DM 00547983
DM 00547983
User manual
Introduction
The STM32H745I-DISCO and STM32H750B-DK Discovery kits are complete demonstration and development platforms for
STMicroelectronics Arm® Cortex®‑M7 and Cortex®‑M4 core-based STM32H745XI (STM32H745XIH6 order code), and
Cortex®‑M7 core-based STM32H750XB (STM32H750XBH6 order code) microcontrollers. Both devices feature four I2Cs,
six SPIs with three multiplexed simplex I2Ss, two SD/SDIO/SDMMC interfaces, four USARTs, four UARTs, one LPUART,
two CAN controllers, three 16-bit ADCs, two 12-bit DACs, four SAIs, 8- to 14‑bit digital camera interface, 1 Mbyte
(STM32H745XIH6) or 128 Kbytes (STM32H750XBH6) of internal SRAM and 2 Mbytes of flash memory, a USB OTG HS and a
USB OTG FS, an Ethernet MAC interface, an FMC interface, a Quad-SPI interface, and SWD debugging support. The
STM32H745I-DISCO and STM32H750B-DK Discovery kits enable users to get started quickly and develop applications.
In addition, the STM32H745I-DISCO and STM32H750B-DK, shown in Figure 1 and Figure 2, can be used as a reference
design for user application prototyping before porting to the final product.
The full range of hardware features available on the board helps users enhance their application development through an
evaluation of almost all peripherals (such as USB OTG FS, Ethernet 10/100 Mbit/s, eMMC, USART, SAI audio DAC stereo with
audio jack input and output, MEMS digital microphone, SDRAM, Quad-SPI flash memory, and RGB interface LCD with
capacitive multi-touch panel). ARDUINO® Uno V3 connectors provide easy connection to extension shields or daughterboards
for specific applications.
STLINK-V3E is integrated into the board, as an embedded in-circuit debugger and programmer for the STM32 MCU and the
USB Virtual COM port bridge.
The STM32H745I-DISCO and STM32H750B-DK boards come with the STM32CubeH7 MCU Package, which provides an
STM32 comprehensive software HAL library as well as various software examples.
Figure 1. STM32H745I-DISCO and STM32H750B-DK main Figure 2. STM32H745I-DISCO and STM32H750B-DK main
boards (top view) boards (bottom view)
1 Features
2 Ordering information
To order the STM32H745I-DISCO and STM32H750B-DK Discovery kits, refer to Table 1. Additional information is
available from the datasheet and reference manual of the target STM32.
2.1 Codification
The meaning of the codification is explained in Table 2.
STM32XXYYZ-DISCO
Description Example: STM32H745I-DISCO
STM32XXYYZ-DK
STM32XX MCU series in STM32 32-bit Arm Cortex MCUs STM32H7 series
YY MCU product line in the series STM32H745/755 includes the STM32H745xx MCUs
STM32 flash memory size:
Z • B for 128 Kbytes 2 Mbytes
• I for 2 Mbytes
Toolkit type:
DISCO/DK Discovery kit
• Discovery kit
3 Development environment
4 Conventions
Table 3 provides the conventions used for the ON and OFF settings in the present document.
Convention Definition
5 Safety recommendations
The STM32H745I-DISCO and STM32H750B-DK Discovery kits are designed around the STM32H745XIH6 and
STM32H750XBH6 microcontrollers, respectively. Both microcontrollers are packaged in TFBGA240+25. The
hardware block diagram (see Figure 3) illustrates the connection between the microcontroller and the peripherals
(SDRAM, eMMC, Quad-SPI flash memory, CAN FD (FDCAN), LCD RGB connector, USB OTG connectors,
UART, Ethernet, audio, TAG connector, STDC connector, ARDUINO® Uno shields, and embedded ST-LINK).
Figure 4 and Figure 5 help to locate these features on the STM32H745I-DISCO and STM32H750B-DK boards.
MII Ethernet
TAG connector SWD
UART1 PoE
STDC connector
2 × 512-Mbit Quad-SPI
QSPI PDM
flash memory
STMod+ connector
DT71752V1
2 × CAN FDs FDCAN1/2 UART2
TAG connector
STMod+ connector (P1)
(CN16)
Reset button
(B2)
Power header
(JP8)
Ethernet connector
(CN1)
DT71753V1
User LEDs
(LD6, LD7, LD8)
ARDUINO® connectors
(CN2, CN6)
ARDUINO® connectors
MCU (CN3, CN7)
(U6)
CAN FDs (U21, U22)
STMod+ STDC14
DT71754V1
connector connector
(P1) (CN4)
Figure 6. STM32H745I-DISCO and STM32H750B-DK Discovery main board mechanical drawing (bottom
view)
DT71755V1
The STLINK-V3E requires drivers to be installed on Windows®. It embeds firmware that needs to be updated
occasionally to benefit from new functionalities and bug corrections. Refer to the technical note Overview of ST-
LINK derivatives (TN1235) for details.
To do this, it is important to power the board before connecting it with the host PC, which requires the following
sequence to be respected:
1. Set jumper JP8 in the E5V or CHGR position.
2. Connect the external power source to CN3 pin 8 or CN15.
3. Check that the green LED LD4 is turned ON.
4. Connect the host PC to the USB connector (CN14).
Caution: If the board requests more than 300 mA and the host PC is connected via USB before the board is powered
from CN3 pin 8 or CN15, the following events may occur (listed in reverse severity order):
1. The host PC can supply 300 mA (the enumeration succeeds) but does not feature overcurrent protection on
its USB port. It is damaged due to overcurrent.
2. The host PC can supply 300 mA (the enumeration succeeds) and it has built-in overcurrent protection on its
USB port, limiting or shutting down the power out of its USB port when the excessive current demand from
STM32H745I-DISCO/STM32H750B-DK is detected. This causes the card to malfunction.
3. The host PC is not capable of supplying 300 mA (the enumeration fails). The STLINK-V3E does not supply
the rest of the STM32H745I-DISCO/STM32H750B-DK from its USB port VBUS line.
Table 4 describes the settings of all the jumpers related to the powering of the STM32H745I-DISCO/
STM32H750B-DK and the extension board. VDD_MCU corresponds to the STM32H745XIH6/STM32H750XBH6
digital supply voltage line. It can be connected to a fixed 3.3 V supply.
STLK
ESV
USBFS
CHGR
STLK
ESV
USBFS
CHGR
STLK
ESV
USBFS
CHGR
STLK
ESV
Default setting
The STM32H745I-DISCO/STM32H750B-DK is supplied through the CN14 Micro-B
USB receptacle. It depends on the host PC USB port powering capability declared in
POE5V
USBFS
CHGR
STLK
ESV
the enumeration.
Default setting
SB23 SB23 ON
VBAT is connected to +3V3.
VBAT connection
SB23 OFF VBAT is not connected to +3V3.
Default setting.
SB15 SB15 ON VDD_USB (VDDUSB terminal of STM32H745XIH6/STM32H750XBH6) is connected to
VDD_USB connection VDD_MCU.
SB15 OFF VDD_USB is not connected to VDD_MCU.
Default setting
6.7 Audio
An audio codec with four DACs and two ADCs is connected to the STM32H745XIH6 and STM32H750XBH6 SAI
interface. It communicates with the STM32H745XIH6 and STM32H750XBH6 microcontrollers via an I2C bus
shared with the touch panel of the RGB LCD, ARDUINO®, and STMod+ connectors.
• The analog input line is connected to the audio codec ADC through the blue audio jack (CN8).
• The analog output line is connected to the audio codec DAC via the green audio jack (CN9).
• Two external speakers can be connected to the audio codec via CN18 for the left speaker and CN17 for
the right speaker.
• The STM32H745I-DISCO and STM32H750B-DK feature one digital ST MEMS microphone. It is connected
to the digital microphone input of the STM32H745XIH6/STM32H750XBH6 and managed by the PDM
functionality.
6.9 eMMC
The STM32H745I-DISCO and STM32H750B-DK embed a 4-Gbyte eMMC chip. It is connected to the
STM32H745XIH6 and STM32H750XBH6 SDMMC1 port.
6.10 Ethernet
The STM32H745I-DISCO and STM32H750B-DK boards support 10/100 Mbit/s Ethernet communications by a
PHY, which supports IEEE 802.3az Energy Efficient Ethernet (EEE) and integrated RJ45 connector CN1. The
Ethernet PHY is connected to the STM32H745XIH6/STM32H750XBH6 microcontroller through an MII interface.
The PHY 25 MHz clock is generated from the X1 oscillator, while the STM32H745XIH6/STM32H750XBH6
50 MHz clock is generated by the PHY MII_REF_CLK.
Half-duplex operation
With default settings, Ethernet half-duplex operation does not work due to I/O multiplexing between Ethernet
MII_CRS and MII_COL, and Q-SPI flash memory QSPI_BK2_IO0 and QSPI_BK2_IO1. Table 5 shows the
possible settings of all solder bridges or resistors associated with Ethernet on the boards.
Solder bridges /
Setting Configuration
Resistors
Default setting.
SB3 and SB4 OFF
PH2 and PH3 are connected to the Q-SPI flash memory. Ethernet
R38 and R40 ON
SB3, SB4, R38, R40 half‑duplex operation is not supported.
SB3 and SB4 ON PH2 and PH3 are connected to the Ethernet PHY. Ethernet half-duplex
R38 and R40 OFF operation is supported.
6.12 SDRAM
A 128-Mbit SDRAM is connected to the STM32H745XIH6/STM32H750XBH6 FMC interface.
Limitation: Only half of the memory density is available by hardware design.
One twin Quad-SPI flash U1: 1-Gbit Quad-SPI NOR flash memory • R53/R62/R54/R56/R60/SB8/SB48 ON
memory U2: - • R14/R3/R2/R9/SB2/C15 OFF
7 Connectors
Connector Pin Pin MCU pin Function Function MCU pin Pin Pin Connector
number name name number
1. Supports analog input only. The current capability is limited to 1 mA when used as digital output or input.
1 VBUS 4 ID
2 D- 5 GND
3 D+ - -
1 Tx+ 7 Nc7
2 Tx- 8 Nc8
3 Rx+ 9 K, yellow LED
4 Nc4 10 A, yellow LED
5 Nc5 11 K, green LED
6 Rx- 12 A, green LED
Pin number Description Pin connection Pin number Description Pin connection
1 LCD_BL_K - 2 LCD_BL_A -
3 GND - 4 VDD -
5 LCD_R0 PI15 6 LCD_R1 PJ0
7 LCD_R2 PJ1 8 LCD_R3 PH9
9 LCD_R4 PJ3 10 LCD_R5 PJ4
11 LCD_R6 PJ5 12 LCD_R7 PJ6
13 LCD_G0 PJ7 14 LCD_G1 PJ8
15 LCD_G2 PJ9 16 LCD_G3 PJ10
17 LCD_G4 PJ11 18 LCD_G5 PI0
19 LCD_G6 PI1 20 LCD_G7 PK2
21 LCD_B0 PJ12 22 LCD_B1 PJ13
23 LCD_B2 PJ14 24 LCD_B3 PJ15
25 LCD_B4 PK3 26 LCD_B5 PK4
27 LCD_B6 PK5 28 LCD_B7 PK6
29 GND - 30 LCD_CLK PI14
31 LCD_DISP PD7 32 LCD_HSYNC PI12
33 LCD_VSYNC PI9 34 LCD_DE PK7
35 GND - 36 GND -
37 LCD_RST - 38 LCD_INT PG2
39 LCD_SCL PD12 40 LCD_SDA PD13
1 VDD 10 RESET#
2 SWDIO(PA13) 9 NA
3 GND 8 TDI(PA15)
4 SWCLK(PA14) 7 NA
5 GND 6 SWO(PB3)
1 NC 8 T_SWO
2 NC 9 NC
3 3V3 10 T_JTDI
4 T_SWDIO 11 GNDDETECT
5 GND 12 T_NRST
6 T_SWCLK 13 T_VCP_RX
7 GND 14 T_VCP_TX
1 VBUS 4 NC
2 NC 5 GND
3 NC - -
PA0 N5 STMOD#1-CTS
PA1 N4 MII_RX_CLK
PA2 N3 MII_MDIO
PA3 U2 STMOD#14-PWM
PA4 U3 STMOD#13-ADC
PA5 T3 OTG_FS2_PSO
PA6 R3 ARD_D3
PA7 R5 MII_RX_DV
PA8 E5 ARD_D5
PA9 D15 VBUS_FS2
PA10 D14 USB_OTG_FS2_ID
PA11 E17 USB_OTG_FS2_N
PA12 E16 USB_OTG_FS2_P
PA13 C15 SWDIO
PA14 B14 SWCLK
PA15 A14 STMOD#1_SPI_CS or T_JTDI
PB0 U5 MII_RXD2
PB1 T5 MII_RXD3
PB2 R6 MII_TX_ER
PB3 C6 SWO
PB4 B7 ARD_D10
PB5 A5 FDCAN2_RX
PB6 B5 ARD_D1
PB7 C5 ARD_D0
PB8 D5 SDIO1_D4
PB9 D4 SDIO1_D5
PB10 P11 VCP_TX (USART3)
PB11 P12 VCP_RX (USART3)
PB12 T14 LCD_RST
PB13 U14 FDCAN2_TX
PB14 U15 STMOD#9-MISOs
PB15 T15 ARD_D11
PC0 L2 ARD_A0
PC1 M2 MII_MDC
PC2 M3 MII_TXD2
PC3 M4 MII_TX_CLK
PC4 T4 MII_RXD0
PC5 U4 MII_RXD1
R2 N8 VDDIO1
R3 M5 VDDIO2
R4 U12 VDDIO33_LDO1
R5 C17 VDDIO33_LDO2
R6 A6 VDDIO33_LDO3
R7 G17 VDD50_USB
R8 F17 VDD_USB33
- L1 VDDA
- M1 VREF+
- B1 VBAT
- A1 VSS
- C10 VSS
- C13 VSS
- C16 VSS
- G16 VSS
- J3 VSS
- N16 VSS
- U17 VSS
- T12 VSS
- R8 VSS
- L9 VSS
- L11 VSS
- K10 VSS
- K11 VSS
- A17 VSS
- L10 VSS
- B6 VSS
- B2 VSS
- R2 VSS
- G7 VSS
- G8 VSS
- G9 VSS
- G10 VSS
- G11 VSS
- H7 VSS
- H8 VSS
- H9 VSS
- H10 VSS
- H11 VSS
- J7 VSS
- J8 VSS
- J9 VSS
- J10 VSS
- J11 VSS
- K7 VSS
- K8 VSS
- K9 VSS
- L7 VSS
- L8 VSS
- U1 VSS
- P1 VSSA
- N1 VREF-
- P17 VDD33_DSI
- N17 VDD12_DSI_CAP
- J16 VSSDSI1
- J17 VSSDSI2
- K15 VSSDSI3
- L15 VSSDSI4
- M15 VSSDSI5
1. For 10 Mbit/s half-duplex MII communication, SB3 and SB4 must be ON.
• Main board featuring the target device: product order code, product identification, serial number, and board reference
with revision.
Single-sticker example:
Dual-sticker example:
• Other boards if any: board reference with revision and serial number.
Examples:
MBxxxx-Variant-yzz
DT76507V1
DT76508V1
or or or
syywwxxxxx syywwxxxxx
MBxxxx-Variant-yzz
On the main board sticker, the first line provides the product order code, and the second line the product
identification.
On all board stickers, the line formatted as “MBxxxx-Variant-yzz” shows the board reference “MBxxxx”, the
mounting variant “Variant” when several exist (optional), the PCB revision “y”, and the assembly revision “zz”, for
example B01. The other line shows the board serial number used for traceability.
Products and parts labeled as “ES” or “E” are not yet qualified or feature devices that are not yet qualified.
STMicroelectronics disclaims any responsibility for consequences arising from their use. Under no circumstances
will STMicroelectronics be liable for the customer's use of these engineering samples. Before deciding to use
these engineering samples for qualification activities, contact STMicroelectronics' quality department.
“ES” or “E” marking examples of location:
• On the targeted STM32 that is soldered on the board (for an illustration of STM32 marking, refer to the
STM32 datasheet Package information paragraph at the www.st.com website).
• Next to the ordering part number of the evaluation tool that is stuck, or silk-screen printed on the board.
Some boards feature a specific STM32 device version, which allows the operation of any bundled commercial
stack/library available. This STM32 device shows a “U” marking option at the end of the standard part number
and is not available for sales.
To use the same commercial stack in their applications, the developers might need to purchase a part number
specific to this stack/library. The price of those part numbers includes the stack/library royalties.
Order Product
Product details Product change description Product limitations
code identification
MCU:
• STM32H745XIH6 silicon
revision "V"
MCU errata sheet:
• STM32H745/747xI/G and
STM32H755/757xI device
DKH745IO$AT1 limitations (ES0445) Initial revision No limitation
Boards:
• MB1280-DEFAULT-B01
(STMod+ fan-out
expansion board)
• MB1381-H745XI-B01
(main board)
MCU:
• STM32H745XIH6 silicon
revision "V"
MCU errata sheet:
• STM32H745/747xI/G and • Packaging: plastic blister
STM32H755/757xI device replaced by a carton box
DKH745IO$AT2 limitations (ES0445) • Main board revision changed No limitation
• STMod+ fan-out expansion
STM32H745I-DISCO
Order Product
Product details Product change description Product limitations
code identification
STM32H745I-DISCO
Boards:
• MB1280-3V3-C01
DK32H745I$AT4 (STMod+ fan-out Main board revision changed No limitation
expansion board)
• MB1381-H745XI-B04
(main board)
MCU:
• STM32H750XBH6 silicon
revision "V"
MCU errata sheet:
• STM32H750xB and
STM32H753xI device
DK32H750B$AT1 limitations (ES0396) Initial revision No limitation
Boards:
• MB1280-DEFAULT-B01
(STMod+ fan-out
expansion board)
STM32H750B-DK
• MB1381-H750XB-B01
(main board)
MCU:
• STM32H750XBH6 silicon
revision "V"
MCU errata sheet:
• Packaging: plastic blister
• STM32H750xB and replaced by a carton box
STM32H753xI device • Board stickers format changed
DK32H750B$AT2 limitations (ES0396) No limitation
• Main board revision changed
Boards: • STMod+ fan-out expansion
board revision changed
• MB1280-3V3-C01
(STMod+ fan-out
expansion board)
• MB1381-H750XB-B04
(main board)
Part 15.21
Any changes or modifications to this equipment not expressly approved by STMicroelectronics may cause
harmful interference and void the user's authority to operate this equipment.
Part 15.105
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part
15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference
when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate
radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause
harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause
harmful interference in which case the user will be required to correct the interference at his own expense.
Francesco Doddo
STMicroelectronics, Inc.
200 Summit Drive | Suite 405 | Burlington, MA 01803
USA
Telephone: +1 781-472-9634
ISED Canada ICES-003 Compliance Label: CAN ICES-3 (A) / NMB-3 (A).
Étiquette de conformité à la NMB-003 d'ISDE Canada : CAN ICES-3 (A) / NMB-3 (A).
11 CE conformity
11.1 Warning
EN 55032 / CISPR32 (2012) Class A product
Warning: this device is compliant with Class A of EN55032 / CISPR32. In a residential environment, this
equipment may cause radio interference.
Avertissement : cet équipement est conforme à la Classe A de la EN55032 / CISPR 32. Dans un environnement
résidentiel, cet équipement peut créer des interférences radio.
12 Product disposal
This symbol on the product, accessories, or accompanying documents indicates that the
product and its electronic accessories should not be disposed of with household waste at the
end of their working life.
To prevent possible harm to the environment and human health from uncontrolled waste
disposal, please separate these items from other type of waste and recycle them responsibly
to the designated collection point to promote the sustainable reuse of material resources.
Household users:
You should contact either the retailer where you buy the product or your local authority for
further details of your nearest designated collection point.
Business users:
You should contact your dealer or supplier for further information.
Revision history
Table 20. Document revision history
Updated the descriptions of pins ARD_D0 and ARD_D1 of ARDUINO® connector CN6 in Figure 29.
ARDUINO® connectors and correspondingly in Table 6. ARDUINO® connectors (CN2, CN3, CN6,
12-Sep-2019 4 and CN7).
Updated all schematics related to STM32H745I-DISCO in Section 9 Electrical schematics.
Updated SMPS/LDO power supply in Section 6.4 Power supply for hardware/firmware mismatch
31-Jan-2020 5
deadlock recovery.
Updated for Ethernet half-duplex support:
• Updated Section 6.10 Ethernet
• Updated PH2 and PH3 in Table 16. STM32H745I-DISCO and STM32H750B-DK I/O
assignment
21-Apr-2020 6 Updated the document structure:
• Updated Federal Communications Commission (FCC) and Industry Canada (IC) Compliance
Statements
• Added CE conformity
• Removed Electrical schematics
Updated LEDs LD6 and LD7 in Table 6. Assignment of control ports to LED.
27-Apr-2021 7 Added Section 9 STM32H745I-DISCO and STM32H750B-DK product information and included
Product marking within.
Updated Figure 4 and Figure 5.
9-Sep-2021 8 Added limitation to pins A[2...5] of ARDUINO® connector CN7 in Table 7. ARDUINO® connectors
(CN2, CN3, CN6, and CN7).
Updated Product marking, STM32H745I-DISCO and STM32H750B-DK product history, and Board
revision history.
Updated Federal Communications Commission (FCC) and ISED Canada Compliance Statements.
Updated the section titles of STM32H745I-DISCO and STM32H750B-DK layout and
STM32H745IDISCO and STM32H750B-DK mechanical drawing.
16-Dec-2022 9
Updated Figure 4 and Figure 5.
Updated Power supply, Audio, USB OTG FS, Ethernet, SDRAM, and Quad-SPI NOR flash memory.
Updated USB Type-B to Micro-B in CN14 STLINK-V3E USB Micro-B connector.
Updated Features, Ordering information, and Development environment.
Added Safety recommendations and Product disposal.
24-Apr-2025 10 Updated Ordering information, Power supply, SDRAM, STMod+ connector (P1), STM32H745I-
DISCO and STM32H750B-DK I/O assignment, ARDUINO® connectors (CN2, CN3, CN6, and CN7),
and STM32H745I-DISCO and STM32H750B-DK product information.
Contents
1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Codification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3 Development environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.1 System requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.2 Development toolchains . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.3 Demonstration software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3.4 EDA resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
4 Conventions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
5 Safety recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.1 Targeted audience. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.2 Handling the board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5.3 Delivery recommendations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
6 Hardware layout and configuration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6.1 STM32H745I-DISCO and STM32H750B-DK layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6.2 STM32H745I-DISCO and STM32H750B-DK mechanical drawing . . . . . . . . . . . . . . . . . . . . . 10
6.3 Embedded STLINK-V3E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6.4 Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6.5 Clock sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.6 Reset sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.7 Audio. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.8 USB OTG FS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.9 eMMC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.10 Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.11 Power over Ethernet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.12 SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.13 Quad-SPI NOR flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.14 Virtual COM port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6.15 RGB LCD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6.16 Buttons and LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7 Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
7.1 ARDUINO® Uno V3 connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.2 USB OTG FS Micro-AB connector (CN13) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
7.3 Ethernet RJ45 connector (CN1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
List of tables
Table 1. List of available products. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Table 2. Codification explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Table 3. ON/OFF convention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 4. Power-supply-related jumper and solder bridge settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 5. Ethernet-related solder bridge and resistor settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 6. Quad-SPI flash memory configuration settings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 7. Assignment of control ports to LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 8. ARDUINO® connectors (CN2, CN3, CN6, and CN7). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Table 9. USB OTG FS Micro-AB connector (CN13) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 10. Ethernet RJ45 connector (CN1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 11. RGB LCD connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 12. STMod+ connector (P1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 13. USB Micro-B connector (CN14) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 14. TAG connector (CN16) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 15. STDC14 connector (CN4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 16. USB Micro-B connector (CN15) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 17. STM32H745I-DISCO and STM32H750B-DK I/O assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 18. Product history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 19. Board revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Table 20. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
List of figures
Figure 1. STM32H745I-DISCO and STM32H750B-DK main boards (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 2. STM32H745I-DISCO and STM32H750B-DK main boards (bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figure 3. Hardware block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. STM32H745I-DISCO and STM32H750B-DK Discovery main board top layout . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 5. STM32H745I-DISCO and STM32H750B-DK Discovery main board bottom layout. . . . . . . . . . . . . . . . . . . . . . 9
Figure 6. STM32H745I-DISCO and STM32H750B-DK Discovery main board mechanical drawing (bottom view) . . . . . . 10
Figure 7. USB OTG Micro-AB connector (CN13) front view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 8. Ethernet RJ45 connector (CN1) front view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 9. RGB LCD connector (footprint) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 10. USB Micro-B connector (CN14) front view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 11. TAG debugging connector (CN16) top view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 12. USB Micro-B connector (CN15) front view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22