EMC Split

More online at interferencetechnology.
eu
PAST
PRESENT
& FUTURE
OF EMC
EUROPE EMC GUIDE
2013
ARTICLES BUYERS GUIDES STANDARDS UPDATES EMC EVENTS
Cover_EEG2013.indd 6 11/16/12 1:37 PM ADs_EEG13.indd 1 11/16/12 1:41 PM
More online at interferencetechnology.eu
PAST
PRESENT
& FUTURE
OF EMC
EUROPE EMC GUIDE
2013
ARTICLES BUYERS GUIDES STANDARDS UPDATES EMC EVENTS
Cover_EEG2013.indd 6 11/16/12 1:37 PM ADs_EEG13.indd 1 11/16/12 1:41 PM
a TESEQ Company a TESEQ Company
What we offer:
AmplifersforEMC,ISM,telecomanddefense
Solid-stateclassAandclassABmodels
CW,pulsedandcombinedTWTamplifers
Tetrodetubeamplifers
Whatmakesusunique:
Rugged,reliabledesignforEMCtestingwithanyload
Higherpoweratlowerfrequencytocompensatefor
antennagain
Compactdesignwithmodulararchitecture
Upto5yearswarranty
LocalservicethroughTeseqsownservice
organizations
Teseq, IFI & mIlmega
RF, mICROWaVe & TWT eXPeRTs
amPlIFIeRs 10 kHz 40 gHz uP TO 10 kW
Three strong brands joined forces in 2012 under the Teseq
umbrella to offer the industrys widest product range: Teseq, IFI
and Milmega!
Our product portfolio includes Milmegas famous solid state micro-
wave amplifers, Teseqs rugged Class A power amplifers and IFIs
high power RF solid state and Tetrode tube amplifers, as well as
their well-known TWT amplifers up to 40 GHz. Teseq now covers
any application in the EMC, telecommunications and defense
industries.
Our strong global service network with local accredited calibration
labs ensures fast turn-around for calibration and repair. We back our
commitment to quality and reliability with a warranty up to 5 years.
Teseq IFI Milmega, the new power amplifer team to remember!
TeseqInc. Edison, NJ USA
T + 1 732 417 0501 F + 1 732 417 0511
usasales@teseq.com www.tesequsa.com
ADs_EEG13.indd 3 11/16/12 1:43 PM
CONTENTS
2013 Europe EMC Guide
interferencetechnology.eu interference technology
1
4 letter from the editor
6 european StandardS and reSourceS
standards organizations, government sites, institutes and trade associations
14 eVentS and tradeShoWS
168 indeX of adVertiSerS

26 productS & SerViceS
34 reSourceS
36 inVeStigation of Vehicle radiated
emiSSionS meaSurement practiceS
AlAstAir r. ruddle, Ph.d., Project engineer, mira Limited
46 neW Voltage Sag teSting requirementS
for induStrial equipment
AndreAs eberhArd, vice President, Power standards Lab
50 Surge protectiVe deViceS (SpdS)
and Short circuit currentS
bryAn Cole, President, technology research council
Jim tiesi, marketing manager, emerson network Power surge Protection
58 produkte und SerViceS
65 reSSourcen
66 anforderungen der ciSpr 16-1-1 an
meSSempfnger, SpektrumanalySatoren
und fft-baSierende meSSinStrumente
stePhAn brAun, Arnd FreCh, Founders, gauss instruments gmbH
74 punktgenaue pulS-StrfeStigkeitS-analySe
lArs Glser, Hardware-entwickler von emv - ma, Langer
S u b s c r i p t i ons
ITEM, InterferenceTechnologyThe EMC Directory & Design Guide, The EMC Symposium Guide, The EMC Test & Design Guide and the Europe EMC Guide are distributed annually at no charge to engineers
and managers who are engaged in the application, selection, design, test, specifcation or procurement of electronic components, systems, materials, equipment, facilities or related fabrication services. subscriptions
are available through interferencetechnology.com.
United Kingdom
Deutchland
Page 48
Page 77
all of our articles are available
online in english at
www.interferencetechnology.eu
TOC_EEG13.indd 1 11/16/12 3:03 PM
What we offer:
AmplifersforEMC,ISM,telecomanddefense
Solid-stateclassAandclassABmodels
CW,pulsedandcombinedTWTamplifers
Tetrodetubeamplifers
Whatmakesusunique:
Rugged,reliabledesignforEMCtestingwithanyload
Higherpoweratlowerfrequencytocompensatefor
antennagain
Compactdesignwithmodulararchitecture
Upto5yearswarranty
LocalservicethroughTeseqsownservice
organizations
Teseq, IFI & mIlmega
RF, mICROWaVe & TWT eXPeRTs
amPlIFIeRs 10 kHz 40 gHz uP TO 10 kW
Three strong brands joined forces in 2012 under the Teseq
umbrella to offer the industrys widest product range: Teseq, IFI
and Milmega!
Our product portfolio includes Milmegas famous solid state micro-
wave amplifers, Teseqs rugged Class A power amplifers and IFIs
high power RF solid state and Tetrode tube amplifers, as well as
their well-known TWT amplifers up to 40 GHz. Teseq now covers
any application in the EMC, telecommunications and defense
industries.
Our strong global service network with local accredited calibration
labs ensures fast turn-around for calibration and repair. We back our
commitment to quality and reliability with a warranty up to 5 years.
Teseq IFI Milmega, the new power amplifer team to remember!
TeseqInc. Edison, NJ USA
T + 1 732 417 0501 F + 1 732 417 0511
usasales@teseq.com www.tesequsa.com
ADs_EEG13.indd 3 11/16/12 1:43 PM
2
INTERFERENCE TECHNOLOGY EUROPE EMC GUIDE 2013
2
82 PRODUITS ET SERVICES
85 RESSOURCES
86 COUPLAGE ANTENNAIRES DUNCOUPLAGES ENTRES
ANTENNES DANS UN ARONEF PAR LA MTHODE
DIRECTE ACA
PASCAL DE RESSGUIER, Chef de projet chez, Entares Engineering
YANNICK POIR, SAMUEL LEMAN, Ingnieurs Etudes & Simulations CEM, Nexio
96 PRODOTTI E SERVIZI
97 RISORSE
98 IMPATTI POTENZIALI DELLE ARMI
ELETTROMAGNETICHE SULLE INFRASTRUTTURE
CRITICHE (SITUAZIONE AL 2012)
DOTT. WILLIAM A. RADASKY, Membro a vita dellIEEE
108 PRODOCTOS Y SERVICIOS
111 LOS RECURSOS
112 CMO PROTEGER LA INFORMACIN CORPORATIVA
CONFIDENCIAL DEL ACCESO NO AUTORIZADO
HERBERT MANGSTL, Director de ventas, EMshield GmbH
JORDI FERRI, Director de la divisin de blindaje, AST Modular S.L.
116 EMISIONES DE RF DE LAS LMPARAS
FLUORESCENTES DE BAJO CONSUMO
W.G. FANO, Profesor, Facultad de Ingeniera, Universidad de Buenos Aires
124 PRODOKTY I USUGI
125 ZASOBY
126 O SZACOWANIU BDU NIEDOPASOWANIA W
BADANIACH EMISJI PROMIENIOWANEJ
JAN SROKA, Profesor, Politechnika Warszawska
France
Italia
Espaa
Polska
PAGE 88
PAGE 101
PAGE 118
P
A
G
E

1
3
1
TOC_EEG13.indd 2 11/16/12 6:11 PM
3
InterferenceTechnologyThe Annual EMC Guide, The EMC Symposium Guide, and The EMC Test & Design Guide are distributed annually at no charge to qualifed engineers
and managers who are engaged in the application, selection, design, test, specifcation or procurement of electronic components, systems, materials, equipment, facilities or related
fabrication services. To be placed on the subscriber list, complete the subscription qualifcation card or subscribe online at InterferenceTechnology.com.
ITEM PublIcaTIons endeavors to offer accurate information, but assumes no liability for errors or omissions in its technical articles. Furthermore, the opinions contained herein do not
necessarily refect those of the publisher.
ITEM
TM
, InterferenceTechnologyThe Annual EMC Guide
TM
, and Interference Technology.com
TM
are trademarks of ITEM PublIcaTIons and may not be used without express
permission. ITEM, InterferenceTechnologyThe Annual EMC Guide, The EMC Symposium Guide, The EMC Test & Design Guide and InterferenceTechnology.com, are
copyrighted publications of ITEM PublIcaTIons. contents may not be reproduced in any form without express permission.
136 Producten en SerViceS
139 middelen
140 Verbeteringen AAn reSonAntieVrij
Pdn-deSign
MarT Coenen, cEo, EMcMcc
arThur van roerMund, Hoogleraar, Technische universiteit van Eindhoven
148 ProduKte und SerViceS
150 reSSourcen
154 ProduitS et SerViceS
156 reSSourceS
158 ProduKte und SerViceS
162 ProductS & SerViceS
Nederland
Schweiz
Belgique
sterreich
Europe
PaGE 141
Cover: Photography by photographer Ray lombardi, lorray Design studio; Model: George bruno, conshohocken, Pennsylvania, u.s. lab use courtesy of alion
science & Technology, conshohocken, Pennsylvania, u.s.
TOC_EEG13.indd 3 11/16/12 3:06 PM
4
interference technology
Letter from the Editor
USA
1000 Germantown Pike, F-2
Plymouth Meeting, PA 19462
Phone: (484) 688-0300
Fax: (484) 688-0303
E-mail:
info@interferencetechnology.com
www.interferencetechnology.com
chinA, tAiwAn, hong kong
Beijing Hesicom Consulting Company
Cecily Bian, +86-010-65250537
E-mail: cecilybian_itc@163.com
JAPAn
TV SD Ohtama, Ltd.
Miho Toshima, +81-44-980-2092
E-mail: m-toshima@tuv-ohtama.co.jp
ITEM MEdIa endeavors to offer accurate information, but assumes no
liability for errors or omissions. Information published herein is based on
the latest information available at the time of publication. Furthermore, the
opinions contained herein do not necessarily refect those of the publisher.
I T E M
T M
, I n t e r f e r e n c e T e c h n o l o g y a n d
InterferenceTechnology.com
TM
are trademarks of I TEM
MEdIa and may not be used without express permission. ITEM,
InterferenceTechnology and InterferenceTechnology.com
are copyrighted publications of ITEM MEdIa. Contents may not be
reproduced in any form without express permission.
Copyright 2012 ITEM Media ISSN 0190-0943
Publisher
Paul Salotto
editor
Belinda Stasiukiewicz
editorial Assistant
Aliza Becker
graphic Designer
Evan Schmidt
Marketing
Francesco diMaio
Jacqueline Gentile
Business Development Manager
Casey Goodwin
Business Development executives
daryl McFadyen
Leslie Ringe
Katie Tolton
Janet Ward
Administrative Manager
Eileen M. ambler
circulation Manager
Irene H. Nugent
Product Development Manager
Helen S. Flood
Data Analyst
Karen Holder
President
Graham S. Kilshaw
Publisher emeritus
Robert d. Goldblum
A year for europe
W
ELCOME TO THE THIRD ANNUAL IS-
SUE of the Interference Technology Europe
EMC Guide.
2013 has been designated the European
Year of Citizens to commemorate the 20th
anniversary of EU citizenship under the Maastricht Treaty. Te
European Year is both an interdepartmental and grass-roots-level
campaign that aims to raise European awareness of citizen rights.
Terefore, Interference Technology has dedicated this edition of
the Europe EMC Guide to the contributions of Europeans to the
EMC world, featuring biographies of signifcant engineers and articles on new standards
and practices taking place in Europe.
One recent important standard is the New Legislative Framework for Marketing
of Products, which came into efect in 2010. Tis decision concerns the traceability of
products being placed in the EU, including components like EMI flters and shielding.
It requires importers, distributors and manufacturers to share the responsibility to put
only compliant products on the market.
Te articles in this issue demonstrate how information on EMC can reach across
continents, connecting engineers the world over, regardless of nation. Each section in this
issue contains an article in its countrys native language, and all articles are also available
in English on our website, www.interferencetechnology.eu. Be sure to check out our new
digital edition on the site as well, which has interactive elements and special features.
In this issue, Mart Coenen, who is based in the Netherlands, discusses enhancements
on resonant-free PDN Design on page 140. We also provide information on new
requirements, such as CISPR 16-1-1 test receivers, spectrum analysers and FFT-based
measuring instruments, which Germans Stephan Braun and Arnd Frech discuss on
page 66. EMC on aircraft is a commonly discussed and disputed topic among engineers
and the general public alike. French engineers Pascal De Resseguier, Yannick Poire and
Samuel Leman discuss antenna coupling inside an aircraft on page 86.
We also take a look back in this issue by exploring some of the historical fgures in
the feld. Tese men and women are all from European countries and were key in the
development of the feld.
One of the most well-known European engineers is Nicola Tesla. He was born in
Croatia and lived in Austria, Hungary, the Czech Republic and France before emigrating
to the U.S. He worked for Tomas Edison before forming his own companies, Tesla
Electric Light & Manufacturing and Tesla Electric Company, and he patented the Tesla
Coil. Teslas impact can be felt across the globe, even in my hometown on Long Island,
New York, where he built his Wardenclyfe Laboratory.
Joining Tesla in this years focus on historical fgures in EMC are Guglielmo Marconi,
the Italian inventor of radio; Heinrich Rudolf Hertz, the German physicist; Michael
Faraday, the English scientist who inspired Albert Einstein; and other historically
signifcant men and women. Tese engineers contributed in many important ways that
helped shape the feld as we know it today.
Tere are also many important shows that will take place in Europe over the next year.
One is the EMC 2013 Europe show, which will take place in Brugge, Belgium. Tere is
also EMV 2013 in Stuttgart, Germany one of the largest trade shows in Europe for
electromagnetic compatibility. Tis conference, held in March, ofers professionals the
opportunity to acquire information on trends and developments frsthand. We have a
list of these and other important events and conferences on page 14.
Europe from its significant historical figures to its new regulations and
i mportant i ndustry events is a very i mportant contributor to EMC and
were committed to providi ng current, practical and accurate articles and
information for the entire region. If you have any questions or comments about
this issue, or would like to contribute to the next edition, please email me at
bstas@interferencetechnology.com.
Editor
2013 EUROPE EMC GUIDE
Editors_Note_EEG13.indd 6 11/16/12 3:08 PM
International Microwave Symposium
IEEE 2-7 June 2013, Seattle, WA MTT-S
IMS2013
MUST ATTEND!
HTTP://IMS2013.MTT.ORG
FOR FULL CONFERENCE DETAILS VISIT
The 2013 IEEE MTT-S International Microwave Symposium (IMS2013) is the
Premier Microwave Conference in the Industry!
With over 9,000 attendees and over 800 industrial exhibits of the latest state-of-the-art microwave products,
Microwave Week is the worlds largest gathering of Radio Frequency (RF) and Microwave professionals and the most
important forum for the latest and most advanced research in the area.
Technical Paper Submissions: Authors are invited
to submit technical papers describing original work
on radio-frequency, microwave, millimeter-wave, and
terahertz (THz) theory and techniques. The deadline
for submission is 10 December 2012. Please refer to
the IMS2013 website (http://ims2013.mtt.org) for
detailed instructions concerning paper submission, as
well as a complete list of technical areas.
Become an Exhibitor: The 2013 IEEE MTT-S
International Microwave Symposium is the worlds
premier microwave event. It features a large trade show,
technical sessions, workshops and panel sessions
covering a wide range of topics. Attendee interests
include wireless communication, radar, RF technologies,
high frequency semiconductors, electromagnetics,
commercial and military RF, microwave and mm-wave
electronics, applications, and much more.
SUBMIT YOUR TECHNICAL PAPER TO
IMS2013 TODAY!
EXPERIENCE ALL THE ADVANTAGES OF
BECOMING AN EXHIBITOR AT IMS2013.
IMS2013 EXHIBIT SPACE IS AVAILABLE FOR RESERVATION Questions or further information contact:
Cedric W. Fellows, Sales Director, Events Tel 303-530-4562 ext. 133, Email: Cedric@mpassociates.com
Tim Thompson Tim Thompson
Tim Thompson
Tim Thompson
Tim Thompson
ADs_EEG13.indd 4 11/16/12 2:34 PM
4
interference technology
Letter from the Editor
USA
1000 Germantown Pike, F-2
Plymouth Meeting, PA 19462
Phone: (484) 688-0300
Fax: (484) 688-0303
E-mail:
info@interferencetechnology.com
www.interferencetechnology.com
chinA, tAiwAn, hong kong
Beijing Hesicom Consulting Company
Cecily Bian, +86-010-65250537
E-mail: cecilybian_itc@163.com
JAPAn
TV SD Ohtama, Ltd.
Miho Toshima, +81-44-980-2092
E-mail: m-toshima@tuv-ohtama.co.jp
ITEM MEdIa endeavors to offer accurate information, but assumes no
liability for errors or omissions. Information published herein is based on
the latest information available at the time of publication. Furthermore, the
opinions contained herein do not necessarily refect those of the publisher.
I T E M
T M
, I n t e r f e r e n c e T e c h n o l o g y a n d
InterferenceTechnology.com
TM
are trademarks of I TEM
MEdIa and may not be used without express permission. ITEM,
InterferenceTechnology and InterferenceTechnology.com
are copyrighted publications of ITEM MEdIa. Contents may not be
reproduced in any form without express permission.
Copyright 2012 ITEM Media ISSN 0190-0943
Publisher
Paul Salotto
editor
editorial Assistant
Aliza Becker
graphic Designer
Evan Schmidt
Marketing
Francesco diMaio
Jacqueline Gentile
Business Development Manager
Casey Goodwin
Business Development executives
daryl McFadyen
Leslie Ringe
Katie Tolton
Janet Ward
Administrative Manager
Eileen M. ambler
circulation Manager
Irene H. Nugent
Product Development Manager
Helen S. Flood
Data Analyst
Karen Holder
President
Graham S. Kilshaw
Publisher emeritus
Robert d. Goldblum
A year for europe
W
ELCOME TO THE THIRD ANNUAL IS-
SUE of the Interference Technology Europe
EMC Guide.
2013 has been designated the European
Year of Citizens to commemorate the 20th
anniversary of EU citizenship under the Maastricht Treaty. Te
European Year is both an interdepartmental and grass-roots-level
campaign that aims to raise European awareness of citizen rights.
Terefore, Interference Technology has dedicated this edition of
the Europe EMC Guide to the contributions of Europeans to the
EMC world, featuring biographies of signifcant engineers and articles on new standards
and practices taking place in Europe.
One recent important standard is the New Legislative Framework for Marketing
of Products, which came into efect in 2010. Tis decision concerns the traceability of
products being placed in the EU, including components like EMI flters and shielding.
It requires importers, distributors and manufacturers to share the responsibility to put
only compliant products on the market.
Te articles in this issue demonstrate how information on EMC can reach across
continents, connecting engineers the world over, regardless of nation. Each section in this
issue contains an article in its countrys native language, and all articles are also available
in English on our website, www.interferencetechnology.eu. Be sure to check out our new
digital edition on the site as well, which has interactive elements and special features.
In this issue, Mart Coenen, who is based in the Netherlands, discusses enhancements
on resonant-free PDN Design on page 140. We also provide information on new
requirements, such as CISPR 16-1-1 test receivers, spectrum analysers and FFT-based
measuring instruments, which Germans Stephan Braun and Arnd Frech discuss on
page 66. EMC on aircraft is a commonly discussed and disputed topic among engineers
and the general public alike. French engineers Pascal De Resseguier, Yannick Poire and
Samuel Leman discuss antenna coupling inside an aircraft on page 86.
We also take a look back in this issue by exploring some of the historical fgures in
the feld. Tese men and women are all from European countries and were key in the
development of the feld.
One of the most well-known European engineers is Nicola Tesla. He was born in
Croatia and lived in Austria, Hungary, the Czech Republic and France before emigrating
to the U.S. He worked for Tomas Edison before forming his own companies, Tesla
Electric Light & Manufacturing and Tesla Electric Company, and he patented the Tesla
Coil. Teslas impact can be felt across the globe, even in my hometown on Long Island,
New York, where he built his Wardenclyfe Laboratory.
Joining Tesla in this years focus on historical fgures in EMC are Guglielmo Marconi,
the Italian inventor of radio; Heinrich Rudolf Hertz, the German physicist; Michael
Faraday, the English scientist who inspired Albert Einstein; and other historically
signifcant men and women. Tese engineers contributed in many important ways that
helped shape the feld as we know it today.
Tere are also many important shows that will take place in Europe over the next year.
One is the EMC 2013 Europe show, which will take place in Brugge, Belgium. Tere is
also EMV 2013 in Stuttgart, Germany one of the largest trade shows in Europe for
electromagnetic compatibility. Tis conference, held in March, ofers professionals the
opportunity to acquire information on trends and developments frsthand. We have a
list of these and other important events and conferences on page 14.
Europe from its significant historical figures to its new regulations and
i mportant i ndustry events is a very i mportant contributor to EMC and
were committed to providi ng current, practical and accurate articles and
information for the entire region. If you have any questions or comments about
this issue, or would like to contribute to the next edition, please email me at
bstas@interferencetechnology.com.
Editor
2013 EUROPE EMC GUIDE
Editors_Note_EEG13.indd 6 11/16/12 3:08 PM
International Microwave Symposium
IEEE 2-7 June 2013, Seattle, WA MTT-S
IMS2013
MUST ATTEND!
HTTP://IMS2013.MTT.ORG
FOR FULL CONFERENCE DETAILS VISIT
The 2013 IEEE MTT-S International Microwave Symposium (IMS2013) is the
Premier Microwave Conference in the Industry!
With over 9,000 attendees and over 800 industrial exhibits of the latest state-of-the-art microwave products,
Microwave Week is the worlds largest gathering of Radio Frequency (RF) and Microwave professionals and the most
important forum for the latest and most advanced research in the area.
Technical Paper Submissions: Authors are invited
to submit technical papers describing original work
on radio-frequency, microwave, millimeter-wave, and
terahertz (THz) theory and techniques. The deadline
for submission is 10 December 2012. Please refer to
the IMS2013 website (http://ims2013.mtt.org) for
detailed instructions concerning paper submission, as
well as a complete list of technical areas.
Become an Exhibitor: The 2013 IEEE MTT-S
International Microwave Symposium is the worlds
premier microwave event. It features a large trade show,
technical sessions, workshops and panel sessions
covering a wide range of topics. Attendee interests
include wireless communication, radar, RF technologies,
high frequency semiconductors, electromagnetics,
commercial and military RF, microwave and mm-wave
electronics, applications, and much more.
SUBMIT YOUR TECHNICAL PAPER TO
IMS2013 TODAY!
EXPERIENCE ALL THE ADVANTAGES OF
BECOMING AN EXHIBITOR AT IMS2013.
IMS2013 EXHIBIT SPACE IS AVAILABLE FOR RESERVATION Questions or further information contact:
Cedric W. Fellows, Sales Director, Events Tel 303-530-4562 ext. 133, Email: Cedric@mpassociates.com
Tim Thompson Tim Thompson
Tim Thompson
Tim Thompson
Tim Thompson
ADs_EEG13.indd 4 11/16/12 2:34 PM
6
interference technology europe emc guide 2013
Compliance with standards can make or break any new product. This section recaps some of the major new and revised EMC standards in
the last year from the three European standards organizations: the European Committee for Standardization (CEN), the European Committee
for Electrotechnical Standardization (CENELEC) and the European Telecommunications Standards Institute (ETSI). Standards information and
updates are featured in our Interference Technology eNews. Visit InterferenceTechnology.com, subscribe to the eNews, and youll be notifed
weekly of important changes in EMC standards from Europe and around the world. Standards are sorted by standard reference number.
European Committee
for Electrotechnical
Standardization
(CENELEC)
EN 50177:2009/A1:2012
IEC TEChNICAl Body: CLC/SC 31-8
STATuS: Published
dATE of puBlICATIoN: 2012-08-17
TITlE: Stationar y electrostatic appli-
cation equipment for ignitable coating
powders - Safety requirements
EN 50516-1-1:2011/AC:2012
IEC TEChNICAl Body: CLC/TC 86BXA
STATuS: Published
TITlE: Industrial connector sets and
interconnect components to be used in
optical fibre control and communication
systems - Product specifications - Part
1-1: Type SC-RJ PC industrial terminated
on EN 60793-2-10 category A1a and A1b
multimode fibre to meet the requirements
of category I (industrial environments) as
specified in IEC/PAS 61753-1-3
SCopE: 1.1 Product definition This Euro-
pean Standard contains the initial, start of
life dimensional, optical, mechanical and
environmental performance requirements
that an SC-RJ connector set with one side
protected by an industrial housing with
the fibres terminated with cylindrical
zirconia PC ferrules, an adaptor fitted with
resilient alignment sleeves and patchcord
shall meet in order for it to be categorised
as an EN standard product. The product
is rated IP67. Since different variants are
permitted, product marking details are
given in 3.6. 1.2 Intermateability Products
conforming to the requirements of this
specification will intermate and give the
specified level of random attenuation
and random return loss per formance,
provided that the same fibre t ype is
used. The intention is that this will be
true irrespective of the manufacturing
source(s) of the product. 1.3 Operating
environment The tests selected combined
with the severities and durations, speci-
fied as category I, are intended to reflect,
although they do not necessarily satisfy
all the requirements of the boundary con-
ditions of M3I3C3E3. 1.4 Reliability Whilst
the anticipated service life expectancy
of the product in this environment is 20
years, compliance with this specification
does not guarantee the reliability of the
product. This should be predicted us-
ing a recognised reliability assessment
programme. 1.5 Quality assurance Com-
pliance with this specification does not
guarantee the manufacturing consistency
of the product. This should be maintained
using a recognised qualit y assurance
programme.
EN 50521:2008/A1:2012
IEC TEChNICAl Body: CLC/TC 82
STATuS: Published
TI TlE: Connect or s for phot ovol t ai c
systems - Safety requirements and tests
SCopE: This European Standard applies
to connectors of application Class A ac-
cording to EN 61730-1 for use in photo-
voltaic systems with rated voltages up to
1 500 V DC and rated currents up to 125
A per contact. This standard applies to
connectors without breaking capacity but
might be engaged and disengaged under
voltage. NOTE For connectors according
to Class B and C of EN 61730 as well
as for protection for Class II equipment
intended for use between 0 V and 120 V
d.c. in photovoltaic-systems this standard
may be used as a guide.
EN 60269-4:2009/A1:2012
IEC TEChNICAl Body: CLC/SR 32B
STATuS: Published
TI TlE: Low- vol t age f uses - Par t 4:
Supplementar y requirements for fuse-
links for the protection of semiconductor
devices
SCopE: IEC 60269-4:2009 is to be used in
conjunction with IEC 60269-1. This Part 4
supplements or modifies the corresonding
clauses or subclauses of Part 1. Fuse-links
for the protection of semiconductor de-
vices shall comply with aIl requirements
of IEC 60269-1, if not otherwise indicated
hereinafter, and shall also comply with
the supplementar y requirements laid
down below. This fifth edition cancels and
replaces the fourth edition published in
STANDARDS
EUROPE
Standards | Europe
Standards_EEG13.indd 6 11/16/12 5:55 PM
7
Standards | Europe
2006. It constitutes a technical revision.
The significant technical changes to the
fourth edition are: - the introduction of
voltage source inverter fuse-links, includ-
ing test requirements; - coverage of the
tests on operating characteristics for
a.c. by the breaking capacity tests; - the
updating of examples of standardised
fuse-links for the protection of semicon-
ductor devices.
EN 60358-1:2012
IEC TEChNICal Body: CLC/SR 33
STaTuS: Published
daTE of puBlICaTIoN: 2012-08-10
TITlE: Coupling capacitors and capacitor
dividers - Part 1: General rules
SCopE: IEC 60358-1:2012 applies to ca-
pacitors, with rated voltage >1 000 V, con-
nected line to ground with the low voltage
terminal either permanently earthed or
connected to devices, for applications
listed hereunder and other similar uses.
This standard serves as basic standard
for the coupling capacitor, the different
parts of this standard will present the
supplementary specifications and tests,
for example IEC 60358-2, IEC 60358-3
or IEC 60358-4. This standard cancels
and replaces the second edition of IEC
60358 (1990), and constitutes a techni-
cal revision. This edition of IEC 60358-1
includes the following significant techni-
cal changes with respect to the former
edition of IEC 60358: - the standard has
been split into different parts; Part 1 is
the general rules and Parts 2, 3, 4 will be
specific to the PLC, filters and dividers
applications. - the routine and type test
have been reviewed and are presented in
Figure 2. Keywords: coupling capacitor,
capacitor dividers.
EN 60717:2012
STaTuS: Published
TITlE: Method for the determination
of the space required by capacitors and
resistors with unidirectional terminations
SCopE: IEC 60717:2012 applies to ca-
pacitors and resistors with unidirectional
wire terminations intended for use in elec-
tronic equipment. This standard provides
a method for determination of the space
required by capacitors and resistors with
unidirectional wire terminations. NOTE:
Instead of measuring the actual space,
it may be suf ficient to ensure that a
component fits into the maximum space
for which it is designed. This may be
achieved by means of fixed gauges. The
main technical changes with respect to
the first edition are the following: - em-
ployment of the millimetre-based grid, the
preferred grid system given in IEC 60097,
- employment of SI units only, causing
deletion of the imperial dimensions from
Table 1, - reduction of the tolerance on the
chamfer depth in Figure 1, and - introduc-
tion of requirements on information to be
given in a relevant specification.
EN 60862-2:2012
STaTuS: Published
TITlE: Sur face acoustic wave (SAW)
filters of assessed quality - Part 2: Guide-
lines for the use
SCopE: IEC 60862-2:2012 gives practi-
cal guidance on the use of SAW filters
which are used in telecommunications,
measuring equipment, radar systems and
consumer products. IEC 60862-1 should be
referred to for general information, stan-
dard values and test conditions. This part
of IEC 60862 includes various kinds of fil-
ter configuration, of which the operating
frequency range is from approximately 10
MHz to 3 GHz and the relative bandwidth
is about 0,02 % to 50 % of the centre fre-
quency. It is not the aim of this standard
to explain theory, nor to attempt to cover
all the eventualities which may arise in
practical circumstances. This standard
draws at tention to some of the more
fundamental questions, which should be
considered by the user before he places
an order for a SAW filter for a new ap-
plication. Such a procedure will be the
users insurance against unsatisfactory
performance. This edition includes the
following significant technical changes
with respect to the previous edition:
- Clause 3 Terms and definitions has
been deleted to be included in the next
edition of IEC 60862-1; - the tapered IDT
STaNdaRdS
oRGaNIZaTIoNS
CEN, the European Committee for
Standardization
CEN is a provider of European Stan-
dards and technical specifications. It
is a recognized European organization
according to Directive 98/34/EC for
the planning, draf ting and adoption
of European Standards in all areas of
economic activity with the exception
of electrotechnology (CENELEC) and
telecommunication (ETSI).
CEN- CENELEC Management Centre,
Avenue Marnix 17, B-1000 Brussels,
Belgium; + 32 2 550 08 11; Fax: + 32
2 550 08 19; www. cen. eu/cenor m/
homepage.htm
CENELEC - European Committee for
Electrotechnical Standardization
CENELECs mission is to prepare vol-
untary electrotechnical standards that
help develop the Single European Mar-
ket/European Economic Area for electri-
cal and electronic goods and services
removing barriers to trade, creating new
markets and cutting compliance costs.
17, Avenue Marnix, B-1000 Brussels,
Belgium; +32 2 519 68 71; Fax: +32 2
519 69 19; www.cenelec.org
European Telecommunications
Standards Institute
Recognized as an of ficial European
Standards Organization by the Euro-
pean Union, ETSI produces globall y
applicable standards for Information &
Communications Technologies including
fixed, mobile, radio, broadcast, internet,
aeronautical and other areas.
ETSI Secretariat: 650, Route des Lu-
cioles, 06921 Sophia-Antipolis Cedex,
France; +33 (0) 4 92 94 42 00; Fax: +33
(0) 4 93 65 47 16; info@etsi.org; www.
etsi.org
International Electrotechnical
Commission (IEC)
The IEC prepares and publishes Interna-
tional Standards for all electrical, electronic
and related technologies collectively
known as electrotechnology.
IEC Central Offce, 3, rue de Varemb, P.O.
Box 131, CH - 1211 Geneva 20, Switzerland;
+41 22 919 02 11, Fax: +41 22 919 03 00;
info@iec.ch, www.iec.ch
IECs EMC Zone: www.iec.ch/zone/emc/
emc_entry.htm
6
Compliance with standards can make or break any new product. This section recaps some of the major new and revised EMC standards in
the last year from the three European standards organizations: the European Committee for Standardization (CEN), the European Committee
for Electrotechnical Standardization (CENELEC) and the European Telecommunications Standards Institute (ETSI). Standards information and
updates are featured in our Interference Technology eNews. Visit InterferenceTechnology.com, subscribe to the eNews, and youll be notifed
weekly of important changes in EMC standards from Europe and around the world. Standards are sorted by standard reference number.
European Committee
for Electrotechnical
Standardization
(CENELEC)
EN 50177:2009/A1:2012
IEC TEChNICAl Body: CLC/SC 31-8
STATuS: Published
TITlE: Stationar y electrostatic appli-
cation equipment for ignitable coating
powders - Safety requirements
EN 50516-1-1:2011/AC:2012
IEC TEChNICAl Body: CLC/TC 86BXA
STATuS: Published
TITlE: Industrial connector sets and
interconnect components to be used in
optical fibre control and communication
systems - Product specifications - Part
1-1: Type SC-RJ PC industrial terminated
on EN 60793-2-10 category A1a and A1b
multimode fibre to meet the requirements
of category I (industrial environments) as
specified in IEC/PAS 61753-1-3
SCopE: 1.1 Product definition This Euro-
pean Standard contains the initial, start of
life dimensional, optical, mechanical and
environmental performance requirements
that an SC-RJ connector set with one side
protected by an industrial housing with
the fibres terminated with cylindrical
zirconia PC ferrules, an adaptor fitted with
resilient alignment sleeves and patchcord
shall meet in order for it to be categorised
as an EN standard product. The product
is rated IP67. Since different variants are
permitted, product marking details are
given in 3.6. 1.2 Intermateability Products
conforming to the requirements of this
specification will intermate and give the
specified level of random attenuation
and random return loss per formance,
provided that the same fibre t ype is
used. The intention is that this will be
true irrespective of the manufacturing
source(s) of the product. 1.3 Operating
environment The tests selected combined
with the severities and durations, speci-
fied as category I, are intended to reflect,
although they do not necessarily satisfy
all the requirements of the boundary con-
ditions of M3I3C3E3. 1.4 Reliability Whilst
the anticipated service life expectancy
of the product in this environment is 20
years, compliance with this specification
does not guarantee the reliability of the
product. This should be predicted us-
ing a recognised reliability assessment
programme. 1.5 Quality assurance Com-
pliance with this specification does not
guarantee the manufacturing consistency
of the product. This should be maintained
using a recognised qualit y assurance
programme.
EN 50521:2008/A1:2012
STATuS: Published
TI TlE: Connect or s for phot ovol t ai c
systems - Safety requirements and tests
SCopE: This European Standard applies
to connectors of application Class A ac-
cording to EN 61730-1 for use in photo-
voltaic systems with rated voltages up to
1 500 V DC and rated currents up to 125
A per contact. This standard applies to
connectors without breaking capacity but
might be engaged and disengaged under
voltage. NOTE For connectors according
to Class B and C of EN 61730 as well
as for protection for Class II equipment
intended for use between 0 V and 120 V
d.c. in photovoltaic-systems this standard
may be used as a guide.
EN 60269-4:2009/A1:2012
STATuS: Published
TI TlE: Low- vol t age f uses - Par t 4:
Supplementar y requirements for fuse-
links for the protection of semiconductor
devices
SCopE: IEC 60269-4:2009 is to be used in
conjunction with IEC 60269-1. This Part 4
supplements or modifies the corresonding
clauses or subclauses of Part 1. Fuse-links
for the protection of semiconductor de-
vices shall comply with aIl requirements
of IEC 60269-1, if not otherwise indicated
hereinafter, and shall also comply with
the supplementar y requirements laid
down below. This fifth edition cancels and
replaces the fourth edition published in
STANDARDS
EUROPE
Standards | Europe
7
Standards | Europe
2006. It constitutes a technical revision.
The significant technical changes to the
fourth edition are: - the introduction of
voltage source inverter fuse-links, includ-
ing test requirements; - coverage of the
tests on operating characteristics for
a.c. by the breaking capacity tests; - the
updating of examples of standardised
fuse-links for the protection of semicon-
ductor devices.
EN 60358-1:2012
STaTuS: Published
TITlE: Coupling capacitors and capacitor
dividers - Part 1: General rules
SCopE: IEC 60358-1:2012 applies to ca-
pacitors, with rated voltage >1 000 V, con-
nected line to ground with the low voltage
terminal either permanently earthed or
connected to devices, for applications
listed hereunder and other similar uses.
This standard serves as basic standard
for the coupling capacitor, the different
parts of this standard will present the
supplementary specifications and tests,
for example IEC 60358-2, IEC 60358-3
or IEC 60358-4. This standard cancels
and replaces the second edition of IEC
60358 (1990), and constitutes a techni-
cal revision. This edition of IEC 60358-1
cal changes with respect to the former
edition of IEC 60358: - the standard has
been split into different parts; Part 1 is
the general rules and Parts 2, 3, 4 will be
specific to the PLC, filters and dividers
applications. - the routine and type test
have been reviewed and are presented in
Figure 2. Keywords: coupling capacitor,
capacitor dividers.
EN 60717:2012
STaTuS: Published
TITlE: Method for the determination
of the space required by capacitors and
resistors with unidirectional terminations
SCopE: IEC 60717:2012 applies to ca-
pacitors and resistors with unidirectional
wire terminations intended for use in elec-
tronic equipment. This standard provides
a method for determination of the space
required by capacitors and resistors with
unidirectional wire terminations. NOTE:
Instead of measuring the actual space,
it may be suf ficient to ensure that a
component fits into the maximum space
for which it is designed. This may be
achieved by means of fixed gauges. The
main technical changes with respect to
the first edition are the following: - em-
ployment of the millimetre-based grid, the
preferred grid system given in IEC 60097,
- employment of SI units only, causing
deletion of the imperial dimensions from
Table 1, - reduction of the tolerance on the
chamfer depth in Figure 1, and - introduc-
tion of requirements on information to be
given in a relevant specification.
EN 60862-2:2012
STaTuS: Published
TITlE: Sur face acoustic wave (SAW)
filters of assessed quality - Part 2: Guide-
lines for the use
SCopE: IEC 60862-2:2012 gives practi-
cal guidance on the use of SAW filters
which are used in telecommunications,
measuring equipment, radar systems and
consumer products. IEC 60862-1 should be
referred to for general information, stan-
dard values and test conditions. This part
of IEC 60862 includes various kinds of fil-
ter configuration, of which the operating
frequency range is from approximately 10
MHz to 3 GHz and the relative bandwidth
is about 0,02 % to 50 % of the centre fre-
quency. It is not the aim of this standard
to explain theory, nor to attempt to cover
all the eventualities which may arise in
practical circumstances. This standard
draws at tention to some of the more
fundamental questions, which should be
considered by the user before he places
an order for a SAW filter for a new ap-
plication. Such a procedure will be the
users insurance against unsatisfactory
performance. This edition includes the
following significant technical changes
with respect to the previous edition:
- Clause 3 Terms and definitions has
been deleted to be included in the next
edition of IEC 60862-1; - the tapered IDT
STaNdaRdS
oRGaNIZaTIoNS
CEN, the European Committee for
Standardization
CEN is a provider of European Stan-
dards and technical specifications. It
is a recognized European organization
according to Directive 98/34/EC for
the planning, draf ting and adoption
of European Standards in all areas of
economic activity with the exception
of electrotechnology (CENELEC) and
telecommunication (ETSI).
CEN- CENELEC Management Centre,
Avenue Marnix 17, B-1000 Brussels,
Belgium; + 32 2 550 08 11; Fax: + 32
2 550 08 19; www. cen. eu/cenor m/
homepage.htm
CENELEC - European Committee for
Electrotechnical Standardization
CENELECs mission is to prepare vol-
untary electrotechnical standards that
help develop the Single European Mar-
ket/European Economic Area for electri-
cal and electronic goods and services
removing barriers to trade, creating new
markets and cutting compliance costs.
17, Avenue Marnix, B-1000 Brussels,
Belgium; +32 2 519 68 71; Fax: +32 2
519 69 19; www.cenelec.org
European Telecommunications
Standards Institute
Recognized as an of ficial European
Standards Organization by the Euro-
pean Union, ETSI produces globall y
applicable standards for Information &
Communications Technologies including
fixed, mobile, radio, broadcast, internet,
aeronautical and other areas.
ETSI Secretariat: 650, Route des Lu-
cioles, 06921 Sophia-Antipolis Cedex,
France; +33 (0) 4 92 94 42 00; Fax: +33
(0) 4 93 65 47 16; info@etsi.org; www.
etsi.org
International Electrotechnical
Commission (IEC)
The IEC prepares and publishes Interna-
tional Standards for all electrical, electronic
and related technologies collectively
known as electrotechnology.
IEC Central Offce, 3, rue de Varemb, P.O.
Box 131, CH - 1211 Geneva 20, Switzerland;
+41 22 919 02 11, Fax: +41 22 919 03 00;
info@iec.ch, www.iec.ch
IECs EMC Zone: www.iec.ch/zone/emc/
emc_entry.htm
8
Standards | Europe
filter and the RSPUDT filter have been
added to the clause of SAW transversal
filters. Also DART, DWSF and EWC have
been added as variations of SPUDT; - the
balanced connection has been added to
the subclause of coupled resonator filters;
- recent substrate materials have been
described; - a subclause about packaging
of SAW filters has been added.
EN 61000-6-3:2007/A1:2011/
AC:2012
STATuS: Published
TITlE: Electromagnetic compatibilit y
(EMC) - Par t 6-3: Generic standards -
Emission standard for residential, com-
mercial and light-industrial environments.
EN 61076-3-110:2012
STATuS: Published
TITlE: Connectors for electronic equip-
ment - Product requirements - Part 3-110:
Detail specification for shielded, free and
fixed connectors for data transmission
with frequencies up to 1 000 MHz
SCopE: IEC 61076-3-110:2012 This detail
specification covers mechanical and en-
vironmental requirements, and electrical
transmission requirements for frequen-
cies up to 1 000 MHz. These connectors
can be used as category 7A connectors
in class FA cabling systems specified
in ISO/IEC 11801. The connectors are
intermateable with IEC 60603-7 series
connectors (see 3.3). The connectors are
interoperable with IEC 60603-7-7 and IEC
60603-7-71 connectors (see 3.4). The con-
nectors are backward compatible with IEC
60603-7-7 and IEC 60603-7-71 connectors
(see 3.5). This second edition cancels and
replaces the first edition, issued in 2007,
and constitutes a technical revision. This
edition includes the following significant
technical changes with respect to the pre-
vious edition: - changes in 4.5 regarding
electrical transmission performance i.e.
return loss, among other specific changes,
in compliance to the requirements of ISO/
IEC 11801, - updated text and format to be
consistent with the referenced standards,
- removal of duplication of requirements
in the IEC 60603-7 standard series, in-
troduction of transmission performance
testing procedures as specified by IEC
60512-28-100. Keywords: Free connec-
tors, Fixed connectors.
EN 61124:2012
IEC TEChNICAl Body: CLC/SR 56
STATuS: Published
TITlE: Reliability testing - Compliance
tests for constant failure rate and con-
stant failure intensity
SCopE: IEC 61124:2012 gives a number
of optimized test plans, the correspond-
ing operating characteristic curves and
expected test times. In addi tion the
algorithms for designing test plans using
a spreadsheet program are also given,
together with guidance on how to choose
test plans. This standard specifies proce-
dures to test whether an observed value
of: failure rate, failure intensity, meantime
to failure (MTTF), and mean operating
time between failures (MTBF). The main
changes with respect to the previous
edition are as follows: - A number of new
test plans have been added based on the
Russian standard GOST R 27.402 [1], and
it is intended to align the new edition
of MIL-HDBK-781 [2] with this edition.
Algorithms for optimizing test plans using
a spreadsheet program are given and a
number of optimized test plans are listed.
Furthermore, emphasis is laid on the fact
that the test should be repeated following
design changes; - Discrepancies in test
plans A, B as well as Annexes A and B
that originated in IEC 60605-7 [3], now
withdrawn, have been corrected so these
test plans differ from those given in previ-
ous editions of IEC 61124. As requested by
the National Committees, mathematical
background material and spreadsheet
program information has been moved to
informative annexes. In addition, the sym-
bol lists have been divided, so that some
annexes have separate lists of symbols;
- Guidance on how to choose test plans
has been added as well as guidance on
how to use spreadsheet programs to cre-
ate them. Test plans A.1 to A.9 and B.1 to
B.13 have been corrected; - Subcluses 8.1,
8.2, 8.3, Clause 9, Annex C, Clauses G.2,
I.2, I.3 and Annex J are unchanged, except
for updated terminology and references.
EN 61375-1:2012
IEC TEChNICAl Body: CLC/TC 9X
STATuS: Published
TITlE: Electronic railway equipment -
Train communication network (TCN) - Part
1: General architecture
SCopE: IEC 61375-1:2012 applies to the
architecture of data communication sys-
tems in open trains, i.e. it covers the ar-
chitecture of a communication system for
the data communication between vehicles
of the said open trains, the data commu-
nication within the vehicles and the data
communication from train to the ground.
The applicability of this part of IEC 61375
to the train network technologies allows
for interoperability of individual vehicles
within open trains in international traf-
fic. The main technical change of this
new edition with regard to the previous
edition consists of a new structure of the
complete IEC 61375 series.
EN 61439-6:2012
IEC TEChNICAl Body: CLC/SR 17D
STATuS: Published
TI TlE: Low-vol t age swi t chgear and
controlgear assemblies - Part 6: Busbar
trunking systems (busways)
SCopE: IEC 61439-6:2012 lays down
the definitions and states the ser vice
conditions, construction requirements,
technical characteristics and verification
requirements for low voltage BTS (see
3.101) as follows: - BTS for which the
rated voltage does not exceed 1 000 V in
case of a.c. or 1 500 V in case of d.c.; -
BTS intended for use in connection with
the generation, transmission, distribution
and conversion of electric energy, and for
the control of electric energy consuming
equipment; - BTS designed for use under
special service conditions, for example in
ships, in rail vehicles, and for domestic
applications (operated by unskilled per-
sons), provided that the relevant specific
8
Standards | Europe
filter and the RSPUDT filter have been
added to the clause of SAW transversal
filters. Also DART, DWSF and EWC have
been added as variations of SPUDT; - the
balanced connection has been added to
the subclause of coupled resonator filters;
- recent substrate materials have been
described; - a subclause about packaging
of SAW filters has been added.
EN 61000-6-3:2007/A1:2011/
AC:2012
STATuS: Published
(EMC) - Par t 6-3: Generic standards -
Emission standard for residential, com-
mercial and light-industrial environments.
EN 61076-3-110:2012
STATuS: Published
TITlE: Connectors for electronic equip-
ment - Product requirements - Part 3-110:
Detail specification for shielded, free and
fixed connectors for data transmission
with frequencies up to 1 000 MHz
SCopE: IEC 61076-3-110:2012 This detail
specification covers mechanical and en-
vironmental requirements, and electrical
transmission requirements for frequen-
cies up to 1 000 MHz. These connectors
can be used as category 7A connectors
in class FA cabling systems specified
in ISO/IEC 11801. The connectors are
intermateable with IEC 60603-7 series
connectors (see 3.3). The connectors are
interoperable with IEC 60603-7-7 and IEC
60603-7-71 connectors (see 3.4). The con-
nectors are backward compatible with IEC
60603-7-7 and IEC 60603-7-71 connectors
(see 3.5). This second edition cancels and
replaces the first edition, issued in 2007,
and constitutes a technical revision. This
edition includes the following significant
technical changes with respect to the pre-
vious edition: - changes in 4.5 regarding
electrical transmission performance i.e.
return loss, among other specific changes,
in compliance to the requirements of ISO/
IEC 11801, - updated text and format to be
consistent with the referenced standards,
- removal of duplication of requirements
in the IEC 60603-7 standard series, in-
troduction of transmission performance
testing procedures as specified by IEC
60512-28-100. Keywords: Free connec-
tors, Fixed connectors.
EN 61124:2012
IEC TEChNICAl Body: CLC/SR 56
STATuS: Published
TITlE: Reliability testing - Compliance
tests for constant failure rate and con-
stant failure intensity
SCopE: IEC 61124:2012 gives a number
of optimized test plans, the correspond-
ing operating characteristic curves and
expected test times. In addi tion the
algorithms for designing test plans using
a spreadsheet program are also given,
together with guidance on how to choose
test plans. This standard specifies proce-
dures to test whether an observed value
of: failure rate, failure intensity, meantime
to failure (MTTF), and mean operating
time between failures (MTBF). The main
changes with respect to the previous
edition are as follows: - A number of new
test plans have been added based on the
Russian standard GOST R 27.402 [1], and
it is intended to align the new edition
of MIL-HDBK-781 [2] with this edition.
Algorithms for optimizing test plans using
a spreadsheet program are given and a
number of optimized test plans are listed.
Furthermore, emphasis is laid on the fact
that the test should be repeated following
design changes; - Discrepancies in test
plans A, B as well as Annexes A and B
that originated in IEC 60605-7 [3], now
withdrawn, have been corrected so these
test plans differ from those given in previ-
ous editions of IEC 61124. As requested by
the National Committees, mathematical
background material and spreadsheet
program information has been moved to
informative annexes. In addition, the sym-
bol lists have been divided, so that some
annexes have separate lists of symbols;
- Guidance on how to choose test plans
has been added as well as guidance on
how to use spreadsheet programs to cre-
ate them. Test plans A.1 to A.9 and B.1 to
B.13 have been corrected; - Subcluses 8.1,
8.2, 8.3, Clause 9, Annex C, Clauses G.2,
I.2, I.3 and Annex J are unchanged, except
for updated terminology and references.
EN 61375-1:2012
IEC TEChNICAl Body: CLC/TC 9X
STATuS: Published
TITlE: Electronic railway equipment -
Train communication network (TCN) - Part
1: General architecture
SCopE: IEC 61375-1:2012 applies to the
architecture of data communication sys-
tems in open trains, i.e. it covers the ar-
chitecture of a communication system for
the data communication between vehicles
of the said open trains, the data commu-
nication within the vehicles and the data
communication from train to the ground.
The applicability of this part of IEC 61375
to the train network technologies allows
for interoperability of individual vehicles
within open trains in international traf-
fic. The main technical change of this
new edition with regard to the previous
edition consists of a new structure of the
complete IEC 61375 series.
EN 61439-6:2012
IEC TEChNICAl Body: CLC/SR 17D
STATuS: Published
TI TlE: Low-vol t age swi t chgear and
controlgear assemblies - Part 6: Busbar
trunking systems (busways)
SCopE: IEC 61439-6:2012 lays down
the definitions and states the ser vice
conditions, construction requirements,
technical characteristics and verification
requirements for low voltage BTS (see
3.101) as follows: - BTS for which the
rated voltage does not exceed 1 000 V in
case of a.c. or 1 500 V in case of d.c.; -
BTS intended for use in connection with
the generation, transmission, distribution
and conversion of electric energy, and for
the control of electric energy consuming
equipment; - BTS designed for use under
special service conditions, for example in
ships, in rail vehicles, and for domestic
applications (operated by unskilled per-
sons), provided that the relevant specific
9
Standards | Europe
requirements are complied with; - BTS
designed for electrical equipment of ma-
chines. Supplementary requirements for
BTS forming part of a machine are covered
by the IEC 60204 series. This first edition
of IEC 61439-6 cancels and replaces the
third edition of IEC 60439-2 (2000) and
its Amendment 1 (2005), and constitutes
a technical revision. This edition of IEC
61439-6 includes the following significant
technical changes with respect to the lat-
est edition of IEC 60439-2: - alignment on
the second edition of IEC 61439-1 (2011)
regarding the structure and technical
content, as applicable; - introduction
of new verifications, accordingly; - cor-
rection of inconsistencies in resistance,
reactance and impedance measurements
and calculations; - numerous editorial
improvements.
EN 61837-1:2012
STaTuS: Published
TITlE: Surface mounted piezoelectric
devices for frequency control and selec-
tion - Standard outlines and terminal lead
connections - Par t 1: Plastic moulded
enclosure outlines
SCopE: IEC 61837-1:2012 deals with
st andar d outlines and ter minal lead
connections as they apply to SMDs for
frequency control and selection in plastic
moulded enclosures and is based on IEC
61240.
EN 62271-107:2012
IEC TEChNICal Body: CLC/TC 17AC
STaTuS: Published
TI TlE: High-vol t age swi tchgear and
controlgear - Part 107: Alternating current
fused circuit-switchers for rated voltages
above 1 kV up to and including 52 kV
SCopE: IEC 62271-107:2012 applies to
three-pole operated units for distribution
systems that are functional assemblies
of a circuit-switcher and current-limiting
fuses designed so as to be capable of:
- breaking, at the rated recovery volt-
age, any load or fault current up to and
including the rated short-circuit breaking
current; - making, at the rated voltage,
circuits to which the rated short-circuit
breaking current applies. This second
edition cancels and replaces the first
edition, published in 2005. I t consti -
tutes a technical revision. This edition
cal changes with respect to the previous
edition. - the reference to IEC 60694 has
been changed to IEC 62271-1; - the new
clauses and subclauses from IEC 62271-1
have been added and where necessary
new wording has been provided; - the
normative references have been updated:
IEC 60265-1 to IEC 62271-103, IEC 60787
to IEC/TR 60787, IEC 60466 to IEC 62271-
201, and IEC/ TR 60787 was moved to
the bibliography; - the figures and tables
have been placed in the document where
they are first cited; - the numbering of
figures and tables has been changed to
obtain the correct order; - the definition
of NSDD was deleted. This definition is
included in IEC 62271-1; - the acceptance
criteria have been aligned with 6.101.4
of IEC 62271-103: 2011; - the various
provisions expressed about extension
of the validity of type tests have been
grouped under 6.103: some of the rules
were duplicated in Clauses 6 and 8, and
it seems better fitted to deal within each
type test sub-clause only with the type
test to be performed. Conditions have
not been changed, but the wording is
clearer; - new numbering of subclauses
in Clauses 8 and 9 to avoid conflict with
clauses from IEC 62271-1.
EN 62271-207:2012
IEC TEChNICal Body: CLC/TC 17AC
STaTuS: Published
TITlE: High-voltage switchgear and con-
trolgear - Part 207: Seismic qualification
for gas-insulated switchgear assemblies
for rated voltages above 52 kV
SCopE: IEC 62271-207:2012 applies to
gas-insulated switchgear assemblies
for alternating current of rated voltages
above 52 kV for indoor and outdoor instal-
lations, including their supporting struc-
ture. This second edition of IEC 62271-207
cancels and replaces the first edition
published in 2007. It constitutes a techni-
cal revision. This edition includes the fol-
CISPR
The principal task of CISPR, the Inter-
national Special Committee on Radio
Interference, is at the higher end of the
frequency range, from 9 kHz upwards,
preparing standards that offer protec-
tion of radio reception from interference
sources such as electrical appliances of
all types, the electricity supply system,
industrial, scientific and electromedical
RF, broadcasting receivers (sound and
TV) and, increasingly, IT equipment (ITE).
www.iec.ch/zone/emc/emc_cis.htm
International Organization for
Standardization
A developer and publisher of interna-
tional standards, ISO is comprised of a
network of the national standards insti-
tutes of 163 countries, one member per
country, with a Central Secretariat in
Geneva, Switzerland, that coordinates
the system.
ISO Central Secretariat: 1, ch. de la
Voie-Creuse, Case postale 56, CH- 1211
Geneva 20, Switzerland; +41 22 749 01
11; Fax +41 22 733 34 30; www.iso.org
GOVERNMENT SITES
CEOC International
Secretariat, Rue du Commerce 20-22,
B-1000 Brussels, Belgium; +32 2 511
5065; Fax: +32 2 502 5047; info@ceoc.
com; www.ceoc.com
EFTA (European Free Trade
Association)
Headquar ters: 9-11, rue de Varemb,
CH-1211 Geneva 20, Switzerland; +41 22
332 26 00; Fax: +41 22 332 26 77; mail.
gva@efta.int; www.efta.int
European Comm iss ion
Secretariat-General, B-1049 Brussels,
Belgium
http://ec.europa.eu
European New Legislat i ve
Framework f or market ing of
products
ht tp: //ec.europa.eu/enterprise/poli -
cies/single-market-goods/regulator y-
policies-common-rules-for-products/
new-legislative-framework
10
Standards | Europe
lowing significant technical changes with
respect to the previous edition: - modifi-
cation of the minimum voltage rating from
72,5 kV to above 52 kV; - harmonisation of
qualification procedures for GIS with IEEE
693:2005 Annex A and P by modifying the
response spectra; - modification of the
test procedures; - addition of criteria of
allowed stresses; - addition of dynamic
analysis CQC.
European Committee
for Standardization
(CEN)
CWA 16504:2012
IEC TEChnICAl Body: CEN/WS InTime
- Secure multilateral communication via
EDI in non-hierarchical networks (InTime)
STATuS: Published
dATE of puBlICATIon: 2012-08-29
TITlE: Simplified multilateral EDI - Se-
cure electronic data interchange in non-
hierarchical networks
SCopE: This workshop agreement is
intended as a guideline for the exchange
of business documents between compa-
nies by electronic communication (EDI).
Since every company has a multitude of
business relationships it is important to
keep this communication easy to handle.
Especially for small and medium sized
enterprises a new approach is necessary
because the efforts to handle bilateral
communication channels are too heavy.
The idea is to route the communication
through a central platform in the Internet
where only the data format is used which
is described in this workshop agreement.
The data format must be lightweight (to
enable companies of all sizes to commu-
nicate) and free of redundancies (so the
semantics are clear). Both aspects are
not possible with traditional data formats
like EDIFACT.
En 13032-1:2004+A1:2012
IEC TEChnICAl Body: CEN/TC 169 -
Light and lighting
STATuS: Published
Title: Light and lighting - Measurement
and presentation of photometric data of
lamps and luminaires - Part 1: Measure-
ment and file format
SCopE: This standard establishes gener-
al principles for the measurement of basic
photometric data for lighting application
purposes. It establishes the measurement
criteria needed for the standardisation
of basic photometric data and details of
the CEN file format for electronic data
transfer. In addition to it being a valuable
standard in its own right, this standard
has been written in two parts to provide
the basis of photometric measurement in
part 1 and verification and presentation
techniques for specific lighting applica-
tions in part 2.
En 13309:2010
IEC TEChnICAl Body: CEN/ TC 151
- Construction equipment and building
material machines - Safety
STATuS: Published
TITlE: Construction machinery - Electro-
magnetic compatibility of machines with
internal power supply
SCopE: This European Standard provides
test methods and acceptance criteria for
the evaluation of the electromagnetic
compatibility of construction machinery
with respect to free trade of goods in the
European Union. It deals with functional
EMC requirements under t ypical EMC
environmental conditions. This European
Standard does not deal with safety re-
quirements. Electrical and/or electronic
component(s) or separate technical unit(s)
intended to be fit ted in construction
machiner y are also dealt with in this
European Standard. The following elec-
tromagnetic disturbance phenomena are
evaluated: - broadband and narrowband
electromagnetic interference; - electro-
magnetic field immunity test; - broadband
and narrowband interference of electri-
cal/electronic sub-assemblies; - electro-
magnetic field immunity test of electrical/
electronic sub-assemblies; - electrostatic
discharge; - conducted transients. Con-
struction machinery can have DC and/or
AC internal electrical power supply sys-
tems. Machines that are designed to be
supplied by the Public Mains Network
are specifically excluded.
En 618:2002+A1:2010
- Continuous handling equipment and
systems - Safety
STATuS: Published
TITlE: Continuous handling equipment
and systems - Safety and EMC require-
ments for equipment for mechanical
handling of bulk materials except fixed
belt conveyors
SCopE: 1.1 This standard deals with the
technical requirements to minimise the
risks due to the hazards listed in clause
4, which can arise during operation and
maintenance of mechanical handling
equipment defined in clauses 3.1 to 3.3
and which are designed for continuously
conveying bulk materials from the loading
point(s) to the unloading point(s).In gen-
eral, it also applies to equipment which
are built into machines or attached to
machines. This standard deals with the
technical requirements for EMC. 1.2 The
standard does not apply to: - continuous
handling equipment and systems for
open-cast lignite mining; - continuous
underground mining; - tunnel digging
and excavating machines; - bulk material
processing or classification machines
such as grinders, crushers, screens; -
fixed belt conveyors for bulk materials.
These are covered by the standard EN
620:2002+A1:2010; - fixed pneumatic
handling equipment. These equipment
and systems are covered by the standard
EN 741; - the interface between the ma-
chinery dealt with in this standard and
the fixed belt or pneumatic conveyor.
1.3 This standard does not give the ad-
ditional requirements for: a) use in public
areas or for the transportation of people;
b) floating, dredging and ship mounted
equipment; c) conveyors requiring a high
level of cleanliness for hygiene reasons,
e.g. in direct contact with foodstuffs or
pharmaceuticals; d) transportation of the
equipment; e) hazards caused by vibra-
tion; f) use in ambient air temperature
below - 20 C and above + 40 C; g) the
effects of wind on strength and stability;
h) hazards resulting from handling specific
10
Standards | Europe
lowing significant technical changes with
respect to the previous edition: - modifi-
cation of the minimum voltage rating from
72,5 kV to above 52 kV; - harmonisation of
qualification procedures for GIS with IEEE
693:2005 Annex A and P by modifying the
response spectra; - modification of the
test procedures; - addition of criteria of
allowed stresses; - addition of dynamic
analysis CQC.
European Committee
for Standardization
(CEN)
CWA 16504:2012
IEC TEChnICAl Body: CEN/WS InTime
- Secure multilateral communication via
EDI in non-hierarchical networks (InTime)
STATuS: Published
TITlE: Simplified multilateral EDI - Se-
cure electronic data interchange in non-
hierarchical networks
SCopE: This workshop agreement is
intended as a guideline for the exchange
of business documents between compa-
nies by electronic communication (EDI).
Since every company has a multitude of
business relationships it is important to
keep this communication easy to handle.
Especially for small and medium sized
enterprises a new approach is necessary
because the efforts to handle bilateral
communication channels are too heavy.
The idea is to route the communication
through a central platform in the Internet
where only the data format is used which
is described in this workshop agreement.
The data format must be lightweight (to
enable companies of all sizes to commu-
nicate) and free of redundancies (so the
semantics are clear). Both aspects are
not possible with traditional data formats
like EDIFACT.
En 13032-1:2004+A1:2012
IEC TEChnICAl Body: CEN/TC 169 -
Light and lighting
STATuS: Published
Title: Light and lighting - Measurement
and presentation of photometric data of
lamps and luminaires - Part 1: Measure-
ment and file format
SCopE: This standard establishes gener-
al principles for the measurement of basic
photometric data for lighting application
purposes. It establishes the measurement
criteria needed for the standardisation
of basic photometric data and details of
the CEN file format for electronic data
transfer. In addition to it being a valuable
standard in its own right, this standard
has been written in two parts to provide
the basis of photometric measurement in
part 1 and verification and presentation
techniques for specific lighting applica-
tions in part 2.
En 13309:2010
- Construction equipment and building
material machines - Safety
STATuS: Published
TITlE: Construction machinery - Electro-
magnetic compatibility of machines with
internal power supply
SCopE: This European Standard provides
test methods and acceptance criteria for
the evaluation of the electromagnetic
compatibility of construction machinery
with respect to free trade of goods in the
European Union. It deals with functional
EMC requirements under t ypical EMC
environmental conditions. This European
Standard does not deal with safety re-
quirements. Electrical and/or electronic
component(s) or separate technical unit(s)
intended to be fit ted in construction
machiner y are also dealt with in this
European Standard. The following elec-
tromagnetic disturbance phenomena are
evaluated: - broadband and narrowband
electromagnetic interference; - electro-
magnetic field immunity test; - broadband
and narrowband interference of electri-
cal/electronic sub-assemblies; - electro-
magnetic field immunity test of electrical/
electronic sub-assemblies; - electrostatic
discharge; - conducted transients. Con-
struction machinery can have DC and/or
AC internal electrical power supply sys-
tems. Machines that are designed to be
supplied by the Public Mains Network
are specifically excluded.
En 618:2002+A1:2010
- Continuous handling equipment and
systems - Safety
STATuS: Published
TITlE: Continuous handling equipment
and systems - Safety and EMC require-
ments for equipment for mechanical
handling of bulk materials except fixed
belt conveyors
SCopE: 1.1 This standard deals with the
technical requirements to minimise the
risks due to the hazards listed in clause
4, which can arise during operation and
maintenance of mechanical handling
equipment defined in clauses 3.1 to 3.3
and which are designed for continuously
conveying bulk materials from the loading
point(s) to the unloading point(s).In gen-
eral, it also applies to equipment which
are built into machines or attached to
machines. This standard deals with the
technical requirements for EMC. 1.2 The
standard does not apply to: - continuous
open-cast lignite mining; - continuous
underground mining; - tunnel digging
and excavating machines; - bulk material
processing or classification machines
such as grinders, crushers, screens; -
fixed belt conveyors for bulk materials.
These are covered by the standard EN
620:2002+A1:2010; - fixed pneumatic
handling equipment. These equipment
and systems are covered by the standard
EN 741; - the interface between the ma-
chinery dealt with in this standard and
the fixed belt or pneumatic conveyor.
1.3 This standard does not give the ad-
ditional requirements for: a) use in public
areas or for the transportation of people;
b) floating, dredging and ship mounted
equipment; c) conveyors requiring a high
level of cleanliness for hygiene reasons,
e.g. in direct contact with foodstuffs or
pharmaceuticals; d) transportation of the
equipment; e) hazards caused by vibra-
tion; f) use in ambient air temperature
below - 20 C and above + 40 C; g) the
effects of wind on strength and stability;
h) hazards resulting from handling specific
11
Standards | Europe
hazardous materials, (e.g. Explosives,
radiating material); i) hazards resulting
from contact with or inhalation of harm-
ful fluids, gas, mists, fumes and dusts;
j) biological and micro-biological (viral
or bacterial) hazards; k) hazards due to
heat radiation from the materials handled.
European
Telecommunications
Standards Institute
EN 302 885-2
IEC TEChNICal Body: ERM TG26
STaTuS: Published
TITlE: Electromagnetic compatibility and
Radio spectrum Matters (ERM); Portable
Ver y High Frequency ( VHF) radiotele-
phone equipment for the maritime mobile
service operating in the VHF bands with
integrated handheld class D DSC; Part 2:
Harmonized EN covering the essential
requirements of article 3.2 of the R&TTE
Directive. Portable VHF radiotelephone
equipment
SCopE: Part 2: Harmonised standard for
handheld VHF with class D DSC (EN302
885-2)
EN 302 885-3
STaTuS: Published
Radio spectrum Matters (ERM); Portable
Ver y High Frequency ( VHF) radiotele-
phone equipment for the maritime mobile
service operating in the VHF bands with
integrated handheld class D DSC; Part 3:
Harmonized EN covering the essential re-
quirements of article 3.3(e) of the R&TTE
Directive . Portable VHF radiotelephone
equipment
SCopE: Part 3 harmonised standard for
handheld VHF with class D DSC (EN302
885-3)
EN 302 858-2
IEC TEChNICal Body: ERM TGSRR
STaTuS: Published
and Radio spectrum Matters (ERM); Road
Transport and Traffic Telematics (RTTT);
Short range radar equipment operating
in the 24,05 GHz to 24,25 GHz frequency
range for automotive application; Part 2:
Harmonized EN covering the essential
requirements of article 3.2 of the R&TTE
Directive. EN for NB SRR @ 24GHz
SCopE: Creation of EN for automotive
narrowband short range radar (SRR) op-
erating in the band 24.050 to 24.250 GHz,
to meet requirements for Vehicle Radars
(VR) in the band 24.075 - 24.150 GHz of
the revised annex 5 of ERC Rec 70-03.
EN 302 288-2
IEC TEChNICal Body: ERM TGSRR
STaTuS: Published
Radio spectrum Matters (ERM); Shor t
Range Devices; Road Transport and Traf-
fic Telematics (RTTT); Short range radar
equipment operating in the 24 GHz range;
Part 2: Harmonized EN covering the es-
sential requirements of article 3.2 of the
R&TTE Directive. SRD for UWB SRR in
24 GHz band
SCopE: RSCOM 11-07 decided to amend
the existing EC decision 2005/50/EC for
the frequency range from 22 GHz to 26,65
GHz with the sunset date 30.6. 2013 to
24,25 GHz to 26,65 GHz with the new sun-
set date January 1st 2022. This requires
an adaption of the current EN 302 288-2.
EN 305 550-2
STaTuS: Published
Radio spectrum Matters (ERM); Shor t
Range Devices (SRD); Radio equipment
to be used in the 40 GHz to 246 GHz
frequency range; Part 2: Harmonized EN
European Environment Agency
Kongens Nytorv 6, DK - 1050 Copenha-
gen K, Denmark; +45 3336 7100; Fax:
+45 33 36 71 99; http://www.efta.int
Rapex
EU consumer alerts about unsafe prod-
ucts European Commission, Health &
Consumers Directorate-General,
B 1049 Brussels, Belgium; ht tp: //
ec.europa.eu/consumers/dyna/rapex/
rapex_archives_en.cfm
INSTITUTES & TRADE
aSSoCIaTIoNS
Electromagnetic Compatibility
Industry Association
Nutwood UK Limited, Eddystone Court,
De Lank Lane, St. Breward, Bodmin,
Cornwall. PL30 4NQ; +44 (0) 1208 851
530; Fax: +44 (0) 1208 850 871
www.emcia.org
Electromagnetics Society
(aCES)
President Osama Mohammed, ECE De-
partment, Florida International Univer-
sity, 10555 W. Flagler Street, EAS-3983,
Miami, FL 33174 USA; +1-305-348-3040;
mohammed@fiu.edu;
http://aces.ee.olemiss.edu/
Energy Institute (EI)
61 New Cavendish Street, London W1G
7AR, United Kingdom; +44 (0) 20 7467
7100; Fax: +44 (0) 20 7255 1472; info@
energyinst.org
www.energyinst.org
European Federation for Non-
Destructive Testing
European Building Services scrl, 80, av-
enue de lOpale, B-1030 Brussels; Belgium
+32274 32980; Fax: 32274 32990;
www.efndt.org
European Federation of Na-
tional Associations of Measure-
ment , Testing and Analytical
Laboratories (EUROLAB)
Rue du Commerce 20-22, B-1000 Brus-
sels, Belgium, +32 2 511 5065, Fax: +32
2 502 5047; secretariat@eurolab.org
www.eurolab.org.
12
Standards | Europe
covering the essential requirements of
article 3.2 of the R&TTE Directive. SRDs
in the 40-246 GHz.
Scope: Emerging components availabil-
ity provide generic SRDs above 40GHz,
the upper limit frequency of the existing
EN 300 440. A new HS for 40 to 246 GHz
frequency range is proposed to satisfy
long standing existing frequencies as
designated by ERC Rec. 70-03 Annex 1
and will support a recommendation from
the (2006) CEPT Report 14 in response to
the EU Commission mandate to develop a
strategy to improve the effectiveness and
flexibility of spectrum availability SRDsef-
fectiveness and flexibility of spectrum
availability SRDs.
International
Electrotechnical
Commission (IEC)
cISpR/ TR 30-1 ed.1.0
Iec TechnIcal Body: CIS/F
STaTuS: Published
daTe of puBlIcaTIon: 2012-08-24
TITle: Test method on electromagnetic
emissions - Part 1: Electronic control gear
for single- and double-capped fluorescent
lamps
Scope: CISPR/TR 30-1:2012(E), which is
a technical report, details, with the aid
of reference luminaires, an independent
method by which the radio disturbance
characteristics of electronic control gear
for fluorescent lamp luminaires wi th
protection classes I and/or II may be com-
pared against the requirements of CISPR
15. This technical report covers electronic
control gear for double-capped fluores-
cent lamps fitted with G5 or G13 lamp
caps and to single-capped fluorescent
lamps fitted with lamp caps: 2GX7, 2G8,
2G10, 2G11, 2GX13, G23, GX23, G24q,
GX24q, GR8, and GR10q. It is specifically
applicable for equipment to be connected
to 230 V - 50 Hz mains power networks.
For other power systems, modifications
may be necessary. This first edition of
CISPR/TR 30-1 cancels and replaces the
first edition of CISPR/TR 30 published
in 2001. It is a technical revision which
cal changes with respect to the previous
edition:
- minor correction of wiring distances of
reference luminaire in Figure A.1;
- addition of reference luminaires for elec-
tronic control gear with output terminals
on both ends;
- addition of reference luminaires for
electronic control gear for circular-shaped
fluorescent lamps; and
- introduction of control gear marking in-
dicating suitability for application in pro-
tection class I and/or class II luminaires.
cISpR/ TR 30-2 ed1.0
Iec TechnIcal Body: CIS/F
STaTuS: Published
TITle: Test method on electromagnetic
emissions - Part 2: Electronic control gear
for discharge lamps excluding fluorescent
lamps
Scope: CISPR/TR 30-2:2012(E), which
is a technical report, details with the aid
of reference luminaires, an independent
method by which the radio disturbance
char acteristi cs of buil t-in electroni c
control gear for discharge (excluding
fluorescent) lamp luminaires with protec-
tion classes I and/or II may be compared
against the requirements of CISPR 15. The
scope of the part is limited to electronic
lamp control gear with an output power
(lamp power) up to and including 150 W.
Independent electronic lamp control gears
are not covered by this technical report;
they are within the scope of CISPR 15.
This first edition of CISPR/ TR 30-2 is
published in conjunction with CISPR/
TR 30-1. Each part of CISPR 30 series is
independent and describes the test set-up
for electronic control gear use together
with a special lamp family.
cISpR 32:2012
Iec TechnIcal Body: CIS/I - Elec-
tromagnetic compatibility of information
technology equipment, multimedia equip-
ment and receivers
STaTuS: Published
TITle: Electromagnetic compatibility of
multimedia equipment - Emission require-
ments
Scope: CISPR 32:2012 International Stan-
dard applies to multimedia equipment (MME)
having a rated r.m.s. AC or DC supply voltage
not exceeding 600 V. Equipment within the
scope of CISPR 13 or CISPR 22 is within the
scope of this publication. MME intended
primarily for professional use is within the
scope of this publication. The radiated emis-
sion requirements in this standard are not
intended to be applicable to the intentional
transmissions from a radio transmitter as
defined by the ITU, nor to any spurious
emissions related to these intentional trans-
missions. Equipment, for which emission
requirements in the frequency range covered
by this publication are explicitly formulated
in other CISPR publications (except CISPR 13
and CISPR 22), are excluded from the scope
of this publication. This document does not
contain requirements for in-situ assessment.
Such testing is outside the scope of this
publication and may not be used to demon-
strate compliance with it. This publication
covers two classes of MME (Class A and
Class B). The objectives of this publication
are to establish requirements which provide
an adequate level of protection of the radio
spectrum, allowing radio services to operate
as intended in the frequency range 9 kHz to
400 GHz and to specify procedures to ensure
the reproducibility of measurement and the
repeatability of results. The contents of cor-
rigendum of March 2012 and August 2012
have been included in this copy.
cISpR 32 ed1.0
Iec TechnIcal Body: CIS/I
STaTuS: Published
TITle: Corrigendum 2 - Electromagnetic
compatibility of multimedia equipment -
Emission requirements
Iec 60512-1-100 ed3.0
Iec TechnIcal Body: 48B - Connec-
tors
STaTuS: Published
TITle: Connectors for electronic equip-
ment - Tests and measurements - Part
1-100: General - Applicable publications
13
Standards | Europe
Scope: IEC 60512-1-100:2012 provides
a listing of the 60512 series of standards
for specific tests that are created for con-
nectors. Further it gives cross-references
with the former (60)512 standards, where
different test numbers were used. The
connect or t est s as such ar e mai nl y
identical with the previously published
standards; minor changes may be intro-
duced due to technical developments (e.g.
other soldering temperatures in soldering
tests, resulting from the introduction of
lead-free soldering). The former issues
were in booklets, with several related
tests in one document, while the present
issues are leaflets, each featuring one
single test. This third edition cancels and
replaces the second edition published in
2006. This edition constitutes a technical
revision. This new edition reflects the
status of publications in the IEC 60512
series as of 1 September, 2011.
Iec/ TR 60725 ed3.0
Iec TechnIcal Body: 77A - EMC - Low
frequency phenomena
STaTuS: Published
Title: Consideration of reference im-
pedances and public suppl y net work
impedances for use in determining the
disturbance characteristics of electrical
equipment having a rated current 75 A
per phase
Scope: IEC/TR 60725:2012, which is a
technical report, records the information
that was available and the factors that
were taken into account in arriving at
the reference impedances that were
incorporated in IEC 60555 and which
are now incorporated in some parts of
IEC 61000-3. In addition, information is
given on the impedances of public sup-
ply net works associated with ser vice
current capacities 100 A per phase. The
third edition includes brings two mainly
significant technical changes with respect
to the previous edition:
- A new survey and other data from coun-
tries with public supply networks operat-
ing at 60 Hz have been included; and
- Recommendations that were applicable
to 50 Hz systems are now mirrored by new
recommendations that are relevant to 60
Hz systems.
Iec/ TR 61000-1-6 ed1.0
Iec TechnIcal Body: 77 - Electromag-
netic compatibility
STaTuS: Published
TITle: Electromagnetic compatibilit y
(EMC) - Part 1-6: General - Guide to the
assessment of measurement uncertainty
Scope: IEC/TR 61000-1-6:2012(E), which
is a technical report, provides methods
and background information for the as-
sessment of measurement uncertainty.
It gives guidance to cover general mea-
surement uncer t aint y considerations
within the IEC 61000 series. The objec-
tives of this Technical Report are to give
advice to technical committees, product
committees and conformity assessment
bodies on the development of measure-
ment uncertainty budgets; to allow the
comparison of these budgets between
laboratories that have similar influence
quantities; and to align the treatment
of measurement uncertainty across the
EMC committees of the IEC. It gives a
description for:
- a method for the assessment of mea-
surement uncertainty;
- mathematical formulas for probability
density functions;
- analytical assessment of statistical
evaluations;
- correction of measured data; and
- documentation. This Technical Report is
not intended to summarize all measure-
ment uncertainty influence quantities nor
is it intended to define how measurement
uncertainty is to be taken into account
in determining compliance with an EMC
requirement.
I EC Syst em f or Conf ormi t y
Testing and Certification of Elec
trical Equipment (IECEE)
Executi ve Secret ar y I ECEE, c/o I EC
Central Office, 3, Rue de Varemb, PO
Box 131, 1211 Geneva 20, Switzerland;
+41 22 919 02 23; Fax: +41 22 919 03 00,
www.iecee.org
IEEE EMC Society
IEEE Corporate Office, 3 Park Avenue,
17th Floor, New York, N.Y. 10016-5997
USA; +1 212 419 7900; Fax: +1 212 752
4929;
www.ewh.ieee.org/soc/emcs
IEEE Product Safety
Engineering Society
http://ewh.ieee.org/soc/pses
iNARTE, In terna tional Associ-
ation for Radio, Telecommunica
tions and Electromagnetics
840 Queen St r eet , New Ber n, NC
2 8 5 6 0 US A ; +1- 2 5 2- 6 7 2- 0 2 0 0 ;
+1-800-89-NARTE; Fax: +1-252- 672-
0111; www.narte.org
Institution of Engineering and
Technology
Michael Faraday House, Six Hills Way,
St evenage, Her t s SG1 2AY Uni t ed
Kingdom; +44 (0)1438 313 311; Fax:
+44 (0)1438 765 526; postmaster @
theiet.org;
www.theiet.org
International Accreditation
Forum, Inc. (IAF)
IAF Secretariat, 28 Chemin Old Chelsea,
Box 1811, Chelsea, Quebec, Canada, J9B
1A0; +1 (613) 454 8159
www.iaf.nu
International Laboratory Ac-
creditation Cooperation
The ILAC Secretariat, PO Box 7507,
Silverwater, NSW 2128, Australia; +61 2
9736 8374; Fax: +61 2 9736 8373; ilac@
nata.com.au
www.ilac.org/home.html
14
This section includes information on important events in the electromagnetic compatibility community. Visit Interference Technology online
at www.interferencetechnology.eu for the latest listings. If you would like to add an event, e-mail details to Belinda Stasiukiewicz at bstas@
interferencetechnology.com
INTERNATIONAL
WORKSHOP ON ANTENNA
TECHNOLOGY
WHEN: 4-6 March 2013
WHERE: Karlsruhe, Germany
WHAT: The International Workshop on
Antenna Technology (iWAT) is an annual
forum for the exchange of information on the
progress of research and development in the
area of innovative antenna technology. Top-
ics include small antennas and applications
of advanced and artifcial materials to the
antenna design.
INFORMATION: www.iwat2013.de
EMV 2013
WHERE: Stuttgart, Germany
WHAT: Europes leading application-oriented
conference on electromagnetic compat-
ibility highlights the requirements of EMC
and provides a comprehensive information
program that includes reports on the newest
products and developments. Specialists from
all over the world are available for technical
discussion.
INFORMATION: www.mesago.de/en/EMV/
The_Conference
INTERNATIONAL VDI
CONFERENCE
PLASTICS IN AUTOMOTIVE ENGINEERING
WHERE: Mannheim, Germany
WHAT: The 37th international congress
Plastics in Automotive Engineering will
provide a comprehensive overview of the
current developments in plastics from German
manufacturers of passenger and commercial
vehicles. The congress will feature a techni-
cal conference and a trade exhibition by raw
material producers, manufacturers of plastic
processing machines, plastics processors and
system suppliers.
INFORMATION: www.vdi-wissensfo-
r um. de/en/nc/angebot /det ai l sei t e/
event/01TA701013/
SMART SYSTEMS INTE-
GRATION 2013
WHERE: Amsterdam, The Netherlands
WHAT: Smart Systems Integration allows
you to form a system out of components
which is able to gain information from the
environment, to process it electronically, to
communicate signals and data and to give
enabled feedback signal to the ambience. The
whole system is subject to the trend of todays
world: miniaturization, networking capabil-
ity, energy-autonomy and reliability. Due to
increasing complexity and multidisciplinarity
developing teams in felds of microsystems-
and nanotechnology, optics, fuidics, biology,
medical science, electronics and wireless
communication technologies face highest
demands.
INFORMATION: www.mesago.de/en/SSI/
home.htm
DESIGN, AUTOMATION AND
TEST IN EUROPE CONFER-
ENCE 2013 (DATE)
WHERE: Grenoble, France
WHAT: DATE is an international event and
networking opportunity for the design and
engineering of Systems-on-Chip, Systems-on-
Board and Embedded Systems Software. Sup-
pliers of development tools and platforms for
hardware and software development exhibit
a range of information and products including
front-end to back-end chip design, silicon test
and manufacture, system architecture and
embedded software implementation.
INFORMATION: www.date-conference.com
EuCAP 2013
WHEN: 8-12 April 2013
WHERE: Gothenburg, Sweden
WHAT: The 7th annual Conference on Anten-
nas and Propagation provides a forum for the
exchange of scientifc and technical informa-
tion on the latest results and developments
in antenna theory and technology, electro-
magnetic wage propagation and antenna
measurement techniques. Members of both
industry and academia are welcome to attend.
INFORMATION: www.eucap2013.org
EXPOELECTRONICA 2013
WHERE: Moscow, Russia
WHAT: ExpoElectronica is one of the largest
EMC
EVENTS
EMC Events
EMC_Events_EEG13.indd 6 11/16/12 5:54 PM
EDI
CON
Electronic Design
Innovations Conference
2013
March 12-14, 2013
Beijing, China
www.EDICONCHINA.com
EDI CON is an opportunity for design engineers and system integrators to learn about the latest RF/microwave
and high speed digital products, design tools and technologies for todays communication, computing,
RFID, industrial wireless monitoring, navigation, aerospace and related markets.
A focus on enhancing physical design, emerging technologies and practical
engineering solutions, brings together designers at the
forefront of Chinese innovation and the worlds
leading technology companies.
Learning to Innovate at GHz and Gbps Rates
Sponsors
Platinum
China
Media Partners
Organized by
In Partnership with
ADs_EEG13.indd 5 11/16/12 2:35 PM
14
This section includes information on important events in the electromagnetic compatibility community. Visit Interference Technology online
at www.interferencetechnology.eu for the latest listings. If you would like to add an event, e-mail details to Belinda Stasiukiewicz at bstas@
INTERNATIONAL
WORKSHOP ON ANTENNA
TECHNOLOGY
WHERE: Karlsruhe, Germany
WHAT: The International Workshop on
Antenna Technology (iWAT) is an annual
forum for the exchange of information on the
progress of research and development in the
area of innovative antenna technology. Top-
ics include small antennas and applications
of advanced and artifcial materials to the
antenna design.
INFORMATION: www.iwat2013.de
EMV 2013
WHERE: Stuttgart, Germany
WHAT: Europes leading application-oriented
conference on electromagnetic compat-
ibility highlights the requirements of EMC
and provides a comprehensive information
program that includes reports on the newest
products and developments. Specialists from
all over the world are available for technical
discussion.
INFORMATION: www.mesago.de/en/EMV/
The_Conference
INTERNATIONAL VDI
CONFERENCE
PLASTICS IN AUTOMOTIVE ENGINEERING
WHERE: Mannheim, Germany
WHAT: The 37th international congress
Plastics in Automotive Engineering will
provide a comprehensive overview of the
current developments in plastics from German
manufacturers of passenger and commercial
vehicles. The congress will feature a techni-
cal conference and a trade exhibition by raw
material producers, manufacturers of plastic
processing machines, plastics processors and
system suppliers.
INFORMATION: www.vdi-wissensfo-
r um. de/en/nc/angebot /det ai l sei t e/
event/01TA701013/
SMART SYSTEMS INTE-
GRATION 2013
WHERE: Amsterdam, The Netherlands
WHAT: Smart Systems Integration allows
you to form a system out of components
which is able to gain information from the
environment, to process it electronically, to
communicate signals and data and to give
enabled feedback signal to the ambience. The
whole system is subject to the trend of todays
world: miniaturization, networking capabil-
ity, energy-autonomy and reliability. Due to
increasing complexity and multidisciplinarity
developing teams in felds of microsystems-
and nanotechnology, optics, fuidics, biology,
medical science, electronics and wireless
communication technologies face highest
demands.
INFORMATION: www.mesago.de/en/SSI/
home.htm
DESIGN, AUTOMATION AND
TEST IN EUROPE CONFER-
ENCE 2013 (DATE)
WHERE: Grenoble, France
WHAT: DATE is an international event and
networking opportunity for the design and
engineering of Systems-on-Chip, Systems-on-
Board and Embedded Systems Software. Sup-
pliers of development tools and platforms for
hardware and software development exhibit
a range of information and products including
front-end to back-end chip design, silicon test
and manufacture, system architecture and
embedded software implementation.
INFORMATION: www.date-conference.com
EuCAP 2013
WHERE: Gothenburg, Sweden
WHAT: The 7th annual Conference on Anten-
nas and Propagation provides a forum for the
exchange of scientifc and technical informa-
tion on the latest results and developments
in antenna theory and technology, electro-
magnetic wage propagation and antenna
measurement techniques. Members of both
industry and academia are welcome to attend.
INFORMATION: www.eucap2013.org
EXPOELECTRONICA 2013
WHAT: ExpoElectronica is one of the largest
EMC
EVENTS
EMC Events
EDI
CON
Electronic Design
Innovations Conference
2013
March 12-14, 2013
Beijing, China
www.EDICONCHINA.com
EDI CON is an opportunity for design engineers and system integrators to learn about the latest RF/microwave
and high speed digital products, design tools and technologies for todays communication, computing,
RFID, industrial wireless monitoring, navigation, aerospace and related markets.
A focus on enhancing physical design, emerging technologies and practical
engineering solutions, brings together designers at the
forefront of Chinese innovation and the worlds
leading technology companies.
Learning to Innovate at GHz and Gbps Rates
Sponsors
Platinum
China
Media Partners
Organized by
In Partnership with
ADs_EEG13.indd 5 11/16/12 2:35 PM
EMC Events
16
exhibitions for electronic components and
technologies in Russia and Eastern Europe
and consists of three smaller trade fairs. The
largest, ExpoElectronica, is an international
trade fair for components, PCBs and electronic
production. ElectronTechExpo is the only trade
fair in Russia for electronics manufacturing
technology, while LEDTechExpo covers LED
solutions, chips and production facilities.
INFORMATION: http://expoelectronica.
primexpo.ru/en/
eCarTec MUNICH 2013 &
eCarTec PARIS 2013
WHEN/WHERE: 23-25 April 2013 in Munich
Germany; 16-18 April 2013 in Paris, France
WHAT: The leading trade fair for electric
mobility hosts an information conference and
an accompanying exhibition of new and de-
veloping products. Conference topics include
electric vehicles, drive and motor technique,
engineering and subcontracting, energy and
infrastructure, maintenance and parts, energy
storage technology and fnance.
INFORMATION: www.ecartec.de/index.
php?id=3&L=4; www.ecartec-paris.eu
POWER CONVERSION IN-
TELLIGENT MOTION (PCIM)
WHEN: 14-16 May 2013
WHERE: Nuremberg, Germany
WHAT: From latest developments of power
semiconductors, passive components, prod-
ucts for thermal management, new materials,
sensors as well as servo-technology and the
wide area of power quality and energy-
management - PCIM offers a comprehensive,
focused and compact presentation of products
all under one roof. Beneft from the success of
such a well established international exhibi-
tion with conference and tutorials.
INFORMATION: www.mesago.de/en/
PCIM/For_visitors/Welcome/index.htm
SVIAZ-EXPOCOMM 2013
WHEN: 14-17 May 2013
WHAT: Sviaz-Expocomm is Russias key in-
formation technology and telecommunication
event used by many overseas IT manufactur-
ers to promote their products and develop their
business in Russia. The conference showcas-
es the latest innovative products, technologies
and services and serves as a place for industry
professionals to network, promote technology
and exchange information.
INFORMATION: www.sviaz-expocomm.
ru/en
INTERNATIONAL
SYMPOSIUM ON
ELECTROMAGNETIC
THEORY (EMTS) 2013
WHEN: 20-24 May 2013
WHERE: Hiroshima, Japan
WHAT: The 21st event in a triennial series of
international symposia dating back to 1953,
EMTS 2013 covers all areas of electromag-
netic theory and its applications.
INFORMATION: http://ursi-emts2013.org/
index.html
ASIA-PACIFIC
INTERNATIONAL
SYMPOSIUM AND
EXHIBITION ON
ELECTROMAGNETIC
COMPATIBILITY
WHEN: 20-23 May 2013
WHERE: Melbourne, Australia
WHAT: The Symposium showcases devices,
components and subsystems, design and
simulation software and test and measure-
ment equipment used in the felds of micro-
waves and electromagnetic compatibility
and provides an international gathering for
all members involved in technologies associ-
ated with RF, microwaves, antennas, EMC
instrumentation and analysis software.
INFORMATION: www.apemc2013.org
2013 IEEE
EMC SYMPOSIUM
WHEN: 5-9 August 2013
WHERE: Denver, Colorado, USA
WHAT: The 2013 International EMC Sym-
posium is a comprehensive event featuring
technical information, collateral industry
meetings, professional awards, professional
development, networking social events and
companion events.
INFORMATION: http://emc2013.org
PES 2013 INTERNATIONAL
CONFERENCE ON APPLIED
ELECTROMAGNETICS
WHEN: 1-4 September 2013
WHERE: Ni, Serbia
WHAT: Conference topics include com-
putation of electromagnetic felds, inverse
electromagnetic feld problems, optimization
techniques, electromagnetic feld measure-
ment techniques, electromagnetic CAD,
EMC problems, non-linear electromagnetic
systems, bio-effects of electromagnetic felds
and EM circuits and systems.
INFORMATION: http://pes2013.elfak.
ni.ac.rs
EMC EUROPE -
INTERNATIONAL
SYMPOSIA AND
WORKSHOPS ON
ELECTROMAGNETIC
COMPATIBILITY
WHERE: Brugge, Belgium
WHAT: EMC Europe is the leading EMC Sym-
posium in Europe with a long history, created
from a series of independent EMC confer-
ences based in Worclaw, Zurich and Rome that
ran every other year. This year, EMC Europe
extends an invitation to all those working in
the feld of electromagnetic compatibility to
participate in an international forum for the
exchange of technical information on EMC to
be held in Brugge, Belgium.
INFORMATION: www.emceurope2013.eu
METAMATERIALS 2013
WHERE: Bordeaux, France
WHAT: The 7th International Congress
on Advanced Electromagnetic Materials
in Microwaves and Optics provides a
forum for members of the engineering,
physics and material science communities
working in the field of artificial electro-
magnetic materials and their applications
at various frequencies to network and
discuss the latest results of research and
development.
INFORMATION: http://congress2013.
metamorphose-vi.org
EMC Events
16
exhibitions for electronic components and
technologies in Russia and Eastern Europe
and consists of three smaller trade fairs. The
largest, ExpoElectronica, is an international
trade fair for components, PCBs and electronic
production. ElectronTechExpo is the only trade
fair in Russia for electronics manufacturing
technology, while LEDTechExpo covers LED
solutions, chips and production facilities.
INFORMATION: http://expoelectronica.
primexpo.ru/en/
eCarTec MUNICH 2013 &
eCarTec PARIS 2013
WHEN/WHERE: 23-25 April 2013 in Munich
Germany; 16-18 April 2013 in Paris, France
WHAT: The leading trade fair for electric
mobility hosts an information conference and
an accompanying exhibition of new and de-
veloping products. Conference topics include
electric vehicles, drive and motor technique,
engineering and subcontracting, energy and
infrastructure, maintenance and parts, energy
storage technology and fnance.
INFORMATION: www.ecartec.de/index.
php?id=3&L=4; www.ecartec-paris.eu
POWER CONVERSION IN-
TELLIGENT MOTION (PCIM)
WHEN: 14-16 May 2013
WHERE: Nuremberg, Germany
WHAT: From latest developments of power
semiconductors, passive components, prod-
ucts for thermal management, new materials,
sensors as well as servo-technology and the
wide area of power quality and energy-
management - PCIM offers a comprehensive,
focused and compact presentation of products
all under one roof. Beneft from the success of
such a well established international exhibi-
tion with conference and tutorials.
INFORMATION: www.mesago.de/en/
PCIM/For_visitors/Welcome/index.htm
SVIAZ-EXPOCOMM 2013
WHEN: 14-17 May 2013
WHAT: Sviaz-Expocomm is Russias key in-
formation technology and telecommunication
event used by many overseas IT manufactur-
ers to promote their products and develop their
business in Russia. The conference showcas-
es the latest innovative products, technologies
and services and serves as a place for industry
professionals to network, promote technology
and exchange information.
INFORMATION: www.sviaz-expocomm.
ru/en
INTERNATIONAL
SYMPOSIUM ON
ELECTROMAGNETIC
THEORY (EMTS) 2013
WHEN: 20-24 May 2013
WHERE: Hiroshima, Japan
WHAT: The 21st event in a triennial series of
international symposia dating back to 1953,
EMTS 2013 covers all areas of electromag-
netic theory and its applications.
INFORMATION: http://ursi-emts2013.org/
index.html
ASIA-PACIFIC
INTERNATIONAL
SYMPOSIUM AND
EXHIBITION ON
ELECTROMAGNETIC
COMPATIBILITY
WHEN: 20-23 May 2013
WHERE: Melbourne, Australia
WHAT: The Symposium showcases devices,
components and subsystems, design and
simulation software and test and measure-
ment equipment used in the felds of micro-
waves and electromagnetic compatibility
and provides an international gathering for
all members involved in technologies associ-
ated with RF, microwaves, antennas, EMC
instrumentation and analysis software.
INFORMATION: www.apemc2013.org
2013 IEEE
EMC SYMPOSIUM
WHEN: 5-9 August 2013
WHERE: Denver, Colorado, USA
WHAT: The 2013 International EMC Sym-
posium is a comprehensive event featuring
technical information, collateral industry
meetings, professional awards, professional
development, networking social events and
companion events.
INFORMATION: http://emc2013.org
PES 2013 INTERNATIONAL
CONFERENCE ON APPLIED
ELECTROMAGNETICS
WHERE: Ni, Serbia
WHAT: Conference topics include com-
putation of electromagnetic felds, inverse
electromagnetic feld problems, optimization
techniques, electromagnetic feld measure-
ment techniques, electromagnetic CAD,
EMC problems, non-linear electromagnetic
systems, bio-effects of electromagnetic felds
and EM circuits and systems.
INFORMATION: http://pes2013.elfak.
ni.ac.rs
EMC EUROPE -
INTERNATIONAL
SYMPOSIA AND
WORKSHOPS ON
ELECTROMAGNETIC
COMPATIBILITY
WHERE: Brugge, Belgium
WHAT: EMC Europe is the leading EMC Sym-
posium in Europe with a long history, created
from a series of independent EMC confer-
ences based in Worclaw, Zurich and Rome that
ran every other year. This year, EMC Europe
extends an invitation to all those working in
the feld of electromagnetic compatibility to
participate in an international forum for the
exchange of technical information on EMC to
be held in Brugge, Belgium.
INFORMATION: www.emceurope2013.eu
METAMATERIALS 2013
WHERE: Bordeaux, France
WHAT: The 7th International Congress
on Advanced Electromagnetic Materials
in Microwaves and Optics provides a
forum for members of the engineering,
physics and material science communities
working in the field of artificial electro-
magnetic materials and their applications
at various frequencies to network and
discuss the latest results of research and
development.
INFORMATION: http://congress2013.
metamorphose-vi.org
EMC_Events_EEG13.indd 8 11/16/12 5:54 PM ADs_EEG13.indd 6 11/16/12 2:36 PM
EMC Events
18
InternatIonal
electronIcs Forum 2013
WHen: 2-4 October 2013
WHere: TBD
WHat: No location confrmed
WHAT: Future Horizons presents its 24th an-
nual International Electronics Industry Forum
to provide the industry with developments
in the electronics industry. Topics include
advanced research, equipment and materials,
semiconductor and OEM system design and
production, and IP and EDA. Speakers and
world-leading experts from across the globe
will be available to participate in seminars
and debates.
InFormatIon: www.futurehorizons.com/
page/127/International-Electronics-Forum
euroPean
mIcroWaVe WeeK
WHere: Nuremburg, Germany
WHat: The European Microwave Week
is a 5-day event that provides seminars,
workshops and discussion groups where
attendees can discuss relevant microwave,
RF, wireless, defense/security and radar is-
sues with leading manufacturers, institutes
and industry bodies. EMW consists of
three conferences: The European Micro-
wave Conference (EuMC), the European
Microwave Integrated Circuits Conference
(EuMIC) and the European Radar Confer-
ence (EuRAD).
InFormatIon: www.eumweek.com
InnoVatIVe smart GrID
tecHnoloGIes
euroPe 2013
WHen: 6-9 October 2013 (preliminary)
WHere: Copenhagen, Denmark (preliminary)
WHat: The 4th European conference and
exhibition on innovative smart grid tech-
nologies is an international forum for the
participants to address and discuss the
current development and state-of-the-art
innovation in smart grids. The conference
features sessions, panels and tutorials by
international experts on smart grids.
InFormatIon: /www.ieee-isgt-2012.eu
emc uK eXHIBItIon anD
conFerence
WHere: Newbury, United Kingdom
WHat: EMC UK is a targeted networking
event ideal for any members of a business
that designs and manufactures electrical
or electronic systems. The event will give
designers and test engineers a chance to
meet and discuss EMC issues, problems
or test requirements. Discussion sessions
hosted by panels of experts will cover
EMC in defense systems, EMV in buildings
and infrastructure, EMC in transport sys-
tems and EMV in consumer electronics,
including diagnostics and smart grid/me-
tering. Full CISPR 16-1-1 compliance test
systems for the evaluation of completed
products will also be available.
InFormatIon: www.emcuk.co.uk
InternatIonal
eXHIBItIon oF testInG
eQuIPment, sYstems
anD tecHnoloGIes For
tHe aerosPace InDustrY
WHere: Moscow, Russia
WHat: In 2013, the International Ex-
hibition of Testing Equipment, Systems
and Technologies of Aerospace Industry
Aerospace Testing Russia will celebrate
its 10th anniversary. Aerospace Testing
Russia presents the latest developments
and unique methods of aerospace tech-
nique, component and subsystem testing
to specialists of aerospace sector of Rus-
sia and CIS countries.
InFormatIon: www.aerospace-expo.
ru/eng
ID WorlD
InternatIonal
conGress
WHen: 5-7 November 2013
WHere: Frankfurt, Germany
WHat: The ID World International Con-
gress showcases new developments in
the evolving world of RFID, biometrics
and smart card technologies and explores
the fundamental issues associated with
automatic identification in a variety of
market segments. The Congress is broken
down into a conference, a networking
event and an exhibition.
InFormatIon: www.mesago.de/en/
IDW/home.htm
Ieee GloBecom 2013
WHen: 9-13 December 2013
WHere: Atlanta, GA, US
WHat: The Gl obal Communi cat i on
Conference is an annual conference,
exhibition and industry forum on theories
and technologies on the management of
emerging networks and services. Globe-
com 2013 features tutorials and work-
shops on technical and business issues
in communications technologies as well
as an exhibition showcasing the latest
technologies, applications and services.
InFormatIon: www.ieee-globecom.
org/2013/#.UFytZlFOhdA
emc comPo 2013
WHere: Nara, Japan
WHat: The 9th International Workshop on
Electromagnetic Compatibility of Integrated
Circuits provides information on the latest
research achievements and experience in
IC-level EMC and welcomes researchers
both from industry and from academia
backgrounds.
InFormatIon: www.emccompo2013.org
emV semInare 2013
WHen: TBD
WHere: Munich and Stuttgart, Germany
WHat: EMV Seminare is a series of full-
day seminars hosted by Mesago designed
to provide par ticipants with current,
application-specific, vendor-neutral infor-
mation and training on the subject of EMC.
InFormatIon: http://www.mesago.
de/de/EMV-Seminare/home.htm
2013 Asia-Pacific International Symposium and
Exhibition on Electromagnetic Compatibility
20-23 May 2013, Melbourne, Australia
Prospective authors are invited to submit original papers on their latest research results.
Suggested topics are (papers on other, EMC related topics are welcome):
Important Dates
Proposals for topical meetings, industry fora
workshops and tutorials 29 October 2012
Preliminary paper submissions 30 November 2012
Notification of acceptance 31 January 2013
Final paper submission 15 March 2013
All submissions must be electronic. Font embedding must be IEEE Xplore compatible. No hardcopies
shall be accepted. Details are given on the symposium website: apemc2013.org
2013 ASIA-PACIFIC
EMC Symposium
apemc2013.org
Call for Papers
Computational EM
Signal Integrity
Power Integrity
IC and Semiconductor EMC
Meas. Methods & Stds
Lightning EM
HPEM
ESD
Power System EMC
EM Protection
System Level EMC
EM Leakage
Wireless Comm. EMC
Wireless Power EMC
Transportation EMC
Aerospace EMC
Advancements in EMC
Radioastronomy EMC
Biomedical EMC
EMF in EMC
The 2013 Asia-Pacific International Symposium and Exhibition on EMC will be hosted in
Melbourne, Australia.
The symposium will cover the entire scope of electromagnetic compatibility and include
emerging technologies. It will comprise regular sessions and special session, poster
presentations, workshops and tutorials, an industry forum, and a trade exhibition.
Mark the dates in your diary and visit the symposium website for more information.
EMC Society
of Australia
ADs_EEG13.indd 7 11/16/12 2:37 PM
EMC Events
18
InternatIonal
electronIcs Forum 2013
WHere: TBD
WHat: No location confrmed
WHAT: Future Horizons presents its 24th an-
nual International Electronics Industry Forum
to provide the industry with developments
in the electronics industry. Topics include
advanced research, equipment and materials,
semiconductor and OEM system design and
production, and IP and EDA. Speakers and
world-leading experts from across the globe
will be available to participate in seminars
and debates.
InFormatIon: www.futurehorizons.com/
page/127/International-Electronics-Forum
euroPean
mIcroWaVe WeeK
WHere: Nuremburg, Germany
WHat: The European Microwave Week
is a 5-day event that provides seminars,
workshops and discussion groups where
attendees can discuss relevant microwave,
RF, wireless, defense/security and radar is-
sues with leading manufacturers, institutes
and industry bodies. EMW consists of
three conferences: The European Micro-
wave Conference (EuMC), the European
Microwave Integrated Circuits Conference
(EuMIC) and the European Radar Confer-
ence (EuRAD).
InFormatIon: www.eumweek.com
InnoVatIVe smart GrID
tecHnoloGIes
euroPe 2013
WHen: 6-9 October 2013 (preliminary)
WHere: Copenhagen, Denmark (preliminary)
WHat: The 4th European conference and
exhibition on innovative smart grid tech-
nologies is an international forum for the
participants to address and discuss the
current development and state-of-the-art
innovation in smart grids. The conference
features sessions, panels and tutorials by
international experts on smart grids.
InFormatIon: /www.ieee-isgt-2012.eu
emc uK eXHIBItIon anD
conFerence
WHere: Newbury, United Kingdom
WHat: EMC UK is a targeted networking
event ideal for any members of a business
that designs and manufactures electrical
or electronic systems. The event will give
designers and test engineers a chance to
meet and discuss EMC issues, problems
or test requirements. Discussion sessions
hosted by panels of experts will cover
EMC in defense systems, EMV in buildings
and infrastructure, EMC in transport sys-
tems and EMV in consumer electronics,
including diagnostics and smart grid/me-
tering. Full CISPR 16-1-1 compliance test
systems for the evaluation of completed
products will also be available.
InFormatIon: www.emcuk.co.uk
InternatIonal
eXHIBItIon oF testInG
eQuIPment, sYstems
anD tecHnoloGIes For
tHe aerosPace InDustrY
WHere: Moscow, Russia
WHat: In 2013, the International Ex-
hibition of Testing Equipment, Systems
and Technologies of Aerospace Industry
Aerospace Testing Russia will celebrate
its 10th anniversary. Aerospace Testing
Russia presents the latest developments
and unique methods of aerospace tech-
nique, component and subsystem testing
to specialists of aerospace sector of Rus-
sia and CIS countries.
InFormatIon: www.aerospace-expo.
ru/eng
ID WorlD
InternatIonal
conGress
WHen: 5-7 November 2013
WHere: Frankfurt, Germany
WHat: The ID World International Con-
gress showcases new developments in
the evolving world of RFID, biometrics
and smart card technologies and explores
the fundamental issues associated with
automatic identification in a variety of
market segments. The Congress is broken
down into a conference, a networking
event and an exhibition.
InFormatIon: www.mesago.de/en/
IDW/home.htm
Ieee GloBecom 2013
WHere: Atlanta, GA, US
WHat: The Gl obal Communi cat i on
Conference is an annual conference,
exhibition and industry forum on theories
and technologies on the management of
emerging networks and services. Globe-
com 2013 features tutorials and work-
shops on technical and business issues
in communications technologies as well
as an exhibition showcasing the latest
technologies, applications and services.
InFormatIon: www.ieee-globecom.
org/2013/#.UFytZlFOhdA
emc comPo 2013
WHere: Nara, Japan
WHat: The 9th International Workshop on
Electromagnetic Compatibility of Integrated
Circuits provides information on the latest
research achievements and experience in
IC-level EMC and welcomes researchers
both from industry and from academia
backgrounds.
InFormatIon: www.emccompo2013.org
emV semInare 2013
WHen: TBD
WHere: Munich and Stuttgart, Germany
WHat: EMV Seminare is a series of full-
day seminars hosted by Mesago designed
to provide par ticipants with current,
application-specific, vendor-neutral infor-
mation and training on the subject of EMC.
InFormatIon: http://www.mesago.
de/de/EMV-Seminare/home.htm
2013 Asia-Pacific International Symposium and
Exhibition on Electromagnetic Compatibility
20-23 May 2013, Melbourne, Australia
Prospective authors are invited to submit original papers on their latest research results.
Suggested topics are (papers on other, EMC related topics are welcome):
Important Dates
Proposals for topical meetings, industry fora
workshops and tutorials 29 October 2012
Preliminary paper submissions 30 November 2012
Notification of acceptance 31 January 2013
Final paper submission 15 March 2013
All submissions must be electronic. Font embedding must be IEEE Xplore compatible. No hardcopies
shall be accepted. Details are given on the symposium website: apemc2013.org
2013 ASIA-PACIFIC
EMC Symposium
apemc2013.org
Call for Papers
Computational EM
Signal Integrity
Power Integrity
IC and Semiconductor EMC
Meas. Methods & Stds
Lightning EM
HPEM
ESD
Power System EMC
EM Protection
System Level EMC
EM Leakage
Wireless Comm. EMC
Wireless Power EMC
Transportation EMC
Aerospace EMC
Advancements in EMC
Radioastronomy EMC
Biomedical EMC
EMF in EMC
The 2013 Asia-Pacific International Symposium and Exhibition on EMC will be hosted in
Melbourne, Australia.
The symposium will cover the entire scope of electromagnetic compatibility and include
emerging technologies. It will comprise regular sessions and special session, poster
presentations, workshops and tutorials, an industry forum, and a trade exhibition.
Mark the dates in your diary and visit the symposium website for more information.
EMC Society
of Australia
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The trade show dedicated to radiofrequencies,
microwaves, wireless and fibre optics
www.microwave-rf.com
EXHI BI TI ON - CONFERENCES - ANI MATI ONS
10 & 11, April 2013
Paris Expo Porte de Versailles
France
2nd
edition
Organization
Pub microwave 210x297 N1032:Pub microwave 210x297 N1013 26/09/12 11:27 Page1
ADs_EEG13.indd 9 11/16/12 2:38 PM
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The trade show dedicated to radiofrequencies,
microwaves, wireless and fibre optics
www.microwave-rf.com
EXHI BI TI ON - CONFERENCES - ANI MATI ONS
10 & 11, April 2013
Paris Expo Porte de Versailles
France
2nd
edition
Organization
Pub microwave 210x297 N1032:Pub microwave 210x297 N1013 26/09/12 11:27 Page1
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EMCEurope2013,Brugge
September26,2013
Brugge,Belgium
BRUGGE2013
BRUGGE2013
FirstCallforPapers
EMCweekinBrugge
EMCEuropeistheleadingEMCSymposiuminEuropeandthe2013edition
will be held at the University College KHBO in Brugge, Belgium, from
September2
nd
tillSeptember6
th
,2013.Wewishtoinviteandencourageall
thoseworkinginthefieldofelectromagneticcompatibilitytoparticipatein
thisprestigiousevent.
EMC research and conferences in Europe have a long tradition. From the
series of independent EMC Symposia based in Wroclaw, Zurich and Rome
running every second year, has emerged EMC Europe which is organised
every year in a European city to provide an international forum for the
exchangeoftechnicalinformationonEMC.
EMC Europe 2013, Brugge, will consist of 5day oral and poster
presentations, workshops, tutorials, special sessions, shortcourses,
industrial forum, and exhibits. Accepted papers will appear in IEEE Xplore.
Prospective authors are invited to submit original papers on their latest
researchresults.Selectedpapersafterrevisionwillbepresentedinoraland
postersessions.
Thepreliminaryprogram,registrationform,informationonaccommodation
andsocialactivitieswillbeavailableonthewebsite
(www.emceurope2013.eu)induetime.
SymposiumVenue
Known as the Venice of the North, Brugge is one of the most beautiful
citiesinEurope!ItwasajustifiedmotivethatpromptedUNESCOin2000
to include the entire historical city centre on the World Heritage list.
Walking along the maze of winding cobbled alleys and romantic canals,
youimagineyourselftobeinmedievaltimes.Thewealthofmuseumsisa
strikingimageofthiscity'sstirringhistory.
Brugge is also home to contemporary culture, such as the new Concert
Hall, which is one of the most prominent music houses in Flanders. The
restaurants in Brugge which offer gastronomic cuisine and the exclusive
hotelsareatruefeastforthosewhoenjoythegoodthingsinlife.
Importantdates
Papersubmission
February15,2013
ProposalforWorkshopsandTutorials
March15,2013
NotificationofAcceptance
April30,2013
FinalPaperSubmission
May30,2013
Submissionofpapers
Authors are invited to submit original papers in the areas listed below,
focussing on EMC aspects. Prospective authors should submit their full
paper (4/6 pages, 2column) by February 15, 2013. The paper should
clearly explain the originality and the relevance to EMC, and should be
uploaded in electronic format to the website of the symposium. The
guidelinestouploadwillappearonthewebsitewww.emceurope2013.eu.
Allsubmittedpaperswillbeevaluatedbyapeerreviewprocess.
Authorswhosepapersareacceptedforpresentationwillberequestedto
providethefinalpaper(4/6pages,2columninIEEEformat)byMay30,
2013.
Poster sessions and special sessions will stimulate more in depth
discussionsonsometopics.
TechnicalAreas
1. Electromagnetic Environment, Lightning, ESD, Transients, High Power
Electromagnetics,IntentionalEMI&EMP
2. EMCundernonlinearandmultiplephenomenaconditions
3. TransmissionLines,Cables,Crosstalk,CouplingPaths
4. Shielding,Gaskets,Filters,Grounding
5. Measurement & Instrumentation, Chambers & Cells, Antennas, Near Field
techniques
6. ComputationalElectromagnetics,CodeValidation
7. Modellingofsystems,circuitsandcomponents,ModelValidation
8. Apparatus,PCB,ElectronicPackaging&Integration,Semiconductors
9. EMC behaviour over the life cycle and due to aging and environmental
conditions
10. SignalIntegrity&PowerIntegrityofcircuitry
11. PowerSystems,PowerQuality,PowerElectronics,SmartGrids
12. Wired&WirelessRFCommunications,UWB,BPL,datanetworksandfield
busses
13. Automotive,RailwaySystems,NavalSystems,Aircraft&SpaceSystems
14. FunctionalSafetyofmachinesandsystems
15. AdvancedMaterials&NanotechnologyrelatedtoEMCapplications
16. StandardsandRegulations
17. EMCManagement,EMC(risk)assessment
18. EMCEducation
19. HumanExposuretoEMfields,Biologicaleffects
20. Anyotherrelevanttopicorissue
Committees
InternationalSteeringCommittee&AdvisoryBoard
J.L.terHaseborg,Chairman(Germany)
H.Garbe,ViceChairman(Germany)
InternationalSteeringCommittee
P.Besnier(France) F.G.Canavero(Italy)
J.Catrysse(Belgium) J.Carlsson(Sweden)
G.C.Cerri(Italy) C.Christopoulos(UK)
M.DAmore(Italy) P.Degauque(France)
M.Feliziani(Italy) A.Karwowski(Poland)
Z.Joskiewicz(Poland) F.B.J.Leferink(NL)
M.Klingler(France) A.Marvin(UK)
F.Maradei(Italy) D.Pissoort(Belgium)
G.Peres(France) M.Ramdani(France)
F.Rachidi(Switserland) M.S.Sarto(Italy)
F.Sabath(Germany) A.P.J.vanDeursen(NL)
F.Silva(Spain) T.W.Wieckowski(Poland)
J.Welinder(Sweden)
InternationalAdvisoryBoard
J.Drewniak(USA) ErpingLi(Singapore)
O.Fujiwara(Japan) D.Hoolihan(USA)
T.Hubing(USA) JounghoKim(Korea)
N.Korovkin(Russia) D.C.Pande(India)
G.Pettit(USA) O.Ramahi(Canada)
C.Sartori(Brasil) F.Schlagenhaufer(AUS)
WenYanYin(China) P.Wilson(USA)
XiangCui(China)
LocalOrganizingCommittee
Chair: JohanCatrysse,KHBOKULeuven
CoChair: DavyPissoort,KHBOKULeuven
Organization: JosWesthofJacobs,Rohde&Schwarz
ChristianBrull,SchlegelEMI
GeorgesGielen,KULeuven
GuyVandenbosch,KULeuven
RenaudGillon,OnSemiconductor
VeroniqueBeauvois,ULG
HerbertDeGersem,KULeuvenKULAK
DirkVanTroyen,LaboDeNayer
MarcCumps,Agoria
HugoPues,Melexis
RamiroSerra,TUEindhoven
CeesKeyer,HogeschoolAmsterdam
ContactandInformation
Forfurtherinformationdonothesitatetocontacttheorganizingcommittee:
info@emceurope2013.eu.
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interferencetechnology.eu INTERFERENCE TECHNOLOGY
25
Contents | United Kingdom
Michael Faraday was an English scientist who
contributed to the elds of electromagnetism and
electrochemistry.
Faraday researched the magnetic eld around
a conduct or car r yi ng a di r ect cur r ent and
established the basis for the concept of the
electromagnetic eld in physics. After electric
currents were discovered, he built a device of a
hinged wire, a magnet and a chemical battery.
When the current was turned on, a magnetic eld
was set up in the wire, and it began to spin around the magnet creating an electric motor.
He also discovered the principle of electromagnetic induction, diamagnetism and the laws
of electrolysis. The SI unit of capacitance, the farad, is named for Faraday.
Albert Einstein kept a picture of Faraday on his study wall next to scientists Isaac Newton
and James Clerk Maxwell.
Michael
Faraday (17911867)
PRODUCTS & SERVICES
RESOURCES
ARTICLES
Investigation of Vehicle Radiated
Emissions Measurement Practices
ALASTAIR R. RUDDLE, PH.D., Project engineer, MIRA Limited
New Voltage Sag Testing Requirements
for Industrial Equipment
ANDREAS EBERHARD, Vice President, Power Standards Lab
Surge Protective Devices (SPDs)
and Short Circuit Currents
BRYAN COLE, President, Technology Research Council
JIM TIESI, Marketing Manager, Emerson Network Power Surge Protection
26
34
36
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N
I
T
E
D
K
I
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G
D
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25
Contents | United Kingdom
Michael Faraday was an English scientist who
contributed to the elds of electromagnetism and
electrochemistry.
Faraday researched the magnetic eld around
a conduct or car r yi ng a di r ect cur r ent and
established the basis for the concept of the
electromagnetic eld in physics. After electric
currents were discovered, he built a device of a
hinged wire, a magnet and a chemical battery.
When the current was turned on, a magnetic eld
was set up in the wire, and it began to spin around the magnet creating an electric motor.
He also discovered the principle of electromagnetic induction, diamagnetism and the laws
of electrolysis. The SI unit of capacitance, the farad, is named for Faraday.
Albert Einstein kept a picture of Faraday on his study wall next to scientists Isaac Newton
and James Clerk Maxwell.
Michael
Faraday (17911867)
PRODUCTS & SERVICES
RESOURCES
ARTICLES
ALASTAIR R. RUDDLE, PH.D., Project engineer, MIRA Limited
New Voltage Sag Testing Requirements
for Industrial Equipment
ANDREAS EBERHARD, Vice President, Power Standards Lab
BRYAN COLE, President, Technology Research Council
JIM TIESI, Marketing Manager, Emerson Network Power Surge Protection
26
34
36
UK_TOC_EEG13.indd 25 11/16/12 3:35 PM
26
United Kingdom | Products & Services
1-9
3C Test Ltd.
Silverstone Technology Park, Silverstone Circuit,
Nor thamptonshire NN12 8GX, United Kingdom;
+44(0)1327 857500; Fax: +44(0)1327 857747;
Pete Sheppard, sales@3ctest.co.uk; www.3ctest.co.uk
Products and Services: Testing
A
A.H. Systems
SystemWare Europe, Bedfordshire, United Kingdom;
+44(0)1462 734777; Fax: +44(0)1462 835777;
enquiries@sysware-europe.com;
www.AHSystems.com
Products and Services: Antennas, Test Instrumenta-
tion, Testing
Aaronia UK
Bellringer Road, Trentham, Lakes South, Stoke-on-Trent,
ST4 8GB Staffordshire, United Kingdom;
+44(0)845-4379092; Fax: +44(0)870-8700001;
sales@aaronia.co.uk; www.aaronia.co.uk
Products and Services: Antennas, Shielding, Test
Instrumentation
Accurate Controls Ltd.
25 Cowley Road, Nuffeld Industrial Estate, Poole, Dorset,
United Kingdom, BH17 0UJ;
+44(0)1202 678108; Fax: +44(0)1202 670161;
Paul Gibbens, pgibbens@accurate-controls.ltd.uk;
www.accurate-controls.ltd.uk
Products and Services: Test Instrumentation
AEF Solutions
Unit 46, Thomas Way, Lakesview Business Park, Hersdon,
Canterbury, CT3 4JJ, United Kingdom;
+44(0)1227 711455; Fax: +44(0)2380 455022;
Paul Lawrence, paull@aefsolutions.com;
Products and Services: Filters, Cables & Connectors,
Surge & Transients, Miscellaneous
Aerofex Test Solutions
Longacres House, Six Hills Way,
Stevenage, SG1 2AN, United Kingdom;
+44 1438 742200; Fax: +44 1438 727601;
www.aerofex.com
Agilient Technologies UK Ltd.
5 Lochside Avenue, Edinburgh Park,
Edinburgh, EH12 9DJ, United Kingdom,
+44 (0)131 452 0200; Fax: +44 (0)131 452 0419;
www.agilent.com
Albacom Ltd.
George Buckman Drive,
Dundee, DD2 3SP United Kingdom;
+44(0)1382 889311; +44(0)1382 810171;
Martin Mackin, m.mackin@albacom.co.uk;
Products and Services: Amplifers
Albatross Projects GmbH
Daimlerstrae 17, 89564 Nattheim, Germany;
+49 7321 730 500; Fax: +49 7321 730 590;
info@albatross-projects.com;
www.albatross-projects.com
Products and Services: Shielded Rooms & Enclosures,
Anechoic Chambers
Alrad Instruments Ltd.
Alder House, Turnpike Road Industrial Estate,
Newbury, Berkshire, RG14 1NS, United Kingdom;
+44(0)1635 32630,
sales@alrad.co.uk,
www.alrad.co.uk
Anritsu EMEA Ltd.
200 Capability Green,
Luton, Beds, LU1 3LU, United Kingdom;
+44 (0)1582 433280; Fax: +44 (0)1582 731303;
salesadministration@anritsu.com;
www.eu.anritsu.com
Products and Services: Test Instrumentation, Testing
Ansys UK, Ltd.
First Floor, 8 Bracknell Beeches, Old Bracknell Lane West,
Bracknell, Berks, RG12 7BW, United Kingdom; +44 (0)
1344767550; Fax: 44 (0) 1344767551;
ukinfo@ansys.com; www.ansys-uk.com
Products and Services: EMC Design Software
Applied Coating
Technologies Ltd.
Tipton Road, Tividale,
Oldbury B69 3HY. United Kingdom;
+44 (0)121 557 5324; Fax: +44 (0)121 557 7064;
info@applicoat.com; www.applicoat.com
Products and Services: Conductive Materials
AQL EMC Limited
16 Cobham Road, Ferndown Industrial Estate,
Wimborne, Dorset, BH21 7PG United Kingdom; +44(0)1202
861175; Fax: +44(0)1202 861176;
www.aqlemc.co.uk
Products and Services: Consultancy, Testing
AR United Kingdom Ltd.
Unit 8 TORC MK, Chippenham Drive, Kingston, Milton
Keynes , England Bucks MK10 OAE;
+44(0)1908 282766; Fax: +44(0)1908 288249;
Dr. Tom Cantle, TCantle@ARWorld.US;
www.arukltd.co.uk
Products and Services: Amplifers, Antennas, Cables
& Connectors, Shielded Rooms & Enclosures, Surge &
Transients, Test Instrumentation
Arrow Europe
Arrow Advantage UK, london Road Campus,
London Road, Harlow Essex CM179NA;
+44 1279 626777; www.arroweurope.com
Products and Services: Ferrites, Cables & Connectors,
Power Applications
B
BAE Systems
Faraday Test Centre, Marconi Way,
Rochester, Kent. ME1 2XX, United Kindom;
+44(0)1634205155;
Faraday.test@baesystems.com;
www.baesystems.com/faradaytestcentre
BFi OPTiLAS Ltd.
Mill Court, Wolverton Mill South,
Milton Keynes MK 12 5EU, United Kingdom;
+44(0)1908 326326; Fax: +44(0)1908 221110;
sales.uk@bfoptilas.com;
www.bfoptilas.co.uk
Products and Services: Shielding, Testing
Blackwood Labs
8 Woodfeldside Business Park, Pontllanfraith,
Blackwood, NP12 2DG, United Kingdom;
+44(0)1495 229219;
test@blackwood-labs.co.uk;
www.blackwood-labs.co.uk;
Brand-Rex Ltd.
Viewfeld Industrial Estate,
Glenrothes, Fife., KY6 2RS United Kingdom;
PRODUCTS &
SERVICES
27
Products & Services | United Kingdom
+44(0)1592 772124; Fax: +44(0)1592 775314;
Audrey OBrien, aobrien@brand-rex.com;
www.brand-rex.com
Products and Services: Cables & Connectors
BRE Ltd.
Bucknalls Lane,
Watford, WD25 9XX United Kingdom;
+44(0)1923 664000;
enquiries@bre.co.uk; www.bre.co.uk
Brian Jones
89 Widney Road, Knowle,
Solihull B93 9EA, United Kingdom;
+44(0)1564 773319;
Fax: +44(0)1564 773319; emc@brianjones.co.uk
Products and Services: EMC Consultant and Com-
petent Body Signatory specializing in standards and
regulations
Bulgin
Melville Court, Spilsby Road,
Romford, Essex, Great Britain, RM3 8SB;
+44(0)1708 343800;
europe@elektron-technology.com; www.bulgin.co.uk
Products and Services: Filters
C
Cabletec ICS Ltd.
Sunnyside Road, Weston-super-Mare, North Somerset,
BS23 3PZ, United Kingdom; +44(0)1934 424900; Fax:
+44(0)1934 636632; Karen French, sales@cabletec.com;
www.cabletec.com
Products and Services:Shielding
Caltest Instruments Ltd.
4 Riverside Business Centre, Walnut Tree Close,
Guildford, Surrey GU1 4UG, United Kingdom;
+44 (0) 1483 302 700; Fax: +44 (0) 1483 300 562;
info@caltest.co.uk; www.caltest.co.uk
Carlisle Interconnect Technologies
United Kingdom;
+44-7817-731-000;
Andy Bowne, Andy.Bowne@carlisleit.com;
www.CarlisleIT.com
CASS Industries Ltd.
Blackbrook Trading Estate Weybrook Road, Levenshulme,
Manchester, M19 2QD United Kingdom; +44(0)1614
424200; Fax: +44(0)1614 424283;
www.cassindustries.com
CCQS UK Ltd.
Level 7, CEC Westgate, Westgate House,
Westgate Road, London, W5 1YY, United Kingdom;
+44 (0)20 8991 3488; info@ccqs.co.uk; www.ccqsuk.co.uk
Products and Services: Certifcation Services
Cherry Clough Consultants
9 Bracken View, Brocton,
Stafford, Staffs, ST17 0TF, United Kingdom;
+44(0)1785 660247;
Keith Armstrong; keith.armstrong@cherryclough.com;
www.cherryclough.com
Products and Services: Training, Seminars & Work-
shops, Design and Management Consultancy
Cobham Microwave
148 Stocks Lane, Bracklesham Bay, Chichester,
West Sussex, PO20 8NT United Kingdom;
+44(0)1243 670711; Fax: +44(0)1243 672907;
Dean Terrett, Key Account Manager;
DeanTerrett@cobham.com;
www.cobham.com/microwave
Products and Services: Antennas, Cables & Connec-
tors, Filters, Shielded Rooms & Enclosures
Conformance Services Ltd.
24 Tidnock Avenue, Congleton,
Cheshire, CW12 2HW United Kingdom;
+44(0)1260 270729; Fax: +44(0)1260 270729;
enquiries@conformance-services.com;
www.conformance-services.com
Coreshield
St. Margarets School, Gosfeld Hall Park,
Gosfield, Halstead, Essex, CO9 1SE, Great Britain;
+44(0)1787 472134; Fax: +44(0)1787 473589;
info@coreshield.eu;www.coreshield.eu
Products and Services: Shielding
Communications & Power
Industries Europe Ltd.
Surrey, England,
+44 (1932) 256 930; Fax: +44 (1932) 241 271;
Tony Johns, tony.johns@cpii.com;
Donna Crittenden; donna.crittenden@cpii.com;
www.cpii.com
Products and Services: Amplifers, Microwave Power
Cranage EMC & Safety
Market Drayton, Shropshire, United Kingdom;
+44(0)1630 658568; Fax: +44(0)1630 658921;
info@cranage.co.uk; www.cranage.co.uk
Products and Services: Testing Labs
Cre8 Associates Ltd.
Bruntingthorpe Proving Ground, Bath Lane,
Lutterworth, Leicestershire, LE17 5QS, Great Britain;
+44(0)1162 479787;
enquiries@cre8-associates.com;
www.cre8-associates.com
Products and Services: Cables & Connectors, Filters,
Testing
Credowan Ltd.
Stocks Lane, Bracklesham Bay, Chichester,
West Sussex P020 8NT, United Kingdom;
+44(0)1243 670711; Fax: +44(0)1243 672907;
sales@credowan.co.uk;
www.credowan.co.uk
Products and Services: Shielded Rooms & Enclosures
D
DEM Manufacturing
Deltron Emcon House, Hargreaves Way, Sawcliffe
Industrial Park, Scunthorpe, North Lincolnshire DN15 8RF
United Kingdom;
+44(0)1724 273200; Fax: +44(0)1724 280353;
Diane Kilminster, sales@dem-uk.com;
www.dem-uk.com
Products and Services: Filters, Surge & Transients
Dexter Magnetic Technologies Europe, Ltd.
Unit 12, Tavistock Industrial Estate, Ruscombe Park, Twy-
ford, Berkshire RG10 9NJ, United Kingdom; +44(0)1189
602430; Fax: +44(0)1189 602431;
info@dextermag.com; www.dextermag.com
Products and Services: Ferrites, Shielding, Surge &
Transients
D+M Systems and Test
60 Wilbury Way, Hitchin, Hertfordshire SG4 0TA,
United Kingdom;
+44(0)1462 428991, Fax: +44(0)1462 428995;
graham.howard@dplusm.co.uk; www.dplusm.uk
Dutch Microwave Absorber Solutions
Industrieweg 12, Zoeterwoude, 2382 NV NL
+31-71-5012526
Bas de Groot; BkdeGroot@dmas.eu; www.dmas.eu
Products and Services: Microwave absorbers
E
Electromagnetic Testing Services Ltd.
Pratts Fields, Lubberhedges Lane, Stebbing, Essex, CM6
3BT United Kingdom;
+44(0)1371 856061; Fax: +44(0)1371 856144;
www.etsemc.co.uk
Electronic Test & Calibration Ltd.
Caddsdown Industrial Park, Clovelly Road, Bideford,
EX393DX, United Kingdom;
+44(0)1237 423388; Fax: +44(0)1237 423434;
info@etcal.co.uk; www.etcal.co.uk
Products and Services:Antennas, Calibration, Test-
ing, Training
Electrostatic Solutions Ltd.
13 Redhill Crescent, Bassett, Southampton, Hampshire,
SO16 7BQ, United Kingdom;
+44 (0)2380 905600;
Dr. Jeremy Smallwood; enq2006@electrostatics.net;
www.static-sol.com/index.htm
Products and Services: Consultancy
Elmac Services
Wareham, Dorset, United Kingdom;
+44 (0) 1929 558279;
consult@elmac.co.uk; www.elmac.co.uk;
Products and Services: Consultancy, Training
EM Test AG
Frequensys Ltd., 10 Abbey Court, Fraser Road, MK44 3WH
Bedford, United Kingdom;
+44 (0)1142 353507; Fax: +44 (0)1234 831998;
info@frequensys.co.uk; www.frequensys.co.uk
Products and Services: Surge & Transients, Test
Instrumentation, Testing
EMC Consultants Ltd.
Stebbing Hall, Lubberhedges Lane, Stebbing, Essex, CM6
3BU United Kingdom;
+44(0)1371 856964; +44(0)1371 856984;
info@emc-consultants.co.uk;
http://emc-consultants.co.uk
28
EMC Hire Ltd.
Unit 1, Ivel Road, Shefford, Bedfordshire, SG17 5JU
United Kingdom;
+44(0)1462 817111; +44(0)1462 819564;
www.emchire.co.uk
EMC Partner UK Ltd.
1A Golf Link Villas, The Common, Downley, High
Wycombe, HP13 5YH, Buckinghamshire United Kingdom;
+44(0)1494 44 42 55; Fax: +44(0)1494 44 42 77;
David Castle, sales@emcpartner.co.uk;
www.emcpartner.co.uk
Instrumentation
EMC Resources Ltd.
Willow House, Greenrig Road, Hawksland, Lanark, ML11
9QA United Kingdom;
+44(0) 141 4161 663;
info@nda-training-course.co.uk;
www.nda-training-course.co.uk
EMC Solutions Ltd.
Unit 6, Century Park, Starley Way, Solihull, West Mid-
lands, B37 7HF United Kingdom;
+44(0)1217 822705;
www.emcsolutionsltd.com
Products and Services: Filters, Testing
ERA Technology Ltd.
Cleeve Road, Leatherhead, Surrey, KT22 7SA,
United Kingdom;
+44(0)1372 367030;
www.cobham.com/technicalservices
ETC Ltd.
Caddsdown Industrial Park Clovelly Road, Bideford,
EX39 3DX United Kingdom;
+44(0)1237 423388; Fax: +44(0)1237 423434;
info@etcal.co.uk; www.etcal.co.uk/emc_cont.htm;
ETS - Lindgren Ltd.
Unit 4 Eastman Way, Pin Green Industrial Area, Steve-
nage, Hertfordshire, SG1 4UH, United Kingdom;
+44(0)1438 730700; Fax: +44(0)1438 730750;
uk@ets-lindgren.com; www.ets-lindgren.com
Products and Services: Antennas, Ferrites, Filters,
Shielded Rooms & Enclosures, RFI/EMI Signal Genera-
tors, Test Instrumentation, Miscellaneous
European EMC Products
Unit 7-9, Saffron Business Centre Elizabeth Way, Saf-
fron Walden, Essex, CB10 2BL United Kingdom;
+44(0)1799 523 073; Fax: +44(0)1799 521 191;
info@euro-emc.co.uk; www.euro-emc.co.uk
Euroquartz Ltd.
Blacknell Lane, Crewkerne, Somerset TA18 7HE,
United Kingdom;
+44(0)1460 230000; Fax: +44(0)1460 230001;
John Dale, info@euroquartz.co.uk;
www.euroquartz.co.uk
Products and Services:Filters
F
Fair-Rite Products Corp.
Dexter Magnetic Technologies Europe, Ltd., Unit 12,
Tavistock Industrial Estate, Ruscombe Park, Twyford,
Berkshire RG10 9NJ United Kingdom;
+44(0) 1189 602430; Fax: +44(0) 1189 602431;
info@dextermag.com
Schaffner Ltd., Ashville Way, Molly Millars Lane,
Wokingham, Berkshire RG41 2PL United Kingdom;
+44 118 977 0070; Fax: +44 118 979 2969;
uksales@schaffner.com; www.Fair-Rite.com
Products and Services: Antennas, Ferrites
G
Glenair UK Ltd.
40 Lower Oakham Way, Manseld, NG18 5BY,
Great Britain;
+44(0)1623 638154; Fax: +44(0)1623 638111;
Jane Moss, jmoss@glenair.co.uk; www.glenair.co.uk
Global EMC
Prospect Close, Lowmoor Road Industrial Estate,
Kirby-in-Asheld, NG17 7LF United Kingdom;
+44(0)1623 755539; Fax: +44(0)1623 755719;
www.globalemc.co.uk
Products and Services: Shielding, Testing
Globec (UK) Ltd.
Unit 15, Shrivenham Hundred Business Park, Watcheld,
Oxfordshire, SN6 8TZ, United Kingdom;
+44(0)1793 780790; Fax: +44(0) 1793 780776;
Peter Harris, peterh@globec.co.uk;
www.globec.co.uk/emc/lters/lter7.html
Products and Services: Cables & Connectors, Filters
Gowanda Electronics
ACAL BFI UK Ltd.; Mill Court, Wolverton Mill South,
Milton Keynes, Buckinghamshire, United Kingdom,
MK12 5EU;
+44 1908 326326; Fax: +44 1908 221110;
info.uk@boptilas.com; www.boptilas.com
Products and Services: Inductors
Charcroft Electronics
Dol-y-Coed, Llanwrtyd Wells, Powys, United Kingdom,
LD5 4TH;
+44 01591 612242; Fax: +44 01591 612005;
lewis.charlton@charcroft.com;
www.charcroft.com
H
Habia Cable Inc.
Unit 10 Short Way, Thornbury Industrial Estate,
Thornbury, Great Britain, Bristol, BS35 3UT;
+44(0)1454 41 25 22;
www.habia.com
Harwin
Fitzherbert Road, Farlington, Portsmouth, PO6 1RT,
Hants, United Kingdom;
+44(0)2392 314545;
www.harwin.com
HITEK Electronic Materials Ltd.
15 Wentworth Road, South Park Industrial Estate,
Scunthorpe, LINCS, DN17 2AX, United Kingdom;
+44(0)1724 851678; Fax: +44(0)1724 280586;
John Terry, sales@hitek-ltd.co.uk;
www.hitek-ltd.co.uk
Products and Services: Conductive Materials
Horiba Instruments UK Service Center
Kyoto Close, Summerhouse Road, Moulton Park,
Northampton, NN3 6FL United Kingdom;
+44(0)1604 542500;
www.horiba.com
HTT (UK) Ltd.
Unit 6 Northend Industrial Estate, Bury Mead Road,
Hitchin, SG5 1RT, United Kingdom;
+44(0)1462 486866;
Roland Brunisholz, sales@httuk.co.uk; www.httuk.co.uk
Hursley EMC Services
Unit 16, Brickeld Lane Chandlers Ford, Eastleigh,
Hampshire, SO53 4DP United Kingdom;
+44(0)2380 271111; Fax: +44(0)2380 271144;
sales@hursley-emc.co.uk; www.hursley-emc.co.uk
Products and Services: Consultancy, Testing
I
Instrument Plastics Ltd.
Unit 35, Kings Grove Industrial Est, Maidenhead,
Berkshire, SL6 4DP, United Kingdom;
sales@instrumentplastics.co.uk;
www.instrumentplastics.co.uk
IFI - Instruments for Industry
DM Systems and Test, Ltd.,
Iceni Court, Icknield Way, Letchworth Garden City,
Hertfordshire, SG6 1TN, United Kingdom;
+44 (0) 1462 650620; Fax +44 (0) 1462 650622;
Ken Ward; ken.ward@dplusm.co.uk;
Andy Jessavala, andy.jessavala@dplusm.co.uk;
Products and Services: Designers and Manufactur-
ers of High Power Microwave and RF Ampliers (Tetrode
Tubes, Solid State and TWT)
J
J. M. Woodgate and Associates
3 Brameld Road East, Rayleigh, Essex, SS6 8RG,
United Kingdom;
+44(0)1268 747839; Fax: +44(0)1268 777124;
jmw@jmwa.demon.co.uk; www.jmwa.demon.co.uk
UK_PS_R_EEG13.indd 28 11/16/12 7:31 PM
ADs_EEG13.indd 13 11/16/12 2:41 PM
30
K
Kemtron Ltd.
19-21 Finch Drive, Springwood Inustrial Estate,
Braintree, Essex, CM7 2SF, United Kingdom;
+44(0)1376 348115; Fax: +44(0)1376 345885;
info@kemtron.co.uk; www.kemtron.co.uk
Products and Services: RFI/EMI Sheilding gaskets
and components
KnitMesh Technologies
Greenfeld, Holywell, Flintshire, North Wales,
CH8 9DP United Kingdom;
+44(0)1352 717600; Fax: +44(0)1352 714909;
Colin Barnes; colin.barnes@knitmeshtechnologies.com;
www.knitmeshtechnologies.com
Products and Services: Shielding, Conductive
Materials
KTL (TracGlobal)
Unit E, South Orbital, Tracking Park, Hedan Road, Hull,
HU9 1NJ United Kingdom;
+44(0)1482 801801;
www.ktl.com
L
Langer EMV-Technik GmbH
APC-Novacom, Novalis Place, Deepdale
Enterprise Park, Deepdale Lane, Nettleham, Lincoln,
LN2 2LL, United Kingdom;
+44 1522 751136; Fax: +44 1522 754408;
sales@apc-novacom.co.uk;
www.apc-novacom.co.uk; www.langer-emv.de
Laplace Instruments Ltd.
Tudor House, Grammar School Road, North Walsham,
Norfolk NR28 9JH, UK;
+44 (0) 16 92 40 20 70; Fax: +44 (0) 16 92 40 49 10;
tech@laplace.co.uk;
www.laplaceinstruments.com
Products and Services: Amplifiers, Antennas,
Shielded Rooms & Enclosures, Test Instrumentation
Link Microtek Ltd.
High Point, Church Street, Basingstoke, Hampshire,
RG21 7QN, United Kingdom;
+44(0)1256 355771; Fax: +44(0)1256 355118;
Hugo Bibby, sales@linkmicrotek.com;
www.linkmicrotek.com
M
M.Buttkereit Ltd.
Unit 2, Britannia Road, Ind. Est. Sale Cheshire,
M33 2AA, United Kingdom;
+44(0)1619 695418;
info@buttkereit.co.uk
Magnetic Shields Ltd.
Headcorn Road, Staplehurst, Kent TN12 ODS
United Kingdom;
+44(0)1580 891521; Fax: +44(0)1580 893345;
enq@magneticshields.co.uk;
www.magneticshields.co.uk
MDL Technologies Ltd.
Unit 11, Devonshire Business Centre, Works Road,
Letchworth, Herts, SG6 1GJ, United Kingdom;
+44(0)1462 431981; Fax: +44(0)5603 152515;
www.mdltechnologies.co.uk
Mead Testing Ltd.
Unit 25 Mead Industrial Park River Way, Harlow, Essex,
CM20 2SE United Kingdom;
+44(0)1279 635864; Fax: +44(0)1279 635874;
www.meadtest.com
Mentor Graphics Mechanical Analysis Div.
81 Bridge Road, Hampton Court, Surrey, KT8 9HH,
United Kingdom;
+44(0)2084 873000; Fax: +44(0)2084 873001;
John Parry, Research Manager;
john_parry@mentor.com;
www.mentor.com/products/mechanical
Products and Services: Software
METECC
179 Junction Road, Burgess Hill, West Sussex,
RH15 0JW, United Kingdom;
+44(0)7725 079956;
Peter Metcalfe, peter@metecc.eu; www.metecc.eu
Products and Services: Testing, Training
a TESEQ Company
MILMEGA Ltd.
MDL Technologies Limited, Unit 11, Devonshire
Business
Centre, Works Road, Letchworth Hertfordshire SG6
1GJ, United Kingdom;
+44 0 1462 431981; Fax: 0044 0 560 315 2515;
sales@mdltechnologies.co.uk;
www.mdltechnologies.co.uk; www.milmega.com
Products and Services: Designers and Manufac-
turers of High Power Microwave and RF Amplifiers
MIRA Ltd.
Watling Street Nuneaton, Warwickshire,
CV10 0TU United Kingdom;
+44(0)2476 355576; Fax: +44(0)2476 358576;
www.mira.co.uk
UK_PS_R_EEG13.indd 30 11/16/12 3:38 PM
30
K
Kemtron Ltd.
19-21 Finch Drive, Springwood Inustrial Estate,
Braintree, Essex, CM7 2SF, United Kingdom;
+44(0)1376 348115; Fax: +44(0)1376 345885;
info@kemtron.co.uk; www.kemtron.co.uk
Products and Services: RFI/EMI Sheilding gaskets
and components
KnitMesh Technologies
Greenfeld, Holywell, Flintshire, North Wales,
CH8 9DP United Kingdom;
+44(0)1352 717600; Fax: +44(0)1352 714909;
Colin Barnes; colin.barnes@knitmeshtechnologies.com;
www.knitmeshtechnologies.com
Products and Services: Shielding, Conductive
Materials
KTL (TracGlobal)
Unit E, South Orbital, Tracking Park, Hedan Road, Hull,
HU9 1NJ United Kingdom;
+44(0)1482 801801;
www.ktl.com
L
APC-Novacom, Novalis Place, Deepdale
Enterprise Park, Deepdale Lane, Nettleham, Lincoln,
LN2 2LL, United Kingdom;
+44 1522 751136; Fax: +44 1522 754408;
sales@apc-novacom.co.uk;
www.apc-novacom.co.uk; www.langer-emv.de
Laplace Instruments Ltd.
Tudor House, Grammar School Road, North Walsham,
Norfolk NR28 9JH, UK;
+44 (0) 16 92 40 20 70; Fax: +44 (0) 16 92 40 49 10;
tech@laplace.co.uk;
www.laplaceinstruments.com
Shielded Rooms & Enclosures, Test Instrumentation
Link Microtek Ltd.
High Point, Church Street, Basingstoke, Hampshire,
+44(0)1256 355771; Fax: +44(0)1256 355118;
Hugo Bibby, sales@linkmicrotek.com;
www.linkmicrotek.com
M
M.Buttkereit Ltd.
Unit 2, Britannia Road, Ind. Est. Sale Cheshire,
M33 2AA, United Kingdom;
+44(0)1619 695418;
info@buttkereit.co.uk
Magnetic Shields Ltd.
Headcorn Road, Staplehurst, Kent TN12 ODS
United Kingdom;
+44(0)1580 891521; Fax: +44(0)1580 893345;
enq@magneticshields.co.uk;
www.magneticshields.co.uk
MDL Technologies Ltd.
Unit 11, Devonshire Business Centre, Works Road,
Letchworth, Herts, SG6 1GJ, United Kingdom;
+44(0)1462 431981; Fax: +44(0)5603 152515;
www.mdltechnologies.co.uk
Mead Testing Ltd.
Unit 25 Mead Industrial Park River Way, Harlow, Essex,
CM20 2SE United Kingdom;
+44(0)1279 635864; Fax: +44(0)1279 635874;
www.meadtest.com
Mentor Graphics Mechanical Analysis Div.
81 Bridge Road, Hampton Court, Surrey, KT8 9HH,
United Kingdom;
+44(0)2084 873000; Fax: +44(0)2084 873001;
John Parry, Research Manager;
john_parry@mentor.com;
www.mentor.com/products/mechanical
Products and Services: Software
METECC
179 Junction Road, Burgess Hill, West Sussex,
RH15 0JW, United Kingdom;
+44(0)7725 079956;
Peter Metcalfe, peter@metecc.eu; www.metecc.eu
a TESEQ Company
MILMEGA Ltd.
MDL Technologies Limited, Unit 11, Devonshire
Business
Centre, Works Road, Letchworth Hertfordshire SG6
1GJ, United Kingdom;
+44 0 1462 431981; Fax: 0044 0 560 315 2515;
sales@mdltechnologies.co.uk;
www.mdltechnologies.co.uk; www.milmega.com
MIRA Ltd.
Watling Street Nuneaton, Warwickshire,
CV10 0TU United Kingdom;
+44(0)2476 355576; Fax: +44(0)2476 358576;
www.mira.co.uk
UK_PS_R_EEG13.indd 30 11/16/12 3:38 PM
EMI/RFI Shielding Solutions
TECH-ETCH, INC., 45 Aldrin Road, Plymouth, MA 02360 USA TEL 508-747-0300 FAX 508-746-9639 sales@tech-etch.com
BENELUX HF TECHNOLOGY The Netherlands TEL +31 75 628 37 17 FAX +31 75 621 11 20 info@hftechnology.nl
DENMARK BOMBERG & CO. ApS TEL +45 48 14 01 55 FAX +45 48 14 01 56 sales@bomberg.com
FRANCE YELLOZ COMPONENTS TEL +3301 64 46 69 68 FAX +3301 60 92 38 01 yellozcomponents@yellowzgroup.com
GERMANY FEUERHERDT GmbH TEL +49 30 710 96 45 - 53 FAX +49 30 710 96 45 - 99 emc@feuerherdt.de
ISRAEL MAHAM FASTENERS TEL +972 3 9626516 FAX +972 3 9626517 haim@mhm.co.il
ITALY SIRCES SRL. ITALY TEL +39 02 55231395 FAX +39 02 56816112 nicola.iacovino@sirces.it
NORWAY EG COMPONENTS NORWAY AS TEL +47 23254600 FAX +47 23254601 info@egcomponents.no
UK TBA ELECTRO CONDUCTIVE PRODUCTS TEL +44 1706 647718 FAX +44 1706 646170 davidhurst@tbaecp.co.uk
Exceptional FREE sample program
Fast response to customer requests
Finest print and web catalogs
Better than 99% quality rating
Customization of standard products
ISO 9001:2008 Registered
Large inventory for immediate delivery
Industry leader of innovative designs
Specialists for application assistance
www.tech-etch.com/shield
Tech-Etch, a global supplier of EMI shielding for over 40 years, designs and manufactures a full line of
standard and custom products, including contact strips, conductive elastomers, wire mesh, honeycomb
vents, board level shielding, metalized fabric shielding, and conductive foam.
ADs_EEG13.indd 14 11/16/12 2:41 PM
32
MPE Ltd.
Hammond Road, Knowsley Industrial Park, Liverpool,
Merseyside, L33 7UL, United Kingdom;
+44(0)1516 329100; Fax: +44(0)1516 329112;
John Jephcott, sales@mpe.co.uk;
www.mpe.co.uk
Murata Electronics UK
Oak House, Ancells Road, Ancells Business Park, Fleet,
Hampshire, GU51 2QW, United Kingdom;
+44(0)1252 8111666;
Aya Tonooka, Marketing Offcer UK,
ayatonooka@murata.co.uk; www.murata-europe.com
Products and Services: Amplifers, Ferrites, Filters,
Surge & Transients
N
Noratel UK Ltd.
7 George House Princes Court, Beam Heath Way,
Nantwich, CW5 6GD United Kingdom;
+44(0)1270 611368;
info@noratel.co.uk; www.toroid.co.uk
Products and Services: Ferrites, Surge & Transients
O
Optical Filters Ltd.
Unit 13 & 14, Thame Park Business Centre,
Wenman Road, Thame, Oxon, United Kingdom;
+44(0)1844 260377; Fax: +44(0)1844 260355;
www.opticalflters.co.uk
Products and Services: Filters, Shielding
Oxley Group Ltd.
Priory Park, Ulverston, Cumbria, LA12 9QG,
United Kingdom;
+44(0)1229 582621; Fax: +44(0)1229 585090;
Mark Johnson; sales@oxleygroup.com;
www.oxleygroup.com
Products and Services: Cables & Connectors, Fer-
rites, Filters, Shielding, Surge & Transients, Testing
P
P & P Technology Ltd.
Finch Drive, Springwood, Braintree, Essex,
United Kingdom;
+44(0)1376 550525; Fax: +44(0)1376 552389;
www.p-p-t.co.uk
Products and Services: Conductive Materials, Die
Cut Shielding Material, EMI Gaskets, Shielding
Panashield (UK) Ltd.
The Bothy, 38 Smarts, Heath Road, Woking,
Surrey, GU22 0NP, United Kingdom;
+44(0)1483 722020; Fax: +44(0)1483 770330;
sales@panashield.co.uk
Products and Services: Filters, Shielded Rooms &
Enclosures, Shielding, Testing
Peak Electromagnetics
139 Bank Street, Macclesfeld, Cheshire,
SK11 7AY United Kingdom;
+44(0)1625 269808;
sales@peak-em.co.uk; www.peak-em.co.uk
PPI (Power Products International) Ltd.
Commerce Way, Edenbridge, Kent, TN8 6ED,
United Kingdom;
+44(0)1732 866424; Fax: +44(0)1732 866399;
Geoff Robinson; gkrobinson@ppi-uk.com;
www.ppi-uk.com
PPM (Pulse Power and Measurement) Ltd.
65 Shrivenham Hundred Business Park, Watchfeld,
Swindon, Wiltshire, SN6 8TY, United Kingdom;
+44(0)1793 784389; Fax: +44(0)1793 784391;
Philip Surman, psurman@ppm.co.uk;
www.point2point.co.uk
Products and Services: Antennas, Cables & Con-
nectors, Test Instrumentation, Testing
Precision Micro Ltd
11 Vantage Way, Erdington, Birmingham,
B24 9GZ, United Kingdom;
+44 121 380 0100; Fax: +44 121 749 4157;
www.precisionmicro.com
Q
Q-par Angus Ltd.
Barons Cross Laboratories, Leominster, Hereford-
shire,
HR6 8RS, United Kingdom;
+44(0)1568 612138l; Fax: +44(0)1568 616373;
Rob Lowther; sales@q-par.com; www.q-par.com
Products and Services: Antennas, Testing,
Miscellaneous
QinetiQ
CodyTechnology, Park 1005, Ively Road, Farnborough,
Hampshire, GU14 OLX, United Kingdom;
+44 (0)1252 392000; Fax:+44 (0)1252 393399;
www.qinetiq.com
R
Rainford EMC Systems
St. Helens Merseyside, United Kingdom;
+44(0)1942 296190;
www.rainfordemc.com
Rasmi Electronics Ltd.
Morrison Road, Annfeld Plain, Stanley, Durham,
DH9 7RX, United Kingdom;
+44(0)1207 291300;
Dr. Surendra, sales@rasmi.com; www.rasmi.com
Products and Services: Antennas, Filters, Shielded
Rooms & Enclosures
UK_PS_R_EEG13.indd 32 11/16/12 3:39 PM
32
MPE Ltd.
Hammond Road, Knowsley Industrial Park, Liverpool,
Merseyside, L33 7UL, United Kingdom;
+44(0)1516 329100; Fax: +44(0)1516 329112;
John Jephcott, sales@mpe.co.uk;
www.mpe.co.uk
Murata Electronics UK
Oak House, Ancells Road, Ancells Business Park, Fleet,
Hampshire, GU51 2QW, United Kingdom;
+44(0)1252 8111666;
Aya Tonooka, Marketing Offcer UK,
ayatonooka@murata.co.uk; www.murata-europe.com
Products and Services: Amplifers, Ferrites, Filters,
Surge & Transients
N
Noratel UK Ltd.
7 George House Princes Court, Beam Heath Way,
Nantwich, CW5 6GD United Kingdom;
+44(0)1270 611368;
info@noratel.co.uk; www.toroid.co.uk
Products and Services: Ferrites, Surge & Transients
O
Optical Filters Ltd.
Unit 13 & 14, Thame Park Business Centre,
Wenman Road, Thame, Oxon, United Kingdom;
+44(0)1844 260377; Fax: +44(0)1844 260355;
www.opticalflters.co.uk
Oxley Group Ltd.
Priory Park, Ulverston, Cumbria, LA12 9QG,
United Kingdom;
+44(0)1229 582621; Fax: +44(0)1229 585090;
Mark Johnson; sales@oxleygroup.com;
www.oxleygroup.com
Products and Services: Cables & Connectors, Fer-
rites, Filters, Shielding, Surge & Transients, Testing
P
P & P Technology Ltd.
Finch Drive, Springwood, Braintree, Essex,
United Kingdom;
+44(0)1376 550525; Fax: +44(0)1376 552389;
www.p-p-t.co.uk
Products and Services: Conductive Materials, Die
Cut Shielding Material, EMI Gaskets, Shielding
Panashield (UK) Ltd.
The Bothy, 38 Smarts, Heath Road, Woking,
Surrey, GU22 0NP, United Kingdom;
+44(0)1483 722020; Fax: +44(0)1483 770330;
sales@panashield.co.uk
Enclosures, Shielding, Testing
Peak Electromagnetics
139 Bank Street, Macclesfeld, Cheshire,
SK11 7AY United Kingdom;
+44(0)1625 269808;
sales@peak-em.co.uk; www.peak-em.co.uk
PPI (Power Products International) Ltd.
Commerce Way, Edenbridge, Kent, TN8 6ED,
United Kingdom;
+44(0)1732 866424; Fax: +44(0)1732 866399;
Geoff Robinson; gkrobinson@ppi-uk.com;
www.ppi-uk.com
PPM (Pulse Power and Measurement) Ltd.
65 Shrivenham Hundred Business Park, Watchfeld,
Swindon, Wiltshire, SN6 8TY, United Kingdom;
+44(0)1793 784389; Fax: +44(0)1793 784391;
Philip Surman, psurman@ppm.co.uk;
www.point2point.co.uk
Products and Services: Antennas, Cables & Con-
nectors, Test Instrumentation, Testing
Precision Micro Ltd
11 Vantage Way, Erdington, Birmingham,
B24 9GZ, United Kingdom;
+44 121 380 0100; Fax: +44 121 749 4157;
www.precisionmicro.com
Q
Q-par Angus Ltd.
Barons Cross Laboratories, Leominster, Hereford-
shire,
HR6 8RS, United Kingdom;
+44(0)1568 612138l; Fax: +44(0)1568 616373;
Rob Lowther; sales@q-par.com; www.q-par.com
Products and Services: Antennas, Testing,
Miscellaneous
QinetiQ
CodyTechnology, Park 1005, Ively Road, Farnborough,
Hampshire, GU14 OLX, United Kingdom;
+44 (0)1252 392000; Fax:+44 (0)1252 393399;
www.qinetiq.com
R
Rainford EMC Systems
St. Helens Merseyside, United Kingdom;
+44(0)1942 296190;
www.rainfordemc.com
Rasmi Electronics Ltd.
Morrison Road, Annfeld Plain, Stanley, Durham,
DH9 7RX, United Kingdom;
+44(0)1207 291300;
Dr. Surendra, sales@rasmi.com; www.rasmi.com
Products and Services: Antennas, Filters, Shielded
Rooms & Enclosures
UK_PS_R_EEG13.indd 32 11/16/12 3:39 PM
33
Products & Services | United Kingdom
RFI Global Services Ltd.
Unit 3 Horizon, Wade Road, Kingsland Business Park,
Basingstoke, Hampshire, RG24 8AH United Kingdom;
+44 (0)1256 312000;
www.rf-global.com
Richard Marshall Ltd.
The Dappled House, 30 Ox Lane, Harpenden,
Herts. AL5 4HE, United Kingdom;
+44(0)1582 460815;
richard.marshall@iee.org; www.design-emc.co.uk
Rittal Ltd.
Braithwell Way, Hellaby Industrial Estate, Hellaby,
Rotherham, South Yorkshire, S66 8QY United Kingdom;
+44(0)1709 704000;
information@rittal.co.uk; www.rittal.co.uk
Products and Services: Shielded Rooms & Enclosures
RN Electronics Ltd.
Arnolds Court, Arnolds Farm Lane, Brentwood, Essex
CM13 1UT United Kingdom;
+44(0)1277 352219; Fax: +44(0)1277 352968;
Paul Darragh, paul@RNelectronics.com;
www.rnelectronics.com
Roxburgh EMC
Deltron Emcon House, Hargreaves Way, Sawcliffe
Industrial Park, Scunthorpe, North Lincolnshire,
DN15 8RF, United Kingdom;
+44(0)1724 273200; Fax: +44(0)1724 280353;
Diane Kilminster; dkilminster@dem-uk.com;
www.dem-uk.com/roxburgh
Enclosures, Surge & Transients
RS Coatings Ltd.
Unit 10, Britannia Way, Britannia Enterprise Park,
Lichfeld, Staffordshire, WS14 9UY;
+44 01543 410 771; Fax: +44 01543 414 977;
rscgroup@btconnect.com;
www.rscoatings.com
S
Schaffner Ltd.
5 Ashville Way, Molly Millars Lane, Wokingham,
Berkshire RG41 2PL, United Kingdom;
+44(0)1189 770070; Fax: +44(0)1189 792969;
uksales@schaffner.com; www.schaffner.com
Schlegel Electronic Materials
Kemtron Limited, 19-21 Finch Drive,
Springwood Industrial Estate, Braintree, Essex, CM7 2SF;
+44(0)1376 348115; Fax: +44(0)1376 345885;
David Wall, dbw@kemtron.co.uk;
www.kemtron.co.uk
Products and Services: Conductive Materials, Shielding
Sematron UK Ltd.
Sandpiper House, Aviary Court, Wade Road,
Basingstoke, Hampshire, RG24 8GX, United Kingdom;
+44(0)1256 812222; Fax: +44(0)1256 812666;
Glenn Toal, gtoal@sematron.com;
www.sematron.com;
Products and Services: Cables & Connectors, Test
Instrumentation
Slater Plastics
Unit 7, Hanborough Business Park Lodge Road,
Long Hanborough, Oxon, OX8 8LG United Kingdom;
+44(0)1785 213861; Fax: +44(0)1785 243204;
info@slaterplastics.com;
www.slaterplastics.com
Products and Services: Filters, Shielding, Test
Instrumentation
Sulis Consultants Ltd.
Mead House, Longwater Road, Eversley, Hampshire,
RG27 0NW, United Kingdom;
+44(0)7946 624317;
Charlie Blackham, charlie@sulisconsultants.com;
www.sulisconsultants.com
Products and Services: Product Approvals, CE Marking
Suppression Devices
Unit 8 - York St Business Centre, Clitheroe, Lancashire,
BB7 2DL, United Kingdom;
+44(0)1200 444497;
Campbell Barker, sales@suppression-devices.com;
http://suppression-devices.com
Swift Textile Metalizing LLC
00 1 860 243 1122; Fax: 00 1 860 243 0848
Christen Holmberg cholmberg@swift-textile.com
www.swift-textile.com
Syfer Technology Ltd.
Old Stoke Road, Arminghall, Norwich, Norfolk,
NR14 8SQ, United Kingdom;
+44(0)1603 723310; Fax: +44(0)1603 723301;
sales@syfer.co.uk; www.syfer.com
T
T C Shielding, Ltd.
Unit 2, Ashburton Industrial Estate Ross on Wye,
Herefordshire, HR9 7BW United Kingdom;
+44(0)1989 563941;
info@tcshielding.com;
www.tcshielding.com
TBA Electro-Conductive Products
Rooley Moor Road, PO Box 56, Rochdale, Laurashire,
OL12 7E4 United Kingdom;
+44(0)1706 647718; Fax: +44(0)1706 646170;
www.tbaecp.co.uk
Products and Services: Conductive Materials,
Shielding, Surge & Transients
Tecan Ltd.
Tecan Way, Weymouth, Dorset DT4 9TU United King-
dom; +44(0)1305 765432; Fax: +44(0)1305 780194;
www.tecan.co.uk
Tech-Etch, Inc.
TBA Electro Conductive Products, P.O. Box 56,
Rooley Moor Road, Rochdale, Spotland, Lancs.
OL12 7EY
United Kingdom;
+44(0)1706 647718; Fax: +44(0)1706 646170;
davidhurst@tbaecp.co.uk; www.tech-etch.com
Shielding
Teledyne Reynolds
Navigation House, Canal View Road, Newbury,
Berkshire, RG14 5UR, United Kingdom;
+44 (0) 1635 262200;
Oli vier Dilun, Souther n Europe regional sales
manager;
odilun@teledyne.com; www.teledynereynolds.
co.uk
Telonic Instruments Ltd.
Toutley Industrial Estate, Toutley Road, Wokingham,
+44(0)1189 786911;
Bob Lovell, info@telonic.co.uk; www.telonic.co.uk
Products and Services: Filters, Test Instrumen-
tation
Advanced Test Sol ut i ons f or EMC
Teseq Ltd.
Teseq Ltd., Ashville Way, Molly Millars Lane,
Wokingham, Berkshire RG41 2PL;
+44 (0) 8540 740 660; Fax: +44 (0) 845 074 0656;
uksales@teseq.com; www.teseq.co.uk
Products and Services: Amplifiers (RF & Micro-
wave), Antennas, Automotive Systems, Conducted
RF immunity, Conducted Surge & Transients, ESD,
Harmonics & Flicker, GTEM cells, RF Immunit y
Systems, RF Emission Systems, RF Test software,
Calibration & Service
UK_PS_R_EEG13.indd 33 11/16/12 3:39 PM
34
United Kingdom | Resources
The Lighting Association Laboratories
Stafford Park 7, Telford, Shropshire, TF3 3BQ,
United Kingdom;
+44(0)1952 290905; Fax: +44(0)1952 290906;
lab@lightingassociation.com;
www.lightingassociation.com;
Products and Services: Surge & Transients
Thurlby-Thandar Instruments (TTI)
Glebe Road, Huntingdon, Cambridgeshire, PE29 7DR
United Kingdom;
+44(0)1480 412451;
www.tti-test.com
Tioga Ltd.
St Thomas House, Manseld Road, Derby,
DE1 3TN, United Kingdom;
+44(0)1332 360884; Fax: +44(0)1332 360885;
Angela Bond; angela@tioga.co.uk;
www.tioga.co.uk
TMD Technologies Ltd.
Swalloweld Way, Hayes, Middlesex UB3 1DQ,
United Kingdom;
+44(0)2085 735555; Fax: +44(0)2085 691839;
wecare@tmd.co.uk; www.tmd.co.uk
Products and Services: Ampliers, Antennas, Filters,
Test Instrumentation
TRAC Global, Ltd.
100 Frobisher Business Park, Leigh Sinton Road,
Malvern, Worcestershire, WR14 1BX, United Kingdom;
+44(0)1684 571700; Fax: +44(0)1684 571701;
environmental@tracglobal.com;
www.tracglobal.com
TRW Conekt
Technical Centre, Stratford Road, Solihull, B90 4GW,
United Kingdom;
+44(0)1216 274242; Fax: +44(0)1216 274243;
www.conekt.co.uk
Products and Services: Consultancy and Testing
provider
TUV Product Service Ltd.
Octagon House, Concorde Way, Segensworth North,
Fareham, Hampshire, PO15 5RL, United Kingdom;
Fax: +44(0)1489 558100;
www.tuvps.co.uk
U
Uvox Ltd.
Building 14/Unit 3, Stanmore Industrial Estate,
Bridgnorth, Shropshire, WV15 5HR, United Kingdom;
+44(0)1746 769369; Fax: +44(0)1746 766001;
Robin Shedden, Sales Manager, sales@uvox.co.uk;
www.uvox.co.uk
V
Vector Fields Ltd. / Cobham Technical Services
24 Bankside, Kidlington, OX5 1JE United Kingdom;
+44(0)1865 370151; Fax: +44(0)1865 370277;
www.vectorelds.com
Visteon Engineering Services Ltd.
Dunton Engineering Centre, Dunton, Essex, SS15 6EE,
United Kingdom;
+44(0)1245 395000;
Martin Black, mblack7@visteon.com;
www.visteon.com/testing
W
Wemtech
Bordesley Hall, The Holloway, Alvechurch,
Birmingham, B48 7QQ United Kingdom;
+44(0)1527 595066; +44(0)1527 595033;
www.wemtech.co.uk
Westbay Technology Ltd.
Main St. Baycliff, Ulverston, Cumbria, LA12 9RN
United Kingdom;
+44(0)1229 869798; Fax: +44(0)1229 869108;
www.westbay.ndirect.co.uk
Wurth Electronics UK Ltd.
Exchange Quay, The Ofce Oxfordshire Village, First
Floor, Building 24, Salford, Quays, M50 3EQ,
United Kingdom;
+44(0)1618 720431; Fax: +44(0)1618 720433;
sales-uk@we-online.com
Products and Services: Cables & Connectors, Ferrites
480. 730. 5700
Jerrik@CarlisleIT.com
www.CarlisleIT.com
With Carlisle Interconnect Technologies
TVS / EMI Filter Connectors
SHIELD
YOUR
CRITICAL
DATA
TVS / EMI Filter Connector
WHEN PERFORMANCE MATTERS
UK_PS_R_EEG13.indd 34 11/16/12 3:39 PM
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Resources | United Kingdom
Y
York EMC Services Ltd.
Market Square, University of York, Heslington, York,
YO10 5DD, United Kingdom;
+44(0)1904 434440;
www.yorkemc.co.uk
Products and Services: Signal Generators
Z
Zytronic Displays Ltd.
Whitely Road Blaydon-on-Tyne, Tyne & Wear, NE21
5NJ United Kingdom;
+44(0)1914 145511; Fax: +44(0)1914 140545;
www.zytronic.co.uk
ASSOCIATIONS
ELECTROMAGNETIC COMPATIBILITY
INDUSTRY ASSOCIATION
Nutwood UK Limited, Eddystone Court, De Lank Lane,
St Breward, Bodmin, Cornwall. PL30 4NQ;
+44 (0) 1208 851 530; Fax: +44 (0) 1208 850 871;
emcia@emcia.org; www.emcia.org
INSTITUTION OF ENGINEERING
AND TECHNOLOGY
Michael Faraday House, Six Hills Way, Stevenage,
Herts, SG1 2AY, UK;
+44 (0)1438 313 311; Fax: +44 (0)1438 765 526;
postmaster@theiet.org; www.theiet.org
RADIO SOCIETY OF GREAT BRITAIN
3 Abbey Court, Fraser Road, Priory Business Park,
Bedford MK44 3WH, England;
01234 832700; Fax: 01234 831496;
sales@rsgb.org.uk; www.rsgb.org
UNITED KINGDOM & REPUBLIC OF
IRELAND IEEE EMC SOCIETY CHAPTER
CST UK Ltd, Strelley Hall, Main Street, Strelley,
Nottingham NG8 6PE, United Kingdom;
+44 115-906128; Fax: +44 115-9061115;
Chairman Nihal Sinnadurai; sinnadurai@aol.com;
www.ieee-ukri.org
NOTIFIED BODIES
3C TEST LIMITED
Silverstone Northamptonshire NN12 8GX,
United Kingdom;
+44 (0)1327 857500; Fax: +44 (0)1327 857747;
sales@3ctest.co.uk; www.3ctest.co.uk
KIWA BLACKWOOD COMPLIANCE
LABORATORIES
Unit 8 Woodeldside Business Park, Pontllanfraith,
Blackwood NP12 2DG, United Kingdom;
+44 (0) 1495 229219; Fax: +44 (0) 1495 228331;
blackwoodenquiries@kiwa.co.uk;
www.kiwa.co.uk
CCQS UK LTD
Westgate Road, London W5 1YY, United Kingdom;
+44 (0)20 8991 3488; info@ccqs.co.uk; www.ccqs.
co.uk
CEM INTERNATIONAL LTD
The Atrium Business Centre Curtis Road, Dorking Surrey
RH4 1XA, United Kingdom; +44 (0) 1306 646388; Fax:
+44 (0) 1306 646389; info@cem-international.co.uk;
www.cem-international.co.uk
CONFORMANCE SERVICES LTD
Conformance House, 24 Tidnock Ave., Congleton,
Cheshire CW12 2HW, United Kingdom; +44 (0)1260
270729; Fax: +44 (0)1260 270729; enquiries@
conformance-services.com; www.conformance-
services.com
ERICSSON LIMITED
Unit 4, Midleton Gate, Guildford Business Park,
Guildford, GU2 8SD United Kingdom; +44 (0) 1483 30 36
66; Fax: +44 (0) 1483 30 35 37; kirit.surelia@ericsson.
com; www.ericsson.com
HURSLEY EMC SERVICES LTD
Unit 16 Brickeld Trading Est., Brickeld Lane,
Chandlers Ford, Eastleigh, Hampshire SO53 4DP,
United Kingdom; +44 (0)23 8027 1111; Fax: +44 (0)23
8027 1144; sales@hursley-emc.co.uk;www.hursley-
emc.co.uk
INTERTEK TESTING & CERTIFICATION
Intertek House, Cleeve Road, Leatherhead, Surrey
KT22 7SB, United Kingdom; +44 (0) 1372 370900; Fax:
+44 (0) 1372 370999; talban.sohi@intertek.com; www.
intertek.com
LLOYDS REGISTER GROUP LTD
71 Fenchurch St., London EC3M 4BS, United Kingdom;
+44 (0)20 7709 9166; Fax: +44 (0) 20 7488 4796;
london.client-management@lr.org; www.lr.org
MIRA LIMITED
Watling Street, Nuneaton Warwickshire CV10 0TU,
United Kingdom; +44 (0) 24 7635 5000; enquiries@mira.
co.uk; www.mira.co.uk
RFI GLOBAL SERVICES LTD
Pavilion A, Ashwood Park, Ashwood Way, Basingstoke
RG23 8BG, United Kingdom; +44 (0) 1256 312000;
Fax: +44 (0) 1256 312001; info@r-global.com; www.
r-global.com
SAFENET LIMITED
Denford Garage, Denford, Kettering, Northants
NN14 4EQ, United Kingdom; +44 (0) 1832 732 174;
sales@safenet.co.uk; www.safenet.co.uk
SAI GLOBAL ASSURANCE SERVICES
Winterhill House Snowdon Drive, Milton Keynes,
Buckinghamshire, MK6 1AX, United Kingdom;
+44 (0) 1926854111; Fax: +44 (0) 1926854222;
info.emea@saiglobal.com; www.saiglobal.com
SAMSUNG ELECTRONICS
EURO QA LAB
Blackbushe Business Park Saxony Way, Yateley
Hampshire GU46 6GG, United Kingdom; +44 (0)1252
863 800; Fax: +44 (0)1252 863 805; s.colclough@
samsung.com
SGS UNITED KINGDOM LIMITED
Inward Way, Rossmore Business Park, Ellesmere
Port, CH65 3 EN, United Kingdom;
+44 (0) 151 350 6666; Fax: +44 (0) 151 350 6600;
keith.hutchinson@sgs.com; www.uk.sgs.com
TECHNOLOGY INTERNATIONAL
EUROPE LTD
56 Shrivenham Hundred Business Park Shrivenham,
Swindon, Wiltshire SN6 8TY, United Kingdom; +44 (0)
1793 783137; Fax: +44 (0) 1793 782310; sales@iti.
co.uk; www.iti.co.uk
TRAC GLOBAL LTD
South Orbital Trading Park, Hedon Road, Hull
HU9 1NJ, United Kingdom; +44 (0)1482 801801; Fax:
+44 (0)1482 801806; emc@tracglobal.com; www.
tracglobal.com
TV SD BABT
Forsyth House, Churcheld Road, Walton-on-
Thames Surrey KT12 2TD, United Kingdom;
+44 (0) 1932 251200; Fax: +44 (0) 1932 251201;
info@babt.com; www.babt.com
TUV PRODUCT SERVICE LTD
Fareham, Hampshire PO15 5RL, United Kingdom; +44
(0) 1489 558100; Fax: +44 (0) 1489 558101; info@tuvps.
co.uk; www.tuvps.co.uk
YORK EMC SERVICES LTD
Market Square, University of York, Heslington, York
YO10 5DD, United Kingdom; +44 (0) 1904 434440; Fax:
+44 (0) 1904 324434; enquiry@yorkemc.co.uk; www.
yorkemc.co.uk
Follow Us on Twitter @EMC_EMI
UK_PS_R_EEG13.indd 35 11/16/12 6:35 PM
34
United Kingdom | Resources
The Lighting Association Laboratories
Stafford Park 7, Telford, Shropshire, TF3 3BQ,
United Kingdom;
+44(0)1952 290905; Fax: +44(0)1952 290906;
lab@lightingassociation.com;
www.lightingassociation.com;
Products and Services: Surge & Transients
Thurlby-Thandar Instruments (TTI)
Glebe Road, Huntingdon, Cambridgeshire, PE29 7DR
United Kingdom;
+44(0)1480 412451;
www.tti-test.com
Tioga Ltd.
St Thomas House, Manseld Road, Derby,
DE1 3TN, United Kingdom;
+44(0)1332 360884; Fax: +44(0)1332 360885;
Angela Bond; angela@tioga.co.uk;
www.tioga.co.uk
TMD Technologies Ltd.
Swalloweld Way, Hayes, Middlesex UB3 1DQ,
United Kingdom;
+44(0)2085 735555; Fax: +44(0)2085 691839;
wecare@tmd.co.uk; www.tmd.co.uk
Products and Services: Ampliers, Antennas, Filters,
Test Instrumentation
TRAC Global, Ltd.
100 Frobisher Business Park, Leigh Sinton Road,
Malvern, Worcestershire, WR14 1BX, United Kingdom;
+44(0)1684 571700; Fax: +44(0)1684 571701;
environmental@tracglobal.com;
www.tracglobal.com
TRW Conekt
Technical Centre, Stratford Road, Solihull, B90 4GW,
United Kingdom;
+44(0)1216 274242; Fax: +44(0)1216 274243;
www.conekt.co.uk
Products and Services: Consultancy and Testing
provider
TUV Product Service Ltd.
Fareham, Hampshire, PO15 5RL, United Kingdom;
Fax: +44(0)1489 558100;
www.tuvps.co.uk
U
Uvox Ltd.
Building 14/Unit 3, Stanmore Industrial Estate,
Bridgnorth, Shropshire, WV15 5HR, United Kingdom;
+44(0)1746 769369; Fax: +44(0)1746 766001;
Robin Shedden, Sales Manager, sales@uvox.co.uk;
www.uvox.co.uk
V
Vector Fields Ltd. / Cobham Technical Services
24 Bankside, Kidlington, OX5 1JE United Kingdom;
+44(0)1865 370151; Fax: +44(0)1865 370277;
www.vectorelds.com
Visteon Engineering Services Ltd.
Dunton Engineering Centre, Dunton, Essex, SS15 6EE,
United Kingdom;
+44(0)1245 395000;
Martin Black, mblack7@visteon.com;
www.visteon.com/testing
W
Wemtech
Bordesley Hall, The Holloway, Alvechurch,
Birmingham, B48 7QQ United Kingdom;
+44(0)1527 595066; +44(0)1527 595033;
www.wemtech.co.uk
Westbay Technology Ltd.
Main St. Baycliff, Ulverston, Cumbria, LA12 9RN
United Kingdom;
+44(0)1229 869798; Fax: +44(0)1229 869108;
www.westbay.ndirect.co.uk
Wurth Electronics UK Ltd.
Exchange Quay, The Ofce Oxfordshire Village, First
Floor, Building 24, Salford, Quays, M50 3EQ,
United Kingdom;
+44(0)1618 720431; Fax: +44(0)1618 720433;
sales-uk@we-online.com
Products and Services: Cables & Connectors, Ferrites
480. 730. 5700
Jerrik@CarlisleIT.com
www.CarlisleIT.com
With Carlisle Interconnect Technologies
TVS / EMI Filter Connectors
SHIELD
YOUR
CRITICAL
DATA
TVS / EMI Filter Connector
WHEN PERFORMANCE MATTERS
UK_PS_R_EEG13.indd 34 11/16/12 3:39 PM
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Resources | United Kingdom
Y
York EMC Services Ltd.
Market Square, University of York, Heslington, York,
YO10 5DD, United Kingdom;
+44(0)1904 434440;
www.yorkemc.co.uk
Products and Services: Signal Generators
Z
Zytronic Displays Ltd.
Whitely Road Blaydon-on-Tyne, Tyne & Wear, NE21
5NJ United Kingdom;
+44(0)1914 145511; Fax: +44(0)1914 140545;
www.zytronic.co.uk
ASSOCIATIONS
ELECTROMAGNETIC COMPATIBILITY
INDUSTRY ASSOCIATION
Nutwood UK Limited, Eddystone Court, De Lank Lane,
St Breward, Bodmin, Cornwall. PL30 4NQ;
+44 (0) 1208 851 530; Fax: +44 (0) 1208 850 871;
emcia@emcia.org; www.emcia.org
INSTITUTION OF ENGINEERING
AND TECHNOLOGY
Michael Faraday House, Six Hills Way, Stevenage,
Herts, SG1 2AY, UK;
+44 (0)1438 313 311; Fax: +44 (0)1438 765 526;
postmaster@theiet.org; www.theiet.org
RADIO SOCIETY OF GREAT BRITAIN
3 Abbey Court, Fraser Road, Priory Business Park,
Bedford MK44 3WH, England;
01234 832700; Fax: 01234 831496;
sales@rsgb.org.uk; www.rsgb.org
UNITED KINGDOM & REPUBLIC OF
IRELAND IEEE EMC SOCIETY CHAPTER
CST UK Ltd, Strelley Hall, Main Street, Strelley,
Nottingham NG8 6PE, United Kingdom;
+44 115-906128; Fax: +44 115-9061115;
Chairman Nihal Sinnadurai; sinnadurai@aol.com;
www.ieee-ukri.org
NOTIFIED BODIES
3C TEST LIMITED
Silverstone Northamptonshire NN12 8GX,
United Kingdom;
+44 (0)1327 857500; Fax: +44 (0)1327 857747;
sales@3ctest.co.uk; www.3ctest.co.uk
KIWA BLACKWOOD COMPLIANCE
LABORATORIES
Unit 8 Woodeldside Business Park, Pontllanfraith,
Blackwood NP12 2DG, United Kingdom;
+44 (0) 1495 229219; Fax: +44 (0) 1495 228331;
blackwoodenquiries@kiwa.co.uk;
www.kiwa.co.uk
CCQS UK LTD
Westgate Road, London W5 1YY, United Kingdom;
+44 (0)20 8991 3488; info@ccqs.co.uk; www.ccqs.
co.uk
CEM INTERNATIONAL LTD
The Atrium Business Centre Curtis Road, Dorking Surrey
RH4 1XA, United Kingdom; +44 (0) 1306 646388; Fax:
+44 (0) 1306 646389; info@cem-international.co.uk;
www.cem-international.co.uk
CONFORMANCE SERVICES LTD
Conformance House, 24 Tidnock Ave., Congleton,
Cheshire CW12 2HW, United Kingdom; +44 (0)1260
270729; Fax: +44 (0)1260 270729; enquiries@
conformance-services.com; www.conformance-
services.com
ERICSSON LIMITED
Unit 4, Midleton Gate, Guildford Business Park,
Guildford, GU2 8SD United Kingdom; +44 (0) 1483 30 36
66; Fax: +44 (0) 1483 30 35 37; kirit.surelia@ericsson.
com; www.ericsson.com
HURSLEY EMC SERVICES LTD
Unit 16 Brickeld Trading Est., Brickeld Lane,
Chandlers Ford, Eastleigh, Hampshire SO53 4DP,
United Kingdom; +44 (0)23 8027 1111; Fax: +44 (0)23
8027 1144; sales@hursley-emc.co.uk;www.hursley-
emc.co.uk
INTERTEK TESTING & CERTIFICATION
Intertek House, Cleeve Road, Leatherhead, Surrey
KT22 7SB, United Kingdom; +44 (0) 1372 370900; Fax:
+44 (0) 1372 370999; talban.sohi@intertek.com; www.
intertek.com
LLOYDS REGISTER GROUP LTD
71 Fenchurch St., London EC3M 4BS, United Kingdom;
+44 (0)20 7709 9166; Fax: +44 (0) 20 7488 4796;
london.client-management@lr.org; www.lr.org
MIRA LIMITED
Watling Street, Nuneaton Warwickshire CV10 0TU,
United Kingdom; +44 (0) 24 7635 5000; enquiries@mira.
co.uk; www.mira.co.uk
RFI GLOBAL SERVICES LTD
Pavilion A, Ashwood Park, Ashwood Way, Basingstoke
RG23 8BG, United Kingdom; +44 (0) 1256 312000;
Fax: +44 (0) 1256 312001; info@r-global.com; www.
r-global.com
SAFENET LIMITED
Denford Garage, Denford, Kettering, Northants
NN14 4EQ, United Kingdom; +44 (0) 1832 732 174;
sales@safenet.co.uk; www.safenet.co.uk
SAI GLOBAL ASSURANCE SERVICES
Winterhill House Snowdon Drive, Milton Keynes,
Buckinghamshire, MK6 1AX, United Kingdom;
+44 (0) 1926854111; Fax: +44 (0) 1926854222;
info.emea@saiglobal.com; www.saiglobal.com
SAMSUNG ELECTRONICS
EURO QA LAB
Blackbushe Business Park Saxony Way, Yateley
Hampshire GU46 6GG, United Kingdom; +44 (0)1252
863 800; Fax: +44 (0)1252 863 805; s.colclough@
samsung.com
SGS UNITED KINGDOM LIMITED
Inward Way, Rossmore Business Park, Ellesmere
Port, CH65 3 EN, United Kingdom;
+44 (0) 151 350 6666; Fax: +44 (0) 151 350 6600;
keith.hutchinson@sgs.com; www.uk.sgs.com
TECHNOLOGY INTERNATIONAL
EUROPE LTD
56 Shrivenham Hundred Business Park Shrivenham,
Swindon, Wiltshire SN6 8TY, United Kingdom; +44 (0)
1793 783137; Fax: +44 (0) 1793 782310; sales@iti.
co.uk; www.iti.co.uk
TRAC GLOBAL LTD
South Orbital Trading Park, Hedon Road, Hull
HU9 1NJ, United Kingdom; +44 (0)1482 801801; Fax:
+44 (0)1482 801806; emc@tracglobal.com; www.
tracglobal.com
TV SD BABT
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UK_PS_R_EEG13.indd 35 11/16/12 6:35 PM
ALASTAIR R. RUDDLE, PH.D.
Computational Electromagnetics Specialist
MIRA Limited

R
ADI ATED ELECTROMAGNETIC emi ssions
measurement standards for road vehicles were
developed at a time when the main threat
posed by radio-frequency noise from vehicles
was interference to broadcast transmissions
from spark ignition systems. Since that time,
however, on-going technological developments
have resulted in changes in the nature of both the emissions
from vehicles and the radio-based services under potential
threat. is raises questions as to whether the existing test
methods remain appropriate for modern vehicles.
The developments that impact on electromagnetic
emissions from modern vehicles arise from the following
technological trends in the automotive industry:
1. Replacement of traditional mechanical systems with
mechatronic solutions (anti-lock braking systems, steer-
by-wire etc.).
2. Use of more sophisticated technologies to deliver
existing electrical and electronic functions (PWM control
for vehicle lamps, faster processors etc.).
3. Moves towards greater integration between systems
in order to provide enhanced functionality (e.g. stability
control systems).
4. Introduction of new functions and services based on
wireless communications and operating at increasingly
high frequencies (vehicle telematics, Bluetooth, radar-based
adaptive cruise control etc.).
5. Wider exploitation of lightweight materials, rather
than traditional steel, in order to improve energy e ciency.
6. Increasing deployment of alternative powertrain tech-
nologies (e.g. battery, hybrid and fuel cell vehicles).
e latter prompted amendments in the fth edition
of CISPR 12 [1], which is referenced by the Automotive
EMC Directive [2], requiring vehicles with electric pow-
ertrain to be operated at 40 km/hr in order to ensure that
emissions from these components are taken account of.
A further amendment to CISPR 12 [3], which includes an
additional requirement for hybrid vehicles that both drive
systems should be operational during the measurements
where possible, is referenced by UNECE Regulation 10 [4],
which will replace the Automotive EMC Directive for EU
36
United Kingdom
Ruddle_UK_EEG13.indd 6 11/16/12 3:41 PM
ALASTAIR R. RUDDLE, PH.D.
Computational Electromagnetics Specialist
MIRA Limited

R
ADI ATED ELECTROMAGNETIC emi ssions
measurement standards for road vehicles were
developed at a time when the main threat
posed by radio-frequency noise from vehicles
was interference to broadcast transmissions
from spark ignition systems. Since that time,
however, on-going technological developments
have resulted in changes in the nature of both the emissions
from vehicles and the radio-based services under potential
threat. is raises questions as to whether the existing test
methods remain appropriate for modern vehicles.
The developments that impact on electromagnetic
emissions from modern vehicles arise from the following
technological trends in the automotive industry:
1. Replacement of traditional mechanical systems with
mechatronic solutions (anti-lock braking systems, steer-
by-wire etc.).
2. Use of more sophisticated technologies to deliver
existing electrical and electronic functions (PWM control
for vehicle lamps, faster processors etc.).
3. Moves towards greater integration between systems
in order to provide enhanced functionality (e.g. stability
control systems).
4. Introduction of new functions and services based on
wireless communications and operating at increasingly
high frequencies (vehicle telematics, Bluetooth, radar-based
adaptive cruise control etc.).
5. Wider exploitation of lightweight materials, rather
than traditional steel, in order to improve energy e ciency.
6. Increasing deployment of alternative powertrain tech-
nologies (e.g. battery, hybrid and fuel cell vehicles).
e latter prompted amendments in the fth edition
of CISPR 12 [1], which is referenced by the Automotive
EMC Directive [2], requiring vehicles with electric pow-
ertrain to be operated at 40 km/hr in order to ensure that
emissions from these components are taken account of.
A further amendment to CISPR 12 [3], which includes an
additional requirement for hybrid vehicles that both drive
systems should be operational during the measurements
where possible, is referenced by UNECE Regulation 10 [4],
which will replace the Automotive EMC Directive for EU
36
United Kingdom
Ruddle_UK_EEG13.indd 6 11/16/12 3:41 PM ADs_EEG13.indd 15 11/16/12 2:41 PM
United Kingdom
38
whole vehicle type approval purposes
with efect from November 2014 [5].
Amendments to UNECE Regulation
10 adopted in 2012 also describe new
radiated emissions test requirements
relating to on-board conductively-
coupled electrical charging systems
[6]. Wireless inductive charging of
vehicle traction batteries, which is
currently of growing interest, will
necessitate the development of further
emissions test requirements.
However, there may be emissions
at frequencies outside the existing
vehicle emissions test band, and
conventional vehicles may also be
equipped with systems that are dor-
mant until the wheels are in motion.
Tus, existing test methods may be
becoming less relevant as new tech-
nology is introduced. Tis article gives
an overview of an investigation into possible alternative ap-
proaches for measuring vehicle electromagnetic emissions
that was motivated by these issues.
EXISTING VEHICLE EMISSIONS
MEASUREMENT PRACTICES
Unlike the emissions testing standards used by many
other industries, such as CISPR 22 [7], there is no require-
ment for height scanning of the antenna and rotation of
the test object in order to identify the maximum emission
levels. Te approach for vehicles is based on more restricted
snapshots for fxed test confgurations.
Current vehicle-level radiated emissions test require-
ments ([2], [5]) specify broadband and narrowband emis-
sions measurements over the band 301000 MHz using an
antenna at a fxed point relative to the vehicle. Broadband
emissions are classifed as signals with bandwidths that
exceed the receiver bandwidth, and have pulse repetition
frequencies that are smaller than the receiver bandwidth.
Narrowband emissions are classifed as signals with band-
widths that are smaller than the receiver bandwidth, and
have pulse repetition frequencies that are greater than the
receiver bandwidth. In CISPR 12, both broadband and nar-
rowband measurements are carried out using a receiver
bandwidth of 120 kHz.
For conventional vehicles, broadband measurements
are carried out using a quasi-peak detector with the en-
gine running at constant speed (1500 rpm), primarily to
detect emissions from the spark ignition system. Vehicles
with electric powertrain are required to be operated at
40 km/hr (or maximum speed if this is lower), either on a
dynamometer under negligible load or in a free-wheeling
mode with the driven wheels raised
up using non-conductive axle stands.
As quasi-peak measurements require
a signifcant dwell time, a common ap-
proach is to use peak measurements to
quickly identify those frequencies that
are sufciently close to the limits to
merit the slower quasi-peak measure-
ments. Narrowband measurements
are carried out using an average detec-
tor with the vehicle switched on but
without the engine running, in order
to detect emissions from on-board
electronic modules.
Te most common test confgura-
tion is an open area test site (OATS),
or a semi-anechoic chamber (SAC),
with an antenna mounted 3 m high
at a distance of 10 m from the side
of the vehicle and aligned with the
centre of the engine (as illustrated in
Fig. 1). However, the standards also
permit measurements at a reduced
distance of 3 m, with the antenna
FIGURE 1: Standard 10 m emissions test on MIRA open area test site.
TABLE 1: Summary of tests carried out on sample vehicles.
Vehicle Static Mode Dynamic Mode Other Tests
Motorcycle
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
Family Car
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
Hybrid Vehicle
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
Intermittent, 30-1000 MHz,
10m
Light Goods
Vehicle
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
Luxury Car
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
Static, 1-10 GHz, 3m
10m
City Car
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
Car with
Composite Body
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
United Kingdom RUDDLE
39
height reduced to 1.8 m. e limits for
the 3 m measurements are based on
the 10 m limits with a 10 dB increase,
reecting free-space attenuation for a
point source.
e emission level is simply taken
to be the maximum of the values
recorded on either side of the vehicle.
Nonetheless, sweep times can be
signicant, even without the require-
ment to identif y the direction of
maximum emission, so broadband
antennas are normally used in order
to minimize test disruptions.
Although there is an SAE Recom-
mended Practice [8] for measurement
of radiated electric and magnetic eld
emissions at lower frequencies (from
9 kHz to 30 MHz) for vehicles with
electric powertrain, this is not a re-
quirement and there are no similar recommendations for
the testing of conventional (i.e. internal combustion engine)
vehicles at these frequencies.
INVESTIGATION OF ALTERNATIVE
TEST METHODS
Measurements based on both the conventional
xed geometry of CISPR 12 and the height/azimuth
scanning approach of ANSI C63.4 [9] were carried
out at frequencies from 9 kHz to 1000 MHz on
an open area test site (OATS) for a range of seven
dierent vehicles using the static test modes of
CISPR 12. Various practical issues limited the
ability to replicate these methods exactly. In earlier
investigations of alternative powertrain vehicles at
low frequency [10] it was found that measurements
at the standard 10 m distance were impracticable
because of high and uctuating ambient signals.
In this work, therefore, the measurement distance
was reduced to 3 m for frequencies below 30 MHz.
A bilog antenna at 3 m height was used for
measurements in the band 301000 MHz, for
both horizontal and vertical eld polarizations. For
the measurements below 30 MHz, an active loop
antenna at a height of 1.8 m was used to detect
transverse and radial horizontal magnetic elds,
and an active monopole antenna mounted at a
height of 1 m was used to measure the vertically
polarized electric eld.
As there are vehicle systems that are dormant
unless the wheels are in motion, measurements
were also made for a dynamic, steady-state operat-
ing mode that was achieved by raising the driven
wheels so that the powertrain could be engaged in
free-wheeling operation (as used for electric pow-
ertrain testing). For two vehicles, emissions from
various intermittent sources, and in the band 110
GHz, were also investigated. e antennas used
above 1 GHz included a bilog, a dual-polarized
horn and a double-ridged horn. e range of sample
vehicles and the tests that were carried out on them
are summarized in Table 1 on page 38.
For the ANSI-based measurements with antenna height
and angular scanning, the vehicle wheelbase was centred
on the turntable axis and the antenna was positioned at a
distance of X m as indicated in Fig. 2, such that the separa-
tion between the antenna and the vehicle was at least X m
FIGURE 2: Geometry for ANSI-based scanning measurements.
United Kingdom
38
whole vehicle type approval purposes
with efect from November 2014 [5].
Amendments to UNECE Regulation
10 adopted in 2012 also describe new
radiated emissions test requirements
relating to on-board conductively-
coupled electrical charging systems
[6]. Wireless inductive charging of
vehicle traction batteries, which is
currently of growing interest, will
necessitate the development of further
emissions test requirements.
However, there may be emissions
at frequencies outside the existing
vehicle emissions test band, and
conventional vehicles may also be
equipped with systems that are dor-
mant until the wheels are in motion.
Tus, existing test methods may be
becoming less relevant as new tech-
nology is introduced. Tis article gives
an overview of an investigation into possible alternative ap-
proaches for measuring vehicle electromagnetic emissions
that was motivated by these issues.
EXISTING VEHICLE EMISSIONS
MEASUREMENT PRACTICES
Unlike the emissions testing standards used by many
other industries, such as CISPR 22 [7], there is no require-
ment for height scanning of the antenna and rotation of
the test object in order to identify the maximum emission
levels. Te approach for vehicles is based on more restricted
snapshots for fxed test confgurations.
Current vehicle-level radiated emissions test require-
ments ([2], [5]) specify broadband and narrowband emis-
sions measurements over the band 301000 MHz using an
antenna at a fxed point relative to the vehicle. Broadband
emissions are classifed as signals with bandwidths that
exceed the receiver bandwidth, and have pulse repetition
frequencies that are smaller than the receiver bandwidth.
Narrowband emissions are classifed as signals with band-
widths that are smaller than the receiver bandwidth, and
have pulse repetition frequencies that are greater than the
receiver bandwidth. In CISPR 12, both broadband and nar-
rowband measurements are carried out using a receiver
bandwidth of 120 kHz.
For conventional vehicles, broadband measurements
are carried out using a quasi-peak detector with the en-
gine running at constant speed (1500 rpm), primarily to
detect emissions from the spark ignition system. Vehicles
with electric powertrain are required to be operated at
40 km/hr (or maximum speed if this is lower), either on a
dynamometer under negligible load or in a free-wheeling
mode with the driven wheels raised
up using non-conductive axle stands.
As quasi-peak measurements require
a signifcant dwell time, a common ap-
proach is to use peak measurements to
quickly identify those frequencies that
are sufciently close to the limits to
merit the slower quasi-peak measure-
ments. Narrowband measurements
are carried out using an average detec-
tor with the vehicle switched on but
without the engine running, in order
to detect emissions from on-board
electronic modules.
Te most common test confgura-
tion is an open area test site (OATS),
or a semi-anechoic chamber (SAC),
with an antenna mounted 3 m high
at a distance of 10 m from the side
of the vehicle and aligned with the
centre of the engine (as illustrated in
Fig. 1). However, the standards also
permit measurements at a reduced
distance of 3 m, with the antenna
FIGURE 1: Standard 10 m emissions test on MIRA open area test site.
TABLE 1: Summary of tests carried out on sample vehicles.
Vehicle Static Mode Dynamic Mode Other Tests
Motorcycle
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
Family Car
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
Hybrid Vehicle
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
10m
Light Goods
Vehicle
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
Luxury Car
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
10m
City Car
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
Car with
Composite Body
CISPR 12, 30-1000 MHz, 10m
ANSI, 30-1000 MHz, 10m
CISPR 12, 0.009-30 MHz, 3m
ANSI, 0.009-30 MHz, 3m
39
height reduced to 1.8 m. e limits for
the 3 m measurements are based on
the 10 m limits with a 10 dB increase,
reecting free-space attenuation for a
point source.
e emission level is simply taken
to be the maximum of the values
recorded on either side of the vehicle.
Nonetheless, sweep times can be
signicant, even without the require-
ment to identif y the direction of
maximum emission, so broadband
antennas are normally used in order
to minimize test disruptions.
Although there is an SAE Recom-
mended Practice [8] for measurement
of radiated electric and magnetic eld
emissions at lower frequencies (from
9 kHz to 30 MHz) for vehicles with
electric powertrain, this is not a re-
quirement and there are no similar recommendations for
the testing of conventional (i.e. internal combustion engine)
vehicles at these frequencies.
INVESTIGATION OF ALTERNATIVE
TEST METHODS
Measurements based on both the conventional
xed geometry of CISPR 12 and the height/azimuth
scanning approach of ANSI C63.4 [9] were carried
out at frequencies from 9 kHz to 1000 MHz on
an open area test site (OATS) for a range of seven
dierent vehicles using the static test modes of
CISPR 12. Various practical issues limited the
ability to replicate these methods exactly. In earlier
investigations of alternative powertrain vehicles at
low frequency [10] it was found that measurements
at the standard 10 m distance were impracticable
because of high and uctuating ambient signals.
In this work, therefore, the measurement distance
was reduced to 3 m for frequencies below 30 MHz.
A bilog antenna at 3 m height was used for
measurements in the band 301000 MHz, for
both horizontal and vertical eld polarizations. For
the measurements below 30 MHz, an active loop
antenna at a height of 1.8 m was used to detect
transverse and radial horizontal magnetic elds,
and an active monopole antenna mounted at a
height of 1 m was used to measure the vertically
polarized electric eld.
As there are vehicle systems that are dormant
unless the wheels are in motion, measurements
were also made for a dynamic, steady-state operat-
ing mode that was achieved by raising the driven
wheels so that the powertrain could be engaged in
free-wheeling operation (as used for electric pow-
ertrain testing). For two vehicles, emissions from
various intermittent sources, and in the band 110
GHz, were also investigated. e antennas used
above 1 GHz included a bilog, a dual-polarized
horn and a double-ridged horn. e range of sample
vehicles and the tests that were carried out on them
are summarized in Table 1 on page 38.
For the ANSI-based measurements with antenna height
and angular scanning, the vehicle wheelbase was centred
on the turntable axis and the antenna was positioned at a
distance of X m as indicated in Fig. 2, such that the separa-
tion between the antenna and the vehicle was at least X m
FIGURE 2: Geometry for ANSI-based scanning measurements.
United Kingdom
40
(where X=10 m for measurements in the band 301000 MHz
and X=3 m for measurements in the band 9 kHz to 30 MHz).
Preliminary scans, which were needed in order to iden-
tify emissions frequencies for more detailed investigation,
were carried out on both sides of the vehicle at xed heights
of 1 m for vertical polarization and 2 m for horizontal po-
larization. e selection of these particular congurations
for the preliminary scans was based on practical experience
of these types of measurements. As in the method based
on CISPR 12, the measurements were carried out using a
quasi-peak detector for broadband emissions and an average
detector for narrowband emissions. Where time permitted,
such as when few emissions were found, additional data
was collected at dierent test positions.
RESULTS FOR FREQUENCIES BELOW 30 MHZ
Low frequency measurements were not carried out for
the city car or the family car, and only the motorcycle and
luxury car were tested in the steady-state dynamic mode.
Measurements for the hybrid, light goods and composite
vehicles were limited to the static mode only.
No low frequency emissions were detected from the
motorcycle in either static or dynamic modes. e light
goods vehicle (only tested in the static mode) provided
narrowband emissions at 16 MHz only, which probably
arises from a control module clock signal. For the composite
vehicle, broadband emissions were found for two polariza-
tions (see Fig. 3).
Broadband emissions were also detected from the hybrid
vehicle (see Fig. 4), together with a few narrowband emis-
sions. Both static and dynamic measurements were carried
out for the luxury vehicle. In this case a few broadband
emissions were found, but for the static mode only, while a
large number of narrowband emissions were obtained for
the dynamic mode only (see Fig. 5). No reliable emissions
were detected from any of the vehicles in measurements
using the active monopole antenna.
RESULTS FOR FREQUENCY RANGE
301000 MHZ
Measurements in this band were carried out for all of the
vehicles in the conventional static mode. e motorcycle,
family car and luxury cars were also tested in the steady-
state dynamic mode.
For the family car, the only emissions detected were
broadband for vertical polarization, which were present in
both static and dynamic modes. e results obtained from
the luxury car, however, were limited to a few broadband
emissions, in the static mode only, again only for vertical
polarization.
Almost no emissions were detected from the light goods
vehicle. Only broadband emissions were detected from the
hybrid vehicle, while for the composite vehicle narrowband
emissions were obtained for vertical polarization and broad-
band emissions were detected for both polarizations. For
the city car, both broadband (see Fig. 6) and narrowband
emissions were detected, mostly for vertical polarization.
For the motorcycle, broadband emissions were detected
for both vertical and horizontal polarization, in both static
and dynamic modes (shown in Figs. 78). Narrowband
emissions were also obtained for the motorcycle in both
FIGURE 3: Composite vehicle, comparison of low frequency CISPR 12 and
ANSI-based results: broadband, transverse horizontal polarization, static mode.
FIGURE 4: Hybrid vehicle, comparison of low frequency CISPR 12 and
ANSI-based results: broadband, radial horizontal polarization, static mode.
FIGURE 5: Luxury car, comparison of low frequency CISPR 12 and ANSI-
based results: narrowband, radial horizontal polarization, dynamic mode.
FIGURE 6: City car, comparison of CISPR 12 & ANSI-based results:
broadband, vertical polarization, static mode.
United Kingdom
40
(where X=10 m for measurements in the band 301000 MHz
and X=3 m for measurements in the band 9 kHz to 30 MHz).
Preliminary scans, which were needed in order to iden-
tify emissions frequencies for more detailed investigation,
were carried out on both sides of the vehicle at xed heights
of 1 m for vertical polarization and 2 m for horizontal po-
larization. e selection of these particular congurations
for the preliminary scans was based on practical experience
of these types of measurements. As in the method based
on CISPR 12, the measurements were carried out using a
quasi-peak detector for broadband emissions and an average
detector for narrowband emissions. Where time permitted,
such as when few emissions were found, additional data
was collected at dierent test positions.
RESULTS FOR FREQUENCIES BELOW 30 MHZ
Low frequency measurements were not carried out for
the city car or the family car, and only the motorcycle and
luxury car were tested in the steady-state dynamic mode.
Measurements for the hybrid, light goods and composite
vehicles were limited to the static mode only.
No low frequency emissions were detected from the
motorcycle in either static or dynamic modes. e light
goods vehicle (only tested in the static mode) provided
narrowband emissions at 16 MHz only, which probably
arises from a control module clock signal. For the composite
vehicle, broadband emissions were found for two polariza-
tions (see Fig. 3).
Broadband emissions were also detected from the hybrid
vehicle (see Fig. 4), together with a few narrowband emis-
sions. Both static and dynamic measurements were carried
out for the luxury vehicle. In this case a few broadband
emissions were found, but for the static mode only, while a
large number of narrowband emissions were obtained for
the dynamic mode only (see Fig. 5). No reliable emissions
were detected from any of the vehicles in measurements
using the active monopole antenna.
RESULTS FOR FREQUENCY RANGE
301000 MHZ
Measurements in this band were carried out for all of the
vehicles in the conventional static mode. e motorcycle,
family car and luxury cars were also tested in the steady-
state dynamic mode.
For the family car, the only emissions detected were
broadband for vertical polarization, which were present in
both static and dynamic modes. e results obtained from
the luxury car, however, were limited to a few broadband
emissions, in the static mode only, again only for vertical
polarization.
Almost no emissions were detected from the light goods
vehicle. Only broadband emissions were detected from the
hybrid vehicle, while for the composite vehicle narrowband
emissions were obtained for vertical polarization and broad-
band emissions were detected for both polarizations. For
the city car, both broadband (see Fig. 6) and narrowband
emissions were detected, mostly for vertical polarization.
For the motorcycle, broadband emissions were detected
for both vertical and horizontal polarization, in both static
and dynamic modes (shown in Figs. 78). Narrowband
emissions were also obtained for the motorcycle in both
FIGURE 3: Composite vehicle, comparison of low frequency CISPR 12 and
ANSI-based results: broadband, transverse horizontal polarization, static mode.
FIGURE 4: Hybrid vehicle, comparison of low frequency CISPR 12 and
ANSI-based results: broadband, radial horizontal polarization, static mode.
FIGURE 5: Luxury car, comparison of low frequency CISPR 12 and ANSI-
based results: narrowband, radial horizontal polarization, dynamic mode.
FIGURE 6: City car, comparison of CISPR 12 & ANSI-based results:
broadband, vertical polarization, static mode.
United Kingdom Ruddle
41
static and dynamic modes, although very few such emissions
were detected for horizontal polarization.
RESULTS FOR FREQUENCIES ABOVE 1 GHZ
Measurements based on the CISPR 12 approach were also
carried out for the static mode over the band 110 GHz in
an anechoic chamber, but only for the luxury car and for
the composite vehicle.
Te emissions were monitored using a receiver confg-
ured with a 1 MHz measurement bandwidth and a 500
kHz frequency increment. Te antenna was positioned at
1 m height and placed at a 3 m distance (due to space con-
straints in the anechoic chamber) and at multiple positions
alongside the vehicle (because of the narrower beamwidths
of the antennas at these frequencies). Te test positions
investigated included:
Position 1 drivers side, aligned with rear axle
Position 2 drivers side, aligned with midpoint
Position 3 drivers side, aligned with front axle
Position 4 front, aligned with vehicle axis
Broadband emissions were found for both polarizations
at frequencies up to 3 GHz for the luxury car, and at up
to 6 GHz for the composite vehicle. Results for the latter
were clearly clustered by position for horizontal polariza-
tion (see Fig. 9), but not for vertical polarization (see Fig.
10). However, no narrowband emissions were detectable
(using a criterion that the emission should be at least 4 dB
above the noise foor) from either of the vehicles tested at
these frequencies.
INTERMITTENT SOURCES, 301000 MHZ
In order to investigate the emissions from electronic
systems under more realistic driving conditions, measure-
ments were carried out in a large semi-anechoic chamber
(SAC). Te SAC (shown in Fig. 11) is equipped with a dyna-
mometer, which allows vehicles to be operated under road-
load conditions whilst carrying out EMC measurements.
Tus, vehicle emissions can be measured under realistic
driving conditions, including during acceleration and decel-
eration cycles, using this facility. A further advantage is that
the emissions from vehicle sources are more easily identifed
and quantifed in the SAC, which minimizes the impact
of high ambient signals such as broadcast transmissions.
Due to the relative geometry of the dynamometer in the
SAC, the measurements were made from the front of the ve-
hicle, with the vehicle positioned on the dynamometer and
the measuring antenna (a bilog) positioned 10 m forward of
the front axle at a height of 3 m. Measurements were made
during operational cycles of each of the following systems:
Electric window operating (window wound up and
down until sweeps were completed);
Windscreen wipers operating in fast and slow modes;
Rear window heater on;
Internal fan heater operating in fast and slow modes;
Indicators operating on drivers side;
Headlights on;
Engine idling at 1500 revs/min (for comparison with
standard CISPR 12 measurements).
FIGURE 7: Motorcycle, comparison of CISPR 12 measurements for dynamic
and static modes of operation: broadband, vertical polarization.
FIGURE 8: Motorcycle, comparison of ANSI preliminary scans for dynamic
and static modes of operation: broadband, vertical polarization.
FIGURE 9: High frequency broadband emissions for composite vehicle at
different positions, horizontal polarization.
FIGURE 10: High frequency broadband emissions for composite vehicle at
different positions, vertical polarization.
United Kingdom
42
For these sources, fve maximum
hold measurements with the peak de-
tector (each lasting 10 seconds) were
carried out while the system under
test was operated.
Measurements were also made
during the following dynamometer
drive-cycles (the sweep time varies
as detailed below for specifc drive-
cycles):
Acceleration to 50 km/h (over a
period of 20 s);
Deceleration from 50 km/h (over
a period of 20 s);
Constant 50 km/h.
Te fan heater and electric win-
dows produced emissions that ap-
proached, but did not exceed, the
limits. However, emissions at levels
above the limits were observed for
the constant speed and acceleration/
deceleration modes. For the luxury car, emissions of up
to 10 dB above the limits were found at constant speed
for vertical polarization. Tus, there may be some merit
in investigating vehicle emissions under constant speed
conditions, which can be achieved using current CISPR 12
methods if a dynamometer is available.
MEASUREMENT ISSUES
In these comparison of CISPR 12 and ANSI-based
methods, the ANSI-based values were generally higher, and
markedly so in some cases, whereas the CISPR 12 approach
allowed larger numbers of emissions to be identifed much
more rapidly, but at the cost of limited amplitude and direc-
FIGURE 11: Vehicle under EMC test on dynamometer in MIRA SAC.
United Kingdom
42
For these sources, fve maximum
hold measurements with the peak de-
tector (each lasting 10 seconds) were
carried out while the system under
test was operated.
Measurements were also made
during the following dynamometer
drive-cycles (the sweep time varies
as detailed below for specifc drive-
cycles):
Acceleration to 50 km/h (over a
period of 20 s);
Deceleration from 50 km/h (over
a period of 20 s);
Constant 50 km/h.
Te fan heater and electric win-
dows produced emissions that ap-
proached, but did not exceed, the
limits. However, emissions at levels
above the limits were observed for
the constant speed and acceleration/
deceleration modes. For the luxury car, emissions of up
to 10 dB above the limits were found at constant speed
for vertical polarization. Tus, there may be some merit
in investigating vehicle emissions under constant speed
conditions, which can be achieved using current CISPR 12
methods if a dynamometer is available.
MEASUREMENT ISSUES
In these comparison of CISPR 12 and ANSI-based
methods, the ANSI-based values were generally higher, and
markedly so in some cases, whereas the CISPR 12 approach
allowed larger numbers of emissions to be identifed much
more rapidly, but at the cost of limited amplitude and direc-
FIGURE 11: Vehicle under EMC test on dynamometer in MIRA SAC.
United Kingdom Ruddle
43
tional information. Tis is due to the time taken to maxi-
mize the emissions in the ANSI-based approach through
height and angular scanning. In this study, the time that
was available for the ANSI-based measurements was twice
that allocated for the measurements based in CISPR 12.
Furthermore, the emissions frequencies identifed using the
two methods are not always identical. Tis perhaps resulted
from diferences in the relative geometry of the vehicle and
the antenna between the CISPR-based measurements and
the preliminary scans used in the ANSI-based approach.
Comparison of measurements using the two approaches
on real vehicles on the OATS was also complicated by ap-
parent drift in the levels during the time taken to maximize
the emissions. Tus, in many cases the maximized results
were in fact lower than those recorded from the preliminary
scan. Tis problem did not arise in measurements carried
out using a noise source to excite the wiring of two of the
vehicles (in a dormant state), which were used to investi-
gate the correlation between measurements at 3 m and 10
m distances.
Consequently, the emissions identifed from the two
methods were not identical and there were emissions, of-
ten at high levels from the CISPR 12 measurements, which
were missed using the ANSI method. Tis, together with
the drift problem and the fact that the number of emissions
that can be investigated using the ANSI method is limited
by the time taken to maximize the levels, suggests that the
ANSI results do not necessarily provide a better view of
the overall emissions profle than can be obtained using
methods based on CISPR 12.
In practice, therefore, both methods have weaknesses in
characterizing the emissions profles of vehicles. A more
cost efective approach for improving the spectral and
spatial coverage of vehicle emissions measurements could
be to use additional sweeps at diferent fxed measurement
locations, rather than the adoption of inherently slower
and more limited height and azimuth scanning methods.
However, this would mean further expansion of the test
requirements.
In the band 1-10 GHz it was not possible to investigate
the ANSI-based method due to lack of a suitable turntable in
the anechoic chamber. Nonetheless, the greater bandwidth
to be covered and the smaller beamwidths of the antennas
used in this band resulted in long measurement times for
the approach based on CISPR 12.
CONCLUSIONS
Te measurements carried out in this project, at frequen-
cies from 9 kHz to 10 GHz, demonstrate that emissions are
present at frequencies outside the existing vehicle emissions
test band, both above 1 GHz and (for magnetic feld) below
30 MHz. Tus, there is a case for extending the frequency
scope of automotive emissions measurement requirements
both above and below the current test band. In order to
United Kingdom
44
facilitate this, suitable frequency and emissions limits, as
well as appropriate measurement methods, would need to
be defned for frequencies above 1 GHz and below 30 MHz.
Te investigation of emissions under the steady-state
dynamic test condition (with the driven wheels in motion)
and from intermittent vehicle sources (including accel-
eration and deceleration cycles as well as systems such as
heaters, lights and electric windows) also shows that the
operational emissions characteristics are likely to be difer-
ent from those for the static modes that are currently tested.
Te steady-state dynamic test condition could be accom-
modated using current test methods, and can be achieved
using free-wheeling operation as in this work, although a
dynamometer (as used in [3]) provides a more realistic and
satisfactory solution. It is therefore recommended that a
dynamic steady-state mode should be considered for future
development of automotive emissions standards.
Te measurements reported here show that both CISPR
12 and ANSI C63.4 based methods have weaknesses in
characterizing the emissions profles of vehicles. Tese
results also suggest that the use of additional sweeps at
diferent fxed measurement locations would perhaps be a
more efcient approach for improving the spatial coverage
and reliability of vehicle emissions measurements than the
adoption of inherently slower and more limited height and
azimuth scanning methods. Tis approach may also be
more suitable for alternative powertrain vehicles, which
include architectures that combine spark-ignition engines
and electric motors, and may employ multiple traction ma-
chines (e.g. wheel-mounted motors). However, increasing
the number of fxed emissions measurement points would
mean further expansion of the test requirements in addition
to the expanded frequency scope and steady-state dynamic
test mode that are recommended above.
Te time taken to complete measurements using the
current methods is already considered to be too high by
industry, so any movement towards increasing emissions
measurement time would not be regarded favourably.
However, measuring a wider range of frequencies would
inevitably require more time, even using methods based
on CISPR 12. Consequently, alternative approaches that
could speed up the measurement process would be highly
desirable.
Time-domain emissions measurement methods ofer
much greater speed more traditional frequency-domain ap-
proaches (acceleration factors of 10-100 have been reported
[11][12]), and could therefore allow many more measure-
ment confgurations to be investigated within a given time
than conventional frequency sweeps. Te results obtained in
this work suggest that making additional CISPR type fxed
measurements is perhaps more benefcial than maximizing
a few emissions. Faster, time-domain measurements could
be used for this purpose, or to reduce the search
space by more rapidly identifying emissions that
are required to be maximized. Furthermore, time-
domain methods are inherently much better suited
to the measurement of intermittent sources, for
which cycle times are too short for reliable mea-
surements using frequency domain methods.
Measurement of emissions in the 110 GHz
band was also found to be slow. For radiated im-
munity measurements, reverberation conditions
offer several advantages, such as reducing the
power required to achieve high feld levels and
eliminating the need to illuminate the equipment
under test from a particular direction and with
a specifc feld polarization. Furthermore, rever-
beration chambers are much cheaper to construct
than anechoic or semi-anechoic chambers of
comparable size as expensive absorbing material
is not required. Te use of reverberation chambers
for achieving faster emissions measurements has
also been considered [13], as this test environment
provides more comprehensive coverage in terms of
emission angles and feld polarizations. Methods
for measuring both emissions and immunity char-
acteristics are described in IEC 61000-4-21 [14].
In order to achieve the necessary statistical feld
properties the reverberation chamber must support
a sufciently large number of modes. Although it
would be impractical to have a sufciently large
chamber for use at very low frequencies, as for
immunity measurements, reverberation chambers
become increasingly successful (in that they are
able to support increasing numbers of modes) at
high frequencies. Tus, a reverberation chamber
45
could be used to rapidly identify signicant emissions at
high frequencies, perhaps for more detailed investigation
using other techniques.
ACKNOWLEDGEMENT
The work reported here was carried out as part of a
contract from the UKs Radiocommunications Agency,
which is now part of Ofcom (Office of Communications).
The report on the study that this article is based on [15]
is available from the Ofcom website.
REFERENCES
[1] CISPR 12:2001, Vehicles, motorboats and spark-ignited
engine driven devices. Radio disturbances characteristics. Lim-
its and methods of measurements, 2001.
[2] Directive 2004/104/EC of 14 October 2004 adapting to
technical progress Council Directive 72/245/EEC relating to the
radio interference (electromagnetic compatibility) of vehicles
and amending Directive 70/156/EEC on the approximation of
the laws of the Member States relating to the type-approval of
motor vehicles and their trailers, Official Journal of the Euro-
pean Union, No. L 337, 13th November 2004, pp. 13-58.
[3] CISPR 12:2001+A1:2005, Vehicles, motorboats and
spark-ignited engine driven devices. Radio disturbances charac-
teristics. Limits and methods of measurements, 2005.
[4] UNECE, Regulation No. 10 Uniform provisions
concerning the approval of vehicles with regard to
electromagnetic compatibility, Add. 9, Rev. 3, 14th
August 2008.
[5] Directive 2007/46/EC of the European Parlia-
ment and of the Council of 5 September 2007 estab-
lishing a framework for the approval of motor vehicles
and their trailers, and of systems, components and
separate technical units intended for such vehicles,
Official Journal of the European Union, No. L 263, 9th
October 2007, pp. 1-160.
[6] UNECE, Regulation No. 10 Uniform provi-
sions concerning the approval of vehicles with regard
to electromagnetic compatibility, Add. 9, Rev. 4, 6th
March 2012.
[7] CISPR 22, Limits and methods of measure-
ment of electromagnetic disturbance characteristics
of information technology equipment, 1999.
[8] SAE Recommended Practice J551-5:2004,
Performance levels and methods of measurement
of magnetic and electric field strength from electric
vehicles, broadband, 9 kHz to 30 MHz.
[9] ANSI C63.4, American National Standard for
Methods of Measurement of Radio-Noise Emission
from Low-Voltage Electrical and Electronic Equip-
ment in the Range of 9 kHz to 40 GHz, 2001.
[10] A.R. Ruddle, D.A. Topham and D.D. Ward,
Investigation of electromagnetic emissions mea-
surements practices for alternative powertrain road
vehicles, Proceedings of 2003 IEEE EMC Symposium,
Boston, USA, August 2003, pp. 543-547.
[11] F. Krug and P. Russer, Ultra-fast broadband
EMI measurement in time-domain using FFT and
periodogram, Proceedings of 5th European Sympo-
sium on EMC, Sorrento, Italy, September 2002, pp.
379384.
[12] C. Keller and K. Feser, Non-linear superposition of
broadband spectra for fast emission measurements in time-
domain, Proceedings of 15th Zurich EMC Symposium, Zurich,
Switzerland, February 2003, pp. 505510.
[13] C.L. Holloway, P.F. Wilson, G. Koepke and M. Candidi,
Total radiated power limits for emission measurements in a
reverberation chamber, Proceedings of IEEE 2003 EMC Sym-
posium, Boston, USA, August 2003, pp. 838843.
[14] IEC 61000-4-21, Electromagnetic compatibility (EMC) -
Part 4-21: Testing and measurement techniques - Reverberation
chamber test methods, Edition 2.0, January 2011,
[15] A.R. Ruddle, Investigation of road vehicle electromag-
netic emissions measurement methods, MIRA Report No.
04-0845046, 18th March 2004. Available at: http://stakeholders.
ofcom.org.uk/binaries/research/technology-research/mira_04-
0845046.pdf
ALASTAIR RUDDLE is with MIRA Ltd (Nuneaton, UK), where much
of his work is concerned with the use of numerical modeling methods to
investigate electromagnetic issues, primarily for automotive applica-
tions. Specific areas of interest include EMC, installed performance
of antennas, human exposure to electromagnetic fields, and associ-
ated test and measurement methods. He can be contacted at alastair.
ruddle@mira.co.uk.
FREE WEBINARS
Keep abreast of the latest EMC topics
Check the schedule at interferencetechnology.com
United Kingdom
44
facilitate this, suitable frequency and emissions limits, as
well as appropriate measurement methods, would need to
be defned for frequencies above 1 GHz and below 30 MHz.
Te investigation of emissions under the steady-state
dynamic test condition (with the driven wheels in motion)
and from intermittent vehicle sources (including accel-
eration and deceleration cycles as well as systems such as
heaters, lights and electric windows) also shows that the
operational emissions characteristics are likely to be difer-
ent from those for the static modes that are currently tested.
Te steady-state dynamic test condition could be accom-
modated using current test methods, and can be achieved
using free-wheeling operation as in this work, although a
dynamometer (as used in [3]) provides a more realistic and
satisfactory solution. It is therefore recommended that a
dynamic steady-state mode should be considered for future
development of automotive emissions standards.
Te measurements reported here show that both CISPR
12 and ANSI C63.4 based methods have weaknesses in
characterizing the emissions profles of vehicles. Tese
results also suggest that the use of additional sweeps at
diferent fxed measurement locations would perhaps be a
more efcient approach for improving the spatial coverage
and reliability of vehicle emissions measurements than the
adoption of inherently slower and more limited height and
azimuth scanning methods. Tis approach may also be
more suitable for alternative powertrain vehicles, which
include architectures that combine spark-ignition engines
and electric motors, and may employ multiple traction ma-
chines (e.g. wheel-mounted motors). However, increasing
the number of fxed emissions measurement points would
mean further expansion of the test requirements in addition
to the expanded frequency scope and steady-state dynamic
test mode that are recommended above.
Te time taken to complete measurements using the
current methods is already considered to be too high by
industry, so any movement towards increasing emissions
measurement time would not be regarded favourably.
However, measuring a wider range of frequencies would
inevitably require more time, even using methods based
on CISPR 12. Consequently, alternative approaches that
could speed up the measurement process would be highly
desirable.
Time-domain emissions measurement methods ofer
much greater speed more traditional frequency-domain ap-
proaches (acceleration factors of 10-100 have been reported
[11][12]), and could therefore allow many more measure-
ment confgurations to be investigated within a given time
than conventional frequency sweeps. Te results obtained in
this work suggest that making additional CISPR type fxed
measurements is perhaps more benefcial than maximizing
a few emissions. Faster, time-domain measurements could
be used for this purpose, or to reduce the search
space by more rapidly identifying emissions that
are required to be maximized. Furthermore, time-
domain methods are inherently much better suited
to the measurement of intermittent sources, for
which cycle times are too short for reliable mea-
surements using frequency domain methods.
Measurement of emissions in the 110 GHz
band was also found to be slow. For radiated im-
munity measurements, reverberation conditions
offer several advantages, such as reducing the
power required to achieve high feld levels and
eliminating the need to illuminate the equipment
under test from a particular direction and with
a specifc feld polarization. Furthermore, rever-
beration chambers are much cheaper to construct
than anechoic or semi-anechoic chambers of
comparable size as expensive absorbing material
is not required. Te use of reverberation chambers
for achieving faster emissions measurements has
also been considered [13], as this test environment
provides more comprehensive coverage in terms of
emission angles and feld polarizations. Methods
for measuring both emissions and immunity char-
acteristics are described in IEC 61000-4-21 [14].
In order to achieve the necessary statistical feld
properties the reverberation chamber must support
a sufciently large number of modes. Although it
would be impractical to have a sufciently large
chamber for use at very low frequencies, as for
immunity measurements, reverberation chambers
become increasingly successful (in that they are
able to support increasing numbers of modes) at
high frequencies. Tus, a reverberation chamber
45
could be used to rapidly identify signicant emissions at
high frequencies, perhaps for more detailed investigation
using other techniques.
ACKNOWLEDGEMENT
The work reported here was carried out as part of a
contract from the UKs Radiocommunications Agency,
which is now part of Ofcom (Office of Communications).
The report on the study that this article is based on [15]
is available from the Ofcom website.
REFERENCES
[1] CISPR 12:2001, Vehicles, motorboats and spark-ignited
engine driven devices. Radio disturbances characteristics. Lim-
its and methods of measurements, 2001.
[2] Directive 2004/104/EC of 14 October 2004 adapting to
technical progress Council Directive 72/245/EEC relating to the
radio interference (electromagnetic compatibility) of vehicles
and amending Directive 70/156/EEC on the approximation of
the laws of the Member States relating to the type-approval of
motor vehicles and their trailers, Official Journal of the Euro-
pean Union, No. L 337, 13th November 2004, pp. 13-58.
[3] CISPR 12:2001+A1:2005, Vehicles, motorboats and
spark-ignited engine driven devices. Radio disturbances charac-
teristics. Limits and methods of measurements, 2005.
[4] UNECE, Regulation No. 10 Uniform provisions
concerning the approval of vehicles with regard to
electromagnetic compatibility, Add. 9, Rev. 3, 14th
August 2008.
[5] Directive 2007/46/EC of the European Parlia-
ment and of the Council of 5 September 2007 estab-
lishing a framework for the approval of motor vehicles
and their trailers, and of systems, components and
separate technical units intended for such vehicles,
Official Journal of the European Union, No. L 263, 9th
October 2007, pp. 1-160.
[6] UNECE, Regulation No. 10 Uniform provi-
sions concerning the approval of vehicles with regard
to electromagnetic compatibility, Add. 9, Rev. 4, 6th
March 2012.
[7] CISPR 22, Limits and methods of measure-
ment of electromagnetic disturbance characteristics
of information technology equipment, 1999.
[8] SAE Recommended Practice J551-5:2004,
Performance levels and methods of measurement
of magnetic and electric field strength from electric
vehicles, broadband, 9 kHz to 30 MHz.
[9] ANSI C63.4, American National Standard for
Methods of Measurement of Radio-Noise Emission
from Low-Voltage Electrical and Electronic Equip-
ment in the Range of 9 kHz to 40 GHz, 2001.
[10] A.R. Ruddle, D.A. Topham and D.D. Ward,
Investigation of electromagnetic emissions mea-
surements practices for alternative powertrain road
vehicles, Proceedings of 2003 IEEE EMC Symposium,
Boston, USA, August 2003, pp. 543-547.
[11] F. Krug and P. Russer, Ultra-fast broadband
EMI measurement in time-domain using FFT and
periodogram, Proceedings of 5th European Sympo-
sium on EMC, Sorrento, Italy, September 2002, pp.
379384.
[12] C. Keller and K. Feser, Non-linear superposition of
broadband spectra for fast emission measurements in time-
domain, Proceedings of 15th Zurich EMC Symposium, Zurich,
Switzerland, February 2003, pp. 505510.
[13] C.L. Holloway, P.F. Wilson, G. Koepke and M. Candidi,
Total radiated power limits for emission measurements in a
reverberation chamber, Proceedings of IEEE 2003 EMC Sym-
posium, Boston, USA, August 2003, pp. 838843.
[14] IEC 61000-4-21, Electromagnetic compatibility (EMC) -
Part 4-21: Testing and measurement techniques - Reverberation
chamber test methods, Edition 2.0, January 2011,
[15] A.R. Ruddle, Investigation of road vehicle electromag-
netic emissions measurement methods, MIRA Report No.
04-0845046, 18th March 2004. Available at: http://stakeholders.
ofcom.org.uk/binaries/research/technology-research/mira_04-
0845046.pdf
ALASTAIR RUDDLE is with MIRA Ltd (Nuneaton, UK), where much
of his work is concerned with the use of numerical modeling methods to
investigate electromagnetic issues, primarily for automotive applica-
tions. Specific areas of interest include EMC, installed performance
of antennas, human exposure to electromagnetic fields, and associ-
ated test and measurement methods. He can be contacted at alastair.
ruddle@mira.co.uk.
FREE WEBINARS
Keep abreast of the latest EMC topics
Check the schedule at interferencetechnology.com
ANDREAS EBERHARD
Vice President
Power Standards Lab
I
MMUNITY FROM voltage sags is vital for reliable opera-
tion of our evermore-sophisticated electronic controls
and equipment. Every electrical product should be able
to ride through typical voltage sags, but in many cases
the rst sag test occurs after equipment is installed
and in operation. Select the appropriate sag immunity
specication and equipment compliance testing, and
youll be glad you did.
Modern equipment can be sensitive to brief disturbances
on utility power mains. Electrical systems are subject to a
wide variety of power quality problems that can interrupt
production processes, aect sensitive equipment, and cause
downtime, scrap, and capacity losses. e most common
disturbance, by far, is a sag: a brief reduction in voltage
lasting a few hundred milliseconds.
Sags are commonly caused by fuse or breaker opera-
tion, motor starting, or capacitor switching, but they are
also triggered by shortp-circuits on the power distribution
system caused by such events as snakes slithering across
insulators, trenching machines hitting underground cables,
and lightning ionizing the air around high-voltage lines.
Many utilities report that 80% of electrical disturbances
originate within the users facility.
A decade ago, the solution to voltage sags was to try to
x them by storing enough energy somehow and releasing
it onto the AC mains when voltage dropped. Some of the old
solutions included uninterruptible power supplies (UPS),
ywheels, and ferroresonant transformers.
More recently, engineers have realized that voltage sag
is really a compatibility problem with at least two classes of
solutions: You can improve the power or you can make the
equipment tougher. e latter approach is called voltage
sag immunity, and gets more important around the world.

STANDARDS DEVELOPED
ree main primary voltage sag immunity standards are
discussed in the following paragraphs: IEC 61000-4-11, IEC
61000-4-34, and SEMI F47. ere are others in usesuch
as IEEE 1100, CBEMA, ITIC, Samsung Power Vaccine,
international standards and MIL-STDbut the rst three
seem to have the widest acceptance in the marketplace.
46
New Voltage Sag Testing
Requirements for Industrial Equipment
United Kingdom
Eberhard_UK_EEG13.indd 6 11/16/12 3:48 PM
ANDREAS EBERHARD
Vice President
Power Standards Lab
I
MMUNITY FROM voltage sags is vital for reliable opera-
tion of our evermore-sophisticated electronic controls
and equipment. Every electrical product should be able
to ride through typical voltage sags, but in many cases
the rst sag test occurs after equipment is installed
and in operation. Select the appropriate sag immunity
specication and equipment compliance testing, and
youll be glad you did.
Modern equipment can be sensitive to brief disturbances
on utility power mains. Electrical systems are subject to a
wide variety of power quality problems that can interrupt
production processes, aect sensitive equipment, and cause
downtime, scrap, and capacity losses. e most common
disturbance, by far, is a sag: a brief reduction in voltage
lasting a few hundred milliseconds.
Sags are commonly caused by fuse or breaker opera-
tion, motor starting, or capacitor switching, but they are
also triggered by shortp-circuits on the power distribution
system caused by such events as snakes slithering across
insulators, trenching machines hitting underground cables,
and lightning ionizing the air around high-voltage lines.
Many utilities report that 80% of electrical disturbances
originate within the users facility.
A decade ago, the solution to voltage sags was to try to
x them by storing enough energy somehow and releasing
it onto the AC mains when voltage dropped. Some of the old
solutions included uninterruptible power supplies (UPS),
ywheels, and ferroresonant transformers.
More recently, engineers have realized that voltage sag
is really a compatibility problem with at least two classes of
solutions: You can improve the power or you can make the
equipment tougher. e latter approach is called voltage
sag immunity, and gets more important around the world.

STANDARDS DEVELOPED
ree main primary voltage sag immunity standards are
discussed in the following paragraphs: IEC 61000-4-11, IEC
61000-4-34, and SEMI F47. ere are others in usesuch
as IEEE 1100, CBEMA, ITIC, Samsung Power Vaccine,
international standards and MIL-STDbut the rst three
seem to have the widest acceptance in the marketplace.
46
New Voltage Sag Testing
Requirements for Industrial Equipment
United Kingdom
United Kingdom EbErhard
47
(IEC is the International Electrotech-
nical Commission, SEMI is the Semi-
conductor Equipment and Materials
Institute, CBEMA is the Computer
Business Equipment Manufacturers
Association, ITIC is the Information
Technology Institute Council, and
MIL-STD is the U.S. Defense Depart-
ments specifcation.)
IEC 61000-4-11 and IEC 61000-4-
34 are a closely related set of standards
that cover voltage sag immunity. IEC
61000-4-11 Ed. 2 covers equipment
rated at 16 amps per phase or less
while IEC 61000-4-34 Ed. 1 covers
equipment rated at more than 16 amps
per phase. Te latter was written after
IEC 61000-4-11, so it seems to be more
comprehensive.
SEMI F47 is the voltage sag immu-
nity standard used in the semiconduc-
tor manufacturing industry, where a
single voltage sag can result in the multi-million-dollar
loss of product if a facility is not properly protected. Te
semiconductor industry has developed specifications
for its manufacturing equipment and for components
and subsystems in that equipment. Enforcement is en-
tirely customer-driven in this industry, as semiconductor
manufacturers understand the economic consequences of
sag-induced failures and generally refuse to purchase new
equipment that fails the SEMI F47 immunity requirement.
SEMI F47 is currently going through its fve-year revision
and update cycle.
All three standards specify voltage sags with certain
depths and durations for the equipment under test (EUT).
For example, a specifcation may state 70% of nominal for
500 milliseconds. Te percentage is the amount of voltage
remaining, not the amount that is missing. Each standard
specifes pass-fail criteria for EUT when a voltage sag is ap-
plied; the IEC standards have a range of pass-fail criteria,
but the SEMI F47 standard is more explicit (photo 2).

What makes Voltage sag testing different
In contrast to most other emissions and immunity test-
ing, voltage sag testing requires the engineer to control
and manipulate all of the power fowing into the EUT. For
smaller devices such as personal computers, this is not a
great challenge. But for larger industrial equipment; perhaps
rated at 480 volts three-phase at 200 amps per phaseand
an expected inrush current of 600 amps or more, the test
engineer must be prepared for serious performance and
safety challenges.
A voltage-sag generator is a piece of test equipment
that is inserted between the AC mains and the EUT. It
generates voltage sags of any required depth and duration.
Some, like the PSL Industrial Power Corruptor, include
pre-programmed sags for all of the
IEC, SEMI or MIL standards.
Because a common EUT failure
mechanism is a blown fuse or circuit
breaker during the current inrush after
a voltage-sag, the sag generator must
be specifed for delivering large peak
currents typically in the hundreds of
amps. Tis peak current requirement
in the IEC standards means that elec-
tronic amplifer AC sources generally
can only be used for pre-compliance
testing, not certifcation
Certain software, such as the sag
immunity testing sof tware from
Power Standards Lab, comes with
extensive safety checklists: some
of the checklist items are obvious
(Who on the test team is trained in
CPR?; Where is the closest fre extin-
guisher?) and some are less obvious
(How do we get access to at least two
PHOTO 1: Immunize your products and facilities. Voltage sag immunity testing has been common
in the semiconductor industry for years and has proved its economic value. New IEC standards for
voltage sag immunity will expand this kind of testing and certifcation to other industries.
PHOTO 2: Playing through. A typical example of a voltage sag ride-through curve compared
with the SEMI F47 specifcation commonly used in the semiconductor industry.
United Kingdom
48
upstream circuit breakers?; Where is the closest trash can?).
Tis kind of testing requires a fully-functional EUT,
and someone who knows how to operate it. Te only way
to determine if an EUT is immune to the required voltage
sags is to have it fully operating during the voltage sags; in
many cases, the sags will need to be applied during difer-
ent stages of EUT operation. Remarkably often, the EUT
is not ready on time for voltage sag testing. Development
work may need to be completed, or no one is available to
operate the EUT, or the supplies to operate the EUT (raw
materials, cooling water, compressed air, etc.) are not avail-
able, or the EUT software is broken. Test engineers should
plan for these kinds of problems.
EUT failure mechanisms can be complicated, too, and
the test engineer will be expected to help diagnose them.
Te built-in digital oscilloscopes in most sag generators will
help, but the test engineer must fgure out where to connect
the channels to circuits inside the EUT.
Common failure meChanisms due
to voltage sags
Te most common failure mechanism is lack of energy.
Tis can manifest itself in something as simple as insuf-
fcient voltage to keep a critical relay or contactor energized
or something as complex as an electronic sensor with a fail-
ing power supply giving an incorrect reading, which would
cause EUT software to react inappropriately (Figure 6).
Te second most common failure mechanism, surpris-
ingly, occurs just after the sag has fnished. In such
cases, all of the bulk capacitors inside the EUT re-
charge at once, causing a large increase in AC mains
current. Tis increase can trip circuit breakers,
open fuses, and even destroy solid-state rectifers.
Most design engineers correctly protect against
this inrush current during power cycling, but many
do not consider the similar efects of voltage sags.
Be careful when the test procedure is developed; if
you use a sag generator that lacks sufcient current
capability it will incorrectly pass the equipment if
there is insufcient current available to blow a fuse
or trip a circuit breaker in a half-cycle.
Another common EUT failure mechanism
occurs when a sensor detects the voltage sag and
decides to shut down the EUT. In a straightforward
example, a three-phase EUT might have a phase-
rotation relay that incorrectly interprets an unbal-
anced voltage-sag as a phase reversal and therefore
shuts down the EUT. A more atypical example
would be if you had an airfow sensor mounted
near a fan, it detected that the fan had slowed
down momentarily, and the equipment software
misinterpreted the message from this sensor as
indicating that the EUT cooling system had failed.
In this case, a software fan failure signal delay is
the solution to improve sag immunity.
One more typical EUT failure mechanism
involves an uncommon sequence of events. For
example, in one case, a voltage-sag was applied
to the EUT and its main contactor opened with
a bang. But further investigation revealed that a
small relay, wired in series with the main contac-
tor coil, actually opened because it received an
open relay contact from a stray water sensor. Tat
PHOTO 3: The voltage sag test engineer will insert a sag generator
between the AC source and the EUT. Often, high currents (200 amps)
and high voltages (480 volts 3-phase) must be handled.
49
sensor, in turn, opened because its small 24-VDC supply
output dropped to 18 V during the sag. Te solution was
an inexpensive bulk capacitor across the 24-VDC supply.
Many other failure mechanisms can take place during
voltage sags. Te question to the test engineer will always
be: How do we fx this problem? Usually, there is a simple,
low-cost fx once the problem is identifed.
A new embedded Power QuAlity
meAsurement technology
Tere is a new way to increase the reliability of products
due to common power quality and voltage sag problems.
How about making the product more intelligent - so it can
react depending on severity of the voltage sag problem?
You will see more and more of such permanently in-
stalled Power Quality Monitors on a product level. Tis
new embedded technology comes with the huge advantage
that power quality problems and energy consumption can
be evaluated directly within the product or machine. Te
new Power Quality Monitor (Photo 4) has the same func-
tionality and features as the well-known expensive Power
Quality Instruments. Tese are typically used on a facility
level and are much too expensive, and, of course way too
big, to integrate and design into products. Traditional power
quality instruments have been designed with their own
unique packaging. By packaging this new little power qual-
ity instrument (the PQube) in a standard 35mm DIN-rail
circuit breaker package, installation is greatly simplifed.
Te new trend is towards anembedded and intelligent power
quality functionality. Te PQube detects any kind of power
problems on the AC lines and can communicate directly
with the product, machine or facility personnel.
Te version shown in Photo 4 has Ethernet connectivity
(and includes a web server, an FTP server, and an e-mail
generator), wireless radio connectivity, and a modem con-
nection. However, it is optimized to function without con-
nectivity it can easily store a years data on a removable
SD memory card.
By following the software model of a digital camera, the
PQube requires absolutely no software. When you connect
a digital camera to your computer, you immediately see the
pictures in a folder on your disk drive. Te same is true for
power quality data in this application.
With the ever-increasing use of sophisticated controls
and equipment in industrial, commercial, institutional,
and governmental facilities; the continuity, reliability, and
quality of electrical service has become extremely crucial to
many power users. Te power will hardly get better in the
future, so the ultimate goal for any product manufacturer is
to make its product immune to voltage sags. As all modern
cars should be able to drive through regular bumps on the
road, every electrical product should be able to ride-through
any regular voltage sag that will occur in a facility.

Andreas Eberhard is member of various power quality standard com-
mittees around the world. He has more than 10 years of experience in
product compliance based on international standards. He is vice president
of technical services at Power Standard Labs and can be contacted at
aeberhard@powerstandards.com or +1-510-522-4400.
PHOTO 4: Anatomy of voltage sag. To test a new product, a voltage-sag
is introduced in the power source (a). The waveform, which was about 40
amps peak before the sag in this example, then increases to 450 amps peak
after the voltage sag (b). The same current, this time expressed as an RMS
value, is shown. The next graph shows the same current, this time as an
RMS value. Before the sag, it was about 23 amps RMS (this equipment
was rated at 30 amps), but after the sag the current increased to 175 amps
RMS. This behavior is not unusual (c). The fnal graph shows the output of
a DC supply during this sag (d).
PHOTO 5: Picture of latest low-cost PQube - Power Quality and
Energy Monitor for permanent installation and integration.
United Kingdom
48
upstream circuit breakers?; Where is the closest trash can?).
Tis kind of testing requires a fully-functional EUT,
and someone who knows how to operate it. Te only way
to determine if an EUT is immune to the required voltage
sags is to have it fully operating during the voltage sags; in
many cases, the sags will need to be applied during difer-
ent stages of EUT operation. Remarkably often, the EUT
is not ready on time for voltage sag testing. Development
work may need to be completed, or no one is available to
operate the EUT, or the supplies to operate the EUT (raw
materials, cooling water, compressed air, etc.) are not avail-
able, or the EUT software is broken. Test engineers should
plan for these kinds of problems.
EUT failure mechanisms can be complicated, too, and
the test engineer will be expected to help diagnose them.
Te built-in digital oscilloscopes in most sag generators will
help, but the test engineer must fgure out where to connect
the channels to circuits inside the EUT.
Common failure meChanisms due
to voltage sags
Te most common failure mechanism is lack of energy.
Tis can manifest itself in something as simple as insuf-
fcient voltage to keep a critical relay or contactor energized
or something as complex as an electronic sensor with a fail-
ing power supply giving an incorrect reading, which would
cause EUT software to react inappropriately (Figure 6).
Te second most common failure mechanism, surpris-
ingly, occurs just after the sag has fnished. In such
cases, all of the bulk capacitors inside the EUT re-
charge at once, causing a large increase in AC mains
current. Tis increase can trip circuit breakers,
open fuses, and even destroy solid-state rectifers.
Most design engineers correctly protect against
this inrush current during power cycling, but many
do not consider the similar efects of voltage sags.
Be careful when the test procedure is developed; if
you use a sag generator that lacks sufcient current
capability it will incorrectly pass the equipment if
there is insufcient current available to blow a fuse
or trip a circuit breaker in a half-cycle.
Another common EUT failure mechanism
occurs when a sensor detects the voltage sag and
decides to shut down the EUT. In a straightforward
example, a three-phase EUT might have a phase-
rotation relay that incorrectly interprets an unbal-
anced voltage-sag as a phase reversal and therefore
shuts down the EUT. A more atypical example
would be if you had an airfow sensor mounted
near a fan, it detected that the fan had slowed
down momentarily, and the equipment software
misinterpreted the message from this sensor as
indicating that the EUT cooling system had failed.
In this case, a software fan failure signal delay is
the solution to improve sag immunity.
One more typical EUT failure mechanism
involves an uncommon sequence of events. For
example, in one case, a voltage-sag was applied
to the EUT and its main contactor opened with
a bang. But further investigation revealed that a
small relay, wired in series with the main contac-
tor coil, actually opened because it received an
open relay contact from a stray water sensor. Tat
PHOTO 3: The voltage sag test engineer will insert a sag generator
between the AC source and the EUT. Often, high currents (200 amps)
and high voltages (480 volts 3-phase) must be handled.
49
sensor, in turn, opened because its small 24-VDC supply
output dropped to 18 V during the sag. Te solution was
an inexpensive bulk capacitor across the 24-VDC supply.
Many other failure mechanisms can take place during
voltage sags. Te question to the test engineer will always
be: How do we fx this problem? Usually, there is a simple,
low-cost fx once the problem is identifed.
A new embedded Power QuAlity
meAsurement technology
Tere is a new way to increase the reliability of products
due to common power quality and voltage sag problems.
How about making the product more intelligent - so it can
react depending on severity of the voltage sag problem?
You will see more and more of such permanently in-
stalled Power Quality Monitors on a product level. Tis
new embedded technology comes with the huge advantage
that power quality problems and energy consumption can
be evaluated directly within the product or machine. Te
new Power Quality Monitor (Photo 4) has the same func-
tionality and features as the well-known expensive Power
Quality Instruments. Tese are typically used on a facility
level and are much too expensive, and, of course way too
big, to integrate and design into products. Traditional power
quality instruments have been designed with their own
unique packaging. By packaging this new little power qual-
ity instrument (the PQube) in a standard 35mm DIN-rail
circuit breaker package, installation is greatly simplifed.
Te new trend is towards anembedded and intelligent power
quality functionality. Te PQube detects any kind of power
problems on the AC lines and can communicate directly
with the product, machine or facility personnel.
Te version shown in Photo 4 has Ethernet connectivity
(and includes a web server, an FTP server, and an e-mail
generator), wireless radio connectivity, and a modem con-
nection. However, it is optimized to function without con-
nectivity it can easily store a years data on a removable
SD memory card.
By following the software model of a digital camera, the
PQube requires absolutely no software. When you connect
a digital camera to your computer, you immediately see the
pictures in a folder on your disk drive. Te same is true for
power quality data in this application.
With the ever-increasing use of sophisticated controls
and equipment in industrial, commercial, institutional,
and governmental facilities; the continuity, reliability, and
quality of electrical service has become extremely crucial to
many power users. Te power will hardly get better in the
future, so the ultimate goal for any product manufacturer is
to make its product immune to voltage sags. As all modern
cars should be able to drive through regular bumps on the
road, every electrical product should be able to ride-through
any regular voltage sag that will occur in a facility.

Andreas Eberhard is member of various power quality standard com-
mittees around the world. He has more than 10 years of experience in
product compliance based on international standards. He is vice president
of technical services at Power Standard Labs and can be contacted at
aeberhard@powerstandards.com or +1-510-522-4400.
PHOTO 4: Anatomy of voltage sag. To test a new product, a voltage-sag
is introduced in the power source (a). The waveform, which was about 40
amps peak before the sag in this example, then increases to 450 amps peak
after the voltage sag (b). The same current, this time expressed as an RMS
value, is shown. The next graph shows the same current, this time as an
RMS value. Before the sag, it was about 23 amps RMS (this equipment
was rated at 30 amps), but after the sag the current increased to 175 amps
RMS. This behavior is not unusual (c). The fnal graph shows the output of
a DC supply during this sag (d).
PHOTO 5: Picture of latest low-cost PQube - Power Quality and
Energy Monitor for permanent installation and integration.
BRYAN COLE
President
Technology Research Council
JIM TIESI
Marketing Manager
Emerson Network Power Surge Protection
E
LECTRICAL SYSTEMS and equipment that
power and control industrial, commercial,
telecommunication and medical processes are
subjected to numerous power quality events.
These includes power disruptions, brown-
outs, sags, swells, temporary overvoltages and
lightning. Lightning can disrupt processes by
damaging transformers, distribution equipment, conduc-
tors or power conversion equipment. Lightning can also
disrupt processes by activating protection and control
relays within the utility system, which can cause transient
conditions which could result in switching transmis-
sion and distribution relays to re-route electrical power.
To protect electrical systems and equipment from light-
ning induced transients, surge protective devices (SPDs) are
connected to the electrical system. An SPD is a device that
contains at least one non-linear component and is intended
to protect the electrical system and equipment by limiting
transient overvoltages and diverting surge currents [1].
SPDs come in numerous congurations from small DIN
Rail and anged mounted devices intended for installation
inside electrical equipment and machines (Figure 1), to
permanently connected devices intended to be connected
external to electrical equipment and machines (Figure 2).
SPDs need to protect the electrical system without
adversely aecting the overall system or cause harm to
adjacent personnel. Adverse interactions include system
resonances, interactions with ground fault systems, and
electrical system damage from inadequately applied (rated)
equipment [2]. Protection is derived from the performance
characteristics of the SPD. Performance attributes include
limiting transient voltages by diverting transient current
to amplitudes that are acceptable for continual operation
of the connected equipment. e connection of the SPD
to the electrical system should not subject personnel to
additional electrical hazards from its operation: such as
shock and arcing hazards.
50
United Kingdom
Cole_UK_EEG13.indd 6 11/16/12 3:46 PM
BRYAN COLE
President
Technology Research Council
JIM TIESI
Marketing Manager
Emerson Network Power Surge Protection
E
LECTRICAL SYSTEMS and equipment that
power and control industrial, commercial,
telecommunication and medical processes are
subjected to numerous power quality events.
These includes power disruptions, brown-
outs, sags, swells, temporary overvoltages and
lightning. Lightning can disrupt processes by
damaging transformers, distribution equipment, conduc-
tors or power conversion equipment. Lightning can also
disrupt processes by activating protection and control
relays within the utility system, which can cause transient
conditions which could result in switching transmis-
sion and distribution relays to re-route electrical power.
To protect electrical systems and equipment from light-
ning induced transients, surge protective devices (SPDs) are
connected to the electrical system. An SPD is a device that
contains at least one non-linear component and is intended
to protect the electrical system and equipment by limiting
transient overvoltages and diverting surge currents [1].
SPDs come in numerous congurations from small DIN
Rail and anged mounted devices intended for installation
inside electrical equipment and machines (Figure 1), to
permanently connected devices intended to be connected
external to electrical equipment and machines (Figure 2).
SPDs need to protect the electrical system without
adversely aecting the overall system or cause harm to
adjacent personnel. Adverse interactions include system
resonances, interactions with ground fault systems, and
electrical system damage from inadequately applied (rated)
equipment [2]. Protection is derived from the performance
characteristics of the SPD. Performance attributes include
limiting transient voltages by diverting transient current
to amplitudes that are acceptable for continual operation
of the connected equipment. e connection of the SPD
to the electrical system should not subject personnel to
additional electrical hazards from its operation: such as
shock and arcing hazards.
50
United Kingdom
Solid State TWT Tetrode Tube
DC - 40 GHz up to 10 kW
903 South Second Street Ronkonkama, NY 11779
Tel: 631-467-8400 Fax: 631-467-8558 Email: sales@ifi.com www.ifi.com a TESEQ Company
ADs_EEG13.indd 16 11/16/12 2:42 PM
United Kingdom
52
SPDS & SHORT
CIRCUIT CURRENTS.
IEC standards requi re SPDs to
withstand fault or short circuit cur-
rents from an internal SPD failure [1].
To ensure that an SPD is capable of
withstanding the short circuit currents
associated with a connection to the
electrical system, the SPD is required
to have a disconnecting device.
An SPD disconnector is a device that
disconnects an SPD from the electrical
system in the event of an SPD failure
[3]. SPD disconnectors are required
to provide system protection to two
SPD failure modes: thermal faults and
short-circuit current faults [3]. A short-
circuit current is the amount of current
that can fow in the system to the point
of failure. Te amplitude of the short-
circuit current depends on numerous
conditions, including the source imped-
ance, conductor impedance, whether
the fault is phase-to-phase or phase-
to-ground, and the amount of other
impedances in the electrical system.
SPDs that are connected to the
electrical system are required to have
a short-circuit current rating [1]. Te short-circuit current
rating of an SPD is the maximum prospective short-circuit
current available from the electrical system that the SPD
and disconnector is able to withstand without creating an
electrical hazard [3]. For an SPD to be properly connected
to the electrical system, the short-circuit current rating of
the SPD must be equal to or greater than the short-circuit
current at the point of installation [3, 4].
Calculating short-circuit currents in an electrical system
is complex. While it can be performed by hand or through
the use of spreadsheets, software simulation is commonly
used to account for the many variables. However, estimat-
ing the short-circuit current at the output of a transformer
can be easily estimated. To approximate the short-circuit
current (SCC) at the secondary of the transformer, one
needs to know the power rating of the transformer (P), the
full-load secondary current of the transformer (I), the line-
line voltage at the secondary of the transformer (V) and the
transformer impedance (Z) [5]. Te power rating is in kVA,
the current is in amperes (A), and the voltage is in volts (V).
Te full-load secondary current (I) of the transformer
can be calculated by EQ1.
I=P/(V3)
Te short-circuit current (SCC) can be calculated by EQ2
SCC=I/Z
As the power rating of the transformer increases, the
available short-circuit current increases. As the impedance
of the transformer increases, the available short-circuit
current decreases.
SPD SHORT-CIRCUIT CURRENT TESTING.
SPDs are required to be tested to short-circuit currents
to determine the short-circuit current rating (SCCR) [3]. A
disconnecting device is required to disconnect the SPD dur-
ing the short-circuit current test, except for the Neutral to
Protective Earth (N-PE) protection mode of an SPD in a TN
or TT grounding system [3]. Te SPD disconnecting device
can be either an internal or external fuse or circuit breaker.
Te SPD manufacturer specifes the amplitude of the
short-circuit current (Table I). If no short-circuit current
is defned by the SPD manufacturer, then the SPD is tested
at a short-circuit current of 300 A. Once the short-circuit
current amplitude is selected, the power source must be
able to deliver a specifc current with a minimum power
FIGURE 1: Integrated SPD.
FIGURE 2: External SPD.
United Kingdom
52
SPDS & SHORT
CIRCUIT CURRENTS.
IEC standards requi re SPDs to
withstand fault or short circuit cur-
rents from an internal SPD failure [1].
To ensure that an SPD is capable of
withstanding the short circuit currents
associated with a connection to the
electrical system, the SPD is required
to have a disconnecting device.
An SPD disconnector is a device that
disconnects an SPD from the electrical
system in the event of an SPD failure
[3]. SPD disconnectors are required
to provide system protection to two
SPD failure modes: thermal faults and
short-circuit current faults [3]. A short-
circuit current is the amount of current
that can fow in the system to the point
of failure. Te amplitude of the short-
circuit current depends on numerous
conditions, including the source imped-
ance, conductor impedance, whether
the fault is phase-to-phase or phase-
to-ground, and the amount of other
impedances in the electrical system.
SPDs that are connected to the
electrical system are required to have
a short-circuit current rating [1]. Te short-circuit current
rating of an SPD is the maximum prospective short-circuit
current available from the electrical system that the SPD
and disconnector is able to withstand without creating an
electrical hazard [3]. For an SPD to be properly connected
to the electrical system, the short-circuit current rating of
the SPD must be equal to or greater than the short-circuit
current at the point of installation [3, 4].
Calculating short-circuit currents in an electrical system
is complex. While it can be performed by hand or through
the use of spreadsheets, software simulation is commonly
used to account for the many variables. However, estimat-
ing the short-circuit current at the output of a transformer
can be easily estimated. To approximate the short-circuit
current (SCC) at the secondary of the transformer, one
needs to know the power rating of the transformer (P), the
full-load secondary current of the transformer (I), the line-
line voltage at the secondary of the transformer (V) and the
transformer impedance (Z) [5]. Te power rating is in kVA,
the current is in amperes (A), and the voltage is in volts (V).
Te full-load secondary current (I) of the transformer
can be calculated by EQ1.
I=P/(V3)
Te short-circuit current (SCC) can be calculated by EQ2
SCC=I/Z
As the power rating of the transformer increases, the
available short-circuit current increases. As the impedance
of the transformer increases, the available short-circuit
current decreases.
SPD SHORT-CIRCUIT CURRENT TESTING.
SPDs are required to be tested to short-circuit currents
to determine the short-circuit current rating (SCCR) [3]. A
disconnecting device is required to disconnect the SPD dur-
ing the short-circuit current test, except for the Neutral to
Protective Earth (N-PE) protection mode of an SPD in a TN
or TT grounding system [3]. Te SPD disconnecting device
can be either an internal or external fuse or circuit breaker.
Te SPD manufacturer specifes the amplitude of the
short-circuit current (Table I). If no short-circuit current
is defned by the SPD manufacturer, then the SPD is tested
at a short-circuit current of 300 A. Once the short-circuit
current amplitude is selected, the power source must be
able to deliver a specifc current with a minimum power
FIGURE 1: Integrated SPD.
FIGURE 2: External SPD.
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United Kingdom
54
factor (Table II).
Prior to short-circuit current testing, samples must be
prepared. For SPDs with voltage limiting components, e.g.
metal-oxide varistors (MOVs) or silicon avalanche diodes
(SADs), they are replaced with appropriately sized copper
blocks [3]. SPDs that are intended to be connected inside an
electrical enclosure or have a degree of protection of IP20 or
less are installed in a mesh type, metal enclosure [2]. SPDs
intended to be connected outside of electrical equipment
are tested in the supplied enclosure.
After the short-circuit current test is completed, the pass
criteria of the SPD are [3]:
No visible damage to the SPD enclosure; small indents
or cracks that do not degrade the degree of protection (IP
code) are excluded
Disconnection shall be provided by the disconnector
Disconnector indication shall show proper state
SPDs with a degree of protection greater than IP20 shall
not have accessible live components (unless accessible prior
to the test) when subjected to a test fnger probe
Te short-circuit current from the power source shall
be interrupted by the SPD disconnector within fve seconds
Tere shall be no explosion of other hazard
Tere shall be no fashover to the mesh type, metallic
enclosure
SPD & DISCONNECTOR INTERACTIONS.
Interrupting a short-circuit current produces an arc be-
tween the two electrodes or points in the electrical circuit.
Circuit breakers incorporate arc shoots to direct the arc
away from the contacts within the circuit breaker. Fuse
elements use an arc quenching medium, e.g. vacuum, sand,
etc., to ensure the arc between the two electrodes.
Some SPDs use internal disconnectors that are in close
proximity to the voltage limiting component(s), i.e. MOVs.
When MOVs are placed in close proximity to the internal
disconnector intended to disconnect short circuit currents,
the arc created can rupture the MOVs resulting in subse-
quent actions that will result in the SPD failing to meet the
pass criteria (Figure 3).
SPDs subjected to the short-circuit current tests using a
copper shorting block in place of the voltage limiting com-
ponent meet the requirements of the standard. However,
using a copper shorting block may not fully evaluate the
overall safety performance of the SPD to adequately dis-
connect during short-circuit currents. Other international
standards require that the SPD be tested as a complete
function device [6].
When considering the installation of an SPD, a risk as-
sessment is required to ensure that the SPD will provide
the proper protection and disconnect from the electrical
system without creating additional hazards [1]. Tis risk
assessment should include an evaluation of how the SPD was
tested to short-circuit currents and if the voltage limiting
components were connected in the circuit or if they were
replaced by copper blocks.
SPD APPLICATION EXAMPLE
Connecting the SPD to the electrical system requires
that the short-circuit current at the point of installation
and the short-circuit cur-
rent rating of the SPD are
needed. In all cases, the
short-circuit current rat-
ing of the SPD must be
larger than the calculated
short-circuit current at
the point of installation. If
the SPD is located in other
locations, a detailed short-
circuit current study is
required. If connecting
to the secondary side of a
transformer, simple equa-
tions (EQ1, EQ2) can be
used in conjunction with
the parameters of the
transformer to determine
the short-circuit current.
For example, if an SPD
is to be connected at a
facility service entrance
feed f rom a 2. 5 MVA
transformer with a voltage of 400Y/230 V, 4W+G, and an
impedance of 3 %, using EQ1 and EQ2 yields a short circuit
current of 120.3 kA. To properly apply the SPD, the SPD
would have a short-circuit current rating of 125 kA or more.
Applying an SPD with a short-circuit current rating of less
than 125 kA would compromise the safety of personnel.
CONCLUSION
Te application of SPDs on the electrical system is an
efective and important method to reduce damage to the
electrical system and equipment from transient voltages.
Properly applying SPDs requires the engineer to consider
many system and equipment parameters. One important
parameter is the short-circuit current rating of the SPD, the
type and location of the SPD disconnector, and the short-
circuit current at the point of application.
Te short-circuit current at the point of application
can be calculated using the process shown in this article
or through electrical power analysis software, e.g. SKM,
ETAP, or EasyPower. To determine the short-circuit current
for SPDs connected at the secondary side of a transformer,
simple calculations can be used.
Fuses or circuit-breakers, whether internal or external to
TABLE 1: SPD Short Circuit Current
Ratings.
TABLE 2: Short Circuit Current and Power Factor.
I
SCCR
(kA)
5,0
10,0
14,0
22,0
25,0
30,0
42,0v
50,0
65,0
85,0
100,0
125,0
150,0
200,0
I
p
(kA) Power Factor
I
p
1,5 0,95
1,5 < I
p
3,0 0,90
3,0 < I
p
4,5 0,80
4,5 < I
p
6,0 0,70
6,0 < I
p
10,0 0,50
10,0 < I
p
20,0 0,30
20,0 < I
p
50,0 0,25
50,0 < I
p
0,20
United Kingdom
54
factor (Table II).
Prior to short-circuit current testing, samples must be
prepared. For SPDs with voltage limiting components, e.g.
metal-oxide varistors (MOVs) or silicon avalanche diodes
(SADs), they are replaced with appropriately sized copper
blocks [3]. SPDs that are intended to be connected inside an
electrical enclosure or have a degree of protection of IP20 or
less are installed in a mesh type, metal enclosure [2]. SPDs
intended to be connected outside of electrical equipment
are tested in the supplied enclosure.
After the short-circuit current test is completed, the pass
criteria of the SPD are [3]:
No visible damage to the SPD enclosure; small indents
or cracks that do not degrade the degree of protection (IP
code) are excluded
Disconnection shall be provided by the disconnector
Disconnector indication shall show proper state
SPDs with a degree of protection greater than IP20 shall
not have accessible live components (unless accessible prior
to the test) when subjected to a test fnger probe
Te short-circuit current from the power source shall
be interrupted by the SPD disconnector within fve seconds
Tere shall be no explosion of other hazard
Tere shall be no fashover to the mesh type, metallic
enclosure
SPD & DISCONNECTOR INTERACTIONS.
Interrupting a short-circuit current produces an arc be-
tween the two electrodes or points in the electrical circuit.
Circuit breakers incorporate arc shoots to direct the arc
away from the contacts within the circuit breaker. Fuse
elements use an arc quenching medium, e.g. vacuum, sand,
etc., to ensure the arc between the two electrodes.
Some SPDs use internal disconnectors that are in close
proximity to the voltage limiting component(s), i.e. MOVs.
When MOVs are placed in close proximity to the internal
disconnector intended to disconnect short circuit currents,
the arc created can rupture the MOVs resulting in subse-
quent actions that will result in the SPD failing to meet the
pass criteria (Figure 3).
SPDs subjected to the short-circuit current tests using a
copper shorting block in place of the voltage limiting com-
ponent meet the requirements of the standard. However,
using a copper shorting block may not fully evaluate the
overall safety performance of the SPD to adequately dis-
connect during short-circuit currents. Other international
standards require that the SPD be tested as a complete
function device [6].
When considering the installation of an SPD, a risk as-
sessment is required to ensure that the SPD will provide
the proper protection and disconnect from the electrical
system without creating additional hazards [1]. Tis risk
assessment should include an evaluation of how the SPD was
tested to short-circuit currents and if the voltage limiting
components were connected in the circuit or if they were
replaced by copper blocks.
SPD APPLICATION EXAMPLE
Connecting the SPD to the electrical system requires
that the short-circuit current at the point of installation
and the short-circuit cur-
rent rating of the SPD are
needed. In all cases, the
short-circuit current rat-
ing of the SPD must be
larger than the calculated
short-circuit current at
the point of installation. If
the SPD is located in other
locations, a detailed short-
circuit current study is
required. If connecting
to the secondary side of a
transformer, simple equa-
tions (EQ1, EQ2) can be
used in conjunction with
the parameters of the
transformer to determine
the short-circuit current.
For example, if an SPD
is to be connected at a
facility service entrance
feed f rom a 2. 5 MVA
transformer with a voltage of 400Y/230 V, 4W+G, and an
impedance of 3 %, using EQ1 and EQ2 yields a short circuit
current of 120.3 kA. To properly apply the SPD, the SPD
would have a short-circuit current rating of 125 kA or more.
Applying an SPD with a short-circuit current rating of less
than 125 kA would compromise the safety of personnel.
CONCLUSION
Te application of SPDs on the electrical system is an
efective and important method to reduce damage to the
electrical system and equipment from transient voltages.
Properly applying SPDs requires the engineer to consider
many system and equipment parameters. One important
parameter is the short-circuit current rating of the SPD, the
type and location of the SPD disconnector, and the short-
circuit current at the point of application.
Te short-circuit current at the point of application
can be calculated using the process shown in this article
or through electrical power analysis software, e.g. SKM,
ETAP, or EasyPower. To determine the short-circuit current
for SPDs connected at the secondary side of a transformer,
simple calculations can be used.
Fuses or circuit-breakers, whether internal or external to
TABLE 1: SPD Short Circuit Current
Ratings.
TABLE 2: Short Circuit Current and Power Factor.
I
SCCR
(kA)
5,0
10,0
14,0
22,0
25,0
30,0
42,0v
50,0
65,0
85,0
100,0
125,0
150,0
200,0
I
p
(kA) Power Factor
I
p
1,5 0,95
1,5 < I
p
3,0 0,90
3,0 < I
p
4,5 0,80
4,5 < I
p
6,0 0,70
6,0 < I
p
10,0 0,50
10,0 < I
p
20,0 0,30
20,0 < I
p
50,0 0,25
50,0 < I
p
0,20
United Kingdom Cole, Ti esi
55
the SPD, are required to obtain a short-circuit current rat-
ing and shall not hinder the performance attributes of the
SPD. Te short-circuit current rating of the SPD is required
by standards to be located either on the SPD or in the ac-
companying installation instructions. Te type and location
of the SPD disconnector is also included in the installation
instructions.
When performing the risk assessment, the engineer
should obtain data from the manufacturer of the SPD
whether the short-circuit current test was conducted with the
MOVs being replaced with a copper block or if the MOV was
installed during the test. SPDs tested with the MOV replaced
with a copper block and an internal disconnector can lead
to a safety hazard that requires an additional enclosure or
protective measures to be considered in the fnal installation.
REFERENCES.
[1] International Electrotechnical Commission (IEC). Low-
voltage Surge Protective Devices Part 12: Surge protective devices
connected to low-voltage power distribution systems Selection
and application principles, IEC 61643-12. Geneva, Switzerland.
[2] Institute of Electrical and Electronic Engineers (IEEE). IEEE
Guide for the Application of Surge-Protective Devices for Low-Volt-
age (1000 V or Less) AC Power Circuits, IEEE C62.72TM 2007.
NY, NY USA.
[3] International Electrotechnical Commission (IEC). Low-
voltage Surge Protective Device Part 11: Surge protec-
tive devices connected to low-voltage power systems
Requirements and test methods, IEC 61643-11. Geneva,
Switzerland.
[4] Cole, B.R., Brown, K, McCurdy, P.S., Phipps, T.E.,
and Hotchkiss, R. Te Short Circuit Current Ratings of
Surge Protective Devices. 2006 IEEE Power Engineering
Society Summer Conference. Available [on-line] at IEEE
Explore.
[5] McKeown, D., Simple Methods for Calculat-
ing Short Circuit Current without a Computer, Re-
trieved 2012 August 10, Available [on-line] at http://
www.geindustrial.com/publibrary/checkout/Short%20
Circuit?TNR=White%20Papers|Short%20Circuit|generic.
[6] Underwriters Laboratories (UL). Standard for
Safety, Surge Protective Devices, UL 1449, 3rd Edition.
Northbrook, IL USA.

BRYAN COLE is the president of Technology Research Coun-
cil. Cole has more than 25 years experience in the design,
development, application, and product safety of power quality
equipment, aviation instrumentation, and various low-voltage
distribution equipment. He is an IEEE member, a number of
UL Standard Technical Panels, a member to the US National
Committee to the IEC, and has assisted in the development of
numerous national and international standards related to Elec-
trical Power Systems. Cole is a former US Marine, is a NARTE
Certifed Engineer, holds a Bachelors degree in electrical engi-
neering, and an MBA with a focus in technology management.

JIM TIESI is the Marketing Manager for Emerson Network
Power Surge Protection. Tiesi has 20 years of experience in the
design, development, application, and marketing of power quality equip-
ment. He is active in various working groups for both the IEEE and NEMA,
and is a member of the Product Development and management Associa-
tion. Tiesi holds a Bachelor of Science degree in electrical engineering and
a masters degree in business administration.
FIGURE 3: Improperly Applied MOV & Disconnector.
ADs_EEG13.indd 18 11/16/12 2:43 PM
57
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Contents | Deutschland
Heinrich Rudol f Her t z war ein deutscher
Physiker, der die elektromagnetische Theorie
des Lichts von James Clerk Maxwell berprfen
wollte. Hertz war der erste Physiker, der die
Exi st enz von el ekt r omagnet i schen Well en
t echni scher I nst r ument e i n Exper i ment en
nachgewiesen hat. Die wissenschaftliche Einheit
der Frequenz wurde nach ihm benannt: Hertz.
18 8 6 e n t wi c k el t e He r t z di e He r t z -
Empfngerantenne, eine Anschlussgruppe die fr
den Betrieb nicht elektrisch geerdet wird. Auerdem entwickelte er einen bertragungstyp
der Dipolantenne, ein zentral zugefhrtes Element zum bermitteln von UHF-Funkwellen.
1887 experimentierte Hertz in seinem Labor mit Funkwellen. Er verwendete eine von einem
Ruhmkorfnduktor gesteuerte Funkenstrecke und ein Leiterpaar als Radiator. An den Enden
waren Kapazittsbereiche fr die Schaltresonanz vorhanden. Hertz verffentlichte seine
Arbeit in einem Buch mit dem Titel Electric waves: being researches on the propagation of
electric action with nite velocity through space.(Elektrische Wellen: derzeitige Forschungen
ber die Ausbreitung von Elektrischer Wirkung mit begrenzter Geschwindigkeit im Raum).
Hertz bewies in Experimenten, dass transversale elektromagnetische Freiraumwellen eine
bestimmte Distanz zurcklegen knnen.
Heinrich Rudolf
Hertz (18571894)
PRODUKTE UND SERVICES
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Anforderungen der CISPR 16-1-1 an
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Punktgenaue Puls-Strfestigkeits-Analyse
LARS GLSER, Hardware-Entwickler von EMV - Ma, Langer

58
64
66
GER_TOC_EEG13.indd 57 11/16/12 3:53 PM
ADs_EEG13.indd 18 11/16/12 2:43 PM
57
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S
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L
A
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57
Contents | Deutschland
Heinrich Rudol f Her t z war ein deutscher
Physiker, der die elektromagnetische Theorie
des Lichts von James Clerk Maxwell berprfen
wollte. Hertz war der erste Physiker, der die
Exi st enz von el ekt r omagnet i schen Well en
t echni scher I nst r ument e i n Exper i ment en
nachgewiesen hat. Die wissenschaftliche Einheit
der Frequenz wurde nach ihm benannt: Hertz.
18 8 6 e n t wi c k el t e He r t z di e He r t z -
Empfngerantenne, eine Anschlussgruppe die fr
den Betrieb nicht elektrisch geerdet wird. Auerdem entwickelte er einen bertragungstyp
der Dipolantenne, ein zentral zugefhrtes Element zum bermitteln von UHF-Funkwellen.
1887 experimentierte Hertz in seinem Labor mit Funkwellen. Er verwendete eine von einem
Ruhmkorfnduktor gesteuerte Funkenstrecke und ein Leiterpaar als Radiator. An den Enden
waren Kapazittsbereiche fr die Schaltresonanz vorhanden. Hertz verffentlichte seine
Arbeit in einem Buch mit dem Titel Electric waves: being researches on the propagation of
electric action with nite velocity through space.(Elektrische Wellen: derzeitige Forschungen
ber die Ausbreitung von Elektrischer Wirkung mit begrenzter Geschwindigkeit im Raum).
Hertz bewies in Experimenten, dass transversale elektromagnetische Freiraumwellen eine
bestimmte Distanz zurcklegen knnen.
Heinrich Rudolf
Hertz (18571894)
RESSOURCEN
ARTIKEL
STEPHAN BRAUN, ARND FRECH, Founders, GAUSS INSTRUMENTS GmbH
Punktgenaue Puls-Strfestigkeits-Analyse
LARS GLSER, Hardware-Entwickler von EMV - Ma, Langer

58
64
66
GER_TOC_EEG13.indd 57 11/16/12 3:53 PM
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Im kurzen Busch 15, DE - 58640 Iserlohn Deutschland;
+49(0)2371 78530; Fax: +49(0)2371 157722;
info@hundh-highvoltage.de;
www.hundh-highvoltage.de
ste, Testausstattung
EMC Testhaus Schreiber GmbH
Eiserfelderstrasse 316, D-57080 Siegen, Deutschland;
+49(0)2713 8270; Fax: +49(0)2713 82758;
info@emc-testhaus.de;
www.emc-testhaus.de
EMCC DR. RAEK
Moggast, Boelwiese 4-8, 91320
Ebermannstadt, Deutschland;
+49(0)9194 9016; Fax: +49(0)9194 8125;
emc.cons@emcc.de;
www.emcc.de
Produkte und Services: Testing
EMCO Elektronik GmbH
Bunsenstrae 5, 82152 Planegg, Deutschland;
+49(0)8989 55650; +49(0)8989 590376;
Diego Waser; info@emco-elektronik.de;
www.emco-elektronik.de
und Stecker, Testausstattung
EMC Test NRW GmbH
Emil-Figge-Str. 76, Dortmund, D-44227, Deutschland;
+49(0)2319 742750; Fax: +49(0)2319 742755;
Monika Przybilla, przybilla@emc-test.de;
www.emc-test.de
emitec ag
Birkenstrasse 47, Rotkreuz, INTL 6343, Schweiz;
+49(0)4141 7486010;
info@emitec.ch;
www.emitec.ch
EMI-tec GmbH
Motzener Str 17, Berlin, 12277, Deutschland;
+49(0)3072 39490; Fax: +49(0)3072 394919;
Robert Kahl, info@emi-tec.de;
www.emi-tec.de
emscreen GmbH
Wallbergstrae 7, D-82024 Taufkirchen, Deutschland;
+49(0)8961 41710; Fax: +49(0)8961 417171;
info@emscreen.de;
www.emscreen.com
Gehuse, Abschirmung
emv - Elektronische
Megerte Vertriebs GmbH
Wallbergstrae 7, 82024 Taufkirchen Deutschland;
+49(0)8961 41710; Fax: +49(0)8961 417171;
Ariane Wahrmann; info@emvgmbh.de;
www.emvgmbh.com
Produkte und Services: Testausstattung, Verstrker,
Antennen
EMV Testhaus GmbH
Gustav-Hertz-Strae 35, Straubing,
+49(0)9421 568680; Fax: +49(0)9421 56868100;
Charlotte Klein, charlotte.klein@emv-testhaus.com;
www.emv-testhaus.com
ETS-Lindgren
emv GmbH an ETS-Lindgren company - Wallbergstrae
7 82024 Taufkirchen
+49 (0) 89 614171-0; Fax. +49 (0) 89 614171-0;
emv@ets-lindgren.com;
www.emvgmbh.de
Produkte und Services: Verstrker, Antennen,
Ferrite, Filter, geschirmte Rume und Gehuse, RFI /
EMI-Signalgeneratoren, Test Instrumentation, Diverses
euro EMC GmbH
Schlossstr. 4, Oberkoellnbach, 84103 Postau,
Deutschland;
+49(0)8774 968550; Fax: +49(0)8774 968559;
info@euro-emc.com;
www.emc-positioning.de
Produkte und Services: Antennen, Verstrker
F
Industrial Electronics, Hauptstr. 71 - 79 D-65760
Eschborn Deutschland;
+49(0)6196 927900; Fax: +49(0)6196 927929;
w.uhlig@industrialelectronics.de
Schaffner Elektronik GmbH, Schoemperienstrasse 12B
D-76185 Karlsruhe Deutschland;
+49(0)7215 6910; Fax: +49(0) 7215 69110;
germanysales@schaffner.com; www.fair-rite.com
Produkte und Services: Ferrit, Filter, Abgeschirmte
Rume und Gehuse, Abschirmung
Federal-Mogul Corporation
Brgermeister-Schmidt-Strae 17, 51399 Burscheid,
+49 2174 69 1360; Fax: +49 2174 696 1360;
systems.protection@federalmogul.com;
www.federalmogul.com/sp
Produkts und Services: Shielded Cable Assemblies
& Gurte, Shielded Conduits, Shielded Tubing
Feuerherdt GmbH
Motzener Str. 26b, 12277 Berlin, Deutscland;
+49(0)30 710 96 45 52; Fax: +49(0)30 710 96 45 99;
Judith Feuerherdt, emc@feuerherdt.de;
www.shielding-online.com
Produkts und Services: Conductive Materials,
Shielding
Frankonia GmbH
Industriestr. 16, Heideck, 91180, Deutschland;
+49(0)9177 98500; Fax: +49(0)9177 98520;
Andrea Bodhee, info@frankonia-emc.com;
www.frankoniagroup.com
Produkts und Services: Shielded Rooms & Enclo-
sures, Shielding, Test Instrumentation
FS Antennentechnik GmbH
Morsestr. 6, D-85716 Unterschleissheim, Deutschland;
+49(0)8937 44860; Fax: +49(0)8937 448655;
info@fsant.de;
www.fsant.de
Produkte und Services: Antennen
FUSS-EMV
Johann-Hittorf-Strae 6, D-12489 Berlin, Deutschland;
+49(0)3040 44004, Fax: +49(0)3040 43150;
info@fuss-emv.de;
www.fuss-emv.de
G
GAUSS Instruments
Vertriebs GMBH
Agnes-Pockels-Bogen 1, Munich, 80992, Deutschland;
+49(0)89 9962 7826; Fax: +49(0) 1803 5518 44585;
Caroline Lommer, info@tdemi.com;
www.gauss-instruments.com
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info@cecert.de; www.cecert.com
CETECOM GmbH
Im Teelbruch 116, 45219 Essen, Deutschland;
+49(0)2054 9519 0; Fax: +49(0)2054 9519 997;
info@cetecom.com; www.cetecom.com
International
Ismaning, Bayern, Deutschland;
+49(0)8945 87370; Fax: +49(0)8945 873745;
Wolfgang Tschunke; wolfgang.tschunke@cpii.de;
Roman Jaresch; roman.jaresch@cpii.de;
www.cpii.com
Conec Corp
Ostenfeldmark 16, 59557 Lippstadt, Deutschland;
+49(0)2941 7650; Fax: +49(0)2941 76565;
Ferdinand Schrader; ferdinand.schrader@conec.de;
www.conec.de
CST - Computer Simulation Technology
Bad Nauheimer Str. 19, Darmstadt, 64289, Deutschland;
+49(0)6151 7303 0; Fax: +49(0)6151 7303 100;
info@cst.com; Ruth Jackson; ruth.jackson@cst.com;
www.cst.com
Produkte und Services: Testen, Antennen, Abschir-
mung, Kabel und Stecker
E
Eberspacher Electronics
Robert Bosch Strasse 6, Goeppingen,
73037 Deutschland;
+49(0)7161 9559206; Fax: +49(0)7161 9559455;
Christian Huschle christian.huschle@eberspaecher.com;
www.eberspacher.com
EM Software & Systems GmbH
Otto-Lilienthal-Strasse 36, D-71034 Bblingen,
Deutschland;
+49(0)7031 7145200; Fax: +49(0)7031 7145249;
Dr. U. Jakobus; info@emss.de;
www.emss.de
Produkte und Services: Testausstattung, Testen
EM Test GmbH
+49(0)2307 260700; Fax: +49(0)2307 17050;
info@emtest.de;
www.emtest.de
ste, Testen
EMC Partner
H+H High Voltage Technology GmbH, Herr Volker Henker,
Im kurzen Busch 15, DE - 58640 Iserlohn Deutschland;
+49(0)2371 78530; Fax: +49(0)2371 157722;
EMC Testhaus Schreiber GmbH
Eiserfelderstrasse 316, D-57080 Siegen, Deutschland;
+49(0)2713 8270; Fax: +49(0)2713 82758;
info@emc-testhaus.de;
www.emc-testhaus.de
EMCC DR. RAEK
Moggast, Boelwiese 4-8, 91320
Ebermannstadt, Deutschland;
+49(0)9194 9016; Fax: +49(0)9194 8125;
emc.cons@emcc.de;
www.emcc.de
EMCO Elektronik GmbH
Bunsenstrae 5, 82152 Planegg, Deutschland;
+49(0)8989 55650; +49(0)8989 590376;
Diego Waser; info@emco-elektronik.de;
www.emco-elektronik.de
und Stecker, Testausstattung
EMC Test NRW GmbH
Emil-Figge-Str. 76, Dortmund, D-44227, Deutschland;
+49(0)2319 742750; Fax: +49(0)2319 742755;
Monika Przybilla, przybilla@emc-test.de;
www.emc-test.de
emitec ag
Birkenstrasse 47, Rotkreuz, INTL 6343, Schweiz;
+49(0)4141 7486010;
info@emitec.ch;
www.emitec.ch
EMI-tec GmbH
Motzener Str 17, Berlin, 12277, Deutschland;
+49(0)3072 39490; Fax: +49(0)3072 394919;
Robert Kahl, info@emi-tec.de;
www.emi-tec.de
emscreen GmbH
Wallbergstrae 7, D-82024 Taufkirchen, Deutschland;
+49(0)8961 41710; Fax: +49(0)8961 417171;
info@emscreen.de;
www.emscreen.com
Gehuse, Abschirmung
emv - Elektronische
Megerte Vertriebs GmbH
Wallbergstrae 7, 82024 Taufkirchen Deutschland;
+49(0)8961 41710; Fax: +49(0)8961 417171;
Ariane Wahrmann; info@emvgmbh.de;
www.emvgmbh.com
Antennen
EMV Testhaus GmbH
Gustav-Hertz-Strae 35, Straubing,
+49(0)9421 568680; Fax: +49(0)9421 56868100;
Charlotte Klein, charlotte.klein@emv-testhaus.com;
www.emv-testhaus.com
ETS-Lindgren
emv GmbH an ETS-Lindgren company - Wallbergstrae
7 82024 Taufkirchen
+49 (0) 89 614171-0; Fax. +49 (0) 89 614171-0;
emv@ets-lindgren.com;
www.emvgmbh.de
Produkte und Services: Verstrker, Antennen,
Ferrite, Filter, geschirmte Rume und Gehuse, RFI /
EMI-Signalgeneratoren, Test Instrumentation, Diverses
euro EMC GmbH
Schlossstr. 4, Oberkoellnbach, 84103 Postau,
Deutschland;
+49(0)8774 968550; Fax: +49(0)8774 968559;
info@euro-emc.com;
www.emc-positioning.de
Produkte und Services: Antennen, Verstrker
F
Industrial Electronics, Hauptstr. 71 - 79 D-65760
Eschborn Deutschland;
+49(0)6196 927900; Fax: +49(0)6196 927929;
w.uhlig@industrialelectronics.de
Schaffner Elektronik GmbH, Schoemperienstrasse 12B
D-76185 Karlsruhe Deutschland;
+49(0)7215 6910; Fax: +49(0) 7215 69110;
germanysales@schaffner.com; www.fair-rite.com
Brgermeister-Schmidt-Strae 17, 51399 Burscheid,
+49 2174 69 1360; Fax: +49 2174 696 1360;
Produkts und Services: Shielded Cable Assemblies
& Gurte, Shielded Conduits, Shielded Tubing
Feuerherdt GmbH
Motzener Str. 26b, 12277 Berlin, Deutscland;
+49(0)30 710 96 45 52; Fax: +49(0)30 710 96 45 99;
Judith Feuerherdt, emc@feuerherdt.de;
www.shielding-online.com
Produkts und Services: Conductive Materials,
Shielding
Frankonia GmbH
Industriestr. 16, Heideck, 91180, Deutschland;
+49(0)9177 98500; Fax: +49(0)9177 98520;
Andrea Bodhee, info@frankonia-emc.com;
www.frankoniagroup.com
Produkts und Services: Shielded Rooms & Enclo-
sures, Shielding, Test Instrumentation
FS Antennentechnik GmbH
Morsestr. 6, D-85716 Unterschleissheim, Deutschland;
+49(0)8937 44860; Fax: +49(0)8937 448655;
info@fsant.de;
www.fsant.de
Produkte und Services: Antennen
FUSS-EMV
Johann-Hittorf-Strae 6, D-12489 Berlin, Deutschland;
+49(0)3040 44004, Fax: +49(0)3040 43150;
info@fuss-emv.de;
www.fuss-emv.de
G
GAUSS Instruments
Vertriebs GMBH
Agnes-Pockels-Bogen 1, Munich, 80992, Deutschland;
+49(0)89 9962 7826; Fax: +49(0) 1803 5518 44585;
Caroline Lommer, info@tdemi.com;
www.gauss-instruments.com
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62
Produkts und Services: Cables & Connectors, Test
Instrumentation, Testing, Miscellaneous
germania elektronik GmbH
Gutenbergring 41, 22848 Norderstedt, Deutschland;
+49(0)4059 35580; Fax: +49(0)4059 355820;
info@germania-elektronik.de;
www.germania-elektronik.de
Produkte und Services: Abschirmung, Leitungsma-
terialien, Ferrit, Filter
GIGACOMP GmbH
Richard-Wagner-Str. 31, D-82049 Pullach, Deutschland;
+49(0)8932 208957; Fax: +49(0)8932 208958;
info@gigacomp.de; www.gigacomp.de
Gowanda Electronics
ACAL BFI Germany GmbH; Assar-Gabrielsson-Strasse 1,
Dietzenbach, Deutschland, D-63128;
+49 6074 4098 0; Fax: +49 6074 4098 110;
ipe.de@bfoptilas.com;
www.bfoptilas.com.
Produkte und Services: Induktivitten
Rossmann Electronic GmbH
Georg-Grobl-Strasse 11, Diessen, Deutschland, 86911;
+49 8807 94994 0; Fax: 49 8807 94994 29;
info@rossmannweb.de; www.rossmannweb.de.
SK Trade GmbH
Behringersdorfer Str 2, Heroldsberg, Deutschland,
D-90562;
+49 911 5187080; Fax: +49 911 5187081;
sktrade@t-online.de; www.sktrade.de.
H
H+H High Voltage Technology GmbH
Im kurzen Busch 15, D-58640 Iserlohn, Deutschland;
+49(0)2371 7853 0; Fax: +49(0)2371 7853 28;
Klaus Hornickel, Managing Director;
HF-SHIELDING Joachim Broede GmbH
Industriestrae 6, D-49170 Hagen a.T.W., Deutschland;
+49(0)5405 999904; Fax: +49(0)5405 999906;
Joachim Broede, broede@hf-shielding.de;
www.hf-shielding.de
HILO-TEST GmbH
E. Pohlner, Hennebergstr. 6,
D - 76131 Karlsruhe, Deutschland;
+49-721-931 090; Fax: +49-721-931 0939;
info@hilo-test.de; www.hilo-test.de
Hirschmann Car Communication GmbH
Stuttgarter Strae 45-51, 72654 Neckartenzlingen,
Deutschland;
+49 (0) 7127 14-0; Fax: +49 (0) 7127 14-1060;
info@hirschmann-car.com;
www.hirschmann-car.com
I
i. thomas gmbh
An der B73 - 200a, D-21684 Stade, Deutschland;
+49(0)4141 82920; Fax: +49(0)4141 84461;
www.schirmkabinen.de
Produkte und Services: Filter, Abschirmung,
Software
IBH Elektrotechnik GmbH
Gutenbergring 35, D-22848 Norderstedt, INTL,
Deutschland;
+49(0)40 52 30 52 0; Fax: +49(0)40 523 97 09;
Michaela Kluckert, mkluckert@ibh-elektrotechnik.de;
www.ibh-elektrotechnik.de
a TESEQ Company
Teseq GmbH, Landsberger Strasse 255, 12623 Berlin;
+49 (0) 3056 598835; Fax: +49 (0) 3056 598834;
desales@teseq.com;
www.teseq.dewww.pischzan-technologies.de
Produkte und Services: Entwicklung und Herstellung
von Leistungsverstrkern im Mikrowellen und HF-Bereich
(Tetrode Tubes, Solid State and TWT)
IMST GmbH
Carl-Friedrich-Gau-Str. 2-4-4, 47475, Kamp-Lintfort,
Deutschland;
+49(0)2842 981 0; Fax: +49 2842 981 199;
borkes@imst.com; marketing@imst.com;
www.imst.com
Produkte und Services: Software
innco-systems GmbH
Erlenweg 12, 92521 Schwarzenfeld, Deutschland;
+49 9435 301659-0; Fax: +49 9435 301659-99;
info@inncosystems.com;
hoelzl@inncosystems.com;
www.inncosystems.com
Produkte und Services: EMV Positionierer
Drehtische & Antennen Masten
Industrial Electronics
Rudolf-Diesel-Str. 2a D-65719 Hofheim-Wallau;
+49 (0) 6122 / 7 26 60-0; Fax: +49 (0) 6122 / 7 26 60-29;
a.keenan@ie4u.de; w.uhlig@ie4u.de;
www.ie4u.de
Instec Filters
ACAL BFI GmbH; Assar Gabrielsson Strae 1,
+49 (0) 6074 4098 113; Fax: +49 (0) 6074 81 20 20;
Kerstin Reinhardt, kerstin.reinhardt@bfoptilas.com;
www.bfoptilas.com.
Produkte und Services: Filters
J
Jacob GmbH
Elektrotechnische Fabrik, Gottlieb-Daimler-Str. 11,
D-71394 Kernen, Deutschland;
+49 (0)7151 40110; Fax: +49 (0)7151 4011 49;
jacob@jacob-gmbh.de;
www.jacob-gmbh.de
JiangSu WEMC Technology Co., Ltd.
No. 8, Jian Ye Road, TianMu Lake Industrial Park, LiYang
Jiangsu, 213300, China;
+86 519 8746 7888; Fax: +86 519 8746 5666;
Xiao Wei; weiyl@wemctech.com;
www.wemctech.com
K
KE Kitagawa GmbH
Elbinger Strae 3-5, D-63110 Rodgau-Jgesheim,
Deutschland;
+49(0)6106 8524 0; Fax: +49(0)6106 85 2430;
sales@kitagawa.de;
www.kitagawa.de
Produkte und Services: Ferrit
L
Noethnitzer Hang 31, Bannewitz, 01728, Deutschland;
+49(0)3514 3009323;
michak@langer-emv.de; www.langer-emv.de
Peter Harms Consulting, Schenefelder Landstrae 127,
DE-22589 Hamburg;
+49 40 870-2469; Fax: +49 40 870-3821;
peter.harms@on-line.de; www.langer-emv.de
Produkte und Services: Testausstattung, Pre-
compliance EMC engineering services, Measurement
software, EMC pre-test equipments, Test and measure-
ment, Training
Luethi Elektronik-Feinmechanik AG
Parkstrasse 6, 4402 Frenkendorf / BL, Deutschland;
+49(0)6190 21210; Fax: +49(0)6190 21211;
www.luethi-ag.ch
M
Maschek Elektronik
Adolf-Scholz-Allee 4a, 86825, Bad Wrishofen,
Deutschland;
+49(0)8247 959807; Fax: +49(0)8247 959809;
info@maschek.de; www.maschek.de
maturo GmbH
Bahnhofstr. 26, 92536, Pfreimd, Deutschland;
+49(0)9606 9239130; Fax: 49(0)9606 92391329;
Markus Saller; m.saller@maturo-gmbh.de;
www.maturo-gmbh.de
Produkte und Services | Deutschland
63
MB-technology GmbH
Kolumbusstr. 19+21, 71063 Sindelfngen, Deutschland;
+49(0)7031 6863000; Fax: +49(0)7031 6864500;
media@mbtech-group.com; www.mbtech-group.com
Mesago Messe Frankfurt GmbH
Rotebuehlstrae 83-85, Stuttgart, 70178, Deutschland;
+49(0)7116 19462 0; Fax: +49(0) 7116 1946 91;
www.mesago-online.de
Produkte und Services: Events
Mician GmbH
Schlachte 21, 28195 Bremen, Deutschland;
+49(0)4211 6899351; Fax: +49(0)4211 68993 52;
sales@mician.com; www.mician.com
a TESEQ Company
MILMEGA
+49 (0) 3056 598835; Fax: +49 (0) 3056 598834;
desales@teseq.com; www.teseq.de
MOOSER Consulting GmbH
Amtmannstrae 5a, 82544
Egling/Thanning, Deutschland;
+49(0)8176 92250; Fax: +49(0)8176 92252;
Mario Kantner; m.kantner@mooser-emctechnik.de;
http://mooser-consulting.de
MTS Systemtechnik GmbH
Gewerbepark Ost 8, D-86690 Mertingen, Deutschland;
+49(0)9078 912940, Fax: +49(0)9078 912947 0;
info@mts-systemtechnik.de;
www.mts-systemtechnik.de
Produkte und Services: Antennen, Testausstattung
N
Narda Safety Test Solutions GmbH
Sandwiesenstrasse 7, 72793, Pfullingen, Deutschland;
+49(0)7121 9732 0 Fax: +49(0)7121 9732790,
support@narda-sts.de; www.narda-sts.de
Sonstiges
Neosid Pemetzrieder GmbH & Co. KG
P.O. Box 1354, D-58543 Halver, Deutschland;
+49(0)2353 710; Fax: +49(0)2353 7154;
sales@neosid.de; www.neosid.de
Produkte und Services: Ferrit, Filter
Neuhaus Elektronik GmbH
Drontheimer Str. 21, D-13359 Berlin, Deutschland;
+49(0)3049 76950; Fax: +49(0)3049 769530;
neuhaus-elektronik@t-online.de;
www.neuhaus-elektronik.de
Produkte und Services: Leitungsmaterialien
Nexio
Emco Elektronik, Bunsenstr.5, D-82152 Planegg,
Deutschland;
+49(0)8989 55650; Fax: +49(0)8989 590376;
info@emco-elektronik.de; www.emco-elektronik.de
Produkte und Services: Testausstattung, Filter,
berspannung und Einschaltste
P
PFLITSCH GmbH & Co. KG
Ernst-Pfitsch-Strae 1 industriegebie, Nord 1, D-42499
Hckeswagen, Deutschland;
+49(0)2192 9110; Fax: +49(0)2192 911220;
info@pfitsch.de; www.pfitsch.de
Phoenix Testlab GmbH
Konigswinkel 10, D-32825 Blomberg, Deutschland;
+49(0)5235 95000; Fax: 49(0)5235 950010;
offce@phoenix-testlab.de;
www.phoenix-testlab.de
Pontis - Audiv GmbH
Audivo GmbH,Irrenloher Damm 17, 92521 Schwarzenfeld,
Deutschland;
+49(0)9435 54190; Fax: +49(0)9435 541919;
info@audivo.com; www.audivo.com
Produkte und Services: Abschirmung
R
Rohde & Schwarz GmbH
Muhldorfstrasse 15, Munich, 81671, Deutschland;
+49(0)89 418695 0; Fax: +49(0)89 404764;
sigrun.Berghammer@rohde-schwarz.com;
www2.rohde-schwarz.com
Produkte und Services: Antennen, Abgeschirmte
Rume und Gehuse, Abschirmung, Testausstattung
ROLEC GEHUSE-Systeme GmbH
Kreuzbreite 2, 31737 Rinteln, Deutschland;
+49(0)5751 40030; www.rolec-enclosures.co.uk
Gehuse
S
Electrade GmbH, Lochhamer Schlag 10b, 82166 Graefelf-
ing, Deutschland;
+49(0)8989 81050; Fax: +49(0)8985 44922;
Frau Anja Schmidt, Anfrage@electrade.com;
www.electrade.com
Produkte und Services: Leitungsmaterialien, Ab-
schirmung
Schlenk Metallfolien GmbH & Co. KG
Barnsdorfer Hauptstr. 5, D-91154 Roth, Deutschland;
+49(0)9171 808 0; Fax: +49(0)9171 808200;
Gerhard Loeckler, gerhard.loeckler@schlenk.de;
www.schlenk.de
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Produkts und Services: Cables & Connectors, Test
Instrumentation, Testing, Miscellaneous
germania elektronik GmbH
Gutenbergring 41, 22848 Norderstedt, Deutschland;
+49(0)4059 35580; Fax: +49(0)4059 355820;
info@germania-elektronik.de;
www.germania-elektronik.de
Produkte und Services: Abschirmung, Leitungsma-
terialien, Ferrit, Filter
GIGACOMP GmbH
Richard-Wagner-Str. 31, D-82049 Pullach, Deutschland;
+49(0)8932 208957; Fax: +49(0)8932 208958;
info@gigacomp.de; www.gigacomp.de
Gowanda Electronics
ACAL BFI Germany GmbH; Assar-Gabrielsson-Strasse 1,
+49 6074 4098 0; Fax: +49 6074 4098 110;
ipe.de@bfoptilas.com;
www.bfoptilas.com.
Rossmann Electronic GmbH
Georg-Grobl-Strasse 11, Diessen, Deutschland, 86911;
+49 8807 94994 0; Fax: 49 8807 94994 29;
info@rossmannweb.de; www.rossmannweb.de.
SK Trade GmbH
Behringersdorfer Str 2, Heroldsberg, Deutschland,
D-90562;
+49 911 5187080; Fax: +49 911 5187081;
sktrade@t-online.de; www.sktrade.de.
H
H+H High Voltage Technology GmbH
Im kurzen Busch 15, D-58640 Iserlohn, Deutschland;
+49(0)2371 7853 0; Fax: +49(0)2371 7853 28;
Klaus Hornickel, Managing Director;
HF-SHIELDING Joachim Broede GmbH
Industriestrae 6, D-49170 Hagen a.T.W., Deutschland;
+49(0)5405 999904; Fax: +49(0)5405 999906;
Joachim Broede, broede@hf-shielding.de;
www.hf-shielding.de
HILO-TEST GmbH
E. Pohlner, Hennebergstr. 6,
D - 76131 Karlsruhe, Deutschland;
+49-721-931 090; Fax: +49-721-931 0939;
info@hilo-test.de; www.hilo-test.de
Hirschmann Car Communication GmbH
Stuttgarter Strae 45-51, 72654 Neckartenzlingen,
Deutschland;
+49 (0) 7127 14-0; Fax: +49 (0) 7127 14-1060;
info@hirschmann-car.com;
www.hirschmann-car.com
I
i. thomas gmbh
An der B73 - 200a, D-21684 Stade, Deutschland;
+49(0)4141 82920; Fax: +49(0)4141 84461;
www.schirmkabinen.de
Produkte und Services: Filter, Abschirmung,
Software
IBH Elektrotechnik GmbH
Gutenbergring 35, D-22848 Norderstedt, INTL,
Deutschland;
+49(0)40 52 30 52 0; Fax: +49(0)40 523 97 09;
Michaela Kluckert, mkluckert@ibh-elektrotechnik.de;
www.ibh-elektrotechnik.de
a TESEQ Company
+49 (0) 3056 598835; Fax: +49 (0) 3056 598834;
desales@teseq.com;
www.teseq.dewww.pischzan-technologies.de
IMST GmbH
Carl-Friedrich-Gau-Str. 2-4-4, 47475, Kamp-Lintfort,
Deutschland;
+49(0)2842 981 0; Fax: +49 2842 981 199;
borkes@imst.com; marketing@imst.com;
www.imst.com
innco-systems GmbH
Erlenweg 12, 92521 Schwarzenfeld, Deutschland;
+49 9435 301659-0; Fax: +49 9435 301659-99;
info@inncosystems.com;
hoelzl@inncosystems.com;
www.inncosystems.com
Produkte und Services: EMV Positionierer
Drehtische & Antennen Masten
+49 (0) 6122 / 7 26 60-0; Fax: +49 (0) 6122 / 7 26 60-29;
a.keenan@ie4u.de; w.uhlig@ie4u.de;
www.ie4u.de
Instec Filters
ACAL BFI GmbH; Assar Gabrielsson Strae 1,
+49 (0) 6074 4098 113; Fax: +49 (0) 6074 81 20 20;
Kerstin Reinhardt, kerstin.reinhardt@bfoptilas.com;
www.bfoptilas.com.
Produkte und Services: Filters
J
Jacob GmbH
Elektrotechnische Fabrik, Gottlieb-Daimler-Str. 11,
D-71394 Kernen, Deutschland;
+49 (0)7151 40110; Fax: +49 (0)7151 4011 49;
jacob@jacob-gmbh.de;
www.jacob-gmbh.de
JiangSu WEMC Technology Co., Ltd.
No. 8, Jian Ye Road, TianMu Lake Industrial Park, LiYang
Jiangsu, 213300, China;
+86 519 8746 7888; Fax: +86 519 8746 5666;
Xiao Wei; weiyl@wemctech.com;
www.wemctech.com
K
KE Kitagawa GmbH
Elbinger Strae 3-5, D-63110 Rodgau-Jgesheim,
Deutschland;
+49(0)6106 8524 0; Fax: +49(0)6106 85 2430;
sales@kitagawa.de;
www.kitagawa.de
Produkte und Services: Ferrit
L
Noethnitzer Hang 31, Bannewitz, 01728, Deutschland;
+49(0)3514 3009323;
michak@langer-emv.de; www.langer-emv.de
Peter Harms Consulting, Schenefelder Landstrae 127,
DE-22589 Hamburg;
+49 40 870-2469; Fax: +49 40 870-3821;
peter.harms@on-line.de; www.langer-emv.de
Produkte und Services: Testausstattung, Pre-
compliance EMC engineering services, Measurement
software, EMC pre-test equipments, Test and measure-
ment, Training
Luethi Elektronik-Feinmechanik AG
Parkstrasse 6, 4402 Frenkendorf / BL, Deutschland;
+49(0)6190 21210; Fax: +49(0)6190 21211;
www.luethi-ag.ch
M
Maschek Elektronik
Adolf-Scholz-Allee 4a, 86825, Bad Wrishofen,
Deutschland;
+49(0)8247 959807; Fax: +49(0)8247 959809;
info@maschek.de; www.maschek.de
maturo GmbH
Bahnhofstr. 26, 92536, Pfreimd, Deutschland;
+49(0)9606 9239130; Fax: 49(0)9606 92391329;
Markus Saller; m.saller@maturo-gmbh.de;
www.maturo-gmbh.de
Produkte und Services | Deutschland
63
MB-technology GmbH
Kolumbusstr. 19+21, 71063 Sindelfngen, Deutschland;
+49(0)7031 6863000; Fax: +49(0)7031 6864500;
media@mbtech-group.com; www.mbtech-group.com
Mesago Messe Frankfurt GmbH
Rotebuehlstrae 83-85, Stuttgart, 70178, Deutschland;
+49(0)7116 19462 0; Fax: +49(0) 7116 1946 91;
www.mesago-online.de
Produkte und Services: Events
Mician GmbH
Schlachte 21, 28195 Bremen, Deutschland;
+49(0)4211 6899351; Fax: +49(0)4211 68993 52;
sales@mician.com; www.mician.com
a TESEQ Company
MILMEGA
+49 (0) 3056 598835; Fax: +49 (0) 3056 598834;
MOOSER Consulting GmbH
Amtmannstrae 5a, 82544
Egling/Thanning, Deutschland;
+49(0)8176 92250; Fax: +49(0)8176 92252;
Mario Kantner; m.kantner@mooser-emctechnik.de;
http://mooser-consulting.de
MTS Systemtechnik GmbH
Gewerbepark Ost 8, D-86690 Mertingen, Deutschland;
+49(0)9078 912940, Fax: +49(0)9078 912947 0;
info@mts-systemtechnik.de;
www.mts-systemtechnik.de
N
Narda Safety Test Solutions GmbH
Sandwiesenstrasse 7, 72793, Pfullingen, Deutschland;
+49(0)7121 9732 0 Fax: +49(0)7121 9732790,
support@narda-sts.de; www.narda-sts.de
Sonstiges
Neosid Pemetzrieder GmbH & Co. KG
P.O. Box 1354, D-58543 Halver, Deutschland;
+49(0)2353 710; Fax: +49(0)2353 7154;
sales@neosid.de; www.neosid.de
Produkte und Services: Ferrit, Filter
Neuhaus Elektronik GmbH
Drontheimer Str. 21, D-13359 Berlin, Deutschland;
+49(0)3049 76950; Fax: +49(0)3049 769530;
neuhaus-elektronik@t-online.de;
www.neuhaus-elektronik.de
Nexio
Emco Elektronik, Bunsenstr.5, D-82152 Planegg,
Deutschland;
+49(0)8989 55650; Fax: +49(0)8989 590376;
info@emco-elektronik.de; www.emco-elektronik.de
Produkte und Services: Testausstattung, Filter,
berspannung und Einschaltste
P
PFLITSCH GmbH & Co. KG
Ernst-Pfitsch-Strae 1 industriegebie, Nord 1, D-42499
Hckeswagen, Deutschland;
+49(0)2192 9110; Fax: +49(0)2192 911220;
info@pfitsch.de; www.pfitsch.de
Phoenix Testlab GmbH
Konigswinkel 10, D-32825 Blomberg, Deutschland;
+49(0)5235 95000; Fax: 49(0)5235 950010;
offce@phoenix-testlab.de;
www.phoenix-testlab.de
Pontis - Audiv GmbH
Audivo GmbH,Irrenloher Damm 17, 92521 Schwarzenfeld,
Deutschland;
+49(0)9435 54190; Fax: +49(0)9435 541919;
info@audivo.com; www.audivo.com
R
Rohde & Schwarz GmbH
Muhldorfstrasse 15, Munich, 81671, Deutschland;
+49(0)89 418695 0; Fax: +49(0)89 404764;
sigrun.Berghammer@rohde-schwarz.com;
www2.rohde-schwarz.com
Rume und Gehuse, Abschirmung, Testausstattung
ROLEC GEHUSE-Systeme GmbH
Kreuzbreite 2, 31737 Rinteln, Deutschland;
+49(0)5751 40030; www.rolec-enclosures.co.uk
Gehuse
S
Electrade GmbH, Lochhamer Schlag 10b, 82166 Graefelf-
ing, Deutschland;
+49(0)8989 81050; Fax: +49(0)8985 44922;
Frau Anja Schmidt, Anfrage@electrade.com;
www.electrade.com
schirmung
Schlenk Metallfolien GmbH & Co. KG
Barnsdorfer Hauptstr. 5, D-91154 Roth, Deutschland;
+49(0)9171 808 0; Fax: +49(0)9171 808200;
Gerhard Loeckler, gerhard.loeckler@schlenk.de;
www.schlenk.de
Deutschland | Ressourcen
64
Schlder GmbH
Hauptstrasse 71, D-75210, Keltern-Weiler, Deutschland;
+49(0)7236 93960; Fax: +49(0)7236 939690;
Friedrich Schloeder, info@schloeder-emv.de;
www.schloeder-emv.de
Produkte und Services: Testen, Testausstattung
Schwarzbeck Mess - Elektronik
An der Klinge 29, D 69250, Schnau, Deutschland;
+49(0)6228 1001; Fax: +49(0)6228 1003;
info@schwarzbeck.de; www.schwarzbeck.de

ServiceForce.Com GmbH
Kleyerstrae 92, 60326, Frankfurt am Main,
Deutschland;
+49(0)6936 50905500; www.serviceforce-com.de
Siemens Energy & Automation EMC-Centre
Guenther-Scharowsky-Str. 21,
Erlangen, D-91058, Deutschland;
+49(0)9131 732977; Fax: +49(0)9131 725007; karlheinz.
gravenhorst@siemens.com;
www.automation.siemens.com
SINUS Electronic GmbH
Schiefweg 10, D-7427 Untereisesheim, Deutschland;
+49(0)7132 99690; +49(0)7132 996950;
info@sinus-electronic.de; www.sinus-electronic.de
Produkte und Services: Filter, berspannung und
Einschaltste
Sonderhoff Chemicals GmbH
Richard-Byrd-Strae 26, 50829 Kln, Deutschland;
+49(0)2219 56850; Fax +49(0)2219 5685599;
info@sonderhoff.com; www.sonderhoff.com
SOSHIN Electronics Europe GmbH
Westerbachstrasse 32, D-61476, Kronberg im Taunus,
Deutschland;
+49(0)6173 993108; Fax: +49(0)6173 993206;
www.soshin-ele.com
Spitzenberger & Spies GmbH & Co
Schmidstrae 32-34, D-94234, Viechtach, Deutschland;
+49(0)9942 956 0;
info@spitzenberger.de; www.spitzenberger.de
Produkte und Services: Verstrker, Testausstattung

Statex Produktions & Vertriebs GmbH
Kleiner Ort 9, 28357 Bremen, Deutschland;
+49(0)4212 750479; Fax: +49(0)4212 73643;
info@statex.de; www.statex.de
Gehuse, Abschirmung, Leitungsmaterialien
Stolberg HF-Technik AG
Muensterau 168, 52224, Stolberg-Vicht, Deutschland;
+49(0)2402 997770; Fax: +49(0)2402 99777900;
Harald Landes, harald.landes@stolberg-hf.com;
www.stolberg-hf.com
Stecker, Testausstattung
T
Tactron Elektronik
Bunsenstrae 5 / 11 Stock, 82152 Planegg, Deutschland;
+49(0)8989 55690; Fax: +49(0)8985 77605;
info@tactron.de TDK; www.tactron.de
TDK Electronics Europe
Wanheimer Strasse 57, Dusseldorf, INTL, D-40472,
Deutschland;
+44(0)1344 381515;
Stuart Jackson; sjackson@eu.tdk.com;
www.tdk-europe.com
Produkte und Services: Verstrker, Antennen, Ferrit,
Filter, Abgeschirmte Rume und Gehuse, Abschirmung,
Testausstattung, Testen
Tech-Etch, Inc.
Feuerherdt GmbH, Motzener Str. 26 b, 12277 Berlin,
Deutschland;
+49(0)30 710 96 45 53; Fax: +49(0)30 710 96 45 99;
emc@feuerherdt.de; www.tech-etch.com
schirmung
Telemeter Electronic GmbH
Joseph-Gansler-Strae 10,
D-86609 Donauworth, Deutschland;
+49(0)9067 06930; Fax: +49(0)9067 069350;
info@telemeter.de; www.telemeter.info
Produkte und Services: Testen,HF-und Mikrowellen
TESTEC Elektronik GmbH
Westerbachstr. 58,
60489 Frankfurt am Main, Deutschland;
+49(0)6994 33350; Fax: +49(0)6994 333555;
info@testec.de; www.testec.de
Teseq GmbH
Landsberger Strasse 255, 12623 Berlin, Deutsch-
land;
+49 (0) 3056 598835; Fax: +49 (0) 3056 598834;
Pr odukt e und Ser vi ces: Ver st r ker ( HF &
Mikrowellen), Antennen, Automotive Systeme,
leitungsgebundene Strfestigkeit, leitungsgebun-
dene berspannung & schnelle Transienten, ESD,
Netzoberwellen & Flicker, GTEM Zellen, HF Immu-
nitts- und Emissionssysteme, HF Testsoftware,
Kalibration & Service
THORA Elektronik GmbH
Esbacher Weg 13, D-91555 Feuchtwangen,
+49 (0) 98 52 6 10 79-0; Fax: +49 (0) 98 52 6 10
79-50;
service@thora.com; www.thora.com
Produkte und Services: Ferrit, Connectors
TTV GmbH
Sudetenstr. 53, 82538 geretsried, Deutschland;
+49(0)8171 34690; Fax: +49(0)8171 346929;
info@go-ttv.com; www.go-ttv.com
TV SD SENTON GmbH
uere Frhlingstrae 45,
94315 Straubing, Deutschland;
+49(0)9421 552222; Fax: +49(0)9421 552299;
Stefan Kammerl; senton@tuev-sued.de;
www.tuev-sued.de/senton
V
Vacuumschmelze GmbH
Grner Weg 37, Hanau, D-63450, Deutschland;
+49 6181 38-0; Fax: +49(0)6181 382645;
info_vertrieb@vacuumschmelze.com;
www.vacuumschmelze.com
Produkte und Services: Produkte
W
Wrth Elektronik GmbH &Co. KG
Salzstrae 21, 74676 Niedernhall, Deutschland;
+49 (0) 79 40 946 - 0; Fax: +49 (0) 79 40 946 - 55 00 00;
Alexander Gerfer, alexander.gerfer@we-online.de;
www.we-online.de
Produkte und Services: Ferrit, Kabel und Stecker
ASSOCIATION
IEEE EMC SOCIETY
CHAPTER GERMANY
Frank Sabath, Federal Ministry of Defense,
Armament Directorate IV 6, Am Steinberg 9,
Garstedt 21441, Deutschland; +49 4173 58 17 20;
Fax: +49 4173 58 17 21; Frank.Sabath@ieee.org
NOTIFIED BODIES
CETECOM GMBH
Im Teelbruch 116, 45219 ESSEN, Deutschland; 49
(0) 20 54 95 283; Fax: 49 (0) 20 54 95 19 903; info@
cetecom.com; www.cetecom.de
EMC TEST NRW GMBH
Emil-Figge-Strae 76, 44227 Dortmund,
Deutschland; +49 231 9742750; Fax: +49 231
9742755; service@emc-test.de; www.emc-test.de
EMCCERT DR. RASEK GMBH
Moggast, Boelwiese 4-8, 91320 Ebermanstadt,
Deutschland; +49 9194 9016; Fax: +49 9194 8125;
emc.cert@emcc.de; www.emcc.de
EUROFINS PRODUCT SERVICE GMBH
Storkower Strae 38C, 15526 Reichenwalde,
Deutschland; +49 33 63 18 88 0; Fax: +49 33 63 18
88 660; ProductTesting-BLN@eurofns.com; www.
eurofns.com
KRAUSS-MAFFEI WEGMANN
GMBH & CO. KG
August-Bode-Strae 1, 34127 Kassel, Deutschland;
+49 561 105 0; Fax: +49 (561) 1052832; info@
kmweg.de; www.kmweg.de
MIKES-TESTING PARTNERS GMBH
Ohmstrasse 2-4, 94342 Strasskirchen, Deutschland;
+49 (0) 9424 94810; Fax: +49 (0) 9424 9481240;
info@mikes-tp.com; www.mikes-testing-partners.
com
MITSUBISHI ELECTRIC EUROPE B.V.
Mndelheimer Weg 35, 40472 Dsseldorf,
Deutschland; +49 211 17149712; Fax:+49
211 17149727; pr@meg.mee.com; www.
mitsubishielectric.de
OBERING BERG & LUKOWIAK GMBH
Lhner Strae 157, 32609 Hllhorst, Deutschland;
+49 5744 9296 0; Fax: +49 5744 929615; info@obl-
gmbh.de; www.obl-gmbh.de
Deutschland | Ressourcen
64
Schlder GmbH
Hauptstrasse 71, D-75210, Keltern-Weiler, Deutschland;
+49(0)7236 93960; Fax: +49(0)7236 939690;
Friedrich Schloeder, info@schloeder-emv.de;
www.schloeder-emv.de
Produkte und Services: Testen, Testausstattung
Schwarzbeck Mess - Elektronik
An der Klinge 29, D 69250, Schnau, Deutschland;
+49(0)6228 1001; Fax: +49(0)6228 1003;
info@schwarzbeck.de; www.schwarzbeck.de

ServiceForce.Com GmbH
Kleyerstrae 92, 60326, Frankfurt am Main,
Deutschland;
+49(0)6936 50905500; www.serviceforce-com.de
Siemens Energy & Automation EMC-Centre
Guenther-Scharowsky-Str. 21,
Erlangen, D-91058, Deutschland;
+49(0)9131 732977; Fax: +49(0)9131 725007; karlheinz.
gravenhorst@siemens.com;
www.automation.siemens.com
SINUS Electronic GmbH
Schiefweg 10, D-7427 Untereisesheim, Deutschland;
+49(0)7132 99690; +49(0)7132 996950;
info@sinus-electronic.de; www.sinus-electronic.de
Produkte und Services: Filter, berspannung und
Einschaltste
Sonderhoff Chemicals GmbH
Richard-Byrd-Strae 26, 50829 Kln, Deutschland;
+49(0)2219 56850; Fax +49(0)2219 5685599;
info@sonderhoff.com; www.sonderhoff.com
SOSHIN Electronics Europe GmbH
Westerbachstrasse 32, D-61476, Kronberg im Taunus,
Deutschland;
+49(0)6173 993108; Fax: +49(0)6173 993206;
www.soshin-ele.com
Spitzenberger & Spies GmbH & Co
Schmidstrae 32-34, D-94234, Viechtach, Deutschland;
+49(0)9942 956 0;
info@spitzenberger.de; www.spitzenberger.de
Produkte und Services: Verstrker, Testausstattung

Statex Produktions & Vertriebs GmbH
Kleiner Ort 9, 28357 Bremen, Deutschland;
+49(0)4212 750479; Fax: +49(0)4212 73643;
info@statex.de; www.statex.de
Gehuse, Abschirmung, Leitungsmaterialien
Stolberg HF-Technik AG
Muensterau 168, 52224, Stolberg-Vicht, Deutschland;
+49(0)2402 997770; Fax: +49(0)2402 99777900;
Harald Landes, harald.landes@stolberg-hf.com;
www.stolberg-hf.com
Stecker, Testausstattung
T
Tactron Elektronik
Bunsenstrae 5 / 11 Stock, 82152 Planegg, Deutschland;
+49(0)8989 55690; Fax: +49(0)8985 77605;
info@tactron.de TDK; www.tactron.de
TDK Electronics Europe
Wanheimer Strasse 57, Dusseldorf, INTL, D-40472,
Deutschland;
+44(0)1344 381515;
Stuart Jackson; sjackson@eu.tdk.com;
www.tdk-europe.com
Produkte und Services: Verstrker, Antennen, Ferrit,
Filter, Abgeschirmte Rume und Gehuse, Abschirmung,
Testausstattung, Testen
Tech-Etch, Inc.
Feuerherdt GmbH, Motzener Str. 26 b, 12277 Berlin,
Deutschland;
+49(0)30 710 96 45 53; Fax: +49(0)30 710 96 45 99;
emc@feuerherdt.de; www.tech-etch.com
schirmung
Telemeter Electronic GmbH
Joseph-Gansler-Strae 10,
D-86609 Donauworth, Deutschland;
+49(0)9067 06930; Fax: +49(0)9067 069350;
info@telemeter.de; www.telemeter.info
Produkte und Services: Testen,HF-und Mikrowellen
TESTEC Elektronik GmbH
Westerbachstr. 58,
60489 Frankfurt am Main, Deutschland;
+49(0)6994 33350; Fax: +49(0)6994 333555;
info@testec.de; www.testec.de
Teseq GmbH
Landsberger Strasse 255, 12623 Berlin, Deutsch-
land;
+49 (0) 3056 598835; Fax: +49 (0) 3056 598834;
Pr odukt e und Ser vi ces: Ver st r ker ( HF &
Mikrowellen), Antennen, Automotive Systeme,
leitungsgebundene Strfestigkeit, leitungsgebun-
dene berspannung & schnelle Transienten, ESD,
Netzoberwellen & Flicker, GTEM Zellen, HF Immu-
nitts- und Emissionssysteme, HF Testsoftware,
Kalibration & Service
THORA Elektronik GmbH
Esbacher Weg 13, D-91555 Feuchtwangen,
+49 (0) 98 52 6 10 79-0; Fax: +49 (0) 98 52 6 10
79-50;
service@thora.com; www.thora.com
Produkte und Services: Ferrit, Connectors
TTV GmbH
Sudetenstr. 53, 82538 geretsried, Deutschland;
+49(0)8171 34690; Fax: +49(0)8171 346929;
info@go-ttv.com; www.go-ttv.com
TV SD SENTON GmbH
uere Frhlingstrae 45,
94315 Straubing, Deutschland;
+49(0)9421 552222; Fax: +49(0)9421 552299;
Stefan Kammerl; senton@tuev-sued.de;
www.tuev-sued.de/senton
V
Vacuumschmelze GmbH
Grner Weg 37, Hanau, D-63450, Deutschland;
+49 6181 38-0; Fax: +49(0)6181 382645;
info_vertrieb@vacuumschmelze.com;
www.vacuumschmelze.com
Produkte und Services: Produkte
W
Wrth Elektronik GmbH &Co. KG
Salzstrae 21, 74676 Niedernhall, Deutschland;
+49 (0) 79 40 946 - 0; Fax: +49 (0) 79 40 946 - 55 00 00;
Alexander Gerfer, alexander.gerfer@we-online.de;
www.we-online.de
Produkte und Services: Ferrit, Kabel und Stecker
ASSOCIATION
IEEE EMC SOCIETY
CHAPTER GERMANY
Frank Sabath, Federal Ministry of Defense,
Armament Directorate IV 6, Am Steinberg 9,
Garstedt 21441, Deutschland; +49 4173 58 17 20;
Fax: +49 4173 58 17 21; Frank.Sabath@ieee.org
NOTIFIED BODIES
CETECOM GMBH
Im Teelbruch 116, 45219 ESSEN, Deutschland; 49
(0) 20 54 95 283; Fax: 49 (0) 20 54 95 19 903; info@
cetecom.com; www.cetecom.de
EMC TEST NRW GMBH
Emil-Figge-Strae 76, 44227 Dortmund,
Deutschland; +49 231 9742750; Fax: +49 231
9742755; service@emc-test.de; www.emc-test.de
EMCCERT DR. RASEK GMBH
Moggast, Boelwiese 4-8, 91320 Ebermanstadt,
Deutschland; +49 9194 9016; Fax: +49 9194 8125;
emc.cert@emcc.de; www.emcc.de
EUROFINS PRODUCT SERVICE GMBH
Storkower Strae 38C, 15526 Reichenwalde,
Deutschland; +49 33 63 18 88 0; Fax: +49 33 63 18
88 660; ProductTesting-BLN@eurofns.com; www.
eurofns.com
KRAUSS-MAFFEI WEGMANN
GMBH & CO. KG
August-Bode-Strae 1, 34127 Kassel, Deutschland;
+49 561 105 0; Fax: +49 (561) 1052832; info@
kmweg.de; www.kmweg.de
MIKES-TESTING PARTNERS GMBH
Ohmstrasse 2-4, 94342 Strasskirchen, Deutschland;
+49 (0) 9424 94810; Fax: +49 (0) 9424 9481240;
info@mikes-tp.com; www.mikes-testing-partners.
com
MITSUBISHI ELECTRIC EUROPE B.V.
Mndelheimer Weg 35, 40472 Dsseldorf,
Deutschland; +49 211 17149712; Fax:+49
211 17149727; pr@meg.mee.com; www.
mitsubishielectric.de
OBERING BERG & LUKOWIAK GMBH
Lhner Strae 157, 32609 Hllhorst, Deutschland;
+49 5744 9296 0; Fax: +49 5744 929615; info@obl-
gmbh.de; www.obl-gmbh.de
Ressourcen | Deutschland
65
PANASONIC CUSTOMER
SERVICES EUROPE
Winsbergring 15, 22525 Hamburg, Deutschland;
+49 40 8549 359 0; Fax: +49 40 8549 2500;
wolfgang.hoepfner@eu.panasonic.com; www.
panasonic.de
PHOENIX TESTLAB GMBH
Kningswinkel 10, 32825 Blomberg, Deutschland;
+49 5235 9500 0; Fax: +49 5235 9500 20;
office@phoenix-testlab.de; www.phoenix-
testlab.de
SGS GERMANY GMBH
ZERTIFIZIERUNGSSTELLE MNCHEN
Hofmannstrae 50 81379 Mnchen, Deutschland;
+49 89 787475132; Fax: +49 89 787475122;
melanie.beier@sgs.com; www.sgs-cqe.de
SIEMENS AG
San-Carlos-Strae 7, 91058 Erlangen,
Deutschland +49 9131 733177; Fax:+49 9131
733265; peter.linnert@siemens.com; www.
siemens.de
SLG PRF UND ZERTIFIZIERUNGS
GMBH
Burgstdter Strasse 20, 09232 Hartmannsdorf,
Deutschland; +49 (0) 3722 7323 0; Fax:+49 (0)
3722 7323-899; service@slg.de.com; www.slg.
de.com
SONY DEUTSCHLAND GMBH
Hedelfinger Strae 61, 70327 Stuttgart,
Deutschland; +49 (0) 711 5858 0; Fax: +49 (0) 711
5858 235; hubert.klamm@eu.sony.com; www.
stuttgart.sony.de
TV RHEINLAND LGA PRODUCTS
GMBH
Tillystrae 2, 90431 Nrnberg, Deutschland; +49
0911 6555227; Fax: +49 221 806 3935; ksc@
de.tuv.com; www.de.tuv.com
TV SD PRODUCT SERVICE GMBH
Ridlerstrae 65, 80339 Mnchen, Deutschland;
+49 (0) 89 5008 40; Fax: +49 (0) 89 5008 4222
productservice@tuev-sued.de; ww.tuev-sued.
de/ps
TV TECHNISCHE BERWACHUNG
HESSEN GMBH
Rdesheimer Strae, 119, 64285 Darmstadt,
Deutschland; +49 651 600 109; Fax: +49 6151
600 666; mailbox@tuevhessen.de; www.tuev-
hessen.de
VDE - PRF- UND
ZERTIFIZIERUNGSINSTITUT GMBH
Merianstrae, 28, 63069 Offenbach (AM MAIN),
Deutschland; +49 069 8306 0; Fax: +49 069 8306
555; vde-institut@vde.com; www.vde.com
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STEPHAN BRAUN, ARND FRECH
Founders
GAUSS INSTRUMENTS GmbH
I. EINLEITUNG
D
URCH DIE Erweiterung der Fachgrundnorm
CISPR 16-1-1 um Spektrumanalysatoren
sowie um das FFT-based Measuring Instru-
ment wurden die Weichen fr den Technolo-
giewechsel gestellt. Der Einsatz des Spektru-
manalysators fr EMV Messungen wurde in
die Fachgrundnorm aufgenommen um primr
stationre EMV Emissionen, wie sie z.B. von einem PC
existieren kostengnstig und schnell messen zu knnen.
Das FFT-based Measuring Instrument hingegen wurde in
die Fachgrundnorm aufgenommen, um komplexe Strer
mit hhere Zuverlssigkeit und hherer Geschwindigkeit
zu analysieren und messen zu knnen. Durch die Digital-
isierung der Messgerte stehen mittlerweile verschiedene
Verfahren zur Verfgung um einen Messempfnger zu re-
alisieren. Zum einen existieren klassische Messempfnger,
welche schmalbandig heruntermischen, durchgestimmt
werden und die Messung an je einem Frequenzpunkt
durchfhren. Des weiteren existieren Basisbandmess-
gerte welche mit sehr leistungsf higen Gigasamples
A/D Wandlern und FPGAs ausgestattet sind[2], und die
eigentliche Messung, d.h. Emulation eines Messempfngers
oder Spektrumanalyzers, voll digital an mehreren tausend
Frequenzpunkten durchgefhrt werden. Als Brckentech-
nologie gibt es noch Messempfnger mit einer breiteren
Zwischenfrequenz, typischerweise ca. 25 MHz welche die
Auswertung ber diesen Bandbereich durchfhren, und
einzelne Bnder sequentiell durchmessen und diese zu
einem Spektrum zusammensetzen.
Allerdings stellt die CISPR 16-1-1 hchste Anforderun-
gen an derartige Messgerte hinsichtlich der Dynamik fr
breitbandige Strungen. Die zentrale Herausforderung ist
die Dynamik fr Pulse im Band C mit niedriger Pulswieder-
holrate und Quasi-Spitzenwert Bewertung bereitzustellen.
Zum erreichen dieser Dynamik werden unterschiedliche
Konzepte eingesetzt. Bei breitbandigen Messsystemen
werden mehrstuge A/D Wandlersystem eingesetzt um
die Dynamik zu verbessern. Bei Messempfnger wird dies
durch Vorselektion erreicht.
In diesem Artikel wird eine bersicht an die Anforde-
66
Deutschland
Braun_GER_EEG13.indd 6 11/16/12 4:03 PM
STEPHAN BRAUN, ARND FRECH
Founders
GAUSS INSTRUMENTS GmbH
I. EINLEITUNG
D
URCH DIE Erweiterung der Fachgrundnorm
CISPR 16-1-1 um Spektrumanalysatoren
sowie um das FFT-based Measuring Instru-
ment wurden die Weichen fr den Technolo-
giewechsel gestellt. Der Einsatz des Spektru-
manalysators fr EMV Messungen wurde in
die Fachgrundnorm aufgenommen um primr
stationre EMV Emissionen, wie sie z.B. von einem PC
existieren kostengnstig und schnell messen zu knnen.
Das FFT-based Measuring Instrument hingegen wurde in
die Fachgrundnorm aufgenommen, um komplexe Strer
mit hhere Zuverlssigkeit und hherer Geschwindigkeit
zu analysieren und messen zu knnen. Durch die Digital-
isierung der Messgerte stehen mittlerweile verschiedene
Verfahren zur Verfgung um einen Messempfnger zu re-
alisieren. Zum einen existieren klassische Messempfnger,
welche schmalbandig heruntermischen, durchgestimmt
werden und die Messung an je einem Frequenzpunkt
durchfhren. Des weiteren existieren Basisbandmess-
gerte welche mit sehr leistungsf higen Gigasamples
A/D Wandlern und FPGAs ausgestattet sind[2], und die
eigentliche Messung, d.h. Emulation eines Messempfngers
oder Spektrumanalyzers, voll digital an mehreren tausend
Frequenzpunkten durchgefhrt werden. Als Brckentech-
nologie gibt es noch Messempfnger mit einer breiteren
Zwischenfrequenz, typischerweise ca. 25 MHz welche die
Auswertung ber diesen Bandbereich durchfhren, und
einzelne Bnder sequentiell durchmessen und diese zu
einem Spektrum zusammensetzen.
Allerdings stellt die CISPR 16-1-1 hchste Anforderun-
gen an derartige Messgerte hinsichtlich der Dynamik fr
breitbandige Strungen. Die zentrale Herausforderung ist
die Dynamik fr Pulse im Band C mit niedriger Pulswieder-
holrate und Quasi-Spitzenwert Bewertung bereitzustellen.
Zum erreichen dieser Dynamik werden unterschiedliche
Konzepte eingesetzt. Bei breitbandigen Messsystemen
werden mehrstuge A/D Wandlersystem eingesetzt um
die Dynamik zu verbessern. Bei Messempfnger wird dies
durch Vorselektion erreicht.
In diesem Artikel wird eine bersicht an die Anforde-
66
Deutschland
Braun_GER_EEG13.indd 6 11/16/12 4:03 PM ADs_EEG13.indd 21 11/16/12 2:46 PM
Deutschland
68
rungen von Messgerten hinsichtlich
der erweiterten Norm CISPR 16-1-1
gegeben. Dabei werden die Heraus-
forderungen, Lsungsanstze sowie
mgliche Grenzen diskutiert. Auch
neuere Verfahren wie Noise Floor
Extension (NFE) werden hinsichtlich
Chancen und Risiken diskutiert.
II. FUNKSTRMESSEMPFNGER
UND
SPEKTRUMANALYSATOREN
Funkstrmessempfnger messen
das Emissionssignal im Frequenz-
bereich. Die Messung erfolgt dabei
sequentiell an mehreren tausend Fre-
quenzpunkten. Bis heute ist der Einsatz
von Superheterodynempfngern weit
verbreitet. Ein Blockdiagramm eines
konventionellen Superheterodynemp-
fngers ist in Abbildung 1 dargestellt.
Eine Vorselektion unterdrckt Signale
auerhalb des Bandes, in welchem
die Messungen durchgefhrt werden.
Dadurch wird die Dynamik, insbesondere fr breitbandige
Strungen im Vergleich zu Spektrumanalysatoren erhht. Ein Mischer, sowie ein berlagerungsoszillator fh-
ren eine Frequenzkonversion zu einer Zwisch-
enfrequenz durch. Das Signal wird durch das
ZF-Filter bandpassgefiltert. Das ZFFilter muss
die Selektivitt nach CISPR 16-1-1 einhalten. Das
Ausgangssignal wird gewichtet mittels eines Spit-
zenwert, Quasi-Spitzenwert, Mittelwert, CISPR-
AVG, CISPRAVG - RMS Detektors. blicherweise
wird das ZF-Signal
s
IF
auch analog bereitgestellt.
Spektrumanalysatoren knnen einen gesweepten
Scan durchfhren und benutzen blicherweise eine
Video Filter zur Mittelwertbildung. Man spricht
hier von einer logarithmischen Mittelwertbildung.
III. EMV-ZEITBEREICHSMESSSYSTEM
Beim EMV-Zeitbereichsmesssystem wird das
Eingangssignal mittels einer Analog-Digital-
Wandler-Einheit zur Messung im Frequenzbereich
9 kHz - 1 GHz abgetastet und digitalisiert. Fr Mes-
sungen oberhalb 1 GHz erfolgt eine breitbandige
Frequenzumsetzung. Die spektrale Berechnung
erfolgt mittels Kurzzeit-FFT. Ein Blockschaltbild
eines EMVZeitbereichsmesssystems ist in Ab-
bildung 2 dargestellt. Fr gestrahlte Emissions-
messung verwendet man typischerweise eine
breitbandige logarithmisch-periodische Antenne.
Alternativ knnen Messungen mittels Absorber-
zange oder Netznachbildung durchgefhrt werden.
Zur Untersuchung der Einkopplung an Antennen
im KFZ kann das EMVZeitbereichsmesssystem
direkt angeschlossen werden. Das Eingangssignal
wird mittels eines mehrstufgen Analog- Digital-
Wandler-Systems digitalisiert. Durch das mehr-
stufge Analog-Digital-Wandler-System erfolgt die
Digitalisierung in eine Gleitkommazahl [1]. Dies
erlaubt es, einen quivalenten Dynamikbereich
Fig. 1: Konventioneller Superheterodynempfnger
Fig. 2: EMV-Zeitbereichsmesssystem
Deutschland
68
rungen von Messgerten hinsichtlich
der erweiterten Norm CISPR 16-1-1
gegeben. Dabei werden die Heraus-
forderungen, Lsungsanstze sowie
mgliche Grenzen diskutiert. Auch
neuere Verfahren wie Noise Floor
Extension (NFE) werden hinsichtlich
Chancen und Risiken diskutiert.
II. FUNKSTRMESSEMPFNGER
UND
SPEKTRUMANALYSATOREN
Funkstrmessempfnger messen
das Emissionssignal im Frequenz-
bereich. Die Messung erfolgt dabei
sequentiell an mehreren tausend Fre-
quenzpunkten. Bis heute ist der Einsatz
von Superheterodynempfngern weit
verbreitet. Ein Blockdiagramm eines
konventionellen Superheterodynemp-
fngers ist in Abbildung 1 dargestellt.
Eine Vorselektion unterdrckt Signale
auerhalb des Bandes, in welchem
die Messungen durchgefhrt werden.
Dadurch wird die Dynamik, insbesondere fr breitbandige
Strungen im Vergleich zu Spektrumanalysatoren erhht. Ein Mischer, sowie ein berlagerungsoszillator fh-
ren eine Frequenzkonversion zu einer Zwisch-
enfrequenz durch. Das Signal wird durch das
ZF-Filter bandpassgefiltert. Das ZFFilter muss
die Selektivitt nach CISPR 16-1-1 einhalten. Das
Ausgangssignal wird gewichtet mittels eines Spit-
zenwert, Quasi-Spitzenwert, Mittelwert, CISPR-
AVG, CISPRAVG - RMS Detektors. blicherweise
wird das ZF-Signal
s
IF
auch analog bereitgestellt.
Spektrumanalysatoren knnen einen gesweepten
Scan durchfhren und benutzen blicherweise eine
Video Filter zur Mittelwertbildung. Man spricht
hier von einer logarithmischen Mittelwertbildung.
III. EMV-ZEITBEREICHSMESSSYSTEM
Beim EMV-Zeitbereichsmesssystem wird das
Eingangssignal mittels einer Analog-Digital-
Wandler-Einheit zur Messung im Frequenzbereich
9 kHz - 1 GHz abgetastet und digitalisiert. Fr Mes-
sungen oberhalb 1 GHz erfolgt eine breitbandige
Frequenzumsetzung. Die spektrale Berechnung
erfolgt mittels Kurzzeit-FFT. Ein Blockschaltbild
eines EMVZeitbereichsmesssystems ist in Ab-
bildung 2 dargestellt. Fr gestrahlte Emissions-
messung verwendet man typischerweise eine
breitbandige logarithmisch-periodische Antenne.
Alternativ knnen Messungen mittels Absorber-
zange oder Netznachbildung durchgefhrt werden.
Zur Untersuchung der Einkopplung an Antennen
im KFZ kann das EMVZeitbereichsmesssystem
direkt angeschlossen werden. Das Eingangssignal
wird mittels eines mehrstufgen Analog- Digital-
Wandler-Systems digitalisiert. Durch das mehr-
stufge Analog-Digital-Wandler-System erfolgt die
Digitalisierung in eine Gleitkommazahl [1]. Dies
erlaubt es, einen quivalenten Dynamikbereich
Fig. 1: Konventioneller Superheterodynempfnger
Fig. 2: EMV-Zeitbereichsmesssystem
Deutschland Braun, Frech
69
von ca. 20 Bit zu erreichen. Damit ist es mglich eine hohe
Sensistivitt von ca. 20 dBV (Band B) zu erreichen und
gleichzeitig Pulse von mehreren Volt zu erfassen. Mittels
leistungsfhiger FPGAs mit einer Rechenleistung, welche
ca. 20 handelsblichen PCs entspricht, erfolgt die Auswer-
tung in einer Bandbreite von 162,5 MHz vollstndig lcken-
los in Echtzeit. Ein derartiges EMVZeitbereichsmesssystem
wurde erstmalig in [2] vorgestellt. Die Messung konnte
hierbei um einen Faktor 1000 beschleunigt werden. Das
EMV Zeitbereichsmessystem bis 1 GHz arbeitet ber den
gesamten Frequenzbereich mit Basisbandabtas-
tung und reduziert die Messzeit um bis zu einen
Faktor 4000. Das System bis 40G mit zustzlicher
Frequenzumsetzung deckt den Frequenzbereich
10 Hz - 40 GHz ab.
A. Kurzzeit-FFT
Die Kurzzeit-FFT wird als eine FFT-Berechnung
ber einen begrenzten Abschnitt verstanden,
welche im Zeitbereich verschoben wird. Mittels
Kurzzeit-FFT wird ein Spektrogramm berechnet,
welches einer Darstellung des Spektrums ber
der Zeit entspricht. Whrend stationre Signale
ein konstantes Spektrum ber der Zeit aufweisen,
zeigt sich beim Spektrogramm das instationre
Verhalten des Strsignals.
Die mathematische Defnition der Kurzzeit-FFT
ist gegeben durch:
(1) Z[m, k] =
N-1
n-0
j2 kn
N

x[n]w[n m]e
Da die Fensterfunktion w[n] symmetrisch ist, exis-
tieren mehrere Mglichkeiten Gl. 1 umzuformen.
Zur realen Berechnung erfolgt die Umwandlung
derart, dass nicht die Fensterfunktion verschoben
wird, sondern das Eingangssignal. Weitere Ver-
einfachungen sind mglich, insbesondere fr die
Applikation der Stremssionsmessung, da hier die
Phase nicht weiter ausgewertet wird. w[n] ist die
Fensterfunktion, welche das ZF-Filter eines Mes-
sempfngers nachbildet [3].
B. Vergleich zu einem konventionellen Messemfnger
Es ist aus der Literatur bekannt, dass die Kurzzeit-FFT
quivalent zu einer Anordnung von Basisbandmischern und
einer Filterbank ist [4],[5]. Die Kurzzeit-FFT kann ebenfalls
aus einer Anordnung einer Filterbank hergeleitet [6] werden.
Ein Blockschaltbild einer derartigen Anordnung ist in
Abbildung 3 dargestellt. Das Verhltnis des Dezimators ist
gegeben durch:
Fig. 3. Filterbank
Fig. 4. Bewertungskurven gema CISPR Anforderungen
10
0
10
1
10
2
10
3
10
4
15
10
5
0
5
10
15
20
25
30
CISPR 16
TDEMI
R
e
l
a
t
i
v
e

I
n
p
u
t

L
e
v
e
l

f
o
r

c
o
n
s
t
a
n
t

I
n
d
i
c
a
t
i
o
n
Pulse Repetition Frequency [Hz]
Band A
Band B
Band C/D
Deutschland
70
(2) M = f
s
/f
s bb

wobei f
s
die Abtastrate des Analog-
Digital-Wandlers ist und f
s b b
die in-
verse Schrittweite der Kurzzeit-FFT,
welche der Basisbandabtastfrequenz
entspricht. W[ f ] ist die diskretisierte
bertragungsfunktion. Die Basisband-
abtastfrequenz f
s bb
muss so gro sein,
dass die Nyquistbedingung im Basis-
band beispielsweise bei der digitalen Implementierung des
Quasispitzenwertdetektors eingehalten wird. Ein zu geringe
Abtastrate fhrt zu Messfehlern bei transienten Signalen.
C. Messungen oberhalb der Nyquistfrequenz
Typischerweise ist die Abtastrate verfgbarer Analog-
Digital-Wandler um eine Grenordnung niedriger, als
die verfgbaren Frequenzbereiche von Mischern. Eine
Kombination von einer sehr breitbandigen Konversion-
seinheit [7], welche den Frequenzbereich bis 40 GHz in
den Bereich unterhalb 1 GHz mischt, wird verwendet, um
Messungen oberhalb der Nyquistfrequenz zu ermglichen.
Mittlerweile existieren EMV Zeitbereichsmesssysteme bis
40 GHz. Damit sind Messungen nach den Normen CISPR
16-1-1, MIL461F sowie DO160 mglich.
D. Vorselektion
Breitbandige EMV Zeitbereichsmesssysteme verfgen
zustzlich ber eine Vorselektion mit einer Bandbreite von
300 MHz. Hierdurch wird zustzlich zum mehrstufgen
A/D Wandlersystem die Dynamik verbessert. Die Vorselek-
tion befndet sich vor dem mehrstufgen A/D Wandlersys-
tem mit integriertem 20 dB Vorverstrker.
IV. MESSEMPF NGER MIT BREITBANDIGER ZF
Neben den sehr breitbandingen MV Zeitbereichs-
messssytemen existieren auch frequenzumsetzende
Messgerte, welche eine breitbandige ZF verwenden, das
ZF Signals mittels eines A/D Wandlers digitalisieren und
die Berechnung der Kurzzeit Fourier Transformation in
Segmenten von maximal 25 MHz durchfhren.
V. ANFORDERUNGEN DER NORM CISPR 16-1-1
Die CISPR 16-1-1 [8] verlangt ein bestimmtes Anzei-
geverhalten eines Instruments fr unterschiedliche Prf-
signale. Man unterscheidet zwischen:
Anzeigeverhalten fr Sinus und Pulsfolgen
Anforderungen an die Dynamik
Anforderungen fr Ein- und Ausgnge
A. Anzeigeverhalten fr Sinus und Pulsfolgen
Ein Messgert gem CISPR 16-1-1 muss eine Sinusan-
zeigenauigkeit von +/-2 dB erfllen. Darber hinaus muss
je nach Detektor ein bestimmter relativer Anzeigewert
zu einem Sinussignal erreicht werden. Weiter mssen die
Bewertungskurven, welche eine nderung der Anzeige hin-
sichtlich der Pulswiederholrate fordert eingehalten werden.
Ein Beispiel fr die Bnder A,B,C und D ist in Abbildung 4
dargestellt. Die Abweichungen sind deutlich niedriger als
die zulssigen Toleranzen.
B. Anforderungen an die Dynamik
Fr alle Messgerte gelten die gleichen Anforderungen
hinsichtlich Dynamik. Fr den eingeschrnkten Einsatz
des Spektrumanalysators sind hierbei Erleichterungen
vorgesehen.
Bei Messempfngern und Messempfngern mit breiter
ZF wird die Dynamik durch den 1 dB Kompressionspunkt
des Systems bestimmt. Des weiteren wird fr Pulse die
Dynamik mageblich durch die Bandbreite der Vorselek-
tion bestimmt.
Bei Basisbandsystemen, wird die Dynamik fr Sinus-
signale mit dem Aussteuerbereich des ersten A/D Wandler
und die Dynamik fr Breitbandpulse durch den gesamten
Ausstuerbereich des Gleitkomma A/D Wandlersystems
bestimmt.
Im folgenden wollen wir die Anforderungen an die Dy-
namik zunchst allgemein und dann fr konkrete Beispiele
darstellen. Hierbei benutzen wir die Anforderungen des
Band C gem CISPR 16-1-1. blicherweise besitzen Mes-
sempfnger bei aktiviertem Vorstrker von 20 dB einen
Rauschboden von ca. -7 dBuV bei Bewertung mit dem Mit-
telwert Detektor. Fr den Quasispitzenwertdetektor ergibt
sich ein Rauschboden von 0 dBuV.
Die Referenz fr die Anzeige des Quasispitzenwertde-
tektors liegt bei 100 Hz. Hierbei muss der Anzeigewert
31.5 dB hher sein, als fr einen Einzelimpuls. Umgekehrt
bedeutet dies, dass der Einzelimpuls mit ausreichenden
Abstand ber dem Rauschboden liegen muss. Um eine
berhhung des Rauschens zu verhindern, sollte zumind-
est ein Signal- Rausch-Abstand von 10 dB vorhanden sein.
Ferner muss zustzlich ein Dynamikreserve in der Hhe der
ANFORDERUNGEN AN DIE PULSDYNAMIK
Messempfnger: Schmalbandig Breite ZF ZB-System
B
imp
1 GHz 1 GHz 1 GHz
B
pre
7 MHz 70 MHz 300MHz
D
ext
43.1 dB 23.1 dB 10.5dB
V
1dB
58 mV 590 mV 2.5 V
P
1dB
m
in
-14.6 dBm 5.4 dBm 18 dBm
P
1dB
m
in
o.V.
+4.6 dBm +25.4 dBm enfllt
Fig. 5. CISPR 16-1-1 Puls im Band B, Analoger Messempfnger
0 5 10 15 20 25 30
34
35
36
37
38
39
40
41
42
Frequency / MHz
L
e
v
e
l

/

d
B
V
Analogue EMIReceiver

CISPR 1611 40 dBuV
CISPR 1611 39 dBuV
CISPR 1611 38 dBuV
Deutschland
70
(2) M = f
s
/f
s bb

wobei f
s
die Abtastrate des Analog-
Digital-Wandlers ist und f
s b b
die in-
verse Schrittweite der Kurzzeit-FFT,
welche der Basisbandabtastfrequenz
entspricht. W[ f ] ist die diskretisierte
bertragungsfunktion. Die Basisband-
abtastfrequenz f
s bb
muss so gro sein,
dass die Nyquistbedingung im Basis-
band beispielsweise bei der digitalen Implementierung des
Quasispitzenwertdetektors eingehalten wird. Ein zu geringe
Abtastrate fhrt zu Messfehlern bei transienten Signalen.
C. Messungen oberhalb der Nyquistfrequenz
Typischerweise ist die Abtastrate verfgbarer Analog-
Digital-Wandler um eine Grenordnung niedriger, als
die verfgbaren Frequenzbereiche von Mischern. Eine
Kombination von einer sehr breitbandigen Konversion-
seinheit [7], welche den Frequenzbereich bis 40 GHz in
den Bereich unterhalb 1 GHz mischt, wird verwendet, um
Messungen oberhalb der Nyquistfrequenz zu ermglichen.
Mittlerweile existieren EMV Zeitbereichsmesssysteme bis
40 GHz. Damit sind Messungen nach den Normen CISPR
16-1-1, MIL461F sowie DO160 mglich.
D. Vorselektion
Breitbandige EMV Zeitbereichsmesssysteme verfgen
zustzlich ber eine Vorselektion mit einer Bandbreite von
300 MHz. Hierdurch wird zustzlich zum mehrstufgen
A/D Wandlersystem die Dynamik verbessert. Die Vorselek-
tion befndet sich vor dem mehrstufgen A/D Wandlersys-
tem mit integriertem 20 dB Vorverstrker.
IV. MESSEMPF NGER MIT BREITBANDIGER ZF
Neben den sehr breitbandingen MV Zeitbereichs-
messssytemen existieren auch frequenzumsetzende
Messgerte, welche eine breitbandige ZF verwenden, das
ZF Signals mittels eines A/D Wandlers digitalisieren und
die Berechnung der Kurzzeit Fourier Transformation in
Segmenten von maximal 25 MHz durchfhren.
V. ANFORDERUNGEN DER NORM CISPR 16-1-1
Die CISPR 16-1-1 [8] verlangt ein bestimmtes Anzei-
geverhalten eines Instruments fr unterschiedliche Prf-
signale. Man unterscheidet zwischen:
Anzeigeverhalten fr Sinus und Pulsfolgen
Anforderungen an die Dynamik
Anforderungen fr Ein- und Ausgnge
A. Anzeigeverhalten fr Sinus und Pulsfolgen
Ein Messgert gem CISPR 16-1-1 muss eine Sinusan-
zeigenauigkeit von +/-2 dB erfllen. Darber hinaus muss
je nach Detektor ein bestimmter relativer Anzeigewert
zu einem Sinussignal erreicht werden. Weiter mssen die
Bewertungskurven, welche eine nderung der Anzeige hin-
sichtlich der Pulswiederholrate fordert eingehalten werden.
Ein Beispiel fr die Bnder A,B,C und D ist in Abbildung 4
dargestellt. Die Abweichungen sind deutlich niedriger als
die zulssigen Toleranzen.
B. Anforderungen an die Dynamik
Fr alle Messgerte gelten die gleichen Anforderungen
hinsichtlich Dynamik. Fr den eingeschrnkten Einsatz
des Spektrumanalysators sind hierbei Erleichterungen
vorgesehen.
Bei Messempfngern und Messempfngern mit breiter
ZF wird die Dynamik durch den 1 dB Kompressionspunkt
des Systems bestimmt. Des weiteren wird fr Pulse die
Dynamik mageblich durch die Bandbreite der Vorselek-
tion bestimmt.
Bei Basisbandsystemen, wird die Dynamik fr Sinus-
signale mit dem Aussteuerbereich des ersten A/D Wandler
und die Dynamik fr Breitbandpulse durch den gesamten
Ausstuerbereich des Gleitkomma A/D Wandlersystems
bestimmt.
Im folgenden wollen wir die Anforderungen an die Dy-
namik zunchst allgemein und dann fr konkrete Beispiele
darstellen. Hierbei benutzen wir die Anforderungen des
Band C gem CISPR 16-1-1. blicherweise besitzen Mes-
sempfnger bei aktiviertem Vorstrker von 20 dB einen
Rauschboden von ca. -7 dBuV bei Bewertung mit dem Mit-
telwert Detektor. Fr den Quasispitzenwertdetektor ergibt
sich ein Rauschboden von 0 dBuV.
Die Referenz fr die Anzeige des Quasispitzenwertde-
tektors liegt bei 100 Hz. Hierbei muss der Anzeigewert
31.5 dB hher sein, als fr einen Einzelimpuls. Umgekehrt
bedeutet dies, dass der Einzelimpuls mit ausreichenden
Abstand ber dem Rauschboden liegen muss. Um eine
berhhung des Rauschens zu verhindern, sollte zumind-
est ein Signal- Rausch-Abstand von 10 dB vorhanden sein.
Ferner muss zustzlich ein Dynamikreserve in der Hhe der
ANFORDERUNGEN AN DIE PULSDYNAMIK
Messempfnger: Schmalbandig Breite ZF ZB-System
B
imp
1 GHz 1 GHz 1 GHz
B
pre
7 MHz 70 MHz 300MHz
D
ext
43.1 dB 23.1 dB 10.5dB
V
1dB
58 mV 590 mV 2.5 V
P
1dB
m
in
-14.6 dBm 5.4 dBm 18 dBm
P
1dB
m
in
o.V.
+4.6 dBm +25.4 dBm enfllt
Fig. 5. CISPR 16-1-1 Puls im Band B, Analoger Messempfnger
0 5 10 15 20 25 30
34
35
36
37
38
39
40
41
42
Frequency / MHz
L
e
v
e
l

/

d
B
V
Analogue EMIReceiver

CISPR 1611 40 dBuV
CISPR 1611 39 dBuV
CISPR 1611 38 dBuV
71
Schritte des Abschwchers vorgesehen werden. Damit ergibt
sich ohne die Dynamikreserve die Anforderung, dass der
Messempfnger mit aktiviertem Vorverstrker zumindest
Pulse mit einem Anzeigepegel von 41,5 dBuV im Band C
korrekt und 0 dB Abschwchung darstellen knnen muss.
Ein Pulsgenerator nach CISPR 16-1-1 welcher eine Anzeige
von 60 dBuV am Messempfnger bei 100 Hz erzeugt, hat
eine Impulsfche von 0,044 uVs, eine Pulsbreite von 300
ps und demzufolge eine Pulsspannung von 146 V.
Daraus ergibt sich fr die Anzeige von 41,5 dBuV
eine Pulsspannung von ca. 8.4 V. Ein komplett
breitbandiges Messgert ohne jegliche Vorselektion
msste daher einen 1 dB Kompressionpunkt von
28,5 dBm aufweisen.
Durch den Einsatz der Vorselektion wird diese
Anforderung verringert. Hierbei wird die Dynami-
kanforderung gem der Formel
(3) D
ext
= 20log
10
(
B
imp
B
pre
)
abgesenkt.
Im folgenden sind die Anforderungen f ur
einen traditionellen Messempfnger mit schmaler
Vorselektion, einem Messempfnger mit breiter ZF
und breiter Vorselektion sowie dem EMV Zeitbe-
reichsmesssystem (ZB-System) welches breitbandig
arbeitet fr das Band C dargestellt.
Die Anforderungen werden durch die Vorsele-
ktion bei schmalbandigen Messempfngern um
ca. 43 dB verringert, so dass sich am Eingang des
Vorverstrkers eine Anforderung an den 1 dB
Kompressionspunkt von -14.6 dBm bzw. 92.4 dBuV
ergibt. Am Mischer blicherweise 4.6 dBm. Dies
stellt keine greren Herausforderungen an das
Messgert dar. Die technische Herausforderung
besteht bei diesen Messgerten an die Realisierung
der Vorselektion.
Bei Messemfngern mit breiter Zwischenfre-
quenz ergeben sich deutlich hhere Anforderun-
gen, welche zum Teil von den Messgerten nicht
mehr vollstndig eingehalten werden knnen.
Derartige Messgerte knnen aber mit der Er-
leichterung um ca. 15 dB nach CISPR 16-1-1 2010
fr bestimmte Messungen eingesetzt werden. Messgerte,
welche in der Lage sind einen 1 dB Kompressionpunkt
von ca. 25 dBm bei ausgeschaltetem Verstrker bereit zu
stellen, knnen fr full Compliance Messungen eingesetzt
werden. Die Dynamik kann gegebenenfalls durch Verfahren
wie Noise Floor Extension oder gezielte bersteuerung
des Mischers und digitale Korrektur verbessert werden.
Allerdings knnen derartige Verfahren zu Unterschieden
Fig. 7. Anwendung von Noise Floor Extension
18 18.5 19 19.5 20 20.5 21 21.5 22
16
14
12
10
8
6
4
2
0
2
Frequency / MHz
L
e
v
e
l

/

d
B
V

Original
NFE
Fig. 6. Spektrogrammdarstellung einer Folge von Pulsen
Deutschland
72
bei realen Prfungen und damit zu Fehlmessungen fhren.
Bei breitbandigen Messgerten besteht die Herausfor-
derung darin, eine sehr hohe Dynamik mit Vorverstrker
von 18 dBm am Eingang zu erreichen. Diese Anforderung
wird durch einen Leistungsteiler und ein mehrkanaliges
A/D Wandlersystem erreicht. Dabei existieren hohe An-
forderungen an die Linearitt. Typischerweise haben diese
Messgerte einen Aussteuerbereich bis ca. 5 V. Damit besitzt
man noch Dynamikreserven von ca. 6 dB.
C. Anforderungen an die Dynamik fr Spektrumanalysatoren
Spektrumanalysatoren verfgen blicherweise ber
eine Vorselektion, welche nur zur Unterdrckung von
unerwnschten Mischprodukten verwendet wird. Im
Gegensatz zum Messempfnger ist diese nicht primr fr
die Erhhung der Dynamik entwickelt worden. Allerdings
haben hochwertige Spektrumanalysatoren einen hohen 1 dB
Kompressionspunkt von ca. 13 dBm. Die Norm CISPR 16-
1-1 Ed 2010 hat diesen Umstand bercksichtigt und erlaubt
die Verwendung fr Spektrumanalysatoren bei Prfingen,
deren Pulswiederholrate derart hoch ist, dass die Dynamik
des Spektrumanalysators ausreichend ist. Es drfen Pr-
finge mit einer Pulswiederholrate, welche grer als 20 Hz
ist gemessen werden. Gleichzeitig muss die Dynamik des
Spektrumanalyzers die Norm CISPR 16-1-1 fr Pulswie-
derholraten von mehr als 20 Hz einhalten. Dies entspricht
einer Erleichtung um ca. 23 dB. Spektrumanalysatoren mit
hoher Performance stellen hier ausreichend Dynamik zur
Verfgung. Es ist allerdings darauf zu achten, dass dies meist
nicht im Datenblatt vermerkt ist, und daher vom Anwender
selbst validiert werden muss.
VI. MESSUNGEN
A. Pulsdynamik bei klassichen Messempfngern
Messungen, welche die Grenzen der Pulsdynamik von
klassischen Messempfngern zeigen, wurden durchgefhrt.
Beispielsweise wurde ein klassicher Messempfnger im
Band B mit dem CISPR 16-1-1 Puls beaufschlagt. Der Pegel
wurde im Bereich 39 dBuV bis 41 dBuV variiert. In Abbil-
dung 5 ist das Messergebnis gezeigt.
Idealerweise ist das angzeigte Pulsspektrum fach und
alle Spektren sollten parallel in den Pegeln 38, 39 und
40 dBuV sein. Es zeigt sich allerdings, dass in den unter-
schiedlichen Frequenzbereichen der Vorselektion die Lin-
earitt und das Autorange des analogen Messempfngers
unterschiedliche verhlt. Im oberen Frequenzbereich ist der
1 dB Kompressionspunkt des Messempfngers geringer als
im mittleren Bereich, so dass dies zu einer Minderanzeige
fhrt. Ab 40 dBuV schaltet der Eingangsabschwcher auf
5 dB. Dadurch gert der obere Frequenzbereich aus der
Kompression und die Anzeige nhert sich dem tatschli-
chen Pegel deutlich an. Es wird deutlich, dass bei diesem
analogen Messempfnger die Toleranzen der CISPR 16-1-1
vollstndig genutzt werden.
NETWAVE: ThL PkU6kAMMALL
AC]0CPUwLk SUukCL
3 KvA T0 60 KvA
cur direct nk lc LM TLST s www.emtest.com
Iclwavc by LM TLST runs
wlh pcwcrfu LMC scflwarc:
netwave.control
lLC]LI 61000-/-13
lLC]LI 61000-/-1/
lLC]LI 61000-/-27
lLC]LI 61000-/-28
lLC]LI 61000-/-17
lLC]LI 61000-/-29
6crmanschcr Lcyd
Iclwavc fcr
Ccnsumcr Lcclrcncs
Iclwavc fcr
kcncwabc Lncrgy
Iclwavc fcr
lnduslra Ccmpcncnls
LM TLST prcvdcs dcvccs
fcr a ycur appcalcns
EMT_Anz_Item.indd 1 26.September.2012 13:45
Deutschland
72
bei realen Prfungen und damit zu Fehlmessungen fhren.
Bei breitbandigen Messgerten besteht die Herausfor-
derung darin, eine sehr hohe Dynamik mit Vorverstrker
von 18 dBm am Eingang zu erreichen. Diese Anforderung
wird durch einen Leistungsteiler und ein mehrkanaliges
A/D Wandlersystem erreicht. Dabei existieren hohe An-
forderungen an die Linearitt. Typischerweise haben diese
Messgerte einen Aussteuerbereich bis ca. 5 V. Damit besitzt
man noch Dynamikreserven von ca. 6 dB.
C. Anforderungen an die Dynamik fr Spektrumanalysatoren
Spektrumanalysatoren verfgen blicherweise ber
eine Vorselektion, welche nur zur Unterdrckung von
unerwnschten Mischprodukten verwendet wird. Im
Gegensatz zum Messempfnger ist diese nicht primr fr
die Erhhung der Dynamik entwickelt worden. Allerdings
haben hochwertige Spektrumanalysatoren einen hohen 1 dB
Kompressionspunkt von ca. 13 dBm. Die Norm CISPR 16-
1-1 Ed 2010 hat diesen Umstand bercksichtigt und erlaubt
die Verwendung fr Spektrumanalysatoren bei Prfingen,
deren Pulswiederholrate derart hoch ist, dass die Dynamik
des Spektrumanalysators ausreichend ist. Es drfen Pr-
finge mit einer Pulswiederholrate, welche grer als 20 Hz
ist gemessen werden. Gleichzeitig muss die Dynamik des
Spektrumanalyzers die Norm CISPR 16-1-1 fr Pulswie-
derholraten von mehr als 20 Hz einhalten. Dies entspricht
einer Erleichtung um ca. 23 dB. Spektrumanalysatoren mit
hoher Performance stellen hier ausreichend Dynamik zur
Verfgung. Es ist allerdings darauf zu achten, dass dies meist
nicht im Datenblatt vermerkt ist, und daher vom Anwender
selbst validiert werden muss.
VI. MESSUNGEN
A. Pulsdynamik bei klassichen Messempfngern
Messungen, welche die Grenzen der Pulsdynamik von
klassischen Messempfngern zeigen, wurden durchgefhrt.
Beispielsweise wurde ein klassicher Messempfnger im
Band B mit dem CISPR 16-1-1 Puls beaufschlagt. Der Pegel
wurde im Bereich 39 dBuV bis 41 dBuV variiert. In Abbil-
dung 5 ist das Messergebnis gezeigt.
Idealerweise ist das angzeigte Pulsspektrum fach und
alle Spektren sollten parallel in den Pegeln 38, 39 und
40 dBuV sein. Es zeigt sich allerdings, dass in den unter-
schiedlichen Frequenzbereichen der Vorselektion die Lin-
earitt und das Autorange des analogen Messempfngers
unterschiedliche verhlt. Im oberen Frequenzbereich ist der
1 dB Kompressionspunkt des Messempfngers geringer als
im mittleren Bereich, so dass dies zu einer Minderanzeige
fhrt. Ab 40 dBuV schaltet der Eingangsabschwcher auf
5 dB. Dadurch gert der obere Frequenzbereich aus der
Kompression und die Anzeige nhert sich dem tatschli-
chen Pegel deutlich an. Es wird deutlich, dass bei diesem
analogen Messempfnger die Toleranzen der CISPR 16-1-1
vollstndig genutzt werden.
NETWAVE: ThL PkU6kAMMALL
AC]0CPUwLk SUukCL
3 KvA T0 60 KvA
cur direct nk lc LM TLST s www.emtest.com
Iclwavc by LM TLST runs
wlh pcwcrfu LMC scflwarc:
netwave.control
lLC]LI 61000-/-13
lLC]LI 61000-/-1/
lLC]LI 61000-/-27
lLC]LI 61000-/-28
lLC]LI 61000-/-17
lLC]LI 61000-/-29
6crmanschcr Lcyd
Iclwavc fcr
Ccnsumcr Lcclrcncs
Iclwavc fcr
kcncwabc Lncrgy
Iclwavc fcr
lnduslra Ccmpcncnls
LM TLST prcvdcs dcvccs
fcr a ycur appcalcns
73
B. Dynamik des EMV Zeitbereic-hsmessystems
Zur Untersuchung wurde ein TDEMI verwendet. Hierbei
wurde eine Pulsfolge gem der Norm CISPR 16-1-1 auf das
Gert gegeben und das Echtzeitspektrogramm, bewertet
mit dem Spitzenwertdetektor, zur Anzeige gebracht. Das
Ergebnis der Messung ist in Abbildung 6 dargestellt.
Das Resultat ist dreidimensional als Spektrogramm dar-
gestellt. Es ist deutlich zu erkennen, dass jeder Puls korrekt
gemessen und zur Anzeige gebracht wird. Die Dynamik
betrgt mehr als 55 dB, wobei CISPR 16-1-1 nur 43,5 dB
verlangt. Die Anzeigegenauigkeit entspricht den Vorgaben
der CISPR 16-1-1.
C. Erweiterung des Dynamikbereichs durch Noise Floor
Extension
Noisefoor Extension (NFE) ist eine Methode, die es
erlaubt den Rauschboden abzusenken. Bei der Rausch-
bodenabsenkung wird vom Messergebnis das Rauschen
des Messger tes nach ZF-Filterung und Detektorbewer-
tung subtrahiert. Da Rauschen ein statistischer Prozess
ist, fhrt dies zu Einfssen auf die Pegelgenauigkeit in der
Nhe des Rauschbodens. Im folgende wurde eine NFE von
8 dB erzeugt.
In Abbildung 7 ist das Ergebnis des realen Spektrums
sowie des korrigierten Spektrums mit NFE dargestellt.
Fr das Sinussignal wird der Dynamikbereich um ca. 8 dB
verbessert. Allerdings ist auch deutlich zu erken-
nen, dass der Rauschboden eine deutlich hhere
Varianz aufweist. Diese Streuung fhrt zu Mes-
sunsicherheiten die bercksichtigt werden mssen.
VII. ZUSAMMENFASSUNG
In diesem Artikel wurden die Anforderungen
hinsichtlich analoger Messempfnger, Messemp-
fnger mit breiter ZF sowie FFT-basierende Mes-
sempfnger gem der Norm CISPR 16-1-1 diskuti-
ert. Es wurde gezeigt, dass analoge Messempfnger
gengend Dynamik fr Emissionsmessungen zur
Verfgung stellen. Effekte welche durch Kom-
pression des Mischers und Autorange entstehen
wurden diskutiert. Des weiteren wurden Vor- und
Nachteile des Verfahren Noise Floor Extension dis-
kutiert. Die Anforderungen hinsichtlich Dynamik
wurden fr Messempfnger mit breitbandiger ZF
diskutiert. Diese stellen eine hohe Herausforderung
an den 1 dB Kompressionspunkt dar, die blich-
erweise nicht erreicht wird. Derartige Messgerte
knnen allerdings verwendet werden, wenn man
die Erleichterungen von ca. 20 dB fr den Einsatz
als Spektrumanalysator ansetzt. Darber hinaus
existieren breitbandige Messsysteme mit mehr-
stufgen A/D Wandlern und Vorselektion welche
die Dynamikanforderungen der CISPR 16-1-1
einhalten.
REFERENCES
[1] S. Braun and P. Russer, A Low-Noise Multiresolution
High-Dynamic Ultra-Broad-Band Time-Domain EMI
Measurement System, IEEE Transactions on Micro-
wave Theory and Techniques, vol. 53, pp. 3354 3363,
Nov 2005.
[2] S. Braun, M. Al-Qedra, and P. Russer, A novel realtime time-
domain emi measurement system based on field programmable gate
arrays, in 17th International Zurich Symposium on Electromag-
netic Compatibility, Digest, (Singapore), pp. 501504, Feb. 2006.
[3] S. Braun, F. Krug, and P. Russer, A novel automatic digital
quasi-peak detector for a time domain measurement system, in
2004 IEEE International Symposium On Electromagnetic Compat-
ibility Digest, August 914, Santa Clara, USA, vol. 3, pp. 919924,
Aug. 2004.
[4] A. V. Oppenheim and R. W. Schafer, DiscreteTime Signal
Processing. ISBN 0-13-214107-8, Prentice-Hall, 1999.
[5] F. J. Harris, On the Use of Windows for Harmonic Analysis
with the Discrete Fourier Transform, in Proceeding of the IEEE,
vol. 66, no. 1, pp. 5183, 1978.
[6] J. Allen and L. Rabiner, A unified approach to short-time
Fourier analysis and synthesis, in Proceedings of the IEEE, vol.
65, pp. 15581564, 1977.
[7] C. Hoffmann, S. Braun, and P. Russer, A Broadband Time-
Domain EMI Measurement System up to 18 GHz, in In EMC
Europe 2010, Breslau, Polen, September 2010, September 2010.
[8] CISPR16-1-1 Ed. 3, Specification for radio disturbance and im-
munity measuring apparatus and methods Part 1-1: Radio distur-
bance and immunity measuring apparatus Measuring apparatus.
International Electrotechnical Commission, 2010
LARS GLSER
Hardware-Entwickler von EMV - Ma
Langer
PHYSIKALISCHE PROBLEME BEI DER
STRFESTIGKEITSANALYSE EINER ELEKTRONIK
LSUNGSANSATZ
EINLEITUNG:
F
EHLERSUCHE IN modernen Schaltungen erweist
sich heutzutage als zunehmend schwierig. Neben
der gestiegenen Komplexitt (und damit stark
erhhter Anzahl mglicher Fehlerquellen) stellen
die geringeren mechanischen Abmessungen den
Entwickler vor immer grere Schwierigkeiten,
gerade wenn es um die Eingrenzung der Fehler
geht. Dazu ein Beispiel aus unserer Messpraxis:
AUFGABENSTELLUNG:
Gegenstand der Untersuchung war das Bedienteil eines
neuen Strgenerators zur Strfestigkeitsuntersuchung.
Neben einem LCD Display (+ Controller) enthlt die
Leiterkarte einen C (142 Pin TQFP), einen FPGA (100 Pin
TQFP), Schnittstellenbausteine, passive Bauelemente (u.a.
SMD 0603) sowie diverse Bedienelemente (Impulsdrehge-
ber, Taster, Schalter). Zustzlich benden sich USB Buchsen,
Anschlsse fr die spter erzeugte Generatorspannung
sowie die Eingnge fr die Stromversorgung auf dem Board.
Aus Kostengrnden wurde die Leiterkarte im 2-Lagen Sys-
tem mit 200m Strukturgren ausgefhrt. Es gibt keinen
durchgehenden GND-Layer. Die Busse / Leitungen sind auf
beiden Ebenen verlegt. Die rumliche Nhe des Bedienteils
zum Generatorteil ergibt dabei hohe Anforderungen an die
Strfestigkeit.
Beim ersten ESD - Test nach DIN EN 61000-4-2 kam es
zu Fehlfunktionen. Nach Einkopplung von Strimpulsen
(Kontaktentladung) in das GND System der Platine strzte
der Mikrocontroller ab, was sich durch den Ausfall des
Heartbeat Signals sowie dem Einfrieren des Displays
bemerkbar machte. Diese Strung trat je nach Position
der ESD Pistole (Einkoppelpunkt und Stellwinkel) bei
unterschiedlichen Spannungen auf (2,4 kV 4 kV). Die
Strschwelle war deutlich zu erhhen.
74
Punktgenaue
Puls-Strfestigkeits-Analyse
Deutschland
Langer_GER_EEG13.indd 6 11/16/12 4:08 PM
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LARS GLSER
Hardware-Entwickler von EMV - Ma
Langer
PHYSIKALISCHE PROBLEME BEI DER
STRFESTIGKEITSANALYSE EINER ELEKTRONIK
LSUNGSANSATZ
EINLEITUNG:
F
EHLERSUCHE IN modernen Schaltungen erweist
sich heutzutage als zunehmend schwierig. Neben
der gestiegenen Komplexitt (und damit stark
erhhter Anzahl mglicher Fehlerquellen) stellen
die geringeren mechanischen Abmessungen den
Entwickler vor immer grere Schwierigkeiten,
gerade wenn es um die Eingrenzung der Fehler
geht. Dazu ein Beispiel aus unserer Messpraxis:
AUFGABENSTELLUNG:
Gegenstand der Untersuchung war das Bedienteil eines
neuen Strgenerators zur Strfestigkeitsuntersuchung.
Neben einem LCD Display (+ Controller) enthlt die
Leiterkarte einen C (142 Pin TQFP), einen FPGA (100 Pin
TQFP), Schnittstellenbausteine, passive Bauelemente (u.a.
SMD 0603) sowie diverse Bedienelemente (Impulsdrehge-
ber, Taster, Schalter). Zustzlich benden sich USB Buchsen,
Anschlsse fr die spter erzeugte Generatorspannung
sowie die Eingnge fr die Stromversorgung auf dem Board.
Aus Kostengrnden wurde die Leiterkarte im 2-Lagen Sys-
tem mit 200m Strukturgren ausgefhrt. Es gibt keinen
durchgehenden GND-Layer. Die Busse / Leitungen sind auf
beiden Ebenen verlegt. Die rumliche Nhe des Bedienteils
zum Generatorteil ergibt dabei hohe Anforderungen an die
Strfestigkeit.
Beim ersten ESD - Test nach DIN EN 61000-4-2 kam es
zu Fehlfunktionen. Nach Einkopplung von Strimpulsen
(Kontaktentladung) in das GND System der Platine strzte
der Mikrocontroller ab, was sich durch den Ausfall des
Heartbeat Signals sowie dem Einfrieren des Displays
bemerkbar machte. Diese Strung trat je nach Position
der ESD Pistole (Einkoppelpunkt und Stellwinkel) bei
unterschiedlichen Spannungen auf (2,4 kV 4 kV). Die
Strschwelle war deutlich zu erhhen.
74
Punktgenaue
Puls-Strfestigkeits-Analyse
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76
Koppelmechanismus:
Wie bereits in [1] gezeigt treten zwei mgliche Koppel-
mechanismen der Strgren in kritischen Bereichen der
Schaltung auf: Magnetische Einkopplung und elektrische
Einkopplung.
Beim Einkoppeln mit der ESD Pistole in die Baugruppe
muss diese unterscheiden:
Bei der magnetischen Einkopplung fieen Strstrme
durch das Board und erzeugen dabei Magnetfelder. Diese
knnen in Leiterschleifen Spannungen induzieren. Dies kann
nun auf zwei Wegen zu Problemen fhren: Einerseits kann die
induzierte Spannung vom Schaltkreiseingang als logisches
Signal behandelt werden oder sie treibt einen Strstrom,
welcher Probleme in anderen Schaltungsteilen hervorruft.
Hinzu kommen Strungen durch elektrische Einkop-
plung. Dabei koppeln elektrische Felder kapazitiv in die
Leitungsnetze oder auch Bauelemente des Boards ein. Der
dabei entstehende Verschiebestrom kann das System wieder
auf zwei Wegen beeinfussen: Zum einen fhrt der Ver-
schiebestrom an einem Widerstand (gegen Vss oder Vdd) zu
einem Spannungsabfall, welcher wieder als logisches Signal
erkannt wird oder er induziert Spannungen in anderen
Schaltungsteilen, hnlich der magnetischen Einkopplung.
Fr die genauere Eingrenzung empfndlicher Baugrup-
penteile ist es erforderlich, gezielt einzelne Leitungen (z.B.
in Bussystemen) bzw. deren Vias oder einzelne IC Pins
mit Strgren zu beaufschlagen. Aufgrund der bereits
erwhnten hohen Integration von Schaltungen und Struk-
turgren im m Bereich wachsen die Anforderungen an
die mechanische Aufsung einer Strquelle.
Da die Fehlfunktion und Strschwelle nun bekannt
waren, musste ein geeigneter Weg gefunden werden, die
Strfestigkeit zu erhhen.
Durch den Normtest konnte der Fehler auf den Control-
ler eingekreist werden. Welche(r) Pin(s) fr den Absturz
verantwortlich war(en) musste noch ermittelt werden. Dies
Bild 1: Wirkung elektrischer und magnetischer Felder auf den IC
Bild 2: Prfanordnung Pulser + IC
Deutschland Gl ser
77
ist in diesem Fall aber notwendig, da die entsprechenden
Gegenmanahmen (Verblockung der IC-Pins, Vergraben
der empfndlichen Leitungen) sonst nicht efektiv durch-
fhrbar gewesen wren.
Um nun die empfndlichen Leitungen / IC-Pins zu ermit-
teln, muss jeder Pin einzeln mit einer ESD hnlichen Str-
gre beaufschlagt werden. Der erneute Einsatz der
ESD Pistole schied aus mehreren Grnden aus:
- Die Impulse sind zu stark fr einzelne IC-Pins
der Schaltkreis kann leicht zerstrt werden.
- Die Feldemission der ESD-Pistole kann an-
dere Schaltungsteile beeinfussen und eine gezielte
Fehlersuche dadurch erheblich erschweren.
- Durch die mechanischen Abmessungen ist
es nahezu unmglich, einen einzelnen IC-Pin zu
kontaktieren, ohne mit den Nachbarpins einen
Kurzschluss zu erzeugen.
- Aufgrund der Leitungsdichte ist das GND-Sys-
tem um den Schaltkreis nur schlecht zugnglich,
was das Anschlieen des Bezugsleiters erschwert.
Lsungsansatz:
Zur lokalen Einkopplung von Strgren
werden hufg E- bzw. B-Feldquellen verwendet.
Deren Selektivitt war jedoch im vorliegenden
Fall nicht ausreichend. Eine weitere Verkleinerung
der Feldquellen erscheint jedoch nicht sinnvoll:
Die Koppelkapazitt zwischen der Elektrode der
E Feldquelle und der entsprechenden Leiterplat-
tenstruktur / Bauteilgehuse wrde entscheidend
verkleinert, so dass der resultierende Strimpuls
nicht ausreicht, um den bereits beobachteten Fehler
zu reproduzieren.
Um dieses Problem zu umgehen wurde ein neuer
Strgenerator entwickelt. Dieser erzeugt steil-
fankige Strimpulse (1,2 kV / 1,8 ns Anstiegszeit),
welche ber eine interne Kapazitt (10 pF) in den
Prfing eingekoppelt werden knnen. Polaritt und
Intensitt sind verstellbar. Zur Kontaktierung wird
eine austauschbare Nadelelektrode verwendet.
Dieses PrinziP bringt mehrere
VorteiLe mit sich:
- Die Koppelkapazitt zwischen der zu beaufschlagenden
Struktur und der Feldquelle ist immer gleich (nicht mehr
abhngig von Abstand).
- Es lassen sich einzelne Pins an hochintegrierten Schalt-
Bild 3: Pulsform der Feldquelle an 50 Bild 4: Einkopplung in IC
Deutschland
76
Koppelmechanismus:
Wie bereits in [1] gezeigt treten zwei mgliche Koppel-
mechanismen der Strgren in kritischen Bereichen der
Schaltung auf: Magnetische Einkopplung und elektrische
Einkopplung.
Beim Einkoppeln mit der ESD Pistole in die Baugruppe
muss diese unterscheiden:
Bei der magnetischen Einkopplung fieen Strstrme
durch das Board und erzeugen dabei Magnetfelder. Diese
knnen in Leiterschleifen Spannungen induzieren. Dies kann
nun auf zwei Wegen zu Problemen fhren: Einerseits kann die
induzierte Spannung vom Schaltkreiseingang als logisches
Signal behandelt werden oder sie treibt einen Strstrom,
welcher Probleme in anderen Schaltungsteilen hervorruft.
Hinzu kommen Strungen durch elektrische Einkop-
plung. Dabei koppeln elektrische Felder kapazitiv in die
Leitungsnetze oder auch Bauelemente des Boards ein. Der
dabei entstehende Verschiebestrom kann das System wieder
auf zwei Wegen beeinfussen: Zum einen fhrt der Ver-
schiebestrom an einem Widerstand (gegen Vss oder Vdd) zu
einem Spannungsabfall, welcher wieder als logisches Signal
erkannt wird oder er induziert Spannungen in anderen
Schaltungsteilen, hnlich der magnetischen Einkopplung.
Fr die genauere Eingrenzung empfndlicher Baugrup-
penteile ist es erforderlich, gezielt einzelne Leitungen (z.B.
in Bussystemen) bzw. deren Vias oder einzelne IC Pins
mit Strgren zu beaufschlagen. Aufgrund der bereits
erwhnten hohen Integration von Schaltungen und Struk-
turgren im m Bereich wachsen die Anforderungen an
die mechanische Aufsung einer Strquelle.
Da die Fehlfunktion und Strschwelle nun bekannt
waren, musste ein geeigneter Weg gefunden werden, die
Strfestigkeit zu erhhen.
Durch den Normtest konnte der Fehler auf den Control-
ler eingekreist werden. Welche(r) Pin(s) fr den Absturz
verantwortlich war(en) musste noch ermittelt werden. Dies
Bild 1: Wirkung elektrischer und magnetischer Felder auf den IC
Bild 2: Prfanordnung Pulser + IC
Deutschland Gl ser
77
ist in diesem Fall aber notwendig, da die entsprechenden
Gegenmanahmen (Verblockung der IC-Pins, Vergraben
der empfndlichen Leitungen) sonst nicht efektiv durch-
fhrbar gewesen wren.
Um nun die empfndlichen Leitungen / IC-Pins zu ermit-
teln, muss jeder Pin einzeln mit einer ESD hnlichen Str-
gre beaufschlagt werden. Der erneute Einsatz der
ESD Pistole schied aus mehreren Grnden aus:
- Die Impulse sind zu stark fr einzelne IC-Pins
der Schaltkreis kann leicht zerstrt werden.
- Die Feldemission der ESD-Pistole kann an-
dere Schaltungsteile beeinfussen und eine gezielte
Fehlersuche dadurch erheblich erschweren.
- Durch die mechanischen Abmessungen ist
es nahezu unmglich, einen einzelnen IC-Pin zu
kontaktieren, ohne mit den Nachbarpins einen
Kurzschluss zu erzeugen.
- Aufgrund der Leitungsdichte ist das GND-Sys-
tem um den Schaltkreis nur schlecht zugnglich,
was das Anschlieen des Bezugsleiters erschwert.
Lsungsansatz:
Zur lokalen Einkopplung von Strgren
werden hufg E- bzw. B-Feldquellen verwendet.
Deren Selektivitt war jedoch im vorliegenden
Fall nicht ausreichend. Eine weitere Verkleinerung
der Feldquellen erscheint jedoch nicht sinnvoll:
Die Koppelkapazitt zwischen der Elektrode der
E Feldquelle und der entsprechenden Leiterplat-
tenstruktur / Bauteilgehuse wrde entscheidend
verkleinert, so dass der resultierende Strimpuls
nicht ausreicht, um den bereits beobachteten Fehler
zu reproduzieren.
Um dieses Problem zu umgehen wurde ein neuer
Strgenerator entwickelt. Dieser erzeugt steil-
fankige Strimpulse (1,2 kV / 1,8 ns Anstiegszeit),
welche ber eine interne Kapazitt (10 pF) in den
Prfing eingekoppelt werden knnen. Polaritt und
Intensitt sind verstellbar. Zur Kontaktierung wird
eine austauschbare Nadelelektrode verwendet.
Dieses PrinziP bringt mehrere
VorteiLe mit sich:
- Die Koppelkapazitt zwischen der zu beaufschlagenden
Struktur und der Feldquelle ist immer gleich (nicht mehr
abhngig von Abstand).
- Es lassen sich einzelne Pins an hochintegrierten Schalt-
Bild 3: Pulsform der Feldquelle an 50 Bild 4: Einkopplung in IC
Deutschland
78
kreisgehusen (TQFP) einzeln kontaktieren.
- Die Koppelkapazitt gegenber einer kleinen Struktur
wird vergrert.
- Es ist mglich Schaltkreise in der Applikation zu testen.
Da in unmittelbarer Nhe der zu testenden Signale
einer realen Baugruppe keine ausreichend kurze Massev-
erbindung mit dem Pulsgenerators mglich ist, wurde der
Generator so ausgelegt, dass eine kapazitive Kopplung zum
Prfing gengt.
Die Impulsform der Feldquelle wurde zunchst in einem
50 System und mit einem 1 GHz Oszilloskop untersucht,
um sicher zu stellen, dass die von der Pulsspannungsquelle er-
zeugte Strgre ausreichend ist, um Systeme zu beeinfussen.
Die Messung zeigte, dass trotz kapazitivem Stromrckweg
der produzierte Impulse mit 8 V stark genug ist, um Strun-
gen am IC hervorzurufen (Amplitude und Kurvenform rich-
ten sich nach dem Messaufbau, z.B. wird in einen hochohmi-
gen Eingang oder auf einen Treiberausgang eingekoppelt).
Mit dieser Messanordnung wurden nun alle IC Pins
einzeln mit einem Strimpuls beaufschlagt. Dabei wurde
zuerst die niedrigste Pulsintensitt bei positiver Polaritt
gewhlt. Beim ersten Abprfen konnte keine Fehlfunk-
tion festgestellt werden. Nach schrittweiser Erhhung der
Intensitt stellte sich das gleiche Fehlerbild wie bei dem
Normtest mit der ESD Pistole ein. Bei der Einkopplung
in zwei der 20 Leitungen, welche zum Bedienteil fhren,
konnte der Controller zum Absturz gebracht werden. Als
mgliche Gegenmanahmen kamen zunchst nur zwei
Modifkationen in Frage: der Einbau von Abblockkondensa-
toren gegen Masse und der Einbau von Chipinduktivitten/
Widerstnden in die Leitungen zwischen Bedienteil und
Controller. Nach Einbau von 2x10 pF 0402 Kondensatoren
wurden alle Pins erneut mit dem P23 beaufschlagt. Die
Strung trat nun nicht mehr auf.
Anschlieend wurde erneut ein Normtest mit ESD Pis-
tole durchgefhrt. Wie sich zeigte standen die bei beiden
Tests hervorgerufenen Fehler in Zusammenhang. Die
Strschwelle wurde auf 4,8 kV angehoben.
Fazit:
Durch die lokale Einkopplung in einzelne Leitungen
oder IC Pins ist es mglich, die bei der Strfestigkeitspr-
fung eines Gertes auftretenden Strgren nachzubilden
und besonders empfndliche Schaltungsteile (IC-Pins /
Leitungen) zu ermitteln. Die Ursachensuche wird damit
erheblich erleichtert und erlaubt es, Fehlern schneller auf
den Grund zu gehen.
Quellen:
[1] Neue Aspekte zur ESD-Strfestigkeit Elektronik, 05/2009,
Autor: Gunter Langer
[2] Neue Burst-Generatoren zur Prfung der Strfestigkeit von
integrierten Schaltungen.
Deutschland
78
kreisgehusen (TQFP) einzeln kontaktieren.
- Die Koppelkapazitt gegenber einer kleinen Struktur
wird vergrert.
- Es ist mglich Schaltkreise in der Applikation zu testen.
Da in unmittelbarer Nhe der zu testenden Signale
einer realen Baugruppe keine ausreichend kurze Massev-
erbindung mit dem Pulsgenerators mglich ist, wurde der
Generator so ausgelegt, dass eine kapazitive Kopplung zum
Prfing gengt.
Die Impulsform der Feldquelle wurde zunchst in einem
50 System und mit einem 1 GHz Oszilloskop untersucht,
um sicher zu stellen, dass die von der Pulsspannungsquelle er-
zeugte Strgre ausreichend ist, um Systeme zu beeinfussen.
Die Messung zeigte, dass trotz kapazitivem Stromrckweg
der produzierte Impulse mit 8 V stark genug ist, um Strun-
gen am IC hervorzurufen (Amplitude und Kurvenform rich-
ten sich nach dem Messaufbau, z.B. wird in einen hochohmi-
gen Eingang oder auf einen Treiberausgang eingekoppelt).
Mit dieser Messanordnung wurden nun alle IC Pins
einzeln mit einem Strimpuls beaufschlagt. Dabei wurde
zuerst die niedrigste Pulsintensitt bei positiver Polaritt
gewhlt. Beim ersten Abprfen konnte keine Fehlfunk-
tion festgestellt werden. Nach schrittweiser Erhhung der
Intensitt stellte sich das gleiche Fehlerbild wie bei dem
Normtest mit der ESD Pistole ein. Bei der Einkopplung
in zwei der 20 Leitungen, welche zum Bedienteil fhren,
konnte der Controller zum Absturz gebracht werden. Als
mgliche Gegenmanahmen kamen zunchst nur zwei
Modifkationen in Frage: der Einbau von Abblockkondensa-
toren gegen Masse und der Einbau von Chipinduktivitten/
Widerstnden in die Leitungen zwischen Bedienteil und
Controller. Nach Einbau von 2x10 pF 0402 Kondensatoren
wurden alle Pins erneut mit dem P23 beaufschlagt. Die
Strung trat nun nicht mehr auf.
Anschlieend wurde erneut ein Normtest mit ESD Pis-
tole durchgefhrt. Wie sich zeigte standen die bei beiden
Tests hervorgerufenen Fehler in Zusammenhang. Die
Strschwelle wurde auf 4,8 kV angehoben.
Fazit:
Durch die lokale Einkopplung in einzelne Leitungen
oder IC Pins ist es mglich, die bei der Strfestigkeitspr-
fung eines Gertes auftretenden Strgren nachzubilden
und besonders empfndliche Schaltungsteile (IC-Pins /
Leitungen) zu ermitteln. Die Ursachensuche wird damit
erheblich erleichtert und erlaubt es, Fehlern schneller auf
den Grund zu gehen.
Quellen:
[1] Neue Aspekte zur ESD-Strfestigkeit Elektronik, 05/2009,
Autor: Gunter Langer
[2] Neue Burst-Generatoren zur Prfung der Strfestigkeit von
integrierten Schaltungen.
SIX DAYS THREE CONFERENCES ONE EXHIBITION
EuropEan MicrowavE wEEk 2013
nrnbErg ncc, gErMany,
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EuropEs prEMiEr MicrowavE,
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NCC NUREMBERG, GERMANY
The 43rd European Microwave Conference
Organised by: Offcial Publication: Co-sponsored by:
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The European Microwave Exhibition (810 Oct) will see:
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Inexcessof250exhibitors
Running alongside the exhibition are 3 separate,
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Conference(EuMIC)
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Plus a one day Defence and Security Conference
interested in exhibiting?
call +44(0) 20 7596 8742 or visit www.eumweek.com
2013_exhibit_ad_MWJ.indd 1 11/09/2012 09:37
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ADs_EEG13.indd 24 11/16/12 2:47 PM
81
F
R
A
N
C
E
81
Contents | France
An d r - Mar i e Amp r e, p h y s i c i e n e t
mathmaticien franais, est lun des fondateurs
de la science de llectromagntisme classique.
Il donne son nom lampre, lunit SI de mesure
du courant lectrique.
L a t hor i e mat hmat i que et physi que
dveloppe par Ampre tente de comprendre
la relation entre llectricit et le magntisme.
Ampre dmontre que deux conducteurs parallles
parcourus par des courants lectriques sattirent
ou se repoussent en fonction de la direction, identique ou oppose, du ux des courants.
La loi dAmpre stipule que laction mutuelle de deux conducteurs lectrifis est
proportionnelle leurs longueurs et aux intensits de leurs courants. Il applique galement
ce mme principe au magntisme. Nous devons Ampre lide nouvelle de la relation
lectromagntique.
En reconnaissance de sa contribution la cration dune science lectrique moderne,
lampre est tabli comme unit de base de la mesure lectrique en 1881.
Andr-Marie
Ampre (17751836)
PRODUITS ET SERVICES
RESSOURCES
ARTICLES
Couplages Entre Antennes Dans un
Aronef Par la Mthode Directe ACA
82
84
86
FR_TOC_EEG13.indd 81 11/16/12 4:13 PM
ADs_EEG13.indd 24 11/16/12 2:47 PM
81
F
R
A
N
C
E
81
Contents | France
An d r - Mar i e Amp r e, p h y s i c i e n e t
mathmaticien franais, est lun des fondateurs
de la science de llectromagntisme classique.
Il donne son nom lampre, lunit SI de mesure
du courant lectrique.
L a t hor i e mat hmat i que et physi que
dveloppe par Ampre tente de comprendre
la relation entre llectricit et le magntisme.
Ampre dmontre que deux conducteurs parallles
parcourus par des courants lectriques sattirent
ou se repoussent en fonction de la direction, identique ou oppose, du ux des courants.
La loi dAmpre stipule que laction mutuelle de deux conducteurs lectrifis est
proportionnelle leurs longueurs et aux intensits de leurs courants. Il applique galement
ce mme principe au magntisme. Nous devons Ampre lide nouvelle de la relation
lectromagntique.
En reconnaissance de sa contribution la cration dune science lectrique moderne,
lampre est tabli comme unit de base de la mesure lectrique en 1881.
Andr-Marie
Ampre (17751836)
RESSOURCES
ARTICLES
82
84
86
FR_TOC_EEG13.indd 81 11/16/12 4:13 PM
82
France | Products & Services
A
A.H. Systems Inc.
AR France, 7 Rue des Fosses Blanc Bat D1,
F-92230, Gennevilliers, France;
+011 33 1 47 91 75 30; Fax: 011 33 1 47 91 75 35;
contact@arfrance.eu; www.AHSystems.com
Produits et services: Antennes, Instrument de
contrle, Contrles
AA Opto-Electronic
AA MCS, 18, rue Nicolas Appert, F-91898,
Orsay Cedex, France,
+33 01 76 91 5012 Fax +33 01 76 91 5031;
sales@aa-mcs.com;www.aa-mcs.com
Produits et services: Micro-ondes, amplifcateurs de
puissance, coupleurs large bande, diviseurs, fltres
Aaronia AG
Kauthenbergstr. 14, Strickscheid,
DE-54597 Germany;
Fax:+49(0)6556-93034; +49(0)6556-93033;
Vanessa Bauer, VB@aaronia.de;
Thorsten Chmielus, owner, TC@aaronia.de;
Manuel Pinten, Materials contact, mp@aaronia.de;
www.aaronia.de
Produits et services: Antennes, Protection, Instru-
ment de contrle
Apache Design Solutions
La Grande Arche, Paroi Nord, Paris La Defense,
92044, France;
+33(0)1 43 25 92 45 Fax: +33(0)1 40 84 57 21 41;
Jose Gandlarz; jose@apache-da.com;
www.apache-da.com
Produits et Services: Miscellaneous
AR France
7 rue du Fosse Blanc, Bat D1, Gennevilliers,
France 92230;
+33(0)1 47 91 75 30; Fax: +33(0)1 47 91 75 35;
Bernard Bessot; contact@arfrance.eu;
www.arfrance.eu
Produits et services: Amplificateurs, Antennes,
Cbles et connexions, Espaces sous protection et
cltures,Hausse et lments temporaires, Instrument
de contrle
Arrow Europe
13-15 rue de pont des Halles Rungis 94656;
+33 01 4978 4949;
www.arroweurope.com
Produits et services: Ferrites, cbles et connecteurs,
applications de puissance
C
United Kingdom;
+44-7817-731-000;
www.CarlisleIT.com
Produits et services: Filtres
E
EM Test France
Le Trident - Parc des Collines, 36, Rue Paul Czanne,
68200 Mulhouse, France;
+33(0)3 89 31 23 50; Fax: +33(0)3 89 31 23 55;
info@emtest.fr;
www.emtest.fr
Products and Services: Hausse et lments tempo-
raires, Instrument de contrle, Contrles
EMC Partner France
Mr Pascal POIRET, 6 rue Clment VI ;
19300 Rosiers dEgletons France;
+33 (0)5 55 74 31 68 ; Fax. : +33 (0)5 55 87 47 69;
contact@emc-partner.fr; www.emc-partner.fr
Produits et services: Gnrateurs et solutions
CEM & RF
EMI TECH
3, rue des Coudriers - CAP 78, ZA de lObservatoire,
78180 Montigny le Bretonneux France;
+33(0)1 30 57 55 55; Fax: +33(0)1 30 57 8640;
Jean Luc Tisserand, jl.tisserand@emitech.fr;
www.emitech.fr
Produits et services: Contrles
Eurofarad
93, rue Oberkampf, F-75540 PARIS Cedex 11, France;
+33(0)1 49 23 10 00; Fax: +33(0)1 43 57 05 33;
info@eurofarad.com; www.eurofarad.com
EuroMC
12/24 Avenue de Stalingrad Stains, ZA St, Leger,
93240, France;
+33 1 58 34 00 00; Fax. +33 1 58 34 07 07;
EuroMC@wanadoo.fr; www.euromc.fr
Produits et services: Filtres, Protection, Espaces sous
protection et cltures
ETS-Lindgren
Z.A. Saint Lger - Batiment; 12-24 Avenue Stalingrad,
93240 Stains;
+33 1 49 40 19 30; Fax:+33 1 49 40 19 31;
france@ets-lindgren.com;
www.ets-lindgren.com
Produits et services: Antennes, ferrites, filtres,
chambres blindes et botiers, Gnrateurs de signaux
RFI / EMI, instrumentation de test, Divers
PRODUITS ET
SERVICES
France | Produits Et Services
FRA_PS_R_EEG12.indd 82 11/16/12 4:14 PM
Concepteurs et fabricants damplificateurs
radiofrquences et hyperfrquences de forte puissance
MILMEGA Limited Park Road, Ryde, Isle of Wight, PO33 2BE United Kingdom
Tel. +44 (0) 1983 618004 Fax. +44 (0) 1983 811521 sales@milmega.co.uk www.milmega.co.uk

MILMEGA
La diffrence entre lordinaire
et lextraordinaire
La nouvelle srie damplificateurs de 80 1 000 MHz de MILMEGA est limage
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des standards que nos concurrents souhaitent imiter.
Nous promettons seulement ce que nous pouvons livrer
puis livrons plus que ce nous avons promis.
Le meilleur dans sa catgorie pour une
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Des sous ensembles amovibles
amliorent lutilisation du produit
Garantie 5 ans tous frais compris
Compacit exceptionnelle
(la moiti de la taille de nos concurrents)
Architecture modulaire, permettant une
mise niveau
Extra210x297ITEMFrance_Layout 1 04/09/2012 16:37 Page 1
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82
France | Products & Services
A
A.H. Systems Inc.
AR France, 7 Rue des Fosses Blanc Bat D1,
F-92230, Gennevilliers, France;
+011 33 1 47 91 75 30; Fax: 011 33 1 47 91 75 35;
contact@arfrance.eu; www.AHSystems.com
contrle, Contrles
AA Opto-Electronic
AA MCS, 18, rue Nicolas Appert, F-91898,
Orsay Cedex, France,
+33 01 76 91 5012 Fax +33 01 76 91 5031;
sales@aa-mcs.com;www.aa-mcs.com
Produits et services: Micro-ondes, amplifcateurs de
puissance, coupleurs large bande, diviseurs, fltres
Aaronia AG
Kauthenbergstr. 14, Strickscheid,
DE-54597 Germany;
Fax:+49(0)6556-93034; +49(0)6556-93033;
Vanessa Bauer, VB@aaronia.de;
Thorsten Chmielus, owner, TC@aaronia.de;
Manuel Pinten, Materials contact, mp@aaronia.de;
www.aaronia.de
Produits et services: Antennes, Protection, Instru-
ment de contrle
Apache Design Solutions
La Grande Arche, Paroi Nord, Paris La Defense,
92044, France;
+33(0)1 43 25 92 45 Fax: +33(0)1 40 84 57 21 41;
Jose Gandlarz; jose@apache-da.com;
www.apache-da.com
Produits et Services: Miscellaneous
AR France
7 rue du Fosse Blanc, Bat D1, Gennevilliers,
France 92230;
+33(0)1 47 91 75 30; Fax: +33(0)1 47 91 75 35;
Bernard Bessot; contact@arfrance.eu;
www.arfrance.eu
cltures,Hausse et lments temporaires, Instrument
de contrle
Arrow Europe
13-15 rue de pont des Halles Rungis 94656;
+33 01 4978 4949;
www.arroweurope.com
Produits et services: Ferrites, cbles et connecteurs,
applications de puissance
C
United Kingdom;
+44-7817-731-000;
www.CarlisleIT.com
E
EM Test France
Le Trident - Parc des Collines, 36, Rue Paul Czanne,
68200 Mulhouse, France;
+33(0)3 89 31 23 50; Fax: +33(0)3 89 31 23 55;
info@emtest.fr;
www.emtest.fr
Products and Services: Hausse et lments tempo-
raires, Instrument de contrle, Contrles
EMC Partner France
Mr Pascal POIRET, 6 rue Clment VI ;
19300 Rosiers dEgletons France;
+33 (0)5 55 74 31 68 ; Fax. : +33 (0)5 55 87 47 69;
contact@emc-partner.fr; www.emc-partner.fr
Produits et services: Gnrateurs et solutions
CEM & RF
EMI TECH
3, rue des Coudriers - CAP 78, ZA de lObservatoire,
78180 Montigny le Bretonneux France;
+33(0)1 30 57 55 55; Fax: +33(0)1 30 57 8640;
Jean Luc Tisserand, jl.tisserand@emitech.fr;
www.emitech.fr
Eurofarad
93, rue Oberkampf, F-75540 PARIS Cedex 11, France;
+33(0)1 49 23 10 00; Fax: +33(0)1 43 57 05 33;
info@eurofarad.com; www.eurofarad.com
EuroMC
12/24 Avenue de Stalingrad Stains, ZA St, Leger,
93240, France;
+33 1 58 34 00 00; Fax. +33 1 58 34 07 07;
EuroMC@wanadoo.fr; www.euromc.fr
Produits et services: Filtres, Protection, Espaces sous
protection et cltures
ETS-Lindgren
Z.A. Saint Lger - Batiment; 12-24 Avenue Stalingrad,
93240 Stains;
+33 1 49 40 19 30; Fax:+33 1 49 40 19 31;
france@ets-lindgren.com;
www.ets-lindgren.com
Produits et services: Antennes, ferrites, filtres,
chambres blindes et botiers, Gnrateurs de signaux
RFI / EMI, instrumentation de test, Divers
PRODUITS ET
SERVICES
Concepteurs et fabricants damplificateurs
radiofrquences et hyperfrquences de forte puissance
MILMEGA Limited Park Road, Ryde, Isle of Wight, PO33 2BE United Kingdom
Tel. +44 (0) 1983 618004 Fax. +44 (0) 1983 811521 sales@milmega.co.uk www.milmega.co.uk

MILMEGA
La diffrence entre lordinaire
et lextraordinaire
La nouvelle srie damplificateurs de 80 1 000 MHz de MILMEGA est limage
de notre socit : elle fournit des produits et des services exceptionnels et tablit
des standards que nos concurrents souhaitent imiter.
Nous promettons seulement ce que nous pouvons livrer
puis livrons plus que ce nous avons promis.
Le meilleur dans sa catgorie pour une
puissance garantie
Des sous ensembles amovibles
amliorent lutilisation du produit
Garantie 5 ans tous frais compris
Compacit exceptionnelle
(la moiti de la taille de nos concurrents)
Architecture modulaire, permettant une
mise niveau
Extra210x297ITEMFrance_Layout 1 04/09/2012 16:37 Page 1
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84
F
Fair-Rite Products
Schaffner EMC SAS, 112, Quai de Bezons B.P. 133 95103
Argenteuil France;
+33(0)1 34 34 30 60; Fax: +33(0)1 39 47 02 28;
francesales@schaffner.com; www.fair-rite.com
Produits et services: Ferrite, Filtres, Espaces sous
protection et cltures, Protection
FCI Connectors
Immeuble Calypso, 18 Parc Ariane III, 3-5 rue Alfred
Kastler, 78 280 Guyancourt, France;
+33 1 72 67 35 00; Fax : +33 1 72 67 36 83;
france@fci.com; www.fciconnect.com
Produits et services: Cbles et connexions
69, rue Henri Laroche, 60800 Crpy-en-Valois;
+33 3 44 39 06 06; Fax: +33 3 44 94 48 33;
Produits et services: Ensembles de cbles blinds &
harnais conduits, tuyaux blinds blind
G
GETELEC
375 rue Morane Saulnier, 78530 Buc- France;
+33(0)1 39 20 42 42; Fax: +33(0)1 39 20 43 43;
info@getelec.com; www.getelec.com
Produits et services: Matriaux conducteurs,
Protection
Gowanda Electronics
ACAL BFI; ZI De La Petite Montagne Sud, 4 Allee Du
Cantal, CE 1834 Lisses, Evry Cedex, France, 91018;
+33 01 60 79 59 00; 33 01 60 79 89 01;
info@bfoptilas.com; www.bfoptilas.com.
Produits et services: inducteurs
I
a TESEQ Company
Teseq Sarl, 50, route de Pontoise, 95870 Bezons;
+33 (0)1 39 47 42 21; Fax: +33 (0)1 39 47 40 92;
francesales@teseq.com; www.teseq.fr
Produits et services: Concepteurs et fabricants d
amplifcateurs radiofrquences et hyperfrquences de
haute puissance (Tetrode Tubes, Solid State and TWT)
K
Kemtron SARL
315 Square des Champs Elysees,
91080 Courcouronnes, France;
+33(0)1 60 91 34 48; Fax: +33 (0)1.60.91.34.47;
Pascal Malblanc, info@kemtron.fr;
www.kemtron.fr
Protection
L
M2S SARL, 3 rue des Martins Pcheurs, F-66700 Argels
sur Mer France;
04-68-81-49-52; Fax: 04-68-81-62-16;
m2s@wanadoo.fr;
www.langer-emv.de
Produits et services: Instrument de contrle
M
a TESEQ Company
MILMEGA
+33 (0)1 39 47 42 21; Fax: +33 (0)1 39 47 40 92;
francesales@teseq.com;
www.teseq.fr
Produits et services: Concepteurs et fabricants d
amplifcateurs radiofrquences et hyperfrquences de
haute puissance
N
NEXIO
46 Avenue du General de Croutte, Toulous,
31100 France;
+33(0)5 61 44 02 47; Fax: +33(0)5 61 44 05 67;
Frederic Amoros, President;
frederic.amoros-routie@nexio.fr;
www.nexio-online.com
Produits et services: Instrument de contrle, Divers
P
Prana
Z.I. La Marquisie, Avenue du 4 Juillet 1776, Brive Cedex
19101 France;
+33(0)5 55 86 49 33; Fax: +33(0)5 55 86 49 45;
Dennis Dumont, ddumont@prana-rd.com;
www.prana-rd.com
Produits et services: Amplifcateurs
S
Yelloz Component - MILMEGA, 4 Rue de Mayotte Z.I.de
Courtaboeuf, FR- 91940 Les Ulis, France;
+33(0)1 64 46 04 42; Fax: +33(0)1 64 46 92 70;
Eric Stunault; estunault@yellozgroup.com;
www.yellozgroup.com
Protection
Schurter S.A.S.
Route de Chteauvillain, 52210 Arc en Barrios, France;
+33 3 2502 5049;
contact@schurter.fr;
www.schurter.fr
Produits et services: Filtres, Protection
T
Tech-Etch, Inc.
Yelloz Components
Za de Courtaboeuf, 4 Rue de Mayotte,
F-91940 Les Ulis, France;
+33 164 46968; Fax: +33 160 923801;
yellozcomponents@yellowzgroup.com;
www.tech-etch.com
Protection
Teseq Sarl
+33 (0)1 39 47 42 21; Fax: +33 (0)1 39 47 40 92;
francesales@teseq.com;
www.teseq.fr
Produits et services: Amplifers (RF & Microwave),
Antennas, Automotive Systems, Conducted RF immu-
nity, Conducted Surge & Transients, ESD, Harmonics &
Flicker, GTEM cells, RF Immunity Systems, RF Emission
Systems, RF Testsoftware, Calibration & Service
ASSOCIATIONS
ASSOCIATION FRANAISE DE LA
COMPATIBILIT ELECTROMAGNTIQUE
(AFCEM)
Pour la promotion et le dveloppement de la
Compatibilit ElectroMagntique
Association rgie par la loi du 1er juillet 1901, 86 rue de
la Libert 38180 SEYSSINS;
01 43 86 13 96; Fax: 01 43 86 09 40;
contact@afcem.org;
www.afcem.org/index.asp
IEEE EMC SOCIETY CHAPTER FRANCE
Andr Berthon, Admittance, 11 rue Bertron, F-92330
Sceaux, France;
+331 433 45231;
aberthon@club-internet.fr
Ressources | France
85
NOTIFIED BODIES
AEMC LAB
19 rue franois Blumet, ZI de lArgentire,
F38360, Sassenage, France;
+33 04 76 27 83 83; Fax: +33 04 76 27 77 00;
aemc.lab@wanadoo.fr
ASEFA
33 avenue du Gnral Leclerc,
92260 Fontenay-aux-Roses, France;
+33 1 40 95 63 34; Fax: +33 1 40 95 88 18;
asefa@lcie.fr
ASEFA - PLATE FORME F 03 - SCHNEIDER
ELECTRIC INDUSTRIES
37 quai Paul Louis Merlin,
38050 Grenoble cedex 9, France ;
+33 4 76 39 85 51; Fax: +33 4 76 57 99 38;
william.magnon@schneider-electric.com;
www.schneider-electric.com
ASEFA - PLATE FORME P 01 - LEGRAND
128 avenue du Marchal de Lattre de Tassigny, F87045
Limoges cedex, France;
+33 5 55 06 87 87; Fax: +33 5 55 06 88 88;
didier.leblanc@legrand.fr
ASEFA - PLATE FORME V 01 - ALSTOM
TRANSPORT
11-13 Avenue de Bel Air 69627,
Villeurbanne Cedex, France;
+33 4 72 81 46 27;
carlos-queiros-de-oliveira@transport.alstom.com;
www.alstom.transport.com
CENTRE TECHNIQUE DES INDUSTRIES
MECANIQUES
52 Avenue Felix Louat - BP 80067, F60304 SENLIS
CEDEX, France;
+33 3 44 67 30 00; Fax: +33 3 44 67 34 00;
sqr@cetim.fr; www.cetim.fr
EMITECH ATLANTIQUE
Rue de la Claie 15, ZI Angers-Beaucouz, 49070 BEAU-
COUZE, France;
+33 2 41 732627; Fax: +33 241 7326.40;
atlantique@emitech.fr; www.emitech.fr
EMITECH - CHASSIEU
7, rue Georges Mlis, F 69680 CHASSIEU, France; +33
478 406655; Fax: +33 472 470039; chassieu@emitech.
fr; www.emitech.fr
EMITECH GRAND SUD
Rue du Massacan 145, ZI Valle du Salaison, BP 25,
34741 VENDARGUES CEDEX, France;
+33 467 871102; Fax: +33 467 709455;
grand-sud@emitech.fr;
www.emitech.fr
EMITECH ILE DE FRANCE
Z.A. de lObservatoire 3 rue des Coudriers, 78180
MONTIGNY LE BRETONNEUX, France;
+33 1 30 57 55 55; Fax: +33 1 30 43 74 48;
contact@emitech.fr; www.emitech.fr
EMITECH - LE RHEU
2 alle du Chne Vert F35650 le Rheu, Le Rheu, France;
+33 299 14 5914; +33 299 146454;
lerheu@emitech.fr; www.emitech.fr
EUROCEM
364, rue Armand Japy Technoland, 25460 Etupes,
Cedex, France;
+33 381 907590; Fax: +33 381 3236 28;
s.affard@eurocem.fr;
commercial@eurocem.fr;
www.eurocem.fr
GYL TECHNOLOGIES
Parc dactivits de Lanserre 21 rue de la Fuye F49610
Juigne sur Loire, Juigne sur loire, France;
+33 241 575740; Fax: +33 2414525 77;
gyl@gyl.fr
GROUPE DETUDES ET DE RECHERCHES
APPLIQUES LA COMPATIBILIT
105 avenue du Gnral Eisenhower BP 23705 F 31037
Toulouse cedex 01, Toulouse, France,
+33 561 1946 50; Fax: +33 561 194668;
toulouse@gerac.com
INSTITUT NATIONAL DE
LENVIRONNEMENT INDUSTRIEL ET
DES RISQUES
Parc Technologique Alata BP 2, F60550 Verneuil-en-
Halatte, France;
+33 344 556677; Fax: +33 344 556699;
pierre.gruet@ineris.fr;
www.ineris.fr
LABORATOIRE CENTRAL DES
INDUSTRIES ELECTRIQUES
33 avenue du Gnral Leclerc BP 8, F92266 Fontenay-
aux-Roses cedex, France;
+33 140 956060; Fax: +33 140 955407;
contact@lcie.fr; www.lcie.fr
LABORATOIRE NATIONAL DE
MTROLOGIE ET DESSAIS
1, rue Gaston Boissier, 75724 PARIS CEDEX 15, France;
+33 140 433700; Fax: +33 140 433737;
info@lne.fr; www.lne.fr
INDUSTRIES ELECTRIQUES -
ETABLISSEMENT SUD-EST
ZI CentrAlp 170 rue de Chatagnon,
F38430 Moirans, France;
+33 476 073636; Fax: +33 476 559088;
UNION TECHNIQUE DE LAUTOMOBILE,
DU MOTOCYCLE ET DU CYCLE
Autodrome de Linas-Montlhry BP 20212,
91311 Montlhry Cedex, France;
+33 169 801700; Fax: +33 169 801717;
christian.pichon@utac.com; www.utac.com
OTHER
MINISTRE DE LECONOMIE, DES
FINANCES ET DE LINDUSTRIE DIGITIP/
SPIC/SQUALPI DIGITIP 5
Le Bervil, 12 rue Villiot, F-75572 Paris Cedex 12;
+33 015 3449703; Fax: + 33 015 3449888;Michel Berger,
michel.berger@fnances.gouv.fr
Ressources | France
85
NOTIFIED BODIES
AEMC LAB
19 rue franois Blumet, ZI de lArgentire,
F38360, Sassenage, France;
+33 04 76 27 83 83; Fax: +33 04 76 27 77 00;
aemc.lab@wanadoo.fr
ASEFA
33 avenue du Gnral Leclerc,
92260 Fontenay-aux-Roses, France;
+33 1 40 95 63 34; Fax: +33 1 40 95 88 18;
asefa@lcie.fr
ASEFA - PLATE FORME F 03 - SCHNEIDER
ELECTRIC INDUSTRIES
37 quai Paul Louis Merlin,
38050 Grenoble cedex 9, France ;
+33 4 76 39 85 51; Fax: +33 4 76 57 99 38;
william.magnon@schneider-electric.com;
www.schneider-electric.com
ASEFA - PLATE FORME P 01 - LEGRAND
128 avenue du Marchal de Lattre de Tassigny, F87045
Limoges cedex, France;
+33 5 55 06 87 87; Fax: +33 5 55 06 88 88;
didier.leblanc@legrand.fr
ASEFA - PLATE FORME V 01 - ALSTOM
TRANSPORT
11-13 Avenue de Bel Air 69627,
Villeurbanne Cedex, France;
+33 4 72 81 46 27;
carlos-queiros-de-oliveira@transport.alstom.com;
www.alstom.transport.com
CENTRE TECHNIQUE DES INDUSTRIES
MECANIQUES
52 Avenue Felix Louat - BP 80067, F60304 SENLIS
CEDEX, France;
+33 3 44 67 30 00; Fax: +33 3 44 67 34 00;
sqr@cetim.fr; www.cetim.fr
EMITECH ATLANTIQUE
Rue de la Claie 15, ZI Angers-Beaucouz, 49070 BEAU-
COUZE, France;
+33 2 41 732627; Fax: +33 241 7326.40;
atlantique@emitech.fr; www.emitech.fr
EMITECH - CHASSIEU
7, rue Georges Mlis, F 69680 CHASSIEU, France; +33
478 406655; Fax: +33 472 470039; chassieu@emitech.
fr; www.emitech.fr
EMITECH GRAND SUD
Rue du Massacan 145, ZI Valle du Salaison, BP 25,
34741 VENDARGUES CEDEX, France;
+33 467 871102; Fax: +33 467 709455;
grand-sud@emitech.fr;
www.emitech.fr
EMITECH ILE DE FRANCE
Z.A. de lObservatoire 3 rue des Coudriers, 78180
MONTIGNY LE BRETONNEUX, France;
+33 1 30 57 55 55; Fax: +33 1 30 43 74 48;
contact@emitech.fr; www.emitech.fr
EMITECH - LE RHEU
2 alle du Chne Vert F35650 le Rheu, Le Rheu, France;
+33 299 14 5914; +33 299 146454;
lerheu@emitech.fr; www.emitech.fr
EUROCEM
364, rue Armand Japy Technoland, 25460 Etupes,
Cedex, France;
+33 381 907590; Fax: +33 381 3236 28;
s.affard@eurocem.fr;
commercial@eurocem.fr;
www.eurocem.fr
GYL TECHNOLOGIES
Parc dactivits de Lanserre 21 rue de la Fuye F49610
Juigne sur Loire, Juigne sur loire, France;
+33 241 575740; Fax: +33 2414525 77;
gyl@gyl.fr
GROUPE DETUDES ET DE RECHERCHES
APPLIQUES LA COMPATIBILIT
105 avenue du Gnral Eisenhower BP 23705 F 31037
Toulouse cedex 01, Toulouse, France,
+33 561 1946 50; Fax: +33 561 194668;
toulouse@gerac.com
INSTITUT NATIONAL DE
LENVIRONNEMENT INDUSTRIEL ET
DES RISQUES
Parc Technologique Alata BP 2, F60550 Verneuil-en-
Halatte, France;
+33 344 556677; Fax: +33 344 556699;
pierre.gruet@ineris.fr;
www.ineris.fr
INDUSTRIES ELECTRIQUES
33 avenue du Gnral Leclerc BP 8, F92266 Fontenay-
aux-Roses cedex, France;
+33 140 956060; Fax: +33 140 955407;
LABORATOIRE NATIONAL DE
MTROLOGIE ET DESSAIS
1, rue Gaston Boissier, 75724 PARIS CEDEX 15, France;
+33 140 433700; Fax: +33 140 433737;
info@lne.fr; www.lne.fr
INDUSTRIES ELECTRIQUES -
ETABLISSEMENT SUD-EST
ZI CentrAlp 170 rue de Chatagnon,
F38430 Moirans, France;
+33 476 073636; Fax: +33 476 559088;
UNION TECHNIQUE DE LAUTOMOBILE,
DU MOTOCYCLE ET DU CYCLE
Autodrome de Linas-Montlhry BP 20212,
91311 Montlhry Cedex, France;
+33 169 801700; Fax: +33 169 801717;
christian.pichon@utac.com; www.utac.com
OTHER
MINISTRE DE LECONOMIE, DES
FINANCES ET DE LINDUSTRIE DIGITIP/
SPIC/SQUALPI DIGITIP 5
Le Bervil, 12 rue Villiot, F-75572 Paris Cedex 12;
+33 015 3449703; Fax: + 33 015 3449888;Michel Berger,
michel.berger@fnances.gouv.fr
PASCAL DE RESSGUIER
Chef de projet chez
Entares Engineering
YANNICK POIR, SAMUEL LEMAN
Ingnieurs Etudes & Simulations CEM
Nexio
Rsum Une tude approfondie des interfrences
lectromagntiques lintrieur dun aronef est dsormais
incontournable face la rcente augmentation des dispositifs
lectroniques bord. Leurs eets sur la communication et les
systmes lectroniques de lappareil ont besoin dtre pris en
compte en priorit lors de ltape de conception. Des simula-
tions numriques sont souvent utilises an deectuer cette
analyse. Cependant, la grande taille lectrique des modles
haute frquence entrane un temps de calcul et un espace m-
moire considrable. Bien quun certain nombre de mthodes
itratives rapides existe, la structure en forme de cavit de
laronef pose des problmes de convergence rduisant leur
applicabilit pour ce type de problme. La mthode directe
propose rsout le systme linaire de la Mthode des Mo-
ments (MoM) en utilisant lalgorithme Adaptive Cross Ap-
proximation (ACA) an de rduire la taille de la matrice
et le temps de calcul. Contrairement aux solveurs itratifs
rapides, une approche directe est eectue an dviter les
problmes de convergence. Une bonne concordance entre les
simulations du logiciel CAPITOLE-EM utilisant la com-
pression ACA et les mesures sur une maquette dun avion
simpli a t observe.
Mots cls : Adaptive Cross Approximation, ACA, cble,
cavit, couplage, antenne, aronef
INTRODUCTION
L
E NOMBRE de passager embarquant dans les
avions qui ont des appareils lectroniques a
considrablement augment durant la dernire
dcennie. Lutilisation des appareils lectron-
iques est gnralement interdite pendant les
phases critiques du vol en raison de leur pouvoir
dinterfrer avec les systmes de lavion. Toute-
fois, il est important dtudier les IEM (Interfrences Elec-
tromagntiques) assez tt dans la phase de conception an
de minimiser les eets possibles.
86

France
Nexio_FRA_EEG13.indd 6 11/16/12 4:17 PM
PASCAL DE RESSGUIER
Chef de projet chez
Entares Engineering
YANNICK POIR, SAMUEL LEMAN
Ingnieurs Etudes & Simulations CEM
Nexio
Rsum Une tude approfondie des interfrences
lectromagntiques lintrieur dun aronef est dsormais
incontournable face la rcente augmentation des dispositifs
lectroniques bord. Leurs eets sur la communication et les
systmes lectroniques de lappareil ont besoin dtre pris en
compte en priorit lors de ltape de conception. Des simula-
tions numriques sont souvent utilises an deectuer cette
analyse. Cependant, la grande taille lectrique des modles
haute frquence entrane un temps de calcul et un espace m-
moire considrable. Bien quun certain nombre de mthodes
itratives rapides existe, la structure en forme de cavit de
laronef pose des problmes de convergence rduisant leur
applicabilit pour ce type de problme. La mthode directe
propose rsout le systme linaire de la Mthode des Mo-
ments (MoM) en utilisant lalgorithme Adaptive Cross Ap-
proximation (ACA) an de rduire la taille de la matrice
et le temps de calcul. Contrairement aux solveurs itratifs
rapides, une approche directe est eectue an dviter les
problmes de convergence. Une bonne concordance entre les
simulations du logiciel CAPITOLE-EM utilisant la com-
pression ACA et les mesures sur une maquette dun avion
simpli a t observe.
Mots cls : Adaptive Cross Approximation, ACA, cble,
cavit, couplage, antenne, aronef
INTRODUCTION
L
E NOMBRE de passager embarquant dans les
avions qui ont des appareils lectroniques a
considrablement augment durant la dernire
dcennie. Lutilisation des appareils lectron-
iques est gnralement interdite pendant les
phases critiques du vol en raison de leur pouvoir
dinterfrer avec les systmes de lavion. Toute-
fois, il est important dtudier les IEM (Interfrences Elec-
tromagntiques) assez tt dans la phase de conception an
de minimiser les eets possibles.
86

France
Nexio_FRA_EEG13.indd 6 11/16/12 4:17 PM ADs_EEG13.indd 26 11/16/12 2:48 PM
France
88
Le fuselage dun aronef peut tre assimil une cavit
cylindrique en mtal avec des ouvertures pour les fentres.
Lorsquil est excit par une antenne, des rsonances sur
les champs lectriques et magntiques apparaissent cer-
taines frquences et peuvent crer des interfrences avec
des quipements de lappareil, entranant des problmes
vident de scurit.
Pour analyser ces efets de couplage, diverses mthodes
ont t jusqu prsent utilises, telles que la Mthode des
Difrences Finies dans le Domaine Temporel [1] et la M-
thode des Moments (MoM) [2] entre autres. Cependant, la
frquence de fonctionnement des appareils ainsi que la taille
des aronefs sont en augmentation, demandant ainsi un
temps de calcul ainsi quun espace de mmoire prohibitifs.
Plusieurs mthodes dites rapides telles que AIM [3],
MLFMA [4], MLMDA [5], et ACA [6] ont t dveloppes
afn de rsoudre lectriquement et de manire efcace
de gros modles traits par la mthode MoM. Toutes
ces mthodes sont bases sur une approximation de la
matrice dimpdances sous forme compresse, rduisant
ainsi sa taille. Gnralement, le systme est rsolu par
un algorithme itratif, impliquant un produit matrice
vecteur par itration. Grce la compression de la matrice
dimpdances, le cot de calcul du processus de rsolution
est grandement rduit.
Bien que ces mthodes, et en particulier la MLFMA,
sont trs efcaces sur les gros problmes lectriques, il
reste certains cas o les mthodes itratives ont une con-
vergence lente ou voire mme ne converge pas du tout.
En gnral, il est difcile de prvoir la convergence dun
problme donn, mais les structures de type cavit sont
communment difciles rsoudre. La mthode prsente
ici est base sur la MoM-EFIE, celle-ci se traduit par une
rduction signifcative du temps de calcul en vitant tout
problme de convergence.
Dans la Section II, la compression de la matrice
dimpdances avec lutilisation de lalgorithme ACA est
brivement explique. La Section III dcrit la factorisation
avec un processus dinversion directe. Enfn, la Section IV
expose une comparaison de cette mthode avec la MoM
classique et la MLFMA. Une validation avec des mesures
FIGURE 1: Dcomposition du bloc
FIGURE 3: Modle CAD
FIGURE 4: Maquette physique
FIGURE 2: Compression ACA
France
88
Le fuselage dun aronef peut tre assimil une cavit
cylindrique en mtal avec des ouvertures pour les fentres.
Lorsquil est excit par une antenne, des rsonances sur
les champs lectriques et magntiques apparaissent cer-
taines frquences et peuvent crer des interfrences avec
des quipements de lappareil, entranant des problmes
vident de scurit.
Pour analyser ces efets de couplage, diverses mthodes
ont t jusqu prsent utilises, telles que la Mthode des
Difrences Finies dans le Domaine Temporel [1] et la M-
thode des Moments (MoM) [2] entre autres. Cependant, la
frquence de fonctionnement des appareils ainsi que la taille
des aronefs sont en augmentation, demandant ainsi un
temps de calcul ainsi quun espace de mmoire prohibitifs.
Plusieurs mthodes dites rapides telles que AIM [3],
MLFMA [4], MLMDA [5], et ACA [6] ont t dveloppes
afn de rsoudre lectriquement et de manire efcace
de gros modles traits par la mthode MoM. Toutes
ces mthodes sont bases sur une approximation de la
matrice dimpdances sous forme compresse, rduisant
ainsi sa taille. Gnralement, le systme est rsolu par
un algorithme itratif, impliquant un produit matrice
vecteur par itration. Grce la compression de la matrice
dimpdances, le cot de calcul du processus de rsolution
est grandement rduit.
Bien que ces mthodes, et en particulier la MLFMA,
sont trs efcaces sur les gros problmes lectriques, il
reste certains cas o les mthodes itratives ont une con-
vergence lente ou voire mme ne converge pas du tout.
En gnral, il est difcile de prvoir la convergence dun
problme donn, mais les structures de type cavit sont
communment difciles rsoudre. La mthode prsente
ici est base sur la MoM-EFIE, celle-ci se traduit par une
rduction signifcative du temps de calcul en vitant tout
problme de convergence.
Dans la Section II, la compression de la matrice
dimpdances avec lutilisation de lalgorithme ACA est
brivement explique. La Section III dcrit la factorisation
avec un processus dinversion directe. Enfn, la Section IV
expose une comparaison de cette mthode avec la MoM
classique et la MLFMA. Une validation avec des mesures
FIGURE 1: Dcomposition du bloc
FIGURE 3: Modle CAD
FIGURE 4: Maquette physique
FIGURE 2: Compression ACA
France Poi r, Leman
89
rpartition en deux groupes jusqu ce quun certain nombre
dlments par groupe soit atteint.
Les blocs diagonaux, qui correspondent aux interactions
des groupes sur eux-mmes, sont calculs avec la mthode
classique MoM alors que, les blocs nappartenant pas la
diagonale, qui reprsentent linteraction entre deux blocs
bien distincts, sont calculs avec laide de lAlgorithme ACA.
Lalgorithme ACA fut introduit par Bebendorf [7] afn de
calculer une forme compresse de matrice de rang faible en
utilisant que quelques lments de la matrice originale. Par
consquent, chaque matrice bloc peut avoir une approxima-
sur maquette a aussi t efectue.
LALgorithme de Compression ACA
La mthode prsente ici est base sur la compression
de la matrice dimpdances MoM en blocs. Le point majeur
vient du fait que les matrices blocs, reprsentant des interac-
tions entre deux groupes dlments spatialement loigns,
sont de rang faible.
Un algorithme de type arbre binaire est utilis afn de
subdiviser la matrice dimpdances en blocs (Figure 1).
Les lments sont successivement partags suivant leur
FIGURE 5: Couplage S21 entre deux monoples, comparaison entre ACA
& MoM
FIGURE 6: Erreur ACA & MoM
1e+008 2e+008 3e+008 4e+008 5e+008 6e+008 7e+008 8e+008 9e+008 1e+009
-180
-160
-140
-120
-100
-80
-60
-40
-20
Freq. (Hz)
|
S
2
1
|

(
d
B
)
MoM
ACA
1e+008 2e+008 3e+008 4e+008 5e+008 6e+008 7e+008 8e+008 9e+008 1e+009
0.0
0.5
1.0
1.5
2.0
2.5
Freq. (Hz)
E
r
r
e
u
r

A
C
A

/

M
o
M

(
%
)
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France
90
tion qui est reprsente par le produit de deux matrices de
plus petite taille:
MUV
On a M une matrice mn, U une matrice mk et V une
matrice kn avec k<<m,n, o k est le rang de la matrice bloc
(Figure 2). Lerreur est contrle par un seuil qui dtermine
le moment o il faut arrter de chercher plus de colonnes
ou de lignes pour respectivement U et V. Il en rsulte une
rduction de la taille de mmoire et du temps de calcul. Cet
algorithme est purement algbrique, il ne dpend donc pas
du cur dquations intgrales et par consquent, il peut
tre facilement intgr dans un code MoM existant.
Une re-compression SVD est faite sur la matrice g-
nre par lalgorithme ACA afn dobtenir une plus grande
compression et avoir la matrice sous la forme SVD pour le
processus de rsolution. Un seuil SVD dix fois plus grand
que celui dACA est choisi.
III. DecomposItIon bloc-lu
Une fois que la matrice compresse est calcule, une m-
thode directe par bloc est utilise. Bien quhabituellement
plus lente pour la rsolution dun vecteur incident que les
mthodes acclres itratives, la mthode directe vite des
problmes de convergence puisquelle trouve une solution
en un temps prvisible. Sans oublier le temps supplmen-
taire qui est ngligeable si la solution de plusieurs vecteurs
entrant est ncessaire, ce qui est en gnral le cas dans la
plupart des applications.
En particulier, nous utilisons une factorisation LDLt
par bloc pour matrices symtriques indfnies, o L est
une matrice triangulaire infrieure, D reprsente les blocs
diagonaux et T correspond la transpose de la matrice.
Ceci est une gnralisation de la factorisation de Cho-
lesky, qui requiert une matrice dfnie positivement. Une
reprsentation de cette dcomposition lorsque la matrice
est subdivise en 3x3 blocs est prsente ci-dessous:
Z
11
Z
12
Z
13
Z
12
Z
22
Z
23
Z
13
Z
23
Z
33
I 0 0
L
21
I 0
L
31
L
32
I
D
1
0 0
0 D
2
0
0 0 D
3
I L
21
L
31
0 I L
32
0 0 I
[ [
=
[ [ ] ] ] ]
T T
T
o

D
j
=A
ii
-
L
jk
D
k
L
jk
k=1
j-1
T
et

L
ij
=
(
A
ij
-
L
ik
D
k
L
jk
)
D
j
j-1
k=1
T -1
La rsolution est efectue par une descente triangulaire
suivie dune remonte triangulaire afn dobtenir la solution.
IV. ResultAts
Afn de valider la mthode de rsolution en utilisant
lalgorithme de compression ACA nous avons effectu
FIGURE 7: Modle de cabine avec fentres
TABLE 2: comparaison entre MLFMA & ACA
MLFMA ACA
Nombre dinconnues 10378 10378
Nombre de Frquences 501 501
Temps Total CPU 35h 4h 52min
Taux de Compression 93.7% 83.9%
& MoM
3e+008 4e+008 5e+008 6e+008 7e+008 8e+008 9e+008 1e+009
-150
-100
-50
0
Freq. (Hz)
|
S
2
1
|

(
d
B
)
MLFMM
CAPITOLE-EM
FIGURE 9: Nombre ditrations par frquence en utilisant la MLFMA
3e+008 4e+008 5e+008 6e+008 7e+008 8e+008 9e+008 1e+009
0
50
100
150
200
250
300
350
400
450
500
Freq. (Hz)
N
b
r
e

i
t
e
r
a
t
i
o
n
s
TABLE 1: comparaison entre ACA & MoM
MoM ACA
Solveur LAPACK ACA-BlockLU
Temps Total CPU 30h 22min 3h 38min
Taux de Compression 0% 84.8%
France Poi r, Leman
91
La Figure 6. nous montre le pourcentage derreur entre les
deux courbes, elles sont la plupart du temps en dessous de
1% et atteignent rarement 2.4% ce qui reprsente une dif-
frence de 0.5dB contre une gamme dynamique suprieure
100dB.
Dans le second test, le modle de cylindre avec des
fentres et un plancher est utilis. Une comparaison avec
la mthode MLFMA est alors ralise.
La TABLE II. Synthtise les performances des deux
mthodes. Mme si la MLFMA a une meilleure compres-
sion, le temps de calcul est beaucoup plus important. Cela
est d la convergence des solveurs itratifs, en particulier
pour les frquences suprieures 700MHz (voir Figure 9. ).
Notons que mme dans le cas o la MLFMA atteint son
niveau maximal ditrations sans convergence, la valeur de
couplage obtenue est trs proche de celle actuelle, ce qui
signife que lalgorithme a pratiquement converg.
C. Validation par mesures
Les mesures ont t ralises sur le modle en aluminium
complet.
Le paramtre S21 a t mesur entre une source
dinterfrence et un rcepteur avec un analyseur vectoriel
(VNA).
Le premier cas reprsente un couplage entre deux
monoples sur le plancher de la cabine. La Figure 10.
prsente le rsultat de la simulation et des mesures. Elle a
laspect dun couplage direct entre deux monoples proches
superposs aux rsonances de la cavit.
Une bonne correspondance entre les mesures et la simu-
lation peut tre observe. Il reproduit convenablement le
niveau moyen et les rsonances. Le second cas mesure le
couplage entre un monople plac lintrieur du cockpit
et un cble qui stend du mur jusqu la cabine. La Figure
11, en dehors de la plage de frquence autour de 510MHz,
montre une bonne corrlation.
La longueur de la fente entre le plancher du cockpit et
le cne tronqu est denviron 29.5cm. Si lon regarde la
frquence de rsonance / 2, nous obtenons 3e8/29.5e-2/2
= 508MHz, rsonance qui apparat dans la simulation. Il
est lgitime de penser que cette rsonance est manquante
dans les mesures cause des cales de PVC utilises pour
supporter le plancher.
trois types de comparaisons: une avec la rfrence non-
compresse de la mthode MoM, une autre avec la mthode
rapide MLFMA et enfn une avec des mesures sur un modle
rduit et simplif dun avion.
A. Prsentation du modle
Le modle utilis pour la validation reprsente un avion
inspir du CASA CN-235 de EADS. Des formes simples
ont t choisies afn de faciliter la fabrication physique du
modle. Nanmoins, les volumes ont t respects selon
une chelle fxe (Figure 3. )
Le fuselage simplif est reprsent par un cylindre dune
longueur de 150 cm et dun diamtre de 47 cm. Le plancher
de lappareil se situe 29 cm du haut du cylindre. Une srie
de petites ouvertures de chaque ct du cylindre ont t
perces pour les fentres. Le cockpit est reprsent par un
cne tronqu de 27.3 cm de long, ajust au cylindre au niveau
de sa section la plus large et dun diamtre oppos de 24 cm.
Les ouvertures pour les fentres ont galement t cres
dans le cockpit. Un plancher a aussi t plac dans le cockpit
la mme hauteur que dans la cabine. Notons quil y a un
espace entre le plancher et le fuselage qui est obtur par
deux cales longitudinales en PVC supportant le plancher.
Plusieurs monoples de 2 cm sont placs difrents
endroits lintrieur de la structure dans le but de mod-
liser les antennes. Les cbles sont reprsents par des fls
conducteurs rectilignes connects au plancher.
Le modle a t construit en aluminium dune paisseur
de 2 mm. (Figure 4. )
B. Validation numrique
Les simulations suivantes ont t ralises sur un poste
de travail DELL PRECISION 690 avec un processeur quad-
core Intel Xeon E5345 2.33GHz et 12GB de mmoire. Le
logiciel CAPITOLE-EM dEntares Engineering a t utilis
pour les simulations numriques.
Dans le premier cas, une comparaison est faite entre le
modle compress ACA et la MoM conventionnelle. Dans
ce cas-l, le modle tait simplement le cylindre comprenant
deux monoples lintrieur.
La taille de la matrice a t rduite de 84.8% alors que le
temps de CPU tait presque rduit par dix. (voir TABLE I. ).
Le rsultat du couplage entre les deux monoples est
reprsent sur la Figure 5. Un excellent accord est observ.
FIGURE 10: Couplage entre deux monoples, mesures et comparaison
ACA
FIGURE 11:Couplage entre un monople et un cble, mesures et
comparaison ACA
1e+008 2e+008 3e+008 4e+008 5e+008 6e+008 7e+008 8e+008 9e+008 1e+009
-90
-80
-70
-60
-50
-40
-30
-20
Freq. (Hz)
|
S
2
1
|

(
d
B
)
Mesures
CAPITOLE-EM
1e+008 2e+008 3e+008 4e+008 5e+008 6e+008 7e+008 8e+008 9e+008 1e+009
-80
-70
-60
-50
-40
-30
-20
Freq. (Hz)
|
S
2
1
|

(
d
B
)
Mesures
CAPITOLE-EM
France
90
tion qui est reprsente par le produit de deux matrices de
plus petite taille:
MUV
On a M une matrice mn, U une matrice mk et V une
matrice kn avec k<<m,n, o k est le rang de la matrice bloc
(Figure 2). Lerreur est contrle par un seuil qui dtermine
le moment o il faut arrter de chercher plus de colonnes
ou de lignes pour respectivement U et V. Il en rsulte une
rduction de la taille de mmoire et du temps de calcul. Cet
algorithme est purement algbrique, il ne dpend donc pas
du cur dquations intgrales et par consquent, il peut
tre facilement intgr dans un code MoM existant.
Une re-compression SVD est faite sur la matrice g-
nre par lalgorithme ACA afn dobtenir une plus grande
compression et avoir la matrice sous la forme SVD pour le
processus de rsolution. Un seuil SVD dix fois plus grand
que celui dACA est choisi.
III. DecomposItIon bloc-lu
Une fois que la matrice compresse est calcule, une m-
thode directe par bloc est utilise. Bien quhabituellement
plus lente pour la rsolution dun vecteur incident que les
mthodes acclres itratives, la mthode directe vite des
problmes de convergence puisquelle trouve une solution
en un temps prvisible. Sans oublier le temps supplmen-
taire qui est ngligeable si la solution de plusieurs vecteurs
entrant est ncessaire, ce qui est en gnral le cas dans la
plupart des applications.
En particulier, nous utilisons une factorisation LDLt
par bloc pour matrices symtriques indfnies, o L est
une matrice triangulaire infrieure, D reprsente les blocs
diagonaux et T correspond la transpose de la matrice.
Ceci est une gnralisation de la factorisation de Cho-
lesky, qui requiert une matrice dfnie positivement. Une
reprsentation de cette dcomposition lorsque la matrice
est subdivise en 3x3 blocs est prsente ci-dessous:
Z
11
Z
12
Z
13
Z
12
Z
22
Z
23
Z
13
Z
23
Z
33
I 0 0
L
21
I 0
L
31
L
32
I
D
1
0 0
0 D
2
0
0 0 D
3
I L
21
L
31
0 I L
32
0 0 I
[ [
=
[ [ ] ] ] ]
T T
T
o

D
j
=A
ii
-
L
jk
D
k
L
jk
k=1
j-1
T
et

L
ij
=
(
A
ij
-
L
ik
D
k
L
jk
)
D
j
j-1
k=1
T -1
La rsolution est efectue par une descente triangulaire
suivie dune remonte triangulaire afn dobtenir la solution.
IV. ResultAts
Afn de valider la mthode de rsolution en utilisant
lalgorithme de compression ACA nous avons effectu
FIGURE 7: Modle de cabine avec fentres
TABLE 2: comparaison entre MLFMA & ACA
MLFMA ACA
Temps Total CPU 35h 4h 52min
Taux de Compression 93.7% 83.9%
& MoM
3e+008 4e+008 5e+008 6e+008 7e+008 8e+008 9e+008 1e+009
-150
-100
-50
0
Freq. (Hz)
|
S
2
1
|

(
d
B
)
MLFMM
CAPITOLE-EM
FIGURE 9: Nombre ditrations par frquence en utilisant la MLFMA
3e+008 4e+008 5e+008 6e+008 7e+008 8e+008 9e+008 1e+009
0
50
100
150
200
250
300
350
400
450
500
Freq. (Hz)
N
b
r
e

i
t
e
r
a
t
i
o
n
s
TABLE 1: comparaison entre ACA & MoM
MoM ACA
Solveur LAPACK ACA-BlockLU
Temps Total CPU 30h 22min 3h 38min
Taux de Compression 0% 84.8%
France Poi r, Leman
91
La Figure 6. nous montre le pourcentage derreur entre les
deux courbes, elles sont la plupart du temps en dessous de
1% et atteignent rarement 2.4% ce qui reprsente une dif-
frence de 0.5dB contre une gamme dynamique suprieure
100dB.
Dans le second test, le modle de cylindre avec des
fentres et un plancher est utilis. Une comparaison avec
la mthode MLFMA est alors ralise.
La TABLE II. Synthtise les performances des deux
mthodes. Mme si la MLFMA a une meilleure compres-
sion, le temps de calcul est beaucoup plus important. Cela
est d la convergence des solveurs itratifs, en particulier
pour les frquences suprieures 700MHz (voir Figure 9. ).
Notons que mme dans le cas o la MLFMA atteint son
niveau maximal ditrations sans convergence, la valeur de
couplage obtenue est trs proche de celle actuelle, ce qui
signife que lalgorithme a pratiquement converg.
C. Validation par mesures
Les mesures ont t ralises sur le modle en aluminium
complet.
Le paramtre S21 a t mesur entre une source
dinterfrence et un rcepteur avec un analyseur vectoriel
(VNA).
Le premier cas reprsente un couplage entre deux
monoples sur le plancher de la cabine. La Figure 10.
prsente le rsultat de la simulation et des mesures. Elle a
laspect dun couplage direct entre deux monoples proches
superposs aux rsonances de la cavit.
Une bonne correspondance entre les mesures et la simu-
lation peut tre observe. Il reproduit convenablement le
niveau moyen et les rsonances. Le second cas mesure le
couplage entre un monople plac lintrieur du cockpit
et un cble qui stend du mur jusqu la cabine. La Figure
11, en dehors de la plage de frquence autour de 510MHz,
montre une bonne corrlation.
La longueur de la fente entre le plancher du cockpit et
le cne tronqu est denviron 29.5cm. Si lon regarde la
frquence de rsonance / 2, nous obtenons 3e8/29.5e-2/2
= 508MHz, rsonance qui apparat dans la simulation. Il
est lgitime de penser que cette rsonance est manquante
dans les mesures cause des cales de PVC utilises pour
supporter le plancher.
trois types de comparaisons: une avec la rfrence non-
compresse de la mthode MoM, une autre avec la mthode
rapide MLFMA et enfn une avec des mesures sur un modle
rduit et simplif dun avion.
A. Prsentation du modle
Le modle utilis pour la validation reprsente un avion
inspir du CASA CN-235 de EADS. Des formes simples
ont t choisies afn de faciliter la fabrication physique du
modle. Nanmoins, les volumes ont t respects selon
une chelle fxe (Figure 3. )
Le fuselage simplif est reprsent par un cylindre dune
longueur de 150 cm et dun diamtre de 47 cm. Le plancher
de lappareil se situe 29 cm du haut du cylindre. Une srie
de petites ouvertures de chaque ct du cylindre ont t
perces pour les fentres. Le cockpit est reprsent par un
cne tronqu de 27.3 cm de long, ajust au cylindre au niveau
de sa section la plus large et dun diamtre oppos de 24 cm.
Les ouvertures pour les fentres ont galement t cres
dans le cockpit. Un plancher a aussi t plac dans le cockpit
la mme hauteur que dans la cabine. Notons quil y a un
espace entre le plancher et le fuselage qui est obtur par
deux cales longitudinales en PVC supportant le plancher.
Plusieurs monoples de 2 cm sont placs difrents
endroits lintrieur de la structure dans le but de mod-
liser les antennes. Les cbles sont reprsents par des fls
conducteurs rectilignes connects au plancher.
Le modle a t construit en aluminium dune paisseur
de 2 mm. (Figure 4. )
B. Validation numrique
Les simulations suivantes ont t ralises sur un poste
de travail DELL PRECISION 690 avec un processeur quad-
core Intel Xeon E5345 2.33GHz et 12GB de mmoire. Le
logiciel CAPITOLE-EM dEntares Engineering a t utilis
pour les simulations numriques.
Dans le premier cas, une comparaison est faite entre le
modle compress ACA et la MoM conventionnelle. Dans
ce cas-l, le modle tait simplement le cylindre comprenant
deux monoples lintrieur.
La taille de la matrice a t rduite de 84.8% alors que le
temps de CPU tait presque rduit par dix. (voir TABLE I. ).
Le rsultat du couplage entre les deux monoples est
reprsent sur la Figure 5. Un excellent accord est observ.
FIGURE 10: Couplage entre deux monoples, mesures et comparaison
ACA
FIGURE 11:Couplage entre un monople et un cble, mesures et
comparaison ACA
1e+008 2e+008 3e+008 4e+008 5e+008 6e+008 7e+008 8e+008 9e+008 1e+009
-90
-80
-70
-60
-50
-40
-30
-20
Freq. (Hz)
|
S
2
1
|

(
d
B
)
Mesures
CAPITOLE-EM
1e+008 2e+008 3e+008 4e+008 5e+008 6e+008 7e+008 8e+008 9e+008 1e+009
-80
-70
-60
-50
-40
-30
-20
Freq. (Hz)
|
S
2
1
|

(
d
B
)
Mesures
CAPITOLE-EM
France
92
CONCLUSION
Dans ce document, une mthode de rsolution base sur
lalgorithme ACA pour la compression de matrices issues de
la Mthode des Moments a t dcrite et applique aux tudes
de couplages dans une cavit rsonante. Une comparaison
avec la mthode conventionnelle MoM a montr la bonne
prcision de la mthode. Dans ce cas en particulier, nous
avons observ les di cults de convergence de la MLFMA.
Et enn, nous pouvons galement noter une bonne concor-
dance avec les mesures.
Ces dernires annes, les mthodes dites rapides ont
rvolutionn les simulations lectromagntiques de faon
spectaculaire, en rduisant le temps de calcul et la taille
mmoire. Nanmoins, la mthode prsente, bien que moins
e cace sur de trs gros modles lectriques, peut tre intres-
sante pour des modles de taille intermdiaire plus complexes
comme ceux comportant des cavits par exemple.
REFERENCES
[1] K. S. Yee, Numerical solution of initial boundary value
problems involving Maxwells equations in isotropic media,
IEEE Trans. Antennas Propagat., vol. AP-14, pp. 302307, May
1966
[2] R. F. Harrington, Field Computation by Moment Meth-
ods, MacMillan, New York, 1968
[3] E. Bleszynski, M. Bleszynski and T. Jaroszewicz, Adap-
tive Integral Method for Solving Large-scale Electromagnetic
scattering and Radiation Problems, Radio Science, vol.31, no.5,
pp1225-1251, 1996, Sep.-Oct.
[4] J. Song, C.C. Lu and W.C. Chew, Multilevel Fast
Multipole Algorithm for Electromagnetic Scattering by Large
Complex Objects, IEEE Trans. On Antennas and Propag., Vol.
45, No. 10, pp. 1488-1493, October 1997.
[5] E. Michielsen and A. Boag, A multilevel matrix decom-
position algorithm for analyzing scattering from large struc-
tures, IEEE Trans. on Antennas and Propag., Vol. 44, No. 8.
1086-1093, Aug. 1996.
[6] K. Zhao, M. Vouvakis, and J.-F. Lee, The adaptive cross
approximation algorithm for accelerated method of moment
computations of emc problems, IEEE Trans. on Electromag-
netic Compatibility, vol. 47, no. 4, pp. 763773, Nov. 2005.
[7] M. Bebendorf Approximation of boundary element
matrices, Numer. Math., vol. 86, pp.565 - 589, 2000
Nexio_FRA_EEG13.indd 12 11/16/12 4:19 PM ADs_EEG13.indd 27 11/16/12 2:48 PM
ADs_EEG13.indd 27 11/16/12 2:48 PM
ADs_EEG13.indd 28 3/13/13 2:01 PM
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Tel (+39) 02 4840.1713

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Tel (+39) 06 4080.0491

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Rainford EMC Systems are a global leader in providing
anechoic and shielded chamber solutions.

Solar manufactures Pulsed Transient Generators and Audio
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ADs_EEG13.indd 28 11/16/12 2:49 PM
95
I
T
A
L
I
A
95
Contents | Italia
Guglielmo Marconi fu un famoso inventore
italiano noto come il padre della trasmissione
radio a lunga distanza. Gli stata spesso
attribuita linvenzione della radio.
Marconi inizi i suoi esperimenti di laboratorio
sulle frequenze radio nel 1895. Cre un sistema e
condusse esperimenti con lobiettivo di utilizzare
le onde radio per la trasmissione dei messaggi
telegraci senza li. Invi con successo segnali
senza li a una distanza di circa 2,4 chilometri e
gli fu concesso il primo brevetto al mondo per un sistema di telegraa senza li.
Nel 1901 Marconi utilizz il suo sistema per trasmettere i primi segnali senza li al di l
dellOceano Atlantico, da Poldhu in Cornovaglia a St. Johns in Terranova, a una distanza
di oltre 3300 chilometri.
Marconi ricevette nel 1909 il Premio Nobel per la sica per il suo contributo allo sviluppo della
telegraa senza li. Costitu la Wireless Telegraph & Signal Company in Gran Bretagna nel 1897.
Guglielmo
Marconi (18741937)
PRODOTTI E SERVIZI
RISORSE
ARTICOLO
Impatti Potenziali Delle Armi
Elettromagnetiche Sulle Infrastrutture
Critiche (Situazione al 2012)
DOTT. WILLIAM A. RADASKY, Membro a vita dellIEEE
96
97
98
ITL_TOC_EEG13.indd 95 11/16/12 4:22 PM
Italia | Prodotti e Servizi
96
A
A.H. Systems, Inc.
NARDA Safety Test Solutions s.r.L., Via Leonardo Da
Vinci 213, 20090, Segrate (MI), Italia;
+39-02-22699871; Fax: +39-02-26998700; support@
narda-sts.it; www.AHSystems.com
TESEO S.p.A., C.so Alexander Flemming, 25/27/29,
10040, Druento, Italia; +39-011-9941911; Fax: +011
39-011-9941900; fchinaglia@teseo.net; www.AHSys-
tems.com
Prodotti e servizi: Antenne, Strumentazione per
test, Test
AR / RF Microwave Instrumentation
Teseo S.p.A., C.so Alexander Fleming, 25/27/29,
Druento, Italia 10040;
+39 01 19941911; Fax: +39 01 19941900; Stefano Serra,
sales@teseo.net,; www.teseo.net
Prodotti e servizi: Amplifcatori, Antenne, Cavi e con-
nettori, Stanze e spazi schermati, Oscillazioni di tensione
e sovratensioni temporanee, Strumentazione per test
AFJ INTERNATIONAL Srl
Via G. Watt, Milano, 12 -20143 Italia;
+39 02 89159140; Fax: +39 02 89159226; info@afj.it;
www.afj.it
Prodotti e servizi: Filtri, Strumentazione per test
Arrow Europe
viale F.testi 280 20126 Milano;
+39 02 66 12 51; Fax: +39 02 66 10 5156; www.ar-
roweurope.com
Prodotti e servizi: Ferriti, Cavi e connettori, applica-
zioni di potenza
C
United Kingdom; +44-7817-731-000; Andy Bowne,
Andy.Bowne@carlisleit.com; www.CarlisleIT.com
Prodotti e servizi: Filtri
E
EM Test AG
Volta S.p.A., Via del Vigneto 23, 39100 Bolzano, Italia;
+39 04 71561120; Fax: +39 04 71561100; gba@volta.
it; www.volta.it
Prodotti e servizi: Oscillazioni di tensione e sovraten-
sioni temporanee, Strumentazione per test, Test
EMC Partner
AFJ Istruments Srl, Mr. Marco Mozzi, Via Corno di
Cavento 5; IT - 20148 Milano Italia;
+39 02 91434850; Fax: +39 02 91434877; info@afj-
instruments.com; www.afj-instruments.com
sioni temporanee, Strumentazione per test
ETS - Lindgren
Unit 4, Eastman Way, Pin Green Industrial Area,
Stevenage, Hertfordshire, SG1 4UH, United Kingdom;
+44(0)1438 730700; Fax: +44(0)1438 730750; uk@
ets-lindgren.com; www.ets-lindgren.com
Prodotti e servizi: Antenne, Cavi e connettori, Filtri,
Stanze e spazi schermati, Schermatura, Strumentazione
per test, Test
F
Schaffner EMC Srl, Via Galileo Galile1,471-20092 Cinise-
llo Balsamo (MI), Italia; +39 02 66043045; Fax: +39 02
6123943; italysales@schaffner.com
Technopartner, Via Delle Imprese, 44/46 Ang Murari,
Brembate Sotto 24041 Italia;
+39 03 54874010; Fax: +39 03 54826473; marketing@
technopartner.it; www.fair-rite.com
Prodotti e servizi: Ferritici, Filtri, Stanze e spazi
schermati, Stanze e spazi schermati
Via Reiss Romoli 122/11, 10148 Torino;
+39 011 22 63 016; Fax: + 39 011 22 63 016; systems.pro-
tection@federalmogul.com; www.federalmogul.com/sp
Prodotti e servizi: Schermatura; Cavi
Finmotor srl
Via Edison, 217, 20019 Settimo Milanese, (Milano)
Italia;
+39 02 48910020; Fax: +39 02 48910053; info@fnmotor.
com; http://fnmotor.com
G
Ghiringhelli Mario
Via Luigi Riva, 10 - 21013 Gallarate - (VA) Italia;
+39 03 31 70 05 25; Fax: +39 03 31 70 05 26; info@
ghiringhellimario.com; www.ghiringhellimario.com
Prodotti e servizi: Schermatura
PRODOTTI e
SERVIZI
ITL_PS_R_EEG13.indd 110 11/16/12 7:52 PM
Prodotti e Servizi | Risorse | Italia
97
Gowanda Electronics
Sincron SRL; Via Aldo Moro 55, Gessate (MI), Italia,
20060;
+39 02 95384218; Fax: + 39 02 95384210; sincron@
sincron.it; www.sincron.it.
Prodotti e servizi: induttori
H
Haefely EMC Division
Insitec Elettronica S.r.l., Via del parco degli Scout 7,
20091 - Bresso - Milano, Italia;
+39 02 66501075; +39 02 66501096; Roberto Landrisci-
na, insitec@insitec.it; www.insitec.it
a TESEQ Company
L.P. Instruments, Rome Offce, 00155 Roma (RM) - Via
Bardanzellu, 46;
+39 06 40800491; Fax: +39 06 40800493; paolo.cru-
ciani@lpinstruments.it; www.lpinstruments.it, Trezzano
Offce, 20090 Trezzano Sul Naviglio (MI) - Viale Leonardo
da Vinci, 255/a;
+39 02 48401713; Fax: +39 02 48401582; franco-
parroco@lpinstruments.it: www.lpinstruments.it
Prodotti e servizi: Amplifcatori a RF e microonde
ad alta potenza (Tetrode Tubes, Solid State and TWT)
Instec Filters
Milano Brothers; Via Enrico Fermi 79, Roma, Italia, 00146;
+39 (0) 6888 16531; Fax: +39 (0) 33849 69298; Uriel
Perugia, perugia@milanobro.com; www.milanobro.com.
Spec Tec SRL; Viale Abruzzi, 87, Milano, Italia, 20131;
+39 (0) 2294 03186; Fax: +39 (0) 34844 12911;
Paolo Franciosi, paolo.franciosi@stspectec.it; www.
stspectec.it.
Technopartner; Via delle impresse, 44/46, Brembarte
BG, Italia, 24041;
+39 (0) 3548 74010; Fax: +39 (0) 3548 26473;
Danilo Corsini, direzione@technopartner.it; www.
technopartner.it.
International Business Development
Via San Rocco, 8/a, 25032 Chiari (BS), Italia; +39 03
07100618; Fax: +39 03 07002803; ibd@iol.it; www.
ibdonline.it
Prodotti e servizi: Test
L
LP Instruments
Milano: Via Via Leonardo Da Vinci, 255A, 20090 Trezzano
sul Naviglio (MI) Italia;
+39 02 48401713; Fax: +39 02 48401852;
info@lpinstruments.it; www.lpinstruments.it
Roma: Viale Battista Bardanzellu, 46, 00155 Roma Italia;
+39 06 40800491; Fax: +39 06 40800493; info@lpinstru-
ments.it; www.lpinstruments.it
M
a TESEQ Company
MILMEGA
Narda Safety Test Solutions S.r.l.; Via Leonardo da Vinci,
213, 20090 Segrate (Milano);
+39 02 2699871; Fax: +390226998700; roberto.grego@
narda-sts.it; www.narda-sts.it
Prodotti e servizi: Amplifcatori a RF e microonde ad
alta potenza
N
Narda Safety Test Solutions S.r.l.
Via Leonardo da Vinci, 213 - 20090 Segrate (Milano),
Italia;
+39 02 2699871; Fax: +39 02 26998700; Roberto Grego;
roberto.grego@narda-sts.it; www.narda-sts.it
Prodotti e servizi: Amplifcatori, Antenne, Strumen-
tazione per test
S
Sirces Srl, Via C. Boncompagni 3/B, 20139 Milano Italia;
+39 02 55231395; Fax: +39-0256816112; Mario Crippa,
mario.crippa@sirces.it; www.sirces.it
Prodotti e servizi: Materiali conduttivi, Schermatura
Soliani EMC SRL
Via Varesina 122, 22100 Como, Italia; +39 03 15001112;
Fax: +39 03 1505467; info@solianiemc.com;
www.solianiemc.com
Prodotti e servizi: Materiali conduttivi, Stanze e spazi
schermati, Schermatura
T
Tech-Etch, Inc.
Sirces Srl. Italia, Via C. Boncompagni 3/B, 20139 Milano
- MI, Italia;
+39 02 55231395; Fax: +39 02 56816112; nicola.iaco-
vino@sirces.it; www.tech-etch.com
Prodotti e servizi: Materiali conduttivi, Scher-
matura
Technopartner srl
Via Delle Imprese, 44/46, 24041, Brembate Sotto
(BG), Italia;
+39 035 4874010; Fax: +39 035 4826473; market-
ing@technopartner.it; www.technopartner.it
TEMAS Engineering
Via Milano 72, 22070 Bregnano CO, Italia;
+39 031 772348; Fax: +39 031 773897; info@
temas.it; www.temas.it
TESEO S.p.A.
Corso Alexander Fleming, 25/27/29 10040 Druento
(TO) Italia; +39 011 9941911; Fax: +39 011 9941900;
info@teseo.net; www.teseo.net
Teseq Ltd.
Narda Safety Test Solutions S.r.l.; Via Leonardo da
Vinci, 213, 20090 Segrate (Milano);
+39 02 2699871; Fax: +39 02 26998700; roberto.
grego@narda-sts.it; www.narda-sts.it
Prodotti e servizi: Amplifiers (RF & Microwave),
Antenne, sistemi automotive, Immunit RF, Picco di
e transitori, ESD, Armoniche e Flicker, GTEM-cel-
lule, sistemi di immunit RF, RF Emission Systems,
RF Testsoftware, Taratura e Servizi
RISORSE
IEE EMC SOCIETY ITALIA CHAPTER
Universit degli Studi dellAquila, Via G. Gronchi
18, 67100, LAquila, Italia;
+39 320-923116, Fax: Fax: +39 0862-701979;
Chairman Giulio Antonini, g.antonini@ieee.org;
ing.univaq.it/emc-chap-it
CEI - COMITATO ELETTROTECNICO
ITALIANO
Via Saccardo, 9- 20134, Milano, Italia; +02
21006 226; Fax: +02 21006 222; Punto Vendita,
puntovendita@ceiweb.it; www.ceiweb.it
MINISTERO DELLO SVILUPPO
ECONOMICO
Via Molise 2, 00187 Roma, Italia;
+39 06 4705 1; Fax: +39 06 4788 7748; www.
sviluppoeconomico.gov.it/index.php
96
A
A.H. Systems, Inc.
NARDA Safety Test Solutions s.r.L., Via Leonardo Da
Vinci 213, 20090, Segrate (MI), Italia;
+39-02-22699871; Fax: +39-02-26998700; support@
narda-sts.it; www.AHSystems.com
TESEO S.p.A., C.so Alexander Flemming, 25/27/29,
10040, Druento, Italia; +39-011-9941911; Fax: +011
39-011-9941900; fchinaglia@teseo.net; www.AHSys-
tems.com
Prodotti e servizi: Antenne, Strumentazione per
test, Test
Teseo S.p.A., C.so Alexander Fleming, 25/27/29,
Druento, Italia 10040;
+39 01 19941911; Fax: +39 01 19941900; Stefano Serra,
sales@teseo.net,; www.teseo.net
Prodotti e servizi: Amplifcatori, Antenne, Cavi e con-
nettori, Stanze e spazi schermati, Oscillazioni di tensione
e sovratensioni temporanee, Strumentazione per test
AFJ INTERNATIONAL Srl
Via G. Watt, Milano, 12 -20143 Italia;
+39 02 89159140; Fax: +39 02 89159226; info@afj.it;
www.afj.it
Prodotti e servizi: Filtri, Strumentazione per test
Arrow Europe
viale F.testi 280 20126 Milano;
+39 02 66 12 51; Fax: +39 02 66 10 5156; www.ar-
roweurope.com
Prodotti e servizi: Ferriti, Cavi e connettori, applica-
zioni di potenza
C
United Kingdom; +44-7817-731-000; Andy Bowne,
Andy.Bowne@carlisleit.com; www.CarlisleIT.com
E
EM Test AG
Volta S.p.A., Via del Vigneto 23, 39100 Bolzano, Italia;
+39 04 71561120; Fax: +39 04 71561100; gba@volta.
it; www.volta.it
sioni temporanee, Strumentazione per test, Test
EMC Partner
AFJ Istruments Srl, Mr. Marco Mozzi, Via Corno di
Cavento 5; IT - 20148 Milano Italia;
+39 02 91434850; Fax: +39 02 91434877; info@afj-
instruments.com; www.afj-instruments.com
ETS - Lindgren
Unit 4, Eastman Way, Pin Green Industrial Area,
Stevenage, Hertfordshire, SG1 4UH, United Kingdom;
+44(0)1438 730700; Fax: +44(0)1438 730750; uk@
ets-lindgren.com; www.ets-lindgren.com
Prodotti e servizi: Antenne, Cavi e connettori, Filtri,
Stanze e spazi schermati, Schermatura, Strumentazione
per test, Test
F
Schaffner EMC Srl, Via Galileo Galile1,471-20092 Cinise-
llo Balsamo (MI), Italia; +39 02 66043045; Fax: +39 02
6123943; italysales@schaffner.com
Technopartner, Via Delle Imprese, 44/46 Ang Murari,
Brembate Sotto 24041 Italia;
+39 03 54874010; Fax: +39 03 54826473; marketing@
technopartner.it; www.fair-rite.com
Prodotti e servizi: Ferritici, Filtri, Stanze e spazi
schermati, Stanze e spazi schermati
Via Reiss Romoli 122/11, 10148 Torino;
+39 011 22 63 016; Fax: + 39 011 22 63 016; systems.pro-
tection@federalmogul.com; www.federalmogul.com/sp
Prodotti e servizi: Schermatura; Cavi
Finmotor srl
Via Edison, 217, 20019 Settimo Milanese, (Milano)
Italia;
+39 02 48910020; Fax: +39 02 48910053; info@fnmotor.
com; http://fnmotor.com
G
Ghiringhelli Mario
Via Luigi Riva, 10 - 21013 Gallarate - (VA) Italia;
+39 03 31 70 05 25; Fax: +39 03 31 70 05 26; info@
ghiringhellimario.com; www.ghiringhellimario.com
PRODOTTI e
SERVIZI
Prodotti e Servizi | Risorse | Italia
97
Gowanda Electronics
Sincron SRL; Via Aldo Moro 55, Gessate (MI), Italia,
20060;
+39 02 95384218; Fax: + 39 02 95384210; sincron@
sincron.it; www.sincron.it.
Prodotti e servizi: induttori
H
Haefely EMC Division
Insitec Elettronica S.r.l., Via del parco degli Scout 7,
20091 - Bresso - Milano, Italia;
+39 02 66501075; +39 02 66501096; Roberto Landrisci-
na, insitec@insitec.it; www.insitec.it
a TESEQ Company
L.P. Instruments, Rome Offce, 00155 Roma (RM) - Via
Bardanzellu, 46;
+39 06 40800491; Fax: +39 06 40800493; paolo.cru-
ciani@lpinstruments.it; www.lpinstruments.it, Trezzano
Offce, 20090 Trezzano Sul Naviglio (MI) - Viale Leonardo
da Vinci, 255/a;
+39 02 48401713; Fax: +39 02 48401582; franco-
parroco@lpinstruments.it: www.lpinstruments.it
Prodotti e servizi: Amplifcatori a RF e microonde
ad alta potenza (Tetrode Tubes, Solid State and TWT)
Instec Filters
Milano Brothers; Via Enrico Fermi 79, Roma, Italia, 00146;
+39 (0) 6888 16531; Fax: +39 (0) 33849 69298; Uriel
Perugia, perugia@milanobro.com; www.milanobro.com.
Spec Tec SRL; Viale Abruzzi, 87, Milano, Italia, 20131;
+39 (0) 2294 03186; Fax: +39 (0) 34844 12911;
Paolo Franciosi, paolo.franciosi@stspectec.it; www.
stspectec.it.
Technopartner; Via delle impresse, 44/46, Brembarte
BG, Italia, 24041;
+39 (0) 3548 74010; Fax: +39 (0) 3548 26473;
Danilo Corsini, direzione@technopartner.it; www.
technopartner.it.
International Business Development
Via San Rocco, 8/a, 25032 Chiari (BS), Italia; +39 03
07100618; Fax: +39 03 07002803; ibd@iol.it; www.
ibdonline.it
L
LP Instruments
Milano: Via Via Leonardo Da Vinci, 255A, 20090 Trezzano
sul Naviglio (MI) Italia;
+39 02 48401713; Fax: +39 02 48401852;
info@lpinstruments.it; www.lpinstruments.it
Roma: Viale Battista Bardanzellu, 46, 00155 Roma Italia;
+39 06 40800491; Fax: +39 06 40800493; info@lpinstru-
ments.it; www.lpinstruments.it
M
a TESEQ Company
MILMEGA
Narda Safety Test Solutions S.r.l.; Via Leonardo da Vinci,
213, 20090 Segrate (Milano);
+39 02 2699871; Fax: +390226998700; roberto.grego@
narda-sts.it; www.narda-sts.it
Prodotti e servizi: Amplifcatori a RF e microonde ad
alta potenza
N
Narda Safety Test Solutions S.r.l.
Via Leonardo da Vinci, 213 - 20090 Segrate (Milano),
Italia;
+39 02 2699871; Fax: +39 02 26998700; Roberto Grego;
roberto.grego@narda-sts.it; www.narda-sts.it
Prodotti e servizi: Amplifcatori, Antenne, Strumen-
tazione per test
S
Sirces Srl, Via C. Boncompagni 3/B, 20139 Milano Italia;
+39 02 55231395; Fax: +39-0256816112; Mario Crippa,
mario.crippa@sirces.it; www.sirces.it
Prodotti e servizi: Materiali conduttivi, Schermatura
Soliani EMC SRL
Via Varesina 122, 22100 Como, Italia; +39 03 15001112;
Fax: +39 03 1505467; info@solianiemc.com;
www.solianiemc.com
Prodotti e servizi: Materiali conduttivi, Stanze e spazi
schermati, Schermatura
T
Tech-Etch, Inc.
Sirces Srl. Italia, Via C. Boncompagni 3/B, 20139 Milano
- MI, Italia;
+39 02 55231395; Fax: +39 02 56816112; nicola.iaco-
vino@sirces.it; www.tech-etch.com
Prodotti e servizi: Materiali conduttivi, Scher-
matura
Technopartner srl
Via Delle Imprese, 44/46, 24041, Brembate Sotto
(BG), Italia;
+39 035 4874010; Fax: +39 035 4826473; market-
ing@technopartner.it; www.technopartner.it
TEMAS Engineering
Via Milano 72, 22070 Bregnano CO, Italia;
+39 031 772348; Fax: +39 031 773897; info@
temas.it; www.temas.it
TESEO S.p.A.
Corso Alexander Fleming, 25/27/29 10040 Druento
(TO) Italia; +39 011 9941911; Fax: +39 011 9941900;
info@teseo.net; www.teseo.net
Teseq Ltd.
Narda Safety Test Solutions S.r.l.; Via Leonardo da
Vinci, 213, 20090 Segrate (Milano);
+39 02 2699871; Fax: +39 02 26998700; roberto.
grego@narda-sts.it; www.narda-sts.it
Prodotti e servizi: Amplifiers (RF & Microwave),
Antenne, sistemi automotive, Immunit RF, Picco di
e transitori, ESD, Armoniche e Flicker, GTEM-cel-
lule, sistemi di immunit RF, RF Emission Systems,
RF Testsoftware, Taratura e Servizi
RISORSE
IEE EMC SOCIETY ITALIA CHAPTER
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sviluppoeconomico.gov.it/index.php
DOTT. WILLIAM A. RADASKY
Membro a vita dell'IEEE
COS' LA IEMI?
N
EGLI ULTIMI ANNI, diverse opere holly-
woodiane hanno suggerito che criminali
e terroristi potrebbero avvalersi di armi
elettromagnetiche, ad esempio per cau-
sare un blackout in una parte di Las Vegas
("Ocean's 11") o per mettere fuori uso un
centro informatico antiterrorismo ("24").
Si tratta di pura nzione o di un'eventualit concreta?
Ebbene, in questo caso Hollywood sta aiutando l'opinione
pubblica e le forze di polizia a comprendere le possibilit di
una simile minaccia. In quanto frutto di fantasia, tuttavia,
questi due esempi sono estremi, dal momento che preve-
dono l'uso di un grande generatore per collegarsi ai cavi di
una cabina elettrica o di un congegno esplosivo nel baule
di un'automobile. Nessuna di queste situazioni rispecchia
i modi in cui, probabilmente, le armi elettromagnetiche
sarebbero utilizzate contro infrastrutture critiche.
Alla ne degli anni '90, due stimate organizzazioni scien-
tiche e tecniche internazionali hanno mosso i primi passi
per capire se le armi elettromagnetiche rappresentino una
minaccia per la societ. Nel 1999, nel corso della propria as-
semblea generale a Ottawa, in Canada, l'URSI (Unione Radio
Scientica Internazionale) ha approvato una risoluzione che
imponeva a scienziati e ingegneri di prendere sul serio tale
minaccia e di lavorare per tutelarci da essa. Nello stesso
anno, l'IEC SC 77C (sottocomitato 77C della Commis-
sione Elettrotecnica Internazionale) ha ampliato il proprio
campo di lavoro, iniziando a redigere rapporti e norme
relativi a quello che in origine era stato denito terrorismo
elettromagnetico, successivamente ribattezzato Intentional
Electromagnetic Interference (IEMI, interferenza elettro-
magnetica intenzionale). La IEMI stata formalmente
denita come segue: "Generazione intenzionale e dolosa di
energia elettromagnetica, che introduce disturbi o segnali
negli impianti elettrici ed elettronici interrompendone il
funzionamento, disorientandoli o danneggiandoli a ni
terroristici o criminali."
Il motivo per cui tale minaccia emersa negli ultimi
anni duplice. Innanzitutto, la potenza dellelettronica a
stato solido consente lo sviluppo di armi elettromagnetiche,
che producono elevati livelli di potenza di picco in impulsi
a dimensione temporale molto breve; dal momento che
98
Italia
Radasky_ITL_EEG13.indd 6 11/16/12 4:28 PM ADs_EEG13.indd 29 11/16/12 2:49 PM
DOTT. WILLIAM A. RADASKY
Membro a vita dell'IEEE
COS' LA IEMI?
N
EGLI ULTIMI ANNI, diverse opere holly-
woodiane hanno suggerito che criminali
e terroristi potrebbero avvalersi di armi
elettromagnetiche, ad esempio per cau-
sare un blackout in una parte di Las Vegas
("Ocean's 11") o per mettere fuori uso un
centro informatico antiterrorismo ("24").
Si tratta di pura nzione o di un'eventualit concreta?
Ebbene, in questo caso Hollywood sta aiutando l'opinione
pubblica e le forze di polizia a comprendere le possibilit di
una simile minaccia. In quanto frutto di fantasia, tuttavia,
questi due esempi sono estremi, dal momento che preve-
dono l'uso di un grande generatore per collegarsi ai cavi di
una cabina elettrica o di un congegno esplosivo nel baule
di un'automobile. Nessuna di queste situazioni rispecchia
i modi in cui, probabilmente, le armi elettromagnetiche
sarebbero utilizzate contro infrastrutture critiche.
Alla ne degli anni '90, due stimate organizzazioni scien-
tiche e tecniche internazionali hanno mosso i primi passi
per capire se le armi elettromagnetiche rappresentino una
minaccia per la societ. Nel 1999, nel corso della propria as-
semblea generale a Ottawa, in Canada, l'URSI (Unione Radio
Scientica Internazionale) ha approvato una risoluzione che
imponeva a scienziati e ingegneri di prendere sul serio tale
minaccia e di lavorare per tutelarci da essa. Nello stesso
anno, l'IEC SC 77C (sottocomitato 77C della Commis-
sione Elettrotecnica Internazionale) ha ampliato il proprio
campo di lavoro, iniziando a redigere rapporti e norme
relativi a quello che in origine era stato denito terrorismo
elettromagnetico, successivamente ribattezzato Intentional
Electromagnetic Interference (IEMI, interferenza elettro-
magnetica intenzionale). La IEMI stata formalmente
denita come segue: "Generazione intenzionale e dolosa di
energia elettromagnetica, che introduce disturbi o segnali
negli impianti elettrici ed elettronici interrompendone il
funzionamento, disorientandoli o danneggiandoli a ni
terroristici o criminali."
Il motivo per cui tale minaccia emersa negli ultimi
anni duplice. Innanzitutto, la potenza dellelettronica a
stato solido consente lo sviluppo di armi elettromagnetiche,
che producono elevati livelli di potenza di picco in impulsi
a dimensione temporale molto breve; dal momento che
98
Italia
Radasky_ITL_EEG13.indd 6 11/16/12 4:28 PM ADs_EEG13.indd 29 11/16/12 2:49 PM
Italia
100
l'obiettivo di queste armi produrre
campi elettrici e magnetici a picco ele-
vato, l'energia contenuta negli impulsi
non altrettanto importante. Ci con-
sente l'utilizzo di una fonte di energia
di piccole dimensioni per alimentare
le armi. In secondo luogo, l'elettronica
commerciale e i computer moderni
operano con microprocessori con
velocit di clock misurate in GHz e a
basse tensioni di funzionamento in-
terne e sono pertanto potenzialmente
pi sensibili a interferenze e danni
causati da armi elettromagnetiche
nello stesso intervallo di frequenza
e tensione.
Alcuni casi di minacce/attacchi
con IEMI sono stati ampiamente
documentati, ma molti altri non sono
resi pubblici a causa dell'imbarazzo di
chi li ha subiti o per motivi di sicurezza. Ecco alcuni esempi.
1. In Giappone, due criminali della Yakuza sono stati
sorpresi a utilizzare un'arma elettromagnetica su una mac-
china Pachinko (tipo slot machine) per determinare una
falsa vincita.
2. A San Pietroburgo, in Russia, un criminale si avvalso
di un'arma elettromagnetica per disattivare l'impianto di
allarme di una gioielleria e perpetrare un furto.
3. A Londra, una banca stata oggetto di un tentativo
di estorsione, con la minaccia di utilizzare un'arma elettro-
magnetica sui suoi impianti.
4. A Mosca, un centro di telecomunicazioni stato at-
taccato e messo fuori uso per 24 ore, lasciando 200.000
clienti senza servizio.
5. A inizio marzo 2011, la citt di Seul, in Corea del
Sud, stata attaccata con un'interferenza elettronica che
ha disattivato numerosi impianti GPS utilizzati in campo
industriale. Inoltre, l'esercito sudcoreano segnal che
linterferenza aveva avuto conseguenze negative su alcuni
dei suoi impianti. A inizio 2012 stato segnalato che gli
impianti GPS nella zona dell'aeroporto internazionale di
Incheon, sempre in Corea del Sud, stavano subendo un at-
tacco mediante interferenza elettronica e che le compagnie
aeree erano state allertate.
INTRODUZIONE
Le armi elettromagnetiche si dividono in due categorie:
irradiate e condotte. Entrambi i tipi sono dotati di fonte di
energia (ad esempio una batteria), di un generatore a stato
solido che produce tensioni elevate con rapida variazione
nel tempo e, in alternativa, di un'antenna progettata per
propagare tali campi a una certa distanza dall'arma (campi
irradiati) o di un collegamento ai cavi di un impianto (ten-
sioni condotte). I campi irradiati sono pi essibili (per
chi attacca), ma decrescono rapidamente all'allontanarsi
dall'arma. Le armi condotte richiedono un collegamento
a una fonte di alimentazione o a linee dati esterne a un
edicio, ma l'intera tensione prodotta viene trasmessa ai
circuiti sotto attacco. Si potrebbe pensare che una minaccia
tramite arma condotta non sia temibile; al contrario, stato
vericato che molti edici hanno cabine dati non protette
e prese elettriche esterne all'aperto. Inoltre, chiunque ab-
bia esperienza in materia di impianti di alimentazione pu
stabilire un collegamento alle emissioni a bassa tensione dei
trasformatori che portano all'interno degli edici.
La gura 1 illustra il processo di base per "accoppiare" i
campi irradiati da un'arma elettromagnetica in un edicio.
I campi elettromagnetici indurranno tensioni e correnti sui
cavi esterni e interni (per questi ultimi sono importanti le
propriet di schermatura dell'edicio). Tali tensioni rag-
giungeranno gli apparecchi elettronici, che spesso non
sono in grado di tollerarne il livello. Posizionare elementi
di protezione delle linee (rel di massima/ltri di sovra-
tensione) all'ingresso dei cavi esterni all'edicio e inserire
una schermatura elettromagnetica nelle pareti dello stesso
garantir una certa protezione da questo tipo di minaccia
(maggiori dettagli a seguire).
Per quanto riguarda le infrastrutture critiche (impianti
elettrici, di telecomunicazione, nanziari, acqua, gas na-
turale, eccetera), quasi tutte sono controllate da computer
sempre pi sosticati. Ad esempio, gli impianti elettrici dei
paesi sviluppati stanno installando wattmetri digitali intel-
ligenti in edici privati e commerciali, insieme a impianti di
comunicazione per interpretare i dati. Inoltre, gli impianti
di energia rinnovabile distribuiti necessitano di ulteriori
sensori che ne stabiliscano lo stato di funzionamento, cosic-
ch la rete possa operare in modo e ciente. L'aumento
della quantit di informazioni da elaborare e i requisiti di
comunicazione correlati rendono il sistema pi vulnerabile
da parte di coloro che intendono creare problemi (che si
tratti di pirati informatici, criminali o terroristi).
Sebbene la sicurezza sia sempre un aspetto importante
per le infrastrutture critiche, va ricordato che le serrature
e le recinzioni non costituiscono un ostacolo per le armi
elettromagnetiche. Inoltre, l'autore di un attacco pu tentare
ripetutamente di mandare in tilt una struttura nch non
ci riesce perch nessuno si render conto di cosa sta acca-
dendo nch non verranno osservati problemi ai computer.
Fig. 1. Uno scenario delle interazioni IEMI.
Radasky_ITL_EEG13.indd 8 11/16/12 4:28 PM
Italia
100
l'obiettivo di queste armi produrre
campi elettrici e magnetici a picco ele-
vato, l'energia contenuta negli impulsi
non altrettanto importante. Ci con-
sente l'utilizzo di una fonte di energia
di piccole dimensioni per alimentare
le armi. In secondo luogo, l'elettronica
commerciale e i computer moderni
operano con microprocessori con
velocit di clock misurate in GHz e a
basse tensioni di funzionamento in-
terne e sono pertanto potenzialmente
pi sensibili a interferenze e danni
causati da armi elettromagnetiche
nello stesso intervallo di frequenza
e tensione.
Alcuni casi di minacce/attacchi
con IEMI sono stati ampiamente
documentati, ma molti altri non sono
resi pubblici a causa dell'imbarazzo di
chi li ha subiti o per motivi di sicurezza. Ecco alcuni esempi.
1. In Giappone, due criminali della Yakuza sono stati
sorpresi a utilizzare un'arma elettromagnetica su una mac-
china Pachinko (tipo slot machine) per determinare una
falsa vincita.
2. A San Pietroburgo, in Russia, un criminale si avvalso
di un'arma elettromagnetica per disattivare l'impianto di
allarme di una gioielleria e perpetrare un furto.
3. A Londra, una banca stata oggetto di un tentativo
di estorsione, con la minaccia di utilizzare un'arma elettro-
magnetica sui suoi impianti.
4. A Mosca, un centro di telecomunicazioni stato at-
taccato e messo fuori uso per 24 ore, lasciando 200.000
clienti senza servizio.
5. A inizio marzo 2011, la citt di Seul, in Corea del
Sud, stata attaccata con un'interferenza elettronica che
ha disattivato numerosi impianti GPS utilizzati in campo
industriale. Inoltre, l'esercito sudcoreano segnal che
linterferenza aveva avuto conseguenze negative su alcuni
dei suoi impianti. A inizio 2012 stato segnalato che gli
impianti GPS nella zona dell'aeroporto internazionale di
Incheon, sempre in Corea del Sud, stavano subendo un at-
tacco mediante interferenza elettronica e che le compagnie
aeree erano state allertate.
INTRODUZIONE
Le armi elettromagnetiche si dividono in due categorie:
irradiate e condotte. Entrambi i tipi sono dotati di fonte di
energia (ad esempio una batteria), di un generatore a stato
solido che produce tensioni elevate con rapida variazione
nel tempo e, in alternativa, di un'antenna progettata per
propagare tali campi a una certa distanza dall'arma (campi
irradiati) o di un collegamento ai cavi di un impianto (ten-
sioni condotte). I campi irradiati sono pi essibili (per
chi attacca), ma decrescono rapidamente all'allontanarsi
dall'arma. Le armi condotte richiedono un collegamento
a una fonte di alimentazione o a linee dati esterne a un
edicio, ma l'intera tensione prodotta viene trasmessa ai
circuiti sotto attacco. Si potrebbe pensare che una minaccia
tramite arma condotta non sia temibile; al contrario, stato
vericato che molti edici hanno cabine dati non protette
e prese elettriche esterne all'aperto. Inoltre, chiunque ab-
bia esperienza in materia di impianti di alimentazione pu
stabilire un collegamento alle emissioni a bassa tensione dei
trasformatori che portano all'interno degli edici.
La gura 1 illustra il processo di base per "accoppiare" i
campi irradiati da un'arma elettromagnetica in un edicio.
I campi elettromagnetici indurranno tensioni e correnti sui
cavi esterni e interni (per questi ultimi sono importanti le
propriet di schermatura dell'edicio). Tali tensioni rag-
giungeranno gli apparecchi elettronici, che spesso non
sono in grado di tollerarne il livello. Posizionare elementi
di protezione delle linee (rel di massima/ltri di sovra-
tensione) all'ingresso dei cavi esterni all'edicio e inserire
una schermatura elettromagnetica nelle pareti dello stesso
garantir una certa protezione da questo tipo di minaccia
(maggiori dettagli a seguire).
Per quanto riguarda le infrastrutture critiche (impianti
elettrici, di telecomunicazione, nanziari, acqua, gas na-
turale, eccetera), quasi tutte sono controllate da computer
sempre pi sosticati. Ad esempio, gli impianti elettrici dei
paesi sviluppati stanno installando wattmetri digitali intel-
ligenti in edici privati e commerciali, insieme a impianti di
comunicazione per interpretare i dati. Inoltre, gli impianti
di energia rinnovabile distribuiti necessitano di ulteriori
sensori che ne stabiliscano lo stato di funzionamento, cosic-
ch la rete possa operare in modo e ciente. L'aumento
della quantit di informazioni da elaborare e i requisiti di
comunicazione correlati rendono il sistema pi vulnerabile
da parte di coloro che intendono creare problemi (che si
tratti di pirati informatici, criminali o terroristi).
Sebbene la sicurezza sia sempre un aspetto importante
per le infrastrutture critiche, va ricordato che le serrature
e le recinzioni non costituiscono un ostacolo per le armi
elettromagnetiche. Inoltre, l'autore di un attacco pu tentare
ripetutamente di mandare in tilt una struttura nch non
ci riesce perch nessuno si render conto di cosa sta acca-
dendo nch non verranno osservati problemi ai computer.
Fig. 1. Uno scenario delle interazioni IEMI.
Italia RADASKY
101
potente stato sviluppato dall'aeronautica statunitense a
ni di ricerca. Si chiama simulatore JOLT e le sue capacit
sono state illustrate negli atti dell'IEEE del luglio 2004. Una
fotograa del generatore riportata nella gura 2.
BACKGROUND TECNICO
Caratteristiche delle armi elettromagnetiche
Per comprendere le minacce alle apparecchiature
elettroniche, necessario conoscere i diversi tipi di ambi-
ente elettromagnetico che possono essere prodotti e sono
in grado di creare problemi di funzionamento alle apparec-
chiature esposte. Ci sono due categorie basilari di ambienti
elettromagnetici di interesse: a banda stretta e a banda larga.
Come gi ricordato, ci sono anche due modi fondamentali
di trasmettere tale energia a un impianto: per irradiazione
e per conduzione.
Una forma d'onda a banda stretta quasi una frequenza
singola (solitamente una larghezza di banda inferiore all'1%
della frequenza centrale) di energia trasmessa in un arco di
tempo stabilito (da 100 nanosecondi a pochi microsecondi).
Alcuni degli ambienti in questa categoria includono la
modulazione delle onde sinusoidali, frequenze variabili e
persino applicazioni ripetitive. Solitamente questa catego-
ria di minaccia indicata come microonde ad alta potenza
(HPM, High Power Microwaves), sebbene il termine in
senso lato includa le frequenze al di fuori dell'intervallo
delle microonde.
Una forma d'onda a banda larga a volte denita a banda
ultralarga (UWB, Ultra Wide Band) o a impulso breve (SP,
Short Impulse) di solito implica la trasmissione di un
impulso a dimensione temporale, spesso in modo ripeti-
tivo. Il termine "banda larga" di solito indica che
la potenza della forma d'onda viene prodotta su
una gamma di frequenze sostanziale relativa alla
"frequenza centrale". Ovviamente, molte forme
d'onda dell'impulso non hanno una frequenza cen-
trale esplicita e la comunit tecnica ha deciso che
fossero necessarie denizioni migliori in relazione
alla questione. La IEC ha denito nuovi termini
per descrivere le forme d'onda a banda larga: me-
sobanda, subiperbanda e iperbanda [61000-2-13].
In termini di vulnerabilit degli impianti, la
banda stretta ha solitamente potenza molto elevata,
dal momento che l'energia elettrica viene trasmessa
in una banda a frequenza ristretta. piuttosto facile
trasmettere campi dell'ordine di migliaia di volt/
metro a una singola frequenza. Spesso i malfunzi-
onamenti osservati nelle apparecchiature di test
con forme d'onda a banda stretta sono sintomo di
danni permanenti.
La minaccia a banda larga leggermente di-
versa da questo punto di vista. Dal momento che
un impulso a dimensione temporale produce en-
ergia su molte frequenze contemporaneamente,
l'energia prodotta su ogni singola frequenza
molto inferiore. Ci signica che la probabilit di
danni inferiore che nella banda stretta. Sorgenti
che sono state realizzate sono in grado di produrre
impulsi ripetitivi no a un milione al secondo e
possono continuare per diversi secondi o minuti,
aumentando in tal modo la probabilit di indurre
un malfunzionamento degli impianti. Alcuni di
questi malfunzionamenti possono interferire con le
comunicazioni di dati, causando un modo diverso
di interruzione dei servizi.
Un generatore a banda larga estremamente
Fig. 2. Il generatore JOLT produce un campo elettrico con tempi di
gamma di picco pari a 5,3 MV, una larghezza di impulso di 1 ns e un
tasso di ripetizione di 600 impulsi al secondo.
Italia
102
Vulnerabilit dei prodotti elettronici commerciali
Negli ultimi quindici anni ci sono stati numerosi esperi-
menti volti a testare la risposta delle apparecchiature com-
merciali a minacce a banda stretta e larga analoghe a quelle
della IEMI. In generale, questi test si sono concentrati sui
personal computer (e sulle relative reti), dal momento che
sono largamente utilizzati in molti settori diversi. Inoltre,
i test hanno riguardato sportelli bancomat, dispositivi di
controllo industriale, generatori, componenti Ethernet, reti
WiFi, automobili, elettronica GPS, telefoni cellulari, palmari
e diversi tipi di sensori. Molti articoli di giornale e relazioni
di conferenze descrivono i dettagli di tali esperimenti, per-
tanto in questa sede ci limiteremo a riassumere i risultati.
I moderni computer e altri tipi di apparecchiature che si
avvalgono di microprocessori sembrano essere soggetti a
malfunzionamenti dovuti a campi magnetici a banda stretta
irradiati al di sopra di 30 V/m, sebbene i pi moderni PC
ad alta velocit presentino livelli di suscettibilit superiori
(~300 V/m). Sembrano esserci notevoli variazioni nella
risposta delle apparecchiature, a seconda delle speciche
impostazioni degli esperimenti e della qualit degli invo-
lucri delle apparecchiature stesse. Inoltre, i test eettuati
entro la gamma 1 - 10 GHz sembrano indicare che i mal-
funzionamenti si vericano a livelli di campo inferiori e a
frequenze pi basse.
Test sui campi irradiati a banda larga sono stati condotti
anche da scienziati russi, svedesi, tedeschi e statunitensi. I
test su apparecchiature elettroniche delle dimensioni di un
computer indicano che i livelli di picco del campo elettrico
di ~2 kV/m per impulsi con ampiezze dell'ordine di 200
ps creano problemi all'elettronica (rendendo necessario
un hard reset), con danni che si vericano nella gamma 5
kV/m. La gura 3 mostra un esempio di danno a un circuito
stampato dovuto a una tensione a impulsi che rappresenta
l'accoppiamento a un cavo Ethernet metallico.
Va osservato che questi esperimenti, di solito, sono ef-
fettuati esponendo direttamente le apparecchiature testate
all'antenna che irradia. Chiaramente, se l'apparecchiatura
all'interno di un edicio o in una stanza priva di nestre,
ci sar una riduzione del campo incidente dall'esterno
all'interno (a seconda di come costruito il muro). Ancora,
nella maggior parte degli esperimenti non sono stati esa-
minati approfonditamente la polarizzazione e l'angolo di
incidenza (per questioni di tempi e costi) e pertanto molti
degli eetti osservati durante i test possono vericarsi
anche a livelli di campo inferiori, se la geometria di accop-
piamento ottimale.
Per le minacce IEMI condotte, sembra evidente che se
l'autore dell'attacco ha accesso a cabine di telecomunicazi-
one o cavi di alimentazione esterni, gli risulterebbe facile
riversare segnali dannosi su un edicio. Per le forme d'onda
a impulsi, sembra che le ampiezze di impulso dell'ordine
di 100 microsecondi possano creare danni ai generatori
delle apparecchiature e ai circuiti stampati di interfaccia a
livelli no a un minimo di 500 volt, ma solitamente intorno
ai 2 - 4 kV.
Relazione con gli standard di immunit EMC della IEC
Anche se questi valori di guasto possono sembrare
bassi rispetto alle capacit delle armi elettromagnetiche,
non devono sorprendere. Quando si esaminano i requisiti
di immunit della IEC per i test di compatibilit elettro-
magnetica (EMC) nelle applicazioni quotidiane, insolito
trovare un requisito con livello di campo irradiato a banda
stretta superiore a 10 V/m (per frequenze superiori a 80
MHz). Livelli superiori sono sconsigliati per applicazioni
domestiche o industriali, per via dei costi necessari per
garantire una maggior protezione.
Per quanto riguarda i transitori condotti a banda larga,
gran parte dei test rapidi di EMC svolti sui transitori di
illuminazione ed elettrici si limitano a livelli no a 2 kV.
Solo in casi speciali, ad esempio per le apparecchiature di
uno stabilimento di produzione di energia o di una cabina,
i livelli delle prove di immunit saranno pi alti. Le tipiche
forme d'onda dei test a banda larga condotti sull'EMC (come
l'EFT) hanno tempi di salita no a 5 ns e ampiezze di im-
pulso no a 700 millisecondi (ad es. 61000-4-5). L'ampiezza
di impulso pi stretta per l'EMC pari a 50 ns, molto mag-
giore di quella della tipica minaccia IEMI.
Pertanto chiaro che i livelli di immunit alle interfer-
enze elettromagnetiche dei prodotti elettronici commerciali
sono bassi rispetto ai loro apparenti livelli di sensibilit agli
ambienti elettromagnetici IEMI. Ci indica che i normali
livelli di protezione non sono su cienti per le interferenze
intenzionali. Inoltre, un generatore come JOLT pu pro-
durre 50 kV/m a no a una distanza di 100 metri. Questo
signica, per la maggior parte dei prodotti elettronici non
protetti, danni di entit 10 volte superiore.
Fig. 3. Capacitore danneggiato su una scheda di interfaccia di rete.
Fig. 4. Esempio di rilevatore IEMI.
Italia
102
Vulnerabilit dei prodotti elettronici commerciali
Negli ultimi quindici anni ci sono stati numerosi esperi-
menti volti a testare la risposta delle apparecchiature com-
merciali a minacce a banda stretta e larga analoghe a quelle
della IEMI. In generale, questi test si sono concentrati sui
personal computer (e sulle relative reti), dal momento che
sono largamente utilizzati in molti settori diversi. Inoltre,
i test hanno riguardato sportelli bancomat, dispositivi di
controllo industriale, generatori, componenti Ethernet, reti
WiFi, automobili, elettronica GPS, telefoni cellulari, palmari
e diversi tipi di sensori. Molti articoli di giornale e relazioni
di conferenze descrivono i dettagli di tali esperimenti, per-
tanto in questa sede ci limiteremo a riassumere i risultati.
I moderni computer e altri tipi di apparecchiature che si
avvalgono di microprocessori sembrano essere soggetti a
malfunzionamenti dovuti a campi magnetici a banda stretta
irradiati al di sopra di 30 V/m, sebbene i pi moderni PC
ad alta velocit presentino livelli di suscettibilit superiori
(~300 V/m). Sembrano esserci notevoli variazioni nella
risposta delle apparecchiature, a seconda delle speciche
impostazioni degli esperimenti e della qualit degli invo-
lucri delle apparecchiature stesse. Inoltre, i test eettuati
entro la gamma 1 - 10 GHz sembrano indicare che i mal-
funzionamenti si vericano a livelli di campo inferiori e a
frequenze pi basse.
Test sui campi irradiati a banda larga sono stati condotti
anche da scienziati russi, svedesi, tedeschi e statunitensi. I
test su apparecchiature elettroniche delle dimensioni di un
computer indicano che i livelli di picco del campo elettrico
di ~2 kV/m per impulsi con ampiezze dell'ordine di 200
ps creano problemi all'elettronica (rendendo necessario
un hard reset), con danni che si vericano nella gamma 5
kV/m. La gura 3 mostra un esempio di danno a un circuito
stampato dovuto a una tensione a impulsi che rappresenta
l'accoppiamento a un cavo Ethernet metallico.
Va osservato che questi esperimenti, di solito, sono ef-
fettuati esponendo direttamente le apparecchiature testate
all'antenna che irradia. Chiaramente, se l'apparecchiatura
all'interno di un edicio o in una stanza priva di nestre,
ci sar una riduzione del campo incidente dall'esterno
all'interno (a seconda di come costruito il muro). Ancora,
nella maggior parte degli esperimenti non sono stati esa-
minati approfonditamente la polarizzazione e l'angolo di
incidenza (per questioni di tempi e costi) e pertanto molti
degli eetti osservati durante i test possono vericarsi
anche a livelli di campo inferiori, se la geometria di accop-
piamento ottimale.
Per le minacce IEMI condotte, sembra evidente che se
l'autore dell'attacco ha accesso a cabine di telecomunicazi-
one o cavi di alimentazione esterni, gli risulterebbe facile
riversare segnali dannosi su un edicio. Per le forme d'onda
a impulsi, sembra che le ampiezze di impulso dell'ordine
di 100 microsecondi possano creare danni ai generatori
delle apparecchiature e ai circuiti stampati di interfaccia a
livelli no a un minimo di 500 volt, ma solitamente intorno
ai 2 - 4 kV.
Relazione con gli standard di immunit EMC della IEC
Anche se questi valori di guasto possono sembrare
bassi rispetto alle capacit delle armi elettromagnetiche,
non devono sorprendere. Quando si esaminano i requisiti
di immunit della IEC per i test di compatibilit elettro-
magnetica (EMC) nelle applicazioni quotidiane, insolito
trovare un requisito con livello di campo irradiato a banda
stretta superiore a 10 V/m (per frequenze superiori a 80
MHz). Livelli superiori sono sconsigliati per applicazioni
domestiche o industriali, per via dei costi necessari per
garantire una maggior protezione.
Per quanto riguarda i transitori condotti a banda larga,
gran parte dei test rapidi di EMC svolti sui transitori di
illuminazione ed elettrici si limitano a livelli no a 2 kV.
Solo in casi speciali, ad esempio per le apparecchiature di
uno stabilimento di produzione di energia o di una cabina,
i livelli delle prove di immunit saranno pi alti. Le tipiche
forme d'onda dei test a banda larga condotti sull'EMC (come
l'EFT) hanno tempi di salita no a 5 ns e ampiezze di im-
pulso no a 700 millisecondi (ad es. 61000-4-5). L'ampiezza
di impulso pi stretta per l'EMC pari a 50 ns, molto mag-
giore di quella della tipica minaccia IEMI.
Pertanto chiaro che i livelli di immunit alle interfer-
enze elettromagnetiche dei prodotti elettronici commerciali
sono bassi rispetto ai loro apparenti livelli di sensibilit agli
ambienti elettromagnetici IEMI. Ci indica che i normali
livelli di protezione non sono su cienti per le interferenze
intenzionali. Inoltre, un generatore come JOLT pu pro-
durre 50 kV/m a no a una distanza di 100 metri. Questo
signica, per la maggior parte dei prodotti elettronici non
protetti, danni di entit 10 volte superiore.
Fig. 3. Capacitore danneggiato su una scheda di interfaccia di rete.
Fig. 4. Esempio di rilevatore IEMI.
Italia RADASKY
103
APPROCCIO ALLA PROTEZIONE
L'approccio di base alla protezione
dalla IEMI di un edicio contenente
dispositivi elettronici sensibili con-
siste nell'accertarsi che tutti i cavi che
entrano nell'edicio dall'esterno siano
protetti al punto di ingresso con ltri e
schermature contro la sovratensione e
dotati di un buon impianto di messa a
terra a bassa induttanza. Ci neces-
sario poich il contenuto in frequenza
dei disturbi accoppiati sar superiore a
100 MHz e un semplice cavo di messa
a terra avr un'impedenza elevata. Il
secondo approccio consiste nel ridurre
la possibilit dei campi esterni di pen-
etrare nell'edicio senza attenuazione.
Per i campi che riescono a penetrare,
ci sono modi per arontare i campi
elettromagnetici interni.
Varie opzioni di mitigazione includono:
1. Una migl iore schermatura elettromagnetica
dell'edicio. Il miglioramento dell'e cacia della scherma-
tura dell'edicio nella gamma di frequenze rilevante. Ad es-
empio, le nestre sono permeabili ai campi elettromagnetici
ad alta frequenza e vanno coperte completamente
con fogli metallici.
2. Aumento della possibile distanza di posiz-
ionamento dell'arma tramite elementi di sicurezza
sici, come una recinzione, per tenere lontani gli
assalitori, traendo vantaggio dal decadimento 1/R
dei campi magnetici generati da un'antenna.
3. Uso di allarmi elettromagnetici per moni-
torare l'ambiente elettromagnetico, in modo da
rilevare l'inizio e lo svolgimento di un attacco IEMI.
4. Se la struttura viene penetrata da elevati
livelli di IEMI che si accoppiano ai cavi di rete,
occorre cercare di ridurre tale accoppiamento o di
contenere gli eetti dei segnali accoppiati. Alcuni
possibili approcci per ottenere tale risultato sono:
Disporre i cavi lungo superci
metalliche.
Utilizzare cavi e connettori schermati.
Utilizzare ferriti sui cavi metallici.
Utilizzare dispositivi di protezione dalla
sovratensione nel punto di collegamento
all'apparecchiatura.
Utilizzare cavi ottici privi di metallo per
sostituire i cavi metallici.
Schermatura dell'edicio
A seconda della potenza di un'arma IEMI e del
suo posizionamento rispetto alle apparecchiature
elettroniche, ragionevole pensare che i campi
elettromagnetici di picco esterni saranno superiori
a 10 kV/m. Tali campi potrebbero essere attenuati
solo lievemente nella gamma fra 1 MHz e 5 GHz,
a seconda della schermatura naturale garantita dai
normali metodi di costruzione. La tabella 1 mostra
i risultati di misurazioni eettuate su edici con diversi
tipi di materiali costruttivi. evidente la forte variazione
dell'attenuazione. La colonna a destra riporta i valori misu-
rati, mentre la prima inserisce le misurazioni in categorie
approssimative.
Esistono due approcci per lavorare sull'edicio. Innanzi-
tutto si pu migliorare l'e cacia di schermatura coprendo le
Misurazioni della schermatura
Schermatura nominale, dB Stanza Schermatura, dB
0 Edicio interamente in Legno 2
5
10
20
Stanza sotto solaio in legno
Edicio in legno - stanza 1
4
4
Calcestruzzo senza tondini
Edicio in legno - stanza 2
Calcestruzzo con tondini - stanza 1
5
6
7
11
11
18
30
Edicio in metallo 26
Calcestruzzo con tondini - stanza ben
pretetta
29
Tabella 1. Misurazioni dell'efcacia della schermatura per vari edici e stanze contenenti impianti
elettrici fra 1 MHz e 5 GHz.
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Italia
104
eventuali fnestre aperte, le superfci esterne dell'edifcio che
presentano materiale metallico, inserendo materiale metal-
lico nelle pareti interne dell'edifcio (pannello metallico per
rivestimenti murali) o sostituendo l'edifcio esistente con
un altro interamente metallico (ovviamente l'opzione pi
costosa). Inoltre, indipendentemente dall'approccio scelto,
qualsiasi cavo esterno di alimentazione, comunicazione e
controllo deve essere messo a terra all'ingresso dell'edifcio
con tecniche a bassa induttanza (piastre, non fli).
Allarmi elettromagnetici
Poich in molti casi le armi elettromagnetiche pos-
sono creare forti interferenze in computer e altri dispositivi
elettronici solo durante la fase di trasmissione, pu essere
utile avvalersi di un rilevatore per individuare l'attivit di
un'eventuale sorgente IEMI continua nelle vicinanze. Anche
se l'attacco fosse di breve durata, un rilevatore sarebbe utile
dal punto di vista legale. Considerato l'ampio ventaglio di
ambienti elettromagnetici (dalla banda stretta all'iperbanda),
non facile costruire rilevatori che possano coprire un'ampia
gamma di frequenze e intervalli di tempo, ma la fgura 4
mostra un esempio di rilevatore portatile (tarato per un mas-
simo di 8 GHz). Altri rilevatori possono essere installati in
modo permanente nei pressi di apparecchi elettronici sensibili.
Attivit di protezione
Come spiegato nell'introduzione al presente articolo,
dopo la risoluzione dell'URSI, la IEC ha avviato la propria
opera di standardizzazione, afrontando sistematicamente
la questione IEMI. Ci ha portato alle seguenti attivit in
seno a IEEE, ITU-T e Cigr:
Lo sviluppo degli standard IEMI della IEC iniziato
nel 1999.
Il numero speciale di Transacions dell'IEEE EMC
Society sulla IEMI stato pubblicato nell'agosto del 2004.
La raccomandazione dell'ITU-T per la protezione degli
impianti di telecomunicazione dalla HPEM (IEMI),
K.81, stata pubblicata nel 2009.
La pubblicazione della prassi standard P1642 dell'IEEE
EMC Society, in corso di sviluppo, per la protezione dei
computer pubblicamente accessibili dalla minaccia
della IEMI prevista a inizio 2013.
in corso di sviluppo una brochure C4 Cigr per la pro
tezione dei dispositivi elettronici di controllo di una
cabina elettrica ad alta tensione dalla IEMI; la sua pub
blicazione prevista per la fne del 2012.
Oltre alle attivit di standardizzazione, la Federal Energy
Regulatory Commission e il Ministero dell'energia hanno
valutato l'impatto di diverse minacce elettromagnetiche
sull' industria energetica, e la Camera dei deputati ha
introdotto lo SHIELD Act, HR 668, che, qualora diventi
legge, imporr la protezione dell'infrastruttura elettrica di
NSG 3040
MULTIFUNCTION GENERATOR
GOOd THINGS COME IN
SMALL pACkAGES
It is small, smart and has a high-contrast 7 touchscreen color display and the rotary
wheel for quick input with appealing ease of operation. With its open modular archi-
tecture, the NSG 3040 is the ideal immunity test companion for smaller engineering
labs with amazing capacities for demanding EMC testing companies and for easy
integration into the production process. The electromagnetic pulses generated from
this multipurpose unit are especially tailored for CE marking requirements of the EU
in addition to the national and international standards. Like its big brother, NSG 3060
(6.6 kV), the NSG 3040 also has a SD memory card where test fles can be saved easily
and expanded at any time.
Modular, expandable system
Surge voltage to 4.4 kV
EFT/Burst to 4.8 kV/1 MHz
PQT to 16A/260 VAC & DC
Easy-to-operate 7 touchscreen color display
TA (Test Assistance) for rapid test resolution
Parameters can be changed during test
Sales International Teseq AG Luterbach Switzerland
T + 41 32 681 40 50 www.teseq.com
Italia Radasky
105
produzione energetica all'ingrosso contro i pericoli degli
impulsi elettromagnetici naturali e generati dall'uomo. La
IEMI rientra fra i pericoli generati dall'uomo.
ConClusioni
Sebbene le armi elettromagnetiche possano sembrare
un'invenzione hollywoodiana pensata per l'intrattenimento,
sono una chiara minaccia ai moderni impianti elettronici,
a causa dei progressi dell'elettronica allo stato solido per
la produzione di armi piccole e moderne e della maggior
efcienza di dispositivi elettronici che operano a tensioni
sempre pi basse (e sono pertanto pi sensibili).
Dalla breve panoramica fornita qui, chiaro che la comu-
nit tecnica internazionale ha valutato la situazione e ritiene
che la IEMI sia una minaccia reale per le nostre infrastrutture
critiche. Tramite ricerche e studi tecnici sono stati individuati
diversi modi per rendere la nostra societ meno vulnerabile a
questa minaccia. La sfda per il futuro determinare gli ap-
procci pi economicamente sensati alla protezione, che deve
essere fsica ed elettromagnetica, oltre a includere il rileva-
mento elettromagnetico. Inoltre, la formazione di operatori
per le strutture un obiettivo importante ed auspicabile
che venga promosso dal presente articolo.
Per aPProfondire l'argomento
Standard su HPEM e IEMI redatti da IEC SC 77C (www.
iec.ch)
Special Issue on High-Power Electromagnetics (HPEM)
and Intentional Electromagnetic Interference (IEMI), IEEE
Transactions on Electromagnetic Compatibility, Volume
46, n. 3, Agosto 2004.
High-power electromagnetic immunity guide for tele-
communication systems, Telecommunication Standardiza-
tion Sector di ITU, ITU-T, K.81, Novembre 2009.
Dott. William A. Radasky, Ph.D, P.E., membro a vita dell'IEEE
Il dott. Radasky ha conseguito il Ph.D. in ingegneria elettrica presso
la University of California di Santa Barbara nel 1981. Lavora ad ap-
plicazioni elettromagnetiche ad alta energia da oltre 44 anni. Nel
corso della sua carriera ha pubblicato pi di 400 rapporti, paper e
articoli inerenti gli ambienti elettromagnetici, i loro efetti e la relativa
protezione. Di recente si dedicato intensamente a condurre valuta-
zioni di infrastrutture critiche rispetto alle minacce di HEMP, IEMI
e forti tempeste geomagnetiche. presidente di IEC SC 77C (EMC:
fenomeni transitori ad alta energia), presidente di IEEE EMC Society
TC-5 (elettromagnetismo ad alta energia) e responsabile delle con-
vocazioni dei gruppi di lavoro di Cigr C4. Nel 1984 ha fondato la
Metatech Corporation in California e ne presidente e capo ingegnere.
Il Dott. Radasky molto attivo nel campo della standardizzazione della
compatibilit elettromagnetica e, nel 2004, stato premiato con il Lord
Kelvin Award da parte della IEC per il suo eccezionale contributo alla
standardizzazione internazionale. membro a vita dell'IEEE e profes-
sionista in ingegneria elettrica iscritto all'albo.
Italia
104
eventuali fnestre aperte, le superfci esterne dell'edifcio che
presentano materiale metallico, inserendo materiale metal-
lico nelle pareti interne dell'edifcio (pannello metallico per
rivestimenti murali) o sostituendo l'edifcio esistente con
un altro interamente metallico (ovviamente l'opzione pi
costosa). Inoltre, indipendentemente dall'approccio scelto,
qualsiasi cavo esterno di alimentazione, comunicazione e
controllo deve essere messo a terra all'ingresso dell'edifcio
con tecniche a bassa induttanza (piastre, non fli).
Allarmi elettromagnetici
Poich in molti casi le armi elettromagnetiche pos-
sono creare forti interferenze in computer e altri dispositivi
elettronici solo durante la fase di trasmissione, pu essere
utile avvalersi di un rilevatore per individuare l'attivit di
un'eventuale sorgente IEMI continua nelle vicinanze. Anche
se l'attacco fosse di breve durata, un rilevatore sarebbe utile
dal punto di vista legale. Considerato l'ampio ventaglio di
ambienti elettromagnetici (dalla banda stretta all'iperbanda),
non facile costruire rilevatori che possano coprire un'ampia
gamma di frequenze e intervalli di tempo, ma la fgura 4
mostra un esempio di rilevatore portatile (tarato per un mas-
simo di 8 GHz). Altri rilevatori possono essere installati in
modo permanente nei pressi di apparecchi elettronici sensibili.
Attivit di protezione
Come spiegato nell'introduzione al presente articolo,
dopo la risoluzione dell'URSI, la IEC ha avviato la propria
opera di standardizzazione, afrontando sistematicamente
la questione IEMI. Ci ha portato alle seguenti attivit in
seno a IEEE, ITU-T e Cigr:
Lo sviluppo degli standard IEMI della IEC iniziato
nel 1999.
Il numero speciale di Transacions dell'IEEE EMC
Society sulla IEMI stato pubblicato nell'agosto del 2004.
La raccomandazione dell'ITU-T per la protezione degli
impianti di telecomunicazione dalla HPEM (IEMI),
K.81, stata pubblicata nel 2009.
La pubblicazione della prassi standard P1642 dell'IEEE
EMC Society, in corso di sviluppo, per la protezione dei
computer pubblicamente accessibili dalla minaccia
della IEMI prevista a inizio 2013.
in corso di sviluppo una brochure C4 Cigr per la pro
tezione dei dispositivi elettronici di controllo di una
cabina elettrica ad alta tensione dalla IEMI; la sua pub
blicazione prevista per la fne del 2012.
Oltre alle attivit di standardizzazione, la Federal Energy
Regulatory Commission e il Ministero dell'energia hanno
valutato l'impatto di diverse minacce elettromagnetiche
sull' industria energetica, e la Camera dei deputati ha
introdotto lo SHIELD Act, HR 668, che, qualora diventi
legge, imporr la protezione dell'infrastruttura elettrica di
NSG 3040
MULTIFUNCTION GENERATOR
GOOd THINGS COME IN
SMALL pACkAGES
It is small, smart and has a high-contrast 7 touchscreen color display and the rotary
wheel for quick input with appealing ease of operation. With its open modular archi-
tecture, the NSG 3040 is the ideal immunity test companion for smaller engineering
labs with amazing capacities for demanding EMC testing companies and for easy
integration into the production process. The electromagnetic pulses generated from
this multipurpose unit are especially tailored for CE marking requirements of the EU
in addition to the national and international standards. Like its big brother, NSG 3060
(6.6 kV), the NSG 3040 also has a SD memory card where test fles can be saved easily
and expanded at any time.
Modular, expandable system
Surge voltage to 4.4 kV
EFT/Burst to 4.8 kV/1 MHz
PQT to 16A/260 VAC & DC
Easy-to-operate 7 touchscreen color display
TA (Test Assistance) for rapid test resolution
Parameters can be changed during test
Sales International Teseq AG Luterbach Switzerland
T + 41 32 681 40 50 www.teseq.com
Italia Radasky
105
produzione energetica all'ingrosso contro i pericoli degli
impulsi elettromagnetici naturali e generati dall'uomo. La
IEMI rientra fra i pericoli generati dall'uomo.
ConClusioni
Sebbene le armi elettromagnetiche possano sembrare
un'invenzione hollywoodiana pensata per l'intrattenimento,
sono una chiara minaccia ai moderni impianti elettronici,
a causa dei progressi dell'elettronica allo stato solido per
la produzione di armi piccole e moderne e della maggior
efcienza di dispositivi elettronici che operano a tensioni
sempre pi basse (e sono pertanto pi sensibili).
Dalla breve panoramica fornita qui, chiaro che la comu-
nit tecnica internazionale ha valutato la situazione e ritiene
che la IEMI sia una minaccia reale per le nostre infrastrutture
critiche. Tramite ricerche e studi tecnici sono stati individuati
diversi modi per rendere la nostra societ meno vulnerabile a
questa minaccia. La sfda per il futuro determinare gli ap-
procci pi economicamente sensati alla protezione, che deve
essere fsica ed elettromagnetica, oltre a includere il rileva-
mento elettromagnetico. Inoltre, la formazione di operatori
per le strutture un obiettivo importante ed auspicabile
che venga promosso dal presente articolo.
Per aPProfondire l'argomento
Standard su HPEM e IEMI redatti da IEC SC 77C (www.
iec.ch)
Special Issue on High-Power Electromagnetics (HPEM)
and Intentional Electromagnetic Interference (IEMI), IEEE
Transactions on Electromagnetic Compatibility, Volume
46, n. 3, Agosto 2004.
High-power electromagnetic immunity guide for tele-
communication systems, Telecommunication Standardiza-
tion Sector di ITU, ITU-T, K.81, Novembre 2009.
Dott. William A. Radasky, Ph.D, P.E., membro a vita dell'IEEE
Il dott. Radasky ha conseguito il Ph.D. in ingegneria elettrica presso
la University of California di Santa Barbara nel 1981. Lavora ad ap-
plicazioni elettromagnetiche ad alta energia da oltre 44 anni. Nel
corso della sua carriera ha pubblicato pi di 400 rapporti, paper e
articoli inerenti gli ambienti elettromagnetici, i loro efetti e la relativa
protezione. Di recente si dedicato intensamente a condurre valuta-
zioni di infrastrutture critiche rispetto alle minacce di HEMP, IEMI
e forti tempeste geomagnetiche. presidente di IEC SC 77C (EMC:
fenomeni transitori ad alta energia), presidente di IEEE EMC Society
TC-5 (elettromagnetismo ad alta energia) e responsabile delle con-
vocazioni dei gruppi di lavoro di Cigr C4. Nel 1984 ha fondato la
Metatech Corporation in California e ne presidente e capo ingegnere.
Il Dott. Radasky molto attivo nel campo della standardizzazione della
compatibilit elettromagnetica e, nel 2004, stato premiato con il Lord
Kelvin Award da parte della IEC per il suo eccezionale contributo alla
standardizzazione internazionale. membro a vita dell'IEEE e profes-
sionista in ingegneria elettrica iscritto all'albo.
ADs_EEG13.indd 30 11/16/12 2:50 PM
ADs_EEG13.indd 30 11/16/12 2:50 PM
107
E
S
P
A
A
107
Contents | Espaa
Jos Manuel Rodrguez Delgado fue un profesor
espaol de siologa de la Universidad de Yale ,
conocido por sus investigaciones sobre el control
de la mente mediante la estimulacin elctrica
del cerebro.
Delgado naci en Espaa en 1915. Recibi el
ttulo de Doctor en Medicina de la Universidad
de Madrid, volvi a recibir el ttulo de Doctor
en Medicina, y luego recibi un doctorado en el
Instituto Cajal despus de la Guerra Civil Espaola.
En 1946, Delgado se convirti en miembro de la Universidad de Yale y acept un cargo en
el departamento de siologa en 1950. En el ao 1952, fue coautor de su primer artculo sobre
la implantacin de electrodos en humanos con el n de controlar el cerebro.
La investigacin de Delgado usaba seales elctricas para evocar respuestas en el cerebro,
lo que se poda utilizar para crear emociones y comportamientos. Invent un estimoceptor, una
radio que una simuladores de ondas cerebrales con un receptor que supervisaba las ondas de
la EEG y las devolva a travs de canales de radio separados.
Delgado tambin cre un quemitrodo, que era un dispositivo que se poda implantar y que
liberaba cantidades controladas de un medicamento en reas especcas del cerebro. Tambin
invent una versin primitiva de lo que hoy es un marcapasos.
Jose Manuel
Rodriguez Delgado
(19152011)
PRODUCTOS Y SERVICIOS
LOS RECURSOS
ARTCULO
Cmo proteger la informacin corporativa
condencial del acceso no autorizado
W.G. FANO, Profesor, Facultad de Ingeniera, Universidad de Buenos Aires
Emisiones de RF de las Lmparas
Fluorescentes de bajo consumo
HERBERT MANGSTL, Director de ventas, EMshield GmbH
JORDI FERRI, Director de la divisin de blindaje, AST Modular S.L.
108
111
112
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Espaa | Productos Y Servicios
108
A
A.H. Systems
Wavecontrol; C/Pallars 65-71,
Barcelona, ES-08018, Espaa;
+34 933 208 055, ext 3; Fax: +34 933 208 056;
Jordi Accensi, jordi-accensi@wavecontrol.com;
www.wavecontrol.com;
www.AHSystems.com
Productos y servicios: Antenas, Instrumentacin
para pruebas, Pruebas
Adler Instrumentos
C/Antonio de Cabezn, 83 2 planta,
28034 Madrid, Espaa;
+34 913 584 046; Fax: +34 913 581 383;
info@adler-instrumentos.es; www.adler-instrumentos.
es
Productos y servicios: Instrumentacin para pruebas
APPLUS
LGAI Technological Center, S.A. / Catalunya, Campus
UAB Carretera acceso a la Facultad de Medicina, s/n,
Bellaterra 08193, Barcelona, Espaa;
+34 93-567 20 00;
www.appluscorp.com
Productos y servicios: Pruebas
WAVECONTROL, S.L., C/ Pallars 65-71,
Barcelona, Espaa E-08018;
+34 933 208 055; Fax: +34 933 208 056;
Ernest Cid; ernest-cid@wavecontrol.com;
www.wavecontrol.com; www.arworld.us
Productos y servicios: Amplifcadores, Antenas,
Cables y conectores, Habitaciones y recintos aislados,
Sobrecargas y transitorios, Instrumentacin para
pruebas
Arrow Europe
Albasanz 75 28037 Madrid;
+34 91 304 30 40;
www.arroweurope.com
Productos y servicios: Ferritas, cables y conectores,
aplicaciones de energa
AST
Advanced Shielding Technologies,
Albert Einstein, 43 E-08940
Cornell de Llob. (BCN) Espaa;
+34 934 751 481; +34 616 081 176;
Fax: +34 933 772 880;
Jordi Ferri, Shielding Division Manager,
info@ast-global.com; http://ast-global.com
Productos y servicios: Aislamiento
AT4 Wireless
Parque Tecnologico de Andaluca C/ Severo Ochoa, 2,
29590 Malaga, Espaa;
+34 95 261 91 00; Fax: +34 95 261 91 13;
infoTS@at4wireless.com; www.at4wireless.com
C
CATECHOM
Polytechnic Building, West Area, ground foor, L/02,
Ctra. Madrid-Barcelona, Km. 33.600, 28871 Alcal de
Henares, Madrid, Espaa;
+34 918 856 539; Fax: +34 918 856 652;
catechom@depeca.uah.es; www2.uah.es/catechom
CEMITEC
Polgono Mochol, Plaza Cein 4, 31110, Noain, Espaa;
+34 848 420 800; Fax: +34 948 317 754;
info@cemitec.com; www.cemitec.com
E
Eldonvasa AB
P de la Finca, 1 Edifcio 13, Madrid 28223, Espaa;
+34 953 551 000; Fax: +34 953 551 539;
eldon.es@eldon.com; www.eldon.com
Productos y servicios: Habitaciones y recintos
aislados
EM Test AG
ALAVA Ingenieros S.A., C/ Albasanz 16 - Edifcio Antalia,
+34 91 799 71 35; Fax: +34 91 799 52 33;
alava@alava-ing.es;
www.alava-ing.es
Productos y servicios: Sobrecargas y transitorios,
Pruebas Instrumentation, Pruebas
EMC Partner AG
WAVECONTROL, Pallars, 65 - 71 ES - 08018
Barcelona Espaa;
+34 933 20 80 55; Fax: +34 933 20 80 56;
Jordi Accensi; info@wavecontrol.com; www.wave-
control.com
Instrumentacin para pruebas
F
Redislogar, Anabel Segura, 11 Centro de Negocios
Albatros, Edifcio B 28108 - Alcobendas Madrid, Espaa;
+34 902 509 980; Fax: +34 916 591 436;
redislogar@redislogar.es; www.fair-rite.com
Productos y servicios: Artculos con ferrita, Filtros,
Habitaciones y recintos aislados, Aislamiento
C/Progres, 394, Barcelona 08918;
+34 93 460 24 70; Fax: +34 93 460 18 16;
Productos y servicios: Conjuntos de cables apantalla-
dos y blindados Arneses, Conductos, tuberas blindado
PRODUCTOS Y
SERVICIOS
Spain_PS_R_EEG13.indd 110 11/16/12 8:11 PM
108
A
A.H. Systems
Wavecontrol; C/Pallars 65-71,
Barcelona, ES-08018, Espaa;
+34 933 208 055, ext 3; Fax: +34 933 208 056;
www.wavecontrol.com;
www.AHSystems.com
Productos y servicios: Antenas, Instrumentacin
para pruebas, Pruebas
Adler Instrumentos
C/Antonio de Cabezn, 83 2 planta,
+34 913 584 046; Fax: +34 913 581 383;
info@adler-instrumentos.es; www.adler-instrumentos.
es
APPLUS
LGAI Technological Center, S.A. / Catalunya, Campus
UAB Carretera acceso a la Facultad de Medicina, s/n,
Bellaterra 08193, Barcelona, Espaa;
+34 93-567 20 00;
www.appluscorp.com
Barcelona, Espaa E-08018;
+34 933 208 055; Fax: +34 933 208 056;
Ernest Cid; ernest-cid@wavecontrol.com;
www.wavecontrol.com; www.arworld.us
Productos y servicios: Amplifcadores, Antenas,
Cables y conectores, Habitaciones y recintos aislados,
Sobrecargas y transitorios, Instrumentacin para
pruebas
Arrow Europe
Albasanz 75 28037 Madrid;
+34 91 304 30 40;
www.arroweurope.com
Productos y servicios: Ferritas, cables y conectores,
aplicaciones de energa
AST
Advanced Shielding Technologies,
Albert Einstein, 43 E-08940
Cornell de Llob. (BCN) Espaa;
+34 934 751 481; +34 616 081 176;
Fax: +34 933 772 880;
Jordi Ferri, Shielding Division Manager,
info@ast-global.com; http://ast-global.com
Productos y servicios: Aislamiento
AT4 Wireless
Parque Tecnologico de Andaluca C/ Severo Ochoa, 2,
29590 Malaga, Espaa;
+34 95 261 91 00; Fax: +34 95 261 91 13;
infoTS@at4wireless.com; www.at4wireless.com
C
CATECHOM
Polytechnic Building, West Area, ground foor, L/02,
Ctra. Madrid-Barcelona, Km. 33.600, 28871 Alcal de
Henares, Madrid, Espaa;
+34 918 856 539; Fax: +34 918 856 652;
catechom@depeca.uah.es; www2.uah.es/catechom
CEMITEC
Polgono Mochol, Plaza Cein 4, 31110, Noain, Espaa;
+34 848 420 800; Fax: +34 948 317 754;
info@cemitec.com; www.cemitec.com
E
Eldonvasa AB
P de la Finca, 1 Edifcio 13, Madrid 28223, Espaa;
+34 953 551 000; Fax: +34 953 551 539;
eldon.es@eldon.com; www.eldon.com
Productos y servicios: Habitaciones y recintos
aislados
EM Test AG
ALAVA Ingenieros S.A., C/ Albasanz 16 - Edifcio Antalia,
+34 91 799 71 35; Fax: +34 91 799 52 33;
alava@alava-ing.es;
www.alava-ing.es
Pruebas Instrumentation, Pruebas
EMC Partner AG
WAVECONTROL, Pallars, 65 - 71 ES - 08018
Barcelona Espaa;
+34 933 20 80 55; Fax: +34 933 20 80 56;
Jordi Accensi; info@wavecontrol.com; www.wave-
control.com
Instrumentacin para pruebas
F
Redislogar, Anabel Segura, 11 Centro de Negocios
Albatros, Edifcio B 28108 - Alcobendas Madrid, Espaa;
+34 902 509 980; Fax: +34 916 591 436;
redislogar@redislogar.es; www.fair-rite.com
Productos y servicios: Artculos con ferrita, Filtros,
Habitaciones y recintos aislados, Aislamiento
C/Progres, 394, Barcelona 08918;
+34 93 460 24 70; Fax: +34 93 460 18 16;
Productos y servicios: Conjuntos de cables apantalla-
dos y blindados Arneses, Conductos, tuberas blindado
PRODUCTOS Y
SERVICIOS
Spain_PS_R_EEG13.indd 110 11/16/12 8:11 PM ADs_EEG13.indd 31 11/16/12 2:50 PM
110
G
GCEM
UPC Campus Nord. Building C4, c/ Jordi Girona 1-3.,
08034, Barcelona, Espaa;
+34 934 011 021;
info.gcem@upc.edu; www.upc.edu/web/gcem
Gowanda Electronics
ACAL BFI Iberia; C/Anabel Segura 7, Planta Acceso,
Alcobendas (Madrid), Espaa, 28108;
+ 34 914531160; Fax: + 34 916626837;
concepcion.marcos@bfoptilas.com; www.acalbf.com.
Productos y servicios: Inductores
I
Ibertest International SA
C/ Ramon y Cajal, 35. Pol. Ind Gitesa I, Daganzo de Arriba,
Madrid, 28814, Espaa;
+34 91 884 53 85; Fax: +34 91 884 50 02;
info@ibertest.es; www.ibertestint.com
a TESEQ Company
Adler Instrumentos, S.L., C/Antonio de Cabezon, 83,
28034 Madrid Espana,
+34 913 584 046; Fax: +34 913 581 383;
Millan Fernandez; millan@adler-instrumentos.es;
www.adler-instrumentos.es
Productos y servicios: Disenadores y Fabricantes de
Amplifcadores de Alta Potencia para RF y Microondas
INTA
Ctra. Ajalvir, Km. 4 28850,
Torrejn de Ardoz, Madrid, Espaa;
+34 915 201 200; www.inta.es
ITA
Mara de Luna, n8 50018 Zaragoza, Espaa;
+34 976 010 000; Fax: +34 976 011 888;
www.ita.es
ITE
Parque Tecnolgico de Valencia, Avenida Juan de la
Cierva 24, 46980 Paterna, Valencia, Espaa;
+34 961 366 670; Fax: +34 96 136 66 80;
www.ite.es
L
Labien Tecnalia
Parque Tecnolgico de Bizkaia, Edifcio 700, C/Geldo,
48160, Derio, Espaa;
+34 946 073 300; Fax: +34 946 073 349;
www.labein.es
LACECAL
E.T.S. Ingenieros Industriales, Paseo del Cauce, 59, 47011
Valladolid, Espaa;
+34 983 423 343; Fax: 983 423 996;
emc@lacecal.es; www.lacecal.es
Wavecontrol S.L., Pallars, 65-71,
08018-Barcelona Espaa;
+34 93 320 805-5; Fax: +34 93 320 805-6;
info@wavecontrol.com; www.wavecontrol.com;
www.langer-emv.de
LCOE
Laboratorio Central Ofcial de Electrotecnia, c/ Jos
Gutirrez Abascal, 2, 28006, Madrid, Espaa;
+34 915 625 116; Fax: +34 915 618 818;
www.ffi.es/lcoe/lcoe_portada.asp
Lifasa International Capacitors
c/. Valls, 32 - Polgono Urvasa, 08130, Santa Perptua
De Mogoda, Barcelona, Espaa;
+34 935 747 017; Fax: +34 935 448 433;
info@lifasa.com; www.lifasa.com
Productos y servicios: Filtros
M
a TESEQ Company
MILMEGA
Adler Instrumentos, S.L., C/Antoniode Cabexon, 83-2,
28034 Madrid;
+34 91 358 40 46; Fax: +34 91 358 13 83;
millan@adler-instrumentos.es; www.adler-instru-
mentos.es
P
Premo Group
Grupo Premo C/. Conchita Superva, 13 - 08028, Bar-
celona, Espaa;
+34 934 098 980; Fax: +34 934 906 682;
info@grupopremo.com; www.grupopremo.com
S
RC Microelectrnica S.A., c/ Francesc Moragas 72, nave
3, 08907 L Hospitalet de Llobregat, Barcelona Espaa;
+34 932 602 166; Fax: +34 933 383 602;
Jordi Nogu, Ventas@rcmicro.es; www.rcmicro.es
Productos y servicios: Materiales conductores,
Aislamiento
SGS TECNOS
Trespaderne, Edificio Barajas 1, 28042 Madrid,
Espaa;
+34 913 138 000; Fax: +34 913 138 080;
www.sgs.es
Salicru S.A.
Avda de la Serra, 100, 08460 Santa Mara de
Palautordera, Espaa;
+34 902 482 400; Fax +34 938 481 151;
salicru@salicru.com; www.salicru.com
T
Tecnologica
C/ La Majada, 3, 28760, Tres Cantos, Madrid, Espaa;
+34 918 041 893;
www.alter-spain.com
Teseq Ltd.
28034 Madrid;
+34 91 358 40 46; Fax: +34 91 358 13 83;
mentos.es
Productos y servicios: Amplifcadores (RF y Microon-
das), Antenas, Sistemas Automotrices, de inmunidad
conducida RF, sobretensiones conducidas y Transitorios,
ESD, Armnicos y Flicker, las clulas GTEM, Sistemas de
Inmunidad a la RF, RF Sistemas de Emisin, Testsoftware
RF, Calibracin y Servicio
W
Wavecontrol
Pallars 65-71 Barcelona, E-08018, Espaa;
+34 933 208 055; Fax: +34 933 208 056;
Ernest Cid, Marketing; ernest-cid@wavecontrol.
com;
www.wavecontrol.com
Productos y servicios: Instrumentacin, acceso-
rios y sistemas para EMC, RF, Seguridad Elctrica
y Medida de antenas
ASSOCIATIONS
IEEE EMC SOCIETY CHAPTER SPAIN
Ferran Silva Martinez, GCEM. Universitat Politc-
nica de Catalunya, Campus Nord. Edifici C4, C. Jordi
Girona 1-3, Barcelona 08034, Espaa;
+34 93 401 7826; Fax: +34 93 401 1021;
Ferran.silva@upc.edu
Los Recursos | Espaa
111
NOTIFIED BODIES
ALTER TECHNOLOGY GROUP SPAIN
C/ DE LA MAJADA, N 3 28760 TRES
CANTOS,
Madrid, Espaa;
+34 91 8043292; Fax: +34 91 8041664;
enrique.galiana@al ter-spain. com; www. al ter-
spain.com
APPLUS/LGAI TECHNOLOGICAL
CENTER
Campus UAB, Apto Correos 18, 08193 Bellaterra
(Barcelona), Espaa;
+34 935 672 000; Fax: +34 935 672 001;
ctc@appluscorp.com; www.appluscorp.com
AT4 WIRELESS CENTRO DE
TECNOLOGIA
DE LAS COMUNICACIONES S.A.
Parque Tecnologico de Andalucia Calle Severo
Ochoa, 2, 29590 Campanillas (Malaga), Espaa;
+34 952 619100; Fax: +34 952 619112;
info@at4wireless.com; www.at4wireless.com
FUNDACION TECNALIA RESEARCH &
INNOVATION
Parque Tecnolgico de Vizcaya, Ed. 700, 48160
Derio (Vizcaya), Espaa;
+34 90 276 00 00; Fax: +34 94 607 33 49;
javier.nunez@tecnalia.com; www.tecnalia.com
INSTITUTO NACIONAL DE TECNICA
AEROESPACIAL
Carretera de Ajalvir, km. 4, 28850 Torrejon De Ardoz
(Madrid), Espaa;
+34 91 5201396; Fax: +34 91 5202021;
dejuancr@inta.es
LABORATORIO CENTRAL OFICIAL DE
ELECTROTECNIA
Calle Jos Guterrez Abascal, 2, 28006 Madrid,
Espaa;
+34 91 5625116; Fax: +34 91 5618818;
rguirado@lcoe.etsii.upm.es; www.ffii.es
LABORATORIO ICEM. ASOCIACION
ITACA
Universidad Politcnica de Valencia Camino de la
Vera, s/n Edificio 8G. Acceso C. Nivel 3 46022,
Val enci a, Espaa; +34 963879306; Fax: +34
963877279; icem@itaca.upv.es; www.itaca.upv.es
SGS, TECNOS, S.A.
C/ Trespaderne, 29, 28042 Madrid, Espaa;
+34 91 3138000; Fax: +34 9131380 90;
miguelangel.fernandez@sgs.com
Solid State
TWT Tetrode Tube
Follow Us on Facebook
110
G
GCEM
UPC Campus Nord. Building C4, c/ Jordi Girona 1-3.,
08034, Barcelona, Espaa;
+34 934 011 021;
info.gcem@upc.edu; www.upc.edu/web/gcem
Gowanda Electronics
ACAL BFI Iberia; C/Anabel Segura 7, Planta Acceso,
Alcobendas (Madrid), Espaa, 28108;
+ 34 914531160; Fax: + 34 916626837;
concepcion.marcos@bfoptilas.com; www.acalbf.com.
Productos y servicios: Inductores
I
Ibertest International SA
C/ Ramon y Cajal, 35. Pol. Ind Gitesa I, Daganzo de Arriba,
Madrid, 28814, Espaa;
+34 91 884 53 85; Fax: +34 91 884 50 02;
info@ibertest.es; www.ibertestint.com
a TESEQ Company
Adler Instrumentos, S.L., C/Antonio de Cabezon, 83,
28034 Madrid Espana,
+34 913 584 046; Fax: +34 913 581 383;
Millan Fernandez; millan@adler-instrumentos.es;
www.adler-instrumentos.es
INTA
Ctra. Ajalvir, Km. 4 28850,
Torrejn de Ardoz, Madrid, Espaa;
+34 915 201 200; www.inta.es
ITA
Mara de Luna, n8 50018 Zaragoza, Espaa;
+34 976 010 000; Fax: +34 976 011 888;
www.ita.es
ITE
Parque Tecnolgico de Valencia, Avenida Juan de la
Cierva 24, 46980 Paterna, Valencia, Espaa;
+34 961 366 670; Fax: +34 96 136 66 80;
www.ite.es
L
Labien Tecnalia
Parque Tecnolgico de Bizkaia, Edifcio 700, C/Geldo,
48160, Derio, Espaa;
+34 946 073 300; Fax: +34 946 073 349;
www.labein.es
LACECAL
E.T.S. Ingenieros Industriales, Paseo del Cauce, 59, 47011
Valladolid, Espaa;
+34 983 423 343; Fax: 983 423 996;
emc@lacecal.es; www.lacecal.es
Wavecontrol S.L., Pallars, 65-71,
08018-Barcelona Espaa;
+34 93 320 805-5; Fax: +34 93 320 805-6;
info@wavecontrol.com; www.wavecontrol.com;
www.langer-emv.de
LCOE
Laboratorio Central Ofcial de Electrotecnia, c/ Jos
Gutirrez Abascal, 2, 28006, Madrid, Espaa;
+34 915 625 116; Fax: +34 915 618 818;
www.ffi.es/lcoe/lcoe_portada.asp
Lifasa International Capacitors
c/. Valls, 32 - Polgono Urvasa, 08130, Santa Perptua
De Mogoda, Barcelona, Espaa;
+34 935 747 017; Fax: +34 935 448 433;
info@lifasa.com; www.lifasa.com
M
a TESEQ Company
MILMEGA
28034 Madrid;
+34 91 358 40 46; Fax: +34 91 358 13 83;
mentos.es
P
Premo Group
Grupo Premo C/. Conchita Superva, 13 - 08028, Bar-
celona, Espaa;
+34 934 098 980; Fax: +34 934 906 682;
info@grupopremo.com; www.grupopremo.com
S
RC Microelectrnica S.A., c/ Francesc Moragas 72, nave
3, 08907 L Hospitalet de Llobregat, Barcelona Espaa;
+34 932 602 166; Fax: +34 933 383 602;
Jordi Nogu, Ventas@rcmicro.es; www.rcmicro.es
Productos y servicios: Materiales conductores,
Aislamiento
SGS TECNOS
Trespaderne, Edificio Barajas 1, 28042 Madrid,
Espaa;
+34 913 138 000; Fax: +34 913 138 080;
www.sgs.es
Salicru S.A.
Avda de la Serra, 100, 08460 Santa Mara de
Palautordera, Espaa;
+34 902 482 400; Fax +34 938 481 151;
salicru@salicru.com; www.salicru.com
T
Tecnologica
C/ La Majada, 3, 28760, Tres Cantos, Madrid, Espaa;
+34 918 041 893;
www.alter-spain.com
Teseq Ltd.
28034 Madrid;
+34 91 358 40 46; Fax: +34 91 358 13 83;
mentos.es
Productos y servicios: Amplifcadores (RF y Microon-
das), Antenas, Sistemas Automotrices, de inmunidad
conducida RF, sobretensiones conducidas y Transitorios,
ESD, Armnicos y Flicker, las clulas GTEM, Sistemas de
Inmunidad a la RF, RF Sistemas de Emisin, Testsoftware
RF, Calibracin y Servicio
W
Wavecontrol
Pallars 65-71 Barcelona, E-08018, Espaa;
+34 933 208 055; Fax: +34 933 208 056;
Ernest Cid, Marketing; ernest-cid@wavecontrol.
com;
www.wavecontrol.com
Productos y servicios: Instrumentacin, acceso-
rios y sistemas para EMC, RF, Seguridad Elctrica
y Medida de antenas
ASSOCIATIONS
IEEE EMC SOCIETY CHAPTER SPAIN
Ferran Silva Martinez, GCEM. Universitat Politc-
nica de Catalunya, Campus Nord. Edifici C4, C. Jordi
Girona 1-3, Barcelona 08034, Espaa;
+34 93 401 7826; Fax: +34 93 401 1021;
Ferran.silva@upc.edu
Los Recursos | Espaa
111
NOTIFIED BODIES
ALTER TECHNOLOGY GROUP SPAIN
C/ DE LA MAJADA, N 3 28760 TRES
CANTOS,
Madrid, Espaa;
+34 91 8043292; Fax: +34 91 8041664;
enrique.galiana@al ter-spain. com; www. al ter-
spain.com
APPLUS/LGAI TECHNOLOGICAL
CENTER
Campus UAB, Apto Correos 18, 08193 Bellaterra
(Barcelona), Espaa;
+34 935 672 000; Fax: +34 935 672 001;
ctc@appluscorp.com; www.appluscorp.com
AT4 WIRELESS CENTRO DE
TECNOLOGIA
DE LAS COMUNICACIONES S.A.
Parque Tecnologico de Andalucia Calle Severo
Ochoa, 2, 29590 Campanillas (Malaga), Espaa;
+34 952 619100; Fax: +34 952 619112;
info@at4wireless.com; www.at4wireless.com
FUNDACION TECNALIA RESEARCH &
INNOVATION
Parque Tecnolgico de Vizcaya, Ed. 700, 48160
Derio (Vizcaya), Espaa;
+34 90 276 00 00; Fax: +34 94 607 33 49;
javier.nunez@tecnalia.com; www.tecnalia.com
INSTITUTO NACIONAL DE TECNICA
AEROESPACIAL
Carretera de Ajalvir, km. 4, 28850 Torrejon De Ardoz
(Madrid), Espaa;
+34 91 5201396; Fax: +34 91 5202021;
dejuancr@inta.es
LABORATORIO CENTRAL OFICIAL DE
ELECTROTECNIA
Calle Jos Guterrez Abascal, 2, 28006 Madrid,
Espaa;
+34 91 5625116; Fax: +34 91 5618818;
rguirado@lcoe.etsii.upm.es; www.ffii.es
LABORATORIO ICEM. ASOCIACION
ITACA
Universidad Politcnica de Valencia Camino de la
Vera, s/n Edificio 8G. Acceso C. Nivel 3 46022,
Val enci a, Espaa; +34 963879306; Fax: +34
963877279; icem@itaca.upv.es; www.itaca.upv.es
SGS, TECNOS, S.A.
C/ Trespaderne, 29, 28042 Madrid, Espaa;
+34 91 3138000; Fax: +34 9131380 90;
miguelangel.fernandez@sgs.com
Solid State
TWT Tetrode Tube
Follow Us on Facebook
HERBERT MANGSTL
Director de ventas
EMshield GmbH
JORDI FERRI
Director de la divisin de blindaje
AST Modular S.L.
LA PROTECCIN DE LA INFORMACIN
CORPORATIVA CONFIDENCIAL DEL ACCESO
NO AUTORIZADO ES UN FACTOR CLAVE PARA
MUCHAS ORGANIZACIONES. UN BLINDAJE
ADECUADO PROTEGER LOS DATOS DEL
ESPIONAJE ILEGAL
A
MODO DE EJEMPLO, las deliberaciones del
comit de empresa de Breuninger fueron
interceptadas durante una reunin, lo
que ocasion un polmico escndalo de
espionaje que ha asestado un duro golpe
al fabricante de equipamiento original de
coches de Renault: una vez ms, los titu-
lares relacionados con espectaculares casos de espionaje
industrial ocupan todas las portadas. Los autores de este
tipo de acciones pueden ser servicios secretos, empresas
competidoras y personas inltradas. El objetivo siempre es
el mismo: obtener informacin acerca de los productos y la
estrategia futura de la empresa.
Segn la Ocina del Estado Bvaro para la Proteccin de
Datos en Alemania, el espionaje industrial genera cada ao
miles de millones de euros en daos. Las consecuencias que
conlleva son la prdida de cuota de mercado, la prdida de
liderazgo en el sector tecnolgico y la prdida de puestos
de trabajo para la empresa debido a la prdida de competi-
tividad. Adems, los gastos indirectos son mucho mayores.
Estos daos no se pueden determinar claramente, pero para
la empresa suponen una grave prdida de reputacin como
resultado del delito econmico que se puede traducir incluso
en un descenso del precio de sus acciones. Pero, por qu es
tan aparentemente fcil conseguir informacin empresarial?
Por una razn: los sistemas modernos de comunicaciones
ofrecen muchos puntos dbiles de los que los delincuentes
experimentados y bien preparados se pueden aprovechar.
112
con dencial del acceso no autorizado
Espaa
Ferri_SPA_EEG13.indd 6 11/16/12 4:38 PM
Espaa Mangstl, Ferri
113
Para los Piratas informticos es
muy fcil intercePtar y caPturar
informacin confidencial
La escucha de conversaciones telefnicas, o la intrusin
en el trfco de correo electrnico o fax, no representan un
problema para los profesionales. Los telfonos, la voz sobre
IP, las conferencias inalmbricas y las videoconferencias
ofrecen muchas opciones para que los piratas informticos
se introduzcan sin ser advertidos en el fujo de informacin.
A menudo, estos profesionales utilizan mtodos muy sofsti-
cados y creativos en estas acciones de espionaje. Hasta las
pelculas de espionaje de Hollywood se basan, a menudo,
en tecnologa real, afrma un experto del contraespionaje,
como por ejemplo los smartphones con control remoto, la
fotografa area infrarroja y los ataques por lser a travs
del cristal de las ventanas de las salas de conferencias. La
idea generalizada de que los sencillos micrfonos ocultos
son dispositivos obsoletos y de que la manipulacin de or-
denadores y sistemas de telefona digital los ha desbancado
por completo no es del todo cierta. El acceso no restringido
a la red inalmbrica o la instalacin de programas troyanos
en el ordenador en segundo plano hacen que acceder al
lugar deseado con xito y sin riesgos sea cada vez ms com-
plicado. Para lograr un ataque con resultados inmediatos,
los dispositivos electrnicos convencionales de espionaje
representan, sin duda, un medio econmico de calidad para
conseguir informacin confdencial.
Puntos dbiles del blanco
de las intrusiones
El precio de los micrfonos ocultos es sumamente bajo
y su diseo est muy perfeccionado, por lo que no son
comparables con el clsico mini-transmisor del pasado:
los dispositivos modernos pueden enviar informacin de
forma discontinua; los datos se registran durante la sesin
y, posteriormente, se envan sin ser detectados.
Adicionalmente, la frecuencia de transmisin en estos
nuevos dispositivos; por eso, es cada vez ms difcil detectar
estos micrfonos inteligentes con mtodos convencionales.
Sin embargo, las empresas se pueden proteger por s so-
las. El primer paso es clasifcar la informacin en categoras
propias: qu tipo de informacin confdencial necesita una
estrategia de proteccin digna y especfca?
Tambin es necesario que participen expertos de seguri-
dad con una gran experiencia, que la empresa sensibilice a
sus empleados y que los instruya para que se conciencien
de la importancia de la proteccin de la informacin in-
terna y la estrategia de seguridad. Solo una estrategia de
seguridad consecuente aplicada a la totalidad de la empresa
puede ofrecer una proteccin efcaz. En una empresa, desde
el escalafn ms bajo al ms elevado, se debe establecer
claramente quin puede acceder a qu tipo de informacin
y cundo puede hacerlo.
Prevencin de ataques de
esPionaje ilegal
La importancia del asunto no est nicamente en la par-
ticipacin de expertos en seguridad: los propios empleados
de la empresa deben estar concienciados sobre el problema y
recibir una formacin de calidad. Para que la proteccin sea
efcaz, la estrategia de seguridad debe estar implementada
en toda la empresa.
Si una empresa de espionaje profesional acta como
asesora, comprobar la situacin global actual y los puntos
dbiles, y disear una estrategia contra el espionaje ilegal.
Por ejemplo, con la ayuda de un analizador de espectro
especial se puede comprobar la existencia de transmisores
ilegales en una habitacin.
Con detectores semiconductores se puede verifcar que
no haya micrfonos en las paredes, los techos y el suelo. Las
lneas acopladas ilegales se pueden localizar con analiza-
dores de lnea. Para no interrumpir el trabajo normal, estas
operaciones se suelen llevar a cabo por las tardes, fuera del
horario laboral o los fnes de semana.
alta Proteccin con seguridad
electrnica, mecnica y estructural
Existen tres formas de garantizar el acceso no autorizado a
las reas de acceso restringido de una empresa o el acceso a la
informacin confdencial: la seguridad electrnica, mecnica
y estructural es la nica forma de contrarrestar los ataques.
Desde hace varios aos, la instalacin de una habitacin
a prueba de micrfonos se ha convertido en una prctica
estndar para protegerse contra el espionaje ilegal en em-
presas con una estrategia de seguridad imperativa. En una
habitacin de estas caractersticas, las ondas acsticas y
HERBERT MANGSTL
Director de ventas
EMshield GmbH
JORDI FERRI
Director de la divisin de blindaje
AST Modular S.L.
LA PROTECCIN DE LA INFORMACIN
CORPORATIVA CONFIDENCIAL DEL ACCESO
NO AUTORIZADO ES UN FACTOR CLAVE PARA
MUCHAS ORGANIZACIONES. UN BLINDAJE
ADECUADO PROTEGER LOS DATOS DEL
ESPIONAJE ILEGAL
A
MODO DE EJEMPLO, las deliberaciones del
comit de empresa de Breuninger fueron
interceptadas durante una reunin, lo
que ocasion un polmico escndalo de
espionaje que ha asestado un duro golpe
al fabricante de equipamiento original de
coches de Renault: una vez ms, los titu-
lares relacionados con espectaculares casos de espionaje
industrial ocupan todas las portadas. Los autores de este
tipo de acciones pueden ser servicios secretos, empresas
competidoras y personas inltradas. El objetivo siempre es
el mismo: obtener informacin acerca de los productos y la
estrategia futura de la empresa.
Segn la Ocina del Estado Bvaro para la Proteccin de
Datos en Alemania, el espionaje industrial genera cada ao
miles de millones de euros en daos. Las consecuencias que
conlleva son la prdida de cuota de mercado, la prdida de
liderazgo en el sector tecnolgico y la prdida de puestos
de trabajo para la empresa debido a la prdida de competi-
tividad. Adems, los gastos indirectos son mucho mayores.
Estos daos no se pueden determinar claramente, pero para
la empresa suponen una grave prdida de reputacin como
resultado del delito econmico que se puede traducir incluso
en un descenso del precio de sus acciones. Pero, por qu es
tan aparentemente fcil conseguir informacin empresarial?
Por una razn: los sistemas modernos de comunicaciones
ofrecen muchos puntos dbiles de los que los delincuentes
experimentados y bien preparados se pueden aprovechar.
112
con dencial del acceso no autorizado
Espaa
Espaa Mangstl, Ferri
113
Para los Piratas informticos es
muy fcil intercePtar y caPturar
informacin confidencial
La escucha de conversaciones telefnicas, o la intrusin
en el trfco de correo electrnico o fax, no representan un
problema para los profesionales. Los telfonos, la voz sobre
IP, las conferencias inalmbricas y las videoconferencias
ofrecen muchas opciones para que los piratas informticos
se introduzcan sin ser advertidos en el fujo de informacin.
A menudo, estos profesionales utilizan mtodos muy sofsti-
cados y creativos en estas acciones de espionaje. Hasta las
pelculas de espionaje de Hollywood se basan, a menudo,
en tecnologa real, afrma un experto del contraespionaje,
como por ejemplo los smartphones con control remoto, la
fotografa area infrarroja y los ataques por lser a travs
del cristal de las ventanas de las salas de conferencias. La
idea generalizada de que los sencillos micrfonos ocultos
son dispositivos obsoletos y de que la manipulacin de or-
denadores y sistemas de telefona digital los ha desbancado
por completo no es del todo cierta. El acceso no restringido
a la red inalmbrica o la instalacin de programas troyanos
en el ordenador en segundo plano hacen que acceder al
lugar deseado con xito y sin riesgos sea cada vez ms com-
plicado. Para lograr un ataque con resultados inmediatos,
los dispositivos electrnicos convencionales de espionaje
representan, sin duda, un medio econmico de calidad para
conseguir informacin confdencial.
Puntos dbiles del blanco
de las intrusiones
El precio de los micrfonos ocultos es sumamente bajo
y su diseo est muy perfeccionado, por lo que no son
comparables con el clsico mini-transmisor del pasado:
los dispositivos modernos pueden enviar informacin de
forma discontinua; los datos se registran durante la sesin
y, posteriormente, se envan sin ser detectados.
Adicionalmente, la frecuencia de transmisin en estos
nuevos dispositivos; por eso, es cada vez ms difcil detectar
estos micrfonos inteligentes con mtodos convencionales.
Sin embargo, las empresas se pueden proteger por s so-
las. El primer paso es clasifcar la informacin en categoras
propias: qu tipo de informacin confdencial necesita una
estrategia de proteccin digna y especfca?
Tambin es necesario que participen expertos de seguri-
dad con una gran experiencia, que la empresa sensibilice a
sus empleados y que los instruya para que se conciencien
de la importancia de la proteccin de la informacin in-
terna y la estrategia de seguridad. Solo una estrategia de
seguridad consecuente aplicada a la totalidad de la empresa
puede ofrecer una proteccin efcaz. En una empresa, desde
el escalafn ms bajo al ms elevado, se debe establecer
claramente quin puede acceder a qu tipo de informacin
y cundo puede hacerlo.
Prevencin de ataques de
esPionaje ilegal
La importancia del asunto no est nicamente en la par-
ticipacin de expertos en seguridad: los propios empleados
de la empresa deben estar concienciados sobre el problema y
recibir una formacin de calidad. Para que la proteccin sea
efcaz, la estrategia de seguridad debe estar implementada
en toda la empresa.
Si una empresa de espionaje profesional acta como
asesora, comprobar la situacin global actual y los puntos
dbiles, y disear una estrategia contra el espionaje ilegal.
Por ejemplo, con la ayuda de un analizador de espectro
especial se puede comprobar la existencia de transmisores
ilegales en una habitacin.
Con detectores semiconductores se puede verifcar que
no haya micrfonos en las paredes, los techos y el suelo. Las
lneas acopladas ilegales se pueden localizar con analiza-
dores de lnea. Para no interrumpir el trabajo normal, estas
operaciones se suelen llevar a cabo por las tardes, fuera del
horario laboral o los fnes de semana.
alta Proteccin con seguridad
electrnica, mecnica y estructural
Existen tres formas de garantizar el acceso no autorizado a
las reas de acceso restringido de una empresa o el acceso a la
informacin confdencial: la seguridad electrnica, mecnica
y estructural es la nica forma de contrarrestar los ataques.
Desde hace varios aos, la instalacin de una habitacin
a prueba de micrfonos se ha convertido en una prctica
estndar para protegerse contra el espionaje ilegal en em-
presas con una estrategia de seguridad imperativa. En una
habitacin de estas caractersticas, las ondas acsticas y
Espaa
114
posible crear una habitacin completamente blindada con
paneles modulares que se unen como si fueran las piezas
de un rompecabezas. De este modo, se pueden construir
habitaciones de cualquier tamao como habitaciones in-
dependientes o una habitacin dentro de otra. El diseo
modular de este tipo de estructuras ofrece un montaje
rpido y exible, que se adapta a espacios de diferentes
tamaos, evitando la necesidad de construir una habitacin
tradicional. Adems, la posibilidad de reutilizarlo es una
ventaja en el caso de que en el futuro se quiera modicar la
distribucin de la habitacin.
electromagnticas se absorben, por lo que es imposible
conseguir informacin desde el exterior.
EL BLINDAJE SE PUEDE ADAPTAR A LA
ARQUITECTURA DE LA HABITACIN
Un sistema de blindaje bien diseado encaja a la perfec-
cin en el diseo arquitectnico original de una habitacin,
sin que ste sea detectable.
La expresin La forma sigue a la funcin es un principio
cuyo origen se debe al sector del diseo y la arquitectura.
La forma y la composicin de las cosas deberan ser con-
secuencia directa de su funcin y su uso. Con los sistemas
de blindaje arquitectnico, el diseo y la arquitectura son
los puntos clave. Este concepto se adapta completamente a
habitaciones de cualquier forma y distribucin. El sistema
de blindaje es compatible con cualquier tipo de acabado
tradicional de techos, paredes y suelos. En combinacin con
soluciones inteligentes, las habitaciones blindadas se pueden
construir con la apariencia de una habitacin tradicional sin
blindaje. El componente principal del blindaje estructural es
el material de blindaje especial, que elimina la necesidad de
aadir una estructura de refuerzo adicional. Es transpirable
y permite colocar materiales de revestimiento tradicionales
en suelos y paredes. La instalacin es similar a la del papel
pintado convencional.
Adems, existe la opcin de construir nuevas habitacio-
nes empleando tcnicas modulares. Con esta tecnologa, es
ITEM
Free Subscription
Exploring Electronics &
Their Environments
Espaa
114
posible crear una habitacin completamente blindada con
paneles modulares que se unen como si fueran las piezas
de un rompecabezas. De este modo, se pueden construir
habitaciones de cualquier tamao como habitaciones in-
dependientes o una habitacin dentro de otra. El diseo
modular de este tipo de estructuras ofrece un montaje
rpido y exible, que se adapta a espacios de diferentes
tamaos, evitando la necesidad de construir una habitacin
tradicional. Adems, la posibilidad de reutilizarlo es una
ventaja en el caso de que en el futuro se quiera modicar la
distribucin de la habitacin.
electromagnticas se absorben, por lo que es imposible
conseguir informacin desde el exterior.
EL BLINDAJE SE PUEDE ADAPTAR A LA
ARQUITECTURA DE LA HABITACIN
Un sistema de blindaje bien diseado encaja a la perfec-
cin en el diseo arquitectnico original de una habitacin,
sin que ste sea detectable.
La expresin La forma sigue a la funcin es un principio
cuyo origen se debe al sector del diseo y la arquitectura.
La forma y la composicin de las cosas deberan ser con-
secuencia directa de su funcin y su uso. Con los sistemas
de blindaje arquitectnico, el diseo y la arquitectura son
los puntos clave. Este concepto se adapta completamente a
habitaciones de cualquier forma y distribucin. El sistema
de blindaje es compatible con cualquier tipo de acabado
tradicional de techos, paredes y suelos. En combinacin con
soluciones inteligentes, las habitaciones blindadas se pueden
construir con la apariencia de una habitacin tradicional sin
blindaje. El componente principal del blindaje estructural es
el material de blindaje especial, que elimina la necesidad de
aadir una estructura de refuerzo adicional. Es transpirable
y permite colocar materiales de revestimiento tradicionales
en suelos y paredes. La instalacin es similar a la del papel
pintado convencional.
Adems, existe la opcin de construir nuevas habitacio-
nes empleando tcnicas modulares. Con esta tecnologa, es
ITEM
Free Subscription
Exploring Electronics &
Their Environments
Espaa MANGSTL, FERRI
115
HABITACIN BLINDADA:
ATENUACIN HASTA 80 DB
Para la aceptacin del usuario, es extremadamente
importante que las habitaciones blindadas no dieran de
las habitaciones normales. Instalada por especialistas, es
posible conseguir una atenuacin de 80 dB, equivalente a
un factor de 10 000, garantizada en una gama de frecuencias
de entre 30 MHz a 6 GHz Uno de los principales sectores
actuales del blindaje arquitectnico son las zonas con
proteccin contra espionaje. En una ocina o una sala de
conferencias, las posibilidades existentes para el espionaje
ilegal son variadas. La emisin pasiva de informacin crtica
se presenta en todos los lugares en los que se utilizan dis-
positivos informticos perifricos como tarjetas grcas y de
vdeo, puertos de impresora, monitores, teclados y unidades
de disco duro. La posibilidad del espionaje existe mediante
el usode transmisores telefnicos o mini-transmisores.
Adems, la interfaz de datos de los telfonos mviles puede
transmitir datos e imgenes sin necesidad de registrarse.
HABITACIONES SEGURAS CON LA APARIENCIA
DE UNA HABITACIN NORMAL
En estas zonas, el sistema de blindaje abarca todas las po-
sibilidades existentes, basndose en sistemas de proteccin
invisibles de techo, paredes y suelo, con soluciones inteligentes
para las ventanas, las puertas y los dispositivos electrnicos.
Una habitacin equipada de estas caractersticas ofrece al
usuario la apariencia de una habitacin normal y la seguri-
dad de poder mantener sus conversaciones condenciales
en una habitacin a prueba de micrfonos con el n de
proteger su informacin. Para proteger la palabra hablada,
se instala un aislamiento acstico adicional en el sistema
de blindaje electromagntico y generadores de vibraciones,
que enmascaran las vibraciones producidas por las ondas
sonoras de la conversacin.
SALAS DE TRABAJO CON
BLINDAJE ELECTROMAGNTICO
Desde un laboratorio de investigacin de una empresa in-
dustrial que desarrolla nuevos productos hasta laboratorios
en el sector farmacutico para los estudios de larga duracin
durante los que se prueba la ecacia de nuevos medicamen-
tos, surge la necesidad de proteger estas habitaciones con
un sistema de blindaje electromagntico.
En estas aplicaciones, es primordial evitar la intercep-
tacin y la lectura de datos o informacin condencial; por
ello, las mediciones se deben efectuar sin ruidos electro-
magnticos externos, de modo que no haya interpretaciones
errneas de los resultados de las pruebas.
Debido a la ilimitada variedad de este tipo de habitacio-
nes, incluyendo ventanas, habitaciones hmedas, salas blan-
cas y zonas destinadas a albergar dispositivos electrnicos,
una solucin exible ideal para este tipo de aplicaciones es
una habitacin individual modular con sistema de blindaje.
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W.G. FANO
Profesor, Facultad de Ingeniera
Universidad de Buenos Aires

RESUMEN
R
ECIENTEMENTE LAS lmparas Fluorescentes,
y en particular las lmparas fluorescentes
compactas son usadas en todo el mundo para
reemplazar las lmparas incandescentes,
esta nueva tecnologa tiene el benecio de un
bajo consumo de energa aproximadamente 5
veces menos que las incandescentes, y esto es
debido al balasto electrnico de alta frecuencia, que podra
interferir con el equipamiento electrnico por la generacin
de ondas electromagnticas producidas por el circuito
electrnico y e mecanismo de arco de la lmpara, y tambin
las emisiones conducidas por las lneas de alimentacin.
Este artculo est dedicado a la medicin y al estudio de
las emisiones caractersticas de las lmparas uorescentes
compactas a pequeas distancias.
INTRODUCCION
Lmparas incandescentes
Una lmpara incandescente tradicional produce luz cu-
ando circula una corriente por el lamento de Tungsteno
y dicho lamento se encuentra dentro de un gas inerte,
y alcanzar altas temperaturas por el efecto Joule. Esta
tecnologa tiene una baja eciencia, y mas an, el tiempo
de vida de esta lmpara es relativamente corta, porque el
lamento se encontrar a altas temperaturas y se vapor-
izar gradualmente en las paredes de vidrio de la lmpara,
y eventualmente se romper despus de algunas cientos de
horas de operacin[4].
El lamento de una lmpara incandescente es simple-
mente un resistor que depende de la temperatura, sta
resistencia depender principalmente de la longitud, ancho
y material del lamento.
Si se aplica energa elctrica, sta se convierte en calor
en el lamento, donde la temperatura crecer.
La temperatura del lamento se eleva hasta que se de-
shace de calor a la misma tasa que el calor se genera en el
lamento. Idealmente, en el lamento se convertir energa
calorca en energa radiada, aunque una pequea cantidad
de energa calorca se eliminan tambin por la conduc-
cin trmica del lamento. La temperatura del lamento
116
Espaa
Fano_SPA_EEG13.indd 6 11/16/12 4:40 PM
Espaa Fano
117
ser muy alta, generalmente mas de 2000C. A estas altas
temperaturas, la radiacin trmica del flamento incluye
una signifcativa cantidad de luz visible. La pobre efciencia
de esta lmpara reside en el hecho de que el flamento de
Tungsteno radia mayormente en longitudes de onda cor-
respondiente al infrarojo al menos a las temperaturas que
soporta el flamento [7].
La lmpara incandescente est tambin radiando a una
frecuencia de 50/60Hz dependiendo del pas, porque de-
pende de la corriente suministrada al flamento, aunque esta
radiacin ser enmascarada por la radiacin producida a
esa frecuencia por las lneas de transmisin que distribuyen
energa elctrica en la ciudad.
Lmparas fuorescentes
Hay una gran variedad de lmparas no incandescentes
de luz visible, que son empleadas para ambientes internos o
externos de edifcios. La mayora de estas lmparas se basan
en la descarga elctrica atravs de un gas como el mercurio,
o de gases nobles como nen, argn y xenn.
La generacin de luz visible en lmparas de descarga
gaseosa se basa en la colisin entre tomos e iones en el gas
con una corriente elctrica que pasa entre dos electrodos
colocados en los extremos de la lmpara [8].
El tubo de vidrio de una lmpara fuorescente comn
tiene un recubrimiento de fsforo en la superfcie interna del
vidrio, y el tubo se llena con vapor de mercurio a muy baja
presin (ver Fig. 2). Si se aplica una diferencia de potencial
entre los electrodos del tubo, se producir una corriente de
electrones que fuye de un electrodo hacia el otro. Cuando
los electrones coalisionan con los tomos de mercurio, stos
se excitan, llendo a estados de energa ms altos. Esta energa
es liberada en forma de radiacin ultravioleta cuando los
electrones de mercurio retornan al estado de energa base.
La radiacin ultravioleta adems energizar la cara interna
de la lmpara que est recubierta de fsforo, causando la
emisin de luz blanca que se observa desde las lmparas
fuorescentes. Las lmparas fuorescentes son de dos a cu-
atro veces mas efcientes para emitir en logitudes de ondas
visibles, produciendo menos cantidad de calor generado,
aproximadamente de diez a veinte veces menos de calor
generado que las lmparas incandescentes [8].
Una caracterstica de las lmparas fuorescentes es que
generan una serie de longitudes de onda que estn concen-
tradas en pequeas bandas del espectro electromagntico,
que se denominan lneas espectrales. Como consecuencia,
estas fuentes no producen un espectro de iluminacin
continua, como el caso de las lmparas incandecentes. Es
posible disear las lmparas de descarga gaseosas que emi-
tan un espectro casi continuo, adems de los espectros de
Fig.1 lmparas incadescentes y la distribucin espectral de lmparas.
Fig.2 Lmparas de vapor de mercurio fuorescentes. Ref: Olympus
Microscopy Resource Center. http://www.olympusmicro.com/primer/
lightandcolor/lightsourcesintro.html
Fig.3 Espectro de fuentes luminosas comunes, ref: Olympus
W.G. FANO
Profesor, Facultad de Ingeniera
Universidad de Buenos Aires

RESUMEN
R
ECIENTEMENTE LAS lmparas Fluorescentes,
y en particular las lmparas fluorescentes
compactas son usadas en todo el mundo para
reemplazar las lmparas incandescentes,
esta nueva tecnologa tiene el benecio de un
bajo consumo de energa aproximadamente 5
veces menos que las incandescentes, y esto es
debido al balasto electrnico de alta frecuencia, que podra
interferir con el equipamiento electrnico por la generacin
de ondas electromagnticas producidas por el circuito
electrnico y e mecanismo de arco de la lmpara, y tambin
las emisiones conducidas por las lneas de alimentacin.
Este artculo est dedicado a la medicin y al estudio de
las emisiones caractersticas de las lmparas uorescentes
compactas a pequeas distancias.
INTRODUCCION
Lmparas incandescentes
Una lmpara incandescente tradicional produce luz cu-
ando circula una corriente por el lamento de Tungsteno
y dicho lamento se encuentra dentro de un gas inerte,
y alcanzar altas temperaturas por el efecto Joule. Esta
tecnologa tiene una baja eciencia, y mas an, el tiempo
de vida de esta lmpara es relativamente corta, porque el
lamento se encontrar a altas temperaturas y se vapor-
izar gradualmente en las paredes de vidrio de la lmpara,
y eventualmente se romper despus de algunas cientos de
horas de operacin[4].
El lamento de una lmpara incandescente es simple-
mente un resistor que depende de la temperatura, sta
resistencia depender principalmente de la longitud, ancho
y material del lamento.
Si se aplica energa elctrica, sta se convierte en calor
en el lamento, donde la temperatura crecer.
La temperatura del lamento se eleva hasta que se de-
shace de calor a la misma tasa que el calor se genera en el
lamento. Idealmente, en el lamento se convertir energa
calorca en energa radiada, aunque una pequea cantidad
de energa calorca se eliminan tambin por la conduc-
cin trmica del lamento. La temperatura del lamento
116
Espaa
Espaa Fano
117
ser muy alta, generalmente mas de 2000C. A estas altas
temperaturas, la radiacin trmica del flamento incluye
una signifcativa cantidad de luz visible. La pobre efciencia
de esta lmpara reside en el hecho de que el flamento de
Tungsteno radia mayormente en longitudes de onda cor-
respondiente al infrarojo al menos a las temperaturas que
soporta el flamento [7].
La lmpara incandescente est tambin radiando a una
frecuencia de 50/60Hz dependiendo del pas, porque de-
pende de la corriente suministrada al flamento, aunque esta
radiacin ser enmascarada por la radiacin producida a
esa frecuencia por las lneas de transmisin que distribuyen
energa elctrica en la ciudad.
Lmparas fuorescentes
Hay una gran variedad de lmparas no incandescentes
de luz visible, que son empleadas para ambientes internos o
externos de edifcios. La mayora de estas lmparas se basan
en la descarga elctrica atravs de un gas como el mercurio,
o de gases nobles como nen, argn y xenn.
La generacin de luz visible en lmparas de descarga
gaseosa se basa en la colisin entre tomos e iones en el gas
con una corriente elctrica que pasa entre dos electrodos
colocados en los extremos de la lmpara [8].
El tubo de vidrio de una lmpara fuorescente comn
tiene un recubrimiento de fsforo en la superfcie interna del
vidrio, y el tubo se llena con vapor de mercurio a muy baja
presin (ver Fig. 2). Si se aplica una diferencia de potencial
entre los electrodos del tubo, se producir una corriente de
electrones que fuye de un electrodo hacia el otro. Cuando
los electrones coalisionan con los tomos de mercurio, stos
se excitan, llendo a estados de energa ms altos. Esta energa
es liberada en forma de radiacin ultravioleta cuando los
electrones de mercurio retornan al estado de energa base.
La radiacin ultravioleta adems energizar la cara interna
de la lmpara que est recubierta de fsforo, causando la
emisin de luz blanca que se observa desde las lmparas
fuorescentes. Las lmparas fuorescentes son de dos a cu-
atro veces mas efcientes para emitir en logitudes de ondas
visibles, produciendo menos cantidad de calor generado,
aproximadamente de diez a veinte veces menos de calor
generado que las lmparas incandescentes [8].
Una caracterstica de las lmparas fuorescentes es que
generan una serie de longitudes de onda que estn concen-
tradas en pequeas bandas del espectro electromagntico,
que se denominan lneas espectrales. Como consecuencia,
estas fuentes no producen un espectro de iluminacin
continua, como el caso de las lmparas incandecentes. Es
posible disear las lmparas de descarga gaseosas que emi-
tan un espectro casi continuo, adems de los espectros de
Fig.1 lmparas incadescentes y la distribucin espectral de lmparas.
Fig.2 Lmparas de vapor de mercurio fuorescentes. Ref: Olympus
Fig.3 Espectro de fuentes luminosas comunes, ref: Olympus
Espaa
118
lnea inherente en la mayora de estas lmparas. La tcnica
ms comn es recubrir la superfcie interior del tubo con
partculas de fsforo, que absorben la radiacin emitida por
el gas brillante y lo convierten en un amplio espectro de luz
visible que van del azul al rojo.
Historia de las lmparas Fluorescentes compactas (CFL)
Las lmparas f luorescentes compactas helicoidales
fueron inventadas por Ed Hammer de GE en 1976.
La propuesta consista en un tubo de forma de hlice largo
y delgado de alta efciencia, de modo que se ajusten al tamao
y distribucin de la luz de una lmpara incandescente, con
un funcionamiento en fro, es decir sin generar calor.
Sin embargo, GE consider que enrollar tubos de vidrio
en esta forma era complejo y no era compatible con tcnicas
de alta velocidad de fabricacin, y la idea fue archivada [1] [2].
No fue sino hasta 1992 que GE complet una mquina
para curvar el cristal, y las muestras de la lmpara llamada
Heliax que produjo fueron enviadas al mercado ese mismo
ao. Lamentablemente la lmpara nunca se produjo a escala,
debido a la extrema difcultad en el control del proceso de
produccin [1] [2]. La introduccin comercial de la lmpara
tendra que esperar otros tres aos hasta que la empresa
china, Shanghai Xiangshan, que comercializ con xito el
diseo. Esta fue la primera lmpara de Phillips de 2003 [1].
Lmparas fuorescentes compactas
Las lmparas fuorescentes se han utilizado en la ofcina
y otros entornos comerciales, iluminando con una efcien-
cia de 5-10 veces mayor que las bombillas de flamento de
tungsteno. El tubo fuorescente contiene un electrodo con
un gas que tpicamente es una mezcla de argn / criptn
y una pequea cantidad de mercurio. Se trata de una lm-
para de descarga, la descarga se inicia por un iniciador o
arrancador y despus es controlado por un balasto, que es
tradicionalmente un inductor con ncleo de hierro. Cuando
el arco se alcanza, la corriente fuye y el circuito opera a
una frecuencia de suministro de la red. Cuando el funcio-
namiento es normal, las emisiones de radiofrecuencia de
una lmpara fuorescente a frecuencia de la red se producen
debido a un arco en los electrodos.
El funcionamiento de una lmpara fuorescente a una
frecuencia ms alta reduce el parpadeo visual, y reduce el
zumbido, aumentando la facilidad de regulacin y tambin
la efciencia hasta aproximadamente 25%. Por esa razn es
deseable una mayor frecuencia de operacin usando balasto
electrnico de conmutacin [5].
Por qu se utilizan las lmparas fuorescentes compac-
tas (CFL)? En la fgura 4 se puede observar una imagen de
una lmpara de este tipo. La caracterstica ms importante
de por qu la lmpara fuorescente compacta se utiliza, es
por el consumo elctrico. Esto se puede ver en la Figura 5,
donde la CFL tiene un consumo de aproximadamente 5
veces respecto que el tipo incandescente.
MEDICION DEL CAMPO MAGNETICO
Un mtodo conocido para medir el campo magntico de
ondas electromagnticas es usando un espira, y se llama ha-
bitualmente antena de lazo, que se puede observar en la Fig. 6.
La Fuerza electromotriz inducida en el lazo a circuito
abierto, se puede obtener mediante la ley de Faraday [6],
Fig. 5. Consumo elctrico de los tipos de lmparas, incandescentes,
fuorescentes y halgenas. Datos tomados de la pgina de Osram
http://catalog.myosram.com
Fig. 4 Fotografa de una lmpara fuorescente compacta (CFL)
Fig.6 Diferencia de potencial inducida en el lazo debida a la aplicacin
de campo magntico Hi.
Espaa Fano
119
que se expresa de la siguiente manera:
(1) V
OC
= nBAcos
donde: n es el nmero de vueltas, w: es la pulsacin an-
gular, A: es el rea del lazo, y q: es el ngulo entre z y Hi.
Ms detalles acerca de los parmetros de esta antena que
se emplean para medir el campo magntico se describen
en el Apndice.
PARTE EXPERIMENTAL
La antena lazo o cuadro de aire se ha diseado con un
cilindro dielctrico con un alambre sobre el mismo, con: un
dimetro = 0,1 m, a 50 vueltas, y la seccin del cable = 0.5mm
2
.
Es interesante observar que la fuerza electromotriz
inducida Voc de la ecuacin. (1) aumenta con el rea y el
nmero de vueltas n, esto puede ser usado para seleccionar
la recepcin. La seccin de alambre se han elegido para
reducir las prdidas por efecto Joule del alambre. Como
el dispositivo es bsicamente un inductor, en la prctica,
la resistencia de esta antena de lazo se puede despreciar
comparada con la reactancia. En la Fig. 7 se muestra como
se ha construido la antena de lazo.
Para observar las emisiones de radiacin de RF de las
lmparas fuoresecentes compactas, se ha medido el campo
magntico que producen en funcin de la distancia a la
lmpara. Hay dos posibilidades en la medicin del campo
magntico: en la direccin del eje del lazo, y en la direccin
radial del lazo, como se puede observar en la Fig. 8 y 9.
Se ha medido el campo magntico de las lmparas fuores-
centes Osram de 11W de potencia, conectadas a 220V/50Hz,
en las direcciones Axial y radial como se puede observar en
la Fig. 10 y 11. Este campo magntico se
puede modelizar en funcin de la dis-
tancia d con un exponente a. Es decir:
H 1/d
a
a=4
Es interesante observar que usu-
almente en antenas lineales como las
antenas dipolo, el campo magntico
cercano a la antena en la regin reactiva,
tiene una dependencia con la distancia
de 1/d
2
, esto est muy difundido en la
gente que pertenece a la comunidad de
antenas [6]. En este trabajo la depen-
dencia del campo magntico ha sido
medida resultando una variacin en
funcin de la distancia de 1/d
4
. Esto
signifca que el campo magntico de las
lmparas fuorescentes decrece mucho
ms rpido que las antenas tipo dipolo.
El campo magntico medido en la
direccin radial como se puede obser-
var en la Fig. 12, se encuentra aproxi-
madamente 6 rdenes de magnitud
menor que el campo magntico en la
direccin axial de la Fig. 11.
Fig. 7 Imagen de la antena lazo para sensado de campo magntico H
Fig. 8 Medicin de campo magntico en la direccin del eje del sensor.
Fig. 9 Medicin de campo magntico en la direccin radial del sensor.
Espaa
118
lnea inherente en la mayora de estas lmparas. La tcnica
ms comn es recubrir la superfcie interior del tubo con
partculas de fsforo, que absorben la radiacin emitida por
el gas brillante y lo convierten en un amplio espectro de luz
visible que van del azul al rojo.
Historia de las lmparas Fluorescentes compactas (CFL)
Las lmparas f luorescentes compactas helicoidales
fueron inventadas por Ed Hammer de GE en 1976.
La propuesta consista en un tubo de forma de hlice largo
y delgado de alta efciencia, de modo que se ajusten al tamao
y distribucin de la luz de una lmpara incandescente, con
un funcionamiento en fro, es decir sin generar calor.
Sin embargo, GE consider que enrollar tubos de vidrio
en esta forma era complejo y no era compatible con tcnicas
de alta velocidad de fabricacin, y la idea fue archivada [1] [2].
No fue sino hasta 1992 que GE complet una mquina
para curvar el cristal, y las muestras de la lmpara llamada
Heliax que produjo fueron enviadas al mercado ese mismo
ao. Lamentablemente la lmpara nunca se produjo a escala,
debido a la extrema difcultad en el control del proceso de
produccin [1] [2]. La introduccin comercial de la lmpara
tendra que esperar otros tres aos hasta que la empresa
china, Shanghai Xiangshan, que comercializ con xito el
diseo. Esta fue la primera lmpara de Phillips de 2003 [1].
Lmparas fuorescentes compactas
Las lmparas fuorescentes se han utilizado en la ofcina
y otros entornos comerciales, iluminando con una efcien-
cia de 5-10 veces mayor que las bombillas de flamento de
tungsteno. El tubo fuorescente contiene un electrodo con
un gas que tpicamente es una mezcla de argn / criptn
y una pequea cantidad de mercurio. Se trata de una lm-
para de descarga, la descarga se inicia por un iniciador o
arrancador y despus es controlado por un balasto, que es
tradicionalmente un inductor con ncleo de hierro. Cuando
el arco se alcanza, la corriente fuye y el circuito opera a
una frecuencia de suministro de la red. Cuando el funcio-
namiento es normal, las emisiones de radiofrecuencia de
una lmpara fuorescente a frecuencia de la red se producen
debido a un arco en los electrodos.
El funcionamiento de una lmpara fuorescente a una
frecuencia ms alta reduce el parpadeo visual, y reduce el
zumbido, aumentando la facilidad de regulacin y tambin
la efciencia hasta aproximadamente 25%. Por esa razn es
deseable una mayor frecuencia de operacin usando balasto
electrnico de conmutacin [5].
Por qu se utilizan las lmparas fuorescentes compac-
tas (CFL)? En la fgura 4 se puede observar una imagen de
una lmpara de este tipo. La caracterstica ms importante
de por qu la lmpara fuorescente compacta se utiliza, es
por el consumo elctrico. Esto se puede ver en la Figura 5,
donde la CFL tiene un consumo de aproximadamente 5
veces respecto que el tipo incandescente.
MEDICION DEL CAMPO MAGNETICO
Un mtodo conocido para medir el campo magntico de
ondas electromagnticas es usando un espira, y se llama ha-
bitualmente antena de lazo, que se puede observar en la Fig. 6.
La Fuerza electromotriz inducida en el lazo a circuito
abierto, se puede obtener mediante la ley de Faraday [6],
Fig. 5. Consumo elctrico de los tipos de lmparas, incandescentes,
fuorescentes y halgenas. Datos tomados de la pgina de Osram
http://catalog.myosram.com
Fig. 4 Fotografa de una lmpara fuorescente compacta (CFL)
Fig.6 Diferencia de potencial inducida en el lazo debida a la aplicacin
de campo magntico Hi.
Espaa Fano
119
que se expresa de la siguiente manera:
(1) V
OC
= nBAcos
donde: n es el nmero de vueltas, w: es la pulsacin an-
gular, A: es el rea del lazo, y q: es el ngulo entre z y Hi.
Ms detalles acerca de los parmetros de esta antena que
se emplean para medir el campo magntico se describen
en el Apndice.
PARTE EXPERIMENTAL
La antena lazo o cuadro de aire se ha diseado con un
cilindro dielctrico con un alambre sobre el mismo, con: un
dimetro = 0,1 m, a 50 vueltas, y la seccin del cable = 0.5mm
2
.
Es interesante observar que la fuerza electromotriz
inducida Voc de la ecuacin. (1) aumenta con el rea y el
nmero de vueltas n, esto puede ser usado para seleccionar
la recepcin. La seccin de alambre se han elegido para
reducir las prdidas por efecto Joule del alambre. Como
el dispositivo es bsicamente un inductor, en la prctica,
la resistencia de esta antena de lazo se puede despreciar
comparada con la reactancia. En la Fig. 7 se muestra como
se ha construido la antena de lazo.
Para observar las emisiones de radiacin de RF de las
lmparas fuoresecentes compactas, se ha medido el campo
magntico que producen en funcin de la distancia a la
lmpara. Hay dos posibilidades en la medicin del campo
magntico: en la direccin del eje del lazo, y en la direccin
radial del lazo, como se puede observar en la Fig. 8 y 9.
Se ha medido el campo magntico de las lmparas fuores-
centes Osram de 11W de potencia, conectadas a 220V/50Hz,
en las direcciones Axial y radial como se puede observar en
la Fig. 10 y 11. Este campo magntico se
puede modelizar en funcin de la dis-
tancia d con un exponente a. Es decir:
H 1/d
a
a=4
Es interesante observar que usu-
almente en antenas lineales como las
antenas dipolo, el campo magntico
cercano a la antena en la regin reactiva,
tiene una dependencia con la distancia
de 1/d
2
, esto est muy difundido en la
gente que pertenece a la comunidad de
antenas [6]. En este trabajo la depen-
dencia del campo magntico ha sido
medida resultando una variacin en
funcin de la distancia de 1/d
4
. Esto
signifca que el campo magntico de las
lmparas fuorescentes decrece mucho
ms rpido que las antenas tipo dipolo.
El campo magntico medido en la
direccin radial como se puede obser-
var en la Fig. 12, se encuentra aproxi-
madamente 6 rdenes de magnitud
menor que el campo magntico en la
direccin axial de la Fig. 11.
Fig. 7 Imagen de la antena lazo para sensado de campo magntico H
Fig. 8 Medicin de campo magntico en la direccin del eje del sensor.
Fig. 9 Medicin de campo magntico en la direccin radial del sensor.
Espaa
120
ConClusiones
Los niveles de los campos magnti-
cos de las lmparas fuprescentes com-
pactas (CFL) se han medido, y se han
detectado importantes niveles entre 40
y 50kHz en la direccin axial de la Fig.
10. Los niveles en la direccin radial es-
tn 6 rdenes de magnitud por debajo
que los medidos en la direccin axial
y por lo tanto se podrian despreciar.
En frecuencias de 150kHz la poten-
cia recibida es considerablemente baja
comparada con la recibida a frecuen-
cias de 40-50kHz.
Como una prueba de que se est
produciendo intereferencia debida a
la generacin de ondas electromag-
neticas en RF, si se coloca un receptor
de AM de frecuencias medias cerca de
la lmpara fuorescente y la recepcion
ser interferida con ruido audible que
se suma al sonido recibido durante la
recepcin.
La lmpara f luorescente genera
un campo electromagntico en la
banda de 40-50kHz principalmente
y puede interferir con otros circuitos
electrnicos, estas emisiones estn en
campo cercano debido a la banda de
frecuencias. Si en el lugar donde se
encuentran las lmparas hay disposi-
tivos electrnicos sensibles al campo
magntico, es aconsejable reemplazar
las lmparas fluorescentes por otro
tipo de iluminacin como los LED pero
sin emplear fuentes de conmutacin,
empleando reguladores de tensin
lineales. Las lmparas incandescentes
tambin podran ser empleadas porque
no tienen emisiones de RF.
instrumentaCin
Analizador de espectro PSA 6000 9
kHz 6.2GHz
Medidor de impedancia vectorial
HP4815
Anal i zador de i mpedanci a AEA
200kHz 200MHz
LCR Instek 1kHz- 100kHz
apndiCe
El circuito elctrico de una antena
lazo de n vueltas empleado como an-
tena receptora se representa por la
impedancia Z=R+jX en serie con un
generador de tensin. El analizador
de espectro est representado por me-
dio de una impedancia de 50 . Este
circuito elctrico se puede observar
en la Fig. 12, donde: V
oc
: es la fuerza
electromotriz a circuito abierto, ZL:
Fig.10 Campo magntico medido en funcin de la distancia, y modelizado para diferentes valores
de alfa. Direccin axial f=48.95kHz.
Fig.11 Campo magntico medido en funcin de la distancia, y modelizado para diferentes valores de
alfa. Direccin radial f=48.95kHz.
Fig.12 Circuito elctrico equivalente de la antena lazo.
Espaa Fano
121
impedancia de carga del analizador de espectro, y Z es la
impedancia de la antena lazo. La diferencia de potencial
medida en el analizador de espectro se puede escribir como:
(2) V
OC
Z
L
Z
L
+Z

= V
m

De las ecs. (1) y (2) el campo magntico se puede expresar
como una funcin de la tensin medida V
m
:
(3) H =
(ZL+Z)
ZL
V
m
1
nACOS
0

De la ec. (3) el factor de antena puede se puede defnir como
la relacin entre el campo magntico y la tensin medida
Vm en el lazo como sigue:
(4) H = KVm
Entonces el factor de antena es:
(5) K = 1 +
Z
ZL

1
nACOS
0

Este factor es muy importante porque relaciona la ten-
sin medida con el campo magntico que es lo que se desea
conocer.
En la Fig.13 se observa la foto de la medicin de imped-
ancias de una antena de lazo empleada en el experimento.
El resultado de la medicin de la reactancia en funcin de
la frecuencia de la antena de lazo se puede observar en la
Fig. 14, donde la reactancia es lineal y se incrementa con la
frecuencia. Esto representa un comportamiento inductivo.
En la Fig. 14 la reactancia es lineal hasta 1700kHz
aproximadamente, y entonces la reactancia se aleja del
comportamiento lineal, esto es debido a la cercana de la
frecuencia de resonancia de la antena, porque la antena tiene
una capacidad de prdidas, y la frecuencia de resonancia
aumenta con el nmero de vueltas de la antena.
En la Fig.15 se muestra el factor de antena obtenido me-
diante la ecuacin (5), este factor es utilizado para obtener
el campo magntico medido.
RefeRencias
[1] ^ Philips Tornado Asian Compact Fluorescent. Philips. Retrieved
2007-12-24.
[2] ^ Compact Fluorescent Light Bulbs. Energy Star. Retrieved
2010-09-30.
[3] Antenna Engineering Handbook. 3rd Ed. R.C. Jhonson. Mac-Graw
Hill Inc. 1993.
[4] Characterization of compact fuorescent lights RF emissions in the
perspective of human exposure. T. Letertre, A. Azoulay, A. Destrez,
F. Gaudaire y Christophe Martinsons. EMC09/ Kyoto.
[5] Efective Tests and Measurements Mechanisms for EMI Level Iden-
tifcation in Fluorescent Lamp Operation V. Sekar, T. G. Palanivelu,
and B. Revathi. European Journal of Scientifc Research, Vol.34 No.4
(2009), pp.495-505
[6] Antenna Teory Analysis and Design 2nd Ed. C.A. Balanis. J.
Wiley. 1997.
[7] Te Great Internet Light Bulb Book, Part I. Donald L. Klipstein.
http://freespace.virgin.net/tom.baldwin/bulbguide.html
[8] Olympus Microscopy Resource Center. http://www.olympusmicro.
com/primer/lightandcolor/lightsourcesintro.html
Fig. 13 Medicin de la impedancia de la antena lazo con un medidor LCR.
Fig.14 Reactancia medida de la antena lazo.
Fig. 15 Reactancia medida de la antena lazo.
Fig.16 Factor de antena en veces en funcin de la frecuencia.
Espaa
120
ConClusiones
Los niveles de los campos magnti-
cos de las lmparas fuprescentes com-
pactas (CFL) se han medido, y se han
detectado importantes niveles entre 40
y 50kHz en la direccin axial de la Fig.
10. Los niveles en la direccin radial es-
tn 6 rdenes de magnitud por debajo
que los medidos en la direccin axial
y por lo tanto se podrian despreciar.
En frecuencias de 150kHz la poten-
cia recibida es considerablemente baja
comparada con la recibida a frecuen-
cias de 40-50kHz.
Como una prueba de que se est
produciendo intereferencia debida a
la generacin de ondas electromag-
neticas en RF, si se coloca un receptor
de AM de frecuencias medias cerca de
la lmpara fuorescente y la recepcion
ser interferida con ruido audible que
se suma al sonido recibido durante la
recepcin.
La lmpara f luorescente genera
un campo electromagntico en la
banda de 40-50kHz principalmente
y puede interferir con otros circuitos
electrnicos, estas emisiones estn en
campo cercano debido a la banda de
frecuencias. Si en el lugar donde se
encuentran las lmparas hay disposi-
tivos electrnicos sensibles al campo
magntico, es aconsejable reemplazar
las lmparas fluorescentes por otro
tipo de iluminacin como los LED pero
sin emplear fuentes de conmutacin,
empleando reguladores de tensin
lineales. Las lmparas incandescentes
tambin podran ser empleadas porque
no tienen emisiones de RF.
instrumentaCin
Analizador de espectro PSA 6000 9
kHz 6.2GHz
Medidor de impedancia vectorial
HP4815
Anal i zador de i mpedanci a AEA
200kHz 200MHz
LCR Instek 1kHz- 100kHz
apndiCe
El circuito elctrico de una antena
lazo de n vueltas empleado como an-
tena receptora se representa por la
impedancia Z=R+jX en serie con un
generador de tensin. El analizador
de espectro est representado por me-
dio de una impedancia de 50 . Este
circuito elctrico se puede observar
en la Fig. 12, donde: V
oc
: es la fuerza
electromotriz a circuito abierto, ZL:
Fig.10 Campo magntico medido en funcin de la distancia, y modelizado para diferentes valores
de alfa. Direccin axial f=48.95kHz.
Fig.11 Campo magntico medido en funcin de la distancia, y modelizado para diferentes valores de
alfa. Direccin radial f=48.95kHz.
Fig.12 Circuito elctrico equivalente de la antena lazo.
Espaa Fano
121
impedancia de carga del analizador de espectro, y Z es la
impedancia de la antena lazo. La diferencia de potencial
medida en el analizador de espectro se puede escribir como:
(2) V
OC
Z
L
Z
L
+Z

= V
m

De las ecs. (1) y (2) el campo magntico se puede expresar
como una funcin de la tensin medida V
m
:
(3) H =
(ZL+Z)
ZL
V
m
1
nACOS
0

De la ec. (3) el factor de antena puede se puede defnir como
la relacin entre el campo magntico y la tensin medida
Vm en el lazo como sigue:
(4) H = KVm
Entonces el factor de antena es:
(5) K = 1 +
Z
ZL

1
nACOS
0

Este factor es muy importante porque relaciona la ten-
sin medida con el campo magntico que es lo que se desea
conocer.
En la Fig.13 se observa la foto de la medicin de imped-
ancias de una antena de lazo empleada en el experimento.
El resultado de la medicin de la reactancia en funcin de
la frecuencia de la antena de lazo se puede observar en la
Fig. 14, donde la reactancia es lineal y se incrementa con la
frecuencia. Esto representa un comportamiento inductivo.
En la Fig. 14 la reactancia es lineal hasta 1700kHz
aproximadamente, y entonces la reactancia se aleja del
comportamiento lineal, esto es debido a la cercana de la
frecuencia de resonancia de la antena, porque la antena tiene
una capacidad de prdidas, y la frecuencia de resonancia
aumenta con el nmero de vueltas de la antena.
En la Fig.15 se muestra el factor de antena obtenido me-
diante la ecuacin (5), este factor es utilizado para obtener
el campo magntico medido.
RefeRencias
[1] ^ Philips Tornado Asian Compact Fluorescent. Philips. Retrieved
2007-12-24.
[2] ^ Compact Fluorescent Light Bulbs. Energy Star. Retrieved
2010-09-30.
[3] Antenna Engineering Handbook. 3rd Ed. R.C. Jhonson. Mac-Graw
Hill Inc. 1993.
[4] Characterization of compact fuorescent lights RF emissions in the
perspective of human exposure. T. Letertre, A. Azoulay, A. Destrez,
F. Gaudaire y Christophe Martinsons. EMC09/ Kyoto.
[5] Efective Tests and Measurements Mechanisms for EMI Level Iden-
tifcation in Fluorescent Lamp Operation V. Sekar, T. G. Palanivelu,
and B. Revathi. European Journal of Scientifc Research, Vol.34 No.4
(2009), pp.495-505
[6] Antenna Teory Analysis and Design 2nd Ed. C.A. Balanis. J.
Wiley. 1997.
[7] Te Great Internet Light Bulb Book, Part I. Donald L. Klipstein.
http://freespace.virgin.net/tom.baldwin/bulbguide.html
[8] Olympus Microscopy Resource Center. http://www.olympusmicro.
com/primer/lightandcolor/lightsourcesintro.html
Fig. 13 Medicin de la impedancia de la antena lazo con un medidor LCR.
Fig.14 Reactancia medida de la antena lazo.
Fig. 15 Reactancia medida de la antena lazo.
Fig.16 Factor de antena en veces en funcin de la frecuencia.
ADs_EEG13.indd 32 11/16/12 2:51 PM
ADs_EEG13.indd 32 11/16/12 2:51 PM
123
P
O
L
S
K
A
123
Contents | Polska
Wal ent y St ar c z akow ukoc z y s t udi a
inynierskie na Wydziale Elektrycznym Politechniki
Warszawskiej.
Pier wsz prac podj w za oonej pr zez
Kazimierza Szpotaskiego Fabr yce Aparatw
Elektrycznych. Prace konstruktorskie Starczakowa
koncentroway si na projektowaniu przekadnikw
pr dowych i napi ci owych or az obwodw
magnetycznych.
Pr z ek adni ki konst r uowane w f abr yce
Szpotaskiego z powodzeniem rywalizowa y z uznanymi wyrobami dostpnymi na rynkach
midzynarodowych. W. Starczakow interesowa si rwnie opracowywaniem modeli oglnych
zjawisk zachodzcych w obwodach magnetycznych przekadnikw.
Po zakoczeniu II Wojny wiatowej, W. Starczakow podj prac na Wydziale Elektrycznym
na Politechnice dzkiej w Katedrze Podstaw Elektrotechniki, na stanowisku starszego
asystenta, nastpnie adiunkta i docenta. W tym okresie wydana zostaa jego ksika pt.
Przekadniki. Ksika ta staa si podstawowym rdem wiedzy na temat zarwno teorii i
konstrukcji, jak i eksploatacji przekadnikw.
Od czerwca 1957 roku pe ni funkcj kierownika Katedry Elektrotechniki Oglnej,
wprowadzajc temat yk naukow z dziedziny przek adnikw i materia oznawst wa
elektrotechnicznego.
Starczakow jest uwaany za twrc polskiej szko y przekadnikowej. Zosta odznaczony
Krzyem Kawalerskim Orderu Odrodzenia Polski i Zotym Krzyem Zasugi. Otrzyma tytu
Honorowy Zasuonego Nauczyciela Rzeczpospolitej Polskiej.
PRODUKTY I USUGI
ZASOBY
ARTYKU
O Szacowaniu Bdu Niedopasowania W
Badaniach Emisji Promieniowanej
JAN SROKA, Profesor, Politechnika Warszawska
124
125
126
Walenty
Starczakow (19061999)
POL_TOC_EEG13.indd 123 11/16/12 4:47 PM
124
Polska | Produkty i Ustugi
A
A.H. Systems
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diowe systemy odpornoci, RF Emission Systems, RF
Testsoftware, kalibracja i serwis
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View our videos on YouTube:
InterferenceTech1
JAN SROKA
Profesor
Politechnika Warszawska
S
TRESZCZENI E. Zaburzeni a promi en-
iowane w badani ach kompat ybi l noci
elektromagnetycznej mierzone s anten
poczon z miernikiem zaburze koncen-
trycznym torem pomiarowym o impedancji
charakterystycznej 50. Wspczynnik
przeliczeniowy sygnalu miernika na wiel-
kosc mierzon anten (mezurand) zdefiniowany jest z
pominiciem niedopasowa w torze pomiarowym. Jest to
jeden ze skadnikow bdu pomiaru. Bdu tego nie da sie
wyznaczy w sposb deterministyczny. Jest on szacowany
i wbudowany w bilans niepewnoci pomiaru. Wyprow-
adzono wzory na dwa rodzaje bdu niedopasowania:
dla bezporedniego poczenia anteny z odbiornikiem
oraz z wtrconym torem pomiarowym. Oszacowanie
bdu niedopasowania metod polecan w dokumencie
CISPR 16-4-2 oraz z wykorzystaniem metody Monte
Carlo zilustrowano obliczeniami numercznymi dla po-
miaru pola elektrycznego zaburze promieniowanych w
pasmach C i D, w przedziale czstotliwosci od 30MHz
do 1GHz. Podejcie proponowne w dokumencie CISPR
16-4-2 jest zbyt pesymistyczne i prowadzi do znacznego
przeszacowania bdu.
WSTP
1
Poszukiwan wielkoci fizyczn w pomiarach emisji
promieniowanej (mezurandem) jest natenie pola
elektrycznego lub magnetycznego. Do pomiarw tych
uywa si odpowiedniej anteny, ktra jest konwerterem
natenia pola na sygna napiciowy na przyczu anteny.
Sygna ten jest przekazywany do odbiornika zaburze
elektromagnetycznych torem pomiarowym o impedancji
charakterystycznej 50, skadajcym si z dwu kabli kon-
O Szacowaniu Bdu Niedopasowania
W Badaniach Emisji Promieniowanej
Polska
1
Artyku jest polsk, uaktualnion i poprawion wersj publikacji
[4].
2
Sytuacja opisana w publikacji [8], w ktrej obcienie jest poczone bezporednio
do rda moe wystpowa przy kalibracji sprztu, natomiast nigdy nie wystpuje
przy pomiarach EMC. Tutaj zawsze midzy anten, a odbiornikiem jest tor pomiarowy.
126
Sroka_PO_EEG13.indd 6 11/16/12 4:52 PM
JAN SROKA
Profesor
Politechnika Warszawska
S
TRESZCZENI E. Zaburzeni a promi en-
iowane w badani ach kompat ybi l noci
elektromagnetycznej mierzone s anten
poczon z miernikiem zaburze koncen-
trycznym torem pomiarowym o impedancji
charakterystycznej 50. Wspczynnik
przeliczeniowy sygnalu miernika na wiel-
kosc mierzon anten (mezurand) zdefiniowany jest z
pominiciem niedopasowa w torze pomiarowym. Jest to
jeden ze skadnikow bdu pomiaru. Bdu tego nie da sie
wyznaczy w sposb deterministyczny. Jest on szacowany
i wbudowany w bilans niepewnoci pomiaru. Wyprow-
adzono wzory na dwa rodzaje bdu niedopasowania:
dla bezporedniego poczenia anteny z odbiornikiem
oraz z wtrconym torem pomiarowym. Oszacowanie
bdu niedopasowania metod polecan w dokumencie
CISPR 16-4-2 oraz z wykorzystaniem metody Monte
Carlo zilustrowano obliczeniami numercznymi dla po-
miaru pola elektrycznego zaburze promieniowanych w
pasmach C i D, w przedziale czstotliwosci od 30MHz
do 1GHz. Podejcie proponowne w dokumencie CISPR
16-4-2 jest zbyt pesymistyczne i prowadzi do znacznego
przeszacowania bdu.
WSTP
1
Poszukiwan wielkoci fizyczn w pomiarach emisji
promieniowanej (mezurandem) jest natenie pola
elektrycznego lub magnetycznego. Do pomiarw tych
uywa si odpowiedniej anteny, ktra jest konwerterem
natenia pola na sygna napiciowy na przyczu anteny.
Sygna ten jest przekazywany do odbiornika zaburze
elektromagnetycznych torem pomiarowym o impedancji
charakterystycznej 50, skadajcym si z dwu kabli kon-
O Szacowaniu Bdu Niedopasowania
W Badaniach Emisji Promieniowanej
Polska
1
Artyku jest polsk, uaktualnion i poprawion wersj publikacji
[4].
2
Sytuacja opisana w publikacji [8], w ktrej obcienie jest poczone bezporednio
do rda moe wystpowa przy kalibracji sprztu, natomiast nigdy nie wystpuje
przy pomiarach EMC. Tutaj zawsze midzy anten, a odbiornikiem jest tor pomiarowy.
126
Sroka_PO_EEG13.indd 6 11/16/12 4:52 PM ADs_EEG13.indd 33 11/16/12 2:51 PM
Polska
128
centrycznych i przepustu w cianie komory pomiarowej
2
.
Tor pomiarowy weryfikuje si przy pomocy parametrw
rozproszeniowych S-Parameters. Wspczynni k F
stanowiska pomiarowego pozwalajcy przeliczy sygna,
ktry mierzy miernik na modu natenia pola, nie
uwzgldnia niedopasowan w torze pomiarowym. Jest
to praktyka powszechnie stosowana w laboratoriach
badawczych. Uproszczenie to implikuje bd, ktrym
mona skorygowa pomiar. Bd ten nazywa si nie-
dopasowaniem mismatch. Zgodnie z dokumentem [1]
oznacza si go symbolem M. W efekcie, relacja midzy
mezurandem, a napiciem mierzonym przez miernik,
w zalenoci od uytej skali (liniowej lub decybelowej)
jest iloczynem (F M) lub sum (F +M) wspczynnika
stanowiska pomiarowego i b du niedopasowania.
Wspczynnik anteny
W pomiarach emisji promieniowanej mezurandem jest
modu natenia pola elektrycznego |E| lub magnetyc-
znego |H| w strefie dalekiej pola [2]. Wprowadzmy dla
tego mezurandu oglny symbol |Q|
|Q|
|E| natenie pola elektrycznego
|H| natenie pola magnetycznego
[ ]
W procesie kalibracji anteny wyznacza si jej dwa
parametry: wspczynnik anteny FA oraz wspczynnik
odbicia S na przyczu anteny, ktry jest rwnowazny
impedancji wejsciowej anteny ZS. Mierzalny jest tylko
modu wspczynnika anteny, dlatego FA jest wielkosci
rzeczywist, zalen od czstotliwosci.
Wspczynnik anteny FA jest ilorazem moduu natenia
pola w miejscu umieszczenia anteny i moduu napi-cia
|U| mierzonego na przyczu anteny pod warunkiem, e
miernik na przyczu anteny nie powoduje odbic, jest
dopasowany (L = 0)
(1) FA
|E|
|U|
wspczynnik anteny elktrycznej
|H|
|U|
wspczynnik anteny magnetycznej
{
Rys. 1. Kalibracja anteny oraz rwnowany schemat elektryczny
zcza antena-odbiornik.
S
Emc solutions for GrEEn EnErGy
drivinG rEnEwablE EnErGy forward
throuGh advancEd tEchnoloGy
Teseq Global EMC Solutions: Radiated Immunity, Radiated Emissions,
Conducted Immunity, Conducted Emissions.
For over ffty years, Teseq has been providing EMC solutions to the most modern, cutting
edge felds. Teseq users beneft from the widest portfolio of high performance EMC
solutions with future-proof design. They tell us how they value the elegant usability,
innovative features and wide selection of Teseq products. Through constant research,
active participation in standards committees and keeping current with the latest require-
ments, the next big thing is just around the corner. EMC is what we do!
EMC for New Technologies:
Renewable Energy
Electric and Hybrid Vehicles
Vehicle Charging Systems
Smart Grid Devices
Solar Energy
LED Lighting
Sales Intl. Teseq AG Luterbach Switzerland
T + 41 32 681 40 50 www.teseq.com
Polska SROKA
129
Modu siy elektromotorycznej (SEM) || w schemacie
zastepczym anteny (Rys.1) jest proporcjonal ny do
natenia
pola. Jest tak zarwno dla pola elektrycznego, jak i mag-
netycznego w strefie dalekiej.
(2) || = F
|Q|
Przyporzdkowujc procesowi kalibracji rwnowany
obwd elektryczny z obcieniem 50 jak pokazano na
Rys.1, wprowadzajc do niego dane z kalibracji anteny
oraz
zaleno wyraon Rwn.(2), wspczynnik anteny moe
by wyrazony nastpujco
(3) F
A
=
2
F
|1 -
S
|
|Q|
|U|
=
Pominicie odbi na wejciu miernika pomiarowego w
Rwn.(3) (
L
= 0) jest uzasadnione w procesie kalibracji
anteny pod warunkiem, e miernik jest kalibrowany z
zachowanim spjnoci pomiarowej i bd wynikajcy
z niedopasowania na jego wejciu jest skompensowany
[2]. Nie
zmienia to faktu, e odbicia na wejsciu miernika s i
wpywaj na bd niedopasowania toru pomiarowego
przy pomiarze zaburze.
BD NIEDOPASOWANIA PRZY BEZPO
REDNIM POCZNIU ANTENY
Z MIERNIKIEM
Jeeli antena podczona jest bezposrednio do od-
biornika zaburze (kreska przerywana na Rys.1), spadek
napicia na wejciu miernika wyraa si nastpujcym
wzorem
Rys. 2. Tor pomiarowy wtrcony midzy anten, a miernik zaburze.
3
To samo dotyczy samego wspczynnika FA anteny elektrycznej. T losow
zmienno uwzglednia si w bilansie niepewnoci [2]. Nie jest to przedmiotem
rozwaa tej publikacji.
Check the schedule at electronics-cooling.com
FREE WEBINARS
Stay current on thermal management topics
Polska
128
centrycznych i przepustu w cianie komory pomiarowej
2
.
Tor pomiarowy weryfikuje si przy pomocy parametrw
rozproszeniowych S-Parameters. Wspczynni k F
stanowiska pomiarowego pozwalajcy przeliczy sygna,
ktry mierzy miernik na modu natenia pola, nie
uwzgldnia niedopasowan w torze pomiarowym. Jest
to praktyka powszechnie stosowana w laboratoriach
badawczych. Uproszczenie to implikuje bd, ktrym
mona skorygowa pomiar. Bd ten nazywa si nie-
dopasowaniem mismatch. Zgodnie z dokumentem [1]
oznacza si go symbolem M. W efekcie, relacja midzy
mezurandem, a napiciem mierzonym przez miernik,
w zalenoci od uytej skali (liniowej lub decybelowej)
jest iloczynem (F M) lub sum (F +M) wspczynnika
stanowiska pomiarowego i b du niedopasowania.
Wspczynnik anteny
W pomiarach emisji promieniowanej mezurandem jest
modu natenia pola elektrycznego |E| lub magnetyc-
znego |H| w strefie dalekiej pola [2]. Wprowadzmy dla
tego mezurandu oglny symbol |Q|
|Q|
|E| natenie pola elektrycznego
|H| natenie pola magnetycznego
[ ]
W procesie kalibracji anteny wyznacza si jej dwa
parametry: wspczynnik anteny FA oraz wspczynnik
odbicia S na przyczu anteny, ktry jest rwnowazny
impedancji wejsciowej anteny ZS. Mierzalny jest tylko
modu wspczynnika anteny, dlatego FA jest wielkosci
rzeczywist, zalen od czstotliwosci.
Wspczynnik anteny FA jest ilorazem moduu natenia
pola w miejscu umieszczenia anteny i moduu napi-cia
|U| mierzonego na przyczu anteny pod warunkiem, e
miernik na przyczu anteny nie powoduje odbic, jest
dopasowany (L = 0)
(1) FA
|E|
|U|
wspczynnik anteny elktrycznej
|H|
|U|
wspczynnik anteny magnetycznej
{
Rys. 1. Kalibracja anteny oraz rwnowany schemat elektryczny
zcza antena-odbiornik.
S
Emc solutions for GrEEn EnErGy
drivinG rEnEwablE EnErGy forward
throuGh advancEd tEchnoloGy
Teseq Global EMC Solutions: Radiated Immunity, Radiated Emissions,
Conducted Immunity, Conducted Emissions.
For over ffty years, Teseq has been providing EMC solutions to the most modern, cutting
edge felds. Teseq users beneft from the widest portfolio of high performance EMC
solutions with future-proof design. They tell us how they value the elegant usability,
innovative features and wide selection of Teseq products. Through constant research,
active participation in standards committees and keeping current with the latest require-
ments, the next big thing is just around the corner. EMC is what we do!
EMC for New Technologies:
Renewable Energy
Electric and Hybrid Vehicles
Vehicle Charging Systems
Smart Grid Devices
Solar Energy
LED Lighting
Sales Intl. Teseq AG Luterbach Switzerland
T + 41 32 681 40 50 www.teseq.com
Polska SROKA
129
Modu siy elektromotorycznej (SEM) || w schemacie
zastepczym anteny (Rys.1) jest proporcjonal ny do
natenia
pola. Jest tak zarwno dla pola elektrycznego, jak i mag-
netycznego w strefie dalekiej.
(2) || = F
|Q|
Przyporzdkowujc procesowi kalibracji rwnowany
obwd elektryczny z obcieniem 50 jak pokazano na
Rys.1, wprowadzajc do niego dane z kalibracji anteny
oraz
zaleno wyraon Rwn.(2), wspczynnik anteny moe
by wyrazony nastpujco
(3) F
A
=
2
F
|1 -
S
|
|Q|
|U|
=
Pominicie odbi na wejciu miernika pomiarowego w
Rwn.(3) (
L
= 0) jest uzasadnione w procesie kalibracji
anteny pod warunkiem, e miernik jest kalibrowany z
zachowanim spjnoci pomiarowej i bd wynikajcy
z niedopasowania na jego wejciu jest skompensowany
[2]. Nie
zmienia to faktu, e odbicia na wejsciu miernika s i
wpywaj na bd niedopasowania toru pomiarowego
przy pomiarze zaburze.
BD NIEDOPASOWANIA PRZY BEZPO
REDNIM POCZNIU ANTENY
Z MIERNIKIEM
Jeeli antena podczona jest bezposrednio do od-
biornika zaburze (kreska przerywana na Rys.1), spadek
napicia na wejciu miernika wyraa si nastpujcym
wzorem
Rys. 2. Tor pomiarowy wtrcony midzy anten, a miernik zaburze.
3
To samo dotyczy samego wspczynnika FA anteny elektrycznej. T losow
zmienno uwzglednia si w bilansie niepewnoci [2]. Nie jest to przedmiotem
rozwaa tej publikacji.
Check the schedule at electronics-cooling.com
FREE WEBINARS
Stay current on thermal management topics
Polska
130
(4) |U| =
F
|Q|
2
| |
(1 +
L
)(1 -
S
)
1 -
L
S
Wstawienie Rwn.(4) do Rwn. (3) daje
(5) |U| =
|1 +
L
|
|1 -
L
S
|
|Q|
F
A
Uwzgldniajc niedopasowanie na wejciu miernika

(Rwn.(14)) otrzymyjemy
(6) |Q| = F
A
|1 -
L
S
| |U
R
|
Jak wida
(7) M
A-R
= |1 -
L
S
|
jest b dem niedopasowania przy pomiarze emisji pro-
mieniowanej gdy antena podczona jest bezposrednio
do miernika.
Bd niedopasowania przy
poczeniu anteny z odBiornikiem za
porednictwem toru pomiarowego
Zwykle antena poczona jest z miernikiem za
porednictwem toru pomiarowego skadajcego si z kab-
la koncentrycznego w komorze pomiarowej, przepustu w
cianie komory i kabla w pomieszczeniu z miernikiem
Rys.(2). Sytuacja ta odpowiada schematowi pokazanemu
na Rys.7 b) jeli przyjmie si anten za rdo, miernik
za obcienie, a tor pomiarowy, wtrcony midzy Port-
1 i Port-2 scharakteryzuje si zespolonmacierz S
parametrw rozproszeniowych.
Wstawiajc rwnanie definicyjne stratnoci
wtrceniowej Rwn.(15) do rwnania na spadek napicia
na wejciu miernika przy bezpordnim podczeniu
anteny do miernika Rwn.(5) oraz wstawiajc niedo-
pasowanie na wej ciu miernika Rwn.(14) do spadku
napicia U2, mona wyznaczy zaleno midzy |Q|, a
napiciem wskazanym przez miernik |U
R
|
(8) |Q| = = |(1 -
S
S
11
)(1 -
L
S
22
) -
S
S
12
L
S
21
|
F
A
|S
21
|
|U
R
|
Do przeliczenia wskazania miernika na poszukiwane
natenie pola, czyli jako wspczynnika stanowiska
pomiarowego uzywa si iloczynu wspczynnika anteny
oraz tumienia toru pomiarowego
(9) F
A-I-R
= F
A

1
|S
21
|
natomiast
(10) M
A-I-R
== |(1 -
S
S
11
)(1 -
L
S
22
)-
S
S
12
L
S
21
|
Rys. 3. Paramtry S toru pomiarowego.
Rys. 4. Modu wspczynnika odbi |
L
| na wejciu anteny przy
polaryzacji poziomej i pionowej dla anteny umieszczonej odpowiednio
1,5m i 1,7m nad podog.
Rys. 5. Niepewno standardowa u oraz warto oczekiwana E
bdu niedopasowania dla poziomej polaryzacji anteny.
Tablica 1. Maximum niepewnoci standardowej dla poziomej
polaryzacji anteny.
Pasmo czstotliwoci
(zakres)
Metoda
CISPR Monte Carlo
C (30MHz - 300MHz) 1.85dB 0.95dB
D (300MHz - 1000MHz) 0.53dB 0.26dB
4
Rozkad kszta tu U ma zmienna zespolona
L
, jeli jej modu |
L
| jest deterministy-
czny, a tylko argument jest losowy. Niestety, zwykle w danych producenta dostpne
jest tylko ekstremum |
L
|.
Polska
130
(4) |U| =
F
|Q|
2
| |
(1 +
L
)(1 -
S
)
1 -
L
S
Wstawienie Rwn.(4) do Rwn. (3) daje
(5) |U| =
|1 +
L
|
|1 -
L
S
|
|Q|
F
A
Uwzgldniajc niedopasowanie na wejciu miernika

(Rwn.(14)) otrzymyjemy
(6) |Q| = F
A
|1 -
L
S
| |U
R
|
Jak wida
(7) M
A-R
= |1 -
L
S
|
jest b dem niedopasowania przy pomiarze emisji pro-
mieniowanej gdy antena podczona jest bezposrednio
do miernika.
Bd niedopasowania przy
poczeniu anteny z odBiornikiem za
porednictwem toru pomiarowego
Zwykle antena poczona jest z miernikiem za
porednictwem toru pomiarowego skadajcego si z kab-
la koncentrycznego w komorze pomiarowej, przepustu w
cianie komory i kabla w pomieszczeniu z miernikiem
Rys.(2). Sytuacja ta odpowiada schematowi pokazanemu
na Rys.7 b) jeli przyjmie si anten za rdo, miernik
za obcienie, a tor pomiarowy, wtrcony midzy Port-
1 i Port-2 scharakteryzuje si zespolonmacierz S
parametrw rozproszeniowych.
Wstawiajc rwnanie definicyjne stratnoci
wtrceniowej Rwn.(15) do rwnania na spadek napicia
na wejciu miernika przy bezpordnim podczeniu
anteny do miernika Rwn.(5) oraz wstawiajc niedo-
pasowanie na wej ciu miernika Rwn.(14) do spadku
napicia U2, mona wyznaczy zaleno midzy |Q|, a
napiciem wskazanym przez miernik |U
R
|
(8) |Q| = = |(1 -
S
S
11
)(1 -
L
S
22
) -
S
S
12
L
S
21
|
F
A
|S
21
|
|U
R
|
Do przeliczenia wskazania miernika na poszukiwane
natenie pola, czyli jako wspczynnika stanowiska
pomiarowego uzywa si iloczynu wspczynnika anteny
oraz tumienia toru pomiarowego
(9) F
A-I-R
= F
A

1
|S
21
|
natomiast
(10) M
A-I-R
== |(1 -
S
S
11
)(1 -
L
S
22
)-
S
S
12
L
S
21
|
Rys. 3. Paramtry S toru pomiarowego.
Rys. 4. Modu wspczynnika odbi |
L
| na wejciu anteny przy
polaryzacji poziomej i pionowej dla anteny umieszczonej odpowiednio
1,5m i 1,7m nad podog.
bdu niedopasowania dla poziomej polaryzacji anteny.
Tablica 1. Maximum niepewnoci standardowej dla poziomej
polaryzacji anteny.
Pasmo czstotliwoci
(zakres)
Metoda
CISPR Monte Carlo
C (30MHz - 300MHz) 1.85dB 0.95dB
D (300MHz - 1000MHz) 0.53dB 0.26dB
4
Rozkad kszta tu U ma zmienna zespolona
L
, jeli jej modu |
L
| jest deterministy-
czny, a tylko argument jest losowy. Niestety, zwykle w danych producenta dostpne
jest tylko ekstremum |
L
|.
Polska Sroka
131
jest b dem niedopasowania przy pomiarze emisji
promieniowanej gdy antena poczona jest z miernikiem
za porednictwem toru pomiarowego
Uwagi na temat odbic na wejsciU
anteny i odbiornika
Odbi ci a
S
na przy czu anteny wystpuj w
bdzie niedopasowania niezalenie od tego, czy an-
tena podczona jest bezporednio Rwn.(7), czy za
porednictwem toru pomiarowego Rwn.(10).
Anteny elektryczne kalibruje si w komorach w peni
bezodbiciowych. Jeeli pomiarw emisji promieniowanej
dokonuje si rwnie w komorach w peni bezodbicio-
wych to,
S
jest deterministyczn zmienn zespolon
niezalen od polaryzacji anteny i jej wysokoci nad
podog.
I nac z e j j e s t pr z y pomi a r ac h w komor z e
wpbezodbiciowej. Pomiarw tych dokonuje si dla
rnych wysokosci anteny nad podog, dla obu po-
laryzacji (poziomej i pionowej) oraz czasami zmieniajc
nachylenie anteny do podogi. Przy tych pomiarach
S
jest zmienn zalen od wszystkich wymieni-
onych czynnikw
3
. Dokadnie rzecz biorc naleaoby
wyznaczy ekstrema
S
w zalenosi od wysokosci an-
teny nad podog, polaryzacji oraz nachylenia anteny.
To wyznaczaoby przestrze zmiennoci wielowymiar-
owej zmiennej losowej
S
. Na szczcie przestrze tej
zmiennoci jest maa. Dlatego w tym artykule
S
jest
uwzgldniona jako zmienna deterministyczna dla ty-
powej wysokoci anteny nad podog, oddzielnie dla
poziomej i pionowej polaryzacji.
Innym uproszczeniem jest zao enie, e
S
jest prak-
tycznie niezalene od wpywu badanego obiektu EUT.
To zao enie jest uzasadnione poniewa pomiarw
dokonuje si w strefie dalekiej pola.
Zmiennoci odbi
S
na wejciu anteny magnetycznej
nie trzeba wogle uwzgldnia, bowiem kalibracja i
pomiar odbywaj si w tym samym rodowisku elek-
tromsagnetycznym tzn. w komorze wp-bezodbiciowej,
na okrelonej wysokoci nad podog i tylko przy jednej
polaryzacji.
Pomiar zespolonej wartoci
L
na wejsciu miernika
jest moliwy, ale kosztowny. Dlatego informacj na ten
temat czerpie si z danych technicznych dostarcznych
przez producenta. Zwykle producenci podaja najwiksz
warto moduu odbi |
L
| z wczonym i wyczonym
tumikiem w stopniu wejsciowym miernika. Przy pomi-
arach emisji promieniowanej tumik na wejciu miernika
jest zawsze wyczony, aby zachowa moliwie dobry
odstp sygnau od szumu i zachowa moliwie duy
odstp szumw od limitw wymaganych przez normy.
Jeeli dostpny jest przedwzmacniacz na wejciu, zawsze
wcza si go, aby poprawi obydiwe wspomniane cechy
pomiaru.
szacowanie bdU niedopasowania
W podejciu prezentowanym w dokumencie [1]
wszystkie zmienne wystpujce we wzorze Rwn.(10)
przyjmuje si za zmienne losowe. Dalej, ekstremum b
du niedopa-sowania M
A-I-R
szacuje si w ten sposb, e
w skali decybelowej argument funkcji logarytmicznej jest
sum arytmetyczn wszystkich skadnikw
(11) M

A-I-R
= 20log [1 (|
S
| |S
11
| + +|
L
| |S
22
|+|
S
| |S
11
|
|
L
| |S
22
| + |
S
| |S
21
|
2
|
L
|)]
Nazywa si to czsto propagacj bedu. Kady ze
skadnikw w tym wypadku dziesi ciowymiarowej zmi-
ennej losowej (pi zespolonych zmiennych losowych)
Rys. 7. Schemat blokowy z oznaczeniami wielkoci uzytych w defnicji
stratnoci wtrceniowej.
bdu niedopasowania dla pionowej polaryzacji anteny.
Tablica 2. Maximum niepewnoci standardowej dla pionowej
polaryzacji anteny.
Pasmo czstotliwoci
(zakres)
Metoda
CISPR Monte Carlo
C (30MHz - 300MHz) 1.68dB 0.90dB
D (300MHz - 1000MHz) 0.53dB 0.26dB
Polska
132
wpywa na bd (propaguje swj udzia w bdzie) ma-
zurandu wedug podanej zalenoci Rwn.(11). Rwn.(11)
okrela przedzia zmiennoci zmiennej losowej, ktra ma
w przyblieniu rozkad ksztatu U [2]. W konsekwencji
pprzedzia zmiennos i a oraz warto oczekiwana E
s nastpujce
(12) a =
M
A-I-R
- M
A-I-R
2
(+) (-)

(13) =
M
A-I-R
- M
A-I-R
2
(+) (-)
Ze wzgldu na zaoony rozkad ksztatu U, przyjmuje
si wspczynnik rozszerzenia midzy niepewnocia
standardow u, a pprzedziaem zmiennoci rwny
2. cile biorc tak oszacowany bd nie ma rozkadu
ksztatu U
4
.
Jeeli pomierzy si parametry S toru pomiarowego,
to bd niedopasowania Rwn.(10) jest dwuwymiarow
zmienn losow, poniewa tylko zespolony wspczynnik
odbi na wejsciu anteny |
L
| jest zmienn losow.
Prawidowo i efektywnie mozna oszacowa ten bd
stosujc metod Monte Carlo [5], [6], [7]. Autor, podob-
nie jak w swoim poprzednim artykule [3] posuy si
programem Math- Cad13 wykorzystujc dostpny w
nim generator wartoci pseudo-losowych o rozkadzie
rwnomiernym (prostoktnym). Warto oczekiwana
E(X) jest policzona jako rednia arytmetyczna prbek,
a niepewno standardowa u policzona jest wzorem u
=E(X
2
) - E
2
(X).
Obliczenia prOpOagacji
parametrw rOzkadu
Parametry rozproszeniowe toru pomiarowego zostay
pomierzone wektorowym analizatorem sieci (VNA)
ZVRE firmy R&S w przedziale czstotliwoci od 30MHz
do 1GHz w 801 rozoonych logarytmicznie punktach
czstotliwo ci. Do kalibracji VNA uyto zestawu kali-
bracyjnego 85032B TYPE-N Firmy HP.
Szacowanie bdu przeprowadzono dla stanowiska po-
miarowego z miernikiem zaburze ESIB40 firmy Rohde&
Schwarz. Zgodnie z danymi producenta, wspczynnik
fali stojcej na wejciu tego miernika, w caym przedziale
czstotliwoci od 20Hz do 40GHz jest nie wikszy ni 2,0
dla zerowego tumienia na wejciu (V SWR 2:0) oraz
nie wikszy ni 1,2, jeeli tumienie na wejciu jest co
najmniej 10dB (V SWR 1:2).
Oznacza to, e modu wspczynnika odbicia na
wejciu miernika spenia nierwno |
L
| < 0:34 dla ze-
rowej nastawy tumienia. Wasnie t warto graniczn
przyj to w obliczeniach, gdy jak wyjaniono wczeniej
przy pomiarach emisji promieniowanej tumik wejciowy
jest wyczony. Wygenerowano 180, rwnomiernie
rozoonych wartosci losowych moduu |
L
| w przedziale
[0; 0; 34]. Kadej z nich przyporzadkowano 180 zmien-
nych losowych argumentu
L
z zakresu [-; ].
Tor pomiarowy skada si z kable koncentrycznego
dugo sci 9m w komorze wp-bezodbiciowej, przepustu
oraz kable koncentrycznego dugoci 3m w pomieszcze-
niu z odbiornikiem. Moduy parametrw rozproszenio-
wych toru pomiarowego pokazane s na Rys.3.
St a nowi s ko pomi a rowe wy pos a one j es t w
szerokopasmow anten dwustokowo-logarytmiczn
EMCO3141. Wspczynnik odbi na wejciu anteny
S

pomierzono w komorze wp-bezodbiciowej dla polary-
zacji poziomej, przy umieszczeniu anteny na wysokoci
1,5m nad podog oraz dla polaryzacji pionowej przy
umieszczeniu anteny na wysokoci 1,7m nad podog.
Moduy tych wspczynnikw odbi przedstawione s na
Rys.4. Mona na nim zauway tylko niewielkie rnice
dla obu ustawien anteny.
Porwnanie rezultatw szacowania bdu metod
CISPR oraz Monte Carlo dla polaryzacji poziomej i pi-
onowej przedstawiono na Rys.5 i 6. Wartoci graniczne
bdu dla pasm czstotliwoci C (30MHz - 300MHz) oraz
D (300MHz -1GHz) zebrane s w Tab.1 i Tab.2.
wniOski
Zgodnie z dokumentem [1] bd niedopasowania
M
A-I-R
(Rwn.(10)) przy badaniu emisji promieniowanej
jest dziesiciowymiarowa zmienn losow o rozkadzie
zblionym do ksztatu U. Przyj ty bad graniczny tego
rozkadu (Rwn.(11) jest przeszacowany. Obliczenie
parametrw tego rozkadu tzn. wartoci oczekiwanej i
niepewnosci standardowej jest bardzo proste.
Przy pomi arach pol a el ekt r ycznego zaburze
promieniowanych w komorze wp-bezodbiciowej
wspczynnik odbic na wejsciu anteny
S
jest zmienna
deterministyczn, jeli rozpatruje si oddzielnie polary-
zacje poziom i pionow anteny. W takiej sytuacji bd
niedopasowania Rwn.(10) jest dwuwymiarow zmienn
losow, ze wzgldu na zespolony wspczynnik
L
odbi
na wejciu miernika. Do szacowania takiego zagadnienia
losowego z atwoci mona wykorzysta metod Monte
Carlo.
W artykule przedstawiono szacowanie bdu obiema
metodami.
Wartoci oczekiwane E w obu podejciach byy pomi-
jalnie mae. Dotyczy to zwaszcza pasma D czstotliwoci.
Niepewno standardowa, obliczana zgodnie z metod
zalecan w dokumencie [1] jest przesadnie i niepotrze-
bnie zawyona.
W pamie C czstotliwoci duym wartociom odbi
S
na wejciu anteny towarzyszy duy bd graniczny
L

odbi na wejciu miernika. Skutkuje to duo wikszum
bdem niedopasowania ni w pasmie D czstotliwoci.
zaczniki
niedOpasOwanie na wejciu miernika
Jeeli uwzgldni si odbicia
L
na wejciu miernika,
to sygna na wejciu miernika U i zarejestrowany przez
miernik U
R
rni si od siebie. Zwizane one s ze sob
nastpujc zalenoci
(14) |U| = |1 +
L
| _ |U
R
|
stratnO wtrceniOwa L
I
Stratno wtrceniowa jest to stosunek napicia
U na zaciskach obcienia, gdy podczone jest ono
bezporednio do rda (Rys.7a) do napicia U
2
na tych
samych zaciskach jeeli midzy zrdo i obcizenie
Polska Sroka
133
wczony jest czwrnik (Rys.7b)
(15) L
I
=
U
U
2
=
(1 -
S
S
11
) (1 -
L
S
22
) -
S
S
12

L
S
21
S
21
(1 -
S

L
)
W przypadku braku odbi w rdle (
S
= 0) i
na obci eniu (
L
= 0) stratno napiciowa jest
odwrotnoci wspczynnika transmisji S21. Modu
stratnoci napiciowej w takich warunkach nazywa si
tumiennoci A
(16) |L
I
|
|r
S
=r
L
=0
= A =
1
|S
21
|
LITERATURA
[1] CISPR 16-4-2: 2003, Specification for radio disturbance and
immunity measuring apparatus and methods - Part 4-2: Uncer-
tainties, statistics and limit modeling - Measurement instru-
mentation uncertainty. IEC, 2003.
[2] J. Sroka, Niepewnosc pomiarowa w badaniach EMC, pomi-
ary
emisyjnoci radioelektrycznej . OWPW, Warszawa, 2009.
[3] J. Sroka, Mismatch Correction by Measurement of Con-
ducted
Radio Disturbances With AMN . IEEE Trans. on EMC Vol. 53
No. 2 pp. 534 - 536, May, 2011.
[4] J. Sroka, Mismatch Error by Measurement of Radiated
Disturbances in EMC Testing. PRZEGLAD ELEKTROTECH-
NICZNY
(Electrical Review), PL ISSN 0033-2097, ROK LXXXVIII NR 2
pp. 92-95, 2012.
[5] R. Babka, Niepewno pomiarw emisji przewodzonej w
kompatybilnoci elektromagnetycznej . Poltechnika Warsza-
wska, Rozprawa Doktorska, 2009.
[6] Joint Committee for Guides in Metrology (JCGM), Evalua-
tion of measurement data - Supplement 1 to the Guide to the
expression of uncertainty in measurement - Propagation of dis-
tributions using a Monte Carlo method. JCMG 101:2008. Freely
available at OIML web side, www.oiml.org.
[7] C.,F.,M. Carobbi, The GUM Supplement 1 and the Uncer-
tainty Evaluations of EMC Measurements . IEEE EMC Society
Newsletter, Issue No. 225, 2010.
[8] C.,F.,M. Carobbi, M. Cati and C. Panconi, Note on the Ex-
pected Value and Standard Deviation of the Mismatch Correc-
tion . IEEE Trans. Electromagn. Compat. vol. 53, no. 4, pp.1098-
1099, Nov. 2011.
Prof. Jan Sroka jest pracownikiem Politechniki Warszawskiej, IETi-
SIP, Koszykowa 75, 00-662 Warszawa, email: (J.Sroka@iem.pw.edu.pl)
oraz EMC-Testcenter Zrich AG, Schaff hauserstr. 580, 8052-Zrich,
Szwajcaria, e-mail: (j.sroka@emc-testcenter.com). Jest rwnoczenie
doradc w zakresie kompatybilnosci elektromagnetycznej firmy ASTAT
Sp. z o. o. Pozna (www.astat.com.pl).
Automotive + Telecom +
Consumer Products + Military +
Industrial + Medical + Avionics
THE BEST EMCTESTEQUIPMENT
FOR ANY APPLICATION:
EM TEST Polska ul. 0rodowa `}`5
uuS9` warzawa /S (u) 5S 6/` 5`
inlo.polka_emtet.de www.emtet.com}pl
Your direct line to EM TEST is +48 (0) 518 643 512
Polska
132
wpywa na bd (propaguje swj udzia w bdzie) ma-
zurandu wedug podanej zalenoci Rwn.(11). Rwn.(11)
okrela przedzia zmiennoci zmiennej losowej, ktra ma
w przyblieniu rozkad ksztatu U [2]. W konsekwencji
pprzedzia zmiennos i a oraz warto oczekiwana E
s nastpujce
(12) a =
M
A-I-R
- M
A-I-R
2
(+) (-)

(13) =
M
A-I-R
- M
A-I-R
2
(+) (-)
Ze wzgldu na zaoony rozkad ksztatu U, przyjmuje
si wspczynnik rozszerzenia midzy niepewnocia
standardow u, a pprzedziaem zmiennoci rwny
2. cile biorc tak oszacowany bd nie ma rozkadu
ksztatu U
4
.
Jeeli pomierzy si parametry S toru pomiarowego,
to bd niedopasowania Rwn.(10) jest dwuwymiarow
zmienn losow, poniewa tylko zespolony wspczynnik
odbi na wejsciu anteny |
L
| jest zmienn losow.
Prawidowo i efektywnie mozna oszacowa ten bd
stosujc metod Monte Carlo [5], [6], [7]. Autor, podob-
nie jak w swoim poprzednim artykule [3] posuy si
programem Math- Cad13 wykorzystujc dostpny w
nim generator wartoci pseudo-losowych o rozkadzie
rwnomiernym (prostoktnym). Warto oczekiwana
E(X) jest policzona jako rednia arytmetyczna prbek,
a niepewno standardowa u policzona jest wzorem u
=E(X
2
) - E
2
(X).
Obliczenia prOpOagacji
parametrw rOzkadu
Parametry rozproszeniowe toru pomiarowego zostay
pomierzone wektorowym analizatorem sieci (VNA)
ZVRE firmy R&S w przedziale czstotliwoci od 30MHz
do 1GHz w 801 rozoonych logarytmicznie punktach
czstotliwo ci. Do kalibracji VNA uyto zestawu kali-
bracyjnego 85032B TYPE-N Firmy HP.
Szacowanie bdu przeprowadzono dla stanowiska po-
miarowego z miernikiem zaburze ESIB40 firmy Rohde&
Schwarz. Zgodnie z danymi producenta, wspczynnik
fali stojcej na wejciu tego miernika, w caym przedziale
czstotliwoci od 20Hz do 40GHz jest nie wikszy ni 2,0
dla zerowego tumienia na wejciu (V SWR 2:0) oraz
nie wikszy ni 1,2, jeeli tumienie na wejciu jest co
najmniej 10dB (V SWR 1:2).
Oznacza to, e modu wspczynnika odbicia na
wejciu miernika spenia nierwno |
L
| < 0:34 dla ze-
rowej nastawy tumienia. Wasnie t warto graniczn
przyj to w obliczeniach, gdy jak wyjaniono wczeniej
przy pomiarach emisji promieniowanej tumik wejciowy
jest wyczony. Wygenerowano 180, rwnomiernie
rozoonych wartosci losowych moduu |
L
| w przedziale
[0; 0; 34]. Kadej z nich przyporzadkowano 180 zmien-
nych losowych argumentu
L
z zakresu [-; ].
Tor pomiarowy skada si z kable koncentrycznego
dugo sci 9m w komorze wp-bezodbiciowej, przepustu
oraz kable koncentrycznego dugoci 3m w pomieszcze-
niu z odbiornikiem. Moduy parametrw rozproszenio-
wych toru pomiarowego pokazane s na Rys.3.
St a nowi s ko pomi a rowe wy pos a one j es t w
szerokopasmow anten dwustokowo-logarytmiczn
EMCO3141. Wspczynnik odbi na wejciu anteny
S

pomierzono w komorze wp-bezodbiciowej dla polary-
zacji poziomej, przy umieszczeniu anteny na wysokoci
1,5m nad podog oraz dla polaryzacji pionowej przy
umieszczeniu anteny na wysokoci 1,7m nad podog.
Moduy tych wspczynnikw odbi przedstawione s na
Rys.4. Mona na nim zauway tylko niewielkie rnice
dla obu ustawien anteny.
Porwnanie rezultatw szacowania bdu metod
CISPR oraz Monte Carlo dla polaryzacji poziomej i pi-
onowej przedstawiono na Rys.5 i 6. Wartoci graniczne
bdu dla pasm czstotliwoci C (30MHz - 300MHz) oraz
D (300MHz -1GHz) zebrane s w Tab.1 i Tab.2.
wniOski
Zgodnie z dokumentem [1] bd niedopasowania
M
A-I-R
(Rwn.(10)) przy badaniu emisji promieniowanej
jest dziesiciowymiarowa zmienn losow o rozkadzie
zblionym do ksztatu U. Przyj ty bad graniczny tego
rozkadu (Rwn.(11) jest przeszacowany. Obliczenie
parametrw tego rozkadu tzn. wartoci oczekiwanej i
niepewnosci standardowej jest bardzo proste.
Przy pomi arach pol a el ekt r ycznego zaburze
promieniowanych w komorze wp-bezodbiciowej
wspczynnik odbic na wejsciu anteny
S
jest zmienna
deterministyczn, jeli rozpatruje si oddzielnie polary-
zacje poziom i pionow anteny. W takiej sytuacji bd
niedopasowania Rwn.(10) jest dwuwymiarow zmienn
losow, ze wzgldu na zespolony wspczynnik
L
odbi
na wejciu miernika. Do szacowania takiego zagadnienia
losowego z atwoci mona wykorzysta metod Monte
Carlo.
W artykule przedstawiono szacowanie bdu obiema
metodami.
Wartoci oczekiwane E w obu podejciach byy pomi-
jalnie mae. Dotyczy to zwaszcza pasma D czstotliwoci.
Niepewno standardowa, obliczana zgodnie z metod
zalecan w dokumencie [1] jest przesadnie i niepotrze-
bnie zawyona.
W pamie C czstotliwoci duym wartociom odbi
S
na wejciu anteny towarzyszy duy bd graniczny
L

odbi na wejciu miernika. Skutkuje to duo wikszum
bdem niedopasowania ni w pasmie D czstotliwoci.
zaczniki
niedOpasOwanie na wejciu miernika
Jeeli uwzgldni si odbicia
L
na wejciu miernika,
to sygna na wejciu miernika U i zarejestrowany przez
miernik U
R
rni si od siebie. Zwizane one s ze sob
nastpujc zalenoci
(14) |U| = |1 +
L
| _ |U
R
|
stratnO wtrceniOwa L
I
Stratno wtrceniowa jest to stosunek napicia
U na zaciskach obcienia, gdy podczone jest ono
bezporednio do rda (Rys.7a) do napicia U
2
na tych
samych zaciskach jeeli midzy zrdo i obcizenie
Polska Sroka
133
wczony jest czwrnik (Rys.7b)
(15) L
I
=
U
U
2
=
(1 -
S
S
11
) (1 -
L
S
22
) -
S
S
12

L
S
21
S
21
(1 -
S

L
)
W przypadku braku odbi w rdle (
S
= 0) i
na obci eniu (
L
= 0) stratno napiciowa jest
odwrotnoci wspczynnika transmisji S21. Modu
stratnoci napiciowej w takich warunkach nazywa si
tumiennoci A
(16) |L
I
|
|r
S
=r
L
=0
= A =
1
|S
21
|
LITERATURA
[1] CISPR 16-4-2: 2003, Specification for radio disturbance and
immunity measuring apparatus and methods - Part 4-2: Uncer-
tainties, statistics and limit modeling - Measurement instru-
mentation uncertainty. IEC, 2003.
[2] J. Sroka, Niepewnosc pomiarowa w badaniach EMC, pomi-
ary
emisyjnoci radioelektrycznej . OWPW, Warszawa, 2009.
[3] J. Sroka, Mismatch Correction by Measurement of Con-
ducted
Radio Disturbances With AMN . IEEE Trans. on EMC Vol. 53
No. 2 pp. 534 - 536, May, 2011.
[4] J. Sroka, Mismatch Error by Measurement of Radiated
Disturbances in EMC Testing. PRZEGLAD ELEKTROTECH-
NICZNY
(Electrical Review), PL ISSN 0033-2097, ROK LXXXVIII NR 2
pp. 92-95, 2012.
[5] R. Babka, Niepewno pomiarw emisji przewodzonej w
kompatybilnoci elektromagnetycznej . Poltechnika Warsza-
wska, Rozprawa Doktorska, 2009.
[6] Joint Committee for Guides in Metrology (JCGM), Evalua-
tion of measurement data - Supplement 1 to the Guide to the
expression of uncertainty in measurement - Propagation of dis-
tributions using a Monte Carlo method. JCMG 101:2008. Freely
available at OIML web side, www.oiml.org.
[7] C.,F.,M. Carobbi, The GUM Supplement 1 and the Uncer-
tainty Evaluations of EMC Measurements . IEEE EMC Society
Newsletter, Issue No. 225, 2010.
[8] C.,F.,M. Carobbi, M. Cati and C. Panconi, Note on the Ex-
pected Value and Standard Deviation of the Mismatch Correc-
tion . IEEE Trans. Electromagn. Compat. vol. 53, no. 4, pp.1098-
1099, Nov. 2011.
Prof. Jan Sroka jest pracownikiem Politechniki Warszawskiej, IETi-
SIP, Koszykowa 75, 00-662 Warszawa, email: (J.Sroka@iem.pw.edu.pl)
oraz EMC-Testcenter Zrich AG, Schaff hauserstr. 580, 8052-Zrich,
Szwajcaria, e-mail: (j.sroka@emc-testcenter.com). Jest rwnoczenie
doradc w zakresie kompatybilnosci elektromagnetycznej firmy ASTAT
Sp. z o. o. Pozna (www.astat.com.pl).
Automotive + Telecom +
Consumer Products + Military +
Industrial + Medical + Avionics
THE BEST EMCTESTEQUIPMENT
FOR ANY APPLICATION:
EM TEST Polska ul. 0rodowa `}`5
uuS9` warzawa /S (u) 5S 6/` 5`
inlo.polka_emtet.de www.emtet.com}pl
Your direct line to EM TEST is +48 (0) 518 643 512
ADs_EEG13.indd 34 11/16/12 2:51 PM
135
N
E
D
E
R
L
A
N
D
135
Contents | Nederland
Ewald Georg
von Kleist (17001748)
PRODUCTEN EN SERVICES
MIDDELEN
ARTIKEL
Verbeteringen Aan Resonantievrij
PDN-Design
MART COENEN, CEO, EMCMCC
ARTHUR VAN ROERMUND, Hoogleraar, Technische Universiteit van Eindhoven
136
139
140
Ewald Georg von Kleist was een Duits fysicus
die in 1745 de Kleistiaanse fles uitvond nadat
hij een fundamenteel element in de elektrische
stroomkring ontdekte om elektriciteit op te slaan.
Hij studeerde aan de Universiteit van Leiden
in de jaren 1720. Samen met een aantal collega-
elektriciens ging hij op zoek naar een methode om
zwakke elektrische ladingen te verhogen en er
zoveel mogelijk van te accumuleren en op te slaan
in een substantie. Zijn Kleistiaanse es toonde aan
dat elektriciteit kon worden geaccumuleerd en opgeslagen.
Zijn uitvinding betrof een glazen es die voor de helft met water werd gevuld en aan de
buitenzijde en de binnenzijde werd bekleed met metaalfolie. Een metaaldraad of ketting werd
door een kurk in de hals van de es geleid en vastgemaakt aan een handmatig aangeslingerde
statische generator. Op deze manier had de es twee gelijke maar aan elkaar tegengestelde
lasten die elkaar in evenwicht hielden tot ze met een geleider werden verbonden, waardoor
een elektrische schok werd geproduceerd.
Pieter van Musschenbroek, een Nederlandse professor aan de Universiteit van Leiden vond
een erg gelijkaardig apparaat uit dat de Leidse es werd genoemd. Beide mannen werden
erkend als uitvinder van het apparaat.
NET_TOC_EEG13.indd 135 11/16/12 4:57 PM
ADs_EEG13.indd 34 11/16/12 2:51 PM
135
N
E
D
E
R
L
A
N
D
135
Contents | Nederland
Ewald Georg
von Kleist (17001748)
PRODUCTEN EN SERVICES
MIDDELEN
ARTIKEL
Verbeteringen Aan Resonantievrij
PDN-Design
MART COENEN, CEO, EMCMCC
ARTHUR VAN ROERMUND, Hoogleraar, Technische Universiteit van Eindhoven
136
139
140
Ewald Georg von Kleist was een Duits fysicus
die in 1745 de Kleistiaanse fles uitvond nadat
hij een fundamenteel element in de elektrische
stroomkring ontdekte om elektriciteit op te slaan.
Hij studeerde aan de Universiteit van Leiden
in de jaren 1720. Samen met een aantal collega-
elektriciens ging hij op zoek naar een methode om
zwakke elektrische ladingen te verhogen en er
zoveel mogelijk van te accumuleren en op te slaan
in een substantie. Zijn Kleistiaanse es toonde aan
dat elektriciteit kon worden geaccumuleerd en opgeslagen.
Zijn uitvinding betrof een glazen es die voor de helft met water werd gevuld en aan de
buitenzijde en de binnenzijde werd bekleed met metaalfolie. Een metaaldraad of ketting werd
door een kurk in de hals van de es geleid en vastgemaakt aan een handmatig aangeslingerde
statische generator. Op deze manier had de es twee gelijke maar aan elkaar tegengestelde
lasten die elkaar in evenwicht hielden tot ze met een geleider werden verbonden, waardoor
een elektrische schok werd geproduceerd.
Pieter van Musschenbroek, een Nederlandse professor aan de Universiteit van Leiden vond
een erg gelijkaardig apparaat uit dat de Leidse es werd genoemd. Beide mannen werden
erkend als uitvinder van het apparaat.
NET_TOC_EEG13.indd 135 11/16/12 4:57 PM
136
Nederland | Producten en Services
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THALES NEDERLAND B.V.
Surface Radar, Environmental Competence Centre P.O.
Box 42, 7550 GD Hengelo, Nederland; +31 74 2488111;
Fax: + 31 74 2425936; info@nl.thalesgroup.com; www.
thales-nederland.nl
TV RHEINLAND EPS B.V.
Eiberkamp 10, 9351 VT Leek; Postbus 37, 9350 AA Leek,
Nederland +31 594 505005; Fax: +31 594 504804;
info@tuv-eps.com; www.tuv-eps.com
MART COENEN
CEO
EMCMCC
ARTHUR VAN ROERMUND
Hoogleraar
Technische Universiteit van Eindhoven
ABSTRACT
I
N 2011 werd tijdens EMCCompo2011 een nieuw con-
cept voor resonantievrij PDN-design gepresenteerd[1].
Dit concept werd gebaseerd op begrensde transmis-
sielijnen. Uit toepassingen op meerlaagse panelen
zijn bijkomende beperkingen aan het licht gekomen
waarvoor we hier oplossingen geven. Verder vermel-
den we de beperkingen bij de correcte toepassing van
een ontkoppeld apparaat op een chip of behuizing op basis
van een werkelijk FPGA-applicatie. Aangezien dit soort IC-
gerelateerde informatie vaak in de meegeleverde datasheets
en handleidingen ontbreekt, bieden we een compacte meet-
methode voor het bepalen van de aanwezigheid en aard van
deze ontkoppeling op chip of behuizing en valideren we dit
door middel van metingen.
I. INLEIDING
Veel van de IC-ontkoppelingssystemen die tegenwoordig
worden toegepast, zijn nog steeds gebaseerd op het idee dat
ontkoppeling buiten de chip noodzakelijk is om te zorgen
voor een correcte werking van de ICs.
Het is echter bij CMOS-ontwerpen al zo'n twintig jaar
gebruikelijk om de ontkoppeling op de chip uit te voeren,
aangezien de time-of-fight voor het transport van de lading
buiten de chip naar het schakelen op de chip te lang is. Deze
ontkoppeling op de chip heeft er vervolgens voor gezorgd dat
kloksnelheden van IC's ver boven 50 MHz uitrijzen.
Dankzij deze zelfde on-chipcapaciteit in combinatie
met de gelijkwaardige serile inductie van een lead frame,
worden er laagdoorlaatflters gevormd waarvan de resonan-
tiefrequentie ver onder 100 MHz ligt. Uitzonderingen op
deze laagfrequentieresonanties worden bereikt door BGA
of lead frame fip-chipbundels waarbij transmissielijnen
worden gevormd tussen de silicium en de PCB waar de voed-
ing vandaan komt. Ook in dit geval tonen de gelijkwaardige
circuits scherpe resonanties in het bereik van 100 - 1000
MHz, of zelfs nog lager.
140
Verbeteringen aan
Resonantievrij PDN-Design
Nederland Nederland Coenen, Van RoeRmund
141
Naast de resonanties veroorzaakt door ontkoppeling op
een chip of plaat komen er ook scherpe resonanties op de PCB
zelf voor. De meeste PCBs bevatten eilandjes met ontkoppel-
ingscondensatoren nabij de voedings- en massapennen van de
IC. Aangezien deze ontkoppelingscondensatoren bij bepaalde
frequenties op de verschillende eilandjes van de PCB zeer lage
impedanties vormen, ontstaan er staande golven tussen de
eilandjes. De resonantiefrequenties, n. /2, worden bepaald
door de fysieke afstand tussen deze ontkoppelingseilandjes
en de dilektrische constante van het isolerende materiaal dat
wordt gebruikt bij het stapelen van de PCB lagen.
Zoals in het vorige artikel [1] werd vermeld, ontstaan
er uit deze ontkoppelingszones ook staande golven in de
richting van de PCB-randen die gewoonlijk open worden
gelaten. Als zodanig treden er resonanties op tussen elk van
deze ontkoppelde (kortgesloten) eilandjes, via de structuur
van de PCB-transmissielijnen, naar de opengelaten PCB-
randen toe. Dit resulteert in m. /4 resonantiefrequenties.
Zelfs wanneer twee of meer transmissielijnen, met
verschillende Z
0
en
pd
evenwijdig aan elkaar met onjuiste
afsluiting worden geplaatst, ontstaan er nieuwe resonanties.
De verschillen in karakteristieke impedanties: Z
0
, van de
transmissielijnen bepalen de stroomverdeling.
II. BEPALING VAN IC-DECAP
De on-chipontkoppelingscapaciteiten worden geleverd
door een combinatie van passief gentegreerde, afzonder-
lijke condensatoren, gewoonlijk op de die-pad geplaatst,
gentegreerde siliciumcondensatoren (een speciale behu-
izing, gewoonlijk trench-condensatoren met 'n fip-chip
erboven op) en/of metalen aan elkaar verbonden capaciteit,
gate-oxidecondensatoren of zelfs trench-condensatoren op
silicium.
De on-chipcapaciteit wordt doorgaans gebruikt met alle
digitale core-ontwerpen van CMOS: DSP, geheugen, proces-
sor enz. In veel gevallen wordt on-chipontkoppeling ook
toegepast in het digitale I/O-domein, zowel bij pre-drivers
en level-shifters als bij de uitgangstrappen. Bij het ontwerp
van analoge circuits wordt on-chipontkoppeling minder
vaak gebruikt. Bij het ontkoppelen van oscillatoren, PLLs,
bandgaps, ADC- of stroomspanningen, spanningsregelaars,
enz. is er echter steeds meer on-chipontkoppeling nodig om-
dat een aansluiting buiten de chip naar een PCB-referentie,
die weinig gemeenschappelijk heeft met het on-chipcircuit,
dat moet worden gebuferd of ontkoppeld. Vergeleken met
de hoeveelheid ontkoppelingscapaciteit die aan het digi-
tale domein wordt toegevoegd, wordt er slechts een fractie
daarvan aan het analoge domein toegevoegd.
De on-chipactiviteitsfactor kan worden onder-verdeeld
in twee groepen:
Spanningsafhankelijk
Spanningsonafhankelijk
De spanningsafhankelijke groep wordt gevormd door de
gate-oxidecapaciteit. Het belangrijkste deel van deze groep
bestaat uit alle extern gevoede standaard logicacellen die
statisch zijn in het geval waarin andere, die moeten worden
ontkoppeld, schakelen. De capaciteit ervan wordt bepaald
door de on-chipactiviteitenfactor: , waarbij (1-) van de
totale hoeveelheid cellen in ontkoppeling, de actieve cellen
zijn. Gewoonlijk is minder dan 0,3 voor bediening van
functionele blokken.
Andere spanningsafhankelijke onderdelen zijn trench-
condensatoren met een in spanning varirende capaciteit.
Het proces van deze ontkoppelingscondensator is ontleend
aan het normaal gentegreerde DRAM trench-proces.
Trench-condensatoren bieden een aanzienlijke ruimtebe-
sparing op chipniveau, ze gebruiken slechts 1 deel van
het siliciumoppervlak dat nodig is voor standaard gate-
oxidecondensatoren. Daarnaast bieden trench-decaps een
aanzienlijke verbetering voor wat betreft afname in lekst-
room vergeleken met standaard gate-oxidecondensatoren.
Een extra uitdaging ontstaat wanneer een complexe chip
een ingebouwde spanningsregeling heeft. Wanneer bijv.
functionele blokken op de chip via de gezamenlijke core-
voeding kunnen worden in- of uitgeschakeld, afhankelijk
van de functie die de chip moet uitvoeren. Niet alleen het
Afbeelding 1: Vereenvoudigd FPGA-ontkoppelingscircuit
MART COENEN
CEO
EMCMCC
ARTHUR VAN ROERMUND
Hoogleraar
Technische Universiteit van Eindhoven
ABSTRACT
I
N 2011 werd tijdens EMCCompo2011 een nieuw con-
cept voor resonantievrij PDN-design gepresenteerd[1].
Dit concept werd gebaseerd op begrensde transmis-
sielijnen. Uit toepassingen op meerlaagse panelen
zijn bijkomende beperkingen aan het licht gekomen
waarvoor we hier oplossingen geven. Verder vermel-
den we de beperkingen bij de correcte toepassing van
een ontkoppeld apparaat op een chip of behuizing op basis
van een werkelijk FPGA-applicatie. Aangezien dit soort IC-
gerelateerde informatie vaak in de meegeleverde datasheets
en handleidingen ontbreekt, bieden we een compacte meet-
methode voor het bepalen van de aanwezigheid en aard van
deze ontkoppeling op chip of behuizing en valideren we dit
door middel van metingen.
I. INLEIDING
Veel van de IC-ontkoppelingssystemen die tegenwoordig
worden toegepast, zijn nog steeds gebaseerd op het idee dat
ontkoppeling buiten de chip noodzakelijk is om te zorgen
voor een correcte werking van de ICs.
Het is echter bij CMOS-ontwerpen al zo'n twintig jaar
gebruikelijk om de ontkoppeling op de chip uit te voeren,
aangezien de time-of-fight voor het transport van de lading
buiten de chip naar het schakelen op de chip te lang is. Deze
ontkoppeling op de chip heeft er vervolgens voor gezorgd dat
kloksnelheden van IC's ver boven 50 MHz uitrijzen.
Dankzij deze zelfde on-chipcapaciteit in combinatie
met de gelijkwaardige serile inductie van een lead frame,
worden er laagdoorlaatflters gevormd waarvan de resonan-
tiefrequentie ver onder 100 MHz ligt. Uitzonderingen op
deze laagfrequentieresonanties worden bereikt door BGA
of lead frame fip-chipbundels waarbij transmissielijnen
worden gevormd tussen de silicium en de PCB waar de voed-
ing vandaan komt. Ook in dit geval tonen de gelijkwaardige
circuits scherpe resonanties in het bereik van 100 - 1000
MHz, of zelfs nog lager.
140
Verbeteringen aan
Resonantievrij PDN-Design
Nederland Nederland Coenen, Van RoeRmund
141
Naast de resonanties veroorzaakt door ontkoppeling op
een chip of plaat komen er ook scherpe resonanties op de PCB
zelf voor. De meeste PCBs bevatten eilandjes met ontkoppel-
ingscondensatoren nabij de voedings- en massapennen van de
IC. Aangezien deze ontkoppelingscondensatoren bij bepaalde
frequenties op de verschillende eilandjes van de PCB zeer lage
impedanties vormen, ontstaan er staande golven tussen de
eilandjes. De resonantiefrequenties, n. /2, worden bepaald
door de fysieke afstand tussen deze ontkoppelingseilandjes
en de dilektrische constante van het isolerende materiaal dat
wordt gebruikt bij het stapelen van de PCB lagen.
Zoals in het vorige artikel [1] werd vermeld, ontstaan
er uit deze ontkoppelingszones ook staande golven in de
richting van de PCB-randen die gewoonlijk open worden
gelaten. Als zodanig treden er resonanties op tussen elk van
deze ontkoppelde (kortgesloten) eilandjes, via de structuur
van de PCB-transmissielijnen, naar de opengelaten PCB-
randen toe. Dit resulteert in m. /4 resonantiefrequenties.
Zelfs wanneer twee of meer transmissielijnen, met
verschillende Z
0
en
pd
evenwijdig aan elkaar met onjuiste
afsluiting worden geplaatst, ontstaan er nieuwe resonanties.
De verschillen in karakteristieke impedanties: Z
0
, van de
transmissielijnen bepalen de stroomverdeling.
II. BEPALING VAN IC-DECAP
De on-chipontkoppelingscapaciteiten worden geleverd
door een combinatie van passief gentegreerde, afzonder-
lijke condensatoren, gewoonlijk op de die-pad geplaatst,
gentegreerde siliciumcondensatoren (een speciale behu-
izing, gewoonlijk trench-condensatoren met 'n fip-chip
erboven op) en/of metalen aan elkaar verbonden capaciteit,
gate-oxidecondensatoren of zelfs trench-condensatoren op
silicium.
De on-chipcapaciteit wordt doorgaans gebruikt met alle
digitale core-ontwerpen van CMOS: DSP, geheugen, proces-
sor enz. In veel gevallen wordt on-chipontkoppeling ook
toegepast in het digitale I/O-domein, zowel bij pre-drivers
en level-shifters als bij de uitgangstrappen. Bij het ontwerp
van analoge circuits wordt on-chipontkoppeling minder
vaak gebruikt. Bij het ontkoppelen van oscillatoren, PLLs,
bandgaps, ADC- of stroomspanningen, spanningsregelaars,
enz. is er echter steeds meer on-chipontkoppeling nodig om-
dat een aansluiting buiten de chip naar een PCB-referentie,
die weinig gemeenschappelijk heeft met het on-chipcircuit,
dat moet worden gebuferd of ontkoppeld. Vergeleken met
de hoeveelheid ontkoppelingscapaciteit die aan het digi-
tale domein wordt toegevoegd, wordt er slechts een fractie
daarvan aan het analoge domein toegevoegd.
De on-chipactiviteitsfactor kan worden onder-verdeeld
in twee groepen:
Spanningsafhankelijk
Spanningsonafhankelijk
De spanningsafhankelijke groep wordt gevormd door de
gate-oxidecapaciteit. Het belangrijkste deel van deze groep
bestaat uit alle extern gevoede standaard logicacellen die
statisch zijn in het geval waarin andere, die moeten worden
ontkoppeld, schakelen. De capaciteit ervan wordt bepaald
door de on-chipactiviteitenfactor: , waarbij (1-) van de
totale hoeveelheid cellen in ontkoppeling, de actieve cellen
zijn. Gewoonlijk is minder dan 0,3 voor bediening van
functionele blokken.
Andere spanningsafhankelijke onderdelen zijn trench-
condensatoren met een in spanning varirende capaciteit.
Het proces van deze ontkoppelingscondensator is ontleend
aan het normaal gentegreerde DRAM trench-proces.
Trench-condensatoren bieden een aanzienlijke ruimtebe-
sparing op chipniveau, ze gebruiken slechts 1 deel van
het siliciumoppervlak dat nodig is voor standaard gate-
oxidecondensatoren. Daarnaast bieden trench-decaps een
aanzienlijke verbetering voor wat betreft afname in lekst-
room vergeleken met standaard gate-oxidecondensatoren.
Een extra uitdaging ontstaat wanneer een complexe chip
een ingebouwde spanningsregeling heeft. Wanneer bijv.
functionele blokken op de chip via de gezamenlijke core-
voeding kunnen worden in- of uitgeschakeld, afhankelijk
van de functie die de chip moet uitvoeren. Niet alleen het
Afbeelding 1: Vereenvoudigd FPGA-ontkoppelingscircuit
Nederland
142
Voor het meten van de on-chipcapaciteit en/of elektrische
impedanties is een impedance/gain of vectornetwerk analyzer
nodig. Bij de impedantie-meetpoort(en) is een voorspan-
ninggevend netwerk nodig om de nominale spanning op het
vereiste vermogen naar het IC te voeren. Bovendien moeten
alle andere voedingspoorten, die in dit onderzoek buiten
beschouwing zijn gelaten, ook worden gevoed en, wanneer
ze zijn verbonden met hetzelfde domein als de geteste poort,
begrensd. Om het geteste IC te dwingen op te starten en
communicatie tot stand te brengen met JTAG of een andere
manier dit om de stroomtoevoer op normale werking in te
stellen, moet de IC worden uitgerust met een externe klok.
Tijdens de impedantiemetingen op de verschillende voed-
ingspoorten, doorgaans een voor een, moet het externe klok
worden uitgeschakeld.
N.B. Tijdens de impedantiemetingen moet het IC (ti-
jdelijk) inactief zijn, d.w.z. dat de externe klok moet zijn
uitgeschakeld.
Om de impedantiemetingen correct uit te voeren, moet
de amplitude van het RF-signaal aan de hand waarvan de
impedantie wordt gemeten, klein zijn vergeleken met de
beschikbare voedingsspanning. Dit is nodig om niet-lineair
gedrag van het IC tijdens de test te vermijden.
Om de spanningsafhankelijkheid van de gemeten ont-
koppelingcapaciteiten te ontdekken, moeten de nominale
DC-voorspanningen worden gewijzigd naar +5 of +10 %
en tenminste -5 en -10 %. Indien mogelijk moet de DC-
voorspanning worden verminderd tot net boven de situatie
waarbij het apparaat stopt met 'functioneren'. Dit niet-
functioneren kan worden opgemerkt door een onmiddellijke
in- en uitschakelen van de voeding op functionele blokken
varieert, maar ook de voedingsspanningen en/of klokfre-
quenties van de functieblokken.
En tenslotte, maar daarom zeker niet minder belangrijk,
is dat de spanningsverzorging op de chip vaak niet langer
toegankelijk blijkt door het gebruik van een LDO-spanning-
sregelaar (low drop-out) op de chip. De gentegreerde
on-chipontkoppeling moet echter groot genoeg zijn om
een aantal klokcyclussen, gewoonlijk tussen 10 tot 100
ns, te overbruggen voordat een LDO het kan overnemen.
Bovendien moet het mogelijk zijn de lading die voor de LDO
wordt opgeslagen, onmiddellijk te leveren. Ook hiervoor is
on-chipontkoppeling onvermijdelijk. De time-of-fight voor
het verkrijgen van spanning afkomstig van een ontkoppel-
ingscondensator buiten de chip, is te lang. Een compromis
hiervoor is gevonden met de integratie van passieve con-
densatoren in de IC- behuizing die vaak in commercile
apparaten worden gebruikt.
De groep spanningsonafhankelijke capaciteiten wordt
gevormd door de metalen onderling verbonden capaciteiten
in het stroomschema en de samengevoegde condensatoren
die in, op of onder de IC-behuizing worden geplaatst. In de
laatste gevallen is de samengevoegde ontkoppelingscapac-
iteit op de IC-behuizing bijna gelijk aan de ontkoppeling-
scondensatoren op de PCB, maar met enige padlengte van
de IC-behuizing in de richting van de PCB. De combinatie
van deze twee in parallel geschakeld, met enige onderling
verbonden lengte ertussenin, resulteert in resonanties.
III. CONFIGURATIE VAN DE IC-DECAPMETING
Afbeelding 2: Veelvoorkomende ontkoppelingsimpedantie buiten de chip die moet worden gebruikt met een FPGA, conform het door de fabrikant
meegeleverde PDN-hulpmiddel.
Nederland
142
Voor het meten van de on-chipcapaciteit en/of elektrische
impedanties is een impedance/gain of vectornetwerk analyzer
nodig. Bij de impedantie-meetpoort(en) is een voorspan-
ninggevend netwerk nodig om de nominale spanning op het
vereiste vermogen naar het IC te voeren. Bovendien moeten
alle andere voedingspoorten, die in dit onderzoek buiten
beschouwing zijn gelaten, ook worden gevoed en, wanneer
ze zijn verbonden met hetzelfde domein als de geteste poort,
begrensd. Om het geteste IC te dwingen op te starten en
communicatie tot stand te brengen met JTAG of een andere
manier dit om de stroomtoevoer op normale werking in te
stellen, moet de IC worden uitgerust met een externe klok.
Tijdens de impedantiemetingen op de verschillende voed-
ingspoorten, doorgaans een voor een, moet het externe klok
worden uitgeschakeld.
N.B. Tijdens de impedantiemetingen moet het IC (ti-
jdelijk) inactief zijn, d.w.z. dat de externe klok moet zijn
uitgeschakeld.
Om de impedantiemetingen correct uit te voeren, moet
de amplitude van het RF-signaal aan de hand waarvan de
impedantie wordt gemeten, klein zijn vergeleken met de
beschikbare voedingsspanning. Dit is nodig om niet-lineair
gedrag van het IC tijdens de test te vermijden.
Om de spanningsafhankelijkheid van de gemeten ont-
koppelingcapaciteiten te ontdekken, moeten de nominale
DC-voorspanningen worden gewijzigd naar +5 of +10 %
en tenminste -5 en -10 %. Indien mogelijk moet de DC-
voorspanning worden verminderd tot net boven de situatie
waarbij het apparaat stopt met 'functioneren'. Dit niet-
functioneren kan worden opgemerkt door een onmiddellijke
in- en uitschakelen van de voeding op functionele blokken
varieert, maar ook de voedingsspanningen en/of klokfre-
quenties van de functieblokken.
En tenslotte, maar daarom zeker niet minder belangrijk,
is dat de spanningsverzorging op de chip vaak niet langer
toegankelijk blijkt door het gebruik van een LDO-spanning-
sregelaar (low drop-out) op de chip. De gentegreerde
on-chipontkoppeling moet echter groot genoeg zijn om
een aantal klokcyclussen, gewoonlijk tussen 10 tot 100
ns, te overbruggen voordat een LDO het kan overnemen.
Bovendien moet het mogelijk zijn de lading die voor de LDO
wordt opgeslagen, onmiddellijk te leveren. Ook hiervoor is
on-chipontkoppeling onvermijdelijk. De time-of-fight voor
het verkrijgen van spanning afkomstig van een ontkoppel-
ingscondensator buiten de chip, is te lang. Een compromis
hiervoor is gevonden met de integratie van passieve con-
densatoren in de IC- behuizing die vaak in commercile
apparaten worden gebruikt.
De groep spanningsonafhankelijke capaciteiten wordt
gevormd door de metalen onderling verbonden capaciteiten
in het stroomschema en de samengevoegde condensatoren
die in, op of onder de IC-behuizing worden geplaatst. In de
laatste gevallen is de samengevoegde ontkoppelingscapac-
iteit op de IC-behuizing bijna gelijk aan de ontkoppeling-
scondensatoren op de PCB, maar met enige padlengte van
de IC-behuizing in de richting van de PCB. De combinatie
van deze twee in parallel geschakeld, met enige onderling
verbonden lengte ertussenin, resulteert in resonanties.
III. CONFIGURATIE VAN DE IC-DECAPMETING
Afbeelding 2: Veelvoorkomende ontkoppelingsimpedantie buiten de chip die moet worden gebruikt met een FPGA, conform het door de fabrikant
meegeleverde PDN-hulpmiddel.
Nederland Coenen, Van RoeRmund
143
daling van de stroomvoeding (zelfs in
de hold-stand: klok uit). Deze spanning
ligt gewoonlijk rond het spanningsniv-
eau voor gegevensbehoud.
IV. METINGSRESULTATEN VAN
IC-DECAP
Voor een geavanceerde FPGA
werden de volgende parameters gevon-
den voor de digitale core:
On-chipkerncapaciteit: 200 nF +/-
20%
ESRon-chipcapaciteit:1,2m
Serie-inductie van chip naar PCB:
0,103nH
AantalVcc_corepennen:58
Capaciteit nauwelijks benvloed
doordeDC-voorspanning;0-0,9V
De piekstroom die door de digitale
kern werd getrokken (in het slechtste
geval)ligtenigszinsboven30Amp.Degemiddeldestroom
bedraagtongeveer5Amp.Dezeparameters,incombinatie
metdeidealeontkoppelingbuitendechip,levereneenreso-
nantiefrequentievan35MHzmeteenkwaliteitsfactorvan
bijna19!!Zoalsookkanwordengezienzoueenresistente
PDN-impedantievanenkeletiendenmili-Ohmervoorzor-
gendatdekwaliteitsfactorvanderesonantieonder1zakt.
Afbeelding 1 toont de digitale core, aan de rechter-
kant, aan de hand van geschakelde condensatoren om de
verliezen van de kern duidelijk aan te geven. De verliezen
worden bereikt in combinatie met de
R
on-weerstand van de
schakelaars. We meten de rimpelspanning in de volledige
core,evenalsdestroomindekern,dievooralafkomstigis
van de on-chipcapaciteit C1. De ontkoppeling buiten de
chip/spanningsbuferingwordtviadeleadframeenPCB-
opbouwdoorC4enC5geleverd.L5//R5vertegenwoordigt
hetRF-ferrietmetverliesnaarhetresonantievrijePDNmet
een RF-equivalente impedantie van 0,1 en een ideale
voedingopDC:L6//R5
Door het toevoegen van een kleine serile inductie met
RFverliesmeteenwaardevan10nH(L5)incombinatiemet
eenPDN-impedantievan0,1neemtdekwaliteitsfactor
vanderesonantieopdechipafmeteenfactorvan10!Ook
de ruis op de chip zakt hiermee met een paar procent.
Omhetinschakelenvandestroomen/ofklokmogelijk
te maken, worden de grote, lokale elektrolyten C4 en C5
toegevoegdomdespanningtebuferen.Merkopdatdeze
elektrolytendirectopdevoedingspennenvandeICmoeten
wordenaangebracht,nietaandePDN-zijde.DeRF-stroom
door de PDN neemt proportioneel af met de stroomreductie
tengevolgevandekwaliteitsfactorreductie,naarmatede
RF-stromenopdechipwordenbegrensd.
Uit het feit dan de on-chipcapaciteit nauwelijks wordt
benvloeddoordevoorspanning,kanwordenafgeleiddat
er afzonderlijke condensatoren binnen
de IC-behuizing worden toegevoegd.
Deze informatie was niet terug te
vinden in de datasheets. Wel beschik-
baar was een PDN-hulpmiddel dat de
gebruiker precies de tegenovergestelde
informatiegafdanuitafbeelding1kan
worden afgeleid en zoals gezien door
de digitale core binnenin (onderbro-
ken lijn).
De PDN-structuur is mogel ijk
alleen belast met ' hoge' impedantie
om de resonantievrije PDN-conditie
te handhaven. De PDN-impedantie
zoals gezien door de corelogica moet
laagliggen,minimaalopdegebruikte
frequenties van de interne klok. Let
erop dat data ofwel een harmonische
of subharmonische van de gebruikte
klokfrequenties zijn.
V. PDN-RESONANTIES
Afbeelding 3: Impedantie zoals gezien door de PDN-structuur (ononderbroken lijn)
Afbeelding 4: Ongelijke TLs in parallelle opstelling (onderbroken lijnen) versus afgestelde TLs
(ononderbroken lijn)
Nederland
144
Wanneer er meerdere voedings-/massavlakken (PDN)
worden gebruikt in een parallelle, meerlaagse PCB-bundel,
kunnen zich tussen deze lagen verschillende materialen en
ruimtes bevinden. Deze mogen niet worden samengevoegd,
aangezien de Z
0
en
pd
dan zullen verschillen, met een
nieuwe resonantie als gevolg (zie afbeelding 4).
Zoals uit de onderbroken lijn in afbeelding 4 kan worden
afgeleid, geeft alleen een
pd
-verschil van ongeveer 20% in
combinatie met een verschilfactor 2 in Z
0
steile resonanties
op een PCB ter grootte van een Eurocard. Deze verschillen
beginnen al onder 1 GHz. Hieruit blijkt dus dat de topolo-
gien van de PCB-laag die parallel worden gebruikt met een
resonantievrij PDN-design, aan elkaar gelijk moeten zijn
om deze resonanties tussen PDN's onderling te vermijden.
Alleen wanneer de twee of meerdere TL-propagatiever-
tragingen gelijk aan elkaar zijn, gedragen de impedanties zich
als parallel geplaatste weerstanden. In parallelle opstelling
moet de randbegrenzing worden bijgesteld tot de resulterende
parallelle impedantie (zie de ononderbroken lijn in afbeelding
4), zodat de resonantie tussen de PDN's afneemt.
VI. CONCLUSIES
De instructies voor het ontkoppelen van de voeding die
door fabrikanten van de PCB en andere PCB-deskundigen
worden gegeven, zijn tegenstrijdig en worden gebaseerd op
een verouderde ontkoppelingsmethode. Deze verouderde
methoden worden echter nog wel gehanteerd door een
groot deel van de PCB-ontwerpwereld en gentegreerd in
de meeste EDA CAD-toolomgevingen.
Door eenvoudige maatregelen voor de ontkoppeling van
PDN kan de variatie van de spanning c.q. stroom die door
de PDN wordt opgewekt worden gedecimeerd, indien de
maatregelen voor ontkoppeling op de chip of plaat bekend
zijn. Zelfs bij bestaande ontwerpen kan een orde van grootte
worden verbeterd ten behoeve van een afname in kwalit-
eitsfactor en RF-emissie.
Evenwijdige PDN-vlakken op een meerlaagse PCB-
structuur moeten op elkaar worden afgestemd, teneinde
resonantie tussen PDN's onderling te vermijden. Deze reso-
nanties komen zowel bij conventionele als bij resonantievrije
PDN-ontwerpen voor.
Bij het gebruik van PDN-vlakstructuren met gelijke
propagatievertragingen bij parallelle opstelling moeten
randbegrenzingsnetwerken dienovereenkomstig worden
aangepast.
MET DANK AAN
De auteur bedankt zijn klant, die hem de kans bood
gezamenlijk deze testmethode te ontwikkelen. Het uit-
gevoerde werk wordt ondersteund door het Nederlandse
overheidsprogramma voor innovatie WBSO, onder het
nummer ZT09051042.SO.
REFERENTIES
[1] Mart Coenen, Arthur van Roermund, Resonant-Free PDN
Design, EMCCompo2011
[2] Bogatin, Eric, Signal and power integrity, Simplifed, Pearson
Education Inc, 2010
[3] Volkan Kursun, Eby G. Friedman, Multi-voltage CMOS circuit
design, John Wiley and Sons, 2006 - Technology & Engineering
[4] Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba,
Selcuk Kose, Eby G. Friedman, Power Distribution Networks with
On-Chip Decoupling Capacitors,Springer, 2010
[5] Special Issue on PCB Level Signal Integrity, Power Integrity,
and EMC, IEEE Transactions on Electromagnetic Compatibility, Vol.
52, No. 2, May 2010, Bevat meer dan 100 referenties.
[6] John Andresakis, Embedded Capacitors, Strategic Technology
Oak-Mitsui Technologies, 11-2005
[7] 3M, A High Performance Embedded Capacitance PCB Lami-
nate, http://solutions.3m.com/wps/portal/3M/en_US/EmbeddedCa-
pacitance-Material/Home/Learn/WhatIsECM/
[8] Iliya Zamek, SoC-System Jitter Resonance and its Impact on
Common Approach to the PDN Impedance, Altera Corporation, San
Jose, USA
[9] Om P. Mandhana, Jin Zhao, Comparative Study on Efective-
ness of On-Chip, On-Package and PCB Decoupling for Core Noise
Reduction by Using Broadband Power Delivery Network Models,
Networking and Computer Systems Group Freescale Semiconductor,
Austin, Texas, Sigrity Inc, Santa Clara, CA
[10] Istvan Novak, Overview of Some Options to Create Low-Q
Controlled-ESR Bypass Capacitors, Sreemala Pannala, Jason. R. Miller,
SUN Microsystems, Inc. EPEP2004, October 25-27, 2004, Portland,
OR
[11] Minjia Xu, Member, IEEE, Todd H. Hubing, Senior Member,
IEEE, Juan Chen, Member, IEEE, Tomas P. Van Doren, Fellow, IEEE,
James L. Drewniak, Senior Member, IEEE, and Richard E. DuBrof,
Senior Member, IEEE, Power-Bus Decoupling With Embedded Ca-
pacitance in Printed Circuit Board Design, IEEE Transactions On
Electromagnetic Compatibility, Vol. 45, No. 1, February 2003
[12] Istvan Novak, Comparison of Power Distribution Network
Design Methods, Bypass Capacitor Selection Based on Time Domain
and Frequency Domain Performances, Comparison of Power Distri-
bution Network Design Methods at DesignCon 2006, February 6-9,
2006, Santa Clara, CA
[13] Om P. Mandhana, Efect of Resonant Free Power Delivery
Network Design on VRM Performance, Networking and Computer
Systems Group, Freescale Semiconductor, Austin, Texas
[14] Om P. Mandhana, Modeling, Analysis and Design of Reso-
nant Free Power Distribution Network for Modern Microprocessor
Systems, IEEE Transactions On Advanced Packaging, Vol. 27, No. 1,
February 2004 107, Jun Fan, James L. Knighten*, Antonio Orlandi**,
[15] Norman W. Smith* and James L. Drewniak, Quantifying
Decoupling Capacitor Location, Electromagnetic Compatibility
Laboratory, Department of Electrical and Computer Engineering,
University of Missouri - Rolla, Rolla, MO 65409, USA
[16] T. Hakoda, T. Takahashi, T. Sakusabe, N. Schibuya. , Study on
Noise Reduction Efect Using the Decoupling Capacitor with Resistor
on Power Distribution Line, Proc. APEMC 2008 (Singapore), pp.878-
881, May 2008.
[17] Scott McMorrow, Teraspeed Consulting Group, Brian Vicich,
Samtec, Inc., Steve Weir, Teraspeed Consulting Group, Tom Dagos-
tino, Teraspeed Consulting Group, Pushing the Envelope Without
Tears: An Advanced Power Delivery Solution, DesignCon 2008
[18] Junho Lee, Hyungsoo Kim, and Joungho Kim, Terahertz In-
terconnection & Package Laboratory KAIST, Division of EE and CS
Daejon, South Korea, Broadband Suppression of SSN and Radiated
Emissions using High-DK Tin Film EBG Power Distribution Network
for High-Speed Digital PCB Applications
[19] Iliya Zamek, Nm-Systems Jitter Resonance induced by PDN
noise of toggling on-die Logic, DesignCon 2010
[20] M. Coenen, D. de Greef, Optimization techniques for minimiz-
ing IR-drop and supply bounce, EMCCompo 2005
ADs_EEG13.indd 36 11/16/12 2:54 PM
Nederland
144
Wanneer er meerdere voedings-/massavlakken (PDN)
worden gebruikt in een parallelle, meerlaagse PCB-bundel,
kunnen zich tussen deze lagen verschillende materialen en
ruimtes bevinden. Deze mogen niet worden samengevoegd,
aangezien de Z
0
en
pd
dan zullen verschillen, met een
nieuwe resonantie als gevolg (zie afbeelding 4).
Zoals uit de onderbroken lijn in afbeelding 4 kan worden
afgeleid, geeft alleen een
pd
-verschil van ongeveer 20% in
combinatie met een verschilfactor 2 in Z
0
steile resonanties
op een PCB ter grootte van een Eurocard. Deze verschillen
beginnen al onder 1 GHz. Hieruit blijkt dus dat de topolo-
gien van de PCB-laag die parallel worden gebruikt met een
resonantievrij PDN-design, aan elkaar gelijk moeten zijn
om deze resonanties tussen PDN's onderling te vermijden.
Alleen wanneer de twee of meerdere TL-propagatiever-
tragingen gelijk aan elkaar zijn, gedragen de impedanties zich
als parallel geplaatste weerstanden. In parallelle opstelling
moet de randbegrenzing worden bijgesteld tot de resulterende
parallelle impedantie (zie de ononderbroken lijn in afbeelding
4), zodat de resonantie tussen de PDN's afneemt.
VI. CONCLUSIES
De instructies voor het ontkoppelen van de voeding die
door fabrikanten van de PCB en andere PCB-deskundigen
worden gegeven, zijn tegenstrijdig en worden gebaseerd op
een verouderde ontkoppelingsmethode. Deze verouderde
methoden worden echter nog wel gehanteerd door een
groot deel van de PCB-ontwerpwereld en gentegreerd in
de meeste EDA CAD-toolomgevingen.
Door eenvoudige maatregelen voor de ontkoppeling van
PDN kan de variatie van de spanning c.q. stroom die door
de PDN wordt opgewekt worden gedecimeerd, indien de
maatregelen voor ontkoppeling op de chip of plaat bekend
zijn. Zelfs bij bestaande ontwerpen kan een orde van grootte
worden verbeterd ten behoeve van een afname in kwalit-
eitsfactor en RF-emissie.
Evenwijdige PDN-vlakken op een meerlaagse PCB-
structuur moeten op elkaar worden afgestemd, teneinde
resonantie tussen PDN's onderling te vermijden. Deze reso-
nanties komen zowel bij conventionele als bij resonantievrije
PDN-ontwerpen voor.
Bij het gebruik van PDN-vlakstructuren met gelijke
propagatievertragingen bij parallelle opstelling moeten
randbegrenzingsnetwerken dienovereenkomstig worden
aangepast.
MET DANK AAN
De auteur bedankt zijn klant, die hem de kans bood
gezamenlijk deze testmethode te ontwikkelen. Het uit-
gevoerde werk wordt ondersteund door het Nederlandse
overheidsprogramma voor innovatie WBSO, onder het
nummer ZT09051042.SO.
REFERENTIES
[1] Mart Coenen, Arthur van Roermund, Resonant-Free PDN
Design, EMCCompo2011
[2] Bogatin, Eric, Signal and power integrity, Simplifed, Pearson
Education Inc, 2010
[3] Volkan Kursun, Eby G. Friedman, Multi-voltage CMOS circuit
design, John Wiley and Sons, 2006 - Technology & Engineering
[4] Renatas Jakushokas, Mikhail Popovich, Andrey V. Mezhiba,
Selcuk Kose, Eby G. Friedman, Power Distribution Networks with
On-Chip Decoupling Capacitors,Springer, 2010
[5] Special Issue on PCB Level Signal Integrity, Power Integrity,
and EMC, IEEE Transactions on Electromagnetic Compatibility, Vol.
52, No. 2, May 2010, Bevat meer dan 100 referenties.
[6] John Andresakis, Embedded Capacitors, Strategic Technology
Oak-Mitsui Technologies, 11-2005
[7] 3M, A High Performance Embedded Capacitance PCB Lami-
nate, http://solutions.3m.com/wps/portal/3M/en_US/EmbeddedCa-
pacitance-Material/Home/Learn/WhatIsECM/
[8] Iliya Zamek, SoC-System Jitter Resonance and its Impact on
Common Approach to the PDN Impedance, Altera Corporation, San
Jose, USA
[9] Om P. Mandhana, Jin Zhao, Comparative Study on Efective-
ness of On-Chip, On-Package and PCB Decoupling for Core Noise
Reduction by Using Broadband Power Delivery Network Models,
Networking and Computer Systems Group Freescale Semiconductor,
Austin, Texas, Sigrity Inc, Santa Clara, CA
[10] Istvan Novak, Overview of Some Options to Create Low-Q
Controlled-ESR Bypass Capacitors, Sreemala Pannala, Jason. R. Miller,
SUN Microsystems, Inc. EPEP2004, October 25-27, 2004, Portland,
OR
[11] Minjia Xu, Member, IEEE, Todd H. Hubing, Senior Member,
IEEE, Juan Chen, Member, IEEE, Tomas P. Van Doren, Fellow, IEEE,
James L. Drewniak, Senior Member, IEEE, and Richard E. DuBrof,
Senior Member, IEEE, Power-Bus Decoupling With Embedded Ca-
pacitance in Printed Circuit Board Design, IEEE Transactions On
Electromagnetic Compatibility, Vol. 45, No. 1, February 2003
[12] Istvan Novak, Comparison of Power Distribution Network
Design Methods, Bypass Capacitor Selection Based on Time Domain
and Frequency Domain Performances, Comparison of Power Distri-
bution Network Design Methods at DesignCon 2006, February 6-9,
2006, Santa Clara, CA
[13] Om P. Mandhana, Efect of Resonant Free Power Delivery
Network Design on VRM Performance, Networking and Computer
Systems Group, Freescale Semiconductor, Austin, Texas
[14] Om P. Mandhana, Modeling, Analysis and Design of Reso-
nant Free Power Distribution Network for Modern Microprocessor
Systems, IEEE Transactions On Advanced Packaging, Vol. 27, No. 1,
February 2004 107, Jun Fan, James L. Knighten*, Antonio Orlandi**,
[15] Norman W. Smith* and James L. Drewniak, Quantifying
Decoupling Capacitor Location, Electromagnetic Compatibility
Laboratory, Department of Electrical and Computer Engineering,
University of Missouri - Rolla, Rolla, MO 65409, USA
[16] T. Hakoda, T. Takahashi, T. Sakusabe, N. Schibuya. , Study on
Noise Reduction Efect Using the Decoupling Capacitor with Resistor
on Power Distribution Line, Proc. APEMC 2008 (Singapore), pp.878-
881, May 2008.
[17] Scott McMorrow, Teraspeed Consulting Group, Brian Vicich,
Samtec, Inc., Steve Weir, Teraspeed Consulting Group, Tom Dagos-
tino, Teraspeed Consulting Group, Pushing the Envelope Without
Tears: An Advanced Power Delivery Solution, DesignCon 2008
[18] Junho Lee, Hyungsoo Kim, and Joungho Kim, Terahertz In-
terconnection & Package Laboratory KAIST, Division of EE and CS
Daejon, South Korea, Broadband Suppression of SSN and Radiated
Emissions using High-DK Tin Film EBG Power Distribution Network
for High-Speed Digital PCB Applications
[19] Iliya Zamek, Nm-Systems Jitter Resonance induced by PDN
noise of toggling on-die Logic, DesignCon 2010
[20] M. Coenen, D. de Greef, Optimization techniques for minimiz-
ing IR-drop and supply bounce, EMCCompo 2005
ADs_EEG13.indd 36 11/16/12 2:54 PM
ADs_EEG13.indd 37 11/16/12 2:55 PM
147
S
C
H
W
E
I
Z
147
Contents | Schweiz
Gustav
Guanella (19091982)
RESSOURCEN

148
150
Gustav Guanella war ein schweizer Ernder, der
zahlreiche Patente besa.
Guanella studier te Elektrotechnik an der
Eidgenssischen Technischen Hochschule Zrich und
graduierte 1933. Er war ein Assistent von Professor
Fritz Fischer, der das Eidophor-System fr die
grochige Projektion von Fernsehbildern erfand.
G u a n e l l a i n t e r e s s i e r t e s i c h f r
Hochfrequenzelektronik. Seine Er findungen
fhrten zu 40 Patentantrgen. Guanella arbeitete
fr die BBC Schweiz und wurde Leiter einer Abteilung, die sich mit der Entwicklung von
Hochfrequenzelektronik befasste. Er ist einer der Erndert der DSSS-bertragungstechnik
(Direct Sequence Spread Spectrum).
Guanella erfand den Guanella-Balun, einen Hochfrequenz-Impedanzadapter.
SWI_TOC_EEG13.indd 147 11/16/12 5:05 PM
ADs_EEG13.indd 37 11/16/12 2:55 PM
147
S
C
H
W
E
I
Z
147
Contents | Schweiz
Gustav
Guanella (19091982)
RESSOURCEN

148
150
Gustav Guanella war ein schweizer Ernder, der
zahlreiche Patente besa.
Guanella studier te Elektrotechnik an der
Eidgenssischen Technischen Hochschule Zrich und
graduierte 1933. Er war ein Assistent von Professor
Fritz Fischer, der das Eidophor-System fr die
grochige Projektion von Fernsehbildern erfand.
G u a n e l l a i n t e r e s s i e r t e s i c h f r
Hochfrequenzelektronik. Seine Er findungen
fhrten zu 40 Patentantrgen. Guanella arbeitete
fr die BBC Schweiz und wurde Leiter einer Abteilung, die sich mit der Entwicklung von
Hochfrequenzelektronik befasste. Er ist einer der Erndert der DSSS-bertragungstechnik
(Direct Sequence Spread Spectrum).
Guanella erfand den Guanella-Balun, einen Hochfrequenz-Impedanzadapter.
SWI_TOC_EEG13.indd 147 11/16/12 5:05 PM
148
Schweiz | Produkte und Services
A
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Pro Nova Elektronik GmbH; Ludwigsburg Deutschland;
+49 7141 2858 20; Fax: +49 7141 2858 29;
pne@pronovagmbh.de; www.AHSystems.com
Testen
ABB Ltd.
Affolternstrasse 44, City Port, Postfach 8131, Zurich,
8050, Schweiz;
+41 43 317 7111; Fax: +41 43 317 4420;
Thomas Schmidt, media.relations@ch.abb.com; www.
abb.com
AR/RF Microwave Instrumentation
Emitec AG, Business Cube, Birkenstrasse 47, Rotkrueuz,
Schweiz 6343;
+41 41 748 6010; Fax: +41 41 748 5055;
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p.wuethrich@emitec.ch; www.emitec.ch
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Ciba Inc.
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EXZELLENT, WEIL EFFIZIENT!
NSG 4070 DER MULTIFUNKTIONS-
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Der NSG 4070, ein Multitalent fr entwicklungsbegleitende Tests und Normprfungen
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A
A.H. Systems
Pro Nova Elektronik GmbH; Ludwigsburg Deutschland;
+49 7141 2858 20; Fax: +49 7141 2858 29;
pne@pronovagmbh.de; www.AHSystems.com
Testen
ABB Ltd.
Affolternstrasse 44, City Port, Postfach 8131, Zurich,
8050, Schweiz;
+41 43 317 7111; Fax: +41 43 317 4420;
Thomas Schmidt, media.relations@ch.abb.com; www.
abb.com
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Riedmatt 9 8153 Rumlang;
+41 44 8176-217; www.arroweurope.com
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United Kingdom;
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Ciba Inc.
Klybeckstr. 141, 4057 Basel, Schweiz;
+41 61 636 6049; Fax: +41 61 636 3019;
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Industries International Inc., Cham, Schweiz;
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E
EM TEST AG
EMITEC AG, Business Cube, Birkenstrasse 47, CH-6343
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Ittigen, Schweiz;
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Schweiz;
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Produkte und Services | Schweiz
H
Haefely Test AG
Roschi Rohde & Schwarz AG, Mhlestrasse 7, CH 3063
Ittigen, Schweiz;
+41 31 922 1522; Fax: +41 31 921 8101;
Kurt Schilter, sales@roschi.rohde-schwarz.com;
www.roschi.rohde-schwarz.ch
I
a TESEQ Company
+41 32 681 40 40; Fax +41 32 681 40 48;
L
ROSCHI ROHDE & SCHWARZ AG,
Mhlestrasse 7, CH - 3063 Ittigen;
+41 (0)31 92-215 22; Fax: +41 (0)31 92-181 01;
schwarz.ch; www.langer-emv.de
M
a TESEQ Company
Milmega
+41 32 681 40 40; Fax +41 32 681 40 48;
S
AWAG Elektrotechik AG, Sandbelstrasse 2, CH-8604
Volketswil, Schweiz;
+41 44 908 1919; Fax +41 44 908 1999;
Oliver Huber, info@awag.ch; www.awag.ch
Produkte und Services: Leitungsmaterialien,
Abschirmung
SCHURTER AG
Werkhofstrasse 8-12, Postfach, 6002 Luzern, Schweiz;
+41 41 369 31 11; Fax: +41 41 369 33 33;
Herbert Blum; herbert.blum@schurter.ch; www.
schurter.com
Produkt und Services: Filter, Drosseln, Testen
Schmid & Partner Engineering AG (SPEAG)
Zeughausstrasse 43, Zurich, CH 8004, Schweiz;
+41 44 245 9691; Fax: +41 44 245 97 79;
www.schurter.ch
EXZELLENT, WEIL EFFIZIENT!
NSG 4070 DER MULTIFUNKTIONS-
GENERATOR
Der NSG 4070, ein Multitalent fr entwicklungsbegleitende Tests und Normprfungen
nach IEC/EN 61000-4-6. Wer bisher viel Zeit fr die Prfplatzkalibrierung, die Anbindung
des EUT-Monitors oder die Dokumentation aufwenden musste, kann Strfestigkeits-
prfungen nun mit dem NSG 4070 viel effzienter durchfhren. Die weiteren Highlights:
EUT-Monitoring-Ergebnisse knnen whrend der Prfung kommentiert werden, die
Ausgabe erfolgt im Report. Abspeichermglichkeit fr Ergebnisse, Konfgurationen und
Kalibrierdateien mit bis zu 340 Daten.
Der NSG 4070 auf einen Blick:
Lsung fr IEC/EN 61000-4-6 und Automotive BCI
Frequenzbereich 9 kHz bis 1 GHz
Einfache Bedienung ber Frontplatte oder Windows-Software
Anzeige der Kalibrierdaten in graphischer und tabellarischer Form
Verstrker-Sttigungs-Check
Regelung des Kalibrier- und Prfpegels anhand der Vorwrtsleistung
am Verstrkerausgang
Teseq AG 4542 Luterbach Schweiz
T + 41 32 681 40 50 www.teseq.com
150
Schweiz | Ressourcen
T
Teseq AG
+41 32 681 40 40; Fax +41 32 681 40 48;
Produkt und Services: Verstrker (HF & Mikrowellen),
Antennen, Automotive Systeme, leitungsgebundene
Strfestigkeit, leitungsgebundene berspannung &
schnelle Transienten, ESD, Netzoberwellen & Flicker,
GTEM Zellen, HF Immunitts- und Emissionssysteme,
HF Testsoftware, Kalibration & Service
RESSOURCEN
FEDERAL MINISTRY OF ECONOMICS
AND TECHNOLOGY RADIO FREQUENCY
POLICY, ELECTROMAGNETIC
COMPATIBILITY
Villemombler Strae 76 53123 Bonn;
+49 228 99615-3258; Fax: +49 228 99 615- 3264;
Michael Scharnberg, Michael.Scharnberg@bmwi.
bund.de
Follow Us on Twitter @e_cooling
SWI_PS_R_EEG13.indd 150 11/16/12 8:15 PM ADs_EEG13.indd 38 11/16/12 2:56 PM
150
Schweiz | Ressourcen
T
Teseq AG
+41 32 681 40 40; Fax +41 32 681 40 48;
Produkt und Services: Verstrker (HF & Mikrowellen),
Antennen, Automotive Systeme, leitungsgebundene
Strfestigkeit, leitungsgebundene berspannung &
schnelle Transienten, ESD, Netzoberwellen & Flicker,
GTEM Zellen, HF Immunitts- und Emissionssysteme,
HF Testsoftware, Kalibration & Service
RESSOURCEN
FEDERAL MINISTRY OF ECONOMICS
AND TECHNOLOGY RADIO FREQUENCY
POLICY, ELECTROMAGNETIC
COMPATIBILITY
Villemombler Strae 76 53123 Bonn;
+49 228 99615-3258; Fax: +49 228 99 615- 3264;
Michael Scharnberg, Michael.Scharnberg@bmwi.
bund.de
Follow Us on Twitter @e_cooling
SWI_PS_R_EEG13.indd 150 11/16/12 8:15 PM ADs_EEG13.indd 38 11/16/12 2:56 PM
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153
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E
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153
Contents | Belique
Femke
Olyslager (19662009)
RESSOURCES

154
156
Femke Olyslager est un ingnieur scientique belge.
Dtentrice dune matrise et dun doctorat en
ingnierie lectrique obtenus lUniversit de
Gand, en Belgique, elle enseigne, en tant que
professeur, llectromagntisme lUniversit
de Gand. Ses contributions dans le domaine de
llectromagntisme se traduisent par la rdaction
ou la co-rdaction de 300 publications dans des
revues internationales et des actes de confrences.
Olyslager a t la sous-secrtaire gnrale
de lUnion Radio-Scientique Internationale, la rdactrice en chef adjointe de la revue IEEE
Transactions on Antennas and Propagation et la rdactrice en chef adjointe de Radio Science.
Olyslager a reu le prix IEEE Microwave en 1995 pour le meilleur article publi dans la revue
IEEE Transactions On Microwave Theory and Techniques en 1993 et le Best Transactions
Paper Award en 2000 pour le meilleur article publi dans la revue IEEE Transactions on
Electromagnetic Compatibility en 1999. En 2002, elle reoit la Mdaille dOr Issac Koga de lURSI
(en reconnaissance pour son travail en lectromagntisme). En 2004, elle devient laurate de
lAcadmie royale amande de Belgique. En 2005, elle est lue membre-associe de lIEEE.
BEL_TOC_EEG13.indd 153 11/16/12 5:14 PM
ADs_EEG13.indd 39 11/16/12 2:56 PM
153
B
E
L
G
I
Q
U
E
153
Contents | Belique
Femke
Olyslager (19662009)
RESSOURCES

154
156
Femke Olyslager est un ingnieur scientique belge.
Dtentrice dune matrise et dun doctorat en
ingnierie lectrique obtenus lUniversit de
Gand, en Belgique, elle enseigne, en tant que
professeur, llectromagntisme lUniversit
de Gand. Ses contributions dans le domaine de
llectromagntisme se traduisent par la rdaction
ou la co-rdaction de 300 publications dans des
revues internationales et des actes de confrences.
Olyslager a t la sous-secrtaire gnrale
de lUnion Radio-Scientique Internationale, la rdactrice en chef adjointe de la revue IEEE
Transactions on Antennas and Propagation et la rdactrice en chef adjointe de Radio Science.
Olyslager a reu le prix IEEE Microwave en 1995 pour le meilleur article publi dans la revue
IEEE Transactions On Microwave Theory and Techniques en 1993 et le Best Transactions
Paper Award en 2000 pour le meilleur article publi dans la revue IEEE Transactions on
Electromagnetic Compatibility en 1999. En 2002, elle reoit la Mdaille dOr Issac Koga de lURSI
(en reconnaissance pour son travail en lectromagntisme). En 2004, elle devient laurate de
lAcadmie royale amande de Belgique. En 2005, elle est lue membre-associe de lIEEE.
BEL_TOC_EEG13.indd 153 11/16/12 5:14 PM
154
Belgique | Produits et Services
A
A.H. Systems
8239 DA, Lelystad, Nederland;
+31 320 295 395; Fax: +31 320 413 133;
info@eemc.nl; www.AHSystems.com
contrle, Contrles
ANPI
Parc scientifique Fleming, Rue Granbonpr 1, 1348
Louvain-la-Neuve, Belgique;
+32(0) 10 47 52 11; Fax: +32(0) 10 47 52 70;
info@anpi.be; www.anpi.be
AR Benelux B.V.
Frankrijklaan 7, ITC Boskoop,
NL-2391 PX, Hazerswoude-Dorp, Nederland;
+31(0)172 423 000; Fax: +31(0)172 423 009;
Onno de Meyer, info@arbenelux.com;
www.arbenelux.com
cltures, Hausse et lments temporaires, Instru-
ment de contrle
Arrow Europe
Keiberg II Minervastraat 14/B2 1930 Zaventem;
+32 (0) 27 25 46 60; www.arroweurope.com
Produits et services: Ferrites, cbles et con-
necteurs, applications de puissance
B
Bekaert Fibre Technologies
President Kennedypark 18, B-8500 Kor trijk Bel-
gique;
+32(0) 56 23 05 11; Fax: +32 (0) 56 23 0543;
www.bekaert.com
Produits et services: Protection
BGEMC
Joseph Cardijnstraat 21, Erpe-Mere,
OVl, B-9420, Belgium;
+32(0)53 60 16 01; Fax:+32(0)53 70 78 99;
Johan De Temmerman; johan.de.temmerman@
moreatmere.com; www.bgemc.com
C
Carlisle Interconnect
Technologies
United Kingdom;
+44-7817-731-000;
Andy Bowne, Andy.Bowne@carlisleit.com; www.
CarlisleIT.com
D
Dow Corning Corporation
Dow Corning Europe SA, Parc Industriel - Zone C,
Rue Jules Bordet, 7180 Seneffe, Belgium,
+32 64 511 163, Fax: +32 64 888 401,
Linda Coughlin, l.m.coughlin@dowcorning.com;
www.dowcorning.com
Produits et services: Test
E
EM Test AG
EM Test GmbH, Lnener Strasse 211, 59174 Kamen,
Deutschland;
+49 (0) 2307 26070 0; Fax: +49 (0) 2307 17050;
info@emtest.de; www.emtest.de
Produits et services: Hausse et lments tem-
poraires, Contrles Instrumentation, Contrles
EMC Partner
Decatel S.A, Rue de la Technologie 31BE,
1082 Berchem-Ste-Agathe, Belgium;
+32 2 469 00 90; Fax: +32 2 469 06 07;
info@decatel.be; www.decatel.be
poraires, Instrument de contrle
F
HF Technology, Atalanta 5, 1562 LC Krommenie,
Holland;
+31 (0)75 - 628 37 17; Fax: +31 (0)75 - 621 11 20;
Produits et services: Ferrite, Filtres, Espaces
sous protection et cltures, Protection
I
a TESEQ Company
Accelonix BV, Postbus 7044,
5605 JA Eindhoven, Netherlands;
+31 40 750 1650; Fax: +31 40 293 0722;
Produits et services: Concepteurs et fabricants
PRODUITS ET
SERVICES
BEL_PS_R_EEG13.indd 154 11/16/12 5:17 PM
155
Produits et Services | Belgique
d ampl i f i cat eur s r adi of r quences et hyper-
frquences de haute puissance ( Tetrode Tubes,
Solid State and TWT)
L
Laborelec
Rodestraat 125, B -1630 Linkebeek, Belgique,
+32(0)2 382 02 11; Fax: +32(0)2 382 02 41;
info@laborelec.com; www.laborelec.com
M
a TESEQ Company
MILMEGA
+31 40 750 1650; Fax: +31 40 293 0722;
frquences de haute puissance
N
Nexio
EEMC Coimex, Apolloweg 80 8239 Da Lelystad,;
+31 320 295 395; Fax: +31 320 413 133;
www.eemc.nl/eng; info@eemc.nl
S
SHIELDINX
De Ploegschaar 135, 5056 MC Berkel-Enschot,
Netherlands
Protection
T
Tech-Etch, Inc.
+31 75 628 37 17; Fax: +31 75 621 11 20;
Protection
Teseq Ltd.
+31 40 750 1650; Fax: +31 40 293 0722;
Produits et services: Amplificateurs, antennes,
Automotive Systems, Immunit aux perturbations
conduites, les surtensions transitoires et conduites,
lEDD, Harmoniques et Flicker, les cellules GTEM,
Systmes dimmunit RF, RF Systems mission,
logiciel de test RF, dtalonnage et Servicetesting
ITS 6006 EMC IMMUNITY
TEST SYSTEM
INGENIOUSLY INTEGRATED TESTING
TO 6 GHz
There has never been a specially designed compact system for radiated immunity EMC
testing like this: The ITS 6006 ingeniously integrates a large number of functions, reducing
setup time, cable losses, errors and costs. This versatile unit is as fexible as it is safe, and
its 2.8 color display makes it especially easy to use. It features an impressive variety of
immunity tests to address a wide range of IEC standards. With the ITS 6006, TESEQ once
again demonstrates its leading expertise in the feld of immunity testing.
Signal generator with AM/PM/external modulation
Integrated 4-channel RF switch network
Ampliferinterlockcontrol
Remote control via USB, RS 232 or LAN
Extensive EUT monitoring
Power meter integration
PM 6006 Power Meter
RMS power meter, 1 MHz to 6 GHz
Linear from 45 dBm to 20 dBm
Connection to PC/USB or directly to an ITS 6006
Accelonix BV Eindhoven The Netherlands
T +31 40 750 1650 www.accelonix.nl
154
A
A.H. Systems
8239 DA, Lelystad, Nederland;
+31 320 295 395; Fax: +31 320 413 133;
info@eemc.nl; www.AHSystems.com
contrle, Contrles
ANPI
Parc scientifique Fleming, Rue Granbonpr 1, 1348
Louvain-la-Neuve, Belgique;
+32(0) 10 47 52 11; Fax: +32(0) 10 47 52 70;
info@anpi.be; www.anpi.be
AR Benelux B.V.
Frankrijklaan 7, ITC Boskoop,
NL-2391 PX, Hazerswoude-Dorp, Nederland;
+31(0)172 423 000; Fax: +31(0)172 423 009;
www.arbenelux.com
cltures, Hausse et lments temporaires, Instru-
ment de contrle
Arrow Europe
Keiberg II Minervastraat 14/B2 1930 Zaventem;
+32 (0) 27 25 46 60; www.arroweurope.com
Produits et services: Ferrites, cbles et con-
necteurs, applications de puissance
B
Bekaert Fibre Technologies
President Kennedypark 18, B-8500 Kor trijk Bel-
gique;
+32(0) 56 23 05 11; Fax: +32 (0) 56 23 0543;
www.bekaert.com
Produits et services: Protection
BGEMC
Joseph Cardijnstraat 21, Erpe-Mere,
OVl, B-9420, Belgium;
+32(0)53 60 16 01; Fax:+32(0)53 70 78 99;
Johan De Temmerman; johan.de.temmerman@
moreatmere.com; www.bgemc.com
C
Carlisle Interconnect
Technologies
United Kingdom;
+44-7817-731-000;
Andy Bowne, Andy.Bowne@carlisleit.com; www.
CarlisleIT.com
D
Dow Corning Corporation
Dow Corning Europe SA, Parc Industriel - Zone C,
Rue Jules Bordet, 7180 Seneffe, Belgium,
+32 64 511 163, Fax: +32 64 888 401,
Linda Coughlin, l.m.coughlin@dowcorning.com;
www.dowcorning.com
Produits et services: Test
E
EM Test AG
EM Test GmbH, Lnener Strasse 211, 59174 Kamen,
Deutschland;
+49 (0) 2307 26070 0; Fax: +49 (0) 2307 17050;
info@emtest.de; www.emtest.de
poraires, Contrles Instrumentation, Contrles
EMC Partner
Decatel S.A, Rue de la Technologie 31BE,
1082 Berchem-Ste-Agathe, Belgium;
+32 2 469 00 90; Fax: +32 2 469 06 07;
info@decatel.be; www.decatel.be
poraires, Instrument de contrle
F
HF Technology, Atalanta 5, 1562 LC Krommenie,
Holland;
+31 (0)75 - 628 37 17; Fax: +31 (0)75 - 621 11 20;
Produits et services: Ferrite, Filtres, Espaces
sous protection et cltures, Protection
I
a TESEQ Company
+31 40 750 1650; Fax: +31 40 293 0722;
PRODUITS ET
SERVICES
155
Produits et Services | Belgique
frquences de haute puissance ( Tetrode Tubes,
Solid State and TWT)
L
Laborelec
Rodestraat 125, B -1630 Linkebeek, Belgique,
+32(0)2 382 02 11; Fax: +32(0)2 382 02 41;
info@laborelec.com; www.laborelec.com
M
a TESEQ Company
MILMEGA
+31 40 750 1650; Fax: +31 40 293 0722;
frquences de haute puissance
N
Nexio
EEMC Coimex, Apolloweg 80 8239 Da Lelystad,;
+31 320 295 395; Fax: +31 320 413 133;
www.eemc.nl/eng; info@eemc.nl
S
SHIELDINX
De Ploegschaar 135, 5056 MC Berkel-Enschot,
Netherlands
Protection
T
Tech-Etch, Inc.
+31 75 628 37 17; Fax: +31 75 621 11 20;
Protection
Teseq Ltd.
+31 40 750 1650; Fax: +31 40 293 0722;
Produits et services: Amplificateurs, antennes,
Automotive Systems, Immunit aux perturbations
conduites, les surtensions transitoires et conduites,
lEDD, Harmoniques et Flicker, les cellules GTEM,
Systmes dimmunit RF, RF Systems mission,
logiciel de test RF, dtalonnage et Servicetesting
ITS 6006 EMC IMMUNITY
TEST SYSTEM
INGENIOUSLY INTEGRATED TESTING
TO 6 GHz
There has never been a specially designed compact system for radiated immunity EMC
testing like this: The ITS 6006 ingeniously integrates a large number of functions, reducing
setup time, cable losses, errors and costs. This versatile unit is as fexible as it is safe, and
its 2.8 color display makes it especially easy to use. It features an impressive variety of
immunity tests to address a wide range of IEC standards. With the ITS 6006, TESEQ once
again demonstrates its leading expertise in the feld of immunity testing.
Signal generator with AM/PM/external modulation
Integrated 4-channel RF switch network
Ampliferinterlockcontrol
Remote control via USB, RS 232 or LAN
Extensive EUT monitoring
Power meter integration
PM 6006 Power Meter
RMS power meter, 1 MHz to 6 GHz
Linear from 45 dBm to 20 dBm
Connection to PC/USB or directly to an ITS 6006
Accelonix BV Eindhoven The Netherlands
T +31 40 750 1650 www.accelonix.nl
156
Belgique | Ressources
ASSOCIATIONS
Dodeweg 6B, 3832 RC Leusden, Postbus 366,
3830 AK Leusden, The Netherlands; +(033) 465
75 07; Fax: +(033 ) 461 66 38; Chairman Cees
Keyer; c.h.a.keyer@hva.nl; www.emc-esd.nl
NOTIFIED BODIES
AIB-VINOTTE BELGIUM
Business Class Kantorenpark, Jan Olieslagerslan,
35, 1800 Vilvoorde, Belgique; +32 (0)2 674 57 11;
Fax: +32 (0)2 674 59 59; brussels@vincotte.be;
www.vincotte.be
ANPI
Parc scientifique Fleming, Rue Granbonpr 1,
1348 Louvain-La-Neuve, Belgique; +32 10 47 52
11; Fax: +32 10 47 52 70; info@anpi.be; www.
anpi.be
BLUE GUIDE EMC LAB
Joseph Cardijnstraat 21, 9420 Erpe-Mere,
Belgique; +32 53 60 16 01; Fax: +32 53 70 78 99;
info@bgemc.com; www.bgemc.com
LABORATORIA DE NAYER
J.P. De Nayerlaan 9, 2860 Sint-Katelijne-Waver,
Belgique; +32 (0)15 31 33 22; Fax: +32 (0)15
32 12 12; Filip Nauwelaerts; f.nauwelaerts@
labodenayer.be; www.labodenayer.be
LABORATOIRE COMPATIBILIT
LECTROMAGNTIQUE - UNIVERSIT
DE LIGE
Universit de Lige Sart-Tilman, Institut
Montefiore, B28, 4000 LIEGE, Belgique, +32
4 366 37 46, Fax: +32 4 366 29 10, Vronique
Beauvois; V.Beauvois@ulg.ac.be; www.ulg.ac.be
LABORELEC
Rodestraat 125, 1630 Linkebeek, Belgique; +32 2
382 02 11; Fax: +32 2 382 02 41; info@laborelec.
com; www.laborelec.com
LEMCKO
Graaf Karel De Goedelaan 34, 8500 Kortrijk,
Belgique; +32 56 24 12 35; Fax: +32 56 24 12 34;
lemcko@howest.be; http://www.lemcko.be/
SGS BELGIUM NV - DIVISION CEBEC
SGS House, Noorderlaan 87, Antwerpen, 2030,
Belgique; +32 3 545 44 00; Fax: +32 3 545 44 99;
info@cebec.be; www.cebec.sgs.com
OTHER
INSTITUT BELGE DES
SERVICES POSTAUX ET DES
TLCOMMUNICATIONS / BELGISCH
INSTITUUT VOOR POSTDIENSTEN EN
TELECOMMUNICATIE (BIPT)
Ellipse Building - Btiment C, Boulevard du Roi
Albert II 35, 1030 Bruxelles, Belgique; +02 226
88 88; Fax: +02 226 88 77; Eric Colpaert, Eric.
Colpaert@BIPT.be
Got thermal problems?
Weve got solutions!
Read the latest news,
standards & product updates
Find products & services with
our Buyers Guide
Download the most recent
issue of Electronics Cooling
Share & comment on stories
with colleagues
Visit us online at
Electronics-Cooling.com
Connect with us
on LinkedIn
ITEM

156
Belgique | Ressources
ASSOCIATIONS
Dodeweg 6B, 3832 RC Leusden, Postbus 366,
3830 AK Leusden, The Netherlands; +(033) 465
75 07; Fax: +(033 ) 461 66 38; Chairman Cees
Keyer; c.h.a.keyer@hva.nl; www.emc-esd.nl
NOTIFIED BODIES
AIB-VINOTTE BELGIUM
Business Class Kantorenpark, Jan Olieslagerslan,
35, 1800 Vilvoorde, Belgique; +32 (0)2 674 57 11;
Fax: +32 (0)2 674 59 59; brussels@vincotte.be;
www.vincotte.be
ANPI
Parc scientifique Fleming, Rue Granbonpr 1,
1348 Louvain-La-Neuve, Belgique; +32 10 47 52
11; Fax: +32 10 47 52 70; info@anpi.be; www.
anpi.be
BLUE GUIDE EMC LAB
Joseph Cardijnstraat 21, 9420 Erpe-Mere,
Belgique; +32 53 60 16 01; Fax: +32 53 70 78 99;
info@bgemc.com; www.bgemc.com
LABORATORIA DE NAYER
J.P. De Nayerlaan 9, 2860 Sint-Katelijne-Waver,
Belgique; +32 (0)15 31 33 22; Fax: +32 (0)15
32 12 12; Filip Nauwelaerts; f.nauwelaerts@
labodenayer.be; www.labodenayer.be
LABORATOIRE COMPATIBILIT
LECTROMAGNTIQUE - UNIVERSIT
DE LIGE
Universit de Lige Sart-Tilman, Institut
Montefiore, B28, 4000 LIEGE, Belgique, +32
4 366 37 46, Fax: +32 4 366 29 10, Vronique
Beauvois; V.Beauvois@ulg.ac.be; www.ulg.ac.be
LABORELEC
Rodestraat 125, 1630 Linkebeek, Belgique; +32 2
382 02 11; Fax: +32 2 382 02 41; info@laborelec.
com; www.laborelec.com
LEMCKO
Graaf Karel De Goedelaan 34, 8500 Kortrijk,
Belgique; +32 56 24 12 35; Fax: +32 56 24 12 34;
lemcko@howest.be; http://www.lemcko.be/
SGS BELGIUM NV - DIVISION CEBEC
SGS House, Noorderlaan 87, Antwerpen, 2030,
Belgique; +32 3 545 44 00; Fax: +32 3 545 44 99;
info@cebec.be; www.cebec.sgs.com
OTHER
INSTITUT BELGE DES
SERVICES POSTAUX ET DES
TLCOMMUNICATIONS / BELGISCH
INSTITUUT VOOR POSTDIENSTEN EN
TELECOMMUNICATIE (BIPT)
Ellipse Building - Btiment C, Boulevard du Roi
Albert II 35, 1030 Bruxelles, Belgique; +02 226
88 88; Fax: +02 226 88 77; Eric Colpaert, Eric.
Colpaert@BIPT.be
Got thermal problems?
Weve got solutions!
Read the latest news,
standards & product updates
Find products & services with
our Buyers Guide
Download the most recent
issue of Electronics Cooling
Share & comment on stories
with colleagues
Visit us online at
Electronics-Cooling.com
Connect with us
on LinkedIn
ITEM

157
S
T
E
R
R
E
I
C
H
157
Contents | sterrreich

158
Carl August von Steinheil war ein sterreichisch-
deutscher Physiker, Ernder, Techniker und Astronom.
Im Jahr 1839 benutzte Steinheil Silberchloridpapier
und eine tubusfrmige Kamera aus verschiebbaren
Papprhren um Motive aufzunehmen. Er erfand
den ersten Daguerreotypen in Deutschland.
1846 ging Steinheil nach Neapel, um dort ein
neues System fr Gewichts- und Maeinheiten
einzufhren. Drei Jahre spter arbeitete er im
Departement fr Telegraphie im sterreichischen
Handelsministerium, entwarf ein Telegraphennetzwerk fr die k.u.k. Monarchie und beteiligte
sich an der Grndung des Deutsch-sterreichischen Telegraphenvereins. 1851 baute er das
Schweizer Telegraphenwesen auf, worauf er nach Mnchen zurckkehrte und Kurator der
mathematisch-physikalischen Sammlungen und Ministerialrat im Handelsministerium von
Bayern wurde.
Er erfand die elektrische Erdrckleitung, den Schreibtelegraphen, die elektrische Uhr, die
Steinheil-Schrift, das Steinheil-Doublet (eine achromatische Linse) und die Silberbeschichtung
von Glas fr die Verwendung in Teleskopen.
Carl August
von Steinheil (18011870)
AUS_TOC_EEG13.indd 157 11/16/12 5:18 PM
158
sterreich | Produkte und Services
A
A.H. Systems, Inc.
Pro Nova Elektronik GmbH, Ludwigsburg, sterreich;
+49 7141 2858 20; Fax: +49 7141 2858 29;
pne@pronovagmbh.de;
www.AHSystems.com
Testen
EMV GmbH, Wallbergstr.7,
Taufkirchen, Deutschland, D-82024;
+49 8961 41710; Fax: +49 8961 417171;
www.emvGmbh.de; www.arworld.us
Arrow Europe
Landstraer Haupstrae 97-101 / Stiege 1 / 4A 1030
Wien;
+43 (01) 360 46-50; www.arroweurope.com.
E
EM TEST GmbH
UEI Universal Elektronik Import GmbH, Anton Freun-
schlag Gasse 49, 1230 Vienna, sterreich;
+43(0)1 545 1588; Fax: +43(0)1 545 1464;
www.uei-vienna.com/index.php/kontakt; www.uei-
vienna.com
Produkte und Services: Testen & Testausstattungen
fr ESD, BURST, SURGE, Dips &Drops, RWG, RF Immu-
nity, Telecom, Automotive sowie Ueberspannung und
Einschaltstsse.
F
Industrial Electronics, Hauptstr. 71 - 79 D-65760 Esch-
born sterreich;
+49 6196 927900; Fax: +49 6196 927929;
PRODUKTE
UND SERVICES
AUS_PS_R_EEG13.indd 158 11/16/12 5:19 PM
159
Produkte und Services | sterreich
I
a TESEQ Company
deg-Messtechnik GmbH
Meldemannstrasse 18, 1200 Wien;
+43 1 +813 5380-0; Fax: +43 1 813 5380-3059;
info@deg-messtechnik.at; www.deg-messtechnik.at
+49 (0) 6122 / 7 26 60-0; Fax: +49 (0) 6122 / 7 26 60-29;
M
a TESEQ Company
Milmega
deg-Messtechnik GmbH Meldemannstrasse 18, 1200
Wien;
+43 1 +813 5380-0; Fax: +43 1 813 5380-3059;
info@deg-messtechnik.at;
www.deg-messtechnik.at
S
JiC Warenvertriebs-gesellschaft m.b.H., Theresianum-
gasse 13, Vienna 1040, sterreich;
+43-1-812 2739; Fax: +43-1-812 1081;
John Wellems; john.wellems@jic-trading.com;
www.jic-trading.com
schirmung
Seibersdorf Labor GmbH
Seibersdorf, 2444 Austria;
+43 5055 02882; Fax: +43 5055 02881;
DI Wolfgang Muellner;wolfgang.muellner@seibersdorf-
laboratories.at; www.seibersdorf-laboratories.at
Rume und Gehuse, Testausstattung, Testen
T
Teseq
+43 1 +813 5380-0; Fax: +43 1 813 5380-3059;
Produkte und Services: Verstrker (HF & Mik-
rowellen), Antennen, Automotive Systeme, leitungsge-
bundene Strfestigkeit, leitungsgebundene berspan-
nung & schnelle Transienten, ESD, Netzoberwellen &
Flicker, GTEM Zellen, HF Immunitts- und Emissions-
systeme, HF Testsoftware, Kalibration & Service
ESD Simulator NSG 437
DEr Profi fr
DaS klEiNE BuDGEt
Der NSG 437 mit seinem menugesteuerten, ergonomischen Touchscreen-Kontrollpanel
steht fr hohe technische Performance und einfachste Bedienung. Er wurde speziell fr
Basisanwendungen im 30 kV Bereich entwickelt. Das geniale Gert erfllt alle gngigen
ESD-Standards und gewhrleistet jederzeit die geforderten fnf Sekunden Spannungshal-
tung. Die breite Palette einfach austauschbarer Netzwerk-Module macht das Testgert
speziell fr die Automobilindustrie interessant. Und: Teseq brgt mit seinem weltweiten
Netz an akkreditierten Kalibrierstellen jederzeit fr przise Zertifzierung.
Der Leistungsausweis des NSG 437:
Testet mit Luft- und Kontaktentladung bis 30 kV
Stabilisierte Prfspannung >5 Sekunden
Automatische Polarittsumschaltung
Erfllt IEC, ANSI, SAE, ISO Normen
Grosses Touchscreen-Kontrolldisplay
Schnell auswechselbare Netzwerkmodule
Beliebige R/C-Netzwerke ab 0 Ohm und bis 2 nF
deg-Messtechnik GmbH Wien sterreich
T +43 1 8135 380-0 www.deg-messtechnik.at
158
A
A.H. Systems, Inc.
Pro Nova Elektronik GmbH, Ludwigsburg, sterreich;
+49 7141 2858 20; Fax: +49 7141 2858 29;
pne@pronovagmbh.de;
www.AHSystems.com
Testen
EMV GmbH, Wallbergstr.7,
Taufkirchen, Deutschland, D-82024;
+49 8961 41710; Fax: +49 8961 417171;
www.emvGmbh.de; www.arworld.us
Arrow Europe
Landstraer Haupstrae 97-101 / Stiege 1 / 4A 1030
Wien;
+43 (01) 360 46-50; www.arroweurope.com.
E
EM TEST GmbH
UEI Universal Elektronik Import GmbH, Anton Freun-
schlag Gasse 49, 1230 Vienna, sterreich;
+43(0)1 545 1588; Fax: +43(0)1 545 1464;
www.uei-vienna.com/index.php/kontakt; www.uei-
vienna.com
Produkte und Services: Testen & Testausstattungen
fr ESD, BURST, SURGE, Dips &Drops, RWG, RF Immu-
nity, Telecom, Automotive sowie Ueberspannung und
Einschaltstsse.
F
Industrial Electronics, Hauptstr. 71 - 79 D-65760 Esch-
born sterreich;
+49 6196 927900; Fax: +49 6196 927929;
PRODUKTE
UND SERVICES
159
Produkte und Services | sterreich
I
a TESEQ Company
+43 1 +813 5380-0; Fax: +43 1 813 5380-3059;
+49 (0) 6122 / 7 26 60-0; Fax: +49 (0) 6122 / 7 26 60-29;
M
a TESEQ Company
Milmega
deg-Messtechnik GmbH Meldemannstrasse 18, 1200
Wien;
+43 1 +813 5380-0; Fax: +43 1 813 5380-3059;
info@deg-messtechnik.at;
www.deg-messtechnik.at
S
JiC Warenvertriebs-gesellschaft m.b.H., Theresianum-
gasse 13, Vienna 1040, sterreich;
+43-1-812 2739; Fax: +43-1-812 1081;
John Wellems; john.wellems@jic-trading.com;
www.jic-trading.com
schirmung
Seibersdorf Labor GmbH
Seibersdorf, 2444 Austria;
+43 5055 02882; Fax: +43 5055 02881;
DI Wolfgang Muellner;wolfgang.muellner@seibersdorf-
laboratories.at; www.seibersdorf-laboratories.at
Rume und Gehuse, Testausstattung, Testen
T
Teseq
+43 1 +813 5380-0; Fax: +43 1 813 5380-3059;
Produkte und Services: Verstrker (HF & Mik-
rowellen), Antennen, Automotive Systeme, leitungsge-
bundene Strfestigkeit, leitungsgebundene berspan-
nung & schnelle Transienten, ESD, Netzoberwellen &
Flicker, GTEM Zellen, HF Immunitts- und Emissions-
systeme, HF Testsoftware, Kalibration & Service
ESD Simulator NSG 437
DEr Profi fr
DaS klEiNE BuDGEt
Der NSG 437 mit seinem menugesteuerten, ergonomischen Touchscreen-Kontrollpanel
steht fr hohe technische Performance und einfachste Bedienung. Er wurde speziell fr
Basisanwendungen im 30 kV Bereich entwickelt. Das geniale Gert erfllt alle gngigen
ESD-Standards und gewhrleistet jederzeit die geforderten fnf Sekunden Spannungshal-
tung. Die breite Palette einfach austauschbarer Netzwerk-Module macht das Testgert
speziell fr die Automobilindustrie interessant. Und: Teseq brgt mit seinem weltweiten
Netz an akkreditierten Kalibrierstellen jederzeit fr przise Zertifzierung.
Der Leistungsausweis des NSG 437:
Testet mit Luft- und Kontaktentladung bis 30 kV
Stabilisierte Prfspannung >5 Sekunden
Automatische Polarittsumschaltung
Erfllt IEC, ANSI, SAE, ISO Normen
Grosses Touchscreen-Kontrolldisplay
Schnell auswechselbare Netzwerkmodule
Beliebige R/C-Netzwerke ab 0 Ohm und bis 2 nF
deg-Messtechnik GmbH Wien sterreich
T +43 1 8135 380-0 www.deg-messtechnik.at
ADs_EEG13.indd 40 11/16/12 2:58 PM
161
161
Contents | Europe 2013
Nikola Tesla was a Serbian-American inventor,
physicist and electrical and mechanical engineer
known for his contributions to alternating current
electrical supply systems.
Tesla worked in the telephone and electrical elds
throughout Europe in the late 1800s, then moved
to the United States in 1884 to work for Thomas
Edison, who was trying to improve the electric
lighting system. Tesla believed currents could ow
bothways, rather than one. After he left Edison, he
set up laboratories to develop a range of electrical devices. At his labs in New York and Colorado
he experimented with high-voltage, high-frequency power experiments; patented devices to
assist in the creation of radio communications and erected antennas for wireless transmissions.
He patented an AC induction motor and transformer that was licensed by George Westinghouse,
who hired Tesla as a consultant to help develop an alternating current system. Tesla patented
the Tesla coil in 1891. He eventually held more than 700 patents.
In 1960, the General Conference on Weights and Measures for the International System of
Units dedicated the term tesla to the SI unit measure for magnetic eld strength.
In 1886, Tesla formed Tesla Electric Light & Manufacturing. The company installed electrical
arc light based illumination systems designed by Tesla. In April 1887, Tesla started the Tesla
Electric Company.
Nikola
Tesla (18561943)
PRODUCTS & SERVICES
Albania
Armenia
Belarus
Bosnia-Herzegovina
Bulgaria
Cyprus
Czech Republic
Denmark
Estonia
Finland
Greece
Hungary
Ireland
Latvia
Lithuania
Luxembourg
Moldova
Norway
Portugal
Romania
Russia
Serbia
Slovakia
Slovenia
Sweden
Ukraine
162
E
U
R
O
P
E
MISC_TOC_EEG13.indd 161 11/16/12 5:21 PM
ADs_EEG13.indd 40 11/16/12 2:58 PM
161
161
Contents | Europe 2013
Nikola Tesla was a Serbian-American inventor,
physicist and electrical and mechanical engineer
known for his contributions to alternating current
electrical supply systems.
Tesla worked in the telephone and electrical elds
throughout Europe in the late 1800s, then moved
to the United States in 1884 to work for Thomas
Edison, who was trying to improve the electric
lighting system. Tesla believed currents could ow
bothways, rather than one. After he left Edison, he
set up laboratories to develop a range of electrical devices. At his labs in New York and Colorado
he experimented with high-voltage, high-frequency power experiments; patented devices to
assist in the creation of radio communications and erected antennas for wireless transmissions.
He patented an AC induction motor and transformer that was licensed by George Westinghouse,
who hired Tesla as a consultant to help develop an alternating current system. Tesla patented
the Tesla coil in 1891. He eventually held more than 700 patents.
In 1960, the General Conference on Weights and Measures for the International System of
Units dedicated the term tesla to the SI unit measure for magnetic eld strength.
In 1886, Tesla formed Tesla Electric Light & Manufacturing. The company installed electrical
arc light based illumination systems designed by Tesla. In April 1887, Tesla started the Tesla
Electric Company.
Nikola
Tesla (18561943)
PRODUCTS & SERVICES
Albania
Armenia
Belarus
Bosnia-Herzegovina
Bulgaria
Cyprus
Czech Republic
Denmark
Estonia
Finland
Greece
Hungary
Ireland
Latvia
Lithuania
Luxembourg
Moldova
Norway
Portugal
Romania
Russia
Serbia
Slovakia
Slovenia
Sweden
Ukraine
162
E
U
R
O
P
E
MISC_TOC_EEG13.indd 161 11/16/12 5:21 PM
Europe | Products & Services
162
Albania
Frankrijklaan 7, ITC Boskoop, NL-2391 PX,
Hazerswoude-Dorp, Nederland;
+31(0)172 423 000; Fax: +31(0)172 423 009;
www.arbenelux.com
Cables and Connectors, Shielded Rooms & Enclo-
sures, Surge & Transients, Test Instrumentation
EMC Partner
ACTA Ltd., Ethnikis Antistaseos 14A, Chalandri,
GR-15232 Athens, Greece;
+30 210 600 33 02; Fax: +30 210 600 31 13;
Antonis Georgiou; ageo@acta.com.gr;
www.acta.com.gr
Instrumentation
Armenia
EM TEST
EMCI, 105005, Radio Str., 24, Build. 1, Moscow,
Russia;
+7 (495) 410 64 65; Fax: +7 (495) 980 71 19;
info@emci.ru; www.emci.ru
Belarus
Radiant-Elcom, 117246, Nautchny proezd,
8 b.1, Moscow;
+7495 725 0404; Fax: +7495 921 3585;
Sergey Pavlov, ps@ranet.ru; www.radiant.su
Cables & Connectors, Shielded Rooms & Enclo-
EM TEST
Russia;
+7 (495) 410 64 65; Fax: +7 (495) 980 71 19;
Bosnia- Herzegovina
EM TEST GmbH
Lnener Strasse 211, 59174 Kamen, Germany;
+49 (0)2307 26070-0; Fax: +49 (0)2307 17050;
info@emtest.de; www.emtest.com
Instrumentation
Bulgaria
A.H. Systems, Inc.
Test Solutions, Sofia;
+359 2 970 1990; Fax: +359 2 970 1999;
dobromil _dobrev@testsolutions.bg; www.test-
solutions.bg
Products and Services: Antennas, Test Instru-
mentation, Testing
Giga Electronics EOOD, 21A Manastirska,
Sofia Bulgaria 1111;
+359 2 971 4919, Fax: +359 2 873 1498;
Danail Geor gi ev, danail @gi gat est . net ; www.
gigatest.net
EM TEST GmbH
Lnener Strasse 211,
59174 Kamen, Germany;
+49 (0)2307 26070-0; Fax: +49 (0)2307 17050;
EMC Partner AG
+41 61 775 20 30;
Nicolas Wright; sales@emc-partner.ch;
www.emc-partner.ch
Instrumentation
Balkantel Ltd., 68, Bratya Bakston Blvd., Sofia 1618,
+359 2 850 04 30; Fax +359 2 955 91 89;
mail@balkantel.net; www.balkantel.net
Milmega
+359 2 850 04 30; Fax +359 2 955 91 89;
Teseq
+359 2 850 04 30; Fax +359 2 955 91 89;
Systems, RF Emission Systems, RF Testsoftware,
Cyprus
Vector Technologies, 40, Diogenous str. Halandri,
15234 Greece;
+30 210 685 80 08; Fax: +30 210 685 81 18;
Geroge Koukas, info@vectortechnologies.gr;
www.vectortechnologies.gr
EMC Partner
+30 210 600 33 02; Fax: +30 210 600 31 13;
Antonis Georgiou, ageo@acta.com.gr;
www.acta.com.gr
Instrumentation
Czech Republic
H TEST a.s, afrnkova 3,15500 Praha 5 Czech
Republic; +420 235365207; Fax: +420 2353689;
David Koshuba; www.htest.cz
EM TEST
Testovaci Technika s.r.o., Hakenova 1423,
290 01 Podebrady, Czech Republic;
+42 (0)325 610 123; Fax: +42 (0)325 610 134;
PRODUCTS
AND SERVICES
OTHER_PS_R_EEG13.indd 162 11/16/12 5:26 PM
Products & Services | Europe
163
teste@teste.cz;www.teste.cz
EMC Partner
TECTRA A.S., Domkovska 23433, CZ-193 00 Praha,
Czech Republic;
+420 281 921 650; Fax: +420 281 921 649;
Herr Ing. Zbynek Sommer, tectra@tectra.cz;
www.tectra.cz
Instrumentation
H TEST a.s
afrnkova 3, 15500 Praha 5, Czech Republic;
+420 235365207; Fax: +420 23536893;
Instrumentation
Empos Spol s.r.o., U Novych Vil 18, 10000 Praha 10,
+420 2 4174 2084; Fax +420 4174 2088;
info@empos.cz; www.empos.cz
turers of High Power Microwave and RF Amplifers
Milmega
+420 2 4174 2084; Fax +420 4174 2088;
ers of High Power Microwave and RF Amplifers
SCHURTER spol. s.r.o
Mal Skla 190, 46822 Zelezn Brod;
+42 0483 392 080;
frma@schurter.cz; www.schurter.cz
Teseq
+420 2 4174 2084; Fax +420 4174 2088;
Products and Services: Amplifers (RF & Microwave),
Denmark
Erik Blichfeld A/S, P.B. 400, Birkemosevej 11, Kolding,
Denmark DK-6000;
+45 7552 2020; Fax: +45 7556 7007;
info@blichfeld.dk; www.blichfeld.dk
Cables & Connectors, Shielded Rooms & Enclosures,
Surge & Transients, Test Instrumentation
Bolls ApS
Ved Gadekret 11F, DK-3660 Stenlse, Denmark;
+45 48 18 35 66;
www.bolls.dk; info@bolls.dk
Products & Services: Consultants, Full EMC test
facilities and CE typetest
Erik Blichfeld A/S
PO Box 400, Kolding, Kolding, DK-6000, Denmark;
+45 75 52 20 20; Fax: +45 75 56 70 07;
Henrik Andresen, info@blichfeld.dk; www.blichfeld.
dk
Products & Services: Amplifers, Antennas, Filters,
Surge & Transients
EM TEST
Nortelco Electronics Denmark, Vaerkstedsgarden
14, 1, 2620 Albertslund, Denmark;
+45 (0) 48 17 75 00; Fax: +45 (0) 48 17 75 10;
elektronik@nor telco.dk; www.nor telcoelectron-
ics.dk
EMC Partner
ERDE- ELEKTRONIK AB, Spikgatan 8,
SE-23532 Vellinge, Sweden;
+46 40 42 46 10; Fax: +46 40 42 62 18;
Ralf Danielsson; info@erde.se; www.erde.se
Instrumentation
Gowanda Electronics
ACAL BFI Nordic AB, Portalgatan 2B, P.O. Box 1335,
Uppsala, Sweden, SE-75143;
+46 1856 5830; +46 1869 6666;
info.se@bfioptilas.com; www.bfioptilas.com
Teseq AG, Nordstrasse 11F,
4542 Luterbach, Switzerland;
+41 32 681 40 40; Fax +41 32 681 40 48;
Erik Blichfeld A/S, Box 400, Birkemosevej 11,
DK-6000 KOLDING;
+45 755 22020; Fax: +45 755 67007;
Erik Blichfeld; info@blichfeld.dk; www.blichfeld.dk
MILMEGA
+41 32 681 40 40; Fax +41 32 681 40 48;
Tech-Etch, Inc.
BOMBERG & CO. ApS, Vassingerodvej 145, 3540
Lynge, CVR Nr. 27306179 Denmark;
+45 48 14 01 55; Fax: +45 48 14 01 56;
sales@bomberg.com; www.techetch.com
Shielding
Teseq
Erik Blichfeld A/S, Birkemosevej 11, 6000 Kolding;
+45 75 52 20 20, Fax +45 75 56 70 07;
info@blichfeld,dk; www.blichfeld.dk
Estonia
Caltest Oy, Kaarelantie 21,
PO Box 39, Helskinki, Finland FIN-00421;
+358 95 30 6070; Fax: +358 95 30 60 711;
Mattie Salonen, matti.salonen@caltest.fi;
www.caltest.fi
EMC Partner
ASTAT sp. zo.o, ul. Dabrowskiego 441,
PL-60 451 Poznan, Poland;
+48 61 849 80 61; Fax: +48 61 848 82 76;
Lukasz Wilk; l.wilk@astat.com.pl; www.astat.
com.pl
Instrumentation
EM TEST
Amitronic OY, Aniankatu 1, 15210 Lahti, Finland;
+358 3 876 100; Fax: +358 3 751 0253;
sales@amitronic.fi; www.amitronic.fi
+41 32 681 40 40; Fax +41 32 681 40 48;
Milmega
+41 32 681 40 40; Fax +41 32 681 40 48;
sales@teseq.com;
www.teseq.ch
Teseq
+41 32 681 40 40; Fax +41 32 681 40 48;
Finland
+358 95 30 6070; Fax: +358 95 30 60 711;
www.caltest.fi
EM TEST
+358 3 876 100; Fax: +358 3 751 0253;
EMC Partner
INEL Ltd. Oy, Graniit titie 9, FI - 00710 Helsinki,
Finland;
+358 10 42 37 570; Fax: +358 10 42 37 579;
Raimo Sainio, inel@inel.fi; www.inel.fi
Instrumentation
162
Albania
+31(0)172 423 000; Fax: +31(0)172 423 009;
www.arbenelux.com
Cables and Connectors, Shielded Rooms & Enclo-
EMC Partner
+30 210 600 33 02; Fax: +30 210 600 31 13;
Antonis Georgiou; ageo@acta.com.gr;
www.acta.com.gr
Instrumentation
Armenia
EM TEST
Russia;
+7 (495) 410 64 65; Fax: +7 (495) 980 71 19;
Belarus
8 b.1, Moscow;
+7495 725 0404; Fax: +7495 921 3585;
EM TEST
Russia;
+7 (495) 410 64 65; Fax: +7 (495) 980 71 19;
Bosnia- Herzegovina
EM TEST GmbH
+49 (0)2307 26070-0; Fax: +49 (0)2307 17050;
Instrumentation
Bulgaria
A.H. Systems, Inc.
Test Solutions, Sofia;
+359 2 970 1990; Fax: +359 2 970 1999;
dobromil _dobrev@testsolutions.bg; www.test-
solutions.bg
mentation, Testing
Giga Electronics EOOD, 21A Manastirska,
Sofia Bulgaria 1111;
+359 2 971 4919, Fax: +359 2 873 1498;
Danail Geor gi ev, danail @gi gat est . net ; www.
gigatest.net
EM TEST GmbH
Lnener Strasse 211,
59174 Kamen, Germany;
+49 (0)2307 26070-0; Fax: +49 (0)2307 17050;
EMC Partner AG
+41 61 775 20 30;
Nicolas Wright; sales@emc-partner.ch;
www.emc-partner.ch
Instrumentation
+359 2 850 04 30; Fax +359 2 955 91 89;
Milmega
+359 2 850 04 30; Fax +359 2 955 91 89;
Teseq
+359 2 850 04 30; Fax +359 2 955 91 89;
Cyprus
Vector Technologies, 40, Diogenous str. Halandri,
15234 Greece;
+30 210 685 80 08; Fax: +30 210 685 81 18;
EMC Partner
+30 210 600 33 02; Fax: +30 210 600 31 13;
www.acta.com.gr
Instrumentation
Czech Republic
H TEST a.s, afrnkova 3,15500 Praha 5 Czech
Republic; +420 235365207; Fax: +420 2353689;
EM TEST
+42 (0)325 610 123; Fax: +42 (0)325 610 134;
PRODUCTS
AND SERVICES
163
teste@teste.cz;www.teste.cz
EMC Partner
Czech Republic;
+420 281 921 650; Fax: +420 281 921 649;
Herr Ing. Zbynek Sommer, tectra@tectra.cz;
www.tectra.cz
Instrumentation
H TEST a.s
afrnkova 3, 15500 Praha 5, Czech Republic;
+420 235365207; Fax: +420 23536893;
Instrumentation
+420 2 4174 2084; Fax +420 4174 2088;
Milmega
+420 2 4174 2084; Fax +420 4174 2088;
SCHURTER spol. s.r.o
Mal Skla 190, 46822 Zelezn Brod;
+42 0483 392 080;
frma@schurter.cz; www.schurter.cz
Teseq
+420 2 4174 2084; Fax +420 4174 2088;
Products and Services: Amplifers (RF & Microwave),
Denmark
Erik Blichfeld A/S, P.B. 400, Birkemosevej 11, Kolding,
Denmark DK-6000;
+45 7552 2020; Fax: +45 7556 7007;
info@blichfeld.dk; www.blichfeld.dk
Cables & Connectors, Shielded Rooms & Enclosures,
Surge & Transients, Test Instrumentation
Bolls ApS
Ved Gadekret 11F, DK-3660 Stenlse, Denmark;
+45 48 18 35 66;
www.bolls.dk; info@bolls.dk
Products & Services: Consultants, Full EMC test
facilities and CE typetest
Erik Blichfeld A/S
PO Box 400, Kolding, Kolding, DK-6000, Denmark;
+45 75 52 20 20; Fax: +45 75 56 70 07;
Henrik Andresen, info@blichfeld.dk; www.blichfeld.
dk
Products & Services: Amplifers, Antennas, Filters,
Surge & Transients
EM TEST
Nortelco Electronics Denmark, Vaerkstedsgarden
14, 1, 2620 Albertslund, Denmark;
+45 (0) 48 17 75 00; Fax: +45 (0) 48 17 75 10;
elektronik@nor telco.dk; www.nor telcoelectron-
ics.dk
EMC Partner
+46 40 42 46 10; Fax: +46 40 42 62 18;
Instrumentation
Gowanda Electronics
ACAL BFI Nordic AB, Portalgatan 2B, P.O. Box 1335,
Uppsala, Sweden, SE-75143;
+46 1856 5830; +46 1869 6666;
+41 32 681 40 40; Fax +41 32 681 40 48;
Erik Blichfeld A/S, Box 400, Birkemosevej 11,
DK-6000 KOLDING;
+45 755 22020; Fax: +45 755 67007;
Erik Blichfeld; info@blichfeld.dk; www.blichfeld.dk
MILMEGA
+41 32 681 40 40; Fax +41 32 681 40 48;
Tech-Etch, Inc.
BOMBERG & CO. ApS, Vassingerodvej 145, 3540
Lynge, CVR Nr. 27306179 Denmark;
+45 48 14 01 55; Fax: +45 48 14 01 56;
sales@bomberg.com; www.techetch.com
Shielding
Teseq
Erik Blichfeld A/S, Birkemosevej 11, 6000 Kolding;
+45 75 52 20 20, Fax +45 75 56 70 07;
info@blichfeld,dk; www.blichfeld.dk
Estonia
+358 95 30 6070; Fax: +358 95 30 60 711;
www.caltest.fi
EMC Partner
+48 61 849 80 61; Fax: +48 61 848 82 76;
Lukasz Wilk; l.wilk@astat.com.pl; www.astat.
com.pl
Instrumentation
EM TEST
+358 3 876 100; Fax: +358 3 751 0253;
+41 32 681 40 40; Fax +41 32 681 40 48;
Milmega
+41 32 681 40 40; Fax +41 32 681 40 48;
sales@teseq.com;
www.teseq.ch
Teseq
+41 32 681 40 40; Fax +41 32 681 40 48;
Finland
+358 95 30 6070; Fax: +358 95 30 60 711;
www.caltest.fi
EM TEST
+358 3 876 100; Fax: +358 3 751 0253;
EMC Partner
INEL Ltd. Oy, Graniit titie 9, FI - 00710 Helsinki,
Finland;
+358 10 42 37 570; Fax: +358 10 42 37 579;
Raimo Sainio, inel@inel.fi; www.inel.fi
Instrumentation
164
ETS-Lindgren
Mekaanikontie 1, 27510 Eura, Findland;
+358 2 8383 300; Fax: +358 2 8651 233;
euinfo@etslindgren.com
Products and Services: Antennas, Ferrites, Fil-
ters, Shielded Rooms & Enclosures, RFI/EMI Signal
Generators, Test Instrumentation, Miscellaneous
+41 32 681 40 40; Fax +41 32 681 40 48;
Fair-Rite
Caltest Oy, Kaarelantie 21 FIN-00430 Helskini;
+358 95 30 6070; Fax: +358 95 30 60 711;
info@caltest.fi
INEL Ltd. Oy, PO Box 14, FIN-00711 Helsinki;
+358 10 423 757-0; Fax: +358 10 423 757-9;
inel@inel.fi; www.inel.fi
Milmega
Exova METECH Oy, Kuormakuja 1, FIN- 03100,
Nummela;
+358 40 03 56 054; Fax +358 95 84 00 552;
Virpi.Marttila@exova.com; www.exovametech.fi
Teseq
Metric Industrial Oy, Postbox 14, Piispantilankuja
4, 02241 Espoo;
+358 9 4761 600; Fax +358 9 4761 6700;
sales@metric.fi; www.metricindustrial.com
Greece
A.H. Systems, Inc.
Vector Technologies, Athens;
+302106858008; Fax: +302106858118;
info@vector technologies.gr; www.vector tech-
nologies.gr
mentation, Testing
Vector Technologies, 40,
Diogenous str. Halandri, 15234 Greece;
+30 210 6858008; Fax: +30 210 6858118;
EM TEST
MES Ltd., 228, Kifissias Ave.,
145 61 Kifissia, Athens Hellas;
+30 (0210) 80 16 077; Fax: +30 (0210) 80 16 034;
dpmkour@otenet.gr
EMC Partner
+30 210 600 33 02; Fax: +30 210 600 31 13;
www.acta.com.gr
Instrumentation
DRYS TECHNIKI S.A., 13 Thessalonikis str.,
18346 Moschato;
+30 210 523 2842; Fax +30 210 52 32 555;
drysales@drystech.gr; www.drystech.gr
Milmega
18346 Moschato;
+30 210 523 2842; Fax +30 210 52 32 555;
Teseq
DRYS TECHNIKI S.A.,
13 Thessalonikis str., 18346 Moschato;
+30 210 523 2842; Fax +30 210 52 32 555;
Vector Technologies Ltd
40 Diogenous str, Halandri, Athens 15234, Greece;
Panos Vouvounas, info@vectortechnologies.gr;
Product s & Ser vices: Test Instrumentation,
Amplifiers, Antennas
Hungary
H TEST a.s., afrnkova 3,
15500 Praha 5 Czech Republic;
+420 23 53 65 207; Fax: +420 23 53 68 93;
David Koshuba; info@htest.cz; www.htest.cz
EMC Partner
ELTEST Kf t , Hat t y u.16, HU-1015 Budapest ,
Hungary;
+36 1 202 18 73; Fax: +36 1 225 00 31;
Janos Redai, eltest@eltest.hu;
www.eltest.hu
Instrumentation
EM TEST
ProMet Merestechnika Kft, Arany Janos u. 54, 2314
Halasztelek, Hungary;
+36 (0)24 521 240; Fax: +36 (0)24 521 253;
promet@promet.hu; www.promet.hu
Tectra Electronics Kft., Mikszath Kalman u. 105,
1184 Budapest,
+36 1 291 2065; Fax +36 1 291 1643;
tectra@tectra.hu;
www.tectra.hu
Milmega
1184 Budapest,
+36 1 291 2065; Fax +36 1 291 1643;
tectra@tectra.hu;
www.tectra.hu
Teseq
1184 Budapest,
+36 1 291 2065; Fax +36 1 291 1643;
tectra@tectra.hu;
www.tectra.hu
Ireland
Unit 8 TORC MK, Chippenham Drive, Kingston,
Milton Keynes, England Bucks MK10 OAE;
+44(1) 908 282766; +44(1) 908 288249;
Tom Cantle; TCantle@ARWorld.US;
www.arukltd.co.uk
ElectroMagnetic Technologies Ltd.
Inniscarra, Cork, Ireland;
+353 21 487 1437; Fax: +353 21 487 2132;
info@emtcork.biz; www.emtcork.biz
EM TEST
Frequensys Ltd., 10 Abbey Cour t, Fraser Road,
MK44 3WH Bedford, United Kingdom;
+44 (0)1142 353 507; Fax: +44 (0)1234 831 998;
info@frequensys.co.uk;
www.frequensys.co.uk
EMC Partner (UK) Ltd.
1A Golf Link Villas- The Common Downley- High
Wycombe, GB-HP13 5YH Buckinghamshire, United
Kingdom;
+44(0) 1494 44 42 55; Fax: +44(0) 1494 44 42 77;
David Castle; sales@emcpartner.co.uk;
Instrumentation
DM Systems and Test, Ltd., 60 Wilbury Way Hitchin
Hertfordshire SG4 0/A;
+44 (0) 1462 477277; Fax +44 (0) 1462 428995;
Brian Epton; brian.epton@dplusm.co.uk;
Graham Howard, graham.howard@dplusm.co.uk;
Mick Keryell, mike.keryell@dplusm.co.uk
165
Milmega
+44 (0) 8540 740 660; Fax: +44 (0) 845 074 0656;
Teseq
Teseq Ltd., Ashville Way, Moll y Millars Lane,
+44 (0) 8540 740 660; Fax: +44 (0) 845 074 0656;
uksales@teseq.com;
www.teseq.co.uk
Latvia
+358 95 30 6070; Fax: +358 95 30 60 711;
www.caltest.fi
sures, Test Instrumentation
EMC Partner
+48 61 849 80 61; Fax: +48 61 848 82 76;
Lukasz Wilk, l.wilk@astat.com.pl; www.astat.
com.pl
Instrumentation
Lithuania
+358 95 30 6070; Fax: +358 95 30 60 711;
www.caltest.fi
EMC Partner
+48 61 849 80 61; Fax: +48 61 848 82 76;
com.pl
Instrumentation
Luxembourg
A.H. Systems, Inc.
EEMCCOIMEX, Lelystad, NL;
+31 320 295 395; Fax: +31 320 413 133;
tion, Testing
Frankrijklaan 7, ITC Boskoop, NL-2391 PX, Hazer-
swoude-Dorp, the Netherlands;
+31(0) 17 242 30 00; Fax: +31(0) 17 242 30 09;
www.arbenelux.com
EM TEST GmbH
+49 (0)2307 26070-0; Fax: +49 (0)2307 17050;
Fair-Rite
HF Technology, Atalanta 5, 1562 LC Krommenie Holland;
+31(0) 75 628 37 17; Fax: +31(0) 75 621 11 20;
info@hftechnology.nl
Accelonix BV, Croy 7,
5653 LC Eindhoven, The Netherlands;
+31 40 750 1650; Fax: +31 40 293 0722;
MILMEGA
+31 40 750 1650; Fax: +31 40 293 0722;
Teseq
+31 40 750 1650; Fax: +31 40 293 0722;
Moldova
EM TEST
EMCI, 105005, Radio Str., 24, Build. 1, Moscow, Russia;
+7 (495) 410 64 65; Fax: +7 (495) 980 71 19;
Norway
Nortelco Electronics AS, Postboks 116 Manglerud,
Oslo, Norway NO-0612;
+47 2257 6100; Fax: +47 2257 6130;
Arve Bekkevold, arve.bekkevold@nortelco.no;
www.nortelcoelectronics.no
EM TEST
Nortelco Electronics AS, Johan Scharffenbergsvei
95, 0694 Oslo, Norway;
+47 2 257 6100; Fax: +47 2 257 6130;
EMC Partner
+46 40 42 46 10; Fax: +46 40 42 62 18;
Ralf Danielsson; info@erde.se;
www.erde.se
Instrumentation
IFI- Instruments for Industry
Metric Industrial AS, Trollasveien 8, 1414 Trollasen;
+47 40 00 40 54; Fax +47 40 00 40 53;
per.myhrvold@metricindustrial.no;
www.metric.no
MILMEGA
+47 40 00 40 54; Fax +47 40 00 40 53;
www.metric.no
Tech-Etch, Inc.
EG Components Norway AS,
Hovfaret 17 B, N0275 Oslo Norway;
+47 2325 4600; Fax: +47 2325 4601;
info@egcomponents.no; www.techetch.com
Shielding
Teseq
+47 40 00 40 54; Fax +47 40 00 40 53;
per.myhrvold@metricindustrial.no; www.metric.no
Portugal
Barcelona, Spain E-08018;
+34 933 208 055; Fax: +34 933 208 056;
www.wavecontrol.com
EM TEST
ALAVA Ingenieros S.A., C/ Albasanz 16 - Edificio
Antalia, 28037 Madrid, Spain;
+34 (0)91 567 97 00; Fax: +34 (0)91 570 26 61;
alava@alava-ing.es; www.alava-ing.es
EMC Partner
WAVECONTROL, Pallars, 65-71,
ES-08018 Barcelona, Spain;
+34 933 208 055; Fax: +34 933 208 056;
www.wavecontrol.com
Instrumentation
164
ETS-Lindgren
Mekaanikontie 1, 27510 Eura, Findland;
+358 2 8383 300; Fax: +358 2 8651 233;
euinfo@etslindgren.com
Products and Services: Antennas, Ferrites, Fil-
ters, Shielded Rooms & Enclosures, RFI/EMI Signal
Generators, Test Instrumentation, Miscellaneous
+41 32 681 40 40; Fax +41 32 681 40 48;
Fair-Rite
Caltest Oy, Kaarelantie 21 FIN-00430 Helskini;
+358 95 30 6070; Fax: +358 95 30 60 711;
info@caltest.fi
INEL Ltd. Oy, PO Box 14, FIN-00711 Helsinki;
+358 10 423 757-0; Fax: +358 10 423 757-9;
inel@inel.fi; www.inel.fi
Milmega
Exova METECH Oy, Kuormakuja 1, FIN- 03100,
Nummela;
+358 40 03 56 054; Fax +358 95 84 00 552;
Virpi.Marttila@exova.com; www.exovametech.fi
Teseq
Metric Industrial Oy, Postbox 14, Piispantilankuja
4, 02241 Espoo;
+358 9 4761 600; Fax +358 9 4761 6700;
sales@metric.fi; www.metricindustrial.com
Greece
A.H. Systems, Inc.
Vector Technologies, Athens;
+302106858008; Fax: +302106858118;
info@vector technologies.gr; www.vector tech-
nologies.gr
mentation, Testing
Vector Technologies, 40,
Diogenous str. Halandri, 15234 Greece;
+30 210 6858008; Fax: +30 210 6858118;
EM TEST
MES Ltd., 228, Kifissias Ave.,
145 61 Kifissia, Athens Hellas;
+30 (0210) 80 16 077; Fax: +30 (0210) 80 16 034;
dpmkour@otenet.gr
EMC Partner
+30 210 600 33 02; Fax: +30 210 600 31 13;
www.acta.com.gr
Instrumentation
18346 Moschato;
+30 210 523 2842; Fax +30 210 52 32 555;
Milmega
18346 Moschato;
+30 210 523 2842; Fax +30 210 52 32 555;
Teseq
DRYS TECHNIKI S.A.,
13 Thessalonikis str., 18346 Moschato;
+30 210 523 2842; Fax +30 210 52 32 555;
Vector Technologies Ltd
40 Diogenous str, Halandri, Athens 15234, Greece;
Panos Vouvounas, info@vectortechnologies.gr;
Product s & Ser vices: Test Instrumentation,
Amplifiers, Antennas
Hungary
H TEST a.s., afrnkova 3,
15500 Praha 5 Czech Republic;
+420 23 53 65 207; Fax: +420 23 53 68 93;
David Koshuba; info@htest.cz; www.htest.cz
EMC Partner
ELTEST Kf t , Hat t y u.16, HU-1015 Budapest ,
Hungary;
+36 1 202 18 73; Fax: +36 1 225 00 31;
Janos Redai, eltest@eltest.hu;
www.eltest.hu
Instrumentation
EM TEST
ProMet Merestechnika Kft, Arany Janos u. 54, 2314
Halasztelek, Hungary;
+36 (0)24 521 240; Fax: +36 (0)24 521 253;
promet@promet.hu; www.promet.hu
1184 Budapest,
+36 1 291 2065; Fax +36 1 291 1643;
tectra@tectra.hu;
www.tectra.hu
Milmega
1184 Budapest,
+36 1 291 2065; Fax +36 1 291 1643;
tectra@tectra.hu;
www.tectra.hu
Teseq
1184 Budapest,
+36 1 291 2065; Fax +36 1 291 1643;
tectra@tectra.hu;
www.tectra.hu
Ireland
Unit 8 TORC MK, Chippenham Drive, Kingston,
Milton Keynes, England Bucks MK10 OAE;
+44(1) 908 282766; +44(1) 908 288249;
Tom Cantle; TCantle@ARWorld.US;
www.arukltd.co.uk
ElectroMagnetic Technologies Ltd.
Inniscarra, Cork, Ireland;
+353 21 487 1437; Fax: +353 21 487 2132;
info@emtcork.biz; www.emtcork.biz
EM TEST
Frequensys Ltd., 10 Abbey Cour t, Fraser Road,
MK44 3WH Bedford, United Kingdom;
+44 (0)1142 353 507; Fax: +44 (0)1234 831 998;
info@frequensys.co.uk;
www.frequensys.co.uk
EMC Partner (UK) Ltd.
1A Golf Link Villas- The Common Downley- High
Wycombe, GB-HP13 5YH Buckinghamshire, United
Kingdom;
+44(0) 1494 44 42 55; Fax: +44(0) 1494 44 42 77;
David Castle; sales@emcpartner.co.uk;
Instrumentation
DM Systems and Test, Ltd., 60 Wilbury Way Hitchin
Hertfordshire SG4 0/A;
+44 (0) 1462 477277; Fax +44 (0) 1462 428995;
Brian Epton; brian.epton@dplusm.co.uk;
Graham Howard, graham.howard@dplusm.co.uk;
Mick Keryell, mike.keryell@dplusm.co.uk
165
Milmega
+44 (0) 8540 740 660; Fax: +44 (0) 845 074 0656;
Teseq
Teseq Ltd., Ashville Way, Moll y Millars Lane,
+44 (0) 8540 740 660; Fax: +44 (0) 845 074 0656;
uksales@teseq.com;
www.teseq.co.uk
Latvia
+358 95 30 6070; Fax: +358 95 30 60 711;
www.caltest.fi
sures, Test Instrumentation
EMC Partner
+48 61 849 80 61; Fax: +48 61 848 82 76;
com.pl
Instrumentation
Lithuania
+358 95 30 6070; Fax: +358 95 30 60 711;
www.caltest.fi
EMC Partner
+48 61 849 80 61; Fax: +48 61 848 82 76;
com.pl
Instrumentation
Luxembourg
A.H. Systems, Inc.
EEMCCOIMEX, Lelystad, NL;
+31 320 295 395; Fax: +31 320 413 133;
tion, Testing
swoude-Dorp, the Netherlands;
+31(0) 17 242 30 00; Fax: +31(0) 17 242 30 09;
www.arbenelux.com
EM TEST GmbH
+49 (0)2307 26070-0; Fax: +49 (0)2307 17050;
Fair-Rite
HF Technology, Atalanta 5, 1562 LC Krommenie Holland;
+31(0) 75 628 37 17; Fax: +31(0) 75 621 11 20;
info@hftechnology.nl
+31 40 750 1650; Fax: +31 40 293 0722;
MILMEGA
+31 40 750 1650; Fax: +31 40 293 0722;
Teseq
+31 40 750 1650; Fax: +31 40 293 0722;
Moldova
EM TEST
EMCI, 105005, Radio Str., 24, Build. 1, Moscow, Russia;
+7 (495) 410 64 65; Fax: +7 (495) 980 71 19;
Norway
Nortelco Electronics AS, Postboks 116 Manglerud,
Oslo, Norway NO-0612;
+47 2257 6100; Fax: +47 2257 6130;
EM TEST
Nortelco Electronics AS, Johan Scharffenbergsvei
95, 0694 Oslo, Norway;
+47 2 257 6100; Fax: +47 2 257 6130;
EMC Partner
+46 40 42 46 10; Fax: +46 40 42 62 18;
Ralf Danielsson; info@erde.se;
www.erde.se
Instrumentation
IFI- Instruments for Industry
+47 40 00 40 54; Fax +47 40 00 40 53;
www.metric.no
MILMEGA
+47 40 00 40 54; Fax +47 40 00 40 53;
www.metric.no
Tech-Etch, Inc.
EG Components Norway AS,
Hovfaret 17 B, N0275 Oslo Norway;
+47 2325 4600; Fax: +47 2325 4601;
info@egcomponents.no; www.techetch.com
Shielding
Teseq
+47 40 00 40 54; Fax +47 40 00 40 53;
per.myhrvold@metricindustrial.no; www.metric.no
Portugal
Barcelona, Spain E-08018;
+34 933 208 055; Fax: +34 933 208 056;
www.wavecontrol.com
EM TEST
ALAVA Ingenieros S.A., C/ Albasanz 16 - Edificio
Antalia, 28037 Madrid, Spain;
+34 (0)91 567 97 00; Fax: +34 (0)91 570 26 61;
alava@alava-ing.es; www.alava-ing.es
EMC Partner
WAVECONTROL, Pallars, 65-71,
ES-08018 Barcelona, Spain;
+34 933 208 055; Fax: +34 933 208 056;
www.wavecontrol.com
Instrumentation
166
VITELSIS - Soc. Com. De Electrotecnica, Lda., Rua
Alvaro Ferreira Alves, 15 C, 2855-591 Corroios;
+351 21 258 3619; Fax +351 21 258 8087;
geral@vitelsis.pt; www.vitelsis.pt
Milmega
+351 21 258 3619; Fax +351 21 258 8087;
Teseq
+351 21 258 3619; Fax +351 21 258 8087;
Romania
A.H. Systems, Inc.
CELESTA COMEXIM SRL, Bucharest;
+4021 410 30 64; Fax: +4021 410 31 17;
celesta@celesta.ro; www.celesta.ro/en
mentation, Testing
COMTEST SRL, Ol ar i 7A, 024056 Buchar est ,
Romania;
+4021 211 08 83; Fax: +4021 211 08 84;
Radu Mat eescu, r adum@comt est . r o; www.
comtest.ro
EM TEST GmbH
+49 (0)2307 26070-0; Fax: +49 (0)2307 17050;
InterNET SRL, Calea Grivitei nr. 119, sector 1,
010707 Bucuresti;
+40 21 310 7121; Fax +40 21 312 1663;
internet@inter-net.ro; www.inter-net.ro
Milmega
InterNET SRL, Calea Grivitei nr. 119,
sector 1, 010707 Bucuresti;
+40 21 310 7121; Fax +40 21 312 1663;
SCHURTER
SC INTERELEKTRONIC S.R.L, Comuna Gruiu, sat
Santu Floresti, Str. Ungureni, Nr. 103, 077118
Judet Ilfov;
+402 135 08 100;
contact@ticomel.ch; www.ticomel.ch
Teseq
010707 Bucuresti;
+40 21 310 7121; Fax +40 21 312 1663;
Russia
A.H. Systems, Inc.
SERNIA, Moscow;
+7 495 225 40 14; Fax: +7 495 932 92 44;
office@sernia.ru; www.sernia.ru
mentation, Testing
8 b.1, Moscow;
+7495 725 0404; Fax:n+7495 921 3585;
EM TEST
Russia;
+7 (495) 410 64 65; Fax: +7 (495) 980 71 19;
EMC Partner
AMIDEON Systems Ltd. Innovation works, National
Technology Park, IE- Limerick, Ireland;
+353 61 503 007; Fax: +353 61 338 065;
Barry Lunn, sales@amideon.com; www.amideon.
com
Instrumentation
+41 32 681 40 40; Fax +41 32 681 40 48;
MILMEGA
EMCI, Radio str 24, Building 1, 105005 Moscow;
Tel +7 495 410 6465; Fax +7 495 791 7107;
Products and Services: Amplifiers
Teseq
ZAO NFP Dipaul Ltd., 213a Professora Popova
Street, 197376 St. Petersburg;
+7 812 325 1478; Fax 7 812 325 1478;
shuval@dipaul.ru; www.dipaul.ru
Serbia
swoude-Dorp, Nederland;
+31(0)172 423 000; Fax: +31(0)172 423 009;
www.arbenelux.com
EM TEST GmbH
+49 (0)2307 26070-0; Fax: +49 (0)2307 17050;
info@emtest.de;
www.emtest.com
Tectra AG Predstavnistvo Beograd, Begejska 2a,
11000 Beograd;
+381 11 2894 424; Fax +381 11 3049 640;
office@tectra.co.rs; www.tectra.co.rs
Milmega
11000 Beograd;
+381 11 2894 424; Fax +381 11 3049 640;
Teseq
11000 Beograd;
+381 11 2894 424; Fax +381 11 3049 640;
Slovakia
- H TEST afrnkova 3, 15500 Praha 5 Czech
Republic;
+420 23 53 65 207; Fax: +420 23 53 68 93;
David Koshuba; info@htest.cz;
www.htest.cz
EM TEST
+42 (0)325 610 123; Fax: +42 (0)325 610 134;
teste@teste.cz; www.teste.cz
Product s and Services: Surge & Transients,
Test Instrumentation, Testing
167
EMC Partner
Czech Republic;
+420 281 921 650; Fax: +420 281 921 649;
Herr Ing. Zbynek Sommer; tectra@tectra.cz;
www.tectra.cz
Instrumentation
Empos Spol s.r.o., U Novych Vil 18,
10000 Praha 10, Czech Republic;
+420 2 4174 2084; Fax +420 4174 2088;
MILMEGA
+420 2 4174 2084; Fax +420 4174 2088;
SCHURTER (SK) s.r.o
Piestanska 404, 95605 Radosina;
+42 138 539 84 80;
www.schurter.com
Teseq
+420 2 4174 2084; Fax +420 4174 2088;
Slovenia
+31(0)172 423 000; Fax: +31(0)172 423 009;
www.arbenelux.com
EM TEST GmbH
+49 (0)2307 26070-0; Fax: +49 (0)2307 17050;
Tectra d.o.o., Stegne 21, 1000 Ljubljana;
+386 1 511 46 12; Fax +386 1 511 46 13;
tectra@tectra.si
Milmega
+386 1 511 46 12; Fax +386 1 511 46 13;
tectra@tectra.si
Teseq
+386 1 511 46 12; Fax +386 1 511 46 13;
tectra@tectra.si
Sweden
A.H. Systems, Inc.
AGETO MTT AB, Taby;
+46 844 677 30; Fax: +46 844 677 45;
http://agetomtt.com/contact; http://agetomtt.com
mentation, Testing
Ce-Bit Electronik, P.O. Box 7055, Taby, Sweden
187 11;
+46 8 735 7550; Fax: +46 8 735 6165;
Ingemar Islander; ingemar.islander@cebit.se;
www.cebit.se
CE-BIT Elektronik AB
Polygonvaaegen 29,
P.O. BOX 7055, TAEBY, SE-187 66, Sweden;
+46-8-735 75 50; Fax: +46-8-735 61 65;
www.cebit.se; Ingemar Islander,
info@cebit.se
Products & Services: Amplifiers, Shielded Rooms
& Enclosures, Surge & Transients, Ferrites
EM TEST
CE-BIT Elektronik AB, Polygonvgen 29,
187 66 Tby, Sweden;
+46 (0)8 735 75 50; Fax: +46 (0)8 735 61 65;
www.cebit.se
POXITRON AB; Box 324, 591 24 Motala, Sweden;
+46 141-580 00; Fax: +46 141-584 95;
info@proxitron.se; www.proxitron.se
EMC Partner
+46 40 42 46 10; Fax: +46 40 42 62 18;
Instrumentation
Gowanda Electronics
ACAL BFI Nordic AB; Portalgatan 2B,
P.O. Box 1335, Uppsala, Sweden, SE-75143;
+46 1856 5830; +46 1869 6666;
Gritek Konsult Ab; Ostermalmsgatan 49,
Stockholm, Sweden, 11426;
+46 08242312; +46 08242306;
AGETO MTT AB, Propellervgen 6B, 183 62 Tby;
+46 8 446 77 30; Fax +46 8 446 77 45;
sales@agetomtt.com; www.agetomtt.se
Fair-Rite
Ce-Bit Electronik, Box 7055, 18711 Taby;
+46 8 735 7550; Fax: +46 8 735 6165;
info@cebit.se
Schaffner EMC AB; Turebergstorg 1,
6 S-10147 Sollentuna;
+46 8 5792 1121; Fax: +46 8 929 690;
swedensales@schaffner.com
Ingenjrsfirman, Ekeby Gard,
Ekebyborna 250, SE-59195 Motala;
+46 8 930 280; +46 14 171 151;
hans.petterson@igpab.se; www.igpab.se
MILMEGA
+46 8 446 77 30; Fax +46 8 446 77 45;
SCHURTER Nordic AB
Sandsborgsvgen 50, 122 33 Enskede;
+46 8 447 35 60;
info@schurter.se; www.schurter.se
Teseq
+46 8 446 77 30; Fax +46 8 446 77 45;
Ukraine
Radiant-Elcom, 117246,
Nautchny proezd, 8 b.1, Moscow;
+7495 725 0404; Fax: +7495 921 3585;
EM TEST
Russia;
+7 (495) 410 64 65; Fax: +7 (495) 980 71 19;
Instrumentation
166
+351 21 258 3619; Fax +351 21 258 8087;
Milmega
+351 21 258 3619; Fax +351 21 258 8087;
Teseq
+351 21 258 3619; Fax +351 21 258 8087;
Romania
A.H. Systems, Inc.
CELESTA COMEXIM SRL, Bucharest;
+4021 410 30 64; Fax: +4021 410 31 17;
celesta@celesta.ro; www.celesta.ro/en
mentation, Testing
COMTEST SRL, Ol ar i 7A, 024056 Buchar est ,
Romania;
+4021 211 08 83; Fax: +4021 211 08 84;
Radu Mat eescu, r adum@comt est . r o; www.
comtest.ro
EM TEST GmbH
+49 (0)2307 26070-0; Fax: +49 (0)2307 17050;
010707 Bucuresti;
+40 21 310 7121; Fax +40 21 312 1663;
Milmega
InterNET SRL, Calea Grivitei nr. 119,
sector 1, 010707 Bucuresti;
+40 21 310 7121; Fax +40 21 312 1663;
SCHURTER
SC INTERELEKTRONIC S.R.L, Comuna Gruiu, sat
Santu Floresti, Str. Ungureni, Nr. 103, 077118
Judet Ilfov;
+402 135 08 100;
contact@ticomel.ch; www.ticomel.ch
Teseq
010707 Bucuresti;
+40 21 310 7121; Fax +40 21 312 1663;
Russia
A.H. Systems, Inc.
SERNIA, Moscow;
+7 495 225 40 14; Fax: +7 495 932 92 44;
office@sernia.ru; www.sernia.ru
mentation, Testing
8 b.1, Moscow;
+7495 725 0404; Fax:n+7495 921 3585;
EM TEST
Russia;
+7 (495) 410 64 65; Fax: +7 (495) 980 71 19;
EMC Partner
AMIDEON Systems Ltd. Innovation works, National
Technology Park, IE- Limerick, Ireland;
+353 61 503 007; Fax: +353 61 338 065;
Barry Lunn, sales@amideon.com; www.amideon.
com
Instrumentation
+41 32 681 40 40; Fax +41 32 681 40 48;
MILMEGA
EMCI, Radio str 24, Building 1, 105005 Moscow;
Tel +7 495 410 6465; Fax +7 495 791 7107;
Products and Services: Amplifiers
Teseq
ZAO NFP Dipaul Ltd., 213a Professora Popova
Street, 197376 St. Petersburg;
+7 812 325 1478; Fax 7 812 325 1478;
shuval@dipaul.ru; www.dipaul.ru
Serbia
swoude-Dorp, Nederland;
+31(0)172 423 000; Fax: +31(0)172 423 009;
www.arbenelux.com
EM TEST GmbH
+49 (0)2307 26070-0; Fax: +49 (0)2307 17050;
info@emtest.de;
www.emtest.com
11000 Beograd;
+381 11 2894 424; Fax +381 11 3049 640;
Milmega
11000 Beograd;
+381 11 2894 424; Fax +381 11 3049 640;
Teseq
11000 Beograd;
+381 11 2894 424; Fax +381 11 3049 640;
Slovakia
- H TEST afrnkova 3, 15500 Praha 5 Czech
Republic;
+420 23 53 65 207; Fax: +420 23 53 68 93;
David Koshuba; info@htest.cz;
www.htest.cz
EM TEST
+42 (0)325 610 123; Fax: +42 (0)325 610 134;
teste@teste.cz; www.teste.cz
Product s and Services: Surge & Transients,
Test Instrumentation, Testing
167
EMC Partner
Czech Republic;
+420 281 921 650; Fax: +420 281 921 649;
Herr Ing. Zbynek Sommer; tectra@tectra.cz;
www.tectra.cz
Instrumentation
+420 2 4174 2084; Fax +420 4174 2088;
MILMEGA
+420 2 4174 2084; Fax +420 4174 2088;
SCHURTER (SK) s.r.o
Piestanska 404, 95605 Radosina;
+42 138 539 84 80;
www.schurter.com
Teseq
+420 2 4174 2084; Fax +420 4174 2088;
Slovenia
+31(0)172 423 000; Fax: +31(0)172 423 009;
www.arbenelux.com
EM TEST GmbH
+49 (0)2307 26070-0; Fax: +49 (0)2307 17050;
+386 1 511 46 12; Fax +386 1 511 46 13;
tectra@tectra.si
Milmega
+386 1 511 46 12; Fax +386 1 511 46 13;
tectra@tectra.si
Teseq
+386 1 511 46 12; Fax +386 1 511 46 13;
tectra@tectra.si
Sweden
A.H. Systems, Inc.
AGETO MTT AB, Taby;
+46 844 677 30; Fax: +46 844 677 45;
http://agetomtt.com/contact; http://agetomtt.com
mentation, Testing
Ce-Bit Electronik, P.O. Box 7055, Taby, Sweden
187 11;
+46 8 735 7550; Fax: +46 8 735 6165;
Ingemar Islander; ingemar.islander@cebit.se;
www.cebit.se
CE-BIT Elektronik AB
Polygonvaaegen 29,
P.O. BOX 7055, TAEBY, SE-187 66, Sweden;
+46-8-735 75 50; Fax: +46-8-735 61 65;
www.cebit.se; Ingemar Islander,
info@cebit.se
Products & Services: Amplifiers, Shielded Rooms
& Enclosures, Surge & Transients, Ferrites
EM TEST
CE-BIT Elektronik AB, Polygonvgen 29,
187 66 Tby, Sweden;
+46 (0)8 735 75 50; Fax: +46 (0)8 735 61 65;
www.cebit.se
POXITRON AB; Box 324, 591 24 Motala, Sweden;
+46 141-580 00; Fax: +46 141-584 95;
info@proxitron.se; www.proxitron.se
EMC Partner
+46 40 42 46 10; Fax: +46 40 42 62 18;
Instrumentation
Gowanda Electronics
ACAL BFI Nordic AB; Portalgatan 2B,
P.O. Box 1335, Uppsala, Sweden, SE-75143;
+46 1856 5830; +46 1869 6666;
Gritek Konsult Ab; Ostermalmsgatan 49,
Stockholm, Sweden, 11426;
+46 08242312; +46 08242306;
+46 8 446 77 30; Fax +46 8 446 77 45;
Fair-Rite
Ce-Bit Electronik, Box 7055, 18711 Taby;
+46 8 735 7550; Fax: +46 8 735 6165;
info@cebit.se
Schaffner EMC AB; Turebergstorg 1,
6 S-10147 Sollentuna;
+46 8 5792 1121; Fax: +46 8 929 690;
swedensales@schaffner.com
Ingenjrsfirman, Ekeby Gard,
Ekebyborna 250, SE-59195 Motala;
+46 8 930 280; +46 14 171 151;
hans.petterson@igpab.se; www.igpab.se
MILMEGA
+46 8 446 77 30; Fax +46 8 446 77 45;
SCHURTER Nordic AB
Sandsborgsvgen 50, 122 33 Enskede;
+46 8 447 35 60;
info@schurter.se; www.schurter.se
Teseq
+46 8 446 77 30; Fax +46 8 446 77 45;
Ukraine
Radiant-Elcom, 117246,
Nautchny proezd, 8 b.1, Moscow;
+7495 725 0404; Fax: +7495 921 3585;
EM TEST
Russia;
+7 (495) 410 64 65; Fax: +7 (495) 980 71 19;
Instrumentation
168
ADVERTISER
INDEX
2013 EMC Europe Guide
Aaronia AG 24, 67, 93, Back Cover
Advanced Test Equipment Rentals 32, 68
AH Systems, Inc 37, 63, 85, 101, 115, 129, 139, 158
Albatross Projects GmbH 42, 43
APEMC Asia Pacifc EMC Symposium 2013 19
AR RF/Microwave Instrumentation 29, 56, 80,
99, 109, 122, 137, 146, 152
ASTAT Sp z oo 127
Carlisle Interconnect Technologies 34
Dutch Microwave Absorber Solutions 48
EDICON 15
EM TEST AG 72, 133
EMC Europe 2013 22
EMC PARTNER AG 39
EMV 2013 20
ESD Association 23
European Microwave Week 2013 79
Federal-Mogul Corporation 65, 89
Fair-Rite Products Corp 44, 71
Gowanda 77
IEEE 2013 EMC Symposium Denver 17
IFI, a TESEQ company 51, 111
IMS 5
ITEM Media 45, 78, 92, 103, 105, 114,
115, 129, 138, 145, 150, 151, 156, 160, Inside Back Cover
JiangSu WEMC Technology Co, Ltd 73
Kemtron Limited 30
Langer EMV-Technik GmbH 69
LP Instruments srl 94
Montrose Compliance Services 33
Nexio 87
Microwave & RF Show Paris 21
Milmega, a TESEQ Company 83, 134
Rohde & Schwartz 53, 75
Schlegel Electronic Materials 61
Swift Textile Metalizing 55
Tech-Etch, Inc 31
TESEQ 59,104, 128, 149, 155, 159, Inside Front Cover
Wavecontrol 106
AD_INDEX_EEG13.indd 110 11/16/12 5:28 PM ADs_EEG13.indd 2 11/16/12 1:43 PM
168
ADVERTISER
INDEX
2013 EMC Europe Guide
Aaronia AG 24, 67, 93, Back Cover
Advanced Test Equipment Rentals 32, 68
AH Systems, Inc 37, 63, 85, 101, 115, 129, 139, 158
Albatross Projects GmbH 42, 43
APEMC Asia Pacifc EMC Symposium 2013 19
AR RF/Microwave Instrumentation 29, 56, 80,
99, 109, 122, 137, 146, 152
ASTAT Sp z oo 127
Carlisle Interconnect Technologies 34
Dutch Microwave Absorber Solutions 48
EDICON 15
EM TEST AG 72, 133
EMC Europe 2013 22
EMC PARTNER AG 39
EMV 2013 20
ESD Association 23
European Microwave Week 2013 79
Federal-Mogul Corporation 65, 89
Fair-Rite Products Corp 44, 71
Gowanda 77
IEEE 2013 EMC Symposium Denver 17
IFI, a TESEQ company 51, 111
IMS 5
ITEM Media 45, 78, 92, 103, 105, 114,
115, 129, 138, 145, 150, 151, 156, 160, Inside Back Cover
JiangSu WEMC Technology Co, Ltd 73
Kemtron Limited 30
Langer EMV-Technik GmbH 69
LP Instruments srl 94
Montrose Compliance Services 33
Nexio 87
Microwave & RF Show Paris 21
Milmega, a TESEQ Company 83, 134
Rohde & Schwartz 53, 75
Schlegel Electronic Materials 61
Swift Textile Metalizing 55
Tech-Etch, Inc 31
TESEQ 59,104, 128, 149, 155, 159, Inside Front Cover
Wavecontrol 106
AD_INDEX_EEG13.indd 110 11/16/12 5:28 PM ADs_EEG13.indd 2 11/16/12 1:43 PM

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