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KHX1866C9D3 4G

This document summarizes the specifications of a 4GB DDR3-1866 memory module from Kingston. The module uses sixteen 256M x 8-bit components running at 1.65V with a CL9 latency. It has a maximum operating power of 2.4W and operates between 0-85 degrees Celsius. The module measures 133.35mm x 30mm x 18.8mm.

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72 views2 pages

KHX1866C9D3 4G

This document summarizes the specifications of a 4GB DDR3-1866 memory module from Kingston. The module uses sixteen 256M x 8-bit components running at 1.65V with a CL9 latency. It has a maximum operating power of 2.4W and operates between 0-85 degrees Celsius. The module measures 133.35mm x 30mm x 18.8mm.

Uploaded by

dcubasf
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Memory Module Specifications

KHX1866C9D3/4G
4GB 512M x 64-Bit DDR3-1866
CL9 240-Pin DIMM

SPECIFICATIONS
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh 160ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Maximum Operating Power 2.400 W*
UL Rating 94 V - 0
Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C
*Power will vary depending on the SDRAM used.

DESCRIPTION FEATURES
This document describes Kingston's 512M x 64-bit (4GB) • JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
DDR3-1866 CL9 SDRAM (Synchronous DRAM), 2Rx8 memory
• VDDQ = 1.5V (1.425V ~ 1.575V)
module, based on sixteen 256M x 8-bit FBGA components. This
module has been tested to run at DDR3-1866 at a low latency • 667MHz fCK for 1333Mb/sec/pin

timing of 9-11-9-27 at 1.65V.The SPD is programmed to JEDEC • 8 independent internal bank


standard latency DDR3-1333 timing of 9-9-9. This 240-pin • Programmable CAS Latency: 9, 8, 7, 6
DIMM uses gold contact fingers. The JEDEC electrical and • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
mechanical specifications are as follows:
• Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
• Asynchronous Reset
• PCB : Height 1.180” (30.00mm), double sided component

Continued >>

Document No. 4806123-001.C00 12/18/12 Page 1


continued HyperX

MODULE DIMENSIONS

T E C H N O L O G Y

Units: millimeters 133.35


30.00

18.80
15.80
11.00
8.00

0.00
0.00

54.70

MODULE WITH HEAT SPREADER

FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM

All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.

Document No. 4806123-001.C00 Page 2

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