INTEGRATED CIRCUITS

DATA SHEET

TJA1040 High speed CAN transceiver

Product specication Supersedes data of 2003 Feb 19 2003 Oct 14

Philips Semiconductors

Product specication

High speed CAN transceiver

FEATURES Fully compatible with the ISO 11898 standard High speed (up to 1 MBaud) Very low-current standby mode with remote wake-up capability via the bus Very low ElectroMagnetic Emission (EME) Differential receiver with high common-mode range for ElectroMagnetic Immunity (EMI) Transceiver in unpowered state disengages from the bus (zero load) Input levels compatible with 3.3 V and 5 V devices Voltage source for stabilizing the recessive bus level if split termination is used (further improvement of EME) At least 110 nodes can be connected Transmit Data (TXD) dominant time-out function Bus pins protected against transients in automotive environments Bus pins and pin SPLIT short-circuit proof to battery and ground Thermally protected. QUICK REFERENCE DATA SYMBOL VCC ICC VCANH VCANL VSPLIT Vesd PARAMETER supply voltage supply current DC voltage on pin CANH DC voltage on pin CANL DC voltage on pin SPLIT electrostatic discharge voltage CONDITIONS operating range standby mode 0 < VCC < 5.25 V; no time limit 0 < VCC < 5.25 V; no time limit 0 < VCC < 5.25 V; no time limit Human Body Model (HBM) pins CANH, CANL and SPLIT all other pins tPD(TXD-RXD) Tvj propagation delay TXD to RXD virtual junction temperature VSTB = 0 V 6 4 40 40 5 27 27 27 MIN. 4.75 GENERAL DESCRIPTION

TJA1040

The TJA1040 is the interface between the Controller Area Network (CAN) protocol controller and the physical bus. It is primarily intended for high speed applications, up to 1 MBaud, in passenger cars. The device provides differential transmit capability to the bus and differential receive capability to the CAN controller. The TJA1040 is the next step up from the TJA1050 high speed CAN transceiver. Being pin compatible and offering the same excellent EMC performance, the TJA1040 also features: An ideal passive behaviour when supply voltage is off A very low-current standby mode with remote wake-up capability via the bus. This makes the TJA1040 an excellent choice in nodes which can be in power-down or standby mode in partially powered networks.

MAX. 5.25 15 +40 +40 +40 +6 +4 255 +150

UNIT V A V V V kV kV ns C

ORDERING INFORMATION TYPE NUMBER TJA1040T TJA1040U PACKAGE NAME SO8 DESCRIPTION plastic small outline package; 8 leads; body width 3.9 mm bare die; die dimensions 1840 1440 380 m VERSION SOT96-1

2003 Oct 14

Philips Semiconductors

Product specication

High speed CAN transceiver

BLOCK DIAGRAM

TJA1040

handbook, full pagewidth

VCC 3

TXD

1 VCC

TIME-OUT & SLOPE

TEMPERATURE PROTECTION

V SPLIT

SPLIT

7 6

CANH CANL

STB

WAKE-UP MODE CONTROL

DRIVER

RXD

MUX

WAKE-UP FILTER

GND

TJA1040

MGU161

Fig.1 Block diagram.

PINNING SYMBOL TXD GND VCC RXD SPLIT CANL CANH STB PIN 1 2 3 4 5 6 7 8 DESCRIPTION transmit data input ground supply supply voltage receive data output; reads out data from the bus lines common-mode stabilization output LOW-level CAN bus line HIGH-level CAN bus line standby mode control input
MGU160

handbook, halfpage

TXD 1 GND 2

8 7

STB CANH CANL SPLIT

TJA1040T
VCC 3 RXD 4 6 5

Fig.2 Pin configuration.

2003 Oct 14

Philips Semiconductors

Product specication

High speed CAN transceiver

FUNCTIONAL DESCRIPTION Operating modes The TJA1040 provides two modes of operation which are selectable via pin STB. See Table 1 for a description of the modes of operation. Table 1 MODE normal standby Operating modes PIN STB LOW HIGH PIN RXD LOW bus dominant HIGH bus recessive

TJA1040
to the centre tap of the split termination (see Fig.4). In case of a recessive bus voltage <0.5VCC due to the presence of an unsupplied transceiver in the network with a significant leakage current from the bus lines to ground, the split circuit will stabilize this recessive voltage to 0.5VCC. So a start of transmission does not cause a step in the common-mode signal which would lead to poor ElectroMagnetic Emission (EME) behaviour. Wake-up In the standby mode the bus lines are monitored via a low-power differential comparator. Once the low-power differential comparator has detected a dominant bus level for more than tBUS, pin RXD will become LOW. Over-temperature detection The output drivers are protected against over-temperature conditions. If the virtual junction temperature exceeds the shutdown junction temperature Tj(sd), the output drivers will be disabled until the virtual junction temperature becomes lower than Tj(sd) and TXD becomes recessive again. By including the TXD condition, the occurrence of output driver oscillation due to temperature drifts is avoided. TXD dominant time-out function A TXD dominant time-out timer circuit prevents the bus lines from being driven to a permanent dominant state (blocking all network communication) if pin TXD is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on pin TXD. If the duration of the LOW level on pin TXD exceeds the internal timer value (tdom), the transmitter is disabled, driving the bus lines into a recessive state. The timer is reset by a positive edge on pin TXD. The TXD dominant time-out time tdom defines the minimum possible bit rate of 40 kBaud. Fail-safe features Pin TXD provides a pull-up towards VCC in order to force a recessive level in case pin TXD is unsupplied. Pin STB provides a pull-up towards VCC in order to force the transceiver into standby mode in case pin STB is unsupplied. In the event that the VCC is lost, pins TXD, STB and RXD will become floating to prevent reverse supplying conditions via these pins.

wake-up request no wake-up detected request detected

NORMAL MODE In this mode the transceiver is able to transmit and receive data via the bus lines CANH and CANL. See Fig.1 for the block diagram. The differential receiver converts the analog data on the bus lines into digital data which is output to pin RXD via the multiplexer (MUX). The slope of the output signals on the bus lines is fixed and optimized in a way that lowest ElectroMagnetic Emission (EME) is guaranteed. STANDBY MODE In this mode the transmitter and receiver are switched off, and the low-power differential receiver will monitor the bus lines. A HIGH level on pin STB activates this low-power receiver and the wake-up filter, and after tBUS the state of the CAN bus is reflected on pin RXD. The supply current on VCC is reduced to a minimum in such a way that ElectroMagnetic Immunity (EMI) is guaranteed and a wake-up event on the bus lines will be recognized. In this mode the bus lines are terminated to ground to reduce the supply current (ICC) to a minimum. A diode is added in series with the high-side driver of RXD to prevent a reverse current from RXD to VCC in the unpowered state. In normal mode this diode is bypassed. This diode is not bypassed in standby mode to reduce current consumption. Split circuit Pin SPLIT provides a DC stabilized voltage of 0.5VCC. It is turned on only in normal mode. In standby mode pin SPLIT is floating. The VSPLIT circuit can be used to stabilize the recessive common-mode voltage by connecting pin SPLIT

2003 Oct 14

Philips Semiconductors

Product specication

High speed CAN transceiver

LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VCC VTXD VRXD VSTB VCANH VCANL VSPLIT Vtrt Vesd PARAMETER supply voltage DC voltage on pin TXD DC voltage on pin RXD DC voltage on pins STB DC voltage on pin CANH DC voltage on pin CANL DC voltage on pin SPLIT transient voltages on pins CANH, CANL and SPLIT electrostatic discharge voltage 0 < VCC < 5.25 V; no time limit 0 < VCC < 5.25 V; no time limit 0 < VCC < 5.25 V; no time limit according to ISO 7637; see Fig.5 Human Body Model (HBM); note 1 pins CANH and CANL and SPLIT all other pins Machine Model (MM); note 2 Tvj Tstg Notes 1. Equivalent to discharging a 100 pF capacitor via a 1.5 k series resistor. virtual junction temperature storage temperature note 3 6 4 200 40 55 +6 +4 +200 +150 +150 CONDITIONS no time limit operating range MIN. 0.3 4.75 0.3 0.3 0.3 27 27 27 200

TJA1040

MAX. +6 5.25 V V

UNIT

VCC + 0.3 V VCC + 0.3 V VCC + 0.3 V +40 +40 +40 +200 V V V V

kV kV V C C

2. Equivalent to discharging a 200 pF capacitor via a 0.75 H series inductor and a 10 series resistor. 3. Junction temperature in accordance with IEC 60747-1. An alternative definition of Tvj is: Tvj = Tamb + P Rth(vj-amb), where Rth(vj-amb) is a fixed value to be used for the calculating of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient temperature (Tamb). THERMAL CHARACTERISTICS In accordance with IEC 60747-1. SYMBOL Rth(vj-a) Rth(vj-s) PARAMETER thermal resistance from virtual junction to ambient in SO8 package thermal resistance from virtual junction to substrate of bare die CONDITIONS in free air in free air VALUE 145 50 UNIT K/W K/W

QUALITY SPECIFICATION Quality specification in accordance with AEC-Q100.

2003 Oct 14

Philips Semiconductors

Product specication

High speed CAN transceiver

TJA1040

CHARACTERISTICS VCC = 4.75 to 5.25 V, Tvj = 40 to +150 C and RL = 60 unless specied otherwise; all voltages are dened with respect to ground; positive currents ow into the IC; note 1. SYMBOL Supply (pin VCC) ICC supply current standby mode normal mode recessive; VTXD = VCC dominant; VTXD = 0 V Transmit data input (pin TXD) VIH VIL IIH IIL Ci VIH VIL IIH IIL VOH IOH IOL VO IL HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current input capacitance VTXD = VCC normal mode; VTXD = 0 V not tested 2 0.3 5 100 2 0.3 VSTB = VCC VSTB = 0 V standby mode; IRXD = 100 A normal mode; VRXD = VCC 0.4 V VRXD = 0.4 V normal mode; 500 A < IO < +500 A standby mode; 22 V < VSPLIT < +35 V VTXD = 0 V pin CANH pin CANL VO(dom)(m) VO(dif)(bus) matching of dominant output voltage (VCC - VCANH - VCANL) differential bus output voltage (VCANH VCANL) VTXD = 0 V; dominant; 45 < RL < 65 VTXD = VCC; recessive; no load 3 0.5 100 1.5 50 3.6 1.4 0 4.25 1.75 +150 3.0 +50 V V mV V mV 1 0 200 5 0 4 VCC + 0.3 V +0.8 +5 300 10 V A A pF 2.5 30 5 50 10 70 mA mA 5 10 15 A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Standby mode control input (pin STB) HIGH-level input voltage LOW-level input voltage HIGH-level input current LOW-level input current VCC + 0.3 V +0.8 10 V A A

Receive data output (pin RXD) HIGH-level output voltage HIGH-level output current LOW-level output current VCC 1.1 VCC 0.7 VCC 0.4 V 0.1 2 0.4 6 1 12 mA mA

Common-mode stabilization output (pin SPLIT) output voltage leakage current 0.3VCC 0.5VCC 0 0.7VCC 5 V A

Bus lines (pins CANH and CANL) VO(dom) dominant output voltage

2003 Oct 14

Philips Semiconductors

Product specication

High speed CAN transceiver

TJA1040

SYMBOL VO(reces)

PARAMETER recessive output voltage

CONDITIONS normal mode; VTXD = VCC; 2 no load standby mode; no load

MIN.

TYP. 0.5VCC 0 70 70 3

MAX.

UNIT V V mA mA mA

0.1 40 2.5

+0.1 95 100 +2.5

IO(sc)

short-circuit output current

VTXD = 0 V pin CANH; VCANH = 0 V pin CANL; VCANL = 40 V 40

IO(reces) Vdif(th)

recessive output current differential receiver threshold voltage

27 V < VCAN < +32 V 12 V < VCANL < +12 V; 12 V < VCANH < +12 V

normal mode (see Fig.6) 0.5 standby mode Vhys(dif) differential receiver hysteresis voltage input leakage current common-mode input resistance common-mode input resistance matching differential input resistance common-mode input capacitance differential input capacitance normal mode; 12 V < VCANL < +12 V; 12 V < VCANH < +12 V VCC = 0 V; VCANH = VCANL = 5 V standby or normal mode VCANH = VCANL standby or normal mode VTXD = VCC; not tested VTXD = VCC; not tested normal mode 0.4 50

0.7 0.7 70

0.9 1.15 100

V V mV

ILI Ri(cm) Ri(cm)(m) Ri(dif) Ci(cm) Ci(dif) td(TXD-BUSon) td(TXD-BUSoff) td(BUSon-RXD) td(BUSoff-RXD) tPD(TXD-RXD) tdom(TXD) tBUS td(stb-norm)

5 15 3 25 25 10 15 35 40 300 0.75 5

0 25 0 50 70 50 65 100 600 1.75 7.5

+5 35 +3 75 20 10

A k % k pF pF

Timing characteristics; see Fig.8 delay TXD to bus active delay TXD to bus inactive delay bus active to RXD delay bus inactive to RXD propagation delay TXD to RXD VSTB = 0 V TXD dominant time-out dominant time for wake-up via bus delay standby mode to normal mode VTXD = 0 V standby mode normal mode 110 95 115 160 255 1000 5 10 ns ns ns ns ns s s s

Thermal shutdown Tj(sd) Note 1. All parameters are guaranteed over the virtual junction temperature range by design, but only 100% tested at 125 C ambient temperature for dies on wafer level, and in addition to this 100% tested at 25 C ambient temperature for cased products; unless specied otherwise. For bare dies, all parameters are only guaranteed with the backside of the die connected to ground. shutdown junction temperature 155 165 180 C

2003 Oct 14

Philips Semiconductors

Product specication

High speed CAN transceiver

APPLICATION AND TEST INFORMATION

TJA1040

handbook, full pagewidth

BAT

5V VCC CANH 7 3 8 STB Port x VCC

TJA1040
SPLIT 5 4 CANL 6 2 1 RXD TXD MICROCONTROLLER

RXD TXD
MGU164

More application information is available in a separate application note.

Fig.3 Typical application for 5 V microcontroller.

handbook, full pagewidth

VCC

TJA1040
CANH R VSPLIT = 0.5VCC in normal mode; otherwise floating R CANL SPLIT 60 60

MGU162

GND

Fig.4 Stabilization circuitry and application.

2003 Oct 14

Philips Semiconductors

Product specication

High speed CAN transceiver

TJA1040

handbook, full pagewidth

+5 V 47 F 100 nF VCC TXD 3 1 7 CANH 1 nF TRANSIENT GENERATOR

500 kHz RXD

TJA1040
4 2 8 GND

6 5

CANL SPLIT

1 nF

15 pF

STB
MGW336

The waveforms of the applied transients will be in accordance with ISO 7637 part 1, test pulses 1, 2, 3a, 3b, 5, 6 and 7.

Fig.5 Test circuit for automotive transients.

handbook, full pagewidth

MGS378

VRXD HIGH

LOW hysteresis 0.5 0.9 Vi(dif)(bus) (V)

Fig.6 Hysteresis of the receiver.

2003 Oct 14

Philips Semiconductors

Product specication

High speed CAN transceiver

TJA1040

handbook, full pagewidth

+5 V 47 F 100 nF VCC TXD 3 1 7 SPLIT 5 CANH RL 60 CL 100 pF

TJA1040
6 CANL

RXD

4 2 8 GND STB
MGW335

15 pF

Fig.7 Test circuit for timing characteristics.

handbook, full pagewidth

HIGH TXD LOW

CANH CANL dominant (BUS on) 0.9 V Vi(dif)(bus)

(1)

0.5 V recessive (BUS off) HIGH RXD t d(TXD-BUSon) t d(BUSon-RXD) t PD(TXD-RXD) (1) Vi(dif)(bus) = VCANH VCANL. t PD(TXD-RXD) 0.3VCC 0.7VCC LOW t d(TXD-BUSoff) t d(BUSoff-RXD)
MGS377

Fig.8 Timing diagram.

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Philips Semiconductors

Product specication

High speed CAN transceiver

BONDING PAD LOCATIONS COORDINATES(1) SYMBOL TXD GND VCC RXD SPLIT CANL CANH STB Note 1. All x/y coordinates represent the position of the centre of each pad (in m) with respect to the left hand bottom corner of the top aluminium layer (see Fig.9). PAD x 1 2 3 4 5 6 7 8 119.5 648.5 1214.25 1635.25 1516.5 990.5 530.25 113.75 y 114.5 85 114.5 114.5 1275 1273.75 1273.75 1246
x 0 0 y
handbook, halfpage

TJA1040

test pad 1

TJA1040U
test pad 2

4
MBL584

The backside of the bare die must be connected to ground.

Fig.9 Bonding pad locations.

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Philips Semiconductors

Product specication

High speed CAN transceiver

PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm

TJA1040

SOT96-1

A X

c y HE v M A

Z 8 5

Q A2 A1 pin 1 index Lp 1 e bp 4 w M L detail X (A 3) A

2.5 scale

5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3

0.010 0.057 0.069 0.004 0.049

0.019 0.0100 0.014 0.0075

0.244 0.039 0.028 0.041 0.228 0.016 0.024

0.028 0.004 0.012

8 0o

Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03 JEDEC MS-012 JEITA EUROPEAN PROJECTION

ISSUE DATE 99-12-27 03-02-18

2003 Oct 14

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Philips Semiconductors

Product specication

High speed CAN transceiver

SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: below 220 C (SnPb process) or below 245 C (Pb-free process) for all BGA and SSOP-T packages for packages with a thickness 2.5 mm for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. below 235 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. Manual soldering

TJA1040
To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch (e): larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.

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Philips Semiconductors

Product specication

High speed CAN transceiver

Suitability of surface mount IC packages for wave and reow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(5), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP PMFP(8) Notes not suitable not suitable(4)

TJA1040

SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable not suitable

suitable not not recommended(5)(6) recommended(7)

not suitable

1. For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Hot bar or manual soldering is suitable for PMFP packages. REVISION HISTORY REV 6 DATE 20031014 CPCN 200307014 Modication: Change Vth(dif) = 0.5 V in standby mode into Vdif(th) = 0.4 V Add Chapter REVISION HISTORY 5 20030219 Product specication (9397 750 10887) DESCRIPTION Product specication (9397 750 11837)

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Philips Semiconductors

Product specication

High speed CAN transceiver

DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION

TJA1040

This data sheet contains data from the objective specication for product development. Philips Semiconductors reserves the right to change the specication in any manner without notice. This data sheet contains data from the preliminary specication. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specication without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specication. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN).

II

Preliminary data Qualication

III

Product data

Production

Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status Production), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

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Philips Semiconductors

Product specication

High speed CAN transceiver

Bare die All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety (90) days from the date of Philips' delivery. If there are data sheet limits not guaranteed, these will be separately indicated in the data sheet. There are no post packing tests performed on individual die or wafer. Philips Semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. It is the responsibility of the customer to test and qualify their application in which the die is used.

TJA1040

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Philips Semiconductors a worldwide company

Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Koninklijke Philips Electronics N.V. 2003

SCA75

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

R16/06/pp17

Date of release: 2003

Oct 14

Document order number:

9397 750 11837

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