Fundamentals of Electronic

Packaging
Lecture 1
08/21/24

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Electronic Industry
❑Multi trillion-dollar industry
➢Growing at 5 to 8% YOY
➢Growth very high for consumer electronics
❑Electronics influence the way we live
❑Possibilities turn into commodity product in a very short time span.
❑Technological Advancement and price erosion enables high growth
rate
Features of Electronic Industry

❑ Technology driven business

❑ Continuous price erosion
❑ High growth rate
❑ Large volume in Global market
❑ Short life cycle

Source: Prof. Anandaroop Bhattacharya, NOC Jan 2019: Electronic Packaging and Manufacturing
Major Electronic System and Market
❑ Computer and business equipment
➢ Calculators, Desktop, Printers, Photocopiers etc.
❑ Communication
➢ Telephone, Fax, Modem
❑ Automotive electronics
➢ Engine control management, Cruise control, power steering, Safety features, Sensors
❑ Consumer electronics
➢ TV, VCR, Audio, Watches, Games etc.
❑ Medical Electronics
➢ CT Scan, MRI, X-Ray, Ultrasound machines, Robotic surgery system, etc.
❑ Military and aviation electronics
➢ Missile, Radar, Fire control system, Communications etc.
❑ Remote sensing
➢ Satellites, Sensors, Cameras, Drones etc.
❑ Industrial electronics
➢ Automation equipment, Drives and motor control, Control systems, Data acquisition and analysis, etc.
(Toyota's global production capacity is around 10 million vehicles per year (27,000 vehicles per day)!!!)
 Integrated circuit
• Main Elements of an electronic product
• A Product also requires
➢Passive components- Resistors, Capacitors, Inductors
➢Electrical and Mechanical Components – Switches, connectors, cables etc.
➢Cooling Components
➢Batteries/Power supply
➢Display Components- LED, LCD, Plasma display

Source: Prof. Anandaroop Bhattacharya, NOC Jan 2019: Electronic Packaging and Manufacturing

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 Electronic Packaging
• Multidisciplinary Technology
• Physics
• Chemistry
• Materials Science
• Engineering
• Mechanical
• Electrical/Electronics
• Thermal
• Chemical

• Statistics Source: Fundamentals of Device and Systems Packaging: Technologies and Applications, 2nd Edition. Dr.
Rao R. Tummala

• Modeling and Simulation

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 Electronic Packaging 1. Processor (CPU) -Acts as the brain of the smartphone, handling all instructions and processing tasks.
2. Graphics Processing Unit (GPU) - Responsible for rendering images, video, and animations.
3. Memory (RAM) - Temporary storage used by the CPU to store data for quick access while tasks are being processed.
4. Storage (Internal Memory)- Stores the operating system, apps, and user data (e.g., photos, videos).
5. Battery - Powers the smartphone, typically rechargeable lithium-ion batteries.
6. Display - The screen, often an OLED or LCD, that shows visuals, touch inputs, and media.
7. Camera Systems - Includes multiple lenses and sensors for taking photos and recording video.
8. Oscillators and Crystal Clocks - Generate precise timing signals for synchronizing various operations in the phone.
9. Sensors
Accelerometer: Detects orientation.
Gyroscope: Measures rotation and movement.
Proximity Sensor: Detects how close the phone is to objects.
Light Sensor: Adjusts screen brightness.
Fingerprint Sensor: For biometric authentication.
Magnetometer: Functions as a compass.
Face ID Components
10. Wireless Connectivity Modules
Wi-Fi
Bluetooth
Cellular Antennas (for 4G, 5G)
GPS Module
NFC (Near Field Communication)
11. Audio Components
Speakers
Microphones
Audio Jacks (if available)
Amplifiers
Source: https://fossbytes.com/whats-inside-smartphone-depth-look-parts- DAC (Digital-to-Analog Converter): Converts digital audio signals into analog sound.
powering-everyday-gadget/ 12. Charging Port -Typically a USB-C or Lightning port for charging and data transfer.
13. SIM Card Slot - Holds the SIM card used for network identification and connection.
14. MicroSD Card Slot
15. Inductors, Capacitors, and Resistors
16. Motherboard and Integrated Circuits -Houses the main circuitry, connecting all other components.
17. Flashlight/LED Flash
18. Heat sink or Cooling Components -Thermal Pads or Heat Pipes
19. Power Button
20. Volume Buttons
21. Casing

All these components are connected through intricate copper traces on the PCB, forming a complex circuit that
powers and operates the smartphone.
Source: Dr. Rao R. Tummala 2019

• Packaging starts with design, then device and packaging, and ends up • 400+ components in the smart phone
with a system like a smartphone. 7
 What is Electronic Packaging?
Electronic packaging is:

• A support structure for the reliable performance of an appliance through interconnection schemes in an

environment to process, transmit and/or store information.

• The functions of an electronic package are to protect, power, and cool the microelectronic chips or

components and provide electrical and mechanical connection between the microelectronic part and the

outside world.

Reference: Fundamentals of Device and Systems Packaging: Technologies and Applications, 2nd Edition. Dr. Rao R. Tummala 8
 Electronic Packaging
Electronic packaging serves several key purposes, including:
➢ Protection:
• Mechanical Protection: Shielding components from physical damage such as shocks, vibrations, and impacts.
• Environmental Protection: Safeguarding against dust, moisture, corrosion, and other environmental factors that could degrade the
performance of electronic components.
• Thermal Management: Managing the heat generated by electronic components to prevent overheating, which could lead to failure.
➢ Interconnection:
• Electrical Connections: Packaging provides the necessary pathways for electrical signals to travel between components, such as
through soldered connections on a printed circuit board (PCB).
• Signal Integrity: Ensuring that the electrical signals are transmitted without interference or degradation, which is crucial for high-
speed and high-frequency applications.
➢ Structural Support:
• Packaging provides structural support for electronic components, keeping them in place within the device and ensuring they remain
connected and aligned.
➢ Form Factor and Aesthetics:
• The physical size, shape, and appearance of the electronic device, which is important for user interfaces and the overall design of
consumer products.
➢ Functional Integration:
• Some electronic packaging includes additional functionalities, such as shielding against electromagnetic interference (EMI) or
integrating passive components like capacitors and resistors directly into the package.
➢ Testing and Reliability:
• The packaging must allow for testing and validation of the components and systems to ensure reliability over the product's expected
lifespan.
 Nomenclature

• Electronic Packaging is categorized hierarchically

• A Nomenclature of Convenience

• Plurality of Levels of Packaging

• Zero, First, Second, etc.

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Levels of Packaging

Level 0 – Wafer-Level Packaging

Level 1 – Chip-Level or Die-Level Packaging

Level 2 – Printed Circuit Board (PCB) Assembly

Level 3 – Module-Level Packaging
Level 4 – Box or System-Level Packaging
Level 5 – System-of-Systems Packaging

Source: Tummala, Rao R. "Fundamentals of microsystems packaging." (2001)

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 Mechanical design aspects of packaging
• Connections
• Manufacturing
• Thermal Management
• Maintenance
• Shock and Vibration
• Ergonomics
• Environment

Source: Prof. Anandaroop Bhattacharya, NOC Jan 2019: Electronic Packaging and Manufacturing

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 Silicon wafer formation
Czochralski Process: Named after Jan Czochralski (discovered the method in 1916)

➢ Molten Silicon (Ultra pure) in a heated crucible

Schematic setup of a Czochralski crystal puller
• Adding dopant impurities atoms such as Boron, Phosphorous
➢ Seed Crystal brought in contact with fused Si
• Rotated (for homogeneity) and pulled upwards Watch Video:
➢ Crystal start growing in the form of an ingot. https://www.youtube.com/watch?v=xftnhfa-Dmo
• Thin wafers are chopped off 13
 Silicon wafer to Microchip formation

Slicing into Silicon wafer using

diamond saw

Watch Video: https://www.youtube.com/watch?v=g8Qav3vIv9s

• The die-sawing,
• Wire Bonding
• Molding and Solder Plating
• Marking and Lead Trim/Form

Encapsulated microchip
Final wafer production after cleaning,
A silicon wafter fabricated with polishing and inspection 14
Microelectronic circuit
 Zero Level Packaging
❑ Zero Level Packaging (Wafer-level Packaging)
It represents a key step in the transition from raw silicon wafers to fully functional dies or packaging
of integrated circuits (ICs) directly on the wafer before it is diced into individual chips.

• Packaging Different functions on a semiconductor

• Several Transistors, Circuits,
• Gate to Gate Interconnections
• Multitudes of Functions, processors, logic, memory
• Chip level interconnects etc.

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 First Level Packaging
❑First Level Packaging (Chip-Level or Die-Level Packaging)
• Process of assembling a semiconductor Chip or Chips into an enclosure/package as a
1. Single Chip Module (SCM) - Individual chips and includes necessary electrical connections
2. Multichip Module (MCM)- Two or more chips interconnected on a single carrier. Ex: 2D, 2.5D, 3D
To facilitate Assembly on to a Board.

➢ Importance of First-Level Packaging:

• Electrical Performance: Ensures that signals can efficiently enter and exit the chip,
minimizing delays and interference.
• Mechanical Integrity: Protects the delicate chip from physical and environmental
damage.
• Thermal Management: Helps to dissipate heat generated by the chip, ensuring reliable
performance and preventing overheating.

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Many changes on the horizon
New driving factor → performance, power and bandwidth
Tummala, Rao R. "Fundamentals of microsystems packaging." (2001)
 Second Level Packaging
❑Second Level Packaging (Printed Circuit Board Assembly)
• Assembling
• First level Packages on to a Printed Wiring Board
• Capacitors, Resistors, Inductances
• Switches Connectors
• Assembling number of smaller card with specific functionalities

• Key Aspects of Second-Level Packaging:

1. Mounting: Surface Mount Technology (SMT), Through-Hole Technology (THT)
2. Electrical Connections: Soldering, Wire Bonding:
3. Thermal Management: Heat Sinks, Thermal Via:
4. Testing: In-Circuit Testing and Functional Testing

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 Third and Higher-Level Packaging
• Third Level Packaging (Module-Level Packaging)
• Assembling mother boards, daughter cards, baby board etc.

• Fourth Level Packaging (Box or System-Level Packaging)

• Box Level Assembly with
• Storage devices
• Cables
• Rack and box assembly

• Fifth Level Packaging(System-of-Systems Packaging)

• Host to terminals
• Printers, displays, keyboard, etc.

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Packaging and Product Classification

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 Components of Package
• The Package/component can be

• Leaded- J-leaded or Gull wing leaded

• Leadless- Bottom leaded

• Area Array
✓ Ball Grid Array
✓ Column Grid Array
✓ Pin Grid Array
• Package(chip carrier) can be
✓ Ceramic (Hermetic)
✓ Plastic (non-hermetic)
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 Ceramic and Plastic Packages
• Relative Advantages and Disadvantages of Ceramic and Plastic Packaging

Source: Viswanadham, Puligandla. Essentials of Electronic Packaging: A Multidisciplinary Approach. ASME. 2011.
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 Packaging Schemes in Semiconductor Packaging

Source: Viswanadham, Puligandla. Essentials of Electronic Packaging: A Multidisciplinary Approach. ASME. 2011. 24
 Product Categories and Environments
• Product Categories, Typical Operating Temperatures Extremities, and Designed Life

Source: Viswanadham, Puligandla. Essentials of Electronic Packaging: A Multidisciplinary Approach. ASME. 2011. 25
END