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12 views1 page

3 Wgao 3 Zxiidocx

FDCFBCBB GSS GS

Uploaded by

G2742Ketan Meshram
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Details of HCL Tech Internship + PPO for 2025 batch 30 Oct 2024

Reaching out on behalf of HCLTech Campus Team to request the enrollment of qualified
candidates from the Electronics and Communication Engineering (ECE) and Electrical and
Electronics Engineering (EEE) departments for our Corporate Internship Program.

We are excited to offer an immersive, hands-on experience that enables students to develop
industry-relevant skills and gain insights into real-world engineering challenges. This internship
is structured to support students’ career growth while fostering professional skills aligned with
the latest developments in Embedded Systems.

Program Highlights:

Duration: 6 - 9 months
Stipend/Compensation: This will be discussed post selection.
Location: HCLTech Offices Pan India
Learning Objectives: Embedded Systems
Eligibility Criteria: Must have 70% throughout the Academics, Students in their
8th Semester with Strong academic background and relevant technical skills.

We kindly request your assistance in conducting an internal evaluation to identify the most
suitable candidates for this internship opportunity. Once the evaluation is complete, we would
appreciate it if you could share the list of selected candidates with us to facilitate further
communication and next steps in the enrollment process.

The Job Description is as follows:

 Understanding of C fundamentals, including pointers, file handling, structures,


and linked lists.
 Good knowledge of Embedded C, the basics of C/C++.
 OOPS and data structures concepts are added advantage
 Strong grasp of embedded concepts.
 Awareness and Familiarity with development tools and protocols like I2C,
SPI, CAN, etc..are added advantage
 Awareness in RTOS, Linux, multithreading, and IPC.
 Hands-on experience with microcontrollers and various microprocessor
architectures.
 Candidates should have an engineering background.

The package will be between 4 – 6 LPA

We would appreciate it if you could share this opportunity with suitable candidates and help
facilitate the application and selection process. Please let us know if there are any formalities or
additional requirements to proceed.

Thank you very much for your support. We look forward to welcoming talented candidates from
your Institution to our Program.

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