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WEEK-3 1. Component Package Types

The document discusses different types of component packages and PCB design considerations. It describes through-hole and surface-mount packages, as well as ball grid array (BGA) and fine-pitch packages. It also covers PCB trace width calculation and factors to consider like current, location, and thickness. Finally, it discusses types of planes in PCB design like ground, power, and signal planes and their purposes.

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82 views

WEEK-3 1. Component Package Types

The document discusses different types of component packages and PCB design considerations. It describes through-hole and surface-mount packages, as well as ball grid array (BGA) and fine-pitch packages. It also covers PCB trace width calculation and factors to consider like current, location, and thickness. Finally, it discusses types of planes in PCB design like ground, power, and signal planes and their purposes.

Uploaded by

NAVEEN
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as DOCX, PDF, TXT or read online on Scribd
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WEEK-3

1. COMPONENT PACKAGE TYPES


 Product designers have been exploring new component packages to increase the functionality and
reducing the size & cost of the manufacturing.
Different package types:
1. Through – Hole
2. Surface – Mount
3. FPGA
4. BGA
5. Fine – Pitch
6. QFT
7. TFP
8. Press Fit

1. Through – Hole Packages


 Through-hole technology refers to assemblies having components with leads that are inserted into holes
in the circuit board and soldered into place.
 Examples: Single inline Package (SIP), Dual inline Package (DIP), Axial leaded components, Radial
leaded components

Single inline Package (SIP) Dual inline Package (DIP)

Axial leaded components Radial


leaded components

Advantage of through hole technology


 Creates a stronger bond between components and the board
Disadvantage of through hole technology
 Takes more space on the PCB
 Need to drill multiple holes through the board.
 Lengthens production time and increases production costs.

2. Surface – Mount Packages


 Surface-mount technology refers to assemblies that have components soldered to pads on the surfaces of
the circuit board.
Advantages of surface-mount technology
 Surface mount components require less space So SMT is helpful in product miniaturization.
 Cost effective than through hole components.
 Faster assembly
Disadvantages of SMT:
 Easy to broken.
 Components are easy to be dropped or damaged when installed.
 All the components are not available in SMT.

3. Ball grid Array (BGA) Package


 A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated
circuits.
 BGA packages are used to permanently mount devices such as microprocessors, memories. BGA
packaging is more useful for high frequency PCB design.
Advantages
 High density
 Heat conduction
Disadvantages
 Lack of compliance
 Difficulty of inspection
 Difficulties during circuit development
 Cost of equipment

4. Field Programmable Gate Array (FPGA)


 A field-programmable gate array (FPGA) is an integrated circuit designed to be configured by a
customer or a designer after manufacturing – hence the term field-programmable.
 The FPGA configuration is generally specified using a hardware description language (HDL).
 FPGAs contain an array of programmable logic blocks, Logic blocks can be configured to perform
complex combinational functions, or act as simple logic gates like AND and XOR etc.

5. Fine Pitch
 Fine pitch is a special class of surface-mount components.
 This class is characterized by lead pitches lower than 0.65 mm (25 mils).
 These fine lead pitches are usually driven by very high lead count ASICs (160 pins and up) or by the
extreme miniaturization requirements of PCMCIA (Personal Computer Memory Card Industry
Association) cards, PDAs (personal digital assistants), and other small, high-performance products.
 The motivation for designating a special fine-pitch-component class of surface-mount parts is the
extra difficulty of successfully testing, assembling, and reworking these parts on PCBs, as well as in
building PCBs with accurately formed patterns and solder masks to mate with the leads of fine-pitch
parts.

6. Press Fit
 Press fit is a special form of through-hole technology.
 Components are fastened to the PCB by deliberately designing an interference fit between the
component lead and the plated through-hole in the PCB.
 The principle application of press-fit technology is the attachment of connectors into backplanes.
 The reason for this is that early backplanes were built by wire wrapping the signal connections onto
the connector pins extending out the back of the backplane.
 Trying to solder the connector pins to the backplane through this field of pins proved difficult, if not
impossible. The solution was press fit.

2. PCB TRACK WIDTH- IMPORTANCE, CALCULATION, AND DESIGN TIPS


 PCB boards are used to minimize the size and complications that are present in the wired circuits.
 The wires in circuits are converted as tracks in a PCB.
 Just like a wire, tracks also have their own resistance and the maximum current that flow through it
depends on its width.
 Further the width and resistance of the track also decides the voltage drop across the track.
 So, it is very important for a PCB Designer to calculate the right width and Resistance of tracks.
 A Track on a PCB is a conductive path or the running path of copper that runs all over the circuit
board, they act as a connection between two points on the PCB.

Factors to consider while designing a PCB track


There are certain factors that are considered before designing the PCB Track such as Purpose,
Amperage, Location, Thickness, and length.
 Purpose: The purpose defines what kind of parameter does the track is going to carry, whether the
Track is a power track or the Signal track. Power tracks should always be wider than the signal track.
 Amperage: The design of the track also depends on the amount of the current that the track is going to
carry.
 Location:  There will be a lot of components included on the circuit board which will be connected with
one another with different tracks; these tracks should not be too close to each other.
 Thickness: The thickness of the copper track and the Width of the track is directly related to one
another. 
 Length: The length also plays a major role in the designing of the PCB Track because the length should
not affect the efficiency of the current flow. If you want a lot of power for your circuit you should have
longer tracks.

PCB Trace width Calculation:

0 . 44 0 . 725
I =k ¿ ∆ T ∗A
ΔT - stands for the change in temperature and A represents the cross-sectional area of the Track.

{ }
(1 /0.725)
Current [ Amps ]
Area [ mil 2 ] =
(k∗(Temp Rise [deg . C])0.44 )

Calculate the width of PCB track

Width(mils)=Area ¿ ¿

Trace widths are often measured in mils, or thousands of an inch. A standard trace width for an ordinary
signal (no special requirements) may be in the 7-12 mil range and be as long as a few inches
Oz=ounce, 1 ounce=29.57 milliliter

PCB Trace Resistance Calculation


L
R=r .( . W )[1+∝ . ( temp−25 ) ]
T

Where L, W, and T represent the physical parameters like Length, Width, and Thickness of the Track,
3. TYPES OF PLANES IN PCB.
1. Ground plane
2. Power plane
3. Signal plane/layer

1. Ground plane
 The ground plane on a printed circuit board is typically a large area of metal connected to the
circuit ground.
 This area of metal is sometimes only a small portion of the board, or in a multi-layer design it may
be one entire board layer. 
 It serves as the return path for current from many different components.
 In digital and radio frequency PCBs, the major reason for using large ground planes is to reduce
electrical noise and interference through ground loops and to prevent crosstalk between adjacent
circuit traces.

2. Power plane
 A power plane is simply a flat plane of copper connected to a power supply. Similar to how the
ground plane is connected to the ground connection of the power supply.
 Its purpose is to provide a steady supply of voltage to your board.

Why Use Power Planes?


 Power planes come with a number of advantages over tracks and traces when they can be used in a
PCB design:
 Improved decoupling between circuits: The surface of a power plane can create a parallel plate
decoupling capacitor between itself the insulating layer and the following ground plane that prevents
noise from propagating through the power supply from one circuit to another.
 Shorter return paths: The convenience of following a via down from a signal layer to the power
plane to power a circuit. Shorter return paths lead to better EMC performance.
 Larger current carrying capacity: Power planes can handle more current than traces or tracks,
lowering the operating temperature of your board.

3. Signal Plane
 Signal plane layers carry power and electrical signals between components.

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