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Self-limiting atomic-layer deposition of Si on SiO2 by alternate supply of Si2H6 and SiCl4 - 広島大学 学術情報リポジトリ

Self-limiting atomic-layer deposition of Si on SiO2 by alternate supply of Si2H6 and SiCl4

Applied Physics Letters 79 巻 5 号 617-619 頁 2001-07-30 発行
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ファイル情報(添付)
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タイトル ( eng )
Self-limiting atomic-layer deposition of Si on SiO2 by alternate supply of Si2H6 and SiCl4
作成者
Ohba Kenji
収録物名
Applied Physics Letters
79
5
開始ページ 617
終了ページ 619
抄録
Atomic-layer deposition of Si on SiO2 with a self-limiting growth mode was achieved at substrate temperatures between 355 and 385 °C by means of alternate supply of Si2H6 and SiCl4 gas sources. The growth rate was saturated at 2 ML per cycle at these temperatures and for Si2H6 exposure time over 120 s. The smooth surface (∼0.26 nm in arithmetic average roughness) was obtained under the self-limiting condition irrespective of a film thickness up to 6.5 nm.
言語
英語
資源タイプ 学術雑誌論文
出版者
American Institute of Physics
発行日 2001-07-30
権利情報
Copyright (c) 2001 American Institute of Physics.
出版タイプ Version of Record(出版社版。早期公開を含む)
アクセス権 オープンアクセス
収録物識別子
[ISSN] 0003-6951
[DOI] 10.1063/1.1389508
[NCID] AA00543431
[DOI] http://dx.doi.org/10.1063/1.1389508








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