1st Interview Questions-Qualcomm
1st Interview Questions-Qualcomm
-application of TCP and UDP -what is DC-HSDPA.. -what is HSPA+.. -digital modulation schems.. -what is iperf.. -what is rsrp.. -about TEMS..which window u have to see in tems.. Uttar 1) 2) 3) 4) Difference between wired and wireless Given analog signal, how you will send it to the destinations via wireless. Difference between 16QPSK & 16QAM What are the electronic components which will come when you transmit a signal from one end to another end (Wireless Medium) 5) What is 16 in 16QAM 6) What is AWGN 7) Explain your projects in detail.