HT27LC020

CMOS 256K´8-Bit OTP EPROM

Features
· Operating voltage: +3.3V · 256K´8-bit organization
· Programming voltage · Fast read access time: 90ns
- VPP=12.5V±0.2V · Fast programming algorithm
- VCC=6.0V±0.2V · Programming time 75ms typ.
· High-reliability CMOS technology
· Two line controls (OE and CE)
· Latch-up immunity to 100mA from -1.0V to
· Standard product identification code
VCC+1.0V
· Commercial temperature ranges (0°C to +70°C)
· CMOS and TTL compatible I/O
· 32-pin DIP/SOP/TSOP/PLCC package
· Low power consumption
- Active: 15mA max.
- Standby: 1mA typ.

General Description
The HT27LC020 chip family is a low-power, 2048K with respect to Spec. This eliminates the need for WAIT
(2,097,152) bit, +3.3V electrically one-time programma- states in high-performance microprocessor systems.
ble (OTP) read-only memories (EPROM). Organized The HT27LC020 has separate Output Enable (OE) and
into 256K words with 8 bits per word, it features a fast Chip Enable (CE) controls which eliminate bus conten-
single address location programming, typically at 75ms tion issues.
per byte. Any byte can be accessed in less than 90ns

Block Diagram

R o w
X -D e c o d e r C e ll A r r a y
A d d re s s

V C C
C o lu m n G N D
A d d re s s Y -D e c o d e r Y - G a tin g
V P P

C E C E & O E & S A C K T
O E P G M & T E S T & D Q 0 ~ D Q 7
P G M C o n tr o l L o g ic O u tp u t B u ffe r

Rev. 1.40 1 November 21, 2002

 HT27LC020

Pin Assignment

V P P 1 3 2 V C C
A 1 6 2 3 1 P G M

P G M
V C C
V P P
A 1 2
A 1 5
A 1 6

A 1 7
A 1 5 3 3 0 A 1 7

3 0
3 2
3 1
4
3
2
1
A 1 2 4 2 9 A 1 4
A 7 5 2 8 A 1 3 A 1 1 1 3 2 O E
A 7 5 2 9 A 1 4 A 9 2 3 1 A 1 0
A 6 6 2 7 A 8 A 6 6 2 8 A 1 3 A 8 3 3 0 C E
A 5 7 2 7 A 1 3 4 2 9 D Q 7
A 5 7 2 6 A 9 A 8 2 8
A 1 4 5 D Q 6
A 4 8 2 6 A 9 A 1 7 6 2 7 D Q 5
A 4 8 2 5 A 1 1 H T 2 7 L C 0 2 0
A 3 9 2 5 A 1 1 P G M 7 2 6 D Q 4
A 3 9 2 4 O E
A 2 1 0 3 2 P L C C -A 2 4 O E
V C C 8 H T 2 7 L C 0 2 0 2 5 D Q 3
V P P 9 2 4 G N D
A 2 1 0 2 3 A 1 0 A 1 1 1 2 3 A 1 0 A 1 6 1 0 3 2 T S O P -A 2 3 D Q 2
A 1 1 1 2 2 C E A 0 1 2 2 2 C E A 1 5 1 1 2 2 D Q 1
A 1 2 1 2 2 1 D Q 0
A 0 1 2 2 1 D Q 7 D Q 0 1 3 2 1 D Q 7 A 7 2 0 A 0
1 3
A 6 1 4 1 9 A 1
D Q 0 1 3 2 0 D Q 6 A 5 1 5 1 8 A 2

1 4
1 5
1 6
1 7
1 8
1 9
2 0
D Q 1 1 4 1 9 D Q 5 A 4 1 6 1 7 A 3

G N D
D Q 1
D Q 2

D Q 3
D Q 4
D Q 5
D Q 6
D Q 2 1 5 1 8 D Q 4
G N D 1 6 1 7 D Q 3

H T 2 7 L C 0 2 0
3 2 D IP -A /S O P -A

Pin Description
Pin Name I/O/C/P Description

A0~A17 I Address inputs

DQ0~DQ7 I/O Data inputs/outputs

CE C Chip enable

OE C Output enable

PGM C Program strobe

NC ¾ No connection

VPP P Program voltage supply

Absolute Maximum Rating

Operation Temperature Commercial ............................................................................................................0°C to 70°C
Storage Temperature.............................................................................................................................-65°C to 125 °C
Applied VCC Voltage with Respect to GND............................................................................................... -0.6V to 7.0V
Applied Voltage on Input Pin with Respect to GND.................................................................................... -0.6V to 7.0V
Applied Voltage on Output Pin with Respect to GND......................................................................... -0.6V to VCC+0.5V
Applied Voltage on A9 Pin with Respect to GND ..................................................................................... -0.6V to 13.5V
Applied VPP Voltage with Respect to GND ..............................................................................................-0.6V to 13.5V
Applied READ Voltage (Functionality is guaranteed between these limits) ..................................................3.0V to 3.6V

Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those
listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil-
ity.

Rev. 1.40 2 November 21, 2002

 HT27LC020

D.C. Characteristics
Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VCC Conditions
Read operation
VOH Output High Level 3.3V IOH=-0.4mA 2.4 ¾ ¾ V
VOL Output Low Level 3.3V IOL=2.0mA ¾ ¾ 0.45 V
VIH Input High Level 3.3V ¾ 2.0 ¾ VCC+0.5 V
VIL Input Low Level 3.3V ¾ -0.3 ¾ 0.8 V
ILI Input Leakage Current 3.3V VIN=0 to 3.6V -5 ¾ 5 mA
ILO Output Leakage Current 3.3V VOUT=0 to 3.6V -10 ¾ 10 mA
CE=VIL, f=5MHz,
ICC VCC Active Current 3.3V ¾ ¾ 15 mA
IOUT=0mA
ISB1 Standby Current (CMOS) 3.3V CE=VCC±0.3V ¾ 1.0 10 mA
ISB2 Standby Current (TTL) 3.3V CE=VIH ¾ ¾ 0.6 mA
VPP Read/Standby
IPP 3.3V CE=OE=VIL, VPP=VCC ¾ ¾ 100 mA
Current
Programming operation
VOH Output High Level 6V IOH=-0.4mA 2.4 ¾ ¾ V
VOL Output Low Level 6V IOL=2.0mA ¾ ¾ 0.45 V
VIH Input High Level 6V ¾ 0.7VCC ¾ VCC+0.5 V
VIL Input Low Level 6V ¾ -0.5 ¾ 0.8 V
ILI Input Load Current 6V VIN=VIL, VIH ¾ ¾ 5.0 mA
VH A9 Product ID Voltage 6V ¾ 11.5 ¾ 12.5 V
ICC VCC Supply Current 6V ¾ ¾ ¾ 40 mA
IPP VPP Supply Current 6V CE=VIL ¾ ¾ 10 mA
Capacitance
CIN Input Capacitance 3.3V VIN=0V ¾ 8 12 pF
COUT Output Capacitance 3.3V VOUT=0V ¾ 8 12 pF
CVPP VPP Capacitance 3.3V VPP=0V ¾ 18 25 pF

A.C. Characteristics Ta=+25°C±5°C

Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VCC Conditions
Read operation
tACC Address to Output Delay 3.3V CE=OE=VIL ¾ ¾ 90 ns
tCE Chip Enable to Output Delay 3.3V OE=VIL ¾ ¾ 90 ns
tOE Output Enable to Output Delay 3.3V CE=VIL ¾ ¾ 45 ns
CE or OE High to Output Float, Whichever
tDF 3.3V ¾ ¾ ¾ 40 ns
Occurred First
Output Hold from Address, CE or OE,
tOH 3.3V ¾ 0 ¾ ¾ ns
Whichever Occurred First

Rev. 1.40 3 November 21, 2002

 HT27LC020

Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VCC Conditions
Programming operation
tAS Address Setup Time 6V ¾ 2 ¾ ¾ ms
tOES OE Setup Time 6V ¾ 2 ¾ ¾ ms
tDS Data Setup Time 6V ¾ 2 ¾ ¾ ms
tAH Address Hold Time 6V ¾ 0 ¾ ¾ ms
tDH Data Hold Time 6V ¾ 2 ¾ ¾ ms
tDFP Output Enable to Output Float Delay 6V ¾ 0 ¾ 130 ns
tVPS VPP Setup Time 6V ¾ 2 ¾ ¾ ms
tPW PGM Program Pulse Width 6V ¾ 30 75 105 ms
tVCS VCC Setup Time 6V ¾ 2 ¾ ¾ ms
tCES CE Setup Time 6V ¾ 2 ¾ ¾ ms
tOE Data Valid from OE 6V ¾ ¾ ¾ 150 ns
tPRT VPP Pulse Rise Time During Programming 6V ¾ 2 ¾ ¾ ms

Test waveforms and measurements

2 .4 V
2 .0 V A C
A C D r iv in g
M e a s u re m e n t
L e v e ls
L e v e l
0 .8 V
0 .4 5 V

tR, tF<20ns (10% to 90%)

Output test load

1 .3 V

(1 N 9 1 4 )

3 .3 k 9

O u tp u t P in
C L

Note: CL=100pF including jig capacitance.

Product Identification Code

Pins Hex
Code
A0 A1 DQ7 DQ6 DQ5 DQ4 DQ3 DQ2 DQ1 DQ0 Data

Manufacturer 0 1 0 0 0 1 1 1 0 0 1C
Device Type 1 1 0 0 0 0 0 0 1 0 02
0 0 0 1 1 1 1 1 1 1 7F
Continuation
1 0 0 1 1 1 1 1 1 1 7F

Rev. 1.40 4 November 21, 2002

 HT27LC020

Functional Description
Operation mode
All the operation modes are shown in the table following.
Mode CE OE PGM A0 A1 A9 VPP Output
Read VIL VIL X (2) X X X VCC Dout
Output Disable VIL VIH X X X X VCC High Z
Standby (TTL) VIH X X X X X VCC High Z
Standby (CMOS) VCC±0.3V X X X X X VCC High Z
Program VIL VIH VIL X X X VPP DIN
Program Verify VIL VIL VIH X X X VPP DOUT
Product Inhibit VIH X X X X X VPP High Z
Manufacturer Code (3) VIL VIL X VIL VIH VH (1) VCC 1C
Device Code (3) VIL VIL X VIH VIH VH (1) VCC 02

Notes: (1) VH = 12.0V±0.5V

(2) X=Either VIH or VIL
(3) For Manufacturer Code and Device Code, A1=VIH, When A1=VIL, both codes will read 7F

Vpp=12.5±0.2V, PGM LOW, and OE HIGH will program

Programming of the HT27LC020 that HT27LC020. A high-level CE input inhibits the
When the HT27LC020 is delivered, the chip has all HT27LC020 from being programmed.
2048K bits in the ²ONE², or HIGH state. ²ZEROs² are
loaded into the HT27LC020 through programming. Program verify mode
Verification should be performed on the programmed
The programming mode is entered when 12.5±0.2V is ap-
bits to determine whether they were correctly pro-
plied to the VPP pin, OE is at VIH, and CE and PGM are
grammed. The verification should be performed with
VIL. For programming, the data to be programmed is ap-
OE and CE at VIL, PGM at VIH, and VPP at its program-
plied with 8 bits in parallel to the data pins.
ming voltage.
The programming flowchart in Figure 3 shows the fast
interactive programming algorithm. The interactive al- Auto product identification
gorithm reduces programming time by using 30ms to The Auto Product Identification mode allows the read-
105ms programming pulses and giving each address ing out of a binary code from an EPROM that will identify
only as many pulses as is necessary in order to reliably its manufacturer and the type. This mode is intended for
program the data. After each pulse is applied to a given programming to automatically match the device to be
address, the data in that address is verified. If the data programmed with its corresponding programming algo-
is not verified, additional pulses are given until it is veri- rithm. This mode is functional in the 25°C±5°C ambient
fied or until the maximum number of pulses is reached temperature range that is required when programming
while sequencing through each address of the the HT27LC020.
HT27LC020. This process is repeated while sequenc-
To activate this mode, the programming equipment must
ing through each address of the HT27LC020. This part
of the programming algorithm is done at VCC=6.0V to force 12.0±0.5V on the address line A9 of the
assure that each EPROM bit is programmed to a suffi- HT27LC020. Two identifier bytes may then be sequenced
ciently high threshold voltage. This ensures that all bits from the device outputs by toggling address line A0 from
have sufficient margin. After the final address is com- VIL to VIH, when A1=VIH. All other address lines must be
pleted, the entire EPROM memory is read at held at VIH during Auto Product Identification mode.
VCC=VPP=3.3±0.3V to verify the entire memory. Byte 0 (A0=VIL) represents the manufacturer code, and
byte 1 (A0=VIH), the device code. For HT27LC020, these
Program inhibit mode two identifier bytes are given in the Mode Select Table. All
Programming of multiple HT27LC020 in parallel with differ- identifiers for the manufacturer and device codes will pos-
ent data is also easily accomplished by using the Program sess odd parity, with the MSB (DQ7) defined as the parity
Inhibit Mode. Except for CE, all like inputs of the parallel bit. When A1=VIL, the HT27LC020 will read out the binary
HT27LC020 may be common. A TTL low-level program code of 7F, continuation code, to signify the unavailability
pulse applied to an HT27LC020 CE input with of manufacturer ID codes.

Rev. 1.40 5 November 21, 2002

 HT27LC020

Read mode It is recommended that CE be decoded and used as the

The HT27LC020 has two control functions, both of primary device-selection function, while OE be made a
which must be logically satisfied in order to obtain data common connection to the READ line from the system
at outputs. Chip Enable (CE) is the power control and control bus. This assures that all deselected memory
should be used for device selection. Output Enable (OE) devices are in their low-power standby mode and that
is the output control and should be used to gate data to the output pins are only active when data is desired from
the output pins, independent of device selection. As- a particular memory device.
suming that addresses are stable, address access time
System considerations
(tACC) is equal to the delay from CE to output (tCE). Data
is available at the outputs (tOE) after the falling edge of During the switch between active and standby condi-
OE, assuming the CE has been LOW and addresses tions, transient current peaks are produced on the rising
have been stable for at least tACC-tOE. and falling edges of Chip Enable. The magnitude of
these transient current peaks is dependent on the out-
Standby mode put capacitance loading of the device. At a minimum, a
The HT27LC020 has CMOS standby mode which re- 0.1mF ceramic capacitor (high frequency, low inherent
duces the maximum VCC current to 10mA. It is placed in inductance) should be used on each device between
VCC and VPP to minimize transient effects. In addition,
CMOS standby when CE is at V CC ±0.3V. The
to overcome the voltage drop caused by the inductive
HT27LC020 also has a TTL-standby mode which re-
effects of the printed circuit board traces on EPROM ar-
duces the maximum VCC current to 0.6mA. It is placed
in TTL-standby when CE is at VIH. When in standby rays, a 4.7mF bulk electrolytic capacitor should be used
mode, the outputs are in a high-impedance state, inde- between VCC and VPP for each eight devices. The lo-
pendent of the OE input. cation of the capacitor should be close to where the
power supply is connected to the array.
Two-line output control function
To accommodate multiple memory connections, a
two-line control function is provided to allow for:
· Low memory power dissipation
· Assurance that output bus contention will not occur

A d d re s s A d d r e s s V a lid

tC E
C E
tD F

tO E
O E

tA C C tO H

O u tp u t O u tp u t V a lid
H IG H Z

Figure 1. A.C. waveforms for read operation

Rev. 1.40 6 November 21, 2002

 HT27LC020

R e a d
P ro g ra m ( V e r ify )
V IH
A d d re s s A d d r e s s S ta b le
V IL
tA S tO E tA H
V IH
D a ta O u t
D a ta D a ta In V a lid
V IL
tD S tD H
6 .0 V
V C C tD F P
5 .0 V
tV C S

1 2 .5 V tV P S
V P P
5 .0 V

tP R T
V IH
C E
V IL

tC E S

V IH
P G M
V IL

tP W tO E S

V IH
O E
V IL

Figure 2. Programming waveforms

Rev. 1.40 7 November 21, 2002

 HT27LC020

S T A R T

A d d r e s s = F ir s t L o c a tio n

V C C = 6 .0 V
V P P = 1 2 .5 V

X = 0

P ro g ra m o n e 7 5 s P u ls e
In te r a c tiv e
S e c tio n
In c re m e n t X

Y e s
X = 2 5 ?

N o

F a il V e r ify
B y te ?

P a s s

N o L a s t F a il
In c re m e n t A d d re s s A d d re s s

Y e s

V C C = V P P = 3 .3 V

V e r ify
S e c tio n F a il
V e r ify a ll D e v ic e F a ile d
B y te s ?

P a s s

D e v ic e P a s s e d

N o te : E ith e r 1 0 5 s o r 3 0 s p u ls e .

Figure 3. Fast programming flowchart

Rev. 1.40 8 November 21, 2002

 HT27LC020

Package Information
32-pin DIP (600mil) outline dimensions

3 2 1 7

1 1 6

D
= I
E F G

Dimensions in mil
Symbol
Min. Nom. Max.
A 1635 ¾ 1665
B 535 ¾ 555
C 145 ¾ 155
D 125 ¾ 145
E 16 ¾ 20
F 50 ¾ 70
G ¾ 100 ¾
H 595 ¾ 615
I 635 ¾ 670
a 0° ¾ 15°

Rev. 1.40 9 November 21, 2002

 HT27LC020

32-pin SOP (450mil) outline dimensions

3 2 1 7

A B

1 1 6

C '
G
D H

=
E F

Dimensions in mil
Symbol
Min. Nom. Max.
A 543 ¾ 557
B 440 ¾ 450
C 14 ¾ 20
C¢ ¾ ¾ 817
D 100 ¾ 112
E ¾ 50 ¾
F 4 ¾ ¾
G 32 ¾ 38
H 4 ¾ 12
a 0° ¾ 10°

Rev. 1.40 10 November 21, 2002

 HT27LC020

32-pin TSOP (8´20) outline dimensions

H D

1 3 2

G
E
0 .0 1 0 L
D e ta il F

1 6 1 7

A 2 A

S e e D e ta il F b e A 1
L 1 S y
S e a tin g P la n e

Dimensions in mm
Symbol
Min. Nom. Max.
A ¾ ¾ 1.20
A1 0.05 ¾ 0.15
A2 0.95 ¾ 1.05
b ¾ 0.22 ¾
D 18.30 ¾ 18.50
HD 19.80 ¾ 20.20
E 7.90 ¾ 8.10
e ¾ 0.50 ¾
L ¾ 0.60 ¾
L1 ¾ 0.80 ¾
q 0° ¾ 5°

Rev. 1.40 11 November 21, 2002

 HT27LC020

32-pin PLCC outline dimensions

A
B
4 1 3 2 2 9

5 2 8

D C

1 2 2 1

1 3 2 0
K

E F

J G
H
I

Dimensions in mil
Symbol
Min. Nom. Max.
A 485 ¾ 495
B 445 ¾ 455
C 585 ¾ 595
D 545 ¾ 555
E 105 ¾ 115
F ¾ ¾ 140
G 15 ¾ ¾
H ¾ 50 ¾
I 16 ¾ 22
J 24 ¾ 32
K 8 ¾ 12
a 0° ¾ 10°

Rev. 1.40 12 November 21, 2002

 HT27LC020

Product Tape and Reel Specifications

Reel dimensions

D
T 2

A B C

T 1

SOP 32W
Symbol Description Dimensions in mm
A Reel Outer Diameter 330±1.0
B Reel Inner Diameter 100±0.1
13.0+0.5
C Spindle Hole Diameter
-0.2
D Key Slit Width 2.0±0.5
32.8+0.3
T1 Space Between Flange
-0.2
T2 Reel Thickness 38.2+0.2

PLCC 32
Symbol Description Dimensions in mm
A Reel Outer Diameter 330±1.0
B Reel Inner Diameter 62±1.5
13.0+0.5
C Spindle Hole Diameter
-0.2
D Key Slit Width 2.0±0.5
24.8+0.3
T1 Space Between Flange
-0.2
T2 Reel Thickness 30.2±0.2

Rev. 1.40 13 November 21, 2002

 HT27LC020

Carrier tape dimensions

P 0 P 1 t
D

F
W C B 0

K 1
D 1 P
K 2

A 0

SOP 32W
Symbol Description Dimensions in mm
32.0+0.3
W Carrier Tape Width
-0.1
P Cavity Pitch 16.0±0.1
E Perforation Position 1.75±0.1
F Cavity to Perforation (Width Direction) 14.2±0.1
D Perforation Diameter 1.55+0.1
D1 Cavity Hole Diameter 2.0+0.25
P0 Perforation Pitch 4.0±0.1
P1 Cavity to Perforation (Length Direction) 2.0±0.1
A0 Cavity Length 14.7±0.1
B0 Cavity Width 20.9±0.1
K1 Cavity Depth 3.0±0.1
K2 Cavity Depth 3.4±0.1
t Carrier Tape Thickness 0.35±0.05
C Cover Tape Width 25.5

Rev. 1.40 14 November 21, 2002

 HT27LC020

P 0 P 1
D t

F
W
B 0
C

D 1 P
K 0

A 0

PLCC 32
Symbol Description Dimensions in mm
W Carrier Tape Width 24.0±0.3
P Cavity Pitch 18.0±0.1
E Perforation Position 1.75±0.1
F Cavity to Perforation (Width Direction) 11.5±0.1
D Perforation Diameter 1.5+0.1
1.55+1.0
D1 Cavity Hole Diameter
-0.05
P0 Perforation Pitch 4.0±0.1
P1 Cavity to Perforation (Length Direction) 2.0±0.1
A0 Cavity Length 13.1±0.1
B0 Cavity Width 15.5±0.1
K0 Cavity Depth 3.9±0.1
t Carrier Tape Thickness 0.30±0.05
C Cover Tape Width 21.3

Rev. 1.40 15 November 21, 2002

 HT27LC020

Holtek Semiconductor Inc. (Headquarters)

No.3, Creation Rd. II, Science-based Industrial Park, Hsinchu, Taiwan
Tel: 886-3-563-1999
Fax: 886-3-563-1189
http://www.holtek.com.tw
Holtek Semiconductor Inc. (Sales Office)
11F, No.576, Sec.7 Chung Hsiao E. Rd., Taipei, Taiwan
Tel: 886-2-2782-9635
Fax: 886-2-2782-9636
Fax: 886-2-2782-7128 (International sales hotline)
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7th Floor, Building 2, No.889, Yi Shan Rd., Shanghai, China
Tel: 021-6485-5560
Fax: 021-6485-0313
http://www.holtek.com.cn
Holtek Semiconductor (Hong Kong) Ltd.
RM.711, Tower 2, Cheung Sha Wan Plaza, 833 Cheung Sha Wan Rd., Kowloon, Hong Kong
Tel: 852-2-745-8288
Fax: 852-2-742-8657
Holmate Semiconductor, Inc.
48531 Warm Springs Boulevard, Suite 413, Fremont, CA 94539
Tel: 510-252-9880
Fax: 510-252-9885
http://www.holmate.com

Copyright Ó 2002 by HOLTEK SEMICONDUCTOR INC.

The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek as-
sumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek reserves the right to alter its products without prior notification. For the most
up-to-date information, please visit our web site at http://www.holtek.com.tw.

Rev. 1.40 16 November 21, 2002