24FC1025 Eeprom
24FC1025 Eeprom
24FC1025 Eeprom
Features: A1 2 7 WP
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
5 4
2 D3
SCL
7
3 8 9 10
SDA
6
IN
15
13 14
SDA
OUT
(protected)
WP 11 12
(unprotected)
SDA
SCL 1 2 3 4 5 6 7 8 9 1 2 3
The transmitter must release the SDA line at this The receiver must release the SDA line at this
point allowing the receiver to pull the SDA line low point so the transmitter can continue sending
to acknowledge the previous eight bits of data. data.
B A A A A A A A A A A A A
1 0 1 0 1 0 R/W • • • • • •
0 15 14 13 12 11 10 9 8 7 0
A A A A
BUS ACTIVITY C C C C
K K K K
X = “don’t care” bit
Did Device No
Acknowledge
(ACK = 0)?
Yes
Next
Operation
Control S
BUS ACTIVITY T
Byte Data n Data n + 1 Data n + 2 Data n + X
MASTER O
P
SDA LINE P
A A A A N
C C C C O
BUS ACTIVITY K K K K A
C
K
XXXXXXXX 24LC1025
TXXXXNNN I/P e3 13F
YYWW 0928
XXXXXXXT 24L1025I
XXXXYYWW SN e3 0928
NNN
13F
XXXXXXXX 24LC1025
TXXXXXXX I/SM e3
YYWWNNN 0928 13F
Note: For very small packages with no room for the Pb-free JEDEC designator
e3 , the marking will only appear on the outer carton or reel label.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
* Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.
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Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
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Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Revision A
Original release.
Revision B
Section 1.0 Electrical Characteristics: revised Ambient
Temperature; Revised Table 1-1; Revised Section 2.1
and Section 2.5.
Revision C
Revised Features, Maximum Read Current and Table
1-1, D9; Revised Table 2-1, VCC; Revised Section 6.3.
Revision D (01/2007)
Revised Device Selection Table; Features Section;
Changed 1.8V to 1.7V; Revised Tables 1-1, 1-2, 2-1;
Revised Product ID System; Replaced Package
Drawings.
Revision E (03/2007)
Replaced Package Drawings (Rev. AM).
Revision F (10/2008)
Corrections on the Device Selection Table; Corrections
on the Description; Corrections on the AC Characteris-
tics table; Corrections on the Pin Function Table;
Corrections on the Product ID System; Updated
Package Drawings.
Revision G (01/2010)
Added 8-Lead SOIC Package.
Revision H (01/2011)
Revised PDIP Package Type Diagram; Revised
Section 1.0 Electrical Characteristics; Revised SOIC
Package Marking Information (3.90mm).
From: Name
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Application (optional):
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Questions:
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
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• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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ISBN: 978-1-60932-833-7
08/04/10