Thermal Loads and Boundary Conditions

Chapter 2
Thermal Loads and Boundary Conditions

Thermal loading
Generally, we can divide the

thermal loading possibilities in
of OptiStruct into below listed
group:
• Volumetric Heat
Generation
• Heat Flux
• Imposed temperature
• Free Convection
• Time dependent thermal
loading
Heat Transfer and Structural Analysis Analog
LOADINGS
Mechanical Thermal Comments
Volumetric Defines heat generation of elements per unit of volume.This can be used to model
Inertial loads
heating heat generation by Joule effect for example. Units example: W/m3 or W/mm3
[GRAV] (depending on unit used for distance)
[QVOL]
A thermal loading applied to a 2D area, the external face of a 3D part, or the edge
Pressure Thermal flux of a 2Dpart.
Unlike in mechanical analysis, Flux is not directly applied to structural elements,
[PLOAD] [QBDY1] but on dedicated entities, the thermal interface elements (CHBDYE)Units example:
W/m² or W/mm² (depending on unit used for distance)
Heat Transfer and Structural Analysis Analog
LOADINGS
Mechanical Thermal Comments
Imposed Imposed The same way we use SPC(D) to set displacement boundary conditions on nodes
displacements temperature in a mechanical analysis (dof =1 to 6), the same principle is used to set
temperature boundary conditions on nodes (dof = 0).MPC also works in thermal
[SPC / SPCD] [SPC / SPCD] analysis with dof = 0.Units example: K or °C
Both Contact and Convection are set up as a Group and they describe
relationship between adjacent media, they are not referred in subcase entry.
Since contact is a structural interface between contact surface and set of nodes,
convection is a thermal interface between thermal elements and a single GRID
Contact Convection or SPOINT, on which an SPC is applied to model the external solid/fluid
[CONTACT] [CONV] temperature away from the structure.Different convection rules can be used to
determine the resulting loading. Thermal flux is not directly set by the user but
depends on convection rules, part temperature and fluid temperature.
Units example: W/m² or W/mm² (depending on unit used for distance)
Thermal Loads – Volumetric Heat Generation
When heat is conducted through an object, conversion of electrical/chemical/nuclear energy into thermal
energy may happen, which acts upon the part as a secondary heat source
• Heat generation is a volumetric phenomenon in heat conduction analysis.

• For steady state analysis, a total thermal energy into an element
Heat_in = volume * HGEN * QVOL
where,
QVOL is the constant volumetric heat generation rate defined in QVOL card
HGEN is the scale factor for volumetric heat generation defined in MAT4/MAT5
How to Define QVOL Heat Generation in HyperMesh
1) Create Load Collector with no card image
2) In flux panel, generate volumetric flux loading on 2D/3D
elements, with loading type QVOL
• QVOL is directly applied on structural elements

• Tip: heat generation is changed by the HGEN parameter in
MAT4/5
• The value unit should be {power_unit}/{distance_unit}3.
For example W/m3.
• Flux will be illustrated as arrows in the graphics area
Thermal Loads – Heat Flux
Heat flux is the amount of heat transferred thru a given surface per unit area.
The total thermal energy which goes into an element is given by

Heat_in = (Effective_Area) * Q0
where Q0 is heat flux defined in QBDY1 card,

Effectiv_Area is calculated based on CHBDYE
definition
How to Define Heat Flux in HyperMesh
To create CHBDYE thermal interface elements:
1. Create a new group of card image CONDUCTION
2. Add to this group the elements or elements faces that define the
interface used to apply the thermal loading.
This action will create new elements : the CHBDYE elements,
displayed as hollow rectangular or triangular shapes.
Notes about creating CHBDYE elements:

• CHBDYE elements are specific to thermal analysis
• They are used to apply flux and/or convection in thermal analysis
• They are not used for mechanical analysis
• CHBDYE elem configuration in HyperMesh is slave3 or slave4
• Due to their “non-physical” nature, they are not held in components
but in groups and can be selected using the “by group” selection
How to Define Heat Flux in HyperMesh
To create a heat flux on CHBDYE thermal interface elements:
1. Create a load collector with no card image
2. Create flux loading on CHBDYE thermal elements with loading type QBDY1
When creating heat flux loading:

• In order to select CHBDYE thermal elements , use the by group selection option
• The value unit should be {power_unit}/{distance_unit}². For example W/m².
• Flux will be shown as arrows in the graphics area
Thermal Boundary Conditions – Temperature Constraints
Temperature boundary conditions specify temperatures at grid points (GRID) associated with conduction
elements or ambient points (GRID or SPOINT).
• An SPC, SPC1 or SPCD can be used to define a fixed temperature for both steady state analysis or
transient analysis. The component number need to be blank or zero. Component number 1 can be
used if SPSYNTAX=mixed is specified.
• MPC can be used to specify the relationship between temperatures of different points with
component number blank or zero.
How to Define Imposed Temperatures in HyperMesh
To apply a temperature of 60.0 degree to grids ID 101 and 102

$======$$======$$======$$======$$======$$======$$======$$======$
SPC 1 101 60.0
SPC 1 102 60.0
1. Select grids #101 and #102 and create SPC without selecting any dof in “constraints” panel
2. Select SPCs and input D=60.0 in “card edit” panel

Thermal Boundary Conditions – Free Convection
In free convection, fluid motion is not generated by any external source, like pump, fan, etc, but only
by density differences in the fluid due to temperature gradients
• In OptiStruct, free convection allows thermal energy transfers between a surface and an ambient
environment (SPC/SPCD) through heat transfer coefficient (H) and a surface element (CHBDYE)
• Heat exchange equation for free convection
q=H*(T-T_amb)
where:
H – free convection heat transfer coefficient defined in MAT4
T – surface temperature
T_amb – ambient/sink temperature
How to Define Convection in HyperMesh
In order to define convection in HyperMesh:
1. Create a new PCONV convection property
2. Edit the MID to point to a MAT4 OR

How to Define Convection in HyperMesh
In order to define convection in HyperMesh:
3. Create CHBDYE surface elements for convection
OR
4. Assign ambient temperature node to surface elements and

ensure PCONID for the CONV is set to the convection ID
Free Convection: Bulk Cards Reference Overview
The following is an illustration of the references between cards used in a free convection setup in
OptiStruct
Transient Thermal Loading
The TLOAD1 card defines a time-dependent dynamic load or enforced motion
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
TLOAD1 SID EXCITEID DELAY TYPE TID
Time dependent thermal loading and boundary conditions

• Time dependent heat flux (QBDY1)
• Time dependent heat generation (QVOL)
• Time dependent temperature boundary conditions (SPCD)
• Time dependent ambient temperatures for convection (SPCD)
• Referenced by TLOADi in EXCITEID field
Time dependent loading curve
• Define time dependent loading scales via TABLEDi
• Referenced by TLOADi in TID field
Transient Thermal Loading
Time-dependent loadings can be combined in DLOAD cards & used together in a load step
Initial Condition and Time Step
Setting initial temperature conditions can be done through case control parameters
• IC case control command selects TEMP/TEMPD
Time step control is important to a transient simulation result

• TSTEP must be specified for linear transient
• Defines integration time step which should be small enough to get converged result
• Controls at which time steps solution will be generated and output

Thermal Loads and Boundary Conditions

Uploaded by

Copyright:

Available Formats

Thermal Loads and Boundary Conditions

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Thermal Loads and Boundary Conditions

Uploaded by

Copyright:

Available Formats

Chapter 2

Thermal Loads and Boundary Conditions

Generally, we can divide the

• Heat generation is a volumetric phenomenon in heat conduction analysis.

Heat_in = volume * HGEN * QVOL

• QVOL is directly applied on structural elements

The total thermal energy which goes into an element is given by

where Q0 is heat flux defined in QBDY1 card,

Notes about creating CHBDYE elements:

When creating heat flux loading:

To apply a temperature of 60.0 degree to grids ID 101 and 102

2. Select SPCs and input D=60.0 in “card edit” panel

2. Edit the MID to point to a MAT4 OR

4. Assign ambient temperature node to surface elements and

Time dependent thermal loading and boundary conditions

Time step control is important to a transient simulation result

You might also like

Pfad - The Proxy pFad of © 2024 Garber Painting. All rights reserved.