BC557
BC557
BC557
DATA SHEET
dbook, halfpage
M3D186
BC556; BC557
PNP general purpose transistors
Product data sheet 2004 Oct 11
Supersedes data of 1999 Apr 15
NXP Semiconductors Product data sheet
FEATURES PINNING
• Low current (max. 100 mA) PIN DESCRIPTION
• Low voltage (max. 65 V). 1 emitter
2 base
APPLICATIONS 3 collector
• General purpose switching and amplification.
1
MAM281
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
BC556 SC-43A plastic single-ended leaded (through hole) package; 3 leads SOT54
BC557
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base voltage open emitter
BC556 − −80 V
BC557 − −50 V
VCEO collector-emitter voltage open base
BC556 − −65 V
BC557 − −45 V
VEBO emitter-base voltage open collector − −5 V
IC collector current (DC) − −100 mA
ICM peak collector current − −200 mA
IBM peak base current − −200 mA
Ptot total power dissipation Tamb ≤ 25 °C − 500 mW
Tstg storage temperature −65 +150 °C
Tj junction temperature − 150 °C
Tamb ambient temperature −65 +150 °C
2004 Oct 11 2
NXP Semiconductors Product data sheet
THERMAL CHARACTERISTICS
Note
1. Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
Notes
1. VBEsat decreases by about −1.7 mV/K with increasing temperature.
2. VBE decreases by about −2 mV/K with increasing temperature.
2004 Oct 11 3
NXP Semiconductors Product data sheet
MBH726
300
handbook, full pagewidth
hFE
200
VCE = −5 V
100
0
−10−1 −1 −10 −102 IC (mA) −103
BC556A.
MBH727
400
handbook, full pagewidth
hFE
VCE = −5 V
300
200
100
0
−10−2 −10−1 −1 −10 −102 IC (mA) −103
BC556B; BC557B.
2004 Oct 11 4
NXP Semiconductors Product data sheet
MBH728
600
handbook, full pagewidth
hFE
500
VCE = −5 V
400
300
200
100
0
−10−2 −10−1 −1 −10 −102 IC (mA) −103
BC557C.
2004 Oct 11 5
NXP Semiconductors Product data sheet
PACKAGE OUTLINE
d A L
1
e1
2
D e
b1
L1
0 2.5 5 mm
scale
UNIT A b b1 c D d E e e1 L L1(1)
max.
5.2 0.48 0.66 0.45 4.8 1.7 4.2 14.5
mm 2.54 1.27 2.5
5.0 0.40 0.55 0.38 4.4 1.4 3.6 12.7
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
04-06-28
SOT54 TO-92 SC-43A
04-11-16
2004 Oct 11 6
NXP Semiconductors Product data sheet
DOCUMENT PRODUCT
DEFINITION
STATUS(1) STATUS(2)
Objective data sheet Development This document contains data from the objective specification for product
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
General ⎯ Information in this document is believed to be
above those given in the Characteristics sections of this
accurate and reliable. However, NXP Semiconductors
document is not implied. Exposure to limiting values for
does not give any representations or warranties,
extended periods may affect device reliability.
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the Terms and conditions of sale ⎯ NXP Semiconductors
consequences of use of such information. products are sold subject to the general terms and
conditions of commercial sale, as published at
Right to make changes ⎯ NXP Semiconductors
http://www.nxp.com/profile/terms, including those
reserves the right to make changes to information
pertaining to warranty, intellectual property rights
published in this document, including without limitation
infringement and limitation of liability, unless explicitly
specifications and product descriptions, at any time and
otherwise agreed to in writing by NXP Semiconductors. In
without notice. This document supersedes and replaces all
case of any inconsistency or conflict between information
information supplied prior to the publication hereof.
in this document and such terms and conditions, the latter
Suitability for use ⎯ NXP Semiconductors products are will prevail.
not designed, authorized or warranted to be suitable for
No offer to sell or license ⎯ Nothing in this document
use in medical, military, aircraft, space or life support
may be interpreted or construed as an offer to sell products
equipment, nor in applications where failure or malfunction
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of an NXP Semiconductors product can reasonably be
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Applications ⎯ Applications that are described herein for Quick reference data ⎯ The Quick reference data is an
any of these products are for illustrative purposes only. extract of the product data given in the Limiting values and
NXP Semiconductors makes no representation or Characteristics sections of this document, and as such is
warranty that such applications will be suitable for the not complete, exhaustive or legally binding.
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
2004 Oct 11 7
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Contact information
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The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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Printed in The Netherlands R75/04/pp8 Date of release: 2004 Oct 11 Document order number: 9397 750 13571
Mouser Electronics
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