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    AG 806.silver Epoxy

    Uploaded by

    Chad Cuares
    1. AG 806 is a one-part silver conductive epoxy adhesive that can be cured at high temperatures between 130-150C. 2. It has applications for bonding IC chips and general electrical connections due to its good electrical and thermal conductivity as well as adhesion properties. 3. The silver epoxy can be dispensed or printed on circuit boards and devices, then cured for 30-45 minutes at 150C or longer at lower temperatures.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd

    AG 806.silver Epoxy

    Uploaded by

    Chad Cuares
    151 views1 page
    1. AG 806 is a one-part silver conductive epoxy adhesive that can be cured at high temperatures between 130-150C. 2. It has applications for bonding IC chips and general electrical connections due to its good electrical and thermal conductivity as well as adhesion properties. 3. The silver epoxy can be dispensed or printed on circuit boards and devices, then cured for 30-45 minutes at 150C or longer at lower temperatures.

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    AG 806.Silver Epoxy

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    © Attribution Non-Commercial (BY-NC)

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    1. AG 806 is a one-part silver conductive epoxy adhesive that can be cured at high temperatures between 130-150C. 2. It has applications for bonding IC chips and general electrical connections due to its good electrical and thermal conductivity as well as adhesion properties. 3. The silver epoxy can be dispensed or printed on circuit boards and devices, then cured for 30-45 minutes at 150C or longer at lower temperatures.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    151 views1 page

    AG 806.silver Epoxy

    Uploaded by

    Chad Cuares
    1. AG 806 is a one-part silver conductive epoxy adhesive that can be cured at high temperatures between 130-150C. 2. It has applications for bonding IC chips and general electrical connections due to its good electrical and thermal conductivity as well as adhesion properties. 3. The silver epoxy can be dispensed or printed on circuit boards and devices, then cured for 30-45 minutes at 150C or longer at lower temperatures.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
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    PENCHEM AG 806

    Silver Epoxy
    Description
    AG 806 is a one-part silver conductive adhesive based on epoxy resins. It can be cured and hardened at
    high temperatures. It is formulated for very good electrical and thermal conductive properties. It is
    solvent-free, has little volatiles during cure and very low shrinkage. It has great adhesion and good
    thermal shock performance.

    Applications
    1. Bonding IC chip to metal bond pad
    2. General electrical connections

    Guidelines for Use


    1. Thaw the silver epoxy to room temperature (25ºC) before use.
    2. The silver epoxy may be printed or dispensed on printed circuit boards, semiconductor elements,
    electrodes or for other connections that require conductivity.
    3. The silver epoxy can be cured at 150ºC in 30 minutes.

    Properties
    Property Unit Typical Value
    Chemical type Epoxy
    Appearance Silver paste
    Mix ratio, by weight One component
    Shelf life, -20ºC Month 6
    Pot life, 25ºC Hour 48
    Viscosity, Brookfield RVT, 25ºC cP 54,000
    Hardness, cured 150ºC for 1 hr Shore D 75
    Shear strength kgcm-2 166
    Electrical conductivity ohm.cm 0.0001
    Glass transition temperature, Tg ºC 80
    Coef. thermal expansion, alpha-1 4.5 x 10-5
    mm-1ºC-1
    alpha-2 2.2 x 10-4
    Conducting medium; Content by weight % Silver; 70%
    Solids content % 100

    Recommended Cure
    Temperature Gel Time Cure Time
    130ºC -- 45 min
    150ºC -- 30 min

    Storage
    Tightly close original container of unused product and store it at below -20ºC. Storing at lower
    temperatures down to - 40°C may prolong shelf life beyond 6 months. However it may take longer time to
    thaw the product.

    Environment, Health & Safety


    This product is RoHS compliant. It does not contain any known carcinogenic, mutagenic or teratogenic
    component.

    Packaging
     5 ml syringe
     10 ml syringe
     500 g jar

    Revision 31 Dec 2009

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