Shenzhen Normand Electronic Co.

,Ltd

SK6805MICRO
SPECIFICATION
INTEGRATED LIGHT SOURCE INTELLIGENT CONTROL OF
CHIP-ON-TOP SMD TYPE LED

Document No.: SPC/ SK6805MICRO

Model No.: SK6805MICRO
Description: 2.4X2.7X1.1mm Top SMD Type 0.1Watt Power tegrated
light source Intelligent control LED
Rev. No.: 03
Date: 2018-06-11

ELECTROSTATIC
SENSITIVE DEVICES

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INTEGRATED LIGHT SOURCE INTELLIGENT CONTROL

OF CHIP-ON-TOP SMD TYPE LED
Model: SK6805MICRO
1. Product Overview :
SK6805MICRO is a smart LED control circuit and light emitting circuit in one controlled LED source,
which has the shape of a 2427 LED chip. Each lighting element is a pixel, and the intensities of the
pixels are contained within the intelligent digital interface input. The output is driven by patented PWM
technology, which effectively guarantees high consistency of the color of the pixels. The control
circuit consists of a signal shaping amplification circuit, a built-in constant current circuit, and a high
precision RC oscillator.
The data protocol being used is unipolar RZ communication mode. The 24-bit data is transmitted
from the controller to DIN of the first element, and if it is accepted it is extracted pixel to pixel. After an
internal data latch, the remaining data is passed through the internal amplification circuit and sent out
on the DO port to the remaining pixels. The pixel is reset after the end of DIN. Using automatic
shaping forwarding technology makes the number of cascaded pixels without signal transmission only
limited by signal transmission speed.
The LED has a low driving voltage (which allows for environmental protection and energy saving),
high brightness, scattering angle, good consistency, low power, and long life. The control circuit is
integrated in the LED above.

2. Main Application Field:

● Full color LED string light, LED full color module, LED super hard and soft lights, LED guardrail tube,
LED appearance / scene lighting
● LED point light, LED pixel screen, LED shaped screen, a variety of electronic products, electrical
equipment etc..

3. Description:
● Top SMD internal integrated high quality external control line serial cascade constant current IC;
● control circuit and the RGB chip in SMD 2427 components, to form a complete control of pixel, color
mixing uniformity and consistency;
●built-in data shaping circuit, a pixel signal is received after wave shaping and output waveform
distortion will not guarantee a line;
●The built-in power on reset and reset circuit, the power does not work;
●gray level adjusting circuit (256 level gray scale adjustable);
● red drive special treatment, color balance;
● line data transmission;
● plastic forward strengthening technology, the transmission distance between two points over 10M;
●Using a typical data transmission frequency of 800 Kbps, when the refresh rate of 30 frames per sec

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4. Mechanical Dimensions:

Notes:
1. All dimensions are in millimeters.
2. Tolerance is ±0.1mm unless otherwise noted

5. PIN configuration

NO. Symbol Function description

1 DOUT Control data signal output
2 VSS Ground
3 DIN Control data signal input
4 VDD Power supply LED

6. General Information

SK6805MICRO

SK6805-MICRO: The default is RGB chips with IC

integration

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7. Electrical/Optical Characteristics:

SK6805MICRO
Color
Dominate wavelength(nm) Luminance(mcd) luminous flux(lm)

Red 620-630 100-200 0.4-0.6

Green 520-535 400-700 1.0-2.0

Blue 460-475 50-100 0.2-0.4

8. Product welding plate size

9. Absolute Maximum Ratings（Ta=25℃,VSS=0V） :

Parameter Symbol Range Unit

Power supply voltage VDD +3.5～+5.5 V
Logic input voltage VIN -0.5～VDD+0.5 V
Working temperature Topt -40~+85 ℃
Storage temperature Tstg -50~+150 ℃
ESD pressure(HBM) VESD 4K V
ESD pressure(DM) VESD 200 V

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10. The electrical parameters (unless otherwise specified, TA=-20 ~ +70 ℃, VDD=4.5 ~ 5.5V,
VSS=0V):
Typica
Parmeter Symbol Min Max Unit Test conditions
l
The chip
VDD --- 5.2 --- V ---
supply voltage
R/G/B port VDS,M
--- --- 26 V ---
pressure AX
DOUT conect ground,
IDOH --- 49 --- mA the maximum drive
DOUT drive current
capability
DOUT conect +, the
IDOL --- -50 --- mA
largest current
0.7*V
The signal VIH --- --- V
DD
input flip VDD=5.0V
threshold VIL --- --- 0.3*VDD V

The frequency
FPWM --- 1.2 --- KHZ ---
of PWM
Static power
IDD --- 1 --- mA ---
consumption

11. The dynamic parameters (Ta=25 ℃):

Parameter Symbol Min Typical Max Unit Test conditions

The speed of data The duty ratio of 67%

fDIN --- 800 --- KHZ
transmission (data 1)

DOUT transmission TPLH --- --- 500 ns

DIN→DOUT
delay TPHL --- --- 500 ns

IOUT Rise/Drop Tr --- 100 --- ns VDS=1.5

Time Tf --- 100 --- ns IOUT=5mA

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12. The data transmission time :

Standard
Name Min. Max. Unit
value
T Code period 1.20 -- -- µs

T0H 0 code, high level time 0.2 0.31 0.4 µs

T0L 0 code, low level time 0.8 -- -- µs

T1H 1 code, high level time 0.65 0.97 1.0 µs

T1L 1 code, low level time 0.2 -- -- µs

Reset code，low level
Trst >80 -- -- µs
time

1. The protocol uses a unipolar zeroing code. Each symbol must have a low level. Each
symbol in this protocol starts with a high level. The high time width determines the "0" or
"1" code. .
2. When writing programs, the minimum symbol period is 1.2μs.
3. The high time of “0” code and “1” code should be in accordance with the
stipulated range in the above table. The low time requirement of “0” code and “1”
code is less than 20μs.
13. Timing waveform:
Input code:

Connection mode:

D1 D2 D3 D4
DIN DO DIN DO DIN DO

PIX1 PIX2 PIX3

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14. The method of data transmission:

Note: the D1 sends data for MCU, D2, D3, D4 for data forwarding automatic shaping cascade circuit.

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13. The data structure of 24bit:

G7 G6 G5 G4 G3 G2 G1 G0 R7 R6 R5 R4
R3 R2 R1 R0 B7 B6 B5 B4 B3 B2 B1 B0
Note: high starting, in order to send data (G7 - G6 - ...... ..B0)

14. The typical application circuit:

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16. Standard LED Performance Graph:

Thermal Pad Temperature vs. Relative Light Output

120%
BLUE/GREEN
Normalized Luminous Flux

100%

80%

60% RED

40%

20%

0.00
0 20 40 60 80 100 120
Thermal Pad Temperature (T=25°C)

Wavelength Characteristics

100%
GREEN
Relative Emission Distribution

BLUE
80% RED

60%

40%

20%

0.00
400 450 500 550 600 650 700 750 800
Wavelength (nm)

Typical Radiation Pattern 120°

0
30°

60°

90°
90 75 60 45 30 15 0 0.2 0.4 0.6 0.8 1.0
Radiation Angle
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16. Packaging Standard:

SK6805-MICRO

CATHODE IDENTIFICATION

TAPE FEED DIRECTION CARRIER TAPE

COVER TAPE

REEL(178x12mm)
(INNER 3000pcs LED MAX)

SMD
PRODUCT NO.: SK6805-MICRO
ESD POLYETHYLENE BAG
QUANTITY.: 3000 PCS

Lot No.: LW2015070902-10

DATE:2018-06-09

LABEL SKETCHING

The reel pack is applied in SMD LED. The LEDs are packed in cardboard boxes after packaging in normal or anti-electrostatic
bags. cardboard boxes will be used to protect the LEDs from mechanical shocks during transportation. The boxes are not water
resistant and therefore must be kept away from water and moisture.

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19. Reliability Test :

NO. Test item Test Conditions Reference Criterion

100 ± 5°C ~ -40°C ±

1 Thermal Shock 5°C MIL-STD-202G 0/22
30min~30min 300 cycles

High Temperature JEITA ED-4701

2 Ta= +100ºC 1000hrs 0/22
Storage 200 201

Low Temperature JEITA ED-4701

3 Ta= -40ºC 1000hrs 0/22
Storage 200 202

High Temperature
JEITA ED-4701
4 High Humidity Ta=60ºC RH=90% 1000hrs 0/22
Storage
100 103

-55ºC~25ºC~100ºC~25ºC
Temperature 30min~5min~30min~5mi JEITA ED-4701
5 0/22
Cycle n 100 105
100 cycles

Resistance to Tsld = 260°C, 10sec. 3 JEITA ED-4701

6 0/22
Soldering Heat times 300 301

Room temp Life 25°C, IF: Typical JESD22-A

7 0/22
Test current , 1000hrs 108D

Criteria for Judging the Damage:

Limit
Item Symbol Test Condition
Min Max
Luminous DC=5V, Typical
IV Init. Value*0.7 ---
Intensity current

Resistance to DC=5V, Typical No dead lights or obvious

---
Soldering Heat current damage

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TOP SMD LED Application Notes

1. Features
The Purposes of making Normand’s customers and users to have a clear understanding on the ways how to
use the LED.
2. Description
Generally. The LED can be used the same way as other general purposed semiconductors. When using
Normand’s TOP SMD LED, the following precautions must be taken to protect the LED.

3. Cautions
3.1. Dust & Cleaning
This emitter has a silicone surface, There are many benefits to the silicone surface in terms of optical
properties and improved reliability. However, silicone is a softer material and prone to attract dust. While a
minimal amount of dust and debris on the LED will not cause significant reduction in illumination, steps
should be taken to keep the emitter free of dust.
These include keeping the LEDs in the manufacturer’s package prior to assembly and storing assemblies in
an enclosed area after installing the emitters.
Surface condition of this device may change when organic solvents such as trichloroethylene or acetone
were applied.
Avoid using organic solvent, it is recommended that isopropyl be used as a solvent for cleaning the LEDs.
When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the
package and the resin of not.
Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence as ultrasonic
cleaning on the LEDs depends on factors such as ultrasonic power. Baking time and assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.

3.2. Shipment and storage

TOP SMD LED is a humidity sensor, the LED packaging in the aluminum bag is to avoid the LED in the
transport and storage of moisture absorption, in the bag with a desiccant to absorb the moisture inside
the bag. If the LED absorbs water vapor, then in the LED over reflow, in the high temperature state, into
which the rapid expansion of gas vaporization and produce a greater internal stress, so that the material
crack, layered or damaged bonding wire , Resulting in product failure.
TOP SMD LED with a moisture-proof anti-static aluminum foil bag packaging, handling should avoid the
process of squeezing, piercing the case of bags, and do the necessary anti-static protective measures;
promise products on the line before the leak or broken, Please stop the use of direct use of the product; ,
Resulting in product failure;
Such as before the material has been found to prevent moisture-proof aluminum foil bags have been
opened, damaged, perforated can be returned to the original re-dehumidification, must not be on-line use;
The humidity level of this product is LEVEL5a.

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Chart 1:Definition of material’s MSL prescribed by IPC/JEDECJ-STD-020

Workshop lifespan after open the packaging
Moisture proof
Time condition

LEVEL1 unlimited ≦30℃/85 % RH

LEVEL2 1 year ≦30℃/60 % RH

LEVEL2a 4 Weeks ≦30℃/60 % RH

LEVEL3 168 Hours ≦30℃/60 % RH

LEVEL4 72 Hours ≦30℃/60 % RH

LEVEL5 48 Hours ≦30℃/60 % RH

LEVEL5a 24 Hours ≦30℃/60 % RH

LEVEL6 Take off and use immediately ≦30℃/60 % RH

3.3. Storage before unsealing

In order to avoid the moisture barrier caused by the reliability of the failure problem, need to do LED products SMT pre-
storage and moisture-proof measures;
If the moisture-proof bag is not open, the TOP SMD element will be stored for less than 2 months at <30 ° C / 60% RH;
(Note: The label date is the same and the packing is not leaked. Discoloration under the premise of use; for different
moisture-proof grade materials or packaging to save the time there is a certain difference, the specific preservation time
to the specification book or packaging tips prevail); recommended in the unassembled do not open the moisture before
the bag;

3.4. Control after the packing bag is opened

After opening the moisture-proof bag, please read the moisture-proof bag inside the humidity indicator card in the
moisture-proof beads into pink to confirm moisture in the moisture bag is too much, according to the color of the ball to
determine whether the bag material on-line operation; And the material after opening the package should be strictly
controlled in the table 1 as specified by the maximum temperature and humidity and operating time allowed, as long as
the material exposed in the environment described in Table 1, the need to accumulate its use in the workshop time.
Open the bag and paste the material on the PCB board, should be completed within 0.5H welding work, do not
recommend the material attached to the PCB, a long time stay in the workshop does not carry out SMT work; Caused
by adverse water within the lead;

3.5. Definition of humidity card

Open the package after the TOP SMD LED bag inside the humidity card color instructions are as follows:
A. If the moisture card 10% of the moisture-proof beads into pink, other files for the blue, this situation, LED can be used
directly;
B. If the humidity card moisture-proof beads 10%, 20% at all become pink, in fact, the file is blue, this situation, the need
for low-temperature components dehumidification;
C. If the humidity card moisture-proof beads 10%, 20%, 30% more than three are turned pink, in this case, the customer
needs to return the material to our company for high humidity dehumidification, re-packaging before use;

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Humidity indicator DO not change color

Humidity indicator tums pink in 10% 20%

Humidity indicator tums pink in 10% 20% 30%

3.6. Unwanted material moisture-proof storage and moisture-proof control of finished material
If a roll of SMDs is not used at once and the plant temperature and humidity are within the defined conditions (<30 ° C /
60% RH), the exposure time of the element in the air does not exceed 2H, the remaining material should be carried
out together with the desiccant Vacuum sealed, otherwise, the material must be low-wet baking dehumidification;
dehumidified material can be re-packaged to re-start the calculation time;
Perform moisture control on SMDs components that have been assembled
A. After the components have been assembled to the PCB board no longer need to go through the high temperature
process or reflow process, it will not be special treatment;
B. Do not need to do the necessary dehumidification work before making the appropriate protection process, bake in 70
℃ ± 5 ℃ oven baking for less than 12 hours, To remove the product in the detection and aging process exposed to
moisture in the air to avoid the product in the protective treatment, the package in the material surface of the moisture
will slowly invade the product, will cause product failure;
C. For products that require secondary SMT process or high temperature, they should be subjected to the necessary
moisture treatment before secondary welding, after exposure to (<30 ° C / 60% RH) , The maximum length of not more
than 2H, Connaught second high temperature process separated by a long time, then a welding material must be
necessary dehumidification work (70 ℃ ± 5 ℃ oven baking no less than 12 hours), and then pumping Vacuum storage;
or the first product stored in the oven or with a desiccant container, the second high-temperature process before doing
dehumidification work (70 ℃ ± 5 ℃ in the oven baking no less than 12 hours) , To ensure that products in the high
temperature before the process is not damp;
Low-temperature baking conditions: 70 ° C ± 5 ° C baking not less than 12 hours high temperature baking conditions:
130 ° C ± 5 ° C baking not less than 6 hours (lamp beads must be split into particles)

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3.7. Reflow Soldering Characteristics

In testing, Normand has found S50 LEDs to be compatible with JEDEC J-STD-020C,using the parameters listed below. As a
general guideline Normand recommends that users follow the recommended soldering profile provided by the manufacturer
of solder paste used.
Note that this general guideline is offered as a starting point and may require adjustment for certain PCB designs and
Configurations of reflow soldering equipment.

Critical Zone TL to TP
amp-up

L L
Temperature (°C)

s max

MIN
Ramp down

ts
(Preheat)

T 25°C to Peak

Times

Profile Feature Lead-Based Solder Lead-Free Solder

Average Ramp-Up Rate (Ts max to Tp ) 3℃/second max. 3℃/second max.

Preheat: Temperature Min (Ts min) 100℃ 150℃

Preheat: Temperature Min (Ts max) 150℃ 200℃

Preheat: Time ( ts min to ts max ) 60-120 seconds 60-180 seconds

Time Maintained Above: Temperature (TL) 183 ℃ 217 ℃

Time Maintained Above: Time (t L) 60-150 seconds 60-150 seconds

Peak/Classification Temperature (T P) 215 ℃ 240 ℃

Time Within 5℃ of Actual Peak Temperature ( tp) <10 seconds <10 seconds

Ramp-Down Rate 6℃/second max. 6℃/second max.

Time 25 ℃ to Peak Temperature <6 minutes max. <6 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.

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3.8 General design requirements :

. SMT nozzle requirements: (red circle refers to the nozzle diameter)

OK (nozzle diameter is greater than the NG (nozzle diameter is less than the light
light bulb area beads light area)

. Material to take way: with tweezers folder material, can not press the colloid or sharp objects to
touch the colloid, the material can not be stacked;

. Products in the PCB layout design, for the soft sheet, and 0.5T below the plate, the pad direction
should be perpendicular to the direction of PCB extension to reduce the PCB board bending stress
generated in the LED pin, resulting in LED products Due to stress acting tensile failure;

3.9 Heat Generation:

Thermal design of the end product is of paramount importance. Please consider the heat generation of the
LED when making the system design. The coefficient of temperature increase per input electric power is
affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as
components. It is necessary to avoid in tense heat generation and operate within the maximum rating given in
this specification. The operating current should be decided after considering the ambient maximum
temperature of LEDs
The maximum working humidity of the product is not easy to exceed 40 ° C ( ≤ 40 ° C, refers to the product
pin at the operating temperature)

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4.0 Electrostatic Discharge & Surge Current :

Electrostatic discharge (ESD) or surge current (EOS) may damage LED.
Precautions such as ESD wrist strap, ESD shoe strap or antistatic gloves must be worn whenever handling of
LED.
IC device signal input and output ports must be connected in series protection resistor to prevent surge or
static shock port caused by product failure;
All devices, equipment and machinery must be properly grounded.
It is recommended to perform electrical test to screen out ESD failures at final inspection.
It is important to eliminate the possibility of surge current during circuitry design.

4.1 Moisture Proof Package

Cannot take any responsibility for any trouble that are caused by using the LEDs at conditions exceeding
our specifications.
The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking
directly at the LEDs with unaided eyes for more than a few seconds.
The formal specification must be exchanged and signed by both parties before large volume purchase begins.
The appearance and specifications of the product may be modified for improvement without notice.

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Change History

FCN No. Date Rev. No. Changes/Reason of changes

2016-08-08 01 Initial Document

2017-09-12 02 Modified pad size

2018-06-08 03 Revision of the time series table range

Note
Items Signatures Date
03 Revision of the time series table range

Prepared by Kevin Zhu 2018-06-11

Checked by

Approved by

FCN#

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