Bosch

Semiconductors
for Automotive
MEMS Sensors
System ICs
Power Semiconductors
IP Modules
2 Semiconductors

Smart and innovative components

for new market requirements

ABOUT THIS CATALOG ABOUT OUR PRODUCTS

This catalog shows our current range of electronic MEMS SENSORS: POWER SEMICONDUCTORS:
com­ponents and IP modules for automotive applications. MEMS sensors (micro electro-mechanical systems) are Efficient use of electric power is paramount for electric
Bosch offers MEMS sensors, application-specific ICs a key technology for the mobile and connected world. vehicles. Our new silicon carbide power switches are
and IP m
­ odules, based on almost half a century of Bosch has been at the forefront of MEMS technology specifically designed for automotive use. They reduce
experience. for more than 25 years now. Bosch MEMS sensors de- power losses in drive electronics and power converters,
liver high per­formance, are small, sturdy, and extremely resulting in an increase of range.
cost-effective due to high volume series production.
We stand for future, innovative technologies – driven
IP MODULES:
by c
­ ustomer-specific requirements. We are the largest
SYSTEM ICS: Intellectual property (IP) modules allow chipmakers to
manufacturer for micromechanical sensors, one of the
Modern types of vehicles include a number of electronic quickly adopt complete ranges of functions in standard
biggest semiconductor makers for automotive and one
control units. Integrated circuits (ICs) are an essential products such as microcontrollers, FPGAs and ASSPs,
of the driving forces in the IP module market.
component of such units. As one of the first suppliers, thus significantly reducing development times and
Bosch began with the development and production of costs. That is, they represent an assembly plan to im-
Our world-wide customer base includes OEMs, such sophisticated integrated circuits as early as the plement these functions in hardware.
well-known makers of electronic control units, and late 1960s. Bosch ICs are customized for specific appli-
the Bosch auto­motive system divisions. cations in the vehicle system (= application specific ICs).

Whenever you design advanced safety and comfort

systems or highly efficient powertrain electronics:
Contact us to benefit from our smart and innovative
portfolio.
 Content 3

MEMS SENSORS SYSTEM ICS POWER SEMICONDUCTORS

Restraint systems Restraint systems Electric drive and power conversion systems

◾ Acceleration sensors 4 ◾ Single-chip airbag system ICs 15 ◾ Silicon carbide power switches 30
◾ Angular rate sensors 6 ◾ Sensor interfaces 17

Vehicle comfort systems Advanced driver assistance systems

◾ Power management ICs 18 IP MODULES
◾ Sensors for motion detection 7
Engine management systems CAN IP modules
Engine management systems
◾ System basis ICs, power supply ICs 20 ◾ X_CAN IP module32
◾ Barometric pressure sensors 9
◾ Low-side power switches 21 ◾ M_CAN IP module 32
Seat comfort systems ◾ Ignition stage driver 22 ◾ TSU IP module ‒ Timestamping unit for M_CAN 32
◾ Low pressure sensors 10 ◾ Oxygen sensor interfaces 23 ◾ DMU IP module ‒ Direct memory access
◾ B6 bridge 24 unit for M_CAN32
Transmission control systems ◾ CAN XL Protocol 32
Transmission control systems ◾ CAN FD Protocol 32
◾ Hydraulic pressure sensors 11
◾ System basis ICs 25 ◾ CAN FD Light Protocol 32
Vehicle dynamics control (VDC) ◾ Current regulators 26 ◾ Mandatory License of CAN Protocols 32
◾ Inertial sensors 12 Timer IP module
Pyro fuse systems
Highly automated and hands-free driving systems ◾ Generic timer module (GTM) 34
◾ Pyro fuse driver 27
◾ High performance inertial sensors 13
Alternator electronics
Active suspension systems
◾ Alternator regulators 29 APPENDIX
◾ Acceleration sensors 14

◾ Abbreviations35
◾ Packages36
◾ Contact40
4 MEMS sensors

Restraint systems
Acceleration sensors

Acceleration sensors in airbag systems measure strong or as a standalone component in the vehicle’s front or
acceleration values within milliseconds. Depending on side (satellite sensor).
the airbag system and the number of existing airbags,
our customers can install the MEMS sensors in the ECU

HIGH-G SINGLE AXIS ACCELERATION SENSORS

Type Product Range Output Tolerance VDD typ. Tmin Tmax Package
[g] [%] [V] [°C] [°C]
Single axis (a y) SMA682 ±120/240/480 PSI5, 10 bit 7 4.5 – 11 −40 125 SOIC8n
Single axis (a z) SMA684 ±120/240 PSI5, 10 bit 7 4.5 – 11 −40 125 SOIC8n
Single axis (a z) SMA694 ±480 PSI5, 10 bit 7 4.5 – 11 −40 125 SOIC8n
Single axis (a y) SMA750 ±120/240/480 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 SOIC8n
Single axis (a z) SMA751 ±120/240/480 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 SOIC8n
Single axis (a x) SMA755 ±240/480 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 SOIC8n
Single axis (a x) SMA758 ±120/240/480 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 SOIC8n
Single axis (a x) SMA780 ±120/240/480 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 LGA SiP
Single axis (a z) SMA781 ±120/240/480 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 LGA SiP
Single axis (a x) SMA790 ±240/480 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 LGA SiP
 MEMS sensors 5

Restraint systems
Acceleration sensors

HIGH-G DUAL AXIS ACCELERATION SENSORS

Type Product Range Output Tolerance VDD typ. Tmin Tmax Package
[g] [%] [V] [°C] [°C]
Dual axis (a xy) SMA660 ±120 SPI, 12 bit 5 3.3 or 5 −40 125 SOIC8n
Dual axis (a xz) SMA665 ±120 SPI, 12 bit 7 3.3 or 5 −40 125 SOIC8n
Dual axis (a xz) SMA720 ±128 (a x) SafeSPI, 14 bit 5 (a x) 3.3 or 6.7 −40 125 SOIC8n
±32 (a z) 7 (a z)
Dual axis (a xy) SMA760 ±128 SafeSPI, 14 bit 5 3.3 or 6.7 −40 125 SOIC8n
Dual axis (a xy) SMA685 ±120/240/480 PSI5, 10 bit 7 4.5 – 11 −40 125 SOIC8n
Dual axis (a xz) SMA686 ±120/240 PSI5, 10 bit 7 4.5 – 11 −40 125 SOIC8n
Dual axis (a xz) SMA696 ±480 PSI5, 10 bit 7 4.5 – 11 −40 125 SOIC8n
Dual axis (a xy) SMA752 ±120/240/480 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 SOIC8n
Dual axis (a xz) SMA753 ±120/240/480 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 SOIC8n
Dual axis (a xy) SMA757 ±240/480 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 SOIC8n
Dual axis (a xy) SMA773 ±30/60 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 SOIC8n
Dual axis (a xz) SMA774 ±30/60 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 SOIC8n
Dual axis (a xy) SMA777 ±30/60 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 LGA SiP
Dual axis (a xz) SMA778 ±30/60 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 LGA SiP
Dual axis (a xy) SMA782 ±120/240/480 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 LGA SiP
Dual axis (a xz) SMA783 ±120/240/480 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 LGA SiP
Dual axis (a xy) SMA792 ±240/480 PSI5, 10 bit or 14 bit 7 4.5 – 11 −40 125 LGA SiP
6 MEMS sensors

Restraint systems
Angular rate and pressure sensors

Rollover and pressure sensors support an airbag system

in the detection of accidents.

ANGULAR RATE SENSOR FOR ROLLOVER SENSING

Type Product Range Output Sensitivity Sensitivity VDD typ. Tmin Tmax Package
[°/s] tolerance typ. [V] [°C] [°C]
[%]
Angular rate sensor (Ω x) SMG810 300 SafeSPI, 16 bit ±100 LSB/°/s ±3 3.3 or 5 or 6.7 –40 125 BGA64
Other configurations are possible on customer demand

COMBINED INERTIAL SENSOR FOR ROLLOVER SENSING

Type Product Range Output Sensitivity Sensitivity VDD typ. Tmin Tmax Package
tolerance typ. [V] [°C] [°C]
[%]
Angular rate sensor (Ω x) SMI720 ±300 °/s SPI, 16 bit 100 LSB/°/s ±5 3.3 –40 105 BGA64
and single axis acceleration ±5 g 5,000 LSB/g ±6
sensor (a z)

PRESSURE SENSORS FOR SIDE IMPACT SENSING AND PEDESTRIAN PROTECTION

Type Product Range Output Sensitivity Tolerance VDD typ. Tmin Tmax Package
[kPa] [kPa] [V] [°C] [°C]
Barometric pressure sensor SMP470 50 – 110 PSI5, 10 bit 53.53 LSB/ ±3 4.55 – 11 –40 125 LGA8
(enhanced: 140) or 16 bit kPA (solderless
(V1.3 / V2.1) contacting
only)
Barometric pressure sensor SMP475 50 – 110 PSI5, 10 bit 53.53 LSB/ ±3 4.55 – 11 –40 125 SOIC8n
(enhanced: 140) or 16 bit kPA
(V1.3 / V2.1)
 MEMS sensors 7

Vehicle comfort systems

Sensors for motion detection

Vehicle comfort features like navigation, tilt or inclina- safety applications, such as airbag or stability systems.
tion mea­su­re­ment, telematics, car key modules, car Therefore, Bosch developed the concept for a new set
alarm or eCall s­ ystems are a rapidly growing field of of cost efficient MEMS sensors for motion detection in
application for MEMS sensors. Typically, these appli- comfort app­l ications.
cations do not have ASIL-classified requirements of

ACCELERATION SENSORS FOR NON-SAFETY APPLICATIONS

Type Product Range Output Sensitivity Sensitivity VDD typ. Tmin Tmax Package
[g] tolerance typ. [V] [°C] [°C]
[%]
Tri-axis acceleration SMA130 ±2 SPI, I²C 4,096 ±2.1 1.62 – 3.6 –40 105* LGA12
sensor (a xyz) ±4 14 bit 2,048
±8 1,024
±16 512
Tri-axis acceleration SMA131 ±2 SPI, I²C 4,096 ±2.1 1.62 – 3.6 –40 105* LGA12
sensor (a xyz) ±4 14 bit 2,048
±8 1,024
*85 – 105 °C: Extended operating temperature range, typical values only

ANGULAR RATE SENSOR FOR NON-SAFETY APPLICATIONS

Type Product Range Output Sensitivity Sensitivity VDD typ. Tmin Tmax Package
[°/s] [°/s] tolerance typ. [V] [°C] [°C]
[%]
Tri-axis angular rate SMG130 ±125 SPI, I²C 262.4 ±1.5 2.4 – 3.6 –40 105* LGA16
sensor (Ω xyz) ±250 16 bit 131.2
±500 65.6
±1,000 32.8
±2,000 16.4
*85 – 105 °C: Extended operating temperature range, typical values only
8 MEMS sensors

Vehicle comfort systems

Sensors for motion detection

COMBINED INERTIAL SENSORS FOR NON-SAFETY APPLICATIONS

Type Product Range Output Sensitivity Sensitivity Sensitivity Sensitivity VDD typ. Tmin Tmax Package
(switchable) Gyroscope Accelerometer tolerance tolerance [V] [°C] [°C]
[LSB/°/s] [LSB/g] Gyroscope typ. Accelerometer
[%] typ.
[%]
Tri-axis SMI130 ±125 °/s, SPI, 262.4 ±1.5 ±1.4 2.4 – 3.6 −40 105* LGA16
angular ±250 °/s, I²C 131.2
rate sensor ±500 °/s, 16 bit (Ω) 65.6
(Ω xyz) ±1,000 °/s, 12 bit (a) 32.8
and tri-axis ±2,000 °/s 16.4
acceleration ±2 g 1,024
sensor (a xyz) ±4 g 512
±8 g 256
±16 g 128
Tri-axis SMI230 ±125 °/s, SPI, 262.4 ±1.5 ±1 2.4 – 3.6 −40 105 LGA16
angular ±250 °/s, I²C 131.2
rate sensor ±500 °/s, 16 bit (Ω) 65.6
(Ω xyz) ±1,000 °/s, 16 bit (a) 32.8
and tri-axis ±2,000 °/s 16.4
acceleration ±2 g 16,384
sensor (a xyz) ±4 g 8,192
±8 g 4,096
±16 g 2,048
*85 – 105 °C: Extended operating temperature range, typical values only
 MEMS sensors 9

Engine management systems

Barometric pressure sensors

Bosch barometric pressure sensors are a key compo- sea level as well as of weather conditions. The engine constant rebalancing of the mixture ratio is that it
nent in engine management for diesel and gasoline management system uses the sensor measurement reduces fuel consumption as well as emissions of
engines. They are designed to measure the current data to ensure the optimum air-fuel mixture, irrespec- CO₂ and other pollutants.
ambient pressure accurately and with low drift. tive of whether the vehicle is traveling along a coastal
Atmospheric pressure is a function of height above road or a road up in the mountains. The benefit of this

PRESSURE SENSOR FOR DIESEL OR GASOLINE ENGINE MANAGEMENT

Type Product Range Output Tolerance VDD typ. Tmin Tmax Package
[kPa] [over lifetime and temperature] [V] [°C] [°C]
Barometric pressure SMP581 40 – 115 SPI ≤1.0 kPa (pressure) 3.3 – 5 −40 125 DFN8
sensor 10 bit or 12 bit ≤3 K (temperature)
10 MEMS sensors

Seat comfort systems

Low pressure sensors

Bosch low pressure sensors are a key component for seat passenger. Thus, form-adjustable lumbar support Particularly when driving on winding roads and on
pneumatic seat applications. The sensor regulates the as well as adjustable side bolsters on the backrest and long trips, the low pressure sensors provide increased
correct inflation of the air chambers in multi-contoured seat area stabilize the v­ ehicle occupants. A massage comfort and help reduce driver fatigue.
seats and ensures that the seat adapts to the anatomy function can also be realized.
and the individual requirements of the driver and front-

PRESSURE SENSOR FOR PNEUMATIC SEAT APPLICATIONS

Type Product Range Output Tolerance VDD typ. Tmin Tmax Package
[kPa] [over lifetime and temperature] [V] [°C] [°C]
Low pressure SMP581 60 – 165 SPI ≤1.5 kPa (pressure) 3.3 – 5 −40 125 DFN8
sensor 10 bit ≤5 K (temperature)
 MEMS sensors 11

Transmission control systems

Hydraulic pressure sensors

MEMS sensors for automatic transmission detect the ing of gears. The Bosch medium h ­ ydraulic pressure
oil pressure in the hydraulic actuators of the gearbox – sensors are characterized by very high media resis-
with a very precise response time of less than a milli- tance and durability due to their hermetically sealed
second. This is crucial for fast and ultra-smooth shift- metal package.

PRESSURE SENSORS FOR TRANSMISSION CONTROL

Type Product Range Output Tolerance VDD typ. Tmin Tmax Package
[bar] [% FS] [V] [°C] [°C]
Hydraulic pressure SMP142 0.5 – 22 SENT / analog 1.2 – 1.8 5 −40 150 Hermetically
sensor 12 bit sealed metal package
Hydraulic pressure SMP144 0.5 – 40 SENT / analog 1.2 – 1.8 5 −40 150 Hermetically
sensor 12 bit sealed metal package
Hydraulic pressure SMP147 0.5 – 70 SENT / analog 1.2 – 1.8 5 −40 150 Hermetically
sensor 12 bit sealed metal package
Sensors with customer specific pressure ranges (10 – 70 bar) on request
12 MEMS sensors

Vehicle dynamics control (VDC)

Inertial sensors

In vehicle dynamics systems, MEMS inertial sensors

measure angular rate and acceleration. This is essential
to determine the dynamic state of the vehicle and to
check the plausibility of the rotation rate signal.

COMBINED INERTIAL SENSORS FOR VDC

Type Product Range Output Sensitivity Sensitivity VDD typ. Tmin Tmax Package
tolerance typ. [V] [°C] [°C]
[%]
Dual angular rate sensor (Ω xz) and SMI860 ±300 °/s SafeSPI, 100 LSB/°/s ±3 3.3 or 5 or −40 125 BGA64
tri-axis acceleration sensor (a xyz) ±6 g 16 bit 5,000 LSB/g ±3 6.7
Angular rate sensor (Ω z) and SMI810 ±300 °/s SafeSPI, 100 LSB/°/s ±3 3.3 or 5 or −40 125 BGA64
dual axis acceleration sensor (a xy) ±6g 16 bit 5,000 LSB/g ±3 6.7
Angular rate sensor (Ω x) and SMI800 ±300 °/s SafeSPI, 100 LSB/°/s ±3 3.3 or 5 or −40 125 BGA64
dual axis acceleration sensor (a xy) ±6g 16 bit 5,000 LSB/g ±3 6.7
Angular rate sensor (Ω x) and SMI710 ±300 °/s SPI, PSI5, 100 LSB/°/s ±3 3.3 or 5 −40 125 BGA64
dual axis acceleration sensor (a yz) ±5 g CAN, 16 bit 5,000 LSB/g ±3
Angular rate sensor (Ω z) and SMI700 ±300 °/s SPI, PSI5, 100 LSB/°/s ±3 3.3 or 5 −40 125 BGA64
dual axis acceleration sensor (a xy) ±5 g CAN, 16 bit 5,000 LSB/g ±3
 MEMS sensors 13

Highly automated and hands-free driving systems

High performance inertial sensors

Highly automated driving (HAD) and hands-free driving re- image or steering angle sensor. The SMU2 family
quires precise information about the vehicle’s movements. offers excellent offset stability over the entire tem-
The sensor data is used for lane keeping during a safe stop perature range.
or to verify movement information derived from camera

HIGH PERFORMANCE INERTIAL SENSORS WITH SUPERB OFFSET PERFORMANCE

Type Product Range Output Total offset error VDD typ. Tmin Tmax Package
incl. lifetime and [V] [°C] [°C]
temperature
High performance yaw rate SMU200 ±300 °/s (Ω z) SPI ±0.25 °/s 3.3 or 5 −40 125 CLCC16
sensor (Ω z) and 3-axis ±6 g (a xyz)
accelerometer
High performance pitch /  SMU210 ±300 °/s (Ω x) SPI ±0.25 °/s 3.3 or 5 −40 125 CLCC16
roll sensor (Ω x) and 3-axis ±6 g (a xyz)
accelerometer

COMBINED INERTIAL SENSOR WITH ASIL B

Type Product Range Output Total offset error VDD typ. Tmin Tmax Package
incl. lifetime and [V] [°C] [°C]
temperature
Precise 3-axis gyroscope and SMI240 ±300 °/s (Ω z) SPI ±5 °/s 3.3 −40 105 LGA12
3-axis accelerometer ±16 g (a xyz)
14 MEMS sensors

Active suspension systems

Acceleration sensors

Active suspension systems have an important impact reduces body movement to make driving safer and more
on driving comfort and safety. They are based on low-g comfortable. The braking distance is shortened and
acceleration sensors that precisely record the dynamics the danger of a rollover is reduced. Also, the vehicle’s
of the chassis and body even under harsh conditions. occupants experience higher driving comfort and less
Thus, the ECU regulates suspension damping and chassis movement.

LOW-G ACCELERATION SENSORS FOR VIBRATION CONTROL

Type Product Range Output Sensitivity Tolerance VDD typ. Tmin Tmax Package
[g] [LSB/g] [%] [V] [°C] [°C]
Low-g SMA731/PSS2.31* ±16 PSI5 (V2.1), 480 3.5 6.7 −40 125 SOIC8n
acceleration (V1.3 config.) (SMA731)
sensor (a x) Second level
package,
details upon
request
(PSS2.31)
Low-g SMA732/ ±16 PSI5 (V2.1), 480 3.5 6.7 −40 125 SOIC8n
acceleration PSS2.32* (V1.3 config.) (SMA732)
sensor (a y) Second level
package,
details upon
request
(PSS2.32)
*PSS2.3x = satellite sensor variant
 System ICs 15

Restraint systems
Single-chip airbag system ICs

Restraint system ICs contain all peripheral system mechanisms to constantly monitor the system avail-
functions: Interfaces to connect digital crash sensors ability. They also provide power for the entire system.
to the electronic control unit, firing loop drivers for
deploying airbags, extensive safety and diagnosis

SYSTEM ICS FOR VARIOUS AIRBAG SYSTEM CONFIGURATIONS

Application Product VDD typ. VVZP VVER typ. Peripheral Analog Interfaces Firing Features Tj min Tj max Package
[V] typ. [V] sensor inter­faces loops [°C] [°C]
[V] interfaces
Single-chip CG904 3.3 14 23.75 or 33 6 × PSI5 10 × AIN SPI, 16 (5 firing ◾ Enhanced sophisticated −40 150 TQFP128-EPAD
integrated (pro­gramma­ble) (V1.3) 2 × AIO 32 bit (3.3 V), modes) safety concept: safety
airbag system K-Line/LIN controller; 3 watchdogs;
ESP sensor data can be
included in safety
concept
◾ Fully automatic diagnosis:
– Monitoring of voltages
(incl. VHx) and
overtemperature,
SVR diagnosis
– Built-in sensor test, C ER
diagnosis, power stage
and squib diagnosis,
cross coupling
diagnosis, connector
capacitor diagnosis,
STB and STG diagnosis
◾ 2 independent 7 bit firing
current counters per
channel (max time:
3.2 ms)
◾ PWM controlled GPIO
16 System ICs

Restraint systems
Single-chip airbag system ICs

SYSTEM ICS FOR VARIOUS AIRBAG SYSTEM CONFIGURATIONS

Application Product VDD typ. VVZP VVER typ. Peripheral Analog Interfaces Firing loops Features Tj min Tj max Package
[V] typ. [V] sensor inter ­faces [°C] [°C]
[V] interfaces
Single-chip CG903 3.3 14 23.75 or 33 4 × PSI5 10 × AIN SPI, 12 (5 firing See CG904 −40 150 TQFP128-EPAD
integrated (programma­ (V1.3) 2 × AIO 32 bit (3.3 V), modes)
airbag system ble) K-Line/LIN

Single-chip CG902 3.3 14 23.75 or 33 2 × PSI5 10 × AIN SPI, 8 (5 firing See CG904 −40 150 TQFP128-EPAD
integrated (programma­ (V1.3) 2 × AIO 32 bit (3.3 V), modes)
airbag system ble) K-Line/LIN

Single-chip CG912 3.3 14 23.75 or 33 2 × PAS 4 × AIN SPI, 4 (5 firing See CG904 −40 150 TQFP64-EPAD
integrated (programma­ 2 × AIO 32 bit (3.3 V), modes)
airbag system ble) K-Line/LIN
 System ICs 17

Restraint systems
Sensor interfaces

Digital interfaces connect peripheral sensors to the

­control unit. They provide supply power to the sensors
and transfer the sensor readings to the microcontroller.

SENSOR SUPPLY AND DATA TRANSMISSION FOR DIGITAL PERIPHERAL SENSORS WITH PSI5 INTERFACE (V1.3)

Application Product Inputs Peripheral sensor Interfaces Features Tj min Tj max Package
interfaces [°C] [°C]
2 channel CF190 VER typ.: (VAS + 3.5 V) – 35 V 2 × PSI5 (V 1.3) SPI ◾ Max. 8 sensors –40 150 LQFP32,
PSI5 receiver VSYNC typ.: (VAS + 4.6 V) – 35 V (3.3 V or 5 V) ◾ Bidirectional communication QFN36
◾ Bosch AB, EM and Open SPI protocol (on request)
◾ Integrated monitoring of voltages and
over ­temperature
◾ Integrated diagnosis
18 System ICs

Advanced driver assistance systems

Power Management ICs for Radar and Video SoCs

Power Management ICs (PMICs) provide low noise and

ultra stable high current for ASIL D advanced driver
assistance systems. They serve as a compact supply not
only for µCs and peripherals, but also sensors,
FPGA and memory.

SUPER-LOW NOISE POWER SUPPLY FOR MONOLITHIC MICROWAVE INTEGRATED CIRCUIT (MMIC) RADAR TRANSCEIVERS

Application Product VDD typ. Inter ­faces Supply voltages Outputs Features Tj min Tj max Package
[V] [°C] [°C]
System basis IC CS520 14/28 SPI, CAN FD ◾ 3.3 V/1.8 A SMPS for ◾ Reset ◾ Designed for passenger car and –40 150 TQFP64-EPAD
for radar ECUs microcontroller and ◾ Battery voltage commercial vehicle applications
bus transceivers monitoring ◾ Suitable for systems up to ASIL C
◾ 3.3 V/1.8 A low noise switch ◾ Voltage monitoring and overcurrent
LR for MMIC analog ◾ Battery voltage protection for all regulators
radar components drop detection ◾ SPI interface for control and
◾ 3.3 V/0.9 A LR for diagnostics
MMIC digital radar ◾ CAN FD driver (up to 5 Mbit/s)
components
◾ 5 V/100 mA switch
for partial network
transceivers
 System ICs 19

Advanced driver assistance systems

Power Management ICs for Radar and Video SoCs

POWER SUPPLY FOR ADVANCED DRIVER ASSISTANCE SYSTEMS (ADAS), CAMERA OR LIDAR SYSTEMS

Application Product VDD typ. Inter ­faces Supply voltages Outputs Features Tj min Tj max Package
[V] [°C] [°C]
System basis IC CS600 14/28 SPI 32 bit ◾ 2 × 0.7 V – 3.825 V ◾ GPIO ◾ 10 programmable rails, possibility –40 150 QFN-MR
for ADAS (programmable) /  for multi phase configuration
systems 2 A (SMPS) ◾ Programmable power-up and -down
◾ 2 × 0.7 V – 3.825 V sequencing between all supply rails,
(programmable) /  incuding optional external sync
1 A (SMPS) ◾ Temperature monitoring and over-
◾ 2 × 0.7 V – 3.825 V temperature shutdown
(programmable) ◾ Voltage monitoring (UV, OV) with
driver for ext. configurable thresholds
power stages ◾ On-chip general purpose ADC
◾ 4 × 0.7 – 3.825 V /  (12 bit, maximum 1MSPS) for
300 mA/LDO) monitoring external voltages on
4 input pins with
up to 7 channels
◾ OTP memory for device configura-
tion of several functions
◾ Functional safety on-chip functions
allowing to realize ISO26262
ASIL-C/D on ECU system level
◾ AEC-Q100 automotive qualified,
grade 1
20 System ICs

Engine management systems

System basis ICs, power supply ICs

Bosch system ICs for engine management systems

combine the power supply with additional peripheral
functions. Virtually all current microcontrollers are
supported.

POWER SUPPLY WITH INTEGRATED CONTROL AND I/O FUNCTIONS, RPM SENSOR SUPPLIES AND INTERFACES

Applicati- Product VDD typ. Inter ­faces Supply voltages Inputs Outputs Features Tj min Tj max Package
on [V] [°C] [°C]
System CY329 14 MSC bus ◾ System: ◾ Ignition ◾ Main relay ◾ Battery supply can be –40 150 TQFP64-EPAD
basis IC 1 × CAN-FD 5 V/550 mA, ◾ 3 wake up control: 1 × LSPS configured as permanent
physical 5 V/950 mA pins ◾ 7 × LS power stage: or non-permanent with
layer ◾ Sensors: ◾ Wake up Ron_max = 2.4 Ohm / or without CAN wake-up
3 × 5 V/200 mA on CAN UClamp = 55 V capability
◾ External ◾ 1 × HS power stage: ◾ Minimal power dissipation
5V moni- Ron_max = 2.4 Ohm, ◾ Standby current down to
tor dedicated supply pin 55 µA
◾ Suitable for ASIL D systems
System CY327 14 SPI, ◾ System: 5 V/450 mA ◾ Ignition ◾ Main relay ◾ Buck/boost pre-regulator –40 150 TQFP64-EPAD
basis IC 16 bit 3.3 V/300 mA, ◾ 3 wake up control: 1 × LSPS switched mode supply for or
(3.3 V) 5 or 3.3 V/250 mA pins µC core voltage TQFP100-EPAD
1 × CAN ◾ Core supply ◾ Wake up ◾ Advanced 3-level watchdog
1 × LIN 0.9 – 1.525 V/1.2 A on CAN operating range 3 V – 40 V
switch-mode ◾ Stop counter functions
◾ Sensors: 3 × 5 V ◾ Very low quiescent current
System CY320 14 1 × CAN ◾ System: 5 V, 3.3 V, ◾ Ignition ◾ Main relay ◾ 2 pre-regulator modes –40 150 PSO36
basis IC 1 × ISO SPI, 2.6 V, 1.5 V ◾ Wake up control: 1 × LSPS (switched, linear)
16 bit (5 V) ◾ Sensors: 3 × 3.3/5 V ◾ Advanced 3-level watchdog
progammable ◾ µC-reset and system reset
◾ Stop counter functions
 System ICs 21

Engine management systems

Low-side power switches

Robust power stages for driving electric loads

around the e
­ ngine: injectors, igniters and other
peripheral devices.

POWER STAGE ARRAYS WITH INTEGRATED MONITORING FUNCTIONS

Application Pro- Vbat typ. VDD typ. Inter ­faces Inputs Outputs Features Tj min Tj max Package
duct [V] [V] [°C] [°C]
14 channel CJ970 14 5 MSC 4 × H bridge 6 × 350 mΩ / 3.6 A / 55 V ◾ Two voltage monitors for –40 150 TQFP100-EPAD
low-side control 2 × 720 mΩ / 2.2 A / 55 V system supplies
power switch 6 × 2.4 Ω / 0.6 A / 55 V ◾ In H bridge configuration,
and H bridge 4 × HSS 5 V / 20 mA bridge is controlled by dedicated
(ignition driver) pins directly
4 × HS/LS combined ◾ Power stages protected against
MOSFET driver SCB
4 × LS MOSFET driver ◾ Current limit or shutdown on
overcurrent
◾ Diagnosis: OL, SCG, SCB and
OTW for each powerstage
◾ Internal power stages can be
connected in parallel
8-fold CJ960 14 5 SPI, 4 × 3.0 A /230 mΩ / 55 V ◾ Diagnosis: OL, SCG, SCB and OT –40 140 TQFP64-EPAD
low-side MSC 2 × 1.0 A /700 mΩ / 55 V ◾ Flexible control by MSC or SPI
power switch 2 × 1.0 A /550 mΩ / 55 V ◾ Multiple safety features
◾ Separate shutdown path for
OUT1 – 4
◾ Current limit or shutdown on
over­current
18-fold CJ950 14 5 MSC TTL/CMOS 4 × 0.6 A /1,800 mΩ / 55 V ◾ Diagnosis: OL, SCG, SCB and OT –40 150 PSO36
low-side logic, 10 × 2.2 A /500 mΩ / 55 V ◾ 5 V monitoring
power switch withstands 2 × 3 A /260 mΩ / 55 V ◾ 2nd independent shut down path
36 V 2 × 8 A /150 mΩ / 55 V ◾ 2 × lambda sensor heater
permanently
22 System ICs

Engine management systems

Ignition stage drivers

Efficient combustion requires a strong ignition spark

at the spark plug. Ignition stage drivers convert the
microcontroller’s output signal in a driver current for
the ignition coil.

INVERTING DRIVER FOR EXTERNAL IGNITION STAGES IN 4 CYLINDER ENGINES

Application Product VDD typ. Channels Interfaces Features Tj min Tj max Package
[V] [°C] [°C]
4-channel inverting driver CK240 5 4 SPI ◾ Short-circuit protection –40 150 SOIC16w
for external ignition stages ◾ Diagnosis
◾ Wiring diagnosis
 System ICs 23

Engine management systems

Oxygen sensor interfaces

The oxygen sensor (or lambda sensor) interface IC per-

manently controls the probe for precise operation and
provides the ­sensor’s readings to the microcontroller
within the engine control unit.

OXYGEN SENSOR CONTROL AND READOUT WITH INTEGRATED MONITORING FUNCTIONS

Application Product Vbat typ. VDD typ. Inputs Interfaces Features Tj min Tj max Package
[V] [V] [°C] [°C]
Oxygen sensor control CJ135 14 3/5 Oxygen SPI ◾ Lambda measurement –40 150 TQFP32-EPAD
for Bosch, NTK & ­sensor ◾ Probe temperature evaluation
Denso oxygen sensors signals ◾ SPI programmable controls
◾ Active blackening control and protection
◾ Analog output current
◾ Diagnostic features
◾ Supports LSU5.2 / 4.9 / ADV (Bosch)
◾ Supports ZFAS-U2 / U3 (NTK)
◾ Supports Plus 5 / 6 (Denso)
Bosch oxygen sensor CJ125 14 5 Oxygen SPI ◾ Lambda measurement –40 150 LQFP32
(LSU) ­sensor ◾ Probe temperature measurement
signals ◾ Programmable reference pump current
◾ Diagnostics
◾ Supports LSU5.2 / 4.9 / ADV / 4.2
(Bosch)
24 System ICs

Engine management systems

B6 bridges

Efficient one-chip solution for driving 3 phase BLDC

­motors.

SMART BRIDGE FOR THROTTLE VALVE DRIVES, PUMPS AND OTHER MOTOR-DRIVEN ACTUATORS

Application Product Vbat typ. Interfaces Features Tj min Tj max Package

[V] [°C] [°C]
Monolithic B6 bridge CJ260 4.5 – 28 SPI, direct inputs ◾ R DSon max: 540 mΩ (@3 A RMS , 150 °C) –40 150 PSSO36
for motors up to 60 W ◾ I out max: 3 A RMS
◾ fPWM max: 20 kHz
◾ Current limiter function
◾ Extensive protection features
◾ Diagnosis functions
◾ Suitable for systems up to ASIL-B
 System ICs 25

Transmission control systems

System basis ICs

In transmission control systems, the system basis Current regulators set the ­currents for magnetic
chipset provides the system power, disables the starter oil valves rapidly and precisely to the desired value –
in case of gearbox malfunction and ensures proper crucial for fast and smooth gear shifting.
system function by various monitoring routines.

2-CHIP CONCEPT FOR HIGH SYSTEM SAFETY: POWER SUPPLY, STARTER RELAIS CONTROL AND VARIOUS I/O

Application Pro- VDD typ. Interfaces Supply Inputs Outputs Features Tj min Tj max Package
duct [V] voltages [°C] [°C]
Safety IC for CG135 14 SPI (3.3 V) UBAT ◾ 3 × voltage ◾ System reset ◾ Complies with ISO26262:2011 for –40 150 TQFP32-EPAD
transmission monitor- ◾ Power control ASIL-D capability in combination QFN36 (on
control units ing with system basis ICs, solenoid demand)
channels drivers and high-side switches
◾ 3 × speed ◾ Flexible parameter configuration
sensor ◾ Diagnostic capability
­interface

System basis CG124 14 ISO/LIN 3.3 V, 5 V, ◾ 3 × speed ◾ 3 × driver for HS ◾ Ideally suited for Renesas SH7 –40 150 TQFP64-EPAD
IC combinati- CG130 SPI (5 V) 9 V, UBAT sensor switches ◾ Reverse polarity protection for (CG124) and
on ◾ 4 × posi- ◾ Starter disable HS switches LQFP32
tion ◾ Startup, reset, ◾ Reverse polarity protection (CG130)
sensor shutdown for for system supply or bare die
◾ Wake up µC ◾ HS switch for starter disable
◾ 2-fold voltage monitoring
◾ Question and answer watchdog
◾ Periphery clock monitoring
◾ 16 channel multiplexer for
diagnosis: OL, SCG and SCB
26 System ICs

Transmission control systems

Current regulators

High precision current regulators for driving hydraulic

valves in automatic transmissions, allowing for fast gear
changes.

PRECISE CONTROL OF OIL PRESSURE VALVES IN HYDRAULIC SYSTEMS

Application Product Vbat typ. VDD typ. Interfaces Outputs Features Tj min Tj max Package
[V] [V] [°C] [°C]
Dual-channel fully CG208 14 5 1 × SPI 2 × regulated ◾ Power switch, shunt and free wheeling diode –40 150 Bare die,
integrated current (3.3 V or load current integrated current regulation range: TQFP44-EPAD
regulator for inductive 5 V) 0...1,200 mA
loads for low-side ◾ Accuracy < 1 %
application ◾ Dither function
◾ Overcurrent protection
◾ Overtemperature protection
◾ SPI controlled regulation loop characteristics
 System ICs 27

Pyro fuse systems

Pyro fuse drivers

In case of an accident, pyro fuses physically separate

the HV battery from the vehicle’s power lines.
As part of the battery management system, pyro fuse
drivers can trigger several pyro fuses independently of
each other.

PYRO FUSE DRIVERS WITH SPI CONTROL, NUMEROUS SAFETY AND DIAGNOSIS FEATURES

Application Product µC VVZP HSS Interfaces Firing Features Tj min Tj max Package
­supply typ. supply loops [°C] [°C]
[V] [V]
4 channel CG985 n.a. 14 25 or 33 SPI, 16-bit 4 (2 firing ◾ Sophisticated safety concept −40 150 LQFP44
pyro fuse (3.3 V or 4.9 V) modes) ◾ Monitoring of voltages, power stage and fi-
driver ring loop diagnosis, STB and STG diagnosis,
squib resistance
measurement
◾ 4-bit firing current counter
per firing loop
4 channel CG912 3.3 14 23.75 or 33 SPI, 32-bit 4 (5 firing ◾ Power supply capabilities: −40 150 TQFP64-EPAD
pyro fuse (programmable) (3.3 V), modes) – 3.3 V (microcontroller,
driver K-Line/LIN onboard sensors)
– 5 V (CAN)
– 6.7 V (peripheral sensors)
– 23.75 / 33 V (energy reserve & pyro fuse firing)
◾ Enhanced sophisticated safety concept
(incl. sensor data monitoring)
◾ Watchdog for microcontroller
◾ Fully automated diagnosis: Monitoring of
voltages (incl. VHx) and overtemperature,
SVR diagnosis, CER diagnosis, power stage
and squib diagnosis, cross-coupling diagnosis,
connector capacitor diagnosis, STB and
STG diagnosis
◾ 2 independent 7-bit firing current
counters per channel (max. time: 3.2 ms)
◾ PWM controlled GPIO
28 System ICs

Pyro fuse systems

Pyro fuse drivers

PYRO FUSE DRIVERS WITH SPI CONTROL, NUMEROUS SAFETY AND DIAGNOSIS FEATURES

Application Product µC VVZP typ. HSS Interfaces Firing Features Tj min Tj max Package
­supply [V] supply loops [°C] [°C]
[V]
8 channel pyro CG902 3.3 14 23.75 or 33 SPI, 32 bit 8 (5 firing ◾ Power supply capabilities: −40 150 TQFP128-EPAD
fuse driver (programmable) (3.3 V), modes) – 3.3 V, 1.3 V (microcontroller,
K-Line/LIN onboard sensors)
– 5 V (CAN)
– 6.7 V (peripheral sensors)
– 23.75 / 33 V (energy
reserve & pyro fuse firing)
◾ Enhanced sophisticated safety
concept (incl. sensor data monitoring)
◾ Watchdog for microcontroller
◾ Fully automated diagnosis: Monitoring
of voltages (incl. VHx) and overtempera-
ture, SVR diagnosis, CER diagnosis,
power stage and squib diagnosis, cross-
coupling diagnosis, connector capacitor
diagnosis, STB and STG diagnosis
◾ 2 independent 7-bit firing current
counters per channel (max. time: 3.2 ms)
◾ PWM controlled GPIO
 System ICs 29

Alternator electronics
Alternator regulators

By adjusting the rotor current, Bosch alternator regula- control, i.e. provide status information, set the output
tors set the output voltage to a constant level, regard- voltage to a desired level or switch off the alternator
less of the actual engine rotation speed. Regulators during acceleration.
with interfaces allow for interaction with the engine

ALTERNATOR OUTPUT VOLTAGE CONTROL, PROGRAMMABLE FOR CUSTOMER SPECIFIC ALTERNATOR BEHAVIOUR

Application Product Interfaces Outputs Features Tj min Tj max Package

[°C] [°C]
Regulator for 14 V alternators CR719 n.a. Excitation current ◾ Autonomous regulator concept −40 175 MultiWatt8
◾ Smart load management

Regulator for 14 V alternators CR724 n.a. Excitation current ◾ Autonomous regulator concept −40 175 MultiWatt8
◾ Smart load management

Regulator for 14 V alternators CR665 LIN 1.3, 2.1 Excitation current ◾ LIN control functions acc. to VDA spec. −40 175 TO220-5
◾ Programmable
◾ Smart load management
Regulator for 14 V alternators CR636 PWM Excitation current ◾ PWM controlled output −40 175 MultiWatt8
◾ Smart load management

Regulator for 14 V alternators CR760 C-Terminal Excitation current ◾ C-Terminal controlled output −40 175 MultiWatt8
◾ Smart load management

Regulator for 28 V alternators CR298 n.a. Excitation current ◾ Autonomous regulator concept −40 175 MultiWatt8
◾ Smart load management

Regulator for 28 V alternators CR250 LIN 1.3 Excitation current ◾ LIN controlled output −40 175 MultiWatt8
◾ Programmable
◾ Smart load management
30 Power semiconductors

Electric drive and power conversion systems

Silicon carbide power switches

Bosch SiC MOSFETs reduce conduction and switching

losses, allow for higher switching frequencies and are
extremely robust. They are specifically designed for
drive electronics or power conversion systems in
(hybrid) electric vehicles.

SILICON CARBIDE AUTOMOTIVE POWER MOSFETS 1,200 V

Type Product VDS [V] I DS [A] R DSon [mΩ] Tj min [°C] Tj max [°C] Package

SiC power switch BT1M1200023T3A 1,200 63 23 −40 175 TO247-3

SiC power switch BT1M1200031T3A 1,200 44 31 −40 175 TO247-3
SiC power switch BT1M1200050T3A 1,200 29 50 −40 175 TO247-3
SiC power switch BT1M1200023T4A 1,200 63 23 −40 175 TO247-4
SiC power switch BT1M1200031T4A 1,200 44 31 −40 175 TO247-4
SiC power switch BT1M1200050T4A 1,200 30 50 −40 175 TO247-4
SiC power switch BT1M1200023D7A 1,200 63 23 −40 175 TO263-7
SiC power switch BT1M1200031D7A 1,200 44 31 −40 175 TO263-7
SiC power switch BT1M1200050D7A 1,200 30 50 −40 175 TO263-7
 Power semiconductors 31

Electric drive and power conversion systems

Silicon carbide power switches

SILICON CARBIDE AUTOMOTIVE POWER MOSFETS 750 V

Type Product VDS [V] I DS [A] R DSon [mΩ] Tj min [°C] Tj max [°C] Package

SiC power switch BT1M0750016T3A 750 82 16 −40 175 TO247-3

SiC power switch BT1M0750022T3A 750 59 22 −40 175 TO247-3
SiC power switch BT1M0750035T3A 750 39 36 −40 175 TO247-3
SiC power switch BT1M0750016T4A 750 82 16 −40 175 TO247-4
SiC power switch BT1M0750022T4A 750 59 22 −40 175 TO247-4
SiC power switch BT1M0750035T4A 750 39 36 −40 175 TO247-4
SiC power switch BT1M0750016D7A 750 82 16 −40 175 TO263-7
SiC power switch BT1M0750022D7A 750 59 22 −40 175 TO263-7
SiC power switch BT1M0750035D7A 750 39 36 −40 175 TO263-7
32 Power semiconductors

Electric drive and power conversion systems

Silicon carbide power switches

SILICON CARBIDE AUTOMOTIVE POWER MOSFETS 1,200 V

Type Product VDS [V] I DS [A] R DSon [mΩ] Tj min [°C] Tj max [°C] Package

SiC power switch BT1M1200010BBA 1,200 175 10 −55 175 bare die
SiC power switch BT1M1200010BOA 1,200 175 10 −55 175 bare die
SiC power switch BT1M1200013BBA 1,200 130 13 −55 175 bare die
SiC power switch BT1M1200013BOA 1,200 130 13 −55 175 bare die
Front side metallization options; BBA type: AlCu; BOA type: AlCu + additional metallization for sintering and soldering

SILICON CARBIDE AUTOMOTIVE POWER MOSFETS 750 V

Type Product VDS [V] I DS [A] R DSon [mΩ] Tj min [°C] Tj max [°C] Package

SiC power switch BT1M0750010BBA 750 225 7 −55 175 bare die
SiC power switch BT1M0750010BBA 750 225 7 −55 175 bare die
SiC power switch BT1M1200013BBA 750 165 10 −55 175 bare die
SiC power switch BT1M1200013BOA 750 165 10 −55 175 bare die
Front side metallization options; BBA type: AlCu; BOA type: AlCu + additional metallization for sintering and soldering
 IP modules 33

IP modules
for networking applications

X_CAN IP MODULE DMU IP MODULE ‒ DIRECT MEMORY ACCESS UNIT CAN FD is standardized as ISO11898-1:2015. CAN FD
The X_CAN is a CAN IP module that can be implemented FOR M_CAN protocol controllers are also able to perform Classical
in an SoC (System on Chip). It supports Classical CAN, The DMU supports DMA transfers between M_CAN CAN communication.
CAN FD (CAN with Flexible Data-rate), and CAN XL message RAM and system memory.
(CAN with Extended Length) communication. CAN XL CAN FD LIGHT PROTOCOL
is being drafted by the CiA 610-1 specification (CAN CAN XL PROTOCOL CAN FD Light is a lightweight version of CAN FD. It is
in Auto­mation) and will be a standardized as part of CAN XL (Controller Area Network with Extended Length) intended for low cost application with one commander
ISO11898. For a connection to the CAN physical layer, provides a superior solution for data rates of up to (master) controller and numerous responder (slave)
additional transceiver hardware is required. 20Mbit/s by maintaining the advantages of the CAN controllers. CAN FD Light is currently intended for
The X_CAN is being developed as Safety Element out protocol like collision-resolution by non-destructive 1 Mbps. For a CAN FD Light responder there is no need
of Context (SEooC) according to ISO 26262-11:2018 arbitration. It expands the number of data bytes per for an external crystal to have lower cost.
Clause 4. Safety Manual and FMEDA will be available CAN frame up to 2048. CAN XL is ready for SOA (Service CAN FD Light is currently being standardized by the
on request. Oriented Architecture) with new protocol features as it CiA (CAN in Automation).
enables virtual CAN networks with the Virtual CAN Existing IP capable of CAN FD (X_CAN and M_CAN)
M_CAN IP MODULE network ID (VCID). The Service data type (SDT) defines can be used as CAN FD Light commander.
The M_CAN is a CAN IP module that can be realized as higher protocol type and the 32 bit Address Field (AF) is
stand-alone device, as part of an ASIC, or on an FPGA. used for content or node based addressing. With respect MANDATORY LICENSE OF CAN PROTOCOLS
It supports Classical CAN and CAN FD (CAN with Flexible to the bitrate, CAN XL fills the gap between CAN FD and The CAN Protocols are patented products developed
Data-rate) communication according to ISO11898-1:2015. 100BASE-T1 (Ethernet) with a bit rate of up to 20 Mbit/s. by Robert Bosch GmbH.
For a connection to the CAN physical layer, additional CAN XL protocol controllers are also able to perform A CAN Protocol License is required for all implemen­
transceiver hardware is required. The M_CAN is also Classical CAN and CAN FD communication. tations of CAN FD, CAN FD Light, TTCAN and CAN XL
available as M_TTCAN, to additionally support Time- module.
Triggered CAN according to ISO11898-4. The M_CAN CAN FD PROTOCOL
has been developed as Safety Element out of Context CAN FD (CAN with Flexible Data-rate) was introduced
(SEooC) according to ISO 26262-11:2018, Clause 4. by Bosch in 2012 to overcome the Classical CAN’s bit
Safety Manual and FMEDA are available on request. rate limitation to 1 Mbps and to expand the number of
data bytes per CAN frame from up to 8 to up to 64,
TSU IP MODULE ‒ TIMESTAMPING UNIT FOR M_CAN thereby closing the gap between Classical CAN and other
The timestamping unit supplies IP module with hard- protocols. This is achieved by a modified CAN frame
ware timestamps according to CiA 603 and AUTOSAR format where the bit rate can be switched to faster value
specification. inside the CAN frame and by a new data length coding.
34 IP modules

IP modules
for timer applications

GENERIC TIMER MODULE (GTM)

The GTM IP is a scalable I/O co-processor and a generic ◾ Counters (free running and resettable)
timer for various automotive and industrial applica- ◾ Multi-action capture/compare PWM input
tions. It covers a wide range of applications: Power ◾ Complex PWM output function
Factor Correction (PFC), electrical converter, motor ◾ Duty-cycle measurement
control, traction control, EV (Electric Vehicle), power- ◾ Global time bases
train, power steering, chassis and transmission control. ◾ Complex angle clock mechanism for
The benefits of the GTM are: powertrain applications
◾ Input signal filtering
◾ Internal RISC-like programmable cores
◾ Offloading real-time critical I/O workloads from µC
for data processing and complex output
cores to a specialized I/O co-processor with massive
sequence generation
parallel thread handling capabilities
◾ Common architecture across multiple semiconductor
controllers The GTM IP is designed to offer flexible solutions
◾ Development of software/applications independent for different application domains and for different
of selected MCU application classes within one specific application
◾ Scalable design approach domain. The IP is designed to run with minimal CPU
◾ Scales with the application demand – interaction and to unload the CPU from handling
from low-end to high-end class applications interrupt service requests as much as possible.
◾ Large Eco-Environment
◾ Short development cycle with a rich set of tools Generic interfaces and the hierarchical system archi­
and compilers tecture make the GTM an ideal solution as IP core for
◾ Emulation of serial protocols (e.g. LIN, SENT) various microcontroller architectures.
◾ Add serial protocol to your design with the GTM
 Abbreviations 35

Abbreviations
As used in data tables

C ER Energy reserve capacitor

HS High side switch
HSPS High side power switch
LS Low side switch
LSPS Low side power switch
PAS Peripheral airbag sensor
PSI5 Peripheral sensor interface bus
SPI Serial peripheral interface
VBAT Battery voltage
VDD System supply
VPASOx Sensor supply voltage
V VER Energy reserve voltage
V VZP Supply voltage
36 Packages (body dimensions only)

Packages
Body dimensions

TQFP128-EPAD TQFP100-EPAD TQFP64-EPAD TQFP44-EPAD TQFP32-EPAD LQFP44

(14 mm × 14 mm) (14 mm × 14 mm) (10 mm × 10 mm) (10 mm × 10 mm) (7 mm × 7 mm) (10 mm × 10 mm)

LQFP32 PSO36 PSSO36 SOIC24w SOIC16w SOIC8n

(7 mm × 7 mm) (11.1 mm × 16 mm) (10.3 mm × 7.6 mm) (7.5 mm × 15.4 mm) (7.5 mm × 10.3 mm) (3.9 mm × 4.9 mm)

QFN-MR QFN36
(10 mm × 10 mm) (6 mm × 6 mm)
 Packages (body dimensions only) 37

Packages
Body dimensions

BGA64 Metal package LGA16 LGA12 LGA8 CLCC16

(7 mm × 7 mm) (⌀ 17.5 mm) (3 mm × 4.5 mm) (2 mm × 2 mm) (8.2 mm × 4.4 mm) (8 mm × 8 mm)

LGA SiP TO220-5 TO247-3 TO263-7 Multiwatt8 (in-line) DFN8

(4 mm × 5 mm)
38 Notes
Notes 39
Contact

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