CD4510
CD4510
4 6
PRESET ENABLE 1 16 VDD P1 Q1
12 11
P2 Q2
Q4 2 15 CLOCK 13 14
P3 Q3
3 2
P4 3 14 Q3 P4 Q4
P1 4 13 P3
CARRY IN 5 12 P2
Q1 6 11 Q2 15
CLOCK
CARRY OUT 7 10 UP/DOWN 10
UP/DOWN
5 7
VSS 8 9 RESET CARRY IN CARRY OUT
9 VDD = 16
RESET VSS = 8
1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999
CD4510BMS, CD4516BMS
LIMITS
GROUP A
PARAMETER SYMBOL CONDITIONS (NOTE 1) SUBGROUPS TEMPERATURE MIN MAX UNITS
Supply Current IDD VDD = 20V, VIN = VDD or GND 1 +25oC - 10 µA
2 +125oC - 1000 µA
VDD = 18V, VIN = VDD or GND 3 -55oC - 10 µA
Input Leakage Current IIL VIN = VDD or GND VDD = 20 1 +25oC -100 - nA
2 +125oC -1000 - nA
VDD = 18V 3 -55oC -100 - nA
Input Leakage Current IIH VIN = VDD or GND VDD = 20 1 +25oC - 100 nA
2 +125oC - 1000 nA
VDD = 18V 3 -55oC - 100 nA
Output Voltage VOL15 VDD = 15V, No Load 1, 2, 3 +25oC, +125oC, -55oC - 50 mV
Output Voltage VOH15 VDD = 15V, No Load (Note 3) 1, 2, 3 +25oC, +125oC, -55oC 14.95 - V
Output Current (Sink) IOL5 VDD = 5V, VOUT = 0.4V 1 +25oC 0.53 - mA
Output Current (Sink) IOL10 VDD = 10V, VOUT = 0.5V 1 +25oC 1.4 - mA
Output Current (Sink) IOL15 VDD = 15V, VOUT = 1.5V 1 +25oC 3.5 - mA
Output Current (Source) IOH5A VDD = 5V, VOUT = 4.6V 1 +25oC - -0.53 mA
Output Current (Source) IOH5B VDD = 5V, VOUT = 2.5V 1 +25oC - -1.8 mA
Output Current (Source) IOH10 VDD = 10V, VOUT = 9.5V 1 +25oC - -1.4 mA
Output Current (Source) IOH15 VDD = 15V, VOUT = 13.5V 1 +25oC - -3.5 mA
N Threshold Voltage VNTH VDD = 10V, ISS = -10µA 1 +25oC -2.8 -0.7 V
P Threshold Voltage VPTH VSS = 0V, IDD = 10µA 1 +25oC 0.7 2.8 V
Functional F VDD = 2.8V, VIN = VDD or GND 7 +25oC VOH > VOL < V
VDD/2 VDD/2
VDD = 20V, VIN = VDD or GND 7 +25oC
VDD = 18V, VIN = VDD or GND 8A +125oC
VDD = 3V, VIN = VDD or GND 8B -55oC
Input Voltage Low VIL VDD = 5V, VOH > 4.5V, VOL < 0.5V 1, 2, 3 +25oC, +125oC, -55oC - 1.5 V
(Note 2)
Input Voltage High VIH VDD = 5V, VOH > 4.5V, VOL < 0.5V 1, 2, 3 +25oC, +125oC, -55oC 3.5 - V
(Note 2)
Input Voltage Low VIL VDD = 15V, VOH > 13.5V, 1, 2, 3 +25oC, +125oC, -55oC - 4 V
(Note 2) VOL < 1.5V
Input Voltage High VIH VDD = 15V, VOH > 13.5V, 1, 2, 3 +25oC, +125oC, -55oC 11 - V
(Note 2) VOL < 1.5V
NOTES: 1. All voltages referenced to device GND, 100% testing being im- 3. For accuracy, voltage is measured differentially to VDD. Limit is
plemented. 0.050V max.
2. Go/No Go test with limits applied to inputs.
2
CD4510BMS, CD4516BMS
3
CD4510BMS, CD4516BMS
4
CD4510BMS, CD4516BMS
LIMITS
PARAMETER SYMBOL CONDITIONS NOTES TEMPERATURE MIN MAX UNITS
Supply Current IDD VDD = 20V, VIN = VDD or GND 1, 4 +25oC - 25 µA
N Threshold Voltage VNTH VDD = 10V, ISS = -10µA 1, 4 +25oC -2.8 -0.2 V
N Threshold Voltage ∆VTN VDD = 10V, ISS = -10µA 1, 4 +25oC - ±1 V
Delta
P Threshold Voltage VTP VSS = 0V, IDD = 10µA 1, 4 +25oC 0.2 2.8 V
P Threshold Voltage ∆VTP VSS = 0V, IDD = 10µA 1, 4 +25oC - ±1 V
Delta
Functional F VDD = 18V, VIN = VDD or GND 1 +25oC VOH > VOL < V
VDD/2 VDD/2
VDD = 3V, VIN = VDD or GND
Propagation Delay Time TPHL VDD = 5V 1, 2, 3, 4 +25oC - 1.35 x ns
TPLH +25oC
Limit
NOTES: 1. All voltages referenced to device GND. 3. See Table 2 for +25oC limit.
2. CL = 50pF, RL = 200K, Input TR, TF < 20ns. 4. Read and Record
MIL-STD-883
CONFORMANCE GROUP METHOD GROUP A SUBGROUPS READ AND RECORD
Initial Test (Pre Burn-In) 100% 5004 1, 7, 9 IDD, IOL5, IOH5A
Interim Test 1 (Post Burn-In) 100% 5004 1, 7, 9 IDD, IOL5, IOH5A
Interim Test 2 (Post Burn-In) 100% 5004 1, 7, 9 IDD, IOL5, IOH5A
PDA (Note 1) 100% 5004 1, 7, 9, Deltas
Interim Test 3 (Post Burn-In) 100% 5004 1, 7, 9 IDD, IOL5, IOH5A
PDA (Note 1) 100% 5004 1, 7, 9, Deltas
Final Test 100% 5004 2, 3, 8A, 8B, 10, 11
Group A Sample 5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11
Group B Subgroup B-5 Sample 5005 1, 2, 3, 7, 8A, 8B, 9, 10, 11, Deltas Subgroups 1, 2, 3, 9, 10, 11
Subgroup B-6 Sample 5005 1, 7, 9
Group D Sample 5005 1, 2, 3, 8A, 8B, 9 Subgroups 1, 2 3
NOTE: 1. 5% Parameteric, 3% Functional; Cumulative for Static 1 and 2.
5
CD4510BMS, CD4516BMS
OSCILLATOR
FUNCTION OPEN GROUND VDD 9V ± -0.5V 50kHz 25kHz
CD4510BMS
Static Burn-In 1 2, 6, 7, 11, 14 1, 3-5, 8-10, 12, 13, 16
(Note 1) 15
Static Burn-In 2 2, 6, 7, 11, 14 8 1, 3-5, 9, 10, 12, 13,
(Note 1) 15, 16
Dynamic Burn- - 1, 3, 4, 8, 9, 12, 13 10, 16 2, 6, 7, 11, 14 15 5
In (Note 1)
Irradiation 2, 6, 7, 11, 14 8 1, 3-5, 9, 10, 12, 13,
(Note 2) 15, 16
NOTES:
1. Each pin except VDD and GND will have a series resistor of 10K ± 5%, VDD = 18V ± 0.5V
2. Each pin except VDD and GND will have a series resistor of 47K ± 5%; Group E, Subgroup 2, sample size is 4 dice/wafer, 0 failures,
VDD = 10V ± 0.5V
Logic Diagrams
1
PRESET*
ENABLE
15 P P P P
CLOCK*
PE Q PE Q PE Q PE Q
7
CARRY OUT C C C C
T Q T Q T Q T Q
Q1 Q2 Q2 Q3 Q3 Q4 Q4
5
CARRY IN*
10 U/D
UP/DOWN*
U/D
Q1
VDD U/D U/D Q3 U/D Q3 U/D U/D U/D Q3 Q2 Q3
Q4 Q2 Q4 Q2 Q2 Q4 Q2 U/D Q3 Q4
FIGURE 1. CD4510BMS
6
CD4510BMS, CD4516BMS
1
PRESET*
ENABLE
15 P P P P
CLOCK*
PE Q PE Q PE Q PE Q
7
CARRY OUT C C C C
T Q T Q T Q T Q
Q1 Q2 Q2 Q3 Q3 Q4 Q4
5
CARRY IN*
10 U/D
UP/DOWN*
U/D
Q1
VDD U/D Q3 U/D Q3 U/D U/D U/D Q3 Q2
Q2 Q4 Q2 Q4 Q2 Q2 Q2 U/D Q3
FIGURE 2. CD4516BMS
TRUTH TABLE
CL CI U/D PE R ACTION
X 1 X 0 0 NO COUNT
0 1 0 0 COUNT UP
0 0 0 0 COUNT DOWN
X X X 1 0 PRESET
X X X X 1 RESET
X = DON’T CARE
7
CD4510BMS, CD4516BMS
30 15.0
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
GATE-TO-SOURCE VOLTAGE (VGS) = 15V
25 12.5
20 10.0
10V
15 7.5
10V
10 5.0
5 2.5
5V 5V
0 5 10 15 0 5 10 15
DRAIN-TO-SOURCE VOLTAGE (VDS) (V) DRAIN-TO-SOURCE VOLTAGE (VDS) (V)
FIGURE 3. TYPICAL OUTPUT LOW (SINK) CURRENT FIGURE 4. MINIMUM OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS CHARACTERISTICS
-10 -5
-15
-10V -10V
-20 -10
-25
-15V -15V
-30 -15
FIGURE 5. TYPICAL OUTPUT HIGH (SOURCE) CURRENT FIGURE 6. MINIMUM OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS CHARACTERISTICS
250
TRANSITION TIME (tTLH) (ns)
10V
100 100
10V 15V
15V
50 50
0
0 20 40 60 80 100 0 20 40 60 80 100
LOAD CAPACITANCE (CL) (pF) LOAD CAPACITANCE (CL) (pF)
FIGURE 7. TYPICAL TRANSITION TIME vs LOAD FIGURE 8. TYPICAL PROPAGATION DELAY TIME vs LOAD
CAPACITANCE CAPACITANCE FOR CLOCK-TO-Q OUTPUTS
8
CD4510BMS, CD4516BMS
8 10V
6 10V
10 4
5V
2
102
8
5 6
4
CL = 50pF
2
CL = 15pF
10
0 5 10 15 20 2 4 68 2 4 68 2 4 68 2 4 68 2 4 68
01 1 10 102 103 104
SUPPLY VOLTAGE (VDD)
INPUT FREQUENCY (fCL) (kHz)
FIGURE 9. TYPICAL MAXIMUM CLOCK INPUT FREQUENCY vs FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION vs
SUPPLY VOLTAGE FREQUENCY
100µF ID 500µF
1 16
PULSE
2 15
GENERATOR
3 14 20ns 20ns
VDD
4 13 90%
CL 50%
CL 5 12
10%
VSS
6 11 VARIABLE
WIDTH
CL 7 10
CL
8 9 CL
Acquisition System
SAMPLE
AMPLI- AND
FIER HOLD
10 BIT PARALLEL
16 CHANNEL
ANALOG MULTIPLEXER START A/D DATA
DATA CD4067 CONVERTER OUTPUTS
CLOCK
INPUTS
CONVERSION
LOGIC
END
SELECT
INPUTS
NOTE:
Q1 Q4 This acquisition system can be operated in the random access mode by
PRESET jamming in the channel number at the present inputs, or in the sequential
INPUTS CD4516BMS mode by clocking the CD4516BMS.
9
CD4510BMS, CD4516BMS
Timing Diagrams
CLOCK
CARRY IN
UP/DOWN
RESET
PE
P1
P2
P3
P4
Q1
Q2
Q3
Q4
CARRY OUT
COUNT 0 1 2 3 4 5 6 7 8 9 8 7 6 5 4 3 2 1 0 0 9 6 7 0
CLOCK
CARRY IN
UP/DOWN
RESET
PE
P1 VDD
P2 VSS
P3
P4
Q1
Q2
Q3
Q4
CARRY OUT
COUNT 5 6 7 8 9 10 11 12 13 14 15 9 8 7 6 5 4 3 2 1 0 0 15 0
10
CD4510BMS, CD4516BMS
PARALLEL CLOCKING
UP/DOWN
PRESET
ENABLE
R CL Q1 Q2 Q3 Q4 R CL Q1 Q2 Q3 Q4 R CL Q1 Q2 Q3 Q4
CLOCK
RESET
* CARRY OUT lines at the 2nd, 3rd, etc., stages may have a negative-going glitch pulse resulting from differential delays of different CD4010/16BMS
IC’S. These negative going glitches do not affect proper CD4029BMS operation. However, if the CARRY OUT signals are used to trigger other edge-
sensitive logic devices, such as FF’S or counters, the CARRY OUT signals should be gated with the clock signal using a 2-input OR gate such as
CD4071BMS.
RIPPLE CLOCKING
UP/DOWN
PRESET
ENABLE
R CL Q1 Q2 Q3 Q4 R CL Q1 Q2 Q3 Q4 R CL Q1 Q2 Q3 Q4
RESET
Ripple Clocking Mode: The up/down control can be changed at any count. The only restriction on changing the up/down control is that the
clock input to the first counting stage must be high. For cascading counters operating in a fixed up-count or down-count mode, the OR gates
are not required between stages, and CO is connected directly to the CL input of the next stage with CI grounded.
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
11