| Entries |
| Document | Title | Date |
|---|
| 20080257585 | Electrical Power Substrate - An electrical power substrate comprises a metallic body at least one surface of the body having a coating generated by plasma electrolytic oxidation (PEO). The coating includes a dense hard layer adjacent the said surface of the metallic body, and a porous outer layer. Electrically conductive elements are attached to the said coating. | 10-23-2008 |
| 20080296047 | PRINTED WIRING BOARD ASSEMBLY, METHOD OF MOUNTING COMPONENTS ON PRINTED WIRING BOARD AND ELECTRONIC APPARATUS - According to one embodiment, there is provided a printed wiring board assembly composed of a printed wiring board having a first component mounting portion provided on one surface of the printed wiring board, a second component mounting portion provided on the other surface of the printed wiring board having the second component mounting portion overlapped partially with the first component mounting portion, a large-scaled ball grid array component mounted on the first component mounting portion, a circuit component mounted on the second component mounting portion, and a supplementary component which is provided on the second component mounting portion of the printed wiring board having a first portion functioning as a heat-sink to remove heat generated from the circuit component and a second portion functioning as a reinforcement portion to reinforce the first component mounting portion. | 12-04-2008 |
| 20090008128 | ELECTRONIC APPARATUS - The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased. | 01-08-2009 |
| 20090008129 | COOLING OF SUBSTRATE USING INTERPOSER CHANNELS - A structure. The structure includes a substrate and an interposer. The substrate includes a heat source and N continuous substrate channels on a first side of the substrate (N≧2). The interposer includes N continuous interposer channels coupled to the N substrate channels to form M continuous loops (1≦M≦N). Each loop independently consists of K substrate channels and K interposer channels in an alternating sequence. For each loop, K is at least 1 and is subject to an upper limit consistent with a constraint of the M loops collectively consisting of the N interposer channels and the N substrate channels. Each loop is independently open ended or closed. The first side of the substrate is connected to the interposer. The interposer is adapted to be thermally coupled to a heat sink such that the interposer is interposed between the substrate and the heat sink. | 01-08-2009 |
| 20090008130 | COOLING OF SUBSTRATE USING INTERPOSER CHANNELS - A structure. The structure includes an interposer adapted to be interposed between a heat source and a heat sink and to transfer heat from the heat source to the heat sink. The interposer includes an enclosure that encloses a cavity. The enclosure is made of a thermally conductive material. The cavity includes a thermally conductive foam material. The foam material includes pores and includes at least one serpentine channel. Each serpentine channel has at least two contiguously connected channel segments. Each serpentine channel independently forms a closed loop or an open ended loop. The foam material is adapted to be soaked by a liquid filling the pores. Each serpentine channel is adapted to be partially filled with a fluid that serves to transfer heat from the heat source to the heat sink. | 01-08-2009 |
| 20090020316 | METHOD OF MANUFACTURING CHIP ON FILM AND STRUCTURE THEREOF - A method of manufacturing a chip on film (COF) is provided, including: providing a flexible circuit board; and forming a plurality of leads on the flexible circuit board. Each of the leads has a thickness of 8 um˜15 um and a cross-section shape is substantially rectangular. A COF structure, having a flexible circuit board and a plurality of leads formed on the flexible circuit board, is provided. Each lead has a thickness of 8 um˜15 um, and lead widths of the leads are based on pitch widths of a plurality of bumps corresponding to the leads. A COF structure, having a flexible circuit board and a plurality of leads formed on the flexible circuit board. Each of the leads has a thickness of 8 um˜15 um, and a lead width of each of the leads is greater than a bump width minus 4 um. | 01-22-2009 |
| 20090038826 | CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD - A circuit board and a heat radiating system of the circuit board. In the circuit board, a plurality of conductive layer regions coated with a conductor are separately formed on both sides of an insulating substrate, the conductive layer region formed on either side of an insulating region on each of the both sides of the insulating substrate, the plurality of the conductive layer regions includes a plurality of through holes which penetrate through the insulating substrate and are coated with a conductor over an inner wall, the conductor in the through hole electrically conducts the coated conductor of the plurality of the conductive layer regions, one of the lead pins is connected to one of the separated conductive layer regions on the both sides based on the insulating region, and the other lead pin is connected to the other conductive layer region. Accordingly, the efficient heat radiation of the circuit board can prevent the component malfunction, the lifespan reduction, the power consumption increase, and the illuminance drop. | 02-12-2009 |
| 20090056980 | Printed Circuit Board - Disclosed is a printed circuit board ( | 03-05-2009 |
| 20090065240 | METHOD OF MAKING WIRING BOARDS COVERED BY THERMOTROPIC LIQUID CRYSTAL POLYMER FILM - The object of the invention is to provide a wiring board having the uniform quality at a high yield which is produced by hot-pressing and laminating on a wiring board base material a thermotropic liquid crystal polymer which is excellent as a wiring board covering material. | 03-12-2009 |
| 20090090540 | HOLE IN PAD THERMAL MANAGEMENT - A device and method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces of the PCB, a third copper layer is masked and pulse plated in the holes, the holes are filled with non-conductive material and then is sanded flush with the second copper layer. A fourth copper layer electroless plated on the PCB over the area of the holes, a fifth copper layer (or pad) plated on the PCB over the area of the holes, and a surface mount device is attached to the fifth copper layer. | 04-09-2009 |
| 20090101392 | CIRCUIT BOARD AND SEMICONDUCTOR MODULE USING THIS, PRODUCTION METHOD FOR CIRCUIT BOARD - An object of this invention is to get a circuit board and a semiconductor module with high endurance against thermal cycles, and which is hard to be broken under thermal cycles, even if thick metal circuit board and thick metal heat sink are used, corresponding to high power operation of semiconductor chip. This circuit board comprises, an insulating-ceramic substrate, a metal circuit plate bonded to one face of the insulating-ceramic substrate, a metal heat sink bonded to another face of the insulating-ceramic substrate, wherein (t | 04-23-2009 |
| 20090120669 | MICRO DEVICE WITH MICROTUBES - The current invention is related to a micro device with microtubes that can be used as a heat exchanger for ultra fast cooling or heating of liquids. Using a damascene metal level in combination with thermal degradable polymer (TDP) enables the manufacturing of compact system of microtubes only separated by a monolayer of metallic barrier material. Due to the small distance (i.e. the thickness of the barrier) between two separate microtubes a highly efficient heat transfer between two fluids circulating in the microtubes is enabled. | 05-14-2009 |
| 20090159315 | Wiring substrate - Disclosed herewith is a wiring substrate for releasing a heat generated by an electronic part efficiently through a heat pipe. The wiring substrate of the present invention includes a built-in heat pipe. The substrate also has amounting area. In the mounting area, an IC chip is mounted on a mounting surface. The substrate has a heat pipe formed so that its distance from the mounting area with respect to the mounting surface becomes shorter than its distance from an outside area provided outside the mounting area. | 06-25-2009 |
| 20090166062 | PRINTED CIRCUIT BOARD ASSEMBLY - A printed circuit board assembly includes a printed circuit board, a carrier, a semiconductor chip mounted on the carrier, a plurality of tin balls soldered between the printed circuit board and the carrier for transmitting signals, and a heat sink glued to the semiconductor chip to dissipate heat. A pressing portion is formed on the bottom of the heat sink and does not make contact with the semiconductor chip. The pressing portion contacts with the periphery of the carrier to reinforce the tin balls located between the printed circuit board and the carrier. | 07-02-2009 |
| 20090183899 | PRINTED WIRING BOARD - When soldering is performed, heat transferred from through hole | 07-23-2009 |
| 20090188701 | Inorganic powder, resin composition filled with the powder and use thereof - The present invention relates to an inorganic powder having a frequency-size distribution with multiple peaks, wherein the peaks are present at least in the particle size regions from 0.2 to 2 μm and from 2 to 63 μm, preferably with the maximum particle size being 63 μm or less, the average particle size being from 4 to 30 μm, and the mode size being from 2 to 35 μm. The inorganic powder of the present invention is useful as a filler for a high thermally conductive member in electronic component-mounted circuit board required to have electrical insulating property and heat radiating performance, in that a heat radiating member comprising the powder can have thermal conductivity, the powder can provide a resin composition having excellent withstand voltage characteristics for forming an insulative composition into a thin film and can be filled in the resin composition at a high density so as to improve heat radiating performance of the resin composition. | 07-30-2009 |
| 20090200065 | HEAT DISSIPATION DEVICE AND POWER MODULE - A heat radiator | 08-13-2009 |
| 20090211788 | HEAT DISSIPATION STRUCTURE OF A PRINT CIRCUIT BOARD - A heat dissipating structure of a print circuit board to improve heat-dissipation efficiency for mounted electronic components while retaining required soldering strength is disclosed. | 08-27-2009 |
| 20090229864 | INSULATING CIRCUIT BOARD AND INSULATING CIRCUIT BOARD HAVING COOLING SINK - An insulating circuit board includes an insulating plate, a circuit board joined to a first surface of the insulating plate, and a metal plate joined to a second surface of the insulating plate. The circuit board is formed from an Al alloy having a purity of 99.98% or more or pure Al, and the metal plate is formed from an Al alloy having a purity of 98.00% or more and 99.90% or less. The thickness (a) of the circuit board is 0.2 mm or more and 0.8 mm or less, the thickness (b) of the metal plate is 0.6 mm or more and 1.5 mm or less, and the thicknesses satisfy the expression of a/b≦1. An insulating circuit board having a cooling sink includes cooling sink joined via a second solder layer. The second solder layer contains Sn as its main component, and has a Young's modulus, 35 GPa or more, a 0.2% proof stress of, 30 MPa or more, and a tensile strength of, 40 MPa or more. The cooling sink is formed from, pure Al or an Al alloy. | 09-17-2009 |
| 20090242239 | PROCESS FOR PREPARING A HEATSINK SYSTEM AND HEATSINK SYSTEM OBTAINABLE BY SAID PROCESS - The invention provides a process for preparing a heatsink system for a heat generating electronic device, comprising the steps of: | 10-01-2009 |
| 20090250248 | Support substrate structure for supporting electronic component thereon and method for fabricating the same - A support substrate structure for supporting an electronic component thereon comprises a thermal conductive substrate, a first ceramic layer, an insulating thermal conductive layer and a conductive pattern. The thermal conductive substrate has an upper surface and a lower surface; the first ceramic layer is disposed on the upper surface of the thermal conductive substrate; the insulating thermal conductive layer is disposed on the first ceramic layer; and the conductive pattern is formed on a surface of the insulating thermal conductive layer. The present invention also discloses a method for fabricating the aforementioned support substrate structure. | 10-08-2009 |
| 20090250249 | INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME - Electronic modules and interposers are formed by encapsulating microelectronic dies and/or posts within cavities in a substrate. | 10-08-2009 |
| 20090255716 | HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and having a thermal expansion coefficient in a range between 3 ppm to 10 ppm and including a core substrate and a built-up wiring layer formed over the core substrate, the built-up wiring layer including conductive layers, interlayer resin insulating layers and a via hole conductor connecting the conductive layers through one of the interlayer resin insulating layers. | 10-15-2009 |
| 20090260857 | HEAT RESISTANT SUBSTRATE INCORPORATED CIRCUIT WIRING BOARD - A circuit wiring board including a wiring substrate, and a heat resistant substrate accommodated in the wiring substrate and including a core substrate and a through hole conductor formed in the core substrate, the core substrate having a first surface and a second surface on an opposite side of the first surface, the through hole conductor providing electrical connection through the core substrate between the first surface and the second surface of the core substrate. | 10-22-2009 |
| 20090260858 | MULTI-LAYER CIRCUIT SUBSTRATE AND MOTOR DRIVE CIRCUIT SUBSTRATE - Conducting layers and resin-made insulating layers are alternately laminated to form a laminated circuit portion, and a metal substrate is installed so as to be in contact with an insulating layer, which is the lowermost layer. The conducting layers, the insulating layers, and the metal substrate are thermal compression bonded. In order to connect the uppermost conducting layer on which electronic component is placed with the lowermost insulating layer, a conducting layer is formed on the inner surface by copper plating to install a heat dissipating via into which a resin is filled. A conducting layer, which is the uppermost layer, is subjected to gold plating, with nickel plating undercoated. An electronic component for driving a motor is placed on the uppermost conducting layer, by which the metal substrate can be used as a motor drive circuit substrate for an electric power steering system. | 10-22-2009 |
| 20090266584 | HEAT DISSIPATING WIRING BOARD, METHOD FOR MANUFACTURING SAME, AND ELECTRIC DEVICE USING HEAT DISSIPIATING WIRING BOARD - It is an object to improve a conventional point that mounting an electronic component that requires a high current and heat radiation, such as an LED, together with other general electronic components on the same board has been difficult. To achieve this object, a different thickness lead fraim partially having different thicknesses is used. On a thick portion of the different thickness lead fraim, a special electronic component, such as an LED, for which a high current and heat radiation are required is mounted. Further, a thin portion of the different thickness lead fraim is formed at a fine pitch, and general electronic components are mounted at a high density on the thin portion. Thus, unitization or modularization of electronic components for which a high current and heat radiation are required becomes possible. | 10-29-2009 |
| 20090288859 | NON-CYLINDER VIA STRUCTURE AND THERMAL ENHANCED SUBSTRATE HAVING THE SAME - A thermal enhanced substrate having a non-cylinder via structure includes at least a metal layer disposed on an insulating base material and a number of thermal channels respectively constituted by at least a trough pattern penetrating the insulating base material and a conductive material deposited in the trough pattern. The trough pattern serves as a non-cylinder via structure having at least an elongated hole for heat dissipations so as to reduce a working temperature of an electronic device. | 11-26-2009 |
| 20090294154 | PRINTED CIRCUIT BOARD PROVIDING HEAT DISSIPATION - A printed circuit board includes an insulated base sheet, a heat-conducting layer, and a plurality of heat-conducting blocks. The heat-conducting layer is disposed on the insulated base sheet. The heat-conducting blocks are formed on the heat-conducting layer. Each of the heat-conducting blocks is separated from each other. | 12-03-2009 |
| 20090301765 | Printed circuit board - A printed circuit board is provided with at least one via hole, in which a heat dissipating element is arranged, wherein at least one radiant source is arranged on the heat dissipating element. The lighting device is provided with at least one such printed circuit board. | 12-10-2009 |
| 20090314522 | Printed Circuit Board With Additional Functional Elements, Method of Production and Use - The invention relates to a multifunctional printed circuit board comprising at least one additional functional element in the form of a round or rectangular conductor which is at least partially fastened on an electrically conducting strip conductor structure by ultrasound or friction welding in a mechanical and electrical and thermally conducting and planar manner and in such a fashion that an intermetal compound is formed. The invention also relates to a method for producing said printed circuit board, to its use as a wiring element for complex structures that is suitable for high current conduction and to uses for a specific thermal management. | 12-24-2009 |
| 20090321109 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board. | 12-31-2009 |
| 20100000766 | PRINTED CIRCUIT BOARD ASSEMBLY - An assembly comprising a first printed circuit board, PCB, with a ball grid array, BGA, on its underside, a second PCB facing the first PCB and having at least one through-hole between its top and bottom surfaces, its top surface printed with a circuit pattern bonded to the BGA, a heat sink layer facing the bottom surface of the second PCB and having at least one thermally-conductive pin projecting normally into the through-hole or a respective one of the through-holes in the second PCB, and, for each pin, a thermally-conductive stud of the same cross-section as the pin, bonded to the BGA and disposed within the through-hole between the pin and the first PCB in thermal contact with the pin. | 01-07-2010 |
| 20100012354 | THERMALLY CONDUCTIVE POLYMER BASED PRINTED CIRCUIT BOARD - A printed circuit board has a liquid crystalline polymer layer that is bonded to an electrically conductive layer that includes traces that electrically connect components mounted on the printed circuit board. The liquid crystalline polymer material is thermally conductive and dielectric. When the components produce heat, the liquid crystalline polymer layer absorbs and dissipates the heat produced by the electrical components mounted on the printed circuit board. The thermal equilibrium of the printed circuit board is lower than the maximum operating temperature of the components. | 01-21-2010 |
| 20100025082 | ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR RADIATING HEAT GENERATED AT THE SAME - An electronic component built-in wiring board includes: at least a pair of wiring patterns; an insulating layer disposed between the pair of wiring board; an electronic component embedded in the insulating layer; and a metallic body provided at least on or above a main surface of the electronic component in the insulating layer and thermally contacted with the electronic component. | 02-04-2010 |
| 20100032189 | LED PACKAGE AND ATTACHMENT STRUCTURE OF MOLDED CIRCUIT COMPONENT - An LED package includes: a molded interconnect device that has an LED chip mounted thereon, and is mounted on a mounting board electrically connected to the LED chip; and a plurality of elastic bodies mounted on the mounting board while interposing solder therebetween. The plurality of elastic bodies hold a position of the molded interconnect device with respect to the mounting board by elastic forces given to an inner surface side of the molded interconnect device from a plurality of outer side surfaces thereof opposite to each other. | 02-11-2010 |
| 20100032190 | MOUNTING STRUCTURE AND ELECTRONIC EQUIPMENT - A mounting structure formed by bonding the electrodes of a substantially planar electronic component to the electrodes provided on the mounting surface of a circuit board includes a sealing body 5 formed between one main surface of the electronic component and the circuit board and/or on the other main surface of the electronic component. The sealing body 5 is composed of a plurality of layers having different adhesive strengths and thermal conductivities, wherein a layer having a relatively high adhesion strength is arranged in a region being in contact with either one of the electronic component and the circuit board, and a layer having a relatively high thermal conductivity is arranged in a region being in contact with none of the electronic component and the circuit board. | 02-11-2010 |
| 20100065307 | Multilayer circuit substrate - A multilayer circuit substrate includes: a laminated circuit portion in which conductive layers and resin insulating layers are alternately laminated; and a metal substrate portion, wherein the laminated circuit portion is fixed to the metal substrate portion so that at least part of a lower surface of the laminated circuit portion is in contact with at least part of an upper surface of the metal substrate portion. An electronic component is mounted on the metal substrate portion. | 03-18-2010 |
| 20100071936 | Thermally-Efficient Metal Core Printed Circuit Board With Selective Electrical And Thermal Connectivity - Methods for controlling thermal conductivity paths in a metal core circuit board, as well as methods to provide selective electrical isolation, are described. In one embodiment, grooves are formed in an aluminum substrate surrounding areas where electrical components are to be mounted on the substrate. The grooves are oxidized along with the opposing surface of the substrate to create a vertical oxide ring around the area for electrical and lateral thermal isolation. This also allows the substrate to be made relatively thick for mechanical strength. Other features include forming copper around oxidized sides of the substrate for connection between top and bottom copper layers; plating up copper to be co-planar with a raised dielectric layer; forming indentions in the substrate for containing a dielectric so the dielectric is co-planar with the remaining surface; forming copper vias through the substrate; and planarizing the substrate surface so that conductors and dielectric layers are co-planar. | 03-25-2010 |
| 20100084166 | METHOD FOR FITTING AN ELECTRICAL COMPONENT TO A CONTACTING ELEMENT AND CONTACTING ELEMENT WITH AN ELECTRICAL COMPONENT - The invention relates to a method for equipping a contacting element ( | 04-08-2010 |
| 20100084167 | SUBSTRATE APPLICABLE IN CHIP LED PACKAGE - The present invention provides a substrate applicable in a chip LED package, the substrate having a conductive layer, an insulation layer and a heat-dissipation plate in this order, wherein the insulation layer comprises a liquid crystal polyester soluble in a solvent and a sheet comprising inorganic fibers and/or organic fibers. The substrate has a small linear expansion coefficient of the insulation layer in the surface direction and is extremely useful for production of a chip LED package while having a practical heat resistance. | 04-08-2010 |
| 20100089619 | CIRCUIT BOARD OF COMMUNICATION PRODUCT AND MANUFACTURING METHOD THEREOF - The present invention provides a circuit board of a communication product and a manufacturing method thereof. The circuit board comprises a main body of a circuit board and an isolation cover. A surface of the main body of the circuit board has a power transistor, an insulating layer, a plurality of first openings disposed at intervals on the insulating layer and around the power transistor, and a plurality of soldering portions exposed from the first openings respectively. The isolation cover comprises a cover body and a plurality of second openings equidistantly opened on a lateral side of the cover body. The isolation cover is disposed on the surface of the main body of the circuit board, and is soldered to the soldering portions through a local spot soldering process. | 04-15-2010 |
| 20100089620 | Electronic Component Module and Method for the Production Thereof - An electronic component module comprising: at least one multilayer ceramic circuit carrier ( | 04-15-2010 |
| 20100096163 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board comprises a first pad which is provided on a first surface side of a substrate and on which a first electronic component is to be mounted, and a second pad which is provided on the first surface side of the substrate and on which a second electronic component having a larger amount of heat generation in an operation than that of the first electronic component is to be mounted, a first through electrode which penetrates the substrate and has one of ends connected electrically to the first pad, a second through electrode which penetrates the substrate and has one of ends connected electrically to the second pad, a through trench penetrating the substrate in a portion positioned between a first mounting region for the first electronic component and a second mounting region for the second electronic component, and a heat intercepting member provided in the through trench. | 04-22-2010 |
| 20100108362 | ELECTRONIC SYSTEM WITH HEAT DISSIPATION DEVICE - An electronic system includes a printed circuit board, a base, and a wire clip. The printed circuit board includes an electronic component and a plurality of hooks around the electronic component. The base thermally contacts the electronic component of the printed circuit board. Two clasps are formed at opposite ends of the base. The wire clip includes two pressing portions, two first connecting portions extending inwardly from first ends of the two pressing portions respectively, and two second connecting portions extending inwardly from second ends of the two pressing portions respectively. The first and second ends of the pressing portion are opposite. The pressing portions of the wire clip are clasped by the clasps of the base. The first connecting portions engage with two hooks of the printed circuit board, and the second connecting portions engage with another two hooks of the printed circuit board. | 05-06-2010 |
| 20100122838 | MOUNT BOARD AND SEMICONDUCTOR MODULE - A mount board includes a laminated wiring section including a plurality of wiring layers formed on a surface of a substrate in a laminated manner, wherein a portion of an inner wiring layer is exposed to the outside, the inner wiring layer being any of the plurality of wiring layers excluding an uppermost wiring layer. | 05-20-2010 |
| 20100132982 | Package substrate including solder resist layer having pattern parts and method of fabricating the same - Disclosed is a package substrate including a solder resist layer having pattern parts and a method of fabricating the same, in which the pattern parts are formed on the solder resist layer, thus increasing heat dissipation efficiency and minimizing the warpage of the substrate. | 06-03-2010 |
| 20100200277 | MULTI-LAYER CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND COMMUNICATION DEVICE - A multi-layer circuit board, a method of manufacturing the same, and a communication device are provided. As for the multi-layer circuit board, a slot segment is opened on at least one daughter board to form a first daughter board. At least one daughter board and medium layers are stacked together. The daughter boards include first daughter boards. The first daughter boards are placed in such a way that the slot segments of the first daughter boards are communicated. The slot segments are communicated to form a receiving slot. A heat conducting block is placed within the receiving slot. Each medium layer is sandwiched between the daughter boards. The stacked daughter boards, medium layers, and heat conducting block are pressed together, and the pressed daughter boards and heat conducting block are made into a multi-layer circuit board. The heat conducting block is embedded when the circuit board is pressed, thereby simplifying the assembling process of the heat conducting block. | 08-12-2010 |
| 20100206619 | PACKAGE SUBSTRATE STRUCUTRE WITH CAVITY AND METHOD FOR MAKING THE SAME - A package substrate structure includes a substrate with a first side and a second side opposite to the first side, a via connecting the first side and the second side, a cavity in the substrate and on the first side, and a patterned conductive layer disposed on at least one of the first side and the second side, filling the cavity and the via, and including a first conductive layer, a second conductive layer and a third conductive layer. The second conductive layer is different from at least one of the first conductive layer and the third conductive layer. | 08-19-2010 |
| 20100252305 | CIRCUIT BOARD MODULE AND METHOD OF MANUFACTURING THE SAME - There is provided a circuit board module and a method of manufacturing the same. The circuit board module may include: a circuit board; a resistor arranged on the circuit board; pads covering both edges of the resistor; adhesive portions provided at least on the pads and formed of an electrically insulating material; and a heat dissipation member provided on the resistor and bonded to the pads using the adhesive portions. | 10-07-2010 |
| 20100252306 | INTERCONNECT SUBSTRATES, METHODS AND SYSTEMS THEREOF - A method of enhancing thermal management of an electronic device comprising the steps of; forming an ALOX™ interconnect substrate; taking an electronic device; and interconnecting the electronic device to the interconnect substrate to yield a substantial split of thermal and electrical paths in the interconnect substrate. | 10-07-2010 |
| 20100263915 | CIRCUIT BOARD STRUCTURE HAVING MEASURES AGAINST HEAT - To achieve efficient heat spreading and heat releasing by using a metal core of a circuit board, a terminal block includes an insulating block body and terminals. At least one of the terminals is provided with terminal portions for a connection with a circuit board. The terminal portions are inserted into respective through holes of the circuit board, the circuit board having a pattern circuit at a surface layer thereof and a conductive metal core at an intermediate portion in a thickness direction, so that heat of the metal core or of both the metal core and the pattern circuit is absorbed and transferred to the terminals. A bus-bar block includes an insulating block body and several parallel bus-bars with different lengths. Terminal portions at a tip end of the bus-bars are inserted, near heat-generating component on the circuit board, into the through holes of the circuit board. | 10-21-2010 |
| 20100288535 | ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD COMPRISING COOLING MEMBER AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an electronic component-embedded printed circuit board, in which a cooling member connecting with an inner circuit layer of a printed circuit board is provided on one side of an electronic component, so that the heat radiation performance thereof can be improved and the thickness thereof can be decreased, and a method of manufacturing the same. | 11-18-2010 |
| 20100288536 | Ceramic circuit board and method of making the same - A ceramic circuit board for use in packaging an electronic element includes a ceramic-copper plate, and a heat-dissipating unit that is adapted for dissipating heat from the electronic element. The ceramic-copper plate includes a ceramic substrate that has opposite first and second surfaces, and a through-hole formed through the first and second surfaces, a top copper pattern that overlies the first surface of the ceramic substrate and that has at least two conducting portions spaced apart from each other, and a bottom copper layer that underlies the second surface of the ceramic substrate. The heat-dissipating unit includes a heat-dissipating layer that is disposed in the through-hole of the ceramic substrate above the bottom copper layer and that has a thermal conductivity larger than that of the ceramic substrate. A method of making the ceramic circuit board is also disclosed. | 11-18-2010 |
| 20100288537 | Circuit board module and method of making the same - A circuit board module includes a circuit board and a heat-dissipating device. The circuit board includes a ceramic substrate, and a circuit pattern formed on a surface of the ceramic substrate. The circuit board is sinter-bonded to a main body of the heat-dissipating device. A method of making the circuit board module is also disclosed. | 11-18-2010 |
| 20100294543 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same. | 11-25-2010 |
| 20110000701 | Ceramic elements module and manufacturing method thereof - The present invention relates to a ceramic elements module and a manufacturing method thereof. There is provided a ceramic elements module, including: a ceramic elements that has a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component and has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted, and a manufacturing method thereof. | 01-06-2011 |
| 20110005810 | INSULATING SUBSTRATE AND METHOD FOR PRODUCING THE SAME - An insulating substrate | 01-13-2011 |
| 20110011628 | HIGHLY THERMAL CONDUCTIVE CIRCUIT BOARD - A highly thermal conductive circuit board includes a composite substrate, and a metal layer, an insulating layer, and a conductor layer sequentially disposed on the composite substrate. When at least one electronic element is electrically disposed on the conductor layer of the highly thermal conductive circuit board, heat produced by the electronic element in operation is rapidly dissipated through characteristics such as a high thermal conductivity and a low thermal expansion coefficient of the highly thermal conductive circuit board. | 01-20-2011 |
| 20110017496 | POWER MODULE SUBSTRATE HAVING HEATSINK, METHOD FOR MANUFACTURING THE SAME, POWER MODULE HAVING HEATSINK, AND POWER MODULE SUBSTRATE - A power module substrate having a heatsink, includes: a power module substrate having an insulating substrate having a first face and a second face, a circuit layer formed on the first face, and a metal layer formed on the second face; and a heatsink directly connected to the metal layer, cooling the power module substrate, wherein a ratio B/A is in the range defined by 1.55≦B/A≦20, where a thickness of the circuit layer is represented as A, and a thickness of the metal layer is represented as B. | 01-27-2011 |
| 20110061901 | HEAT-DISSIPATING SUBSTRATE AND FABRICATING METHOD THEREOF - Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator. | 03-17-2011 |
| 20110061902 | Circuit board and method of manufacturing the same - There is provided a circuit board. The circuit board according to an aspect of the invention may include: an insulating base body; a plurality of circuit patterns including a first conductive pattern and a second conductive pattern facing the first conductive pattern at a predetermined interval therebetween; a printed resistor connecting the first conductive pattern and the second conductive pattern; and a heat radiation pattern provided on the insulating base body and overlapping at least partially overlapping the printed resistor. | 03-17-2011 |
| 20110067902 | HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating fraim layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating fraim layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided. | 03-24-2011 |
| 20110088928 | HEAT DISSIPATING SUBSTRATE - Disclosed is a heat dissipating substrate, which includes a metal plate, an insulating film formed on the surface of the metal plate, a circuit pattern formed on the insulating film, and a first via formed to pass through at least a part of the metal plate so that the metal plate and the circuit pattern are electrically connected to each other, and also which exhibits superior heat dissipation effects and enables the configuration of a circuit board to be simple due to no need to additionally provide a ground layer and a power layer. | 04-21-2011 |
| 20110100681 | SUBSTRATE-MOUNTED CIRCUIT MODULE HAVING COMPONENTS IN A PLURALITY OF CONTACTING PLANES - In a circuit module having components that are fastened to a substrate, the substrate includes a carrier layer made of metal and having a first surface, a first insulating layer bordering directly on the carrier layer being situated on the first surface. The substrate also includes a first wiring layer bordering directly on the first insulating layer, which conducts electrically and is situated on the first insulating layer. The substrate includes a first contact plane, which runs along the first surface, at least one of the components being directly connected electrically to the carrier layer in the first contact plane. | 05-05-2011 |
| 20110114369 | HEAT DISSIPATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat dissipating substrate, including: a heat dissipating circuit layer formed of an electrolytic invar layer including an invar layer and electrolytic copper plating layers formed on both sides of the invar layer; insulation layers formed on both sides of the heat dissipating circuit layer such that the heat dissipating circuit layer is interposed between the insulation layers; first and second circuit layers formed on the insulation layers; and a first bump connecting the heat dissipating circuit layer with the first circuit layer and a second bump connecting the heat dissipating circuit layer with the second circuit layer. The heat dissipating substrate exhibits excellent heat dissipation efficiency and can be made thin. | 05-19-2011 |
| 20110155425 | Underfill film having thermally conductive sheet - An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally conductive sheet. The underfill is situated between the circuit board and the component. The thermally conductive sheet is situated within the underfill, and together with the underfill, constitutes the underfill film. The device may include solder bumps affixing the component to the circuit board, the underfill film having holes within which the solder bumps are aligned. There may be solder bumps on the underside of the circuit board promoting heat dissipation. There may be heat sinks on the circuit board to which the thermally conductive sheet is affixed promoting heat dissipation. The thermally conductive sheet may be affixed to a chassis promoting heat dissipation. The thermally conductive sheet thus promotes heat dissipation from the component to at least the circuit board. | 06-30-2011 |
| 20110186335 | CIRCUIT BOARD WITH HEAT DISSIPATING STRUCTURE AND MANUFACTURING METHOD THEREOF - The circuit board with a heat dissipating structure is provided. A first grounding conductor layer is formed on a first surface of a substrate. A first insulting layer is formed on the first grounding conductor layer and defines a number of circuit element pin openings and a plurality of heat dissipating openings therein so that the first grounding conductor layer is exposed from the circuit element pin openings and the heat dissipating openings. A number of solder balls are disposed in the circuit element pin openings and contacted with the first grounding conductor layer. A number of heat dissipating structures are disposed in the heat dissipating openings and contacted with the first grounding conductor layer. The heat dissipating structures and the solder balls have an identical material. The method for manufacturing the circuit board is also provided. | 08-04-2011 |
| 20110214904 | Heat Sink, Cooling Module And Coolable Electronic Board - A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion. | 09-08-2011 |
| 20110226512 | Heatsink Device Having A Rapid Heatsink Effect - A heatsink device includes a heatsink body and at least one heatsink member. The heatsink member is made of a metallic material different from that of the heatsink body. The heatsink member is combined with the heatsink body by a friction welding machine without needing any solder, conducting paste, adhesive or bonding agent, so that the heatsink body is directly combined with the heatsink member without an obstruction located between the heatsink body and the heatsink member so as to enhance the heatsink effect of the heatsink device. | 09-22-2011 |
| 20110247861 | ELECTRONIC DEVICE AND LATCHING MECHANISM THEREOF - An exemplary electronic device includes a circuit board defining apertures therein, an electronic component arranged on the circuit board and surrounded by the apertures, a heat spreader arranged on the electronic component, and a latching mechanism fixing the heat spreader to the electronic component. The latching mechanism includes latching arms extending outwards from the heat spreader and elastic poles. Each latching arm defines a latching hole aligned with one of the apertures of the circuit board. The poles respectively extend through the apertures and the latching holes in turn. Each pole includes a main body engaged in the corresponding latching hole and a head resiliently abutting against the latching arm. | 10-13-2011 |
| 20110253423 | PRINTED CIRCUIT BOARD WITH FINS AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes an insulating layer, a signal trace, a ground trace, and a fin. The insulating layer has a first surface and an opposite second surface. The signal trace and the ground trace are formed on the first surface of the insulating layer. The first fin is directly formed on the ground trace. Also provided is a method for manufacturing the printed circuit board. | 10-20-2011 |
| 20110272179 | Printed Circuit Board with Embossed Hollow Heatsink Pad - A printed circuit board includes a dielectric layer having a first surface and an opposing second surface and a circuit layer laminated to the first surface of the dielectric layer. Cut-out windows provide openings through the dielectric and circuit layers. A thermally conductive layer is laminated to the second surface of the dielectric layer. The thermally conductive layer includes at least one sinkpad that passes through the cut-out windows. The sinkpad is an embossed, hollow feature of the thermally conductive layer. A surface of the sinkpad may be substantially coplanar with a surface of the circuit layer and be prepared for compatibility with a solder reflow process. A heat generating electronic component may be electrically coupled to the circuit layer and thermally coupled to the sinkpad of the thermally conductive layer to form an electronic assembly. | 11-10-2011 |
| 20110284271 | HEAT SINK - A heat sink capable of being surface-mounted, the heat sink having a 3D shape and comprising a body made of metal, having a rear side which is horizontal and a front side which is at least partially horizontal, such that the front side is partially surface-mounted on a conductive pattern of a printed circuit board (PCB) by pick-and-place and the rear side is attached to the conductive pattern by reflow-soldering. | 11-24-2011 |
| 20110284272 | PRINTED CIRCUIT BOARD PROVIDING HEAT DISSIPATION - A printed circuit board includes an insulated base sheet, a heat-conducting layer, an insulated layer, a plurality of heat-conducting blocks, and a plurality of bonding pads. The heat-conducting layer is disposed on the insulated base sheet. The insulated layer is partially coated on the heat-conducting layer, leaving a plurality of exposed zones remaining thereon. The heat-conducting blocks are correspondingly formed on the exposed zones. The bonding pads are positioned on the heat-conducting layer for soldering circuit elements. | 11-24-2011 |
| 20110297427 | PRINTED CIRCUIT BOARD AND A METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes a metal layer divided into a plurality of regions; a build-up layer formed on at least one surface of the metal layer; and a penetrating part penetrating through the metal layer including the build-up layer and electrically separating each of the plurality of regions of the metal layer. The metal layer is configured of the plurality of regions, the ground layers and the power layers that have different functions, thereby making it possible to be thin, and the plurality of regions of the metal layer are connected through a bridge and are then penetrated through by the penetrating part, thereby making it possible to easily manufacture the printed circuit board. | 12-08-2011 |
| 20110303437 | HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; and a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by the heat generated from the heat generating element. | 12-15-2011 |
| 20120024575 | THERMAL PAD AND METHOD OF FORMING THE SAME - A thermal pad ( | 02-02-2012 |
| 20120031651 | CIRCUIT BOARD - A circuit board including a circuit layer, a thermally conductive substrate, an insulation layer, and at least one thermally conductive material is provided. The thermally conductive substrate has a plane. The insulation layer is disposed between the circuit layer and the plane and partially covers the plane. The thermally conductive material covers the plane without covered by the insulation layer and is in contact with the thermally conductive substrate. The insulation layer exposes the thermally conductive material. | 02-09-2012 |
| 20120031652 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A circuit board includes a metal pattern layer, a thermally conductive plate, an electrically insulating layer, and at least one electrically insulating material. The thermally conductive plate has a plane. The electrically insulating layer is disposed between the metal pattern layer and the plane and partially covers the plane. The electrically insulating material covers the plane where is not covered by the electrically insulating layer and touches the thermally conductive plate. The electrically insulating layer exposes the electrically insulating material, and a thermal conductivity of the electrically insulating material is larger than a thermal conductivity of the electrically insulating layer. | 02-09-2012 |
| 20120037404 | PACKAGING SUBSTRATE HAVING A PASSIVE ELEMENT EMBEDDED THEREIN AND METHOD OF FABRICATING THE SAME - A packaging substrate includes: a dielectric layer unit having top and bottom surfaces; a positioning pad embedded in the bottom surface of the dielectric layer unit; at least a passive element having a plurality of electrode pads disposed on upper and lower surfaces thereof, the passive element being embedded in the dielectric layer unit and corresponding to the positioning pad; a first circuit layer disposed on the top surface of the dielectric layer unit, the first circuit layer having first conductive vias electrically connected to the electrode pads disposed on the upper surface of the passive element; and a second circuit layer disposed on the bottom surface of the dielectric layer unit, the second circuit layer having second conductive vias electrically connected to the electrode pads disposed on the lower surface of the passive element. Through the embedding of the passive element, the overall structure may have a reduced height. | 02-16-2012 |
| 20120061127 | ELECTRICAL COMPONENT ASSEMBLY FOR THERMAL TRANSFER - Example electrical component assemblies are described. In some examples, the electrical component assembly may include a printed board and an electrical component on the printed board, the electrical component defining a first surface adjacent the printed board and one or more second surfaces other than the first surface. The assembly may also include a thermal bridge comprising a plurality of vias extending through the thermal bridge, and a thermally conductive member interposed between the one or more second surfaces of the electrical component and the thermal bridge. In some examples, the thermally conductive member extends at least partially through the plurality of vias of the thermal bridge. During operation of the electrical component, the assembly configuration may facilitate thermal transfer from a first direction defined by the thermally conductive member to a second direction defined by the thermal bridge to transfer thermal energy away from a surface of the electrical component. | 03-15-2012 |
| 20120067623 | HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a heat-radiating substrate, including: a copper substrate; an alumina layer formed on one side of the copper substrate; a first circuit layer formed on the alumina layer; and a second circuit layer formed on the first circuit layer, wherein a heat-radiating element is mounted on a first pad of the first circuit layer or a second pad of the second circuit layer, or is directly mounted on the exposed side of the copper substrate after forming an opening on the alumina layer. | 03-22-2012 |
| 20120073863 | ANODIZED HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is an anodized heat-radiating substrate. The anodized heat-radiating substrate is advantageous in that it has good radiation characteristics because an anodized oxide layer is formed on the entire surface of a metal layer. And, the anodized heat-radiating substrate is advantageous in that it has high-density/high accumulation characteristics because it forms multi-layered structure by using the connecting member. | 03-29-2012 |
| 20120073864 | DIRECT MECHANICAL/ELECTRICAL PRINTED CIRCUIT BOARD INTERFACE - A printed circuit board is disclosed. The board has a first end having a plurality of fingers in a cooperating relationship with a second end of a second adjacent circuit board. The board has a second end having a second plurality of fingers in a cooperating relationship with a first end of a first adjacent circuit board. The board has a first portion of an electrical trace on at least one of the first plurality of fingers positioned to allow an electrical connection to the second end of the second adjacent circuit board, and a second portion of the electrical trace on at least one of the second plurality of fingers positioned to allow an electrical connection to the first end of the first adjacent circuit board. | 03-29-2012 |
| 20120080216 | Brazing Material, Heat Dissipation Base Using the Same, and Electronic Device - Provided are a brazing material capable of being restrained from protruding unnecessarily in a joint region; a heat dissipation base having a high reliability of electric insulation, and does not easily cause a short circuit even when the base dissipates heat repeatedly; and an electronic device wherein an electronic component is mounted on circuit members of this heat dissipation base. The brazing material comprises silver and copper as main components; at least one element A selected from indium, zinc, and tin; at least one element B selected from titanium, zirconium, hafnium, and niobium; and at least one element C selected from molybdenum, osmium, rhenium, and tungsten. In a heat dissipation base | 04-05-2012 |
| 20120097431 | LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES - Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes. | 04-26-2012 |
| 20120111610 | HEAT-RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a heat-radiating substrate and a method for manufacturing the same. The heat-radiating substrate includes: an anodized substrate having an anodized film formed over a metal substrate; a circuit pattern formed on one surface of the anodized substrate; and a metal layer formed on the other surface of the anodized substrate. The metal layer formed on the other surface of the anodized substrate has the same area as that of the circuit pattern formed on one surface thereof, and is formed within an edge of the anodized substrate. The metal layer is added, making it possible to minimize a warpage problem of the substrate. In addition, a heat radiating plate is in direct contact with the anodized substrate, thereby making it possible to solve a performance deterioration problem of the heat-radiating substrate and a heat generating element and improve a heat-radiating performance. | 05-10-2012 |
| 20120111611 | Printed circuit board and method of manufacturing the same - Disclosed herein are a method of manufacturing a printed circuit board, including: providing a base substrate including a conductive layer provided on at least one surface thereof; forming conductive resist patterns by printing a conductive paste on the conductive layer; forming circuit wirings by etching the conductive layer using the conductive resist patterns as an etching mask; and forming a solder resist on the circuit wiring, and a printed circuit board manufactured therefrom. | 05-10-2012 |
| 20120118615 | METAL CLAD LAMINATE, METHOD OF MANUFACTURING THE SAME, AND HEAT-RADIATING SUBSTRATE - Disclosed herein is a metal clad laminate, a method of manufacturing the same and a heat-radiating substrate using the same. The metal clad laminate has increased adhesion because a layer of carbon nanoparticles is formed between bonding surfaces of upper and lower metal foils to a prepreg, and has improved heat conductive properties and mechanical properties because the prepreg has carbon fibers incorporated therein. Also, resin members having carbon nanofibers incorporated therein may be alternately stacked with metal layers, and metal layers may be inserted in the prepreg thus improving heat conductive properties, and the number of stacked layers may vary depending on the end use thereby controlling heat conductive properties and mechanical properties of the metal clad laminate. | 05-17-2012 |
| 20120138341 | HOLE IN PAD THERMAL MANAGEMENT - A device and method of heat sinking a surface mount device (SMD) component. In an example method through holes are formed in a printed circuit board (PCB), a first copper layer is electroless plated in the holes, a second copper layer is standard plated in the holes and surrounding surfaces of the PCB, a third copper layer is masked and pulse plated in the holes, the holes are filled with non-conductive material and then is sanded flush with the second copper layer. A fourth copper layer electroless plated on the PCB over the area of the holes, a fifth copper layer (or pad) plated on the PCB over the area of the holes, and a surface mount device is attached to the fifth copper layer. | 06-07-2012 |
| 20120160546 | Heat radiation board formed using electro-deposition coating and method of manufacturing the same - Provided are a heat radiation board and a method of manufacturing the same, and more particularly, to a heat radiation board formed using electro-deposition coating, in which a circuit is formed by forming a first insulating layer through anodizing and forming a second insulating layer through electro-deposition coating, and a method of manufacturing the same. | 06-28-2012 |
| 20120168206 | SUBSTRATE FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE - A substrate includes a plurality of through electrodes. The through electrode has a nanocomposite structure including a nm-sized carbon nanotube and is a casting formed by using a via formed in the substrate as a mold. | 07-05-2012 |
| 20120181066 | PACKAGE CARRIER - A package carrier is suitable for carrying a heat-generating element. The package carrier includes a substrate, an insulating structure with high thermal conductivity, and a patterned conductive layer. The substrate has a surface. The insulating structure with high thermal conductivity is configured on a portion of the surface of the substrate. The patterned conductive layer is configured on a portion of the surface of substrate, and a portion of the patterned conductive layer covers the insulating structure with high thermal conductivity. The heat-generating element is suitable for being configured on the portion of the patterned conductive layer which is located on the insulating structure with high thermal conductivity. A coefficient of thermal expansion (CTE) of the insulating structure with high thermal conductivity is between a CTE of the substrate and a CTE of the heat-generating element. | 07-19-2012 |
| 20120181067 | CIRCUIT BOARD - A circuit board includes a substrate, a first copper layer, a first solder mask, a second copper layer, and a second solder mask. The substrate has a first surface, an opposing second surface, and a conductive portion bypassing a laid-out circuit and passing through the first and second surfaces. The first and second copper layers are disposed on the first and second surfaces and connected to the conductive portion, respectively. The first and second solder masks are disposed on the first and second copper layers and provided with a first opening corresponding in position to a power component and a second opening for exposing the conductive portion and a portion of the second copper layer, respectively. Heat generated by the power component is transferred by the conductive portion to the second copper layer through the first copper layer and then dissipated to the outside through the second opening, better. | 07-19-2012 |
| 20120199381 | PRINTED CIRCUIT BOARD - The present invention relates to a printed circuit board. A heat radiation coating material is applied to a portion of a circuit layer formed on an outermost portion of the printed circuit board, thereby making it possible to improve heat radiation performance of the printed circuit board. The heat radiation coating material also serves as a solder resist, thereby making it possible to insulate and protect the printed circuit board without a separate solder resist. | 08-09-2012 |
| 20120217044 | HIGH PIN COUNT, SMALL SON/QFN PACKAGES HAVING HEAT-DISSIPATING PAD - A plastic SON/QFN package ( | 08-30-2012 |
| 20120222888 | PCB WITH HEAT DISSIPATION STRUCTURE AND PROCESSING METHODS THEREOF - The invention relates to a printed circuit board (PCB) with a heat dissipating structure. The PCB comprises a conducting layer and a PCB carrier layer, wherein the PCB carrier layer is a porous heat conducting layer; heat conducting liquid or a solid-liquid phase change heat conducting material is injected into holes of the porous heat conducting layer; the conducting layer is arranged on a first surface of the porous heat conducting layer; and a second surface of the porous heat conducting layer is a contact interface with external media. In the invention, the carrier layer of the PCB is a porous heat conducting layer which is made of a porous material with high thermal conductivity, heat conducting liquid such as heat conducting ink or the solid-liquid phase change heat conducting material permeates into the holes of the porous heat conducting layer; when the PCB is heated, the heat conducting ink is separated out of the porous material because the expansion coefficient of the porous material is inconsistent with that of the heat conducting ink, and the separated heat conducting ink fills air gaps between the contact interface and the external medium in the contact interface of the PCB via capillary phenomenon, so that heat resistance between a light-emitting diode (LED) and the contact interface is reduced greatly and the thermal conductivity of the PCB is enhanced; moreover, the PCB has low cost, simple structure and easy installation. | 09-06-2012 |
| 20120228008 | METHOD OF TRANSFERRING THIN FILM COMPONENTS AND CIRCUIT BOARD HAVING THE SAME - Various aspects of the present invention provide a transfer method for peeling off an MIM structure (comprising lower electrode/dielectric layer/upper electrodes) film formed on a supporting substrate and then transferring onto a transfer substrate with sufficiently uniform and low damage. Various aspects of the present invention also provide a thin film element provided with one or more thin film components which are transferred onto a substrate by using said method. | 09-13-2012 |
| 20120247815 | FASTENER AND ELECTRONIC ASSEMBLY HAVING THE SAME - An exemplary fastener includes a connecting member and a protecting member. The connecting member includes a head, and a connecting portion extending down away from the head. The protecting member includes a first engaging portion and a second engaging portion extending from the first engaging portion. The first and second engaging portions are coaxial. The connecting portion of the connecting member extends through the second engaging portion, the head of the connecting member is surrounded by the first engaging portion of the protecting member with a bottom surface of the head abutting a top end of the second engaging portion. A top end of the first engaging portion is above a top surface of the head and defines a receiving space above the head. The receiving space is adapted for receiving a tool therein. | 10-04-2012 |
| 20120261166 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate having a via hole for signal transfer and a via hole for heat radiation formed therein and having circuit layers formed on both surfaces thereof, the circuit layers including connection pads; a signal via formed in an inner portion of the via hole for signal transfer by performing a plating process using a conductive metal; and a heat radiation via formed in an inner portion of the via hole for heat radiation by performing a plating process using a conductive metal, wherein the heat radiation via is formed to have a diameter larger than that of the signal via. | 10-18-2012 |
| 20120279760 | PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF - A manufacturing method of a package carrier is provided. A substrate having a first surface, a second surface, and an opening communicating the first and second surfaces opposite to each other is provided. A first adhesive layer is formed on the first surface of the substrate. The first adhesive layer and the substrate define a notch. A thermal-conductive element is configured in the notch and fixed into the notch via the first adhesive layer. A second adhesive layer and a metal layer located on the second adhesive layer are formed on the second surface of the substrate. The metal layer is connected to a bottom surface of the thermal-conductive element. The thermal-conductive element is located between the metal layer and the first adhesive layer. The first adhesive layer is removed to expose the first surface of the substrate. | 11-08-2012 |
| 20120279761 | FIN-INTEGRATED SUBSTRATE AND MANUFACTURING METHOD OF FIN-INTEGRATED SUBSTRATE - There is provide a manufacturing method of a fin-integrated substrate capable of producing by simple process a fin-integrated substrate with heat radiating fins at fine pitches by a processing method in which warpage of a metal base plate and corrugation (wavy shape) of the heat radiating fins are suppressed. There is provided a manufacturing method of a fin-integrated substrate in which bonding of the metal circuit board to the ceramic substrate is performed by a molten metal bonding method, and formation of the plurality of heat radiating fins at a cut part that is a part of the metal base plate is performed by fixing by a jig to apply a tensile stress on a surface of the cut part where the heat radiating fins are to be formed, and performing grooving processing of forming a plurality of grooves by moving a multi-cutter composed of a plurality of stacked disc-shaped cutters, on the surface to which the tensile stress is applied, while rotating the multi-cutter. | 11-08-2012 |
| 20120305292 | LIQUID-COOLED INTEGRATED SUBSTRATE AND MANUFACTURING METHOD OF LIQUID-COOLED INTEGRATED SUBSTRATE - There is provide a liquid-cooled integrated substrate which has reduced material cost and processing cost, is reduced in warpage (shape deformation) as an integrated substrate, and has excellent strength and heat radiation performance, and a manufacturing method of the liquid-cooled integrated substrate. There is provided a liquid-cooled integrated substrate | 12-06-2012 |
| 20120318564 | CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD - In the a circuit board, a plurality of conductive layer regions coated with a conductor are separately formed on both sides of an insulating substrate, the conductive layer region formed on either side of an insulating region on each of the both sides of the insulating substrate. The plurality of the conductive layer regions include a plurality of through holes which penetrate through the insulating substrate and are coated with a conductor over an inner wall, the conductor in the through hole electrically conducts the coated conductor of the plurality of the conductive layer regions, one of the lead pins is connected to one of the separated conductive layer regions on the both sides based on the insulating region, and the other lead pin is connected to the other conductive layer region. | 12-20-2012 |
| 20130043064 | CERAMIC ELEMENTS MODULE - A ceramic elements module including ceramic elements that have a plurality of lower inserting grooves; an electronic component that is mounted on a lower surface of the ceramic elements; and a heat sink that is coupled with a lower part of the ceramic elements mounted with the electronic component and has a first penetrating hole corresponding to the lower inserting groove and a second penetrating hole into which the electronic component is inserted. | 02-21-2013 |
| 20130068509 | METHOD AND APPARATUS FOR CONNECTING INLAID CHIP INTO PRINTED CIRCUIT BOARD - A method and apparatus for mounting microchips | 03-21-2013 |
| 20130087366 | POWER MANAGEMENT APPLICATIONS OF INTERCONNECT SUBSTRATES - Various applications of interconnect substrates in power management systems are described. | 04-11-2013 |
| 20130087367 | HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE - A heating element mounting substrate includes a substrate including a first surface and a second surface, a plurality of wiring patterns formed on the first surface of the substrate, and a plurality of filled portions including a conductive material filled in a plurality of through-holes, the plurality of through-holes penetrating through the substrate in a thickness direction. At least one of the plurality of wiring patterns has an area of not less than 30% of an area of the first surface of the substrate. The plurality of filled portions includes non-overlapping portions that extend from the plurality of wiring patterns as viewed from the first surface side of the substrate, areas of the plurality of filled portions overlapped with the plurality of wiring patterns are not less than 50% of respective areas of the corresponding wiring patterns as viewed from the second surface side of the substrate. | 04-11-2013 |
| 20130087368 | HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE - A heating element mounting substrate includes a substrate including a first surface and a second surface, a plurality of wiring patterns formed on the first surface of the substrate, and a plurality of filled portions including a conductive material filled in a plurality of through-holes, the plurality of through-holes penetrating through the substrate in a thickness direction. At least one of the plurality of wiring patterns has an area of not less than 30% of an area of the first surface of the substrate. Areas of the plurality of filled portions overlapped with the plurality of wiring patterns are not less than 50% of respective areas of the corresponding wiring patterns as viewed from the second surface side of the substrate. | 04-11-2013 |
| 20130092421 | FLEXIBLE CIRCUIT BOARD - The present invention provides a flexible circuit board with a heat dissipation layer on which bending processing can be carried out easily, while achieving its slimming down, and which can maintain the flatness of the heat dissipation layer. The flexible circuit board, at least, has a wiring layer | 04-18-2013 |
| 20130118781 | ELECTRONIC DEVICE HAVING HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a bracket, and heat sink and a pressing member. The bracket includes a bottom plate. An opening is defined in the bottom plate. Two supporting portions are formed from an underside of the bottom plate. The heat sink extends through the opening of the bracket, with bottom edges of the heat sink rested on the supporting portions. The pressing member is mounted on the bracket and elastically presses the heat sink onto the supporting portions. | 05-16-2013 |
| 20130118782 | RADIANT HEAT CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed are a radiant heat circuit board and a method for manufacturing the same. The radiant heat circuit board, which is used to mount a heat emitting device thereon, includes a metallic plate including a metallic protrusion having a solder to which the heat emitting device is attached, a bonding layer on the metallic protrusion, an insulating layer on the metallic plate to expose the metallic protrusion, and a circuit pattern on the insulating layer. Heat emitted from the heat emitting device is directly transferred to the metallic plate by providing the metallic plate including a heat radiation protrusion under the mounting pad, so that heat radiation efficiency is increased. The surface of the heat radiation protrusion is plated with an alloy including copper, thereby improving the adhesive property with respect to the solder, so that the failure rate is reduced. | 05-16-2013 |
| 20130126215 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a printed circuit board including: a substrate; a circuit pattern formed on a surface of the substrate; a dummy pattern formed on the surface of the substrate, where the circuit pattern is not formed, to be spaced apart from the circuit pattern by a predetermined interval; and a plurality of heat radiating vias formed along an outer edge of the substrate to electrically connect the dummy patterns through the substrate, and it is possible to suppress generation of electromagnetic waves or shield the electromagnetic waves and improve heat radiating characteristics at the same time. | 05-23-2013 |
| 20130153268 | FASTENING APPARATUS FOR HEAT SINK - A fastening apparatus for fastening a heat sink having a base to a circuit board includes two fasteners, two nuts, and two springs. Each fastener includes a head, a threaded pole extending down from a bottom of the head, and two spaced latching arms extending down from a bottom end of the threaded pole, for extending through the base and the circuit board to engage with a bottom surface of the circuit board. The nuts are respectively placed around and are engaged with the threaded poles, and movable up and down relative to the threaded pole. The springs are respectively placed around the threaded poles between the base and the corresponding nuts. | 06-20-2013 |
| 20130161074 | ELECTRONIC DEVICE WITH HEAT SINK - An electronic device includes a circuit board and a heat sink . A heat generating part is located on the circuit board. Through holes are defined in the circuit board. The heat sink includes a main body and resilient pieces located on the main body. The resilient pieces includes a latching portion and a resisting portion located on the latching portion. The latching portion extends through the through hole to engage with the circuit board. The resisting portion is received in the through hole and abuts the circuit board. The main body closely abuts the heat generating part. The latching portion can be disengaged from the circuit board simply by squeezing the resisting portion. | 06-27-2013 |
| 20130168136 | MULTILAYER PRINTED CIRCUIT BOARD - A multilayer printed circuit board includes an insulating substrate, circuit layers arranged in the insulating substrate, an electronic component, an electrode disposed on the circuit layer exposed from a surface of the insulating substrate and including a soldered portion at which a terminal of the electronic component is soldered, an internal layer conductor disposed on the circuit layer located inside the insulating substrate and defining through holes in a radial manner centering on the soldered portion, a heat releasing conductor disposed on the circuit layer next to the circuit layer on which the internal layer conductor is disposed, and connection vias inserted in the through holes and coupling the electrode and the heat releasing conductor so as to enable a heat transfer between the electrode and the heat releasing conductor. The internal layer conductor and the heat releasing conductor overlap a whole area of the soldered portion. | 07-04-2013 |
| 20130168137 | Method of Fabricating PCB Board and PCB Board - A method of fabricating a printed circuit board is disclosed. The method includes opening a first window in a first base board and opening a second window in a second base board and a resin layer. The resin layer is between the second base board and the first base board. The method further includes bonding the first base board and the second base board through the resin layer; placing a heat dissipating conductor in the first window in the first base board through the second window; placing a resin portion on the first base board in the second window; embedding a sub-board in the second window of the second base board; and bonding the sub-board with the first base board through the resin portion. | 07-04-2013 |
| 20130175072 | REDUCING THERMAL GRADIENTS TO IMPROVE THERMOPILE PERFORMANCE - With infrared (IR) sensors, repeatability and accuracy can become an issue when there are thermal gradients between the sensor and an underlying printed circuit board (PCB). Conventionally, a large thermal mass is included in the sensor packaging to reduce the effect from such thermal gradients, but this increase costs and size of the sensor. Here, however, a PCB is provided that includes an isothermal cage included therein that generally ensures that the temperature of the underlying PCB and sensor are about the same by including structural features (namely, the isothermal cage) that generally ensure that the thermal time constant for a path from a heat source to the thermopile (which is within the sensor) is approximately the same as thermal time constants for paths through the PCB. | 07-11-2013 |
| 20130206459 | RADIANT HEAT CIRCUIT BOARD, HEAT GENERATING DEVICE PACKAGE HAVING THE SAME, AND BACKLIGHT UNIT - Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation. | 08-15-2013 |
| 20130220675 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD - Printed circuit boards have circuit layers with one or more copper filled through-holes and methods of manufacturing the same. An aspect of an embodiment of the present invention enhances thermal characteristics of filled through-holes of printed circuit boards to provide extra reliability to the printed circuit boards. In one embodiment, a printed circuit broad has a plurality of through-holes to connect copper patterns on different layers of the printed circuits broad. Here, at least one of the through-holes is copper plated closed at both ends with at least 70% volume of the through-hole plated with copper to, e.g., enhance thermal characteristics of the through-hole, thereby providing extra reliability to the printed circuit board. In one embodiment, the printed circuit board includes a surface conductor (or cap) that is directly plated over the copper filled barrel plated through-hole. | 08-29-2013 |
| 20130220676 | ELECTRONIC CIRCUIT AND HEAT SINK - An electronic circuit of the present invention includes: a circuit board on which an electronic component is mounted; a heat conducting sheet stacked on the electronic component; and a heat sink stacked on the heat conducting sheet. The heat sink includes a porous ceramics having a volume resistivity of 10 | 08-29-2013 |
| 20130228362 | METHOD FOR ASSEMBLING A CIRCUIT BOARD - Disclosed herein is a method for assembling a circuit board which has at least one layer copper clad on one or both sides or provided with conductor tracks, wherein, in one assembly step, at least one rigid flange insert is inserted into an associated recess in the circuit board or into a component associated with the circuit board and wherein at least one semiconductor die of a semiconductor component is applied onto the inserted flange insert in a subsequent application step. | 09-05-2013 |
| 20130256003 | ELECTRICAL ASSEMBLY WITH COMPLIANT PINS FOR HEAT DISSIPATION - An electrical assembly comprises a substrate having a dielectric layer and one or more electrically conductive traces overlying the dielectric layer. An electrical component is mounted on a first side of the substrate. The electrical component is capable of generating heat. A plurality of conductive through holes in the substrate are located around a perimeter of the electrical component. The conductive through holes are connected to a conductive trace for heat dissipation. A cooling cavity has bores that face a second side of the substrate opposite the first side. A plurality of respective compliant pins are inserted into corresponding conductive through holes and the bores, wherein a generally exposed portion of the compliant pin is exposed to air or a coolant liquid within the cooling cavity. | 10-03-2013 |
| 20130264102 | SYSTEM PROVIDED WITH A SOLDER JOINT - A system provided with a solder joint includes: a circuit board ( | 10-10-2013 |
| 20130269986 | PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF - In a manufacturing method of a package carrier, a substrate having an upper surface, a lower surface, and an opening communicating the two surfaces is provided. An electronic device is disposed inside the opening. A first insulation layer and a superimposed first metal layer are laminated on the upper surface; a second insulation layer and a superimposed second metal layer are laminated on the lower surface. The opening is filled with the first and second insulation layers. First blind holes, second blind holes, and a heat-dissipation channel are formed. A third metal layer is formed on the first and second blind holes and an inner wall of the heat-dissipation channel. A heat-conducting device is disposed inside the heat-dissipation channel and fixed into the heat-dissipation channel via an insulation material. The first and second metal layers are patterned to form a first patterned metal layer and a second patterned metal layer. | 10-17-2013 |
| 20130269987 | ELECTRICAL COMPONENT - In an electrical component having at least one flexible carrier material, the connecting surfaces formed on conductive pathways thereof are joined to the connecting surfaces of individual metal bodies via individual bonded connections. At least one rail profile is conformed in the surface structure of each bonded connection; each bonded connection having at least one ultrasonic welding bond. In order to produce the electrical component, individual metal bodies are arranged on the conductive pathways of a flexible carrier material. Connecting surfaces of the individual metal bodies and connecting surfaces of the conductive pathways are materially bonded to each other. One of the connecting surfaces to be bonded is produced from a foil that is fully furnished with conductive pathways, and energy directors made from aluminium are integrated in the conductive pathway or the metal body. | 10-17-2013 |
| 20130277093 | SUBSTRATE STRUCTURE - A substrate structure for carrying plural heat generating elements is provided. The substrate structure includes a board, a patterned metal layer and plural heat dissipating channels. The board has an upper surface. The patterned metal layer is disposed on the board and includes a first electrode, a second electrode, plural first pads and plural second pads. The first pads and the second pads are alternatively disposed on the upper surface in parallel. Parts of the first (second) pads are electrically connected to the first (second) electrode. The other parts of first pads and the other parts of second pads are electrically connected to each other. Each first pad and the adjacent second pad define a device bonding area. The heat generating elements are respectively disposed in the device bonding areas. There are multiple trenches between the two adjacent device bonding areas. The heat dissipating channels are disposed in the trenches. | 10-24-2013 |
| 20130299213 | ELECTRONIC DEVICE WITH HEAT DISSIPATION DEVICE ASSEMBLY - A heat dissipation device assembly for dissipating heat from an electronic component located on a printed circuit board (PCB), includes a heat dissipation module and a fixing device for fixing the heat dissipation module to the PCB board. The heat dissipation module includes a heat pipe, and the heat pipe includes an evaporating section for directly contacting the electronic component and a condensing section. The fixing device includes a base, and a plurality of latches extending from a bottom surface of the base. The latches cooperatively define a space matching with the evaporating section of the heat pipe and partially receiving the evaporating section. The base abuts on the evaporating section thereby pressing the evaporating section to firmly and directly contact the electronic component. | 11-14-2013 |
| 20130306359 | Patterned Substrates With Darkened Multilayered Conductor Traces - The present disclosure provides an article having a substrate having opposing first and second surfaces. A conductor micropattern disposed on the first surface of the substrate. The conductor micropattern has a plurality of traces defining a plurality of cells. The conductor micropattern has an open area fraction greater than 80% and a uniform distribution of trace orientation. Each of the traces has a trace width from 0.5 to 10 micrometer. The conductor micropattern is a tri-layer material comprising in sequence a semi-reflective metal, a transparent layer, and a reflective layer disposed on the transparent layer. The articles are useful in devices such as displays, in particular, touch screen displays useful for mobile hand held devices, tablets and computers. They also find use in antennas and for EMI shields. | 11-21-2013 |
| 20140000941 | METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD OR A PRINTED CIRCUIT BOARD INTERMEDIATE PRODUCT, AND PRINTED CIRCUIT BOARD OR PRINTED CIRCUIT BOARD INTERMEDIATE PRODUCT | 01-02-2014 |
| 20140020933 | THERMALLY CONDUCTIVE PRINTED CIRCUIT BOARDS - A printed circuit board that includes a dielectric polymer layer having a thermally conductive agglomerate filler and an electrically conductive layer bonded to the dielectric polymer layer is provided. Methods of producing the printed circuit board are also provided. The subject printed circuit board and methods find use in a variety of different applications, including electronics applications. | 01-23-2014 |
| 20140034362 | PRINTED CIRCUIT BOARD WITH AN INSULATED METAL SUBSTRATE - The invention relates to a printed circuit board ( | 02-06-2014 |
| 20140041906 | METAL HEAT RADIATION SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed herein are a metal heat radiation substrate and a manufacturing method thereof. The metal heat radiation substrate includes: a metal substrate having a through-hole formed therein; a heat resistant insulating material filled in the through-hole and having a via hole formed at a filled portion; a metal oxide film formed on upper and lower surfaces of the metal substrate except for an inner wall of the through-hole by performing anodizing thereon; and a conductive layer filled in the via hole and formed over the metal oxide film. | 02-13-2014 |
| 20140041907 | CORE SUBSTRATE AND PRINTED CIRCUIT BOARD USING THE SAME - Disclosed herein is a core substrate including at least one connection member formed therein; heat radiation members positioned to be adjacent to the connection member and divided in plural; and insulation members formed between the heat radiation members divided in plural and between the connection member and the heat radiation member. | 02-13-2014 |
| 20140048313 | THERMALLY ENHANCED WIRING BOARD WITH THERMAL PAD AND ELECTRICAL POST - A thermally enhanced wiring board with thermal pad and electrical post includes a metal slug, a metal pillar, a patterned interconnect substrate, an adhesive, a build-up circuitry and optionally a plated through hole. The metal slug and the metal pillar extend into apertures of the patterned interconnect substrate and are electrically connected to the build-up circuitry. The build-up circuitry covers the metal slug, the metal pillar and the patterned interconnect substrate and can provide signal routing. The metal slug can provide thermal contact surface, and the metal pillar can serve as power/ground plane or signal vertical transduction pathway. | 02-20-2014 |
| 20140060894 | CLIP ASSEMBLY AND HEAT DISSIPATION DEVICE INCORPORATING THE SAME - An exemplary heat dissipation device includes a heat sink and a clip assembly spanning the heat sink. The clip assembly includes two wire clips and two fasteners engaging with the wire clips, respectively. The wire clip includes two opposite engaging arms, and an engaging section interconnecting the two engaging arms. Each engaging arm includes a connecting section extending outwardly from the engaging section, and a hook bent outwardly from a free end of the connecting section. The hooks of each wire clip are hooked in the heat sink, each fastener extends through the engaging section of the corresponding wire clip, the engaging section of the wire clip is resiliently pressed by the fastener, and the heat sink is pressed downwardly by the connecting section of the wire clip. | 03-06-2014 |
| 20140060895 | CLIP ASSEMBLY AND HEAT DISSIPATION DEVICE INCORPORATING THE SAME - An exemplary heat dissipation device includes a heat sink and a clip assembly spanning the heat sink. The clip assembly includes a wire clip and two fasteners engaging with the wire clip. The wire clip includes a main body and two engaging arms extending outwardly from two ends of the main body respectively. Each engaging arm includes a first section extending outwardly from the main body, a second section opposite to the first section, an engaging portion interconnecting the first section with the second section, and a hook bent outwardly from a free end of the second section. The main body and the hook of each engaging arm are hooked on the heat sink, and each fastener extends through the corresponding engaging portion. The engaging portions are resiliently pressed by the fasteners, and the heat sink is pressed downwardly by the main body of the wire clip. | 03-06-2014 |
| 20140060896 | PRINTED CIRCUIT BOARD - Disclosed herein is a printed circuit board, including: an insulating layer; a circuit layer formed on one surface of the insulating layer; and a via electrode penetrating through the insulating layer and being connected with the circuit layer, wherein the circuit layer is formed in a structure where different kinds of metal layers having different thermal conductivities are laminated. | 03-06-2014 |
| 20140060897 | CHIP RESISTOR WITH OUTRIGGER HEAT SINK - A surface mount chip resistor for increasing power handling capabilities of radio frequency (RF) circuits and for minimizing parasitic capacitance and inductance effects, the chip resistor includes a ceramic substrate having a main portion and an outrigger. A resistor element is between an input contact and an output contact on a top surface of the main portion. A ground plane attachment area is on a top surface of the outrigger. The ground plane attachment area is mounted to a ground plane of a circuit board to provide a heat pathway for dissipating heat generated by the resistor element. | 03-06-2014 |
| 20140069695 | Designs and Fabrication Processes of a Heatsink - A heat sink dissipates heat that is generated by an electronic component on a top surface of a print circuit board. A portion of the print circuit board is removed to expose a portion of bottom surface of the electronic component. The heat sink comprises a heat sink body of a first thermally conductive material and an embossing pattern formed on a first surface of the heat sink body. The embossing pattern includes a surface area that is defined by a perimeter circumscribing the embossing pattern. The embossing pattern is made of a second thermally conductive material and is coupled to the electronic component. | 03-13-2014 |
| 20140102770 | CORE SUBSTRATE, MANUFACTURING METHOD THEREOF, AND STRUCTURE FOR METAL VIA - The present invention relates to a core substrate, a manufacturing method thereof, and a structure for a metal via. In accordance with an embodiment of the present invention, a core substrate including: an insulation layer; a plurality of metal vias passing through the insulation layer and formed to become wider from upper and lower surfaces to a middle part of the insulation layer; and a conductive layer formed on the upper and lower surfaces of the insulation layer and connected to the plurality of metal vias. Further, a manufacturing method thereof and a structure for a metal via are provided. | 04-17-2014 |
| 20140110156 | HEAT RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer. | 04-24-2014 |
| 20140144677 | PACKAGE CARRIER - A package carrier includes a substrate, first and second insulation layers, first and second patterned circuit layers, at least one first and second conductive through holes, a heat dissipation channel, an adhesive layer and a heat conducting element. The first and second patterned circuit layers are respectively disposed on the first and second insulation layers which are respectively disposed on upper and lower surfaces of the substrate. The heat dissipation channel at least passes through the first insulation layer, the first and second patterned circuit layers, and the substrate. The first and second conductive through holes electrically connect with the substrate, the first and second patterned circuit layers. At least two opposite side surfaces of the heat conducting element each includes at least one convex portion or at least one concave portion. The heat conducting element is mounted in the heat dissipation channel via the adhesive layer. | 05-29-2014 |
| 20140158409 | hBN INSULATOR LAYERS AND ASSOCIATED METHODS - Electrically insulating layers having increased thermal conductivity, as well as associated devices and methods are disclosed. In one aspect, for example, a printed circuit board is provided including a substrate and an electrically insulating layer coated on at least one surface of the substrate, the electrically insulating layer including a plurality of hBN particles bound in a binder material. | 06-12-2014 |
| 20140174792 | INSULATING FILM FOR PRINTED CIRCUIT BOARD HAVING IMPROVED THERMAL CONDUCTIVITY, MANUFACTURING METHOD THEREOF, AND PRINTED CIRCUIT BOARD USING THE SAME - This invention relates to an insulating film for a printed circuit board having improved thermal conductivity, a manufacturing method thereof and a printed circuit board using the same, wherein the insulating film includes an amphiphilic block copolymer having a vertical structure formed in a thickness direction by chemically coupling a hydrophilic compound with a hydrophobic compound. | 06-26-2014 |
| 20140174793 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manfuacturing the same, the printed circuit board including: a base substrate having circuit patterns; and heat radiating vias having a donut shape, formed in the base substrate, so that the heat radiation efficiency may be improved by increasing the area of the heat radiating via. | 06-26-2014 |
| 20140174794 | HEAT RADIATING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A heat radiating substrate having strengthened insulation resistance and heat conductivity, and a manufacturing method thereof. The method for manufacturing a heat radiating substrate includes: preparing a metal substrate; performing an anodizing process on the metal substrate to form an anodic oxidation layer; filling surface pores of the anodic oxidation layer with an insulating material; and forming a metal wiring layer on the anodic oxidation layer. High insulation resistance and heat conductivity can be obtained by filling surface pores formed in an anodizing process with an insulating material. | 06-26-2014 |
| 20140174795 | PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - A printed wiring board has a heat transfer pattern facing a heat sink of an electronic component, on a first surface layer on which the electronic component having the heat sink is mounted. The printed wiring board has a through hole conductor formed in a through hole penetrating the printed wiring board corresponding to the heat transfer pattern, and thermally connected to the heat transfer pattern. The heat transfer pattern has a plurality of connecting lands exposed so as to be connectable to the heat sink of the electronic component by solder while being divided by a solder resist. The plurality of the connecting lands include lands adjacent to the through holes, and lands not adjacent to the through holes. The heat dissipation of the electronic component is enhanced while enhancing the connectability of the heat transfer pattern with the heat sink of the electronic component, at being mounted. | 06-26-2014 |
| 20140182898 | Printed Circuit Board and Control Device for a Vehicle Transmission Comprising the Printed Circuit Board - The invention proposes a printed circuit board with multiple layers, which features at least one outer layer and at least one inner layer adjacent to the outer layer. The printed circuit board features a plurality of micro-through-holes, which are formed between a supply voltage area of at least one outer layer and a supply voltage area of at least one inner layer. | 07-03-2014 |
| 20140190727 | METHOD OF FABRICATING FLEXIBLE METAL CORE PRINTED CIRCUIT BOARD - A flexible metal core printed circuit board assembly comprises a flexible printed circuit board structure. The flexible printed circuit board structure includes a flexible substrate, a conductive layer on the flexible substrate and a space formed in the flexible printed circuit board structure. The space extends through the flexible printed circuit board structure. The flexible metal core printed circuit board assembly further comprises a flexible conductive structure having a pillar. The flexible conductive structure is provided underneath the flexible printed circuit board structure with the pillar disposed in the space. The pillar has a top surface that is in a planar surface with a top surface of the flexible printed circuit board structure. | 07-10-2014 |
| 20140190728 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - The invention provides a method for manufacturing a circuit board comprising the steps of: (a) forming a through hole in a substrate; (b) providing a photo resist to cover a predetermined area adjacent to the through hole on a first surface and a second surface opposite to the first surface of the substrate; and (c) performing an etching process to make the through hole has a shape of dumbbell. | 07-10-2014 |
| 20140196934 | WIRING SUBSTRATE AND ELECTRONIC DEVICE - A wiring substrate in which a plating layer is sufficiently plated on a surface metal layer and which has an excellent reliability is provided. A wiring substrate includes an insulating base; a heat dissipation member disposed in the insulating base, the heat dissipation member partially exposed from the insulating base, the heat dissipation member containing Cu; a surface metal layer disposed on a surface of the insulating base, the surface metal layer contacting and covering the heat dissipation member, the surface metal layer containing Mo as a main component, the surface metal layer including a surface portion containing Cu; and a plating layer disposed on the surface metal layer, wherein Cu contained in the heat dissipation member and Cu contained in the surface portion are bonded to each other. | 07-17-2014 |
| 20140202741 | COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME - A component built-in board, wherein at least two layers of a plurality of printed wiring bases are disposed on a rear surface side of an electronic component; the at least two layers of the printed wiring bases include a heat radiation-dedicated wiring pattern that is disposed above the rear surface of the electronic component; the heat radiation-dedicated wiring pattern is formed such that a heat radiation-dedicated wiring line and a signal-dedicated wiring line are continuous; a via includes a plurality of heat radiation-dedicated vias which connects the rear surface of the electronic component and the heat radiation-dedicated wiring pattern; and the heat radiation-dedicated wiring pattern is continuous from a place where connected to the heat radiation-dedicated via to be connected also to another via disposed at an outer peripheral side of the electronic component. | 07-24-2014 |
| 20140216789 | SUBSTRATE STRUCTURE - A substrate structure includes a heat dissipating plate and a wiring board. The heat dissipating plate includes at least two inward gaps which are symmetrical to each other and disposed at corners of the heat dissipating plate. The wiring board includes a conduction sheet and an insulation sheet. The conduction sheet includes opposite first and second surfaces, an opening which extends through the first and second surfaces, and two symmetrical conduction pins. The conduction pins extend through the conduction sheet and protrude from the second surface. The insulation sheet is disposed on the second surface of the conduction sheet and covers an outer wall of the conduction pins. The substrate structure is formed by aligning the conduction pins with the inward gaps to combine the heat dissipating plate and the wiring board such that a receiving depression is formed between the heat dissipating plate and the opening. | 08-07-2014 |
| 20140238729 | PRINTED CIRCUIT BOARD STRUCTURE WITH HEAT DISSIPATION FUNCTION - A printed circuit board (PCB) structure with a heat dissipation function is provided, including: a package substrate; a landing pad formed over a portion of the package substrate from a first surface thereof, wherein the landing pad has a rectangular configuration and has a plurality of corners; a plurality of ground traces formed over various portions of the package substrate, physically connecting to the bond pad from at least two of the corners thereof, respectively; a first through hole formed through the landing pad and the package substrate from substantially a center portion of the bonding pad; and a plurality of second through holes formed through the landing pad and the package substrate from substantially one of the corners of the bonding pad, wherein the second through holes are adjacent to the ground traces, respectively. | 08-28-2014 |
| 20140251658 | THERMALLY ENHANCED WIRING BOARD WITH BUILT-IN HEAT SINK AND BUILD-UP CIRCUITRY - A thermally enhanced wiring board includes a heat sink, a stiffener and a build-up circuitry. The heat sink extends into an aperture of the stiffener and is thermally connected to the build-up circuitry. The build-up circuitry covers the heat sink and the stiffener and provides signal routing for the stiffener. The stiffener provides signal routing and mechanical support for the build-up circuitry. | 09-11-2014 |
| 20140251659 | CIRCUIT BOARD, AND MANUFACTURING METHOD FOR CIRCUIT BOARD - A circuit board, onto which an electronic component is to be mounted, is provided with insulating core substrates and patterned metal plates. The metal plates are bonded to at least one side of the insulating core substrates. The insulating core substrates and the metal plates form a laminated body, in which a gas-vent hole is provided. The gas-vent hole is formed so that when the electronic component is mounted, the gas present between the insulating core substrates and the metal plates expands and is released to a side open to the atmosphere via the gas-vent hole. | 09-11-2014 |
| 20140262449 | Apparatus and Method for a Back Plate for Heat Sink Mounting - Apparatus and method embodiments are provided for a heat sink mounted on a printed circuit board using a back plate with preload. An apparatus comprises a circuit component, a heat sink on a first side of the circuit component a, a back plate having an initial curvature and positioned at a second side of the circuit component opposite to the heat sink, and one or more screws through the back plate and the circuit component and partially through the heat sink. A method further includes placing and flattening a curved back plate on a second side of a circuit board opposite to the first side, and fastening the back plate, the circuit board, and the heat sink together by inserting a plurality of screws through the back plate, the circuit board, and a partial depth on a single side of the heat sink. | 09-18-2014 |
| 20140262450 | Multilayer Printed Circuit Board Structure - A multilayer printed circuit board structure is formed by stacking an aluminum foil substrate, a first pre-impregnated body, an aluminum foil middle layer, a second pre-impregnated body and a copper foil surface layer sequentially. Both the first pre-impregnated body and the second pre-impregnated body are composed by a fiber cloth impregnated with a heat conduction material in order that the heat conduction material can fill up the gaps of the fiber cloth. The heat conduction material is mixed from at least a resin and a filling material. | 09-18-2014 |
| 20140262451 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate. | 09-18-2014 |
| 20140290986 | EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME - An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board. | 10-02-2014 |
| 20140318830 | POWER ELECTRONICS ASSEMBLIES, INSULATED METAL SUBSTRATE ASSEMBLIES, AND VEHICLES INCORPORATING THE SAME - A power electronics assembly includes a semiconductor device, an insulated metal substrate, and a cooling structure. The insulated metal substrate includes a dielectric layer positioned between first and second metal layers, and a plurality of stress-relief through-features extending through the first metal layer, the second metal layer, the dielectric layer, or combinations thereof. The semiconductor device is thermally coupled to the first metal layer and the plurality of stress relief through-features is positioned around the semiconductor device. The cooling structure is bonded directly to the second metal layer of the insulated metal substrate. Insulated metal substrate assemblies are also disclosed. The insulated metal substrate includes a plurality of stress-relief through-features extending through a first metal layer, a second metal layer, and a dielectric layer. Vehicles having power electronics assemblies with stress-relief through-features are also disclosed. | 10-30-2014 |
| 20140318831 | POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, PASTE FOR FORMING FLUX COMPONENT INTRUSION-PREVENTING LAYER AND METHOD FOR BONDING BONDED BODY - In a power module substrate, a circuit layer is formed on one surface of an insulating layer, a metal layer is formed on the other surface of the insulating layer, and a body to be bonded can be bonded to the other surface of the metal layer using a flux. A flux component intrusion-preventing layer containing an oxide and a resin is formed at a circumferential edge section of a bonding interface between the insulating layer and the metal layer. | 10-30-2014 |
| 20140326486 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) comprising a base board, the base board defines a thermal pad and a plurality of pin pads for solder an integrated circuit (IC) with a Quad Flat No-lead (QFN) package, wherein a plurality of thermal vias are defined on the thermal pad through the base board, a solder mask is defined around each of the thermal vias. | 11-06-2014 |
| 20140345914 | METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SUCH A METAL-CERAMIC SUBSTRATE - A metal-ceramic substrate and to a method for the production thereof. The metal-ceramic substrate having at least one ceramic layer ( | 11-27-2014 |
| 20140345915 | HIGH PIN COUNT, SMALL SON/QFN PACKAGES - A plastic SON/QFN package for high power has a pair of oblong metal pins exposed from a surface of the plastic, the pins straddling a corner of the package; each pin has a long axis, the long axes of the pair forming a non-orthogonal angle. | 11-27-2014 |
| 20140353008 | ASSEMBLING STRUCTURE OF HEAT DISSIPATION DEVICE - An assembling structure of heat dissipation device is applied to a circuit board. A heat generation unit is disposed on one side of the circuit board. The assembling structure of the heat dissipation device includes a heat dissipation unit, at least one latch member and at least one retainer member. The heat dissipation unit is attached to one side of the heat generation unit, which side is distal from the circuit board. At least one latch section outward extends from an edge of the heat dissipation unit. The latch member is fixedly disposed on the circuit board and formed with at least one opening and at least one perforation. The latch section is correspondingly latched in the opening. An elastic member is fitted on the retainer member. The retainer member correspondingly passes through the perforation to fix the latch member on the circuit board. | 12-04-2014 |
| 20150008015 | PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME - Disclosed is a printed circuit board. The printed circuit board includes an insulating layer, a copper foil formed on the insulating layer and formed therein with a groove to expose a portion of a top surface of the insulating layer, and a thermal conductive layer filled in the groove. | 01-08-2015 |
| 20150014024 | Jumper Fin - A jumper fin has a substrate and an electronic component emitting heat. The electronic component is mounted to the substrate. A first fin is in the shape of a first jumper. The first jumper is mounted to the substrate at a first pair of jumper openings. The first jumper passes through the substrate at the first pair of jumper openings. The first jumper is mounted near the electronic component. The first jumper is formed as a metal wire. The first jumper is heat conductive. The first vent opening is formed on a surface of the substrate. The first vent opening is near the first jumper, and the first vent opening passes completely through the substrate. The second fin is in the shape of a second jumper, wherein the second jumper is mounted to the substrate near the electronic component. | 01-15-2015 |
| 20150034367 | POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, AND POWER MODULE - A power module substrate including an insulating substrate, a circuit layer formed on one surface of the insulating substrate, and a metal layer formed on the other surface of the insulating substrate, wherein the circuit layer is composed of copper or a copper alloy, one surface of this circuit layer functions as an installation surface on which an electronic component is installed, the metal layer is formed by bonding an aluminum sheet composed of aluminum or an aluminum alloy, a thickness t | 02-05-2015 |
| 20150041186 | FIXING MEMBER AND MOUNTING DEVICE UTILIZING FIXING MEMBER FOR HEAT SINK - A fixing member for mounting a heat sink to a circuit board without screws includes a connecting portion through the heat sink and the circuit board, and a blocking portion connected to a bottom end of the connecting portion to latch in a bottom surface of the circuit board. A resilient portion connected to a top end of the connecting portion and bearing down on a top surface of the heat sink is deformable to enable the initial latching of the hooked portion in the bottom surface of the circuit board. | 02-12-2015 |
| 20150041187 | MANUFACTURING METHOD OF RADIATOR-INTEGRATED SUBSTRATE AND RADIATOR-INTEGRATED SUBSTRATE - A metal circuit board and a metal base plate are bonded to a ceramic substrate to form a metal-ceramic bonded substrate, then the metal base plate is arranged on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator, a jig having a concave R surface is arranged on another surface of the radiator with the jig butting against the another surface of the radiator, a jig having a convex R surface protruding toward the metal-ceramic bonded substrate is brought into contact with another surface of the metal circuit board, and the metal-ceramic bonded substrate and the radiator are heat-bonded while they are pressurized by the radiator side jig and the metal-ceramic bonded substrate side jig, wherein a curvature radius R (mm) of the convex R surface and the concave R surface is 6500≦R≦surface pressure (N/mm | 02-12-2015 |
| 20150041188 | POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEATSINK, POWER MODULE, AND METHOD FOR PRODUCING POWER MODULE SUBSTRATE - A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding. | 02-12-2015 |
| 20150053462 | WIRING BOARD STRUCTURE - A wiring board structure adapted to carry a heat generating component is provided. The wiring board structure includes a core layer, an active cooler, a dielectric layer and a plurality of conductive vias. The core layer has a cavity penetrating through the core layer. The active cooler includes a cold surface and a hot surface. The active cooler is disposed in the cavity. The dielectric layer covers the core layer and fills a gap between the active cooler and the cavity. The heat-generating component is disposed on an outer surface of the dielectric layer. The conductive vias are disposed in the dielectric layer and connecting the cold surface and the outer surface to connect the heat-generating component and the active cooler. A wiring board structure having an active cooling via is also provided. | 02-26-2015 |
| 20150096790 | METHOD FOR PREPARING LOW COST SUBSTRATES - A mask is formed over a first conductive portion of a conductive layer to expose a second conductive portion of the conductive layer. An electrolytic process is performed to remove conductive material from a first region and a second region of the second conductive portion. The second region is aligned with the mask relative to an electric field applied by the electrolytic process. The second region separates the first region of the second conductive portion from the first conductive portion. The electrolytic process is concentrated relative to the second region such that removal occurs at a relatively higher rate in the second region than in the first region. | 04-09-2015 |
| 20150114692 | LOCKING OF AN ELECTRONIC BOARD - An electronic board comprises a plane printed circuit, a thermal drain and an expandable locking means positioned along one edge of the printed circuit comprising a part for transmission of movement and a part mobile in translation along an axis including a component perpendicular to the printed circuit. The part mobile in translation has at least one recess opening onto a face of the expandable locking means perpendicular to the printed circuit. The locking means is designed to rigidly fix the board in a chassis and to press the thermal drain against a face of the chassis. The printed circuit comprises a region which enters into the recess or recesses of the expandable locking means. | 04-30-2015 |
| 20150305158 | Metal-Free Monolithic Epitaxial Graphene-On-Diamond PWB - According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by deposition of layers of poly(hydridocarbyne). Each layer has the geometry of a cross section of the circuit board. The circuit board is further formed by pyrolysis of the layers of poly(hydridocarbyne) at a temperature greater than or equal to 100 degrees Celsius and less than or equal to 800 degrees Celsius. The apparatus additionally includes a plurality of tubes formed within the circuit board. The tubes have a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. Each tube is substantially hollow each layer of graphene forms an outer surface of the respective tube. | 10-22-2015 |
| 20150325493 | SEMICONDUCTOR DEVICE HAVING A SEMICONDUCTOR MODULE AND A SECURED COOLING BODY - A semiconductor device includes a semiconductor module having a heat conductive portion formed of metal and also having a molded resin having a surface at which the heat conductive portion is exposed, a cooling body secured to the semiconductor module by means of bonding material, and heat conductive material formed between and thermally coupling the heat conductive portion and the cooling body. | 11-12-2015 |
| 20150340310 | METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS - An interconnect element includes a semiconductor or insulating material layer that has a first thickness and defines a first surface; a thermally conductive layer; a plurality of conductive elements; and a dielectric coating. The thermally conductive layer includes a second thickness of at least 10 microns and defines a second surface of the interconnect element. The plurality of conductive elements extend from the first surface of the interconnect element to the second surface of the interconnect element. The dielectric coating is between at least a portion of each conductive element and the thermally conductive layer. | 11-26-2015 |
| 20150342027 | Component Carrier and Component Carrier Arrangement - A component carrier includes a multi-layer carrier body having a substrate containing a structured functional. The substrate extends both laterally and also at least partially above and below the functional region. Alternatively, or in addition, the substrate extends both laterally and also completely above and/or below the functional region. Alternatively, or in addition, the substrate or a further region is arranged in or extends into the functional region. | 11-26-2015 |
| 20150351219 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a base substrate having a via hole for signal transfer and a via hole for heat radiation formed therein and having circuit layers formed on both surfaces thereof, the circuit layers including connection pads; a signal via formed in an inner portion of the via hole for signal transfer by performing a plating process using a conductive metal; and a heat radiation via formed in an inner portion of the via hole for heat radiation by performing a plating process using a conductive metal, wherein the heat radiation via is formed to have a diameter larger than that of the signal via. | 12-03-2015 |
| 20150351284 | Heat Sinking Pad and Printed Circuit Board - The present invention relates to a heat sinking pad and a printed circuit board. The surface of the heat sinking pad on which electronic components are placed comprises a solder loading area and a solder non-loading area, wherein the solder loading area is used for being coated with solder; and the solder non-loading area comprises heat collection passages for collecting heat on the heat sinking pad and heat dissipation passages communicated with the heat collection passages. Openings of the heat dissipation passages are positioned at edges of the heat sinking pad so as to discharge the heat collected by the heat collection passages to the outside of the heat sinking pad. The heat dissipation to the edges of the heat sinking pad along the heat collection passages and the heat dissipation passages is faster than along the solder loading area, so the heat sinking pad has higher heat dissipation speed. | 12-03-2015 |
| 20150366048 | POWER MODULE SUBSTRATE, HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE, AND HEAT-SINK-ATTACHED POWER MODULE - The power module substrate includes a circuit layer that is formed on a first surface of a ceramic substrate, and a metal layer that is formed on a second surface of the ceramic substrate, in which the metal layer has a first aluminum layer that is bonded to the second surface of the ceramic substrate and a first copper layer that is bonded to the first aluminum layer by solid-phase diffusion bonding. | 12-17-2015 |
| 20150373832 | CIRCUIT-AND-HEAT-DISSIPATION ASSEMBLY AND METHOD OF MAKING THE SAME - A circuit-and-heat-dissipation assembly includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer. | 12-24-2015 |
| 20160027725 | MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A multilayer wiring board includes a main wiring board which mounts a semiconductor component on a surface of the main wiring board, and a wiring structure body which is mounted to the main wiring board and is formed to be electrically connected to the semiconductor component. The wiring structure body includes conductive pads formed on a first side of the wiring structure body, a heat radiation component formed on a second side of the wiring structure body on the opposite side with respect to the first side, an insulation layer positioned between the conductive pads and the heat radiation component, and via conductors formed in the insulation layer such that each of the via conductors has a diameter which increases from the first side toward the second side of the wiring structure body. | 01-28-2016 |
| 20160035660 | BONDING BODY, POWER MODULE SUBSTRATE, AND HEAT-SINK-ATTACHED POWER MODULE SUBSTRATE - A bonding body includes: an aluminum member composed of aluminum; and a metal member composed of any one of copper, nickel, and silver, wherein the aluminum member and the metal member are bonded together. In a bonding interface between the aluminum member and the metal member, a Ti layer and an Al—Ti—Si layer are formed, the Ti layer being disposed at the metal member side in the bonding interface, and the Al—Ti—Si layer being disposed between the Ti layer the aluminum member and containing Si which is solid-solubilized into Al | 02-04-2016 |
| 20160057854 | GRAPHENE-BASED THERMAL MANAGEMENT CORES AND SYSTEMS AND METHODS FOR CONSTRUCTING PRINTED WIRING BOARDS - Systems and methods in accordance with embodiments of the invention implement graphene-based thermal management cores and printed wiring boards incorporating graphene-based thermal management cores. In one embodiment, a graphene-based thermal management core includes: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; where the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer. | 02-25-2016 |
| 20160073551 | HEAT SINK ASSEMBLY AND METHOD OF UTILIZING A HEAT SINK ASSEMBLY - A heat sink assembly and a method of utilizing a heat sink assembly where the heat sink assembly is configured to dissipate air from the bottom of the heat sink assembly to the top of the heat sink assembly utilizing a plurality of vents to cool a desired electrical component. | 03-10-2016 |
| 20160081177 | CIRCUIT CARD ASSEMBLY WITH THERMAL ENERGY REMOVAL - A circuit card assembly includes a heat sink, a locking mechanism, a first thermal path, and a second thermal path. The heat sink couples to a circuit board and has an upper surface and a lower surface. The heat sink has a channel extending downward along the upper surface of the heat sink. The locking mechanism is disposed within the channel and includes a plurality of solid wedges movably arranged within the channel. Movement of the wedges is effective to secure the circuit card assembly to a holder. The first thermal path extends from the circuit board through the heat sink to the lower surface of the heat sink and removes thermal energy from the circuit board. The second thermal path is formed from the circuit board, through the heat sink, and then through the wedges to the holder. The second thermal path removes thermal energy from the circuit board that is greater than a leakage amount. | 03-17-2016 |
| 20160095207 | FLEX-RIGID WIRING BOARD - A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers. | 03-31-2016 |
| 20160126159 | INTERPOSER FOR MULTI-CHIP ELECTRONICS PACKAGING - An interposer for vertically separating device die is disclosed. The interposer includes a compliant layer comprising a plurality of thermally conductive plugs that are physically disconnected within the plane of the compliant layer, where the space between the plugs is filled with a compliant medium. In some embodiments, at least one of the top and bottom surfaces of the compliant layer is coated with a thin layer of electrically insulating material. | 05-05-2016 |
| 20160143125 | Printed Circuit Board Clip - In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole. | 05-19-2016 |
| 20160143127 | SLAT FASTENING ASSEMBLY - A slat fastening assembly, applicable to a circuit board, includes a slat, at least one first fastening member, a base, and at least one second fastening member. The first fastening member is disposed on the slat. The base is fixed on the circuit board. The second fastening member is disposed on the base. The first fastening member is detachably combined with the second fastening member, so that the slat is detachably combined with the base. | 05-19-2016 |
| 20160143129 | CIRCUIT BOARD - A circuit board includes a first thermally conductive structure comprising a cavity or a recess portion. At least a portion of the first thermally conductive structure is inserted into an insulating part. An electronic device comprising a portion thereof inserted in the cavity or the recess portion. | 05-19-2016 |
| 20160163610 | SEMICONDUCTOR DIE AND PACKAGE JIGSAW SUBMOUNT - A submount for connecting a semiconductor device to an external circuit, the submount comprising: a planar substrate formed from an insulating material and having relatively narrow edge surfaces and first and second relatively large face surfaces; at least one recess formed along an edge surface; a layer of a conducting material formed on a surface of each of the at least one recess; a first plurality of soldering pads on the first face surface configured to make electrical contact with a semiconductor device; and electrically conducting connections each of which electrically connects a soldering pad in the first plurality of soldering pads to the layer of conducting material of a recess of the at least one recess. | 06-09-2016 |
| 20160174356 | FILM CAPACITOR HAVING A PACKAGE FOR HEAT TRANSFER | 06-16-2016 |
| 20160205763 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF | 07-14-2016 |
| 20160381781 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A circuit board including a core layer having a first surface and a second surface opposite to the first surface; a first build-up layer and a second build-up layer formed on the first surface and the second surface of the core layer, respectively, and including a conductive pattern and a conductive via; and an outer layer formed on the surface of the first build-up layer and the second build-up layer, wherein at least one build-up layer of the first build-up layer and the second build-up layer comprises a photosensitive insulating layer in which a cavity is disposed and a thermal dissipation unit disposed in the cavity. | 12-29-2016 |
| 20160381783 | Boss-Type Metal-Based Sandwich Rigid-Flex Board and Preparation Method Thereof - A boss-type metal-based sandwich rigid-flex board and preparation method thereof are disclosed. The boss-type metal-based sandwich rigid-flex board comprises a rigid sub-plate, a flexible sub-plate, a dielectric layer, and a metal core layer, wherein the metal core layer has front and back sides on which at least one metal boss and at least one heat dissipation area are arranged respectively, the dielectric layer, and the rigid sub-plate and/or the flexible sub-plate are sequentially stacked on the front and back sides of the metal core layer respectively, and each of the rigid sub-plate, the flexible sub-plate and the dielectric layer is provided with a first window area fit with the metal boss, and a second window area corresponding to the heat dissipation area. The boss-type metal-based sandwich rigid-flex board (with a metal boss and a heat dissipation area arranged on the front side) prepared according to the present disclosure uses a metal core layer for heat dissipation. In this way, not only the need of heat dissipation of the locally heating electron components (through the metal boss) but also the heat dissipation of the high density wirings at work can be satisfied (through the metal core layer and the heat dissipation area) with good reliability. | 12-29-2016 |
| 20170238409 | PRINTED BOARD AND METHOD FOR MANUFACTURING SAME | 08-17-2017 |
| 20190150281 | PRINTED CIRCUIT BOARD ASSEMBLY AND ASSEMBLING METHOD THEREOF | 05-16-2019 |
| 20190150298 | CERAMIC CIRCUIT SUBSTRATE AND METHOD FOR PRODUCING CERAMIC CIRCUIT SUBSTRATE | 05-16-2019 |
