Transparent SONET-SDH Over Packet Transceivers DS

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DATA SHEET

Transparent SONET/SDH
over Packet Transceivers
OC3/STM1, OC12/STM4, OC48/STM16

Ciena’s Transparent SONET/SDH over Packet Transceivers Features and benefits


enable cost-effective transport of OC3/STM1, OC12/STM4, • Provides an efficient method to
transport SONET/SDH over packet
and OC48/STM16 streams over packet. in a transparent payload using MEF8
or MPLS frame header formats
The small form-factor pluggable (SFP) modules convert either a SONET • Integrates transparent SONET/SDH
(OC-3/12/48) or SDH (STM-1/4/16) stream into fixed lengths for transmission over packet (TSoP) technology into
a cost-effective module, reducing
over a packet-switched network (PSN). Legacy TDM services can thus be
system and network complexity
transported over an Ethernet or IP/multi-protocol label switching (MPLS) while offering a lower carbon
network. Frames are transmitted using a 1 Gigabit Ethernet (GbE) or 10 footprint to yield significant CAPEX
GbE port on the host device through one or more PSNs (in case of multiple and OPEX savings
operators). At the remote end, the frames are converted back to TDM traffic • Operates at an industrial
temperature range (-40°C to +85°C)
for handoff as TDM services.
• Eliminates TDM leased line costs
TDM-to-packet modernization • Delivers plug-and-play operation
with TSoP equipment
With many network operators transforming their networks to Ethernet and
IP/MPLS transport, TDM over packet emerges as a key enabler to efficiently
migrate legacy services to the new IP/MPLS infrastructure. Using a single
unified network for both data and TDM transport can streamline operations
and reduce capital and operational expenditures.

The IP/MPLS network allows for greater economies of scale for multiple
service types (video, voice, mobile, and so on) while still accommodating
the need to reliably carry legacy traffic from TDM interfaces, which are
likely still in use in many enterprise and industrial scenarios. Whether
servicing traditional PBX units, utility teleprotection relays, digitized voice
equipment, or supervisory control and data acquisition (SCADA) systems,
low-to-moderate—speed TDM endpoints will remain common interfaces
into the modernized network for decades to come. These services must be
accommodated within the same infrastructure as the growing data network
to remain cost-effective while not sacrificing the highest reliability these
systems require.

1
OC12/STM4
TDM core
Enterprise

OC3/STM1 TDM pseudowire

SME Packet-switched network IP/MPLS


core
OC48/STM16

Mobile 39xx/51xx
infrastructure

Figure 1. OC3/STM1, OC12/STM4, and OC48/STM16 to SONET/SDH TSoP pseudowires

Cost-effective yet reliable TDM migration TSoP sender-receiver functions


Each TSoP transceiver provides an optical LC Each module supports the following functions from
interface to connect SONET and SDN optical signals. optical to the electrical interface:
The XCVR-TSOP01 supports OC3/STM1 connections • Non-intrusive monitoring of incoming optical signal
up to 15 km, while the XCVR-TSOP02 transceiver
delivers OC12/STM4 for 15 km and the XCVR-TSOP03 • TDM payload fixed-size (810 octets) data block
can provide OC48/STM16 connections up to 2 km. • Encapsulation of the data blocks with packet
headers, RTP header, and FCS
To transport OC3/12/48 or STM1/4/16 circuits
through an IP/MPLS network, the user payload is Each module supports the following functions from
broken into fragments and a TSoP encapsulation electrical to optical interface:
header is prepended to each fragment. In this method • Nonintrusive monitoring of outgoing optical signal
of encapsulating TDM, the SONET/SDH signal is
• Decapsulation of TDM data blocks
transported and can preserve the OC3/12/48 or
STM1/4/16 connectivity, as the signal is transported • Delay-buffer management, packet sequencing,
as clear channel across the network. This is and clock recovery from RTP header
beneficial, as the SONET/SDH protocols, overhead
bytes, protection schemes, and synchronization are
transported transparently.

2
Technical information
XCVR-TSOP01 XCVR-TSOP02 XCVR-TSOP03
Interface OC3/STM1 OC12/STM4 OC48/STM16
Optical budget (km) 15 15 2
Jitter and wander tolerance ITU-T G.825 and GR-253-CORE
Packet dely variation buffer size 624 usec
Mechanical LC LC LC
Header formats MEF8 and MPLS frame header without VLAN tag
Management and support Management via service-aware operating system (SAOS)
Physical dimensions (mm) 57 (W) x 14(D) x 12 (H) 57 (W) x 14(D) x 12 (H) 57 (W) x 14(D) x 12 (H)
Power (w) 1.2 (Typical) 1.4 (Max.) 1.3 (Typical) 1.5 (Max.) 2.5 (Typical) 2.7 (Max.)
Weight (g) 15 50 15

Ordering information
Part Number Description

XCVR-TSOP01 TDM OVER PACKET, TRANSPARENT OC3/STM1 OVER ETHERNET, DUPLEX, LC, 15KM

XCVR-TSOP02 TDM OVER PACKET, TRANSPARENT OC12/STM4 OVER ETHERNET, DUPLEX, LC, 15KM

XCVR-TSOP03 TDM OVER PACKET, TRANSPARENT OC48/STM16 OVER ETHERNET, DUPLEX, LC, 2KM

Ciena may make changes at any time to the products or specifications contained herein
without notice. Ciena and the Ciena Logo are trademarks or registered trademarks
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their respective owners and do not imply a partnership between Ciena and any other
company. Copyright © 2024 Ciena® Corporation. All rights reserved. DS398 6.2024

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