SN8P2602C Sonix
SN8P2602C Sonix
SN8P2602C Sonix
8-Bit Micro-Controller
SN8P2602C
USER’S MANUAL
Version 1.2
SN8P2602C
SONIX reserves the right to make change without further notice to any products herein to improve reliability, function or design. SONIX does not
assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent
rights nor the rights of others. SONIX products are not designed, intended, or authorized for us as components in systems intended, for surgical
implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SONIX product
could create a situation where personal injury or death may occur. Should Buyer purchase or use SONIX products for any such unintended or
unauthorized application. Buyer shall indemnify and hold SONIX and its officers, employees, subsidiaries, affiliates and distributors harmless against
all claims, cost, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use even if such claim alleges that SONIX was negligent regarding the design or manufacture of
the part.
AMENDENT HISTORY
Version Date Description
VER 0.1 Feb. 2010 First issue.
VER 0.2 May. 2010 Modify EV-Kit version from “B” to “A”.
VER 0.3 Jun. 2010 1. Modify EV-Kit version from “A” to “V1.0”.
2. Add SN8P2602C EV-KIT schematic.
VER 1.0 Dec. 2010 Add code option: Low_Power description.
VER 1.1 Mar. 2011 Add “DEVELOPMENT TOOL” description.
VER 1.2 May. 2011 1. Modify “Chapter 2.4.2 STACK REGISTERS” description : 9-bit >> 10-bit data
memory.
2. Add “Chapter 11.3 CHARACTERISTIC GRAPHS” description : (-40℃~+85℃ curves
are for design reference).
3. Modify “Chapter 12 DEVELOPMENT TOOL” description.
Table of Content
AMENDENT HISTORY ................................................................................................................................ 2
11 PRODUCT OVERVIEW ........................................................................................................................... 6
1.1 FEATURES ........................................................................................................................................ 6
1.2 SYSTEM BLOCK DIAGRAM .......................................................................................................... 7
1.3 PIN ASSIGNMENT ........................................................................................................................... 7
1.4 PIN DESCRIPTIONS ......................................................................................................................... 8
1.5 PIN CIRCUIT DIAGRAMS ............................................................................................................... 8
22 CENTRAL PROCESSOR UNIT (CPU) .................................................................................................. 10
2.1 PROGRAM MEMORY (ROM) ....................................................................................................... 10
2.1.1 RESET VECTOR (0000H) ...................................................................................................... 11
2.1.2 INTERRUPT VECTOR (0008H) ............................................................................................. 12
2.1.3 LOOK-UP TABLE DESCRIPTION ........................................................................................ 14
2.1.4 JUMP TABLE DESCRIPTION ............................................................................................... 16
2.1.5 CHECKSUM CALCULATION............................................................................................... 18
2.2 DATA MEMORY (RAM) ................................................................................................................ 19
2.2.1 SYSTEM REGISTER .............................................................................................................. 19
2.2.1.1 SYSTEM REGISTER TABLE ............................................................................................ 19
2.2.1.2 SYSTEM REGISTER DESCRIPTION ............................................................................... 19
2.2.1.3 BIT DEFINITION of SYSTEM REGISTER ....................................................................... 20
2.2.2 ACCUMULATOR ................................................................................................................... 21
2.2.3 PROGRAM FLAG ................................................................................................................... 22
2.2.4 PROGRAM COUNTER........................................................................................................... 23
2.2.5 Y, Z REGISTERS..................................................................................................................... 25
2.2.6 R REGISTER ........................................................................................................................... 25
2.3 ADDRESSING MODE .................................................................................................................... 26
2.3.1 IMMEDIATE ADDRESSING MODE .................................................................................... 26
2.3.2 DIRECTLY ADDRESSING MODE ....................................................................................... 26
2.3.3 INDIRECTLY ADDRESSING MODE ................................................................................... 26
2.4 STACK OPERATION ...................................................................................................................... 27
2.4.1 OVERVIEW ............................................................................................................................. 27
2.4.2 STACK REGISTERS ............................................................................................................... 27
2.4.3 STACK OPERATION EXAMPLE.......................................................................................... 28
2.5 CODE OPTION TABLE .................................................................................................................. 29
2.5.1 Fcpu code option ...................................................................................................................... 30
2.5.2 Reset_Pin code option .............................................................................................................. 30
2.5.3 Security code option ................................................................................................................. 30
2.5.4 Noise Filter code option ........................................................................................................... 30
2.5.5 Low_Power code option ........................................................................................................... 30
33 RESET ...................................................................................................................................................... 31
3.1 OVERVIEW ..................................................................................................................................... 31
3.2 POWER ON RESET......................................................................................................................... 32
3.3 WATCHDOG RESET ...................................................................................................................... 32
3.4 BROWN OUT RESET ..................................................................................................................... 32
3.5 THE SYSTEM OPERATING VOLTAGE ....................................................................................... 33
3.6 LOW VOLTAGE DETECTOR (LVD) ............................................................................................ 33
3.7 BROWN OUT RESET IMPROVEMENT ....................................................................................... 35
3.8 EXTERNAL RESET ........................................................................................................................ 36
3.9 EXTERNAL RESET CIRCUIT ....................................................................................................... 36
1 PRODUCT OVERVIEW
1.1 FEATURES
Memory configuration Fcpu (Instruction cycle)
ROM size: 1K * 16 bits. Fcpu = Fosc/1, Fosc/2, Fosc/4, Fosc/8, Fosc/16,
RAM size: 48 * 8 bits. Fosc/32, Fosc/64, Fosc/128
4 levels stack buffer. One T0 8-bit basic timer with RTC (0.5sec).
3 interrupt sources One TC0 8-bit timer with external event counter,
2 internal interrupts: T0, TC0 Buzzer and PWM.
1 external interrupt: INT0 One channel 2K/4K buzzer output.
On chip watchdog timer and clock source is
I/O pin configuration Internal low clock RC type (16KHz @3V, 32KHz
Bi-directional: P0, P1, P5. @5V).
Input only: P1.5.
Pull-up resisters: P0, P1, P5. 4 system clocks
Pull-down resisters: P5.0~P5.3. External high clock: RC type up to 10 MHz
Wakeup: P0, P1 level change. External high clock: Crystal type up to 16 MHz
40mA sink pin: P5.0~P5.3, P5.5. Internal high clock: 16MHz RC type.
Programmable open-drain: P1.0. Internal low clock: RC type 16KHz(3V), 32KHz(5V)
External Interrupt trigger edge:
P0.0 controlled by PEDGE register. 4 operating modes
Normal mode: Both high and low clock active
3-Level LVD. Slow mode: Low clock only
Reset system and power monitor. Sleep mode: Both high and low clock stop
Green mode: Periodical wakeup by timer
Powerful instructions
Instruction’s length is one word. Package (Chip form support)
Most of instructions are one cycle only. DIP 18 pin
All ROM area JMP/CALL instruction. SOP 18 pin
All ROM area lookup table function (MOVC). SSOP 20 pin
PC
3-Level LVD
OTP INTERNAL (Low Voltage Detector)
IR HIGH RC INTERNAL
ROM 16MHz LOW RC
WATCHDOG TIMER
FLAGS
TIMING GENERATOR
ALU
RAM
INTERRUPT
CONTROL TIMER & COUNTER PWM, Buzzer PWM0, BZ0
P0 P1 P5
PnM PnUR
Output
I/O Output Bus
Latch
PnM PnUR
PnM PnDR
Pull-Down
Resistor
PnM
Output
I/O Output Bus
Latch
PnM PnUR
Output
I/O Output Bus
Latch
Open-Drain
High_Clk
PnM PnUR
Code Option
Output
I/O Output Bus
Latch
Oscillator Driver
ROM
User reset vector
0000H Reset vector
Jump to user start address
0001H
.
General purpose area
.
0007H
0008H Interrupt vector User interrupt vector
0009H User program
.
.
000FH
0010H General purpose area
0011H
.
.
03FCH End of user program
03FDH
03FEH Reserved
03FFH
The ROM includes Reset vector, Interrupt vector, General purpose area and Reserved area. The Reset vector is
program beginning address. The Interrupt vector is the head of interrupt service routine when any interrupt occurring.
The General purpose area is main program area including main loop, sub-routines and data table.
After power on reset, external reset or watchdog timer overflow reset, then the chip will restart the program from
address 0000h and all system registers will be set as default values. It is easy to know reset status from NT0, NPD
flags of PFLAG register. The following example shows the way to define the reset vector in the program memory.
ORG 0 ; 0000H
JMP START ; Jump to user program address.
…
ORG 10H
START: ; 0010H, The head of user program.
… ; User program
…
Note: ”PUSH”, “POP” instructions save and load ACC/PFLAG without (NT0, NPD). PUSH/POP buffer is a
unique buffer and only one level.
Example: Defining Interrupt Vector. The interrupt service routine is following ORG 8.
.CODE
ORG 0 ; 0000H
JMP START ; Jump to user program address.
…
Example: Defining Interrupt Vector. The interrupt service routine is following user program.
.CODE
ORG 0 ; 0000H
JMP START ; Jump to user program address.
…
ORG 8 ; Interrupt vector.
JMP MY_IRQ ; 0008H, Jump to interrupt service routine address.
ORG 10H
START: ; 0010H, The head of user program.
… ; User program.
…
…
JMP START ; End of user program.
…
MY_IRQ: ;The head of interrupt service routine.
PUSH ; Save ACC and PFLAG register to buffers.
…
…
POP ; Load ACC and PFLAG register from buffers.
RETI ; End of interrupt service routine.
…
Note: It is easy to understand the rules of SONIX program from demo programs given above. These
points are as following:
1. The address 0000H is a “JMP” instruction to make the program starts from the beginning.
2. The address 0008H is interrupt vector.
3. User’s program is a loop routine for main purpose application.
Note: The Y register will not increase automatically when Z register crosses boundary from 0xFF to
0x00. Therefore, user must be take care such situation to avoid look-up table errors. If Z register is
overflow, Y register must be added one. The following INC_YZ macro shows a simple method to process
Y and Z registers automatically.
INC_YZ MACRO
INCMS Z ; Z+1
JMP @F ; Not overflow
INCMS Y ; Y+1
NOP ; Not overflow
@@:
ENDM
The other example of look-up table is to add Y or Z index register by accumulator. Please be careful if “carry” happen.
Note: PCH only support PC up counting result and doesn’t support PC down counting. When PCL is
carry after PCL+ACC, PCH adds one automatically. If PCL borrow after PCL–ACC, PCH keeps value and
not change.
ORG 0X0100 ; The jump table is from the head of the ROM boundary
B0ADD PCL, A ; PCL = PCL + ACC, PCH + 1 when PCL overflow occurs.
JMP A0POINT ; ACC = 0, jump to A0POINT
JMP A1POINT ; ACC = 1, jump to A1POINT
JMP A2POINT ; ACC = 2, jump to A2POINT
JMP A3POINT ; ACC = 3, jump to A3POINT
SONIX provides a macro for safe jump table function. This macro will check the ROM boundary and move the jump
table to the right position automatically. The side effect of this macro maybe wastes some ROM size.
Example: If “jump table” crosses over ROM boundary will cause errors.
If the jump table position is across a ROM boundary (0x00FF~0x0100), the “@JMP_A” macro will adjust the jump table
routine begin from next RAM boundary (0x0100).
ROM address
B0MOV A, BUF0 ; “BUF0” is from 0 to 4.
@JMP_A 5 ; The number of the jump table listing is five.
0X00FD JMP A0POINT ; ACC = 0, jump to A0POINT
0X00FE JMP A1POINT ; ACC = 1, jump to A1POINT
0X00FF JMP A2POINT ; ACC = 2, jump to A2POINT
0X0100 JMP A3POINT ; ACC = 3, jump to A3POINT
0X0101 JMP A4POINT ; ACC = 4, jump to A4POINT
ROM address
B0MOV A, BUF0 ; “BUF0” is from 0 to 4.
@JMP_A 5 ; The number of the jump table listing is five.
0X0100 JMP A0POINT ; ACC = 0, jump to A0POINT
0X0101 JMP A1POINT ; ACC = 1, jump to A1POINT
0X0102 JMP A2POINT ; ACC = 2, jump to A2POINT
0X0103 JMP A3POINT ; ACC = 3, jump to A3POINT
0X0104 JMP A4POINT ; ACC = 4, jump to A4POINT
Example: The demo program shows how to calculated Checksum from 00H to the end of user’s code.
MOV A,#END_USER_CODE$L
B0MOV END_ADDR1, A ; Save low end address to end_addr1
MOV A,#END_USER_CODE$M
B0MOV END_ADDR2, A ; Save middle end address to end_addr2
CLR Y ; Set Y to 00H
CLR Z ; Set Z to 00H
@@:
MOVC
B0BSET FC ; Clear C flag
ADD DATA1, A ; Add A to Data1
MOV A, R
ADC DATA2, A ; Add R to Data2
JMP END_CHECK ; Check if the YZ address = the end of code
AAA:
INCMS Z ; Z=Z+1
JMP @B ; If Z != 00H calculate to next address
JMP Y_ADD_1 ; If Z = 00H increase Y
END_CHECK:
MOV A, END_ADDR1
CMPRS A, Z ; Check if Z = low end address
JMP AAA ; If Not jump to checksum calculate
MOV A, END_ADDR2
CMPRS A, Y ; If Yes, check if Y = middle end address
JMP AAA ; If Not jump to checksum calculate
JMP CHECKSUM_END ; If Yes checksum calculated is done.
Y_ADD_1:
INCMS Y ; Increase Y
NOP
JMP @B ; Jump to checksum calculate
CHECKSUM_END:
…
…
END_USER_CODE: ; Label of program end
The 48-byte general purpose RAM is separated into Bank 0. Sonix provides “Bank 0” type instructions (e.g. b0mov,
b0add, b0bts1, b0bset…) to control Bank 0 RAM directly.
0 1 2 3 4 5 6 7 8 9 A B C D E F
8 - - R Z Y - PFLAG - - - - - - - - -
9 - - - - - - - - - - - - - - - -
A - - - - - - - - - - - - - - - -
B - - - - - - - - P0M - - - - - - PEDGE
C P1W P1M - - - P5M - - INTRQ INTEN OSCM - WDTR TC0R PCL PCH
D P0 P1 - - - P5 - - T0M T0C TC0M TC0C BZM - - STKP
E P0UR P1UR - - - P5UR P5DR @YZ - P1OC - - - - - -
F - - - - - - - - STK3L STK3H STK2L STK2H STK1L STK1H STK0L STK0H
Note:
1. To avoid system error, make sure to put all the “0” and “1” as it indicates in the above table.
2. All of register names had been declared in SN8ASM assembler.
3. One-bit name had been declared in SN8ASM assembler with “F” prefix code.
4. “b0bset”, “b0bclr”, ”bset”, ”bclr” instructions are only available to the “R/W” registers.
2.2.2 ACCUMULATOR
The ACC is an 8-bit data register responsible for transferring or manipulating data between ALU and data memory. If
the result of operating is zero (Z) or there is carry (C or DC) occurrence, then these flags will be set to PFLAG register.
ACC is not in data memory (RAM), so ACC can’t be access by “B0MOV” instruction during the instant addressing
mode.
MOV BUF, A
MOV A, #0FH
MOV A, BUF
; or
B0MOV A, BUF
The system doesn’t store ACC and PFLAG value when interrupt executed. ACC and PFLAG data must be saved to
other data memories. “PUSH”, “POP” save and load ACC, PFLAG data into buffers.
INT_SERVICE:
PUSH ; Save ACC and PFLAG to buffers.
…
…
POP ; Load ACC and PFLAG from buffers.
Bit 5 LVD36: LVD 3.6V operating flag and only support LVD code option is LVD_H.
0 = Inactive (VDD > 3.6V).
1 = Active (VDD ≦ 3.6V).
Bit 4 LVD24: LVD 2.4V operating flag and only support LVD code option is LVD_M.
0 = Inactive (VDD > 2.4V).
1 = Active (VDD ≦ 2.4V).
Note: Refer to instruction set table for detailed information of C, DC and Z flags.
Bit 15 Bit 14 Bit 13 Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
PC - - - - - - PC9 PC8 PC7 PC6 PC5 PC4 PC3 PC2 PC1 PC0
After
- - - - - - 0 0 0 0 0 0 0 0 0 0
reset
PCH PCL
If the condition of bit test instruction is true, the PC will add 2 steps to skip next instruction.
B0BTS1 FC ; To skip, if Carry_flag = 1
JMP C0STEP ; Else jump to C0STEP.
…
…
C0STEP: NOP
If the ACC is equal to the immediate data or memory, the PC will add 2 steps to skip next instruction.
CMPRS A, #12H ; To skip, if ACC = 12H.
JMP C0STEP ; Else jump to C0STEP.
…
…
C0STEP: NOP
If the destination increased by 1, which results overflow of 0xFF to 0x00, the PC will add 2 steps to skip next
instruction.
INCS instruction:
INCS BUF0
JMP C0STEP ; Jump to C0STEP if ACC is not zero.
…
…
C0STEP: NOP
INCMS instruction:
INCMS BUF0
JMP C0STEP ; Jump to C0STEP if BUF0 is not zero.
…
…
C0STEP: NOP
If the destination decreased by 1, which results underflow of 0x01 to 0x00, the PC will add 2 steps to skip next
instruction.
DECS instruction:
DECS BUF0
JMP C0STEP ; Jump to C0STEP if ACC is not zero.
…
…
C0STEP: NOP
DECMS instruction:
DECMS BUF0
JMP C0STEP ; Jump to C0STEP if BUF0 is not zero.
…
…
C0STEP: NOP
MULTI-ADDRESS JUMPING
Users can jump around the multi-address by either JMP instruction or ADD M, A instruction (M = PCL) to activate
multi-address jumping function. Program Counter supports “ADD M,A”, ”ADC M,A” and “B0ADD M,A” instructions
for carry to PCH when PCL overflow automatically. For jump table or others applications, users can calculate PC value
by the three instructions and don’t care PCL overflow problem.
Note: PCH only support PC up counting result and doesn’t support PC down counting. When PCL is
carry after PCL+ACC, PCH adds one automatically. If PCL borrow after PCL–ACC, PCH keeps value and
not change.
; PC = 0323H
MOV A, #28H
B0MOV PCL, A ; Jump to address 0328H
…
; PC = 0328H
MOV A, #00H
B0MOV PCL, A ; Jump to address 0300H
…
; PC = 0323H
B0ADD PCL, A ; PCL = PCL + ACC, the PCH cannot be changed.
JMP A0POINT ; If ACC = 0, jump to A0POINT
JMP A1POINT ; ACC = 1, jump to A1POINT
JMP A2POINT ; ACC = 2, jump to A2POINT
JMP A3POINT ; ACC = 3, jump to A3POINT
…
…
2.2.5 Y, Z REGISTERS
The Y and Z registers are the 8-bit buffers. There are three major functions of these registers.
Can be used as general working registers
Can be used as RAM data pointers with @YZ register
Can be used as ROM data pointer with the MOVC instruction for look-up table
Example: Uses Y, Z register as the data pointer to access data in the RAM address 025H of bank0.
Example: Uses the Y, Z register as data pointer to clear the RAM data.
B0MOV Y, #0 ; Y = 0, bank 0
B0MOV Z, #07FH ; Z = 7FH, the last address of the data memory area
CLR_YZ_BUF:
CLR @YZ ; Clear @YZ to be zero
CLR @YZ
END_CLR: ; End of clear general purpose data memory area of bank 0
…
2.2.6 R REGISTER
R register is an 8-bit buffer. There are two major functions of the register.
Can be used as working register
For store high-byte data of look-up table
(MOVC instruction executed, the high-byte data of specified ROM address will be stored in R register and the
low-byte data will be stored in ACC).
Note: Please refer to the “LOOK-UP TABLE DESCRIPTION” about R register look-up table application.
Note: In immediate addressing mode application, the specific RAM must be 0x80~0x87 working register.
B0MOV A, 12H ; To get a content of RAM location 0x12 of bank 0 and save in
ACC.
B0MOV 12H, A ; To get a content of ACC and save in RAM location 12H of
bank 0.
RET / CALL /
RETI INTERRUPT
PCH PCL
Example: Stack pointer (STKP) reset, we strongly recommended to clear the stack pointers in the
beginning of the program.
MOV A, #00000011B
B0MOV STKP, A
There are Stack-Restore operations correspond to each push operation to restore the program counter (PC). The RETI
instruction uses for interrupt service routine. The RET instruction is for CALL instruction. When a pop operation occurs,
the STKP is incremented and points to the next free stack location. The stack buffer restores the last program counter
(PC) to the program counter registers. The Stack-Restore operation is as the following table.
3 RESET
3.1 OVERVIEW
The system would be reset in three conditions as following.
Power on reset
Watchdog reset
Brown out reset
External reset (only supports external reset pin enable situation)
When any reset condition occurs, all system registers keep initial status, program stops and program counter is cleared.
After reset status released, the system boots up and program starts to execute from ORG 0. The NT0, NPD flags
indicate system reset status. The system can depend on NT0, NPD status and go to different paths by program.
086H Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
PFLAG NT0 NPD LVD36 LVD24 - C DC Z
Read/Write R/W R/W R R - R/W R/W R/W
After reset - - 0 0 - 0 0 0
Finishing any reset sequence needs some time. The system provides complete procedures to make the power on reset
successful. For different oscillator types, the reset time is different. That causes the VDD rise rate and start-up time of
different oscillator is not fixed. RC type oscillator’s start-up time is very short, but the crystal type is longer. Under client
terminal application, users have to take care the power on reset time for the master terminal requirement. The reset
timing diagram is as following.
Power VSS
VDD
Power-up: System detects the power voltage up and waits for power stable.
External reset (only external reset pin enable): System checks external reset pin status. If external reset pin is
not high level, the system keeps reset status and waits external reset pin released.
System initialization: All system registers is set as initial conditions and system is ready.
Oscillator warm up: Oscillator operation is successfully and supply to system clock.
Program executing: Power on sequence is finished and program executes from ORG 0.
Watchdog timer status: System checks watchdog timer overflow status. If watchdog timer overflow occurs, the
system is reset.
System initialization: All system registers is set as initial conditions and system is ready.
Oscillator warm up: Oscillator operation is successfully and supply to system clock.
Program executing: Power on sequence is finished and program executes from ORG 0.
Before clearing watchdog timer, check I/O status and check RAM contents can improve system error.
Don’t clear watchdog timer in interrupt vector and interrupt service routine. That can improve main routine fail.
Clearing watchdog timer program is only at one part of the program. This way is the best structure to enhance the
watchdog timer function.
Note: Please refer to the “WATCHDOG TIMER” about watchdog timer detail information.
System Work
Well Area
V1
System Work
V2
V3 Error Area
VSS
Brown Out Reset Diagram
The power dropping might through the voltage range that’s the system dead-band. The dead-band means the power
range can’t offer the system minimum operation power requirement. The above diagram is a typical brown out reset
diagram. There is a serious noise under the VDD, and VDD voltage drops very deep. There is a dotted line to separate
the system working area. The above area is the system work well area. The below area is the system work error area
called dead-band. V1 doesn’t touch the below area and not effect the system operation. But the V2 and V3 is under the
below area and may induce the system error occurrence. Let system under dead-band includes some conditions.
DC application:
The power source of DC application is usually using battery. When low battery condition and MCU drive any loading,
the power drops and keeps in dead-band. Under the situation, the power won’t drop deeper and not touch the system
reset voltage. That makes the system under dead-band.
AC application:
In AC power application, the DC power is regulated from AC power source. This kind of power usually couples with AC
noise that makes the DC power dirty. Or the external loading is very heavy, e.g. driving motor. The loading operating
induces noise and overlaps with the DC power. VDD drops by the noise, and the system works under unstable power
situation.
The power on duration and power down duration are longer in AC application. The system power on sequence protects
the power on successful, but the power down situation is like DC low battery condition. When turn off the AC power,
the VDD drops slowly and through the dead-band for a while.
System Mini.
Operating Voltage.
Vdd (V)
Normal Operating
Area
Dead-Band Area
System Reset
Voltage.
Reset Area
Normally the system operation voltage area is higher than the system reset voltage to VDD, and the reset voltage is
decided by LVD detect level. The system minimum operating voltage rises when the system executing rate upper even
higher than system reset voltage. The dead-band definition is the system minimum operating voltage above the system
reset voltage.
Power On
Delay Time
The LVD (low voltage detector) is built-in Sonix 8-bit MCU to be brown out reset protection. When the VDD drops and
is below LVD detect voltage, the LVD would be triggered, and the system is reset. The LVD detect level is different by
each MCU. The LVD voltage level is a point of voltage and not easy to cover all dead-band range. Using LVD to
improve brown out reset is depend on application requirement and environment. If the power variation is very deep,
violent and trigger the LVD, the LVD can be the protection. If the power variation can touch the LVD detect level and
make system work error, the LVD can’t be the protection and need to other reset methods. More detail LVD information
is in the electrical characteristic section.
The LVD is three levels design (2.0V/2.4V/3.6V) and controlled by LVD code option. The 2.0V LVD is always enable for
power on reset and Brown Out reset. The 2.4V LVD includes LVD reset function and flag function to indicate VDD
status function. The 3.6V includes flag function to indicate VDD status. LVD flag function can be an easy low battery
detector. LVD24, LVD36 flags indicate VDD voltage level. For low battery detect application, only checking LVD24,
LVD36 status to be battery status. This is a cheap and easy solution.
Bit 5 LVD36: LVD 3.6V operating flag and only support LVD code option is LVD_H.
0 = Inactive (VDD > 3.6V).
1 = Active (VDD ≦ 3.6V).
Bit 4 LVD24: LVD 2.4V operating flag and only support LVD code option is LVD_M.
0 = Inactive (VDD > 2.4V).
1 = Active (VDD ≦ 2.4V).
LVD_L
If VDD < 2.0V, system will be reset.
Disable LVD24 and LVD36 bit of PFLAG register.
LVD_M
If VDD < 2.0V, system will be reset.
Enable LVD24 bit of PFLAG register. If VDD > 2.4V, LVD24 is “0”. If VDD ≦2.4V, LVD24 flag is “1”.
Disable LVD36 bit of PFLAG register.
LVD_H
If VDD < 2.4V, system will be reset.
Enable LVD24 bit of PFLAG register. If VDD > 2.4V, LVD24 is “0”. If VDD ≦2.4V, LVD24 flag is “1”.
Enable LVD36 bit of PFLAG register. If VDD > 3.6V, LVD36 is “0”. If VDD ≦3.6V, LVD36 flag is “1”.
LVD_MAX
If VDD < 3.6V, system will be reset.
Note:
1. After any LVD reset, LVD24, LVD36 flags are cleared.
2. The voltage level of LVD 2.4V or 3.6V is for design reference only. Don’t use the LVD indicator as
precision VDD measurement.
LVD reset
Watchdog reset
Reduce the system executing rate
External reset circuit. (Zener diode reset circuit, Voltage bias reset circuit, External reset IC)
Note:
1. The “ Zener diode reset circuit”, “Voltage bias reset circuit” and “External reset IC” can completely
improve the brown out reset, DC low battery and AC slow power down conditions.
2. For AC power application and enhance EFT performance, the system clock is 4MHz/4 (1 mips) and
use external reset (“ Zener diode reset circuit”, “Voltage bias reset circuit”, “External reset IC”).
The structure can improve noise effective and get good EFT characteristic.
Watchdog reset:
The watchdog timer is a protection to make sure the system executes well. Normally the watchdog timer would be clear
at one point of program. Don’t clear the watchdog timer in several addresses. The system executes normally and the
watchdog won’t reset system. When the system is under dead-band and the execution error, the watchdog timer can’t
be clear by program. The watchdog is continuously counting until overflow occurrence. The overflow signal of
watchdog timer triggers the system to reset, and the system return to normal mode after reset sequence. This method
also can improve brown out reset condition and make sure the system to return normal mode.
If the system reset by watchdog and the power is still in dead-band, the system reset sequence won’t be successful
and the system stays in reset status until the power return to normal range. Watchdog timer application note is as
following.
External reset (only external reset pin enable): System checks external reset pin status. If external reset pin is
not high level, the system keeps reset status and waits external reset pin released.
System initialization: All system registers is set as initial conditions and system is ready.
Oscillator warm up: Oscillator operation is successfully and supply to system clock.
Program executing: Power on sequence is finished and program executes from ORG 0.
The external reset can reset the system during power on duration, and good external reset circuit can protect the
system to avoid working at unusual power condition, e.g. brown out reset in AC power application…
VDD
R1
47K ohm
R2
100 ohm
RST
MCU
C1
0.1uF
VSS
VCC
GND
This is the basic reset circuit, and only includes R1 and C1. The RC circuit operation makes a slow rising signal into
reset pin as power up. The reset signal is slower than VDD power up timing, and system occurs a power on signal from
the timing difference.
Note: The reset circuit is no any protection against unusual power or brown out reset.
DIODE R1
47K ohm
R2
100 ohm
RST
MCU
C1
0.1uF
VSS
VCC
GND
This is the better reset circuit. The R1 and C1 circuit operation is like the simply reset circuit to make a power on signal.
The reset circuit has a simply protection against unusual power. The diode offers a power positive path to conduct
higher power to VDD. It is can make reset pin voltage level to synchronize with VDD voltage. The structure can
improve slight brown out reset condition.
Note: The R2 100 ohm resistor of “Simply reset circuit” and “Diode & RC reset circuit” is necessary to
limit any current flowing into reset pin from external capacitor C in the event of reset pin breakdown due
to Electrostatic Discharge (ESD) or Electrical Over-stress (EOS).
R1
33K ohm E
R2
B
Q1
10K ohm
C RST
MCU
Vz
R3
40K ohm
VSS
VCC
GND
The zener diode reset circuit is a simple low voltage detector and can improve brown out reset condition
completely. Use zener voltage to be the active level. When VDD voltage level is above “Vz + 0.7V”, the C terminal of
the PNP transistor outputs high voltage and MCU operates normally. When VDD is below “Vz + 0.7V”, the C terminal of
the PNP transistor outputs low voltage and MCU is in reset mode. Decide the reset detect voltage by zener
specification. Select the right zener voltage to conform the application.
R2
C RST
MCU
10K ohm R3
2K ohm
VSS
VCC
GND
The voltage bias reset circuit is a low cost voltage detector and can improve brown out reset condition completely.
The operating voltage is not accurate as zener diode reset circuit. Use R1, R2 bias voltage to be the active level. When
VDD voltage level is above or equal to “0.7V x (R1 + R2) / R1”, the C terminal of the PNP transistor outputs high
voltage and MCU operates normally. When VDD is below “0.7V x (R1 + R2) / R1”, the C terminal of the PNP transistor
outputs low voltage and MCU is in reset mode.
Decide the reset detect voltage by R1, R2 resistances. Select the right R1, R2 value to conform the application. In the
circuit diagram condition, the MCU’s reset pin level varies with VDD voltage variation, and the differential voltage is
0.7V. If the VDD drops and the voltage lower than reset pin detect level, the system would be reset. If want to make the
reset active earlier, set the R2 > R1 and the cap between VDD and C terminal voltage is larger than 0.7V. The external
reset circuit is with a stable current through R1 and R2. For power consumption issue application, e.g. DC power
system, the current must be considered to whole system power consumption.
Note: Under unstable power condition as brown out reset, “Zener diode rest circuit” and “Voltage bias
reset circuit” can protects system no any error occurrence as power dropping. When power drops below
the reset detect voltage, the system reset would be triggered, and then system executes reset sequence.
That makes sure the system work well under unstable power situation.
Bypass
Capacitor
VDD 0.1uF
Reset
IC
RST RST MCU
VSS
VSS
VCC
GND
The external reset circuit also use external reset IC to enhance MCU reset performance. This is a high cost and good
effect solution. By different application and system requirement to select suitable reset IC. The reset circuit can
improve all power variation.
4 SYSTEM CLOCK
4.1 OVERVIEW
The micro-controller is a dual clock system including high-speed and low-speed clocks. The high-speed clock includes
internal high-speed oscillator and external oscillators selected by “High_CLK” code option. The low-speed clock is from
internal low-speed oscillator controlled by “CLKMD” bit of OSCM register. Both high-speed clock and low-speed clock
can be system clock source through a divider to decide the system clock rate.
High-speed oscillator
Internal high-speed oscillator is 16MHz RC type called “IHRC”.
External high-speed oscillator includes crystal/ceramic (4MHz, 12MHz, 32KHz) and RC type.
Low-speed oscillator
Internal low-speed oscillator is 16KHz @3V, 32KHz @5V RC type called “ILRC”.
Fosc
XIN Fcpu = Fhosc/1 ~ Fhosc/128, Noise Filter Disable.
Fhosc.
XOUT Fcpu = Fhosc/4 ~ Fhosc/128, Noise Filter Enable.
Fcpu
Fosc
CPUM[1:0]
SONIX provides a “Noise Filter” controlled by code option. In high noisy situation, the noise filter can isolate noise
outside and protect system works well. The minimum Fcpu of high clock is limited at Fhosc/4 when noise filter enable.
In high noisy environment, enable “Noise_Filter” code option is the strongly recommendation to reduce noise
effect.
IHRC_16M: The system high-speed clock source is internal high-speed 16MHz RC type oscillator. In the mode,
XIN and XOUT pins are bi-direction GPIO mode, and not to connect any external oscillator device.
IHRC_RTC: The system high-speed clock source is internal high-speed 16MHz RC type oscillator. The RTC
clock source is external low-speed 32768Hz crystal. The XIN and XOUT pins are defined to drive external
32768Hz crystal and disables GPIO function.
RC: The system high-speed clock source is external low cost RC type oscillator. The RC oscillator circuit only
connects to XIN pin, and the XOUT pin is bi-direction GPIO mode.
32K X’tal: The system high-speed clock source is external low-speed 32768Hz crystal. The option only supports
32768Hz crystal and the RTC function is workable.
12M X’tal: The system high-speed clock source is external high-speed crystal/ceramic. The oscillator bandwidth
is 10MHz~16MHz.
4M X’tal: The system high-speed clock source is external high-speed crystal/resonator. The oscillator bandwidth
is 1MHz~10MHz.
For power consumption under “IHRC_RTC” mode, the internal high-speed oscillator and internal low–speed oscillator
stops and only external 32KHz crystal actives under green mode. The condition is the watchdog timer can’t be
“Always_On” option, or the internal low-speed oscillator actives.
IHRC_16M: The system high-speed clock is internal 16MHz oscillator RC type. XIN/XOUT pins are general
purpose I/O pins.
IHRC_RTC: The system high-speed clock is internal 16MHz oscillator RC type, and the real time clock is external
32768Hz crystal. XIN/XOUT pins connect with external 32768Hz crystal.
CRYSTAL/CERAMIC RC Type
XOUT
XIN XIN
VCC
VCC
GND
GND
Note: Connect the Crystal/Ceramic and C as near as possible to the XIN/XOUT/VSS pins of
micro-controller. Connect the R and C as near as possible to the VDD pin of micro-controller.
45.00
40.00 40.80
38.08
35.00 35.40
Freq. (KHz)
32.52
30.00 29.20
25.96
25.00
22.24 ILRC
20.00 18.88
17.24
16.00
15.00 14.72
10.00 10.64
7.52
5.00
0.00
2.1 2.5 3 3.1 3.3 3.5 4 4.5 5 5.5 6 6.5 7
VDD (V)
The internal low RC supports watchdog clock source and system slow mode controlled by “CLKMD” bit of OSCM
register.
There are two conditions to stop internal low RC. One is power down mode, and the other is green mode of 32K mode
and watchdog disable. If system is in 32K mode and watchdog disable, only 32K oscillator actives and system is under
low power consumption.
Note: The internal low-speed clock can’t be turned off individually. It is controlled by CPUM0, CPUM1
(32K, watchdog disable) bits of OSCM register.
“STPHX” bit controls internal high speed RC type oscillator and external oscillator operations. When “STPHX=0”, the
external oscillator or internal high speed RC type oscillator active. When “STPHX=1”, the external oscillator or internal
high speed RC type oscillator are disabled. The STPHX function is depend on different high clock options to do
different controls.
B0BSET P0M.0 ; Set P0.0 to be output mode for outputting Fcpu toggle signal.
@@:
B0BSET P0.0 ; Output Fcpu toggle signal in low-speed clock mode.
B0BCLR P0.0 ; Measure the Fcpu frequency by oscilloscope.
JMP @B
Note: Do not measure the RC frequency directly from XIN; the probe impendence will affect the RC
frequency.
Vdd Vp
Power On Reset
Flag
Oscillator
Tcfg Tost Tosp
Fcpu
(Instruction Cycle)
External Reset
Flag
Oscillator
Tcfg Tost Tosp
Fcpu
(Instruction Cycle)
System is under reset
status.
Oscillator
Tcfg Tost Tosp
Fcpu
(Instruction Cycle)
Wake-up Pin
Rising Edge
Oscillator
Tost
Tosp
Fcpu
(Instruction Cycle)
Wake-up Pin
Rising Edge
Timer overflow.
Timer ... 0xFD 0xFE 0xFF 0x00 0x01 0x02 ... ... ... ... ...
Oscillator
Fcpu
(Instruction Cycle)
RC Oscillator
Tost
Ceramic/Resonator
Tost
Crystal
Tost
5.1 OVERVIEW
The chip builds in four operating mode for difference clock rate and power saving reason. These modes control
oscillators, op-code operation and analog peripheral devices’ operation.
Wake-up condition:
P0, P1 input status is level changing. Power Down Mode
CLKMD = 1
Reset Control Block Normal Mode CLKMD = 0 Slow Mode
Note: If the system is in normal mode, to set STPHX=1 to disable the high clock oscillator. The system is
under no system clock condition. This condition makes the system stay as power down mode, and can
be wake-up by P0, P1 level change trigger.
Note: Sonix provides “GreenMode” macro to control green mode operation. It is necessary to use
“GreenMode” macro to control system inserting green mode.
The macro includes three instructions. Please take care the macro length as using BRANCH type
instructions, e.g. bts0, bts1, b0bts0, b0bts1, ins, incms, decs, decms, cmprs, jmp, or the routine would
be error.
Example: Switch slow mode to normal mode (The external high-speed oscillator stops).
Example: Switch normal/slow mode to green mode and enable T0 wake-up function.
Example: Switch normal/slow mode to green mode and enable T0 wake-up function with RTC.
5.7 WAKEUP
5.7.1 OVERVIEW
Under power down mode (sleep mode) or green mode, program doesn’t execute. The wakeup trigger can wake the
system up to normal mode or slow mode. The wakeup trigger sources are external trigger (P0/P1 level change) and
internal trigger (T0 timer overflow).
Power down mode is waked up to normal mode. The wakeup trigger is only external trigger (P0/P1 level change)
Green mode is waked up to last mode (normal mode or slow mode). The wakeup triggers are external trigger
(P0/P1 level change) and internal trigger (T0 timer overflow).
Note: Wakeup from green mode is no wakeup time because the clock doesn’t stop in green mode.
The value of the internal high clock oscillator RC type wakeup time is as the following.
Example: In power down mode (sleep mode), the system is waked up. After the wakeup time, the system
goes into normal mode. The wakeup time is as the following.
Note: The high clock start-up time is depended on the VDD and oscillator type of high clock.
6 INTERRUPT
6.1 OVERVIEW
This MCU provides three interrupt sources, including two internal interrupt (T0/TC0) and one external interrupt (INT0).
The external interrupt can wakeup the chip while the system is switched from power down mode to high-speed normal
mode. Once interrupt service is executed, the GIE bit in STKP register will clear to “0” for stopping other interrupt
request. On the contrast, when interrupt service exits, the GIE bit will set to “1” to accept the next interrupts’ request. All
of the interrupt request signals are stored in INTRQ register.
Note: The GIE bit must enable during all interrupt operation.
Note: The GIE bit must enable during all interrupt operation.
Note: ”PUSH”, “POP” instructions save and load ACC/PFLAG without (NT0, NPD). PUSH/POP buffer is
an unique buffer and only one level.
Example: Store ACC and PAFLG data by PUSH, POP instructions when interrupt service routine
executed.
ORG 0
JMP START
ORG 8
JMP INT_SERVICE
ORG 10H
START:
…
INT_SERVICE:
PUSH ; Save ACC and PFLAG to buffers.
…
…
POP ; Load ACC and PFLAG from buffers.
The external interrupt builds in wake-up latch function. That means when the system is triggered wake-up from power
down mode, the wake-up source is external interrupt source (P0.0), and the trigger edge direction matches interrupt
edge configuration, the trigger edge will be latched, and the system executes interrupt service routine fist after
wake-up.
For multi-interrupt conditions, two things need to be taking care of. One is to set the priority for these interrupt requests.
Two is using IEN and IRQ flags to decide which interrupt to be executed. Users have to check interrupt control bit and
interrupt request flag in interrupt routine.
7 I/O PORT
7.1 OVERVIEW
The micro-controller builds in 16 pin I/O. Most of the I/O pins are mixed with analog pins and special function pins. The
I/O shared pin list is as following.
* DC: Digital Characteristic. AC: Analog Characteristic. HV: High Voltage Characteristic.
Note:
Users can program them by bit control instructions (B0BSET, B0BCLR).
P1.5 input only pin, and the P1M.5 is undefined.
Note: P1.5 is input only pin and without pull-up resister. The P1UR.5 is undefined.
Note: The P15 keeps “1” when external reset enable by code option.
8 TIMERS
8.1 WATCHDOG TIMER
The watchdog timer (WDT) is a binary up counter designed for monitoring program execution. If the program goes into
the unknown status by noise interference, WDT overflow signal raises and resets MCU. Watchdog clock controlled by
code option and the clock source is internal low-speed oscillator.
The watchdog timer has three operating options controlled “WatchDog” code option.
In high noisy environment, the “Always_On” option of watchdog operations is the strongly recommendation
to make the system reset under error situations and re-start again.
Watchdog clear is controlled by WDTR register. Moving 0x5A data into WDTR is to reset watchdog timer.
Example: An operation of watchdog timer is as following. To clear the watchdog timer counter in the top
of the main routine of the program.
Main:
MOV A, #5AH ; Clear the watchdog timer.
B0MOV WDTR, A
…
CALL SUB1
CALL SUB2
…
JMP MAIN
Main:
@RST_WDT ; Clear the watchdog timer.
…
CALL SUB1
CALL SUB2
…
JMP MAIN
Before clearing watchdog timer, check I/O status and check RAM contents can improve system error.
Don’t clear watchdog timer in interrupt vector and interrupt service routine. That can improve main routine fail.
Clearing watchdog timer program is only at one part of the program. This way is the best structure to enhance the
watchdog timer function.
Example: An operation of watchdog timer is as following. To clear the watchdog timer counter in the top
of the main routine of the program.
Main:
… ; Check I/O.
… ; Check RAM
Err: JMP $ ; I/O or RAM error. Program jump here and don’t
; clear watchdog. Wait watchdog timer overflow to reset IC.
Correct: ; I/O and RAM are correct. Clear watchdog timer and
; execute program.
MOV A, #5AH ; Clear the watchdog timer.
B0MOV WDTR, A
…
CALL SUB1
CALL SUB2
…
…
…
JMP MAIN
8-bit programmable up counting timer: Generate time-out at specific time intervals based on the selected clock
frequency.
Interrupt function: T0 timer function supports interrupt function. When T0 timer occurs overflow, the T0IRQ
actives and the system points program counter to interrupt vector to do interrupt sequence.
RTC function: T0 supports RTC function. The RTC clock source is from external low speed 32K oscillator when
T0TB=1. RTC function is only available in High_Clk code option = "IHRC_RTC".
Green mode function: T0 timer keeps running in green mode and wakes up system when T0 timer overflows.
T0 Rate
Load T0C Value by Program.
(Fcpu/2~Fcpu/256) T0ENB
T0TB
Fcpu
T0C 8-Bit Binary Up Counting Counter
RTC
T0ENB
Note: In RTC mode, the T0 interval time is fixed at 0.5 sec and T0C is 256 counts.
Clock
... ...
Source
T0IRQ
T0 clock source is Fcpu (instruction cycle) through T0rate[2:0] pre-scaler to decide Fcpu/2~Fcpu/256. T0 length is 8-bit
(256 steps), and the one count period is each cycle of input clock.
T0 Interval Time
Fhosc=16MHz, Fhosc=4MHz,
IHRC_RTC mode
T0rate[2:0] T0 Clock Fcpu=Fhosc/4 Fcpu=Fhosc/4
max.
max. (ms) Unit (us) max. (ms) Unit (us) Unit (ms)
(sec)
000b Fcpu/256 16.384 64 65.536 256 - -
001b Fcpu/128 8.192 32 32.768 128 - -
010b Fcpu/64 4.096 16 16.384 64 - -
011b Fcpu/32 2.048 8 8.192 32 - -
100b Fcpu/16 1.024 4 4.096 16 - -
101b Fcpu/8 0.512 2 2.048 8 - -
110b Fcpu/4 0.256 1 1.024 4 - -
111b Fcpu/2 0.128 0.5 0.512 2 - -
- 32768Hz/64 - - - - 0.5 1.953
Note: T0RATE is not available in RTC mode. The T0 interval time is fixed at 0.5 sec.
T0C initial value = 256 - (T0 interrupt interval time * T0 clock rate)
Example: To calculation T0C to obtain 10ms T0 interval time. T0 clock source is Fcpu = 4MHz/4 = 1MHz.
Select T0RATE=001 (Fcpu/128).
T0 interval time = 10ms. T0 clock rate = 4MHz/4/128
Note: In RTC mode, T0C is 256 counts and generatesT0 0.5 sec interval time. Don’t change T0C value in
RTC mode.
T0 TIMER CONFIGURATION:
; Reset T0 timer.
MOV A, #0x00 ; Clear T0M register.
B0MOV T0M, A
; Clear T0IRQ
B0BCLR FT0IRQ
; Clear T0C.
CLR T0C
; Clear T0IRQ
B0BCLR FT0IRQ
8-bit programmable up counting timer: Generate time-out at specific time intervals based on the selected clock
frequency.
Interrupt function: TC0 timer function supports interrupt function. When TC0 timer occurs overflow, the TC0IRQ
actives and the system points program counter to interrupt vector to do interrupt sequence.
Event Counter: The event counter function counts the external clock counts.
PWM output: The PWM is duty/cycle programmable controlled by T0rate and TC0R registers.
Buzzer output: The Buzzer output signal is 1/2 cycle of TC0 interval time.
Green mode function: All TC0 functions (timer, PWM, Buzzer, event counter, auto-reload) keep running in green
mode and no wake-up function.
TC0OUT
Up Counting ALOAD0
Reload Value
Buzzer
Auto. Reload
TC0 Time Out TC0 / 2 P5.4
TC0R Reload
ALOAD0, TC0OUT
Data Buffer
TC0 Rate
(Fcpu/2~Fcpu/256) R PWM0OUT
PWM
Compare
TC0CKS TC0ENB
Fcpu S
Load
TC0C
8-Bit Binary Up TC0 Time Out
Counting Counter
INT0
(Schmitter Trigger)
CPUM0,1
Clock
... ...
Source
0x00
TC0C 0x01 0x02 0x03 ... 0xFE 0xFF TC0R ...
or TC0R
TC0IRQ
TC0 provides different clock sources to implement different applications and configurations. TC0 clock source includes
Fcpu (instruction cycle) and external input pin (P0.0) controlled by TC0CKS bits. TC0CKS bit selects the clock source
is from Fcpu or external input pin. If TC0CKS=0, TC0 clock source is Fcpu through TC0rate[2:0] pre-scaler to decide
Fcpu/2~Fcpu/256. If TC0CKS=1, TC0 clock source is external input pin that means to enable event counter function.
TC0rate[2:0] pre-scaler is unless when TC0CKS=1 condition. TC0 length is 8-bit (256 steps) when PWM disabled, and
the one count period is each cycle of input clock.
Bit 1 TC0OUT: TC0 time out toggle signal output control bit. Only valid when PWM0OUT = 0.
0 = Disable, P5.4 is I/O function.
1 = Enable, P5.4 is output TC0OUT signal.
Note: When TC0CKS=1, TC0 became an external event counter and TC0RATE is useless. No more P0.0
interrupt request will be raised. (P0.0IRQ will be always 0).
TC0C initial value = N - (TC0 interrupt interval time * TC0 clock rate)
N is TC0 overflow boundary number. TC0 timer overflow time has five types (TC0 timer, TC0 event counter, TC0 Fcpu
clock source, PWM mode and no PWM mode). These parameters decide TC0 overflow time and valid value as follow
table.
TC0R initial value = 256 - (TC0 interrupt interval time * TC0 clock rate)
N is TC0 overflow boundary number. TC0 timer overflow time has five types (TC0 timer, TC0 event counter, TC0 Fcpu
clock source, PWM mode and no PWM mode). These parameters decide TC0 overflow time and valid value as follow
table.
Example: To calculation TC0C and TC0R value to obtain 10ms TC0 interval time. TC0 clock source is
Fcpu = 4MHz/4 = 1MHz. Select TC0RATE=001 (Fcpu/128).
TC0 interval time = 10ms. TC0 clock rate = 4MHz/4/128
0x00
TC0C 0x01 0x02 0x03 ... 0xFE 0xFF TC0R ...
or TC0R
TC0IRQ
TC0IRQ ...
When buzzer outputs, TC0IRQ still actives as TC0 overflows, and TC0 interrupt function actives as TC0IEN = 1. But
strongly recommend be careful to use buzzer and TC0 timer together, and make sure both functions work well.
The buzzer output pin is shared with GPIO and switch to output buzzer signal as TC0OUT=1 automatically. If TC0OUT
bit is cleared to disable buzzer signal, the output pin exchanges to last GPIO mode automatically. It easily to implement
carry signal on/off operation, not to control TC0ENB bit.
Buzzer Output
TC0OUT=0. TC0OUT=1. The pin exchanges to output TC0OUT=0. The pin exchanges TC0OUT=1.
mode and outputs Buzzer signal to last GPIO mode (output low).
automatically.
Buzzer Output
TC0OUT=0. TC0OUT=1. The pin exchanges to output TC0OUT=0. The pin exchanges TC0OUT=1.
mode and outputs Buzzer signal to last GPIO mode (output high).
automatically.
TC0OUT=0. TC0OUT=1. The pin exchanges to output TC0OUT=0. The pin exchanges TC0OUT=1.
mode and outputs Buzzer signal to last GPIO mode (input).
automatically.
Note: Because the TC0OUT decides the PWM cycle in PWM mode. The PWM0OUT bit must be “0” when
buzzer output function works.
TC0R TC0R
0x00 0x01 0x02 ...
-1
TC0R
+1
... 0xFD 0xFE 0xFF 0x00 0x01 0x02 ...
TC0C
PWM Output
The resolution of PWM includes 1/256, 1/64, 1/32, 1/16 controlled by ALOAD0 and TC0OUT bits to implement high
speed PWM signal. ALOAD0, TC0OUT = 00, the PWM resolution is 1/256. ALOAD0, TC0OUT = 01, the PWM
resolution is 1/64. ALOAD0, TC0OUT = 10, the PWM resolution is 1/32. ALOAD0, TC0OUT = 11, the PWM resolution
is 1/16. If modify the PWM resolution, the TC0R PWM duty control range must be modified to meet resolution. When
PWM outputs, TC0IRQ still actives as TC0 overflows, and TC0 interrupt function actives as TC0IEN = 1. But strongly
recommend be careful to use PWM and TC0 timer together, and make sure both functions work well.
1/256 Duty
1/64 Duty
1/32 Duty
1/16 Duty
The PWM output pin is shared with GPIO and switch to output PWM signal as PWM0OUT=1 automatically. If
PWM0OUT bit is cleared to disable PWM, the output pin exchanges to last GPIO mode automatically. It easily to
implement carry signal on/off operation, not to control TC0ENB bit.
PWM Output
PWM0OUT=0. PWM0OUT=1. The pin exchanges to output PWM0OUT=0. The pin exchanges PWM0OUT=1.
mode and outputs PWM signal automatically. to last GPIO mode (output low).
PWM Output
PWM0OUT=0. PWM0OUT=1. The pin exchanges to output PWM0OUT=0. The pin exchanges PWM0OUT=1.
mode and outputs PWM signal automatically. to last GPIO mode (output high).
PWM0OUT=0. PWM0OUT=1. The pin exchanges to output PWM0OUT=0. The pin exchanges PWM0OUT=1.
mode and outputs PWM signal automatically. to last GPIO mode (input).
; Clear TC0IRQ
B0BCLR FTC0IRQ
; Clear TC0IRQ
B0BCLR FTC0IRQ
Fcpu/256 Pin
Fcpu/512
Fcpu
Fcpu/1024
Fcpu/2048
BZEN
The buzzer frequency is divided from Fcpu (instruction cycle) controlled by BZrate bits, and Fcpu decides the buzzer
frequency. The selection table is as following.
The buzzer target frequency is 2KHz and 4KHz. It is important to choice a good Fcpu rate to obtain the correct buzzer
frequency. The above table shows 2KHz/4KHz buzzer frequency configurations.
Note:
1. If BZEN=0, the buzzer output pin is GPIO mode and returns to last status after disabling buzzer
output.
2. If BZEN=1, the buzzer output pin is buzzer output function and isolates the GPIO function.
10 INSTRUCTION TABLE
Field Mnemonic Description C DC Z Cycle
MOV A,M AM - - 1
M MOV M,A MA - - - 1
O B0MOV A,M A M (bank 0) - - 1
V B0MOV M,A M (bank 0) A - - - 1
E MOV A,I AI - - - 1
B0MOV M,I M I, “M” only supports 0x80~0x87 registers (e.g. PFLAG,R,Y,Z…) - - - 1
XCH A,M A M - - - 1+N
B0XCH A,M A M (bank 0) - - - 1+N
MOVC R, A ROM [Y,Z] - - - 2
ADC A,M A A + M + C, if occur carry, then C=1, else C=0 1
A ADC M,A M A + M + C, if occur carry, then C=1, else C=0 1+N
R ADD A,M A A + M, if occur carry, then C=1, else C=0 1
I ADD M,A M A + M, if occur carry, then C=1, else C=0 1+N
T B0ADD M,A M (bank 0) M (bank 0) + A, if occur carry, then C=1, else C=0 1+N
H ADD A,I A A + I, if occur carry, then C=1, else C=0 1
M SBC A,M A A - M - /C, if occur borrow, then C=0, else C=1 1
E SBC M,A M A - M - /C, if occur borrow, then C=0, else C=1 1+N
T SUB A,M A A - M, if occur borrow, then C=0, else C=1 1
I SUB M,A M A - M, if occur borrow, then C=0, else C=1 1+N
C SUB A,I A A - I, if occur borrow, then C=0, else C=1 1
AND A,M A A and M - - 1
L AND M,A M A and M - - 1+N
O AND A,I A A and I - - 1
G OR A,M A A or M - - 1
I OR M,A M A or M - - 1+N
C OR A,I A A or I - - 1
XOR A,M A A xor M - - 1
XOR M,A M A xor M - - 1+N
XOR A,I A A xor I - - 1
SWAP M A (b3~b0, b7~b4) M(b7~b4, b3~b0) - - - 1
P SWAPM M M(b3~b0, b7~b4) M(b7~b4, b3~b0) - - - 1+N
R RRC M A RRC M - - 1
O RRCM M M RRC M - - 1+N
C RLC M A RLC M - - 1
E RLCM M M RLC M - - 1+N
S CLR M M0 - - - 1
S BCLR M.b M.b 0 - - - 1+N
BSET M.b M.b 1 - - - 1+N
B0BCLR M.b M(bank 0).b 0 - - - 1+N
B0BSET M.b M(bank 0).b 1 - - - 1+N
CMPRS A,I ZF,C A - I, If A = I, then skip next instruction - 1+S
B CMPRS A,M ZF,C A – M, If A = M, then skip next instruction - 1+S
R INCS M A M + 1, If A = 0, then skip next instruction - - - 1+ S
A INCMS M M M + 1, If M = 0, then skip next instruction - - - 1+N+S
N DECS M A M - 1, If A = 0, then skip next instruction - - - 1+ S
C DECMS M M M - 1, If M = 0, then skip next instruction - - - 1+N+S
H BTS0 M.b If M.b = 0, then skip next instruction - - - 1+S
BTS1 M.b If M.b = 1, then skip next instruction - - - 1+S
B0BTS0 M.b If M(bank 0).b = 0, then skip next instruction - - - 1+S
B0BTS1 M.b If M(bank 0).b = 1, then skip next instruction - - - 1+S
JMP d PC15/14 RomPages1/0, PC13~PC0 d - - - 2
CALL d Stack PC15~PC0, PC15/14 RomPages1/0, PC13~PC0 d - - - 2
M RET PC Stack - - - 2
I RETI PC Stack, and to enable global interrupt - - - 2
S PUSH To push ACC and PFLAG (except NT0, NPD bit) into buffers. - - - 1
C POP To pop ACC and PFLAG (except NT0, NPD bit) from buffers. 1
NOP No operation - - - 1
Note: 1. “M” is system register or RAM. If “M” is system registers then “N” = 0, otherwise “N” = 1.
2. If branch condition is true then “S = 1”, otherwise “S = 0”.
11 ELECTRICAL CHARACTERISTIC
11.1 ABSOLUTE MAXIMUM RATING
Supply voltage (Vdd)…………………………………………………………………………………………………………………….……………… - 0.3V ~ 6.0V
Input in voltage (Vin)…………………………………………………………………………………………………………………….… Vss – 0.2V ~ Vdd + 0.2V
Operating ambient temperature (Topr)
SN8P2602CP, SN8P2602CS, SN8P2602CX …………………………………………………………………………………………….. 0C ~ + 70C
SN8P2602CPD, SN8P2602CSD, SN8P2602CXD ………………………………………………………………………………………. –40C ~ + 85C
Storage ambient temperature (Tstor) ………………………………………………………………….………………………………………… –40C ~ + 125C
12 DEVELOPMENT TOOL
SONIX provides ICE (in circuit emulation), IDE (Integrated Development Environment) and EV-kit for SN8P2602C
development. ICE and EV-kit are external hardware devices, and IDE is a friendly user interface for firmware
development and emulation. These development tools’ version is as following.
ICE: SN8ICE2K Plus II. (Please install 16MHz crystal in ICE to implement IHRC emulation.)
ICE emulation speed maximum: 8 MIPS @ 5V (e.g. 16Mhz crystal, Fcpu = Fosc/2)
EV-kit: EV2602C KIT REV: V1.0.
IDE: SONiX IDE M2IDE_V129 and later version.
Writer: MPIII writer.
Writer transition board: SN8P2602C
CON2: Connect to SN8ICE2K Plus II CON1 (includes GPIO, EV-KIT control signal, and the others).
CON1: Connect to SN8ICE2K Plus II JP3 (EV-KIT communication bus with ICE, control signal, and the others).
S1: LVD24V / LVD36V control switch. To emulate LVD2.4V flag / reset function and LVD3.6V / flag function.
48 Pin 48
40
40
28
28
18
18
14
Pin 25
Pin 24
14 Marking Definition
14.1 INTRODUCTION
There are many different types in Sonix 8-bit MCU production line. This note listed the production definition of all 8-bit
MCU for order or obtain information. This definition is only for Blank OTP MCU.
Temperature - = 0 ~ 70
D = -40 ~ 85
Range
Device 2602C
PB-Free Package:
Name ROM Type Device Package Temperature Material
SN8P2602CPB OTP 2602C P-DIP 0℃~70℃ PB-Free Package
SN8P2602CSB OTP 2602C SOP 0℃~70℃ PB-Free Package
SN8P2602CXB OTP 2602C SSOP 0℃~70℃ PB-Free Package
SN8P2602CPDB OTP 2602C P-DIP -40℃~85℃ PB-Free Package
SN8P2602CSDB OTP 2602C SOP -40℃~85℃ PB-Free Package
SN8P2602CXDB OTP 2602C SOP -40℃~85℃ PB-Free Package
1=01
Day
2=02
....
9=09
A=10
B=11
....
Month 1=January
2=February
....
9=September
A=October
B=November
C=December
15 PACKAGE INFORMATION
15.1 P-DIP 18 PIN
SONIX reserves the right to make change without further notice to any products herein to improve reliability, function or
design. SONIX does not assume any liability arising out of the application or use of any product or circuit described herein;
neither does it convey any license under its patent rights nor the rights of others. SONIX products are not designed,
intended, or authorized for us as components in systems intended, for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SONIX product could create a
situation where personal injury or death may occur. Should Buyer purchase or use SONIX products for any such
unintended or unauthorized application. Buyer shall indemnify and hold SONIX and its officers , employees, subsidiaries,
affiliates and distributors harmless against all claims, cost, damages, and expenses, and reasonable attorney fees arising
out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use
even if such claim alleges that SONIX was negligent regarding the design or manufacture of the part.
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Address: 10F-1, NO.36, Taiyuan Street, Chupei City, Hsinchu, Taiwan R.O.C.
Tel: 886-3-560 0888
Fax: 886-3-560 0889
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Technical Support by Email:
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