MAX668/MAX669 1.

8V to 28V Input, PWM Step-Up

Controllers in μMAX

General Description Benefits and Features

The MAX668/MAX669 constant-frequency, pulse-width- ●● 1.8V Minimum Start-Up Voltage (MAX669)
modulating (PWM), current-mode DC-DC controllers are ●● Wide Input Voltage Range (1.8V to 28V)
designed for a wide range of DC-DC conversion applications
including step-up, SEPIC, flyback, and isolated-output ●● Tiny 10-Pin μMAX Package
configurations. Power levels of 20W or more can be ●● Current-Mode PWM and Idle Mode™ Operation
controlled with conversion efficiencies of over 90%. The ●● Efficiency over 90%
1.8V to 28V input voltage range supports a wide range of
●● Adjustable 100kHz to 500kHz Oscillator or
battery and AC-powered inputs. An advanced BiCMOS
SYNC Input
design features low operating current (220μA), adjustable
operating frequency (100kHz to 500kHz), soft-start, and ●● 220μA Quiescent Current
a SYNC input allowing the MAX668/MAX669 oscillator to ●● Logic-Level Shutdown
be locked to an external clock.
●● Soft-Start
DC-DC conversion efficiency is optimized with a low
100mV current-sense voltage as well as with Maxim’s Applications
proprietary Idle Mode™ control scheme. The controller ●● Cellular Telephones
operates in PWM mode at medium and heavy loads for ●● Telecom Hardware
lowest noise and optimum efficiency, then pulses only as ●● LANs and Network Systems
needed (with reduced inductor current) to reduce operating ●● POS Systems
current and maximize efficiency under light loads. A logic-
level shutdown input is also included, reducing supply Ordering Information
current to 3.5μA. PART TEMP RANGE PIN-PACKAGE
The MAX669, optimized for low input voltages with a MAX668EUB -40°C to +85°C 10 µMAX
guaranteed start-up voltage of 1.8V, requires bootstrapped MAX669EUB -40°C to +85°C 10 µMAX
operation (IC powered from boosted output). It supports MAX669EUB/V+T -40°C to +85°C 10 µMAX
output voltages up to 28V. The MAX668 operates with Idle Mode is a trademark of Maxim Integrated Products.
inputs as low as 3V and can be connected in either a boot- + Denotes a lead(Pb)-free/RoHS-compliant package.
strapped or non-bootstrapped (IC powered from input sup- T = Tape and reel.
ply or other source) configuration. When not bootstrapped,
/V Denotes an automotive qualified part.
it has no restriction on output voltage. Both ICs are avail-
Note: Devices are also available in a lead(Pb)-free/RoHS-
able in an extremely compact 10-pin μMAX package. compliant package. Specify lead-free by adding “+” to the part
number when ordering.

Typical Operating Circuit Pin Configuration

VIN = 1.8V to 28V

TOP VIEW
VOUT = 28V
VCC
SYNC/ EXT
SHDN LDO 1 10 SYNC/SHDN
FREQ CS+ FREQ 2 9 VCC
MAX668
MAX669 GND 3 MAX669 8 EXT
REF 4 7 PGND
LDO PGND
FB 5 6 CS+
FB
REF
GND µMAX

19-4778; Rev 3; 6/16

MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

Absolute Maximum Ratings

VCC to GND...........................................................-0.3V to +30V Continuous Power Dissipation (TA = +70°C)
PGND to GND.....................................................................±0.3V 10-Pin μMAX (derate 5.6mW/°C above +70°C) ..........444mW
SYNC/SHDN to GND.............................................-0.3V to +30V Operating Temperature Range............................ -40°C to +85°C
EXT, REF to GND................................... -0.3V to (VLDO + 0.3V) Junction Temperature.......................................................+150°C
LDO, FREQ, FB, CS+ to GND.................................-0.3V to +6V Storage Temperature Range............................. -65°C to +150°C
LDO Output Current............................................ -1mA to +20mA Lead Temperature (soldering,10sec)................................ +300°C
REF Output Current.............................................. -1mA to +1mA Soldering Temperature (Reflow).......................................+300°C
LDO Short Circuit to GND.......................................... Momentary Lead(Pb)-Free Packages.................................................+260°C
REF Short Circuit to GND..........................................Continuous Packages Containing Lead(Pb).......................................+240°C

Electrical Characteristics
(VCC = VLDO = +5V, ROSC = 200kΩ, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)

PARAMETER CONDITIONS MIN TYP MAX UNITS

PWM CONTROLLER
MAX668 3 28
Input Voltage Range, VCC V
MAX669 1.8 28
Input Voltage Range with VCC Tied to LDO 2.7 5.5 V
FB Threshold 1.225 1.250 1.275 V
Typically 0.013% per mV on CS+;
FB Threshold Load Regulation VCS+ range is 0 to 100mV for 0 to full load 0.013 %/mV
current.

Typically 0.012% per % duty factor on

FB Threshold Line Regulation EXT; EXT duty factor for a step-up is: 0.012 %/%
100% (1 – VIN/VOUT)
FB Input Current VFB = 1.30V 1 20 nA
Current Limit Threshold 85 100 115 mV
Idle Mode Current-Sense Threshold 5 15 25 mV
CS+ Input Current CS+ forced to GND 0.2 1 µA
VCC Supply Current (Note 1) VFB = 1.30V, VCC = 3V to 28V 220 350 µA
Shutdown Supply Current (VCC) SYNC/SHDN = GND, VCC = 28V 3.5 6 µA
REFERENCE AND LDO REGULATORS
5V ≤ VCC ≤ 28V
4.50 5.00 5.50
LDO load = (includes LDO dropout)
LDO Output Voltage V
∞ to 400Ω 3V ≤ VCC ≤ 28V
2.65 5.50
(includes LDO dropout)
Sensed at LDO, falling edge,
Undervoltage Lockout Threshold 2.40 2.50 2.60 V
hysteresis = 1%, MAX668 only
REF Output Voltage No load, CREF = 0.22μF 1.225 1.250 1.275 V
REF Load Regulation REF load = 0 to 50μA -2 -10 mV
REF Undervoltage Lockout Threshold Rising edge, 1% hysteresis 1.0 1.1 1.2 V
OSCILLATOR
ROSC = 200kΩ ±1% 225 250 275
Oscillator Frequency ROSC = 100kΩ ±1% 425 500 575 kHz
ROSC = 500kΩ ±1% 85 100 115

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

Electrical Characteristics (continued)

(VCC = VLDO = +5V, ROSC = 200kΩ, TA = 0°C to +85°C, unless otherwise noted. Typical values are at TA = +25°C.)

PARAMETER CONDITIONS MIN TYP MAX UNITS

ROSC = 200kΩ ±1% 87 90 93
Maximum Duty Cycle ROSC = 100kΩ ±1% 86 90 94 %
ROSC = 500kΩ ±1% 86 90 94
Minimum EXT Pulse Width 290 ns
Minimum SYNC Input-Pulse Duty Cycle 20 45 %
Minimum SYNC Input Low Pulse Width 50 200 ns
SYNC Input Rise/Fall Time Not tested 200 ns
SYNC Input Frequency Range 100 500 kHz
SYNC/SHDN Falling Edge to Shutdown
70 µs
Delay
3.0V < VCC < 28V 2.0
SYNC/SHDN Input High Voltage V
1.8V < VCC < 3.0V (MAX669) 1.5
3.0V < VCC < 28V 0.45
SYNC/SHDN Input Low Voltage V
1.8V < VCC < 3.0V (MAX669) 0.30
VSYNC/SHDN = 5V 0.5 3.0
SYNC/SHDN Input Current µA
VSYNC/SHDN = 28V 1.5 6.5
EXT Sink/Source Current EXT forced to 2V 1 A
EXT On-Resistance EXT high or low 2 5 Ω

Electrical Characteristics
(VCC = VLDO = +5V, ROSC = 200kΩ, TA = -40°C to +85°C, unless otherwise noted.) (Note 2)

PARAMETER CONDITIONS MIN MAX UNITS

PWM CONTROLLER
MAX668 3 28
Input Voltage Range, VCC V
MAX669 1.8 28
Input Voltage Range with VCC Tied to LDO 2.7 5.5 V
FB Threshold 1.22 1.28 V
FB Input Current VFB = 1.30V 20 nA
Current-Limit Threshold 85 115 mV
Idle Mode Current-Sense Threshold 3 27 mV
CS+ Input Current CS+ forced to GND 1 µA
VCC Supply Current (Note 1) VFB = 1.30V, VCC = 3V to 28V 350 µA
Shutdown Supply Current (VCC) SYNC/SHDN = GND, VCC = 28V 6 µA
REFERENCE AND LDO REGULATORS
5V ≤ VCC ≤ 28V
4.50 5.50
LDO load = (includes LDO dropout)
LDO Output Voltage V
∞ to 400Ω 3V ≤ VCC ≤ 28V
2.65 5.50
(includes LDO dropout)
Sensed at LDO, falling edge,
LDO Undervoltage Lockout Threshold 2.40 2.60 V
hysteresis = 1%, MAX669 only

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

Electrical Characteristics (continued)

(VCC = VLDO = +5V, ROSC = 200kΩ, TA = -40°C to +85°C, unless otherwise noted.) (Note 2)

PARAMETER CONDITIONS MIN MAX UNITS

REF Output Voltage No load, CREF = 0.22μF 1.22 1.28 V
REF Load Regulation REF load = 0 to 50μA -10 mV
REF Undervoltage Lockout Threshold Rising edge, 1% hysteresis 1.0 1.2 V
OSCILLATOR
ROSC = 200kΩ ±1% 222 278
Oscillator Frequency ROSC = 100kΩ ±1% 425 575 kHz
ROSC = 500kΩ ±1% 85 115
ROSC = 200kΩ ±1% 87 93
Maximum Duty Cycle ROSC = 100kΩ ±1% 86 94 %
ROSC = 500kΩ ±1% 86 94
Minimum SYNC Input-Pulse Duty Cycle 45 %
Minimum SYNC Input Low Pulse Width 200 ns
SYNC Input Rise/Fall Time Not tested 200 ns
SYNC Input Frequency Range 100 500 kHz
3.0V < VCC < 28V 2.0
SYNC/SHDN Input High Voltage V
1.8V < VCC < 3.0V (MAX669) 1.5
3.0V < VCC < 28V 0.45
SYNC/SHDN Input Low Voltage V
1.8V < VCC < 3.0V (MAX669) 0.30
VSYNC/SHDN = 5V 3.0
SYNC/SHDN Input Current µA
VSYNC/SHDN = 28V 6.5
EXT On-Resistance EXT high or low 5 Ω
Note 1: This is the VCC current consumed when active but not switching. Does not include gate-drive current.
Note 2: Limits at TA = -40°C are guaranteed by design.

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 MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

Typical Operating Characteristics

(Circuits of Figures 2, 3, 4, and 5; TA = +25°C; unless otherwise noted.)

EFFICIENCY vs. LOAD CURRENT MAX668 EFFICIENCY vs. MAX668 EFFICIENCY vs.
(VOUT = 5V) LOAD CURRENT (VOUT = 12V) LOAD CURRENT (VOUT = 24V)
95 95 95
MAX668 toc01

MAX668 toc02

MAX668 toc03
VIN = 3.6V
90 VIN = 12V
VIN = 3.3V
90 90 VIN = 8V
85
80
EFFICIENCY (%)

EFFICIENCY (%)

EFFICIENCY (%)
VIN = 2.7V
85 85
75 VIN = 2V VIN = 5V

70
80 80
65
VIN = 5V
60 BOOTSTRAPPED 75 NON-BOOTSTRAPPED 75 NON-BOOTSTRAPPED
FIGURE 3 FIGURE 4 FIGURE 4
55
R4 = 200kΩ R4 = 200kΩ R4 = 200kΩ
50 70 70
1 10 100 1000 10,000 1 10 100 1000 10,000 1 10 100 1000 10,000
LOAD CURRENT (mA) LOAD CURRENT (mA) LOAD CURRENT (mA)
MAX669 MINIMUM START-UP VOLTAGE SUPPLY CURRENT vs. NO-LOAD SUPPLY CURRENT vs.
vs. LOAD CURRENT SUPPLY VOLTAGE SUPPLY VOLTAGE
3.0 1200 4000
MAX668 toc04

MAX668 toc05

MAX668 toc06
VOUT = 5V CURRENT INTO VCC PIN VOUT = 12V
3500
MINIMUM START-UP VOLTAGE (V)

NO-LOAD SUPPLY CURRENT (µA)

2.5 1000 ROSC = 500kΩ BOOTSTRAPPED
3000 FIGURE 2
SUPPLY CURRENT (µA)

R4 = 200kΩ
2.0 800
2500
VOUT = 12V
1.5 600 MAX669 2000

1500
1.0 400
1000
0.5 200
BOOTSTRAPPED 500
FIGURE 2 MAX668
0 0 0
0 100 200 300 400 500 600 700 800 900 1000 0 5 10 15 20 25 30 0 2 4 6 8 10 12
LOAD CURRENT (mA) SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V)
SHUTDOWN CURRENT vs. SUPPLY CURRENT vs. LDO DROPOUT VOLTAGE vs.
SUPPLY VOLTAGE TEMPERATURE LDO CURRENT
3.5 290 300
MAX668 toc07

MAX668 toc08

MAX668 toc09

MAX669
3.0 270 250
LDO DROPOUT VOLTAGE (mV)
SHUTDOWN CURRENT (µA)

ROSC = 100kΩ VIN = 3V

SUPPLY CURRENT (µA)

2.5 250
MAX668 200
2.0 230
ROSC = 200kΩ 150
1.5 210 VIN = 4.5V
ROSC = 500kΩ 100
1.0 190

0.5 170 50
CURRENT INTO VCC PIN
0 150 0
0 5 10 15 20 25 30 -40 -20 0 20 40 60 80 100 0.1 1 10 20
SUPPLY VOLTAGE (V) TEMPERATURE (°C) LDO CURRENT (mA)

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

Typical Operating Characteristics (continued)

(Circuits of Figures 2, 3, 4, and 5; TA = +25°C; unless otherwise noted.)

REFERENCE VOLTAGE vs.

TEMPERATURE SWITCHING FREQUENCY vs. ROSC
1.250 500

MAX668 toc11
MAX668 toc10
1.249 450

SWITCHING FREQUENCY (kHz)

1.248 400
REFERENCE VOLTAGE (V)

1.247 350
1.246 300
1.245 250
1.244 200
1.243 150
1.242 100
1.241 50
VCC = 5V VCC = 5V
1.240 0
-40 -20 0 20 40 60 80 100 0 100 200 300 400 500
TEMPERATURE (°C) ROSC (kΩ)

SWITCHING FREQUENCY vs. EXT RISE/FALL TIME vs.

TEMPERATURE CAPACITANCE
600 60
MAX668 toc12

MAX668 toc13
100kΩ
500 50
SWITCHING FREQUENCY (kHz)

EXT RISE/FALL TIME (ns)

tR, VCC = 3.3V

400 40

165kΩ tF, VCC = 3.3V

300 30

200 20
499kΩ tR, VCC = 5V
100 10
VIN = 5V tF, VCC = 5V
0 0
-40 -20 0 20 40 60 80 100 100 1000 10,000
TEMPERATURE (°C) CAPACITANCE (pF)

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

Typical Operating Characteristics (continued)

(Circuits of Figures 2, 3, 4, and 5; TA = +25°C; unless otherwise noted.)

EXITING SHUTDOWN ENTERING SHUTDOWN

MAX668 toc14

MAX668 toc15
0V
OUTPUT SHUTDOWN
VOLTAGE 0V
VOLTAGE
5V/div 5V/div
INDUCTOR
CURRENT 0A
2A/div

SHUTDOWN 0V OUTPUT 0V
VOLTAGE VOLTAGE
5V/div 5V/div
500ms/div 200µs/div
MAX668, VIN = 5V, VOUT = 12V, LOAD = 1.0A, ROSC = 100kW, MAX668, VIN = 5V, VOUT = 12V, LOAD = 1.0A,
LOW VOLTAGE, NON-BOOTSTRAPPED LOW VOLTAGE, NON-BOOTSTRAPPED

HEAVY-LOAD SWITCHING WAVEFORM LIGHT-LOAD SWITCHING WAVEFORM

MAX668 toc16

MAX668 toc17
VOUT VOUT
200mV/div 100mV/div
AC-COUPLED AC-COUPLED

Q1, DRAIN Q1, DRAIN

5V/div 5V/div
0V 0V

IL IL 0A
0A
1A/div 1A/div

1µs/div 1µs/div
MAX668, VIN = 5V, VOUT = 12V, ILOAD = 1.0A, MAX668, VIN = 5V, VOUT = 12V, ILOAD = 0.1A,
LOW VOLTAGE, NON-BOOTSTRAPPED LOW VOLTAGE, NON-BOOTSTRAPPED

LOAD-TRANSIENT RESPONSE LINE-TRANSIENT RESPONSE

MAX668 toc18

MAX668 toc19

OUTPUT OUTPUT
VOLTAGE VOLTAGE
AC-COUPLED 100mV/div
100mV/div AC-COUPLED

LOAD INPUT 0V
CURRENT VOLTAGE
1A/div 5V/div
1ms/div 20ms/div
MAX668, VIN = 5V, VOUT = 12V, ILOAD = 0.1A TO 1.0A, MAX668, VIN = 5V TO 8V, VOUT = 12V, LOAD = 1.0A,
LOW VOLTAGE, NON-BOOTSTRAPPED HIGH VOLTAGE, NON-BOOTSTRAPPED

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

Pin Description
PIN NAME FUNCTION
5V On-Chip Regulator Output. This regulator powers all internal circuitry including the EXT gate driver.
1 LDO
Bypass LDO to GND with a 1µF or greater ceramic capacitor.

Oscillator Frequency Set Input. A resistor from FREQ to GND sets the oscillator from 100kHz (ROSC =
2 FREQ 500kΩ) to 500kHz (ROSC = 100kΩ). fOSC = 5 x 1010 / ROSC. ROSC is still required if an external clock is used
at SYNC/SHDN. (See SYNC/SHDN and FREQ Inputs section.)
3 GND Analog Ground
4 REF 1.25V Reference Output. REF can source 50µA. Bypass to GND with a 0.22µF ceramic capacitor.
5 FB Feedback Input. The FB threshold is 1.25V.
6 CS+ Positive Current-Sense Input. Connect a current-sense resistor, RCS, between CS+ and PGND.
7 PGND Power Ground for EXT Gate Driver and Negative Current-Sense Input
8 EXT External MOSFET Gate-Driver Output. EXT swings from LDO to PGND.

VCC Input Supply to On-Chip LDO Regulator. VCC accepts inputs up to 28V. Bypass to GND with a 0.1µF ceramic
9
capacitor.

Shutdown control and Synchronization Input. There are three operating modes:
• SYNC/SHDN low: DC-DC off.
SYNC/
10 • SYNC/SHDN high: DC-DC on with oscillator frequency set at FREQ by ROSC.
SHDN
• SYNC/SHDN clocked: DC-DC on with operating frequency set by SYNC clock input. DC-DC conversion
cycles initiate on rising edge of input clock.

Detailed Description have undervoltage lockout, but instead drives EXT with
The MAX668/MAX669 current-mode PWM controllers an open-loop, 50% duty-cycle start-up oscillator when
operate in a wide range of DC-DC conversion applications, LDO is below 2.5V. It switches to closed-loop operation
including boost, SEPIC, flyback, and isolated output only when LDO exceeds 2.5V. If a non-bootstrapped
configurations. Optimum conversion efficiency is maintained connection is used with the MAX669 and if VCC (the
over a wide range of loads by employing both PWM input voltage) remains below 2.7V, the output voltage will
operation and Maxim’s proprietary Idle Mode control to soar above the regulation point. Table 2 recommends the
minimize operating current at light loads. Other features appropriate device for each biasing option.
include shutdown, adjustable internal operating frequency
or synchronization to an external clock, soft start, adjustable Table 1. MAX668/MAX669 Comparison
current limit, and a wide (1.8V to 28V) input range. FEATURE MAX668 MAX669
MAX668 vs. MAX669 Differences VCC Input
3V to 28V 1.8V to 28V
Range
Differences between the MAX668 and MAX669 relate
to their use in bootstrapped or non-bootstrapped circuits Bootstrapped or nonboot-
Must be boot-
(Table 1). The MAX668 operates with inputs as low strapped. VCC can be
strapped (VCC must
connected to input,
as 3V and can be connected in either a bootstrapped Operation
output, or other voltage
be connected to
or non-bootstrapped (IC powered from input supply or boosted output
source such as a logic
voltage, VOUT).
other source) configuration. When not bootstrapped, the supply.
MAX668 has no restriction on output voltage. When boot-
strapped, the output cannot exceed 28V. Under-
IC stops switching for
voltage No
LDO below 2.5V.
The MAX669 is optimized for low input voltages (down to Lockout
1.8V) and requires bootstrapped operation (IC powered
When LDO is
from VOUT) with output voltages no greater than 28V. Soft-Start Yes
above 2.5V
Bootstrapping is required because the MAX669 does not

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

PWM Controller Bootstrapped/Non-Bootstrapped Operation

The heart of the MAX668/MAX669 current-mode PWM Low-Dropout Regulator (LDO)
controller is a BiCMOS multi-input comparator that Several IC biasing options, including bootstrapped and
simultaneously processes the output-error signal, the non-bootstrapped operation, are made possible by an
current-sense signal, and a slope-compensation ramp on-chip, low-dropout 5V regulator. The regulator input is
(Figure 1). The main PWM comparator is direct summing, at VCC, while its output is at LDO. All MAX668/MAX669
lacking a traditional error amplifier and its associated functions, including EXT, are internally powered from
phase shift. The direct summing configuration approaches LDO. The VCC-to-LDO dropout voltage is typically 200mV
ideal cycle-by-cycle control over the output voltage since (300mV max at 12mA), so that when VCC is less than
there is no conventional error amp in the feedback path. 5.2V, LDO is typically VCC - 200mV. When LDO is in drop-
In PWM mode, the controller uses fixed-frequency, out, the MAX668/MAX669 still operate with VCC as low
current-mode operation where the duty ratio is set by the as 3V (as long as LDO exceeds 2.7V), but with reduced
input/output voltage ratio (duty ratio = (VOUT - VIN)/VIN amplitude FET drive at EXT. The maximum VCC input
in the boost configuration). The current-mode feedback voltage is 28V.
loop regulates peak inductor current as a function of the LDO can supply up to 12mA to power the IC, supply
output error signal. gate charge through EXT to the external FET, and supply
At light loads the controller enters Idle mode. During Idle small external loads. When driving particularly large FETs
mode, switching pulses are provided only as needed to at high switching rates, little or no LDO current may be
service the load, and operating current is minimized to available for external loads. For example, when switched
provide best light-load efficiency. The minimum-current at 500kHz, a large FET with 20nC gate charge requires
comparator threshold is 15mV, or 15% of the full-load 20nC x 500kHz, or 10mA.
value (IMAX) of 100mV. When the controller is synchro- VCC and LDO allow a variety of biasing connections to
nized to an external clock, Idle Mode occurs only at very optimize efficiency, circuit quiescent current, and full-load
light loads. start-up behavior for different input and output voltage
ranges. Connections are shown in Figure 2, Figure 3,
Figure 4, and Figure 5. The characteristics of each are
outlined in Table 1.

VCC

MAX669 ONLY LDO

1.25V
EXT LOW-VOLTAGE
LDO MUX 0
ANTISAT 1 START-UP
R1 OSCILLATOR
552k PGND (MAX669 ONLY)
UVLO MAX668
R2 MAX669
276k
REF
R3 1.25V
276k MAIN PWM
FB +A COMPARATOR
-A X6
CURRENT SENSE +C
CS+
-C X1 BIAS
SLOPE COMPENSATION SYNC/SHDN
+S X1
-S
OSC OSC
FREQ
100mV IMAX

S Q
IMIN R
15mV

Figure 1. MAX668/MAX669 Functional Diagram

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

VIN = 1.8V to 12V

C1 L1

1 VOUT = 12V @ 0.5A

LDO 8
EXT N1 D1
C4 C5 C6 C8
MAX669 6
CS+
9
V+ R1 R2
C2 7
PGND
10 SYNC/
5
SHDN FB
4
REF
3 C7 R3
C3 2 GND
FREQ

R4

Figure 2. MAX669 High-Voltage Bootstrapped Configuration

VIN = 1.8V to 5V
C1
68µF L1
10V 4.7µH

1 VOUT = 5V @ 1A
LDO 8
EXT N1 D1
C2 C4 C5 C6
MAX669 MBRS340T3
1µF 6 FDS6680 68µF 68µF 0.1µF
CS+
IRF7401 10V 10V
9 R1 R2
VCC
0.02Ω 75k
7 1%
PGND
10 SYNC/
SHDN 5
FB
4 R3
REF
3 C7 24.9k
C3 2 GND 220pF
FREQ 1%
0.221µF
R4
100k
1%

Figure 3. MAX669 Low-Voltage Bootstrapped Configuration

Bootstrapped Operation current at low input voltages. If the input voltage range
With bootstrapped operation, the IC is powered from extends below 2.7V, then bootstrapped operation with the
the circuit output (VOUT). This improves efficiency when MAX669 is the only option.
the input voltage is low, since EXT drives the FET with With VCC connected to VOUT, as in Figure 2, EXT voltage
a higher gate voltage than would be available from the swing is 5V when VCC is 5.2V or more, and VCC - 0.2V
low-voltage input. Higher gate voltage reduces the FET when VCC is less than 5.2V. If the output voltage does
on-resistance, increasing efficiency. Other (undesirable) not exceed 5.5V, the on-chip regulator can be disabled
characteristics of bootstrapped operation are increased by connecting VCC to LDO (Figure 3). This eliminates the
IC operating power (since it has a higher operating LDO forward drop and supplies maximum gate drive to
voltage) and reduced ability to start up with high load the external FET.

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

VIN = 3V to 12V
C1
68µF L1
20V 4.7µH

1 VOUT = 12V @ 1A
LDO 8
EXT N1 D1
C4 C5 C6 C8
MAX668 MBRS340T3
1µF 6 68µF 68µF 0.1µF
CS+ FDS6680
20V 20V
9 R1 R2
VCC
C2 0.02W 218k
0.1µF 7 1%
PGND
10 SYNC/
SHDN 5
FB
4 R3
REF
3 C7 24.9k
C3 2 GND 220pF
FREQ 1%
0.22µF
R4
100k
1%

Figure 4. MAX668 High-Voltage Non-Bootstrapped Configuration

VIN = 2.7V to 5.5V

C1
68µF L1
10V 4.7µH

1 VOUT = 12V @ 1A
LDO 8
EXT N1 D1
C2 C4 C5 C6
MAX668 MBRS340T3
1µF 6 68µF 68µF 0.1µF
CS+ FDS6680
20V 20V
9 R1 R2
VCC
0.02W 218k
7 1%
PGND
10 SYNC/
SHDN 5
FB
4 R3
REF
3 C7 24.9k
C3 2 GND 220pF
FREQ 1%
0.22µF
R4
100k
1%

Figure 5. MAX668 Low-Voltage Non-Bootstrapped Configuration

Non-Bootstrapped Operation If the input voltage does not exceed 5.5V, the on-chip
With non-bootstrapped operation, the IC is powered from the regulator can be disabled by connecting VCC to LDO
input voltage (VIN) or another source, such as a logic sup- (Figure 5). This eliminates the regulator forward drop
ply. Non-bootstrapped operation (Figure 4) is recommended and supplies the maximum gate drive to the external
(but not required) for input voltages above 5V, since the FET for lowest on-resistance. Disabling the regulator also
EXT amplitude (limited to 5V by LDO) at this voltage range reduces the non-bootstrapped minimum input voltage
is no higher than it would be with bootstrapped operation. from 3V to 2.7V.
Note that non-bootstrapped operation is required if the
output voltage exceeds 28V, since this level is too high to
safely connect to VCC. Also note that only the MAX668
can be used with non-bootstrapped operation.

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

Table 2. Bootstrapped and Non-Bootstrapped Configurations

INPUT OUTPUT
USE
CONFIGURATION FIGURE VOLTAGE VOLTAGE COMMENTS
WITH:
RANGE* (V) RANGE (V)

Connect VCC to VOUT. Provides maximum external

High-Voltage, FET gate drive for low-voltage (Input <3V) to high-
Figure2 MAX669 1.8 to 28 3V to 28
Bootstrapped voltage (output >5.5V) boost circuits. VOUT cannot
exceed 28V.

Connect VOUT to VCC and LDO. Provides maxi-

Low-Voltage,
Figure3 MAX669 1.8 to 5.5 2.7 to 5.5 mum possible external FET gate drive for low-volt-
Bootstrapped
age designs, but limits VOUT to 5.5V or less.

Connect VIN to VCC. Provides widest input and out-

High-Voltage,
Figure4 MAX668 3 to 28 VIN to ∞ put range, but external FET gate drive is reduced for
Non-Bootstrapped
VIN below 5V.

Connect VIN to VCC and LDO. FET gate-drive

amplitude = VIN for logic-supply (input 3V to 5.5V) to
Low-Voltage,
Figure5 MAX668 2.7 to 5.5 VIN to ∞ high-voltage (output >5.5V) boost circuits. IC oper-
Non-Bootstrapped
ating power is less than in Figure 4, since IC current
does not pass through the LDO regulator.

Connect VCC and LDO to a separate supply

(VBIAS) that powers only the IC. FET gate-drive
Extra IC supply, Not
None MAX668 VIN to ∞ amplitude = VBIAS. Input power source (VIN) and
Non-Bootstrapped Restricted
output voltage range (VOUT) are not restricted,
except that VOUT must exceed VIN.

* For standard step-up DC-DC circuits (as in Figures 2, 3, 4, and 5), regulation cannot be maintained if VIN exceeds VOUT. SEPIC
and transformer-based circuits do not have this limitation.

In addition to the configurations shown in Table 2, the following 3) If VIN is in the 3V to 4.5V range (i.e., 1-cell Li-Ion or
guidelines may help when selecting a configuration: 3-cell NiMH battery range), bootstrapping VCC from
1) If VIN is ever below 2.7V, VCC must be bootstrapped to VOUT, although not required, may increase overall
VOUT and the MAX669 must be used. If VOUT never efficiency by increasing gate drive (and reducing
exceeds 5.5V, LDO may be shorted to VCC and VOUT FET resistance) at the expense of quiescent power
to eliminate the dropout voltage of the LDO regulator. consumption.
2) If VIN is greater than 3.0V, VCC can be powered from 4) If VIN always exceeds 4.5V, VCC should be tied to VIN,
VIN, rather than from VOUT (non-bootstrapped). This since bootstrapping from VOUT does not increase gate
can save quiescent power consumption, especially drive from EXT but does increase quiescent power
when VOUT is large. If VIN never exceeds 5.5V, LDO dissipation.
may be shorted to VCC and VIN to eliminate the drop-
out voltage of the LDO regulator.

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

SYNC/SHDN and FREQ Inputs Setting the Operating Frequency

The SYNC/SHDN pin provides both external-clock The MAX668/MAX669 can be set to operate from 100kHz
synchronization (if desired) and shutdown control. When to 500kHz. Choice of operating frequency will depend on
SYNC/SHDN is low, all IC functions are shut down. A logic number of factors:
high at SYNC/SHDN selects operation at a frequency set 1) Noise considerations may dictate setting (or synchronizing)
by ROSC, connected from FREQ to GND. The relationship fOSC above or below a certain frequency or band of
between fOSC and ROSC is: frequencies, particularly in RF applications.
ROSC = 5 x 1010/fOSC 2) Higher frequencies allow the use of smaller value
So a 500kHz operating frequency, for example, is set with (hence smaller size) inductors and capacitors.
ROSC = 100kΩ. 3) Higher frequencies consume more operating power
Rising clock edges on SYNC/SHDN are interpreted as both to operate the IC and to charge and discharge
synchronization inputs. If the sync signal is lost while the gate of the external FET. This tends to reduce
SYNC/SHDN is high, the internal oscillator takes over at efficiency at light loads; however, the MAX668/
the end of the last cycle and the frequency is returned MAX669’s Idle mode feature substantially increases
to the rate set by ROSC. If sync is lost with SYNC/ light-load efficiency.
SHDN low, the IC waits for 70μs before shutting down. 4) Higher frequencies may exhibit poorer overall efficiency
This maintains output regulation even with intermittent due to more transition losses in the FET; however, this
sync signals. When an external sync signal is used, Idle shortcoming can often be nullified by trading some
mode switchover at the 15mV current-sense threshold is of the inductor and capacitor size benefits for lower-
disabled so that Idle mode only occurs at very light loads. resistance components.
Also, ROSC should be set for a frequency 15% below the
SYNC clock rate: The oscillator frequency is set by a resistor, ROSC,
connected from FREQ to GND. ROSC must be connected
ROSC(SYNC) = 5 x 1010 / (0.85 x fSYNC) whether or not the part is externally synchronized ROSC
Soft-Start is in each case:
The MAX668/MAX669 feature a “digital” soft start which is ROSC = 5 x 1010 / fOSC
preset and requires no external capacitor. Upon startup, when not using an external clock.
the peak inductor increments from 1/5 of the value set by
ROSC(SYNC) = 5 x 1010 / (0.85 x fSYNC)
RCS, to the full current-limit value, in five steps over 1024
when using an external clock, fSYNC.
cycles of fOSC or fSYNC. For example, with an fOSC of
200kHz, the complete soft-start sequence takes 5ms. See Setting the Output Voltage
the Typical Operating Characteristics for a photo of soft- The output voltage is set by two external resistors (R2
start operation. Soft-start is implemented: 1) when power and R3, Figure 2, Figure 3, Figure 4, and Figure 5). First
is first applied to the IC, 2) when exiting shutdown with select a value for R3 in the 10kΩ to 1MΩ range. R2 is
power already applied, and 3) when exiting undervoltage then given by:
lockout. The MAX669’s soft-start sequence does not start
R2 = R3 [(VOUT/VREF) – 1]
until LDO reaches 2.5V.
where VREF is 1.25V.
Design Procedure
Determining Inductance Value
The MAX668/MAX669 can operate in a number of
For most MAX668/MAX669 boost designs, the inductor
DCDC converter configurations including step-up, SEPIC
value (LIDEAL) can be derived from the following equation,
(single-ended primary inductance converter), and flyback.
which picks the optimum value for stability based on the
The following design discussions are limited to step-up,
MAX668/MAX669’s internally set slope compensation:
although SEPIC and flyback examples are shown in the
Application Circuits section. LIDEAL = VOUT / (4 x IOUT x fOSC)

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

The MAX668/MAX669 allow significant latitude in inductor For high peak inductor currents (>1A), Kelvin sensing
selection if LIDEAL is not a convenient value. This may connections should be used to connect CS+ and PGND
happen if LIDEAL is a not a standard inductance (such as to RCS. PGND and GND should be tied together at the
10μH, 22μH, etc.), or if LIDEAL is too large to be obtained ground side of RCS.
with suitable resistance and saturation-current rating in
the desired size. Inductance values smaller than LIDEAL Power MOSFET Selection
may be used with no adverse stability effects; however, The MAX668/MAX669 drive a wide variety of N-channel
the peak-to-peak inductor current (ILPP) will rise as L is power MOSFETs (NFETs). Since LDO limits the EXT output
reduced. This has the effect of raising the required ILPK gate drive to no more than 5V, a logic-level NFET is
for a given output power and also requiring larger output required. Best performance, especially at low input voltag-
capacitance to maintain a given output ripple. An induc- es (below 5V), is achieved with low-threshold NFETs that
tance value larger than LIDEAL may also be used, but specify on-resistance with a gate-source voltage (VGS) of
output-filter capacitance must be increased by the same 2.7V or less. When selecting an NFET, key parameters
proportion that L has to LIDEAL. See the Capacitor can include:
Selection section for more information on determining 1) Total gate charge (Qg)
output filter values.
2) Reverse transfer capacitance or charge (CRSS)
Due to the MAX668/MAX669’s high switching frequencies,
3) On-resistance (RDS(ON))
inductors with any core materials that exhibit low core
loss (ferrite, or equivalent) are recommended for best 4) Maximum drain-to-source voltage (VDS(MAX))
efficiency performance. 5) Minimum threshold voltage (VTH(MIN))
Determining Peak Inductor Current At high switching rates, dynamic characteristics (parameters
1 and 2 above) that predict switching losses may have more
The peak inductor current required for a particular output is:
impact on efficiency than RDS(ON), which predicts DC losses.
ILPEAK = ILDC + (ILPP / 2)
Qg includes all capacitances associated with charging the
where ILDC is the average DC input current and ILPP is gate. In addition, this parameter helps predict the current
the inductor peak-to-peak ripple current. The ILDC and needed to drive the gate at the selected operating frequency.
ILPP terms are determined as follows: The continuous LDO current for the FET gate is:
I (V + VD ) IGATE = Qg x fOSC
ILDC = OUT OUT
(VIN – VSW ) For example, the MMFT3055L has a typical Qg of 7nC
where VD is the forward voltage drop across the Schottky (at VGS = 5V); therefore, the IGATE current at 500kHz is
rectifier diode (D1), and VSW is the drop across the external 3.5mA. Use the FET manufacturer’s typical value for Qg in
FET, when on. the above equation, since a maximum value (if supplied) is
(VIN – VSW ) (VOUT + VD – VIN ) usually too conservative to be of use in estimating IGATE.
ILPP =
L x f OSC (VOUT + VD ) Diode Selection
where L is the inductor value. The saturation rating The MAX668/MAX669’s high switching frequency
of the selected inductor should meet or exceed the demands a high-speed rectifier. Schottky diodes are
calculated value for ILPEAK, although most coil types can recommended for most applications because of their fast
be operated up to 20% over their saturation rating without recovery time and low forward voltage. Ensure that the
difficulty. In addition to the saturation criteria, the inductor diode’s average current rating is adequate using the diode
should have as low a series resistance as possible. For manufacturer’s data, or approximate it with the following
continuous inductor current, the power loss in the inductor formula:
resistance, PLR, is approximated by: I -I
= I OUT + LPEAK OUT
IDIODE
PLR ≅ (IOUT x VOUT / VIN)2 x RL 3
where RL is the inductor series resistance. Also, the diode reverse breakdown voltage must exceed
VOUT. For high output voltages (50V or above), Schottky
Once the peak inductor current is selected, the current-
diodes may not be practical because of this voltage
sense resistor (RCS) is determined by:
requirement. In these cases, use a high-speed silicon
RCS = 85mV / ILPEAK rectifier with adequate reverse voltage.

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

Capacitor Selection Applications Information

Output Filter Capacitor Starting Under Load
The minimum output filter capacitance that ensures stability is: In non-bootstrapped configurations (Figure 4, and Figure 5),
the MAX668 can start up with any combination of
(7.5V × L / L IDEAL )
C OUT(MIN) = output load and input voltage at which it can operate
(2πR CS × VIN(MIN) × f OSC ) when already started. In other words, there are no special
limitations to start up in non-bootstrapped circuits.
where VIN(MIN) is the minimum expected input voltage.
Typically COUT(MIN), though sufficient for stability, will not In bootstrapped configurations with the MAX668 or
be adequate for low output voltage ripple. Since output MAX669, there may be circumstances where full load
ripple in boost DC-DC designs is dominated by capacitor current can only be applied after the circuit has
equivalent series resistance (ESR), a capacitance value 2 started and the output is near its set value. As the input
or 3 times larger than COUT(MIN) is typically needed. Low- voltage drops, this limitation becomes more severe. This
ESR types must be used. Output ripple due to ESR is: characteristic of all bootstrapped designs occurs when the
MOSFET gate is not fully driven until the output voltage
VRIPPLE(ESR) = ILPEAK x ESRCOUT
rises. This is problematic because a heavily loaded output
Input Capacitor cannot rise until the MOSFET has low on-resistance. In
The input capacitor (CIN) in boost designs reduces the such situations, low-threshold FETs (VTH < VIN(MIN))
current peaks drawn from the input supply and reduces are the most effective solution. The Typical Operating
noise injection. The value of CIN is largely determined by Characteristics section shows plots of startup voltage
the source impedance of the input supply. High source versus load current for a typical bootstrapped design.
impedance requires high input capacitance, particularly
Layout Considerations
as the input voltage falls. Since step-up DC-DC converters
act as “constant-power” loads to their input supply, input Due to high current levels and fast switching waveforms
current rises as input voltage falls. Consequently, in low- that radiate noise, proper PC board layout is essential.
input-voltage designs, increasing CIN and/or lowering its Protect sensitive analog grounds by using a star ground
ESR can add as many as five percentage points to configuration. Minimize ground noise by connecting GND,
conversion efficiency. A good starting point is to use the PGND, the input bypass-capacitor ground lead, and the
same capacitance value for CIN as for COUT. output-filter ground lead to a single point (star ground
configuration). Also, minimize trace lengths to reduce
Bypass Capacitors stray capacitance, trace resistance, and radiated noise.
In addition to CIN and COUT, three ceramic bypass The trace between the external gain-setting resistors and
capacitors are also required with the MAX668/MAX669. the FB pin must be extremely short, as must the trace
Bypass REF to GND with 0.22μF or more. Bypass LDO between GND and PGND.
to GND with 1μF or more. And bypass VCC to GND with
0.1μF or more. All bypass capacitors should be located as
Application Circuits
close to their respective pins as possible. Low-Voltage Boost Circuit
Compensation Capacitor Figure 3 shows the MAX669 operating in a low-voltage
boost application. The MAX669 is configured in the boot-
Output ripple voltage due to COUT ESR affects loop
strapped mode to improve low input voltage performance.
stability by introducing a left half-plane zero. A small
The IRF7401 nMOSFET was selected for Q1 in this appli-
capacitor connected from FB to GND forms a pole with
cation because of its very low 0.7V gate threshold voltage
the feedback resistance that cancels the ESR zero. The
(VGS). This circuit provides a 5V output at greater than 2A
optimum compensation value is:
of output current and operates with input voltages as low
ESR COUT as 1.8V. Efficiency is typically in the 85% to 90% range.
C FB = C OUT x
(R2 x R3) / (R2 + R3)
where R2 and R3 are the feedback resistors (Figure 2,
Figure 3, Figure 4, and Figure 5). If the calculated value
for CFB results in a non-standard capacitance value,
values from 0.5CFB to 1.5CFB will also provide sufficient
compensation.

www.maximintegrated.com Maxim Integrated │ 15

MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

+12V Boost Application C2 must also be able to handle high ripple currents;
Figure 5 shows the MAX668 operating in a 5V to ordinary tantalum capacitors should not be used for high-
12V boost application. This circuit provides output current designs.
currents of greater than 1A at a typical efficiency of 92%. The circuit in Figure 6 provides greater than 1A output
The MAX668 is operated in non-bootstrapped mode to current at 5V when operating with an input voltage from 3V
minimize the input supply current. This achieves to 25V. Efficiency will typically be between 70% and 85%,
maximum light-load efficiency. If input voltages below depending upon the input voltage and output current.
5V are used, the IC should be operated in bootstrapped
mode to achieve best low-voltage performance. Isolated +5V to +5V Power Supply
The circuit of Figure 7 provides a 5V isolated output at
4-Cell to +5V SEPIC Power Supply 400mA from a 5V input power supply. Transformer T1
Figure 6 shows the MAX668 in a SEPIC (single-ended provides electrical isolation for the forward path of the
primary inductance converter) configuration. This configuration converter, while the TLV431 shunt regulator and MOC211
is useful when the input voltage can be either larger or opto-isolator provide an isolated feedback error voltage
smaller than the output voltage, such as when converting for the converter. The output voltage is set by resistors
four NiMH, NiCd, or Alkaline cells to a 5V output. The R2 and R3 such that the mid-point of the divider is 1.24V
SEPIC configuration is often a good choice for combined (threshold of TLV431). Output voltage can be adjusted
step-up/step-down applications. from 1.24V to 6V by selecting the proper ratio for R2 and
The nMOSFET (Q1) must be selected to withstand a R3. For output voltages greater than 6V, substitute the
drain-to-source voltage (VDS) greater than the sum of the TL431 for the TLV431, and use 2.5V as the voltage at the
input and output voltages. The coupling capacitor (C2) midpoint of the voltage-divider.
must be a low-ESR type to achieve maximum efficiency.

VIN
3V to 25V

22µF x 3
@ 35V 4.9µH L1
CTX5-4
D1
40V
9 10 VOUT
VCC SHDN 5V @ 1A
1 C2
LDO 10µF @ 35V
MAX668 C3
2 Q1 68µF x 3
FREQ
8 30V
EXT
FDS6680
1µF 4
R3 REF
100k 6
CS+
0.22µF
5
FB R4 R1
0.02Ω 75k
GND PGND
3 7

C4 R2
D1: MBR5340T3, 3A, 40V SCHOTTKY DIODE 520pF 25k
R4: WSL-2512-R020F, 0.02Ω
C3: AVX TPSZ686M020R0150, 68µF, 150mΩ ESR

Figure 6. MAX668 in SEPIC Configuration

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

MBR0540L 47µH
VIN = +5V +5V @ 400mA

220µF T1 220µF
1µF
10V 2:1 MBR0540L 10V

LDO VCC +5V RETURN

EXT IRF7603
SHDN

CS+
MAX668
FB
0.1Ω
PGND

REF FREQ GND

0.22µF
100k

R2
510Ω 301k
MOC211 1%

10k

0.1µF

0.068µF 610Ω TLV431

R3
100k
1%
T1: COILTRONICS CTX03-14232

Figure 7. Isolated +5V to +5V at 400mA Power Supply

Package Information
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.

PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO.

10 µMAX U10-2 21-0061 90-0330

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MAX668/MAX669 1.8V to 28V Input, PWM Step-Up
Controllers in μMAX

Revision History
REVISION REVISION PAGES
DESCRIPTION
NUMBER DATE CHANGED
Added automotive qualified part and updated lead-free and leaded soldering
2 1/12 1, 2
temperatures

3 6/16 Updated verbiage in Determining Inductance Value section 14

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Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits)
shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.

Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc. © 2016 Maxim Integrated Products, Inc. │ 18