Automation PC 620 - E - V2 - 68
Automation PC 620 - E - V2 - 68
Automation PC 620
User's Manual
All information contained in this manual is current as of its creation/publication. We reserve the
right to change the contents of this manual without warning. The information contained herein is
believed to be accurate as of the date of publication; however, Bernecker + Rainer Industrie-
Elektronik Ges.m.b.H. makes no warranty, expressed or implied, with regards to the products or
the documentation contained within this book. In addition, Bernecker + Rainer Industrie-
Elektronik Ges.m.b.H. shall not be liable in the event of incidental or consequential damages in
connection with or resulting from the furnishing, performance, or use of these products. The
software names, hardware names, and trademarks used in this manual are registered by the
respective companies.
Chapter 3: Commissioning
Chapter 4: Software
Chapter 6: Accessories
Appendix A
Figure index
Table index
Index
Table of contents
7.2 Features with WES2009 (Windows Embedded Standard 2009) ................................. 589
7.3 Installation ................................................................................................................... 590
7.4 Drivers ......................................................................................................................... 590
7.4.1 Touch screen driver .............................................................................................. 590
8. Automation PC 620 with Windows CE .............................................................................. 591
8.1 General information ..................................................................................................... 591
8.2 Windows CE 5.0 features ............................................................................................ 592
8.3 Windows CE 6.0 features ............................................................................................ 593
8.4 Differences between Windows CE 6.0 and Windows CE 5.0 ..................................... 593
8.5 Requirements .............................................................................................................. 594
8.6 Installation ................................................................................................................... 594
8.6.1 B&R Embedded OS Installer ................................................................................ 594
9. B&R Automation Device Interface (ADI) driver - Control Center ...................................... 595
9.1 Features ...................................................................................................................... 596
9.2 Installation ................................................................................................................... 597
9.3 SDL equalizer setting .................................................................................................. 598
9.4 UPS configuration ....................................................................................................... 599
9.4.1 Installing the UPS service for the B&R APC add-on UPS .................................... 599
9.4.2 Displaying UPS status values ............................................................................... 600
9.4.3 Changing UPS battery settings ............................................................................. 601
9.4.4 Updating UPS battery settings .............................................................................. 603
9.4.5 Saving UPS battery settings ................................................................................. 604
9.4.6 Configuring UPS system settings ......................................................................... 604
9.4.7 Changing additional UPS settings ........................................................................ 606
9.4.8 Procedure following power failure ......................................................................... 608
General information
Section 1
Chapter 1 • General information
Information:
B&R does its best to keep the printed versions of its user's manuals as current as
possible. However, any newer versions of the User's Manual can always be
downloaded in electronic form (pdf) from the B&R homepage www.br-
automation.com.
1. Manual history
General information
- Touch screen driver installation).
Section 1
- 1 GB flash drive (5MMUSB.1024-00) added (128 MB - 5MMUSB.0128-00 cancelled).
- Silicon Systems CompactFlash cards 5CFCRD.xxxx-03 updated (see the section "USB flash drive
5MMUSB.0xxx-00", on page 564).
- Serial number sticker information updated (see the section "Serial number sticker", on page 119).
- Additional technical data about the PCI bus added.
- A general device interface photo (version with 5 PCI slots) added (see the section "Device
interfaces", on page 90).
- Information about the minimum ambient temperature added (component-dependent).
- Block diagrams of entire device for all system units with 855GME CPU boards added.
- SDL cable with 45° plug 5CASDL.0018-01, 5CASDL.0050-01, 5CASDL.0100-01, 5CASDL.0150-
01 added (see the section "SDL cable with 45° plug 5CASDL.0xxx-01", on page 578.
- SDL cable with extender 5CASD.0300-10 and 5CASDL.0400-10 added (see the section "SDL
cable with extender 5CASDL.0x00-10", on page 581).
- System unit support for buffering (10 ms) with Automation Runtime added (see the section
"Automation PC 620 with Automation Runtime", on page 461).
- Explanation of terminology added in the form of a glossary (see the "Glossary" section, on
page 662).
- "855GME (ETX) BIOS description" section on page 325 adapted to BIOS version 1.21.
- "Firmware upgrade" section on page 453 adapted to the APC620 / Panel PC Firmware upgrade
(MTCX, SDLR, SDLT) version 1.13.
- Humidity table according to the individual components added (see the "Humidity specifications"
section, on page 89.)
- Information about starting current added.
- Section Automation PC 620 with Windows CE (9S0001.29-020) updated (see section "Automation
PC 620 with Windows CE", on page 483).
- New chapter "Standards and specifications", on page 497" updated.
- Known problems using MS-DOS added (see the "Known problems" section, on page 462).
- Automation Panel 900 connection examples expanded (see "Automation Panel 900 connection
examples" on page 194).
- Technical data table for all device versions (1, 2 and 5 PCI slots) added.
- Progress information about the BIOS boot procedure added.
- Topic "Power options and touch screen" added.
1.80 2006-04-21 - Corrections to chapter "Standards and Certifications".
- The footnote "Depending on the process or batch, there may be visual deviations in the color and
surface structure." was added for housing and color specifications.
- PCI RAID hard disk 5ACPCI.RAIS-01 (60 GB) added.
- Information regarding the new 512 MB and 1 GB SanDisk Cruzer Micro flash drives added.
- Temperature specifications for the PCI RAID hard disk 5ACPCI.RAIS-00 added.
- HMI Drivers & Utilities DVD 5SWHMI.0000-00 added.
1.90 2006-08-29 - Corrections to chapter "Standards and Certifications" - section "Emission requirements" -
standards were listed twice.
- The manual history has been corrected.
- Vibration values were switched for 'continuous' and 'occasional' operation.
- "Cable connections" section on page 223 (flex radius) updated.
- Name change for CompactFlash short text.
- Name change of chapter "Installation" to "Commissioning".
- Restructuring of section "Automation Panel 900 - connection examples" - it is now located in
chapter "Commissioning".
- BIOS postcode messages added.
- USB Media Drive 5MD900.USB2-00 added.
- New technical data added for slide-in drive 5AC600.DVRS-00 revision D0 and later.
- New image for PCI routing.
- List of delivery contents removed for some components (e.g. cable).
- Vibration and shock values changed for the PCI RAID controller hard discs.
General information
2.30 2007-09-10 - USB Memory Sticks 256 MB (5MMUSB.0256-00) and 1 GB (5MMUSB.1024-00) cancelled.
Section 1
- UPS module + accessories short descriptions changed (page 47).
Description of UPS configuration revised beginning on page 599.
- Section "SDL flex cable - test description", on page 629 expanded (cable drag chain and torsion
test).
- Section "USB flash drive", on page 682 updated.
- General information in section "Automation PC 620 with Automation Runtime", on page 564
updated.
- Section "Automation Panel 900 connection examples" changed to "Connection examples" and
expanded to include Automation Panel 800 connection examples
- Section "Grounding concept", on page 307 added
- Section "Configuration of a SATA RAID array", on page 351 added
- Section "B&R Automation Device Interface (ADI) driver - Control Center", on page 595 updated
(screenshots, UL compliant operation)
- Section "Uninterruptible power supply", on page 720 updated (description, technical data,
temperature lifespan diagram up to 20% battery capacity, deep discharge cycles added).
- New model numbers for Windows CE and Windows XPe expanded.
- Section "Automation PC 620 with Windows XP embedded", on page 584 updated.
. System unit 5PC600.SF03-00 expanded.
- Fan kit 5PC600.FA03-00 expanded.
- Replacement fan filters 5AC600.FA01-00, 5AC600.FA02-00, 5AC600.FA03-00, 5AC600.FA05-00
(see section "Replacement fan", on page 737) updated.
- Maintenance interval information for the UPS battery (5AC600.UPSB-00) updated.
- 855GME CPU board 5PC600.E855-05 (1 GHz Celeron) L2 cache entry changed from 1MB to 512
kB.
- Standard Full-size PCI card size expanded (see section "PCI slots", on page 147).
- The optional UPS module added to all block diagrams for the entire device (see Section "Block
diagram", on page 165).
- Drilling template for 5PC600.SF03-00 expanded (see section "Drilling templates", on page 294).
- 815E CPU boards BIOS description updated to version 1.23 (see "Software" chapter, section
"815E (ETX) BIOS description", on page 371).
- 855GME CPU boards BIOS description updated to version 1.26 (see "Software" chapter, section
"855GME (ETX) BIOS description", on page 425).
- Name change from 815E to 815E (ETX) and 855GME to 855GME (ETX).
- CPU boards 855GME (XTX) model numbers expanded (see Section "CPU boards 855GME
(XTX)", on page 39).
- Safety guidelines updated to include "Environmental conditions - dust, humidity, aggressive
gases", on page 34.
- 855GME (XTX) CPU boards (BIOS Version 1.14) BIOS description updated (see "Software"
chapter, section 1.3 "855GME (XTX) BIOS description", on page 481).
- Add-On UPS module pin assignments and UPS battery unit updated (see Section "Uninterruptible
power supply", on page 720).
- UPS battery unit deep discharge cycle diagram updated (see image 374 "Deep discharge cycles",
on page 727).
- SRAM module 5AC600.SRAM-00 added (see section "SRAM module - 5AC600.SRAM-00", on
page 738).
- Battery and real-time clock entries (RTC) revised.
- Power consumption values adjusted in the revision of the system units.
- Number added to information on interface numbering.
General information
2.50 2009-04-23 - Footnotes in section 4.3 "An Automation Panel 900 via SDL (onboard)" - "Cable lengths and
Section 1
resolutions for SDL transfer", on page 315 added.
- ADI driver description -> Windows 2000 removed and Automation Panel 800 added.
- Information regarding SATA HDD exchange added.
- Information "Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages" added.
- Temperature humidity diagram for 5AC600.CDXS-00 corrected.
- Section 6 "Typical topologies", on page 51 in chapter 1 "General information" added.
- 5ACPCI.RAIC-00 cancelled.
- Fan control information expanded in Appendix A, section 3.2 "Temperature monitoring - Fan
control", on page 796.
- External UPS added to accessories - see section 17 "External UPS", on page 731.
- B&R Key Editor information updated.
- ADI Development Kit information updated.
- Section 2.7 "Environmentally-friendly disposal" in chapter 1 "General information" added.
- Image of Silicon Systems CF card changed.
- Contents of delivery for USB flash drives removed.
- 0TB704.91 and 0TB704.9 added in Chapter 6 "Accessories".
- Information about the BIOS setting in the connection examples with an AP900 via SDL (onboard)
changed.
- Information about firmware upgrade updated.
- WinCE features updated.
- Temperature humidity diagram for USB flash drive corrected.
- B&R CompactFlash card added.
- Technical data for Silicon Systems CFs revised.
- PCI routing for APC620e added to Chapter 4 "Software".
- Maximum ambient temperature for APC620 embedded added.
- Section "Installation on PCI SATA RAID controller - 5ACPCI.RAIC-03, 5ACPCI.RAIC-05", on
page 569 added
General information
2.64 2011-07-28 - „Information:“ to installation in section "Automation PC 620 with Windows XP Professional", on
Section 1
page 568 added.
- Tableentra „typ. recharge time at low battery“ in table 453 "Technical data - 5AC600.UPSB-00", on
page 726 added.
- Referring to external UPS 24 VDC in Section "Uninterruptible power supply", on page 720 added.
- Sections "B&R Automation Device Interface (ADI) driver - Control Center", on page 595, "B&R
Automation Device Interface (ADI) development kit", on page 799 and "B&R Automation Device
Interface (ADI) .NET SDK", on page 801 added.
- "PCI SATA RAID 2 x 250 GB - 5ACPCI.RAIC-05", on page 267 and "Replacement SATA HDD 250
GB - 5MMHDD.0250-00", on page 271 added
- Section "Changing the CompactFlash", on page 746 added.
- 5ACPCI.RAIC-05 added in figure "Ambient temperatures for systems with an 855GME CPU board
(ETX / XTX)", on page 94, in figure 5 "Selection guide - APC620 optional components with 1, 2, 3,
and 5 PCI slots", on page 57 in table 29 "Overview of humidity specifications for individual
components", on page 119 and in headline "Installation on PCI SATA RAID controller -
5ACPCI.RAIC-03, 5ACPCI.RAIC-05", on page 569.
2.65 2012-12-06 - Ambient temperature for charging mode added to the technical data for the 5AC600.UPSB-00 bat-
tery unit, see "Battery unit 5AC600.UPSB-00", on page 726.
- The add-on SSD drive "Add-on Solid State Drive 128 GB 24x7 ET - 5AC600.SSDI-00", on
page 187 was added.
2.66 2013-04-25 - Replacement SSD drive "Replacement Solid State Drive 128 GB 24x7 ET - 5MMSSD.0128-00",
on page 191 was added.
- For "Add-on Solid State Drive 128 GB 24x7 ET - 5AC600.SSDI-00", on page 187, revision D was
added.
- The "CompactFlash cards 5CFCRD.xxxx-06", on page 645 were added.
- Section "General instructions for performing temperature tests", on page 362 was added.
2.68 2015-05-07 - The revision E0 was added at the "Add-on Solid State Drive 128 GB 24x7 ET - 5AC600.SSDI-00",
on page 187.
- The revision E0 was added at the "Replacement Solid State Drive 128 GB 24x7 ET -
5MMSSD.0128-00", on page 191.
- Section "Ground", on page 136 and "Grounding concept", on page 307 updated.
- Added information about the discontinuation of support for the OS "Automation PC 620 with
Windows XP Professional", on page 568.
2. Safety notices
Programmable logic controllers (PLCs), operating and monitoring devices (industrial PCs, Power
Panels, Mobile Panels, etc.), and B&R uninterruptible power supplies have been designed,
developed, and manufactured for conventional use in industry. They were not designed,
developed, and manufactured for any use involving serious risks or hazards that could lead to
death, injury, serious physical damage, or loss of any kind without the implementation of
exceptionally stringent safety precautions. In particular, such risks and hazards include the use
of these devices to monitor nuclear reactions in nuclear power plants, as well as flight control
systems, flight safety, the control of mass transit systems, medical life support systems and the
control of weapons systems.
Electrical components that are vulnerable to electrostatic discharge (ESD) must be handled
accordingly.
2.2.1 Packaging
• Any persons handling electrical components or devices that will be installed in the
electrical components must be grounded.
• Components can only be touched on the small sides or on the front plate.
• Components should always be stored in a suitable medium (ESD packaging, conductive
foam, etc.).
Metallic surfaces are not suitable storage surfaces!
General information
plastics).
Section 1
• A minimum distance of 10 cm must be kept from monitors and TV sets.
• Measurement devices and equipment must be grounded.
• Measurement probes on potential-free measurement devices must be discharged on
sufficiently grounded surfaces before taking measurements.
Individual components
• ESD protective measures for individual components are thoroughly integrated at B&R
(conductive floors, footwear, arm bands, etc.).
The increased ESD protective measures for individual components are not necessary for our
customers for handling B&R products.
Electronic devices are generally not failsafe. In the event of a failure on the programmable
control system operating or monitoring device, or uninterruptible power supply, the user is
responsible for ensuring that other devices that may be connected, e.g. motors, are in a secure
state.
Both when using programmable logic controllers and when using operating and monitoring
devices as control systems in conjunction with a soft PLC (e.g. B&R Automation Runtime or
comparable products) or a slot PLC (e.g. B&R LS251 or comparable products), the safety
precautions applying to industrial control systems (e.g. the provision of safety devices such as
emergency stop circuits, etc.) must be observed in accordance with applicable national and
international regulations. The same applies for all other devices connected to the system, such
as drives.
All tasks such as installation, commissioning, and maintenance are only permitted to be carried
out by qualified personnel. Qualified personnel are persons familiar with transport, ounting,
installation, commissioning, and operation of the product who also have the respective
qualifications (e.g. IEC 60364). National accident prevention guidelines must be followed.
The safety guidelines, connection descriptions (type plate and documentation), and limit values
listed in the technical data are to be read carefully before installation and commissioning and
must be observed.
During transport and storage, devices must be protected from excessive stress (mechanical
load, temperature, humidity, aggressive atmospheres, etc.).
2.5 Installation
• Installation must take place according to the documentation, using suitable equipment
and tools.
• Devices must be installed without voltage applied and by qualified personnel.
• General safety regulations and nationally applicable accident prevention guidelines must
be observed.
• Electrical installation must be carried out according to the relevant guidelines (e.g. line
cross section, fuse, protective ground connection).
2.6 Operation
Before turning on the programmable logic controller, the operating and monitoring devices and
the uninterruptible power supply, ensure that the housing is properly grounded (PE rail). The
ground connection must be established when testing the operating and monitoring devices or
the uninterruptible power supply, even when operating them for only a short time.
Before turning the device on, make sure that all parts with voltage applied are securely covered.
During operation, all covers must remain closed.
Use of operating and monitoring devices (e.g. industrial PCs, power panels, mobile panels, etc.)
and uninterruptible power supplies in very dusty environments should be avoided. Dust
collection on the devices influences their function and, especially in systems with active cooling
(fans), sufficient cooling cannot be guaranteed.
The presence of aggressive gases in the environment can also lead to malfunctions. When
combined with high temperature and humidity, aggressive gases - e.g. with sulfur, nitrogen and
chlorine components - start chemical processes that can damage electronic components very
quickly. Signs of the presence of aggressive gases are blackened copper surfaces and cable
ends on existing installations.
For operation in dusty or humid conditions, correctly installed (cutout installation) operating and
monitoring devices like Automation Panel or Power Panel are protected on the front side. The
rear side of all devices must be protected from dust and humidity and must be cleaned at suitable
intervals.
General information
Section 1
The system is subject to potential danger each time data is exchanged or software is installed
from a data medium (e.g. diskette, CD-ROM, USB flash drive, etc.), a network connection, or the
Internet. The user is responsible for assessing these dangers, implementing preventative
measures such as virus protection programs, firewalls, etc. and obtaining software from reliable
sources.
All B&R programmable controllers, operating and monitoring devices, and uninterruptible power
supplies are designed to inflict as little harm on the environment as possible.
. Component Disposal
Programmable logic controllers Electronics recycling
Operating and monitoring devices
Uninterruptible power supply
Cables
Cardboard box / paper packaging Paper / cardboard recycling
Plastic packaging Plastic recycling
4. Directives
E
European dimension standards apply to all dimensions (e.g. dimension
diagrams, etc.).
5. Model numbers
General information
Section 1
5.1 System units
General information
Section 1
Model number Short description Note
5PC600.X855-00 CPU board 855GME PM-1100
CPU board Intel Pentium M, 1100 MHz, 400 MHz FSB, 1 MB L2 cache; 855GME chipset; See page 183
1 socket for SO-DIMM DDR RAM module.
5PC600.X855-01 CPU board 855GME PM-1600
CPU board Intel Pentium M, 1600 MHz, 400 MHz FSB, 1 MB L2 cache; 855GME chipset; See page 183
1 socket for SO-DIMM DDR RAM module.
5PC600.X855-02 CPU board 855GME PM-1400
CPU board Intel Pentium M, 1400 MHz, 400 MHz FSB, 2 MB L2 cache; 855GME chipset; See page 183
1 socket for SO-DIMM DDR RAM module.
5PC600.X855-03 CPU board 855GME PM-1800
CPU board Intel Pentium M, 1800 MHz, 400 MHz FSB, 2 MB L2 cache; 855GME chipset; See page 183
1 socket for SO-DIMM DDR RAM module.
5PC600.X855-04 CPU board 855GME CM-600
CPU board Intel Celerom M, 600 MHz, 400 MHz FSB, 512 kB L2 cache; 855GME chipset; See page 183
1 socket for SO-DIMM DDR RAM module.
5PC600.X855-05 CPU board 855GME CM-1000
CPU board Intel Pentium M, 1000 MHz, 400 MHz FSB, 512 kB L2 cache; 855GME chipset; See page 183
1 socket for SO-DIMM DDR RAM module.
5.7 Drives
General information
5AC600.CDXS-00 Slide-in CD-ROM
Section 1
CD-ROM drive (slide-in); for operation in a slide-in drive slot in an APC620 or PPC700 See page 217
system.
5AC600.CFSI-00 Add-on CompactFlash slot
See page 216
CompactFlash slot (add-on); for installation in an APC620 or PPC700.
5AC600.CFSS-00 Slide-in CF 2-slot
See page 228
Slide-in CompactFlash adapter for 2 CompactFlash cards (via IDE and USB 2.0)
5AC600.DVDS-00 Slide-in DVD-ROM/CD-RW
DVD-ROM/CD-RW drive (slide-in); for operation in a slide-in drive slot in an APC620 or See page 220
PPC700 system.
5AC600.DVRS-00 Slide-in DVD-R/RW, DVD+R/RW
See page 223
DVD-RW drive (slide-in); for operation in a drive slot in an APC620 or PPC700 system.
5AC600.FDDS-00 Slide-in USB floppy disk drive
See page 230
FDD drive (slide-in); for operation in a slide-in drive slot in an APC620 or PPC700 system.
5AC600.HDDS-00 30 GB 24/7 slide-in hard disk Cancelled since 04/2007.
Replaced by:
30 GB hard disk (slide-in); ideal for 24 hour operation (24x7). For use in a slide-in drive slot 5AC600.HDDS-02.
in an APC620 or PPC700 system. See page 233
5AC600.HDDS-01 20 GB ET slide-in hard disk Cancelled since 04/2007.
Replaced by:
20 GB hard disk (slide-in); with expanded temperature range (ET). For use in a slide-in drive 5AC600.HDDS-02.
slot in an APC620 or PPC700 system. See page 236
5AC600.HDDS-02 40 GB 24x7 ET slide-in hard disk
40 GB hard disk (add-on); Suitable for 24 hour operation (24x7) as well as for operation in the
See page 239
extended temperature range (ET). For use in a slide-in drive slot in an APC620 or PPC700
system.
5ACPCI.RAIC-00 PCI RAID controller ATA/100 Cancelled since 07/2007.
Replaced by:
PCI Raid controller 5ACPCI.RAIC-03.
See page 243
5ACPCI.RAIC-01 PCI SATA RAID system 2 x 60 GB 24x7 Cancelled since 04/2008
Replacement type
PCI Raid controller + 2 x 60 GB SATA hard disk; ideal for 24 hour operation (24x7). Requires 5ACPCI.RAIC-03
a free PCI slot. See page 251
5ACPCI.RAIC-02 Replacement SATA-HDD 60 GB
See page 256
1 piece Hard disk 60 GB SATA, replacement part for 5ACPCI.RAIC-01
5ACPCI.RAIC-03 PCI SATA RAID system 2 x 160 GB 24x7, ET
PCI Raid controller + 2 x 160 GB SATA hard disk; Suitable for 24 hour operation (24x7) as See page 259
well as for operation in the extended temperature range (ET). Requires a free PCI slot.
5ACPCI.RAIC-04 Replacement SATA-HDD 160 GB
See page 264
1 piece Hard disk 160 GB SATA, replacement part for 5ACPCI.RAIC-03
5ACPCI.RAIC-05 PCI RAID system SATA 2x250GB (M5400.6)
See page 267
PCI RAID controller + 2 x 250 GB SATA hard disks; requires a free PCI slot.
5MMHDD.0250-00 Replacement SATA-HDD 250GB (M5400.6)
See page 271
Hard disk 250 GB SATA, replacement part for 5ACPCI.RAIC-03 and 5ACPCI.RAIC-05.
5ACPCI.RAIS-00 PCI RAID storage 2 x 40 GB Cancelled since 06/2006
Replacement type
PCI Raid hard disk 2 x 40 GB 5ACPCI.RAIC-03
See page 245
5ACPCI.RAIS-01 PCI RAID storage 2 x 60 GB Cancelled since 01/2007
Replacement type
PCI Raid hard disk 2 x 60 GB 5ACPCI.RAIC-03
See page 248
5.11 Accessories
General information
Section 1
Model number Short description Note
0TB704.9 Terminal block, 4-pin,
See page 640
Screw clamp, 1.5 mm²
0TB704.91 Terminal block, 4-pin,
See page 640
cage clamps, 2.5 mm²
5.11.3 Batteries
General information
Section 1
Model number Short description Note
5MMUSB.0128-00 USB flash drive 128 MB SanDisk Cancelled since 12/2005
Replaced by 5MMUSB.2048-
USB 2.0 flash drive 128 MB 00
See page 682
5MMUSB.0256-00 USB flash drive 256 MB SanDisk Cancelled since 03/2007
Replaced by 5MMUSB.2048-
USB 2.0 flash drive 256 MB 00
See page 682
5MMUSB.0512-00 USB flash drive 512 MB SanDisk Cancelled since 07/2007
Replaced by 5MMUSB.2048-
USB 2.0 flash drive 512 MB 00
See page 682
5MMUSB.1024-00 USB flash drive 1 GB SanDisk Cancelled since 03/2007
Replaced by 5MMUSB.2048-
USB 2.0 flash drive 1 GB 00
See page 682
5MMUSB.2048-00 USB flash drive 2 GB SanDisk
See page 682
USB 2.0 flash drive 2 GB
5MMUSB.2048-01 USB flash drive 2 GB B&R
See page 685
USB 2.0 flash drive 2 GB
5.11.6 Cables
General information
Section 1
Model number Short description Note
5AC600.UPSI-00 Add-on UPS module
UPS module for APC620, APC810, PPC800; for system units 5PC600.SX01-00 (starting with
Rev. H0), 5PC600.SX02-00 (starting with Rev. G0), 5PC600.SX02-01 (starting with Rev. H0),
5PC600.SX05-00 (starting with Rev. F0), 5PC600.SX05-01 (starting with Rev. F0), See page 724
5PC600.SF03-00 (starting with Rev. A0), 5PC810.SX*. 5PC820.1505-00, 5PC820.1906-00
Order cable (5CAUPS.0005-00 or 5CAUPS.0030-00) and battery unit (5AC600.UPSB-00)
separately.
5AC600.UPSB-00 Battery unit 5 Ah
See page 726
Battery unit 5Ah; for APC620, APC810 or PPC800 UPS.
5CAUPS.0005-00 APC620 UPS cable 0.5 m
See page 730
Connection cable between add-on UPS module and UPS battery unit, length 0.5 meters
5CAUPS.0030-00 APC620 UPS cable 3 m
See page 730
Connection cable between add-on UPS module and UPS battery unit, length 3 meters
5.11.9 Miscellaneous
5.12 Software
General information
9S0000.01-020 OEM MS-DOS 6.22 English (disk)
Section 1
OEM MS-DOS 6.22 English disks See page 566
Only delivered with a new PC.
9S0000.08-010 OEM Microsoft Windows XP Professional Cancelled since 10/2008
CD, German; Only delivered with a new PC. See page 568
1) Support for Automation PC 620 embedded system units starting with Revision D0.
6. Typical topologies
General information
Section 1
6.1 APC620 embedded for central control and visualization
The control program runs on the APC620 embedded. The visualization project is integrated with
Visual Components. A display unit is connected to the PC. The PC is networked via Ethernet
TCP/IP; additional Power Panel-based operator terminals can also be connected via Ethernet.
Communication to I/O systems with axes is handled via fieldbus systems (CAN bus,
POWERLINK).
Ethernet TCP/IP
APC620 Power Panel 300 Power Panel 300 Power Panel 300
SDL
Automation Panel
X2X
CAN
X20 System
POWERLINK
X20 System
The visualization runs on the APC620 as a SCADA application. Two display units are connected
to the PC either locally or remotely. The control tasks interact with one or more underlying PLC
stations where I/O systems and drives are connected locally or remotely over fieldbus systems.
Additional SCADA stations can be networked via Ethernet TCP/IP.
Ethernet TCP/IP
ACOPOS ACOPOS X67 X67 X67 ACOPOS ACOPOS X67 X67 X67
1. Introduction
Technical Data
Section 2
With its structure, its many slots and well thought-out placement of interfaces and drives, the
APC620 provides optimal adaptability and ergonomics. The APC620 saves space in the
switching cabinet. Drive inserts (HDD, CD-ROM, DVD, burner, etc.) and up to two CompactFlash
slots are hidden behind a cover on the front of the device.
The APC620 embedded additionally unites the fieldbus interfaces POWERLINK, CAN and X2X
in a compact housing.
The APC620 with an Intel® Pentium® M processor and Intel® 855GME chipset is available for
high-performance applications that require a powerful processor. These processors, developed
specially for mobile computing, offer many advantages for industrial applications as well. They
combine high computing capacity with low power consumption. The chipset contains an
integrated graphic solution which provides optimal use of memory for the system and graphics.
1.1 Features
• Processors up to Pentium M 1.8 GHz (APC620 embedded only possible up to 1.4 GHz)
• CompactFlash slot (type I)
• Half-size / full-size PCI slots (PCI standard 2.2, 32-bit, PCI bus speed 33 MHz)
• AC97 sound
• USB 2.0
• 24 VDC supply voltage
• 2x Ethernet 10/100 MBit interfaces
• 2x RS232 Interface, modem compatible
• PS/2 keyboard/mouse (combined)
• CAN add-on interface
• Fieldbus interfaces1) (POWERLINK, CAN and X2X)
• RS232/422/485 add-on interface
• Fan-free operation2)
• BIOS
• Real-time clock, (RTC) battery-buffered
• Up to 1 GB main memory
• Connection of various display devices to the "Monitor/Panel" video output (supports
RGB, DVI, and SDL - Smart Display Link - signals)
• Optional installation of add-on UPS APC620 module3)
• Optional SRAM module4) battery backed
The APC620 system can be assembled to meet individual requirements and operational
conditions.
• System unit
• CPU board
Technical Data
• Heat sink (CPU board dependent)
Section 2
• Main memory (CPU board dependent)
• Drive (mass memory such as CompactFlash card or hard disk) for the operating system
• Software
5AC600.HS01-01
5AC600.HS01-00 1)
2) 5AC600.HS01-02
5AC600.HS02-01 2)
2) 5AC600.HS02-01
5AC600.HS02-02 1)2)
5AC600.HS02-02
1) Is required when using 855GME CPU boards 5PC600.E855-01 / 5PC600.X855-01 and 5PC600.E855-03 / 5PC600.X855-03.
2) Is required when using system unit 5PC600.SF03-00.
Figure 4: Selection guide - APC620 basic system with 1, 2, 3, and 5 PCI slots
Explanation:
2) System selection - Choose a CPU board variant (815E - ETX or 855GME - ETX / XTX).
3) Select one each of main memory and heat sink, based on selected CPU board.
4) Select optional components, based on selected system unit (see section 1.2.2 "Selection
guide - Optional components", on page 57).
Configuration - optional
System unit Select 1
The system unit consists of
the housing and base board.
Variants:
PCI slots (1,2, 3 or 5)
Slide-in slots (0,1 or 2)
AP Link slots (0 or 1)
Example 2 / 1 / 1 5PC600.SX01-00 (1/0/0) 5PC600.SX02-01 (2/1/0) 5PC600.SF03-00 (3/1/1) 5PC600.SX05-01 (5/2/0)
Technical Data
= 2 PCI, 1 slide-in, 1 AP Link 5PC600.SX02-00 (2/1/1) 5PC600.SX05-00 (5/2/1)
Section 2
Fan kit (select 1)
5AC600.CANI-00 (CAN)
5AC600.485I-00 (combined RS232/RS422/RS485)
Figure 5: Selection guide - APC620 optional components with 1, 2, 3, and 5 PCI slots
Information:
• Depending on the system unit, a compatible fan kit can be installed in the APC620.
Required for certain system configurations and ambient temperatures (see also sections
2.6 "Ambient temperatures for systems with an 815E CPU board (ETX)", on page 89 and
2.7 "Ambient temperatures for systems with an 855GME CPU board (ETX / XTX)", on
page 93).
• Select optional drive(s) (add-on / slide-in), based on the system unit. One add-on drive
can be installed in each system unit. Slide-in drives (1 or 2) are only available in certain
system units.
• AP Link cards create a second graphics line (possibility of extended desktop or display
clone operation) on the APC620. Only possible with system units 5PC600.SX02-00,
5PC600.SX05-00, 5PC600.SF03-00 and with an 855GME CPU board.
• An add-on interface adds an optional connection possibility.
• Depending on the revision of the system unit (see graphic), an optional integrated UPS
add-on module can be installed.
• Depending on the revision of the system unit (see graphic), an optional integrated SRAM
module (battery backed) can be installed.
• The appropriate power supply plugs ensure simple connection to the power supply.
The following components are absolutely essential for operation: System unit, CPU board, main
memory and heat sink.
Technical Data
5PC600.SE00-00 - SDL - 512 kB SRAM
5PC600.SE00-01 - CRT 512 kb SRAM
Section 2
5PC600.SE00-02 - SDL 1 MB SRAM
5MMDDR.0256-00 - 256 MB
5MMDDR.0512-00 - 512 MB
5MMDDR.1024-00 - 1 GB
Heat sink
5AC600.HS03-01
Figure 6: Selection guide - Basic system and optional components APC620 embedded
Explanation:
2. Entire device
2.1.1 Interfaces
Monitor / Panel
SDL (Smart Display Link) / DVI
Supply voltage
+24 VDC
USB1, USB2
Ethernet2
LED for:
Power
HDD Ethernet1
Link1
COM2
Link2
COM1
Heat sink
060003861
Warning!
Do not remove the mounting screws from the heat sink, as it is connected to the
processor and chipset by a thermal coupling. Should this connection be broken, the
APC620 must be sent for repair. Removal of the mounting screws, which can be
determined by a broken seal, voids all warranty.
During operation, surface temperatures of the heat sink may reach 70°C (warning
"hot surface").
Technical Data
LED for: Power, HDD
Link1, Link2
Section 2
CompactFlash slot
PS/2 keyboard
or PS/2 mouse
Battery
Serial number
sticker
Hardware
security key
Information:
The orange front doors contain two permanent magnets. Contact between a data
carrier that saves data magnetically (hard disk, diskette, the magnetic strip of a
credit card, etc.) and a magnet can cause loss of data.
Technical Data
Housing4)
Section 2
Item Galvanized plate, plastic
Paint Light gray (similar to Pantone 427CV), dark gray (similar to Pantone 432CV)
Front cover Colored orange plastic (similar to Pantone 144CV)
Outer dimensions See "Dimensions", on page 65
Weight Approx. 3.4 kg (component-dependent)
Environmental characteristics
Ambient temperature
Operation Component-dependent, see the section about ambient temperature on page 89 and page 93
Bearings -20 to 60°C
Transport -20 to 60°C
Relative humidity
Operation Component-dependent, see section "Humidity specifications", on page 119
Bearings Component-dependent, see section "Humidity specifications", on page 119
Transport Component-dependent, see section "Humidity specifications", on page 119
Vibration5)
Operation (continuous) 2 - 9 Hz: 1.75 mm amplitude / 9 - 200 Hz: 0.5 g
Operation (occasional) 2 - 9 Hz: 3.5 mm amplitude / 9 - 200 Hz: 1 g
Bearings 2 - 8 Hz: 7.5 mm amplitude / 8 - 200 Hz: 2 g / 200 - 500 Hz: 4 g
Transport 2 - 8 Hz: 7.5 mm amplitude / 8 - 200 Hz: 2 g / 200 - 500 Hz: 4 g
Shock5)
Operation 15 g, 11 ms
Bearings 30 g, 15 ms
Transport 30 g, 15 ms
Protection type IP20
Altitude
Operation max. 3000 m6) (component-dependent)
Electromagnetic compatibility
Emissions
Network-related emissions EN 61000-6-4, EN 55022 A
Emissions EN 61000-6-4, EN 55011 class A, EN 55022 class A, EN 61131-2, 47 CFR Part 15
2.1.3 Dimensions
65
15 35 .4 2
ø5 12
24
9
42.7
ø11
Technical Data
Section 2
184.6
244
260
222
270
19
18
15
5
3 59.6 “A”
Information:
Measurement “A” depends on
the APC620 heat sink used.
APC620 heat sink Dimensions
model number in mm
5AC600.HS01-00 12.8
5AC600.HS01-01 12.8
241
244
251
5AC600.HS01-02 28
2.2.1 Interfaces
2)
Add-on UPS slot Add-on interface slot
1)
AP Link slot
PCI slot 2 half-size MIC, Line IN,
Line OUT
PCI slot 1 half-size
Monitor / Panel
SDL (Smart Display Link) / DVI
Supply voltage
+24 VDC
USB 1, USB 2
Ethernet 2
LED for:
Power
HDD Ethernet 1
Link1
Link2
COM 2
COM 1
Heat sink
060003861
Warning!
Do not remove mounting screws from the heat sink, as it is connected to the
processor and chipset by a thermal coupling. Should this connection be broken, the
APC620 must be sent for repair. Removal of the mounting screws, which can be
determined by a broken seal, voids all warranty.
During operation, surface temperatures of the heat sink may reach 70°C (warning
"hot surface").
Technical Data
Bottom slide-in slot 1
Section 2
eject drive 1)
CompactFlash slot
Permanent
magnet
Power button
Reset button
PS/2 keyboard
or PS/2 mouse
Battery
Serial number
sticker
Hardware
security key
Bottom slide-in slot 1
eject drive 1)
1) The side cover of the PC 620 must be opened before ejecting a drive.
Information:
The orange front doors contain two permanent magnets. Contact between a data
carrier that saves data magnetically (hard disk, diskette, the magnetic strip of a
credit card, etc.) and a magnet can cause loss of data.
Technical Data
Housing4)
Section 2
Item Galvanized plate, plastic
Paint Light gray (similar to Pantone 427CV), dark gray (similar to Pantone 432CV)
Front cover Colored orange plastic (similar to Pantone 144CV)
Outer dimensions See "Dimensions", on page 71
Weight Approx. 4.5 kg (component-dependent)
Environmental characteristics
Ambient temperature
Operation Component-dependent, see the section about ambient temperature on page 89 and page 93
Bearings -20 to 60°C
Transport -20 to 60°C
Relative humidity
Operation Component-dependent, see section "Humidity specifications", on page 119
Bearings Component-dependent, see section "Humidity specifications", on page 119
Transport Component-dependent, see section "Humidity specifications", on page 119
Vibration5)
Operation (continuous) 2 - 9 Hz: 1.75 mm amplitude / 9 - 200 Hz: 0.5 g
Operation (occasional) 2 - 9 Hz: 3.5 mm amplitude / 9 - 200 Hz: 1 g
Bearings 2 - 8 Hz: 7.5 mm amplitude / 8 - 200 Hz: 2 g / 200 - 500 Hz: 4 g
Transport 2 - 8 Hz: 7.5 mm amplitude / 8 - 200 Hz: 2 g / 200 - 500 Hz: 4 g
Shock5)
Operation 15 g, 11 ms
Bearings 30 g, 15 ms
Transport 30 g, 15 ms
Protection type IP20
Altitude
Operation max. 3000 m6) (component-dependent)
Electromagnetic compatibility
Emissions
Network-related emissions EN 61000-6-4, EN 55022 A
Emissions EN 61000-6-4, EN 55011 class A, EN 55022 class A, EN 61131-2, 47 CFR Part 15
2.2.3 Dimensions
104.5
17.3 70 .4
ø5 2 14
24
42.7
9
ø11
Technical Data
Section 2
184.6
244
260
270
222
19
18
15
5
3 99.1 “A ”
Information:
Measurement “A” depends on
APC620 heat sink used.
APC620 heat sink Dimension
model number in mm
5AC600.HS01-00 12.8
5AC600.HS01-01 12.8
241
244
253
5AC600.HS01-02 28
2.3.1 Interfaces
USB 1, USB 2
LED for:
Power Ethernet 2
HDD
Link1 Ethernet 1
Link2
COM 2
COM 1
Heat sink
060003861
Warning!
Do not remove mounting screws from the heat sink, as it is connected to the
processor and chipset by a thermal coupling. Should this connection be broken, the
APC620 must be sent for repair. Removal of the mounting screws, which can be
determined by a broken seal, voids all warranty.
During operation, surface temperatures of the heat sink may reach 70°C (warning
"hot surface").
Technical Data
Slide-in slot 1 drive slot
Section 2
Add-on drive slot
CompactFlash slot
Reset button
PS/2 keyboard
or PS/2 mouse
Battery Permanent
magnet
Hardware
security key
Bottom slide-in slot 11)
eject drive
Serial number
sticker
1) The side cover of the PC 620 must be opened before ejecting a drive.
Information:
The orange front doors contain three permanent magnets. Contact between a data
carrier that saves data magnetically (hard disk, diskette, the magnetic strip of a
credit card, etc.) and a magnet can cause loss of data.
Technical Data
Section 2
Outer dimensions See "Dimensions", on page 76
Weight Approx. 4.5 kg (component-dependent)
Environmental characteristics
Ambient temperature
Operation Component-dependent, see the section about ambient temperature on page 93
Bearings -20 to +60°C
Transport -20 to +60°C
Relative humidity
Operation Component-dependent, see section "Humidity specifications", on page 119
Bearings Component-dependent, see section "Humidity specifications", on page 119
Transport Component-dependent, see section "Humidity specifications", on page 119
Vibration5)
Operation (continuous) 2 - 9 Hz: 1.75 mm amplitude / 9 - 200 Hz: 0.5 g
Operation (occasional) 2 - 9 Hz: 3.5 mm amplitude / 9 - 200 Hz: 1 g
Bearings 2 - 8 Hz: 7.5 mm amplitude / 8 - 200 Hz: 2 g / 200 - 500 Hz: 4 g
Transport 2 - 8 Hz: 7.5 mm amplitude / 8 - 200 Hz: 2 g / 200 - 500 Hz: 4 g
Shock5)
Operation 15 g, 11 ms
Bearings 30 g, 15 ms
Transport 30 g, 15 ms
Protection type IP20
Altitude
Operation max. 3000 m6) (component-dependent)
Electromagnetic compatibility
Emissions
Network-related emissions EN 61000-6-4, EN 55022 A
Emissions EN 61000-6-4, EN 55011 class A, EN 55022 class A, EN 61131-2, 47 CFR Part 15
Immunity
Electrostatic discharge (ESD) EN 61000-6-2, EN 61131-2, EN 55024
High-frequency electromagnetic fields EN 61000-6-2, EN 61131-2, EN 55024
High-speed transient disturbances
(Burst) EN 61000-6-2, EN 61131-2, EN 55024
Surges EN 61000-6-2, EN 61131-2, EN 55024
Conducted values EN 61000-6-2, EN 61131-2, EN 55024
Magnetic fields with electrical EN 61000-6-2, EN 61131-2, EN 55024
frequencies
Voltage dips, interruptions EN 61000-6-2, EN 61131-2, EN 55024
Damped vibration
EN 61000-6-2, EN 61131-2, EN 55024
2.3.3 Dimensions
125
24
42.8
ø11
9
384
324.5
410
362
400
19
18
15
3 119.5
"A"
Information:
Measurement “A” depends on the
APC620 heat sink used.
APC620 heat sink Measurement
model number in mm
5AC600.HS02-00 12.8
5AC600.HS02-01 28
241
244
253
2.4.1 Interfaces
1) 2)
AP Link slot Add-on USV slot
PCI slot 1 Add-on interface slot
PCI slot 2
PCI slot 3
PCI slot 4 MIC, Line IN,
Line OUT
Technical Data
PCI slot 5
Section 2
Monitor / Panel
SDL (Smart Display Link) / DVI
Supply voltage
+24 VDC
USB 1, USB 2
Ethernet 2
LED for:
Power
HDD Ethernet 1
Link1
Link2
COM 2
COM 1
Heat sink
060003861
Warning!
Do not remove the mounting screws from the heat sink, as it is connected to the
processor and chipset by a thermal coupling. Should this connection be broken, the
APC620 must be sent for repair. Removal of the mounting screws, which can be
determined by a broken seal, voids all warranty.
During operation, surface temperatures of the heat sink may reach 70°C (warning
"hot surface").
Power, HDD
LED for:
Link1, Link2
Top slide-in slot 2
eject drive 1)
Top slide-in slot 1
eject drive 1)
CompactFlash slot
Add-on drive slot
Slide-in slot 1
drive slot
Slide-in slot 2 Permanent
drive slot magnet
Power button
Reset button
PS/2 keyboard
or PS/2 mouse
Battery
Serial number
sticker
Hardware
security key
Information:
The orange front doors contain two permanent magnets. Contact between a data
carrier that saves data magnetically (hard disk, diskette, the magnetic strip of a
credit card, etc.) and a magnet can cause loss of data.
Technical Data
Graphics
Section 2
Controller Component-dependent, see technical data for the CPU board
Power failure logic
Controller MTCX1) (see also page 793)
Buffer time 10 ms, dependent on the system unit revision (see page 564)
Real-time clock
Battery-buffered Yes
Accuracy Component-dependent, see technical data for the CPU board
Battery See also page 158
Type Renata 950 mAh
Removable Yes, accessible behind the orange cover
Lifespan 4 years2) 3)
Ethernet
Controller See also page 130 or page 132
Amount 2
CAN bus Optional using add-on interface (5AC600.CANI-00)
CompactFlash See also page 152 or page 153
Type Type I
Amount 2 (max. 4 using optional components)
Serial interface See also page 123 or page 124
Amount 2
Type RS232, modem-capable, not electrically isolated
UART 16550 compatible, 16 byte FIFO
Transfer rate Max. 115 kBaud
Connection 9-pin DSUB
USB interface See also section "USB port", on page 133
Type USB 2.0
Amount 2
Transfer rate Low speed (1.5 MBit/s), full speed (12 MBit/s), to high speed (480 Mbit/s)
Connection Type A
Current load Max. 500 mA per connection
Reset button Yes, accessible behind the orange cover
LEDs 4 directed outwards via fiber optic lines, also see section "Status LEDs", on page 150
PCI slots See also section "PCI slots", on page 147
half-size 5
full-size -
Add-on UPS internal slot Yes
5PC600.SX05-00 starting with revision F0, 5PC600.SX05-01 starting with revision F0 present
See also section "Add-on UPS module slot", on page 146
Technical Data
EN 61000-6-2, EN 61131-2, EN 55024
Section 2
Table 27: Technical data - APC620, 5 PCI slot variant (Forts.)
2.4.3 Dimensions
185.4
22.7 70 70
2 14
24
9
.4
ø5
1
ø1
244
260
270
222
19
18
15
5
3 180 “A ”
Information:
Measurement “A” depends on
APC620 heat sink used.
APC620 heat sink Dimension
model number in mm
5AC600.HS01-00 12.8
241.1
5AC600.HS01-01 12.8
253
5AC600.HS01-02 28
up to 6 mm ± 0.1 mm
over 6 to 30 mm ± 0.2 mm
over 30 to 120 mm ± 0.3 mm
over 120 to 400 mm ± 0.5 mm
185.3 over 400 to 1000 mm ± 0.8 mm
2.5.1 Interfaces
POWERLINK
Ethernet 10/100 MBit
COM1
Technical Data
CAN
Status LEDs CAN / X2X
Section 2
+24 VDC supply voltage
Monitor/Panel
SDL (Smart Display Link) / DVI
4 x USB
LED for:
Power COM2
CF
X2X
Link
Heat sink
060003861
Warning!
Do not remove the mounting screws from the heat sink, as it is connected to the
processor and chipset by a thermal coupling. Should this connection be broken, the
APC620 embedded must be sent for repair. Removal of the mounting screws, which
can be determined by a broken seal, voids all warranty.
During operation, surface temperatures of the heat sink may reach 70°C (warning
"hot surface").
Power button
Battery
POWERLINK
station number (x16, x1)
Information:
The orange front doors contain two permanent magnets. Contact between a data
carrier that saves data magnetically (hard disk, diskette, the magnetic strip of a
credit card, etc.) and a magnet can cause loss of data.
Technical Data
Graphics
Section 2
Controller Component-dependent, see technical data for the CPU board on page 183
Power failure logic
Controller MTCX1) (see also page 793)
Buffer time 10 ms, dependent on the system unit revision (see page 564)
Real-time clock
Battery-buffered Yes
Accuracy Component-dependent, see technical data for the 855GME (XTX) CPU board
Battery See also page 158
Type Renata 950 mAh
Removable Yes, accessible behind the orange cover
Lifespan 2½ years2)
Ethernet Yes
Controller See also page 129
Amount 1
POWERLINK Yes, also see page 127
Amount 1
Station Number Dial 2 pcs.
X2X Link Yes, also see page 125
Amount 1
Status LED Yes, see page 127
CAN bus See also page 125
Amount 1
Transfer rate Max. 500 kBit/s
Node switch Yes
Terminating resistor Yes, can be activated using a switch
Status LED Yes, see page 127
CompactFlash See also page 155
Type Type I
Amount 2
Serial interface See also page 123 or page 124
Amount 2
Type RS232, modem-capable, not electrically isolated
UART 16550-compatible, 16-byte FIFO
Transfer rate Max. 115 kBaud
Connection 9-pin DSUB
USB interface See also page 134
Type USB 2.0
Amount 4
Transfer rate Low speed (1.5 MBit/s), full speed (12 MBit/s), to high speed (480 Mbit/s)
Connection Type A
Current load Max. 500 mA or 1 A per connection
Technical Data
EN 61000-6-2, EN 61131-2, EN 55024
Section 2
Table 28: Technical data - APC620 embedded variant (Forts.)
2.5.3 Dimensions
58
24
9
42.5
ø11
125.1
200
183.8
210
19
18
5
68.3 15
3 52.5 12.8
225.6
220
217
2.6 Ambient temperatures for systems with an 815E CPU board (ETX)
It is possible to combine CPU boards with various other components, such as drives, main
memory, additional insert cards, etc. dependent on system unit and fan kit. The various
configurations result in varying maximum possible ambient temperatures, which can be seen in
the following graphic (see figure 23 "Ambient temperatures for systems with an 815E CPU board
(ETX)", on page 90).
Information:
Technical Data
Section 2
The maximum specified ambient temperatures were determined under worst-case
conditions.
Experience has shown that higher ambient temperatures can be reached under typical
conditions, e.g. using Microsoft Windows. The testing and evaluation is to be done on-site by the
user (temperatures can be read in BIOS or using the B&R Control Center, see the chapter 4
"Software", on page 371).
CPU module
heat build-up
PCI cards
heat build-up
main heat dissipation
via heat sink
815E CPU board without fan kit 815E CPU board with fan kit
1 and heat sink (5AC600.HS01-00) 1 and heat sink (5AC600.HS01-00)
C3 400 C3 733 C3 1000 C3 400 C3 733 C3 1000
All temperature values in degrees
5PC600.E815-00
5PC600.E815-02
5PC600.E815-03
5PC600.E815-02
5PC600.E815-00
5PC600.E815-03
celsius (°C) at 500 meters above sea level.
Temperature monitored
2 Max. environmental temperature 50 45 30 55 55 55
in these locations
by sensor(s)
What can still be operated at max. env. temp.,
and what limits are there?
3
On-board CompactFlash 1) 80
Add-on drive
1)
5AC600.CFSI-00 80
I/O
5AC600.HDDI-01 80
5AC600.HDDI-00 (24-hour / standard) -/30 -/25 -/25 35/45 35/45 35/45 45/55
5AC600.CFSS-00 1) 80
5AC600.CDXS-00 45 50 50 50 55
5AC600.DVDS-00 35 35 40 40 40 45
5AC600.DVRS-00 35 35 40 40 40 45
5AC600.FDDS-00 35 35 40 40 40 50
5AC600.HDDS-01 80
5AC600.HDDS-00 (24-hour / standard) 30/35 30/35 30/35 40/50 40/50 40/50 45/55
5MMSDR.0128-01 -
Main memory
5MMSDR.0256-01 -
5MMSDR.0512-01 -
5PC600.SX01-00 95
Power supply
System units
5PC600.SX02-01 95
5PC600.SX02-00 95
5PC600.SX05-01 95
5PC600.SX05-00 95
5AC600.CANI-00 -
Additional IF
5AC600.485I-00 -
slots
Figure 23: Ambient temperatures for systems with an 815E CPU board (ETX)
For systems containing one of the following components, the minimum ambient temperature is
+5°C: 5AC600.HDDI-00, 5AC600.CDXS-00, 5AC600.DVDS-00, 5AC600.DVRS-00,
5AC600.FDDS-00, 5AC600.HDDS-00, 5ACPCI.RAIS-00, 5ACPCI.RAIS-01.
If none of these components are used, then the minimum ambient temperature is 0°C.
Technical Data
Section 2
2) The "maximum ambient temperature" line shows the maximum ambient temperature for the
entire system when using this CPU board.
Information:
Maximum temperature data is for operation at 500 meters. Derating the maximum
ambient temperature - typically 1°C per 1000 meters (from 500 meters above sea
level).
3) Incorporating additional drives (add-on, slide-in), main memory, additional insert cards, etc.
can change the temperature limits of an APC620 system.
If there is a ✓ (checkmark) next to the component, it can be used at the maximum ambient
temperature of the whole system without problems.
If there is a specific temperature, for example "35", next to the component, then the ambient
temperature of the whole APC620 system cannot exceed this temperature.
For these hard disks, the limits will depend on whether the system is intended for 24-hour1) or
standard1) operation.
Example 1: A temperature limit of "30/35" means
30°C for 24-hour operation and 35°C for standard operation.
Information:
It is generally recommended to use a fan kit when using hard disks 5AC600.HDDI-
00, 5AC600.HDDS-00 and the RAID hard disks.
1) 24-hour operation = 732 POH (Power On Hours) per month, standard operation = 250 POH or 333 POH (Power On Hours) per month.
The APC620 has temperature sensors in various places (I/O, power supply, slide-in drive 1,
slide-in drive 2). The locations of the temperature sensors can be found in the figure
"Temperature sensor locations", on page 791. The value listed in the table represents the
defined maximum temperature for this measurement point1) . An alarm is not triggered when this
temperature is exceeded. The temperatures1) can be read in BIOS (menu item "Advanced" -
Main board/panel features - Main board monitor) or in Microsoft Windows XP/embedded, using
the B&R Control Center.
Additionally, the hard disks for APC620 systems available from B&R are equipped with
S.M.A.R.T, or Self Monitoring, Analysis, and Reporting Technology. This makes it possible to
read various parameters, for example the temperature, using software (e.g. HDD thermometer -
freeware) in Microsoft Windows XP/embedded.
1) The measured temperature is a guideline for the immediate ambient temperature, but can be influenced by neighboring components.
2.7 Ambient temperatures for systems with an 855GME CPU board (ETX / XTX)
It is possible to combine CPU boards with various other components, such as drives, main
memory, additional insert cards, etc. dependent on system unit and fan kit. The various
configurations result in varying maximum possible ambient temperatures, which can be seen in
the following graphic (see figure 25 "Ambient temperatures for systems with an 855GME CPU
board (ETX / XTX)", on page 94).
Information:
Technical Data
Section 2
The maximum specified ambient temperatures were determined under worst-case
conditions.
Experience has shown that higher ambient temperatures can be reached under typical
conditions, e.g. using Microsoft Windows. The testing and evaluation is to be done on-site by the
user (temperatures can be read in BIOS or using the B&R Control Center, see the chapter 4
"Software", on page 371).
Worst-case conditions for systems with an 855GME CPU board (ETX / XTX)
• Thermal Analysis Tool V1.4 from Intel for simulating 100% processor load.
• BurnIn testing tool (BurnIn V4.0 Pro from Passmark Software) to simulate a 100% load
on the interface via loop-back adapters (serial interfaces, add-on and slide-in drives, USB
interfaces, audio outputs)
• Maximum system extension and power consumption.
CPU module
heat build-up
PCI cards
heat build-up
main heat dissipation
via heat sink
855GME CPU board (ETX / XTX) without fan kit 855GME CPU board (ETX / XTX) with fan kit
and heat sink and heat sink and heat sink and heat sink
1 5AC600.HS01-01 5AC600.HS01-02
1 5AC600.HS01-01 5AC600.HS01-02
CM 600 CM 1000 PM 1100 PM 1400 PM 1600 PM 1800 CM 600 CM 1000 PM 1100 PM 1400 PM 1600 PM 1800
All temperatures in °C
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-01
5PC600.X855-01
5PC600.E855-03
5PC600.X855-03
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-01
5PC600.X855-01
5PC600.E855-03
5PC600.X855-03
at 500 m above sea level
Temp. Monitored
by sensors
What can still be operated at max. ambient temp.?
located in
What are the limitations?
3
1)
Onboard CompactFlash 80
1) 80
5AC600.CFSI-00
5AC600.HDDI-01 80
Add-on drive
5AC600.HDDI-00 (24-hour/Standard) -/30 -/25 -/25 -/25 30/40 30/40 30/40 30/40 -/35 -/35 45/55
I/O
5AC600.HDDI-05 80
5AC600.HDDI-06 80
5AC600.SSDI-00 ≤ D0 75
5AC600.SSDI-00 ≥ E0 80
1)
5AC600.CFSS-00 55
5AC600.CDXS-00 45 40 40 40 50 50 50 50 40 40 45
5AC600.DVRS-00 30 30 30 30 40 40 40 40 30 30 50
5AC600.FDDS-00 40 35 35 35 45 45 45 45 35 35 80
5AC600.HDDS-01 45/55
5AC600.HDDS-00 (24-hour/Standard) 35/45 30/40 30/40 30/40 40/50 40/50 40/50 40/50 30/40 30/40 80
5AC600.HDDS-02 -
-
Main memory
5MMDDR.0256-00
5MMDDR.0512-00 -
5MMDDR.1024-00 95
5PC600.SX01-00 95
Power supply
System units
5PC600.SX02-00 / -01 95
5PC600.SF03-00 95
5PC600.SX05-00 / -01 -
5AC600.CANI-00 -
5AC600.485I-00 -
Additional insert cards
-
Interfaces / AP Link
5AC600.SDL0-00
5ACPCI.RAIS-00 (24-hour/Standard) 35/45 30/40 30/40 30/40 40/50 40/50 40/50 40/50 30/40 30/40 -
5ACPCI.RAIS-01 (24-hour/Standard) 35/45 30/40 30/40 30/40 40/50 40/50 40/50 40/50 30/40 30/40 -
5ACPCI.RAIC-01 (24-hour/Standard) 35/45 30/40 30/40 30/40 40/50 40/50 40/50 40/50 30/40 30/40 -
5ACPCI.RAIC-03 (24-hour/Standard) -
5ACPCI.RAIC-05 (24-hour/Standard) 45 50 50 50 50
1) Only possible with a CompactFlash card 5CFCRD.xxxx-06, 5CFCRD.xxxx-04 or 5CFCRD.xxxx-03 from B&R
Figure 25: Ambient temperatures for systems with an 855GME CPU board (ETX / XTX)
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
at 500 m above sea level
Technical Data
2 Maximum ambient temperature 50 45 45 45
Temp. Monitored
Section 2
by sensors
What can still be operated at max. ambient temp.?
located in
What are the limitations?
3
Power Supply
5PC600.SE00-02 < Rev D0 45 40 40 40 95
5PC600.SE00-00 ³ Rev C0 95
5PC600.SE00-01 ³ Rev D0 95
5PC600.SE00-02 ³ Rev D0 95
Figure 26: Ambient temperatures for embedded systems with an 855GME CPU board (ETX / XTX)
For systems containing one of the following components, the minimum ambient temperature is
+5°C: 5AC600.HDDI-00, 5AC600.CDXS-00, 5AC600.DVDS-00, 5AC600.DVRS-00,
5AC600.FDDS-00, 5AC600.HDDS-00, 5ACPCI.RAIS-00, 5ACPCI.RAIS-01, 5ACPCI.RAIC-01.
If none of these components are used, then the minimum ambient temperature is 0°C.
2) The "maximum ambient temperature" line shows the maximum ambient temperature for the
entire system when using this CPU board.
Information:
Maximum temperature data is for operation at 500 meters. Derating the maximum
ambient temperature - typically 1°C per 1000 meters (from 500 meters above sea
level).
3) Incorporating additional drives (add-on, slide-in), main memory, additional insert cards, etc.
can change the temperature limits of an APC620 system.
If there is a ✓ (checkmark) next to the component, it can be used at the maximum ambient
temperature of the whole system without problems.
If there is a specific temperature, for example "35", next to the component, then the ambient
temperature of the whole APC620 system cannot exceed this temperature.
For these hard disks, the limits will depend on whether the system is intended for 24-hour1) or
standard1) operation.
Example 1: A temperature limit of "30/35" means
30°C for 24-hour operation and 35°C for standard operation.
Information:
It is generally recommended to use a fan kit when using hard disks 5AC600.HDDI-
00, 5AC600.HDDS-00 and the RAID hard disks 5ACPCI.RAIS-00, 5ACPCI.RAIS-01,
5ACPCI.RAIC-01 and 5ACPCI.RAIC-03.
The APC620 has temperature sensors in various places (I/O, power supply, slide-in drive 1,
slide-in drive 2). The locations of the temperature sensors can be found in the figure
"Temperature sensor locations", on page 791. The value listed in the table represents the
defined maximum temperature for this measurement point2) . An alarm is not triggered when this
temperature is exceeded. The temperatures2) can be read in BIOS (menu item "Advanced" -
Baseboard/panel features - Baseboard monitor) or in Microsoft Windows XP/Embedded, using
the B&R Control Center.
Additionally, the hard disks for APC620 systems available from B&R are equipped with
S.M.A.R.T, or Self Monitoring, Analysis, and Reporting Technology. This makes it possible to
read various parameters, for example the temperature, using software (e.g. HDD thermometer -
freeware) in Microsoft Windows XP/Embedded.
1) 24-hour operation = 732 POH (Power On Hours) per month, standard operation = 250 POH or 333 POH (Power On Hours) per month.
2) The measured temperature is a guideline for the immediate ambient temperature, but can be influenced by neighboring components.
The following block diagram presents the simplified structure of the APC620 supply voltage for
5PC600.SX01-00 system units starting with revision I0.
Technical Data
Section 2
Supply voltage 15V
24V 15V
+24 VDC
electrically
isolated
3V3 Standby
Buffering capacitors
15V 3V3
(for min. 10 ms)
3V3
5V Standby
5V
5V
Power On
5V -12V
-12V
+12V
5V
+12V +12V
PCI bus
Explanation:
The supply voltage is converted to 15 V with a DC/DC converter. These electrically isolated 15
V feed four further DC/DC converters, which generate the remaining voltages.
After the system is turned on (e.g. using the power button), the voltages 3V3 and 5 V are placed
on the bus. Two additional DC/DC converters at the 5 V output generate
-12 V and -12 V, which is then applied to the bus.
The optional APC620 add-on UPS and battery unit is supplied with 15 V and provides an
uninterrupted power supply from the 15 V bus during power failures.
5PC600.E815-00
5PC600.E815-02
5PC600.E815-03
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-01
5PC600.X855-01
5PC600.E855-03
5PC600.X855-03
All entries in watts Enter values in this
columns
The entries for the Generator are maximum values.
Entries for the Device are determined maximum
values, but not peak values.
Interface option (add-on interface), optional 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25
PCI card manufacturer limit, optional 1)
(max. 3 watts without fan kit, max. 17 watts with fan kit)
Devices 3V3 å
Devices total å
1) The total performance of one PCI card per PCI slot (= sum of power consumptions for each voltage area) may not exceed the limits stated for operation with or without
a fan kit.
See section "Starting current", on page 136 for starting current values.
The following block diagram presents the simplified structure of the APC620 supply voltage for
5PC600.SX01-00 system units starting with revision < I0.
Technical Data
+24 VDC
Section 2
electrically
isolated
15V +12V
Buffering capacitors
(for min. 10 ms) +12V
3V3 standby
15V 3V3
3V3
5V Standby
5V
5V
Power on
5V -12V
-12V
Explanation:
The supply voltage is converted to 15 V with a DC/DC converter. These electrically isolated 15
volts feed two further DC/DC converters. One generates +12 V, and the other 3V3 and 5V
standby.
After the system is turned on (e.g. using the power button), the voltages 3V3, 5 V, +12 V are
placed on the bus. At the 5 V output, yet another DC/DC converter generates -12 V, and places
these on the bus.
The optional APC620 add-on UPS and battery unit is supplied with 15 V and provides an
uninterrupted power supply from the 15 V bus during power failures.
5PC600.E815-00
5PC600.E815-02
5PC600.E815-03
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-01
5PC600.X855-01
5PC600.E855-03
5PC600.X855-03
All entries in watts Enter values in this
columns
The entries for the Generator are maximum values.
Entries for the Device are determined maximum
values, but not peak values.
Devices -12V å
Devices total 5V å
max. possible at3V3 23
System unit, fixed device 4 4 4 4 4 4 4 4 4
3V3
Interface option (add-on interface), optional 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25
PCI card manufacturer limit, optional 1)
(max. 3 watts without fan kit, max. 17 watts with fan kit)
Devices 3V3 å
max. possible at +12V 12
Fan kit, optional 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5
+12V
Devices +12V å
Devices total å
1) The total performance of one PCI card per PCI slot (= sum of power consumptions for each voltage area) may not exceed the limits stated for operation with or without
a fan kit.
See section "Starting current", on page 136 for starting current values.
2.9.1 Supply voltage for the 5PC600.SX02-00 revision >= H0 and 5PC600.SX02-01 revision
>= K0)
The following block diagram presents the simplified structure of the APC620 supply voltage for
system units 5PC600.SX02-00 (revision H0 and higher), 5PC600.SX02-01 (revision K0 and
higher).
Technical Data
Section 2
Add-on UPS UPS battery
module (optional)
3V3 Standby
Buffering capacitors
15V 3V3
(for min. 10 ms)
3V3
5V Standby
5V
5V
Power On
5V -12V
-12V
+12V
5V
+12V +12V
PCI bus
Figure 29: Supply voltage for the 2 PCI slots (dependent on system unit version)
Explanation:
The supply voltage is converted to 15 V with a DC/DC converter. These electrically isolated 15
V feed four further DC/DC converters, which generate the remaining voltages.
After the system is turned on (e.g. using the power button), the voltages 3V3 and 5 V are placed
on the bus. Two additional DC/DC converters at the 5 V output generate
-12 V and -12 V, which is then applied to the bus.
The optional APC620 add-on UPS and battery unit is supplied with 15 V and provides an
uninterrupted power supply from the 15 V bus during power failures.
5PC600.E815-00
5PC600.E815-02
5PC600.E815-03
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-01
5PC600.X855-01
5PC600.E855-03
5PC600.X855-03
All entries in watts Enter values in this
columns
The entries for the Generator are maximum values.
Entries for the Device are determined maximum
values, but not peak values.
Devices 5V å
max. possible at +12V 12
Fan kit, optional 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5
+12V
Interface option (add-on interface), optional 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25
PCI card manufacturer limit, optional 1)
(max. 3 watts without fan kit, max. 17 watts with fan kit)
Devices 3V3 å
Devices total å
1) The total performance of one PCI card per PCI slot (= sum of power consumptions for each voltage area) may not exceed the limits stated for operation with or without
a fan kit.
See section "Starting current", on page 136 for starting current values.
5PC600.E815-00
5PC600.E815-02
5PC600.E815-03
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-01
5PC600.X855-01
5PC600.E855-03
5PC600.X855-03
All entries in watts Enter values in this
columns
The entries for the Generator are maximum values.
Entries for the Device are determined maximum
values, but not peak values.
Technical Data
Add-on UPS module, optional 7.5 7.5 7.5 7.5 7.5 7.5 7.5 7.5 7.5
Section 2
max. possible at 5V 70
CPU Board, fixed device 14 18 25 17 21 23 23 37 37
per CompactFlash, optional (add-on, slide-in) 1 1 1 1 1 1 1 1 1
Hard Disk, optional (add-on, slide-in) 4 4 4 4 4 4 4 4 4
per Drive, optional (slide-in CD,DVD CD-RW) 4 4 4 4 4 4 4 4 4
External keyboard PS/2, optional 1 1 1 1 1 1 1 1 1
USB Peripheral, optional 5 5 5 5 5 5 5 5 5
(max. 2,5 watts per USB1 and USB2 connection)
Interface option (add-on interface), optional 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5
5V
Devices 5V å
max. possible at -12V 1.2
-12V
Devices -12V å
Devices total 5V å
max. possible at 3V3 23
System unit, fixed device 4 4 4 4 4 4 4 4 4
3V3
Interface option (add-on interface), optional 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25
PCI card manufacturer limit, optional 1)
(max. 3 watts without fan kit, max. 17 watts with fan kit)
Devices 3V3 å
max. possible at +12V 12
Fan kit, optional 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5
+12V
Devices +12V å
Devices total å
1) The total performance of one PCI card per PCI slot (= sum of power consumptions for each voltage area) may not exceed the limits stated for operation with or without
a fan kit.
See section "Starting current", on page 136 for starting current values.
2.9.4 Supply voltage for the 5PC600.SX02-00 revision < H0 and 5PC600.SX02-01 revision
< K0)
The following block diagram presents the simplified structure of the APC620 supply voltage for
system units 5PC600.SX02-00 (revision < H0 and higher), 5PC600.SX02-01 (revision < K0 and
higher).
15V +12V
Buffering capacitors
(for min. 10 ms) +12V
3V3 standby
15V 3V3
3V3
5V Standby
5V
5V
Power on
5V -12V
-12V
Figure 30: Supply voltage for the 2 PCI slots (dependent on system unit version)
Explanation:
The supply voltage is converted to 15 V with a DC/DC converter. These electrically isolated 15
volts feed two further DC/DC converters. One generates +12 V, and the other 3V3 and 5V
standby.
After the system is turned on (e.g. using the power button), the voltages 3V3, 5 V, +12 V are
placed on the bus. At the 5 V output, yet another DC/DC converter generates -12 V, and places
these on the bus.
The optional APC620 add-on UPS and battery unit is supplied with 15 V and provides an
uninterrupted power supply from the 15 V bus during power failures.
5PC600.E815-00
5PC600.E815-02
5PC600.E815-03
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-01
5PC600.X855-01
5PC600.E855-03
5PC600.X855-03
All entries in watts Enter values in this
columns
The entries for the Generator are maximum values.
Entries for the Device are determined maximum
values, but not peak values.
Technical Data
Add-on UPS module, optional 7.5 7.5 7.5 7.5 7.5 7.5 7.5 7.5 7.5
Section 2
max. possible at 5V 55
CPU Board, fixed device 14 18 25 17 21 23 23 37 37
per CompactFlash, optional (add-on, slide-in) 1 1 1 1 1 1 1 1 1
Hard Disk, optional (add-on, slide-in) 4 4 4 4 4 4 4 4 4
per Drive, optional (slide-in CD,DVD CD-RW) 4 4 4 4 4 4 4 4 4
External keyboard PS/2, optional 1 1 1 1 1 1 1 1 1
USB Peripheral, optional 5 5 5 5 5 5 5 5 5
(max. 2,5 watts per USB1 and USB2 connection)
Interface option (add-on interface), optional 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5
Graphics adapter (AP Link), optional 5 5 5 5 5 5 5 5 5
5V
Devices 5V å
max. possible at -12V 1.2
-12V
Devices -12V å
Devices total 5V å
max. possible at 3V3 23
System unit, fixed device 4 4 4 4 4 4 4 4 4
Graphics adapter (AP Link), optional 5 5 5 5 5 5 5 5 5
3V3
Interface option (add-on interface), optional 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25
PCI card manufacturer limit, optional 1)
(max. 3 watts without fan kit, max. 17 watts with fan kit)
Devices 3V3 å
max. possible at +12V 12
Fan kit, optional 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5
+12V
Devices +12V å
Devices total å
1) The total performance of one PCI card per PCI slot (= sum of power consumptions for each voltage area) may not exceed the limits stated for operation with or without
a fan kit.
See section "Starting current", on page 136 for starting current values.
5PC600.E815-00
5PC600.E815-02
5PC600.E815-03
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-01
5PC600.X855-01
5PC600.E855-03
5PC600.X855-03
All entries in watts Enter values in this
columns
The entries for the Generator are maximum values.
Entries for the Device are determined maximum
values, but not peak values.
Devices 5V å
max. possible at -12V 1.2
-12V
Devices -12V å
Devices total 5V å
max. possible at 3V3 23
System unit, fixed device 4 4 4 4 4 4 4 4 4
3V3
Interface option (add-on interface), optional 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25
PCI card manufacturer limit, optional 1)
(max. 3 watts without fan kit, max. 17 watts with fan kit)
Devices 3V3 å
max. possible at +12V 12
Fan kit, optional 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5
+12V
Devices +12V å
Devices total å
1) The total performance of one PCI card per PCI slot (= sum of power consumptions for each voltage area) may not exceed the limits stated for operation with or without
a fan kit.
See section "Starting current", on page 136 for starting current values.
The following block diagram presents the simplified structure of the APC620 supply voltage for
system units 5PC600.SF03-00.
Technical Data
Section 2
Supply voltage 15V
24V 15V
+24 VDC
electrically
isolated
3V3 Standby
15V 3V3 3V3
Buffering capacitors
(for at least 10 ms)
5V Standby
5V
5V
Power On
5V +12V
+12V
+12V PCI bus
Explanation:
Systems with 3 PCI slots have an additional power supply for the PCI buses and the slide-in
drive. The supply voltage is converted to 15 V with a DC/DC converter. These electrically
isolated 15 volts feed two further DC/DC converters. One generates 5 V for an additional DC/DC
converter, which produces +12 V and +12V PCI bus voltage. The other DC/DC converter
produces 3V3 and 5V standby.
After the system is turned on (e.g. using the power button), the voltages 3V3, 5 V, +12 V are
placed on the bus. At the 5 V output, yet another DC/DC converter generates -12 V, and places
these on the bus.
The optional APC620 add-on UPS and battery unit is supplied with 15 V and provides an
uninterrupted power supply from the 15 V bus during power failures.
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-01
5PC600.X855-01
5PC600.E855-03
5PC600.X855-03
All entries in watts Enter values in this
column
The entries for the Generator are maximum values.
Entries for the Device are determined maximum
values, but not peak values.
Devices total 5V å
Total power supply
Devices -12V å
Devices total 5V å
max. possible at 3V3 PCI bus and slide-in 23
3V3
Devices 3V3 å
See section "Starting current", on page 136 for starting current values.
2.11.1 Supply voltage for the 5PC600.SX05-00 (revision >= H0) and 5PC600.SX05-01
(revision >= H0)
The following block diagram presents the simplified structure of the APC620 supply voltage for
system units 5PC600.SX05-00 (Revision H0), 5PC600.SX05-01 (Revision H0).
Technical Data
Add-on UPS UPS battery
module (optional)
Section 2
Supply voltage 15V
24V 15V
+24 VDC
electrically
isolated
3V3 Standby
15V 3V3 3V3
Buffering capacitors
(for at least10 ms)
5V Standby
5V
5V
Power On
5V +12V
+12V
+12V PCI bus
Figure 32: Supply voltage for the 5 PCI slots (dependent on system unit version)
Explanation:
Systems with 5 PCI slots have an additional power supply for the PCI buses and the slide-in
drive. The supply voltage is converted to 15 V with a DC/DC converter. These electrically
isolated 15 volts feed two further DC/DC converters. One generates 5 V for an additional DC/DC
converter, which produces +12 V and +12V PCI bus voltage. The other DC/DC converter
produces 3V3 and 5V standby.
After the system is turned on (e.g. using the power button), the voltages 3V3, 5 V, +12 V are
placed on the bus. At the 5 V output, yet another DC/DC converter generates -12 V, and places
these on the bus.
The optional APC620 add-on UPS and battery unit is supplied with 15 V and provides an
uninterrupted power supply from the 15 V bus during power failures.
2.11.2 Power calculation with system unit 5PC600.SX05-00 (revision >= H0)
5PC600.E815-00
5PC600.E815-02
5PC600.E815-03
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-01
5PC600.X855-01
5PC600.E855-03
5PC600.X855-03
All entries in watts Enter values in this
columns
The entries for the Generator are maximum values.
Entries for the Device are determined maximum
values, but not peak values.
Technical Data
Add-on UPS module, optional 7.5 7.5 7.5 7.5 7.5 7.5 7.5 7.5 7.5
Section 2
max. possible at 5V 70
CPU Board, fixed device 14 18 25 17 21 23 23 37 37
per CompactFlash, optional (add-on, slide-in) 1 1 1 1 1 1 1 1 1
Hard Disk, optional (add-on, slide-in) 4 4 4 4 4 4 4 4 4
External keyboard PS/2, optional 1 1 1 1 1 1 1 1 1
USB Peripheral, optional 5 5 5 5 5 5 5 5 5
(max. 2,5 watts per USB1 and USB2 connection)
Interface option (add-on interface), optional 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5
5V
Devices 5V å
Devices -12V å
Devices total +5V å
max. possible at 3V3 PCI bus 23
3V3
Devices 3V3 å
Total PCI bus and slide-in å
Devices total å
1) The total performance of one PCI card per PCI slot (= sum of power consumptions for each voltage area) may not exceed the limits stated for operation with or without
a fan kit.
See section "Starting current", on page 136 for starting current values.
2.11.3 Power calculation with system unit 5PC600.SX05-01 (revision >= H0)
5PC600.E815-00
5PC600.E815-02
5PC600.E815-03
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-01
5PC600.X855-01
5PC600.E855-03
5PC600.X855-03
All entries in watts Enter values in this
columns
The entries for the Generator are maximum values.
Entries for the Device are determined maximum
values, but not peak values.
Interface option (add-on interface), optional 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25
Devices 3V3 å
PCI bus and slide-in power supply (max.) 50
max. possible at 5V PCI bus and slide-in 50
per CompactFlash, optional (slide-in) 1 1 1 1 1 1 1 1 1
PCI bus and slide-in power supply
Devices -12V å
Devices total +5V å
max. possible at 3V3 PCI bus and slide-in 23
3V3
Devices 3V3 å
Total PCI bus and slide-in å
Devices total å
1) The total performance of one PCI card per PCI slot (= sum of power consumptions for each voltage area) may not exceed the limits stated for operation with or without
a fan kit.
See section "Starting current", on page 136 for starting current values.
2.11.4 Supply voltage for the 5PC600.SX05-00 (revision < H0) and 5PC600.SX05-01
(revision <= H0)
The following block diagram presents the simplified structure of the APC620 supply voltage for
system units 5PC600.SX05-00 (Revision < H0), 5PC600.SX05-01 (Revision < H0).
Technical Data
Supply voltage 15V
24V 15V
Section 2
+24 VDC
electrically
isolated
15V +12V
+12V
Buffering capacitors
(for min. 10 ms)
3V3 Standby
15V
3V3 3V3
5V Standby
5V
5V
Power On
Figure 33: Supply voltage block diagram 5 PCI slots (dependent on system unit version)
Explanation:
Systems with 5 PCI slots have two additional power supplies for the PCI bus and the slide-in
drives. The supply voltage is converted to 15 V with a DC/DC converter. These electrically
isolated 15 V feed four further DC/DC converters. Two generate +12 V, and the others generate
3V3 and 5V standby. After the system is turned on (e.g. using the power button), the voltages
3V3, 5 V, +12 V are placed on the bus. At the 5 V output, yet another DC/DC converter
generates -12 V , and places these on the bus.
The optional APC620 add-on UPS and battery unit is supplied with 15 V and provides an
uninterrupted power supply from the 15 V bus during power failures.
5PC600.E815-00
5PC600.E815-02
5PC600.E815-03
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-01
5PC600.X855-01
5PC600.E855-03
5PC600.X855-03
All entries in watts Enter values in this
columns
The entries for the Generator are maximum values.
Entries for the Device are determined maximum
values, but not peak values.
Technical Data
Section 2
max. possible at 5V 55
CPU Board, fixed device 14 18 25 17 21 23 23 37 37
per CompactFlash, optional (add-on, slide-in) 1 1 1 1 1 1 1 1 1
Hard Disk, optional (add-on, slide-in) 4 4 4 4 4 4 4 4 4
External keyboard PS/2, optional 1 1 1 1 1 1 1 1 1
5V
Fan kit, optional 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5
External consumer, optional (via BaseBoard) 10 10 10 10 10 10 10 10 10
Devices +12V å
PCI bus and slide-in power supply (max.) 50
max. possible at 5V PCI bus and slide-in 50
per CompactFlash, optional (slide-in) 1 1 1 1 1 1 1 1 1
per Hard Disk, optional (slide-in) 4 4 4 4 4 4 4 4 4
PCI bus and slide-in power supply
1)
(max. 3 watts without fan kit, max. 17 watts with fan kit)
Devices total 5V å
max. possible at 3V3 PCI bus and slide-in 23
3V3
Devices 3V3 å
max. possible at +12V PCI bus and slide-in 12
+12V
Devices +12V å
See section "Starting current", on page 136 for starting current values.
5PC600.E815-00
5PC600.E815-02
5PC600.E815-03
5PC600.E855-04
5PC600.X855-04
5PC600.E855-05
5PC600.X855-05
5PC600.E855-00
5PC600.X855-00
5PC600.E855-02
5PC600.X855-02
5PC600.E855-01
5PC600.X855-01
5PC600.E855-03
5PC600.X855-03
All entries in watts Enter values in this
columns
The entries for the Generator are maximum values.
Entries for the Device are determined maximum
values, but not peak values.
Interface option (add-on interface), optional 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25
Devices 3V3 å
max. possible at +12V 12
+12V
Fan kit, optional 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5
Total power supply
1)
(max. 3 watts without fan kit, max. 17 watts with fan kit)
Devices total 5V å
Devices +12V å
Total PCI bus and slide-in å
Devices total å
1) The total performance of one PCI card per PCI slot (= sum of power consumptions for each voltage area) may not exceed the limits stated for operation with or without
a fan kit.
See section "Starting current", on page 136 for starting current values.
The following block diagram presents the simplified structure of the APC620 embedded supply
voltage for system units 5PC600.SE00-00, 5PC600.SE00-01 and 5PC600.SE00-02.
Technical Data
Section 2
Supply voltage 15V
24V 15V
+24 VDC
electrically
isolated
3V3 Standby
Buffering capacitors
15V 3V3
(for min. 10 ms)
3V3
5V Standby
5V
5V
Power On
Figure 34: Supply voltage for the 5PC600.SE00-00, 5PC600.SE00-01 and 5PC600.SE00-02
Explanation:
The supply voltage is converted to 15 V with a DC/DC converter. These electrically isolated 15
V feed four further DC/DC converters, which generate the remaining voltages.
After the system is turned on (e.g. using the power button), the voltages 3V3 and 5 V are placed
on the bus.
The optional APC620 add-on UPS and battery unit is supplied with 15 V and provides an
uninterrupted power supply from the 15 V bus during power failures.
5PC600.X855-04
5PC600.X855-05
5PC600.X855-00
5PC600.X855-02
All entries in watts Enter values in this
column
The values for the suppliers are maximum values.
The values for the devices are average maximum
values, but not peak values.
Devices 5V å
Maximum possible at 3V3 23
3V3
See section "Starting current", on page 136 for starting current values.
The following table displays the minimum and maximum humidity for the individual components
that are relevant for the humidity limitations of the entire device. The lowest and highest common
values are always used when establishing these limits.
Technical Data
System units (all models) 5 to 90% 5 to 95%
Section 2
Main memory for CPU boards 10 to 90% 5 to 95%
5AC600.HDDI-00 (24 hours/default) 8 to 90% 5 to 95%
5AC600.HDDI-01 (ET) 8 to 90% 5 to 95%
5AC600.HDDI-02 (ET) 8 to 90% 5 to 95%
5AC600.HDDI-03 (ET) 8 to 90% 5 to 95%
Add-on drives 5AC600.HDDI-04 (ET) 8 to 90% 5 to 95%
5AC600.HDDI-05 (ET, 24x7) 5 to 90% 5 to 95%
5AC600.HDDI-06 (ET, 24x7) 5 to 90% 5 to 95%
5AC600.SDDI-00 ≤ D0 5 to 95% 5 to 95%
5AC600.SDDI-00 ≥ E0 10 to 95% 10 to 95%
5AC600.CDXS-00 8 to 80% 5 to 95%
5AC600.DVDS-00 8 to 80% 5 to 95%
5AC600.DVRS-00 8 to 80% 5 to 95%
Slide-in drives 5AC600.FDDS-00 20 to 80% 5 to 90%
5AC600.HDDS-00 (ET, 24x7) 8 to 90% 5 to 95%
5AC600.HDDS-01 (ET) 8 to 90% 5 to 95%
5AC600.HDDS-02 (ET, 24x7) 5 to 90% 5 to 95%
5AC600.CANI-00 5 to 90% 5 to 95%
5AC600.485I-00 5 to 90% 5 to 95%
5AC600.SDL0-00 5 to 90% 5 to 95%
5ACPCI.RAIS-00 (24 hours/default) 8 to 90% 5 to 95%
5ACPCI.RAIS-01 (24 hours/default) 8 to 90% 5 to 95%
Additional insert cards
Interfaces 5ACPCI.RAIC-01 (24 hours/default) 5 to 90% 5 to 95%
AP Link
5ACPCI.RAIC-02 (24 hours/default) 5 to 90% 5 to 95%
5ACPCI.RAIC-03 (24 hours/default) 8 to 90% 5 to 95%
5ACPCI.RAIC-04 (24 hours/default) 8 to 90% 5 to 95%
5ACPCI.RAIC-05 (24 hours/default) 5 to 95% 5 to 95%
5MMHDD.0250-00 (24 hours/default) 5 to 95% 5 to 95%
The listed specifications correspond to the relative humidity at an ambient temperature of 30°C.
More detailed information about the specific temperature-dependent humidity values can be
found in the technical data for the individual components.
The following two graphics show the general and optional device interfaces on an APC620
complete device with 5 PCI slots or an APC620 embedded device.
MIC, Line IN
Technical Data
and Line OUT
Section 2
PCI slots
half-size or full-size Monitor / Panel
(max. 5 ) connection
USB
Ethernet ETH 2
Ethernet ETH 1
Status LEDs
Slide-in slot 2
CompactFlash slot CF1
drive slot (optional)
CompactFlash slot or
Slide-in slot 1
hard disk CF2 / HDD (optional)
drive slot (optional)
Reset and Power
buttons
Battery
Hardware security
key (Dongle)
Figure 35: General device interfaces example - APC620 with 5 PCI slots
POWERLINK
Ethernet 10/100 MBit
COM1
+24 VDC supply voltage
CAN
Monitor/Panel
Status LEDs CAN / X2X SDL (Smart Display Link) / DVI
4 x USB
COM2
X2X
Status LEDs
Power, CF, Link
Power button
Each individual device interface is explained in greater detail on the following pages.
Technical Data
Pin Assignment
Section 2
COM1
1 DCD
1 5
2 RXD
3 TXD 6 9
4 DTR
5 GND
6 DSR
7 RTS
8 CTS
9 RI
1) The interfaces, etc. available on the device or module were numbered accordingly for easy identification. This numbering can differ from
the numbering used by the particular operating system.
The setting for the I/O address and the IRQ can be changed in the BIOS setup (under
"Advanced" - submenu "I/O Device Configuration" setting "Serial port A"). Please note any
potential conflicts with other resources when changing this setting.
4 DTR
5 GND
6 DSR
7 RTS
8 CTS
9 RI
1) The interfaces, etc. available on the device or module were numbered accordingly for easy identification. This numbering can differ from
the numbering used by the particular operating system.
The setting for the I/O address and the IRQ can be changed in the BIOS setup (under
"Advanced" - submenu "I/O Device Configuration" setting "Serial port B"). Please note any
potential conflicts with other resources when changing this setting.
Technical Data
4 SHLD (shield)
Section 2
Table 34: X2X pin assignments (only APC620 embedded)
Driver support
The fieldbus interface X2X is only supported together with Automation Runtime (for more
information, see section "Automation PC 620 with Automation Runtime", on page 564).
CAN
The electrically isolated CAN bus interface is a 4-pin multipoint
connector.
Transfer rate Max. 500 kBit/s
Bus length Max. 1000 meters
Pin CAN bus 1 2 3 4
1 CAN_H (CAN High)
2 CAN⊥ (CAN ground)
3 CAN_L (CAN Low)
4 SHLD (shield)
Driver support
The fieldbus interface CAN is only supported together with Automation Runtime (for more
information, see section "Automation PC 620 with Automation Runtime", on page 564).
Table 36: CAN node number switch (x1, x16) - only APC620 embedded
Technical Data
Section 2
Table 38: Status LEDs CAN / X2X (only APC620 embedded)
Transfer rate
Cable length max. 100 m (min. Cat5e) Green/Red Green
LED color On Off
Green/red see Status / Error LED
Green Link Activity (blinking)
(POWERLINK (Data transfer in
network progress)
connection
available)
Driver support
The fieldbus interface POWERLINK is only supported together with Automation Runtime (for
more information, see section "Automation PC 620 with Automation Runtime", on page 564).
The status/error LED is a green/red dual LED. The color green (status) is superimposed on the
color red (error).
Table 40: Status / Error LED as error LED - POWERLINK V2 operating mode
Technical Data
0 ... F 1 ... D station number Operation as controlled
Section 2
node
F E Reserved
F F Reserved
Table 42: POWERLINK station number (x1, x16) - only APC620 embedded
1) The interfaces, etc. available on the device or module were numbered accordingly for easy identification. This numbering can differ from
the numbering used by the particular operating system.
2) Both operating modes possible. Change-over takes place automatically.
Driver support
A special driver is necessary for operating the Intel Ethernet controller 82562. Drivers for
Windows XP Professional, Windows XP Embedded, Windows Embedded Standard 2009 and
DOS are available for download on the B&R Homepage in the download area (www.br-
automation.com).
Information:
Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages.
Ethernet cable length when 855GME (ETX) CPU boards are used.
The supported cable length depends on the system unit revision when using Intel 855GME CPU
boards (5PC600.E855-xx (ETX)).
Technical Data
5PC600.SX02-01 Revision < G5 Starting with revision G5
Section 2
5PC600.SF03-00 - Starting with revision A0
5PC600.SX05-00 Revision < G0 Starting with revision G0
5PC600.SX05-01 Revision < G0 Starting with revision G0
Table 45: Ethernet cable length in conjunction with 5PC600.E855-xx CPU boards (ETX)
1) When higher quality cable is used (e.g.: category CAT7), greater distances are possible.
Ethernet cable length when 855GME (XTX) CPU boards are used.
The supported cable length depends on the system unit revision when using Intel 855GME CPU
boards (5PC600.E855-xx (XTX)).
Table 46: Ethernet cable length in conjunction with 5PC600.E855-xx CPU boards
The hardware supports Auto MDX, which means an integrated switch automatically determines
if the connected cable is crossed or not and adjusts itself accordingly. However, Auto MDX must
be supported by the Ethernet driver used by the operating system.
B&R recommends not using the Auto MDX function during cabling, and instead using it only as
a diagnostics or testing feature.
1) The interfaces, etc. available on the device or module were numbered accordingly for easy identification. This numbering can differ from
the numbering used by the particular operating system.
2) Both operating modes possible. Change-over takes place automatically.
Driver support
A special driver is necessary for operating the Intel Ethernet controller 82551ER. Drivers for
Windows XP Professional, Windows XP Embedded, Windows Embedded Standard 2009 and
DOS are available for download on the B&R Homepage in the download area (www.br-
automation.com ).
Information:
Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages.
The APC620 devices have a USB 2.0 (Universal Serial Bus) host controller with multiple USB
ports, two of which are on the outside for easy user access.
See the section "USB connection (only APC620 embedded)", on page 134 for a description of
the USB connections on APC620 embedded devices.
Technical Data
(12 MBit/s) up to High speed (480 MBit/s)
Section 2
Power supply Max. 500 mA per port2)
USB1
Maximum 5 m (without hub)
Cable length
USB2
1) The interfaces, etc. available on the device or module were numbered accordingly for easy identification. This numbering can differ from
the numbering used by the particular operating system.
2) For safety, every USB port is equipped with a maintenance free "USB current-limiting circuit breaker" (max. 500 mA)
Warning!
Peripheral USB devices can be connected to the USB interfaces. Due to the vast
number of USB devices available on the market, B&R cannot guarantee their
performance. B&R does ensure the performance of all USB devices that they
provide.
Warning!
Because of general PC specifications, this interface should be handled with extreme
care with regard to EMC, location of cables, etc.
Driver support
For optimal functionality of USB 2.0 (transfer speed up to 480 Mbit/s) with Windows XP, at least
Service Pack 1 must be installed. Without Service Pack 1, Windows XP will only support USB
1.1.
USB 2.0 comes already integrated in B&R's XP embedded operating systems.
The APC620 embedded devices have a USB 2.0 (Universal Serial Bus) host controller with
multiple USB ports, two of which are on the outside for easy access.
Universal Serial Bus (USB1, USB2, USB3, USB4)1) - only APC620 embedded
Transfer rate Low speed (1.5 MBit/s), Full speed (12 4 x USB type A, female
MBit/s) up to High speed (480 Mbit/s)
Power supply2)
USB1, USB3 Max. 500 mA
USB2, USB4 Max. 1 A
Maximum 5 m (without hub)
Cable length
1) The interfaces, etc. available on the device or module were numbered accordingly for easy identification. This numbering can differ from
the numbering used by the particular operating system.
2) For safety, every USB port is equipped with a maintenance free "USB current-limiting circuit breaker" (max. 500 mA or 1 A). The sum
of all 4 USB ports must not exceed the limit of 2 A.
Warning!
Peripheral USB devices can be connected to the USB interfaces. Due to the vast
number of USB devices available on the market, B&R cannot guarantee their
performance. B&R does ensure the performance of all USB devices that they
provide.
Warning!
Because of general PC specifications, this interface should be handled with extreme
care with regard to EMC, location of cables, etc.
The Automation PC 620 has a 24 VDC ATX compatible power supply. Depending on the system
unit, the power supply provides the following maximum performances (in watts).
System unit Max. power Max. power Max. power Max. power Max.
at + 5 V at + 3V3 at + 12 V at - 12 V total power
5PC600.SX01-00 55 23 12 1.2 70
5PC600.SX02-00 55 23 12 1.2 70
5PC600.SX02-01 55 23 12 1.2 70
Technical Data
Section 2
5PC600.SF03-00 105 46 24 1.2 110
5PC600.SX05-00 105 46 24 1.2 110
5PC600.SX05-01 105 46 24 1.2 110
5PC600.SE00-00 55 23 12 1.2 55
5PC600.SE00-01 55 23 12 1.2 55
5PC600.SE00-02 55 23 12 1.2 55
The 3-pin socket required for the supply voltage connection is not included in delivery. This can
be ordered from B&R using the model number 0TB103.9 (screw clamp) or 0TB103.91 (cage
clamp).
The pin assignments can be found either in the following table or printed on the APC620 housing.
The supply voltage is internally protected (10A, fast-acting), so that the device cannot be
damaged if there is an overload (fuse replacement necessary) or if the voltage supply is
connected incorrectly (reverse polarity protection - fuse replacement not necessary).
Supply voltage
Protected against reverse polarity 3-pin, male
Pin Description
-
1 + Power 24 VDC
+
2 Functional ground
3 - 1 2 3
Accessories
0TB103.9 Plug 24 V 5.08 3p screw clamps
0TB103.91 Plug 24 V 5.08 3p cage clamps
Ground
Caution!
Functional ground (pin 2 of power supply and ground connection) must be kept as
short as possible and connected to the largest possible wire cross section at the
central grounding point (e.g. the control cabinet or system).
The grounding connection can be found on the bottom of the APC620 systems. The M4 self-
locking nut can be used, for example, to fasten a copper strip that is built into the APC620 at a
central grounding point in the switching cabinet or system. The largest possible conductor cross
section should be used (at least 2.5 mm²).
Starting current
Table 51: Starting currents in the voltage supply to the system units
If the APC620 is in Standby mode (e.g. Windows XP shutdown), then buffering takes a little more
time due to capacitors and low power consumption. If the "Power Loss Control" option is set to
"Power On" or "Last State" in BIOS, then a system with one of the system unit revisions in table
52 "System unit revisions for at least 10 seconds turn-off time" might not restart because a
Power Off/On was not detected. To make sure that these system units will restart after a Power
Off/On, the turn-off time should be set to at least 10 seconds.
Technical Data
Section 2
5PC600.SX01-00 System 1 PCI Starting with revision B0
5PC600.SX02-00 System 2 PCI, 1 disk drive slot, 1 AP Link slot Starting with revision B0
5PC600.SX02-01 System 2 PCI, 1 disk drive slot Starting with revision B0
5PC600.SX05-00 System 5 PCI, 2 disk drive slots, 1 AP Link slot Starting with revision A0
5PC600.SX05-01 System 5 PCI, 2 disk drive slots Starting with revision A0
Table 52: System unit revisions for at least 10 seconds turn-off time
Thanks to a workaround, the turn-off time can be set as needed in systems with one of the
following system unit revisions or higher.
When using this video output, understand that the video signals that are available (RGB, DVI,
and SDL - Smart Display Link) will vary depending on the system unit and CPU board.
Monitor / Panel
The following will provide an overview of the video signals available with
different system units and CPU boards.
For details, see technical data for the CPU board being used.
System unit 815E board (ETX) 855GME board 24-pin DVI-I with special functions, female
(ETX / XTX)
5PC600.SX01-00 RGB, DVI, SDL RGB, DVI, SDL (GE1)
5PC600.SX02-00 RGB RGB, DVI, SDL (GE1)
Monitor / Panel
5PC600.SX02-01 RGB, DVI, SDL RGB, DVI, SDL (GE2)
5PC600.SF03-00 RGB, DVI, SDL RGB, DVI, SDL (GE2)
5PC600.SX05-00 RGB RGB, DVI, SDL (GE1)
5PC600.SX05-01 RGB, DVI, SDL RGB, DVI, SDL (GE1)
5PC600.SE00-00 - RGB, DVI, SDL (GE1)
5PC600.SE00-01 - RGB
5PC600.SE00-02 - RGB, DVI, SDL (GE1)
Hotplug for a display device is not supported in any combination. The plugs are specified for 100
connection cycles.
Caution!
The RGB, DVI and SDL cables can only be plugged in and unplugged when the
APC620 and display device (Automation Panel 900, Automation Panel 800, monitor)
are turned off.
See "Definitions for RGB, DVI, SDL", on page 142 for descriptions of RGB, DVI and SDL.
Pin assignments
Technical Data
Section 2
6 DDC clock 21 XUSB1+
DVI-I 24 pin, female
7 DDC data 22 T.M.D.S. Clock Shield
8 Analog vertical sync 23 T.M.D.S. Clock + 1 2 3 4 5 6 7 8
c1 c2
9 T.M.D.S. DATA 1- 24 T.M.D.S. Clock - 9 10 11 12 13 14 15 16
17 18 19 20 21 22 23 24 c3 c4
10 T.M.D.S. DATA 1+ c1 Analog red video out c5
The following table shows the relationship between segment lengths and the maximum
resolution according to the SDL cable used:
Cables Resolution
VGA SVGA XGA SXGA UXGA
Segment length [m] 640 x 480 800 x 600 1024 x 768 1280 x 1024 1600 x 1200
5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00
1.8 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01
5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03
5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00
5 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01
5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03
5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-001)
10 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-011)
5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-031)
Cables Resolution
VGA SVGA XGA SXGA UXGA
Segment length [m] 640 x 480 800 x 600 1024 x 768 1280 x 1024 1600 x 1200
5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-001) -
15 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-011) -
5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-031) -
5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) -
20
5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031)
5CASDL.0250-001) 5CASDL.0250-001) 5CASDL.0250-001) - -
25
5CASDL.0250-031) 5CASDL.0250-031) 5CASDL.0250-031) - -
5CASDL.0300-001) 5CASDL.0300-001) 5CASDL.0300-102) 5CASDL.0300-102) -
30
5CASDL.0300-031) 5CASDL.0300-031) 5CASDL.0300-132) 5CASDL.0300-132) -
5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) -
40
5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) -
1) See table 56 "Requirements for SDL cable with automatic cable adjustment (equalizer)", on page 140
2) See table 57 "Requirements for SDL cable with extender and automatic cable adjustment (equalizer)", on page 141
The cable types and resolutions shown with a footnote 1) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 56: Requirements for SDL cable with automatic cable adjustment (equalizer)
The cable types and resolutions shown with a footnote 2) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Technical Data
Hardware Name Revision Note
Section 2
5DLSDL.1000-00 AP Link SDL receiver Rev. D0
5DLSDL.1000-01 AP Link SDL transceiver Rev. D0
5AC600.SDL0-00 AP Link SDL transmitter Rev. B3
5PC600.SX01-00 System 1 PCI Rev. E0
5PC600.SX02-00 System 2 PCI, 1 disk drive slot, 1 AP Link slot Rev. D0
5PC600.SX02-01 System 2 PCI, 1 disk drive slot Rev. E0
5PC600.SF03-00 System 3 PCI, 1 disk drive slot, 1 AP Link slot Rev. A0
5PC600.SX05-00 System 5 PCI, 2 disk drive slots, 1 AP Link slot Rev. C0
5PC600.SX05-01 System 5 PCI, 2 disk drive slots Rev. C0
Table 57: Requirements for SDL cable with extender and automatic cable adjustment (equalizer)
RGB means:
• It is possible to connect RGB monitors (with adapter, model nr. 5AC900.1000-00) and
office RGB TFT displays.
DVI means:
• Connection of B&R Automation Panel 900 display units with Automation Panel Link DVI
Receiver (Model nr. 5DLDVI.1000-01), Office Digital/DVI Monitors and Office DVI TFT
Displays is possible.
For examples and possibilities for connecting Automation Panel 900 display units via DVI, see
Appendix A, chapter 3 "Commissioning", section 4 "Connection examples", starting on page 308.
• Connection of B&R Automation Panel 800 and Automation Panel 900 display units with
Automation Panel Link SDL receiver (Model nr. 5DLSDL.1000-01) or SDL transceiver
(Model nr. 5DLSDL.1000-01).
Technical Data
Section 2
Automation Panel 900 Automation Panel 800
Automation PC 620
For examples and possibilities for connecting Automation Panel 900 and Automation Panel 800
display units via SDL, see Appendix A, chapter 3 "Commissioning", section 4 "Connection
examples", starting on page 308.
All APC620 systems include an AC97 (specification 2.2) compatible sound chip with access to
the channels MIC, Line IN and Line OUT from the outside.
Information:
APC620 embedded devices do not have these connections.
Table 58: Technical data - MIC, Line IN and Line OUT port
Driver support
A special driver is necessary for operating the AC97 sound chip (Realtek). Drivers for Windows
XP Professional, Windows XP Embedded, Windows Embedded Standard 2009 are available for
download on the B&R Homepage in the download area (www.br-automation.com ).
Information:
Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages.
An optional add-on interface (e.g. CAN, RS485) can be installed here. See also section 3.9
"Interface options", on page 274.
Information:
APC620 embedded devices do not have this option.
Technical Data
Add-on interface slot
Section 2
Available add-on interfaces
5AC600.CANI-00 Add-on CAN interface IF Option
Information:
An add-on interface module is only available factory-installed.
Information:
An add-on UPS module can be installed with the following system unit revisions or
later:
For more on the UPS module, see chapter 6 "Accessories", section 16 "Uninterruptible power
supply", on page 720.
For info on configuring the UPS module, see chapter 4 "Software", section 9.4 "UPS
configuration", on page 599.
For info on installing the UPS module, see chapter 7 "Maintenance / Servicing", section 5
"Installing the UPS module", on page 765.
The option of inserting and using an AP Link card is only possible with system units
5PC600.SX02-00, 5PC600.SF03-00 and 5PC600.SX05-00.
For more information see section 3.11 "AP Link cards", on page 288.
Information:
APC620 embedded devices do not have this option.
Technical Data
Section 2
2.14.21 PCI slots
Information:
APC620 embedded devices do not have a PCI slot.
Up to 5 PCI slots are available, depending on the system unit. 5-volt cards or universal cards that
comply with the PCI half-size standard 2.2, and that do not exceed the following dimensions can
be inserted.
177.7
106.7
100.5
9
17.4 25.8 55
314
106.7
100.5
9
Information:
The total performance of one PCI card per PCI slot should not exceed the limit with
or without a fan kit (see section "Power management APC620 system unit with 1 PCI
slot", on page 97 or section "Power management APC620 system unit with 3 PCI
slots", on page 107 and "Power management APC620 system units with 5 PCI
slots", on page 109).
Technical data
The plug design for the PCI slot is the same as the design for a 5-volt PCI plug. The supply is
applied at 3.3 volts and 5 volts on the actual plug.
Technical Data
Section 2
Dual-voltage PCI card
universal card
5 V and 3.3 V compatible
The status LEDs are integrated in the system unit behind the orange front cover.
See the section "Status LEDs Power, CF, Link (only APC620 embedded)", on page 151 for a
description of the status LEDs on APC620 embedded devices.
Status LEDs
The light for the status LEDs is fed to the front cover via fiber optic lines.
Technical Data
Section 2
Figure 46: Front-side status LEDs
The status LEDs are integrated in the system unit behind the orange front cover.
Table 63: Status LEDs Power, CF, Link (only APC620 embedded)
This CompactFlash slot is a fixed component of an APC620 system, and is defined in BIOS as
the primary master drive. Type I CompactFlash cards are supported. Available CompactFlash
cards - see table 17 "Model numbers - CompactFlash cards", on page 43.
See the section "CompactFlash slots (only APC620 embedded)", on page 155 for a description
of the CompactFlash slots on APC620 embedded devices.
Warning!
Inserting and removing the CompactFlash card can only take place without power
applied!
This slot allows for the installation of a hard disk or a second CompactFlash slot (type I
CompactFlash card) as add-on drives (see table 5.7 "Drives" for available add-on drives). The
add-on drive is referred to in BIOS as the primary slave drive.
See the section "CompactFlash slots (only APC620 embedded)", on page 155 for a description
of the CompactFlash slots on APC620 embedded devices.
Information:
Technical Data
Section 2
Add-on drives are only available factory-installed. Therefore, they need to be
requested when placing an order.
Warning!
Inserting and removing the CompactFlash card can only take place without power
applied!
These CompactFlash slots are a fixed part of an APC620 embedded system and are defined in
the BIOS as Primary Master (CF1) and Primary Slave (CF2) drive. Type I CompactFlash cards
are supported.
Technical Data
CompactFlash
Section 2
Type Type I
Accessories Short description
5CFCRD.0512-06 512 MB B&R CompactFlash card
5CFCRD.1024-06 1024 MB B&R CompactFlash card
5CFCRD.2048-06 2048 MB B&R CompactFlash card
5CFCRD.4096-06 4096 MB B&R CompactFlash card
5CFCRD.8192-06 8192 MB B&R CompactFlash card
5CFCRD.016G-06 16 GB B&R CompactFlash card
5CFCRD.032G-06 32 GB B&R CompactFlash card
5CFCRD.0064-03 CompactFlash 64 MB SSI
5CFCRD.0128-03 CompactFlash 128 MB SSI
5CFCRD.0256-03 CompactFlash 256 MB SSI
5CFCRD.0512-03 CompactFlash 512 MB SSI
5CFCRD.1024-03 CompactFlash 1024 MB SSI
Ejector
5CFCRD.2048-03 CompactFlash 2048 MB SSI
5CFCRD.4096-03 CompactFlash 4096 MB SSI
5CFCRD.8192-03 CompactFlash 8192 MB SSI
Warning!
Inserting and removing the CompactFlash card can only take place without power
applied!
Due to the complete ATX power supply support, the power button serves various functions.
These functions can be configured either in the BIOS setup (see BIOS function "Power button
function" in section "Power", on page 409 for 815E CPU boards (ETX), or section "Power", on
page 465 for 855GME CPU boards (ETX) or section "Power", on page 523 for 855GME CPU
boards (XTX)) or, for example, in the operating system Windows XP.
Power button
Reset button
Warning!
A system reset can cause data to be lost!
Slot for a standard PS/2 mouse or a PS/2 AT-Enhanced keyboard. BIOS automatically
determines whether a mouse or a keyboard has been connected, and transfers this information
to the operating system.
Information:
APC620 embedded devices do not have a PS/2 interface.
Technical Data
Section 2
With a PS/2 Y-cable, both keyboard and mouse can be operated simultaneously. They must be
connected before the system is switched on.
This interface has a Hot-Plug function for PS/2 keyboards (only when no PS/2 mouse has ever
been connected and used!).
Warning!
Because of general PC specifications, this interface should be used with extreme
care concerning EMC, location of cables, etc.. It should therefore only be used for
service!
Information:
The BIOS setup defaults only allow for the operation of a PS/2 keyboard. If a PS/2
mouse is connected, it must be activated in BIOS. In order to do this, set "PS/2
mouse" in the BIOS setup menu to "enabled" and save. (Located under Advanced -
Miscellaneous - Item "PS/2 mouse").
2.14.30 Battery
The lithium battery (3 V, 950 mAh) buffers the internal real-time clock (RTC) as well as the
individually saved BIOS settings and is located behind the black cover. The buffer duration of the
battery is at least 4 years (2½ years with the SRAM module model number 5AC600.SRAM-00
or with an APC620 embedded system unit and at 50°C, 8.5 mA current requirements of the
supplied components and a self discharge of 40%). The battery is subject to wear and should be
replaced regularly (at least following the specified buffer duration).
Battery
Battery
Type Renata 950 mAh
Removable Yes, accessible from the
Lifespan outside
4 years1) 2)
Accessories Short description
0AC201.91 Lithium batteries, 4 pcs.
Lithium batteries (4 pcs.),
3 V / 950 mAh, button cell
4A0006.00-000 Lithium battery, 1 pc.
Lithium battery (1 pcs.),
3 V / 950 mAh, button cell
APC620 with 1, 2, 3 and 5 PCI slots APC620 embedded
For more on changing the lithium battery, see chapter 7 "Maintenance / Servicing", section
"Changing the battery", on page 743.
For technical information on the lithium battery, see chapter 6 "Accessories", section 4
"Replacement CMOS batteries", on page 641.
The battery status is evaluated immediately following start-up of the device and is subsequently
checked by the system every 24 hours. The battery is subjected to a brief load (1 second) during
the measurement and then evaluated. The evaluated battery status is displayed in the BIOS
Setup pages (under Advanced - Baseboard monitor) and in the B&R Control Center (ADI driver),
but can also be read in a customer application via the ADI Library.
Technical Data
• 5PC600.SX01-00 starting with Rev. H0
Section 2
• 5PC600.SX02-01 starting with Rev. K0
• 5PC600.SF03-00 starting with Rev. A0
• 5PC600.SX05-00 starting with Rev. H0
• 5PC600.SX05-01 starting with Rev. H0
• APC620 / Panel PC 700 Firmware Upgrade V1.19 (MTCX PX32: V1.63, MTCX FPGA
V1.19)
• BIOS 855GME (ETX) V1.26, BIOS 855GME (XTX) V1.14
B&R recommends a hardware security key (dongle) based on the DS1425 from MAXIM
(previously Dallas Semiconductors) for software copy protection.
Warning!
Turn off power before removing or adding the hardware security key.
The setting for the I/O address and the IRQ can be changed in the BIOS setup (under
"Advanced" - submenu "I/O device configuration" setting "Parallel port").
The "slide-in slot 1" drive slot exists only in APC620 system units with 2, 3 or 5 PCI slots. It is
possible to insert a number of slide-in drives into it. See table for available slide-in drives 10
"Model numbers - Drives", on page 40.
For instructions about installing and replacing a slide-in, see chapter 7 "Maintenance /
Servicing", section 4 "Slide-in drive - installation and exchange", on page 762.
Technical Data
00) and DVD-R/RW, DVD+R/RW (5AC600.DVRS-00) drive are referred to in BIOS as
Section 2
"secondary slave". The slide-in USB FDD drive (5AC600.FDDS-00) is referred to as USB.
Information:
• It is possible to add, remove, or modify the slide-in drive at any time.
• In system units with 5 PCI slots, the slide-in USB FDD (5AC600.FDDS-00)
drive must be inserted in slide-in slot 1 for mechanical reasons. The slide-in
drive 5AC600.CFSS-00 (slide-in CF 2-slot) should only be operated in slide-in
slot 2.
Caution!
Turn off power before adding or removing a slide-in drive.
Slide-in slot 1
Connection Secondary slave IDE device
Accessories Short description
5AC600.CDXS-00 Slide-in CD-ROM
5AC600.CFSS-00 Slide-in CF 2-slot
5AC600.DVDS-00 Slide-in DVD-ROM/CD-RW
5AC600.DVRS-00 Slide-in DVD-R/RW, DVD+R/RW
5AC600.FDDS-00 Slide-in USB FDD
5AC600.HDDS-02 40 GB 24x7 ET slide-in hard disk
The "slide-in slot 2" drive slot exists only in APC620 system units with 5 PCI slots. It is possible
to insert a number of slide-in drives into it. See table for available slide-in drives 10 "Model
numbers - Drives", on page 40.
For instructions about installing and replacing a slide-in, see chapter 7 "Maintenance /
Servicing", section 4 "Slide-in drive - installation and exchange", on page 762.
Information:
• It is possible to add or remove a slide-in drive at any time.
• In system units with 5 PCI slots, the slide-in USB FDD (5AC600.FDDS-00)
drive must be inserted in slide-in slot 1 for mechanical reasons. The slide-in
drive 5AC600.CFSS-00 (slide-in CF 2-slot) should only be operated in slide-in
slot 2.
Caution!
Turn off power before adding or removing a slide-in drive.
Slide-in slot 2
Connection Secondary master IDE device
Accessories Short description
5AC600.CDXS-00 Slide-in CD-ROM
5AC600.CFSS-00 Slide-in CF 2-slot
5AC600.DVDS-00 Slide-in DVD-ROM/CD-RW
5AC600.DVRS-00 Slide-in DVD-R/RW, DVD+R/RW
5AC600.FDDS-00 Slide-in USB FDD
5AC600.HDDS-02 Slide-in hard disk 40 GB 24x7, ET
Each B&R device is assigned a unique serial number label with a bar code (type 128), which
allows the device to be clearly identified.
The serial number for the entire device is located behind the front door. This serial number
represents all of the components built into the system (model number, name, revision, serial
number, delivery date and duration of warranty).
Technical Data
Section 2
Figure 47: APC620 serial number sticker on front-side
A sticker with detailed information about the individual components can also be found on the
back side of the mounting plate.
This information can also be found on the B&R homepage. Enter the serial number of the entire
device (found behind the front door) in the serial number search field on the start page www.br-
automation.com. The search provides you with a detailed list of the individual components.
The following block diagrams show the simplified structure according to the system unit being
used with a 855GME CPU board (ETX / XTX).
CPU temperature
Technical Data
DC/DC processor voltage CPU board
Intel Pentium M
Section 2
Clock generator
SM bus Intel Celeron M
yellow
Serial Flash
PS/2 mouse
Serial EEPROM
factory settings or keyboard
Power button
Ethernet
Piezzo controller Ethernet
summer ETH2
Intel 82551ER
Ethernet
Optional
Optional ETH1
add-on Secondary IDE Ethernet
CompactFlash hard disk or controller controller
slot CompactFlash Mic
slot
Primary IDE
South Bridge AC97 sound
controller ICH4 controller AC97
Intel 82801DB Line In
USB3 sound
Battery Real time clock USB USB0
950 mAh RTC controller
V battery USB6 Line Out
USB1 USB USB5
USB2
Battery backup module hub USB1 USB1 / USB2
BIOS
flash SM bus
6-pin Serial EEPROM
Load
battery
controller
CMOS setup RS232 COM1
unit
Temp. sensor
Controller
RS232 COM2
+ 15.6 volts
V Batterie Keyboard controller
Line driver
10 ms buffer DC/DC + 5 volts Hardware Serial 1 RS232 Security key
3-pin switch monitor
DC/DC CPU temperature
supply
isolated I/O controller
voltage Line driver
DC/DC + 3.3 volts Winbond Serial 2
switch RS232
Floppy W83627HF
controller Dallas security
External interface LPT key controller
Optional or interior interface
Figure 50: Block diagram of entire device with system unit 5PC600.SX01-00 and 855GME CPU board
AP Link module
CPU temperature
DC/DC processor voltage CPU board LVDS TMDS
Intel Pentium M 63LVD824 Sil 160 AP Link
Clock generator
SM Bus Intel Celeron M SDL2 / DVI-D
Altera
FPGA
yellow
Serial Flash
PS/2 mouse
Serial EEPROM
or keyboard
Slide-in slot 1
factory settings
Power button
Ethernet
Piezzo controller Ethernet
USB5 summer ETH2
Intel 82551ER
Ethernet
Optional
Optional ETH1
add-on Secondary IDE Ethernet
CompactFlash hard disk or controller controller
slot CompactFlash Mic
slot
Primary IDE
South Bridge AC97 sound
controller ICH4 controller AC97
Intel 82801DB Line In
USB3 sound
Battery Real time clock USB USB0
950 mAh RTC controller
V battery USB6 Line Out
USB1 USB USB5
USB2
Battery backup module hub USB1 USB1 / USB2
BIOS
Flash SM bus
6-pin Serial EEPROM
Load
battery controller
CMOS setup RS232 COM1
unit
Temp. sensor
Controller
RS232 COM2
+ 15.6 volts
V battery Keyboard controller
Line driver
10 ms buffer DC/DC + 5 volts Hardware Serial 1 RS232 Security key
3-pin switch CPU temperature monitor
DC/DC
supply
isolated I/O controller
voltage Line driver
DC/DC + 3.3 volts Winbond Serial 2 RS232
switch
Floppy W83627HF
controller Dallas security
Exterior interface LPT key controller
Optional or internal interface
Figure 51: Block diagram of entire device with system unit 5PC600.SX02-00 and 855GME CPU board
CPU temperature
DC/DC processor voltage CPU board
Intel Pentium M
Clock generator
SM bus Intel Celeron M
Technical Data
SM bus SDL1 / DVI-I
Intel 82855GMCH SDL IF
Section 2
SO-DIMM Optional
module Memory Graphics fan 1
controller controller
256MB - 1GB Temp. sensor Optional IF: Optional Power / LED
PCI bus I/O CAN or RS485 fan 2 red/green/orange
controller
Temp. sensor Optional HDD LED
power supply fan 3
yellow
yellow
Serial Flash
PS/2 mouse
Serial EEPROM
or keyboard
Slide-in slot 1
factory settings
Power button
Ethernet
Piezzo controller Ethernet
USB5 summer ETH2
Intel 82551ER
Ethernet
Optional
Optional ETH1
add-on Secondary IDE Ethernet
CompactFlash hard disk or controller controller
slot CompactFlash Mic
slot
Primary IDE
South Bridge AC97 sound
controller ICH4 controller AC97
Intel 82801DB Line In
USB3 sound
Battery Real time clock USB USB0
950 mAh RTC controller
V battery USB6 Line Out
USB1 USB USB5
USB2
Battery backup module hub USB1 USB1 / USB2
BIOS
Flash SM Bus
6-pin Serial EEPROM
Load
battery
controller
CMOS setup RS232 COM1
unit
Temp. sensor
Controller
RS232 COM2
+ 15.6 volts
V Batterie Keyboard controller
Line driver
10 ms buffer DC/DC + 5 volts Hardware Serial 1 RS232 Security key
3-pin switch CPU temperature monitor
DC/DC
supply
isolated
I/O controller
voltage Line driver
DC/DC + 3.3 volts Winbond Serial 2
switch RS232
Floppy W83627HF
controller Dallas security
External interface LPT key controller
Optional or interior interface
Figure 52: Block diagram of entire device with system unit 5PC600.SX02-01 and 855GME CPU board
AP Link module
CPU temperature
DC/DC processor voltage CPU board LVDS TMDS
Intel Pentium M 63LVD824 Sil 160 AP Link
Clock generator
SM Bus Intel Celeron M SDL2 / DVI-D
Altera
FPGA
yellow
DC/DC +3V3 bus
Serial Flash
PS/2 mouse
Serial EEPROM
or keyboard
Slide-in slot 1
factory settings
Figure 53: Block diagram of entire device with system unit 5PC600.SF03-00 and 855GME CPU board
AP Link module
CPU temperature
DC/DC processor voltage CPU board LVDS TMDS
Intel Pentium M 63LVD824 Sil 160 AP Link
Clock generator
SM Bus Intel Celeron M SDL2 / DVI-D
Altera
FPGA
Technical Data
SM bus SDL1 / DVI-I
Intel 82855GMCH SDL IF
Section 2
SO-DIMM Optional
module Memory Graphics fan 1
controller controller
256MB - 1GB Temp. sensor Optional IF Optional Power / LED
PCI bus CAN or RS485 fan 2 red/green/orange
I/O
controller
Temp. sensor Optional HDD LED
power supply fan 3
yellow
yellow
DC/DC +3V3 bus
Serial Flash
PS/2 mouse
Serial EEPROM
or keyboard
Slide-in slot 1
Slide-in slot 2
factory settings
Figure 54: Block diagram of entire device with system unit 5PC600.SX05-00 and 855GME CPU board
CPU temperature
DC/DC processor voltage CPU board
Intel Pentium M
Clock generator
SM bus Intel Celeron M
yellow
DC/DC +3V3 bus
Serial Flash
PS/2 mouse
Serial EEPROM
or keyboard
Slide-in slot 1
Slide-in slot 2
factory settings
Figure 55: Block diagram of entire device with system unit 5PC600.SX05-01 and 855GME CPU board
Power / LED
red/green/orange
CF LED
yellow
North Bridge
Technical Data
SM bus
Intel 82855GMCH Link1 LED
Section 2
SO-DIMM yellow
256MB - 1GB
controller controller Reset button
Temp. sensor
PCI bus I/O
controller
Temp. sensor Power button
power supply
CAN
RAM 128 kB CAN status LED
yellow
Serial Flash
FPGA MTCX controller
CAN node
Serial EEPROM
Factory Settings number
CAN terminating
PCI bus switch
CAN terminating
LED
yellow
CompactFlash
slot 2 Piezzo FPGA X2X
buzzer
fielbus interfaces
and SRAM X2X status LED
yellow
POWERLINK, X2X,
CompactFlash Ethernet CAN, SRAM
slot 1 controller
POWERLINK
Slave
Primary IDE
South Bridge AC97 sound SRAM
Master controller ICH4 controller 512 kB
V battery
POWERLINK
Intel 82801DB USB3
Real-time clock USB USB5 n.c. node number
Battery
950 mAh RTC controller
V battery
Figure 56: Block diagram of entire device with system unit 5PC600.SE00-00 and 855GME CPU board
CPU temperature
DC/DC processor voltage Monitor / Panel
Board temperature CPU board analog RGB
RGB
855GME (XTX)
SM bus
Clock generator
Power / LED
red/green/orange
CF LED
yellow
SM bus North Bridge
Intel 82855GMCH Link1 LED
SO-DIMM yellow
256MB - 1GB
controller controller Reset button
Temp. sensor
PCI bus I/O
controller
Temp. sensor Power button
power supply
CAN
RAM 128 kB CAN status LED
yellow
Serial Flash
FPGA MTCX controller
CAN node
Serial EEPROM
Factory Settings number
CAN terminating
PCI bus switch
CAN terminating
LED
yellow
CompactFlash
slot 2 Piezzo FPGA X2X
buzzer
fielbus interfaces
and SRAM X2X status LED
yellow
POWERLINK, X2X,
CompactFlash Ethernet CAN, SRAM
slot 1 controller
POWERLINK
Slave
Primary IDE
South Bridge AC97 sound SRAM
Master controller ICH4 controller 512 kB
V battery
POWERLINK
Intel 82801DB USB3
Real-time clock USB USB5 n.c. node number
Battery
950 mAh RTC controller
V battery
Figure 57: Block diagram of entire device with system unit 5PC600.SE00-01 and 855GME CPU board
Power / LED
red/green/orange
CF LED
yellow
North Bridge
Technical Data
SM bus
Intel 82855GMCH Link1 LED
Section 2
SO-DIMM yellow
256MB - 1GB
controller controller Reset button
Temp. sensor
PCI bus I/O
controller
Temp. sensor Power button
power supply
CAN
RAM 128 kB CAN status LED
yellow
Serial Flash
FPGA MTCX controller
CAN node
Serial EEPROM
Factory Settings number
CAN terminating
PCI bus switch
CAN terminating
LED
yellow
CompactFlash
slot 2 Piezzo FPGA X2X
buzzer
fielbus interfaces
and SRAM X2X status LED
yellow
POWERLINK, X2X,
CompactFlash Ethernet CAN, SRAM
slot 1 controller
POWERLINK
Slave
Primary IDE
South Bridge AC97 sound SRAM
Master controller ICH4 controller 1 MB
V battery
POWERLINK
Intel 82801DB USB3
Real-time clock USB USB5 n.c. node number
Battery
950 mAh RTC controller
V battery
Figure 58: Block diagram of entire device with system unit 5PC600.SE00-02 and 855GME CPU board
3. Individual components
All of the individual components of the Automation PC620 system come together inside the
system unit. The system unit consists of an APC620 housing with an integrated main board. The
housing units are available in variations with 1, 2, 3 and 5 PCI slots and in APC620 embedded.
Units with 2, 3 or 5 PCI slots have an additional 1 or 2 slide-in drives, respectively.
Photo
Combined CompactFlash slot 2 / Yes, optional add-on CompactFlash slot or add-on hard disk
hard disk (HDD/CF2)
Internal organization Primary slave
Insert for slide-in drive 1 - Yes
Internal organization Secondary slave
Insert for slide-in drive 2 - - - - Yes
Internal organization Secondary master
APC620 UPS module optional Yes, starting Yes, starting Yes, starting Yes Yes, starting Yes, starting
with Rev. H0 with Rev. G0 with Rev. H0 with Rev. F0 with Rev. H0
Technical Data
SRAM module optional Yes, starting Yes, starting Yes, starting Yes Yes, starting Yes, starting
Section 2
with Rev. I0 with Rev. H0 with Rev. K0 with Rev. H0 with Rev. H0
Reset button Yes
Power button Yes
PS/2 keyboard / mouse Yes, combined, will be automatically detected
Battery slot Yes
Hardware security key slot Yes (DS1425 from MAXIM/Dallas)
Fan slot Yes
Automation Panel link slot - 1 - 1 1 -
Status LEDs Power, HDD, Link1, Link2
Real-time clock (RTC)
Battery-buffered Yes
Accuracy See the technical data for CPU boards
MTCX1) Yes
Electrical characteristics
Power supply
Rated voltage 24 VDC ±25% 24 VDC ±25%
Starting current Typically 7A Typically 10 A
Maximum 40 A for < 300 μs Maximum 40 A for < 300 μs
Power consumption See 2.8 "Power management APC620 system unit See section 2.10 "Power management APC620
with 1 PCI slot" system unit with 3 PCI slots" or 2.11 "Power
management APC620 system units with 5 PCI slots"
Mechanical characteristics
Housing2)
Item Galvanized steel plate
Paint Light gray (similar to Pantone 427CV), dark gray (similar to Pantone 432CV)
Front cover Colored plastic (similar to Pantone 144CV)
Outer dimensions
Width 65 mm 104.5 mm 125 mm 185.4 mm
Length 251 mm 253 mm 253 mm 253 mm
Height 270 mm 270 mm 410 mm 270 mm
Weight Approx. 1.5 kg Approx. 2.6 kg Approx. 4.5 kg Approx. 3.8 kg
Mounting plates (for M4 screws) 4 4 6
Drilling templates for mounting (see chapter 3 "Commissioning", section 1.2 "Drilling templates")
1) Maintenance Controller Extended, for more information, see the section "Maintenance Controller Extended (MTCX)", on page 793.
2) Depending on the process or batch, there may be visible deviations in the color and surface structure.
Photo
Technical Data
Quantity 512 kB 1 MB
Remanent variables for AR
Section 2
(Automation Runtime) in power 256 kB with CPU board 5PC600.X855-xx 256 kB with CPU board
fail mode 192 kB with CPU board 5PC600.X945-00 5PC600.X855-xx
192 kB with CPU board
5PC600.X945-00
Reset button Yes
Power button Yes
PS/2 keyboard / mouse -
Battery slot Yes
Hardware security key slot Yes (DS1425 from MAXIM/Dallas)
Fan slot -
Automation Panel link slot -
Status LEDs Power, HDD, Link1
Real-time clock (RTC)
Battery-buffered Yes
Accuracy See the technical data for the CPU board
MTCX1) Yes
Electrical characteristics
Power supply
Rated voltage 24 VDC ±25%
Starting current Typically 7 A
maximum 40 A for < 300 μs
Power consumption See 2.12 "Power management for the APC620 embedded system unit"
Mechanical characteristics
Housing2)
Item Galvanized steel plate
Paint Light gray (similar to Pantone 427CV), dark gray (similar to Pantone 432CV)
Front cover Colored plastic (similar to Pantone 144CV)
Outer dimensions
Width 68.3 mm
Length 225.6 mm
Height 210 mm
Weight Approx. 1.3 kg
Mounting plates (for M4 screws) 4
Drilling templates for mounting (see chapter 3 "Commissioning", section 1.2 "Drilling templates")
1) Maintenance Controller Extended, for more information, see the section "Maintenance Controller Extended (MTCX)", on page 793.
2) Depending on the process or batch, there may be visible deviations in the color and surface structure.
Technical Data
Section 2
Figure 59: CPU boards 815E (ETX)
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
1) At max. specified ambient temperature: typically 70 ppm (6 seconds) - worst-case 220 ppm (19 seconds).
2) GE = Graphics Engine
Driver support
In order for the CPU board with the Intel 82815E chipset to work properly, it is necessary to install
the Intel chipset driver (e.g. special USB driver) and the graphics chip. The necessary software
can be downloaded from the download area on the B&R homepage (www.br-
automation.com).
Information:
Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages.
Technical Data
Section 2
Figure 60: CPU boards 855GME (ETX)
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Boot loader / Operating BIOS Phoenix (see BIOS section "855GME (ETX) BIOS description", on page 425)
system
Processor
Architectures 0.13 μm 0.13 μm 90 nm 90 nm 0.13 μm 0.13 μm
Type Intel Pentium M Intel Pentium M Intel Pentium M Intel Pentium M Intel Celeron M Intel Celeron M
Clock frequency 1.1 GHz 1.6 GHz 1.4 GHz 1.8 GHz 600 MHz 1000 MHz
Expanded command set MMX MMX MMX MMX MMX MMX
technology, technology, technology, technology, technology, technology,
streaming streaming streaming streaming streaming streaming
SIMD extension SIMD extension SIMD extension SIMD extension SIMD extension SIMD extension
L1 cache 2 2 2 2 2 2
L2 cache 32 kB 32 kB 32 kB 32 kB 32 kB 32 kB
Floating point unit (FPU) 1 MB 1 MB 2 MB 2 MB 512 kB 512 kB
Yes Yes Yes Yes Yes Yes
Chipset Intel 82855GME (GMHC)
Intel 82801DB (ICH4)
1) At max. specified ambient temperature: typically 58 ppm (5 seconds) - worst-case 220 ppm (19 seconds).
2) GE = Graphics Engine
Driver support
In order for the CPU board with the Intel 82855GME chipset to work properly, it is necessary to
install the Intel chipset driver (e.g. special USB driver) and the graphics chip. The necessary
software can be downloaded from the download area on the B&R homepage (www.br-
automation.com).
Information:
Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages.
Technical Data
Section 2
Figure 61: CPU boards 855GME (XTX)
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Boot loader / Operating BIOS AMI (see BIOS section "855GME (XTX) BIOS description", on page 481)
system
Processor
Architectures 0.13 μm 0.13 μm 90 nm 90 nm 0.13 μm 0.13 μm
Type Intel Pentium M Intel Pentium M Intel Pentium M Intel Pentium M Intel Celeron M Intel Celeron M
Clock frequency 1.1 GHz 1.6 GHz 1.4 GHz 1.8 GHz 600 MHz 1000 MHz
Expanded command set MMX MMX MMX MMX MMX MMX
technology, technology, technology, technology, technology, technology,
streaming streaming streaming streaming streaming streaming
SIMD extension SIMD extension SIMD extension SIMD extension SIMD extension SIMD extension
L1 cache 2 2 2 2 2 2
L2 cache 32 kB 32 kB 32 kB 32 kB 32 kB 32 kB
Floating point unit (FPU) 1 MB 1 MB 2 MB 2 MB 512 kB 512 kB
Yes Yes Yes Yes Yes Yes
Chipset Intel 82855GME (GMHC)
Intel 82801DB (ICH4)
1) At max. specified ambient temperature: typically 58 ppm (5 seconds) - worst-case 220 ppm (19 seconds).
2) GE = Graphics Engine
Driver support
In order for the CPU board with the Intel 82855GME chipset to work properly, it is necessary to
install the Intel chipset driver (e.g. special USB driver) and the graphics chip. The necessary
software can be downloaded from the download area on the B&R homepage (www.br-
automation.com).
Information:
Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages.
There are a number of heat sink variants available to be used with different CPU boards.
Technical Data
Section 2
Figure 62: Heat sink
Information:
A heat sink can only be replaced at the B&R plant.
The CPU boards (815E, 855GME) are each equipped with a socket for memory modules. When
choosing a main memory, it is important to consider both the maximum memory capacity (for
815E (ETX) CPU Boards 512 MB, and for 855GME (ETX or XTX) CPU Boards 1 GB) and the
correct type.
Information:
A main memory module can only be replaced at the B&R plant.
3.7 Drives
This 128 GB add-on SSD (Solid State Drive) is based on Multi Level Cell (MLC) technology and
is ATA/ATAPI compatible. The add-on drive is referred to internally as the primary slave drive.
Information:
Technical Data
Add-on drives are only available factory-installed. Therefore, they need to be
Section 2
requested when placing an order.
Technical data
Information:
A sudden loss of power may result in data loss! In very rare cases, mass memory
may also be damaged.
To prevent damage and loss of data, the use of a UPS device is recommended.
Information:
The following characteristics, features and limit values only apply to this individual
component and can deviate from those specified for the fully assembled device. For
the assembled device in which this individual component is used, refer to the data
given specifically for that device.
Technical Data
Storage -40 to 85°C -55 to 95°C
Section 2
Transport -40 to 85°C -55 to 95°C
Relative humidity
Operation 0 to 95%, non-condensing 10 to 95%, non-condensing
Storage 0 to 95%, non-condensing 10 to 95%, non-condensing
Transport 0 to 95%, non-condensing 10 to 95%, non-condensing
Vibration
Operation 20 to 2000 Hz: 20 g 7 to 2000 Hz: 20 g
Storage 20 to 2000 Hz: 20 g 7 to 2000 Hz: 20 g
Transport 20 to 2000 Hz: 20 g 7 to 2000 Hz: 20 g
Shock (pulse with a sine half-wave)
Operation 1500 g, 0.5 ms
Storage 1500 g, 0.5 ms
Transport 1500 g, 0.5 ms
Altitude
Operation - 300 to 12192 meters
Storage - 300 to 12192 meters
Transport - 300 to 12192 meters
1) The simultaneous operation with a CompactFlash card in the CompactFlash1 slot is no longer recommended.
2) IOPS: Random read and write input/output operations per second.
3) TBW: Terabyte written
4) Dimensions without add-on
5) Weight without add-on
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
50 Storage
Operation
45 Transport
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
Transport
Storage
55
Operation
50
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
This 128 GB Solid State Drive can be used as a replacement part for the 5AC600.SSDI-00 SSD.
Technical Data
Section 2
Figure 68: Replacement SSD 128 GB - 5MMSSD.0128-00 ≤ D0
Technical data
Information:
A sudden loss of power may result in data loss! In very rare cases, mass memory
may also be damaged.
To prevent damage and loss of data, the use of a UPS device is recommended.
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the fully assembled device. For
the assembled device in which this individual component is used, refer to the data
given specifically for that device.
Technical Data
Section 2
Temperature humidity diagram
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
50 Storage
Operation
45 Transport
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
Transport
Storage
55
Operation
50
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
This hard disk is specified for 24-hour operation (24x7). The add-on drive is referred to internally
as the primary slave drive.
Information:
Add-on drives are only available factory-installed. Therefore, they need to be
requested when placing an order.
Technical Data
Section 2
Figure 72: Add-on hard disk 30 GB 24x7 - 5AC600.HDDI-00
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5AC600.HDDI-00
Manufacturer's product ID Fujitsu MHT2030AR
Formatted capacity 30 GB
Number of heads 2
Number of sectors (user) 58,605,120
Bytes per sector 512
Revolution speed 4200 rpm ±1%
Access time (average) 7.14 ms
Features 5AC600.HDDI-00
Positioning time (seek, typical values)
Minimum (track to track) 1.5 ms
Average (read access) 12 ms
Maximum 22 ms
Starting time (0 rpm to read access) 5 seconds (typically)
Interface ATA-6
Data transfer rate
On the medium 26.1 to 36.2 MB/s
To/from host Max. 100 MB/s (ultra-DMA mode 5)
Cache 2 MB
Noise level (idle mode) Approx. 24 dBA at 30 cm
Electrical characteristics
Lifespan 5 years or 20,000 POH (Power-On Hours)
MTBF 300,000 hours
Mechanical characteristics
Add-on mounting Fixed
Outer dimensions (without slide-in)
Width 70 mm
Length 100 mm
Height 9.5 mm
Weight 120 g
Environmental characteristics
Ambient temperature1)
Operation - standard 2) 5 to 55°C
Operation - 24-hour 3) 5 to 44°C
Bearings -40 to 65°C
Transport -40 to 65°C
Relative humidity
Operation 8 to 90%, non-condensing
Bearings 5 to 95%, non-condensing
Transport 5 to 95%, non-condensing
Vibration
Operation No non-recovered errors at max. 5 - 500 Hz and 1 g (9.8 m/s2 0-peak)
Bearings No damage at max. 5 - 500 Hz and 5 g (49 m/s 2 0-peak)
Shock (pulse with a sine half-wave)
Operation No non-recovered errors at max. 225 g (2207 m/s2 0-peak) and 2 ms duration
Bearings No damage at max. 900 g (8820 m/s2 0-peak) and 1 ms duration
No damage at max. 120 g (1176 m/s2 0-peak) and 11 ms duration
Altitude
Operation - 300 to 3000 meters
Bearings - 300 to 12000 meters
1) Temperature data is for operation at 500 meters. Derating the max. ambient temperature - typically 1°C per 1000 meters (from 500
meters above sea level).
2) Standard operation means 250 POH (power-on hours) per month.
3) 24-hour operation means 732 POH (power-on hours) per month.
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
Technical Data
Storage 24-hour
50
Transport operation
Section 2
45
40
Standard operation
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
This hard disk has an extended temperature specification (ET), but is not permitted for 24 hour
operation. The add-on drive is referred to internally as the primary slave drive.
Information:
Add-on drives are only available factory-installed. Therefore, they need to be
requested when placing an order.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5AC600.HDDI-01
Manufacturer's product ID Fujitsu MHT2020AC
Formatted capacity 20 GB
Number of heads 2
Number of sectors (user) 39,070,080
Bytes per sector 512
Revolution speed 4200 rpm ±1%
Access time (average) 7.14 ms
Features 5AC600.HDDI-01
Positioning time (seek, typical values)
Minimum (track to track) 1.5 ms
Average (read access) 12 ms
Maximum 22 ms
Starting time (0 rpm to read access) 5 seconds (typically)
Interface ATA-6
Data transfer rate
On the medium Up to 28.9 MB/s
To/from host Max. 100 MB/s (ultra-DMA mode 5)
Technical Data
Cache 2 MB
Section 2
Noise level (idle mode) Approx. 22 dBA at 30 cm
Electrical characteristics
Lifespan 5 years or 20,000 POH (Power-On Hours)
MTBF 300,000 hours
Mechanical characteristics
Add-on mounting Fixed
Outer dimensions (without slide-in)
Width 70 mm
Length 100 mm
Height 9.5 mm
Weight 120 g
Environmental characteristics
Ambient temperature1)
Operation2) -20 to 80°C
Bearings -40 to 85°C
Transport -40 to 85°C
Relative humidity
Operation 8 to 90%, non-condensing
Bearings 5 to 95%, non-condensing
Transport 5 to 95%, non-condensing
Vibration
Operation No non-recovered errors at max. 5 - 500 Hz and 1 g (9.8 m/s2 0-peak)
Bearings No damage at max. 5 - 500 Hz and 5 g (49 m/s 2 0-peak)
Shock (pulse with a sine half-wave)
Operation No non-recovered errors at max. 225 g (2207 m/s2 0-peak) and 2 ms duration
Bearings No damage at max. 900 g (8820 m/s2 0-peak) and 1 ms duration
No damage at max. 120 g (1176 m/s2 0-peak) and 11 ms duration
Altitude
Operation - 300 to 3000 meters
Bearings - 300 to 12000 meters
1) Temperature data is for operation at 500 meters. Derating the max. ambient temperature - typically 1°C per 1000 meters (from 500
meters above sea level).
2) Standard operation means 250 POH (power-on hours) per month.
100
95
90
Relative Luftfeuchtigkeit [%RH] (nicht kondensierend)
85
80
75
70
65
60
55
Lagerung
50 Betrieb
Transport
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperatur [°C] +
This hard disk is specified for 24-hour operation (24x7). The add-on drive is referred to internally
as the primary slave drive.
Information:
Add-on drives are only available factory-installed. Therefore, they need to be
requested when placing an order.
Technical Data
Section 2
Figure 76: Add-on hard disk 40 GB - 5AC600.HDDI-02
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5AC600.HDDI-02
Manufacturer's product ID Hitachi HTE726040M9AT00
Formatted capacity 40 GB
Number of heads 4
Number of sectors (user) 78,140,160
Bytes per sector 512
Revolution speed 7200 rpm ±1%
Access time (average) 10 ms
Features 5AC600.HDDI-02
Positioning time (seek, typical values)
Minimum (track to track) 1 ms
Average (read access) 10 ms
Maximum (read access) 16 ms
Starting time (0 rpm to read access) 4 seconds (typically)
Interface ATA-6
Data transfer rate
On the medium 236 to 507 MBit/s
To/from host Max. 100 MB/s (ultra-DMA mode 5)
Cache 8 MB
Electrical characteristics
Lifespan 5 years or 30,000 POH (Power-On Hours)
MTBF 477,000 hours1)
Mechanical characteristics
Add-on mounting Fixed
Outer dimensions (without slide-in)
Width 70 mm
Length 100 mm
Height 9.5 mm
Weight 120 g
Environmental characteristics
Ambient temperature2)
Operation - standard 3) 5 to 55°C
Operation - 24-hour4) 5 to 40°C
Bearings -40 to 65°C
Transport -40 to 65°C
Relative humidity
Operation 8 to 90%, non-condensing
Bearings 5 to 95%, non-condensing
Transport 5 to 95%, non-condensing
Vibration
Operation 5 - 500 Hz: 1 g (9.8 m/s2 0-peak) duration 2 octaves per minute; no non-recovered errors
Bearings 5 - 500 Hz: 5 g (49 m/s2 0-peak) duration 0.5 oct./min.; no damage
Shock (pulse with a sine half-wave)
Operation No non-recovered errors at max. 200 g (1960 m/s2 0-peak) and 2 ms duration
No non-recovered errors at max. 15 g (147 m/s2 0-peak) and 11 ms duration
Bearings No damage at max. 980 g (9800 m/s2 0-peak) and 1 ms duration
No damage at max. 120 g (1176 m/s2 0-peak) and 11 ms duration
Altitude
Operation - 300 to 3048 meters
Bearings - 300 to 12192 meters
100
95
90
Relative Luftfeuchtigkeit [%RH] (nicht kondensierend)
85
80
75
70
65
60
55
Technical Data
Lagerung 24 Stunden
50
Transport Betrieb
Section 2
45
40
35
30
Standard-
betrieb
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperatur [°C] +
This hard disk is specified for 24-hour operation (24x7). The add-on drive is referred to internally
as the primary slave drive.
Information:
Add-on drives are only available factory-installed. Therefore, they need to be
requested when placing an order.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5AC600.HDDI-03
Manufacturer's product ID Hitachi HTE721060G9AT00
Formatted capacity 60 GB
Number of heads 3
Number of sectors (user) 117,210,240
Bytes per sector 512
Revolution speed 7200 rpm ±1%
Access time (average) 10 ms
Features 5AC600.HDDI-03
Positioning time (seek, typical values)
Minimum (track to track) 1 ms
Average (read access) 10 ms
Maximum (read access) 16 ms
Starting time (0 rpm to read access) 4 seconds (typically)
Interface ATA-6
Data transfer rate
On the medium 267 to 629 MBit/s
To/from host Max. 100 MB/s (ultra-DMA mode 5)
Technical Data
Cache 8 MB
Section 2
Electrical characteristics
Lifespan 5 years or 30,000 POH (Power-On Hours)
MTBF 550,000 hours1)
Mechanical characteristics
Add-on mounting Fixed
Outer dimensions (without slide-in)
Width 70 mm
Length 100 mm
Height 9.5 mm
Weight 120 g
Environmental characteristics
Ambient temperature2)
Operation - standard 3) 5 to 55°C
Operation - 24-hour4) 5 to 40°C
Bearings -40 to 65°C
Transport -40 to 65°C
Relative humidity
Operation 8 to 90%, non-condensing
Bearings 5 to 95%, non-condensing
Transport 5 to 95%, non-condensing
Vibration
Operation 5 - 500 Hz: 1 g (9.8 m/s2 0-peak) duration 1 octave per minute; no non-recovered errors
Bearings 10 - 500 Hz: 5 g (49 m/s2 0-peak) duration 0.5 oct./min.; no damage
Shock (pulse with a sine half-wave)
Operation No non-recovered errors at max. 160 g (1568 m/s2 0-peak) and 1 ms duration
No non-recovered errors at max. 300 g (2900 m/s2 0-peak) and 2 ms duration
No non-recovered errors at max. 15 g (147 m/s2 0-peak) and 11 ms duration
Bearings No damage at max. 1000 g (9800 m/s2 0-peak) and 1 ms duration
No damage at max. 120 g (1176 m/s2 0-peak) and 11 ms duration
Altitude
Operation - 300 to 3048 meters
Bearings - 300 to 12192 meters
100
95
90
Relative Luftfeuchtigkeit [%RH] (nicht kondensierend)
85
80
75
70
65
60
55
Lagerung 24 Stunden
50
Transport Betrieb
45
40
35
30
Standard-
betrieb
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperatur [°C] +
This hard disk is specified for 24-hour operation (24x7). The add-on drive is referred to internally
as the primary slave drive.
Information:
Add-on drives are only available factory-installed. Therefore, they need to be
requested when placing an order.
Technical Data
Section 2
Figure 80: Add-on hard disk 80 GB - 5AC600.HDDI-04
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5AC600.HDDI-04
Manufacturer's product ID Hitachi HTE721080G9AT00
Formatted capacity 80 GB
Number of heads 4
Number of sectors (user) 156,301,488
Bytes per sector 512
Revolution speed 7200 rpm ±1%
Access time (average) 10 ms
Features 5AC600.HDDI-04
Positioning time (seek, typical values)
Minimum (track to track) 1 ms
Average (read access) 10 ms
Maximum (read access) 16 ms
Starting time (0 rpm to read access) 4 seconds (typically)
Interface ATA-6
Data transfer rate
On the medium 267 to 629 MBit/s
To/from host Max. 100 MB/s (ultra-DMA mode 5)
Cache 8 MB
Electrical characteristics
Lifespan 5 years or 30,000 POH (Power-On Hours)
MTBF 550,000 hours1)
Mechanical characteristics
Add-on mounting Fixed
Outer dimensions (without slide-in)
Width 70 mm
Length 100 mm
Height 9.5 mm
Weight 120 g
Environmental characteristics
Ambient temperature2)
Operation - standard 3) 5 to 55°C
Operation - 24-hour4) 5 to 40°C
Bearings -40 to 65°C
Transport -40 to 65°C
Relative humidity
Operation 8 to 90%, non-condensing
Bearings 5 to 95%, non-condensing
Transport 5 to 95%, non-condensing
Vibration
Operation 5 - 500 Hz: 1 g (9.8 m/s2 0-peak) duration 1 octave per minute; no non-recovered errors
Bearings 10 - 500 Hz: 5 g (49 m/s2 0-peak) duration 0.5 oct./min.; no damage
Shock (pulse with a sine half-wave)
Operation No non-recovered errors at max. 160 g (1568 m/s2 0-peak) and 1 ms duration
No non-recovered errors at max. 300 g (2900 m/s2 0-peak) and 2 ms duration
No non-recovered errors at max. 15 g (147 m/s2 0-peak) and 11 ms duration
Bearings No damage at max. 1000 g (9800 m/s2 0-peak) and 1 ms duration
No damage at max. 120 g (1176 m/s2 0-peak) and 11 ms duration
Altitude
Operation - 300 to 3048 meters
Bearings - 300 to 12192 meters
100
95
90
Relative Luftfeuchtigkeit [%RH] (nicht kondensierend)
85
80
75
70
65
60
55
Technical Data
Lagerung 24 Stunden
50
Transport Betrieb
Section 2
45
40
35
30
Standard-
betrieb
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperatur [°C] +
This hard disk is specified for 24-hour operation (24x7) and also provides an extended
temperature specification (ET). The add-on drive is referred to internally as the primary slave
drive.
Information:
Add-on drives are only available factory-installed. Therefore, they need to be
requested when placing an order.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Technical Data
Cache 8 MB
Section 2
S.M.A.R.T. Support Yes
MTBF 550,000 hours1) 750,000 hours1)
Mechanical characteristics
Add-on mounting Fixed
Outer dimensions (without slide-in)
Width 70 mm
Length 100 mm
Height 9.5 mm
Weight 100 g
Environmental characteristics
Ambient temperature2)
Operation - Standard / 24-hour -30 to 85°C
Bearings -40 to 95°C
Transport -40 to 95°C
Relative humidity
Operation 5 to 90%, non-condensing
Bearings 5 to 95%, non-condensing
Transport 5 to 95%, non-condensing
Vibration
Operation 10 - 500 Hz: 1 g; no non-recovered errors 5 - 500 Hz: 2 g; no non-recovered errors
Bearings 5 - 500 Hz: 5 g; no non-recovered errors 5 - 500 Hz: 5 g; no non-recovered errors
Shock (pulse with a sine half-wave)
Operation Max. 200 g, 2 ms; no non-recovered errors Max. 300 g, 2 ms; no non-recovered errors
Max. 110 g, 11 ms; no non-recovered errors Max. 150 g, 11 ms; no non-recovered errors
Bearings Max. 800 g, 2 ms; no damage Max. 800 g, 2 ms; no damage
Max. 400 g, 0.5 ms; no damage Max. 400 g, 0.5 ms; no damage
Altitude
Operation - 300 to 4419 meters - 300 to 5000 meters
Bearings - 300 to 12192 meters - 300 to 12192 meters
1) With 8760 POH (Power On Hours) per year and 70°C surface temperature.
2) Temperature values for 305 meter altitude. The temperature specification must be reduced linearly by 1°C every 305 meters. The
temperature increase and decrease can be a maximum of 3°C per minute.
100
95
40
90
Relative Luftfeuchtigkeit [%RH] (nicht kondensierend)
30
85
80
75
70
65 Lagerung / Transport
60
55
50
Betrieb
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
- Temperatur [°C] +
Temperature values for 305 meter altitude. The temperature specification must be reduced
linearly by 1°C every 305 meters. The temperature increase and decrease can be a maximum
of 3°C per minute.
This hard disk is specified for 24-hour operation (24x7) and also provides an extended
temperature specification (ET). The add-on drive is referred to internally as the primary slave
drive.
Information:
Add-on drives are only available factory-installed. Therefore, they need to be
requested when placing an order.
Technical Data
Section 2
Figure 84: Add-on hard disk 80 GB - 5AC600.HDDI-06
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5AC600.HDDI-06
Manufacturer's product ID Seagate ST980817AM
Formatted capacity 80 GB
Number of heads 2
Number of sectors (user) 156,301,488
Bytes per sector 512
Revolution speed 5400 rpm ±1%
Access time (average) 10 ms
Features 5AC600.HDDI-06
Positioning time (seek, typical values)
Minimum (track to track) 1 ms
Average (read access) 12.5 ms
Maximum (read access) 22 ms
Starting time (0 rpm to read access) 4 seconds (typically)
Interface ATA-6
Data transfer rate
On the medium Max. 450 MBit/s
To/from host Max. 100 MB/s (Ultra-DMA Mode 5)
S.M.A.R.T. Support Yes
Cache 8 MB
MTBF 750,000 hours1)
Mechanical characteristics
Add-on mounting Fixed
Outer dimensions (without slide-in)
Width 70 mm
Length 100 mm
Height 9.5 mm
Weight 120 g
Environmental characteristics
Ambient temperature2)
Operation - Standard / 24-hour -30 to 85°C
Bearings -40 to 95°C
Transport -40 to 95°C
Relative humidity
Operation 5 to 90%, non-condensing
Bearings 5 to 95%, non-condensing
Transport 5 to 95%, non-condensing
Vibration
Operation 5 - 500 Hz: 2 g; no non-recovered errors
Bearings 5 - 500 Hz: 5 g; no non-recovered errors
Shock (pulse with a sine half-wave)
Operation Max. 300 g, 2 ms; no non-recovered errors
Max. 150 g, 11 ms; no non-recovered errors
Bearings Max. 800 g, 2 ms; no damage
Max. 400 g, 0.5 ms; no damage
Altitude
Operation - 300 to 5000 meters
Bearings - 300 to 12192 meters
1) With 8760 POH (Power On Hours) per year and 70°C surface temperature.
2) Temperature values for 305 meter altitude. The temperature specification must be reduced linearly by 1°C every 305 meters. The
temperature increase and decrease can be a maximum of 3°C per minute.
100
95
40
90
Relative Luftfeuchtigkeit [%RH] (nicht kondensierend)
30
85
80
75
70
65 Lagerung / Transport
60
55
Technical Data
50
Betrieb
Section 2
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
- Temperatur [°C] +
Temperature values for 305 meter altitude. The temperature specification must be reduced
linearly by 1°C every 305 meters. The temperature increase and decrease can be a maximum
of 3°C per minute.
A CompactFlash card inserted in the add-on drive is referred to internally as the "primary slave
drive."
Information:
Add-on drives are only available factory-installed. Therefore, they need to be
requested when placing an order.
Technical data
Features 5AC600.CFSI-00
CompactFlash
Type Type I
Amount 1 slot
Connection Primary slave
Weight 100 g
Warning!
Inserting and removing the CompactFlash card can only take place without power
applied!
The slide-in drive can be used in system units with 2, 3 or 5 PCI slots. When inserted in slide-in
slot 1 it is referred to internally as "secondary slave" and when in slide-in slot 2 as "secondary
master."
Information:
It is possible to add or remove a slide-in drive at any time.
Technical Data
Section 2
Caution!
Turn off power before adding or removing a slide-in drive.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5AC600.CDXS-00
Reading rate 24x
Data transfer rate Max. 33.3 MB/s
Access time (average) 115 ms
Revolution speed Max. 5136 rpm ±1%
Starting time (0 rpm to read access) 10 seconds (maximum)
Host interface IDE (ATAPI)
Readable CD media CD/CD-ROM (12 cm, 8 cm), CD-R, CD-RW
Compatible formats CD-DA, CD-ROM mode 1/mode 2
CD-ROM XA mode 2 (form 1, form 2)
Photo CD (single/multi-session)
Enhanced CD
Cache 128 kB
Noise level (complete read access) Approx. 45 dBA at 50 cm
Lifespan 60,000 POH (Power-On Hours)
Opening/closing the drawer > 10,000 times
Environmental characteristics
Ambient temperature1)
Operation -5 to 60°C2)
Bearings -20 to 60°C
Transport -40 to 65°C
Relative humidity
Operation 8 to 80%, non-condensing
Bearings 5 to 95%, non-condensing
Transport 5 to 95%, non-condensing
Vibration
Operation At max. 5 - 500 Hz and 0.3 g
Bearings At max. 5 - 500 Hz and 2 g
Transport At max. 5 - 500 Hz and 5 g
Shock (pulse with a sine half-wave)
Operation At max. 7 g for 11 ms
Bearings At max. 60 g for 11 ms
At max. 200 g for 2 ms
Transport At max. 60 g for 11 ms
At max. 200 g for 2 ms
1) Temperature data is for operation at 500 meters. Derating the max. ambient temperature - typically 1°C per 1000 meters (from 500
meters above sea level).
2) Drive surface temperature
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
Technical Data
50
Section 2
45 Storage Operation
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
The slide-in drive can be used in system units with 2, 3 or 5 PCI slots. When inserted in slide-in
slot 1 it is referred to internally as "secondary slave" and when in slide-in slot 2 as "secondary
master."
Information:
It is possible to add or remove a slide-in drive at any time.
Caution!
Turn off power before adding or removing a slide-in drive.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5AC600.DVDS-00
Write speed
CD-R 24x, 16x, 10x and 4x
CD-RW 10x and 4x
Reading rate
CD 24x
DVD 8x
Data transfer rate Max. 33.3 MB/s
Access time (average)
CD 85 ms
Technical Data
DVD 110 ms
Section 2
Revolution speed Max. 5136 rpm ±1%
Starting time (0 rpm to read access) 19 seconds (maximum)
Host interface IDE (ATAPI)
Readable media
CD CD/CD-ROM (12 cm, 8 cm), CD-R, CD-RW
DVD DVD-ROM, DVD-R, DVD-RW, DVD-RAM
Non-write protected media
CD CD-R, CD-RW
Compatible formats CD-DA, CD-ROM mode 1/mode 2
CD-ROM XA mode 2 (form 1, form 2)
Photo CD (single/multi-session)
Enhanced CD, CD text
DVD-ROM, DVD-R, DVD-Video (double layer)
DVD-RAM (4.7 GB, 2.6 GB)
Write-methods Disk at once, session at once, packet write, track at once
Laser class Class 1 laser
Data buffer capacity 2 MB
Noise level (complete read access) Approx. 45 dBA at 50 cm
Lifespan 60,000 POH (Power-On Hours)
Opening/closing the drawer > 10,000 times
Environmental characteristics
Ambient temperature1)
Operation +5 to +50°C2)
Bearings -20 to +60°C
Transport -40 to +65°C
Relative humidity
Operation 8 to 80%, non-condensing
Bearings 5 to 95%, non-condensing
Transport 5 to 95%, non-condensing
Vibration
Operation At max. 5 - 500 Hz and 0.2 g
Bearings At max. 5 - 500 Hz and 2 g
Transport At max. 5 - 500 Hz and 2 g
Features 5AC600.DVDS-00
Shock (pulse with a sine half-wave)
Operation At max. 5 g for 11 ms
Bearings At max. 60 g for 11 ms
At max. 200 g for 2 ms
Transport At max. 60 g for 11 ms
At max. 200 g for 2 ms
1) Temperature data is for operation at 500 meters. Derating the max. ambient temperature - typically 1°C per 1000 meters (from 500
meters above sea level).
2) Drive surface temperature
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
50 Storage Operation
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
The slide-in drive can be used in system units with 2, 3 or 5 PCI slots. When inserted in slide-in
slot 1 it is referred to internally as "secondary slave" and when in slide-in slot 2 as "secondary
master."
Information:
It is possible to add or remove a slide-in drive at any time.
Technical Data
Section 2
Caution!
Turn off power before adding or removing a slide-in drive.
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Table 95: Technical data - slide-in DVD-R/RW, DVD+R/RW - 5AC600.DVRS-00 revision D0 and higher
Technical Data
Bearings At max. 60 g for 11 ms
Section 2
At max. 200 g for 2 ms
Transport At max. 60 g for 11 ms
At max. 200 g for 2 ms
Table 95: Technical data - slide-in DVD-R/RW, DVD+R/RW - 5AC600.DVRS-00 revision D0 and higher
(Forts.)
1) RAM drivers are not provided by the manufacturer. Support of RAM function by the burning software "Nero" (model number
5SWUTI.0000-00) or other burning software packages and drivers from third party providers.
2) Temperature data is for operation at 500 meters. Derating the max. ambient temperature - typically 1°C per 1000 meters (from 500
meters above sea level).
3) Drive surface temperature
Table 96: Technical data - slide-in DVD-R/RW, DVD+R/RW - 5AC600.DVRS-00 revision D0 and lower
Table 96: Technical data - slide-in DVD-R/RW, DVD+R/RW - 5AC600.DVRS-00 revision D0 and lower
(Forts.)
1) Temperature data is for operation at 500 meters. Derating the max. ambient temperature - typically 1°C per 1000 meters (from 500
meters above sea level).
2) Drive surface temperature
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
Technical Data
50
Section 2
45 Transport Storage Operation
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
The slide-in drive can be used in system units with 2, 3 or 5 PCI slots. When inserted in slide-in
slot 1, the CompactFlash slot CF3 is referred to internally as "secondary slave" and when in
slide-in slot 2 as "secondary master." CompactFlash slot CF4 is always accessed via USB.
Information:
• It is possible to add or remove a slide-in drive at any time.
• In system units with 5 PCI slots, the slide-in USB FDD drive (5AC600.FDDS-
00) must be inserted in slide-in slot 1.
The double CompactFlash slide-in drive (5AC600.CFSS-00) should only be
used in slide-in slot 2.
Caution!
Turn off power before adding or removing a slide-in drive.
Warning!
The CompactFlash card can only be inserted in and removed from the CF3 IDE
CompactFlash slot can only take place without power applied to the APC620!
Ejector
CF3 via
IDE
Activity LED (Cf4)
Ejector
CF4 via
USB
Technical data
Features 5AC600.CFSS-00
CompactFlash (CF3)
Type Type I and II
Amount 1 slot
Connection IDE - Secondary slave in slide-in slot 1
IDE - Secondary master in slide-in slot 2
Activity LED Yes
CompactFlash (CF4)
Type Type I and II
Technical Data
Amount 1 slot
Section 2
Connection Via USB 2.0
Activity LED Yes
The slide-in drive can be used in system units with 2, 3 or 5 PCI slots. In these units it is
connected to the system via USB.
Information:
• It is possible to add, remove, or modify the slide-in drive at any time.
• In system units with 5 PCI slots, the slide-in USB FDD drive must be inserted
in slide-in slot 1 for mechanical reasons.
Caution!
Turn off power before adding or removing a slide-in drive.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Technical Data
Section 2
Features 5AC600.FDDS-00
Data capacity 720 KB / 1.25 MB / 1.44 MB (formatted)
USB transfer rate Full speed (12 Mbps)
Data transfer rate 250 kbits (720 KB) or 500 kbits (1.25 MB and 1.44 MB)
Rotation speed Up to 360 rpm
Diskette media High density (2HD) or normal density (2DD) 3.5" diskettes
MTBF 30,000 POH (Power-On Hours)
Environmental characteristics
Ambient temperature1)
Operation 4 to 50°C
Bearings -20 to 60°C
Transport -20 to 60°C
Relative humidity
Operation 20 to 80%, non-condensing
Bearings 5 to 90%, non-condensing
Transport 5 to 90%, non-condensing
Vibration
Operation At max. 5 - 500 Hz and 0.3 g
Bearings At max. 10 - 100 Hz and 2 g
Transport At max. 10 - 100 Hz and 2 g
Shock (pulse with a sine half-wave)
Operation At max. 5 g for 11 ms
Bearings At max. 60 g for 11 ms
Transport At max. 60 g for 11 ms
Altitude Max. 3000 meters
1) Temperature data is for operation at 500 meters. Derating the max. ambient temperature - typically 1°C per 1000 meters (from 500
meters above sea level).
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
Storage
50 Operation
Transport
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
Figure 95: Temperature humidity diagram - Slide-in USB diskette drive 5AC600.FDDS-00
This hard disk is specified for 24-hour operation (24x7). The slide-in drive can be used in system
units with 2, 3 or 5 PCI slots. When inserted in slide-in slot 1 it is referred to internally as
"secondary slave" and when in slide-in slot 2 as "secondary master."
Information:
It is possible to add or remove a slide-in drive at any time.
Technical Data
Section 2
Caution!
Turn off power before adding or removing a slide-in drive.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5AC600.HDDS-00
Manufacturer's product ID Fujitsu MHT2030AR
Formatted capacity 30 GB
Number of heads 2
Number of sectors (user) 58,605,120
Bytes per sector 512
Revolution speed 4200 rpm ±1%
Access time (average) 7.14 ms
Positioning time (seek, typical values)
Minimum (track to track) 1.5 ms
Average (read access) 12 ms
Maximum 22 ms
Starting time (0 rpm to read access) 5 seconds (typically)
Interface ATA-6
Data transfer rate
On the medium 26.1 to 36.2 MB/s
To/from host Max. 100 MB/s (ultra-DMA mode 5)
Cache 2 MB
Noise level (idle mode) Approx. 24 dBA at 30 cm
Electrical characteristics
Lifespan 5 years or 20,000 POH (Power-On Hours)
MTBF 300,000 hours
Mechanical characteristics
Slide-in mounting Fixed
Outer dimensions (without slide-in)
Width 70 mm
Length 100 mm
Height 9.5 mm
Weight 120 g
Environmental characteristics
Ambient temperature1)
Operation - standard 2) 5 to 55°C
Operation - 24-hour 3) 5 to 44°C
Bearings -40 to 60°C
Transport -40 to 60°C
Relative humidity
Operation 8 to 90%, non-condensing
Bearings 5 to 95%, non-condensing
Transport 5 to 95%, non-condensing
Vibration
Operation No non-recovered errors at max. 5 - 500 Hz and 1 g (9.8 m/s2 0-peak)
Bearings No damage at max. 5 - 500 Hz and 5 g (49 m/s 2 0-peak)
Technical Data
1) Temperature data is for operation at 500 meters. Derating the max. ambient temperature - typically 1°C per 1000 meters (from 500
Section 2
meters above sea level).
2) Standard operation means 250 POH (power-on hours) per month.
3) 24-hour operation means 732 POH (power-on hours) per month.
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
Storage 24-hour
50
45 Transport operation
40
Standard operation
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
This hard disk has an extended temperature specification (ET), but is not permitted for 24 hour
operation. The slide-in drive can be used in system units with 2, 3 or 5 PCI slots. When inserted
in slide-in slot 1 it is referred to internally as "secondary slave" and when in slide-in slot 2 as
"secondary master."
Information:
It is possible to add or remove a slide-in drive at any time.
Caution!
Turn off power before adding or removing a slide-in drive.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5AC600.HDDS-01
Manufacturer's product ID Fujitsu MHT2020AC
Formatted capacity 20 GB
Number of heads 2
Number of sectors (user) 39,070,080
Bytes per sector 512
Revolution speed 4200 rpm ±1%
Access time (average) 7.14 ms
Technical Data
Positioning time (seek, typical values)
Section 2
Minimum (track to track) 1.5 ms
Average (read access) 12 ms
Maximum 22 ms
Starting time (0 rpm to read access) 5 seconds (typically)
Interface ATA-6
Data transfer rate
On the medium Up to 28.9 MB/s
To/from host Max. 100 MB/s (ultra-DMA mode 5)
Cache 2 MB
Noise level (idle mode) Approx. 22 dBA at 30 cm
Electrical characteristics
Lifespan 5 years or 20,000 POH (Power-On Hours)
MTBF 300,000 hours
Mechanical characteristics
Slide-in mounting Fixed
Outer dimensions (without slide-in)
Width 70 mm
Length 100 mm
Height 9.5 mm
Weight 120 g
Environmental characteristics
Ambient temperature1)
Operation2) -20 to +80°C
Bearings -40 to +85°C
Transport -40 to +85°C
Relative humidity
Operation 8 to 90%, non-condensing
Bearings 5 to 95%, non-condensing
Transport 5 to 95%, non-condensing
Vibration
Operation No non-recovered errors at max. 5 - 500 Hz and 1 g (9.8 m/s2 0-peak)
Bearings No damage at max. 5 - 500 Hz and 5 g (49 m/s 2 0-peak)
Shock (pulse with a sine half-wave)
Operation No non-recovered errors at max. 225 g (2207 m/s2 0-peak) and 2 ms duration
Bearings No damage at max. 900 g (8820 m/s2 0-peak) and 1 ms duration
No damage at max. 120 g (1176 m/s2 0-peak) and 11 ms duration
Features 5AC600.HDDS-01
Altitude
Operation - 300 to 3000 meters
Bearings - 300 to 12000 meters
1) Temperature data is for operation at 500 meters. Derating the max. ambient temperature - typically 1°C per 1000 meters (from 500
meters above sea level).
2) Standard operation means 250 POH (power-on hours) per month.
100
95
90
Relative Luftfeuchtigkeit [%RH] (nicht kondensierend)
85
80
75
70
65
60
55
Lagerung
50 Betrieb
Transport
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperatur [°C] +
This hard disk is specified for 24-hour operation (24x7) and also provides an extended
temperature specification (ET). The slide-in drive can be used in system units with 2, 3 or 5 PCI
slots. When inserted in slide-in slot 1 it is referred to internally as "secondary slave" and when in
slide-in slot 2 as "secondary master."
Information:
It is possible to add or remove a slide-in drive at any time.
Technical Data
Section 2
Caution!
Turn off power before adding or removing a slide-in drive.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Technical Data
Bearings Max. 800 g, 2 ms; no damage Max. 800 g, 2 ms; no damage
Section 2
Max. 400 g, 0.5 ms; no damage Max. 400 g, 0.5 ms; no damage
Altitude
Operation - 300 to 4419 meters - 300 to 5000 meters
Bearings - 300 to 12192 meters - 300 to 12192 meters
1) With 8760 POH (Power On Hours) per year and 70°C surface temperature.
2) Temperature values for 305 meter altitude. The temperature specification must be reduced linearly by 1°C every 305 meters. The
temperature increase and decrease can be a maximum of 3°C per minute.
100
95
40
90
Relative Luftfeuchtigkeit [%RH] (nicht kondensierend)
30
85
80
75
70
65
Lagerung / Transport
60
55
50
Betrieb
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
- Temperatur [°C] +
Temperature values for 305 meter altitude. The temperature specification must be reduced
linearly by 1°C every 305 meters. The temperature increase and decrease can be a maximum
of 3°C per minute.
Sometimes it is simply not possible to avoid using hard disks due to the amount of data that
needs to be saved. In this case, a RAID provides high system availability. All data is
simultaneously and automatically stored on two hard drives. This double data storage means
that when one hard disk fails, the system will continue to run on the second hard disk.
2 PCI slot: PCI RAID controller (5ACPCI.RAIC-00) and PCI card with two hard disks
(5ACPCI.RAIS-00 or 5ACPCI.RAIS-01)
The system can be flexibly implemented in all APC620 und PPC700s with 1 free PCI slot
(depending on the RAID system design). The system also supports RAID 0 applications. As a
result, parallel access to two hard drives with a relatively high data throughput is the main focus,
in addition to the high availability.
File A
File B
File C
File D
File A
File B
File C
File D
Information:
PCI RAID controllers are only available factory-installed. Therefore, this needs to be
requested when placing the order.
Technical Data
Section 2
Primary
Secondary
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5ACPCI.RAIC-00
Manufacturer's product ID Adaptec ATA RAID 1200A
Data transfer rate up to 100 MB/s per channel
RAID level Supports RAID 0, 1, 0/1 and JBOD
Internal connections Two 40-pin connections
Electrical characteristics
Power consumption 0.15 A at 5 V (PCI bus)
Driver support
Drivers for the approved operating systems can be downloaded from the download area on the
B&R homepage (www.br-automation.com).
Information:
Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages.
Contents of delivery
Amount Component
1 Adaptec ATA RAID 1200A controller
2 ATA RAID connection cable (length 130 mm)
The hard disks that are used are specified for 24-hour operation (24x7).
Information:
PCI RAID storage drives are only available factory-installed. Therefore, this needs to
be requested when placing the order.
Technical Data
Section 2
Primary hard disk
Primary Secondary
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5ACPCI.RAIS-00
Manufacturer's product ID Hitachi Travelstar HTE726040M9AT00
Formatted capacity 40 GB
Number of heads 4
Number of sectors (user) 78,140,160
Bytes per sector 512
Revolution speed 7200 rpm ±1%
Access time (average) 4.2 ms
Positioning time (seek, typical values)
Minimum (track to track) 1 ms
Average (read access) 10 ms
Maximum (read access) 16 ms
Starting time (0 rpm to read access) 4 seconds (typically)
Interface ATA-6
Data transfer rate
On the medium 236 to 507 MBit/s
To/from host Max. 100 MB/s (ultra-DMA mode 5)
Cache 8 MB
Electrical characteristics
Lifespan 5 years or 30,000 POH (Power-On Hours)
MTBF 477,000 hours1)
Mechanical characteristics
Mounted on PCI insert Fixed
Outer dimensions (without PCI card)
Width 70 mm
Length 100 mm
Height 9.5 mm
Weight 350 g
Environmental characteristics
Ambient temperature2)
Operation - standard 3) +5 to +55°C
Operation - 24-hour4) +5 to +40°C
Bearings -40 to +65°C
Transport -40 to +65°C
Technical Data
Operation No non-recovered errors at max. 80 g (784 m/s2 0-peak) and 1 ms duration
Section 2
No non-recovered errors at max. 150 g (1450 m/s2 0-peak) and 2 ms duration
No non-recovered errors at max. 7 g (68 m/s2 0-peak) and 11 ms duration
Bearings No damage at max. 500 g (4900 m/s2 0-peak) and 1 ms duration
No damage at max. 60 g (588 m/s2 0-peak) and 11 ms duration
Altitude
Operation - 300 to 3048 meters
Bearings - 300 to 12192 meters
100
95
90
Relative Luftfeuchtigkeit [%RH] (nicht kondensierend)
85
80
75
70
65
60
55
Lagerung 24 Stunden
50
Transport Betrieb
45
40
35
30
Standard-
betrieb
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperatur [°C] +
The hard disks that are used are specified for 24-hour operation (24x7).
Information:
PCI RAID storage drives are only available factory-installed. Therefore, this needs to
be requested when placing the order.
Primary Secondary
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Technical Data
Section 2
Features 5ACPCI.RAIS-01
Manufacturer's product ID Hitachi HTE721060G9AT00
Formatted capacity 60 GB
Number of heads 3
Number of sectors (user) 117,210,240
Bytes per sector 512
Revolution speed 7200 rpm ±1%
Access time (average) 10 ms
Positioning time (seek, typical values)
Minimum (track to track) 1 ms
Average (read access) 10 ms
Maximum (read access) 16 ms
Starting time (0 rpm to read access) 4 seconds (typically)
Interface ATA-6
Data transfer rate
On the medium 267 to 629 MBit/s
To/from host Max. 100 MB/s (ultra-DMA mode 5)
Cache 8 MB
Electrical characteristics
Lifespan 5 years or 30,000 POH (Power-On Hours)
MTBF 550,000 hours1)
Mechanical characteristics
Mounted on PCI insert Fixed
Outer dimensions (without PCI card)
Width 70 mm
Length 100 mm
Height 9.5 mm
Weight 120 g
Environmental characteristics
Ambient temperature2)
Operation - standard 3) 5 to 55°C
Operation - 24-hour4) 5 to 40°C
Bearings -40 to 65°C
Transport -40 to 65°C
100
95
90
Relative Luftfeuchtigkeit [%RH] (nicht kondensierend)
85
80
75
70
65
60
55
Lagerung 24 Stunden
50
Transport Betrieb
45
40
35
30
Standard-
betrieb
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperatur [°C] +
The hard disks that are used are specified for 24-hour operation (24x7).
Features
Technical Data
Section 2
• Only requires 1 PCI slot
• Transfer rates up to 150 MB/s
Information:
The PCI SATA RAID controller can not be used in place of a Universal Power Supply
(UPS). If the operating system is shut down improperly, the next time it is started it
is detected as an error by the RAID 1, and a complete rebuild is executed. This
generally takes at least 50 minutes (configurable) to complete.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5ACPCI.RAIC-01
SATA RAID controller
Type SiI 3512 SATA link
Specifications Serial ATA 1.0
Data transfer rate Max. 1.5 GB/s (150 MB/s)
RAID level Supports RAID 0, 1
BIOS Extension ROM - requirements ca. 32 KB
Hard disks Seagate Momentus 7200.1 ST96023AS
Amount 2
Formatted capacity (512 bytes/sector) 60 GB
Number of heads 3
Number of sectors (user) 117,210,240
Bytes per sector 512
Revolution speed 7200 rpm ±1%
Access time (average) 4.2 ms
Positioning time (seek, typical values)
Minimum (track to track) 1.5 ms
Average (read access) 10.5 ms
Maximum (read access) 22 ms
Starting time (0 rpm to read access) 4 seconds (typically)
Supported transfer mode SATA 1.0, PIO mode 0-4, multiword DMA mode 0-2, UDMA 0-5
Data transfer rate
On the medium max. 539 MBit/s
To/from host Max. 150 MB/s
Cache 8 MB
S.M.A.R.T. Support Yes
Lifespan 5 years
Electrical characteristics
Power consumption 0.3 A at 3.3 V (PCI bus)
1 A at 5 V (PCI bus)
Mechanical characteristics
Mounted on PCI insert Fixed
Weight 350 g
Technical Data
Operation (continuous) No damage at max. 5 - 500 Hz and 0.125 g (1.225 m/s2 0-peak) duration 1 oct/min
Section 2
Operation (occasional) No damage at max. 5 - 500 Hz and 0.25 g (2.45 m/s2 0-peak) duration 1 oct/min
Bearings No damage at max. 5 - 500 Hz and 5 g (49 m/s2 0-peak) duration 0.5 oct/min
Transport No damage at max. 5 - 500 Hz and 5 g (49 m/s2 0-peak) duration 0.5 oct/min
Shock 4) (pulse with a sine half-wave)
Operation No non-recovered errors at max. 125 g (1226 m/s2 0-peak) and 2 ms duration
Bearings No damage at max. 400 g (3924 m/s2 0-peak) and 2 ms duration
No damage at max. 450 g (4424 m/s2 0-peak) and 1 ms duration
No damage at max. 200 g (1962 m/s2 0-peak) and 0.5 ms duration
Altitude
Operation - 300 to 3048 meters
Bearings - 300 to 12192 meters
1) Temperature values for 305 meter altitude. The temperature specification must be reduced linearly by 1°C every 305 meters. The
temperature increase and decrease can be a maximum of 3°C per minute.
2) Standard operation means 333 POH (power-on hours) per month.
3) 24-hour operation means 732 POH (power-on hours) per month.
4) Operation in areas prone to vibration and shock can affect performance negatively (reduction of transfer rate).
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
Storage 24-hour
50
Transport operation
45
40
35
30
operation
Standard
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
Figure 109: Temperature humidity diagram - SATA RAID hard disk 5ACPCI.RAIC-01
Temperature values for 305 meter altitude. The temperature specification must be reduced
linearly by 1°C every 305 meters. The temperature increase and decrease can be a maximum
of 3°C per minute.
Driver support
Special drivers are necessary for operating the PCI SATA RAID controller. Drivers for Windows
XP Professional, Windows XP Embedded and Windows Embedded Standard 2009 are available
for download on the B&R Homepage in the download area (www.br-automation.com).
The .NET-based SATARaid™ serial ATA RAID management software can also be found on the
B&R homepage.
Information:
Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages.
If one of the two hard disks is physically damaged, when the system is booted the SATA RAID
BIOS displays the following error message for approx. 5 seconds: "RAID1 set is in critical status".
After this time the operating system is automatically started on the functioning hard disk. The
installed SATA Raid™ serial ATA RAID management software does not detect this error status.
After repairing the cause of the error (e.g. replacing the hard disk) the SATARaid™ Serial ATA
RAID management software automatically executes a rebuild (mirroring of the hard disk). This
process takes approximately 50 minutes to complete, regardless of the amount of data and with
the highest possible setting for "Rebuild rate".
A hard disk that becomes faulty during operation is detected by the SATA Raid™ Serial ATA
RAID management software and indicated with an error message.
For PCI cards with BIOS Extension ROM, there is a limited area of 64 KB available in the
Phoenix BIOS. A B&R PCI SATA RAID controller requires a free area of approx. 32 KB. The
remaining area can be used as desired.
If a PCI card requiring BIOS extension ROM is plugged into PCI slot 1 on an AP620 with 5 PCI
slots (see figure 110 "PCI slot numbering on APC620 systems with 5 PCI slots") and the B&R
PCI SATA RAID controller is plugged-in at a different position (e.g. PCI slot 4), then the BIOS
menu item Advanced - PCI/PnP Configuration - PCI Device, Slot #2 must be set from "Option
Technical Data
ROM Scan" to "Disabled" so that this device can be used for booting. The BIOS default setting
Section 2
is to always attempt to load the BIOS Extension ROM from the PCI slot 1. Alternatively, the two
PCI cards can be switched.
This setting does not have to be changed if a PCI card without BIOS extension ROM is plugged-
in.
PCI SATA
RAID controller
Figure 110: PCI slot numbering on APC620 systems with 5 PCI slots
Instructions for configuration of a PCI SATA RAID array using RAID BIOS can be found in
chapter 3 "Commissioning", section "Configuration of a SATA RAID array", on page 351.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5ACPCI.RAIC-02
Hard disks Seagate Momentus 7200.1 ST96023AS
Amount 1
Formatted capacity (512 bytes/sector) 60 GB
Number of heads 3
Number of sectors (user) 117,210,240
Bytes per sector 512
Revolution speed 7200 rpm ±1%
Access time (average) 4.2 ms
Positioning time (seek, typical values)
Minimum (track to track) 1.5 ms
Average (read access) 10.5 ms
Maximum (read access) 22 ms
Starting time (0 rpm to read access) 4 seconds (typically)
Supported transfer mode SATA 1.0, PIO mode 0-4, multiword DMA mode 0-2, UDMA 0-5
Data transfer rate
On the medium max. 539 MBit/s
To/from host Max. 150 MB/s
Features 5ACPCI.RAIC-02
Cache 8 MB
S.M.A.R.T. Support Yes
Lifespan 5 years
Environmental characteristics
Ambient temperature1)
Operation - standard 2) 5 to 55°C
Operation - 24-hour3) 5 to 40°C
Bearings -40 to 70°C
Technical Data
Transport -40 to 70°C
Section 2
Relative humidity
Operation 5 to 90%, non-condensing
Bearings 5 to 95%, non-condensing
Transport 5 to 95%, non-condensing
Vibration4)
Operation (continuous) No damage at max. 5 - 500 Hz and 0.125 g (1.225 m/s2 0-peak) duration 1 oct/min
Operation (occasional) No damage at max. 5 - 500 Hz and 0.25 g (2.45 m/s2 0-peak) duration 1 oct/min
Bearings No damage at max. 5 - 500 Hz and 5 g (49 m/s2 0-peak) duration 0.5 oct/min
Transport No damage at max. 5 - 500 Hz and 5 g (49 m/s2 0-peak) duration 0.5 oct/min
Shock 4) (pulse with a sine half-wave)
Operation No non-recovered errors at max. 125 g (1226 m/s2 0-peak) and 2 ms duration
Bearings No damage at max. 400 g (3924 m/s2 0-peak) and 2 ms duration
No damage at max. 450 g (4424 m/s2 0-peak) and 1 ms duration
No damage at max. 200 g (1962 m/s2 0-peak) and 0.5 ms duration
Altitude
Operation - 300 to 3048 meters
Bearings - 300 to 12192 meters
1) Temperature values for 305 meter altitude. The temperature specification must be reduced linearly by 1°C every 305 meters. The
temperature increase and decrease can be a maximum of 3°C per minute.
2) Standard operation means 333 POH (power-on hours) per month.
3) 24-hour operation means 732 POH (power-on hours) per month.
4) Operation in areas prone to vibration and shock can affect performance negatively (reduction of transfer rate).
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
Storage 24-hour
50
Transport operation
45
40
35
30
operation
Standard
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
Figure 112: Temperature humidity diagram - SATA RAID hard disk 5ACPCI.RAIC-02
Instructions for exchanging a SATA hard disk can be found in chapter 7 "Maintenance /
Servicing", section "Exchanging a PCI SATA RAID hard disk", on page 785.
The hard disks being used are specified for 24-hour operation (24x7) and also provides an
extended temperature specification (ET).
Features
Technical Data
• 2 SATA hard disk drives (suitable for 24 hour operation)
Section 2
• Only requires 1 PCI slot
• Transfer rates up to 150 MB/s
Information:
The PCI SATA RAID controller can not be used in place of a Universal Power Supply
(UPS). If the operating system is shut down improperly, the next time it is started it
is detected as an error by the RAID 1, and a complete rebuild is executed. This
generally takes at least 50 minutes (configurable) to complete.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5ACPCI.RAIC-03
SATA RAID controller
Type SiI 3512 SATA link
Specifications Serial ATA 1.0
Data transfer rate Max. 1.5 GB/s (150 MB/s)
RAID level Supports RAID 0, 1
BIOS Extension ROM - requirements Approx. 32 KB
Hard disks Fujitsu M120-ESW MHY2160BH-ESW
Amount 2
Formatted capacity (512 bytes/sector) 160 GB
Number of heads 3
Number of sectors (user) 312,581,808
Bytes per sector 512
Revolution speed 5400 rpm ±1%
Access time (average) 5.56 ms
Positioning time (seek, typical values)
Minimum (track to track) 1.5 ms
Average (read access) 12 ms
Maximum (read access) 22 ms
Starting time (0 rpm to read access) 4 seconds (typically)
Supported transfer mode SATA 1.0, PIO mode 0-4, multiword DMA mode 0-2, UDMA 0-5
Data transfer rate
On the medium Max. 84.6 MBit/s
To/from host Max. 150 MB/s
Cache 8 MB
S.M.A.R.T. Support Yes
Lifespan 5 years
Electrical characteristics
Power consumption 0.3 A at 3.3 V (PCI bus)
1 A at 5 V (PCI bus)
Mechanical characteristics
Mounted on PCI insert Fixed
Weight 350 g
Technical Data
Operation (occasional) 5 - 500 Hz: max. 0.25 g; duration 1 octave per minute; no unrecoverable errors
Section 2
Bearings 5 - 500 Hz: max. 5 g; duration 0.5 octaves per minute; no damage
Transport 5 - 500 Hz: max. 5 g; duration 0.5 octaves per minute; no damage
Shock 4) (pulse with a sine half-wave)
Operation Max. 125 g, 2 ms; no unrecoverable errors
Bearings Max. 400 g, 2 ms; no damage
Max. 450 g, 1 ms; no damage
Max. 200 g, 0.5 ms; no damage
Altitude
Operation - 300 to 3048 meters
Bearings - 300 to 12192 meters
1) Temperature values for 305 meter altitude. The temperature specification must be reduced linearly by 1°C every 305 meters. The
temperature increase and decrease can be a maximum of 3°C per minute.
2) 24-hour operation means 732 POH (power-on hours) per month.
3) Operation in areas prone to vibration and shock can affect performance negatively (reduction of transfer rate).
100
95 40
90
Relative Luftfeuchtigkeit [%RH] (nicht kondensierend)
29
85
80
75
70
65
60
55 Lagerung
50 Betrieb
Transport
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
- Temperatur [°C] +
Figure 114: Temperature humidity diagram - SATA RAID hard disk 5ACPCI.RAIC-03
Temperature values for 305 meter altitude. The temperature specification must be reduced
linearly by 1°C every 305 meters. The temperature increase and decrease can be a maximum
of 3°C per minute.
Driver support
Special drivers are necessary for operating the PCI SATA RAID controller. Drivers for Windows
XP Professional, Windows XP Embedded and Windows Embedded Standard 2009 are available
for download on the B&R Homepage in the download area (www.br-automation.com).
The .NET-based SATARaid™ serial ATA RAID management software can also be found on the
B&R homepage.
Information:
Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages.
If one of the two hard disks is physically damaged, when the system is booted the SATA RAID
BIOS displays the following error message for approx. 5 seconds: "RAID1 set is in critical status".
After this time the operating system is automatically started on the functioning hard disk. The
installed SATA Raid™ serial ATA RAID management software does not detect this error status.
After repairing the cause of the error (e.g. replacing the hard disk) the SATARaid™ Serial ATA
RAID management software automatically executes a rebuild (mirroring of the hard disk). This
process takes approximately 50 minutes to complete, regardless of the amount of data and with
the highest possible setting for "Rebuild rate".
A hard disk that becomes faulty during operation is detected by the SATA Raid™ Serial ATA
RAID management software and indicated with an error message.
For PCI cards with BIOS Extension ROM, there is a limited area of 64 KB available in the
Phoenix BIOS. A B&R PCI SATA RAID controller requires a free area of approx. 32 KB. The
remaining area can be used as desired.
If a PCI card requiring BIOS extension ROM is plugged into PCI slot 1 on an AP620 with 5 PCI
slots (see figure 110 "PCI slot numbering on APC620 systems with 5 PCI slots") and the B&R
PCI SATA RAID controller is plugged-in at a different position (e.g. PCI slot 4), then the BIOS
menu item Advanced - PCI/PnP Configuration - PCI Device, Slot #2 must be set from "Option
Technical Data
ROM Scan" to "Disabled" so that this device can be used for booting. The BIOS default setting
Section 2
is to always attempt to load the BIOS Extension ROM from the PCI slot 1. Alternatively, the two
PCI cards can be switched.
This setting does not have to be changed if a PCI card without BIOS extension ROM is plugged-
in.
PCI SATA
RAID controller
Figure 115: PCI slot numbering on APC620 systems with 5 PCI slots
Instructions for configuration of a PCI SATA RAID array using RAID BIOS can be found in
chapter 3 "Commissioning", section "Configuration of a SATA RAID array", on page 351.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5ACPCI.RAIC-04
Hard disks Fujitsu M120-ESW MHY2160BH-ESW
Amount 1
Formatted capacity (512 bytes/sector) 160 GB
Number of heads 3
Number of sectors (user) 312,581,808
Bytes per sector 512
Revolution speed 5400 rpm ±1%
Access time (average) 5.56 ms
Positioning time (seek, typical values)
Minimum (track to track) 1.5 ms
Average (read access) 12 ms
Maximum (read access) 22 ms
Starting time (0 rpm to read access) 4 seconds (typically)
Supported transfer mode SATA 1.0, PIO mode 0-4, multiword DMA mode 0-2, UDMA 0-5
Data transfer rate
On the medium Max. 84.6 MBit/s
To/from host Max. 150 MB/s
Features 5ACPCI.RAIC-04
Cache 8 MB
S.M.A.R.T. Support Yes
Lifespan 5 years
Environmental characteristics
Ambient temperature1)
Operation - Standard / 24-hour2) -15 to 80°C
Bearings -40 to 95°C
Transport -40 to 95°C
Technical Data
Relative humidity
Section 2
Operation 8 to 90% non-condensing (maximum humidity at 29°C)
Bearings 5 to 95% non-condensing (maximum humidity at 40°C)
Transport 5 to 95% non-condensing (maximum humidity at 40°C)
Vibration3)
Operation (continuous) 5 - 500 Hz: max. 0.125 g; duration 1 octave per minute; no unrecoverable errors
Operation (occasional) 5 - 500 Hz: max. 0.25 g; duration 1 octave per minute; no unrecoverable errors
Bearings 5 - 500 Hz: max. 5 g; duration 0.5 octaves per minute; no damage
Transport 5 - 500 Hz: max. 5 g; duration 0.5 octaves per minute; no damage
Shock 4) (pulse with a sine half-wave)
Operation Max. 125 g, 2 ms; no unrecoverable errors
Bearings Max. 400 g, 2 ms; no damage
Max. 450 g, 1 ms; no damage
Max. 200 g, 0.5 ms; no damage
Altitude
Operation - 300 to 3048 meters
Bearings - 300 to 12192 meters
1) Temperature values for 305 meter altitude. The temperature specification must be reduced linearly by 1°C every 305 meters. The
temperature increase and decrease can be a maximum of 3°C per minute.
2) 24-hour operation means 732 POH (power-on hours) per month.
3) Operation in areas prone to vibration and shock can affect performance negatively (reduction of transfer rate).
100
95 40
90
Relative Luftfeuchtigkeit [%RH] (nicht kondensierend)
29
85
80
75
70
65
60
55 Lagerung
50 Betrieb
Transport
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
- Temperatur [°C] +
Figure 117: Temperature humidity diagram - SATA RAID hard disk 5ACPCI.RAIC-04
Instructions for exchanging a SATA hard disk can be found in chapter 7 "Maintenance /
Servicing", section "Exchanging a PCI SATA RAID hard disk", on page 785.
The hard disks that are used are specified for 24-hour operation (24x7).
Features
Technical Data
Section 2
• Only requires 1 PCI slot
• Transfer rates up to 150 MB/s
Information:
The PCI SATA RAID controller can not be used in place of a Universal Power Supply
(UPS). If the operating system is shut down improperly, the next time it is started it
is detected as an error by the RAID 1, and a complete rebuild is executed. This
generally takes at least 120 minutes (configurable) to complete.
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5ACPCI.RAIC-05
SATA RAID controller
Type SiI 3512 SATA link
Specifications Serial ATA 1.0
Data transfer rate Max. 1.5 GB/s (150 MB/s)
RAID level Supports RAID 0, 1
BIOS Extension ROM - requirements Approx. 32 KB
Hard disks Seagate ST9250315AS
Amount 2
Formatted capacity (512 bytes/sector) 250 GB
Number of heads 1
Number of sectors (user) 488,397,168
Bytes per sector 512
Revolution speed 5400 rpm ±0.2%
Access time (average) 5.56 ms
Positioning time (seek, typical values)
Minimum (track to track) 1 ms
Average (read access) 14 ms
Maximum (read access) 30 ms
Starting time (0 rpm to read access) 3.6 seconds (typically)
Supported transfer modes SATA 1.0, Serial ATA Revision 2.6
PIO mode 0-4, multiword DMA mode 0-2, UDMA mode 0-6
Data transfer rate
On the medium Max. 1175 Mbits/s
To/from host Max. 150 MB/s
Cache 8 MB
S.M.A.R.T. Support Yes
Electrical characteristics
Power consumption 0.3 A at 3.3 V (PCI bus)
1 A at 5 V (PCI bus)
Mechanical characteristics
Mounted on PCI insert Fixed
Weight 350 g
Technical Data
Operation (occasional) 5 - 500 Hz: max. 0.25 g; duration 1 octave per minute; no unrecoverable errors
Section 2
Storage 5 - 500 Hz: max. 5 g; duration 0.5 octaves per minute; no damage
Transport 5 - 500 Hz: max. 5 g; duration 0.5 octaves per minute; no damage
Shock4) (pulse with a sine half-wave)
Operation Max. 125 g, 2 ms; no unrecoverable errors
Storage Max. 400 g, 2 ms; no damage
Max. 500 g, 1 ms; no damage
Max. 300 g, 0.5 ms; no damage
Altitude
Operation - 300 to 3048 m
Storage - 300 to 12,192 m
1) Temperature values for 305 meter altitude. The temperature specification must be reduced linearly by 1°C every 305 meters. The
temperature increase and decrease can be a maximum of 20°C per hour.
2) 24-hour operation means 732 POH (power-on hours) per month.
3) Humidity gradient: Maximum 30% per hour.
4) Operation in areas prone to vibration and shock can affect performance negatively (reduction of transfer rate).
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
50 Storage
Operation
45 Transport
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
Figure 119: Temperature humidity diagram - SATA RAID Hard Disk - 5ACPCI.RAIC-05
Temperature values for 305 meter altitude. The temperature specification must be reduced
linearly by 1°C every 305 meters. The temperature increase and decrease can be a maximum
of 20°C per hour.
Driver support
Special drivers are necessary for operating the PCI SATA RAID controller. Drivers for Windows
XP Professional and Windows XP Embedded are available for download on the B&R Homepage
in the download area (www.br-automation.com).
The .NET-based SATARaid™ serial ATA RAID management software can also be found on the
B&R homepage.
Information:
Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages.
Configuration
Exchanging a HDD
A hard drive can be easily exchanged in the event of an error when using the RAID1 (mirroring)
configuration without having to re-install the system. The replacement SATA HDD 250GB
5MMHDD.0250-00 is available as a replacement part for a HDD.
For instructions on exchanging the drive, see Chapter 7 "Maintenance / Servicing", section
"Mounting the side cover", on page 781.
Technical Data
Section 2
Figure 120: Replacement SATA HDD 250 GB - 5MMHDD.0250-00
Technical data
Information:
The following characteristics, features, and limit values only apply to this individual
component and can deviate from those specified for the entire device. For the entire
device in which this individual component is used, refer to the data given
specifically for the entire device.
Features 5MMHDD.0250-00
Hard disks Seagate ST9250315AS
Amount 1
Formatted capacity (512 bytes/sector) 250 GB
Number of heads 1
Number of sectors (user) 488,397,168
Bytes per sector 512
Revolution speed 5400 rpm ±0.2%
Access time (average) 5.56 ms
Positioning time (seek, typical values)
Minimum (track to track) 1 ms
Average (read access) 14 ms
Maximum (read access) 30 ms
Starting time (0 rpm to read access) 3.6 seconds (typically)
Supported transfer modes SATA 1.0, Serial ATA Revision 2.6
PIO mode 0-4, multiword DMA mode 0-2, UDMA mode 0-6
Interface SATA
Features 5MMHDD.0250-00
Data transfer rate
On the medium Max. 1175 Mbits/s
To/from host Max. 150 MB/s (SATA I), max. 300 MB/s (SATA II)
Cache 8 MB
S.M.A.R.T. Support Yes
MTBF 550,000 Power On Hours1)
Environmental characteristics
Ambient temperature2)
Operation - Standard / 24-hour3) 0 to 60°C
Storage -40 to 70°C
Transport -40 to 70°C
Relative humidity4)
Operation 5 to 95%, non-condensing
Storage 5 to 95%, non-condensing
Transport 5 to 95%, non-condensing
Vibration
Operation 0.5 g at 5 - 500 Hz, no non-recovered errors
Storage 5 g at 5 - 500 Hz, no non-recovered errors
Shock (pulse with a sine half-wave)
Operation 350 g and 2 ms duration, no non-recovered errors
Storage 800 g and 2 ms duration, no non-recovered errors
1000 g and 1 ms duration, no non-recovered errors
600 g and 0.5 ms duration, no non-recovered errors
Altitude
Operation - 300 to 3048 m
Storage - 300 to 12,192 m
1) With 8760 POH (Power On Hours) per year and 25°C surface temperature.
2) Temperature values for 305 meter altitude. The temperature specification must be reduced linearly by 1°C every 305 meters. The
temperature increase and decrease can be a maximum of 20°C per hour.
3) 24-hour operation means 732 POH (power-on hours) per month.
4) Humidity gradient: Maximum 30% per hour.
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
Technical Data
50 Storage
Operation
Section 2
45 Transport
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
Figure 121: Temperature humidity diagram - SATA RAID hard disk - 5MMHDD.0250-00
Temperature values for 305 meter altitude. The temperature specification must be reduced
linearly by 1°C every 305 meters. The temperature increase and decrease can be a maximum
of 20°C per hour.
Information:
It is possible to add or remove an add-on interface at any time.
Caution!
Turn off power before adding or removing an add-on interface.
The add-on CAN interface is equipped with a Bosch CC770 CAN controller (compatible with an
Intel 82527 CAN controller), which conforms to CAN specifications 2.0 part A/B. The CAN
controller can trigger an NMI (non-maskable interrupt).
Technical data
Features 5AC600.CANI-00
CAN interface
Controller Bosch CC770 (compatible with Intel 82527 CAN controller)
Amount 1
Connection 9-pin DSUB, male
Terminating resistor Can be activated and deactivated using a sliding switch
Default setting Disabled
Pin assignments
Add-on CAN
Type Electrically isolated
Transfer rate Max. 500 kBit/s
Bus length Max. 1000 Meter
Pin Assignment
1 n.c. 9-pin DSUB connector
Technical Data
2 CAN low 1 5
Section 2
3 GND
4 n.c.
6 9
5 n.c.
6 Reserved
7 CAN high
8 n.c.
9 n.c.
The setting for the IRQ can be changed in the BIOS setup (under "Advanced" - submenu
"Baseboard/Panel Features" - submenu "Legacy Devices", setting "CAN"). Please note any
potential conflicts with other resources when changing this setting.
The type of cable used depends largely on the required bus length and the number of nodes.
The bus length is mainly determined by the bit rate. In accordance with CiA (CAN in Automation)
the maximum bus length is 1000 meters.
The following bus lengths are permitted with a maximum oscillator tolerance of 0.121%:
The material used for the cable should preferably have all or most of the following properties in
order to reach an optimal transfer rate.
Terminating resistor
CAN networks are cabled using a bus structure where both ends of the bus are equipped with
terminating resistors. The add-on CAN interface has an integrated terminating resistor (delivery
state: disabled with the setting "Off").
Technical Data
Section 2
On
Off
Contents of delivery
The screws included in the mounting kit are to be used for installation.
1x 2x
Pin assignments
Add-on RS232/422/485
Features RS232 RS422/485
Type RS232 not modem compatible;
Electrically isolated
UART 16550 compatible, 16 byte FIFO
Transfer rate Max. 115 kBit/s
Bus length Max. 15 meters Max. 1200 meters
Pin Assignments Assignments 9-pin DSUB connector
(RS232) (RS422)
1 5
1 n.c. TXD/
2 RXD n.c.
3 TXD n.c. 6 9
4 n.c. TXD
5 GND GND
6 n.c. RXD/
7 RTS n.c.
8 CTS n.c.
9 n.c. RXD
The setting for the I/O address and the IRQ can be changed in the BIOS setup (under
"Advanced" - submenu "Main board/Panel Features" - submenu "Legacy Devices", setting
"COM E"). Please note any potential conflicts with other resources when changing this setting.
The maximum transfer rate of 115 kBit/s depends on the cable type being used.
Technical Data
Section 2
≤ 10 Typ. 115
≤5 Typ. 115
The material used for the cable should preferably have all or most of the following properties in
order to reach an optimal transfer rate.
The maximum transfer rate of 115 kBit/s depends on the cable type being used.
The material used for the cable should preferably have all or most of the following properties in
order to reach an optimal transfer rate.
The pins of the RS422 default interface (1,4,6 and 9) should be used for operation. The pins
should be connected as shown.
9
RXD
DATA
4
TXD
6
RXD
DATA
1
TXD
The RTS line must be switched each time the driver is sent and received; there is no automatic
switch back. This cannot be configured in Windows.
The voltage drop caused by long line lengths can lead to greater potential differences between
the bus stations, which can hinder communication. This can be improved by running ground wire
with the others.
The line ends of the RS485 interface should (at least for longer line lengths or larger transfer
rates) be closed. Normally a passive terminator can be used on the bus ends by connecting each
of the signal lines with 120 Ω resistance.
The maximum transfer rate of 115 kBit/s depends on the cable type being used.
The material used for the cable should preferably have all or most of the following properties in
order to reach an optimal transfer rate.
Technical Data
Cable cross section 4 x 0.25 mm² (24AWG/19), tinned Cu wire
Section 2
Wire insulation PE
Conductor resistance ≤ 82 Ω / km
Stranding Wires stranded in pairs
Shield Paired shield with aluminum foil
Grounding line
Cable cross section 1 x 0.34 mm² (22AWG/19), tinned Cu wire
Wire insulation PE
Conductor resistance ≤ 59 Ω / km
Outer sheathing
Item PUR mixture
Characteristics Halogen free
Entire shielding From tinned cu wires
Contents of delivery
The screws included in the mounting kit are to be used for installation.
1x 2x
Information:
Fans are necessary when using components which must work within certain
temperature limits, e.g. hard disks, DVD combos, PCI cards, etc.
The fan and dust filter are subject to wear and must be checked with appropriate
frequency and cleaned or replaced when not functioning properly (e.g. due to dirt
and grime).
This fan kit is an optional addition for system units with 1 PCI slots. For available replacement
dust filters for this fan kit, see section "Replacement fan", on page 737.
Fans ø 40 mm
Fastening screws
Dust filter
Technical data
Features 5PC600.FA01-00
Fan type Double ball bearings
Width 40 mm
Length 40 mm
Height 20 mm
Revolution speed 5600 rpm ±10%
Noise level 24 dB
Lifespan 80,000 hours at 30°C
Features 5PC600.FA01-00
Maintenance interval The fans are subject to wear. Depending on the work environment, the dust filter should be checked
with appropriate frequency to determine whether the air flow provides sufficient cooling. An exchange
or cleaning of the filter kit is appropriate at that time.
Contents of delivery
Amount Component
Technical Data
3 Fans with 40 mm diameter
Section 2
1 Dust filter
6 Mounting screws
Installation
For a description of how to install the fan kit, see chapter 7 "Maintenance / Servicing", section 3
"Fan kit installation and replacement", starting on page 747.
This fan kit is an optional addition for system units with 2 PCI slots. For available replacement
dust filters for this fan kit, see section "Replacement fan", on page 737.
Fans ø 60 mm
Fastening screws
Filter clasp
Dust filter
Technical data
Features 5PC600.FA02-00
Fan type Double ball bearings
Width 60 mm
Length 60 mm
Height 20 mm
Revolution speed 3600 rpm ±10%
Noise level 30.5 dB
Lifespan 80,000 hours at 30°C
Maintenance interval The fans are subject to wear. Depending on the work environment, the dust filter should be checked
with appropriate frequency to determine whether the air flow provides sufficient cooling. An exchange
or cleaning of the filter kit is appropriate at that time.
Contents of delivery
Amount Component
2 Fans with 60 mm diameter
1 Dust filter
1 Filter clasp
4 Mounting screws
Installation
For a description of how to install the fan kit, see chapter 7 "Maintenance / Servicing", section 3
"Fan kit installation and replacement", starting on page 750.
This fan kit is an optional addition for system units with 3 PCI slots. For available replacement
dust filters for this fan kit, see section "Replacement fan", on page 737.
Fans ø 80mm
Technical Data
Filter clasp
Section 2
Fastening screws
Dust filter
Technical data
Features 5PC600.FA03-00
Fan type Double ball bearings
Amount 2
Width 80 mm
Length 80 mm
Height 20 mm
Revolution speed 2600 rpm ±10%
Noise level 27 dB
Lifespan 80,000 hours at 30°C
Maintenance interval The fans are subject to wear. Depending on the work environment, the dust filter should be checked
with appropriate frequency to determine whether the air flow provides sufficient cooling. An exchange
or cleaning of the filter kit is appropriate at that time.
Contents of delivery
Amount Component
2 Fans with 80 mm diameter
1 Dust filter
1 Filter clasp
4 Mounting screws
Amount Component
2 Cable fastener
Installation
For a description of how to install the fan kit, see chapter 7 "Maintenance / Servicing", section 3
"Fan kit installation and replacement", starting on page 753.
This fan kit is an optional addition for system units with 5 PCI slots. For available replacement
dust filters for this fan kit, see section "Replacement fan", on page 737.
Fan ø 60 mm Fans ø 80 mm
Filter clasp
Cable clamp
Fastening screws
Dust filter
Technical data
Features 5PC600.FA05-00
Fan type Double ball bearings Double ball bearings
Amount 1 2
Width 60 mm 80 mm
Length 60 mm 80 mm
Height 20 mm 20 mm
Revolution speed 3600 rpm ±10% 2600 rpm ±10%
Noise level 30.5 dB 27 dB
Lifespan 80,000 hours at 30°C
Maintenance interval The fans are subject to wear. Depending on the work environment, the dust filter should be checked
with appropriate frequency to determine whether the air flow provides sufficient cooling. An exchange
or cleaning of the filter kit is appropriate at that time.
Contents of delivery
Amount Component
1 Fans with 60 mm diameter
2 Fans with 80 mm diameter
1 Dust filter
1 Filter clasp
4 Mounting screws
Technical Data
2 Cable fastener
Section 2
Table 133: Contents of delivery - 5PC600.FA05-00
Installation
For a description of how to install the fan kit, see chapter 7 "Maintenance / Servicing", section 3
"Fan kit installation and replacement", starting on page 757.
For the APC620 system units 5PC600.SX02-00, 5PC600.SF03-00 and 5PC600.SX05-00 and
an 855GME CPU board, a second graphics line can be created using the AP Link graphics
adapter cards.
The following video signals are available via AP Link and monitor/panel output. The plugs are
specified for 100 connection cycles.
Caution!
The RGB, DVI and SDL cables can only be plugged in and unplugged when the
APC620 and display device (Automation Panel 900, Automation Panel 800, monitor)
are turned off.
Pin assignments
Technical Data
Section 2
1 T.M.D.S. Data 2- 16 Hot Plug detect
2 T.M.D.S. Data 2+ 17 T.M.D.S. Data 0-
3 T.M.D.S. Data 2/SDL Shield 18 T.M.D.S. Data 0+
4 SDL- 19 T.M.D.S. DATA 0/XUSB1
Shield
5 SDL+ 20 XUSB1-
6 DDC clock 21 XUSB1+
DVI-I 24 pin, female
7 DDC data 22 T.M.D.S. Clock Shield
8 n.c. 23 T.M.D.S. Clock + 1 2 3 4 5 6 7 8
c1 c2
9 10 11 12 13 14 15 16
9 T.M.D.S. DATA 1- 24 T.M.D.S. Clock - 17 18 19 20 21 22 23 24 c3 c4
c5
10 T.M.D.S. DATA 1+ c1 n.c.
11 T.M.D.S. DATA 1/XUBS0 c2 n.c.
Shield
12 XUSB0- c3 n.c.
13 XUSB0+ c4 n.c.
14 + 5 V power 1) c5 n.c.
15 Ground (return for + 5V,
HSync and VSync)
The following table shows the relationship between segment lengths and the maximum
resolution according to the SDL cable used:
Cables Resolution
VGA SVGA XGA SXGA UXGA
Segment length [m] 640 x 480 800 x 600 1024 x 768 1280 x 1024 1600 x 1200
5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00
1.8 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01
5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03
5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00
5 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01
5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03
5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-001)
10 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-011)
5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-031)
5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-001) -
15 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-011) -
5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-031) -
5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) -
20
5CASDL.0200-301) 5CASDL.0200-301) 5CASDL.0200-301) 5CASDL.0200-301) -
5CASDL.0250-001) 5CASDL.0250-001) 5CASDL.0250-001) - -
25
5CASDL.0250-301) 5CASDL.0250-301) 5CASDL.0250-301) - -
5CASDL.0300-001) 5CASDL.0300-001) 5CASDL.0300-102) 5CASDL.0300-102) -
30
5CASDL.0300-031) 5CASDL.0300-031) 5CASDL.0300-132) 5CASDL.0300-132)
5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) -
40
5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) -
1) See table 138 "Requirements for SDL cable with automatic cable adjustment (equalizer)", on page 290
2) See table 139 "Requirements for SDL cable with extender and automatic cable adjustment (equalizer)", on page 291
The cable types and resolutions shown with a footnote 1) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 138: Requirements for SDL cable with automatic cable adjustment (equalizer)
The cable types and resolutions shown with a footnote 2) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Technical Data
Hardware Name Revision Note
Section 2
5DLSDL.1000-00 AP Link SDL receiver Rev. D0
5DLSDL.1000-01 AP Link SDL transceiver Rev. D0
5AC600.SDL0-00 AP Link SDL transmitter Rev. B3
5PC600.SX02-00 System 2 PCI, 1 disk drive slot, 1 AP Link slot Rev. D0
5PC600.SF03-00 System 3 PCI, 1 disk drive slot, 1 AP Link slot Rev. A0
5PC600.SX05-00 System 5 PCI, 2 disk drive slots, 1 AP Link slot Rev. C0
Table 139: Requirements for SDL cable with extender and automatic cable adjustment (equalizer)
DVI means:
• Connection of B&R Automation Panel 900 display units with Automation Panel Link DVI
Receiver (Model nr. 5DLDVI.1000-01), Office Digital/DVI Monitors and Office DVI TFT
Displays is possible.
For examples and possibilities for connecting Automation Panel 900 display units via DVI, see
Appendix A, chapter 3 "Commissioning", section 4 "Connection examples", starting on page 308.
• Connection of B&R Automation Panel 900 display units with Automation Panel Link SDL
receiver (Model nr. 5DLSDL.1000-01) or SDL transceiver (Model nr. 5DLSDL.1000-01).
For examples and possibilities for connecting Automation Panel 900 and Automation Panel 800
display units via SDL, see Appendix A, chapter 3 "Commissioning", section 4 "Connection
examples", starting on page 308.
Chapter 3 • Commissioning
1. Installation
The APC620 systems are mounted with the mounting plates found on the housing. The plates
are designed for M5 screws.
Commissioning
Section 3
9
ø 11
The exact positioning of the mounting holes can be seen in the following drilling templates.
• The environmental conditions must be taken into consideration (see chapter 2 "Technical
Data", section 2.6 "Ambient temperatures for systems with an 815E CPU board (ETX)",
on page 89, and section 2.7 "Ambient temperatures for systems with an 855GME CPU
board (ETX / XTX)", on page 93).
• The APC620 is only for operation in closed rooms.
• The APC620 cannot be situated in direct sunlight.
• The ventilation holes cannot be covered.
• When mounting the device, be sure to adhere to the allowable mounting orientations (see
section 1.3 "Mounting orientation", on page 297).
• Be sure the wall or switching cabinet can withstand four times the total weight of the the
PC620.
• When connecting certain cable types (DVI, SDL, USB, etc.), keep the flex radius in mind.
(see section 2 "Cable connections", on page 306).
270 270
262 262
18 18
0 0
410 270
402 262
Commissioning
Section 3
18
18
APC620 embedded
210
201.8
18
0 11.5 46.5 58
The Automation PC620 system must be mounted as described in the following sections.
APC620 systems with and without fan kit can be mounted this way.
0° 0°
Commissioning
0°
Section 3
0°
In order to guarantee natural air circulation, mount the system so that the spacing on the top,
bottom, and sides is as follows.
at least
air out
100 mm
at least at least
50 mm 50 mm
at least
100 mm air in
Caution!
A fan kit must be used if the system is mounted in the following orientations. In
addition, it is important to be sure that the components used are installed in a way
that complies with the specifications of the drives being used (CD-ROM, DVD/CD-
RW, hard disk, etc.). See the following pages for information regarding the
specifications for mounting orientation.
90° 90°
Commissioning
Section 3
90°
90°
In order to guarantee natural air circulation, mount the system so that the spacing on the top,
bottom, and sides is as follows.
at least
50 mm
at least at least
100 mm 100 mm
at least
50 mm
No limitation on mounting orientation. Permissible mounting orientations are shown in figure 138
"Mounting orientation - Optional", on page 299.
The following figure shows the possible mounting orientations for an APC620 device with an
add-on (5AC600.HDDI-00 or 5AC600.HDDI-01) or slide-in hard disk (5AC600.HDDS-00 or
5AC600.HDDS-02).
Standard mounting
vertical 1
0° 0°
Commissioning
Section 3
1) 1)
horizontal 1 0° horizontal 2 0° 0°
0°
Figure 140: Mounting orientations for an APC620 with hard disk drive
The mounting orientations "horizontal 1" and "horizontal 2" require the use of a fan kit.
The following figure shows the possible mounting orientations for an APC620 device with a slide-
in CD-ROM drive (5AC600.CDXS-00).
1)
vertical 1
30° 5°
1)
horizontal 1 30° 30°
Figure 141: Mounting orientations for an APC 620 with a slide-in CD-ROM drive
The mounting orientation "horizontal 1" requires the use of a fan kit.
Mounting orientation "vertical 1" can also be used at 0° without a fan kit.
The following figure shows the possible mounting orientations for an APC620 device with a slide-
in DVD-ROM/CD-RW drive 5AC600.DVDS-00).
1)
vertcal 1
30° 0°
Commissioning
Section 3
horizontal 11) 30° 30°
Figure 142: Mounting orientations for an APC620 with a slide-in DVD-ROM/CD-RW drive
The mounting orientation "horizontal 1" requires the use of a fan kit.
Mounting orientation "vertical 1" can also be used at 0° without a fan kit.
Slide-in DVD-R/RW/DVD+R/RW
The following figure shows the possible mounting orientations for an APC620 device with a slide-
in DVD-R/RW / DVD+R/RW drive (5AC600.DVRS-00).
1)
vertcal 1
30° 0°
Figure 143: Mounting orientations for an APC620 with a slide-in DVD-R/RW / DVD+R/RW drive
The mounting orientation "horizontal 1" requires the use of a fan kit.
Mounting orientation "vertical 1" can also be used at 0° without a fan kit.
The following figure shows the possible mounting orientations for an APC620 device with a slide-
in USB FDD drive (5AC600.FDDS-00).
1)
vertical 1
90° 0°
Commissioning
Section 3
1) Only allowed when a fan kit is used.
Figure 144: Mounting orientations for an APC620 with a slide-in USB FDD drive
Mounting orientation "vertical 1" can also be used at 0° without a fan kit.
2. Cable connections
When making cable connections and installing cables, it is not permitted to have a flex radius
smaller than the minimum value specified.
Fle
xr
ad
ius
Information:
The value specified for the minimum flex radius can be found in the technical data
for the cable that is being used.
For error free data transfer, take note of the cable length information in section "Ethernet
connection ETH1", on page 130.
3. Grounding concept
Functional ground is a current path of low impedance between electrical circuits and ground. It
is used, for example, to improve immunity to disturbances and not necessarily as a protective
measure. It therefore serves only to deflect disturbances, not to provide any kind of protection
against electric shock.
• Supply voltage
• Ground connection
To guarantee safe conductance of electric disturbances, the following points must be observed:
• The device must be connected to the central grounding point in the control cabinet using
the shortest route possible.
• A cable with a minimum cross section of 2.5 mm² per connection should be used. If a
cable with wire end sleeves is connected to the 0TB103.9 or 0TB103.91 terminal block,
Commissioning
then a cable with maximum 1.5 mm² per connection is possible.
Section 3
• Note the line shielding concept. All data cables connected to the device must be shielded.
Symbol indicating functional ground on the B&R device:
Ground connection
min. 2.5mm²
Switching cabinet
Supply voltage
Grounding strip
min. 1.5mm²
4. Connection examples
The following examples provide an overview of the configuration options for connecting
Automation Panel 800 and Automation Panel 900 and/or Automation Panel 800 devices with the
APC620. The following questions will be answered:
• How are Automation Panel 900 devices connected to the monitor / panel output of the
APC620, and what needs to be considered?
• How are Automation Panel 800 devices connected to the monitor / panel output of the
APC620, and what needs to be considered?
• How are Automation Panel 900 devices connected simultaneously to the Monitor / Panel
output on the optional SDL AP Link of the APC620 and what needs to be considered?
• What are "Display Clone" and "Extended Desktop" modes?
• How many Automation Panel 900 devices can be connected per line?
• How many Automation Panel 900 devices can be connected to an Automation Panel 800
device per line?
• How are the connected devices internally numbered?
• Are there limitations to the segment length and if so, what are they?
• What cables and link modules are needed?
• Do BIOS settings have to be changed for a specific configuration?
Information:
An RGB monitor / flat-screen can always be connected to the monitor / panel output
of the APC620 (necessary DVI to CRT adapter can be ordered under the model
number 5AC900.1000-00).
If an Automation Panel 800 and an Automation Panel 900 should be connected on the same line,
the devices must have the same display type.
The following table lists the AP900 devices that can be connected on the same line with an
AP800 device.
Commissioning
Section 3
An Automation Panel 900 with max. SXGA resolution is connected to the integrated DVI
interface (onboard). As an alternative, an office TFT with DVI interface or an analog monitor
(using adapter with model no. 5AC900.1000-00) can also be operated. A separate cable is used
for touch screen and USB. If USB devices are to be operated on the Automation Panel 900, the
maximum distance is 5 meters. USB devices can only be connected directly to the Automation
Panel (without a hub).
Monitor / Panel
connection DVI cable
USB cable
RS232 cable
USB up to
✓ 5m OK
Link: 5DLDVI.1000-01
Automation PC 620
Figure 147: Configuration - One Automation Panel 900 via DVI (onboard)
The following table shows the possible combinations for the APC620 system unit with CPU
board to implement the configuration shown in the figure above. If the maximum resolution is
limited when making the combination then it is also shown in this table (e.g. for connecting a non-
B&R Automation Panel 900 device).
5PC600.E855-00
✓ ✓ ✓ ✓ ✓ ✓ Max. SXGA
5PC600.X855-00
5PC600.E855-01
✓ ✓ ✓ ✓ ✓ ✓ Max. SXGA
5PC600.X855-01
5PC600.E855-02
✓ ✓ ✓ ✓ ✓ ✓ Max. SXGA
5PC600.X855-02
5PC600.E855-03
✓ ✓ ✓ ✓ ✓ ✓ Max. SXGA
5PC600.X855-03
5PC600.E855-04
✓ ✓ ✓ ✓ ✓ ✓ Max. SXGA
5PC600.X855-04
5PC600.E855-05
✓ ✓ ✓ ✓ ✓ ✓ Max. SXGA
5PC600.X855-05
Table 145: Link module for the configuration - One Automation Panel 900 via DVI
4.2.3 Cables
Commissioning
9A0014.05 Touch screen cable - serial 5m
Section 3
9A0014.10 Touch screen cable - serial 10 m1)
5CAUSB.0018-00 USB cable 1.8 m
5CAUSB.0050-00 USB cable 5m
1) USB support is not possible on the Automation Panel 900 because USB is limited to 5 m.
The following Automation Panel 900 units can be used. In rare cases, the segment length is
limited according to the resolution.
Model number Diagonal Resolution Touch screen Keys Max. segment length
5AP920.1043-01 10.4“ VGA ✓ - 5 m / 10 m1)
5AP920.1214-01 12.1“ SVGA ✓ - 5 m / 10 m1)
5AP920.1505-01 15.0“ XGA ✓ - 5 m / 10 m1)
5AP920.1706-01 17.0“ SXGA ✓ - 5 m / 10 m1)
5AP920.1906-01 19.0“ SXGA ✓ - 5 m / 10 m1)
Table 147: Possible Automation Panel units, resolutions und segment lengths
1) USB support is not possible on the Automation Panel 900 because USB is limited to 5 m.
Information:
The DVI transfer mode does not allow reading statistical values on Automation
Panel 900 units.
An Automation Panel 900 is connected to the integrated SDL interface (onboard) via an SDL
cable. USB devices can only be connected directly to the Automation Panel (without a hub).
Monitor / Panel
connection
0
SDL segment length
max. 40 meters
✓ USB OK
Link: 5DLSDL.1000-00
Automation PC 620
Graphics Engine 2
x Internal APC620 panel number independent of segment length
Commissioning
Figure 148: Configuration - An Automation Panel 900 via SDL (onboard)
Section 3
4.3.1 Basic system requirements
The following table shows the possible combinations for the APC620 system unit with CPU
board to implement the configuration shown in the figure above. If the maximum resolution is
limited when making the combination then it is also shown in this table (e.g. for connecting a non-
B&R Automation Panel 900 device).
5PC600.E855-00
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-00
5PC600.E855-01
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-01
5PC600.E855-02
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-02
5PC600.E855-03
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-03
5PC600.E855-04
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-04
5PC600.E855-05
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-05
Table 149: Link module for the configuration - One Automation Panel 900 via SDL
4.3.3 Cables
The following table shows the relationship between segment lengths and the maximum
resolution according to the SDL cable used:
Cables Resolution
VGA SVGA XGA SXGA UXGA
Segment length [m] 640 x 480 800 x 600 1024 x 768 1280 x 1024 1600 x 1200
5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00
1.8 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01
5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03
5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00
5 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01
5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03
5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-001)
10 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-011)
5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-031)
5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-001) -
15 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-011) -
Commissioning
5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-031) -
Section 3
5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) -
20
5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031) -
5CASDL.0250-001) 5CASDL.0250-001) 5CASDL.0250-001) - -
25
5CASDL.0250-031) 5CASDL.0250-031) 5CASDL.0250-031) - -
5CASDL.0300-001) 5CASDL.0300-001) 5CASDL.0300-102) 5CASDL.0300-102) -
30
5CASDL.0300-031) 5CASDL.0300-031) 5CASDL.0300-132) 5CASDL.0300-132) -
5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) -
40
5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) -
1) See table 152 "Requirements for SDL cable with automatic cable adjustment (equalizer)", on page 315
2) See table 153 "Requirements for SDL cable with extender and automatic cable adjustment (equalizer)", on page 316
The cable types and resolutions shown with a footnote 1) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 152: Requirements for SDL cable with automatic cable adjustment (equalizer)
The cable types and resolutions shown with a footnote 2) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 153: Requirements for SDL cable with extender and automatic cable adjustment (equalizer)
To operate Automation Panel 900 panels with a touch screen (Extended Desktop or Dual
Display Clone), the serial interfaces COM C and COM D must be activated in BIOS (BIOS default
setting = disabled).
For more information on this, see chapter 4 "Software", section 5 "Automation PC 620 with
Windows XP Professional", on page 568.
For more information on this, see chapter 4 "Software", section 5 "Automation PC 620 with
Windows XP Professional", on page 568.
An Automation Panel 800 is connected to the integrated SDL interface (onboard) via an SDL
cable. USB devices can only be connected directly to the extension keyboard (without a hub).
Monitor / panel
connection 1 3
0
SDL segment 1
max. 40 meters
2 ✓ USB OK
Graphics Engine 2
x Internal APC620 panel number ✓ Independent of segment length
Commissioning
Figure 149: Configuration - An Automation Panel 800 via SDL (onboard)
Section 3
4.4.1 Basic system requirements
The following table shows the possible combinations for the APC620 system unit with CPU
board to implement the configuration shown in the figure above. If the maximum resolution is
limited when making the combination then it is also shown in this table.
5PC600.E855-00
✓ ✓ ✓ ✓ ✓ ✓ max. XGA
5PC600.X855-00
5PC600.E855-01
✓ ✓ ✓ ✓ ✓ ✓ max. XGA
5PC600.X855-01
5PC600.E855-02
✓ ✓ ✓ ✓ ✓ ✓ max. XGA
5PC600.X855-02
5PC600.E855-03
✓ ✓ ✓ ✓ ✓ ✓ max. XGA
5PC600.X855-03
5PC600.E855-04
✓ ✓ ✓ ✓ ✓ ✓ max. XGA
5PC600.X855-04
5PC600.E855-05
✓ ✓ ✓ ✓ ✓ ✓ max. XGA
5PC600.X855-05
4.4.2 Cables
The following table shows the relationship between segment lengths and the maximum
resolution according to the SDL cable used:
Cables Resolution
XGA
Segment length [m] 1024 x 768
1.8 5CASDL.0018-20
5 5CASDL.0050-20
10 5CASDL.0100-20
15 5CASDL.0150-20
20 5CASDL.0200-201)
25 5CASDL.0250-201)
30 5CASDL.0300-302)
40 5CASDL.0400-302)
1) See table 157 "Requirements for SDL cable with automatic cable adjustment (equalizer)"
2) See table 158 "Requirements for SDL cable with extender and automatic cable adjustment (equalizer)"
The cable types and resolutions shown with a footnote 1) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 157: Requirements for SDL cable with automatic cable adjustment (equalizer)
The cable types and resolutions shown with a footnote 2) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Commissioning
available in the download area of the B&R
Section 3
homepage.
Hardware Name Revision Note
5PC600.SX01-00 System 1 PCI Rev. E0 -
5PC600.SX02-00 System 2 PCI, 1 disk drive slot, 1 AP Link slot Rev. D0 -
5PC600.SX02-01 System 2 PCI, 1 disk drive slot Rev. E0 -
5PC600.SF03-00 System 3 PCI, 1 disk drive slot, 1 AP Link slot Rev. A0
5PC600.SX05-00 System 5 PCI, 2 disk drive slots, 1 AP Link slot Rev. C0 -
5PC600.SX05-01 System 5 PCI, 2 disk drive slots Rev. C0 -
Table 158: Requirements for SDL cable with extender and automatic cable adjustment (equalizer)
For more information on this, see chapter 4 "Software", section 5 "Automation PC 620 with
Windows XP Professional", on page 568.
For more information on this, see chapter 4 "Software", section 5 "Automation PC 620 with
Windows XP Professional", on page 568.
An Automation Panel 900 and an Automation Panel 800 are connected to the integrated SDL
interface (onboard) via SDL.
Monitor / panel
connection
SDL segment 1 0 SDL segment 2 2 1 4
max. 40 m max. 40 m
✓ USB OK
3 USB
Link: 5DLSDL.1000-01 ✓
possible
Graphics Engine 2
x Internal APC620 panel number ✓ Independent of segment length ✓ Depends on segment length
Figure 150: Configuration - One AP900 and an AP800 via SDL (onboard)
The following table shows the possible combinations for the APC620 system unit with CPU
board to implement the configuration shown in the figure above. If the maximum resolution is
limited when making the combination then it is also shown in this table.
5PC600.E855-00
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-00
5PC600.E855-01
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-01
5PC600.E855-02
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-02
5PC600.E855-03
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-03
5PC600.E855-04
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-04
5PC600.E855-05
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-05
4.5.2 Cables
How to select an SDL cable for connecting the AP900 display to the AP900 display 4.3 "An
Automation Panel 900 via SDL (onboard)".
How to select an SDL cable for connecting the AP800 display to the AP900 display4.4 "An
Automation Panel 800 via SDL (onboard)".
The following table shows the relationship between segment lengths and the maximum
resolution according to the SDL cable used:
Cables Resolution
XGA
Segment length [m] 1024 x 768
1.8 5CASDL.0018-20
5 5CASDL.0050-20
Commissioning
10 5CASDL.0100-20
Section 3
15 5CASDL.0150-20
20 5CASDL.0200-201)
25 5CASDL.0250-201)
30 5CASDL.0300-302)
40 5CASDL.0400-302)
1) See table 161 "Requirements for SDL cable with automatic cable adjustment (equalizer)"
2) See table 162 "Requirements for SDL cable with extender and automatic cable adjustment (equalizer)"
The cable types and resolutions shown with a footnote 1) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 161: Requirements for SDL cable with automatic cable adjustment (equalizer)
The cable types and resolutions shown with a footnote 2) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 162: Requirements for SDL cable with extender and automatic cable adjustment (equalizer)
For more information on this, see chapter 4 "Software", section 5 "Automation PC 620 with
Windows XP Professional", on page 568.
For more information on this, see chapter 4 "Software", section 5 "Automation PC 620 with
Windows XP Professional", on page 568.
An Automation Panel 900 is connected to the integrated SDL interface (onboard) via an SDL
cable. Up to three other Automation Panels of the same type are connected to this Automation
Panel and operated via SDL. All four panels show the same content (Display Clone).
Monitor / Panel
connection
SDL segment 1 0 SDL segment 2 1
max. 40 m max. 40 m
SDL segment 3
max. 40 m
USB
✓ USB OK ✓
Commissioning
possible
Link: 5DLSDL.1000-01 Link: 5DLSDL.1000-01
Section 3
Automation PC 620
with AP Link 3 SDL segment 2
5AC600.SDL0-00 max. 40 m
USB USB
not possible not possible
Link: 5DLSDL.1000-00 Link: 5DLSDL.1000-01
Graphics Engine 2
x Internal APC620 panel number ✓ independent of segment length ✓ depends on segment length
Figure 151: Configuration - Four Automation Panel 900 units via SDL (onboard)
The following table shows the possible combinations for the APC620 system unit with CPU
board to implement the configuration shown in the figure above. If the maximum resolution is
limited when making the combination then it is also shown in this table (e.g. for connecting a non-
B&R Automation Panel 900 device).
5PC600.E855-00
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-00
5PC600.E855-01
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-01
5PC600.E855-02
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-02
5PC600.E855-03
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-03
5PC600.E855-04
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-04
5PC600.E855-05
✓ ✓ ✓ ✓ ✓ ✓ Max. UXGA
5PC600.X855-05
Table 163: Possible combinations of system unit and CPU board (Forts.)
Table 164: Link modules for the configuration: 4 Automation Panel 900 via SDL on 1 line
4.6.3 Cables
The following table shows the relationship between segment lengths and the maximum
resolution according to the SDL cable used:
Cables Resolution
VGA SVGA XGA SXGA UXGA
Segment length [m] 640 x 480 800 x 600 1024 x 768 1280 x 1024 1600 x 1200
5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00
1.8 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01
Commissioning
5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03
Section 3
5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00
5 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01
5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03
5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-001)
10 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-011)
5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-031)
5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-001) -
15 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-011) -
5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-031) -
5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) --
20
5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031)
5CASDL.0250-001) 5CASDL.0250-001) 5CASDL.0250-001) - -
25
5CASDL.0250-031) 5CASDL.0250-031) 5CASDL.0250-031) - -
5CASDL.0300-001) 5CASDL.0300-001) 5CASDL.0300-102) 5CASDL.0300-102) -
30
5CASDL.0300-031) 5CASDL.0300-031) 5CASDL.0300-132) 5CASDL.0300-132)
5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) -
40
5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132)
1) See table 167 "Requirements for SDL cable with automatic cable adjustment (equalizer)", on page 326
2) See table 168 "Requirements for SDL cable with extender and automatic cable adjustment (equalizer)", on page 326
The cable types and resolutions shown with a footnote 1) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 167: Requirements for SDL cable with automatic cable adjustment (equalizer)
The cable types and resolutions shown with a footnote 2) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 168: Requirements for SDL cable with extender and automatic cable adjustment (equalizer)
"Display Clone" must be defined as output device in the graphics driver, with "Digital Display" as
primary device.
For more information on this, see chapter 4 "Software", section 5 "Automation PC 620 with
Windows XP Professional", on page 568.
For more information on this, see chapter 4 "Software", section 5 "Automation PC 620 with
Windows XP Professional", on page 568.
Commissioning
Section 3
4.7 One Automation Panel 900 unit via SDL (AP Link)
An Automation Panel 900 unit is connected to the optional SDL transmitter (AP Link) via an SDL
cable. USB devices can only be connected directly to the Automation Panel (without a hub).
✓ USB OK
Link: 5DLSDL.1000-00
Automation PC 620
Link: 5AC600.SDL0-00
Graphics Engine 1
x Internal APC620 panel number ✓ independent of segment le
Figure 152: Configuration - One Automation Panel 900 via SDL (AP Link)
The following table shows the possible combinations for the APC620 system unit with CPU
board to implement the configuration shown in the figure above. If the maximum resolution is
limited when making the combination then it is also shown in this table (e.g. for connecting a non-
B&R Automation Panel 900 device).
5PC600.E855-00
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-00
5PC600.E855-01
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-01
5PC600.E855-02
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-02
5PC600.E855-03
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-03
5PC600.E855-04
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-04
5PC600.E855-05
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-05
Table 170: Link modules for the configuration: 1 Automation Panel 900 via SDL (optional)
4.7.3 Cables
Commissioning
5CASDL.0018-03 SDL cable for fixed and flexible type of layout 1.8 m
Section 3
5CASDL.0050-00 SDL cable for a fixed type of layout 5m
5CASDL.0050-01 SDL cable with 45° plug for fixed type of layout 5m
5CASDL.0050-03 SDL cable for fixed and flexible type of layout 5m
5CASDL.0100-00 SDL cable for a fixed type of layout 10 m
5CASDL.0100-01 SDL cable with 45° plug for fixed type of layout 10 m
5CASDL.0100-03 SDL cable for fixed and flexible type of layout 10 m
5CASDL.0150-00 SDL cable for a fixed type of layout 15 m
5CASDL.0150-01 SDL cable with 45° plug for fixed type of layout 15 m
5CASDL.0150-03 SDL cable for fixed and flexible type of layout 15 m
5CASDL.0200-00 SDL cable for a fixed type of layout 20 m
5CASDL.0200-03 SDL cable for fixed and flexible type of layout 20 m
5CASDL.0250-00 SDL cable for a fixed type of layout 25 m
5CASDL.0250-30 SDL cable for fixed and flexible type of layout 25 m
5CASDL.0300-00 SDL cable for a fixed type of layout 30 m
5CASDL.0300-03 SDL cable for fixed and flexible type of layout 30 m
5CASDL.0300-10 SDL cable with extender for a fixed type of layout 30 m
5CASDL.0300-13 SDL cable with extender for fixed and flexible type of layout 30 m
5CASDL.0400-10 SDL cable with extender for a fixed type of layout 40 m
5CASDL.0400-13 SDL cable with extender for fixed and flexible type of layout 40 m
The following table shows the relationship between segment lengths and the maximum
resolution according to the SDL cable used:
Cables Resolution
VGA SVGA XGA SXGA UXGA
Segment length [m] 640 x 480 800 x 600 1024 x 768 1280 x 1024 1600 x 1200
5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00
1.8 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01
5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03
5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00
5 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01
5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03
5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-001)
10 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-011)
5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-031)
5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-01) -
15 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-011) -
5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-031) -
5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) -
20
5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031) -
5CASDL.0250-001) 5CASDL.0250-001) 5CASDL.0250-001) - -
25
5CASDL.0250-031) 5CASDL.0250-031) 5CASDL.0250-031) - -
5CASDL.0300-001) 5CASDL.0300-001) 5CASDL.0300-102) 5CASDL.0300-102) -
30
5CASDL.0300-031) 5CASDL.0300-031) 5CASDL.0300-132) 5CASDL.0300-132) -
5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) -
40
5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) -
1) See table 173 "Requirements for SDL cable with automatic cable adjustment (equalizer)", on page 330
2) See table 174 "Requirements for SDL cable with extender and automatic cable adjustment (equalizer)", on page 331
The cable types and resolutions shown with a footnote 1) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 173: Requirements for SDL cable with automatic cable adjustment (equalizer)
The cable types and resolutions shown with a footnote 2) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Commissioning
5PC600.SF03-00 System 3 PCI, 1 disk drive slot, 1 AP Link slot Rev. A0
Section 3
5PC600.SX05-00 System 5 PCI, 2 disk drive slots, 1 AP Link slot Rev. C0
5PC600.SX05-01 System 5 PCI, 2 disk drive slots Rev. C0
Table 174: Requirements for SDL cable with extender and automatic cable adjustment (equalizer)
To operate Automation Panel 900 panels with a touch screen (Extended Desktop or Dual
Display Clone), the serial interfaces COM C and COM D must be activated in BIOS (BIOS default
setting = disabled).
For more information on this, see chapter 4 "Software", section 5 "Automation PC 620 with
Windows XP Professional", on page 568.
For more information on this, see chapter 4 "Software", section 5 "Automation PC 620 with
Windows XP Professional", on page 568.
4.8 Four Automation Panel 900 units via SDL (AP Link)
An Automation Panel 900 unit is connected to the optional SDL transmitter (AP Link) via an SDL
cable. Three other Automation Panels of the same type are connected to this Automation Panel
and operated via SDL. All four panels show the same content (Display Clone).
SDL segment 3
max. 40 m
USB OK ✓ USB
Link: 5DLSDL.1000-01 Link: 5DLSDL.1000-01 possible
11 SDL segment 4 10
max. 40 m
Automation PC 620
with AP Link
5AC600.SDL0-00
USB USB
not possible not possible
Link: 5DLSDL.1000-00 Link: 5DLSDL.1000-01
Graphics Engine 1
x Internal APC620 panel number independent of segment length ✓ depends on segment length
Figure 153: Configuration - 4 Automation Panel 900 units via SDL (AP Link)
The following table shows the possible combinations for the APC620 system unit with CPU
board to implement the configuration shown in the figure above. If the maximum resolution is
limited when making the combination then it is also shown in this table (e.g. for connecting a non-
B&R Automation Panel 900 device).
5PC600.E855-00
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-00
5PC600.E855-01
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-01
5PC600.E855-02
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-02
5PC600.E855-03
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-03
5PC600.E855-04
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-04
5PC600.E855-05
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-05
Table 175: Possible combinations of system unit and CPU board (Forts.)
Commissioning
data, 24 VDC (screw clamp 0TB103.9 or cage clamp 0TB103.91 sold separately). 3 pieces required
Section 3
5AC600.SDL0-00 APC620 Smart Display Link transmitter For Automation PC
For connecting Automation Panels to an APC620 via SDL. 620
Table 176: Link modules for configuration: 4 Automation Panel 900 units via SDL (optional) on 1 line
4.8.3 Cables
The following table shows the relationship between segment lengths and the maximum
resolution according to the SDL cable used:
Cables Resolution
VGA SVGA XGA SXGA UXGA
Segment length [m] 640 x 480 800 x 600 1024 x 768 1280 x 1024 1600 x 1200
5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00
1.8 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01
5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03
5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00
5 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01
5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03
5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-001)
10 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-011)
5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-031)
5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-001) -
15 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-011) -
5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-031) -
5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) -
20
5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031) -
5CASDL.0250-001) 5CASDL.0250-001) 5CASDL.0250-001) - -
25
5CASDL.0250-031) 5CASDL.0250-031) 5CASDL.0250-031) - -
5CASDL.0300-001) 5CASDL.0300-001) 5CASDL.0300-102) 5CASDL.0300-102) -
30
5CASDL.0300-031) 5CASDL.0300-031) 5CASDL.0300-132) 5CASDL.0300-132)
5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) -
40
5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132)
1) See table 179 "Requirements for SDL cable with automatic cable adjustment (equalizer)", on page 335
2) See table 180 "Requirements for SDL cable with extender and automatic cable adjustment (equalizer)", on page 335
The cable types and resolutions shown with a footnote 1) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 179: Requirements for SDL cable with automatic cable adjustment (equalizer)
The cable types and resolutions shown with a footnote 2) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Commissioning
Firmware Name Version Note
Section 3
MTCX FPGA Firmware on the APC620 v 01.15 The version is read from BIOS - see the
BIOS description.
MTCX PX32 Firmware on the APC620 v 01.55 Supported starting with the APC620 /
SDLR FPGA Firmware on the AP Link SDL receiver and v 01.04 PPC 700 Firmware upgrade (MTCX,
transceiver SDLR, SDLT) V01.10, available in the
download area of the B&R homepage.
SDLT FPGA Firmware on the AP Link SDL transmitter v 00.02
Hardware Name Revision Note
5DLSDL.1000-00 AP Link SDL receiver Rev. D0
5DLSDL.1000-01 AP Link SDL transceiver Rev. D0
5AC600.SDL0-00 AP Link SDL transmitter Rev. B3
5PC600.SX01-00 System 1 PCI Rev. E0
5PC600.SX02-00 System 2 PCI, 1 disk drive slot, 1 AP Link slot Rev. D0
5PC600.SX02-01 System 2 PCI, 1 disk drive slot Rev. E0
5PC600.SF03-00 System 3 PCI, 1 disk drive slot, 1 AP Link slot Rev. A0
5PC600.SX05-00 System 5 PCI, 2 disk drive slots, 1 AP Link slot Rev. C0
5PC600.SX05-01 System 5 PCI, 2 disk drive slots Rev. C0
Table 180: Requirements for SDL cable with extender and automatic cable adjustment (equalizer)
For more information on this, see chapter 4 "Software", section 5 "Automation PC 620 with
Windows XP Professional", on page 568.
For more information on this, see chapter 4 "Software", section 5 "Automation PC 620 with
Windows XP Professional", on page 568.
4.9 Two Automation Panel 900 units via SDL (onboard) and SDL (AP Link)
An Automation Panel 900 (max. UXGA) is connected to the integrated SDL interface (onboard)
via an SDL cable. A second Automation Panel 900 (max. UXGA) is connected to the optional
SDL transmitter (AP Link) via an SDL cable. The Automation Panels show different content
(Extended Desktop) and can be different types.
✓ USB OK ✓ USB OK
Link: 5DLSDL.1000-00 Link: 5DLSDL.1000-00
Automation PC 620
Commissioning
with AP Link
5AC600.SDL0-00
Section 3
Graphics Engine 1
Graphics Engine 2
x Internal APC620 panel number independent of segment length
Figure 154: Configuration - Two Automation Panel 900 units via SDL (onboard) and SDL (AP Link)
The following table shows the possible combinations for the APC620 system unit with CPU
board to implement the configuration shown in the figure above. If the maximum resolution is
limited when making the combination then it is also shown in this table (e.g. for connecting a non-
B&R Automation Panel 900 device).
5PC600.E855-00
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-00
5PC600.E855-01
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-01
5PC600.E855-02
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-02
5PC600.E855-03
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-03
5PC600.E855-04
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-04
5PC600.E855-05
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-05
Table 182: Link modules for the configuration: 2 Automation Panel 900 units via SDL and SDL (optional)
4.9.3 Cables
The following table shows the relationship between segment lengths and the maximum
resolution according to the SDL cable used:
Cables Resolution
VGA SVGA XGA SXGA UXGA
Segment length [m] 640 x 480 800 x 600 1024 x 768 1280 x 1024 1600 x 1200
5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00
1.8 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01
5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03
5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00
5 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01
5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03
5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-001)
10 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-011)
5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-031)
5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-001) -
15 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-011) -
Commissioning
5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-031) -
Section 3
5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) -
20
5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031) -
5CASDL.0250-001) 5CASDL.0250-001) 5CASDL.0250-001) - -
25
5CASDL.0250-031) 5CASDL.0250-031) 5CASDL.0250-031) - -
5CASDL.0300-001) 5CASDL.0300-001) 5CASDL.0300-102) 5CASDL.0300-102) -
30
5CASDL.0300-031) 5CASDL.0300-031) 5CASDL.0300-132) 5CASDL.0300-132) -
5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) -
40
5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) -
1) See table 185 "Requirements for SDL cable with automatic cable adjustment (equalizer)", on page 339
2) See table 186 "Requirements for SDL cable with extender and automatic cable adjustment (equalizer)", on page 340
The cable types and resolutions shown with a footnote 1) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 185: Requirements for SDL cable with automatic cable adjustment (equalizer)
The cable types and resolutions shown with a footnote 2) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 186: Requirements for SDL cable with extender and automatic cable adjustment (equalizer)
To operate Automation Panel 900 panels with a touch screen (Extended Desktop or Dual
Display Clone), the serial interfaces COM C and COM D must be activated in BIOS (BIOS default
setting = disabled).
If all connected Automation Panel 900 panels (line 1 + line 2) should display the same content,
then "Dual Display Clone" mode must be set in the graphics driver (see chapter 4 "Software",
section 5.2.4 "Graphics settings for Dual Display Clone", on page 575).
If all connected Automation Panel 900 panels (line 1 + line 2) should display the same content,
then "Dual Display Clone" mode must be set in the graphics driver (see chapter 4 "Software",
section 5.2.3 "Graphics settings for Extended Desktop", on page 573).
4.10 Eight Automation Panel 900 units via SDL (onboard) and SDL (AP Link)
Four Automation Panel 900 units (max. UXGA) are connected to the integrated SDL interface
(onboard) via SDL. Four additional Automation Panel 900 units (max. UXGA) are connected to
the optional SDL transmitter (AP Link). The Automation Panels in each line must be the same
type. The two lines display different content (Extended Desktop), but panels in the same line
show the same content (Display Clone).
SDL segment 1
max.40 meters
AP Link Monitor / Panel
connection connection
SDL segment length 0 8
max.40 meters
Commissioning
Section 3
SDL segment 2
SDL segment 2
max.40 meters
max.40 meters
USB OK USB OK
Link: 5DLSDL.1000-01 Link: 5DLSDL.1000-01
Automation PC 620 1 9
with AP Link
5AC600.SDL0-00
Graphics Engine 1
Graphics Engine 2
SDL segment 3
SDL segment 3
USB
max.40 meters
max.40 meters
Not supported
USB USB
SDL segment 4
SDL segment 4
max.40 meters
max.40 meters
3 11
USB USB
not possible Link: 5DLSDL.1000-00 not possible
Link: 5DLSDL.1000-00
Figure 155: Configuration - Eight Automation Panel 900 units via SDL (onboard) and SDL (AP Link)
The following table shows the possible combinations for the APC620 system unit with CPU
board to implement the configuration shown in the figure above. If the maximum resolution is
limited when making the combination then it is also shown in this table (e.g. for connecting a non-
B&R Automation Panel 900 device).
5PC600.E855-00
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-00
5PC600.E855-01
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-01
5PC600.E855-02
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-02
5PC600.E855-03
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-03
5PC600.E855-04
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-04
5PC600.E855-05
- ✓ - ✓ ✓ - Max. UXGA
5PC600.X855-05
Table 188: Link modules for configuration: 8 Automation Panel 900 units via SDL and SDL (optional)
4.10.3 Cables
Commissioning
Section 3
5CASDL.0150-03 SDL cable for fixed and flexible type of layout 15 m
5CASDL.0200-00 SDL cable for a fixed type of layout 20 m
5CASDL.0200-03 SDL cable for fixed and flexible type of layout 20 m
5CASDL.0250-00 SDL cable for a fixed type of layout 25 m
5CASDL.0250-30 SDL cable for fixed and flexible type of layout 25 m
5CASDL.0300-00 SDL cable for a fixed type of layout 30 m
5CASDL.0300-03 SDL cable for fixed and flexible type of layout 30 m
5CASDL.0300-10 SDL cable with extender for a fixed type of layout 30 m
5CASDL.0300-13 SDL cable with extender for fixed and flexible type of layout 30 m
5CASDL.0400-10 SDL cable with extender for a fixed type of layout 40 m
5CASDL.0400-13 SDL cable with extender for fixed and flexible type of layout 40 m
The following table shows the relationship between segment lengths and the maximum
resolution according to the SDL cable used:
Cables Resolution
VGA SVGA XGA SXGA UXGA
Segment length [m] 640 x 480 800 x 600 1024 x 768 1280 x 1024 1600 x 1200
5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00 5CASDL.0018-00
1.8 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01 5CASDL.0018-01
5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03 5CASDL.0018-03
Cables Resolution
VGA SVGA XGA SXGA UXGA
Segment length [m] 640 x 480 800 x 600 1024 x 768 1280 x 1024 1600 x 1200
5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00 5CASDL.0050-00
5 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01 5CASDL.0050-01
5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03 5CASDL.0050-03
5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-00 5CASDL.0100-001)
10 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-01 5CASDL.0100-011)
5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-03 5CASDL.0100-031)
5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-00 5CASDL.0150-001) -
15 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-01 5CASDL.0150-011) -
5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-03 5CASDL.0150-031) -
5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) 5CASDL.0200-001) -
20
5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031) 5CASDL.0200-031) -
5CASDL.0250-001) 5CASDL.0250-001) 5CASDL.0250-001) - -
25
5CASDL.0250-031) 5CASDL.0250-031) 5CASDL.0250-031) - -
5CASDL.0300-001) 5CASDL.0300-001) 5CASDL.0300-102) 5CASDL.0300-102) -
30
5CASDL.0300-031) 5CASDL.0300-031) 5CASDL.0300-132) 5CASDL.0300-132) -
5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) 5CASDL.0400-102) -
40
5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) 5CASDL.0400-132) -
1) See table 191 "Requirements for SDL cable with automatic cable adjustment (equalizer)", on page 344
2) See table 192 "Requirements for SDL cable with extender and automatic cable adjustment (equalizer)", on page 345
The cable types and resolutions shown with a footnote 1) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 191: Requirements for SDL cable with automatic cable adjustment (equalizer)
The cable types and resolutions shown with a footnote 2) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Commissioning
5PC600.SF03-00 System 3 PCI, 1 disk drive slot, 1 AP Link slot Rev. A0
Section 3
5PC600.SX05-00 System 5 PCI, 2 disk drive slots, 1 AP Link slot Rev. C0
5PC600.SX05-01 System 5 PCI, 2 disk drive slots Rev. C0
Table 192: Requirements for SDL cable with extender and automatic cable adjustment (equalizer)
To operate Automation Panel 900 panels with a touch screen (Extended Desktop or Dual
Display Clone), the serial interfaces COM C and COM D must be activated in BIOS (BIOS default
setting = disabled).
If all connected Automation Panel 900 panels (line 1 + line 2) should display the same content,
then "Dual Display Clone" mode must be set in the graphics driver (see chapter 4 "Software",
section 5.2.4 "Graphics settings for Dual Display Clone", on page 575).
4.11 Six AP900 and two AP800 devices via SDL (onboard) and SDL (AP Link)
Three Automation Panel 900 (max. UXGA) units and one Automation Panel 800 are connected
to the integrated SDL interface (onboard) via SDL. Additionally, three Automation Panel 900
(max. UXGA) units and one Automation Panel 800 are operated on the optional SDL
transmitters. The Automation Panels in each line must be the same type. The two lines display
different content (Extended Desktop), but displays in the same line show the same content
(Display Clone).
SDL Segment 1
max.40 Meter
AP Link Monitor / panel
connection connection
SDL Segemt1 0 8
max.40 meters
SDL Segment 2
SDL Segment 2
max.40 meters
max.40 meters
✓ USB OK ✓ USB OK
Link: 5DLSDL.1000-01 Link: 5DLSDL.1000-01
Automation PC 620 1 9
with AP Link
5AC600.SDL0-00
Graphics Engine 1
Graphics Engine 2
SDL Segment 3
SDL Segment 3
max.40 meters
max.40 meters
Not supported
SDL Segment 4
possible possible
Link: 5DLSDL.1000-01 Link: 5DLSDL.1000-01
4 3 6 11 13
Figure 156: Configuration - Six AP900 and two AP800 devices via SDL (onboard) and SDL (AP Link)
The following table shows the possible combinations for the APC620 system unit with CPU
board to implement the configuration shown in the figure above. If the maximum resolution is
limited when making the combination then it is also shown in this table.
If an Automation Panel 800 and an Automation Panel 900 should be connected on the same line,
the devices must have the same display type.
5PC600.E855-00
- ✓ - ✓ ✓ - max. XGA
5PC600.X855-00
5PC600.E855-01
- ✓ - ✓ ✓ - max. XGA
5PC600.X855-01
5PC600.E855-02
- ✓ - ✓ ✓ - max. XGA
5PC600.X855-02
5PC600.E855-03
- ✓ - ✓ ✓ - max. XGA
Commissioning
5PC600.X855-03
Section 3
5PC600.E855-04
- ✓ - ✓ ✓ - max. XGA
5PC600.X855-04
5PC600.E855-05
- ✓ - ✓ ✓ - max. XGA
5PC600.X855-05
Table 194: Link modules for configuration: 6 Automation Panel 900 units via SDL and SDL (optional)
4.11.3 Cables
How to select an SDL cable for connecting the AP900 display to the AP900 display 4.3 "An
Automation Panel 900 via SDL (onboard)".
How to select an SDL cable for connecting the AP800 display to the AP900 display4.4 "An
Automation Panel 800 via SDL (onboard)".
The following table shows the relationship between segment lengths and the maximum
resolution according to the SDL cable used:
Cables Resolution
VGA SVGA XGA SXGA UXGA
Segment length [m] 640 x 480 800 x 600 1024 x 768 1280 x 1024 1600 x 1200
- - 5CASDL.0018-00 - -
- - 5CASDL.0018-01 - -
1.8
- - 5CASDL.0018-20 - -
- - 5CASDL.0018-03 - -
- - 5CASDL.0050-00 - -
- - 5CASDL.0050-01 - -
5
- - 5CASDL.0050-02 - -
- - 5CASDL.0050-03 - -
- - 5CASDL.0100-00 - -
- - 5CASDL.0100-01 - -
10
- - 5CASDL.0100-02 - -
- - 5CASDL.0100-03 - -
- - 5CASDL.0150-00 - -
- - 5CASDL.0150-01 - -
15
- - 5CASDL.0150-02 - -
- - 5CASDL.0150-03 - -
- - 5CASDL.0200-001) - -
20 - - 5CASDL.0200-021) - -
- - 5CASDL.0200-031) - -
- - 5CASDL.0250-001) - -
25 - - 5CASDL.0250-021) - -
- - 5CASDL.0250-031) - -
- - 5CASDL.0300-101) - -
30 - - 5CASDL.0300-132) - -
- - 5CASDL.0300-302) - -
- - 5CASDL.0400-102) - -
40 - - 5CASDL.0400-132) - -
5CASDL.0400-302)
1) See table 196 "Requirements for SDL cable with automatic cable adjustment (equalizer)", on page 348
2) See table 197 "Requirements for SDL cable with extender and automatic cable adjustment (equalizer)", on page 349
The cable types and resolutions shown with a footnote 1) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Table 196: Requirements for SDL cable with automatic cable adjustment (equalizer)
The cable types and resolutions shown with a footnote 2) in the previous table can only be
implemented starting with the following firmware and hardware versions:
Commissioning
Table 197: Requirements for SDL cable with extender and automatic cable adjustment (equalizer)
Section 3
4.11.4 BIOS settings
To operate Automation Panel 900 panels with a touch screen (Extended Desktop or Dual
Display Clone), the serial interfaces COM C and COM D must be activated in BIOS (BIOS default
setting = disabled).
If all connected Automation Panel 900 panels and Automation Panel 800 panels (line 1 + line
2) should display the same content, then "Dual Display Clone" mode must be set in the graphics
driver (see chapter 4 "Software", section 5.2.4 "Graphics settings for Dual Display Clone", on
page 575).
An extension unit for an AP800 device is numbered like another device. The numbering of the
extension units starts from the display unit and goes in the counter-clockwise direction; all
extension unit slots that are not used are left out.
The following graphic shows numbering examples.
1 0 3 0 2 1 0 2
You must enter the BIOS "RAID Configuration Utility" in order to make the necessary settings.
After the POST, enter <Ctrl+S> or <F4> to open RAID BIOS.
Commissioning
Section 3
RAID Configuration Utility - Silicon Image Inc. Copyright (C) 2006
* 0 PM ST96023AS 55GB
1 SM ST96023AS 55GB
Select Menu
ESC Previous Menu
Enter Select
Ctrl-E Exit
* First HDD
The following keys can be used after entering the BIOS setup:
Key Function
Cursor ↑ Go to previous item.
Cursor ↓ Go to the next item.
Enter Select an item or open a submenu.
Key Function
ESC Go back to previous menu.
Ctrl+E Exit setup and save the changed settings.
* 0 PM ST96023AS 55GB
1 SM ST96023AS 55GB
Select Menu
ESC Previous Menu
Enter Select
Ctrl-E Exit
* First HDD
The RAID system can be recreated as "Striped" = RAID0 or "Mirrored" = RAID1 using the menu
"Create RAID set".
* 0 PM ST96023AS 55GB
1 SM ST96023AS 55GB
Select Menu
ESC Previous Menu
Enter Select
Commissioning
Ctrl-E Exit
Section 3
* First HDD
Auto Configuration
Manual Configuration
It is possible to specify the first and second HDD as well as the "Chunk Size" (= block size,
application-dependent).
* 0 PM ST96023AS 55GB
1 SM ST96023AS 55GB
Select Menu
ESC Previous Menu
Enter Select
Ctrl-E Exit
* First HDD
Auto Configuration
Manual Configuration
It is possible to specify the "Source" and "Target" HDD, and also to specify whether a rebuild
(mirror) should be performed immediately (approx. 50 minutes).
0 PM ST96023AS 55GB
1 SM ST96023AS 55GB
Commissioning
Ctrl-E Exit
Section 3
* First HDD
An existing RAID set can be deleted using the menu "Delete RAID set".
0 PM ST96023AS 55GB
1 SM ST96023AS 55GB
* First HDD
The "Rebuild mirrored set" menu can be used to restart a rebuild procedure in a RAID 1 network
if an error occurs, after first interrupting the rebuild procedure or when exchanging a hard disk.
If "onlinerebuild" is selected, then the rebuild is executed during operation after the system is
booted. E.g. an event pop-up is displayed by the installed SATA RAID configuration program:
SATARaid detected a new event and the rebuild is started. The entire rebuild lasts
approximately 50 minutes.
0 PM ST96023AS 55GB
1 SM ST96023AS 55GB
Commissioning
Ctrl-E Exit
Section 3
* First HDD
Conflicts in a RAID set can be resolved using the "Resolve conflicts" menu. This function is only
available if the status of the hard disk is "conflict".
0 PM ST96023AS 55GB
1 SM ST96023AS 55GB
Select Menu
ESC Previous Menu
Enter Select
Ctrl-E Exit
* First HDD
Individual hard disks can be configured using the "Low Level Format" menu. This can only be
done if a RAID set is not configured. A low level format of a hard disk takes approx. 40 minutes.
Warning!
Peripheral USB devices can be connected to the USB interfaces. Due to the vast
number of USB devices available on the market, B&R cannot guarantee their
performance. B&R does ensure the performance of all USB devices that they
provide.
Many different peripheral USB devices can be connected to the 2 or 4 (APC embedded) USB
interfaces. The maximum current load values and transfer speeds can be found in Sections
"USB port", on page 133 and "USB connection (only APC620 embedded)", on page 134.
Commissioning
Section 3
2.0
USB
USB port expansion
e.g. Hub
USB 2.0
.1
B1
US
US
B1
.1
USB drives
e.g. CD ROM drive
Many different peripheral USB devices can be connected to the 2 or 3 USB interfaces on the
Automation Panel 900. These can each handle a load of 500 mA. The maximum transfer rate is
USB 2.0.
Information:
Only end devices (no hubs) can be connected to the Automation Panel 900.
DVI
USB 2.0
USB 2.0
RS232
USB memory media
e.g. flash drive
USB 2.0
B 1.1
US
US
B1
.1
USB drives
USB input devices USB display devices e.g. CD ROM drive
e.g. keyboard e.g. mouse
Figure 168: Remote connection of USB peripheral devices to the APC900 via DVI
Many different peripheral USB devices can be connected to the 2 or 3 USB interfaces on
Automation Panel 900 and/or USB connections on the Automation Panel 800 devices. These
can each handle a load of 500 mA. The maximum transfer rate is USB 1.1.
Information:
Only end devices (no hubs) can be connected to the Automation Panel 800/900.
Commissioning
USB 1.1
Section 3
USB memory media
e.g. flash drive
USB 1.1
B 1.1
US
US
B1
.1
USB drives
USB input devices USB display devices e.g. CD ROM drive
e.g. keyboard e.g. mouse
Figure 169: Remote connection of USB peripheral devices to the APC800/900 via SDL
The purpose of these instructions is to explain general procedures for performing application-
specific temperature tests with B&R industrial PCs or Power Panels. However, these instructions
are meant to serve only as a guideline.
7.1 Procedure
In order to obtain accurate results, the testing conditions should match the conditions in the field.
This means that for the duration of the temperature tests, the target application should be
running, the PC should be installed in the control cabinet that will be used, etc.
Additionally, a temperature sensor should be installed for the device being tested to provide live
monitoring of the ambient temperature. In order to obtain accurate measurements, this sensor
should be mounted at a distance of 5 to 10 cm from the B&R industrial PC, near the air intake
(not near the exhaust).
All B&R industrial PCs and Power Panels are equipped with internal temperature sensors. These
are installed in different locations for each series. The number of sensors and the temperature
limits also vary from series to series.
Information about the locations of temperature sensors and the maximum specified values can
be found in section "Temperature sensor locations", on page 791.
The B&R Control Center can be used to evaluate the temperatures. The temperatures can be
viewed on the "Temperatures" tab. The B&R Control Center can be downloaded at no cost from
the Downloads section of the B&R website (www.br-automation.com). The B&R Control Center
uses the B&R Automation Device Interface (ADI).
Commissioning
Section 3
Figure 170: B&R Control Center
Information:
There are SDK's (e.g. the ADI .NET SDK) available on the B&R website (www.br-
automation.com) that can be helpful in creating a new application.
If a new application is not created for evaluating the temperatures, B&R recommends using the
BurnIn Test software tool from the company Passmark.
Standard and Professional versions of the BurnIn tool are available. In addition to the software
package, there are also various loopback adapters (serial, parallel, USB, etc.) and test
CDs/DVDs available. The exact software and loopback adapters used will determine the
corresponding load that can be generated on the system and peripheral devices.
Information:
Loopback adapters are also available from Passmark. More information can be
found at www.passmark.com.
The following screenshots are based on Passmark BurnIn Pro Version V4 and an APC810 2-slot
with DVD.
Figure 171: Settings for Passmark BurnIn Pro V4 with an APC810 2-slot with DVD
Commissioning
Section 3
Figure 172: Test overview of an APC810 2-slot with DVD
The respective test properties may need to be fine tuned depending on the availability of a
loopback adapter and DVDs.
Information:
If there is no USB loopback adapter available, USB flash drives can also be used.
The USB flash drives must be available in Windows as formatted drives. The test
USB must then be deselected and the USB flash drives must be configured in the
disk properties.
Information:
Serial loopback adapters are relatively easy to create yourself. Simple connect
several pins on the serial interface with wires.
For applications that don't use Windows, the temperatures can be evaluated using the B&R
implementation guide. In addition to the implementation guide, there are also programs available
in MS-DOS.
The implementation guide only describes the device-specific functions and not the main
functions of the sample programs.
If code from the sample programs is used, please observe the notes in the implementation guide
regarding the TODO statements, I/O access functions, etc.
Information:
Sample programs and implementation guides for any B&R industrial PC or Power
Panel can be downloaded free of charge from the B&R website (www.br-
automation.com).
The maximum temperature value recorded by each sensor must not exceed the temperature
limits specified in the user's manuals.
If the temperature tests cannot be performed in a climate controlled chamber, they can also be
performed in an office environment. In this case, however, it is necessary to measure the
ambient temperature. Experience at B&R has shown that values measured on passive systems
(systems without a fan kit) can be projected linearly based on the ambient temperature. In order
to be able to project the temperature values for systems with a fan kit, the fans must be running.
It is also important to consider the speed, etc.
If the temperature tests are performed in a climate controlled chamber with fans, the devices will
be cooled by these fans, and the results will be skewed. The measurement results for passive
devices would therefore be unusable. In order to obtain accurate results in climate controlled
chambers with fans, the chamber fans must be turned off and the device must be allowed to run
for a sufficient amount of time (several hours) before beginning the test.
The following example is only valid as long as the instructions for installation and mounting
orientation provided in the user's manual are followed.
Commissioning
Section 3
The following table shows the compatibilities and improvements from 855GME (XTX)
5PC600.X855-0x to 855GME (ETX) 5PC600.E855-0x CPU boards.
• Using two different types of CompactFlash cards can cause problems in Automation PCs
and Panel PCs. This can result in one of the two cards not being detected during system
startup. This is caused by varying startup speeds. CompactFlash cards with older
technology require significantly more time during system startup than CompactFlash
cards with newer technology. This behavior occurs near the limits of the time frame
provided for startup. The problem described above can occur because the startup time
for the CompactFlash cards fluctuates due to the variance of the components being used.
Depending on the CompactFlash cards being used, this error might never, sometimes or
always occur.
• During daisy chain operation of multiple AP800/AP900 devices via SDL, it's possible that
the touch controller status shows a red "X" in the Control Center applet for the touch
screen driver when the touch controller is detected. The functionality of the touch system
is not affected by this. This can be avoided by setting a panel locking time of 50 ms. The
Commissioning
panel locking time can be configured with the B&R Key Editor.
Section 3
• Beginning with Revision E0 of the 5AC600.SSDI-00 drive, the simultaneous operation
with a CompactFlash card in the CompactFlash1 slot is no longer recommended since
the CompactFlash card is only operated in UDMA2 mode. Revision E0 of the
5AC600.SSDI-00 drive can only be used in standalone operation.
Chapter 4 • Software
1. BIOS options
The available BIOS settings in various CPU boards 815E (ETX), 855GME (ETX) and 855GME
(XTX) are described in the following sections.
Information:
• The following diagrams and BIOS menu items including descriptions refer to
BIOS version 1.23. It is therefore possible that these diagrams and BIOS
descriptions do not correspond with the installed BIOS version.
• The setup defaults are the settings recommended by B&R. The setup defaults
are dependant on the DIP switch configuration on the baseboard (see section
1.1.10 "Profile overview - BIOS default settings - 815E (ETX)", on page 416).
Section 4
1.1.1 General information
Software
BIOS stands for "Basic Input Output System". It is the most basic standardized communication
between the user and the system (hardware). The BIOS system used in the Automation PC 620
systems is produced by Phoenix.
The BIOS Setup Utility lets you modify basic system configuration settings. These settings are
stored in CMOS and in EEPROM (as a backup).
The CMOS data is buffered by a battery, and remains in the APC620 even when the power is
turned off (no 24 VDC supply) .
BIOS is immediately activated when switching on the power supply of the Automation PC 620
system or pressing the power button. The system checks if the setup data from the EEPROM is
"OK". If the data is "OK", then it is transferred to the CMOS. If the data is "not OK", then the
CMOS data is checked for validity. An error message is output if the CMOS data contains errors
and the boot procedure can be continued by pressing the <F1> key. To prevent the error
message from appearing at each restart, open the BIOS setup by pressing the <F2> key and re-
save the settings.
BIOS reads the system configuration information in CMOS RAM, checks the system, and
configures it using the Power On Self Test (POST).
When these "preliminaries" are finished, BIOS seeks an operating system in the data storage
devices available (hard drive, floppy drive, etc.). BIOS launches the operating system and hands
over control of system operations to it.
To enter BIOS setup, the F2 key must be pressed as soon as the following message appears on
the lower margin of the display (during POST):
Summary screen
After the POST, the summary screen displays the most important system characteristics.
Key Function
Section 4
Software
F2 Enters the BIOS setup menu.
ESC Cues the boot menu. Lists all bootable devices that are connected to the system. With cursor ↑ and
cursor ↓ and by pressing <ENTER>, select the device from which will be booted.
<Spacebar> Pressing the spacebar skips the system RAM check.
<Pause> Pressing the <pause> key stops the POST. Press any other key to resume the POST.
The following keys can be used after entering the BIOS setup:
Key Function
Cursor ↑ Moves to the previous item.
Cursor ↓ Go to the next item.
Cursor ← Move to the item on the left.
Cursor → Move to the item on the right.
<ESC> Exits the submenu.
PageUp ↑ Moves the cursor to the top of the current BIOS setup page.
PageDown ↓ Moves the cursor to the bottom of the current BIOS setup page.
Key Function
<F1> or <Alt+H> Opens a help window showing the key assignments.
<F5> or <-> Scrolls to the previous option for the selected BIOS setting.
<F6> or <+> or <spacebar> Scrolls to the next option for the selected BIOS setting.
<F9> Loads setup defaults for the current BIOS setup screen.
<F10> Saves settings and closes BIOS setup.
<Enter> Opens submenu for a BIOS setup menu item, or displays the configurable values of a BIOS setup item.
The following sections explain the individual BIOS setup menu items in detail.
1.1.4 Main
Section 4
Software
BIOS setting Meaning Setting options Effect
System Time This is the current system time setting. Changes the Set the system time in the format (hh:mm:ss).
The time is buffered by a battery (CMOS System time
battery) after the system has been
switched off.
System Date This is the current system date setting. Changes the Set the system date in the format (mm:dd:yyyy).
The time is buffered by a battery (CMOS system date
battery) after the system has been
switched off.
IDE channel 0 The drive in the system that is connected Enter Opens the submenu
master to the IDE primary master port is See "IDE channel 0 master", on page 376.
configured here.
IDE channel 0 slave The drive in the system that is connected Enter Opens the submenu
to the IDE primary slave port is configured See "IDE channel 0 slave", on page 378.
here.
IDE channel 1 The drive in the system that is connected Enter Opens the submenu
master to the IDE secondary master port is See "IDE channel 1 master", on page 380.
configured here.
IDE channel 1 slave The drive in the system that is connected Enter Opens the submenu
to the IDE secondary slave port is See "IDE channel 1 slave", on page 382.
configured here.
LBA mode control This option activates the logical block Disabled Disables this function.
addressing for IDE. This function enables
support of drives larger than 540 MB. Enabled Enables this function.
Only possible when manually setting up
the drive.
32-bit I/O This function enables 32-bit data transfer. Disabled Disables this function.
Enabled Enables this function.
Transfer mode The communication path between the Default Default setting.
primary master drive and the system
memory is defined here. Only possible Fast PIO 1 - Fast PIO 4 / Manual configuration of PIO mode.
when manually setting up the drive. DMA2
Ultra DMA mode The data transfer rate to and from the Disabled Disables this function. Do not use UDMA mode.
primary master drive is defined here. The
Mode 0 - Mode 5 Manual setting option for UDMA mode.
Section 4
DMA mode must be activated in the
Software
Windows device manager in order to
guarantee maximum performance. Only
possible when manually setting up the
drive.
SMART monitoring Indicates whether the primary master Disabled No drive support, and function is deactivated.
drive supports SMART technology.
Enabled Drive support present, and function is activated.
LBA mode control This option activates the logical block Disabled Disables this function.
addressing for IDE. This function enables
support of drives larger than 540 MB. Enabled Enables this function.
Only possible when manually setting up
the drive.
Ultra DMA mode The data transfer rate to and from the Disabled Disables this function. Do not use UDMA mode.
primary slave drive is defined here. The
DMA mode must be activated in the Mode 0 - Mode 5 Manual setting option for UDMA mode.
Windows device manager in order to
guarantee maximum performance. Only
possible when manually setting up the
drive.
SMART monitoring Indicates whether the primary slave drive Disabled No drive support, and function is deactivated.
supports SMART technology.
Enabled Drive support present, and function is activated.
Table 206: 815E (ETX) IDE Channel 0 Slave setting options (Forts.)
Section 4
Software
LBA mode control This option activates the logical block Disabled Disables this function.
addressing for IDE. This function enables
support of drives larger than 540 MB. Enabled Enables this function.
Only possible when manually setting up
the drive.
Ultra DMA mode The data transfer rate to and from the Disabled Disables this function. Do not use UDMA mode.
secondary master drive is defined here.
The DMA mode must be activated in the Mode 0 - Mode 5 Manual setting option for UDMA mode.
Windows device manager in order to
guarantee maximum performance. Only
possible when manually setting up the
drive.
SMART monitoring Indicates whether the secondary master Disabled No drive support, and function is deactivated.
drive supports SMART technology.
Enabled Drive support present, and function is activated.
Table 207: 815E (ETX) IDE Channel 1 Master setting options (Forts.)
Section 4
Software
LBA mode control This option activates the logical block Disabled Disables this function.
addressing for IDE. This function enables
support of drives larger than 540 MB. Enabled Enables this function.
Only possible when manually setting up
the drive.
Ultra DMA mode The data transfer rate to and from the Disabled Disables this function. Do not use UDMA mode.
secondary slave is defined here. The
DMA mode must be activated in the Mode 0 - Mode 5 Manual setting option for UDMA mode.
Windows device manager in order to
guarantee maximum performance. Only
possible when manually setting up the
drive.
SMART monitoring Indicates whether the secondary slave Disabled No drive support, and function is deactivated.
drive supports SMART technology.
Enabled Drive support present, and function is activated.
Table 208: 815E (ETX) IDE Channel 1 Slave setting options (Forts.)
Section 4
Software
1.1.5 Advanced
or [Disabled] to
disable the onboard
video controller.
Section 4
Software
Figure 181: 815E (ETX) Advanced Chipset/Graphics Control
PCI/PNP Configuration
Section 4
Software
Figure 182: 815E (ETX) PCI/PNP Configuration
Section 4
Software
BIOS setting Meaning Setting options Effect
ROM scan option Setting for the initialization of a device's Enabled Enables this function.
ROM.
Disabled Disables this function.
Enable master Sets the PCI device to be treated as the Enabled Enables this function.
PCI bus master. Not all PCI devices can
function as PCI bus master! Check device
description. Disabled Disables this function.
Latency timer This option controls how long one card Default Default setting. Default
can continue to use the PCI bus master
after another PCI card has requested 0020h, 0040h, 0060h, Value set manually.
access. 0080h, 00A0h, 00C0h,
00E0h
Section 4
Software
BIOS setting Meaning Setting options Effect
ROM scan option Setting for the initialization of a device's Enabled Enables this function.
ROM.
Disabled Disables this function.
Enable master Sets the PCI device to be treated as the Enabled Enables this function.
PCI bus master. Not all PCI devices can
function as PCI bus master! Check device
description. Disabled Disables this function.
Latency timer This option controls how long one card Default Default setting. Default
can continue to use the PCI bus master
after another PCI card has requested 0020h, 0040h, 0060h, Value set manually.
access. 0080h, 00A0h, 00C0h,
00E0h
Memory cache
Section 4
Software
Figure 187: 815E (ETX) Memory Cache
Section 4
Software
Esc Exit Select Menu Enter Select Sub Menu F10 Save and Exit
Secondary IDE Setup the data transfer rate for a device Disabled The maximum data transfer rate is UDMA33.
UDMA66/100 connected to the secondary IDE channel.
This option is only available when a Enabled The maximum data transfer rate is UDMA66.
secondary IDE drive is connected.
Serial port A For the configuration of serial port A Disabled Port A deactivated.
(COM1).
Enabled Port A activated. The base I/O addresses and the
interrupt must then be configured manually.
Auto Either BIOS or the operating system configures
the port automatically.
Base I/O address Selection of the base I/O address for port 3F8, 2F8, 3E8, 2E8 Base I/O address is manually assigned.
A.
A yellow star indicates a conflict with
another device.
Interrupt Selection of the interrupt for port A. IRQ 3, IRQ 4 Manual assignment of the interrupt.
A yellow star indicates a conflict with
another device.
Table 217: 815E (ETX) I/O Device Configuration setting options (Forts.)
Table 217: 815E (ETX) I/O Device Configuration setting options (Forts.)
Section 4
Software
Keyboard features
Information:
The displayed voltage values (e.g. core voltage, battery voltage) on this BIOS Setup
page represent uncalibrated information values. These cannot be used to draw any
conclusions about any hardware alarms or error conditions. The hardware
components used have automatic diagnostics functions that can be applied in the
event of error.
Section 4
F1 Help Select Item -/+ Change Values F9 Setup Defaults Software
Esc Exit Select Menu Enter Select Sub Menu F10 Save and Exit
Miscellaneous
Panel Control
Baseboard Monitor
Legacy Devices
Versions
Section 4
Software
BIOS: R123
MTCX PX32: V1.63
MTCX FPGA: V1.19
Panel control
Section 4
Software
BIOS setting Meaning Setting options Effect
Select panel number Selection of the panel number for which 0 ... 15 Selection of panel 0 ... 15.
the values should be read out and/or Panel 15 is specifically intended for panel PC 700
changed. systems.
Version Displays the firmware version of the SDLR None
controller.
Brightness For setting the brightness of the selected 0%, 25%, 50%, 75%, For setting the brightness (in %) of the selected
panel. 100% panel. Changes take effect after saving and
restarting the system (e.g. by pressing <F10>).
Temperature Displays the selected panel's temperature None
(in degrees Celsius and Fahrenheit).
Fan speed Displays fan speed for the selected panel. None
Keys/LEDs Displays the available keys and LEDs on None
the selected panel.
Temperatures
I/O: 42°C/108°F All items on this menu
Power Supply: 34°C/93°F cannot be modified in
Slide-In Drive 1: 00°C/32°F user mode. If any
Slide-In Drive 2: 00°C/32°F items require changes,
please consult your
Fan Speeds system Supervisor.
Case 1: 00 RPM
Case 2: 00 RPM
Case 3: 00 RPM
Case 4: 00 RPM
CPU: 00 RPM
Legacy devices
Section 4
Software
Figure 195: 815E (ETX) Legacy Devices
1.1.6 Security
Section 4
Software
BIOS setting Meaning Setting options Effect
Supervisor Displays whether or not a supervisor None Display set: A supervisor password has been set.
password is password has been set. Display clear: No supervisor password has been
set.
User password is Displays whether or not a user password None Display set: A user password has been set.
has been set. Display clear: No user password has been set.
Set supervisor To enter/change a supervisor password. Enter Press Enter and enter password two times. The
password A supervisor password is necessary to maximum 7 password must be 7 alphanumeric characters or
edit all BIOS settings. alphanumeric characters less.
- not case sensitive. Needed to enter BIOS setup.
To change the password, enter the old password
once and then the new password twice.
Set user password To enter/change a user password. A user Enter Press Enter and enter password two times. The
password allows the user to edit only maximum 7 password must be 7 alphanumeric characters or
certain BIOS settings. alphanumeric characters less.
- not case sensitive. Needed to enter BIOS setup.
To change the password, enter the old password
once and then the new password twice.
Virus check This function opens a reminder when the Disabled Disables this function.
reminder system is started to scan for viruses.
Daily A reminder appears every day when the system
is started.
Weekly A reminder appears the first time the system is
started after every Sunday.
Monthly A reminder appears the first time the system is
started each month.
System backup This function opens a reminder when the Disabled Disables this function.
reminder system is started to create a system
backup. Daily A reminder appears every day when the system
is started.
Weekly A reminder appears the first time the system is
started after every Sunday.
Monthly A reminder appears the first time the system is
started each month.
Password at boot This function requires a supervisor or user Disabled Disables this function.
password when the system is started.
Only possible when a supervisor or user Enabled Enables this function.
password is enabled.
1.1.7 Power
Section 4
Software
Figure 197: 815E (ETX) Power Menu
Resume on time This function enables the system to start Off Disables this function.
at the time set under "resume time."
On Enables this function.
Resume time Time setting for the option "resume on [00:00:00] Personal setting of the time in the format
time" (when the system should start up). (hh:mm:ss).
Power supply The type of power supply being used can ATX An ATX compatible power supply is being used.
be entered here.
Information:
Since the APC620 contains an ATX power
supply, ATX should be selected.
AT An AT compatible power supply is being used.
Power button This option determines the function of the Power off Shuts down the system.
Function power button.
Sleep The system enters sleep mode.
Power Loss Control This option determines how the system Stay off The system does not turn back on. The system
reacts to a power outage. remains off until the power button is pressed.
Power-on The system turns back on.
Last State The system resumes the last state it was in
before the power outage.
ACPI control
Section 4
Software
BIOS setting Meaning Setting options Effect
Active trip point With this function, an optional CPU fan Disabled Disables this function.
above the operating system can be set to
turn on when the CPU reaches the set 40 to 100°C Temperature setting for the active trip point. Can
temperature. be set in increments of 5°C.
Passive Cooling Trip With this function, a temperature can be Disabled Disables this function.
Point set at which the CPU automatically
reduces its speed. 40 to 100°C Temperature setting for the passive cooling trip
point. Can be set in increments of 5°C.
Critical Trip Point With this function, a temperature can be Disabled Disables this function.
set at which the operating system
automatically shuts itself down.
Warning!
40 to 110°C Temperature setting for the critical trip point. Can
This function should never be be set in increments of 5°C.
deactivated, as this would allow the
CPU to rise above the temperature
specifications.
Thermal management
Section 4
Software
1.1.8 Boot
7:
8:
1.1.9 Exit
Section 4
Software
BIOS setting Meaning Setting options Effect
Exit saving changes BIOS setup is closed with this item. Yes / No
Changes made are saved in CMOS after
confirmation, and the system is rebooted.
Exit discarding With this item you can close BIOS setup Yes / No
changes without saving the changes made. The
system is then rebooted.
Load setup defaults This item loads the BIOS setup defaults, Yes / No
which are defined by the DIP switch
settings. These settings are loaded for all
BIOS configurations.
Discard Changes Should unknown changes have been Yes / No
made and not yet saved, they can be
discarded.
Save changes Settings are saved, and the system is not Yes / No
restarted.
If the function "load setup defaults" is chosen in the main BIOS setup menu, or if exit is selected
(or <F9> is pressed) in the individual setup screens, the following BIOS default settings are the
optimized values that will be used.
DIP switch position see Section 1.6 "Location of the DIP switch in APC620 system units", on
page 546).
ON DIP
39
1 2 3 4 5 6 7 8
The first six DIP switches (1-6) are used to set the profiles. The rest (7,8) are reserved.
1) Reserved.
The following pages provide an overview of the BIOS default settings for the different DIP switch
configurations.
Personal settings
If changes have been made to the BIOS defaults, they can be entered in the following tables for
backup.
Main
System Time - - - - -
System Date - - - - -
BIOS Date - - - - -
Multi-sector transfer - - - - -
Transfer mode - - - - -
Multi-sector transfer - - - - -
Transfer mode - - - - -
Section 4
Software
IDE channel 1 master
Type Auto Auto Auto Auto Auto
Multi-sector transfer - - - - -
Transfer mode - - - - -
Multi-sector transfer - - - - -
Transfer mode - - - - -
Advanced
Table 233: 815E (ETX) Advanced Chipset/Graphics Control Profile settings overview
PCI/PNP Configuration
PCI device, slot #4 Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Personal settings
Table 234: 815E (ETX) PCI/PNP Configuration Profile settings overview (Forts.)
Memory cache
Cache system BIOS area Write protect Write protect Write protect Write protect Write protect
Cache video BIOS area Write protect Write protect Write protect Write protect Write protect
Cache extended memory Write back Write back Write back Write back Write back
area
Cache D000 - D3FF Disabled Disabled Disabled Disabled Disabled
Section 4
Software
Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Personal settings
Table 236: 815E (ETX) I/O Device Configuration Profile settings overview
Table 236: 815E (ETX) I/O Device Configuration Profile settings overview (Forts.)
Keyboard features
NumLock On On On On On
Keyboard auto-repeat delay 1/2 sec 1/2 sec 1/2 sec 1/2 sec 1/2 sec
5Vsb voltage - - - - -
Battery voltage - - - - -
CPU temperature - - - - -
Table 238: 815E (ETX) CPU Board Monitor Profile settings overview
Miscellaneous
Extended memory testing Just zero it Just zero it Just zero it Just zero it Just zero it
Versions - - - - -
BIOS - - - - -
MTCX - - - - -
FPGA - - - - -
Optimized ID - - - - -
Device ID - - - - -
Compatibility ID - - - - -
Serial Number - - - - -
Product name - - - - -
User serial ID - - - - -
Panel control
Select panel number 0 0 0 15 15
Version - - - - -
Temperature - - - - -
Fan speed - - - - -
Keys/LEDs - - - - -
I/O - - - - -
Section 4
Software
Power supply - - - - -
Slide-in drive 1 - - - - -
Slide-in drive 2 - - - - -
Fan speeds - - - - -
Case 1 - - - - -
Case 2 - - - - -
Case 3 - - - - -
Case 4 - - - - -
CPU - - - - -
Legacy devices
COM C Disabled Disabled Disabled Enabled Enabled
Interrupt - - - 11 11
Interrupt - - - - -
Interrupt - - - - -
Interrupt - - - - -
Table 240: 815E (ETX) Baseboard/Panel Features Profile settings overview (Forts.)
Security
Power
Standby timeout - - - - -
Power button function Power off Power off Power off Power off Power off
ACPI control
Active trip point Disabled Disabled Disabled Disabled Disabled
Thermal management
Auto thermal throttling Enabled Enabled Enabled Enabled Enabled
Section 4
Software
Temperature 100°C 100°C 100°C 100°C 100°C
Boot
5: USB KEY USB FDC USB KEY USB KEY USB KEY
6: USB CDROM USB KEY USB CDROM USB CDROM USB CDROM
8: - - IDE 3 - IDE 3
: USB HDD USB HDD USB LS120 USB HDD USB LS120
: USB ZIP USB ZIP PCI BEV USB ZIP PCI BEV
: USB LS120 USB LS120 PCI SCSI USB LS120 PCI SCSI
: PCI BEV PCI SCSI Bootable add-in PCI BEV Bootable add-in
cards cards
Information:
• The following diagrams and BIOS menu items including descriptions refer to
BIOS version 1.30. It is therefore possible that these diagrams and BIOS
descriptions do not correspond with the installed BIOS version.
• The setup defaults are the settings recommended by B&R. The setup defaults
are dependant on the DIP switch configuration on the baseboard (see section
1.2.10 "Profile overview - BIOS default settings - 855GME (ETX)", on
page 472).
BIOS stands for "Basic Input Output System". It is the most basic standardized communication
between the user and the system (hardware). The BIOS system used in the Automation PC 620
systems is produced by Phoenix.
The BIOS Setup Utility lets you modify basic system configuration settings. These settings are
stored in CMOS and in EEPROM (as a backup).
The CMOS data is buffered by a battery, and remains in the APC620 even when the power is
turned off (no 24 VDC supply) .
Section 4
Software
BIOS is immediately activated when switching on the power supply of the Automation PC 620
system or pressing the power button. The system checks if the setup data from the EEPROM is
"OK". If the data is "OK", then it is transferred to the CMOS. If the data is "not OK", then the
CMOS data is checked for validity. An error message is output if the CMOS data contains errors
and the boot procedure can be continued by pressing the <F1> key. To prevent the error
message from appearing at each restart, open the BIOS setup by pressing the <F2> key and re-
save the settings.
BIOS reads the system configuration information in CMOS RAM, checks the system, and
configures it using the Power On Self Test (POST).
When these "preliminaries" are finished, BIOS seeks an operating system in the data storage
devices available (hard drive, floppy drive, etc.). BIOS launches the operating system and hands
over control of system operations to it.
To enter BIOS setup, the F2 key must be pressed as soon as the following message appears on
the lower margin of the display (during POST):
Summary screen
After the POST, the summary screen displays the most important system characteristics.
Key Function
F2 Enters the BIOS setup menu.
ESC Cues the boot menu. Lists all bootable devices that are connected to the system. With cursor ↑ and
cursor ↓ and by pressing <ENTER>, select the device from which will be booted.
<Spacebar> Pressing the spacebar skips the system RAM check.
<Pause> Pressing the <pause> key stops the POST. Press any other key to resume the POST.
The following keys can be used after entering the BIOS setup:
Key Function
Cursor ↑ Moves to the previous item.
Cursor ↓ Go to the next item.
Cursor ← Move to the item on the left.
Cursor → Move to the item on the right.
<ESC> Exits the submenu.
PageUp ↑ Moves the cursor to the top of the current BIOS setup page.
PageDown ↓ Moves the cursor to the bottom of the current BIOS setup page.
<F1> or <Alt+H> Opens a help window showing the key assignments.
<F5> or <-> Scrolls to the previous option for the selected BIOS setting.
Section 4
Software
<F6> or <+> or <spacebar> Scrolls to the next option for the selected BIOS setting.
<F8> Load optimized default values for all pages.
<F9> Load setup default values for all pages.
<F10> Saves settings and closes BIOS setup.
<Enter> Opens submenu for a BIOS setup menu item, or displays the configurable values of a BIOS setup item.
The following sections explain the individual BIOS setup menu items in detail.
1.2.4 Main
Section 4
Software
LBA mode control This option activates the logical block Disabled Disables this function.
addressing for IDE. This function enables
support of drives larger than 540 MB. Enabled Enables this function.
Only possible when manually setting up
the drive.
Ultra DMA mode The data transfer rate to and from the IDE Disabled Disables this function. Do not use UDMA mode.
channel 0 master drive is defined here.
The DMA mode must be activated in the Mode 0 - Mode 5 Manual setting option for UDMA mode.
Windows device manager in order to
guarantee maximum performance. Only
possible when manually setting up the
drive.
SMART monitoring Indicates whether the IDE channel 0 Disabled No drive support, and function is deactivated.
master drive supports SMART
technology. Enabled Drive support present, and function is activated.
Table 248: 855GME (ETX) IDE Channel 0 Master setting options (Forts.)
Section 4
Software
LBA mode control This option activates the logical block Disabled Disables this function.
addressing for IDE. This function enables
support of drives larger than 540 MB. Enabled Enables this function.
Only possible when manually setting up
the drive.
Ultra DMA mode The data transfer rate to and from the IDE Disabled Disables this function. Do not use UDMA mode.
channel 0 slave drive is defined here. The
DMA mode must be activated in the Mode 0 - Mode 5 Manual setting option for UDMA mode.
Windows device manager in order to
guarantee maximum performance. Only
possible when manually setting up the
drive.
SMART monitoring Indicates whether the IDE channel 0 slave Disabled No drive support, and function is deactivated.
drive supports SMART technology.
Enabled Drive support present, and function is activated.
Table 249: 855GME (ETX) IDE Channel 0 Slave setting options (Forts.)
Section 4
Software
LBA mode control This option activates the logical block Disabled Disables this function.
addressing for IDE. This function enables
support of drives larger than 540 MB. Enabled Enables this function.
Only possible when manually setting up
the drive.
Ultra DMA mode The data transfer rate to and from the IDE Disabled Disables this function. Do not use UDMA mode.
channel 1 master drive is defined here.
The DMA mode must be activated in the Mode 0 - Mode 5 Manual setting option for UDMA mode.
Windows device manager in order to
guarantee maximum performance. Only
possible when manually setting up the
drive.
SMART monitoring Indicates whether the IDE channel 1 Disabled No drive support, and function is deactivated.
master drive supports SMART
technology. Enabled Drive support present, and function is activated.
Table 250: 855GME (ETX) IDE Channel 1 Master setting options (Forts.)
Section 4
Software
LBA mode control This option activates the logical block Disabled Disables this function.
addressing for IDE. This function enables
support of drives larger than 540 MB. Enabled Enables this function.
Only possible when manually setting up
the drive.
Ultra DMA mode The data transfer rate to and from the IDE Disabled Disables this function. Do not use UDMA mode.
channel 1 slave drive is defined here. The
DMA mode must be activated in the Mode 0 - Mode 5 Manual setting option for UDMA mode.
Windows device manager in order to
guarantee maximum performance. Only
possible when manually setting up the
drive.
SMART monitoring Indicates whether the IDE channel 1 slave Disabled No drive support, and function is deactivated.
drive supports SMART technology.
Enabled Drive support present, and function is activated.
Table 251: 855GME (ETX) IDE Channel 1 Slave setting options (Forts.)
Section 4
Software
1.2.5 Advanced
Section 4
Software
Figure 211: 855GME (ETX) - advanced chipset control
Information:
If EDID data older than V1.1 is read, it is not
passed on to the VGA BIOS
Disabled Disable graphics controller.
Information.
The onboard video controller must be
activated to make video output possible.
Deactivate only for use of an external PCI
graphics card.
with 5PC600.SX02-00 and Graphics engine 2 The primary video outputs are the display devices
5CP600.SX05-00 on the monitor/panel plug with system units
- Graphics engine 1: AP Link output 5PC600.SX02-00 and 5CP600.SX05-00.
- Graphics engine 2: Monitor / Panel
Information:
The "Primary graphics engine" setting
is only relevant from the booting of the
system until a graphics driver is
started (e.g. in Windows).
Graphics memory For setting how much of the main memory 1 MB 1 MB main memory to be used by the graphics
size (in MB) the graphics controller can use. controller.
UMA = 8 MB 8 MB main memory to be used by the graphics
controller.
UMA = 16 MB 16 MB main memory to be used by the graphics
controller.
UMA = 32 MB 32 MB main memory to be used by the graphics
controller.
Assign IRQ to VGA This is where an IRQ is reserved and Enabled Enables this function.
automatically assigned for the CPU
board's onboard graphics. Disabled Disables this function.
Table 253: 855GME (ETX) Advanced Chipset Control setting options (Forts.)
PCI/PNP Configuration
Section 4
Software
Figure 212: 815GME (ETX) - PCI/PNP configuration
Section 4
Software
Section 4
Software
BIOS setting Meaning Setting options Effect
ROM scan option Setting for the initialization of a device's Enabled Enables this function.
ROM.
Disabled Disables this function.
Enable master Sets the PCI device to be treated as the Enabled Enables this function.
PCI bus master. Not all PCI devices can
function as PCI bus master! Check device
description. Disabled Disables this function.
Latency timer This option controls how long one card Default Default setting. Default
can continue to use the PCI bus master
after another PCI card has requested 0020h, 0040h, 0060h, Value set manually.
access. 0080h, 00A0h, 00C0h,
00E0h
Section 4
Software
BIOS setting Meaning Setting options Effect
ROM scan option Setting for the initialization of a device's Enabled Enables this function.
ROM.
Disabled Disables this function.
Enable master Sets the PCI device to be treated as the Enabled Enables this function.
PCI bus master. Not all PCI devices can
function as PCI bus master! Check device
description. Disabled Disables this function.
Latency timer This option controls how long one card Default Default setting. Default
can continue to use the PCI bus master
after another PCI card has requested 0020h, 0040h, 0060h, Value set manually.
access. 0080h, 00A0h, 00C0h,
00E0h
Memory cache
Section 4
Software
Write protect Memory content is mapped in the cache.
Write back Memory content is mapped only when necessary.
Cache DC00 - DFFF Configure how the memory content of Disabled No mapping.
DC00-DFFF should be mapped.
Write through Memory content is simultaneously mapped in the
cache and written to the main memory.
Write protect Memory content is mapped in the cache.
Write back Memory content is mapped only when necessary.
Cache E000 - E3FF Configure how the memory content of Disabled No mapping.
E00-E3FF should be mapped.
Write through Memory content is simultaneously mapped in the
cache and written to the main memory.
Write protect Memory content is mapped in the cache.
Write back Memory content is mapped only when necessary.
Cache E400 - E7FF Configure how the memory content of Disabled No mapping.
E400-E7FF should be mapped.
Write through Memory content is simultaneously mapped in the
cache and written to the main memory.
Write protect Memory content is mapped in the cache.
Write back Memory content is mapped only when necessary.
Secondary IDE Setup the data transfer rate for a device Disabled The maximum data transfer rate is UDMA33.
UDMA66/100 connected to the secondary IDE channel.
This option is only available when a Enabled The maximum data transfer rate is UDMA66.
secondary IDE drive is connected.
Section 4
Software
Onboard LAN For turning the ICH4 on-board LAN Disabled Deactivates the LAN controller or the ETH1
controller controller (for ETH1) on and off. interface.
Enabled Activates the LAN controller or the ETH1
interface.
Onboard LAN PXE For turning the remote boot BIOS Disabled Disables this function.
ROM extension for the onboard LAN controller
(ETH1) on and off. Enabled Enables this function.
Serial port A For the configuration of serial port A Disabled Port A deactivated.
(COM1).
Enabled Port A activated. The base I/O addresses and the
interrupt must then be configured manually.
Auto Either BIOS or the operating system configures
the port automatically.
Base I/O address Selection of the base I/O address for port 3F8, 2F8, 3E8, 2E8 Base I/O address is manually assigned.
A.
A yellow star indicates a conflict with
another device.
Interrupt Selection of the interrupt for port A. IRQ 3, IRQ 4 Manual assignment of the interrupt.
A yellow star indicates a conflict with
another device.
Table 260: 855GME (ETX) I/O Device Configuration setting options (Forts.)
Table 260: 855GME (ETX) I/O Device Configuration setting options (Forts.)
Keyboard features
Section 4
Software
BIOS setting Meaning Setting options Effect
NumLock This option sets the status On Numeric keypad is enabled.
of the numeric keypad when the the
system is booted. Off Only the cursor functions of the numerical keypad
are activated.
Auto Numeric keypad is activated, if present.
Key click Using this option, the clicking of the keys Disabled Disables this function.
can be turned on or off.
Enabled Enables this function.
Keyboard auto- For setting the speed of repetition when a 30/sec, 26.7/sec, Settings from 2 to 30 characters per second.
repeat rate key is held down. 21.8/sec, 18.5/sec,
13.3/sec, 10/sec, 6/sec,
2/sec
Keyboard auto- For setting the amount of delay after the 1/4 sec, 1/2 sec, 3/4 sec, Setting of the desired delay.
repeat delay key is pressed before the auto-repeat 1 sec
begins.
Information:
The displayed voltage values (e.g. core voltage, battery voltage) on this BIOS Setup
page represent uncalibrated information values. These cannot be used to draw any
conclusions about any hardware alarms or error conditions. The hardware
components used have automatic diagnostics functions that can be applied in the
event of error.
Miscellaneous
Section 4
Software
BIOS setting Meaning Setting options Effect
Summary screen Set whether or not the system summary Enabled Enables this function.
screen should open when the system is
started (see figure 204 "855GME (ETX) Disabled Disables this function.
BIOS Summary Screen", on page 426).
QuickBoot mode Speeds up the booting process by Enabled Enables this function.
skipping several tests.
Disabled Disables this function.
Extended memory This function determines the method by Just zero it The main memory is quickly tested.
testing which the main memory over 1 MB is
tested. None The main memory is not tested at all.
Normal This option is only available when the function
"QuickBoot Mode" has been set to "disabled."
The main memory is tested more slowly than with
"Just zero It."
Dark boot Sets whether the diagnostics screen (see Enabled Enables this function. The diagnostics screen is
figure 203 "855GME (ETX) BIOS not displayed.
Diagnostics Screen", on page 426) should
be displayed when the system is started. Disabled Disables this function. The diagnostics screen is
displayed.
Panel Control
Baseboard Monitor
Legacy Devices
Versions
BIOS: R130
MTCX PX32: V1.63
MTCX FPGA: V1.19
Section 4
Software
Panel control
Temperatures
I/O: 46°C/117°F
Power Supply: 38°C/100°F
Slide-In Drive 1: 32°C/90°F
Slide-In Drive 2: 00°C/32°F
Fan Speeds
Case 1: 00 RPM
Case 2: 00 RPM
Case 3: 00 RPM
Case 4: 00 RPM
CPU: 00 RPM
Section 4
Software
BIOS setting Meaning Setting options Effect
CMOS battery The status of the built-in CMOS battery is None -
displayed here.
Possible displays:
N/A - Not Available, GOOD - Battery OK,
BAD - Battery must be replaced.
For additional information on when status
displays are shown, see "Battery", on
page 158
I/O Displays the temperature in the I/O area in None -
degrees Celsius and Fahrenheit.
Power supply Displays the temperature in the power None -
supply area in degrees Celsius and
Fahrenheit.
Slide-in drive 1 Displays the temperature of the slide-in None -
drive 1 in degrees Celsius and Fahrenheit.
Slide-in drive 2 Displays the temperature of the slide-in None -
drive 2 in degrees Celsius and Fahrenheit.
Case 1 Displays the fan speed of housing fan 1. None -
Case 2 Displays the fan speed of housing fan 2. None -
Legacy devices
Section 4
Software
BIOS setting Meaning Setting options Effect
COM C Settings for the internal serial interfaces in Disabled Disables the interface.
the system. This setting activates the
touch screen in panel PC 700 systems, Enabled Enables the interface.
and, using SDL transfer technology, also
in Automation Panel 900 display units.
Base I/O address Selection of the base I/O address for the 238, 2E8, 2F8, 328, 338, Selected base I/O address is assigned.
COM C port. 3E8, 3F8
A yellow star indicates a conflict with
another device.
Interrupt Selection of the interrupt for the COM C IRQ 3, IRQ 4, IRQ 5, IRQ Selected interrupt is assigned.
port. 7, IRQ 10, IRQ 11, IRQ
A yellow star indicates a conflict with 12
another device.
COM D Configuration of the COM D port for the Disabled Disables the interface.
serial interface of an automation panel link
slot. The interface is used to operate the
touch screen on connected Automation Enabled Enables the interface.
Panel 900 units.
1.2.6 Security
Section 4
Software
BIOS setting Meaning Setting options Effect
Supervisor Displays whether or not a supervisor None Display set: A supervisor password has been set.
password is password has been set. Display clear: No supervisor password has been
set.
User password is Displays whether or not a user password None Display set: A user password has been set.
has been set. Display clear: No user password has been set.
Set supervisor To enter/change a supervisor password. Enter Press Enter and enter password two times. The
password A supervisor password is necessary to maximum 7 password must be 7 alphanumeric characters or
edit all BIOS settings. alphanumeric characters less.
- not case sensitive. Needed to enter BIOS setup.
To change the password, enter the old password
once and then the new password twice.
Set user password To enter/change a user password. A user Enter Press Enter and enter password two times. The
password allows the user to edit only maximum 7 password must be 7 alphanumeric characters or
certain BIOS settings. alphanumeric characters less.
- not case sensitive. Needed to enter BIOS setup.
To change the password, enter the old password
once and then the new password twice.
Virus check This function opens a reminder when the Disabled Disables this function.
reminder system is started to scan for viruses.
Daily A reminder appears every day when the system
is started.
Weekly A reminder appears the first time the system is
started after every Sunday.
Monthly A reminder appears the first time the system is
started each month.
System backup This function opens a reminder when the Disabled Disables this function.
reminder system is started to create a system
backup. Daily A reminder appears every day when the system
is started.
Weekly A reminder appears the first time the system is
started after every Sunday.
Monthly A reminder appears the first time the system is
started each month.
Password at boot This function requires a supervisor or user Disabled Disables this function.
password when the system is started.
Only possible when a supervisor or user Enabled Enables this function.
password is enabled.
1.2.7 Power
Section 4
Software
Figure 227: 855GME (ETX) Power menu
Resume on time This function enables the system to start Off Disables this function.
at the time set under "resume time."
On Enables this function.
Resume time Time setting for the option "resume on [00:00:00] Personal setting of the time in the format
time" (when the system should start up). (hh:mm:ss).
Power supply The type of power supply being used can ATX An ATX compatible power supply is being used.
be entered here.
AT An AT compatible power supply is being used.
Power button This option determines the function of the Power off Shuts down the system.
Function power button.
Sleep The system enters sleep mode.
Power Loss Control This option determines how the system Stay off The system does not turn back on. The system
reacts to a power outage. remains off until the power button is pressed.
Power-on The system turns back on.
Last State The system resumes the last state it was in
before the power outage.
ACPI control
Section 4
Software
Native IDE Support: [Disabled]
Information:
This function is not supported by MS-
DOS.
Information:
This function is not supported by MS-
DOS.
APIC - I/O APIC This option controls the functionality of the Disabled Disables the function
mode advanced interrupt controller in the
processor. Enabled Enables this function.
The activation of this option is only effective if it
takes place before the operating system
(Windows XP) is activated.
There are then 23 IRQs available.
Native IDE support The native IDE support offers the Disabled Disables this function.
possibility to make 4 hard disk controllers
(2 x primary ATA for a total of 4 devices,
and 2 x secondary ATA for another 2 Enabled Enables this function.
devices) accessible through Windows XP.
Information:
This function is not supported by MS-
DOS.
1.2.8 Boot
Section 4
Software
BIOS setting Meaning Setting options Effect
1: IDE 0, IDE 1, Use the up arrow ↑ and down arrow ↓, to select
IDE 2, IDE 3, a device. Then, use the <+> und <-> keys to
2: IDE CD change the boot priority of the drive.
3: USB FDC, USB KEY
To add a device to the "boot priority order" list
USB CDROM
4: from the "excluded from boot order" list, use the
USB HDD, USB ZIP
<x> key. In the same way, the <x> key can move
USB LS120,
5: boot devices down out of the boot priority order.
PCI BEV, PCI SCSI,
The keys 1 - 4 can load preset boot sequences.
6: bootable add-in cards
7:
8:
1.2.9 Exit
Information:
Only shown if "Save Optimized
Defaults" has been executed.
Load setup defaults This item loads the BIOS setup defaults, Yes / No
which are defined by the DIP switch
settings. These settings are loaded for all
BIOS configurations.
Section 4
Software
If the function "load setup defaults" is chosen in the main BIOS setup menu, or if exit is selected
(or <F9> is pressed) in the individual setup screens, the following BIOS default settings are the
optimized values that will be used.
DIP switch position see Section 1.6 "Location of the DIP switch in APC620 system units", on
page 546).
ON DIP
39
1 2 3 4 5 6 7 8
The first six DIP switches (1-6) are used to set the profiles. The rest (7,8) are reserved.
1) Reserved.
The following pages provide an overview of the BIOS default settings for the different DIP switch
configurations.
Personal settings
If changes have been made to the BIOS defaults, they can be entered in the following tables for
backup.
Main
System Time - - - - -
System Date - - - - -
Multi-sector transfer - - - - -
Transfer mode - - - - -
Multi-sector transfer - - - - -
Transfer mode - - - - -
Section 4
Software
Type Auto Auto Auto Auto Auto
Multi-sector transfer - - - - -
Transfer mode - - - - -
Multi-sector transfer - - - - -
Transfer mode - - - - -
Advanced
Graphics engine Graphics engine 1 Graphics engine 1 Graphics engine 1 Graphics engine 1 Graphics engine 1
Table 275: 855GME (ETX) - advanced chipset/graphics control - profile settings overview
PCI/PNP Configuration
PCI device, slot #1 Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Personal settings
Table 276: 855GME (ETX) PCI/PNP Configuration Profile settings overview (Forts.)
Memory cache
Cache system BIOS area Write protect Write protect Write protect Write protect Write protect
Cache video BIOS area Write protect Write protect Write protect Write protect Write protect
Cache base 0-512k Write back Write back Write back Write back Write back
Cache base 512-640k Write back Write back Write back Write back Write back
Cache extended memory Write back Write back Write back Write back Write back
area
Cache D000 - D3FF Disabled Disabled Disabled Disabled Disabled
Section 4
Software
Cache D800 - DBFF Disabled Disabled Disabled Disabled Disabled
Table 278: 855GME (ETX) I/O Device Configuration Profile settings overview
Keyboard features
NumLock On On On On On
Keyboard auto-repeat delay 1/2 sec 1/2 sec 1/2 sec 1/2 sec 1/2 sec
5Vsb voltage - - - - -
Battery voltage - - - - -
CPU temperature - - - - -
Table 280: 855GME (ETX) - CPU board monitor - profile setting overview
Miscellaneous
Extended memory testing Just zero it Just zero it Just zero it Just zero it Just zero it
Section 4
Main Board/Panel Features
Software
Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Personal settings
Versions - - - - -
BIOS - - - - -
MTCX - - - - -
FPGA - - - - -
Optimized ID - - - - -
Device ID - - - - -
Compatibility ID - - - - -
Serial Number - - - - -
Product name - - - - -
User serial ID - - - - -
Panel control
Select panel number 0 0 0 0 0
Version - - - - -
Temperature - - - - -
Fan speed - - - - -
Keys/LEDs - - - - -
Temperatures - - - - -
I/O - - - - -
Power supply - - - - -
Slide-in drive 1 - - - - -
Slide-in drive 2 - - - - -
Fan speeds - - - - -
Case 1 - - - - -
Case 2 - - - - -
Case 3 - - - - -
Case 4 - - - - -
CPU - - - - -
Legacy devices
COM C Disabled Enabled Disabled Enabled Enabled
Interrupt - 11 - 11 11
Interrupt - - - - -
Interrupt - - - - -
Interrupt - - - - -
Table 282: 855GME (ETX) Baseboard/Panel Features profile settings overview (Forts.)
Security
Power
Standby timeout - - - - -
Section 4
Software
Auto suspend timeout - - - - -
Power button function Power off Power off Power off Power off Power off
ACPI control
Active trip point Disabled Disabled Disabled Disabled Disabled
Boot
5: USB KEY USB FDD USB KEY USB KEY USB KEY
6: USB CDROM USB KEY USB CDROM USB CDROM USB CDROM
8: - - IDE 3 - IDE 3
: USB HDD USB HDD USB LS120 USB HDD USB LS120
: USB ZIP USB ZIP PCI BEV USB ZIP PCI BEV
: USB LS120 USB LS120 PCI SCSI USB LS120 PCI SCSI
: PCI BEV PCI SCSI Bootable add-in PCI BEV Bootable add-in
cards cards
Information:
• The following diagrams and BIOS menu items including descriptions refer to
BIOS version 1.16. It is therefore possible that these diagrams and BIOS
descriptions do not correspond with the installed BIOS version.
• The setup defaults are the settings recommended by B&R. The setup defaults
are dependant on the DIP switch configuration on the baseboard (see section
1.3.10 "Profile overview - BIOS default settings - 855GME (XTX)", on
page 527).
BIOS stands for "Basic Input Output System". It is the most basic standardized communication
between the user and the system (hardware). The BIOS system used in the Automation PC 620
systems is produced by American Megatrends Inc.
The BIOS Setup Utility lets you modify basic system configuration settings. These settings are
stored in CMOS and in EEPROM (as a backup).
The CMOS data is buffered by a battery, and remains in the APC620 even when the power is
turned off (no 24VDC supply).
Section 4
Software
BIOS is immediately activated when switching on the power supply of the Automation PC 620
system or pressing the power button. The system checks if the setup data from the EEPROM is
"OK". If the data is "OK", then it is transferred to the CMOS. If the data is "not OK", then the
CMOS data is checked for validity. An error message is output if the CMOS data contains errors
and the boot procedure can be continued by pressing the <F1> key. To prevent the error
message from appearing at each restart, open the BIOS setup by pressing the <Del> key and
re-save the settings.
BIOS reads the system configuration information in CMOS RAM, checks the system, and
configures it using the Power On Self Test (POST).
When these "preliminaries" are finished, BIOS seeks an operating system in the data storage
devices available (hard drive, floppy drive, etc.). BIOS launches the operating system and hands
over control of system operations to it.
To enter BIOS Setup, the DEL key must be pressed as soon as the following message appears
on the monitor (during POST):
Key Function
ESC The system RAM check can be skipped by pressing ESC.
Del Enters the BIOS setup menu.
F12 Using the F12 key, you can boot from the network.
F11 Cues the boot menu. Lists all bootable devices that are connected to the system. With cursor ↑ and
cursor ↓ and by pressing <ENTER>, select the device from which will be booted.
<Pause> Pressing the <pause> key stops the POST. Press any other key to resume the POST.
The following keys can be used after entering the BIOS setup:
Key Function
F1 General help
Cursor ↑ Moves to the previous item.
Cursor ↓ Go to the next item.
Cursor ← Moves to the previous item.
Cursor → Go to the next item.
+- Changes the setting of the selected function.
Table 287: 855GME (XTX) keys relevant to BIOS in the BIOS menu
Key Function
Enter Changes to the selected menu.
PageUp ↑ Change to the previous page.
PageDown ↓ Change to the previous page.
Pos 1 Jumps to the first BIOS menu item or object.
End Jumps to the last BIOS menu item or object.
F2 / F3 The colors of the BIOS Setup are switched.
F7 Changes are reset.
F9 These settings are loaded for all BIOS configurations.
F10 Save and close.
Esc Exits the submenu.
Table 287: 855GME (XTX) keys relevant to BIOS in the BIOS menu (Forts.)
The following sections explain the individual BIOS main menu items in detail.
Section 4
Software
Table 288: Overview of 855GME (XTX) BIOS menu items
1.3.4 Main
Immediately after the DEL button is pressed during startup, the main BIOS setup menu appears.
1.3.5 Advanced
Advanced Settings
ACPI Configuration
PCI Configuration
Graphics Configuration
CPU Configuration
Chipset Configuration
I/O Interface Configuration
Clock Configuration
IDE Configuration
USB Configuration
Keyboard/Mouse Configuration Select Screen
Remote Access Configuration Select Item
CPU Board Monitor Enter Go to Sub Screen
Baseboard/Panel Features F1 General Help
F10 Save and Exit
ESC Exit
Section 4
Software
v02.57 (C)Copyright 1985-2004, American Megatrends, Inc.
ACPI configuration
ACPI APIC support This option controls the support of the Enabled Enables this function.
advanced programmable interrupt
controller in the processor. Disabled Disables the function
Active Cooling Trip With this function, an optional CPU fan Disabled Disables this function.
Point above the operating system can be set to
turn on when the CPU reaches the set 50°C, 60°C, 70°C, 80°C, Temperature setting for the active trip point.
temperature. 90°C Can be set in increments of 10°C.
Passive Cooling Trip With this function, a temperature can be Disabled Disables this function.
Point set at which the CPU automatically
reduces its speed. 50°C, 60°C, 70°C, 80°C, Temperature setting for the active trip point.
90°C Can be set in increments of 10°C.
Critical Trip Point With this function, a temperature can be 80°C, 85°C, 90°C, 95°C, Temperature setting for the critical trip point.
set at which the system automatically 100°C, 105°C, 110°C Can be set in increments of 5°C.
shuts itself down.
Watchdog ACPI System monitoring of the ACPI function. Shutdown The system is shut down.
event
Restart Restarts the system.
GPE1 function Setting the GPE1 function. No function Not used.
Lid switch -
GPE2 function Setting the GPE2 function. No function Not used.
Sleep button -
Section 4
Software
Table 291: 855GME (XTX) Advanced ACPI Configuration setting options
PCI Configuration
PIRQ A Under this option, the external PCI Auto The interrupt is automatically assigned according
(UHCI1+VGA) interrupt A is assigned to an ISA interrupt. to Plug & Play guidelines.
5, 6, 7, 8, 9, 10, 11, 12 Manual configuration of the IRQ.
PIRQ B Under this option, the external PCI Auto The interrupt is automatically assigned according
(INTD+AC97+SMBu interrupt B is assigned to and ISA to Plug & Play guidelines.
s) interrupt.
5, 6, 7, 8, 9, 10, 11, 12 Manual configuration of the IRQ.
Information:
Is only displayed if a PIRQ is manually
set (e.g. 5).
Section 4
Software
2nd exclusive PCI With this option you can determine if the None No interrupt is assigned.
IRQ IRQ assigned to the PIRQ x is handled
exclusively (no IRQ sharing). x Assigns the PIRQ as 2nd exclusive PCI IRQ.
Information:
Only displayed when two PIRQs are set
manually.
3rd exclusive PCI With this option you can determine if the None No interrupt is assigned.
IRQ IRQ assigned to the PIRQ x is handled
exclusively (no IRQ sharing). x Assigns the PIRQ as 3rd exclusive PCI IRQ.
Information:
Only displayed in connection with
"Profile 5" and if three PIRQs are set
manually.
Table 292: 855GME (XTX) Advanced PCI Configuration setting options (Forts.)
Graphics configuration
Section 4
Software
video controller.
Init. Graphic adapter This option allows you to set which PCI/Int-VGA PCI/Int-VGA adapter is first installed.
priority graphics card should be initialized first.
Internal VGA Internal VGA adapter is first installed.
Graphics aperture Reserves a memory location in the RAM 64MB, 128MB, 256MB Value set manually.
size for the graphics card.
Information:
The size with the best performance is
the same size as the working memory.
DVI HotPlug Affects both graphics engines. When Enabled Enables this function.
persistence enabled, the operating system graphics
driver attempts to restore the most recent Disabled Disables this function.
configuration.
Table 293: 855GME (XTX) Advanced Graphics Configuration setting options (Forts.)
CPU configuration
Chipset configuration
Select Screen
Select Item
+- Change Option
F1 General Help
F10 Save and Exit
ESC Exit
Section 4
Software
BIOS setting Meaning Setting options Effect
IOAPIC This option is used to activate or Disabled Deactivates this function.
deactivate the APIC (Advanced
Programmable Interrupt Controller). Enabled Activates this function.
Information:
The IRQ resources available to the
system are expanded when the APIC
mode is enabled.
APIC ACPI SCI IRQ This option is used to activate or Disabled Deactivates this function.
deactivate the APIC (Advanced
Programmable Interrupt Controller). Enabled Activates this function.
Information:
The IRQ resources available to the
system are expanded when the APIC
mode is enabled.
Select Screen
Select Item
+- Change Option
F1 General Help
F10 Save and Exit
ESC Exit
Table 296: 855GME (XTX) Advanced I/O Interface Configuration setting options
Information:
Only visible if the "Serial Port2 Mode"
function is set to IrDA or ASK IR.
Parallel port address The address of the parallel interface can Disabled Deactivates the port.
be defined with this option.
378, 278, 3BC Manual assignment of the port address.
Information:
Address is automatically set, even if
the function is disabled.
Table 296: 855GME (XTX) Advanced I/O Interface Configuration setting options (Forts.)
Section 4
Software
Clock Configuration
Select Screen
Select Item
+- Change Option
F1 General Help
F10 Save and Exit
ESC Exit
Unused PCI slot This option activates or deactivates the Disabled Disables this function.
clocks unused PCl slot cycle.
Enabled Enables this function.
IDE Configuration
Section 4
Software
BIOS setting Meaning Setting options Effect
OnBoard PCI IDE Both the IDE controllers found on the Disabled Disables this function.
controller board can be configured here.
Primary Activates the primary IDE channel.
Secondary Activates the secondary IDE channel.
Both Activates both IDE channels (primary and
secondary).
OnBoard PCI IDE The PCI IDE operate mode found on the Legacy mode Activates legacy mode
operate mode board is configured here.
Native mode Activates the native mode (suited for Windows
XP and Windows 2000).
Primary IDE Master The drive in the system that is connected Enter Opens the submenu
to the IDE primary master port is See "Primary IDE Master", on page 498
configured here.
Primary IDE slave The drive in the system that is connected Enter Opens the submenu
to the IDE primary slave port is configured See "Primary IDE slave", on page 500
here.
Secondary IDE The drive in the system that is connected Enter Opens the submenu
Master to the IDE secondary master port is See "Secondary IDE Master", on page 501
configured here.
Table 298: 855GME (XTX) Advanced IDE Configuration setting options (Forts.)
Type [Auto]
LBA/Large Mode [Auto]
Block (Multi-Sector Transfer) [Auto]
PIO Mode [Auto]
DMA Mode [Auto]
S.M.A.R.T. [Auto]
32Bit Data Transfer [Enabled]
Select Screen
Select Item
+- Change Option
F1 General Help
F10 Save and Exit
ESC Exit
Section 4
Software
technology). Disabled Disables this function.
Enabled Enables this function.
32 Bit Data Transfer This function enables 32-bit data transfer. Disabled Disables this function.
Enabled Enables this function.
Type [Auto]
LBA/Large Mode [Auto]
Block (Multi-Sector Transfer) [Auto]
PIO Mode [Auto]
DMA Mode [Auto]
S.M.A.R.T. [Auto]
32Bit Data Transfer [Enabled]
Select Screen
Select Item
+- Change Option
F1 General Help
F10 Save and Exit
ESC Exit
Type [Auto]
LBA/Large Mode [Auto]
Section 4
Software
Block (Multi-Sector Transfer) [Auto]
PIO Mode [Auto]
DMA Mode [Auto]
S.M.A.R.T. [Auto]
32Bit Data Transfer [Enabled]
Select Screen
Select Item
+- Change Option
F1 General Help
F10 Save and Exit
ESC Exit
Type [Auto]
LBA/Large Mode [Auto]
Block (Multi-Sector Transfer) [Auto]
PIO Mode [Auto]
DMA Mode [Auto]
S.M.A.R.T. [Auto]
32Bit Data Transfer [Enabled]
Select Screen
Select Item
+- Change Option
F1 General Help
F10 Save and Exit
ESC Exit
Section 4
Software
BIOS setting Meaning Setting options Effect
Type The type of drive connected to the Not installed No drive installed.
secondary slave is configured here.
Auto Automatic recognition of the drive and setup of
appropriate values.
CD/DVD CD -/ DVD drive
ARMD ARMD - drive (zip drive)
LBA/Large Mode This option activates the logical block Disabled Disables this function.
addressing / large mode for IDE.
Auto Automatic enabling of this function when
supported by the system.
Block (Multi-Sector This option enables the block mode for Disabled Disables this function.
Transfer) IDE hard drives. When this option is
enabled, the number of blocks per request Auto Automatic enabling of this function when
from the configuration sector of the hard supported by the system.
drive is read.
PIO Mode The PIO mode determines the data rate of Auto Automatic configuration of PIO mode.
the hard drive.
0, 1, 2, 3, 4 Manual configuration of PIO mode.
Information:
The higher the PIO mode, the shorter
the data cable must be.
Table 302: 855GME (XTX) Secondary IDE Slave setting options (Forts.)
USB configuration
Section 4
Software
activated/deactivated here.
Disabled Disables this function.
USB 2.0 Controller Settings can be made for the USB Full Speed 12 MBps
Mode controller.
Hi Speed 480 MBps
BIOS EHCI Hand- The support for the operating system can Disabled Disables the function
Off be set up without the fully automatic EHCI
function. Enabled Enables this function.
USB Beep Message The warning tone can be Disabled Disables this function.
activated/deactivated here.
Enabled Enables this function.
USB Stick Default You can set how the USB device is to be Auto USB devices with fewer than 530MB of memory
Emulation used. are simulated as floppy disk drives and devices
with larger capacities are simulated as hard
drives.
Hard Disk An HDD-formatted drive can be used as an FDD
(e.g. zip drive) for starting the system.
Information:
The message "No USB mass storage
device detected" is displayed if no USB
memory device has been installed.
USB mass storage This is where the USB mass memory Enter Opens the submenu
device device is configured. See "USB mass storage device configuration", on
configuration page 507
Information:
Is only visible when the "USB stick
default emulation" function is set to
AUTO.
Table 303: 855GME (XTX) Advanced USB Configuration setting options (Forts.)
Select Screen
Select Item
+- Change Option
F1 General Help
F10 Save and Exit
ESC Exit
Section 4
Software
BIOS setting Meaning Setting options Effect
Emulation type With this option, the device to be plugged Auto Automatic selection of the function.
into the USB interface can be selected.
Floppy Using a floppy disk drive.
Forced FDD A hard disk image is connected as a floppy
image. Functions only in the FAT12, FAT16 or
FAT32 formats.
Hard Disk Using a hard disk
CDROM Using a CD-ROM drive, it is assumed as
'bootable'.
Keyboard/mouse configuration
Select Screen
Select Item
+- Change Option
F1 General Help
F10 Save and Exit
ESC Exit
Section 4
Software
BIOS setting Meaning Setting options Effect
Remote access The remote access function can be Disabled Disables this function.
enabled/disabled here.
Enabled Enables this function.
Serial port number The serial interface can be set using this COM1 Activates the COM1 interface.
option, as long as disabled is not entered
in the remote access field. COM2 Activates the COM2 interface.
Base address, IRQ Serial connection display for the logical None -
address and interrupt, as long as disabled
is not entered in the remote access field.
Serial port mode The serial interface transfer rate is defined 115200 8,n,1 Value set manually.
here, as long as disabled is not entered in 57600 8,n,1
the remote access field. 38400 8,n,1
19200 8,n,1
09600 8,n,1
Table 306: 855GME (XTX) - advanced remote access configuration - setting options
Serial port BIOS During system start up, the update is Disabled Disables this function.
update loaded via the serial interface in the
processor. Enabled Enables this function.
Information:
If this option is disabled, the boot time
is reduced.
Table 306: 855GME (XTX) - advanced remote access configuration - setting options (Forts.)
Information:
The displayed temperature and voltage values (e.g. CPU temperature, core voltage,
battery voltage) on this BIOS Setup page represent uncalibrated information values.
These cannot be used to draw any conclusions about any hardware alarms or error
conditions. The hardware components used have automatic diagnostics functions
that can be applied in the event of error.
VcoreA :1.193 V
VcoreB :2.596 V
+3.3Vin :3.403 V
+5Vin :5.080 V
+5VSB :4.898 V
VBAT :3.322 V
Select Screen
Select Item
Section 4
F1 General Help
Software
F10 Save and Exit
ESC Exit
Table 307: 855GME (XTX) - advanced remote access configuration - setting options
Table 307: 855GME (XTX) - advanced remote access configuration - setting options
Baseboard/Panel Features
Panel Control
Baseboard Monitor
Legacy Devices
Versions
BIOS: R114
MTCX PX32: V1.63
MTCX FPGA: V1.19
Table 308: 855GME (XTX) Advanced Baseboard/Panel Features setting options (Forts.)
Section 4
Software
Panel control
Select Screen
Select Item
+- Change Option
F1 General Help
F10 Save and Exit
ESC Exit
Baseboard Monitor
Temperatures
I/O: 45°C/113°F
Power Supply: 39°C/102°F
Slide-In Drive 1: 00°C/32°F
Slide-In Drive 2: 00°C/32°F
Fan Speeds
Case 1: 00 RPM
Case 2: 00 RPM
Case 3: 00 RPM
Case 4: 00 RPM Select Screen
CPU: 00 RPM Select Item
F1 General Help
F10 Save and Exit
ESC Exit
Section 4
Software
BIOS setting Meaning Setting options Effect
CMOS battery Displays the battery status. None -
n.a. - not available, either MTCX does not
support the firmware (starting with these
versions "Main Board/Panel Features", on
page 512) or the hardware is too old.
Good - Battery is OK
Bad - Battery is damaged.
I/O Displays the temperature in the I/O area None -
in degrees Celsius and Fahrenheit.
Power supply Displays the temperature in the power None -
supply area in degrees Celsius and
Fahrenheit.
Slide-in drive 1 Displays the temperature of the slide-in None -
drive 1 in degrees Celsius and Fahrenheit.
Slide-in drive 2 Displays the temperature of the slide-in None -
drive 2 in degrees Celsius and Fahrenheit.
Case 1 Displays the fan speed of housing fan 1. None -
Case 2 Displays the fan speed of housing fan 2. None -
Case 3 Displays the fan speed of housing fan 3. None -
Case 4 Displays the fan speed of housing fan 4. None -
Legacy devices
Section 4
Software
A yellow star indicates a conflict with
another device.
ETH2 LAN controller For turning the onboard LAN controller Disabled Disables the controller.
(ETH2) on and off. Enabled Enables the controller.
ETH2 MAC Address Displays the Ethernet 2 controller MAC None -
address.
1.3.6 Boot
Add-On ROM Sets the display mode for the ROM Force BIOS An additional BIOS part can be displayed.
Display Mode (during the booting procedure).
Keep Current BIOS information is displayed.
Halt On Error This option sets whether the system Disabled The system does not pause. All errors are
should pause the Power On Self Test ignored.
(POST) when it encounters an error.
Enabled The system pauses. The system pauses every
time an error is encountered.
Hit 'DEL' Message Settings can be made here for the "Hit Disabled The message is not displayed.
Display 'DEL' Message" display.
Enabled The message is displayed.
Information:
When quiet boot is activated the
message is not displayed.
Interrupt 19 Capture This function can be used to incorporate Disabled Disables this function.
the BIOS interrupt.
Enabled Enables this function.
PXE boot to LAN Activating/Deactivating the function to Disabled Disables this function.
(ETH1) boot from LAN.
Enabled Enables this function.
Power Loss Control Determines if the system is on/off Remain Off Remains off.
following power loss.
Turn On Powers on.
Last State Enables the previous state.
Section 4
Software
Table 312: 855GME (XTX) Boot menu setting options (Forts.)
1.3.7 Security
Information:
With this option, only the boot sector is
protected, not the entire hard drive.
Hard disk security The hard disk security user password can Enter Opens the submenu
user password be created here. See "Hard disk security user password", on
page 521
Select Screen
Select Item
F1 General Help
Section 4
Software
F10 Save and Exit
ESC Exit
Select Screen
Select Item
F1 General Help
F10 Save and Exit
ESC Exit
1.3.8 Power
Section 4
Software
BIOS setting Meaning Setting options Effect
Power This option switches the APM function on Disabled Disables this function.
Management/APM or off. This is an advanced plug & play and
power management functionality. Enabled Enables this function.
Video Power Down This option allows you to set the energy Disabled Do not switch off the monitor.
Mode saving mode for the monitor.
Standby Monitor goes to standby mode.
Suspend Monitor goes to suspend mode.
Hard Disk Power This option allows you to set the energy Disabled Do not switch off the hard drive.
Down Mode saving mode for the hard drive.
Standby Monitor goes to standby mode.
Suspend Hard drive goes to suspend mode.
Standby time out Using this option, you can configure how Disabled Disables this function.
long the system stays inactive until
standby mode is executed. 1 min, 2 min, 4 min, 8 Value set manually.
min, 10 min, 20 min 30
min, 40 min;
Resume on PME# With this option, you can switch the PME Disabled Disables this function.
wakeup function on or off.
Enabled Enables this function.
Resume On RTC With this option, you can activate the Disabled Disables this function.
Alarm alarm and enter the date and time for the
system start. Enabled Enables this function.
RTC alarm date Setting the date for the system start. Every day System starts daily.
(days)
Information: 01-31 System start takes place on the manually set
date.
Setting with "+"/"-".
1.3.9 Exit
Select Screen
Select Item
Enter Go to Sub Screen
F1 General Help
F10 Save and Exit
ESC Exit
Section 4
Software
v02.57 (C)Copyright 1985-2004, American Megatrends, Inc.
Discard Changes With this item you can close BIOS setup OK / Cancel
and Exit without saving the changes made. The
system is then rebooted.
If the function "load setup defaults" is chosen in the main BIOS setup menu, or if exit is selected
(or <F9> is pressed) in the individual setup screens, the following BIOS default settings are the
optimized values that will be used.
DIP switch position see Section 1.6 "Location of the DIP switch in APC620 system units", on
page 546).
ON DIP
39
1 2 3 4 5 6 7 8
The first six DIP switches (1-6) are used to set the profiles. The rest (7,8) are reserved.
Section 4
Profile 2 Automation PC 620 system units 5PC600.SX02-00, 5PC600.SX02- Off On Off Off Off Off - -
Software
01, 5PC600.SF03-00, 5PC600.SX05-00 and 5PC600.SX05-01.
Profile 3 Panel PC 700 system unit 5PC720.1043-00, 5PC720.1214-00, On On Off Off Off Off - -
5PC720.1505-00, 5PC720.1706-00, 5PC720.1906-00,
5PC781.1043-00, 5PC781.1505-00 and 5PC782.1043-00.
Profile 4 Panel PC 700 system unit 5PC720.1043-01, 5PC720.1214-01, Off Off On Off Off Off - -
5PC720.1505-01 and 5PC720.1505-02.
Profile 5 Automation PC 620 embedded system units 5PC600.SE00-00 und On Off On Off Off Off - -
5PC600.SE00-01
1) Reserved.
The following pages provide an overview of the BIOS default settings for the different DIP switch
configurations. Settings highlighted in yellow are variations from the BIOS default profile (=profile
0).
Personal settings
If changes have been made to the BIOS defaults, they can be entered in the following tables for
backup.
Main
System Time - - - - - -
System Date - - - - - -
BIOS ID - - - - - -
Processor - - - - - -
CPU Frequency - - - - - -
System Memory - - - - - -
Product Revision - - - - - -
Serial Number - - - - - -
BC Firmware Rev. - - - - - -
Boot Counter - - - - - -
Running times - - - - - -
Advanced
ACPI settings
ACPI settings Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
Active Cooling Trip Point Disabled Disabled Disabled Disabled Disabled Disabled
Passive Cooling Trip Point Disabled Disabled Disabled Disabled Disabled Disabled
PCI Configuration
PCI Configuration Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
Allocate IRQ to PCI VGA Yes Yes Yes Yes Yes Yes
Graphics configuration
Section 4
Software
Graphics configuration Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
Graphics memory size Enabled, 8MB Enabled, 8MB Enabled, 8MB Enabled, 8MB Enabled, 8MB Enabled, 8MB
Init. Graphic adapter priority PCI/Int-VGA PCI/Int-VGA PCI/Int-VGA PCI/Int-VGA PCI/Int-VGA PCI/Int-VGA
CPU configuration
CPU configuration Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
Manufacture: - - - - - -
Brand string - - - - - -
Frequency - - - - - -
FSB speed - - - - - -
L1 cache - - - - - -
L2 cache - - - - - -
Intel (R) SpeedStep (tm) Automatic Automatic Automatic Automatic Automatic Automatic
tech
Max. CPU frequency - - - - - -
Chipset configuration
Chipset configuration Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
APIC ACPI SCI IRQ Disabled Disabled Disabled Disabled Disabled Disabled
I/O interface configuration Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
Table 325: 855GME (XTX) - I/O interface configuration - profile settings overview
Clock Configuration
Clock Configuration Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
Unused PCI slot clocks Enabled Enabled Enabled Enabled Enabled Enabled
IDE Configuration
IDE Configuration Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
OnBoard PCI IDE controller Primary Both Both Primary Both Primary
Onboard PCI IDE operate Legacy mode Legacy mode Legacy mode Legacy mode Legacy mode Legacy mode
mode
Hard disk write protect Disabled Disabled Disabled Disabled Disabled Disabled
ATA(PI) 80 pin cable Host & device Host & device Host & device Host & device Host & device Host & device
detection
Primary IDE Master
Type Auto Auto Auto Auto Auto Auto
Section 4
Software
PIO Mode Auto Auto Auto Auto Auto Auto
Secondary IDE slave Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
USB configuration
USB configuration Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
USB Function 4 USB Ports 4 USB Ports 4 USB Ports 4 USB Ports 4 USB Ports 6 USB Ports
USB 2.0 Controller Mode HiSpeed HiSpeed HiSpeed HiSpeed HiSpeed HiSpeed
USB Stick Default Hard Disk Hard Disk Hard Disk Hard Disk Hard Disk Hard Disk
Emulation
USB Mass Storage Reset 20 Sec 20 Sec 20 Sec 20 Sec 20 Sec 20 Sec
Delay
Keyboard/mouse configuration
Remote access Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
configuration
Remote access Disabled Disabled Disabled Disabled Disabled Disabled
Serial port BIOS update Disabled Disabled Disabled Disabled Disabled Disabled
Table 330: 855GME - (XTX) remote access configuration - profile setting overview
CPU board monitor Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
Board temperature - - - - - -
CPU temperature - - - - - -
VcoreA - - - - - -
VcoreB - - - - - -
+3.3Vin - - - - - -
+5Vin - - - - - -
+5VSB - - - - - -
VBAT - - - - - -
Table 331: 855GME (XTX) - CPU board monitor - profile setting overview
Section 4
Software
Main Board/Panel Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
Features
Panel control
Select panel number - - - - - -
Version - - - - - -
Temperature - - - - -
Fan speed - - - - - -
Keys/LEDs - - - - - -
I/O - - - - - -
Power supply - - - - - -
Slide-in drive 1 - - - - - -
Slide-in drive 2 - - - - - -
Case 1 - - - - - -
Case 2 - - - - - -
Main board monitor Profile 0 Profile 1 Profile 2 Profile 3 Profile 4 Profile 5 Personal settings
Case 3 - - - - - -
Case 4 - - - - - -
CPU - - - - - -
Legacy devices
COM C Disabled Enabled Disabled Enabled Enabled Disabled
Interrupt - 11 - 11 11 -
Versions
BIOS - - - - - -
MTCX PX32 - - - - - -
MTCX FPGA - - - - - -
Optimized ID - - - - - -
Device ID - - - - - -
Compatibility ID - - - - - -
Serial number - - - - - -
Product name - - - - - -
User serial OD - - - - - -
Boot
Boot Priority Selection Type Based Type Based Type Based Type Based Type Based Type Based
1st Boot Device Primary master Onboard LAN Primary master Primary master Primary master Primary master
2nd Boot Device Primary slave Primary Primary slave Primary slave Primary slave Primary slave
master
3rd Boot Device USB floppy Primary slave USB floppy USB floppy USB floppy USB floppy
4th Boot Device USB USB floppy USB USB USB USB
removable removable removable removable removable
device device device device device
5th Boot Device USB hard disk USB USB hard disk USB hard disk USB hard disk USB hard disk
removable
device
6th Boot Device USB CDROM USB CDROM USB CDROM USB CDROM USB CDROM USB CDROM
Automatic Boot List Retry Disabled Disabled Disabled Disabled Disabled Disabled
Add-On ROM Display Mode Keep Current Keep Current Keep Current Keep Current Keep Current Keep Current
Hit 'DEL' Message Display Enabled Enabled Enabled Enabled Enabled Enabled
Section 4
Software
PXE boot to LAN (ETH1) Disabled Enabled Disabled Disabled Disabled Disabled
Security
Supervisor Password - - - - - -
User Password - - - - - -
Change Supervisor - - - - - -
Password
Change User Password - - - - - -
Boot Sector Virus Protection Disabled Disabled Disabled Disabled Disabled Disabled
Power
Video Power Down Mode Suspend Suspend Suspend Suspend Suspend Suspend
Hard Disk Power Down Suspend Suspend Suspend Suspend Suspend Suspend
Mode
Standby time out Disabled Disabled Disabled Disabled Disabled Disabled
Keyboard & PS/2 Mouse MONITOR MONITOR MONITOR MONITOR MONITOR MONITOR
While the Automation PC 620 is booting, the following messages and errors can occur with
BIOS. These errors are signaled by different beeping codes.
Table 336: BIOS post code messages BIOS 815E (ETX) and 855GME (ETX)
Section 4
Software
Beeping code Meaning Necessary user action
1 x short Memory refresh failed. Load BIOS defaults. In the event that the error persists,
send industrial PC to B&R for testing.
2 x short Parity error: POST error (error in one of the hardware Check the placement of the inserted card. In the event that
testing procedures) the error persists, send industrial PC to B&R for testing.
3 x short Base 64 KB memory failure: Basic memory defect, RAM Send industrial PC to B&R for checking.
error within the initial 64 KB.
4 x short Timer not operational: System timer. Send industrial PC to B&R for checking.
5 x short Processor error: Processor defect. Send industrial PC to B&R for checking.
6 x short 8042 gate A20 failure: Keyboard controller defect (block Send industrial PC to B&R for checking.
8042/ A20 gate). Processor cannot switch to protected
mode.
7 x short Processor exception interrupt error: Virtual mode Send industrial PC to B&R for checking.
exception error (CPU generated an interrupt error.
8 x short Display memory read/write error: Video memory not Check inserted graphic card position and eventually
accessible; graphic card defect or not built in (no fatal exchange. In the event that the error persists, send
error). industrial PC to B&R for testing.
9 x short ROM-checksum error: ROM-BIOS-checksum incorrect, Send industrial PC to B&R for checking.
EPROM, EEPROM or Flash-ROM component defect,
BIOS defect or incorrectly updated.
Table 337: BIOS post code messages BIOS 855GME (XTX) (Forts.)
Section 4
Software
4 Reserved
5 Available
6 Available
7 Available
NONE
NMI
10
11
12
13
14
15
IRQ
0
9
System timer ●
Keyboard ●
IRQ cascade ●
COM1 (Serial port A) ❍ ●
COM2 (Serial port B) ● ❍
LPT1 ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ●
LPT2 ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ●
LPT3 ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ●
PS/2 mouse ●
ACPI1) ●
FDD ● ❍
Real-time clock ●
Coprocessor (FPU) ●
Primary IDE channel ●
Secondary IDE
●
channel
COM3
❍ ❍ ❍ ❍ ❍ ❍ ❍ ●
(COM C)
COM4
❍ ❍ ❍ ❍ ❍ ❍ ❍ ●
B&R (COM D)
Section 4
Software
COM5
❍ ❍ ❍ ❍ ❍ ❍ ❍ ●
(COM E)
CAN ❍ ❍ ●
A total of 23 IRQs are available in the APIC mode (Advanced Programmable Interrupt
Controller). The activation of this option is only effective if it takes place before the operating
system (Windows XP) is activated. There are then 23 IRQs available.
NONE
NMI
10
11
12
13
14
15
16
17
18
19
20
21
22
23
IRQ
0
1
2
3
4
5
6
7
8
9
System timer ●
Keyboard ●
IRQ cascade ●
COM1
❍ ●
(Serial port A)
COM2
● ❍
(Serial port B)
LPT1 ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ●
LPT2 ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ●
LPT3 ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ❍ ●
PS/2 mouse ●
ACPI1) ●
FDD ● ❍
Real-time clock ●
Coprocessor
●
(FPU)
Primary IDE
●
channel
Secondary IDE
●
channel
COM3
❍ ❍ ❍ ❍ ❍ ❍ ❍ ●
(COM C)
COM4
❍ ❍ ❍ ❍ ❍ ❍ ❍ ●
B&R (COM D)
COM5
❍ ❍ ❍ ❍ ❍ ❍ ❍ ●
(COM E)
CAN ❍ ❍ ●
PIRQ A 2) ●
PIRQ B 3) ●
4)
PIRQ C ●
PIRQ D 5) ●
PIRQ E 6) ●
PIRQ F ●
PIRQ G ●
NONE
NMI
10
11
12
13
14
15
16
17
18
19
20
21
22
23
IRQ 0
1
2
3
4
5
6
7
8
9
PIRQ H 7) ●
The PCI resources are assigned to fixed IRQ lines when the APIC function is enabled. The
following image shows the connections to the individual PCI slots.
B B B B B
PIRQ B SM-Bus Audio
Section 4
Software
APIC IRQ 17 B0:D31:F3 B0:D31:F5
C C C C C
PIRQ C Native IDE
APIC IRQ 18 B0:D31:F1
D D D D D
PIRQ D USB UHCI-2
APIC IRQ 19 B0:D29:F1
PIRQ F 1 1 Slot
APIC IRQ 21
PIRQ G
1 2 2 Slot
APIC IRQ 22
1) 1) 1) 1)
1 2 3 4 5 5 Slot
PIRQ H USB EHCI
APIC IRQ 23 B0:D29:F7
1) 1)
1 2 3 3 Slot
1) These slots are behind the PCI to PCI bridge (B2:D6), which is connected to PIRQ D (PCI slot 4).
Figure 263: PCI routing with activated APIC CPU boards 815E (ETX), 855GME (ETX)
B B B B B
PIRQ B SM-bus Audio
APIC IRQ 17 B0:D31:F3 B0:D31:F5
C C C C C
PIRQ C Native IDE
APIC IRQ 18 B0:D31:F1
D D D D D
PIRQ D USB UHCI-2
APIC IRQ 19 B0:D29:F1
PIRQ F 1 1 Slot
APIC IRQ 21
PIRQ G
1 2 2 Slot
APIC IRQ 22
1) 1) 1) 1)
1 2 3 4 5 5 Slot
PIRQ H USB EHCI
APIC IRQ 23 B0:D29:F7
1) 1)
1 2 3 3 Slot
1) These slots are behind the PCI to PCI bridge (D1:D6), which is connected to PIRQ D (PCI slot 4).
Figure 264: PCI routing with activated APIC CPU boards 855GME (XTX)
B
PIRQ B SM-Bus CAN
APIC IRQ 17 B0:D31:F3 B1:D3:F1
C
PIRQ C Native IDE USB UHCI-3
APIC IRQ 18 B0:D31:F1 B0:D29:F2
D
PIRQ D USB UHCI-2 X2X
APIC IRQ 19 B0:D29:F1 B1:D3:F2
PIRQ F
APIC IRQ 21
PIRQ G
APIC IRQ 22
Figure 265: PCI routing with activated APIC CPU boards 855GME (XTX) on the APC620e
Section 4
Software
I²C address Resource Note
A0h EEPROM EEPROM for CMOS data - cannot be used
B0h Reserved Cannot be used
58h Reserved Cannot be used
Warning!
The following procedure is only permitted with the power switched off and the
supply voltage disconnected!
To get to the DIP switches, it is necessary to open the front cover. To do this, loosen the five Torx
screws (T10) marked and pull the cover off towards the front. Then the DIP switches can be
accessed at the location marked in yellow. The setting can now be made using a pointed object.
If the system has a slide-in drive, it must be removed first to get to the DIP switches.
2. Upgrade information
Warning!
The upgrade procedures described in the following pages must be carried out for all
APC620 systems with software versions lower than those listed in the following
table.
Section 4
Software
BIOS upgrade).
Information:
Individually saved BIOS settings are deleted when upgrading the BIOS.
Before starting the upgrade, you should know the CPU board type (815E or 855GME) and the
various software versions.
After switching on the APC620, the installed CPU board can be identified by the letters "B", "C"
or „E“.
Table 347: Differentiating between 815E (ETX) and 855GME (ETX / XTX) CPU boards
Which BIOS version and firmware are already installed on the APC620?
This information can be found on the same BIOS setup page for both the 815E (ETX) and the
855GME (ETX / XTX)CPU boards:
• After switching on the APC620, you can get to the BIOS Setup by pressing "F2" or "DEL".
• From the BIOS main menu "advanced" (top), select "baseboard/panel features" (bottom):
CPU boards 815E (ETX) and 855GME (ETX) CPU boards 855GME (XTX)
PhoenixBIOS Setup Utility BIOS SETUP UTILITY
Advanced Advanced
Panel Control
Panel Control Baseboard Monitor
Baseboard Monitor Legacy Devices
Legacy Devices
Versions
BIOS: R116 System BIOS
Versions
BIOS: R123 System BIOS MTCX PX32: V1.63 MTCX PX32 firmware
MTCX FPGA: V1.19
MTCX PX32: V1.19 MTCX PX32 firmware MTCX FPGA firmware
MTCX FPGA: V1.06
MTCX FPGA firmware Optimized ID:
Device ID:
00000010b
00001BB7h Select Screen
Optimized ID: 11111111b Compatibility ID: 0000h Select Item
Device ID: 00001BB7h Serial number: 70950173619 Enter Go to Sub Screen
Compatibility ID: 0000h Product Name: 5PC600.SX02-01 F1 General Help
Serial Number: 70950168449 User Serial ID: FFFFFFFFh F10 Save and Exit
Product Name: System 2PCI 1DD ESC Exit
User Serial ID: 00000000h
Section 4
Software
This information can be found on the same BIOS setup page for both the 815E (ETX) and the
855GME (ETX / XTX)CPU boards:
• After switching on the APC620, you can get to the BIOS Setup by pressing "F2" or "DEL".
• From the BIOS main menu "advanced" (top), select "baseboard/panel features" (bottom)
and then "panel control":
Information:
The version can only be shown if an Automation Panel with Automation Panel Link
SDL transceiver (5DLSDL.1000-01) and Automation Panel Link SDL receiver
(5DLSDL.1000-00) is connected.
CPU boards 815E (ETX) and 855GME (ETX) CPU boards 855GME (XTX)
PhoenixBIOS Setup Utility BIOS SETUP UTILITY
Advanced Advanced
Panel Control Item Specific Help Panel Control Panel 0-14: connected
to Automation Panel
Select Panel Number [0] Link or Monitor/Panel
Select Panel Number: [ 0] Version: V1.09 FPGA firmware of
connector.
Brightness: [100%] Panel 15: connected on
Version: V0.03 FPGA firmware of Temperature: 41°C/105°F the SDLR controller
Panel PC Link.
Fan Speed: 00RPM Note: DVI and PPC Link
Brightness:
Temperature:
[ 50%]
00°C/32°F the SDLR controller Keys/Leds: 128/128 will show no valid
Fan Speed: 00 RPM values. On OOC Link
Keys/Leds: 00/00 only the brightness
option will work.
Select Screen
Select Item
+- Change Option
F1 General Help
F10 Save and Exit
ESC Exit
• Download and unzip the zip file from the B&R homepage.
• Create bootable media.
Information:
In MS-DOS, Win95 and Win98, a blank HD disk can be made bootable using the
command line command "sys a:" or "format a: /s".
Information concerning creating a bootable diskette in Windows XP cab be found on
page 558.
• Copy the contents of the *.zip file to the bootable media. If the B&R upgrade was already
added when the bootable media was created using the B&R Embedded OS Installer, then
this step is not necessary.
• Connect the bootable media to the APC620 and reboot the device.
• The following boot menu will be shown after startup:
1. Upgrade PHOENIX BIOS for i815E (5PC600.E815-xx)
2. Exit to MS-DOS
Concerning point 1:
BIOS is automatically upgraded (default after 5 seconds).
Concerning point 2:
Returns to the shell (MS-DOS).
Section 4
Software
• The system must be rebooted after a successful upgrade.
Information:
When the system has rebooted, setup default values must be reloaded after the
message, "System CMOS checksum bad" (press F1 or select "load setup defaults"
in the BIOS setup "exit" menu). Afterwards, the time and date must be set again.
• Download and unzip the zip file from the B&R homepage.
• Create bootable media.
Information:
In MS-DOS, Win95 and Win98, a blank HD disk can be made bootable using the
command line command "sys a:" or "format a: /s".
Information concerning creating a bootable diskette in Windows XP cab be found on
page 558.
Information concerning creating a USB flash drive for a B&R upgrade can be found
on page 560.
• Copy the contents of the *.zip file to the bootable media. If the B&R upgrade was already
added when the bootable media was created using the B&R Embedded OS Installer, then
this step is not necessary.
• Connect the bootable media to the APC620 and reboot the device.
• The following boot menu will be shown after startup:
1. Upgrade PHOENIX BIOS for i855GME (5PC600.E855-xx)
2. Exit to MS-DOS
Concerning point 1:
BIOS is automatically upgraded (default after 5 seconds).
Concerning point 2:
Returns to the shell (MS-DOS).
Information:
When the system has rebooted, setup default values must be reloaded after the
message, "System CMOS checksum bad" (press F1 or select "load setup defaults"
in the BIOS setup "exit" menu).
Starting with BIOS version V1.15, the time and date no longer has to be set again
after a BIOS upgrade (stays the same).
• Download and unzip the zip file from the B&R homepage.
• Create bootable media.
Information:
In MS-DOS, Win95 and Win98, a blank HD disk can be made bootable using the
command line command "sys a:" or "format a: /s".
Information concerning creating a bootable diskette in Windows XP cab be found on
page 558.
Information concerning creating a USB flash drive for a B&R upgrade can be found
on page 560.
• Copy the contents of the *.zip file to the bootable media. If the B&R upgrade was already
added when the bootable media was created using the B&R Embedded OS Installer, then
this step is not necessary.
• Connect the bootable media to the APC620 and reboot the device.
• The following boot menu will be shown after startup:
1. Upgrade PHOENIX BIOS for i855GME (5PC600.X855-xx)
2. Exit to MS-DOS
Section 4
Software
Concerning point 1:
BIOS is automatically upgraded (default after 5 seconds).
Concerning point 2:
Returns to the shell (MS-DOS).
Information:
After the system restart, the warning "CMOS checksum BAD" is displayed, but BIOS
boots through it. The setup can be opened using the "Del" key and the setup
defaults must be loaded again and saved using either the "F9" key or the menu item
"Exit" - "Load CMOS defaults".
"Copy Error"
To do this, use the audio driver from the B&R Homepage (www.br-automation.com).
During the installation of the audio driver, the following 2 files must be manually selected from
the following directories.
In order to be able to set up all possible resolutions when using an 815E CPU board, the graphics
driver must be reinstalled (see 5.2.1 "Installing the graphics driver for 815E (ETX) CPU boards").
With the APC620 / Panel PC firmware upgrade (MTCX, SDLR, SDLT), the firmware of a number
of controllers (MTCX, SDLR, SDLT, UPS) can be updated, depending on the construction of the
APC620 system.
2.2.1 Procedure
• Download and unzip the zip file from the B&R homepage.
• Create bootable media.
Information:
In MS-DOS, Win95 and Win98, a blank HD disk can be made bootable using the
command line command "sys a:" or "format a: /s".
Information concerning creating a bootable diskette in Windows XP cab be found on
page 558.
Information concerning creating a USB flash drive for a B&R upgrade can be found
on page 560.
• Copy the contents of the *.zip file to the bootable media. If the B&R upgrade was already
added when the bootable media was created using the B&R Embedded OS Installer, then
Section 4
this step is not necessary.
Software
• Connect the bootable media to the APC620 and reboot the device.
• The following boot menu will be shown after startup:
Information:
The following boot menu options including descriptions are based on version 1.27
of the APC620 / Panel PC Firmware upgrade (MTCX, SDLR, SDLT) disk. In some
cases, these descriptions might not match the version you are currently using.
6. Exit
Concerning point 1:
Automatically upgrade PX32 and FPGA for MTCX (default after 5 seconds).
Concerning point 2:
The FPGA of the SDLT controller on the AP Link slot is automatically updated.
Concerning point 3:
A submenu is opened for upgrading the SDLR controller on the Monitor/Panel plug.
Concerning point 4:
A submenu is opened for upgrading the SDLR controller on the AP Link slot.
Section 4
Software
Concerning point 5:
The submenu for the add-on UPS firmware and upgrade and the battery settings upgrade is
opened - this is irrelevant for PPC700 systems.
Concerning point 6:
Returns to the shell (MS-DOS).
Information:
The system must be powered off and on again after a successful controller upgrade.
• Then select the checkbox "Create an MS-DOS startup disk", press "Start" and
acknowledge the warning message with "OK".
After creating the startup disk, some of the files must be deleted because of the size of the
update.
When doing this, all files (hidden, system files, etc.) must be shown on the diskette.
In Explorer, go to the Tools menu, select Folder Options... and open the View tab. Now
deactivate the option Hide protected operating system files (Recommended) (activated by
default) and activate the option Show hidden files and folders.
before after
Section 4
Software
Figure 274: Creating a bootable diskette in Windows XP - step 5
Now all files (marked) except Command.com, IO.sys and MSDOS.sys can be deleted.
2.4 Creating a bootable USB flash drive for B&R upgrade files
When used in connection with a B&R industrial PC, it is possible to upgrade BIOS from one of
the USB flash drives available from B&R. To do this, the USB flash drive must be prepared
accordingly. This is done with the B&R Embedded OS Installer, which can be downloaded for
free from the B&R homepage (www.br-automation.com).
2.4.1 Requirements
The following peripherals are required for creating a bootable USB flash drive:
2.4.2 Procedure
Figure 275: Creating a USB flash drive for B&R upgrade files
Information concerning creating an MS-DOS boot diskette can be found in section 2.3 "Creating
an MS-DOS boot diskette in Windows XP", on page 558. Then the files from the diskette are to
be copied to your hard drive.
Section 4
Software
When used in connection with a B&R industrial PC, it is possible to upgrade BIOS from one of
the CompactFlash cards available from B&R. To do this, the CompactFlash card must be
prepared accordingly. This is done with the B&R Embedded OS Installer, which can be
downloaded for free from the B&R homepage (www.br-automation.com).
2.5.1 Requirements
The following peripherals are required for creating a bootable CompactFlash card:
• CompactFlash card
• B&R Industrial PC
• B&R Embedded OS Installer (V3.10 or higher)
2.5.2 Procedure
Information concerning creating an MS-DOS boot diskette can be found in section 2.3 "Creating
an MS-DOS boot diskette in Windows XP", on page 558. Then the files from the diskette are to
be copied to your hard drive.
Potential upgrade problems are listed in the Liesmich.txt or Readme.txt files on the upgrade
Section 4
Software
disks.
An integral component of Automation Studio™ is Automation Runtime, the software kernel which
allows applications to run on a target system. This runtime environment offers numerous
important advantages:
3.2.1 ARwin
The fieldbus interfaces CAN, X2X, and POWERLINK are supported by ARwin with an AS 2.6
upgrade.
3.2.2 ARemb
The fieldbus interfaces CAN, X2X, and POWERLINK are supported by AR 2.94 together with an
AS 2.7.
Power supply buffering of 10 ms is guaranteed starting with the following system unit revisions:
Table 348: System unit support for buffering with Automation Runtime
Table 348: System unit support for buffering with Automation Runtime (Forts.)
The output of graphics with Visual Components is only supported by graphic engine 1. Graphic
engine 2 is not supported. The following table should clarify the mapping and stretching function
of the graphic engine in connection with the different system unit variations.
Section 4
Software
5PC600.SE00-01 1 GE1 - Monitor / Panel
5PC600.SE00-02 1 GE1 - Monitor / Panel
Table 349: Visual Components video output with different system units
A graphic engine 1 (GE1) is only available in connection with AP Link SDL transmitter
5AC600.SDL0-00 for system units 5PC600.SX02-00, 5PC600.SX05-00 and 5PC600.SF03-00.
If no AP Link SDL transmitter is present in the system units listed, then video output is not
possible with Visual Components.
DOS622 Deutsch
Diskette 1- Setup
Perfection in Automation
Recovery Diskette
www.br-automation.com
060000129
©1983-2000 Microsoft Corporation. Alle Rechte vorbehalten.
Either no drivers are available for the following hardware components or only with limitations:
The following table shows the tested resolutions and color depths on the Monitor / Panel
connector with 855GME CPU boards.
Color depth
Resolutions for DVI 8-bit 16-bit 24-bit
640 x 480 ✓ ✓ ✓
800 x 600 ✓ ✓ ✓
1024 x 768 ✓ ✓ ✓
1280 x 1024 ✓ ✓ ✓
Color depth
Resolutions for RGB 8-bit 16-bit 24-bit
640 x 480 ✓ ✓ ✓
800 x 600 ✓ ✓ ✓
1024 x 768 ✓ ✓ ✓
1280 x 1024 ✓ ✓ ✓
1600 x 1200 ✓ ✓ ✓
1920 x 1440 ✓ ✓
Table 351: Tested resolutions and color depths for DVI and RGB signals
Section 4
Software
Information:
Discontinuation of support for Windows XP by Microsoft:
After April 8th, 2014, Microsoft will no longer be providing any security updates,
hotfixes, support (free or paid) or technical resources for Windows XP.
5.1 Installation
Upon request, B&R will pre-install Windows XP Professional on the desired mass memory (add-
on hard disk, slide-in hard disk). All of the drivers required for operation (graphics, network, etc.)
are also installed when doing so.
5.1.1 FAQ
Windows XP can be installed on APC620 systems with 815E CPU boards only together with a
connected external monitor (RGB). An Automation Panel 900 is switched off in the Windows
hardware recognition if connected via SDL or DVI during the installation. Video output via SDL
and DVI is only supported after installing the 815E graphics driver.
The following steps are necessary for installing Windows XP Professional on the PCI SATA
RAID controller:
Section 4
1) Download the RAID driver from the B&R homepage (www.br-automation.com) and copy
Software
the files to a diskette.
3) Insert the diskette and Windows XP Professional CD in the the Media Drive and boot from
the CD.
4) Press the F6 key during setup to install a third-party SCSI or a driver.
5) Press the "s" key when asked about installing an additional drive. Insert the disk in the floppy
drive. Press "Enter" and select the driver.
7) The setup copies the files to the Windows XP Professional folder and restarts the APC620.
The following steps are necessary when installing to a slide-in HDD being operated in the slide-
in slot 2 (located behind the PCI to SATA Bridge) on the APC620:
1) Download the Si3531 SATA driver from the B&R homepage (www.br-automation.com)
and copy the files to a diskette.
3) Insert the diskette and Windows XP Professional CD in the the Media Drive and boot from
the CD.
5) Press the "s" key when asked about installing an additional drive. Insert the disk in the floppy
drive. Press "Enter" and select the driver.
7) The setup copies the files to the Windows XP Professional folder and restarts the Automation
PC 620.
Information:
• Windows XP setup supports not all USB-FDD drives (see Microsoft KB 916196).
• Depending on the system it could be neccesary to change the boot order in BIOS.
For operation modes "extended desktop" and "dual display clone", the Intel Extreme graphics
chip driver must be installed. Graphics drivers for 815E and 855GME CPU boards are available
for approved operating systems in the download area (Service - Material Related Downloads -
BIOS / Drivers / Updates) on the B&R homepage (www.br-automation.com).
5.2.1 Installing the graphics driver for 815E (ETX) CPU boards
The following must be observed when installing the graphics chip driver for the graphics chip
integrated in the 815E chip set:
• The driver available from Intel is NOT permitted to be used, only the driver available from
B&R (www.br-automation.com).
• After unpacking the *.zip file, the driver must be updated using the Windows Device
Manager "Start - Control Panel - System - Hardware - Device Manager - Update Driver".
When doing this, use the file i81xnt5.inf.
• The initial installation of the driver can only be carried out with an external monitor
(RGB) connected. After successfully installing the B&R driver, an Automation Panel 900
be operated via SDL or DVI without problems.
Caution!
Presently, this driver is only approved for the Windows XP Professional and
Windows XP embedded operating systems.
Information:
The following screenshots and descriptions refer to the graphics driver version
6.13.01.3175 for 815E CPU boards. Therefore, it is possible that the screenshots and
descriptions might not correspond with the installed driver version.
After the driver is installed, it can be configured in the Control Panel (called up through the icon
in the taskbar or Start - Control Panel - Display - Settings - Advanced).
Section 4
Figure 279: Graphics driver for 815E Control Panel access
Software
Information:
The following screenshots and descriptions refer to the graphics driver version
14.11 for 855GME CPU boards. Therefore, it is possible that the screenshots and
descriptions might not correspond with the installed driver version.
After the driver is installed, it can be configured in the Control Panel (called up through the icon
in the taskbar or Start - Control Panel - Display - Settings - Advanced).
Information:
The connected Automation Panel 900 is still not activated after installing the
graphics driver.
See the FAQ for information on this topic: "My Automation Panel 900 is still not
activated after installing the graphics driver.", on page 576.
Under the "Extended desktop" settings, "Notebook" can be set as the primary device (Graphics
Engine 1) and "Digital display" as secondary device (Graphics Engine 2). The two lines display
different content (Extended Desktop).
Resolution and color depth can be configured separately for each line via the device settings for
notebook and digital display.
Section 4
Software
Due to the operation of two different lines, for each line one of the internal serial interfaces COM
C and COM D on the APC620 must be activated in BIOS (under Advanced - Baseboard/Panel
Features - Legacy Devices) for the Automation 900 devices' touch screens. See the section
5.3.1 "Installation for Extended Desktop", on page 578 for information about installing the touch
screen driver.
In "Dual display clone" mode, the same content is displayed on every connected Automation
Panel 900 unit on both lines (Graphics Engine 1 and Graphics Engine 2). This enables operation
of the application from every display.
Resolution and color depth can only be set on the line designated as the primary device.
Section 4
Software
Figure 283: Dual display clone settings - primary and secondary device
The internal serial interface COM C on the APC620 must be activated in BIOS (under Advanced
- Baseboard/Panel Features - Legacy Devices) for the Automation 900 devices' touch screens.
See the section 5.3.2 "Installation for Dual Display Clone", on page 580 for information about
installing the touch screen driver.
A panel locking time can be set in the B&R Control Center to prevent simultaneous operation of
the Automation Panel 900 (see the .chm help file for the B&R Control Center).
Information:
• The panel locking time is reset to the value configured in the key
configuration (KCF - Key Configuration File) when the system is restarted.
5.2.5 FAQ
My Automation Panel 900 is still not activated after installing the graphics driver.
After installation, the graphics driver is automatically set to the analog output - RGB (monitor).
As a result, any Automation Panel 900 connected via SDL (Smart Display Link) or DVI remains
switched-off after loading the Intel graphics driver in Windows XP.
Is set to "Monitor"
after installation
To correct this problem, an analog monitor (RGB) must be connected to the monitor/panel, to re-
activate the settings for digital output (digital display for the monitor/panel output or notebook for
the AP Link output).
Digital display for Monitor / Panel output Notebook for AP Link output
Section 4
Software
For operation modes "extended desktop" and "dual display clone", the Elo touch screen driver
must be installed. This can be found in the download area (Service - Material Related Downloads
- BIOS / Drivers / Updates) on the B&R homepage (www.br-automation.com).
Information:
The touch screen drivers are based on the Windows mouse system. That means that
either a mouse (USB or PS/2) must have been connected during the Windows
installation or the mouse drivers must be installed additionally (e.g. automatically
installed when later connecting a USB mouse). The BIOS function "PS/2 Mouse"
must be set to "Enabled" when using a PS/2 mouse. This is located on the BIOS
setup page "Advanced" - "Miscellaneous" (the default setting is "Disabled").
Information:
• Activate COM C and COM D in BIOS.
• During installation the panel locking time must be set to 0 ms ("Auto detect" of the driver
could only recognize 1 touch screen).
• Executing setup
• The Automation Panel 900 unit's touch screen is connected with the APC620 serially, so
the serial touch screen drivers must be installed.
• The driver's auto-detect function sends data packets to every existing serial interface. It
then returns a list of all the ports on which an Elo touch screen is connected. The panel
locking time must be set to 0 ms (auto-detect only found 1 touch screen)
• After selecting the COM ports on which Elo touch screens are connected, the system
must be rebooted.
• After restarting, each line of touch screens must be calibrated separately. This is done in
the menus "Properties 1" and "Properties 2" with the "Align" button. When one touch
screen is being calibrated, the others are automatically locked.
Section 4
Software
Information:
• Activate COM C in BIOS.
• During installation the panel locking time must be set to 0 ms ("Auto detect" of the driver
could only recognize 1 touch screen).
• Executing setup
• The Automation Panel 900 unit's touch screen is connected with the APC620 serially, so
the serial touch screen drivers must be installed.
• The driver's auto-detect function sends data packets to every existing serial interface. It
then returns a list of all the ports on which an Elo touch screen is connected. The panel
locking time must be set to 0 ms (auto-detect only found 1 touch screen)
• After selecting the COM ports on which Elo touch screens are connected, the system
must be rebooted.
• After restarting, only one touch screen must be calibrated. These settings are then
applied to other touch screens.
Section 4
Software
5.3.3 FAQ
The power options allow a few different settings (e.g. Turn off monitor, Turn off hard disks and
System standby for a Windows XP system).
Caution!
If the "Turn off monitor" function is enabled and a time has been set, then touching
the dark touch display after the time has expired presents the risk of "blindly"
activating one of the commands in the application and unintentionally triggering
functions.
This can be avoided by activating a screen saver. As a result, the next time the touch
screen is touched, the screen saver is deactivated.
An audio driver can be found in the download area (Service - Material Related Downloads - BIOS
/ Drivers / Updates) on the B&R homepage (www.br-automation.com).
See the section "MIC, Line IN and Line OUT ports", on page 144 for information about the audio
driver type.
5.4.1 Installation
Information:
The option "AC97 Audio controller" must be set to "Enabled" (default setting) in
BIOS under Advanced - I/O Device Configuration.
The APC620 has 2 different networks controllers. Drivers for both network connections (ETH1
and ETH2) are available for approved operating systems in the download area (Service -
Material Related Downloads - BIOS / Drivers / Updates) on the B&R homepage (www.br-
automation.com).
See the sections "Ethernet connection ETH1", on page 130 and "Ethernet connection ETH2", on
page 132 for information about network controller types.
Installation is performed via the Windows device manager using the Net559ER.inf file.
The fieldbus interfaces CAN, X2X and POWERLINK are not supported by Microsoft Windows
XP (no drivers present).
Section 4
Software
Windows XP Embedded is the modular version of the desktop operating system Windows XP
Professional. Windows XP Embedded is based on the same binary files as Windows XP
Professional and is optimally tailored to the hardware being used. In other words, only the
functions and modules required by the respective device are included. Windows XP Embedded
is also based on the same reliable code as Windows XP Professional. It provides industry with
leading reliability, improvements in security and performance, and the latest technology for Web
browsing and extensive device support.
The Windows XP Embedded available from B&R was developed for APC620 systems with 815E
and 855GME CPU board units.
The feature list shows the most important device functions in Windows XP Embedded with
Feature Pack 2007 (FP2007).
Function Present
Enhanced write filter (EWF) ✓
File Based Write Filter ✓
Page file Configurable
Administrator account ✓
User account Configurable
Explorer shell ✓
Registry filter ✓
Internet Explorer 6.0 + SP2 ✓
Internet information service (IIS) -
Terminal service ✓
Windows Firewall ✓
MSN-Explorer -
Outlook Express -
Administrative Tools ✓
Remote Desktop ✓
Remote Assistance -
.NET Framework -
Section 4
Software
ASP.NET -
Codepages/User Locale/Keyboard ✓
Disk Management Service ✓
Windows Installer Service ✓
Class Installer ✓
CoDevice Installer ✓
Media Player -
DirectX -
Accessories ✓
Number of fonts 89
6.3 Installation
Brief instructions for creating your own Windows XP Embedded images or a suitable Target
Designer export file for 815E or 855GME CPU boards can be downloaded from the download
area on the B&R homepage (www.br-automation.com).
Already included in the B&R Windows XP Embedded image for 815E and 855GME CPU boards.
The touch screen driver must be manually installed in order to operate Automation Panel 900
touch screen devices. The driver installation is identical to the driver installation for Windows XP
Professional Systems. For more information, see 5.3 "Touch screen driver", on page 578
The driver can be downloaded from the download area on the B&R homepage (www.br-
automation.com).
Already integrated in the B&R Windows XP Embedded image for 815E and 855GME CPU
boards.
"Copy Error"
To do this, use the audio driver from the B&R Homepage (www.br-automation.com).
During the installation of the audio driver, the following 2 files must be manually selected from
the following directories.
The graphics driver must be re-installed to enable all possible resolutions when using an 815E
CPU board (see 5.2.1 "Installing the graphics driver for 815E (ETX) CPU boards").
Already integrated in the B&R Windows XP Embedded image for 815E and 855GME CPU
boards.
6.8 FAQ
If the APC620 is connected with a B&R device, then the option "USB root hubs" must be disabled
in the Windows XP Embedded device manager under "Universal Serial Bus controllers" using
the following dialog box: Properities > Power Management > Allow the computer to turn off
this device to save power.
Section 4
Software
Windows XP Embedded Standard 2009 is the modular version of the desktop operating system
Windows XP Professional with Service Pack 3. Windows XP Embedded Standard 2009 is based
on the same binary files as Windows XP Professional with Service Pack 3 and is optimally
tailored to the hardware being used. In other words, only the functions and modules required by
the respective device are included. Windows XP Embedded Standard 2009 is also based on the
same reliable code as Windows XP Professional with SP3. It provides industry with leading
reliability, improvements in security and performance, and the latest technology for Web
browsing and extensive device support.
The feature list shows the most important device functions in Windows Embedded Standard
2009.
Function Present
Enhanced write filter (EWF) ✓
File Based Write Filter ✓
Page file Configurable
Administrator account ✓
User account Configurable
Explorer shell ✓
Registry filter ✓
Internet Explorer 7.0 ✓
Internet information service (IIS) -
Terminal service ✓
Windows Firewall ✓
MSN-Explorer -
Outlook Express -
Administrative Tools ✓
Remote Desktop ✓
Remote Assistance -
.NET Framework -
Section 4
Software
ASP.NET -
Local Network Bridge ✓
Codepages/User Locale/Keyboard ✓
Disk Management Service ✓
Windows Installer Service ✓
Class Installer ✓
CoDevice Installer ✓
Media Player 6.4 ✓
DirectX 9.0c ✓
Accessories ✓
Number of fonts 89
7.3 Installation
Upon request, Windows Embedded Standard 2009 can be preinstalled at B&R Austria on a
suitable CompactFlash card (min. 1GB). The APC620 system is then automatically configured
after it has been switched on for the first time. This procedure takes approximately 30 minutes,
and the device will be rebooted a number of times.
7.4 Drivers
All drivers required for operation are preinstalled on the operating system. If an older driver
version is installed, the latest version can be downloaded from the B&R homepage (www.br-
automation.com) and installed. A potentially activated "Enhanced Write Filter (EWF)" must be
taken into consideration.
The touch screen driver must be manually installed in order to operate Automation Panel 800 or
Automation Panel 900 touch screen devices. The driver can be downloaded from the download
area on the B&R homepage (www.br-automation.com). A potentially activated "Enhanced
Write Filter (EWF)" must be taken into consideration.
Information:
Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages.
Section 4
Software
with CPU boards 5PC600.X855-00, 5PC600.X855-01, 5PC600.X855-02, 5PC600.X855-03,
5PC600.X855-04, 5PC600.X855-05; CompactFlash separately (at least 128 MB).
5SWWCE.0812-ENG WinCE6.0 Pro APC620 E855GME
Order Microsoft Windows CE 6.0 Professional, English, including license, for APC620 with
CPU boards 5PC600.E855-00, 5PC600.E855-01, 5PC600.E855-02, 5PC600.E855-03,
5PC600.E855-04, 5PC600.E855-05; CompactFlash separately (at least 128 MB).
5SWWCE.0813-ENG WinCE6.0 Pro APC620 X855GME
Order Microsoft Windows CE 6.0 Professional, English, including license, for APC620 with
CPU boards 5PC600.X855-00, 5PC600.X855-01, 5PC600.X855-02, 5PC600.X855-03,
5PC600.X855-04, 5PC600.X855-05; CompactFlash separately (at least 128 MB).
B&R Windows CE is an operating system which is optimally tailored to B&R's devices. It includes
only the functions and modules which are required by each device. This makes this operating
system extremely robust and stable. A further advantage of B&R Windows CE compared to other
operating systems are the low licensing costs.
Detailed information about Windows CE for B&R devices can be downloaded in the download
area on the B&R homepage (www.br-automation.com).
Detailed information about Windows CE for B&R devices can be downloaded in the download
area on the B&R homepage (www.br-automation.com).
Section 4
Software
Compatible with zenOn Yes
Compatible with Wonderware No
Serial interfaces for any use 3
DirectX No
Audio ports "Line OUT" and "MIC" are supported. "Line IN" is not supported.
8.5 Requirements
The device must fulfill the following criteria to be able run the Windows CE operating system.
8.6 Installation
The B&R Embedded OS Installer allows you to install existing B&R Windows CE images. The
four files (NK.BIN, BLDR, LOGOXRES.BMP, and LOGOQVGA.BMP) must be provided from an
already functioning B&R Windows CE installation.
The B&R Embedded OS Installer can be downloaded from the download area on the B&R
homepage (www.br-automation.com). Further information is available in the online help for the
B&R Embedded OS Installer.
The ADI (Automation Device Interface) driver enables access to specific functions of B&R
devices. Settings for this device can be read and edited using the B&R Control Center applet in
the control panel.
Section 4
Figure 294: ADI Control Center screenshots - Example (symbol photo) Software
Information:
The displayed temperature and voltage values (e.g. CPU temperature, core voltage,
battery voltage) on the corresponding ADI page represent uncalibrated information
values. These cannot be used to draw any conclusions about any hardware alarms
or error conditions. The hardware components used have automatic diagnostics
functions that can be applied in the event of error.
9.1 Features
Information:
The functions provided by the Automation Device Interface (ADI) - Control Center
vary according to device series.
• Automation PC 620
• Automation PC 810
• Automation PC 820
• Panel PC 300
• Panel PC 700
• Panel PC 725
• Panel PC 800
• Power Panel 100/200
• Power Panel 300/400
• Power Panel 500
• Mobile Panel 40/50
• Mobile Panel 100/200
• Automation Panel 800 (in connection with Automation PCs and Panel PCs)
• Automation Panel 900 (in connection with Automation PCs and Panel PCs)
9.2 Installation
A detailed description of the Control Center can be found in the integrated online help. The B&R
Automation Device Interface (ADI) driver (also contains Control Center) can be downloaded for
free from the download area on the B&R homepage (www.br-automation.com).
- or -
Information:
The ADI driver is already included in the B&R images of embedded operating
systems.
If a more current ADI driver version exists (see the B&R homepage download area),
it can be installed later. A potentially activated "Enhanced Write Filter (EWF)" must
be taken into consideration when installing.
Section 4
Software
You can change the display's SDL equalizer settings in this dialog box. The equalizer is
integrated in the Automation Panel and adapts the DVI signal to various cable lengths. The
equalizer value is automatically calculated based on the cable length: You may set a different
equalizer value in order to obtain the best possible display quality (e.g. with low-quality cables or
poor DVI signal quality).
The value is optimally defined for the cable length when using the "Automatic setting".
Information:
The equalizer value can only be changed if the function is supported by the panel
(panel firmware version 1.04 or higher) and if MTCX PX32 version 1.54 or higher is
installed. Otherwise, the dialog fields are disabled.
Here you can view the status values for an optionally installed B&R APC add-on UPS as well as
change, update or save the battery settings for the UPS. You can also configure the system
settings for the UPS.
Caution!
Section 4
Software
The installed UPS must be selected and configured in the Control Panel using the
energy options in order for battery operation to be supported.
9.4.1 Installing the UPS service for the B&R APC add-on UPS
3) Click on System under UPS settings. This opens the Power Options in the Control Panel.
(The Power Options can also be opened directly from the Control Panel.)
5) Choose 'Bernecker + Rainer' as manufacturer and 'APC Add-On UPS' as model and then
click Finish. The value for the COM connection is only required for a serially connected UPS
and is ignored by the APC add-on UPS driver.
6) Click on Apply to begin UPS operation. After a few seconds the UPS status and details are
displayed.
7) Click OK.
8) The text field beside System (on the UPS tab in the Control Center) also indicates whether
the B&R UPS driver is active.
Information:
• Administrator rights are required in order to change the energy options or
display the UPS status.
Information:
The "reversed battery polarity" status is only displayed in UPS firmware version 1.08
or higher.
In UPS firmware Version 1.07 or smaller, a change between battery operation and
normal operation can lead to communication errors.
3) Select UPS monitor to display UPS status changes since the last time the system or UPS
driver was started.
Information:
The current status of the UPS is also displayed when the UPS service is started in
the Windows Control Panel on the UPS page in the energy options.
Information:
In a German version of Windows XP Professional the battery status is displayed as
Section 4
Software
"low" in the energy options, even if the battery is OK (Windows error). In an English
version, three battery status levels are displayed: unknown, OK, replace A low
battery status is never displayed.
3) Under "Battery settings," click on Edit. Clicking on "Open" opens a dialog box.
In this dialog box you can change the settings for the UPS battery.
The changed settings are written to the file by clicking on the OK button. The battery settings for
the UPS can then be updated with this file.
Information:
To make settings for batteries not from B&R, it is best to make a copy of a file with
battery settings from B&R under a new name and make adjust the settings in this
file for the battery being used.
Current files with settings for batteries from B&R can be found on the B&R APC620 / PPC700
firmware upgrade disk (starting with V1.16) and can also be updated using these.
Information:
• The current UPS firmware version 1.10 does not use charge end voltage, deep
discharge voltage, lifespan and deep discharge cycles.
• Lifespan is only included in version 2 (and higher) of the UPS battery settings
and only valid for B&R UPS batteries at 25°C ambient temperature.
• Deep discharge cycles are only included in version 3 (and higher) of the UPS
battery settings and only valid for B&R UPS batteries.
Information:
If you would like to change the current battery settings on the UPS, they must first
be saved in a file.
3) Under Battery settings, click on Update. Clicking on "Open" opens a dialog box.
4) Select and open the file containing the battery settings. The "Download" dialog box is
opened.
The transfer can be aborted by clicking on Cancel in the Download dialog box. Cancel is
disabled when the flash memory is being written to.
Caution!
• The UPS cannot be operated while updating the battery settings.
• If the transfer is interrupted, then the procedure must be repeated until the
battery settings have been updated successfully. Otherwise battery
operation will no longer be possible.
Section 4
Software
Deleting the data in flash memory can take several seconds depending on the memory block
being used. The progress indicator is not updated during this time.
Information:
The UPS is automatically restarted after a successful download. This can cause a
brief failure in the UPS communication.
3) Under "Battery settings", click on Save. Clicking on "Save under" opens a dialog box.
Information:
UPS settings can only be saved using UPS firmware version 1.10 and higher.
The transfer can be aborted by clicking on Cancel in the Download dialog box.
3) Click on System under UPS settings. The energy options dialog box in the Control Panel is
opened.
Further information regarding the UPD system settings can be found in the Windows help.
Information:
• UPS settings can only be changed using UPS firmware version 1.10 and
higher. If there are no changed settings on the UPS, then the factory or default
settings are used.
• The UPS is automatically restarted after UPS settings have been changed.
This can cause a brief disruption in communication with the UPS.
• Administrator rights are required in order to change the energy options or
display the UPS status.
Information:
It is not UL compliant to switch off the 8 A current limitation on devices during
battery operation!
If current limitation is enabled (checkbox deselected), then the UPS uses battery operation to
check whether the UPS battery is discharged with 8 A for longer than 16 seconds. If so, then an
overcurrent alarm is sent to the PC.
Section 4
Software
Information:
Current limitation is only supported with UPS firmware version 1.10 and higher.
Enabling one of the two following options determines how the UPS should perform when an
overcurrent alarm occurs:
If Turn-off within 1 minute is selected, then the UPS will turn-off within one when an overcurrent
alarm occurs.
Warning!
The operating system will not be properly shut down if an overcurrent alarm occurs!
If Perform "low battery" shutdown is selected, then the UPS will also signal a "Low battery
alarm" in addition to the overcurrent alarm and will turn off after the defined Low battery
shutdown time. This will allow the operating system to shut down properly when UPS service
is enabled.
Enter the "Low Battery" shutdown time in seconds. This is the amount of time that the UPS
will wait before shutting off the power supply when the battery level is low.
This prevents the UPS battery from becoming too discharged if the Windows UPS service is not
enabled and the UPS is therefore not turned off by the operating system.
If the UPS service is enabled, then the UPS will be turned off by the operating system when the
battery level is low, based on the Windows UPS service Turn-off delay (see 9.4.7 "Changing
additional UPS settings"). The low battery shutdown time will then be ignored.
Information:
• The low battery shutdown time must be set to at least 60 seconds, so that the
operating system has enough time to send the shutdown command to the
UPS when the battery level is low (normally occurs after approximately 30
seconds).
• The low battery shutdown time can only be set in UPS firmware version 1.10
and later. UPS firmware version 1.08 always uses a turn off delay time of 180
seconds. UPS firmware versions earlier than 1.08 do not shut down
automatically when the battery level is low.
3) Click on Advanced under UPS settings. This opens the following dialog box:
Information:
Administer rights are required in order to display this dialog box.
The Shutdown time can be specified in seconds under Windows UPS service. This is the
length of time that the UPS waits before switching off the power supply. When a critical alarm
occurs (e.g. at low battery level), the Windows UPS service will send a shutdown command with
the turn off delay time to the UPS and will shut down the system.
Information:
This time is evaluated by the Windows UPS Service, but can not be set in the UPS
system settings of the energy options. This value should only be changed if the
system requires longer than the default setting of 180 seconds to shut down.
Caution!
The time entered must be longer than the time required to shut down the operating
system.
Section 4
Software
Under "B&R UPS driver", activate the checkbox "UPS status messages". Any changes to the
UPS status will then trigger a message from the B&R UPS driver.
Information:
Shutting down the system is only reported by the Windows UPS Service. The UPS
Service also sends other messages if they are activated in the UPS system settings
energy options. These messages are only displayed when the Windows Alerter and
Windows Messenger1) are active and the PC is logged on to a network. Additionally,
some conditions of the B&R APC620 UPS are not detected by the Windows UPS
Service, and are therefore do not trigger messages (e.g. when there are no battery
settings on the UPS). The Windows Services can be found in the Control Panel
under Administrative Tools - Services.
1) The Windows Alerter is supported starting with B&R Windows Embedded Version 2.10 or higher.
If the checkbox Display UPS status with UPS monitor is also activated, a new message is not
displayed for every change, but only a general message and request for you to start the B&R
UPS monitor. As long as the UPS monitor is active, no new messages are displayed.
Information:
Regardless of these options, all changes to the UPS status are logged in Windows
event protocol (under "Application").
Over-current shutdown
If an over-current >8 A is present during battery operation for a duration of 16 seconds, the over-
current shutdown is executed. A turn-off time of one minute is available to the system.
If the supply is regenerated during this time, then the shut down process is aborted.
Information:
The over-current shutdown has the highest priority.
If the LowBatteryFlag is set during power failure, then the "low battery" shutdown is executed,
preventing the battery from fully discharging. Once the turn-off time expires (3 minutes by
default), the UPS shuts down.
Standard shutdown
The standard shutdown is effective when the UPS service is active, the turn-off time is 3 minutes
by default.
If the supply voltage returns during the turn-off time, then the shutdown procedure will be
stopped.
If the supply voltage returns during the shutdown process, then the shutdown timer will run until
the APC620 enters standby mode and will then reboot the system.
2. Overview of standards
Standard Description
EN 55011 Electromagnetic compatibility (EMC), radio disturbance product standard, industrial, scientific, and
Class A medical high-frequency devices (ISM devices), limit values and measurement procedure; group 1
(devices that do not create HF during material processing) and group 2 (devices that create HF during
material processing)
EN 55022 Electromagnetic compatibility (EMC), radio disturbance characteristics, information technology
Class A equipment (ITE devices), limits and methods of measurement
EN 60060-1 High-voltage test techniques - part 1: General specifications and testing conditions
EN 60068-2-1 Environmental testing - part 2: Tests; test A: Dry cold
EN 60068-2-2 Environmental testing - part 2: Tests; test B: Dry heat
EN 60068-2-3 Environmental testing - part 2: Tests; test and guidance: Damp heat, constant
EN 60068-2-6 Environmental testing - part 2: Tests; test: Vibration (sinusoidal)
EN 60068-2-14 Environmental testing - part 2: Tests; test N: Change of temperature
EN 60068-2-27 Environmental testing - part 2: Tests; test and guidance: Shock
EN 60068-2-30 Environmental testing - part 2: Tests; test and guidance: Damp heat, cyclic
Standards and
certifications
Section 5
EN 60068-2-31 Environmental testing - part 2: Tests; test: Drop and topple, primarily for equipment-type specimens
EN 60068-2-32 Environmental testing - part 2: Tests; test: Free fall
EN 60204-1 Safety of machinery, electrical equipment on machines - part 1: General requirements
EN 60529 Degrees of protection provided by enclosures (IP code)
EN 60664-1 Insulation coordination for equipment within low-voltage systems - part 1: Principles, requirements and
tests
EN 60721-3-2 Classification of environmental conditions - part 3: Classification of groups of environmental
parameters and their severities, section 2: Transport
EN 60721-3-3 Classification of environmental conditions - part 3: Classification of groups of environmental
parameters and their severities, section 3: Stationary use at weather-protected locations
Standard Description
EN 61000-4-2 Electromagnetic compatibility (EMC) - part 4-2: Testing and measuring techniques; electrostatic
discharge immunity test
EN 61000-4-3 Electromagnetic compatibility (EMC) - part 4-3: Testing and measuring techniques; radiated radio-
frequency electromagnetic field immunity test
EN 61000-4-4 Electromagnetic compatibility (EMC) - part 4-4: Testing and measuring techniques; electrical fast
transient/burst immunity test
EN 61000-4-5 Electromagnetic compatibility (EMC) - part 4-5: Testing and measuring techniques; surge immunity
test
EN 61000-4-6 Electromagnetic compatibility (EMC) - part 4-6: Testing and measuring techniques; immunity to
conducted disturbances, induced by radio-frequency fields
EN 61000-4-8 Electromagnetic compatibility (EMC) - part 4-8: Testing and measuring techniques; power frequency
magnetic field immunity test
EN 61000-4-11 Electromagnetic compatibility (EMC) - part 4-11: Testing and measuring techniques; voltage dips,
short interruptions and voltage variations immunity tests
EN 61000-4-12 Electromagnetic compatibility (EMC) - part 4-12: Testing and measuring techniques; oscillatory waves
immunity test
EN 61000-4-17 Electromagnetic compatibility (EMC) - part 4-12: Testing and measuring techniques; ripple on DC input
power port immunity test
EN 61000-4-29 Electromagnetic compatibility (EMC) - part 4-29: Testing and measuring techniques; voltage dips,
short interruptions and voltage variations on DC input power port immunity tests
EN 61000-6-2 Electromagnetic compatibility (EMC), generic immunity standard - part 2: industrial environment
EN 61000-6-4 Electromagnetic compatibility (EMC), generic emission standard - part 2: industrial environment
EN 61131-2 Product standard, programmable logic controllers - part 2: Equipment requirements and tests
Standards and
certifications
Section 5
Test carried out according to Limits according to Limits according to Limits according to
EN 55011 / EN 55022 EN 61000-6-4 EN 55011 Class A EN 55022 Class A
Power mains connections - 79 dB (μV) 79 dB (μV)
150 kHz - 500 kHz Quasi-peak value Quasi-peak value
66 dB (μV) 66 dB (μV)
Average Average
Power mains connections - 73 dB (μV) 73 dB (μV)
500 kHz - 30 MHz Quasi-peak value Quasi-peak value
60 dB (μV) 60 dB (μV)
Average Average
AC mains connections 79 dB (μV) - -
150 kHz - 500 kHz Quasi-peak value
66 dB (μV)
Average
AC mains connections 73 dB (μV) - -
500 kHz - 30 MHz Quasi-peak value
60 dB (μV)
Average
Other connections - - 97 - 87 dB (μV) und
150 kHz - 500 kHz 53 - 43 dB (μA)
Quasi-peak value
84 - 74 dB (μV) und
40 - 30 dB (μA)
Average
Other connections - - 87 dB (μV) and 43 dB (μA)
500 kHz - 30 MHz Quasi-peak value
74 dB (μV) and 30 dB (μA)
Average
Test carried out according to Limits according to Limits according to
EN 55011 / EN 55022 EN 61131-2 47 CFR Part 15 Subpart B class
A
Power mains connections 1) 79 dB (μV) -
150 kHz - 500 kHz Quasi-peak value
66 dB (μV)
Average
Power mains connections 73 dB (μV) -
500 kHz - 30 MHz Quasi-peak value
60 dB (μV)
Average
AC mains connections - 79 dB (μV)
150 kHz - 500 kHz Quasi-peak value
66 dB (μV)
Average
AC mains connections - 73 dB (μV)
500 kHz - 30 MHz Quasi-peak value
60 dB (μV)
Average
Table 364: Test requirements - Network-related emissions for industrial areas (Forts.)
Test carried out according to Limits according to Limits according to Limits according to
EN 55011 / EN 55022 EN 61000-6-4 EN 55011 Class A EN 55022 Class A
30 MHz - 230 MHz < 40 dB (μV/m) < 40 dB (μV/m) < 40 dB (μV/m)
measured at a distance of 10 m Quasi-peak value Quasi-peak value Quasi-peak value
230 MHz - 1 GHz < 47 dB (μV/m) < 47 dB (μV/m) < 47 dB (μV/m)
measured at a distance of 10 m Quasi-peak value Quasi-peak value Quasi-peak value
Test carried out according to Limits according to
EN 55011 / EN 55022 EN 61131-2
30 MHz - 230 MHz < 40 dB (μV/m)
measured at a distance of 10 m Quasi-peak value
230 MHz - 1 GHz < 47 dB (μV/m)
measured at a distance of 10 m Quasi-peak value
Test carried out Limits according to 47 CFR Part
15 Subpart B class A
30 MHz - 88 MHz < 90 dB (μV/m)
measured at a distance of 10 m Quasi-peak value
88 MHz - 216 MHz < 150 dB (μV/m)
measured at a distance of 10 m Quasi-peak value
Standards and
216 MHz - 960 MHz < 210 dB (μV/m)
certifications
Section 5
Criteria A:
The operating equipment must continue to work as intended during the test. There should be
no interference in the operating behavior and no system failures below a minimum operating
quality as defined by the manufacturer.
Criteria B:
The operating equipment must continue to work as directed after the test. There should be no
interference in the operating behavior and no system failures below a minimum operating quality
as defined by the manufacturer.
Criteria C:
A temporary function failure is permitted if the function restores itself, or the function can be
restored by activating configuration and control elements.
Criteria D:
Impairment or failure of the function, which can no longer be established (operating equipment
destroyed).
Standards and
certifications
Section 5
Standards and
certifications
Section 5
Table 373: Test requirements - Voltage dips, fluctuations, and short-term interruptions
5. Mechanical conditions
Test carried out according to Limits according to Limits according to Limits according to
EN 60068-2-6 EN 60721-3-2 class 2M1 EN 60721-3-2 class 2M2 EN 60721-3-2 class 2M3
Vibration during transport: 10 sweeps for each axis, 10 sweeps for each axis, 10 sweeps for each axis,
Uninterrupted duty with moveable packaged packaged packaged
frequency in all 3 axes (x, y, z)
Frequency Limit value Frequency Limit value Frequency Limit value
2 - 9 Hz Amplitude 2 - 9 Hz Amplitude 2 - 8 Hz Amplitude
3.5 mm 3.5 mm 7.5 mm
9 - 200 Hz Acceleration 9 - 200 Hz Acceleration 8 - 200 Hz Acceleration
1g 1g 2g
200 - 500 Hz Acceleration 200 - 500 Hz Acceleration 200 - 500 Hz Acceleration
1.5 g 1.5 g 4g
Test carried out according to Limits according to Limits according to Limits according to
EN 60068-2-27 EN 60721-3-2 class 2M1 EN 60721-3-2 class 2M2 EN 60721-3-2 class 2M3
Pulse (half-sine) stress in all 3 axes Acceleration 10 g, Acceleration 30 g, Acceleration 100 g,
(x, y, z) Length 11 ms, each 3 shocks, Length 6 ms, each 3 shocks, Length 6 ms, each 3 shocks,
packaged packaged packaged
5.5 Toppling
Test carried out according to Limits according to Limits according to Limits according to
EN 60068-2-31 EN 60721-3-2 class 2M1 EN 60721-3-2 class 2M2 EN 60721-3-2 class 2M3
Drop and topple Devices: Drop/topple Devices: Drop/topple Devices: Drop/topple
on each edge on each edge on each edge
Weight Required Weight Required Weight Required
<20 kg Yes <20 kg Yes <20 kg Yes
20 - 100 kg - 20 - 100 kg Yes 20 - 100 kg Yes
>100 kg - >100 kg - >100 kg Yes
Test carried out according to Limits according to Limits according to Limits according to Limits according to
EN 60068-2-32 EN 61131-2 EN 60721-3-2 class EN 60721-3-2 class EN 60721-3-2 class
2M1 2M2 2M3
Free fall Devices with delivery Devices packaged Devices packaged Devices packaged
packaging each with 5
fall tests
Weight Height Weight Height Weight Height Weight Height
<10 kg 1.0 m <20 kg 0.25 m <20 kg 1.2 m <20 kg 1.5 m
10 - 40 kg 0.5 m 20 - 100 0.25 m 20 - 100 1.0 m 20 - 100 1.2 m
kg kg kg
> 40 kg 0.25 m >100 kg 0.1 m >100 kg 0.25 m >100 kg 0.5 m
Devices with product
packaging each with 5
fall tests
Weight Height
<10 kg 0.3 m
10 - 40 kg 0.3 m
> 40 kg 0.25 m
Standards and
certifications
Section 5
6. Climate conditions
Table 382: Overview of limits and testing guidelines for temperature and humidity
7. Safety
Standards and
certifications
Section 5
7.6 Overload
8. Other tests
Table 399: Overview of limits and testing guidelines for other tests
9.1 Torsion
2 3
1 ... Angle of rotatio
2 ... Fixed
a 3 ... Movable
• Distance a: 450 mm
• Rotation angle: ±85°
• Velocity: 50 cycles / minute
• Special feature: The cable was clamped down twice in the machine.
• Visible pixel errors: At the beginning of the test, the minimum equalizer setting was
determined. This is the value between 0-15 at which no more pixel errors are visible. If
the equalizer setting is changed due to the mechanical load, this is noted.
• Touch screen for function (with a 21.3" Automation Panel - 5AP920.2138-01)
• USB mouse function
• Hot plug function tested by unplugging the USB plug
Standards and
certifications
Section 5
• After a test duration of 15000 cycles, the test was ended with a result of "OK".
1
1 ... Flex radius
2 ... Movable carriage
2 3 ... Monitoring unit
4 ... Hub
• Visible pixel errors: At the beginning of the test, the minimum equalizer setting is
determined. This is the value between 0-15 at which no more pixel errors are visible. If
the equalizer setting is changed due to the mechanical load, this is noted.
• Touch screen for function (with a 21.3" Automation Panel - 5AP920.2138-01)
• USB mouse function
• Hot plug function tested by unplugging the USB plug
• After a test duration of 30,000 cycles, the test was ended with a result of "OK".
B&R products and services comply with applicable standards. They are international standards
from organizations such as ISO, IEC and CENELEC, as well as national standards from
organizations such as UL, CSA, FCC, VDE, ÖVE, etc. We give special consideration to the
reliability of our products in an industrial environment.
Certifications
USA and Canada All important B&R products are tested and listed by Underwriters Laboratories and
checked quarterly by a UL inspector.
This mark is valid for the USA and Canada and simplifies certification of your machines
and systems in these areas.
Europe All harmonized EN standards for the applicable directives are met.
Standards and
certifications
Section 5
Chapter 6 • Accessories
1. Overview
5MD900.USB2-00 USB 2.0 drive DVD-ROM/CD-RW FDD CF USB Cancelled since 10/2006
Replacement type
USB 2.0 drive combination, consists of DVD-ROM/CD-RW, FDD, CompactFlash slot (type II), 5MD900.USB-01
USB connection (type A front, type B back); 24 V DC.
5MD900.USB2-01 USB 2.0 drive DVD-RW/CD-RW FDD CF USB
USB 2.0 drive combination, consists of DVD-R/RW/DVD+R/RW/CD-RW, FDD,
CompactFlash slot (type II), USB connection (type A front, type B back); 24 V DC.
5MMUSB.0128-00 USB flash drive 128 MB SanDisk Cancelled since 12/2005
Replaced by 5MMUSB.2048-
USB 2.0 flash drive 128 MB 00
This single row 3-pin terminal block is mainly used to connect the supply voltage.
0TB103.9
0TB103.91
Information:
The following characteristics, features and limit values only apply to this accessory
and can deviate from those specified for the entire device. For the entire device
where this accessory is installed, refer to the data provided specifically for the entire
device.
Accessories
Section 6
This 4-pin plug is needed for connecting to the X2X and CAN interface.
0TB704.9
0TB704.91
Information:
The following characteristics, features and limit values only apply to this accessory
and can deviate from those specified for the entire device. For the entire device
where this accessory is installed, refer to the data provided specifically for the entire
device.
The lithium battery is needed for buffering the BIOS CMOS data, the real-time clock, and SRAM
data. The battery is subject to wear and should be replaced regularly (at least following the
specified buffer duration).
Warning!
Replace battery with Renata, type CR2477N only. Use of another battery may
present a risk of fire or explosion.
Information:
The following characteristics, features and limit values only apply to this accessory
and can deviate from those specified for the entire device. For the entire device
where this accessory is installed, refer to the data provided specifically for the entire
device.
The interface covers protect interfaces from dirt and dust when not in use.
2x 4x 2x 3x 3x 2x
for DVI sockets for DUSB for Ethernet for MIC, Line IN, Line OUT for USB for CF2 / HDD or CF1
Information:
B&R CompactFlash cards 5CFCRD.xxxx-06 and CompactFlash cards from a
different manufacturer cannot be used in the same system at the same time. Due to
differences in technology (older vs. newer technologies), problems can occur
during system startup that are caused by the different boot times.
Information:
The 5CFCRD.xxxx-06 CompactFlash cards are supported on B&R devices with
WinCE Version ≥ 6.0.
CompactFlash card
Caution!
A sudden loss of power may result in data loss! In very rare cases, mass memory
may also be damaged.
Information:
The following characteristics, features and limit values only apply to this accessory
and can deviate from those specified for the fully assembled device. The data
specifications for the fully assembled device take precedence over those of
individual components.
1) Endurance of B&R CFs (with linear written block size 128 kB)
2) Not supported by B&R Embedded OS installer.
Accessories
Section 6
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
Storage
50 Operation
Transport
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
- Temperature [°C] +
7.4 Dimensions
1,60 ±0.05
±0,05
0.99 ±0.05
1.60
26 50
1 25
1.01 ±0.07 1.01 ±0.07
3.30 ±0.1
2x 12 ±0.10
2x 3 ±0.07
CompactFlash type I
2x 25.78 ±0.07
2.44 ±0.07
36.4 ±0.15
Top
0.76 ±0.07
7.5 Benchmark
40
35
30
25
Transfer rate [MB/s]
20
15
10
Figure 306: ATTO Benchmark v2.34 comparison when reading - 5CFCRD.xxxx-04 with 5CFCRD.xxxx-06
40
35
30
25
Transfer rate [MB/s]
20
15
10
5
Accessories
Figure 307: ATTO Benchmark v2.34 comparison when writing - 5CFCRD.xxxx-04 with 5CFCRD.xxxx-06
Information:
B&R CompactFlash cards 5CFCRD.xxxx-04 and CompactFlash cards from a
different manufacturer cannot be used in the same system at the same time. Due to
differences in technology (older vs. newer technologies), problems can occur
during system startup that are caused by the different boot times.
Information:
The 5CFCRD.xxxx-04 CompactFlash cards are supported on B&R devices with
WinCE Version 6.0 or higher.
CompactFlash card
Caution!
A sudden loss of power can cause data to be lost! In very rare cases, the mass
memory may also become damaged.
Information:
The following characteristics, features and limit values only apply to this accessory
and can deviate those specified for the entire device. For the entire device where
this accessory is installed, refer to the data provided specifically for the entire
device.
1) Speed specification with 1X = 150 KB/s. All specifications refer to the Samsung Flash chips, CompactFlash cards in UDMA mode 4, 30
ns cycle time in True-IDE mode with sequential write/read test.
2) The file is written/read sequentially in True IDE mode with the DOS program Thruput.exe.
3) Endurance of B&R CF cards (linear written block size with 128 KB)
4) Depending on the average file size.
5) Not supported by B&R Embedded OS installer.
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
Storage
50 Operation
Transport
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
- Temperature [°C] +
8.4 Dimensions
1,60 ±0.05
±0,05
0.99 ±0.05
1.60
26 50
1 25
1.01 ±0.07 1.01 ±0.07
3.30 ±0.1
2x 12 ±0.10
2x 3 ±0.07
CompactFlash type I
2x 25.78 ±0.07
2.44 ±0.07
36.4 ±0.15
Top
0.76 ±0.07
4 x R0.5 ±0.1
42.8 ±0.1
8.5 Benchmark
40
35
30
25
Transfer rate [MB/s]
20
15
10
40
35
30
25
Transfer rate [MB/s]
20
15
10
Information:
Silicon Systems CompactFlash cards 5CFCRD.xxxx-03 and CompactFlash cards
from a different manufacturer cannot be used in the same system at the same time.
Due to differences in technology (older vs. newer technologies), problems can
occur during system startup that are caused by the different boot times.
Information:
On Windows CE 5.0 devices, 5CFCRD.xxxx-03 CompactFlash cards up to 1GB are
supported.
Caution!
A sudden loss of power can cause data to be lost! In very rare cases, the mass
memory may also become damaged.
To prevent damage and loss of data, B&R recommends that you use a UPS device.
Information:
The following characteristics, features and limit values only apply to this accessory
and can deviate those specified for the entire device. For the entire device where
this accessory is installed, refer to the data provided specifically for the entire
device.
Accessories
Section 6
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55 Storage
50 Operation
Transport
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100
- Temperature [°C] +
9.4 Dimensions
1,60 ±0.05
±0,05
0.99 ±0.05
1.60
26 50
1 25
1.01 ±0.07 1.01 ±0.07
3.30 ±0.1
2x 12 ±0.10
2x 3 ±0.07
CompactFlash type I
2x 25.78 ±0.07
2.44 ±0.07
36.4 ±0.15
Top
0.76 ±0.07
Information:
SanDisk CompactFlash cards 5CFCRD.xxxx-02 and CompactFlash cards from a
different manufacturer cannot be used in the same system at the same time. Due to
differences in technology (older vs. newer technologies), problems can occur
during system startup that are caused by the different boot times.
CompactFlash cards are easy-to-exchange storage media. Due to their robustness against
environmental influences (e.g. temperature, shock, vibration, etc.), CompactFlash cards are
ideal for use as storage media in industrial environments.
Information:
The following characteristics, features and limit values only apply to this accessory
Accessories
and can deviate from those specified for the entire device. For the entire device
Section 6
where this accessory is installed, refer to the data provided specifically for the entire
device.
Features 5CFCRD.xxxx-02
MTBF (at 25°C) > 3,000,000 hours
Maintenance None
Data reliability < 1 unrecoverable error in 1014bit read accesses
< 1 faulty correction in 1020bit read accesses
Write/erase procedures > 2,000,000 times
Mechanical characteristics
Dimensions
Length 36.4 ±0.15 mm
Width 42.8 ±0.10 mm
Thickness 3.3 mm ±0.10 mm
Weight 11.4 g
Environmental characteristics
Ambient temperature
Operation 0 to 70°C
Bearings -25 to 85°C
Transport -25 to 85°C
Relative humidity
Operation / Storage 8 to 95%, non-condensing
Vibration
Operation / Storage Maximum 30 g (point to point)
Shock
Operation / Storage Maximum 3,000 g
Altitude 24,000 meters
10.4 Dimensions
1,60 ±0.05
±0,05
0.99 ±0.05
1.60 26 50
1 25
1.01 ±0.07 1.01 ±0.07
3.30 ±0.1
2x 12 ±0.10
2x 3 ±0.07
CompactFlash type I
2x 25.78 ±0.07
2.44 ±0.07
36.4 ±0.15
Top
0.76 ±0.07
1.65 0.63 ±0.07
41.66 ±0.13
4 x R0.5 ±0.1
42.8 ±0.1
Accessories
Section 6
SanDisk provides a 6-page "white paper" for the lifespan calculation of CompactFlash cards (see
following pages). This document can also be found on the SanDisk homepage.
2x mounting brackets
11.1 Features
Information:
The following characteristics, features and limit values only apply to this accessory
and can deviate from those specified for the entire device. For the entire device
where this accessory is installed, refer to the data provided specifically for the entire
device.
11.3 Dimensions
52
140
156
Accessories
Section 6
196
82,5
52
80
14
20 156
140
Amount Component
1 USB Media Drive complete unit
2 Mounting rail brackets
11.6 Interfaces
11.7 Installation
The USB Media Drive can be operated as a desk-top device (rubber feet) or as a rack-mount
device (2 mounting rail brackets included).
Because of limits to the mounting orientation with the components used (floppy, DVD-CDRW
drive), the USB media drive is only permitted to be mounted and operated as shown in the
following figure.
less than 20° less than 20° less than 20° less than 20°
This front cover can also be mounted on the front of the USB media drive (model number
5MD900.USB2-00 or 5MD900.USB2-01) to protect the interface.
4x
4x
Features 5A5003.03
Front cover design / colors
Accessories
Section 6
11.8.2 Dimensions
80
196 8
11.8.3 Installation
The front cover is attached with 2 mounting rail brackets (included with USB Media Drive) and 4
locknuts. The USB media drive and front cover can be mounted as a whole in (for example) a
switching cabinet door.
max. 10 mm
2x mounting brackets
12.1 Features
Information:
The following characteristics, features and limit values only apply to this accessory
and can deviate from those specified for the entire device. For the entire device
where this accessory is installed, refer to the data provided specifically for the entire
device.
1) RAM drivers are not provided by the manufacturer. Support of RAM function by the burning software "Nero" (model number
5SWUTI.0000-00) or other burning software packages and drivers from third party providers.
12.3 Dimensions
52
140
156
196
82,5
52
80
14
20 156
140
Amount Component
1 USB Media Drive complete unit
2 Mounting rail brackets
12.6 Interfaces
12.7 Installation
The USB Media Drive can be operated as a desk-top device (rubber feet) or as a rack-mount
device (2 mounting rail brackets included).
Because of limits to the mounting orientation with the components used (floppy, DVD-CDRW
drive), the USB media drive is only permitted to be mounted and operated as shown in the
following figure.
less than 20° less than 20° less than 20° less than 20°
This front cover can also be mounted on the front of the USB media drive (model number
5MD900.USB2-00 or 5MD900.USB2-01) to protect the interface.
4x
4x
Features 5A5003.03
Front cover design / colors
Dark gray border around the cover Similar to Pantone432CV
Light gray background Similar to Pantone 427CV
12.8.2 Dimensions
80
196 8
12.8.3 Installation
The front cover is attached with 2 mounting rail brackets (included with USB Media Drive) and 4
locknuts. The USB media drive and front cover can be mounted as a whole in (for example) a
switching cabinet door.
max. 10 mm
Information:
We reserve the right to supply alternative products due to the vast quantity of flash
drives available on the market and their corresponding short product lifecycle.
Therefore, the following measures might be necessary in order to boot from these
flash drives (e.g. the SanDisk Cruzer Micro flash drive with 512 MB):
• The flash drive must be reformatted or in some cases even re-partitioned (set
active partition).
• The flash drive must be at the top of the BIOS boot order, or alternatively the
IDE controllers can also be deactivated in the BIOS. This can be avoided in
most cases if a "fdisk /mbr" command is also executed on the USB flash
drive.
USB flash drives are easy-to-exchange storage media. Because of the fast data transfer
provided by USB 2.0, USB flash drives are ideal for use as a portable memory medium. Without
requiring additional drivers ("Hot Plug & Play" - except with Windows 98SE), the USB flash drive
can be converted immediately into an additional drive where data can be read or written.
Information:
The following characteristics, features and limit values only apply to this accessory
and can deviate those specified for the entire device. For the entire device where
this accessory is installed, refer to the data provided specifically for the entire
device.
LED
Cruzer Mini / Cruzer Micro 1 LED (green), signals data transfer (send and receive)
Power supply Via the USB port
Current requirements Cruzer Mini / 650 μA in sleep mode, 150 mA read/write
Cruzer Micro
Interface Cruzer Mini / Cruzer Micro USB specification 2.0 high speed device, mass storage class, USB-IF and WHQL certified
Type USB 1.1 and 2.0 compatible
Transfer rate Up to 480 MBit (high speed)
Sequential reading Max. 8.7 MB/second
Sequential writing Max. 1.7 MB/second
Connection To each USB type A interface
MTBF (at 25°C)
Cruzer Mini / Cruzer Micro 100,000 hours
Data retention
Cruzer Mini / Cruzer Micro 10 years
Maintenance
Cruzer Mini / Cruzer Micro None
Operating system support
Cruzer Mini Windows CE 4.1, CE 4.2, 98SE1) , ME, 2000, XP, Mac OS 9.1.x and Mac OS X 10.1.2
Cruzer Micro Windows CE 4.2, CE 5.0, ME, 2000, XP and Mac OS 9.1.x+, OS X v10.1.2+
Mechanical characteristics
Dimensions
Height - Cruzer Mini / Cruzer Micro 62 mm / 52.2 mm
Width - Cruzer Mini / Cruzer Micro 19 mm / 19 mm
Depth - Cruzer Mini / Cruzer Micro 11 mm / 7.9 mm
Environmental characteristics
Environmental temperature Cruzer Mini /
Cruzer Micro2)
Operation 0 to +45°C
Bearings -20 to +60°C
Transport -20 to +60°C
Humidity Cruzer Mini / Cruzer Micro
Operation 10 to 90%, non-condensing
Bearings 5 to 90%, non-condensing
Transport 5 to 90%, non-condensing
Accessories
Section 6
1) For Win 98SE, a driver can be downloaded from the SanDisk homepage.
2) Temperature data is for operation at 500 meters. Derating the max. ambient temperature - typically 1°C per 1000 meters (from 500
meters above sea level).
100
95
90
Relative Luftfeuchtigkeit [%RH] (nicht kondensierend)
85
80
75
70
65
60
55
Transport
Lagerung
50 Betrieb
45
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperatur [°C] +
Information:
The following characteristics, features and limit values only apply to this accessory
and can deviate those specified for the entire device. For the entire device where
this accessory is installed, refer to the data provided specifically for the entire
device.
Features 5MMUSB.2048-01
LED 1 LED (green), signals data transfer (send and receive)
Power supply Via the USB port
Current requirements max. 500 μA sleep mode, max. 120 mA read/write
Interface USB specification 2.0 high speed device, mass storage class, USB-IF and WHQL certified
Type USB 1.1 and 2.0 compatible
Transfer rate Up to 480 MBit (high speed)
Sequential reading Max. 31 MB/second
Sequential writing Max. 30 MB/second
Connection To each USB type A interface
MTBF > 3,000,000 hours
Data retention > 10 years
Maintenance None
Operating system support Windows CE, ME, 2000, XP, Vista und Mac OS 9 or newer, Linux 2.4 or newer
Mechanical characteristics
Dimensions
Length 67.85 mm
Width 17.97 mm
Thickness 8.35 mm
Environmental characteristics
Ambient temperature
Operation 0 to 70°C
Bearings -50 to 100°C
Transport -50 to 100°C
Relative humidity
Operation 85%, non-condensing
Bearings 85%, non-condensing
Transport 85%, non-condensing
Vibration
Operation At 20 - 2000 Hz: 20 g (peak)
Bearings At 20 - 2000 Hz: 20 g (peak)
Transport At 20 - 2000 Hz: 20 g (peak)
Shock
Operation max. 1500 g (peak)
Bearings max. 1500 g (peak)
Accessories
Section 6
100
95
90
85
Relative humidity [%RH] (non-condensing)
80
75
70
65
60
55
Transport
50
Storage
45 Operation
40
35
30
25
20
15
10
5
0
-80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90
- Temperature [°C] +
Temperature data is for operation at 500 meters. Derating the max. ambient temperature -
typically 1°C per 1000 meters (from 500 meters above sea level).
This DVD contains drivers, utilities, software upgrades and user's manuals for B&R Panel
system products (see B&R homepage www.br-automation.com – Industrial PCs, Visualization
and Operation).
At the time of its creation, the content on the DVD is identical to the files found in the download
area of the B&R homepage (under Service – “Material Related Downloads”).
• Automation PC 620 / Panel PC 700 CPU Board 815E und 855GME BIOS
• Automation PC 620 / Panel PC 700 CPU Board X855GME BIOS
• Automation PC 620 / Panel PC 700 CPU Board 945GME N270 BIOS
• Automation PC 680
• Automation PC 810 / Automation PC 820 / Panel PC 800 B945GME BIOS
Accessories
Section 6
Firmware Upgrades
Utilities / Tools
Windows
• Windows CE 6.0
• Windows CE 5.0
• Windows CE 4.2
• Windows CE 4.1
• Windows CE Tools
• Windows Embedded Standard 2009
• Thin Client
• Windows NT Embedded
• Windows XP Embedded
• VNC Viewer
• Industrial PCs
Accessories
Section 6
• Industrial PCs
• Automation PCs
• Automation Panel 900
• Panel (Power Panel)
Documentation for
• Automation PC 620
• Automation PC 680
• Automation PC 810
• Automation PC 820
• Automation Panel 800
• Automation Panel 900
• Panel PC 310
• Panel PC 700
• Panel PC 725
• Panel PC 800
• Power Panel 15/21/35/41
• Power Panel 100/200
• Power Panel 300/400
• Mobile Panel 40/50
• Mobile Panel 100/200
• Mobile Panel connection box
• Provit 2000
• Provit 3030
• Provit 4000
• Provit 5000
• Provit Benchmark
• Provit Mkey
• Windows CE 5.0 help
• Windows CE 6.0 help
• Windows NT Embedded application guide
• Windows XP Embedded application guide
• UPS - uninterruptible power supply
• Implementation instructions
• B&R Hilscher feldbus cards (CANopen, DeviceNet, PROFIBUS, PROFINET)
Service tools
Accessories
Section 6
15. Cables
This supply cable is used internally e.g. to supply special PCI cards. It is connected to the
APC620 main board. For requirements and procedures, see appendix A, section "Connection of
an external device to the main board", on page 792.
Features 5CAMSC.0001-00
Length 100 mm ±5 mm
Connector type 1x 4-pin male disk drive power plug, 1x 4-pin female plug housing
Wire cross section AWG 22
Flexibility Flexible
Caution!
DVI cables can only be plugged in and unplugged when the APC620 and display
device (Automation Panel 900, monitor) are turned off.
Accessories
Section 6
Plug Ferrite
Ferrite Ferrite
The following figure shows the pin assignments for the DVI cable available at B&R. If you want
to build a suitable cable yourself, it should be wired according to these specifications.
Warning!
If a self-built cable is used, B&R cannot guarantee that it will function properly.
8 24
17 1 16
9
Pin assignments
DVI-D (24+1), male DVI-D (24+1), male
24 24
23 23
22 22
19 19
18 18
17 17
16 16
15 15
14 14
11 11
10 10
9 9
7 7
6 6
3 3
2 2
1 1
Cable shielding Cable shielding
Figure 343: Pin assignments - DVI cable
Accessories
Section 6
The SDL cables 5CASDL.0xxx-00 are designed for fixed layout. Use of the SDL flex cable
5CASDL.0xxx-03 is required for a flexible installation (e.g. in swing arm systems).
Plug Plug
Ferrite Ferrite
Caution!
The SDl cable can only be plugged in and unplugged when the device is turned off.
Length 1.8 m 5m 10 m 15 m 20 m 25 m 30 m
Tolerance ±50 mm ±80 mm ±100 mm ±120 mm ±150 mm ±200 mm ±200 mm
Cable diameter
Typical 8.6 ±0.2 mm 11 ±0.2 mm
Maximum 9 mm 11.5 mm
Shielding Individual cable pairs and entire cable
Connector type 2x DVI-D (24+1), male
Connection cycles 100
Wire cross section AWG 28 AWG 24
Line resistance Max. 237 Ω/km Max. 93 Ω/km
Insulation resistance Min. 10 MΩ/km
Flexibility Limited flexibility; valid for ferrite magnet - ferrite magnet (tested 100 cycles with 5x cable diameter, 20 cycles /
minute)
Halogen-free No
Flex radius See figure "Flex radius specification", on page 697
Fixed layout 5x cable diameter (plug - ferrite magnet and ferrite magnet - ferrite magnet)
Weight Approx. 300 Approx. 590 Approx. 2100 Approx. 3000 Approx. 4100 Approx. 5100 Approx. 6100
g g g g g g g
Plug Ferrite
Ferrite Ferrite
The following figure shows the pin assignments for the SDL cable available at B&R. If you want
to build a suitable cable yourself, it should be wired according to these specifications.
Warning!
If a self-built cable is used, B&R cannot guarantee that it will function properly.
16 9 17
1
24 8
8 24
17 16
9 1 Pin assignments
DVI (24+1), male DVI (24+1), male
24 24
23 23
22 22
21 21
20 20
19 19
18 18
17 17
16 16
15 15
14 14
13 13
12 12
11 11
10 10
9 9
7 7
6 6
5 5
4 4
3 3
2 2
1 1
Cable shielding Cable shielding
Figure 346: Pin assignments - SDL cable 5CASDL.0xxx-00
Plug
Plug
Ferrite Ferrite
Caution!
The SDl cable can only be plugged in and unplugged when the device is turned off.
Table 437: Technical data - SDL cable with 45° plug 5CASDL.0xxx-01
Plug Ferrite
Ferrite Ferrite
The following figure shows the pin assignments for the SDL cable available at B&R. If you want
to build a suitable cable yourself, it should be wired according to these specifications.
Warning!
If a self-built cable is used, B&R cannot guarantee that it will function properly.
8 24
16
Pin assignments
24 16
24 24
9
23 23
17
22 22
21 21
20 20
19 19
18 18
17 17
16 16
15 15
14 14
13 13
12 12
11 11
10 10
9 9
7 7
6 6
5 5
4 4
3 3
2 2
1 1
Cable shielding Cable shielding
Accessories
Section 6
Figure 349: Pin assignments - SDL cable with 45° plug 5CASDL.0xxx-01
The SDL cables (with extender) 5CASDL.0xxx-10 are designed for fixed layout. Use of the SDL
flex cable (with extender) 5CASDL.0x00-13 is required for a flexible installation (e.g. in swing
arm systems).
Display PC
Caution!
SDL cables with extender can only be plugged in and unplugged when the device is
turned off. The correct direction of connection (Display, PC) for the wiring is
illustrated on the middle of the extender.
Plug Ferrite
Ferrite Extender
The SDL cable with extender must be connected between the Automation PC 620 and
Automation Panel 900 display unit in the correct direction. The correct signal direction is
indicated on the extender unit for this purpose:
• Connect the end labeled "PC" with the video output of the Automation PC 620.
• The "Display" end should be connected to the display unit Automation Panel 900.
Extender unit
DISPLAY
PC
Signal direction
DISPLAY PC
Automation Panel 900
Automation PC 620
Figure 352: Example of the signal direction for the SDL cable with extender
The following figure shows the pin assignments for the SDL cable with extender available at
B&R.
Information:
Only B&R SDL cables with extender can be used.
Extender Unit
Black Box
8 24
17 1 Pin assignments 16
9
DVI (24+1), male DVI (24+1), male
24 24
23 23
22 22
21 21
20 20
19 19
18 18
17 17
16 16
15 15
14 14
13 13
12 12
11 11
10 10
9 9
7 7
6 6
5 5
4 4
3 3
2 2
1 1
Cable shielding Cable shielding
Figure 353: Pin assignments - SDL cable with extender 5CASDL.0x00-10
Accessories
Section 6
The SDL flex cables 5CASDL.0xxx-03 are designed for both fixed and flexible installations (e.g.
in swing arm systems).
Caution!
The SDl cable can only be plugged in and unplugged when the device is turned off.
Length 1.8 m 5m 10 m 15 m 20 m 25 m 30 m
Tolerance ±20 mm ±45 mm ±90 mm ±135 mm ±180 mm ±225 mm ±270 mm
Cable diameter
Maximum 12 mm
Shielding Individual cable pairs and entire cable
Connector type 2x DVI-D (24+1), male
Connection cycles Min. 200
Contacts Gold plated
Mechanical protection Metal cover with crimped stress relief
Max. tension
During installation ≤ 400 N
During operation ≤ 50 N
Materials RoHS compliant
Cable shield Aluminum foil clad + tinned copper mesh
Color Black (similar to RAL 9005)
Flexibility Flexible; valid for ferrite magnet - ferrite magnet (tested 300,000 cycles with 15x cable diameter, 4800 cycles / hour)
Halogen-free Yes
Flex radius See figure "Flex radius specification", on page 708
Fixed layout 6x cable diameter (of plug - ferrite magnet)
10x cable diameter (of ferrite magnet - ferrite magnet)
flexible installation 15x cable diameter (of ferrite magnet - ferrite magnet)
Weight Approx. 450 Approx. 1000 Approx. 2000 Approx. 3000 Approx. 4000 Approx. 5000 Approx. 6000
g g g g g g g
Electrical properties (at
20°C)
Wire cross section 24 AWG (control wires)
26 AWG (DVI, USB, data)
Line resistance
24 AWG ≤ 95 Ω/km
26 AWG ≤ 145 Ω/km
Insulation resistance > 200 MΩ/km
Wave impedance 100 ±10 Ω
Test voltage
Wire / wire 1 kVeff
Wire / shield 0.5 kVeff
Operating voltage ≤ 30 V
Environmental
characteristics
Temperature resistance
Fixed installation -20 to 80°C
Moving -5 to 60°C
Accessories
Section 6
Torsion load 100,000 cycles (tested angle of rotation: ±85° speed: 50 cycles / minute)
Cable drag chain 300,000 cycles
Tested flex radius: 180 mm;15x cable diameter; hub: 460 mm; speed: 4800 cycles / hour
Approbation UL AWM 20236 80°C 30 V
Oil and hydrolysis According to VDE 0282-10
resistance
Plug Ferrite
Ferrite Ferrite
15.6.4 Dimensions
19
max. Ø 12
Ø 22
38
15 36.5
55 110 ±10 37.5 ±2.5
Length
All values in mm
15.6.5 Structure
Accessories
Section 6
The following figure shows the pin assignments for the SDL cable available at B&R. If you want
to build a suitable cable yourself, it should be wired according to these specifications.
Warning!
If a self-built cable is used, B&R cannot guarantee that it will function properly.
8 24
17 1 16
9
Pin assignments
DVI (24+1), male DVI (24+1), male
TMDS Clock - 24 24 TMDS Clock -
TMDS Clock + 23 23 TMDS Clock +
TMDS Clock Shield 22 22 TMDS Clock Shield
XUSB1+ 21 21 XUSB1+
XUSB1- 20 20 XUSB1-
TMDS DATA 0/XUSB1 Shield 19 19 TMDS DATA 0/XUSB1 Shield
TMDS Data 0+ 18 18 TMDS Data 0+
TMDS Data 0- 17 17 TMDS Data 0-
Hot Plug Detect 16 16 Hot Plug Detect
Ground 15 15 Ground
+5V 14 14 +5V
XUSB0+ 13 13 XUSB0+
XUSB0- 12 12 XUSB0-
TMDS DATA 1/XUSB0 Shield 11 11 TMDS DATA 1/XUSB0 Shield
TMDS Data 1+ 10 10 TMDS Data 1+
TMDS Data 1- 9 9 TMDS Data 1-
DDC Clock 7 7 DDC Clock
DDC Data 6 6 DDC Data
SDL+ 5 5 SDL+
SDL- 4 4 SDL-
TMDS DATA 2/SDL Shield 3 3 TMDS DATA 2/SDL Shield
TMDS Data 2+ 2 2 TMDS Data 2+
TMDS Data 2- 1 1 TMDS Data 2-
Cable shielding Cable shielding
Figure 357: Pin assignments - SDL cable 5CASDL.0xxx-03
The SDL flex cables (with extender) 5CASDL.0x00-13 are designed for both fixed and flexible
installations (e.g. in swing arm systems).
SDL OUT
SDL IN
SDL IN SDL OUT
Caution!
SDL cables with extender can only be plugged in and unplugged when the device is
turned off. The correct direction of connection (SDL IN, SDL OUT) for the wiring is
illustrated on the middle of the extender and between the ferrite magnet and plug
(with a sticker).
Accessories
Section 6
Table 444: Technical data - SDL flex cable with extender 5CASDL.0x00-13
Table 444: Technical data - SDL flex cable with extender 5CASDL.0x00-13 (Forts.)
Plug Ferrite
Ferrite Extender
15.7.4 Dimensions
max. Ø 12
19
Ø 22
SDL OUT
SDL IN
38
15
34
36.5
55 110 ±10 37.5 ±2.5 130
Length
All values in mm
The SDL flex cable with extender must be connected between the Industrial PC and Automation
Panel 900 display unit in the correct direction. The signal direction is indicated on the extender
unit for this purpose:
• Connect the end labeled "SDL IN" with the video output of the Automation PC 620 or
Panel PC 700 (monitor/panel output) or Panel OUT of an AP900 AP Link card.
• The "SDL OUT" end should be connected to the display unit (e.g. Automation Panel 900)
via the Automation Panel Link insert card (Panel IN).
Extender unit
Signal direction
DISPLAY PC
Automation Panel 900
Automation PC 620
Figure 361: Example of the signal direction for the SDL flex cable with extender - APC620
SDL OUT
SDL IN
SDL IN
to to
Panel OUT Panel IN
Figure 362: Example of signal direction display - SDL flex cable with extender
The following figure shows the pin assignments for the SDL flex cable with extender available at
B&R.
Information:
Only B&R SDL flex cables with extender can be used.
Extender Unit
Black Box
8 24
17 1 Pin assignments 16
9
DVI (24+1), male DVI (24+1), male
24 24
23 23
22 22
21 21
20 20
19 19
18 18
17 17
16 16
15 15
14 14
13 13
12 12
11 11
10 10
9 9
7 7
6 6
5 5
4 4
3 3
2 2
1 1
Cable shielding Cable shielding
Figure 363: Pin assignments - SDL flex cable with extender 5CASDL.0x00-13
Accessories
Section 6
The following figure shows the pin assignments for the RS232 cable available at B&R. If you
want to build a suitable cable yourself, it should be wired according to these specifications.
Warning!
If a self-built cable is used, B&R cannot guarantee that it will function properly.
6 1 9 5
9 6
5 1
Pin assignments
DSUB (9-polig), male DSUB (9-polig), female
9 9
8 8
7 7
6 6
5 5
4 4
3 3
2 2
1 1
Cable shielding Cable shielding
Figure 365: Pin assignments - RS232 cable
Accessories
Section 6
The following figure shows the pin assignments for the USB cable available at B&R. If you want
to build a suitable cable yourself, it should be wired according to these specifications.
Warning!
If a self-built cable is used, B&R cannot guarantee that it will function properly.
4 2 3
1 1 4
Pin assignments
USB Type A, male USB Type B, male
4 4
3 3
2 2
1 1
Cable shielding Cable shielding
Figure 367: Pin assignments - USB cable
Accessories
Section 6
With the optionally integrated UPS, the Automation PC 620 makes sure that the PC system
completes write operations even after a power failure occurs. When the UPS detects a power
failure, it switches to battery operation immediately without interruption. This means that all
running programs will be ended properly by the UPS software. This prevents the possibility of
inconsistent data (only functions if the UPC is already configured and the driver is activated).
Information:
More detailed information about uninterruptible power supplies can be found in the
UPS users manual (of the external UPS 24 VDC). This can be downloaded from the
B&R homepage.
Information:
The monitor is not buffered by the UPS and will shut off when the power fails.
By integrating the charging circuit in the Automation PC 620 housing, the installation has been
reduced to merely attaching the connection cable to the battery unit mounted next to the PC.
Special emphasis was placed on ease of maintenance when the battery unit was designed. The
batteries are easily accessible from the front and can be switched in just a few moments when
servicing.
Temperature
Supply voltage
+ 24 VDC
16.2 Features
16.3 Requirements
For info regarding upgrading the firmware, see chapter 4 "Software", section 2.2 "Upgrade the
firmware", on page 555.
The APC620 firmware version can be read in BIOS under the main menu item "Advanced",
submenu item "Baseboard/Panel Features", or in the B&R Control Center.
Versions
BIOS: R121
MTCX PX32: V1.61 MTCX PX32 Firmware
MTCX FPGA: V1.18 MTCX FPGA Firmware
Optimized ID: 11111111b
Device ID: 00001BB7h
Compatibility ID: 0000h
Serial Number: 70950168449
Product Name: System 2PCI 1DD
User Serial ID: 00000000h
The required firmware versions can be found in the APC620 / Panel PC firmware upgrade
(MTCX, SDLR, SDLT) V1.161) .
6) To configure: Automation Device Interface driver version 1.60 or higher (for the ADI Control
Center)
For info regarding configuration of the B&R UPS using the ADI Control Center, see chapter
4 "Software", section 9.4 "UPS configuration", on page 599.
Accessories
Section 6
The add-on UPS module can easily be installed in an appropriate APC620 system unit (List of
required revisions: see section "Requirements", on page 721).
Technical data
Features 5AC600.UPSI-00
Switching threshold mains / battery 15 / 13 V
operation
Mains failure bridging Max. 20 min at 150 W load
Charging current Max. 0.5 A
Deep discharge protection Yes, at 10 V on the battery unit
Short circuit protection No
Power requirements Max. 7.5 W
Status indicators Via the ADI Control Center (see section "UPS configuration", on page 599)
Configuration Via the ADI Control Center (see section "UPS configuration", on page 599)
Installation
The module is installed using the materials included in the delivery. For installation instructions,
see chapter 7 "Maintenance / Servicing", section 5 "Installing the UPS module", on page 765.
Accessories
Section 6
The battery unit is subject to wear and should be replaced regularly (at least following the
specified lifespan).
Technical data
16000
Temperature Lifespan (days)
25 14600 14000
30 9467
35 6139 10000
Lifespan [days]
40 3980
45 2581 8000
50 1674
55 1085 6000
60 704
65 456 4000
70 296
75 192 2000
80 124
0
25 30 35 40 45 50 55 60 65 70 75 80
- Temperature [°C] +
1000000
100000
Discharge cycles
10000
1000
100
0 10 20 30 40 50 60 70 80 90 100
Amount of discharge [%]
Dimensions
52
8.4
ø5.4
ø11
166
170.5
143
103
30.9
14
104 87.5
118
Drilling template
Contour
178.9
170.5
141.9
Mounting instructions
Due to the unique construction of these batteries, they can be stored and operated in any
position.
Accessories
Section 6
Technical data
24 VDC mains
Handshake signals
(Via null modem cable)
Temperature sensor
24 VDC
Battery unit
e.g. 9A0100.14
For supply with an external UPS, a UPS charging unit, a battery unit and a null modem cable are
required.
In normal operation, the 24 VDC supply voltage is put straight through to the load system. If the
supply voltage fails, the rechargeable UPS batteries power the PC to allow controlled shutdown
without loss of data.
Data and commands are exchanged between the UPS and the load system via the handshake
signals for an RS232 interface.
More information concerning an external UPS is available in the "UPS manual", which can be
downloaded from the B&R homepage (www.br-automation.com).
Accessories
Section 6
The universal (3.3 V and 5 V) half-size PCI Ethernet card has a 10/100 MBit/s network
connection and can be inserted in a 16-bit PCI slot and operated as an additional network
interface.
LEDs ETH1
k connection
Ethernet connection
Controller Intel 82551ER RJ45 twisted pair (10BaseT/100BaseT), female
Power supply Universal card (2 notches)
for 3.3 V or 5 V
Cabling S/STP (Cat5e) Speed Act/Link
1)
Transfer rate 10/100 MBit/s
Cable length max. 100 m (min. Cat5e)
LED On Off
Green 100 Mbit/s 10 Mbit/s
Orange Link Activity (blinking)
(Ethernet network (Data transfer in
connection progress) ETH
available)
Accessories
Section 6
A special driver is necessary for operating the Intel Ethernet controller 82551ER. Drivers for
Windows XP Professional, Windows XP Embedded, and DOS are available for download on the
B&R Homepage in the download area (www.br-automation.com ).
Information:
Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages.
18.1.3 Dimensions
0.8
100.3
64.4
8
42.6
58
106.3
121.7 All values in mm
The universal (3.3 V and 5 V) half-size PCI Ethernet card has three 10/100 MBit/s network
connections and can be inserted in a 16-bit PCI slot and operated as an additional network
interface.
LEDs ETH1
rk connection
LEDs ETH2
rk connection
LEDs ETH3
rk connection
Ethernet connections
Controller each with Intel 82551ER
3 x RJ45 twisted pair (10BaseT/100BaseT), female
Power supply Universal card (2 notches)
for 3.3 V or 5 V
Cabling each S/STP (Cat5e) Speed Act/Link Speed Act/Link
Speed Act/Link
1)
Transfer rate each 10/100 MBit/s
Cable length each max. 100 m (min. Cat5e)
LED On Off
Green 100 Mbit/s 10 Mbit/s
Orange Link Activity (blinking)
(Ethernet network (Data transfer in ETH1 ETH2 ETH3
connection progress)
available)
A special driver is necessary for operating the Intel Ethernet controller 82551ER. Drivers for
Windows XP Professional, Windows XP Embedded, and DOS are available for download on the
B&R Homepage in the download area (www.br-automation.com ).
Information:
Required drivers can only be downloaded from the B&R homepage, not from
manufacturers' pages.
18.2.3 Dimensions
0.8
100,3
95
8
42.6
58
106.3
121.7 All values in mm
Information:
The fan filters are subject to wear , and should be checked with appropriate
frequency to determine whether the air flow provides sufficient cooling. An
exchange or cleaning of the filter kit is appropriate at that time.
The 512 KB SRAM module increases APC620 application possibilities. It is inserted internally on
the baseboard (depending on revision) and doesn't require a PCl slot. Nonvolatile data can be
stored on it. The module is backed up by the APC620 battery.
Station switch
The following system unit hardware revisions are required before mounting the SRAM module:
Features 5AC600.SRAM-00
Connection to system via the PCl bus (PCI PnP)
Memory SRAM
Quantity 512 kB
Battery-buffered Yes
Remanent variables for AR 256 kB with CPU board 5PC600.E855-xx and 5PC600.X855-xx
(Automation Runtime) in power fail 192 kB with CPU board 5PC600.X945-00
mode
Station switch 16 digits (0-F)
Data rate Up to 31 MB/s for write access
Up to 25 MB/s for read access
Features 5AC600.SRAM-00
PCI configuration space Value Meaning
Vendor ID 1677h B&R
Device ID A085h 5AC600.SRAM-00
Status 0200h DEVSEL timing medium
HeaderType 00h Single function device
The card is registered in the PCI
Configuration Space as Single Value Meaning
Function Device
Device 0
Base class 05h Memory controller
Sub class 00h RAM
Command 0000h Bus master (not used)
IRQ - Not used
BAR0 512 kByte memory area
BAR1 4 Byte I/O area
The module is presently only supported in an Automation Runtime environment. Driver for other
operating systems (e.g. Windows XP) are available upon request.
Accessories
Section 6
20.3 Installation
Installation is described in the example with system unit 5PC600.SF03-00 with inserted AP Link
cards and APC620 UPS module.
• Remove side cover from APC620 (see chapter 7 "Maintenance / Servicing", section 6
"Mounting the side cover", on page 781).
• Screw on the M3x5 Torx included in the delivery to the baseboard of the module.
Fastening bolt
Baseboard plug
In order to meet demands for complete, comprehensive system solutions, power supplies are
available in the B&R product line for mounting rail installation. This extensive spectrum ranges
from single-phase power supplies that supply 2.1 A up to three-phase power supplies that supply
40 A. All switching power supplies can manage a wide range of AC and DC input voltages. This
input ranges from 100 to 240 VAC or 400 to 500 VAC and from 85 to 375 VDC. Devices are
protected against short circuit, overload, and open circuit, which allows them to be operated
without functional limitations or derating even when overloads between 15% and 25% occur.
Two mini power supplies (PS102 and PS104) in robust plastic housing are available in the lower
performance range. A well-designed cooling concept allows several different mounting
orientations. The functional DIN rail allows fast mounting and removal. Wiring is essentially
performed in seconds thanks to the spring clamps being used. The compact design, easy
mounting and several different mounting orientations make the two smallest power supplies in
this product line components that can be used practically anywhere.
Accessories
Section 6
The technical data listed in the following tables should act as a brief selection guide. For more
detailed technical data, data sheets are available for download from production description
section of the B&R homepage (www.br-automation.com).
Maintenance / Servicing
Section 7
Chapter 7 • Maintenance / Servicing
The following chapter describes service/maintenance work which can be carried out by a trained,
qualified user.
The lithium battery buffers the internal real-time clock (RTC) and the CMOS data. The buffer
duration of the battery is at least 4 years (2½ years with the SRAM module model number
5AC600.SRAM-00 and at 50°C, 8.5 mA current requirements of the supplied components and a
self discharge of 40%).
Information:
• The product design allows the battery to be changed with the APC620
switched either on or off. In some countries, safety regulations do not allow
batteries to be changed while the module is switched on.
• Any BIOS settings that have been made will remain when the battery is
changed with the power turned off (stored in non-volatile EEPROM). The date
and time must be reset later because this data is lost when the battery is
changed.
• The battery should only be changed by qualified personnel.
Warning!
Replace battery with Renata, type CR2477N only. Use of another battery may
present a risk of fire or explosion.
The following replacement lithium batteries are available: 4A0006.00-000 (single) and
0AC201.91 (4 pcs.).
The battery status is evaluated immediately following start-up of the device and is subsequently
checked by the system every 24 hours. The battery is subjected to a brief load (1 second) during
the measurement and then evaluated. The evaluated battery status is displayed in the BIOS
Setup pages (under Advanced - Baseboard monitor) and in the B&R Control Center (ADI driver),
but can also be read in a customer application via the ADI Library.
From the point when battery capacity is recognized as insufficient, data buffering is guaranteed
for approximately another 500 hours. When changing the battery, data is buffered for
approximately another 10 minutes by a gold leaf capacitor.
1.2 Procedure
• Disconnect the power supply to the Automation PC 620 (also see information on page
743).
• Touch the housing or ground connection (not the power supply!) in order to discharge any
electrostatic charge from your body.
• Remove the black plastic cover from the battery compartment and carefully pull out the
battery using the removal strips.
Maintenance / Servicing
• Insert the new battery with correct polarity. The battery should not be held by its edges.
Insulated tweezers may also be used for inserting the battery.
Section 7
Correct Incorrect
• To make the next battery change easier, be sure the removal strip is in place when
inserting battery.
• Reconnect the power supply to the PC 620 by plugging the power cable back in and
pressing the power button (also see information on page 743).
• Reset the data and time in BIOS (see information on page 743).
Warning!
Lithium batteries are considered hazardous waste. Used batteries should be
disposed of according to local requirements.
By pressing the ejection lever (see figure) with a pointed object (i.e. pen) the exchange of the
CompactFlash card is quickly and safely.
Ejection lever
CompactFlash
Caution!
The power must be turned off before inserting or removing the CompactFlash card!
Maintenance / Servicing
3. Fan kit installation and replacement
Section 7
3.1 Procedure for APC620 with 1 PCI slot
Figure 391: APC620 1PCI slot - Remove screws to install/ remove filter kit
• After the screws have been removed, the side cover and the fan kit cover can be removed
toward the front.
Side cover
Figure 392: APC620 1PCI slot - Remove side cover and fan kit cover
• If a PCI card is in place, it must be removed before moving on to the next step.
• There are two arrows on the fans that indicate the direction of air flow and the direction
of fan rotation.
Air flow
Direction of rotation
Warning!
The fans must be inserted so that the air flows toward the inside of the housing.
• Align fans over the fastening bolts (see arrows). Feed cables through the openings in the
housing (see circles) into the main board of the APC620.
Maintenance / Servicing
• The fan connection cable must be connected to the main circuit board at the right position
(fan 1 at position 1, fan 2 at position 2, fan 3 at position 3).
Section 7
1 2 3
3
2 1
Figure 395: APC620 1PCI slot - Fan cable connection to the main board
Figure 396: APC620 2PCI slots - Remove screws to install/ remove filter kit
• After the screws have been removed, the side cover and the fan kit cover can be removed
toward the front.
Side cover
Figure 397: APC620 2PCI slots - Remove side cover and fan kit cover
Maintenance / Servicing
• If one or more PCI cards are in place, they must be removed before moving on to the next
step.
Section 7
• If a slide-in drive is in place, it also must be removed before moving on to the next step.
• There are two arrows on the fans that indicate the direction of air flow and the direction
of fan rotation.
Air flow
Direction of rotation
Warning!
The fans must be inserted so that the air flows toward the inside of the housing.
• Align fans over the fastening bolts (see arrows). Feed cables through the openings in the
housing (see circles) into the main board of the APC620.
• The fan connection cable must be connected to the main circuit board at the right position
(fan 1 at position 1, fan 2 at position 2).
1 2
1
2
Figure 400: APC620 2PCI slots - Fan cable connection to the main board
• If one or more PCI cards were previously in place, they can now be re-inserted.
• If a slide-in drive was previously in place, it too can now be re-inserted.
• Place the dust filter in the fan kit cover and secure with the filter clasp.
Figure 401: Dust filter in the fan kit cover and filter clasp
• Replace any removed components (filter kit cover, side cover) in the reverse order.
Maintenance / Servicing
3.3 Procedure for APC620 with 3 PCI slot
Section 7
• Disconnect the power supply to the Automation PC 620.
• Touch the housing or ground connection (not the power supply!) in order to discharge any
electrostatic charge from your body.
• Open the orange front cover. Behind the cover there are 4 Torx screws (T10) that must
be removed.
Figure 402: APC620 3PCI slot - Remove screws to install/ remove filter kit
• After the screws have been removed, the side cover and the fan kit cover can be removed
toward the front.
Side
cove
r
Figure 403: APC620 3PCI slots - Remove side cover and fan kit cover
• There are two arrows on the fans that indicate the direction of air flow and the direction
of fan rotation.
Air flow
Direction of rotation
Warning!
The fans must be inserted so that the air flows toward the inside of the housing.
Maintenance / Servicing
• Align fans over the fastening bolts (see arrows). Feed cables through the openings in the
housing (see circles) into the main board of the APC620.
Section 7
Figure 405: APC620 3PCI slot - Fan installation
• The fan connection cable must be connected to the main circuit board at the right position
(fan 1 at position 1, fan 2 at position 2).
1 2
Figure 406: APC620 3PCI slot - Fan cable connection to the main board
• Place the dust filter in the fan kit cover and secure with the filter clasp.
Figure 407: Dust filter in the fan kit cover and filter clasp
• Replace any removed components (filter kit cover, side cover) in the reverse order.
Maintenance / Servicing
3.4 Procedure for APC620 with 5 PCI slot
Section 7
• Disconnect the power supply to the Automation PC 620.
• Touch the housing or ground connection (not the power supply!) in order to discharge any
electrostatic charge from your body.
• Open the orange front cover. Behind the cover there are 4 Torx screws (T10) that must
be removed.
Figure 408: APC620 5PCI slot - Remove screws to install/ remove filter kit
• After the screws have been removed, the side cover and the fan kit cover can be removed
toward the front.
Side cover
Figure 409: APC620 5PCI slot - Remove side cover and fan kit cover
• If one or more PCI cards are in place, they must be removed before moving on to the next
step.
• If a slide-in drive is in place, it also must be removed before moving on to the next step.
• Attach the two included cable fasteners in the appropriate holes.
• There are two arrows on the fans that indicate the direction of air flow and the direction
of fan rotation.
Air flow
Direction of rotation
Warning!
The fans must be inserted so that the air flows toward the inside of the housing.
Maintenance / Servicing
• Align fans over the fastening bolts (see arrows). Feed cables through the openings in the
housing (see circles) into the main board of the APC620.
Section 7
The fan connector cable for the 40 mm fan should be placed in the cable fastener.
• The fan connection cable must be connected to the main circuit board at the right position
(fan 1 at position 1, fan 2 at position 2, fan 3 at position 3).
2 3
1 2 3
Figure 413: APC620 5PCI slot - Fan cable connection to the main board
• If one or more PCI cards were previously in place, they can now be re-inserted.
• If a slide-in drive was previously in place, it too can now be re-inserted.
Maintenance / Servicing
• Place the dust filter in the fan kit cover and secure with the filter clasp.
Section 7
Filter clasp Dust filter Fan kit cover
Figure 414: Dust filter in the fan kit cover and filter clasp
• Replace any removed components (filter kit cover, side cover) in the reverse order.
Slide-in drives can be installed and exchanged in system units with 2 or 5 PCI slots.
Maintenance / Servicing
4.2 Exchange procedure
Section 7
• Disconnect the power supply to the Automation PC 620.
• Touch the housing or ground connection (not the power supply!) in order to discharge any
electrostatic charge from your body.
• Remove the side cover, see section 6 "Mounting the side cover", on page 781.
• Simultaneously remove both slide-in slot releasing mechanisms outwards The slide-in
drive is pushed a few mm upwards for easy removal.
Maintenance / Servicing
5. Installing the UPS module
Section 7
The module is installed using the materials included in the delivery. Different parts are used
depending on the system unit and whether the add-on interface module is installed (description
starting on page 774) or not installed (description follows).
• Remove side cover (see section 6 "Mounting the side cover", on page 781).
• Remove UPS module cover by removing the 2 marked Torx screws (T10).
• Screw in spacing bolt and spacing ring (using M5 hex socket screwdriver).
14 mm spacing bolt
+ spacing ring
• Install UPS module with 2 Torx screws (T10) and 1 Torx screw (T10). Use the previously
removed Torx screws and one Torx screw from the mounting materials.
Maintenance / Servicing
Information:
Section 7
When connecting the cable, make sure that the connector locking mechanism is
engaged.
• Remove side cover (see section 6 "Mounting the side cover", on page 781).
• Remove UPS module cover by removing the 2 marked Torx screws (T10).
• Screw in spacing bolt and spacing ring (using M5 hex socket screwdriver).
14 mm spacing bolt
+ spacing ring
Maintenance / Servicing
• Install mounting bracket on UPS module using 2 Torx screws (T10).
Section 7
Mounting bracket
+ 2 Torx screws
• Install UPS module with 2 Torx screws (T10) and 1 Torx screw (T10). Use the previously
removed Torx screws and one Torx screw from the mounting materials.
Information:
When connecting the cable, make sure that the connector locking mechanism is
engaged.
Maintenance / Servicing
5.1.3 APC620, 5 PCI slot
Section 7
• Remove side cover (see section 6 "Mounting the side cover", on page 781).
• Remove UPS module cover by removing the 2 marked Torx screws (T10).
• Screw in spacing bolt and spacing ring (using M5 hex socket screwdriver).
16 mm spacing bolt
+ spacing ring
Mounting bracket
+ 2 Torx screws
• Install UPS module with 2 Torx screws (T10) and 1 Torx screw (T10). Use the previously
removed Torx screws and one Torx screw from the mounting materials.
Maintenance / Servicing
Information:
Section 7
When connecting the cable, make sure that the connector locking mechanism is
engaged.
• Remove side cover (see section 6 "Mounting the side cover", on page 781).
• Remove UPS module cover by removing the 2 marked Torx screws (T10).
14 mm spacing bolt
• Install UPS module with 2 Torx screws (T10) and 1 Torx screw (T10). Use the previously
removed Torx screws and one Torx screw from the mounting materials.
Maintenance / Servicing
• Plug in connection cable (see marked socket).
Section 7
Figure 443: Plug in connection cable
Information:
When connecting the cable, make sure that the connector locking mechanism is
engaged.
• Remove side cover (see section 6 "Mounting the side cover", on page 781).
• Remove UPS module cover by removing the 2 marked Torx screws (T10).
14 mm spacing bolt
Maintenance / Servicing
• Install mounting bracket on UPS module using 2 Torx screws (T10).
Section 7
Mounting bracket
+ 2 Torx screws
• Install UPS module with 2 Torx screws (T10) and 1 Torx screw (T10). Use the previously
removed Torx screws and one Torx screw from the mounting materials.
Information:
When connecting the cable, make sure that the connector locking mechanism is
engaged.
• Remove side cover (see section 6 "Mounting the side cover", on page 781).
• Remove UPS module cover by removing the 2 marked Torx screws (using T10
screwdriver).
Maintenance / Servicing
• Screw in spacing bolt (using M5 hex socket screwdriver).
Section 7
16 mm spacing bolt
Mounting bracket
+ 2 Torx screws
• Install UPS module with 2 Torx screws (T10) and 1 Torx screw (T10). Use the previously
removed Torx screws and one Torx screw from the mounting materials.
Information:
When connecting the cable, make sure that the connector locking mechanism is
engaged.
Maintenance / Servicing
6. Mounting the side cover
Section 7
The number of Torx (T10) screws varies depending on the system (1, 2, 3 or 5 PCl slots).
• After the screws have been removed, the side cover can be removed by sliding it toward
the front.
• After the screws have been removed, the side cover can be removed by sliding it toward
the front.
Maintenance / Servicing
6.3 APC620 with 3 PCI slot
Section 7
• Disconnect the power supply to the Automation PC 620.
• Touch the housing or ground connection (not the power supply!) in order to discharge any
electrostatic charge from your body.
• Open the orange front cover. Behind the cover there are 7 Torx screws (T10) that must
be removed.
• After the screws have been removed, the side cover can be removed by sliding it toward
the front.
• After the screws have been removed, the side cover can be removed by sliding it toward
the front.
Maintenance / Servicing
7. Exchanging a PCI SATA RAID hard disk
Section 7
In the example, the assumption is made that the secondary hard disk (HDD1) is defective. In
such a case, the defective hard disk can be replaced by the replacement drive SATA hard disk.
Exchange procedure
• Remove the power supply to the device (Automation PC 620 / Panel PC 700).
• Touch the housing or ground connection (not the power supply!) in order to discharge any
electrostatic charge from your body.
• Remove the side cover.
• Remove the SATA RAID insert.
• Loosen the 4 appropriate mounting screws (M3x5) - see Figure 463 "Screw assignment
on the back side of the SATA RAID controller", on page 785.
Figure 463: Screw assignment on the back side of the SATA RAID controller
• On the front side, slide the hard disk down and away (image 1).
• Carefully plug the new hard disk into the connector (image 2).
Information:
When doing this, make sure that the hard disk is only touched on the front side, and
not on the top side.
1 2
• Re-secure the hard disk using the 4 fastening screws (M3x5) used earlier.
• Reassemble device in the reverse order.
• An error message is output by the RAID BIOS after starting the system "RAID1 set is
in Critical status - press any key to enter Configuration Utility".
A rebuild must be executed in the SATA RAID BIOS - for more information on this, see the
section "Rebuild mirrored set", on page 356.
Maintenance / Servicing
8. Replacing the front cover
Section 7
Depending on how the front cover is attached, the following points must be taken into
consideration when replacing.
• On the side of the APC620 there are Torx screws (T12) that must be removed (3, 4 or 6
screws, depending on the APC620 design).
Pull the cover in the direction of the arrows, thereby pulling the hinge bar under the heat
sink.
• Slide the new hinge bar under the heat sink and screw it back on using the screws
removed earlier.
Maintenance / Servicing
8.2 Variation B - Front cover attached without screws
Section 7
• A label on the side of the hinge bar "PULL TO REMOVE" indicates that the front cover is
attached without screws.
PULL TO REMOVE
• Open the front cover approximately 1-2 cm. Now remove the cover by pulling it in the
direction of the red arrow.
• Attach the new cover to the hinge bar from the side.
Appendix A
Appendix A
The APC620 has temperature sensors in various places (CPU, power supply, slide-in drive 1,
slide-in drive 2, I/O). The temperatures1) can be read in BIOS (menu item "advanced" -
baseboard/panel features - baseboard monitor) or in Microsoft Windows XP/Embedded, using
B&R Control Center2) .
1 3
1 ... CPU
2 ... Power Supply
3 ... Slide-In device 1/2
4 ... I/O
1) The measured temperature is a guideline for the immediate ambient temperature, but can be influenced by neighboring components.
2) The B&R Control Center - ADI driver - can be downloaded for free from the download area on the B&R homepage (www.br-
automation.com).
A plug on the main board enables branching of +5 VDC and +12 VDC for the internal supply of
e.g. special PCI cards.
The connector is only provided starting with the following system unit revisions:
The voltage can be accessed using the "APC620 internal supply cable 5CAMSC.0001-00", on
page 692. Depending on the system unit revision, the connector is located close to the fan
connector. The APC620 side cover and possibly also the slide-in drive and PCI cards must be
removed to reach the connector.
Ex
ter
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ld
ev
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Fan connection
Fan connection
The MTCX controller (FPGA processor) is located on the main board (part of every system unit)
of the APC620 device.
Appendix A
MTCX
The MTCX is responsible for the following monitoring and control functions:
1) Can be downloaded from the download area on the B&R homepage (www.br-automation.com).
SDL SDL
SDL SDL
Graphics Engine 1
Graphics Engine 2
Basic procedure:
1) On every Automation Panel 900 display unit, the data (button and LED, touch screen,
service data) is nominally determined asynchronously every 16 ms, saved and made
available.
2) The MTCX in the APC620 samples one display unit after another asynchronously in 1 ms
increments. The status is requested within the 15 ms nominal cycle (maximum 15 display
units x 1 ms), regardless of the total number of display units connected in the system
(Graphics Engine 1 + Graphics Engine 2), and the information is saved in the MTCX's Dual-
Ported RAM.
3) An application can access the MTXC data using the programming interface (API) ADI
(Automation Device Interface). Reading or writing data does not affect the asynchronous
acquisition of data from the connected display units.
Further information about this can be found in the "ADI Development Kit" and the
"Automation PC 620 / Panel PC 700 Implementation Guide" (both available on the B&R
Homepage).
Caution!
Due to safety requirements regulated by international standards, implementing an
E-stop element via SDL (using Matrix) is NOT allowed. Instead, such an element
must be wired according to the safety requirements.
Information:
Display data will not be updated and cannot be read by the MTCX while a display unit
Appendix A
is in upgrade mode (e.g. SDL firmware upgrade).
The nominal time specifications are not guaranteed maximum lengths of time, but
may be increased due to e.g. transfer disturbances and external influences.
Schematic diagram
16 ms
data
ieve
Retr
Scanned
MTCX
display on
0 1 2 3 4 5 6 7 0 1 2
Graphics Engine 2
8 9 10 11 12 13 14 8 9 10
Graphics Engine 1
A different 1 ms 1 ms 1 ms
display every ms
Figure 474: SDL timing - Example for Automation Panel 900 with the number 0
The MTCX constantly monitors the temperature using temperature sensors (see section 1
"Temperature sensor locations", on page 791), which directly determine how the fan is
controlled. The RPM depends on the temperature measured. The limit values depend on the
MTCX firmware version being used.
The fans stop again when the temperature drops below 37°C.
On display units, it is often necessary to adjust the function keys and LEDs for the application
software being used. The B&R Key Editor makes it quick and easy to adapt the application to a
unique configuration.
Appendix A
Figure 475: B&R Key Editor screenshots Version 3.10 (representation picture)
Features:
• Automation PC 620
• Automation PC 810
• Automation PC 820
• Automation Panel 800
• Automation Panel 900
• IPC2000, IPC2001, IPC2002
• IPC5000, IPC5600
• IPC5000C, IPC5600C
• Mobile Panel 40/50
• Mobile Panel 100/200
• Panel PC 300
• Panel PC 700
• Panel PC 800
• Power Panel 100/200
• Power Panel 300/400
• Power Panel 500 (the Key Editor device file must be downloaded separately from the
B&R homepage)
A detailed guide for configuring keys and LEDs can be found in the B&R Key Editor's online help.
The B&R Key Editor can be downloaded for free from the download area on the B&R homepage
(www.br-automation.com ). Additionally, it can also be found on the B&R HMI Drivers & Utilities
DVD (model number 5SWHMI.0000-00).
This software can be used to activate functions of the B&R Automation Device Interface (ADI)
from Windows applications, which, for example, were created using the following development
tools:
Appendix A
• Microsoft Visual Studio 2005 (or newer)
Features:
• One Microsoft Visual Basic module with declarations for the ADI functions.
• Header files and import libraries for Microsoft Visual C++.
• Help files for Visual Basic and Visual C++.
• Sample projects for Visual Basic and Visual C++.
• ADI DLL (for testing the applications, if no ADI driver is installed).
• Automation PC 620
• Automation PC 810
• Automation PC 820
• Mobile Panel 40/50
• Mobile Panel 100/200
• Panel PC 300
• Panel PC 700
• Panel PC 800
• Power Panel 100/200
• Power Panel 300/400
• Power Panel 500
The ADI driver suitable for the device must be installed on the stated product series. The ADI
driver is already included in the B&R images of embedded operating systems.
A detailed description of using the ADI functions can be found in the integrated online help.
The B&R Automation Device Interface (ADI) development kit can be downloaded for free from
the download area on the B&R homepage (www.br-automation.com).
This software can be used to activate functions of the B&R Automation Device Interface (ADI)
from .NET applications, which were created using Microsoft Visual Studio 2005 (or newer).
• Visual Basic
• Visual C++
Appendix A
• Visual C#
• Visual J#
System requirements:
- Microsoft .NET Framework 2.0 and / or Microsoft .NET Compact Framework 2.0
or newer
Features:
• Automation PC 620
• Automation PC 810
• Automation PC 820
• Mobile Panel 40/50
• Mobile Panel 100/200
• Panel PC 300
• Panel PC 700
• Panel PC 800
• Power Panel 100/200
• Power Panel 300/400
• Power Panel 500
The ADI driver suitable for the device must be installed on the stated product series. The ADI
driver is already included in the B&R images of embedded operating systems.
A detailed description of using the ADI functions can be found in the integrated online help.
The ADI .NET SDK can be downloaded for free from the download area on the B&R homepage
(www.br-automation.com).
7. Glossary
ACPI
Abbreviation for "Advanced Configuration and Power Interface". Configuration interface that
enables the operating system to control the power supply for each device connected to the PC.
With ACPI, the computer's BIOS is only responsible for the details of communication with the
hardware.
Appendix A
APC
An abbreviation for "Automation PC".
API
Abbreviation for "Application Program Interface" The interface, which allows applications to
communicate with other applications or with the operating system.
Automation Runtime
Baud rate
Measurement unit for data transfer speed. It indicates the number of states for a transferred
signal per second and is measured using the baud unit of measurement. 1 baud = 1 bit/sec or 1
bps.
BIOS
An abbreviation for "Basic Input/Output System". Core software for computer systems with
essential routines for controlling input and output processes on hardware components, for
performing tests after system start and for loading the operating system. Although BIOS is used
to configure a system's performance, the user does not usually come into contact with it.
Bit
Binary digit > binary position, binary character, smallest discrete unit of information. A bit can
have the value 0 or 1.
Bit rate
The number of bits that can be transferred within a specified time unit. 1 bit/sec = 1 baud.
Bootstrap loader
A program that automatically runs when the computer is switched on or restarted. After some
basic hardware tests have been carried out, the bootstrap loader starts a larger loader and hands
over control to it, which in turn boots the operating system. The bootstrap loader is typically found
in ROM on the computer.
Byte
Data format [1 byte = 8 bits] and a unit for characterizing information amounts and memory
capacity. The following units are the commonly used units of progression: KB, MB, GB.
Windows-based program for creating installation disks to install B&R Automation Runtime™ on
the target system.
Cache
Background memory, also known as non-addressable memory or fast buffer memory. It is used
to relieve the fast main memory of a computer. For example, data that should be output to slower
components by the working memory (e.g. disk storage, printers) is stored temporarily in cache
memory and output from there at an appropriate speed for the target devices.
CAN
An abbreviation for "Controller Area Network" (serial bus system). Structure according to ISO
11898; Bus medium: twisted pair. Good transfer properties in short distances less than 40 m with
a 1 MBit/sec data transfer rate. Maximum number of stations: Theoretically unlimited, but
practically limited up to 64. Real-time capable (i.e. defined maximum latency times for messages
with high priority). High reliability using error detection, error handling, troubleshooting. Hamming
distance.
CD-ROM
Abbreviation for "Compact Disc Read-Only Memory". A removable data medium with a capacity
of ~700 MB. CD-ROMs are optically scanned.
CE mark
A CE mark for a product. It consists of the letters "CE" and indicates conformity to all EU
guidelines for the labeled product. It indicates that the individual or corporate body who has
performed or attached the label assures that the product conforms to all EU guidelines for
complete harmonization. It also indicates that all mandatory conformity evaluation procedures
have taken place.
CMOS
"CMOS" is a battery powered memory area where fundamental parameters of an IBM (or
compatible) personal computer are stored. Information such as the type of hard drive, size of the
working memory and the current date and time are required when booting the computer. As the
name suggests, the memory is based on CMOS technology standards.
COM
A device name used to access serial ports in MS-DOS. The first serial port can be accessed
under COM1, the second under COM2, etc. A modem, mouse, or serial printer is typically
Appendix A
connected to a serial port.
COM1
Device name for the first serial port in a PC system. The input/output area for COM1 is usually
found at address 03F8H. Generally, the COM1 port is assigned to IRQ 4. In many systems, an
RS232 serial mouse is connected to COM1.
COM2
Device name for the second serial port in a PC system. The input/output area for COM2 is
usually found at address 02F8H. Generally, the COM2 port is assigned to IRQ 3. In many
systems, a modem is connected to COM2.
COM3
Device name for a serial port in a PC system. The input/output area for COM3 is usually found
at address 03E8H. Generally, the COM3 port is assigned to IRQ 4. In many systems, COM3 is
used as an alternative for COM1 or COM2 if peripheral devices are already connected to COM1
and COM2.
CompactFlash®
CompactFlash memory cards [CF cards] are exchangeable nonvolatile mass memory systems
with very small dimensions [43 x 36 x 3.3 mm, approximately half the size of a credit card]. In
addition to the flash memory chips, the controller is also present on the cards. CF cards provide
complete PC card / ATA functionality and compatibility. A 50-pin CF card can be simply inserted
in a passive 68-pin type II adapter card. It conforms to all electrical and mechanical PC card
interface specifications. CF cards were launched by SanDisk back in 1994. Currently, memory
capacities reach up to 8 GB per unit. Since 1995, CompactFlash Association [CFA] has been
looking after standardization and the worldwide distribution of CF technology
CPU
An abbreviation for "Central Processing Unit". Interprets and executes commands. It is also
known as a "microprocessor" or "processor" for short. A processor is able to receive, decode and
execute commands, as well as transfer information to and from other resources via the computer
bus.
CTS
An abbreviation for "Clear To Send". A signal used when transferring serial data from modem to
computer, indicating its readiness to send the data. CTS is a hardware signal which is transferred
via line number 5 in compliance with the RS-232-C standard.
DCD
An abbreviation for "Data Carrier Detected". A signal used in serial communication that is sent
by the modem to the computer it is connected to, indicating that it is ready for transfer.
Dial-up
Data is transferred over the telephone network using a modem or an ISDN adapter.
DIMM
"Double In-line Memory Module" consisting of one or more RAM chips on a small circuit board
that is connected with the motherboard of a computer.
DMA
Direct Memory Access > Accelerated direct access to a computer’s RAM by bypassing the CPU.
DRAM
DSR
An abbreviation for "Data Set Ready". A signal used in serial data transfer, which is sent by the
modem to the computer it is connected to, indicating its readiness for processing. DSR is a
hardware signal which is sent via line number 6 in compliance with the RS-232-C standard.
DTR
An abbreviation for "Data Terminal Ready". A signal used in serial data transfer that is sent by
the computer to the modem it is connected to, indicating the computer's readiness to accept
incoming signals.
DVD
An abbreviation for "Digital Versatile Disc". The next generation of optical data carrier technology
is able to store a higher volume of data than conventional CDs. Standard DVDs, which have a
single layer, can hold 4.7 GB. Dual-layer DVDs can hold 8.5 GB. Double-sided DVDs can
therefore hold up to 17 GB. A special drive is needed for DVDs. Conventional CDs can also be
played on DVD drives.
DVI
Abbreviation for "Digital Visual Interface" An interface for the digital transfer of video data.
Appendix A
DVI-A
Analog only
DVI-D
Digital only
DVI-I
EDID data
Abbreviation for "Extended Display Identification Data". EDID data contains the characteristics
of monitors / TFT displays transferred as 128 KB data blocks to the graphics card via the Display
Data Channel (DDC). This EDID data can be used to set the graphics card to the monitor
properties.
EIDE
An abbreviation for "Enhanced Integrated Drive Electronics". An expansion of the IDE standard.
Enhanced IDE is considered the standard for hardware interfaces. This interface is designed for
drives with an integrated drive controller.
EMC
EPROM
Ethernet
An IEEE 802.3 standard for networks. Ethernet uses bus or star topology and controls the traffic
on communication lines using the access procedure CSMA/CD (Carrier Sense Multiple Access
with Collision Detection). Network nodes are connected using coaxial cables, fiber optic cables
or twisted pair cabling. Data transfer on an Ethernet network takes place in frames of variable
lengths that consist of supply and controller information as well as 1500 bytes of data. The
Ethernet standard provides base band transfers at 10 megabit and 100 megabit per second.
ETX
Abbreviation for "Embedded Technology eXtended" This established standard offers complete
PC functionality on a very compact form factor of just 114 mm x 100 mm (´4.5" x 4"). The
flexibility offered by ETX® in the development of system specific main boards allows easy
requirement fulfillment in a number of different applications.
FDD
Abbreviation for "Floppy Disk Drive". Reading device for removable magnetic memory from the
early days of PC technology. Due to their sensitivity and moving components, FDDs have been
almost completely replaced by CompactFlash memory in modern automation solutions.
Fiber optics
FIFO
An abbreviation for "First In First Out". A queuing organization method whereby elements are
removed in the same order as they were inserted. The first element inserted is the first one
removed. Such an organization method is typical for a list of documents that are waiting to be
printed.
Firmware
Floppy
Also known as a diskette. A round plastic disk with an iron oxide coating that can store a
magnetic field. When the floppy disk is inserted in a disk drive, it rotates so that the different
areas (or sectors) of the disk's surface are moved under the read/write head. This allows the
magnetic orientation of the particle to be modified and recorded. Orientation in one direction
represents binary 1, while the reverse orientation represents binary 0.
FPC
FPD
FTP
"File Transfer Protocol" Rules for transferring data over a network from one computer to another
computer. This protocol is based on TCP/IP, which has established itself as the standard for
Appendix A
transferring data over Ethernet networks. FTP is one of the most used protocols on the Internet.
It is defined in RFC 959 in the official regulations for Internet communication.
GB
Handshake
Method of synchronization for data transfer when data is sent at irregular intervals. The sender
signals that data can be sent, and the receiver signals when new data can be received.
HDD
An abbreviation for "Hard Disk Drive". Fixed magnetic mass memory with high capacities, e.g.
120 GB.
IDE
An abbreviation for "Integrated Drive Electronics". A drive interface where the controller
electronics are integrated in the drive.
ISA
An abbreviation for "Industry Standard Architecture". A term given for the bus design which
allows expansion of the system with plug-in cards that can be inserted in PC expansion slots.
ISO
Jitter
Jitter is a term that describes time deviations of cyclic events. If, for example, an event should
take place every 200ìs and it actually occurs every 198 to 203ìs, then the jitter is 5ìs. Jitter has
many causes. It originates in the components and transfer media of networks because of noise,
crosstalk, electromagnetic interference and many other random occurrences. In automation
technology, jitter is a measure of the quality of synchronization and timing.
Jumper
A small plug or wire link for adapting the hardware configuration used to connect the different
points of an electronic circuit.
LCD
An abbreviation for "Liquid Crystal Display". A display type, based on liquid crystals that have a
polarized molecular structure and are enclosed between two transparent electrodes as a thin
layer. If an electrical field is applied to the electrodes, the molecules align themselves with the
field and form crystalline arrangements that polarize the light passing through. A polarization
filter, which is arranged using lamellar electrodes, blocks the polarized light. In this way, a cell
(pixel) containing liquid crystals can be switched on using electrode gates, thus coloring this pixel
black. Some LCD displays have an electroluminescent plate behind the LCD screen for lighting.
Other types of LCD displays can use color.
LED
An abbreviation for "Light Emitting Diode". A semiconductor diode which converts electrical
energy into light. LEDs work on the principle of electroluminescence. They are highly efficient
because they do not produce much heat in spite of the amount of light they emit. For example,
"operational status indicators" on floppy disk drives are LEDs.
LPT
Logical device name for line printers. In MS-DOS, names are reserved for up to three parallel
printer ports with the names LPT1, LPT2 and LPT3. The first parallel port (LPT1) is usually
identical to the primary parallel output device PRN (in MS-DOS the logical device name for the
printer). The abbreviation LPT stands for "Line Printer Terminal".
MB
Microprocessor
Highly integrated circuit with the functionality of a CPU, normally housed on a single chip. It
comprises a control unit, arithmetic and logic unit, several registers and a link system for
connecting memory and peripheral components. The main performance features are the internal
and external data bus and address bus widths, the command set and the clock frequency.
Additionally, a choice can be made between CISC and RISC processors. The first commercially
available worldwide microprocessor was the Intel 4004. It came on the market in 1971.
MIPS
Appendix A
Million instructions per second > Measurement for the computing speed of computers.
Motherboard
A circuit board that houses the main components of a computer such as the CPU switching
circuit, co-processors, RAM, ROM for firmware, interface circuits, and expansion slots for
hardware expansions.
MTBF
An abbreviation for "Mean time between failure". The average time which passes before a
hardware component fails and repair is needed. This time is usually expressed in thousands or
ten thousands of hours, sometimes known as power-on hours (POH).
MTCX
Multitasking
Multitasking is an operating mode in an operating system that allows several computer tasks to
be executed virtually simultaneously.
OEM
OPC
OLE for Process Control > A communication standard for components in the area of automation.
The goal of OPC development is to provide an open interface that builds on Windows-based
technologies such as OLE, COM and DCOM. It allows problem-free standardized data transfer
between controllers, operating and monitoring systems, field devices and office applications
from different manufacturers. This development is promoted by the OPC Foundation, which is
made up of over 200 companies from around the world, including Microsoft and other leading
companies. Nowadays, OPC is also interpreted as a synonym for Openness, Productivity and
Connectivity, symbolizing the new possibilities that this standard opens up.
OPC server
The missing link between connection modules for the Interbus and the visualization application.
It communicates serially with the connection modules via the ISA or PCI bus or Ethernet.
Panel
PCI Bus
PCMCIA
PLC
PnP
An abbreviation for "Plug and Play". Specifications developed by Intel. Using Plug and Play
allows a PC to automatically configure itself so that it can communicate with peripheral devices
(e.g. monitors, modems, and printers). Users can connect a peripheral device (plug) and it
immediately runs (play) without having to manually configure the system. A Plug and Play PC
requires a BIOS that supports Plug and Play and a respective expansion card.
POH
POST
An abbreviation for "Power-On Self Test". A set of routines that are stored in ROM on the
computer and that test different system components, e.g. RAM, disk drive and the keyboard in
order to determine that the connection is operating correctly and ready for operation. POST
routines notify the user of problems that occur. This is done using several signal tones or by
displaying a message that frequently accompanies a diagnosis value on the standard output or
standard error devices (generally the monitor). If the POST runs successfully, control is
transferred over to the system's bootstrap loader.
POWERLINK
Appendix A
An enhancement of standard Ethernet. It enables data exchange under strict real-time
conditions with cycle times down to 200 μs and jitter under 1 μs. This makes Ethernet power
available on all communication levels of automation technology – from control levels to I/O.
POWERLINK was initiated by the company B&R Industrie-Elektronik and is now managed by
the open end user and vendor association, EPSG - Ethernet POWERLINK Standardization
Group (www.ethernet-powerlink.org).
QVGA
Abbreviation for "Quarter Video Graphics Array". Usually a screen resolution of 320 × 240 pixels.
QUXGA
Abbreviation for "Quad Ultra Extended Graphics Array". Generally a screen resolution of 3200
× 2400 pixels (4:3). Quad implies the 4x greater pixel resolution compared to the UXGA.
QWUXGA
Abbreviation for "Quad WUXGA"; Generally a screen resolution of 3840 × 2400 pixels (8:5,
16:10).
RAM
An abbreviation for "Random Access Memory". Semiconductor memory which can be read or
written to by the microprocessor or other hardware components. Memory locations can be
accessed in any order. The various ROM memory types do allow random access, but they
cannot be written to. The term RAM refers to a more temporary memory that can be written to
as well as read.
Real time
A system is operating in real time or has real-time capability if the input sizes (e.g. signals, data)
are received and processed in a defined time period, and the results are made available in real
time for a partner system or the system environment. See also "real-time demands" and "real-
time system".
ROM
An abbreviation for "Read-Only Memory". Semiconductor memory where programs or data were
permanently stored during the production process.
RS232
Recommended Standard Number 232. Oldest and most widespread interface standard, also
called a V.24 interface. All signals are referenced to ground making this an unbalanced interface.
High level: -3 to -30 V, low level: +3 to +30 V; cable lengths up to 15 m, transfer rates up to 20
kbit/s; for point-to-point connections between 2 stations.
RS422
RS485
Recommended Standard Number 485. Interface standard upgraded from RS422. High level: 1.5
to -6 V, low level: +1.5 to +6 V; two-line connection [half-duplex mode] or four-line connection
[full-duplex mode]; permissible cable length up to 1200 m, transfer rates up to 10 Mbit/s. Up to
32 stations (sender/receiver) can be connected to an RS485 bus.
RTS
An abbreviation for "Request To Send". A signal used in serial data transfer for requesting send
permission. For example, it is sent from a computer to the modem connected to it. The RTS
signal is assigned to pin 4 according to the hardware specifications of the RS-232-C standard.
RXD
An abbreviation for "Receive (RX) Data". A line for transferring serial data received from one
device to another, e.g. from a modem to a computer. For connections complying with the RS-
232-C standard, the RXD is connected to pin 3 of the plug.
SDRAM
SFC
Sequential function chart > Graphic input language for PLCs used to represent sequential
control.
Slot PLC
PC insert card that has full PLC functionality. On the PC, it is coupled via a DPR with the process
using a fieldbus connection. It is programmed externally or using the host PC.
SoftPLC
SRAM
An abbreviation for "Static Random Access Memory". A semiconductor memory (RAM) made up
Appendix A
of certain logic circuits (flip-flop) that only keeps stored information while powered. In computers,
static RAM is generally only used for cache memory.
SUXGA
Abbreviation for Super Ultra Extended Graphics Array; Generally a screen resolution of
2048×1536 pixels (4:3). An alternative name is QXGA (Quad Extended Graphics Array), which
is 4x the pixel resolution of XGA.
SVGA
Abbreviation for "Super Video Graphics Array"; Graphics standard with a resolution of at least
800×600 pixels and at least 256 colors.
Switch
Device similar to a hub that takes data packets received in a network and, unlike a hub, passes
them only to the respective addressee, not to all network nodes. Unlike a hub, a switch provides
targeted communication within a network that only takes place between sender and receiver.
Other network nodes are not involved.
SXGA
Abbreviation for Super Extended Graphics Array. Graphics standard with a screen resolution of
1280 × 1024 pixels (aspect ratio 5:4).
SXGA+
System units
Provit system units consist of a mainboard (without processor), slots for RAM modules, VGA
controller, serial and parallel interfaces, and connections for the FPD, monitor, PS/2 AT
keyboard, PS/2 mouse, USB, Ethernet (for system units with Intel Celeron and Pentium III
processors), Panelware keypad modules and external FDD.
Task
Program unit that is assigned a specific priority by the real-time operating system. It contains a
complete process and can consist of several modules.
TCP/IP
Transmission Control Protocol/Internet Suit of Protocols. Network protocol that has become the
generally accepted standard for data exchange in heterogeneous networks. TCP/IP is used both
in local networks for communication between various computer and also for LAN to WAN
access.
TFT display
LCD (Liquid Crystal Display) technology where the display consists of a large grid of LCD cells.
Each pixel is represented by a cell, whereby electrical fields produced in the cells are supported
by thin film transistors (TFT) that result in an active matrix. In its simplest form, there is exactly
one thin film transistor per cell. Displays with an active matrix are generally used in laptops and
notebooks because they are thin, offer high-quality color displays and can be viewed from all
angles.
Touch screen
Screen with touch sensors for selecting options in a displayed menu using the tip of the finger.
TXD
An abbreviation for "Transmit (TX) Data". A line for the transfer of serial data sent from one
device to another, e.g. from a computer to a modem. For connections complying with the RS-
232-C standard, the TXD is connected to pin 2 of the plug.
UART
UDMA
An abbreviation for "Ultra Direct Memory Access". A special IDE data transfer mode that allows
high data transfer rates for drives. There have been many variations in recent times.
UDMA33 mode transfers 33 megabytes per second.
UDMA66 mode transfers 66 megabytes per second.
UDMA100 mode transfers 100 megabytes per second.
Both the mainboard and the hard drive must support the specification to implement
modifications.
UPS
USB
An abbreviation for "Universal Serial Bus" A serial bus with a bandwidth of up to 12 megabits per
second (Mbit/s) for connecting a peripheral device to a microcomputer. Up to 127 devices can
be connected to the system using a single multipurpose connection, the USB bus (e.g. external
CD drives, printers, modems as well as the mouse and keyboard). This is done by connecting
the devices in a row. USB allows devices to be changed when the power supply is switched on
Appendix A
(hot plugging) and multi-layered data flow.
UPS
An abbreviation for "Uninterruptible Power Supply". The UPS supplies power to systems that
cannot be connected directly to the power mains for safety reasons because a power failure
could lead to loss of data. The UPS allows the PC to be shut down securely without losing data
if a power failure occurs.
UXGA
Abbreviation for "Ultra Extended Graphics Array" Generally a screen resolution of 1600 × 1200
pixels (aspect ratio 4:3, 12:9).
VGA
An abbreviation for "Video Graphics Adapter". A video adapter which can handle all EGA
(Enhanced Graphics Adapter) video modes and adds several new modes.
Windows CE
Compact 32-bit operating system with multitasking and multithreading that Microsoft developed
especially for the OEM market. It can be ported for various processor types and has a high
degree of real-time capability. The development environment uses proven, well-established
development tools. It is an open and scalable Windows operating system platform for many
different devices. Examples of such devices are handheld PCs, digital wireless receivers,
intelligent mobile phones, multimedia consoles, etc. In embedded systems, Windows CE is also
an excellent choice for automation technology.
WSXGA
WUXGA
WXGA
XGA
An abbreviation for "EXtended Graphics Array". An expanded standard for graphics controllers
and monitors that was introduced by IBM in 1990. This standard supports 640x480 resolution
with 65,536 colors or 1024x768 resolution with 256 colors. This standard is generally used in
workstation systems.
XTX
Abbreviation for "eXpress Technologoy for ETX" A further development consistent with the
proven ETX® standard. The newest I/O technology is implemented on a reliable form factor in
XTX. The ETX® interface X2 is equipped with new serial buses like PCI Express™ und Serial
ATA®, instead of the unpopular ISA bus. All other signals on the X1, X3 and X4 interfaces remain
completely compatible with the ETX® Standard (Rev. 2.7). However, if ISA signals are needed,
a PCI-ISA can be implemented on the base board. The use of an LPC bus already in XTX™ is
considerably cheaper than a bridge solution.
Figure index
Figure index
Figure 18: Dimensions - APC620, 5 PCI slot variant....................................................... 82
Figure 19: APC620 embedded variant interface overview - top side .............................. 83
Figure 20: APC620 embedded variant interface overview - front side ............................ 84
Figure 21: APC620 embedded variant - dimensions....................................................... 88
Figure 22: Example of worst-case conditions for temperature measurement ................. 89
Figure 23: Ambient temperatures for systems with an 815E CPU board (ETX).............. 90
Figure 24: Example of worst-case conditions for temperature measurement ................. 93
Figure 25: Ambient temperatures for systems with an 855GME CPU board (ETX / XTX)...
94
Figure 26: Ambient temperatures for embedded systems with an 855GME CPU board
(ETX / XTX) 95
Figure 27: Supply voltage for the 5PC600.SX01-00 revision >= I0 ................................. 97
Figure 28: Supply voltage for the 5PC600.SX01-00 revision < I0 ................................... 99
Figure 29: Supply voltage for the 2 PCI slots (dependent on system unit version) ....... 101
Figure 30: Supply voltage for the 2 PCI slots (dependent on system unit version) ....... 104
Figure 31: Supply voltage block diagram 3 PCI slots .................................................... 107
Figure 32: Supply voltage for the 5 PCI slots (dependent on system unit version) ....... 109
Figure 33: Supply voltage block diagram 5 PCI slots (dependent on system unit version)..
113
Figure 34: Supply voltage for the 5PC600.SE00-00, 5PC600.SE00-01 and 5PC600.SE00-
02 117
Figure 35: General device interfaces example - APC620 with 5 PCI slots.................... 121
Figure 36: General device interfaces example - APC620 embedded ........................... 122
Figure 37: Supply voltage connection ........................................................................... 135
Figure 38: Ground connection ....................................................................................... 136
Figure 39: Monitor / Panel connection........................................................................... 138
Figure 40: Monitor / Panel connection with RGB video signal....................................... 142
Figure 41: Monitor / Panel connection with DVI video signal ........................................ 142
Figure 42: Monitor / Panel connection with SDL video signal ....................................... 143
Figure 77: Temperature humidity diagram - Add-on hard disk 5AC600.HDDI-02 ......... 203
Figure 78: Add-on hard disk 60 GB - 5AC600.HDDI-03................................................ 204
Figure 79: Temperature humidity diagram - Add-on hard disk 5AC600.HDDI-03 ......... 206
Figure 80: Add-on hard disk 80 GB - 5AC600.HDDI-04................................................ 207
Figure 81: Temperature humidity diagram - Add-on hard disk 5AC600.HDDI-04 ......... 209
Figure 82: Add-on hard disk 40 GB - 5AC600.HDDI-05................................................ 210
Figure 83: Temperature humidity diagram - Add-on hard disk 5AC600.HDDI-05 ......... 212
Figure 84: Add-on hard disk 80 GB - 5AC600.HDDI-06................................................ 213
Figure 85: Temperature humidity diagram - Add-on hard disk 5AC600.HDDI-06 ......... 215
Figure 86: Add-on CompactFlash slot - 5AC600.CFSI-00 ............................................ 216
Figure 87: Slide-in CD-ROM - 5AC600.CDXS-00 ......................................................... 217
Figure 88: Temperature humidity diagram - Slide-in CD-ROM 5AC600.CDXS-00 ....... 219
Figure 89: Slide-in DVD-ROM/CD-RW - 5AC600.DVDS-00 ......................................... 220
Figure 90: Temperature humidity diagram - Slide-in DVD-ROM/CD-RW 5AC600.DVDS-00
222
Figure 91: Slide-in DVD-R/RW, DVD+R/RW - 5AC600.DVRS-00 ................................ 223
Figure 92: Temperature humidity diagram - Slide-in DVD-R/RW, DVD+R/RW
5AC600.DVRS-00 227
Figure index
Figure 93: Slide-in CF 2-slot - 5AC600.CFSS-00.......................................................... 228
Figure 94: Slide-in USB FDD - 5AC600.FDDS-00 ........................................................ 230
Figure 95: Temperature humidity diagram - Slide-in USB diskette drive 5AC600.FDDS-00
232
Figure 96: Slide-in hard disk 30 GB - 5AC600.HDDS-00 .............................................. 233
Figure 97: Temperature humidity diagram - Slide-in hard disk 5AC600.HDDS-00 ....... 235
Figure 98: Slide-in hard disk 20 GB - 5AC600.HDDS-01 .............................................. 236
Figure 99: Temperature humidity diagram - Slide-in hard disk 5AC600.HDDS-01 ....... 238
Figure 100: Slide-in hard disk 40 GB - 5AC600.HDDS-02 .............................................. 239
Figure 101: Temperature humidity diagram - Slide-in hard disk 5AC600.HDDS-02 ....... 241
Figure 102: RAID 1 system schematic ............................................................................ 242
Figure 103: RAID controller - 5ACPCI.RAIC-00 .............................................................. 243
Figure 104: PCI RAID storage - 5ACPCI.RAIS-00 .......................................................... 245
Figure 105: Temperature humidity diagram - RAID hard disk 5ACPCI.RAIS-00 ............ 247
Figure 106: PCI RAID storage - 5ACPCI.RAIS-01 .......................................................... 248
Figure 107: Temperature humidity diagram - RAID hard disk 5ACPCI.RAIS-01 ............ 250
Figure 108: PCI SATA RAID controller - 5ACPCI.RAIC-01............................................. 251
Figure 109: Temperature humidity diagram - SATA RAID hard disk 5ACPCI.RAIC-01.. 253
Figure 110: PCI slot numbering on APC620 systems with 5 PCI slots ........................... 255
Figure 111: Replacement SATA HDD 60 GB - 5ACPCI.RAIC-02................................... 256
Figure 112: Temperature humidity diagram - SATA RAID hard disk 5ACPCI.RAIC-02.. 258
Figure 113: PCI SATA RAID controller - 5ACPCI.RAIC-03............................................. 259
Figure 114: Temperature humidity diagram - SATA RAID hard disk 5ACPCI.RAIC-03.. 261
Figure 115: PCI slot numbering on APC620 systems with 5 PCI slots ........................... 263
Figure 116: Replacement SATA HDD 160 GB - 5ACPCI.RAIC-04................................. 264
Figure 117: Temperature humidity diagram - SATA RAID hard disk 5ACPCI.RAIC-04.. 266
Figure 118: PCI SATA RAID controller - 5ACPCI.RAIC-05............................................. 267
Figure 119: Temperature humidity diagram - SATA RAID Hard Disk - 5ACPCI.RAIC-05 .....
269
Figure 161: RAID Configuration Utility - Create RAID set - Striped................................. 353
Figure 162: RAID Configuration Utility - Create RAID set - Mirrored............................... 354
Figure 163: RAID Configuration Utility - Delete RAID set................................................ 355
Figure 164: RAID Configuration Utility - Rebuild mirrored set ......................................... 356
Figure 165: RAID Configuration Utility - Resolve conflicts .............................................. 357
Figure 166: RAID Configuration Utility - Low level format ............................................... 358
Figure 167: Local connection of USB peripheral devices on the APC620 ...................... 359
Figure 168: Remote connection of USB peripheral devices to the APC900 via DVI....... 360
Figure 169: Remote connection of USB peripheral devices to the APC800/900 via SDL 361
Figure 170: B&R Control Center...................................................................................... 363
Figure 171: Settings for Passmark BurnIn Pro V4 with an APC810 2-slot with DVD ...... 364
Figure 172: Test overview of an APC810 2-slot with DVD .............................................. 365
Figure 173: 815E (ETX) BIOS diagnostic screen ............................................................ 372
Figure 174: 815E (ETX) BIOS Summary screen............................................................. 373
Figure 175: 815E (ETX) Main Menu................................................................................ 375
Figure 176: 815E (ETX) IDE Channel 0 Master .............................................................. 376
Figure 177: 815E (ETX) IDE Channel 0 .......................................................................... 378
Figure 178: 815E (ETX) IDE Channel 1 Master .............................................................. 380
Figure index
Figure 179: 815E (ETX) IDE Channel 1 Slave ................................................................ 382
Figure 180: 815E (ETX) Advanced Menu........................................................................ 384
Figure 181: 815E (ETX) Advanced Chipset/Graphics Control ........................................ 385
Figure 182: 815E (ETX) PCI/PNP Configuration............................................................. 387
Figure 183: 815E (ETX) PCI device, slot #1.................................................................... 389
Figure 184: 815E (ETX) PCI device, slot #2.................................................................... 390
Figure 185: 815E (ETX) PCI device, slot #3.................................................................... 391
Figure 186: 815E (ETX) PCI device, slot #4.................................................................... 392
Figure 187: 815E (ETX) Memory Cache ......................................................................... 393
Figure 188: 815E (ETX) I/O Device Configuration .......................................................... 395
Figure 189: 815E (ETX) Keyboard Features ................................................................... 398
Figure 190: 815E (ETX) CPU Board Monitor .................................................................. 399
Figure 191: 815E (ETX) Miscellaneous........................................................................... 400
Figure 192: 815E (ETX) Baseboard/Panel Features....................................................... 401
Figure 193: 815E (ETX) Panel Control............................................................................ 403
Figure 194: 815E (ETX) Baseboard Monitor ................................................................... 404
Figure 195: 815E (ETX) Legacy Devices ........................................................................ 405
Figure 196: 815E (ETX) Security Menu........................................................................... 407
Figure 197: 815E (ETX) Power Menu ............................................................................. 409
Figure 198: 815E (ETX) ACPI Control............................................................................. 411
Figure 199: 815E (ETX) Thermal Management .............................................................. 412
Figure 200: 815E (ETX) Boot Menu ................................................................................ 414
Figure 201: 815E (ETX) Exit Menu.................................................................................. 415
Figure 202: DIP switch on system unit ............................................................................ 416
Figure 203: 855GME (ETX) BIOS Diagnostics Screen ................................................... 426
Figure 204: 855GME (ETX) BIOS Summary Screen ...................................................... 426
Figure 205: 855GME (ETX) Main .................................................................................... 428
Figure 206: 855GME (ETX) IDE Channel 0 Master Setup .............................................. 430
Figure 207: 855GME (ETX) IDE channel 0 slave setup .................................................. 432
Figure 208: 855GME (ETX) IDE Channel 1 Master Setup .............................................. 434
Figure 209: 855GME (ETX) IDE channel 1 slave setup .................................................. 436
Figure 210: 855GME - advanced setup menu - overview ............................................... 438
Figure 211: 855GME (ETX) - advanced chipset control.................................................. 439
Figure 212: 815GME (ETX) - PCI/PNP configuration...................................................... 441
Figure 213: 855GME (ETX) - PCI device, slot #1............................................................ 444
Figure 214: 855GME (ETX) - PCI device, slot #2............................................................ 445
Figure 215: 855GME (ETX) - PCI device, slot #3............................................................ 446
Figure 216: 855GME (ETX) - PCI device, slot #4............................................................ 447
Figure 217: 855GME (ETX) - memory cache .................................................................. 448
Figure 218: 855GME (ETX) - I/O device configuration.................................................... 450
Figure 219: 855GME (ETX) Keyboard Features ............................................................. 453
Figure 220: 855GME (ETX) - CPU board monitor........................................................... 454
Figure 221: 855GME (ETX) miscellaneous ..................................................................... 455
Figure 222: 855GME (ETX) Baseboard/Panel Features ................................................. 456
Figure 223: 855GME (ETX) Panel Control ...................................................................... 458
Figure 224: 855GME (ETX) - baseboard monitor............................................................ 459
Figure 225: 855GME (ETX) Legacy Devices .................................................................. 461
Figure 226: 855GME (ETX) Security Menu..................................................................... 463
Figure 227: 855GME (ETX) Power menu........................................................................ 465
Figure 228: 855GME (ETX) ACPI Control....................................................................... 467
Figure 229: 855GME (ETX) Boot menu .......................................................................... 469
Figure 230: 855GME (ETX) - exit menu .......................................................................... 470
Figure 231: DIP switch on system unit ............................................................................ 472
Figure 232: 855GME (XTX) - BIOS diagnostics screen .................................................. 482
Figure 233: 855GME (XTX) BIOS Main menu ................................................................ 484
Figure 234: 855GME (XTX) Advanced menu.................................................................. 485
Figure 235: 855GME (XTX) Advanced ACPI Configuration ............................................ 486
Figure 236: 855GME (XTX) Advanced PCI Configuration .............................................. 488
Figure 237: 855GME (XTX) Advanced Graphics Configuration ...................................... 490
Figure 238: 855GME (XTX) Advanced CPU Configuration............................................. 492
Figure 239: 855GME (XTX) - advanced chipset configuration ........................................ 493
Figure 240: 855GME (XTX) I/O Interface Configuration.................................................. 494
Figure 241: 855GME (XTX) Advanced Clock Configuration ........................................... 496
Figure 242: 855GME (XTX) Advanced IDE Configuration .............................................. 497
Figure 243: 855GME (XTX) Primary IDE Master ............................................................ 498
Figure 244: 855GME (XTX) - primary IDE slave ............................................................. 500
Figure 245: 855GME (XTX) Secondary IDE Master........................................................ 501
Figure 246: 855GME (XTX) Secondary IDE Slave.......................................................... 503
Figure 247: 855GME (XTX) Advanced USB Configuration ............................................. 504
Figure 248: 855GME (XTX) USB mass storage device configuration............................. 507
Figure 249: 855GME (XTX) - advanced keyboard/mouse configuration......................... 508
Figure 250: 855GME (XTX) - advanced remote access configuration ............................ 509
Figure 251: 855GME (XTX) - advanced CPU board monitor .......................................... 511
Figure 252: 855GME (XTX) Advanced Baseboard/Panel Features ................................ 512
Figure 253: 855GME (XTX) Panel Control ...................................................................... 514
Figure 254: 855GME (XTX) - baseboard monitor............................................................ 515
Figure index
Figure 272: Creating a bootable diskette in Windows XP - step 3 .................................. 558
Figure 273: Creating a bootable diskette in Windows XP - step 4 .................................. 559
Figure 274: Creating a bootable diskette in Windows XP - step 5 .................................. 559
Figure 275: Creating a USB flash drive for B&R upgrade files........................................ 561
Figure 276: Creating a CompactFlash card for B&R upgrade files ................................. 563
Figure 277: Automation PC 620 with MS-DOS ............................................................... 566
Figure 278: Windows XP Professional Logo ................................................................... 568
Figure 279: Graphics driver for 815E Control Panel access ........................................... 571
Figure 280: Graphics driver for 815E settings ................................................................. 571
Figure 281: Accessing the graphics driver via Control Panel .......................................... 572
Figure 282: Extended desktop settings - primary and secondary device ........................ 573
Figure 283: Dual display clone settings - primary and secondary device........................ 575
Figure 284: Settings after installing the graphics driver................................................... 576
Figure 285: Settings for adjustment................................................................................. 577
Figure 286: Touch screen driver - serial touch screen .................................................... 578
Figure 287: Touch screen driver - auto-detect ................................................................ 579
Figure 288: Touch screen calibration .............................................................................. 579
Figure 289: Touch screen driver - serial touch screen .................................................... 580
Figure 290: Touch screen driver - auto-detect ................................................................ 580
Figure 291: Touch screen calibration .............................................................................. 581
Figure 292: Windows XP Embedded Logo...................................................................... 584
Figure 293: Windows Embedded Standard 2009 Logo................................................... 588
Figure 294: ADI Control Center screenshots - Example (symbol photo)......................... 595
Figure 295: ADI Control Center - SDL equalizer settings................................................ 598
Figure 296: ADI Control Center - UPS settings ............................................................... 599
Figure 297: ADI Control Center - UPS monitor ............................................................... 601
Figure 298: ADI Control Center - UPS battery settings ................................................... 602
Figure 299: ADI Control Center - UPS settings ............................................................... 604
Figure 300: ADI Control Center - Advanced UPS settings .............................................. 606
Figure index
Figure 363: Pin assignments - SDL flex cable with extender 5CASDL.0x00-13 ............. 715
Figure 364: RS232 extension cable (similar)................................................................... 716
Figure 365: Pin assignments - RS232 cable ................................................................... 717
Figure 366: USB extension cable (similar) ...................................................................... 718
Figure 367: Pin assignments - USB cable....................................................................... 719
Figure 368: UPS principle................................................................................................ 720
Figure 369: Firmware and software required for the UPS ............................................... 722
Figure 370: Add-on UPS module 5AC600.UPSI-00 ........................................................ 724
Figure 371: Add-on UPS module 5AC600.UPSI-00 - Installation materials .................... 725
Figure 372: Battery unit 5AC600.UPSB-00 ..................................................................... 726
Figure 373: Temperature life span diagram .................................................................... 727
Figure 374: Deep discharge cycles ................................................................................. 727
Figure 375: Dimensions - 5AC600.UPSB-00 .................................................................. 728
Figure 376: Drilling template for the battery unit.............................................................. 729
Figure 377: UPS connection cable .................................................................................. 730
Figure 378: Block diagram of the UPS ............................................................................ 731
Figure 379: PCI Ethernet card 10/100 - 5ACPCI.ETH1-01 ............................................. 733
Figure 380: Dimensions - 5ACPCI.ETH1-01 ................................................................... 734
Figure 381: PCI Ethernet card 10/100 - 5ACPCI.ETH3-01 ............................................. 735
Figure 382: Dimensions - 5ACPCI.ETH3-01 ................................................................... 736
Figure 383: Replacement fan .......................................................................................... 737
Figure 384: 5AC600.SRAM-00........................................................................................ 738
Figure 385: SRAM module installation ............................................................................ 740
Figure 386: B&R power supplies (examples) .................................................................. 741
Figure 387: Battery removal ............................................................................................ 744
Figure 388: Battery handling ........................................................................................... 745
Figure 389: Battery polarity ............................................................................................. 745
Figure 390: CompactFlash + ejection lever (representation picture)............................... 746
Figure 391: APC620 1PCI slot - Remove screws to install/ remove filter kit ................... 747
Figure 392: APC620 1PCI slot - Remove side cover and fan kit cover ........................... 747
Figure 393: Markings for direction of airflow / fan rotation............................................... 748
Figure 394: APC620 1PCI slot - Fan installation ............................................................. 748
Figure 395: APC620 1PCI slot - Fan cable connection to the main board ...................... 749
Figure 396: APC620 2PCI slots - Remove screws to install/ remove filter kit ................. 750
Figure 397: APC620 2PCI slots - Remove side cover and fan kit cover ......................... 750
Figure 398: Markings for direction of airflow / fan rotation............................................... 751
Figure 399: APC620 2PCI slots - Fan installation ........................................................... 751
Figure 400: APC620 2PCI slots - Fan cable connection to the main board .................... 752
Figure 401: Dust filter in the fan kit cover and filter clasp................................................ 752
Figure 402: APC620 3PCI slot - Remove screws to install/ remove filter kit ................... 753
Figure 403: APC620 3PCI slots - Remove side cover and fan kit cover ......................... 754
Figure 404: Markings for direction of airflow / fan rotation............................................... 754
Figure 405: APC620 3PCI slot - Fan installation ............................................................. 755
Figure 406: APC620 3PCI slot - Fan cable connection to the main board ...................... 756
Figure 407: Dust filter in the fan kit cover and filter clasp................................................ 756
Figure 408: APC620 5PCI slot - Remove screws to install/ remove filter kit ................... 757
Figure 409: APC620 5PCI slot - Remove side cover and fan kit cover ........................... 757
Figure 410: APC620 5PCI attach cable fasteners........................................................... 758
Figure 411: Markings for direction of airflow / fan rotation............................................... 758
Figure 412: APC620 5PCI slot - Fan installation ............................................................. 759
Figure 413: APC620 5PCI slot - Fan cable connection to the main board ...................... 760
Figure 414: Dust filter in the fan kit cover and filter clasp................................................ 761
Figure 415: Removing the slide-in dummy module ......................................................... 762
Figure 416: Installing the slide-in drive ............................................................................ 762
Figure 417: Release the slide-in slot releasing mechanisms .......................................... 763
Figure 418: Removing the slide-in drive .......................................................................... 763
Figure 419: Slide-in slot releasing mechanism start position .......................................... 764
Figure 420: Add-on UPS module 5AC600.UPSI-00 - Installation materials .................... 765
Figure 421: Remove UPS module cover ......................................................................... 765
Figure 422: Screw in spacing bolt and spacing ring ........................................................ 766
Figure 423: Install UPS module....................................................................................... 766
Figure 424: Plug in connection cable .............................................................................. 766
Figure 425: Connector locking mechanism ..................................................................... 767
Figure 426: Remove UPS module cover ......................................................................... 768
Figure 427: Remove cover plate ..................................................................................... 768
Figure 428: Screw in spacing bolt and spacing ring ........................................................ 768
Figure 429: Install mounting bracket ............................................................................... 769
Figure 430: Install UPS module....................................................................................... 769
Figure 431: Plug in connection cable .............................................................................. 769
Figure 432: Connector locking mechanism ..................................................................... 770
Figure 433: Remove UPS module cover ......................................................................... 771
Figure 434: Remove cover plate ..................................................................................... 771
Figure 435: Screw in spacing bolt and spacing ring ........................................................ 771
Figure 436: Install mounting bracket ............................................................................... 772
Figure 437: Install UPS module....................................................................................... 772
Figure 438: Plug in connection cable .............................................................................. 772
Figure index
Figure 457: Plug in connection cable .............................................................................. 780
Figure 458: Connector locking mechanism ..................................................................... 780
Figure 459: Mounting the side cover - APC620, 1 PCI slot ............................................. 781
Figure 460: Mounting the side cover - APC620, 2 PCI slot ............................................. 782
Figure 461: Mounting the side cover - APC620, 3 PCI slot ............................................. 783
Figure 462: Mounting the side cover - APC620, 5 PCI slot ............................................. 784
Figure 463: Screw assignment on the back side of the SATA RAID controller ............... 785
Figure 464: Hard disk exchange...................................................................................... 786
Figure 465: Removing the APC620 front cover............................................................... 787
Figure 466: Mounting the APC620 front cover ................................................................ 788
Figure 467: APC620 front cover label ............................................................................. 789
Figure 468: Removing the APC620 front cover............................................................... 789
Figure 469: Attaching the front cover .............................................................................. 790
Figure 470: Temperature sensor locations...................................................................... 791
Figure 471: Connector location for external devices ....................................................... 792
Figure 472: MTCX controller location .............................................................................. 793
Figure 473: Sample configuration for SDL timing............................................................ 794
Figure 474: SDL timing - Example for Automation Panel 900 with the number 0 ........... 795
Figure 475: B&R Key Editor screenshots Version 3.10 (representation picture)............. 797
Figure 476: ADI development kit screenshots (Version 3.10) ......................................... 799
Figure 477: ADI .NET SDK Screenshots (Version 1.50) ................................................. 801
Table index
Table index
Table 27: Technical data - APC620, 5 PCI slot variant ....................................................... 79
Table 28: Technical data - APC620 embedded variant ...................................................... 85
Table 29: Overview of humidity specifications for individual components......................... 119
Table 30: Pin assignments - COM1 .................................................................................. 123
Table 31: COM1 - I/O address and IRQ............................................................................ 123
Table 32: Pin assignments - COM2 .................................................................................. 124
Table 33: COM2 - I/O address and IRQ............................................................................ 124
Table 34: X2X pin assignments (only APC620 embedded) .............................................. 125
Table 35: CAN pin assignments (only APC620 embedded) ............................................. 125
Table 36: CAN node number switch (x1, x16) - only APC620 embedded ........................ 126
Table 37: CAN terminating switch / LED (only APC620 embedded)................................. 126
Table 38: Status LEDs CAN / X2X (only APC620 embedded) ......................................... 127
Table 39: POWERLINK (only APC620 embedded) .......................................................... 127
Table 40: Status / Error LED as error LED - POWERLINK V2 operating mode................ 127
Table 41: Status/Error LED as status LED - POWERLINK V2 operating mode................ 128
Table 42: POWERLINK station number (x1, x16) - only APC620 embedded................... 129
Table 43: Ethernet connection ETH (only APC620 embedded)........................................ 129
Table 44: Ethernet connection (ETH1).............................................................................. 130
Table 45: Ethernet cable length in conjunction with 5PC600.E855-xx CPU boards (ETX).....
131
Table 46: Ethernet cable length in conjunction with 5PC600.E855-xx CPU boards ......... 131
Table index
Table 117: CAN cable requirements ................................................................................... 276
Table 118: Pin assignments - RS232/RS422...................................................................... 278
Table 119: Add-on RS232/422/485 - I/O address and IRQ ................................................ 278
Table 120: RS232 - Bus length and transfer rate................................................................ 279
Table 121: RS232 - Cable requirements............................................................................. 279
Table 122: RS422 - Bus length and transfer rate................................................................ 279
Table 123: RS422 - Cable requirements............................................................................. 280
Table 124: RS485 - Bus length and transfer rate................................................................ 281
Table 125: RS485 - Cable requirements............................................................................. 281
Table 126: Technical data - 5PC600.FA01-00.................................................................... 282
Table 127: Contents of delivery - 5PC600.FA01-00 ........................................................... 283
Table 128: Technical data - 5PC600.FA02-00.................................................................... 284
Table 129: Contents of delivery - 5PC600.FA02-00 ........................................................... 284
Table 130: Technical data - 5PC600.FA03-00.................................................................... 285
Table 131: Contents of delivery - 5PC600.FA03-00 ........................................................... 285
Table 132: Technical data - 5PC600.FA05-00.................................................................... 286
Table 133: Contents of delivery - 5PC600.FA05-00 ........................................................... 287
Table 134: Model numbers - AP Link graphics adapter ...................................................... 288
Table 135: AP Link slot (AP Link card inserted).................................................................. 288
Table 136: Pin assignment for AP Link connection............................................................. 289
Table 137: Segment lengths, resolutions and SDL cables ................................................. 290
Table 138: Requirements for SDL cable with automatic cable adjustment (equalizer) ....... 290
Table 139: Requirements for SDL cable with extender and automatic cable adjustment
(equalizer) ......................................................................................................... 291
Table 140: Drilling templates - 1 and 2 PCI slots ................................................................ 294
Table 141: Drilling templates - 3 and 5 PCI slots ................................................................ 295
Table 142: Drilling templates - APC620 embedded ............................................................ 296
Table 143: Selecting the display units................................................................................. 309
Table 144: Possible combinations of system unit and CPU board ..................................... 310
Table 145: Link module for the configuration - One Automation Panel 900 via DVI ........... 311
Table 146: Cables for DVI configurations ........................................................................... 311
Table 147: Possible Automation Panel units, resolutions und segment lengths ................. 311
Table 148: Possible combinations of system unit and CPU board ..................................... 313
Table 149: Link module for the configuration - One Automation Panel 900 via SDL .......... 314
Table 150: Cables for SDL configurations .......................................................................... 314
Table 151: Segment lengths, resolutions and SDL cables ................................................. 315
Table 152: Requirements for SDL cable with automatic cable adjustment (equalizer) ....... 315
Table 153: Requirements for SDL cable with extender and automatic cable adjustment
(equalizer) ......................................................................................................... 316
Table 154: Possible combinations of system unit and CPU board ..................................... 317
Table 155: Cables for SDL configurations .......................................................................... 318
Table 156: Segment lengths, resolutions and SDL cables ................................................. 318
Table 157: Requirements for SDL cable with automatic cable adjustment (equalizer) ....... 319
Table 158: Requirements for SDL cable with extender and automatic cable adjustment
(equalizer) ......................................................................................................... 319
Table 159: Possible combinations of system unit and CPU board ..................................... 320
Table 160: Segment lengths, resolutions and SDL cables ................................................. 321
Table 161: Requirements for SDL cable with automatic cable adjustment (equalizer) ....... 321
Table 162: Requirements for SDL cable with extender and automatic cable adjustment
(equalizer) ......................................................................................................... 322
Table 163: Possible combinations of system unit and CPU board ..................................... 323
Table 164: Link modules for the configuration: 4 Automation Panel 900 via SDL on 1 line 324
Table 165: Cables for SDL configurations .......................................................................... 324
Table 166: Segment lengths, resolutions and SDL cables ................................................. 325
Table 167: Requirements for SDL cable with automatic cable adjustment (equalizer) ....... 326
Table 168: Requirements for SDL cable with extender and automatic cable adjustment
(equalizer) ......................................................................................................... 326
Table 169: Possible combinations of system unit and CPU board ..................................... 328
Table 170: Link modules for the configuration: 1 Automation Panel 900 via SDL (optional) ....
329
Table 171: Cables for SDL configurations .......................................................................... 329
Table 172: Segment lengths, resolutions and SDL cables ................................................. 330
Table 173: Requirements for SDL cable with automatic cable adjustment (equalizer) ....... 330
Table 174: Requirements for SDL cable with extender and automatic cable adjustment
(equalizer) ......................................................................................................... 331
Table 175: Possible combinations of system unit and CPU board ..................................... 332
Table 176: Link modules for configuration: 4 Automation Panel 900 units via SDL (optional) on
1 line.................................................................................................................. 333
Table index
Table 197: Requirements for SDL cable with extender and automatic cable adjustment
(equalizer) ......................................................................................................... 349
Table 198: BIOS-relevant keys in the RAID Configuration Utility........................................ 351
Table 199: Evaluation example using an APC810 2-slot .................................................... 367
Table 200: Compatibility / improvements from 855GME (XTX) to 855GME (ETX)............. 368
Table 201: Keys relevant to 815E (ETX) BIOS during POST ............................................. 373
Table 202: Keys relevant to 815E (ETX) BIOS ................................................................... 373
Table 203: Overview of 815E (ETX) BIOS menu items ...................................................... 374
Table 204: 815E (ETX) Main setting options ...................................................................... 375
Table 205: 815E (ETX) IDE Channel 0 Master setting options ........................................... 377
Table 206: 815E (ETX) IDE Channel 0 Slave setting options ............................................. 378
Table 207: 815E (ETX) IDE Channel 1 Master setting options ........................................... 380
Table 208: 815E (ETX) IDE Channel 1 Slave setting options ............................................. 382
Table 209: 815E (ETX) Advanced Menu setting options .................................................... 384
Table 210: 815E (ETX) Advanced Chipset/Graphics Control setting options ..................... 386
Table 211: 815E (ETX) PCI/PNP Configuration setting options ......................................... 387
Table 212: 815E (ETX) PCI device, slot #1 setting options ................................................ 389
Table 213: 815E (ETX) PCI device, slot #2 setting options ................................................ 390
Table 214: 815E (ETX) PCI device, slot #3 setting options ................................................ 391
Table 215: 815E (ETX) PCI device, slot #4 setting options ................................................ 392
Table 216: 815E (ETX) Memory Cache setting options ...................................................... 393
Table 217: 815E (ETX) I/O Device Configuration setting options ....................................... 395
Table 218: 815E (ETX) Keyboard Features setting options................................................ 398
Table 219: 815E (ETX) CPU Board Monitor setting options ............................................... 399
Table 220: 815E (ETX) Miscellaneous setting options ....................................................... 400
Table 221: 815E (ETX) Baseboard/Panel Features setting options ................................... 401
Table 222: 815E (ETX) Panel Control setting options ........................................................ 403
Table 223: 815E (ETX) Baseboard Monitor setting options ................................................ 404
Table 224: 815E (ETX) Legacy Devices setting options ..................................................... 405
Table 225: 815E (ETX) Security setting options ................................................................. 407
Table 226: 815E (ETX) Power setting options .................................................................... 409
Table 227: 815E (ETX) ACPI Control setting options ......................................................... 411
Table 228: 815E (ETX) Thermal Management ................................................................... 412
Table 229: 815E (ETX) Boot setting options ....................................................................... 414
Table 230: 815E (ETX) Exit setting options ........................................................................ 415
Table 231: 815E (ETX) Profile overview ............................................................................. 416
Table 232: 815E (ETX) Main Profile settings overview ....................................................... 417
Table 233: 815E (ETX) Advanced Chipset/Graphics Control Profile settings overview...... 418
Table 234: 815E (ETX) PCI/PNP Configuration Profile settings overview .......................... 418
Table 235: 815E (ETX) Memory Cache Profile settings overview ...................................... 419
Table 236: 815E (ETX) I/O Device Configuration Profile settings overview........................ 419
Table 237: 815E (ETX) Keyboard Features Profile settings overview ................................ 420
Table 238: 815E (ETX) CPU Board Monitor Profile settings overview................................ 420
Table 239: 815E (ETX) Miscellaneous Profile settings overview ........................................ 420
Table 240: 815E (ETX) Baseboard/Panel Features Profile settings overview .................... 421
Table 241: 815E (ETX) Security Profile settings overview.................................................. 422
Table 242: 815E (ETX) Power Profile settings overview .................................................... 423
Table 243: 815E (ETX) Boot Profile settings overview ....................................................... 424
Table 244: Keys relevant to 855GME (ETX) BIOS during POST ....................................... 427
Table 245: 855GME (ETX) - BIOS relevant keys................................................................ 427
Table 246: Overview of 855GME (ETX) BIOS menu items................................................. 427
Table 247: 855GME (ETX) Main setting options................................................................. 428
Table 248: 855GME (ETX) IDE Channel 0 Master setting options ..................................... 430
Table 249: 855GME (ETX) IDE Channel 0 Slave setting options ....................................... 432
Table 250: 855GME (ETX) IDE Channel 1 Master setting options ..................................... 434
Table 251: 855GME (ETX) IDE Channel 1 Slave setting options ....................................... 436
Table 252: 855GME (ETX) Advanced Menu setting options .............................................. 438
Table 253: 855GME (ETX) Advanced Chipset Control setting options............................... 439
Table 254: 855GME (ETX) PCI/PNP Configuration setting options.................................... 442
Table 255: 855GME (ETX) - PCI device, slot #1 - setting options ...................................... 444
Table 256: 855GME (ETX) - PCI device, slot #2 - setting options ...................................... 445
Table 257: 855GME (ETX) - PCI device, slot #3 - setting options ...................................... 446
Table 258: 855GME (ETX) - PCI device, slot #4 - setting options ...................................... 447
Table 259: 855GME (ETX) Memory Cache setting options ................................................ 448
Table 260: 855GME (ETX) I/O Device Configuration setting options ................................. 450
Table 261: 855GME (ETX) Keyboard Features setting options .......................................... 453
Table 262: 855GME (ETX) - CPU board monitor - setting options ..................................... 454
Table 263: 855GME (ETX) miscellaneous - setting options ............................................... 455
Table index
Table 289: 855GME (XTX) Main menu setting options....................................................... 484
Table 290: 855GME (XTX) Advanced menu setting options .............................................. 485
Table 291: 855GME (XTX) Advanced ACPI Configuration setting options......................... 487
Table 292: 855GME (XTX) Advanced PCI Configuration setting options ........................... 488
Table 293: 855GME (XTX) Advanced Graphics Configuration setting options................... 490
Table 294: 855GME (XTX) Advanced CPU Configuration setting options.......................... 492
Table 295: 855GME (XTX) - advanced chipset - setting options ........................................ 493
Table 296: 855GME (XTX) Advanced I/O Interface Configuration setting options ............. 494
Table 297: 855GME (XTX) Advanced Clock Configuration setting options ........................ 496
Table 298: 855GME (XTX) Advanced IDE Configuration setting options ........................... 497
Table 299: 855GME (XTX) Primary IDE Master setting options ......................................... 499
Table 300: 855GME (XTX) - primary IDE slave - setting options........................................ 500
Table 301: 855GME (XTX) Secondary IDE Master setting options .................................... 502
Table 302: 855GME (XTX) Secondary IDE Slave setting options ...................................... 503
Table 303: 855GME (XTX) Advanced USB Configuration setting options.......................... 505
Table 304: 855GME (XTX) USB mass storage device configuration.................................. 507
Table 305: 855GME (XTX) - advanced keyboard/mouse configuration - setting options ... 508
Table 306: 855GME (XTX) - advanced remote access configuration - setting options....... 509
Table 307: 855GME (XTX) - advanced remote access configuration - setting options....... 511
Table 308: 855GME (XTX) Advanced Baseboard/Panel Features setting options............. 512
Table 309: 855GME (XTX) Panel Control setting options................................................... 514
Table 310: 855GME (XTX) - baseboard monitor setting options ........................................ 515
Table 311: 855GME (XTX) Legacy Devices setting options ............................................... 516
Table 312: 855GME (XTX) Boot menu setting options ....................................................... 518
Table 313: 855GME (XTX) Security menu setting options ................................................. 520
Table 314: 855GME (XTX) Hard disk security user password............................................ 521
Table 315: 855GME (XTX) Hard disk security master password........................................ 522
Table 316: 855GME (XTX) Power menu setting options .................................................... 523
Table 317: 855GME - (XTX) Exit menu - Setting options ................................................... 525
Table 318: 855GME (XTX) Profile overview ....................................................................... 527
Table 319: 855GME (XTX) Main profile settings overview.................................................. 528
Table 320: 855GME (XTX) - advanced profile setting options ............................................ 528
Table 321: 855GME - (XTX) PCI configuration - profile setting overview ........................... 529
Table 322: 855GME - (XTX) Graphics configuration - profile setting overview................... 529
Table 323: 855GME - (XTX) CPU configuration - profile setting overview.......................... 530
Table 324: 855GME - (XTX) Chipset configuration - profile setting overview ..................... 530
Table 325: 855GME (XTX) - I/O interface configuration - profile settings overview............ 530
Table 326: 855GME - (XTX) Clock configuration - profile setting overview ........................ 530
Table 327: 855GME - (XTX) IDE configuration - profile setting overview ........................... 531
Table 328: 855GME - (XTX) USB configuration - profile setting overview.......................... 532
Table 329: 855GME (XTX) - keyboard/mouse configuration - profile setting overview....... 532
Table 330: 855GME - (XTX) remote access configuration - profile setting overview.......... 533
Table 331: 855GME (XTX) - CPU board monitor - profile setting overview ........................ 533
Table 332: 855GME (XTX) - baseboard/panel features -profile setting overview ............... 533
Table 333: 855GME (XTX) - boot - profile setting overview................................................ 535
Table 334: 855GME (XTX) - security - profile setting options ............................................. 535
Table 335: 855GME (XTX) - power - profile setting overview ............................................. 536
Table 336: BIOS post code messages BIOS 815E (ETX) and 855GME (ETX).................. 537
Table 337: BIOS post code messages BIOS 855GME (XTX) ............................................ 537
Table 338: RAM address assignment ................................................................................. 539
Table 339: DMA channel assignment ................................................................................. 539
Table 340: I/O address assignment .................................................................................... 540
Table 341: IRQ interrupt assignments in PCI mode............................................................ 541
Table 342: IRQ interrupt assignments in APIC mode ......................................................... 542
Table 343: Inter-IC (I²C) bus resources .............................................................................. 545
Table 344: Inter-IC (I²C) bus resources .............................................................................. 545
Table 345: CPU board software versions ........................................................................... 547
Table 346: Automation panel link software versions ........................................................... 547
Table 347: Differentiating between 815E (ETX) and 855GME (ETX / XTX) CPU boards... 548
Table 348: System unit support for buffering with Automation Runtime ............................. 564
Table 349: Visual Components video output with different system units ............................ 565
Table 350: Model numbers - MS-DOS ................................................................................ 566
Table 351: Tested resolutions and color depths for DVI and RGB signals ......................... 567
Table 352: Model numbers - Windows XP Professional ..................................................... 568
Table 353: Relationship between driver settings and graphics engine ............................... 573
Table 354: Relationship between driver settings and graphics engine ............................... 575
Table 355: Model numbers - Windows XP Embedded ....................................................... 584
Table 356: Device functions in Windows XP Embedded with FP2007 ............................... 585
Table index
Table 383: Test requirements - Worst case during operation ............................................. 622
Table 384: Test requirements - Dry heat ............................................................................ 622
Table 385: Test requirements - Dry cold ............................................................................. 622
Table 386: Test requirements - Large temperature fluctuations ......................................... 623
Table 387: Test requirements - Temperature fluctuations during operation ....................... 623
Table 388: Test requirements - Humid heat, cyclic ............................................................. 623
Table 389: Test requirements - Humid heat, constant (storage)......................................... 623
Table 390: Overview of limits and testing guidelines for safety .......................................... 624
Table 391: Test requirements - Ground resistance............................................................. 625
Table 392: Test requirements - Insulation resistance ......................................................... 625
Table 393: Test requirements - High voltage ...................................................................... 626
Table 394: Test requirements - Residual voltage ............................................................... 626
Table 395: Test requirements - Leakage current ................................................................ 626
Table 396: Test requirements - Overload ........................................................................... 627
Table 397: Test requirements - Defective component ........................................................ 627
Table 398: Test requirements - Voltage range.................................................................... 627
Table 399: Overview of limits and testing guidelines for other tests ................................... 628
Table 400: Test requirements - Protection .......................................................................... 628
Table 401: Test requirements - Degree of pollution ............................................................ 628
Table 402: International Certifications................................................................................. 631
Table 403: Model numbers - Accessories ........................................................................... 633
Table 451: Firmware and software required for the UPS .................................................... 722
Table 452: Technical data - 5AC600.UPSI-00 .................................................................... 724
Table 453: Technical data - 5AC600.UPSB-00................................................................... 726
Table 454: Technical data - UPS connection cable ............................................................ 730
Table 455: UPS - Order data .............................................................................................. 732
Table 456: Ethernet connection ETH .................................................................................. 733
Table 457: Ethernet connections ETH1, ETH2, ETH3 ........................................................ 735
Table 458: Model numbers - Replacement fan filters ......................................................... 737
Table 459: Technical data - 5AC600.SRAM-00 .................................................................. 738
Table 460: Single-phase power supplies ............................................................................ 742
Table 461: Three-phase power supplies ............................................................................. 742
Table 462: Meaning of battery status .................................................................................. 744
Table 463: Temperature sensor locations........................................................................... 791
Table 464: Revision information for connecting an external device .................................... 792
Table 465: Pin assignments - Connector on main board .................................................... 792
Table 466: Temperature limits for fan control ..................................................................... 796
Table index
5AC600.FA01-00 ....................... 47, 637, 737 5CASDL.0050-03 ...................... 45, 634, 706
5AC600.FA02-00 ....................... 48, 637, 737 5CASDL.0100-00 ...................... 45, 634, 696
5AC600.FA03-00 ....................... 48, 637, 737 5CASDL.0100-01 ...................... 46, 634, 699
5AC600.FA05-00 ....................... 48, 637, 737 5CASDL.0100-03 ...................... 46, 634, 706
5AC600.FDDS-00.............................. 41, 231 5CASDL.0150-00 ...................... 46, 634, 696
5AC600.HDDI-00............................... 40, 195 5CASDL.0150-01 ...................... 46, 634, 699
5AC600.HDDI-01............................... 40, 198 5CASDL.0150-03 ...................... 46, 634, 706
5AC600.HDDI-02............................... 40, 201 5CASDL.0200-00 ...................... 46, 634, 696
5AC600.HDDI-03............................... 40, 204 5CASDL.0200-03 ...................... 46, 634, 706
5AC600.HDDI-04............................... 40, 207 5CASDL.0250-00 ...................... 46, 634, 696
5AC600.HDDI-05............................... 40, 210 5CASDL.0250-03 ...................... 46, 634, 706
5AC600.HDDI-06............................... 40, 213 5CASDL.0300-00 ...................... 46, 634, 696
5AC600.HDDS-00 ......................................41 5CASDL.0300-03 ...................... 46, 634, 706
5AC600.HDDS-01 ............................. 41, 237 5CASDL.0300-10 ...................... 46, 634, 702
Index
RS232 ..................................................716 D
SDL ......................................................696
SDL w/ extender ...................................702 Damped vibration .................................... 618
SDL with 45° plug .................................699 Data loss ............ 61, 67, 73, 78, 84, 156, 817
USB ......................................................718 Data register ............................................ 275
Cache ..............................179, 181, 183, 804 DCD ......................................................... 806
Cage clamps ............................135, 638, 640 Deep discharge cycles ...................... 27, 727
CAN ...................................54, 125, 145, 804 Deep discharge protection ....................... 721
Bus length ............................................276 Deep discharge voltage ........................... 726
Cable type ............................................276 Defective component ............................... 627
Terminating resistor ..............................277 Degree of pollution .................................. 628
CAN address register ..............................275 Derating ............................................... 91, 95
CAN controller .........................................274 Development kit ....................................... 799
CAN node ID ............................................126 Device ID ................................................. 739
CAN terminating switch ...........................126 Device interfaces ..................................... 121
CD-ROM ..................................................804 Dial-up ..................................................... 806
CE mark ...................................................804 Dimension standards ................................. 36
Certifications ............................................631 Dimensions ................................................ 65
Chipset .....................................................179 1 PCI slot variant .................................... 65
Climate conditions ...................................622 2 PCI slot variant .................................... 71
CMOS ......................................................805 3 PCI slot variant .................................... 76
CMOS battery ..........................................641 5 PCI slot variant .................................... 82
COM ........................................................805 620 embedded variant ........................... 88
COM1 ..............................................123, 805 DIMM ....................................................... 806
COM2 ..............................................124, 805 DIP switch ................................................ 546
COM3 ......................................................805 Direction of air flow .......... 748, 751, 754, 758
CompactFlash ..................................659, 805 Directives ................................................... 36
Calculating the lifespan ........................662 Display Clone .......................................... 308
Dimensions ...................648, 653, 658, 661 Disposal ..................................................... 35
General information ......645, 650, 655, 659 Distribution of resources .......................... 539
Order data ....................645, 650, 655, 659 DMA channel assignment .................... 539
Technical data ..............646, 651, 656, 659 I/O address assignment ....................... 540
CompactFlash slot ...................152, 153, 155 Interrupt assignments ................... 541, 542
Conducted disturbances ..........................616 RAM address assignment .................... 539
Configure .................................................723 DMA ......................................................... 806
Connection cycles ............................138, 288 Dongle ..................................... 160, 397, 452
Connection examples ..............................308 Double layer .................................... 224, 676
Control Center .........................595, 600, 791 DRAM ...................................................... 806
CPU .........................................................805 Drilling templates ..................................... 294
CPU board 815E (ETX) ...........................179 Drives ...................................................... 187
CPU board 855GME (ETX) .....................181 Dry cold ................................................... 622
CPU board 855GME (XTX) .....................183 Dry heat ................................................... 622
Creating a CompactFlash card for B&R DS1425 .................................................... 160
Index
Index