PN7150
PN7150
1 Introduction
This document describes the functionality and electrical specification of the NFC Controller PN7150.
Additional documents describing the product functionality further are available for design-in support. Refer to the
references listed in this document to get access to the full documentation provided by NXP.
NXP Semiconductors
PN7150
High performance NFC controller with integrated firmware, supporting all NFC Forum modes
2 General description
Plug´n play and high-performance full NFC solution PN7150 is a full NFC controller solution with integrated
firmware and NCI interface designed for contactless communication at 13.56 MHz. It is compatible with NFC
forum requirements.
PN7150 is designed based on learnings from previous NXP NFC device generation. It is the ideal solution for
rapidly integrating NFC technology in any application, especially those running O/S environment like Linux and
Android, reducing Bill of Material (BOM) size and cost, thanks to:
• Full NFC forum compliancy (see [1]) with small form factor antenna
• Embedded NFC firmware providing all NFC protocols as pre-integrated feature
2
• Direct connection to the main host or microcontroller, by I C-bus physical and NCI protocol
• Ultra-low power consumption in polling loop mode
• Highly efficient integrated power management unit (PMU) allowing direct supply from a battery
PN7150 embeds a new generation RF contactless front-end supporting various transmission modes according
to NFCIP-1 and NFCIP-2, ISO/IEC 14443, ISO/IEC 15693, MIFARE Classic IC-based card and FeliCa card
specifications. It embeds an Arm Cortex-M0 microcontroller core loaded with the integrated firmware supporting
the NCI 1.0 host communication. It also allows to provide a higher output power by supplying the transmitter
output stage from 3.0 V to 4.75 V.
The contactless front-end design brings a major performance step-up with on one hand a higher sensitivity and
on the other hand the capability to work in active load modulation communication enabling the support of small
antenna form factor.
Figure 1 lists the supported transmission modes. For contactless card functionality, the PN7150 can act
autonomously if previously configured by the host in such a manner.
PN7150 integrated firmware provides an easy integration and validation cycle as all the NFC real-time
constraints, protocols and device discovery (polling loop) are being taken care internally. In few NCI commands,
host SW can configure the PN7150 to notify for card or peer detection and start communicating with them.
Sony FeliCa(1)
aaa-023871
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PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
4 Applications
• All devices requiring NFC functionality especially those running in an Android or Linux environment
• TVs, set-top boxes, blu-ray decoders, audio devices
• Home automation, gateways, wireless routers
• Home appliances
• Wearables, remote controls, healthcare, fitness
• Printers, IP phones, gaming consoles, accessories
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
Ptot total power dissipation Reader; IVDD(TX) = 100 mA;VBAT = 5.5 V - - 420 mW
Tamb ambient temperature JEDEC PCB-0.5 -30 - +85 °C
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6 Versions
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
7 Ordering information
Table 2. Ordering information
Type number Package
Name Description Version
[1]
PN7150B0HN/C110xx HVQFN40 plastic thermal enhanced very thin quad flat SOT618-1
package; no leads; 40 terminals; body; 6 mm × 6
mm × 0.85 mm
[1]
PN7150B0UK/C110xx WLCSP42 wafer level chip-scale package; 42 bumps; 2.88 mm SOT1459-1
× 2.80 mm × 0.54 mm (Backside coating included)
Do not use for new designs. Planned for
discontinuation.
The product version C11006 does not support the standby mode. The standby is not supported, also
during the polling sequence.
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8 Marking HVQFN40
Terminal 1 index area
A:7 A:7
B1 : 6
B2 : 6
B1 : 6
C:7
C:7
0 5
aaa-007965 aaa-038147
Figure 2. PN7150 package marking HVQFN40 (top view) Figure 3. PN7150 package marking HVQFN40 (top view)
4 lines 3 lines
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9 Marking WLCSP42
aaa-028702
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10 Block diagram
DRIVER TxCtrl
ARM DATA
CORTEX M0 MEMORY
PLL BG
SRAM
VMID
EEPROM
AHB to APB
MEMORY
CONTROL
CODE
POWER MISCELLANEOUS CLOCK MANAGEMENT UNIT MEMORY
MANAGEMENT UNIT
OSCILLATOR OSCILLATOR ROM
TIMERS
BATTERY 380 kHz 40 MHz
MONITOR
CRC FRACN QUARTZ
EEPROM
4.5 V 1.8 V COPROCESSOR PLL OSCILLATOR
TX-LDO DSLDO
RANDOM
NUMBER
GENERATOR
aaa-016737
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11 Pinning information
37 NFC_CLK_XTAL2
36 NFC_CLK_XTAL1
40 CLK_REQ
terminal 1
35 n.c.
34 n.c.
33 n.c.
32 n.c.
31 n.c.
39 i.c.
38 i.c.
index area
I2CADR0 1 30 VDDD
i.c. 2 29 VDD
I2CADR1 3 28 VDDA
VSS(PAD) 4 27 VSS
I2CSDA 5 26 VBAT
PN7150
VDD(PAD) 6 25 i.c.
I2CSCL 7 24 i.c.
IRQ 8 23 i.c.
VSS 9 VSS 22 VDD(TX_IN)
VEN 10 21 TX1
VBAT2 12
VBAT1 13
VDD(TX) 14
RXN 15
RXP 16
VDD(MID) 17
TX2 18
VSS(TX) 19
n.c. 20
i.c. 11
Figure 6. Pinning
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ball A1 1 2 3 4 5 6 7
index area
aaa-007576
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
12 Functional description
2
PN7150 can be connected on a host controller through I C-bus. The logical interface towards the host
baseband is NCI-compliant [2] with additional command set for NXP-specific product features. This IC is fully
user controllable by the firmware interface described in [5].
Moreover, PN7150 provides flexible and integrated power management unit in order to preserve energy
supporting Power Off mode.
In the following chapters you will find also more details about PN7150 with references to very useful application
note such as:
• PN7150 User Manual ([5]):
User Manual describes the software interfaces (API) based on the NFC forum NCI standard. It does give full
description of all the NXP NCI extensions coming in addition to NCI standard ([2]).
• PN7150 Hardware Design Guide ([6]):
Hardware Design Guide provides an overview on the different hardware design options offered by the IC and
provides guidelines on how to select the most appropriate ones for a given implementation. In particular, this
document highlights the different chip power states and how to operate them in order to minimize the average
NFC-related power consumption so to enhance the battery lifetime.
• PN7150 Antenna and Tuning Design Guide ([7]):
Antenna and Tuning Design Guide provides some guidelines regarding the way to design an NFC antenna for
the PN7150 chip.
It also explains how to determine the tuning/matching network to place between this antenna and the PN7150.
Standalone antenna performances evaluation and final RF system validation (PN7150 + tuning/matching
network + NFC antenna within its final environment) are also covered by this document.
• PN7150 Low-Power Mode Configuration ([10]):
Low-Power Mode Configuration documentation provides guidance on how PN7150 can be configured in order
to reduce current consumption by using Low-power polling mode.
BATTERY/PMU
host interface
HOST control
NFCC
CONTROLLER
ANTENNA
MATCHING
aaa-016739
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Note: To avoid data corruption inside the EEPROM memory, make sure to follow these rules:
• Prevent re-applying RF settings configuration when not required (different possibilities of implementation exist
depending on the integration environment, please contact NXP support for more details).
• Insure RF settings configuration is not interrupted (no interruption between related
CORE_SET_CONFIG_CMD and CORE_SET_CONFIG_RSP).
• Split the RF settings configuration into several CORE_SET_CONFIG_CMD to limit the time for the FW
to treat this command. Only one transferred RF parameter via the CORE_SET_CONFIG_CMD takes
approximately 2.7ms. 5.4ms in the specific case where the RF parameter resides in two separated Flash
memory blocks, which increase the probability for an interruption between CORE_SET_CONFIG_CMD and
CORE_SET_CONFIG_RSP.
• It must be ensured that the RF settings configuration will not be interrupted due to a power off or hardware
reset. Once the memory is corrupted, the IC cannot recover from this stage and cannot be used anymore.
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
Table 8 summarizes the system power mode of the PN7150 depending on the status of the external supplies
available in the system:
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
At application level, the PN7150 will continuously switch between different states to optimize the current
consumption (polling loop mode). Refer to Table 1 for targeted current consumption in here described states.
The PN7150 is designed to allow the host controller to have full control over its functional states, thus of
the power consumption of the PN7150 based NFC solution and possibility to restrict parts of the PN7150
functionality.
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
Poller mode
In this mode, PN7150 is acting as Reader/Writer or NFC Initiator,
searching for or communicating with passive tags or NFC target. Once
RF communication has ended, PN7150 will switch to active battery
mode (that is, switch off RF transmitter) to save energy. Poller mode
shall be used with 2.7 V < VBAT < 5.5 V and VEN voltage > 1.1 V.
Poller mode shall not be used with VBAT < 2.7 V. VDD(PAD) is within its
operational range (see Table 1).
Listener mode
In this mode, PN7150 is acting as a card or as an NFC Target. Listener
mode shall be used with 2.3 V < VBAT < 5.5 V and VEN voltage > 1.1 V.
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Listening phase
Emulation
Pause
Type A
Type B
Type F
@424
Type F
@212
ISO15693
Polling phase
aaa-016741
Listening phase uses Standby power state (when no RF field) and PN7150 goes to Listener mode when RF
field is detected. When in Polling phase, PN7150 goes to Poller mode.
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To further decrease the power consumption when running the polling loop, PN7150 features a low-power
RF polling. When PN7150 is in Polling phase instead of sending regularly RF command, PN7150 senses
with a short RF field duration if there is any NFC Target or card/tag present. If yes, then it goes back to
standard polling loop. With 500 ms (configurable duration, see [5]) listening phase duration, the average power
consumption is around 150 μA.
Listening phase
Emulation
Pause
Polling phase
aaa-016743
12.2 Microcontroller
PN7150 is controlled via an embedded ARM Cortex-M0 microcontroller core.
PN7150 features integrated in firmware are referenced in [5].
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
2
12.3.1 I C-bus interface
2 2
The I C-bus interface implements a slave I C-bus interface with integrated shift register, shift timing generation
and slave address recognition.
2
I C-bus Standard mode (100 kHz SCL), Fast mode (400 kHz SCL) and High-speed mode (3.4 MHz SCL) are
supported.
2
The mains hardware characteristics of the I C-bus module are:
2
• Support slave I C-bus
• Standard, Fast and High-speed modes supported
• Wake-up of PN7150 on its address only
• Serial clock synchronization can be used by PN7150 as a handshake mechanism to suspend and resume
serial transfer (clock stretching)
2 2
The I C-bus interface module meets the I C-bus specification [4] except General call, 10-bit addressing and
Fast mode Plus (Fm+).
2
12.3.1.1 I C-bus configuration
2 2 2
The I C-bus interface shares four pins with I C-bus interface also supported by PN7150. When I C-bus is
configured in EEPROM settings, functionality of interface pins changes to one described in Table 10.
2
Table 12. Functionality for I C-bus interface
Pin name Functionality
2
I2CADR0 I C-bus address 0
2
I2CADR1 I C-bus address 1
2
I2CSCL
[1] I C-bus clock line
2
I2CSDA
[1] I C-bus data line
[1] I2CSCL and I2CSDA are not fail-safe and VDD(pad) shall always be available when using the SCL and SDA
lines connected to these pins.
2
PN7150 supports 7-bit addressing mode. Selection of the I C-bus address is done by 2-pin configurations on
top of a fixed binary header: 0, 1, 0, 1, 0, I2CADR1, I2CADR0, R/W.
2
Table 13. I C-bus interface addressing
2 2
I2CADR1 I2CADR0 I C-bus address I C-bus address
(R/W = 0, write) (R/W = 1, read)
0 0 0x50 0x51
0 1 0x52 0x53
1 0 0x54 0x55
1 1 0x56 0x57
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PN7150
NFC_CLK_XTAL1 NFC_CLK_XTAL2
crystal
c c
27.12 MHz
aaa-016745
Table 14 describes the levels of accuracy and stability required on the crystal.
[1] This requirement is according to FCC regulations requirements. To meet only ISO/IEC 14443 and ISO/IEC 18092, then ± 14 kHz apply.
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
dBc/Hz
-20dBc/Hz
Input reference
noise floor
-140 dBc/Hz
This phase noise is equivalent to an RMS jitter of 6.23 ps from 10 Hz to 1 MHz. For configuration of input
frequency, refer to [9]. Thee six pre-programmed and validated frequencies for the PLL are: 13 MHz, 19.2 MHz,
24 MHz, 26 MHz, 38.4 MHz and 52 MHz.
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[1] This requirement is according to FCC regulations requirements. To meet only ISO/IEC 14443 and ISO/IEC 18092, then ± 400 ppm limits apply.
For detailed description of clock request mechanisms, refer to [5] and [6].
DSLDO
BANDGAP VDD(TX)
TXLDO
NFCC
aaa-016748
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12.5.3 TXLDO
Transmitter voltage can be generated by internal LDO (VDD(TX)) or come from an external supply source
VDD(TX).
The regulator has been designed to work in two configurations:
12.5.3.1 Configuration 1: supply connection in case the battery is used to generate RF field
The Low drop Out Regulator has been designed to generate a 3.0 V, 3.3 V or 3.6 V supply voltage to a
transmitter with a current load up to 180 mA.
The output is called VDD(TX). The input supply voltage of this regulator is a battery voltage connected to VBAT1
pin.
VBAT1
BATTERY
VBAT2
NFCC
VDD(TX)
VDD(TX_IN)
aaa-017002
VDD(TX) value shall be chosen according to the minimum targeted VBAT value for which reader mode shall work.
• If VBAT is above 3.0 V plus the regulator voltage dropout, then VDD(TX) = 3.0 V shall be chosen:
• If VBAT is above 3.3 V plus the regulator voltage dropout, then VDD(TX) = 3.3 V shall be chosen:
• If VBAT is above 3.6 V plus the regulator voltage dropout, then VDD(TX) = 3.6 V shall be chosen:
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
5.0 V
VB
AT
3.6 V
Drop = 1 Ω * load
3.3 V
3.0 V
2.8 V
4.5 V 3.6 V 3.3 V 3.0 V 2.8 V
aaa-014174
Figure 16 shows VDD(TX) offset disabled behavior for both cases of VDD(TX) programmed for 3.0 V, 3.3 V or
3.6 V.
In Standby state, whenever VDD(TX) is configured for 3.0 V, 3.3 V or 3.6 V, VDD(TX) is regulated at 2.5 V.
VBAT
2.5 V
2.5 V
aaa-009463
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VBAT1
EXTERNAL 5 V
VBAT2
BATTERY
NFCC
VDD(TX)
VDD(TX_IN)
aaa-017003
5.5 V VBAT1
4.75 V
VDD(TX)
4.5 V
Drop = 1 * load
aaa-017004
Figure 19. VDD(TX) behavior when PN7150 is supply using external supply on VBAT1
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VBAT
enable
VBAT
EEPROM REGISTERS
MONITOR
threshold
selection
SYSTEM
low power MANAGEMENT
POWER
VDD
MANAGEMENT
VDDD
power off
POWER SWITCHES
DVDD_CPU DIGITAL
(memories, cpu,
etc,...)
aaa-013868
The value of the critical level can be configured to 2.3 V or 2.75 V by an EEPROM setting. This value has a
typical hysteresis around 150 mV.
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VBAT
VDD(PAD)
host
VEN tw(VEN) tboot communication
possible
aaa-015878
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VBAT
VDD(PAD)
tt(VDD(PAD)-VEN) tboot
host
VEN communication
possible
aaa-015879
VBAT
tt(VBAT-VEN)
VDD(PAD)
tboot
host
VEN communication
possible
aaa-015881
Figure 23. VDD(PAD) and VBAT are set up at the same time
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12.6.2.3 PN7150 has been enabled before VDD(PAD) is set up or before VDD(PAD) has been cut off
This can be the case when VBAT pin is directly connected to the battery and when VDD(PAD) is generated from a
PMU. When the battery voltage is too low, then the PMU might no more be able to generate VDD(PAD). When the
device gets charged again, then VDD(PAD) is set up again.
As the pins to select the interface are biased from VDD(PAD), when VDD(PAD) disappears the pins might not be
correctly biased internally and the information might be lost. Therefore it is required to make the IC boot after
VDD(PAD) is set up again.
VBAT
VDD(PAD)
tt(VDD(PAD)-VEN) tboot
host
VEN tW(VEN) communication
possible
aaa-015884
Figure 24. VDD(PAD) is set up or cut-off after PN7150 has been enabled
tVBAT(L)
VBAT
t > 0 ms t > 0 ms
(nice to have)
VEN
VDD(PAD)
aaa-015886
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12.7.1.1 Communication mode for ISO/IEC 14443 type A, MIFARE Classic and Jewel/Topaz
PCD
The ISO/IEC 14443A and MIFARE Classic PCD communication mode is the general reader to card
communication scheme according to the ISO/IEC 14443A specification. This modulation scheme is as well used
for communications with Jewel/Topaz cards.
Figure 26 describes the communication on a physical level, the communication table describes the physical
parameters (the numbers take the antenna effect on modulation depth for higher data rates).
PCD to PICC
100 % ASK at 106 kbit/s
> 25 % ASK at 212, 424 or 848 kbit/s
Modified Miller coded
NFCC PICC (Card)
PICC to PCD,
subcarrier load modulation
ISO/IEC 14443A - Manchester coded at 106 kbit/s
MIFARE Classic BPSK coded at 212, 424 or 848 kbit/s ISO/IEC 14443A -
PCD mode MIFARE Classic
aaa-016749
Figure 26. Read/write mode for ISO/IEC 14443 type A and read/write mode for MIFARE Classic
Table 16. Communication overview for ISO/IEC 14443 type A and read/write mode for MIFARE Classic
Communication ISO/IEC 14443A/ ISO/IEC 14443A higher transfer speeds
direction MIFARE Classic/
Jewel/ Topaz
Transfer speed 106 kbit/s 212 kbit/s 424 kbit/s 848 kbit/s
Bit length (128/13.56) μs (64/13.56) μs (32/13.56) μs (16/13.56) μs
PN7150 → PICC
(data sent by PN7150 to a modulation on 100 % ASK > 25 % ASK > 25 % ASK > 25 % ASK
card) PN7150 side
bit coding Modified Miller Modified Miller Modified Miller Modified Miller
PICC → PN7150
(data received by PN7150 modulation on subcarrier load subcarrier load subcarrier load subcarrier load
from a card) PICC side modulation modulation modulation modulation
subcarrier 13.56 MHz/16 13.56 MHz/16 13.56 MHz/16 13.56 MHz/16
frequency
bit coding Manchester BPSK BPSK BPSK
The contactless coprocessor and the on-chip CPU of PN7150 handle the complete ISO/IEC 14443A and
MIFARE Classic RF-protocol, nevertheless a dedicated external host has to handle the application layer
communication.
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
PCD to PICC,
8 - 12 % ASK at 212 or 424 kbits/s
Manchester coded
NFCC PICC (Card)
PICC to PCD,
load modulation
ISO/IEC 18092 - FeliCa Manchester coded at 212 or 424 kbits/s FeliCa card
PCD mode
aaa-016750
The contactless coprocessor of PN7150 and the on-chip CPU handle the FeliCa protocol. Nevertheless a
dedicated external host has to handle the application layer communication.
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PCD to PICC,
8 - 14 % ASK at 106, 212, 424 or 848 kbit/s
NRZ coded
NFCC PICC (Card)
PICC to PCD,
subcarrier load modulation
ISO/IEC 14443 Type B BPSK coded at 106, 212, 424 or 848 kbit/s ISO/IEC 14443 Type B
PCD mode
aaa-016751
The contactless coprocessor and the on-chip CPU of PN7150 handles the complete ISO/IEC 14443B RF-
protocol, nevertheless a dedicated external host has to handle the application layer communication.
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
VCD to VICC,
100 % ASK at 26.48 kbit/s
pulse position coded
NFCC Card
(VICC/TAG)
VICC to VCD,
subcarrier load modulation
ISO/IEC 15693 Manchester coded at 26.48 kbit/s ISO/IEC 15693
VCD mode
aaa-016752
Figure 29. R/W mode for NFC forum T5T communication diagram
Table 19. Communication overview for NFC forum T5T R/W mode
Communication direction
PN7150 → VICC
(data sent by PN7150 to a tag) transfer speed 26.48 kbit/s
bit length (512/13.56) μs
modulation on PN7150 side 100 % ASK
bit coding pulse position modulation 1 out of 4 mode
VICC → PN7150
(data received by PN7150 from a tag) transfer speed 26.48 kbit/s
bit length (512/13.56) μs
modulation on VICC side subcarrier load modulation
subcarrier frequency single subcarrier
bit coding Manchester
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BATTERY BATTERY
NFCC NFCC
HOST HOST
NFC Initiator: Passive or Active Communication modes NFC Target: Passive or Active Communication modes
aaa-016755
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power power
to generate for digital
the field processing
power power
for digital to generate
processing the field
aaa-016756
[1] This modulation index range is according to NFCIP-1 standard. It might be that some NFC forum type 3 cards does not withstand the full range as based
on FeliCa range which is narrow (8 % to 14 % ASK).
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power power
to generate for digital
the field processing
power power
to generate for digital
the field processing
aaa-016757
[1] This modulation index range is according to NFCIP-1 standard. It might be that some NFC forum type 3 cards does not withstand the full range as based
on FeliCa range which is narrow (8 % to 14 % ASK). To adjust the index, see [7].
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
13 Limiting values
Table 25. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDD(PAD) VDD(PAD) supply voltage supply voltage for host - 4.35 V
interface
VBAT battery supply voltage - 6 V
[1]
VESD electrostatic discharge voltage human body model (HBM) ; 1500 - 1.5 kV
Ω, 100 pF
[2]
charge device model (CDM) - 500 V
Tstg storage temperature -55 +150 °C
[3]
Ptot total power dissipation all modes - 600 mW
VRXN(i) RXN input voltage 0 2.5 V
VRXP(i) RXP input voltage 0 2.5 V
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15 Thermal characteristics
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16 Characteristics
[1] Refer to Section 12.1.2 for the description of the power modes.
[2] This is the same value for VBAT = 2.3 V when the monitor threshold is set to 2.3 V.
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2
16.2.5 I C-bus timings
2
Figure 33, Table 34, and Table 35 describe I C-bus timings and frequency specifications.
I2CSDA
tLOW
I2CSCL
aaa-017006
2
Figure 33. I C-bus timings
2
Table 34. High-speed mode I C-bus timings specification
Symbol Parameter Conditions Min Max Unit
2
fclk(I2CSCL) clock frequency on pin I C-bus SCL;Cb < 100 pF 0 3.4 MHz
I2CSCL
tSU;STA set-up time for a repeated Cb < 100 pF 160 - ns
START condition
tHD;STA hold time (repeated) START Cb < 100 pF 160 - ns
condition
tLOW LOW period of the SCL clock Cb < 100 pF 160 - ns
tHIGH HIGH period of the SCL clock Cb < 100 pF 60 - ns
tSU;DAT data set-up time Cb < 100 pF 10 - ns
tHD;DAT data hold time Cb < 100 pF 0 - ns
2
tr(I2CSDA) rise time on pin I2CSDA I C-bus SDA;Cb < 100 pF 10 80 ns
2
tf(I2CSDA) fall time on pin I2CSDA I C-bus SDA;Cb < 100 pF 10 80 ns
Vhys hysteresis voltage Schmitt trigger inputs;Cb < 0.1VDD(PAD) - V
100 pF
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2
Table 35. Fast mode I C-bus timings specification
Symbol Parameter Conditions Min Max Unit
2
fclk(I2CSCL) clock frequency on pin I2CSCL I C-bus SCL;Cb < 400 pF 0 400 kHz
tSU;STA set-up time for a repeated Cb < 400 pF 600 - ns
START condition
tHD;STA hold time (repeated) START Cb < 400 pF 600 - ns
condition
tLOW LOW period of the SCL clock Cb < 400 pF 1.3 - μs
tHIGH HIGH period of the SCL clock Cb < 400 pF 600 - ns
tSU;DAT data set-up time Cb < 400 pF 100 - ns
tHD;DAT data hold time Cb < 400 pF 0 900 ns
Vhys hysteresis voltage Schmitt trigger inputs;Cb < 0.1VDD(PAD) - V
400 pF
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17 Package outline
HVQFN40: plastic thermal enhanced very thin quad flat package; no leads;
40 terminals; body 6 x 6 x 0.85 mm SOT618-1
D B A
terminal 1
index area
A
A1
E c
detail X
e1
C
v C A B
e 1/2 e b y1 C y
w C
11 20
L
21
10
Eh e2
1/2 e
1
30
terminal 1
index area 40 31
Dh X
0 2.5 5 mm
max 1.00 0.05 0.30 0.2 6.1 4.25 6.1 4.25 0.5 4.5 4.5 0.5 0.1 0.05 0.05 0.1
mm nom 0.85 0.02 0.21 6.0 4.10 6.0 4.10 0.4
min 0.80 0.00 0.18 5.9 3.95 5.9 3.95 0.3
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. sot618-1_po
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WLCSP42: wafer level chip-scale package; 42 bumps; 2.88 x 2.80 x 0.54 mm (Backside coating included) SOT1459-1
D B A
ball A1
index area
A2
E A
A1
detail X
e1 C
Øv C A B
e b y
Øw C
F
e
E
D
e2
C
1/2 e
B
ball A1 1 2 3 4 5 6 7
index area X
0 3 mm
scale
Unit A A1 A2 b D E e e1 e2 v w y
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Moisture sensitivity precautions, as indicated on the packing, must be respected at all times.
PN7150 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.
Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 36.
peak
temperature
time
001aac844
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19 Abbreviations
Table 50. Abbreviations
Acronym Description
API Application Programming Interface
ASK Amplitude Shift keying
ASK modulation The ASK modulation index is defined as the voltage ratio (Vmax - Vmin)/
index (Vmax + Vmin) × 100%
Automatic device Detect and recognize any NFC peer devices (initiator or target) like: NFC
discovery initiator or target, ISO/IEC 14443-3, -4 Type A&B PICC, MIFARE Classic
and MIFARE Ultralight PICC, ISO/IEC 15693 VICC
BPSK Bit Phase Shift Keying
Card Emulation The IC is capable of handling a PICC emulation on the RF interface including
part of the protocol management. The application handling is done by the host controller
DEP Data Exchange Protocol
DSLDO Dual Supplied LDO
FW FirmWare
HPD Hard Power Down
LDO Low Drop Out
LFO Low Frequency Oscillator
MOSFET Metal Oxide Semiconductor Field Effect Transistor
MSL Moisture Sensitivity Level
NCI NFC Controller Interface
NFC Near Field Communication
NFCC NFC Controller, PN7150 in this data sheet
NFC Initiator Initiator as defined in ISO/IEC 18092 or ECma 340: NFCIP-1 communication
NFCIP NFC Interface and Protocol
NFC Target Target as defined in ISO/IEC 18092 or ECma 340: NFCIP-1 communication
NRZ Non-Return to Zero
P2P Peer to Peer
PCD Proximity Coupling Device. Definition for a Card reader/writer device
according to the ISO/IEC 14443 specification or MIFARE Classic
PCD -> PICC Communication flow between a PCD and a PICC according to the
ISO/IEC 14443 specification or MIFARE Classic
PICC Proximity Interface Coupling Card. Definition for a contactless Smart Card
according to the ISO/IEC 14443 specification or MIFARE Classic
PICC-> PCD Communication flow between a PICC and a PCD according to the
ISO/IEC 14443 specification or MIFARE Classic
PMOS P-channel MOSFET
PMU Power Management Unit
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20 References
[1] NFC Forum Device Requirements V1.3
[2] NFC Controller Interface (NCI) Technical Specification V1.0
[3] ISO/IEC 14443 parts 2: 2001 COR 1 2007 (01/11/2007), part 3: 2001 COR 1 2006 (01/09/2006) and part
4: 2nd edition 2008 (15/07/2008)
2
[4] UM10204 I C-bus Specification and User Manual (link)
[5] UM10936 - PN7150 User Manual (link)
[6] AN11756 - PN7150 Hardware Design Guide (link)
[7] AN11755 - PN7150 Antenna Design and Matching Guide (link)
[8] ISO/IEC 18092 (NFCIP-1) edition, 15/032013. This is similar to Ecma 340.
[9] ISO/IEC 15693 part 2: 2nd edition (15/12/2006), part 3: 1st edition (01/04/2001)
[10] AN11757 - PN7150 Low-Power Mode Configuration (link)
[11] ISO/IEC 21481 (NFCIP-2) edition, 01/07/2012. This is similar to Ecma 352.
[12] AN10365 - Surface Mount Reflow Soldering Description (link)
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21 Revision history
Table 51. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PN7150 v4.2 20240202 Product data sheet PN7150 v4.1
Modifications: • Section 8 "Marking HVQFN40": updated the firmware version.
• Section 9 "Marking WLCSP42": updated the firmware version.
PN7150 v4.1 20230127 Product data sheet - PN7150 v4.0
Modifications: • Statement added that "The product version C11006 does not support the standby mode. The
standby is not supported, also during the polling sequence. " in Section 6.1 and Section 7
PN7150 v4.0 20200625 Product data sheet - PN7150 v3.9
Modifications: • Included new product type PN7150B0HN/C11006
• Marked PN7150B0UK/C11002 to be come discontinued
• Added information about withdrawal of PN7150B0HN/C11004
PN7150 v3.9 20190828 Product data sheet - PN7150 v3.8
Modifications: • Added a version history of the different firmware versions, see Section 6
PN7150 v3.8 20181030 Product data sheet - PN7150 v3.7
Modifications: • Section 12 "Functional description": added a note regarding EEPROM memory.
PN7150 v3.7 20180424 Product data sheet - PN7150 v3.6
Modifications: • Section 12.6.1: fixed some cross references.
PN7150 v3.6 20171127 Product data sheet - PN7150 v3.5
Modifications: • Minor typos corrected.
• Included new product type PN7150B0UK/C11002
PN7150 v3.5 20171018 Product data sheet - PN7150 v3.4
Modifications: • Table 19 "Communication overview for NFC forum T5T R/W mode ": updated.
PN7150 v3.4 20171004 Product data sheet - PN7150 v3.3
Modifications: • Descriptive title updated
• Section 2: updated the figure.
• Updated MIFARE branding.
PN7150 v3.3 20160704 Product data sheet - PN7150 v3.2
Modifications: • Figure 1: updated.
• Section 12.7.1.4 "R/W mode for NFC forum Type 5 Tag": updated.
• Section 12.7.3 "Card communication modes": updated.
PN7150 v3.2 201600525 Product data sheet - PN7150 v3.1
PN7150 v3.1 20160511 Product data sheet - PN7150 v3.0
PN7150 v3.0 20151209 Product data sheet - PN7150 v2.1
PN7150 v2.1 20151127 Preliminary data sheet - PN7150 v2.0
PN7150 v2.0 20150701 Preliminary data sheet - PN7150 v1.2
PN7150 v1.2 20150625 Objective data sheet - PN7150 v1.1
PN7150 v1.1 20150212 Objective data sheet - PN7150 v1.0
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Legal information
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Tables
Tab. 1. Quick reference data .........................................5 Tab. 26. Operating conditions ....................................... 44
Tab. 2. Ordering information ..........................................7 Tab. 27. Thermal characteristics ................................... 45
Tab. 3. Marking codes ...................................................8 Tab. 28. Thermal characteristics ................................... 45
Tab. 4. WLCSP package marking (top view) .................9 Tab. 29. Current consumption characteristics for
Tab. 5. Pin description .................................................11 operating ambient temperature range ............. 46
Tab. 6. WLCSP package marking (top view) ...............13 Tab. 30. Battery voltage monitor characteristics ............46
Tab. 7. System power mode description ..................... 16 Tab. 31. Reset timing .................................................... 46
Tab. 8. System power modes configuration ................ 17 Tab. 32. Power-up timings ............................................ 46
Tab. 9. System power mode descriptions ................... 17 Tab. 33. Power-down timings ........................................ 47
Tab. 10. PN7150 power states ......................................18 Tab. 34. High-speed mode I2C-bus timings
Tab. 11. Functional modes in active state .....................19 specification .....................................................47
Tab. 12. Functionality for I2C-bus interface ...................22 Tab. 35. Fast mode I2C-bus timings specification .........48
Tab. 13. I2C-bus interface addressing .......................... 22 Tab. 36. Input clock characteristics on NFC_CLK_
Tab. 14. Crystal requirements ....................................... 23 XTAL1 when using PLL ...................................49
Tab. 15. PLL input requirements ................................... 24 Tab. 37. Pin characteristics for NFC_CLK_XTAL1
Tab. 16. Communication overview for ISO/IEC when PLL input ............................................... 49
14443 type A and read/write mode for Tab. 38. Pin characteristics for 27.12 MHz crystal
MIFARE Classic .............................................. 34 oscillator .......................................................... 49
Tab. 17. Overview for FeliCa Reader/ Tab. 39. PLL accuracy .................................................. 49
Writercommunication mode .............................35 Tab. 40. VEN input pin characteristics .......................... 50
Tab. 18. Overview for ISO/IEC 14443B Reader/ Tab. 41. pin characteristics for IRQ and CLK_REQ .......50
Writer communication mode ............................36 Tab. 42. Input pin characteristics for RXN and RXP ......51
Tab. 19. Communication overview for NFC forum Tab. 43. Output pin characteristics for TX1 and TX2 .....52
T5T R/W mode ................................................37 Tab. 44. Output resistance for TX1 and TX2 .................52
Tab. 20. Overview for Active communication mode .......39 Tab. 45. Input pin characteristics for I2CADR0 and
Tab. 21. Overview for passive communication mode .... 40 I2CADR1 ......................................................... 52
Tab. 22. Overview for NFC forum T4T, ISO/IEC Tab. 46. Pin characteristics for I2CSDA and I2CSCL ....53
14443A card mode ..........................................41 Tab. 47. Electrical characteristic of VDD ....................... 53
Tab. 23. Overview for NFC forum T4T, ISO/IEC Tab. 48. SnPb eutectic process (from J-STD-020D) ..... 57
14443B card mode ..........................................42 Tab. 49. Lead-free process (from J-STD-020D) ............ 57
Tab. 24. Overview for NFC forum T3T, Sony FeliCa Tab. 50. Abbreviations ...................................................59
card mode ....................................................... 42 Tab. 51. Revision history ...............................................62
Tab. 25. Limiting values ................................................ 43
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Figures
Fig. 1. PN7150 transmission modes ............................ 2 Fig. 20. Battery voltage monitor principle ..................... 29
Fig. 2. PN7150 package marking HVQFN40 (top Fig. 21. Resetting PN7150 via VEN pin ....................... 30
view) 4 lines ...................................................... 8 Fig. 22. VBAT is set up before VDD(PAD) ................... 31
Fig. 3. PN7150 package marking HVQFN40 (top Fig. 23. VDD(PAD) and VBAT are set up at the
view) 3 lines ...................................................... 8 same time ........................................................31
Fig. 4. PN7150 package marking WLCSP42 (top Fig. 24. VDD(PAD) is set up or cut-off after PN7150
view) .................................................................. 9 has been enabled ........................................... 32
Fig. 5. PN7150 block diagram ....................................10 Fig. 25. Power-down sequence ....................................32
Fig. 6. Pinning .............................................................11 Fig. 26. Read/write mode for ISO/IEC 14443 type A
Fig. 7. WLCSP42 pinning (bottom view) .................... 13 and read/write mode for MIFARE Classic ........34
Fig. 8. PN7150 connection ......................................... 15 Fig. 27. FeliCa Reader/Writer communication mode
Fig. 9. System power mode diagram ......................... 16 diagram ............................................................35
Fig. 10. Polling loop: all phases enabled ......................20 Fig. 28. ISO/IEC 14443B Reader/Writer
Fig. 11. Polling loop: low-power RF polling .................. 21 communication mode diagram ........................ 36
Fig. 12. 27.12 MHz crystal oscillator connection .......... 23 Fig. 29. R/W mode for NFC forum T5T
Fig. 13. Input reference phase noise characteristics .... 24 communication diagram .................................. 37
Fig. 14. PMU functional diagram ..................................25 Fig. 30. FNFCIP-1 communication mode ..................... 38
Fig. 15. VBAT1 = VBAT2 (between 2.3 V and 5.5 V) ....26 Fig. 31. Active communication mode ........................... 39
Fig. 16. VDD(TX) offset behavior ................................. 27 Fig. 32. Passive communication mode .........................40
Fig. 17. VDD(TX) behavior when PN7150 is in Fig. 33. I2C-bus timings ............................................... 47
Standby state .................................................. 27 Fig. 34. Package outline, HVQFN40, SOT618-1,
Fig. 18. VBAT1 = 5 V, VBAT2 between 2.3 V and MSL3 ............................................................... 54
5.5 V ................................................................28 Fig. 35. Package outline, WLCSP42, SOT1459-1 ........55
Fig. 19. VDD(TX) behavior when PN7150 is supply Fig. 36. Temperature profiles for large and small
using external supply on VBAT1 ..................... 28 components ..................................................... 58
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Contents
1 Introduction ...................................................... 1 12.7 Contactless interface unit ................................ 32
2 General description ......................................... 2 12.7.1 Reader/Writer communication modes ..............33
3 Features and benefits ..................................... 3 12.7.1.1 Communication mode for ISO/IEC 14443
4 Applications ..................................................... 4 type A, MIFARE Classic and Jewel/Topaz
5 Quick reference data ....................................... 5 PCD ................................................................. 34
6 Versions ............................................................ 6 12.7.1.2 FeliCa PCD communication mode ...................35
6.1 Version C11006 ................................................. 6 12.7.1.3 ISO/IEC 14443B PCD communication
6.2 Version C11004 ................................................. 6 mode ................................................................ 36
6.3 Version C11002 ................................................. 6 12.7.1.4 R/W mode for NFC forum Type 5 Tag ............. 37
7 Ordering information .......................................7 12.7.2 ISO/IEC 18092, Ecma 340 NFCIP-1
8 Marking HVQFN40 ........................................... 8 communication modes .....................................38
9 Marking WLCSP42 ........................................... 9 12.7.2.1 ACTIVE communication mode .........................39
10 Block diagram ................................................ 10 12.7.2.2 Passive communication mode ......................... 40
11 Pinning information .......................................11 12.7.2.3 NFCIP-1 framing and coding ........................... 41
11.1 Pinning HVQFN40 ........................................... 11 12.7.2.4 NFCIP-1 protocol support ................................41
11.2 Pinning WLCSP42 ........................................... 13 12.7.3 Card communication modes ............................ 41
12 Functional description .................................. 15 12.7.3.1 NFC forum T4T, ISO/IEC 14443Acard
12.1 System modes .................................................16 mode ................................................................ 41
12.1.1 System power modes ...................................... 16 12.7.3.2 NFC forum T4T, ISO/IEC 14443B card
12.1.2 PN7150 power states ...................................... 18 mode ................................................................ 42
12.1.2.1 Monitor state ....................................................18 12.7.3.3 NFC forum T3T, Sony FeliCa card mode .........42
12.1.2.2 Hard Power Down (HPD) state ........................18 12.7.4 Frequency interoperability ............................... 42
12.1.2.3 Standby state ...................................................19 13 Limiting values ...............................................43
12.1.2.4 Active state ...................................................... 19 14 Recommended operating conditions ...........44
12.1.2.5 Polling loop ...................................................... 20 15 Thermal characteristics ................................ 45
12.2 Microcontroller ................................................. 21 15.1 Thermal characteristics HVQFN40 .................. 45
12.3 Host interface .................................................. 21 15.2 Thermal characteristics WLCSP42 .................. 45
12.3.1 I2C-bus interface ............................................. 22 16 Characteristics ............................................... 46
12.3.1.1 I2C-bus configuration .......................................22 16.1 Current consumption characteristics ................46
12.4 PN7150 clock concept .....................................23 16.2 Functional block electrical characteristics ........ 46
12.4.1 27.12 MHz quartz oscillator ............................. 23 16.2.1 Battery voltage monitor characteristics ............ 46
12.4.2 Integrated PLL to make use of external 16.2.2 Reset via VEN ................................................. 46
clock .................................................................24 16.2.3 Power-up timings ............................................. 46
12.4.3 Low-power 40 MHz ± 2.5 % oscillator ............. 25 16.2.4 Power-down timings ........................................ 47
12.4.4 Low-power 380 kHz oscillator ..........................25 16.2.5 I2C-bus timings ................................................47
12.5 Power concept .................................................25 16.3 Pin characteristics ............................................49
12.5.1 PMU functional description .............................. 25 16.3.1 NFC_CLK_XTAL1 and NFC_CLK_XTAL2
12.5.2 DSLDO: dual supply LDO ............................... 26 pins characteristics .......................................... 49
12.5.3 TXLDO ............................................................. 26 16.3.2 VEN input pin characteristics ...........................50
12.5.3.1 Configuration 1: supply connection in case 16.3.3 Pin characteristics for IRQ and CLK_REQ .......50
the battery is used to generate RF field ...........26 16.3.4 Input pin characteristics for RXN and RXP ...... 51
12.5.3.2 Configuration 2: supply connection in case 16.3.5 Output pin characteristics for TX1 and TX2 ..... 52
a 5 V supply is used to generate RF field 16.3.6 Input pin characteristics for I2CADR0 and
with the use of TXLDO .................................... 28 I2CADR1 ..........................................................52
12.5.3.3 TXLDO limiter .................................................. 28 16.3.7 Pin characteristics for I2CSDA and I2CSCL .... 53
12.5.4 Battery voltage monitor ....................................29 16.3.8 VDD pin characteristic ..................................... 53
12.6 Reset concept ..................................................30 17 Package outline ............................................. 54
12.6.1 Resetting PN7150 ............................................30 17.1 Package outline HVQFN40 ..............................54
12.6.2 Power-up sequences ....................................... 31 17.2 Package outline WLCSP42 ............................. 55
12.6.2.1 VBAT is set up before VDD(PAD) ....................31 18 Soldering of SMD packages ......................... 56
12.6.2.2 VDD(PAD) and VBAT are set up in the 18.1 Introduction to soldering .................................. 56
same time ........................................................ 31 18.2 Wave and reflow soldering .............................. 56
12.6.2.3 PN7150 has been enabled before 18.3 Wave soldering ................................................ 56
VDD(PAD) is set up or before VDD(PAD) 18.4 Reflow soldering .............................................. 57
has been cut off ...............................................32 19 Abbreviations ................................................. 59
12.6.3 Power-down sequence .................................... 32 20 References ......................................................61
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Please be aware that important notices concerning this document and the product(s)
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