Realize Your Product Promise™ Thermal Management of Electronics Using ANSYS Icepak Fluid Dynamics BSCR ed fared UME MUL uy ae) Mohammad Elyyan Technical Service Engineer ANSYS Inc.EXSS! Agenda * ANSYS Icepak Overview * Sample Problem: Thermal analysis of electronics in downhole equipment * Background * Problem Description * System Model + Zoom-in Model * Summary 2 © 2012 ANSYS, ne June 21,2012EXE ANSYS Icepak 3 ANSYS Icepak is an integrated electronics cooling solution for IC packages, printed circuit boards and complete electronic systems. Steady state and transient thermal- flow Conduction Convection Radiation a Conjugate heat transfer Velocity streamlines and temperature contours for a card array ina VME format box cooled by three axial fans modeled using a moving reference frame (MRF) fan model.Eee IC Package Thermal Analysis Detailed and compact thermal te models of IC packages 4 Import EDA data from a variety of layout tools Detailed thermal conductivity map for package substrate Import die power map from a variety of tools Export temperatures to ANSYS Temperature contours on a 272-pin Mechanical for thermal-stress BGA package, package data imported from an MCM file Create compact thermal models * Two-resistor, star, DELPHIEXXSae Printed Circuit Board Thermal Analysis Cooling simulation for single and rack mounted boards Import EDA layout data from a variety of board layout tools Detailed thermal conductivity map for PCB layers Resistive heating of traces Export temperatures to ANSYS. Mechanical for thermal-stress Thermal-stress analysis of a computer graphics cardENS Electronic System Thermal Analysis Design the flow and thermal elements for electronic systems Import 3D MCAD via Workbench Geometry Interfaces Simply and defeature geometry with ANSYS DesignModeler Extensive libraries of standard electronic components and materials Advanced fan modeling Export temperatures to ANSYS Temperature contours and fluid velocity Mechanical for thermal-stress vectors of a fan cooled rack mounted computerENSee Interface to Slwave * Slwave and ANSYS Icepak exchange both power map and temperature data = Accounts for copper resistive losses in printed circuit boards and packages Power Map —=_> Temperature Current Density Temperature (Slwave) (Icepak)Ese" Interface to ANSYS Mechanical Import temperature data from ANSYS Icepak to ANSYS Mechanical for thermal-stress analysis Thermal-stress simulation for a computer graphics card - performed in the ANSYS Workbench environmentSample Problem: Thermal Analysis of Electronics Board in Down-hole Equipment 9 ©2012 ANSYS, Inc. June 21,2012Esse Background * Electronics devices exist in down-hole tools to collect sensors data, drive actuators, multiplexing, data storage + Wireline tools * Logging While Drilling (LWD/ MWD) tools * Permanent monitoring systems in oil wells * Rough operating conditions: - Wells are getting deeper = sink temperature keeps rising — Formation temperature is about 100 to 120°C at~ 4 km - IC packages rarely designed to withstand > 150 °C * Challenge: - Narrow temperature band of operation > Thermal management of Electronics is critical - Natural convection cooling only - Accurate prediction of electronics reliability is needed—ANSYS IcepakENSae Case Study: Wireline Toolstring Thermal analysis of electronics within wireline toolstring - Complex geometry + Wide range of length scales ~ Different operating conditions: drilling orientation — Modeling methodology: System vs. detailed > overview > background Problem Desinton -) Stem model 11° D201 ANS, ne Tune 21,2032EOSee Modeling Strategy Perform analysis in two steps 1. System level analysis - Get the big picture - Fewer details — Lumped PCB and IC modeling . , Component 2. Zoom-in analysis Board — More details included — Results profiles mapped from System level model System - Hotspot detectionEXSSe Problem Description * WIRELINE TOOLSTRING - 7’ long, 2.5” dia + Houses 16” Electronic Section containing: - PCBwithICs: Power =11.1W — IGBTFETsx3: Power=11Wea — Actuator device: Power = 4 W * Tool string studied in 8” dia well — Natural convection in well fluid — Natural convection and radiation within electronic section of tool S overiew >) seciground cave study Sytem model 13° D201 ANS, ne Tune 21,2032Eee Problem Description (Contd.) IGBT heat sink * Power components (red) PCB components total 11.1 W — Details in next slide IGBT x3 : 11 W each — Mounted on single heat sink Actuator: 4 W 1GBT (11 W) x3 ce (11.1 W) Actuator (4 W) * All parts mounted on the Core * Core slides into housing core 16, mounting. * Contact resistances exists between parts parts D 2012 ANSTS, In Tone 21, 2012EXSe8 Problem Description (Contd.) PCB DETAILS SOIC 32 * 141Cs on PCB * 8, and 6}, data for different ICs * 6 Cu layers in PCB Name faim) [en(crw [eter | [Layer [Thick (mil [% Cover FP 144 |5 12 0.6 1 14 sos1 a 4 - 5 = ee sos-2 [2 4 js Ta 3 lsoicia fos [5 PCB [esa soic20 fos [5 soic32 [os |S kp =18.6 WimK; ky = 0.38 WimK Diode fo. |- PCB trace layers details IC details 15) D 2012 ANS, ne Tone 21, 2012EOSee Modeling: Geometry—CAD 16 Icepak can accepts both MCAD and ECAD data CAD-to-Icepak conversion in ANSYS Design Modeler (DM) 1. 3. Import native CAD using ANSYS CAD interface Use any DM tools to modify geometry as required DM ELECTRONICS (DME): convert into Icepak objects D 2012 ANSTS, In Tone 21, 2012 1B De SPagamaak we water Toselny BPoraneers cue Hea set Icopsk object Type AJ show tee Bodies RD show CAD Bodtes = Revert ViewEXSee Modeling: Geometry—PCB ¢ Import board layout and trace data directly into Icepak - Board outline and components layout € IDF import — PCB traces € ANSYS Ansoftlinks, Gerber, BRD formats IDF: Board Layout EDA (Cadence, Mentor, Altium, Zuken, etc) ‘ANF, BRD, GBR: Traces 17° D201 ANS, ne Tone 21, 2012Eee System Level Model Get the BIG PICTURE Domain top BC * Overall heat flow from tool to surroundings Well fluid * Keep larger components + Reduced details fewer mesh count> faster run Electronic section + All possible operating conditions external to tool of Tool + Well fluid properties, e.g. non-Newtonian * Different formation temperature conditions * Tool orientation — gravity direction * Model natural convection and radiation within tool Domain bottom BC 18) D 2012 ANS, ne Tone 21, 2012Eee System Level Model * Only larger components considered * Board: - Individual components on PCB NOT modeled — PCB generates 11.1 W of component power — Uniform orthotropic conductivity of PCB — compact PCB model * IGBTs: Network resistor model with 6, (C/W) * Actuator: Actuator — lumped Fe block with 4 W * Simpler model > Less details> Fewer mesh count Overview > Tine 200 19° _ D 2012 ANS, neEee System Level Model Domain P H top BC + 4 Different cases considered: * First three to determine worst case scenario * Working fluid: water Well fluid * Domain height: 20’ for cases i, ii, and iii; 30’ for case iv Kid Kal lil aaa Open Open T=100°C -9.817 ii Open T=00°C T=100°C -9.817 ii Open‘ T=400°C = T=100°C- -9.81 iv Adiabatic T=100°C T=100°C _ selected from worst case Electronic section Domain bottom BC Lb 20° D2U1D ANS, ne Tone 21, 2012Results: System Level Flow — Cases i, ii, iii * Well fluid flow structure ao — Reasonable to expect annular circulation / — Low velocity vectors at bottom * Case i— unidirectional upward flow > Not realistic * Case ii — flow recirculation around tool > reasonable * Case iii (horizontal)- Very different flow field as expected Sekitcerers Case iii Be atte Caseii 0.000 0.001.002 0.004 0,005 Velocity Im 1 > overview > Background) cae study) Problem Decision Zeonrinmodel S) _Sanary 21 BRUT ANS, ne Tune 21,2032Eee Results: System Level Thermal - Cases i, ii, i * Temperatures for IGBTs and PCB * Similar temperatures in cases i, ii * Slightly lower temperatures for Case iii Component Temperatures in °C [Component _|Casei_|Caseii_|Case iii ligbt.1 110.4 110.5| 108.7] ligbt.2 110.5, _110.6| 108.9 light.3 110.2) 110.2} 108.8 [PCB 116.4) 116.5) 114.8) * Case ii may be considered as the Worst case scenario—Case iv * Modeling concerns with case ii: — Top opening too close to tool — may numerically influence flow field - Complete recirculation is not visible — Extend domain 22° D2UTD ANS, ne Tone 21, 2012EXNXSSe Results: Case iv a + Well extended above tool > H,...)= 30’ 0.024 ‘total * Top B.C. set to adiabatic wall: core — Enforces circulation aie - Temperatures similar to case ii mena Component Temperatures in °C Component [Case i [Case ii [Case iv ight.1 110.4] 110.5| 110.5 ight.2 110.5] 110.6 110.6 ight.3 110.2) 110.2) 110.3 PCB 116.4] 116.5] 116.5 * Further confidence in earlier results * Case iv used to create zoom-in detailed model (discussed later) 23° DOLD ANS, ne Tone 21, 2012EXNSee8 Detailed Zoom-in Model * Focus: Electronic section of the tool string * Detailed flow structure and temperature distribution * PCB hotspot detection * Case iv solution used to create zoom-in model: = 1 from electronic housing at the top > temperature within 1 °C rise from ambient — 3” from electronic housing at the bottom ~ P, Uy, Uy, U;, and T profiles used as BC for zoom-in model 24° DOLD ANS, ne Tone 21, 2012EXNSee8 Detailed Zoom-in Model * Detailed Board model — All PCB components included Layer hick rt) fe over rt 1 2 14 om iS 14 até le 14 3 * Two PCB modeling options applied pcs {65.4 1. Uniform orthotropic conductivity: he = 18.6 Wink: ky = 0.38 Wink] P a Orthotrc iductivit = Unifrom planar and normal conductivities (kp, ky) O*OMoPIC conductivity used throughout the PCB 2. Trace based conductivity — Computed from Cu pattern of in each CFD cell Trace Distribution = Each cell in the PCB has a unique triad of k,, kk, 25 _ D 2012 ANS, ne Tone 21, 2012Esee Results: Zoom-in Model Layer Thick ni) % Cover 1 14 23 2 14 are * Comparison of c§nductivifies of fhé PCB PCB eb * Lumped PCB: [k, =186 Wim; ky =0.38 WimK ‘mx. + Layer 1—all components are mounted oa — Therefore most important to capture nos " trace conductivity ia = Layers 2,5 almost fully copper (k ~ 385 W/m.K) * Overdesign with lumped PCB 221.57 17125 132.94 28.63 k, > i , Conductivity of Lumped ky orthotropic PCB kpca in trace modeled PCB 26 D2U1D ANS, ne Tone 21, 2012EXSae Results: Zoom-in Model * Type of PCB model — important to temperature field * Trace important for down hole tools > conduction dominated 0) ‘Compact | Trace |Component Pcp pcs | aift [U4-S08 175.2| 154.7| 37.5] Us-S014 144.4[ 136.1[ 22.0) U10-SO20_BW_A 139.1] 138.1 2.6] Higher temperature levels for U9-S020_BW_A 136.4] 134.1] 6.8| compact PCB model U5-S0J32_300 136.4| 129.5| _23.2| U6-S0J32_300 1256| 122.4[_ 35 lU7-SarP20x20_144| 159.6] 139.3| 51.4 U14-S08 204.1] 176.6| 35.9 igbt.4 110.3/ 110.3|-0.2| igbt2 110.3 110.4[ -0.5| igbt 3 109.9[ 109.9[ _-0.3| 27° BRUT ANS, ne Tone 21, 2012EXSSe Results: Zoom-in Model Temperature 2078 r Temperature i. a@ 996 Compact PCB Detailed PCB S oversaw > sscigrouns case study -) Moblem Dexiption >) Sytem model Summary 28 D202 ANS, ne Tune 21,2032Ese System Coupling: Thermo-Mechanical * Icepak is integrated into ANSYS Workbench Goal: CFD and thermal only Focus limited to modeling with Icepak Goal: Thermo-Mechanical Detailed thermal field from 29° D2U1D ANS, ne Tone 21, 2012EX ssae System Coupling: Thermo-Mechanical Analysis —- » ~ @ ‘ es, y ——*,— dEsse Summary * Close integration of Icepak and Chip/package design tools * Thermal analysis of downhole electronics conducted for different operating conditions * System and zoom-in detailed models analyzed * System level: big picture analysis of flow and T profiles oe * Zoom-in: hot spot detection or? * System coupling available with Icepak ae yo ge go 0 ye” Se LL a1 D 2012 ANS, ne Tone 21, 2012