Workstation HP z1 g9 Torre

QuickSpecs HP Z1 G9 Tower Desktop PC
Overview
HP Z1 G9 Tower Desktop PC
1. Slim optical drive bay (optional) 6. SD card 4.0 reader (optional)

2. Slim optical bay for removable 2.5’’ HDD or M.2 SSD 7. (4) Type-A SuperSpeed USB 10Gbps signaling rate port
(optional) (1 with charge support up to 5V/1.5A)
3. Hard drive activity light 8. Type-C® SuperSpeed USB 20Gbps signaling rate port
4. Dual-state power button (charge support up to 5V/3A)
5. Combo Audio Jack with CTIA and OMTP headset support
Not Shown
Slots
(1) PCI Express Gen4 x16 (wired as x4)
(1) PCI Express Gen4 x16
(2) PCI Express x1
(3) M.2 (1 as M.2 2230 socket for WLAN/BT and 2 as M.2 2280
socket for storage)
Not all configuration components are available in all regions/countries. Page 1

c08112669– DA 17011– Worldwide – Version 9 – March 30, 2023
Overview
1. Audio line-out jack connector 6. (3) Type A SuperSpeed USB 5Gbps signaling rate port
2. (2) Dual-Mode DisplayPort™ 1.4 (DP++) 7. (1) Type A Hi-Speed USB 480 Mbps signaling rate port
3. HDMI port 1.4 8. Power cord connector
4. Flex port, choice of (shown here HDMI installed): 9. Internal WLAN antenna (optional, shown here installed)
• DisplayPort™ 1.4 • Dual Type-A SuperSpeed USB 10. Business Lock (optional, shown here not installed)
• HDMI 2.0b 5Gbps signaling rate port 11. RJ-45 (network) jack
• VGA • Serial 12. Serial port (optional, shown here installed)
• USB-C® SuperSpeed USB 10Gbps signaling rate port 13. Integrated keyboard/mouse wire hoop
(USB-C® option has alt mode DisplayPort™ 1.4 and 15W 14. Pad Lock
output)
5. (2) Type A Hi-Speed USB 480 Mbps signaling rate port with 15. Standard cable lock slot
wake from S4/S5
16. External WLAN antenna (shown here not install)
Not shown
Optional ports Bays
Thunderbolt™ 3 card1 (2) 3.5” internal storage drive bay
PS/2 & serial port card (connected to mainboard via a flyer (2) Slim optical drive bay (optional, ODD and removable
cable) 1 storage)
Parallel Port1
1. Each of the legacy options will occupy one rear slot.

Features
AT A GLANCE
• HP developed and engineered UEFI V2.7 BIOS supporting security, manageability, and software image stability
• Intel® Q670 chipset supporting Intel® 12th generation Core™ processors, featuring integrated Intel® UHD Graphics and
Intel® vPro® Technology (available with Core i5- and above processors)
• Intel® Ethernet Connection I219LM GbE LOM integrated network connection
• Intel® Wi-Fi 6E + BT5.2 (802.11AX 2x2)5
• DDR5 Synchronous Dynamic Random Access Memory (SDRAM) up to 4400 MT/s
• Support for up to 8 monitors via two standard DisplayPort™ 1.4 ports, HDMI 1.4, and a configurable Flex I/O port for video
options and a discrete graphics
• Configurable FlexPort which provides the following choices: HDMI 2.0b, Serial, VGA, DisplayPort™ 1.4, or USB Type-C® with
DisplayPort™ 1.4 Thunderbolt 3 (PCIe card, Thunderbolt 3 with USB4.0 (and Dual USB Type-A. See Ports section for port
availability
• Configurable, NVIDIA® GeForce® VR ready and NVIDIA® Quadro® discrete graphics 1
• Can be configured with multiple data drives in a RAID array
• Enhanced Security with HP Security Suite (Refer to Security Section for details)
• ENERGY STAR® certified. EPEAT® registered where applicable. Based on US EPEAT® registration according to IEEE 1680.1-
2018 EPEAT®. EPEAT® status varies by country. Visit http://www.epeat.net for more information.
• CCC, CECP and SEPA Certified
• TCO Edge for All-in-One TCO
• PC chassis and all internal components and modules are manufactured with low halogen content
• Dust filter available
• Protected by HP Services, including limited warranties of 90/90/90, 1/1/1 and 3/3/3 (terms and conditions vary by
country; certain restrictions and exclusions apply); Care Packs available with up to 5 years Next Business Day Onsite
Hardware Support
• Compliance with CE (Class B) / FCC (Class B) / UL (UL60950-1 /UL62368-1) / CSA (CSA C22.2 No.60950-1-07 / CSA C22.2 No.
62368-1-14) / ICES-003 / CCC / VCCI (Class B) / KCC (Class B)
1. VR Ready is an optional feature which requires supported discrete graphics.

NOTE: See important legal disclosures for all listed specs in their respective feature sections
PRODUCT NAME

Features
OPERATING SYSTEM
Preinstalled Windows 11 Pro2
Windows 11 Pro Education2
Windows 11 Home - HP recommends Windows 11 Pro for business2
Windows 11 Home Single Language - HP recommends Windows 11 Pro for business2
Windows 11 Pro (preinstalled with Windows 10 Pro Downgrade) 1,2,3
FreeDOS
1 Device comes with Windows 10 and a free Windows 11 upgrade or may be preloaded with Windows 11. Upgrade timing may vary by device.
Features and app availability may vary by region. Certain features require specific hardware (see Windows 11 Specifications).
2 Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware,
drivers, software or BIOS update to take full advantage of Windows functionality. Windows is automatically updated and enabled. High speed
internet and Microsoft account required. ISP fees may apply and additional requirements may apply over time for updates. See
http://www.windows.com.
3This system is preinstalled with Windows 10 Pro software and also comes with a license for Windows 11 Pro software and provision for recovery
software. You may only use one version of the Windows software at a time. Switching between versions will require you to uninstall one version
and install the other version. You must back up all data (files, photos, etc.) before uninstalling and installing operating systems to avoid loss of
your data.
NOTE: Your product does not support Windows 8 or Windows 7. In accordance with Microsoft’s support policy, HP does not support the Windows®
8 or Windows 7 operating system on products configured with Intel® and AMD® 7th generation and forward processors or provide any Windows® 8
or Windows 7 drivers on http://www.support.hp.com. A full list of HP products and the Windows 10 versions tested is available on the HP support
website. https://support.hp.com/us-en/document/c05195282
CHIPSET
Intel® Q670

Features
PROCESSORS
Ghz P- Ghz E- Featuring Max

Up to X P- Up to x GHz Memory ECC
Core Core L3 P- E- Processo Intel® Turbo
Core Max E-Core Max Total Speed Memory Integrated TDP
Name Base Base Cache Core Core r vPro® Freque
Turbo Turbo Cores (MT/s) Supporte Graphics (W)
Frequenc Frequenc (MB) s s Threads Technolog ncy
Freq Frequency (DDR5)4 d5
y y y3 (GHz)2
Intel 13th Generation Processors
Intel® Core™ Intel® UHD
2 1.50 5.2 4.2 36 8 16 24 32 5600 Y Y 65 5.6
i9-13900 Graphics 770
2.1 1.50 5.1 4.10 30 8 8 16 24 5600 Y Y 65 5.2
2.7 2.00 5.0 3.7 24 6 8 14 20 4800 Y Y 65 5.0
2.5 1.80 4.8 3.5 24 6 8 14 20 4800 Y Y 65 4.8
2.5 1.80 4.6 3.3 20 6 4 10 16 4800 N N/A 65 4.6
Intel® Core™- Intel® UHD
4.5 N/A 3.4 N/A 12 8 0 8 8 4800 N N/A 60 4.5
13100 Graphics 730
Intel 12th Generation Processors
5 1.8 5.0 3.8 30 8 8 16 24 4800 Y Y 65 5.1
2.1 1.6 4.8 3.6 25 8 4 12 20 4800 Y Y 65 4.9
3.3 N/A 4.8 N/A 18 6 0 6 12 4800 Y Y 65 4.8
3 N/A 4.6 N/A 18 6 0 6 12 4800 Y Y 65 4.6
2.5 N/A 4.4 N/A 18 6 0 6 12 4800 N N/A 65 4.4
i5- 12400 Graphics 730
3.5 N/A 4.4 N/A 12 4 0 4 8 4800 N N/A 60 4.4
3.3 N/A 4.3 N/A 12 4 0 4 8 4800 N N/A 60 4.3

Features
1
Multicore is designed to improve performance of certain software products. Not all customers or software
applications will necessarily benefit from use of this technology. Performance and clock frequency will vary
depending on application workload and your hardware and software configurations. Intel’s numbering, branding
and/or naming is not a measurement of higher performance.
3
Intel Turbo Boost performance varies depending on hardware, software and overall system configuration. See
http://www.intel.com/technology/turboboost for more information.
4
Intel vPro® requires Windows 10 Pro 64 bit or higher, a vPro supported processor, vPro enabled chipset, vPro enabled
wired LAN and/or Wi-Fi 6E WLAN and TPM 2.0. Some functionality requires additional 3rd party software in order to
run. Features of vPro® Essentials and Enterprise vary. See http://intel.com/vpro
5 Memory will run at 4400 speed (MT/s) in 2DPC within 1DIMM population; memory will run at 4000 speed (MT/s) in
2DPC within 2DIMM of 1 Rank population and memory will run at 3600 speed (MT/s) in 2DPC within 2DIMM of 2 Rank
population

Features
GRAPHICS
Integrated Intel® Graphics
Intel® UHD Graphics 770 (integrated in 12th gen Corei5-12500T and above)
Intel® UHD Graphics 730 (integrated in 12th gen Core i5-12400(T), and i3)
Optional Discrete Graphics Solutions
NVIDIA® GeForce® RTX 3070 8GB LHR Graphics Card1
NVIDIA® GeForce® RTX 3060 12GB Graphics Card
NVIDIA® T400 4GB Graphics Card
1. Requires 550W chassis

NOTE: HP Z1 G9 Tower Desktop PC can support a single discrete graphics card up to 200W with a 550W Power Supply.
Adapters and Cables

HP DisplayPort Cable
HP DisplayPort to HDMI True 4K Adapter
HP DisplayPort to VGA Adapter
HP USB to Serial Port Adapter
HP HDMI Standard Cable Kit (HDMI)

Features
STORAGE
3.5 inch SATA Hard Disk Drives (HDD)
500GB 7200RPM 3.5in SATA HDD
1TB 7200RPM 3.5in SATA HDD
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for
Windows) is reserved for system recovery software.
2.5 inch SATA Hard Disk Drives (HDD)**

500GB 7200RPM 2.5in SATA HDD
500GB 7200RPM 2.5in Self Encrypted OPAL2 SATA HDD*
* Storage DriveLock does not work with Self Encrypting or Optane based storage.
** 2.5 inch SATA Hard Disk Drives are only available with the removable Hard Disk Drive carrier, and as the primary drive only.
M.2 PCIe NMVe Solid State Drives (SSD)

256GB M.2 2280 PCIe NVMe SSD
512GB M.2 2280 PCIe NVMe SSD
1TB M.2 2280 PCIe NVMe SSD
256GB M.2 2280 PCIe NVMe Three Layer Cell SSD
512GB M.2 2280 PCIe NVMe Three Layer Cell SSD
1TB M.2 2280 PCIe NVMe Three Layer Cell SSD
2TB M.2 2280 PCIe NVMe Three Layer Cell SSD
256GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD**
512GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD**
** Storage DriveLock does not work with Self Encrypting or Optane based storage
Optical Disc Drives
HP 9.5mm Slim DVD-ROM Drive1
HP 9.5mm Slim DVD Writer Drive1
1. HD-DVD disks cannot be played on this drive. No support for DVD-RAM. Actual speeds may vary. Don’t copy copyright-protected
materials. Double Layer discs can store more data than single layer discs. Discs burned with this drive may not be compatible with many
existing single-layer DVD drives and players.
Media Card Reader

SD 4.0 with 5-in-1 Interface (Supports SD, SDXC, SDHC, UHS-I, UHS-II)
MEMORY
Memory Type

Features
DDR5-4800 (Transfer rates up to 4400 MT/s), Max 128 GB, 4 U-DIMM
Memory Configuration
8GB (1 x 8GB)
16GB (2 x 8GB)
32GB (4 x 8GB)
16GB (1 x 16GB)
32GB (2 x 16GB)
64GB (4 x 16GB)
32GB (1 x 32GB)
64GB (2 x 32GB)
128GB (4 x 32GB)
NOTE: Memory modules support data transfer rates up to 3600 MT/s(2DPC/2R) or 4400 MT/s (2DPC/1R) and 4400 MT/s; actual data rate
is determined by the system configured.
NOTE: 2 DIMMs per channel requires platform design with four physical DIMM slots. 2 DIMMS per channel is supported when
channel is populated with the same DIMM part number. Symmetric configurations are required for 2 DIMMs per channel physical
configuration. Population rule: ensure furthest DIMM from processor is populated.
NOTE: All memory slots are customer accessible / upgradeable.
NETWORKING/COMMUNICATIONS
Ethernet (RJ-45)
Intel® I219-LM 1 Gigabit Network Connection LOM (vPro®)
Intel® Ethernet Network Adapter I225-T1 (optional)
Wireless
Intel® Wi-Fi 6E1 AX211 + BT5.3 wireless card (802.11AX 2x2 vPro®, supporting gigabit data rate2)
Intel® Wi-Fi 6E1 AX211 + BT5.3 wireless card (802.11AX 2x2 non-vPro®, supporting gigabit data rate2)
Realtek RTL8852BE 802.11ax3 2x2 Wi-Fi® 62 + BT5.3 wireless card
1. Wireless access point and Internet service required and not included. Availability of public wireless access points limited. The
specifications for the 802.11ax WLAN are draft specifications and are not final. If the final specifications differ from the draft
specifications, it may affect the ability of the PC to communicate with 802.11ax WLAN devices. Wi-Fi 6 requires a wireless router, sold
separately, that supports 802.11ax (Wi-Fi 6). Only available in countries where 802.11ax is supported.
2. Wi-Fi 5 or 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router.
Requires a wireless router, sold separately, that supports 80MHz and higher channels.
NOTE: Intel Wi-Fi 6E modules are available, but the 6GHz band is not available.

Features
KEYBOARDS AND POINTING DEVICES
Keyboards
HP Wired Desktop 320K Keyboard
HP USB Business Slim Wired SmartCard CCID Keyboard
HP Business Slim PS/2 Wired Keyboard
HP 125 Wired Keyboard
HP 125 AntiMicrobial Wired Keyboard (China Only)
Mouse
HP Wired 320M Mouse
HP PS/2 Mouse
HP Wired 125 Mouse
HP Wired 128 Laser Mouse
HP Wired 125 Antimicrobial Mouse (China only)
Keyboard and Mouse Combo

HP 655 Wireless Keyboard and mouse combo

Features
SECURITY
TPM 2.0 endpoint security controller (Infineon SLB9670) shipped with Windows 10. Common Criteria EAL4+ Certified. FIPS
140-2 Level 2 Certified.
Solenoid Lock & Intrusion Sensor (optional)
Support for chassis cable lock devices
Support for chassis padlocks devices
SATA port disablement (via BIOS)
Serial, USB enable / disable (via BIOS)
Serial, parallel, USB enable / disable (via BIOS)
Optional USB Port Disable at factory (user configurable via BIOS)
Removable media write/boot control
Power-on password (via BIOS)
Setup password (via BIOS)
PORTS
I/O Ports – Internal Ports
PCI Express 4.0 x16 1
PCI Express 3.0 x16 (wired as x4) 1
PCI Express 3.0 x1 2
SATA port 4
M.2 PCIe (1) M.2 PCIe 3 x1 2230 (for WLAN)
(2) M.2 PCIe 4 x4 2280 (for storage)
1. M.2 SSD attached to CPU is PCIe Gen 4, the other two M.2 are PCIe Gen 3 (AIO)
NOTE: For Mini with M.2 Storage config, there will be no SATA drive bracket. If you plan to use or upgrade the storage with any 2.5" SATA
drive, please select a DM SATA Drive Bracket (available as both factory configured and after-market option).
Standard User Accessible Ports

Type-A Hi-Speed USB 480Mbps signaling rate port 3(rear)
Type-A SuperSpeed USB 5 Gbps signaling rate port
3 (rear)
Type-A SuperSpeed USB 10 Gbps signaling rate port

4 (front)
Type-C® SuperSpeed USB 20Gbps signaling rate port

1 (front)
Video 2 DisplayPort™ 1.4a

1 HDMI 1.4
Audio 1 Universal Audio Jack with CTIA and OMPT headset support
(front);
1 Audio-Line-in/Line out (rear)
(1) Flexible Port 1, choice of one of the following…

Dual Type-A SuperSpeed USB 5 Gbps signaling rate port 1
Type-C® SuperSpeed USB 10Gbps signaling rate port 1

Features
Thunderbolt™ 3.0 with USB 4.02 1
Video 1 DisplayPort™ 1.4a or
HDMI 2.0b or VGA
Serial* 1
2. Occupies a PCIe slot. Available in Q3, 2021.

3. Sold separately or as an optional feature.
Bays
(2) Slim Optical Disc Drive (ODD or removable storage)
(1) SD Card Reader
(2) 3.5" Internal Storage Drive
4. SATA 2.5” internal storage drive cannot be selected if discrete graphic card is selected.

Features
USB SPECIFICATION AND MARKETING NAME MAPPING TABLE
Marketing Name Technical Terminology
Hi-Speed USB 480Mbps signaling rate USB 2.0
SuperSpeed USB 5Gbps signaling rate USB 3.2 Gen 1
SuperSpeed USB 10Gbps signaling rate USB 3.2 Gen 2
SuperSpeed USB 20Gbps signaling rate USB 3.2 Gen 2x2

Features
SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS
Software
HP Easy Clean20
HP QuickDrop1
HP PC Hardware Diagnostics UEFI
HP Desktop Support Utilities
HP Privacy Settings
HP Setup Integrated OOBE
HP Support Assistant2
HSA Fusion for Commercial
HSA Telemetry for Commercial
Touchpoint Customizer for Commercial
myHP
HP Notifications
HP Connection Optimizer
HP Smart Support3
Buy Microsoft Office (sold separately)
Manageability Features
HP Connect for Microsoft Endpoint Manager4
HP Image Assistant Gen5 (download)
HP Manageability Integration Kit (download)5
HP Client Management Script Library (download)
HP Patch Assistant (download)6
HP Driver Packs (download)19
HP Cloud Recovery7
HP Client Catalog (download)
Security Management
HP Wolf Security for Business8 includes:
HP Sure Click9
HP Sure Sense 210
HP Sure Run Gen511
HP Sure Recover Gen512
HP Sure Start Gen713
HP Tamper Lock
HP Sure Admin14
HP Client Security Manager Gen715
BIOS
HP BIOSphere Gen616
HP Secure Erase17
HP DriveLock & Automatic DriveLock
BIOS Update via Network
Absolute Persistence Module18
TPM 2.0 Embedded Security Chip (Common Criteria EAL4+ Certified) (FIPS 140-2 Level 2 Certified)
1. HP Quick Drop requires Internet access and Windows 10 or higher PC preinstalled with HP QuickDrop app and either an Android device (phone or
tablet) running Android 7 or higher with the Android HP QuickDrop app, and /or an iOS device (phone or tablet) running iOS 12 or higher with the
iOS HP QuickDrop app.
2. HP Support Assistant requires Windows and Internet Access
3. HP Smart Support automatically collects the telemetry necessary upon initial boot of the product to deliver device-level configuration data and
health insights and is available preinstalled on select products, thru HP Factory Configuration Services; or it can be downloaded. For more
information about how to enable HP Smart Support or for download, please visit http://www.hp.com/smart-support.

Features
4. HP Connect for Microsoft Endpoint Manager is available from the Azure Market Place for HP Pro, Elite, Z and Point-of-Sale PCs managed with
Microsoft Endpoint Manager. Subscription to Microsoft Endpoint Manager required and sold separately. Network connection required.
5. HP Manageability Integration Kit can be downloaded from http://www.hp.com/go/clientmanagement.
6. HP Patch Assistant available on select HP PCs with the HP Manageability Kit that are managed through Microsoft System Center Configuration
Manager. HP Manageability Integration Kit can be downloaded from http://www8.hp.com/us/en/ads/clientmanagement/overview.html.
7. HP Cloud Recovery is available for Z by HP, HP Elite and Pro desktops and laptops PCs with Intel® or AMD processors and requires an open,
wired network connection. NOTE: You must back up important files, data, photos, videos, etc. before use to avoid loss of data. Detail, please refer
to: https://support.hp.com/us-en/document/c05115630.
8. HP Wolf Security for Business requires Windows 10 or higher, includes various HP security features and is available on HP Pro, Elite, RPOS and
Workstation products. See product details for included security features and OS requirement.
9. HP Sure Click requires Windows 10 Pro or higher or Enterprise. See https://bit.ly/2PrLT6A_SureClick for complete details.
10. HP Sure Sense requires Windows 11 Pro or Enterprise and supports Microsoft Internet Explorer, Google Chrome™, and Chromium™. Supported
attachments include Microsoft Office (Word, Excel, PowerPoint) and PDF files in read only mode, when Microsoft Office or Adobe Acrobat are
installed.
11. HP Sure Run Gen5 is available on select HP PCs and requires Windows 10 and higher.
12. HP Sure Recover Gen4 is available on select HP PCs and requires an open network connection. Not available on platforms with multiple
internal storage drives. You must back up important files, data, photos, videos, etc. before using HP Sure Recover to avoid loss of data.
13. HP Sure Start Gen 7 is available on select HP PCs and workstations. See product specifications for availability.
14. HP Sure Admin requires Windows 11, HP BIOS, HP Manageability Integration Kit from http://www.hp.com/go/clientmanagement and HP Sure
Admin Local Access Authenticator smartphone app from the Android or Apple store.
15. HP Client Security Manager Gen7 requires Windows and is available on the select HP PCs.
16. HP BIOSphere Gen6 features may vary depending on the platform and configuration.
17. HP Secure Erase for the methods outlined in the National Institute of Standards and Technology Special Publication 800-88 "Clear" sanitation
method. HP Secure Erase does not support platforms with Intel® Optane™.
18. Absolute firmware module is shipped turned off and can only be activated with the purchase a license subscription and full activation of the
software agent. License subscriptions can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability
outside the U.S. Certain conditions apply. For full details visit: https://www.absolute.com/about/legal/agreements/absolute/.
19. HP Driver Packs: Not preinstalled, however available for download at http://www.hp.com/go/clientmanagement .
20. HP Easy Clean requires Windows 10 RS3 and higher and will disable the keyboard, touchscreen, and clickpad only. Ports are not disabled. See
user guide for cleaning instructions.

Features
ENVIRONMENTAL & INDUSTRY
ENERGY STAR® certified models available
ENERGY STAR® certified. EPEAT® registered where applicable. Based on US EPEAT® registration according to IEEE 1680.1-2018
EPEAT®. EPEAT® status varies by country. Visit http://www.epeat.net for more information.
Low halogen (chassis, all internal components and modules)1
TAA compliant models available
1. External power supplies, power cords, cables and peripherals are not Low Halogen. Service parts obtained after purchase may not be Low
Halogen.
UNIT ENVIRONMENT AND OPERATING CONDITIONS

General Unit Operating Guidelines
• Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit
is operated within the specified operating range.
• Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow.
• Never restrict airflow into the computer by blocking any vents or air intakes.
• Do not stack computers on top of each other or place computers so near each other that they are subject to each other's
re-circulated or preheated air.
• Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign
matter can block the vents and limit the airflow.
• If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the
enclosure, and the same operating guidelines listed above will still apply.
Temperature Range Operating: 50° to 95° F (10° to 35° C)1

Non-operating: -22° to 149° F (-30° to 65° C)
Relative Humidity Operating: 10% to 90% (non-condensing at ambient)
Non-operating: 5% to 95% (non-condensing at ambient)
Maximum Altitude Operating: 5000m
(unpressurized) Non-operating: 50000ft (15240 m)
1. Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight. Maximum
rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.

Features
Eco-Label Certifications & This product has received or is in the process of being certified to the following approvals and may
declarations be labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• ENERGY STAR® certified. EPEAT® registered where applicable. Based on US EPEAT® registration
according to IEEE 1680.1-2018 EPEAT®. EPEAT® status varies by country. Visit
http://www.epeat.net for more information.
Sustainable Impact • 45% post-consumer recycled plastic

Specifications • 5% ITE-derived closed loop plastic
• Bulk packaging available
• 80 Plus® Platinum power supplies available
• Molded paper pulp cushion inside box is 100% sustainably sourced and recyclable
• Ocean-bound plastic in speaker enclosure and system fan
• Contains recycled metal
System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Desktop model is based on a Typically Configured Desktop.
Energy Consumption
(in accordance with US
115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
ENERGY STAR® test
method)
Normal Operation 27.15 W 27.45 W 27.2 W
(Short idle)
Normal Operation 26.07 W 25.96 W 25.45 W
(Long idle)
Sleep 1.36 W 1.34 W 1.32 W
Off 0.76 W 0.72 W 0.71 W
NOTE: Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model
family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S.
Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does
not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is for a typically
configured PC featuring a hard disk drive, a high efficiency power supply, and a Microsoft Windows® operating
system.
Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation (Short 92.9 BTU/hr 93.9 BTU/hr 93 BTU/hr
idle)
Normal Operation (Long 89.2 BTU/hr 88.8 BTU/hr 87 BTU/hr
idle)
Sleep 4.7 BTU/hr 4.6 BTU/hr 4.5 BTU/hr
Off 2.6 BTU/hr 2.5 BTU/hr 2.4 BTU/hr
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for
one hour.
Declared Noise Emissions
Sound Power Sound Pressure
(in accordance with
(LWAd, bels) (LpAm, decibels)
ISO 7779 and ISO 9296)
Typically Configured – Idle 3.1 19
Fixed Disk – Random writes 3.3 20
Optical Drive – Sequential 4.5 23
reads

Features
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the product may include:
Spare parts are available throughout the warranty period and or for up to “5” years after the end of
production.
Batteries This battery(s) in this product comply with EU Directive 2006/66/EC
Batteries used in the product do not contain:

Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell)

Battery type: Lithium
Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -
2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE)
Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking
Water and Toxic Enforcement Act of 1986).
• ENERGY STAR® certified. EPEAT® 2019 registered where applicable. Based on US EPEAT®
registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit
http://www.epeat.net for more information.
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
• This product contains a minimum of 35% post-consumer recycled plastic (by wt.); Including 10%
ITE-derived post-consumer recycled plastic*
• This product is 93.5% recycle-able when properly disposed of at end of life.
*NOTE: Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018 standard.
Packaging Materials External: PAPER/Corrugated 1106 g
PAPER/Molded Pulp 666 g
Internal: PLASTIC/Polyethylene low density - LDPE 40 g
Material Usage This product does not contain any of the following substances in excess of regulatory limits (refer
to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.

Features
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging
materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To
and Recycling recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest
HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for
each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These
instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K
_Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf
Footnotes 1ITE Derived Closed Loop Plastic percentage is based on the definition set in the IEEE 1680.1-2018
standard.
2Percentage of ocean-bound plastic contained in each component varies by product
4Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018
standard.
5Molded pulp cushions are made from 100% recycled wood fiber and organic materials.

Features
SERVICE AND SUPPORT
On-site Warranty1: One-year (1-1-1) limited warranty delivers one years of on-site, next business day2 service for parts and
labor and includes free support 24 x 73. Service offers terms up to 5 years by choosing an optional HP Care Pack. To choose
the right level of service for your HP product, visit HP Care Pack Central: http://www.hp.com/go/cpc.4
1. Terms and conditions may vary by country. Certain restrictions and exclusions apply. Other warranty variations may be offered in your
region.
2. On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider, and is not
available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.
3. Technical telephone support applies only to HP-configured and third-party HP qualified hardware and software. Toll-free calling and 24 x
7 support may not be available in some countries.
4. Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date of hardware
purchase. Restrictions and limitations apply. For details, visit www.hp.com/go/cpc. HP services are governed by the applicable HP terms and
conditions of service provided or indicated to Customer at the time of purchase. Customer may have additional statutory rights according to
applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty
provided with your HP Product.
CERTIFICATION AND COMPLIANCE

Certification and Compliance
Environmental Sustainability questions concerning:

• Ecolabels (EPEAT, TCO, etc.)
• ENERGY STAR, California Energy Commission (CEC)
• Compliance with Environmental legislation (EU ErP, China CECP, EU RoHS and other countries)
• Supply Chain Social Environmental Responsibility (SER) (conflict minerals; human rights, etc.)
• Product specific environmental features (material content, packaging content, recycled content, etc.)
• China Energy Label (CEL)
•
Please contact sustainability@hp.com
For country specific Regulatory Compliance approval documents or Regulatory and Safety questions concerning:
• Declarations of Conformity (for self-service, go to https://www.hp.com/uk-
en/certifications/technical/regulations-certificates.html?jumpid=ex_r135_uk/en/any/corp/hpuk-
mu_chev/certificates)
• GS Certificates
• Product Safety Certificates (UL, CB, BIS, etc.)
• EMC Certificates, Declarations of Conformity, or Certificates of Conformity (CE, FCC, ICES, etc.)
• CCC Certificates
• Ergonomics
•
Please contact techregshelp@hp.com
Energy Efficiency Compliance

ENERGY STAR® certified. EPEAT® registered where applicable. EPEAT ® registration varies by country. See http://www.epeat.net
for registration status by country. According to IEEE 1680.1-2018.

Technical Specifications – Processors
PROCESSORS
12th Generation Intel® Core™ Processors
All HP Z1 G9 Tower PC models featuring this technology include processors that are part of the Intel® Stable Image Platform
Program (SIPP) designed to ensure the stability promise inherent in the value proposition of the HP Z1 series G9 Desktop
Business PC.
Intel® Management Engine (ME) v16 – An advanced set of remote management features and functionality which provides
network administrators the latest and most effective tools to remotely discover, heal, and protect networked client systems
regardless of the system's health or power state. AMT 16 includes the following advanced management functions:
• Support for configuration of Intel ME 16.0 capabilities

• No reset after provisioning
• Support for Intel Enterprise Digital Fence
• The Platform Discovery Utility can now discover these additional Intel products:
o Public Key Infrastructure
• Profile Editor and Profile Editor Plugin Interface
• Required Permissions for Solutions Framework

Technical Specifications – Graphics
GRAPHICS
Intel® UHD Graphics (integrated)
VGA Controller Integrated
DisplayPort™ Multimode capable; supports HDCP, Display Port Audio (2 streams), Onboard support HBR2
link rates/option DP support to HBR3 and Multi-Stream Technology for a maximum of 4
displays connected to any output controlled by Intel® Graphics
HDMI (onboard / optional) Supports HDMI 2.0b features (onboard HDMI support HDMI1.4; Option HDMI support
HDMI2.0b)
Supports HDCP 2.3 (Support HDCP 1.4/2.3)
Supports audio over HDMI
VGA (optional) VGA output
USB-C® DP Alt Mode (optional) DisplayPort™ over the optional USB-C® module (Support DP1.4 HBR2)
Memory The actual amount of maximum graphics memory can be >4GB. System memory is allocated
for graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide an
optimal balance between graphics and system memory use.
Maximum Color Depth up to 16 bits/color
Graphics/Video API Support HEVC 10b Enc/12b Dec HW
VP9 12b Dec HW à AV1 decode support 8/10b, 4:2:0

HDR
Rec. 2020
DX12
Max. Resolution (VGA Option) 2048 x 1536@60Hz
Max. Resolution (Onboard 1920 x 1080@60Hz
HDMI)
Max. Resolution (Option 3840 x 2160@60Hz
HDMI)
Max. Resolution (On board DP) 3840 x 2160@60Hz
Max. Resolution (Option DP) 5120 x 2280@60Hz
NVIDIA® GeForce® RTX 3060 LHR Graphics Card

Engine Clock 1320 MHz
Memory Clock 1875 MHz
Memory Size(width) 12 GB (256-bit)
Memory Type 256M x 32 GDDR6
Max. Resolution (HDMI) 7680x4320@60Hz
Max. Resolution (DP) 7680x4320@60Hz
Multi Display Support 4 displays
HDCP Compliance Yes
Rear I/O connectors (bracket) HDMIx1+ DPx3
Cooling (active/passive) Active fan-sink (Active cooling with dynamic speed)
Total power consumption (W) 170W
PCB form-factor with bracket ATX (Full height) PCB with ATX dual slot bracket
NVIDIA® GeForce® RTX 3070 LHR Graphics Card

Memory Size(width) 8 GB (256-bit)

Technical Specifications – Graphics

Max. Resolution (HDMI) 7680x4320@60Hz
HDCP Compliance Yes
Rear I/O connectors (bracket) HDMIx1+ DPx3
Total power consumption (W) <220W
PCB form-factor with bracket ATX (Full height) PCB with ATX dual slot bracket

Memory Size (width) 2GB (64-bit)
HDCP Compliance Yes
Rear I/O connectors (bracket) mDPx3

Memory Size (width) 4GB (64-bit)
HDCP Compliance Yes
Rear I/O connectors (bracket) mDPx3
PCB form-factor with bracket LP PCB with LP bracket

Technical Specifications – Storage
STORAGE
500 GB 7200RPM 3.5in SATA HDD
Capacity 500 GB
Rotational Speed 7,200 rpm
Interface SATA 6.0 Gb/s
Buffer Size 32 MB
Logical Blocks 976,773,168
Seek Time 11 ms (Average)
Height 1 in/2.54 cm
Width Media diameter: 3.5 in/8.89 cm
Physical size: 4 in/10.2 cm
Operating Temperature 41° to 131° F (5° to 55° C)
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB of system disk (for Windows) is
reserved for system recovery software.
1 TB 7200RPM 3.5in SATA HDD

Capacity 1 TB
Interface SATA 6 Gb/s
Buffer Size 64 MB
Logical Blocks 1,953,525,168
Height 1 in/2.54 cm
Width (nominal) Media diameter: 3.5 in/8.89 cm
Physical size: 4 in/10.2 cm

Capacity 2 TB
Buffer Size 128 MB
Height 1.028 in/26.11 mm
Width (nominal) Media diameter: 3.5 in/88.9 mm
Physical size: 4 in/102 mm

500 GB 7200RPM 2.5in SATA HDD

Capacity 500 GB
Buffer Size Up to 128 MB
Height 0.283 in/7.2 mm (Max.)
Width (nominal) 2.75 in/70 mm (nominal)

Capacity 1 TB
Buffer Size Up to 128 MB

Capacity 2 TB
Buffer Size 128 MB
Height 0.374 in/9.5 mm (nominal)


500 GB 7200RPM 2.5in Self Encrypted OPAL2 SATA HDD
Capacity 500 GB
Architecture Self-Encrypting (SED) Solid State Drive with SATA interface
Buffer Size 128 MB
Width 2.75 in/70 mm (nominal)
256 GB M.2 2280 PCIe NVMe SSD

Drive Weight < 10g
Capacity 256 GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Interface PCIe NVMe
Maximum Sequential Read 3200 MB/s ±20%
Maximum Sequential Write 2000 MB/s ±20%
Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp]
Features TRIM; L1.2


512 GB M.2 2280 PCIe NVMe SSD
Drive Weight < 10g
Capacity 512 GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Interface PCIe NVMe
Features TRIM; L1.2
1 TB M.2 2280 PCIe NVMe SSD

Drive Weight < 10g
Capacity 1 TB
Height 2.3 mm
Length 80 mm
Width 22 mm
Interface PCIe NVMe
Features TRIM; L1.2
256 GB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 256 GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Interface PCIE Gen4x4
Features TRIM; L1.2; Pyrite 2.0

512 GB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 512 GB
Height 2.3 mm
Length 80 mm
Width 22 mm
1 TB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 1 TB
Height 2.3 mm
Length 80 mm
Width 22 mm
2 TB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 2 TB
Height 2.3 mm
Length 80 mm
Width 22 mm

256 GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD
Drive Weight < 10g
Capacity 256 GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Features TRIM; L1.2; TCG Opal 2.0
512 GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD
Drive Weight < 10g
Capacity 512 GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Features TRIM; L1.2; TCG Opal 2.0
OPTICAL DISC DRIVES

HP 9.5mm Slim DVD-ROM Drive
Height 9.5 mm height
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Dimensions (W x H x D) 5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max) Up to 0.31 lb (140g) without bezel
Read Speeds DVD+R/-R/+RW/
-RW/+R DL /-R DL Up to 8X
DVD-ROM Up to 8X
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
Access time Random: DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)


(typical reads, including Full stroke: DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
settling)
Power Source Slimline SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions Temperature 41° to 122° F (5° to 50° C)
(operating - non-condensing) Relative Humidity 10% to 80%
Maximum Wet Bulb Temperature 84° F (29° C)
HP 9.5mm Slim DVD Writer Drive

Height 9.5 mm height
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Disc recording capacity Up to 8.5 GB DL or 4.7 GB standard
Dimensions (W x H x D) 5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max) 0.31 lb (140 g)
Write Speeds DVD-R DL - Up to 6X
DVD+R - Up to 8X
DVD+RW - Up to 8X
DVD+R DL - Up to 6X
DVD-R - Up to 8X
DVD-RW - Up to 6X
CD-R - Up to 24X
CD-RW - Up to 10X
DVD-RW, DVD+RW - Up to 8X
Read Speeds DVD-R DL, DVD+R DL - Up to 8X
DVD+R, DVD-R - Up to 8X
DVD-ROM DL, DVD-ROM - Up to 8X
CD-ROM, CD-R - Up to 24X
CD-RW - Up to 24X
Access time Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
(typical reads, including Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
settling) Stop Time 6 seconds (typical)
Power Source Slimline SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions Temperature 41° to 122° F (5° to 50° C)
(operating - non-condensing) Relative Humidity 10% to 80%
Maximum Wet Bulb Temperature 84° F (29° C)

Technical Specifications – Networking and Communications
NETWORKING AND COMMUNICATIONS

Intel® I219-LM 1 Gigabit Network Connection LOM (vPro®)
Connector RJ-45
System Interface PCI (Intel proprietary) + SMBus
Data rates supported 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
IEEE Compliance IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE (Energy Efficient Ethernet)
Performance TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling (Hash Mode Only)
Jumbo Frame 9K
Power consumption Cable Disconnection: 25mW
100Mbps Full Run: 450mW
1000bp Full Run: 1000mW
WoL Enable(S3/S4/S5): 50mW
WoL Disable(S3/S4/S5): 25mW
Power ACPI compliant – multiple power modes
Management Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power consumption
Management Interface Auto MDI/MDIX Crossover cable detection
IT Manageability Wake-on-LAN from modern standby or sleep state (Magic Packet and Microsoft Wake-Up Frame);
Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Security & Manageability Intel® vPro® support with appropriate Intel® chipset components
Intel® I225-LM 2.5 Gigabit Network Connection LOM (non-vPro®)

Connector RJ-45
System Interface PCI (Intel proprietary) + SMBus
Data rates supported 1. 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
2. 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
3. 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 802.3 clauses 40)
4. 2.5 Gbit/s operation(2.5GBASE-T; IEEE 802.3bz Clause 126)
5. Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10, 100 & 1000 Mbit/s
IEEE Compliance IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE (Energy Efficient Ethernet)
IEEE 802.3i 10BASE-T
IEEE 802.3u 100BASE-TX
IEEE 802.3ab 1000BAE-T
IEEE 802.3bz 2.5GBASE-T


Performance TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling (Hash Mode Only)
Jumbo Frame 9K
Power consumption Cable Disconnection: 25mW
100Mbps Full Run: 450mW
1000bp Full Run: 1000mW
WoL Enable(S3/S4/S5): 50mW
WoL Disable(S3/S4/S5): 25mW
Power ACPI compliant – multiple power modes
Management Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power consumption
Management Interface Auto MDI/MDIX Crossover cable detection
IT Manageability Wake-on-LAN from modern standby or sleep state (Magic Packet and Microsoft Wake-Up Frame);
Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Security & Manageability Intel® non-vPro® support with appropriate Intel® chipset components
Realtek RTL8852BE 802.11ax 2x2 Wi-Fi + BT5.3 (802.11ax 2x2, supporting gigabit data rate)1
Wireless LAN Standards IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified modules
Frequency Band 802.11b/g/n/ax
• 2.402 – 2.482 GHz
802.11a/n/ac/ax
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac: max 866.7Mbps
• 802.11ax: max 1201Mbps
Modulation Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
Security2 • IEEE and WiFi certified 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware


• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models
Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power3 • 802.11b : +18.5dBm minimum
• 802.11g : +17.5dBm minimum
• 802.11a : +18.5dBm minimum
• 802.11n HT20(2.4GHz) : +15.5dBm minimum
• 802.11n HT40(2.4GHz) : +14.5dBm minimum
• 802.11n HT20(5GHz) : +15.5dBm minimum
• 802.11n HT40(5GHz) : +14.5dBm minimum
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
• 802.11ax HE40(2.4GHz) : +10dBm minimum
• 802.11ax HE80(5GHz) : +10dBm minimum
Power Consumption • Transmit mode :2.5 W
• Receive mode :2 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode :50 mW (WLAN unassociated)
• Connected Standby/Modern Standby: 10mW
• Radio disabled: 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity4 802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum
802.11a/g, 6Mbps : -86dBm maximum
802.11a/g, 54Mbps : -72dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11n, MCS15 : -64dBm maximum
802.11ac, MCS0 : -84dBm maximum
802.11ac, MCS9 : -59dBm maximum
•802.11ax, MCS11(HE40): -57dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN
MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 126: 1.3g
Operating Voltage 3.3v +/- 9%
Temperature Operating: 14° to 158° F (–10° to 70° C)
Non-operating: –40° to 176° F (–40° to 80° C)
Humidity Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude Operating: 0 to 10,000 ft (3,048 m)
Non-operating: 0 to 50,000 ft (15,240 m)


LED Activity LED Amber – Radio OFF;
LED OFF – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2/5.3 Wireless Technology
Frequency Band 2402 to 2480 MHz
Number of Available Channels Legacy: 0~79 (1 MHz/CH)
BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or
864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
transmit power of + 4 dBm for BR and EDR.
Power Consumption Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Electrical Interface Microsoft Windows Bluetooth Software
Bluetooth® Software Supported Microsoft Windows ACPI, and USB Bus Support
Link Topology
Power Management FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Certifications ETS 300 328, ETS 300 826
Low Voltage Directive IEC950
UL, CSA, and CE Mark

Peak (Tx): 330 mW
Peak (Rx): 230 mW
Power Management Microsoft Windows Bluetooth Software
Certifications
Bluetooth Profiles Supported BT4.1-ESR 5/6/7 Compliance
LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
BT5.1


ESR9/10 Compliance
LE Advertisement Extensions
Channel Selection Algo
Limited High Duty Cycle Non-Connectable Advertising
2Mbps LE
LE Long Range
1. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a wireless
router, sold separately, that supports 80MHz and higher channels. Wireless access point and Internet service required and sold separately.
Availability of public wireless access points limited. Wi-Fi 6 (802.11ax) is backwards compatible with prior 802.11 specs.
2. Check latest software/driver release for updates on supported security features.
3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of transmitting must
fully comply with requirements of 15.247 or otherwise disable those channels.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM
modulation).
Intel AX211 Wi-Fi 6E +BT 5.3 M.2 160MHz CNVi WW WLAN1

IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified
• 2.402 – 2.482 GHz
802.11a/n/ac/ax
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
• 5.955 – 6.415 GHz
• 6.435 – 6.515 GHz
• 6.535 – 6.875 GHz
• 6.895 – 7.115 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac: 1733Mbps
• 802.11ax : max 2.4Gbps
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM

, 1024QAM
Security2 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only


• IEEE 802.11i
• WAPI
Models
Output Power3 • 802.11b: +17dBm minimum
• 802.11g: +16dBm minimum
• 802.11a: +17dBm minimum
• 802.11n HT20(2.4GHz) : +14dBm minimum
• 802.11n HT20(5GHz) : +14dBm minimum
• 802.11ac VHT80(5GHz) : +10dBm minimum
Power Consumption • Transmit mode 2.0 W
• Receive mode 1.6 W
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Receiver Sensitivity4 •802.11b, 1Mbps : -93.5dBm maximum
•802.11b, 11Mbps : -84dBm maximum
• 802.11a/g, 6Mbps : -86dBm maximum
• 802.11n, MCS07 : -67dBm maximum
• 802.11ac, MCS0(VHT80) : -84dBm maximum
• 802.11ac, MCS9(VHT160) : -58.5dBm maximum
•802.11ax, MCS11(HE160): -53.5dBm maximum
2. Type 1216: 1.67 x 12.0 x 16.0 mm
2. Type 1216: 1.3g


LED Activity LED Amber – Radio OFF; LED OFF – Radio ON
BLE: 0~39 (2 MHz/CH)
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or
transmit power of + 9.5 dBm for BR and EDR.
Peak (Rx): 230 mW
Bluetooth® Software Supported Microsoft Windows Bluetooth Software
Link Topology
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications

LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)
BT5.2
ESR9/10 Compliance


2Mbps LE
LE Long Range
modulation).


Intel AX211 Wi-Fi 6E +BT 5.3 M.2 vPro® 160MHz CNVi WW WLAN1
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified
• 2.402 – 2.482 GHz
802.11a/n/ac/ax
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
• 5.955 – 6.415 GHz
• 6.435 – 6.515 GHz
• 6.535 – 6.875 GHz
• 6.895 – 7.115 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac: 1733Mbps
• 802.11ax: max 2.4Gbps
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM

, 1024QAM
Security2 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
• IEEE 802.11i
• WAPI
Models
Output Power3 • 802.11b : +17dBm minimum
• 802.11g : +16dBm minimum
• 802.11a : +17dBm minimum


Power Consumption • Transmit mode 2.0 W
• Receive mode 1.6 W
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Receiver Sensitivity4 •802.11b, 1Mbps : -93.5dBm maximum
•802.11b, 11Mbps : -84dBm maximum
• 802.11ac, MCS9(VHT160) : -58.5dBm maximum
•802.11ax, MCS11(HE160): -53.5dBm maximum
2. Type 1216: 1.67 x 12.0 x 16.0 mm
2. Type 1216: 1.3g
LED Activity LED Amber – Radio OFF; LED OFF – Radio ON
BLE : 0~39 (2 MHz/CH)
BLE : 1 Mbps data rate; throughput up to 0.2 Mbps


Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or
transmit power of + 9.5 dBm for BR and EDR.
Peak (Rx): 230 mW
Bluetooth® Software Supported Microsoft Windows Bluetooth Software
Link Topology
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Power Management ETS 300 328, ETS 300 826
Certifications

LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)
BT5.2
ESR9/10 Compliance
2Mbps LE
LE Long Range
modulation).

Technical Specifications – Input/Output Devices
I/O DEVICES
HP Business Slim Standalone USB/PS2 Wired Keyboard

Physical Characteristics Keys 104, 105, 106, 107, 109 layout (depending upon country)
Dimensions 171.97 x 68.35 x 8.27 in (436.8± 1.5 x 137.6± 1.0 x 21.0±
(L x W x H) 1.0 cm)
Weight 1.32 lb (0.6± 0.08 kg)
Electrical Operating voltage 4.4-5.25VDC
Power consumption 50-mA maximum (with 5 VDC power supplied and three
LEDs ON)/
System interface USB or PS/2
ESD Contact Discharge: 2, 4,6,8KV
Air Discharge: 2, 4, 8,10,12.5KV
EMI - RFI Conforms to FCC rules for a Class B computing device
Mechanical Keycaps Low-profile design
Switch actuation 60±12.5g nominal peak force with tactile feedback
Switch life 10 million keystrokes (Life tester)
Switch type Contamination-resistant switch membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 6 ft (1.8 m)
Environmental Acoustics 43-dBA maximum sound pressure level
Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature Minus 30 degrees to 60 degrees Celsius
Operating humidity 10% to 90% (non-condensing at ambient)
Non-operating humidity 20% to 80% (non-condensing at ambient)
Operating shock 40 g, six surfaces
Non-operating shock 80 g, six surfaces
Operating vibration 2-g peak acceleration
Non-operating vibration 4-g peak acceleration
Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence
Drop (in box) 30 in (76.2 cm) on concrete, 16-drop sequence
Approvals UL, FCC, CE Mark, TUV GS, VCCI, BSMI, RCM, KCC
Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS
HP USB Business Slim Wired SmartCard CCID Keyboard

Physical Characteristics Keys 104, 105, 109 layout (depending upon country)


Dimensions 17.34 x 5.68 x 0.78in (440.6 x 144.5 x 1.98 cm)
(L x W x H)
Weight 1.32 lb (598g)
Electrical Operating voltage 5 VDC, +/-5%
Power consumption 100mA (All LED on)
System interface USB Type A plug connector
ESD Contact Discharge: 8 KV Air Discharge: 12.5 KV
Switch actuation 60±10g nominal peak force with tactile feedback
Non-operating temperature -22° to 140° F (-30° to 60° C)
Approvals CE Marking, TUV, EAC, FCC, cULus/CSAus, ICES, RCM, VCCI, KCC, BSMI
Ergonomic compliance ISO 9241-4, TUVGS
HP 125 (AntiMicrobial) Wired Keyboard (China only)

Physical Characteristics Keys 104/105/107/109layout (depending upon country)
Dimensions 436 x 138 x24.7 mm
(L x W x H)
Weight 471g
Electrical Operating voltage 5V +- 5%
Power consumption 50mA
System interface USB Type A plug connector


ESD Contact Discharge: 8 KV Air Discharge: 12.5 KV
Switch actuation 55±10g nominal peak force with tactile feedback
Cable length 1.8 m
Approvals UL, cUL, FCC, CE, TUV GS, VCCI, BSMI, RCM, KCC, USB-IF, WHQL, EN/IEC 60601-1
Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS
HP 655 wireless Keyboard

Physical Characteristics Keys 104, 105, 107,109 layouts
Dimensions 16.86 x 4.55 x 0.71 in (428.22 x 115.47 x 18.06 mm)
(L x W x H)
Weight 0.96 lb (435g)
Power consumption 20 mA Max (All LED on)
System interface 2.4GHz Wireless
ESD Contact Discharge: 8 KV Air Discharge: 15 KV
Mechanical Keycaps Plunger, 2.0 mm key travel
Key actuation 60±10g nominal peak force with tactile feedback
Key life 10 million keystrokes (Life tester)
Key structure type Rubber dome & Membrane


Environmental Operating temperature 50° to 122° F (10° to 50° C)
Approvals CB, CE, FCC, cULus, ICES, IC, I TRC, TRA, CASA, UA, EAC, CNC, ANATEL, NOM-NYCE
SCT, IFETEL, MPTC, RCM, BIS, PosTel, VCCI, TELEC, KC, MCMC, IDA, BSMI, NCC,
DWLF&M, TP-BY, MOC
Ergonomic compliance TUVGS
HP Wired Desktop 320K Keyboard

Keys 104, 105, 107,109 layouts
Physical Characteristics Dimensions (L x W x H) 18.86*4.55*0.66 in (426.2 x 110.9 x 16.7 mm)
Weight 1.00 lb(452g)
Operating voltage 5 VDC, +/-5%
Power consumption 50 mA Max (All LED on)
Electrical System interface USB Port

ESD Contact Discharge: 8 KV Air Discharge: 15 KV (Class B)
European Standard EN 55022: 2006+A1: 2007, Class B.
EMI - RFI
FCC/CFR 47: Part 15 Class B
Mechanical Keycaps 2.0mm +/-0.2mm at 120gf Key travel
Operating temperature 10° C to 90° C
Non-operating temperature -30° C to 95° C
Environmental Operating humidity N/A
Operating shock N/A

i. Half-Sine Shock – End-Use Handling, Non-Operational

Sample size: 5pcs.
Condition: Sample power off.
Axis: X, Y, Z axis (all 6 faces) – sample normal mode of operation.
Number of shocks: 1 shock/face.
Pulse duration: < 3 ms
Velocity change: 50lps (inch-per-second)- 65lps desired.
ii. Trapezoidal Shock- Transportation Environment, Non-Operational

Non-operating shock
Sample size: 5pcs.
Orientation: All six faces: Front, Rear, Left, Right, Bottom, and Top.
Configuration: As intended for shipment
Minimum faired acceleration: 30G’s. Test also at 40 and 50G’s to find
margin.
Velocity change: 266lps (inch-per-second) for product mass (m)
20<m<40lbs.
Frequency (Hz) Slope (dB/oct) PSD (g2/Hz)

5-350 0 0.0001
Operating vibration 350-500 -6 -
500 - 0.00005
(~0.21Gnms)
Total Test time: 10 minutes
5.100 0 0.015
Non-operating vibration 100-137 -6 -
137-350 0 0.008
350-500 -6 -
500 - 0.0039
Drop (out of box) 76cm on carpet, six-drop sequence
10 times drop including 6 faces, one corner and 3 edges on rigid surface.
Drop (in box)
Drop Height: 91cm
Approvals CB, CE, FCC, ICES, EAC, NOM-NYCE SCT, RCM, BIS, VCCI, KC, BSMI
HP Wired Desktop 320M Mouse

Keys Left/right key
Physical Characteristics Dimensions (L x W x H) 4.09 x2.50 x 1.40 in (103.8x 63.4 x 35.5 mm)
Weight 0.16 lb(72g)
Operating voltage 5 VDC, +/-0.25V
Power consumption 100 mA Max
Electrical System interface USB Port

ESD Contact Discharge: 8 KV Air Discharge: 15 KV (Class B)
European Standard EN 55022: 2006+A1: 2007, Class B.
EMI - RFI
FCC/CFR 47: Part 15 Class B


Keycaps 0.3mm key travel
Key actuation 75±20g
Mechanical Key life 1million cycles
Key structure type Tact Switch
Key-leveling mechanisms N/A
Operating temperature 10° to 90° C
Non-operating temperature -30° C to 95° C
Operating humidity N/A
Operating shock N/A
i. Half-Sine Shock – End-Use Handling, Non-Operational
Sample size: 5pcs.
Axis: X, Y, Z axis (all 6 faces) – sample normal mode of operation.
Pulse duration: < 3 ms
Velocity change: 50lps (inch-per-second)- 65lps desired.
ii. Trapezoidal Shock- Transportation Environment, Non-Operational

Non-operating shock
Sample size: 5pcs.
Orientation: All six faces: Front, Rear, Left, Right, Bottom, and Top.
Configuration: As intended for shipment
Environmental Number of shocks: 1 shock/face.
Minimum faired acceleration: 30G’s. Test also at 40 and 50G’s to find
margin.
Velocity change: 266lps (inch-per-second) for product mass (m)
20<m<40lbs.
5-350 0 0.0001
Operating vibration 350-500 -6 -
500 - 0.00005
(~0.21Gnms)
Total Test time: 10 minutes
5.100 0 0.015
Non-operating vibration 100-137 -6 -
137-350 0 0.008
350-500 -6 -
500 - 0.0039
Drop (out of box) 76cm on carpet, six-drop sequence
Drop (in box) N/A
Approvals CB, CE, FCC, cULus, ICES, EAC, NOM-NYCE SCT, RCM, VCCI, KC, BSMI

HP 655 wireless Mouse

Dimensions (H x L x W) 4.74 x 2.75 x 1.63 in (120.29 x 69.97 x41.39 mm)
Weight 0.194lb (88g)
Power consumption (typical) 10 mA Max
Resolution 1,200 DPI (Default)
Sensor Pixart PAW3222DB-TJDS
Tracking speed 10G(max), 1G=9.8m/s2
Tracking acceleration 2.4GHz Wireless
Mechanical Color Jack Black
Regulatory approvals Compliant CB, CE, FCC, cULus, ICES, IC, TRC, TRA, ICASA, UA, EAC, CNC,
ANATEL, NOM-NYCE SCT, IFETEL, MPTC, RCM, PosTel, VCCI,
TELEC, KC, MCMC, IDA, BSMI, NCC, DWLF&M, TP-BY, MOC
Ergonomic compliance Compliant TUVGS
HP PS/2 Mouse
Dimensions (H x L x W) 4.53 x 2.48 x1.46 in (115.2x 63 x37 mm)
Weight 0.22lb (101.6g)
Non-operating temperature (-4° to 140° F) (-20° to 60° C)
Electrical Tracking speed 30 inch/sec (max)
Tracking acceleration 8G(max), 1G=9.8m/s2
System interface PS/2
Mechanical Switch actuation 60±15g nominal peak force with tactile feedback


Color Jack Black
Regulatory approvals Compliant UL, FCC, CE Mark, TUV GS, VCCI, BSMI, RCM, KCC
HP USB 125 (Antimicrobial)/128 Laser Mouse (China only)

Dimensions (H x L x W) 112 x 63 x 36.2 mm (L x W x H)
Weight 85 g
Power consumption (typical) 100mA
Resolution 1,200 DPI
Sensor Optical/ Laser USB mouse sensor
Tracking speed 30 inch/sec (max)
Tracking acceleration 8G(max), 1G=9.8m/s2
Mechanical Connector USB
Color Jack Black
Regulatory approvals Compliant UL, FCC, CE Mark, TUV GS, VCCI, BSMI, RCM, KCC, EAC

Technical Specifications – Audio/Multimedia
AUDIO/MULTIMEDIA
Type Integrated
HD Stereo Codec Realtek ALC 3252
Audio I/O Ports Front: Headset connector supports a CTIA and OMTP style headset and is re-taskable as a Line-in,
Line-out, Microphone-in or Headphone-out port
Rear: Line-out, Line-in*, 3.5mm and support stereo and retasking
Internal Speaker Amplifier 2W class D mono amplifier for the internal speaker only. External speakers must be powered
Multi-streaming Capable Playback multi-streaming can be enabled in the audio control panel to allow independent audio
streams to be sent to/from the front and rear jacks or integrated speaker.
Sampling Independent sampling rates for DAC’s and ADC’s; supports resolutions from 16 to 24-bit; 44.1 kHz
to 192 kHz for DAC and 44.1 kHz to 192 kHz for ADC
Wavetable Syntheses Yes - Uses OS soft wavetable
Analog Audio Yes
# of Channels on Line-Out Stereo (Left & Right channels)

Technical Specifications – Integrated Webcam and Microphone
INTEGRATED WEBCAM AND MICROPHONE

Integrated Webcam and Microphone
Optional integrated 5 MP Swivel Webcam with integrated dual array digital microphones
Optional integrated 5 MP Swivel Webcam + IR Sensor + Color Light Sensor with integrated dual array digital microphones (Supports
Windows Hello)
Optional integrated 16MP binned Swivel Webcam + IR Sensor + Color Light Sensor + Time of Flight Sensor (TOF) (Supports Windows
Hello)
NOTE: All HP devices which carry the Bang & Olufsen brand are custom-tuned with Bang & Olufsen’s acoustical engineers for precise sound
experience in business use.
INTEGRATED FINGERPRINT SENSOR

Sensor type: Touch
Fingerprint matching: Performed on device
Anti-Spoofing: Yes
Windows Hello Support: Yes
Encryption: On sensor
FIPS Compliant: No

Technical Specifications – Power
POWER
Unit Environment and Operating Conditions
Temperature Range Operating: 5°C ~35°C
Non-Operating: -40°C ~66°C
Relative Humidity Operating 5% to 90% relative humidity at max inlet temperature
Non-Operating 5% to 90% relative humidity at max inlet temperature
Maximum Altitude Operating: 5000m
(unpressurized) Non-operating: 50,000 ft. (15240 m)
80 PLUS Platinum 550W active PFC / 80 PLUS Platinum
260W active PFC / 80 PLUS Platinum
400Wactive PFC / 80 PLUS Platinum
90/92/89% efficient at 20/50/100% load (115V)
91/93/90% efficient at 20/50/100% load (230V)
Operating Voltage Range 90Vac~264Vac
Rated Voltage Range 100Vac~240Vac
Rated Line Frequency 50HZ~60HZ
Operating Line Frequency 47HZ~63HZ
Rated Input Current with 260W Platinum≦3.1A
Energy Efficient* Power 400W Platinum≦5.2A
Supply 550W Platinum≦6.6A
DC Output +12V
1. External power supplies, power cords, cables and peripherals are not low halogen. Service parts obtained after purchase may not be low
halogen.
Current Leakage (NFPA 99: Less than 500 microamps of leakage current at 120 Vac with the ground wire disconnected, as
2102) required for Non-patient Electrical Appliances and Equipment used in a patient care facility or that
contact patients in normal use. Per section 10.3.5.1.
Less than 100 microamps of leakage current at 120 Vac with the ground wire intact with normal
polarity, as required for Non-patient Electrical Appliances and Equipment used in a patient care
facility or that contact patients in normal use. Per section 10.3.5.1.
Power Supply Fan 70mm variable speed
Power cord length 6.0 ft. (1.83 m)2
External Power Adapter Internal power supply
Dimensions 165mm x 95mm x 73mm
Total Cord Length 6.0 ft. (1.83 m)
1. Power cord length will be varied from different type of cords start from 1.8m.
2. The length of India power cord is 2.0m

Technical Specifications – Power
Condition Standard Efficiency 82/85/82% 85/88/85% 87/90/87% 90/92/89% Input Voltage

10% of Rated
- 75% 81% 84% 86% 115Vac/60HZ
Load
20% of Rated
- 82% 85% 87% 90% 115Vac/60HZ
Load
50% of Rated - 85% 88% 90% 92% 115Vac/60HZ
Load PF>0.9 PF>0.9 PF>0.9 PF>0.9 PF>0.95
100% of Rated 70% 82% 85% 87% 89% 115Vac/60HZ
Load PF>0.9 PF>0.9 PF>0.9 PF>0.9 PF>0.9 230Vac/50HZ

Technical Specifications – Miscellaneous Features
WEIGHTS & DIMENSIONS

Chassis (W x D x H) 6.1 x 12.13 x 13.27 in
155 x 308 x 337 mm
System Volume 981.9 cu in
16.1 L
System Weight 13.56 lb
6.15 kg
Max Supported Weight 77.16 lb
(desktop orientation) 35 kg
Stand Dimensions N/A
Packaging (W x D x H) 15.75 x 19.65 x 11.30 in
(400 x 499 x 287 mm)
MPP: 15.75 x 19.65 x 11.30 in
(400 x 499 x 287 mm)
Shipping Weight 19.54 lbs (8.87 kg)
MPP: 20.35 lbs (9.24kg)
Multipack 6-units per layer
Packaging 8 layer max
(10 units) 48 per pallet
47.24 x 39.37 x 95.12 in, 1200 x 1000 x 2416 mm (including pallet)
Palletization Profile 6-units per layer
8 layer max
48 per pallet
47.24 x 39.37 x 95.12 in, 1200 x 1000 x 2416 mm (including pallet)

MISCELLANEOUS FEATURES
Management Features
• Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode.
Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or
powered-off state without affecting other elements of the system.
• Intel® Wired for Management support; industry wide initiative to make Intel® architecture based PCs, servers and mobile
computers more inherently manageable out-of-the-box and over the network
• Dual State Power Button; acts as both an on/off button and a suspend-to-sleep button
Serviceability Features
• Dual colored power LED on front of computer to indicate either normal or fault condition
• Diagnostic LED Explanation Table:
o Power LED will blink red 2 to 5 times, then blink white 2 or more times, then repeat (with beep tones for each blink
initially):
▪ 2 red + 2 white User must provide file for BIOS recovery (USB storage typically)
▪ 2 red + 3 white User must enter a key sequence to proceed with recovery by policy
▪ 2 red + 4 white BIOS recovery is in progress
▪ 3 red + 2 white Memory could not be initialized
▪ 3 red + 3 white Graphics adaptor could not be found
▪ 3 red + 4 white Power supply failure / not connected
▪ 3 red + 5 white Processor not installed
▪ 3 red + 6 white Current processor does not support an enabled feature
▪ 4 red + 2 white Processor has exceeded its temperature threshold / system thermal shutdown
▪ 4 red + 3 white System internal temperature has exceeded its threshold
▪ 5 red + 2 white System controller firmware is not valid
▪ 5 red + 3 white System controller detected BIOS is not executing
▪ 5 red + 4 white BIOS could not complete initialization / PCA failure
▪ 5 red + 5 white System controller rebooted the system after a health or recovery timer triggered
• HP PC Hardware Diagnostics UEFI:
o This utility enables hardware level testing outside the operating system on many components. The diagnostics
can be invoked by pressing F2 at POST, and is available as a download from HP Support
• System/Emergency ROM
• Flash ROM
• CMOS Battery Holder for easy replacement
• 1 Aux Power LED on System PCA
• Processor ZIF Socket for easy Upgrade
• Over-Temp Warning on Screen (Requires IM Agents)
• DIMM Connectors for easy Upgrade
• Clear CMOS Button
• NIC LEDs (integrated) (Green & Amber)
• Dual Color Power and HD LED - To Indicate Normal Operations and Fault Conditions
• Color coordinated cables and connectors
• Tool-less Hood Removal
• Front power switch
• System memory can be upgraded without removing the system board or any internal components
• Tool-less Hard Drive, CD & Diskette Removal (For MT, SFF, and DM only)
• Green Pull Tabs, and Quick Release Latches for easy Identification


Additional Features Description
Tower Orientation Product can be oriented as either a desktop (horizontal) or a tower (vertical)
Drive Lock Implementation of the industry standard ATA Security feature set. When enabled, it
prevents software access to user data on the drive until one or two user-defined
passwords are provided.
Boot Sectors Protection MBR and GPT sectors of the hard drive are critical to booting the operating system. By
saving the MBR or GPT data (depending on the how the OS was installed), the BIOS will
be able to monitor for changes and allow the user to override them with the backup
copy at boot-up.
Drive Protection System DPS Access through F10 Setup during Boot (for SATA hard drive only)
A diagnostic hard drive self- test. It scans critical physical components and every
sector of the hard drive for physical faults and then reports any faults to the user
Running independently of the operating system, it can be accessed through a
Windows-based diagnostics utility or through the computer's setup procedure. It
produces an evaluation on whether the hard drive is the source of the problem and
needs to be replaced
The system expands on the Self-Monitoring, Analysis, and Reporting Technology
(SMART), a continuously running systems diagnostic that alerts the user to certain
types of failures
SMART Technology (Self-Monitoring, Allows hard drives to monitor their own health and to raise flags if imminent failures
Analysis and Reporting Technology) were predicted
SMART I - Drive Failure Prediction Predicts failures before they occur. Tracks fault prediction and failure indication
parameters such as re-allocated sector count, spin retry count, calibration retry count
SMART II - Off-Line Data Collection By avoiding actual hard drive failures, SMART hard drives act as "insurance" against
unplanned user downtime and potential data loss from hard drive failure
SMART III - Off-Line Read Scanning with IOEDC: I/O Error Detection Circuitry
Defect Reallocation
SMART IV - End-to-End CRC for hard drives Detects errors in Read/Write buffers on HDD cache RAM

Technical Specifications – After Market Options
AFTER MARKET OPTIONS

Graphics Solutions Part Number
NVIDIA® T400 2GB GDDR6 3mDP 340K8AA
NVIDIA® T400 4GB GDDR6 3mDP 5Z7E0AA
HP DisplayPort to HDMI True 4k Adapter 2JA63AA
HP DVI Cable Kit DC198A
HP HDMI Standard Cable Kit T6F94AA
HP DisplayPort to VGA Adapter AS615AA
HP DisplayPort to DVI-D Adapter FH973AA
HP USB-C To DisplayPort Adapter N9K78AA
Data Storage Drives

HP PCIe NVME TLC M.2 256GB SSD 1CA51AA
HP PCIe NVME TLC M.2 512GB SSD X8U75AA
HP PCIe Gen 4 NVME TLC M.2 512GB SSD 406L8AA
HP PCIe Gen 4 NVME TLC M.2 1TB SSD 406L7AA
HP 500GB 7200PRM SATA 3.5” Hard Drive QK554AA
HP 1TB 7200rpm SATA 3.5” Hard Drive QK555AA
Input Devices
HP 125 Wired Keyboard 266C9AA
HP 225 Antimicrobial Wired Mouse and Keyboard Combo (China only) 286K3AA
HP 225 Wired Mouse and Keyboard Combo 286J4AA
HP 125 Wired Mouse 265A9AA
HP 128 Laser Wired Mouse 265D9AA
HP Wired Desktop 320K Keyboard 9SR37AA
HP Wired Desktop 320M Mouse 9VA80AA
HP Wired Desktop 320MK Mouse and Keyboard 9SR36AA
HP USB Business Slim CCID SmartCard Keyboard Z9H48AA
HP 655 Wireless Keyboard and Mouse Combo 4R009AA
HP 455 Programmable Wireless Keyboard 4R177AA
HP USB Keyboard and Mouse Healthcare Edition1 1VD81AA
1. Only available in NA/EMEA regions
System Memory Part Number

HP 8GB DDR5-4800 UDIMM 4M9X9AA
HP 16GB DDR5-4800 UDIMM 4M9Y0AA
HP 32GB DDR5-4800 UDIMM 4M9Y2AA
Multimedia Devices Part Number

Technical Specifications – After Market Options

HP S101 Speaker Bar 5UU40AA
HP Stereo 3.5mm Headset G2 428K7AA
HP Stereo USB Headset G2 428K6AA
HyperX Cloud MIX – Gaming Headset (Black-Gunmetal) 4P5K9AA
HyperX Cloud Flight – Wireless Gaming Headset (Black-Red) 4P5L4AA
HyperX Cloud Stinger Core – Gaming Headset (Black) 4P4F4AA
HyperX Cloud Core + 7.1 Gaming Headset (Black) 4P4F2AA
HyperX SoloCast USB WHT Microphone (Black) 4P5P8AA
Security Devices Part Number

HP Business PC Security Lock v3 Kit 3XJ17AA
HP Keyed Cable Lock 10mm T1A62AA
HP Master Keyed Cable Lock 10mm T1A63AA
HP Sure Key Cable Lock 6UW42AA
I/O Devices Part Number

HP DisplayPort Port Flex IO v2 13L54AA
HP Type-C® USB 3.1 Gen2 Port Flex IO v2 13L59AA
HP USB 3.1 Gen1 x2 Module Flex IO v2 13L58AA
HP VGA Port Flex IO v2 13L53AA
HP Serial Port Flex IO v2 13L56AA
HP Internal Serial Port (in rear wall) 3TK82AA
HP PCIe x1 Parallel Port Card N1M40AA
HP Serial/PS/2 Adapter Kit (in PCIe slot) 1VD82AA
HP USB to Serial Port Adapter J7B60AA
HP USB-C to Display Port Adapter N9K78AA
HP USB Type-C Extension Cable Kit (5M) 9JH45AA
HP Serial Port v3 Flex IO 5B895AA
HP HDMI Port Flex IO v2 13L55AA
HP Parallel Port Adapter KD061AA
NOTE: For more detail on HP I/O Devices please refer to the HP FLEX IO Option Cards
QuickSpecs. URL is:
http://h20195.www2.hp.com/v2/GetDocument.aspx?docname=c06042607
Communication Devices Part Number

Intel® Ethernet I225-T1 GbE NIC 406L9AA
Intel Wi-Fi 6 AX200 ax 2x2 + BT5 non-vPro® TBD

© Copyright 2023 HP Development Company, L.P.

The information contained herein is subject to change without notice. The only warranties for HP products are set forth in the
express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an
additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows
are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other countries. Intel, Celeron, Core, Pentium
are registered trademarks or trademarks of Intel Corporation in the U.S. and/or other countries. Bluetooth  is a trademark of its
proprietor, used by HP, Inc. under license. USB Type-C® and USB-C® are trademarks of USB Implementers Forum. NVIDIA, GeForce
and NVS are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. AMD and Radeon are
trademarks of Advanced Micro Devices, Inc. ENERGY STAR is a registered trademark owned by the U.S. Environmental Protection
Agency. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video Electronics Standards Association (VESA®) in
the United States and other countries.
Date Version History Action Description of Change

March 16, 2022 From v1 to v2 Changed Social and Environmental Responsibility section
June 1, 2022 From v2 to v3 Changed Graphics section
July 1, 2022 From v3 to v4 Changed Graphics and AFTER MARKET OPTIONS sections
October 1, 2022 From v4 to v5 Changed AFTER MARKET OPTIONS section
December 7, 2022 From v5 to v6 Changed Format
December 15, 2022 From v6 to v7 Changed GRAPHICS section
March 1, 2023 From v7 to v8 Changed Manageability section
March 30, 2023 From v8 to v9 Changed Processors section


Workstation HP z1 g9 Torre

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QuickSpecs HP Z1 G9 Tower Desktop PC

1. Slim optical drive bay (optional) 6. SD card 4.0 reader (optional)

5. Combo Audio Jack with CTIA and OMTP headset support

Not all configuration components are available in all regions/countries. Page 1

1. Each of the legacy options will occupy one rear slot.

Not all configuration components are available in all regions/countries. Page 2

1. VR Ready is an optional feature which requires supported discrete graphics.

Not all configuration components are available in all regions/countries. Page 3

Not all configuration components are available in all regions/countries. Page 4

Ghz P- Ghz E- Featuring Max

Not all configuration components are available in all regions/countries. Page 5

Not all configuration components are available in all regions/countries. Page 6

1. Requires 550W chassis

Adapters and Cables

Not all configuration components are available in all regions/countries. Page 7

2.5 inch SATA Hard Disk Drives (HDD)**

M.2 PCIe NMVe Solid State Drives (SSD)

Media Card Reader

Not all configuration components are available in all regions/countries. Page 8

Not all configuration components are available in all regions/countries. Page 9

Keyboard and Mouse Combo

Not all configuration components are available in all regions/countries. Page 10

Standard User Accessible Ports

Type-A SuperSpeed USB 10 Gbps signaling rate port

Type-C® SuperSpeed USB 20Gbps signaling rate port

Video 2 DisplayPort™ 1.4a

(1) Flexible Port 1, choice of one of the following…

Not all configuration components are available in all regions/countries. Page 11

2. Occupies a PCIe slot. Available in Q3, 2021.

Not all configuration components are available in all regions/countries. Page 12

Not all configuration components are available in all regions/countries. Page 13

Not all configuration components are available in all regions/countries. Page 14

Not all configuration components are available in all regions/countries. Page 15

UNIT ENVIRONMENT AND OPERATING CONDITIONS

Temperature Range Operating: 50° to 95° F (10° to 35° C)1

Not all configuration components are available in all regions/countries. Page 16

Sustainable Impact • 45% post-consumer recycled plastic

Not all configuration components are available in all regions/countries. Page 17

Batteries used in the product do not contain:

Battery size: CR2032 (coin cell)

Not all configuration components are available in all regions/countries. Page 18

Not all configuration components are available in all regions/countries. Page 19

CERTIFICATION AND COMPLIANCE

Environmental Sustainability questions concerning:

Energy Efficiency Compliance

Not all configuration components are available in all regions/countries. Page 20

Technical Specifications – Processors

• Support for configuration of Intel ME 16.0 capabilities

Not all configuration components are available in all regions/countries. Page 21

Technical Specifications – Graphics

VP9 12b Dec HW à AV1 decode support 8/10b, 4:2:0

NVIDIA® GeForce® RTX 3060 LHR Graphics Card

NVIDIA® GeForce® RTX 3070 LHR Graphics Card

Not all configuration components are available in all regions/countries. Page 22

Technical Specifications – Graphics

NVIDIA® T400 2GB Graphics Card

NVIDIA® T400 4GB Graphics Card

Not all configuration components are available in all regions/countries. Page 23

Technical Specifications – Storage