SM465-1

LONCO ROSIN FLUX 800 (RF800)

NO-CLEAN FLUX
RF800 provides the broadest process window for a no-clean flux with less than 5% solids content.
RF800 is designed to provide excellent soldering results (low defects rates), even when the surfaces to
be soldered (component leads and pads) are not highly solderable. RF800 works particularly well with
bare copper boards protected with organic or rosin/resin coatings and with tin-lead coated PCB's.

GENERAL DESCRIPTION that assemblers establish specifications on these

items with their suppliers and that suppliers provide
Certificates of Analysis with shipments and/or
RF800 is a very active, low solids, no-clean flux. It is
assemblers perform incoming inspection. A common
formulated with a proprietary activator system. A
specification for the ionic cleanliness of incoming
small percentage of rosin is added for enhanced
boards and components is 5µg/in2 maximum, as
thermal stability. The activators are designed to
measured by an Omegameter with heated solution.
provide the broadest operating window for a low
solids, no-clean flux, while maintaining a high level of
Care should be taken in handling the circuit boards
long-term electrical reliability. After wave soldering,
throughout the process. Boards should always be
RF800 leaves a low level of non-tacky residue, which
held at the edges. The use of clean, lint-free gloves is
is easily penetrable in pin testing.
also recommended. When switching from one flux to
another, the use of a new foam stone is
FEATURES & BENEFITS recommended (for foam fluxing).

• Highly active for excellent soldering and low Conveyors, fingers and pallets should be cleaned.
defect rates. Bioact SC-10 Solvent Cleaner has been found to be
• Low level of non-tacky residue to reduce very useful for these cleaning applications. When
interference with pin testing. foam fluxing, do not use hot fixtures or pallets. Hot
• Cleaning is not required which reduces operating fixtures/pallets will deteriorate the foam head.
costs.
• Reduces the surface tension between solder FLUX APPLICATION - RF800 is formulated to be
mask and solder to significantly reduce solder applied by foam, wave or spray methods. When foam
ball frequency. fluxing, the foam fluxer should be supplied with
• Meets Bellcore requirements for long-term compressed air which is free of oil and water. Keep
electrical reliability. the flux tank full at all times. The flux level should be
maintained 1 inch to 1-½ inches above the top of the
APPLICATION GUIDELINES stone. Adjust the air pressure to produce the optimum
foam height with a fine, uniform foam head.
PREPARATION - In order to maintain consistent A uniform coating of flux is essential to successful
soldering performance and electrical reliability, it is soldering. When using the foam or wave method of
important to begin the process with circuit boards and application, an air knife is recommended after the
components that meet established requirements for fluxing operation. An air knife will help ensure that the
solderability and ionic cleanliness. It is suggested flux is uniformly distributed across the board and will
remove the excess flux.
When spray fluxing, the uniformity of the coating can piece of tempered glass through the spray and then
be visually checked by running a piece of cardboard through the preheat section.
over the spray fluxer or by processing a board-sized

GENERAL GUIDELINES FOR MACHINE SETTINGS

OPERATING PARAMETER TYPICAL LEVEL

Amount of Flux Applied Foam, Wave: 1,000 - 2,000 µg/in2 of solids
Spray: 750 - 1,500 µg/in2 of solids
When foam fluxing ..................................................................
Foam Stone Pore Size 20 -50 µm
Distance that top of stone is submerged below flux 1 - 1½ inches (25 - 40 mm)
Foam Fluxer Chimney Opening 3/8 - 1/2 inch (10-13 mm)
When foam fluxing, use an Air Knife .........................................
Air Knife Hole Diameter 1 - 1.5 mm
Distance Between Holes 4 - 5 mm
Distance from Fluxer to Air Knife 4 - 6 inches (10-15 cm)
Air Knife Angle Back toward Fluxer from Perpendicular 3° - 5°
Topside Preheat Temperature 190°F - 230°F (85°C - 110°C)
Bottomside Preheat Temperature about 65°F (35°C) higher than topside
Maximum Ramp Rate of Topside Temperature (to avoid 2°C/second (3.5°F/second) maximum
component damage)
Conveyor Angle 5°-8° (6° most common)
Conveyor Speed 4 - 6 feet/minute (1.2 - 1.8 meters/minute)
Contact Time in the Solder (includes Chip Wave and Primary 1.5 - 3.5 seconds (2-2½ seconds most common)
Wave)
Solder Pot Temperature 460 - 500°F (235-260°C)
These are general guidelines which have proven to yield excellent results; however, depending upon your equipment,
components, and circuit boards, your optimal settings may be different. In order to optimize your process, it is
recommended to perform a designed experiment, optimizing the most important variables (amount of flux applied,
conveyor speed, topside preheat temperature, and solder pot temperature).

FLUX SOLIDS CONTROL - If foam, wave, or soldering performance, dispose of spent flux every 40
rotary drum spray fluxing, the flux solids will need to hours of operation. After emptying the flux, the
be controlled via thinner addition to replace reservoir and foam stone should be thoroughly
evaporative losses of the flux solvent. As with any flux cleaned with flux thinner.
with less than 5% solids content, specific gravity is not
an effective measurement for assessing and RESIDUE REMOVAL - RF800 is a no-clean flux
controlling the solids content. Monitoring and and the residues are designed to be left on the board.
controlling the acid number is recommended for However, if desired, RF800 residues can be removed
maintaining the solids content. The acid number with Alpha 2110 Saponifier.
should be controlled to between 17 and 19. Alpha's
Flux Solids Control Kit #3, a digital titrator, is TOUCH-UP/REWORK - Use of the Cleanline Write
suggested. Request Alpha's Technical Bulletin SM- Flux Applicator with NR205 flux and Telecore Plus
458 for details on the kit and titration procedure. cored solder is recommended for hand soldering
When operating the foam fluxer continously, the acid applications.
number should be checked every two to four hours.
Over time, debris and contaminants will accumulate in
recirculating type flux applicators. For consistent
TECHNICAL SPECIFICATIONS
Parameters Typical Values Parameters/Test Method Typical Values
Appearance Pale, yellow liquid pH (5% aqueous solution) 3.4
Solids Content, wt/wt 4.1 Recommended Thinner 800 Additive
Acid Number (mg KOH/g) 18 Shelf Life 18 Months
Specific Gravity @ 25°C (77°F) 0.794 ± 0.003 Container Size Availability 1, 5, and 55 Gal.
Pounds Per Gallon 6.6 Bellcore TR-NWT-000078, Issue 3
Compliant Yes
Flash Point (T.C.C.) 56°F (13°C) IPC J-STD-004 Designation B (RO/L1)

CORROSION AND ELECTRICAL RELIABILITY TESTING

Corrosion Testing Requirements Results
Silver Chromate Paper Test No Detection of Halide Passes
Copper Mirror Test No Complete Removal of Copper Passes
IPC Copper Corrosion Test No Corrosion (Type L)

SURFACE INSULATION RESISTANCE (all values in ohms)

Test Condition Requirement Results
Bellcore "Comb-Down" - Uncleaned 1.0 x 1011 minimum 4.5 x 1011
Bellcore "Comb-Up" - Uncleaned 1.0 x 1011 minimum 6.7 x 1011
Bellcore Control Board 2.0 x 1011 minimum 1.6 x 1012
IPC J-STD-004 Comb-Down 1.0 x 108 minimum 1.1 x 1010
Uncleaned
IPC J-STD-004 Comb-Up Uncleaned 1.0 x 108 minimum 9.8 x 109
IPC J-STD-004 Control Board 1.1 x 1010
Bellcore Test Condition (per TR-NWT-000078, Issue 3): 35°C/85%RH/120 Hours/-48 volts, measurement @ 100V/
25 mil lines/50 mil spacing.
IPC Test Condition (per J-STD-004): 85°C/85%RH/168 Hours/-50V, measurement @ 100V/IPC B-24 board (0.4 mm lines, 0.5 mm
spacing).
ELECTROMIGRATION (all values in ohms)
Test Condition SIR (Initial) SIR (Final) Requirement Result Visual Result
Bellcore "Comb-Up" 3.6 x 109 3.8 x 109 SIR (Initial)/SIR (Final) < 10 Passes No Dendrites
Uncleaned or Corrosion
Bellcore "Comb-Down" 2.8 x 109 4.0 x 109 SIR (Initial)/SIR (Final) < 10 Passes No Dendrites
Uncleaned or Corrosion
Bellcore Test Condition (per TR-NWT-000078, Issue 3): 85°C/85%RH/500 Hours/10V, measurement @ 100V/IPC B-25 B Pattern
(12.5 mil lines, 12.5 mil spacing)

HEALTH & SAFETY

Please refer to the Material Safety Data Sheet as the needed to completely capture the fumes. Observe
primary source of health and safety information. precautions during handling and use. Suitable
Inhalation of the flux solvent and volitalized activator protective clothing should be worn to prevent the
fumes which are generated at soldering temperatures material from coming in contact with skin and eyes.
may cause headaches, dizziness and nausea. RF800 flux contains a highly flammable solvent with a
Suitable fume extraction equipment should be used to flashpoint of 56°F (13°C). The flux must not be used
remove the flux from the work area. An exhaust at the near open flames or near non-flameproof electrical
exit end of the wave solder machine may also be equipment.

The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or implied regarding the accuracy of this data. Liability is expressly
disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated.