DH61DL TechProdSpec06

Intel Desktop Board DH61DL
Technical Product Specification
October 2012 Part Number: G23559-006
The Intel Desktop Board DH61DL may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DH61DL Specification Update.
Revision History
Revision -001 -002 -003 -004 -005 -006 Revision History First release of the Intel Specification
Date Desktop Board DH61DL Technical Product March 2011 May 2011 March 2012 April 2012 June 2012 October 2012
Second release of the Intel Desktop Board DH61DL Technical Product Specification Updated maximum memory supported from 8 GB to 16 GB Updated the Board Identification Information Specification Clarification Specification Clarification
This product specification applies to only the standard Intel Desktop Board DH61DL with BIOS identifier BEH6110H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTELS TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. All Intel desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Intel, Intel Core, and Pentium are trademarks of Intel Corporation in the U.S. and/or other countries. * Other names and brands may be claimed as the property of others. Copyright 2011, 2012, Intel Corporation. All rights reserved.
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Board Identification Information

Basic Desktop Board DH61DL Identification Information
AA Revision
G14066-202 G14066-203 G14066-204 G14066-205 G14066-206 G14067-202 G14067-203 G14067-204 G14067-205 G14067-206 Notes: 1. 2. The AA number is found on a small label on the component side of the board. The H61 chipset used on this AA revision consists of the following component:
BIOS Revision
BEH6110H.86A.0020 BEH6110H.86A.0020 BEH6110H.86A.0020 BEH6110H.86A.0038 BEH6110H.86A.0044 BEH6110H.86A.0020 BEH6110H.86A.0020 BEH6110H.86A.0020 BEH6110H.86A.0038 BEH6110H.86A.0044
Notes
1,2 1,2 1,2 1,2 1,2 1,2 1,2 1,2 1,2 1,2
Device
82H61
Stepping
B3
S-Spec Numbers
SLJ4B
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Specification Changes or Clarifications

The table below indicates the Specification Changes or Specification Clarifications that apply to the Intel Desktop Board DH61DL. Specification Changes or Clarifications
Date
May 2011
Type of Change
Spec Clarifications
Description of Change or Clarification

The Intel H61 Express Chipset does not support RAID. The following sections of this manual have been updated: Reference to RAID in Table 1. Feature Summary has been deleted Section 1.9.1.1 Serial ATA RAID has been deleted Section 1.9.1.2 Intel Rapid Recover Technology has been deleted The Caution in Section 3.1 Introduction has been deleted The maximum memory supported changed from 16 GB to 8 GB in the following sections of this manual: Table 1. Feature Summary Section 1.6 System Memory Section 2.1.1 Addressable Memory Figure 8. Detailed System Memory Address Map Table 9. System Memory Map Thermal Design Power (TDP) changed from 95 W to 65 W in the following sections of this manual: Table 1. Feature Summary Section 1.4 Processor Section 2.6.1 Power Supply Considerations
March 2012 June 2012 October 2012
Spec Clarification Spec Clarification Spec Clarification
Updated maximum memory supported from 8 GB to 16 GB Added additional supported memory to Table 3 and corrected a typo in Table 9. Updated Table 31. Environmental Specifications to address operating temperature requirements for the board. Updated Section 1.7.1.2 Digital Visual Interface (DVI-D) to correct maximum supported resolution.
Errata
Current characterized errata, if any, are documented in a separate Specification Update. See http://developer.intel.com/products/desktop/motherboard/index.htm for the latest documentation.
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Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for the Intel Desktop Board DH61DL.
Intended Audience
The TPS is intended to provide detailed, technical information about the Intel Desktop Board DH61DL and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains

Chapter 1 2 3 4 5 Description A description of the hardware used on the Intel Desktop Board DH61DL A map of the resources of the Intel Desktop Board The features supported by the BIOS Setup program A description of the BIOS error messages, beep codes, and POST codes Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings

NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
Intel Desktop Board DH61DL Technical Product Specification
Other Common Notation

# GB GB/s Gb/s KB Kbit kbits/s MB MB/s Mbit Mbits/s xxh x.x V * Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) Gigabytes per second Gigabits per second Kilobyte (1024 bytes) Kilobit (1024 bits) 1000 bits per second Megabyte (1,048,576 bytes) Megabytes per second Megabit (1,048,576 bits) Megabits per second An address or data value ending with a lowercase h indicates a hexadecimal value. Volts. Voltages are DC unless otherwise specified. This symbol is used to indicate third-party brands and names that are the property of their respective owners.
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Contents
Revision History
Board Identification Information .................................................................. iii Specification Changes or Clarifications ..........................................................iv Errata ......................................................................................................iv
Preface
Intended Audience..................................................................................... v What This Document Contains..................................................................... v Typographical Conventions ......................................................................... v
1 Product Description
1.1 Overview ......................................................................................... 11 1.1.1 Feature Summary ................................................................. 11 1.1.2 Board Layout ........................................................................ 13 1.1.3 Block Diagram ...................................................................... 15 1.2 Legacy Considerations ....................................................................... 16 1.3 Online Support ................................................................................. 16 1.4 Processor ........................................................................................ 16 1.5 Intel H61 Express Chipset ................................................................ 17 1.6 System Memory ............................................................................... 17 1.6.1 Memory Configurations .......................................................... 18 1.7 Graphics Subsystem ......................................................................... 20 1.7.1 Integrated Graphics ............................................................... 20 1.7.2 External Graphics .................................................................. 20 1.8 USB ................................................................................................ 21 1.9 SATA Interfaces ............................................................................... 22 1.10 Legacy I/O Controller ........................................................................ 22 1.10.1 Serial Port ............................................................................ 22 1.11 Audio Subsystem .............................................................................. 23 1.11.1 Audio Subsystem Software ..................................................... 24 1.11.2 Audio Headers and Connectors................................................ 24 1.12 LAN Subsystem ................................................................................ 26 1.12.1 Intel 82579V Gigabit Ethernet Controller ................................ 26 1.12.2 LAN Subsystem Software ....................................................... 26 1.12.3 RJ-45 LAN Connector with Integrated LEDs .............................. 27 1.13 Real-Time Clock Subsystem ............................................................... 28 1.14 Thermal Monitoring ........................................................................... 29 1.15 Platform Management and Security ..................................................... 30 1.15.1 Hardware Management Subsystem .......................................... 30 1.15.2 Hardware Monitoring ............................................................. 30
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1.16 Power Management .......................................................................... 31 1.16.1 ACPI .................................................................................... 31 1.16.2 Hardware Support ................................................................. 34
2 Technical Reference
2.1 Memory Resources ........................................................................... 39 2.1.1 Addressable Memory ............................................................. 39 2.1.2 Memory Map ......................................................................... 41 2.2 Connectors and Headers .................................................................... 41 2.2.1 Back Panel Connectors ........................................................... 42 2.2.2 Component-side Connectors and Headers................................. 43 2.3 BIOS Configuration Jumper Block ....................................................... 52 2.4 Intel Management Engine BIOS Extension (Intel MEBX) Reset Header . 54 2.5 Mechanical Considerations ................................................................. 55 2.5.1 Form Factor .......................................................................... 55 2.6 Electrical Considerations .................................................................... 56 2.6.1 Power Supply Considerations .................................................. 56 2.6.2 Fan Header Current Capability ................................................ 57 2.6.3 Add-in Board Considerations ................................................... 57 2.7 Thermal Considerations ..................................................................... 58 2.8 Reliability......................................................................................... 60 2.9 Environmental .................................................................................. 60
3 Overview of BIOS Features

3.1 3.2 3.3 3.4 Introduction ..................................................................................... 61 System Management BIOS (SMBIOS) ................................................. 63 Legacy USB Support ......................................................................... 63 BIOS Updates .................................................................................. 64 3.4.1 Language Support ................................................................. 64 3.4.2 Custom Splash Screen ........................................................... 65 3.5 BIOS Recovery ................................................................................. 65 3.6 Boot Options .................................................................................... 66 3.6.1 Optical Drive Boot ................................................................. 66 3.6.2 Network Boot........................................................................ 66 3.6.3 Booting Without Attached Devices ........................................... 66 3.6.4 Changing the Default Boot Device During POST ......................... 66 Speaker .......................................................................................... 67 BIOS Beep Codes ............................................................................. 67 Front-panel Power LED Blink Codes ..................................................... 68 BIOS Error Messages ........................................................................ 68 Port 80h POST Codes ........................................................................ 69
4 Error Messages and Beep Codes

4.1 4.2 4.3 4.4 4.5
viii
Contents
5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance ...................................................................... 75 5.1.1 Safety Standards................................................................... 75 5.1.2 European Union Declaration of Conformity Statement ................ 76 5.1.3 Product Ecology Statements ................................................... 77 5.1.4 EMC Regulations ................................................................... 79 5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 82 5.1.6 Regulatory Compliance Marks (Board Level) ............................. 83 5.2 Battery Disposal Information .............................................................. 84
Figures
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. Major Board Components .................................................................. 13 Block Diagram .................................................................................. 15 Memory Channel and DIMM Configuration............................................ 19 Back Panel Audio Connector Options ................................................... 25 LAN Connector LED Locations ............................................................. 27 Thermal Sensors and Fan Headers ...................................................... 29 Location of the Standby Power LED (Green) ......................................... 37 Detailed System Memory Address Map ................................................ 40 Back Panel Connectors ...................................................................... 42 Component-side Connectors and Headers ............................................ 43 Connection Diagram for Front Panel Header ......................................... 49 Connection Diagram for Front Panel USB Headers ................................. 51 Location of the Jumper Block ............................................................. 52 Intel MEBX Reset Header ................................................................... 54 Board Dimensions ............................................................................. 55 Localized High Temperature Zones ..................................................... 59
Tables
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. Feature Summary ............................................................................. 11 Components Shown in Figure 1 .......................................................... 14 Supported Memory Configurations ...................................................... 18 Audio Jack Support ........................................................................... 23 LAN Connector LED States ................................................................. 27 Effects of Pressing the Power Switch ................................................... 31 Power States and Targeted System Power ........................................... 32 Wake-up Devices and Events ............................................................. 33 System Memory Map ........................................................................ 41 Component-side Connectors and Headers Shown in Figure 10 ................ 44 Serial Port Header ............................................................................ 45 S/PDIF Header ................................................................................. 45 Internal Mono Speaker Header ........................................................... 45 Front Panel Audio Header for Intel HD Audio ........................................ 45 Front Panel Audio Header for AC 97 Audio ........................................... 46
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16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. 43. 44.
Front Panel USB Header .................................................................... 46 SATA Connectors .............................................................................. 46 Chassis Intrusion Header ................................................................... 47 Fan Headers .................................................................................... 47 Processor Core Power Connector ........................................................ 48 Main Power Connector ....................................................................... 48 Front Panel Header ........................................................................... 49 States for a One-Color Power LED....................................................... 50 Alternate Front Panel Power LED Header.............................................. 50 LPC Debug Header ............................................................................ 51 BIOS Setup Configuration Jumper Settings .......................................... 53 Intel MEBX Reset Header Signals ........................................................ 54 Recommended Power Supply Current Values........................................ 56 Fan Header Current Capability ............................................................ 57 Thermal Considerations for Components .............................................. 59 Environmental Specifications .............................................................. 60 BIOS Setup Program Menu Bar........................................................... 62 BIOS Setup Program Function Keys .................................................... 62 Acceptable Drives/Media Types for BIOS Recovery................................ 65 Boot Device Menu Options ................................................................. 66 BIOS Beep Codes ............................................................................. 67 Front-panel Power LED Blink Codes ..................................................... 68 BIOS Error Messages ........................................................................ 68 Port 80h POST Code Ranges .............................................................. 69 Port 80h POST Codes ........................................................................ 70 Typical Port 80h POST Sequence ........................................................ 74 Safety Standards .............................................................................. 75 EMC Regulations ............................................................................... 79 Regulatory Compliance Marks ............................................................ 83
1
1.1
1.1.1
Product Description
Overview
Feature Summary
Table 1 summarizes the major features of the board. Table 1. Feature Summary
Form Factor Processor Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters]) Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors in an LGA1155 socket with up to 65 W TDP: Integrated graphics processing (processors with Intel Graphics Technology) External graphics interface controller Integrated memory controller Chipset Memory Intel H61 Express Chipset consisting of the Intel H61 Platform Controller Hub (PCH) Two 240-pin DDR3 SDRAM Dual Inline Memory Module (DIMM) sockets Support for DDR3 1333 MHz and DDR3 1066 MHz DIMMs Support for 1 Gb, 2 Gb, and 4 Gb memory technology Support for up to 16 GB of system memory with two DIMMs using 4 Gb memory technology Support for non-ECC memory Graphics Integrated graphics support for processors with Intel Graphics Technology: VGA DVI-D Support for PCI Express 2.0 x1 add-in graphics card Audio Intel High Definition Audio: Realtek* ALC892 audio codec S/PDIF audio header Front panel audio header Mono speaker header
continued
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Table 1. Feature Summary (continued)

Peripheral Interfaces Ten USB ports: Two USB 3.0 ports are implemented with stacked back panel connectors (blue) Two USB 2.0 ports are implemented with stacked back panel connectors (black) Six USB 2.0 front panel ports are implemented through three dual-port internal headers Three SATA interfaces through the Intel H61 Express Chipset One serial port header One parallel port connector on the back panel One PS/2* keyboard/mouse port on back panel Legacy I/O Control BIOS Nuvoton* W83677HG-i Super I/O controller for hardware management and serial port, parallel port, and PS/2 support Intel BIOS resident in the SPI Flash device Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and SMBIOS Instantly Available PC Technology Support for PCI* Local Bus Specification Revision 2.2 Support for PCI Express* Suspend to RAM support Wake on Conventional PCI, PCI Express, LAN, front panel, serial, PS/2, and USB ports LAN Support Expansion Capabilities Hardware Monitor Subsystem Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel 82579V Gigabit Ethernet Controller One PCI Express 2.0 x1 add-in card connector One PCI Express x1 Half-Mini add-in card connector Hardware monitoring through the Nuvoton Super I/O controller Voltage sense to detect out of range power supply voltages Thermal sense to detect out of range thermal values Two fan headers Two fan sense inputs used to monitor fan activity Fan speed control
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Product Description
1.1.2
Board Layout
Figure 1 shows the location of the major components on Intel Desktop Board DH61DL.
Figure 1. Major Board Components Table 2 lists the components identified in Figure 1.
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Table 2. Components Shown in Figure 1

Item/callout from Figure 1 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA BB Description Back panel connectors Battery BIOS setup configuration jumper block SATA connectors (3) Intel Management Engine BIOS Extension (Intel MEBX) Reset header Front panel USB 2.0 header Front panel USB 2.0 header Front panel USB 2.0 header Main power connector (2 x 12) PCI Express Mini Card slot Intel H61 Express Chipset Piezoelectric speaker Standby power LED DIMM 2 (Channel B DIMM 1) DIMM 1 (Channel A DIMM 1) Serial port header Front panel header Chassis intrusion header Alternate front panel power LED header Processor fan header LGA1155 processor socket 12 V internal power connector (ATX12V) Low Pin Count (LPC) Debug header PCI Express x1 add-in card connector System fan header S/PDIF header Front panel audio header Internal mono speaker header
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Product Description
1.1.3
Block Diagram
Figure 2 is a block diagram of the major functional areas of the board.
Figure 2. Block Diagram
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1.2
Legacy Considerations
No Parallel ATA (PATA) IDE drive connector
This board differs from other Intel Desktop Board products, with specific changes including (but not limited to) the following:
1.3
Online Support
To find information about
Intel Desktop Board DH61DL Desktop Board Support Available configurations for the Intel Desktop Board DH61DL Supported processors Chipset information BIOS and driver updates Tested memory Integration information
Visit this World Wide Web site:

http://www.intel.com/products/motherboard/index.htm http://www.intel.com/p/en_US/support?iid=hdr+support http://ark.intel.com http://processormatch.intel.com http://www.intel.com/products/desktop/chipsets/index.htm http://downloadcenter.intel.com http://www.intel.com/support/motherboards/desktop/sb/CS025414.htm http://www.intel.com/support/go/buildit
1.4
Processor
The board is designed to support the Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors in an LGA1155 socket. Other processors may be supported in the future. This board is designed to support processors with a maximum TDP of 65 W. See the Intel web site listed below for the most up-to-date list of supported processors.
For information about
Supported processors
Refer to:
http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to Section 2.6.1 on page 56 for information on power supply requirements for this board.
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Product Description
1.5
Intel H61 Express Chipset
The Intel H61 Express Chipset consisting of the Intel H61 Platform Controller Hub (PCH) provides interfaces to the processor and the USB, SATA, LPC, audio, network, display, and PCI Express. The PCH is a centralized controller for the boards I/O paths.
The Intel H61 Express chipset Resources used by the chipset
Refer to
http://www.intel.com/products/desktop/chipsets/index.htm Chapter 2
1.6

System Memory
Two independent memory channels with interleaved mode support Supports 1.2 V 1.8 V DIMM memory voltage Support for non-ECC, unbuffered, single-sided or double-sided DIMMs with x8 organization 16 GB maximum total system memory (with 4 Gb memory technology). Refer to Section 2.1.1 on page 39 for information on the total amount of addressable memory. Minimum total system memory: 1 GB using 1 Gb x8 module Serial Presence Detect DDR3 1333 MHz and DDR3 1066 MHz SDRAM DIMMs
The board has two DIMM sockets and supports the following memory features:
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the DIMMs may not function under the determined frequency.
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Table 3 lists the supported DIMM configurations. Table 3. Supported Memory Configurations
DIMM Capacity 512 MB 1024 MB 1024 MB 2048 MB 2048 MB 4096 MB 4096 MB 8192 MB Note: Configuration (Note) SS SS SS DS SS DS SS DS SDRAM Density 1 Gbit 1 Gbit 2 Gbit 1 Gbit 2 Gbit 2 Gbit 4 Gbit 4 Gbit SDRAM Organization Front-side/Back-side 64 M x16/empty 128 M x8/empty 128 M x16/empty 128 M x8/128 M x8 128 M x16/empty 256 M x8/256 M x8 512 M x8/empty 512 M x8/512 M x8 Number of SDRAM Devices 4 8 4 16 8 16 8 16
DS refers to double-sided memory modules (containing two rows of SDRAM) and SS refers to single-sided memory modules (containing one row of SDRAM).

Tested Memory
Refer to:
http://support.intel.com/support/motherboards/desktop/sb/CS025414.htm
1.6.1
Memory Configurations
Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed DIMMs are used between channels, the slowest memory timing will be used. Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed DIMMs are used between channels, the slowest memory timing will be used.
Refer to:
http://www.intel.com/support/motherboards/desktop/sb/cs011965.htm
The Intel Core i7, Intel Core i5, Intel Core i3, and Intel Pentium processors support the following types of memory organization:

Memory Configuration examples
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Product Description
Figure 3 illustrates the memory channel and DIMM configuration.
Figure 3. Memory Channel and DIMM Configuration
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1.7
Graphics Subsystem
The board supports system graphics through either Intel Graphics Technology or a PCI Express 2.0 x1 add-in graphics card.
1.7.1
Integrated Graphics
The board supports integrated graphics through the Intel Flexible Display Interface (Intel FDI) for processors with Intel Graphics Technology.
1.7.1.1
Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 2048 x 1536 (QXGA) at a 75 Hz refresh rate. The VGA port is enabled for POST whenever a monitor is attached, regardless of the DVI-D connector status.
1.7.1.2
Digital Visual Interface (DVI-D)
The DVI-D port supports only digital DVI displays. The maximum supported resolution is 1920 x 1200 at 60 Hz refresh (WUXGA). The DVI-D port is compliant with the DVI 1.0 specification.
1.7.2
External Graphics
The board supports external graphics via a PCI Express x1 connector.
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Product Description
1.8
USB
The board supports up to eight USB 2.0 ports and two USB 3.0 ports. The Intel H61 Express Chipset provides the USB controller for the 2.0 ports. The two USB 3.0 ports are provided by the NEC UPD720200 controller. The port arrangement is as follows: Two USB 3.0 ports are implemented with stacked back panel connectors (blue) Two USB 2.0 ports are implemented with stacked back panel connectors (black) Six USB 2.0 front panel ports are implemented through three dual-port internal headers
All 10 USB ports are high-speed, full-speed, and low-speed capable. The USB 3.0 ports are super-speed capable.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.
The location of the USB connectors on the back panel The location of the front panel USB headers
Refer to
Figure 9, page 42 Figure 10, page 43
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1.9
SATA Interfaces
The board provides three 3 Gb/s SATA connectors, which support one device per connector. The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using the Windows* XP, Windows Vista*, and Windows 7* operating systems. For more information, see: http://www.serialata.org/.
The location of the SATA connectors
Refer to
Figure 10, page 43
1.10 Legacy I/O Controller

The Legacy I/O Controller provides the following features: One serial port One back panel parallel port (with Extended Capabilities Port (ECP) and Enhanced Parallel Port (EPP) support PS/2-style keyboard/mouse interface on the back panel Serial IRQ interface compatible with serialized IRQ support for PCI Conventional bus systems Intelligent power management, including a programmable wake-up event interface Conventional PCI bus power management support
The BIOS Setup program provides configuration options for the Legacy I/O controller.
1.10.1
Serial Port
The serial port is implemented as a 10-pin header on the board. The serial port supports data transfers at speeds up to 115.2 kbits/s with BIOS support.
The location of the serial port header
Refer to
Figure 10, page 43
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Product Description
1.11 Audio Subsystem

The board supports Intel High Definition Audio through the Realtek ALC892 audio codec interface. The Realtek ALC892-based audio subsystem supports the following features: 6+2-channel audio with independent multi-streaming stereo. Advanced jack sense for the back panel audio jacks that enables the audio codec to recognize the device that is connected to an audio port. The back panel audio jacks are capable of retasking according to the users definition, or can be automatically switched depending on the recognized device type. Stereo input and output through back panel jacks Headphone and Mic in functions for front panel audio jacks S/PDIF audio header A signal-to-noise (S/N) ratio of 90 dB
Table 4 lists the supported functions of the front panel and back panel audio jacks. Table 4. Audio Jack Support
Audio Jack FP Green FP Pink Rear Blue Rear Green Rear Pink Ctrl panel Default Default Default Default Microphone Headphones Default Line Out (Front Speakers) Line In (Surround) Mic In (Center/Sub)
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1.11.1
Audio Subsystem Software

Refer to
Section 1.3, page 16
Audio software and drivers are available from Intels World Wide Web site.
Obtaining audio software and drivers
1.11.2
Audio Headers and Connectors
The board contains audio connectors and headers on both the back panel and the component side of the board. The component-side audio headers include the following: Front panel audio (a 2 x 5-pin header that provides headphone and mic in signals for front panel audio connectors) (yellow) S/PDIF audio header (1 x 4-pin header) (yellow) Internal mono speaker header (1 x 2-pin header) (yellow)
Refer to
Figure 10, page 43 Table 14 and Table 15, page 45 Table 12, page 45 Table 13, page 45 Section 2.2.1, page 42

The locations of the front panel audio header, S/PDIF header, and internal mono speaker header The signal names of the front panel audio header The signal names of the S/PDIF header The signal names of the internal mono speaker header The back panel audio connectors
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Product Description
1.11.2.1
Analog Audio Connectors
The available configurable back panel audio connectors are shown in Figure 4.
Item
A B C
Description
Line in Line out/front speakers Mic in/side surround
Figure 4. Back Panel Audio Connector Options The back panel audio connectors are configurable through the audio device drivers.
The back panel audio connectors
Refer to
Section 2.2.1, page 42
The front panel headphone output is supported using a separate audio channel pair allowing multi-streaming audio configurations such as simultaneous 5.1 surround playback and stereo audio conferencing (through back panel speakers and a front panel headset, respectively).
1.11.2.2
S/PDIF Header
The S/PDIF header allows connections to coaxial or optical dongles for digital audio output.
1.11.2.3
Internal Mono Speaker Header
The internal mono speaker header allows connection to an internal, low-power speaker for basic system sound capability. The subsystem is capable of driving a speaker load of 8 Ohms at 1 W (rms) or 4 Ohms at 1.5 W (rms).
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1.12 LAN Subsystem

The LAN subsystem consists of the following: Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mbits/s) Intel H61 Express Chipset RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include: CSMA/CD protocol engine LAN connect interface between the PCH and the LAN controller PCI Express power management ACPI technology support LAN wake capabilities LAN subsystem software
Refer to
http://downloadcenter.intel.com

LAN software and drivers
1.12.1

Intel 82579V Gigabit Ethernet Controller
The Intel 82579V Gigabit Ethernet Controller supports the following features: 10/100/1000 BASE-T IEEE 802.3 compliant Energy Efficient Ethernet (EEE) IEEE802.3az support [Low Power Idle (LPI) mode] Dual interconnect between the Integrated LAN Controller and the Physical Layer (PHY): PCI Express-based interface for active state operation (S0) state SMBUS for host and management traffic (Sx low power state) Compliant to IEEE 802.3x flow control support 802.1p and 802.1q TCP, IP, and UDP checksum offload (for IPv4 and IPv6) Full device driver compatibility
1.12.2
LAN Subsystem Software

Refer to
LAN software and drivers are available from Intels World Wide Web site.
Obtaining LAN software and drivers
26
Product Description
1.12.3
RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 5).
Item
A B
Description
Link/Activity LED (green) Link Speed LED (green/yellow)
Figure 5. LAN Connector LED Locations Table 5 describes the LED states when the board is powered up and the LAN subsystem is operating. Table 5. LAN Connector LED States
LED
Link/Activity
LED Color
Green
LED State
Off On Blinking Off
Condition
LAN link is not established. LAN link is established. LAN activity is occurring. 10 Mbits/s data rate is selected or negotiated. 100 Mbits/s data rate is selected or negotiated. 1000 Mbits/s data rate is selected or negotiated.
Link Speed
Green/Yellow
Green Yellow
27
1.13 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to 13 minutes/year at 25 C with power applied through the power supply 5V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be notified during POST. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 13 shows the location of the battery.
28
Product Description
1.14 Thermal Monitoring

Figure 6 shows the locations of the thermal sensors and fan headers.
Item
A B C D
Description
Thermal diode, located on the Intel H61 PCH Processor fan header Thermal diode, located on processor die System fan header
Figure 6. Thermal Sensors and Fan Headers
29
1.15 Platform Management and Security

Intel DH61DL Desktop Board integrates several functions designed to manage the system and lower the total cost of ownership (TCO) of the system. These system management functions are designed to report errors, diagnose the system, and recover from system lockups without the aid of an external microcontroller.
1.15.1
Hardware Management Subsystem
The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including the following: Fan monitoring and control Thermal and voltage monitoring Chassis intrusion detection
1.15.2

Hardware Monitoring
The hardware monitoring and fan control subsystem is based on the Nuvoton W83677HG-i device, which supports the following: Processor and system ambient temperature monitoring Chassis fan speed monitoring Power monitoring of +12 V, +5 V, +3.3 V, V_SM, and +VCCP SMBus interface
1.15.2.1
Fan Monitoring
Fan monitoring can be observed through the BIOS setup user interface, Intel Desktop Utilities or third-party software.
The functions of the fan headers
Refer to
Section 1.16.2.2, page 35
1.15.2.2
Chassis Intrusion and Detection
The board supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion header. When the chassis cover is removed, the mechanical switch is in the closed position.
The location of the chassis intrusion header
Refer to
Figure 10, page 43
30
Product Description
1.16 Power Management

Power management is implemented at several levels, including: Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: Power connector Fan headers LAN wake capabilities Instantly Available PC technology Wake from USB PCI Express WAKE# signal support Wake from serial port Wake from PS/2
1.16.1
ACPI
ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include: Plug and Play (including bus and device enumeration) Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state A Soft-off feature that enables the operating system to power-off the computer Support for multiple wake-up events (see Table 8 on page 33) Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system. Table 6. Effects of Pressing the Power Switch
If the system is in this state Off (ACPI G2/G5 Soft off) On (ACPI G0 working state) On (ACPI G0 working state) Sleep (ACPI G1 sleeping state) Sleep (ACPI G1 sleeping state) and the power switch is pressed for Less than four seconds Less than four seconds More than six seconds Less than four seconds More than six seconds the system enters this state Power-on (ACPI G0 working state) Soft-off/Standby (note) (ACPI G1 sleeping state) Fail safe power-off (ACPI G2/G5 Soft off) Wake-up (ACPI G0 working state) Power-off (ACPI G2/G5 Soft off)
Note: System can only enter Standby state if power switch action is properly configured by the operating system.
31
1.16.1.1
System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state. Table 7 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states. Table 7. Power States and Targeted System Power
Global States G0 working state G1 sleeping state G1 sleeping state G2/S5 Sleeping States S0 working S3 Suspend to RAM. Context saved to RAM. S4 Suspend to disk. Context saved to disk. S5 Soft off. Context not saved. Cold boot is required. No power to the system. Processor States C0 working No power Device States D0 working state. D3 no power except for wake-up logic. D3 no power except for wake-up logic. D3 no power except for wake-up logic. D3 no power for wake-up logic, except when provided by battery or external source. Targeted System Power (Note 1) Full power > 30 W Power < 5 W (Note 2)
No power
Power < 5 W (Note 2)
No power
Power < 5 W (Note 2)
G3 mechanical off AC power is disconnected from the computer. Notes: 1. 2.
No power
No power to the system. Service can be performed safely.
Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis power supply. Dependent on the standby power consumption of wake-up devices used in the system.
32
Product Description
1.16.1.2
Wake-up Devices and Events
Table 8 lists the devices or specific events that can wake the computer from specific states. Table 8. Wake-up Devices and Events
These devices/events can wake up the computer Power switch RTC alarm LAN USB WAKE# signal Serial port PS/2 Notes: S4 implies operating system support only. USB ports are turned off during S4/S5 states. from this state S3, S4, S5 S3, S4, S5 S3, S4, S5 S3 S3, S4, S5 S3 S3, S4, S5
NOTE
The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.
33
1.16.2
Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake capabilities and Instantly Available PC technology features are used. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. The board provides several power management hardware features, including: Power connector Fan headers LAN wake capabilities Instantly Available PC technology Wake from USB WAKE# signal wake-up support Wake from serial port Wake from PS/2 +5 V Standby Power Indicator LED
LAN wake capabilities and Instantly Available PC technology require power from the +5 V standby line.
NOTE
The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.
1.16.2.1
Power Connector
ATX12V-compliant power supplies can turn off the system power through system control. When an ACPI-enabled system receives the correct command, the power supply removes all non-standby voltages. When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computers response can be set using the Last Power State feature in the BIOS Setup programs Boot menu.
The location of the main power connector The signal names of the main power connector
Refer to
Figure 10, page 43 Table 21, page 48
34
Product Description
1.16.2.2

Fan Headers
The function/operation of the fan headers is as follows: The fans are on when the board is in the S0 state The fans are off when the board is in the S3, S4, or S5 state Each fan header is wired to a fan tachometer input of the hardware monitoring and fan control ASIC All fan headers support closed-loop fan control that can adjust the fan speed or switch the fan on or off as needed All fan headers have a +12 V DC connection 4-pin fan headers are controlled by Pulse Width Modulation The system fan header also supports linear fan control on 3-wire fans
Refer to
Figure 10, page 43 Figure 6, page 29

The location of the fan headers The location of the fan headers and sensors for thermal monitoring
1.16.2.3
LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing LAN wake capabilities can damage the power supply. LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.
35
1.16.2.4
Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when implementing Instantly Available PC technology can damage the power supply. Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off and the front panel power LED will behave as configured by the BIOS S3 State Indicator option). When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 8 on page 33 lists the devices and events that can wake the computer from the S3 state. The board supports the PCI Bus Power Management Interface Specification. Add-in boards that also support this specification can participate in power management and can be used to wake the computer. The use of Instantly Available PC technology requires operating system support and PCI Express add-in cards and drivers.
1.16.2.5
Wake from USB
USB bus activity wakes the computer from an ACPI S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB and is supported by the operating system.
1.16.2.6
WAKE# Signal Wake-up Support
When the WAKE# signal on a PCI Express add-in card is asserted, the computer wakes from an ACPI S3, S4, or S5 state.
1.16.2.7 1.16.2.8
Wake from Serial Port Wake from PS/2 Devices
Serial port activity wakes the computer from an ACPI S3 state.
PS/2 device activity wakes the computer from an ACPI S3, S4, or S5 state. However, when the computer is in an S4 or S5 state, the only PS/2 activity that will wake the computer is the alt-PrtScrn key combination on the keyboard.
36
Product Description
1.16.2.9
+5 V Standby Power LED
The green +5 V standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 7 shows the location of the Standby Power indicator LED on the board.
CAUTION
If AC power has been switched off and the standby power indicators are still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices.
Figure 7. Location of the Standby Power LED (Green)
37
38
2
2.1
2.1.1
Technical Reference
Memory Resources
Addressable Memory
The board utilizes 16 GB of addressable system memory. Typically the address space that is allocated for PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 16 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following: BIOS/SPI Flash device (32 Mbit) Local APIC (19 MB) Direct Media Interface (40 MB) PCI Express configuration space (256 MB) PCH base address registers PCI Express ports (up to 256 MB) Memory-mapped I/O that is dynamically allocated for PCI Express add-in cards (256 MB)
The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just above the 4 GB boundary. Figure 8 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.
39
Figure 8. Detailed System Memory Address Map
40
Technical Reference
2.1.2
Memory Map
Table 9 lists the system memory map. Table 9. System Memory Map
Address Range (decimal)
1024 K 16777216 K 960 K - 1024 K 896 K - 960 K 800 K - 896 K
Address Range (hex)

100000 400000000 F0000 - FFFFF E0000 - EFFFF C8000 - DFFFF
Size
16382 MB 64 KB 64 KB 96 KB
Description
Extended memory Runtime BIOS Reserved Potential available high DOS memory (open to the PCI bus). Dependent on video adapter used. Video memory and BIOS Extended BIOS data (movable by memory manager software) Extended conventional memory Conventional memory
640 K - 800 K 639 K - 640 K 512 K - 639 K 0 K - 512 K
A0000 - C7FFF 9FC00 - 9FFFF 80000 - 9FBFF 00000 - 7FFFF
160 KB 1 KB 127 KB 512 KB
2.2
Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: back panel and front panel USB, and PS/2. The other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computers chassis, such as fans and internal peripherals. Do not use these connectors or headers to power devices external to the computers chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. Furthermore, improper connection of USB header single wire connectors may eventually overload the overcurrent protection and cause damage to the board. This section describes the boards connectors. The connectors can be divided into these groups: Back panel I/O connectors Component-side I/O connectors and headers (see page 43)
41
2.2.1
Back Panel Connectors
Figure 9 shows the location of the back panel connectors for the board.
Item A B C D E F G H I J
Description PS/2 keyboard/mouse connector USB 2.0 ports LAN USB 3.0 connectors Parallel port VGA connector DVI-D connector Line in Line out/front speakers Mic in/side surround
Figure 9. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (non-amplified) speakers are connected to this output.
42
Technical Reference
2.2.2
Component-side Connectors and Headers
Figure 10 shows the locations of the component-side connectors and headers.
Figure 10. Component-side Connectors and Headers Table 10 lists the component-side connectors and headers identified in Figure 10.
43
Table 10. Component-side Connectors and Headers Shown in Figure 10

Item/callout from Figure 10 A B C D E F G H I J K L M N O P Q R Description SATA connectors Front panel USB 2.0 header Front panel USB 2.0 header Front panel USB 2.0 header Main power connector (2 x 12) PCI Express Mini Card connector Serial port header Front panel header Chassis intrusion header Alternate front panel power LED header Processor fan header Main power connector (2 x 12) LPC Debug header PCI Express x1 add-in card connector System fan header S/PDIF header Front panel audio header Internal mono speaker header
44
Technical Reference
2.2.2.1
Signal Tables for the Connectors and Headers
Table 11. Serial Port Header

Pin
1 3 5 7 9
Signal Name
DCD (Data Carrier Detect) TXD# (Transmit Data) Ground RTS (Request To Send) RI (Ring Indicator)
Pin
2 4 6 8 10
Signal Name
RXD# (Receive Data) DTR (Data Terminal Ready) DSR (Data Set Ready) CTS (Clear To Send) Key (no pin)
Table 12. S/PDIF Header

Pin
1 2 3 3
Signal Name
Ground S/PDIF out Key (no pin) +5V_DC
Table 13. Internal Mono Speaker Header

Pin
1 2
Signal Name
+
Table 14. Front Panel Audio Header for Intel HD Audio

Pin
1 3 5 7 9
Signal Name
[Port 1] Left channel [Port 1] Right channel [Port 2] Right channel SENSE_SEND (Jack detection) [Port 2] Left channel
Pin
2 4 6 8 10
Signal Name
Ground PRESENCE# (Dongle present) [Port 1] SENSE_RETURN Key (no pin) [Port 2] SENSE_RETURN
45
Table 15. Front Panel Audio Header for AC 97 Audio

Pin
1 3 5 7 9
Signal Name
MIC MIC_BIAS FP_OUT_R AUD_5V FP_OUT_L
Pin
2 4 6 8 10
Signal Name
AUD_GND AUD_GND FP_RETURN_R KEY (no pin) FP_RETURN_L
NOTE
Not all AC 97 signals are supported; specifically, pins 4, 6, 7, and 10 are not supported.
Table 16. Front Panel USB Header

Pin
1 3 5 7 9
Signal Name
+5 VDC DD+ Ground KEY (no pin)
Pin
2 4 6 8 10
Signal Name
+5 VDC DD+ Ground No Connect
Table 17. SATA Connectors

Pin
1 2 3 4 5 6 7
Signal Name
Ground TXP TXN Ground RXN RXP Ground
46
Technical Reference
Table 18. Chassis Intrusion Header

Pin
1 2
Signal Name
Intruder# Ground
Table 19. Fan Headers

Pin
1 2 3 4
4-Wire Support
Ground +12 V FAN_TACH FAN_CONTROL
Pin
3 2 1 N/A
3-Wire Support
Ground FAN_POWER FAN_TACH N/A
2.2.2.2
Add-in Card Connectors
The board has the following add-in card connector: PCI Express 2.0 x1: one PCI Express x1 Mini Card connector. The x1 interface supports simultaneous transfer speeds up to 1 GB/s of peak bandwidth per direction and up to 2 GB/s concurrent bandwidth.
47
2.2.2.3
Power Supply Connectors
The board has the following power supply connectors: Main power a 2 x 12 connector. This connector is compatible with 2 x 10 connectors previously used on Intel Desktop boards. The board supports the use of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When using a power supply with a 2 x 10 main power cable, pins 11, 12, 23, and 24 must remain unconnected. Processor core power a 2 x 2 connector. This connector provides power directly to the processor voltage regulator and must always be used. Failure to do so will prevent the board from booting.
CAUTION
If a high power (75 W or greater) add-in card is installed in the PCI Express x16 connector, that card must also be connected directly to the power supply. Failure to do so may cause damage to the board and the add-in card. Table 20. Processor Core Power Connector
Pin
1 3
Signal Name
Ground +12 V
Pin
2 4
Signal Name
Ground +12 V
Table 21. Main Power Connector

Pin
1 2 3 4 5 6 7 8 9 10 11 12
Signal Name
+3.3 V +3.3 V Ground +5 V Ground +5 V Ground PWRGD (Power Good) +5 V (Standby) +12 V +12 V (Note)
(Note)
Pin
13 14 15 16 17 18 19 20 21 22 23 24
Signal Name
+3.3 V 12 V Ground PS-ON# (power supply remote on/off) Ground Ground Ground 5 V (obsolete) +5 V +5 V +5 V (Note) Ground (Note)
+3.3 V 2 x 12 connector detect
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.

Power supply considerations
Refer to
Section 2.6.1 on page 56
48
Technical Reference
2.2.2.4
Front Panel Header
This section describes the functions of the front panel header. Table 22 lists the signal names of the front panel header. Figure 11 is a connection diagram for the front panel header. Table 22. Front Panel Header
Pin
1 3
Signal
HD_PWR HDA#
In/ Out
Out Out
Description
Hard disk LED pull-up to +5 V Hard disk active LED
Pin
2 4
Signal
FP_LED+ FP_LED
In/ Out
Out Out
Description
Front panel green LED Front panel yellow LED
Hard Drive Activity LED
Power LED
Reset Switch 5 7 Power 9 +5 V Power Ground FP_RESET# In Ground Reset switch
On/Off Switch 6 8 PWR# Ground In Power switch Ground
Not Connected 10 N/C Not connected
Figure 11. Connection Diagram for Front Panel Header 2.2.2.4.1 Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to an internal storage device. Proper LED function requires a SATA hard drive or optical drive connected to an onboard SATA connector.
49
2.2.2.4.2
Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST. 2.2.2.4.3 Power LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 23 shows the default states for this LED. More options are available through BIOS setup. Table 23. States for a One-Color Power LED
LED State
Off Steady Lit Blink
Description
Power off/sleeping Running Standby
2.2.2.4.4
Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal.
2.2.2.5
Alternate Front Panel Power LED Header
Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header. Table 24. Alternate Front Panel Power LED Header
Pin
1 2 3
Signal Name
FP_LED+ Not connected FP_LED
In/Out
Out Out
Description
FP_LED+ FP_LED
50
Technical Reference
2.2.2.6
Front Panel USB Headers
Figure 12 is a connection diagram for the front panel USB headers.
NOTE
The +5 V DC power on the USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices.
Figure 12. Connection Diagram for Front Panel USB Headers
2.2.2.7
Low Pin Count (LPC) Debug Header
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred (refer to Section 4.5 on page 69 for a description of the POST codes). Displaying the POST codes requires a POST card that can interface with the Low Pin Count (LPC) Debug header. The POST card can decode the port and display the contents on a medium such as a seven-segment display. Table 25. LPC Debug Header
Pin
1 3 5 7 9 11 13
Signal Name
CK_33M_DEBUG PLTRST# LAD0 LAD2 GND +3.3 V Not connected
Pin
2 4 6 8 10 12 14
Signal Name
GND LFRAME# LAD1 LAD3 GND +3.3 V +3.3 V
51
2.3
BIOS Configuration Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 13 shows the location of the jumper block. The 3-pin jumper block determines the BIOS Setup programs mode. Table 26 describes the jumper settings for the three modes: normal, configure, and recovery.
Figure 13. Location of the Jumper Block
52
Technical Reference
Table 26. BIOS Setup Configuration Jumper Settings

Function/Mode Normal Configure Jumper Setting 1-2 2-3 Configuration The BIOS uses current configuration information and passwords for booting. After the POST runs, Setup runs automatically. The maintenance menu is displayed. Note that this Configure mode is the only way to clear the BIOS/CMOS settings. Press F9 (restore defaults) while in Configure mode to restore the BIOS/CMOS settings to their default values. Recovery None The BIOS attempts to recover the BIOS configuration. A recovery CD or USB flash drive is required.
53
2.4
Intel Management Engine BIOS Extension (Intel MEBX) Reset Header
The Intel MEBX reset header (see Figure 14) allows you to reset the Intel AMT configuration to the factory defaults. Momentarily shorting pins 1 and 2 with a jumper (not supplied) will accomplish the following: Return all Intel ME parameters to their default values. Delete any user entered information, including PID/PPS and user entered Hash Certificates. USB key and remote configuration data will be removed if the parameters are not default parameters. Reset the Intel MEBX password to the default value (admin).
Figure 14. Intel MEBX Reset Header Table 27. Intel MEBX Reset Header Signals
Pin
1 2 3
Function
PCH.AK24 (PCH_RTCRST_PULLUP) Ground No connection
54
Technical Reference
CAUTION
Always turn off the power and unplug the power cord from the computer before installing an MEBX jumper. The jumper must be removed before reapplying power. The system must be allowed to reach end of the POST before reset is complete. Otherwise, the board could be damaged.
2.5
2.5.1
Mechanical Considerations
Form Factor
The board is designed to fit into a microATX form-factor chassis. Figure 15 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification.
Figure 15. Board Dimensions
55
2.6
2.6.1
Electrical Considerations
Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate +5 V standby current. Failure to do so can damage the power supply. The total amount of standby current required depends on the wake devices supported and manufacturing options. Additional power required will depend on configurations chosen by the integrator. The power supply must comply with the indicated parameters of the ATX form factor specification. The potential relation between 3.3 VDC and +5 VDC power rails The current capability of the +5 VSB line All timing parameters All voltage tolerances
For example, for a system consisting of a supported 65 W processor (see Section 1.3 on page 16 for a list of supported processors), 1 GB DDR3 RAM, one high end video card, one hard disk drive, one optical drive, and all board peripherals enabled, the minimum recommended power supply is 350 W. Table 28 lists the recommended power supply current values. Table 28. Recommended Power Supply Current Values
Output Voltage Current 3.3 V 17 A 5V 18 A 12 V1 12 A 12 V2 18 A -12 V 0.8 A 5 VSB 2A

Selecting an appropriate power supply
Refer to
http://www.intel.com/support/motherboards/desktop/sb/C S-026472.htm
56
Technical Reference
2.6.2
Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 29 lists the current capability of the fan headers. Table 29. Fan Header Current Capability
Fan Header
Processor fan System fan
Maximum Available Current

2.0 A 1.5 A
2.6.3
Add-in Board Considerations
The board is designed to provide 2 A (average) of current for each add-in board from the +5 V rail. The total +5 V current draw for add-in boards for a fully loaded board (all expansion slots filled) must not exceed the systems power supply +5 V maximum current.
57
2.7
Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is required. Use of a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area is highly recommended. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.
CAUTION
The ambient temperature must not exceed the boards maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.9.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in damage to the voltage regulator circuit.
58
Technical Reference
Figure 16 shows the locations of the localized high temperature zones.
Item A B C
Description Processor voltage regulator area Processor Intel H61 Express Chipset
Figure 16. Localized High Temperature Zones Table 30 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 30. Thermal Considerations for Components
Component
Processor Intel H61 Express Chipset
Maximum Case Temperature

For processor case temperature, see processor datasheets and processor specification updates 111 oC (under bias)

Processor datasheets and specification updates
Refer to
59
2.8
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332, Method I Case 1 50% electrical stress, 55 C ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF data is calculated from predicted data at 55 C. The MTBF for the board is 292,467 hours.
2.9
Environmental
Table 31 lists the environmental specifications for the board. Table 31. Environmental Specifications
Parameter Temperature Non-Operating Operating -40 C to +60 C 0 C to +40 C The operating temperature of the board may be determined by measuring the air temperature from within 1 inch of the edge of the chipset/PCH heatsink and 1 inch above the board, in a closed chassis, while the system is in operation. Shock Unpackaged Packaged 50 g trapezoidal waveform Velocity change of 170 inches/second Half sine 2 millisecond Product Weight (pounds) <20 21-40 41-80 81-100 Vibration Unpackaged Packaged 5 Hz to 20 Hz: 0.01 g Hz sloping up to 0.02 g Hz 20 Hz to 500 Hz: 0.02 g Hz (flat) 5 Hz to 40 Hz: 0.015 g Hz (flat) 40 Hz to 500 Hz: 0.015 g Hz sloping down to 0.00015 g Hz Note: Before attempting to operate this board, the overall temperature of the board must be above the minimum operating temperature specified. It is recommended that the board temperature be at least room temperature before attempting to power on the board. Free Fall (inches) 36 30 24 18 Velocity Change (inches/sec) 167 152 136 118
(Note)
Specification
60
3
3.1
Overview of BIOS Features

Introduction
The board uses an Intel BIOS that is stored in a 32 Mbit (8,192 KB) Serial Peripheral Interface Flash Memory (SPI Flash) device which can be updated using a set of utilities. The SPI Flash contains the BIOS Setup program, POST, LAN EEPROM information, Plug and Play support, and other firmware. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as BEH6110H.86A. The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below.
Maintenance Main Configuration Performance Security Power Boot Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode. Section 2.3 on page 52 shows how to put the board in configure mode.
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Table 32 lists the BIOS Setup program menu features. Table 32. BIOS Setup Program Menu Bar
Maintenance Clears passwords and displays processor information Main Displays processor and memory configuration Configuration Performance Configures advanced features available through the chipset Configures Memory, Bus and Processor overrides Security Sets passwords and security features Power Configures power management features and power supply controls Boot Selects boot options Exit Saves or discards changes to Setup program options
Table 33 lists the function keys available for menu screens. Table 33. BIOS Setup Program Function Keys
BIOS Setup Program Function Key
<> or <> <> or <> <Tab> <Enter> <F9> <F10> <Esc>
Description
Selects a different menu screen (Moves the cursor left or right) Selects an item (Moves the cursor up or down) Selects sub-items within a field (i.e., date/time) Executes command or selects the submenu Load the default configuration values for the current menu Save the current values and exits the BIOS Setup program Exits the menu
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3.2
System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information: BIOS data, such as the BIOS revision level Fixed-system data, such as peripherals, serial numbers, and asset tags Resource data, such as memory size, cache size, and processor speed Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page.
3.3
Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating systems USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2. POST begins. 3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu. 4. POST completes. 5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.) 6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used.
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3.4
BIOS Updates
Intel Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive. Intel Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB drive), or an optical drive. Intel F7 switch allows a user to select where the BIOS .bio file is located and perform the update from that location/device. Similar to performing a BIOS Recovery without removing the BIOS configuration jumper.
The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site:
Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
BIOS update utilities
Refer to
http://www.intel.com/support/motherboards/desktop/sb/CS022312.htm.
3.4.1
Language Support
The BIOS Setup program and help messages are supported in US English.
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3.4.2
Custom Splash Screen
During POST, an Intel splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrators Toolkit that is available from Intel can be used to create a custom splash screen.
Intel Integrator Toolkit Additional Intel software tools
Refer to
http://developer.intel.com/design/motherbd/software/itk/ http://developer.intel.com/products/motherboard/DH61DL/ tools.htm and http://developer.intel.com/design/motherbd/software.htm
3.5
BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 34 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable however, it must contain the motherboard .bio file at the root level. Table 34. Acceptable Drives/Media Types for BIOS Recovery
Media Type
Optical drive connected to the SATA interface USB removable drive (a USB Flash Drive, for example) USB diskette drive (with a 1.44 MB diskette) USB hard disk drive Legacy diskette drive (with a 1.44 MB diskette) connected to the legacy diskette drive interface
Can be used for BIOS recovery?

Yes Yes No No No

BIOS recovery
Refer to
http://www.intel.com/support/motherboards/desktop/sb /cs-023360.htm
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3.6
Boot Options
In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.
3.6.1
Optical Drive Boot
Booting from the optical drive is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the optical drive is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the optical drive, the system will attempt to boot from the next defined drive.
3.6.2
Network Boot
The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed. Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.
3.6.3
Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present: Video adapter Keyboard Mouse
3.6.4
Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices. Table 35 lists the boot device menu options. Table 35. Boot Device Menu Options
Boot Device Menu Function Keys
<> or <> <Enter> <Esc>
Description
Selects a default boot device Exits the menu, and boots from the selected device Exits the menu and boots according to the boot priority defined through BIOS setup
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4
4.1
Error Messages and Beep Codes

Speaker
The board-mounted piezoelectric speaker provides audible error code (beep code) information during POST.
The location of the onboard speaker
Refer to
Figure 1, page 13
4.2
BIOS Beep Codes
Whenever a recoverable error occurs during POST, the BIOS causes the boards piezoelectric speaker to beep an error message describing the problem (see Table 36). Table 36. BIOS Beep Codes
Type
F2 Setup/F10 Boot Menu Prompt Video error (no add-in graphics card installed)
Pattern
One 0.5 second beep when BIOS is ready to accept keyboard input On-off (1.0 2.5-second (beeps and continue to second each) two times, then pause (off), entire pattern repeats pause) once and the BIOS will boot.
Frequency/Comments
932 Hz
BIOS update in progress None 932 Hz For processors requiring an add-in graphics card 932 Hz
Memory error
On-off (1.0 second each) three times, then 2.5-second pause (off), entire pattern repeats (beeps and pause) until the system is powered off. Alternate high and low beeps (1.0 second each) for eight beeps, followed by system shut down.
Thermal trip warning
High beep 2000 Hz Low beep 1500 Hz
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4.3
Front-panel Power LED Blink Codes
Whenever a recoverable error occurs during POST, the BIOS causes the boards front panel power LED to blink an error message describing the problem (see Table 37). Table 37. Front-panel Power LED Blink Codes
Type
F2 Setup/F10 Boot Menu Prompt
Pattern
None
Note
BIOS update in progress Off when the update begins, then on for 0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete. Video error (no add-in graphics card installed) On-off (1.0 second each) two times, then 2.5-second pause (off), entire pattern repeats (blink and pause) until the system is powered off. On-off (1.0 second each) three times, then 2.5-second pause (off), entire pattern repeats (blinks and pause) until the system is powered off. Each beep will be accompanied by the following blink pattern: .25 seconds on, .25 seconds off, .25 seconds on, .25 seconds off. This will result in a total of 16 blinks. For processors requiring an add-in graphics card
Memory error
Thermal trip warning
4.4
BIOS Error Messages
Table 38 lists the error messages and provides a brief description of each. Table 38. BIOS Error Messages
Error Message
CMOS Battery Low CMOS Checksum Bad Memory Size Decreased No Boot Device Available
Explanation
The battery may be losing power. Replace the battery soon. The CMOS checksum is incorrect. CMOS memory may have been corrupted. Run Setup to reset values. Memory size has decreased since the last boot. If no memory was removed, then memory may be bad. System did not find a device to boot.
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4.5
Port 80h POST Codes
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a POST card that can interface with the Low Pin Count (LPC) Debug header. The POST card can decode the port and display the contents on a medium such as a seven-segment display. Refer to the location of the LPC Debug header in Figure 1. The following tables provide information about the POST codes generated by the BIOS: Table 39 lists the Port 80h POST code ranges Table 40 lists the Port 80h POST codes themselves Table 41 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal. Table 39. Port 80h POST Code Ranges
Range
0x00 0x05 0x10, 0x20, 0x30, 0x40, 0x50 0x08 0x0F 0x11 0x1F 0x21 0x29 0x2A 0x2F 0x31 0x35 0x36 0x3F 0x41 0x4F 0x50 0x5F 0x60 0x6F 0x70 0x7F 0x80 0x8F 0x90 0x9F 0xA0 0xAF 0xB0 0xBF 0xC0 0xCF 0xD0 0xDF 0xF0 0xFF
Subsystem
Entering SX states S0 to S5. Resuming from SX states. 0x10 0x20 S2, 0x30 S3, etc. Security (SEC) phase PEI phase pre MRC execution MRC memory detection PEI phase post MRC execution Recovery Platform DXE driver CPU Initialization (PEI, DXE, SMM) I/O buses: PCI, USB, ATA, etc. 0x5F is an unrecoverable error. Start with PCI. BDS Output devices: All output consoles. For future use Input devices: Keyboard/Mouse. For future use Boot Devices: Includes fixed media and removable media. Not that critical since consoles should be up at this point. For future use For future use
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Table 40. Port 80h POST Codes

Port 80 Code
0x00,0x01,0x02,0x03,0x04,0x05 0x10,0x20,0x30,0x40,0x50 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F
Progress Code Enumeration

ACPI S States Entering S0, S2, S3, S4, or S5 state Resuming from S2, S3, S4, S5 Security Phase (SEC) Starting BIOS execution after CPU BIST SPI prefetching and caching Load BSP microcode Load APs microcodes Platform program baseaddresses Wake Up All APs Initialize NEM Pass entry point of the PEI core PEI before MRC PEI Platform driver
0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1A 0x1B 0x1C 0x21 0x23 0x24 0x27 0x28 0x29 0x2A 0x2B
Set bootmode, GPIO init Early chipset register programming including graphics init Basic PCH init, discrete device init (1394, SATA) LAN init Exit early platform init driver PEI SMBUS SMBUSriver init Entry to SMBUS execute read/write Exit SMBUS execute read/write PEI CK505 Clock Programming Entry to CK505 programming Exit CK505 programming PEI Over-Clock Programming Entry to entry to PEI over-clock programming Exit PEI over-clock programming Memory MRC entry point Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Exit MRC driver PEI after MRC Start to Program MTRR Settings Done Programming MTRR Settings
continued
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Table 40. Port 80h POST Codes (continued)

Port 80 Code
0x31 0x33 0x34

PEIMs/Recovery Crisis Recovery has initiated Loading recovery capsule Start recovery capsule / valid capsule is found CPU Initialization CPU PEI Phase
0x41 0x42 0x43 0x44 0x45 0x46 0x47 0x48 0x49 0x4A 0x4B 0x4C 0x4D 0x4E 0x4F 0x50 0x51 0x52 0x58 0x59 0x5A 0x5B
Begin CPU PEI Init XMM instruction enabling End CPU PEI Init CPU PEI SMM Phase Begin CPU SMM Init smm relocate bases Smm relocate bases for APs End CPU SMM Init CPU DXE Phase CPU DXE Phase begin Refresh memory space attributes according to MTRRs Load the microcode if needed Initialize strings to HII database Initialize MP support CPU DXE Phase End CPU DXE SMM Phase CPU DXE SMM Phase begin Relocate SM bases for all APs CPU DXE SMM Phase end I/O Buses Enumerating PCI buses Allocating resources to PCI bus Hot Plug PCI controller initialization USB Resetting USB bus Reserved for USB ATA/ATAPI/SATA Resetting PATA/SATA bus and all devices Reserved for ATA
continued
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Port 80 Code
0x60 0x61 0x62 0x63 0x64 0x65 0x66 0x67 0x68 0x69 0x6A 0x6B 0x6C 0x6D 0x6E 0x6F 0x90 0x91 0x92 0x93 0x94 0x95 0x98 0x99 0x9A 0x9B 0xB0 0xB1 0xB2 0xB3

BDS BDS driver entry point initialize BDS service routine entry point (can be called multiple times) BDS Step2 BDS Step3 BDS Step4 BDS Step5 BDS Step6 BDS Step7 BDS Step8 BDS Step9 BDS Step10 BDS Step11 BDS Step12 BDS Step13 BDS Step14 BDS return to DXE core (should not get here) Keyboard (PS/2 or USB) Resetting keyboard Disabling the keyboard Detecting the presence of the keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS/2 only) Mouse (PS/2 or USB) Resetting mouse Detecting mouse Detecting presence of mouse Enabling mouse Fixed Media Resetting fixed media Disabling fixed media Detecting presence of a fixed media (IDE hard drive detection, etc.) Enabling/configuring a fixed media
continued
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Port 80 Code
0xB8 0xB9 0xBA 0xBB 0xE4 0xE7 0xE8 0xE9 0xEB 0xF8 0xF9

Removable Media Resetting removable media Disabling removable media Detecting presence of a removable media (IDE, CDROM detection etc.) Enabling/configuring a removable media DXE Core Entered DXE phase BDS Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot EFI boot service ExitBootServices( ) has been called EFI runtime service SetVirtualAddressMap( ) has been called
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Table 41. Typical Port 80h POST Sequence

POST Code
21 22 23 25 28 34 E4 12 13 50 51 92 90 94 95 EB 58 5A 92 90 94 5A 28 90 94 E7 01 00
Description
Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase Starting application processor initialization SMM initialization Enumerating PCI buses Allocating resourced to PCI bus Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Keyboard Self Test Calling Video BIOS Resetting USB bus Resetting PATA/SATA bus and all devices Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Resetting PATA/SATA bus and all devices Testing memory Resetting keyboard Clearing keyboard input buffer Waiting for user input INT 19 Ready to boot
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Regulatory Compliance and Battery Disposal Information

Regulatory Compliance
Safety standards European Union Declaration of Conformity statement Product Ecology statements Electromagnetic Compatibility (EMC) standards Product certification markings
5.1

This section contains the following regulatory compliance information for Intel Desktop Board DH61DL:
5.1.1
Safety Standards
The Intel Desktop Board DH61DL complies with the safety standards stated in Table 42 when correctly installed in a compatible host system. Table 42. Safety Standards
Standard
CSA/UL 60950-1 EN 60950-1 IEC 60950-1
Title
Information Technology Equipment Safety - Part 1: General Requirements (USA and Canada) Information Technology Equipment Safety - Part 1: General Requirements (European Union) Information Technology Equipment Safety - Part 1: General Requirements (International)
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5.1.2
European Union Declaration of Conformity Statement
We, Intel Corporation, declare under our sole responsibility that the product Intel Desktop Board DH61DL is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive). The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC, 2006/95/EC, and 2002/95/EC. etina Tento vrobek odpovd poadavkm evropskch smrnic 2004/108/EC, 2006/95/EC a 2002/95/EC. Dansk Dette produkt er i overensstemmelse med det europiske direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC. Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC, 2006/95/EC & 2002/95/EC. Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja 2002/95/EC kehtestatud nuetele. Suomi Tm tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC mryksi. Franais Ce produit est conforme aux exigences de la Directive Europenne 2004/108/EC, 2006/95/EC & 2002/95/EC. Deutsch Dieses Produkt entspricht den Bestimmungen der Europischen Richtlinie 2004/108/EC, 2006/95/EC & 2002/95/EC. 2004/108/EC, 2006/95/EC 2002/95/EC. Magyar E termk megfelel a 2004/108/EC, 2006/95/EC s 2002/95/EC Eurpai Irnyelv elrsainak. Icelandic essi vara stenst regluger Evrpska Efnahags Bandalagsins nmer 2004/108/EC, 2006/95/EC, & 2002/95/EC. Italiano Questo prodotto conforme alla Direttiva Europea 2004/108/EC, 2006/95/EC & 2002/95/EC. Latvieu is produkts atbilst Eiropas Direktvu 2004/108/EC, 2006/95/EC un 2002/95/EC noteikumiem. Lietuvi is produktas atitinka Europos direktyv 2004/108/EC, 2006/95/EC, ir 2002/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC, 2006/95/EC u 2002/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/EC, 2006/95/EC & 2002/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC, 206/95/EC i 2002/95/EC.
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Portuguese Este produto cumpre com as normas da Diretiva Europia 2004/108/EC, 2006/95/EC & 2002/95/EC. Espaol Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC. Slovensky Tento produkt je v slade s ustanoveniami eurpskych direktv 2004/108/EC, 2006/95/EC a 2002/95/EC. Slovenina Izdelek je skladen z dolobami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC. Trke Bu rn, Avrupa Birliinin 2004/108/EC, 2006/95/EC ve 2002/95/EC ynergelerine uyar.
5.1.3
Product Ecology Statements
The following information is provided to address worldwide product ecology concerns and regulations.
5.1.3.1
Disposal Considerations
This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly.
5.1.3.2
Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intels branded products to return used products to selected locations for proper recycling. Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc. Intel Product Recycling Program http://www.intel.com/intel/other/ehs/product_ecology Deutsch Als Teil von Intels Engagement fr den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermglicht, gebrauchte Produkte an ausgewhlte Standorte fr ordnungsgemes Recycling zurckzugeben. Details zu diesem Programm, einschlielich der darin eingeschlossenen Produkte, verfgbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der http://www.intel.com/intel/other/ehs/product_ecology
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Espaol Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envo, trminos y condiciones, etc. Franais Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en uvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits uss en les retournant des adresses spcifies. Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, savoir les produits concerns, les adresses disponibles, les instructions d'expdition, les conditions gnrales, etc. http://www.intel.com/in tel/other/ehs/product_ecology Malay Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul. Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb. Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos so reciclados de maneira adequada. Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Ingls) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponveis, as instrues de envio, os termos e condies, etc.
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Russian , Intel Intel (Product Recycling Program) Intel . , - http://www.intel.com/intel/other/ehs/product_ecology , , , , .. Trke Intel, evre sorumluluuna bamllnn bir paras olarak, perakende tketicilerin Intel markal kullanlm rnlerini belirlenmi merkezlere iade edip uygun ekilde geri dntrmesini amalayan Intel rnleri Geri Dnm Programn uygulamaya koymutur. Bu programn rn kapsam, rn iade merkezleri, nakliye talimatlar, kaytlar ve artlar v.s dahil btn ayrntlarn grenmek iin ltfen http://www.intel.com/intel/other/ehs/product_ecology Web sayfasna gidin.
5.1.4
EMC Regulations
The Intel Desktop Board DH61DL complies with the EMC regulations stated in Table 43 when correctly installed in a compatible host system. Table 43. EMC Regulations
Regulation
FCC 47 CFR Part 15, Subpart B ICES-003 EN55022 EN55024 EN55022 CISPR 22 CISPR 24 VCCI V-3, V-4 KN-22, KN-24 CNS 13438
Title
Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio Frequency Devices. (USA) Interference-Causing Equipment Standard, Digital Apparatus. (Canada) Limits and methods of measurement of Radio Interference Characteristics of Information Technology Equipment. (European Union) Information Technology Equipment Immunity Characteristics Limits and methods of measurement. (European Union) Australian Communications Authority, Standard for Electromagnetic Compatibility. (Australia and New Zealand) Limits and methods of measurement of Radio Disturbance Characteristics of Information Technology Equipment. (International) Information Technology Equipment Immunity Characteristics Limits and Methods of Measurement. (International) Voluntary Control for Interference by Information Technology Equipment. (Japan) Korean Communications Commission Framework Act on Telecommunications and Radio Waves Act (South Korea) Bureau of Standards, Metrology, and Inspection (Taiwan)
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FCC Declaration of Conformity This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124 1-800-628-8686 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver. Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications to the equipment not expressly approved by Intel Corporation could void the users authority to operate the equipment. Tested to comply with FCC standards for home or office use. Canadian Department of Communications Compliance Statement This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications. Le prsent appareil numerique nmet pas de bruits radiolectriques dpassant les limites applicables aux appareils numriques de la classe B prescrites dans le Rglement sur le broullage radiolectrique dict par le ministre des Communications du Canada.
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Japan VCCI Statement Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.
Korea Class B Statement Korea Class B Statement translation: This equipment is for home use, and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas..
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5.1.5
ENERGY STAR* 5.0, e-Standby, and ErP Compliance
The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements. Intel Desktop Board DH61DL meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply: Energy Star v5.0, category A EPEAT* Korea e-Standby European Union Energy-related Products Directive 2009 (ErP)
Refer to
http://www.intel.com/go/energystar http://www.epeat.net/ http://www.kemco.or.kr/new_eng/pg02 /pg02100300.asp http://ec.europa.eu/enterprise/policies/s ustainable-business/sustainableproduct-policy/ecodesign/index_en.htm

ENERGY STAR requirements and recommended configurations Electronic Product Environmental Assessment Tool (EPEAT) Korea e-Standby Program European Union Energy-related Products Directive 2009 (ErP)
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5.1.6
Regulatory Compliance Marks (Board Level)
Intel Desktop Board DH61DL has the regulatory compliance marks shown in Table 44. Table 44. Regulatory Compliance Marks
Description
UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment.
Mark
CE mark. Declaring compliance to the European Union (EU) EMC directive, Low Voltage directive, and RoHS directive.
Australian Communications Authority (ACA) and New Zealand Radio Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code number, N-232. Japan VCCI (Voluntary Control Council for Interference) mark.
Korea Certification mark. Includes an adjacent KCC (Korean Communications Commission) certification number: KCC-REM-CPU-DH61DL Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025. Printed wiring board manufacturers recognition mark. Consists of a unique UL recognized manufacturers logo, along with a flammability rating (solder side). China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined to be 10 years. V-0
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5.2
Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.
PRCAUTION
Risque d'explosion si la pile usage est remplace par une pile de type incorrect. Les piles usages doivent tre recycles dans la mesure du possible. La mise au rebut des piles usages doit respecter les rglementations locales en vigueur en matire de protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier br om muligt genbruges. Bortskaffelse af brugte batterier br foreg i overensstemmelse med gldende miljlovgivning.
OBS!
Det kan oppst eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier br kastes i henhold til gjeldende miljlovgivning.
VIKTIGT!
Risk fr explosion om batteriet erstts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljvrdsbestmmelserna.
VARO
Rjhdysvaara, jos pariston tyyppi on vr. Paristot on kierrtettv, jos se on mahdollista. Kytetyt paristot on hvitettv paikallisten ympristmrysten mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.
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PRECAUCIN
Existe peligro de explosin si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENO
Haver risco de exploso se a bateria for substituda por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminao de baterias usadas deve ser feita de acordo com as regulamentaes ambientais da regio.
ACIAROZNA
, . , , . .
UPOZORNN
V ppad vmny baterie za nesprvn druh me dojt k vbuchu. Je-li to mon, baterie by mly bt recyklovny. Baterie je teba zlikvidovat v souladu s mstnmi pedpisy o ivotnm prosted.
. . .
VIGYZAT
Ha a telepet nem a megfelel tpus telepre cserli, az felrobbanhat. A telepeket lehetsg szerint jra kell hasznostani. A hasznlt telepeket a helyi krnyezetvdelmi elrsoknak megfelelen kell kiselejtezni.
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AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.
OSTRZEENIE
Istnieje niebezpieczestwo wybuchu w przypadku zastosowania niewaciwego typu baterii. Zuyte baterie naley w miar moliwoci utylizowa zgodnie z odpowiednimi przepisami ochrony rodowiska.
PRECAUIE
Risc de explozie, dac bateria este nlocuit cu un tip de baterie necorespunztor. Bateriile trebuie reciclate, dac este posibil. Depozitarea bateriilor uzate trebuie s respecte reglementrile locale privind protecia mediului.
. . , .
UPOZORNENIE
Ak batriu vymente za nesprvny typ, hroz nebezpeenstvo jej vbuchu. Batrie by sa mali poda monosti vdy recyklova. Likvidcia pouitch batri sa mus vykonva v slade s miestnymi predpismi na ochranu ivotnho prostredia.
POZOR
Zamenjava baterije z baterijo druganega tipa lahko povzroi eksplozijo. e je mogoe, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi.
UYARI
Yanl trde pil takldnda patlama riski vardr. Piller mmkn olduunda geri dntrlmelidir. Kullanlm piller, yerel evre yasalarna uygun olarak atlmaldr.
O
, . , . , .
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Intel Desktop Board DH61DL

Technical Product Specification

October 2012 Part Number: G23559-006

Board Identification Information

Specification Changes or Clarifications

Description of Change or Clarification

March 2012 June 2012 October 2012

Spec Clarification Spec Clarification Spec Clarification

What This Document Contains

Notes, Cautions, and Warnings

Intel Desktop Board DH61DL Technical Product Specification

Other Common Notation

Intel Desktop Board DH61DL Technical Product Specification

3 Overview of BIOS Features

4 Error Messages and Beep Codes

5 Regulatory Compliance and Battery Disposal Information

Intel Desktop Board DH61DL Technical Product Specification

Intel Desktop Board DH61DL Technical Product Specification

Table 1. Feature Summary (continued)

Intel Desktop Board DH61DL Technical Product Specification

Table 2. Components Shown in Figure 1

Figure 2 is a block diagram of the major functional areas of the board.

Figure 2. Block Diagram

Intel Desktop Board DH61DL Technical Product Specification

Visit this World Wide Web site:

Intel H61 Express Chipset

Intel Desktop Board DH61DL Technical Product Specification

For information about

For information about

Figure 3 illustrates the memory channel and DIMM configuration.

Figure 3. Memory Channel and DIMM Configuration

Intel Desktop Board DH61DL Technical Product Specification

Analog Display (VGA)

Digital Visual Interface (DVI-D)

The board supports external graphics via a PCI Express x1 connector.

Intel Desktop Board DH61DL Technical Product Specification

1.10 Legacy I/O Controller

1.11 Audio Subsystem

Intel Desktop Board DH61DL Technical Product Specification

Audio Subsystem Software

Audio Headers and Connectors

For information about

Analog Audio Connectors

Internal Mono Speaker Header

Intel Desktop Board DH61DL Technical Product Specification

1.12 LAN Subsystem

For information about

Intel 82579V Gigabit Ethernet Controller

LAN Subsystem Software

RJ-45 LAN Connector with Integrated LEDs

Intel Desktop Board DH61DL Technical Product Specification

1.13 Real-Time Clock Subsystem

1.14 Thermal Monitoring

Figure 6. Thermal Sensors and Fan Headers

Intel Desktop Board DH61DL Technical Product Specification

1.15 Platform Management and Security

Hardware Management Subsystem

Chassis Intrusion and Detection

1.16 Power Management