Spec No.

: JELF243A_0122J-01 P1/9

CHIP COILS (CHIP INDUCTORS) LQH5BPN□□□□38□ REFERENCE SPECIFICATION

1. Scope
This reference specification applies to chip coils (chip inductors) LQH5BPN_38 series for general electronic equipment.

2. Part Numbering
(Ex.)
LQ H 5B P N 220 M 38 L
Product ID Structure Dimension Application and Category Inductance Tolerance Dimension Packaging
(L × W) characteristic (T) L: ø180 taping
K: ø330 taping

3. Part Number and Rating

Operating temperature range (ambient temperature not including self-temperature rise) -40°C to +85°C
(product temperature including self-temperature rise) -40°C to +125°C
Storage temperature range -40°C to +85°C

Rated current
Inductance
DC Self-resonant (mA)*3
Customer Murata
Nominal resistance frequency Based on Based on
Part number Part number Tolerance
value (Ω) (MHz min.) inductance temperature
(%)
(μH) change*1 rise*2
LQH5BPN1R0N38L 1.0 N: ±30 0.012±20% 54 7000 4600
LQH5BPN1R0N38K 1.0 N: ±30 0.012±20% 54 7000 4600
LQH5BPN1R5N38L 1.5 N: ±30 0.014±20% 50 6500 4500
LQH5BPN1R5N38K 1.5 N: ±30 0.014±20% 50 6500 4500
LQH5BPN2R2N38L 2.2 N: ±30 0.016±20% 45 5000 4300
LQH5BPN2R2N38K 2.2 N: ±30 0.016±20% 45 5000 4300
LQH5BPN3R3N38L 3.3 N: ±30 0.021±20% 25 4000 4000
LQH5BPN3R3N38K 3.3 N: ±30 0.021±20% 25 4000 4000
LQH5BPN4R7N38L 4.7 N: ±30 0.026±20% 17 3500 3800
LQH5BPN4R7N38K 4.7 N: ±30 0.026±20% 17 3500 3800
LQH5BPN6R8M38L 6.8 M: ±20 0.039±20% 15 3000 3000
LQH5BPN6R8M38K 6.8 M: ±20 0.039±20% 15 3000 3000
LQH5BPN100M38L 10 M: ±20 0.056±20% 13 2600 2200
LQH5BPN100M38K 10 M: ±20 0.056±20% 13 2600 2200
LQH5BPN150M38L 15 M: ±20 0.08±20% 10 1800 1900
LQH5BPN150M38K 15 M: ±20 0.08±20% 10 1800 1900
LQH5BPN220M38L 22 M: ±20 0.11±20% 8.0 1600 1500
LQH5BPN220M38K 22 M: ±20 0.11±20% 8.0 1600 1500
LQH5BPN330M38L 33 M: ±20 0.15±20% 6.5 1300 1300
LQH5BPN330M38K 33 M: ±20 0.15±20% 6.5 1300 1300
LQH5BPN470M38L 47 M: ±20 0.22±20% 6.0 1100 1100
LQH5BPN470M38K 47 M: ±20 0.22±20% 6.0 1100 1100
LQH5BPN680M38L 68 M: ±20 0.33±20% 5.0 900 930
LQH5BPN680M38K 68 M: ±20 0.33±20% 5.0 900 930
LQH5BPN101M38L 100 M: ±20 0.48±20% 4.0 750 740
LQH5BPN101M38K 100 M: ±20 0.48±20% 4.0 750 740
LQH5BPN151M38L 150 M: ±20 0.68±20% 3.5 650 630
LQH5BPN151M38K 150 M: ±20 0.68±20% 3.5 650 630

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Spec No.: JELF243A_0122J-01 P2/9

Rated current
Inductance
DC Self-resonant (mA)*3
Customer Murata
Nominal resistance frequency Based on Based on
Part number Part number Tolerance
value (Ω) (MHz min.) inductance temperature
(%)
(μH) change*1 rise*2
*1 When rated current is applied to the products, inductance will be within ±30% of initial inductance value range.
*2 When rated current is applied to the products, temperature rise caused by self-generated heat shall be limited to 40°C max.
*3 Keep the temperature (ambient temperature plus self-generation of heat) under 125°C.

4. Testing Conditions
Unless otherwise specified Temperature: ordinary temperature (15°C to 35°C)
Humidity: ordinary humidity [25% to 85% (RH)]
In case of doubt Temperature: 20°C±2°C
Humidity: 60% to 70% (RH)
Atmospheric pressure: 86 kPa to 106 kPa

5. Appearance and Dimensions

Unit mass (typical value): 0.35 g

6. Marking
No marking.

7. Electrical Performance
No. Item Specification Test method
7.1 Inductance Meet chapter 3 ratings. Measuring equipment: Keysight 4192A or the
equivalent
Measuring frequency: 100 kHz
7.2 DC resistance Meet chapter 3 ratings. Measuring equipment: digital multimeter
7.3 Self-resonant Meet chapter 3 ratings. Measuring equipment: Keysight E4991A or the
frequency equivalent

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Spec No.: JELF243A_0122J-01 P3/9

8. Mechanical Performance
No. Item Specification Test method
8.1 Shear test No significant mechanical damage or no Test substrate: glass-epoxy substrate
sign of electrode peeling off shall be Force application direction:
observed.

Applying force: 10 N
Holding time: 5 s±1 s
8.2 Bending test No significant mechanical damage or no Test substrate: glass-epoxy substrate (100 mm × 40
sign of electrode peeling off shall be mm × 1.0 mm)
observed. Pressurizing speed: 0.5 mm/s
Deflection: 2 mm
Holding time: 5 s

8.3 Vibration Appearance shall have no significant Oscillation frequency: 10 Hz to 2000 Hz to 10 Hz, for
mechanical damage. approx. 20 min
Total amplitude: total amplitude of 1.5 mm or
acceleration amplitude of 98 m/s2, whichever is smaller
Test time: 3 directions perpendicular to each other, 2 h
for each direction (6 h in total)
8.4 Solderability 90% or more of the outer electrode shall Flux: immersed in ethanol solution with a rosin content
be covered with new solder seamlessly. of 25(wt)% for 5 s to 10 s
Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 240°C±5°C
Immersion time: 3 s±1 s
8.5 Resistance to Appearance: No significant mechanical Flux: immersed in ethanol solution with a rosin content
soldering heat damage shall be observed. of 25(wt)% for 5 s to 10 s
Inductance change rate: within ±10% Solder: Sn-3.0Ag-0.5Cu solder
Pre-heating: 150°C±10°C/60 s to 90 s
Solder temperature: 270°C±5°C
Immersion time: 10 s±1 s
Post-treatment: left at a room condition for 24 h±2 h

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Spec No.: JELF243A_0122J-01 P4/9

9. Environmental Performance
The product is soldered on a substrate for test.
No. Item Specification Test method
9.1 Heat resistance Appearance: No significant mechanical Temperature: 85°C±2°C
damage shall be observed. Test time: 1000 h (+48 h, -0 h)
Inductance change rate: within ±10% Post-treatment: left at a room condition for 24 h±2 h
9.2 Cold resistance Appearance: No significant mechanical Temperature: -40°C±2°C
damage shall be observed. Test time: 1000 h (+48 h, -0 h)
Inductance change rate: within ±10% Post-treatment: left at a room condition for 24 h±2 h
9.3 Humidity Appearance: No significant mechanical Temperature: 70°C±2°C
damage shall be observed. Humidity: 90% (RH) to 95% (RH)
Inductance change rate: within ±10% Test time: 1000 h (+48 h, -0 h)
Post-treatment: left at a room condition for 24 h±2 h
9.4 Temperature cycle Appearance: No significant mechanical Single cycle conditions:
damage shall be observed. Step 1: -40°C±2°C/30 min±3 min
Inductance change rate: within ±10% Step 2: ordinary temperature/10 min to 15 min
Step 3: +85°C±2°C/30 min±3 min
Step 4: ordinary temperature/10 min to 15 min
Number of testing: 10 cycles
Post-treatment: left at a room condition for 24 h±2 h

10. Specification of Packaging

10.1 Appearance and dimensions of tape (12 mm width/plastic tape)

A 5.3±0.1
B 5.3±0.1
t 4.2±0.1
t' (0.4)
(in mm)

* The dimensions of the cavity are measured at its bottom.

10.2 Taping specifications

Packing quantity ø180 mm reel: 400 pcs/reel
(Standard quantity) ø330 mm reel: 1500 pcs/reel
Packing method The products are placed in embossed cavities of a plastic tape and sealed by a cover tape.
Feed hole position The feed holes on the plastic tape are on the right side when the cover tape is pulled toward the user.
Joint The plastic tape and the cover tape are seamless.
Number of missing Number of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and
products are not continuous. The specified quantity per reel is kept.

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Spec No.: JELF243A_0122J-01 P5/9
10.3 Break down force of tape
Break down force of plastic tape 10 N min.
Break down force of cover tape 5 N min.

10.4 Peeling off force of cover tape

Speed of peeling off 300 mm/min
Peeling off force 0.2 N to 0.7 N (The lower limit is for typical value.)

165 to 180 degree

F Cover tape

Plastic tape

10.5 Dimensions of leader section, trailer section and reel

A vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader
section is further provided with an area consisting only of the cover tape. (See the diagram below.)
• Packaging: L (ø180 mm reel)

• Packaging: K (ø330 mm reel)

10.6 Marking for reel

Customer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc.
*1 Expression of inspection No.: (1) Factory code
□□ ○○○○  (2) Date
(1) (2) (3) First digit: year/last digit of year
Second digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D
Third, Fourth digit: day
(3) Serial No.
*2 Expression of RoHS marking: (1) RoHS regulation conformity
ROHS- Y () (2) Murata classification number
(1) (2)

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Spec No.: JELF243A_0122J-01 P6/9
10.7 Marking on outer box (corrugated box)
Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.

10.8 Specification of outer box

Dimensions of outer box

(mm) Standard reel quantity
Reel
in outer box (reel)
Label W D H
H ø180 mm 186 186 93 4
ø330 mm 340 340 95 4
D
* Above outer box size is typical. It depends on a quantity of an
W order.

11. Caution

11.1 Restricted applications

Restricted Please contact us before using our products for the applications listed below which require especially high
applications reliability for the prevention of defects which might directly cause damage to the third party's life, body or
property.

(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster/crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and/or reliability requirements
to the applications listed in the above

11.2 Corrosive gas

Please refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide,
etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated
corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of
product electrode, etc. We will not bear any responsibility for use under these environments.

12. Precautions for Use

This product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other
mounting method, for example, using a conductive adhesive, please consult us beforehand.

12.1 Land dimensions

The following diagram shows the recommended land dimensions for reflow soldering.
The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other land
dimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional
shift. If you use other land pattern, consider it adequately.

(in mm)

MURATA MFG CO., LTD

Spec No.: JELF243A_0122J-01 P7/9
12.2 Flux and solder used
Flux • Use a rosin-based flux.
• Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value).
• Do not use a water-soluble flux.
Solder • Use Sn-3.0Ag-0.5Cu solder.
• Standard thickness of solder paste: 100 μm to 150 μm
If you want to use a flux other than the above, please consult our technical department.

12.3 Soldering conditions (reflow)

• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to
100°C max.
Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality.
• Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of
product quality.

Temp. 260℃
(℃)
245℃±3℃
230℃
220℃
Limit Profile
180

150

30s～60s Standard Profile

60s max.

90s±30s Time. (s)

Standard profile Limit profile

Pre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s
Heating Above 220°C/30 s to 60 s Above 230°C/60 s max.
Peak temperature 245°C±3°C 260°C/10 s
Number of reflow cycles 2 times 2 times

12.4 Reworking with soldering iron

The following requirements must be met to rework a soldered product using a soldering iron.
Item Requirement
Pre-heating 150°C/approx. 1 min
Tip temperature of soldering iron 380°C max.
Power consumption of soldering iron 80 W max.
Tip diameter of soldering iron ø3 mm max.
Soldering time 3 s (+1 s, -0 s)
Number of reworking operations 2 times max.
* Avoid a direct contact of the tip of the soldering iron with the product. Such a
direction contact may cause cracks in the ceramic body due to thermal shock.

12.5 Solder volume

Solder shall be used not to increase the volume too much.
An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of
mechanical or electrical performance.

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Spec No.: JELF243A_0122J-01 P8/9
12.6 Product's location
The following shall be considered when designing and laying out PCBs.
(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board.
[Products direction]
Products shall be located in the sideways direction to the mechanical stress.

Electrode

(Poor example) (Good example)

Electrode

(2) Components location on PCB separation

It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible to reduce
stress.
Contents of measures Stress level
(1) Turn the mounting direction of the component parallel to the
A > D*1
board separation surface.
(2) Add slits in the board separation part. A>B
(3) Keep the mounting position of the component away from the
A>C
board separation surface.
*1 A > D is valid when stress is added vertically to the perforation as with hand separation.
If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.

Perforation C
B
Electrode

A D
Slit
Electrode

(3) Mounting components near screw holes

When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the
tightening of the screw.
Mount the component in a position as far away from the screw holes as possible.

Screw Hole Recommended

12.7 Handling of substrate

After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate
when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.

Bending Twisting

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Spec No.: JELF243A_0122J-01 P9/9

12.8 Cleaning
The product shall be cleaned under the following conditions.
(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°C
max.
(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon in
mounted products and the PCB.
Item Requirement
Power 20 W/L max.
Time 5 min max.
Frequency 28 kHz to 40 kHz
(3) Cleaner
Alcohol-based cleaner: IPA
Aqueous agent: PINE ALPHA ST-100S
(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized water
adequately and completely dry it so that no cleaner is left.
* For other cleaning, consult our technical department.

12.9 Storage and transportation

Storage period Use the product within 12 months after delivery.
If you do not use the product for more than 12 months, check solderability before using it.
Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.
The recommended temperature range is -10°C to +40°C. The recommended relative humidity
range is 15% to 85%.
Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes the
electrode, resulting in poor solderability or corrosion of the coil wire of the product.
• Do not keep products in bulk packaging. Doing so may cause collision between the products or
between the products and other products, resulting in core chipping or wire breakage.
• Do not place the products directly on the floor; they should be placed on a palette so that they are
not affected by humidity or dust.
• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.
Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution when
handling the products.

12.10 Resin coating

The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operating
condition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some
operating condition may cause corrosion of wire of coil, leading to wire breakage.
So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your
board.

12.11 Handling of product

• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the
winding portion to prevent the breaking of wire.
• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.

13. Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted to
your product.
(2) You are requested not to use our product deviating from the agreed specifications.
(3) The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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