BC847/BC547 Series: 1. Product Profile
BC847/BC547 Series: 1. Product Profile
BC847/BC547 Series: 1. Product Profile
1. Product profile
1.1 General description
NPN general-purpose transistors.
Table 1:
Product overview
Package
PNP complement
Philips
JEITA
BC847
SOT23
BC857
BC847W
SOT323
SC-70
BC857W
BC847T
SOT416
SC-75
BC857T
BC847AM
SOT883
SC-101
BC857AM
BC847BM
SOT883
SC-101
BC857BM
BC847CM
SOT883
SC-101
BC857CM
BC547 [2]
SOT54
SC-43A
BC557
[1]
[2]
Also available in SOT54A and SOT54 variant packages (see Section 2).
1.2 Features
Low current
Low voltage
Three different gain selections
1.3 Applications
General-purpose switching and amplification
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCEO
collector-emitter voltage
open base
45
IC
100
mA
hFE
DC current gain
110
800
hFE group A
110
180
220
hFE group B
200
290
450
hFE group C
420
520
800
VCE = 5 V;
IC = 2 mA
BC847/BC547 series
Philips Semiconductors
2. Pinning information
Table 3:
Pinning
Pin
Description
Simplified outline
Symbol
base
emitter
collector
3
1
sym021
006aaa144
SOT883
1
base
emitter
collector
3
3
1
Transparent
top view
2
sym021
SOT54
1
emitter
base
collector
3
1
2
3
2
1
001aab347
sym026
SOT54A
1
emitter
base
collector
3
1
2
001aab348
sym026
SOT54 variant
1
emitter
base
collector
3
1
2
3
001aab447
2
1
sym026
2 of 13
BC847/BC547 series
Philips Semiconductors
3. Ordering information
Table 4:
Ordering information
Package
Name
Description
Version
SOT23
BC847W
SC-70
SOT323
BC847T
SC-75
SOT416
BC847AM
SC-101
SOT883
SC-43A
SOT54
BC847
BC847BM
BC847CM
BC547 [2]
[1]
[2]
Also available in SOT54 and SOT54 variant packages (see Section 2 and Section 9).
4. Marking
Table 5:
Marking codes
Type number
Type number
BC847
1H*
BC847AT
1E
BC847A
1E*
BC847BT
1F
BC847B
1F*
BC847CT
1G
BC847C
1G*
BC847AM
D4
BC847W
1H*
BC847BM
D5
BC847AW
1E*
BC847CM
D6
BC847BW
1F*
BC547
C547
BC847CW
1G*
BC547B
C547B
BC847T
1N
BC547C
C547C
[1]
3 of 13
BC847/BC547 series
Philips Semiconductors
5. Limiting values
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VCBO
collector-base voltage
open emitter
50
VCEO
collector-emitter voltage
open base
45
VEBO
emitter-base voltage
open collector
IC
100
mA
ICM
single pulse;
tp 1 ms
200
mA
IBM
single pulse;
tp 1 ms
100
mA
Ptot
Tamb 25 C
SOT23
[1]
250
mW
SOT323
[1]
200
mW
SOT416
[1]
150
mW
SOT883
[2] [3]
250
mW
[1]
500
mW
Tstg
storage temperature
65
+150
Tj
junction temperature
150
Tamb
ambient temperature
65
+150
SOT54
[1]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2]
[3]
Device mounted on an FR4 PCB with 60 m copper strip line, standard footprint.
6. Thermal characteristics
Table 7:
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
in free air
Typ
Max
Unit
SOT23
[1]
500
K/W
SOT323
[1]
625
K/W
SOT416
[1]
833
K/W
SOT883
[2] [3]
500
K/W
[1]
250
K/W
SOT54
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
[3]
Device mounted on an FR4 PCB with 60 m copper strip line, standard footprint.
Min
4 of 13
BC847/BC547 series
Philips Semiconductors
7. Characteristics
Table 8:
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter
ICBO
Conditions
Min
Typ
Max
Unit
15
nA
VEB = 5 V; IE = 0 A
100
nA
hFE group A
VCE = 5 V; IC = 10 A
90
hFE group B
VCE = 5 V; IC = 10 A
150
hFE group C
VCE = 5 V; IC = 10 A
270
DC current gain
VCE = 5 V; IC = 2 mA
110
800
hFE group A
VCE = 5 V; IC = 2 mA
110
180
220
hFE group B
VCE = 5 V; IC = 2 mA
200
290
450
hFE group C
VCE = 5 V; IC = 2 mA
420
520
800
IEBO
emitter-base cut-off
current
hFE
DC current gain
VCEsat
VBEsat
VBE
collector-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA
90
200
mV
IC = 100 mA; IB = 5 mA
[1]
200
400
mV
base-emitter
saturation voltage
IC = 10 mA; IB = 0.5 mA
[2]
700
mV
IC = 100 mA; IB = 5 mA
[2]
900
mV
IC = 2 mA; VCE = 5 V
[2]
base-emitter voltage
IC = 10 mA; VCE = 5 V
660
700
mV
770
mV
Cc
1.5
pF
Ce
emitter capacitance
IC = ic = 0 A; VEB = 0.5 V;
f = 1 MHz
11
pF
fT
transition frequency
IC = 10 mA; VCE = 5 V;
f = 100 MHz
100
MHz
noise figure
IC = 200 A; VCE = 5 V;
RS = 2 k; f = 1 kHz;
B = 200 Hz
10
dB
[1]
[2]
580
-
5 of 13
BC847/BC547 series
Philips Semiconductors
mgt723
400
mgt724
1200
VBE
(mV)
1000
hFE
(1)
300
(1)
800
(2)
(2)
200
600
(3)
400
(3)
100
200
0
101
10
102
103
0
101
10
102
I C (mA)
VCE = 5 V
VCE = 5 V
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
103
103
I C (mA)
1200
VBEsat
(mV)
1000
VCEsat
(mV)
(1)
800
(2)
102
600
(1)
(3)
(2)
400
(3)
200
10
101
10
102
103
0
101
IC/IB = 20
IC/IB = 10
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
102
103
10
I C (mA)
I C (mA)
6 of 13
BC847/BC547 series
Philips Semiconductors
mgt727
600
VBE
(mV)
1000
hFE
(1)
500
mgt728
1200
(1)
400
800
(2)
(2)
300
600
200
400
(3)
100
0
101
(3)
200
10
102
103
0
102
101
10
I C (mA)
VCE = 5 V
VCE = 5 V
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
104
102
103
I C (mA)
1200
VBEsat
(mV)
1000
VCEsat
(mV)
(1)
103
800
(2)
600
(3)
102
400
(1)
200
(3) (2)
10
101
10
102
103
0
101
IC/IB = 20
IC/IB = 10
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
102
103
10
I C (mA)
I C (mA)
7 of 13
BC847/BC547 series
Philips Semiconductors
mgt731
1200
VBE
(mV)
1000
hFE
1000
mgt732
1200
(1)
800
(1)
800
(2)
(2)
600
400
600
200
0
101
(3)
400
(3)
200
10
102
103
0
102
101
10
I C (mA)
VCE = 5 V
VCE = 5 V
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
104
102
103
I C (mA)
1200
VBEsat
(mV)
1000
VCEsat
(mV)
(1)
103
800
(2)
600
(3)
102
400
(1)
200
(3) (2)
10
101
10
102
103
0
101
I C (mA)
102
103
I C (mA)
IC/IB = 20
IC/IB = 10
(1) Tamb = 55 C
(2) Tamb = 25 C
(2) Tamb = 25 C
(3) Tamb = 55 C
10
8 of 13
BC847/BC547 series
Philips Semiconductors
8. Package outline
3.0
2.8
1.1
0.9
2.2
1.8
1.1
0.8
0.45
0.15
0.45
0.15
2.5 1.4
2.1 1.2
2.2 1.35
2.0 1.15
0.48
0.38
1.9
0.4
0.3
0.15
0.09
Dimensions in mm
Dimensions in mm
04-11-04
0.95
0.60
1.8
1.4
0.25
0.10
1.3
04-11-04
0.45
0.15
0.50
0.46
0.30
0.22
1.75 0.9
1.45 0.7
1.02
0.95
0.65
0.30
0.22
1
2
0.30
0.15
0.25
0.10
0.20
0.12
0.35
Dimensions in mm
04-11-04
Dimensions in mm
03-04-03
0.45
0.38
4.2
3.6
0.45
0.38
4.2
3.6
0.48
0.40
3 max
0.48
0.40
1
2
4.8
4.4
2.54
3
4.8
4.4
5.08
1.27
2.54
3
5.2
5.0
14.5
12.7
5.2
5.0
Dimensions in mm
04-11-16
Dimensions in mm
04-06-28
14.5
12.7
9 of 13
BC847/BC547 series
Philips Semiconductors
0.45
0.38
4.2
3.6
1.27
2.5
max
0.48
0.40
1
2
4.8
4.4
2.54
3
5.2
5.0
1.27
14.5
12.7
Dimensions in mm
05-01-10
9. Packing information
Table 9:
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code. [1]
Type number [2]
Package
Description
Packing quantity
3000
5000
10000
BC847
SOT23
-215
-235
BC847W
SOT323
-115
-135
BC847T
SOT416
-115
-135
BC847AM
SOT883
-315
SOT54
-412
SOT54A
-116
-126
-112
BC847BM
BC847CM
BC547
For further information and the availability of packing methods, see Section 15.
[2]
10 of 13
BC847/BC547 series
Philips Semiconductors
Revision history
Document ID
BC847_BC547_SER_6
20050519
Modifications:
Supersedes
BC846_BC847_
BC848_5,
BC847M_SERIES_2,
BC846T_847T_
SERIES_3,
BC846W_BC847W_
BC848W_4,
BC546_547_4
The format of this data sheet has been redesigned to comply with the new presentation
and information standard of Philips Semiconductors.
This data sheet is a type combination out of the previous data sheets
BC846_BC847_BC848_5, BC847M_SERIES_2, BC846T_847T_SERIES_3,
BC846W_BC847W_BC848W_4 and BC546_547_4.
BC846_BC847_BC848_5
20040206
Product
specification
BC846_BC847_
BC848_4
BC847M_SERIES_2
20040310
Product
specification
BC847M_SERIES_1
BC846T_847T_SERIES_3 20001115
Product
specification
BC846T_847T_2
BC846W_BC847W_
BC848W_4
20020204
Product
specification
BC846W_847W_3
BC546_547_4
20041125
Product
specification
BC546_547_3
11 of 13
BC847/BC547 series
Philips Semiconductors
Definition
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
[2]
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
12. Definitions
14. Trademarks
13. Disclaimers
Life support These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
12 of 13
Philips Semiconductors
BC847/BC547 series
45 V, 100 mA NPN general-purpose transistors
16. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Packing information. . . . . . . . . . . . . . . . . . . . . 10
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 11
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 12
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Contact information . . . . . . . . . . . . . . . . . . . . 12