service manual

Service Manual
 service manual

Content
1.Description of Circuit Chart
1.1.GSM RF circuit
1.1.1.Receiving circuit
1.1.2.Transmitting circuit
1.2.Base band circuit
1.3.Bluetooth/FM/WIFI/GPS
2.Troubleshooting
2.1.Notes on Failure Handling
3.Fault repair
3.1.RF part failure
3.2.Base band failure
3.2.1.Startup process failure
3.2.2.Fail to download
3.2.3.Bluetooth/WIFI/GPS failure
3.2.4.Configuration defect
3.2.5.Unable to power on the phone
3.2.6.Ring tone Fault
3.2.7. LCD display fault
3.2.8.Failure to Charge
3.2.9.Failure to identify SIM card
3.2.10.Main Microphone fault
3.2.11.Keypad fault
3.2.12.Receiver fault
3.2.13.Vibrator fault
3.2.14.FM fault
3.2.15.No RF Signal
3.2.16.Failure to read T-flash card
3.2.17.Earphone Fault
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1. Description of Circuit Chart

T_Flash
J1313 SIM –Card J1312 J1310
ATV ANT WIFI/BT ANT
ANT1401 ANT801

CTP IC U1200 &

CTP CON J1202
TV IC U1401

BAT CON CON501

WIFI/GPS/BT/FM
IC U801
LCD Bridge IC
U1101
MEMORY1
U600

LCD CON
J1001

MEMORY 2
U601

CPU
U301
PMU
U501

音频 PA U700 RF PA 、
TRANSIVER U201

GSM ANT ANT101

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FRONT CAM CON1200

BACK CAM J1201

JACK J710

MIC MIC700
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1.1.GSM RF circuit

This phone is designed on MT8382 platform ,The RF chip contains in MT6166

chip ,Power amplifier adopts SKY77584 and TCXO adopts 26M reference frequency
crystal.
The MT6166 is a RF transceiver targeted at high speed 2G/3G-FDD/TDD multi-
mode smart phone and tablet computer implantd in 40 nm CMOS. The RF transceiver
function is fully integrated.
SKY77584 is a transmit and receive Front-End Module (FEM) with integrated
power amplifier control designed in a low profile, compact form factor for quad-band
cellular handsets comprising GSM850/GSM900 and DCS1800/PCS1900 operation.
The SKY77584 offers a complete Transmit VCO-to-Antenna and Antenna-to-Receive
SAW filter solution. The FEM also supports Class 12 General Packet Radio Service
(GPRS) multi-slot operation and EDGE downlink .

1.1.1.Receiving circuit

The GSM or DCS signal received from a base station via antenna is input from
the U102 after pass the combining filter and RF Receiving filter to the U201 , U201
has a built-in LNA and frequency mixer. The signal is amplified by its related Low
Noise Amplifier (LNA). The amplified signal is sent to a down converter, where the
signal is mixed with local oscillation (LO) output from RX VCO to generate zero
intermediate frequency (ZIF) signals. The zero-IF signal passes through a filter and is
amplified by programmable gain amplifier (PGA), then the signal is output to I and Q
demodulator to generate I/Q base band signals. The demodulated I and Q base band
signals are output to the base band part for further processing.

1.1.2.Transmitting circuit

A transmitter consists of I/Q modulation circuit, up-conversion mixer circuit,

power amplifier and duplex switch. Perform signal modulation to I and Q signals sent
to the Base Band chip U301. The follow-up XIF signal will be sent to a discriminator
on the offset frequency phase lock loop (OPLL). Then perform frequency
discrimination to this signal and the mixed signal of TXVCO signal and RFVCO
output signal. The discriminator outputs the signal control RFVCO and RFVCO
phase is enabled to lock at the phase of TXIF signal. TXVCO output RF is still
decided by RFVCO frequency. The phases of RFVCO and IFVCO signals lock at the
phase of VCTXO reference signal. TXVCO output signal is sent to transmission
power amplifier (PA). TX signal output from the pin of PA 19/20 passes through the
antenna switch and is transferred to the antenna for transmission.
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1.2. Base Band Circuit

Base Band adopts MT8382 , MediaTek MT8382 is a highly integrated 3G
System-on-chip (SoC) which incorporates advanced features e.g. HSPA R8 modem,
Quad-core ARM Cortex-A7 MPCoreTM operating at 1.2 GHz, 3D graphics
(OpenGL|ES 2.0), 8Mcamera ISP, LPDDR2/3 533 MHz and high-definition 1080p
video decoder. MT8382 helps phone manufacturers build high-performance 3G
smart phones with PC-like browser, 3D gaming and cine ma class home
entertainment experiences.

MT8382 Circuit map

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1.3.Bluetooth/FM /WIFI /GPS circuit

MT6627 (U801) is Designed in Bluetooth/FM /WIFI /GPS.
MT6627 is a 4-in-1 connectivity chip which contains a WiFi/Bluetooth
transcevier, a GPS receiver,and a FM receiver front-ends, along with integrated
passive device(IPD) in a QFN40 pacakge.Simplified block diagram and how
MT6627 connects to acompanion modem is shown in Figure 1. For WiFi and
Bluetooth, MT6627 provides an advanced switching mechanism which allows fast
switching between WiFi and BT modes. Hardware sharing and reuse is maximized.
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2. Trouble Shooting

2.1.Notes on Failure Handling

Notes:

The PCBA repairing is a very important procedure during the final production
of cellular phones. The speed and quality of repairing decides the yield and production
efficiency. The repair idea is very important for a good repairing technician. Make
sure not to heat a board right away once a phone reaches at hand.

Board
Board received
received

Check whether the

board fails
Heating
board
Check whether there
exist element
missing additional
elements or
deviation

Replace
each
element Measure related
circuits or elements
with equipments

Confirm board
Left aside
failure and change
or handle
the board
by others

Main board
Main board OK
scrapped
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3. Fault repair

3.1.RF part

(1) Receiving abnormality

The GSM or DCS signal received from a base station via antenna is input from
the U102 pin 26,The chipset has a built-in LNA and frequency mixer. The signal is
amplified by its related Low Noise Amplifier (LNA). The amplified signal is sent to a
down converter, where the signal is mixed with local oscillation (LO) output from RX
VCO to generate zero intermediate frequency (ZIF) signals. The zero-IF signal passes
through a filter and is amplified by programmable gain amplifier (PGA), then the
signal is output to I and Q demodulator to generate I/Q base band signals. The
demodulated I and Q base band signals are output to the base band part for further
processing.

Repair procedure:
(1) Test again and make sure that there is no misoperation. Observe the failure
carefully.
(2) Analyze the probable circuit related to the failure to minimize the failure detection
range.
(3) Perform visual detection to related circuits to find obvious failure cause, such as
missing or deviation.
(4) Measure/analyze/repair according to flowchart.

(2) Transmission abnormality

A transmitter consists of I/Q modulation circuit, up-conversion mixer circuit,

power amplifier and duplex switch. The follow-up XIF signal will be sent to a
discriminator on the offset frequency phase lock loop (OPLL). Then perform
frequency discrimination to this signal and the mixed signal of TXVCO signal and
RFVCO output signal. The discriminator outputs the signal control RFVCO and
RFVCO phase is enabled to lock at the phase of TXIF signal. TXVCO output RF is
still decided by RFVCO frequency. The phases of RFVCO and IFVCO signals lock at
the phase of VCTXO reference signal. TXVCO output signal is sent to transmission
power amplifier (PA) via the pins of U102 19/20. TX signal output from the pin of PA
26 passes through the antenna switch and is transferred to the antenna for
transmission.

Repair procedure:

(1) Test again and make sure that there is no disoperation. Observe the failure
carefully.
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(2) Analyze the probable circuit related to the failure to minimize the failure detection
range.
(3) Perform visual detection to related circuits to find obvious failure cause, such as
element missing or deviation.
(4) Measure/analyze/repair according to flowchart.

(3) AFC Fail

AFC—Automatic Frequency Control
VCO signal is compared in phase discriminator with the reference clock signal
generated by 13M crystal oscillator. Then output error signal AFC to adjust the both
end voltage of VCO Variable-Capacitance Diode, which finally leads to the
adjustment of VCO oscillation frequency. If AFC fails during calibration, the failure
appearance will be that the device fails to detect any frequency conformant to the
requirements.
There are several occasions:
(1) No signal output can also be reported as AFC Fail.
(2) Device connection failure can lead to signal attenuation.
(3) Transmission frequency is not stable or frequency deviates.

(4) APC Fail GSM

APC---Automatic Power Control

APC signal functions to assign phone transmission power grade for

communication system in different environments. APC directly influences PA. APC
Failure is reported when the signal power doesn’t reach or exceed the required power
during calibration.
Check all the elements in the transmission path and see whether there is any
incomplete soldering. If not, check PA or FEM. The check process is as follows. First,
use META to control the main board to transmit independent 900/1800 frequency
band. If the current at the maximum power is about 250mA in 900 frequency band
and the current at the maximum power in 1800 frequency band is about 200mA, PA
can be judged as normal. If the current deviates a lot from the values above, PA must
fail. The repair procedure is shown in the figure below.
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3.2.Base band failure

MTK uses relatively high integration and has limited peripheral independent
elements. Check whether there is any additional element, missing or wrong element
before hot air gun is used. If visual detection fails to find problem, use some
equipments to findfailure positions.

(1) Below 20MA: indicates that power starts working but the next action is not
performed. The cause can be incomplete soldering or damage in power
management, CPU or 26M circuit.
(2) 20~25MA: the cause can be: there is no download software; software functions
abnormally; or, CPU cannot read or execute software normally.
(3) 30~90MA: if the software, 26M and 32K are all normal, the cause can be
incomplete soldering. Check U301 。
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3.2.1.Startup process

When the Power-On button is pressed, PWRKEY will detect a low voltage.
The PMU MT6323 will turn on the LDOs which provide power-supply to base band
30ms later; then the RESET circuit of the PMU will generate the reset signal 200ms
later to make the base band chip run the power-on software.

Fail to startup

Press Startup to
High current
see current

20mABelow No current Current normal

Check whether
3.8V power
Whether Some output
CPU works supply is Software
redownload is NO voltage
abnormally normal,check download fail
ok shortcircuit
startup signal
circuit

YES

Check short
Check CPU Check power Solder/change circuit
N
work voltage supply circuit CPU according to
current

Check Clock Check clock Process short

N
signal circuit circuit

CPU:Solder/
change CPU

OK
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3.2.2.Fail to download
Make sure that the download current of main board is normal and important
I/O interfaces including J1304、U501and U301 are normal.

Fail to
download

Check the
connection
of
mainboard YES
and
download
cable
YES

Check IO Re-weld
NO YES
connector connector

YES

Check boot Check boot

NO YES
circuit circuit

YES

Re-weld
Check Crystal
26MHz NO oscillator and YES
clock Relevant
circuit

YES

Check
VDD/ NO Re-weld CPU YES
VCORE

YES

Re-weld
Check flash NO YES
FLASH

YES

Check CPU NO Re-weld CPU YES

OK
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3.2.3. Bluetooth /WIFI /GPS failure

Please refer to the details of Bluetooth /WIFI/GPS circuit description in Part 1.

First perform visual examination to check whether there are missing pieces on
related circuits or significant deviation. Then perform circuit analysis according to
the maintenance process.

Bluetooth failure

Check whether Process

U403 circuit N related Y
soldering well faulty

Check
Check whether
power
work Voltage is N Y
normal supply
circuit

Check whether Process

clock signal is N related Y
normal circuit

Check whether Solder

control signal is N /change Y
normal U302

Solder/ change
U403

OK
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3.2.4. configuration defect

For structural parts of the fault, please refer to phone the disassembly
procedures for the corresponding change

3.2.5. Unable to power on the phone

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3.2.6. Ring tone Fault

No ringtone

YES

Check the
soldering
Re-weld
of NO YES
speaker
speaker.OK
?

YES

Replace
OK!Mark the
speaker and YES YES
failed speaker
test

NO
Check the
speaker Mark the
circuit no mainboard
NO YES
short circuit with analysis
or open result
circuit
YES

Replace
new
mainboard

OK
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3.2.7. LCD display fault(TP same to LCD)

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3.2.8. Failure to Charge

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3.2.9. Failure to identify SIM card

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3.2.10.Main Microphone fault

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3.2.11. Keypad fault

Keypad do not
work correctly

Check:
Paste the DOME
dome is
YES orassemble Y
assembled
keymat again
correctly

N
NO

Is there any
dirty on Clean keypad
YES Y
keypad surface and test
surface?

N
NO

Is sidekey
soldered
Solder or replace
well? YES Y
sidekey
No short
circuit

NO

Replace N
new
mainboard

OK
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3.2.12.Receiver fault
No voice in
receiver

Is receiver
Replace new
ok? No NO Y
receiver
broken wire

N
YES

Check
receiver
connector Weld receiver
YES Y
for connector
soldering
defect
N
NO

Check
Mark the
receiver
YES mainboard with Y
circuit for
analysis result
any fault

NO

Replace N
new
mainboard

OK
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3.2.13.Vibrator fault
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3.2.14.FM fault
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3.2.15.No RF Signal

No RF signal

Is RF
antenna Re-assemble RF
NO Y
assembled antenna
correctly?

N
YES

Is the
phone set Return to normal
YES Y
into flying mode
mode?

N
NO

Check RF Mark the

circuit for yes mainboard with
any fault analysis result

NO

Replace
new
mainboard

OK
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3.2.16. Failure to read T-flash card

Fail to read T-
flash card

Is T-flash
card Re-insert T-flash
NO Y
inserted card
correctly?

N
YES

Check: the
T-flash NO Replace new card Y
card is OK?

N
YES

Check card
socket is
Clean socket or
clean and NO
replace socket
no physical
fault

YES

Mark the
Check card
mainboard with
circuit for YES
analysis result
any fault

NO

Replace
new
mainboard

OK
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3.2.17.Failure to use earphone

Failure to use
earphone

Check :earp
hone is Replace new
NO Y
OK? No earphone
damage

N
YES

Check
earphone
connector Weld earphone
YES Y
for connector
soldering
defect
N
NO

Is there any
foreign
Clean or replace
matter in NO
connector
earphone
connector?

YES

Check Mark the

earphone mainboard with
YES
circuit for analysis result
any fault

NO

Replace
new
mainboard

OK
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END