Highlights in Science, Engineering and Technology EMIS 2023

Volume 81 (2024)

Analysis Of the Development History, Key Technologies, And

Future Development of Integrated Circuits
Zimo Li *
TsingHuaZhiQing High School,100084, Beijing, China
* Corresponding Author Email: wrivera81414@student.napavalley.edu
Abstract. Integrated circuits (ICs) are pivotal in propelling the advancement of contemporary human
technology. This article delves into the definition and evolution of integrated circuits, while also
examining various collaborative technologies. Notable among these are EDR technology, VLSI
testing technology, and High-Speed signal integrity testing assurance technology. The roots of
integrated circuits can be traced back to their inception, with innovations occurring at a rapid pace
over the years. EDR technology, for instance, has been instrumental in enhancing the efficiency of
ICs by enabling data transmission at high speeds. Similarly, VLSI testing technology has played a
crucial role in ensuring the reliability and quality of ICs. High-Speed signal integrity testing assurance
technology has emerged as a fundamental aspect of IC development, ensuring that signals remain
stable and accurate even at high speeds. These collaborative technologies have propelled ICs to
new heights, paving the way for more powerful and efficient electronic devices. Furthermore, this
article explores the challenges and prospects associated with integrated circuits on both a national
and global scale.
Keywords: EDR technology, VLSI, High-Speed signal, challenges and development.

1. Introduction
Integrated circuits are widely distributed in various aspects of life. Covering industry, military,
communications, aerospace, consumer electronics, automotive, medical equipment, household
appliances, and bioelectronics [1]. It is the cornerstone of modern information society, playing an
essential role in promoting the development of a new era for humanity and bringing huge benefits to
people worldwide. In the development of integrated circuits, many key technologies have emerged,
such as protection technology, design technology, and testing technology, which have solved
problems in integrated circuits and laid a foundation for future larger, more efficient, safe, and reliable
integrated circuits. These key technologies are worth analyzing and understanding. In addition, with
the continuous advancement of integrated circuit manufacturing technology and equipment, chip's
extreme technology continues to make breakthroughs. The continuous reduction of process size leads
to the continuous expansion of chip circuit scale. The challenges faced by integrated circuits are
increasingly big. More and more people are paying attention to the development prospect of this
industry [2].
Therefore, this article will describe the definition of integrated circuits in detail, describe the
development process of integrated circuits, and analyze some of the key technologies involved. For
example, EDR technology, VLSI testing technology, and High-Speed signal integrity testing
assurance technology. In addition, this article also analyzes the challenges faced by integrated circuits
and their future development, such as the challenges faced by the integrated circuit industry in China,
as well as intellectual property and protection of integrated circuits and development and challenge
prospects of integrated circuits in the world. Integrated circuits are a bright pearl of human industry,
contributing to the advancement and development of society, and setting the direction for future
technological advancement.

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2. The theoretical basis of integrated circuits

2.1. Definition of integrated circuits
An integrated circuit is a type of micro-electronic device or component. By using a particular
process, the required details such as transistors, resistors, capacitors, and inductors in a circuit are
interconnected with wiring and then fabricated onto a small or several small semiconductor chips or
dielectric substrates. They are then packaged in a tube shell to form a microstructure with the required
circuit functions.
2.2. The development history of integrated circuits
Integrated circuits originated in 1947. John Barding, Bratton, and Shockley from Bell Laboratories
in the United States invented the transistor. In the following decade, people began to develop
transistors until 1958, when the world's first integrated circuit was produced, marking the arrival of
the era of integrated circuits. Subsequently, in 1964, Moore proposed the famous Moore's Law: the
integration of transistors will double every 18 months. Shortly thereafter, in 1966, RCA Corporation
in the United States developed CMOS integrated circuits and the first gate array. Five years later,
with Intel's release of 1kb Dynamic Memory (DRAM) and the world's first microprocessor 4004, it
marked the emergence of large-scale integrated circuits. In 1978, a 64kb dynamic random-access
memory appeared, integrating 140000 transistors on silicon wafers of less than 0.5 square centimeters.
Human beings have been constantly moving towards ultra-large-scale integrated circuits. In 1988,
16M DRAM emerged, integrating 35 million transistors on a 1 square centimeter silicon wafer. At
this point, people have entered the era of ultra-large-scale integrated circuits. The development history
of integrated circuits is shown in Figure 1.

Fig. 1 The development history of integrated circuit (Photo/Picture credit: Original)

3. Key Technology Analysis

3.1. Analysis of ESD technology
The ESD phenomenon is because two objects at different potentials cause static charges to move
through electrostatic field induction or direct contact. When the charge generated is large enough, the
inability to generate enough charge in the circuit system will concentrate and sum up. This can lead
to excessive voltage in the integrated circuit, which can generate a lot of heat and damage the circuit.
Therefore, people have formulated the design principle of the ESD protection circuit of the
integrated circuit. When the integrated circuit is working normally, the ESD protection circuit should
be in the off state. When the ESD phenomenon occurs, the ESD protection circuit will be opened
quickly. At the same time, when designing ESD protection, it should be designed in layers according
to different protection levels to ensure that the core of the integrated circuit cannot be damaged. In

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addition, during the occurrence of ESD, each device of the protection circuit should be turned off to
avoid device failure and damage to the core of the integrated circuit [3].
The devices in the ESD protection circuit are very diverse, among which diodes, resistors, and
bipolar transistors are the main ones. As one of the most critical components in integrated circuits,
diodes are widely used in various protection circuits. In ESD, since diodes have no hysteresis
characteristics, the detection method of diodes is mainly rail-to-rail. The resistors are mostly N-type
well capacitors. The bipolar transistor plays the role of amplifying the current. It is a crystal triode
composed of two back-to-back PN structures.
Most ESD protection circuits use SCR protection technology, which mainly uses thyristors. The
application process of SCR protection technology includes two kinds of resistors and two parasitic
triodes. When performing ESD protection, the thyristor is connected to the integrated circuit as a two-
terminal device, its anode is connected to the N-well and its cathode is connected to the P-well. By
connecting the thyristor to PN in the bipolar transistor in the integrated circuit, the effective ESD
protection function can be played by triggering the thyristor.
3.2. VLSI Testing Status and Key Technologies
Integrated circuits mainly include four significant sectors: design, manufacturing, packaging, and
testing. Among them, the test section is very important. Regarding the ATE testing technology of
integrated circuits, Luo Hongwei and his team conducted a detailed analysis. The integrated circuit
ATE test system is a collection of various electronic circuits, mainly including the following modules
[4].
Firstly, about the Time Test Unit. The purpose of the timing test unit is to measure timing
parameters, including period, pulse width, pulse duty cycle, signal rise/fall time, and transmission
delay. The hardware circuit of the time measurement unit generally includes a logic control FPGA, a
signal conditioning circuit, and a time measurement circuit.
Secondly, about the Arbitrary Waveform Generator. The purpose of the arbitrary waveform
generator is to synthesize the test vector waveform, by synthesizing the driving front and back edges
of the test vector graphics and measuring the front and back edges, to realize different test waveforms
and timing information of the test vector.
Thirdly, about Digital instrument. The digital instrument which is used to collect the output
measurement value of the chip pin and compare the collected output high-impedance state, output
high level, and output low level with the expected output value of the test vector.
Fourthly, about the Precision Measuring Unit. The precision measurement unit is used to measure
current and voltage. By applying a certain current or voltage to the pins of the chip under test, the
voltage or current of the corresponding pins is measured to realize the open circuit/short circuit test
and leakage test of the pins.
3.3. High-Speed Signal Integrity Testing Assurance Technology
In addition, they also analyzed the guaranteed technology of high-speed signal integrity testing [4].
They analyzed that high-speed signal integrity testing is a huge challenge in the current development
of high-speed, high-frequency, and high-bandwidth integrated circuit technology. Among them, high-
speed signals can cause problems such as reflection, crosstalk, and radiation during transmission,
leading to false digital circuit triggering, output signal waveform distortion, and system instability.
This will affect the testing of integrated circuits.
Yuan Weiqun and their research on signal integrity-based high-speed PCB optimization design
sine waves are commonly used to obtain time-domain responses through testing software, and the
technical means are to analyze the key properties of high-speed transmission channels using vector
network analyzers with wide coverage frequency and fast testing speed [5]. Therefore, in practical
applications, quality issues of cables, connectors, and PCBs can be inspected in the early stages of
design to reduce subsequent impacts.

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4. Development and Challenge Prospects of Integrated Circuits

4.1. Development and Challenge Prospects of Integrated Circuits in China
According to Li Jianming's research data on the problems and challenges faced by the integrated
circuit manufacturing industry, China’s domestic demand for integrated circuits is large but the
supply is small, lacking competitiveness [6]. Li Jianming pointed out that talent and technology are
fundamental to the development of the industry. We should accelerate the pace of talent cultivation.
Therefore, in order to solve the problem of insufficient supply capacity in China's integrated circuit
industry, it is necessary to focus on technological innovation and talent cultivation, and the
government should continue to increase investment in the integrated circuit industry [7].
4.2. Intellectual Property and Protection of Integrated Circuits
In recent years, the continuous flow of piracy and infringement has greatly hindered the
development of integrated circuits. The intellectual property rights of integrated circuits are not only
an institutional guarantee but also a driving force to stimulate their development. Qiu Dongdong
proposed three contradictory points in the intellectual property rights and protection of integrated
circuits, namely the contradiction between the technical performance and creativity of integrated
circuit technology, the contradiction between the limitations and patentability of integrated circuit
technology, and the contradiction between the replicability of integrated circuit technology and the
content of patent rights.
Based on the above three contradictions, Qiu Dongdong proposed three solutions [8]. The first one
is deterrence, which relies heavily on citizens' quality to protect integrated circuits. The second type
is protection, which uses encryption algorithms and other operations to protect the integrated circuit
IP core from theft and commercial use. The third method is detection, which embeds watermark
technology into integrated circuit technology for easy detection. At present, the path of intellectual
property protection for integrated circuits is still arduous and requires the unremitting efforts of the
entire industry.
4.3. Development and Challenge Prospects of Integrated Circuits in the World.
Sun Jinkai pointed out in his research on the status quo and development prospects of the
semiconductor integrated circuit industry [9]. With the progress of mainstream processes, the
development of technology and materials, the reduction of technical standards in the integrated circuit
industry, the physical mechanisms and process technologies that lead to the semiconductor integrated
circuit industry face great challenges in the development process in terms of size effects, The process
scale is decreasing, and the thickness of gate insulation layer of the integrated circuit is limited. The
IC conductive region distance is reduced. In terms of materials, the size of integrated circuit
components is decreasing, and in order to avoid leakage, process and material requirements are
becoming more stringent. Also, In the future development of integrated circuits, Sun Jinkai pointed
out that the slowdown in the growth rate of integrated circuits will not cause the microelectronics
industry to stagnate. The integrated circuit industry can focus on product diversity and energy
consumption optimization to meet modern market needs [10]. At the same time, the reduction in the
growth rate of integrated circuits brings more time to relevant researchers. We will put more energy
into computer systems and software development and improve the performance of integrated circuit
products.

5. Conclusion
Integrated circuits (ICs) continue to advance steadily, with ongoing efforts aimed at enhancing
process technology and minimizing energy consumption still undergoing refinement. As we look to
the future, the integrated circuit industry is poised to place greater emphasis on safeguarding its
innovations and fostering practical applications, all the while surmounting persisting technical

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challenges. The quest to optimize process technology remains a focal point in the IC industry's
ongoing journey. The intricacies of improving IC manufacturing processes are multifaceted and ever
evolving. Researchers and engineers are tirelessly working to unlock more efficient and sustainable
production methods that can further propel the capabilities of ICs.
Moreover, the relentless pursuit of energy efficiency remains an essential objective. As the world
grapples with environmental concerns, reducing the energy footprint of ICs is of paramount
importance. Innovations in power management, heat dissipation, and energy-efficient designs are at
the forefront of these endeavors. In the coming years, the integrated circuit industry's dedication to
safeguarding its innovations and fostering practical applications will continue to shape its trajectory.
This commitment involves not only protecting intellectual property but also ensuring that the benefits
of IC technology are accessible to a broader spectrum of individuals.
Ultimately, the vision is to democratize the advantages of integrated circuits, making them more
affordable, accessible, and applicable to a wide range of industries and everyday life. This
commitment to progress, efficiency, and accessibility will be the driving force behind the continued
evolution of integrated circuits in our technologically advancing world.

References
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Development in the Field of Integrated Circuit Materials in China. Industrial Economic Review, 2023.
[2] Huang Dechun, Yuan Qigang. Research on the New Model of Innovative Development of China's
Integrated Circuit Industry under the New National System. Jiangsu Social Sciences, 2022, (03): 156-165.
[3] Ying Fumiao. Analysis of ESD protection technology for integrated circuits. Science and technology style,
2017, (15): 201.
[4] Luo Hongwei, Liu Jingsheng, Yu Yongtao&Luo Jun. Current Status and Key Technologies of Very
Large-Scale Integrated Circuit Testing Reliability and Environmental. Testing of Electronic Products,
2017, (S2): 16-20.
[5] Yuan Weiqun, Song Jianyuan, Chen Shirong. Signal integrity-based high-speed PCB optimization design,
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[7] Yu Zongguang, Huang Wei. The Development Trend of China's Integrated Circuit Design Industry.
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