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Alcatel-Lucent 1696MSPAN
32 + 32 CHANNELS DWDM SYSTEM

& COMPACT SHELF | 1696MSPAN REL.3.4

TECHNICAL HANDBOOK
ALCATEL-LUCENT PROPRIETARY
This document contains proprietary information of Alcatel-Lucent and
is not to be disclosed or used except in accordance with applicable
agreements.

8DG-17561-AAAA
ISSUE 21
JUNEMARCH
2008

Alcatel-Lucent Proprietary
See notice on first page
Alcatel, Lucent, Alcatel-Lucent and the Alcatel-Lucent logo are trademarks of Alcatel-Lucent. All other trademarks are the property of their
respective owners.
The information presented is subject to change without notice. Alcatel-Lucent assumes no responsibility for inaccuracies contained herein.
Copyright 2008 Alcatel-Lucent. All Rights Reserved.

8DG-17561-AAAA Alcatel-Lucent Proprietary iii
Issue 21, JuneMarch 2008 See notice on first page
Table of content

ABOUT THIS DOCUMENT ............................................................................................................................ XXXII
Purpose ................................................................................................................................................................................ xxxii
Handbook applicability ..................................................................................................................................................... xxxiii
Productrelease handbooks ............................................................................................................................................... xxxiii
Handbook Structure ..................................................................................................................................... xxxvii
Handbook configuration check ................................................................................... xxxviii
List of the editions and modified parts ........................................................................................................................... xxxviii
Notes on Ed.01 ....................................................................................................................................................................xxxix
Notes on Ed.02 ....................................................................................................................................................................xxxix
Safety information ..............................................................................................................................................................xxxix
How to comment .................................................................................................................................................................xxxix
PART I: HANDBOOK GUIDE ......................................................................................................................I-1
1 SAFETY NORMS AND LABELS ............................................................................................................... I-1
Purpose .................................................................................................................................................................................... I-1
Contents ................................................................................................................................................................................... I-1
Structure of hazard statements .......................................................................................................................... I-2
Overview ................................................................................................................................................................................. I-2
General structure ..................................................................................................................................................................... I-2
Signal words ............................................................................................................................................................................ I-3
Safety Rules ....................................................................................................................................................... I-6
General Rules .......................................................................................................................................................................... I-6
Labels Indicating Danger, Forbiddance, Command ............................................................................................................. I-7
Dangerous Electrical Voltages ............................................................................................................................................... I-8
Harmful Optical Signals ....................................................................................................................................................... I-10
Risks of Explosions .............................................................................................................................................................. I-13
Moving Mechanical Parts ..................................................................................................................................................... I-13
Heat-radiating Mechanical Parts .......................................................................................................................................... I-14
Specific safety rules in this handbook ................................................................................................................................. I-15
2 OTHER NORMS AND LABELS .............................................................................................................. I-16
Purpose .................................................................................................................................................................................. I-16
Contents ................................................................................................................................................................................. I-16
Electromagnetic Compatibility ....................................................................................................................... I-17
General Norms - Installation ................................................................................................................................................ I-17
General Norms Maintenance ............................................................................................................................................ I-18
Electrostatic Dischargers (ESD) ..................................................................................................................... I-19
Suggestions, notes and cautions ...................................................................................................................... I-20
Labels affixed to the Equipment ...................................................................................................................... I-20
3 GENERAL ON ALCATEL-LUCENT CUSTOMER DOCUMENTATION ............................................. I-33
Purpose .................................................................................................................................................................................. I-33
Contents ................................................................................................................................................................................. I-33
Products, productreleases, versions and Customer Documentation ............................................................. I-34
Handbook supply to Customers ....................................................................................................................... I-34
Aims of standard Customer Documentation ................................................................................................... I-34
Handbook Updating ........................................................................................................................................ I-36
Changes introduced in the same productrelease (same handbook P/N) .......................................................................... I-36
Changes due to a new productrelease ................................................................................................................................ I-37
Customer documentation supply on CD-ROM ................................................................................................ I-38

iv Alcatel-Lucent Proprietary 8DG-17561-AAAA
See notice on first page Issue 21, JuneMarch 2008
Contents, creation and production of a CD-ROM .............................................................................................................. I-38
Use of the CD-ROM ............................................................................................................................................................. I-38
CD-ROM identification ........................................................................................................................................................ I-39
CD-ROM updating ............................................................................................................................................................... I-39
PART II: DESCRIPTIONS .......................................................................................................................... II-40
4 FUNCTIONAL DESIGN ......................................................................................................................... II-41
Purpose ................................................................................................................................................................................. II-41
Contents ................................................................................................................................................................................ II-41
Equipment basic configurations .................................................................................................................... II-46
Line terminal ........................................................................................................................................................................ II-46
Booster + Pre-amplifier Line terminal ............................................................................................................................... II-50
Optical Add and Drop Multiplexer (OADM) or back-to-back terminal (hub) ................................................................ II-51
OADM or back-to-back terminal (hub) repeater ............................................................................................................... II-55
In line repeater ..................................................................................................................................................................... II-57
Customer Premises Equipment (CPE)................................................................................................................................ II-57
Network architectures ................................................................................................................................... II-58
Point-to-point links .............................................................................................................................................................. II-58
Ring networks ...................................................................................................................................................................... II-58
Ring interconnection (with or without protection) ............................................................................................................ II-59
CPE configurations .............................................................................................................................................................. II-61
Interworking with other Alcatel-Lucent NEs ..................................................................................................................... II-62
2xGbE_FC ............................................................................................................................................................................ II-62
Host systems (ADM..) ......................................................................................................................................................... II-65
Protection scenario ....................................................................................................................................... II-67
O-SNCP ................................................................................................................................................................................ II-67
Optical Transmission Section Protection ........................................................................................................................... II-68
5 PHYSICAL CONFIGURATION ............................................................................................................. II-70
Purpose ................................................................................................................................................................................. II-70
Contents ................................................................................................................................................................................ II-70
Rack design ................................................................................................................................................... II-72
1696MS shelf physical configuration ............................................................................................................ II-74
1696MS Empty shelf ........................................................................................................................................................... II-74
1696MS Shelf configuration rules ...................................................................................................................................... II-76
1696MS Part list .................................................................................................................................................................. II-79
1696MS shelf front view ................................................................................................................................................... II-110
1696MS_C (compact shelf) physical configuration .................................................................................... II-111
1696MS_C Empty shelf .................................................................................................................................................... II-113
1696MS_C Shelf configuration rules ............................................................................................................................... II-115
1696MS_C Part list............................................................................................................................................................ II-118
Equipment connections ............................................................................................................................... II-148
Optical connections ........................................................................................................................................................... II-148
Management and maintenance connections ..................................................................................................................... II-150
Power supply connections ................................................................................................................................................. II-151
User interfaces.................................................................................................................................................................... II-151
Units front view ........................................................................................................................................... II-152
Tributaries front view ........................................................................................................................................................ II-153
Multiplexers front view ..................................................................................................................................................... II-167
Optical amplifiers front view ............................................................................................................................................ II-182
Controllers front view ........................................................................................................................................................ II-183
Switching protection, power supply and fans front view ................................................................................................ II-195
6 FUNCTIONAL DESCRIPTION ............................................................................................................ II-200
Purpose ............................................................................................................................................................................... II-200
Contents .............................................................................................................................................................................. II-200
Transponder sub-system .................................................................................................................................................... II-205
8DG-17561-AAAA Alcatel_lucent Proprietary v
TDM client signal concentrator sub-system .................................................................................................................... II-215
Ethernet concentrator sub-system ..................................................................................................................................... II-218
Wavelength Division Multiplexing sub-system............................................................................................................... II-220
Optical Fiber Amplification sub-system .......................................................................................................................... II-229
Optical supervisory channel (OSC) sub-system .............................................................................................................. II-231
Automatic Power Equalization (APE) subsystem ........................................................................................................... II-234
Controller sub-system ........................................................................................................................................................ II-235
Protection sub-system ........................................................................................................................................................ II-246
Performance Monitoring sub-system................................................................................................................................ II-266
Configuration criteria ........................................................................................................................................................ II-278
1696MS (main shelf) configurations examples ............................................................................................................... II-282
1696 MS_C (Compact Shelf) configurations examples ....................................................................................... II-353II-355
1696MS configured to connect a CPE .................................................................................................................. II-382II-384
Two 1696MS or 1696MS_C rings connected together ........................................................................................ II-388II-390
7 UNITS DESCRIPTION ................................................................................................................II-393II-395
Purpose .................................................................................................................................................................... II-393II-395
Contents ................................................................................................................................................................... II-393II-395
Tranponders tributaries ..................................................................................................................II-395II-397
Multirate Channel Card III (MCC3) ...................................................................................................................... II-395II-397
10 Gbps Optical Channel Card Enhanced (OCC10_E) ........................................................................................ II-414II-416
10 Gbps Optical Channel Card for CWDM (OCC10_EC) .................................................................................. II-428II-430
Wavelength adapter 1 and 2 (WLA1C, WLA2M) ............................................................................................... II-429II-431
Wavelength adapter 3 (WLA3CD) ........................................................................................................................ II-450II-452
Wavelength adapter 2 with O-SNCP (WLA2M_OP) .......................................................................................... II-455II-457
Wavelength adapter 3 with O-SNCP (WLA3CDOP) .......................................................................................... II-468II-470
4xANY_P ................................................................................................................................................................ II-473II-475
2xGE_FC ................................................................................................................................................................. II-478II-480
8xGbE concentrator (8xGE) .................................................................................................................................. II-485II-487
Small Formfactor Pluggable (SFP) optical modules ............................................................................................ II-495II-497
XFP optical modules .............................................................................................................................................. II-498II-500
Multiple Variable Attenuator Cards...................................................................................................II-500II-502
Multiple Variable Attenuator Card (MVAC) ........................................................................................................ II-500II-502
Multiple Variable Attenuator Card (MVAC10) ................................................................................................... II-503II-506
Multiplexers .......................................................................................................................................II-508II-513
DWDM mux/demux : OMDX units ...................................................................................................................... II-508II-513
8-channel CWDM mux/demux: CMDX-U, CMDX-U-S, CMDX2-U, CMDX2-U-S ...................................... II-515II-520
8-channel CWDM/DWDM mux/demux: CDMDX2-U and CDMDX2-U-S ..................................................... II-516II-521
DWDM OADM units ............................................................................................................................................. II-518II-523
CWDM OADM units ............................................................................................................................................. II-526II-531
SPV_F_1310_1550 ................................................................................................................................................. II-532II-537
SPV_F_C ................................................................................................................................................................. II-534II-539
F1310 ....................................................................................................................................................................... II-535II-540
Description .............................................................................................................................................................. II-537II-542
Way of working ...................................................................................................................................................... II-541II-546
Optical characteristics............................................................................................................................................. II-545II-550
Optical safety .......................................................................................................................................................... II-545II-550
Controller ...........................................................................................................................................II-546II-551
ESC board ............................................................................................................................................................... II-546II-551
Supervision units (SPVM2, SPVM3, SPVM_H, SPVM3_H) ............................................................................. II-547II-552
Optical Supervisory Card (OSC) ........................................................................................................................... II-551II-556
EBRIDGE board ..................................................................................................................................................... II-555II-560
Optical Spectrum Monitoring Card (OSMC) ........................................................................................................ II-555II-560
1696MS_C Master Intershelf Link (I-LINK_M) .................................................................................................. II-557II-563
1696MS_C Slave Intershelf Link (I-LINK_S) ..................................................................................................... II-559II-564
LAN board............................................................................................................................................................... II-562II-568
HouseKeeping board (HK)..................................................................................................................................... II-564II-570

vi Alcatel-Lucent Proprietary 8DG-17561-AAAA
Rack Alarm Interface (RAI)................................................................................................................................... II-565II-571
User Interfaces Card (UIC) .................................................................................................................................... II-568II-574
Switching Protection (OPC) ...............................................................................................................II-569II-575
Single and Multi Mode Optical Protection Cards ................................................................................................. II-569II-575
Optical Multiplex Section Protection: OMSP unit ............................................................................................... II-572II-578
Power Supply Card (PSC/PSC3) .......................................................................................................II-575II-581
Power Supply Card (PSC2)................................................................................................................II-575II-581
Power Management Unit (PMU) .......................................................................................................II-576II-582
Batteries for PMU ................................................................................................................................................... II-578II-584
FANS unit ...........................................................................................................................................II-581II-587
FANC unit for 1696MS shelf ................................................................................................................................. II-581II-587
FAN_C unit for 1696MS_C shelf .......................................................................................................................... II-582II-588
8 TECHNICAL SPECIFICATIONS ................................................................................................II-584II-590
Purpose .................................................................................................................................................................... II-584II-590
Contents ................................................................................................................................................................... II-584II-590
Main system characteristics ................................................................................................................................... II-585II-591
Electrical safety ....................................................................................................................................................... II-596II-602
Electrical Safety compliance with standardized Norms ....................................................................................... II-596II-602
Optical safety .......................................................................................................................................................... II-597II-603
Tributaries optical characteristics .......................................................................................................................... II-608II-614
Multiple Variable Attenuator Cards (MVAC) optical characteristics ................................................................. II-652II-658
DWDM Mux/Demux units (OMDX) optical characteristics ............................................................................... II-654II-660
8-channel CWDM Mux/Demux optical characteristics: CMDX-U(-S), CMDX2-U(-S) .................................. II-659II-665
C/DWDM Mux/Demux units (CDMDX2-U and CDMDX2-U-S) optical characteristics ................................ II-660II-666
DWDM OADM units optical characteristics ........................................................................................................ II-661II-667
CWDM OADM units optical characteristics ........................................................................................................ II-671II-677
Mux/Demux 1310-1550 + supervision unit optical characteristics ..................................................................... II-673II-679
SPV_F_C unit optical characteristics .................................................................................................................... II-674II-680
F1310 unit optical characteristics .......................................................................................................................... II-676II-682
Optical Amplifier Card (OAC) optical characteristics ......................................................................................... II-677II-683
SPV-M + OW (SPVM2) and SPVM_H optical characteristics .......................................................................... II-678II-684
Optical Supervisory Channel (OSC) board optical characteristics ...................................................................... II-679II-685
OSMC optical characteristics ................................................................................................................................. II-679II-685
Optical Protection Cards (OPC) optical characteristics ....................................................................................... II-680II-686
OMSP optical characteristics ................................................................................................................................. II-681II-687
Equipment domain alarms ...................................................................................................................................... II-685II-691
Optical transmission domain alarms...................................................................................................................... II-717II-723
Power supply characteristics .............................................................................................................II-740II-746
Power consumption ................................................................................................................................................ II-740II-746
Maximum power consumption of boards and units ............................................................................................. II-740II-746
Mechanical characteristics ................................................................................................................II-743II-749
Maximum weight of the boards and units ............................................................................................................. II-744II-750
Environmental characteristics ...........................................................................................................II-745II-751
Electromagnetic Compatibility (EMC) norms: ETSI compliancy ...................................................................... II-746II-752
Electromagnetic Compatibility (EMC) norms: ANSI compliancy ..................................................................... II-746II-752
Electromagnetic Compatibility (EMC) condition................................................................................................. II-746II-752
Waste from Electrical and Electronic Equipment (WEEE) ................................................................................ II-747II-753
Acoustical noise ...................................................................................................................................................... II-747II-753
Environmental constraints ...................................................................................................................................... II-747II-753
9 HARDWARE SETTINGS ............................................................................................................II-755II-761
Purpose .................................................................................................................................................................... II-755II-761
Contents ................................................................................................................................................................... II-755II-761
ESC Presetting table ............................................................................................................................................... II-769II-776
PART III: MAINTENANCE ........................................................................................................... III-783III-791
8DG-17561-AAAA Alcatel_lucent Proprietary vii
10 MAINTENANCE ....................................................................................................................... III-785III-793
Purpose ................................................................................................................................................................. III-785III-793
Contents ................................................................................................................................................................ III-785III-793
General safety rules ............................................................................................................................................. III-786III-794
General rules ........................................................................................................................................................ III-787III-795
Maintenance aspects: definitions ........................................................................................................................ III-787III-795
Instruments And Accessories .............................................................................................................................. III-788III-796
Routine Maintenance every six months ............................................................................................................. III-790III-798
Routine Maintenance every year ........................................................................................................................ III-794III-802
Routine Maintenance every five years ............................................................................................................... III-794III-802
Fault location: alarm & status indication ........................................................................................................... III-797III-805
Suggested Spare Parts .......................................................................................................................................... III-800III-808
General rules on spare parts management .......................................................................................................... III-800III-808
Particular rules on spare parts management ....................................................................................................... III-800III-808
PART IV: DISMANTLING & RECYCLING ............................................................................... IV-803IV-811
11 DISMANTLING & RECYCLING ............................................................................................ IV-805IV-813
Purpose ................................................................................................................................................................. IV-805IV-813
Contents ................................................................................................................................................................ IV-805IV-813
Tools necessary for disassembly ......................................................................................................................... IV-807IV-815
Subrack disassembly ............................................................................................................................................ IV-808IV-816
Unit disassembly .................................................................................................................................................. IV-819IV-827
Hazardous materials and components ................................................................................................................ IV-834IV-842
12 LIST OF ABBREVIATIONS .................................................................................................... IV-840IV-848
ABOUT THIS DOCUMENT .................................................................................................................................. XX
Purpose ..................................................................................................................................................................................... xx
Handbook applicability ........................................................................................................................................................... xx
Productrelease handbooks .................................................................................................................................................... xxi
Handbook Structure ........................................................................................................................................ xxiv
Handbook configuration check ............................................................................................................................................. xxv
List of the editions and modified parts ................................................................................................................................. xxv
Notes on Ed.01 ...................................................................................................................................................................... xxvi
Notes on Ed.02 ...................................................................................................................................................................... xxvi
Safety information ................................................................................................................................................................ xxvi
How to comment ................................................................................................................................................................... xxvi
PART I: HANDBOOK GUIDE ......................................................................................................................I-1
1 SAFETY NORMS AND LABELS ............................................................................................................... I-1
Purpose .................................................................................................................................................................................... I-1
Contents ................................................................................................................................................................................... I-1
Structure of hazard statements .......................................................................................................................... I-2
Overview ................................................................................................................................................................................. I-2
General structure ..................................................................................................................................................................... I-2
Signal words ............................................................................................................................................................................ I-3
First aid for electric shock ................................................................................................................................ I-4
Safety Rules ....................................................................................................................................................... I-6
General Rules .......................................................................................................................................................................... I-6
Labels Indicating Danger, Forbiddance, Command ............................................................................................................. I-7
Dangerous Electrical Voltages ............................................................................................................................................... I-8
Harmful Optical Signals ....................................................................................................................................................... I-10
Risks of Explosions .............................................................................................................................................................. I-13
Moving Mechanical Parts ..................................................................................................................................................... I-13
Heat-radiating Mechanical Parts .......................................................................................................................................... I-14

viii Alcatel-Lucent Proprietary 8DG-17561-AAAA
Specific safety rules in this handbook ................................................................................................................................. I-15
2 OTHER NORMS AND LABELS .............................................................................................................. I-16
Purpose .................................................................................................................................................................................. I-16
Contents ................................................................................................................................................................................. I-16
Electromagnetic Compatibility ....................................................................................................................... I-17
General Norms - Installation ................................................................................................................................................ I-17
General Norms Maintenance ............................................................................................................................................ I-18
Electrostatic Dischargers (ESD) ..................................................................................................................... I-19
Suggestions, notes and cautions ...................................................................................................................... I-20
Labels affixed to the Equipment ...................................................................................................................... I-20
3 GENERAL ON ALCATEL-LUCENT CUSTOMER DOCUMENTATION ............................................. I-32
Purpose .................................................................................................................................................................................. I-32
Contents ................................................................................................................................................................................. I-32
Products, productreleases, versions and Customer Documentation ............................................................. I-33
Handbook supply to Customers ....................................................................................................................... I-33
Aims of standard Customer Documentation ................................................................................................... I-33
Handbook Updating ........................................................................................................................................ I-35
Changes introduced in the same productrelease (same handbook P/N) .......................................................................... I-35
Changes due to a new productrelease ................................................................................................................................ I-36
Customer documentation supply on CD-ROM ................................................................................................ I-37
Contents, creation and production of a CD-ROM .............................................................................................................. I-37
Use of the CD-ROM ............................................................................................................................................................. I-37
CD-ROM identification ........................................................................................................................................................ I-38
CD-ROM updating ............................................................................................................................................................... I-38
PART II: DESCRIPTIONS .......................................................................................................................... II-39
4 FUNCTIONAL DESIGN ......................................................................................................................... II-41
Purpose ................................................................................................................................................................................. II-41
Contents ................................................................................................................................................................................ II-41
Equipment basic configurations .................................................................................................................... II-46
Line terminal ........................................................................................................................................................................ II-46
Booster + Pre-amplifier Line terminal ............................................................................................................................... II-50
Optical Add and Drop Multiplexer (OADM) or back-to-back terminal (hub) ................................................................ II-51
OADM or back-to-back terminal (hub) repeater ............................................................................................................... II-55
In line repeater ..................................................................................................................................................................... II-57
Customer Premises Equipment (CPE)................................................................................................................................ II-57
Network architectures ................................................................................................................................... II-58
Point-to-point links .............................................................................................................................................................. II-58
Ring networks ...................................................................................................................................................................... II-58
Ring interconnection (with or without protection) ............................................................................................................ II-59
CPE configurations .............................................................................................................................................................. II-61
Interworking with other Alcatel-Lucent NEs ..................................................................................................................... II-62
2xGbE_FC ............................................................................................................................................................................ II-62
Host systems (ADM..) ......................................................................................................................................................... II-65
Protection scenario ....................................................................................................................................... II-67
O-SNCP ................................................................................................................................................................................ II-67
Optical Transmission Section Protection ........................................................................................................................... II-68
5 PHYSICAL CONFIGURATION ............................................................................................................. II-70
Purpose ................................................................................................................................................................................. II-70
Contents ................................................................................................................................................................................ II-70
Rack design ................................................................................................................................................... II-72
1696MS shelf physical configuration ............................................................................................................ II-74
1696MS Empty shelf ........................................................................................................................................................... II-74
1696MS Shelf configuration rules ...................................................................................................................................... II-76
8DG-17561-AAAA Alcatel_lucent Proprietary ix
1696MS Part list .................................................................................................................................................................. II-79
1696MS shelf front view ................................................................................................................................................... II-110
1696MS_C (compact shelf) physical configuration .................................................................................... II-111
1696MS_C Empty shelf .................................................................................................................................................... II-113
1696MS_C Shelf configuration rules ............................................................................................................................... II-115
1696MS_C Part list............................................................................................................................................................ II-118
Equipment connections ............................................................................................................................... II-148
Optical connections ........................................................................................................................................................... II-148
Management and maintenance connections ..................................................................................................................... II-150
Power supply connections ................................................................................................................................................. II-151
User interfaces.................................................................................................................................................................... II-151
Units front view ........................................................................................................................................... II-152
Tributaries front view ........................................................................................................................................................ II-153
Multiplexers front view ..................................................................................................................................................... II-165
Optical amplifiers front view ............................................................................................................................................ II-180
Controllers front view ........................................................................................................................................................ II-181
Switching protection, power supply and fans front view ................................................................................................ II-193
6 FUNCTIONAL DESCRIPTION ............................................................................................................ II-198
Purpose ............................................................................................................................................................................... II-198
Contents .............................................................................................................................................................................. II-198
General description ..................................................................................................................................... II-199
Transponder sub-system .................................................................................................................................................... II-203
TDM client signal concentrator sub-system .................................................................................................................... II-211
Ethernet concentrator sub-system ..................................................................................................................................... II-214
Wavelength Division Multiplexing sub-system............................................................................................................... II-216
Optical Fiber Amplification sub-system .......................................................................................................................... II-225
Optical supervisory channel (OSC) sub-system .............................................................................................................. II-227
Automatic Power Equalization (APE) subsystem ........................................................................................................... II-230
Controller sub-system ........................................................................................................................................................ II-231
Protection sub-system ........................................................................................................................................................ II-242
Performance Monitoring sub-system................................................................................................................................ II-260
System Configuration .................................................................................................................................. II-271
Configuration criteria ........................................................................................................................................................ II-271
1696MS (main shelf) configurations examples ............................................................................................................... II-274
1696 MS_C (Compact Shelf) configurations examples .................................................................................................. II-347
1696MS configured to connect a CPE ............................................................................................................................. II-370
Two 1696MS or 1696MS_C rings connected together ................................................................................................... II-376
7 UNITS DESCRIPTION ......................................................................................................................... II-381
Purpose ............................................................................................................................................................................... II-381
Contents .............................................................................................................................................................................. II-381
Tranponders tributaries ........................................................................................................................... II-383
Multirate Channel Card III (MCC3) ................................................................................................................................. II-383
10 Gbps Optical Channel Card Enhanced (OCC10_E) ................................................................................................... II-402
10 Gbps Optical Channel Card for CWDM (OCC10_EC) ............................................................................................. II-416
Wavelength adapter 1 and 2 (WLA1C, WLA2M) .......................................................................................................... II-417
Wavelength adapter 3 (WLA3CD) ................................................................................................................................... II-438
Wavelength adapter 2 with O-SNCP (WLA2M_OP) ..................................................................................................... II-443
Wavelength adapter 3 with O-SNCP (WLA3CDOP) ..................................................................................................... II-456
4xANY_P ........................................................................................................................................................................... II-461
2xGE_FC ............................................................................................................................................................................ II-466
8xGbE concentrator (8xGE) ............................................................................................................................................. II-473
TRBD1996 ......................................................................................................................................................................... II-482
Small Formfactor Pluggable (SFP) optical modules ....................................................................................................... II-482
XFP optical modules ......................................................................................................................................................... II-485
Multiple Variable Attenuator Cards............................................................................................................ II-487

x Alcatel-Lucent Proprietary 8DG-17561-AAAA
Multiple Variable Attenuator Card (MVAC) ................................................................................................................... II-487
Multiple Variable Attenuator Card (MVAC10) .............................................................................................................. II-490
Multiplexers ................................................................................................................................................ II-494
DWDM mux/demux : OMDX units ................................................................................................................................. II-494
8-channel CWDM mux/demux: CMDX-U, CMDX-U-S, CMDX2-U, CMDX2-U-S ................................................. II-501
8-channel CWDM/DWDM mux/demux: CDMDX2-U and CDMDX2-U-S ................................................................ II-502
DWDM OADM units ........................................................................................................................................................ II-504
CWDM OADM units ........................................................................................................................................................ II-512
SPV_F_1310_1550 ............................................................................................................................................................ II-518
SPV_F_C ............................................................................................................................................................................ II-520
F1310 .................................................................................................................................................................................. II-521
Optical Amplifier (OAC) ............................................................................................................................ II-523
Description ......................................................................................................................................................................... II-523
Way of working ................................................................................................................................................................. II-527
Optical characteristics........................................................................................................................................................ II-531
Optical safety ..................................................................................................................................................................... II-531
Controller .................................................................................................................................................... II-532
ESC board .......................................................................................................................................................................... II-532
Supervision units (SPVM2, SPVM3, SPVM_H, SPVM3_H) ........................................................................................ II-533
Optical Supervisory Card (OSC) ...................................................................................................................................... II-537
EBRIDGE board ................................................................................................................................................................ II-541
Optical Spectrum Monitoring Card (OSMC) ................................................................................................................... II-541
1696MS_C Master Intershelf Link (I-LINK_M) ............................................................................................................. II-543
1696MS_C Slave Intershelf Link (I-LINK_S) ................................................................................................................ II-545
General user interfaces.............................................................................................................................. II-547
LAN board.......................................................................................................................................................................... II-548
HouseKeeping board (HK)................................................................................................................................................ II-550
Rack Alarm Interface (RAI).............................................................................................................................................. II-551
User Interfaces Card (UIC) ............................................................................................................................................... II-554
Switching Protection (OPC) ........................................................................................................................ II-555
Single and Multi Mode Optical Protection Cards ............................................................................................................ II-555
Optical Multiplex Section Protection: OMSP unit .......................................................................................................... II-558
Power Supply Card (PSC/PSC3) ................................................................................................................ II-561
Power Supply Card (PSC2)......................................................................................................................... II-561
Power Management Unit (PMU) ................................................................................................................ II-562
Batteries for PMU .............................................................................................................................................................. II-564
FANS unit .................................................................................................................................................... II-567
FANC unit for 1696MS shelf ............................................................................................................................................ II-567
FAN_C unit for 1696MS_C shelf ..................................................................................................................................... II-568
8 TECHNICAL SPECIFICATIONS ......................................................................................................... II-570
Purpose ............................................................................................................................................................................... II-570
Contents .............................................................................................................................................................................. II-570
1696MSPAN System characteristics ........................................................................................................... II-571
Main system characteristics .............................................................................................................................................. II-571
Safety requirements and mechanism ........................................................................................................... II-581
Electrical safety .................................................................................................................................................................. II-581
Electrical Safety compliance with standardized Norms .................................................................................................. II-581
Optical safety ..................................................................................................................................................................... II-582
Boards interfaces characteristics ................................................................................................................ II-593
Tributaries optical characteristics ..................................................................................................................................... II-593
Multiple Variable Attenuator Cards (MVAC) optical characteristics ............................................................................ II-634
DWDM Mux/Demux units (OMDX) optical characteristics .......................................................................................... II-636
8-channel CWDM Mux/Demux optical characteristics: CMDX-U(-S), CMDX2-U(-S) ............................................. II-641
C/DWDM Mux/Demux units (CDMDX2-U and CDMDX2-U-S) optical characteristics ........................................... II-642
DWDM OADM units optical characteristics ................................................................................................................... II-643
8DG-17561-AAAA Alcatel_lucent Proprietary xi
CWDM OADM units optical characteristics ................................................................................................................... II-653
Mux/Demux 1310-1550 + supervision unit optical characteristics ................................................................................ II-655
SPV_F_C unit optical characteristics ............................................................................................................................... II-656
F1310 unit optical characteristics ..................................................................................................................................... II-658
Optical Amplifier Card (OAC) optical characteristics .................................................................................................... II-659
SPV-M + OW (SPVM2) and SPVM_H optical characteristics ..................................................................................... II-660
Optical Supervisory Channel (OSC) board optical characteristics ................................................................................. II-661
OSMC optical characteristics ............................................................................................................................................ II-661
Optical Protection Cards (OPC) optical characteristics .................................................................................................. II-662
OMSP optical characteristics ............................................................................................................................................ II-663
Alarm characteristics................................................................................................................................. II-665
Equipment domain alarms ................................................................................................................................................. II-667
Optical transmission domain alarms................................................................................................................................. II-699
Power supply characteristics ...................................................................................................................... II-722
Power consumption ........................................................................................................................................................... II-722
Maximum power consumption of boards and units ........................................................................................................ II-722
Mechanical characteristics ......................................................................................................................... II-725
Maximum weight of the boards and units ........................................................................................................................ II-726
Environmental characteristics .................................................................................................................... II-727
Electromagnetic Compatibility (EMC) norms: ETSI compliancy ................................................................................. II-728
Electromagnetic Compatibility (EMC) norms: ANSI compliancy ................................................................................ II-728
Electromagnetic Compatibility (EMC) condition............................................................................................................ II-728
Waste from Electrical and Electronic Equipment (WEEE) ........................................................................................... II-728
Acoustical noise ................................................................................................................................................................. II-729
Environmental constraints ................................................................................................................................................. II-729
9 HARDWARE SETTINGS ..................................................................................................................... II-737
Purpose ............................................................................................................................................................................... II-737
Contents .............................................................................................................................................................................. II-737
Part Number and Change Status identification ........................................................................................ II-740
General safety rules and warnings............................................................................................................ II-743
Microswitches ON position .................................................................................................................... II-746
OMDX, OADM and SPV_F hardware settings......................................................................................... II-747
ESC hardware settings............................................................................................................................... II-750
ESC Presetting table .......................................................................................................................................................... II-751
SPVM2 and SPVM_H hardware settings.................................................................................................. II-752
LANC (LAN access card) hardware settings ............................................................................................. II-756
MCC3 hardware settings............................................................................................................................ II-759
OCC10 hardware settings.......................................................................................................................... II-761
OCC10_E hardware settings...................................................................................................................... II-763
PART III: MAINTENANCE ...................................................................................................................... III-765
10 MAINTENANCE .................................................................................................................................. III-767
Purpose ............................................................................................................................................................................. III-767
Contents ............................................................................................................................................................................ III-767
Maintenance introduction ......................................................................................................................... III-768
General safety rules ......................................................................................................................................................... III-768
General rules .................................................................................................................................................................... III-769
Maintenance aspects: definitions .................................................................................................................................... III-769
Instruments And Accessories .......................................................................................................................................... III-770
Preventive maintenance............................................................................................................................ III-771
Routine Maintenance every six months ......................................................................................................................... III-772
Routine Maintenance every year .................................................................................................................................... III-776
Routine Maintenance every five years ........................................................................................................................... III-776
Corrective maintenance (troubleshooting) ............................................................................................... III-777

xii Alcatel-Lucent Proprietary 8DG-17561-AAAA
Fault location: alarm & status indication ....................................................................................................................... III-779
Set of spare parts....................................................................................................................................... III-782
Suggested Spare Parts ...................................................................................................................................................... III-782
General rules on spare parts management ...................................................................................................................... III-782
Particular rules on spare parts management ................................................................................................................... III-782
Repair Form.............................................................................................................................................. III-783
PART IV: DISMANTLING & RECYCLING ........................................................................................... IV-785
11 DISMANTLING & RECYCLING ........................................................................................................ IV-787
Purpose ............................................................................................................................................................................. IV-787
Contents ............................................................................................................................................................................ IV-787
WEEE general information ...................................................................................................................... IV-788
How to disassembly the equipment........................................................................................................... IV-789
Tools necessary for disassembly ..................................................................................................................................... IV-789
Subrack disassembly ........................................................................................................................................................ IV-790
Unit disassembly .............................................................................................................................................................. IV-801
Hazardous materials and components ............................................................................................................................ IV-816
Eco declaration .......................................................................................................................................... IV-819
12 LIST OF ABBREVIATIONS ................................................................................................................ IV-822

8DG-17561-AAAA Alcatel_lucent Proprietary xiii
List of figures

Figure 1: Subrack label ..........................................................................................................................................I-22
Figure 4: Labels on units with standard cover plate .........................................................................................I-26
Figure 5: Modules label .........................................................................................................................................I-28
Figure 6: Internal label for Printed Board Assembly ..........................................................................................I-29
Figure 7: Back panels internal label......................................................................................................................I-30
Figure 8: Label specifying item not on catalogue (P/N. and serial number) .....................................................I-30
Figure 9: Label specifying item on catalogue (P/N. and serial number) ............................................................I-31
Figure 10: Item identification labels - item on catalog ........................................................................................I-31
Figure 11: Label identifying the equipment (example) .......................................................................................I-32
Figure 12: CE label .................................................................................................................................................I-32
Figure 13: WEEE label ..........................................................................................................................................I-33
Figure 14: The 1696MSPAN in line terminal configuration ............................................................................. II-46
Figure 15: The 1696MSPAN in line terminal configuration (mixed configuration) ....................................... II-47
Figure 16: Line Terminal configuration block diagram with two MCC3 transponders ................................ II-47
Figure 17: Line Terminal configuration block diagram with a WLA transponder (2 chs) ........................... II-48
Figure 18: Line Terminal block diagram with two 4xANY_P or 2xGE_FC or 8xGE transponders ............ II-49
Figure 19: Booster + Pre-amplifier Line Terminal (1 x OAC) configuration with DWDM technology ....... II-50
Figure 20: Mixed (CWDM + DWDM) configuration: Booster + Pre-amplifier LT (1 x OAC) ..................... II-50
Figure 21: The 1696MSPAN in Booster + Pre-amplifier Line Terminal (2 x OACs) configuration ............. II-51
Figure 22: The 1696MSPAN in OADM configuration ...................................................................................... II-51
Figure 23: The 1696MSPAN in back-to-back terminal configuration ............................................................. II-52
Figure 25: OADM or back-to-back terminal configuration block diagram with WLA ................................. II-54
Figure 26: OADM or b-to-b configuration block diagram with WLA as regenerator for 2 chs ................... II-55
Figure 27: OADM repeater (1 OAC west side + 1 OAC east side) configuration ........................................... II-56
Figure 28: OADM repeater (2 OACs west side + 2 OACs east side) configuration ........................................ II-56
Figure 29: The 1696MSPAN in repeater configuration .................................................................................... II-57
Figure 30: Point-to-point link .............................................................................................................................. II-58
Figure 31: Ring configuration ............................................................................................................................. II-59
Figure 32: Interconnected rings with data on customer ports and supervision carried by OSC .................. II-60
Figure 33: Interconnected rings with data on customer ports and LAN_Q management ............................. II-60
Figure 34: CPE configuration .............................................................................................................................. II-61
Figure 35: Bicycle wheel configuration: NE on a ring adressing 10 supervised CPE links ........................ II-62
Figure 36: CPE link based on CWDM technology ............................................................................................ II-63
Figure 37: CPE link based on CWDM technology with 1310nm port ............................................................. II-64
Figure 38: Mixed transmission based on CWDM and DWDM technologies .................................................. II-65
Figure 39: Connection to host equipments ......................................................................................................... II-66
Figure 40: Optical SNCP protection scheme: with back-to-back terminals or OADM ................................. II-67
Figure 41: Optical SNCP way of working .......................................................................................................... II-68
Figure 42: OTSP protection scheme in a point-to-point network configuration............................................. II-69
Figure 43: Rack organization, 32 channel bi-directional terminal ................................................................... II-73
Figure 44: Shelf dimensions ................................................................................................................................. II-76
Figure 45: Typical fully equipped shelf .............................................................................................................. II-78
Figure 46: Example of Master shelf front view ................................................................................................ II-110

xiv Alcatel-Lucent Proprietary 8DG-17561-AAAA
Figure 47: Shelf front view with cover .............................................................................................................. II-111
Figure 48: 1696MS_C Rack version .................................................................................................................. II-112
Figure 49: 1696MS_C Table version with and without cover ......................................................................... II-112
Figure 50: 1696 MS_C - Mechanical structure ................................................................................................ II-114
Figure 51: 1696 MS_C - Main shelf board arrangement ................................................................................ II-115
Figure 52: Typical 1696MS_C equipped shelf ................................................................................................. II-117
Figure 53: Fan_C board ..................................................................................................................................... II-147
Figure 54: Simple MU optical connector .......................................................................................................... II-148
Figure 55: Double MU optical connector .......................................................................................................... II-149
Figure 56: MCC3 front panel ............................................................................................................................ II-153
Figure 57: OCC10_E and OCC10_EC front panel .......................................................................................... II-154
Figure 58: WLA1C front panel ......................................................................................................................... II-155
Figure 59: WLA2M and WLA3CD front panel ............................................................................................... II-156
Figure 60: CWLA2M_OP and CWLA3CDOP front panel ............................................................................ II-157
Figure 61: 2xGE_FC front panel ....................................................................................................................... II-158
Figure 62: 8xGE front panel .............................................................................................................................. II-160
Figure 63 TRBD1996 front panel ...................................................................................................................... II-161
Figure 64: 4xANY front panel ........................................................................................................................... II-162
Figure 65: MVAC front panel ........................................................................................................................... II-163
Figure 66: MVAC10 front panel ....................................................................................................................... II-164
Figure 67: SFP optical module .......................................................................................................................... II-165
Figure 68: XFP optical module .......................................................................................................................... II-166
Figure 69: OMDX8100_M_L1_XS front panel ................................................................................................ II-167
Figure 70: OMDX8100_M_L2/S2/S1 front panel ............................................................................................ II-168
Figure 71: OADM8100_M_L1_S (L2/S1/S2) front panel ................................................................................ II-169
Figure 72: OADM4100_M_chxx-yy_S front panel .......................................................................................... II-170
Figure 73: OADM2100_M_xx_yy_S front panel ............................................................................................. II-171
Figure 74: OADM1100_M_xx_S front panel ................................................................................................... II-172
Figure 75: SPV_F_1310_1550 front panel ........................................................................................................ II-173
Figure 76: SPV_F_C front panel ....................................................................................................................... II-174
Figure 77: CMDX(2) boards (all types) front panel ........................................................................................ II-175
Figure 78: CDMDX2-U and CDMDX2-U-S front panel ................................................................................. II-176
Figure 79: COAD2-xx_S (1-channel OADM) front panel ............................................................................... II-177
Figure 80: COAD2-xx-yy_S (2-channel OADM) front panel.......................................................................... II-178
Figure 82: COAD2-xx-yy_S (4-channel OADM) access points description ................................................... II-180
Figure 83: F1310 front panel ............................................................................................................................. II-181
Figure 84: OAC2 and OAC2_L front panel ..................................................................................................... II-182
Figure 85: ESC front panel ................................................................................................................................ II-183
Figure 86: SPVM2 and SPVM3 front panel ..................................................................................................... II-184
Figure 87: SPVM_H and SPVM3_H front panel ............................................................................................. II-185
Figure 88: OSC front panel................................................................................................................................ II-186
Figure 89: EBRIDGE front panel ..................................................................................................................... II-187
Figure 90: OSMC front panel ............................................................................................................................ II-188
Figure 91: I-Link_M front panel ....................................................................................................................... II-189
Figure 92: I-Link_S front panel ........................................................................................................................ II-190
Figure 93: LAN boards front panel ................................................................................................................... II-191
Figure 94: Housekeeping front panel ................................................................................................................ II-192
Figure 95: RAI front panel ................................................................................................................................ II-193
Figure 96: UIC front panel ................................................................................................................................ II-194
Figure 97: OPC front panel ............................................................................................................................... II-195
8DG-17561-AAAA Alcatel_lucent Proprietary xv
Figure 98: OMSP front panel ............................................................................................................................ II-196
Figure 99: PSC/PSC2/PSC3 front panel ........................................................................................................... II-197
Figure 100: PMU front panel ............................................................................................................................. II-198
Figure 101: FANs front panel ............................................................................................................................ II-199
Figure 102: Functional synopsis in Line Terminal configuration .................................................................. II-202
Figure 103: Functional synopsis in OADM configuration .............................................................................. II-203
Figure 104: Functional synopsis in Repeater configuration ........................................................................... II-204
Figure 105: Line terminal transponder function ............................................................................................. II-206
Figure 106: Back-to-back terminal or OADM transponder function ............................................................ II-207
Figure 107: Principle of the 4xANY TDM concentration ............................................................................... II-215
Figure 108: Principle of the 2xGE_FC TDM concentration ........................................................................... II-217
Figure 109: 8xGE configurations: concentration mode and add/drop mode ................................................ II-218
Figure 110: Principle of the 8xGE Ethernet concentration ............................................................................ II-219
Figure 111: Eight GbE signals protected by OMSP boards in Concentration mode (point-to-point) ........ II-219
Figure 112: 8xGE in ADD/DROP mode (multipoint) ...................................................................................... II-220
Figure 113: 4 and 8 channels DWDM optical MUXes ..................................................................................... II-221
Figure 114: 8 channels CWDM optical MUX .................................................................................................. II-222
Figure 115: 7 channels C/DWDM optical MUX .............................................................................................. II-222
Figure 116: LB and SB aggregate signals expansion MUX ............................................................................. II-222
Figure 117: 4 and 8 channels optical DMUX .................................................................................................... II-223
Figure 118: 8 channels CWDM optical DMUX ................................................................................................ II-223
Figure 119: 7 channels C/DWDM optical DMUX ............................................................................................ II-224
Figure 120: LB and SB aggregate signals expansion DMUX .......................................................................... II-224
Figure 121: MUX and DMUX functions of an 8 channels Line Terminal ..................................................... II-225
Figure 122: MUX and DMUX functions of a 12 channels Line Terminal ..................................................... II-225
Figure 124: MUX and DMUX functions of a 38 C/DWDM mixed channels Line Terminal ....................... II-227
Figure 125: MUX and DMUX functions of an 8 channels OADM ................................................................. II-228
Figure 126: MUX and DMUX functions of a 32 channels back-to-back terminal ........................................ II-228
Figure 127: 1696MSPAN in back-to-back terminal configuration and with a remote channel .................. II-229
Figure 128: OFA sub-system in line terminal or OADM configuration ........................................................ II-230
Figure 129: OFA sub-system in repeater configuration .................................................................................. II-230
Figure 130: OSC management in Line Terminal, OADM, OADM repeater and In-Line-Repeater .......... II-232
Figure 131: Automatic Power Equalization ..................................................................................................... II-235
Figure 132: Controller sub-system .................................................................................................................... II-238
Figure 133: Example of control interfaces scheme in 1696MSPAN ............................................................... II-240
Figure 134: Example of control interfaces scheme in 1696MS_C .................................................................. II-241
Figure 135: 1696MSPAN - equipment power supply scheme ......................................................................... II-245
Figure 136: Channel level protection in a ring network .................................................................................. II-246
Figure 137: O-SNCP principle ........................................................................................................................... II-247
Figure 138: Optical SNCP with MCC3 unit ..................................................................................................... II-249
Figure 139: Optical SNCP of the MCC associated with the 4xANY (MCC-4xANY) ................................... II-250
Figure 140: Optical SNCP with OCC10 unit.................................................................................................... II-251
Figure 141: Optical SNCP of the MCC associated with the 4xANY (4xANY client protection) ................. II-254
Figure 142: Correspondance between OPC slots allocation and 4xANY drawers in protection ................. II-255
Figure 143: Optical SNCP of the MCC associated with the 2xGE_FC .......................................................... II-257
Figure 144: Optical SNCP of the WLA_OP associated with the 2xGE_FC .................................................. II-258
Figure 146: Optical SNCP with 8xGE .............................................................................................................. II-261
Figure 147: O-SNCP with WLA units (WLA2M_OP/WLA3CDOP) ............................................................ II-262
Figure 148: Example of a 1696 MS network with path protection using WLA3CDOP cards ..................... II-264

xvi Alcatel-Lucent Proprietary 8DG-17561-AAAA
Figure 149: TS protection with OMSP unit...................................................................................................... II-265
Figure 150: Example of starting configuration ................................................................................................ II-280
Figure 151: 4 (CWDM or DWDM) channels line terminal block diagram ................................................... II-284
Figure 152: Remote MCC or (MCC or 2xGE_FC)+4xANY_P: 3 signals multiplexed by SPV_F .... II-368II-370
Figure 153: One protected transponderon the same fiber (2 channel wavelengths) ........................... II-370II-372
Figure 154: B-to-b 4XANY used to drop some of the carried services and by-pass the others ......... II-372II-374
Figure155: Remote unprotected MCC .................................................................................................... II-373II-375
Figure156: OADM 1 channel protected back-to-back (DWDM) ......................................................... II-375II-377
Figure 157: Remote Spur 4xANY (or 2xGE_FC) + protected MCC on 1310 nm ............................... II-376II-378
Figure158: Remote Spur 4xANY (or 2xGE_FC) + protected MCC on 1550 nm ................................ II-377II-379
Figure159: 2-channel Line Terminal ...................................................................................................... II-378II-380
Figure160: Remote CPE, 2-channel terminal: MCC + 4xANY with drawers protection .................. II-381II-383
Figure161: 1696MS or 1696MS_C with only supervision ..................................................................... II-382II-384
Figure162: 1696MS connected to a CPE through a supervised black-and-white signal .................... II-383II-385
Figure163: 1696MS connected to a CPE through a supervised black-and-white and colored signal and
protected in the ring ........................................................................................................................ II-384II-386
Figure164: 1696MS connected to a CPE through a supervised black-and-white and colored signal and
unprotected in the ring ................................................................................................................... II-385II-387
Figure165: Optical channel optically passed through the NE without being regenerated. ................ II-386II-388
Figure166: Optical channel optically passed through the NE without being regenerated and with OSC
insertion............................................................................................................................................ II-387II-389
Figure167: Two 1696MS rings connected together through user interfaces. ...................................... II-390II-392
Figure168: Two 1696MS rings connected together through user interfaces. ...................................... II-392II-394
Figure169: Block diagram of the MCC3 unit ......................................................................................... II-395II-397
Figure170: MCC2 in default configuration ............................................................................................ II-402II-404
Figure171: Drop / Insert without Optical-SNCP (identical 8x8 matrix configuration) ...................... II-403II-405
Figure172: Drop / Insert with Optical-SNCP (identical 8x8 matrix configuration) ........................... II-404II-406
Figure173: Pass-through (regeneration configuration) ......................................................................... II-406II-408
Figure174: Local Loop-Back ................................................................................................................... II-408II-410
Figure175: Remote Loop-Back in ring application (back-to-back or OADM) ................................... II-409II-411
Figure176: User Loop-Back ..................................................................................................................... II-410II-412
Figure177: User Loop-Back & pass-through ......................................................................................... II-411II-413
Figure178: Remote Loop-Back in ring application (back-to-back or OADM) ................................... II-412II-414
Figure179: OCC10_E unit block diagram .............................................................................................. II-414II-416
Figure180: Drop / Insert without Optical-SNCP (identical 8x8 matrix configuration) ...................... II-421II-423
Figure181: Drop-insert (UNI) .................................................................................................................. II-421II-423
Figure182: Drop / Insert with Optical-SNCP (identical 8x8 matrix configuration) ........................... II-422II-424
Figure183: Pass-through (NNI) ............................................................................................................... II-423II-425
Figure184: Regeneration (two pass-through linked by 10G backpanel) .............................................. II-423II-425
Figure185: Remote Loop-Back pass-through (NNI) in ring application (back-to-back or OADM) . II-424II-426
Figure186: Drop-insert remote loop-back (UNI) in ring application (back-to-back or OADM) ....... II-425II-427
Figure187: Remote loop-back (NNI) in ring application (back-to-back or OADM) .......................... II-425II-427
Figure188: Local Loop-Back (UNI) ........................................................................................................ II-426II-428
Figure189: User Loop-Back (UNI) .......................................................................................................... II-427II-429
Figure190: WLA1C and WLA2M unit block diagram ......................................................................... II-429II-431
Figure191: Matrix configuration for both Channels in Add/Drop ....................................................... II-434II-436
Figure192: Matrix configuration for CH1 in Add/Drop and CH2 in Local loopback ........................ II-435II-437
Figure193: Matrix configuration for CH1 in Add/Drop and CH2 in Remote loopback .................... II-436II-438
Figure194: Matrix configuration for CH1 in Add/Drop and CH2 in Local-Remote loopback ......... II-437II-439
Figure195: Matrix configuration for CH1 in Local loopback and CH2 in Add/Drop ........................ II-438II-440
Figure196: Matrix configuration for CH1 and CH2 in Local loopback .............................................. II-439II-441
8DG-17561-AAAA Alcatel_lucent Proprietary xvii
Figure197: Matrix configuration for CH1 in Local loopback and CH2 in Remote loopback ........... II-440II-442
Figure198: Matrix configuration for CH1 in Local loopback and CH2 in Local-Remote loopback . II-441II-443
Figure199: Matrix configuration for CH1 in Remote loopback and CH2 in Add/Drop .................... II-442II-444
Figure200: Matrix configuration for CH1 in Remote loopback and CH2 in Local loopback ........... II-443II-445
Figure201: Matrix configuration for CH1 and CH2 in Remote loopback ........................................... II-444II-446
Figure202: Matrix configuration for CH1 in Remote loopback, CH2 in Local-Remote loopback.... II-445II-447
Figure203: Matrix configuration for CH1 in Local-Remote loopback and CH2 in Add/Drop ......... II-446II-448
Figure204: Matrix configuration for CH1 in Local-Remote loopback and CH2 in Local loopback . II-447II-449
Figure205: Matrix configuration for CH1 in Local-Remote loopback, CH2 in Remote loopback .... II-448II-450
Figure206: Matrix configuration for CH1 and CH2 in Local-Remote loopback ................................ II-449II-451
Figure207: WLA3CD unit block diagram .............................................................................................. II-450II-452
Figure208: WLA2M_OP unit block diagram ........................................................................................ II-455II-457
Figure209: Matrix configuration for both Channels in Add/Drop (O-SNCP configutration) ........... II-461II-463
Figure210: Matrix configuration for CH1 in Add/Drop and CH2 in Local loopback ........................ II-462II-464
Figure211: Matrix configuration for CH1 in Add/Drop and CH2 in Remote loopback .................... II-463II-465
Figure212: Matrix configuration for CH1 in Add/Drop and CH2 in Local-Remote loopback ......... II-464II-466
Figure213: Matrix configuration for CH1 in Local loopback and CH2 in Add/Drop ........................ II-465II-467
Figure214: Matrix configuration for CH1 in Remote loopback and CH2 in Add/Drop .................... II-466II-468
Figure215: Matrix configuration for CH1 in Local-Remote loopback, CH2 in Remote loopback .... II-467II-469
Figure216: WLA3CDOP unit block diagram ........................................................................................ II-468II-470
Figure217: 4xANY_P block diagram ...................................................................................................... II-475II-477
Figure218: 2xGE_FC block diagram ...................................................................................................... II-478II-480
Figure219: Loopbacks configuration of 2xGE_FC ................................................................................ II-481II-483
Figure220: Example of communication between two 2xGE_FC boards ............................................. II-482II-484
Figure221: 8xGE block diagram ............................................................................................................. II-485II-487
Figure222: Loopbacks configuration of 8xGE (in concentration mode) .............................................. II-488II-490
Figure223: SFP modules general block diagram ................................................................................... II-497II-499
Figure224: XFP modules general block diagram ................................................................................... II-499II-501
Figure225: MVAC unit block diagram ................................................................................................... II-501II-504
Figure226: Example of MVAC location in the system .......................................................................... II-502II-505
Figure227: MVAC10 unit block diagram ............................................................................................... II-504II-508
Figure228: Example of MVAC10 configurations .................................................................................. II-506II-511
Figure229: OMDX8100_M_L1_XS: block diagram .............................................................................. II-510II-515
Figure230: OMDX8100_M_L1_X: block diagram ................................................................................ II-512II-517
Figure231: OMDX8100_M_L2 , OMDX8100_M_S1 , OMDX8100_M_S2 : block diagram ............. II-514II-519
Figure232: CMDX (all types) block diagram ......................................................................................... II-516II-521
Figure233: CDMDX2-U and CDMDX2-U-S block diagram ................................................................ II-518II-523
Figure234: OADM8: block-diagram ....................................................................................................... II-519II-524
Figure235: OADM4: block-diagram ....................................................................................................... II-521II-526
Figure236: Block diagram of the OADM2100_M_xx_S unit ................................................................ II-523II-528
Figure237: OADM1100: block diagram ................................................................................................. II-525II-530
Figure238: COAD2-xx-yy_S block diagram (4-channel CWDM OADM) .......................................... II-528II-533
Figure239: Block diagram of the SPV_F_1310_1550 unit .................................................................... II-532II-537
Figure240: Block diagram of the SPV_F_C unit ................................................................................... II-534II-539
Figure241: Position of SPV_F_C unit in a transmission line ................................................................ II-535II-540
Figure242: F1310 block diagram ............................................................................................................. II-536II-541
Figure243: Amplifier boards block-diagram ......................................................................................... II-540II-545
Figure244: Optical amplifiers configuration .......................................................................................... II-541II-546
Figure245: Span variation compensation ............................................................................................... II-542II-547
Figure246: Amplifier tuning for number of channels changes (previous span loss constant) ........... II-544II-549
Figure247: SPVM2 and SPVM3 block diagram .................................................................................... II-549II-554

xviii Alcatel-Lucent Proprietary 8DG-17561-AAAA
Figure248: SPVM board in a Line Terminal configuration ................................................................. II-550II-555
Figure249: SPVM board in an OADM or Back-To-Back configuration ............................................. II-551II-556
Figure250: OSC block diagram ............................................................................................................... II-553II-558
Figure251: board in a Line Terminal configuration .............................................................................. II-554II-559
Figure252: OSC board in an OADM or Back-To-Back configuration ................................................ II-554II-559
Figure253: OMSC block diagram ........................................................................................................... II-556II-561
Figure254: OSMC connection (measured points) .................................................................................. II-556II-562
Figure255: I-Link_M block diagram ...................................................................................................... II-559II-564
Figure256: I-Link_S block diagram ........................................................................................................ II-560II-566
Figure257: Electrical access, slot description ......................................................................................... II-561II-567
Figure258: Block diagram of control LAN board .................................................................................. II-562II-568
Figure259: LAN board settings ............................................................................................................... II-564II-570
Figure260: Electrical links between RAI cards (slot 37) and TRU & PDU ......................................... II-567II-573
Figure261: 2 Mbit/s back-panel links between UIC Cards and the SPVM unit ................................. II-568II-574
Figure262: OPC block diagram ............................................................................................................... II-571II-577
Figure263: OMSP Application with and without OADM ..................................................................... II-573II-579
Figure264: OMSP unit block diagram .................................................................................................... II-574II-580
Figure265: PSC2 block diagram ............................................................................................................. II-576II-582
Figure266: PMU cabling scheme ............................................................................................................. II-577II-583
Figure267: PMU block diagram .............................................................................................................. II-578II-584
Figure268: Minimum configuration of the batteries in 1696MS_C Rel. 2.2, rack version................. II-579II-585
Figure269: Maximum configuration of the batteries in 1696MS_C Rel. 2.2, table version ............... II-580II-586
Figure270: Fan shelf description and Rack partitioning ....................................................................... II-581II-587
Figure271: Block diagram of the new FAN unit .................................................................................... II-582II-588
Figure272: FAN_C description and Rack partitioning ......................................................................... II-582II-588
Figure273: ALS mechanism on WDM line in point-to-point configuration ........................................ II-601II-607
Figure274: ALS in OADM configuration, channel in pass-through or in add/drop........................... II-602II-608
Figure275: ALS procedure in a ring with Optical SNCP, in case of fiber failure in the ring ............ II-603II-609
Figure276: ALS procedure in a point-to-point amplified transmission without OADM repeater .... II-604II-610
Figure277: ALS mechanism with cascaded pre-amplifier and booster ............................................... II-604II-610
Figure278: ALS mechanism with single pre-amplifier and booster ..................................................... II-605II-611
Figure279: Restart algorithm .................................................................................................................. II-607II-613
Figure280: OAC block diagram. ............................................................................................................. II-693II-699
Figure281: Climatogram for hazard level 1.2: not temperature controlled storage location ............ II-750II-756
Figure282: Climatogram for hazard level 3.2: partly temperature controlled locations ................... II-753II-759
Figure283: Microswitch front view and meaning .................................................................................. II-764II-770
Figure284: ESC hardware settings.......................................................................................................... II-768II-775
Figure285: LAN_Q and LAN_I hardware settings .............................................................................. II-775II-782
Figure286: MCC3 hardware settings ...................................................................................................... II-777II-784
Figure287: OCC10 hardware settings .................................................................................................... II-779II-787
Figure288: OCC10_E hardware settings ................................................................................................ II-782II-790
Figure289: FAN_C: no-dast filter extraction ...................................................................................... III-793III-801
Figure290: position of the alarms in a terminal .................................................................................. III-798III-806
Figure291: position of the alarms in an OADM .................................................................................. III-799III-807
Figure292: Repair form ........................................................................................................................ III-802III-810
Figure293: Subrack front and rear view ............................................................................................. IV-808IV-816
Figure294: Handle removing and disassembly ................................................................................... IV-809IV-817
Figure295: Rear cover removing .......................................................................................................... IV-810IV-818
Figure296: Back Panel removing ......................................................................................................... IV-812IV-820
Figure297: Upper and lower guides plane removing .......................................................................... IV-814IV-822
Figure298: Side wall removing ............................................................................................................. IV-816IV-824
8DG-17561-AAAA Alcatel_lucent Proprietary xix
Figure299: Optical fiber duct, guides and contact spring removing ................................................. IV-818IV-826
Figure300: Side coverplate removal ..................................................................................................... IV-820IV-828
Figure301: Levers removal ................................................................................................................... IV-821IV-829
Figure302: Optical connectors support removal ................................................................................. IV-823IV-831
Figure303: Side coverplate and contact spring removal ................................................................... IV-825IV-833
Figure304: Internal connectors removal.............................................................................................. IV-827IV-835
Figure305: Dissipator removal ............................................................................................................. IV-828IV-836
Figure306: Modules removal from dissipator ..................................................................................... IV-829IV-837
Figure307: Daughter boad removal ..................................................................................................... IV-830IV-838
Figure308: Gold connector removal..................................................................................................... IV-831IV-839
Figure309: Internal cables removal ..................................................................................................... IV-832IV-840
Figure310: Connector metal support removal .................................................................................... IV-833IV-841
Structure of hazard statements ...............................................................................................................................I-2
Figure 4: Labels on units with standard cover plate .........................................................................................I-25
Figure 5: Modules label .........................................................................................................................................I-26
Figure 6: Internal label for Printed Board Assembly ..........................................................................................I-27
Figure 7: Back panels internal label......................................................................................................................I-28
Figure 8: Label specifying item not on catalogue (P/N. and serial number) .....................................................I-29
Figure 9: Label specifying item on catalogue (P/N. and serial number) ............................................................I-29
Figure 10: Item identification labels - item on catalog ........................................................................................I-30
Figure 11: Label identifying the equipment (example) .......................................................................................I-30
Figure 12: CE label .................................................................................................................................................I-31
Figure 13: WEEE label ..........................................................................................................................................I-31
Figure 14: The 1696MSPAN in line terminal configuration ............................................................................. II-46
Figure 15: The 1696MSPAN in line terminal configuration (mixed configuration) ....................................... II-47
Figure 16: Line Terminal configuration block diagram with two MCC3 transponders ................................ II-47
Figure 17: Line Terminal configuration block diagram with a WLA transponder (2 chs) ........................... II-48
Figure 18: Line Terminal block diagram with two 4xANY_P or 2xGE_FC or 8xGE transponders ............ II-49
Figure 19: Booster + Pre-amplifier Line Terminal (1 x OAC) configuration with DWDM technology ....... II-50
Figure 20: Mixed (CWDM + DWDM) configuration: Booster + Pre-amplifier LT (1 x OAC) ..................... II-50
Figure 21: The 1696MSPAN in Booster + Pre-amplifier Line Terminal (2 x OACs) configuration ............. II-51
Figure 22: The 1696MSPAN in OADM configuration ...................................................................................... II-51
Figure 23: The 1696MSPAN in back-to-back terminal configuration ............................................................. II-52
Figure 24: OADM or back-to-back terminal configuration block diagram with two MCC3 ........................ II-53
Figure 25: OADM or back-to-back terminal configuration block diagram with WLA ................................. II-54
Figure 26: OADM or b-to-b configuration block diagram with WLA as regenerator for 2 chs ................... II-55
Figure 27: OADM repeater (1 OAC west side + 1 OAC east side) configuration ........................................... II-56
Figure 28: OADM repeater (2 OACs west side + 2 OACs east side) configuration ........................................ II-56
Figure 29: The 1696MSPAN in repeater configuration .................................................................................... II-57
Figure 30: Point-to-point link .............................................................................................................................. II-58
Figure 31: Ring configuration ............................................................................................................................. II-59
Figure 32: Interconnected rings with data on customer ports and supervision carried by OSC .................. II-60
Figure 33: Interconnected rings with data on customer ports and LAN_Q management ............................. II-60
Figure 34: CPE configuration .............................................................................................................................. II-61
Figure 35: Bicycle wheel configuration: NE on a ring adressing 10 supervised CPE links ........................ II-62
Figure 36: CPE link based on CWDM technology ............................................................................................ II-63
Figure 37: CPE link based on CWDM technology with 1310nm port ............................................................. II-64
Figure 38: Mixed transmission based on CWDM and DWDM technologies .................................................. II-65

xx Alcatel-Lucent Proprietary 8DG-17561-AAAA
Figure 39: Connection to host equipments ......................................................................................................... II-66
Figure 40: Optical SNCP protection scheme: with back-to-back terminals or OADM ................................. II-67
Figure 41: Optical SNCP way of working .......................................................................................................... II-68
Figure 42: OTSP protection scheme in a point-to-point network configuration............................................. II-69
Figure 43: Rack organization, 32 channel bi-directional terminal ................................................................... II-73
Figure 44: Shelf dimensions ................................................................................................................................. II-76
Figure 45: Typical fully equipped shelf .............................................................................................................. II-78
Figure 46: Example of Master shelf front view ................................................................................................ II-110
Figure 47: Shelf front view with cover .............................................................................................................. II-111
Figure 48: 1696MS_C Rack version .................................................................................................................. II-112
Figure 49: 1696MS_C Table version with and without cover ......................................................................... II-112
Figure 50: 1696 MS_C - Mechanical structure ................................................................................................ II-114
Figure 51: 1696 MS_C - Main shelf board arrangement ................................................................................ II-115
Figure 52: Typical 1696MS_C equipped shelf ................................................................................................. II-117
Figure 53: Fan_C board ..................................................................................................................................... II-147
Figure 54: Simple MU optical connector .......................................................................................................... II-148
Figure 55: Double MU optical connector .......................................................................................................... II-149
Figure 56: MCC3 front panel ............................................................................................................................ II-153
Figure 57: OCC10_E and OCC10_EC front panel .......................................................................................... II-154
Figure 58: WLA1C front panel ......................................................................................................................... II-155
Figure 59: WLA2M and WLA3CD front panel ............................................................................................... II-156
Figure 60: CWLA2M_OP and CWLA3CDOP front panel ............................................................................ II-157
Figure 61: 2xGE_FC front panel ....................................................................................................................... II-158
Figure 62: 8xGE front panel .............................................................................................................................. II-159
Figure 63: 4xANY front panel ........................................................................................................................... II-160
Figure 64: MVAC front panel ........................................................................................................................... II-161
Figure 65: MVAC10 front panel ....................................................................................................................... II-162
Figure 66: SFP optical module .......................................................................................................................... II-163
Figure 67: XFP optical module .......................................................................................................................... II-164
Figure 68: OMDX8100_M_L1_XS front panel ................................................................................................ II-165
Figure 69: OMDX8100_M_L2/S2/S1 front panel ............................................................................................ II-166
Figure 70: OADM8100_M_L1_S (L2/S1/S2) front panel ................................................................................ II-167
Figure 71: OADM4100_M_chxx-yy_S front panel .......................................................................................... II-168
Figure 72: OADM2100_M_xx_yy_S front panel ............................................................................................. II-169
Figure 73: OADM1100_M_xx_S front panel ................................................................................................... II-170
Figure 74: SPV_F_1310_1550 front panel ........................................................................................................ II-171
Figure 75: SPV_F_C front panel ....................................................................................................................... II-172
Figure 76: CMDX(2) boards (all types) front panel ........................................................................................ II-173
Figure 77: CDMDX2-U and CDMDX2-U-S front panel ................................................................................. II-174
Figure 78: COAD2-xx_S (1-channel OADM) front panel ............................................................................... II-175
Figure 81: COAD2-xx-yy_S (4-channel OADM) access points description ................................................... II-178
Figure 82: F1310 front panel ............................................................................................................................. II-179
Figure 83: OAC2 and OAC2_L front panel ..................................................................................................... II-180
Figure 84: ESC front panel ................................................................................................................................ II-181
Figure 85: SPVM2 and SPVM3 front panel ..................................................................................................... II-182
Figure 86: SPVM_H and SPVM3_H front panel ............................................................................................. II-183
Figure 87: OSC front panel................................................................................................................................ II-184
Figure 88: EBRIDGE front panel ..................................................................................................................... II-185
Figure 89: OSMC front panel ............................................................................................................................ II-186
8DG-17561-AAAA Alcatel_lucent Proprietary xxi
Figure 90: I-Link_M front panel ....................................................................................................................... II-187
Figure 91: I-Link_S front panel ........................................................................................................................ II-188
Figure 92: LAN boards front panel ................................................................................................................... II-189
Figure 93: Housekeeping front panel ................................................................................................................ II-190
Figure 94: RAI front panel ................................................................................................................................ II-191
Figure 95: UIC front panel ................................................................................................................................ II-192
Figure 96: OPC front panel ............................................................................................................................... II-193
Figure 97: OMSP front panel ............................................................................................................................ II-194
Figure 98: PSC/PSC2/PSC3 front panel ........................................................................................................... II-195
Figure 99: PMU front panel ............................................................................................................................... II-196
Figure 100: FANs front panel ............................................................................................................................ II-197
Figure 101: Functional synopsis in Line Terminal configuration .................................................................. II-200
Figure 102: Functional synopsis in OADM configuration .............................................................................. II-201
Figure 103: Functional synopsis in Repeater configuration ........................................................................... II-202
Figure 104: Line terminal transponder function ............................................................................................. II-203
Figure 105: Back-to-back terminal or OADM transponder function ............................................................ II-204
Figure 106: Principle of the 4xANY TDM concentration ............................................................................... II-211
Figure 107: Principle of the 2xGE_FC TDM concentration ........................................................................... II-213
Figure 108: 8xGE configurations: concentration mode and add/drop mode ................................................ II-214
Figure 109: Principle of the 8xGE Ethernet concentration ............................................................................ II-215
Figure 110: Eight GbE signals protected by OMSP boards in Concentration mode (point-to-point) ........ II-215
Figure 111: 8xGE in ADD/DROP mode (multipoint) ...................................................................................... II-216
Figure 112: 4 and 8 channels DWDM optical MUXes ..................................................................................... II-217
Figure 113: 8 channels CWDM optical MUX .................................................................................................. II-218
Figure 114: 7 channels C/DWDM optical MUX .............................................................................................. II-218
Figure 115: LB and SB aggregate signals expansion MUX ............................................................................. II-218
Figure 116: 4 and 8 channels optical DMUX .................................................................................................... II-219
Figure 117: 8 channels CWDM optical DMUX ................................................................................................ II-219
Figure 118: 7 channels C/DWDM optical DMUX ............................................................................................ II-220
Figure 119: LB and SB aggregate signals expansion DMUX .......................................................................... II-220
Figure 120: MUX and DMUX functions of an 8 channels Line Terminal ..................................................... II-221
Figure 123: MUX and DMUX functions of a 38 C/DWDM mixed channels Line Terminal ....................... II-223
Figure 124: MUX and DMUX functions of an 8 channels OADM ................................................................. II-224
Figure 125: MUX and DMUX functions of a 32 channels back-to-back terminal ........................................ II-224
Figure 126: 1696MSPAN in back-to-back terminal configuration and with a remote channel .................. II-225
Figure 127: OFA sub-system in line terminal or OADM configuration ........................................................ II-226
Figure 128: OFA sub-system in repeater configuration .................................................................................. II-226
Figure 129: OSC management in Line Terminal, OADM, OADM repeater and In-Line-Repeater .......... II-228
Figure 130: Automatic Power Equalization ..................................................................................................... II-231
Figure 131: Controller sub-system .................................................................................................................... II-234
Figure 132: Example of control interfaces scheme in 1696MSPAN ............................................................... II-236
Figure 133: Example of control interfaces scheme in 1696MS_C .................................................................. II-237
Figure 134: 1696MSPAN - equipment power supply scheme ......................................................................... II-241
Figure 135: Channel level protection in a ring network .................................................................................. II-242
Figure 136: O-SNCP principle ........................................................................................................................... II-243
Figure 137: Optical SNCP with MCC3 unit ..................................................................................................... II-245
Figure 138: Optical SNCP of the MCC associated with the 4xANY (MCC-4xANY) ................................... II-246
Figure 139: Optical SNCP with OCC10 unit.................................................................................................... II-247
Figure 140: Optical SNCP of the MCC associated with the 4xANY (4xANY client protection) ................. II-248

xxii Alcatel-Lucent Proprietary 8DG-17561-AAAA
Figure 141: Correspondance between OPC slots allocation and 4xANY drawers in protection ................. II-249
Figure 143: Optical SNCP of the WLA_OP associated with the 2xGE_FC .................................................. II-252
Figure 145: Optical SNCP with 8xGE .............................................................................................................. II-255
Figure 146: O-SNCP with WLA units (WLA2M_OP/WLA3CDOP) ............................................................ II-256
Figure 147: Example of a 1696 MS network with path protection using WLA3CDOP cards ..................... II-258
Figure 148: TS protection with OMSP unit...................................................................................................... II-259
Figure 149: Two possible monitored sections by the MCC ............................................................................. II-263
Figure 150: 2 possible monitored sections with the OCC ................................................................................ II-264
Figure 151: 3 possible monitored sections with the 4xANY associated with MCC ....................................... II-264
Figure 152: Monitored sections with the 2xGE_FC and 8xGE ...................................................................... II-265
Figure 153: Example of starting configuration ................................................................................................ II-272
Figure 155: 4 (CWDM or DWDM) channels terminal configuration ............................................................ II-277
Figure 156: 4 (CWDM or DWDM) channels terminal configuration with WLA boards ............................ II-278
Figure 157: 4 DWDM channels terminal configuration with 4XANY drawers protection .......................... II-279
Figure 159: 8 (CWDM or DWDM) channels line terminal with expansion and supervision ....................... II-281
Figure 160: Example of 8 (CWDM or DWDM) channels line terminal with WLA boards ......................... II-282
Figure 161: Example of 8 (CWDM or DWDM) channels line terminal with 4xANY_P .............................. II-283
Figure 162: Example of 8 CWDM or DWDM channels line terminal w/o expansion block diagram ......... II-285
Figure 163: Example of 8 DWDM or CWDM channels LT with supervision (no expansion) ..................... II-285
Figure 164: 8 CWDM channels LT with two 10Gbps chs and six 2.7Gbps chs block diagram ................... II-286
Figure 165: 8 CWDM chs terminal: two OCC10_ECs and three WLAs connected to CMDX(2) .............. II-287
Figure 166: 16 DWDM channels terminal with expansion and SPV upgradability block diagram ............ II-288
Figure 167: 16 DWDM channels terminal with expansion and SPV upgradability ..................................... II-289
Figure 168: Example of 15 CWDM/DWDM mixed channels terminal block diagram with WLAs............ II-290
Figure 169: 16 DWDM channels terminal or mix C/DWDM (15-channel) terminal with WLAs ............... II-290
Figure 170: Example of 22 CWDM/DWDM mixed channels terminal block diagram with WLAs............ II-292
Figure 171: 24 DWDM channels terminal or mix C/DWDM (22-channel) terminal with WLAs ............... II-293
Figure 172: 32 DWDM channels terminal + SPV + two stages OAC block diagram (example) ................. II-296
Figure 173: 32 DWDM channels terminal + SPV + 2 stages OAC configuration ......................................... II-297
Figure 174: Example of 30 CWDM/DWDM mixed channels terminal block diagram ................................ II-298
Figure 175: 32 DWDM chs or 30 C/DWDM chs LT+SPV+1 stage OAC configuration with WLAs .......... II-299
Figure 176: Example of 38 CWDM/DWDM mixed channels terminal block diagram ................................ II-300
Figure 177: 38 C/DWDM chs terminal+SPV+1 stage OAC configuration with WLAs ............................... II-301
Figure 178: 4 channels OADM (DWDM) block diagram ................................................................................ II-302
Figure 179: 4 channels back-to-back terminal / OADM ................................................................................. II-303
Figure 180: 8 DWDM channels OADM w/ protection block diagram ........................................................... II-305
Figure 181: 8 DWDM channels OADM protected channels ........................................................................... II-305
Figure 182: 8-channel OADM w/o protection block diagram......................................................................... II-307
Figure 183: 8 DWDM channels OADM with EXP and SPV capabilities ...................................................... II-307
Figure 184: 8 DWDM channels OADM w/o protection block diagram/2 ...................................................... II-308
Figure 185: 8 DWDM channels OADM with supervision upgrade capability .............................................. II-309
Figure 186: 8 DWDM or CWDM channels OADM with WLAs w/ protection block diagram ................... II-310
Figure 187: 8 DWDM or CWDM channels OADM with WLAs w/o protection block diagram ................. II-311
Figure 188: 8 DWDM or CWDM channels OADM with WLAs w/ or w/o protection ................................. II-312
Figure 189: 8 channels OADM with protection, 4xANY drawers protection................................................ II-313
Figure 190: 8 West / 4 East channels OADM ................................................................................................... II-315
Figure 191: 12 protected DWDM channels OADM with SPV and w/o expansion configuration ............... II-317
8DG-17561-AAAA Alcatel_lucent Proprietary xxiii
Figure 192: 16 DWDM protected channels OADM with supervision and expansion configuration........... II-319
Figure 193: 16 DWDM channels OADM with supervision and without expansion configuration .............. II-321
Figure 194: Example of 15 C/DWDM mixed channels OADM with WLA boards w/o protection ............. II-323
Figure 195: Example of 15 C/DWDM mixed channels OADM with WLA boards w/ protection ............... II-324
Figure 196: 16 DWDM chs or 15 C/DWDM mixed chs OADM with WLAs w/ or w/o protection .............. II-325
Figure 198: Example of 22 C/DWDM mixed channels OADM with WLA boards w/ protection ............... II-328
Figure 200: 32 protected DWDM chs back-to-back w/ SPV and protection and one OAC per side........... II-332
Figure 201: Example of 30 C/DWDM mixed channels OADM with WLAs w/o protection ........................ II-333
Figure 204: 38 C/DWDM mixed channels OADM with WLAs w/ or w/o protection ................................... II-337
Figure 205: Repeater with supervision ............................................................................................................. II-338
Figure 206: 8 DWDM channels terminal configuration with MVAC boards ............................................... II-339
Figure 207: 4 DWM channels LT configuration with 4xANY_P (first channels of an 8-ch band) .............. II-340
Figure 208: 16 channels terminal with MVAC boards .................................................................................... II-341
Figure 209: 8 DWDM channels OADM with MVAC boards: OADM inside OFA inter-stage ................... II-343
Figure 210: 8 DWDM channels OADM with MVACs: OADM between 2 double stages OFAs ................. II-344
Figure 211: 4 x ANY node configuration without drawers protection ........................................................... II-345
Figure 212: 4 x ANY node configuration with drawers protection ................................................................ II-346
Figure 213: 4 DWDM or CWDM channel terminal w/o SPV configuration ................................................. II-348
Figure 214: 8 DWDM channel terminal with SPV and OAC ......................................................................... II-349
Figure 215: 8 D/CWDM channels terminal with WLAs (w/ or w/o protection) w/o SPV ............................ II-350
Figure 216: 8 D/CWDM channels terminal with WLAs (w/ or w/o protection) with SPV ........................... II-350
Figure 217: 12-channel terminal without SPV ................................................................................................. II-351
Figure 218: 16 DWDM channels or mix C/DWDM (15 chs) terminal with WLAs with SPV+OAC ........... II-352
Figure 219: OADM 4 channels protected back-to-back with supervision and OAC .................................... II-354
Figure 220: Unprotected remote 4xANY or 2xGE_FC ................................................................................... II-355
Figure 221: Two remote 4xANY ........................................................................................................................ II-356
Figure 222: Unprotected remote transponder or MCC+(4xANY or 2xGE_FC) .......................................... II-357
Figure 223: Remote MCC or (MCC or 2xGE_FC)+4xANY_P: 3 signals multiplexed by SPV_F .............. II-358
Figure 224: One protected transponderon the same fiber (2 channel wavelengths) ..................................... II-360
Figure 225: B-to-b 4XANY used to drop some of the carried services and by-pass the others ................... II-361
Figure 226: Remote unprotected MCC ............................................................................................................. II-362
Figure 227: OADM 1 channel protected back-to-back (DWDM) .................................................................. II-363
Figure 228: Remote Spur 4xANY (or 2xGE_FC) + protected MCC on 1310 nm ......................................... II-364
Figure 229: Remote Spur 4xANY (or 2xGE_FC) + protected MCC on 1550 nm ......................................... II-365
Figure 230: 2-channel Line Terminal ............................................................................................................... II-366
Figure 231: 4-channel Line Terminal CWDM or DWDM with supervision ................................................. II-367
Figure 232: Remote CPE, 2-channel terminal: MCC + 4xANY with drawers protection ........................... II-368
Figure 233: 1696MS or 1696MS_C with only supervision .............................................................................. II-370
Figure 234: 1696MS connected to a CPE through a supervised black-and-white signal ............................. II-371
Figure 235: 1696MS connected to a CPE through a supervised black-and-white and colored signal and
protected in the ring .................................................................................................................................. II-372
Figure 236: 1696MS connected to a CPE through a supervised black-and-white and colored signal and
unprotected in the ring ............................................................................................................................. II-373
Figure 237: Optical channel optically passed through the NE without being regenerated. ......................... II-374
Figure 238: Optical channel optically passed through the NE without being regenerated and with OSC
insertion...................................................................................................................................................... II-375
Figure 239: Interconnection of two rings with a 1696MS and a 1696MS_C ................................................. II-376

xxiv Alcatel-Lucent Proprietary 8DG-17561-AAAA
Figure 240: Two 1696MS rings connected together through user interfaces. ............................................... II-378
Figure 241: Two 1696MS rings connected together through user interfaces. ............................................... II-379
Figure 242: Block diagram of the MCC3 unit .................................................................................................. II-383
Figure 243: MCC2 in default configuration ..................................................................................................... II-390
Figure 244: Drop / Insert without Optical-SNCP (identical 8x8 matrix configuration) ............................... II-391
Figure 245: Drop / Insert with Optical-SNCP (identical 8x8 matrix configuration) .................................... II-392
Figure 246: Pass-through (regeneration configuration) .................................................................................. II-394
Figure 247: Local Loop-Back ............................................................................................................................ II-396
Figure 248: Remote Loop-Back in ring application (back-to-back or OADM) ............................................ II-397
Figure 249: User Loop-Back .............................................................................................................................. II-398
Figure 250: User Loop-Back & pass-through .................................................................................................. II-399
Figure 251: Remote Loop-Back in ring application (back-to-back or OADM) ............................................ II-400
Figure 252: OCC10_E unit block diagram ....................................................................................................... II-402
Figure 253: Drop / Insert without Optical-SNCP (identical 8x8 matrix configuration) ............................... II-409
Figure 254: Drop-insert (UNI) ........................................................................................................................... II-409
Figure 255: Drop / Insert with Optical-SNCP (identical 8x8 matrix configuration) .................................... II-410
Figure 256: Pass-through (NNI) ........................................................................................................................ II-411
Figure 257: Regeneration (two pass-through linked by 10G backpanel)....................................................... II-411
Figure 258: Remote Loop-Back pass-through (NNI) in ring application (back-to-back or OADM) .......... II-412
Figure 259: Drop-insert remote loop-back (UNI) in ring application (back-to-back or OADM) ................ II-413
Figure 260: Remote loop-back (NNI) in ring application (back-to-back or OADM) ................................... II-413
Figure 261: Local Loop-Back (UNI) ................................................................................................................. II-414
Figure 262: User Loop-Back (UNI) ................................................................................................................... II-415
Figure 263: WLA1C and WLA2M unit block diagram .................................................................................. II-417
Figure 264: Matrix configuration for both Channels in Add/Drop ................................................................ II-422
Figure 265: Matrix configuration for CH1 in Add/Drop and CH2 in Local loopback ................................. II-423
Figure 266: Matrix configuration for CH1 in Add/Drop and CH2 in Remote loopback ............................. II-424
Figure 267: Matrix configuration for CH1 in Add/Drop and CH2 in Local-Remote loopback .................. II-425
Figure 268: Matrix configuration for CH1 in Local loopback and CH2 in Add/Drop ................................. II-426
Figure 269: Matrix configuration for CH1 and CH2 in Local loopback ....................................................... II-427
Figure 270: Matrix configuration for CH1 in Local loopback and CH2 in Remote loopback..................... II-428
Figure 271: Matrix configuration for CH1 in Local loopback and CH2 in Local-Remote loopback .......... II-429
Figure 272: Matrix configuration for CH1 in Remote loopback and CH2 in Add/Drop ............................. II-430
Figure 273: Matrix configuration for CH1 in Remote loopback and CH2 in Local loopback .................... II-431
Figure 274: Matrix configuration for CH1 and CH2 in Remote loopback .................................................... II-432
Figure 275: Matrix configuration for CH1 in Remote loopback, CH2 in Local-Remote loopback ............. II-433
Figure 276: Matrix configuration for CH1 in Local-Remote loopback and CH2 in Add/Drop .................. II-434
Figure 277: Matrix configuration for CH1 in Local-Remote loopback and CH2 in Local loopback .......... II-435
Figure 278: Matrix configuration for CH1 in Local-Remote loopback, CH2 in Remote loopback ............. II-436
Figure 279: Matrix configuration for CH1 and CH2 in Local-Remote loopback ......................................... II-437
Figure 280: WLA3CD unit block diagram ....................................................................................................... II-438
Figure 281: WLA2M_OP unit block diagram ................................................................................................. II-443
Figure 282: Matrix configuration for both Channels in Add/Drop (O-SNCP configutration) .................... II-449
Figure 283: Matrix configuration for CH1 in Add/Drop and CH2 in Local loopback ................................. II-450
Figure 284: Matrix configuration for CH1 in Add/Drop and CH2 in Remote loopback ............................. II-451
Figure 285: Matrix configuration for CH1 in Add/Drop and CH2 in Local-Remote loopback .................. II-452
Figure 286: Matrix configuration for CH1 in Local loopback and CH2 in Add/Drop ................................. II-453
Figure 287: Matrix configuration for CH1 in Remote loopback and CH2 in Add/Drop ............................. II-454
Figure 288: Matrix configuration for CH1 in Local-Remote loopback, CH2 in Remote loopback ............. II-455
Figure 289: WLA3CDOP unit block diagram ................................................................................................. II-456
Figure 290: 4xANY_P block diagram ............................................................................................................... II-463
8DG-17561-AAAA Alcatel_lucent Proprietary xxv
Figure 291: 2xGE_FC block diagram ............................................................................................................... II-466
Figure 292: Loopbacks configuration of 2xGE_FC ......................................................................................... II-469
Figure 293: Example of communication between two 2xGE_FC boards ...................................................... II-470
Figure 294: 8xGE block diagram ...................................................................................................................... II-473
Figure 295: Loopbacks configuration of 8xGE (in concentration mode) ....................................................... II-476
Figure 296: SFP modules general block diagram ............................................................................................ II-484
Figure 297: XFP modules general block diagram ............................................................................................ II-486
Figure 298: MVAC unit block diagram ............................................................................................................ II-488
Figure 299: Example of MVAC location in the system ................................................................................... II-489
Figure 300: MVAC10 unit block diagram ........................................................................................................ II-491
Figure 301: Example of MVAC10 configurations ........................................................................................... II-492
Figure 302: OMDX8100_M_L1_XS: block diagram ....................................................................................... II-496
Figure 303: OMDX8100_M_L1_X: block diagram ......................................................................................... II-498
Figure 304: OMDX8100_M_L2 , OMDX8100_M_S1 , OMDX8100_M_S2 : block diagram ...................... II-500
Figure 305: CMDX (all types) block diagram .................................................................................................. II-502
Figure 306: CDMDX2-U and CDMDX2-U-S block diagram ......................................................................... II-504
Figure 307: OADM8: block-diagram ................................................................................................................ II-505
Figure 308: OADM4: block-diagram ................................................................................................................ II-507
Figure 309: Block diagram of the OADM2100_M_xx_S unit ......................................................................... II-509
Figure 310: OADM1100: block diagram .......................................................................................................... II-511
Figure 311: COAD2-xx-yy_S block diagram (4-channel CWDM OADM) ................................................... II-514
Figure 312: Block diagram of the SPV_F_1310_1550 unit ............................................................................. II-518
Figure 313: Block diagram of the SPV_F_C unit ............................................................................................ II-520
Figure 314: Position of SPV_F_C unit in a transmission line ......................................................................... II-521
Figure 315: F1310 block diagram ...................................................................................................................... II-522
Figure 316: Amplifier boards block-diagram .................................................................................................. II-526
Figure 317: Optical amplifiers configuration ................................................................................................... II-527
Figure 318: Span variation compensation ........................................................................................................ II-528
Figure 319: Amplifier tuning for number of channels changes (previous span loss constant) .................... II-530
Figure 320: SPVM2 and SPVM3 block diagram ............................................................................................. II-535
Figure 321: SPVM board in a Line Terminal configuration .......................................................................... II-536
Figure 322: SPVM board in an OADM or Back-To-Back configuration ...................................................... II-537
Figure 323: OSC block diagram ........................................................................................................................ II-539
Figure 324: board in a Line Terminal configuration ....................................................................................... II-540
Figure 325: OSC board in an OADM or Back-To-Back configuration ......................................................... II-540
Figure 326: OMSC block diagram .................................................................................................................... II-542
Figure 327: OSMC connection (measured points) ........................................................................................... II-542
Figure 328: I-Link_M block diagram ............................................................................................................... II-545
Figure 329: I-Link_S block diagram ................................................................................................................. II-546
Figure 330: Electrical access, slot description .................................................................................................. II-547
Figure 331: Block diagram of control LAN board ........................................................................................... II-548
Figure 332: LAN board settings ........................................................................................................................ II-550
Figure 333: Electrical links between RAI cards (slot 37) and TRU & PDU .................................................. II-553
Figure 334: 2 Mbit/s back-panel links between UIC Cards and the SPVM unit .......................................... II-554
Figure 335: OPC block diagram ........................................................................................................................ II-557
Figure 336: OMSP Application with and without OADM .............................................................................. II-559
Figure 337: OMSP unit block diagram ............................................................................................................. II-560
Figure 338: PSC2 block diagram ...................................................................................................................... II-562
Figure 339: PMU cabling scheme ...................................................................................................................... II-563
Figure 340: PMU block diagram ....................................................................................................................... II-564
Figure 341: Minimum configuration of the batteries in 1696MS_C Rel. 2.2, rack version .......................... II-565

xxvi Alcatel-Lucent Proprietary 8DG-17561-AAAA
Figure 342: Maximum configuration of the batteries in 1696MS_C Rel. 2.2, table version ........................ II-566
Figure 343: Fan shelf description and Rack partitioning ................................................................................ II-567
Figure 344: Block diagram of the new FAN unit ............................................................................................. II-568
Figure 345: FAN_C description and Rack partitioning .................................................................................. II-568
Figure 346: ALS mechanism on WDM line in point-to-point configuration ................................................. II-586
Figure 347: ALS in OADM configuration, channel in pass-through or in add/drop .................................... II-587
Figure 348: ALS procedure in a ring with Optical SNCP, in case of fiber failure in the ring ..................... II-588
Figure 349: ALS procedure in a point-to-point amplified transmission without OADM repeater ............. II-589
Figure 350: ALS mechanism with cascaded pre-amplifier and booster ........................................................ II-589
Figure 351: ALS mechanism with single pre-amplifier and booster .............................................................. II-590
Figure 352: Restart algorithm ........................................................................................................................... II-592
Figure 353: OAC block diagram. ...................................................................................................................... II-675
Figure 354: Climatogram for hazard level 1.2: not temperature controlled storage location ..................... II-732
Figure 355: Climatogram for hazard level 3.2: partly temperature controlled locations ............................ II-735
Figure 356: Microswitch front view and meaning ........................................................................................... II-746
Figure 357: ESC hardware settings................................................................................................................... II-750
Figure 358: LAN_Q and LAN_I hardware settings ....................................................................................... II-757
Figure 359: MCC3 hardware settings ............................................................................................................... II-759
Figure 360: OCC10 hardware settings ............................................................................................................. II-761
Figure 361: OCC10_E hardware settings ......................................................................................................... II-764
Figure 362: FAN_C: no-dast filter extraction ................................................................................................ III-775
Figure 363: position of the alarms in a terminal ............................................................................................ III-780
Figure 364: position of the alarms in an OADM ............................................................................................ III-781
Figure 365: Repair form .................................................................................................................................. III-784
Figure 366: Subrack front and rear view ........................................................................................................ IV-790
Figure 367: Handle removing and disassembly .............................................................................................. IV-791
Figure 368: Rear cover removing ..................................................................................................................... IV-792
Figure 369: Back Panel removing .................................................................................................................... IV-794
Figure 370: Upper and lower guides plane removing ..................................................................................... IV-796
Figure 371: Side wall removing ........................................................................................................................ IV-798
Figure 372: Optical fiber duct, guides and contact spring removing ............................................................ IV-800
Figure 373: Side coverplate removal ................................................................................................................ IV-802
Figure 374: Levers removal .............................................................................................................................. IV-803
Figure 375: Optical connectors support removal ............................................................................................ IV-805
Figure 376: Side coverplate and contact spring removal .............................................................................. IV-807
Figure 377: Internal connectors removal......................................................................................................... IV-809
Figure 378: Dissipator removal ........................................................................................................................ IV-810
Figure 379: Modules removal from dissipator ................................................................................................ IV-811
Figure 380: Daughter boad removal ................................................................................................................ IV-812
Figure 381: Gold connector removal................................................................................................................ IV-813
Figure 382: Internal cables removal ................................................................................................................ IV-814
Figure 383: Connector metal support removal ............................................................................................... IV-815
8DG-17561-AAAA Alcatel_lucent Proprietary xxvii
List of tables

Table 1.1 Handbooks related to the products hardware ................................................................................. xxxiv
Table 1.2 Handbooks related to the specific product SW management and local product control .............. xxxiv
Table 1.3 Handbooks common to Alcatel-Lucent Network Elements using 1320CT platform ..................... xxxv
Table 1.4 Documentation on CD-ROM ............................................................................................................. xxxvi
Table 1.5 Handbook configuration check ........................................................................................................ xxxviii
Table 1.1 IEC 950 -Table 16: Over-temperature limits, Part 2 ..........................................................................I-15
Table 2.1 Label references .....................................................................................................................................I-20
Table 4.1 O-SNCP Supported protection schemes............................................................................................. II-68
Table 5.1 1696MS boards and units list .............................................................................................................. II-80
Table 5.2 1696MS explanatory notes ................................................................................................................ II-103
Table 5.3 1696MS_C boards and units list ....................................................................................................... II-118
Table 5.4 1696MS_C explanatory notes ............................................................................................................ II-141
Table 6.1 Example of Client signals - supported bit rates ............................................................................... II-207
Table 6.2 DWDM frequencies allocation plan in C-Band ............................................................................... II-210
Table 6.3 CWDM nominal frequencies allocation plan in C-Band ................................................................ II-214
Table 6.4 MCC protection: switching criteria .................................................................................................. II-248
Table 6.5 OCC10 protection: switching criteria .............................................................................................. II-251
Table 6.6 4xANY client protection: switching criteria per each drawer ....................................................... II-256
Table 6.7 2xGE_FC client protection: switch criteria for each drawer ......................................................... II-260
Table 6.8 WLA2M_OP and WLA3CDOP protection: switch criteria.......................................................... II-263
Table 6.9 OTS protection: switch criteria ........................................................................................................ II-265
Table 6.10 Boards and supported Performance Monitoring Points .............................................................. II-269
Table 6.11 RS counters default threshold data values ..................................................................................... II-275
Table 6.12 Configuration criteria ...................................................................................................................... II-281
Table 7.1 MCC3 Shut down mode........................................................................................................... II-400II-402
Table 7.2 Summary of the way of working in case of ILOS and LOC ................................................. II-403II-405
Table 7.7 MCC3 default Lasers and VOA states ................................................................................... II-412II-414
Table 7.8 OCC10_E Shut down mode..................................................................................................... II-418II-420
Table 7.9 OCC10_E configurations......................................................................................................... II-420II-422
Table 7.10 OCC10_E default Lasers and VOA states ........................................................................... II-427II-429
Table 7.11 Alarms and action usage for both Channels in Add/Drop configuration .......................... II-434II-436
Table 7.12 Alarms and action usage for CH1 in Add/Drop and CH2 in Local loopback configuration . II-435II-
437
Table 7.13 Alarms and action usage for CH1 in Add/Drop, CH2 in Remote loopback configuration .... II-435II-
437
Table 7.14 Alarms and action usage for CH1 in A/D and CH2 in Local-Remote loopback ............... II-436II-438
Table 7.15 Alarms and action usage for CH1 in Local loopback and CH2 in Add/Drop configuration . II-437II-
439
Table 7.16 Alarms and action usage for CH1 and CH2 in Local loopback configuration ................. II-438II-440
Table 7.17 Alarms and action usage for CH1 in Local loopback and CH2 in Remote loopback ...... II-439II-441
Table 7.18 Alarms and action usage for CH1 in Local loopback, CH2 in Local-Remote loopback .. II-440II-442

xxviii Alcatel-Lucent Proprietary 8DG-17561-AAAA
Table 7.19 Alarms and action usage for CH1 in Remote loopback, CH2 in Add/Drop configuration .... II-441II-
443
Table 7.20 Alarms and action usage for CH1 in Remote loopback and CH2 in Local loopback ...... II-442II-444
Table 7.21 Alarms and action usage for CH1 and CH2 in Remote loopback configuration .............. II-443II-445
Table 7.22 Alarms and action usage for CH1 in Remote loopback, CH2 in Local-Remote loopback..... II-444II-
446
Table 7.23 Alarms and Aaction usage for CH1 in Local-Remote loopback and CH2 in Add/Drop . II-445II-447
Table 7.24 Alarms and action usage for CH1 in Local-Remote loopback, CH2 in Local loopback .. II-446II-448
Table 7.25 Alarms and action usage for CH1 in Local-Remote loopback, CH2 in Remote loopback..... II-447II-
449
Table 7.26 Alarms and action usage for CH1 and CH2 in Local-Remote loopback configuration ... II-448II-450
Table 7.27 Alarms and action usage for O-SNCP with auto mode ....................................................... II-460II-462
Table 7.28 Alarms and action usage for both Channels in Add/Drop (O-SNCP configuration) ....... II-460II-462
Table 7.29 Alarms and action usage for CH1 in Add/Drop and CH2 in Local loopback configuration . II-461II-
463
Table 7.30 Alarms and action usage for CH1 in Add/Drop, CH2 in Remote loopback configuration .... II-462II-
464
Table 7.31 Alarms and action usage for CH1 in A/D, CH2 in Local-Remote loopback configuration ... II-463II-
465
Table 7.32 Alarms and action usage for CH1 in Local loopback and CH2 in Add/Drop configuration . II-464II-
466
Table 7.33 Alarms and action usage for CH1 in Remote loopback, CH2 in Add/Drop configuration .... II-465II-
467
Table 7.34 Alarms and action usage for CH1 in Local-Remote loopback, CH2 in Remote loopback..... II-466II-
468
Table 7.35 Allowed drawers association ................................................................................................. II-476II-478
Table 7.36 Summary of the way of working. Drop insert ..................................................................... II-477II-479
Table 7.37 2xGE_FC Shut Down mode with no E-SNCP ..................................................................... II-483II-485
Table 7.38 8xGE Shut Down mode ......................................................................................................... II-490II-492
Table 7.39 Main differences between OAC1, OAC1_L, OAC2 and OAC2_L optical amplifiers...... II-537II-542
Table 7.40 Summary of the way of working in case of ILOS APSD disable..................................... II-545II-550
Table 7.41 Summary of the way of working in case of ILOS APSD disable forced ON/OFF ......... II-545II-550
Table 7.42 Summary of the way of working in case of ILOS APSD enable ..................................... II-546II-551
Table 7.43 PDU Front Panel LED Markings ......................................................................................... II-565II-571
Table 7.44 TRU Front Panel LED Markings ......................................................................................... II-566II-572
Table 7.45 PSC and PSC3 LEDs signification ........................................................................................ II-575II-581
Table 8.1 CWDM nominal frequencies allocation plan in C-Band ...................................................... II-592II-598
Table 8.2 DWDM frequencies allocation plan in C-Band ..................................................................... II-594II-600
Table 8.3 Relation between Alarm severity terminology displayed on C.T./O.S. and alarm severity
terminology used for the ESC leds and ETSI market rack (TRU). ............................................ II-684II-690
Table 8.4 Generic alarms common to all boards .................................................................................... II-686II-692
Table 8.5 ESC-EC board specific alarms. .............................................................................................. II-687II-693
Table 8.6 ESC-SC board specific alarms. ............................................................................................... II-687II-693
Table 8.7 PSC board specific alarms....................................................................................................... II-688II-694
Table 8.8 HK board specific alarms. ....................................................................................................... II-688II-694
Table 8.9 RAI board specific alarms. ...................................................................................................... II-689II-695
Table 8.10 LAN board specific alarms .................................................................................................... II-689II-695
Table 8.11 I-LINK-M board specific alarms .......................................................................................... II-689II-695
Table 8.12 I-LINK-S board specific alarms............................................................................................ II-690II-696
Table 8.13 UIC board specific alarms ..................................................................................................... II-690II-696
Table 8.14 FAN board specific alarms .................................................................................................... II-691II-697
8DG-17561-AAAA Alcatel_lucent Proprietary xxix
Table 8.15 FAN_C board specific alarms ............................................................................................... II-691II-697
Table 8.16 OPC board specific alarms .................................................................................................... II-692II-698
Table 8.17 OMSP board specific alarms ................................................................................................. II-692II-698
Table 8.18 OAC board specific alarms. .................................................................................................. II-693II-699
Table 8.19 SPVM specific alarms ............................................................................................................ II-696II-702
Table 8.20 OSC specific alarms ............................................................................................................... II-697II-703
Table 8.21 SPV_F_C specific alarms ...................................................................................................... II-697II-703
Table 8.22 SPV_F_1310_1550 board specific alarms ............................................................................ II-698II-704
Table 8.23 MCC specific alarms. ............................................................................................................. II-699II-705
Table 8.24 SFP specific alarms. ............................................................................................................... II-700II-706
Table 8.25 XFP specific alarms. .............................................................................................................. II-701II-707
Table 8.26 WLA1 and WLA2 specific alarms. ....................................................................................... II-702II-708
Table 8.27 WLA3 specific alarms. ........................................................................................................... II-703II-709
Table 8.28 2xGE_FC specific alarms ...................................................................................................... II-703II-709
Table 8.29 8xGE main board specific alarms ......................................................................................... II-704II-710
Table 8.30 OCC10 specific alarms .......................................................................................................... II-705II-711
Table 8.31 OCC10_E specific alarms ...................................................................................................... II-708II-714
Table 8.32 4xANY main board specific alarms ...................................................................................... II-710II-716
Table 8.33 4xANY drawer specific alarms ............................................................................................. II-710II-716
Table 8.34 OMDX/OADM specific alarms. ............................................................................................ II-712II-718
Table 8.35 CMDX(2) boards specific alarms.......................................................................................... II-712II-718
Table 8.36 COAD2 boards specific alarms ............................................................................................. II-713II-719
Table 8.37 CDMDX2-U and CDMDX2-U-S specific alarms................................................................. II-713II-719
Table 8.38 OSMC specific alarms ........................................................................................................... II-714II-720
Table 8.39. MVAC specific alarms .......................................................................................................... II-715II-721
Table 8.40 MVAC10 specific alarms ....................................................................................................... II-716II-722
Table 8.41 Supervision boards transmission alarms ............................................................................. II-717II-723
Table 8.42 OMSP boards transmission alarms ...................................................................................... II-719II-725
Table 8.43 OAC boards transmission alarms ......................................................................................... II-719II-725
Table 8.44 OMDX boards transmission alarms ..................................................................................... II-720II-726
Table 8.45 COAD2 boards transmission alarms .................................................................................... II-720II-726
Table 8.46 CMDX(2) boards transmission alarms ................................................................................ II-721II-727
Table 8.47 CDMDX2-U and CDMDX2-U-S boards transmission alarms ........................................... II-722II-727
Table 8.48 MCC boards transmission alarms ........................................................................................ II-722II-728
Table 8.49 SFP specific alarms. ............................................................................................................... II-726II-731
Table 8.50 XFP specific alarms. .............................................................................................................. II-726II-732
Table 8.51 WLA1 and WLA2 boards transmission alarms .................................................................. II-726II-732
Table 8.52 WLA3 boards transmission alarms ...................................................................................... II-727II-733
Table 8.53 2xGE_FC board transmission alarms .................................................................................. II-728II-734
Table 8.54 8xGE board transmission alarms ......................................................................................... II-729II-735
Table 8.55 OCC10 boards transmission alarms ..................................................................................... II-730II-736
Table 8.56 DWDM OADM boards transmission alarms ...................................................................... II-733II-739
Table 8.57 4xANY boards transmission alarms ..................................................................................... II-734II-740
Table 8.58 SDH_DRAWER, HF_DRAWER and LF_DRAWER drawers transmission alarms ...... II-735II-741
Table 8.59 OPC transmission alarms ...................................................................................................... II-736II-742
Table 8.60 Main climatic conditions........................................................................................................ II-748II-754
Table 9.1 Example of ANV Part Number + ICS evolution ................................................................... II-758II-764
Table 9.2 OMDX, OADM and SPV_F presetting table ......................................................................... II-767II-774
Table 9.3 SPVM2 and SPVM_H presetting table .................................................................................. II-773II-780

xxx Alcatel-Lucent Proprietary 8DG-17561-AAAA
Table 9.4 Presetting table ......................................................................................................................... II-776II-783
Table 9.5 MCC3 presetting table ............................................................................................................. II-778II-785
Table 9.6 OCC10 presetting table ........................................................................................................... II-780II-788
Table 9.7 OCC10_E presetting table ....................................................................................................... II-782II-790
Table 11.1 List of hazardous materials and components present in the equipment ........................ IV-834IV-842
Table 1.1 Handbooks related to the products hardware ..................................................................................... xxi
Table 1.2 Handbooks related to the specific product SW management and local product control ................. xxii
Table 1.3 Handbooks common to Alcatel-Lucent Network Elements using 1320CT platform ....................... xxii
Table 1.4 Documentation on CD-ROM ............................................................................................................... xxiii
Table 1.5 Handbook configuration check ............................................................................................................. xxv
Table 1.1 IEC 950 -Table 16: Over-temperature limits, Part 2 ..........................................................................I-15
Table 2.1 Label references .....................................................................................................................................I-20
Table 4.1 O-SNCP Supported protection schemes............................................................................................. II-68
Table 5.1 1696MS boards and units list .............................................................................................................. II-80
Table 5.2 1696MS explanatory notes ................................................................................................................ II-103
Table 5.3 1696MS_C boards and units list ....................................................................................................... II-118
Table 5.4 1696MS_C explanatory notes ............................................................................................................ II-141
Table 6.1 Example of Client signals - supported bit rates ............................................................................... II-204
Table 6.4 MCC protection: switching criteria .................................................................................................. II-244
Table 6.5 OCC10 protection: switching criteria .............................................................................................. II-247
Table 6.6 4xANY client protection: switching criteria per each drawer ....................................................... II-250
Table 6.7 2xGE_FC client protection: switch criteria for each drawer ......................................................... II-254
Table 6.8 WLA2M_OP and WLA3CDOP protection: switch criteria.......................................................... II-257
Table 6.9 OTS protection: switch criteria ........................................................................................................ II-259
Table 6.10 Boards and supported Performance Monitoring Points .............................................................. II-262
Table 6.11 RS counters default threshold data values ..................................................................................... II-268
Table 6.12 Configuration criteria ...................................................................................................................... II-273
Table 7.1 MCC3 Shut down mode..................................................................................................................... II-388
Table 7.2 Summary of the way of working in case of ILOS and LOC ........................................................... II-391
Table 7.7 MCC3 default Lasers and VOA states ............................................................................................. II-400
Table 7.8 OCC10_E Shut down mode............................................................................................................... II-406
Table 7.9 OCC10_E configurations................................................................................................................... II-408
Table 7.10 OCC10_E default Lasers and VOA states ..................................................................................... II-415
Table 7.11 Alarms and action usage for both Channels in Add/Drop configuration .................................... II-422
Table 7.12 Alarms and action usage for CH1 in Add/Drop and CH2 in Local loopback configuration ..... II-423
Table 7.13 Alarms and action usage for CH1 in Add/Drop, CH2 in Remote loopback configuration ........ II-423
Table 7.14 Alarms and action usage for CH1 in A/D and CH2 in Local-Remote loopback ......................... II-424
Table 7.15 Alarms and action usage for CH1 in Local loopback and CH2 in Add/Drop configuration ..... II-425
Table 7.16 Alarms and action usage for CH1 and CH2 in Local loopback configuration ........................... II-426
Table 7.17 Alarms and action usage for CH1 in Local loopback and CH2 in Remote loopback ................ II-427
Table 7.18 Alarms and action usage for CH1 in Local loopback, CH2 in Local-Remote loopback ............ II-428
Table 7.19 Alarms and action usage for CH1 in Remote loopback, CH2 in Add/Drop configuration ........ II-429
Table 7.20 Alarms and action usage for CH1 in Remote loopback and CH2 in Local loopback ................ II-430
Table 7.21 Alarms and action usage for CH1 and CH2 in Remote loopback configuration ........................ II-431
Table 7.22 Alarms and action usage for CH1 in Remote loopback, CH2 in Local-Remote loopback......... II-432
8DG-17561-AAAA Alcatel_lucent Proprietary xxxi
Table 7.23 Alarms and Aaction usage for CH1 in Local-Remote loopback and CH2 in Add/Drop ........... II-433
Table 7.24 Alarms and action usage for CH1 in Local-Remote loopback, CH2 in Local loopback ............ II-434
Table 7.25 Alarms and action usage for CH1 in Local-Remote loopback, CH2 in Remote loopback......... II-435
Table 7.26 Alarms and action usage for CH1 and CH2 in Local-Remote loopback configuration ............. II-436
Table 7.27 Alarms and action usage for O-SNCP with auto mode ................................................................. II-448
Table 7.28 Alarms and action usage for both Channels in Add/Drop (O-SNCP configuration) ................. II-448
Table 7.29 Alarms and action usage for CH1 in Add/Drop and CH2 in Local loopback configuration ..... II-449
Table 7.30 Alarms and action usage for CH1 in Add/Drop, CH2 in Remote loopback configuration ........ II-450
Table 7.31 Alarms and action usage for CH1 in A/D, CH2 in Local-Remote loopback configuration ....... II-451
Table 7.32 Alarms and action usage for CH1 in Local loopback and CH2 in Add/Drop configuration ..... II-452
Table 7.33 Alarms and action usage for CH1 in Remote loopback, CH2 in Add/Drop configuration ........ II-453
Table 7.34 Alarms and action usage for CH1 in Local-Remote loopback, CH2 in Remote loopback......... II-454
Table 7.35 Allowed drawers association ........................................................................................................... II-464
Table 7.36 Summary of the way of working. Drop insert ............................................................................... II-465
Table 7.37 2xGE_FC Shut Down mode with no E-SNCP ............................................................................... II-471
Table 7.38 8xGE Shut Down mode with no E-SNCP ....................................................................................... II-478
Table 7.39 Main differences between OAC1, OAC1_L, OAC2 and OAC2_L optical amplifiers................ II-523
Table 7.40 Summary of the way of working in case of ILOS APSD disable............................................... II-531
Table 7.41 Summary of the way of working in case of ILOS APSD disable forced ON/OFF ................... II-531
Table 7.42 Summary of the way of working in case of ILOS APSD enable ............................................... II-532
Table 7.43 PDU Front Panel LED Markings ................................................................................................... II-551
Table 7.44 TRU Front Panel LED Markings ................................................................................................... II-552
Table 7.45 PSC and PSC3 LEDs signification .................................................................................................. II-561
Table 8.3 Relation between Alarm severity terminology displayed on C.T./O.S. and alarm severity
terminology used for the ESC leds and ETSI market rack (TRU). ...................................................... II-666
Table 8.4 Generic alarms common to all boards .............................................................................................. II-668
Table 8.5 ESC-EC board specific alarms. ........................................................................................................ II-669
Table 8.6 ESC-SC board specific alarms. ......................................................................................................... II-669
Table 8.7 PSC board specific alarms................................................................................................................. II-670
Table 8.8 HK board specific alarms. ................................................................................................................. II-670
Table 8.9 RAI board specific alarms. ................................................................................................................ II-671
Table 8.10 LAN board specific alarms .............................................................................................................. II-671
Table 8.11 I-LINK-M board specific alarms .................................................................................................... II-671
Table 8.12 I-LINK-S board specific alarms...................................................................................................... II-672
Table 8.13 UIC board specific alarms ............................................................................................................... II-672
Table 8.14 FAN board specific alarms .............................................................................................................. II-673
Table 8.15 FAN_C board specific alarms ......................................................................................................... II-673
Table 8.16 OPC board specific alarms .............................................................................................................. II-674
Table 8.17 OMSP board specific alarms ........................................................................................................... II-674
Table 8.18 OAC board specific alarms. ............................................................................................................ II-675
Table 8.19 SPVM specific alarms ...................................................................................................................... II-678
Table 8.20 OSC specific alarms ......................................................................................................................... II-679
Table 8.21 SPV_F_C specific alarms ................................................................................................................ II-679
Table 8.22 SPV_F_1310_1550 board specific alarms ...................................................................................... II-680
Table 8.23 MCC specific alarms. ....................................................................................................................... II-681
Table 8.24 SFP specific alarms. ......................................................................................................................... II-682
Table 8.25 XFP specific alarms. ........................................................................................................................ II-683
Table 8.26 WLA1 and WLA2 specific alarms. ................................................................................................. II-684
Table 8.27 WLA3 specific alarms. ..................................................................................................................... II-685

xxxii Alcatel-Lucent Proprietary 8DG-17561-AAAA
Table 8.28 2xGE_FC specific alarms ................................................................................................................ II-685
Table 8.29 8xGE main board specific alarms ................................................................................................... II-686
Table 8.31 OCC10 specific alarms .................................................................................................................... II-687
Table 8.32 OCC10_E specific alarms ................................................................................................................ II-690
Table 8.33 4xANY main board specific alarms ................................................................................................ II-692
Table 8.34 4xANY drawer specific alarms ....................................................................................................... II-692
Table 8.35 OMDX/OADM specific alarms. ...................................................................................................... II-694
Table 8.36 CMDX(2) boards specific alarms.................................................................................................... II-694
Table 8.37 COAD2 boards specific alarms ....................................................................................................... II-695
Table 8.38 CDMDX2-U and CDMDX2-U-S specific alarms........................................................................... II-695
Table 8.39 OSMC specific alarms ..................................................................................................................... II-696
Table 8.40. MVAC specific alarms .................................................................................................................... II-697
Table 8.41 MVAC10 specific alarms ................................................................................................................. II-698
Table 8.42 Supervision boards transmission alarms ....................................................................................... II-699
Table 8.43 OMSP boards transmission alarms ................................................................................................ II-701
Table 8.44 OAC boards transmission alarms ................................................................................................... II-701
Table 8.45 OMDX boards transmission alarms ............................................................................................... II-702
Table 8.46 COAD2 boards transmission alarms .............................................................................................. II-702
Table 8.47 CMDX(2) boards transmission alarms .......................................................................................... II-703
Table 8.48 CDMDX2-U and CDMDX2-U-S boards transmission alarms ..................................................... II-703
Table 8.49 MCC boards transmission alarms .................................................................................................. II-704
Table 8.50 SFP specific alarms. ......................................................................................................................... II-707
Table 8.51 XFP specific alarms. ........................................................................................................................ II-708
Table 8.52 WLA1 and WLA2 boards transmission alarms ............................................................................ II-708
Table 8.53 WLA3 boards transmission alarms ................................................................................................ II-709
Table 8.54 2xGE_FC board transmission alarms ............................................................................................ II-710
Table 8.55 8xGE board transmission alarms ................................................................................................... II-711
Table 8.56 OCC10 boards transmission alarms ............................................................................................... II-712
Table 8.57 DWDM OADM boards transmission alarms ................................................................................ II-715
Table 8.58 4xANY boards transmission alarms ............................................................................................... II-716
Table 8.59 SDH_DRAWER, HF_DRAWER and LF_DRAWER drawers transmission alarms ................ II-717
Table 8.60 OPC transmission alarms ................................................................................................................ II-718
TRBD1996 board transmission alarms ............................................................................................................. II-719
Table 8.60 Main climatic conditions.................................................................................................................. II-730
Table 9.1 Example of ANV Part Number + ICS evolution ............................................................................. II-740
Table 9.2 OMDX, OADM and SPV_F presetting table ................................................................................... II-749
Table 9.3 SPVM2 and SPVM_H presetting table ............................................................................................ II-755
Table 9.4 Presetting table ................................................................................................................................... II-758
Table 9.5 MCC3 presetting table ....................................................................................................................... II-760
Table 9.6 OCC10 presetting table ..................................................................................................................... II-762
Table 9.7 OCC10_E presetting table ................................................................................................................. II-764
Table 11.1 List of hazardous materials and components present in the equipment .................................... IV-816
8DG-17561-AAAA Alcatel_lucent Proprietary xxxiii
About this document
Purpose
Alcatel-Lucent makes no warranty of any kind with regards to this manual, and
specifically disclaims the implied warranties of merchantability and fitness for a
particular purpose. Alcatel-Lucent will not be liable for errors contained herein or for
damages, whether direct, indirect, consequential, incidental, or special, in connection
with the furnishing, performance, or use of this material.
NOTICE
The product specification and/or performance levels contained in this document are for
information purposes only and are subject to change without notice. They do not
represent any obligation on the part of Alcatel-Lucent.
COPYRIGHT NOTIFICATION
The technical information of this manual is the property of Alcatel-Lucent and must
not be copied, reproduced or disclosed to a third party without written consent.
Handbook applicability
This handbook applies to the following productreleases:
PRODUCT ANV P/N
1696MSPAN 3AL 86601 AAAA
PRODUCT RELEASE VERSION (N.B.) ANV P/N
1696MSPAN 3.4 8DG 17561 AAAA
N.B. See NOTES FOR HANDBOOKS RELEVANT TO SOFTWARE
APPLICATIONS in the section,Changes introduced in the same productrelease
(same handbook P/N) .

xxxiv Alcatel-Lucent Proprietary 8DG-17561-AAAA
Productrelease handbooks
The list of handbooks given here below is valid on the issue date of this Handbook
and can be changed without any obligation for Alcatel-Lucent to update it in this
Handbook.

Some of the handbooks listed here below may not be available on the issue date of
this Handbook.

The standard Customer Documentation in the English language for the equipment
whose productreleaseversion is stated on the manuals front page consists of the
following handbooks:

Table 1.1 Handbooks related to the products hardware
REF HANDBOOK ANV Part No. THIS
HDBK
[1] 1696MSPAN Rel.3.4
Technical Handbook
8DG 17561 AAAA
Provides information regarding Equipment description, Maintenance, Hardware
setting documentation.

[2] 1696MSPAN Rel.3.4
Installation Handbook
8DG 17561 CAAA
Provides stepped procedural instructions for unpacking, inspecting, Alcatel-
Lucent Part Number assembling, and mounting and wiring bays, sub-frames, I/O
panels, ancillary items, and cabling.

[3] 1696MSPAN Rel.3.4
Turn-On & Commissioning Handbook
8DG 17561 DAAA
Provides procedures to support visual inspection, module installation, Alcatel-
Lucent Part Number and provisioning; and local network element verification
tests and generic network tests.

8DG-17561-AAAA Alcatel_lucent Proprietary xxxv
Table 1.2 Handbooks related to the specific product SW management and local
product control
HDBK or
note
[4] 1696MSPAN Rel.3.4
Operators Handbook
8DG 17561 BAAA
Provides information regarding maintenance using the craft terminal

Table 1.3 Handbooks common to Alcatel-Lucent Network Elements using 1320CT
platform
HDBK
[5] 1320CT 3.X
Basic Operators Handbook
3AL 79551 AAAA
Provides general information and operational procedures common to all
1320CT (Craft terminal) of Alcatel-Lucent Info-Model Network Elements.

[6] 1330AS Rel.6.5
Operators Handbook
3AL 88876 AAAA
Provides detailed information and operational procedures regarding the alarm
Surveillance software embedded in the 1320CT software package.

[7] ELB Rel.2.X Operators Handbook 3AL 88877 AAAA
Provide detailed information and operational procedures regarding the Event
Log Browser software embedded in the 1320CT software package.

xxxvi Alcatel-Lucent Proprietary 8DG-17561-AAAA

Table 1.4 Documentation on CD-ROM
See Power supply characteristics.
REF CD-ROM TITLE ANV Part No. FACTORY Part No.
[8] 1696MSPAN Rel.3.4 CD-ROM-DOC EN 8DG 17518 AAAA --------
Contains, in electronic format, the following handbooks: REF.[1] to [4]
Envisaged after the release of all handbooks.
[9] 1320CT 3.X CD-ROM-DOC EN 3AL 79552 AAAA 417.100.032
Contains, in electronic format, the following handbooks: REF.[5] to [7]
Envisaged after the release of all handbooks

8DG-17561-AAAA Alcatel_lucent Proprietary xxxvii
Handbook Structure
This handbook has been edited according to the Alcatel-Lucent standardized drawing-
up guides complying with such suggestion.
This handbook is divided into the following main topics as described in the table of
contents:
HANDBOOK GUIDE: It contains general information on safety norms, EMC and
type of labels that might be affixed to the equipment.
Furthermore, it describes the handbook structure and the
customer documentation. The abbreviation list is supplied too.
DESCRIPTION: It contains all the equipments general and detailed system
features including its application in the telecommunication
network. Furthermore, it supplies the equipment description
and specifications (i.e., system, mechanical,electrical and/or
optical).
HARDWARE SETTING
DOCUMENTATION:
It encloses the documents related to unit hardware setting
operations, if envisaged.
MAINTENANCE: It contains all the details for periodic checks, fault location and
repair procedures and restore to normal operation through the
withdrawal of faulty units and their replacement with spares
(*)
DISMANTLING & RECYLING It contains information for subrack/units dismantling and
recycling and list of hazardous materials.
APPENDICES: Section envisaged (but not necessarily included) to describe
possible alternative unit.
ANNEXES: Section envisaged (but not necessarily included) containing
additional documentation or general information on other
topics not inherent to the chapters making up the handbook.
(*) If the equipment is software integrated and man-machine interfaced (through a PCD, PC,
Work Station or other external processing/displaying system) the maintenance carried
out with such system is described in the Operators Handbook (see Productrelease
handbooks).

xxxviii Alcatel-Lucent Proprietary 8DG-17561-AAAA
Handbook configuration check
List of the editions and modified parts
The following table indicates the handbook parts new and modified with respect to the
previous edition.
Legenda
n = new part p =proposal part
m = modified part PR =proposal edition

Table 1.5 Handbook configuration check
EDITION 01 02 03 04 05 06
DESCRIPTION n
1. GENERAL n m
2. PHYSICAL CONFIGURATION n m
3. FUNCTIONAL DESCRIPTION n m
4. UNITS DESCRIPTION n m
5. TECHNICAL SPECIFICATION n m
6. HARDWARE SETTINGS n
MAINTENANCE n
7. MAINTENANCE n
DISMANTLING & RECYCLING n
8. DISMANTLING & RECYCLING n
APPENDICES
Nothing envisaged
ANNEXES
Nothing envisaged

8DG-17561-AAAA Alcatel_lucent Proprietary xxxix
Notes on Ed.01
Ed.01 created on June 2007 is the first validated and officially released issue of this
Handbook.
Notes on Ed.02
Ed.02 created on November 2007 has been issued to:
update some system configurations, OAC units front view and the optical safety norms
add SPVM3 and SPVM3_H
update some SFP part numbers and some SFP and XFP technical specifications.
Safety information
See Safety information
How to comment
To comment on this document, go to the Online Comment Form (http://www.lucent-
info.com/comments/) or e-mail your comments to the Comments Hotline
(comments@alcatel-lucent.com).

8DG-17561-AAAA Alcatel-Lucent Proprietary I-1
Issue 1, February 2008 See notice on first page
Part I: HANDBOOK GUIDE
Overview
Purpose

The purpose of this section is outlined in the contents below.
Contents
This part includes these chapters.
SAFETY NORMS AND LABELS I-1
OTHER NORMS AND LABELS I-16
GENERAL ON ALCATEL-LUCENT CUSTOMER
DOCUMENTATION
I-32

8DG-17561-AAAA Alcatel-Lucent Proprietary I-1
Issue 1, March 2008 See notice on first page

1 SAFETY NORMS AND LABELS
Overview
Purpose
Contents
This chapter covers these topics.
First aid for electric shock I-4
Safety Rules I-6

I-2 Alcatel-Lucent Proprietary 8DG-17561-AAAA
Structure of hazard statements

Overview
Hazard statements describe the safety risks relevant while performing tasks on Alcatel-
Lucent products during deployment and/or use. Failure to avoid the hazards may have
serious consequences.
General structure
Hazard statements include the structural elements shown below.
Structure of hazard statements

Item Structure element Purpose
1 Personal injury symbol Indicates the potential for personal injury
(optional)
2 Hazard type symbol Indicates hazard type (optional)
3 Signal word Indicates the severity of the hazard
4 Hazard type Describes the source of the risk of damage or
injury
5 Damage statement Consequences if protective measures fail
8DG-17561-AAAA Alcatel_lucent Proprietary I-3
Item Structure element Purpose
6 Avoidance message Protective measures to take to avoid the hazard
7 Identifier The optional reference ID of the hazard statement
Signal words
The signal words that identify the hazard severity levels are shown in .
Signal words for hazard severity
Signal word Meaning
DANGER Indicates an imminently hazardous situation (high risk) which, if not
avoided, will result in death or serious injury.
WARNING Indicates a potentially hazardous situation (medium risk) which, if
not avoided, could result in death or serious injury.
CAUTION When used with the personal injury symbol:
Indicates a potentially hazardous situation (low risk) which, if not
avoided, may result in personal injury.
When used without the personal injury symbol:
Indicates a potentially hazardous situation (low risk) which, if not
avoided, may result in property damage, such as service interruption
or damage to equipment or other materials.

First aid for electric shock
Do not touch the patient with bare hands until the circuit has been opened.
Open the circuit by switching off the line switches. If that is not possible, protect
yourself with dry material and free the patient from the conductor.
ARTIFICIAL RESPIRATION
It is important to start mouth to mouth resuscitation at once and seek medical help
immediately.
TREATMENT OF BURNS
This treatment should be used after the patient has regained consciousness. It can also
be employed while the artificial respiration is being applied (in this case there should
be at least two persons present).
Warning
- Do not attempt to remove his clothing from the burnt parts;
- Apply dry gauze on the burns;
- Do not apply ointments or other oily substances.
Mouth to mouth resuscitation method

Safety Rules
General Rules
- Before carrying out any installation, turn-on, tests & operation and maintenance
operations carefully read the relevant Handbooks and chapters.
- Observe safety rules
When equipment is operating nobody is allowed to have access inside on the
equipment parts which are protected with Cover Plate Shields removable with
tools
In case of absolute need to have access inside, on the equipment parts when it is
operating this is allowed exclusively to service personnel, where for Service
Personnel or Technical assistance is meant :
personnel which has adequate Technical Knowledge and experience necessary
to be aware of the danger that he might find in carrying out an operation and of
the necessary measurements to reduce danger to minimum for him and for
others.
The Service Personnel can only replace the faulty units with spare parts.
The Service Personnel is not allowed to repair: hence the access to the parts no
specified is not permitted.
The keys and/or the tools used to open doors, hinged covers to remove parts
which give access to compartments in which are present high dangerous
voltages must belong exclusively to the service personnel.
For the eventual cleaning of the external parts of the equipment, absolutely do
not use any inflammable substance or substances which in some way may alter
the markings, inscriptions ect.
It is recommended to use a slightly wet cleaning cloth.
- The Safety Rules stated in the handbook describe the operations and/or precautions
to observe to safeguard service personnel during the working phases and to
guarantee equipment safety, i.e., not exposing persons, animals, things to the risk
of being injured/damaged.
- Whenever the safety protection features have been impaired, REMOVE POWER.
To cut off power proceed to switch off the power supply units as well as cut off
power station upstream (rack or station distribution frame).
- Unless fitted into the equipment, an external protection device on power supply
will be provided in the building installation. The breaking capacity of the device
will be adequate to the maximum short circuit current which can flow.
- The safety rules described in this handbook are distinguished by the following
symbol and statement:

S A F E T Y R U L E S

Labels Indicating Danger, Forbiddance, Command
It is of utmost importance to follow the instructions printed on the labels affixed to the
units and assemblies.
The labels are fully compliant with International Norms ISO 3846-1984. The symbols
or statements are enclosed in geometric shapes: ISO 3864-1984.
C O N T A I N S A S Y M B O L S T A T E M E N T
C O N T A I N S A S T A T E M E N T P R O V I D I N G I N F O R M A T I O N
O R I N S T R U C T I O N .
CONTAINS ASYMBOL
INDICATES WARNING OR DANGER (YELLOW
BACKGROUND-BLACK SYMBOL AND RIM)
(YELLOW BACKGROUND-BLACK STATEMENT AND RIM)
I N D I C A T E S F O R B I D D A N C E ( W H I T E B A C K G R O U N D
W H I T R E D R I M - B L A C K S Y M B O L O R S T A T E M E N T )
I T I S A C O M M A N D ( B L U E B A C K G R O U N D - W H I T E
S Y M B O L O R S T A T E M E N T ) .

The labels have been affixed to indicate a dangerous condition. They may contain any
standard-known symbol or any statement necessary to safeguard users and service
personnel against the most common ones, specifically:
- dangerous electrical voltages
- harmful optical signals
- risk of explosion
- moving mechanical parts
- heat-radiating Mechanical Parts

Pay attention to the information stated in the following, and proceed as instructed
The symbols presented in the following sections are all the possible symbols that
could be present on Alcatel-Lucent equipment, but are not all necessarily present
on the equipment this handbook refers to.
Dangerous Electrical Voltages
Labelling
The following warning label is affixed next to dangerous voltages (>42.4 Vp; >60
Vdc).

If it is a Class 1 equipment connected to mains, then the label associated to it will state
that the equipment will have to be grounded before connecting it to the power supply
voltage, e.g.:
W A R N I N G !

G r o u n d p r o t e c t t h e e q u i p m e n t b e f o r e
c o n n e c t i n g i t t o m a n i n s
M a k e s u r e t h a t p o w e r h a s b e e n c u t o f f
b e f o r e d i s c o n n e c t i n g g r o u n d p r o t e c t i o n .

Electrical safety: general rules
Danger Possibility of personal injury: carefully observe the
specific procedures for installation / turn-up and commissioning
/ maintenance of equipment parts where A.C. or D.C. power is
present, described in the relevant installation / turn-up and
commissioning / maintenance documents and the following
general rules:
1.a. Personal injury can be caused by -48 V dc (or by 220 V ac if envisaged in the
equipment). Avoid touching powered terminals with any exposed part of your
body.
2.b. Short circuiting, lowvoltage, lowimpedance, dc circuits can cause severe arcing
that can result in burns and/or eye damage. Remove rings, watches, and other
metal jewelry before working with primary circuits. Exercise caution to avoid
shorting power input terminals.
Electrical safety: equipment specific data
Refer to Electrical safety.
Formatted: Indent: Left: 0.69", Hanging:
0.3", Numbered + Level: 1 + Numbering Style:
a, b, c, + Start at: 1 + Alignment: Left +
Aligned at: 0.92" + Tab after: 1.17" + Indent
at: 1.17", Tab stops: Not at 1.17"

Harmful Optical Signals
Labelling
If the assembly or unit is fitted with a LASER, the labels must comply with the IEC
60825-1: Ed.1.2 (08-2007) and IEC 60825-2: Ed.3.1 (01-2007) International Norms.
The symbol indicates the presence of a LASER beam. Danger level is stated within a
rectangular label:

If the LASER is a class 1 or 1M product, the label depicting the symbol within a
triangle is not compulsory.
The rectangular shaped label bears all the information needed, i.e.:
- LASER class
- Power emitted
- Wavelength
- Ref. Norm
- Precautionary measures taken depend on LASER class
- Indications given on openings, panels and safety interlocks

Optical safety: general rules
On handling optical equipments or units or cables always check that laser labels are
properly affixed and that the system complies with applicable optical standards.

Danger Possibility of eyes damage: invisible infrared
radiations emitted by the fiber optic transmitters can cause
eyes damages. Carefully observe the specific procedures for
installation / turn-up and commissioning / maintenance of units
containing laser devices or cables transporting optical signals,
described in the relevant installation / turn-up and
commissioning / maintenance documents and the following
general rules:
a. Laser radiation is not visible by the naked eye or with laser safety glasses.
Although it cannot be seen, laser radiation may be present.
exemple of power and lenght values

a.b. Never look directly into a not terminated fiber optic connector or into a broken
optical fiber cable, unless it is absolutely known that no laser radiation is
present.
b.c. Never look at an optical fiber splice, cable or connector, unless it is absolutely
known that no laser radiation is present.
c.d. All optical connectors, terminating either fibers and transmitters/receivers, are
provided with protective covers that must always be used, as soon as possible,
when any optical link is disconnected for installation/test/maintenance purposes
or whatever operation.
d.e. Never look directly into a not terminated fiber optic connector or into a broken
optical fiber cable by means of magnifiers/microscopes, unless it is absolutely
known that no laser radiation is present. A magnifier/microscope greatly
increases the damage hazard to the eyes.
e.f. Never point a not terminated optical fiber splice, cable or connector to other
persons, unless it is absolutely known that no laser radiation is present.
f.g. Always remove electrical power from near and far optical transmitters before
disconnecting optical links between the transmitter and the receiver.
g.h. Wearing of laser safety goggles or eyes shields is recommended for every
person working on optical devices, whenever the above listed rules cannot be
followed.
Optical safety: equipment specific data
Refer to Optical safety.
Formatted: Numbered + Level: 1 +
Numbering Style: a, b, c, + Start at: 1 +
Alignment: Left + Aligned at: 0.92" + Tab
after: 1.17" + Indent at: 1.17", Tab stops: Not
at 1.17"
Risks of Explosions
Labelling and safety instructions
This risk is present when batteries are used, and it is signalled by the following label:

Therefore, slits or apertures are made to let air circulate freely and allow dangerous
gasses to down flow (battery-emitted hydrogen). A 417-IEC-5641 Norm. compliant
label is affixed next to it indicating that the openings must not be covered up.

Moving Mechanical Parts
The following warning label is affixed next to fans or other moving mechanical parts:

Before carrying out any maintenance operation see that all the moving mechanical
parts have been stopped.
Heat-radiating Mechanical Parts
The presence of heat-radiating mechanical parts is indicated by the following warning
label in compliancy with IEC 417 Norm, Fig.5041:

As stated by IEC 60950 Norm., para.1.4.7 the touchable mechanical parts carrying the
above depicted warning label, are those whose temperature T exceeds the limits
established by the following formula (temperatures in C ):
(T-T
amb
) ? (DT
max
+ 25 - T
mra
)
where:
T Temperature of the mechanical part measured at ambient
temperature T
amb
.
T
amb
Ambient temperature during the test.
DT
max
Value defined by IEC 950 Norm, Table 16 part 2 and specified in the
table below.
T
mra
The maximum room ambient temperature permitted by the
equipment specification or 25C, whichever is greater.

Table 1.1 IEC 950 -Table 16: Over-temperature limits, Part 2
Operator-accessible parts Maximum over-temperature (C )
Metal Glass,
porcelain
Plastic,
rubber
Handle knob, ect., held or touched
for short periods
35 45 60
Handles, knobs, ect., regularly held 30 40 50
Outer surface of the equipment that
can be touched
45 55 70
Inner surface of the equipment that
can be touched
45 55 70
Danger Possibility of personal injury: carefully observe the
specific procedures for installation / turn-up and commissioning
/ maintenance of equipment parts where heat-radiating
mechanical parts are present, described in the relevant
installation / turn-up and commissioning / maintenance
documents and the following general rule:
a. Personal injury can be caused by heat. Avoid touching powered terminals with
any exposed part of your body.
Specific safety rules in this handbook
Specific safety rules are specified in the following paragraphs:
Safety requirements and mechanism (Electrical safety, etc.)
General safety rules
Routine Maintenance every six months No-dust filter cleaning/substitution
Routine Maintenance every year Power cables check


2 OTHER NORMS AND LABELS
Overview
Purpose
Contents
Electromagnetic Compatibility I-17
Electrostatic Dischargers (ESD) I-19
Suggestions, notes and cautions I-20
Labels affixed to the Equipment I-20

Electromagnetic Compatibility
The equipments EMC norms depend on the type of installation being carried out
(cable termination, grounding etc.,) and on the operating conditions (equipment,
setting options of the electrical/electronic units, presence of dummy covers, etc.).
- Before starting any installation, turn-on, tests & operation and maintenance work
refer to the relevant Handbooks and chapters.
- The norms set down to guarantee EMC compatibility, are distinguished inside this
handbook by the symbol and term:

General Norms - Installation
- All connections (towards the external source of the equipment) made with shielded
cables use only cables and connectors suggested in this technical handbook or in
the relevant Plant Documentation, or those specified in the CustomersInstallation
Norms. (or similar documents)
- Shielded cables must be suitably terminated
- Install filters outside the equipment as required
- Ground connect the equipment utilizing a conductor with proper dia. and
impedance
- Mount shields (if utilized), previously positioned during the installation phase, but
not before having cleaned and degreased it.
- Before inserting the shielded unit proceed to clean and degrease all peripheral
surfaces (contact springs and connection points, etc.)
- Screw fasten the units to the subrack.
- To correctly install EMC compatible equipment follow the instructions given.
A T T E N T I O N E M C N O R M S

General Norms - Turn-on, Tests & Operation
- Preset the electrical units as required to guarantee EMC compatibility
- Check that the equipment is operating with all the shields properly positioned
(dummy covers, ESD connector protections, etc.)
- To properly use EMC compatible equipment observe the information given
General Norms Maintenance
- Before inserting the shielded unit, which will replace the faulty or modified unit,
proceed to clean and degrease all peripheral surfaces (contact springs and
connection points, etc.)
- Clean the dummy covers of the spare units as well.
- Screw fasten the units to the subrack.
Electrostatic Dischargers (ESD)
Before removing the ESD protections from the monitors, connectors etc., observe the
precautionary measures stated. Make sure that the ESD protections have been replaced
and after having terminated the maintenance and monitoring operations.
Most electronic devices are sensitive to electrostatic discharges, to this concern the
following warning labels have been affixed:

Observe the precautionary measures stated when having to touch the electronic parts
during the installation/maintenance phases.
Workers are supplied with antistatic protection devices consisting of:
ELASTICIZED BAND
COILED CORD

- an elastic band worn around the wrist
- a coiled cord connected to the elastic band and to the stud on the subrack.

Suggestions, notes and cautions
Suggestions and special notes are marked by the following symbol:

Suggestion or note....

Cautions to avoid possible equipment damage are marked by the following symbol:

Caution TITLE...
(caution to avoid equipment damage)
statement....
Labels affixed to the Equipment
This paragraph indicates the positions and the information contained on the
identification and serial labels affixed to the equipment.
Figure 1 to Figure 7. illustrate the most common positions of the labels on the units,
modules and subracks.
Figure 8 to Figure 13. illustrate the information (e.g., identification and serial No.)
printed on the labels.
The table below relates the reference numbers stated on the figures to the labels used.

Labelling depicted hereafter is for indicative purposes and could be
changed without any notice.

Table 2.1 Label references
Ref. No. Name of Label
1 label specifying item not on catalogue (P/N. and serial number)
Ref. No. Name of Label
Refer to Figure 8.
2 label specifying item on catalogue (P/N. and serial number)
Refer to Figure 9.
3 item identification label - item on catalog
Refer to Figure 10.
4 label identifying the equipment
Refer to Figure 11.
5 label identifying compliancy with CE and WEEE Directives.
Refer to Figure 12 and Figure 13.
On contract basis, customized labels can be affixed to the equipment.
Standard labels can be affixed to any position on the equipment, as required by the
Customer.
However, for each of the above are applied the rules defined by each individual
Customer.

2
A
B
C
D
4

NOTE : The above reference numbers are detailed in Table 2.1 Label
referencesTable 2.1 Label referencesTable 2.1 Label references.
Figure 1: Subrack label

2
A
B
C

NOTE : The above reference numbers are detailed on Table 2.1 Label


2
A
B
C
NB.1

NB.1 = The label is present on the support side

2
A
B
C
x
x
x
x
x
x
3
x
x
x
x
x
x
x
x
x
x
x
x
x
x
x

Figure 4: Labels on units with standard cover plate

2
ABC

NOTE : The above reference numbers are detailed on .Table 2.1 Label
referencesTable 2.1 Label referencesTable 2.1 Label references

Figure 5: Modules label

1
NB.1
ABC

NB.1 = The label is present on the p.c.s. component side
Figure 6: Internal label for Printed Board Assembly

1
ABC
NB.1

NB. 1 = The label is present on p.c.s. components side or rear side on the empty
spaces.

Figure 7: Back panels internal label

Figure 8: Label specifying item not on catalogue (P/N. and serial number)

Figure 9: Label specifying item on catalogue (P/N. and serial number)

ACRONYM FREQUENCY
(Optional)
ANV ITEM PART NUMBER

Figure 10: Item identification labels - item on catalog

EQUIPMENT NAME

Figure 11: Label identifying the equipment (example)

Figure 12: CE label

Figure 13: WEEE label

Warning CE and WEEE symbols can be in the same label or in
different position of the equipment.

3 GENERAL ON ALCATEL-LUCENT
CUSTOMER DOCUMENTATION
Overview
Purpose
Contents
Products, productreleases, versions and Customer Documentation I-33
Handbook supply to Customers I-33
Aims of standard Customer Documentation I-33
Handbook Updating I-35
Customer documentation supply on CD-ROM I-37

Products, productreleases, versions and Customer
Documentation
A product is defined by the network hierarchical level where it can be inserted and
by the whole of performance and services for which it is meant.
A product evolves through successive productreleases which are the real
products marketed for their delivery at a certain productrelease availability date.
So, a product-release defines a set of hardware components and a software package
which, as a whole, identify the possible network applications and the equipment
performance which the specific productrelease has been designed, engineered and
marketed for.
In some cases a productrelease has further development steps, named versions,
that are born to improve or add some performance (mainly software) with respect to
the previous version, or for bug fixing purposes.
A productrelease has its own standard Customer Documentation, composed by one
or more handbooks.
A new version of a productrelease may or may not produce a change in the status
of the Customer Documentation set, as described in Alarm characteristics.
Handbook supply to Customers
Handbooks are not automatically delivered together with the equipment they refer to.
The number of handbooks per type to be supplied must be decided at contract level.
Aims of standard Customer Documentation
Standard Customer Documentation, referred to hereafter, must be always meant as
plantindependent.
Plantdependent documentation, if envisaged by the contract, is subjected to
commercial criteria as far as contents, formats and supply conditions are concerned
(plantdependent documentation is not described here).
Standard hardware and software documentation is meant to give the Customer
personnel the possibility and the information necessary for installing, commissioning,
operating and maintaining the equipment according to Alcatel-Lucent Laboratory
design choices.
In particular: the contents of the handbooks associated to the software applications
focus on the explanation of the manmachine interface and of the operating procedures
allowed by it; maintenance is described down to faulty PCB location and replacement.
Consequently, no supply to the Customers of design documentation (like PCB
hardware design and production documents and files, software source programs,
programming tools, etc.) is envisaged.
The handbooks concerning hardware (usually the Technical Handbook) and software
(usually the Operators Handbook) are kept separate in that any product changes do
not necessarily concern their contents.
For example, only the Technical Handbook might be revised because of hardware
configuration changes (e.g., replacing a unit with one having different P/N but the
same function).
On the other hand, the Operators Handbook is updated because of a new software
version but which does not concern the Technical Handbook as long as it does not
imply hardware modifications.
However, both types of handbooks can be updated to improve contents, correct
mistakes, etc..

Handbook Updating
The handbooks associated to the product-release are listed in Productrelease
handbooks.
Each handbook is identified by:
the name of the productrelease (and version when the handbook is applicable to the
versions starting from it, but not to the previous ones),
the handbook name,
the handbook P/N,
the handbook issue (usually first issue =1),
the handbook issue date. The date on the handbook does not refer to the date of print but to
the date on which the handbook source file has been completed and released for the
production.
Changes introduced in the same productrelease (same handbook P/N)
The edition and date of issue might change on future handbook versions for the
following reasons:
only the date changes (pointed out in the Table of Contents) when modifications are made to
the editorial system not changing the technical contents of the handbook.
the edition, hence the date, is changed because modifications made concern technical
contents. In this case:
the chapters modified with respect to the previous edition are listed in Table 1.5
Handbook configuration checkTable 1.5 Handbook configuration checkTable 1.5
Handbook configuration checkTable 1.5 Handbook configuration check;
in affected chapters, revision bars on the left of the page indicate modifications in text
and drawings.

Changes concerning the technical contents of the handbook cause the issue number to
increase (e.g. from Issue 1 to Issue 2). Slight changes (e.g. for corrections) maintain
the same edition but with the addition of a version character (e.g. from Issue 2 to Issue
2A). Version character can be used for draft or proposal editions.

NOTES FOR HANDBOOKS RELEVANT TO SOFTWARE
APPLICATIONS
Handbooks (or part of the handbook) relevant to software applications (typically
the Operators Handbooks) are not modified unless the new software version
distributed to Customers implies man-machine interface changes or in case of
slight modifications not affecting the understanding of the explained
procedures.
Moreover, should the screen prints included in the handbook contain the
productreleases version marking, they are not replaced in the handbooks
related to a subsequent version, if the screen contents are unchanged.
Supplying updated handbooks to Customers
Supplying updated handbooks to Customers who have already received previous issues
is submitted to commercial criteria.
By updated handbook delivery it is meant the supply of a complete copy of the
handbook new issue (supplying errata-corrige sheets is not envisaged).
Changes due to a new productrelease
A new productrelease changes the handbook P/N and the edition starts from 01.
In this case the modified parts of the handbook are not listed.

Customer documentation supply on CD-ROM
In the following CD-ROM means Customer Documentation on CD-ROM
Contents, creation and production of a CD-ROM
In most cases, a CD-ROM contains in read-only eletronic format the documentation of
one product-release(-version) and for a certain language.
In some other cases, the same CD-ROM can contain the documentation of different
product-release(-version)s for a certain language.
As a general rule:
CD-ROMs for Network Management products do not contain:
the Installation Guides
the documentation of system optional features that Customers could not buy from
Alcatel-Lucent together with the main applicative SW.
CD-ROMs for Network Elements products do not contain:
the documentation of system optional features (e.g. System Installation Handbooks
related to racks that Customers could not buy from Alcatel-Lucent together with the main
equipment).

A CD-ROM is obtained collecting various handbooks and documents in .pdf format.
Bookmarks and hyperlinks make the navigation easier. No additional information is
added to each handbook, so that the documentation present in the CD-ROMs is exactly
the same the Customer would receive on paper.
The files processed in this way are added to files/images for managing purpose and a
master CD-ROM is recorded.
Suitable checks are made in order to have a virus-free product.
After a complete functional check, the CD-ROM image is electronically transferred to
the archive of the Production Department, so that the CD-ROM can be produced and
delivered to Customers.
Use of the CD-ROM
The CD-ROM can be used both in PC and Unix WS environments.
The CD-ROM starts automatically with autorun and hyperlinks from the opened
Index document permit to visualize the .pdf handbooks
Other hyperlinks permit to get, from the Technical handbooks, the specific .pdf setting
documents.
In order to open the .pdf documents Adobe Acrobat Reader Version 4.0 (minimum)
must have been installed on the platform.
The CD-ROM doesnt contain the Adobe Acrobat Reader program. The Customer is in
charge of getting and installing it.
ReadMe info is present on the CD-ROM to this purpose.
Then the Customer is allowed to read the handbooks on the PC/WS screen, using the
navigation and zooming tools included in the tool, and to print selected parts of the
documentation through a local printer.
CD-ROM identification
Each CD-ROM is identified:
3.1. by the following external identifiers, that are printed both on the booklet and the CD-
ROM upper surface:
the name of the product-release(s) (and version if applicable),
a writing indicating the language(s),
the CD-ROM P/N (Factory P/N and ANV P/N),
the CD-ROM edition (usually first edition=01)
4.2. and, internally, by the list of the source handbooks and documents (P/Ns and editions) by
whose collection and processing the CD-ROM itself has been created.
CD-ROM updating
The list of source handbook/document P/Ns-editions indicated in CD-ROM
identification in association with the CD-ROM own P/N-edition, is also loaded in the
Alcatel-Lucent-Information-System as a structured list.
Whenever a new edition of any of such handbooks/documents is released, a check is
made in the Alcatel-Lucent-Information-System to identify the list of CD-ROMs that
must be updated to include the new editions of these handbooks/documents.
This causes the planning and creation of a new edition of the CD-ROM.
Updating of CD-ROMs always follows, with a certain delay, the updating of the single
handbooks composing the collection.

II-40 Alcatel-Lucent Proprietary 8DG-17561-AAAA
Part II: DESCRIPTIONS
Overview
Purpose

Contents
FUNCTIONAL DESIGN II-41
PHYSICAL CONFIGURATION II-70
FUNCTIONAL DESCRIPTION II-198
UNITS DESCRIPTION II-382
TECHNICAL SPECIFICATIONS II-564
HARDWARE SETTINGS II-727

8DG-17561-AAAA Alcatel-Lucent Proprietary II-41

4 FUNCTIONAL DESIGN
Overview
Purpose
Contents
Equipment basic configurations II-46
Network architectures II-58
Protection scenario II-67

The 1696MSPAN product is a WDM equipment intended for the so called enterprise
and metropolitan market. It is compliant with both ETSI and ANSI standards.
It provides a higher transmission capacity on a single optical fiber by multiplexing up
to 32 channels in the C-band at the following bit rates:
up to 2.5 Gbps (STM-16 / OC-48)
10 Gbps (STM-64/OC-192/10GbE WAN/10GbE LAN).
The 1696MSPAN is mainly composed of transponder cards connected to optical
Mux/Demux cards to manage the main WDM signal (combined signal) and launch it in
the fibre.
Both DWDM and CWDM technologies are addressed, allowing to build
a DWDM system (up to 32 channels) or
a CWDM system (up to 8 channels) or
a CWDM + DWDM system (up to 32 DWDM channels + up to 6 CWDM channels).
Client side, all the signals between 100Mbps to 2.7Gbps and 10Gbps native signals are
supported.
A Compact WDM architecture, 1696MS_C is proposed. It is a compact 13 slots
shelf enabling point-to-point and ring applications monitored by the Optical
Supervisory Channel through SPVM board.
Up to two 1696MS_C expansion shelves can be connected to the main one allowing 12
channels terminals or 4 channels OADM configurations.
Furthermore amplifiers can be placed inside the compact shelf.
The 1696MSPAN has been designed to offer the following main functions:
Multiple configurations and multiple network architectures
The 1696MSPAN can be configured as
line terminal
back-to-back terminal
Optical Add and Drop Multiplexer (OADM)
in line repeater (optical amplifier)
These basic configurations cover both point-to-point and ring network applications and with
or without amplifiers.
Different optical add-drop (OADM) nodes can be provided: 1, 2, 4, 8, 12, 16, 24, 32 channels
OADM (channels in Add/Drop in both direction).
Possibility to manage a remote NE named Customer Premises (CPE): it is a 1696MSPAN
or 1696MS_C located far from a Ring that can be linked to a NE of the ring (1696MSPAN or
1696MS_C) or to another NE (point-to-point link).
Multi-rate client signals
The 1696MSPAN is equipped with
multi-rate transponders (MCC3, WLA1, WLA2 and WLA3), which support client signals
from 125Mbps to 2.67Gbps
10 Gbps transponders (OCC10, TRBD1996) which support 9.953Gbps (STM-64/10GbE
WAN) and 10.3125 Gbps (10GbE LAN) client signals
TDM concentrators which support
client signals from 125Mbps to 1.25Gbps, by means of 4xANY_P
GbE/FC/FICON client signals (up to two), by means of 2xGE_FC
Data concentrators which support GbE client signals (up to eigth), by means of 8xGE
Client signals TDM concentration
4xANY_P board is able to concentrate up to 4 client signals by Time Division
Multiplexing, on a unique B&W or colored (C/DWDM) STM-16, in order to
optimize the use of each wavelength.
2xGE_FC performs the same feature on two clients (2xGbE/FC into one
B&W/C/DWDM STM-16).
Up to 32 DWDM / 8 CWDM / 38 mixed optical channels in a single NE
Each client signal is assigned to one of the 32 DWDM optical channels provided by
the tributaries. Each channel is associated to a fixed wavelength chosen in the third
window or C-band (1.550 nm).
Pure CWDM (8-channel) and mixed C/DWDM configurations (up to 38 channels)
can be provided.
Up to 16 bidirectional transponders (i.e. 8 ch. OADM with 1+1 optical ch. protection)
in one shelf.
Fully equipped system with up 32+32 bidirectional wavelengths in one rack (4
shelves per rack).
Flexible and scalable architecture
The 1696MSPAN design allows to begin modestly with a partially equipped
configuration (e.g.: 4 or 8 channels) that can be progressively upgraded as the traffic
demand grows (e.g.: 16, 24, 32 channels). In particular, from the initial configuration,
the transmission capacity can be increased without interrupting the existing traffic.

Protection
A protection at channel level is provided in ring application (Sub-Network
Connection Protection, SNCP) and point-to-point links (1+1). The 4xANY,
2xGE_FC and 8xGE drawers/clients protection is also provided (only in point-to-
point conf.
Supervision
Up to ten extra channels at 1510 nm and up to four 1310 nm, the Optical Supervision
Channel (OSC), can be optionally added to the aggregate signal before being
launched in the fiber. They can be used to supervise the WDM line and/or remote
CPEs (up to ten CPEs).
host SFP (up to 2.67Gbps) and XFP (10Gbps) pluggable optical modules are supported
According to the type, SFP modules are provided on MCC3 and 8xGE client
interfaces, 4xANY_P aggregate interface, WLA1, WLA2, WLA3 and 2xGE_FC
client and line/WDM interfaces.
XFPs are provided on OCC10 client interface, 8xGE line interface and TRBD1996
client & line interface.
Various types of SFP and XFP are provided. For details, refer to Figure 676, Figure
687, Small Formfactor Pluggable (SFP) optical modules, XFP optical modules, and to
the equipping boards description (see chapter 4)
SFP and XFP modules allow to fit the client optical interface with the bitrate
characteristics and/or to use CWDM/DWDM wavelengths.
Automatic power equalization
It consists of an automatic adjustment of the power per channel in order to maintain
the optical power at each node output as flat as possible. This functionality needs
OSMC (measuring the power per channel) and MVAC (adjusting the power value)
boards.
10Gbps backpanel
The 10Gbps backpanel, introduced in rel. 2.2, allows to link two adjacent OCC10s at 10.7 Gbps.
Performance Monitoring
Monitoring the performances of the client signals and the WDM transmission is
available for GBE, SDH and SONET frames. Up to 32 PM per NE are managed.
Management Interfaces
Formatted: Bullets and Numbering
As the product is intended to both ETSI and ANSI market, Q3 and TL1 interfaces are
supported. In ETSI market the NE is managed by the Alcatel-Lucent 1353NM and
1354RM by means of the Q3 interface.
User Interfaces
The product offers user interfaces for various overhead for data channels and orders
wires using (64 kbit/s, 2Mbps, RS232, audio).
Firmware download
The Firmware download on going status is displayed on Craft Terminal.
The 1696MSPAN supports non-traffic affecting firmware download.
Boards supporting non-traffic affecting firmware download: OAC2, OAC2_L,
OCC10_E, OCC10_EC, WLA3, OSMC, OSC, 2xGE_FC, 8xGE and 4xANY_P
(when declared as 4xANY_P).
The NE software automatically performs non-traffic affecting firmware download of
the MCC3, WLA3CD/CDOP, SPVM & OSC 4xANY_P (when declared as
4xANY_P) and OCC10 cards. It is the only firmware download performed by the NE
software in current rel.
N.B. Never unplug or configure a board while this is on Firmware
download state. Should this occur, the board will not restart and may have to
be returned for factory repair.

Equipment basic configurations
The 1696MSPAN and 1696MS_C design, allows the following basic configurations of
the equipment:
Line Terminal
Booster + Pre-amplifier Line Terminal
Optical Add and Drop Multiplexer (OADM) or back-to-back terminal (hub)
OADM or back-to-back terminal (hub) repeater
In line repeater
Customer Premises Equipment (CPE).
Line terminal
In line terminal configuration, the 1696MSPAN connects
up to 32 clients signals (1696MS_C = up to 12 channels) to an optical fibre DWDM line
up to 8 clients signals (1696MS_C too) to an optical fibre CWDM line
mixed configuarations (CWDM + DWDM) are allowed too, thus providing up to 32 DWDM
channels plus 6 CWDM channels.
In this configuration, the equipment takes place at both ends of point-to-point links.
U p t o 3 2 D W D M s i g n a l s o r
B & W C l i e n t s i g n a l s
U p t o t o 3 8
c l i e n t s i g n a l s
O n e f i b r e p a ir
M u x
D e m u x
S P V
M u x a n d D e m u x c a n b e
- O A D M o r O M D X i n
D W D M a p p l i c a t i o n s
- C M D X 2 / C D M D X i n
C W D M a p p l i c a t i o n s
U p to 3 2
W D M
s i g n a l s
T P D
( u p to 3 2 )
1 - > 3 2
S P V
U p t o 8 C W D M s i g n a l s o r
U p t o 3 2 D W D M p l u s
6 C W D M s i g n a l s

Figure 14: The 1696MSPAN in line terminal configuration


O n e f i b re p a ir
M u x
D m u x
S P V
T P D
( u p to 3 2 )
D W D M
S P V
C W D M
M u x ( e s )
D m u x ( e s )
D W D M
U
P

T
O

3
8

C
L
I
E
N
T

S
I
G
N
A
L
S
A g g r e g a t e
T P D
( u p t o 6 )
U p t o 6 C W D M s i g n a l s
U p to 3 2
D W D M
s i g n a l s

Figure 15: The 1696MSPAN in line terminal configuration (mixed configuration)

In the following some examples of Line Terminal configuration are provided.
Line Terminal basic configuration with two MCC3 transponders
O n e f i b r e p a i r
M
u
x
S P V
T X
W D M
R X
W D M
R X
B & W
T X
B & W
T X
W D M
R X
W D M
R X
B & W
T X
B & W
D
e
m
u
x
1
1
n
n
S P V
M C C 3
M C C 3

Figure 16: Line Terminal configuration block diagram with two MCC3
transponders

Line Terminal basic configuration with a WLA transponder
M
u
x
S P V
T X
W D M
R X
W D M
R X
B & W
T X
B & W
T X
W D M
R X
W D M
R X
B & W
T X
B & W
D
e
m
u
x
1
1
n
n
S P V
W L A

Figure 17: Line Terminal configuration block diagram with a WLA transponder (2
chs)

Line Terminal basic configuration with two 4xANY_P, 2xGE_FC, 8xGE
transponders
M
u
x
S P V
T X
W D M
R X
W D M
T X
D
e
m
u
x
1
1
n
n
S P V
4 x A N Y _ P
2 x G E _ F C
8 x G E
B & W
R X
B & W
1
T X
B & W
R X
B & W
2 / 4 / 8
T X
W D M
R X
W D M
T X
B & W
R X
B & W
1
T X
B & W
R X
B & W
2 / 4 / 8
2 c l i e n t s f o r 2 x G E _ F C , 4 c l i e n t s f o r 4 x A N Y _ P , 8 c l i e n t s f o r 8 x G E
4 x A N Y _ P
2 x G E _ F C
8 x G E

Figure 18: Line Terminal block diagram with two 4xANY_P or 2xGE_FC or 8xGE
transponders

Booster + Pre-amplifier Line terminal
1 x OAC board by terminal
This configuration is made up of a line terminal + one OAC. It applies only to DWDM
applications.
1 1 - > 3 2
U p t o 3 2 c l i e n t s i g n a l s
T P D
O F A S P V
U p to 3 2
W D M
s i g n a l s
( u p to 3 2 )
2
1
S P V
D W D M a p p l i c a t i o n s
U p t o 3 2 D W D M s i g n a l s
M u x
D e m u x

Figure 19: Booster + Pre-amplifier Line Terminal (1 x OAC) configuration with
DWDM technology

This configuration is made up of a line terminal + one OAC.
It applies only to mixed (CWDM + DWDM) applications. Only the DWDM channels
are amplified.
O n e f ib re p a i r
M u x
D m u x
S P V
T P D
( u p to 3 2 )
D W D M
S P V
U p t o 3 2 D W D M
p l u s
C W D M
M u x ( e s )
D m u x ( e s )
D W D M
U
P

T
O

3
8

C
L
I
E
N
T

S
I
G
N
A
L
S
A g g r e g a t e
U p t o 6 C W D M s i g n a l s
U p to 3 2
D W D M
s i g n a l s
O F A
2
1
T P D
( u p t o 6 )

Figure 20: Mixed (CWDM + DWDM) configuration: Booster + Pre-amplifier LT (1 x
OAC)

2 x OAC board by terminal
This configuration is made up of a line terminal + two OACs. It applies only to
DWDM applications.
U p u p t o 3 2 c l i e n t s i g n a l s
T P D
M u x
D e m u x
O F A
( u p to 3 2 )
1 - > 3 2
O F A S P V
A t t e n /
D C U 1 2
1 2
V O A
V O A
S P V
A t t e n /
D C U
D W D M a p p l ic a t i o n s
U p t o 3 2
D W D M s i g n a l s

Figure 21: The 1696MSPAN in Booster + Pre-amplifier Line Terminal (2 x OACs)
configuration

Optical Add and Drop Multiplexer (OADM) or back-to-back terminal (hub)
Optical Add and Drop Multiplexer (OADM)
In OADM configuration, the 1696MSPAN may add and drop a part of the traffic of an
optical WDM line, in both directions. In this configuration the equipment takes place
as linear add and drop multiplexer in:
point-to-point links
ring networks.
C l i e n t s i g n a l s
n - x
p a s s t h r o u g h c h a n n e l s
T P D
M u x
D m u x
T P D
M u x
D m u x
n
( u p t o 3 8 )
x a d d e d & d r o p p e d c h a n n e l s
n
( u p t o 3 8 )
S P V
S P V
S P V
S P V
D W D M a p p l ic a t i o n s
- C O A D i n C W D M a p
p l ic a t i o n s

Figure 22: The 1696MSPAN in OADM configuration

The OADM configuration, especially in ring network, allows the Sub-Network
Connection Protection (SNCP) of the added and dropped channels.
Back-to-back terminal (hub)

When ALL the DWDM line channels are added and dropped or electrically
regenerated, the 1696MSPAN is a back-to-back terminal or a hub node. There is no
optical pass through channel. SNCP may be performed on all the DWDM line
channels.
T P D
M u x
D m u x
T P D
M u x
D m u x
n
(3 8 m a x )
x a d d e d & d r o p p e d
c h a n n e ls
n
(3 8 m a x )
S P V
S P V
S P V
S P V
D W D M a p p li c .
- C M D X / C D M D X i n
C W D M a p p li c a t i o n s

Figure 23: The 1696MSPAN in back-to-back terminal configuration

In the following some examples of OADM / back-to-back terminal configuration are
provided.
The OADM / back-to-back terminal configuration is also possible with 4xANY_P
equipped with coloured SFPs.
Examples of OADM or back-to-back terminal configurations
M
u
x
S P V
T X
W D M
R X
W D M
M C C 3
T X
W D M
R X
W D M
R X
B & W
M C C 3
T X
B & W
R X
B & W
T X
B & W D
e
m
u
x
S P V
M
u
x
S P V
D
e
m
u
x
S P V

Figure 24: OADM or back-to-back terminal configuration block diagram with two
MCC3

The above configuration is also possible with
two 4xANY_P (managing up to four clients each), equipped with WDM SFP
two 2xGE_FC (managing up to two clients each), equipped with WDM SFP

M
u
x
S P V
T X
W D M
R X
W D M
R X
B & W
D
e
m
u
x
S P V
W L A
8 x G E *
T X
B & W
T X
W D M
R X
W D M
R X
B & W
T X
B & W
M
u
x
S P V
D
e
m
u
x
S P V
* I n c a s e o f 8 x G E i s u s e d , u p t o 8 B & W c l i e n t s a r e a v a i l a b l e
Figure 2425: OADM or back-to-back terminal configuration block diagram with
WLA

The above configuration is possible with
one WLA (managing two WDM channels each), equipped with WDM SFP, line side
one 8xGE (managing eigth clients each), equipped with two WDM XFP, line side (one XFP
per WDM line).

OADM or back-to-back terminal configuration with WLA as regenerator for two
chs
M
u
x
S P V
T X
W D M
R X
W D M
R X
W D M
W L A
T X
W D M
T X
W D M
R X
W D M
R X
W D M
T X
W D M
D
e
m
u
x
S P V
M
u
x
S P V
D
e
m
u
x
S P V

Figure 2526: OADM or b-to-b configuration block diagram with WLA as
regenerator for 2 chs

OADM or back-to-back terminal (hub) repeater
1 x OAC board in West side + 1 x OAC board in East side
This configuration is made up of a OADM or back-to-back (hub) terminal + one OAC.
In the example of Figure 27 an OADM repeater configuration is shown. It applies
only to DWDM applications.

n - x
T P D
M u x
D m u x
T P D
M u x
D m u x
O F A O F A
n
( u p t o 3 2 )
c h a n n e ls
n
( u p t o 3 2 )
S P V
S P V S P V
S P V
V O A
V O A
1
2 1
2
U p t o 3 2
W D M
s i g n a ls
M u x a n d D e m u x c a n b e O A D M o r
O M D X i n D W D M a p p li c a t i o n s

Figure 2627: OADM repeater (1 OAC west side + 1 OAC east side) configuration

OADM or back-to-back terminals can be equipped with amplifiers on West side or
East side or both sides. In case of mix of coarse+dense channels, amplifiers amplify
only dense channels. In this case, Coarse muxes are before the left amplifier and after
the right amplifier. Refer to Figure 20 and Figure 37.
2 x OAC board in West side + 2 x OAC board in East side
This configuration is made up of a OADM or back-to-back (hub) terminal + two
OACs. In the example of Figure 28 an OADM repeater configuration is shown. It
applies only to DWDM applications.
n - x
T P D
M u x
D m u x
O n e f i b r e p a ir
T P D
n
( u p t o 3 2 )
c h a n n e ls
n
( u p t o 3 2 )
M u x a n d D m u x c a n b e O A D M o r O M D X i n D W D M a p p l i c a t i o n s
O F A O F A S P V
1 2
1 2
V O A
1
O F A S P V
S P V
V O A
M u x
D m u x
O F A
2
1 V O A 2
S P V
T O / F R O M M U X / D M U X
T O / F R O M
O F A
V O A
A tte n /
D C U
A tte n /
D C U
A t t e n /
D C U
A t t e n /
D C U
U p t o 3 2

Figure 2728: OADM repeater (2 OACs west side + 2 OACs east side) configuration

OADM or back-to-back terminals can be equipped with amplifiers on West side or
East side or both sides. In case of mix of coarse+dense channels, amplifiers amplify
only dense channels. In this case, Coarse muxes are before the left amplifier and after
the right amplifier. Refer to Figure 20 and Figure 37.
In line repeater
In line repeater configuration, the 1696MSPAN is a bidirectional WDM amplifier,
without transponders nor MUX/DEMUX functions. This configuration applies only to
DWDM channels.
In this configuration the equipment takes place as line repeater in:
point-to-point links
ring networks.
O n e f ib re p a i r
n
( u p t o 3 2 )
n
( u p t o 3 2 )
A t t e n u a t o r o r D C U
A t t e n u a t o r o r D C U
O F A S P V
V O A
S P V
S P V
S P V
V O A
W D M
s i g n a l s
1
2 1
2
O F A

Figure 2829: The 1696MSPAN in repeater configuration

Customer Premises Equipment (CPE)
A Customer Premises equipment (CPE) is a 1696MS_C or 1696MS located far from a
ring which can be linked to a NE of the ring (1696MS or 1696MS_C) or to another NE
in a point to point link.
In that configuration it is possible to manage a remote NE with no obligation to
multiplex the optical signal (see Figure 34).
Up to 14 supervised CPE links can be installed on one NE in current release.

Network architectures
Point-to-point links
A point-to-point link, based on 1696MSPAN, is obtained with:
a 1696MSPAN in line terminal configuration at each end of the link,
eventually, one or more 1696MSPAN in OADM configuration.
L i n e
T e r m i n a l
O A D M
L i n e
T e r m i n a l
C l i e n t
e n d
t r a f f ic
C l i e n t A d d & D r o p t r a f f i c
R e p e a t e r
C l i e n t
e n d
t r a f f ic

Figure 2930: Point-to-point link

Ring networks
A two fibers ring network is obtained with 1696MSPAN equipment in back-to-back
terminal and OADM configurations.
O A D M
B - t o - B
C l i e n t e n d t r a f f i c
C lie n t
A d d & d r o p
t r a f f i c
I n L i n e
R e p e a t e r
O A D M
r e p e a t e r
C lie n t
A d d & d r o p
t r a f f i c

Figure 3031: Ring configuration

Ring interconnection (with or without protection)
NE
NE
NE
NE
NE
NE
NE
NE
Black & White links
with superv ision

Figure 3132: Interconnected rings with data on customer ports and supervision
carried by OSC

Such a ring interconnection is done through interconnection of customer ports of the
adjacent NEs of the interconnected rings. Supervision is transmitted from one ring to
the other with optical insertion of the OSC in one Black & White link through a
SPV_F_C board. The NEs host of the interconnection do not need to be colocated.
NE
NE
NE
NE
NE
NE
NE
NE
Superv ision through
interconnected LAN_Q boards
LAN_Q
LAN_Q

Figure 3233: Interconnected rings with data on customer ports and LAN_Q
management

Such a ring interconnection is done through interconnection of customer ports of the
adjacent NEs of the interconnected rings. Supervision is transmitted from one ring to
the other through the electrical connection of the LAN_Q boards (only the DCC). This
type of interconnection can only be performed in ETSI market. The NEs host of the
interconnection need to be colocated.
CPE configurations
CPE
CPE
CPE
CPE
NO OSC
OSC
NE
NE NE
NE
NE

Figure 3334: CPE configuration

CPE consists in remote 4xANY, 2xGE_FC, WLA or MCC transponders. Management
is performed through OSC. Three different channel configurations can be transmitted
to/from a CPE:
one Black & White channel (1310 nm)
one colored channel (1550 nm)
one 1310 nm and one 1550 nm channels
up to 8 CWDM channels.

CPE
CPE
NE
CPE
CPE
CPE
CPE
CPE
CPE
CPE
CPE
CPE

Figure 3435: Bicycle wheel configuration: NE on a ring adressing 10
supervised CPE links

One NE situated on a ring can support several CPE links (up to 10 supervised CPE
links).
Interworking with other Alcatel-Lucent NEs
4xANY concentrator
As the 4xANY concentrator realizes a real STM-16 frame, the concentrated signal can
pass trough an ADM network.
2xGbE_FC
As the 2xGE_FC uses Virtual Concatenation and frames the virtual concatenated
group in STM-16 frame (or SONET OC-48 frame), the concentrated signal can pass
trough an ADM network.
The interworking with other Alcatel-Lucent boards or any other provider equipment is
possible if the corresponding board uses GFP-T mapping and Virtual concatenation
using the VC-4-7v virtual group as for GbE clients (and in further release, VC-4-6v as
for Fibre Channel or FICON clients).


1696MS CWDM/DWDM as CPE
Taking advantage of the CWDM features of release 2.2A (MCC3, WLA1, WLA2,
WLA3, 4xANY_P, 2xGE_FC, CMDX2, CDMDX, COAD boards), it is possible to
implement the transmission on CWDM/DWDM wavelengths.
Figure 37 shows a CPE link based on CWDM technology.
MCC3 in the core ring enables to generate CWDM wavelengths on the client side.
In the CPE, 4xANY_P, 2xGE_FC or WLA1/2/3 boards give the signal back to the
customer in a B&W wavelength.
SPV is inserted/extracted in the 1510nm channel CMDX2, COAD, CDMDX
Input/Output if the 1310nm port is not available, or in the 1310nm port of the CMDX2,
COAD, CDMDX or F1310 filter Input/Output (when 1310nm port is available).
C W D M
M u x /
D e m u x
M C C 3
M C C 3
D W D M
M u x / D e m u x
M C C 3
M C C 3
M u x / D e m u x
D W D M
C W D M
M u x /
D e m u x
4 X A N Y _ P
W L A 3
W L A 2
4 X A N Y _ P
S P V S P V
C W D M
1 6 9 6 M S 1 6 9 6 M S

Figure 3536: CPE link based on CWDM technology

C W D M
M u x /
D e m u x
M C C 3
M C C 3
D W D M
M u x / D e m u x
M C C 3
M C C 3
M u x / D e m u x
D W D M
C W D M
M u x /
D e m u x
4 X A N Y _ P
W L A 3
W L A 2
4 X A N Y _ P
S P V S P V
C W D M
1 6 9 6 M S 1 6 9 6 M S

Figure 3637: CPE link based on CWDM technology with 1310nm port

1696MS Mixed CWDM/DWDM as CPE
Cascade of Coarse and Dense multiplexer-demultiplexer is possible in order to
transmit through a single fiber both coarse and dense channels. Dense channels may be
amplified but not the coarse ones.
On is shown mixed transmissions based on CWDM and DWDM technologies. Dense
multiplexers or amplifiers can be connect to coarse extra port (if exists) or 1530 or
1550 coarse channel ports. 1310 nm SPV is inserted/extracted in the SPV I/O ports of
the COAD_S.
C W D M
M u x /
D e m u x
S P V
C W D M + D W D M
D W D M
M u x /
D e m u x
O A C
C W D M
M u x /
D e m u x
S P V
C W D M + D W D M
D W D M
M u x /
D e m u x
O A C
D W D M o n l y
D W D M
M u x /
D e m u x
C W D M
M u x /
D e m u x
D W D M o n l y
D W D M o n l y
O A C
D W D M o n l y
C W D M + D W D M

Figure 3738: Mixed transmission based on CWDM and DWDM technologies

Host systems (ADM..)
Host systems can be all data equipments whose optical output signals have the
following bit-rates
between 100 and 2.7 Gbps
10 Gbps.
They can be :
SDH/SONET (STM-1/OC-3, STM-4/OC-12, STM-16/OC-48, STM-64/OC-192) equipments
IP routers
Fast Ethernet, GbE, 10 GbE WAN, 10 GbE LAN, FC, FICON, ESCON... equipments

1696MS
4 x ANY
Tx
Rx Tx
Rx Tx
Rx
MUX/
DEMUX
SCHEME
Tx1
Rx1
Tx
Rx
Tx
Rx
CLIENT SYSTEM
Tx
Rx Tx
Rx Tx
Rx Tx8
Rx8
CLIENT SYSTEM
SDH/ETH/FC...
Tx
Rx
100Mto 2.5Gbps
10GBE WAN
2.5Gbps B&W
1Gbps B&W
100Mbps to 2.7Gbps B&W
CLIENT SYSTEM
Tx
Rx
SONET
OCC10
Tx
Rx Tx
Rx TxN
RxN
10Gbps SDH
10Gbps B&W
10Gbps B&W
2.5Gbps
WDMSIGNAL
Tx
Rx
CLIENT SYSTEM
GBE/FICON
Tx
Rx
CLIENT SYSTEM
FC/ESCON/FE
Tx1
Rx1
Tx4
Rx4
GBE/FICON
FC/ESCON/FE
UP TOFOUR
10Gbps
WDMSIGNAL
10Gbps
WDMSIGNAL
AGGREGATE
MULTIPLEXED
SIGNAL
U P T O 8 C W D M
CLIENT SYSTEM
Tx
Rx
OCC10
Tx
Rx Tx
Rx Tx7
Rx7
10Gbps LAN
10Gbps B&W
10Gbps
WDMSIGNAL
STM1/4, OC3/12,
STM1/4, OC3/12,
Tx
Rx
GBE/FC/FICON
CLIENT SYSTEM
MCC3
Tx
Rx Tx6
Rx6
100Mto 2.7G
WDMSIGNAL
Tx2
Rx2
2
x
G
E
_
F
C
Tx
Rx Tx4
Rx4
2.5Gbps
WDMSIGNAL
MCC3
1
4
6
7
8
N
4 x ANY
Tx
Rx Tx2
Rx2
2.5Gbps
WDMSIGNAL
Tx
Rx
CLIENT SYSTEM
GBE/FICON
Tx
Rx
CLIENT SYSTEM
FC/ESCON/FE
Tx1
Rx1
Tx4
Rx4
GBE/FICON
FC/ESCON/FE
UP TOFOUR
STM1/4, OC3/12,
STM1/4, OC3/12,
2
100Mbps to 1.25Mbs B&W
Tx
Rx
GBE/FICON
CLIENT SYSTEM
FC/ESCON/FE
STM1/4/16, OC3/12/48
Tx
Rx
WLA2
Tx
Rx Tx3
Rx3
100M to 2.7G
WDM SIGNAL
3
WLA3
WLA1
Tx
Rx
1Gbps B&W
GBE/FC/FICON
CLIENT SYSTEM
Tx1
Rx1
Tx
Rx
1Gbps B&W
GBE
CLIENT SYSTEM
Tx8
Rx8
8xGE
Tx
Rx Tx5
Rx5
10Gbps
WDM SIGNAL
5
Tx
Rx
1Gbps B&W
GBE
CLIENT SYSTEM Tx1
Rx1
100Mbps to 1.25Mbps B&W
100Mbps to 2.7Gbps B&W
U P T O 3 2 D W D M
U P T O 3 8 C / D W D M
UP TOEIGHT
OCC10

Figure 3839: Connection to host equipments

Protection scenario
O-SNCP
In a ring, the SNCP at OCh level can be provided either in back-to-back terminals or in
OADM equipment, as shown in Figure 40 below.
At the transmit side, the signal is broadcasted on both arms of the ring and the
available signal is selected at the receive side (when failure of the other signal).
b a c k - t o - b a c k t e rm i n a l
M u x
D m u x
M u x
D m u x
S p l i t a n d s e l e c t p e r f o r m e d i n o p t i c a l
d o m a i n ( b y s w i t c h i n g - o f f t h e u s e r T x )
O A D M o r b a c k - t o - b a c k
S p l i t a n d s e l e c t p e r f o r m e d i n o p t i c a l
d o m a i n ( b y s w i t c h i n g - o f f t h e u s e r T x )
a d d e d c h a n n e l s d ro p p e d c h a n n e l s

Figure 3940: Optical SNCP protection scheme: with back-to-back terminals or
OADM

The split and select function is optically performed.
The protection is optically performed, too; the function is ensured by 2 optical splitters.

The selection is done by switching-off the user Tx corresponding to the path in failure
and re-activating the protecting one (see Figure 41).
W D M
W D M T x
W D M T x W D M R x
W D M R x u s e r T x
u s e r T x
u s e r R x
u s e r R x
o p t i c a l s p l i t t e r o p t i c a l c o u p l e r
o p t i c a l o p t i c a l o p t i c a l e l e c t r i c a l e l e c t r i c a l
w o r k i n g
p r o t e c t i n g
l a s e r : O F F
l a s e r : O N

Figure 4041: Optical SNCP way of working

Table 4.1 O-SNCP Supported protection schemes
CONFIGURATION O-SNCP PROTECTION
MCC3; MCC3 + OAC
MCC3 + 4xANY_P only MCC3 is protected
MCC3 + 2xGE_FC only MCC3 is protected
WLAxx_OP + 2xGE_FC only WLA is protected
4xANY_P each client/drawer can be protected
2xGE_FC each client can be protected
8xGE each client can be protected
OCC10; OCC10 + OAC
TRBD1996; TRBD1996 + OAC Only TRBD1996 is protected
WLAxx_OP the two channels are 1+1 protected, not the board

Optical Transmission Section Protection
OTSP protection scheme is carried out using the OMSP board.
In a point-to-point link, with a splitter an a switch located after the amplifiers, it is
possible to protect the line. The amplifiers are not mandatory.
M
u
x
D
e
m
u
x
M
u
x
D
e
m
u
x
S u b - N e t w o r k
O M S P O M S P

Figure 4142: OTSP protection scheme in a point-to-point network configuration

After being multiplexed, the signal is amplified (or not) and broadcasted onto 2 lines.
At reception, before being demultiplexed, the MAIN line (port #2) is selected by the
OMSP board.
Switching occurs on ILOS detection on OMSP board on MAIN path (port #2) and no
ILOS on OMSP board on SPARE path (port #3).
The OSC, if present, is inserted in the amplifier boards. If amplifiers are not present,
OSC is inserted in Mux/DeMux boards. Thus the OSC passes through the OMSP
board, it is then OTSP-protected.


5 PHYSICAL CONFIGURATION
Overview
Purpose
Contents
Rack design II-72
1696MS shelf physical configuration II-73
1696MS_C (compact shelf) physical configuration II-111
Equipment connections II-148
Units front view II-152

The 1696MSPAN has been designed to offer a record size integration to meet the
challenging requirements of the metropolitan environment. A fully loaded
1696MSPAN system with 32 protected channels can be housed in one standard ETSI
or ANSI racks.
The 1696MSPAN employs a common shelf type for the different network elements.
Up to four shelves can be fit into a single rack.

Rack design
The 1696MSPAN mechanical design allows to put up to four shelves in a single rack.
It is compatible with the following mechanical standards
a 2000 mm high ETSI rack,
a 1950 mm high NEBS 2000 rack.
The depth is compliant with the 300 mm deep ETSI rack (no limitations in ANSI
rack).
Top rack unit
Air deflector
600 mm
2
0
0
0
Fiber storage
Power Distribution Unit
Air deflector
600 mm
1
9
5
0
OPTINEX RACK
NEBS 2000 RACK
(ETSI)

Figure 4243: Rack organization, 32 channel bi-directional terminal

1696MS shelf physical configuration
The 1696MSPAN shelf is made up by an empty shelf and the boards and units
installed in it.
One 1696MSPAN system is composed by one mandatory main/master shelf and up to
three slave/expansion shelves. The board composition determines the shelf type:
master or slave.
1696MS Empty shelf
1696MS shelf organization
The shelf is organized into three parts (one main and two extension), hosting 49 boards
or unit slots:
the main part, which is the upper part and comprises the slots from 1 to 24; here are located
the 285 mm high boards performing the elaboration of the signal.
This part hosts the equipment and shelf controller, up to 16 transponders, up to 11 TDM
concentrators (4xANY_P), optical amplifiers, one mux/demux for LT or two mux/demux or
OADM boards (east/west) for hub/OADM application, optical supervisory channel...
the first extension part, which is the middle part and comprises the slots from 25 to 48; here
are located the 88 mm high boards, herebelow listed
two redundant -48V power supply boards
one LAN access board for the CT or the EML (LAN_Q) connection (in master shelf
only)
one LAN access board for inter-shelf communication (LAN_I)
one house-keeping board with 8 x input access + 8 x output access (HK) (in master shelf
only)
one remote alarms board (RAI) (in master shelf only)
two user interface boards (UIC) (in master shelf only)
one optical protection channel board (OPC) per protected channel (optical SNCP)
the second extension part, which is the bottom part and comprises slot 49, where are located
the fans.
All the optical and electrical connectors are located on the front of the units to be
easily accessed.
This chapter illustrates the physical structure, layout and composition, coding and
partition of the shelf.
The Equipment shelf front view is illustrated here below, in Figure 44 and in Figure
45.
The units codes and partition are listed in Table 5.1 1696MS boards and units listTable
5.1 1696MS boards and units listTable 5.1 1696MS boards and units listTable 5.1
1696MS boards and units list.
M a i n p a r t ( s l o t 1 t o 2 4 )
F i r s t e x t e n s i o n p a r t ( s l o t 2 5 t o 4 8 )
S e c o n d e x t e n s i o n p a r t ( s l o t 4 9 )

1696MS Shelf dimensions
FANS
21'' (533.4 mm)
2
8
5
4
0
4
4
3
96 TE(24 x 4 TEwide slots)
8
8
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
49
1
5

Figure 4344: Shelf dimensions

1696MS Shelf configuration rules
The board composition and placement of a shelf respects some constraints at the
hardware, software and functional levels.
If general rules are followed, a certain number of standard configurations can be
obtained in which boards can be exchanged without functionality loss.
1696MS configuration constraints
Optical Sub-Network Channel Protection requires:
transponder boards (TRBD 1996, MCC, OCC10, 2xGE_FC) must be placed in consecutive
slots: [4,5] or [6,7] or [8,9] or [10,11] or [14,15] or [16,17] or[18,19] or [20,21]
each Optical Protecting Channel boards (OPC) must be placed
- when protecting transponders, in one of the two slots, located under the
corresponding transponder (MCC/OCC10) pair (e.g.: the OPC in slot 28 or 29
corresponds to the slots 4-5). The transponder above the OPC is the main one and
the other is the protecting transponder (e.g.: OPC in slot 28 implies main
transponder in slot 4 and protecting one in slot 5)
- when two 2xGE_FC boards are used in client protection configuration, the
2xGE_FC on the right side always contains the SFP MAIN (or protected), and the
board on the left side, the SFP SPARE (or protecting). If the 2xGE_FC boards are
provisioned in slots #n and #n+1, then:
client #1, is protected using OPC in slot #n+25 (on the right side)
client #2, is protected using OPC in slot #n+24 (on the left side)
- when protecting 4xANY_P client signals, in the four slots located below the
corresponding 4xANY_P pair; the 4xANY_P on the right side contains the
MAIN/protected drawers. Starting from the left the first OPC protects drawer 2, the
second one drawer 1, the third one drawer 3, the fourth one drawer 4; in case of
4xANY_P in slots 6,7,8,9, the OPC in slot 30 protects drawer 2, that in slot 31
protects drawer 1, that in slot 32 protects drawer 3, that OPC in slot 33 protects
drawer 4
if 4xANY_P are used with few channels, all the boards are preferably put in a single shelf
if TDM concentrators are used with more than 8 channels, 4xANY_P boards are preferably
put in one dedicated shelf
using MVAC (for power adjustment of external colored wavelengths, of channel or band
optical passthrough and for transponder post-emphasis, channel/band loop power adjustment)
the boards allocation depends on the needed configuration (for the boards location refer to
installation handbook).
MVAC10_2 is mandatory in case of 8xGE or TRBD1996 use, for DWDM XFP post-
emphasis.

1696MS Typical shelf configuration
Figure 45 shows a typical configuration of a fully equipped shelf and Table 5.1
1696MS boards and units listTable 5.1 1696MS boards and units listTable 5.1 1696MS
boards and units listTable 5.1 1696MS boards and units list, resumes the possibilities
that satisfy the configuration constraints.
FANS
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
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1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
49
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(*)
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(X)
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(*) Master
shelf only
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Figure 4445: Typical fully equipped shelf

In the first extension part, except for the PSC and the LAN boards, the placement of
the boards has no hardware limitation. However, here is the most frequently used
configuration:
the slots 28 to 35 and 38 to 45 are dedicated to the Optical Protection Channel board (OPC),
the slot 36 hosts the HouseKeeping board (HK),
the slot 37 hosts the Remote Alarm Interface board (RAI),
the slots 46 and 47 hosts the User Interface Card (UIC).
Mandatory boards are:
Slot 1 is dedicated to ESC board (Master and expansion (SC) shelves).
Slots 25 and 48 are dedicated to the Power Supply Cards (Master and Expansion shelves).
Slot 26 of the master shelf is dedicated to the LAN_Q card.
Slot 27 of the slave shelf is dedicated to the LAN_I card.
Slot 49 hosts the FANs card (Master and Expansions).
N.B. Particular setting of the LAN board (slot 26) on the Master shelf:
On this board, the rotary switch SW3 corresponding to the Equipment Type must
be set in 5 value (hexadecimal), otherwise the Shelf Controller will not start.
When the straps on the board are forced (by pass state) to be LAN #26 or LAN #27
board, take care to insert the LAN board in the correct slot.
N.B. the slot 2 can be used for OSMC; it is an optional card.
1696MS Part list
Table 5.1 1696MS boards and units listTable 5.1 1696MS boards and units listTable
5.1 1696MS boards and units listTable 5.1, 1696MS boards and units list, in the
following paragraph lists the names and codes of the items and units making up the
Equipment Shelf (see 1696MS Shelf configuration rules section, 1696MS shelf and
boards designation and reference).
Furthermore, for any item the position and the maximum quantity that can be allocated
inside a single shelf, are indicated too.
Such table reports the following information :
- Item Name
- The Acronym identifying the units
- ANV part numbers (3ALXXXXX XXXX)
- Maximum quantity per each shelf
- Position of the unit inside the equipment. Refer to Figure 44 and Figure 45 for slot
numbering.
- Number of explanatory notes
Table 5.2 1696MS explanatory notesTable 5.2 1696MS explanatory notesTable 5.2
1696MS explanatory notesTable 5.2 1696MS explanatory notes reports the
explanatory notes.

1696MS shelf and boards designation and reference

Table 5.1 1696MS boards and units list
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
MECHANICAL STRUCTURE
1696MSPAN shelf 3AL 86607 AA-- - -- [1]
Shelf 1696MSPAN 10G 3AL 95270 AA-- - -- [2]
1696MSPAN FB shelf 3AL 86607 AC-- - --
Shelf FB 1696MSPAN 10G 3AL 95270 AB-- - -- [2]
21 D.C.U. assembled support 3AN 44747 AA-- 2 --

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
TRIBUTARIES
Enhanched Multirate CH 19x.x00-
19x.x00 with SFP optical
modules, client side
MCC3 192.0-192.1 3AL 95150 AA-- 16 4->11
14->21
[3]
MCC3 192.2-192.3 3AL 95150 AB--
MCC3 192.5-192.6 3AL 95150 AC--
MCC3 192.7-192.8 3AL 95150 AD--
MCC3 193.0-193.1 3AL 95150 AE--
MCC3 193.2-193.3 3AL 95150 AF--
MCC3 193.5-193.6 3AL 95150 AG--
MCC3 193.7-193.8 3AL 95150 AH--
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
TRIBUTARIES
MCC3 194.2-194.3 3AL 95150 AJ--
MCC3 194.4-194.5 3AL 95150AK--
MCC3 194.7-194.8 3AL 95150 AL--
MCC3 194.9-195.0 3AL 95150 AM--
MCC3 195.2-195.3 3AL 95150 AN--
MCC3 195.4-195.5 3AL 95150 AP--
MCC3 195.7-195.8 3AL 95150 AQ--
MCC3 195.9-196.0 3AL 95150 AR--
OCC10 XFP APD CH 192.000 OCC10 _E 3AL 95238 AA-- 16 4->11
14->21
[4]
OCC10 XFP APD CH 192.100 3AL 95238 AC--
OCC10 XFP APD CH 192.200 3AL 95238 AE--
OCC10 XFP APD CH 192.300 3AL 95238 AG--
OCC10 XFP APD CH 192.500 3AL 95238 AN--
OCC10 XFP APD CH 192.600 3AL 95238 AQ--
OCC10 XFP APD CH 192.700 3AL 95238 AS--
OCC10 XFP APD CH 192.800 3AL 95238 BA--
OCC10 XFP APD CH 193.000 3AL 95238 BE--
OCC10 XFP APD CH 193.100 3AL 95238 BG--
OCC10 XFP APD CH 193.200 3AL 95238 BL--
OCC10 XFP APD CH 193.300 3AL 95238 BN--
OCC10 XFP APD CH 193.500 3AL 95238 BS--
OCC10 XFP APD CH 193.600 3AL 95238 CA--

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
TRIBUTARIES
OCC10 XFP APD CH 193.700 3AL 95238 CC--
OCC10 XFP APD CH 193.800 3AL 95238 CE--
OCC10 XFP APD CH 194.200 3AL 95238 CP--
OCC10 XFP APD CH 194.300 3AL 95238 CR--
OCC10 XFP APD CH 194.400 3AL 95238 CT--
OCC10 XFP APD CH 194.500 3AL 95238 DB--
OCC10 XFP APD CH 194.700 3AL 95238 DF--
OCC10 XFP APD CH 194.800 3AL 95238 DH--
OCC10 XFP APD CH 194.900 3AL 95238 DM--
OCC10 XFP APD CH 195.000 3AL 95238 DP--
OCC10 XFP APD CH 195.200 3AL 95238 DT--
OCC10 XFP APD CH 195.300 3AL 95238 EB--
OCC10 XFP APD CH 195.400 3AL 95238 ED--
OCC10 XFP APD CH 195.500 3AL 95238 EF--
OCC10 XFP APD CH 195.700 3AL 95238 EM--
OCC10 XFP APD CH 195.800 3AL 95238 EP--
OCC10 XFP APD CH 195.900 3AL 95238 ER--
OCC10 XFP APD CH 196.000 3AL 95238 ET--
OCC-10_XFP_CWDM 1530NM OCC10_EC 8DG 81002 AA-- 16 4->11
14->21
[5]
OCC-10_XFP_CWDM 1550NM 8DG 81002 AB--
OCC-10_XFP_CWDM 1570NM 8DG 81002 AC--
OCC-10_XFP_CWDM 1590NM 8DG 81002 AD--
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
TRIBUTARIES
OCC-10_XFP_CWDM 1610NM 8DG 81002 AE--
TRBD1996 TRBD1996 3AL97706 AA-- 16 4->11
14->21

DUAL BASIC WLA MODULE-
3R
WLA1C 3AL 97529 BA-- 16 4->11
14->21
[6]
DUAL ENH WLA MODULE-
2X3R
WLA2C 3AL 97657 AA--
DUAL ENH WLA MODULE -
2X3R W/ OPC
WLA2C_OP 3AL 97657 AB-- [7]
DUAL C/DWLA3 CARD-SFP WLA3CD 3AL 97795 BA-- [8]
DUAL C/DWLA3 CARD-SFP-
OPC
WLA3CDOP 3AL 97795 BB-- [9]
2XGE 2xGE_FC 3AL 97800 AA-- [10]
8xGE IN 10G 8xGE 3AL 97875 AA-- [11]
4xANY Host fully pluggable 4xANY_P 3AL 95063 AA-- 11 2;4;6;8;
10;12;
14;16;
18;20;
22
[12]
[13]

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
TRIBUTARY SUBSYSTEM
4 X ANY SDH/SONET
cartridge/2
SDH-SONET_1310
Drawer
3AL 95284 AA-- -- -- [14]

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
TRIBUTARY SUBSYSTEM
4 X ANY 1310nm LS cartridge LF_1310_2 Drawer 3AL 86674 AA-- -- -- [15]
4 X ANY HS cartridge HF_1310 Drawer 3AL 86672 AA-- -- -- [16]
4 X ANY LS optical cartridge LF_850 Drawer 3AL 86869 AA-- -- -- [17]
[13]
4 X ANY 850nm HS cartridge HF_850 Drawer 3AL 86870 AA-- -- -- [18]
[13]
4 X ANY Electrical DV cartridge 3AL 95267 AA-- -- -- [19]
Multiple attenuator card MVAC 3AL 86892 AA-- 18 4->21 [20]
MVAC10 MVAC10 3AL 97848 AA-- 20 2->21
MVAC10_2 3AL97848AB-- 20 2->21

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
B&W SFP MODULES
OPTO TRX Supervisory Channel 2M 1AB 20986 0001 -- -- [21]
OPTO TRX SFP S-1.1 W/DDM S-1.1DDM 1AB 19467 0004 -- -- [22]
OPTO TRX SFP L-1.1 L-1.1 1AB 19467 0002 -- --
OPTO TRX SFP L-1.2 L-1.2 1AB 19467 0003 -- --
OPTO TRX SFP S-4.1 DDM S-4.1DDM 1AB 19636 0004 -- --
OPTO TRX SFP L-4.1 DDM L-4.1DDM 1AB 19636 0006 -- --
OPTO TRX SFP I-16.1 DDM I-16.1DDM 1AB 19637 0005 -- --
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
B&W SFP MODULES
OPTO TRX SFP S-16.1 DDM S-16.1DDM 1AB 19637 0006 -- --
OPTO TRX SFP L-16.2 DDM L.16.2DDM 1AB 19637 0009 -- --
OPTO TRX SFP S-16.1
ANYRATE DDM
S-16-ADDM 1AB 19637 0007 -- --
OPTO TRX SFP 100 BASE LX 100B LX 1AB 21471 0001 -- --
OPTO TRX 1.25GBE SFP LX
DDM
1GbELXDDM 1AB 18728 0031 -- --
OPTO TRX 1.25GBE SFP SX
DDM
1GbESXDDM 1AB 18728 0033 -- --
OPTO TRX 1.25GBE SFP-ZX
DDM
1GbEZXDDM 1AB 18728 0042 -- --
OPTO TRX SFP FC/2FC MM
DDM
FC/2FCmm 1AB 18728 0037 -- --
OPTO TRX SFP FC/2FC SM
DDM
FC/2FCsm 1AB 18728 0038 -- --

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
B&W XFP MODULES
XFP I-64.1/10GBE BASE L XI641 1AB 21454 0001 -- -- [23]
XFP 10GBE BASE S 10GBase-S 1AB 21454 0002 -- --
XFP S-64.2B/10GBE BASE E XS642B 1AB 21728 0001 -- --

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
CWDM SFP MODULES
CWDM 1470NM PIN SFP DDM CWP147 1AB 19634 0009 -- -- [24]
CWDM 1490NM PIN SFP DDM CWP149 1AB 19634 0010 -- --
CWDM 1470NM APD SFP DDM CWA147 1AB19635 0026 -- -- [25]
CWDM 1490NM APD SFP DDM CWA149 1AB 19635 0027 -- --

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
DWDM SFP MODULES
PTO TRX SFP DWDM CH600 DWA600 1AB 23141 0003 -- -- [26]
OPTO TRX SFP DWDM CH590 DWA590 1AB 32141 0004
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
DWDM SFP MODULES

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
DWDM SFP MODULES

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
DWDM XFP MODULES
Opto TRX 10G XFP DWDM
ch600
XL-64.2C 1AB 35663 0001 -- -- [27]
ch590
1AB 35663 0002
ch580
1AB 35663 0003
ch570
1AB 35663 0004
ch550
1AB 35663 0006
ch540
1AB 35663 0007
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
DWDM XFP MODULES
ch530
1AB 35663 0008
ch520
1AB 35663 0009
ch500
1AB 35663 0011
ch490
1AB 35663 0012
ch480
1AB 35663 0013
ch470
1AB 35663 0014
ch450
1AB 35663 0016
ch440
1AB 35663 0017
ch430
1AB 35663 0018
ch420
1AB 35663 0019
ch380
1AB 35663 0023
ch370
1AB 35663 0024
ch360
1AB 35663 0025
ch350
1AB 35663 0026

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
DWDM XFP MODULES
ch330
1AB 35663 0028
ch320
1AB 35663 0029
ch310
1AB 35663 0030
ch300
1AB 35663 0031
ch280
1AB 35663 0033
ch270
1AB 35663 0034
ch260
1AB 35663 0035
ch250
1AB 35663 0036
ch230
1AB 35663 0038
ch220
1AB 35663 0039
ch210
1AB 35663 0040
ch200

1AB 35663 0041


NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
MULTIPLEXERS
1x8 Mux/Demux 300 - 380 + EXP
+ SPV
OMDX8100_M_L1_XS 3AL 86615 AA-- 8 2;3;4;5;
6;12;13;
22
[28]
1x8Mux/Demux 300-380+EXP OMDX8100_M_L1_X 3AL 86615 AJ-- [29]
1x8 Mux/Demux 200-280 OMDX8100_M_L2 3AL 86615 AB-- [30]
1x8 Mux/Demux 520-600 OMDX8100_M_S1 3AL 86615 AC--
1x8 Mux/Demux 420-500 OMDX8100_M_S2 3AL 86615 AD--
OADM 8 CH 300-380 + SPV OADM8100_M_L1_S 3AL 86637 AA-- 8 2;3;4;5;
6;12;13;
22
[31]
[32]
OADM 8 CH 200-280 + SPV OADM8100_M_L2_S 3AL 86637 AB--
OADM 8 CH 520-600 + SPV OADM8100_M_S1_S 3AL 86637 AC--
OADM 8 CH 420-500 + SPV OADM8100_M_S2_S 3AL 86637 AD--
OADM 4 CH 200-230 + SPV OADM4100_M_ch20-
23_S
3AL 86637 BC-- 8 2;3;4;5;
6;12;13;
22
[33]
[32]
28_S
3AL 86637 BD--
33_S
3AL 86637 BA--
38_S
3AL 86637 BB--
45_S
3AL 86637 BG--
50_S
3AL 86637 BH--

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
MULTIPLEXERS
55_S
3AL 86637 BE--
60_S
3AL 86637 BF--
OADM 2 CH 300-310 + SPV OADM2100_M_30-31_S 3AL 86778 AB-- 8 2;3;4;5;
6;12;13;
22
[34]
OADM 2 CH 320-330 + SPV OADM2100_M_32-33_S 3AL 86778 AC--
OADM 2 CH 350-360 + SPV OADM2100_M_35-36_S 3AL 86778 AD--
OADM 2 CH 370-380 + SPV OADM2100_M_37-38_S 3AL 86778 AE--
OADM 2 CH 470-480 + SPV OADM2100_M_47-48_S 3AL 86778 AF--
OADM 1 CH 300 + SPV OADM1100_M_30_S 3AL 86777 AJ-- 8 2;3;4;5;
6;12;13
22
[35]
OADM 1 CH 310 + SPV OADM1100_M_31_S 3AL 86777 AK--
OADM 1 CH 320 + SPV OADM1100_M_32_S 3AL 86777 AL--
OADM 1 CH 330 + SPV OADM1100_M_33_S 3AL 86777 AM--
OADM 1 CH 350 + SPV OADM1100_M_35_S 3AL 86777 AN--
OADM 1 CH 360 + SPV OADM1100_M_36_S 3AL 86777 AP--
OADM 1 CH 370 + SPV OADM1100_M_37_S 3AL 86777 AQ--
OADM 1 CH 380 + SPV OADM1100_M_38_S 3AL 86777 AR--
OADM 1 CH 470 + SPV OADM1100_M_47_S 3AL 86777 BE--
OADM 1 CH 480 + SPV OADM1100_M_48_S 3AL 86777 BF--
Mux-Demux 1310-1550+SPV SPV_F_1310_1550 3AL 86779 AA-- 5 2;3;12;1
3;22
[36]
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
MULTIPLEXERS
1510 SPV COUPLER SMALL SPV_F_C 3AL 86779 BA-- 16 28B35
38B45
[37]
2F 8CH MDX w/o OSC w/o LOS CMDX-U 3AL 97538 AB-- 8 2;3;4;5;
6;8;10;1
2;13;
14;16;
18;20;
22
[38]
2F 8CH MDX w/ OSC w/o LOS CMDX-U-S 3AL 97769 AA--
2F 8CH MDX2 w/o OSC w/ LOS CMDX2-U 3AL 97654 AA--
2F 8CH MDX2 w/ OSC w/ LOS CMDX2-U-S 3AL 97772 AA--
2F 7CH CDMDX2E CDMDX2-U 3AL 97794 AA-- [39]
2F 7CH CDMDX2E W/ 1310
FILTER
CDMDX2-U-S 3AL 97794 AB--
OADM2E 1CH 1470 UNI W/
1310 FILTER
COAD2-1470_S 3AL 97771 AA-- 8 2; 3; 4;
5; 6; 8;
10; 12;
13; 14;
16; 18;
20; 22
[40]
1310 FILTER
COAD2-1490_S 3AL 97771 AB--
1310 FILTER
COAD2-1510_S 3AL 97771 AC--
1310 FILTER
COAD2-1530_S 3AL 97771 AD--
1310 FILTER
COAD2-1550_S 3AL 97771 AE--

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
MULTIPLEXERS
1310 FILTER
COAD2-1570_S 3AL 97771 AF--
1310 FILTER
COAD2-1590_S 3AL 97771 AG--
1310 FILTER
COAD2-1610_S 3AL 97771 AH--
OADM2E 2CH 1470-1490 UNI
W/ 1310 FILTER
COAD2-1470-1490_S 3AL 97771 BA--
W/ 1310 FILTER
COAD2-1510-1530_S 3AL 97771 BB--
W/ 1310 FILTER
COAD2-1550-1570_S 3AL 97771 BC--
W/ 1310 FILTER
COAD2-1590-1610_S 3AL 97771 BD--
OADM2E 4CH 1470-1490-1510 -
1530 UNI W/ 1310 FILTER
COAD2-1470-1530_S 3AL 97771 CA-- 8 2&3;4&
5;6&7;8
&9;10;
12&13;
16&17;
18&19;
20&21;
22&23

OADM2E 4CH 1550-1570-1590 -
COAD2-1550-1610_S 3AL 97771 CB--
F1310 FILTER F1310 3AL 86779 BB-- 16 28->35
38->45
[41]

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
OPTICAL AMPLIFIERS
OFA +17 dBm (22/9) OAC2 3AL 86703 AC-- 8 4; 5; 12;
13; 20;
21; 22;
23
[42]
OFA +17 dBm (28/9) OAC2_L 3AL 86703 AD--
1696MS boards and units list
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
CONTROLLER
ESC/2 ESC2 3AL 86661 AB-- 1 1; 24 [43]
ESC/3 ESC3 3AL 86661 AC-- 1 1; 24
FLASH CARD 80 MB MEM-DEV 1AB 15205 0001 1 1 [44]
FLASH CARD 256 MB MEM-DEV 1AB 17634 0002 1 1
SPV-M + OW SPVM2 3AL 86606 AB-- 6 2;4;6;8;
10;14;
16;18;
20;22;
23
[45]
SPVM3 3AL 86606 BB--
SPVM_H SPVM_H 3AL 86606 AC-- 6 [46]
SPVM3_H 3AL 86606 BC-- 6
Optical Supervisory Channel OSC 3AL 97540 AA-- 2 29;33;
35;39;
43
[47]
LAC (LAN Access card) LAN_Q or LAN_I 3AL 86653 AA-- 1 26 [48]

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
CONTROLLER
Housekeeping card HK 3AL 86668 AA-- 1 36 [49]
Alarm Card RAI 3AL 87009 AA-- 1 37 [50]
UAC (User Access Card) UIC 3AL 86654AA-- 2 46;47 [51]
OSM_C (Monitoring Card) OSMC 3AL 86893AA-- 4 2;12;
13;23
[52]

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
SWITCHING MATRIX
EBRIDGE EBRIDGE 3AL 97710 AA-- 2 10, 18 [57]

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
POWER SUPPLY
Power Supply Card PSC3 3AL 86652 AB-- 2 25;48 [58]
1696MS boards and units list
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
FANS
CO ENH FAN MODULE FANC 3AL 86625 AB-- 1 49 [59]
CO NO-DUST FILTER - 3AL 86633 AA-- 1 49
CO METALLIC GRID FILTER - 3AL 95106 AA-- 1 49
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
OPTICAL COMPENSATION DEVICES
Low loss SMF C+band DCM 3Km DCM-3 1AB 21083 0001 - - [60]

Low loss SMF C+band DCM 5Km DCM-5 1AB 21083 0002
Low loss SMF C+band DCM
100Km
DCM-100 1AB 21083 0014
120Km
DCM-120 1AB 21083 0015

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
EQUIPMENT ACCESSORIES
Circuit breaker 15A 72VDC - 1AB 16271 0006 2 - [61]
Alarm chain cable - 3AL 86750 AA-- 1 - [62]
HK user cable - 3AL 86751 AA-- 1 - [63]
ANSI & NEBS installation kit - 3AL 86725 AA-- 1 - [64]
1696MS Optinex installation kit - 3AL 86772 AA-- 1 - [65]
KIT - Optical kit 8-channel - 3AL 95184 AA-- 2 - [66]
Jumper kit 4 lambda OADM - 3AL 86827 AA-- 2 - [67]
Optical kit 4xANY intra-shelf - 3AL 86863 AA-- 4 - [68]
Opt. kit 4xANY intra-shelf Prot - 3AL 86864 AA-- 4 - [69]
Air deflector ETSI - 3AN 51293 AA-- 3 -
UAC user cable - 3AL 86753 AA-- 1 - [70]
Opto jumper SMF MU/PC-SC/PC
L = 3MT
- 1AB 1675400010 16 - [71]
SFP MODULE PLUGIN TOOL - 3AL 81728
AAAA
1 - [72]
KIT - OPC connection SM - 3AL 95185
AAAA
8 - [73]
KIT - OPC connection MM - 3AL 95186
AAAA
8 - [74]
Jumper SM MU/PC-LC/PC cable - 1AB 18577 0004 16 - [75]
KIT-Common optical amplif. - 3AL 95136
AAAA
1 - [76]
KIT-Common optical not amplif - 3AL 95137
AAAA
1 - [77]
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
OPTICAL KIT 8 CHANNEL
WLA
- 8DG 17471 AA-- 1 -
WLA
- 8DG 17472 AA-- 1 -
OPTICAL KIT 8 CHANN
4xANY
- 8DG 17473 AA-- 1 -
COMMON OPTICAL NOT
AMPL
- 8DG 17474 AA-- 1 -
WLA UPGRADE KIT - 8DG 17475 AA-- 1 -
4xANY UPGRADE KIT - 8DG 17476 AA-- 1 -
WLA PROTECTED KIT - 8DG 17477 AA-- 1 -
JUMPER SMF MU/PC-MU/PC
390MM
- 1AB 18240 0005 2 -
540MM
- 1AB 18240 0009 2 -
600MM
- 1AB 18240 0011 4 -
650MM
- 1AB 18240 0013 1 -
680MM
- 1AB 18240 0014 2 -
OPTO JUMPER SM MU/PC-
LC/PC CABLE
- 1AB 18577 0003 2 -
LC/PC CABLE
- 1AB 18577 0004 2 -
OPTO CABLE ASSY SM - 1AB 18577 0005 2 -

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
LC/PC CABLE
- 1AB 18577 0006 2 -
JUMPER SM MU/LC 2MM
LSZH 270MM
- 1AB 18577 0008 2 -
JUMPER SM MU/LC 2MM
LSZH 350MM
- 1AB 18577 0009 2 -
JUMPER MU/PC-LC/PC SM
L=700MM
- 1AB 18577 0013 2 -
OPTO CABLE ASSY MM - 1AB 22779 0001 16 -
JUMPER SM MU/MU CABLE
2MM 1700MM
- 1AB 18240 0049 2 -
2MM 1400MM
- 1AB 18240 0046 2 -
360MM
- 1AB 18240 0004 2 -
350MM
- 1AB 18240 0003 2 -
320MM
- 1AB 18240 0002 2 -
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
280MM
- 1AB 18240 0001 2 -
710MM
- 1AB 18240 0015 3 -
OPC connector SM WITH MCC3 - 3AL 86608 AA-- 1 -
OPC_850 connector - 3AL 86608 AB-- 1 -
OPC connection SM with drawers - 3AL 86608 AC-- 1 -
Dummy plate 4TE for PBA - 3AN 50555 AA-- 22 -
Dummy plate 4TE for UTILITY - 3AN 50556 AA-- 22 -

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
INSTALLATION MATERIALS
Opto atten MU/PC 1dB plug type 1AB 20480 0001 -
Opto atten MU/PC 2dB plug type 1AB 20480 0002

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
Opto atten MU/PC 10dB plug
type
1AB 20480 0010
type
1AB 20480 0011
type
1AB 20480 0012
type
1AB 20480 0013
type
1AB 20480 0014
type
1AB 20480 0015
type
1AB 20480 0016
POWER SUPPLY CABLE-CO 3AL 86752 AB--
RAI - TRU CABLE 3AL 86769 AA--
2 MM 770 MM
1AB 18240 0041 -
2 MM 810 MM
1AB 18240 0042 -
2 MM 500 MM
1AB 18240 0050 1 [78]
2 MM 650 MM
1AB 18240 0013 8 [79]
2 MM 650 MM
1AB 18240 0012 2 [80]
REMOVAL TOOL MU/PC 1AD 03860 0002 1 [81]
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
PLUG_IN ATTEN.
SOFTWARE [82]

Table 5.2 1696MS explanatory notes
Note Explanation
[1] It is the equipment shelf, including the back panel. Up to four subracks can be housed in an ETSI
and NEBS compliant rack
[2] Backpanel able to transmit 10G data, able to link two adjacent OCC10s
[3] It is a universal bidirectional multi-clock 3R transponder supporting all the most common bit rates
(from 100 Mbps to 2.5 Gbps) and tunable over two coloured wavelenghts in C band. In case of
protection, 2 adjacent MCCs and 1 x OPC are required. The VOA allows to adjust the output
optical power.
The client optical interface is an SFP module (S-1.1, L-1.1, L-1.2, S-4.1, L-4.1, L-4.2, S-16.1, I-
16.1, L-16.1, L-16.2, CWDM, GbEthernet, FC, 2 FC...)
[4] 10Gbps transponder ITU-T G.709 compliant, designed for 3R transport of 10 Gbps native signals.
The client interface is a B&W XFP module (some types available), accepting the following
signals
9.953Gbps (STM-64/OC-192 to serve as UNI and non-SDH/SONET signals
(10GbeWAN)
10.3125 Gbps (10Gbe LAN)
10.709 Gbps (NNI), future rel.
[5] CWDM version for 10Gbps line. It can be connected to the 1530nm or 1550nm port of CWDM
Mux/Demux (CMDX, CDMDX) or extra port of CDMDX
[6] Multi-rate units (discrete rates in the 0.125->2.7Gbps range) carrying two independent optical
channels. They are double transponders in one slot. The four optical interfaces are B&W and/or
CWDM SFPs. WLA1C is the low cost version, not able to perform PM
[7] Multi-rate unit (discrete rates in the 0.125->2.7Gbps range) carrying one protected optical

Note Explanation
channel. It is a double transponder in one slot. The four optical interfaces are B&W and/or
CWDM SFPs
[8] Multi-rate unit (discrete rates in the 0.125->2.7Gbps range) carrying two independent optical
channels. It is a double transponder in one slot. The four optical interfaces are B&W, DWDM
and/or CWDM SFPs
[9] Multi-rate unit (discrete rates in the 0.125->2.7Gbps range) carrying one protected optical
channel. It is a double transponder in one slot. The four optical interfaces are B&W, DWDM
and/or CWDM SFPs
[10] It performs the aggregation of 2 x GbE/FC/FICON client signals into an SDH/SONET frame
(STM-16/OC-48). The optical interfaces are B&W, DWDM and/or CWDM, provided by SFP
modules
[11] Bidirectional data board with 8 pluggable (SFP) B&W or CWDM user interfaces and 2 pluggable
(XFP) B&W or DWDM line interfaces, performing the concentration of eight GbE clients into a
10GbE WAN, using a Layer 2 switch. It is also able to select some GbE signals to add/drop or to
pass-through. It can also be a transponder
[12] TDM concentrator multiplexing any mix of up to four client signals (100Mbps->1.25Gbps) into a
2.5 Gbps aggregate optical channel, SDH/SONET framing standard (STM-16/OC-48) compliant.
The aggregate optical interface can be B&W (I-S-L type) or CWDM or DWDM type, provided by
an SFP module
[13] To take into account more stringent EMI requirement with the compact shelf using, the end of
Alcatel-Lucent code must be:
4xANY High speed 850 nm cartridge HF-850_Drawer 3AL 86870 AAAG
4xANY Low speed 850 nm cartridge LF-850_Drawer 3AL 86869 AAAG
[14] 2
nd
window plug-in cartridge for 4xANY concentrator, supporting STM-1/OC-3 and STM-4/OC-
12.
If it is set as STM-1, up to four drawers can be housed in one 4xANY board; if it is set as STM-4,
up to three drawers can be housed. STM-1 drawers can be plugged on any slot. STM-4 drawers
can be plugged only on ports #3 and #4; for 3 x STM-4 configuration only, port #1 is available,
too
[15] 2
nd
window plug-in cartridge for 4xANY concentrator, supporting Fast Ethernet, FDDI, ESCON,
DV.
Up to four low frequency (FE, FDDI, ESCON, DV) drawers can be housed on any port of one
4xANY
Note Explanation
[16] 2
nd
window plug-in cartridge for 4xANY concentrator, supporting Gigabit Ethernet, FICON and
FC
Up to two high frequency drawers can be housed only on ports #3 and #4 of a 4xANY board
[17] 1
nd
DV
Up to four low frequency (FE, FDDI, ESCON, DV) drawers can be housed on any port of a
4xANY
[18] 1
nd
FC
[19] 2
nd
window plug-in electrical cartridge for 4xANY concentrator, supporting Digital Video signal
at 270 Mbps. Up to four drawers can be housed on any port of one 4xANY
[20] Allow to manually adjust the optical power budget. Each MVAC board includes two VOAs,
EACH MVAC10 includes ten VOAs.
[21] L-1.1 B&W SFP specialized for SPV/OSC. Plugged on OSC board. L-1.1 SFP (1AB 19467 0002)
can also be plugged on OSC board.
[22] STM1/4/16, GBE, FE, Fiber Channel (2FC, 1FC).... B&W SFP optical modules; they can be
fitted in 4xANY_P (aggregate side, STM-16 only), MCC3, WLA1, WLA2, WLA3, 2xGE_FC
(both line and client sides), 8xGE (client side) and OSC (L-1.1); refer to Figure 676 for further
details
[23] 10GbE B&W XFP optical modules; they can be fitted in OCC10_E and OCC10_EC, client side
and 8xGE, line side (refer to Figure 687 for further details)
[24] Multi-rate (100Mbps to 2.7Gbps) PIN CWDM SFPs. They can be plugged in 4xANY_P,
(aggregate/WDM side), MCC3, 8xGE (user side), 2xGE_FC, WLA1, WLA2, WLA3 (both line
and user sides); refer to Figure 676 for further details
[25] Multi-rate (100Mbps to 2.7Gbps) APD CWDM SFPs. Refer to point [24] above for SFPs placing
[26] Multi-rate (100Mbps to 2.7Gbps) APD DWDM SFPs. They can be plugged in 4xANY_P, line
side, 2xGE_FC and WLA3 (aggregate and client sides); refer to Figure 676 for SFPs placing
[27] APD DWDM XFPs at 10Gbps for CBR client. They are plugged in 8xGE, line side; refer to
Figure 687 for further details
[28] 8 x L1 channels DWDM Mux/Demux with expansion (LB/SB combiner/splitter) and Supervision,

Note Explanation
for hub nodes. Slots 4,5,6 are available in master shelf only. Starting MUX if 32 channels hub
extension is required without amplifiers
[29] 8 x L1 channels DWDM Mux/Demux with expansion (LB/SB combiner/splitter), for hub nodes.
Slots 4,5,6 are available in master shelf only. Starting MUX if 32 supervised channels hub
extension is required when amplifiers are used
[30] 8 x L2/S1/S2 channels DWDM Mux/Demux for hub nodes, used to upgrade the L1 Mux/Demux.
Slots 4,5,6 are available in master shelf only
[31] Allows to add/drop 8 supervised DWDM channels in L1 (30B38)/L2 (20B28)/S1 (52B60)/S2
(42B50) band. Slots 4,5,6 are available in master shelf only.
[32] Can be used also as DWDM MUX/DEMUX. Slots 4,5,6 are available in master shelf only.
[33] Allows to add/drop the 4 supervised DWDM channels shown in its own acronym. Slots 4,5,6 are
available in master shelf only.
[34] Allows to add/drop the 2 supervised DWDM channels shown in its own acronym. Slots 4,5,6 are
available in master shelf only.
[35] Allows to add/drop the supervised DWDM channel shown in its own acronym. From 25 to 38 are
long band channels. From 47 to 57 are short band channels. Slots 4,5,6 are available in master
shelf only.
[36] Allows to mux/demux a 1310nm channel, a 1550nm multiplexed signal and the SPV/OSC
(1510nm) channel. This board allows to supervise a CPE
[37] Allows to mux/demux a SPV/OSC (1510nm) channel and a 1310nm or 1550nm channel. This
board allows to supervise a CPE
[38] 8-channel CWDM Mux/Demux. S indicates the presence of the 1310nm OSC filter. 2 indicates
the presence of LOS detector. Only slots 2, 3, 12, 13, 22 are available in expansion sheves
[39] It is able to mux/demux 6 CWDM channels with an extra DWDM (multiplexed) port. CDMDX2-
U-S is also able to insert/extract the 1310nm OSC. Slots 4, 5, 6, 8, 10 are available in master shelf
only
[40] 1-channel/2-channel/4-channel CWDM OADM mux/demuxes. Each board manages both west
and east sides as two multiplexers and two demultiplexers are integrated in each board. All the
boards are also able to insert/extract the 1310nm supervision signal and to provide LOS
monitoring.
The 4-channel OADM board is two-slot wide (8TE), the other boards are one-slot wide (4TE).
Mixed cascades with DWDM mux/demux(es) are foreseen.
Note Explanation
As regards 1 and 2-channel OADM, slots 4, 5, 6, 8, 10 are available in master shelf only.
As regards 4-channel OADM, in expansion shelves only slots 2&3, 12&13 and 22&23 are
available
[41] It multiplexes one (multiplexed, DWDM/CWDM) C-band signal with the 1310nm OSC channel
[42] Double-stage optical amplifiers able to amplify all the channels in C band. Slots 22 and 23 are
available in expansion shelves only. OAC2_L provide long spans transmission. OAC2_L reduce
power dissipation
[43] It includes both the equipment and shelf controller functionalities. It has to be fitted in expansion
shelves, too, to only perform the shelf controller function. Instead, in slot 24 it is only used to
have a back-up of the slot 1 flash memory, in TL1 management case (North America).
ESC2 is recommended for greenfield deployments from R.2.2A.
ESC3 is recommended for greenfield deployments from R.3.2 and further
[44] The flash card contains the equipment data base.
It must be equipped only on ESC board plugged in slot 1 of the master shelf
[45] 1510nm Optical Supervisory Channel card managing up to 2 x 2048 supervision streams, 2
external 2Mps user interfaces and the EOW (audio channel). Hosted in master shelf only
The SPVM2/3 in slot 23 is exclusively linked to an OADM/OMDX or OAC: it is dedicated to MS
supervision. The other SPVMs are dedicated to up to 10 CPE links supervision (SPVM has 2 x
SPV ports)
[46] Depopulated SPVM with one 1510 nm laser, managing 1 x OSC channel
[47] Low cost 1310nm Optical Supervisory Channel card managing up to 2 x 2048 supervision
streams (2 x SPV ports). Optical interfaces are two customized L-1.1 SFP modules. In master
shelf only.
[48] Provide the Q3 management interface allowing to the NMS to supervise the equipment:
plugged in slot #26 of the master shelf, it is used as LAN_Q to connect the NMS
plugged in slot #27, it is used as LAN_I to inter connect the expansion shelves.
The LAN board code 3AL 86653 AAAD or later must be used for LAN_I installation in slot 27
of the extension shelf. Any variant of 3AL 86653AA-- may be used for LAN_Q in slot 26 of the
master shelf
[49] Hosted in master shelf only, provides 8 input accesses and 8 output accesses
[50] Fitted in master and expansion shelves, it is used for monitoring the rack alarms

Note Explanation
[51] Hosted in master shelf only, manages G.703 user channels. For any SPVM, two cards are required
[52] The Optical Spectrum Monitoring Card measures the power of each channel. Coupled with
MVAC provides automatic power equalization
[53] SM optical splitter with connectors, performing passive OCh (linear config.) or O-SNCP (ring
config) protection. It is linked to 2 adjacent MCC/OCC/2XGE_FC boards and plugged below the
main one.
[54] MM optical splitter with connectors. In addition to the features provided by the SM splitter (ref.
[53]), it manages the HWF led on its front plate and the LOS alarm
[55] MM optical splitter with connectors, used for protection of 4xANY drawers with 850nm
transceiver
[56] Protects the OTS (path) between two NE by selecting (switching) the incoming multiplexed
signal
[57] It performs short circuit from TDM bus to 2M bus so that 2Mbps SPV signals are sent/received
by ESC board to/from OSC small board. In Master shelf only
[58] Power Supply Card for central office shelf. PSC3s work in 1+1 protection meaning that only
one PSC is active at once
[59] It is equipped with three fans; an anti-dust filter has to be put just below the fans
[60] Dispersion Compensating Modules providing chromatic dispersion compensation. The number in
the acronym refers to the SMF distance for which the module provides compensation. DCMs can
be placed either in the inter-stage of an optical amplifier or in the booster and preamplifier of a
link. One DCM simultaneously compensates for the chromatic dispersion of all the (up to 32)
1696 channels
[61] To be used for external subrack power protection with optinex subrack only
[62] Allows the chain connection of the rack alarms, between the SUB-D 9p and RJ45 connectors of
two RAI cards in two different shelves
[63] Used to perform the HK connections from the 25p connector of the HK card to the DDF
[64] Used for equipment installation in ANSI & NEBS rack
[65] Used for equipment installation in OPTINEX rack
[66] The kit contains the fibers to connect 8 transponders to the 8-channel MUX/DEMUX
(OMDX/OADM) following the installation rules. 2 kits are needed to connect a shelf equipped
Note Explanation
with 16 transponders
[67] The kit contains the fibers to connect 8 wavelenght adapters and SPVM to the 4-channel MUX
following the installation rules. Optimized solution can be ordered using single MU-MU jumpers
[68] Required to connect 4xANY HOST to MCC in the same shelf, following installation rules
[69] Required to connect 4xANY HOST to the optical splitter (MCC protection) in the same shelf,
following the installation rules
[70] Used to perform the (2Mbps and 64Kbps) AUX/service channels connection from the 50pin
connector of the UIC card to the DDF
[71] MU-SC/PC jumper for plug-in attenuator manager in ODF
[72] Used to extract the SFP modules (plugged in 4xANY_P and MCC3)
[73] It includes the 4 jumpers allowing to connect a SM OPC with a couple of transponders, providing
1+1 protection. 8 codes are needed in a fully equipped transponder shelf with sixteen
OCC10/MCC (8 + 8).
[74] It includes the 4 jumpers allowing to connect a MM OPC with a couple of transponders,
providing 1+1 protection. 8 codes are needed in a fully equipped transponder shelf with sixteen
OCC10/MCC (8 + 8).
[75] It includes the 4 jumpers allowing to connect an OPC with a couple of 4xANY drawers, providing
1+1 protection. 16 codes are needed in a fully equipped shelf with 32 (16 + 16) 4xANY drawers
in eigth 4xANY
[76] Allows the common connection in amplified systems, like the Mux/Demux connection with OAC,
connection between two stages of the same OAC, connection between two different OACs and
extra or pass-through channel connections (Extra IN/OUT connector of the Mux-Demux pair).
For details refer to the installation handbook
[77] Allows the common connection in non-amplified systems, like the OSC channel (IN/OUT
connector of SPVM) and extra or pass-through channel connections (Extra IN/OUT connector of
the Mux-Demux pair). For details refer to the installation handbook
[78] Used to connect the OSMC to the the OMDX/OADM for monitoring
[79] Used to connect the OSMC to the OAC monitoring points (stage1 IN/OUT, stage 2 IN/OUT)
[80] Used to connect the OMDX/OADM to the OAC
[81] Used to remove the opto attenuator plug-in

Note Explanation
[82] Details concerning the software part number are given in the Operators Handbook
1696MS shelf front view

Figure 4546: Example of Master shelf front view


Figure 4647: Shelf front view with cover

1696MS_C (compact shelf) physical configuration
The 1696MS_C shelf is a Compact WDM architecture.
It is a compact 6 slots shelf with possible expansion to 3 compact shelves (1 master
shelf plus 2 expansion shelves).
It is dedicated to receive the units developped for the 1696MSPAN shelf.
As the 1696MS, the compact shelf has two redundant power feeds for -48V.
This architecture enables point to point and ring applications
up to 12 channels in LT configuration
up to 4 channels in OADM configuration
(colored or black and white) monitored by the SPVM board.

1696MS_C rack version powered from 48V DC voltage source from the rack
connected to the Power Supply Card.

Figure 4748: 1696MS_C Rack version

1696MS_C table version

In a table version using, the operator should wear a wrist-strap bracelet
connected to the mechanical ground (available on the rear of the shelf) for
each handling a board, optical connectors or a part of the shelf.
Figure 4849: 1696MS_C Table version with and without cover

Main features provided by the 1696MS_C shelf
It is very easy to use due its small size (6 unit slots versus 24 in the 1696MSPAN shelf)
Independent stand alone 1696MS_C shelf can be used
Units of the 1696MS_C are set horizontally
Up to 12 1696MS_C shelves can be set in a 2000 mm high ETSI rack, or a 2150 mm
high ANSI rack, or a 1950 mm high NEBS 2000 rack.
1696MS_C Empty shelf
1696MS_C Shelf organization
The 1696MS_C shelf is organized into three parts (one main part and two extensions
parts), hosting 13 boards or unit slots:
the main part, which is the middle part and comprises the slots from 1 to 6; here are located
the 285 mm high boards performing the elaboration of the signal.
This part hosts the equipment and shelf controller, up to 4 transponders, up to 2 TDM
concentrators (4xANY), one mux/demux for LT or two mux/dmux or OADM boards
(east/west) for hub/OADM application, optical supervisory channel board (optimized
application with SPVM_Half, that is a depopulated SPVM supporting one transceiver at 1510
nm instead of two, is possible for point to point and spur configuration)...
the first extension part, which is the right part and comprises the slots from 7 to 12; here are
located the 88 mm high boards, herebelow listed
- two redundant -48V power supply boards
- one LAN access board for the CT or the EML (LAN_Q) connection
- one house-keeping board with 8 x input access + 8 x output access (HK)
- one remote alarms board (RAI)
- one optical protection channel board (OPC) per protected channel
the second extension part, which is the left part and comprises slot 13, where are located the
fans.
All the optical and electrical connectors are located on the front of the units to be
easily accessed.
This chapter illustrates the physical structure, layout and composition, coding and
partition of the shelf.
The shelf front view is illustrated below in Figure 51 and in Figure 52.
The units codes and partition are listed in Table 5.3 1696MS_C boards and units
listTable 5.3 1696MS_C boards and units listTable 5.3 1696MS_C boards and units
list.

F i r s t e x t e n s i o n p a r t ( s l o t 7 t o 1 2 )
S e c o n d e x t e n s i o n p a r t ( s l o t 1 3 )
Main part (slot 1 to 6)

Figure 4950: 1696 MS_C - Mechanical structure

1696MS_C Shelf dimensions
Shelf size:
the size of the 1696MS_C shelf is 446.2mm (19 width) x 274mm (depth with cover) x 132.4
mm (heigth)
the depth is compliant with the 300 mm deep ETSI rack (no limitation in ANSI rack).
Rack partionning
In current release one master shelf and up to two expansion shelves are managed.
19''(446.2 mm)
Slot 6
Slot 5
Slot 4
Slot 3
Slot 2
Slot 1
F A N _C
PSC
PSC
MASTER
1 2
11
1 0
9
8
7
13

ESC
Fiber drawer
LAN_Q
1
3
2
.
4
3
0
0
8
8
N . B . d a r k b o a r d s a r e m a n d a t o r y
Slot 6
Slot 5
Slot 4
Slot 3
Slot 2
Slot 1
F A N _C
PSC
PSC
1 2
11
1 0
9
8
7
13

I-link_S
I-link_M
SLAVE

Figure 5051: 1696 MS_C - Main shelf board arrangement

1696MS_C Shelf configuration rules
The board composition and placement of a shelf respects some constraints at the
hardware, software and functional levels.
If general rules are followed, a certain number of standard configurations can be
obtained in which boards can be exchanged without functionality loss.
The main configurations available are:
OADM 1/2/4 channels (protected back-to-back) configuration with/without OPC
up to 12 channels Line Terminal
Remote 4xANY + protected MCC
Remote 4xANY + protected MCC on 1550 nm
SPVM Manager
2 channels Line Terminal (MCC + 4xANY)...

Local spur (up to two x 4xANY to save cost of one supervision unit).
Amplified configurations are allowed, by means of OAC2 and OAC2_L.
The 4xANY drawers 1+1 protection is also allowed, by means of OPCs.
1696MS_C configuration constraints
Optical Sub-Network Channel Protection requires:
transponders (MCC, OCC10, 2xGE_FC, TRBD1996) must be placed in consecutive slots
[2,3] or [4,5]
4xANY_P unit must be placed in a 2-slots space beginning with an even address ([2,3] or
[4,5]); if two 4xANY are used, they must be installed in in slots ([2,3] and [4,5]);
if 4xANY is associated with a MCC all the board are put in a single compact shelf.
each Optical Protecting Channel board (OPC) must be placed in one of the two slots, located
on the right side of the corresponding MCC/OCC10/TRBD1996 pair (e.g.: the OPC in slot 9
or 10 corresponds to the slots 2-3). The MCC/OCC10/TRBD1996 on the left of the OPC is
the main one and the other is the MCC/OCC10/TRBD1996 in protection (e.g.: OPC in slot 9
implies main MCC/OCC10/TRBD1996 in slot 3 and protecting MCC/OCC10/TRBD1996 in
slot 2).
when two 2xGE_FC boards are used in client protection configuration, the 2xGE_FC on the
right side always contains the SFP MAIN (or protected), and the 2xGE_FC on the left side,
the SFP SPARE (or protecting). If the 2xGE_FC boards are provisioned in slots #n and #n+1,
then:
- client #1, is protected using OPC in slot #n+7 (on the right side)
- client #2, is protected using OPC in slot #n+6 (on the left side)
when protecting 4xANY client signals, the OPCs have to be fitted in the four slots located on
the right of the 4xANY couple; the OPC in slot 8 protects drawer #2, the OPC in slot 9
protects drawer #1, the OPC in slot 10 protects drawer #3, the OPC in slot 11 protects drawer
#4;
when expansion shelves are used
- in slot 6 of the master shelf have to be plugged the I-Link_M board
- in slot 1 of each expansion shelf have to be plugged the I-Link_S board
N.B. There is no specific NE configuration. The behavior is always the same.
The OADM is equivalent to the back-to back terminal.
1696MS_C typical shelf configuration
Figure 52 shows a typical configuration of an equipped 1696MS_C Master shelf and
Table 5.3 1696MS_C boards and units listTable 5.3 1696MS_C boards and units
listTable 5.3 1696MS_C boards and units list resumes the possibilities that satisfy the
configuration constraints.

Figure 5152: Typical 1696MS_C equipped shelf

For Hardware and/or Software organization, boards are located on dedicated slots.
The position of the boards on the 1696MS_C shelf are:
ESC board (mandatory): dedicated slot 1 of master shelf
I-link_M card (mandatory, only when expansion shelves are used): dedicated slot 6 of master
shelf
I-link_S card (mandatory): dedicated slot 1 of each expansion shelf
PSC/PSC2 cards : dedicated small slots (mandatory equipped) 7 and 12
SPVM cards slot #4, #5, or #6
- SPVM in slot #4 must be provisioned to supervise the multiplexed signal
- SPVM boards set in slot #5 and #6 are dedicated to an application with no
multiplexed signal
LAN_Q card (mandatory): dedicated small slot 8
HK card can be installed in small slot 11
RAI card can be installed in small slots 9 or 10
OAC2 and OAC2_L cards can be installed in slot 2, 3
FAN_C card (mandatory): dedicated slot 13.
Mandatory boards are:
ESC board in slot 1 of master shelf
LAN_Q card in slot 8 of master shelf
I-link_M card in slot 6 of the master shelf (only when expansion shelves are used)
I-link_S card in slot 1 of each expansion shelf
PSC/PSC2 cards in slots 7 and 12

FAN_C card in slot 13.
1696MS_C Part list
In Table 5.3 1696MS_C boards and units listTable 5.3 1696MS_C boards and units
listTable 5.3 1696MS_C boards and units listTable 5.3 (1696MS_C boards and units
list) of the following paragraph are listed, named and coded the items and units making
up the Equipment Shelf.
Furthermore, for any item the position and the maximum quantity that can be allocated
inside the equipment, are indicated too.
Such table reports the following information :
Item Name
The Acronym identifying the units
ANV part numbers (3ALXXXXX XXXX)
Maximum quantity per each shelf
Position of the unit inside the equipment. Refer to Figure 51 for slot numbering.
Number of explanatory notes
Table 5.4 1696MS_C explanatory notesTable 5.4 1696MS_C explanatory notesTable
5.4 1696MS_C explanatory notesTable 5.4 1696MS_C explanatory notes reports the
explanatory notes.
1696MS_C shelf and boards designation and reference

Table 5.3 1696MS_C boards and units list
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
MECHANICAL STRUCTURE
METRO SPAN COMPACT
SHELF/3
3AL 97679 AB-- - -- 1

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
TRIBUTARIES
Enhanched Multirate CH 19x.x00-
19x.x00 with SFP optical
modules, client side
MCC3 192.0-192.1 3AL 95150 AA-- 4 2->6 2
MCC3 192.2-192.3 3AL 95150 AB--
MCC3 192.5-192.6 3AL 95150 AC--
MCC3 192.7-192.8 3AL 95150 AD--
MCC3 193.0-193.1 3AL 95150 AE--
MCC3 193.2-193.3 3AL 95150 AF--
MCC3 193.5-193.6 3AL 95150 AG--
MCC3 193.7-193.8 3AL 95150 AH--
MCC3 194.2-194.3 3AL 95150 AJ--
MCC3 194.4-194.5 3AL 95150AK--
MCC3 194.7-194.8 3AL 95150 AL--
MCC3 194.9-195.0 3AL 95150 AM--
MCC3 195.2-195.3 3AL 95150 AN--
MCC3 195.4-195.5 3AL 95150 AP--
MCC3 195.7-195.8 3AL 95150 AQ--
MCC3 195.9-196.0 3AL 95150 AR--
OCC10 XFP APD CH 192.000 OCC10 _E 3AL 95238 AA-- 4 2->6 3
OCC10 XFP APD CH 192.100 3AL 95238 AC--
OCC10 XFP APD CH 192.200 3AL 95238 AE--
OCC10 XFP APD CH 192.300 3AL 95238 AG--
OCC10 XFP APD CH 192.500 3AL 95238 AN--
OCC10 XFP APD CH 192.600 3AL 95238 AQ--
OCC10 XFP APD CH 192.700 3AL 95238 AS--

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
TRIBUTARIES
OCC10 XFP APD CH 192.800 3AL 95238 BA--
OCC10 XFP APD CH 193.000 3AL 95238 BE--
OCC10 XFP APD CH 193.100 3AL 95238 BG--
OCC10 XFP APD CH 193.200 3AL 95238 BL--
OCC10 XFP APD CH 193.300 3AL 95238 BN--
OCC10 XFP APD CH 193.500 3AL 95238 BS--
OCC10 XFP APD CH 193.600 3AL 95238 CA--
OCC10 XFP APD CH 193.700 3AL 95238 CC--
OCC10 XFP APD CH 193.800 3AL 95238 CE--
OCC10 XFP APD CH 194.200 3AL 95238 CP--
OCC10 XFP APD CH 194.300 3AL 95238 CR--
OCC10 XFP APD CH 194.400 3AL 95238 CT--
OCC10 XFP APD CH 194.500 3AL 95238 DB--
OCC10 XFP APD CH 194.700 3AL 95238 DF--
OCC10 XFP APD CH 194.800 3AL 95238 DH--
OCC10 XFP APD CH 194.900 3AL 95238 DM--
OCC10 XFP APD CH 195.000 3AL 95238 DP--
OCC10 XFP APD CH 195.200 3AL 95238 DT--
OCC10 XFP APD CH 195.300 3AL 95238 EB--
OCC10 XFP APD CH 195.400 3AL 95238 ED--
OCC10 XFP APD CH 195.500 3AL 95238 EF--
OCC10 XFP APD CH 195.700 3AL 95238 EM--
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
TRIBUTARIES
OCC10 XFP APD CH 195.800 3AL 95238 EP--
OCC10 XFP APD CH 195.900 3AL 95238 ER--
OCC10 XFP APD CH 196.000 3AL 95238 ET--
OCC-10_XFP_CWDM 1530NM OCC10_EC 8DG 81002 AA-- 4 2->6 4
OCC-10_XFP_CWDM 1550NM 8DG 81002 AB--
OCC-10_XFP_CWDM 1570NM 8DG 81002 AC--
OCC-10_XFP_CWDM 1590NM 8DG 81002 AD--
OCC-10_XFP_CWDM 1610NM 8DG 81002 AE--
TRBD1996 TRBD1996 3AL97706 AA-- 4 2->6
DUAL BASIC WLA MODULE-
3R
WLA1C 3AL 97529 BA-- 4 2->6 5
DUAL ENH WLA MODULE-
2X3R
WLA2C 3AL 97657 AA--
DUAL ENH WLA MODULE -
2X3R W/ OPC
WLA2C_OP 3AL 97657 AB-- 6
DUAL C/DWLA3 CARD-SFP WLA3CD 3AL 97795 BA-- 7
DUAL C/DWLA3 CARD-SFP-
OPC
WLA2CDOP 3AL 97795 BB-- 8
2xGE 2xGE_FC 3AL 97800 AA-- 9
8xGE IN 10G 8xGE 3AL 97875 AA-- 10
4xANY Host fully pluggable 4xANY_P 3AL 95063 AA-- 2 2;4 11, 12


NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
TRIBUTARY SUBSYSTEM (4xANY DRAWERS)
4 X ANY SDH/SONET
cartridge/2
SDH-SONET_1310
Drawer
3AL 95284 AA-- -- -- 13
4 X ANY Low speed cartridge LF_1310_2 Drawer 3AL 86674 AA-- -- -- 14
4 X ANY High speed optical
cartridge
HF_1310 Drawer 3AL 86672 AA-- -- -- 15
4 X ANY Low speed optical
cartridge
LF_850 Drawer 3AL 86869 AA-- -- -- 16, 12
4 X ANY High speed optical
cartridge
HF_850 Drawer 3AL 86870 AA-- -- -- 17, 12
4 X ANY Electrical DV cartridge 3AL 95267 AA-- -- -- 18

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
B&W SFP MODULES
OPTO TRX Supervisory Channel 2M 1AB 20986 0001 -- 19
OPTO TRX SFP S-1.1 W/DDM S-1.1DDM 1AB 19467 0004 16 -- 20
OPTO TRX SFP L-1.1 L-1.1 1AB 19467 0002 --
OPTO TRX SFP L-1.2 L-1.2 1AB 19467 0003 --
OPTO TRX SFP S-4.1 DDM S-4.1DDM 1AB 19636 0004 --
OPTO TRX SFP L-4.1 DDM L-4.1DDM 1AB 19636 0006 --
OPTO TRX SFP I-16.1 DDM I-16.1DDM 1AB 19637 0005 --
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
B&W SFP MODULES
OPTO TRX SFP S-16.1 DDM S-16.1DDM 1AB 19637 0006 --
OPTO TRX SFP L-16.2 DDM L.16.2DDM 1AB 19637 0009 --
OPTO TRX SFP S-16.1
ANYRATE DDM
S-16-ADDM 1AB 19637 0007 --
OPTO TRX SFP 100 BASE LX 100B LX 1AB 21471 0001 --
OPTO TRX 1.25GBE SFP LX
DDM
1GbELXDDM 1AB 18728 0031 --
OPTO TRX 1.25GBE SFP SX
DDM
1GbESXDDM 1AB 18728 0033 --
OPTO TRX 1.25GBE SFP-ZX
DDM
1GbEZXDDM 1AB 18728 0042 --
OPTO TRX SFP FC/2FC MM
DDM
FC/2FCmm 1AB 18728 0037 --
OPTO TRX SFP FC/2FC SM
DDM
FC/2FCsm 1AB 18728 0038 --

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
B&W XFP MODULES
XFP I-64.1/10GBE BASE L XI641 1AB 21454 0001 4 -- 21
XFP 10GBE BASE S X10GBase-S 1AB 21454 0002 --
XFP S-64.2B/10GBE BASE E XS642B 1AB 21728 0001 --

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
CWDM SFP MODULES
CWDM 1470NM PIN SFP DDM CWP147 1AB 19634 0009 -- -- 22
CWDM 1470NM APD SFP DDM CWA147 1AB19635 0026 -- -- 23
CWDM 1610NM APD SFP DMM CWA161 1AB 19635 0033 -- --

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
DWDM SFP MODULES
OPTO TRX SFP DWDM CH600 DWA600 1AB 23141 0003 -- -- 24
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
DWDM SFP MODULES

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
DWDM SFP MODULES

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
DWDM XFP MODULES
ch600
XL-64.2C 1AB 32141 0003 -- -- 25
ch590
1AB 32141 0004
ch580
1AB 32141 0005
ch570
1AB 32141 0006
ch550
1AB 32141 0008
ch540
1AB 32141 0009
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
DWDM XFP MODULES
ch530
1AB 32141 0010
ch520
1AB 32141 0011
ch500
1AB 32141 0013
ch490
1AB 32141 0014
ch480
1AB 32141 0015
ch470
1AB 32141 0016
ch450
1AB 32141 0018
ch440
1AB 32141 0019
ch430
1AB 32141 0020
ch420
1AB 32141 0021
ch380
1AB 32141 0025
ch370
1AB 32141 0026
ch360
1AB 32141 0027
ch350
1AB 32141 0028

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
DWDM XFP MODULES
ch330
1AB 32141 0030
ch320
1AB 32141 0031
ch310
1AB 32141 0032
ch300
1AB 32141 0033
ch280
1AB 32141 0035
ch270
1AB 32141 0036
ch260
1AB 32141 0037
ch250
1AB 32141 0038
ch230
1AB 32141 0040
ch220
1AB 32141 0041
ch210
1AB 32141 0042
ch200
1AB 32141 0043

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
MULTIPLEXERS
1x8 Mux/Demux 300-380 + EXP
+ SPV
OMDX8100_M_L1_XS 3AL 86615 AA-- 3 4;5:6 26
1x8Mux/Demux 300-380+EXP OMDX8100_M_L1_X 3AL 86615 AJ-- 27
1x8 Mux/Demux 200-280 OMDX8100_M_L2 3AL 86615 AB-- 28
1x8 Mux/Demux 520-600 OMDX8100_M_S1 3AL 86615 AC--
1x8 Mux/Demux 420-500 OMDX8100_M_S2 3AL 86615 AD--
OADM 8 CH 300-380 + SPV OADM8100_M_L1_S 3AL 86637 AA-- 3 4;5;6 29,
30,
31
OADM 8 CH 200-280 + SPV OADM8100_M_L2_S 3AL 86637 AB--
OADM 8 CH 520-600 + SPV OADM8100_M_S1_S 3AL 86637 AC--
OADM 8 CH 420-500 + SPV OADM8100_M_S2_S 3AL 86637 AD--
23_S
3AL 86637 BC-- 3 4;5;6 32,
30
28_S
3AL 86637 BD--
33_S
3AL 86637 BA--
38_S
3AL 86637 BB--
45_S
3AL 86637 BG--
50_S
3AL 86637 BH--
55_S
3AL 86637 BE--

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
MULTIPLEXERS
60_S
3AL 86637 BF--
2 channels OADM with SPV card OADM2100_M_30-31_S 3AL 86778 AB-- 3 4;5;6 33
OADM2100_M_32-33_S 3AL 86778 AC--
OADM2100_M_35-36_S 3AL 86778 AD--
OADM2100_M_37-38_S 3AL 86778 AE--
OADM2100_M_47-48_S 3AL 86778 AF--
1 channel OADM with SPV cards OADM1100_M_25_S 3AL 86777 AE-- 3 4;5;6 34
OADM1100_M_30_S 3AL 86777 AJ--
OADM1100_M_31_S 3AL 86777 AK--
OADM1100_M_32_S 3AL 86777 AL--
OADM1100_M_33_S 3AL 86777 AM--
OADM1100_M_35_S 3AL 86777 AN--
OADM1100_M_36_S 3AL 86777 AP--
OADM1100_M_37_S 3AL 86777 AQ--
OADM1100_M_38_S 3AL 86777 AR--
OADM1100_M_47_S 3AL 86777 BE--
OADM1100_M_48_S 3AL 86777 BF--
OADM1100_M_57_S 3AL 86777 BN--
Supervision Filter card
(SPV_F_1310_1550)
SPV_F_1310_1550 3AL 86779 AA-- 2 5;6 35
Supervision Filter card SPV_F_C 3AL 86779 BA-- 4 8->11 36
2F 8CH MDX w/o OSC w/o LOS CMDX-U 3AL 97538 AB-- 3 2;4;5;6 37
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
MULTIPLEXERS
2F 8CH MDX w/ OSC w/o LOS CMDX-U-S 3AL 97769 AA--
2F 8CH MDX2 w/o OSC w/ LOS CMDX2-U 3AL 97654 AA--
2F 8CH MDX2 w/ OSC w/ LOS CMDX2-U-S 3AL 97772 AA--
2F 7CH CDMDX2E CDMDX2-U 3AL 97794 AA-- 38
2F 7CH CDMDX2E W/ 1310
FILTER
CDMDX2-U-S 3AL 97794 AB--
1310 FILTER
COAD2-1470_S 3AL 97771 AA-- 3 2; 4; 5;
6
39
1310 FILTER
COAD2-1490_S 3AL 97771 AB--
1310 FILTER
COAD2-1510_S 3AL 97771 AC--
1310 FILTER
COAD2-1530_S 3AL 97771 AD--
1310 FILTER
COAD2-1550_S 3AL 97771 AE--
1310 FILTER
COAD2-1570_S 3AL 97771 AF--
1310 FILTER
COAD2-1590_S 3AL 97771 AG--
1310 FILTER
COAD2-1610_S 3AL 97771 AH--
W/ 1310 FILTER
COAD2-1470-1490_S 3AL 97771 BA--
W/ 1310 FILTER
COAD2-1510-1530_S 3AL 97771 BB--

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
MULTIPLEXERS
W/ 1310 FILTER
COAD2-1550-1570_S 3AL 97771 BC--
W/ 1310 FILTER
COAD2-1590-1610_S 3AL 97771 BD--
OADM2E 4CH 1470-1490-1510 -
COAD2-1470-1530_S 3AL 97771 CA-- 2&3;
4&5

OADM2E 4CH 1550-1570-1590 -
COAD2-1550-1610_S 3AL 97771 CB--
F1310 FILTER F1310 3AL 86779 BB-- 4 8->11 40

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
OPTICAL AMPLIFIERS
OFA +17 dBm (22/9) OAC2 3AL 86703 AC-- 2 2,3 41
OFA +17 dBm (28/9) OAC2_L 3AL 86703 AD--

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
CONTROLLER
ESC/2 ESC2 3AL 86661 AB-- 1 1 42
ESC/3 ESC3 3AL 86661 AC-- 1 1
FLASH CARD 80 MB MEM-DEV 1AB 15205 0001 1 1 43
FLASH CARD 256 MB MEM-DEV 1AB 17634 0002 1 1
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
CONTROLLER
SPVM + OW SPVM2 3AL 86606 AB-- 3 4;5;6 44
SPVM3 3AL 86606 BB--
SPVM_H SPVM_H 3AL 86606 AC-- 3 4;5;6 45
SPVM3_H 3AL 86606 BC--
Optical Supervisory Channel OSC 3AL 97540 AA-- 2 9;11 46
LAN Access card LAN_Q 3AL 86653 AA-- 1 8 47
Housekeeping card HK 3AL 86668 AA-- 1 11 48
Rack Alarm Interface board RAI 3AL 87009 AA-- 1 9;10 49
I-LINK MASTER I-LINK_M 3AL 86805 AA-- 1 6 50
I-LINK_SLAVE I-LINK_S 3AL 86808 AA-- 1 1

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
SWITCHING PROTECTION
SM-OPC CONNECTORS OPC 3AL 86708 AC-- 4 8->11 51
MM-OPC CONNECTORS OPC 3AL 86708 AD-- 52
MM_OPC_850 OPC 3AL 95113 AA-- 53
OMS PROTECTION OMSP 3AL 97541 AA-- 54


NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
SWITCHING MATRIX
EBRIDGE EBRIDGE 3AL 97710 AA-- 1 2 55

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
POWER SUPPLY
PSC2_COMPACT PSC2 3AL 86888 AA-- 2 7;12 56
Power Management Unit PMU 3AL 86825 AA-- 1 - 57
Batteries for PMU 3AL 95210 AA--
Power supply BOX - 3AL 95239 AA-- - - 58

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
FANS
COMPACT FAN FAN_C 3AL 86802 AA-- 1 13 59
COMPACT DUST FILTER - 3AN 51151 AA-- 1 13


NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
3Km
DCM-3 1AB 21083 0001 - - 60
5Km
DCM-5 1AB 21083 0002
10Km
DCM-10 1AB 21083 0003
15Km
DCM-15 1AB 21083 0004
20Km
DCM-20 1AB 21083 0005
25Km
DCM-25 1AB 21083 0006
30Km
DCM-30 1AB 21083 0007
40Km
DCM-40 1AB 21083 0008
50Km
DCM-50 1AB 21083 0009
60Km
DCM-60 1AB 21083 0010
70Km
DCM-70 1AB 21083 0011
80Km
DCM-80 1AB 21083 0012
90Km
DCM-90 1AB 21083 0013

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
100Km
DCM-100 1AB 21083 0014
120Km
DCM-120 1AB 21083 0015

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
Circuit breaker 15A 72VDC - 1AB 16271 0006 2 - 61
HK user cable - 3AL 95073 AA-- 1 - 62
I-Link cable - 3AL 95179 AA-- 2 - 63
Cable from BOX to PMU 3AL 95263 AA-- 2
Cable from BOX to PSC/PSC2 - 3AL 95264 AA-- 2 - 64
Cable from PMU to FAN 3AL 95266 AA-- 2
SFP MODULE PLUGIN TOOL - 3AL 81728
AAAA
1 - 65
JUMPER SMF MU/MU CABLE
2MM 1700MM
- 1AB 18240 0049 4 - 66
360MM
- 1AB 18240 0004 4 - 67
450MM
- 1AB 18240 0007 4 -
KIT - OPC connection SM - 3AL 95185
AAAA
2 - 68
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
KIT - OPC connection MM - 3AL 95186
AAAA
2 - 69
Jumper SM MU/PC-LC/PC cable - 1AB 18240 0004 4 - 70
WLA
- 8DG 17471 AA-- 1 -
WLA
- 8DG 17472 AA-- 1 -
OPTICAL KIT 8 CHANN
4xANY
- 8DG 17473 AA-- 1 -
COMMON OPTICAL NOT
AMPL
- 8DG 17474 AA-- 1 -
WLA UPGRADE KIT - 8DG 17475 AA-- 1 -
4xANY UPGRADE KIT - 8DG 17476 AA-- 1 -
WLA PROTECTED KIT - 8DG 17477 AA-- 1 -
390MM
- 1AB 18240 0005 2 -
540MM
- 1AB 18240 0009 2 -
600MM
- 1AB 18240 0011 4 -
650MM
- 1AB 18240 0013 1 -
680MM
- 1AB 18240 0014 2 -
LC/PC CABLE
- 1AB 18577 0003 2 -

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
LC/PC CABLE
- 1AB 18577 0004 2 -
LC/PC CABLE
- 1AB 18577 0006 2 -
JUMPER SM MU/LC 2MM
LSZH 270MM
- 1AB 18577 0008 2 -
JUMPER SM MU/LC 2MM
LSZH 350MM
- 1AB 18577 0009 2 -
JUMPER MU/PC-LC/PC SM
L=700MM
- 1AB 18577 0013 2 -
OPTO CABLE ASSY MM - 1AB 22779 0001 16 -
2MM 1700MM
- 1AB 18240 0049 2 -
2MM 1400MM
- 1AB 18240 0046 2 -
360MM
- 1AB 18240 0004 2 -
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
350MM
- 1AB 18240 0003 2 -
320MM
- 1AB 18240 0002 2 -
280MM
- 1AB 18240 0001 2 -
710MM
- 1AB 18240 0015 3 -
OPC connector SM WITH MCC3 - 3AL 86608 AA-- 1 -
OPC_850 connector - 3AL 86608 AB-- 1 -
OPC connection SM with drawers - 3AL 86608 AC-- 1 -
Dummy plate 4TE for PBA - 3AN 50555 AA-- 6 -
Dummy plate 4TE for UTILITY - 3AN 50556 AA-- 6 -

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
POWER SUPPLY CABLE-
COMPACT
- 3AL 95074 AA-- 1 -
1696MS_C ANSI install. kit - 8DG 17425 AA-- 1 -
Kit for C_shelf install on ETSI
rack
- 8DG 17422 AA-- 1 -
Kit for C_shelf install on desk - 8DG 17423 AA-- 1 -
Opto atten MU/PC 1dB plug type 1AB 20480 0001 -

NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
type
1AB 20480 0010
type
1AB 20480 0011
type
1AB 20480 0012
type
1AB 20480 0013
type
1AB 20480 0014
type
1AB 20480 0015
type
1AB 20480 0016
2 MM 770 MM
1AB 18240 0041 -
JumperSM MU/MU cable 2mm
810
1AB 18240 0042 -
NAME ACRONYM ANV
Part Number
Max
Q.ty
SLOT Note
2 MM 650 MM
1AB 18240 0012 2
REMOVAL TOOL MU/PC
PLUG_IN ATTEN.
1AD 03860 0002 1 71
SOFTWARE 72

Table 5.4 1696MS_C explanatory notes
Note Explanation
1 It is the equipment shelf, including the back panel.
2 It is a universal bidirectional multi-clock 3R transponder supporting all the most common bit rates
(from 100 Mbps to 2.5 Gbps) and tunable over two coloured wavelenghts in C band. In case of
protection, 2 adjacent MCCs and 1 x OPC are required. The VOA allows to adjust the output
optical power.
The client optical interface is an SFP module (refer to Figure 676)
3 10Gbps transponder, ITU-T G.709 compliant, designed for 3R transport of 10 Gbps native
signals. The client interface is a B&W XFP module (some types available), accepting the
following signals
9.953Gbps (STM-64/OC-192 to serve as UNI and non-SDH/SONET signals
(10GbeWAN)
10.3125 Gbps (10Gbe LAN)
10.709 Gbps (NNI), future rel.
4 CWDM version for 10Gbps line. It can be connected to the 1530nm or 1550nm port of CWDM
Mux/Demux (CMDX, CDMDX) or extra port of CDMDX
5 Multi-rate units (discrete rates in the 0.125->2.7Gbps range) carrying two independent optical
channels. They are double transponders in one slot. The four optical interfaces are B&W and/or
CWDM SFPs. WLA1C is the low cost version, not able to perform PM
6 Multi-rate unit (discrete rates in the 0.125->2.7Gbps range) carrying one protected optical

Note Explanation
channel. It is a double transponder in one slot. The four optical interfaces are B&W and/or
CWDM SFPs
7 Multi-rate unit (discrete rates in the 0.125->2.7Gbps range) carrying two independent optical
channels. It is a double transponder in one slot. The four optical interfaces are B&W, DWDM
and/or CWDM SFPs
8 Multi-rate unit (discrete rates in the 0.125->2.7Gbps range) carrying one protected optical
channel. It is a double transponder in one slot. The four optical interfaces are B&W, DWDM
and/or CWDM SFPs
9 It performs the aggregation of 2 x GbE client signals into an SDH/SONET frame (STM-16/OC-
48). The optical interfaces are B&W, DWDM and/or CWDM, provided by SFP modules
10 Bidirectional data board with 8 pluggable (SFP) B&W or CWDM user interfaces and 2 pluggable
(XFP) B&W or DWDM line interfaces, performing the concentration of eight GbE clients into a
10GbE WAN, using a Layer 2 switch. It is also able to select some GbE signals to add/drop or to
pass-through. It can also be a transponder
11 TDM concentrator multiplexing any mix of up to four client signals (100MbpsB1.25 Gbps) into a
2.5 Gbps aggregate optical channel, SDH/SONET framing standard (STM-16/OC-48) compliant.
The aggregate optical interface can be B&W (I-S-L type) or CWDM or DWDM type, provided by
an SFP module
12 To take into account more stringent EMI requirement with the compact shelf using, the 4xANY
and 4xANY_S, the end of Alcatel-Lucent code must be:
4xANY High speed 850 nm cartridge HF-850_Drawer 3AL 86870 AAAG
4xANY Low speed 850 nm cartridge LF-850_Drawer 3AL 86869 AAAG
13 2
nd
window plug-in cartridge for 4xANY concentrator, supporting STM-1/OC-3 and STM-4/OC-
12.
If it is set as STM-1, up to four drawers can be housed in one 4xANY board; if it is set as STM-4,
up to three drawers can be housed. STM-1 drawers can be plugged on any slot. STM-4 drawers
can be plugged only on ports #3 and #4; for 3 x STM-4 configuration only, port #1 is available,
too
14 2
nd
DV.
Up to four low frequency (FE, FDDI, ESCON, DV) drawers can be housed on any port of one
4xANY
15 2
nd
Note Explanation
FC
16 1
nd
DV
Up to four low frqeuency (FE, FDDI, ESCON, DV) drawers can be housed on any port of a
4xANY
17 1
nd
FC
Up to two high frqeuency drawers can be housed only on ports #3 and #4 of a 4xANY board
18 2
nd
window plug-in electrical cartridge for 4xANY concentrator, supporting Digital Video signal
at 270 Mbps. Up to four drawers can be housed on any port of one 4xANY
19 L-1.1 B&W SFP specialized for SPV/OSC. Plugged on OSC board. L-1.1 SFP (1AB 19467 0002)
can also be plugged on OSC board.
20 STM1/4/16, GBE, FE, Fiber Channel (2FC, 1FC).... B&W SFP optical modules; they can be
fitted in 4xANY_P (aggregate side, STM-16 only), MCC3, WLA1, WLA2, WLA3, 2xGE_FC
(both line and client sides), 8xGE (client side) and OSC (L-1.1); refer to Figure 676 for further
details
21 10GbE B&W XFP optical modules; they can be fitted in OCC10_E and OCC10_EC, client side
and 8xGE, line side (refer to Figure 687 for further details)
22 Multi-rate (100Mbps to 2.7Gbps) PIN CWDM SFPs. They can be plugged in 4xANY_P,
(aggregate/WDM side), MCC3, 8xGE (user side), 2xGE_FC, WLA1, WLA2, WLA3 (both line
and user sides); refer to Figure 676 for further details
23 Multi-rate (100Mbps to 2.7Gbps) APD CWDM SFPs. Refer to point [24] above for SFPs placing
24 Multi-rate (100Mbps to 2.7Gbps) APD DWDM SFPs. They are plugged in 4xANY_P, aggregate
side, 2xGE_FC and WLA3 (aggregate and client sides); refer to Figure 676 for SFPs placing
25 APD DWDM XFPs at 10Gbps for CBR client. They are plugged in 8xGE, line side; refer to
Figure 687 for further details
26 8 x L1 channels DWDM Mux/Demux with expansion (LB/SB combiner/splitter) and Supervision,
for hub nodes. Slots 4,5,6 are available in master shelf only. Starting MUX if 32 channels hub
extension is required without amplifiers
27 8 x L1 channels DWDM Mux/Demux with expansion (LB/SB combiner/splitter), for hub nodes.

Note Explanation
Slots 4,5,6 are available in master shelf only. Starting MUX if 32 supervised channels hub
extension is required when amplifiers are used
28 8 x L2/S1/S2 channels DWDM Mux/Demux for hub nodes, used to upgrade the L1 Mux/Demux
29 Allow to add/drop 8 supervised DWDM channels in L1 (30B38)/L2 (20B28)/S1 (52B60)/S2
(42B50) band
30 Can be used also as DWDM MUX/DEMUX
31 SW managed in future releases
32 Allow to add/drop the 4 supervised DWDM channels shown in its own acronym
33 Allow to add/drop the 2 supervised DWDM channels shown in its own acronym
34 Allow to add/drop the supervised DWDM channel shown in its own acronym. From 25 to 38 are
long band channels: from 47 to 57 are short band channels
35 Allow to mux/demux a 1310nm channel, a 1550nm multiplexed signal and the SPV/OSC
(1510nm) channel. This board allows to supervise a CPE
36 Insert/extract the SPV channel to/from a 1310nm or 1550nm channel, allowing to supervise a
CPE; slot 8 is available in expansion shelf only
37 8-channel CWDM Mux/Demux. S indicates the presence of the 1310nm OSC filter. 2 indicates
the presence of LOS detector. Only slots 4, 5, 6 are available in expansion sheves
38 It is able to mux/demux 6 CWDM channels with an extra DWDM (multiplexed) port. CDMDX2-
U-S is also able to insert/extract the 1310nm OSC. Slot 2 is available in master shelf only
39 1-channel/2-channel/4-channel CWDM OADM mux/demuxes. Each board manages both west
and east sides as two mux/demuxes are integrated in each board. All the boards are also able to
insert/extract the 1310nm supervision signal and to provide LOS monitoring.
The 4-channel OADM board is two-slot wide (8TE), the other boards are one-slot wide (4TE).
Mixed cascades with DWDM mux/demux(es) are foreseen.
As regards 1 and 2-channel OADM, slot 2 is available in master shelf only.
As regards 4-channel OADM, in expansion shelves only slots 2&3 are available
40 It multiplexes one channel in C-band (one of the 32 DWDM channels or one of the 8 CWDM
channels) with the 1310nm OSC channel. Slot 8 is available in expansion shelves only
41 Double-stage optical amplifiers able to amplify all the channels. OAC2 provides short span
transmission. OAC2_L provides long spans transmission
Note Explanation
42 It includes both the equipment and shelf controller functionalities. It has to be fitted in expansion
shelves, too, to only perform the shelf controller function.
ESC2 is recommended for greenfield deployments from R.2.2A.
ESC3 is recommended for greenfield deployments from R.3.2 and further
43 The flash card contains the equipment data base
44 1510nm Optical Supervisory Channel card managing up to 2 x 1510nm OSC, 2 external 2Mps
user interfaces and the EOW (audio channel).
The SPVM2/3 board in slot 4 is exclusively linked to an OADM/OMDX. Another SPVM2 can be
installed whether in slot #5 or #6 but not in both slots #5 and #6
45 Depopulated SPVM with one 1510 nm laser, managing 1 x OSC channel
46 Low cost 1310nm Optical Supervisory Channel card managing up to 2 x 2048 supervision
streams (2 x SPV ports). Optical interfaces are two customized L-1.1 SFP modules. In master
shelf only
47 Provide the Q3 management interface allowing to the NMS to supervise the equipment. It is
directly connected to the manager
48 Hosted in master shelf only, provides 8 input accesses and 8 output accesses
49 Fitted in master and expansion shelves, it is used for monitoring the rack alarms
50 Allow the communication between the master shelf and the up to two expansion shelves, by
means of a direct connection from I-LINK_M (slot 6 of master shelf) and I-LINK_S (slot 1 of
each exp. shelf)
51 SM optical splitter with connectors, performing passive OCh (linear config.) or O-SNCP (ring
config) protection. It is linked to 2 adjacent MCC/OCC/2XGE_FC boards and plugged below the
main one. Slot 8 is available in expansion shelves only
52 MM optical splitter with connectors. In addition to the features provided by the SM splitter (ref.
51), it manages the HWF led on its front plate and the LOS alarm. Slot 8 is available in expansion
shelves only
53 MM optical splitter with connectors, used for protection of 4xANY drawers with 850nm
transceiver. Slot 8 is available in expansion shelves only.
54 Protects the OTS (path) between two NE by selecting (switching) the incoming multiplexed
signal. Slot 8 is available in expansion shelves only

Note Explanation
55 It performs short circuit from TDM bus to 2M bus so that 2Mbps SPV signals are sent/received
by ESC board to/from OSC small board. In Master shelf only
56 PSC2 is an evolution of the PSC card for the compact shelf but supply less power. It works in
1+1 protection meaning that only one board is active at once; it can be plugged both in master
and slave shelves
57 External module transforming the alternative 110/230V voltage into a -48V continuous wave,
thus allowing a 1696MS_C to be plugged directly to a power supply (avoiding the usage of a
telecom rack for feeding)
58 For power distribution; it is used only in table version
59 FAN module for compact shelf. It is equipped with two fans; an anti-dust filter has to be put on
the left side of the fans
60 Dispersion Compensating Modules providing chromatic dispersion compensation. The number in
the acronym refers to the SMF distance for which the module provides compensation. DCMs can
be placed either in the inter-stage of an optical amplifier or in the booster and preamplifier of a
link. One DCM simultaneously compensates for the chromatic dispersion of all the 1696 channels
61 To be used for external subrack power protection with optinex subrack only
62 Used to perform the HK connections from the 25p connector of the HK card to the DDF
63 Used to connect I-link_M (in master shelf) with I-Link_S (one per each slave shelf)
64 Power supply cable used only in table version. It has to be connected between the BOX and the
power supply card (input power connector)
65 Used to extract the SFP modules (plugged in 4xANY_P and MCC3)
66 Used to connect each other boards located in different shelves; i.e. the OCC10/MCC with the
relevant MUX/DEMUX and/or the MUX/DEMUX with the OAC
67 Used to connect each other boards located in the same shelf; i.e. the OCC10/MCC with the
relevant MUX/DEMUX and/or the MUX/DEMUX with the OAC
68 It includes the 4 jumpers allowing to connect a SM OPC with a couple of transponders, providing
1+1 protection. 2 codes are needed in a fully equipped transponder shelf with four OCC10/MCC
(2 + 2).
69 It includes the 4 jumpers allowing to connect a MM OPC with a couple of transponders,
providing 1+1 protection. 2 codes are needed in a fully equipped transponder shelf with four
Note Explanation
OCC10/MCC (2 + 2).
70 It includes the 4 jumpers allowing to connect an OPC with a couple of 4xANY drawers, providing
1+1 protection. 4 codes are needed in a fully equipped shelf with 8 (4 + 4) 4xANY drawers in two
4xANY
71 Used to remove the opto attenuator plug-in
72 Details concerning the software part number are given in the Operators Handbook
FAN_C board
A particular board adapted for the compact shelf is available. It also enables to manage
the Power Monitoring Unit to feed the shelf with the alternative mains supply.

Figure 5253: Fan_C board

Equipment connections
The external connections of the 1696MSPAN may fall into the following categories:
optical
management
maintenance
power supply
user interfaces.
All the equipment connections are detailed in the Installation Handbook.
Units front view in this handbook presents the front view of all the cards, where the
connection points can be identified.
In the following some general indication and reference to the relevant front view are
given.
Optical connections
Optical connections made with simple MU connectors
See Figure 54. The optical connections are made with simple MU connectors on:
MCC3 board WDM side, see Figure 56.
OPC boards, see Figure 976.
SPV-M boards, see Figure 865 and Figure 876.
MVAC boards, see Figure 654.
OMSP board, see Figure 987.

Figure 5354: Simple MU optical connector

Optical connections made with double MU connectors
See Figure 55. The optical connections are made with double MU connectors on:
OMDX and OADM boards, see Multiplexers front view.
CMDX(2) and CDMDX2 boards, see Figure 776 and Figure 787.
COAD2 boards, see from Figure 798 to Figure 810.
OAC boards, see Figure 843.
OCC10 boards WDM side, see Figure 587.
SPV_F boards, see Figure 754 and Figure 765.
OSMC board, see Figure 9089.
MVAC10 board, see Figure 665.
F1310 board, see Figure 832.

Figure 5455: Double MU optical connector

Optical connections made with LC connectors
The optical connections are made with LC connectors on:
4xANY_P board client side, see Figure 643.
all the SFP modules (B&W, CWDM, DWDM, refer to Figure 676 for further details),
plugged on
4xANY_P aggregate side, see Figure 643.
MCC3 client side, see Figure 576.
8xGE client side, see Figure 622.
2xGE_FC both on client and line sides, see Figure 611.
WLA1C both on client and line sides, see Figure 58.
WLA2 boards (WLA2M and WLA2M_OP) both on client and line sides, see Figure 59
and Figure 60; only LC/PC connectors must be used, LC/APC connectors must not be
plugged in WLA2 boards

WLA3 boards (WLA3CD and WLA3CDOP) both on client and line sides, see Figure 59
and Figure 60.
OSC, see Figure 887.
all the XFP modules (B&W, DWDM, refer to Figure 687 for further details), plugged on
OCC10 boards client side, see Figure 57.
8xGE line side, see Figure 62.
Management and maintenance connections
Housekeeping
The housekeeping alarm signal are available on the front panel connector of the HK
board. It is a 25 pin SUB-D Female connector.
Note: 25 pin SUB-D connector is connected to GNDM by the 2 screws holes
called pin 26 and pin 27.
See Figure 943.
Rack Alarm Interfaces
The rack alarm interface signals are available on the two front panel connectors of the
RAI board. These two interfaces are:
A 9 pins SUB-D female connector, which provides the interface between the master shelf and
the TRU (or PDU),
A 6 pins RJ11 connector, which provides the interface between two shelves.
See Figure 94.
LAN accesses
The LAN board provides LAN accesses on both RJ-45 and BNC connectors.
*LAN access code 3AL 86653 AAAD or later must be used for LAN_I
installations in slot 27. Any variant of 3AL 86653AA may be used for
LAN_Q in master slot 26.
See Figure 932.
Q3 Interface
At the ESC front panel, a 9-pin SUB-D female connector provides an access to an
Q3 interface. It allows to connect a Craft Terminal.
See Figure 854.

1696MS_C Intershelf link
The 15-pin SUB-D female connector, located on the front panel of the I-link_M and I-
link_S boards, allows to link the SPI bus and the card presence signal from slave to
master 1696MS_C shelves.
DBG Interface Connector
8-pin RJ45 connectors at the front-panel of the ESC board, are used for the DBG
interface (factory tests).
See Figure 854.
Power supply connections
Power supply voltage is distributed to the shelves on a 3 pin SUB-D connector, in front
panel of each PSC.
See Figure 998.
It is also available on the M1 and M2 connectors of the Power Monitoring Unit.
User interfaces
The user interfaces are available on the front panel connector of the UIC(s).
52 pin SCSI-2 Female connector of the UIC.
Note: 50 pin SUB-D connector is connected to GNDM by the 2 screws holes
called pin 51 and pin 52.
See Figure 965.

Units front view
The following paragraphs show the units front views and the relevant access points
(Leds, switches etc.) together with legenda and meaning.
Tributaries front view
U s e r T x ( S F P ) * *
U s e r R x ( S F P ) * *
W D M R x
W D M T x
H a r d w a r e f a i l u r e
L E D
E x t r a c t i o n
h a n d l e
E x t r a c t i o n h a n d l e
O p t i c a l s a f e t y
l a b e l
3
A
L
9
5
1
5
0
A
X
A b n o r m a l T x L E D
A b n o r m a l R x L E D
O u t O f S e r v ic e L E D
P o w e r f a i l u r e L E D
A P S D r e s t a r t
p u s h - b u t t o n
ACRONYM
4;5;6;7;
MCC3
8;9;10;11
N a m e
14;15;16;17;
18;19;20;21
M e a n i n g
G r e e n
R e d l e d
T h e p o w e r l e d i s G r e e n t o i n d i c a t e p o w e r o p e r a t i o n a l .
I t i s R e d w h e n t h e i n t e r n a l p o w e r s u p p l y i s s w i t c h e d - o f f ( i . e .
a t u n i t s t a r t - u p ) o r w h e n i t i s f a i l e d .
Y e l l o w l e dT h i s l e d i s O N w h e n t h e b o a r d i s p l u g g e d b u t n o t c o n f i g u r e d b y
t h e s o f t w a r e
Y e l l o w l e d
R x a b n o r m a l : p r o b l e m o n t h e r e c e i v e s i d e , d e p e n d i n g o n t h e c o n
f i g u r a t i o n . T h e L E D i s O N w h e n
1 ) A d d / D r o p c o n f i g u r a t i o n : W D M R x a l a r m s o r U s e r T x a l a r m s
I L O S _ W D M , L O F _ S D H _ W D M , L O C _ U S E R _ T X , D E G _ O U T _ S F P
2 ) P a s s - t h r o u g h c o n f i g u r a t i o n . : W D M R x a l a r m s
I L O S _ W D M , L O F _ S D H _ W D M
3 ) S h u t - d o w n o f t h e S F P T x
Y e l lo w le d
T x a b n o r m a l : p r o b l e m o n t h e t r a n s m i t s i d e , d e p e n d i n g o n t h e c o n
f i g u r a t i o n . T h e L E D i s O N w h e n
1 ) A d d / D r o p c o n f i g u r a t i o n : U s e r R x a l a r m s o r W D M T x a l a r m s
I L O S _ U s e r ( o n S F P ) , L O F _ S D H _ U s e r , L O S _ W D M _ T x ,
D E G _ O U T _ W D M , T O R _ W D M
2 ) P a s s - t h r o u g h c o n f i g u r a t i o n : W D M T x a l a r m s
L O S _ W D M _ T x , D E G _ O U T _ W D M , T O R _ W D M
3 ) S h u t - d o w n o f t h e W D M T x
G r e e n /
Y e l l o w /
R e d l e d
U s e r R x - U s e r R e c e p t i o n : c l i e n t i n p u t s i g n a l ( f r o m c l i e n t ) *
U s e r T x - U s e r T r a n s m i s s i o n : c l i e n t o u t p u t s i g n a l ( t o c l i e n t ) *
W D M R x - W D M R e c e p t i o n : W D M i n p u t s i g n a l f r o m O M D X / O A D M
W D M T x - W D M T r a n s m i s s i o n : W D M o u t p u t s i g n a l t o
O M D X / O A D M
N . B . * * U s e r T X a n d U s e r R X a c c e s s p o i n t s h a v e t o b e e q u i p p e d w i t h
S m a l l F o r m f a c t o r P l u g g a b l e ( S F P ) o p t i c a l m o d u l e s , s h o w n i n
F i g u r e 6 6 . o n p a g e 1 4 9
1696MS
SLOTS
1696MS_C
SLOTS
2; 3; 4; 5; 6
H a r d w a r e f a i l u r e . T h e L E D i s
- O F F w h e n t h e b o a r d i s p l u g g e d b u t n o t c o n f i g u r e d
- G R E E N w h e n t h e b o a r d i s p l u g g e d , c o n f i g u r e d a n d w i t h o u t f a i l u r e
- Y E L L O W w h e n t h e b o a r d i s i n f i r m w a r e d o w n l o a d s t a t e *
- R E D w h e n H W f a i l u r e , p o w e r s u p p l y f a i l u r e o r f a i l u r e i n c o m m u
n i c a t i o n w i t h t h e b o a r d
Access points description (from top to bottom)
N . B . * N e v e r u n p l u g o r m o d i f y t h e c o n f i g u r a t i o n o f a b o a r d w h i l e t h i s
i s o n f i r m w a r e d o w n l o a d s t a t e . S h o u l d t h i s o c c u r , t h e b o a r d w i l l
n o t r e s t a r t a n d m a y h a v e t o b e r e t u r n e d f o r f a c t o r y r e p a i r .

Figure 5556: MCC3 front panel

U s e r T x ( X F P ) * *
U s e r R x ( X F P ) * *
W D M R x
W D M T x
L e d
E x t r a c t i o n
h a n d l e
E x t r a c t i o n
A b n o r m a l T x L e d
A b n o r m a l R x L e d
O u t O f S e r v i c e L e d
P o w e r fa i l u r e L e d
A P S D r e s t a r t
p u s h - b u t t o n
N a m e M e a n i n g
G r e e n l e d
M a n a g e d b y h a r d w a r e . T h i s l e d i s O N w h e n t h e b o a r d i s
p l u g g e d i n a b s e n c e o f h a r d w a r e f a i l u r e ( H W F )
Y e l l o w l e d
T h i s l e d i s O N w h e n t h e b o a r d i s p l u g g e d b u t n o t c o n f i g u r e d b y
t h e s o f t w a r e
Y e l l o w l e d
R x a b n o r m a l : p r o b l e m o n t h e r e c e i v e s i d e . M a n a g e d b y S W .
T h e L E D i s O N w h e n
- ( L O S / L O F _ O T N / L O M _ O T N ) _ W D M _ R X
- D E G _ O U T _ U s e r _ T X
- X F P a b s e n t
T h e L E D i s O N o n l y i f t h e a l a r m i s s h o w n "

Y e ll o w l e d
T x a b n o r m a l : p r o b l e m o n t h e t r a n s m i t s i d e . M a n a g e d b y S W .
T h e L E D i s O N w h e n S D o r
- L O S _ U s e r _ R X
- ( L O S / D E G _ O U T / T O R ) _ W D M _ T X
- X F P a b s e n t
T h e L E D i s O N o n l y i f t h e a l a r m i s s h o w n "
G r e e n /
Y e l l o w /
R e d l e d
H a r d w a r e f a i l u r e . M a n a g e d b y S W . T h e L E D i s
- g r e e n w h e n t h e b o a r d i s p l u g g e d , c o n f i g u r a n d w / o f a i l u r e
- y e l l o w w h e n t h e b o a r d i s i n f i r m w a r e d o w n l o a d s t a t e *
- r e d w h e n o n e o f t h e O n B o a r d p o w e r s u p p l y ( O B P S ) i s i n f a i l
u r e ( O R o n t h e p o w e r s u p p l y a l a r m s )
U s e r R x - U s e r R e c e p t i o n : c l i e n t i n p u t s i g n a l ( f r o m c l i e n t )
U s e r T x - U s e r T r a n s m i s s i o n : c l i e n t o u t p u t s i g n a l ( t o c l i e n t )
W D M R x - W D M R e c e p t i o n : W D M i n p u t s i g n a l f r o m
O M D X / O A D M
W D M T x - W D M T r a n s m i s s i o n : W D M o u t p u t s i g n a l t o
O M D X / O A D M
N . B . * W h e n a b o a r d i s o n f i r m w a r e d o w n l o a d s t a t e , t h e h a r d w a r e f a i l u r e
l e d o n t h e f r o n t b o a r d l i g h t s o n y e l l o w c o l o u r . N e v e r u n p l u g o r
m o d i f y t h e c o n f i g u r a t i o n o f a b o a r d w h i l e t h i s L E D i s y e l l o w .
S h o u l d t h i s o c c u r , t h e b o a r d w i l l n o t r e s t a r t a n d m a y h a v e t o
b e r e t u r n e d f o r f a c t o r y r e p a i r .
* * U s e r T X a n d U s e r R X a c c e s s p o i n t s h a v e t o b e e q u i p p e d w i t h
X F P o p t i c a l m o d u l e s , s h o w n i n F i g u r e 6 7 . o n p a g e 1 5 0
* * * W h e n t h e b o a r d i s c o n f i g u r e d i n l o o p b a c k , t h e R X A a n d T X A
L E D s a r e a l w a y s t u r n e d O F F .
1 0 G b p s f r o n t p a n e l l i n k t o s u b s t i t u t e b a c k p a n e l l i n k s , w h e n
o n l y 2 . 5 G b b a c k p a n e l i s p r e s e n t
1 0 G b p s R x
1 0 G b p s T x
ACRONYM
4;5;6;7;
8;9;10;11 OCC10_E
14;15;16;17;
18;19;20;21
1696MS
SLOTS
1696MS_C
SLOTS
2; 3; 4; 5; 6
la b e l
h a n d l e
OCC10_EC
N . B . M a k e s u r e f i b e r s a r e d i s c o n n e c t e d w h e n p l u g g i n g / u n p l u g
g i n g a n O C C 1 0 _ E / O C C 1 0 _ E C c a r d

Figure 5657: OCC10_E and OCC10_EC front panel

N . B . * * A l l t h e W D M a n d U s e r a c c e s s p o i n t s a r e e q u i p p e d w i t h S F P
o p t i c a l m o d u l e s , s h o w n i n F i g u r e 6 6 . o n p a g e 1 4 9
U s e r T x C H 2 * *
U s e r R x C H 2 * *
U s e r T x C H 1 * *
U s e r R x C H 1 * *
W D M R x C H 2 * *
W D M T x C H 2 * *
W D M R x C H 1 * *
W D M T x C H 1 * *
( S P I ) L e d
E x t r a c t i o n
h a n d l e
E x t r a c t i o n
C H 2 A b n o r m a l L e d
G r e e n l e d
M a n a g e d b y h a r d w a r e . T h e l e d i s O N w h e n t h e b o a r d i s
p l u g g e d i n a b s e n c e o f h a r d w a r e f a i l u r e ( H W F ) .
I t i s O F F w h e n o n e o f t h e l o c a l p o w e r s u p p l y i s i n f a i l u r e
Y e l l o w l e d
T h i s l e d i s O N w h e n t h e b o a r d i s p l u g g e d b u t n o t c o n f i g u r e d
b y t h e s o f t w a r e
Y e l lo w l e d
L e d O N m e a n s p r o b l e m o n c h a n n e l 1 , s u c h a s T X _ F A U L T ,
I L O S o r b o a r d n o t c o n f i g u r e d
Y e l l o w l e d
G r e e n /
R e d l e d
T h e l e d i s G R E E N w h e n t h e b o a r d i s p r o p e r l y e q u i p p e d ,
p r o v i s i o n e d a n d I n - s e r v i c e .
I t i s R E D b e f o r e s o f t w a r e c o n f i g u r i n g i s f i n i s h e d a n d b e
c o m e s G R E E N w h e n t h e c a r d c o n f i g u r i n g i s f i n i s h e d
C H 2 W D M R e c e p t i o n - C H 2 i n p u t s i g n a l f r o m m u x / d e
m u x o r O A D M b o a r d
C H 2 W D M T r a n s m i s s i o n - C H 2 o u t p u t s i g n a l , t o m u x /
d e m u x o r O A D M b o a r d
ACRONYM
4;5;6;7;
8;9;10;11
WLA1C
14;15;16;17;
18;19;20;21
1696MS
SLOTS
1696MS_C
SLOTS
2; 3; 4; 5; 6
l a b e l
h a n d l e
I L O S o r b o a r d n o t c o n f i g u r e d
C H 1 W D M R e c e p t i o n - C H 1 i n p u t s i g n a l f r o m m u x / d e
m u x o r O A D M b o a r d
C H 1 W D M T r a n s m i s s i o n - C H 1 o u t p u t s i g n a l , t o m u x /
d e m u x o r O A D M b o a r d
C H 2 U s e r R e c e p t i o n - C H 2 i n p u t s i g n a l , f r o m c l i e n t
C H 2 U s e r T r a n s m i s s i o n - C H 2 o u t p u t s i g n a l , t o c l i e n t
C H 1 U s e r R e c e p t i o n - C H 1 i n p u t s i g n a l , f r o m c l i e n t
C H 1 U s e r T r a n s m i s s i o n - C H 1 o u t p u t s i g n a l , t o c l i e n t
N . B . * N e v e r u n p l u g o r m o d i f y t h e c o n f i g u r a t i o n o f a b o a r d w h i l e
t h i s i s o n f i r m w a r e d o w n l o a d s t a t e . S h o u l d t h i s o c c u r , t h e b o a r d
w i l l n o t r e s t a r t a n d m a y h a v e t o b e r e t u r n e d f o r f a c t o r y r e p a i r .

Figure 5758: WLA1C front panel

U s e r T x C H 2 * *
U s e r R x C H 2 * *
W D M R x C H 2 * *
W D M T x C H 2 * *
( S P I ) L e d
E x t r a c t i o n
h a n d l e
E x t r a c t i o n
G r e e n l e d
Y e l l o w l e d
Y e l lo w l e d
I L O S , L O F o r b o a r d n o t c o n f i g u r e d
Y e l l o w l e d
G r e e n /
Y e l l o w /
R e d l e d
L E D O F F w h e n t h e b o a r d i s p l u g g e d b u t n o t c o n f i g u r e d
G R E E N L E D : b o a r d p l u g g e d , c o n f i g u r e d a n d w / o f a i l u r e
R E D L E D : H W f a i l u r e , p o w e r s u p p l y f a i l u r e o r f a i l u r e i n c o m
m u n i c a t i o n w i t h t h e b o a r d
Y E L L O W L E D : t h e b o a r d i s i n F W d o w n l o a d s t a t e *
C H 2 W D M R e c e p t i o n - C H 2 W D M i n p u t s i g n a l f r o m
m u x / d e m u x o r O A D M b o a r d
C H 2 W D M T r a n s m i s s i o n - C H 2 W D M o u t p u t s i g n a l , t o
N . B . * * A l l t h e W D M a n d U s e r a c c e s s p o i n t s a r e e q u i p p e d w i t h S F P
ACRONYM
4;5;6;7;
8;9;10;11 WLA2M
14;15;16;17;
18;19;20;21
1696MS
SLOTS
1696MS_C
SLOTS
2; 3; 4; 5; 6
l a b e l
h a n d l e
W D M R x C H 1 * *
W D M T x C H 1 * *
U s e r T x C H 1 * *
U s e r R x C H 1 * *
I L O S , L O F o r b o a r d n o t c o n f i g u r e d
C H 1 W D M R e c e p t i o n - C H 1 W D M i n p u t s i g n a l f r o m
C H 1 W D M T r a n s m i s s i o n - C H 1 W D M o u t p u t s i g n a l , t o
C H 2 U s e r R e c e p t i o n - C H 2 B & W i n p u t s i g n a l , f r o m c l i e n t
C H 2 U s e r T r a n s m i s s io n - C H 2 B & W o u t p u t s ig n a l , t o c l i e n t
C H 1 U s e r R e c e p t i o n - C H 1 B & W i n p u t s i g n a l , f r o m c l i e n t
C H 1 U s e r T r a n s m i s s io n - C H 1 B & W o u t p u t s ig n a l , t o c l i e n t
WLA3CD
N . B . * W L A 3 C D o n l y . N e v e r u n p l u g o r m o d i f y t h e c o n f i g u r a t i o n o f
a b o a r d w h i l e t h i s i s o n F W d o w n l o a d s t a t e . S h o u l d t h i s o c c u r , t h e
b o a r d w i l l n o t r e s t a r t a n d m a y h a v e t o b e r e t u r n e d f o r f a c t o r y r e p a i r .

Figure 5859: WLA2M and WLA3CD front panel

U s e r T x C H 2 *
U s e r R x C H 2 *
W D M R x C H 2 *
W D M T x C H 2 *
( S P I ) L e d
E x t r a c t i o n
h a n d l e
E x t r a c t i o n
G r e e n le d
Y e l l o w l e d
Y e l l o w l e d
L e d O N m e a n s p r o b l e m o n c h a n n e l 1 , s u c h a s T X _ F A U L T
o r C D R _ U N L O C K
Y e l l o w l e d
G r e e n /
Y e l l o w /
R e d l e d
N . B . * A l l t h e W D M a n d U s e r a c c e s s p o i n t s a r e e q u i p p e d w i t h S F P
ACRONYM
4;5;6;7;
8;9;10;11 WLA2M_OP
14;15;16;17;
18;19;20;21
1696MS
SLOTS
1696MS_C
SLOTS
2; 3; 4; 5; 6
l a b e l
h a n d l e
WLA3CD_OP
W D M R x C H 1 *
W D M T x C H 1 *
U s e r T x C H 1 *
U s e r R x C H 1 *
L e d O N m e a n s p r o b l e m o n c h a n n e l 2 , s u c h a s T X _ F A U L T
o r C D R _ U N L O C K
C H 1 a n d C H 2 W D M R e c e p t i o n - W D M i n p u t s i g n a l s
f r o m m u x / d e m u x o r O A D M b o a r d
C H 1 a n d C H 2 W D M T r a n s m i s s i o n - W D M o u t p u t s i g
n a l s , t o m u x / d e m u x o r O A D M b o a r d
C H 2 a n d C H 1 U s e r R e c e p t i o n - B & W i n p u t s i g n a l s , f r o m
c l i e n t
C H 2 a n d C H 1 U s e r T r a n s m i s s i o n - B & W o u t p u t s i g n a l s , t o
c l i e n t
C o u p l e r o u t p u t - B & W o u t p u t s i g n a l t o c l i e n t
S p l i t t e r i n p u t - B & W i n p u t s i g n a l f r o m c l i e n t
C H 2 a n d C H 1 s p l i t t e r o u t p u t s i g n a l , t o U s e r ( B & W )
R x C H 2 a n d U s e r R x C H 1
C H 2 a n d C H 1 c o u p l e r i n p u t s i g n a l , f r o m U s e r ( B & W )
T x C H 2 a n d U s e r T x C H 1
C O U P O U T
S P L I T I N
S P L I T O U T C H 2
C O U P I N C H 2
S P L I T O U T C H 1
C O U P I N C H 1
L E D O F F w h e n t h e b o a r d i s p l u g g e d b u t n o t c o n f i g u r e d
R E D L E D : H W f a i l u r e , p o w e r s u p p l y f a i l u r e o r f a i l u r e i n c o m
m u n i c a t i o n w i t h t h e b o a r d
N . B . * W L A 3 C D O P o n l y . N e v e r u n p l u g o r m o d i f y t h e c o n f i g u r a t i o n o f
a b o a r d w h i l e t h i s i s o n F W d o w n l o a d s t a t e . S h o u l d t h i s o c c u r , t h e
b o a r d w i l l n o t r e s t a r t a n d m a y h a v e t o b e r e t u r n e d f o r f a c t o r y r e p a i r .

Figure 5960: CWLA2M_OP and CWLA3CDOP front panel

Reviewers I need the original source of this
Figure
Figure 6061: 2xGE_FC front panel

L i n e 1 T r a n s m i s s i o n - L i n e / a g g r . o u t p u t s i g n a l , t o m u x / d e m u x
o r O A D M b o a r d ( i f W D M X F P ) o r t o t r a n s p o n d e r ( i f B & W X F P ) .
T h i s p o r t i s u s e d i n c o n c e n t r a t i o n a n d a d d / d r o p m o d e s
R e d l e d
L i n e 2 R x * *
L i n e 2 T x * *
H W F A I L U R E
( S P I ) L E D
E x t r a c t i o n
h a n d l e
G r e e n /
Y e l l o w /
R e d l e d
N . B . * * A l l t h e U s e r a n d L i n e a c c e s s p o i n t s a r e e q u i p p e d w i t h S F P
a n d X F P o p t i c a l m o d u l e s r e s p e c t i v e l y , s h o w n i n F i g u r e 6 6 . o n
p a g e 1 4 9 a n d F i g u r e 6 7 . o n p a g e 1 5 0
ACRONYM
4;5;6;7; 8;9;10;11
14;15;16;17; 18;19;20;21
8xGE 2; 3; 4; 5; 6
l a b e l
L i n e 1 R x * *
L i n e 1 T x * *
N . B . * N e v e r u n p l u g o r m o d i f y t h e c o n f i g u r a t i o n o f a b o a r d w h i l e
t h i s i s o n f i r m w a r e d o w n l o a d s t a t e . S h o u l d t h i s o c c u r , t h e
b o a r d w i l l n o t r e s t a r t a n d m a y h a v e t o b e r e t u r n e d f o r f a c t o
r y r e p a i r .
U s e r 3 T x * *
L i n e 1 R e c e p t i o n - L i n e / a g g r . i n p u t s i g n a l f r o m m u x / d e m u x o r
O A D M b o a r d ( i f W D M X F P ) o r f r o m t r a n s p o n d e r ( i f B & W X F P ) .
T h i s p o r t i s u s e d i n c o n c e n t r a t i o n a n d a d d / d r o p m o d e s
U s e r 3 R x * *
U s e r 4 T x * *
U s e r 4 R x * *
U s e r 1 T x * *
U s e r 1 R x * *
U s e r 2 T x * *
U s e r 2 R x * *
A b o v e c o n n e c t o r : t r a n s m i s s i o n t o U s e r 1 - o u t p u t s i g
n a l t o C l i e n t 1
L E D O F F : t h e b o a r d i s p l u g g e d b u t n o t c o n f i g u r e d
R E D L E D : o n e o f t h e l o c a l p o w e r s u p p l i e s i s i n f a i l u r e
U S E R O O S
L I N E 2 A B N
L I N E 1 A B N
P O W E R O N
P 1
P 2
P 3
P 4
P 5
P 6
P 7
P 8
L 1
L 2
U s e r 7 T x * *
U s e r 7 R x * *
U s e r 8 T x * *
U s e r 8 R x * *
U s e r 5 T x * *
U s e r 5 R x * *
U s e r 6 T x * *
U s e r 6 R x * *
R E D L E D : o n e ( o r m o r e ) p o w e r s u p p l y i s i n f a i l u r e
G r e e n /
Y e ll o w l e d
L E D O F F : n o s i g n a l f a i l u r e ( L i n e 1 i s O K )
L E D O N : I L O S _ L 1 o r R S _ L O F _ L 1 a l a r m i s r a i s e d
Y e ll o w l e d
L E D O F F : n o s i g n a l f a i l u r e ( L i n e 2 i s O K )
L E D O N : I L O S _ L 2 o r R S _ L O F _ L 2 a l a r m i s r a i s e d
Y e ll o w l e d
L E D O F F : n o s i g n a l f a i l u r e ( a l l u s e r s a r e O K )
L E D O N : I L O S _ u s e r o r L O S y _ u s e r a l a r m i s r a i s e d
o n a n y u s e r p o r t
B e l o w c o n n e c t o r : r e c e p t i o n f r o m U s e r 1 - i n p u t s i g n a l
f r o m C l i e n t 1
P 1
T h e s a m e a s P 1 , b u t r e f e r r e d t o U s e r 2 t o 8
P 2
t o
P 8
L 1
L i n e 2 R e c e p t i o n - L i n e / a g g r . i n p u t s i g n a l f r o m m u x / d e m u x
o r O A D M b o a r d ( i f W D M X F P ) o r f r o m t r a n s p o n d e r ( i f B & W
X F P ) . T h i s p o r t i s u s e d i n a d d / d r o p m o d e o n l y
L i n e 2 T r a n s m i s s i o n - L i n e / a g g r . o u t p u t s i g n a l , t o m u x / d e m u x
o r O A D M b o a r d ( i f W D M X F P ) o r t o t r a n s p o n d e r ( i f B & W X F P ) .
T h i s p o r t i s u s e d i n a d d / d r o p m o d e o n l y
L 2
1696MS SLOTS 1696MS_C SLOTS

Note: Plug the optical fibers to SFPs after the SFP SW configuration.

Figure 6162: 8xGE front panel

Note: Plug the optical fibers to SFPs after the SFP SW
configuration.

Figure 6263Figure 63: TRBD1996 front panel

C l i e n t
s i g n a l
1
E x t r a c t i o n
h a n d l e
3
A
L
X
X
X
X
X

X
H a r d w a r e f a i l u r e L E D
A b n o r m a l t r a n s m i s s i o n L E D
A b n o r m a l r e c e p t io n L E D
O u t O f S e r v i c e L E D
P o w e r p r e s e n c e L E D
H
A
Z
A
R
D

L
E
V
E
L

1
L
A
S
E
R

P
R
O
D
U
C
T
D r a w e r 1
T x
E x t r a c t i o n
h a n d l e
P o w e r p r e s e n c e L E D
C l i e n t
s i g n a l
2
D r a w e r 2
P o w e r
p r e s e n c e
L E D
C l i e n t
s i g n a l
3
D r a w e r 3
P o w e r
p r e s e n c e
L E D
C l i e n t
s i g n a l
4
D r a w e r 4
P o w e r
p r e s e n c e
L E D
T x
R x
T x
R x
T x
R x
S T M 1 6
a g g r e g a t e
s i g n a l * *
R x
R x
T x
ACRONYM
2-3; 4-5; 6-7;
8-9; 10-11;
12-13; 14-15;
16-17; 18-19;
20-21; 22-23
P W R
G r e e n l e d
M a n a g e d b y h a r d w a r e . I t i s O N w h e n t h e b o a r d i s
p l u g g e d a n d n o p o w e r f a i l u r e d e t e c t e d
O O S
Y e l l o w l e d
T h i s l e d i s O N w h e n t h e b o a r d i s p l u g g e d b u t n o t c o n
f i g u r e d b y t h e s o f t w a r e
R X A
Y e l l o w
l e d
R x a b n o r m a l : p r o b l e m o n t h e r e c e iv e s i d e . O N m e a n s
- S D d r a w e r s
- I L O S o n S T M - 1 6 s i d e .
M a n a g e d b y s o f t w a r e
T X A
Y e l l o w
l e d
T x a b n o r m a l : p r o b l e m o n t h e t r a n s m i t s i d e . O N m e a n s
- I L O S o n d r a w e r s i d e .
M a n a g e d b y s o f t w a r e .
G r e e n /
Y e l l o w /
R e d l e d
- G r e e n w h e n t h e b o a r d i s p l u g g e d , c o n f i g u r e d a n d
w i t h o u t f a i l u r e
- Y e l l o w w h e n t h e b o a r d i s p l u g g e d a n d i n f i r m w a r e
d o w n l o a d s t a t e *
- R e d w h e n o n e o f t h e O n B o a r d p o w e r s u p p l y
( O B P S ) i s i n f a i l u r e ( O R o n t h e p o w e r s u p p l y a l a r m s )
1696MS
SLOTS
1696MS_C
SLOTS
2-3;
4-5
4 X ANY_P
N . B . M a k e s u r e f i b e r s a r e d i s c o n n e c t e d w h e n p l u g g i n g / u n p l u g
g i n g t h e d r a w e r s o r t h e 4 x A N Y h o s t c a r d .
N . B . * W h e n a b o a r d i s o n f i r m w a r e d o w n l o a d s t a t e , t h e h a r d w a r e f a i l
u r e l e d o n t h e f r o n t b o a r d l i g h t s o n y e l l o w c o l o u r . N e v e r u n p l u g
o r m o d i f y t h e c o n f i g u r a t i o n o f a b o a r d w h i l e t h i s L E D i s y e l
l o w . S h o u l d t h i s o c c u r , t h e b o a r d w i l l n o t r e s t a r t a n d m a y
h a v e t o b e r e t u r n e d f o r f a c t o r y r e p a i r .
* * T h e a g g r e g a t e / W D M i n t e r f a c e i s a B & W ( S T M - 1 6 ) o r C W D M
o r D W D M S F P o p t i c a l m o d u l e ( r e f e r t o F i g u r e 6 6 . o n p a g e 1 4 9 )

Figure 636463: 4xANY front panel

E x t r a c t i o n
h a n d l e
E x t r a c t i o n
h a n d l e
P W R
G r e e n / R e d
l e d
P o w e r a n d h a r d w a r e f a i l u r e l e d . I t i s
- G r e e n w h e n t h e b o a r d i s p l u g g e d , c o n f i g u r e d a n d
- R e d w h e n t h e c a r d i s p l u g g e d a n d i n h a r d w a r e f a i l u r e
I n p u t s i g n a l s ( c a b l e c o n n e c t i o n 1 a n d 2 ) t o b e a d j u s t e d
b y t h e 2 V O A s o f t h e M V A C b o a r d
3
A
L
8
6
8
9
2
A
A
V O A 1 i n p u t
V O A 1 o u t p u t
V O A 2 i n p u t
V O A 2 o u t p u t
ACRONYM
4;5;6;7;8;9
10;11;12;13
MVAC
14;15;16;17;
18;19;20;21
1696MS
SLOTS
1696MS_C
SLOTS
Not used
O u t p u t s i g n a l s ( c a b l e c o n n e c t i o n 1 a n d 2 ) a d j u s t e d /
o p t i m i z e d b y t h e 2 V O A s o f t h e M V A C b o a r d
P o w e r a n d H a r d w a r e f a ilu r e L E D
t o
t o

Figure 646564: MVAC front panel

E x t r a c t i o n
h a n d l e
P o w e r a n d H a r d w a r e f a i l u r e L E D
E x t r a c t i o n
h a n d l e
G r e e n / R e d
l e d
P o w e r a n d h a r d w a r e f a i l u r e l e d . I t i s
- G r e e n w h e n t h e b o a r d i s p l u g g e d , c o n f i g u r e d a n d w i t h o u t
f a i l u r e
- R e d w h e n t h e c a r d i s p l u g g e d a n d i n h a r d w a r e f a i l u r e
I n p u t s i g n a l s ( c a b l e c o n n e c t i o n 1 , 2 . . . t o 1 0 ) t o b e a d j u s t e d
b y t h e t e n V O A s o f t h e M V A C 1 0 b o a r d
V O A 1 i n p u t
V O A 1 o u t p u t
V O A 2 i n p u t
V O A 2 o u t p u t
ACRONYM
4;5;6;7;8;9
10;11;12;13
MVAC10
14;15;16;17;
18;19;20;21
1696MS
SLOTS
1696MS_C
SLOTS
Not used
O u t p u t s i g n a l s ( c a b l e c o n n e c t i o n 1 , 2 . . . t o 1 0 ) a d j u s t e d /
o p t i m i z e d b y t h e t e n V O A s o f t h e M V A C 1 0 b o a r d
t o
t o
V O A 3 i n p u t
V O A 3 o u t p u t
V O A 4 i n p u t
V O A 4 o u t p u t
V O A 5 i n p u t
V O A 6 o u t p u t
V O A 7 i n p u t
V O A 7 o u t p u t
V O A 8 i n p u t
V O A 8 o u t p u t
V O A 9 i n p u t
V O A 9 o u t p u t
V O A 1 0 in p u t
V O A 1 0 o u t p u t

Figure 656665: MVAC10 front panel

SFP optical module
Optical cables
ACRONYM EQUIPPED ONPORT
I N P U T S I G N A L
O U T P U T S I G N A L
B&W STM-16 SFP: S-16.1; I-16.1
4xANY_P, 2xGE_FC (Line side)
MCC3 (client side)
B&W FC SFP : FC/2FCmm; FC/2FCsm
B&W STM-4 SFP: S-4.1; L-4.1; L-4.2
B&W STM-1 SFP: S-1.1; L-1.1; L-1.2
B&W GbESFP: 1GbELX; 1GbESX; 1GbEZX
CWA147 -> CWA161
CWP147 -> CWP161
CWDM SFP:
B&W FESFP: 100BLX
DWA600 -> DWA200
DWDM SFP:
MCC3, 8xGE(Client side)
4xANY_P (Line side)
4xANY_P (Line side)
MCC3 (Client side)
B&W STM16 SFP: L-16.1; L-16.2
WLA3CD(OP) (both sides)
All WLAs (both sides)
2xGE_FC (client side)
OSC (L-1.1 only)
2XGE_FC (both sides)
2XGE_FC (Line side)
8xGE(client side)
B&W SFP: 2M OSC
Multirate SFP (100M to 2.5G): S-16_A
(1GbEand FC SFP only)
(1GbESFP only)

Figure 666766: SFP optical module

XFP optical module
ACRONYM EQUIPPED ONPORT
B&W STM-64 / 10GbEXFP:
OCC10_E(client side)
B&W 10GbEXFP: X10GBASE-S
XS642; XI641
Output signal
Input signal
OCC10_EC (client side)
8 x G E ( l i n e s i d e )
DWDM XFP: XL-642C
8 x G E ( l i n e s i d e )

Figure 676867: XFP optical module

Multiplexers front view
3
7
3
6
3
5
3
3
3
2
3
1
3
0
S
E
X
C
h
#
3
8
W D M T x i n
W D M R x o u t
E x t r a T x i n
E x t ra R x o u t
M o n i t o r i n g
L in e
L i n e T x o u t
L i n e R x i n
E x t r a
c h a n n e l s
S P V T x in
S P V R x o u t
S u p e r v i s i o n
S B T x i n
S B R x o u t
E x p a n s i o n
H a r d W a r e
F a i l u r e L E D
E x t r a c t i o n
h a n d l e
l a b e l
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
M o n i t o r T x o u t
M o n it o r R x o u t
3
A
L
8
6
6
1
5
X
X
G r e e n /
R e d l e d
- G r e e n w h e n t h e b o a r d i s p l u g g e d , c o n f i g a n d w i t h o u t f a i l u r e
- R e d w h e n o n e o f t h e O n B o a r d p o w e r s u p p l y ( O B P S ) is i n
f a i l u r e ( O R o n t h e p o w e r s u p p l y a l a r m s )
ACRONYM
2; 3; 4; 5; 6;
OMDX8100_M_L1_XS
12; 13; 22
M o n it o r
T x o u t
O u t p u t p o w e r m e a s u r e m e n t s i g n a l ( t o o p t i c a l m e a s u r e m e n t d e
v i c e )
M o n i t o r
R x o u t
I n p u t p o w e r m e a s u r e m e n t s i g n a l ( t o o p t i c a l m e a s u r e m e n t d e
v i c e )
L i n e T x o u t L i n e T r a n s m i s s i o n o u t p u t s i g n a l ( t o l i n e )
L i n e R x i n L i n e R e c e p t i o n i n p u t s i g n a l ( f r o m l i n e )
W D M T x i n
W D M t r a n s m i s s i o n i n p u t s i g n a l , f r o m c o r r e s p o n d i n g t r a n s p o n d
e r ( C h . 3 0 B 3 8 )
W D M R x
o u t
W D M r e c e p t i o n o u t p u t s i g n a l , t o c o r r e s p o n d i n g t r a n s p o n d e r
( C h . 3 0 B 3 8 )
E x t r a T x
i n
E x t r a c h a n n e l s i n p u t ( f r o m o t h e r M u x / D e m u x b o a r d )
E x t r a R x
o u t
E x t r a c h a n n e l s o u t p u t ( t o o t h e r M u x / D e m u x b o a r d )
S P V T x i n S u p e r v i s i o n t r a n s m i s s i o n i n p u t s i g n a l ( f r o m S P V M b o a r d )
S P V R x o u t S u p e r v i s i o n r e c e p t i o n o u t p u t s i g n a l ( t o S P V M b o a r d )
1696MS SLOTS
1696MS_C
SLOTS
4,5,6
S B T x i n S h o r t B a n d t r a n s m i s s io n c h a n n e ls i n p u t ( f r o m o t h e r M u x / D e m u x )
S B R x o u t S h o r t B a n d r e c e p t i o n c h a n n e l s o u t p u t ( t o o t h e r M u x / D e m u x )
OMDX8100_M_L1_X
N . B . T h e O M D X 8 1 0 0 _ M _ L 1 _ X b o a r d i s n o t p r o v i d e d w i t h
t h e S u p e r v i s i o n ( S P V T x i n / o u t ) a c c e s s p o i n t s
( s h o w n i n f i g u r e )
A c c e s s
c h a n n e l s
2; 3;
12; 13; 22
Master Expansion

Figure 686968: OMDX8100_M_L1_XS front panel

L in e
E x t r a
H a r d W a r e
F a i l u r e L E D
E x t r a c t i o n
h a n d l e
E x t r a c t i o n
h a n d l e
l a b e l
3
A
L
8
6
6
1
5
X
X
C
h
#
2
8
2
7
2
6
2
3
2
2
2
1
2
0
2
5
W D M T x i n
W D M R x o u t
E x t r a T x i n
E x t ra R x o u t
L in e T x o u t
L i n e R x i n
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
T h i s f r o n t p a n e l i s s i m i l a r t o t h a t o f O M D X 8 1 0 0 _ M _ S 2 a n d S 1 b o a r d s , e x c e p t f o r t h e s e t o f c h a n n e l s ,
i . e . C h . 4 2 t o 5 0 f o r S 2 b a n d a n d C h . 5 2 t o 6 0 f o r S 1 b a n d . T h e s e t o f c h a n n e l s i s p r i n t e d o n t h e f r o n t
p a n e l a n d i n c l u d e d i n t h e a c r o n y m t o i d e n t i f y t h e b o a r d t y p e .
ACRONYM
1696MS SLOTS
OMDX8100_M_L2
G r e e n /
R e d l e d
- R e d w h e n o n e o f t h e O n B o a r d p o w e r s u p p l y ( O B P S ) i s in
L i n e T x o u tL i n e T r a n s m i s s i o n o u t p u t s i g n a l ( t o l i n e o r o t h e r M u x / D e m u x )
L i n e R x i n L i n e R e c e p t i o n i n p u t s i g n a l ( f r o m l i n e o r o t h e r M u x / D e m u x )
W D M T x i n
W D M t r a n s m i s s io n i n p u t s i g n a l , f r o m c o r r e s p o n d in g t r a n s p o n d e r
( C h . 2 0 B 2 8 f o r L 2 b a n d , 4 2 B 5 0 f o r S 2 b a n d , 5 2 B 6 0 f o r S 1 b a n d )
W D M R x
o u t
W D M r e c e p t i o n o u t p u t s i g n a l , t o c o r r e s p o n d i n g t r a n s p o n d e r ( C h .
2 0 B 2 8 f o r L 2 b a n d , 4 2 B 5 0 f o r S 2 b a n d , 5 2 B 6 0 f o r S 1 b a n d )
E x t r a T x
i n
E x t r a c h a n n e l s i n p u t ( f r o m o t h e r M u x / D e m u x b o a r d )
E x t r a R x
o u t
E x t r a c h a n n e l s o u t p u t ( t o o t h e r M u x / D e m u x b o a r d )
1696MS_C
SLOTS
OMDX8100_M_S2
OMDX8100_M_S1
4, 5, 6
A c c e s s
c h a n n e l s
2; 3; 4; 5; 6;
12; 13; 22
2; 3;
12; 13; 22
Master Expansion

Figure 697069: OMDX8100_M_L2/S2/S1 front panel

T h i s f r o n t p a n e l i s s i m i l a r t o t h a t o f O A D M 8 1 0 0 _ M _ L 2 / S 2 / S 1 _ S b o a r d s , e x c e p t f o r t h e s e t o f c h a n n e l , i . e . C h .
2 0 t o 2 8 f o r L 2 b a n d , C h . 4 2 t o 5 0 f o r S 2 b a n d a n d C h . 5 2 t o 6 0 f o r S 1 b a n d . F o u r d i f f e r e n t b o a r d s a r e s o a v a i l a b l e .
T h e s e t o f c h a n n e l s i s p r i n t e d o n t h e f r o n t p a n e l a n d i n c l u d e d i n t h e a c r o n y m t o i d e n t i f y t h e b o a r d t y p e .
ACRONYM
OADM8100_M_L1_S
3
7
3
6
3
5
3
3
3
2
3
1
3
0
S
C
h
#
3
8
W D M T x i n
W D M R x o u t
E x t r a T x i n
E x t ra R x o u t
M o n i t o r i n g
L in e
L in e T x o u t
L i n e R x i n
E x t r a
c h a n n e l s
S P V T x in
S P V R x o u t
H a r d W a r e
F a i l u r e L E D
E x t r a c t i o n
h a n d l e
E x t r a c t i o n
h a n d l e
l a b e l
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
M o n it o r T x o u t
3
A
L
8
6
6
3
7
A
X
U n u s e d
U n u s e d
OADM8100_M_L2_S
OADM8100_M_S1_S
OADM8100_M_S2_S
G r e e n /
R e d l e d
- R e d w h e n o n e o f t h e O n B o a r d p o w e r s u p p l y ( O B P S ) i s i n
M o n i t o r
T x o u t
O u t p u t p o w e r m e a s u r e m e n t s i g n a l ( t o o p t i c a l m e a s u r e m e n t d e
v i c e )
M o n it o r
R x o u t
I n p u t p o w e r m e a s u r e m e n t s i g n a l ( t o o p t i c a l m e a s u r e m e n t d e
v i c e )
L in e T x o u t L i n e T r a n s m i s s i o n o u t p u t s i g n a l ( t o l i n e )
W D M T x i n
W D M t r a n s m is s io n i n p u t s i g n a l , f r o m c o r r e s p o n d in g t r a n s
p o n d e r : c h . 3 0 B 3 8 ( L 1 b a n d ) , c h . 2 0 B 2 8 ( L 2 ) , c h . 4 2 B 5 0
( S 2 ) , c h . 5 2 B 6 0 ( S 1 )
W D M R x
o u t
W D M r e c e p t io n o u t p u t s ig n a l , t o c o r r e s p o n d i n g t r a n s p o n d e r :
c h . 3 0 B 3 8 ( L 1 b a n d ) , c h . 2 0 B 2 8 ( L 2 ) , c h . 4 2 B 5 0 ( S 2 ) , c h .
5 2 B 6 0 ( S 1 )
E x t r a T x
i n
E x t r a o r p a s s - t h r o u g h c h a n n e l s i n p u t ( f r o m o t h e r M u x / D e m u x
b o a r d )
E x t r a R x
o u t
E x t r a o r p a s s - t h r o u g h c h a n n e l s o u t p u t ( t o o t h e r M u x / D e m u x
b o a r d )
S P V R x o u tS u p e r v i s i o n r e c e p t i o n o u t p u t s i g n a l ( t o S P V M b o a r d )
C h a n n e ls
a c c e s s e s
1696MS SLOTS
1696MS_C
SLOTS
4, 5, 6
2; 3; 4; 5; 6;
12; 13; 22
2; 3;
12; 13; 22
Master Expansion

Figure 707170: OADM8100_M_L1_S (L2/S1/S2) front panel

T h i s f r o n t p a n e l i s t h e s a m e f o r a l l O A D M 4 1 0 0 _ M _ c h X X - Y Y _ S f o u r c h a n n e l s b o a r d s , e x c e p t f o r t h e s e t
o f c h a n n e l s : e i g h t s e t s o f 4 c h a n n e l s a r e a v a i l a b l e f o r t h i s b o a r d t y p e ; e i g h t d i f f e r e n t b o a r d s a r e s o a v a i l a b l e .
T h e s e t o f c h a n n e l s i s p r i n t e d o n t h e f r o n t p a n e l a n d i n c l u d e d i n t h e a c r o n y m t o i d e n t i f y t h e b o a r d t y p e .
ACRONYM
OADM4100_M_ch20-23_S
G r e e n /
R e d l e d
M o n i t o r
T x o u t
O u t p u t p o w e r m e a s u r e m e n t s i g n a l ( t o o p t i c a l m e a s u r e
m e n t d e v i c e )
M o n i t o r
R x o u t
I n p u t p o w e r m e a s u r e m e n t s i g n a l ( t o o p t i c a l m e a s u r e
W D M T x i n
W D M t r a n s m i s s i o n i n p u t s i g n a l , f r o m c o r r e s p o n d i n g t r a n s
p o n d e r : c h . 2 0 B 2 3 ; 2 5 B 2 8 ; 3 0 B 3 3 ; 3 5 B 3 8 ; 4 2 B 4 5 ;
4 7 B 5 0 ; 5 2 B 5 5 ; 5 7 B 6 0
W D M R x
o u t
W D M r e c e p t i o n o u t p u t s i g n a l , t o c o r r e s p o n d i n g t r a n s p o n d e r :
c h . 2 0 B 2 3 ; 2 5 B 2 8 ; 3 0 B 3 3 ; 3 5 B 3 8 ; 4 2 B 4 5 ; 4 7 B 5 0 ;
5 2 B 5 5 ; 5 7 B 6 0
E x t r a T x
i n
E x t r a o r p a s s - t h r o u g h c h a n n e l s i n p u t ( f r o m o t h e r M u x / D e
m u x b o a r d )
E x t r a R x
o u t
E x t r a o r p a s s - t h r o u g h c h a n n e l s o u t p u t ( t o o t h e r M u x / D e
m u x b o a r d )
S P V T x i n S u p e r v is i o n t r a n s m i s s io n i n p u t s i g n a l ( f r o m S P V M b o a r d )
C
h
#
3
3
3
2
3
1
3
0
M o n i t o r i n g
L in e
C h a n n e l s
a c c e s s e s
H a r d W a r e
F a i l u r e L E D
E x t r a c t i o n
h a n d l e
O p t i c a l s a f e t y l a b e l
3
A
L
8
6
6
3
7
B
A
E x t r a o r
p a s s -
t h r o u g h
c h a n n e l s
S
W D M T x i n
W D M R x o u t
L in e T x o u t
L i n e R x i n
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
W D M T x i n
W D M R x o u t
E x t r a T x i n
E x t ra R x o u t
S P V T x in
S P V R x o u t
U n u s e d
U n u s e d
1696MS SLOTS
1696MS_C
SLOTS
4, 5, 6
2; 3; 4; 5; 6;
12; 13; 22
2; 3;
12; 13; 22
Master Expansion

Figure 717271: OADM4100_M_chxx-yy_S front panel


T h is f r o n t p a n e l i s t h e s a m e f o r a l l O A D M 2 1 0 0 _ M _ c h x x _ y y _ S t w o c h a n n e l s b o a r d s , e x c e p t f o r t h e s e t
o f c h a n n e l s : f i v e s e t s o f 2 c h a n n e l s a r e a v a i l a b l e f o r t h i s b o a r d t y p e ; f i v e d i f f e r e n t b o a r d s a r e s o a v a i l a b l e .
T h e s e t o f c h a n n e l s i s p r i n t o n t h e f r o n t p a n e l a n d i n c l u d e d i n t h e a c r o n y m t o i d e n t i f y t h e b o a r d t y p e .
ACRONYM
OADM2100_M_30_31_S
G r e e n /
R e d l e d
M o n i t o r
T x o u t
M o n i t o r
R x o u t
W D M T x i n
W D M t r a n s m i s s io n i n p u t s ig n a l , f r o m c o r r e s p o n d i n g t r a n s
p o n d e r : c h . 3 0 - 3 1 ; 3 2 - 3 3 ; 3 5 - 3 6 ; 3 7 - 3 8 ; 4 7 - 4 8
W D M R x
o u t
W D M r e c e p t i o n o u t p u t s i g n a l , t o c o r r e s p o n d i n g t r a n s
p o n d e r : c h . 3 0 - 3 1 ; 3 2 - 3 3 ; 3 5 - 3 6 ; 3 7 - 3 8 ; 4 7 - 4 8
E x t r a T x i n
m u x b o a r d )
E x t r a R x
o u t
m u x b o a r d )
OADM2100_M_32_33_S
OADM2100_M_35_36_S
OADM2100_M_37_38_S
OADM2100_M_47_48_S
3
1
S
C
h
#
3
0
W D M T x i n
W D M R x o u t
E x t r a T x i n
E x t ra R x o u t
M o n i t o r i n g
L in e
L in e T x o u t
L i n e R x i n
C h a n n e l
a c c e s s e s
E x t r a
c h a n n e l s
S P V T x in
S P V R x o u t
H a r d W a r e
F a i l u r e L E D
E x t r a c t i o n
h a n d l e
E x t r a c t i o n
h a n d l e
l a b e l
W D M T x i n
W D M R x o u t
U n u s e d
U n u s e d
3
A
L
8
6
7
7
8
X
X
C h # 1
C h # 2
1696MS SLOTS
1696MS_C
SLOTS
4, 5, 6
2; 3; 4; 5; 6;
12; 13; 22
2; 3;
12; 13; 22
Master Expansion

Figure 727372: OADM2100_M_xx_yy_S front panel


T h is f r o n t p a n e l i s t h e s a m e f o r a l l O A D M 1 1 0 0 _ M _ x x _ S o n e c h a n n e l b o a r d s , e x c e p t f o r t h e c h a n n e l :
1 2 d i f f e r e n t c h a n n e l s a r e a v a i l a b l e f o r t h i s b o a r d t y p e a n d t h e n t w e l v e d i f f e r e n t b o a r d s a r e a v a i l a b l e . T h e
n u m b e r o f t h e c h a n n e l i s p r i n t e d o n t h e f r o n t p a n e l a n d i n c l u d e d i n t h e a c r o n y m t o i d e n t i f y t h e b o a r d t y p e .
ACRONYM
OADM1100_M_25_S
G r e e n /
R e d l e d
M o n i t o r
T x o u t
M o n i t o r
R x o u t
W D M T x i n
W D M t r a n s m i s s io n i n p u t s ig n a l , f r o m c o r r e s p o n d i n g t r a n s
p o n d e r : c h . 2 5 ; 3 0 ; 3 1 ; 3 2 ; 3 3 ; 3 5 ; 3 6 ; 3 7 ; 3 8 ; 4 7 ; 4 8 ; 5 0
W D M R x
o u t
W D M r e c e p t i o n o u t p u t s i g n a l , t o c o r r e s p o n d i n g t r a n s p o n d
e r : c h . c h . 2 5 ; 3 0 ; 3 1 ; 3 2 ; 3 3 ; 3 5 ; 3 6 ; 3 7 ; 3 8 ; 4 7 ; 4 8 ; 5 0
E x t r a T x i n
m u x b o a r d )
E x t r a R x
o u t
m u x b o a r d )
OADM1100_M_30_S
OADM1100_M_31_S
OADM1100_M_32_S
OADM1100_M_33_S
S
C
h
#

x
x
W D M T x i n
W D M R x o u t
E x t r a T x i n
E x t ra R x o u t
M o n i t o r i n g
L in e
L in e T x o u t
L i n e R x i n
C h a n n e l
a c c e s s
E x t r a
c h a n n e l s
S P V T x in
S P V R x o u t
H a r d W a r e
F a i l u r e L E D
E x t r a c t i o n
h a n d l e
E x t r a c t i o n
h a n d l e
l a b e l
3
A
L
8
6
7
7
7
X
X
Add
Drop
OADM1100_M_35_S
OADM1100_M_36_S
OADM1100_M_37_S
OADM1100_M_38_S
OADM1100_M_47_S
OADM1100_M_48_S
OADM1100_M_50_S
1696MS SLOTS
1696MS_C
SLOTS
4, 5, 6
2; 3; 4; 5; 6;
12; 13; 22
2; 3;
12; 13; 22
Master Expansion

Figure 737473: OADM1100_M_xx_S front panel

ACRONYM
1696MS
2; 3; 12
SPV_F_1310_1550
SLOTS
1696MS_C
SLOTS
5; 6
G r e e n /
R e d l e d
M o n i t o r
T x o u t
O u t p u t p o w e r m e a s u r e m e n t s ig n a l ( t o o p t ic a l m e a s u r e m e n t
d e v i c e )
M u x I n
D m u x o u t
M o n i t o r i n g
L in e
L in e T x o u t
L i n e R x i n
1310
M u x I n
D m u x o u t
1 5 5 0
S P V T x in
S P V R x o u t
H a r d W a r e
F a i l u r e L E D
E x t r a c t i o n
h a n d l e
E x t r a c t i o n
h a n d l e
l a b e l
3
A
L
8
6
7
7
9
A
A
1
3
1
0
S
Common
13; 22
M o n i t o r
R x o u t
I n p u t p o w e r m e a s u r e m e n t s ig n a l ( t o o p t ic a l m e a s u r e m e n t
d e v i c e )
L in e T x o u t L i n e T r a n s m i s s i o n o u t p u t s i g n a l ( t o t h e l i n e )
L i n e R x i n L i n e R e c e p t i o n i n p u t s i g n a l ( f r o m t h e l i n e )
M u x i n I n p u t 1 3 1 0 n m s i g n a l
D m u x o u t O u t p u t r e c e p t i o n 1 3 1 0 n m s i g n a l
M u x i n I n p u t 1 5 5 0 n m s i g n a l
D m u x o u t O u t p u t r e c e p t i o n 1 5 5 0 n m s i g n a l

Figure 747574: SPV_F_1310_1550 front panel

ACRONYM
1696MS
SPV_F_C
SLOTS
G r e e n /
R e d l e d
S P V T x i n S u p e r v i s i o n t r a n s m i s s io n i n p u t s i g n a l ( f r o m S P V M b o a r d )
S P V R x o u tS u p e r v i s i o n r e c e p t i o n o u t p u t s i g n a l ( t o S P V M b o a r d )
3 A L 8 6 7 7 9 B A X X
R x o u t p u t
T x i n p u t
S P V T x in
S P V R x o u t
E x t r a T x i n
E x t ra R x o u t
E x t r a
c h a n n e l s
S
C l i e n t a c c e s s
E x t r a I n I n p u t e x t r a s i g n a l ( 1 3 1 0 o r 1 5 5 0 n m )
E x t r a O u t O u t p u t e x t r a s i g n a l ( 1 3 1 0 o r 1 5 5 0 n m )
L i n e T x o u t L i n e T r a n s m i s s i o n o u t p u t s i g n a l ( t o t h e l i n e )
L i n e R x i n L i n e R e c e p t i o n i n p u t s i g n a l ( f r o m t h e l i n e )
2 8 B 3 5
3 8 B 4 5
H a r d W a r e
F a i l u r e L E D
1696MS_C SLOTS
Master Expansion
9; 10; 11
8; 9;
10; 11

Figure 757675: SPV_F_C front panel

C H 1 I N P U T
C H 1 O U T P U T
L in e
L I N E R X I N
L I N E T X O U T
S P V IN ( A D D )
S P V O U T
( D R O P )
E x t r a c t i o n
h a n d l e
C H 2 I N P U T
C H 2 O U T P U T
C H 3 I N P U T
C H 3 O U T P U T
C H 4 I N P U T
C H 4 O U T P U T
C H 5 I N P U T
C H 5 O U T P U T
C H 6 I N P U T
C H 6 O U T P U T
C H 7 I N P U T
C H 7 O U T P U T
C H 8 I N P U T
C H 8 O U T P U T
T h e L E D i s G R E E N w h e n t h e b o a r d i s p lu g g e d , c o n f i g u r e d a n d
T h e L E D i s R E D i n c a s e o f S W r e s e t o r H W f a i l u r e
ACRONYM
2; 3; 4; 5; 6;
CMDX-U
8; 10; 12; 13; 14
L i n e T r a n s m is s io n o u t p u t s ig n a l ( M U X O U T P U T , t o l in e )
L i n e R e c e p t i o n i n p u t s i g n a l ( D E M U X I N P U T , f r o m l i n e )
A b o v e c o n n e c t o r : C H 1 in p u t . 1 4 7 0 n m W D M in p u t s ig n a l, f r o m
c o r r e s p o n d i n g t r a n s p o n d e r
B e l o w c o n n e c t o r : C H 1 o u t p u t . 1 4 7 0 n m W D M o u t p u t s ig n a l , t o
1 3 1 0 n m s u p e r v i s i o n i n p u t s i g n a l , f r o m S P V / O S C b o a r d ( O S C
A D D ) - C M D X ( 2 ) - U - S o n l y
1 3 1 0 n m s u p e r v i s i o n o u t p u t s i g n a l , t o S P V / O S C b o a r d ( O S C
D R O P ) - C M D X ( 2 ) - U - S o n l y
4,5,6
W D M
a c c e s s
c h a n n e l s
2; 3;
12; 13; 22
Master Expansion
H a r d w a r e f a i l u r e L e d
S u p e r v i
s i o n
A b o v e c o n n e c t o r : C H 2 i n p u t t o C H 8 i n p u t . 1 4 9 0 n m t o 1 6 1 0
n m W D M i n p u t s i g n a l , f r o m c o r r e s p o n d i n g t r a n s p o n d e r
B e l o w c o n n e c t o r : C H 1 o u t p u t t o C H 8 o u t p u t . 1 4 9 0 n m t o
1 6 1 0 n m W D M o u t p u t s i g n a l , t o c o r r e s p o n d i n g t r a n s p o n d e r
T O
CMDX2-U
16; 18; 20; 22
Master Expansion
2; 4; 5; 6
T h e 1 3 1 0 n m s u p e r v i s i o n c o n n e c t o r s ( S P V I N / O U T ) a r e
a v a i l a b l e o n l y o n C M D X - U - S a n d C M D X 2 - U - S b o a r d s
CMDX-U-S
CMDX2-U-S

Figure 767776: CMDX(2) boards (all types) front panel


1 4 7 0 C H I N
1 4 7 0 C H O U T
L in e
L I N E R X I N
L I N E T X O U T
S P V IN ( A D D )
S P V O U T
( D R O P )
E x t r a c t i o n
h a n d l e
1 4 9 0 C H I N
1 4 7 0 C H O U T
1 5 1 0 C H I N
1 5 1 0 C H O U T
1 5 7 0 C H I N
1 5 7 0 C H O U T
1 5 9 0 C H I N
1 5 9 0 C H O U T
1 6 1 0 C H I N
1 6 1 0 C H O U T
B A N D I N
W D M
a c c e s s
c h a n n e l s
H a r d w a r e f a i l u r e L e d
S u p e r
v i s i o n
ACRONYM
2; 3; 4; 5; 6
CDMDX2-U
8; 10; 12; 13; 14
4,5,6
2; 3; 12; 13
14; 16; 18
Master Expansion
CDMDX2-U-S
16; 18; 20; 22
Master Expansion
2; 4; 5; 6
20; 22
T h e L E D i s G R E E N w h e n t h e b o a r d i s p l u g g e d , c o n f i g u r e d
a n d w i t h o u t f a i l u r e
L i n e T r a n s m is s io n o u t p u t s ig n a l ( M U X O U T P U T , t o l in e )
L in e R e c e p t io n in p u t s ig n a l ( D E M U X I N P U T , f r o m lin e )
A b o v e c o n n e c t o r : 1 4 7 0 n m W D M i n p u t s i g n a l , f r o m
B e l o w c o n n e c t o r : 1 4 7 0 n m W D M o u t p u t s i g n a l , t o
1 3 1 0 n m s u p e r v i s i o n i n p u t s i g n a l , f r o m S P V / O S C b o a r d
( O S C A D D ) - C D M D X 2 - U - S o n l y
1 3 1 0 n m s u p e r v is io n o u t p u t s ig n a l, t o S P V / O S C b o a r d ( O S C
D R O P ) - C D M D X 2 - U - S o n l y
A b o v e c o n n e c t o r : 1 4 9 0 n m , 1 5 1 0 n m , 1 5 7 0 n m , 1 5 9 0 n m a n d
1 6 1 0 n m W D M i n p u t s i g n a l s , f r o m c o r r e s p o n d i n g t r a n s p o n d e r
B e l o w c o n n e c t o r : 1 4 9 0 n m , 1 5 1 0 n m , 1 5 7 0 n m , 1 5 9 0 n m a n d
1 6 1 0 n m W D M o u t p u t s i g n a l s , t o c o r r e s p o n d i n g t r a n s p o n d e r
T O
T h e 1 3 1 0 n m s u p e r v i s i o n c o n n e c t o r s ( S P V I N / O U T )
a r e a v a i l a b l e o n l y o n C D M D X 2 - U - S b o a r d
E X T R A
B A N D O U T
E X T R A
1 5 2 3 n m - > 1 5 6 0 n m I N P U T e x t r a p o r t , a l l o w i n g t o i n s e r t u p
t o 2 4 D W D M m u l t ip l e x e d c h a n n e l s t o t h e l i n e s i g n a l ( C W D M
M U X I n p u t )
1 5 2 3 n m - > 1 5 6 0 n m O U T P U T e x t r a p o r t a b l e t o e x t r a c t u p
t o 2 4 D W D M m u l t i p l e x e d c h a n n e l s f r o m t h e l i n e s i g n a l
( C W D M D E M U X O u t p u t )

Figure 777877: CDMDX2-U and CDMDX2-U-S front panel

E x t r a c t i o n
h a n d l e
H a r d w a r e
f a i l u r e L e d
ACRONYM
2; 3; 4; 5; 6
COAD2-xx_S 8; 10; 12; 13; 14
4,5,6
2; 3; 12; 13
14; 16; 18
Master Expansion
16; 18; 20; 22
Master Expansion
2; 4; 5; 6
20; 22
G r e e n /
R e d l e d
A b o v e c o n n e c t o r : C H 1 A D D . 1 4 7 1 n m W D M i n p u t s i g n a l ,
f r o m c o r r e s p o n d i n g t r a n s p o n d e r ( E a s t M u x i n p u t )
B e l o w c o n n e c t o r : C H 1 D R O P . 1 4 7 1 n m W D M o u t p u t s i g n a l ,
t o c o r r e s p o n d i n g t r a n s p o n d e r ( E a s t D e m u x o u t p u t )
E A S T S u p e r v i s i o n t r a n s m i s s i o n i n p u t s i g n a l ( f r o m O S C
b o a r d ) - 1 3 1 0 n m S P V / O S C A D D
E A S T C H 1 A D D
E A S T C H 1 D R O P
E A S T E x tr a C H i n ( A D D )
E A S T E x t r a C H o u t ( D R O P )
E A S T L i n e T x o u t
E A T L in e R x in
A c c e s s
C h a n n e l
E A S T S P V T x i n
E A S T S P V R x o u t
S u p e r
v i s i o n
W E S T S P V T x i n
W E S T S P V R x o u t
W E S T C H 1 A D D
W E S T E x t r a C H i n ( A D D )
W E S T E x t r a C H o u t ( D R O P )
W E S T L i n e T x o u t
W E S T L i n e R x i n
A c c e s s
C h a n n e l
W E S T C H 1 D R O P
E A S T S u p e r v i s i o n r e c e p t i o n o u t p u t s i g n a l ( t o O S C b o a r d )
- 1 3 1 0 n m S P V / O S C D R O P
W E S T S u p e r v i s i o n t r a n s m i s s i o n i n p u t s i g n a l ( f r o m O S C
W E S T S u p e r v i s i o n r e c e p t i o n o u t p u t s i g n a l ( t o O S C b o a r d )
- 1 3 1 0 n m S P V / O S C D R O P
E A S T L i n e r e c e p t i o n i n p u t s i g n a l - D e m u x i n p u t f r o m L i n e
E A S T L i n e t r a n s m i s s i o n o u t p u t s i g n a l - M u x o u t p u t t o L i n e
E A S T E x t r a o r p a s s - t h r o u g h c h a n n e l s i n p u t ( i . e . f r o m
W e s t D e m u x e x t r a b a n d o u t p u t ) - E a s t M u x i n p u t
E A S T E x t r a o r p a s s - t h r o u g h c h a n n e l s o u t p u t ( i . e . t o W e s t
M u x e x t r a b a n d i n p u t ) - E a s t D e m u x o u t p u t
A b o v e c o n n e c t o r : C H 1 A D D . 1 4 7 1 n m W D M i n p u t s i g n a l ,
f r o m c o r r e s p o n d i n g t r a n s p o n d e r ( W e s t M u x i n p u t )
B e l o w c o n n e c t o r : C H 1 D R O P . 1 4 7 1 n m W D M o u t p u t s i g n a l ,
t o c o r r e s p o n d i n g t r a n s p o n d e r ( W e s t D e m u x o u t p u t )
W E S T L i n e r e c e p t i o n i n p u t s i g n a l - D e m u x i n p u t f r o m L i n e
W E S T L i n e t r a n s m i s s i o n o u t p u t s i g n a l - M u x o u t p u t t o L i n e
W E S T E x t r a o r p a s s - t h r o u g h c h a n n e l s i n p u t ( i . e . f r o m
E a s t D e m u x e x t r a b a n d o u t p u t ) - W e s t M u x i n p u t
W E S T E x t r a o r p a s s - t h r o u g h c h a n n e l s o u t p u t ( i . e . t o E a s t
M u x e x t r a b a n d i n p u t ) - W e s t D e m u x o u t p u t
E i g t h t y p e s / c o d e s o f 1 - c h a n n e l O A D M b o a r d a r e p r o v i d e d , e a c h o n e
a b l e t o a d d a n d d r o p o n e o f t h e e i g t h w a v e l e n g t h s o f t h e C W D M g r i d .
- O F F w h e n t h e b o a r d i s p l u g g e d b u t n o t d e c l a r e d
- G r e e n w h e n t h e b o a r d i s p l u g g e d , c o n f i g a n d w / o f a i l u r e
o r f a i l u r e i n c o m m u n i c a t i o n o n t h e b o a r d
- R e d i n c a s e o f H W f a i l u r e , p o w e r s u p p l y f a i l u r e
x x s t a n d s f o r 1 4 7 0 o r 1 4 9 0 o r 1 5 1 0 o r 1 5 3 0 o r 1 5 5 0 o r 1 5 7 0 o r 1 5 9 0 o r 1 6 1 0 ,
a c c o r d i n g t o t h e b o a r d c o d e . I t i n d i c a t e s t h e a d d e d / d r o p p e d w a v e l e n g t h .

Figure 787978: COAD2-xx_S (1-channel OADM) front panel

E x t r a c t i o n
h a n d l e
H a r d w a r e
f a i l u r e L e d
ACRONYM
2; 3; 4; 5; 6
8; 10; 12; 13; 14
4,5,6
2; 3; 12; 13
14; 16; 18
Master Expansion
16; 18; 20; 22
Master Expans.
2; 4; 5; 6
20; 22
G r e e n /
R e d l e d
A b o v e c o n n e c t o r : C H 1 , C H 2 A D D . 1 4 7 0 n m , 1 4 9 0 n m W D M
i n p u t s i g n a l s , f r o m c o r r e s p o n d i n g T P D ( E a s t M u x i n p u t )
B e l o w c o n n e c t o r : C H 1 , C H 2 d r o p . 1 4 7 0 n m , 1 4 9 0 n m W D M
o u t p u t s i g n a l s , t o c o r r e s p o n d i n g T P D ( E a s t D e m u x o u t p u t )
E A S T S u p e r v i s i o n t r a n s m i s s i o n i n p u t s i g n a l ( f r o m O S C
E A S T C H 1 A D D
E A S T E x tr a C H i n ( A D D )
E A S T L i n e R x i n
A c c e s s
C h a n n e l s
S u p e r
v i s i o n
W E S T C H 1 A D D
A c c e s s
C h a n n e l s
E A S T S u p e r v i s i o n r e c e p t i o n o u t p u t s i g n a l ( t o O S C b o a r d )
- 1 3 1 0 n m S P V / O S C D R O P
W E S T S u p e r v i s i o n t r a n s m i s s i o n i n p u t s i g n a l ( f r o m O S C
W E S T S u p e r v i s i o n r e c e p t i o n o u t p u t s i g n a l ( t o O S C b o a r d )
- 1 3 1 0 n m S P V / O S C D R O P
E A S T L i n e r e c e p t i o n i n p u t s i g n a l - D e m u x i n p u t f r o m L i n e
E A S T L i n e t r a n s m i s s i o n o u t p u t s i g n a l - M u x o u t p u t t o L i n e
E A S T E x t r a o r p a s s - t h r o u g h c h a n n e l s i n p u t ( i . e . f r o m
W e s t D e m u x e x t r a b a n d o u t p u t ) - E a s t M u x i n p u t
E A S T E x t r a o r p a s s - t h r o u g h c h a n n e l s o u t p u t ( i . e . t o W e s t
M u x e x t r a b a n d i n p u t ) - E a s t D e m u x o u t p u t
A b o v e c o n n e c t o r : C H 1 , C H 2 A D D . 1 4 7 0 n m , 1 4 9 0 n m W D M
i n p u t s i g n a l s , f r o m c o r r e s p o n d i n g T P D ( W e s t M u x i n p u t )
B e l o w c o n n e c t o r : C H 1 , C H 2 d r o p . 1 4 7 0 n m , 1 4 9 0 n m W D M
o u t p u t s i g n a l s , t o c o r r e s p o n d i n g T P D ( W e s t D e m u x o u t p u t )
W E S T L i n e r e c e p t i o n i n p u t s i g n a l - D e m u x i n p u t f r o m L i n e
W E S T L i n e t r a n s m i s s i o n o u t p u t s i g n a l - M u x o u t p u t t o L i n e
W E S T E x t r a o r p a s s - t h r o u g h c h a n n e l s i n p u t ( i . e . f r o m
E a s t D e m u x e x t r a b a n d o u t p u t ) - W e s t M u x i n p u t
W E S T E x t r a o r p a s s - t h r o u g h c h a n n e l s o u t p u t ( i . e . t o E a s t
M u x e x t r a b a n d i n p u t ) - W e s t D e m u x o u t p u t
F o u r t y p e s / c o d e s o f 2 - c h a n n e l O A D M b o a r d a r e p r o v i d e d , e a c h o n e a b l e t o a d d a n d d r o p a p a i r
( 1 4 7 0 - 1 4 9 0 n m , 1 5 1 0 - 1 5 5 3 0 n m , 1 5 5 0 - 1 5 7 0 n m , 1 5 9 0 - 1 6 1 0 n m ) o f w a v e l e n g t h s o f t h e C W D M g r i d .
o r f a i l u r e i n c o m m u n i c a t i o n o n t h e b o a r d
- R e d i n c a s e o f H W f a i l u r e , p o w e r s u p p l y f a i l u r e
E A S T C H 2 A D D
W E S T C H 2 A D D
COAD2-xx-yy_S
x x - y y s t a n d s f o r 1 4 7 0 - 1 4 9 0 o r 1 5 1 0 - 1 5 3 0 o r 1 5 5 0 - 1 5 7 0 o r 1 5 9 0 - 1 6 1 0 , a c c o r d i n g
t o t h e b o a r d c o d e . I t i n d i c a t e s t h e a d d e d / d r o p p e d w a v e l e n g t h s .

Figure 798079: COAD2-xx-yy_S (2-channel OADM) front panel

E x t r a c t i o n
h a n d l e
H a r d w a r e
f a i l u r e L e d
ACRONYM
2&3;4&5;6&7
COAD2-1470-1530_S
8&9;12&13
14&15;16&17
18&19;20&21
22&23;10
1696MS SLOTS 1696MS_C
Master Exp. Master Exp.
2&3
COAD2-1550-1610_S
2&3
22&23
12&13 4&5
4&5
E A S T C H 1 A D D
E A S T E x t r a C H i n ( A D D )
E A S T L i n e R x i n
E A S T C H 2 A D D
E A S T C H 3 A D D
E A S T C H 4 A D D
W E S T C H 1 A D D
W E S T C H 2 A D D
W E S T C H 3 A D D
W E S T C H 4 A D D
A
c
c
e
s
s

C
h
a
n
n
e
l
s
A
c
c
e
s
s

C
h
a
n
n
e
l
s
S
u
p
e
r
v
i
s
i
o
n

Figure 808180: COAD2-xx-yy_S (4-channel OADM) front panel

T w o t y p e s / c o d e s o f 4 - c h a n n e l O A D M b o a r d a r e p r o v i d e d , e a c h o n e a b l e t o a d d a n d d r o p f o u r w a v e
l e n g t h s ( 1 4 7 0 , 1 4 9 0 , 1 5 1 0 a n d 1 5 5 3 0 n m t h e b o a r d s h o w n i n t h e f i g u r e , 1 5 5 0 , 1 5 7 0 , 1 5 9 0 a n d 1 6 1 0 n m
t h e o t h e r o n e ) o f t h e C W D M g r i d .
G r e e n /
R e d l e d
A b o v e c o n n e c t o r : C H 1 , C H 2 , C H 3 , C H 4 A D D . 1 4 7 0 n m , 1 4 9 0 n m , 1 5 1 0 , 1 5 3 0 n m W D M i n
p u t s i g n a l s , f r o m c o r r e s p o n d i n g t r a n s p o n d e r ( E a s t M u x i n p u t s )
B e l o w c o n n e c t o r : C H 1 , C H 2 , C H 3 , C H 4 D R O P . 1 4 7 0 n m , 1 4 9 0 n m , 1 5 1 0 , 1 5 3 0 n m W D M
o u t p u t s i g n a l , t o c o r r e s p o n d i n g t r a n s p o n d e r ( E A S T D e m u x o u t p u t s )
E A S T S u p e r v i s i o n t r a n s m i s s i o n i n p u t s i g n a l ( f r o m O S C b o a r d ) - 1 3 1 0 n m S P V / O S C A D D
E A S T S u p e r v i s i o n r e c e p t i o n o u t p u t s i g n a l ( t o O S C b o a r d ) - 1 3 1 0 n m S P V / O S C D R O P
W E S T S u p e r v i s i o n t r a n s m i s s i o n i n p u t s i g n a l ( f r o m O S C b o a r d ) - 1 3 1 0 n m S P V / O S C A D D
W E S T S u p e r v i s i o n r e c e p t i o n o u t p u t s i g n a l ( t o O S C b o a r d ) - 1 3 1 0 n m S P V / O S C D R O P
E A S T L i n e r e c e p t i o n in p u t s ig n a l - E A S T D e m u x i n p u t f r o m L in e
E A S T L i n e t r a n s m i s s i o n o u t p u t s i g n a l - E A S T M u x o u t p u t t o L i n e
E A S T E x t r a o r p a s s - t h r o u g h c h a n n e l s i n p u t ( f r o m c o r r e s p o n d i n g W e s t D e m u x e x t r a b a n d
o u t p u t o r f r o m a c a s c a d e d D W D M M u x o u t p u t ) - E A S T M u x i n p u t
E A S T E x t r a o r p a s s - t h r o u g h c h a n n e l s o u t p u t ( t o c o r r e s p o n d i n g W e s t M u x e x t r a b a n d i n p u t
o r t o a D W D M D e m u x i n p u t ) - E A S T D e m u x o u t p u t
A b o v e c o n n e c t o r : C H 1 , C H 2 , C H 3 , C H 4 A D D . 1 4 7 0 n m , 1 4 9 0 n m , 1 5 1 0 , 1 5 3 0 n m W D M i n p u t
s i g n a l s , f r o m c o r r e s p o n d i n g t r a n s p o n d e r ( W E S T M u x i n p u t s )
B e l o w c o n n e c t o r : C H 1 , C H 2 , C H 3 , C H 4 D R O P . 1 4 7 0 n m , 1 4 9 0 n m , 1 5 1 0 , 1 5 3 0 n m W D M
o u t p u t s i g n a l , t o c o r r e s p o n d i n g t r a n s p o n d e r ( W E S T D e m u x o u t p u t s )
W E S T L i n e r e c e p t i o n i n p u t s i g n a l - W E S T D e m u x in p u t f r o m L in e
W E S T L in e t r a n s m is s i o n o u t p u t s i g n a l - W E S T M u x o u t p u t t o L i n e
W E S T E x t r a o r p a s s - t h r o u g h c h a n n e l s i n p u t ( f r o m c o r r e s p o n d i n g E a s t D e m u x e x t r a b a n d
o u t p u t o r f r o m a c a s c a d e d D W D M M u x o u t p u t ) - W E S T M u x i n p u t
W E S T E x t r a o r p a s s - t h r o u g h c h a n n e l s o u t p u t ( t o c o r r e s p o n d in g E a s t M u x e x t r a b a n d
i n p u t o r t o a D W D M D e m u x i n p u t ) - W E S T D e m u x o u t p u t
- R e d i n c a s e o f H W f a i l u r e , p o w e r s u p p l y f a i l u r e o r f a i l u r e i n c o m m u n i c a t i o n o n t h e b o a r d

Figure 818281: COAD2-xx-yy_S (4-channel OADM) access points description

ACRONYM
1696MS
F1310
SLOTS
G r e e n /
R e d l e d
- G r e e n w h e n t h e b o a r d i s p l u g g e d a n d w i t h o u t H W f a i l u r e
- R e d w h e n S W r e s e t o r H W f a i l u r e
S P V T x i n S u p e r v i s i o n t r a n s m i s s i o n i n p u t s i g n a l ( f r o m S P V / O S C b o a r d ) - 1 3 1 0 n m S P V / O S C A d d
S P V R x o u t S u p e r v i s i o n r e c e p t i o n o u t p u t s i g n a l ( t o S P V / O S C b o a r d ) - 1 3 1 0 n m S P V / O S C D r o p
L I N E R x I N P U T ( D E M U X I N )
L I N E T x O U T P U T ( M U X O U T )
S P V T x in
S P V R x o u t
E x t r a I N P U T
E x t r a O U T P U T
E x t r a
c h a n n e l
C o m m o n
( L i n e )
E x t r a I n p u t C - B a n d I n p u t s i g n a l ( M u l t i p l e x e d , D / C W D M ) - M U X i n p u t
E x t r a O u t p u t C - B a n d O u t p u t s i g n a l ( M u l t i p l e x e d , D / C W D M ) - D E M U X o u t p u t
L i n e T x o u t L i n e T r a n s m i s s i o n o u t p u t s i g n a l ( M u x o u t p u t t o L i n e )
L i n e R x i n L i n e R e c e p t i o n i n p u t s i g n a l ( D e m u x i n p u t f r o m L i n e )
2 8 B 3 5
3 8 B 4 5
H a r d W a r e
F a i l u r e L E D
1696MS_C SLOTS
Master Expansion
9; 10; 11
8; 9;
10; 11

Figure 828382: F1310 front panel

Optical amplifiers front view
3
A
L
8
6
7
0
3
A
X
ACRONYM
1696MS
4; 5;
SLOTS 1696MS_C
SLOTS
2,3 12; 13;
20; 21
4; 5;
12; 13;
20; 21;
22; 23
P W
G r e e n l e d
P o w e r le d m a n a g e d b y H W . I t is O N w h e n
t h e b o a r d i s p l u g g e d a n d w i t h o u t H W F
O O S
Y e l l o w l e d
M a n a g e d b y S W . I t i s O N w h e n t h e b o a r d i s
p l u g g e d b u t n o t c o n f i g u r e d b y t h e S W
A B N
Y e l l o w l e d
A b n o r m a l i n p u t s i g n a l a l a r m . C a u s e d b y
1 ) 1 s t s t a g e i n p u t o p t i c a l s i g n a l l e v e l h a s d e
c r e a s e d b e l o w t h e i n p u t s i g n a l l o s s t h r e s h o l d
2 ) O u t p u t s a f e t y s h u t d o w n o t t h e 2 n d s t a g e .
M a n a g e d b y S W
A P S D
Y e l l o w l e d *
M a n a g e d b y S W . T h e L E D i s
- O F F w h e n A P S D e n a b l e
- O N w h e n A P S D d i s a b l e f o r c e d O N o r O F F
H W F
G r e e n /
Y e l l o w /
R e d l e d
H a r d w a r e f a ilu r e le d , m a n a g e d b y S W . I t is
- G r e e n w h e n t h e b o a r d i s p l u g g e d , c o n f i g u
r e d a n d w i t h o u t f a i l u r e
- y e l l o w w h e n t h e b o a r d i s i n f i r m w a r e d o w n
l o a d s t a t e * *
- R e d w h e n
a ) o n e o f t h e O n B o a r d p o w e r s u p p l y i s i n
b ) C _ T Y P E a l a r m i s r a i s e d
I n p u t
O u t p u t
V O A
I n p u t
O u t p u t
E x t r a c t i o n
h a n d l e
S t a g e 1
m o n i t o r i n g M o n . T x ( O U T )
M o n . R x ( I N )
S t a g e 2
m o n i t o r i n g M o n . T x ( O U T )
M o n . R x ( I N )
I n p u t
O u t p u t
S t a g e 2
I n p u t
O u t p u t
S t a g e 1
A b n o r m a l i n p u t s i g n a l a l a r m L E D
A P S D s t a t u s L E D
H a r d w a r e f a i l u r e L E D
R e s e t p u s h - b u t t o n
P o w e r O N L E D
N . B . * T h e L E D i s a l w a y s O N b e c a u s e t h e A P S D e n a b l e m o d e i s n o t
s u p p o r t e d
* * W h e n t h e b o a r d i s o n f i r m w a r e d o w n l o a d s t a t e , t h e h a r d w a r e
f a i l u r e l e d o n t h e f r o n t b o a r d l i g h t s o n y e l l o w c o l o u r . N e v e r u n
p l u g o r m o d i f y t h e c o n f i g u r a t i o n o f a b o a r d w h i l e t h i s L E D
i s y e l l o w . S h o u l d t h i s o c c u r , t h e b o a r d w i l l n o t r e s t a r t a n d
m a y h a v e t o b e r e t u r n e d f o r f a c t o r y r e p a i r .
Master Expans
OAC2
L_OAC2

Figure 838483: OAC2 and OAC2_L front panel

Controllers front view
U R G
R e d l e d
U r g e n t A l a r m ( m a j o r o r c r i t i c a l )
N R G
R e d l e d
N o t U r g e n t A l a r m ( m i n o r )
A T D
Y e l l o w l e d
A t t e n d e d A l a r m : a c k n o w l e d g e d U R G o r N U R G
a l a r m ( a l a r m s t o r i n g )
A B N
Y e l l o w l e d
A b n o r m a l c o n d i t i o n
I N D
Y e l l o w l e d
I n d i c a t i v e A l a r m ( w a r n i n g )
ACRONYM
1696MS
1
ESC2
SLOTS
1696MS_C
SLOTS
1 (master
U R G
N R G
A T D
A B N
I n d i c a t i v e a l a r m L E D
E x t r a c t i o n
h a n d l e
E x t r a c t i o n
h a n d l e
3
A
L

8
6
6
6
1
A
A
X
X
A b n o r m a l C o n d i t i o n L E D
A t t e n d e d a la r m L E D
N o t U r g e n t a l a r m L E D
U r g e n t A l a r m L E D
IN D
STATUS
E C
S C
C ra f t
L A T
A C O
R S T
E q u i p m e n t C o n t r o l l e r L E D
S h e l f C o n t r o l l e r L E D
R E S E T p u s h b u t t o n
L a m p T e s t p u s h b u t t o n *
A l a r m C u t O f f p u s h b u t t o n
"DBG" Interf ace
"F" Interf ace f or CT connection
"DBG" Interf ace
E C
G r e e n /
R e d /
Y e l l o w l e d
G r e e n l e d m e a n s c o m m u n i c a t i o n O K b e t w e e n E C / S C
R e d l e d m e a n s n o c o m m u n i c a t i o n b e t w e e n E C / S C
b u t S C i s s t a r t e d
Y e l l o w l e d m e a n s s t a r t t i m e
S C
G r e e n / R e d
/ Y e l l o w l e d
G r e e n l e d m e a n s S C s t a r t e d
Y e l l o w l e d m e a n s s t a r t t i m e
R e d l e d m e a n s S C d e f a u l t
SUB-D 9 pins connector
RJ45 connector
RJ45 connector
N B : * L A T b u t t o n l i g h t s u p a l l l e d s o f t h e N E e x c e p t f o r t h e E S C o n e s .
W h e n p r e s s i n g R S T b u t t o n , E C & S C L E D s s t a t u s d o e s n ' t c h a n g e
W h e n S C i s r e s t a r t e d , t h e E C l e d i s r e d a n d t h e S C l e d i s g r e e n .
W h e n t h e c o m m u n i c a t i o n b e t w e e n E C & S C i s r e - e s t a b l i s h e d , b o t h E C & S C L E D s a r e g r e e n
shelf only) ESC3

Figure 848584: ESC front panel

P W R
G r e e n l e d
P o W e R i n g l e d : i t i s O N w h e n t h e b o a r d i s p o w e r e d a n d
w i t h o u t H a r d W a r e F a i l u r e ( H W F ) . M a n a g e d b y H W
L B
Y e ll o w l e d
L i n e B u s y l e d : i t i s O N w h e n t h e s p e e c h
c h a n n e l i s b u s y
C C
Y e ll o w l e d
C o n f e r e n c e C a l l l e d : i t i s O N w h e n a c o n f e r e n c e
c a l l i s o c c u r i n g o n t h e s p e e c h c h a n n e l
V L
Y e l l o w l e d
V a c a n t L i n e l e d : i t i s O N w h e n t h e S p e e c h c h a n n e l
i s v a c a n t
ACRONYM
1696MS
2; 16; 18;
SLOTS*
1696MS_C
SLOTS*
4; 5; 6
R x 1 i n p u t
T x 1 o u t p u t
R x 2 i n p u t
T x 2 o u t p u t
O S C 1
O S C 2
l a b e l
H a r d W a r e F a i l u r e L E D
V a c a n t L i n e L E D
C o n f e r e n c e C a l l L E D
L i n e B u s y L E D
J 1 : S p e e c h c h a n n e l
h a n d s e t c o n n e c t o r
B o a r d r e s e t
p u s h b u t t o n
L i n e p i c k u p
p u s h b u t t o n
S p e e c h c h a n n e l
n u m b e r
c o d i n g w h e e l s
P o w e r O N L E D
SPVM2
G r e e n /
Y e l l o w /
R e d l e d
- Y e l l o w w h e n t h e b o a r d i s i n f i r m w a r e d o w n l o a d s t a t e *
R X 1 i n p u t O S C 1 r e c e p t i o n i n p u t s i g n a l , f r o m O A C , O M D X o r O A D M
T X 1 i n p u t O S C 1 t r a n s m s s i o n o u t p u t s i g n a l , t o O A C , O M D X o r O A D M
J 1 S p e e c h c h a n n e l h a n d s e t c o n n e c t i o n
N . B . * W h e n a b o a r d i s o n f i r m w a r e d o w n l o a d s t a t e , t h e h a r d
w a r e f a i l u r e l e d o n t h e f r o n t b o a r d l i g h t s o n y e l l o w c o l o u r .
N e v e r u n p l u g o r m o d i f y t h e c o n f i g u r a t i o n o f a b o a r d
w h i l e t h i s L E D i s y e l l o w . S h o u l d t h i s o c c u r , t h e b o a r d
w i l l n o t r e s t a r t a n d m a y h a v e t o b e r e t u r n e d f o r f a c t o r y
r e p a i r .
3
A
L
8
6
6
0
6
A
B
20; 22; 23
* In master shelf only
SPVM3

Figure 858685: SPVM2 and SPVM3 front panel

P W R
G r e e n l e d
P o W e R i n g l e d : i t i s O N w h e n t h e b o a r d i s p o w e r e d a n d
w i t h o u t H a r d W a r e F a i l u r e ( H W F ) . M a n a g e d b y H W
L B
Y e l lo w l e d
L i n e B u s y l e d : i t i s O N w h e n t h e s p e e c h
c h a n n e l i s b u s y
C C
Y e l lo w l e d
C o n f e r e n c e C a l l l e d : i t i s O N w h e n a c o n f e r e n c e
c a l l i s o c c u r i n g o n t h e s p e e c h c h a n n e l
V L
Y e l l o w l e d
V a c a n t L i n e l e d : i t i s O N w h e n t h e S p e e c h c h a n n e l
i s v a c a n t
ACRONYM
1696MS
SPVM_H
SLOTS*
1696MS_C
SLOTS*
4; 5; 6
R x 1 i n p u t
T x 1 o u t p u t
O S C 1
E x tr a c ti o n h a n d l e
V a c a n t L i n e L E D
C o n f e r e n c e C a l l L E D
L i n e B u s y L E D
J 1 : S p e e c h c h a n n e l
a n d s e t c o n n e c t o r
B o a r d r e s e t
p u s h b u t t o n
L i n e p i c k u p
p u s h b u t t o n
S p e e c h c h a n n e l
n u m b e r
c o d i n g w h e e l
E x tr a c ti o n h a n d l e
P o w e r O N L E D
G r e e n /
Y e l l o w /
R e d l e d
- Y e l l o w w h e n t h e b o a r d i s i n f i r m w a r e d o w n l o a d s t a t e *
- R e d w h e n o n e o f t h e O n B o a r d p o w e r s u p p l y ( O B P S ) i s
i n f a i l u r e ( O R o n t h e p o w e r s u p p l y a l a r m s )
J S p e e c h c h a n n e l h a n d s e t c o n n e c t i o n
3
A
L
8
6
6
0
6
A
C
N . B . * W h e n t h e b o a r d i s o n f i r m w a r e d o w n l o a d s t a t e , t h e h a r d w a r e
f a i l u r e l e d o n t h e f r o n t b o a r d l i g h t s o n y e l l o w c o l o u r . N e v e r u n
p l u g o r m o d i f y t h e c o n f i g u r a t i o n o f a b o a r d w h i l e t h i s L E D
i s y e l l o w . S h o u l d t h i s o c c u r , t h e b o a r d w i l l n o t r e s t a r t a n d
m a y h a v e t o b e r e t u r n e d f o r f a c t o r y r e p a i r .
2; 16; 18;
20; 22; 23
SPVM3_H

Figure 868786: SPVM_H and SPVM3_H front panel


Figure 878887: OSC front panel

Name Meaning
ACRONYM
1696MS
29*; 33*;
SLOTS**
1696MS_C
SLOTS**
11
Rx1 input
Tx1 output
Rx2 input
Tx2 output
OSC 1*
OSC 2*
HardWare Failure LED
OSC
Green /
Red led
Hardware failure. The LED is
- Green when the board is plugged, config and without failure
- Red when the board is in hardware failure or at Start-up
OSC2 side output signal to OAC, mux/demux or OADM board
** In master shelf only
* OSC can be declared in this slot only if the shelf is a "new shelf"
35; 39*;
43
OSC2 side input signal from OAC, mux/demux or OADM board
OSC1 side output signal to OAC, mux/demux or OADM board
OSC1 side input signal from OAC, mux/demux or OADM board
N.B. * OSC connectors are equipped with SFP optical modules,
shown in Figure 67.
ACRONYM
1696MS
SLOTS**
1696MS_C
SLOTS**
2*
EBRIDGE
G r e e n /
R e d l e d
T h e L E D i s
- G r e e n w h e n t h e b o a r d i s p l u g g e d a n d w i t h o u t H W f a i l u r e
- R e d w h e n S W r e s e t o r h a r d w a r e f a i l u r e
10; 18*

Figure 888988: EBRIDGE front panel

3
A
L
8
6
8
9
3
A
A
ACRONYM
1696MS
2; 12;
OSMC
SLOTS
1696MS_C
SLOTS
13; 23
Not used
P o w e r O N L E D
G r e e n /
R e d l e d
T h e l e d i s G R E E N w h e n t h e b o a r d i s p l u g g e d , c o n f i g u r e d
a n d w i t h o u t H a r d w a r e f a i l u r e ( H W F ) .
I t i s R E D w h e n t h e b o a r d i s p l u g g e d a n d i n H W F .
Y e l l o w l e d T h i s l e d i s O N w h e n a f i r m w a r e d o w n l o a d i s b e i n g p e r
f o r m e d
I n p u t p o w e r m o n i t o r i n g p o i n t s g i v i n g t h e p o s s i b i l i t y t o c h e c k
t h e p o w e r i n 8 d i f f e r e n t l o c a t i o n s p e r e a c h c h a n n e l
. . . .
I n p u t s p o w e r
m o n i t o r i n g
I n p u t s p o w e r
m o n i t o r i n g
N . B . W h e n t h e b o a r d i s o n f i r m w a r e d o w n l o a d s t a t e , t h e O O S L e d
o n t h e f r o n t b o a r d l i g h t s o n y e l l o w c o l o u r . N e v e r u n p l u g o r
m o d i f y t h e c o n f i g u r a t i o n o f a b o a r d w h i l e t h i s L E D i s y e l
l o w . S h o u l d t h i s o c c u r , t h e b o a r d w i l l n o t r e s t a r t a n d m a y
h a v e t o b e r e t u r n e d f o r f a c t o r y r e p a i r

Figure 899089: OSMC front panel

3
A
L
8
6
8
9
3
A
A
ACRONYM
1696MS
6 (master
I-Link_M
SLOTS
1696MS_C
SLOTS
shelf only)
Not used
P o w e r F a i l u r e L E D
E X P . s h e l v e s 1 , 2 ,
3 , C O N N E C T I O N
S T A T U S L E D s
O r a n g e l e d
T h e l e d i s O N w h e n t h e c o n n e c t i o n w i t h s l a v e s h e l f 1 i s
e s t a b l i s h e d
S U B - D 1 5 P , t o b e
c o n n e c t e d t o e x
p a n s i o n s h e l f 1
H W F a i l u r e L E D
S U B - D 1 5 P , t o b e
( n o t u s e d i n c u r
r e n t r e l . )
O r a n g e l e d
e s t a b l i s h e d
O r a n g e l e d
e s t a b l i s h e d ( o n l y 2 s l a v e s h e l v e s a l l o w e d i n c u r r e n t r e l . )
O r a n g e l e d
P o w e r f a i l u r e l e d ; i t i s O N w h e n t h e b o a r d i s p r o p e r l y
p o w e r e d
G r e e n / R e d
l e d
H a r d w a r e f a i l u r e l e d . I t i s
- G R E E N w h e n t h e b o a r d i s p l u g g e d , c o n f i g u r e d a n d
- R E D w h e n s o f t w a r e r e s e t i s b e i n g p e r f o r m e d
C o n n e c t i o n p o i n t w i t h 1 6 9 6 M S _ C e x p a n s i o n s h e l f 1
( n o t u s e d i n c u r r e n t r e l e a s e )
S U B - D 1 5 P , t o b e

Figure 909190: I-Link_M front panel

3
A
L
8
6
8
9
3
A
A
ACRONYM
1696MS
1 (slave
I-Link_S
SLOTS
1696MS_C
SLOTS
shelf only)
Not used
P o w e r F a i l u r e L E D
N O T U S E D
H W F a i l u r e L E D
O r a n g e l e d
P o w e r f a i l u r e l e d ; i t i s O N w h e n t h e b o a r d i s p r o p e r l y
p o w e r e d
G r e e n / R e d
l e d
H a r d w a r e f a i l u r e l e d . I t i s
- G R E E N w h e n t h e b o a r d i s p l u g g e d , c o n f i g u r e d a n d
- R E D w h e n s o f t w a r e r e s e t i s b e i n g p e r f o r m e d
C o n n e c t i o n p o i n t w i t h 1 6 9 6 M S _ C m a s t e r s h e l f
N O T U S E D
N O T U S E D
S U B - D 1 5 P , t o b e
c o n n e c t e d t o t h e
1 6 9 6 M S _ C m a s
t e r s h e l f

Figure 919291: I-Link_S front panel

ACRONYM
1696MS
LAC (LAN_Q)
SLOTS
1696MS_C
SLOTS
8
G r e e n /
R e d l e d
- G r e e n w h e n t h e b o a r d i s p l u g g e d , c o n f i g u r e d a n d w i t h o u t f a i l u r e
- R e d w h e n o n e o f t h e O n B o a r d p o w e r s u p p l y ( O B P S ) i s i n f a i l u r e
( O R o n t h e p o w e r s u p p l y a l a r m s )
R J 4 5
c o n n e c t o r
R J 4 5 a n d
B N C c o n
n e c t o r s
H a r d W a r e
F a i l u r e L E D
LAC (LAN_I)
26
27 -
B N C
c o n n e c t o r s
- i n m a s t e r s h e l f , s l o t 2 6 , o r i n c o m p a c t s h e l f , s l o t 8 ( L A N _ Q ) , t h e s e c o n n e c
t o r s p r o v i d e t h e p h y s i c a l a c c e s s ( Q 3 i n t e r f . ) t o c o n n e c t a n e x t e r n a l s u p e r v i
s i o n e q u i p m e n t ( 1 3 5 3 . . ) . S l o t 2 6 i s l i n k e d t o t h e E S C b o a r d v i a b a c k p a n e l l i n k
- a s e c o n d b o a r d c a n b e p l u g g e d i n m a s t e r s h e l f , s l o t 2 7 ( L A N _ I ) , t o a l l o w
t h e i n t r a - s h e l f c o m m u n i c a t i o n v i a a c a s c a d e ( B N C ) o r H U B ( R J 4 5 ) l i n k w i t h
t h e s a m e c o n n e c t o r o f t h e L A N _ I b o a r d , s l o t 2 7 , o f e a c h e x p a n s i o n s h e l f .
I f a c a b l e i s f i t t e d i n R J 4 5 c o n n . , B N C i s u n a v a i l a b l e a n d v i c e v e r s a
N M S / I N T R A - S H E L F
c o n n e c t i o n s

Figure 929392: LAN boards front panel

2 5 p i n s S U B - D f e m a l e c o n n e c t o r f o r h o u s e
k e e p i n g a l a r m s ( 8 i n p u t s a n d 8 o u t p u t s )
H a r d W a r e
F a i l u r e L E D
ACRONYM
1696MS
HK
SLOTS*
1696MS_C
SLOTS*
11
G r e e n /
R e d l e d
36
* Master shelf only

Figure 939493: Housekeeping front panel

ACRONYM
1696MS
RAI
SLOTS
1696MS_C
SLOTS
9; 10
9 p i n s S U B - D f e m a l e
c o n n e c t o r ( t o P D U / T R U )
H a r d W a r e
F a i l u r e L E D
37
R J 1 1 , 6 p i n s c o n n e c t o r ( t o
t h e 9 p i n s S U B - D f e m a l e
c o n n e c t o r o f t h e s h e l f b e l o w )
R A C K A L A R M S
G r e e n /
R e d l e d
9 p i n s S U B - D f e
m a l e c o n n e c t o r
U s e d t o c o n n e c t t h e R A I c a r d o f t h e m a s t e r s h e l f w i t h t h e
P D U / T R U
R J 1 1 6 p i n s
c o n n e c t o r
U s e d f o r i n t r a - s h e l f c o m m u n i c a t i o n . I t h a s t o b e c o n n e c t e d t o
t h e 9 - p i n c o n n e c t o r o f t h e s l a v e s h e l f b e l o w . O n l y f o r 1 6 9 6 M S

Figure 949594: RAI front panel

ACRONYM
1696MS
UIC
SLOTS*
1696MS_C
SLOTS*
-
H a r d W a r e
F a i l u r e L E D
46; 47
G r e e n /
R e d l e d
- R e d w h e n t h e b o a r d i s i n h a r d w a r e f a i l u r e
5 2 p i n s S C S I - 2
f e m a l e c o n n e c t o r
* Master shelf only

Figure 959695: UIC front panel

Switching protection, power supply and fans front view
ACRONYM
1696MS
OPC
SLOTS
1696MS_C SLOTS
9, 10, 11
G r e e n /
R e d l e d
H a r d w a r e f a i l u r e . T h e L E D i s *
- R e d w h e n t h e b o a r d i s i n h a r d w a r e f a i l u r e
2 8 B 3 5
3 8 B 4 5
H a r d W a r e F a i l u r e L E D *
c h a n n e l 1 T x I n p u t
c h a n n e l 2 T x I n p u t
c h a n n e l 1 R x O u t p u t
c h a n n e l 2 R x O u t p u t
R x i n p u t
T x o u t p u t
T o ( T x O u t ) /
F r o m ( R x I N )
C l i e n t
T o ( R x O U T ) /
F r o m ( T x I N )
t r a n s p o n d e r s
o r 4 x A N Y
d r a w e r s
SM & MM OPC
with connectors
3AL86708AC
3AL86708AD
3AL95113AA
Master Expansion
8; 9; 10; 11

Figure 969796: OPC front panel

ACRONYM
1696MS
OMSP
SLOTS
1696MS_C SLOTS
9, 10, 11
G r e e n /
R e d l e d
2 8 B 3 5
3 8 B 4 5
H a r d W a r e F a i l u r e L E D *
L i n e 1 I N - C W D M l i n e i n p u t s i g n a l 1 ( f r o m l i n e )
L i n e 2 I N - C W D M l i n e i n p u t s i g n a l 2 ( f r o m l i n e )
L i n e 1 O U T - C W D M l i n e o u t p u t s i g n a l 1 ( t o l i n e )
T X O U T - s e l e c t e d o p t ic a l s i g n a l o u t p u t ( t o D E M U X )
Master Expansion
8; 9; 10; 11
L i n e 2 O U T - C W D M l i n e o u t p u t s i g n a l 1 ( t o l i n e )
R X I N - p r o t e c t e d o p t i c a l s i g n a l i n p u t ( f r o m M U X )
T h e L E D i s G R E E N w h e n t h e b o a r d i s p l u g g e d ,
c o n f i g u r e d a n d w i t h o u t f a i l u r e

Figure 979897: OMSP front panel

ACRONYM
1696MS
SLOTS
1696MS_C
SLOTS
7, 12 (master/exp shelves)
G r e e n /
R e d l e d
- G R E E N w h e n t h e b o a r d i s p l u g g e d , c o n f i g u r e d a n d w it h o u t f a i l u r e
- R E D w h e n t h e b o a r d i s i n f a i l u r e o r t h e p o w e r s u p p l y c a b l e i s n o t
c o n n e c t e d
1 ( m a l e ) + V B A T T
2 ( f e m a l e ) G N D
3 ( m a l e ) - V B A T T
3 - p i n S U B - D
c o n n e c t o r
PSC2
PSC3
2 5 , 4 8

Figure 989998: PSC/PSC2/PSC3 front panel

ACRONYM
1696MS
PMU
SLOTS
1696MS_C
SLOTS
1 ) G R E E N /
R E D L E D
M A J O R a l a r m . T h e L E D i s
- G R E E N w h e n t h e b o a r d i s p l u g g e d a n d w i t h o u t f a i l u r e
- R E D w h e n t h e a l a r m i s p r e s e n t ( r a i s e d o n l y i f P M U _ P r e s e n c e ) . I t i s t h e O R o f
b o t h r e c t i f i e r s a r e m i s s i n g o r b o t h r e c t i f i e r s i n p u t v o l t a g e < 8 5 V r m s
b o t h r e c t i f i e r s o u t p u t v o l t a g e < 3 8 V o r > 6 0 V
b o t h f a n s f r o m P M U c a s e 1 f a i l e d ( O R f a n f r o m P M U c a s e 2 f a i l e d )
b o t h r e c t i f i e r s t e m p e r a t u r e > 5 5 C o r o u t p u t c u r r e n t < 1 2 A
Placed below the 1696MS_C
N o t u s e d
master shelf
RECTIFIER 1 RECTIFIER 2
CONTROL UNIT
in1 in2
1)
OUT
IN
OUT
OUT
5) 3) 4)
2)
6)
7)
3)
2 ) G R E E N /
R E D L E D
M I N O R a l a r m . T h e L E D i s
- G R E E N w h e n t h e b o a r d i s p l u g g e d a n d w i t h o u t f a i l u r e
- R E D w h e n t h e a l a r m i s p r e s e n t ( r a i s e d o n l y i f P M U _ P r e s e n c e ) . I t i s t h e O R o f
o n e r e c t i f i e r i s m i s s i n g o r o n e r e c t i f i e r i n p u t v o l t a g e < 8 5 V r m s
o n e r e c t i f i e r o u t p u t v o l t a g e < 3 8 V o r > 6 0 V
o n e F A N f r o m P M U c a s e 1 f a i l e d o r o n e r e c t i f i e r t e m p e r a t u r e > 5 5 C
b a t t e r y p r e s e n t b u t b a t t e r y b r e a k e r o p e n
3 ) G R E E N /
R E D L E D
B A T T E R Y C O N N E C T E D . T h e L E D i s R E D i f b a t t e r y c o n n e c t i o n i s f a i l e d .
T h e L E D i s G R E E N i f b a t t e r y i s c o n n e c t e d .
4 ) G R E E N /
R E D L E D
T E S T B A T T E R Y . T h e L E D i s R E D i f t e s t b a t t e r y i s f a i l e d .
T h e L E D i s G R E E N i f t e s t b a t t e r y i s O K . T h e L E D i s L I T O F F i f n o b a t t e r y c o n n e c t e d
5 ) B A T T E R Y C O N N E C T O R . I t h a s t o b e c o n n c t e d t o t h e ( o p t i o n a l ) b a c k - u p b a t t e r y
6 ) O U T P U T P O W E R C O N N E C T O R S . S U B - D 3 p t o b e c o n n e c t e d t o t h e t w o P S C ( 2 ) c a r d s
7 ) P M U A L A R M S C O N N E C T O R S . S U B - D 1 5 p t o b e c o n n e c t e d t o t h e F A N _ C
8 ) A C I N P U T P O W E R C O N N E C T O R S . T o b e c o n n e c t e d t o t h e p r i m a r y A C p o w e r s u p p l y
( 1 0 0 V / 5 0 - 6 0 H z , 1 1 5 V / 6 0 H z , 2 3 0 V / 5 0 H z )
in1
in2
OUT
IN
OUT
OUT
F
A
N
1)
5) 4) 3)
2)
6)
7) 3)
Two different solutions are provided

Figure 9910099: PMU front panel

G r e e n /
R e d l e d
T h e L E D i s O F F w h e n t h e b o a r d i s p l u g g e d b u t n o t c o n f i g u r e d
I t i s G R E E N w h e n t h e b o a r d i s p l u g g e d b u t n o t c o n f i g u r e d
I t i s R E D t o i n d i c a t e h a r d w a r e f a i l u r e , p o w e r s u p p l y f a i l u r e o r f a i l u r e i n c o m m u n i c a t i o n w i t h t h e b o a r d
ACRONYM
1696MS
FANC
SLOTS
1696MS_C
SLOTS
- 49
H a r d W a r e
F a i l u r e L E D
F A N C ( f o r 1 6 9 6 M S )
FAN_C 13 -
1 5 p i n s S U B - D
f e m a l e c o n n e c t o r
( f o r b a t t e r i e s
a l a r m s r a i s i n g )
F A N _ C ( f o r 1 6 9 6 M S _ C )
E X T
P M U
F A N
F I L T E R
H a r d W a r e
F a i l u r e L E D
F A N s s t a t u s L E D s
N e w F A N s o n l y . G R E E N L E D i n d i c a t e s F A N ( 1 , 2 , 3 ) s p e e d i s O K .
R E D L E D i n d i c a t e s F A N ( 1 , 2 , 3 ) s p e e d i s t o o l o w .
O R A N G E L E D i n d i c a t e s F A N ( 1 , 2 , 3 ) s p e e d t o o f a s t .
N e w F A N
G r e e n /
R e d l e d

Figure 100101100: FANs front panel


6 FUNCTIONAL DESCRIPTION
Overview
Purpose
Contents
General description II-199
System Configuration II-272

General description
This section describes the main functions carried out by the
- 1696MSPAN
- 1696MS_C (CPE, housed in a compact shelf, with reduced functionalities)
Alcatel-Lucent products.
The functions carried out by the NE, can be splitted in some sub-systems here below
listed, and described from the sections Transponder sub-system to Performance
Monitoring sub-system:
- Transponder sub-systemTransponder sub-systemTransponder sub-
systemTransponder sub-system
- TDM client signal concentrator sub-systemTDM client signal concentrator
sub-systemTDM client signal concentrator sub-systemTDM client signal
concentrator sub-system
- Optical MUX/DMUX (Wavelength Division Multiplexing) sub-system
- Optical Fiber Amplification (OFA) sub-system - optional - used in 1696MS only
- Supervision management (Optical Supervisory Channel, OSC) sub-system -
optional
- Automatic Power Equalization sub-system (APE) - optional
- Controller sub-system
- Power supply sub-system
- Protection (O-SNCP) sub-system
- Performance Monitoring sub-system
Before starting with the presentation of the above listed functions / sub-systems, for a
better system comprehension, the 1696MSPAN main configurations (Line Terminal,
OADM, back-to-back terminal, Repeater) and the functions implemented in each of
them are described in the following.
Formatted: Font: Bold
Formatted: Font: Bold

Line Terminal configuration
W D M
l i n e
O F A
O F A
E q u i p m e n t a n d
s h e l f c o n t r o l l e r
U s e r
I n t e r f a c e s
P o w e r
s u p p l y
U s e r s e r v i c e a c c e s s e s S t a t i o n b a t t e r i e s
O S C
O S C
e x t r a c t i o n
O S C
i n s e r ti o n
3 .6 V
5 .5 V
T o
b o a rd s
4 8 V
T o b o a r d s
S P I b u s
T D M b u s
N E m a n a g e m e n t
a p p l i c a t i o n
L A N - Q 3
2 M b i t / s
2
T r a n s p o n d e r
M U X
D M U X
U p to
3 2
L E G E N D :
O p t i c a l l i n k
E l e c tr i c a l l i n k
O p t i o n a l
f u n c t i o n
4 8 V
U p to
3 2
U p t o 3 2
4 x N Y _ P
2 x G E _ F C
8 x G E
B o o s t e r
P r e - a m p .
U p t o 3 2
( u p t o 1 6 W L A )
C
l
i
e
n
t

s
i
g
n
a
l
s

If needed DCU modules can be used (placed before OFA booster input, in both
directions).
This type of configuration can be provided with one (as shown in current figure) or
two OFAs (see also Booster + Pre-amplifier Line terminal).
In the figure, 4xANY_P, 2xGE_FC and 8xGE are equipped with B&W SFP/XFP, line
side. In case they are provided with WDM SFP/XFP, they act as transponders, hence
they are directly connected to the mux/demux
Figure 101102101: Functional synopsis in Line Terminal configuration

In the line terminal configuration all the above functions are needed.
OADM / back-to-back terminal (Hub) configuration
W D M
l i n e
( E a s t )
U p t o 3 2
O S C
( W e s t )
D M U X
M U X
O - S N C P
M U X
D M U X
P a s s t h ro u g h t ra f f ic
( E a s t )
s h e l f c o n tr o l
U s e r
I n t e r f a c e s
P o w e r
s u p p l y
U s e r s e r v i c e a c c e s s e s
S t a t i o n
b a t t e r i e s
P a s s t h ro u g h t ra f f ic
O S C
e x t r a c t i o n
O S C
i n s e r ti o n
O S C
O S C
e x t r a c t i o n
O S C
i n s e r ti o n
3 .6 V 5 .5 V
T o b o a r d s
W D M
l i n e
( W e s t )
4 8 V
T o b o a r d s
S P I b u s
T D M b u s
L A N - Q 3
2 M b i t / s
2
B a c k p a n e l
e l e c t r i c a l l i n k s
O F A
O F A
O F A
O F A
L E G E N D :
O p t i o n a l
f u n c t i o n
B o o s t e r
P r e - a m p .
B o o s t e r
P r e - a m p .
8
x
G
E
2
x
G
E
_
F
C
4
x
A
N
Y
_
P

If needed DCU modules can be used (placed before OFA booster input, in both
directions).
This type of configuration can be provided with one (as shown in current figure) or
two OFAs (see also OADM or back-to-back terminal (hub) repeater).
In the figure, 4xANY_P, 2xGE_FC and 8xGE are equipped with B&W SFP/XFP, line
side. In case they are provided with WDM SFP/XFP, they act as transponders, hence
they are directly connected to the mux/demux.
Figure 102103102: Functional synopsis in OADM configuration

The hub configuration is similar to the OADM one, but without pass-through channels
(all the channels are added/dropped).
In OADM configuration all the optical transmission functions (transponder, MUX and
DMUX) are duplicated to transmit the client signals in two directions (8xGE also
supports add/drop with one board). This configuration allows optical channel
protection functions (O-SNCP).
In line repeater configuration
W D M
l i n e
O S C
e x t r a c t i o n
O S C
i n s e r ti o n
O F A 1
V O A
S t a g e 1
O S C
e x t r a c t i o n
O S C
i n s e r ti o n
V O A
W D M
l i n e
O F A 2
S t a g e 1
S t a g e 2
S t a g e 2
O S C
s h e l f c o n t r o l
U s e r
I n t e r f a c e s
P o w e r
s u p p l y
U s e r s e r v i c e a c c e s s e s
S t a ti o n
b a tt e r i e s
O S C
3 .6 V 5 .5 V
T o b o a r d s
4 8 V
T o b o a r d s
S P I b u s
T D M b u s
L A N - Q 3
2 M b i t / s
2
L E G E N D :
O p t i o n a l
f u n c t i o n
D C U
D C U

Figure 103104103: Functional synopsis in Repeater configuration

In In line repeater configuration, the MUX/DEMUX and Transponder functions are
not implemented. The equipment acts as an in line amplifier, which allows
nevertheless the Optical Supervision Channel (OSC) and the supervision functions.
Transponder sub-system
The transponder sub-system is built with
Multi-rate Channel Cards: MCC3
Optical Channel Cards: OCC10 (OCC10_E for DWDM and OCC10_EC for CWDM)
Multi-rate WaveLength Adapters: WLA1, WLA2 and WLA3
G709 transponders : TRBD1996 equiped at both sides with XFP modules ( for SDH or
10GbE WAN or 10GbE LAN signals)
TDM concentrators, if equipped with a WDM SFP, line side: 4xANY_P and 2xGE_FC.
These boards are described in TDM client signal concentrator sub-system.
Ethernet concentrator, if equipped with a WDM XFP, line side: 8xGE. This board is
described in Ethernet concentrator sub-system.
MCC3, OCC10 and TRBD1996OCC10 manage one client signal and one WDM
wavelength each.
WLAs manage two client signals each and two WDM wavelengths (2-
channel/wavelength transponders).
2xGE_FC, 4xANY_P and 8xGE manage two/four/eigth client signals respectively, and
one WDM wavelengths (1-channel/wavelength transponders).
The role of this function is:
At the transmit side (from client to WDM line):
to adapt the client incoming optical signals to a dedicated wavelength and deliver those
optical signals to the multiplexer (MUX) function.
At the receive side (from WDM line to client):
to restitute the client optical signals from the signal delivered by the demultiplexer
(DEMUX) function.
The payload type configuration of the client signal is under control of the operator.
N C l i e n t s i g n a l s
T o M U X f u n c t io n
F r o m D M U X f u n c t i o n
U s e r T x U s e r R x
W D M T x W D M R x
U p t o 3 2
T r a n s p o n d e r f u n c t i o n
8 x 8 M a tr i x
U p t o 3 2 D W D M c h a n n e ls o r
U p t o 8 C W D M c h a n n e ls


Figure 104105104: Line terminal transponder function

In back-to-back and OADM configuration, the transponder function is doubled and it is able to
transmit and receive the clients signals in two directions. It provides optionally Optical Sub-
Network Connection Protection (O-SNCP), see Protection sub-system.
U p t o 3 2 C l i e n t s i g n a l s
T o M U X
fu n c ti o n
F r o m D M U X
fu n c ti o n
W D M R x
M C C
W D M R x
W D M T x W D M R x
U p to 3 2
T r a n s p o n d e r f u n c t i o n
8 x 8 M a tr i x
W D M R x
M C C
W D M R x
W D M T x W D M R x
U p to 3 2
F r o m D M U X
fu n c ti o n
T o M U X
fu n c ti o n
B a c k - p a n e l
e l e ct ri ca l
lin k s
O - S N C P
: O pti ons
8 x 8 M a tr i x
W e s t East

Figure 105106105: Back-to-back terminal or OADM transponder function

Client signals
MCC client signals
The MCC3 board accepts all bit rates from 100 Mbit/s to 2.66 Gbit/s in 3R (Re-time,
Re-amplify, Re-shape) mode. However beyond 2.5 Gbit/s the performances may be
degraded.
The typical client signals accepted by the MCC3 board are listed in the following table.

Table 6.1 Example of Client signals - supported bit rates
MCC3
Bit rates (Mbit/s) Signal
100.000 FDDI
125.000 FE / FDDI

MCC3
Bit rates (Mbit/s) Signal
132.815 FC (12M6-LE-I)
155.520 STM-1 / OC-3
200.000 ESCON
265.620 FC (25M6-LL-I)
270.000 DTV / HDTV
466.560 OC-9
531.250 FC (50M5-SL-I)
622.080 STM-4 / OC-12
933.120 OC-18
1062.500 FC (100SM-LL-I)
FICON / Inter-System Coupling Channel (ISC)
1244.160 OC-24
1250.000 GBE
1866.240 OC-36
2125.000 2FC
2488.320 STM-16 / OC-48
2500.000 INFINIBAND
One CWDM SFP can be plugged on MCC3, client side.
WLA1, WLA2 and WLA3 client signals
The WLA boards can accept the following bit rates (from 125 Mbps to 2.666 Gbps) in
3R (Re-time, Re-amplify, Re-shape) mode: 125 Mbps, 155.52 Mbps, 200 Mbps, 270
Mbps, 622.08 Mbps, 1.0625 Gbps, 1.24416 Gbps, 1.25 Gbps, 2.125 Gbps, 2.48832
Gbps, 2.5 Gbps, 2.666 Gbps.
OCC10_E, OCC10_EC, TRBD1996 client signals
OCC10 boards support the following client signals in 3R (Re-time, Re-amplify, Re-
shape) mode:
9953.28 Gbps (STM-64 / OC-192 / 10GBE WAN), in UNI mode
10.3125 Gbps (10GBE LAN)
10.709 Gbps, in NNI mode (future rel.).
9.9532 Gbps and 10.3125 Gbps B&W client signals in UNI mode are converted into a
10.709 Gbps and 11.0957 Gbps coloured signal, respectively.
OCC10_E and TRBD1996 supports DWDM wavelengths, OCC10_EC supports
CWDM wavelengths.
TRBD1996 boards support the following client signals in 3R (Re-time, Re-amplify,
Re-shape) mode:
9953.28 Gbps (STM-64 / OC-192 / 10GBE WAN), in UNI mode
10.3125 Gbps (10GBE LAN)

OCC10_E supports DWDM wavelengths, OCC10_EC supports CWDM wavelengths.
10 Gbps supported interfaces
According to the XFP plugged, client side, the 10Gbps transponders support the
following optical interfaces:
VSR; it complies with the following standards:
ITU-T G.691 I-64.1
ITU-T G.693 VSR 2000-2R1
Bellcore GR253-CORE SR1.
These applications are 2 km target distance supporting B&W 10 Gbps optical tributary
signals with up to 4 dB link budget. The operating wavelength is in the 1300 nm band

S-64.2b; it complies with the ITU-T G.691 standard having a 40 km target distance
supporting B&W 10 Gbps optical tributary signal with up to 11 dB link budget. The
operating wavelength is in the 1550 nm band
10GBASE-SR, 10GBASE-SW: they comply with the IEE 802.3 standard and have a 300 m
target distance with a 2000 MHz/Km Modal bandwidth, supporting B&W 10.31 Gbps
(10GBE LAN) and 9.95 Gbps (10GBE WAN) optical tributary signals with up to 2.6 dB link
budget. The operating wavelength is 850 nm
10GBASE-LR, 10GBASE-LW: they comply with the IEE 802.3 standard and have a 10 km
target distance supporting B&W 10.31 Gbps (10GBE LAN) and 9.95 Gbps (10GBE WAN)
optical tributary signals with up to 9.4 dB link budget. The operating wavelength is 1310 nm.
10GBASE-ER, 10GBASE-EW: they comply with the IEE 802.3 standard and have a 40 km
target distance supporting B&W 10.31 Gbps optical tributary signals (10GBE LAN). The
operating wavelength is 1565 nm.
4XANY_P and 2xGE_FC client signals
Refer toTDM client signal concentrator sub-system.
8xGE client signals
Refer to Ethernet concentrator sub-system.
DWDM optical channels
The 1696MSPAN transmits the 32 possible DWDM channels in the C-band. Table
6.2Table 6.2Table 6.2 gives the nominal central frequencies allocation plan, based on
the 100 GHz channel spacing anchored to a 193.100 THz reference (ITU-T standard
grid).
The C-band is split into 4 sub-bands, which support 8 channels each: the long bands
L1 and L2, and the short bands S1 and S2.
Then, each sub-band is composed of 2 sets of 4 consecutive channels. Each set is
separated from the adjacent sets by one unused channel, except between L1 and S2,
where the separation is 3 unused channels.

Table 6.2 DWDM frequencies allocation plan in C-Band
Band Central frequency
(GHz) (Craft terminal
name)
Channel
Number
Central wavelength (nm)
wavelength deviation : 0,12 nm (EOL)
@2.5Gbps wavelength deviation : 0,1 nm
(EOL) @10Gbps
name)
Channel
Number
(EOL) @10Gbps
BLUE
BAND
192,000 20 1561,42
192,100 21 1560,61
192,200 22 1559,79
192,300 23 1558,98
L2
192,500 25 1557,36
192,600 26 1556,55
192,700 27 1555,75
192,800 28 1554,94

193,000 30 1553,33
193,100 31 1552,52
193,200 32 1551,72
193,300 33 1550,92
L1
193,500 35 1549,32
193,600 36 1548,51
193,700 37 1547,72
193,800 38 1546,92
RED
BAND
194,200 42 1543,73
194,300 43 1542,94

name)
Channel
Number
(EOL) @10Gbps
194,400 44 1542,14
194,500 45 1541,35
S2
194,700 47 1539,77
194,800 48 1538,98
194,900 49 1538,19
195,000 50 1537,40

195,200 52 1535,82
195,300 53 1535,04
195,400 54 1534,25
195,500 55 1533,47
S1
195.700 57 1531,90
195.800 58 1531,12
195.900 59 1530,33
196.000 60 1529,55

The Central frequency value (in GHz) is the channel name, visualized on the Craft
Terminal.
The WaveLength Adapter (WLA) provides two independent optical channels or one
optically protected channel, according to the board type.
WLA3 provides two DWDM interfaces. Sixteen WLA3s are required to cover the 32
DWDM channels.
The TDM concentrators (4xANY_P and 2xGE_FC), the Ethernet concentrator (8xGE),
the Multi-rate Channel Card (MCC3) and the 10 Gbps Optical Channel Cards
(OCC10_E) support one DWDM channel. 32 transponders are required to cover the 32
DWDM channels.
Mixed configuration (MCC3, OCC10, WLA, 2xGE_FC, 8xGE and 4xAny_P in the
same equipment) are allowed.

CWDM optical channels
The 1696MSPAN transmits the eigth possible CWDM channels according to ITU-T
G.694.2. Table 6.3Table 6.3Table 6.3 gives the nominal central frequencies allocation
plan, based on the 20 nm wavelength spacing anchored to a 193.100 THz reference
(ITU-T standard grid).

Table 6.3 CWDM nominal frequencies allocation plan in C-Band
Central wavelength (nm) Central
frequency
(GHz) (Craft
terminal name)
Channel
Number
Wavelength deviation (nm)
1471 204,100 1470 6.5
1491 201,300 1490 6.5
1511 198,700 1510 6.5
1531 195,300 1530 6.5
1551 195,500 1550 6.5
1571 191,100 1570 6.5
1591 188,700 1590 6.5
1611 186,300 1610 6.5

The WaveLength Adapter (WLA1, WLA2 and WLA3) provides two independent
optical channels or one optically protected channel each, according to the board type
(WLA1 will provide one optically protected channel in future rel.).
WLA1, WLA2 and WLA3 provide up to four CWDM interfaces each one.
Four different WLA1, WLA2 or WLA3 are able to cover the eigth CWDM channels.
TDM concentrators (4xANY_P and 2xGE_FC) support one CWDM channel. Eigth
different boards are required to cover the eigth CWDM channels.
OCC10_EC supports one CWDM channel on 1530nm, 1550nm, 1570nm, 1590nm or
1610nm wavelength.
One CWDM SFP can be plugged on MCC3, client side. Eigth different MCC3s
(transponders) are required to cover the eigth CWDM channels.
Mixed configuration (different transponders in the same equipment) are allowed.
TDM client signal concentrator sub-system
Two boards belong to TDM client signal concentrator sub-system: 4xANY_P and
2xGE_FC.
These boards are able to aggregate client signals into a STM-16/OC-48 frame.
4xANY_P
It supports clients signals from 100 Mbps to 2.5 Gbps. Each client signal connected to

The aim of the 4xANY TDM concentration is to save transponders and to optimize the
use of each WDM channel. Client signals from 100Mbps to 1.25Gbps can be
concentrated in one STM-16. For example, 4 x STM-1 client signals can be
concentrated on a unique STM-16 signal and applied to a unique transponder access, if
a B&W SFP is used, aggregate side.
In case of a CWDM or DWDM SFP is plugged on 4xANY_P, aggregate side, the
board is a transponder and can be directly connected to the mux/demux, avoiding the
use of a transponder.
U p t o 4
U p t o 4
W D M
o p t i c a l
c h a n n e ls
4 T r a n s p o n d e r s T r a n s p o n d e r
4 x A N Y
T D M
C o n c e n
t r a t o r
1 W D M
o p t i c a l
c h a n n e l
1 T r a n s p o n d e r
1 x S T M 1 6 ( B & W )
U p t o 4
4 x A N Y
T D M
C o n c e n
t r a t o r
U p t o 4
1 W D M
o p t i c a l
c h a n n e l
1 x C W D M o r D W D M

Figure 106107106: Principle of the 4xANY TDM concentration

The available client signal accesses and their maximum number are:
Low bit rate:
- 4 x Fast Ethernet

- 4 x FDDI
- 4 x ESCON
- 4 x Digital Video
SDH:
- 4 x STM1
- 3 x STM4
High bit rate:
- 2 x Gigabit Ethernet
- 2 x Fiber Channel or FICON
The following mixes are also possible:
- 3 x (FDDI or FE or DV or ESCON or STM1) + 1 x STM4
- 2 x (FDDI or FE or DV or ESCON or STM1) + 2 x STM4
- 2 x (FDDI or FE or DV or ESCON or STM1) + 1 x (FC or GbEth or FICON)
- 1 x (FDDI or FE or DV or ESCON or STM1) + 1 x STM4 +1 x (FC or GbEth or
FICON).
- 2 x (FC or GbEth or FICON).

Low and high bit rates are available at 1310nm and 850nm. SDH bit rates are only
available at 1310nm.
On the aggregate side, the 4xANY_P board is equipped with a SFP optical module
providing the following interfaces, according to the SFP used: I-16.1 or S-16.1 B&W,
APD or PIN CWDM , APD DWDM.
2xGE_FC
The way of working of 2xGE_FC is similar to the 4xANY_P one. The main
differences between them are listed in the following:
2xGE_FC is able to map 2 x GbE or FC or FICON client signals into an STM-16/OC-48
frame using GFP-T and Virtual Concatenation
SFPs are hosted on both sides
B&W, CWDM and DWDM SFPs can be plugged on both sides
1+1 protection (on both sides).
U p t o 2
W D M
o p t i c a l
c h a n n e ls
T D M
C o n c e n
t r a t o r
1 W D M
o p t i c a l
c h a n n e l
U p t o 2
T D M
C o n c e n
t r a t o r
U p t o 2
1 W D M
o p t i c a l
c h a n n e l
1 x C W D M o r D W D M
2 x G E _ F C
2 x G E _ F C
1 x S T M 1 6
( B & W )

Figure 107108107: Principle of the 2xGE_FC TDM concentration

Ethernet concentrator sub-system
One board belongs to the Ethernet concentrator sub-system: 8xGE.
This board is able to aggregate up to 8 x 1GbE client signals into a 10 GbE WAN
frame at 9.95 Gbps, in point-to-point application (Concentration configuration). In this
case, only one line interface is used.
It is also able to add/drop a part of the client signals along the path, and to pass-
through the other clients, in multipoint application (add/drop configuaration). In this
case, both line interfaces are used.
The concentrator function is provided by a Layer 2 switch, which tags the Ethernet
streams with an internal VLAN ID and then aggregates, thus sending them to a 10 GbE
B&W transceiver. In order to completely separate the client data streams from each
other, the Layer 2 switch is provisioned in order to have a port based virtual LAN
(VLAN) for each GbE client (see IEEE802.1Q, Annex D).
The client optical interfaces are B&W or CWDM SFPs.
The line optical interfaces are B&W (I-64.1/10G Base-LW in 2nd window or S-
64.2b/10GBase-EW in 3rd window) or DWDM (APD) XFPs.
1+1 client protection is managed via OMSP, only in point-to-point application (see
Figure 110).
8 x G E T R A N S P
I F G . 7 0 9 O R R E G I O N A L
P E R F . A R E R E Q U I R E D
8 x G E T R A N S P
I F G . 7 0 9 O R R E G I O N A L
C O N C E N T R A T IO N C O N F IG U R A T IO N IN P O IN T - T O - P O IN T A P P L IC A T IO N
8 x G E T R A N S P
I F G . 7 0 9 O R R E G I O N A L
8 x G E T R A N S P
I F G . 7 0 9 O R R E G I O N A L
8 x G E
A D D / D R O P C H s
A D D /D R O P C O N F IG U R A T IO N IN M U L T IP O IN T A P P L IC A T IO N
C O N C E N T R A T O R C O N C E N T R A T O R
C O N C E N T R A T O R C O N C E N T R A T O R
A D D / D R O P

Figure 108109108: 8xGE configurations: concentration mode and add/drop mode

This unit allows to save transponders and to optimize the use of each WDM channel.
Client signals are concentrated in one 10GbE WAN applied to a unique transponder
access, if a B&W XFP is used, line side. In case a WDM XFP is used line side, 8xGE
is a transponder and it is directly connected to the mux/demux.
8 T r a n s p o n d e r s
U p t o 8
U p t o 8
W D M
o p t i c a l
c h a n n e ls
T ra n s p o n d e r
8 x G E
1 W D M
o p t i c a l
c h a n n e l
1 x S T M 1 6 ( B & W )
U p t o 8
8 x G E
U p t o 8
1 W D M
o p t i c a l
c h a n n e l
1 x D W D M
1
8
1
8

Figure 109110109: Principle of the 8xGE Ethernet concentration

G b E # 1
G b E # 2
G b E # 3
G b E # 4
G b E # 5
G b E # 6
G b E # 7
G b E # 8
L I N E # 1
L I N E # 2
O M S P
O M S P
O M S P
O M S P
O M S P
O M S P
O M S P
O M S P
G b E # 1
G b E # 2
G b E # 3
G b E # 4
G b E # 5
G b E # 6
G b E # 7
G b E # 8
L I N E # 1
L I N E # 2
G b E # 1
G b E # 2
G b E # 3
G b E # 4
G b E # 5
G b E # 6
G b E # 7
G b E # 8
L I N E # 1
L I N E # 2
O M S P
O M S P
O M S P
O M S P
O M S P
O M S P
O M S P
O M S P
G b E # 1
G b E # 2
G b E # 3
G b E # 4
G b E # 5
G b E # 6
G b E # 7
G b E # 8
L I N E # 1
L I N E # 2
8 x G E
8 x G E
8 x G E
8 x G E

Figure 110111110: Eight GbE signals protected by OMSP boards in Concentration
mode (point-to-point)

G b E # 1
G b E # 2
G b E # 3
G b E # 4
G b E # 5
G b E # 6
G b E # 7
G b E # 8
L I N E # 1
L I N E # 2
G b E # 1
G b E # 2
G b E # 3
G b E # 4
G b E # 5
G b E # 6
G b E # 7
G b E # 8
L I N E # 1
L I N E # 2
G b E # 1
G b E # 2
G b E # 3
G b E # 4
G b E # 5
G b E # 6
G b E # 7
G b E # 8
L I N E # 1
L I N E # 2
8 x G E
8 x G E
8 x G E
8 x G E
L
I
N
E

#
1
L
I
N
E

#
2
G
b
E

#
1
G
b
E

#
2
G
b
E

#
3
G
b
E

#
4
G
b
E

#
5
G
b
E

#
6
G
b
E

#
7
G
b
E

#
8
U P T O 8 G B E S I G N A L S I N S E R T E D U P T O 4 G B E S I G N A L S I N S E R T E D
U P T O 4 G B E S I G N A L S I N S E R T E D

Figure 111112111: 8xGE in ADD/DROP mode (multipoint)

Wavelength Division Multiplexing sub-system
The optical multiplexer function
receives from the transponder sub-system the colored optical channels
multiplexes them into a WDM signal
launches the WDM signal on the line.
The optical demultiplexer function
receives the WDM line signal
demultiplexes this signal
sends the recovered optical channels to the transponder sub-system.
The DWDM multiplexer/demultiplexer sub-system have a scalable architecture. By
combining three sorts of basic MUXes and three sorts of basic DMUXes, 4, 8, 12, 16,
24 and 32 channels, the multiplexing and demultiplexing capacities can be obtained.
The CWDM multiplexer/demultiplexer sub-system is based on a 8-channel
mux/demux.
Optical multiplexing
The multiplexer function may be obtained with the following optical MUXes:
5:1 and 9:1 DWDM MUXes:
This sort of optical MUX is able to multiplex 4 or 8 channels issued from the
transponder function with an extra input aggregate signal. The extra input may be
connected to the output of another MUX (MUX cascading), connected to the extra
output of a corresponding DMUX (traffic pass through) or simply not connected.
5 : 1
A g g r e g a t e s i g n a l o u t p u t
E x tr a i n p u t
A g g r e g a t e s i g n a l
( n c h a n n e l s )
4 C h a n n e l i n p u t s
4 c h a n n e l s
f r o m T P D
( n + 4 c h a n n e l s )
9 : 1
E x tr a i n p u t
8 c h a n n e l s
f r o m T P D
( n + 8 c h a n n e l s )

Figure 112113112: 4 and 8 channels DWDM optical MUXes

8:1 CWDM MUX:
This sort of optical MUX is able to multiplex 8 channels issued from the transponder
function.

8 c h a n n e l s
f r o m T P D
8 : 1
A g g r e g a t e s ig n a l o u t p u t A g g r e g a t e s i g n a l
( 8 c h a n n e l s )

Figure 113114113: 8 channels CWDM optical MUX

7:1 CWDM + DWDM MUX:
This sort of optical MUX is able to multiplex 6 CWDM channels issued from the
transponder function with an extra input aggregate signal. The extra input may be
connected to the output of a DWDM MUX (MUX cascading) able to mux up to 32
DWDM signals (L1, L2, S1, S2 bands).
7 : 1
6 c h a n n e l s
f r o m T P D
( u p t o 3 8 D W D M + C W D M
m i x e d c h a n n e l s )
E x tr a i n p u t
D W D M A g g r e g a t e s i g n a l
( u p t o 3 2 D W D M c h a n n e l s )

Figure 114115114: 7 channels C/DWDM optical MUX

2:1 expansion MUX:
This sort of optical MUX is able to multiplex 2 aggregate signals, one in the long
band and the other in the short band. It is necessary to reach the multiplexing capacity
of 24 and 32 channels and belongs to the OMDX8100_M_L1_XS and
OMDX8100_M_L1_X boards.
2 : 1 A g g r e g a t e s i g n a l o u t p u t
LB i nput
( n 1 c h a n n e l s )
( n 1 + n 2 c h a n n e l s )
S B i n p u t
( n 2 c h a n n e l s )
E X P

Figure 115116115: LB and SB aggregate signals expansion MUX

Optical demultiplexing
The demultiplexer function may be obtained with the following optical DMUXes:
1:5 and 1:9 DWDM DMUXes:
This sort of optical DMUX is able to demultiplex an input aggregate signal (n
channels) into 4 or 8 channels and an output aggregate signal (n-4 or n-8 channels).
The extra output may be connected to the input of another DMUX (DMUX
cascading), connected to the extra input of a MUX of the multiplexer function (traffic
pass through) or simply not connected.
1 : 5
A g g r e g a t e s i g n a l i n p u t
E x tr a o u tp u t
( n - 4 c h a n n e l s )
4 C h a n n e l o u t p u t s
4 c h a n n e l s
t o T P D
1 : 9
E x tr a o u tp u t
( n - 8 c h a n n e l s )
8 c h a n n e l s
t o T P D

Figure 116117116: 4 and 8 channels optical DMUX

1:8 CWDM DMUX:
This sort of optical DMUX is able to demultiplex an input aggregate signal (8
channels) into 8 channels/wavelengths sent to the transponder function.
8 C hannel o ut pu t s
8 c h a n n e l s
t o T P D
1 : 8
A g g r e g a t e s i g n a l i n p u t A g g r e g a t e s i g n a l

Figure 117118117: 8 channels CWDM optical DMUX

1:7 CWDM + DWDM DMUX:
This sort of optical DMUX is able to demultiplex an input aggregate signal (up to 38
x D/CWDM mixed channels) into 6 CWDM channels/wavelengths sent to the
transponder function and an output aggregate signal (up to 32 DWDM channels). The
extra output may be connected to the input of another DWDM DMUX (DMUX
cascading), able to dmux the DWDM signals (L1, L2, S1, S2 bands).

1 : 7
6 c h a n n e l s t o T P D
( u p t o 3 8 D W D M + C W D M
m i x e d c h a n n e l s )
E x tr a o u tp u t
D W D M A g g r e g a t e s i g n a l
( u p t o 3 2 D W D M c h a n n e l s )

Figure 118119118: 7 channels C/DWDM optical DMUX

1:2 expansion DMUX:
This sort of optical DMUX is able to demultiplex the DWDM line signal into two
aggregate signals, one in the long band and the other in the short band. It is necessary
to reach the demultiplexing capacity of 24 and 32 channels and belongs to the
OMDX8100_M_L1_XS and OMDX8100_M_L1_X boards.
1 : 2 A g g r e g a t e s i g n a l i n p u t
L B o u tp u t
( n 1 c h a n n e l s )
n 1 L B c h a n n e l s
n 2 S B c h a n n e l s
S B o u tp u t
( n 2 c h a n n e l s )
E X P

Figure 119120119: LB and SB aggregate signals expansion DMUX

Example of MUX and DMUX functions
Line Terminal configurations
In a 4 or 8 channels Line Terminal, multiplexing and demultiplexing are performed in
one step. The extra input of the MUX and the extra output of the DMUX are not
connected.
8 c h a n n e l s
t o W D M l i n e
8 c h a n n e l s
f r o m W D M l i n e
F r o m t r a n s p o n d e r
t r a n s m i t f u n c t i o n s
9 : 1
1 : 9
M U X f u n c t i o n
D M U X f u n c t i o n
T o t r a n s p o n d e r
r e c e i v e f u n c t i o n s
8
8
N C
N C

Figure 120121120: MUX and DMUX functions of an 8 channels Line Terminal

In a 12 or 16 channels Line Terminal, multiplexing and demultiplexing are performed
in two steps. The example of Figure 121 shows how to cascade 2 MUXes and 2
DMUXes to obtain a 12 channels Line Terminal.
The extra input of the first MUX is not connected. The 4-channels aggregate signal
output of the first MUX is connected to the extra input of the second MUX.
The extra output of the first DMUX is connected to the 4 channels aggregate signal
input of the second DMUX. The extra output of the second DMUX is not connected.
1 2 c h a n n e l s
t o W D M l i n e
1 2 c h a n n e l s
F r o m
t r a n s p o n d e r
t r a n s m i t
f u n c t i o n s
5 : 1
9 : 1
1 : 5
1 : 9
T o
r e c e i v e
f u n c t i o n s
8
4
4
8
4 c h a n n e ls
a g g r e g a t e
4 c h a n n e ls
a g g r e g a t e

Figure 121122121: MUX and DMUX functions of a 12 channels Line Terminal

In a 24 or 32 channels Line Terminal, multiplexing and demultiplexing are performed
in three steps. The example of Figure 122 shows how the 2:1 expansion MUX
multiplexes the 16 channels in long band and 16 channels in short band.

3 2 c h a n n e l s
t o W D M l i n e
3 2 c h a n n e l s
F r o m
t r a n s m i t
f u n c t i o n s
1 6 c h a n n e ls ( L B )
a g g r e g a t e
9 : 1
9 : 1
9 : 1
9 : 1
2 : 1
1 : 9
1 : 9
1 : 9
1 : 2
1 : 9
T o
r e c e i v e
f u n c t i o n s
8
8
8
8
8
8
8
8
E X P
E X P
8 c h a n n e ls
a g g r e g a t e
8 c h a n n e ls
a g g r e g a t e
1 6 c h a n n e ls ( L B )
a g g r e g a t e
1 6 c h a n n e l s ( S B )
a g g r e g a t e
8 c h a n n e ls
a g g r e g a t e
8 c h a n n e ls
a g g r e g a t e
1 6 c h a n n e l s ( S B )
a g g r e g a t e
O M D X _ L 1 _ X ( S )

Figure 122123122: MUX and DMUX functions of a 32 channels Line Terminal

In a 38 mixed (C/DWDM) channels Line Terminal, multiplexing and demultiplexing
are performed in four steps. The example of Figure 123 shows how the 7:1 C/DWDM
MUX multiplexes the 6 CWDM channels and the 32 DWDM channels (L1, L2, S1, S2
bands).
3 2 D W D M
c h a n n e l s
t o W D M l i n e
3 8 D / C W D M c h a n n e l s
F r o m
t r a n s m i t
f u n c t i o n s
1 6 c h a n n e ls ( L B )
a g g r e g a t e
9 : 1
9 : 1
8
8 c h a n n e ls
a g g r e g a t e
9 : 1
2 : 1
1 : 9
1 : 9
1 : 2
1 : 9
T o
r e c e i v e
f u n c t i o n s
8
8
8
8
8
E X P
E X P
1 6 c h a n n e ls ( L B )
a g g r e g a t e
1 6 c h a n n e l s ( S B )
a g g r e g a t e
8 c h a n n e ls
a g g r e g a t e
1 6 c h a n n e l s ( S B )
a g g r e g a t e
O M D X _ L 1 _ X ( S )
3 8 D / C W D M c h a n n e l s
6
6 C W D M
c h a n n e l s
7 : 1
1 : 7
3 2 D W D M
c h a n n e l s
6
6 C W D M
c h a n n e l s
1 : 9
8
8 c h a n n e ls
a g g r e g a t e
9 : 1
8
8 c h a n n e ls
a g g r e g a t e

Figure 123124123: MUX and DMUX functions of a 38 C/DWDM mixed channels
Line Terminal

OADM configurations
The example of Figure 124 is an 8-channels OADM. 8 channels are dropped and added
on both east and west lines. In this configuration, the extra output of each DMUX is
connected to the extra input of the MUX of the opposite transmission direction. This
allows to place the other 24 channels in pass through.

3 2 c h a n n e l s
t o W D M l i n e
2 4 c h a n n e l s a g g r e g a t e
p a s s t h r o u g h
9 : 1
1 : 9
M U X
D M U X
T o / f r o m
8
8
1 : 9
9 : 1
M U X
D M U X
2 4 c h a n n e l s a g g r e g a t e
p a s s t h r o u g h
8
8 c h a n n e ls
a d d e d
8 c h a n n e ls
d r o p p e d
8 c h a n n e ls
a d d e d
8 c h a n n e ls
d r o p p e d
3 2 c h a n n e l s
3 2 c h a n n e l s
t o W D M l i n e
T o / f r o m
3 2 c h a n n e l s
W e s t l i n e E a s t li n e

Figure 124125124: MUX and DMUX functions of an 8 channels OADM
The same configuration is available with 1, 2, 4 and 8-channels (n-channels). In this
case, the number of aggregate channels available in pass through is 32 - n.
The example of Figure 1265 is a 32-channels back-to-back terminal. In this
configuration, there is no pass through traffic, the 1696MSPAN is like a hub-node.
3 2 c h a n n e l s
t o W D M l i n e
F r o m / t o
t r a n s p o n d e r fu n c ti o n
9 : 1
M U X f u n c t io n
8
8
8
8
E X P
3 2 c h a n n e ls
9 : 1
9 : 1
9 : 1
2 : 1
3 2 c h a n n e l s
1 : 9
8
8
8
8
E X P
1 : 9
1 : 9
1 : 9
1 : 2
9 : 1
M U X f u n c t io n
9 : 1
9 : 1
9 : 1
2 : 1
1 : 9
E X P
1 : 9
1 : 9
1 : 9
1 : 2
8
8
8
8
8
8
8
8
3 2 c h a n n e l s
t o W D M l i n e
3 2 c h a n n e l s
3 2 c h a n n e ls
E X P
W e s t l i n e
E a s t li n e

Figure 125126125: MUX and DMUX functions of a 32 channels back-to-back
terminal

Remote channel to/from 1.
T P D
M u x
D m u x
O n e f i b r e
p a i r
T P D
M u x
D m u x
O F A O F A
n ( u p t o 3 2 )
W D M
l i n e
s i g n a l
W D M
l i n e
s i g n a l
n ( u p t o 3 2 )
O p t i o n a l
f u n c t i o n s
C l i e n t s i g n a l
T o / f r o m C P E
T P D
P a s s t h r o u g h
Remote channel

Figure 126127126: 1696MSPAN in back-to-back terminal configuration and with
a remote channel

Optical Fiber Amplification sub-system
The Optical Fiber Amplification (OFA) sub-system can deliver:
single or double stages amplification
VOA at the first stage entry
Up to 17 dBm output power.
As shown in Figure 1021 and Figure 1032 the 1696MSPAN may be equipped with one
or two OFAs (one OFA in west side and one in east side or two OFAs in west side and
two in east side) in line terminal and OADM/back-to-back configuration. In the
following example is shown a double stage amplification.
In a single stage amplification, the line terminal or OADM is placed inside the OFA
inter-stage (see Figure 26: OADM repeater (1 OAC west side + 1 OAC east side)
configurationFigure 27: OADM repeater (1 OAC west side + 1 OAC east side)

configuration as an example)
W D M
l i n e
O S C
e x t r a c t i o n
O S C
i n s e r ti o n
O F A 1
O F A 2
P u m p 1
P u m p 2
V O A
S t a g e 1 - P r e a m p .
S t a g e 2 - B o o s t e r
O F A 2
O F A 1
P u m p 2
P u m p 1
V O A
M U X
fu n c ti o n
S u p e r v i s i o n f u n c t i o n
L E G E N D :
O p t i o n a l
f u n c t i o n
A T T E N /
D C U
W E S T S I D E
( O M D X / O A D M )
A T T E N /
D C U

Figure 127128127: OFA sub-system in line terminal or OADM configuration
In repeater configuration, the 1696MSPAN is mainly a bidirectional optical amplifier.
W D M
l i n e
O S C
e x t r a c t i o n
O S C
i n s e r ti o n
O F A 1
O F A 2
P u m p 1
P u m p 2
V O A
O F A 2
O F A 1
P u m p 2
P u m p 1
O S C
e x t r a c t i o n
O S C
i n s e r ti o n
V O A
W D M
l i n e
S u p e r v i s i o n f u n c t i o n
L E G E N D :
O p t i o n a l
f u n c t i o n
W E S T S I D E E A S T S I D E
A T T E N /
D C U
A T T E N /
D C U

Figure 128129128: OFA sub-system in repeater configuration

Optical supervisory channel (OSC) sub-system
An optional channel named OSC is allocated to the transport of the supervision data.
The OSC allows the remote monitoring of the NE in a network and gives some order-
wires (data channel and voice channel) to the users.
The OSC channel is managed by the SPV management units (SPVM and OSC boards).
It is
inserted at the output of the terminal equipment (input of the WDM line),
regenerated in each OADM, back-to-back terminal or repeater,
dropped at the input of the terminal equipment (output of the WDM line).

WDM
terminal
WDM
terminal
OADM
OADM
O
M
X
O
D
X
OSC
O
D
X
OSC
O
M
X
SPVM
unit
OADM
OSC
OSC
OSC
OSC
SPVM
unit
OADM
OADM
SPVM
unit
OADM repeater
SPVM
unit
OSC
OSC
SPVM Unit
OSC
OSC
OADM
OADM
OADM repeater
OSC
OSC
SPVM
unit
In Line Repeater
SPVM
SPVM
1
1
1
1
1
1
2
2
2
2
2
2
SPVM
CPE
unit
unit
unit

Figure 129130129: OSC management in Line Terminal, OADM, OADM repeater
and In-Line-Repeater

In case of repeaters the SPV is inserted at the output of the NE: either in the amplifier
board or in the last mux board (Mux/demux or OADM). The optical interfaces are
located inside the SPV management units (SPVM and OSC).
More than one supervision board can be used in one shelf. A link from/to a Customer
Premises Equipment (CPE) carrying only one or two (1550 and/or 1310) data channels
can be inserted on any kind of 1696MS node (terminal or OADM).
OSC cabling engineering rules
SPVM board (1510 nm) is used with dense mux/demux and OAC. OSC board (1310
nm) is used with coarse mux/demux but, can also be used with OAC or dense OADM
by inserting/extracting OSC signal with F1310 board. In case of CPE, OSC channel
can be associated to a single channel, via a transponder

Automatic Power Equalization (APE) subsystem
Automatic Power Equalization (APE) is a function which allows the automatic
balancing of the optical spectrum at node output. The objective is to have a flat
spectrum in power per channel.
For all information related to automatic power equalization, refer to the commissioning
handbook.
Two kinds of boards are mandatory to perform APE :
OSMC : OSMC board is a embedded optical spectrum analyser. It can measure 8 different
spectra at 8 different points of the NE. Only one OSMC per NE is needed. It must be
optically connected to monitoring ports of the NE
MVAC : all loop, pass-through bands and external colored channels must be connected to
MVAC.
Before launching APE, the operator needs to perform some pre-settings.
Firstly, the operator must declare the cabling between :
MVAC & OADM or OMDX ports.
OSMC & monitored boards.
Then, the operator sets the OSMC configuration parameters :
Calibration factors : because OSMC is connected to board monitoring outputs, calibration of
the attenuation path beween real signal on the line and OSMC input is needed.
8 calibration factors are set (one per OSMC input).
Calibration can be performed manually or automatically.
Each OSMC input can be independently calibrated or not, in automatic or manual
mode.
Optical LOS threshold : OSMC board detects two kinds of LOS of signals :
- Total LOS on input #i : Total LOS is raised on input #i if :
Maximum channel power of input #i < Total LOS threshold of input #i
- Relative LOS on channel x of input #i : relative LOS on channel x of input #i is
raised if :
Maximum channel power of input #i - channel power x > Relative LOS threshold
These thresholds are configurable by the operator

Finally, the operator must load APE parameters :
Installation or Upgrade
Direction to equalize
Interstage attenuation and maximum number of iterations in case of an OADM repeater.

When the operator launches the equalization, the NE asks for some spectrum
acquisitions to the OSMC. Spectrum data are sent from OSMC to the NE. The NE
calculates required MVAC and transponders attenuations so to have a flat spectrum at
node output. The process can be iterative in case of an OADM repeater.
When the output tilt is optimized, resulting spectrum and tilt at node output are
displayed.
1 2
D
E
M
U
X
M
U
X
MVAC
MVAC
M
V
A
C
OSMC

Figure 130131130: Automatic Power Equalization

APE is stopped if RUM, RUP, RUTM are raised, in case of communication problem or
if maximum number of iterations is reached.
Controller sub-system
See Figure 1321 and Figure 1332. The controller sub-system is based on a two levels
model:

Shelf Controller (SC)
Equipment Controller (EC)

In current release the ESC (Equipment and Shelf Controller) is the hardware platform
designed to support the Equipment Controller (EC) functions and the Shelf Controller
(SC) functions.
The Equipment Shelf Controller (ESC) board provides both features or only one (as
needed).
It performs both EC and SC when it is located in slot 1 of the Master shelf and only the
SC functionality when it is plugged in slot 1 of an expansion shelf.
The Flash memory of the ESC board must be plugged on its socket and
in the correct sense. In this case, it is plugged easily without constraint.
On the wrong sense the Flash memory cannot be plugged. Then invert the
side to be plugged and try again. Furthermore that flash card must not be
installed in a ESC used in Expansion shelf.
The Control Platform is also provided by the ESC board for the 1696MS_C.
Shelf Controller function
SC provides the resources to support the SW functions related to the physical machine
control and management and configuration provisioning.
In a shelf all the boards are connected to the ESC unit via the SPI bus. By means of the
SPI bus, the processor of the ESC, can collect the control information of the boards
(e.g.: alarms collection, remote inventory and data EEPROM reading).
Equipment Controller function
The EC supports the Q3 agent and the VHM (Virtual Hardware Machine).
It provides the HW resources (physical interfaces) and the SW functionalities (protocol
stack) required for the communication between NE and Management system (OS, craft
terminal, etc).
It performs as well all the SW functions related to the control and management
activities of the virtual (logical) machine: info-model processing, event reporting and
logging, equipment data base management, SW downloading and management, etc.
Control bus
The SPI bus allows:
- connection between SC and boards for configuration data provisioning
- remote inventory data acquisition
- data collection ( alarms ) and commands handling (ex. loops)
The SC processor is master of this bus.
The IS-LINK (10 Mb/s) is used to realize the communication between the EC in the
master shelf and the SC in the expansion shelves.
The ISSB bus (not used in current release) connects the Shelf Controllers processor to
the ASICs and FPGAs of the different boards in the same shelf. It is used for OCh-OH
management and to carry primitives for OCC10 performance monitoring. It is
terminated in the PSC.
The Intershelf Link (I-LINK) (10 Mb/s) is used in 1696MS_C system only allowing
to connect the SPI bus and the Card presence signals from the slave shelves to the ESC
board, only provided in master shelf.
External interfaces toward Craft Terminal, OS...
F interface : available from the EC function for connection to a local Craft Terminal;
the electrical interface and connector are provided by the ESC card.
The standard implementation of the physical layer for the F interface consists of an
RS-232 UART port accessible from the ESC card front panel.
QECC Interface: it is a TMN related communication interface based on the use of the
Embedded Communication Channels available in the Optical Supervisory Channel
(DCC). Through the QECC interface the equipment can exchange management
messages with a remote OS.
QAUX interface: it is provided as an additional TMN communication interface for
message exchange between the NE and a Remote OS station based on the use of a 2
Mbit/s proprietary protocol.
Q3/TL1 interface: it is dedicated to an OS station connection. LAN_Q supports Q3
connection to a WAN or LAN respectively. The physical interfaces are provided by
the LAN_Q card.
RE / HK interface: this interface consists of parallel I/O signals used for remote
alarms and for housekeeping signals. The relevant electrical interfaces are placed on
the HK card, and are controlled by the EC function through parallel I/O ports.
RA interface: it is dedicated to send commands toward the rack to light up the relevant
lamps.


Flash backup and Smart Boot
The flash backup capability permits the management system to copy files back and
forth using an ftp service, between the flash card on the ESC in slot 1 and the ESC in
slot 24 of the master shelf.
MASTER SHELF
Rack leds
Housekeeping
Alarms
SC
OPERATION
SYSTEM
SPVM
F
Local
Craft Terminal
Q3/TL1
Remote/
RA
EC
SC
FLASH
CARD
IS-LINK
To all
boards in
the shelf
SLAVE SHELF
ESC BOARD
ESC BOARD
SPI
REMOTE
OPERATION
SYSTEM
Q
E
C
C
EXTERNAL INTF
UIC
Q
A
U
X
To all
boards
in the shelf
SPI
RE/HK
EXTERNAL INTERFACES
RAI HK LAN_Q
/
OSC

Figure 131132131: Controller sub-system

Example of control interfaces scheme

M
V
A
C
W
L
A
2
/
W
L
A
3
M
C
C
/
O
C
C
1
0
E
S
C
L A N
L A N
H K
R A I
E 1 / E 2
F 1
N U
2 x 2 M b p s
U
I
C
Q 3 / T L 1
I S - L I N K
H K / R E
R A
S P I - A
S P I - B
S P V c h a n n e l ( o p t i c a l )
P S C P S C
P o w e r S u p p l y A
P o w e r S u p p l y B
I S P B ( n o t u s e d i n c u r r e n t r e l e a s e )
P D U / T R U
M A S T E R S H E L F
M
V
A
C
E
S
C
L A N
R A I
I S - L I N K
R A
S P I - A
S P I - B
P S C P S C
E X P A N S I O N S H E L F
E C
S C
Q E C C
R e m o t e / H K A l a r m s
R a c k L e d s
F I N T E R F A C E
L o c a l C r a f t
T e r m i n a l
Q A U X i n t f ( R E M O T E O S )
( O P E R A T I O N S Y S T E M )
O
S
M
C
O
S
M
C
W
L
A
O
M
S
P
O
M
S
P
O
M
D
X
/
O
A
D
M
/
C
( D )
M
D
X
/
C
O
A
D
* O S C b o a r d i s a b l e t o p r o v i d e o n l y t h e 2 M b p s s u p e r v i s o r y c h a n n e l
O
M
D
X
/
O
A
D
M
/
C
( D )
M
D
X
/
C
O
A
D
O
M
D
X
/
O
A
D
M
/
C
( D )
M
D
X
/
C
O
A
D
O
M
D
X
/
O
A
D
M
/
C
( D )
M
D
X
/
C
O
A
D
S
P
V
M
/
O
S
C *
4
x
A
N
Y
/
2
x
G
E
F
C
/
8
x
G
E
M
C
C
/
O
C
C
1
0
4
x
A
N
Y
/
2
x
G
E
F
C
/
8
x
G
E

Figure 132133132: Example of control interfaces scheme in 1696MSPAN

W
L
A
E
S
C
S
P
V
M
/
O
S
C *
L A N
L A N
H K
R A I
A u d i o
Q 3 / T L 1
I S - L I N K
H K / R E
R A
S P I - A
S P V c h a n n e l ( o p t i c a l )
P S C / 2 P S C / 2
P D U / T R U
M A S T E R C O M P A C T S H E L F
S P I - A
I
L
I
N
K
_
S
P S C 2 P S C 2
E X P A N S I O N C O M P A C T S H E L F
E C
S C
Q E C C
R e m o t e / H K A l a r m s
R a c k L e d s
F I N T E R F A C E
L o c a l C r a f t
T e r m i n a l
( O P E R A T I O N S Y S T E M ) I
L
I
N
K
_
M
O
M
S
P
W
L
A
O
M
S
P
* O S C b o a r d i s a b l e t o p r o v i d e o n l y t h e 2 M b p s s u p e r v i s o r y c h a n n e l
O
M
D
X
/ O
A
D
M
/
C
( D )
M
D
X
/
C
O
A
D
O
M
D
X
/ O
A
D
M
/
C
( D )
M
D
X
/
C
O
A
D
M
C
C
/
O
C
C
1
0
4
x
A
N
Y
/
2
x
G
E
F
C
/
8
x
G
E
M
C
C
/
O
C
C
1
0
4
x
A
N
Y
/
2
x
G
E
F
C
/
8
x
G
E

Figure 133134133: Example of control interfaces scheme in 1696MS_C

Power supply sub-system
The powering architecture is distributed: two Power Supply Cards are in charge of
feeding all the other cards hosted in the shelf by selecting the highest voltage supplied
by the two station batteries.
Power Supply Cards are fit in
slot 25 and slot 48 in 1696MS
slot 7 and 12 in 1696MS_C.
The main purposes are:
Supply and distribute 48V filtered and protected voltage to all the boards housed in the shelf
of the 1696MSPAN/1696MS_C equipment
Supply and distribute +3V service voltage dedicated to SPIDER circuitry in all the boards
Supply and distribute +5V auxiliary voltage
Make a bus termination
Give alarms on fault battery and voltages loss.
The PSC boards work in 1 + 1 protection; this means that (as concerning 48V) only
one PSC may be active at once. This circuit select the battery more charged and protect
against reverse voltage applied.
Figure 1354 shows the equipment power supply scheme housed on the two PSC.
Input power stage
It provides adaptation to the customer central power bus by a main power block and
supplies all the SPIDER FPGA by means of an on-board converter.
Main power block
It is used to select the input voltage of the system and to supply a surge protection.
It contains an EMI filter to permit the equipment to be reliable in presence of external
EMI interferences and to limit the internally generated EMI.
The voltages coming from the two station batteries, are applied to PSC A and to PSC B
respectively by means of the power connector located on the unit front panel ( ex.
+BATT A -BATT A to PSC A and +BATT B -BATT B to PSC B).
The +Batt can be connected to a mechanical ground through a strap setting.
Moreover each PSC receives from the back panel connector the -BATT voltage
coming from the other station battery (i.e. -BATT B to PSC A and -BATT A to PSC
B).
Each PSC can therefore select which of the two station batteries provides the highest
supply.
The selected voltages are ORed and sent to the equipment cards.
Protection Circuit
The protection circuit is present in the PSC and in all the boards where a DC/DC
converter is required i.e. input stage and distributed power stages. It is an interface
between +BATT -BATT and the DC/DC converter.
It provides the following functions:
it insulated the DC/DC converter in case of input short circuit. Fuses are fitted in order to
prevent a failed unit from shortening the input bus. In fact a input short circuit failure can
cause severe fluctuations on the input power of the other DC/DC converters
it implements a start-up and an inrush current limiting system in order to provide controlled
charge-up for the input hold-up capacitor and therefore it prevents a current surge at the
module input when the board is plugged in
it insulated the DC/DC converter in case of input voltage lower than 33 V.
On board power supply
A DC/DC converter generates a +3.3 V voltage used to power the SPIDER FPGA.
Distributed power stage
All the boards receive the +3.6 V and the 5.5 V voltage to power the FPGA device
located on each card. Moreover, some boards receive the +BATT -BATT voltages
generated by the input stage of the PSC.
Normal service range
The normal input voltage range of the power supply module is either:
- 40,5 V t - 48 V t - 57,0 V or
- 50,0 V t - 60 V t - 72,0 V.
Abnormal service range
The 1696MSPAN equipment operating at -48 V does not suffer any damage when
subjected to the following voltage range : 0 V to -40,5 V and -57 V to -60 V.
When the equipment operates at -60 V, the voltage range becomes: 0 V to -50 V and -
72 V to -75 V.
Protection to the station power supply is provided by 16A circuit breakers at the top of
the S9 rack.

The maximum power consumption of the main rack is about 400 Watts.
DC/DC Power supply units output voltages + 3.6 V ? 3%
- 5.5 V ? 3%
+ 2.5 V ? 3%
+Batt_A
-Batt_A
+Batt_B
-Batt_B
SPIDER
FPGA
PSC A
PSC B
GND
GND
* protection
* pre-filter
* fuse
* protection
* pre-filter
* fuse
+Batt
-Batt
* OR Batt
* EMI/EMC
filter
* OR Batt
* EMI/EMC
filter
+Batt
-Batt
dual DC/DC
* softstart
* EMI/EMC
filter
* threshold
* softstart
* EMI/EMC
filter
* threshold
converter
dual DC/DC
converter
3.6V
5.5V
3.6V
5.5V
* softstart
* EMI/EMC
filter
* threshold
OBPS
3.6V
5.5V
2.5V
OR
OR auxilliary
power supply
GENERIC BOARD
DISTRIBUTED POWER STAGE
PRIMARY POWER STAGE

Figure 134135134: 1696MSPAN - equipment power supply scheme

Protection sub-system
The protection type used is Optical SNCP (network protection).
In a ring network the Sub-Network Connection Protection (SNCP) at optical channel
level can be provided either in back-to-back terminals or in OADM configuration.
The transponders (MCC/OCC10/4xANY_P/2xGE_FC/TRBD1996) are duplicated for
each protected channel (also WLA2M_OP and WLA3CDOP provide O_SNCP, but
they are not duplicated because they carry one optically protected channel). At the
transmit side, the signal is broadcasted on the two arms of the ring. At the receive side
one of the two available signals is selected. When a failure occurs on the working path,
the system switches on the signal of the protecting path.
O A D M
C l i e n t e n d t r a f f i c
C l i e n t A d d & d r o p t r a f f i c
C l i e n t
A d d & d r o p
t r a f f i c
O A D M O A D M
C l i e n t
A d d & d r o p
t r a f f i c
B a c k - t o - b a c k
t e r m i n a l
T ra n s m it s id e :
c l i e n t s i g n a l s a r e s p l i t
a n d la u n c h e d o n t h e
t w o a rm s o f t h e rin g
R e c e iv e s id e :
in c a s e o f a f a ilu re in o n e a rm
o f t h e rin g t h e s y s t e m s e le c t
t h e s ig n a l o f t h e o t h e r o n e

Figure 135136135: Channel level protection in a ring network

The Optical SNCP (O-SNCP) is ensured for each client signal by 2 optical splitters,
located between the client interface and the transponder cards:
At the transmit side, each client signal is split by a 50/50 optical splitter and sent to two
transponder cards. Then, one signal is broadcasted to one arm of the ring and the other signal
is broadcasted to the other arm.
At the receive side, each WDM signal comes from one arm of the ring to one transponder
card. At the User Tx interface, one transponder card is in working mode (laser ON) and the
other is in protecting mode (laser OFF). When a fault is detected on the working path, the
protection switching is performed by turning off the working User Tx laser and by re-
activating the protecting one.
O p t i c a l s p l i t ti n g
W o r k i n g :
l a s e r O N
P r o te c ti n g :
l a s e r O F F
D M U X
M U X
W D M l i n e
( E a s t )
M U X
D M U X
W D M l i n e
( W e s t )
1 6 9 6 M S P A N
W D M T x W D M R x
W D M T x W D M R x
W e s t
E a s t
O p t i c a l c o u p l i n g

Figure 136137136: O-SNCP principle
In the following are shown the Optical SNCP types provided by the equipment. They
are
MCC protection (alone and MCC + 4xANY)
OCC10 protection
TRBD1996 protection
4xANY client signals protection
MCC + 2xGE_FC protection
WLA_OP + 2xGE_FC protection
2xGE_FC client protection
8xGE client protection
WLA protection
OTS protection


MCC protection

Table 6.4 MCC protection: switching criteria
Alarm Managed Default status
HWF X always enabled
C_ABS X
C_TYPE X
ILOS_WDM X
LOC_user / LOC_User_Tx X
C_ABS_SFP X
C_TYPE_SFP X
SIGNAL_DEGRADE X

When a MCC detects one of the above criteria, the transmitter is shut-down.
MCC3 alone

Rx
Tx
WDMTx
WDMRx
MCC West MCC East
8 x 8
Matrix
8 x 8
Matrix
Rx
Tx
WDMTx
WDMRx

Figure 137138137: Optical SNCP with MCC3 unit

The function is provided by two optical splitters. The selection is done by switching-
off the user Tx corresponding to the path in failure and re-activating the protecting one.
MCC + 4xANY

WDMRx
WDMTx
Tx Rx
WDMTx
WDMRx
Tx Rx
OPC
Tx Rx
Rx Rx Rx Rx
Tx Tx Tx Tx
4xANY
MCC MCC

Figure 138139138: Optical SNCP of the MCC associated with the 4xANY (MCC-
4xANY)

The function is ensured by two optical splitters (one OPC card). The selection is done
by switching-off the MCC user Tx corresponding to the path in failure and re-activing
the protecting one.
OCC10 protection
Rx
Tx
Rx
Tx
WDMTx
WDMRx
OCC10 West OCC10 East
8 x 8
Matrix
8 x 8
Matrix
WDMTx
WDMRx

Figure 139140139: Optical SNCP with OCC10 unit

by switching-off the user Tx corresponding to the path in failure and re-activing the
protecting one.

Table 6.5 OCC10 protection: switching criteria
Alarm Managed Status
C_ABS X
C_TYPE X
LOS_WDM_Rx (or LOC_OTN_WDM_Rx) X

LOF_OTN_WDM_Rx X
XFP_unplugged (OCC10_E only) X
When an OCC10 detects one of the above criteria then the transmitter is shut-down.

TRBD1996 protection

Figure 140: Optical SNCP of the TRBD1996

The function is ensured by two optical splitters. The selection is done by switching-off
the TRBD1996 user Tx corresponding to the path in failure and re-activing the
protecting one.

Table 6.6 TRBD1996 protection: switching criteria

When a TRBD1996 detects one of the above criteria then the transmitter is shut-down

Protection of the 4xANY client
Protection can be performed optically on the 4xANY units.

WDMRx
WDMTx
Tx Rx
WDMTx
WDMRx
Tx Rx
OPC
MCC MCC
Tx Rx
Rx Rx Rx Rx
Tx Tx Tx Tx
4xANY
Tx Rx
Rx Rx Rx Rx
Tx Tx Tx Tx
4xANY
LF Link
OPC OPC OPC

Figure 140141140: Optical SNCP of the MCC associated with the 4xANY (4xANY
client protection)

The function is ensured by eight optical splitters (provided by four OPCs). The
selection is done by switching-off the 4xANY user Tx corresponding to the path in
failure and re-activing the protecting one.
The clients are individually protected: if one is protected, it is not necessary to protect
the other ones.
In 1696MS, when two 4xANY are used in client protection configuration, the 4xANY
on the right side always contains the MAIN/protected drawers, and the 4xANY on the
left side, the SPARE/protecting drawers.
In 1696MS_C, when two 4xANY are used in client protection configuration, the
4xANY above (slots 4 and 5) always contains the MAIN/protected drawers, and the
4xANY below (slots 2 and 3), the SPARE/protecting drawers.
The slot allocation of the OPC according to the drawers in protection of the 4xANY
clients is fixed as described in Figure 1421.
N.B. In some configurations, the OPC slot cannot be provided by an OPC board
because this is already allocated by other boards. This concerns LAN, HK and RAI
boards. This can limit the number of protected clients.
N.B. In case the two 4xANY_P are provided with coloured SFPs (CWDM or
DWDM), transponders are not required.
D
R
A
W
E
R

#
2
D
R
A
W
E
R

#
1
D
R
A
W
E
R

#
4
D
R
A
W
E
R

#
3
D
R
A
W
E
R

#
2
D
R
A
W
E
R

#
1
D
R
A
W
E
R

#
4
D
R
A
W
E
R

#
3
O
P
C

#
2
O
P
C

#
1
O
P
C

#
3
O
P
C

#
4

Figure 141142141: Correspondance between OPC slots allocation and 4xANY
drawers in protection

OPC location for drawers protection

drawer 1: 31, 35, 39, 43
drawer 2: 30, 34, 38, 42
drawer 3: 28, 32, 40, 44
drawer 4: 29, 33, 41, 45.
The 4xANY boards in slot 2-3 and 22-23 cannot be protected.

E
S
C
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
U
I
U
I
H
K
R
A
FANS
49
I
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C

Table 6.6 4xANY client protection: switching criteria per each drawer
Link_Failure_DRW_U X
C_ABS X
C_ABS_DRW_U X
C_TYPE_DRW_U X
SSF_U X
Pk_AIS_U X

MCC + 2xGE_FC
WDMRx
WDMTx
Tx Rx
WDMTx
WDMRx
Tx Rx
MCC MCC
OPC
Tx Rx
Rx Rx
Tx Tx
2xGE_FC

Figure 142143142: Optical SNCP of the MCC associated with the 2xGE_FC

by switching-off the MCC user Tx corresponding to the path in failure and re-activing
the protecting one.

WLA_OP + 2xGE_FC
WDMRx
WDMTx
Tx Rx
WDMTx
WDMRx
Tx Rx
OPC
Tx Rx
Rx Rx
Tx Tx
2xGE_FC
WLA_OP

Figure 143144143: Optical SNCP of the WLA_OP associated with the 2xGE_FC

by switching-off the transponder user Tx corresponding to the path in failure and re-
activing the protecting one.
Protection of the 2xGE_FC client
Protection can be performed only on 2xGE_FC units.
WDMRx
WDMTx
Tx Rx
WDMTx
WDMRx
Tx Rx
OPC
Tx Rx
Rx Rx
Tx Tx
2xGE_FC
MCC MCC
Tx Rx
Rx Rx
Tx Tx
2xGE_FC
OPC
LF link

Figure 144145144: Optical SNCP of the MCC associated with the 2xGE_FC

The function is ensured by four optical splitters (two OPC cards). The selection is done
by switching-off the 2xGE_FC user Tx corresponding to the path in failure and re-
activing the protecting one.
Clients are individually protected: if one is protected, it is not necessary to protect the
other ones.
When two 2xGE_FC are used in client protection configuration, the 2xGE_FC on the
left side always contains the SFP MAIN (or protected), and the 2xGE_FC on the right
side, the SFP SPARE (or protecting).
The slot allocation of the OPC according to the SFP in protection of the 2xGE_FC
clients is fixed as follows:
the 2xGE_FC boards are provisioned in slots #n and #n+1
in 1696MSPAN:
- client #1 is protected using OPC in slot #n+25 (on the right side)

- client #2 is protected using OPC in slot #n+24 (on the left side)
in 1696MS_C
- client #1 is protected using OPC in slot #n+7 (on the right side)
- client #2 is protected using OPC in slot #n+6 (on the left side)
For 1696MS_C only, in Master shelf only, client #2 cannot be protected when
2xGE_FC boards are provisioned in slots #2 and #3 (the LAN_Q mandatory board
occupying the slot of the required OPC)
N.B. In case the Line interface of the two 2xGE_FC boards are provided with
coloured SFPs (CWDM or DWDM), transponders are not required.

Table 6.7 2xGE_FC client protection: switch criteria for each drawer
C_ABS X
C_ABS_SFP_U (U=1, 2, 6) X
ILOS_SFP_6 X
RS_LOF X
MS_AIS X
GFP_CSF_U (U=1,2) X
GFP_SSF_U (U=1,2) X FUTURE REL.
SIGNAL_DEGRADE_6 X always enabled

Protection of the 8xGE client
G b E # 1
G b E # 2
G b E # 3
G b E # 4
G b E # 5
G b E # 6
G b E # 7
G b E # 8
L I N E # 1
L I N E # 2
O M S P
O M S P
O M S P
O M S P
O M S P
O M S P
O M S P
O M S P
G b E # 1
G b E # 2
G b E # 3
G b E # 4
G b E # 5
G b E # 6
G b E # 7
G b E # 8
L I N E # 1
L I N E # 2
8 x G E
8 x G E

Figure 145146145: Optical SNCP with 8xGE

The function is ensured by eight OMSP cards, in point-to-point configurations only.
OMSP is a small board containing an optical splitter and an optical switch, able to
select an incoming signal among two.
On the transmission side, with the optical splitter, the signal output is broadcasted on
the main/working fiber and the spare/protecting fiber to the two GbE SFPs clients of
the 8xGE units.
On the receiver side, the optical switch selects to receive the optical signal coming
from the main/working GbE SFP and the spare/protecting GbE SFP under the control
of a board logic. The optical signal coming out from the optical switch is sent to the
client.
When two 8xGE are used in client protection configuration, the 8xGE on the right side
always contains the SFP MAIN (or protected), and the 8xGE on the left side, the SFP
SPARE (or protecting).
Switch criteria.

Both the incoming signals powers are measured thanks to a 95/5 coupler and a
photodiode enabling
to raise a LOS alarm if the actually selected signal power falls
to know if the spare signal (the incoming signal not selected) is present.
If a LOS appears on the main signal and the spare signal is present, the board switches
to the spare signal.
WLA protection
The optical protection is provided by the WLA2M_OP and WLA3CDOP boards
(WLA1C_OP will be provided in future rel.).
As they are 2-channel boards, one channel is protected by the other one.
The available protection scheme is O-SNCP.
In Tx direction (from client to WDM) the signal is transmitted on the two paths by
means of the optical splitter, while in Rx (from WDM to client) only one signal is sent
to the client by the optical coupler, being active only one transponder (the other one is
OFF).
WDMTx
WDMRx
B&W Rx B&W Tx
1:1
optical
splitter
1:1
optical
coupler
WDMTx
WDMRx
B&W Rx B&W Tx
MAIN SPARE
EAST WEST
WLA2M_OP
WLA3CDOP

Figure 146147146: O-SNCP with WLA units (WLA2M_OP/WLA3CDOP)


Table 6.8 WLA2M_OP and WLA3CDOP protection: switch criteria
Alarm Managed by
ILOS_SFP_X (X=Line ports, X=2 or 4,
corresponding to W1, W2 ports on WLA
front panel
WLA2M_OP, WLA3CDOP
SFP_ABS_X (X=1 to 4, all clients and Line ports) WLA3CDOP
LOC_PORT_U (U=2 and 4) (loss of modulation
or bitrate mismatch)
WLA3CDOP
SIGNAL_DEGRADE_U (U=2 and 4) WLA3CDOP

1354 RM: configuration of the WLA3CDOP
Refer to Figure 1487. In the above example, a protected path is created between NE1
and NE2, using WLA3CDOP cards NE3 provides an optical channel passthrough.
The physical connections indicated in pink are the connections to be created for path
discovery (Note that a physical connection need to be created for an optical channel
passthrough but it is done automatically in case of optical band passthrough).
The physical connections are all of the OPS-type except those related to SDH (port 5)
(SDH/WDM interworking).
For the physical connections related to ports 2 and 4, it is needed to select the mux
ports corresponding to the same wavelength.
Compared to the protected path creation for an OCC10 or a MCC, an additional
operation is needed when creating a protected path with a WLA3CDOP: it is necessary
to create the physical connections between the DWDM SFPs and the corresponding
mux/demux ports.


Figure 147148147: Example of a 1696 MS network with path protection using
WLA3CDOP cards

OTS protection
OTSP protects the fiber in point-to-point links.
All the multiplexed signal is protected: if one or some channels fail, there is no switch
in OMSP board.
If there is a fiber break on the MAIN path, all the multiplexed signal is lost, then the
board switches.
There is no switch in case of HWF, because if HWF occurs on OMSP board, it will not
be able to switch.
M
u
x
D
e
m
u
x
M
u
x
D
e
m
u
x
S u b - N e t w o r k
O M S P O M S P
N E A N E B

Figure 148149148: TS protection with OMSP unit

Table 6.9 OTS protection: switch criteria
ILOS on MAIN path and NO ILOS on SPARE
path
X always enabled
1354 RM: ACCESS to O-MSP commands when 1354 RM is present
1. Identify USM handling the 1696MSPAN, i.e. USMSH5Q3WDMVxx
2. Go to /usr/Systems/1353NM_**/eml/usmsh5q3wdmvxx/conf/ directory
3. Edit param.cfg file
4. Search SECURITY_ENABLED parameter and set it to False
5. Close all related open USMs in the machine
6. Open USM again on the target NE(s)
the USM now behaves as we were in NM only configuration for this USM type
only.
We have now access to Protection commands in cross connection menu.
7. After the operations on OMSP set back the SECURITY_ENABLED parameter.

Performance Monitoring sub-system
Performance Monitoring is a function which provides the operator with the ability to
constantly monitor the quality of the signal flowing through his WDM network. This
function is available at selected Performance Monitoring Points, it is performed
through an accumulation of information during fixed time windows (granularity
periods: 15min or 24h) and it provides consistent information to the management
interface (end-to-end monitoring).
When PM is activated, for each PM Point, the following processes are automatically
performed
Continous monitoring by transmission boards of the quality of the signal flowing through the
PM Point and generation of raw PM information, known as 1s PM primitives (1s stands for 1
second)
Correlation between 1s PM primitives by the system, with periodic collection of 1s PM
primitives and accumulation of corresponding PM counters (PM events) during the current
monitoring period.
N.B. PM primitives are raw information, internally used, but not made available at
NMS; PM counters are the significant values resulting of correlations between PM
primitives. These values are made available to the NMS.
Generation of PM current data related to the current monitoring period (15min / 24h), based
on PM counters accumulated during the current monitoring period
Comparison of PM counters of the current monitoring period with related PM Threshold
profile (TCA)
Generation of PM history data, with storing of PM information related to past 15min / 24h
periods
From the management interface, it is possible to manage PM data (clear PM counters,
activate or deactivate Performance Monitoring...) and PM Thresholds (profile
assignment/modification...).The latters are used to generate Threshold Crossed Alarms
(TCA).
Performance Monitoring Points on transmission boards
PM Points are characterized by the following parameters:
monitored side, which can be:
- Egress if monitoring is performed on information received from WDM side (WDM
--> BW)
- Ingress if monitoring is performed on information received from B&W side (B&W
--> WDM)
monitored end, which can be:
- Near End if monitoring is related to the quality of the received signal
monitored layer, which can be:
- on MCC3 and 4xANY_P
SDH (STM1/STM-4/STM-16) based on information (B1 byte) contained in
SDH Regenerator Section overhead and specific ETSI processing, both on
client and line sides
ETH1G (Layer 1 1 GbE/FC PM), based on 8B/10B coding, client side
- on OCC10_E, OCC10_EC
SDH10G based on information (B1 byte) contained in SDH Regenerator
Section 10G overhead and specific ETSI processing, both on client and line
sides
ETH10G (Layer 1 10GbE PM), based on 64B/66B coding, client side
- on WLA2 and WLA3
SDH (STM1/STM-4/STM-16) based on information (B1 byte) contained in
SDH Regenerator Section overhead and specific ETSI processing, both on
client and line sides
ETH1G (Layer 1 1 GbE/FC PM), based on 8B/10B coding, both on client and
line sides, WLA3 only.
- on 2xGE_FC
SDH 2.5G based on information (B1 byte) contained in SDH Regenerator
Section 2.5G overhead and specific ETSI processing, line side
ETH1G (Layer 1 1 GbE/FC PM), based on 8B/10B coding, client side
- on 8xGE
SDH 10G based on information (B1 byte) contained in SDH Regenerator
Section 10G overhead and specific ETSI processing, line side
ETH1G (Layer 1 1 GbE/FC PM), based on 8B/10B coding, client side.
- on TRBD1996
SDH 10G based on information (B1 byte) contained in SDH Regenerator
Section 10G overhead and specific ETSI processing on side side
FEC PM on line side



For each PM Point it is possible to activate monitoring with 15min or 24h (or both at
the same time) granularity. The following table summarizes the combination of
monitored side/end/layer, supported in current release.

Table 6.10 Boards and supported Performance Monitoring Points
PM Point 1696MSPAN BOARD
Near end egress B1 PM at 10 Gbps (STM-64) OCC10, 8xGE
Near end ingress B1 PM at 10 Gbps (STM-64) OCC10
Near end egress Layer 1 10 GbE PM OCC10 (LAN)
Near end ingress Layer 1 10 GbE PM OCC10 (LAN)
Near end egress B1 PM at 2.5 Gbps (STM-16) WLA2, WLA3, MCC3, 4xANY_P,
2xGE_FC
Near end ingress B1 PM at 2.5 Gbps (STM-16) WLA2, WLA3, MCC3
Near end egress B1 PM STM-4 WLA2, WLA3, MCC3
Near end ingress B1 PM STM-4 WLA2, WLA3, MCC3
Near end egress B1 PM STM-1 WLA2, WLA3, MCC3
Near end ingress B1 PM STM-1 WLA2, WLA3, MCC3
Near end ingress Layer 1 GbE PM 2xGE_FC, 8xGE
Near end egress FEC PM at 10Gbps (STM-64) TRBD1996
Near end ingress B1 PM at 10Gbps (STM-64) TRBD1996
PM working mode
The Performance Monitoring sub-system performs the end-to-end quality-of-service
monitoring of each individual wavelength, all along its path. Performance monitoring
is available:
Clent side, at the User Rx access in order to monitor the client incoming (near end) signal; in
this case
-for OCC10, MCC3, WLA2, WLA3, 4xANY_P: PM (SDH type) is based on B1 and
J0 n.i.m. and Treshold Crossing Alarm based on B1 errors count (J0 non intrusive
monitoring in future release)

-for 2xGE_FC and 8xGE: PM (GbE type) is based on Layer 1 counters (8B/10B)
-for OCC10 (10 GbE LAN only): PM (10 GbE type) is based on Layer 1 counters
(64B/66B)
Line/WDM side, at the Rx access in order to monitor the incoming (near end) signal and its
transmission through the WDM network; in this case PM and Treshold Crossing Alarm are
based on
-for OCC_10, MCC3, WLA2, WLA3, 4xANY_P, 2xGE_FC and 8xGE: PM (SDH
type) is based on B1 and J0 n.i.m. and Treshold Crossing Alarm based on B1 errors
count (J0 non intrusive monitoring in future release)
It is possible to manage up to 32 PM per NE.
MCC3 is able to perform the B1 monitoring either at client Rx side or at WDM Rx
side and simultaneously.
Egress B1 PM (SDH)
WDM
WDM
WDM
User
TX
PM on ingress client
RX TX
RX
User WDM
TX
WDM
RX
User
RX
TX
User
1696MSPAN 1696MSPAN
CLIENT
EQUIPMENT
CLIENT
EQUIPMENT
signal (B1)

Figure 149: Two possible monitored sections by the MCC

OCC10 is able to provide: PM after WDM Rx signal or PM before the WDM Tx.
In OCC units, B1 monitoring is performed at WDM side.
B1 PM or 64B/66B (PM Ethernet layer 1), according to the client, are available on
client side.

Figure 150: 2 possible monitored sections with the OCC

According to the configuration of the 4xANY_P board (remote or not), three kinds of
monitoring is foreseen. B1 is inserted at the 4xANY Tx side. It can be extracted either
at the MCC B&W Rx side, or at the MCC WDM Rx side or at the 4xANY 2.5G Rx
side.

Figure 151: 3 possible monitored sections with the 4xANY associated with MCC

On 2xGE_FC and 8xGE, performance are monitored at both clients and line side, and
simultaneously:
PM B1 are available on line side
PM 8B/10B, also called PM Ethernet layer 1, are available on client side.

SDH B1 PM
WDM
WDM
WDM
User
TXn
Lay er 1 GbE PM
RXn TXn
RXn
User WDM
TXn
WDM
RXn
User
RXn
TXn
User
CLIENT
EQUIPMENT
ETHERNET
Lay er 1 GbE PM
CLIENT
EQUIPMENT
ETHERNET
1696MSPAN 1696MSPAN

Figure 152: Monitored sections with the 2xGE_FC and 8xGE

WLA2 supports PMs on one transponder (of two) at the same time.
WLA3 support PMs on both transponders at the same time.
What does the system monitor?
As already stated, the system monitors 1s PM primitives and then generates PM
counters, briefly described in the following.
PM counters (PM events) accumulation by the Shelf Controller for 15min/24h
granularity period.
Starting from 1s PM primitives collected with the polling mechanism, SC evaluates
corresponding PM counters (also known in standards as PM events) increments, that
are accumulated over the current monitoring period to which they are related (15min or
24hours) for PM purposes (Current Data generation).
The performance monitoring is supported at the following layers:
SDH Regenerator Section (RS) layer, both for STM-1 (155 Mbps), STM-4 (622 Mbps),
STM-16 (2.5 Gbps) and STM-64/10 GbE WAN signals
layer 1 Ethernet PM, for 1.250 Gbps (GbE) and 1.0625 Gbps (FC) client signals
For the SDH-RS layer, the following performance counters are supported:
ES (Erroneous Second): Count of seconds with at least one B1 code violation or with at
least one RS defect
SES (Severely Erroneous Second): Count of seconds which contains more than 2400
(approximately > 30%) B1 code violation, or at least one RS defect. A SES is also counted as
an ES
BBE (Background Block Error): Count of B1 code violations which occur outside a SES.
For the FEC layer at 10Gbps, the following performance counters are supported:
BEC (Background Error Corrected): count of FEC corrected errors that occurred outside a
SCS (result is divided by 512 for display reasons)
SCS (Severely Corrected Seconds): count of seconds with a FEC layer defect or at least one
FEC uncorrected block or more than 33 538 048 FEC corrected errors (this corresponds to a
rate of FEC corrected errors per second higher than approximately 3E-3)
BBU (Background Block Uncorrected): count of FEC uncorrected blocks that occurred
outside a SUS
SUS (Severely Uncorrected Seconds): count of seconds in which a FEC layer defect
occurred or in which more than 33 538 048 FEC blocks were uncorrected (this corresponds to
a rate of FEC uncorrected blocks per second higher than approximately 3E-3)
CS (Corrected Seconds): counter not used; fixed value = 0
US (Uncorrected Seconds): counter not used; fixed value = 0.
For the Ethernet layer 1 at 10Gbps (10GbE LAN), the following performance
counters are supported:
Events managed by the boards (through 1s accumulation counters) are
- Defect Seconds
LOS
LOSy: Loss of Frame synchronisation (16 consecutive 66 bits blocks having
invalid sync field)
- Header Code Violation (HCV) (if sync field value is either 00 or 11)
Counters are managed based on the former values
- ES (Erroneous Second): sum of seconds with (pN_10G_HCV > 0) or Unit Missing
- SES (Severely Erroneous Second): sum of seconds with (pN_10G_HCV?
ETH10G_THR) or Unit Missing),where ETH10G_THR is 255 IB, which
represents a BER better than 2.10-6.
- BBE (Background Block Error): sum of (pN_10G_HCV) occured outside of SES.
For the Ethernet layer 1 at 1.25Gbps (GbE) or 1.0625Gbps (Fiber Channel), the
following performance counters are supported (per each port):
based on 8B/10B coding structure of the Ethernet frame, two types of errors are detected:
- RDE (Running Disparity Error)
- IW (Invalid Word)
these RDE and IW errors occuring in 1s are accumulated in a 16 bits counter, called ICG
(Invalid Code Group)
based on ICG and LOS/LOF detection, the following performance counters are supported

- ES : at least one ICG or one LOS or LOF or unit missing within the second
- SES : at least 10000 ICG (corresponds to a BER <10E-5) or one LOS or LOF or
unit missing
- BBE : ICG occuring outside a SES
Unavailable Time
A period of unavailable time (UAT) shall begin when 10 consecutive SES (or SUS)
events have been detected. These 10 seconds are considered to be part of the available
time.
The UAS counter shall accumulate over the monitoring period (it shall be then be reset
at the end of the monitoring period) the number of seconds of unavailable time.
Performance monitoring event counting for ES, SES, BBE shall be inhibited during
unavailable time.
An alarm UAT shall be raised at the detection of a new period of available time,
whatever the monitoring period.
PM current data management
Performance Monitoring on a given PM Point can be activated on either 15-minute or
24-hour (or both at the same time) granularity.
During a monitoring period, PM information (counters, elapsed time, etc.) is
continuously updated and can be managed from management interface. At the end of
the monitoring period, the content of PM current data (counters, elapsed time, etc.) is
stored into history data, the current data is reset and a new monitoring period begins.
Up to sixteen 15min and one 24h history data are stored in the NE.
Threshold Crossing Alarms (TCA)
15min and 24h PM counters are compared to provisionable thresholds, in order to
generate TCA.
TCA on 15min PM counters are raised/cleared according to a Dual Level Threshold
Crossing mechanism while TCA on 24h PM counters are raised according to a Single
Level Threshold Crossing mechanism:
Single Level Threshold Crossing: a threshold level is associated to each counter of an
activated PM point; TCA is raised each time the threshold is crossed by any counter, during
an accumulation period
Dual Level Threshold Crossing: two threshold levels are associated to each counter of an
activated PM point: the Set and the Reset ones. TCA is generated each time the Set (high)
threshold is crossed during an accumulation period. TCA is reset (clear) at the end of a
subsequent accumulation period in which the counter that generated TCA is lower than or
equal to the Reset (low) value.
N.B. Note: TCA are not meaningful for OCC10_LAN. 15min TCA are
inhibited, 24 h TCA is not be taken into account.
Default thresholds for QoS alarms
The default values of set and reset thresholds are given in the following tables.

Table 6.11 RS counters default threshold data values
Threshold Data Id 15 min Set Threshold 15min Reset
Threshold
24 hours
Threshold
BBE ES SES BBE ES SES BBE ES SES
3 24000 50 10 200 5 0
2, 20500, 21500, 24500,
25500, 26500
36000 150 15
20000, 21000, 24000,
25000, 26000
24000 50 10

Numbers meaning
2 RS Counters 24hours
3 RS Counters 15min
20000 user side MCC/OCC counters 15m
20500 user side MCC/OCC counters 24h
21000 WDM side MCC/OCC counters 15m
21500 WDM side MCC/OCC counters 24h
24000 4xANY counters 15m
24500 4xANY counters 24h
25000 User_U 2xGE_FC counters 15m
25500 User_U 2xGE_FC counters 24h

Numbers meaning
26000 Line 2xGE_FC counters 15m
26500 Line 2xGE_FC counters 24h

1354 RM: how to handle measures on a WDM protected path
1. Using PM Domain in RM Browser create the wanted measures profile, i.e.
Maintenance -15m or/and QOS 24h.
Check that Counters Provided field is set to TRUE
2. Correlate the target path(s) to the previous measure.
There are several ways to do that, from measure or from the path.
i.e. from measure use /Actions/Correlate/Merge/Correlate Paths/Trails
then drag and drop the target path(s).
i.e. from path use /Performance Measurement/Add to, then select target path(s)
At this stage the RM automatically add default measured point to the measure
defined in step
- The default points are extremities/ctps of the path.
You can list them by selecting the measure and clicking on PmTps icon.
You can also double click on the measure.
IF your path is a WDM protected path, the extremities of the path are the
OPC ports. OCP board is not a board generating PM, the PM generation is
performed by the transponders linked to the OPC.
Therefore after step [2] the PmTps list should be still empty
3. To fill the PmTps list of the target measure for WDM protected paths, open the
routing display of the target path(s) already correlated to the measure(s).
In the routing display, select the wanted ctp(s) you want to monitor then
/Actions/Performance Monitoring/Correlate a Planned Measure.
If the path has been correlated to several measures, a window opens to choose the
one(s) you want to correlate.
The Ctps to select are the ones corresponding to the transponders you want to
monitor. If you have a transponder in slot 12 in your path you should see the
related two Ctps (B&W and WDM) in the routing display of the path.
4. Activate the measure(s) with /Actions/Start/Consistency/Stop/Start
Now the target NE transponders should be counting PM.

System Configuration
Configuration criteria
The basic configuration relies on the following criteria:
the traffic demand defines the number of channels (1, 2, 4, 8, 12, 16, 24 or 32 channels)
the network architecture and the position of the equipment in the network defines the NE type
(line terminal, OADM, back-to-back terminal, repeater or CPE).
the optical power budget determines the need of optical amplification in the line terminal and
OADM NEs or the need of repeater NEs.
Once the basic configuration is defined, secondary criteria will be determinant to
define the optional features:
TDM concentrators (4 ANY and 2xGE_FC)
Up to 4 (4xANY) or 2 (2xGE_FC) client signals may be multiplexed on a single
STM16. The concentration of 4/2 client signals on a unique transponder access,
requires a 4 ANY/2xGE_FC board but saves 3 or 1 transponders and the
corresponding optical channels. In case of the 4xANY_P/2xGE_FC is equipped with
a CWDM or DWDM SFP optical module, the transponder is not required.
Optical Sub-Network Connection Protection (O-SNCP)
In ring networks, both channels and each client signals can be individually protected:
- the protection of a channel/wavelenght requires an OPC board and two
transponders (MCC/OCC10/TRBD1996)
- the protection of the client signal(s) requires up to four OPCs, two 4xANY and two
MCC boards (only in case of the 4xANY is not equipped with WDM SFP); in case
of 2xGE_FC clients protection, two OPCs are required
- the protection of the client signal requires one optically protected WLA
(WLA2M_OP, WLA3CDOP).

Consumption

The maximum available consumption for transponders in one shelf is 500 W. So, one
shelf can be filled in following the next consumptions :

- 20 W: MCC, 2xGE_FC, WLA, OAC2
- 30 W: OCC10, 8xGE
- 40 W: 4xANY, TRBD1996

Further more, for optical cabling constraints, only eight 8xGE can be host in one shelf.
For detailed shelf configurations, see [2].

Supervision function and User interface
The supervision feature requires an SPVM (SPVM2; SPVM_H) or OSC board. The 2
Mbit/s user interface feature requires in addition an UIC board (if additional user
information are required; OSCboard doesnt provide these signals). These two
features also require the OSC insertion MUX and the OSC extraction DMUX
implemented in all the OADM boards, the OMDX8100_M_L1_XS, the CMDX-U-S /
CMDX2-U-S (the last ones are used for CWDM applications; 1310nm is the CWDM
supervision wavelength), the CDMDX2-U-S and the OAC boards. If the use of one of
these features is foreseen, the early choice of a board with the OSC MUX and DMUX
will allow a further implementation, without interruption of the traffic.
Expansion MUX/DEMUX
The 2:1 expansion MUX and DEMUX (OMDX8100_M_L1_X and
OMDX8100_M_L1_XS boards) are necessary to reach NE configurations with more
than 16 optical channels. A NE can be upgraded up to a 32 channel NE without traffic
interruption if the expansion MUX and DMUX are already installed.
Remote NE
The type of Remote NE is defined when few channels are needed for the user to reach
from a ring a distant NE or to create a point to point link with CPE using.
N.B. Boards are generally 1696MSPAN shelf and 1696MS_C shelf compatible
except boards explicitly denominated as strictly for 1696MSPAN or strictly for
Compact shelf.
When a CPE is used in office version, the customer must provide an appropriate
ground.
CPE metallic housing should be connected to the ground,
0 V_DC of the External power feeding must be also connected to this ground.
Consequently the ground connection of the positive Battery 48 Vdc should be
directly connected on the ground (PSC side) of the power cable.
Refer to the example in Figure 1503.

L i n e
T e r m i n a l
L i n e
T e r m i n a l
8 c lie n t
s i g n a l s
O A D M
4 p a s s - t h r o u g h
c h a n n e ls
4 a d d e d a n d d r o p p e d
8 c lie n t
s i g n a l s

Figure 149154153: Example of starting configuration

One 8 channel MUX/DMUX card is sufficient to build this configuration. The
following gives three possibilities and their characteristics.

Table 6.12 Configuration criteria
MUX/DMUX board Cost Power
budget
Upgradability Supervision
channel
OMDX8100_M_L2 or
OMDX8100_M_S2 or
OMDX8100_M_S1
minimum maximum 12 or 16 channels without
traffic interruption.
24 or 32 channels with traffic
interruption.
No
OADM8100_M_##_S intermediate intermediate 12 or 16 channels without
24 or 32 channels with traffic
interruption.
Yes
OMDX8100_M_L1_X
S
maximum minimum Up to 32 channels without
Yes

N.B. In the OMDX and OADM board name, the characters of the fourth part if
any, have the following meaning:
S: board with supervision channel extract and insert functions.
X: board with expansion MUX.

1696MS (main shelf) configurations examples
Typical DWDM / CWDM configurations
DWDM configurations
Terminals
- 1 channel terminal
- 2 channels terminal
- 4 channels terminal with two 4 ANY boards
- 8 channels terminal with supervision and user interface
- 16 channels terminal with expansion and supervision
- 32 channels terminal with two stages amplification in one shelf (w/ WLA)
Back-to-back terminals / OADM
- 1 channel OADM
- 2 channels OADM
- 4 channels OADM
- 8 channels OADM
- 8 channels west and 4 channels east back-to-back terminal / OADM (asymmetrical
configuion)
- 16 (protected) channels back-to-back terminal / OADM in one shelf (with WLA)
- 32 (protected and amplified) channels back-to-back terminal / OADM in one NE
It is also possible to use 12 and 24 channels terminal and back-to-back
terminal/OADM.
Repeaters: With and Without supervision.
CWDM configurations
Terminals
- 1 to 8 channels terminal
Back-to-back terminals / OADM
- 1 to 8 channels back-to-back terminal
Repeaters: With and Without supervision.
Mixed (CWDM + DWDM) configurations
Terminals (with or without supervision)
- (up to) 15 channels terminal: (up to) 8 DWDM channels plus (up to) 7 CWDM
channels
channels
channels
channels
Back-to-back terminals (with or without supervision)
- (up to) 15 channels b-to-b terminal: (up to) 8 DWDM chs plus (up to) 7 CWDM
chs for each side
chs for each side
chs for each side
- (up to) 38 channels b-t-b terminal: (up to) 32 DWDM channels plus (up to) 6
CWDM channels
Some of these configurations are described hereafter.
N.B. If equipped with WDM SFP/XFP modules, also 4xAY_P, 8xGE and
2xGE_FC can be considered as transponders, but it will not shown in all the
following figures for semplicity reasons.

Examples of configurations with MVAC are also provided.
In protected configuration, the OPCs have to be plugged under the MAIN
transponder (see the examples shown in the following figures), apart when the
WLA unit (WLA2M_OP and WLA3CDOP) is used: in this case the OPC is not
required.
N.B. In regard to the following figures and relevant configurations in this
section, 1696MS (main shelf) configurations examples and the section,
1696MS_C (compact shelf) configurations examples, it has to be taken into
account that OACs can be used in pure DWDM and mixed DWDM + CWDM
configurations. OACs are never used in pure CWDM configurations

Line Terminals (one sided multiplexer / demultiplexer)
4 channels terminal
Whatever the implementation, all the boards can be placed in a single shelf.
4 channels terminal can be designed with the
4-channel OADM board and OCC10_E, MCC3, WLA3, 2xGE_FC, 4xANY_P, 8xGE,
TRBD1996 transponders, in case of DWDM application. In this case the pass-through link
is not connected (Mux/Demux extra-input)
8-channel CMDX mux/demuxes (all types) and OCC10_EC, WLA1, WLA2, WLA3,
2xGE_FC, 4XANY_P transponders, in case of CWDM application.
WLAs are 2-channel transponders: only two cards are required to provide the 4-
channel configuration.
The 4-channels terminal configuration can be applied also to OCC10/TRBD1996, but
with the 9.953Gbps (STM-64/OC-192/10GBE WAN) client signal.
In case of 4xANY_P/2xGE_FC/8xGE are provided with WDM SFP/XFP, the
transponder is not required.
1
4
4
user
interf aces
1
OADM4100_M_chx-y_S or CMDX-U-S or CMDX2-U-S
4 channels
4 channels
4xMCC
4 x A N Y _ P
M
U
X
D
M
U
X
OSC in
OSC out
C l i e n t
S i g n a l s
UIC SPVM
2Mbps
order wire
2xWLA
4xOCC
w / B & W S F P
w / B & W S F P
2 x G E _ F C
w / B & W X F P
8 x G E

Figure 150155154: 4 (CWDM or DWDM) channels line terminal block diagram

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
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Figure 155: 4 (CWDM or DWDM) channels terminal configuration

** The ESC board is designed in order to support, in the same board, both Equipment
and Shelf Controller facilities. The ESC unit has two microprocessors, one dedicated
for each task.

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
A
D
M

4

c
h
a
n
n
e
l
s

o
r

C
M
D
X
(
2
)
-
U
-
S
1 7 1 8 1 9 2 0 2 1
W
L
A
W
L
A
R
A
I
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
S
P
V
M
_
H

(
o
p
t
.
)
*
U
I
C
U
I
C
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
O
S
M
C

(
0
p
t
.
)
1 5 1 6
*
*
Figure 156: 4 (CWDM or DWDM) channels terminal configuration with WLA boards

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
A
D
M

4
1
0
0
_
M
_
c
h
x
-
y
_
S
4

x

A
N
Y
4

x

A
N
Y
1 6 1 7 1 8 1 9 2 0 2 1
M
C
C

c
h
.

3
0
M
C
C

c
h
.

3
2
M
C
C

c
h
.

3
1
M
C
C

c
h
.

3
3
R
A
I
*
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
S
P
V
M
2
/
_
H

(
o
p
t
.
)
*
U
I
C
U
I
C
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
O
S
M
C

(
0
p
t
.
)
4

x

A
N
Y
4

x

A
N
Y
O
P
C
#
2
O
P
C
#
1
O
P
C
#
3
O
P
C
#
4
O
P
C
#
2
O
P
C
#
1
O
P
C
#
3
O
P
C
#
4
Figure 157: 4 DWDM channels terminal configuration with 4XANY drawers
protection

8 CWDM or DWDM channels terminal with expansion, supervision and user
interface
This configuration can be designed with
OMDX8100_M_L1_XS mux/demux (only L1 band is supported), OCC10, MCC3 and
WLA3 transponders, in case of DWDM application. The same board locations are available
with any band (L1, L2, S1, S2) without expansion
the 8-channel CMDX mux/demuxes (all types), and WLA1/2/3, in case of CWDM
application.
4xANY_P/2xGE_FC/8xGE, TRBD1996 with the appropriate (CWDM/DWDM)
SFP/XFP can also be used as a transponder.
When OMDX boards are used to design 8 (DWDM) channels terminals, only one set
of channels (L1) can be provided with SPV. If an upgrading up to 32 channels is
required, OMDX8 board can perform it.

8 channels
8 channels
1 (30)
M
U
X
D
M
U
X
UIC SPVM
8 x MCC
2Mbps
order wire
OSC in
OSC out
8 (38)
1 (30)
8 (38)
Client
signals
OMDX8100_M_L1_XS or CMDX-U-S or CMDX2-U-S
8 x OCC
4 x WLA
8 x 4xANY_P
8 x 2xGE_FC
8 x 8xGE

Figure 158: 8 (CWDM or DWDM) channels line terminal block diagram

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0
R
A
I
U
I
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
U
I
C
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6
T
r
a
n
s
p
o
n
d
e
r

c
h

3
7
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
O
S
M
C

(
0
p
t
.
)
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S

o
r

C
M
D
X
(
2
)
-
U
-
S
S
P
V
M

(
2
,

_
H
)

(
o
p
t
.
)
*
Figure 159: 8 (CWDM or DWDM) channels line terminal with expansion and
supervision

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
W
L
A
R
A
I
S
P
V
M
_
H

(
o
p
t
.
)
*
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S

o
r

C
M
D
X
(
2
)
-
U
-
S
U
I
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
U
I
C
W
L
A
W
L
A
W
L
A
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
O
S
M
C

(
0
p
t
.
)
Figure 160: Example of 8 (CWDM or DWDM) channels line terminal with WLA
boards

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
4

x

A
N
Y
4

x

A
N
Y
1 6 1 7 1 8 1 9 2 0 2 1
R
A
I
*
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
S
P
V
M
_
H

(
o
p
t
.
)
*
U
I
C
U
I
C
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
O
S
M
C

(
0
p
t
.
)
4

x

A
N
Y
4

x

A
N
Y
O
P
C
#
2
O
P
C
#
1
O
P
C
#
3
O
P
C
#
4
O
P
C
#
2
O
P
C
#
1
O
P
C
#
3
O
P
C
#
4
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S

o
r

C
M
D
X
(
2
)
-
U
-
S
Figure 161: Example of 8 (CWDM or DWDM) channels line terminal with 4xANY_P

8 channels terminal with supervision and user interface and without expansion
In DWDM application four sets of channels are supported: L1, L2, S1, S2.
By using OADM boards in terminals, SPV is available for each set of channels.
However, if an upgrading up to 32 channels is required, using OADM8 boards is not
sufficient (need for expansion).
In CWDM application the 8 available channels are multiplexed by the CMDX board
(with 1310nm filter).
4xANY_P, 2xGE_FC, 8xGE, TRBD1996 with the appropriate (CWDM/DWDM)
SFP/XFP can also be used as a transponder.

8 channels
8 channels
1
M
U
X
D
M
U
X
1
UIC SPVM
2Mbps
order wire
OSC in
OSC out
Client
signals 8
8
OADM8100_M_xx_S or CMDX-U-S or CMDX2-U-S
8 x MCC
8 x OCC
4 x WLA
8 x 4xANY_P
8 x 2xGE_FC
8 x 8xGE

Figure 162: Example of 8 CWDM or DWDM channels line terminal w/o expansion
block diagram

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0
R
A
I
O
A
D
M
8
1
0
0
_
M
_
L
1
_
X
S

o
r

C
M
D
X
(
2
)
-
S
U
I
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
U
I
C
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6
T
r
a
n
s
p
o
n
d
e
r

c
h

3
7
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8
S
P
V
M

(
2
,

_
H
)

(
o
p
t
.
)
*
O
S
M
C

(
0
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
* S P V M i s u s e d i n D W D M
N E s , O S C i s u s e d i n
C W D M a n d m i x e d N E s . N o
O A C i n p u r e C W D M c o n f i g .

Figure 163: Example of 8 DWDM or CWDM channels LT with supervision (no
expansion)

8 CWDM channels terminal: OCC10_ECs and WLAs connected to CMDX(2)
This configuration allows to mux/demux to/from the CWDM line two 10 Gbps
CWDM wavelengths and six (up to 2.67Gbps) CWDM ones. The involved boards are
up to two OCC10_EC boards for the two 10 Gbps CWDM signals
WLA1s, WLA2s or WLA3s (with CWDM SFP) for the six (up to 2.67 Gbps) CWDM signals
one 8-channel CWDM mux/demux for the multiplexing/demultiplexing of the eigth
wavelengths:
- the up to 2.67Gbps CWDM channels can be connected to all the CMDX ports
- the 10 Gbps CWDM channels can be connected only to the 1530nm and the
1550nm ports.

8 CWDM
1470nm f rom WLA
M
U
X
D
M
U
X
OSC in
OSC out
8 client
signals
2 x
3 x WLA
CMDX-U-S or CMDX2-U-S
OCC10_EC
1490nm f rom WLA
1510nm f rom WLA
1530nm f rom OCC10_EC
1550nm f rom OCC10_EC
1570nm f rom WLA
1590nm f rom WLA
1610nm f rom WLA
1470nm to WLA
1490nm to WLA
1510nm to WLA
1530nm to OCC10_EC
1550nm to OCC10_EC
1570nm to WLA
1590nm to WLA
1610nm to WLA
plus
channels
8 CWDM
channels

Figure 164: 8 CWDM channels LT with two 10Gbps chs and six 2.7Gbps chs block
diagram

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
W
L
A

(
w
i
t
h

C
W
D
M

S
F
P
)
R
A
I
C
M
D
X
(
2
)
U
I
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
U
I
C
W
L
A

(
w
i
t
h

C
W
D
M

S
F
P
)
W
L
A

(
w
i
t
h

C
W
D
M

S
F
P
)
O
C
C
1
0
_
X
F
P
_
C
W
D
M
O
C
C
1
0
_
X
F
P
_
C
W
D
M
O
S
C
E
B
R
I
D
G
E
O
S
C

(
o
p
t
.
)

Figure 165: 8 CWDM chs terminal: two OCC10_ECs and three WLAs connected to
CMDX(2)

16 DWDM channels terminal with expansion and supervision
In order to upgrade a 8 DWDM channel terminal to a 16 DWDM channel one, or to
design 16 DWDM channel terminals with SPV, one 8 channel OADM and one 8
channel OMDX boards can be used.
4xANY_P/2xGE_FC/8xGE, TRBD1996 with DWDM SFP can also be used as
transponders.
In case of user channels (UIC) are not required, the OSC board can be used instead of
SPVM2/_H.
OSC in
OSC out
OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
unused
unused
D
M
U
M
U
X
X
D
M
U
M
U
X
X
16 channels
16 channels
UNIT 1
UNIT 2
OMDX8100_M_L2
20
28
20
28
Client
signals
Client
signals
8 x MCC
8 x OCC
4 x WLA
8 x 4xANY_P
8 x 2xGE_FC
8 x 8xGE
8 x MCC
8 x OCC
4 x WLA
8 x 4xANY_P
8 x 2xGE_FC
8 x 8xGE

Figure 166: 16 DWDM channels terminal with expansion and SPV upgradability
block diagram

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S
O
M
D
X
8
1
0
0
_
M
_
L
2
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
T
r
a
n
s
p
o
n
d
e
r

c
h

2
8
S
P
V
M
2
/
_
H

(
o
p
t
.
)
U
I
C
U
I
C
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8
T
r
a
n
s
p
o
n
d
e
r

c
h

2
7
T
r
a
n
s
p
o
n
d
e
r

c
h

3
7
T
r
a
n
s
p
o
n
d
e
r

c
h

2
6
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6
T
r
a
n
s
p
o
n
d
e
r

c
h

2
5
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5
T
r
a
n
s
p
o
n
d
e
r

c
h

2
3
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3
T
r
a
n
s
p
o
n
d
e
r

c
h

2
2
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
T
r
a
n
s
p
o
n
d
e
r

c
h

2
1
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1
T
r
a
n
s
p
o
n
d
e
r

c
h

2
0
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)

Figure 167: 16 DWDM channels terminal with expansion and SPV upgradability

16 DWDM channels or mix C/DWDM (15 chs) terminal with WLA boards
The 16 DWDM channels terminal configuration can be designed with two 8-channel
DWDM mux/demux (OMDX8100) and eigth WLA3 transponders equipped with
DWDM SFP, as described in the previous section, 16 DWDM channels terminal
with expansion and supervision (refer to the block diagram of previous fFigure 166
for details). and to Figure 169.
The mixed 15-channel (7 CWDM plus 8 DWDM) terminal configuration with WLAs
requires
one 8-channel DWDM mux/demux (OMDX8100 in L1 or S1 bands to be respectively
connected to the 1550nm and 1530nm ports of CMDX)
one 8-channel CWDM mux/demux, CMDX(2)-U-S
eigth WLA transponders, taking into account that WLA2 and WLA1 can only provide
CWDM channels and WLA3 can provide both DWDM and CWDM channels.
Refer to block diagram of the next fFigure 168 and Figure 169.
OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
unused
unused
D
M
U
X
M
U
X
UNIT 1
8 client
signals
4xWLA3
M
U
X
D
M
U
X
D
M
U
X
M
U
X
UNIT 2
1550nm
1550nm
7 client
signals
4xWLA3
4xWLA2
or
8 DWDM chs in L1 band
7 CWDM channels
OSC in
OSC out
15 channels
mixed
(7 DWDM
channels
plus
8 DWDM
channels)
15 channels
mixed
1470nm
1610nm
1470nm
1610nm
CMDX(2)-S DWDM
CH1
CH7
4xWLA1
or

Figure 168: Example of 15 CWDM/DWDM mixed channels terminal block diagram
with WLAs

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
U
I
C
U
I
C
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
C
* S P V M i s u s e d i n D W D M
N E s , O S C i s u s e d i n
C W D M a n d m i x e d N E s
E
B
R
I
D
G
E
S
P
V
M
2
/
_
H

(
o
p
t
.
)
*

Figure 169: 16 DWDM channels terminal or mix C/DWDM (15-channel) terminal
with WLAs

24 DWDM channels or mix C/DWDM (22 chs) terminal
The 24 DWDM channels terminal configuration with single channel transponders
(MCC3, OCC10_E, 4xANY_P, 2xGE_FC, 8xGE, TRBD1996) requires two shelves.
The block diagram is similar to that of second next Figure 172 without S1 band; the
shelves configuration is similar to that of Figure 173 without S1 band transponders and
mux/demux.
The 24 DWDM channels terminal configuration with two-channel transponders
requires twelve WLA3s and three OMDX8100 (L1, L2, S2 bands) equipped in only
one shelf. The block diagram is similar to that of second next Figure 172 without the
S1 band (chs 52 to 60). and the shelf configuration is shown in Figure 171.
The mixed 22-channel (6 CWDM plus 16 DWDM) terminal configuration with
WLAs requires
two 8-channel DWDM mux/demux (OMDX8100 in L1 and S1 bands to be respectively
connected to the 1550nm and 1530nm ports of CMDX)
one 8-channel CWDM mux/demux, CMDX(2)-U-S
eleven WLA transponders, taking into account that WLA2 and WLA1 can only provide
CWDM channels and WLA3 can provide both DWDM and CWDM channels.
Refer to block diagram of next fFigure 170 and Figure 171.
OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
unused
unused
D
M
U
X
M
U
X
8 client
signals
4xWLA3
M
U
X
D
M
U
X
1550nm
6 client
signals
3xWLA3
3xWLA2
or
CMDX-U-S or CMDX2-U-S
8 DWDM chs in L1 band
6 CWDM channels
OSC in
OSC out
22 channels
mixed
(6 CWDM
channels
plus
16 DWDM
channels)
22 channels
mixed
1470nm
1610nm
DWDM
CWDM
MUX
DEMUX
OMDX8100_M_S1
52
60
52
60
D
M
U
X
M
U
X
8 client
signals
4xWLA3
8 DWDM chs in S1 band
DWDM
1530nm
CH1
CH6
3xWLA1
or

with WLAs

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
U
I
C
U
I
C
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
W
L
A
W
L
A
W
L
A
W
L
A
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
O
S
C
E
B
R
I
D
G
E
S P V M i s u s e d i n D W D M N E s ,
O S C i s u s e d i n m i x e d N E s .

Figure 171: 24 DWDM channels terminal or mix C/DWDM (22-channel) terminal
with WLAs

32 DWDM channels or 30 C/DWDM mixed chs terminal+SPV+2 stages
amplification
The 32 DWDM channels terminal configuration with single channel transponders
(MCC3, OCC10_E, 4xANY_P, 2xGE_FC, 8xGE, TRBD1996) requires two shelves
(32 transponders, four OMDX8100 L1/L2/S1/S2 bands and two optional OACs). The
block diagram is shown in next fFigure 172. and the shelves configuration is shown in
Figure 173.
The 32 DWDM channels terminal configuration with two-channel transponders
requires sixteen WLA3s and four OMDX8100 (L1, L2, S1, S2 bands) and two optional
OACs, equipped in only one shelf. The block diagram is shown in next fFigure 172.
and the shelf configuration is shown in Figure 175.
WLAs requires
three 8-channel DWDM mux/demux (OMDX8100 in L1, S1 and S2 bands; the multiplexed
signal has to be connected to the extra port of the CDMDX2-U-S)
one 7-channel C/DWDM mux/demux (CDMDX2-U-S)
fifteen WLA transponders, taking into account that WLA2 and WLA1 can only provide
CWDM channels and WLA3 can provide both DWDM and CWDM channels (6 CWDM and
24 DWDM interfaces are required).
The block diagram is shown in the second next fFigure. 174. and the shelf
configuration is shown in Figure 175.
Only one shelf is required for this configuration.
The 30 mixed channels (6 CWDM plus 24 DWDM) terminal configuration can also
be provided with all the other transponder types (single channel transponders), taking
into account that MCC3, 8xGE, TRBD1996 and OCC10_E can only provide DWDM
interfaces, OCC10_EC can only provide a CWDM interface, 4xANY_P and 2xGE_FC
can provide both CWDM and DWDM interfaces (6 CWDM and 24 DWDM interfaces
are required, thus 30 transponders are required).
Two shelves are required for this configuration.

32 channels
OSC in
OSC out
OMDX8100_M_L1_XS
LB
LB
SB
SB
20
28
30
38
42
50
42
50
30
38
52
60
52
60
20
28
D
M
U
M
U
X
X
D
M
U
M
U
X
X
D
M
U
M
U
X
X
D
M
U
M
U
X
X
UNIT 1
UNIT 2
UNIT 4
UNIT 3
OMDX8100_M_L2
OMDX8100_M_S1
D
M
U
M
U
X
X
OAC OAC
OMDX8100_M_S2
OFA
OFA
OFA
OFA
EXP
Client
signals
Client
signals
Client
signals
Client
signals
8 x MCC
8 x OCC10_E
4 x WLA
8 x 4xANY_P
8 x 2xGE_FC
8 x 8xGE
8 x MCC
8 x OCC10_E
4 x WLA
8 x 4xANY_P
8 x 2xGE_FC
8 x 8xGE
8 x MCC
8 x OCC10_E
4 x WLA
8 x 4xANY_P
8 x 2xGE_FC
8 x 8xGE
8 x MCC
8 x OCC10_E
4 x WLA
8 x 4xANY_P
8 x 2xGE_FC
8 x 8xGE

Figure 172: 32 DWDM channels terminal + SPV + two stages OAC block diagram
(example)

S
P
V
M
2
/
_
H

(
o
p
t
.
)
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S
O
M
D
X
8
1
0
0
_
M
_
L
2
P
S
C
P
S
C
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
O
M
D
X
8
1
0
0
_
M
_
S
2
L
A
N
L
A
N
O
M
D
X
8
1
0
0
_
M
_
S
1
R
A
I
R
A
I
U
I
C
U
I
C

E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r

(
S
C
)
T
r
a
n
s
p
o
n
d
e
r

c
h

2
8
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8
T
r
a
n
s
p
o
n
d
e
r

c
h

2
7
T
r
a
n
s
p
o
n
d
e
r

c
h

3
7
T
r
a
n
s
p
o
n
d
e
r

c
h

2
6
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6
T
r
a
n
s
p
o
n
d
e
r

c
h

2
5
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5
T
r
a
n
s
p
o
n
d
e
r

c
h

2
3
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3
T
r
a
n
s
p
o
n
d
e
r

c
h

2
2
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
T
r
a
n
s
p
o
n
d
e
r

c
h

2
1
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1
T
r
a
n
s
p
o
n
d
e
r

c
h

2
0
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0
T
r
a
n
s
p
o
n
d
e
r

c
h

5
0
T
r
a
n
s
p
o
n
d
e
r

c
h

6
0
T
r
a
n
s
p
o
n
d
e
r

c
h

4
9
T
r
a
n
s
p
o
n
d
e
r

c
h

5
9
T
r
a
n
s
p
o
n
d
e
r

c
h

4
8
T
r
a
n
s
p
o
n
d
e
r

c
h

5
8
T
r
a
n
s
p
o
n
d
e
r

c
h

4
7
T
r
a
n
s
p
o
n
d
e
r

c
h

5
7
T
r
a
n
s
p
o
n
d
e
r

c
h

4
6
T
r
a
n
s
p
o
n
d
e
r

c
h

5
6
T
r
a
n
s
p
o
n
d
e
r

c
h

4
4
T
r
a
n
s
p
o
n
d
e
r

c
h

5
4
T
r
a
n
s
p
o
n
d
e
r

c
h

4
3
T
r
a
n
s
p
o
n
d
e
r

c
h

5
3
T
r
a
n
s
p
o
n
d
e
r

c
h

4
2
T
r
a
n
s
p
o
n
d
e
r

c
h

5
2
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)

Figure 173: 32 DWDM channels terminal + SPV + 2 stages OAC configuration

OMDX8100_M_L1_XS
30
38
30
38
D
M
U
X
M
U
X
Client
signals
Client
signals
CDMDX2-U-S
6 CWDM channels
OSC in
OSC out
30 channels
mixed
(6 CWDM
channels
plus
24 DWDM
channels)
30 channels
mixed
1470nm
1610nm
DWDM
DWDM
MUX
DEMUX
OMDX8100_M_S1
52
60
52
60
D
M
U
X
M
U
X
Client
signals
LB
LB
SB
SB
D
M
U
M
U
X
X
EXP
OMDX8100_M_S2
42
50
42
50
D
M
U
X
M
U
X
Client
signals
8 x MCC
8xOCC10_E
4 x WLA3
8x4xANY_P
3xWLA1/2/3
6x4xANY_P
6x2xGE_FC
L1
L1
Extra
band
S2
S2
CWDM/
C H 1 *
C H 6 *
* 1 4 7 0 , 1 4 9 0 , 1 5 1 0 , 1 5 7 0 , 1 5 9 0 , 1 6 1 0 n m a r e t h e
C W D M w a v e l e n g t h s m a n a g e d b y t h e C / D W D M
m u x / d e m u x ( C D M D X 2 - U , C D M D X 2 - U - S )
8x2xGE_FC
8x2xGE
8 x MCC
4 x WLA3
8x4xANY_P
8x2xGE_FC
8x2xGE_
8 x MCC
4 x WLA3
8x4xANY_P
8x2xGE_FC
8x2xGE_
5xOCC10_EC
8xOCC10_E
8xOCC10_E


P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
S
P
V
M
_
H

(
o
p
t
.
)
*
U
I
C
U
I
C
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
W
L
A
W
L
A
W
L
A
W
L
A
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
W
L
A
W
L
A
W
L
A
W
L
A
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
R
A
I
* S P V M i s u s e d i n
D W D M N E s , O S C i s
u s e d i n m i x e d N E s
O
S
C

Figure 175: 32 DWDM chs or 30 C/DWDM chs LT+SPV+1 stage OAC configuration
with WLAs
38 C/DWDM mixed channels terminal + SPV + 2 stages amplification
WLAs requires
four 8-channel DWDM mux/demux (OMDX8100 in L1, L2, S1 and S2 bands; the
multiplexed signal has to be connected to the extra port of the CDMDX2-U-S)
one 7-channel C/DWDM mux/demux (CDMDX2-U-S)
nineteen WLAs, taking into account that WLA2 / WLA1 can only provide CWDM channels
and WLA3 can provide both DWDM and CWDM channels (6 CWDM and 32 DWDM
interfaces are required).
The block diagram is shown in next fFigure 176. and the shelf configuration is shown
in Figure 177.
Two shelves are required for this configuration.
The 38 mixed channels (6 CWDM + 32 DWDM) terminal configuration can also be
provided with all the other transponder types (single channel transponders), taking into
account that MCC3, 8xGE, TRBD1996 and OCC10_E can only provide a DWDM
interface, OCC10_EC can only provide a CWDM interface, 4xANY_P and 2xGE_FC
can provide both a CWDM and a DWDM interface (6 CWDM and 32 DWDM
interfaces are required, thus 38 transponders are required). Three shelves are required
for this configuration.

OMDX8100_M_L1_XS
30
38
30
38
D
M
U
X
M
U
X
Client
signals
Client
signals
CDMDX2-U-S
6 CWDM channels
OSC in
OSC out
38 channels
mixed
(6 CWDM
channels
plus
32 DWDM
channels)
38 channels
mixed
1470nm
1610nm
DWDM
DWDM
MUX
DEMUX
OMDX8100_M_S1
52
60
52
60
D
M
U
X
M
U
X
Client
signals
LB
LB
SB
SB
D
M
U
M
U
X
X
EXP
OMDX8100_M_S2
42
50
42
50
D
M
U
X
M
U
X
Client
signals
8 x MCC
8xOCC10_E
4 x WLA3
8x4xANY_P
Extra
band
S2
S2
CWDM/
C H 1 *
C H 6 *
* 1 4 7 0 , 1 4 9 0 , 1 5 1 0 , 1 5 7 0 , 1 5 9 0 , 1 6 1 0 n m a r e t h e
C W D M w a v e l e n g t h s m a n a g e d b y t h e C / D W D M
m u x / d e m u x ( C D M D X 2 - U , C D M D X 2 - U - S )
8x2xGE_FC
8x2xGE
8 x MCC
8xOCC10_E
4 x WLA3
8x4xANY_P
8x2xGE_FC
8x2xGE_
8 x MCC
8xOCC10_E
4 x WLA3
8x4xANY_P
8x2xGE_FC
8x2xGE
3xWLA1/2/3
6x4xANY_P
6x2xGE_FC
5xOCC10_EC
OMDX8100_M_L2
20
28
20
28
D
M
U
X
M
U
X
Client
signals
L2
L2
8 x MCC
8xOCC10_E
4 x WLA3
8x4xANY_P
8x2xGE_FC
8x2xGE


P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
U
I
C
U
I
C
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
W
L
A
W
L
A
W
L
A
W
L
A
M
U
X
/
D
E
M
U
X

7

c
h
a
n
n
e
l
s
W
L
A
W
L
A
W
L
A
W
L
A
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
R
A
I
O
S
C
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
W
L
A
R
A
I
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
W
L
A
O
S
M
C

(
0
p
t
.
)
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
S
P
V
M
_
H

(
o
p
t
.
)
*
* S P V M i s u s e d i n D W D M N E s , O S C i s u s e d i n m i x e d N E s

Figure 177: 38 C/DWDM chs terminal+SPV+1 stage OAC configuration with WLAs

OADM and Back-to-Back Terminals
In the following configurations we can plug MVAC boards in slots 4 to 11 and/or
14 to 21. Each MVAC is used to replace a transponder in the case of a channel
loop or to adjust pass-through port losses. Furthermore, for OADM with 8xGE,
the add-drop functionality is supported with only one 8xGE.
In OADM configuration the single-channel transponders are in adjacent slots (West in
even, East in odd) then the board location is the same with or without protection. For
configuration without protection, just remove the OPC boards.
In next fFigure 178 a DWDM OADM configuration is shown. In case of CWDM
OADM, only one 4-ch OADM board (COAD2) is used: it includes both west and east
sides. No OAC in pure CWDM configurations.
4 channels OADM
2.66 Gb/s back-panel
electrical links (M
CC only)
D
M
U
M
U
X
X
U
X
D
M
U
X
WEST EAST
OSC out
OSC in
OSC out OSC in
OADM4100_M_chy-z_S OADM4100_M_chy-z_S
M
c l i e n t s i g n a ls c l i e n t s i g n a ls
MCC
4 x
OCC10
4 x WLA
or
4xANY_P
2xGE_FC
8xGE
MCC
4 x
OCC10
4 x WLA
or
4xANY_P
2xGE_FC

Figure 178: 4 channels OADM (DWDM) block diagram

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
A
D
M
4
1
0
0
_
M
_
c
h
x
-
y
_
S

(
W
e
s
t
)
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
T
r
a
n
s
p
o
n
d
e
r

c
h

4
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
E
T
r
a
n
s
p
o
n
d
e
r

c
h

2
W
T
r
a
n
s
p
o
n
d
e
r

c
h

2
E
T
r
a
n
s
p
o
n
d
e
r

c
h

1
W
T
r
a
n
s
p
o
n
d
e
r

c
h

1
E
O
P
C
O
P
C
O
P
C
O
P
C
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)
O
A
D
M
4
1
0
0
_
M
_
c
h
x
-
y
_
S

(
E
a
s
t
)
R
A
I

Figure 179: 4 channels back-to-back terminal / OADM

Every combination of east and west sets of channels is possible.
8 channels OADM
The 8 DWDM channels OADM configuration can be designed with
two 8-channel DWDM mux/demux (OMDX8100) or two 8-channel DWDM OADM
(OADM8100) or two 8-channel CWDM mux/demux (CMDX(2)-U-S); OACs are not used in
CWDM configurations.
16 transponders (MCC, OCC10_E, 4xANY_P, 2xGE_FC, TRBD1996): 8 channels are
connected to the west side and the other 8 channels are connected to the east side (via OPCs
in case of protected channels, directly for unprotected ones). In case of 8xGE is used, the
add-drop functionality is supported with only one unit. Thus eigth 8xGE units are able to
provide the 8 channels OADM functionality.
For the 8 channels OADM with WLAs see following fFigures. 186 to Figure 188.
8 OPCs for MCC/OCC10_E, located below the main transponder, 16 OPCs for 2xGE_FC, 32
OPCs for 4xANY_P.
Both DWDM/CWDM channels are available. From others following fFigures 180 to
Figure 185 are shown DWDM systems.

With optical protection of each channel (neither SPV nor EXP)
D
M
U
M
U
X
X
M
U
X
D
M
U
X
n channels
WEST EAST
OMDX8100_M_x OMDX8100_M_y
n channels
n channels
n channels
(n-8) channels
(n-8) channels
a d d & d r o p p r o t e c t e d c l i e n t s i g n a l s
OPCs
MCC
8 x
OCC10
4 x WLA
or
4xANY_P
2xGE_FC
MCC
8 x
OCC10
4 x WLA
or
4xANY_P
2xGE_FC
8xGE

Figure 180: 8 DWDM channels OADM w/ protection block diagram
P
S
C
L
A
N
P
S
C
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S

W
e
s
t
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S

E
a
s
t
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
7
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
7
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8
E
O
P
C
O
P
C
O
P
C
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)
R
A
I
S
P
V
M
2
/
_
H

(
o
p
t
.
)
I n p r o t e c t e d c o n f ig u r a t io n , t h e O P C s h a v e t o b e p lu g g e d u n d e r t h e M A I N t r a n s p o n d e r .

Figure 181: 8 DWDM channels OADM protected channels

With expansion and supervision upgrade capabilities

Only symmetrical configuration can be provided.
In case of 8xGE is used, the add-drop functionality is supported with only one unit.
OSC in
OSC out
LB
SB
SB
D
M
U
M
U
X
X
OSC out
OSC in
LB
SB
SB
D
M
U
M
U
X
X
WEST EAST
OMDX8100_M_L1_XS
OMDX8100_M_L1_XS a d d & d r o p
a d d & d r o p
MCC
8 x
OCC10
4 x WLA
or
4xANY_P
2xGE_FC
MCC
8 x
OCC10
4 x WLA
or
4xANY_P
2xGE_FC
8xGE

Figure 182: 8-channel OADM w/o protection block diagram

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
R
A
I
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
7
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
7
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8
E
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)
S
P
V
M
2
/
_
H

(
o
p
t
.
)

Figure 183: 8 DWDM channels OADM with EXP and SPV capabilities

With supervision and without expansion upgrade capabilities
Four set of channels are supported : L1, L2, S1, S2.
xx stands for the band used: L1, L2, S1, S2.
D
M
U
M
U
X
X
M
U
X
D
M
U
X
WEST EAST
OADM8100_M_xx_S OADM8100_M_xx_S
OSC in
OSC out
OSC out
OSC in
a d d & d r o p
a d d & d r o p
MCC
8 x
OCC10
4 x WLA
or
4xANY_P
2xGE_FC
MCC
8 x
OCC10
4 x WLA
or
4xANY_P
2xGE_FC
8xGE

Figure 184: 8 DWDM channels OADM w/o protection block diagram/2

S
P
V
M
(
2
,

_
H
)

(
o
p
t
.
)
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
R
A
FANS
49
O
A
D
M
8
1
0
0
_
M
_
x
x
_
S

W
e
s
t
O
A
D
M
8
1
0
0
_
M
_
x
x
_
S

E
a
s
t
I
U
I
C
U
I
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
T
r
a
n
s
p
o
n
d
e
r

c
h

8
W
T
r
a
n
s
p
o
n
d
e
r

c
h

8
E
T
r
a
n
s
p
o
n
d
e
r

c
h

7
W
T
r
a
n
s
p
o
n
d
e
r

c
h

7
E
T
r
a
n
s
p
o
n
d
e
r

c
h

6
W
T
r
a
n
s
p
o
n
d
e
r

c
h

6
E
T
r
a
n
s
p
o
n
d
e
r

c
h

5
W
T
r
a
n
s
p
o
n
d
e
r

c
h

5
E
T
r
a
n
s
p
o
n
d
e
r

c
h

4
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
E
T
r
a
n
s
p
o
n
d
e
r

c
h

2
W
T
r
a
n
s
p
o
n
d
e
r

c
h

2
E
T
r
a
n
s
p
o
n
d
e
r

c
h

1
W
T
r
a
n
s
p
o
n
d
e
r

c
h

1
E
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)

Figure 185: 8 DWDM channels OADM with supervision upgrade capability

8 DWDM or CWDM channels OADM with WLAs w/ or w/o protection
In case of the 8 DWDM channels OADM configuration is required, two OADM8100
or OMDX8100 mux/demux and 8 WLA3s with DWDM SFP have to be used.
In case of the optical protection is required, WLA3CDOP boards have to be used.
In case of the optical protection is not required WLA3CD boards have to be used.
In case of the 8 CWDM channels OADM configuration is required, two CMDX (8
CWDM channels mux/demux), 8 WLA2 or 8 WLA3s with CWDM SFPs have to be
used.
OACs are not used in pure CWDM configurations.
In case of the optical protection is required, WLA3CDOP or WLA2M_OP boards have
to be used.
In case of the optical protection is not required WLA3CD or WLA2M or WLA1C
boards have to be used.

ch1E
ch8E
OMDX8100 or
OADM8100 or
CMDX(2)-U-S
ch1E
ch8E
8xWLA2M_OP
8xWLA3CD_OP
D
M
U
X
M
U
X
D
M
U
X
WEST EAST
ch1W
ch8W
OMDX8100 or
OADM8100 or
CMDX(2)-U-S
ch1W
ch8W
OSC out OSC in
M
U
X
OSC out OSC in
(n-8) channels (only for DWDM)
n channels* n channels*
* up to 32 channels for DWDM systems
* up to 8 channels for CWDM systems
8 client
signals

Figure 186: 8 DWDM or CWDM channels OADM with WLAs w/ protection block
diagram
ch1E
ch8E
OMDX8100 or
OADM8100 or
CMDX(2)-U-S
ch1E
ch8E
8 client
signals
8xWLA2M
8xWLA3CD
D
M
U
X
M
U
X
D
M
U
X
WEST EAST
ch1W
ch8W
OMDX8100 or
OADM8100 or
CMDX(2)-U-S
ch1W
ch8W
OSC out OSC in
M
U
X
OSC out OSC in
n channels* n channels*
* up to 32 channels for DWDM systems
* up to 8 channels for CWDM systems
8 client
signals
8xWLA2M
8xWLA3CD
8xWLA1C 8xWLA1C

Figure 187: 8 DWDM or CWDM channels OADM with WLAs w/o protection block
diagram

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
S
P
V
M
2

(
o
p
t
.
)
*
U
I
C
U
I
C
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
*
R
A
I
* S P V M i s u s e d i n D W D M N E s , O S C i s u s e d i n C W D M N E s . N o O A C i n p u r e C W D M c o n f i g .
Figure 188: 8 DWDM or CWDM channels OADM with WLAs w/ or w/o protection

8 channels OADM with protection, 4xANY drawers protection
P
S
C
L
A
N
P
S
C
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S

W
e
s
t
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S

E
a
s
t
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
M
C
C

c
h

3
0

W
M
C
C

c
h

3
0

E
M
C
C

c
h

3
1

W
M
C
C

c
h

3
1

E
M
C
C

c
h

3
2

W
M
C
C

c
h

3
2

E
M
C
C

c
h

3
3

W
M
C
C

c
h

3
3

E
M
C
C

c
h

3
5

W
M
C
C

c
h

3
5

E
M
C
C

c
h

3
6

W
M
C
C

c
h

3
6

E
M
C
C

c
h

3
7

W
M
C
C

c
h

3
7

E
M
C
C

c
h

3
8

W
M
C
C

c
g
h

3
8

E
I n p r o t e c t e d c o n f ig u r a t io n , t h e O P C s h a v e t o b e p lu g g e d u n d e r t h e M A I N t r a n s p o n d e r .
O
P
C
O
P
C
O
P
C
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)
S
P
V
M
2
/
_
H

(
o
p
t
.
)

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
4

x

A
N
Y
4

x

A
N
Y
1 6 1 7 1 8 1 9 2 0 2 1
R
A
I
*
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
U
I
C
U
I
C
4

x

A
N
Y
4

x

A
N
Y
O
P
C
#
2
O
P
C
#
1
O
P
C
#
3
O
P
C
#
4
O
P
C
#
2
O
P
C
#
1
O
P
C
#
3
O
P
C
#
4
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
O
P
C
#
2
O
P
C
#
1
O
P
C
#
3
O
P
C
#
4
O
P
C
#
2
O
P
C
#
1

Figure 189: 8 channels OADM with protection, 4xANY drawers protection

8 DWDM channels west and 4 DWDM channels east
1
4
4
4
c
h
a
n
n
e
ls
4 channels
1
1
8
8
8
c
h
a
n
n
e
ls
8 channels
1
OADM4100_M_chy-z_S OADM8100_M_x_S
WEST EAST
OSC in
OSC out
OSC out
OSC in
c l i e n t s i g n a l s c l i e n t s i g n a l s
MCC
8 x
OCC10
4 x WLA
or
4xANY_P
2xGE_FC
MCC
4 x
OCC10
4 x WLA
or
4xANY_P
2xGE_FC
8xGE

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
A
D
M
8
1
0
0
_
M
_
x
x
_
S

W
e
s
t
O
A
D
M
4
1
0
0
_
M
_
c
h
y
-
z
_
S

E
a
s
t
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
S
P
V

m
a
n
a
g
e
n
e
m
e
n
t
T
r
a
n
s
p
o
n
d
e
r

c
h

8
W
T
r
a
n
s
p
o
n
d
e
r

c
h

7
W
T
r
a
n
s
p
o
n
d
e
r

c
h

6
W
T
r
a
n
s
p
o
n
d
e
r

c
h

5
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
E
T
r
a
n
s
p
o
n
d
e
r

c
h

2
W
T
r
a
n
s
p
o
n
d
e
r

c
h

2
E
T
r
a
n
s
p
o
n
d
e
r

c
h

1
W
T
r
a
n
s
p
o
n
d
e
r

c
h

1
E
O
P
C
O
P
C
O
P
C
O
P
C
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)

Figure 190: 8 West / 4 East channels OADM

12 protected DWDM channels OADM with supervision and expansion
The example of next fFigure 191 describes a configuration using the L1 band
mux/demux (OMDX8100) with supervision and expansion.
The same board location is available with any band (L1, L2, S1, S2) without
expansion.
xx stands for the band used: L2, S1, S2.
S
P
V
M
2
/
_
H

(
o
p
t
.
)
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
A
D
M
4
1
0
0
_
M
_
c
h
x
-
y
_
S
P
S
C
P
S
C
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S

W
e
s
t
L
A
N
L
A
N
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S

E
a
s
t
R
A
I
R
A
I
U
I
C
U
I
C

E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r

(
S
C
)
T
r
a
n
s
p
o
n
d
e
r

c
h

4
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
E
T
r
a
n
s
p
o
n
d
e
r

c
h

2
W
T
r
a
n
s
p
o
n
d
e
r

c
h

2
E
T
r
a
n
s
p
o
n
d
e
r

c
h

1
W
T
r
a
n
s
p
o
n
d
e
r

c
h

1
E
T
r
a
n
s
p
o
n
d
e
r

c
h

8
W
T
r
a
n
s
p
o
n
d
e
r

c
h

8
E
T
r
a
n
s
p
o
n
d
e
r

c
h

7
W
T
r
a
n
s
p
o
n
d
e
r

c
h

7
E
T
r
a
n
s
p
o
n
d
e
r

c
h

6
W
T
r
a
n
s
p
o
n
d
e
r

c
h

6
E
T
r
a
n
s
p
o
n
d
e
r

c
h

5
W
T
r
a
n
s
p
o
n
d
e
r

c
h

5
E
T
r
a
n
s
p
o
n
d
e
r

c
h

4
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
E
T
r
a
n
s
p
o
n
d
e
r

c
h

2
W
T
r
a
n
s
p
o
n
d
e
r

c
h

2
E
T
r
a
n
s
p
o
n
d
e
r

c
h

1
W
T
r
a
n
s
p
o
n
d
e
r

c
h

1
E
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)
O
A
D
M
4
1
0
0
_
M
_
c
h
x
-
y
_
S
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)

Figure 191: 12 protected DWDM channels OADM with SPV and w/o expansion
configuration

16 protected DWDM channels OADM with supervision and expansion
The example of next Figure 192 describes a configuration using the L1 band
mux/demux (OMDX8100) with supervision and expansion.
The same board location is available with any band (L1, L2, S1, S2) without
expansion. (see next Figure 193).
S
P
V
M
2
/
_
H

(
o
p
t
.
)
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S

W
e
s
t
P
S
C
P
S
C
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
O
M
D
X
8
1
0
0
_
M
_
S
2

W
e
s
t
L
A
N
L
A
N
O
M
D
X
8
1
0
0
_
M
_
S
2

E
a
s
t
R
A
I
R
A
I
U
I
C
U
I
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r

(
S
C
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
7
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
7
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0
E
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S

E
a
s
t
T
r
a
n
s
p
o
n
d
e
r

c
h

4
2
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
2
E
T
r
a
n
s
p
o
n
d
e
r

c
h

4
3
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
3
E
T
r
a
n
s
p
o
n
d
e
r

c
h

4
4
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
4
E
T
r
a
n
s
p
o
n
d
e
r

c
h

4
5
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
5
E
T
r
a
n
s
p
o
n
d
e
r

c
h

4
7
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
7
E
T
r
a
n
s
p
o
n
d
e
r

c
h

4
8
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
8
E
T
r
a
n
s
p
o
n
d
e
r

c
h

4
9
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
9
E
T
r
a
n
s
p
o
n
d
e
r

c
h

5
0
W
T
r
a
n
s
p
o
n
d
e
r

c
h

5
0
E
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)

Figure 192: 16 DWDM protected channels OADM with supervision and expansion
configuration

16 DWDM channels OADM with supervision and without expansion
Three set of channels are supported : L2, S1, S2.
xx and yy stands for the band used: L2, S1, S2.
yy has to be different from xx.
S
P
V

m
a
n
a
g
e
n
e
m
e
n
t

(
o
p
t
)
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
A
D
M
8
1
0
0
_
M
_
x
x
_
S

W
e
s
t
P
S
C
P
S
C
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
O
M
D
X
8
1
0
0
_
M
_
y
y
_
W
e
s
t
L
A
N
L
A
N
O
M
D
X
8
1
0
0
_
M
_
y
y
_
E
a
s
t
R
A
I
R
A
I
U
I
C
U
I
C

E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r

(
S
C
)
T
r
a
n
s
p
o
n
d
e
r

c
h

8
W
T
r
a
n
s
p
o
n
d
e
r

c
h

8
E
T
r
a
n
s
p
o
n
d
e
r

c
h

7
W
T
r
a
n
s
p
o
n
d
e
r

c
h

7
E
T
r
a
n
s
p
o
n
d
e
r

c
h

6
W
T
r
a
n
s
p
o
n
d
e
r

c
h

6
E
T
r
a
n
s
p
o
n
d
e
r

c
h

5
W
T
r
a
n
s
p
o
n
d
e
r

c
h

5
E
T
r
a
n
s
p
o
n
d
e
r

c
h

4
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
E
T
r
a
n
s
p
o
n
d
e
r

c
h

2
W
T
r
a
n
s
p
o
n
d
e
r

c
h

2
E
T
r
a
n
s
p
o
n
d
e
r

c
h

1
W
T
r
a
n
s
p
o
n
d
e
r

c
h

1
E
O
A
D
M
8
1
0
0
_
M
_
x
x
_
S

E
a
s
t
T
r
a
n
s
p
o
n
d
e
r

c
h

8
W
T
r
a
n
s
p
o
n
d
e
r

c
h

8
E
T
r
a
n
s
p
o
n
d
e
r

c
h

7
W
T
r
a
n
s
p
o
n
d
e
r

c
h

7
E
T
r
a
n
s
p
o
n
d
e
r

c
h

6
W
T
r
a
n
s
p
o
n
d
e
r

c
h

6
E
T
r
a
n
s
p
o
n
d
e
r

c
h

5
W
T
r
a
n
s
p
o
n
d
e
r

c
h

5
E
T
r
a
n
s
p
o
n
d
e
r

c
h

4
W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
E
T
r
a
n
s
p
o
n
d
e
r

c
h

2
W
T
r
a
n
s
p
o
n
d
e
r

c
h

2
E
T
r
a
n
s
p
o
n
d
e
r

c
h

1
W
T
r
a
n
s
p
o
n
d
e
r

c
h

1
E
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)

Figure 193: 16 DWDM channels OADM with supervision and without expansion
configuration

16 DWDM channels or mix C/DWDM (15 chs) OADM with WLAs w/ or w/o
protection
The 16 DWDM channels OADM configuration can be designed with four 8-channel
DWDM mux/demux (OMDX8100) and 16 WLA3 (protected or unprotected)
transponders equipped with DWDM SFP.
In unprotected configuration, sixteen channels are transmitted on west side, by means
of 8 unprotected WLAs (WLA3CD), and the other sixteen channels are transmitted on
east side, by means of the other 8 unprotected WLAs.
In protected configuration the sixteen channels are transmitted both on the west and
east sides, via 8 protected WLAs (WLA3CDOP).
The mixed 15-channel (CWDM / DWDM) terminal configuration with WLAs
requires:
two 8-channel DWDM mux/demux (OMDX8100 in L1 or S1 bands to be respectively
connected to the 1550nm and 1530nm ports of CMDX(2)
two 8-channel CWDM mux/demux, CMDX(2)
16 WLAs in unprotected configuration, 15 WLAs in protected configuration, taking into
account that WLA1 and WLA2 can only provide CWDM channels and WLA3 can provide
both DWDM and CWDM channels.
WLA3CDOP and WLA2M_OP have to be used only if the optical protection is
required.
WLA3CD ,WLA2M and WLA1C have to be used only if the optical protection is not
required.
Refer to block diagram of the two next Figures 194 and Figure 195.
OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
unused
unused
D
M
U
X
M
U
X
4 x
M
U
X
D
M
U
X
D
M
U
X
M
U
X
1550nm
1550nm
7 CWDM
4 x
CMDX(2)-U-S
8 chs
OSC in
OSC out
15 chs
mixed
(7 CWDM
channels
plus
8 DWDM
channels)
15 chs
mixed
1470nm
1610nm
1470nm
1610nm
CWDM
DWDM
W
W
(L1 band)
8 DWDM
client signals
client signals
L
A
3
OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
unused
unused
D
M
U
X
M
U
X
4 x
M
U
X
D
M
U
X
M
U
X
D
M
U
X
1550nm
1550nm
7 CWDM
4 x
CMDX2_S
8 chs
OSC in
OSC out
15 chs
mixed
(7 CWDM
channels
plus
8 DWDM
channels)
15 chs
mixed
1470nm
1610nm
1470nm
1610nm
CWDM
DWDM
W
W
(L1 band)
8 DWDM
client signals
client signals
L
A
3
L
A
L
A
7 CWDM chs 7 CWDM chs
CH1
CH7
CH1
CH7
CMDX(2)-U-S

Figure 194: Example of 15 C/DWDM mixed channels OADM with WLA boards w/o
protection


OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
unused
unused
D
M
U
X
M
U
X
M
U
X
D
M
U
X
D
M
U
X
M
U
X
1550nm
1550nm
8 chs
7 CWDM chs
OSC in
OSC out
15 chs
mixed
(7 DWDM
channels
plus
8 DWDM
channels)
15 chs
mixed
1470nm
1610nm
1470nm
1610nm
CWDM
DWDM
(L1 band)
OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
unused
unused
D
M
U
X
M
U
X
M
U
X
D
M
U
X
M
U
X
D
M
U
X
1550nm
1550nm
7 CWDM
CMDX2_S
8 chs
7 CWDM chs
OSC in
OSC out
15 chs
mixed
(7 DWDM
channels
plus
8 DWDM
channels)
15 chs
mixed
1470nm
1610nm
1470nm
1610nm
CWDM
DWDM
(L1 band)
8 DWDM
client signals
client signals
7 x
W
L
A
2
(3)
8 x
W
L
A
3
C
D
l
O
P
CH1
CH7
CH1
CH7
l
O
P
CMDX(2)-U-S CMDX(2)-U-S

Figure 195: Example of 15 C/DWDM mixed channels OADM with WLA boards w/
protection

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
U
I
C
U
I
C
W
L
A
W
L
A
W
L
A
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
R
A
I
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
O
S
C
* S P V M i s u s e d i n D W D M N E s , O S C i s u s e d i n m i x e d N E s .
S
P
V
M
2
/
_
H

(
o
p
t
.
)
*

Figure 196: 16 DWDM chs or 15 C/DWDM mixed chs OADM with WLAs w/ or w/o
protection

24 DWDM channels or mix C/DWDM (22 chs) OADM with WLAs w/ or w/o
protection
The 24 DWDM channels OADM configuration can be designed with six 8-channel
DWDM mux/demux (OMDX8100) and 24 WLA3 (protected or unprotected)
transponders equipped with DWDM SFP.
In unprotected configuration, 24 channels are transmitted on west side, by means of 12
unprotected WLAs (WLA3CD), and the other 24 channels are transmitted on east side,
by means of the other 12 unprotected WLAs.
In protected configuration the 24 channels are transmitted both on the west and east
sides, via 12 protected WLAs (WLA3CDOP).
The mixed 22-channel (CWDM / DWDM) terminal configuration with WLAs
requires:
four 8-channel DWDM mux/demux (OMDX8100 in L1 and S1 bands to be respectively
connected to the 1550nm and 1530nm ports of CMDX(2)
two 8-channel CWDM mux/demux, CMDX(2)

twenty-two WLAs both in protected and unprotected configuration, taking into account that
WLA1 and WLA2 can only provide CWDM channels and WLA3 can provide both DWDM
and CWDM channels.
required.
WLA3CD, WLA2M and WLA1C have to be used only if the optical protection is not
required.
Refer to block diagram of the previous and the next figure. Figure 197and Figure 195.
OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
unused
unused
D
M
U
X
M
U
X
8 x
W
L
A
3
8 x
W
L
A
3
M
U
X
D
M
U
X
6 CWDM
3 x
8 chs
OSC in
OSC out
22 chs
mixed
(6 CWDM
channels
plus
16 DWDM
channels)
22 chs
mixed
CWDM
DWDM
W
16 DWDM
client signals
client signals
OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
unused
unused
D
M
U
X
M
U
X
M
U
X
D
M
U
X CWDM
MUX
DEMUX
1550nm
1550nm
6 CWDM
3 x
8 chs
OSC in
OSC out
22 chs
mixed
(6CWDM
channels
plus
16 DWDM
channels)
22 chs
mixed
1470nm
1610nm
CWDM
DWDM
W
(L1 band)
16 DWDM
client signals
client signals
L
A
L
A
CH1
CH6
CH1
CH6
52
60
52
60
D
M
U
X
M
U
X
OMDX8100_M_S1
1530nm
1530nm
8 chs
(S1 band)
1470nm
1610nm
52
60
52
60
D
M
U
X
M
U
X
OMDX8100_M_S1
CWDM
MUX
DEMUX
1550nm
1550nm
1530nm
1530nm

protection

OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
unused
unused
D
M
U
X
M
U
X
M
U
X
D
M
U
X
8 chs
OSC in
OSC out
22 chs
mixed
(6 CWDM
channels
plus
16 DWDM
channels)
22 chs
mixed
CWDM
DWDM
OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
unused
unused
D
M
U
X
M
U
X
M
U
X
D
M
U
X CWDM
MUX
DEMUX
1550nm
1550nm
6 CWDM
8 chs
OSC in
OSC out
22 chs
mixed
(6CWDM
channels
plus
16 DWDM
channels)
22 chs
mixed
1470nm
1610nm
CWDM
DWDM (L1 band)
16 DWDM
client signals
client signals
CH1
CH6
CH1
CH6
52
60
52
60
D
M
U
X
M
U
X
OMDX8100_M_S1
1530nm
1530nm
8 chs
(S1 band)
1470nm
1610nm
52
60
52
60
D
M
U
X
M
U
X
OMDX8100_M_S1
CWDM
MUX
DEMUX
1550nm
1550nm
1530nm
1530nm
16 x
W
L
A
3
C
D
l
O
P
6 x
W
L
A
2
(3)
l
O
P

Figure 198: Example of 22 C/DWDM mixed channels OADM with WLA boards w/
protection

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
S
P
V
M
2

(
o
p
t
.
)
*
U
I
C
U
I
C
W
L
A
W
L
A
W
L
A
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
R
A
I
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
M
D
X
8
1
0
0
_
M
_
S
1

W
O
M
D
X
8
1
0
0
_
M
_
S
1

E
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
U
I
C
U
I
C
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
R
A
I
* S P V M i s u s e d i n D W D M N E s , O S C i s u s e d i n m i x e d N E s .

protection

32 channels or 30 C/DWDM mixed chs OADM/back-to-back terminal
The 32 DWDM channels OADM configuration with or without optical protection of
each channel, supervision and amplification can be designed with eigth 8-channel
DWDM mux/demux (OMDX8100) and 32 protected or unprotected WLA3s equipped
with DWDM SFP or 64 MCC3/OCC10_E/2xGE_FC/4xANY_P/TRBD1996 or 32
8xGE (8xGE supports add-drop with only one unit.
Up to 32 OPCs are required in case of MCC3/OCC10 client protection, up to 64 OPCs
are required in case of 2xGE_FC, 4xANY_P client protection.
Moreover, one OAC on west side and one OAC on east side is provided.
unprotected WLA3s (or 32 unprotected MCC3/OCC10..), and the other 32 channels
are transmitted on east side, by means of the other 16 unprotected WLA3s (or 32
uprotected MCC3/OCC10..).
sides, via 16 protected WLAs (WLA3CDOP) or 32/64 OPCs (according to the
transponders used).
In protected configuration, the OPCs have to be plugged under the MAIN
MCC3/OCC10; when are used and they are provisioned in slots #n and #n+1, OPC
have to be plugged in slot n+25; when 2xGE_FC is used, OPCs have to be plugged in
slots n+25 (client 1 protection) and n+24 (client 2 protection).
Two shelves are needed for configurations with only WLAs.
Four shelves are needed for configurations with only
MCC3/OCC10/TRBD1996/2xGE_FC/8xGE.
44 x 4xANY_P can be installed in four shelves (up to four shelves can be managed by
the NE).
The shelf configuration is shown in Figure 200.

The mixed 30-channel (CWDM / DWDM) OADM configuration with WLAs
requires:
six 8-channel DWDM mux/demux (OMDX8100 in L1, S1 and S2 bands to be connected to
the extra port of the CDMDX2
two 7-channel CWDM mux/demux, CDMDX2
30 WLAs both in protected and unprotected configuration, taking into account that WLA1
and WLA2 can only provide CWDM channels and WLA3 can provide both DWDM and
CWDM channels.
required.
required.
Refer to the block diagram of the two figures before the previous one.Figure 197 and
Figure 195.
The 30 mixed channels (6 CWDM plus 24 DWDM) OADM configuration can also
be provided with all the other transponder types (single channel transponders), taking
into account that MCC3, OCC10_E, TRBD1996 and 8xGE can only provide a DWDM
interface, OCC10_EC can only provide one CWDM interface, 4xANY_P and
2xGE_FC can provide both CWDM and DWDM interfaces (6 CWDM and 24 DWDM
interfaces per each side are required, thus 60 transponders are required).
Two shelves are needed for configurations with only WLAs.
Four shelves are needed for configurations with only
MCC3/OCC10/TRBD1996/2xGE_FC/8xGE.
44 x 4xANY_P can be installed in four shelves (up to four shelves can be managed by
the NE).

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
S
P
V
M
2
/
_
H

(
o
p
t
.
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8

E
T
r
a
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s
p
o
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d
e
r

c
h

3
8

W
T
r
a
n
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p
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d
e
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c
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3
7

E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
7

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6

E
T
r
a
n
s
p
o
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d
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c
h

3
6

W
T
r
a
n
s
p
o
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d
e
r

c
h

3
5

W
T
r
a
n
s
p
o
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d
e
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c
h

3
5

E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3

E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2

E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1

E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0

E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0

W
L
A
N
R
A
I
U
I
C
U
I
C
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
O
M
D
X
8
1
0
0
_
M
_
S
2
O
M
D
X
8
1
0
0
_
M
_
S
2
E
S
C

(
S
C
)
T
r
a
n
s
p
o
n
d
e
r

c
h

5
0

E
T
r
a
n
s
p
o
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d
e
r

c
h

5
0

W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
9

E
T
r
a
n
s
p
o
n
d
e
r

c
h

4
9

W
T
r
a
n
s
p
o
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d
e
r

c
h

4
8

E
T
r
a
n
s
p
o
n
d
e
r

c
h

4
8

W
T
r
a
n
s
p
o
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d
e
r

c
h

4
7

E
T
r
a
n
s
p
o
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d
e
r

c
h

4
7

W
T
r
a
n
s
p
o
n
d
e
r

c
h

4
5

E
T
r
a
n
s
p
o
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d
e
r

c
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4
5

W
T
r
a
n
s
p
o
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d
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r

c
h

4
4

E
T
r
a
n
s
p
o
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d
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r

c
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4
4

W
T
r
a
n
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p
o
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d
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r

c
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4
3

E
T
r
a
n
s
p
o
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d
e
r

c
h

4
3

W
T
r
a
n
s
p
o
n
d
e
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c
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4
2

E
T
r
a
n
s
p
o
n
d
e
r

c
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4
2

W
L
A
N
R
A
I
U
I
C
U
I
C
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
O
M
D
X
8
1
0
0
_
M
_
L
2
O
M
D
X
8
1
0
0
_
M
_
L
2
E
S
C

(
S
C
)
T
r
a
n
s
p
o
n
d
e
r

c
h

2
8

E
T
r
a
n
s
p
o
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d
e
r

c
h

2
8

W
T
r
a
n
s
p
o
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d
e
r

c
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2
7

E
T
r
a
n
s
p
o
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d
e
r

c
h

2
7

W
T
r
a
n
s
p
o
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d
e
r

c
h

2
6

E
T
r
a
n
s
p
o
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c
h

2
6

W
T
r
a
n
s
p
o
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d
e
r

c
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2
5

E
T
r
a
n
s
p
o
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d
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r

c
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2
5

W
T
r
a
n
s
p
o
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e
r

c
h

2
3

E
T
r
a
n
s
p
o
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d
e
r

c
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2
3

W
T
r
a
n
s
p
o
n
d
e
r

c
h

2
2

E
T
r
a
n
s
p
o
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d
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r

c
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2
2

W
T
r
a
n
s
p
o
n
d
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r

c
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2
1

E
T
r
a
n
s
p
o
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d
e
r

c
h

2
1

W
T
r
a
n
s
p
o
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d
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c
h

2
0

E
T
r
a
n
s
p
o
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d
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r

c
h

2
0

W
L
A
N
R
A
I
U
I
C
U
I
C
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
O
M
D
X
8
1
0
0
_
M
_
S
1
O
M
D
X
8
1
0
0
_
M
_
S
1
E
S
C

(
S
C
)
T
r
a
n
s
p
o
n
d
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r

c
h

6
0

E
T
r
a
n
s
p
o
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d
e
r

c
h

6
0

W
T
r
a
n
s
p
o
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d
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r

c
h

5
9

E
T
r
a
n
s
p
o
n
d
e
r

c
h

5
9

W
T
r
a
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s
p
o
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d
e
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c
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5
8

E
T
r
a
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s
p
o
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d
e
r

c
h

5
8

W
T
r
a
n
s
p
o
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d
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c
h

5
7

E
T
r
a
n
s
p
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d
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r

c
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5
7

W
T
r
a
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p
o
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d
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r

c
h

5
5

E
T
r
a
n
s
p
o
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d
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r

c
h

5
5

W
T
r
a
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s
p
o
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d
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c
h

5
4

E
T
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a
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s
p
o
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d
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c
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5
4

W
T
r
a
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p
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5
3

E
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a
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p
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5
3

W
T
r
a
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p
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c
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5
2

E
T
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a
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p
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c
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5
2

W
L
A
N
R
A
I
U
I
C
U
I
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
A
C

/

O
A
C
_
L
O
A
C

/

O
A
C
_
L
O
S
M
C

(
o
p
t
.
)

Figure 200: 32 protected DWDM chs back-to-back w/ SPV and protection and one
OAC per side

OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
D
M
U
X
M
U
X
12 x
M
U
X
D
M
U
X
6 CWDM
3 x
OSC in
OSC out
30 chs
mixed
(6 CWDM
channels
plus
24 DWDM
channels)
30 chs
mixed
CWDM
DWDM
W
W
client signals
L
A
3
12 x
DWDM
MUX
DEMUX
6 CWDM
3 x
CDMDX2-U-S
OSC in
OSC out
30chs
mixed
(6CWDM
channels
plus
24 DWDM
channels)
30 chs
mixed
1470nm
1610nm
CWDM
W
W
24 DWDM
client signals
client signals
L
A
3
L
A
L
A
1470nm
1610nm
52
60
52
60
D
M
U
X
M
U
X
OMDX8100_M_S1
CDMDX2-U-S
DWDM
MUX
DEMUX
OMDX8100_M_S2
42
50
42
50
D
M
U
X
M
U
X
S2
S2
24 DWDM
client signals
L1
OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
D
M
U
X
M
U
X
M
U
X
DWDM
52
60
52
60
D
M
U
X
M
U
X
OMDX8100_M_S1
OMDX8100_M_S2
42
50
42
50
D
M
U
X
M
U
X
S2
D
M
U
X
L1
C H 1 *
C H 6 *
C H 1 *
C H 6 *
* 1 4 7 0 , 1 4 9 0 , 1 5 1 0 , 1 5 7 0 , 1 5 9 0 , 1 6 1 0 n m a r e t h e C W D M w a v e l e n g t h s m a n a g e d b y t h e
C / D W D M m u x / d e m u x ( C D M D X 2 , C D M D X 2 _ S )
CWDM/ CWDM/

Figure 201: Example of 30 C/DWDM mixed channels OADM with WLAs w/o
protection

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
S
P
V
M
2

(
o
p
t
.
)
*
U
I
C
U
I
C
W
L
A
W
L
A
W
L
A
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
R
A
I
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
U
I
C
U
I
C
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
R
A
I
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
I n 3 0 C / D W D M m i x e d c h a n n e l c o n f ig u r a t i o n , f o u r 8 - c h a n n e l m u x / d e m u x h a v e t o b e r e p l a c e d
b y f o u r 7 - c h a n n e l m u x d e m u x ( C D M D X 2 )
protection

8 C/DWDM mixed chs OADM/back-to-back terminals
The mixed 38-channel (CWDM / DWDM) OADM configuration with or without
optical protection of each channel, supervision and amplification can be designed with:
eigth 8-channel DWDM mux/demux (OMDX8100 in L1, L2, S1 and S2 bands) to be
connected to the extra port of the CDMDX2s
two 7-channel CWDM mux/demux, CDMDX2
38 WLAs both in protected and unprotected configuration, taking into account that WLA1
and WLA2 can only provide CWDM channels and WLA3 can provide both DWDM and
CWDM channels.
required.
required.
Three shelves are needed for configurations with only WLAs.
Refer to the block diagrams of the next fFigure 203 and Figure 204.
unprotected WLAs and the other 38 channels are transmitted on east side, by means of
the other 19 unprotected WLAs.
sides, via 19 protected WLAs (WLA3CDOP, WLA2M_OP).
The 38 mixed channels (6 CWDM plus 32 DWDM) OADM configuration with only
single channel transponders is not supported, as up to four shelves can be managed by
the NE.

OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
D
M
U
X
M
U
X
16 x
W
L
A
3
16 x
W
L
A
3
M
U
X
D
M
U
X
6 CWDM
3 x
OSC in
OSC out
38 chs
mixed
(6 CWDM
channels
plus
32 DWDM
channels)
38 chs
mixed
CWDM
DWDM
W
client signals
DWDM
MUX
DEMUX
6 CWDM
3 x
CDMDX2-U-S
OSC in
OSC out
38 chs
mixed
(6CWDM
channels
plus
32 DWDM
channels)
38 chs
mixed
1470nm
1610nm
CWDM
W
32 DWDM
client signals
client signals
L
A
L
A
1470nm
1610nm
52
60
52
60
D
M
U
X
M
U
X
OMDX8100_M_S1
CDMDX2-U-S
DWDM
MUX
DEMUX
OMDX8100_M_S2
42
50
42
50
D
M
U
X
M
U
X
S2
32 DWDM
client signals
OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
D
M
U
X
M
U
X
M
U
X
DWDM
52
60
52
60
D
M
U
X
M
U
X
OMDX8100_M_S1
OMDX8100_M_S2
42
50
42
50
D
M
U
X
M
U
X
S2
D
M
U
X
C H 1 *
C H 6 *
C H 1 *
C H 6 *
* 1 4 7 0 , 1 4 9 0 , 1 5 1 0 , 1 5 7 0 , 1 5 9 0 , 1 6 1 0 n m a r e t h e C W D M w a v e l e n g t h s m a n a g e d b y t h e
C / D W D M m u x / d e m u x ( C D M D X 2 , C D M D X 2 _ S )
CWDM/ CWDM/
OMDX8100_M_L2
20
28
20
28
D
M
U
X
M
U
X
L2
OMDX8100_M_L2
20
28
20
28
D
M
U
X
M
U
X
L2
L1 L1
S1 S1

protection

P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
U
I
C
U
I
C
W
L
A
W
L
A
W
L
A
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
R
A
I
M
U
X
/
D
E
M
U
X

7

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
R
A
I
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

7

c
h
a
n
n
e
l
s
M
U
X
/
D
E
M
U
X

8

c
h
a
n
n
e
l
s
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
O
S
C
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
W
L
A
R
A
I
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
C

(
o
p
t
.
)

Figure 204: 38 C/DWDM mixed channels OADM with WLAs w/ or w/o protection

Repeater with supervision
W D M
L i n e
O S C
S P V M
O S C
P r e a m p
P r e a m p B o o s t e r
B o o s t e r
O A C 1 O A C 2
O S C
e x t r a c t i o n
O S C
i n s e r t i o n
O S C
e x t r a c t io n
V O A
V O A
O S C
i n s e r t i o n
W D M
L i n e
A t t e n u a t o r
o r D C U
A t t e n u a t o r
o r D C U

S
P
V

m
a
n
a
g
e
n
e
m
e
n
t

(
o
p
t
)
P
S
C
P
S
C
L
A
N
25 26 27 28 29 30 31
H
K
FANS
49
R
A
I
O
A
C
O
A
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4

Figure 205: Repeater with supervision

Configurations with MVAC
MVAC boards can be used for three main applications:
transponder emphasis:
- pre-emphasis (at WDM Tx output): MVAC10 or MVAC10_2.
- post-emphasis (at WDM Rx input): MVAC10 or MVAC2 but MVAC10_2
mandatory with XFP.
channel loop power adjustement: MVAC2 or MVAC10 or MVAC10_2.
band loop power adjustement: (extra and expansion pass-through) : MVAC2.
-extra-loop
expansion-loop
The default configuration depends on the configuration.
Terminal configuration without protection
In this case the MVACs are used for transponder emphasis only.
The MVACs are placed in the adjacent slot of the concerned transponder.
S
P
V
M
2
/
_
H

(
o
p
t
.
)
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S
L
A
N
R
A
I
U
I
C
U
I
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8
M
V
A
C

c
h

3
8

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
7
M
V
A
C

c
h

3
7

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6
M
V
A
C

c
h

3
6

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5
M
V
A
C

c
h

3
5

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3
M
V
A
C

c
h

3
3

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
M
V
A
C

c
h

3
2

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1
M
V
A
C

c
h

3
1

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0
M
V
A
C

c
h

3
0

(
e
m
p
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)
2 4

Figure 206: 8 DWDM channels terminal configuration with MVAC boards


S
P
V
M
2
/
_
H

(
o
p
t
.
)
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
A
D
M
4
1
0
0
_
M
_
c
h
x
-
y
_
S
L
A
N
R
A
I
U
I
C
U
I
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
4
x
A
N
Y
_
P
4
x
A
N
Y
_
P
4
x
A
N
Y
_
P
4
x
A
N
Y
_
P
M
V
A
C
M
V
A
C
M
V
A
C
M
V
A
C
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)

Figure 207: 4 DWM channels LT configuration with 4xANY_P (first channels of an
8-ch band)

In a 16 DWDM channels terminal we must add a second shelf to place the MVAC
boards, as shown in Figure 208.
S
P
V
M
2
/
_
H

(
o
p
t
.
)
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S
P
S
C
P
S
C
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
O
M
D
X
8
1
0
0
_
M
_
S
2
L
A
N
L
A
N
R
A
I
R
A
I
U
I
C
U
I
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r

(
S
C
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8
M
V
A
C

c
h

3
8

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
7
M
V
A
C

c
h

3
7

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6
M
V
A
C

c
h

3
6

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5
M
V
A
C

c
h

3
5

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
3
M
V
A
C

c
h

3
3

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
2
M
V
A
C

c
h

3
2

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1
M
V
A
C

c
h

3
1

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0
M
V
A
C

c
h

3
0

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

4
2
M
V
A
C

c
h

4
2

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

4
3
M
V
A
C

c
h

4
3

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

4
4
M
V
A
C

c
h

4
4

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

4
5
M
V
A
C

c
h

4
5

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

4
7
M
V
A
C

c
h

4
7

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

4
8
M
V
A
C

c
h

4
8

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

4
9
M
V
A
C

c
h

4
9

(
e
m
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

5
0
M
V
A
C

c
h

5
0

(
e
m
p
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)

Figure 208: 16 channels terminal with MVAC boards

OADM configuration without protection
a. MVAC for transponder emphasis
OADM configuration (with or without protection) use adjacent slots for
transponders. In this case the MVAC boards must be placed in an expansion shelf
under the pair of transponders considered.
The even slot will be used by default for the pre-emphasis of the two transponders
The odd slot will be used by default for the post-emphasis of the two transponders
Should the pre-emphasis not be required, half the MVAC boards are saved.
b. MVAC for channel loop
For a loop connection we remove a pair of transponders and place an MVAC in the
even slot.
c. MVAC for extra or expansion loop
For an extra or expansion loop, the default slots for MVAC boards are:
MVAC for extra loop; slot 5, 13 (by default) or 21
MVAC for expansion loop: slot 4, 12 (by default) or 20
N.B. slots 12 and 13 of a first expansion shelf are available only if the
configuration does not need double stage amplifiers at both sides of the OADM (=
OADM inside OFA inter-stage).
S
P
V
M
2
/
_
H

(
o
p
t
.
)
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S
P
S
C
P
S
C
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
L
A
N
L
A
N
R
A
I
R
A
I
U
I
C
U
I
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r

(
S
C
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0

W
M
V
A
C

c
h

3
0

(
p
r
e
-
e
m
p
)
M
V
A
C

c
h

3
1

(
p
r
e
-
e
m
p
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
0

E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1

E
M
V
A
C

c
h

3
2

(
c
h

l
o
o
p
)
M
V
A
C

c
h

3
3

(
c
h

l
o
o
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5

E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6

E
M
V
A
C

c
h

3
7

(
c
h

l
o
o
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8

E
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S
M
V
A
C

c
h

3
0

(
p
o
s
t
-
e
m
p
)
M
V
A
C

c
h

3
1

(
p
o
s
t
-
e
m
p
)
M
V
A
C

(
e
x
p

l
o
o
p
)
M
V
A
C

c
h

3
5

(
p
r
e
-
e
m
p
)
M
V
A
C

(
e
x
t
r
a

l
o
o
p
)
M
V
A
C

c
h

3
5

(
p
o
s
t

e
m
p
)
M
V
A
C

c
h

3
6

(
p
r
e
-
e
m
p
)
M
V
A
C

c
h

3
8

(
p
r
e
-
e
m
p
)
M
V
A
C

c
h

3
6

(
p
o
s
t
-
e
m
p
)
M
V
A
C

c
h

3
8

(
p
o
s
t
-
e
m
p
)
* S e e n o t e s

Figure 209: 8 DWDM channels OADM with MVAC boards: OADM inside OFA inter-
stage

Notes on Figure 209.
MVAC in slot 4 (and 6) of expansion shelf is used for the pre-emphasis of ch 30 (and ch 31)
MVAC in slot 5 (and 7) of expansion shelf is used for the post-emphasis of ch 30 (and ch 31)
MVAC in slot 12 of expansion shelf is used for expansion loop optical power adjustment
MVAC in slot 13 of expansion shelf is used for extra loop optical power adjustment.
S
P
V
M
(
2
,
_
H
)

(
o
p
t
.
)
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
H
K
FANS
49
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S
P
S
C
P
S
C
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
FANS
49
L
A
N
L
A
N
R
A
I
R
A
I
U
I
C
U
I
C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r

(
S
C
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1

W
M
V
A
C

(
e
x
p

l
o
o
p
)
M
V
A
C

c
h

3
1

(
p
r
e
-
e
m
p
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
S
M
C

(
0
p
t
.
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
1

E
M
V
A
C

c
h

3
2

(
c
h

l
o
o
p
)
M
V
A
C

c
h

3
3

(
c
h

l
o
o
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
5

E
T
r
a
n
s
p
o
n
d
e
r

c
h

3
6

E
M
V
A
C

c
h

3
7

(
c
h

l
o
o
p
)
T
r
a
n
s
p
o
n
d
e
r

c
h

3
8

E
O
M
D
X
8
1
0
0
_
M
_
L
1
_
X
S
M
V
A
C

(
e
x
t
r
a
-
l
o
o
p
)
M
V
A
C

c
h

3
1

(
p
o
s
t
-
e
m
p
)
M
V
A
C

c
h

3
5

(
p
r
e
-
e
m
p
)
M
V
A
C

c
h

3
5

(
p
o
s
t

e
m
p
)
M
V
A
C

c
h

3
6

(
p
r
e
-
e
m
p
)
M
V
A
C

c
h

3
8

(
p
r
e
-
e
m
p
)
M
V
A
C

c
h

3
6

(
p
o
s
t
-
e
m
p
)
M
V
A
C

c
h

3
8

(
p
o
s
t
-
e
m
p
)
* S e e n o t e s
M
V
A
C

c
h

3
0

(
c
h

l
o
o
p
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)
O
A
C

/

O
A
C
_
L

(
o
p
t
.
)

Figure 210: 8 DWDM channels OADM with MVACs: OADM between 2 double stages
OFAs

Notes on Figure 210.
ch 30 is a channel loop connection. The transponders in slots 4-5 are replaced by an MVAC in
slot 4
MVAC in slot 6 of expansion shelf is used for the pre-emphasis of ch 31
MVAC in slot 7 of expansion shelf is used for the post-emphasis of ch 31
MVAC in slot 4 of expansion shelf is used for expansion loop optical power adjustment
MVAC in slot 5 of expansion shelf is used for extra loop optical power adjustment.
4 x ANY node configuration
Without drawers protection
E
S
C
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
U
I
U
I
H
K
R
A
FANS
49
L
A
N I
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y

Figure 211: 4 x ANY node configuration without drawers protection


With drawers protection
E
S
C
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
U
I
U
I
H
K
R
A
FANS
49
I
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
4

x

A
N
Y
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C
O
P
C

Figure 212: 4 x ANY node configuration with drawers protection

OPC location for drawers protection
drawer 1: 31, 35, 39, 43
drawer 2: 30, 34, 38, 42
drawer 3: 28, 32, 40, 44
drawer 4: 29, 33, 41, 45.
4xANY boards can be partially protected (drawers 3 & 4 for the 1st couple, drawers 1
& 2 for the 2nd couple).
1696 MS_C (Compact Shelf) configurations examples
The 1696MS_C must be able to set many different configurations
Terminals
- up to 14 unprotected channels LT without supervision, with single channel
transponders
- up to 12 unprotected channels LT with supervision, with single channel
transponders
- up to 4 unprotected channels LT with supervision in one shelf, with single channel
transponders
- up to 28 unprotected channels LT without supervision, with dual channel
transponders
- up to 24 unprotected channels LT with supervision, with dual channel transponders
- up to 8 unprotected channels LT with supervision in one shelf, with dual channel
transponders
Back-to-back terminals or OADM with/without protection
- up to 6 channels back-to-back terminal or OADM, with single channel
transponders
- up to 12 channels back-to-back terminal or OADM, with dual channel transponders
- asymmetrical configurations are allowed (i.e. 2 channels west and 1 channel east)
CPE (Customer Premises Equipment) configurations
In Line Repeater
Supervision manager.
These configurations are preferably exploited with a 1696MS_C but they can be
implemented in a 1696MS, too.
- Remote 4xAny/2xGE_FC (unprotected)
- Remote 4xAny/2xGE_FC + Protection MCC on 1310 nm or 1550 nm
- Remote MCC or MCC+4xANY (or 2xGE_FC)
- OADM 1/2/4(1/2/4 channel with or without protection)
- Remote 4xANY (or 2xGE_FC) + MCC
- One protected transponder (one signal on 2 channels)
- Back-to-back 4xANY
- SPV manager (used to connect a SH Manager to supervise the ring).

- 2-channel terminal: MCC + 4xANY (or 2xGE_FC) with drawers protection
1696MS or 1696MS_C configured to connect a CPE or a 1696MS_C in a small ring
- 1696MS or1696MS_C receiving/emitting a supervised black-and-white signal
- 1696MS or 1696MS_C receiving/emitting a supervised colored signal
- 1696MS or 1696MS connected to a 1696MS_C located in a small ring
- 1696MS as a remotization
Two 1696MS or 1696MS_C rings connected together
- With supervision through optical link (DCC)
- With supervision through electrical link (LAN_Q)
Some of these configurations are described hereafter.
N.B. If equipped with WDM SFP modules, also the 4xAY_P and 2xGE_FC can
be considered as transponders, but it will not shown in all the following figures for
semplicity reasons.
Examples of Line Terminal configurations
4 DWDM or CWDM channel terminal without SPV
The 4-channel terminal block diagram is shown in Figure 154.
F

A

N

_
C
PSC(2)
PSC(2)
LAN_Q
HK
RAI
7
8
9
10
11
12
13
OMDX8100_M_L1_X or CMDX2

ESC
Transponder ch 1
Transponder ch 2
Transponder ch 4
Transponder ch 3
1
2
3
5
6
4

Figure 213: 4 DWDM or CWDM channel terminal w/o SPV configuration

8-channel terminal
For further details on 8-channel terminal configuration (and block diagrams) refer to 8
CWDM or DWDM channels terminal with expansion, supervision and user interface.
8-channel terminal with SPV and OAC
F

A

N

_
C
PSC(2)
PSC(2)
LAN_Q
HK
RAI
7
8
9
10
11
12
1
2
3
5
6
13
F

A

N

_
C
PSC2
PSC2 7
8
9
10
11
12
1
2
3
4
5
6
13
F

A

N

_
C
PSC2
PSC2 7
8
9
10
11
12
1
2
3
4
5
6
13
8 channels
OSC in
OSC out
OMDX8100_M_L1_XS
LB
LB
SB
SB
30
38
30
38
D
M
U
M
U
X
X
D
M
U
M
U
X
X
OAC OAC
OFA OFA
EXP
client
signals
UNUSED
UNUSED
L2 UNUSED
L2 UNUSED
OFA OFA
4
OMDX8100_M_L1_XS

OAC / OAC_L (optional)

ESC
I-Link_M
I-Link_S
Transponder ch 1
Transponder ch 2
Transponder ch 4
Transponder ch 3
Transponder ch 8
I-Link_S
Transponder ch 7
Transponder ch 5
Transponder ch 6
SPVM2, SPVM_H
MCC
8 x
OCC10
4 x WLA
or
2xGE_FC
8xGE


Figure 214: 8 DWDM channel terminal with SPV and OAC

8 DWDM or CWDM chs terminal with WLAs (w/ or w/o protection) w/o SPV
LAN_Q
HK
RAI
F

A

N

_
C
PSC2
PSC2 7
8
9
10
11
12
13
ESC
WLA
WLA
WLA
WLA
1
2
3
4
5
6
MUX/DEMUX8-channel

Figure 215: 8 D/CWDM channels terminal with WLAs (w/ or w/o protection) w/o
SPV

8 DWDM or CWDM chs terminal with WLAs (w/ or w/o protection) with SPV
and OAC
F

A

N

_
C
7
8
9
10
11
12
13
F

A

N

_
C
PSC2
PSC2 7
8
9
10
11
12
13
OMDX8100_M_L1_XS or CMDX2

ESC
I-Link_M
I-Link_S
WLA
WLA
WLA
WLA
SPVM_H*
1
2
3
5
6
1
2
3
4
5
6
4
PSC(2)
PSC(2)
LAN_Q
HK
RAI
Figure 216: 8 D/CWDM channels terminal with WLAs (w/ or w/o protection) with
SPV

12 unprotected channels terminal without SPV

OADM8100_L1_X
LB
LB
SB
SB
1
4
30
38
30
38
1
4
D
M
U
M
U
X
X
D
M
U
M
U
X
X
OADM4100_M_chx-y_S
D
M
U
M
U
X
X
EXP
client
signals
client
signals
UNUSED
UNUSED
Transponder ch 33
F

A

N

_
C
PSC(2)
PSC(2)
LAN_Q

ESC
HK
Transponder ch 32
Transponder ch 30
Transponder ch 31
RAI
7
8
9
10
11
12
1
2
3
4
5
13
F

A

N

_
C
PSC2
PSC2

I-Link_S
Transponder ch 35
Transponder ch 36
7
8
9
10
11
12
1
2
3
4
5
6
13
F

A

N

_
C
PSC2
PSC2 7
8
9
10
11
12
13
Transponder ch 38
Transponder ch 37
I-Link_M
6
OADM8100_L1_X
1
2
3
4
5
6
Transponder ch 4
I-Link_S
Transponder ch 3
Transponder ch 1
Transponder ch 2
OADM4100_M_chx-y _S
MCC
4 x
OCC10
4 x WLA
or
2xGE_FC
8xGE
MCC
4 x
OCC10
4 x WLA
or
2xGE_FC
8xGE


Figure 217: 12-channel terminal without SPV

16 DWDM channels or mix C/DWDM (15 chs) terminal with WLAs with SPV
and OAC
For configuration description and block diagram refer to 16 DWDM channels or mix
C/DWDM (15 chs) terminal with LA boards.


Figure 218: 16 DWDM channels or mix C/DWDM (15 chs) terminal with WLAs with
SPV+OAC

OADM 4 channels protected back-to-back with supervision and OAC
sides. OACs are not used in CWDM configurations.

Mx/DMx 4ch
D
M
U
M
U
X
X
M
U
X
D
M
U
X
n channels
WEST EAST
OADM4100_M_chx-y_S OADM4100_M_chx-y_S
n-4 ch
n-4 channels
4 a d d & d r o p p r o t e c t e d c l i e n t s i g n a l s
OPC
OSC out
OAC
OSC in
OFA
Mx/DMx 4ch
OFA
n channels
OFA
OSC out
OFA
OSC in
OAC
OPC OPC OPC
MCC
4 x
WLA
OCC10
2 x
or
MCC
4 x
WLA
OCC10
2 x
or

F

A

N

_
C
PSC(2)
PSC(2)
LAN_Q
HK
RAI
7
8
9
10
11
12
13
F

A

N

_
C
PSC2
PSC2 7
8
9
10
11
12
13
F

A

N

_
C
PSC2
PSC2 7
8
9
10
11
12
13
OPC
OPC
OPC
OPC
OADM4100_M_chx-y _S
ESC
SPVM2 / SPVM_H
OAC / OAC_L (opt)
OAC / OAC_L (opt)
I-Link_S
I-Link_M
1
2
3
4
5
1
6
Transponder ch 1 E
Transponder ch 1 W
Transponder ch 2 W
Transponder ch 2 E
Transponder ch 4 W
I-Link_S
Transponder ch 4 E
Transponder ch 3 E
Transponder ch 3 W
OADM4100_M_chx-y _S
2
3
4
5
6
1
2
3
4
5
6

Figure 219: OADM 4 channels protected back-to-back with supervision and OAC

CPE (Customer Premises Equipment) configurations
Remote 4xANY_P or Remote 2xGE_FC
In this case, OADM is not needed since the data signal is carried by a Black &
white 1310 nm wavelength. The OSC is extracted to/from the 1310 nm data signal on
a special 1310/1510 filter SPV_F_C card. OSC is managed by the SPVM board.
F

A

N

_
C
PSC
PSC
LAN_Q
SPV_F_C
HK
RAI
SPVM
4
x
A
N
Y
_
P

o
r

2
x
G
E
_
F
C
UI
UI CPE
SPV_F_C
1310 nm
1310 nm
OSC
1510 nm
1310
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
to/from
SPVM
4xANY or 2xGE_FC
SPVF
SPVF
MCC
SPVM
SPVM
MCC
UI
1310 nm
1550 nm
1310 nm
1696MS
1696MS_C
1696MSPAN
SPVM
4xANY


Figure 220: Unprotected remote 4xANY or 2xGE_FC

Two remote 4xANY
F

A

N

_
C
PSC
PSC
LAN_Q
SPV_F_C
HK
RAI
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
SPVM
4xANY
4xANY

Figure 221: Two remote 4xANY

Remote transponder or MCC+4xANY or MCC + 2xGE_FC w/o protection
The situation is the same with or without the 4xANY or 2xGE_FC board : the signal
transmitted from the CPE to the 1696MS in a core ring or in a point-to-point
configuration is colored and carries a 1510 nm OSC.
The Remote MCC is connected to the Metro ring via one MCC or directly from the
WDM path. This configuration allows a greater Span Budget.
M
C
C
SPVM
4
x
A
N
Y
_
P

o
r

2
x
G
E
_
F
C
UI
UI
CPE
SPV_F-C
Colored signal
F

A

N

_
C
PSC
PSC
LAN_Q

SPV_F_C
HK
RAI
SPVM
4xANY
MCC
1550
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
OSC
1510 nm
SPVM
4xANY_P or 2GE_FC
SPVF
SPVF
MCC
SPVM
SPVM
MCC
UI
1310 nm
1550 nm
1310 nm
1696MS
1696MS_C
MCC
1550 nm


Figure 222: Unprotected remote transponder or MCC+(4xANY or 2xGE_FC)

Remote 4xANY or remote 2xGE_FC plus MCC
In this configuration, the CPE supports 2 data channels, one from the 4xANY_P board
(B&W) or 2xG_FC (B&W), and one from the MCC (colored). The
SPV_F_1310_1550 enables to insert/extract them with an OSC. Thus the fiber carries
3 wavelengths : 1510 (OSC), 15xx (transponders with coloured interface) and 1310
(4xANY_P or 2xGE_FC with B&W aggregate interface).
F

A

N

_
C
PSC
PSC
LAN_Q

HK
RAI
SPVM
4xANY
MCC
M
C
C
MCC+4xANy_P or 2xGE_FC
4
x
A
N
Y
_
P

o
r

2
x
G
E
_
F
C
UI
UI
CPE
SPV_F
1310_1550
SPV_F_1310_1550
E
q
u
ip
m
e
n
t

S
h
e
lf

C
o
n
t
r
o
lle
r
SPVM
SPV_F
1550 nm SPVM
MCC
UI
OSC
1696MS_C
4xANY_P
UI
1310 nm
1550 nm + 1310 nm + OSC
1310+1550
or 2xGE_FC


Figure 152 223: Remote MCC or (MCC or 2xGE_FC)+4xANY_P: 3 signals
multiplexed by SPV_F

One protected transponder
In this configuration OPC card is used to protect transponder cards. The same signal is
launched into the fiber on two different wavelengths. This configuration is used in a
point-to-point link.
F

A

N

_
C
PSC
PSC
LAN_Q

HK
RAI SPVM
MCC /OCC10/TRBD spare
MCC/OCC10 main
M
C
C
/
O
C
C
1
0
/
T
R
B
D
SPVM
M
C
C
/
O
C
C
1
0
/
T
R
B
D
User
To/from CPE
Not from 1696 ring
CPE
OPC
OPC
interf ace
User
interf ace
OPC
S P V M m u s t b e s e t i n s l o t 4 o f t h e m a s t e r s h e l f w h e n i t i s l i n k e d t o O A D M b o a r d
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
OADM1100_M_xx_S
MCC/OCC10/TRBD MCC/OCC10/TRBD
SPVM
OADM1
User
OPC
1696MS_C
One protected transponder on the same fiber (2 wavelengths) with OADM 2-channel


Figure 153224: One protected transponderon the same fiber (2 channel
wavelengths)

In this case an OADM is needed to multiplex the main signal and the spare in one fiber
if only one fiber is used. When two fibers are available, the main and spare signals do
not need to be launched in the same fiber, and they also do not need to have different
wavelengths.
Back-to-back 4xANY
This configuration is designed to drop/(insert) some of the 4 services carried by the
4XANY functionality. The others are by-passed to a second 4XANY board to be
launched to their destination. In the following figure, 2 services are dropped (inserted)
and 2 are passed-through.
N.B. Less than 4 services can be carried.
4xANY
SPVM
4
x
A
N
Y
UI
UI
CPE
4
x
A
N
Y
4xANY
SPV_F_C
SPV_F_C
F

A

N

_
C
PSC
PSC
LAN_Q
SPV_F_C
HK
SPVM
4xANY
4xANY
SPV_F_C
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
SPVM


Figure 151226225: B-to-b 4XANY used to drop some of the carried services and
by-pass the others

Remote unprotected MCC
Transp 1550 nm 1696MS
OADM
OADM
SPVM
SPVF
SPVM
SPVM
SPVF
Transponder
1696MS_C
1550 nm + OSC
OSC
4 ch West
Transp
4 ch East
ch.2E
Transp
Transp

S
P
V
M
2
/
_
H
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31 3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
U
I
U
I
H
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R
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FANS
49
O
A
D
M
4
1
0
0
_
M
_
c
h
x
-
y
_
S

W
I
O
A
D
M
4
1
0
0
_
M
_
c
h
x
-
y
_
S

E
S
P
V
M
2

/

S
P
V
M
_
H
S
P
V
F

A

N

_
C
PSC
PSC
LAN_Q

SPV_F_C
HK
RAI
SPVM
Transponder ch 1
4 5 :
SPV Filter
E
q
u
ip
m
e
n
t

S
h
e
lf

C
o
n
t
r
o
lle
r
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
T
r
a
n
s
p
o
n
d
e
r

c
h

1

W
T
r
a
n
s
p
o
n
d
e
r

c
h

1

E
T
r
a
n
s
p
o
n
d
e
r

c
h

2

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3

W
T
r
a
n
s
p
o
n
d
e
r

c
h

2

E
T
r
a
n
s
p
o
n
d
e
r

c
h

4

W
T
r
a
n
s
p
o
n
d
e
r

c
h

4

E
T
r
a
n
s
p
o
n
d
e
r

c
h

3

E

Figure 226155: Remote unprotected MCC

1 protected channel OADM
sides.

F

A

N

_
C
PSC
PSC
LAN_Q
OPC
HK
RAI
Transponder Transponder
1310 nm
1550 nm
1696MS_C
SPVM
OADM1
OADM1
User
OPC
OADM1100_M_chx_S

ESC
SPVM
Transponder E
Transponder W
OADM1100_M_chx_S
(OSC)
S P V M i s u s e d i n D W D M N E s , O S C i s u s e d i n C W D M a n d m i x e d N E s
S P V M i s u s e d i n D W D M N E s , O S C i s u s e d i n C W D M a n d m i x e d N E s

Figure 227156: OADM 1 channel protected back-to-back (DWDM)

Remote 4xANY (or 2xGE_FC) + Protected MCC
The remote 4xANY_P (or 2xGE_FC) + protected MCC is the combination with the 2
MCC protected at each other with an OPC on different NE, and use of the 4xANY_P
(or 2xGE_FC) on the User side.

MCC MCC
1550 nm
1696MS
OADM
OADM
SPVM
SPVF
SPVM
MCC
1550 nm
1696MS
OADM
OADM
SPVM
SPVF
SPVM
SPVM
4xANY (2xGE_FC)
SPVF
UI
MCC
1696MS_C
1310 nm
MCC
OPC
SPVF
1310 nm on WDM side

Figure 152229228: Remote Spur 4xANY (or 2xGE_FC) + protected MCC on 1310
nm

MCC
1550 nm
1696MS
OADM
OADM
SPVM
SPVF
SPVM
1550 nm
1696MS
OADM
OADM
SPVM
SPVF
SPVM
SPVM
4xANY (2xGE_FC)
SPVF
UI
MCC
1696MS_C
1310 nm
MCC
OPC
SPVF
1550 on WDM side
1550 nm + OSC
OSC
1550 nm + OSC

Figure 229158: Remote Spur 4xANY (or 2xGE_FC) + protected MCC on 1550 nm

2-channel Line Terminal
The 2 DWDM Channels Line Terminal use OADM 2 in order to deliver 2 different
channels.
The 2 CWDM Channels Line Terminal use the 8-channel mux/demux, CMDX(2) w/
or w/o 1310nm filter.

OADM2
SPVM/OSC
Transponder Transponder
UI UI
2 1
OSC
1696MS_C
OADM2100_M_chx-y _S
F

A

N

_
C
PSC
PSC
LAN_Q

ESC
SPVM2/_H*
Transponder ch 1
Transponder ch 2
HK
RAI
* S P V M i s u s e d i n D W D M N E s , O S C i s u s e d i n C W D M a n d m i x e d N E s .
O A C s a r e n o t u s e d i n p u r e C W D M c o n f i g u r a t i o n s

Figure 230159: 2-channel Line Terminal

4-channel Line Terminal CWDM or DWDM with supervision
The 2 DWDM Channels Line Terminal use OADM 4 in order to deliver 2 different
channels.
The 2 CWDM Channels Line Terminal use the 8-channel mux/demux CMDX(2) with
1310nm filter (CMDX-U-S or CMDX2-U-S).
SPVM_H*
F

A

N

_
C
PSC
PSC
LAN_Q

ESC
WLA
WLA
HK
RAI
MUX/DEMUX 4 channels
* S P V M i s u s e d i n D W D M N E s , O S C i s u s e d i n C W D M a n d m i x e d N E s .
O A C s a r e n o t u s e d i n p u r e C W D M c o n f i g u r a t i o n s

Figure 231: 4-channel Line Terminal CWDM or DWDM with supervision

Remote CPE, 2-channel terminal: MCC + 4xANY with drawers protection
OADM2100_M_chx-y _S
F

A

N

_
C
PSC(2)
PSC(2)
LAN_Q
HK
RAI
7
8
9
10
11
12
1
2
3
5
6
13
F

A

N

_
C
PSC2
PSC2
4xANY
7
8
9
10
11
12
1
2
3
4
5
6
13
2 channels
OSC in
OSC out
OADM2100_M_chx-y_S
ch1
ch2
ch1
ch2
D
M
U
M
U
X
X
SPVM
MCC
4xANY
4
OPC
T
x
R
x
Rx
Tx
Rx
Tx
Rx
Tx
Rx
Tx
4xANY
T
x
R
x
Rx
Tx
Rx
Tx
Rx
Tx
Rx
Tx
4xANY
OPC
OPC
OPC MCC
ch1
ch2
OPC #4
OPC #3
OPC #1
OPC #2
#1
#2
#3
#4
#1
#1
#2
#2
#3
#3
#4
#4

ESC
MCC ch1
MCC ch2
I-Link_M
I-Link_S
SPVM2 / SPVM_H


Figure 232160: Remote CPE, 2-channel terminal: MCC + 4xANY with drawers
protection

CPE adressing CWDM or DWDM links
A CPE can host a 4xANY_P or 2xGE_FC board equipped with a CWDM or DWDM
SFP, or aWLA equipped with a or some CWDM SFP or DWDM SFP. These
wavelengths can be multiplexed in a CMDX(2) or an OADM/OMDX board.

SPV manager
It is possible to configure a Compact shelf with only a both sides Add/Drop of
supervision functionality.
The functionality of this NE is to manage the OSC channel at 1510 nm or at 1310
nmon both sides without any other functionality.
With supervision at 1510 nm:
- Low cost configuration:
The Insertion/Extraction functionality is performed by a SPV_F_C filter (for
example). Nevetheless it is mandatory to do the provisioning of OADM boards (in
broken line in the figure) to provide the necessary objects forSupervision
extraction. Then, during the normal functioning, theNEshould raise the
replaceableUnitMissing alarms.

This configuration does not allow the supervision of transmission alarms (they are
inhibated by the RUM).
- Properly supervised configuration:
To have a normal supervision of this configuration, the user must plug and declare
en OADM or an OAC. In this case the RUM is not raised and the transmission
alarms are not inhibated.
With supervision at 1310 nm: With F1310 board, no dummy OADM is needed.

Figure 233161: 1696MS or 1696MS_C with only supervision

1696MS configured to connect a CPE
In this paragraph, we describe the configuration of 1696MS in a core ring, host of a
link to a distant CPE.
In current release two data signals plus OSC can be managed as such a one fiber link
(1310 nm, 1550 nm or 1310+1550 nm).


1696MS receiving/emitting a supervised B&W signal
This situation is the same as a customer signal arriving on a B&W port of 1696MS,
except that the incoming signal carries the OSC which has to be extracted/inserted in
the 1696MS.
OMDX or OADM OMDX or OADM
SPVM/OSC
SPVM/OSC
To/From
To 1696 WDM
ring
To 1696
ring WDM
T
r
a
n
s
p
o
n
d
e
r
1696MS
1310 nm
1310 nm
CPE
OPC
SPV_F
T
r
a
n
s
p
o
n
d
e
r
Black & White signal
S
P
V
M
/
O
S
C

In this configuration the 1696MS node has to support 3 Optical Supervisory Channels
(2 x SPVM / OSC boards needed).
Figure 234162: 1696MS connected to a CPE through a supervised black-and-
white signal

1696MS receiving a supervised colored signal
In this configuration, the signal coming from the CPE is plugged on the User
Interfaced of the 1696MS. In this case the signal from the 1696MS to the CPE is
carried by a 1310 nm wavelength, and the contrapropagative signal is carried by a
1550 nm wavelength.
The optical budget is then limited by the Black and White span optical budget.
Protected signal in the ring
The signal coming from the CPE is launched in both directions in the 1696MS ring
(East and West).
In this case, the 1696MS node has to support 3 Optical Supervisory Channels (2
SPVM boards are needed).
SPVM/OSC
SPVM/OSC
To/From CPE
To 1696 WDM
ring
To 1696
ring WDM
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
1696MS
1310 nm 1550 nm
SPV_F_1550
OPC
S
P
V
M

white and colored signal and protected in the ring

Unprotected signal in the ring
In this case the signal coming from the CPE is launched only on one side of the ring.
In this configuration the 1696MS node has to support 3 Optical Supervisory Channels
(2 SPVM boards needed).
SPVM/OSC
SPVM/OSC
To 1696 WDM
ring
To 1696
ring WDM
T
r
a
n
s
p
o
n
d
e
r
1696MS
1310 nm
1550 nm
or 1310 nm
To/From
CPE
S
P
V
M

white and colored signal and unprotected in the ring

1696MS as a remotization
In this configuration one channel is demultiplexed and the other one is sent directly to
the CPE without MCC using.
Without OSC
OMDX or OADM
OMDX or OADM
SPVM/OSC
SPVM/OSC
To/From CPE
To 1696 WDM
ring
To 1696
ring WDM
1696MS

Figure 237165: Optical channel optically passed through the NE without being
regenerated.

With OSC
SPVM/OSC
SPVM/OSC
S
P
V
M
/
O
S
C
To/From CPE
To 1696 WDM
ring
To 1696
ring WDM
1696MS
SPV_F SPV_F

Figure 238166: Optical channel optically passed through the NE without being
regenerated and with OSC insertion.

When the optical budget is available, this configuration can be used to reach a CPE. In
this case, the 1696MS node has to support 3 OSC channels and then 2 SPVM boards
are needed.

Two 1696MS or 1696MS_C rings connected together
It is possible to make two 1696MS rings (made up of 1696MS and/or 1696MS_C)
communicate. It is not necessary that both communicating nodes are located on the
same spot. User interfaces are interconnected (data transmission), and the OSC is
launched on one 1310 nm black and white signal from one ring to the other through
two SPV_F_C boards (one on each ring).
S
P
V

m
a
n
a
g
e
n
e
m
e
n
t

(
o
p
t
)
P
S
C
P
S
C
L
A
N
1 2 3 4 5 6 7
8 9 1 0 11 1 2 1 3 1 4 1 5 1 6 1 7 1 8 1 9 2 0 2 1 2 2 2 3 2 4
25 26 27 28 29 30 31
3 2 3 3 3 4 3 5 3 6 3 7 3 8 3 9 4 0 4 1 4 2 4 3 4 4 4 5 4 6 4 7 4 8
U
I
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I
H
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R
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FANS
49
O
A
D
M

4

c
h
.

W
e
s
t
I
O
A
D
M

4

c
h
.

E
a
s
t
H
a
l
f

S
P
V
M

B
o
a
r
d
F

A

N

_
C
PSC
PSC
LAN_Q

SPV_F_C
OPC
RAI
SPVM
OADM1
Transponder (f rom SPVF_C)
Transponder ch. 1
(1550 nm)
S
P
V
2 8 : SPV Filter
E
q
u
i
p
m
e
n
t

S
h
e
l
f

C
o
n
t
r
o
l
l
e
r
Equipm
ent Shelf C
ontroller
T
r
a
n
s
p
o
n
d
e
r

c
h

1

W
T
r
a
n
s
p
o
n
d
e
r

c
h

1

E
T
r
a
n
s
p
o
n
d
e
r

c
h

2

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3

W
T
r
a
n
s
p
o
n
d
e
r

c
h

3

E
T
r
a
n
s
p
o
n
d
e
r

c
h

4

W
T
r
a
n
s
p
o
n
d
e
r

c
h

4

E
T
r
a
n
s
p
o
n
d
e
r

c
h

2

E

Figure 239: Interconnection of two rings with a 1696MS and a 1696MS_C

Supervision through optical link (DCC)
It is possible to make two 1696MS Rings communicate (made up of 1696MS and/or
1696MS_C). Both the communicating nodes are not necessary to be located on the
same spot. User interfaces are interconnected (data transmission), and the OSC is
launched on one 1310 nm black-and-white signal from one ring to the other through
two SPV_F_C boards (one on each ring).
Protection is provided for remote MCC Boards of both rings with OPC boards.
This protection type allows two failures at a time, one in each ring.

OMDX or OADM 1ch OMDX or OADM 1ch
SPVM/OSC
SPVM/OSC
To 1696 WDM
ring
To 1696
ring WDM
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
SPVM
User interf aces
OADM 1 channel +OSC
SPVM/OSC
SPVM/OSC
To 1696 WDM
ring
To 1696
ring WDM
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
Pass-Through
OADM 1 channel +OSC
SPVM
SPVM
User interf aces
1696MS_C
1696MS
OPC
OPC
SPV_F_C
SPV_F_C

Figure 240167: Two 1696MS rings connected together through user interfaces.

Supervision through electrical link (LAN_Q)
The supervision is transmitted from one ring to the other through the LAN_Q boards.
This avoid to have one SPVM in the 1696MS shelf and one in the MS_C shelf.
OMDX or OADM 1ch OMDX or OADM 1ch
SPVM
SPVM
To 1696 WDM
ring
To 1696
ring WDM
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
User interf aces
OADM 1 channel +OSC
SPVM
SPVM
To 1696 WDM
ring
To 1696
ring WDM
T
r
a
n
s
p
o
n
d
e
r
T
r
a
n
s
p
o
n
d
e
r
Pass-Through
OADM 1 channel +OSC
SPVM
LAN_Q
LAN_Q
User interf aces
1696MS_C
1696MS


Figure 241168: Two 1696MS rings connected together through user interfaces.

The transponders shown in the figure are not protecting each other, but only
transmitting the signal they receive. In this configuration both NEs located in the same
spot are necessary because of the electrical link length.

7 UNITS DESCRIPTION
Overview
Purpose
Contents
Tranponders - tributaries II-384
Multiple Variable Attenuator Cards II-484
Multiplexers II-490
Optical Amplifier (OAC) II-517
Controller II-526
General user interfaces II-541
Switching Protection (OPC) II-549
Power Supply Card (PSC/PSC3) II-555
Power Supply Card (PSC2) II-555

Power Management Unit (PMU) II-556
FANS unit II-561
This chapter describes the cards and units of the 1696 Metro Span for this release. It
gives for each card a functional diagram, description and interfaces definition.
Tranponders tributaries
Multirate Channel Card III (MCC3)
WDM
B&W
B&W
CWDM
SFP
TX
RX
B&W or
WDMRx
ALARM&
CONTROL UNIT
FPGA
WDMTx VOA
Pin
amp
OOPV
2x2
2x2
OPTICAL
MODULE
(PM/ G.709)
CLIENT
CLIENT
WDM
WDM
CDR
CDR
OUTPUT
INPUT
INPUT
OUTPUT
TO/FROM
CORRESPONDING
TRANSPONDER
TO/FROM
ADJACENT
BOARD
N . B . l i n k s f r o m C o n t r o l U n i t t o c o m p o n e n t s h a v e b e e n g r e y e d f o r c l a r i t y )
2.5 - 2.66 Gbps
back-panel
electrical links
STM-16, GBE, FC,
CWDM SFP module
STM-1, STM-4,

Figure 242169: Block diagram of the MCC3 unit

Description
The block-diagram is shown in Figure 242.
MCC3 is built on the model of the MCC2 board. It is a MCC2 with a SFP Pluggable
module in place of Rx-Tx USER Interface. Refer to Small Formfactor Pluggable (SFP)
optical modules.for SFP descrption.
The MCC3 unit is a bidirectional multi-clock transponder with one client optical
interface and one coloured WDM optical interface.
The Line/WDM bidirectional optical interface is the connection to the network, and is
accomplished by a coloured single wavelength on the WDM module. Each wavelength
on the Line interface is then multiplexed into a single fiber and sent to the G.709
network.
The WDM emitter is a WDM optical module tunable over two channels with 100 GHz
channel spacing and 3200 ps/nm dispersion accomodation.
The optical receiver performs an optical-to-electrical conversion and viceversa the
optical transmitter.
The Client interface is a no-OTN bidirectional optical interface providing the
connection of a single wavelength of the client network with the User (B&W or
CWDM) module.
The client interface is a Small Formfactor Pluggable (SFP) module. Small Formfactor
Pluggable modules are optical transceivers enabling the building of a transponder
board with a client oriented User Interface.
The following SFP modules are supported (see also Table 5.1Table 5.1Table 5.1and
Figure 676):
B&W S-1.1/L-1.1/L-1.2: STM-1 Short / Long reach at 1310 nm and (L-1.2) 1550nm
B&W S-4.1 / L-4.1 / L-4.2: STM-4 Short / Long reach at 1310 nm and (L-4.2) 1550nm
B&W I-16.1/S-16.1/L-16.1/L-16.2: STM-16 Inter-office/Short/Long reach at 1310nm and (L-
16.2) 1550nm
B&W S-16.1 multi-rate: S-16.1 multi-rate (up to 2.666Gbps) at 1310 nm
B&W 100B-LX: Fast Ethernet at 1310nm
B&W GbE-SX / Gbe-LX / GbE-ZX: Gigabit Ethernet at 850nm / 1310 nm / 1550nm
B&W FC / 2FC: Fiber Channel (1.065GHz) / 2 FC (2.125GHz) / Fiber Channel at 850nm /
1310nm
CWDM Silver/Bronze: 8 CWDM modules with APD/PIN detector (bitrates = 125 Mbps->2.7
Gbps)
The Client optical interface is made up of LC/SPC connectors. The SFP module can be
extracted/inserted via the front panel without removing the board.
The following B&W signals at 2.488 Gbps are managed in current rel.:
ITU-T G.957 STM-16 (2.488 Gbps), STM-4 (622.08Mbps), STM-1 (155.52Mbps)
OC-48 (2.488 Gbps)
GbE (1.250 Gbps)
2FC / FC (2.125Gbps / 1.065Gbps)
FE (125Mbps)
The CWDM coloured SFP module is able to accept all the bit rates in the range
125Mbps->2.666Gbps.
All the signals are 3R.
The board is configured for application with optical amplifiers.
In the Craft Terminal, the operator can select the bit rate by
selecting it in a list
entering its exact value
A Variable Optical Attenuator (VOA) is inserted after the WDM Tx. The operator
monitors the VOA by choosing a VOA value.
In addition to the optical interfaces an electrical matrix, an alarm and control unit and a
FPGA devoted to B1-based performance monitoring and G.709 optical layer
management are present on the board.
The FPGA / PM block enables the operator to achieve PM based on B1 in a non
intrusive way on SDH/SONET signals either at user Rx side, or at WDM Rx side
(selection made by software provisioning). User signal is monitored after the 8x8
electrical matrix whereas the line signal is monitored before the matrix.
The electrical matrix gives some flexibility and additives features:
- Drop / Insert with or without Optical-SNCP
- Electrical pass-through (with or without SFP module as client interface)
- internal (local) loop-back
- line (remote) loop-back
- line (remote) loop-back drop-insert

- line (remote) loop-back and pass-through in
- line (remote) loop-back and pass-through out
- user loop-back
- user loop-back pass-through
- possibility to broadcast either the user or the WDM signal to the B1 monitoring
unit
This matrix is managed by the craft terminal via the SPI interface and the alarm and
control unit.
The alarm and control unit ensures a few functions:
- matrix management interface
- Clock and Data Recovery (CDR) units management (bit rate selection, pass-
through,...
- B1 device management
- alarms collection and interface to the craft terminal via the shelf controller
- Optical Channel protection control (configuration, switch decision unit)
if optical-SNCP: user Tx ON/OFF control
- safety procedure management (ALS_WDM, ...)
In OCh protection scheme, each transponder transfers its alarms information to the
corresponding one (the transponder just beside) via parallel back-panel links in order
that each one is able to select the unfailed signal.
Each transponder unit is characterized by its particular Tx WDM wavelength (2
wavelengths are selectable so that one shall be chosen before being able to perform a
mismatch).
Two EEPROMs contain both the remote inventory data (construction date, code
number, maker number, board identification...) and the set of channels the card
support. These information are sent to the ESC board by means of the SPI bus.
On the MCC, the set of channels are written on the card support.
Regenerator configuration
This configuration is provided with two MCC3 in pass-through. In this case the User
interface (SFP) is not required.

Optical characteristics
See Multirate Channel Card (MCC3) characteristics
Optical safety
Alcatel-Lucent recommends the customers to preset:
the APSD enable mode for all the transponders in terminating nodes
the APSD disable mode for all the transponders in regeneration.
Two types of alarms are available for optical safety / fault localization / protection
criteria:
LOC: Loss Of Clock. Alarm detected by the CDR modules, before Tx inputs for all bit rates
between 100 Mbit/s and 2.66 Gbit/s.
ILOS: Input Loss Of signal. Alarm detected by the Rx modules as a low power.
Way of working 1st case :
ILOS at user Rx input implies a consecutive LOC at WDM or user Tx input and the SD of
the WDM Tx.
LOC at WDM Tx input (signal coming either from the user Rx or the WDM Rx) implies the
SD of the WDM Tx.
ILOS at WDM Rx input implies the shutdown of the WDM Tx and the start of the ALS
mechanism (if available & enable). A consecutive LOC will appear at user Tx input and this
interface will be shutdown. To restart, the WDM Tx will send restart pulses.
Shutdown time is defined to be less than (or equal to) 10 ms.
LOC at user Tx input (signal coming from WDM world) implies shutdown of the user Tx
laser and protection mechanism (if available).
N.B. During the switch on and the switch off time, the output power remains
between
ITU
500 pm.
Boards behavior depending on APSD status
If the transponder is in APSD enable or disable state, in case of upstream error (fiber
break, transponder failure, jumper disconnection etc...) a mechanism is proposed that
enables to propagate a kind of FDI (Forward Defect Indication) along the trail: a Loss
Of Signal (LOS) will imply a shut-down which will indicate to the next NE that the
failure has occurred in a previous link. This function enables the network manager to
have a good understanding of the fault localization.
This mechanism of LOS propagation is independent from safety procedure. The next
table sums up the different transponder behavior according to safety + LOS
propagation command.


Table 7.1 MCC3 Shut down mode
Node Type MCC3 state Behaviour
Alarm Consecutive action
a. Line Terminal
b. Add & Drop in
OADM or back-to-
back node

APSD enable LOS on User Rx SD of WDM Tx
LOS on WDM Rx SD of User Tx & WDM Tx of the
same board
LOC on User Tx SD of User Tx
LOC on WDM Tx SD of WDM Tx
APSD disable LOS on User Rx SD of WDM Tx
LOS on WDM Rx SD of User Tx
APSD disable
forced ON
WDM Tx always ON
APSD disable
forced OFF
WDM Tx always OFF
Formatted: Indent: Left: 0.08", Numbered +
Level: 1 + Numbering Style: a, b, c, + Start
at: 1 + Alignment: Left + Aligned at: 0.92" +
Tab after: 1.17" + Indent at: 1.17", Tab stops:
Not at 1.17"
Node Type MCC3 state Behaviour
Pass-through in OADM or
back-to-back node
APSD enable Forbidden
APSD disable LOS on WDM Rx SD of WDM Tx of the adjacent
board
APSD disable
forced ON
WDM Tx always ON
APSD disable
forced OFF
WDM Tx always OFF
MCC3 configurations
On the following schemes, are presented the two adjacent transponders and the
transponder matrix configurations. The HF back-panel links shown in the following
drawings are those between the slots 4&5, 6&7, 8&9, 10&11, 14&15, 16&17, 18&19,
20&21.
Default configuration (no cross-connection)
By default, both optical transmitters are OFF, the 8x8 matrix has no connection.
The board is on APSD disable state.

WDMTx
WDMRx
back-panel
connections
MCC West
Rx
Tx
WDMTx
WDM Rx
MCC East
8 x 8
Rx
8 x 8
Matrix
Tx

Figure 243170: MCC2 in default configuration

After software configuration, the way of working will be one of the following.
Drop / Insert without optical channel protection
The transponder can accept this configuration in terminals, back-to-back terminals, and
OADM nodes.
The two adjacent boards have an independent configuration (one can be in drop-insert,
the other one can be unequipped, in drop/insert configuration, or in local loop-back
mode).
Rx
Tx
WDMTx
WDMRx
back-panel
connections
MCC West
8 x 8
Matrix
Rx
Tx
WDMTx
WDM Rx
MCC East
8 x 8

Figure 244171: Drop / Insert without Optical-SNCP (identical 8x8 matrix
configuration)

Table 7.2 Summary of the way of working in case of ILOS and LOC
alarms consecutive action
WDM Rx user Tx user Rx WDM Tx
ILOS (LOC)**
ShutDown of the WDM Tx
ILOS (LOC)**
shutdown of the WDM Tx laser (same
board) and beginning of the ALS_WDM
procedure if ALS enable
ShutDown of the user Tx
activation of the protecting user Tx laser if
protection activated
LOC*
shutdown of the user Tx laser

LOC*
shutdown of the WDM Tx laser
LOC* for the bit-rates managed by the CDR
(LOC)** concerns the LOC alarms consecutive to the ILOS one.
N.B. If WDM Tx is Forced ON, shut-down of the WDM Tx does not occur.
Drop / Insert with optical channel protection
OADM nodes.
The two adjacent boards have the same matrix configuration and must be placed in the
two adjacent slots 4&5, 6&7, 8&9, 10&11, 14&15, 16&17, 18&19 or 20&21 because
of Low Frequency links used to pass information between them.
Rx
Tx
Rx
Tx
WDMTx
WDMRx
MCC West MCC East
8 x 8
Matrix
8 x 8
Matrix
WDMTx
WDMRx

Figure 245172: Drop / Insert with Optical-SNCP (identical 8x8 matrix
configuration)


ILOS (LOC)**
ShutDown of the WDM Tx
ILOS (LOC)**
procedure if ALS enable
ShutDown of the user Tx
LOC*
shutdown of the user Tx laser
LOC*
shutdown of the WDM Tx laser
(LOC)** concerns the LOC alarms consecutive to the ILOS one.
Electrical pass-through, with/without SPF client interface (regeneration config)
When two transponders are configured in pass-through, there is no need of User
Interfaces, hence the user interface (SFP modules) in MCC3 can be equipped or not.
In case it is not equipped, neither alarms nor measurements should be shown to the
operator.
The MCC2 can accept this configuration in back-to-back terminals or OADM nodes
for flexibility and/or to enable a regeneration of the signal. The user interfaces are not
used and this board do not manage the protection.

WDMTx
WDMRx WDMTx
WDM Rx
Tx
Rx
back-panel
connections
MCC West MCC East
8 x 8 8 x 8
Tx
Rx optional
interf aces

Figure 246173: Pass-through (regeneration configuration)

inhibited inhibited LOC*
no action
ILOS inhibited inhibited (LOC)*
procedure (if ALS enable)
ShutDown of the WDM Tx on the adjacent
board
(LOC)* concerns the LOC alarms consecutive to the ILOS one in when the bit-rate
is managed by the CDR
Master board
The board is refered to as master because its user interfaces are those used and it is this
board that manages the protection.

ILOS (LOC)**
SD of the WDM Tx
ILOS (LOC)**
board) and begining of the ALS_WDM
protection action
(LOC)** concerns the LOC alarms consecutive to the ILOS one in when the bit-rate
Slave board
The user interfaces are not used and this board does not manage the protection.

inhibited inhibited LOC*
no action
ILOS inhibited inhibited
board) and begining of the ALS_WDM
transmission of the alarm to the master
board (for protection control)

(LOC)** concerns the LOC alarms consecutive to the ILOS one in when the bit-rate
Loop-backs
The following loop-backs can be provided:
local loop-back
user loop-back
user loop-back and pass-through
remote loop-back.
remote loop-back and drop/insert
remote loop-back and pass-through
Local loop-back
This configuration is used for tests only.
Rx
Tx
Rx
Tx
WDMTx
WDMRx WDMTx
WDM Rx
back-panel
connections
MCC West MCC East
8 x 8 8 x 8

Figure 247174: Local Loop-Back

The two adjacent boards have an independant configuration (one can be in local loop-
back, the other one can be unequipped, in drop/insert configuration, or in local loop-
back mode).
As this configuration is used for tests, the alarm management is controlled by the
operator (he should look at all the alarms and activate or inhibit the ALS_WDM
procedure).
Remote loop-back drop-insert
Rx
Tx
Rx
Tx
WDMTx
WDMTx WDMRx
WDM Rx
back-panel
connections
MCC "loop-in" MCC "loop-out"
8 x 8 8 x 8

Figure 248175: Remote Loop-Back in ring application (back-to-back or OADM)

The two adjacent boards are linked and have a different configuration so that the
operator must set the MCC to work in loop-in or loop-out mode.
procedure).
User loop-back

Rx
Tx
Rx
Tx
WDMTx
WDMRx WDMTx
WDM Rx
back-panel
connections
MCC West MCC East
8 x 8 8 x 8

Figure 249176: User Loop-Back

The two adjacent board have an independant configuration (one can be in local loop-
back mode).
procedure).
User loop-back & pass-through
WDMTx
WDMRx WDMTx
WDM Rx
Tx
Rx
Tx
Rx
back-panel
connections
MCC "loop-in" MCC "loop-out"
8 x 8 8 x 8

Figure 250177: User Loop-Back & pass-through

operator must set the MCC to work in loop-in or loop-out mode.
procedure).
Remote loop-back

Rx
Tx
WDMTx
WDMRx
back-panel
connections
MCC West
8 x 8
Rx
Tx
WDMTx
WDM Rx
MCC East
8 x 8

Figure 251178: Remote Loop-Back in ring application (back-to-back or OADM)

The two adjacent boards have an independant configuration (one can be in local loop-
back mode).
procedure).
Laser and VOA status
The next table gives the default state of the lasers and VOA according to the
configuration of the MCC3.
The default configuration is APSD_Disable.

Table 7.7 MCC3 default Lasers and VOA states
MCC3 configuration WDM Tx laser VOA WDM Tx User Tx laser
Plugged not declared OFF 20 dB OFF
MCC3 configuration WDM Tx laser VOA WDM Tx User Tx laser
Declared but no cross-connection OFF 20 dB OFF
Cross-conn declared but no signal OFF 20 dB OFF
Cross-connection + signal according to configuration according to configuration
Protection management
In Optical SNCP, if the master MCC (master for protection control) is in failure
(Hardware failure, Card absent,...), the selected path is automatically the protecting
one. By this way, when the board in failure is retrieved, there is no impact on the
traffic.
At the creation of the protection function, the operator defines one main and one spare
channel.
The switch criteria and ways of control are the followings:
software locked protection on main channel
software forced selection of spare channel
ILOS (on WDM Rx) or LOC (on user Tx for the available bit-rates) on the current working
channel and no alarm on the protecting one
software manual selection of spare channel (forced selection only if no degradation of this
spare signal)
SFP removed (missing)
The software forcing is highest priority. The manual switch is less priority than the
alarms on the signals.
The priority order for the switch criteria is the following (from the highest to the
lowest):
lockout of protection
software forcing
automatic switching
When a software command (lockout or software forcing) is released (clear function),
the switch remains in its current position to avoid the useless switches.
Total switching time < 50 ms.

10 Gbps Optical Channel Card Enhanced (OCC10_E)
9.95328 Gbps (SDH, WAN)
8 x 8 MATRIX
Client interface
User
Tx
Client output
WDM
Tx
VOA
Photo-diode
WDM output
WDM
Rx
VOA
Photo-diode
WDM input
some functionalities
can be short-cut
to/f rom Matrix 1
WDM
10.709 Gbps (SDH, WAN, NNI)
G.709,
FEC, PM
CDR CDR
t
o
/
f
r
o
m

f
r
o
n
t

p
a
n
e
l

c
o
n
n
e
c
t
o
r
s
10 Gbps input
10 Gbps output
B
a
c
k

p
a
n
e
l
G.709,
FEC, PM
10.3125 Gbps (LAN)
11.096 Gbps (LAN)
10.709 Gbps (NNI)
CDR
CDR
CDR
(APD)
B&W XFP
Client input
User
Rx

Figure 252179: OCC10_E unit block diagram

Description
The OCC10_E unit is a bidirectional multi-clock transponder for 10 Gbps native
signals, with one client optical interface and one coloured WDM optical interface. It is
hardware compliant with ITU-T G.709 Rec.
The USER Interface is a XFP Pluggable module. Refer to XFP optical modules for
XFP description
The Line/WDM bidirectional optical interface is the connection to the network, and is
accomplished by a coloured single wavelength on the WDM module. Each wavelength
on the Line interface is then multiplexed into a single fiber and sent to the G.709
network.
The WDM interface is OTN and the bit rate is
10.709Gbps for SDH STM-64, SONET OC-192, 10GbE WAN and (in future rel.) NNI client
signals
11.096Gbps for 10GbE LAN client signals in the corresponding wavelength.
The WDM emitter is a non-tunable WDM optical module with 100 GHz channel
spacing.
The WDM Receiver is APD type.
The Client interface is a no-OTN bidirectional optical interface providing the
connection of a single wavelength of the client network with the User module.
The client interface is a XFP module with APD detector. It is an optical transceivers
enabling the building of a transponder board with a client oriented User Interface.
The following XFP modules are supported (see also Table 5.1Table 5.1Table 5.1and
Figure 687):
B&W I64.1/10G Base-L and S64.2b/10GBase-E, providing SDH STM-64, 10GbE WAN,
10GbE LAN, OTN
B&W 10GBase-S, providing SDH STM-64, 10GbE WAN, 10GbE LAN
The Client optical interface is made up of LC/PC connectors. The XFP module can be

The following B&W signals are managed:
9.953Gbps (ITU-T G.957 STM-64/OC-192, 10GbE WAN)
10.31Gbps (10GbE LAN).
All the signals are 3R.
The board is configured for application with optical amplifiers.
A Variable Optical Attenuators (VOA) is inserted after the WDM Tx and another one
is placed before the WDM Rx in order to maintain the power constant at the Rx input.
By O.S. (CT, 1353NM) the operator can set (and monitor) the WDM Tx VOA
value.
In addition to the optical interfaces (user Rx and Tx, WDM Rx and Tx), an electrical
matrix and an alarm and control unit are present on the board.
The B1 performance monitoring unit enables the operator to achieve PM on B1 in a
non intrusive way on SDH/SONET signals at user Rx side and at WDM Rx side
simultaneously.
The electrical matrix is managed by the craft terminal via the SPI bus and the Alarm
and control unit.
The electrical matrix gives some flexibility and additives features:
- drop / Insert with or without Optical-SNCP
- electrical pass-through
- internal (local) loop-back
- line (remote) loop-back
- line (remote) loop-back drop-insert
- line (remote) loop-back pass-through (in and out)
- local loop-back
- user loop-back
- possibility to broadcast either the user or the WDM signal to the B1 monitoring
unit

The alarm and control unit performs the following functions:
- matrix management interface
- Clock and Data recovery (CDR) units management (bit rate selection, pass-
through...)
- alarms collection and interface to the craft terminal via the shelf controller
- optical channel protection control (configuration, switch decision unit)
if Optical SNCP: user Tx ON/OFF control
- safety procedure management (ALS_WDM).

In OCh protection scheme, each transponder transfers its alarms information to the
corresponding one (the transponder just beside) via parallel back-panel links in order
that each one is able to select the unfailed signal.
Each transponder unit is characterized by its particular Tx WDM wavelength.
The channel/wavelength is written on the card support.
The card mismatch is managed via information (ECID) contained in an EEPROM
present on the board.
The Remote Inventory of the module is available via the SPI bus.
The EEPROM containing specific data of the board is accessed via the SPI bus.
The O/E/O regeneration for OCC10 is
supported by connecting the client interfaces (general). Mandatory with a 2.5 Gbps backpanel
supported via 10 Gbps backpanel links (for future release).

Refer to 10 Gps Optical Channel Card Enhanced (OCC10_E) characteristics
Optical safety
In case of upstream error (fiber break, transponder failure,...) a mechanism that enables
to propagate a kind of FDI along the trail is proposed (allowing for optical safety /
fault localization / protection criteria):
LOC: Loss Of Clock. Alarm detected by the CDR modules, before Tx inputs for the 9953.28
Gbps bit rate.
LOS: Loss Of Signal. Alarm detected by the Rx modules as a low power.
generic AIS detection.
If the transponder is in disable state, in case of upstream error (fiber break, transponder
failure, jumper disconnection etc...) a mechanism is proposed that enables to propagate

a kind of FDI (Forward Defect Indication) along the trail: a Loss Of Signal (LOS) or a
Loss Of Clock (LOC) detection will imply a shut-down or an AIS generation
(depending on the mode chosen by the operator) which will indicate to the next NE
that the failure has occurred in a previous link. This function enables the network
manager to have a good understanding of the fault localization.
If the protection is activated, only the shut-down mode is authorized.
This mechanism of LOS or LOC propagation is independant from safety procedure.
The next table sums up different OCC10 behaviour according to safety + LOS + LOC
propagation command.

Table 7.8 OCC10_E Shut down mode
Node Type OCC10 state Behaviour
a. Line
Terminal
b. Add & Drop
in OADM or
back-to-back
node

APSD enable LOS on User Rx SD of WDM Tx
LOS on WDM Rx SD of User Tx & WDM Tx of the same
board
APSD disable LOS on User Rx SD of WDM Tx
APSD disable
forced ON
WDM Tx always ON
Not at 1.17"
Node Type OCC10 state Behaviour
APSD disable
forced OFF
WDM Tx always OFF

Pass-through in
OADM or back-to-
back node
APSD enable Forbidden
APSD disable LOS on WDM Rx SD of WDM Tx of the adjacent board
APSD disable
forced ON
WDM Tx always ON
APSD disable
forced OFF
WDM Tx always OFF
Example of way of working for ADD & DROP with APSD Disable:
ILOS at user Rx input implies the SD of WDM Tx
LOC at WDM Tx input (signal coming either from user Rx or WDM Rx) implies SD of
WDM Tx
ILOS at WDM Rx input implies the shutdown of the WDM Tx and the start of the ALS
mechanism (if available & enable). A consecutive LOC will appear at user Tx input and this
interface will be shutdown. To restart, the WDM Tx will send restart pulses.
Shutdown time is defined to be less than (or equal to) 5 ms.
LOC at user Tx input (signal coming from WDM world) implies shutdown of the user Tx
laser and protection mechanism (if available).
N.B. During the switch on and the switch off time, the output power remains
between
ITU
500 pm.

OCC10_E configurations
On the following schemes, are presented the two adjacent transponders and the
transponder matrix configurations. The HF back-panel links shown in the following
drawings are those between the slots 4&5, 6&7, 8&9, 10&11, 14&15, 16&17, 18&19,
20&21.

Table 7.9 OCC10_E configurations
Configuration type UNI NNI
Client bit rate (Gbps) 9.95328 / 10.3125 10.709 / 11.096
Drop-insert YES Future rel.
Optical SNCP YES Future rel.
Pass-through Not Applicable YES
Remote loopback pass-through (IN and OUT) Not Applicable YES
Remote loopback drop/insert YES Future rel.
Remote loopback Not Applicable YES
Local loopback YES Future rel.
User loopback YES Future rel.

In the following tables the alarms which are not shown or not applicable are alarms
with potentially consequent actions but not displayed to the craft user.
Notice that _User is used for B&W link or back panel link.
The switch criteria are described in the protection Protection sub-system.
Default configuration
By default, both optical transmitters are OFF, the 8x8 matrix has no connection.
After software configuration, the way of working will be one of the following.
Drop / Insert without optical channel protection
OADM nodes.
The two adjacent boards have an independent configuration (one can be in drop-insert,
the other one can be unequipped, in drop/insert configuration, or in local loop-back
mode).
Rx
Tx
WDMTx
WDMRx
back-panel
connections
OCC10 West
8 x 8
Matrix
Rx
Tx
WDMTx
WDM Rx
8 x 8
OCC10 East

Figure 253180: Drop / Insert without Optical-SNCP (identical 8x8 matrix
configuration)
For User to Network Interface (UNI) both ODU and OTU are terminated at the WDM
interfaces.
B&W
O/E
WDM
9953.28 Gbps
8 x 8
Matrix
B&W
O/E
O
D
U
O
T
U
FEC
O
D
U
O
T
U
DEFEC
O/E
WDM
O/E
10.709 Gbps
O
T
U
DEFEC
O
T
U
FEC
ODU
OTU

Figure 254181: Drop-insert (UNI)


Drop / Insert with optical channel protection
OADM nodes.
Rx
Tx
WDMTx
WDMRx
8 x 8
Matrix
8 x 8
Matrix
Rx
Tx
WDMTx
WDMRx

Figure 255182: Drop / Insert with Optical-SNCP (identical 8x8 matrix
configuration)

Electrical pass-through
The transponder can accept this configuration in back-to-back terminals or OADM
nodes for flexibility and/or to enable a regeneration of the signal. The user interfaces
are not used and this board do not manage the protection.
Rx
Rx
Tx
WDMTx
WDMRx
f ront panel (f uture rel.)
8 x 8
8 x 8
Tx
WDMTx
WDM Rx
OR
OR
OR
OR

Figure 256183: Pass-through (NNI)

For the regeneration configuration, OTU is terminated at the WDM interfaces and
ODU is bypassed. A dummy OTU is sent through the matrix
WDM
8 x 8
Matrix
O
D
U
O
T
U
FEC
O
D
U
O
T
U
DEFEC
O/E
WDM
O/E
10.709 Gbps
O
T
U
DEFEC
O
T
U
FEC
ODU
OTU
OR
OR
WDM
8 x 8
Matrix
O
D
U
O
T
U
FEC
O
D
U
O
T
U
DEFEC
O/E
WDM
O/E
10.709 Gbps
O
T
U
DEFEC
O
T
U
FEC
OR
OR
OTU Dummy OTU
Front Panel (future rel.)
Front Panel (future rel.)
Board 1 Board 2

Figure 257184: Regeneration (two pass-through linked by 10G backpanel)

The Dummy OTU does not correspond to a real transmission section: it is used to
monitor the matrices connections.

Remote loop-back
When the board is configured in loopback the RXA and TXA LEDs, located on
its front plate, are always turned OFF.
Pass-through remote loop-back
Rx
Rx
Tx
WDMTx
WDMRx
8 x 8
8 x 8
Tx
WDMTx
WDM Rx
OR OR

Figure 258185: Remote Loop-Back pass-through (NNI) in ring application (back-
to-back or OADM)
operator must set the OCC10_E to work in loop-in or loop-out mode.
Drop-insert remote loop-back
Rx
Tx
Rx
Tx
WDMTx
WDMTx WDMRx
WDM Rx
back-panel
connections
8 x 8
8 x 8

Figure 259186: Drop-insert remote loop-back (UNI) in ring application (back-to-
back or OADM)
This configuration is used for tests only. The two adjacent boards have an independent
configuration (one can be in loop-back, the other one can be unequipped, in drop-insert
configuration or in local loop-back mode).
Remote loop-back
Rx
Rx
Tx
WDMTx
WDMTx WDMRx
WDM Rx
back-panel
connections
8 x 8
8 x 8
Tx

Figure 260187: Remote loop-back (NNI) in ring application (back-to-back or
OADM)

configuration (one can be in loop-back, the other one can be unequipped, in drop-insert
configuration or in local loop-back mode).
Local loop-back
Local loop-back
Tx
Rx
Tx
WDMTx
WDMRx WDMTx
WDM Rx
back-panel
connections
8 x 8 8 x 8
Rx

Figure 261188: Local Loop-Back (UNI)

configuration (one can be in local loop-back, the other one can be unequipped, in
drop/insert configuration, or in local loop-back mode).
User loop-back (UNI): foreseen for Hardware and Software.
Rx
Tx
Rx
Tx
WDMRx WDMTx
WDM Rx
back-panel
connections
8 x 8 8 x 8
WDMTx

Figure 262189: User Loop-Back (UNI)

configuration (one can be in local loop-back, the other one can be unequipped, in
drop/insert configuration, or in local loop-back mode).
Laser and VOA status
The next table gives the default state of the lasers and VOA according to the
configuration of the OCC10. The default configuration is APSD_Disable and
LOS_mode_SD.

Table 7.10 OCC10_E default Lasers and VOA states
OCC10_E configuration WDM Tx laser VOA WDM Tx User Tx laser
Plugged not declared OFF 20 dB OFF
Declared but no cross-connection OFF 20 dB OFF
Cross-conn declared but no signal OFF 20 dB OFF
Cross-connection + signal according to configuration according to configuration


Protection management
In Optical SNCP, as for MCC, if the master OCC (master for protection control) is in
failure (Hardware failure, Card absent,...), the selected path is automatically the
protecting one. By this way, when the board in failure is retrieved, there is no impact
on the traffic.
At the creation of the protection function, the operator defines one main and one spare
channel.
The switch criteria and ways of control are the followings:
software locked protection on main channel
software forced selection of spare channel
ILOS (on WDM Rx) or LOC (on user Tx) on the current working channel and no alarm on
the protecting one
software manual selection of spare channel (forced selection only if no degradation of this
spare signal).
The software lockout of protection is the highest priority.
The priority order for the switch criteria is the following (from the highest to the
lowest):
lockout of protection
software forcing
automatic switching
When a software command (lockout or software forcing) is released (clear function),
the switch remains in its current position to avoid useless switches.
Total switching time < 50 ms.
An example of optical protection is given in Figure 182255.
10 Gbps Optical Channel Card for CWDM (OCC10_EC)
This board is the CWDM version for 10Gbps line.
It has been introduced to improve the optical performances of non amplified
transmissions in order to reach 80 km.
It is based on OCC10_E without VOA at transmitter side as well as at receiver. The
available wavelength fits in 1530 nm, 1550 nm, 1570nm, 1590nm and 1610nm
CWDM channels.
Refer to the block diagram (without VOA) of Figure 179252.
Wavelength adapter 1 and 2 (WLA1C, WLA2M)
125Mbps
WDMRx
ALARM&
CONTROL UNIT
WDMTx
USER
USER
to 2.7Gbps
TX
RX
CLIENT
CLIENT
CWDM
CWDM
CDR
CDR
OUTPUT
INPUT
INPUT
OUTPUT
CWDM(or B&W)
MODULE - SFP
125Mbps
to 2.7Gbps
OPTICAL
MODULE - SFP
B&W (or CWDM)
125Mbps
WDMRx
WDMTx
USER
USER
to 2.7Gbps
TX
RX
CLIENT
CLIENT
CWDM
CWDM
CDR
CDR
OUTPUT
INPUT
INPUT
OUTPUT
125Mbps
to 2.7Gbps
OPTICAL
MODULE - SFP
B&W (or CWDM)
CWDM1
CWDM2
USER1
USER2
8X8
MATRIX
SDH
PERFORMANCE
MONITORING*
* P e r f o r m a n c e M o n i t o r i n g a r e a v a i l a b l e o n l y o n W L A 2 M u n i t
P
O
R
T

1
P
O
R
T

3
P
O
R
T

2
P
O
R
T

4
OPTICAL
CWDM(or B&W)
MODULE - SFP
OPTICAL
O n W L A 1 C o n l y t w o C D R a r e p r o v i d e d , l o c a t e d f r o m m a t r i x t o C l i e n t o u t p u t

Figure 263190: WLA1C and WLA2M unit block diagram

3 connectors are green, but the fiber connectors to use are PC, not APC.
Description
WLA1C and WLA2M (wavelength adapter) are equipped with two multirate (125
Mbps -> 2.67 Gbps) transponders supporting two independent optical channels, in the
1470 nm -> 1610 nm range, 20 nm spaced.
These boards provide the same functions: the only difference is that the Performance
Monitoring is not provided by WLA1C.
The main function of these boards is to convert (for each one of the two channels) the
User optical signal into a CWDM coloured optical signal and viceversa.
User side, a CWDM SFP module can also be plugged in allowing the board to be used
as a regenerator.
Moreover it performs 3R function for both User and WDM sides, and performance
monitoring for SDH (WLA2M only).
The four interfaces/transceivers are external SFP pluggable modules so that they can
be alternated according to the different applications, in the 100Mbps->2.67Gbps bit
rate range. Refer to Small Formfactor Pluggable (SFP) optical modules and Figure 676
for SFP description, Table 5.1Table 5.1Table 5.1 for SFP list.
All the SFP types (B&W, CWDM) can be plugged onto all the interfaces/ports, so that
the four interfaces are not user or line tagged, they can be used as both.
Channel #1 uses ports #1 and #2, channel #2 uses ports #3 and #4.
Each Line (Port 2, Port 4 with CWDM SFPs, W1/W2 on the front plate) bidirectional
optical interface is the connection to the network, and is accomplished by a coloured
single wavelength on the WDM module. Each wavelength on the Line interface is then
multiplexed into a single fiber and sent to the network.
The CWDM interfaces are multirate pluggable modules (SFP), PIN (bronze) or APD
(silver) type.
All the SFP types (listed below) can be plugged on Port 2 and Port 4 (W1 and W2).
The bit rate is the same of the client bit rate, in the corresponding wavelength.
Each Client interface (Port 1, Port 3 with B&W SFPs, U1 and U2 on the front plate)
provides the connection to the client of the network.
The optical receiver performs the optical-to-electrical conversion and viceversa the
SFPs are optical transceivers enabling the building of a transponder with a client
oriented User Interface.
All the SFP types (B&W and CWDM, listed below) can be plugged on Port 1 and Port
3 (U1 and U2).
The following SFP modules are supported (on all the four interfaces/ports):
16.2) 1550nm
B&W GbE-SX / GbE-LX / GbE-ZX: Gigabit Ethernet at 850nm / 1310 nm / 1550nm
B&W FC / 2FC: Fiber Channel (1.065GHz) / 2 Fiber Channel (2.125GHz) at 850nm /
1310nm
CWDM: multirate (125 Mbps->2.67 Gbps) CWDM modules with APD or PIN detector
The CWDM coloured SFP modules are able to accept all the bit rates in the range
125Mbps->2.666Gbps, but only a set of discrete bit rates is supported by the card as
mentioned below.
The four optical interfaces are LC/PC connectors. The SFP modules can be
Optical measurements are not supported by WLA1C and WLA2M (use WLA3CD)
All signals are 3R regenerated by multi-rate CDR before transmission by SFP optical
transceivers in order to improve the optical performance. The CDR can lock
automatically onto the proper bit rate.
The supported bit rates are:
Fast Ethernet /FDDI (125 Mbps)
STM-1/OC-3 (155.52Mbps)
ESCON (200 Mbps)
Digital Video (DTV/HDTV, 270 Mbps)
STM-4/OC-12 (622.08Mbps)

Fiber Channel (FC, 100-SM-LL-I, 1.065Gbps)
OC-24 (1.24416 Gbps)
Gigabit Ethernet (1.250 Gbps)
Two Fiber Channel (2FC 2.125Gbps)
STM-16/OC-48 (2.48832 Gbps)
Two Gigabit Ethernet (2GE, 2.5 Gbps)
The 8X8 electrical matrix enables the following channel configuration and additive
features:
Add and Drop
Local loopback, Remote loopback, Local-Remote loopback
flexible transmission performance monitoring data path connection
The Alarms & Control unit provides
unit configuration operations
alarms collection and interface to ESC
remote inventory and additional data information
8X8 matrix configuration
management of CDRs and bit rate information of incoming signals
optical modules monitoring
optical channel protection check: E-SNCP = re-configuration of the matrix
management of performance monitoring information (WLA2M only)
Performance monitoring are performed (WLA2M only) on SDH signal on two ports:
the two ports of the same channel (CH1 or CH2) simultaneously. SDH PM are
calculated on B1 byte.
Firmware Download is available on both WLA1C and WLA2M boards: it is traffic
affecting on WLA1C unit and it is not traffic affecting on WLA2M unit.
Refer to Wavelength adapter 1 and 2 (WLA1C and WLA2M) characteristics
Ports on WLA1 and WLA2 is never in APSD enable state.
Force ON and Force OFF commands are not available.
The LOS propagation is described in the following:
When the alarm PORT2_RX_LOS occurs, PORT1 TX is shut down
When the alarm PORT1_RX_LOS occurs, PORT2TX is shut down
When the alarm PORT3_RX_LOS occurs, PORT4 TX is shut down.

Configurations
The default configuration on WLA boards is port #1 connected to port #2 (channel #1
in Add/Drop configuration), and port #3 connected to port #4 (channel #2 in Add/Drop
configuration).
For each channel there are four kinds of independent configurations:
Add/Drop
Local loopback
Remote loopback
Local-Remote loopback.
In Add/Drop configuration the traffic received from CWDM receiver is dropped on to
the user network, i.e. sent to the user transmitter, as the same traffic received from the
user receiver is added on to the CWDM line via CWDM transmitter.
In Local loopback configuration the traffic received on User receiver is sent to the
corresponding User transmitter in order to be tested. In such way, users can receive
traffic sent by themselves.
In Remote loopback configuration the traffic received from CWDM receiver is sent to
the corresponding CWDM transmitter in order to be tested.
In Local-Remote loopback configuration the traffic received from (User and CWDM)
receiver is sent to the corresponding (User and CWDM) transmitter in order to be
tested.
On channel #1, loopbacks can be performed on ports #1 and #2 or on both
On channel #2, loopbacks can be performed on ports #3 and #4 or on both.
These loopbacks can be simultaneously performed on both channels.

All the possible board configurations are described in the following paragraphs.
Add/Drop configuration (default configuration)
See Figure 191264. This configuration is applied when both channels of the unit are
used in Add/Drop mode.

The configuration without any monitoring implemented is the default one.
All transmitters can be turned ON or OFF manually (it has the highest priority). If the
FORCETXCON is not active the transmitter will obey the rules of the following table.

Table 7.11 Alarms and action usage for both Channels in Add/Drop configuration
Alarms Actions
CWDM_RX1_LOS Shutdown USER TX1
USER_RX1_LOS Shutdown CWDM TX1

8 X 8
M A T R I X
I N P U T
U s e r R X 1
U s e r T X 1 C D R 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T I N P U T
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T
P o r t # 1 P o r t # 2 C H A N N E L # 1

Figure 264191: Matrix configuration for both Channels in Add/Drop

Channel 1 in Add/Drop and Channel 2 in Local loopback configuration
See Figure 192265. The Local loopback configuration is used for testing purpose on
User side.


Table 7.12 Alarms and action usage for CH1 in Add/Drop and CH2 in Local
loopback configuration

Alarms Actions
USER_RX2_LOS Shutdown USER TX2
Shutdown CWDM TX2

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Figure 265192: Matrix configuration for CH1 in Add/Drop and CH2 in Local
loopback

Channel 1 in Add/Drop and Channel 2 in Remote loopback configuration
See Figure 193266. The Remote loopback configuration is used for testing purpose on
CWDM side.

Table 7.13 Alarms and action usage for CH1 in Add/Drop, CH2 in Remote

Alarms Actions

Alarms Actions
Shutdown CWDM TX2

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Figure 266193: Matrix configuration for CH1 in Add/Drop and CH2 in Remote
loopback
Channel 1 in Add/Drop and Channel 2 in Local-Remote loopback configuration
See Figure 194267. The Local-Remote loopback configuration is used for testing
purpose on User and CWDM sides simultaneously (on the same channel).

Table 7.14 Alarms and action usage for CH1 in A/D and CH2 in Local-Remote
loopback

Alarms Actions
CWDM_RX2_LOS Shutdown CWDM TX2

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Figure 267194: Matrix configuration for CH1 in Add/Drop and CH2 in Local-
Remote loopback

Channel 1 in Local loopback and Channel 2 in Add/Drop configuration
User side.

Table 7.15 Alarms and action usage for CH1 in Local loopback and CH2 in
Add/Drop configuration

Alarms Actions
Shutdown CWDM TX1

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Figure 268195: Matrix configuration for CH1 in Local loopback and CH2 in
Add/Drop

Channel 1 and Channel 2 in Local loopback configuration
User side.

Table 7.16 Alarms and action usage for CH1 and CH2 in Local loopback
configuration

Alarms Actions
Shutdown CWDM TX1
Shutdown CWDM TX2

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Figure 269196: Matrix configuration for CH1 and CH2 in Local loopback

Channel 1 in Local loopback and Channel 2 in Remote loopback configuration
User side and the Remote loopback is used for testing purpose on CWDM side.

Remote loopback
Alarms Actions
Shutdown CWDM TX1
Shutdown CWDM TX2

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Remote loopback
Channel 1 in Local loopback and Channel 2 in Local-Remote loopback
configuration
User side and the Local-Remote loopback is used for testing purpose on both User and
CWDM sides.

Table 7.18 Alarms and action usage for CH1 in Local loopback, CH2 in Local-
Remote loopback
Alarms Actions
Shutdown CWDM TX1
8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Figure 271198: Matrix configuration for CH1 in Local loopback and CH2 in Local-
Remote loopback

Channel 1 in Remote loopback and Channel 2 in Add/Drop configuration
CWDM side.

Table 7.19 Alarms and action usage for CH1 in Remote loopback, CH2 in
Alarms Actions
Shutdown CWDM TX1

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Figure 272199: Matrix configuration for CH1 in Remote loopback and CH2 in
Add/Drop
Channel 1 in Remote loopback and Channel 2 in Local loopback configuration
User side and the Remote loopback is used for testing purpose on CWDM side.

Table 7.20 Alarms and action usage for CH1 in Remote loopback and CH2 in
Local loopback
Alarms Actions
Shutdown CWDM TX1
Shutdown CWDM TX2

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Local loopback
Channel 1 and Channel 2 in Remote loopback configuration
CWDM side.

Table 7.21 Alarms and action usage for CH1 and CH2 in Remote loopback
configuration
Alarms Actions
Shutdown CWDM TX1
Shutdown CWDM TX2

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Figure 274201: Matrix configuration for CH1 and CH2 in Remote loopback

CH1 in Remote loopback and CH2 in Local-Remote loopback configuration
CWDM side and the Local-Remote loopback is used for testing purpose on both User
and CWDM sides.

Table 7.22 Alarms and action usage for CH1 in Remote loopback, CH2 in Local-
Remote loopback
Alarms Actions
Shutdown CWDM TX1

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Figure 275202: Matrix configuration for CH1 in Remote loopback, CH2 in Local-
Remote loopback
CH1 in Local-Remote loopback and CH2 in Add/Drop configuration

Table 7.23 Alarms and Aaction usage for CH1 in Local-Remote loopback and CH2
in Add/Drop
Alarms Actions

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Figure 276203: Matrix configuration for CH1 in Local-Remote loopback and CH2
in Add/Drop
Channel 1 in Local-Remote loopback and Channel 2 in Local loopback
configuration
User side and the Local-Remote loopback is used for testing purpose on both User and
CWDM sides.

Table 7.24 Alarms and action usage for CH1 in Local-Remote loopback, CH2 in
Local loopback
Alarms Actions
Shutdown CWDM TX2

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Figure 277204: Matrix configuration for CH1 in Local-Remote loopback and CH2
in Local loopback

CH1 in Local-Remote loopback and CH2 in Remote loopback configuration
CWDM side and the Local-Remote loopback is used for testing purpose on both User
and CWDM sides.

Remote loopback
Alarms Actions
Shutdown CWDM TX2

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Figure 278205: Matrix configuration for CH1 in Local-Remote loopback, CH2 in
Remote loopback
CH1 and CH2 in Local-Remote loopback configuration
See Figure 206279. The Local-Remote loopback is used for testing purpose on both
User and CWDM sides simultaneously (on the same channel).

Table 7.26 Alarms and action usage for CH1 and CH2 in Local-Remote loopback
configuration
Alarms Actions

8 X 8
M A T R I X
I N P U T
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
O U T P U T
I N P U T
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
O U T P U T

Figure 279206: Matrix configuration for CH1 and CH2 in Local-Remote loopback

Wavelength adapter 3 (WLA3CD)
125Mbps
WDMRx
ALARM&
CONTROL UNIT
WDMTx
USER
USER
to 2.7Gbps
TX
RX
CLIENT
CLIENT
WDM
WDM
CDR
CDR
OUTPUT
INPUT
INPUT
OUTPUT
CWDMor DWDM
MODULE - SFP
125Mbps
to 2.7Gbps
DWDM) OPTICAL
MODULE - SFP
B&W (or CWDMor
WDMRx
WDMTx
USER
USER
to 2.7Gbps
TX
RX
CLIENT
CLIENT
WDM
WDM
CDR
CDR
OUTPUT
INPUT
INPUT
OUTPUT
to 2.7Gbps
MODULE - SFP
CWDM1
CWDM2
USER1
USER2
8X8
MATRIX
SDH
PERFORMANCE
MONITORING
(or B&W) OPTICAL
MODULE - SFP
125Mbps 125Mbps
CWDMor DWDM
(or B&W) OPTICAL
DWDM) OPTICAL
B&W (or CWDMor
P
O
R
T

1
P
O
R
T

3
P
O
R
T

2
P
O
R
T

4

Figure 280207: WLA3CD unit block diagram

Description
The WLA3CD (wavelength adapter) is equipped with two multirate (125 Mbps -> 2.67
Gbps) transponders supporting
two independent CWDM optical channels, in the 1470 nm -> 1610 nm range, 20 nm spaced
or
two independent DWDM optical channels, in the 1529.55 nm -> 1561.42 nm range, 100 GHz
spaced.
The main function of this board is to convert (for each one of the two channels) the
User optical signal into a WDM (CWDM or DWDM, according to the SFP used)
coloured optical signal and viceversa. User side, a CWDM or DWDM SFP module can
also be plugged in allowing the board to be used as a regenerator.
Moreover it performs 3R function for both User and WDM sides, and performance
monitoring for SDH.
The four interfaces/transceivers are external SFP pluggable modules so that they can
be alternated according to the different applications, in the 100Mbps->2.67Gbps bit
rate range. Refer to Small Formfactor Pluggable (SFP) optical modules and Figure 66
7for SFP description, Table 9. for SFP list.
All the SFP types (B&W, CWDM, DWDM) can be plugged onto all the
interfaces/ports, so that the four interfaces are not user or line tagged, they can be
used as both.
Channel #1 uses ports #1 and #2, channel #2 uses ports #3 and #4.
Each Line (Port 2, Port 4 with CWDM/DWDM SFPs, W1/W2 on the front plate)
bidirectional optical interface is the connection to the network, and it is accomplished
by a coloured single wavelength on the WDM module. Each wavelength on the Line
interface is then multiplexed into a single fiber and sent to the network.
The WDM interfaces can be
multirate CWDM pluggable modules (SFP), PIN (bronze) or APD (silver) type
multirate DWDM pluggable modules (SFP), APD type.
All the SFP types (listed below) can be plugged on Port 2 and Port 4 (W1, W2).

Each Client interface (Port1, Port 3 with B&W SFPs, U1 and U2 on the front plate)
provides the connection to the client of the network.
All the SFP types (B&W, CWDM and DWDM, listed below) can be plugged on Port 1
and Port 3 (U1, U2).
The following SFP modules are supported (on all the four interfaces/ports):
16.2) 1550nm
1310nm
DWDM: multirate (125 Mbps->2.67 Gbps) DWDM modules with APD detector.
The CWDM/DWDM coloured SFP modules are able to accept all the bit rates in the
range 125Mbps->2.666Gbps, but only a set of discrete bit rates is supported by the
card as mentioned below.
The four optical interfaces are LC/PC connectors. The SFP modules can be
Optical measurements are supported by WLA3CD (Laser Bias, Optical Received
Power and Optical Transmitted Power on all SFPs with DDM).
STM-1/OC-3 (155.52Mbps)
ESCON (200 Mbps)
STM-4/OC-12 (622.08Mbps)
OC-24 (1.24416 Gbps)
Two Fiber Channel (2FC, 2.125Gbps)
STM-16/OC-48 (2.48832 Gbps)
features:
Add and Drop
E-SNCP (future rel.)
optical channel protection check: E-SNCP = re-configuration of the matrix
management of performance monitoring information
Performance monitoring are performed on SDH signal on four ports (CH1 and CH2)
simultaneously. SDH PM are calculated on B1 byte.
Not traffic affecting Firmware Download is available.
Refer to Wavelength adapter 3 (WLA3CD) characteristics
Ports on WLA3 is never in APSD enable state.
Force ON and Force OFF commands aravailable.
The LOS propagation is described in the following:

When the alarm PORT1_RX_LOS occurs, PORT2TX is shut down
When the alarm PORT3_RX_LOS occurs, PORT4 TX is shut down.
Configurations
The allowed configurations are the same as WLA1C and WLA2M, UNITS
DESCRIPTION, Configurations.
Wavelength adapter 2 with O-SNCP (WLA2M_OP)
125Mbps
WDMRx
ALARM&
CONTROL UNIT
WDMTx
USER
USER
to 2.7Gbps
TX
RX
CLIENT
CLIENT
CWDM
CWDM
CDR
CDR
OUTPUT
INPUT
INPUT
OUTPUT
125Mbps
to 2.7Gbps
125Mbps
WDMRx
WDMTx
USER
USER
to 2.7Gbps
TX
RX
CLIENT
CLIENT
CWDM
CWDM
CDR
CDR
OUTPUT
INPUT
INPUT
OUTPUT
125Mbps
to 2.7Gbps
WDM1
WDM2
USER1
USER2
8X8
MATRIX
optical
coupler
FROM
USER
optical
splitter
TO
USER
CWDM(or B&W)
MODULE - SFP
OPTICAL
MODULE - SFP
B&W (or CWDM)
P
O
R
T

1
P
O
R
T

3
P
O
R
T

2
P
O
R
T

4
OPTICAL
CWDM(or B&W)
MODULE - SFP
OPTICAL
MODULE - SFP
B&W (or CWDM)
OPTICAL
O n W L A 1 C o n l y t w o C D R a r e p r o v i d e d , l o c a t e d f r o m m a t r i x t o C l i e n t o u t p u t
Figure 281208: WLA2M_OP unit block diagram

3 connectors are green, but the fiber connectors to use are PC, not APC.
Description
The WLA2M_OP (wavelength adapter) is only used for protection purpose. It is
equipped with two multirate (125 Mbps -> 2.67 Gbps) transponders, one optical
splitter and one optical coupler allowing to support one protected optical channel (O-
SNCP), in the 1470 nm -> 1610 nm range, 20 nm spaced.
One optical protected signal is managed by this board: one user input is available and
the signal is split to both channels in Tx (client to WDM) and viceversa in Rx.
The optical splitter is connected to the two optical channels (transponders), user side,
allowing to transmit the client signal on both the paths (main/protected and
spare/protecting).
The optical coupler is connected to the two optical channels (transponders), user side,
allowing to select the signal according to the failure conditions: the main path is
selected if it is not affected by fault, the spare one (if OK) is selected if the main signal
is faulty.
The main functions of this board are to provide O-SNCP and to convert (for each one
of the two channels) the User optical signal into a CWDM coloured optical signal and
viceversa.
Moreover it performs 3R function for both User and WDM sides.
The two User transceivers and the two CWDM transceivers are external SFP pluggable
modules so that they can be alternated according to the different applications, in the
100Mbps->2.67Gbps bit rate range. Refer to Small Formfactor Pluggable (SFP) optical
modules and Figure 676 for SFP description, and Table 5.1 1696MS boards and units
listTable 5.1 1696MS boards and units listTable 5.1 1696MS boards and units
listTable 5.1 1696MS boards and units list for SFP list.
All the SFP types (B&W, CWDM) can be plugged onto all the interfaces/ports, but the
protection scheme forces Port 1 and Port 3 (C1, S1 and C2, S2 on the front plate) to be
tagged as user and Port 2 and Port 4 (W1 and W2 on the front plate) to be tagged as
line.
Therefore, channel #1 uses ports #1 and #2, channel #2 uses ports #3 and #4.
Each Line (with CWDM SFPs, W1, W2 on the front plate) bidirectional optical
interface is the connection to the network, and it is accomplished by a coloured single
wavelength on the WDM module. Each wavelength on the Line interface is then
The CWDM interfaces are multirate pluggable modules (SFP), PIN (bronze) or APD
(silver) type.
Each Client interface (with B&W SFPs) provides the connection to the client of the
network.
All the SFP types (listed below) can be plugged on Port 1 and Port 3 (C1, S1, C2, S2).
The following SFP modules are supported (on all the interfaces/ports):
16.2) 1550nm
1310nm
The CWDM coloured SFP modules are able to accept all the bit rates in the range
125Mbps->2.666Gbps, but only a set of discrete bit rates is supported by the card as
mentioned below.
The (line and user) optical interfaces are LC/PC connectors. The SFP module can be
Connectors are green, but it is still LC/PC connectors that must be used.
Do not plug LC/APC connectors in WLA2 boards

STM-1/OC-3 (155.52Mbps)
ESCON (200 Mbps)
STM-4/OC-12 (622.08Mbps)
OC-24 (1.24416 Gbps)
STM-16/OC-48 (2.48832 Gbps)
features:
Add and Drop
optical channel protection check: O-SNCP = switch control (turn ON/OFF User B&W TX)
Refer to Wavelength adapter 2 with O-SNCP (WLA2M_OP) characteristics.
Refer to Description - Boards behavior depending on AAPSD status.

Configurations
The default configuration is port #1 connected to port #2 (channel #1 in Add/Drop
configuration), and port #3 connected to port #4 (channel #2 in Add/Drop
configuration).
For each channel there are four kinds of independent configurations:
Add/Drop
Local loopback
Remote loopback
Local-Remote loopback.
In Add/Drop configuration the traffic received from CWDM receiver is dropped on to
the user network, i.e. sent to the user transmitter, as the same traffic received from the
user receiver is added on to the CWDM line via CWDM transmitter. When the Matrix
is configured in Add/Drop, O-SNCP is provided.
In Local loopback configuration the traffic received on User receiver is sent to the
corresponding User transmitter in order to be tested. In such way, users can receive
traffic sent by themselves.
In Remote loopback configuration the traffic received from CWDM receiver is sent to
the corresponding CWDM transmitter in order to be tested.
In Local-Remote loopback configuration the traffic received from (User and CWDM)
receiver is sent to the corresponding (User and CWDM) transmitter in order to be
tested.
On WLA2M_OP, loopbacks can be performed on Client or Line ports and
silmultaneously, but not on both channels simultaneously. To perform these loopbacks,
the protection must be configured in Automatic protection. In that case, force and
loockout manual switches are forbidden.
All the possible board configurations are described in the following paragraphs.
Add/Drop configuration (default configuration)
See Figure 209282. The WLA2M_OP provides the O-SNCP function (described in
Optical-SNCP) when the Matrix is configured as Add/Drop.
This board accepts 2 kinds of operation modes in O-SNCP protection: force and auto.
In force mode, the system can enable or disable the user TX1 or user TX2
unconditionally.

In auto mode, the system can enable or disable the user TX1 and user TX2
automatically, as in the following table.

Table 7.27 Alarms and action usage for O-SNCP with auto mode

CWDM_RX1_LOS CWDM_RX2_LOS Action
1 1 Disable USER TX1, Disable USER TX2
1 0 Disable USER TX1, Enable USER TX2
0 1 Disable USER TX2, Enable USER TX1
0 0 No action


Table 7.28 Alarms and action usage for both Channels in Add/Drop (O-SNCP
configuration)

Alarms Actions

8 X 8
M A T R I X
I n p u t
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
U S E R
S p lit t e r
O u t p u t
C o u p l e r

Figure 282209: Matrix configuration for both Channels in Add/Drop (O-SNCP
configutration)
Channel 1 in Add/Drop and Channel 2 in Local loopback configuration
User side.

Table 7.29 Alarms and action usage for CH1 in Add/Drop and CH2 in Local
Alarms Actions
No condition Shutdown USER TX1
Shutdown CWDM TX2

8 X 8
M A T R I X
I n p u t
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
U S E R
S p lit t e r
O u t p u t
C o u p l e r

Figure 283210: Matrix configuration for CH1 in Add/Drop and CH2 in Local
loopback

Channel 1 in Add/Drop and Channel 2 in Remote loopback configuration
See Figure 211284. The Remote loopback configuration is used for testing purpose
on CWDM side.

Table 7.30 Alarms and action usage for CH1 in Add/Drop, CH2 in Remote
Alarms Actions
Shutdown CWDM TX2

8 X 8
M A T R I X
I n p u t
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
U S E R
S p lit t e r
O u t p u t
C o u p l e r

Figure 284211: Matrix configuration for CH1 in Add/Drop and CH2 in Remote
loopback
Channel 1 in Add/Drop and Channel 2 in Local-Remote loopback configuration

Table 7.31 Alarms and action usage for CH1 in A/D, CH2 in Local-Remote
Alarms Actions

8 X 8
M A T R I X
I n p u t
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
U S E R
S p lit t e r
O u t p u t
C o u p l e r

Figure 285212: Matrix configuration for CH1 in Add/Drop and CH2 in Local-
Remote loopback
Channel 1 in Local loopback and Channel 2 in Add/Drop configuration
User side.

Alarms Actions
Shutdown CWDM TX1

8 X 8
M A T R I X
I n p u t
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
U S E R
S p lit t e r
O u t p u t
C o u p l e r

Add/Drop

Channel 1 in Remote loopback and Channel 2 in Add/Drop configuration
CWDM side.

Table 7.33 Alarms and action usage for CH1 in Remote loopback, CH2 in
Alarms Actions
Shutdown CWDM TX1

8 X 8
M A T R I X
I n p u t
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
U S E R
S p lit t e r
O u t p u t
C o u p l e r

Add/Drop
CH1 in Local-Remote loopback and CH2 in Add/Drop configuration
See Figure 215288. The Local-Remote loopback is used for testing purpose on both
User and CWDM sides.

Remote loopback
Alarms Actions

8 X 8
M A T R I X
I n p u t
U s e r R X 1
C W D M T X 1
C W D M R X 1
C D R 3
U s e r R X 2
C W D M T X 2
C W D M R X 2
C D R 4
U S E R
S p lit t e r
O u t p u t
C o u p l e r

Figure 288215: Matrix configuration for CH1 in Local-Remote loopback, CH2 in
Remote loopback
Optical-SNCP
The O-SNCP is provided when the Matrix is configured in Add/Drop mode on both
the channels. This is the default configuration, described in Add/Drop configuration
(default configuration).
The O-SNCP protection is based on the parallel transmit and best one receive
strategy at optical level. At the transmit side, the signal is broadcasted to the two arms
of the ring or point-to-point link, and the available signal is selected at the receive side,
according to the failure conditions of the two signals.
The splitter and the coupler are used to route optical signals in this application, as
shown in Figure 208282..
The two involved CWDM transponders are placed in the same WLA board: one has to
be configured as main (CH1), the other being spare (CH2).
The system implements protection actions according to the alarms and status
information of both CWDM receivers.
O-SNCP rules:
only one channel can be configured as loop-back mode at same time
the unit must be configured in O-SNCP auto switch mode before loop-back operation
should any loop-back been configured, the O-SNCP function is not available.

Wavelength adapter 3 with O-SNCP (WLA3CDOP)
125Mbps
WDMRx
ALARM&
CONTROL UNIT
WDMTx
USER
USER
to 2.7Gbps
TX
RX
CLIENT
CLIENT
CWDM
CWDM
CDR
CDR
OUTPUT
INPUT
INPUT
OUTPUT
125Mbps
to 2.7Gbps
DWDM) OPTICAL
MODULE - SFP
B&W (or CWDMor
125Mbps
WDMRx
WDMTx
USER
USER
to 2.7Gbps
TX
RX
CLIENT
CLIENT
CWDM
CWDM
CDR
CDR
OUTPUT
INPUT
INPUT
OUTPUT
125Mbps
to 2.7Gbps
MODULE - SFP
WDM1
WDM2
USER1
USER2
8X8
MATRIX
optical
coupler
FROM
USER
optical
splitter
TO
USER
(or B&W) OPTICAL
MODULE - SFP
CWDMor DWDM
MODULE - SFP
CWDMor DWDM
(or B&W) OPTICAL DWDM) OPTICAL
B&W (or CWDMor
P
O
R
T

1
P
O
R
T

3
P
O
R
T

2
P
O
R
T

4
SDH
PERFORMANCE
MONITORING

Figure 289216: WLA3CDOP unit block diagram

Description
The WLA3CDOP (wavelength adapter) is only used for protection purpose. It is
equipped with two multirate (125 Mbps -> 2.67 Gbps) transponders, one optical
splitter and one optical coupler supporting
one protected CWDM optical channel (O-SNCP), in the 1470nm->1610nm range, 20nm
spaced or
one protected DWDM optical channel, in the 1529.55 nm -> 1561.42 nm range, 100 GHz
spaced.
One optical protected signal is managed by this board: one user input is available and
the signal is split to both channels in Tx (client to WDM) and viceversa in Rx.
The optical splitter is connected to the two optical channels (transponders), user side,
allowing to transmit the client signal on both the paths (main/protected and
spare/protecting).
The optical coupler is connected to the two optical channels (transponders), user side,
allowing to select the signal according to the failure conditions: the main signal is
selected if it is not affected by fault, the spare one (if OK) is selected if the main signal
is faulty.
The main functions of this board are to provide O-SNCP and to convert (for each of
the two channels) the User optical signal into a WDM coloured optical signal and
viceversa.
Moreover it performs 3R function for both User and WDM sides.
The two User transceivers and the two WDM transceivers are external SFP pluggable
modules so that they can be alternated according to the different applications, in the
100Mbps->2.67Gbps bit rate range. Refer to Small Formfactor Pluggable (SFP) optical
modules and Figure 676 for SFP description, and Table 5.1 1696MS boards and units
listTable 5.1 1696MS boards and units listTable 5.1 1696MS boards and units
listTable 5.1 1696MS boards and units list for SFP list.
All the SFP types (B&W, CWDM, DWDM) can be plugged onto all the
interfaces/ports, but the protection scheme forces Port 1 and Port 3 (C1, S1 and C2, S2
on the front plate) to be tagged as user and Port 2 and Port 4 (W1 and W2 on the
front plate) to be tagged as line.
Therefore, channel #1 uses ports #1 and #2, channel #2 uses ports #3 and #4.

Each Line (with WDM SFPs, W1, W2 on the front plate) bidirectional optical
interface is the connection to the network, and it is accomplished by a coloured single
wavelength on the WDM module. Each wavelength on the Line interface is then
The WDM interfaces can be
Each Client interface (with B&W SFPs) provides the connection to the client of the
network.
All the SFP types (listed below) can be plugged on Port 1 and Port 3 (C1, S1, C2, S2).
The following SFP modules are supported (on all the interfaces/ports):
16.2) 1550nm
1310nm
DWDM: multirate (125 Mbps->2.67 Gbps) DWDM modules with APD detector
The CWDM/DWDM coloured SFP modules are able to accept all the bit rates in the
range 125Mbps->2.666Gbps, but only a set of discrete bit rates is supported by the
card as mentioned below.
The (line and user) optical interfaces are LC/PC connectors. The SFP modules can be
Optical measurements are supported (Laser Bias, Optical Received Power and Optical
Transmitted Power on all SFPs with DDM).
STM-1/OC-3 (155.52Mbps)
ESCON (200 Mbps)
STM-4/OC-12 (622.08Mbps)
OC-24 (1.24416 Gbps)
STM-16/OC-48 (2.48832 Gbps)
features:
Add and Drop
optical channel protection check: O-SNCP = switch control (turn ON/OFF User B&W TX)
Performance Monitoring are performed on SDH signals on four ports
simultaneously. SDH PM are calculated on B1 byte.

Not traffic affecting Firmware Download is available.
Refer to.Wavelength adapter 3 with O-SNCP (WLA3CDOP) characteristics
Refer to Boards behavior depending on APSD status.
Configurations
The allowed configurations are the same as WLA2M_OP, refer to Configurations.
Optical-SNCP
The O-SNCP is provided when the Matrix is configured in Add/Drop mode on both
the channels. This is the default configuration, described in Add/Drop configuration
(default configuration).
The O-SNCP protection is based on the parallel transmit and best one receive
strategy at optical level. At the transmit side, the signal is broadcasted to the two arms
of the ring or point-to-point link, and the available signal is selected at the receive side,
according to the failure conditions of the two signals.
The splitter and the coupler are used to route optical signals in this application, as
shown in Figure 20982.
The two involved CWDM transponders are placed in the same WLA board: one has to
be configured as main (CH1), the other being spare (CH2).
The system implements protection actions according to the alarms and status
information of both CWDM receivers.
In case of GBE-SX SFP is used as client, if protection is required, OPC board has to be
used.
O-SNCP rules:
only one channel can be configured as loop-back mode at same time
the unit must be configured in O-SNCP auto switch mode before loop-back operation
should any loop-back been configured, the O-SNCP function is not available.

4xANY_P
Description
TDM concentrators are able to multiplex in the time domain up to 4 low bit-rate
(client) signals into a 2.5 Gbps B&W WDM signal. The multiplexed client signals
are listed below:
- 4 x Fast Ethernet
- 4 x FDDI
- 4 x ESCON
- 4 x Digital Video
- 4 x STM1
- 3 x STM4
- 2 x Gigabit Ethernet
- 2 x Fiber Channel or FICON
- some mixes are also possible:
3 x (FDDI or FE or DV or ESCON or STM1) + 1 x STM4
2 x (FDDI or FE or DV or ESCON or STM1) + 2 x STM4
2 x (FDDI or FE or DV or ESCON or STM1) + 1 x (FC or GbEth or FICON)
1 x (FDDI or FE or DV or ESCON or STM1) + 1 x STM4 +1 x (FC or GbEth
or FICON)
2 x (FC or GbEth or FICON).
The 4xANY_P board hosts a 2.5 Gbps pluggable optical module (SFP) providing the
2.5 Gbps aggregate interface, by means of a B&W STM-16 ( I-16.1 or S-16.1) or
CWDM (PIN or APD) or DWDM (APD) transceiver. L-16.x B&W SFPs can also be
plugged, but they have to be declared as SFP generic.
The CWDM wavelenght range is 1470->1610nm and one wavelength per module is
accessible.
The DWDM wavelenght range is 1561.42->1529.55nm and one wavelength per SFP is
accessible.
The architecture of the TDM concentrator board is based on the concept of virtual
concatenation, and on the mapping of SDH on OTN:
- the data traffic is packet into VC-4 structures virtually concatenated. Virtually
concatenated means that any VC-4 can follow an indpendent path crossing any

SDH/SONET network (included legacy ADM). Each VC4 is then concatenated
again in the remote 4xANY.
- the VC-4s are groomed into a STM-16 structure.
In Figure 217290 is shown the block diagram.
The board is divided into:
- one mother board
- one daughter board
- 1 to 4 (client) drawers plugged on the mother or daughter board (2 on each one).
- a 1310 nm B&W transceiver for 4xAny and 4xANY_S
- a 1310 nm B&W or CWDM or DWDM pluggable transceiver for 4xANY_P only.
The board consists essentially in:
- 4 slots for bi-directional client optical interfaces
- One 2.5 Gbps transceiver (or CWDM or DWDM SFP transceiver for 4xANY_P).
The 4xANY_P unit interfaces with
- the MCC and WLA boards via the B&W 2.5 Gbps transceiver (STM-16 SFP)
- CWDM Mux/Demux / OADM via CWDM SFP
- DWDM Mux/Demux / OADM via DWDM SFP.
Receivers and transmitters can be locked either on the received clock or the local
clock:
- Default configuration : Tx locked to local clock and Rx locked to the received
clock.
- Loop-back configuration. LoopBack and Continue managed.
From R.2.2 the B1 performance monitoring is enabled consisting in monitoring the B1
byte of the aggregate signal received (WDM Rx).
It is also provided the 4xANY 1+1 protection consisting in protecting each client
individually.
4 X ANY supports concentration of Fast Ethernet and GbE Jumbo frames including
9000 bytes frames.
t
o
/
f
r
o
m
c
o
r
r
e
s
p
o
n
d
i
n
g
t
r
a
n
s
p
o
n
d
e
r
2
.
5

G
b
/
s
drawer #1
Alarm & Control
unit
C
O
N
C
E
N
T
R
A
T
O
R
S
T
M
-
1
6

m
a
p
p
e
r

Rx
Tx
drawer #3
Rx
Tx
Rx
Tx
drawer #2
Rx
Tx
drawer #4
Rx
Tx
E/O
S
T
M
-
1
6

R
e
g
e
n
e
r
a
t
o
r

Client
signal
Client
signal
Client
signal
Client
signal
STM-16*
C D R
C D R
C D R
C D R
SFP pluggable module
2
Card
presence
* a B&W or CWDM or DWDM SFP module can be plugged on 4xANY_P

Figure 290217: 4xANY_P block diagram

Configuration
Client side, three different kinds of drawers are provided:
- high frequency 1310 nm optical interfaces drawers (Gigabit Ethernet, Fiber
Channel), which can be plugged only on the ports #3 et #4 (HF_1310_DRAWER).
- STM1/4 drawers, which can be plugged on any slots. But, STM_4 Bit rate can
only be set for ports #3 and #4 (SDH-SONET_1310_DRAWER).
- Particular Case: For the 3 x STM4 configuration, the slot #1 is exceptionally
occupied by a STM-4 bit rate.
- Low frequency drawers (Fast Ethernet, FDDI, ESCON, Digital Video) with 1310
nm optical interfaces, which can be plugged in any slots (LF_1310_DRAWER).
- Low frequencydrawers equipped with 1310 nm detector and laser. The optical
interfaces are have better jitter figures. The rules followed for the position of these
drawers are only imposed by the low frequency nature of the drawer
(LF_1310_2_DRAWER).
- High frequencydrawers equipped with 850 nm detector and laser. The rules
followed for the position of these drawers are only imposed by the high frequency
nature of the drawer (HF_850_DRAWER).
- Low frequencydrawers equipped with 850 nm detector and laser. The rules
followed for the position of these drawers are only imposed by the low frequency
nature of the drawer (LF_850_DRAWER).
Furthermore, a limited number of configurations of drawers can be provided. Rules
must be followed :
- If High Frequency drawer in ports #3, the port #1 must be non provisioned
- If High Frequency drawer in ports #4, the port #2 must be non provisioned
The following table lists the allowed configurations.

Table 7.35 Allowed drawers association
Drawer #1 Drawer #3 Drawer #2 Drawer #4
Not provisioned High Frequency Not provisioned High Frequency
Low Frequency / STM-
1
1 / STM-4
1
1 / STM-4
Not provisioned High Frequency / Low
Frequency / STM-1 /
STM-4
Low Frequency / STM1 Low Frequency / STM-
1 / STM-4
1
1 / STM-4
Not provisioned High Frequency / Low
Frequency / STM-1 /
STM-4
STM-4 STM-4 Not provisioned STM-4

Any couple (DRW#1 ; DRW#3) can be associated to any couple (DRW#2 ; DRW#4)
except for the last line (3 x STM-4 configuration is fixed for the 4 drawers).
See 4xANY_P TDM Concentrator characteristics..
In the following table is described the 4xANY loss propagation

Table 7.36 Summary of the way of working. Drop insert

Alarm Shown To User To STM-16 signal
ILOS#i X Pk-AIS
LOS X All SSF_U MS-RDI and Pk-RDI
LOF X All SSF_U MS-RDI and Pk-RDI
MS-AIS All SSF_U MS-RDI and Pk-RDI
SSF_U X SD Pk-RDI
AU_AIS SSF_U Pk-RDI
AU_LOP SSF_U Pk-RDI
PLM SSF_U Pk-RDI
SQM SSF_U Pk-RDI

Alarm Shown To User To STM-16 signal
LOM SSF_U Pk-RDI
LOA SSF_U Pk-RDI
UNEQ SSF_U Pk-RDI
Pk-AIS SD Pk-RDI
Pk-RDI

2xGE_FC
USER RX
USER TX
U
S
E
R

1

I
N
B&W GE
/FC or
PMA 8B/
10B
64B/
65B
SUPER
BLOCKS
GFP-T
VIRTUAL
CONCAT
EXTERNAL
RAM
POH
Loopbacks
TDM
STM-16
SFP
C/DWDM
WDMTx
WDMRx
C/DWDM
or B&W
SFP
STM-16
U
S
E
R

1

O
U
T
L
I
N
E
1

O
U
T
L
I
N
E
1

I
N
WDMTx
WDMRx
SFP (not used)
L
I
N
E
2

O
U
T
*
L
I
N
E
2

I
N
*
USER RX
USER TX
U
S
E
R

2

I
N
B&W GE
/FC or
PMA 8B/
10B
64B/
65B
SUPER
BLOCKS
GFP-T
SFP
C/DWDM
U
S
E
R

2

O
U
T
USER 3 , USER 4 and LINE 2 (W-P) ARE NOT USED
ETH
PM
B1,J0
PM
C/DWDM
or B&W
STM-16
1GBE
1GBE
SDH STM-16
B&Wor CWDM
or DWDM
ADAPTATION
DCC
BACKPLANE TDMLINKS

Figure 291218: 2xGE_FC block diagram

Description
The block diagram is shown in Figure 218291.
2xGE_FC board provides GbE/FC/FICON aggregation supporting two clients
aggregation/extraction into/from one STM-16/OC-48 frame.
Client side there are four interfaces/ports, but only two are available in current release
(U1 and U2 on the front plate).
Line side there are two interfaces/ports, but only Line 21 is available in current release
(W-P on the front plate). Line 12 (W-P) will be available when E-SNCP is provided
(future rel.)
All the interfaces/transceivers are external SFP pluggable modules so that they can be
alternated according to the different applications. Refer to Small Formfactor Pluggable
(SFP) optical modules and Figure 676 for SFP description, and Table 5.1 1696MS
boards and units listTable 5.1 1696MS boards and units listTable 5.1 1696MS boards
and units listTable 5.1 1696MS boards and units list.for SFP list.
The supported clients are:
Gigabit Ethernet (1.25 Gbit/s) with supports of jumbo frames (9.6kbytes)
Fiber Channel and FICON (1.0625 Gbit/s)
The mapping of clients is Transparent GFP (GFP-T) for Gigabit Ethernet, FC and
FICON.
The Virtual Concatenation uses a fixed number of VC-4 (VC-4-7v for Gigabit Ethernet
and VC-4-6v for FC and FICON). The allocated VC4 for:
GbE client 1 are VC4-#0 to VC4-#6
GbE client 2 are VC4-#7 to VC4-#13
FC client 1 are VC4-#0 to VC4-#5
FC client 2 are VC4-#6 to VC4-#11.
From client Rx to line Tx, after O-E converting, the two serial client signals are sent
to the mapper. After internal processing in the mapper, the client service are
encapsulated into GFP frame and framed into STM-16/OC-48 frame. The STM-
16/OC-48 signal is then muxed into serial signals and sent to the line transceiver via
CDR, to drive the Line SFP.
From line Rx to client Tx, the reverse operation is performed.
The Line (with WDM SFP, W on the front plate) bidirectional optical interface is the
connection to the network, and is accomplished by a coloured single wavelength on the
WDM module. Each wavelength on the Line interface is then multiplexed into a single
fiber and sent to the network.
The Line interface supports

B&W STM-16/OC-48 pluggable modules (SFP): I-16.1, S-16.1, L-16.1 and L-16.2 (see
below the SFPs list); L-16.1 and L-16.2 are managed only as SFP_Generic. In this case the
board needs to be connected to a B&W port of a transponder (MCC3, WLA) to obtain a
WDM signal.
Each Client interface (with B&W SFPs, U1 and U2 on the front plate) provides the
connection to the clients of the network.
GbE-SX, LX and ZX B&W SFPs are usually plugged on clients interfaces, but also
CWDM and DWDM ones are supported (see below the SFPs list).
The following SFP modules are supported:
B&W I-16.1/S-16.1: STM-16 Inter-office/Short reach at 1310nm
B&W L-16.1/L-16.2: STM-16 Long reach at 1310nm and 1550nm (managed as
SFP_Generic)
DWDM: multirate (125 Mbps->2.67 Gbps) DWDM modules with APD detector
The optical interfaces/ports are LC/PC connectors. The SFP modules can be
Optical measurements are not supported by the mother board. SFPs measurements are
supported.
Loopbacks can be independently configured. Simultaneous creation are available for
client loopbacks only. When configured, it is possible to monitor the signal. The
following loopbacks are available:
on user side, loop-and-continue
on line side, loop-and-continue.
CLIENTS
1
2
MAPPER
+
FRAMER
LINE
1
CLIENTS
1
2
MAPPER +
FRAMER
LINE
1
LOCAL (USER) LOOPBACK REMOTE (LINE) LOOPBACK

Figure 292219: Loopbacks configuration of 2xGE_FC

Performance monitoring are monitored at both clients and line side, and
simultaneously.
PM 8B/10B, also called PM Ethernet layer 1, are available on client side.
Firmware Download is available.
LOS propagation
Client-to-line: on detection of LOS on user#1 or 2, a GFP-SSF indication is inserted in GFP
frame
Line-to-client: on detection of GFP-SSF on user#1 or 2
when O-SNCP is configured, see protection management (Protection of the 2xGE_FC
client)
when protection is not configured, shut down is applied to the user.
If Rx_LOS or LOF occurs on the local client Rx, the opposite client Tx of 2xGE_FC
shuts down automatically, as shown in Figure 220293.
CLIENT
1
CLIENT
2
MAPPER
+
FRAMER
LINE
1
LINE
2
Rx LOS/LOF
Tx
LOCAL
CLIENT
1
CLIENT
2
MAPPER
+
FRAMER
LINE
1
LINE
2
TX
Rx
REMOTE
LASER
SHUT
DOWN

Figure 293220: Example of communication between two 2xGE_FC boards

Refer to 2xGE_FC optical characteristics.
Configurations
One cross-connection is available on line side.
The default configuration (on provisioning of the board) on 2xGE_FC boards is no
cross-connection.
On provisioning of LINE 1 (W on the front plate ) SFP, the cross-connection is
automatically created.
On de-provisioning of LINE 1 SFP, the cross-connection is automatically deleted.
The cross-connection management is not accessible to the manager.
The allowed configurations are the following:
no-cross-connection
Add/Drop connection LINE 1
E-SNCP (not managed in current rel.).
In Add/Drop configuration the traffic received from WDM/Line receiver is dropped on
to the user network, i.e. sent to the user transmitter, as the same traffic received from
the user receiver is added on to the CWDM line via CWDM transmitter.
2xGE_FC behavior depending on APSD status

Table 7.37 2xGE_FC Shut Down mode with no E-SNCP

Node Type state Behaviour
a. Line
Terminal
b. Add & Drop
in OADM or
back-to-back
node
APSD enable on SFP#6 NOT
SUPPORTED

APSD enable on SFP#j (j =1,2)
NOT SUPPORTED

APSD disable on SFP#6 LOS on SFP#6Rx SD of SFP#j Tx (j =1,2)

APSD disable on SFP#j

APSD disable forced ON on
SFP#6
SFP#6 Tx always ON
Not at 1.17"

Node Type state Behaviour
LOS on SFP#6Rx SD of SFP#j Tx (j =1,2)
APSD disable forced ON on
SFP#j (j =1,2) (*)
SFP#j Tx always ON (j =1,2)
APSD disable forced OFF on
SFP#6
SFP#6 Tx always OFF
LOS on SFP#6Rx SD of SFP#j Tx (j =1,2)

APSD disable forced OFF on
SFP#j (j =1,2) (*)
SFP#j Tx always OFF (j =1,2)

(*) When client protection (O-SNCP), only APSD disable mode is supported.
8xGbE concentrator (8xGE)
USER RX
USER TX
IN
B&W GE SFP
LAYER 2
SWITCH
LINE TX
LINE RX
B&W or
10GXFP
OUT
LINE1 OUT
LINE1 IN
LINE TX
LINE RX
LINE2 OUT
LINE2 IN
P
M
D
1.250 Gbps : GbE
9.9532Gbps: 10 GbE WAN
FRONT
PANEL
USER RX
USER TX
IN
B&W GE SFP
OUT
USER RX
USER TX
IN
B&W GE SFP
OUT
USER RX
USER TX
IN
B&W GE SFP
OUT
RGMII
RGMII
RTX 1
10 GBE
LAN/WAN
XGMII
XGMII
10Gbps
10Gbps
P
M
A
P
C
S
PHY 4XGE
P
M
D
P
M
A
P
C
S
PHY 4XGE
8B/10B
8B/10B
P
C
S
64B/65B
RTX 2
10 GBE
LAN/WAN
P
C
S
64B/65B
M
A
C
M
A
C
USER RX
USER TX
IN
B&W GE SFP
OUT
USER RX
USER TX
IN
B&W GE SFP
OUT
USER RX
USER TX
IN
B&W GE SFP
OUT
USER RX
USER TX
IN
B&W GE SFP
OUT
DWDM
B&W or
10GXFP
DWDM
PORT#1
PORT#2
PORT#3
PORT#4
PORT#5
PORT#6
PORT#8
PORT#7
(8B/10B)
ETH LAYER 1 PM
1 2 3 4 5 6 7 8
FROMGBE
CLIENT SIGNALS
IN CONCENTRATION CONFIGURATION, ONLY LINE 1 IS USED
IN ADD/DROP CONFIG., BOTH LINE 1 AND LINE 2 ARE USED (SOME CHS ARE IN A/D, THE OTHER ARE IN PASS-THROUGH)
B1 PM

Figure 294221: 8xGE block diagram

Description
The block diagram is shown in Figure 221294.
The 8xGE unit is an Ethernet concentrator which aggregates up to eigth Gigabit
Ethernet client signals at 1.25Gbps into a 10 GbE WAN frame at 9.95 Gbps, via Layer
2 switch. It can also be a transponder.
All the client interfaces/transceivers are external SFP pluggable modules (P1 to P8 on
the front plate). Refer to Small Formfactor Pluggable (SFP) optical modules and
Figure 676 for SFP description, and Table 5.1Table 5.1Table 5.1 for SFP list.
The Line interfaces/transceivers are external XFP pluggable modules (L1 and L2 on
the front plate). Refer to XFP optical modules and Figure 687 for XFP description,
Table 5.1Table 5.1Table 5.1 for XFP list.
The supported client is Gigabit Ethernet (1.25 Gbps) with supports of jumbo frames
(9.6kbytes).
The supported Line is 10 Gigabit Ethernet WAN (9.95 Gbps) on a B&W or DWDM
wavelength.
If a B&W XFP is plugged, line side, it is optically connected to the client interface of a
transponder.
If a DWDM XFP is plugged, line side, it is a transponder and it is optically connected
to the mux/demux.
In concentration mode (point-to-point) only L1 is used, while both the L1 and L2 line
ports are used in add/drop mode (multipoint), as described in Ethernet concentrator
sub-system.
From client Rx to line Tx, the GbEthernet streams coming from SFP modules are sent
via a serial link at 1.25 Gbps towards the PHYs. The PHYs perform the entire IEEE
802.3z PCS, including 8B/10B encoding-decoding and furnish the 1GbE (1Gbps) over
RGMII towards the Layer 2 switch. The Layer 2 switch tags the up to eigth Ethernet
streams with a PVID, then aggregates the different streams and send them, over a
XGMII interface, to one (or both) 10 GbE transceiver.
The 10 GbE transceiver provides the entire IEEE 802.3ae, including PMD, PMA and
PCS with 64B/65B encoding-decoding. Its serial output is 10 GbEthernet WAN (9.953
Gbps).
The serial output of the 10 GbE transceiver(s) is then sent to an XFP port.
In Line to client direction, the 10 GbEthernet stream, after being recovered and
decoded by the 10 GbE transceiver, is sent towards the high-speed port of the Layer 2
switch. The Layer 2 switch is able, through the PVID tag, to send the single 1GbE
stream to the access port at which the PVID is associated.
The Line (L1 and L2 connectors on the front plate) bidirectional optical interface hosts
B&W or DWDM optical modules. According to the XFP plugged, it can be connected
to the B&W port of a transponder or to the mux/demux.
DWDM line interface is provided by a 10G DWDM XFP with APD detector.
The following types of B&W line interface are supported, according to the B&W XFP
plugged:
ITU-T G.691 I-64.1: 2 Km reach, up to 4 dB link budget, 1310nm
ITU-T G.693 VSR 2000-2R1: 2 Km reach, up to 4 dB link budget, 1310nm
ITU-T G.691 S-64.2b: 40 km reach, up to 11 dB link budget, 1550nm
IEE 802.3 10GBASE-SR, 10GBASE-SW: 300 m reach, up to 2.6 dB link budget, 850nm
IEE 802.3 10GBASE-LR, 10GBASE-LW: 10 Km reach, up to 9.4 dB link budget, 1310nm
IEE 802.3 10GBASE-ER, 10GBASE-EW: 40 Km reach, 1550nm.
The following B&W and DWDM XFPs are supported, line side:
10 GbE BASE-S (B&W), supporting 9.95/10.31Gbps in 1
st
window
I-64.1 / 10 GbE BASE-L (B&W), client side; supporting 9.95/10.31/10.7Gbps in 2
nd
window
S-64.2b / 10 GbE BASE-E (B&W), client side; supporting 9.95/10.31/10.7Gbps in 3
rd

window
APD DWDM, line side; supporting 9.95/10.31/10.711.09Gbps in 3
rd
window.
Each Client interface (P1 to P8 on the front plate) provides the connection to the
clients.
B&W GbE-SX/LX/ZX in 1
st
, 2
nd
and 3
rd
window respectively and CWDM APD (long
haul) and PIN (short haul) interfaces are supported, client side, according to the SFP
plugged.
The following SFP modules are supported, client side:
B&W GbE-SX, GbE-LX, GbE-ZX, supporting 1.25Gbps bit rate at 850nm, 1310nm, 1550nm
Multirate CWDM with PIN or APD detector, supporting 125Mbps -> 2.67Gbps bit rate.
The optical interfaces/ports are LC/PC connectors. The SFP/XFP modules can be
Performance monitoring are monitored at both clients and line side, and
simultaneously
PM 8B/10B, also called Layer 1 GbE PM, are available on client side.

Loopbacks can be independently configured. Simultaneous creation are available for
client loopbacks only. When configured, it is possible to monitor the signal. Loopbacks
on user side and loopbacks on line side are available, but not simultaneously. The
following loopbacks are available:
on user side, loop-and-cut: it performs a loop at PCS level
on line side, loop-and-cut: it performs a line loop after the PCS block.
CLIENTS
1
8
MAPPER
+
FRAMER
LINE
1
CLIENTS
1
8
MAPPER +
FRAMER
LINE
1
LOCAL (USER) LOOPBACK REMOTE (LINE) LOOPBACK

Figure 295222: Loopbacks configuration of 8xGE (in concentration mode)

Frequency allocation. The frequency of the board depends on the XFP type. In case
of a DWDM XFP is plugged, line side, 32 XFPs P/N are available to cover the 32
supported channels on the 100 GHz grid.
Consequent actions
Client-to-line: on detection of LOS, LOSy on USER#N CSF indication is inserted in the
Ethernet frames corresponding to the #N client in the 10GbE WAN frame.
Line-to-client : on detection of ETHS_SSF or ETHS_CSF alarm on user#U, Shut-Down is
applied to the user #U
- on detection of ILOS on Line #V:
all users carrying a VLAN contained in faulty 10G signal on line #V, is put in
Shut-Down
a SSF shall be inserted in the 10G frame on the other Line port for VLANS in
pass-through.
Line-to-Line:
- on detection of ILOS on Line #V:
a SSF shall be inserted in the 10G frame on the other Line port for vlans in
pass-through.
Firmware Download is available: it is not traffic affecting. Firmware version is
accessible.
Measurements
Temperaure measurement is available on the board. XFP and SFP measurements
(input and output power, ILOS alarm...) are accessible by the controller through the
board.

Board configuration
Three configuration modes are available:
AUTOMATIC_CONCENTRATION: designed for automatic configuration in case of point-
to-point network configuration. Only L1 (line 1) interface is used
REMOTE_ADD-DROP: in the case of Add/Drop configuration (some ethernet streams are
dropped, other are in pass-through), both 10G (L1 and L2) interfaces are used
The default configuration (on provisioning of the board) is
AUTOMATIC_CONCENTRATION.
It is possible to go from AUTOMATIC_CONCENTRATION mode to
REMOTE_ADD-DROP mode but not the reverse modification. This mode
modification is non-traffic affecting.
Refer to 8xGE optical characteristics.
MVAC10_2 is mandatory for XFP_DWDM post-emphasis.

8xGE behavior depending on APSD status

Table 7.38 8xGE Shut Down mode with no E-SNCP

Node Type 8xGE state Behaviour
a. Line Terminal
b. Add & Drop
in OADM or
back-to-back
node
APSD enable
(not supported)
- -

- -

APSD disable LOS on User Rx SD of line Tx

LOS on line Rx SD of Users Tx

APSD disable forced ON Line Tx always ON

APSD disable forced OFF Line Tx always OFF

Formatted: Indent: Left: -0.01", Hanging:
a, b, c, + Start at: 1 + Alignment: Left +
Aligned at: 0.92" + Tab after: 1.17" + Indent
at: 1.17", Tab stops: Not at 1.17"
TRBD1996

TRBD1996 Block Diagram
NB. Matrix and high frequency backpanel links have been removed from previous
edition.

Description
The TRBD1996 is a G709 transponder. A SDH or 10GbE WAN or 10GbE LAN can
be mapped into a G709 or G709* frame. The client and line interfaces are XFP
modules. The client interface is called port#1 and line interfaces is called port#2 .
The supported clients are :
-- STM64 or OC192 (9.95328 Gbit/s)
-- 10 Gigabit Ethernet WAN (9.95328 Gbit/s)
-- 10 Gigabit Ethernet LAN (10.3125 Gbit/s)
In--band supervision
Communication of GCC towards Controller with TDM links is present but no
management in the present release.
Protection
1+1 O--SNCP protection is available. TRBD1996 board is protected by a board of the
same type. 1+1 E--SNCP protection is not managed .
Performance monitoring
Performance is monitored at both clients and line side, and simultaneously.

-- PM B1 is available on user side,
-- PM 64B/66B, also called PM Ethernet layer 1, is available on user side,
-- PM FEC is available on line side.
Frequency allocation
The optical module frequency choice depends on XFP nature.
Loop--Backs functions
Loopbacks should be independently configured. Simultaneous line and user loopback
is not possible. When
loopback is configured, it is possible to monitor the signal.
The following loopbacks are available :
-- on user side, loop--and--continue
-- on line side, loop--and--continue
Loopbacks can only be configured if no protection is present. Loopbacks are
performed by the FEC ASIC.
Consequent actions
Client--to--line: On detection of ILOS_USER a GEN_AIS is inserted in the G709
frame payload. Any other alarms are transparently propagated.
Line--to--client : On detection of ILOS_LINE, OTU2_LOF_LINE,
OTU2_LOM_LINE, GEN_AIS_LINE the user emitter is shut--down. Any other
alarms (client layer alarms) are transparently propagated.
FirmWare Download
Two firmwares are managed on the TRBD1996:
-- One for the board control. The activation of this firmware is not traffic affecting.
-- One for the ethernet layer monitoring. The activation of this firmware is traffic
affecting.
Measurements
Temperature measurement is available on the mother board. XFP measurements are
accessible by the controller through the TRBD1996.
Board configurations
The TRBD1996 is regarded as a fixed transponder from the operator point of view.
The default configuration (on provisioning of the board) on TRBD1996 boards is
Drop--insert connection .
All optical ports are equipped with XFP modules.
The TRBD1996 shall manage the following XFP:
XFP_generic
XFP_DWDM
XFP_I64
XFP_S64--2b

TRBD1996 line TX Shut Down mode

TRBD1996 user TX Shut Down mode

Small Formfactor Pluggable (SFP) optical modules
Refer to Figure 22396.
The SFP modules are the optical physical accesses for:
client side of the MCC3 and 8xGE
aggregate side of the 4xANY_P
WDM and client sides of the WLA and 2xGE_FC boards.
The following (B&W, CWDM, DWDM) SFP modules are supported (also refer to
Figure 676 andTable 5.1Table 5.1Table 5.1).
B&W STM-1 : S-1.1/L-1.1/L-1.2; STM-1 Short / Long reach at 1310 nm and (L-1.2) 1550nm
B&W STM-4 : S-4.1 / L-4.1 / L-4.2; STM-4 Short / Long reach at 1310 nm and (L-4.2)
1550nm
B&W STM-16 : I-16.1/S-16.1/L-16.1/L-16.2; STM-16 Inter-office/Short/Long reach at
1310nm and (L-16.2) 1550nm
B&W STM-16 multirate: S-16.1 multirate/multiformat (up to 2.666Gbps) at 1310 nm
B&W FC / 2FC: Fiber Channel (1.065GHz) and 2 Fiber Channel (2.125GHz) at 850nm /
1310nm
CWDM : multirate (125 Mbps->2.6 Gbps) CWDM modules with APD or PIN detector
DWDM : multirate (125 Mbps->2.67 Gbps) DWDM modules with APD detector
An L-1.1 B&W SFP customized for OSC board is also available. It has a better
sensibility (-35 dBm) for increasing optical budget.
Each module contains on transmitter side an automatic optical output power control
circuit, a laser driver and a laser diode module.
The transmitter is based on an uncooled DFB laser.
The laser safety class for the complete integrated module is CLASS 1 according to IEC
60825-1: Ed.1.2 (08-2007) and IEC 60825-2: Ed.3.1 (01-2007).
It can manage command for TX disable and provides TX Fault alarm.
Depending on the SFP type, the optical access is compatible with
a single mode fiber (9/125 m) or
multi mode fiber (50/125 m or 62.5/125 m)
with standard LC optical connector.

TX Fault indicates a laser fault of some kind. The Transmitter is not disabled when TX
Fault signal is active.
Tx Disable is an input that is used to shut down the transmitter optical output.
On receiver side each module contains a PIN or APD photodetector for light to
electrical current conversion and a limiting amplifier.
The photo detected current is amplified by a an electrical circuit which delivers two
complementary data signals.
The module provides LOS alarm (Loss of input Power Signal alarm). This output
signal indicates the received optical power is below the worst-case receiver sensitivity
(as defined by the standard in use).
Depending on the SFP type, the optical access is compatible with
a single mode fiber (9/125 m) or
multi mode fiber (50/125 m or 62.5/125 m)
with standard LC optical connector.
The Transceiver has an EEPROM inside to provide Remote Inventory, containing
information about transceiver capabilities, standard interfaces, manufacturer... The
serial interface uses the 2-wire serial CMOS EEPROM protocol defined for the
ATMEL AT24C01A/02/04 family of components.
The digital diagnostic monitoring (DDM) is an SFP function supporting analog
parameters measurements as temperature, laser bias, laser power. It is an optional
feature: the availability information is present in the SFP remote inventory.
PIN
Laser
LASER
DRIVER
APC
Electrical DATA
Optical output
TX Fault
TX Disable
P
E
E
P
R
O
M
Remote Inventory / DDM
TR
A
N
SM
ITTER
R
EC
EIVER
LC
Optical input
LC
diode
PIN*
PRE
Main
Amplifier
Electrical DATA
D A T A -
D A T A +
D A T A -
D A T A +
SFPOptical Module
To board
(MCC3 or 4xANY_Por WLA
or 2xGE_FC or 8xGE) processing
to/from transponder
or OADM/mux/demux
* PIN or APD, according to the SFP type
LOS
(if WDMSFP)
(if B&WSFP)

Figure 296223: SFP modules general block diagram

XFP optical modules
The XFP optical modules are the optical physical access for the
client side of OCC10_E and OCC10_EC
line side of 8xGE
The following XFP modules are supported (also refer to Table 5.1Table 5.1Table
5.1and Figure 687):
B&W 10GBase-S for 10GbE WAN, 10GbE LAN signals, in 1
st
window
B&W I64.1/10G Base-L for SDH STM-64, 10GbE WAN, 10GbE LAN, OTN signals, in 2
nd

window
B&W S64.2b/10GBase-E for SDH STM-64, 10GbE WAN, 10GbE LAN, OTN signals, in 3
rd

window
DWDM with APD detector, supporting 9.95/10.31/10.709/11.09 Gbps bit rates.
The module is a 10Gbps serial-to-serial transceiver, made up of one optical transmitter
and one optical receiver.
The transmitter
gets the electrical data input through the 30-position pluggable edge connector
performs 3R regeneration via a CDR
converts the regenerated signal in the optical data output using a Laser.
The receiver
detects the optical data input via a Photo Detector
performs 3R regeneration via a CDR
sends the regenerated signal through the 30-position pluggable edge connector.
Input and output signals have NRZ format. A block diagram is depicted in Figure
224297.
The module is equipped with an I
2
C bus interface to access the following features
implemented in the module:
Monitor signals
Alarms signals
Control signals
Remote inventory (EEPROM)
Alarms and commands:
LOS XFP: Loss Of Signal
FAIL XFP: XFP fault
RESET XFP: module reset
LASER OFF: the laser sourse is tourned off
PRES XFP: module physically present.

Laser
Optical output
LC
To/from
10G
bps board
(8xGE, TRBD, OCC10)
10 Gbps
Laser
Driv er
Line
Driv er
Clock & Data
Recov ery
Equalizer Electrical DATA
D A T A -
D A T A +
Optical input
LC
10 Gbps
Photo
Detector
Line
Dr iver
Clock & Data
Recov er y
Equalizer
Electrical DATA
D A T A -
D A T A +
I 2 C
EEPROM
D A T A
C L O C K
+
5
. 0
V
+
3
. 3
V
+
1
. 8
V
G
N
D
L
O
S
X
F
P
F
A
I L
X
F
P
P
R
E
S
S
X
F
P
R
E
S
E
T
X
F
P
L
A
S
E
R
O
F
F
processing
to/from transponder
or OADM/mux/demux
(if WDMXFP)
(if B&WXFP)

Figure 297224: XFP modules general block diagram

Multiple Variable Attenuator Cards
Multiple Variable Attenuator Card (MVAC)
Description
The board contains 2 x VOAs (Variable Optical Attenuators). It can be located
between the demux and the mux of an OADM / OMDX. A VOA can be placed
between the two stages of an amplifier, too.
Purpose of MVAC is to manually adjust the channel emphasis in order to optimize the
transmission.
Coupled with the OSMC board it allows an automatic emphasis (automatic power
adjustment).

Figure 298225: MVAC unit block diagram

In Figure 225299, some examples of system configuration is given, where MVAC is
connected:
between demux and mux of a multiplexer card (OADM/OMDX)
at the input of a transponder (dropped channel)
between the first and the second stage of the optical amplifier(s).
MVAC can be used for any type of equipment connections:
looped/expansion/extra/external channel.
MVAC optical characteristics
See Multiple Variable Attenuator Cards (MVAC) optical characteristics.

1
2
M V A C
1
2
M V A C
I n 1
I n 2
O u t 1
O u t 2
I n 1
I n 2
O u t 1
O u t 2
1
2
M V A C
I n 1
I n 2
O u t 1
O u t 2
1
2
M
V
A
C
I
n
1
I
n
2
O
u
t
1
O
u
t
2
M C C M C C
P o s t E m p h a s i s
B u n d l e p a s s - t h r o u g h
M U X M U X
V O A i n M C C
V O A i n M V A C
1
2
M V A C
I n 1
I n 2
O u t 1
O u t 2
1 s t s t a g e 2 n d s t a g e
1 s t s t a g e 2 n d s t a g e
O p t i c a l A m p l i f i e r
1
V O A i n O A C
S i n g l e C h a n n e l
V O A i n O A C
O p t i c a l A m p l i f i e r
2
M
U
X
1
2
M V A C
I n 1
I n 2
O u t 1
O u t 2
E X T E R N A L
S I G N A L

Figure 299226: Example of MVAC location in the system

Multiple Variable Attenuator Card (MVAC10)
Description
The board contains 10 x VOAs (Variable Optical Attenuators). It can be located
between the demux and the mux of an OADM / OMDX. A VOA can be placed
between the two stages of an amplifier, too.
Purpose of MVAC10 is to manually adjust the channel emphasis in order to optimize
the transmission. Coupled with the OSMC board it allows an automatic emphasis
(automatic power adjustment).

Figure 300227: MVAC10 unit block diagram

MVAC10 management - power adjustment by using MVAC10 board

MVAC10 VOA are tuned so as to keep a constant output power. The operator
commands each VOA independently in relative attenuation.
Example: In a case of an OADM repeater, MVAC10 can be used at the interstage, in
order to tune each loop and pass-through (see Figure 230303). As flat spectrum at node
output is required, the operator measures the spectrum at the node output.

For each channel, the operator measures the power per channel. Then, he calculates the
needed relative attenuation in order to match to the required power per channel:
Delta (channel #i) = Power per channel (#i) Required power per channel
Once the operator loads Delta (#i) at the users interface, the VOA (#i) is tuned:
VOA (#i) new = VOA (#i) old + Delta (#i)
The MVAC10 measures the output power reached with this new VOA value and a
control loop allows to keep this output power constant.

Any VOA can be used for a loop, an expansion, an extra, SFP or external connection.
A VOA can also be placed at the output of an amplifier.


1
2
I n 1
I n 2
O u t 1
O u t 2
M U X M U X
M V A C 1 0
3 I n 3 O u t 3
4
5
I n 4
I n 5
O u t 4
O u t 5
6 I n 6 O u t 6
7 I n 7 O u t 7
8
9
I n 8
I n 9
O u t 8
O u t 9
1 0 I n 1 0 O u t 1 0
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
E x t r a
E x p a n s i o n
1
2
I n 1
I n 2
O u t 1
O u t 2
M U X
M V A C 1 0
3 I n 3 O u t 3
4
5
I n 4
I n 5
O u t 4
O u t 5
6 I n 6 O u t 6
7 I n 7 O u t 7
8
9
I n 8
I n 9
O u t 8
O u t 9
1 0 I n 1 0 O u t 1 0
W L A
W L A
1
2
3
4
5
6
7
8
E x p a n s i o n
E x t r a
W L A
W L A
W L A
W L A
W L A
W L A


Figure 301228: Example of MVAC10 configurations

MVAC10 optical characteristics
See Multiple Variable Attenuator Card (MVAC10) optical characteristics.
Set the output power of an MVAC10 board
MVAC10 VOA are tuned so as to keep a constant output power. The operator
commands each VOA independently in relative attenuation.
Example: In a case of an OADM repeater, MVAC10 can be used at the interstage, in
order to tune each loop and pass-through. As flat spectrum at node output is required,
the operator measures the spectrum at the node output.

For each channel, the operator measures the power per channel. Then, he calculates the
needed relative attenuation in order to match to the required power per channel:
Delta (channel #i) = Power per channel (#i) Required power per channel
Once the operator loads Delta (#i) at the users interface, the VOA (#i) is tuned:
VOA (#i) new = VOA (#i) old + Delta (#i)
The MVAC10 measures the output power reached with this new VOA value and a
control loop allows to keep this output power constant.

1. Display the board view of the MVAC10 you want to set.
2. Choose the Board Optical power level configuration menu option.
The ALC & Optical power level configuration dialog box is displayed.
3. Set the relative attenuation by using the up and down arrows of Attenuation
Delta #i fields.


4. Click on Apply
Wait a few seconds for the effective setting of the board. During this process the
command buttons of the dialog box are disabled.
The measured output power level is then displayed in the Optical power level
Output Port#i fields.
5. Click on Close to terminate.

Multiplexers

DWDM mux/demux : OMDX units
The following Mux/Demux (OMDX) boards are used

the Mux/Demux with the LB/SB combiner/splitter and the SPV couplers :
OMDX8100_M_L1_XS
the Mux/Demux with the LB/SB combiner/splitter : OMDX8100_M_L1_X
the upgrade Mux/Demux: OMDX8100_M_L2 , OMDX8100_M_S1 and OMDX8100_M_S2

OMDX8100_M_L1_XS
ch 30
ch 31
ch 32
ch 33
ch 35
ch 36
ch 37
ch 38
WDM
9:1
ch 30
ch 31
ch 32
ch 33
ch 35
ch 36
ch 37
ch 38
WDM
1:9
LB/SB
combiner
LB/SB
splitter
IPL
IOPV
Optical
Receiver
Line Rx in
Monitor
Line Tx out
SPV Tx in
E
x
tra
T
x
in
S B R x o u t
SPV Rx out
Monitor Tx out
W
D
M
T
x
in
E
x
tra
R
x
o
u
t
W
D
M
R
x
o
u
t
S B T x i n
Rx out
OPL
Optical
Receiver
OOPV
MUX
DEMUX

N.B. Monitoring Access: Optical power level at monitoring access is around 20
dB less the mean optical power of the line.
Figure 302229: OMDX8100_M_L1_XS: block diagram

Description
c.a. MUX side
The wavelength multiplexer component collects the 8 optical signals (corresponding to
the first part of the Long Band) and the signal coming from the extra-input
(multiplexed signal corresponding to the second part of the Long Band) and
multiplexes them into one optical signal. The following LB/SB combiner multiplexes
the Long Band and the Short Band.
d.b.DEMUX side
At the receive side, a coupler is used to monitor the input signal (power presence and
monitoring connector). Then, a WDM coupler is used to extract the supervisory
channel. Then, the Long Band and the Short Band are separated via the LB/SB splitter.
The long Band signal is demultiplexed into 8 channels plus one that corresponds to the
multiplexed 8 other channels of the LB.
See DWDM Mux/Demux units (OMDX) optical characteristics.

OMDX8100_M_L1_X
ch 30
ch 31
ch 32
ch 33
ch 35
ch 36
ch 37
ch 38
WDM
9:1
ch 30
ch 31
ch 32
ch 33
ch 35
ch 36
ch 37
ch 38
WDM
1:9
LB/SB
combiner
LB/SB
splitter
IPL
IOPV
SPV filter
Optical
Receiver
Line Rx in
Monitor Rx out
Line Tx out
E
x
tra
T
x
in
Monitor Tx out
W
D
M
T
x
in
E
x
tra
R
x
o
u
t
W
D
M
R
x
o
u
t
OPL
Optical
Receiver
OOPV
MUX
DEMUX
S B R x o u t
S B T x i n

Figure 303230: OMDX8100_M_L1_X: block diagram


Description
c.a. MUX side
The wavelength multiplexer component collects the 8 optical signals (corresponding to
the first part of the Long Band) and the signal coming from the extra-input
(multiplexed signal corresponding to the second part of the Long Band) and
multiplexes them into one optical signal. The following LB/SB combiner multiplexes
the Long Band and the Short Band.
d.b.DEMUX side
At the receive side, the Long Band and the Short Band are separated via the LB/SB
splitter. The long band signal is demultiplexed into 8 channels plus one that
corresponds to the multiplexed 8 other LB channels.
The optical characteristics are described inDWDM Mux/Demux units (OMDX)
optical characteristics.

OMDX8100_M_L2 , OMDX8100_M_S1 , OMDX8100_M_S2
42
43
44
45
47
48
49
50
52
53
54
55
57
58
59
60
OR
ch 20
ch 21
ch 22
ch 23
ch 25
ch 26
ch 27
ch 28
OR
L2 S2 S1
42
43
44
45
47
48
49
50
52
53
54
55
57
58
59
60
OR
ch 20
ch 21
ch 22
ch 23
ch 25
ch 26
ch 27
ch 28
OR
L2 S2 S1
Line Rx in
Line Tx out
E
x
tra
T
x
in
W
D
M
T
x
in
E
x
tra
R
x
o
u
t
W
D
M
R
x
o
u
t
MUX
DEMUX

Figure 304231: OMDX8100_M_L2 , OMDX8100_M_S1 , OMDX8100_M_S2 : block
diagram
Description
MUX side
The wavelength multiplexer component collects the 8 optical signals and the signal
coming form the extra-input and multiplexes them into one optical signal, ready to be
launched on the WDM line.
DEMUX side
The wavelength demultiplexer component receives the WDM line signal and
demultiplexes it into 8 channel plus one possible extra aggregate signal.
OADM application
Connecting the Extra Rx out access to the Extra Rx in access allows to pass-through
the channels that are not dropped and added. The board works in OADM
configuration.
These boards are supplied in power by the PSC.
The optical characteristics are described in L2 And S1 band Mux/Demux.
8-channel CWDM mux/demux: CMDX-U, CMDX-U-S, CMDX2-U, CMDX2-U-S
Refer to Figure 232305. This boards perform both the multiplexing and demultiplexing
of 8 CWDM channels/wavelengths, 20 nm spaced (refer to Figure 232305), to/from a
fibre.
The 1310nm SPV/OSC filter is provided only on CMDX-U-S and CMDX2-U-S
boards.
The LOS detector is provided only on CMDX2-U and CMDX2-U-S boards.
The 8-Channel Multiplexer/DemultipleXer units contain
one 8:1 CWDM multiplexer
one 1:8 CWDM demultiplexer
two 1310nm filters, used to insert/extract the 1310nm Supervision wavelength (CMDX(2)-U-
S only).
MUX side. In transmit direction, the boards are used to multiplex the 8 wavelengths
coming from transponders, into a single optical signal, to be sent to the line through the
1310nm filter (CMDX(2)-U-S only), used to add the 1310nm SPV wavelength to the
aggregate/multiplexed optical signal.
DEMUX side. In receive direction, the 1310nm wavelength is firstly dropped
(CMDX(2)-U-S only) from the optical signal coming from the line. The
aggregate/multiplexed signal (8 wavelengths) is then demultiplexed into 8 WDM
output signals, each one further routed to the appropriate transponder. A 95:5 coupler
allows to monitor the input signal providing LOS detection (CMDX2-U(-S) only).
The CMDX has the capability of transmitting TDM signal from OSC to ESC board,
via a dedicated back panel link (OSC to COAD2_S to ESC).

The optical characteristics are described in 8-channel CWDM Mux/Demux optical
characteristics: CMDX-U(-S), CMDX2-U(-S).
CH1 IN
CH2 IN
CH3 IN
CH4 IN
CH5 IN
CH6 IN
CH7 IN
CH8 IN
Line Tx out
S
P
V
T
x
IN
W
D
M

T
x

i
n
MUX
1471nm
1491nm
1511nm
1531nm
1551nm
1571nm
1591nm
1611nm
1310nm*
SPV f ilter
MUX OUT
CH1 OUT
CH2 OUT
CH3 OUT
CH4 OUT
CH5 OUT
CH6 OUT
CH7 OUT
CH8 OUT
Line Rx in
S
P
V
R
x
O
U
T
W
D
M

R
X

o
u
t
DEMUX
1471nm
1491nm
1511nm
1531nm
1551nm
1571nm
1591nm
1611nm
1310nm*
SPV f ilter
DEMUX IN
95:5
TAP
LOS
detector**
* T h e 1 3 1 0 n m S P V f i l t e r i s m o u n t e d o n l y o n C M D X - U - S a n d C M D X 2 - U - S u n i t s
* T h e L O S D e t e c t o r i s m o u n t e d o n l y o n C M D X 2 - U a n d C M D X 2 - U - S u n i t s

Figure 305232: CMDX (all types) block diagram

8-channel CWDM/DWDM mux/demux: CDMDX2-U and CDMDX2-U-S
Refer to Figure 233306. It is a 7-channel mux/demux performing the multiplexing and
demultiplexing of
6 CWDM channels/wavelengths, 20 nm spaced (refer to Figure 306233),
an extra port on which are multiplexed up to 24 DWDM channels (connected to a DWDM
Mux/Demux)
to/from a fibre. So it is able to launch 30 channels to the fibre (6 CWDM channels + 24
DWDM channels).
CDMDX2-U-S also provides the insertion and extraction of the 1310nm supervisory
signal (SPV) or another 1310nm signal (i.e. SDH). The SPV/OSC feature is not
prodived by the CDMDX2-U board.
The 7-Channel Multiplexer/DemultipleXer units contain
one 7:1 WDM multiplexer
one 1:7 WDM demultiplexer
two 1310nm filters, used to insert/extract the 1310nm Supervision wavelength (CDMDX2-U-
S only).
MUX side. In transmit direction, the boards are used to multiplex the 6 CWDM
wavelengths coming from transponders and a signal coming from the extra band input
(a multiplexed signal with up to 32 DWDM channels belonging to L1, L2, S1, S2
bands) into a single optical signal, to be sent to the line through the 1310nm filter
(CDMDX2-U-S only), used to add the 1310nm SPV wavelength to the
aggregate/multiplexed signal.
DEMUX side. In receive direction, the 1310nm SPV wavelength is firstly dropped
(CDMDX2-U-S only) from the optical signal coming from the line. The
aggregate/multiplexed signal is then demultiplexed into 6 WDM output signals, each
one further routed to the appropriate transponder, and the extra band (with up to 32
DWDM multiplexed channels), routed to a DWDM Demux (Demux cascading).
A 95:5 coupler allows to monitor the input signal providing LOS detection.
The CMDX has the capability of transmitting TDM signal from OSC to ESC board,
via a dedicated back panel link (OSC to COAD2_S to ESC).
The optical characteristics are described in C/DWDM Mux/Demux units (CDMDX2-
U and CDMDX2-U-S) optical characteristics.

CH1 IN
CH2 IN
CH3 IN
Extra
CH4 IN
CH5 IN
CH6 IN
Line Tx out
S
P
V
T
x
IN
W
D
M

T
x

i
n
MUX
1471nm
1491nm
1511nm
1571nm
1591nm
1611nm
1310nm*
SPV f ilter
MUX OUT
CH1 OUT
CH2 OUT
CH3 OUT
Extra
CH4 OUT
CH5 OUT
CH6 OUT
Line Rx in
S
P
V
R
x
O
U
T
W
D
M

R
X

o
u
t
DEMUX
1471nm
1491nm
1511nm
1571nm
1591nm
1611nm
1310nm*
SPV f ilter
DEMUX IN
95:5
TAP
LOS
detector
* T h e 1 3 1 0 n m S P V f i l t e r i s m o u n t e d o n l y o n C D M D X 2 - U - S u n i t
band IN
band OUT

Figure 306233: CDMDX2-U and CDMDX2-U-S block diagram

DWDM OADM units
8 channels OADM unit
The components, MUX and DEMUX used in the OADM boards are the same than
those used in the OMDX boards. Thus, 4 OADM boards are defined:
OADM8100_M_S2_S, the dropped and added channels are the channels 42 to 50
OADM8100_M_S1_S, the dropped and added channels are the channels 52 to 60
OADM8100_M_L1_S, the dropped and added channels are the channels 30 to 38
OADM8100_M_L2_S, the dropped and added channels are the channels 20 to 28

WDM
1->8
ch #1
ch #2
ch #3
ch #4
ch #5
ch #6
ch #7
ch #8
ch #1
ch #2
ch #3
ch #4
ch #5
ch #6
ch #7
ch #8
WDM
8 -> 1
1510 nm
filter
OLOS
Optical
Receiver
OOPV
d
r
o
p
p
e
d

c
h
a
n
n
e
l
s
a
d
d
e
d

c
h
a
n
n
e
l
s
1510 nm
filter
Line Rx in
Monitor Rx out
Line Tx out
SPV Tx in
E
x
tra
T
x
in
SPV Rx out
Monitor Tx out
W
D
M

T
x

i
n
E
x
tra
R
x
o
u
t
W
D
M

R
x

o
u
t
Optical
Receiver
OPL
OOPV
Optical
Receiver
MUX
DEMUX
IPL
IOPV

Figure 307234: OADM8: block-diagram

Description
The OADM8 unit is used on the west or east side.
The 8 channels are dropped when all the other channels (pass-through) are sent on the
extra-output port.

On the transmit side, the 8 concerned channels are added to the pass-through channels
via the multiplexer and thus, the SPV (coming from the SPVM unit) is inserted using a
WDM coupler.
The optical characteristics are described in CWDM OADM units optical
characteristics.
The function of the OADM4_x units is to extract and insert 4 channels between the 32
available.
WDM
1->4
ch #1
ch #2
ch #3
ch #4
WDM
4->1
ch #1
ch #2
ch #3
ch #4
1510 nm
filter
OLOS Optical
Receiver OOPV
d
r
o
p
p
e
d

c
h
a
n
n
e
l
s
a
d
d
e
d

c
h
a
n
n
e
l
s
Line Rx in
Monitor Rx out
Line Tx out
SPV Tx in
E
x
tra
T
x
in
SPV Rx out
Monitor Tx out
W
D
M

T
x

i
n
E
x
tra
R
x
o
u
t
W
D
M

R
x

o
u
t
OPL Optical
Receiver OOPV
DEMUX
MUX
IPL
IOPV
Optical
Receiver

Figure 308235: OADM4: block-diagram

Description
The SPV channel is extracted and the signal is sent on a front panel connector. The 4
channels are dropped and sent on a front panel connector. The aggregate of all the
other channels (pass-through) is also sent to a front panel connector to be connected to
the multiplex.
On the transmit side, the 4 concerned channels are added to the pass-through channels
via the multiplexer and thus, the SPV (coming from the SPVM unit). The output signal
is monitored (detection of ILOS, OOPV) and an external optical access is given to the
operator for monitoring purpose too.
The optical characteristics are described in.4-channel OADM with supervision.
The different possible sets of channels are the following: 20 to 23 - 25 to 28 - 30 to 33
- 35 to 38 - 42 to 45 - 47 to 50 - 52 to 55 - and 57 to 60.
The function of the OADM2100_M_XX_S is to extract and insert 2 channels between
the 32 available.
ch #1
ch #2
SPV OUT
extra-
output
Input
IPL
IOPV
Monitor
SPV filter
ch #2
ch #1
Optical
Receiver
DEMUX
Output
SPV IN
extra-
input
OLOS
Optical
Receiver
OOPV
Monitor
IPL
Optical
Receiver
OOPV
MUX

Figure 309236: Block diagram of the OADM2100_M_xx_S unit

Description
The SPV channel is extracted and the signal is sent on a front panel connector. The two
channels are dropped while all the other channels are sent to a front-panel connector
(extra-output).

On the transmit side, the concerned channel is added to the other channels (pass-
through or just multipled in an other board) via the multiplexer and thus, the SPV
(coming from the SPVM unit) is inserted using a coupler. The output signal is
monitored (detection of ILOS, OOPV) and an external optical access is given to the
operator for monitoring purpose too.
The optical characteristics are described in 2-channel OADM with supervision.
Available couple of channels per each OADM2 board: 3031; 32-33; 35-36; 37-38;
47-48.
1 channel OADM unit
The function of the OADM1100_M_XX_S units is to extract and insert 1 channel
between the 32 available.
OLOS
OOPV
Add Ch
Output
SPV IN
SPV OUT
extra-
input
extra-
output
Input
IPL
IOPV
Monitor
SPV filter
Optical
Receiver
Optical
Receiver
Monitor
Drop Ch
OPL
OOPV
MUX
DEMUX
Optical
Receiver
MUX

Figure 310237: OADM1100: block diagram

Description
The SPV channel is extracted and the signal is sent on a front panel connector. The
channel is dropped while all the other channels are sent to a front-panel connector.

On the transmit side, the concerned channel is added to the other channels (pass-
through or just multipled in an other board) via the multiplexer and thus, the SPV
(coming from the SPVM unit) is inserted using coupler. The output signal is monitored
(detection of ILOS, OOPV) and an external optical access is given to the operator for
monitoring purpose too.
The optical characteristics are described in 1-channel OADM with supervision.
The available channels are 25, 30, 31, 32, 33, 35, 36, 37, 38 in Long Band and 47, 48,
57 in Short Band.
CWDM OADM units
4-channel OADM w/ supervision (COAD2-xx-yy_S)
4-channel OADM board is able to add and drop 4 CWDM wavelengths per direction
(both on east and west sides), 20nm spaced, to/from a fibre, in the unidirectional
application (one fibre per direction).
The added and dropped channels are from/to transponders. The other channels (Extra
CH IN/OUT ports) are passed-through by the OADM boards (express channels); the
Extra CH IN/OUT ports can also be connected to cascaded DWDM mux/demux or an
amplifier output.
COAD2-xx-yy_S also provides the insertion/extraction of the 1310nm SPV/OSC
signal or another 1310nm SDH signal on both directions.
The 4-Channel add and drop multiplexer/demultiplexer unit contains
two 4-channel CWDM OADM
four 1310nm filters (two per side), used to insert/extract the 1310nm Supervision wavelength.
On Mux/transmit side, the boards are able to add the four concerned wavelengths,
coming from transponders, to the pass-through/express channels via the OADM
multiplexer. The aggregate/multiplexed output signal (8 channels - MUX output) is
sent to line (Line Tx OUT) via the 1310nm filter, used to add the supervision
wavelength. This is performed both on east and west directions.
On Demux/receive side, the 1310nm supervision wavelength is dropped from the
optical signal coming from the line (Line Rx IN). Then the multiplexed signal is sent
to the OADM demultiplexer that
drops the four concerned wavelengths, each one further routed to the appropriate transponder
sends the aggregate of all the other channels (express channels) to a front plate connector (i.e.
East Extra CH OUT), to be connected to the multiplex (on the other side, i.e. West Extra CH
IN)).
This is performed both on east and west directions.
On Mux/transmit side, the following ports are provided:
East side, 6 input ports (East CH1 add -> East CH 4 add, East Extra CH IN and East SPV Tx
IN) and 1 output port (East Line Tx OUT)
West side, 6 input ports (West CH1 add -> West CH 4 add, West Extra CH INWest and SPV
Tx IN) and 1 output port (West Line Tx OUT)
On Demux/receive side, the following ports are provided:
East side, 6 output ports (East CH1 drop -> East CH 4 drop, East Extra CH OUT and East
SPV Rx OUT) and 1 input port (East Line Rx IN)
West side, 6 output ports (West CH1 drop -> West CH 4 drop, West Extra CH OUT and
West SPV Rx OUT) and 1 input port (West Line Rx IN).
The COAD2_S has the capability of transmitting TDM signal from OSC to ESC
board, via a dedicated back panel link (OSC to COAD2_S to ESC).
According to the board P/N, the following wavelengths are added/dropped by each
board: or 1551&1571&1591&1611nm.
COAD2-1470-1530_S: 1471, 1491, 1511, 1531nm
COAD2-1550-1610_S: 1551, 1571, 1591, 1611nm.
characteristics.

C
H
1

D
R
O
P
C
H
2

D
R
O
P
C
H
3

D
R
O
P
E
x
t
r
a

C
H

D
R
O
P
C
H
4

D
R
O
P
Line
D
E
M
U
X

2
1
4
7
1

o
r

1
5
5
1
n
m
1
4
9
1

o
r

1
5
7
1
n
m
1
5
1
1

o
r

1
5
9
1
n
m
1
5
3
1

o
r

1
6
1
1
n
m
1310nm*
SPV
DEMUX IN
95:5
TAP
LOS
detector
E
x
p
r
e
s
s

C
H
s
Rx
FILTER
IN
C
H
1

A
D
D
C
H
2

A
D
D
C
H
3

A
D
D
E
x
t
r
a

C
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A
D
D
C
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4

A
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D
Line
M
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2
1
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7
1

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1
4
9
1

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5
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1
5
1
1

o
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1
5
9
1
n
m
1
5
3
1

o
r

1
6
1
1
n
m
1310nm*
SPV
MUX OUT
Tx
FILTER
OUT
O
S
C

D
R
O
P
C
H
1

D
R
O
P
C
H
2

D
R
O
P
C
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3

D
R
O
P
E
x
t
r
a

C
H

D
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O
P
C
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4

D
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O
P
Line
D
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M
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1
1
4
7
1

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1
5
5
1
n
m
1
4
9
1

o
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1
5
7
1
n
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1
5
1
1

o
r

1
5
9
1
n
m
1
5
3
1

o
r

1
6
1
1
n
m
1310nm*
SPV
DEMUX IN
95:5
TAP
LOS
detector
Rx
FILTER
IN
C
H
1

A
D
D
C
H
2

A
D
D
C
H
3

A
D
D
E
x
t
r
a

C
H

A
D
D
C
H
4

A
D
D
Line
M
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1
1
4
7
1

o
r

1
5
5
1
n
m
1
4
9
1

o
r

1
5
7
1
n
m
1
5
1
1

o
r

1
5
9
1
n
m
1
5
3
1

o
r

1
6
1
1
n
m
1310nm*
SPV
MUX OUT
(
E
x
p
r
e
s
s

C
H
s
)
Tx
FILTER
OUT
S
P
V

R
x

O
U
T
O
S
C

D
R
O
P
S
P
V

R
x

O
U
T
E
x
p
r
e
s
s

C
H
s
E
x
p
r
e
s
s

C
H
s

S
P
V

T
x

I
N
O
S
C

A
D
D
E
x
p
r
e
s
s

C
H
s

S
P
V

T
x

I
N
O
S
C

A
D
D
E
A
S
T
W
E
S
T

Figure 311238: COAD2-xx-yy_S block diagram (4-channel CWDM OADM)

2-channel OADM w/ supervision (COAD2-xx-yy_S)
For the block diagram of this unit, please refer to Figure 238311: it is the same, the
only difference is that only two channels (instead of four) can be added and dropped
per each side (East and West).
2-channel OADM board is able to add and drop 2 CWDM wavelengths per direction
(both on east and west sides), 20nm spaced, to/from a fibre, in the unidirectional
application (one fibre per direction).
The added and dropped channels are from/to transponders. The other channels (Extra
amplifier output.
The 2-Channel add and drop multiplexer/demultiplexer unit contains
On Mux/transmit side, the board is able to add the two concerned wavelengths,
coming from transponders, to the pass-through/express channels via the OADM
multiplexer. The aggregate/multiplexed output signal (8 channels - MUX output) is
sent to line (Line Tx OUT) via the 1310nm filter, used to add the supervision
wavelength. This is performed both on east and west sides.
drops the two concerned wavelengths, each one further routed to the appropriate transponder
IN)).
This is performed both on east and west sides.
East side, 4 input ports (East CH1 add, East CH 2 add, East Extra CH IN and East SPV Tx
IN) and 1 output port (East Line Tx OUT)
West side, 4 input ports (West CH1 add, West CH 2 add, West Extra CH IN and West SPV
Tx IN) and 1 output port (West Line Tx OUT)

East side, 4 output ports (East CH1 drop, East CH 2 drop, East Extra CH OUT and East SPV
Rx OUT) and 1 input port (East Line Rx IN)
West side, 4 output ports (West CH1 drop, West CH 2 drop, West Extra CH OUT and West
SPV Rx OUT) and 1 input port (West Line Rx IN).
The COAD2(_S) has the capability of transmitting TDM signal from OSC to ESC
According to the board P/N, the following wavelengths are added/dropped by each
board:
COAD2-1470-1490_S: 1471, 1491nm
COAD2-1510-1530_S: 1511, 1531nm
COAD2-1550-1570_S: 1551, 1571nm
COAD2-1590-1610_S: 1591, 1611nm
characteristics.
1-channel OADM w/ supervision (COAD1-xx_S)
For the block diagram of this unit, please refer to Figure 238311: it is the same, the
only difference is that only one channel (instead of four) can be added and dropped per
each side (East and West).
1-channel OADM board is able to add and drop 1 CWDM wavelength per direction
(both on east and west sides) to/from a fibre, in the unidirectional application (one
fibre per direction).
The added and dropped channel is from/to a transponder. The other channels (Extra
amplifier output.
The 2-Channel add and drop multiplexer/demultiplexer units contain
On Mux/transmit side, the board is able to add the concerned wavelength, coming
from a transponder, to the pass-through/express channels via the OADM multiplexer.
The aggregate/multiplexed output signal (8 channels - MUX output) is sent to line
(Line Tx OUT) via the 1310nm filter, used to add the supervision wavelength. This is
performed both on east and west sides.
drops the two concerned wavelengths, each one further routed to the appropriate transponder
IN)).
This is performed both on east and west sides.
East side, 3 input ports (East CH1 add, East Extra CH IN and East SPV Tx IN) and 1 output
port (East Line Tx OUT)
West side, 3 input ports (West CH1 add, West Extra CH IN and West SPV Tx IN) and 1
output port (West Line Tx OUT)
East side, 3 output ports (East CH1 drop, East Extra CH OUT and East SPV Rx OUT) and 1
input port (East Line Rx IN)
West side, 3 output ports (West CH1 drop, West Extra CH OUT and West SPV Rx OUT) and
1 input port (West Line Rx IN).
The COAD1_S has the capability of transmitting TDM signal from OSC to ESC
According to the board P/N, eigth different units are available, each one able to add
and drop one of the eigth CWDM channels.
characteristics.

SPV_F_1310_1550
The function of the SPV_F_1310_1550 unit is used to multiplex / demultiplex one
1310 nm channel (for instance coming from a 4xANY, one 1550 nm multiplexed
signal and the SPV channel.
1550
Output
SPV IN
SPV OUT
Input
OLOS
Monitor
SPV filter
Optical
Receiver
OOPV
Monitor
1310
1550
1310
OPL
Optical
Receiver
OOPV
IPL
IOPV
Optical
Receiver
SPLITTER
COUPLER

Figure 312239: Block diagram of the SPV_F_1310_1550 unit

Description
At demux side, the SPV channel is extracted by a filter while at the mux side, a 95/5
coupler is used.
This board should moreover be able to accomodate whatever channel in the C-Band
(and not only a channel at 1550 nm).
A 95/5 coupler is used to monitor the signal (power presence and monitoring
connector) in both directions.
The optical characteristics are described in Mux/Demux 1310-1550 + supervision
unit optical characteristics.

SPV_F_C
This board is able to insert/extract the OSC channel to/from one 1310 nm channel or
one 1550 nm channel.
Common
SPV
Extra
Optical Input
Power Detection
In
Extra
Optical Output
Power Detection
Common
LOS
LOS
In
SPV
Out
Out
SPV Coupler
SPV Filter
10dB
10dB
In
Out
IPL
Optical
Receiver
OPL
Optical
Receiver
SPLITTER
COUPLER

N.B. For Input power and Output power alarm detection, the optical receiver is
calibrated at 1550 nm.
Figure 313240: Block diagram of the SPV_F_C unit

Description
The board allows to perform both mux and demux function of two signals which are
either C-band WDM signal or Second windows signal (B&W or 1310 nm) by extra
ports and Supervisory channel (1510 nm) by SPV ports. The single channel can be
extracted or inserted to the multiplexed signal.
2 different channel filterings are available:
1310 / 1510 nm
1510 / 1550 nm
This compact board can be plugged in slots 2835 or 3845 on a 1696MSPAN shelf
and in a slots 9-10 or 11 in the 1696MS_C shelf and sub-shelf.
Board location in the system
This board has to take place in both the - 1696MSPAN and 1696MS_C shelves. The
basic configuration may be with one wavelength among predefined WDM range or
B&W user signal, however it could be set with a multiplexed signal.
Transmission Line
T
r
a
n
s
p
o
n
d
e
r

u
n
i
t
West Side East Side
T
r
a
n
s
p
o
n
d
e
r

u
n
i
t
SPV_M SPV_M
SPV_F unit SPV_F unit

Figure 314241: Position of SPV_F_C unit in a transmission line

The optical characteristics are described in SPV_F_C unit optical characteristics.
F1310
This board is able to multiplex/demultiplex one C-band signal (Extra channel) and one
1310nm (supervision) signal to/from a fibre, in the unidirectional application (one fibre
per direction).
The extra channel can be an aggregate DWDM (up to 32 channels) or CWDM signal
(8 channels), from/to (cascaded) DWDM or CWDM mux/demux.

The unit contains two 1310nm WDM couplers (one to add and the other to drop the
1310nm SPV/OSC signal to/from the WDM signal)
On Mux/transmit side, the board add the 1310nm OSC (SPV Input) to the aggregate
C-band signal (Extra Input), coming i.e. from a DWDM or CWDM mux. The
combined output signal is sent to line (Line Tx OUT).
optical signal coming from the line (Line Rx IN) by the drop coupler. The C-band
aggregate signal (D/CWDM Extra channel) is made available on Extra Output front
plate connector, to be sent to a WDM demultiplexer.
Six ports are available on the front plate: two ports for Extra channel (input and
output), two ports for 1310nm supervision signal (input and output) and two ports for
common/line signal (input and output).
The optical characteristics are described in F1310 unit optical characteristics.
Extra
Input
Line Tx
M
U
X

COMMON OUTPUT
Output
SPV Tx
Input
Extra
Output
Line RX
M
U
X
Input
SPV Rx
Output
COMMON INPUT

Figure 315242: F1310 block diagram

Optical Amplifier (OAC)
Description
The Optical Amplifiers are designed to amplify the C bands wavelengths in WDM
transmission system. This functionality is necessary to extend the transmission
capacity of the optical fibers network.
They can perform optical amplification through the optical line as a booster, in line,
OADM repeater and pre-amplifier.
The Optical Amplifiers provide up to +17 dBm output power (for 32 wavelengths) in
C Band without external pump module.
A tunable attenuator (VOA) allows a good gain flatness.
This unit contains two independent stages : a pre-amplifier and a booster.
The board receives electrical data from the Equipment Controller and from the Craft
Terminal. It receives optical data from SPV and from the OADM/OMDX or another
optical amplifier.
The aim of this boards is to allow an output Power Per Channel (P/ch) of
2 dBm for 32 channels max loading
and to allow a correct behaviour whatever the number of channels and whatever the
variation of the loss at the input of the pre-amplifier.
There are two types of optical amplifiers
- OAC2 (OFA 22/9), introduced in R.2.2, used for short spans transmission (metro
amplifier)
- OAC2_L (OFA 28/9), introduced in R.2.2, used for long spans transmission
(regional amplifier).
The following table sums up the main differences between OAC2 and OAC2_L0

Table 7.39 Main differences between OAC1, OAC1_L, OAC2 and OAC2_L optical
amplifiers

Feature Values
Optical amplifier OAC2 OAC2_L

Feature Values
Introduced in release R.2.2 R.2.2
Gain block 22/9 28/9
Example of Span
performance (32
channels x 10Gbps or
2.5 Gbps)
1 span x 21 dB
1 span x 28 dB (with double
stage amplifier at IN and
OUT of the node
up to 7 spans x19 dB
1 span x 27 dB
1 span x 29 dB (with double
stage amplifier at IN and
OUT of the node
up to 4 spans x 22dB
Pre-amplifier Cooler
Booster @ 980 nm
VOA tuning fail alarm Managed from R.2.2
Block diagram description (see Figure 243316).
The optical part consists of
- two optical gain block modules, 22/9 for OAC2 and 28/9 for OAC2_L (1st and
2nd stage; they can be a preamplifier and a booster
- an optical attenuator (VOA) allowing to fix the attenuation before the first stage
of the amplifier and to compensate the variation of the span attenuation. The VOA
input and output are accessible to the operator via front panel connectors.
- four 99/1 couplers for the 1st and 2nd stage signal monitoring (input and output)
- a DEMUX 1550/1510 (SPV filter) for the extraction of the supervisory channel
(SPV OUT). It separates data and supervisory channel
- a 95/5 coupler for the insertion of the supervisory channel (SPV IN). It couples
data and supervisory channel
- monitoring photodiodes (optical recevers).
The electrical part consists of
- two optical gain block modules for regulations, performing
output optical power regulation : a comparaison is made between the measured
optical output power OOPV and the needed optical output power OPAV which
is either calculated by the FPGA (control unit) or fixed by the user
temperature regulation: in each gain block a thermistance allows to evaluate the
temperature inside the gain block. Thereafter a comparison is done between a
reference voltage and the thermistances voltage to determine the control
current
- alarm generation
- card presence indicator
- Remote Inventory
- power supply interface with alarms generation. The board is supplied by -48V
voltage from batteries via backpanel, and by +3.6V voltage from the PSC card. On
the board, 3 different volatges are used: +5.5V; -5.5V; +3.6V.
- visual system alarming by means of 5 leds located on front panel (PW, OOS,
ABN, APSD, HW).
The card mismatch is managed via information (ECID) stored in an EEPROM.
As the maximum power is +17 dBm, the amplifiers operates in safety class 1M.
In the interconnection stage (between the 1st stage output and the 2nd stage input) can
be located a DCU and/or an OADM/OMDX and/or a MVAC board.

P
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p
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1
1
2
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P
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P

I
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1
5
5
0

n
m
1510 nm

Figure 316243: Amplifier boards block-diagram

Way of working
The way of working is described in the next figure.
1
P1
P2
2
1
22
P2
2
P1
1
1
INPUT OUTPUT
INPUT OUTPUT
OADM
DCU
DCU
VOA
VOA

Figure 317244: Optical amplifiers configuration

In order to use the amplifier with its optimum performances, the output power per
channel must be constant whatever the number of channels and whatever the variation
of loss of the previous span.
In order to achieve such a requirement, two tuning mechanisms are foreseen:
Variation of the span loss, for a given number of channels
Variation of the number of channels, for a given span loss.
Variation of the span loss, for a given number of channels
The VOA attenuation is adjusted manually or semi-automatically according to the
previous span attenuation in order to match with the EOL span losses. At the amplifier
installation, the VOA is set in order to match with the foreseen EOL span losses. Then,
when the span changes, the VOA is tuned in order to always match with that EOL span
losses.

1
P1
P2
2
Local Board
1
EOL span losses
Current span losses
VOA

Figure 318245: Span variation compensation

For a given number of channels, when the previous span loss increases (ie. when the
total input power decreases), the total output powers of the 1st and 2nd stage have a
tendency to follow the corresponding linear curve. As a consequence, when the span
loss variation becomes greater than 1 dB, the VOA attenuation must be tuned in order
to keep the total losses constant.
The range of variation of the interstage attenuation is included between 1 and 15 dB.
Two VOA tuning functions are foreseen:
manual setting: the operator enters the value of the VOA (VOA_OP).
semi-automatic setting: the value of the VOA is calculated by the NE via parameters entered
by the operator. This action is not automatic: the operator must command it.
Variation of the number of channels, for a given span loss
Two pump tuning functions are foreseen:
manual setting: the output powers of the 1st and 2nd stages are fixed and set by the operator
(independently from the input power)
automatic setting:
- 1st stage: for a given EOL previous span loss, when the number of channels
changes, the 1st stage output power is tuned without operator intervention
- 2st stage: for a given interstage (IT) attenuation, when the number of channels
changes, the 2st stage output power is tuned without operator intervention
The output power of the 1st and 2nd stage is adjusted automatically according to the
input power of the corresponding stage:
1st stage pump: it is enslaved on the 1st stage output power, which value is given as a
function of the input power and the previous EOL span losses.
For a given EOL previous span loss and for a given IT (interstage) attenuation, when the
number of channels changes (ie. when the total input power changes), the total output power
follows the corresponding linear curve. The full arrows correspond to a number of channels
increasing. The dashed arrows correspond to a number of channels decreasing. When the
number of channels is less than 4, the output power of the 1st & 2nd stage remains constant.
2nd stage: it is enslaved on the 2nd stage output power, which value is given as a function of
the input power of the second stage and the interstage attenuation.
For a given IT attenuation, when the number of channels changes (ie. when the total input
power changes), the total output power of the 2nd stage follows the corresponding linear
curve. The full arrows correspond to a number of channels increasing. The dashed arrows
correspond to a number of channels decreasing. When the number of channels is less than 4,
the output power of the 1st & 2nd stage remains constant.
The nominal operating configuration of the optical amplifiers (Pout = +17dBm) is
associated with a 32 channels loading. Consequently, when 32 channels are loaded, the
output power per channel is about 2 dBm.
For a given EOL span losses or IT, the range of variation of the total input and output
powers is 9 dB (from 32 to 4 channels).
When the number of channels is less than 4, the output power of the 1st & 2nd stage
remains constant.

P i n 1 ( d B m )
P o u t 1 ( d B m )
+ 1 2
+ 3
- 2 3 - 2 0 - 1 7 - 1 4 - 1 1 - 8 - 5 - 2 2 4
S
P
A
N

=

3
1
d
B
S
P
A
N

=

2
8
d
B
S
P
A
N

=

2
5
d
B
S
P
A
N

=

2
2
d
B
S
P
A
N

=

1
9
d
B
S
P
A
N

=

1
6
d
B
S
P
A
N

=

1
3
d
B
f i r s t s t a g e t u n i n g p u m p
P i n 2 ( d B m )
P o u t 2 ( d B m )
+ 1 7
+ 8
- 1 2 - 9 - 6 - 3 0 3 6 9
I
T

=

1
5
d
B
I
T

=

1
2
d
B
I
T

=

9
d
B
I
T

=

6
d
B
I
T

=

3
d
B
s e c o n d s t a g e t u n i n g p u m p

Figure 319246: Amplifier tuning for number of channels changes (previous span
loss constant)

See Optical Amplifier Card (OAC) optical characteristics.
Optical safety
IEC 60825-2, Ed.03: Safety of Laser ptroducts - Part 2: Safety of optical
fibre communication system: in restricted areas no APSD scheme is
required below +21.3 dBm output power (see para 3.6, 4.5.1, table D.1).
Amplified or not amplified equipment is always well below this limit.
Alcatel-Lucent recommends the APSD disable mode (default mode).
The next table describes the way of working of the optical amplifiers. The boards may
be in
APSD disable state
APSD disable forced ON or OFF state
APSD enable state (not available).
The following tables sum up the way of working for each APSD state.
c.a. APSD disable state

Table 7.40 Summary of the way of working in case of ILOS APSD disable
1st stage Input 2nd stage Input
ILOS1
ShutDown of the 1st stage
ILOS2
ShutDown of the 2nd stage

d.b.APSD disable forced ON or OFF state

Table 7.41 Summary of the way of working in case of ILOS APSD disable forced
ON/OFF

ILOS1
1st stage forced ON / OFF. No action.
ILOS2
2nd stage forced ON / OFF. No action.

e.c. APSD enable state (not available)
N.B. In current Release OAC APSD is always disabled.

Table 7.42 Summary of the way of working in case of ILOS APSD enable
Alarms consecutive action
ILOS1
Shutdown of the 1st stage and 2nd stage of the same
board.
ILOS2
Shutdown of the 2nd stage.
Controller
ESC board
The ESC (Equipment and Shelf Controller) board is the hardware platform designed to
support the Equipment Controller (EC) functions and the Shelf Controller (SC)
functions for the 1696 MSPAN and 1696MS_C equipment from the release 1.3.
The EC functions has in charge of the processing activities concerning the Virtual
Equipment Control Element (VECE) function:
Virtual Machine Management Function (VMMF)
Message Communication Function (MCF)
The SC function of ESC has in charge of the processing activities concerning the
Physical Equipment Control Element (PECE) function:
Physical Machine Management Function (PMMF)
Basic Process Control Function (BPCF)
It provides the resources to support the SW functions related to the physical machine
control and management and configuration provisioning.
In an Expansion Shelf, the ESC board needs only to provide a SC functionality. It is
the same board, and its identification is made through shelf id and slot id numbers.
The ESC consists in a double processor board. It is mainly composed of :
A ESC mother board,
A daughter board achieving the EC function,
A daughter board achieving the SC function,
A non volatile mass storage device PCMCIA 2.1 compatible.
Each of these functions (EC and SC) are realized using a PQSCC daughter board. They
are plugged on the ESC mother board. The PQSCC module is developed in order to
provide a common HW (and SW) platform for different applications requiring a Shelf
Controller (SC) function. The processors used are members of Motorola MPC860
family.
Various kinds of serial communication channels and parallel I/O ports for alarm &
status signals are provided by the ESC card.
Thanks to the ESC board, it is no more necessary to plug a LAN_Q card in each shelf
since the ESC is now able to manage the SPI bus. One only needs to plug a LAN_Q
card in the master shelf if one needs the LAN supervision functionality.
The flash backup capability permits the management system to copy files back and
forth using an ftp service, between the flash card on the ESC in slot 1 and the ESC in
slot 24 of the master shelf.
EQUICO to ESC Upgrade procedure information
When the system software is upgraded from version 1.1, both EQUICO boards
(SC+EC) should be replaced by one ESC board in the master shelf, and one ESC board
in expansion shelves in slot 1. The upgrade procedure is perform with the Craft
terminal Equipment or OS (1353SH) and for this:
Refer to 3AL 86602 ABAA-PGZZA document.
N.B. The procedure of NE software management is detailled on the Operator
Handbook.
Supervision units (SPVM2, SPVM3, SPVM_H, SPVM3_H)
The SPV-M cards are used for the management of the 1696 supervision and service
channels.
The set of service channels managed by the supervision unit is a subset of the section
overhead of STM1 frame, as defined in ITU Recommendation G70X (March 1994);

the unit will be able to multiplex/demultiplex the optical service channels in 2048 kb/s
or 4864 kb/s proprietary supervision frames.
In case of a 4864 kb/s supervision data channels, the SPV-M will
multiplex/demultiplex them in two 2048 kb/s frames, only one of these contains the
supervision information, the other is an extra traffic frames.
Furthermore, others four bi-directional 2048 kb/s user auxiliary data channels are
provided for extra traffic needs. A matrix is used to interconnect these channels.
The supervision units types availabale are: SPVM2, SPVM3, SPVM_H and
SPVM3_H.
The supervision unit (SPVM) is composed of
one optical part (SPV channel receiver and transmitter)
two main electrical blocks:
- a matrix to route the 2 Mbit/s inputs
- an FPGA dedicated to the supervision frames management.
The SPVM + OW (SPVM2, SPVM3) boards are able to drop the 2 Mb/s extra
channels and the audio channel.
The SPVM_H and SPVM3_H boards provide all the features of the SPVM2/3 board
but manages only one Optical Supervisory Channel (OSC).
In the following is briefly described the block scheme (see Figure 247320).
The unit is composed of a main board, implementing the larger part of the
functionalities, and two daughter boards (TX-SPV-M) devoted to optical transmitter.
The board can be split in three main parts:
2/4 Mbps MUX/DEMUX (gate array). It multiplexes/demultiplexes a 4864 kb/s stream into
two 2048 kb/s channels. It extracts and inserts from/to these streams three auxiliary service
channels.
Supervision Manager (FPGA); it can be divided in the cited major functions:
- Matrix function between the four users channels at 2048 kb/s, the streams of the
supervison channels processed by the OSC MUXs and two internal streams
reserved to the mux/demux of the service channels contained in the supervision
channels. In case of a 2048kb/s supervision frame it can by-pass the OSC MUXs
- Supervision frames and service channel management extract/insert the slots
containing F1, E1, E2, from the supervision frames. The F1, E1, E2 service
channels and those coming from the OSC MUXs, which is supervision information
coming from both sides (EST and WEST), are re-routed to the ESC board
- OSC MUX configuration: this block function gives the access to the configuration
and alarm pins of the two OSC MUXs via internal registers
- SPI interface which assumes the software interface. Through this interface, the
register of the Supervision Manager is accessible in read and write sequences. It
permits the application software to configure the SPV-M.
TX-SPV-M is a daughter board containing the optical unit (transmitter), having in charge of
transmitting the SPVM frame on an optical fiber support in both sides (east and west), if
required. This function is realized with two LASERS at 1510 nm wavelenght. The LASERS
are supported by two identical daugter boards (TX-SPV-M), managed by SPV-M.
The Remote Inventory of the board is available via the SPI bus.
SPI INTERFACE
4Mbps
OSC+UDC
/ E
2/4Mb
MUX/
DEMUX
2Mbps
OSC
2Mbps
UDC
FRONT
PANEL
FRONT PANEL
TELEPHONE
BACK PANEL
E
O
W

(
E
2

a
t

6
4
K
)
V
o
i
c
e

C
h
a
n
n
e
l
U
D
C

(
2

x

2

M
b
p
s
)
T
D
M
1

(
2
M
)
4Mbps
OSC+UDC
E /
2/4Mb
MUX/
DEMUX
2Mbps
OSC
2Mbps
UDC
FRONT
PANEL
TO ESC TO UIC1
1
5
1
0

n
m

4
M
b
:

O
S
C

(
D
1
-
D
3
;

D
4
-
D
1
2
)

+

U
D
C
1
5
1
0

n
m

4
M
b
:

O
S
C

(
D
1
-
D
3
;

D
4
-
D
1
2
)

+

U
D
C
AGGREGATE
(32 CH + OSC)
AGGREGATE
SIGNAL (UP TO 32 CH)
1550 NM
AGGREGATE
(32 CH + OSC)
AGGREGATE
SIGNAL (UPTO 32 CH)
1550 NM
ADD/DROP
OSC
ADD/DROP
OSC
FROM/TO LINE FROM/TO LINE
OAC
OPTICAL
INTERFACE
OPTICAL
INTERFACE
T
D
M
2

(
2
M
)
SUPERVISION MANAGER
OAC
HANDSET (J1) TO UIC2
TX-SPVM TX-SPVM

Figure 320247: SPVM2 and SPVM3 block diagram

Description of the supported functionalities
The following functionalities are supported:
1. Management of one or two bidirectional supervision streams at 2 048 Kbit/s, one
for Line terminal applications and one for each side of the link in back-to-back or
OADM applications.
2. Management of Data Communication Channels DCCm and DCCr; four data
streams are made available to the Equipment Controller (EC) via a backpanel bus,
and are used for network management.
3. Management of K1/K2 data stream at 128 Kbit/s; this data stream (terminated in
the unit) is made available to the equipment controller.
4. Management of E2 audio channel: The default configuration enables to drop the
audio channel. It is possible to call a specific NE or to make a conference call. The
phone number of the NE is set with the two front panel coding wheels. dial #00 for
a conference call and #XX (with XX strictly greater than 10 for a specific call).
The Line Terminal or back-to-back terminals and OADM configurations are done by
software.
Functional Description of the configurations
As described on two following figures the data of OSC channel at 1510 nm are sent to
the matrix into a 2 Mbit/s signal to the supervision frame management functional
block. This block generates one/or two TDM signals according to the NE
configuration.
S P V M
W D M R x
S u p e r v i s i o n f r a m e
m a n a g e m e n t
M a t r i x
M C C
T x 1 o p ti c a l
t r a n s m i tt e r
R x 1 o p ti c a l
r e c e i v e r
O S C
1 5 1 0 n m
T D M 1
E S C b o a r d
( d a u g h t e r b o a r d )
M U X / D E M U X ,
O A D M o r O A C
b o a r d

Figure 321248: SPVM board in a Line Terminal configuration

S P V M
W D M R x
M C C
T x 2 o p ti c a l
t r a n s m i t t e r
m a n a g e m e n t
M a t r i x
R x 2 o p ti c a l
r e c e i v e r
E a s t
M C C
T x 1 o p ti c a l
R x 1 o p ti c a l
r e c e i v e r
O S C 2
1 5 1 0 n m
O S C 1
1 5 1 0 n m
T D M 2 T D M 1
E S C b o a r d
( d a u g h t e r b o a r d ) ( d a u g h t e r b o a r d )
W e s t
M U X / D E M U X ,
O A D M o r O A C
b o a r d
M U X / D E M U X ,
O A D M o r O A C
b o a r d

Figure 322249: SPVM board in an OADM or Back-To-Back configuration

N.B. When the network comprises NEs connected in a ring, at least one NE
must be configured with the SPVM board in Local Clock configuration (to
avoid clock loop). SPVM board for the others NE can be configured in Remote
Clock configuration.
User channels
The 2Mbps and 64Kbps channels exchanged with UIC, are drop-insert connected by
default.
See SPV-M + OW (SPVM2) and SPVM_H optical characteristics.
Management of up to six SPVM boards
In configurations where CPEs are linked to a 1696MS in a ring, the 1696MS is able to
manage the first SPVM board (East and West of the Ring), plus other five SPVMs
managing the OSC to/from CPE(s).
Optical Supervisory Card (OSC)
The OSC card manages the 1696MSPAN supervision. Furthermore, it used for alarms
and status collection from the optical units in the shelf.

The OSC unit is a simplified edition of SPV-M. In order to locate the OSC unit in
small slots, the card only implements the supervision channels, omit other functions
such as 2Mbps user data, audio access etc.
The OSC board receives data from ESC board and transmit it to the optical fiber line;
on the other hand, receives data from the optical fiber line and transmit them to the
ESC, via back panel.
The set of service channels managed by the supervision unit is a subset of the section
overhead of STM1 frame, as defined in ITU Recommendation G70X (March 1994);
the unit is able to multiplex/demultiplex the optical service channels in 2048 kbps
proprietary supervision frames.
The main feature of this unit is to manage up to two supervision streams at 2048 Kbps
(2 SPV/OSC ports).
The supervision unit (OSC) is composed of
two optical transceivers (supervision channel receiver and transmitter, one per each side);
they are customised L-1.1 SFP modules with a better sensibility (-35 dBm) to increase optical
budget (2M); the normal L-1.1 SFP (L-1.1) can also be plugged on optical ports
an FPGA dedicated to the supervision frames management and OSC alarms and status
collection. Thus the OSC board can deal with two data communication channels (TDM1 and
TDM2), one for each direction. Moreover it provides the Matrix functionality,
interconnecting up to four bidirectionnal 2048 Kbps channels: two supervision channels and
two TDM channels for data communication.
SPI interface is the software interface and allows the application software to
configure the OSC unit.
SPI INTERFACE
/ E
2Mbps OSC
FRONT
PANEL
BACK PANEL
T
D
M
1

(
2
M
)
E /
2Mbps OSC
FRONT
PANEL
TO ESC
1
3
1
0
n
m
:

2
M
B

O
S
C

(
D
1
-
D
3
;

D
4
-
D
1
2
)
AGGREGATE
(32 CH+ OSC)
AGGREGATE
1550 NM
AGGREGATE
(32 CH+ OSC)
AGGREGATE
1550 NM
ADD/DROP
OSC
ADD/DROP
OSC
FROM/TO LINE FROM/TO LINE
OAC
OPTICAL
INTERFACE
T
D
M
2

(
2
M
)
SUPERVISION MANAGER
OAC
(SFP)
1
3
1
0
n
m
:

2
M
B

O
S
C

(
D
1
-
D
3
;

D
4
-
D
1
2
)
OPTICAL
INTERFACE
(SFP)

Figure 323250: OSC block diagram

Configurations description
Up to two bidirectional supervision streams at 2048 Kbps are managed by OSC board.
For Line terminal applications, one supervision stream is required, as shown in Figure
251324.
For back to back or OADM applications, two supervision streams are required, as

O S C
W D M R x
m a n a g e m e n t
M a t r i x
M C C
T x 1 o p ti c a l
t r a n s m i tt e r
R x 1 o p ti c a l
r e c e i v e r
O S C
1 3 1 0 n m
E S C b o a r d
( d a u g h t e r b o a r d )
T D M 1
M U X / D E M U X ,
O A D M o r O A C
b o a r d
E B R I D G E

Figure 324251: board in a Line Terminal configuration

O S C
W D M R x
M C C
T x 2 o p ti c a l
m a n a g e m e n t
M a t r i x
R x 2 o p ti c a l
r e c e i v e r
E a s t
M C C
T x 1 o p ti c a l
R x 1 o p ti c a l
r e c e i v e r
O S C 2
1 3 1 0 n m
O S C 1
1 3 1 0 n m
T D M 2 T D M 1
E S C b o a r d
( d a u g h t e r b o a r d ) ( d a u g h t e r b o a r d )
W e s t
M U X / D E M U X ,
O A D M o r O A C
b o a r d
M U X / D E M U X ,
O A D M o r O A C
b o a r d
E B R I D G E

Figure 325252: OSC board in an OADM or Back-To-Back configuration

See SPV-M + OW (SPVM2) and SPVM_H optical characteristics.
Management of up to two OSC boards
In configurations where CPEs are linked to a 1696MS in a ring, the 1696MS is able to
manage the first OSC board (East and West of the Ring), plus another OSC managing
the OSC to/from CPE(s).
EBRIDGE board
The EBRIDGE is an electrical board for Rel. 3.0 application, which provides TDM
(TDM1 and TDM2 streams) link bridge from ESC board to OSC board and viceversa
(as regards the two 2Mbps bidirectional Data Communication Channels).
In Central Office shelf it is active only in slots #10 and #18 and it supports bridge from
slot 10 to slot 35 and slot #18 to slot #43 (slot #n + 25).
In Compact shelf it is active only in slot #2 and it supports bridge from slot #2 to slot
#9.
Optical Spectrum Monitoring Card (OSMC)
The Optical Spectrum Monitoring Card (OSMC) is used along with the MVAC board
as a key element of the automatic equalization process into the 1696MS system,
providing the ITU-T entire C-band monitoring function in terms of channel power and
wavelength (no OSNR).

Figure 326253: OMSC block diagram

The purpose of this board is to measure the power per channel at several points of a
node.
This board receives its optical input signals from any point of the tranmission path and
it measures the power of each channel.
Up to 8 locations (4 per direction) are possible on monitoring or direct ports (see
Figure 254327).
before and after first and second stage of an amplifier
before a demultiplexer
after a multiplexer.
O S M C
1
R x T x
R x T x
2
1
R x T x
R x T x
2

Figure 327254: OSMC connection (measured points)

The front panel PC electrical interface is used to send the data directly to a PC.
For the absolute channels power measurement, an offset (called calibration factor)
must be available in order to consider the loss of the monitoring splitter. Each power is
given before the monitoring splitter.
Functional Description
The 8 x input ports are connected to a 1 x 8 electro mechanical latching fiber optic
switch: when the system wants to select a specific port, it sends an order thru the SPI
bus that in turns make the Control Unit to properly bias the switch command pins by
making it switching to the selected position. As soon as the new position is raised the
switch will rest in that position until a new stimuli occurs.
The output WDM signal is then forwarded to the OCM module through a 90/10 TAP
coupler, the 10% branch being devoted to a broadband photo-detection, performed by
a PIN photodiode followed by a logaritmic amplification in order to provide system
calibration.
The OCM goal is to perform a spectral analisys of the C-band, from 192 THz (ch#20)
to 196 THz (ch#60), every 100 GHz, as regards channel power and wavelength.
The Alarms and Control unit provides a digital interface between peripheral
components (OCM, Optical switch..) the NE needs to get access to and the SPIDER
local interface it is connected to. Main functions are
channel power calibration and board calibration
OCM interfacing, data post-processing and alarms generation
optical switch control and monitoring
photo detection and board temperature digital processing
OOS led control
The SPI interface terminates the SPI bus used for control and monitoring between
OSMC (slave) and ESC. The two EEPROMs provides Remote Inventory data and
board specific parameters (ECID).
The power supply module performs incoming -48V rails filtering, over-voltage and
current protections, board feeding generating the needed voltages (+3.3V, +5V..),
alarms monitoring.
1696MS_C Master Intershelf Link (I-LINK_M)
This board is dedicated to the 1696MS_C shelf and allows to manage up to three
shelves (one master shelf and two slave shelves) by using only one ESC board (cost-
saving solution).
The I-LINK_M board is located in the master compact shelf; it has to be used in
conjunction with the I-LINK_S board (slave board) located in each slave shelf, to
which it has to be linked to be able to stack up to three subracks. Hence
the ESC board has to be plugged in slot 1 of the master shelf
the I-LINK_M board has to be plugged in slot 6 of the master shelf
the I-LINK_S board has to be plugged in slot 1 of each slave shelf.

The I-LINK_M is mainly dedicated to connect the SPI bus (and the card presence
signals) from the ESC to the slave shelves, where no ESC unit is provided.
The connection between I-LINK_M and each I-LINK_S is done by using dedicated
cables.
After having provisioned it, swapping cables is not possible.
When the connection between I-LINK_M and other I-LINK_S is removed, a Card
Absent alarm is raised on every board of the expansion shelves.
I - L i n k _ M
B A C K
P A N E L
M 1
S P I
I n te r f a c e
( S p i d e r )
E E P R O M E E P R O M
R E M O T E
I N V E N T O R Y
B O A R D
D A T A
( E C I D )
R S 4 8 5
T r a n s c e i v e r s
c a r d p r e s
M 2
P o w e r
S u p p l i e s
R S 4 8 5
T r a n s c e i v e r
S L O T I D
M 7
C a r d P r e s e n c e
B u s S L A V E 1
S P I
s L A V E S H E L F 1
C O N N E C T O R
M 8
B u s S L A V E 2
S P I
C O N N E C T O R
M 9
B u s S L A V E 3
S P I
C O N N E C T O R
( N O T U S E D )
F P G A
C a r d P r e s e n c e B u s
F R O N T
P A N E L
M 5
C a r d
P r e s e n c e
P o w e r
s u p p l y
+
- 48Vdc
VBatt
+ 5 V
+ 3 . 3 V
+ 2 . 5 V
H W F
+ 3 . 6 V

Figure 328255: I-Link_M block diagram

1696MS_C Slave Intershelf Link (I-LINK_S)
This board is dedicated to the 1696MS_C slave shelf giving the possibility to add up to
two 1696MS_C slave shelves to the master shelf.
Using the I-Link_S unit allows to save the cost of the reuse of an ESC unit giving the
possibility to link the SPI bus and the Card Presence signal of each slave shelf to the
master shelf, thus connecting these signals to the ESC boards, only provided in Master
shelf.
The I-LINK_S board has to be plugged in each slave compact shelf; it has to be used in
conjunction with the I-LINK_M board (master board) located in master shelf, to which
it has to be linked to be able to stack up to three subracks (1 master shelf and two slave
shelves). Hence
the I-LINK_S board has to be plugged in slot 1 of each slave shelf.
the I-LINK_M board has to be plugged in slot 6 of the master shelf
The connection between I-LINK_M and each I-LINK_S is done by using dedicated
cables.
After having provisioned it, swapping cables is not possible.
When the connection between I-LINK_M and other I-LINK_S is removed, a Card
Absent alarm is raised on every board of the expansion shelves.
The I-Link_S unit includes
SPIDER, Remote Inventory and Data EEPROM (ECID)
1 connector for the master shelf.

I - L i n k _ S
B A C K
P A N E L
M 1
S P I
I n t e r f a c e
( S p i d e r )
E E P R O M E E P R O M
R E M O T E
I N V E N T O R Y
B O A R D
D A T A
( E C I D )
R S 4 8 5
T r a n s c e i v e r s
c a r d p r e s
M 2
P o w e r
S u p p l i e s
R S 4 8 5
T r a n s c e i v e r
S L O T I D
M 1 0
S P I
s L A V E S H E L F
C O N N E C T O R
F P G A
F R O N T
P A N E L
M 5
C a r d
P r e s e n c e
P o w e r
s u p p l y
+
-
48Vdc
VBatt
+ 5 V
+ 3 . 3 V
+ 2 . 5 V
H W F
+ 3 . 6 V

Figure 329256: I-Link_S block diagram

General user interfaces
Two main functions are supported by the various small units: provide the power supply
to the other units and provide the electrical interfaces to the operators.
The various functions are divided into small boards plugged in the bottom of the shelf
(cf. Figure 257330. ).
Each of these boards supports a SPI Bus interface and some card presence wires.
QB
P
o
w
e
r

s
u
p
p
l
y

A
U
s
e
r

I
n
t
e
r
f
a
c
e
LAN
access
FANC
M
C
C
M
C
C
M
C
C
M
C
C
M
C
C
M
C
C
M
C
C
M
C
C
M
C
C
M
C
C
M
C
C
M
C
C
M
C
C
M
C
C
M
C
C
S
P
V

m
a
n
a
g
e
n
e
m
e
n
t

(
o
p
t
)
E
S
C
O
M
D
X

+

E
X
P

+

S
P
V
O
M
D
X
M
C
C
optical protection units
M
a
t
r
i
x

S
l
o
t
M
a
t
r
i
x

S
l
o
t
P
C
S
P
S
C
L
optical protection units
H
K
H
o
u
s
e

K
e
e
p
i
n
g
R
a
c
k

a
l
a
r
m
s
R
A
I
A
N
C
U
I
C
U
I
C
P
o
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s
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p
p
l
y

B
U
s
e
r

I
n
t
e
r
f
a
c
e

Figure 330257: Electrical access, slot description

LAN board
ETHERNET
INTERFACE
ADAPTER
COAX TRANSC
TP - RJ45
IE-LAN INPUT
IE-LAN OUT
hex rotary switches
EQTYPE
SHELF-ID
N . B . I f a w i r e i s p l u g g e d o n J 4 5 , B N C i s u n
a v a i l a b l e .

Figure 331258: Block diagram of control LAN board

Lan board purposes
The purposes of the LAN board are the following:
to provide the physical layer for the QB interface between the Equipment shelf (ESC board)
and an external supervisor (e.g. 1353SH),.
to provide the 4 bits Equipment type Codification, necessary to give to the application stored
in the Equuipment Controller.
to provide the 8 bits Shelf IDentification number (i.e.: MAC address), necessary to build up
the IP address of the shelf where the LAN board is installed.
Lan board description
The LAN board has to be plugged in the slot 26 for the Maser shelf (LAN_Q) or slot
#8 of 1696MS_C shelf. It is linked to the ESC board by backpanel link.
A second LAN (LAN_I) in the slot 27 is used to link to the Slave shelf with a LAN
board on the slot 27.
The link to an external supervision equipment is ensured by 2 BNC connectors or by
one RJ 45 connector.
The Equipment Type Codification is ensured by the hexadecimal rotary switch CW3.
The Shelf IDentification is ensured by the two hexadecimal rotary switches CW1 and
CW2.
N.B. The LAN_I functionality is not foreseen in a 1696MS_C shelf.
Lan board Hardware setting
Equipment Type Codification
The hexadecimal rotary switch CW3 is in charge of setting up the equipment type. The
CW3 factory setting is the value 5, for the 1696MSPAN. It must not be changed.
Shelf Identification number
The hexadecimal rotary switches CW1 and CW2 are in charge of setting up the shelf
Identification number. The CW1 factory setting is the value B and the CW2 factory
setting is the value F. These default values are the identification number of the master
shelf.
For the different shelves, the switches setting values are:
Shelf Slot Function Switch settings
CW1 CW2 CW3
Master 26 ELAN B F 5
Master 27 ILAN B F 5
Expansion 1 26 ELAN 7 F 5
Expansion 1 27 ILAN 7 F 5
Expansion 2 26 ELAN 3 F 5
Expansion 2 27 ILAN 3 F 5
Expansion 3 26 ELAN E F 5
Expansion 3 27 ILAN E F 5

A B C
Front Panel
Rotary Wheels 6 pins host f or jumper
Back Panel
CW 1 CW 2 CW 3
D E F

Figure 332259: LAN board settings

It is not necessary to configure expansion shelves in this order, but it is necessary to
give the corresponding expansion number to the craft Terminal.
For example if only one drop shelf is present, its LAN baord can be configured (3, F,
5) but then to be defined as Expansion 2.
Jumper configuration
For operation with the ESC, 1696 MS R1.3 and later, the jumper setting equipment for
all LAN cards is the same regardless of which slot they are installed in. Only the
following jumper settings are permitted:
No jumper
Jumper between pins A-D
N.B. During NE upgrade from R1.1, the jumper settings of all installed LAN
cards should be checked and modified as necessary to comply with the above.
For a Compact NE (1696MS_C), the switches setting values are mandatory (B, F, 5).
HouseKeeping board (HK)
8 house-keeping accesses are provided in both direction (8 inputs and 8 outputs).
The HK board is plugged in the slot 36 of the master shelf.
Connector: sub-D 25 pins (see Management and maintenance connections,
Housekeeping).
Rack Alarm Interface (RAI)
The RAI board monitors the rack alarms. Each shelf (master and expansion shelf) is
equipped with this card in the slot 37in 1696MSPAN and in slot 9 or 10 in master shelf
of 1696MS_C.
1696 MSPAN alarms are analysed either by the Equipment Shelf Controller or directly
by the Rack Alarm Interface board. In function of the importance of these alarms, the
ESC generates signals to turn on LEDs on PDU or TRU card and so to alert the user.
2 ways of working are available:
for the Interfacing with the PDU
The RAI cards in the same rack are linked to each other as shown on Figure 260333.
And the RAI card in the master shelf is linked with the PDU.
for the Interfacing with the TRU
The same way of working can be proposed, but also a direct link between each shelf and
the TRU (cf. Figure 260333. ).
The RAI card inputs are alarms coming from the FAN card, from the PSC, from the
shelf just below (if any) and from the Equipment Controller (for the RAI card in the
master shelf). Taking the various inputs into account the rack lamps are lit on or off.
Rack lamps are different in ETSI and ANSI worlds. The RAI card is made to interface
with both standards.
Rack Alarms
It is used to connect the rack lamps. These lamps differ from the ETSI rack to the
ANSI one.

Table 7.43 PDU Front Panel LED Markings
Marking LED Color DESCRIPTION
CRI red Critical: critical alarm input from one of the shelves in the rack
MAJ red Major: major alarm input from one of the shelves in the rack
MIN yellow Major: minor alarm input from one of the shelves in the rack
RACK red Rack Alarm: alarm input from one of the shelves in the rack or
in the PDU


Table 7.44 TRU Front Panel LED Markings
Marking LED Color DESCRIPTION
URG red Urgent: major alarm input from one of the shelves in the rack
NURG yellow Non urgent: minor alarm input from one of the shelves in the
rack
ATTD red Attended: aknowledged URG or NURG alarm
SIG PRSC green signal presence (power on)

Connectors: (see Management and maintenance connections, Rack Alarm Interfaces).
SUB-D 9 pins female
RJ11 6pins female.
Top rack unit
Air deflector
Air deflector
Power Distribution Unit
OPTINEX RACK
NEBS 2000 RACK
Slot 37

Figure 333260: Electrical links between RAI cards (slot 37) and TRU & PDU

User Interfaces Card (UIC)
Description
Some user information are carried by the SPV channel: they are extracted from the
SPV frame by the SPVM board and access via dedicated electrical connectors on the
User Interfaces cards.
Those small boards have to be plugged under the corresponding SPVM board and in
the slot beside.
A
U
X
A
1
A
U
X
B
1
A
U
X
A
2
A
U
X
B
2
SPVM
UIC UIC
SPI SPI
NRZ
G703
NRZ
G703
NRZ
G703
NRZ
G703
AUX1, AUX2 AUX1, AUX2
2Mbps USER ACCESS 2Mbps USER ACCESS

Figure 334261: 2 Mbit/s back-panel links between UIC Cards and the SPVM unit

The E2 analogic voice channel is available through a jack in the front panel of the
SPVM board.
Auxiliary Channels Interfaces:
up to two 2 Mb/s bi-directional links (user 2 Mb/s) - G 703
one analogic link.
N.B. In default configuration the E2 channel is configured in drop/insert
configuration.
In a CPE configuation, auxiliary channels are in a hardware configuration (fixed).
N.B. The UIC possibility is provided for 1696MS and not for 1696MS_C
Equipment.
Switching Protection (OPC)
Single and Multi Mode Optical Protection Cards
Description
See Figure 262335. The purpose of this protection unit is to perform passive OCh
protection (linear configuration), OSNC Protection (ring configuration).
There are five types of Optical Protection Card (OPC), listed in the following:
- Single Mode OPC with connectors (SM OPC FCP)
- Multi Mode OPC with connectors (MM OPC FCP)
- Multi Mode OPC with connectors 850 nm (MM OPC 850)
The main difference between the Single Mode OPC and the Multi Mode OPC (with
connectors and with jumpers) boards is the 50/50 Rx optical splitter:
- the SM OPCs have a single mode splitter
- the MM OPCs have a multi mode splitter and a higher optical loss.
The OPC board can be connected to
two transponders (protected channel / protecting channel)
two drawers of two different 4xANY _P) boards.
It can be placed in slots 28 to 35 and in slots 38 to 45, just below the two
transponders/4xANY. As an example,
if the two transponders are plugged in slots 4 and 5, to perform the channel protection the
OPC is plugged in slot 28 or 29
if the two 4xANY_P are plugged in slots 4,5 and 6,7 to perform the channel protection the up
to four OPCs (MM OPC 850) are plugged in slots 28, 29, 30, 31.
The signal coming from the client is connected on RX input and crosses the board
through a 3 dB splitter. By means of the RX 1&2 OUT OPC connectors, it is then sent
to the two transponders (RX user inputs), placed in the slots just above in the double
shelf.

The signal coming from WDM is transmitted by the two adjacent transponders (user
Tx outputs) to the inputs of the other splitter of the OCh protection unit (TX1IN and
TX2IN). The selected signal is sent to the client via the Tx OUT port.
On each board are located
two broadband (1310 nm and 1550 nm) 3 dB splitters/couplers for SM/MM OPC and
SM/MM OPC FCP
two 850 nm 3 dB splitters/couplers for MM OPC 850
Depending on the configuration, are available:
- a single mode splitter on RX line of the SM OPC
- a multi mode splitter on RX line of the MM OPC
- a single mode coupler on TX line of both the SM and MM OPCs.
LOS detection and power measurement are provided on the following input signals
- Rx IN, coming from the client
- Tx 1 IN and Tx 2 IN, coming from the main and spare transponders / 4xANY_P
by means of three 95/5 couplers (one per monitored signal) which extract the 5% of the
received optical signals and send each of them to a photodiode (optical receiver)
performing LOS detection and measurements. The LOS alarm is sent to the Alarm
Interface and then to:
- the two transponders / 4xANY_P via backpanel connections
- the ESC board via the SPI bus.
The selection of the signal is made by the transponders.
The Remote Inventory data are available via the SPI bus.
Two external voltages are supplied by the PSC units. On-board fuse protection and
hardware failure control are available.
R X O U T
R X I N
C h a n n e l 1
R X O U T
95/5 50/50
Optical L O S
Receiver**
95/5
95/5
Optical L O S 2
Receiver
Optical L O S 1
Receiver
T X I N
T X I N
50/50 T X
O U T
Alarm
Interface
2
Card
presence
C h a n n e l 2
C h a n n e l 1
C h a n n e l 2
B
a
c
k
p
l
a
n
e

c
o
n
n
e
c
t
o
r
t
o
w
a
r
d
s

t
r
a
n
s
p
o
n
d
e
r
s
N . B . * o n M u l t i M o d e O P C b o a r d s , t h e R X l i n e i s M M F t y p e
o n S i n g l e M o d e O P C b o a r d s , t h e R X l i n e i s S M F t y p e .
T h e T X l i n e i s a l w a y s S M F .
f
r
o
m

t
r
a
n
s
p
o
n
d
e
r
s
/
4
x
A
N
Y
_
P

d
r
a
w
e
r
s
f
r
o
m

c
l
i
e
n
t
t
o

c
l
i
e
n
t
t
o

t
r
a
n
s
p
o
n
d
e
r
s
/
4
x
A
N
Y
_
P

d
r
a
w
e
r
s
splitter
MMF or SMF*
3dB optical
coupler
3dB optical
SMF
SMF
MMF or SMF*

Figure 335262: OPC block diagram

See Optical Protection Cards (OPC) optical characteristics.
Optical Multiplex Section Protection: OMSP unit
OMSP is a small board containing an optical splitter and an optical switch, able to
select an incoming signal among two. It performs optical multiplex section protection.
On the transmission side, with the optical splitter, the signal from MUX output is
broadcasted on the main/working fiber and the spare/protecting fiber.
On the receiver side, the optical switch will select to receive the optical signal coming
from the main/working fiber and the spare/protecting fiber under the control of board
logic. The optical signal coming out from the optical switch is sent to DEMUX module
of OMDX board.
Both the incoming signals powers are measured thanks to a 95/5 coupler and a
photodiode enabling
to raise a LOS alarm if the actually selected signal power falls
to know if the spare signal (the incoming signal not selected) is present.
If a LOS appears on the main signal and the spare signal is present, the board switches
to the spare signal.
The board commits the order given by the SC: if the SC forces the board to switch, the
switch is effective.
The OMSP board can be used on a line that is amplified or not:
LOS threshold:
- the default value for LOS alarm thresholds for both input lines is -38 dBm
- the LOS alarm threshold is configurable on the board, and is configurable by the
operator, but both lines have the same LOS alarm threshold
Switch Status:
- the OMSP protection can have two status : Automatic or Forced
- the Forced status can be on the Main line or on the Spare one
- the board commits the order given by the Shelf Controller : if SC forces the board
to switch, the switch is effective. It means that the CPLD on board does not verify
that the path on which it is asked to switch is correct (no LOS). It means that
Manual switch is not foreseen on this board, but only Force switch
Measures:
- the OMSP board enables measure of power level of both lines (in dBm).

In point-to-point application, the OMS protection scheme is divided into the following
two sorts:
M U X /
A M P L I
s p l i t t e r s w i t c h D E M U X
/ A M P L I
M U X /
A M P L I
/ A M P L I
M U X /
A M L I
s p l i t t e r s w i t c h
/ A M P L I
O A D M
M U X /
A M P L I
s p l i t t e r s w i t c h
/ A M P L I

Figure 336263: OMSP Application with and without OADM

f r o m
M u x /
A m p l i
O p t i c a l
s p l i t t e r
O p t i c a l
s w i t c h
d r i v e r
C H 1 o u t
t o
D e m u x
/ A m p l i
C H 2 o u t
C H 1 i n
C H 2 i n
C P L D
O p t i c a l
s w i t c h
s t a t e
O p t i c a l i n p u t
p o w e r d e t e c t i o n ,
m e a s u r e m e n t s ,
L O S j u d g m e n t
O p t i c a l i n p u t
p o w e r d e t e c t i o n ,
m e a s u r e m e n t s ,
L O S j u d g m e n t
L O S 2
L O S 1
A D C
V a l u e 2
V a l u e 1
S p i d e r S P I
b u s
O p t i c a l
s w i t c h
9 5 : 5
9 5 : 5
+
5
.
5
V
+
3
.
6
V

Figure 337264: OMSP unit block diagram

OMSP optical characteristics
Refer to OMSP optical characteristics.
Power Supply Card (PSC/PSC3)
Two power supply units are used: working and protecting.
They are located at each side of the shelf, in the slots 25 and 48.
For the block diagram, refer to Figure 265338..

The Power Supply Cards are monitored via the SPI bus.
PSCs provide some +3.6 V and 5.5 V for service use to all units and a 48 V power
supply when needed.
The input voltage range of the Power Supply Cards is -36 / -72 V.
Front panel Connector: sub-D 3 poles (see Power supply connections).
LEDs signification

Table 7.45 PSC and PSC3 LEDs signification

HardWare Failure:
GREEN when the board is plugged, configured and without failure
RED when one of the On Board Power Supply (OBPS) is in failure (OR on the power supply
alarms)

Power Supply Card (PSC2)
This board is the same as PSC and PSC3 but needs to supply less power, because it has
been designed for 1696MS_C, hosting only 13 slots.
PSC2 are used in main and slave compact shelves.
Two power supply units are used: working and protecting. They are located at each
side of the shelf, in the slots 7 and 12, and they are monitored via the SPI bus.
These boards are with the 0V isolation.
PSCs provide some +3.6 V and 5.5 V for service use to all units and a 48 V power
supply when needed. The current limit is 6A.

The input voltage range of the Power Supply Cards is -36 / -72 V.
Front panel Connector: sub-D 3 poles (see Power supply connections).
The LEDs signification is shown in the following table.
+Batt_A
-Batt_A
PSC2
GND
* protection
* pre-filter
* fuse
+Batt
-Batt
* OR Batt
* EMI/EMC
filter
* soft start
* EMI/EMC
filter
* threshold
dual DC/DC
converter
3.6V
5.5V
TOGENERIC BOARD TOGENERIC BOARD

Figure 338265: PSC2 block diagram

Power Management Unit (PMU)
The PMU is strictly dedicated to the 1696MS_C.
It is an external shelf able to feed the compact shelf providing the -48 Vdc to the power
supply cards.
Hence the 1696MS_C can be fed
by the classical -48Vdc provided by the telecom rack
by the -48Vdc provided by the PMU, able to deliver this powering from any alternative
voltage source.
The PMU is an external shelf of the same size that the 1696MS_C, which can be
installed in 19, 21 and 23 racks. This additional shelf is 1U high (1U = 44.45mm).
The PMU works in a worldwide environment, which applies to the following
requirements:
US requirements : NEBS compliant (115V/ 60Hz),
Japan requirements (100V/ 50/60Hz),
Europe requirements (230V/ 50Hz).
PSC boards are connected to the rectifiers of the PMU which provide the power.
PMU Control unit is connected to the FAN_C board and the tw0 PSC/PSC2 to provide
alarms to the Network Element since this unit in not managed by the software.
F

A

N

_
C
PSC(2)
PSC(2)

7
8
9
10
11
12
1
2
3
4
5
6
13
CONTROL
UNIT
PMU
f rom back-up batteries (optional)
in1 in2
-48Vdc
f rom any alternativ e v oltage source (100Vac, 115Vac, 230Vac)
-
4
8
V
d
c

(
p
o
w
e
r

s
u
p
p
l
y
)
PMU alarms

Figure 339266: PMU cabling scheme

Description
Refer to Figure 267340. The PMU architecture is made up of:
2 VAC inputs
2 VDC outputs without fuses
1 battery connection
one cintrol unit
2 rectifiers modules
On DC voltage outputs, no fuses are required because the 1696MS_C has on his PSC
unit fuses on inputs. The outputs are connected together, so they can protect each all
the DC outputs.
Two rectifiers modules are present in one PMU. Each modules is able to supply with
power up to 4 stacked 1696MS_C.

One module enables to supply the 4 stacked shelves. If one module fails, the other one
can still supply the 4 shelves.
The Control Unit must be able to provide the following functions
deliver 2 outputs 48VDC
transmit alarms to the host (FAN_C board)
manage the battery
manage Status Leds.
AC input 1
Discarge
-
+
-
+
Protect
DC output 1
DC output 2
+ Batt
- Batt
AC input 2
AC in1 presence
AC in2 presence
Batt presence
Control
Unit
Alarms
T o B a t t
M1
M2
M3
M4
M5
M6

Figure 340267: PMU block diagram

Batteries for PMU
Batteries are optional units used with the PMU in order to supply the -48V to the
1696MS_C in case of power outage of the alternative power source (100V/115V/220V
supply).
Battery units are linked to the Control unit of the PMU by cascading the units.
The first battery gives a temperature measurement of the unit to the PMU so as to
generate an alarm when out of the range.
It is possible to add up to three optional batteries. This depends of the current
consumption of the shelves (150W per battery).
Performance.
The battery must be charged in a maximum of 15 hours with 1 PMU and 1 shelf.
The battery must be charged in a maximum of 60 hours with 1 PMU and 4 shelves.
The Battery duration for 150W must be of 3 hours.
Mechanical dimension of each battery: W = 446.02 mm; L = 284 mm; H = 133.35
mm.
Batteries can be inserted in a 19, 21 (ETSI) and 23 (ANSI) rack or put on table.
In Rack Version, the batteries are located below the PMU.
F

A

N

_
CPSC(2)
PSC(2)

7
8
9
10
11
12
1
2
3
4
5
6
13
CONTROL
UNIT
PMU
in1 in2
-48Vdc
-
4
8
V
d
c
Battery with
captor of
temperature
Optional

Figure 341268: Minimum configuration of the batteries in 1696MS_C Rel. 2.2,
rack version
In table version, batteries are located and stacked besides the PMU and 1696MS_C
shelves; only this configuration is supported since a battery is not likely to hold the full
stack of batteries, PMU and shelves.

F

A

N

_
C
PSC(2)
PSC(2)

7
8
9
10
11
12
1
2
3
4
5
6
13
CONTROL
UNIT
PMU
in1 in2
-48Vdc
-
4
8
V
d
c
Battery with
captor of
temperature
F

A

N

_
C
PSC(2)
PSC(2)

7
8
9
10
11
12
1
2
3
4
5
6
13
F

A

N

_
C
PSC(2)
PSC(2)

7
8
9
10
11
12
1
2
3
4
5
6
13
-48Vdc
Optional Battery
-48Vdc
Optional Battery
Optional

Figure 342269: Maximum configuration of the batteries in 1696MS_C Rel. 2.2,
table version
FANS unit
FANC unit for 1696MS shelf
As the power consumption of the transponder is high enough (about 20-25 W / unit),
fans are necessary to dissipate the heat.
The fans are located at the bottom of the shelf. The use of fans requires to put an air
filter just below. This is shown on Figure 270343.
FANS
T
R
S
N
A
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R
S
P
V

m
a
n
a
g
e
n
e
m
e
n
t

(
o
p
t
)
E
S
C
O
M
D
X

+

E
X
P

+

S
P
V
O
M
D
X
O
A
C

(
O
P
T
I
O
N
A
L
)
O
A
C

(
O
P
T
I
O
N
A
L
)
A i r f i l t e r
T
R
S
N
A
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R
T
R
A
N
S
P
O
N
D
E
R

Figure 343270: Fan shelf description and Rack partitioning

One FAN module is placed at the bottom of the shelf, in the slot 49.
The FANS are monitored via SPI bus and some direct wires are sent to the House
Keeping/Remote Alarms module to monitor a possible failure of the cooling system.
Max Power dissipation per shelf: 400 W.
New FANC unit for 1696MS shelf
In Rel. 2.2A has been introduced a new FAN board with improved efficienty, because
of the high consumption of the new boards.
Main characteristics:
air flow increase
FAN speed controlled as a function of the air temperature:

- if temperature is lower than 35C, the FAN speed is normal
- if temperature is higher than 35C, the FAN speed increases quickly
FAN1, FAN2, FAN3 speeds are independednt
the three front panel LEDs indicate the FAN speed state.
S p i d e r
S P I
b u s
+48V
+3.6V
D A T A
R I
E C I D
L E D
c o n t r o l l e r
S p e e d d e t e c t o r S p e e d d e t e c t o r S p e e d d e t e c t o r
F A N 1 F A N 2 F A N 3
P o w e r
S u p p l y
HWF

Figure 344271: Block diagram of the new FAN unit

FAN_C unit for 1696MS_C shelf
On the 1696MS_C shelf, FAN unit is located on the left side of the compact shelf. The
use of fans requires to put an air filter just below.
ESC
TRNSPONDER
TRNSPONDER
SPV managenement
OOADM1ch+OSCW
OOADM1ch+OSCE
F
A
N
_
C
PSC(2)
Hk
RAI
OPC
Lan_Q
PSC(2)
A i r f i l t e r

Figure 345272: FAN_C description and Rack partitioning

FAN_C unit takes place in the left slot of 1696MS_C shelf and is equipped with two
fans with speedometer sensor to dissipate the heat coming from Transponder and
4xANY boards essentially. FAN_C board is mandatory provided.
FAN_C board enables the link to the Power Management Unit (PMU) which is an
external frame containing the rectifier AC/DC to enable the plugging in the main
supply).
The logical alarms generated by the PMU (PMU presence, Minor and Major) are sent
to the FAN_C boards SPIDER where they are red by the shelf Controller (ESC).
This alarm is used by the software to inhibit or not both others. If the alarm is not
raised, (PMU absent), the MAJOR and MINOR alarms are inhibited.
MINOR (resp. MAJOR) alarm means that one (resp. two) rectifier is defective or out
of the functioning range.


8 TECHNICAL SPECIFICATIONS
Overview
Purpose
Contents
1696MSPAN System characteristics II-565
Safety requirements and mechanism II-575
Boards interfaces characteristics II-587
Alarm characteristics II-659
Power supply characteristics II-712
Mechanical characteristics II-715
Environmental characteristics II-717

1696MSPAN System characteristics
Main system characteristics
General
Optical bit rate, client side
MCC3
WLA1, WLA2, WLA3

all the bit rates are 3R
any bit rate between 100Mbps and 2.66Gbps
100 Mbps : FDDI
125 Mbps : Fast Ethernet, FDDI
155.520 Mbps : STM-1/OC-3
200.00 Mbps : ESCON
270 Mbps : Digital Video (DTV) / HDTV
622.080 Mbps : STM-4/OC-12
1062.5 Mbps : Fiber Channel / FICON
1244.160 Mbps : OC-24
1250 Mbps : Gigabit Ethernet
2125.00 Mbps : 2 Fiber Channel
2488.320 Mbps : STM-16/OC-48
2500 Mbps : Infiniband
2666 Mbps : NNI
0CC10
TRBD1996
9953.28 Mbps : STM-64/OC-192/10 GBE WAN
10.3125 Gbps : 10 GBE LAN
4xANY 125 Mbps : Fast Ethernet, FDDI
155.520 Mbps : STM-1/OC-3
200.00 Mbps : ESCON
270 Mbps : Digital Video (DTV) / HDTV
622.080 Mbps : STM-4/OC-12
1062.5 Mbps : Fiber Channel / FICON
2xGE_FC 1250 Mbps : Gigabit Ethernet
1062.5 Mbps : Fiber Channel, FICON
8xGE 1250 Mbps : Gigabit Ethernet

Optical bit rate, line side
MCC3, WLA1, WLA2,
WLA3
4xANY, 2xGE_FC
8xGE
OCC10
TRBD1996

the same of all the clients bit rates, in the correspondent
wavelength ()
2488.320 Mbps : STM-16 / OC-48
9.95328 Gbps : 10 GBE WAN
10.709 Gbps : STM-64/OC-192/10 GBE WAN
+ FEC
11.096 Gbps : 10 GBE LAN + FEC
Type of optical fiber According to ITU-T G.652, G.653, G.654, G.655
Central frequencies and wavelength see Table 8.1 CWDM nominal frequencies allocation plan in C-
BandTable 8.1 CWDM nominal frequencies allocation plan in C-
Band and Table 8.2 DWDM frequencies allocation plan in C-
BandTable 8.2 DWDM frequencies allocation plan in C-
BandTable 8.2 DWDM frequencies allocation plan in C-Band
Application types Terminal Multiplexer (LT), back-to-back terminal (HUB),
OADM in protected / unprotected linear links and rings, In Line
Amplifier, CPE
Interfaces types Electrical interfaces: 2Mbps G.703, 64Kbps (user channels)
Optical interfaces: all the client and WDM interfaces above listed
Applied standards
ITU-T Recommendation G.681 Functional characteristics of interoffice and long-haul line
systems using optical amplifiers, including optical multiplexing
ITU-T Recommendation G.692 Optical interfaces for multichannel systems with optical
amplifiers
ITU-T Recommendation G.693 Optical interfaces for intra-office-systems
ITU-T Recommendation G.694.1 Spectral grid for WDM applications: DWDM wavelengths grid
ITU-T Recommendation G.694.2 Spectral grid for WDM applications: CWDM wavelengths grid
ITU-T Recommendation G.695 Optical interfaces for Coarse WDM multiplexing applications
ITU-T Recommendation G.709 Network Node Interface for the Optical Transport Network
(OTN)
ITU-T Recommendation G.957 Optical interfaces for equipments and systems relating to the
synchronous digital hierarchy
ITU-T Recommendation G.958 Digital line systems based on the synchronous digital hierarchy
for use on optical fibre cables
ETS 300 232 A1 Transmission and multiplexing; Optical interfaces for
equipments and systems relating to the Synchronous Digital
Hierarchy (SDH)
GR - 253 - CORE Synchronous Optical Network (SONET) Transport Systems:
Common Generic Criteria, issue 2C
IEEE G.802.3 Gigabit Ethernet specification
ANSI x 3.184 1993 standards FE and FDDI specification
ANSI x 3.320 standard (100-SM-LL-I) FC and FICON specification
IBM SA-0394-03 ESCON specification
ITU-T BT.656-4, BT1363-1, BT1367 Digital Video specification
SMPTE 292M-1998 Television - Bit Serial Digital Interface for High-Definition
Television Systems
IEEE 802.3 Carrier sense multiple access with collision detection
(CSMA/CD) access method and physical layer specifications
GR - 63 - CORE Network Equipment - Building System (NEBS) Requirements:
Physical Protection, issue 1
ITU-T Recommendation G.664 Optical Safety procedures and requirements for optical transport
systems
IEC 825 Safety of laser products
EN 60950 Safety of information technology equipment, including electrical
business equipment
GR - 1089 - CORE Electromagnetic Compatibility and Electrical Safety - Generic
Criteria for Network Telecommunication equipment
pr ETS 300 386-1
pr ETS 300 386-2-2
Equipment Engineering ; Public telecommunication network
equipment. Electro-magnetic compatibility requirements:
Part 1 : Product family overview, compliance criteria and test
levels

Part 2-2 : Product specific compliance criteria and operating
conditions - Transmission equipment, Version : 0.7, 1996.02.29
ITU-T Recommendation G.825 The control of jitter and wander within digital networks which
are based on the synchronous digital hierarchy to be published
SMPTE RP184-1996 Specification of Jitter in Bit-Serial Digital Systems
T11/98 - 055 Fiber Channel - Methodologies for Jitter Specification
EN 55022 Limits and methods of measurement of radio interference
characteristics of information technology equipment
ETS 300 019-1-1
ETS 300 019-1-2
ETS 300 019-1-3
Equipment Engineering: Environmental conditions and
environmental tests for telecommunications equipment.
Classification of environmental conditions
(storage/transportation/stationary use)
Add-Drop and Cross-Connect features
Connectivity Tributary to Mux/Demux wavelength assigment
Mux/Demux to Mux/Demux wavelength assigment
Tributary to tributary wavelength assigment
Loopbacks
Protections
Network protections Optical SNCP
Optical Transmission Section Protection (OTSP)
Equipment optical protections

1+1 MCC3
1+1 MCC3 + 4xANY / 2xGE_FC (only MCC is protected)
1+1 4xANY / 2xGE_FC client (each client can be protected)
1+1 MCC3 + OAC
1+1 OCC10
1+1 OCC10 + OAC
1+1 the two channels of the WLA2M_OP (not the board)
1+1 the two channels of the WLA3CDOP (not the board)
1+1 WLA(OP) + 2xGE_FC
1+1 TRBD1996
Powering protections 1+1 Power Supply Card
Management interfaces
Functions provided
Q3 interf with PC (ECT/RECT), 1353SH and
1354RM NMS (on terminal)
Station alarms
Equipment Alarm status (indicated by the front cover
LEDs)
Visual indications for card fail.
Management interfaces supported:
Q3/TL1 to connect a Local or Remote Equipment
Craft Terminal
Ethernet (on LAN_Q board) to connect the OS
1353SH and other Alcatel-Lucent NEs with
ETHERNET Interface
QECC to connect other Q3 NEs

Local interface: Craft Interface (PC) RS232 SUB-D 9pin, PC compatible at 9600 bps
Remote interface: Craft Interface (PC) RS232 SUB-D 9pin, PC compatible at 9600 bps.
It handles up to 32 NEs via DCC (D1BD3 and/or
D4BD12)
Remote interface: Transmission Management
Network (TMN) interface
ITU-T G.773 10 base-2 and 10 base-T
Protocol
Stack/Information
Model messages
Q3/QECC or TL1

Operation processes (management interfaces functions)
Configuration and provisioning Equipment, Units; Add-Drop; Cross-connection,
Synchronization, Protection, Alarms status, Maintenance memory
for all the equipment events
Software download It is made locally as well as remotely on non volatile memories
without traffic interruption

Performance monitoring:
FEC PM

based on FEC corrected/uncorrected errors
B1 PM
based on B1 and J0 n.i.m. and Treshold Crossing Alarm based on
B1 errors count, ingress and egress (SDH/SONET), according to
ITU-T G.784, G.826, G.821, M2101.1
Layer 1 Ethernet PM
(8B/10B)
Based on the 8B/10B coding structure of the Ethernet frame,
according to Tables 36-1 and 36-2 of the 802.3 standard (2005 ed.
section 3)
Layer 1 Ethernet PM
(64B/66B)
Based on the 64B/66B coding structure of the Ethernet frame
Remote Inventory At rack, subrack and board level
Unit and equipment
acknowledgement
Through Remote Inventory: Company id, Unit type, Unit part
number, Software part number, CLEI code, Manufacturing Plant,
Date Identifier, Date of construction... For details, refer to the
operators handbook
Security Password, operator profile, back up for programs and data
Unit substitution characteristics
For transponders, optical amplifiers
and Mux/Demux
without traffic interruption in case of Optical SNCP
For 4xANY and 2xGE_FC without traffic interruption if all drawers/clients are protected
Housekeeping (HK)
Number of housekeeping accesses 8 inputs and 8 outputs
Connector SUB-D 25 pins
Output HK signals-CPO (Remote
alarms used for remote control)
By electronic relay contacts to be connected to the external
negative voltage
Max. guaranteed current
with closed condition
50 mA
Max. allowed voltage
with open condition
-72 V
Voltage drop vs ground
-2 V 0 V

Input housekeeping signals (CPI)
Max. guaranteed current
3 mA
Max. allowed voltage
with open condition
-72 V
Voltage drop vs ground
-2 V 0 V
Rack Alarms (RAI)
Connector SUB-D 9 pins
Max. guaranteed current with closed
condition
100 mA
Voltage difference between Common out and OUT < 2,5 Volts
Resistance of the closed relay = 300 Mohm max
Max. allowed voltage with open
condition
-72 V
Automatic shutdown
According to IEC 825 and ITU-T Rec. G.958 regarding ALS
Optical Supervisory Channel characteristics (SPVM)
Digital signal
Nominal bit rate 4 864 kbit/s (default configuration) => 2Mb for LAPD + 2 Mb
for User
Coding asynchr. scrambled (2
15-1
) + synchronous scrambled (2
7-1
) NRZ
SPV Optical Path
Attenuation range 9 49 dB
Maximum dispersion 4000 ps/nm
Maximum reflectance 27 dB
Minimum ORL of cable plant at S,
including any connector
24 dB

SPV Receiver specification
Sensitivity @ BER = 10
-9
-50 dBm -47 dBm
Overload @ BER = 10
-9
-6 dBm
Maximum receiver reflectance -28 dBm
SPV Transmitter specification
Type of source DFB
Wavelength 151010 nm
Maximum -20 dB width 1 nm
Minimum side mode suppression ratio 33 dB
Optical Output power -1 dBm +4 dBm
Minimum Extinction Ratio 8.2 dB
Clock characteristics
Transponders support 3R regeneration. External clock is not required

Table 8.1 CWDM nominal frequencies allocation plan in C-Band
frequency
(GHz) (Craft
terminal name)
Channel
Number
1471 204,100 1470 6.5
1491 201,300 1490 6.5
1511 198,700 1510 6.5
1531 195,300 1530 6.5
1551 195,500 1550 6.5
1571 191,100 1570 6.5
1591 188,700 1590 6.5
frequency
(GHz) (Craft
terminal name)
Channel
Number
1611 186,300 1610 6.5


Table 8.2 DWDM frequencies allocation plan in C-Band
(GHz) (CT name)
Channel Number Central wavelength (nm)
wavelength deviation : 0,12 nm
(EOL)
BLUE
BAND
192,000 20 1561,42
192,100 21 1560,61
192,200 22 1559,79
192,300 23 1558,98
L2
192,500 25 1557,36
192,600 26 1556,55
192,700 27 1555,75
192,800 28 1554,94

193,000 30 1553,33
193,100 31 1552,52
193,200 32 1551,72
193,300 33 1550,92
L1
193,500 35 1549,32
193,600 36 1548,51
193,700 37 1547,72
193,800 38 1546,92

(GHz) (CT name)
Channel Number Central wavelength (nm)
wavelength deviation : 0,12 nm
(EOL)
RED
BAND
194,200 42 1543,73
194,300 43 1542,94
194,400 44 1542,14
194,500 45 1541,35
S2
194,700 47 1539,77
194,800 48 1538,98
194,900 49 1538,19
195,000 50 1537,40

195,200 52 1535,82
195,300 53 1535,04
195,400 54 1534,25
195,500 55 1533,47
S1
195,700 57 1531,90
195,800 58 1531,12
195,900 59 1530,33
196,000 60 1529,55

Safety requirements and mechanism
Electrical safety
Safety status of the connections with
other equipment
TNV (Telecommunication Network Voltage) for Remote alarms,
Housekeeping (CPO,CPI), Rack lamps (RM) and tributary
connections if K20 protected.
SELV (Safety Extra Low Voltage) for all the other.
Electrical Safety compliance with standardized Norms
Compliancy to Safety Norms is declared in that the equipment satisfies standardized
Norms :
- IEC 60950-1 ed. 2001
- EN 60950-1 ed. 2001
- NEBS Level 3 Bellcore GR-63 and GR-1089
Electrical Safety Labelling
The labels reproduced in Dangerous Electrical Voltages - Labeling are affixed during
factory settings.
Electrical Safety instructions
The safety instructions for proper assembly, maintenance, and safe use including clear
warning concerning precautions to avoid possible exposure to hazardous voltages, are
reported in Safety Rules and more specifically in Dangerous Electrical Voltages.
Optical safety
Optical Safety compliance with European Norms
Compliancy to Optical Safety Norms is declared in that the equipment satisfies
standardized Norms:
- IEC 60825-1: Ed.1.2 (08-2007)
- IEC 60825-2: Ed.3.1 (01-2007)
Hazard Level classification and standards
The HAZARD LEVEL of different ports of the system is widely treated in UNIT
DESCRIPTION of this Technical Handbook (see paragraphs Automatic
shutdown and automatic shutdown for each unit).
HAZARD LEVEL classification:
HAZARD LEVEL 1M, according to IEC 60825-1 (2007) + Am. 2 (2007), IEC 60825-2
(2007) and ITU-T Rec. G.664 standards or
HAZARD LEVEL 1M , according to IEC 60825-1 (2007), IEC 60825-2 (2007)
can be assigned to all ports of the system with the exception of the 4xANY boards,
classified as HAZARD LEVEL 1 laser products.
G.664 standard defines two kinds of optical safety mechanisms :
Automatic Laser Shutdown (ALS) : Procedure to automatically shutdown the output power of
laser transmitters and optical amplifiers to avoid exposure to hazardous levels.
Automatic Power ShutDown (APSD) : Procedure to automatically shutdown the output
power of optical amplifiers to avoid exposure to hazardous levels.
In order to be clearer, in the following paragraphs,
safety procedure for transponders is called ALS
safety procedure for amplifiers is called APSD.
Equipment classification
The 1696MSPAN equipment is classified as hazard level 1M (optical power in the [10
21.3] dBm range).
1696MS_C equipment is also classified as hazard level 1M.
N.B. The classification refers to the IEC 60825-1 and IEC 60825-2 Standards.
The OSC alone is classified as hazard level 1.

Location type
The equipment shall be installed in restricted location (industrial and commercial
premises, optical cable ducts and switching centers).
Optical Safety Labelling
The labeling of the optical sources is compliant with the requirements of the IEC
60825 Standard.
The labels reported below are put during factory settings. The labels are affixed on all
front covers that protect optical connectors located on the front side plate of all the
units involved in optical transmission:
The optical interfaces which have HAZARD LEVEL 1 the following explanatory
label

The following label indicates the presence of a LASER beam. If the laser is a Hazard
Level 1 or 1M product, this label is not compulsory.

Example of EXPLANATORY label.
The optical interfaces which have HAZARD LEVEL 1M according to IEC 60825-1
(2001), IEC 60825-2 (2000) and ITU-T Rec. G.664 standards and operate at 3
rd

window, carry the following explanatory label

The optical interfaces which have HAZARD LEVEL 1M according to IEC 60825-1
(2001), IEC 60825-2 (2000) and ITU-T Rec. G.664 standards and operate at 3
rd

window, carry the following explanatory label

The optical interfaces which have HAZARD LEVEL 3A according to IEC 60825-1
(1998), IEC 60825-2 (2000) and operate at 3
rd
window, carry the following
explanatory label

Engineering design features
In normal operating conditions, unless intentional manumission, the laser radiation is
never accessible.
The laser beam is launched in optical fibre through an opposite connector that totally
shuts up the laser radiation.
In case of cable fibre break, to minimize exposure times, ALS procedure is
implemented depending on the location where the fibre break occurred.
ALS procedures are explained in 5.2.3.9, where shutdown and reactivation times are
also reported.
Optical Safety instructions
The safety instructions for proper assembly, maintenance and safe use including clear
warning concerning precautions to avoid possible exposure to hazardous laser
radiation, are reported on:
the Harmful Optical Signals section in this handbook.
the appropriate parts of the other handbooks envisaged for this equipment (see Optical safety
).

Automatic power shutdown with amplifiers
The APSD procedure for the 1696MS amplifiers is not implemented in current release:
according to the IEC 60825 standard, APSD is not mandatory.
Automatic Laser Shutdown at WDM side (ALS_WDM) with transponders
The ALS procedure is compliant with ITU-T G.664 recommendation.
In the 1696MSPAN the ALS procedure is proposed by the transponder cards (MCC3
and OCC10). The WDM receiver shuts down the WDM transmitter in the opposite
direction when it detects an Input Loss Of Signal (ILOS, i.e.: optical input power
MCC3 and OCC10 is too low) or a loss of clock (LOC) for OCC10.
The shutdown of all the transponders on the affected link is carried within less than 3 s,
as required by the ITU-T Rec. G.664.
It is up to the user to enable or disable the ALS. The default configuration is ALS-
disable.
The possible ALS mode are:
ALS disable with laser ON
ALS disable with laser OFF
ALS disable (default configuration)
ALS enable.
During the ALS procedure, the OSC is still working.
This configuration is done at equipment point of view and can be sent transponder by
transponder or for a set of transponders.
The ALS is implemented in WDM terminal and OADM sites in order to have a safety
mechanism independent from the host systems. During ALS, the optional OSC is still
working.
In case of fiber break, a mechanism is proposed in order to shutdown the transponders
in the previous site, before the fiber break.
In case of regenerators (back-to-back terminals) and OADM, the way of working is the
same. The ALS procedure is done in the section when the fiber failure occurred. The
WDM receiver shutdowns the WDM transmitter in the opposite direction when it
detects a Loss Of Signal (LOS) (MCC3, OCC10) or a Loss Of Clock (LOC) (OCC10).
ALS in non-amplified networks
In point-to-point configuration, ALS is performed in four steps (see Figure 273346. ):
1. ILOS detection at Rx WDM access of an MCC3/OCC10 board of the terminal B
and LOC detection at WDM Tx access B (if in pass-through configuration).
2. ShutDown (SD) command sent to the Tx WDM access of all the terminal B
MCC3/OCC10 boards of the opposite transmission direction.
3. Shutting Down all the Tx WDM access of the terminal B (step (2)), causes an ILOS
detection at Rx WDM access and a LOC detection at WDM Tx access of the
MCC3/OCC10 boards of the terminal A (if in pass-through configuration).
4. ShutDown (SD) command sent to the Tx WDM access of all the MCC3/OCC10
boards of the terminal A.
(1)
(2)
(3)
(4)
T
R
A
N
S
P
O
N
D
E
R
RX
WDM
TX
WDM
ILOS
SD
T
R
A
N
S
P
O
N
D
E
R
TX
WDM
RX
WDM
ILOS
S
D
terminal A terminal B
M
U
X
D
M
U
X
D
M
U
X
M
U
X
SD stands for ShutDown
ILOS stands for Input Loss Of Signal
LOC
LOC
LOC stands for Los Of Clock
(16 or 32 ch.) (16 or 32 ch.)

Figure 346273: ALS mechanism on WDM line in point-to-point configuration

For a circuit with regeneration/pass-through, ALS is performed in eight steps as
described in the following (see Figure 274347. ):
5. ILOS detection at RX WDM access of an MCC3/OCC10 board of the terminal B
and LOC detection at WDM Tx access.
6. ShutDown (SD) command sent to the Tx WDM access of all the MCC3/OCC10
boards of the same transmission direction and ShutDown (SD) command sent to the
Tx WDM access of the opposite transmission direction.
7. ILOS detection at Rx WDM access of all MCC3/OCC10 boards of the 16 ch.
terminal
or LOC detection at Tx B&W.
8. Shutting Down on a Tx WDM access and Tx B&W access of the 16 ch. terminal.
TX
WDM
RX
WDM
M
U
X
D
M
U
X
M
U
X
D
M
U
X
RX
WDM
TX
WDM
TX
WDM
RX
WDM
M
U
X
D
M
U
X
(1)
(2)
(4) ILOS
SD
S
D
LOC
B&W
RX
B&W
TX
pass-trough channels (terminal B)) 16 channels terminal
ILOS (3) (4) SD
pass-trough channels
(2) SD

Figure 347274: ALS in OADM configuration, channel in pass-through or in
add/drop

The ALS mode for pass-through MCC3s/OCC10s must be disabled to insure
reliable automatic restart. Note also that ILOS is propagated through the pass-
through MCCs/OCC10s even if the ALS mode is disable.
ALS and LOS propagation are 2 inpedendant procedures.
The ALS procedure in a ring with OSNC-P, is the same of the previous case (circuit
with regeneration/pass-through) and the SD on the end node generates a (5) protection
switch (see Figure 275348).
M
U
X
D
M
U
X
TX
WDM
RX
WDM
RX
B&W
TX
B&W
M
U
X
D
M
U
X
protection
RX
B&W
TX
B&W
TX
WDM
RX
WDM
SD
SD
ILOS
(4)
(3) (4)
M
U
X
D
M
U
X
TX
WDM
RX
WDM
RX
B&W
TX
B&W
M
U
X
D
M
U
X
RX
B&W
TX
B&W
TX
WDM
RX
WDM
SD
SD
ILOS
M U XD M U X
R
X
W
D
M
T
X
W
D
M
M U X D M U X
T
X
W
D
M
R
X
W
D
M
I
L
O
S
(
1
)
S
D
(
2
)
I
L
O
S
L
O
C
S
D
request
protection
request
(5)
(5)

Figure 348275: ALS procedure in a ring with Optical SNCP, in case of fiber
failure in the ring

ALS in amplified networks
See Figure 276349, Figure 277350, and Figure 278351.
ALS for transponders is supported in amplified networks. On the contrary, APSD is
not supported for amplifiers.
However, in the particular case of point-to-point amplified transmission without
OADM repeater, ALS procedure is enough to provide optical safety thanks to LOS
propagation.
Amplifiers must be in APSD disable state.
TX
WDM
RX
WDM
M
U
X
D
M
U
X
ILOS1
S
D SD1
ILOS
LOC
2 1
ILOS2
SD2
ILOS1
SD1
2 1
ILOS2
SD2
WDM
RX
WDM
M
U
X
D
M
U
X
S
D
ILOS
LOC
TX

Figure 349276: ALS procedure in a point-to-point amplified transmission without
OADM repeater
TX
WDM
RX
WDM
M
U
X
D
M
U
X
ILOS1
S
D SD1
ILOS
LOC
2 1
ILOS2
SD2
ILOS1
SD1
2 1
ILOS2
SD2
WDM
RX
WDM
M
U
X
D
M
U
X
S
D
ILOS
LOC
TX
ILOS1
SD1
2 1
ILOS2
SD2
ILOS1
SD1
2 1
ILOS2
SD2

Figure 350277: ALS mechanism with cascaded pre-amplifier and booster

TX
WDM
RX
WDM
M
U
X
D
M
U
X
ILOS1
S
D SD1
ILOS
LOC
1
2
ILOS2
SD2
WDM
RX
WDM
M
U
X
D
M
U
X
S
D
ILOS
LOC
TX
2
ILOS2
SD2
ILOS1
SD1
1

Figure 351278: ALS mechanism with single pre-amplifier and booster

ALS restart concept
After an ALS occurs, one restart mode is available: Automatic restart. The time values
and the restart way of working in the various restart schemes are described in Figure
279352. The restart way of working is defined at equipment point of view.
As the ALS is done at MCC3/OCC10 unit level, each transponder board will restart
independently.
When OAC are used, the restart procedure is done by the amplifier board.
During the switch on and the switch off time, the channel wavelength remains between

ITU
500 pm.
S t a r t
S e c t i o n i n
o p e r a t i o n
A L S _ W D M e n a b l e
R e c e i v e s i g n a l
f r o m f a r e n d ?
L o s s o f r e c e i v e d s i g n a l
f o r m o r e t h a n 5 0 0 m s ?
A u t o m a t i c P o w e r S h u t D o w n
A u t o m a t i c r e s t a r t
D e l a y t i m e
1 8 0 " 2 0 s
T x o n f o r ( 2 0 " 0 . 5 ) s

Y e s
N o
N o
Y e s

Figure 352279: Restart algorithm

The figures of the ALS timing are compliant with the ITU-T Rec.G.664. The standard
recommends a pulse length of 2s except in the case of amplified network where the
pulse length can be greater ( 6.3 of the standard).

Boards interfaces characteristics
Tributaries optical characteristics
Multirate Channel Card (MCC3) characteristics
Optical interfaces specification, User side
Fiber type
(for details refer to SPF modules optical
characteristics)
9/125 m SMF
50/125 m MMF
62.5/125 m MMF

Connector type LC (on SFP modules)
Wavelength range
characteristics)
1
st
window for FC and GbE-SX
3
rd
window for L-1.2, L-4.2, L-16.2, GbE-ZX
2
nd
window for all the others B&W SFP
3
rd
window for CWDM (1470 -> 1610 nm)
Bit rate, client side

all the bit rates are 3R
100 Mbps : FDDI
132.815 Mbps : FC (12M6-LE-I)
155.520 Mbps : STM-1/OC-3
200 Mbps : ESCON
265.620 Mbps : FC (25M6-LL-I)
270 Mbps : Digital Video
466.560 Mbps : OC-9
531.250 Mbps : FC (50M5-SL-I)
622.080 Mbps : STM-4/OC-12
933.120 Mbps : OC-18
1062.5 Mbps : FICON (*), Fiber
Channel
1244.160 Mbps : OC-24
1866.120 Mbps : OC-36
2125.00 Mbps : 2FC
2488.320 Mbps : STM-16/OC-48
2500 Mbps : INFINIBAND
2666 Mbps : NNI
User interface type
characteristics)
S-1.1, L-1.1, L-1.2
S-4.1, L-4.1, L-4.2
I-16.1, S-16.1, L-16.1, L-16.2
S-16.1 multi-rate multiformat
GbE-SX, GbE-LX, GbE-ZX
FC, 2FC
CWDM (PIN and APD)
Other User interface characteristics (SFPs) refer to SPF modules optical
characteristics

Optical interfaces specification, WDM Side
Common optical interfaces specification, WDM side
Interface type L-16.2
Wavelength specification ITU-T G.694.1, 100 GHz channel spacing
Wavelength tunability tunable over 2 wavelengths
Transmitter wavelength range 1528 -> 1565 nm
Fiber type Single-mode (SMF)
Connector type MU horizontal
Center frequency 19x.y

THz; for details refer to Table 8.2 DWDM
frequencies allocation plan in C-BandTable 8.2
DWDM frequencies allocation plan in C-
BandTable 8.2 DWDM frequencies allocation plan
in C-Band.and DWDM Mux/Demux units (OMDX)
optical characteristics.

Bit rate, WDM side transparent (output bit rate equals input bit rate)


WDM Rx : optical interfaces specification MCC3
-10
(OSNR = 19 dB),
including path penalty
-27 dBm / 0.125 -> 1.125 Gbps rate
-26 dBm / 1.125 -> 2.5 Gbps rate
Overload @ BER = 10
-10
-8 dBm
Maximum optical path penalty (up to 3200
ps/nm)
2 dB
Maximum receiver reflectance -27 dB

WDM Tx : optical interfaces specification MCC3
Dispersion accommodation 3200 ps/nm
Maximum -20 dB width with modulation 0.1 nm
Optical power at board output w/ minimum VOA typ : 5.7 dBm
min : 4 dBm
max : 7.5 dBm
Maximum EOL Center Frequency Deviation 12.3 GHz
N.B. the values are given for EOL characteristics

WaveLength Adapter 1 and 2 (WAL1C and WLA2M) characteristics
Optical interfaces specification, User and WDM sides
The same SFPs can be plugged both on WDM and User sides, thus the following specifications are not
splitted in WDM and User sides (they are available for both).
Fiber type
characteristics)
9/125 m SMF
50/125 m MMF
62.5/125 m MMF

Connector type LC/PC (on SFP modules)
Bit rate (client and WDM sides) all the bit rates are 3R; the bit rate is transparent (WDM
bit rate equal to User bit rate)
155.520 Mbps : STM-1/OC-3
200 Mbps : ESCON
622.080 Mbps : STM-4/OC-12
1062.5 Mbps : FICON, Fiber Channel
1244.160 Mbps : OC-24
2125.00 Mbps : 2FC
2488.320 Mbps : STM-16/OC-48
2666 Mbps : NNI
Wavelength range
characteristics)
1
st
3
rd
2
nd
3
rd
Interface type
characteristics)
S-1.1, L-1.1, L-1.2
S-4.1, L-4.1, L-4.2
I-16.1, S-16.1, L-16.1, L-16.2
FC, 2FC
CWDM interface for long haul (APD detector):
CWA1xx
CWDM interface for short haul (PIN detector):
CWP1xx
Other interfaces characteristics (SFPs) see SPF modules optical characteristics

Wavelength adapter 3 (WLA3CD) characteristics
Fiber type
characteristics)
9/125 m SMF
50/125 m MMF
62.5/125 m MMF

155.520 Mbps : STM-1/OC-3
200 Mbps : ESCON
622.080 Mbps : STM-4/OC-12
1244.160 Mbps : OC-24
2125.00 Mbps : 2FC
2488.320 Mbps : STM-16/OC-48
2666 Mbps : NNI
Wavelength range
characteristics)
1
st
3
rd
2
nd
3
rd
3
rd
window for DWDM (1529.55 -> 1561.42 nm)
Interface type
characteristics)
S-1.1, L-1.1, L-1.2
S-4.1, L-4.1, L-4.2
I-16.1, S-16.1, L-16.1, L-16.2
FC, 2FC
CWA1xx
CWP1xx
DWDM interface for long haul (APD detector):
DWAxxx

Wavelength adapter 3 (WLA3CD) characteristics
Fiber type
characteristics)
9/125 m SMF
50/125 m MMF
62.5/125 m MMF

155.520 Mbps : STM-1/OC-3
200 Mbps : ESCON
622.080 Mbps : STM-4/OC-12
1244.160 Mbps : OC-24
2125.00 Mbps : 2FC
2488.320 Mbps : STM-16/OC-48
2666 Mbps : NNI
Wavelength range
characteristics)
1
st
3
rd
2
nd
3
rd
3
rd
Interface type
characteristics)
S-1.1, L-1.1, L-1.2
S-4.1, L-4.1, L-4.2
I-16.1, S-16.1, L-16.1, L-16.2
FC, 2FC
CWA1xx
CWP1xx
DWAxxx

Wavelength adapter 2 with O-SNCP (WLA2M_OP) characteristics
splitted in WDM and User sides (they are available for both). The only difference is the optical
coupler/splitter: it is available only on User side (client protection)
Fiber type
characteristics)
9/125 m SMF
50/125 m MMF
62.5/125 m MMF

Bit rate (client and WDM sides) all the bit rates are 3R; the bit rate is transparent
(WDM bit rate equal to User bit rate)
155.520 Mbps : STM-1/OC-3
200 Mbps : ESCON
622.080 Mbps : STM-4/OC-12
1062.5 Mbps : FICON, Fiber
Channel
1244.160 Mbps : OC-24
2125.00 Mbps : 2FC
2488.320 Mbps : STM-16/OC-48
2666 Mbps : NNI
Wavelength range
characteristics)
1
st
3
rd
2
nd
3
rd
Interface type
characteristics)
S-1.1, L-1.1, L-1.2
S-4.1, L-4.1, L-4.2
I-16.1, S-16.1, L-16.1, L-16.2
FC, 2FC
CWA1xx
CWP1xx
Coupler/Splitter insertion loss (User side only) 4 dB
Other Interfaces characteristics (SFPs) see SPF modules optical characteristics

Wavelength adapter 3 with O-SNCP (WLA3CDOP) characteristics
splitted in WDM and User sides (they are available for both). The only difference is the optical
coupler/splitter: it is available only on User side (client protection)
Fiber type
characteristics)
9/125 m SMF
50/125 m MMF
62.5/125 m MMF

155.520 Mbps : STM-1/OC-3
200 Mbps : ESCON
622.080 Mbps : STM-4/OC-12
1244.160 Mbps : OC-24
2125.00 Mbps : 2FC
2488.320 Mbps : STM-16/OC-48
2666 Mbps : NNI
Wavelength range
characteristics)
1
st
3
rd
2
nd
3
rd
3
rd
Interface type
S-1.1, L-1.1, L-1.2
S-4.1, L-4.1, L-4.2
characteristics) I-16.1, S-16.1, L-16.1, L-16.2
FC, 2FC
CWA1xx
CWP1xx
DWAxxx
Coupler/Splitter insertion loss (User side only) 4 dB

10 Gbps Optical Channel Card Enhanced (OCC10_E) characteristics
Common optical interfaces specification
Fiber type 9/125 m SMF
50/125 m MMF
62.5/125 m MMF

Connector type LC/PC (on XFP modules)

Bit rate, client side all the bit rates are 3R
9.95328 Gbps : STM-64/OC-192, 10GbE
WAN
10.3125 Gbps : 10 GbE LAN
10.709 Gbps : NNI (future rel.)
Wavelength range
(for details refer to XFP modules optical
characteristics)
1
st
window for X10GBASES
2
nd
window for XI641
3
rd
window for XS642
User interface type
characteristics )
10GBASE-S
I-64.1 / 10GBASE-L
S-64.2b / 10GBASE-E

Other User interface characteristics (XFPs) see XFP modules optical characteristics

Optical interfaces specification, WDM side
WDM interface type L-64.2; DWDM interface for long haul (APD
detector)
Wavelength specification ITU-T G.694.1, 100 GHz channel spacing.
The board is tunable over 1 wavelength
Wavelength range 3
rd
window (1528 -> 1565 nm)
Center frequency 19x.y

THz; for details refer to Table 8.2 DWDM
DWDM frequencies allocation plan in C-BandTable
8.2 DWDM frequencies allocation plan in C-Band.
Bit rate 9.95328 Gbps
10.709 Gbps
11.096 Gbps (10 GbE LAN + FEC)

WDM Rx : optical interfaces specification (board input)
Type of Receiver APD
Maximum average optical input power -6 dBm
Sensitivity including path penalty and for
BER = 10
-12
) and overload:
with optical noise
without optical noise

-19 dBm to - 9 dBm
-23 dBm to -5 dBm

VOA dynamic range 20 dB
Max. receiver reflectance -27 dB


WDM Tx : optical interfaces specification (board output)
NDC configuration NDC0 NDC1
Max. EOL center frequency deviation ?100 pm
Dispersion
No OSNR margin
2 dB OSNR margin

0 -> +1300ps/nm
0 -> +1600ps/nm

-500 -> +800ps/nm
Max. -20 dB width 0.5 nm
Pout (VOA at min.) -4.0 -> +7.0 dBm -2.5 -> +7.0 dBm
VOA dynamic range (configurable) 20 dB step 1
Minimum Extintion Ratio 8.2 dB
(*) Contact Alcatel-Lucent for design with negative chromatic dispersion
10 Gbps Optical Channel Card (OCC10_EC) characteristics
50/125 m MMF
62.5/125 m MMF


9.95328 Gbps : STM-64/OC-192, 10GbE WAN
10.709 Gbps : NNI (future rel.)
Wavelength range
characteristics )
1
st
window for 10GBASES
2
nd
window for XI641
3
rd
window for XS642
User interface type
characteristics )
10GBASE-S
I-64.1 / 10GBASE-L
S-64.2b / 10GBASE-E


WDM interface type L-64.2; CWDM interface for long haul (APD
detector), up to 80 Km reach
Wavelength specification ITU-T G.694.2, 20 nm channel spacing.
The board is tunable over 1 wavelength
Transmitter wavelengths 1531nm, 1551nm, 1571nm, 1591nm, 1610nm
Center frequency for details refer to Table 8.1 CWDM nominal
CWDM nominal frequencies allocation plan in C-
BandTable 8.1 CWDM nominal frequencies
allocation plan in C-BandTable 8.1 CWDM nominal
frequencies allocation plan in C-Band
Bit rate, WDM side 9.95328 Gbps
10.709 Gbps
11.096 Gbps (10 GbE LAN + FEC)
Fiber type Single-mode (SMF)


WDM Rx : optical interfaces specification (board input)
Type of Receiver APD
Maximum average optical input power -6 dBm
Sensitivity (including path penalty and for
BER = 10
-12
) and overload:
-23 dBm to -6 dBm (no optical noise)
Maximum receiver reflectance -27 dB

WDM Tx : optical interfaces specification (board output)
Optical Output power (VOA at min) -3.0 -> +7.0 dBm
Max EOL center frequency deviation $6.5 nm
Dispersion 0 to ->1600ps/nm
Maximum -20 dB width 0.5 nm

2xGE_FC optical characteristics
Optical interfaces specification
Common specification, for both User and WDM sides
50/125 m MMF
62.5/125 m MMF


Optical interface specification, User side
Bit rate, client side All the bit rates are 3R
1062.5 Mbps : Fiber Channel, FICON
Interface type
characteristics)
CWA1xx
CWP1xx
DWAxxx
Wavelength range
characteristics)
1
st
window for GbE-SX
2
nd
window for GbE-LX
3
rd
window for GbE-ZX
3
rd
3
rd

Optical interface specification, Line side
Bit rate, Line side all the bit rates are 3R
2488.320 Mbps : STM-16/OC-48
Interface type
characteristics)
I-16.1, S-16.1
CWA1xx
CWP1xx
DWAxxx
Wavelength range
characteristics)
2
nd
window for I-16.1 and S-16.1
3
rd
3
rd

8xGE optical characteristics
Common specification, for both User and WDM sides
50/125 m MMF
62.5/125 m MMF

Connector type LC/PC (on SFP and XFP modules)

Optical interface specification, User side
User Interface type (according to the XFP
module plugged on user side)
CWA1xx
CWP1xx
Wavelength range
characteristics)
1
st
window for GbE-SX
2
nd
window for GbE-LX
3
rd
window for GbE-ZX
3
rd

Bit rate, Line side 9.9532 Gbps : 10GbE WAN

Line interface type (according to the XFP
module plugged on line side)
ITU-T G.691 I-64.1
ITU-T G.693 VSR 2000
ITU-T G.691 S-64.2b
IEE 802.3 10GBASE-SR, 10GBASE-SW
IEE 802.3 10GBASE-LR, 10GBASE-LW
IEE 802.3 10GBASE-ER, 10GBASE-EW
DWDM interface for long haul (APD detector)
Wavelength range 1
st
window for 10GBASE-S
2
nd
window for I-64.1 and 10GBASE-L
3
rd
window for S-64.2b and 10GBASE-E
3
rd
Refer to XFP modules optical characteristics for
XFP details
Other Interface characteristics (XFPs) Refer to XFP modules optical characteristics

TRBD1996 optical characteristics

50/125 m MMF
62.5/125 m MMF


9.95328 Gbps : STM-64/OC-192, 10GbE
WAN

Wavelength range
characteristics)
1
st
window for X10GBASES
2
nd
window for XI641
3
rd
window for XS642
User interface type
characteristics )
10GBASE-S
I-64.1 / 10GBASE-L
S-64.2b / 10GBASE-E


Bit rate, Line side 9.9532 Gbps : 10GbE WAN
Line interface type (according to the XFP
module plugged on line side)
ITU-T G.691 I-64.1
ITU-T G.693 VSR 2000
ITU-T G.691 S-64.2b
IEE 802.3 10GBASE-SR, 10GBASE-SW
IEE 802.3 10GBASE-LR, 10GBASE-LW
IEE 802.3 10GBASE-ER, 10GBASE-EW
DWDM interface for long haul (APD detector)
Wavelength range 1
st
window for 10GBASE-S
2
nd
window for I-64.1 and 10GBASE-L
3
rd
window for S-64.2b and 10GBASE-E
3
rd
Refer to XFP modules optical characteristics for
XFP details
Other Interface characteristics (XFPs) Refer to XFP modules optical characteristics


4xANY_P TDM Concentrator characteristics
Drawers Rx : 1310 nm optical interfaces specification
Drawer Rx : common 1310 nm optical interfaces specification
Fiber type Multi-mode 62.5 / 125 m (MMF)
Optical connector type LC

Drawer Rx : Low Frequency 1310 nm cartridge specification (Rx)
Data rate 125 Mbps ($100ppm) : Fast Ethernet, FDDI
200 Mbps ($100ppm) : ESCON
270 Mbps ($100ppm) : Digital Video
Operating wavelength 1270 -> 1380 nm
-10
28 dBm
Overload @ BER = 10
-10
8 dBm
Maximum optical path penalty NA
Maximum receiver reflectance 12.5 dB

Drawer Rx : STM-1, STM-4 1310 nm cartridge specification (Rx)
Data rate 155.520 Mbps ($20ppm) : STM-1
622.080 Mbps ($20ppm) : STM-4

Drawer Rx : STM-1, STM-4 1310 nm cartridge specification (Rx)
-10
28 dBm
Overload @ BER = 10
-10
8 dBm
Maximum receiver reflectance -

Drawer Rx : High Frequency 1310 nm cartridge specification (Rx)
Data rate 1025 Gbps ($100ppm) : Gigabit Ethernet
1062.5 Gbps ($100ppm) : FICON, Fiber Channel
-10
20 dBm
Overload @ BER = 10
-10
3 dBm
Maximum receiver reflectance 12 dB


Drawers Tx : 1310 nm optical interfaces specification
Drawer Tx : common 1310 nm optical interfaces specification
Fiber type Single-mode 9 / 125 m (SMF)
Laser type Class 1 Laser Safety

Drawer Tx : Low Frequency 1310 nm cartridge specification
Central wavelength 1270 -> 1356 nm
Maximum RMS width 2.5 nm
Minimum side mode suppression ratio NA dB
Optical Output power min : -15 dBm
max : -8 dBm
Shutdown time < 5 ms
Re-activation time < 30 ms

Drawer Tx : STM-1, STM-4 1310 nm cartridge specification
Data rate 155.520 Mbps ($20ppm) : STM-1
622.080 Mbps ($20ppm) : STM-4

Drawer Tx : STM-1, STM-4 1310 nm cartridge specification
Maximum RMS width 2.5 nm
max : -8 dBm

Drawer Tx : High Frequency 1310 nm cartridge specification
Maximum RMS width 4 nm
max : -3 dBm
Minimum Extinction Ratio 9 dB

Drawer Rx : common 850 nm optical interfaces specification

Drawer Rx : Low Frequency 850 nm cartridge specification
Operating wavelength 770 B 860 nm
-10
17 dBm
Overload @ BER = 10
-10
0 dBm

Drawer Rx : High Frequency 850 nm cartridge specification
-10
17 dBm
Overload @ BER = 10
-10
0 dBm


Drawer Tx : common 850 nm optical interfaces specification
Laser type Class 1 Laser Safety

Drawer Tx : Low Frequency 850 nm cartridge specification
Minimum side mode suppression ratio NA
Optical Output power min : -9.5 dBm
max : -1.5 dBm
Shutdown time < 0.5 ms

Minimum side mode suppression ratio NA
Optical Output power min : -9.5 dBm
max : -1.5 dBm
Shutdown time < 0.5 ms

4XANY Digital Video electrical drawer interfaces specification
Common electrical interfaces specification
Connector type BNC
Bit rate 270 Mbps

Drawer Rx : electrical cartridge specification
Terminating impedance (RL > 15 dB) 75 OHMs
Maximum path 40 dB
Interference rejection d.c. : 2.5V
below 1KHz : 2.5V
1 KHz to 5 MHz : 0.1V
above 5 MHz : 0.04V


Drawer Tx : electrical cartridge specification
Output impedance (RL > 15 dB) 75 OHMs
Signal amplitude (peak-to-peak) 800 mV ? 10%
d.c. offset ? 0.5 V
Rise and fall times (between 20% and 80%) 0.75 -> 1.25 ns
The Digital Video cartridge is a Low Frequency drawer dedicated to the Digital Video
signal. It is used as the other Low Frequency drawers.
This drawer is equipped with a BNC socket in place of the SFF optics in the other
(optical) version.
This is the only difference with the other optical low frequency drawers.
All the 4xANY features provided by the other drivers are supported.
2.5 Gbps optical interfaces specification, aggregate side (4 x ANY_P)
Fiber type
characteristics)
9/125 m SMF
Connector type LC/PC (on SFP module)
Wavelength range
characteristics)
2
nd
window for I-16.1 and S-16.1
3
rd
3
rd
Bit rate, WDM (Line) side 2488.320 Mbps : STM-16/OC-48
Interface type
characteristics)
I-16.1, S-16.1
CWA1xx
CWP1xx
DWAxxx
2.5 Gbps optical interfaces specification, aggregate side (4 x ANY_P)
SPF modules optical characteristics
B&W SFP modules optical characteristics
SFP PARAMETER STM-1 (S-1.1, FE,
FDDI, 100BaseLX)
STM-1 L-1.1 STM-1 L-1.2
Addressed wavelength (nm) 1261 -> 1360 1270 -> 1360 1480 -> 1580
Min. launched power (dBm) -15 -5 -5
Max launched power (dBm) -8 0 0
Allowed bitrates 100->155.52Mbps 2.048->155.52Mbps 155.52 Mbps
Min. extinction ratio (dB) 8.2 10 10
Spectral
width
Max. -20dB bandwidth
(nm)
NA 1 nb1 1
Max. RMS width (nm) 7.7 3 nb2 NA
Minimum SMSR (dB) NA 30 if SLM laser 30
Max chromatic disp. (ps/nm) -100 -> +100 -250 -> +250 1900
Minimum sensitivity (dBm), @
BER=1E
-10
-28 -34 -34
Minimum overload (dBm) -8 -10 -10
Max optic. path penalty (dB) 1 1 1
Max receiver reflect. (dB) -14 -14 -25
Optical connector (Tx/Rx) LC LC LC
Fiber type SMF SMF SMF
Acronym / Interface type S-1.1 / S-1.1 L-1.1 / L-1.1 L-1.2 / L-1.12
nb1: if SLM LASER
nb2: if MLM LASER

SFP PARAMETER STM-4 S-4.1 STM-4 L-4.1 STM-4 L-4.2
Min. launched power (dBm) -15 -3 -3
Max launched power (dBm) -8 +2 +2
Allowed bitrates 622.080 Mbps 622.080 Mbps 622.080 Mbps
Min. extinction ratio (dB) 8.2 10 10
Spectral
width
(nm)
NA 1 1
Max. RMS width (nm) 2.5 NA NA
Minimum SMSR (dB) NA 30 30
Max chromatic disp. (ps/nm) -100 -> +100 -250 -> +250 1900
Minimum sensitivity (dBm), @
BER=1E
-10
-28 -28 -28
Minimum overload (dBm) -8 -8 -8
Max optic. path penalty (dB) 1 1 1
Fiber type SMF SMF SMF
Acronym / Interface type S-4.1 / S-4.1 L-4.1 / L-4.1 L-4.2 / L-4.2

SFP PARAMETER STM-16 I-16.1 STM-16 S-16.1
Addressed wavelength (nm) 1270 -> 1360 1270 -> 1360
Min. launched power (dBm) -10 -5
Max launched power (dBm) -3 0
Allowed bitrates 2.48832 Gbps 2.48832 Gbps
Min. extinction ratio (dB) 8.2 8.2
SFP PARAMETER STM-16 I-16.1 STM-16 S-16.1
Spectral
width
(nm)
NA 1
Max. RMS width (nm) 4 NA
Minimum SMSR (dB) NA 30
Max chromatic disp. (ps/nm) -12 -> +12 -100 -> +100
Minimum sensitivity (dBm), @ BER=1E
-
10
-18 -18
Minimum overload (dBm) -3 0
Max optic. path penalty (dB) 1 1
Max receiver reflect. (dB) -27 -27
Optical connector (Tx/Rx) LC LC
Fiber type SMF SMF
Acronym / Interface type I-16.1 / I-16.1 S-16.1 / S-16.1

SFP PARAMETER STM-16 L-16.1 STM-16 L-16.2
Max launched power (dBm) +2 +2
Allowed bitrates 2488.320 Mbps 2488.320 Mbps
Spectral
width
(nm)
1 1
Max. RMS width (nm) NA NA
Minimum SMSR (dB) 30 30
Max chromatic disp. (ps/nm) -250 -> +250 1600

SFP PARAMETER STM-16 L-16.1 STM-16 L-16.2
-
10
-27 -28
Minimum overload (dBm) -8 -8
Fiber type SMF SMF
Acronym / Interface type L-16.1 / L-16.1 L-16.2 / L-16.2

SFP PARAMETER STM-16 SFP S-16.1
multirate multiformat W/DDM
Addressed wavelength (nm) 1290 -> 1330
Min. launched power (dBm) -5
Max launched power (dBm) 0
Allowed bitrates 100 Mbps -> 2.7 Gbps
Min. extinction ratio (dB) for bit rates > 2.125Gbps = 8.2
for bit rates < 2.125Gbps = 9
Spectral
width
(nm)
1
Max. RMS width (nm) NA
Minimum SMSR (dB) 30
Max chromatic disp. (ps/nm) -100 -> +100
-
10
, for all bit rates and patterns
-18
Minimum overload (dBm) 0
Max optic. path penalty (dB) 1
SFP PARAMETER STM-16 SFP S-16.1
multirate multiformat W/DDM
Max receiver reflect. (dB) -27
Optical connector (Tx/Rx) LC
Fiber type SMF
Acronym / Interface type S-16-AnyDDM / S-16-1 multirate multiformat

SFP PARAMETER FE/FDDI SFP 100 Base LX 2Mbp SPV SFP
(1AB 20986 0001)
Max launched power (dBm) -8 +3
Allowed bitrates 125 Mbps 2.048 Mbps
Min. extinction ratio (dB) 5 8.2
Spectral
width
Max. -20dB bandwidth (nm) NA 1
Max. RMS width (nm) 7.7 2
Minimum SMSR (dB) NA 30
Max chromatic disp. (ps/nm) NA -
-12
-26 -40
Minimum overload (dBm) -8 -10
Max optic. path penalty (dB) NA -
Fiber type SMF SMF
Acronym / Interface type 100B LX / 100BASE-L 2M / 2Mbps Supervisory


SFP PARAMETER 1.25GbE GbE1000SX 1.25GbE
GbE1000LX/LH (10)
1.25GbE
GbE1000ZX
Min. launched power (dBm) -9.5 -9.5 0
Max launched power (dBm) -4 -4 +5
Allowed bitrates 1.25 Gbps 1.25 Gbps 1.25 Gbps
Min. extinction ratio (dB) 9 9 9
Spectral
width
Max. -20dB bandwidth (nm) NA NA 1
Max. RMS width (nm) 0.85 0.85 NA
Minimum SMSR (dB) NA NA 30
Max chromatic disp. (ps/nm) - - 1200
Min. sensitivity (dBm), @ BER=1E
-12
-17 -17 -24
Minimum overload (dBm) 0 0 0
Max optic. path penalty (dB) - - 2
Fiber type 50/125m MMF-550m
62.5/125m MMF-
275m
10Km 9/125 m SMF
50/125m MMF-550m
62.5/125m MMF-
550m
10Km 9/125
m SMF
Acronym / Interface type 1GbESX / 1000BASE-S 1GbESX / 1000BASE-
S
1GbEZX /
1000BASE-Z


SFP PARAMETER SFP 1FC, 2FC 850 nm SFP 1FC, 2FC 1310 nm
Addressed wavelength (nm) 830 ->-860 1265 -> 1370
Min. launched power (dBm) -10 -9.5
Max launched power (dBm) -3 -3
Allowed bitrates 1.0625 Gbps; 2.125 Gbps
Min. extinction ratio (dB) 9 9
Spectral
width
(nm)
NA NA
Max. RMS width (nm) 0.85 see 1
Minimum SMSR (dB) NA NA
Max chromatic disp. (ps/nm) - -
Minimum sensitivity (dBm) with fiber,
@ BER=1E
-12
1.0625 Gbps = -17
2.125 Gbps = -15
-20
Minimum overload (dBm) 0 -3
Max optic. path penalty (dB) - -
Fiber type MMF SMF
Acronym / Interface type FC/2FCmm / FC/2FCmm FC/2FCsm / FC/2FCsm
1. See figure 18 and figure 19 of the Physical interfaces FC-PI-2 Rev. 30, 2002 (FC/2FC standard)

WDM SFP modules optical characteristics
SFP PARAMETER APD CWDM PIN CWDM
Addressed wavelength (nm) 1470, 1490, 1510, 1530, 1550, 1570, 1590, 1610,
compliant with ITU-T G.694.2
Min. launched power (dBm) 0 0
Max launched power (dBm) 5 5
Max. -20dB bandwidth (nm) 1 1
Max chromatic disp. (ps/nm) 1600 @ 1610nm, 1590nm
1500 @ 1570nm
1400 @ 1550nm, 1530nm
1300 @ 1510nm
1200 @ 1490nm
1100 @ 1470nm
1000 @ 1610nm
900 @ 1590nm, 1570nm, 1550nm
800 @ 1530nm, 1510nm
700 @ 1490nm, 1470nm
Minimum sensitivity (dBm),
@ BER=1E
-12
-28 -18
Minimum overload (dBm) -9 0
Fiber type SMF SMF
Acronym / Interface type CWA147->CWA161 / APD -
CWDM interface for long haul
(C8L1-1D2)
CWP147 -> CWP161 / PIN - CWDM
interface for short haul (C8S1-1D2)

SFP PARAMETER APD DWDM
Addressed wavelength (nm) 1527,99 to 1563,86 nm
Min. launched power (dBm) 0
Max launched power (dBm) 4
Maximum wavelength deviation EOL (pm) $100
Min. extinction ratio (dB) 8.2
Max. -15dB bandwidth (nm) 0.12
Max chromatic disp. (ps/nm) 1800 / 2400 (Note 1)
-10
-28
Minimum overload (dBm) -8
Max optic. path penalty (dB) 2 / 3 depending on dispersion (Note 1)
Fiber type SMF
Acronym / Interface type DWA200 -> DWA600 / APD DWDM
Note 1 : 2 dB path penalty corresponds to a dispersion of 1800 ps/nm/km, 3 dB to
2400 ps/nm/km.

XFP modules optical characteristics
B&W XFP modules optical characteristics
PARAMETER 10GbE Base S
Addressed wavelength (nm) 840 -> 860
Min. launched power (dBm) -7.3
Max launched power (dBm) -1.0
Allowed bitrates 9.95328Gbps; 10.3125 Gbps
Spectral width: max. -20dB bandwidth
(nm)
See IEEE 802.3ae Triple Tradeoff
Curves (TTC)
Minimum sensitivity with fibre (dBm), @
BER=1E
-12
-9.9
Stressed sensitivity (dBm) -7.5
Minimum overload (dBm) -1.0
Fiber type MMF
Acronym / Interface type X10GBASES / 10GBASE-S

PARAMETER I-64.1/10GbE Base L S-642b/10GbE Base E
Min. launched power (dBm) -6.0 -1.0
Max launched power (dBm) -1.0 +2.0
Allowed bitrates 9.95328Gbps; 10.3125 Gbps; 10.709 Gbps
PARAMETER I-64.1/10GbE Base L S-642b/10GbE Base E
Spectral width: max. -20dB bandwidth
(nm)
1.0 0.25
Max chromatic disp. (ps/nm) 60 800
-12
-11 -14
Minimum overload (dBm) 0.5 -1.0
Max optic. path penalty (dB) 1.0 2.0
Fiber type SMF SMF
Acronym / Interface type XI641 / I-
64.1/10GBASE-L
XS642 / S-64.2b/10GBASE-E

WDM XFP modules optical characteristics
XFP module type APD DWDM
Addressed wavelength (nm) 1529.55nm (196.00 THz) to 1561.42 nm (192.00
THz) 100 GHz grid, compliant with ITU-T
G.694.1
Min. launched power (dBm) -2.0
Max launched power (dBm) +3.0
Max wavelength dev iation EOL (pm) $100
Allowed bitrates (Gbps) 9.95328; 10.3125; 10.709; 11.095728
Spectral width: max. -15dB bandwidth (GHz) $8

XFP module type APD DWDM
Max chromatic disp. (ps/nm) 1600
Minimum sensitivity @ BER=1E
-4

w/o ASE noise (dBm)
-25 @ 1300ps/nm
-23 @ 1600ps/nm
OSNR, @ BER=1E
-4
(dB/0.1nm) 17 @ 1300ps/nm
19 @ 1600ps/nm
Minimum sensitivity @ BER=1E
-12

up to10.3125 Gbps (dBm)
-22 @ 1300ps/nm
Minimum OSNR, @ BER=1E
-12
(dB/0.1nm)
up to10.3125 Gbps (dB/0.1nm)
25 @ 1600ps/nm
Minimum overload (dBm) -8.0
Max receiver reflect. (dB) 27
Fiber type SMF
Acronym / Interface type XL-642C / APD DWDM

Multiple Variable Attenuator Cards (MVAC) optical characteristics
Multiple Variable Attenuator Card (MVAC) optical characteristics
MVAC optical interfaces specification
Optical ports 2
Fiber type Single mode (SMF)
Optical connector type MU horizontal
Wavelength range 1528 -> 1610 nm
Insertion losses (IL) 3 dB
Attenuation dynamic range including IL
(on each VOA input)
3 -> 20 dB ; step = 0.5 dB
MVAC optical interfaces specification
Attenuation accuracy 0.5 dB
Response time < 5 ms
Output measurement -50 -> +17 dBm
Optical ports levels
Optical input power (on both In1 & In2 inputs) -32 -> +17 dBm
Optical output power (on both Out1 & Out2
outputs)
-52 -> +17 dBm

Multiple Variable Attenuator Card (MVAC10) optical characteristics
MVAC10 optical interfaces specification
Optical ports 10
Wavelength range 1528 -> 1610 nm
Insertion losses (IL) 3 dB
Attenuation dynamic range including IL
(on each VOA input)
3 -> 20 dB ; step = 0.5 dB
Attenuation accuracy 0.5 dB
Response time < 5 ms
Output measurement -32 -> +17 dBm
Optical ports levels
Optical input power (on all inputs) -32 -> +17 dBm
Optical output power (on all outputs) -38 -> +17 dBm

DWDM Mux/Demux units (OMDX) optical characteristics
L1 band Mux/Demux with expansion + supervision (OMDX8100_M_L1_XS) and
with expansion (OMDX8100_M_L1_X)
OMDX8100_M_L1_XS optical characteristics
MUX side specification OMDX8100_M_L1_XS OMDX8100_M_L1_X
Input power:
single channels
extra-input
expansion input
supervision input

- 32 -> +17 dBm
- 32 -> +17 dBm
- 32 -> +17 dBm
- 1 -> +1 dBm

- 32 -> +17 dBm
- 32 -> +17 dBm
- 32 -> +17 dBm
-

Insertion loss (max.)
single channels
extra-input
expansion
supervision

5.35 dB
3.1 dB
1.7 dB
15 dB

4.95 dB
2.7 dB
1.3 dB
-
Isolation (adjacent channels) - min 15 dB 15 dB
Output power - 32 -> +17 dBm - 32 -> +17 dBm
Monitoring Output Typically 18 dB below the associated optical power
level measurement

DEMUX side specification OMDX8100_M_L1_XS OMDX8100_M_L1_X
Input power - 32 -> +17 dBm - 32 -> +17 dBm
Monitoring Input Typically 18 dB below the associated optical power
level measurement
single channels

5.55 dB

4.95 dB
DEMUX side specification OMDX8100_M_L1_XS OMDX8100_M_L1_X
extra-output
expansion
supervision
3.3 dB
1.9 dB
2.5 dB
2.7 dB
1.3 dB
2.5 dB
Output power
single channels
extra-output
expansion output
supervision output

- 32 -> +17 dBm
- 32 -> +17 dBm
- 32 -> +17 dBm
- 53 -> -14 dBm

- 32 -> +17 dBm
- 32 -> +17 dBm
- 32 -> +17 dBm
-
Isolation (adjacent channels) - min 22 dB 22 dB
Isolation (non adjacent channels), min 30 dB 35 dB

General characteristics OMDX8100_M_L1_XS OMDX8100_M_L1_X
L1 band channels 30; 31; 32; 33; 35; 36; 37; 38
L1 band channels central wavelenght 1553.33 nm (ch 30); 1552.52 nm (ch 31);
1551.72 nm (ch 32); 1550.92 nm (ch 33);
1549.32 nm (ch 35); 1548.51 nm (ch 36);
1547.72 nm (ch 37);1546.92 nm (ch 38)
channel bandwidth at -0.5 dB 0.11 nm 0.25 nm
channel bandwidth at -3 dB 0.15 nm 0.3 nm
end-to-end IL (max) 9.7 dB 8.7 dB
Isolation (LB vs SB) - min 15 dB 15 dB
PMD 0.15 ps 0.15 ps
PDL 0.25 dB 0.25 dB
connector type MU horizontal MU horizontal

General characteristics OMDX8100_M_L1_XS OMDX8100_M_L1_X

L2 and S1 band Mux/Demux
OMDX8100_M_L2 and OMDX8100_M_S1 optical characteristics
MUX side specification
Input power:
- single channels
- extra-input

- 32 -> +17 dBm
- 32 -> +17 dBm
- single channels
- extra-input

3.75 dB
1.5 dB
Output power - 32 -> +17 dBm

DEMUX side specification
Input power - 32 -> +17 dBm
- single channels
- extra-output

3.75 dB
1.5 dB
Output power
- single channels
- extra-output

- 32 -> +17 dBm
- 32 -> +17 dBm

General characteristics
L2 band channels and central wavelenght 1561.42 nm (ch 20); 1560.61 nm (ch 21);
1559.79 nm (ch 22); 1558.98 nm (ch 23);
1557.36 nm (ch 25); 1556.55 nm (ch 26);
1555.75 nm (ch 27);1554.94 nm (ch 28)
S1 band channels and central wavelenght 1535.82 nm (ch 52); 1535.04 nm (ch 53);
1534.25 nm (ch 54); 1533.47 nm (ch 55);
1531.90 nm (ch 57); 1531.12 nm (ch 58);
1530.33 nm (ch 59);1529.55 nm (ch 60)
channel bandwidth at -0.5 dB 0.11 nm
channel bandwidth at -3 dB 0.15 nm
end-to-end IL (global) (max) 6.3 dB
rejection of dropped channels extra-port (min) 12 dB
PMD 0.15 ps
PDL 0.25 dB
connector type MU horizontal
S2 band Mux/Demux
OMDX8100_M_S2 optical characteristics
Input power:
single channels
extra-input

- 32 -> +17 dBm
- 32 -> +17 dBm

single channels
extra-input

3.75 dB
1.5 dB


single channels
extra-output

3.75 dB
1.5 dB

Output power
single channels
extra-output

- 32 -> +17 dBm
- 32 -> +17 dBm

S2 band channels 42; 43; 44; 45; 47; 48; 49; 50
S2 band channels central wavelenght 1543.73 nm (ch 42); 1542.94 nm (ch 43);
1542.14 nm (ch 44); 1541.35 nm (ch 45);
1539.77 nm (ch 47); 1538.98 nm (ch 48);
1538.19 nm (ch 49);1537.40 nm (ch 50)
channel bandwidth at -0.5 dB 0.11 nm
channel bandwidth at -3 dB 0.15 nm
end-to-end IL (w/OMDX8100_M_L1_XS) (max) 6.3 dB
rejection of dropped channels extra-port (min) 12 dB
PMD 0.15 ps
PDL 0.25 dB

8-channel CWDM Mux/Demux optical characteristics: CMDX-U(-S), CMDX2-U(-S)
CMDX optical characteristics
General characteristics CMDX-U, CMDX2-U CMDX-U-S, CMDX2-U-S
Fiber 9/125 m SMF
Isolation (adjacent channels) - min 30 dB
Isolation (non adjacent channels) - min 40 dB
end-to-end IL (max) 5.7 dB 4.7 dB
PDL 0.25 dB

MUX side specification CMDX-U, CMDX2-U CMDX-U-S, CMDX2-U-S
Input power:
single channels (CH n)
OSC/SPV channel (SPV Tx IN) -
ADD

tbd dBm
NA

tbd dBm
tbd dBm
Insertion loss (max.):
single channels (CHn IN->Line Tx
OUT)
OSC/SPV channel (SPV Tx IN-
>Line Tx OUT) - ADD

3.0 dB
NA

3.5 dB
1.0 dB
Channel passband at -0.5 dB (includes channel
centre wavelength in -6 -> +8 range)
14 dB

DEMUX side specification CMDX-U, CMDX2-U CMDX-U-S, CMDX2-U-S
Input power tbd dBm tbd dBm

DEMUX side specification CMDX-U, CMDX2-U CMDX-U-S, CMDX2-U-S
single channels (Line Rx IN->CHn
OUT)
OSC/SPV channel (Line Rx IN-
>SPV Rx OUT) - DROP

2.9 dB
NA

4 dB
1.5 dB
14 dB
C/DWDM Mux/Demux units (CDMDX2-U and CDMDX2-U-S) optical characteristics
CDMDX2 and CDMDX2_S optical characteristics
General characteristics CDMDX2-U CDMDX2-U-S
Fiber 9/125 m SMF
Isolation (adjacent channels) - min tbd dB
Isolation (non adjacent channels) - min tbd dB
end-to-end IL (max) tbd dB tbd dB
PDL tbd dB

MUX side specification CDMDX2-U CDMDX2-U-S
Input power:
single channels (CHn)
Extra band (Extra band IN)
OSC/SPV channel (SPV Tx IN) - CH
ADD

tbd dBm
tbd dBm
NA

tbd dBm
tbd dBm
tbd dBm
single channels (CHn IN->Line Tx

MUX side specification CDMDX2-U CDMDX2-U-S
OUT)
Extra band (Extra band IN->Line Tx
OUT)
>Line Tx OUT) ADD
tbd dB
tbd dB
NA
tbd dB
tbd dB
tbd dB
tbd dB

DEMUX side specification CDMDX2-U CDMDX2-U-S
Input power (Line Rx IN) tbd dBm tbd dBm
OUT)
Extra band (Line Rx IN->Extra band
OUT)
>SPV Rx OUT) DROP

tbd dB
tbd dB
NA

tbd dB
tbd dB
tbd dB
tbd dB
DWDM OADM units optical characteristics
8-channel OADM with supervision
OADM8100_M_L1(L2/S1/S2)_S optical characteristics
Input power (SPV + 1530 B 1560 nm) - 32 -> +17 dBm
Monitoring Input Typically 18 dB below the associated optical
power level measurement

Output power
single channels
extra-output
supervision output

- 32 -> +17 dBm
- 32 -> +17 dBm
- 53 -> -14 dBm
Insertion loss
single channels
extra-output

4.75 dB
2.5 dB

level measurement
Input power:
single channels
extra-input
supervision input

- 32 -> +17 dBm
- 32 -> +17 dBm
- 1 -> +1 dBm
Insertion loss
single channels
extra-input

4.55 dB
2.3 dB

Isolation
in-band (dropped vs added channels) >24 dB
8 dropped channels isolation
Isolation
adjacent channels
non adjacent channels
>22 dB
>35 dB

Supervision
Rx side IL 2.3 dB
Tx side IL 2 dB
SPV rejection (Rx side) >28 dB

L1, L2, S1, S2 band channels and central
wavelenght
see DWDM Mux/Demux units (OMDX) optical
characteristics
PMD 0.15 ps
PDL 0.25 dB
OADM4100_M_chxx-yy_S optical characteristics
level measurement
Output power

single channels
extra-output
supervision output
- 32 -> +17 dBm
- 32 -> +17 dBm
- 53 -> -14 dBm
Insertion loss
single channels
extra-output

4.45 dB
2 dB

level measurement
Input power:
single channels
extra-input
supervision input

- 32 -> +17 dBm
- 32 -> +17 dBm
- 1 -> +1 dBm

Insertion loss
single channels
extra-input

4.25 dB
1.8 dB

Isolation
in-band (dropped vs added channels) >24 dB
4 dropped channels isolation
Isolation
adjacent channels
non adjacent channels
>22 dB
>35 dB

Supervision
Rx side IL 2.3 dB
Tx side IL 2 dB
SPV rejection (Rx side) >28 dB

Channels range per board 20->23; 25->28; 30->33; 35->38; 42->45;
47->50; 52->55; 57->60
Central wavelenght per channel see DWDM Mux/Demux units (OMDX) optical
characteristics
PMD 0.15 ps
PDL 0.25 dB

Input power:
single channels
extra-input
supervision input

- 32 -> +17 dBm
- 32 -> +17 dBm
- 1 -> +1 dBm
single channels
extra-input

2.7 dB
2.2 dB
Rejection of added channels 13.5 dB
Isolation (adjacent channels) 22 dB
level measurement

level measurement
single channels
extra-output

3.9 dB
2.4 dB
Output power
single channels
extra-output

- 32 -> +17 dBm
- 32 -> +17 dBm
supervision output - 53 -> -14 dBm
Rejection of dropped channels 13.5 dB

Channels range per board 30-31; 32-33; 35-36; 37-38; 47-48
characteristics
Channel passband at -0.5 dB 0.25 nm
Channel passband at -3 dB 0.3 nm
End-to-end IL (max) 6.1 dB
PMD 0.15 ps
PDL 0.25 dB
OADM1100_M_xx_S optical characteristics
Input power:
single channel
extra-input
supervision input

- 32 -> +17 dBm
- 32 -> +17 dBm
- 1 -> +1 dBm

single channels
extra-input
2.2 dB
1.7 dB
Monitoring Output - 49 -> 0 dBm; typically 18 dB below the associated
optical power level measurement

level measurement
single channels
extra-output

3.4 dB
1.9 dB
Output power
single channels
extra-output
supervision output

- 32 -> +17 dBm
- 32 -> +17 dBm
- 53 -> -14 dBm

Channels range per board 30; 31; 32; 33; 35; 36; 37; 38; 47; 48
characteristics
PMD 0.15 ps
PDL 0.25 dB

Input power:
single channel
extra-input
supervision input

- 32 -> +17 dBm
- 32 -> +17 dBm
- 1 -> +1 dBm
single channels
extra-input

2.2 dB
1.7 dB
Monitoring Output - 49 -> 0 dBm; typically 18 dB below the associated

optical power level measurement

level measurement
single channels
extra-output

3.4 dB
1.9 dB
Output power
single channels
extra-output
supervision output

- 32 -> +17 dBm
- 32 -> +17 dBm
- 53 -> -14 dBm

Channels range per board 30; 31; 32; 33; 35; 36; 37; 38; 47; 48
characteristics
PMD 0.15 ps
PDL 0.25 dB
CWDM OADM units optical characteristics
1-channel/2-channel/4-channel CWDM OADM with supervision (COAD2_S)
WDM OADM optical characteristics
General characteristics 4-channel 2-channel 1-channel
Fiber 9/125 m SMF
Isolation (adjacent channels) - min 30 dB
Isolation (non adjacent channels) - min 40 dB
Max. PDL tbd dB 0.25 dB 0.25 dB
Max. single channel insertion loss (Line Rx IN to
Line Tx OUT), east to west and viceversa
4.2 dB tbd dB 3.5 dB
Extra channels insertion loss (Line Rx IN to Line
Tx OUT), east to west and viceversa
4.9 dB 3.5 dB 3.1 dB

MUX side specification 4-channel 2-channel 1-channel
Input power:
single channels (CH n)
Extra channels (Extra CH ADD/IN)
OSC/SPV channel (SPV Tx IN) -
ADD

tbd dBm
tbd dBm
tbd dBm

tbd dBm
tbd dBm
tbd dBm

tbd dBm
tbd dBm
tbd dBm

MUX side specification 4-channel 2-channel 1-channel
single channels (CHn ADD->Line Tx
OUT)
Express chs (Extra CH ADD->Line
Tx OUT)
>Line Tx OUT) ADD

2.3 dB
2.2 dB
1.0 dB

1.8 dB
1.5 dB
1.0 dB

1.5 dB
1.3 dB
1.0 dB

DEMUX side specification 4-channel 2-channel 1-channel
Input power (Line Rx IN) tbd dBm tbd dBm tbd dBm
DROP)
Express chs (Line Rx IN->Extra CH
DROP)
>SPV Rx OUT) - DROP

2.8 dB
2.7 dB
1.5 dB

2.3 dB
2 dB
1.5 dB

2.0 dB
1.8 dB
1.5 dB

Mux/Demux 1310-1550 + supervision unit optical characteristics

SPV_F_1310_1550 optical characteristics
Input power:
SPV channel
1310 nm input
1550 nm input

- 1 -> +1 dBm
- 20 -> 0 dBm
- 32 -> +17 dBm
SPV channel
1310 nm channel
1550 nm channel

14.6 dB
2 dB
2 dB
Isolation (1310 nm vs 1550 nm) min 30 dB
level measurement

level measurement
SPV channel
1310 nm channel
1550 nm channel

2.1 dB
2.2 dB
2.2 dB
Output power
SPV channel
1310 nm input

- 53 -> -14 dBm
- 20 -> 0 dBm

1550 nm input - 32 -> +17 dBm
Isolation (1310 nm vs 1550 nm) min 30 dB

Channel passband at 1550 nm 1528 ->1560 nm
End-to-end IL (max) at 1310 nm 4.2 dB
End-to-end IL (max) at 1550 nm 4.2 dB
PMD 0.15 ps
PDL 0.25 dB

SPV_F_C unit optical characteristics

SPV_F_C optical characteristics
Input power:
SPV channel
extra input

- 1 -> +1 dBm
- 32 -> +17 dBm
SPV channel
extra input

14.2 dB
1.2 dB
level measurement

level measurement
SPV channel
extra-input

1.7 dB
1.4 dB
Output power
SPV channel
extra-output

- 50 -> -14 dBm
- 32 -> +17 dBm

PMD 0.15 ps
PDL 0.25 dB

F1310 unit optical characteristics
F1310 optical characteristics
Fiber 9/125 m SMF
Isolation min tbd dB
End to end channels IL max. tbd dB
Max. PDL tbd dB
Wavelength range 1463.5 -> 1620 nm

C-band (Extra input)
>Line Tx OUT) - ADD

tbd dB
tbd dB

Input power (Line Rx IN) tbd dBm
C-band (Extra output)
>SPV Rx OUT) - DROP

tbd dB
tbd dB

Optical Amplifier Card (OAC) optical characteristics
Optical Amplifier Card optical interfaces specification
Parameter Symbol Min Typ Max Unit
Wavelength range s 1529.1 1561.8 nm
(32 channels) OAC1 and OAC2 optical characteristics
1st stage output power (EOL) OOPV1 12 dBm
2nd stage output power OOPV2 17 dBm
1st stage spectral gain excursion (1) AG 4 4.5 dB
2nd stage spectral gain excursion (1) AG
1
2 2.2 dB
Noise figure (2) NF 6.8 dB
(1): With an input signal power of -5 dBm and an output power of +17 dBm.
(2): With an input signal power of -11 to -5 dBm and an output power of +17 dBm.
(32 channels) OAC1_L and OAC2_L optical characteristics
1st stage output power (EOL) OOPV1 12 dBm
2nd stage output power OOPV2 17 dBm
1st stage spectral gain excursion (1) AG 4 5 dB
2nd stage spectral gain excursion (1) AG
1
2 2.2 dB
Noise figure (2) NF 6 dB
(1): With an input signal power of -11 dBm and an output power of +17 dBm.
(2): With an input signal power of -17 to -11 dBm and an output power of +17 dBm.

Optical ports specification
Fiber type single mode (SMF)
Optical connector type MU/PC ; MU/APC for extra pump
I/O Function OAC1_L, OAC2_L level

Optical ports specification
VOA attenuation range 1 -> 15 dB
I VOA input -32 -> +17 dBm
O VOA output -47 -> +17 dBm
I 1st stage input -47 -> +17 dBm
O 1st stage output -3 -> +12 dBm
I 2nd stage input -32 -> +17 dBm
O 2nd stage output +2 -> +17 dBm
I SPV extraction
O SPV insertion
O 1st stage input monitor Typically 20dB below the associated level measurement
O 1st stage output monitor Typically 20dB below the associated level measurement
O 2nd stage input monitor Typically 20dB below the associated level measurement
O 2nd stage output monitor Typically 20dB below the associated level measurement
SPV-M + OW (SPVM2) and SPVM_H optical characteristics
SPVM2 and SPVM_H optical characteristics
Connector type MU
Number of optical interfaces (OSC interfaces) 2 for SPVM2 (east, west)
1 for SPVM_H
Bit rate 4864 Kbps (default configuration) : 2 Mbps for
LAPD + 2 Mbps for User channels
SPV Receiver specification
-9
-50 dBm to -47 dBm
Overload @ BER = 10
-9
-6 dbm
SPVM2 and SPVM_H optical characteristics
Maximum receiver reflectance -28 dbm
N.B. The 1510 nm receiver has a specified sensibility of -50 dBm. If the
incident power is lower than that value, the OSC BER is higher, but the
supervision LAP-D protocol corrects the errors so that the supervision is correctly
transmitted down to a power value of -53 dBm
SPV Transmitter specification
Type of source DFB
Wavelength 151010 nm
Maximum -20 dB width 1 nm
max : +1 dBm
Optical Supervisory Channel (OSC) board optical characteristics
OSC optical characteristics
Connector type LC/PC (on SFP module)
Wavelength 131010 nm - 2
nd
window
Interface type L-1.1; 2M and L-1.1 SFPs can be used
Number of optical interfaces (OSC interfaces) 2 (east, west)
Bit rate 2048 Kbps, 2 transparent channels (east, west)
OSMC optical characteristics
OSMC specification

OSMC specification
Selectable input ports (switch) 8
Wavelength range 1529.55 to 1561.42 nm
OCM channel power dynamic range -51 to -3 dBm
Total input power -52 to +17 dBm
OCM power channel power accuracy $1 dB
OCM power repeatability $ 0.25 dB
OCM absolute wavelength accuracy $ 100 pm
OCM acquisition time 1 s

OSMC optical ports
Port_p input ; p = [1 B 8] -52 to +17 dBm

Optical Protection Cards (OPC) optical characteristics
SM/MM OPC BOARDS WIT/WITHOUT CONNECTORS SPECIFICATION
TX side MM OPC 850
with
connectors
MM OPC with
connectors
SM OPC with connectors
Connector type MU MU MU
Fiber type MMF SMF SMF
TX side MM OPC 850
with
connectors
MM OPC with
connectors
Max. insertion loss 5 dB 4.4 dB 4.4 dB
Optical level at TX-IN Ch. 1&2 -15 ->+8 dBm -15 ->+8 dBm -15 ->+8dBm

RX side MM OPC 850
with
connectors
MM OPC with
connectors
Connector type MU MU MU
Fiber type MMF MMF SMF
Max. insertion loss 5 dB 6 dB 4.4 dB
Optical level at RX-IN -28 -> 0 dBm -24 -> 0 dBm -24 -> 0 dBm

OMSP optical characteristics
Tx side specification
Input power max. +17 dBm
Insertion loss max. 3.8 dB
Rx side specification
Input power max. +17 dBm

Insertion loss max. 1 dB

Alarm characteristics
Units Alarms:
Each port card or access card of the equipment is provided with a bicolor (green/red)
or three-color (green/yellow/red) HardWare Failure LED on the front coverplate.
This LED indicates:
when red, internal failure
when green, in service unit
when yellow, board in firmware download state (only for MCC3, OCC10, WLA3, 4xANY,
2xGE_FC, 8xGE, SPVM and OSC).
Centralized Equipment Alarms:
All the alarms detected on the units are collected by the ESC unit which will deliver
centralized optical indications (by means of LEDs on its front coverplate).
Specifically:
- Red LED URG: detection of an URGENT (MAJOR OR CRITICAL) alarm
- Red LED NRG: detection of a NOT URGENT (MINOR) alarm
- Yellow LED ABN: detection of an ABNORMAL operative condition. Type:
active loopbacks, forcing the unit into service, laser forced ON or OFF, try to
restore after ALS
- Yellow LED IND: detection of an INDICATIVE (WARNING) alarm
- Yellow LED ATD: alarm condition ATTENDED
Refer to Units front view where the front view of each unit and the LED locations are
illustrated.
N.B. On the Craft Terminal (C.T.) and on the Operation System (O.S).
application the URGENT (URG), NOT URGENT (NURG) and INDICATIVE
alarm are named in a different way; the relation between this two terminology is
explained in the following table..


Table 8.3 Relation between Alarm severity terminology displayed on C.T./O.S.
and alarm severity terminology used for the ESC leds and ETSI market rack
(TRU).
Alarm severity terminology on C.T. and O.S. Alarm severity terminology used for ESC
leds and for TRU in the rack
CRITICAL or MAJOR URG, T*URG, T*RURG,
MINOR NURG, T*NURG, T*RNURG
WARNING INDICATIVE
INDETERMINATE (not used) --

Rack Alarms:
Some equipment alarms are carried to a connector and used to light-up alarm rack-
lamps. Rack alarms are physically available on the RAI board connectors.
Rack lamps are different in ETSI and ANSI worlds. The RAI card is made to interface
with both standards.
The available alarms are the following:
PDU Front Panel LED Markings (ANSI):
- CRI: critical alarm from one of the shelves in the rack
- MAJ: major alarm from one of the shelves in the rack
- MIN: minor alarm from one of the shelves in the rack
- RACK: alarm storing from one of the shelves in the rack
TRU Front Panel LED Markings (ETSI):
- URG: Urgent: major alarm input from one of the shelves in the rack
- NURG: Non urgent: minor alarm input from one of the shelves in the rack
- ATTD: Attended: aknowledged URG or NURG alarm
- SIG PRES: signal presence (power on)
HouseKeeping Alarms/Commands:
A set of housekeeping contacts are available, located on the 25 poles connector of the
housekeeping board.
Alarm Attending:
The detected units alarm condition can be stored through the ACO (Alarms Cut Off)
push-button on the ESC unit (Attended).
This operation will turn OFF the general red LED URG and will light up the ATD
yellow LED on the ESC unit (Attended); the attended command is also sent to the rack
lamps (if present) through the RAI board.
Trouble-shooting:
This equipment has been designed to dialog with a Personal Computer (PC) for
service, activation and trouble-shooting purpose.
Trouble-shooting procedure for the equipment and details of the alarms for each card
and relevant indications are described in the Operators Handbook.
Connection with the PC is achieved through the 9 poles connector (F interface) on the
ESC board.
The unit can be connected to an Operation System associated to the Transmission
Management Network in order to execute operations similar to those carried out by the
PC.
Characteristics of the cited rack alarms and Housekeeping contacts interface (EM type)
are inserted in TECHNICAL SPECIFICATIONS, 1696MSPAN System
Characteristics.
Equipment domain alarms
This section lists all the alarms that can be physically detected by each rack, subrack or
any kind of board. We give some maintenance indications for each problem with a test
order to follow if necessary . The alarm seen on the CT view are shown between
brackets in the probable cause column.
Generic alarms for all the boards
The following table shows the equipment alarms common to all the boards (and sub-
boards like SFP or XFP modules) implemented in the 1696MS. We do not detail them
for each card and we will only give their specific events.


Table 8.4 Generic alarms common to all boards
HW-syst
name
Alarm type Probable cause
Default Severity
(SA/NSA)
Meaning and remarks Maintenance
HWF Hardware
failure
repleacable Unit
Problem (RUP)
Access failure to boards due
to
SPI bus failure
SPIDER failure
1. Plug and replug the
board
2. Replace the board
C_ABS Hardware
failure
replaceable Unit
Missing (RUM)
The corresponding board is
missing: the board is
provisioned but not equipped.
Plug the missing board.
C_TYPE Hardware
failure
repleacable Unit
Type Mismatch
(RUTM)
A wrong element has been
equipped or provisioned (the
expected CID is wrong)
Check the board
plugged in the slot and
the one provisioned.
ABNOR Maintenance
Indication
unconfigured
Equipment Present
(UEP)
An element has been
equipped: the element board is
present but not declared.
Provision the new
board.

N.B. While the generic alarms are raised no firmware download nor
configuration of the board can be done.
N.B. Generic alarms are detected by the SC and raised on the corresponding
board.
ESC-EC board
All the generic alarms except C_ABS (RUM), C_TYPE (RUTM) and ABNOR (UEP).
Level: 1 + Numbering Style: 1, 2, 3, + Start
Tab after: 1" + Indent at: 1", Tab stops:
0.16", List tab + Not at 1"

Table 8.5 ESC-EC board specific alarms.
HW-syst
name
Alarm
type
Probable cause
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
OBPS or EEPROM or
disk or flash memory
or FPGA or LAN
failure
1. Deplug and replug
the board
2. replace the board
LAN_ALAR
M (Note 1)
Hardware
failure
lanFailure (LF)
Min / Min
Loss of Q link. SH is
declared but not
connected
Check LAN card Check
link between 1696 NE
and manager (OS)
CTOR HW
degradation
highTemperature) Generated by SW upon
temperature
measurement

Note 1 : Supported only if ESC is provisioned in slot #1
ESC-SC board
All the generic alarms except C_ABS (RUM), C_TYPE (RUTM) and ABNOR (UEP).

Table 8.6 ESC-SC board specific alarms.
HW-syst
name
Alarm
type
Probable cause
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
C_FAIL
(Note 1)
Hardware
failure
serial Communication
Problem (SCP)
Communication
problem between
EC and SC.
1. Deplug and replug the board
3.2. Check LAN card
4.3. Check both PSC presence
S_TYPE
(Note 2)
SW failure version Mismatch (VM) A wrong software
version was applied
to the card.
the board
2. Do the software download
1, 2, 3, + Start at: 1 + Alignment: Left +
Aligned at: 0.75" + Tab after: 1" + Indent at:
1", Tab stops: Not at 1"
Tab after: 1" + Indent at: 1", Tab stops: Not
at 1"

Note 1 : this alarm is raised by EC but is relevant from the SC when provisioned in
an expansion shelf or a master shelf.
Note 2 : this alarm is raised by EC but is relevant from the SC when provisioned in
an expansion shelf.
ESC-FC board (ESC in slot #24)
All the generic alarms except HWF (RUP).
PSC / PSC2 / PSC3
All the generic alarms except C_TYPE (RUTM).

Table 8.7 PSC board specific alarms.
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
OBPS generation
failure
1. Deplug and
replug
the board
2. replace the card
House-Keeping board
All the generic alarms.

Table 8.8 HK board specific alarms.
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
OBPS failure 1. Deplug and
replug the board

1", Tab stops: 0.27", List tab + Not at 1"
RAI board

Table 8.9 RAI board specific alarms.
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
OBPS failure 1. Deplug and replug
the board

LAN_Q / LAN_IS Access board

Table 8.10 LAN board specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
the board
Intershelf link Master (I-LINK_M) board
All the generic card alarms.

Table 8.11 I-LINK-M board specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
Formatted: Indent: Left: 0", Numbered +
at 1"

HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
External power
supply failure
the board
Intershelf link Slave (I-LINK_S) board
All the generic card alarms except C_TYPE (RUTM).

Table 8.12 I-LINK-S board specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
the board
User Interface board

Table 8.13 UIC board specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
the board

FAN board

Table 8.14 FAN board specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
OBPS failure or FAN
component failure
1. Deplug and
replug the board
CTOR HW
degradation
highTemperature) Generated by SW
upon temperature
measurement

FAN_C board

Table 8.15 FAN_C board specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
OBPS failure or FAN
component failure
1. Deplug and replug the
board
MINOR_
ALARM
(Note 1)
Hardware
degradation
(tbc)
battery Failure
(BF)
Minor alarm on PMU.
One rectifier has failed
in the PMU
Replace the defective
rectifier module.
MAJOR_
ALARM
(Note 1)
Hardware
failure
power Problem
(PP)
Major alarm on PMU.
Both rectifiers have
failed or the fan
rectifiers have failed or
1. Check 220V power
supply
2. Check fans of rectifiers
Formatted: Indent: Left: -0", Hanging: 0.18",
Numbered + Level: 1 + Numbering Style: 1, 2,
3, + Start at: 1 + Alignment: Left + Aligned
at: 0.75" + Tab after: 1" + Indent at: 1", Tab
stops: Not at 1"
Formatted: Indent: Left: 0", Hanging: 0.18",
stops: Not at 1"

HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
the 220V power supply
is down
3. Replace both defective
rectifiers
CTOR HW
degradation
highTemperature Generated by SW upon
temperature
measurement

Note 1 : These alarms are related to the PMU that is not managed. The rectifiers
module allow to provide the -48V from alternative voltage source.
OPC board

Table 8.16 OPC board specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
External power supply
failure
1.4. Deplug
the board
2.5. replace the board

OMSP board

Table 8.17 OMSP board specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
failure
the board
OAC1, L_OAC1, OAC2 and L_OAC2 boards

Figure 353280: OAC block diagram.

Table 8.18 OAC board specific alarms.
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
HWF Hardware
failure
replaceable Unit
Problem (RUP)
OBPS 1. Deplug and replug
the board
1.1

HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
CTOR Hardware
degradation
highTemperature Generated by
SW upon
temperature
measurement
the board
3.2
CVR Hardware
failure
optical Connector
Cover Open
(OCCO)
Optical safety
cover is removed
(automatic
shutdown of the
OAC)
1.1
PUD1
PUD2
Hardware
degradation
transmitter Degraded
(TD)
One of the pump
lasers may be
nearing its end
of life: efficiency
lower than 70%
Plan to change the board. 1.1
ILOS1 Signal failure input Power Loss
(IPL)
Optical input
power of the 1st
stage has fallen
belowthe
acceptable signal
level.
1. Check the input
connections.
2. Clean up the
connectors.
1.1
ILOS2 Signal failure input Power Loss
(IPL)
Optical input
power of the 2nd
stage has fallen
belowthe
acceptable signal
level.
1. Check the input
connections.
2. Clean up the
connectors
1.1
OLOS1 Hardware
failure
output Power Loss
(OPL) output 1st
stage
Optical output
power of the 1st
stage is below
the acceptable
signal level
1. Deplug and plug the
board.
1.1
OLOS2 Hardware
failure
output Power Loss
(OPL) output 2nd
Optical output
power of the 2nd
stage is below
1. Deplug and plug the
board.
1.1
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
stage the acceptable
signal level
OOR1
OOR2
Signal
degradation
configuration Or
Customization Error
(COCE)
Input or Output
power out of
range (span or IT
has been
modfied). 1st
stage or 2nd
stage or VOA
doesnt work
properly. The
tuning cannot be
performed
Check span, IT value
entered by operator.
Check other alarms within
board (ILOS, PUD,
OLOS).
Check OAC in previous
NE
2.0
OOR_
VOA
Maintenance
indication
configuration Or
Customization Error
(COCE)
Input or Output
power out of
range (span or IT
has been
modfied). 1st
stage or 2nd
stage or VOA
doesnt work
properly. The
tuning cannot be
performed
Check span, IT value
entered by operator.
Check other alarms within
board (ILOS, PUD,
OLOS).
Check OAC in previous
NE.
2.0
VOA_
TUNING_
FAILS
Maintenance
indication
configuration Or
Customization Error
(COCE)
The tuning
cannot be
performed
because the
functionalities of
the board are not
accessible
Check alarms within
board (HWF, C_ABS,
C_NOT_ACC)
2.2

Other alarms: All the generic card alarms.

SPVM board

Table 8.19 SPVM specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
HWF Hardware
failure
replaceable Unit
Problem (RUP)
OBPS 1.3. Deplug and
replug the board
1.0
CTOR Hardware
degradation
highTemperature Generated by SW
upon temperature
measurement
1.5. Deplug and
replug the board
3.2
SUP_TX1
_elec
SUP_TX2
_elec
Hardware
failure
Output Power Loss
(OPL)
The optical output
power of the board
is below the
acceptable loss
threshold.
Tx laser or Tx
monitoring diode
down
1.7. Deplug and
replug the board
1.0
SUP_TX1
_opt
SUP_TX2
_opt
Hardware
degradation
transmitter Degraded
(TD)
The optical output
power of the board
is below the
minimum
threshold (-3dBm)
-1. Plan to change the
board
2.0


OSC board
Some more alarms are raised by SFP modules plugged in OSC board.

0.38", List tab + Not at 0.5" + 1"

Table 8.20 OSC specific alarms
HW-syst
name
Alarm
type
Probable cause
Default
Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
OBPS 1.2. Deplug and replug the
board

SPV_F_C board

Table 8.21 SPV_F_C specific alarms
HW-syst
name
Alarm
type
Probable cause
Default
Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
failure
1.4. Deplug and replug the
board

OLOS Signal
failure
output Power
Loss (OPL)
Optical output power
of the Mux output is
belowthe acceptable
signal level
- Check optical path
between this card and
1310nm or 1550nm
channel
- Check 1310nm OR
1510nm channel
- Check monitoring
diode
ILOS Signal input Power Loss Optical input power of
the Demux input is
Check SPV_F_C in previous

HW-syst
name
Alarm
type
Probable cause
Default
Severity
(SA/NSA)
Meaning and
remarks
Maintenance
failure (IPL) below the acceptable
signal level
NE or monitoring diode

Other alarms : All the generic board alarms.
SPV_F_1310_1550 board

Table 8.22 SPV_F_1310_1550 board specific alarms
HW-syst
name
Alarm
type
Probable cause
Default
Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable Unit
Problem (RUP)
failure
board
OLOS Signal
failure
output Power
Loss (OPL)
Optical output power
of the Mux output is
belowthe acceptable
signal level
5. Check optical path
between this card
and 1310nm and
1550nm channel
6. Check 1310nm and
1510nm channel
7. Check monitoring
diode
ILOS Signal
failure
input Power Loss
(IPL)
Optical input power of
the Demux input is
below the acceptable
signal level
Check SPV_F_1310_ 1550 in
previous NE or monitoring diode


Formatted: Indent: Left: 0.5", Bulleted +
Level: 1 + Aligned at: 0.83" + Tab after: 0.5"
+ Indent at: 1.08", Tab stops: Not at 0.5"
MCC boards
The following table shows the alarms which can be raised on :
MCC1_SDH, MCC1_ASY, MCC1_SYN
MCC2_SDH, MCC2_SYN
MCC3_SDH_SONET, MCC3_SYN. In this case, some more alarms can be raised on SFP
module.

Table 8.23 MCC specific alarms.
HW-syst
name
Alarm
type
Probable cause
Default
Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
HWF Hardware
failure
replaceable Unit
Problem (RUP)
OBPS failure 1. Deplug and replug the
board
1.0
CTOR Hardware
degradation
highTemperature Temperature out
of range
3.2
B&W receiver alarms
There is no equipment alarm on the B&W receiver but only Transmission ones.
WDM emitter alarms
LOS_
WDM_
Tx
(only
MCC3)
Hardware
failure
transmitter
Failure (TF)
One of the
following
component
is in failure:
WDM Tx
VOA
8x8 matrix
Replace the board 2.2
DEG_
OUT_
WDM
Hardware
degradation
transmitter
Degraded (TD)
WDM laser may
be nearing its
end of life
Plan to change the board 1.0
TOR_WDM Hardware
degradation
transmitter
Degraded (TD)
The WDM laser
temperature is
out of range

HW-syst
name
Alarm
type
Probable cause
Default
Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
OORVOA
(except
MCC1)
Status
indication
configuration Or
Customization
Error (COCE)
The VOA is out
of range
Check VOA value.
Check if span has been
modified
2.2
WDM receiver alarms
There is no equipment alarm on the WDM receiver but only Transmission ones.
B&W emitter alarms
DEG_OUT_
user (except
MCC3)
Hardware
degradation
transmitter
Degraded (TD)
Degraded B&W
laser
LOC_U
ser_Tx
(only
MCC3)
Hardware
failure
replaceable Unit
Problem (RUP)
The 8x8 matrix
is down
DEG_ SFP
(only
MCC3)
Hardware
degradation
transmitter
Degraded (TD)
User optical
transmitter
degradation of
SFP
Plan to replace the SFP
module
2.2
PROTECT_
FAIL
(SW alarm)
Hardware
failure
replaceable Unit
Problem (RUP)
switch problem
with O-SNCP

SFP modules
The following table shows the alarms which can be raised on all SFP modules:

Table 8.24 SFP specific alarms.
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
RUU maintenance
indication
alarm
replaceable Unit
Unknown (RUU)
SFP plugged not
Alcatel-Lucent
Plan to replace the
SFP module
2.2a
Receiver alarms
Emitter alarms
DEG_SFP Hardware
degradation
transmitter
Degraded (TD)
User optical
transmitter
degradation of
SFP
Plan to replace the
SFP module
2.2a

XFP modules
The following table shows the alarms which can be raised on all XFP modules:

Table 8.25 XFP specific alarms.
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
RUU maintenance
indication
alarm
replaceable Unit
Unknown (RUU)
XFP plugged not
Alcatel-Lucent
Plan to replace the
XFP module
3.0
Receiver alarms
Emitter alarms

HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
DEG_XFP Hardware
degradation
transmitter
Degraded (TD)
User optical
transmitter
degradation of
XFP
Plan to replace the
XFP module
3.0

WLA1 and WLA2 boards
The following table shows the alarms which can be raised on:
WLA1C
WLA2M
WLA2M_OP.

Table 8.26 WLA1 and WLA2 specific alarms.
HW-syst
name
Alarm type Probable
cause Default
Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
HWF Hardware
failure
replaceable Unit
Problem (RUP)
board
2.2a
Port #U (U=1..4) receiver alarms
Alarms are raised by SFP module
Port #U (U=1..4) emitter alarms
Alarms are raised by SFP module 2.2a

WLA3 boards
WLA3CD
WLA3CDOP.

Table 8.27 WLA3 specific alarms.
HW-syst
name
Default
Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
HWF Hardware
failure
replaceable Unit
Problem (RUP)
OBPS failure 1. Deplug and replug the board
2.2a
CTOR Hardware
degradation
highTemperature Temperature
out of range
3.2
Port #U (U=1..4) receiver alarms
Port #U (U=1..4) emitter alarms
2xGE_FC board

Table 8.28 2xGE_FC specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
HWF Hardware
failure
replaceable Unit
Problem (RUP)
board
3.0
Tab after: 1" + Indent at: 1"

HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
CTOR Hardware
degradation
of range
3.2
Other alarms: All the generic card alarms except HWF.
8xGE

Table 8.29 8xGE main board specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
HWF Hardware
failure
replaceable Unit
Problem (RUP)
board
3.0
CTOR Hardware
degradation
highTemperature Unit temperature
is above the
maximum
allowed
temperature
3.2
Other alarms: All the generic card alarms except HWF.
TRBD1996

Table 8.30 TRBD1996 main board specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
HWF Hardware
failure
replaceable Unit
Problem (RUP)
If a failure of any
key component
(Laser, locker,
board
3.4
at 1"
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
WDM and B&W
modules, FPGA,
FEC ASIC)
occurs
or 48V fuse A
failure
or 48V fuse B
failure

CTOR Hardware
degradation
highTemperature Unit temperature
is above the
maximum
allowed
temperature
3.4
PROTECT
_
FAI
L (SW
alarm)
Hardware
failure
replaceableUnit-
Problem (RUP)
switch problem
with O--SNCP
Plan to replace the
board.
3.4

OCC10 boards

Table 8.30303031 OCC10 specific alarms
HW-syst
name
Default
Severity
(SA/NSA)
Meaning
and
remarks
Maintenance Rel
HWF Hardware
failure
replaceable Unit
Problem (RUP)
OBPS
failure
1. Deplug and replug the board
2.0
CTOR Hardware highTemperature Temperat 3.2

HW-syst
name
Default
Severity
(SA/NSA)
Meaning
and
remarks
Maintenance Rel
degradation ure out of
range
B&W receiver alarms
WDM emitter alarms
DEG_OUT_
WDM_Tx
Hardware
degradation
Transmitter
Degraded (TD)
WDMlaser may be
nearing its end of life
Plan to replace the
board
2.0
TOR_
WDM_Tx
Hardware
degradation
transmitter
Degraded (TD)
The WDM laser
temperature is out of
range
Plan to replace the
board
2.0
LOS_
WDM_Tx
Hardware
failure
transmitter Failure
(TF)
One of the following
component is in
failure:
WDM Tx
VOA
8x8 matrix
FEC chip

VOA_OOR_
WDM_Tx
Status
indication
configuration Or
Customization
Error (COCE)
Input power out of
range (span has been
modified). VOA
doesnt work
properly. The tuning
cannot be performed
(TBC)
Check VOA value.
Check if span has
been modified
2.2
WDM receiver alarms
B&W emitter alarms
HW-syst
name
Default
Severity
(SA/NSA)
Meaning
and
remarks
Maintenance Rel
DEG_OUT_
user_Tx
Hardware
degradation
transmitter
Degraded (TD)
Degraded B&W laser Plan to replace the
board
2.0
PROTECT_
FAIL
(SW alarm)
Hardware
failure
replaceable Unit
Problem (RUP)
switch problem with
O-SNCP
Plan to replace the
board
2.0


OCC10_E boards

Table 8.31313132 OCC10_E specific alarms
HW-syst
name
Default
Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
HWF Hardware
failure
replaceable
UnitProblem
(RUP)
OBPS failure 1. Deplug and
replug the board
3.0
CTOR Hardware
degradation
highTemperature Temperature out of
range
3.2
PROTECT_
FAIL (SW
alarm)
Hardware
failure
replaceable
UnitProblem
(RUP)
switch problem with
O-SNCP
Plan to replace the
board
3.0
VOA_Unava
ilable (SW
alarm)
Hardware
failure
Configuration or
Customization
Error (COCE)
VOA not present on
board: OCC10_EC
board instead of
OCC10_E
no 3.0
B&W receiver alarms
WDM emitter alarms
DEG_OUT_
WDM_Tx
Hardware
degradation
Transmitter
Degraded (TD)
WDM laser may be
nearing its end of life
Plan to replace the
board
3.0
TOR_
WDM_Tx
Hardware
degradation
transmitter
Degraded (TD)
The WDM laser
temperature is out of
range
Plan to replace the
board
3.0
LOS_
WDM_Tx
Hardware
failure
transmitter Failure
(TF)
One of the following
component is in
failure:
WDM Tx
VOA
HW-syst
name
Default
Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
8x8 matrix
FEC chip

VOA_OOR_
WDM_Tx
Status
indication
configuration Or
Customization
Error (COCE)
Input power out of
range (span has been
modified). VOA
doesnt work
properly. The tuning
cannot be performed
(TBC)
Check VOA value.
Check if span has
been modified
3.0
WDM receiver alarms
B&W emitter alarms
Equipment alarms on client emitter are held by XFP module.

4xANY board.
The following table shows the alarms which can be raised on:
4xANY
4xANY_S
4xANY_P.

Table 8.32323233 4xANY main board specific alarms
HW-syst
name
Alarm type Probable
cause
Default
Severity
(SA/NSA)
Meaning and
remarks
Maintenance
HWF Hardware
failure
replaceable
Unit
Problem
(RUP)
OBPS failure 1. Deplug and replug the board
CTOR Hardware
degradation
highTemper
ature
Unit temperature is
above the maximum
allowed temperature

4xANY drawers.

Table 8.33333334 4xANY drawer specific alarms
HW-syst name Alarm
type
Probable
cause
Default
Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
Link_Failure_DR
WU
Hardware
failure
replaceable
Unit Problem
No link between
mother board and
9.1. Deplug
and replug the
1.3
HW-syst name Alarm
type
Probable
cause
Default
Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
(U= 1,2,3 or 4) (RUP) drawer U drawer
3.2. replace the drawer
SFP alarms
Alarms are raised on SFP module
PROTECT_
FAIL_DRW_U
(U= 1,2,3 or 4)
(SW alarm)
Hardware
failure
replaceable
Unit Problem
(RUP)
switch problem with
O-SNCP
4.1. Deplug
board
2.2

Other alarms : All the generic alarms except HWF.
Multiplexer / Demultiplexer board
a. OMDX8100_M_##
With ## is L2, S1 or S2.
b. OMDX8100_M_xx_XS and OADMn100
- OMDX8100_M_L1_XS_NOSPV, OMDX8100_M_L1_XS_SPV1,
OMDX8100_M_L1_XS_SPV2, OMDX8100_M_L1_X, OMDX8100_M_L1
boards
- OADM4100 boards
- OADM2100 boards
- OADM1100 boards.

These alarms are not raised with OMDX8100_M_L2, OMDX8100_M_S1 and
OMDX8100_M_S2.
OMDX8100_M_L1 is managed as OMDX8100_M_L1_X.

Table 8.34343435 OMDX/OADM specific alarms.
HW-syst
name
Alarm
type
Probable cause
Default Severity
(SA/NSA)
HWF Hardware
failure
replaceable Unit
Problem (RUP)
failure
the board
CTOR HW
degradation
highTemperature Temperature out of range
defined by operator

OLOS Signal
failure
output Power Loss
(OPL)
Optical output power of
the Mux output is below
the acceptable signal level
Check optical path
before transponders or
monitoring diode
ILOS (for
cascaded
Demux
only)
Signal
failure
input Power Loss
(IPL)
Optical input power of the
Demux input is below the
acceptable signal level
Check previous
cascaded Demux or
monitoring diode
c. CMDX-U, CMDX-U-S, CMDX2-U, CMDX2-U-S

Table 8.35353536 CMDX(2) boards specific alarms
HW-syst
name
Default Severity
(SA/NSA)
HWF Hardware
failure
replaceable Unit
Problem (RUP)
failure
-1. Deplug and replug
the board
3.2. replace the
board
Formatted: Indent: Left: 0", Hanging: 0.44",
stops: Not at 1"
HW-syst
name
Default Severity
(SA/NSA)
ILOS Signal failure Input Power Loss
(IPL)
DeMux input is below the
Check CWDM
network or monitoring
diode
a. COAD2 (1-channel/2-channel/4-channel) boards

Table 8.36363637 COAD2 boards specific alarms
HW-syst
name
Default Severity
(SA/NSA)
HWF Hardware
failure
replaceable Unit
Problem (RUP)
failure
1. Deplug and
replug the board
ILOS1 Signal failure
at input 1
Input Power Loss
(IPL)
DeMux input 1 is below
Check CWDM
network or
monitoring diode
ILOS2 Signal failure
at input 2
Input Power Loss
(IPL)
DeMux input 2 is below
Check CWDM
network or
monitoring diode
b. CDMDX2-U and CDMDX2-U-S

Table 8.37373738 CDMDX2-U and CDMDX2-U-S specific alarms
HW-syst
name
Default Severity
(SA/NSA)
HWF Hardware
failure
replaceable Unit
Problem (RUP)
failure
the board
Formatted: Indent: Left: -0.02", Numbered +

HW-syst
name
Default Severity
(SA/NSA)
ILOS Signal failure Input Power Loss
(IPL)
Optical input power of
the DeMux input is below
Check CWDM
network or monitoring
diode
Optical Spectrum Measurement Card (OSMC)

Table 8.38383839 OSMC specific alarms
HW-syst
name
Alarm
type
Probable cause
Default Severity
(SA/NSA)
HWF Hardware
failure
replaceable Unit
Problem (RUP)
board
Cal_portP_O
OR
(1p P q8)
Signal
degradation
configuration Or
Customization
Error (COCE)
Calibration Factor of
port P is out of the range
[0;40] dB
1. Check OSMC is
correctly connected to
monitored board via
monitoring ports or
passing thru attenuator
2. Check optical power
atmonitored port of the
monitored board is
correct
Auto_Equ_
Stop
Maintenanc
e indication
configuration Or
Customization
Error (COCE)
Automatic equalization
stopped
1. Check that the OSMC,
MVAC or monitored
boards (OAC, OAC_L,
Mux/Demux) do not
raise the following
alarms : HWF,
C_Type, ABNOR,
C_ABS,C_NOT_ACC
.
2. Check there is no
ILOS_PortP_Total on
OSMC
Auto_Cal_
Stop
Maintenanc
e indication
configuration Or
Customization
Error (COCE)
Automatic calibration
stopped
1. Check that OSMC and
monitored board (OAC,
OADM, OMDX) do not
raise the generic alarms.
2. Check if there is no
ILOS or OLOS on
OSMC monitored
board
ILOS_PortP_
total (note 1)
Signal
failure
N/A Loss of total input power
at port P (1p P q8)
1.3. Check path between
each monitored port
and OSMC inputs.
2.4. Clean connectors
ILOS_PortP_
chx (note 1)
Loss of channel x (1 p x
q 32) at port P (1p P q8)

Note 1 : these events can be raised when the operator is asking for
spectrumacquisition or pre-equalization. They are only measurement and are not in
the AS.
Multiple Variable Attenuator Card (MVAC)

Table 8.39393940. MVAC specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
HWF Hardware
failure
replaceable Unit
Problem (RUP)
OBPS failure 1.5. Deplug
replug the board
2.6. replace the
board
2.0
CTOR Hardware
degradation
of range defined
by operator

3.2

OOR_VOA_
PortP
(1 p P r 2)
Maintenance
indication
configuration Or
Customization Error
(COCE)
The VOA is out of
range
1.7. Check path
MVAC port P
2.8. Clean
connectors
2.2
OLOS_PortP
(1 p P r2)
Signal
failure
output Power Loss
(OPL)
Loss of output
power at port
P (1 p P q 2)
1.9. Check path
MVAC port P
2.10. Clean
connectors
3.11. Check
attenuator is
working properly
2.0
Multiple Variable Attenuator Card (MVAC10)

Table 8.40404041 MVAC10 specific alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
HWF Hardware
failure
replaceable Unit
Problem (RUP)
the board
4.2. replace the
board
3.0
CTOR Hardware
degradation
of range defined
by operator
3.2
DEG_OPAV
_#i
(1 p i r10)
Maintenance
indication
configuration Or
Customization Error
(COCE)
The OPAV_#i can
not be correctly
tuned
1.3. Check path
VOA_#i.
2.4. Clean
connectors
3.0
OLOS_#i
(1 p i r10)
Signal
failure
output Power Loss
(OPL)
Loss of output
power at port
P (1 p i r 10)
1.5. Check path
before VOA_#i.
2.6. Clean
connectors
3.7. Check
attenuator is
3.0
1", Tab stops: 0.17", List tab + 0.75", Left +
Not at 1"
Formatted: Indent: Left: -0", Hanging: 0.17",
stops: Not at 1"
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance Rel
working properly
Optical transmission domain alarms
This section lists all the alarms that can be generated in the Optical Transmission
domain to control the transport quality of the system. The alarm seen on the CRAFT
view are shown between brackets in the probable cause column.
URU
URU alarmis raised on OGPI, OTS,OSPI and GMAU Trail termination when a RUP,
RUTM or RUM probable cause is detected on the supported board.
SSF
SSF alarm is a software correlation of previously raised alarms.
SSF is not suitable for maintenance. See primarily raised alarms.
Supervision boards
For each row, the column Trail Termination / Adaptation is split so as to show the
objects for both following cases:
SPVM board in slot#23 for 1696MS and slot#4 for 1696MS_C. This configuration
corresponds to the supervision of the OTS
SPVM board in slot different from slot#23 for 1696MS and slot different from slot#4 for
1696MS_C. Those cells are greyed. This configuration corresponds to the supervision of a
CPE.
OSC board in slot different from slot#29 for 1696MS and slot different from slot#11 for
1696MS_C. Those cells are greyed. This configuration corresponds to the supervision of a
CPE.
In this table, the letter U stands for the port to take into account.

Table 8.41414142 Supervision boards transmission alarms

HW-syst
name
Alarm
type
Probable cause
Default
Severity
(SA/NSA)
Trail
termination
/
Adaptation
Meaning and
remarks
Maintenance
LOF_U
U=1,2
Signal
failure
loss Of
Supervisory
Channel Frame
(LOSCF)
OTS_TT The signal frame
cannot be recovered
from the output of the
receiver. This alarm is
not raised when a
LOSC is detected.
Check input fiber.
Check board
rereceiver or remote
board emitter.
OGPI_TT
or
OSPI_TT

SUP_RXU
U=1,2
Signal
failure
loss Of
Supervisory
Channel (LOSC)
OTS_TT Optical input power
level of the SPV
channel has fallen
below the acceptable
signal level

OGPI_TT
or
OSPI_TT

RS_LAPD
_ FAIL_U
U=1,2
(Note 1)
Signal
failure
(tbc)
communication
Subsystem
Failure (CSF)
OTS_TT The LAPD
communication has
failed.
RS DCC (D1-D3) in
failure in port#U
Check input fiber.
Check SPV receiver
(check URU on OTS).
Check fiber break or
failure in previous NE
not used
MS_LAPD
_ FAIL_U
U=1,2
(Note 1)
Signal
failure
(tbc)
communication
Subsystem
Failure (CSF)
OMS_TT The LAPD
communication has
failed. MS DCC (D4-
D12) in failure in
port#U
Check input fiber.
Check SPV receiver
(check URU on OMS)
Check fiber break or
failure in previous NE
OGPI_TT
or
OSPI_TT

Note 1 : these alarms are raised by the EC.
UIC board
none

OMSP board

Table 8.42424243 OMSP boards transmission alarms
HW-syst
name
Alarm type Probable
cause
Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
ILOS2 Signal failure Loss of Signal
(LOS)
Maj / Min
Signal loss on input port #2
ILOS3 Signal loss on input port #3
OAC boards
The following alarm concerns OAC1, L_OAC1, OAC2 and L_OAC2 boards.

Table 8.43434344 OAC boards transmission alarms
HW-syst
name
Alarm
type
Probable
cause Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenanc
e
ILOS1 Signal
failure
loss Of
Multiplex
Section (LOMS)
OTS/OMS_A_Sk Optical input power
level of the first stage
of the amplifier has
Check fiber
break or
failure in

HW-syst
name
Alarm
type
Probable
cause Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenanc
e
fallen below the
previous NEs

OMDX boards
The following alarm concerns only OMDX8100_M_L1_XS, OMDX8100_M_L1_X
and OMDX8100_M_L1 boards. No transmission alarms are associated to
OMDX8100_M_L2, OMDX8100_M_S1 and OMDX8100_M_S2 boards.

Table 8.44444445 OMDX boards transmission alarms
HW-syst
name
Alarm
type
Probable cause
Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
ILOS Signal
failure
loss Of Multiplex
Section (LOMS)
OTS/OMS_A_Sk Optical input
power level of the
first stage of the
demux input has
fallen below the
acceptable signal
level
Check fiber
break or failure
in previous NEs

OMDX8100_M_L1 is managed as OMDX8100_M_L1_X.
COAD2 (1-channel/2-channel/4-channel) boards

Table 8.45454546 COAD2 boards transmission alarms
HW-syst
name
Alarm
type
Probable cause
Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
HW-syst
name
Alarm
type
Probable cause
Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
ILOS1 Signal
failure
loss Of Multiplex
Section (LOMS)
power level of
the first stage of
the demux input
1 has fallen
below the
acceptable signal
level
Check fiber
break or failure
in previous NEs
ILOS2 Signal
failure
loss Of Multiplex
Section (LOMS)
power level of
the first stage of
the demux input
2 has fallen
below the
acceptable signal
level
Check fiber
break or failure
in previous NEs

CMDX-U, CMDX-U-S, CMDX2-U, CMDX2-U-S

Table 8.46464647 CMDX(2) boards transmission alarms
HW-syst
name
Default Severity
(SA/NSA)
Trail termination
/ Adaptation
Meaning and
remarks
Maintenance
ILOS Signal
failure
loss Of Multiplex
Section (LOMS)
power level of
the first stage of
the demux input
has fallen below
the acceptable
signal level
Check fiber
break or failure
in previous NEs

CDMDX2-U and CDMDX2-U-S boards


Table 8.47474748 CDMDX2-U and CDMDX2-U-S boards transmission alarms
HW-syst
name
Alarm
type
Probable cause
Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
ILOS Signal
failure
loss Of Multiplex
Section (LOMS)
power level of
the first stage of
the demux input
has fallen below
the acceptable
signal level
Check fiber
break or failure
in previous NEs
MCC boards
The following alarms concern the following boards :
MCC1_SDH, MCC1_SYN, MCC1_ASY,
MCC2_SDH, MCC2_SYN,
MCC3_SDH_SONET and MCC3_SYN. In this case, some more alarms are raised by SFP
module.
except LBER alarm not managed in MCC1.

Table 8.48484849 MCC boards transmission alarms
HW-syst
name
Alarm
type
Probable
cause Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
ILOS_user (for
MCC3 it is a
OR with
LOC_User_Rx)
Signal
failure
loss Of Signal
(LOS)
OGPI_TT User optical
signal input
power has
fallen below the
acceptable
signal level, or
loss of clock of
Check the
optical path
between user
and 1696MS

Check receiver
HW-syst
name
Alarm
type
Probable
cause Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
user incoming
signal (only for
MCC3)..
LBER_User (1) Signal
degradation
low BER
(LBER)
RS_TT Transmission
degradation

LOF_SDH_use
r (2)
Signal
failure
loss Of Frame
(LOF)
OGPI/RS_A_S
k
The signal
frame cannot be
recovered from
the output of
the B&W
receiver
Check the
optical path
between SDH
and 1696MS.
Check
transmitted
signal in client
NE
ILOS_WDM
and for MCC3:
plus
LOC_WDM_R
x
Signal
failure
loss Of
Wavelength
(LOW)
OMS/OCH_A_
Sk
The WDM
incoming signal
power is below
the acceptable
signal level, or
loss of clock of
WDM
incoming signal
(only for
MCC3)..
Check the
cabling between
MCC and OAC.
Check the
WDM line.
Might not be
raised with the
use of amplifier
loss Of Signal
(LOS)
(>R1.1 only)
OGPI_TT
(MCC remote)
Check the
optical path
between CPE
and 1696MS.
Check receiver
SIGNAL_DEG
RADE (For
MCC3 only)
Signal
failure
degradedSignal
(DS)
OMS/OCH_A_
Sk
(MCC local)
The WDM
incoming signal
power is below
the acceptable
signal level
(only for
Check the
cabling between
MCC and OAC.
Check the
WDM line.
Might not be

HW-syst
name
Alarm
type
Probable
cause Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
MCC3) raised with the
use of amplifier
Signal
failure
degradedSignal
(DS)
OGPI_TT
(MCC remote)
The WDM
incoming signal
power is below
the acceptable
signal level
(only for
MCC3)
Check the
cabling between
MCC and OAC.
Check the
WDM line.
Might not be
raised with the
use of
amplifier.
Check receiver
LBER_WDM
(1)
Signal
degradation
low BER
(LBER)
RS_TT Transmission
degradation

LOF_SDH_W
D M (2)
Signal
failure
loss Of Frame
(LOF)
OCH/RS_A_Sk The signal
frame cannot be
recovered from
the output of
the WDM
receiver
Check WDM
path for the
channel
LOC_WDM (1)
(Not for
MCC3)
Signal
failure
transmit Failure
(TTF)
OMS/OCH_A_
So
The signal
frame on WDM
Tx cannot be
recovered. In
pass-through
configuration,
for amplified
networks, this
can mean a loss
of signal
Check adjacent
MCC for the
channel, or user
receiver, or user
path.
OGPI/
OCH_A_So
(MCC remote)
Check user
receiver or user
path of the
HW-syst
name
Alarm
type
Probable
cause Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
remote MCC
LOC_user (1)
(Not for
MCC3)
Signal
failure
Loss Of Signal
(ILOS)
OCH_TT The signal
frame on User
Tx cannot be
recovered (i.e.
loss of clock
from the
incoming
WDM signal).
For amplified
networks, this
can mean a loss
of signal
Check WDM
line of previous
NEs
SSF_User_Rx Signal
failure
server Signal
Failure (SSF)
OGPI/RS_A_S
o
(MCC_SDH)
OGPI/GDT_A_
So
(other MCC)
Alarm synthesis
of previous
raised alarms
see primary
alarms
SSF_WDM_Rx Signal
failure
server Signal
Failure (SSF)
OGPI/
OCH_A_So
(MCC_SDH)
OCH/GDT_A_
So
(other MCC)
Alarm synthesis
of previous
raised alarms
see primary
alarms

(1) not managed in MCC1_ASY.
(2) this alarm is raised only if Trail Monitor has been created.
SFP modules
The following table shows the alarms which can be raised on all SFP modules :

Table 8.49494950 SFP specific alarms.
HW-syst
name
Default
Severity
(SA/NSA)
Trail
termination
/ Adaptation
Meaning and
remarks
Maintenance
ILOS Signal failure loss Of Signal
(LOS)
OGPI_TT Input optical
power has fallen
below the
acceptable signal
level
Check the optical
path between user
and 1696MS.
Check receiver
Only for DWDM and CWDM SFP modules.
XFP modules
The following table shows the alarms which can be raised on all SFP modules :

Table 8.50505051 XFP specific alarms.
HW-syst
name
Default Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
LOS_XF
P_Rx
Signal failure loss Of Signal
(LOS)
signal input
power has fallen
below the
acceptable signal
level
Check the optical
path between user
and 1696MS.
Check receiver
WLA1 and WLA2 boards
WLA1C board
WLA2M board
WLA2M_OP.

Table 8.51515152 WLA1 and WLA2 boards transmission alarms
HW-syst
name
Alarm
type
Probable cause
Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
LOF_SDH_
PORT_U
(U=1..4)
signal
failure
loss Of Frame
(LOF)
OGPI/RS_A_Sk The signal frame
cannot be
recovered from
the output of the
WDM receiver
Check path for
the channel
WLA3 boards
WLA3CD
WLA3CDOP.

Table 8.52525253 WLA3 boards transmission alarms
HW-syst
name
Alarm
type
Probable
cause Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
LOF_SDH_
PORT_U
(U=1..4)
signal
failure
loss Of Frame
(LOF)
OGPI/RS_A_Sk The signal frame
cannot be
recovered from
the output of the
WDM receiver
Check path for
the channel
SIGNAL_D
EGRADE_
U (U=2 and
4)
signal
failure
degradedSignal
(DS)
OGPI The WDM
incoming signal
power is below
the acceptable
signal level.
Raised on
optical module
Check path for
the channel

2xGE_FC board

Table 8.53535354 2xGE_FC board transmission alarms
HW-syst
name
Alarm
type
Probable
cause Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
RS_LOF signal
failure
loss Of Frame
(LOF)
OCH/RS_A_Sk The signal frame
cannot be
recovered from
the output of the
WDM receiver
Check the
optical path
between
2xGE_FC and
MCC
RS_LBER signal
degradetion
low BER
(LBER)
RS_TT Transmission
degradation

MS_RDI Maintenace
indication
Far End
Receiver Failure
(FERF)
RS_TT (this is
generated at MS
level)
MS_RDI has
been generated
by remote
corresponding
2xGE_FC due to
network failure
on physical or
RS or MS layers,
or to the loss of
transponder link
check
transponder link
or
SDH/SONET/W
DM network
GFP_SSF_
U (U=1,2)
Signal
Failure
Receiver Failure
(RCVF)
GDC_A_Sk OR wired of
SDH alarms:
ILOS_SFP_6,
RS_LOF, MS-
AIS,
Check line
GFP_CSF_
U (U=1,2)
Signal
Failure
AIS GDC_A_Sk Remote client
failure
(ILOS_SFP_U,
LOF_U,
LOSy_U,
(U=1,2)
Check the
optical path
before client of
remote
2xGE_FC
HW-syst
name
Alarm
type
Probable
cause Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
LOSy_U
(U=1,2)
Signal
Failure
Loss Of Frame
(LOF)
OCH_A_Sk Loss Of
Synchronization
Check optical
path before
client of
2xGE_FC
SIGNAL_D
EGRADE_
U (U=1, 2,
6)
signal
failure
degradedSignal
(DS)
OGPI The WDM
incoming signal
power is below
the acceptable
signal level.
Raised on
optical module
Check optical
path before
client of
2xGE_FC

8xGE

Table 8.54545455 8xGE board transmission alarms
HW-syst
name
Alarm
type
Probable
cause Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
RS_LOF Signal
failure
lossOfFrame
(LOF)
OCH/RS_A_Sk The signal frame
cannot be
recovered from
the output of the
STM64 receiver

RS_LBER Signal
degradation
lowBER (LBER) RS_TT Transmission
degradation

MS_RDI_
U (U= 1,2)
Maintenanc
e Indication
farEndReceive-
Faiure (FERF)
RS_TT far end receive
failure
Check line
MS_SSF_
U (U= 1,2)
Signal
Failure
serverSignalFail
ure (SSF)
RS_TT server signal
failure on remote
Check line

HW-syst
name
Alarm
type
Probable
cause Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance
line
LOSy_U
(U= 1,2)
Signal
Failure
lossOfSignal
(LOS)
OCH_A_Sk Loss of
synchronization
Check optical
path before
client of
2xGE_FC
ETHS_SS
F_U
(U= 1--9)

Signal
failure
reCeiVeFailure
(SSF)

GDC_A_Sk

remote client
failure
Check line.
ETHS_CS
F_U
(U= 1--9)

Signal
Failure

aIS (AIS) GDC_A_Sk remote client
failure
Check optical
path before
client
of remote
2xGE_FC
OCC10 board

Table 8.55555556 OCC10 boards transmission alarms
HW-syst
name
Alarm
type
probable-Cause
Default Severity
(SA/
NSA)
Trail
terminatio
n /
Adaptation
Meaning
and
remarks
Maintenance Rel
LOS_User_
Rx

LOC_User_
Rx
Signal
failure
loss Of Signal
(LOS)
signal input
power has
fallen below
the
acceptable
loss of signal
Check the
optical path
between user
and 1696MS.

Check receiver
2.0
HW-syst
name
Alarm
type
probable-Cause
Default Severity
(SA/
NSA)
Trail
terminatio
n /
Adaptation
Meaning
and
remarks
Maintenance Rel
level
LBER_User
_Rx
Signal
degradati
on
low BER (LBER) RS_TT Transmission
degradation
2.0
LBER_WD
M_Rx

LOF_SDH_
User _Rx
Signal
failure
loss Of Frame
(LOF)
OGPI/RS_A
_Sk
The signal
frame cannot
be recovered
from the
output of the
B&W
receiver
Check the
optical path
between SDH
and 1696MS.
Check
transmitted
signal in client
NE
2.0
LOS_WDM
_Rx
Signal
failure
loss Of Wavelength
(LOW)
OMS/OCH_
A_Sk
The WDM
incoming
signal input
power is
below the
acceptable
signal level
Check the
cabling between
MCC and OAC.
Check the WDM
line. Might not
be raised with
the use of
amplifier
2.0
lossOfSignal
(LOS)
OGPI_TT
(OCC10
remote)
Check the
optical path
between CPE
and 1696MS.
Check receiver.
2.2
LTCER_W
DM_Rx
Signal
degradati
on
low
ThresholdCorrected
Error Rate
(LTCER)
OMS/OCH_
A_Sk
Error rate has
fallen below
Low
threshold
limit
2.2

HW-syst
name
Alarm
type
probable-Cause
Default Severity
(SA/
NSA)
Trail
terminatio
n /
Adaptation
Meaning
and
remarks
Maintenance Rel
OGPI/
OCH_A_Sk
(OCC10
remote)

HTCER_W
DM_Rx
Signal
degradati
on
high Threshold
Corrected Error Rate
(HTCER)
OMS/OCH_
A_Sk
Error rate has
reached High
threshold
limit
2.2
OGPI/
OCH_A_Sk
(OCC10
remote)

LOF_OTN_
WDM_Rx
Signal
failure
loss Of Frame
(LOF)
OMS/OCH_
A_Sk
The signal
frame cannot
be recovered
fromthe
output of the
WDM
receiver
Check WDM
path for the
channel
2.2
OGPI/
OCH_A_Sk
(OCC10
remote)

LOF_SDH_
WDM_Rx
Signal
failure
loss Of Frame
(LOF)
OCH/RS_A_
Sk
The SDH
signal frame
cannot be
recovered
from the FEC
chip
Check WDM
path for the
channel
2.0
LOM_OTN
_WDM_Rx
Signal
failure
loss Of MultiFrame
(LOMF)
OMS/OCH_
A_Sk
The signal
multi-frame
cannot be
recovered
Check WDM
path for the
channel.
2.2
HW-syst
name
Alarm
type
probable-Cause
Default Severity
(SA/
NSA)
Trail
terminatio
n /
Adaptation
Meaning
and
remarks
Maintenance Rel
from the
output of the
WDM
receiver
OGPI/
OCH_A_Sk
(OCC10
remote)

SSF_User_
Rx
Signal
Failure
server Signal Failure
(SSF)
OGPI/RS_A
_Sk
Alarm
synthesis of
previous
raised alarms
see HW alarms 2.0
SSF_WDM
_Rx
Signal
Failure
server Signal Failure
(SSF)
OGPI/
OCH_A_Sk
Alarm
synthesis of
previous
raised alarms
see HW alarms 2.0
PTM Maintena
nce
Indication
Alarm
Payload Type
Mismatch
OCH/RS_A_
Sk
2.2a
OADM boards
The following alarm concerns OADM1, OADM2, OADM4 and OADM8 (DWDM)
boards.

Table 8.56565657 DWDM OADM boards transmission alarms
HW-syst
name
Alarm
type
Probable cause
Default Severity
(SA/NSA)
Trail
termination
/ Adaptation
Meaning and
remarks
Maintenance
ILOS Signal loss Of Multiplex OTS/ Optical input Check fiber

HW-syst
name
Alarm
type
Probable cause
Default Severity
(SA/NSA)
Trail
termination
/ Adaptation
Meaning and
remarks
Maintenance
failure Section (LOMS) OMS_A_Sk power level of the
first stage of the
demux input has
fallen below the
acceptable signal
level
break or
failure in
previous NEs
4xANY boards
4xANY
4xANY_S
4xANY_P. In this case, some more alarms are raised by SFP module.

Table 8.57575758 4xANY boards transmission alarms
HW-syst
name
Alarm
type
probable-
Cause
Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance Rel
LOS
(not in
the
4xANY_
P case)
Signal
failure
loss Of Signal
(LOS)
OSPI_TT optical signal
input power from
NE has fallen
below the
acceptable signal
level
Check the optical
path between NE
and 4xANY(_S).
Check receiver
1.1
LOF Signal
failure
loss Of Frame
(LOF)
OSPI/RS_A_Sk The signal frame
cannot be
recovered from
the output of the
STM16 receiver
Check the optical
path between
4xANY and
MCC
1.1
LBER Signal
degradati
low BER
(LBER)
RS_TT Transmission
degradation
1.1
HW-syst
name
Alarm
type
probable-
Cause
Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning and
remarks
Maintenance Rel
on
MS-RDI Maintena
nce
indication
far End
Receiver
Failure (FERF)
RS_TT MS-RDI has
been generated
by remote
corresponding
4xANY due to
network failure
on physical or
RS or MS layers,
or to the loss of
transponder link
Check
transponder link,
or SONET
SDH/WDM
network
1.3
All 4xANY drawers
The following alarms concern the HF_DRAWER, LF_DRAWER and
SDH_DRAWER drawers.

Table 8.58585859 SDH_DRAWER, HF_DRAWER and LF_DRAWER drawers
transmission alarms
HW-syst
name
Alarm type probable-Cause
Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning
and remarks
Maintenance Rel
ILOS_U
(U= 1,2,3
or 4)
Signal failure loss Of Signal
(LOS)
GMAU_TT Optical signal
input power
has fallen
below the
acceptable
signal level
Check the
optical path
before 4xANY
user.
Check
receiver
1.1

SSF_U
(U= 1,2,3
or 4)
Signal failure server Signal
Failure
(SSF)
GMAU_TT OR wired of
SDH alarms :
LOS, LOF,
MS-AIS, AU-
AIS, AU-
LOP, PLM,
SQM, LOM,
LOA
2.2
Pk-AIS_U
(U= 1,2,3
or 4)
Signal failure aIS (AIS) GMAU/
GDC_A_So
Loss of a
client in
remote
4xANY
Check optical
path before
client of
remote
4xANY
2.2
Pk-RDI_U
(U= 1,2,3
or 4)
Maintenance
indication
far End Receiver
Failure
(FERF)
GMAU_TT Pk-RDI has
been
generated in
remote
4xANY due
to the
detection of a
Pk_AIS
Find the origin
of Pk_AIS and
refer to
Pk_AIS
maintenance
2.2
Optical Spectrum Measurement Card (OSMC)
None.
Optical Protection Card (OPC)

Table 8.59595960 OPC transmission alarms
HW-syst
name
Default Severity
(SA/NSA)
Meaning and
remarks
Maintenance
SSF-i Signal failure Server Signal
Failure (SSF)
Alarm synthesis of
previous raised
alarms
See primary
alarms
SSF-e
(TRBD1996)
Table 8.60.1 TRBD1996 board transmission alarms
HW-syst
name
Alarm type probable-Cause
Default
Severity
(SA/NSA)
Trail
termination /
Adaptation
Meaning
and remarks
Maintenance Rel
LOC_LIN
E_Rx
l loss of clock.
Alarm not
displayed to
the operator.
Taken into
account in the
criteria to
raise the
ILOS_line_R
x on ogpiTTP
supported by
the line
XFP.
3.2
FEC_LTC
ER_LINE
Signal
degradation
lowThreshold-
Correctederrorrate
gdc_A_Sk 3.2
FEC_HTC
ER_LINE

Signal
degradation

highThreshold-
Correctederror-
Rate

gdc_A_Sk 3.2
OTU2_LO
F_LINE

Signal failure lossOfFrame
(LOF)

gdc_A_Sk loss of OTU2
frame
alignment
3.2
OTU2_LO
M_LINE

Signal failure lossOfMulti-
Frame (LOMF)

gdc_A_Sk loss of OTU2
multiframe
alignment
3.2
GEN_AIS_ Signal failure AlarmIndication- gdc_A_Sk Upstream 3.2

LINE
.
Signal (aIS)

defect has
been detected
RS_LOF_
LINE

(LOF)

rsTT The client
frame cannot
be recovered.
Case of SDH-
-like client
3.2
ETH_LOF
_LINE
(LOSy)

(LOF)
rsTT The Ethernet
frame cannot
be recovered.
Case of
Ethernet
client
3.2
RS_LBER
_LINE

Signal
degradation

lowBER (LBER) rsTT Transmission
degradation.
FromB1.Case
of SDH--like
client
3.2
ETH_LBE
R_LINE

Signal
degradation

degradation.
From 64b/66b
decoding.
Case of
Ethernet
client
3.2
LOC_USE
R_Rx

loss of clock.
Alarm not
displayed to
the operator.
Taken into
account in the
criteria to
raise the
ILOS_User_R
3.2
x on ogpiTTP
supported by
the line XFP.
RS_LOF_
USER

(LOF)

rsTT The signal
frame cannot
be recovered.
Case of SDH-
-like client
3.2
ETH_LOF
_USER
(LOSy)

(LOF)

rsTT The signal
frame cannot
be recovered.
Case of
Ethernet
client
3.2
RS_LBER
_USER

Signal
degradation

degradation.
from B1. Case
of SDH--like
client
3.2
ETH_LBE
R_USER
client
Signal
degradation

degradation.
from 64b/66b.
Case of
Ethernet

3.2

Power supply characteristics
Input Voltage range (from station batteries) - 40,5 V t - 48 V t - 57,0 V
- 50,0 V t - 60 V t - 72,0 V
DC/DC Power supply units output voltages + 3.6 V ? 3%
- 5.5 V ? 3%
+ 5.5 V ? 3%
+ 2.5 V ? 3%
Input current Compact shelf = 4 A max
1696MS shelf = 15 A max
Power supply interface according to ETS 300132-2

Power consumption
This product is designed for low power consumption. Developing new components
with very high integration density and low voltage supply leads to a significant
reduction of power consumption.
If necessary several configurations can be taken into account; depending on the
number and type of cards of the deployed configuration, the power consumption may
vary in a wide range.
Estimated max 1696MS power consumption 450W - a fully equipped shelf with 16 transponders
Estimated max 1696MS_C power consumption 150W - 4 channels line terminal (1 shelf)
Max power consumption per rack 1650W

Maximum power consumption of boards and units
Unit Maximum power consumption [W]
OMDX8100_M_xx, OADM1/2/4/8 0.5
CMDX-U, CMDX-U-S, CMDX2-U, CMDX2-U-S 3
CDMDX2-U, CDMDX2-U-S 3
COAD2_S (1/2/4 chs) 3
F1310 0.5
SPV_F_C_1310_1550, SPV_F_C 0.5
ESC 9.3
MCC1/ MCC2 16.8
MCC3 13.9
OCC10 22.6
TRBD1996 43
WLA1C 10
WLA2M, WLA2M_OP 26
WLA3CD, WLA3CDOP 19
2xGE_FC 20
8xGE
4xANY_P without drawers 20
4xANY_P with 4 drawers 32
Drawer 3 (each)
OAC2 and OAC2_L 18.5
SPVM, SPVM2 12
SPVM_H 11
OSC 4
EBRIDGE 3
MVAC 2
MVAC10 16
OSMC 9.7

OPC 0,5
OMSP 7.5
LAN 2.4
PSC 0.4 + P
sec
(*)
PSC2 0.4 + P
sec
(*) + (Ibatx0.4x2)
PSC3 0.4 + P
sec
(*) + (Ibatx0.4)
HK 2.5
RAI 2
UIC 2.6
FAN 20
FAN_C 9.6
(*) For each PSC board, P
sec
= 1/2 (P
shelf 5V
+ P
shelf 3.3V
) (1-0.85).
P
shelf 5V
is the power consumption of the 5V feed.
P
shelf 3.3V
is the power consumption of the 3.3V.
Abnormal service range
The 1696MSPAN equipment operating at -48 V does not suffer any damage when
subjected to the following voltage range : 0 V to -40,5 V and -57 V to -60 V.
When the equipment operates at -60 V the voltage range becomes: 0 V to -50 V and -
72 V to -75 V.
Protection to the station power supply is provided by 16A circuit breakers at the top of
the rack.
Mechanical characteristics
Rack mechanical compatibility ETSI ETS/E3, NEBS2000, Optinex compatible
1696MS subrack size 534 W x 270 D x 443 H mm
1696MS_C subrack size 446 W x 270 D (with cover) x 132 H mm
Boards size 285 mm high, 2-slot wide (8 TE) (4xANY)
285 mm high, 1-slot wide (4 TE)
88 mm high, 1-slot wide (4 TE)
1696MS Subrack weight 8.5 Kg for an empty Central Office shelf and
36.0 Kg for a fully populated Central Office
shelf with transponders, optical amplifiers,
mux/demux and common cards
1696MS_C Subrack weight 5.5 Kg for an empty Compact shelf and
12.5 Kg for a fully populated Compact shelf
with transponders, mux/demux and common
cards
Cooling Fans located at the bottom of the shelf
Rack cabling Vertical between rack and subrack front access
Electrical Connectors IEC 603/DIN 41612
IEC 807 (Sub-D)
IEC 169-1 (coax. 1.0/2.3)
BNC 50 O
BNC 75 O
RJ45
RJ11
Back-to-back installation Yes

Maximum weight of the boards and units
Unit Weight [Kg]
OMDX8100_M_xx 1.1
CMDX-U, CMDX-U-S, CMDX2-U, CMDX2-U-S 1.1
CDMDX2, CDMDX2_S 1.1
COAD2_S (1/2 chs) 1.1
COAD2_S (4 chs)
OADM4, OADM8 1.1
OADM1, OADM2 0.9
ESC 0.85
MCC/ MCC2 0.9
MCC3 1.0
OCC10 0.93
TRBD1996 0.88
WLA1C 0.66
WLA2M, WLA2M_OP 1.2
WLA3CD, WLA3CDOP 1.2
2xGE_FC 0.85
8xGE 0.75
4xANY(_S/_P) without drawers 1.25
4x ANY(_S/_P) with 4 drawers 1.65
Drawer 0.1 (each)
OAC 1.14
SPV_F_C_1310_1550 0.9
SPV_F_C 0.21
Unit Weight [Kg]
SPVM, SPVM2 0.79
OSC 0.2
EBRIDGE 1.1
MVAC 0.9
MVAC10 1.1
OSMC 1.1
OPC 0.18
OMSP 0.3
LAN 0.13
PSC, PSC2, PSC3 0.28
HK 0.13
RAI 0.12
UIC 0.12
FAN 2.2 (Fan module +filter)
FAN_C 0.330
Environmental characteristics
Main environmental aspects of Alcatel-Lucent products are:
energy consumption during manufacturing and use,
materials harmfulness and recyclability,
emissions to air, water or soil related to the manufacturing and the use of the product,
electromagnetic (EM) emissions,
value recovery at the product end of life.
The 1696MSPAN is designed to be compliant to both ETSI and ANSI standards.

The technical data of this chapter are referred to ITU-T Recommendations, ETSI
Standards or Telcordia (former Bellcore) standard.
Electromagnetic Compatibility (EMC) norms: ETSI compliancy
The CE markings printed on the product denote compliancy with the following
Directives:
- 89/336/EEC of May 3rd, 1989 (EMC directives), amended:
by the 92/31/EEC Directive issued on April 28th, 1992
by the 93/68/EEC Directive issued on July 22nd, 1993
Compliancy to the above Directives is declared, when the equipment is installed as for
the manifacturer handbooks, according to the following European Norms:
- EN 300 386 V1.3.2 (2003-05), environment Telecommunication Center
Warning This is a class A product EN55022. In domestic,
residential and light industry environments, this product may
cause radio interference in which case the user may be
required to take adequate measures.
Compliancy Class of Compact shelf on table configuration: B
Electromagnetic Compatibility (EMC) norms: ANSI compliancy
The electromagnetic compatibility requirements for the system are specified in the GR
- 1089 (see note).
The recommendations related to immunity and the radiated emission are located in the
sections, Electromagnetic Compatibility and EElectrostatic Dischargers
(ESD)Electrostatic Dischargers (ESD)Electrostatic Dischargers (ESD)lectrostatic
Dischargers (ESD).
N.B. GR - 1089 - CORE
Electromagnetic Compatibility and Electrical Safety - Generic Criteria for Network
Telecommunication equipment
issue 2, December 1997
Electromagnetic Compatibility (EMC) condition
For the EMC condition see also Electromagnetic Compatibility.
Waste from Electrical and Electronic Equipment (WEEE)
The marking printed on the subrack (refer to Figure 1 and Table 2.1 Label
referencesTable 2.1 Label referencesTable 2.1 Label references) denotes compliancy
with the Directive 2002/96/EC On Waste of Electrical and Electronic Equipment.
The general principle is the producer responsibility in the management of the products
he puts on the market when discarded by the owner. The producer responsibility now
covers the end of life of the products sold.
The European directive is effective in a country once transposed. The starting date for
the producer responsibility for the European text is 13th August 2005.
All Alcatel-Lucent products fall under in Category 3 of Annex 1A of the WEEE
directive (Directive 2002/96/ EC) i.e. IT and Telecommunication equipment under
item other products transmitting sound, images or other information by
telecommunications.
Alcatel-Lucent products fall under WEEE directive name: Other product or
equipment of transmitting sound, images or other information by telecommunications
in Annex 1B.
This mark will not cause any responsibility as all responsibilities will be defined by
contract.
Acoustical noise
The acoustical noise level of the product complies with:
ETS 300 753 Environmental Class 3.1 for attended telecommunication equipment rooms
(maximum sound level 7.2 bels)
The measurements have been performed according to the standards: ISO 3745 and ISO
7779
Environmental constraints
ETSI compliancy
The technical data of this chapter are, where it is possible, referred to ITU-T
Recommendations or ETSI Standards.
The system is designed for indoor operation with controlled air temperature. The
complete environmental conditions, including climatic, atmospheric and mechanical
conditions are specified in the ETS 300 019. The following environmental hazard
levels of this standard is applied.

Storage
The equipment meets the following requirements Vs. Storage:
ETS 300 019-1-2 : 1992, hazard level 1.2
hazard level 1.2 : weatherproofed, not temperature controlled storage location.
This hazard level applies to weatherproofed storage having neither temperature nor
humidity control. The location may have openings directly to the open air, i.e., it may
be only partly weatherproofed. The climatogram is shown in Figure 281354.
This hazard level applies to storage locations :
where equipment may be exposed to solar radiation and temporarily to heat radiation: They
may also be exposed to movements of the surrounding air due to draughts, e.g. through doors,
windows or other openings. They may be subjected to condensed water, dripping water and
to icing. They may also be subjected to limited wind-driven precipitation including snow;
where mould growth or attacks by animals, except termites, may occur;
with normal levels of contaminants experienced in urban areas with industrial activities
scattered over the whole area, and/or with heavy traffic;
in areas with sources of sand or dust, including urban areas;
with vibration of low significance and insignificant shock.
The conditions of this hazard level may occur in :
unattended buildings ;
some entrances of buildings ;
some garages and shacks.

Table 8.60 Main climatic conditions
Environmental parameter Unit Value
Low air temperature C -25
High air temperature C 55
Low relative humidity % 10
High relative humidity % 100
Low absolute humidity g/m
3
0,5
High absolute humidity g/m
3
29
Rain intensity mm/min no
Rate of change of temperature C/min 0,5
Low air pressure kPa 70
High air pressure kPa 106
Solar radiation W/m
2
1120
Movement of the surrounding air m/s 30
Condition of condensation - yes
Condition of precipitation - yes, wind-driven
precipitation
Condition of icing and frosting - yes
Climatogram 2 (ETS 300 019-
1-1)

0 1 0 2 0 3 0 4 0 5 0 6 0 7 0 8 0 9 0 1 0 0
2 0
R E L A T I V E A I R H U M I D I T Y %
A
I
R

T
E
M
P
E
R
A
T
U
R
E

0
C
A
B
S
O
L
U
T
E

A
I
R

H
U
M
I
D
I
T
Y

g
/
m
3
0.5
60
50
40
30
20
10
0
-10
-20
-30
-40

Figure 354281: Climatogram for hazard level 1.2: not temperature controlled
storage location

Transportation
The equipment meets the following requirements Vs. transportation :
ETS 300 019-1-1 : 1992, hazard level 2.2 (Careful transportation).
This hazard level applies to transportation where special care has been taken e.g. with
respect to low temperature and handling.
hazard level 2.2 covers the condition of hazard level 2.1. In addition hazard level 2.2
includes transportation in all types of lorries and trailers in areas with well-developed
road system.
It also includes transportation by ship and by train specially designed, shock-reducing
buffers. Manual loading and unloading of to 20 Kg is included.

High air temperature, air in unventilated enclosures C 70
High air temperature, air in ventilated enclosures or outdoor
air
C 40
Relative humidity % 95
Absolute humidity g/m
3
60
Rain intensity mm/min 6
Solar radiation W/m
2
1120
Heat radiation W/m
2
600

Climatic for operating conditions
The Equipment meets the requirements of ETSI Stand. without use of fans.
The functionality of the Equipment, Vs. Temperature, is in compliance with :
ETS 300 019-1-3 :1992 , hazard level 3.2.
hazard level 3.2: Partly temperature-controlled locations.
This hazard level applies to locations :
where installed equipment may be exposed to solar radiation and heat radiation. They may
also be exposed to movements of the surrounding air due to draughts in buildings, e.g.
through open windows. They may be subjected to condensed water and to water from sources
other than rain and icing. They are not subjected to precipitation;
where mould growth or attacks by animals, except termites, may occur;
with normal levels of contaminants experienced in urban areas with industrial activities
scattered over the whole area and/or with heavy traffic;
In close proximity to sources of sand or dust;
with vibration of low significance, e.g. for products fastened to light supporting structures
subjected to negligible vibrations.
The conditions of this hazard level may be found in:
entrances and staircases of buildings;
garages;
cellars;
certain workshops;
buildings in factories and industrial process plants;
unattended equipment stations;
certain telecommunication buildings;
ordinary storage rooms for frost resistant products and farm buildings...
0 1 0 2 0 3 0 4 0 5 0 6 0 7 0 8 0 9 0 1 0 0
1
2 0
R E L A T I V E A I R H U M I D I T Y %
A
I
R

T
E
M
P
E
R
A
T
U
R
E

0
C
A
B
S
O
L
U
T
E

A
I
R

H
U
M
I
D
I
T
Y

g
/
m
3
60
50
45
40
30
20
10
0
-10
-20
-30
-5
-40

Figure 355282: Climatogram for hazard level 3.2: partly temperature controlled
locations

High air temperature C 45
Low relative humidity % 5
High relative humidity % 95

Low absolute humidity g/m
3
1
High absolute humidity g/m
3
29
Rate of change of temperature C/min 0,5
High air pressure kPa 106
Solar radiation W/m
2
700
Heat radiation W/m
2
600
Condition of wind-driven rain, snow,... - no
Condition of icing - yes
Climatogram 2 (ETS 300 019-
1-3)
ANSI compliancy
The environmental constraints requirements for the system are also compliant with the
GR - 63 (see note).
N.B. GR - 63 - CORE
Network Equipment - Building System (NEBS) Requirements : Physical Protection
issue 1, October 1995

o9 HARDWARE SETTINGS
Overview
Purpose
COMMENT : Please add content.
Contents
Part Number and Change Status identification II-730
General safety rules and warnings II-733
Microswitches ON position II-736
OMDX, OADM and SPV_F hardware settings II-737
ESC hardware settings II-740
SPVM2 and SPVM_H hardware settings II-742
LANC (LAN access card) hardware settings II-746
MCC3 hardware settings II-749
OCC10 hardware settings II-751
Formatted: Indent: Left: 0", Bulleted + Level:
2 + Aligned at: 0.75" + Tab after: 1.5" +
Indent at: 0.75", Tab stops: 0.72", List tab +
Not at 1.25" + 1.5"

OCC10_E hardware settings II-753

This chapter contains the documents sheets to refer to for unit/sub-unit hardware
setting options.
Each paragraph is dedicated to a single unit/sub-unit or to a group of unit/sub-unit with
the same hardware settings.
Each paragraph contains:
- one or more tables defining the relationship between the functions achievable and
the setting options to make
- the unit layout drawing which shows the exact location of all the setting options.
In case of hardware setting modification in the same unit, all the different options are
presented in the same paragraph.
Details about identification Part Number and Change Status are defined in next
paragraph.
N.B.
S Z 1
I D E N T I F I E S P I N 1 O F T H E C O M P O N E N T

N.B. When necessary to make TC Hardware Settings fitted on the rear side of
the board, remove the protective cover plate present on the same rear side and
replace it at the end of the operation.
The setting options described in this chapter must be used according to the document
presented in Figure 283356, which shows the ON (CLOSED) position of
microswitches.
Those setting options that on the table are indicated by the caption For factory use
only should never be modified.
The Hardware Settings can be executed after having checked all the sub-units
belonging to a unit and by using the presetting indication presented in this chapter.

Part Number and Change Status identification
Each unit or sub-unit is distinguished by:
- a Part Number: ANV P/N (xxx.xxxxx xxyy) (NOTE)
The last two ANVP/N letters (yy, in the following stated as suffix) stand for a
feasible alternative, they might differentiate two units even though still
functionally compatible.
For example : the units having P/Ns 3AL-34065-AAAA and 3AL-34065-
AABA are functionally compatible and, as regards the hardware settings, the
hardware settings paragraph (described hereafter) is applicable for both.
- a design & production series (change status): ICS,
The following table shows an example of evolution of ANV P/N + ICS

Table 9.1 Example of ANV Part Number + ICS evolution

ANV CODE
P/N ICS
3AL 34422 AA AA 01
3AL 34422 AA AB 01
3AL 34422 AA AC 01

N.B. The P/Ns used in this example have no correspondence with those of the
actual equipment part list!
In this example you can see that the production series is identified by the suffix +
ICS in the ANV code.
Some of the possible positions of the labels indicating the units P/Ns and CS-ICS
are illustrated in Labels affixed to the Equipment.
As the Customer may have to manage many units of the same type (same Part
Number) but with different ICS, each hardware settings paragraph describes with
possible different parts the different setting options, according to all the possible P/N +
ICSs. For this purpose, when more than one setting versions are present, a table at
the beginning of the paragraph indicates the part to be used according to the
corresponding suffix + ICS, taking into account that:
a change of the production series does not necessarily imply a change in the setting options;
a change of the ANV P/N suffix does not imply a handbook change;
the SUFFIX and ICS must be meant as:
- from specified SUFFIX or ICS (included)
- to next SUFFIX or ICS (excluded) if listed
EXAMPLE
N.B. The P/Ns used in this example have no correspondence with those of the
actual equipment part list!
Take into account the same unit of the following table.
Supposing that the setting options valid for CS=01 are equal to those for CS=02,
but change for CS=03, the table at the beginning of the document 3AL 34422
AAAA MSZZQ will be:

Part in the paragraph ANV P/N
FROM SUFFIX FROM ICS
1 --AA 01
2 --AC 01

If you have the unit identified by one of this identification data:

ANV CODE
P/N ICS
3AL 34422 AAAA 01
3AL 34422 AAAB 01

you will use the Part 1 of the paragraph for 3AL 34422 AAAA

If you have the unit identified by one of this identification data:

ANV CODE
P/N ICS
3AL 34422 AAAC 01
3AL 34422 AAAD 01

you will use Part 2 of the paragraph for 3AL 34422 AAAA

General safety rules and warnings
W A R N I N G E M C N O R M S

WHEN CARRYING OUT THE GIVEN OPERATIONS OBSERVE THE
NORMS STATED.
SAFETY RULES

Caution Carefully observe the front-panel warning labels prior
to working on optical connections while the equipment is in-
service.
Should it be necessary to cut off power during the maintenance
phase, proceed to switch off the power supply units as well as
cut off power station upstream (rack or station distribution
frame)
SAFETY RULES

Caution A TNV-2 (battery) voltage could be present on R/M
interface connector (cable side); do not touch the pins when
unplugged.
Danger Possibility of personal injury. Short circuiting, low
voltage, lowimpedance, dc circuits can cause severe arcing
that can result in burns and/or eye damage. Remove rings,
watches, and other metal jewelry before working with primary
circuits. Exercise caution to avoid shorting power input
terminals.
SAFETY RULES

Danger Possibility of eyes damage: read carefully and strictly
observe the rules pointed out in Optical safety: general rules.
GENERAL RULES
(dummy covers, ESD connector protections, etc)
- In order to reduce the risk of damaging the electrostatic sensitive devices, it is
mandatory to use the elasticized band (around the wrist) and the coiled cord joined
connect with the ground rack when touching the equipment.
Caution FIXING THE UNITS (AND MODULES) INTO THE
SUBRACK
The screw tightening torque for fixing the units (and modules, if any and if fixed
by screws) into the subrack must be:
2.8 kg x cm (0.28 Newton x m) 10 %
Exceeding this value may result in screw breaking.

Microswitches ON position
The following figure shows all the available switch types front view and relevant
meaning.

Figure 356283: Microswitch front view and meaning

OMDX, OADM and SPV_F hardware settings
These units contain hardware settings: the switch position on the board and the
relevant meaning are reported in the following figures and table.
The sub-unit (METRO OAMDX CONTROL BOARD) P/N is 3AL 86638 AA--.
This unit belongs to (see Table 5.1 1696MS boards and units listTable 5.1 1696MS
and units list for the detailed list)
all the OMDX8100 board types
all the OADM8100 / 4100 / 2100 / 1100 board types
the SPV_F_1310_1550 board types.
For details about the use of this hardware setting refer to the Maintenance Handbook.

FRONT VIEW
F O R I N T E R N A L U S E O N L Y

REAR SIDE VIEW


Table 9.2 OMDX, OADM and SPV_F presetting table

I2 and I3 DIP switches are used to set CID (card identif ication) number in f unction of the board ty pe
(OMDX_8100_M_xx, OADM_8100_M_x_S or OMDX_4100_M_chxx_y y _S)
OADM_8100_M_x_S
OMDX_8100_M_xx
When the METRO OAMDX CONTROL board
(3AL 86638 AAAA) is part of an:
Of f
On
On
The HW setting are:
1
On
Of f
Of f
2
I2
Of f
Of f
On
1
Of f
On
On
2
Of f
Of f
On
3
Of f
On
On
4
I3
I D I P s w i t c h e s I 2 e I 3 s o n o u s a t i p e r p r e d i s p o r r e i l n u m e r o d i C I D ( i d e n t i f i c a z i o n e d i u n i t )
i n f u n z i o n e d e l t i p o d i b o a r d
OADM_4100_M_chxx-y y _S Of f

ESC hardware settings
This unit contains hardware settings: the switch position on the board and the relevant
meaning are reported in Figure 284357 and in ESC Presetting table.
The sub-unit (EQUIPMENT AND SHELF CONTROLLER) P/N is 3AL 86662 AA--.

FRONT VIEW
Figure 357284: ESC hardware settings

ESC Presetting table
Refer to correct SW Rel ease of the operator's handbook

SPVM2 and SPVM_H hardware settings
These units contain hardware settings: the switch position on the board and the
relevant meaning are reported in the following figures and table.
The sub-unit (PBA-CONTROL SPV-M) P/N is 3AL 86612 AA--.
SPVM2 board
SPVM_H board.


FRONT SIDE VIEW


REAR SIDE VIEW


Table 9.3 SPVM2 and SPVM_H presetting table

I1 DIP switch is used to set the operating mode of the board: NORMAL or TEST.
Only the f irst position is used
- Of f : NORMAL mode
- On: TEST mode
Il DIP switch I1 usato per settare il modo operativ o dell'unit : NORMAL o TEST
E' usata solo la prima posizione.

LANC (LAN access card) hardware settings
This unit contain hardware settings: the switch position on the board and the relevant
meaning are reported in Figure 285358 and in the following table.
The sub-unit (PBA-CONTROL LANC - LAN ACCESS CARD) P/N is 3AL 86617
AA--.
LAN_Q board
LAN_I board.
For details about the use of this hardware setting refer to the Maintenance
Handbook.


FRONT SIDE VIEW
Figure 358285: LAN_Q and LAN_I hardware settings

Table 9.4 Presetting table

*
= FACTORY PRESETTINGS
S h e l f T y p e
h a r d w a r e s e t t i n g
C M 1
C M 2
M a s t e r s h e l f
F i r s t d r o p s h e l f
S e c o n d d r o p s h e l f
T h i r d d r o p s h e l f
F o u r t h d r o p s h e l f
F i f t h d r o p s h e l f
a n d s o o n . . .
B
7
3
E
A
6
F
F
F
F
F
F
P e r l ' u s o d i C M 1 , C M 2 , C M 3 v e d i a n c h e i l M a n u a l e T e c n ic o & O p e r a t o r e
F o r C M 1 , C M 2 , C M 3 s e e a l s o T e c h n i c a l & O p e r a t o r ' s H a n b o o k
A L A N C b o a r d i n s t a l l e d i n a d r o p s h e l f , a t t h e s l o t 2 7 , o f O C P e q u i p m e n t m u s t
h a v e t h e p o i n t s 2 a n d 3 o f T C 1 5 c o n n e c t e d .
L ' u n i t L A N C i n s t a l l a t a n e l D r o p S h e l f n e l l o s l o t 2 7 d e l l ' a p p a r a t o O C P d e v e
a v e r e c o n n e s s o i p u n t i 2 e 3 d e l T C 1 5

MCC3 hardware settings
The sub-unit (PBA-MCC3 CONTROL BOARD) P/N is 3AL 95152 AA--.
Refer to Table 5.1 1696MS boards and units listTable 5.1 1696MS boards and units
listTable 5.1 1696MS boards and units listTable 5.1 1696MS boards and units list for
the detailed list of all the MCC3 boards P/N.

Figure 359286: MCC3 hardware settings


Table 9.5 MCC3 presetting table

Switch position (I1) Operation
1 = OFF 2 = OFF 3 = OFF 4 = ON MCC3
1 = OFF 2 = OFF 3 = OFF 4 = OFF MCC2

OCC10 hardware settings
The sub-unit (PBA-OCC10 CONTROL) P/N is 3AL 86785 AA--.
the detailed list of all the OCC10 boards P/N.
1
2
3
4
STM-64 /
10GbE WAN
10 GbE LAN

Figure 360287: OCC10 hardware settings


Table 9.6 OCC10 presetting table

M10 state Operation
3-4 linked by means of a jumper 10 GbE LAN
2-3 linked by means of a jumper STM-64 / 10 GbE WAN

OCC10_E hardware settings
The sub-unit (PBA-OCC10 XFP CONTROL) P/N is 3AL 95229 AA--.
the detailed list of all the OCC10_E boards P/N.

Figure 361288: OCC10_E hardware settings

Table 9.7 OCC10_E presetting table

Switch position (I1) Operation
1 = ON 2 = OFF 3 = OFF 4 = OFF 10 GbE LAN
1 = OFF 2 = OFF 3 = OFF 4 = OFF STM-64 / 10 GbE
WAN

III-784 Alcatel-Lucent Proprietary 8DG-17561-AAAA
Part III: MAINTENANCE
Overview
Purpose

Contents
MAINTENANCE III-757

8DG-17561-AAAA Alcatel-Lucent Proprietary III-785

10 MAINTENANCE
Overview
Purpose
Contents
Maintenance introduction III-758
Preventive maintenance III-761
Corrective maintenance (troubleshooting) III-767
Set of spare parts III-772
Repair Form III-773

Not at 1.75" + 2.13"
DISMANTLING & RECYCLING

See notice on first page Issue 1, March 2008

A T T E N T I O N E M C N O R M S
WHEN CARRYING OUT THE GIVEN OPERATIONS OBSERVE THE
NORMS STATED.

Maintenance introduction
General safety rules
SAFETY RULES

Caution Carefully observe the front-panel warning labels prior
to working on optical connections while the equipment is in-
service.
Should it be necessary to cut off power during the maintenance
phase, proceed to switch off the power supply units as well as
cut off power station upstream (rack or station distribution
frame)
SAFETY RULES

Danger Possibility of personal injury. Personal injury can be
caused by -48 V dc.
terminals.

8DG-17561-AAAA Alcatel_lucent Proprietary III-787

SAFETY RULES

Danger Possibility of eyes damage: read carefully and strictly
observe the rules pointed out in Optical Safety: general rules.
General rules
(dummy covers, ESD connector protections, etc)
- In order to reduce the risk of damage the electrostatic sensitive devices, is
mandatory to use the elasticized band (around the wrist) and the coiled cord joined
connect with the ground rack during the touching of the equipment
Maintenance aspects: definitions
Maintenance consists of a set of operations which maintain or bring back the assembly
to optimum operating conditions in a very short time, with the aim of obtaining
maximum operational availability.
Maintenance is classified as:
- ROUTINE (PREVENTIVE)
Routine (preventive) maintenance consists in carrying out a number of periodic
operations to minimize the risk of a failure on a link.
These operations can be scheduled or initiated by the equipment supervision
system.
- CORRECTIVE
Corrective maintenance consists in carrying out a minimum number of operations
to repair a fault as rapidly as possible.
These operations are initiated by the equipment supervision system and limited to
replacement of boards.
Definition of the technical level of the maintenance agent:
It is mandatory for the technicians in charge of the equipment maintenance to be
familiar with the measurement techniques used on equipment fitted with optical
connectors.


Instruments And Accessories
There is a local terminal (PC) which permits to display all the alarms and manages the
Equipment. The relative processing is described in the operators handbook.
Where TMN is implemented, an Operation System displays alarms and manages all
the connected Equipments of the network. Refer to the relevant handbooks.
The need of special tools and accessories to perform possible routine and corrective
maintenance procedures is described inside the procedures themselves.



Preventive maintenance


The Alcatel-Lucent1696MSPAN or 1696MS-C equipment requires no systematic
preventive maintenance. Only a routine maintenance is performed on the fans
Equipment.
Routine Maintenance every six months
It is suggested to carry out the following operations every six months:
- no-dust filter cleaning (ETSI rack) / substitution (ANSI rack)
No-dust filter cleaning / substitution
Caution NO-DUST FILTER CLEANING / SUBSTITUTION
Warning BEFORE INSTALLING OR REMOVING THE NO-DUST
FILTER, CHECK THAT THE PROTECTIVE ADHESIVE FILM HAS
BEEN REMOVED.
SAFETY RULES

caused by -48 V dc.
terminals.


SAFETY RULES

caused by rotating fans.
Every six months is has to be performed the following operations
- ETSI rack: cleaning the no-dust filter, either on FAN and FAN_C units
- ANSI rack: substitute the no-dust filter, either on FAN and FAN_C units

Note: the period of one year is only indicative; according to the environmental
conditions could be necessary to reduce this period.



See Figure 289362. Only on FAN_C no-dust filter, it is necessary to pull out the
FAN_C unit following the procedure below described:
- unscrew the two screws (1) ensuring the FAN_C to the compact shelf
- insert the extractor in (2) and pull out to extract the FAN_C from the shelf
- unscrew the screw (3) ensuring the no-dust filter to the FAN_C and extract the no-
dust filter (4).
To re-insert the FAN_C into the shelf
- insert the no-dust filter (4) to the FAN_C
- screw the screw (3) to ensure the no-dust filter into the FAN_C
- properly insert the FAN_C into the shelf
- screw the two screws (1) to ensure the FAN_C to the compact shelf



F A N _ C ( f o r 1 6 9 6 M S _ C )
E X T
P M U
F A N
F I L
T E R
1 3
4
2
n o - d u s t f i l te r

Figure 362289: FAN_C: no-dast filter extraction



Routine Maintenance every year
It is suggested to carry out the following operations yearly:
- power cables check
Power cables check
SAFETY RULES

caused by -48 V dc.
terminals.
It is suggested to carry out the following operations yearly:
Check that the power cable is perfectly safety grounded.
Make sure that the subrack has been tightly fastened to the rack with screws, to guarantee
grounding (the rack is connected to the station ground).
Routine Maintenance every five years
It is suggested the replacement of each FANS unit (FAN and FAN_C) after five years
of working.



Corrective maintenance (troubleshooting)


Since the Troubleshooting procedure is carried out with the use of the Craft Terminal ,
please refer ,for details, to the Maintenance Section of the Operators Handbook.

Caution FIXING THE UNITS (AND MODULES) INTO THE SUBRACK
The screw tightening torque for fixing the units (and modules, if any and if fixed by
screws) into the subrack must be:
2.8 kg x cm (0.28 Newton x m) 10 %
Exceeding this value may result in screw breaking.
The following paragraph can be used as an help during corrective actions.



Fault location: alarm & status indication
This chapter guides you to localize the defaults occurring on the NE. Starting from an
alarm indication, it helps you to find the cause of the default and decide what has to be
done to correct it.
Fault location can be performed by following simple rules. First, transmission domain
alarms have to be checked to locate the degraded NE. Then, when the faulty NE is
identified, equipment domain alarms are checked to locate degraded board or the faulty
optical connection.
To give the operator the possibility to localize the faults, a few alarms are available:
in a terminal:
- on each transponder MCC (no OCh-overhead):
Loss of power at Rx side (WDM or user side)
Loss Of Clock at Tx side (given by the CDR, WDM or user side)
Laser degradation (WDM or user side)
- LOS detection at equipment output (OLOS)
- LOS detection at equipment input (ILOS)



TX
WDM
RX
WDM
M
U
X
ILOS
B&W
RX
B&W
TX
LOC LDG
ILOS LDG LOC
SPV
LB
SB
M
U
X
LB
SB
SPV
D
M
U
X
D
M
U
X
ILOS
OLOS

Figure 363290: position of the alarms in a terminal

in an OADM:
- on each transponder MCC (no OCh-overhead):
Loss of power at Rx side (WDM or user side)
Loss Of Clock at Tx side (given by the CDR, WDM or user side)
Laser degradation (WDM or user side)
LBER at user Rx (based on B1 calculation - only for SDH/SONET signals)
- LOS detection at equipment output (OLOS)
- LOS detection at equipment input (ILOS)


pass-through channels
RX
WDM
TX
WDM B&W
TX
B&W
RX
RX
WDM
TX
WDM
B&W
TX
B&W
RX
M
U
X
D
M
U
X
M
U
X
D
M
U
X
pass-through channels
SPV & ILOS
SPV
SPV
ILOS LDG LOC ILOS LDG LOC
ILOS LOC LDG ILOS LOC LDG
SPV & ILOS
OLOS
OLOS

Figure 364291: position of the alarms in an OADM

Alarms on transponders are described in the corresponding chapter (Multirate Channel
Card III (MCC3)). Further information are also provided in Equipment domain alarms
and Optical transmission domain alarms.
Alarms on terminals input/output and on OADM output are described with OMDX and
OADM units.



Set of spare parts
Suggested Spare Parts
The overall number of spares depends on Customer requirements, and should be based
on the average amount of transmission circuits available to be accounted for not only
during MTBF but also during MTTR; the latter depending on the amount of spare parts
available.
The set of spare parts is inclusive of a minimum number of spares for each type of
replaceable plug-in unit (see unit list in 1696MS Part list ).
General rules on spare parts management
Before storing the spare units make sure that they are working by inserting them in an
operating equipment
It is suggested to periodically check those spare units have not been utilized for over a
year.
If the spare parts and the equipment are stored in the same environment, make sure that
the spare parts are placed in cabinets to safeguard them from dust and damp.
Moreover, they should also be well grounded to avoid electrostatic discharges.
If the spare parts are stored in another room, or have to be moved from another place,
building or site, make sure that the following is observed:
the spare parts must be wrapped in anti-static and padded envelopes;
the spare parts must not touch wet surfaces or chemical agents that might damage them
(e.g. , gas);
if during transport the temperature is lower than that of the room where they had been kept,
make sure that before using them they pass a certain period in a climatic chamber to prevent
thermal shocks and/or the possibility of steaming up.
When replacing a unit/sub-unit, make sure that the spare unit/sub-unit is set
exactly as the replaced one. For the presettings procedures see section
HARDWARE SETTING documentation.

Particular rules on spare parts management
Whenever some units with flashmemories are common to different kinds of
equipment or to different versions of the same type of equipment, it is possible to
maintain one spare part only: this allows spare part stock saving, even though software
downloading will be necessary when the software loaded into the unit (program part or


data part) is different from that necessary in the equipment where the spare unit must
be used.
At the end of the commissioning phase or after an equipment data change, it is
suggested to save the equipment data, e.g. on floppy disk, and store this floppy disk in
the spare part stock pointing out the equipment it refers to.
Repair Form
To facilitate repair operation, data on the faulty unit must be reported on the form
The repair form must be filled-in with as much data as possible and returned to
Alcatel-Lucent together with the faulty unit.



REPAIRFORM
Fill in this f orm and af f ix it to the f aulty unit to be returned to Alcatel
T
O

B
E

F
I
L
L
E
D

I
N

B
Y

T
H
E

S
E
N
D
E
R
FAULT PHASE
INSTALLATION /
OPERATION
MAINTENANCE
REASON FOR REPAIR
CLEAR FAULT
INTERMITTENTFAULT
TEMPERATUREFAULT
DROPIN PERFORMANCE
UPGRADE/QUALITYALERT
PRESUMED CAUSE
INTERNAL
LIGHTNING
AIR COND.
OTHER
EXTERNAL
FAULTSTILL PRESENT
AFTER REPAIR
COMMENTS
NAMEOFSENDER
PROCESSING
NOFAULTSFOUND
STANDARD REPAIRING
QUALITYALERT
UPGRADE
NOTREPAIRABLE
SUBSTITUTED
(REJECTED)
TURN ON TURN ON
A
B-D
I
I
M
S-X
FAULTS DETECTED
SOLDERING/ ADJUSTMENT
CORROSION
C
P
V3
COMPONENT
MECHANICAL PRINTED
F-L
V1 V1
DIRT
OTHER
V2
CIRCUITBOARD
DATE REPAIRINGNUMBER REPAIRINGCENTRE NAMEOFREPAIR OPERATOR
COMMENTS
T
O

B
E

F
I
L
L
E
D

I
N

B
Y

T
H
E

R
E
P
A
I
R

O
P
E
R
A
T
O
R
DATE
CUSTOMER NAME ORDER NUMBER/CONTRACTNUMBER
SITE BRANCH/UNIT/COUNTRY
SYSTEM/EQUIPMENT PRODUCTRELEASE EQUIPMENTSOFTWAREPARTNUMBER
SLOT SUBRACK STATION/RACK
MNEMONIC
SERIAL NUMBER
ALCATEL PARTNUMBER
FAULTYUNITSOFTWAREVERSION
NOTE:LETTERSAREFOR FACTORYUSE
WIRING
A L CA T E L

Figure 365292: Repair form


8DG-17561-AAAA Alcatel_lucent Proprietary IV-803

Part IV: DISMANTLING &
RECYCLING
Overview
Purpose

Contents
DISMANTLING & RECCLIYNG IV-777

Issue 1, February 2008 See notice on first page

-11 DISMANTLING & RECYCLING
Overview
Purpose
Contents
WEEE general information III-778
How to disassembly the equipment III-779
Eco declaration III-809

Not at 2.25" + 2.5"

IV-806 Alcatel-Lucent Proprietary 8DG-17561-AAAA

WEEE general information
According to the European directive (2002/96/EC) Waste Electric and Electronic
Equipment, from August 13
th
2005 the producer of the equipment being sold, unless
otherwise specified in the contract with the Customer, is resposible for collecting and
treating Electrical and Electronic Equipment.
Equipment put on the market after August 13
th
2005 have a label (refer to Labels
affixed to the Equipment) affixed on the product. The presence of the black label
indicates the product has been put on the market after after August 13th 2005.
In next paragraphs is given a description example of how to disassemble an equipment;
the same principle can be applied to all the subracks and units composing the
equipment.
The unit chosen for disassembly is one of the most complex.
How to disassemble the equipment describes how to disassemble the equipment in detail:
- lists the tools necessary for disassembly
- describes the subrack disassembly
- describes the unit disassembly
- describes the procedure to apply in order to manage Hazardous materials and
components (example battery)
Eco declaration reports the ECO declaration info.



How to disassembly the equipment
This equipment is designed for easy disassembly, by using screws and rivets for
mechanical assembly of subracks and modules. The variety of screw types is
minimized.
Tools necessary for subrack and units disassembly are reported in How to disassemble
the equipment Tools necessary for disassembly.
The disassembly process depends on the respective recycling methods and can be
derived from the delivered assembly instructions of the product.
These guidelinesare not mandatory.
They are given in order to optimize the disassembling process and material recovery as
whole.
Tools necessary for disassembly
The following tools are necessary for unit disassembly:
# T9 TORX screw driver
# T20 TORX screw driver
Crosshead screwdriver
Wrench #
Scissors
Protection gloves



Subrack disassembly
In Figure 293366 is shown an example of subrack.
The same rules can be applied to the specific equipment to be dismantled.
In order to disassemble the subrack first remove the boards eventually present,
included termination bus.

S U B R A C K F R O N T V I E W S U B R A C K R E A R V I E W

Figure 366293: Subrack front and rear view



Procedure:
1. Remove the two screws (A) in order to disassemble the handle as reported in Figure
294367.
2. Repeat the same procedure on the other handle.
3. Separate the two plastic blocks of the handle as reported in Figure 294367.
plastic block
plastic block
A
A

Figure 367294: Handle removing and disassembly

4. Unscrew all the screws present on rear cover as reported in Figure 295368 (dashed
lines).
5. Remove the rear cover in order to access the subrack Back Panel.


Figure 368295: Rear cover removing



6. Unscrew all the screws fastening the Back Panel to the mechanical structure of the
subrack as indicated in Figure 296369 (dashed line).
7. Remove the Back Panel from the subrack mechanical structure.


Figure 369296: Back Panel removing



8. Remove the upper and lower guides from the subrack access area by unscrewing the
relevant screws as indicated in Figure 297370.


Upper and Lower guides
A
C
C
E
S
S

A
R
E
A
B
A
S
I
C

A
R
E
A

Figure 370297: Upper and lower guides plane removing



9. Remove the side wall by unscrewing the relevant screw as indicated in Figure
298371.
10. Remove the two contact springs from the side wall as indicated in Figure 299372
(refer to Hazardous materials and components for info about hazardous parts
dismantling).


Figure 371298: Side wall removing



11. Remove the two guides of the basic area and the two optical fiber ducts by pulling
pulling them out as indicated in Figure 299372.
12. Unscrew all the screws present on the other side wall in order to complete the
subrack disassembly.


guides guides
Optical f iber duct
Optical f iber duct
contact spring
contact spring

Figure 372299: Optical fiber duct, guides and contact spring removing



Unit disassembly

Procedure:
1.13. Remove twe two screws (A) from the side coverplate as indicated in Figure
300373.


A
A

Figure 373300: Side coverplate removal

2.14. Remove the screws (B) that fix the two levers and subsequently pull out them
from the front plate as indicated in Figure 301374.


B
B

Figure 374301: Levers removal


3.15. Unscrew and extract the two optical connectors (C) as indicated Figure 302375.
4.16. Remove the screw (D) fixing the connectors support as indicated in Figure
302375.
5.17. Rotate the connectors support (E) and pull it sidely to be removed as indicated
Figure 302375.


D
E
C

Figure 375302: Optical connectors support removal



6.18. Remove the two screws (F) from the side coverplate as indicated in Figure
303376.
7.19. Extract from the top the contact spring (G) as indicated in Figure 303376 (refer to
Hazardous materials and components for info about hazardous parts dismantling).
8.20. Extract the fibers from the cavity (H) as indicated in Figure 303376..


F
F
G
H

Figure 376303: Side coverplate and contact spring removal



9.21. Disconnect the two flat cables (M) as indicated in Figure 304377.
10.22. Unscrew (L) connectors with the aid of a wrench as indicated Figure 304377.
11.23. Remove the fibers (N) from supports pulling them out Figure 304377.
12.24. Remove the two screws (O) on the other side of the board that fixes the dissipator
to the Printed Circuit Board (PCB) as indicated in Figure 305378.
13.25. The dissipator can now be removed (refer to Figure 306379.


L
L
L L L
L M
M
N
N
Figure 377304: Internal connectors removal



O

Figure 378305: Dissipator removal

14.26. Remove the screws (P) from dissipator as indicated in Figure 306379.
15.27. Now the two modules on the other side of the dissipator are free to be removed
(refer to Figure 308381);
Pay attention during modules removal because of white conductive paste (refer to
Hazardous materials and components for info about hazardous parts dismantling).


16.28. Remove the plastic part (X) in Figure 307380 by unscrewing the screw present on
the rear side of the dissipator.
P P
P
P
P
P
P
P

Figure 379306: Modules removal from dissipator

17.29. Remove the screws (Q) and (R) that fix the daugther board and pull it out from
the mother board (refer to Figure 307380).


Q
Q
R
R
DAUGHTER BOARD
MOTHER BOARD
X

Figure 380307: Daughter boad removal

18.30. Cutaway golded connector (S) from daughter board (refer to Figure 308381).


S

Figure 381308: Gold connector removal



19.31. Remove all internal cables as indicated in Figure 309382. To remove cables it is
enough to pull them out from their support.

Figure 382309: Internal cables removal

20.32. Remove screws (T) that fix the metal support to the mother board as indicated in
Figure 310383.
21.33. Remove the metal support.
22.34. Cutaway the golded connector (U) from mother board.


T
T
T
U
M e t a l s u p p o r t

Figure 383310: Connector metal support removal



Hazardous materials and components
The following table lists the presence or not of hazardous substance/components.
Note: The system cabling is designed for reduced halogen content. All the traffic
cabling is fully PVC free.

Table 11.1 List of hazardous materials and components present in the
equipment
Materials/substances Presence
in the
equipment
Where
Batteries External
(Mercury/NiCad/Lithium/Other)
NO
Batteries Internal
(Mercury/NiCad/Lithium/Other)
NO
Mercury NO
Cadmium NO
Capacitors with PCBs
Capacitors with substances of concern +
height > 25 mm, diameter > 25 mm or
proportionately similar volume
NO
Gas discharge lamps NO
Mercury containing Backlighting lamps NO
Plastic containing brominated flame
retardants other than in Printed Circuit
Assemblies
NO


in the
equipment
Where
Liquid Crystal Displays with a surface
greater than 100 cm2
NO
Asbestos NO
Refractory ceramic fibres NO
Thermal conductive paste YES In all units where dissipators are present a
withe thermal conductive paste is used in
between mechanical parts.
In Figure 307380 an example is shown.
Note: protective plastic
gloves must be used in
order to avoid contact
between hands and
thermal conductive
paste.
Pay attention to avoid
contact of thermal
conductive paste with
eyes.
Radio-active substances NO
Beryllium Oxide NO

Other forms of Beryllium YES Refer to Figure 299372 and Figure
303376 point G.
Note: Copper-beryllium
contact spring must be
separated from other
material and must be
fused in a specific
regulated environment.


in the
equipment
Where
Pressure volume NO
Liquids Volume NO
Gasses Volume NO
Hidden mechanical springs or other
equivalent parts
NO
Ozone depleting substances, according to
those categories that are already banned
in the Montreal protocol
NO
Chloroparaffins with chain length 10-13
C atoms, chlorination greater than 50%
contained in mechanical plastic parts
heavier than 25g,
NO
Lead contained in mechanical parts
heavier than 25g,
NO
Polychlorinated biphenyls (PCB) or
polychlorinated terphenyls (PCT),
NO
Polybrominated biphenyls and their
ethers (CAS no. 32534-81-9, CAS no.
32536-52-0, CAS no 1163-19-5, CAS no.
13654-09-6) contained in mechanical
parts heavier than 25g, in concentrations
exceeding the natural background levels.
NO



Eco declaration
1696 Metro Span is a Wavelength Division Multiplexing (WDM) system.

Weight and Dimensional Characteristics
Refer to Mechanical characteristics.

EXTENSION OF SYSTEM LIFETIME
The product is designed to ensure an outstanding quality of service through very high
reliability figures. The architecture facilitates all kinds of future evolutions:
On-site configuration changes as e.g.:
- Extension of the add/drop capacity without service interruption
- Self-adjustment of optical amplifiers in case of change in the traffic volume
Implementation of new features and functionalities by remote Software download
Extendibility can be achieved by increasing the add/drop capacity without traffic impact
and/or by increasing the bit rate per optical channel
Upgradibility is ensured by a versatile multiplexing architecture that allows to upgrade the
system in-service from 1 channel to the 32 channels, i.e. the full system capacity.
The terms and conditions of warranty, service availability and spare parts availability
are individually agreed between Alcatel-Lucent and the Customer and are part of the
relevant contractual commitments.

POWER CONSUMPTION
Refer to Power consumption.

RADIO FREQUENCY EMISSION
Regarding compliance with radio frequency emission requirements refer to
Electromagnetic Compatibility (EMC) norms: ETSI compliancy and Electromagnetic
Compatibility (EMC) norms: ANSI compliancy.

ACOUSTICAL NOISE


Refer to Acoustical noise.
MATERIALS
Refer to Table 11.1 List of hazardous materials and components present in the
equipmentTable 11.1 List of hazardous materials and components present in the
equipmentTable 11.1 List of hazardous materials and components present in the
equipmentTable 11.1, List of hazardous materials and components present in the
equipment, for details.
DISASSEMBLY
Refer to How to disassemble the equipment and Tools necessary for disassembly
BATTERIES
The product requires no backup batteries.
PACKAGING
The packaging of this Alcatel-Lucent equiment complies with the directive 94/62/EEC
concerning packaging and packaging waste. Depending on the means of transportatio,n
the racks are packed in a cardboard or wooden box, which can easily be recycled after
use. Environmentally harmful materials are not used for packaging. The packaging
materials are marked according to ISO 11 469. If required by the Customer and agreed
by both parties, Alcatel-Lucent can take care of the proper disposal of all packaging
materials.
For details refer to Installation Handbook.
TAKE BACK INFORMATION
On request of customers, Alcatel-Lucent can take care of the take back of depreciated
equipment and of the ecological safe and appropriate disposal under conditions to be
agreed.
For that purpose Alcatel-Lucent co-operates with qualified companies.
DOCUMENTATION
In order to reduce paper consumption for Customer Documentation, Alcatel-Lucent
delivers the Generic Customer Documentation on a CD-ROM. The CD-ROM contains
interactive HW Descriptions, SW Descriptions, Functional Descriptions, Maintenance
Manuals and User Guides. This allows the operator to put the documentation on a
server accessible by all relevant people in the organization without any additional
paper copies.


Additionally more specific documentations as e.g. information about products and
solutions, services and support, training events etc. will be provided by means of
Alcatel-Lucent website accessible by all customers. This will allow distribution of up-
to-date information very quickly and without wasting natural resources.
The Customer documentation is made under use of paper (80 g/m2) which is elemental
chlorine-free bleached.


12 LIST OF ABBREVIATIONS
A/D Add and Drop functionality
ADM Add and Drop Multiplex
AIS Alarm Indication Signal
ALC Automatic Laser Control
ALS Automatic Laser Shutdown
APD Avalanche Photo Detector (photodiode technology)
APE Automatic Power Equalization
APS Automatic Protection switching
APSD Automatic Power ShutDown
AS Alarm Surveillance
ASAP Alarm Severity Assignment Profile
ASIC Application Specific Integrated Circuit
AT ATtended Alarm
ATTD ATtended (Alarm storing)
AU Administrative Unit
AUI Attachment Unit Interface for LAN connection
BER Bit Error Rate
B&W Black and White
BOL Beginning of Life
CBR Constant Bit Rate


CDR Clock and Data Recovery
Ch Channel
CID Card IDentifier
CLEI Common Language Equipment Identification
CPE Costumer Premises Equipment
CSF Communication Subsystem Failure
CT Craft Terminal
CWDM Coarse Wavelength Division Multiplex
DCC Data Communication Channel
DCN Data Communication network
DCU Dispersion Compensating Unit
DFB Distributed Feedback Bragg
DDM Digital Diagnostic Monitoring
DEMUX Demultiplexing
DTMF Dual Tone Modulation FrequencyDTV (Decision Threshold voltage)
DTV Decision Threshold voltage
DV Digital Video
DWDM Dense Wavelength Division Multiplex
EC Equipment Controller
ECC Embedded Channel Communication
ECID Enhanced Card IDentifier
ECC Embedded Channel Communication
ECMA Standardizing information and communication system
(Formerly European Computer Manufacturers Association)
ECT Equipment Craft Terminal
EEPROM Electrically Erasable Programmable Read Only Memory
EMC Electromagnetic compatibility


EMI Electromagnetic Interference
EML Equipment Management Layer
EOL End Of Life
EOW Engineering Order Wire
ESC Equipment and Shelf Controller
ESD Electrostatic Discharges
ETSI European Telecommunication Standard Institute
EXP Expansion
FC Fiber Channel
FDI Forward Defect Indication
FE Fast Ethernet
FEC Forward Error Correction
FIT Failure In Time
FPGA Field Programmable Gate Array
GbE Gigabit Ethernet
GCC Generic Communication Channel
GFP-T Generic Frame Procedure Transparent mode
HDLC High Level Data Link Control
HK HouseKeeping
HW HardWare
HWF HardWare Failure
IEC International Electrotechnical Commission
I/F Interface
ILM Integrated Laser Modulator
ILOS Input Loss Of Signal
IND INDeterminate
I/O Input/Output
IOPV Input Optical Power Voltage


IP Internet Protocol
ISO International Standard Organization
ISPB Intra Shelf Parallel Bus
ISSB Intra Shelf Serial Bus
IT Inter-stage
ITU_T International Telecommunication Union -Telecommunication
LAN Local Area Network
LAPD Link Access Protocol D
LB Long Band
LH Long Haul
LOC Loss Of Clock
LOF Loss Of Frame
LOS Loss Of Signal
LED Light Emitting Diode
LSD Laser ShutDown
LT Line Terminal
MAC Medium Access Control
MCC Multi Channel Card
MMF Multi Mode Fiber
MS Multiplex Section
MVAC Multi Variable Attenuation Card
NE Network Element
NDC Negative Dispersion Chromatic
NES Network Element Synthesis
NML Network Management Layer
NMS Network Management System
NNI Network Node Interface


NSAP Network Service Access Point
NTP Network Time Protocol
NURG Not URGent
OAC Optical Amplifier Card
OADM Optical Add and Drop Multiplexer
OAM Operator Alarm Maintenance
OBPS On Board Power Supply
OCH Optical Channel
OCHA Optical Channel Adaptation
ODU Optical channel Data Unit
OFA Optical Fiber Amplifier
OGPI Optical Generic Physical Interface
OMDX Optical Multiplexer and DemultipleXer
OMS Optical Multiplex Section
OMSA Optical Multiplex Section Adaptation
OOPV Output Optical Power Voltage
OPC Optical Protection Card
OS Operation System
OSC Optical Supervisory Channel
OSMC Optical Spectrum Monitoring Card
O-SNCP Optical Sub-Network Connection Protection
OSNR Optical Signal Noise Ratio
OSPI Optical Generic Physical Interface
OTN Optical Transport Network
OTS Optical Transmission Section
OTSP Optical Transmission Section Protection
OTU Optical channel Transport Unit
PDH Plesiochronous Digital Hierarchy


PDL Polarization Dependent Loss
PDU Power Distribution Unit
PI Physical Interface
PIN Positive - Intrinseque - Negative (photodiode technology)
PMA Physical Medium Attachment
PMD Physical Medium Dependent
PM Performance Monitoring
PMU Power Management Unit
PVID Port Virtual IDentifier
PSC Power Supply Card
Q3 Interface with Q3 Protocol
QECC Interface with Q protocol for Embedded Control Channel
QoS Quality of Service
RAM Random Access Memory
RAI Remote Alarm Interface card
RDI Remote Defect Indication
RECT REmote Craft Terminal
RI Remote Inventory
RUM Replaceable Unit Missing
RUP Replaceable Unit Problem
RUTM Replaceable Unit Type Mismatch
RX Receiver
SB Short Band
SC Shelf Controller
SD ShutDown
SDH Synchronous Digital Hierarchy
SH System Handler


SFP Small Formfactor Pluggable
SMF Single Mode Fiber
SMSR Side Mode Suppression Ratio
SNCP Sub-Network Connection Protection
SPI Serial Peripheral Interface
SPVM SuPerVision Module
SSF Server Signal Failure
SWDL SoftWare DownLoad
SWP SoftWare Product
TCA Threshold Crossed Alarm
TCP Transmission Control Protocol
TCP/IP Transmission Control Protocol/Internet Protocol
TDM Time Division Multiplexing
TRU Top Rack Unit
TMN Telecommunication Management Network
TP Termination Point
TRU Top Rack Unit
TTP Trail Termination Point
TX Transmitter
UEP Unequipped Equipment Present
UIC User Interface Card
UNI User Network Interface
URG URGent
USM User Service Manager
VHM Virtual Hardware Machine
VLAN Virtual Local Area Network
VOA Variable Optical Attenuator
WAN Wide Area Network


WIS Wan Interface Sublayer
WDM Wavelength Division Multiplexing
XFP 10Gbps Formfactor Pluggable

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Alcatel-Lucent 1696MSPAN

32 + 32 CHANNELS DWDM SYSTEM

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