Aerospace Sensor Systems: From Sensor Development To Vehicle Applications
Aerospace Sensor Systems: From Sensor Development To Vehicle Applications
Aerospace Sensor Systems: From Sensor Development To Vehicle Applications
R=20130013129 2019-07-03T08:47:35+00:00Z
G. W. Hunter
NASA Glenn Research Center
Cleveland, OH 44135
Abstract
This paper presents an overview of years of sensor system development and application for aerospace systems.
The emphasis of this work is on developing advanced capabilities for measurement and control of aeropropulsion
and crew vehicle systems as well as monitoring the safety of those systems. Specific areas of work include
chemical species sensors, thin film thermocouples and strain gages, heat flux gages, fuel gages, SiC based
electronic devices and sensors, space qualified electronics, and MicroElectroMechanical Systems (MEMS) as well
as integrated and multifunctional sensor systems. Each sensor type has its own technical challenges related to
integration and reliability in a given application. The general approach has been to develop base sensor technology
using microfabrication techniques, integrate sensors with “smart” hardware and software, and demonstrate those
systems in a range of aerospace applications. Descriptions of the sensor elements, their integration into sensors
systems, and examples of sensor system applications will be discussed. Finally, suggestions related to the future of
sensor technology will be given. It is concluded that smart micro/nano sensor technology can revolutionize
aerospace applications, but significant challenges exist in maturing the technology and demonstrating its value in
real-life applications.
AEROSPACE SENSOR SYSTEMS:
FROM SENSOR DEVELOPMENT TO
VEHICLE APPLICATIONS
200 nm
High Temperature SiC Micro-electromechanical Nanotechnology
Electronics Systems (MEMS)
Mechanical/Display/Electr
Power
A
Physical/Chemical Signal
S C
E T
ical Power
N Analog-Digital-Analog U
S A
Signal Processing
O T
R O
S R
S
Communication
Electrical/Optical
Glenn Research Center
Localized Avionics
System Infrastructure Electronics
Actuator
HiTemp electronics
Rad hard electronics
Distributed control HiTemp electronics
Algorithms Connector Connector Embedded sensors
Self-diagnosing Switch Copper wire Switch Microsensors
Self-calibrating Multiplexer Optical fiber Multiplexer Optical Actuation
Hierarchical control Harness Telemetry Harness Electronic actuation
Signal/data conditioning Transmitter Radio frequency Transmitter
Detector Optical free-space Detector
Improve
Improvesystem
systemreliability, cost,and
reliability,cost, andweight
weight Node
by
byusing
usinglocal
localavionics elementsfor
avionicselements for Area Node
distributed, Node
distributed,smart
smartsensing
sensingand
andcontrol.
control. Vehicle
Link
Linklocal
localnodes
nodestotoareas,
areas,then
thenintegrate
integrate
entire
entirevehicle
vehicleusing
usinghierarchical
hierarchicaldesign.
design.
• INTRODUCTION
• SENSOR ELEMENT
¾ TECHNOLOGIES AND CHALLENGES
• SUPPORTING TECHNOLOGIES
¾ HIGH TEMPERATURE ELECTRONICS EXAMPLE
• SYSTEM APPLICATION
¾ MATURATION FOR ISS APPLICATIONS
¾ SPACE QUALIFIED ELECTRONICS AND SENSORS
¾ MOBILE SENSOR PLATORMS
PdCr strain sensor Pt- Pt/Rh temperature Heat Flux Sensor Array Multifunctional
to T=1000°C sensor to T=1200°C to T=1000°C Sensor Array
1991 R&D 100 Award 1995 R&D 100 Award 1998 R&D 100 Award
PdCr wire strain gauge applied on PdCr thin film gauge applied on Allied-Signal Long-lived Convoluted Thermocouples
Ford Motor Co. exhaust manifold Engines ceramic turbine blade For Ceramic Temperature Measurements
Ceramic TC Sputtering
Targets fabricated by the
NASA GRC Ceramics Branch
Ceramic Thermocouple
fabricated at University of
Rhode Island
LIDS Pressure Sensor Concept Location LIDS Pressure Sensor Concept Modeled
LIDS Pressure Sensor Sensitivity vs. Air Pressure
1.6
1.4
1.2
Sensitivity (arb.)
1.0
0.8
0.6
0.4
0.2
0.0
0 20 40 60 80 100
Air Pressure (kPa)
ASC-E Convertor
ASRG Engineering Unit with Planned Location of Heat Flux Sensors Heat Flux Sensor Design being Fabricated at NASA GRC
POC: Greg.Zimmerli@nasa.gov
Unknown RFMG performance Construct a full-scale mock LH2 Lander tank and
in larger scale tanks, and with test RF response with internal hardware (no cryo-
other internal hardware. fluid).
Kovar tube
Contact wire
• TWO SENSOR SYSTEM FOR FULL RANGE DETECTION: FROM PPM LEVEL
TO 100%
Pd-ALLOY SCHOTTKY
DIODE CONNECTORS
RESISTOR
2.2 mm
Aft Compartment Hydrogen Safety Hydrogen Safety Fuel Cell Safety and Life Support Process
Hydrogen Monitoring Monitoring Monitoring Process Monitoring and Safety Monitoring
S ilic o n
S ilic o n D io x id e
N o t to s c a le :
50 Hp Gas Turbine
Industry Standard
Continuous Emission
Monitoring Equipment
Nanocrystalline
Tin Oxide
2000 PPM
1000 PPM
1500
300 PPM
1000
RP-1 Vapor 0% 0%
Hydrogen 0%
500
0
0 100 200 300 400 500 600 700 800 900 1000
TIME (sec)
Selectively
SiC-Based
Filtered
Pressure Sensor
SnO2 Resistors
Oxygen Sensor
1500 SnO2 Sensor
SiC Hydrocarbon Sensor
1000
Engine Start
0
0 5 10 15 20 25 30 35 40
Time (minutes)
Rake Sampling System At The Outlet Of The JT-12 Location Of The Sensors In The
Jet Engine. Flow Stream Of The Rake
MEMSREL
0.8
Cigarette
Cotton Wick
Propene Soot 0.6
Silicone O-Ring
MEMS- 0.4
Based
Chemical 0.2
Species
Detection
0
MEMS-Based
MiPACREL IMSREL
Particulate
Detector
8
3000
PdCr-Diode-721 Sensor
CO 7
CO-165-diode Sensor
RH % 6
IMS Volts
H2/CXHy
2000 5
4
1500
CO2
3
1000
2
500
1
IMS
0 0
150 170 190 210 230 250 270 290 310 330
Time
TECHNICAL CHALLENGES:
– DEVELOPMENT OF RELIABLE HIGH
TEMPERATURE TELEMETRY Prototype Oscillator Circuit
ELECTRONICS, POWER SOURCES,
REMOTE COMMUNICATION Example: Gas Turbine Engine Development
ELECTRONICS, AND PACKAGING Requires Extensive Instrumentation
Yielding Extensive Wiring Complexity
GOALS SUPPORTED:
– ENHANCE PERFORMANCE
– SIGNIFICANTLY REDUCE COST
100 um
Source
100 µm
Drain Gate
1 mm
Glenn Research Center
Tech Accomplishments
NASA Glenn Silicon Carbide Differential Amplifier (IVHM v1.5 MS 1.3.5)
Signal (V)
0
100 um -1
-2
0 1 2
2 transistors and 3 resistors
integrated into less than half a Time (milliseconds)
square millimeter. Less than 5% change in
operating characteristics during
Single-metal level interconnect. 4000 hours of 500 °C operation.
-10 V 0V
VSS GND
IN A -5V
0V -10 V
-5V IN B
-10 V
0 5 10 15 20 25 30 35
Time (msec)
Probe-Test
Photo
Glenn Research Center
SIGNIFICANCE OF RECENT ELECTRONICS RESULTS
THE BASIC HARDWARE TOOLS FOR HIGH TEMPERATURE DATA PROCESSING
HAVE BEEN FABRICATED
♦ THESE RESULTS HAVE BEEN THE SUBJECT OF A HIGH LEVEL OF VISIBILITY
E.G. NASA TOP 10 DISCOVERY STORIES FOR 2007
Significant wiring
exists with present
sensor systems
Energy Harvesting
World Record High
High Temperature RF Thin Film
Temperature Electronics
Components Thermoelectrics
Device Operation
MULTIFUNCTIONAL
PHYSICAL SENSOR ARRAY
HIGH TEMPERATURE (Temperature, Heat Flux)
ELECTRONIC NOSE
(Chemical Species)
HOTProbe
(Wind flow,
Pressure,
Temperature)
1.80E-01
Stagnant 21% O2 21% O2
Air Stagnant
1.40E-01 Air
1.00E-01
6.00E-02
2.00E-02
5% O2 5% O2
-2.00E-02
3% O2 3% O2
-6.00E-02
0 500 1000 1500 2000 2500 3000 3500 4000 4500
Time (sec)
NAFION Sensors in
manifold
Present commercial
ISS O2 sensors
NAFION Sensors
Control Electronics
NAFION based oxygen sensor (left) and sensors during piggyback testing with NASA CSA-O2 systems
Example Failure
Mechanism: Batch Processed
Diffusion Hole MEMS based
Present Sensor Structure Sputtered Based Three Packaged Sensor
Breakdown
Electrode System
FTSCE
Telerobotics
• Sensor Platform Area Network (SPAN)
• two agent control over the Internet
• streaming video
• each agent owns state vector of the other
Individual Multi-Sensor
Decision
Sensor Validation
Logic
Validation Redundancy-based
Screening/filtering analysis: Determine whether
for gross faults: • Hardware – sensor data is
homogenous comparison
• Amplitude Limits valid or invalid
of redundant sensors
• Rate-of-change based on available
• Analytical –
Limits info and analysis
heterogeneous
• Noise Limits comparison physically
dependent sensors
Iced-Up Failure
(sensor value locked)
Time Time
Intermittent-Binary Intermittent-Filtered
(loose connector) Time (cracked solder joint)
Legend
Good Sensor
Failed Sensor
Time Time
Reasonableness Checks
(Gross Failure Detection)
Increment or Reset
Initiate SDQS Perform Limit Checks Limit Check
Sec. 7.3.2 Fault Counters
Increment or Reset
Perform Rate Checks Rate Check
Sec. 7.3.3 Fault Counters
Obtain data from Sensor
Obtain
Data Sensor Data
Table per Increment of Reset
Perform Noise Checks Noise Check
Sec. 7.3.4 Fault Counters
Query
QueryFault
FaultCounters
Counterstoto
Determine Redundancy Estimation and Detection Mission-level
Qualify/Disqualify
Mission Phase, Decision Algorithm
Sensor Data
Subsystems Phase, Perform Redundant Increment or Reset
Channel Checks RCC Fault Counters
Sec. 7.3.5 DQI for each
Set Data Quality
Perform Analytical Increment of Reset sensor becomes
Indicators (DQI) in
Redundancy Checks ARC Fault Counters available to other
Sensor Data Table
Sec 7.3.6 flight software
algorithms (e.g.,
Aborts, C&W,
Cycle-level GN&C)
Detection
Algorithms
Glenn Research Center
Portable Health ALgorithms Test (PHALT) System
The PHALT System was developed for
use in rapid prototyping and testing of PHALT System
diagnostic algorithms in real-time
hardware
Portable
Laptop (development platform) and
industrial, rack-mount PC (real-time
target) provide portability to support on-
the-road demonstrations and real-time
testing Real-time
Diagnostic Algorithms Target with
Currently limited to data validation GUI & I/O
Capability to add a variety of diagnostic
& prognostic health management
algorithms Anti-aliasing
Test Filters
Matlab/Simulink xPC software
¾ PERFORMANCE CONSIDERATIONS
¾ PHYSICAL CONSIDERATIONS
¾ ENVIRONMENTAL CONSIDERATIONS
OF THE PRODUCT.
• AT MINIMUM, CRIT 1 SYSTEMS, I.E. THOSE WHOSE FUNCTION CAN AFFECT LOSS OF
CREW AND/OR VEHICLE, SHOULD BE MONITORED NO MATTER THE EXTREME 200 nm
CONDITION INHERENT IN SUCH MONITORING
NANOTECHNOLGY
Electrodes
Zinc Oxide
Nanorods
NANOSTRUCTURE
NANORODS CONTACTED
FABRICATED BY THERMAL ZINC OXIDE NANORODS AFTER
WITH THE SUBSTRATE VIA
EVAPORATION- DIELECTROPHORESIS ACROSS
A SILVER EPOXY
CONDENSATION PROCESS. INTERDIGITATED FINGERS
Many Species,
Complex Structures
Lead to Limited
Ability For Species
Identification Nose Approaches necessary to attempt to understand
Limited Chemical Selectivity by use
environment but still limited in species identification:
“Lock and Key” Approach
multispecies identification, closely related species,
significant false positives
• TECHNICALLY ADDRESS THE FUNDAMENTAL QUESTION “WHAT IS NANO GOOD FOR?” IN
THE AREA OF CHEMICAL SENSORS:
¾ NOT SMALL NANO STRUCTURES FOR BILLION MOLECULE MEASUREMENTS/ IN SUCH
APPLICATIONS MAY CONSIDER THIN FILMS OR ALTERNATE SENSOR PLATFORMS
¾ INSTEAD USE NANOSTRUCTURES FOR DETECTION ON MOLECULAR LEVEL
• ARRANGE THE CHEMICAL SENSOR STRUCTURE TO “FIT” THE MOLECULE IN QUESTION
• VERIFY THE PRESENCE OF THE MOLECULE WITH AN ELECTROCHEMICAL SIGNATURE
• FABRICATE “DESIGNER” CHEMICAL SENSORS
L. Chen, A. Trunek,
OAI
Cleveland, OH 44142
D. Lukco, C. Chang
QSS Group, Inc.
Cleveland, OH 44135
L. Dungan, T. C. Hong
NASA Johnson Space Center
Houston, TX
W. T. Powers
NASA George C. Marshall Space Flight Center
Marshall Space Flight Center, Al 35812