[CONTENTS]

❍ SECTION 1. SUMMARY
• SERVICING PRECAUTIONS .......................................................................................................... 1-2

• ESD PRECAUTIONS....................................................................................................................... 1-3

• SPECIFICATIONS ........................................................................................................................... 1-4

❍ SECTION 2. ELECTRICAL
• ELECTRICAL TROUBLESHOOTING GUIDE ................................................................................. 2-1

• CD PART TROUBLESHOOTING GUIDE......................................................................................... 2-3

• WAVEFORMS OF MAJOR CHECK POINT .................................................................................. 2-11

• INTERNAL BLOCK DIAGRAM of ICs ............................................................................................ 2-13

• BLOCK DIAGRAM ......................................................................................................................... 2-25

• SCHEMATIC DIAGRAM ................................................................................................................ 2-27

- MAIN SCHEMATIC DIAGRAM ................................................................................................... 2-27

- FRONT SCHEMATIC DIAGRAM................................................................................................ 2-29

- CDP SCHEMATIC DIAGRAM .................................................................................................... 2-31

• PRINTED CIRCUIT DIAGRAM ...................................................................................................... 2-33

❍ SECTION 3. CABINET MAIN CHASSIS & MECHANISM

• EXPLODED VIEW ........................................................................................................................... 3-1

❍ SECTION 4. REPLACEMENT PARTS LIST.................................................................... 4-1

- 1-1 -
 SECTION 1. SUMMARY
❏ SERVICING PRECAUTIONS
➊ Always disconnect the power source before:
1) Removing or reinstalling any component, circuit board, module or any other instrument assembly.
2) Disconnecting or reconnecting any instrument electrical plug or other electrical connection.
3) Connecting a test substitute in parallel with an electrolytic capacitor in the instrument.

CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in
an explosion hazard.

➋ Do not defeat any plug/socket B+ voltage interlocks with which instruments covered by this service
manual might be equipped.

❸ Do not apply power to this instrument and or any of its electrical assemblies unless all solid-state
device heat sinks are correctly installed.

❹ Always connect a test instrument’s ground lead to the instrument chassis ground before
connecting the test instrument positive lead. Always remove the test instrument ground lead last.
1) The service precautions are indicated or printed on the cabinet, chassis or components. When servicing,
follow the printed or indicated service precautions and service materials.

2) The Components used in the unit have a specified conflammability and dielectric strength. When
replacing any components, use components which have the same ratings. Components marked in
the circuit diagram are important for safety or for the characteristics of the unit. Always replace with the
exact components.

3) An insulation tube or tape is sometimes used and some components are raised above the printed writing
board for safety. The internal wiring is sometimes clamped to prevent contact with heating components.
Install them as they were.

4) After servicing always check that the removed screws, components and wiring have been installed
correctly and that the portion around the service part has not been damaged. Further check the insulation
between the blades of attachment plug and accessible conductive parts.

- 1-2 -
❏ ESD PRECAUTIONS
[Electrostatically Sensitive Devices (ESD)]
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such omponents
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are
integrated circuits and some field-effect transistors and semiconductor chip components. The following
techniques should be used to help reduce the incidence of component damage caused by static electricity.
1) Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and
wear a commercially available discharging wrist strap device, which should be removed for potential
shock reasons prior to applying power to the unit under test.
2) After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3) Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4) Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static”
can generate electrical charges sufficient to damage ESD devices.
5) Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.
6) Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together
by conductive foam, aluminum foil or comparable conductive material).
7) Immediately before removing the protective material from the leads of a replacement ESD device, touch
the protective material to the chassis or circuit assembly into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8) Minimize bodily motions when handling unpackaged replacement ESD devices. (Otherwise harmless
motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor
can generate static electricity sufficient to damage an ESD device).

[CAUTION. GRAPHIC SYMBOLS]

THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL
TRIANGLE, IS INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE
OF UNINSULATED “DANGEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT
MAGNITUDE TO CONSTITUTE A RISK OF ELECTRIC SHOCK.

THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO

ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY
INFORMATION IN SERVICE LITERATURE.

- 1-3 -
❏ SPECIFICATIONS
1. GENERAL
Power requirements ..................................................................................................................... DC12V~15V
Ground system ................................................................................................................................... Negative
Dimensions(W x H x D) ...................................................................................................... 188 x 58 x 166mm
Weight .............................................................................................................................................. Net: 1.3kg

2. RADIO SECTION
FM AM(MW)
Frequency range 65.0~74.0MHz(Optional), 522~1,620kHz
87.5~108MHz (Optional:530~1,710kHz/ 520~1,620kHz)
Intermediate frequency 10.8MHz 450kHz
Usable sensitivity 12dBµV 32dBµV
Signal to noise ratio 55dB 45dB

3. COMPACT DISC SECTION

Frequency response ..................................................................................................................... 40Hz~20kHz
Channel separation ...................................................................................................................... 50dB(1kHz)
Signal to noise ratio .................................................................................................................................. 60dB

4. AUDIO SECTION
Maximum output power ....................................................................................................................... 50W x 4
Speaker impedance ............................................................................................................... 4Ω x 4 or 8Ω x 4

NOTE: The design and specifications are subject to change without notice in the sourse of product
improvement.

- 1-4 -
 SECTION 2. ELECTRICAL
❏ ELECTRICAL TROUBLESHOOTING GUIDE
(1) No Power.

Any Key power on.

YES

Check power supply circuitry.

NO
Is power turnd on? Q260, Q380, Q381, IC401 Pin76
IC201 Pin2
YES

NO Check loading supply circuitry.

DISC loading? Q350,Q351,PN505, IC401 Pin27

YES

NO Check laser circuitry.

Does initial reading occur?
Q501, IC502

Check focusing circuitry.

YES Q501,IC502

Check DISC.

NO Check tracking servo circuitry.

Can disc be played?
Q501,IC502

YES

NO Check audio circuitry.

Is audio output supplied?
IC502,IC601,IC801

YES

OK

- 2-1 -
(2) LCD light abnornal.

Any Key power on.

(without DISC)

Power supply circuitry

NO Check voltage in the power NO
Do display LCD then light? defective.
supply circuitry.
Q380,Q381,IC403

YES

Is u-com IC401 reset circuit

NO Reset circuit defective.
normal? Pin10
IC201 Surrounding circuit
defective.

YES

Is u-com IC401X1, X2 terminal NO

Pin14, 15 input? X401, C413,C414 defective.
OSC : 9.8304MHz

YES

Is u-com IC401 keyin Pin16, 44 NO Q260, PN401 front PCB

71 5volt input? pattern defective.

YES

Is u-com IC401 Pin 38,40,47,48

output waveform normal? NO IC401, Pin38, 40, 47, 48 front
PCB pattern defective.

YES

Is IC901 Com1, Com2, Com3

output waveform normal? NO IC901, Surrounding circuit
PCB pattern defective.

YES

Display LCD connector defective.

- 2-2 -
- 2-3 -
- 2-4 -
- 2-5 -
- 2-6 -
- 2-7 -
- 2-8 -
- 2-9 -
- 2-10 -
❏ WAVEFORMS OF MAJOR CHECK POINT
#1. MICOM INTERFACE WAVEFORM #2. SLED DRIVE AND MOTOR WAVEFORM
(CN503 1 9,2 1 ,1 8,20) during normal play (IC504 pin5, 1 4) when focus search

#3. FOCUS DRIVE AND MOTOR WAVEFORM

(R5 1 3, IC504 pin 1 5)
• When focus search failed or there is no disc on the • There is disc on tray and focus search success
tray

- 2-11 -
#4. SPINDLE DRIVE AND MOTOR WAVEFORM #5. TRACK DRIVE AND MOTOR WAVEFORM
(IC504 pin6, 1 2) when TOC reading (R508, IC504 pin23) during normal play

#6. RF, TRACKING AND FOCUS ERROR WAVEFORM

(IC502 pin8, 2 1 , 23) during normal play

- 2-12 -
❏ INTERNAL BLOCK DIAGRAM of ICs
■ IC401 LC875465B
1) PORT ASSIGNMENT

- 2-13 -
2) PORT DESCRIPTION

- 2-14 -
Pin Name in Micom Name in Model I/O Description
26 P31 PCD_SW2 I In MD, SW2 state input. Refer to CD Player.
27 P32 PCD_PWR O DSP power suppler ON ouptut
28 P33 PCD_FWD O In MD, load motor "forward" command output
PCD_F PCD_R Function
Low Low Open mode
Low High Reverse
High Low Forward
High High Break mode
29 P34 PCD_MUTE O CD’s audio signal mute output
30 P10/SO0 PDSP_ODA O To DSP, data output
31 P11/SI0/SB0 PDSP_IDA I From DSP, data input
32 P12/SCK0 PDSP_OCLK O Clock output for interface with DSP
33 P13/SO1 PDRV_OPS O In MD, motor driver ’s power save command ouput
Power Save Mode(High), Normal Mode(Low)
34 P14/SI1/SB1 PDRV_OMUTE O In MD, all motor ’s output "cut off" command ouput
Cut Off Mode(High), Normal Mode(Low)
35 P15/SCK1 PDSP_IFSEQ I Constant velocity signal input
Ok(High), Not Ok(Low)
36 P16/T1PWML PDSP_OCEN O DSP chip enable output
37 P17/T1PWMH/BUZPBEEP O Beep sound (2KHz) output
38 SI2P0/SO2 PFRT_DO O To LCD driver, data output
39 SI2P1/SI2/SB2 N.C I Not to be used
40 SI2P2/SCK2 PFRT_CLK O Clock output for interface with LCD driver
41 SI2P3/SCK20 N.C I Not to be used
42 PWM1 N.C O Not to be used
43 PWM0 N.C O Not to be used
44 VDD2 VDD - Power supply (+5V)
45 VSS2 GND - Ground
46 P00 PPLL_CE O PLL IC enable output
47 P01 PFRT_CE O LCD driver enable output
48 P02 PFRT_RES O LCD driver reset output
Normal(High), Reset(Low)
49 P03 PREMOTE O External amplifier ON output
50 P04 PLED O LED flashing control output
51 P05 N.C O Not to be used
52 P06 N.C O Not to be used
53 P07 N.C O Not to be used
54 P20/INT4/T1IN PDSP_IDRF I Focusing OK signal input
Ok(High), Not Ok(Low)
55 P21/INT4/T1IN PDSP_IRST O DSP reset output
56 P22/INT4/T1IN N.C I Not to be used
57 P23/INT4/T1IN N.C I Not to be used
58 P24/INT5/T1IN N.C I Not to be used
59 P25/INT5/T1IN N.C I Not to be used
60 P26/INT5/T1IN PCDC_DO O To CD changer, data output
61 P27/INT5/T1IN POPT_OUT0 O For diode option check, signal 1 output. Refer to Option Diode.
62 PB7/D7 POPT_OUT1 O For diode option check, signal 2 output. Refer to Option Diode.
63 PB6/D6 POPT_IN2 I For diode option check, signal 1 or 2 input2. Refer to Option Diode.
64 PB5/D5 POPT_IN1 I For diode option check, signal 1 or 2 input1. Refer to Option Diode.
65 PB4/D4 POPT_IN0 I For diode option check, signal 1 or 2 input0. Refer to Option Diode.
66 PB3/D3 PPLL_CLK O Clock output for interface with PLL IC
67 PB2/D2 PPLL_DI I From PLL IC, data input
68 PB1/D1 PPLL_DO O To PLL IC, data output
69 PB0/D0 PTEL_MUTE I Telephone mute input
70 VSS3 GND - Ground
71 VDD3 VDD - Power supply (+5V)
72 PC7/A7 N.C I Not to be used

- 2-15 -
 Pin Name in Micom Name in Model I /O Description
73 PC6/A6 PPWR_MUTE O To power amp, "MUTE" command output
Mute(High), Sound(Low)
74 PC5/A5 PEV_CLK O Clock for interface with volume controller
75 PC4/A4 PEV_DO O To volume controller, data output
76 PC3/A3 PPWR O System Power supplier ON output
On(High), Off(Low)
77 PC2/A2 PACC I From ISO jack, ACC signal input
ACC On(Low), ACC Off(High)
PC1/A1 N.C
78 I Not to be used
79 PC0/A0 PCDC_PWR O CD changer power supplier ON output
CDC On(High), CDC Off(Low)
80 PA0/CS2# PFRT_DET I Front pannel existence signal input
Front Pannel Ok(High), Absent(Low)

■ IC501 MN6627933
1) PORT ASSIGNMENT

- 2-16 -
2) Block Diagram

- 2-17 -
3) PORT DESCRIPTION
Pin No. Symbol I/O Function
1 D11 I/O DRAM data signal I/O 11
2 D10 I/O DRAM data signal I/O 10
3 D9 I/O DRAM data signal I/O 9
4 D8 I/O DRAM data signal I/O 8
5 UDQM O SDRAM upper byte data mask signal output
6 SDRCK O SDRAM clock signal output
7 A11 O DRAM address signal output 11
8 A9 O DRAM address signal output 9
9 A8 O DRAM address signal output 8
10 A7 O DRAM address signal output 7
11 A6 O DRAM address signal output 6
12 A5 O DRAM address signal output 5
13 A4 O DRAM address signal output 4
14 LDQM O SDRAM lower byte data mask signal output
15 NWE O DRAM write enable signal output
16 NCAS O DRAM CAS control signal output
17 NRAS O DRAM RAS control signal output
18 NCS O SDRAM chip select signal output
19 A3 O DRAM address signal output 3
20 A2 O DRAM address signal output 2
21 A1 O DRAM address signal output 1
22 A0 O DRAM address signal output 0
23 DRVDD1 I Power supply 1 for DRAM interface I/O
24 DVSS1 I Ground 1 for digital circuits
25 A10 O DRAM address signal output 10
26 *BA1 O SDRAM bank selection signal output 1
27 *BA0 O SDRAM bank selection signal output 0
28 DVDD1 I Power supply 1 for internal digital circuits
29 SPOUT O Spindle drive signal output (absolute value)
30 *SPPOL O Spindle drive signal output (polarity)
31 TRVP O Traverse drive signal output (positive polarity)
32 *TRVM O Traverse drive signal output (negative polarity)
33 *TRVP2 O Traverse drive signal output 2 (positive polarity)
34 *TRVM2 O Traverse drive signal output 2 (negative polarity)
35 TRP O Tracking drive signal output (positive polarity)
36 *TRM O Tracking drive signal output (negative polarity)
37 FOP O Focus drive signal output (positive polarity)
38 *FOM O Focus drive signal output (negative polarity)
39 IOVDD1 I Power supply 1 for digital I/O
40 TBAL O Tracking balance adjustment signal output
41 FBAL O Focus balance adjustment signal output
42 FE I Focus error signal input
43 TE I Tracking error signal input
44 ADPVCC I Voltage input for supply voltage monitor
45 RFENV I RF envelope signal input
46 LDON O Laser ON signal output
47 NRFDET I RF detectoion signal input
48 OFT I Off-track signal input
49 BDO I Dropout signal input
50 AVDD1 I Power supply 1 for analog circuits
51 IREF I Analog reference current input
52 ARF I RF signal input
53 DSLF O DSL loop filter pin
54 PWMSEL I PWM output mode selection input Low: Direct High: 3-state
55 PLLF O PLL loop filter pin (for phase comparison)
56 PLLFO O PLL loop filter pin (for speed comparison)
57 AVSS1 I Ground 1 for analog circuits
58 LOOUTL O L-ch audio output for line-out output
59 LOVSS1 I Ground for line-out output

- 2-18 -
Pin No. Symbol I/O Function
60 LOOUTR O R-ch audio output for line-out output
61 LOVDD1 I Power supply for line-out output
62 N.C. - -
63 TMON1 O Test monitor output 1
64 N.C. - -
65 N.C. - -
66 TMON2 O Test monitor output 2
67 DVDD3 I Power supply 3 for digital circuits
68 DVSS2 I Ground 2 for digital circuits
69 *EXT0 I/O Expansion I/O port 0
70 *EXT1 I/O Expansion I/O port 1
71 *EXT2 I/O Expansion I/O port 2
72 MCLK I Microcontroller command clock signal input
73 MDATA I Microcontroller command data signal input
74 MLD I Microcontroller command load signal input
75 *STAT O Status signal output
76 *BLKCK O Subcode block clock signal output
77 *SMCK O 4.2336-/8.4672-MHz clock signal output
78 *PMCK O 88.2-kHz clock signal output
79 *TX O Digital audio interface signal output
80 *FLAG O Flag signal output
81 NRST I LSI reset signal input
82 NTEST I Test mode setting input
83 DVSS3 I Ground 3 for digital circuits
84 X1 I Crystal oscillator circuit input
85 X2 O Crystal oscillator circuit output
86 IOVDD2 I Power supply 2 for digital I/O
87 DVDD2 I Power supply 2 for internal digital circuits
88 D2 I/O DRAM data signal I/O 2
89 D1 I/O DRAM data signal I/O 1
90 D0 I/O DRAM data signal I/O 0
91 D3 I/O DRAM data signal I/O 3
92 D4 I/O DRAM data signal I/O 4
93 D5 I/O DRAM data signal I/O 5
94 D6 I/O DRAM data signal I/O 6
95 D7 I/O DRAM data signal I/O 7
96 D15 I/O DRAM data signal I/O 15
97 D14 I/O DRAM data signal I/O 14
98 DRVDD2 I Power supply 2 for DRAM interface I/O
99 D13 I/O DRAM data signal I/O 13
100 D12 I/O DRAM data signal I/O 12

- 2-19 -
■ IC503 M12L16161A
1) PORT ASSIGNMENT

2) BLOCK DIAGRAM I/O Control

LWE
Bank Select Data Input Regidter
LDQM
Refresh Counter

Row Decoder

Output Buffer
Sense AMP
Row Buffer

512K x 16
Address Register

DQI
CLK 512K x 16

ADD
LRAS

LCBR

Column Decoder
Col. Buffer

Latency & Burst Length

LCKE

Programming Register
LRAS LCBR LWE LCAS LDQM
LWCBR

Timing Register

CLK CKE CS RAS CAS WE L(U)DQM

- 2-20 -
■ PIN Function table
Pin Name Input Function
CLK System Clock Active on the positive going edge to sample all inputs.
Disables or enables device operation by masking or enabling all inputs except
CS Chip Select
CLK, CKE and L(U)DQM.
Masks system clock to freeze operation from the next clock cycle. CKE
CKE Clock Enable should be enabled at least one cycle prior to new command. Disable input
buffers for power down in standby.
Row/Column addresses are multiplexed on the same pins. Row address:
A0~A10/AP Address
RA0~RA10, column address: CA0~CA7
Selects bank to be activated during row address latch time. Selects bank for
BA Bank Select Address
read/write during column address latch time.
Latches row addresses on the positive going edge of the CLK with RAS low.
RAS Row Address Strobe
Enables row access & precharge.
Latches column addresses on the positive going edge of the CLK with CAS
CAS Column Address Strobe
low. Enables column access.
Enables write operation and row precharge. Latches data in starting from
WE Write Enable
CAS, WE active.
Makes data output Hi-Z, tSHZ after the clock and masks the output. Blocks
L(U)DQM Data Input / Output Mask
data input when L(U)DQM active.
DQ0~15 Data Input / Output Data inputs/outputs are multiplexed on the same pins.
VDD/VSS Power Supply/Ground Power and ground for the input buffers and the core logic.
Isolated power supply and ground for the output buffers to provide improved
VDDQ/VSSQ Data Output Power/Ground
noise immunity.
N.C/RFU No Connection/ This is recommended to be left No Connection on the
Reserved for Future Use device.

■ IC504 BA5810FM

28 27 26 25 24 23 22 21 20 19 18 17 16 15
10k 10k

+ — + — CD1~ 10k
CB4 POWVCC34 10k
MUTE (CH3, CH4)

10k 10k
10k
10k
7.5k 16k +
LEVEL
SHIFT
7.5k 16k
+ —
+

LEVEL
SHIFT
—

LOADING PRE LEVEL

+

SHIFT
FWE REV 7.5k
—

16k LEVEL
SHIFT
7.5k
16k
10k
10k
10k 10k

POWER
PREVCC PREVCC12
X3 SAVE
(PRE. LODING) (CH1. CH2)
10k
10k

1 2 3 4 5 6 7 8 9 10 11 12 13 14

- 2-21 -
■ IC505 AMC1117

■ BLOCK DIAGRAM

- 2-22 -
■ IC601 PT2313L

LOUT LIN LOUD_L BOUT_L BIN_L TREB_L

17 16 12 19 18 4

Speaker
ATT

25 LFOUT
LIN1
LIN1 15 RB
Mute
LIN2
LIN2 14 Speaker
LIN3 Voume & ATT
LIN3 13 Bass Treble
Input Loudness
23 LROUT
Selector
Mute
RIN3
& Gain
RIN3 9
RIN2 Serial Bus Decoder & Latches 28 CLK
Control
RIN2 10
RIN1 27 DATA
RIN1 11 26 DGND

Speaker
ATT
Voume
Bass Treble
&
24 RFOUT
Loudness
Mute

RB Speaker
ATT

22 RROUT
Supply

Mute
2 3 1 7 6 8 21 20 5
VDD AGND REF ROUT RIN LOUD BOUT_R BIN_R TREB_R

- 2-23 -
■ IC801 TDA8571J
MODE VP1 VP2 VP3 VP4

15 1 8 16 23

10
IN1 +
2
OUT1+
-
30 K•
+ 4
OUT1-
-

Vref
11
IN2 + 7
OUT2+
-
30 K•
+ 5
OUT2-
-
12
SGND 9
DIAGNOSTIC VDIAG

13
IN3 + 17
OUT3+
-
30 K•
+ 19
OUT3-
-

Vref
14
IN4 + 22
OUT4+
-
30 K•
+ 20
OUT4-
-

3 6 18 21

PGND1 PGND2 PGND3 PGND4 MGG153

■ IC901 LC75811

- 2-24 -
❏ BLOCK DIAGRAM

2(FL,FR) POWER AMP 5,7 L-SPEAKER

24,25 10,11 TDA8571 FRONT
2,4 R-SPEAKER
10,14 LINE SW/E.VOLUME
22,23 13,14
6 27 2(RL,FR) 17,19 L-SPEAKER
13,19 7 28 2 10,14
REAR
TU101 9 20,22 R-SPEAKER
11,12 1,8,16,23
CET85XX 2(LR) OP AMP 9.4V REG
16,17,
S4560 Q360,ZD361 MUTE LINE-OUT
18,19 4,14 CCNTROL

2(RL,RR)
20 (OPTION)
Q720,721,722,723 4-CH
AUDIO MUTE (FL,FR,RL,RR)
CONTROL
Q801
CDC SIGNAL

9.4V RADIO VCC 14V POWER ON PN801 #16

Q310,ZD313 Q380,381 BACK_UP

ANT CONTROL PN801 #10

Q390,391
PWR_ANT

REMOTE
PN801 #6
POWER 5V CONTROL
Q320,321 REMOTE
Q282,Q283

RF IC 24
PICK-UP
AN22004A RESET ACC DETECTOR
IC203 Q230,D231,D232 PN801 #14
ACC

58, 60 PHONE MUTE PN801 #5

Q280,281 PHONE

DSP IC
(MN6627933) 72, 73, 74, 5V CONVERT REG 10V REG 10V PN801 #11
75, 76, 81 Q260,D261D262 IC402 IC403 DIMMER

29, 31, 35, 37

7.5V REG
Q320,351

3.3V REG
54 1 18 74 73 76 2 49 77 69
IC805 75 10
46,66,67,68
KEY MATRIX 69~72
5,6,23,26 15,16,17,18 11,12 RESISTOR 1~50 LCD DISPLAY
30,31,32,36 RADER
9,10,11, LCD DRIVER
12,13,14
MOTOR 7,8,20 U-COM
CD MECHA 38,40 LC75811W
DRIVE IC 25,28
47,48 77~80
(4404R-C004A) 1,2
(BA5810FM) uPD789166
4
14

33
22,23,24,26 15

2-25 2-26
❏ SCHEMATIC DIAGRAM

• MAIN SCHEMATIC DIAGRAM

2-27 2-28
• FRONT SCHEMATIC DIAGRAM

2-29 2-30
❏ SCHEMATIC DIAGRAM

• CDP SCHEMATIC DIAGRAM

2-31 2-32
❏ PRINTED CIRCUIT DIAGRAM

1. LED P.C.BOARD 2. FRONT P.C. BOARD

(COMPONENT SIDE) (SOLDER SIDE)

2. FRONT P.C. BOARD

(COMPONENT SIDE)

2-33 2-34
3. MAIN P.C. BOARD

2-35 2-36
4. CDP P.C. BOARD

2-37 2-38
 SECTION 3. CABINET MAIN CHASSIS & MECHANISM
■ EXPLODED VIEW
NOTE) Refer to “SECTION 4 REPLACEMENT CAUTION
PARTS LIST” in order to look for the
part number of each part.
Exposed blade will cause
severe injury

330

286
452
291
A40 A26
268
451
A43 290
287
265

263
264 452
262 291
261
A47

260
255 266 269
267 283
25 1 254 259 452

258 284

A46
301
257
256
25 0 253 278
252 276
272
450
271
453

275

273 452
277

282
454
452

A45 281

270

3-1 3-2