Alpha Ef 2100 Technical Data Sheet

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TECHNICAL BULLETIN

ALPHA® EF-2100
VOC-Free No Clean Flux

DESCRIPTION

ALPHA EF-2100 is VOC-Free, halide-free, rosin/resin-free, non-toxic, low solids no-clean flux which provides the
highest activity of any VOC-free Bellcore SIR compliant flux for defect-free soldering. ALPHA EF-2100 is
formulated as a drop in replacement for ALPHA EF-2210, ALPHA EF-2202, ALPHA WB-400 & ALPHA NR-300.
Several proprietary organic activators deliver excellent wetting and top-side hole-fill, even with OSP coated bare
copper boards which have undergone prior thermal excursions. They also act to reduce the surface tension
between the solder mask and the solder; thereby, dramatically reducing the tendency of solder ball generation.
The formulation of ALPHA EF-2100 is also designed to be more thermally stable; thereby, reducing the
occurrence of solder bridging.

FEATURES & BENEFITS

• Bellcore SIR compliant for assemblies requiring this standard.


• VOC-Free to help meet air quality regulations.
• Exceptional wetting for excellent hole-fill even with OSP coated bare copper boards, with prior reflows.
• Thermally stable activators provide low solder bridging.
• Reduces the surface tension between solder mask and solder to provide low solder ball frequency.
• Suitable for selective soldering process.
• Excellent cosmetics. Very low level non-tacky residue to reduce interference with pin testing and good board
cosmetics.

APPLICATION

FLUX SOLIDS CONTROL: If rotary drum spray fluxing, the flux solids will need to be controlled via thinner
addition, in this case DI water, to replace evaporative losses of the flux solvent. As with any flux with less than
5% solids content, specific gravity is not an effective measurement for assessing and controlling the solids content.
The acid number should be controlled to between 29.5 and 33.5. Alpha's Flux Solids Control Kit #3, a digital
titrator, is suggested. Request Alpha's Technical Bulletin SM-458 for details on the kit and titration procedure.
When operating a rotary drum fluxer continuously, the acid number should be checked every eight hours. Over
time, debris and contaminants will accumulate in re-circulating type flux applicators. For consistent soldering
performance, dispose of spent flux every 40 hours of operation. After emptying the flux, the reservoir should be
thoroughly cleaned with DI water.

PREPARATION: In order to maintain consistent soldering performance and electrical reliability, it is important to
begin the process with circuit boards and components that meet established requirements for solderability and
ionic cleanliness. It is suggested that assemblers establish specifications on these items with their suppliers and
that suppliers provide Certificates of Analysis with shipments and/or assemblers perform incoming inspection. A
common specification for the ionic cleanliness of incoming boards and components is 5g/in2 maximum, as
measured by an Omegameter with heated solution.

Care should be taken in handling the circuit boards throughout the process. Boards should always be held at
the edges. The use of clean, lint-free gloves is also recommended.

Conveyors, fingers and pallets should be regularly cleaned. DI Water can be used alone or, for more difficult
conditions, IPA and ALPHA SM-110 Solvent Cleaners have been found to be very useful.

SM # 1254-2 2016-12-01
TECHNICAL BULLETIN

ALPHA® EF-2100
VOC-Free No Clean Flux

RESIDUE REMOVAL: ALPHA EF-2100 is a no-clean flux and the residues are designed to be left on the board.
If desired, flux residues can be removed with semi-aqueous cleaner or with other commercially available solvent
cleaners.

TOUCH-UP/REWORK: Use of the ALPHA Cleanline Write Flux Applicator with ALPHA NR205 flux and ALPHA
Telecore HF-850 cored solder is recommended for hand soldering applications.

GENERAL GUIDELINES FOR MACHINE SETTINGS

OPERATING PARAMETER TYPICAL LEVEL


Amount of Flux Applied Spray: <2000 μg/in2 of solids
Top-Side Preheat Temperature 95 - 115°C (203 - 240°F)
Bottom-Side Preheat Temperature 0 to +22°C (0 to +70°F) vs. Top-Side
Straight ramp to desired top-side
Recommended Preheat Profile
temperature
Maximum Ramp Rate of Topside Temperature
2°C/second (3.5°F/second) maximum
(to avoid component damage)
Conveyor Angle 5 - 8° (6° most common)
Conveyor Speed 1.0 - 6.5 feet/minute
2 - 7 seconds
Contact Time in the Solder (includes Chip Wave & Primary Wave)
(3 - 5 seconds most common)
Solder Pot Temperature:
Lead-Free Alloys (99.3Sn/0.7Cu, 96.5/3.5Ag, SAC305,SAC405,
260 - 270°C (500 - 520°F)
ALPHA SnCX® Plus & ALPHA SACX Plus™)
These are general guidelines which have proven to yield excellent results; however, depending upon your equipment, components, and
circuit boards, your optimal settings may be different. In order to optimize your process, it is recommended to perform a design experiment,
optimizing the most important variables (amount of flux applied, conveyor speed, topside preheat temperature, solder pot temperature and
board orientation).

TECHNICAL DATA

Item Typical Values Item Typical Values


Clear
Appearance pH, as is 2.2
Colorless Liquid
Solids Content, wt/wt 4.0 Recommended Thinner DI Water
Specific Gravity @ 25°C (77°C) 1.015 ± 0.003 Shelf Life (from Date of Mfg) 540 days
Acid Number (mg KOH/g) 31.5 ± 2.0 VOC content <1%
Flash Point (T.C.C.) None IPC J-STD-004 Designation ORL0

SM # 1254-2 2016-12-01
TECHNICAL BULLETIN

ALPHA® EF-2100
VOC-Free No Clean Flux

CORROSION & ELECTRICAL TESTING

CORROSION TESTING
Test Requirement for ORL0 Results
Silver Chromate Paper2
No detection of halide Pass
IPC-TM 650 Test Method 2.3.33
Copper Mirror Tests2
No complete removal of copper Pass
(Modified IPC/Bellcore Method)
Copper Corrosion Test
No evidence of corrosion Pass
IPC-TM 650 Test Method 2.6.15

J-STD-004A SURFACE INSULATION RESISTANCE


Test Conditions Requirements Results
"Comb-Down" Uncleaned 85°C/85% RH, 7 days > 1.0 x 108 Ω 3.6 x 109 Ω
"Comb-Up" Uncleaned 85°C/85% RH, 7 days > 1.0 x 108 Ω 4.4 x 109 Ω
Control Boards 85°C/85% RH, 7 days > 1.0 x 109 Ω 2.1 x 109 Ω
IPC Test Condition (per J-STD-004): -50V, measurement @ 100V/IPC B-24 board (0.4mm lines, 0.5mm spacing).
2
Copper Mirror and Silver Chromate Paper tests were performed using flux sample prepared by reconstituting with isopropyl alcohol
after evaporation of its water vehicle at 80°C for one hour as per footnote 1 of table 5, page 8 of J-STD-004.

J-STD-004B SURFACE INSULATION RESISTANCE


Requirements Results (min. of all measurements recorded)
Test (< 1.0x108 allowed
< 24 Hrs 24 – 168 Hrs Visual
during initial 24 hours)
"Comb-Down" Uncleaned > 1.0 x 108 Ω 1.10 x 109 Ω 2.59 x 1010 Ω PASS
"Comb-Up" Uncleaned > 1.0 x 108 Ω 1.66 x 1010 Ω 5.89 x 1010 Ω PASS
Control Boards > 2.0 x 108 Ω 7.94 x 109 Ω 1.58 x 1011 Ω NA
IPC Test Condition (per J-STD-004B TM 2.6.3.7): IPC B-24, 40oC, 90%RH measurements recorded at 20 min intervals

BELLCORE SURFACE INSULATION RESISTANCE


Test Conditions Requirements Results
"Comb-Down" Uncleaned 35°C/85% RH, 5 days > 2.0 x 1011 Ω 5.31 x 1012 Ω
"Comb-Up" Uncleaned 35°C/85% RH, 5 days > 1.0 x 1011 Ω 1.03 x 1013 Ω
Control Boards 35°C/85% RH, 5 days > 1.0 x 1011 Ω 6.66 x 1012 Ω
Bellcore Test Condition (per GR 78-CORE, Issue 1): 48 volts, measurements @ 100V/25 mil lines 50mil spacing.

BELLCORE ELECTROMIGRATION
Visual
Test SIR (Initial) SIR (Final) Requirement Result
Result
"Comb-Up" Uncleaned 6.8 x 109 Ω 2.1 x 109 Ω SIR(Initial) /SIR(Final) <10 Pass Pass
"Comb-Down" Uncleaned 1.0 x 1011 Ω 3.2 x 1011 Ω SIR(Initial) /SIR(Final) <10 Pass Pass
Bellcore Test Condition (per GR 78-CORE, Issue1): 65oC/85% RH/500 Hours/10V, measurement @ 100V/IPC B-25B Pattern
(12.5 mil lines, 12.5 mil spacing).

SM # 1254-2 2016-12-01
TECHNICAL BULLETIN

ALPHA® EF-2100
VOC-Free No Clean Flux

SAFETY

Please refer to the Safety Data Sheet as the primary source of health and safety information. The most recent
version of the SDS is available from AlphaAssembly.com.

Inhalation of the volatilized flux activator fumes which are generated at soldering temperatures may cause
headaches, dizziness and nausea. Suitable fume extraction equipment should be used to remove the flux from
the work area. An exhaust at the exit end of the wave solder machine may also be needed to completely capture
the fumes. Observe precautions during handling and use. Suitable protective clothing should be worn to
prevent the material from coming in contact with skin and eyes.

STORAGE

Keep from freezing. Store between 0-25°C. Do not remove from original container and store materials with sealed
lids.

CONTACT INFORMATION

To confirm this is the most recent issue, please contact Alpha Assembly Solutions
AlphaAssembly.com

North America Europe Asia


300 Atrium Drive Unit 2, Genesis Business Park 8/F., Paul Y. Centre
Somerset, NJ 08873, USA Albert Drive 51 Hung To Road
800.367.5460 Woking, Surrey, GU21 5RW, UK Kwun Tong, Kowloon, Hong Kong
01483.758400 852.3190.3100

Also read carefully warning and safety information on the Safety Data Sheet. This data sheet contains technical information required for safe and economical operation of this product. READ IT
THOROUGHLY PRIOR TO PRODUCT USE. Emergency directory assistance Chemtrec 1 - 800 - 424 - 9300.

DISCLAIMER: All statements, technical information and recommendations contained herein are based on tests we believe to be reliable, but the accuracy or completeness thereof is not
guaranteed. No statement or recommendation shall constitute a representation unless set forth in an agreement signed by officers of seller and manufacturer. NO WARRANTY OR
MERCHANTABILITY OR WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE IS MADE. The following warranty is made in lieu of such warranties and all other warranties, express,
implied, or statutory. Products are warranted to be free from defects in material and workmanship at the time sold. The sole obligation of seller and manufacturer under this warranty shall be to
replace any product defective at the time sold. Under no circumstances shall manufacturer or seller be liable for any loss, damage or expense, direct or consequential, arising out of the inability
to use the product. Notwithstanding the foregoing, if products are supplied in response to a customer request that specifies operating parameters beyond those stated above, or if products are
used under conditions exceeding said parameters, the customer by acceptance or use thereof assumes all risk of product failure and of all direct, indirect and consequential damages that may
result from use of the products under conditions, and agrees to exonerate, indemnify and hold harmless MacDermid Incorporated therefrom. No suggestion for product use nor anything
contained herein shall be construed as a recommendation to use any product in infringement of any patent rights, and seller and manufacturer assume no responsibility or liability for any such
infringement.

® Registered Trademark of MacDermid Performance Solutions. ™ Trademark of MacDermid Performance Solutions.


© Platform Specialty Products Corporation and its subsidiaries 2016.

SM # 1254-2 2016-12-01

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