Unit 5 - Digital Logic Families
Unit 5 - Digital Logic Families
Unit 5 - Digital Logic Families
Memory & Programmable Logic Devices: Digital Logic Families: DTL, DCTL, TTL, ECL & CMOS
etc., Fan Out, Fan in, Noise Margin; RAM, ROM, PLA, PAL; Circuits of Logic Families, Interfacing of
Digital Logic Families, Circuit Implementation using ROM, PLA and PAL; CPLD and FPGA.
The basic building blocks of logic circuits are logic gates. And logic gates themselves are
simple electronic circuits comprising of diodes, transistors and resistors.
The characteristics which are bound to be identical and used to compare performance are:
1. Supply voltage range 4. Input and output logic levels 7. Flexibility
2. Speed of response 5. Current sinking capability 8. Noise immunity
3. Dissipation of power 6. Current sourcing capability 9. Fan-out
Propagation Delay: - Time required for a pulse to propagate from input to output.
Fan in: - no: of inputs that the gate is designed to handle
Fan out: - no; of std. loads that the output of a gate can drive without impairing its normal
operation.
Noise margin: - Noise immunity is the ability of a circuit to tolerate noise voltages at its inputs.
Quantitative measure of noise immunity is Noise margin.
Or
The maximum noise voltage that can be tolerated by a circuit is termed its noise immunity
Speed Power Product: - for measuring the overall performance of an IC family. (Propagation
delay * gate power dissipation)(Figure of merit of an IC family)
Integration Levels:
SSI: Small scale integration 12 gates/chip
MSI: Medium scale integration 100 gates/chip
LSI: Large scale integration 1K gates/chip
VLSI: Very large scale integration 10K gates/chip
ULSI: Ultra large scale integration 100K gates/chip
TYPES OF LOGIC FAMILY
There are two kinds of semiconductor devices. The logic family which falls under the first
kind Bipolar logic family and the other is Unipolar logic family.
BIPOLAR LOGIC FAMILY
It mainly uses bipolar devices like diodes, transistors in addition to passive elements like
resistors and capacitors. There are two kinds of operations in bipolar integrated circuits:
(a) Saturated Bipolar Logic family and
(b) Non-saturated Bipolar Logic family.
(a) Saturated Bipolar Logic Families: In this family the transistors used in ICs are driven into
saturation. These are
1. Diode logic (DL) 5. Transistor Transistor Logic (TTL)
2. Resistor Transistor Logic (RTL) 6. Direct Coupled Transistor Logic (DCTL)
3. Diode Transistor Logic (DTL) 7. High Threshold Logic(HTL)
4. Integrated Injection Logic (IIL or I2L)
(b) Non-saturated Bipolar Logic Families: In this family the transistors used in IC is not driven
into saturation. These are
1. Schottky TTL
2. Emitter Coupled Logic (ECL)
UNIPOLAR LOGIC FAMILY
Unipolar logic family consists of Metal Oxide Semiconductor (MOS) logic families. It mainly
uses unipolar devices like MOSFETs in addition to passive elements like resistors and capacitors.
These logic families have the advantages of high speed and lower power consumption than bipolar
families. These are classified as:
1. P-type MOS (PMOS) Logic 4. Bipolar MOS (BiMOS) logic
2. N-type MOS (NMOS) logic 5. Bipolar CMOS (BiCMOS) logic
3. Complementary MOS (CMOS) logic
DIODE LOGIC GATES
Diode logic is implemented by diodes which exhibit low impedance when forward biased
and a very high impedance when reverse biased. There are two kinds of diode logic gates - OR
and AND. It is not possible to construct NOT (invert) diode gates because the invert function
requires an active component such as a transistor.
OR logic gate
All diodes have inputs on their anodes and their cathodes are connected together to drive the
output. R is connected from the output to some negative voltage (-6 volts) to provide bias current
for the diodes.
AND logic gate
The diode AND is basically the same as the OR except it is turned upside down. The diodes
are reversed so that the cathodes are connected to the inputs and the anodes are connected together
to provide the output. R is connected to +12 volts to provide the forward bias current for the diodes
and current for output drive.
RTL AND DTL CIRCUITS
RTL Basic Gate
Each input is associated with one resistor and one transistor. The collectors of the transistors
are tied together at the output.
The voltage levels for the circuit are 0.2 V for the low level and from 1 to 3.6 V for the high
level. The working of npn transistor is as follows:
(1) Input = High, Transistor goes into saturation region (ON switch).
(2) Input = Low, Transistor goes into cutoff region (OFF switch).
The RTL basic NOR gate is shown in figure below:
Complementary MOS
Complementary MOS (CMOS) circuits take advantage of the fact that both n-channel and
p-channel devices can be fabricated on the same substrate.
To understand the operation of the inverter, we must review the behavior of the MOS transistor
from the previous section:
1. The n-channel MOS conducts when its gate-to-source voltage is positive.
2. The p-channel MOS conducts when its gale-to-source voltage is negative.
3. Either type of device is turned off if its gate-to-source voltage is zero.
Implementation of the logic gates using CMOS:
1. Implement the AND or OR combination of the Boolean expression with n-channel.
2. Make the opposite configuration of n-channel with p-channel MOS (change AND into OR
and vice versa).
3. Connect both the configuration.
4. The output will be complement of the configuration.
Basic NOT, NAND and NOR gates implementation by CMOS is shown in the figure given below:
Content of a memory
Each word in memory is assigned an identification number, called an address, starting from 0 up
to 2k-1, where k is the number of address lines.
The number of words in a memory with one of the letters K=210, M=220, or G=230.
64K = 216 ; 2M = 221; 4G = 232
Types of memories:
In random-access memory, the word locations may be thought of as being separated in space,
with each word occupying one particular location.
In sequential-access memory, the information stored in some medium is not immediately
accessible, but is available only certain intervals of time. A magnetic disk or tape unit is of this
type.
There are two basic types of RAM:
1. Dynamic Ram
2. Static RAM
Dynamic RAM: loses its stored information in a very short time (for millisecond.) even when
power supply is on. D-RAM’s are cheaper.
READ ONLY MEMORY
It’s non-volatile memory, i.e., the information stored in it, is not lost even if the power supply
goes off. It’s used for the permanent storage of information. It also possess random access property.
Information cannot be written into a ROM by the users/programmers. In other words the contents
of ROMs are decided by the manufactures.
A ROM is essentially a memory device in which permanent binary information is stored. Once
the pattern is established it stays within the unit even when power is turned off and on again.
A block diagram of ROM is shown in the figure below. ROM is characterized by the number
of words 2n and number of bits/word n.
The number of words in a ROM is determined from the fact that k address input lines are
needed to specify 2k words.
Consider for example a 32 x 8 ROM. The unit consists of 32 words of 8 bits each. There are
five input lines that form the binary numbers from 0 through 31 for the address. The Figure shows
the internal logic construction of the ROM.
The five inputs are decoded into 32 distinct outputs by means of a 5 x 32 decoder. Each output
of the decoder represents a memory address. The 32 outputs of the decoder are connected to each
of the eight OR gates.
Types of ROMs:
The following types of ROMs are listed below:
(i) PROM: It’s programmable ROM. Its contents are decided by the user. The user can
store permanent programs, data etc. in a PROM. The data is fed into it using a PROM
programs.
(ii) EPROM: An EPROM is an erasable PROM. The stored data in EPROM’s can be
erased by exposing it to UV light for about 20 min. It’s not easy to erase it because the
EPROM IC has to be removed from the computer and exposed to UV light. The entire
data is erased and not selected portions by the user. EPROM’s are cheap and reliable.
(iii) EEPROM (Electrically Erasable PROM): The chip can be erased & reprogrammed on
the board easily byte by byte. It can be erased within a few milliseconds. There is a
limit on the number of times the EEPROM’s can be reprogrammed, i.e.; usually around
10,000 times.
(iv) CPLD: A combinational PLD is an integrated circuit with programmable gates divided
into an AND array and an OR array to provide an AND-OR sum of product
implementation.
(a) PROM: fixed AND array constructed as a decoder and programmable OR array.
(b) PAL: programmable AND array and fixed OR array.
(c) PLA: both the AND and OR arrays can be programmed.
COMBINATIONAL PLDs
The PROM is a combinational programmable logic device (PLD). A combinational PLD is an
integrated circuit with programmable gates divided into an AND array and an OR array to provide
an AND-OR sum of product implementation. There are three major types of combinational PLDs
and they differ in the placement of the programmable connections in the AND-OR array. The
Figure 3 shows the configuration of three PLDs.
PAL with Four Inputs, Four Outputs and Three Wide AND-OR Structure