TAS5727
TAS5727
TAS5727
TAS5727
SLOS670B – NOVEMBER 2010 – REVISED DECEMBER 2016
OUT_A
4th 2´ HB
Serial Order FET Out OUT_B
SDIN Audio S Noise
Digital Audio Processor
Port R Shaper
(DAP)
C and OUT_C
PWM 2´ HB
FET Out OUT_D
Protection
Logic
MCLK Click and Pop
Sample Rate
SCLK Control
Autodetect
LRCLK and PLL
Microcontroller
SDA Serial Based
SCL Control System
Control
Terminal Control
B0262-06
Copyright © 2016 Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TAS5727
SLOS670B – NOVEMBER 2010 – REVISED DECEMBER 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 10.2 Functional Block Diagrams ................................... 13
2 Applications ........................................................... 1 10.3 Feature Description............................................... 15
3 Description ............................................................. 1 10.4 Device Functional Modes...................................... 28
10.5 Programming ........................................................ 29
4 Revision History..................................................... 2
10.6 Register Maps ...................................................... 31
5 Description (continued)......................................... 3
11 Application and Implementation........................ 54
6 Device Comparison Table..................................... 3
11.1 Application Information.......................................... 54
7 Pin Configuration and Functions ......................... 4
11.2 Typical Applications .............................................. 54
8 Specifications......................................................... 6
12 Power Supply Recommendations ..................... 59
8.1 Absolute Maximum Ratings ...................................... 6
12.1 DVDD and AVDD Supplies ................................... 59
8.2 ESD Ratings.............................................................. 6
12.2 PVDD Power Supply ............................................. 59
8.3 Recommended Operating Conditions....................... 6
13 Layout................................................................... 60
8.4 Thermal Information .................................................. 7
13.1 Layout Guidelines ................................................. 60
8.5 DC Electrical Characteristics .................................... 7
13.2 Layout Example .................................................... 60
8.6 AC Electrical Characteristics (BTL, PBTL)................ 8
8.7 PLL Input Parameters and External Filter 14 Device and Documentation Support ................. 61
Components............................................................... 8 14.1 Device Support...................................................... 61
8.8 Serial Audio Ports Slave Mode ................................. 8 14.2 Documentation Support ........................................ 61
8.9 I2C Serial Control Port Operation.............................. 9 14.3 Receiving Notification of Documentation Updates 61
8.10 Reset Timing (RESET) ........................................... 9 14.4 Community Resources.......................................... 61
8.11 Typical Characteristics .......................................... 11 14.5 Trademarks ........................................................... 61
9 Parameter Measurement Information ................ 12 14.6 Electrostatic Discharge Caution ............................ 61
10 Detailed Description ........................................... 13 14.7 Glossary ................................................................ 61
10.1 Overview ............................................................... 13 15 Mechanical, Packaging, and Orderable
Information ........................................................... 61
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................. 1
• Changed Section: Overcurrent (OC) Protection With Current Limiting ................................................................................ 16
• Changed Section: Overcurrent (OC) Protection With Current Limiting and Overload Detection ......................................... 16
5 Description (continued)
The TAS5727 is a slave-only device receiving all clocks from external sources. The TAS5727 operates with a
PWM carrier between a 384-kHz switching rate and a 288-KHz switching rate, depending on the input sample
rate. Oversampling combined with a fourth-order noise shaper provides a flat noise floor and excellent dynamic
range from 20 Hz to 20 kHz.
PHP Package
48-Pin HTQFP
Top View
PGND_CD
PGND_CD
PGND_AB
PGND_AB
OUT_C
OUT_B
BST_C
BST_B
NC
NC
NC
NC
48
47
46
45
44
43
42
41
40
39
38
37
OUT_A 1 36 OUT_D
PVDD_AB 2 35 PVDD_CD
PVDD_AB 3 34 PVDD_CD
BST_A 4 33 BST_D
NC 5 32 GVDD_OUT
SSTIMER 6 31 VREG
Thermal
NC 7 Pad 30 AGND
PBTL 8 29 GND
AVSS 9 28 DVSS
PLL_FLTM 10 27 DVDD
PLL_FLTP 11 26 STEST
VR_ANA 12 25 RESET
13
14
15
16
17
18
19
20
21
22
23
24
AVDD
A_SEL_FAULT
MCLK
OSC_RES
DVSSO
VR_DIG
SCLK
SDIN
SDA
SCL
LRCLK
PDN
Pin Functions
PIN 5-V
TYPE (1) TERMINATION (2) DESCRIPTION
NAME NO. TOLERANT
AGND 30 P Local analog ground for power stage
This pin is monitored on the rising edge of RESET. A value of 0 (15-
kΩ pulldown) sets the I2C device address to 0x54 and a value of 1
A_SEL_FAULT 14 DIO
(15-kΩ pullup) sets it to 0x56. this dual-function pin can be
programmed to output internal power-stage errors.
AVDD 13 P 3.3-V analog power supply
AVSS 9 P Analog 3.3-V supply ground
BST_A 4 P High-side bootstrap supply for half-bridge A
BST_B 43 P High-side bootstrap supply for half-bridge B
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply DVDD, AVDD –0.3 3.6 V
voltage PVDD_x –0.3 30 V
3.3-V digital input –0.5 DVDD + 0.5
Input voltage 5-V tolerant (2) digital input (except MCLK) –0.5 DVDD + 2.5 (3) V
(3)
5-V tolerant MCLK input –0.5 AVDD + 2.5
OUT_x to PGND_x 32 (4) V
BST_x to PGND_x 43 (4) V
Input clamp current, IIK ±20 mA
Output clamp current, IOK ±20 mA
Operating free-air temperature 0 85 °C
Operating junction temperature 0 150 °C
Storage temperature, Tstg –40 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum conditions for extended periods may affect device reliability.
(2) 5-V tolerant inputs are PDN, RESET, SCLK, LRCLK, MCLK, SDIN, SDA, and SCL.
(3) Maximum pin voltage should not exceed 6 V.
(4) DC voltage + peak ac waveform measured at the pin should be below the allowed limit for all conditions.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For operation at PVDD_x levels greater than 18 V, the modulation limit must be set to 93.8% through the control port register 0x10.
(2) Continuous operation above the recommended junction temperature may result in reduced reliability and/or lifetime of the device.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2)
Drain-to-source resistance, LS TJ = 25°C, includes metallization resistance 75
rDS(on) mΩ
Drain-to-source resistance, HS TJ = 25°C, includes metallization resistance 75
I/O Protection
Vuvp Undervoltage protection limit PVDD falling 7.2 V
Vuvp,hyst Undervoltage protection limit PVDD rising 7.6 V
(3)
OTE Overtemperature error 150 °C
(3) Extra temperature drop
OTEHYST 30 °C
required to recover from error
IOC Overcurrent limit protection 4.5 A
IOCT Overcurrent response time 150 ns
Internal pulldown resistor at the Connected when drivers are in the high-impedance state
RPD 3 kΩ
output of each half-bridge to provide bootstrap capacitor charge.
(1) IIH for the PBTL pin has a maximum limit of 200 µA due to an internal pulldown on the pin.
(2) This does not include bond-wire or pin resistance.
(3) Specified by design
tr tf
SCLK
(Input)
t(edge)
th1
tsu1
LRCLK
(Input)
th2
tsu2
SDIN
T0026-04
tw(H) tw(L) tr tf
SCL
tsu1 th1
SDA
T0027-01
SCL
th2 t(buf)
tsu2 tsu3
SDA
Start Stop
Condition Condition
T0028-01
RESET
tw(RESET)
2 2
I C Active I C Active
td(I2C_ready)
System Initialization.
2
Enable via I C.
T0421-01
NOTES: On power up, TI recommends that the TAS5727 RESET be held LOW for at least 100 μs after DVDD has reached 3
V.
If RESET is asserted LOW while PDN is LOW, then RESET must continue to be held LOW for at least 100 μs after
PDN is deasserted (HIGH).
10 10
PVDD = 12V PVDD = 18V
RL = 8Ω RL = 8Ω
TA = 25°C TA = 25°C
1 1
THD+N (%)
THD+N (%)
0.1 0.1
0.01 0.01
PO = 1W PO = 1W
PO = 2.5W PO = 5W
PO = 5W PO = 10W
0.001 0.001
20 100 1k 10k 20k 20 100 1k 10k 20k
Frequency (Hz) Frequency (Hz)
Figure 5. Total Harmonic Distortion + Noise vs Frequency Figure 6. Total Harmonic Distortion + Noise vs Frequency
10 10
PVDD = 24V PVDD = 12V
RL = 8Ω RL = 8Ω
TA = 25°C TA = 25°C
1 1
THD+N (%)
THD+N (%)
0.1 0.1
0.01 0.01
PO = 1W f = 20Hz
PO = 5W f = 1kHz
PO = 10W f = 10kHz
0.001 0.001
20 100 1k 10k 20k 0.01 0.1 1 10 40
Frequency (Hz) Output Power (W)
Figure 7. Total Harmonic Distortion + Noise vs Frequency Figure 8. Total Harmonic Distortion + Noise vs Output
Power
10 10
PVDD = 18V PVDD = 24V
RL = 8Ω RL = 8Ω
TA = 25°C TA = 25°C
1 1
THD+N (%)
THD+N (%)
0.1 0.1
0.01 0.01
f = 20Hz f = 20Hz
f = 1kHz f = 1kHz
f = 10kHz f = 10kHz
0.001 0.001
0.01 0.1 1 10 40 0.01 0.1 1 10 40
Output Power (W) Output Power (W)
Figure 9. Total Harmonic Distortion + Noise vs Output Figure 10. Total Harmonic Distortion + Noise vs Output
Power Power
−30 −30
Crosstalk (dB)
Crosstalk (dB)
−40 −40
−50 −50
−60 −60
−70 −70
−80 −80
−90 −90
−100 −100
20 100 1k 10k 20k 20 100 1k 10k 20k
Frequency (Hz) Frequency (Hz)
−30 70
60
Efficiency (%)
Crosstalk (dB)
−40
50
−50
40
−60
30
−70 PVDD = 12V
20 PVDD = 18V
−80 PVDD = 24V
10 RL = 8Ω
−90 TA = 25°C
0
0 5 10 15 20 25 30 35 40
−100
20 100 1k 10k 20k Total Output Power (W)
Frequency (Hz)
Dashed lines represent thermally limited region.
Figure 13. Crosstalk vs Frequency Figure 14. Efficiency vs Total Output Power
10 Detailed Description
10.1 Overview
The TAS5727 is an efficient stereo I2S input Class-D audio power amplifier with a digital audio processor. The
digital audio processor of the device uses noise shaping and customized correction algorithms to achieve a great
power efficiency and high audio performance. Also, the device has up to eighteen equalizers and two-band
advanced Automatic Gain Limiting (AGL).
The device needs only a single DVDD supply in addition to the higher-voltage PVDD power supply. An internal
voltage regulator provides suitable voltage levels for the gate drive circuit. The wide PVDD power supply range of
the device enables its use in a multitude of applications.
The TAS5727 is a slave-only device that is controlled by a bidirectional I2C interface that supports both 100-kHz
and 400-kHz data transfer rates for single- and multiple-byte write and read operations. This control interface is
used to program the registers of the device and read the device status. The PWM of this device operates with a
carrier frequency between 384 kHz and 354 kHz, depending the sampling rate. This device allows the use of the
same clock signal for both MCLK and BCLK (64xFs) when using a sampling frequency of 44.1 kHz or 48 kHz.
This amplifier can be configured in two different modes, stereo and mono single filter configuration is supported
in mono mode.
OUT_A
2´ HB
th FET Out
Serial 4 OUT_B
SDIN Audio S Order
Port Digital Audio Processor R Noise
(DAP) C Shaper
and OUT_C
PWM 2´ HB
FET Out
OUT_D
Protection
Logic
Microcontroller
SDA Serial Based
Control System
SCL Control
Terminal Control
B0262-06
Copyright © 2016 Texas Instruments Incorporated
FAULT
4
FAULT Under-
voltage 4
Protection
Power
On
Reset
Protection AGND
and
I/O Logic
Temp.
Sense GND
VALID
Overcurrent Isense
Protection
BST_D
PVDD_D
PWM_D PWM Gate
Ctrl Timing OUT_D
Rcv Drive
PWM Controller
Pulldown Resistor
GVDD PGND_CD
Regulator
GVDD_OUT
BST_C
PVDD_C
PWM_C PWM Gate
Ctrl Timing OUT_C
Rcv Drive
Pulldown Resistor
PGND_CD
BST_B
PVDD_B
PWM_B PWM Gate
Ctrl Timing OUT_B
Rcv Drive
Pulldown Resistor
GVDD PGND_AB
Regulator
BST_A
PVDD_A
PWM_A PWM Gate
Ctrl Timing OUT_A
Rcv Drive
Pulldown Resistor
PGND_AB
B0034-06
2
I C Subaddress in Red
2
I C:56
0x51[1] VDISTA
0x72 58, 59 0x70 32 24
27–2F
2BQ clip24
26 9BQ
Vol1
L 1BQ
0x73
0x71
AGL 0x46[0] 0x51[0]
0x52[1]
0x76 5C, 5D Vol2
0x74 v2im1 32 24
31–39
2BQ clip24
30 9BQ
R 1BQ 2
Level
I C:57
0x77 VDISTB Meter
0x75
0x52[0]
5E, 5F 32 32
2BQ
Vol 2
I C:0x6B (32Bit-Left Level)
2
I C:0x6C (32 Bit-Right Level)
AGL 0x46[1]
5A, 5B Vol
2BQ
Vol Config Reg 0x0E
B0321-11
Copyright © 2016 Texas Instruments Incorporated
The TAS5727 DAP has a bidirectional I2C interface that is compatible with the Inter IC (I2C) bus protocol and
supports both 100-kHz and 400-kHz data transfer rates for single- and multiple-byte write and read operations.
This is a slave-only device that does not support a multimaster bus environment or wait-state insertion. The
control interface is used to program the registers of the device and to read device status.
The DAP supports the standard-mode I2C bus operation (100 kHz maximum) and the fast I2C bus operation
(400 kHz maximum). The DAP performs all I2C operations without I2C wait cycles.
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
SCL
Start Stop
T0035-01
2
Figure 18. Typical I C Sequence
There is no limit on the number of bytes that can be transmitted between start and stop conditions. When the last
word transfers, the master generates a stop condition to release the bus. A generic data transfer sequence is
shown in Figure 18.
The 7-bit address for TAS5715 is 0101 010 (0x54) or 0101 011 (0x56) defined by A_SEL (external pulldown for
0x54 and pullup for 0x56).
2 Stop
I C Device Address and Subaddress Data Byte
Read/Write Bit Condition
T0036-01
2 Stop
I C Device Address and Subaddress First Data Byte Other Data Bytes Last Data Byte
Read/Write Bit Condition
T0036-02
2 2
I C Device Address and Subaddress I C Device Address and Data Byte Stop
Read/Write Bit Read/Write Bit Condition
T0036-03
2 2
I C Device Address and Subaddress I C Device Address and First Data Byte Other Data Bytes Last Data Byte Stop
Read/Write Bit Read/Write Bit Condition
T0036-04
2
2-Channel I S (Philips Format) Stereo Input
32 Clks 32 Clks
SCLK SCLK
23 22 9 8 5 4 1 0 23 22 9 8 5 4 1 0
20-Bit Mode
19 18 5 4 1 0 19 18 5 4 1 0
16-Bit Mode
15 14 1 0 15 14 1 0
T0034-01
2
2-Channel I S (Philips Format) Stereo Input/Output (24-Bit Transfer Word Size)
24 Clks 24 Clks
SCLK SCLK
23 22 17 16 9 8 5 4 3 2 1 0 23 22 17 16 9 8 5 4 3 2 1
20-Bit Mode
19 18 13 12 5 4 1 0 19 18 13 12 5 4 1 0
16-Bit Mode
15 14 9 8 1 0 15 14 9 8 1 0
T0092-01
2
2-Channel I S (Philips Format) Stereo Input
16 Clks 16 Clks
SCLK SCLK
15 14 13 12 11 10 9 8 5 4 3 2 1 0 15 14 13 12 11 10 9 8 5 4 3 2 1
T0266-01
32 Clks 32 Clks
LRCLK
SCLK SCLK
23 22 9 8 5 4 1 0 23 22 9 8 5 4 1 0
20-Bit Mode
19 18 5 4 1 0 19 18 5 4 1 0
16-Bit Mode
15 14 1 0 15 14 1 0
T0034-02
24 Clks 24 Clks
LRCLK
SCLK SCLK
23 22 21 17 16 9 8 5 4 1 0 23 22 21 17 16 9 8 5 4 1 0
20-Bit Mode
19 18 17 13 12 5 4 1 0 19 18 17 13 12 5 4 1 0
16-Bit Mode
15 14 13 9 8 1 0 15 14 13 9 8 1 0
T0092-02
16 Clks 16 Clks
LRCLK
SCLK SCLK
15 14 13 12 11 10 9 8 5 4 3 2 1 0 15 14 13 12 11 10 9 8 5 4 3 2 1 0
T0266-02
32 Clks 32 Clks
LRCLK
SCLK SCLK
23 22 19 18 15 14 1 0 23 22 19 18 15 14 1 0
20-Bit Mode
19 18 15 14 1 0 19 18 15 14 1 0
16-Bit Mode
15 14 1 0 15 14 1 0
T0034-03
24 Clks 24 Clks
LRCLK
SCLK SCLK
23 22 19 18 15 14 6 5 2 1 0 23 22 19 18 15 14 6 5 2 1 0
20-Bit Mode
19 18 15 14 6 5 2 1 0 19 18 15 14 6 5 2 1 0
16-Bit Mode
15 14 6 5 2 1 0 15 14 6 5 2 1 0
T0092-03
T
Input Level (dB)
M0091-04
Professional-quality dynamic range compression automatically adjusts volume to flatten volume level.
• Each DRC has adjustable threshold levels.
• Programmable attack and decay time constants
• Transparent compression: compressors can attack fast enough to avoid apparent clipping before engaging,
and decay times can be set slow enough to avoid pumping.
a, w T aa, wa / ad, wd
S
a –1
w
Z
B0265-04
Post-DAP Processing
1–a
–1
Z 32-Bit Level
rms
Ch1 ABS a ADDR = 0x6B
2
1–a I C Registers
(PWM Level Meter)
–1
Z 32-Bit Level
rms
Ch2 ABS a ADDR = 0x6C
B0396-01
10.5 Programming
10.5.1 26-Bit 3.23 Number Format
All mixer gain coefficients are 26-bit coefficients using a 3.23 number format. Numbers formatted as 3.23
numbers means that there are 3 bits to the left of the binary point and 23 bits to the right of the binary point (see
Figure 37).
Programming (continued)
–23
2 Bit
–5
2 Bit
–1
2 Bit
0
2 Bit
1
2 Bit
Sign Bit
S_xx.xxxx_xxxx_xxxx_xxxx_xxxx_xxx
M0125-01
The decimal value of a 3.23 format number can be found by following the weighting shown in Figure 37. If the
most significant bit is logic 0, the number is a positive number, and the weighting shown yields the correct
number. If the most significant bit is a logic 1, then the number is a negative number. In this case every bit must
be inverted, a 1 added to the result, and then the weighting shown in Figure 38 applied to obtain the magnitude
of the negative number.
1 0 –1 –4 –23
2 Bit 2 Bit 2 Bit 2 Bit 2 Bit
1 0 –1 –4 –23
(1 or 0) ´ 2 + (1 or 0) ´ 2 + (1 or 0) ´ 2 + ....... (1 or 0) ´ 2 + ....... (1 or 0) ´ 2
M0126-01
Gain coefficients, entered through the I2C bus, must be entered as 32-bit binary numbers. Figure 39 shows the
format of the 32 bit number (4 byte or 8 digit hexadecimal number).
Sign Fraction
Bit Digit 6
u u u u u u S x x. x x x x x x x x x x x x x x x x x x x x x x x 0
2
Figure 39. Alignment of 3.23 Coefficient in 32-Bit I C Word
When bit D6 is set low, the system exits all-channel shutdown and starts playing audio; otherwise, the outputs
are shut down (hard mute).
Ternary modulation is disabled by default. To enable ternary modulation, the following writes are required before
bringing the system out of shutdown:
1. Set bit D3 of register 0x05 to 1.
2. Write the following ICD settings:
(a) 0x11= 80
(b) 0x12= 7C
(c) 0x13= 80
(d) 0x24 =7C
3. Set the input mux register as follows:
(a) 0x20 = 00 89 77 72
Bits Volume slew rate (used to control volume change and MUTE ramp rates). These bits control the
D2–D0: number of steps in a volume ramp. Volume steps occur at a rate that depends on the sample rate of
the I2S data as follows:
Sample rate (kHz) Approximate ramp rate
8/16/32 125 μs/step
11.025/22.05/44.1 90.7 μs/step
12/24/48 83.3 μs/step
In two-band DRC, register 0x0A should be set to 0x30 and register 0x0E bits 6 and 5 should be set to 1.
ICD settings have high impact on audio performance (for example, dynamic range, THD, crosstalk, and so forth)
Therefore, appropriate ICD settings must be used. By default, the device has ICD settings for the AD mode. If
used in BD mode, then update these registers before coming out of all-channel shutdown.
(1) This register can be written only with a non-reserved value. Also this register can be written once after the reset.
(2) Default values are in bold.
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 1 1 1 0 0 1 0 Reserved (1)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 0 0 0 0 0 1 1 Reserved (1)
Note that channels are encoded so that channel 1 = 0x00, channel 2 = 0x01, …, channel 4 = 0x03.
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 1 0 0 0 1 0 1 Reserved (1)
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 0 – – – – – – Reserved (1)
– – 0 – – – – – Reserved
– – 1 – – – – – Reserved
– – – 0 – – – – Reserved (1)
– – – – 0 – – – Reserved (1)
– – – – – 0 – – Reserved (1)
– – – – – – 0 – DRC2 turned OFF (1)
– – – – – – 1 – DRC2 turned ON
– – – – – – – 0 DRC1 turned OFF (1)
– – – – – – – 1 DRC1 turned ON
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
– – 0 0 – – – – Reserved (1)
– – – – 0 1 1 0 SRC = 6 (1)
– – – – 0 1 1 1 SRC = 7
– – – – 1 0 0 0 SRC = 8
– – – – 1 0 0 1 SRC = 9
– – – – 1 0 1 0 Reserved
– – – – 1 1 – – Reserved
D7 D6 D5 D4 D3 D2 D1 D0 FUNCTION
0 EQ ON (1)
1 – – – – – – – EQ OFF (bypass BQ 0–7 of channels 1 and 2)
– 0 – – – – – – Reserved (1)
– – 0 – – – – – Ignore bank-mapping in bits D31–D8. Use default mapping. (1)
1 Use bank-mapping in bits D31–D8.
– – – 0 – – – – L and R can be written independently. (1)
L and R are ganged for EQ biquads; a write to the left-channel
– – – 1 – – – – biquad is also written to the right-channel biquad. (0x29–0x2F is
ganged to 0x30–0x36. Also, 0x58–0x5B is ganged to 0x5C–0x5F.
– – – – 0 – – – Reserved (1)
– – – – – 0 0 0 No bank switching. All updates to DAP (1)
– – – – – 0 0 1 Configure bank 1 (32 kHz by default)
– – – – – 0 1 X Reserved
– – – – – 1 X X Reserved
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
AVDD/DVDD 3V 3V
0 ns
PDN
0 ns 2 ms
(2) (2)
50 ms 1 ms + 1.3 tstart 1 ms + 1.3 tstop 2 ms
0 ns
100 ms
RESET 13.5 ms
(1)
tPLL
2 ms
100 μs
10 ms
PVDD 8V 8V
6V 6V
AVDD/DVDD 3V
0 ns
PDN 2 ms
0 ns
2
I C
2 ms
RESET
2 ms
0 ns
8V
PVDD
6V
T0420-05
NOTE
Event 3 is not supported for 240 ms + 1.3 × tstart after trim following AVDD/DVDD power-
up ramp (where tstart is specified by register 0x1A).
10 100
PVDD = 24V
RL = 8Ω 90
TA = 25°C
80
1
70
60
Efficiency (%)
THD+N (%)
50
0.1
40
30
PVDD = 12V
0.01 20 PVDD = 18V
PVDD = 24V
PO = 1W 10 RL = 8Ω
PO = 5W TA = 25°C
PO = 10W 0
0.001 0 5 10 15 20 25 30 35 40
20 100 1k 10k 20k Total Output Power (W)
Frequency (Hz)
Dashed lines represent thermally limited region.
Figure 43. Total Harmonic Distortion + Noise vs Frequency Figure 44. Efficiency vs Total Output Power
AVDD/DVDD PVDD
LRCLK OUT_A
Digital SCLK
Audio
Source MCLK BST_A
SDIN
BST_B
OUT_B
2 SDA
I C
Control SCL LCPBTL
OUT_C
Control RESET
Inputs BST_C
PDN
BST_D
Loop PLL_FLTP
Filter PLL_FLTM OUT_D
B0264-26
Copyright © 2016 Texas Instruments Incorporated
13 Layout
0O 15µH
18O
47nF 4700p 2200pF
(Max)
0.1µF
470O 0.68µF
1
10µF 0.1µF
AVDD 48
15µH
A_SEL/FAULT
MCLK
10nF 18O
0.68µF
SYSTEM PROCESSOR
4.7µF 18.2KO
0.1µF
3.3pF
PDN 3.3pF
LRCLK 10nF
SCLK 0.68µF
18O 15µH
SDIN
SDA
SCL TAS5727
0.68µF
0.1µF 0.1µF 15µH
RESET 0.1µF 10nF
18O
14.5 Trademarks
PowerPAD, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
14.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
14.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TAS5727PHP ACTIVE HTQFP PHP 48 250 RoHS & Green NIPDAU Level-3-260C-168 HR 0 to 85 TAS5727
TAS5727PHPR ACTIVE HTQFP PHP 48 1000 RoHS & Green NIPDAU Level-3-260C-168 HR 0 to 85 TAS5727
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Feb-2023
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Feb-2023
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Feb-2023
TRAY
W-
Outer
tray
width
Text
Pack Materials-Page 3
GENERIC PACKAGE VIEW
PHP 48 TQFP - 1.2 mm max height
7 x 7, 0.5 mm pitch QUAD FLATPACK
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4226443/A
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated