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    Notes For The TSE-II BOM: 1N5388BRLG

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    sekhar203512
    The document provides notes for building a BOM (Bill of Materials) for a TSE-II tube amplifier. It discusses: 1) Which capacitors are needed to support different tube types' filament current requirements. 2) Which resistor value is required to provide the proper filament voltage for different tube types. 3) Grounding and insulation requirements for various heat sinks on the board. 4) A warning about the danger of high voltages and stored energy on the board requiring insulation.

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    © All Rights Reserved
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    Notes For The TSE-II BOM: 1N5388BRLG

    Uploaded by

    sekhar203512
    43 views2 pages
    The document provides notes for building a BOM (Bill of Materials) for a TSE-II tube amplifier. It discusses: 1) Which capacitors are needed to support different tube types' filament current requirements. 2) Which resistor value is required to provide the proper filament voltage for different tube types. 3) Grounding and insulation requirements for various heat sinks on the board. 4) A warning about the danger of high voltages and stored energy on the board requiring insulation.

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    BomNotes_5-24-19

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    The document provides notes for building a BOM (Bill of Materials) for a TSE-II tube amplifier. It discusses: 1) Which capacitors are needed to support different tube types' filament current requirements. 2) Which resistor value is required to provide the proper filament voltage for different tube types. 3) Grounding and insulation requirements for various heat sinks on the board. 4) A warning about the danger of high voltages and stored energy on the board requiring insulation.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    43 views2 pages

    Notes For The TSE-II BOM: 1N5388BRLG

    Uploaded by

    sekhar203512
    The document provides notes for building a BOM (Bill of Materials) for a TSE-II tube amplifier. It discusses: 1) Which capacitors are needed to support different tube types' filament current requirements. 2) Which resistor value is required to provide the proper filament voltage for different tube types. 3) Grounding and insulation requirements for various heat sinks on the board. 4) A warning about the danger of high voltages and stored energy on the board requiring insulation.

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    © All Rights Reserved
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    Notes for the TSE-II BOM

    1) C1, C12 and C13 are all connected in parallel. All three are needed for 2A3 tubes to support 5 amps of
    filament current. One may be omitted for 45’s or 300B tubes.

    2) R2 MUST be 100 ohms for 45’s and 2A3 tubes to provide 2.5 volts. R2 MUST be 300 ohms for 300B’s to
    provide 5 volts. Measure the filament voltage BEFORE installing any tubes!

    3) HS1, the heat sink for the regulator chip, IC3 is grounded through the tab on the IC. No insulator is
    required, but one may be used if desired.

    4) HS2, the heat sink for D1 is connected to the filament raw DC source. This voltage is low, about 8 volts
    maximum, but LARGE currents could flow and parts WILL be damaged if this heat sink touches the one
    near it, or anything that is grounded. An insulator and thermal paste is recommended. Do not mount
    both heat sinks to a common metal surface without an insulator on D1.

    5) HS3 and HS4 are the heat sinks for the mosfets, Q1 and Q2. No insulator is needed IF THE
    RECOMMENDED mosfets, or any mosfet with an insulated case are used. If a mosfet with an exposed
    metal tab is used, an insulator and thermal paste is required. The tab operates at 150 to 200 volts.

    6) HS5 and HS6 are the heat sinks for the CCS chips, IC1 and IC2. They are NOT available in an insulated case
    and the FULL B+ VOLTAGE is on the metal tab. Insulators and thermal paste MUST be used. Last night I
    was taking voltage readings on a live board, and turned it over to adjust the bias. There was a LARGE
    BANG scaring me and causing my wife to scream. The grounded volume pot had touched one of the heat
    sinks causing a few BIG SPARKS. That LOW ESR cap at C5 can store some serious energy. I put some
    insulators on my board…..you should too!

    7) Zener diode D6 and resistor R36 reduce the voltage to the mosfets, which gets some of the heat out of
    the center of the board. For B+ voltages up to 350 volts, the specified 150 volt diode is fine. R36 will
    dissipate about 4 watts with B+ at 350 volts. For B+ voltages over 350 volts D6 should be changed to a 200
    volt part. This will put some of the excess heat back into the mosfets, but is needed to keep R36 below 4
    watts. The resistor is rated for 6.5 watts, but puts too much heat into the board at that power level. The
    On Semiconductor part number is 1N5388BRLG , Mouser # 863-1N5388BRLG and Digikey #
    1N5388BRLGOSCT-ND

    8) Provisions for a choke in the power supply have been added to the board. You may connect a choke to
    the connector marked “CHOKE” or you may install R4. Do not use both, it won’t hurt anything but the
    choke works best without a resistor in the board.

    9) The tube socket part numbers are from Antique Electronic Supply (www.tubesandmore.com). There are
    two valid types of the 9 pin sockets and both fit the board. Look at the pictures and choose the style you
    want. I usually get my sockets from ESRC, but he is out of the 4 pin sockets at the moment…..”on their
    way from China.” Other suppliers carry the same Chinese parts although the numbers vary.
    10) As with the original TSE a jumper is used to configure the 6.3 volt winding of the power transformer. A
    jumper from Pad 1 to Pad 4 is needed for 2.5 volt tubes like the 2A3 or 45. A jumper from Pad 3 to Pad 4
    is needed for 5 volt tubes like the 300B. Measure the filament voltage BEFORE installing any tubes.

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