A New Class of Performance in A Seamlessly Integrated Single-Chip Solution

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Product Brief: AMD Ryzen™ Embedded R1000 Processor Family

A New Class of Performance in a Seamlessly


Integrated Single-Chip Solution
Product Overview
The AMD Ryzen™ Embedded R1000 processor brings together AMD Ryzen™ Embedded R1000 SoCs enable sophisticated
the powerful performance of AMD’s pioneering “Zen” CPU and system protection capabilities complemented by an expansive
“Vega” GPU architectures to the R-Series family. With up to breadth of I/O interconnect options.
3x generational CPU performance per watt5 and 4x better CPU
and graphics performance per dollar than the competition6, the The AMD Ryzen™ Embedded R1000 simplifies the design, form
R1000 is an ideal fit for embedded applications. factor and thermal management challenges inherent to discrete
CPU and GPU configurations. This highly integrated SoC enables
The R1000 SoCs provide platform scalability to the Ryzen™ system designers targeting thin clients, networking, casino
Embedded V1000 series via pin-to-pin compatibility and gaming, digital signage, and many other applications to easily
common software foundation whilst leveraging the same high and elegantly scale their graphics and compute performance
level of connectivity, including integrated 10Gb Ethernet. for advanced, feature-rich system designs. A single, small-
footprint AMD Ryzen™ Embedded R1000 SoC can power up to
The R1000 family delivers an optimal balance of performance three independent displays in brilliant 4K resolution, delivering
and power efficiency that enables a new class of designs with stunningly rich and immersive visual experiences.
thermal design power (TDP) between 6W and 25W. With a
comprehensive set of advanced, integrated security features,

2C/4T
"Zen" Cores
3
"Vega" Graphics CUs
3
4K Displays
4K
H.264/H.265 Enc. & Dec. VP91 Decode

Dual
10Gb Ethernet
SW & HW
Compatibility with V1000
Security
Secure boot and Memory Encryption
Product Brief: AMD Ryzen™ Embedded R1000 Processor Family

A New Class of Performance


AMD Ryzen™ Embedded R1000 SoCs provide a new class of and 3x "Vega" GPU compute units can be harnessed to achieve
performance to the Embedded R-Series portfolio, delivering breakthrough processing throughput for most demanding
up to a 52% generational IPC boost at the CPU2. Utilizing a graphics and compute workloads.
14nm FinFET process, up to 2x "Zen" CPU cores/4x threads

Markets
Gaming Machines Digital Signage Medical Imaging
Lottery Terminals, Digital Signage, POS/ Portable Medical
VLTs, and AWPs Kiosk, Quick Service Equipment, Clinical
Restaurant Workstation, MRI,
X-ray, CT

Industrial IoT Controls Thin Client Communications


& Automation Financial/Education, Infrastructure
Industrial PC, HMI Converged Devices uCPE, SD-WAN,
panels, Surveillance, Routers, Switches,
IoT Gateway UTM, Security
Appliances

Rich Multimedia AMD Ryzen™ Embedded R1000 Processor Family SoC

AMD Ryzen™ Embedded R1000 SoCs can power up to


three independent displays in crisp 4K resolution via Thread3 Display Output 1
DDR4 w/ ECC

AMD RADEON Graphics (Up to 3x CUs)

DisplayPort™ 1.4b and/or HDMI™ 2.0b. The integrated


Video Hardware Accelerator supports decode or encode Memory
CPU 1
for various widely used video codecs with resolutions Module Display Output 2
PCI Express® / Display

up to 4K: VP9 10-bit decode, H.265 10-bit decode and Thread2


8-bit encode, H.264 encode & decode1. Display Output 3

Thread1
Thread1
DDR4 w/ ECC

Memory 4x PCIe® GPP Lanes


CPU 0
Module
Thread0 4x PCIe® GFx Lanes
Seamless Integration & Security Features
Embedded R-Series R1000
Integrating a high-performance CPU and GPU on a single
die, the R1000 SoC enables significant space savings, SATA HDD SATA/ SATA Ex AMD Secure
smaller board designs and more efficient cooling Processor 2x USB 3.1
architectures than can be achieved with heterogeneous SPI Gen2 / Type-C
CPU and GPU chipsets – with attendant CAPEX and
eMMC eMMC or LPC USB 3.1 2x USB 3.1 Gen2
OPEX savings opportunities.
10Gb Ethernet
The R1000 SoCs leverage an onboard AMD Secure USB 2.0 2x USB 2.0
2x ports @1/10G or 2.5G
Processor for Crypto Co-processing that encrypts data 10Gb Ethernet
before it feeds to the I/O, complemented with Platform Multimedia
Secure Boot capabilities to help ensure systems Boot Flash Misc I/O HW Accelerator
Optional
are booted from trusted software, with one-time
(Check Part #)
programmable (OTP) capabilities enabling system
designers to manage their own keys.
Product Brief: AMD Ryzen™ Embedded R1000 Processor Family

Additional Key Benefits Security


• Equipped with up to dual-channel 64-bit DDR4 with Next-generation AMD Secure Processor (PSP)
performance up to 2400 MT/s, AMD Ryzen™ Embedded R1000 • fTPM2.0, crypto-offload, platform secure boot,
SoCs provide up to 8 PCIe® lanes, dual 1/2.5/10Gb integrated integrated DRM
Ethernet, up to four USB 3.1 Gen 2 interconnects, with • Field Programmable Keys
additional USB, SATA and NVMe support. • Secure Memory Encryption Support (SME)
• Planned product availability extends up to 10 years, providing
customers with a long-lifecycle support roadmap.

Integration
Next-generation Graphics Core and Multimedia
Performance • “Vega” GPU with up to 3 Compute Units
Next-generation x86 “Zen” Core • H.265 (10-bit) Decode & (8-bit) Encode, VP9 (10-bit) Decode1
• Two cores / up to four threads with up to 1MB of shared L2 plus • Up to 3x DisplayPort™ 1.43 or HDMI™ 2.0b
4MB of shared L3 total Enhanced I/O (FP5)
Up to dual-channel 64-bit DDR4 Up to 2400 MT/s • Up to 4x USB 3.1 Gen2 (10Gb/s) / 1 Type-C
• ECC support with ALT. DP power delivery capable
• 1 DIMM / channel • Up to 2x USB 2.0
• Up to 2x SATA ports
• NVMe support
• eMMC5.0, SD3, or LPC
• Up to 8L of PCIe® Gen3, 5x link max
• Up to 2x 10 Gigabit Ethernet (1/2.5/10Gb)
• Up to 2x UART, 4x I2C, 2x SMBus, SPI/eSPI,
I2S/HDA/SW, GPIO

Graphics Junction
CPU Core/ Base Freq. 1T Boost GPU Freq. Individual Max DDR4 Dual Ethernet
Model TDP Range Computing Package Temperature
Thread Count (GHz) Freq. (GHz) (GHz) (Max) Displays Rate (MT/s) Ports
Units (SIMD) Range (°C)

R1606G 12-25W4 2/4 2.6 3.5 3 1.2 3 FP5 2,400 1/2.5/10Gb 0 – 105

R1505G 12-25W4 2/4 2.4 3.3 3 1.0 3 FP5 2,400 1/2.5/10Gb 0 – 105

R1305G 8-10W8 2/4 1.5 2.8 3 1.0 3 FP5 2,400 1/2.5/10Gb 0 – 105

R1102G 6W9 2/2 1.2 2.6 3 1.0 2 FP5 2,400 1/2.5/10Gb 0 – 105

For more information about the specific features and specifications supported by select products in AMD’s solutions portfolio,
or to learn more about AMD's Ryzen™ Embedded R1000 Processor Family, visit www.amd.com/ryzenembedded-r-series

AMD.com/embedded
1. HEVC (H.265), H.264, and VP9 acceleration are subject to and not operable without inclusion/installation of compatible HEVC players. GD-81
2. Updated Feb 28, 2017: Generational IPC uplift for the “Zen” architecture vs. “Piledriver” architecture is +52% with an estimated SPECint_base2006 score compiled with GCC 4.6 –O2 at a fixed 3.4GHz. Generational IPC uplift for the “Zen” architecture vs. “Excavator”
architecture is +64% as measured with Cinebench R15 1T, and also +64% with an estimated SPECint_base2006 score compiled with GCC 4.6 –O2, at a fixed 3.4GHz. System configs: AMD reference motherboard(s), AMD Radeon™ R9 290X GPU, 8GB DDR4-2667
(“Zen”)/8GB DDR3-2133 (“Excavator”)/8GB DDR3-1866 (“Piledriver”), Ubuntu Linux 16.x (SPECint_base2006 estimate) and Windows® 10 x64 RS1 (Cinebench R15). SPECint_base2006 estimates: “Zen” vs. “Piledriver” (31.5 vs. 20.7 | +52%), “Zen” vs. “Excavator” (31.5
vs. 19.2 | +64%). Cinebench R15 1t scores: “Zen” vs. “Piledriver” (139 vs. 79 both at 3.4G | +76%), “Zen” vs. “Excavator” (160 vs. 97.5 both at 4.0G|+64%). GD-108
3. As of June 2017. Product is based on the DisplayPort 1.4 Specification published February 23, 2016, and has passed VESA’s compliance testing process (excluding HDR) in June 2017. GD-123  
4. Nominal TDP = 15W. Configurable in BIOS.
5. EMB-158: Testing done at AMD Embedded Software Engineering Lab on 3/13/2019. The AMD R-series Embedded SoC RX-216GD formerly codenamed as "Merlin Falcon" scored 118 and the AMD R-series R1606G scored 361, when running Cinebench® R15 benchmark
(Rendering Multi-core preset, 1920x1080x32 resolution). The performance delta of 3x was calculated based on "Merlin Falcon's" performance score of 118 and R1606G performance score of 361. System Configurations: AMD Embedded R-Series RX-216GD used AMD
“Bettong” Platform, with 2x8GB DDR4-2400 RAM, 250GB SSD Drive (non-rotating), TDP 15W, STAPM Enabled and ECC Disabled, Graphics Driver 18.50.190214a-339560C-AES, BIOS RPD130CB. The AMD Ryzen Embedded V-Series R1606G used an AMD R1000 Platform
with 2x8GB DDR4 2400 RAM, 250GB SSD Drive (non-rotating), TDP 15W, STAPM enabled and ECC Disabled, Graphics Driver 18.50_190207a-339028E-AES, BIOS RBB1190B. Both systems ran Microsoft Windows 10.0 Professional (x64) Build 17763.
6. EMB-159. Testing done at AMD Embedded Software Engineering Lab on 3/13/2019. The AMD R1505G Embedded scored 360 running Cinebench R15 Multi-core and 1,988 running 3DMark11 benchmarks. The Intel Core i3-7100U (Kaby Lake) scored 254 running Cinebench
R15 Multi-core and 1,444 when running 3DMark11 benchmarks. Recommended Customer price for Intel Core i3-7100U is $261 as of 4/1/2019 (check https://ark.intel.com/content/www/us/en/ark/products/95442/intel-core-i3-7100u-processor-3m-cache-2-40-ghz.
html). DBB price for R1505G is $80. System Configurations: AMD Embedded R1505G used a AMD R1000 Platform, with a 2x8GB DDR4-2400 RAM, 250GB SSD Drive (non-rotating), TDP 15W, STAPM Enabled and ECC Disabled, Graphics Driver 18.50_190207a-339028E-
AES, BIOS RBB1190B, Microsoft Windows 10 Pro. Intel Core i3-7100u used a HP 15inch Notebook, i3-7100u with Intel® HD Graphics 620, 1x8GB DDR4-2133 RAM, 1 TB 5400 rpm SATA, Microsoft Windows 10 Pro, Graphics Driver 21.20.16.4627, BIOS F.07.
7. GD-150: Max boost for AMD Ryzen and Athlon processors is the maximum frequency achievable by a single core on the processor running a bursty single-threaded workload. Max boost will vary based on several factors, including, but not limited to: thermal paste;
system cooling; motherboard design and BIOS; the latest AMD chipset driver; and the latest OS updates
8. Nominal TDP = 8W. Configurable in BIOS.
9. Nominal 6W SDP (Scenario Dissipation Power). Configurable in BIOS.

©2020 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, Ryzen, and combinations thereof are trademarks of Advanced Micro Devices, Inc. PCIe and PCI Express are registered trademarks of PCI-SIG Corporation. HDMI,
the HDMI logo and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing, LLC in the United States and other countries. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video
Electronics Standards Association (VESA®) in the United States and other countries. Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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