Embedded Software Engineering Role

Talent Analysis
India

Conceptualized and Developed: May 2023

The objective of the document is to provide a comprehensive analysis of the
Embedded Software Engineering Talent Pool in India

Copyright © May 2023 Draup. All rights reserved

1
Agenda

01 Macro Trends 02 Digital Intentions 03 Taxonomy

Embedded Systems Ecosystem Top Employers in the Industrial & Taxonomy of Embedded Engineering
Macro Trends for India Consumer Electronics Industry and skill families and a detailed role
their digital use-cases competencies of Embedded Software
Engineering Job Role

Embedded SW Engineer Key Engineering Profiles

Location Deep-Dive
04 Talent Analysis 05 In-Depth view of the Embedded
06 Draup collated the key engineering
Landscape View of Embedded
Software Engineering Talent Pool profiles from talent hotspots and
Software Engineering Talent Pool in
across the top 6 India locations estimated expertise scores basis
India provided with a detailed Source: Draup
Draup’s proprietary expertise model
location comparison dashboard

2
Source: Draup 2
Executive Summary(1/2)

Objective:

Draup launched a systematic assessment to define the Embedded engineering skill families Taxonomy and further analyze the relevant Embedded Software Engineering talent pool for
Carrier Global. Draup assessed over 50 locations across India and provided focused deep dive into the 6 Talent Hotspots- Greater Hyderabad Area, Greater Bengaluru Area, Greater
Chennai Area, Delhi NCR Area, Greater Pune Area and Greater Coimbatore Area. The summary of the analysis for the Embedded Software Engineering Job Role is segmented below:

Overview - India:
• Location Analysis (comparing parameters such as Talent Supply, Talent Demand, Growth Rate, Hiring Difficulty, Talent Cost and University Talent Supply) identifies India as
one of the most suitable markets; Experienced Embedded Developers have high demand in India
• India has an overall installed talent size of ~26,000 professionals for Embedded Software Engineering Job role (with C/C++, RTOS and relevant skills) with a national median
base pay of ~$14,500
• The current trends of manufacturing and product-based investments in India is favorable for Design, SOC, and Testing
• The government has allocated ~$6.39 billion in 2020 as incentives under the three introduced schemas, aimed to help in the rise of local production of electronics and
promote anchor companies in the major electronics clusters in India

Deep Dive Analysis:

1. Greater Bengaluru Area: 2. Greater Hyderabad Area:
• Bengaluru has the highest talent supply (6,250) for Embedded Software
Engineering Talent in India • High talent availability (~2,750) for relevant Embedded SW Engineering Talent
• Electronic City and Whitefield are major hotspots within Bengaluru Area • Median Base Pay(~$15,800) is approximately 9% higher than the national
• Cost of talent(Annual Median Base Pay) in Bengaluru is approximately 13% median pay and the relevant talent growth rate (~9.2%) is high across the
higher than the national median Base pay locations analyzed
• Organizations like Arm, AMD, Nvidia, and Qualcomm have set up Incubator • Hyderabad accounts for 6% Source: Draup
of the total electronics production in India
Program in Bengaluru that hosts competitions every year • The State Government accorded 2 ESDM clusters at E-city, Raviryala, and
• Bengaluru has the highest Women diversity ratio(19.2%) for the relevant Maheshwaram Park in Hyderabad
talent in India
3

Source: Draup 3
Executive Summary(2/2)

3. Greater Chennai Area:

• The relevant installed talent pool is estimated to be ~1,850 for relevant 4. Greater Pune Area:
Embedded SW Engineering talent • Greater Pune area has a high installed talent pool(1,800)
• Median Base Pay($15,600) is approximately 7% higher than national median • Within Pune, Talegoan and Khed are two major ESDM hubs that have
pay, and ~9% is the growth rate connectivity to two of India’s largest ports (JNPT and Mumbai Port)
• Companies such as Sony-Ericsson, Foxconn, Samsung, Cisco, and Dell have • Pune is a high growth location with an estimated annual growth rate of ~8.2%
chosen Greater Chennai Area as their manufacturing hub • Talent Median Base Pay (~$15,400) is ~6% higher than national median pay
• Chennai has high relevant fresh graduates ~14,500 passing out annually from • KPIT Technologies, TCS, and Whirlpool are some of the top employers in
related electrical & electronics engineering courses Greater Pune Area

5. National Capital Region, India: 6. Coimbatore Area:

• NCR Region has the highest talent growth rate ~10.8% attributed to high fresh • Highest relevant Talent Growth Rate (10%) among the Tier 2 locations in India
talent supply from University/Colleges ~23,500 graduating from ECE, EEE, EIE, for Embedded Software Talent
EME and other related electrical & electronics engineering courses • High talent availability (~1,250) for relevant Embedded Software Engineering
• The installed talent size is ~1,300 for relevant Embedded SW Engineering talent
talent pool • The state government has proposed for the Tata Group to set up their first
• Noida is the major hub for ESDM players in the NCR Region semiconductor fabrication unit results in increasing employment
• The NCR region focuses on small-scale units that manufacture electronic and • Median Base Pay(~$13,200) in Coimbatore Area is approximately 9% lower than
computer products the national median base pay
• Talent Median Base Pay ~$16,200 is approximately 11.7% higher than the
national median base pay

Source: Draup

Source: Draup 4
 Macro Trends in India’s Embedded Systems Ecosystem: Driven by the advent of IoT, 5G, and AI, The Indian electronics
manufacturing industry is projected to reach US$ 520 billion by 2025; Government initiatives, Geo-political
advantages, and presence of R&D hubs are expected to help India boost the embedded Systems Ecosystem

Strengths Challenges Opportunities &

Growth Drivers 07
Large Market
Size 01 Low Talent Supply-
Demand Gap 03 Chip
Shortage 05
• India’s semiconductor market is the 5th • India’s Talent Demand-Supply gap is lowest • Electrical Industry is suffering due to global • Increased demand of Embedded OS from
largest in the APAC region. The market across the globe for Embedded Design job roles. chip shortage. The chip shortage has the Automotive Industry will pivot the
share has been driven mainly by design This is expected to increase due to rapid brought car production to a growth of Semiconductor talent pool
services which became one of the global expansion standstill, delayed consumer electronics
hubs for electronics design, with nearly • Major semiconductor companies ( such as product launches, and impacted companies’ • High Adoption of AI-powered smart
2,000 chips designed every year Broadcom, Intel, Qualcomm, Samsung & ability to onboard new employees devices with cloud computing in industrial
Huawei) have their fabless Intellectual Property automation
(IP) & design offices established in India
• Industries such Medical devices, &
Consumer electronics have witnessed high
demand post Covid
Rapid Digital
Adoption 02 Favourable
Government Initiatives 04 Low IP Acceptance
Rate 06 • Geopolitical Advantage: Project bans,
contract restrictions, and the cancellation
of acquisitions have resulted from
• The advent of EV with the modern • India has approved a $10 billion incentive scheme
concerns about security vulnerabilities in
• IP Regime - India’s low acceptance rate
technologies such as 5G, IoT & Artificial to lure semiconductor and display manufacturers (~4.5%) of research publications in IEEE is imported IC designs and theft of exported
Intelligence, Embedded Systems play a as part of a tactical move to position the nation as the reason for low IP creation rate. IP during the US and China trade tensions.
pivotal role in driving the National Vehicle a hub to produce electronics worldwide. • Though India has a high volume of annual Companies look to diversify their global
electrification & Automation • Govt Special Manpower Development Program is Draup centers and India is at the top due to high
Source:
STEM Graduates, the relevant fresh talent
(SMDP) focuses on incentivizing moves to Chip & less than 8% of the total annual graduates Embedded SW talent
System Design passing out.

Source: Key findings are summarized through conducting several interviews with talent acquisition teams, peer interviews and systematic research conducted by Draup; Draup also tracks multiple public sources, Source: Draup 5
government portals, digital intentions, media journals, press releases and other secondary resources and triangulates it with Draup proprietary platform data to publish the ecosystem analysis
Peer Analysis – Digital Intentions(1/2): Digital advancements observed across major Industry peers include the wide-
range adoption of technologies such as Industrial IoT, AI/ML, Sensors, and Big Data

Company Digital Theme Digital Partner Technology Focus Areas & Initiatives
• Johnson Controls has launched the OpenBlue platform, which provides an AI-based HVAC management
(Inhouse Digital platform that increases energy-saving and improves Indoor Air Quality (IAQ)
Process • Artificial Intelligence
Capability) • By connecting HVAC equipment with new data and AI, users of the platform can expect 20-60% cost
Optimization • Internet of Things
savings by optimizing the performance of the complete HVAC system across energy costs and IAQ
parameters
• Johnson Controls has acquired Qolsys for security and smart building solutions, OpenBlue platform that
• Artificial Intelligence solves complex challenges and has focused on creating AI-based Smart Home and Security management
• Sensors solution that goes beyond the traditional operation
Security • Security Automation • It has partnered with Microsoft for Azure Digital Twins services that enable the creation of knowledge
• Internet of Things graphs based on digital models of entire environments, whether they are buildings, factories, farms,
energy networks, railways, stadiums, or entire cities
• Johnson Controls uses OpenBlue Digital Technology for remote management of HVAC, fire, and security
• Artificial Intelligence
services in real-time to ensure equipment performance and uptime availability
• Sensors
Smart Factory • The partnership with DigiCert enables the Johnson Controls OpenBlue digital solutions suite to utilize the
• Cloud
DigiCert ONE PKI platform, which helps in mitigating the risk of costly operational interruptions due to
• Internet of Things
cybersecurity attacks
• Voice Recognition • LG Electronics announced that HVAC units are now Wi-Fi enabled and compatible with LG's SmartThinQ
(Inhouse Digital • Machine Learning app. Using the app, users can control the entire lineup of LG smart appliances in their home
Connectivity • Sensors • The next-generation LG Sensor Connect mobile application allows users control the lighting. The Android
Capability)
• Internet of Things app comes embedded with VLC technology, a cutting-edge communication platform
• LG Electronics introduced an energy-efficient and IP65-rated LED high bay with wireless communications.
• Sensors The fixtures feature integrated daylight and occupancy sensor with three levels of system integration,
Energy • Internet of Things including stand-alone, group control, and third-party wireless controls using the ZigBee open standard
Optimization • Wireless protocol
Communications • LG has integrated with Fractal EMS (Energy storage control platform) that includes software, controllers,
integration, and analytics
• LG’s IoT-based voice systems allow guests to control smart devices in the room, including lights,
• Internet of Things
(Inhouse Digital drapes/door locks, and others
Smart Factory • Sensors
Capability) • LG’s voice assistant is a combination of voice interaction, content search, and Google Assistant this built-
• Voice Recognition
in voice assistant lets users control basic functions, search for content, and find helpful information
Note: Draup analyses 30,000+ recent articles, announcements, annual reports and news publications periodically to identify and track digital intentions and signals of peer companies. List of digital intentions is not exhaustive
Peer Analysis – Digital Intentions(2/2): Digital advancements observed across major Industry peers include the wide-
range adoption of technologies such as Industrial IoT, AI/ML, Sensors, Computer Vision and Big Data

Company Digital Theme Digital Partner Technology Focus Areas & Initiatives

• Company’s smart inverters that can enable efficient integration of distributed energy resources (DERs)
(Inhouse Digital • Machine Learning
by utilizing artificial intelligence to alter the magnitude and angle of the voltage
Autonomy Capability) • Artificial Intelligence
• Daikin's smart inverter HVAC systems, such as the Daikin FIT system and the Daikin One ecosystem of
• Internet of Things
indoor air quality modules provide an integrated solution for temperature control and air quality

• Daikin's Intelligent Equipment platform was in collaboration with Intel and Wind River (an Intel
Company earlier). The Intelligent Equipment platform supports remote monitoring and control using any
• Artificial Intelligence
Connectivity • Internet of Things
mobile device
• Use of IoT-based system that allows remote control of the home's climate using a tablet, smartphone, or
desktop to better control the central heating and cooling

Asset • Artificial Intelligence • Daikin collaborated with Intel developed analytics for HVAC systems to identify issues and ineffective
• Machine Learning systems that need service
Maintenance & • Big Data • Analytical tools or software that collects equipment statistical data such as production data to identify
Security • Internet of Things patterns and predict the required equipment maintenance to prevent asset failure

Asset • Machine Learning

• Siemens has introduced Predictive maintenance to predict device failures before they occur. It detects
(Inhouse Digital • Artificial Intelligence
Maintenance & • Internet of Things
potential early errors associated with the needs of the Edge or Cloud applications.
Capability)
Security • It is tailored to the needs of the various industries and applications
• Big Data

• Analytics
• Siemens has collaborated with Sino-Singapore Guangzhou Knowledge City for Air Management
• RPA
Smart Factory (Inhouse Digital • It captures pollution data in real-time and forecasts emissions. It also stimulates the effectiveness of
• Big Data
Capability) measures for improving air quality
• Machine Learning

• Siemens has launched an IoT-enabled suite of hardware and software technologies designed to create,
• RPA
Workplace (Inhouse Digital smarter, flexible, human-centric working spaces
• Artificial Intelligence
Modernization Capability) • With real-time analytics, office spaces can adapt to the needs of employees for increased productivity
• Internet of Things
and energy efficiency while reducing costs

Note: Draup analyses 30,000+ recent articles, announcements, annual reports and news publications periodically to identify and track digital intentions and signals of peer companies. List of digital intentions is not exhaustive
 Job Roles and Technical Competencies (1/2) : Draup leveraged text mining to analyze Embedded Software Development
skills across JDs to define key constituent technical skill stacks and Job Roles Taxonomy about technical capabilities

Skill Cluster Embedded Software Development

Embedded Design & Microcontroller
Skill Family SoC Cloud & IoT Operating Systems Programming Data Analytics
Architecture s
Digital and Model Assembly RTL Synthesis & ASIC Power IoT Platforms Wireless Edge RTOS Kernels Cloud C, C++, Data Statistical &
Analog Simulation & Architecture simulation Designing, Access Protocols Integration System C Management & Analytical
Electronics Designing simulation & (Watson IoT, GE (QNX, VxWorks, Visualization Programming
(RN4870, RN4020, (Synopsys Design Predix etc) (Wifi, Cellular, FreeRTOS, ThreadX,
Components Analysis Tools
(MatLab, Simulink, ESP32, ESP8266, Compiler/DCT/DC Bluetooth, RFID, NFC, Arm Cortex-M, etc) (Oracle, MySQL,
Design
UML, Pspice, LTSpice) 8051, MSP430, Ultra, Cadence Mesh) Tableau, SAS) (R, Java, Python,
Arduinos, Raspberry NCSIM, Synopsys VCS)
SPSS)
Pi etc)
Constituent Skills Stack

System Communication Instruction SOC Security & FPGA Design & IoT Protocols Microcontroller, General Purpose IoT Integration Git, Python, AI/ ML Engines & Big Data tools &
Architecture Protocols Architectures Virtualization Verification Microprocessor OS OOPS, Workflows Ecosystems
(MQTT, REST APIs, Architectures (GPOS) MicroPython
(IBM Rhapsody, (I2C, Serial Peripheral (RISC, CISC) (VLSI, VHDL, UVM, CI/ DDS, AMQP) (Impala, Scikit, NLTK, (Apache Spark and
DOORS) Interface (SPI), GPIOs, CD) (RN4870, RN4020, (Embedded Linux, Numpy) Hadoop)
CAN Bus, RS232, RS ESP32, ESP8266, Symbian, eCos,
485, TCP/IP, Modbus, 8051, MSP430, Micro-Control Linux,
Backnet, 5G, Wifi, Arduinos, Raspberry Windows, Android)
Bluetooth, RFID, NFC) Pi etc)

Software Debugging Toolchaining Mixed Mode Cloud Containerization

Development Design & SOC Integration
(Abatron BDI3000, (GNU, Clang, LLVM) (Docker, Kubernetes,
Techniques Power
Freescale USB Tap, ECS, EKS)
Management
(Agile, Embedded DevOps,
Wind River Probe,
Waterfall, RAD) OCDemon, GDB,
JTAG)

ASIC, RTL Design and Verification

Embedded Software Designer Embedded IoT Developer Embedded Linux Application Developer – C, C++ Embedded Developer – AI/ML
Engineer
Domain
Embedded Software Architect SOC Design Engineer Embedded Linux Middleware Developer – C, C++
Roles
FPGA Design and Validation
Engineer

Note: Draup identified the major Skills required for Embedded Software Developer job role and further analysed these major skills families at a granular level while mapping the different specific embedded systems roles to these skills families.
Domain roles list is not exhaustive.
Job Roles and Technical Competencies (2/2) : Draup leveraged text mining to analyze Embedded Software Development
skills across JDs to define key constituent technical skill stacks and Job Roles Taxonomy about technical capabilities

Skills
Family
Embedded Testing Embedded Security

Software Unit Testing System Validation Testing Static Code Testing Cryptographic designing Hardware Security Management

(AES, RSA, ECC, HMAC, CMAC) (Hardware Security Module, Secure

Hardware Extension, ARM Trust Zone,
Trusted Execution Environment)

Software/ Hardware Integration Defect Lifecycle Mnagement tools Hardware Testing Skills Threat Modelling Cybersecurity Compliance
Scripting and Testing Regulations
Constituent Skills (Jira, Trello, Asana, Redbooth) (Oscilloscope, Logic Analyzers, (Secure Boot implementation, fast-boot
Stack (Emulation and Simulation based) Hardware understanding, Logic Gates, debugging, Network Interception, OWASP (PCI, COPA, Safe Harbor, FISMA, FedRAMP
Circuit Design experience, Verilog) security attack) Compliance Regulations)

System scripting and Testing Automation Scripting Firmware Security Management

(Black-box, white- box and Gray-box testing) (Python, Selenium etc) (Encryption, Decryption, TLS, PKI, Hash, OAEP,
PSS)

Embedded Test Automation Embedded Security Software Hardware Security

Embedded QA Test Engineer
Engineer Engineer Engineer
Domain
Roles
Embedded Cyber Security
Hardware Test Enginer
Engineer

Note: Draup identified the major Skills required for Embedded Software Developer job role and further analysed these major skills families at a granular level while mapping the different specific embedded systems roles to these skills families.
Domain roles list is not exhaustive.
Role Competencies Analysis – Embedded Software Engineer: Draup identified Qualifications/Skill Requirements,
Responsibilities, and alternate Job Titles for the Embedded Software Engineer Job Role

Job Role Key Workloads Qualifications/ Technical Skills Alternate Job Titles

• Bachelor’s Degree/Master’s Degree in Computer

Science/Electrical Engineering/Information System

Technical Skills
• Identifies product requirements or performance issues. Works
with the software team leader to negotiate a resolution • C(Programming Language)
• Involve in designing, development, and integration of complex • Linux
drivers, tests, and SW infrastructure, as well as SoC Bring-ups and • Firmware
complex debug activities • Embedded Development Engineer
• Debugging
• Lead and implement the effort to build a secure gateway solution • Embedded Software Engineer
to enable a customer-owned device to be used as a target for • C++
Linux
deployment and access test devices over untrusted networks, such • Software Design
as the internet • Embedded QA Engineer
Embedded • Embedded Software
• Developing and maintaining the build and test automation • Embedded Software Test
Software systems for the embedded SW team • Real-Time Operating Systems (RTOS) Engineer
Engineer • Design and development of device firmware using C/C++ • IoT • Senior Embedded Software
programming languages • HVAC controls Engineer

• Full cycle software development of embedded applications • Agile • Embedded Software Engineer/
already deployed and those under development Firmware Engineer
• Data Analytics
• Collaborate with the research team to optimize algorithms to fit • Embedded Engineer
into the device
Soft/functional Skills
• Collaborate cross-functionally across geographies with hardware,
system, and cloud engineering teams to define and implement • Good verbal and written skills in English
specifications, features, and APIs
• Ability to collaborate and work in a team
• Strong analytical capabilities
• Detail oriented

Note: Draup tracks 750Mn+ professional profiles and 300Mn+ Job descriptions annually, this data was leveraged to identify responsibilities, skills and titles of Embedded Engineering Profiles
 India Overview - Embedded Software Engineer: India employs around 26,000 Embedded Software Engineers; Bengaluru
and Hyderabad employ over 31% of overall relevant talent in India. Companies such as Honeywell, Intel, and HCL Tech
are some of the major employers

India Hotspots ~26,000 83% 17% 6 Years

(25,000 – 27,000)
Installed Talent Pool Gender Diversity Median Years of Experience
Over 65% of talent for Embedded Engineering employs in roles such as Embedded Engineer and Firmware
Engineer. Some top skills for these roles include C/C++, Linux, and RTOS. The median base pay for this talent
pool is ~14,500 USD
NCR (New Delhi, Median Talent
Noida and Gurugram)
Installed Talent
MSA** Base Pay Talent Demand* Top Employers
Pool
(USD)
Bengaluru 6,000 – 6,500 16,500 2,500 – 3,000 Honeywell, Intel, Bosch, L&T, HP

Hyderabad 2,500 – 3,000 15,800 1,200 – 1,700 Honeywell, TCS, Qualcomm, HCL
Ahmedabad Kolkata
Chennai 1,700 – 2,000 15,600 800 – 1,000 KPIT, TCS, Eaton, Emerson, Cyient
Mumbai
Pune Pune 1,700 – 1,900 15,400 400 – 600 TCS, Visteon, HCL, Bosch, L&T

Hyderabad NCR 1,200 – 1,400 16,200 350 – 550 Ciena, VVDN, HCL, NXP, L&T
Talent Pool Distribution 200 – 300
Coimbatore 1,000 – 1,500 13,200 Bosch, UST, Pricol Limited, HCL
High (>2,500) Mumbai 975 – 1,175 15,300 150 – 250 TCS, L&T, Capgemini, Honeywell
Bengaluru
Chennai
Medium (1,000 – 2,500) Ahmedabad 700 - 900 14,300 300 – 400 eInfochips, VOLANSYS, Teksun Inc
Coimbatore
Low (<1,000) Cochin 375 – 425 13,800 50 – 150 Tata Elxsi, Ignitarium, Intel, Quest
Cochin

50 – 150 Wipro, TCS, Cyient, VVDN,

Kolkata 150 – 200 15,000
MachineSense
Parameter Favorability Index High Medium Low
NOTE: * Talent Demand is the number of jobs posted for the relevant job role in the past 12 months. ** MSA refers to a Metropolitan Statistical Area
Draup leverages its Talent Simulation module and database of 750Mn+ technical profiles and 300M+ Job descriptions. Relevant Job clusters are modelled using Draup’s proprietary taxonomy and role level talent estimation is modelled for each city
and company level. The list of top employers mentioned is not exhaustive. Each attribute has an individual relative rating band amongst the locations i.e., High, Medium or Low. Scale for each attribute has its own relative specific range based on the
Location Comparison Dashboard - Embedded Software Engineer: Draup analyzed over 50 Talent Hotspots across
India for the relevant talent pool and summarized the top 15 MSAs with their relevant talent metrics

MSA Talent Size Gender Diversity Median Base Pay (USD) Attrition Rate Growth Rate Hiring Difficulty Index* University Talent**

Bengaluru​ 6,250 19.2% 16,500 6% 8.2% 7.4, High 14,000

Hyderabad​ 2,750 18.0% 15,800 5% 9.2% 6.3, High 11,500

Chennai​ 1,850 17.0% 15,600 7% 9.3% 5.9, High 14,300

Pune​ 1,800 17.8% 15,400 5% 8.2% 5.8, High 8,800

NCR​ 1,300 17.5% 16,200 7% 10.8% 4.8, Medium 23,500

Coimbatore​ 1,250 16.0% 13,200 5% 9.6% 4, Medium 10,800

Mumbai​ 1,075 17.3% 15,300 5% 7.5% 3.1, Low 5,900

Ahmedabad​ 800 14.8% 14,300 4% 7.7% 3.4, Low 4,600

Trivandrum 200 14.2% 13,100 4% 6.3% 7.2, High 800

Kolkata​ 175 15.2% 15,000 5% 7.2% 5.2, Medium 5,700

Vadodara 190 16.0% 12,000 6% 6.2% 7, High 2,600

Mysuru 160 14.0% 13,000 6% 6.9% 2.4, Low 1,100

Visakhapatnam 140 12.2% 12,400 6% 7.6% 4.7, Medium 2,500

Jaipur 110 11.1% 12,900 6% 6.0% 5.6, Medium 2,500

Cochin​ 100 13.5% 13,800 5% 5.4% 3, Low 1,300

Locations Deep-dived Location Tier Classification Tier 1 Tier 2 Parameter Favorability Index High Medium Low
Note: *Hiring Difficulty is derived from taking the ratios of job postings to the talent employed currently at the MSA. Low value of hiring difficulty is considered as a favorable factor for the location. **The University Talent includes the
Fresh graduates from ECE, EEE, EIE, EME and other related electrical & electronics engineering courses; Each attribute has an individual relative rating band amongst the locations i.e., High, Medium or Low. Scale for each attribute has its
own relative specific range based on the distribution of data points. The represented data has been derived using DRAUP’s Proprietary Talent Database that tracks 750M+ professional profiles. Values have been rounded off.
Top Employers India - Embedded Software Engineer India: Honeywell has the highest installed talent pool of ~950
Embedded Engineers. Some of key the job titles for this company are Embedded Engineer, Advanced Embedded
Engineer, and Embedded Software Engineer
Installed
Top Employers Job Titles Workloads
Talent Size
• Work on programming and software development
• Embedded Engineer • Handle software applications management
900 – 950 • Advanced Embedded Engineer • Create instructional technical manuscripts
• Develop enterprise applications in JAVA
• Develop software with a direct interface to hardware including microcode, IP specific firmware, FPGA, and
DSPs
• UEFI Firmware Engineer
475 – 525 • Designs and implements the interfaces that abstract low-level hardware details from higher levels of
• Firmware Development Engineer
software and firmware, performing design and code reviews, as well as testing and validating product
implementations
• Embedded Software Developer • Plan and design software modules and developer test requirements
450 – 500 • Embedded Software Engineer • Analyze and enhance efficiency, stability, and scalability of system resources
• Linux Embedded Software Engineer • Integrate and validate new product designs
• Embedded Systems SW Development Engineer
• Understand and analyze the cyber security requirements from the customers and interact with customers for
390 – 440 • Embedded System Software Developer
collaboration work
• Automotive Embedded Developer
• Create and update SW module test specification
• Embedded Firmware Engineer
• Carry out test execution and error analysis
250 – 300 • Embedded Software Engineer
• Review test cases, test specifications, and test reports generated by peers and document the result n a
• Embedded/ C/ C++ Software Developer
formal verification report
• Embedded Engineer • Design, develop, code, test, and debug security-related software on Embedded platforms
230 – 280 • Engineer – Embedded Security Test Engineer • Develop software modules for proprietary or high-level operating systems
• Sr. Staff Engineer – Embedded Security Group • Develop software in C, Assembly, and Python to run on ARM, RISCV, and proprietary CPU platforms
• Designs methodology using OOAD & UML
• Embedded ASW Developer
• Responsible for leading the team supporting the system architect
170 – 220 • Embedded Developer, C++/QT
• Handles the Firmware Design, Development, Integration, and Testing of new functionalities, enhancements,
• Embedded Linux Developer
change requests, and bug fixes
• Work on programming and software development
• Embedded and System Software Lead
120 – 170 • Handle software applications management
• Create instructional technical manuscripts
Note: The represented data is derived from DRAUP’s Proprietary Talent Module. Draup has analyzed 750Mn+ talent profiles to derive the job roles
pertaining to the provided job functions and skillsets; Roles listed are not exhaustive.
Parameter Favorability Index High Medium Low
 India – University Ecosystem: Some of the top universities include the Indian Institute of Technology, Madras, and the
Indian Institute of Technology, Delhi, where ~368 and ~273 relevant engineers graduate annually

43,300+ 1.5 Mn+ 300,000+

Total Engineering colleges including 42,343
Total Engineering Graduates Total Relevant Graduates*
colleges and 1,043 Universities in India

Relevant Graduates* -
Top Universities** Degrees offered Fields of Expertise Enrollments Completions
Annually

Indian Institute of Bachelors, Doctorates,

Robotics, AI, Analytics, IoT 10,224 1,866 ~368
Technology, Madras Masters

Indian Institute of Bachelors, Doctorates, Analytics, Robotics, Edge

9,132 2,034 ~273
Technology, Delhi Masters Computing

Indian Institute of Bachelors, Doctorates,

Robotics, AI, Analytics, IoT 12,004 1,542 ~235
Technology, Bombay Masters

Indian Institute of
Bachelors, Doctorates, Robotics, Edge Computing,
Technology (Banaras Hindu 6,673 1,289 ~235
Masters Hardware Security
University), Varanasi

Indian Institute of Bachelors, Doctorates, Robotics, Analytics, Business

6,400 1,228 ~172
Technology, Kanpur Masters Intelligence

Indian Institute of Science, Bachelors, Doctorates, Robotics, AI, Analytics,

3,854 697 ~149
Bengaluru Masters Robotics

Note: *The Relevant Graduates includes the Fresh graduates from ECE, EEE, EIE, EME and other related electrical & electronics engineering courses;
**Draup’s University Hiring Module was analyzed for universities and relevant tech and digital courses. The courses mentioned are not exhaustive.
Parameter Favorability Index High Medium Low
Insights have been extracted from Draup’s ML model, which analyses weekly 2M+ publications Industry reports, and news articles.
Source: Draup Research; The represented graduate numbers are calculated for the year 2019 – 2020
 Talent Base Pay Analysis, Greater Bengaluru Area:

Product Companies Vs Service Provider Companies Median Base Pay Analysis

$60,000
$55,530
Median Salary (USD) per annum

$50,000
70-95 %tile
paying
companies
$40,000 $36,828 $35,804

$30,000
$25,705
$23,018

$20,000 $42,405 $17,600

$30,360
~16,500 USD 40-70 %tile
$25,245

paying
companies
$15,345

$10,000

$16,995
$10,560
$0
Paris Bucharest
Median Base Pay 95th Percentile Base Pay

0-5 years 5-10 years 10+ years 0-5 years 5-10 years 10+ years

Median Salary across Product & Service Provider Companies

Note: The represented data has been derived using DRAUP’s Salary Simulation Module
Greater Bengaluru Area – Deep Dive

Source: Draup

16

Source: Draup 16
 Greater Bengaluru Area - Talent Hotspot Analysis: Whitefield and Electronic City are the major hotspots with
presence of top employers such as Bosch, L&T, and Wipro. Top Universities such as Indian Institute of Science,
Ramaiah Institute of Technology, Bangalore University along with other renowned colleges are present in Mathikere

Greater Bengaluru Area, India

Top Employers
Ramaiah Institute
of Technology
Mathikere
Nagavara
Whitefield

L&T Technology Number of Student Enrolments & Major Universities in Bengaluru Area
Indiranagar Services
Bosch Indian Institute of Science
Intel Major Universities Student Count
Koramangala
Honeywell Marathahalli Relevant Graduates 44,500
Western Digital Computer Science /IT
30,000
Electronic City & related
Bangalore
University Electrical/
14,500
PES University Electronics & Related
Universities &
Colleges
Employers • With 85+ chip designing houses and ESDM (Electronic System Design & Manufacturing) skilled
resources available, the state is well set to innovate in the sector. Major players like Wistron,
~ 6,250 (6,000 – 6,500) Intel, Qualcomm, Nvidia and many other global leaders benefit from this ready ecosystem
Embedded Engineer Installed talent pool in Bengaluru • In order to position Karnataka as a global hub for Electronics System Design and
Median Tech Talent Gender Diversity Talent Growth Talent Experience Manufacturing (ESDM) and push further the vision of the National Policy on Electronics (NPE)
Source: Draup
Cost (in INR) Rate (y-o-y) Senior 22% 2019, three schemes namely the Production Linked Incentive Scheme (PLI), Scheme for
Medium 26%
16,500 USD 81% 19% 7.8%-8.2% Entry 52% Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS) and
Modified Electronics Manufacturing Clusters Scheme (EMC 2.0) were announced in 2020
Talent Exp Split
Major Hotspots Other Hotspot Entry Medium Senior • The state government envisages to create world-class infrastructure in the form of Centers of 17
(0-5 yrs) (5 – 10 years) (10+ years)
Excellence (CoEs) to promote research, innovation and entrepreneurship in the ESDM industry
Note: Draup’s proprietary talent module was used to analyse hotspots by locations. The Metropolitan Statistical area (MSA) is considered for the analysis. Source: Draup 17
University graduates with relevant Computer Science, Electronics & Communications, and other related degrees are considered. The list of employers and universities is not exhaustive.
Top employers - Embedded Software Engineer, Bengaluru: Honeywell has the highest installed talent pool for the
embedded engineer/developer with a headcount of ~417 followed by Bosch (~320) and Intel (~300). Some of the
major titles are Embedded System Software Developer and Embedded QA Engineer

Installed
Top Employers Job Titles Workloads
Talent Pool
• Work on programming and software development
• Advanced Embedded Engineer • Develop firmware for embedded products
400 - 450
• Embedded Engr I • Designing test systems and executing functional / system tests on different EPKS releases
• Creation of instructional technical manuscripts

• Embedded Systems SW Development Engineer • Analyse the cyber security requirements from the customers and interact with customers for
300 - 350 • Embedded System Software Developer collaboration work
• Automotive Embedded Engineer • Design program in 'C' and autostart and assembly for real-time embedded systems
• Embedded Engineer • Develop and manage software applications

• Embedded Engineer • Design, develop, code, test, and debug security-related software on Embedded platforms
280 - 320 • Embedded Software Developer • Develop software modules for proprietary or high-level operating systems
• Develop and validate functionality in a complex system level environment

• Embedded Engineer • Design, Code, and Verification of Artifacts

220 - 270 • Embedded Software Engineer • Handle DO-178B processes and standards Expertise using Vector Cast
• Embedded QA Engineer • Design black box and white box test cases with the module test environment Vector Cast

• Develop firmware using C/C++ in multiple environments using the latest standards
• Embedded Firmware Engineer
• Design, implement, and debug firmware for the next generation of SSDs
200 - 250 • Embedded Software Engineer
• Design and implement HW Interface drivers and algorithm
• Embedded C/ C++ Software Developer
• Develop characterization and evaluation programs for new products
• Support failure analysis on test systems

• Design Embedded software in C

• Embedded Software Engineer
• Designing, coding, maintaining and documenting software for automotive ECUs
100 - 150 • Embedded Engineer
• Performing various tests as per process, debugging, and fixing the developed automotive software
• Embedded Software Engineer/Lead
• Analyse, monitor, and improve efficiency, and stability of the software/system

Note: The represented data is derived from DRAUP’s Proprietary Talent Module. Draup has analyzed 750Mn+ talent profiles to derive the job Parameter Favorability Index High Medium Low
roles pertaining to the provided job functions and skillsets; Roles listed are not exhaustive.
Brand Building Strategies and Challenges, Bengaluru: Top employers with significantly low attrition rates employ talent
attraction Strategies like providing Stock options, strong University tie-ups with multi-faceted L&D opportunities to
maintain a steady talent inflow and employee strength

Favorable Location Factors & Talent Attraction Strategies Unfavourable Location Factors & Employee Retention Challenges
Huge Government Initiatives in the Region Relatively High Traffic Connectivity Issues
The govt of India has identified Bangalore as the emerging Electronic hub in the Bangalore has the sixth-highest traffic issues in the world and second in
country and has declared to have global electronics companies invest more than US$ the country. The traffic makes it difficult for talent to move to and from the
3 Billion in Bangalore. Californian product engineering company INVECAS has planned key semiconductor industry areas within the city
to invest between $15-20 million for the setup of design centres in Bangalore

Incubator & Innovation Labs

Organizations like Arm, AMD, Nvidia and Qualcomm have set up Incubator Program Cost of Living
that hosts competitions every year, in collaboration with local Start-up incubators like
Bangalore has a comparatively higher cost of living with respect to other
Semiconductor Fabless Accelerator Lab (SFAL), to grow their talent base
cities in India. This is due to the cost of travel from one part of the city to
Positive Environmental Conditions another and also due to the large sum of deposit money essential when
With a steady flow of the Arabian sea branch of winds and with an altitude of renting apartments in the city
900mts from sea level it has pleasant weather all year round. This is a key
contributor to high efficiency amongst employees and leads to improved task Compensation Dissatisfaction
completion quality and time Companies with high attrition pay about 37% less as
compared to their peer organizations. Employees often
Additional Benefits on Compensation move to organizations like Qualcomm and Nvidia that have
AMD and Qualcomm provide Employee Stock Options to their a better pay scale for a Hardware Engineering job function
employees after they are 2 years old in the company. Other benefits
Include: Insurance plans and Tuition Reimbursement
Cosmopolitan Culture Market Competition
The city has a fast-paced lifestyle which attracts young talent. Bangalore hosts a diverse The electronic cluster in Bangalore is highly dense, which is a major contributing
cultural mix of talent from across India, becoming the leading growth hub in the country Source: companies.
factor for young talent switching Draup This results in high attrition rates and
also affects the implementation of a steady growth structure for an individual
University Tie-ups employee within the company
Leading semiconductor companies like Qualcomm, Nvidia and Mentor Graphics allow
the winners of their Incubator Program to work at the company. Synopsys, Qualcomm, 19
STMicroelectronics, Mentor Graphics and Samsung Electronics have placement ties with
VIT, Vellore and IISc Bangalore
Source: Draup 19
Note: Draup analyses 30,000+ recent articles, announcements, annual reports and news publications periodically to identify and track the above factors at MSA level
Greater Hyderabad Area – Deep Dive

20
 Greater Hyderabad Area – Key Talent Hotspots: Greater Hyderabad area hosts top employers such as Honeywell,
TCS, Qualcomm, and HCL. JNTUH, BITS Pilani Hyderabad Campus, IIT Hyderabad, and CVR College of Engineering are
some of the top universities with a high supply of relevant talent pool

Greater Hyderabad Area, India – Hotspots Top Employers

Ramachandrapuram

Kukatpally
Number of Student Enrolments & Major Universities in Hyderabad Area
Chanda Nagar JNTUH BVRIT
Major Universities Student Count
Moosapet BITS
Kondapur Hyderabad
Serilingampally Engineering Graduates 39,100
TCS Micron
Cyient Honeywell Secunderabad Zone Computer Science /IT &
Gachibowli 27,600
related
Qualcomm Madhapur
Financial District Electrical/
Electronics & Related 11,500
HITEC City Universities &
Employers
Colleges

~ 2,750 (2,500 – 3,000) • State Government has focused on skill development training for youth in ESDM (Electronic System
Design and Manufacturing) through Telangana Academy for Skill and Knowledge (TASK). Around
Embedded Engineer Installed talent pool in Hyderabad
60,000 persons from the State got trained in ESDM, and half of them obtained placement in several
Median Tech Talent Gender Diversity Talent Growth Talent Experience companies
Cost (in INR) Rate (y-o-y) Senior 19%
Medium 26% • The Government has further announced plans to invest Rs 60,000 Cr in the ICT sector for SEZ and is
15,800 USD 82% 18% 8.2%-9.2% Entry 55% making efforts to establish a skill development and training center in Ranga Reddy district
Talent Exp Split • Several Top semiconductor & product companies such as Micron Technology, Moschip, and others
Major Hotspots Other Hotspot Entry Medium Senior have reportedly decided to keep Hyderabad as their top priority location for expansion in Silicon
(0-5 yrs) (5 – 10 years) (10+ years) Design Areas
Note: Draup’s proprietary talent module was used to analyse hotspots by locations. The Metropolitan Statistical
area (MSA) is considered for the analysis.University graduates with relevant Computer Science, Electronics &
Communications, and other related degrees are considered. The list of employers, universities is not exhaustive.
Top employers - Embedded Software Engineer, Hyderabad: Honeywell has the highest installed talent pool for the
Embedded Software Engineer with a headcount of ~175 followed by TCS (~110) and Qualcomm (~100). Some of the
major titles are Embedded C/C++ SW Developer, Embedded System Software Developer, and Embedded QA Engineer

Installed
Top Employers Job Titles Workloads
Talent Size
• Work on programming and software development
• Embedded Engineer • Handle software applications management
150 – 200 • Advanced Embedded Engineer • Create instructional technical manuscripts
• Develop enterprise applications in JAVA

• Embedded Systems SW Development Engineer

• Understand and analyze the cyber security requirements from the customers and interact with
80 – 130 • Embedded System Software Developer
customers for collaboration work
• Automotive Embedded Developer

• Embedded Engineer • Design, develop, code, test, and debug security-related software on Embedded platforms
75 – 125 • Engineer – Embedded Security Test Engineer • Develop software modules for proprietary or high-level operating systems
• Sr. Staff Engineer – Embedded Security Group • Develop software in C, Assembly, Python to run on ARM, RISCV and proprietary CPU platforms

• Carry out Embedded-C and MISRA-C coding and testing for microcontroller-based embedded systems
• Embedded Engineer
• Design, develop, and support framework for test infrastructure and design and write test automation
70 – 90 • Autosar/ Embedded Senior Engineer
scripts for existing and new automation test suites
• Embedded QA Engineer
• Detect, investigate, document and report the bugs in detail

• Create, and update SW module test specification

• Embedded Firmware Engineer • Carry out test execution and error analysis
60 – 80 • Embedded Software Engineer • Review test cases, test specifications and test reports generated by peers and document the result n a
• Embedded/ C/ C++ Software Developer formal verification report
• Design black box and white box test cases with the module test environment Vector Cast

• Develop embedded and interface software, provide input to schematic design, review PCB layouts,
prototyping circuits, debug analog and digital hardware, automating testing, develop user libraries to
• Embedded Software Engineer
20 – 30 • Embedded Systems Design Engineer
control hardware
• Code primarily in C, C++ and Python under Linux for various microcontrollers and computing modules
acting as the interface to custom hardware

Parameter Favorability Index High Medium Low

Note: The represented data is derived from DRAUP’s Proprietary Talent Module. Draup has analyzed 750Mn+ talent profiles to derive the job roles pertaining to the provided job functions and skillsets; Roles listed are not exhaustive.
Each attribute has an individual relative rating band amongst the employers i.e., High, Medium or Low. Scale for each attribute has its own relative specific range based on the distribution of data points
 Talent Base Pay Analysis – Greater Hyderabad Area

Product Companies Vs Service Provider Companies Median Base Pay Analysis

$60,000
$55,000
Median Salary (USD) per annum

$50,000
70-95 %tile
paying
companies
$40,000 $37,200
$34,200

$30,000
$24,200
$22,500
$20,000 $42,000
$17,000
40-70 %tile

$29,000
~15,800 USD
$25,500

paying
$10,000 companies
$15,000

$16,000
$10,200
$0
Product Companies Service Provider Companies
Median Base Pay 95th Percentile Base Pay

0-5 years 5-10 years 10+ years 0-5 years 5-10 years 10+ years

Median Salary across Product & Service Provider Companies

Note: The represented data has been derived using DRAUP’s Salary Simulation Module
Brand Building Strategies and Challenges, Hyderabad: Top employers are setting up incubation centres in Hyderabad in
collaboration with leading Universities in the area to attract qualified talent; the state government has launched
initiatives to increase the semiconductor footprint in Hyderabad

Favorable Location Factors & Talent Attraction Strategies Unfavourable Location Factors & Employee Retention Challenges

Huge Government Investments in the Region Lack of skilled Talent

The government of Telangana has planned to launch T works, India’s largest prototyping The quality of university graduates in Hyderabad is lower than in other relevant
centre, in Hyderabad to act as a prototyping centre for semiconductors. Tata group Indian cities. It makes the cost of hiring low but results in higher unproductive
looking into the possibility of establishing a semiconductor assembly unit in Hyderabad, time as training and development of talent takes more time than usual
with an investment of $300 million, creating more than 4,000 jobs. Micron Technology
plans to increase its footprint in the city by 2023 as well

Cultural Bias and political instability

Increase in Incubator & Innovation Labs Hyderabad is the capital of the recently created state of Telangana. This makes
NXP India announced the launch of the first ‘Semiconductor Startup Incubation and the city the centre of all political movements. The local population in
Acceleration Program’ in collaboration with the Ministry of Electronics and Information Hyderabad regularly shows dissatisfaction with inter-cultural mingling, which is
Technology (MeitY) and Fabless Chip Design Incubator (FabCI), IIT-Hyderabad. They plan also a cause for civil uprights for reservations incorporates Hyderabad’s local
to hire new talent through this program talent

Compensation Dissatisfaction
Companies with high attrition pay about 43% less
Low Pollution and Traffic Levels
compared to their peer organizations. Employees often
Hyderabad has the lowest pollution levels amongst the peer cities semiconductor
move to organizations like Xilinx, which has a better pay
hubs in India. It makes easier for people to settle in and stay in the city. The cost of
scale for a Hardware Engineering job function
transportation is also nominal compared to peer cities, and traffic is limited to peak
hours only

Intermittent Electricity Supply and the high cost of Alternate power

Ever-increasing University Tie-ups Power cuts are regular in Hyderabad, as the Telangana government is still
NXP shall hire the winners of their Incubator Program to work at the setting up long-term power solutions in the capital city. Alternative sources of
company. Synopsys, Xilinx, and Nvidia have placement ties with IIT power like diesel/petrol powered generators or Solar power are a huge
Hyderabad and BV Raju Institute of Technology investment

Note: Draup analyses 30,000+ recent articles, announcements, annual reports and news publications periodically to identify and track the above factors at MSA level
Greater Chennai Area – Deep Dive

Source: Draup

25

Source: Draup 25
Greater Chennai Area - Talent Hotspot Analysis: Sholinganallur and Guindy are the major hotspots with the presence
of top employers such as HCL, TCS etc. Top Universities such as VELS Institute of Science & Technology, Chennai
Institute of Technology along with other renowned colleges are present in the Kancheepuram area

Greater Chennai Area, India Top Employers

Anna Nagar

HCL Visteon

Anna University
Manapakkam TCS
Guindy
Qualcomm Number of Student Enrolments & Major Universities in Chennai Area
VELS Institute of Science Tharamani Major Universities Student Count
& Technology
Chennai Institute Relevant Graduates 40,200
of Technology
Palavakkam Computer Science /IT
IIT Madras 27,800
& related
L&T Technology
Kancheepuram District Sholinganallur Electrical/
14,300
Electronics & Related
Universities &
Colleges Employers
• Chennai is a part of 3 important Industrial Corridors of Government of India -Chennai–
Bangalore Industrial Corridor , Chennai–Kanyakumari Industrial Corridor and Visakhapatnam–
~ 1,850 (1,700 – 2,000) Chennai Industrial Corridor
Embedded Engineer Installed talent pool in Bengaluru
• Electronics Corporation of Tamil Nadu Limited (ELCOT) has created 8 IT/ ITES Special
Median Tech Talent Gender Diversity Talent Growth Talent Experience Source:
Economic Zones in Chennai, Coimbatore, Madurai Draup Trichy, Salem, Tirunelveli and
(2 places),
Cost (in INR) Rate (y-o-y) Senior 13%
Medium 29% Hosur
15,600 USD 83% 17% 8.3%-9.3% Entry 58%
• Investment Conducive Policies & creation of Special Economic Zones (SEZs) in Chennai has led
Talent Exp Split to the transformation of Chennai into a manufacturing and Oil & Energy hub, boasting top
Major Hotspots Minor Hotspots 26
Entry Medium Senior relevant talent in the areas of manufacturing & mechanical engineering
(0-5 yrs) (5 – 10 years) (10+ years)

Source: Draup
Note: Draup’s proprietary talent module was used to analyse hotspots by locations. The Metropolitan Statistical area (MSA) is considered for the analysis. University graduates with relevant Computer Science, Electronics & Communications, and 26
other related degrees are considered. The list of employers and universities is not exhaustive.
Top employers - Embedded Software Engineer, Chennai: TCS has the highest installed talent pool for the Embedded
Software Engineer with a headcount of ~185 followed by Visteon (~170) and HCL (~120). Some of the major titles are
Embedded Engineer, Advanced Embedded Engineer, and Embedded Software Developer

Installed
Top Employers Job Titles Workloads
Talent Pool
• Design and implement software for Embedded Devices and systems
• Embedded Engineer
• Design, develop, & validate existing and next-generation automotive cellular connectivity using high-
160 - 210 • Advanced Embedded Engineer
level languages such as Java, C, and C++ Develop JSON, and BSON
• Junior Embedded Developer
• Design, develop, code, test, and debug system

• Senior Embedded Software Engineer

150 – 200 • Senior Embedded Design engineer • Develop embedded software for high-end instrument clusters in C/C++/embedded automotive domain
• Development GUI on Linux system

• Embedded Developer • Design and Develop software embedded system

100 - 150
• Senior Software Engineer • Resolves complex software issues and bugs

• Carry out Embedded-C and MISRA-C coding and testing

• Sr. Embedded Engineer • Create firmware systems with efficiency, modularity, extensibility, and robustness
60 – 110 • Embedded Engineer • Design, develop and test avionics firmware that will support the functions of our launch vehicles and test
• Embedded Software Development Engineer systems.
• Debug firmware and firmware code

• Analyse requirements, design, develop and test code using C/C on embedded development environment
/ IDEs
55 – 105 • Senior Embedded System Engineer
• Carry out bug fixing and improving performance
• Software Developer - Embedded System
• Support hardware design and prototype fabrication
• Implement performance and quality modules

• Design and development of Embedded Controller Software

• Embedded, Engineer • Responsible for driving the development of software modules from requirements definition to release
50 – 100
• Embedded Software Developer stage
• Resolve and fix the bug

Note: The represented data is derived from DRAUP’s Proprietary Talent Module. Draup has analyzed 750Mn+ talent profiles to derive the job roles
pertaining to the provided job functions and skillsets; Roles listed are not exhaustive. Parameter Favorability Index High Medium Low
 Talent Base Pay Analysis, Greater Chennai Area

Product Companies Vs Service Provider Companies Median Base Pay Analysis

$60,000

$51,051
Median Salary (USD) per annum

$50,000
70-95 %tile
paying
companies
$40,000
$34,569
$32,994

$30,000
$23,817
$21,785
$20,000 $38,984
$16,307
40-70 %tile

$27,977
~15,600 USD
$23,696

paying
$10,000 companies
$14,524

$15,747
$9,784
$0
Product Companies Service Provider Companies
Median Base Pay 95th Percentile Base Pay

0-5 years 5-10 years 10+ years 0-5 years 5-10 years 10+ years

Median Salary across Product & Service Provider Companies

Note: The represented data has been derived using DRAUP’s Salary Simulation Module
Brand Building Challenges and Strategies, Chennai : Top employers with significantly low attrition rates employ talent
attraction Strategies like providing Stock options, hiring employees from the diverse cultural backgrounds and strong
University tie-ups to maintain a steady talent inflow and employee strength

Talent Attraction Strategies Challenges Faced in Employee Retention

Additional Benefits on Compensation Compensation Dissatisfaction

Companies like Qualcomm provide Employee Stock Options to their Companies with high attrition pay about 30% less as
employees after they are 2 years old in the company. Other benefits may compared to their peer organizations. Employees
Include: Insurance plans, Tuition Reimbursement, Work from Home often move to organizations like Qualcomm that has a
allowance better pay scale for a Hardware Engineering job
function
Employee Diversification
Top employers in Chennai hire talent from across borders of Chennai in order
to allow cross-cultural interaction and unbiased growth within the organization Lack of Cosmopolitan Culture
Chennai has a comparatively slow lifestyle. Society norms are more
family-oriented which leads to lesser options for the younger batch of
Strong Employee Referral Program employees to stay in the city long term
Employees that are satisfied with the company dynamics tend to
refer to the organization as an excellent workplace. Having a well-
structured referral program to allow the easy intake of talent works
in favour of the company Cultural Bias
Employees look for equal opportunity and open communication they
work for an organization. Companies in Chennai run a risk of being
Incubator & Innovation Labs heavier on the culturally biased side where management and peer
Organizations like Qualcomm have set up Incubator Program that groups prefer the local employee group over migrated folk from
hosts competitions every year, increasing their talent base. culturally varied areas
Qualcomm’s program is called Design in India Challenge which gives
hardware Start-ups a chance to innovate new hardware product
designs
Limited R&D and Training
Source: Draup
Employees look for organizations that provide a state-of-the-
University Tie-ups art Training facility and R&D opportunities, without which
Universities in greater Chennai and nearby Catchment areas allow either they do not have enough on-job knowledge to
industry tie-ups to foster internships and training programs for their complete tasks or do not get the chance of a diverse
students. Qualcomm allows the winners of their Incubator Program to growth 29
work at the company. Microchip and HCL have placement ties with IIT
Madras and VIT, Vellore respectively
Source: Draup 29
Note: Draup analyses 30,000+ recent articles, announcements, annual reports and news publications periodically to identify and track the above factors at MSA level
 Talent Base Pay Analysis, Greater Pune Area

Product Companies Vs Service Provider Companies Median Base Pay Analysis

$60,000

$50,418
Median Salary (USD) per annum

$50,000
70-95 %tile
paying
companies
$40,000
$33,742
$30,212
$30,000
$23,249
$20,861
$20,000 $38,501
$15,615 40-70 %tile

$25,619
~15,400 USD paying
$23,130

$10,000 companies
$13,907

$15,371
$9,369
$0
Product Companies Service Provider Companies
Median Base Pay 95th Percentile Base Pay

0-5 years 5-10 years 10+ years 0-5 years 5-10 years 10+ years

Median Salary across Product & Service Provider Companies

Note: The represented data has been derived using DRAUP’s Salary Simulation Module
Greater Pune Area – Deep Dive

Source: Draup

31

Source: Draup 31
 Greater Pune Area - Key Talent Hotspots: TCS, Eaton, and einfochip are the top companies employing a large talent
pool across the analysed job role in Pune. Symbiosis Institute of Technology, Dr. D.Y Patil College of Engineering, and
College of Engineering, Pune (COEP) are some of the top universities supplies high relevant talent pool

Greater Pune Area, India – Hotspots Top Employers

Hinjewadi

Viman Nagar
Yerwada
Dr. D Y Patil College Number of Student Enrolments & Major Universities in Coimbatore Area
TCS of Engineering
Eaton Major Universities Student Count
COET Kalyani Nagar
Wipro Engineering Graduates 29,990
KPIT
Computer Science /IT &
21,170
Shivaji Nagar related
HCL
Hadapsar
Electrical/
8,800
Electronics & Related
eInfochips Universities &
Employers
Colleges • Software Technology Parks of India (STPI), an autonomous society under the Ministry of
~ 1,800 (1,700 – 1,900) Electronics and Information Technology Pune has played a very important role to promote
the region as a preferred IT destination and act as a single window agency for the IT/ITeS
Embedded Engineer Installed talent pool in Pune
industry by putting new milestones in IT exports of the state
Median Tech Talent Gender Diversity Talent Growth Talent Experience
Cost (in INR) Rate (y-o-y) Senior 11% • The STPI society in FY 2020-21 registered units under STPI-Pune jurisdiction contributed Rs.
Medium 31% 96,861.85 IT/ITeS/ESDM exports
15,400 USD 82% 18% 7.8%-8.2% Entry 58%
• MCCIA had initiated a Special Purpose Vehicle (SPV) to promote the development of EMC
Talent Exp Split
by setting up a Common Facility Centre (CFC) in Pune. This CFC will help the electronics
Major Hotspots Other Hotspot Entry Medium Senior
(0-5 yrs) (5 – 10 years) (10+ years) industries in Pune and surrounding areas in terms of the latest technology, cost
Note: Draup’s proprietary talent module was used to analyse hotspots by locations. The Metropolitan Statistical competitiveness, and others which enabled the Pune region to become a preferred
area (MSA) is considered for the analysis.University graduates with relevant Computer Science, Electronics & destination for electronics design-led manufacturing
Communications, and other related degrees are considered. The list of employers, universities is not exhaustive.
 Top employers - Embedded Software Engineer, Greater Pune Area: KPIT has the highest installed talent pool for the
Embedded Software Engineer with a headcount of ~85 followed by TCS (~70) and Onward Technology (~65). Some of
the major titles are Sr. Embedded Engineer, Embedded Software Developer, and Embedded Engineer

Installed
Top Employers Job Titles Workloads
Talent Pool

• Embedded Engineer Lead • Developing embedded applications in C++

80 - 130 • Embedded Software Engineer • Designing/Modeling using UML Diagrams
• Performing unit testing

• Embedded Lead Engineer • Analyse the cyber security requirements of the customer
70 - 120 • Engineer- Embedded Development • Design document preparation for the Security requirement implementation
• Embedded software developer • Software development for implementing the security requirements compliant with the Standard
Process

• Senior Software Engineer • Create and execute the performance test script
50 - 100 • Embedded Engineer • Performance test environment, framework, and execution

• Design and develop software embedded module

• Senior Software Engineer - Automotive Embedded • Carry out bug fixing and improve the overall performance
40 - 60
• Embedded Developer • Carry out test execution and error analysis

• Advanced Embedded Engineer • Design Embedded software in C

35 - 45
• Embedded Software Engineer • Analyse, monitor, and improve efficiency, and stability of the software/system

• Senior Embedded Engineer • Handle the Embedded Linux BSP (Board Support Package) on embedded platforms
25 - 35
• Embedded Software Engineer • Design, Develop and Review debugging system

Note: The represented data is derived from DRAUP’s Proprietary Talent Module. Draup has analyzed 750Mn+ talent profiles to derive the job roles
pertaining to the provided job functions and skillsets; Roles listed are not exhaustive.
Parameter Favorability Index High Medium Low
Brand Building Strategies and Challenges, Pune: Top employers are setting up incubation centres in Pune in collaboration
with leading Universities in the area to attract qualified talent; The Government introduced a cluster located in Pimpri
Industrial Area and offered facilities and support for Existing Units to help the local electronics industry in the value chain
Favorable Location Factors & Talent Attraction Unfavourable Location Factors & Employee
Strategies Retention Challenges

Huge Government Investments in the Region Cultural Bias and political instability
Maharashtra’s Electronics sector, including telecommunications, equipment, In Pune, due to major disruption in governing body, there may be
electronic components, industrial electronics, and consumer electronics, tectonic changes in business implementations. This makes the city a
contributes about 31 percent of India’s total electronics industry output. The State focal point for major political movements. The local population in
Government started promoting large-scale manufacturing in the ESDM sector and Pune regularly shows dissatisfaction with inter-cultural mingling,
provided a capital investment subsidy of 20 percent in special economic zones and which is also a cause for civil uprights for reservations incorporates
25 percent in other areas for the period of 10 years Pune’s local talent

Increase in Incubator & Innovation Labs Market Competition

Scitech Park’s main objective is to support innovative technology-based startup The electronic cluster in Pune is highly dense, which is a major
companies in the areas of IT/ITES, Electronics & Telecommunications, and contributing factor for young talent switching companies. It results
others. They have instituted total of 29 incubators including ITeS and Electronics in high attrition rates and also affects the implementation of a
& Telecommunications steady growth structure for an individual employee within the
company

Low Pollution and Traffic Levels Compensation Dissatisfaction

Pune has the lowest pollution levels amongst the peer cities semiconductor Over 55% of employees in Pune changed jobs for better pay and
hubs in India. It makes easier for people to settle in and stay in the city. The ~24% for better career opportunities. Also, the Attrition rate is
cost of transportation is also higher compared to other major cities, and traffic higher among younger professionals as they seek opportunities in
is higher because of its congested roads other major cities such as Bangalore, Delhi, and Mumbai

Lack of skilled Talent

Ever-increasing University Tie-ups The quality of university graduates in Pune is lower than in other
Qualcomm allows the winners of their Incubator Program to relevant Indian cities. It makes the cost of hiring low but results in
work at the company. Eaton and TCS have placement ties with higher unproductive time as training and development of talent
Symbiosis Institute of Technology takes more time than usual

Note: Draup analyses 30,000+ recent articles, announcements, annual reports and news publications periodically to identify and track the above factors at MSA level
National Capital Region, India– Deep Dive

Source: Draup

35

Source: Draup 35
 National Capital Region, India - Key Talent Hotspots: Greater Delhi area hosts top employers such as Ciena, VVDN
Technologies, HCL and NXP; IIT Delhi, NSIT Delhi, DTU and NIT Delhi are some of the top universities with a high
supply of relevant talent pool

National Capital Region, India Top Employers

Delhi

Delhi Technological
University
Ghaziabad

AMD Number of Student Enrolments & Major Universities in Delhi NCR Area
Southwest
Delhi New Delhi Noida Greater
Major Universities Student Count
NSUT, Delhi BVCOE, Delhi Southeast Noida
Delhi
Relevant Graduates 51,500
IIID, Delhi VVDN
L& T TS
NXP Computer Science /IT
Qualcomm IIT, 28,000
Delhi South Delhi
& related
Gurugram
Ciena
Electrical/
Honeywell 23,500
Universities & Electronics & Related
Colleges Employers

• To position India as a global hub for Electronics System Design and Manufacturing (ESDM)
~ 1,300 (1,200 – 1,400) and push further the vision of the National Policy on Electronics (NPE) 2019, three schemes
Embedded SoftwareEngineer Installed talent pool in Bengaluru
namely the Production Linked Incentive Scheme (PLI), Scheme for Promotion of
Median Tech Talent Gender Diversity Talent Growth Talent Experience Manufacturing of Electronic Components and Semiconductors (SPECS) and Modified
Cost (in INR) Rate (y-o-y) Source:
Senior
Medium
11%
31%
Electronics Manufacturing Clusters Scheme (EMCDraup
2.0) were announced in 2020
16,200 USD 82.5% 17.5% 9.8%-10.8% Entry 57%
• The state government envisages creating world-class infrastructure in the form of Centers of
Talent Exp Split
Excellence (CoEs) to promote research, innovation and entrepreneurship in the ESDM
Entry Medium Senior
(Electronic System Design and Manufacturing) industry 36
Major Hotspots Minor Hotspots (0-5 yrs) (5 – 10 years) (10+ years)

Note: Draup’s proprietary talent module was used to analyse hotspots by locations. The Metropolitan Statistical area (MSA) is considered for the analysis. Source: Draup
University graduates with relevant Computer Science, Electronics & Communications, and other related degrees are considered. The list of employers and universities is not exhaustive.
36
Top employers - Embedded Software Engineer – NCR, India: Ciena has the highest installed talent pool for the
Embedded Software Engineer with a headcount of ~175 followed by VVDN (~130) and Landis+Gyr (~95). Some of the
major titles are Embedded System Developer, Embedded System Software Developer, and Embedded QA Engineer

Installed
Top Employers Job Titles Workloads
Talent Pool

• Develop test plan, review the plan with design and execute the test cases on corresponding releases
150 – 200 • Embedded Software Engineer
• Design and develop middleware software for real-time platforms across processors architectures and
• Advanced Embedded Engineer
RTOS, with a focus on Linux

• Design and Develop software embedded module

100 – 150 • Embedded Engineer
• Debug firmware and firmware code
• Sr Embedded Engineer
• Carry out bug fixing and improve the overall performance

• Embedded Engineer • Handle Embedded RTOS application development on embedded platforms

70 – 120 • Senior Embedded Firmware Engineer • Develop codes for utilizing various hardware and capabilities built into a microcontroller
• Embedded QA Engineer • Review, revise, update, refactor and debug code

• Embedded System Developer • Develop embedded firmware for traction motor drives and other power electronics applications
30 – 40
• Embedded Software Engineer • Design and implement protection algorithms, system diagnostics/prognostics

• Create software embedded module

20 – 30 • Embedded Software Engineer
• Carry out test execution and error analysis
• Embedded Engineer
• Design, Develop and Review debugging system

• Automotive Embedded Engineer • Design and Develop Automotive Embedded System

20 - 30
• Software Engineer - Firmware • Design the firmware development and execute the test cases

Note: The represented data is derived from DRAUP’s Proprietary Talent Module. Draup has analyzed 750Mn+ talent profiles to derive the job roles
pertaining to the provided job functions and skillsets; Roles listed are not exhaustive. Parameter Favorability Index High Medium Low
Talent Base Pay Analysis - National Capital Region, India

Product Companies Vs Service Provider Companies Median Base Pay Analysis

$60,000
$54,605
Median Salary (USD) per annum

$50,000
70-95 %tile
paying
companies
$40,000
$35,796 $34,801

$30,000
$25,228
$22,373
$20,000 $41,699 $16,573

$29,510
40-70 %tile
~16,200 USD
$24,538

paying

$16,680
$10,000 companies
$14,915

$9,944
$0
Product Companies Service Provider Companies
Median Base Pay 95th Percentile Base Pay

0-5 years 5-10 years 10+ years 0-5 years 5-10 years 10+ years

Median Salary across Product & Service Provider Companies

Note: The represented data has been derived using DRAUP’s Salary Simulation Module
Brand Building Strategies and Challenges, Delhi: Top employers with significantly low attrition rates employ talent attraction
Strategies like providing Stock options, hiring employees from diverse cultural background and strong University tie-ups to
maintain a steady talent inflow and employee strength

Favorable Location Factors & Talent Attraction Strategies Unfavourable Location Factors & Employee Retention Challenges
Huge Government Investments in the Region
The new UP Electronics manufacturing Policy (2020) provides several incentives for
Relatively High Crime Rate Index
engineering set-up and aims to attract foreign investment of $5.25 billion to the Delhi-NCR region rates low on crime rate index and in 2020 Delhi's
state and generate employment for 400,000 people. The govt has also plans to finish crime rate was 4.1 times higher than the national average
the Asia's largest international airport in the Noida (Jhewar) region in the next 2
years to improve global connectivity

Mature Electronics SEZ Cluster Environmental Factors

Noida and Greater Noida are the new emerging Special Economic Zone in the greater Delhi NCR generally has a high AQI which is
Delhi Area for Electronic and Hardware design companies. 60% of Indian mobile unhealthy for inhabitants. Employees who have the
manufacturing is driven from this region and companies such as Lg, Oppo, Samsung option to move to other cities prefer doing so, so as
have huge presence in the region Tech giants such as Microsoft and Samsung have to maintain a healthy lifestyle
been expanding their R&D teams in Noida-Greater Noida Area

Incubator & Innovation Labs Compensation Dissatisfaction

Organizations like Qualcomm and Samsung have set up Incubator Program that Companies with high attrition pay about 30% less as
host competitions every year, increasing their talent base. Qualcomm’s program is compared to their peer organizations. Employees
called Design in India Challenge which gives hardware Start-ups a chance to often move to organizations like Qualcomm that has a
innovate new hardware product designs better pay scale for a Hardware Engineering job
Additional Benefits on Compensation function
Companies like Qualcomm provide Employee Stock Options to their
employees after they are 2 years old in the company. Other benefits
Include : Insurance plans, Tuition Reimbursement, Work from Home
allowance
Lack of Structured Career
Source: Growth
Draup
In employers such as NXP and STM employees
University Tie-ups have reported negative sentiment for long term
Qualcomm allows the winners of their Incubator Program to work at career development due to limited progression/
the company. STMicroelectronics & Texas Instruments have promotions opportunities 39
placement ties with NIT Delhi and IIT Delhi respectively

Source: Draup 39
Note: Draup analyses 30,000+ recent articles, announcements, annual reports and news publications periodically to identify and track the above factors at MSA level
Greater Coimbatore Area – Deep Dive

40
 Greater Coimbatore Area - Key Talent Hotspots: Bosch, VVDN Technologies, and UST are the top companies
employing a large talent pool across the analysed job role in Coimbatore. Amrita, PSG College of Technology, and
Government College of Technology are some of the top universities that produce a highly relevant talent pool

Coimbatore Area, India – Hotspots Top Employers

Chil SEZ

Number of Student Enrolments & Major Universities in Coimbatore Area

Major Universities Student Count

Tidel Park Engineering Graduates 31,050

Hanudev Computer Science /IT &
Hanudev Info Park 20,250
Info Park
related
Rathinam Tech Park
Electrical/
10,800
Electronics & Related
Universities & Employers
Colleges
• State Government accorded 40 operational SEZs, out of which 18+ SEZs are the IT/ITeS
~ 1,250 (1,000 – 1,500) sector-specific SEZs in Tamil Nadu. The Government IT department has also accorded
Embedded Engineer Installed talent pool in Coimbatore administrative sanction and approval for establishing a warehouse for start-ups in
Median Tech Talent Talent Growth
Coimbatore (Tier II) area, apart from Chennai and a start-up warehouse board
Gender Diversity Talent Experience
Cost (in INR) Rate (y-o-y) Senior 11% • The Government has instituted the ICT Academy of Tamil Nadu (ICTACT). Its prime focus is to
Medium 31%
13,200 USD 82% 16% 8.6%-9.6% Entry 58%
improve the quality & skill development of students graduating from various institutions
and make them employable in the ICT sector
Talent Exp Split
Entry Medium Senior
• Several Top product companies such as VVDN, Bosch, and others have reportedly decided
Major Hotspots Other Hotspot
(0-5 yrs) (5 – 10 years) (10+ years) to keep Coimbatore as their top priority location for expansion in Electronic System Design &
Note: Draup’s proprietary talent module was used to analyse hotspots by locations. The Metropolitan Statistical Manufacturing Areas
area (MSA) is considered for the analysis.University graduates with relevant Computer Science, Electronics &
Communications, and other related degrees are considered. The list of employers, universities is not exhaustive.
 Top employers - Embedded Software Engineer, Coimbatore: Bosch leads with a head count of ~150, followed by VVDN
(~75) and UST (~35). Some of the major job titles are Embedded Software Developer, Embedded System Engineer, and
Embedded C Developer

Installed
Top Employers Job Titles Workloads
Talent Pool

• Design methodology using OOAD & UML

• Senior Embedded C/C++ Developer
120 – 170 • Responsible for leading the team supporting the system architect
• Senior Embedded Software Engineer
• Review unit design, unit implementation, and unit test specifications

• Embedded Software Engineer

• Understand and analyze network protocols and different operating systems like
50 – 100 • Sr. Embedded Engineer
Windows/Linux.
• Engineer, Embedded IoT
• Develop source code targeting the embedded system

• Develop, validate, and repair defects for the small modules in the embedded systems under
• Developer I, Embedded Software
the continuous guidance
30 – 40 • Lead II – Embedded Software
• Execute 1st level analysis on failure logs
• Lead I – Embedded Testing
• Identify and report issues related to the platform

• Plan and design software modules and developer test requirements

• Embedded Software Developer
• Analyse and enhances efficiency, stability, and scalability of system resources
20 – 30 • Embedded Engineer
• Integrate and validate new product designs
• Embedded C Developer

• Create and update SW module test specification

• Embedded System Engineer • Carry out test execution and error analysis
10 – 20 • Embedded Software Engineer • Review test cases, test specifications, and test reports generated by peers and document the
result in a formal verification report

• Embedded Software Engineer • Design and develop firmware drivers and communications algorithms in C & C++
10 – 20 • Automotive Embedded Software Engineer • Handle the fault management, Diagnostics Event Manager, and NVM Stack

Note: The represented data is derived from DRAUP’s Proprietary Talent Module. Draup has analyzed 750Mn+ talent profiles to derive the job roles
pertaining to the provided job functions and skillsets; Roles listed are not exhaustive.
Parameter Favorability Index High Medium Low
 Talent Base Pay Analysis, Coimbatore Area

Product Companies Vs Service Provider Companies Median Base Pay Analysis

$60,000
Median Salary (USD) per annum

$50,000
70-95 %tile
$43,653 paying
companies
$40,000

$29,525
$30,000 $27,144

$17,858 $19,207
$20,000 $33,335

$13,493 40-70 %tile

paying

$23,017
~13,200 USD
$20,239

$10,000 companies

$12,699
$11,905

$8,096
$0
Product Companies Service Provider Companies
Median Base Pay 95th Percentile Base Pay

0-5 years 5-10 years 10+ years 0-5 years 5-10 years 10+ years

Median Salary across Product & Service Provider Companies

Note: The represented data has been derived using DRAUP’s Salary Simulation Module
Brand Building Strategies and Challenges, Coimbatore: Top employers are setting up incubation centers in Coimbatore in
collaboration with leading Universities in the area to attract qualified talent; the state government has launched
initiatives to increase the semiconductor footprint in Coimbatore
Favorable Location Factors & Talent Attraction Unfavourable Location Factors & Employee
Strategies Retention Challenges

Huge Government Investments in the Region Lack of Talent

The State Government Electronics Hardware Manufacturing Policy aims to The quality of university graduates in Coimbatore is lower when
increase Tamil Nadu’s electronics industry output to USD 100 billion by 2025. The compared with other metro cities. Employment of university talent
Government will formulate a package of incentives for Electronic System and pool directly on software engineering roles requires a long training
Manufacturing (ESDM) units in the Micro, Small, and Medium Enterprise (MSME) process
sector. The state government has proposed Coimbatore for the Tata Group to set
up their first semiconductor fabrication unit Cultural Bias and Political Instability
Increase in Incubator & Innovation Labs Coimbatore is the second-largest city in Tamil Nadu. This makes the
Forge is the incubation enterprise launched by the Coimbatore Innovation & city the centre of all political movements. The local population in
Business Incubator (CIBI). They established a 20,000 sq. ft incubator in Coimbatore regularly shows dissatisfaction with inter-cultural
Coimbatore, including Hardware junction, the integrated lab for full-spectrum mingling, which is also a cause for civil uprights for reservations
product (hardware) innovation offering equipment, tools, and resources in IoT, incorporates Coimbatore’s local talent
electronics, robotics, and others to support the design, development, and testing
of manufacturing-ready prototypes of innovative products
Compensation Dissatisfaction & High Talent Migration
Low Pollution and Traffic Levels The cost of hiring is considerably lower in the city, on an average the
Coimbatore has the lowest pollution levels amongst the peer cities cost of talent is 15%-25% lower than Tier-1 MSAs. Due to this,
semiconductor hubs in India. It makes easier for people to settle in and stay in younger professionals are seeking opportunities in nearby major
the city. The cost of transportation is also less compared to peer cities, cities such as Bangalore and Chennai
and traffic is limited to peak hours only
Lack of Experienced Professionals
Ever-increasing University Tie-ups Availability of experienced professionals is limited due to high
TCS and Capgemini have placement ties with Amrita Vishwa migration of these talent pool to Tier-1 locations. Opportunities for
Vidyapeetham University senior professionals across all companies are limited

Note: Draup analyses 30,000+ recent articles, announcements, annual reports and news publications periodically to identify and track the above factors at MSA level
 www.draup.com info@draup.com

HOUSTON I BANGALORE

© 2022 DRAUP. All Rights Reserved.

Expertise Score Model

Final Rank/ Sub Scores & Final Max

S.No Attributes Types
Weightages weightages Weights Score
Distinguished/Fellow 1 10
Director/Chief/Principal/Architect/VP 2 9.5
1 Title / Role Complexity 20.0% 2
Manager/Lead/Team Leader 3 7.5
Others 4 5
Count 20%
2 Patents 25.0% 2.5
Yes/No 80%
Ph.D. 1 10
Masters & Top 100 2 9

Copyright © 2020 Draup. All rights reserved

3 Educational Institution & Degree 20.0% Bachelors & Top 100 3 8 2
Masters & not from top 100 4 5
Bachelors & not from top 100 5 2.5
4 Number of Publications 7.5% Higher the publications, higher the score - - 0.75
Number of CERTIFICATIONS &
5 5.0% Higher the CERTIFICATIONS & AWARDS, higher the score - - 0.5
AWARDS
6 Core skills 5.0% Number of core skills and new age skills - - 0.5
7 No. of Projects 2.5% N/A - - 0.25
8 No. of Awards 2.5% N/A - - 0.25
Professionals from Product Companies will have a higher
9 Product/Service Company 10.0% - 10 1
weightage

11 Years of Exp 2.5% - - - 0.25

46
Key Engineering Sample Profiles – Embedded Software Engineer
Hyderabad

47
Saurabh Kumar Sinha is a Lead Firmware Engineer at United Technologies for the past 9+ years and has 10+ years of
overall experience; He has expertise in Embedded Low-level Software, Firmware, RTOS, Device Driver, and TCPIP; He has
hands-on experience in multiple domains such as HVAC, Building Management System & Access Control

Saurabh Kumar Sinha DESCRIPTION PROFESSIONAL EXPERIENCE

• Saurabh has expertise in performance-driven embedded software • Lead Firmware Engineer - R&D, United Technologies (Nov
Lead Firmware systems, embedded application software design-development- 2012 – Present)
Engineer - R&D debugging, and model-based development • Develop and deploy various embedded software applications
for bare metal controllers as well as for controllers with OS
• He has experience in handling complete product ownership and
end-to-end product development capabilities • Involving in Model-Based Design and Development, and
Analyzing code for vulnerabilities by running static code
• He is skilled in leading & developing focused and caliber teams that analysis tools such as Coverity and resolving the same
successfully meet and exceed business objectives
• Working with bootloader application for the control board
LinkedIn Profile Hyderabad Area, • Lead and deliver various HVAC Carrier projects(agile-
India EDUCATION influenced) in conjunction with other domains, on-time with
• M.Tech, Software Systems, Birla Institute of Technology and quality
Science, Pilani • Firmware Engineer - Embedded System R&D, Areca
7.3
Expertise Score*
Embedded System Pvt. Ltd (Jun 2011 - Nov 2012)
Patent Holder
• Involved in planning, designing, developing, debugging, bench
Award Holder testing as well as writing design documentation for enabling
SKILLS PORTFOLIO the product for market release
Tech Publications
Core Skills • Completed hardware and firmware projects such as the
Design of AT89C52-based general-purpose hardware
SDLC C++ TCP/IP protocols development board, Firmware coding for "Intelligent
CERTIFICATIONS AND AWARDS
Emergency Lighting Unit“, Firmware for RMPU(Roof Mounted
• MATLAB Fundamentals, MathWorks Product Development UDP Microcontrollers
AC Packaged Unit) and so on
• Titan Award, United Technologies
RTOS Embedded Software Python
Source: Draup
Soft Skills
PATENTS
Innovation Ideation Problem Solving
• A system and method for configuring
communication interval for sensing devices (IN 48
Analytical Developing Critical Thinking
201911030991)

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
48
Srinivasa Rao Katepalli is a Senior Lead Engineer of Firmware at NXP Semiconductors for the past 11 months and has
15+ years of overall experience; He is highly skilled in the interfacing of SPI, I2C, ADC, SCI/UART (RS232, RS485) and
MODBUS; He has expertise in Embedded Software, Firmware, and Real-Time Operating Systems (RTOS)

Srinivasa Rao Katepalli DESCRIPTION PROFESSIONAL EXPERIENCE

• Srinivasa is an experienced professional specializing in embedded • Senior Lead Engineer – Firmware, NXP Semiconductors
Senior Lead Engineer systems, digital hardware design concepts, and RTOS concepts (Sep 2021 – Present)
- Firmware • Create application SDKs for the embedded platform for
• He has hands-on experience in CAN, TCP/IP protocols, embedded C
integration with customer products and use cases
language & assembly language of 8-bit micro-controllers/32-bit
micro-controllers • Develop unit tests for firmware applications
• Set design direction for embedded applications using industry
• He has expertise in SDLC, embedded software programming, digital
best practices, processes, and toolchains
circuit, and integrated circuit
• Lead Engineer - Embedded Systems, Giesecke+Devrient
LinkedIn Profile Hyderabad Area,
India EDUCATION Mobile Security (Oct 2015 - Sep 2021)
• Responsible for software development in embedded C/C++
• Master of Science, Electronics, Osmania University for smart cards in G&D's one of the global research and
• Bachelor of Science (BSc), Electronics, Acharya Nagarjuna development centers
6.3 University
Expertise Score* • Technology Analyst - Embedded Systems, Infosys
Award Holder
Limited (Dec 2011 - Sep 2015)
SKILLS PORTFOLIO • Worked on Embedded System Platform and was responsible
for Software development for the embedded system projects
Core Skills
• Assistant Manager - R&D (Embedded), Intelux
CERTIFICATIONS AND AWARDS Microcontrollers SPI I2C Electronics Pvt. Ltd. (Apr 2009 – Dec 2011)
• Spearheaded End to End Firmware Development
• Employee of the Quarter Year, Giesecke & Devrient SDLC Data Structures Embedded OS
• Senior Engineer - R&D (Embedded), Intelux Electronics
• Best Employee of the Year, Intelux Electronics (P)
Ltd C++ Firmware UART Pvt. Ltd. (Apr 2008 – Apr 2009)
• Engineer - R&D
Source: (Embedded), Intelux Electronics Pvt. Ltd.
Draup
Soft Skills (Mar 2007 – Apr 2008)
PATENTS
Innovation Ideation Problem Solving
• N/A
Analytical Developing Critical Thinking 49

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
49
Yogesh Kumar T. is currently working with Honeywell for the past 8 months and has 7+ years of overall working
experience; He has experience in managing Custom Software Implementations and is skilled in Communication
Protocols like TCP/IP, UDP, IRDA, SPI, I2C, RS-232, GPIB, Modbus, and OPC

Yogesh Kumar T. DESCRIPTION PROFESSIONAL EXPERIENCE

• Yogesh is an experienced professional with 7+years of experience • Embedded Engineer II, Honeywell (Dec 2021 – Present)
Embedded Engineer II in the field of Automation and Control Systems • Support to test equipment and manufacturing engineering for
the development of new tools
• He is proficient in Test-Driven Development, Agile Test-Driven
Development, and V-Model Support Driven Development and has • Collaborate with colleagues for knowledge sharing and
deep expertise in programming languages such as NI-LabVIEW, NI- develop innovative solutions
FPGA, Python, Selenium, SVN, Tortoise, and Test Stand • Senior Engineer, Carrier Commercial Refrigeration (Oct
2020 - Dec 2021)
• Provided support to ensure on-schedule and accurate time
LinkedIn Profile Hyderabad Area, tracking for epics and sprints
India EDUCATION • Created and utilized key metrics to measure, improve, and
• Pg. Diploma, Industrial automation system design, National report performance to stakeholders
Institute of Electronics & Information Technology Calicut
• Proactively anticipate and removed impediments to keep
6.1 • B.Tech., Electronics and Communications, Viswanadha institute of
teams highly productive
Expertise Score* HQ Work Experience technology &management(VITAM)
• LabVIEW Developer, Infodat (Feb 2019 - Apr 2020)
SKILLS PORTFOLIO • Detected and troubleshot software issues
Core Skills • Provided input on software development projects
• Application Engineer, VEM Technologies (Apr 2017 - Feb
Process Automation LabVIEW Selenium 2019)
CERTIFICATIONS AND AWARDS • Supported peak load management/demand response
• Certified LabVIEW Associated Developer, NI Python Matlab C program with data analysis and performance trends
(National Instruments) • Collaborated with the onsite team to develop and verify ECM
Ubuntu SCADA Linux
installation and commissioning documents
Source: Draup
Soft Skills • Application Engineer, Digilogic Systems (Jan 2015 - Mar 2017)
PATENTS
Innovation Challenge Driven Problem Solving
• Differential privacy for message text content mining
(US20180091466A1) 50
Initiation Goal Orientation Critical Thinking

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
50
Rekha Edamalapati is working with Qualcomm as a Senior Lead Engineer for the past 5+ years and has 14+ years of
overall experience working in Firmware Engineering; She has experience in WLAN FW development, experience working
in 802.11c/11ax/11be specifications, and has good knowledge in regulatory and DFS

Rekha Edamalapati DESCRIPTION PROFESSIONAL EXPERIENCE

• Rekha is an experienced Engineering professional, currently • Senior Lead Engineer, Qualcomm (Apr 2017 - Present)
Senior Lead Engineer working at Qualcomm as a Senior Lead Engineer for the past 5+ • Working in IEEE 802.11ax, 11a,c, and previous specifications,
years WIFI 6G/5G/2G
• She has good technical knowledge in C, C++, RTOS, 8051 assembly • Gathers, integrates and interprets information from a variety
language of sources in order to troubleshoot issues and find solutions

• She has worked on USB 3.0, and USB 2.0 and worked on a few • Firmware Engineer II, Microchip Technology (Jul 2013 - Apr
projects related to type C Power delivery 2017)
• Worked on firmware development and testing
LinkedIn Profile Hyderabad Area, • Developed application suits using Visual Studio to test the
India EDUCATION firmware
• Bachelor of Engineering (B.E.), Electrical, Electronics, and
• Worked on hardware debugging and fixing, FPGA and ASIC
Communications Engineering, MIT/Anna university
validation
5.9
Expertise Score* • Developed embedded firmware for computing products like
Firmware Expert
Tablets, Mobiles, Desktop PCs, and Industrial PCs
SKILLS PORTFOLIO
Core Skills

C Verilog Debugging
CERTIFICATIONS AND AWARDS
Firmware
• N/A Embedded Systems WLAN
Development

C++ MATLAB WiFi

Source: Draup
Soft Skills
PATENTS
Innovation Ideation Problem Solving
• N/A
Leadership Developing Critical Thinking 51

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
51
Venu Ambati is working with Honeywell as an Embedded Engineer for the past 2 years and has 8+ years of overall
experience; He has experience in Firmware Programming on ARM Cortex-M Microcontrollers and Programming
Experience with C, C++, and Python Scripting

Venu Ambati DESCRIPTION PROFESSIONAL EXPERIENCE

• Venu is an Embedded Software professional with 8+ years of • Embedded Engineer, Honeywell (Jun 2020 – Present)
Embedded Engineer experience in design, development, and integration • Develop firmware for a variety of embedded products
• He has hands-on experience in embedded protocols UART, I2C, SPI, • Design and development of equipment and systems, and
and CAN redesign of existing systems to fulfill the needs of Honeywell's
customers
• He is skilled in Embedded Linux, Linux Device Drivers, and JTAG
• Maintain firmware servers and develop tools for internal use,
debugging on ARM hardware
including scripts and basic hardware interfaces
• Tech Analyst, Infosys (Dec 2017 - Jun 2020)
LinkedIn Profile Hyderabad Area, • Participated in the creation of IP based product/ platform for
India EDUCATION
Infosys Service Differentiation
• BE, Electrical and Electronics Engineering, Osmania University
• Performed impact analysis and participated in the technical
design of the product modules
5.5
Expertise Score* Firmware Expert • Embedded Software Engineer, Mindlance Technologies
(Feb 2017 – Nov 2017)
SKILLS PORTFOLIO • Developed Linux device driver for product development as
Core Skills per customer requirement and perform the BSP
development, Porting Linux kernel on the new target

CERTIFICATIONS AND AWARDS Embedded Linux U-Boot SPI • Embedded Developer Software, ISM Technologies (Jun
2014 – Jan 2017)
• N/A I2C CAN UART • Conducted tests on the embedded software systems to
ensure proper integration
C/C++ ARM Architecture Linux Kernel
• Implemented effective repairs, modifications, and upgrades
toSource: Draup code
the embedded
Soft Skills
PATENTS
Analytical Flexibility Problem Solving
• N/A
Quality Orientation Self-Assurance Critical Thinking 52

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
52
Nikitha Rakala is working at Enphase Energy for the past 2+ years as Senior Embedded Engineer and has 7+ years of
overall experience; She has expertise in HVAC controls development, variable Speed Drives, ARM Controllers,
Embedded Programming and RTOS

Nikitha Rakala DESCRIPTION PROFESSIONAL EXPERIENCE

• Nikitha is an Embedded engineer with strong knowledge in • Sr. Engineer Embedded, Enphase Energy (Jun 2020 – Present)
Sr Embedded embedded controls development • Designing and implementing embedded software
Engineer microinverters operation and control and for battery control
• She has worked on the research of MPEG4 Motion Estimation and
and management
Compensation in the video encoding
• Review and Analyse Product Requirements, Specifications,
• She has hands-on experience working on the hardware and Technical Design Documents and come up with Test Plans
implementation of Motion Compensation and Motion Estimation and Test Cases
Algorithm using MPEG4 Standards
• Sr. Embedded Controls Engineer, Trane Technologies
LinkedIn Profile Hyderabad Area, (Jul 2015 –Jun 2020)
India EDUCATION • Developed application and peripheral modules for different
• Bachelor of Technology (BTech), Electronics and Communications components in a residential HVAC unit
Engineering, NIT CALICUT • Responsible for requirement gathering from systems team,
5.4 application design, coordinating team, and application
Expertise Score* HQ Work Experience development

SKILLS PORTFOLIO
Core Skills
Software
ARM Cortex-M HVAC Controls
CERTIFICATIONS AND AWARDS Development

• N/A C Embedded Systems RTOS

Frequency Drives
Source: Draup
Soft Skills
PATENTS
Innovation Passionate Problem Solving
• N/A
Leadership Communication Skills LogicalThinking 53

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
53
Utkarsh Srivastav is working with Intel Corporation for the past 4 months and has 11+ years of experience in Embedded
Firmware Development using C/C++ on various microcontrollers on Bare metal and RTOS platforms; He is highly
experienced in KEIL, and Eclipse embedded development tools

Utkarsh Srivastav DESCRIPTION PROFESSIONAL EXPERIENCE

• Utkarsh is a highly experienced professional with expertise • Senior Firmware Engineer, Intel Corporation (Apr 2022 -
Senior Firmware in different Communication Protocols like SPI, UART, I2C, USB, Present)
Engineer CAN, and programming tools like Matlab, and Simulink • Support Partners integrating Tile Service to their products.
Provide test fixture support for manufacturing, QA, and
• He has strong Diagnostic/Debugging skills on "8/16/32" Bit ARM 7,
contract manufacturers. Create, modify, and update code for
Cortex M3/4/7 based microcontrollers
new and existing products
• He has experience with In-circuit Emulator and debugging like • Senior Embedded Firmware Engineer, Medtronic
JTAG, ULINK, and ICD3 (Jun 2017 – Apr 2022)
LinkedIn Profile Bengaluru Area, • Worked interfacing MCU with different Valves, Sensors via
India EDUCATION different communication protocols UART, I2C, SPI, I2C, CAN
• Bachelor of Engineering, Medical Electronics, M.S.Ramaiah Institute • Actively participated in Code Reviews and was involved with
Of Technology the system team for the improvement of LDs and UI Alarm
5.5 screens
Expertise Score* Firmware Expert • Senior Embedded Software Engineer, Tech Mahindra
(Apr 2016 – Jun 2017)
SKILLS PORTFOLIO • Development of “RFID Crypto solution” and Integration with
Core Skills Freescale micro-controller MK20/10/64 Series
• Worked on Advance motion Control driver for DC brushless
Embedded Software Matlab Analog Circuit Design motor
CERTIFICATIONS AND AWARDS
• Senior Design/Embedded Engineer, Skanray
• End Tidal Carbon Dioxide Characterization and C Linux - RTOS Digital Electronics
Technologies (Jan 2013 – Mar 2016)
Performance Analysis of a Capnography System
C++ Debugging Code TCP/IP • Involved with the mechanical team in designing of IR bench
for EtCo2 Module,
Source: Draup Error Estimation, accuracy and precision
Soft Skills estimation of capnography, Etco2 Module
PATENTS
• Senior Design/Embedded Engineer, L&T Medical
Analytical Ideation Problem Solving
• N/A Equipment & System (Aug 2011 – Jan 2013)
• Worked on Hardware design and embedded software 54
Leadership Communication Skills Quality Orientation
development of FiO2 monitor
Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
54
Jagadish Kumar. V is working with Samsung R&D Institute for the past 1+ years and has 7+ years of overall experience;
He has expertise in communication protocols (CAN, SPI, I2C, UART), C programming, Quartus2, MATLAB, Real-time
Operating Systems, and Data Structures

Jagadish Kumar .V DESCRIPTION PROFESSIONAL EXPERIENCE

• Jagadish is a Firmware Engineer with expertise in Embedded • Staff Firmware Engineer, Samsung R&D Institute
Staff Firmware Hardware and Software development India (Sep 2020 - Present)
Engineer • He has good Knowledge of firmware development using • Designing, implementing, and supporting features in C and
embedded C and a good understanding of RTOS and worked on C++ for reliable, fault-tolerant, carrier-grade products and
Communication protocols(CAN, SPI, I2C, UART) responsible for planning, improving, and managing firmware
development throughout the NPDI process
• He is skilled in Languages like C, embedded C, C#, JAVA,
• Analysis based on inputs from business/marketing groups and
python(basics), and tools like, Keil, LPC Expresso, Quartus2
system architects
LinkedIn Profile Bengaluru Area, • Worked on Embedded system software design to support
India EDUCATION lighting products, including firmware coding and debugging
• MEng, Embedded Systems , School of Information Science with electronic engineer, and algorithm implementation by
• BE, Electronics and Communication, Bangalore Institute of programming according to functional requirements
6.8 Technology
• Senior Application Engineer, Cypress Semiconductor
Expertise Score* Award Holder
Corporation (Jun 2018 - Sep 2020)
• Identified opportunities for improvement in existing products
SKILLS PORTFOLIO or developing new products based on customer feedback or
Core Skills market trends
• Reviewed blueprints, sketches, drawings, designs, and other
TensorFlow Python Java
CERTIFICATIONS AND AWARDS plans provided by clients to determine the feasibility and
suitability of materials
• Networking Concepts with Socket Programming Embedded C RTOS yocto
• Employee of the month • Software Engineer, Robert Bosch (Jun 2014 - Jul 2016)
• Props Award Keras Matlab Data Structures • Executed full lifecycle software development
Source: Draup
• Programmed well-designed, testable, efficient code
Soft Skills
PATENTS • Produced specifications and determining operational
feasibility
Communication skills Logical Thinking Problem Solving
N/A
Creativity Analytical Supportive 55

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
55
Prashant Pathak is working with AMD for the past 1 year and has 16+ years of overall experience; He is skilled in
Automation, Requirements Analysis, RTOS, Embedded C, Networking, RS232, Object-Oriented Programming, and
Network Protocol stacks like Modbus, CIP, Device Net, and TCP/IP

Prashant Pathak DESCRIPTION PROFESSIONAL EXPERIENCE

• Prashant is a Firmware development engineer with expertise in • SMTS Firmware Development Engineer, AMD (May 2021 –
SMTS Firmware Embedded Firmware, Software design, and development Present)
Development Engineer • Specification and development of Embedded Software for use
• He has expertise in Assembly, C, C++, Object-oriented design using
in Linux and standalone products
different design patterns and UML, serial communication I2C, SPI,
CAN and UART, and Modbus • Designing and implementing software subsystems to control
FPGA Hardware solution
• He has hands-on experience in developing/debugging firmware on
pre-silicon HW setups like FPGA • System Software Engineer, Hewlett Packard
Enterprise (Jun 2019 - May 2021)
LinkedIn Profile Bengaluru Area, • Codes and programs enhancements, updates, and changes for
India EDUCATION portions and subsystems of systems software, including
• Post Graduate Diploma, Embedded System and VLSI Design, C-DAC operating systems, compilers, networking, utilities, databases,
NOIDA and Internet-related tools
5.7 • B.Tech, Electronics & Communication, Dr. K.N. Modi Institute Of • Executes established test plans and protocols for assigned
Expertise Score* HQ Work Experience Engineering And Technology, Ghaziabad portions of code; identifies, logs, and debugs assigned issues

SKILLS PORTFOLIO • Firmware Architect, Wipro Ltd. (Jun 2018 – May 2019)
• Develop software solutions by studying information needs,
Core Skills studying systems flow, data usage, and work processes
• Investigating problem areas followed by the software
Embedded Systems Firmware RTOS
CERTIFICATIONS AND AWARDS development life cycle
• N/A RS232 Embedded C Automation • Facilitate root cause analysis of the system issues and
problem statement
C++ Modbus UML
• Technical Specialist, Capgemini (Oct 2005 – Apr 2018)
Source: Draup
• Configure and optimize processes with Automation-First and
Soft Skills E2E-Focus on a new system setup (global enterprise scale)
PATENTS
Self-Driven Supportive Problem Solving • Transform process configuration into the implementation of a
• N/A running pilot covering all legal requirements
Leadership Methodical Critical Thinking 56

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
56
Darwin Dominic is working with Analog Devices for the past 5 years and has experience working in the field of
Embedded Software Development; He is highly skilled in Internet Protocol Suite (TCP/IP), Neural Networks, Machine
Learning, RTOS, Embedded Systems & Software, Simulink and ARM Architecture

Darwin Dominic DESCRIPTION PROFESSIONAL EXPERIENCE

• Darwin is a highly experienced Software Development engineer • Senior Embedded Software Development Engineer,
Senior Embedded proficient in Embedded Software Development and System Design Analog Devices (Jan 2017 – Present)
Engineer • He has expertise in Network protocols(TCP/IP), Embedded C, PLC • Helped in developing Industrial Ethernet System Solutions
ladder logic, and RTOS mainly Free RTOS and uCOS II, supporting different industrial protocols like Ether CAT,
and Embedded Interfacing protocols like UART, SPI, I2C Ethernet/IP, OPC-UA
• Involved in developing OS, HAL layers for ARM processors,
firmware driver development involving PHY's, Ethernet
Switches
LinkedIn Profile Bengaluru Area, • Worked with RF, and IoT technology teams to deliver
India EDUCATION successful product solutions
• MTech, Applied Electronics and Instrumentation, College of
Engineering Trivandrum
6.9 • BTech, ECE, College of Engineering Chengannur
Expertise Score* Tech Publications

SKILLS PORTFOLIO
Core Skills

Semiconductors Python Embedded Software

CERTIFICATIONS AND AWARDS
• N/A Matlab Embedded Systems RTOS
Machine Learning
C++ Firmware
Source: Draup
Soft Skills
PATENTS
Innovation Teamwork Problem Solving
• N/A
Leadership Developing Logical Thinking 57

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
57
Anurag Singh is working with Samsung Electronics for the past 2+ years and has 6+ years of experience working in the
field of Software Engineering; He is experienced in Embedded Software Development; He is skilled in C, C++, Python,
Data Structures, Operating System concepts, and TCP/IP

Anurag Singh DESCRIPTION PROFESSIONAL EXPERIENCE

• Anurag is an Associate Staff Engineer in Firmware with experience • Associate Staff Engineer, Samsung Electronics (Feb 2020 –
Associate Staff in Semiconductor/Telecom Domain in both windows and Linux Present)
Engineer - Firmware environments • Working on NAND Flash SSD firmware verification and
validation
• He has a good knowledge of C/C++, Real-time operating systems,
and Embedded system • Develop, review, document, and maintain source code in
Python/C/C++
• He has experience in verification and validation of Datacentre
based products using C/C++ and Python-based tests • Software Engineer, Cerence Inc (Apr 2019 - Feb 2020)
• Worked with C, C++, and Python language in Agile and scrum-
LinkedIn Profile Pune, India based environment for AI-based Voice Assistant for
EDUCATION Automotive field
• PG – Diploma in Embedded Systems, Centre for Development of • Worked for multi-threading software development for
Advanced Computing (C – DAC) embedded systems
5.8 • Bachelor's Degree, Electronics and Communications Engineering,
• Experienced with embedded systems and OS like Android and
Expertise Score* Award Holder Dr.A.P.J. Abdul Kalam Technical University
embedded Linux

SKILLS PORTFOLIO • Embedded Software Developer, Giesecke + Devrient

Mobile Security (Aug 2015 – Apr 2019)
Core Skills
• Worked for Smart Card Operating system development and
testing for SIM/USIM card
Embedded Systems Linux Matlab
CERTIFICATIONS AND AWARDS • Versed with Cryptographic algorithm used in Smart Card
• Spot Award, Samsung Electronics Linux RTOS Embedded Linux domain, DES, AES, RSA, ECC
• EOM, Samsung Electronics Software • Worked on Global Platform(GPv2. 2.1, GPv2. 2), ETSI 102 225,
• Spot Award, DCI Pune C++ Microcontrollers 102 226 specification, 3GPP TS 31.102, 3GPP TS 22.048,
Development
Source:Authentication
Network Draup Protocol (3G,4G Authentication -EAP
Soft Skills AKA,AKA_EXTN)
PATENTS
Innovative Supportive Problem Solving
• N/A
Supportive Dynamic Developing 58

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
58
Sanjog Janwalkar is working with NXP Semiconductors for the past 2+ years and has 6+ years of experience working in
the field of Embedded Software Engineering; He is highly experienced in BT/BLE protocol, ARM Cortex M3, Real-Time
Operating Systems (RTOS), Embedded Systems, and C Programming

Sanjog Janwalkar DESCRIPTION PROFESSIONAL EXPERIENCE

• Sanjog is an Embedded Software professional, having 5+ years of • Senior Embedded Software Engineer, NXP
Senior Embedded work experience in developing firmware solutions, Software and Semiconductors (Dec 2019 - Present)
Software Engineer Hardware Debugging, and knowledge of BT/BLE wireless protocol • Debug and resolve several critical customers and QA reported
• He is highly skilled in C programming language, RTOS concepts, issues in BT/BLE firmware
ARM Cortex M3 processor and communication protocols • Work on the qualification issues for the chip to be officially
listed on the BT SIG website
• Support pre- and post-tape-out activities in firmware like
ROM changes, SOC bring-up, etc
LinkedIn Profile Pune, India • Collaborate with QA, AE, SoC and Bluetooth hardware teams
EDUCATION
to deliver better firmware solution
• Master of Technology (M.Tech.), VLSI & Embedded Systems,
College of Engineering Pune • Embedded Software Engineer, Marvell Semiconductor
• Bachelor of Engineering (BE), Electronics, Finolex Academy , (Jun 2016 – Nov 2019)
5.7
Expertise Score* Ratnagiri • Have debugged and resolved several critical customer and
Firmware Expert
QA-reported issues in BT/BLE firmware.
SKILLS PORTFOLIO • Worked on the qualification issues for the chip to be officially
listed on the BT SIG website
Core Skills
• Have worked on Data, host control interface and link layer for
LE isochronous feature
Embedded C Linux device drivers Linux OS
CERTIFICATIONS AND AWARDS • Support pre and post-tape-out activities in firmware like ROM
• AMCAT Certified Design Engineer - Electronics and Embedded Systems C Sell Scripting changes, SOC bring-up, etc.
Semiconductor, Aspiring Minds • Worked on the enhancement of the existing BT/BLE firmware
C++ Bluetooth RTOS as per SIG specs for Marvell’s chipsets.
Source:
• Have Draup
worked to resolve Bluetooth security vulnerability-
Soft Skills
PATENTS related issues
Innovation Quality Orientation Problem Solving • Experienced in debugging multi-threaded, dual-core solutions
• N/A and implementing RAM patches to work around ROM code
Communication Accountability Critical Thinking issues. 59

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
59
Rakila Parveen is working with Qualcomm as a Senior Firmware Engineer for the past 1+ years and has 7+ years of
overall experience; She is skilled in Socket Programming (TCP/UDP), Embedded C/C++, Embedded Linux, RTOS, Linux
Kernel, Communication Protocols (SPI, UART, I2C & SDIO), JIRA, and Git

Rakila Parveen DESCRIPTION PROFESSIONAL EXPERIENCE

• Rakila has experience in working in the semiconductors industry • Senior Firmware Engineer, Qualcomm (Feb 2021 – Present)
Senior Firmware with a focus on Software Applications & Software Development • Design and implement test mode interfaces to enable
Engineer • She has hands-on experience in the wireless portfolio such as IEEE hardware characterization and tuning procedures to
802.15.4, BLE, Wi-Fi (IEEE 802.11) optimize RF receive and transmit performance
• Design, implementation, test, and maintenance of firmware
• She is skilled in tools and technologies such as C, C++, MATLAB, and bootloaders on new and existing products
Embedded Software, Linux, BLE, SPI, and UART
• Optimize device control transactions to meet strict timing
requirements for inter-RAT, multi-SIM, and concurrent radio
LinkedIn Profile Chennai Area, operations
India EDUCATION • Application Engineer, Microchip Technology Inc (Jan 2017 –
• BE., ECE, Anna University Jan 2021)
• Worked on creating custom and reference applications for
5.7 Microchip products
Expertise Score* Firmware Expert • Created application notes, user guides, and demos for
Microchip products
SKILLS PORTFOLIO • Associate Application Engineer, Atmel Corporation (Nov
Core Skills 2014 – Dec 2016)
• Worked on Atmel RF Products such as IEEE 802.15.4 and BLE
Matlab Embedded C Windows to support IoT companies build, debug and launch Products
CERTIFICATIONS AND AWARDS
• Embedded Software Development, support issues, author of
• N/A Linux BLE Embedded System application notes
C++ Embedded Software C
Source: Draup
Soft Skills
PATENTS
Guidance Supportive Analytical
• N/A
Creativity Detail Orientation Presentation Skills 60

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
60
Karthik Murugan is working with Qualcomm for the past 5+ years and has 9+ years of experience working in the field of
Software Engineering; He has expertise in MATLAB, C Programming, Embedded Protocols such as I2C & UART, Firmware,
Carplay Application

Karthik Murugan DESCRIPTION PROFESSIONAL EXPERIENCE

• Karthik is a Software Engineering professional with experience in • Senior Lead Software Engineer, Qualcomm (Nov 2021 –
Senior Lead Software developing Firmware using FreeRTOS real-time operating system Present)
Engineer and 8051 Assembly language • Handling WLAN HALPHY oriented customer issues of Access
point WIFI chipset from field and ODM, interacting with
• He has a vast knowledge of ROM firmware and has analyzed &
internal Customer Engineers and end customers
implemented patch firmware using tricky assembly coding
• Devising debug strategy and delivering solutions with quick
• He is skilled in Silicon Validation, Test Automation, Visual C++, TAT
MATLAB, Verilog, and OpenCV
• Senior Software Engineer, Qualcomm (Nov 2019 - Nov 2021)
LinkedIn Profile Chennai Area, • Closely worked with WLAN MAC layer teams to debug and
India EDUCATION resolve Customer issues reported in the field
• Bachelor of Engineering, Electronics, and Communication • Resolved SW bugs reported by in-house Test teams and
Engineering, Anna University deliver high-quality Cadence releases
5.7
Expertise Score*
• Software Engineer, Qualcomm (Apr 2017 – Nov 2019)
Firmware Expert
• Responsible for WLAN Firmware Development focusing on
HALPHY layer, Delivering on Cadence releases, and Feature
SKILLS PORTFOLIO development based on Customer requirement
Core Skills
• Engineer II – Software, Microchip Technology Inc (Sep 2016
Software – Apr 2017)
UML FreeRTOS
CERTIFICATIONS AND AWARDS Development • Designed and implemented firmware for UART peripheral
for USB to UART bridging application. Implemented as CDC
• N/A PSpice MATLAB Embedded Systems
class interface device as per USB CDC class specification
C++ Firmware C • Responsible for debugging and fixing racing issues caused by
multi-tasking
Source: Draupand ISR latency issues
Soft Skills • Engineer I – Software, Microchip Technology Inc (Jul 2015 –
PATENTS
Aug 2016)
Innovation Ideation Problem Solving
• N/A
Leadership Developing Critical Thinking 61

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
61
Kumar Shanmugam is working with Crestron Electronics India Private Limited for the past 6 months and has over 16+
years of experience; He has a vast knowledge of Programming in C/C++ 11/14, Object-Oriented Design, Protocol
Implementation, FSM Design, and Network Programming

Kumar Shanmugam DESCRIPTION PROFESSIONAL EXPERIENCE

• Kumar is an Engineering Professional with an experience in real- • Lead Firmware Engineer, Crestron Electronics India
Lead Firmware time embedded Network Access products with a focus on product Private Limited (Feb 2022 – Present)
Engineer success • Integrating hardware and firmware and conducting system
• He has industrial knowledge of Internet Protocol Suite (TCP/IP), tests using near-final hardware and firmware
UML, RTOS, and Embedded Software • Planning, developing, and implementing firmware
• He has implemented Ethernet technologies like Service OAM (ITU- • Software Architect, Wipro Limited (Oct 2019 - Feb 2022)
T Y.1731 & IEEE 802.1ag) and security protocols such as SSH • Designed and developed the IoT PoC by integrating RF-867
Dongle/Zigbee to Gateway Router so that the Router can
LinkedIn Profile Coimbatore Area,
India EDUCATION communicate with Lighting Sensor
• Integration and Adaptation of multiple Openwork Package
• MCA, Computer Application, Indira Gandhi National Open
like men's, Docker, Java, etc., into Gateway Router
University
6.1 • B.Sc, Computer Tech-Applied Science, Coimbatore Institute of • Architect (Deputed from Wipro), Fujitsu Network
Expertise Score* HQ Work Experience Technology Communications (Oct 2015 - Oct 2019)
• Involved in the Detailed Design, High-Level design discussion
SKILLS PORTFOLIO activities as per the Requirements
Core Skills • Responsible for the design and implementation of DB Replay,
and Performance Monitoring. Operational Data Retrieval
CERTIFICATIONS AND AWARDS Telecommunications C Java • Technical Lead, Wipro (Jan 2015 – Sep 2015)
• Led the Post GA Enhancement team to deliver the
• N/A Embedded Systems Ethernet Unix Requirement Specification across L2, L3, and System domains
C++ SDLC JIRA • Responsible for implementation and UT planning, Tracking
and delivering the same on time with quality
Source: Draup
Soft Skills
PATENTS
Innovation Analytical Problem Solving
• N/A
Leadership Developing Critical Thinking 62

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
62
Vignesh Thangavel is an Embedded Software Engineer working with Qbitronics with an overall experience of 9+ years;
He has expertise in Programming Languages such as C, C++, and Embedded C; He is skilled in Linux, RTOS, and Protocols
including RS232, I2C & SPI

Vignesh Thangavel DESCRIPTION PROFESSIONAL EXPERIENCE

• Vignesh is an Engineering professional with experience in working • Embedded Software Engineer, Qbitronics (Jul 2013 – Present)
Embedded Software on Wireless Industrial Automation and Consumer Products • Working with Wireless Industrial Automation and Consumer
Engineer products
• He is proficient in Processors such as Intel 8051, PIC, AT mega,
ARM7, and Simulation Tools including Proteus 8 • Responsible for developing and debugging an embedded
application using a C/C++ programming language.
• He has worked with software tools such as Keil-C, CCS-4, Code
• Updating software components and subsystems in a released
Vision AVR, Arduino, MPLAB, MATLAB
product
• Responsible for debugging the code with HW engineers
LinkedIn Profile Coimbatore Area,
India EDUCATION • Identify root causes of issues, determines potential solutions,
and evaluate them against requirements
• Bachelor's Degree, Electrical, Electronics and Communication
Engineering, Sri Ramakrishna Engineering College
5.7
Expertise Score* HQ Work Experience

SKILLS PORTFOLIO
Core Skills

Embedded C RTOS GSM

CERTIFICATIONS AND AWARDS
• C and C++ Matlab C Keil

C++ SPI I2C

Source: Draup
Soft Skills
PATENTS
Innovation Ideation Problem Solving
• N/A
Analytical Developing Critical Thinking 63

Note: Draup tracks 750M+ professional profiles annually, The above-mentioned profile have been generated by leveraging Draup’s Rolodex, and other profiles publicly available on social media platforms. Source: Draup
Please note that the listed skills are not exhaustive. *Please refer the appendix section for the Expertise Score Model
63
 www.draup.com info@draup.com

HOUSTON I BANGALORE

© 2023 DRAUP. All Rights Reserved.

64