Unit V
Unit V
(i).Physical attacks are divided into three categories: noninvasive, semi-invasive, and
invasive attacks.
(ii).A noninvasive attack does not require any initial preparations of the device under test,
and will not physically harm the device during the attack. The attacker can either tap the
wires to the device, or plug it into a test circuit for the analysis.
(iii).Invasive attacks require direct access to the internal components of the device, which
normally requires a well-equipped and knowledgeable attacker to succeed.
Meanwhile, invasive attacks are becoming constantly more demanding and expensive, as
feature sizes shrink, and device complexity increases.
(iv).There is a large gap between noninvasive and invasive attacks.Many attacks fall into this
gap, called semi-invasive attacks. They are not very expensive as classical penetrative
invasive attacks, but are as easily repeatable as noninvasive attacks. Like invasive attacks,
they require depackaging the chip in order to get access to its surface. However, the
passivation layer of the chip remains intact, as semi-invasive methods do not require creating
contacts to the internal wires.
9. What are t-Private Circuits, a circuit which is used to mitigate physical attacks?
The t -private circuit technique is based on the assumption that the number of concurrent
probe channels that an attacker could use is limited, and exhausting this resource deters an
attack. In this technique, the circuit of a security-critical block is transformed so that at least t
+ 1 probes are required within one clock cycle to extract one bit of information. First,
masking is applied to split computation into multiple separate variables, where an important
binary signal x is encoded into t +1 binary signals by XORing it with t independently
generated random signals (rt+1 = x⊕r1⊕· · ·⊕rt).
Input encoder (left) and output decoder (right) for masking in t-private circuits.
14. What are the differences between reverse engineering with honest and dishonest
motivations?
15. List three categories of reverse engineering and their differences.
(1) Chip-level RE: Digital chips include application-specific integrated circuits
(ASICs), field-programmable gate arrays (FPGAs), and memories. RE of chips can be
nondestructive or destructive. X-ray tomography is a nondestructive method of RE that can
provide layer-by-layer images of chips, and is often used for the analysis of internal vias,
traces, wire bonding, capacitors, contacts, or resistors. Destructive analysis, on the other
hand, might consist of etching and grinding every layer for analysis.
(2) PCB-level RE: Electronic chips and components are mounted on a laminated
nonconductive
PCB [17] and electrically interconnected using conductive copper traces and vias.
(3)System-level RE: A system’s firmware includes the information about the system’s
operation and timing, and is typically embedded within nonvolatile memories (NVMs), such
as ROM, EEPROM, and Flash. RE can provide a deeper insight into the system under attack.