Curricular Practical Training

(CPT) Report

Student Name: Md Yasir Zamil

University Name: University of Nevada, Reno
Internship Company: Rocket EMS ltd
Supervisor Name: Dr Jeongwon Park
Report Date: 8/17/2024
Industry: Electronics Manufacturing Services
Position Overview:
As a Process Engineer Intern at Rocket EMS, I will have the opportunity to work
closely with the process engineering team to gain practical experience in the
analysis, improvement, and implementation of manufacturing processes. My role
will involve collaboration on projects that focus on process optimization, data
analysis, and quality control to enhance the overall efficiency and quality of our
PCBA manufacturing operations. This internship provides a hands-on opportunity
to apply engineering principles in a real-world manufacturing environment.
Key Responsibilities:
 Daily Support and Monitoring: I will provide daily support and monitor
the Surface Mount Technology (SMT) line, which includes the Printer, SPI,
Pick & Place, and Reflow oven processes.
 Learning and Operating Machinery: I will learn and operate Automated
Optical Inspection (AOI), Automated X-ray Inspection (AXI), and Solder
Paste Inspection (SPI) machines.
 Collaboration with Engineers: I will collaborate with experienced
process engineers to analyze and evaluate existing manufacturing
processes, identifying opportunities for optimization and improvements.
 Data Analysis and Interpretation: I will participate in data collection,
analysis, and interpretation to identify trends, patterns, and potential
areas for process enhancement and efficiency gains.
 Experimental Design and Implementation: I will assist in the design
and implementation of experiments to validate process improvements,
utilizing statistical methods to ensure accuracy and reliability of results.
 Cross-Functional Collaboration: I will work with cross-functional teams
to develop and implement process changes, equipment modifications, and
workflow adjustments.
 Documentation and Standardization: I will contribute to the
documentation of process changes, standard operating procedures (SOPs),
and work instructions to ensure consistent implementation across the
organization.
 Training Program Development: I will assist in the development and
execution of training programs to ensure team members are
knowledgeable about updated processes and procedures.
 Quality Assurance: I will work closely with quality assurance teams to
address process-related quality issues and implement corrective and
preventive actions.
 Evaluation of New Technologies: I will assist in the evaluation and
introduction of new manufacturing technologies and equipment to
enhance process capabilities and efficiency.
 Lean Manufacturing Principles: I will learn and apply lean
manufacturing principles to identify waste, reduce cycle times, and
improve overall process flow.
This internship is a valuable opportunity for me to bridge the gap between
academic theory and practical application in a professional setting. I believe that
the experience I gain at Rocket EMS
Skills and Knowledge Gained
During my internship at Rocket EMS, I applied a diverse set of skills that I had
developed through my academic coursework and previous experiences.
Technical skills were at the forefront, especially in the operation of Surface
Mount Technology (SMT) equipment and Automated Optical Inspection (AOI),
Automated X-ray Inspection (AXI), and Solder Paste Inspection (SPI) machines. I
used data analysis skills to monitor production processes, identify trends, and
interpret results to suggest improvements. Additionally, my problem-solving
abilities were frequently utilized, especially when addressing issues related to
process efficiency and quality control.
Moreover, I honed my project management skills by managing multiple tasks
simultaneously, ensuring that daily operations ran smoothly while also working
on long-term optimization projects. I also enhanced my collaboration and
communication skills by working closely with cross-functional teams, including
engineers, quality control personnel, and production staff. This collaboration was
essential for successfully implementing process improvements and ensuring
everyone was aligned with project goals.
here is a description of the process that were used during my time on Rocket
EMS

1. Surface Mount Technology (SMT)

Surface Mount Technology (SMT) is a method used in the manufacturing of
electronic circuits where the components are mounted or placed directly onto the
surface of printed circuit boards (PCBs). This technique contrasts with the older
through-hole technology, where components were inserted into holes drilled into
the PCB.
In an SMT process, Components are automatically placed onto the PCB by a
machine known as a pick-and-place machine. Solder Paste is applied to the PCB
to hold the components in place temporarily.
The assembly is then heated in a reflow oven where the solder melts and forms a
permanent connection between the component leads and the PCB pads.
SMT is widely used because it allows for more compact and lightweight designs,
faster production, and greater automation. At Rocket EMS, the SMT process is
integral to assembling high-quality, high-density PCBs for various applications.

2. Automated Optical Inspection (AOI)

Automated Optical Inspection (AOI) is an automated visual inspection
process used in the manufacturing of PCBs. It employs cameras to scan the PCB
and check for both catastrophic failures (such as missing components) and
quality defects (such as incorrect polarity or poor soldering).
In the AOI process:
 The system captures images of the PCB using high-resolution cameras.
 These images are compared against a predefined template or CAD data to
detect anomalies.
 The system then flags any discrepancies for further inspection or repair.
AOI is crucial for ensuring the reliability of the PCBs produced. It helps in
catching defects early in the manufacturing process, thereby reducing the
likelihood of faulty boards reaching the customer. In a company like Rocket EMS,
AOI ensures that every board meets stringent quality standards before
proceeding to the next stage of production.
3. 2D X-ray Inspection (2D X)
2D X-ray Inspection (commonly referred to as 2D X) is a non-destructive
testing method used to inspect the internal structure of PCBs and their
components. Unlike optical inspection, which can only detect surface-level
defects, 2D X-ray inspection allows for the examination of hidden features such
as solder joints beneath components like Ball Grid Arrays (BGAs).
In the 2D X process:
 X-rays are passed through the PCB, and the resulting image is captured on
a detector.
 The varying densities of materials within the PCB, such as metal traces,
solder joints, and components, absorb X-rays differently, creating a
contrast image.
 This image is analyzed to check for issues such as voids in solder joints,
misaligned components, or internal cracks.
2D X is particularly valuable in detecting defects that are not visible with AOI,
making it an essential tool in ensuring the structural integrity and reliability of
the PCB assemblies. At Rocket EMS, 2D X-ray inspection is used to validate the
quality of solder joints and other internal features, particularly for complex
assemblies where reliability is critical.

Reflection and Future Goals:

The internship at Rocket EMS has significantly influenced my understanding of
potential career paths and has helped me explore various opportunities for future
work post-graduation. This experience allowed me to engage deeply with the
practical applications of process engineering and quality control in a
manufacturing environment; working closely with the process engineering team
at Rocket EMS gave me a first-hand look at the intricacies of the manufacturing
industry, particularly in the field of electronics and PCB assembly. I discovered a
strong interest in the continuous improvement processes that drive efficiency,
quality, and innovation in production. This exposure has piqued my interest in
pursuing roles that involve process optimization, data-driven decision-making,
and quality assurance within the manufacturing sector. The hands-on experience
with SMT, AOI, and 2D X-ray inspection systems has broadened my
understanding of how engineering principles are applied in a real-world context.
The collaborative nature of my work at Rocket EMS, which involved coordinating
with cross-functional teams, has also sparked an interest in potential leadership
This experience has motivated me to consider pursuing management or
leadership positions in the future, where I can lead efforts to drive technological
advancements and operational efficiency.

Conclusion
Overall, the internship at Rocket EMS has been a crucial step in helping me
explore and refine my career goals. It has provided me with practical experience,
clarified my professional interests, and given me the confidence to pursue
opportunities that align with my skills and passions. As I approach graduation, I
feel more equipped to make informed decisions about my career trajectory,
knowing that my experience at Rocket EMS has prepared me well for the
challenges and opportunities that lie ahead.