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    Tong Hsing Mr. Ru 092112DL

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    denghuei
    Tong Hsing is a Taiwanese electronics manufacturing company with over 30 years of experience in microelectronic packaging. The presentation outlines Tong Hsing's company profile and facilities, business strategies focused on customer satisfaction and quality, and involvement in MEMS packaging for applications such as digital light processing, printheads, microphones, gyros, and medical devices. Tong Hsing seeks to leverage its expertise through long-term partnerships and niche markets with high barriers to entry.

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    Tong Hsing Mr. Ru 092112DL

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    denghuei
    246 views23 pages
    Tong Hsing is a Taiwanese electronics manufacturing company with over 30 years of experience in microelectronic packaging. The presentation outlines Tong Hsing's company profile and facilities, business strategies focused on customer satisfaction and quality, and involvement in MEMS packaging for applications such as digital light processing, printheads, microphones, gyros, and medical devices. Tong Hsing seeks to leverage its expertise through long-term partnerships and niche markets with high barriers to entry.

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    5. Tong Hsing Mr. Ru 092112DL

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    Tong Hsing is a Taiwanese electronics manufacturing company with over 30 years of experience in microelectronic packaging. The presentation outlines Tong Hsing's company profile and facilities, business strategies focused on customer satisfaction and quality, and involvement in MEMS packaging for applications such as digital light processing, printheads, microphones, gyros, and medical devices. Tong Hsing seeks to leverage its expertise through long-term partnerships and niche markets with high barriers to entry.

    Copyright:

    Attribution Non-Commercial (BY-NC)
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    246 views23 pages

    Tong Hsing Mr. Ru 092112DL

    Uploaded by

    denghuei
    Tong Hsing is a Taiwanese electronics manufacturing company with over 30 years of experience in microelectronic packaging. The presentation outlines Tong Hsing's company profile and facilities, business strategies focused on customer satisfaction and quality, and involvement in MEMS packaging for applications such as digital light processing, printheads, microphones, gyros, and medical devices. Tong Hsing seeks to leverage its expertise through long-term partnerships and niche markets with high barriers to entry.

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    MEMS Packaging Update

    Experience Sharing from Tong Hsing


    Present by: Heinz Ru

    Presentation Outline

    Tong Hsing Company Profile Tong Hsing Business Strategy and Business Model Tong Hsings Involvement in MEMS packaging
    DMD Printhead Airflow Microphone Gyro Medical MEMS

    Presentation Outline

    Tong Hsing Company Profile Tong Hsing Business Strategy and Business Model Tong Hsings Involvement in MEMS packaging
    DMD Printhead Airflow Microphone Gyro Medical MEMS

    Company Status
    Taipei
    Address
    55 Lane 365, Yingtao Rd., Yingko, New Taipei City, 239 Taiwan

    Chung-Li
    8F,No. 27, Ji-Lin Rd., Chung-Li Industry Park, Tao-Yuan Hsien, 320 Taiwan

    Philippine Plant I
    Lot 15 Road 3 Cermelray Indl Park Canlubang, Calamba City, Philippines

    Philippine Plant II
    103 Prosperity Ave., Carmelray Indl Park Canlubang, Calamba City, Philippines

    Established Area

    August 1975 Land: 138,000 sq.ft. Bldg: 224,455 sq.ft. Bldg: 58,982 sq.ft. 425 886-3-433-5998 886-3-433-5995

    September 1994 Land: 80,700 sq.ft. Bldg: 71,866 sq.ft.

    April 2008 Land : 325,000 sq.ft. Bldg : 195,000 sq.ft.

    Employees Tel: Fax: Web Site: Email:

    811 886-2-2679-0122 886-2-2670-0122 www.theil.com

    634 63-49-549-2952 63-49-549-2940 www.tonghsing.ph info@net.tonghsing.ph

    859

    Chiashychang@mail.theil.com.tw Sophia_chen@mail.theil.com.tw

    Products and Services

    Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film/Thin Film Substrate Fabrication.

    RF Modules for Cellular Handsets, WLAN, and WiMax SiP Packaging for WLAN, UWB, and PAN MEMS Packaging CMOS Image Sensor Packaging Reconstruction Wafer Chip Probing and Final Test PCB assembly with SMT and/or COB Processes Automotive Hybrids Thin Film on Alumina and AlN Thick Film on Alumina DBC on Alumina and AlN

    Significant Achievements
    1974 1976 1977 1979 1986 1989 1993 1993 1994 1995 1996 1997 1998 1999 2001 2002 2006 2007 2008 2009 2010 2011 2012 Tong Hsing Established Started Production of Alumina Ceramic Substrates Started Production of Thick Film Print and Fire Started Production of Hybrid Modules Shipped 500K Modules of Electronic Fuse Received IECQ Manufacturer Approval Started Large Scale Production of Thick Film Copper Process Received ISO-9002 Certification Established Tong Hsing Electronics (Philippines) Inc. Started Production of Photo-Sensitive Thick Film Circuits Established CIM System to Track the WIP through LAN Started Mass Production of CDMA Power Amplifier Modules Received QS-9000/ISO-9001 Certification Started Mass Production of GSM Power Amplifier Modules Started Production of Thin Film DPC Substrate Fabrication Received ISO14000 Certification Received TS16949 and OHSAS 18001 Certification IPO at Taiwan Stock Exchange on Nov.15th Won the Excellent Enterprise Innovation Award from MOEA (Ministry of Economic Affairs) Received AS9100 Certification. Acquired Impac to form a new Image Sensor Group Achieved 0 ppm for All Products Shipped to Automotive Customers for two consecutive years. Sony Green Partners ~ Certification Received; Full manufacturing approval was granted by both a well-known German and Japanese Auto Parts Manufacturer for Luxury Cars 2012 Acquired DBC Production, Process, Know-how, and IP from HCS

    s rehtO egam I cima reC di rbyH FR

    sr ehtO eg amI cim ar eC dirbyH FR

    0102 0102 0102 0102

    %82 dirbyH srehtO egamI cimareC dirbyH FR %62 FR


    2009

    srehtO egamI cimareC dirbyH FR

    2008

    %6 %0 srehtO egamI

    Ceramic 22%

    Image Others 0% 2%

    Product Segments

    RF 45%

    %04 cimareC

    Image 23%

    Hybrid 31%

    Ceramic 40% Others 2% RF 19% Hybrid 16%

    Image 27%

    Others 2%

    Ceramic 44% RF 14% Hybrid 13% 2011

    Sales History
    250,000 200,000 150,000 100,000 50,000 0

    2004

    2005

    2006

    2007

    2008

    2009

    2010

    2011

    Unit: USD$/K

    Capital Expenditure
    Comparison 2004 through 2011
    Millions US$

    45,000 40,000 35,000 30,000 25,000 20,000 15,000 10,000 5,000 0 2004 2005 2006 2007 2008 2009 2010 2011
    Unit: USD$/K

    Major Strengths

    Flexibility Technical Innovation Continuous Improvement & Growth Excellent High Volume Production Capacity Superior Supporting Infrastructure in Northern Taiwan Abundant Supply of Human Resources for Semiconductor Packaging in the Philippines Superb Customer Satisfaction Strong R & D Partners

    Market Sales by Region


    Europe: 27%

    Asia: 8%

    N. America: 63%

    Taiwan: 2%

    Our Focus

    Customer Satisfaction Quality Turnaround/Delivery Time Productivity

    Presentation Outline

    Tong Hsing Company Profile Tong Hsing Business Strategy and Business Model Tong Hsings Involvement in MEMS packaging
    DMD Printhead Airflow Microphone Gyro Medical MEMS

    Business Model
    Niche market High entry barrier Long development cycle Leverage Tong Hsings experience accumulated over the past 30 years Build up long term relationship with the technology partners

    Business Strategy

    Speed Quality - Capacity Leading the way in Technology Partnership with our customers

    Growth Strategies & Opportunities


    Tong Hsings major business at present: RF Front Module and PA Module for Handsets & WLAN Base Station Modules SiP for WLAN, UWB, GPS and Bluetooth MEMS packaging Thin Film Substrate for power LED & next gen high end memory Thick Film Substrates & Hybrids for automotive industry CPV Solar Cell Packaging Fuel Cell Technology Business Commercial Aircraft(compliant to DO-254) Image Products Advanced Power Semiconductor Military Hybrid 3D IC & TSV Packaging Bio-Medical QFN Technology Laser Thermoelectric Cooler

    MEMS Packaging - Potential Opportunities


    1. DLP project 2. Silicon Microphone 3. Accelerometer and Gyro 4. RF MEMS Switch 5. Micro Display 6. Hearing Aids Modules with DPC 7. MEMS Time Units 8. MEMS Microvalve Technology 9. Fingerprint Sensor 10. TH GGI Process 11. TH MEMS Cavity Packaging

    Presentation Outline

    Tong Hsing Company Profile Tong Hsing Business Strategy and Business Model Tong Hsings Involvement in MEMS packaging
    DMD Printhead Airflow Microphone Gyro Medical MEMS

    Presentation Outline

    Tong Hsing Company Profile Tong Hsing Business Strategy and Business Model Tong Hsings Involvement in MEMS packaging
    DMD Printhead Airflow Microphone Gyro Medical MEMS

    Presentation Outline

    Tong Hsing Company Profile Tong Hsing Business Strategy and Business Model Tong Hsings Involvement in MEMS packaging
    DMD Printhead Airflow Microphone Gyro Medical MEMS

    Presentation Outline

    Tong Hsing Company Profile Tong Hsing Business Strategy and Business Model Tong Hsings Involvement in MEMS packaging
    DMD Printhead Airflow Microphone Gyro Medical MEMS

    Presentation Outline

    Tong Hsing Company Profile Tong Hsing Business Strategy and Business Model Tong Hsings Involvement in MEMS packaging
    DMD Printhead Airflow Microphone Gyro Medical MEMS

    THE END THANK YOU FOR YOUR LISTENING!!

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