RD06HVF1 MitsubishiElectricSemiconductor
RD06HVF1 MitsubishiElectricSemiconductor
RD06HVF1 MitsubishiElectricSemiconductor
com
DESCRIPTION
OUTLINE DRAWING
RD06HVF1 is a MOS FET type transistor specifically 1.3±0.4
designed for VHF RF power amplifiers applications. 9.1±0.7
3.2±0.4
3.6±0.2
12.3±0.6
FEATURES
9±0.4
High power gain:
Pout>6W, Gp>13dB @Vdd=12.5V,f=175MHz
1.2±0.4
4.8MAX
note(3)
12.3MIN
9.3MIN
7.5MIN
0.8±0.15
APPLICATION 1 2 3
For output stage of high power amplifiers in
0.62±0.2
VHF band mobile radio sets. 2.5 2.5
3.1±0.6
PINS
5deg
1:GATE
4.5±0.5
2:SOURCE
3:DRAIN
4:FIN(SOURCE)
9.5MAX
note:
(1)Torelance of no designation means typical value.
Dimension in mm.
RoHS COMPLIANT (2) :Dipping area
RD06HVF1-101 is a RoHS compliant products.
(3) :Copper of the ground work is exposed in case of frame separation.
RoHS compliance is indicate by the letter “G” after the lot
marking.
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This product include the lead in high melting temperature type solders.
How ever,it applicable to the following exceptions of RoHS Directions.
1.Lead in high melting temperature type solders(i.e.tin-lead solder alloys containing more than85% lead.)
ELECTRICAL CHARACTERISTICS
(Tc=25°C, UNLESS OTHERWISE NOTED)
LIMITS UNIT
SYMBOL PARAMETER CONDITIONS
MIN TYP MAX.
IDSS Zero gate voltage drain current VDS=17V, VGS=0V - - 10 uA
IGSS Gate to source leak current VGS=10V, VDS=0V - - 1 uA
VTH www.DataSheet4U.com
Gate threshold Voltage VDS=12V, IDS=1mA 1.9 - 4.9 V
Pout Output power VDD=12.5V, Pin=0.3W, 6 10 - W
ηD Drain efficiency f=175MHz, Idq=0.3A 60 65 - %
Load VSWR tolerance VDD=15.2V,Po=6W(Pin Control) No destroy -
f=175MHz,Idq=0.3A,Zg=50Ω
Load VSWR=20:1(All Phase)
Note : Above parameters , ratings , limits and conditions are subject to change.
TYPICAL CHARACTERISTICS
40 4
30 3
Pch(W)
Ids(A)
20 2
10 1
0 0
0 40 80 120 160 200 0 2 4 6 8 10
AMBIENT TEMPERATURE Ta(°C) Vgs(V)
3 www.DataSheet4U.com Vgs=9V
40
Ciss(pF)
Vgs=8V
Ids(A)
2 30
Vgs=7V
20
1 Vgs=6V
10
Vgs=5V
0
0
0 10 20 30
0 2 4 6 8 10
Vds(V) Vds(V)
60 6
Coss(pF)
Crss(pF)
40 4
20 2
0 0
0 10 20 30 0 10 20 30
Vds(V) Vds(V)
TYPICAL CHARACTERISTICS
50 100 14 100
Ta=+25°C Po
f=175MHz Po
12 90
Vdd=12.5V
40 80
Po(dBm) , Gp(dB) , Idd(A)
Idq=0.3A
10 80
Pout(W) , Idd(A)
30 ηd 60 8 70
ηd(%)
ηd(%)
ηd
6 Ta=25°C 60
20 40 f=175MHz
Gp 4 Vdd=12.5V 50
Idq=0.3A
10 20 Idd
2 40
Idd
0 0 0 30
0 5 10 15 20 25 30 0.0 0.1 0.2 0.3 0.4 0.5 0.6
Pin(dBm) Pin(W)
12
Pin=0.3W
Idq=0.3A
Zg=ZI=50 ohm
www.DataSheet4U.com Po 3
4 Tc=-25~+75°C
-25°C
Ids(A),GM(S)
10 3
+75°C
Idd(A)
Po(W)
8 2
2
6 Idd
4 1
1
2
0 0 0
4 6 8 10 12 14 0 2 4 6 8 10
Vdd(V) Vgs(V)
Vgs-gm CHARACTORISTICS
2.0
Vds=10V
Tc=-25~+75°C
1.5
gm(S)
-25°C
1.0
+25°C
0.5 +75°C
0.0
0 1 2 3 4 5 6 7 8 9
Vgs(V)
TEST CIRCUIT(f=175MHz)
Vgg Vdd
C1
9.1kOHM
L6
C3
8.2kOHM 100OHM
300pF C2
175MHz L5
L4 RD06HVF1
L1 L2 L3
RF-IN RF-OUT
300pF 82pF
25 70
30
87
33
www.DataSheet4U.com 55
52 92
100
72
75
92
100
Note:Board material-Teflon substrate
C1:2200pF 10uF in parallel
micro strip line width=4.2mm/50OHM,er:2.7,t=1.6mm
C2:2200pF*2 in parallel
C3:2200pF,330uF in parallel Dimensions:mm
f=175MHz Zin*
f=175MH Zo
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Zin , Zout
f Zin Zout
(MHz) (ohm) (ohm) Conditions
175 4.25-j25.6 5.64-j1.05 Po=10W, Vdd=12.5V,Pin=0.3W
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Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more
reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to
personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit
designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable
material or (iii) prevention against any malfunction or mishap.
warning !
Do not use the device at the exceeded the maximum rating condition. In case of plastic molded devices, the
exceeded maximum rating condition may cause blowout, smoldering or catch fire of the molding resin due to extreme
short current flow between the drain and the source of the device. These results causes in fire or injury.