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SYLLABUS

The document outlines the detailed syllabus for the Bachelor and Master of Technology (Dual Degree) program, covering various courses such as Basic Electrical and Electronics Engineering, Electronic Devices and Circuits, Signals and Systems, and more. Each course includes course outcomes, a comprehensive syllabus, and recommended textbooks and references. The focus is on equipping students with theoretical knowledge and practical skills in electrical and electronic engineering.
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0% found this document useful (0 votes)
11 views77 pages

SYLLABUS

The document outlines the detailed syllabus for the Bachelor and Master of Technology (Dual Degree) program, covering various courses such as Basic Electrical and Electronics Engineering, Electronic Devices and Circuits, Signals and Systems, and more. Each course includes course outcomes, a comprehensive syllabus, and recommended textbooks and references. The focus is on equipping students with theoretical knowledge and practical skills in electrical and electronic engineering.
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 77

Bachelor and Master of Technology

(Dual Degree)
Detailed Syllabus

Page 1 of 77
Course Title Course Code Structure (I-P-C)
Basic Electrical and Electronics Engineering EC101 3 0 3
Pre-requisite, if any: Nil

Course Outcomes: At the end of the course, the students will be able to:
CO1 Develop and employ circuit models for elementary electronic components
and circuit analysis.
CO2 Analyze the voltage and current of an electric circuit using network
theorems.
CO3 Understand the behaviour of the transient states in RL, RC, RLC circuits.
CO4 Understand PN junction diodes and its circuits.
CO5 Design the electric circuits with passive and active components.
Syllabus:

Electrical circuit elements: voltage and current sources, R,C,L,M,I,V, linear, non-linear, active and
passive elements, inductor current and capacitor voltage continuity, Kirchhoff’s laws, Elements in
series and parallel, superposition in linear circuits, controlled sources, energy and power in
elements, energy in mutual inductor and constraint on mutual inductance.
Network analysis: Nodal analysis with independent and dependent sources, super nodal analysis,
mesh analysis, super mesh analysis.
Network theorems: superposition theorem, substitution theorem, Millman’s theorem, Tellegen’s
theorem, reciprocity theorem, Thevenin’s and Norton’s theorems, pushing a voltage source
through a node, splitting a current source, compensation theorem, maximum power transfer
theorem.
RC and RL circuits: natural, step and sinusoidal steady state responses, series and parallel
RC/RL/RLC circuits, steady state and transient response, resonance.
AC signal measures: complex, apparent, active and reactive power, power factor.
Magnetic circuits: self-inductance, mutual inductance, dot convention, series/parallel connection
of coils. Two port network functions: z, y, h, g, T, and t parameters; conversion of one parameter
to another, condition for the reciprocity and symmetry.
Network topology: notion of network graphs, nodes, trees, twigs, links, co-tree, independent sets
of branch currents and voltages, incidence matrix, tie set matrix, cut set matrix
Introduction to three phase supply: three phase circuits, star-delta transformations, balanced and
unbalanced three phase load, power measurement, two wattmeter method.
Semiconductor diodes and application: PN diodes, rectifiers, and filters, clipping and clamping
circuits.
Text Book(s):
1. Hayt. W. W, Kemmerly. J.E, and Durbin. S.M, Engineering Circuits Analysis, 8th edition,
Tata McGraw Hill, 2013.
2. J. David Irwin and R. Mark Nelms, Basic Engineering Circuit Analysis, 10th edition, Wiley,
2011
References & Web Resources:
1. Hughes Edward, Electrical & Electronic Technology, 10th edition, Pearson Education, 2007.
2. Hambley. A, Electrical Engineering Principles and Applications: International Version,
Pearson Education, 4 Edn, 2007.
3. Alexander.C. K. & Mathew. N. O. Sadiku, Fundamentals of Electrical circuits, 5th edition,
Tata McGraw Hill, 2008.
Page 2 of 77
Course Title Course Code Structure (I-P-C)
Electronic Devices and Circuits EC151 3 0 3
Pre-requisite, if any: Basic Electrical and Electronics Engineering

Course Outcomes: At the end of the course, the students will be able to:

CO1 Understand the principles and characteristics of different types of semiconductor


devices.
CO2 Understand the fabrication process of semiconductor devices.
CO3 Utilize the mathematical models of semiconductor junctions and MOS transistors
for circuits and systems
CO4 Understand the constructional details and characteristics of Diode, BJT, and MOS
Devices.
CO5 Understand the characteristics of special diodes.
Syllabus:

Semiconductor Basics: Bonding forces, Energy bands in Solids, Metals, Semiconductors and
Insulators, Direct and Indirect semiconductors, Electrons and Holes, Intrinsic and Extrinsic
materials, Conductivity and Mobility, Drift and Resistance, Effects of temperature and doping on
mobility, Hall Effect.
P-N Junctions: Forward and Reverse biased junctions- Qualitative description of Current flow at
a junction, reverse bias, Reverse bias breakdown- Zener breakdown, avalanche breakdown,
Rectifiers, Optoelectronic Devices Photodiodes: Current and Voltage in an Illuminated Junction,
Solar Cells, Photo detectors. Light Emitting Diode: Light Emitting materials.
Bipolar Junction Transistor: Fundamentals of BJT operation, Amplification with BJTS, BJT
Fabrication, The coupled Diode model (Ebers-Moll Model), Switching operation of a transistor,
Cutoff, saturation, switching cycle, specifications, Drift in the base region, Base narrowing,
Avalanche breakdown.
Field Effect Transistors: Basic JFET Operation, Equivalent Circuit and Frequency Limitations,
MOSFET Two terminal MOS structure- Energy band diagram, Ideal Capacitance – Voltage
Characteristics and Frequency Effects, Basic MOSFET Operation- MOSFET structure, Current-
Voltage Characteristics.
Fabrication of P-N Junctions: Thermal Oxidation, Diffusion, Rapid Thermal Processing, Ion
implantation, chemical vapour deposition, photolithography, Etching, metallization.

Integrated Circuits: Background, Evolution of ICs, CMOS Process Integration, Integration of


Other Circuit Elements.

Text Book(s):
1. Ben. G. Streetman, Sanjay Kumar Banergee, “Solid State Electronic Devices”, 7th Edition,
Pearson Education.
2. Donald A Neamen, Dhrubes Biswas, “Semiconductor Physics and Devices”, 4th Edition,
MCGraw Hill Education, 2012.

References & Web Resources:


1. S. M. Sze, Kwok K. Ng, “Physics of Semiconductor Devices”, 3rd Edition, Wiley, 2018.

Page 3 of 77
Course Title Course Code Structure (I-P-C)
Signals and Systems EC152 3 0 3
Pre-requisite, if any: Nil

Course Outcomes: At the end of the course, the students will be able to:

CO1 Understand various properties of continuous time signals.


CO2 Analyze the frequency spectrum of continuous time signals.
CO3 Describe a LTI system by impulse/frequency response.
CO4 Analyze magnitude/phase response of various LTI systems.
CO5 Analyze systems commonly used in Communications, Control, and Signal
Processing.
Syllabus:

Introduction to Continuous/Discrete time Signals and Systems: The unit impulse and unit step
functions, Continuous-time signals, Transformations of the independent variables, Exponential
and Sinusoidal signals, Continuous-time systems and basic system properties.

Linear Time-invariant Discrete/Continuous Systems: Continuous-time Linear Time-invariant


(LTI) system, Discrete-time LTI system, Properties of LTI systems, System representation through
linear constant coefficient differential equations.

Discrete/Continuous Fourier Series Representation of Periodic Signals: Fourier series


representation of continuous/discrete time periodic signals, Convergence of the Fourier series,
Properties of continuous/discrete time Fourier series, Fourier series and LTI systems, Filtering,
Examples of continuous-time filters described by differential equations.

Discrete/Continuous-time Fourier Transform: Representation of aperiodic signals, The Fourier


transform for periodic signals, Properties of the continuous-time Fourier transform, Convolution
and multiplication properties and their effect in the frequency domain, magnitude and phase
response.

Laplace Transform: The Laplace transform for continuous-time signals and systems, the notion of
Eigenvalue and Eigenfunctions of LTI systems, Region of convergence, System functions, Poles
and zeros of system functions and signals, Properties of the Laplace transform, Analysis and
characterization of LTI systems using the Laplace transform, The unilateral Laplace transform.

Z-transform: Introduction of z-transform, Properties of the region of convergence of the z-


transform, The inverse z-transform, Properties of the z-transform, solving the difference equations
using Z-transform.

Text Book(s):
1. A. V. Oppenheim, A. S. Willsky, and S. H. Nawab, “Signals and Systems,” 2nd Edition,
Prentice Hall, 2003.
2. S. Haykin and B. V. Veen, “Signals and Systems” 2nd Edition, Wiley, 2007.
References & Web Resources:
1. B.P. Lathi, “Principles of Linear Systems and Signals,” Oxford University Press, 2nd
Edition, 2009.

Page 4 of 77
Course Title Course Code Structure (I-P-C)
Digital Logic Circuits EC201 3 0 3
Pre-requisite, if any: Nil

Course Outcomes: At the end of the course, the students will be able to:

CO1 Understand various number systems and their representation


CO2 Design combinational circuits
CO3 Design sequential circuits
CO4 Formulate logic and design circuits for practical problems.
CO5 Understand the issues at the digital circuits.
Syllabus:
Representation of Data: Introduction, Data representations, Number systems, conversions and
codes.

Switching Theory: Laws and theorems of Boolean algebra, switching functions, truth table and
algebraic form, realization using logic gates.

Digital Logic and Implementation: K-Maps, QM method, SOP, POS; NAND and NOR
implementation, Digital Circuit Characterization.

Combinational Circuit Design: Design Procedure, Multiplexer, Decoder, Encoder, Comparator,


Seven-segment display, Parity generator, Design of large circuits, Ripple Carry Adder, Carry look
ahead adder, carry save adder, carry save array multiplier, Wallace tree multiplier, Restoring/Non
Restoring division techniques.

Asynchronous and Synchronous Sequential Circuit Design; Design of sequential modules – SR, D,
T and J-K Flip-flops, applications, Clock generation, Clock dividers, Registers, and Counters.

Design using State machines: Moore and Mealy machines, Design Examples.

Issues at the Digital Circuits: Glitches, Glitch free circuit design, Static and Dynamic Hazards,
Hazard resolution techniques, Race, and Cycles.

Text Book(s):
1. C. H. Roth, Jr., “Fundamentals of Logic Design,” 7th Edition, Cengage Learning, 2013.

2. S. Brown and Z. Vranesic, “Fundamentals of Digital Logic with VHDL Design,” TMH, 3rd
Edition

References & Web Resources:


1. J. F. Wakerly, “Digital Design- Principles and Practices,” 3rd Edition, Pearson
2. M. M. Mano, “Digital Design,” PHI.
3. T. L. Floyd and R. P. Jain, “Digital Fundamentals,” 8th Edition, Pearson.

Page 5 of 77
Course Title Course Code Structure (I-P-C)
Electromagnetic Waves and Transmission Lines EC204 3 0 3
Pre-requisite, if any: Nil

Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand the principles of vector algebra, vector calculus, and their physical
interpretations in electromagnetic fields
CO2 Analyse Maxwell’s equations for time-varying electromagnetic fields and understand
the formation and characteristics of electromagnetic wave
CO3 Understand the plane wave reflections and wave dispersion in different mediums
CO4 Apply Maxwell's equations for solutions in transmission lines
CO5 Illustrate the wave propagation through different waveguides
Syllabus:
Vector Analysis: Scalars and Vectors, Vector Algebra, The Rectangular Coordinate System,
Vector Components and Unit Vectors, The Vector Field, The Dot Product, The Cross Product,
Other Coordinate Systems: Cylindrical Coordinates and The Spherical Coordinate System

Time-Varying Fields and Maxwell’s Equations: Faraday’s Law, Displacement Current, Maxwell’s
Equations in Point Form, Maxwell’s Equations in Integral Form, The Retarded Potentials

The Uniform Plane Wave: Wave Propagation in Free Space, Wave Propagation in Dielectrics,
Poynting’s Theorem and Wave Power, Propagation in Good Conductors:Skin Effect, Wave
Polarization

Plane Wave Reflection and Dispersion: Reflection of Uniform Plane Waves at Normal Incidence,
Standing Wave Ratio, Wave Reflection from Multiple Interfaces, Plane Wave Propagation in
General Directions, Plane Wave Reflection at Oblique Incidence
Angles, Total Reflection and Total Transmission of Obliquely Incident Waves,Wave Propagation
in Dispersive Media, Pulse Broadening in Dispersive Media

Transmission Lines: Physical Description of Transmission Line Propagation, The Transmission


Line Equations, Lossless Propagation, Lossless Propagation of Sinusoidal Voltages, Complex
Analysis of Sinusoidal Waves, Transmission Line Equations and Their Solutions in Phasor Form,
Low-Loss Propagation, Power Transmission and The Use of Decibels in Loss Characterization,
Wave Reflection at Discontinuities, Voltage Standing Wave Ratio, Transmission Lines of Finite
Length, Some Transmission Line Examples, Graphical Methods: The Smith Chart, Transient
Analysis

Guided Waves: Transmission Line Fields and Primary Constants, Basic Waveguide Operation,
Plane Wave Analysis of the Parallel-Plate Waveguide, Parallel-Plate Guide Analysis Using the
Wave Equation, Rectangular Waveguides, Planar Dielectric Waveguides, Optical Fibre.
Text Book(s):
1. Matthew N.O. Sadiku, S.V. Kulkarni, Principles of Electromagnetics, 6th Edition, Oxford,
2015.
2. W. H. Hayt and J. A. Buck, Engineering Electromagnetics, Tata McGraw Hill Education
Pvt. Ltd, 2006.
References & Web Resources:
1. Rao, Nannapaneni Narayana. Elements of engineering electromagnetics. Prentice Hall,
1991.
2. Griffiths, David J. "Introduction to Electrodynamics, 4th Edition, 2021.

Page 6 of 77
Course Title Course Code Structure (I-P-C)
Analog Electronics EC202 3 0 3
Pre-requisite, if any: Electronic Devices and Circuits

Course Outcomes: At the end of the course, the students will be able to:

CO1 Understand analog circuits.


CO2 Analyse and design of amplifiers viz. VCVS, VCCS, CCVS, CCCS
CO3 Analyse and design of analog circuits with operational amplifiers.
CO4 Analyse and design the analog filters.
CO5 Design oscillators and multivibrators.
Syllabus:

Device Models: (Diode, BJT, MOSFET); Small signal analysis of nonlinear circuits, small signal
equivalent of diode, BJT, MOSFET.

Biasing: Adding dc bias to ac signals, Concept of ac coupling, current mirrors, Cascode current
mirrors.

Basic transistor Amplifiers: small signal and large signal (low frequency) characteristics, VCVS,
VCCS, CCVS, CCCS, high frequency effects.

Differential pair: Need of active load, differential amplifier.

OpAmp internal circuitry: 2‐stage plus buffer example, Miller compensation of a 2‐stage OpAmp,
Stability, frequency compensation.

OpAmp circuits: Amplifier Circuits, Filters, oscillators.

Text Book(s):
1. B. Razavi, “Fundamentals of Microelecronics,” Wiley Student Edition, 2010.

2. S. Franco, “Design with Operational Amplifiers and Analog Integrated Circuits,” McGraw-
Hill Series in Electrical and Computer Engineering, 4th Edition, 2015.

References & Web Resources:


1. Sedra and Smith, “Microelectronic Circuits,” 7 th Edition, Oxford University Press.
2. D. A. Newman, “Electronic circuits,” 4 th Edition, TMH.

Page 7 of 77
Course Title Course Code Structure (I-P-C)
Digital Logic Circuits Practice EC205 0 3 2
Pre-requisite, if any: Nil

Course Outcomes: At the end of the course, the students will be able to:

CO1 Understand digital circuits in practical prespective


CO2 Design Combinational circuits
CO3 Design sequential circuits
CO4 Formulate logic and design circuits for practical problems.
CO5 Design the digital circuits using HDL
Experiments:

1. Formulating Boolean expressions and truth tables from practical statements.


2. Designing logic circuits and simplifying using k-map,
3. Designing NAND-NAND & NOR-NOR diagrams & verifying the same by
simulation and experiment.
4. Combinational circuits: code converters, arithmetic circuits, mux/demux,
encoder/decoder, comparators etc.
5. Sequential circuits including flip flops, shift registers, counters, sequence
generators etc.
6. Simple design examples with Moore and Mealy machines.
7. Digital circuits design using HDL
8. Implementation of combinational and sequential circuits in the digital trainer board.

Text Book(s):
1. C. H. Roth, “Fundamentals of Logic Design,” 5th Edition, Thomson Books/Cole.

2. Samir Palnitkar: Verilog HDL ‐ Guide to Digital design and synthesis, Pearson Guide to
Digital design and synthesis, Pearson Education, 3rd Edn, 2003.

References & Web Resources:


1. S. Brown and Z. Vranesic, “Fundamentals of Digital Logic with VHDL Design,” TMH, 3rd
Edition.

Page 8 of 77
Course Title Course Code Structure (I-P-C)
Analog Electronics Practice EC206 0 3 2
Pre-requisite, if any: Electronic Devices and Circuits

Course Outcomes: At the end of the course, the students will be able to:

CO1 Understand analog circuits.


CO2 Analyse and design of amplifiers viz. VCVS, VCCS, CCVS, CCCS
CO3 Analyse and design of analog circuits with operational amplifiers
CO4 Analyse and design the analog filters
CO5 Design oscillators and multivibrators.
Experiments:

1. Half wave and full wave rectifiers design,


2. Diode based clipper and clamper circuits design,
3. Voltage regulator design using Zener diode,
4. RC Circuit Analysis,
5. BJT voltage transfer characteristics analysis,
6. Operation amplifier analysis,
7. Circuits using Op-Amps, Filters, and Oscillators,
8. Common emitter amplifier design,
9. Analysis of common source characteristics of NMOS transistor,
10. Basic NMOS common source audio amplifier design,
11. Power Supply analysis
12. Frequency analysis of BJT and MOSFET

Text Book(s):
1. B. Razavi, “Fundamentals of Microelectronics,” Wiley Student Edition, 2010.

2. S. Franco, “Design with Operational Amplifiers and Analog Integrated Circuits,” McGraw-
Hill Series in Electrical and Computer Engineering, 4th Edition, 2015.

References & Web Resources:


1. Sedra and Smith, “Microelectronic Circuits,” 7th Edition, Oxford University Press.

2. D. A. Newman, “Electronic circuits,” 4th Edition, TMH.

Page 9 of 77
Course Title Course Code Structure (I-P-C)
Probability Theory and Statistics DS151 3 0 3
Pre-requisite, if any: Nil

Course Outcomes: At the end of the course, the students will be able to:

CO1 Understand the concept of probability using an appropriate samplespace.


CO2 Solve problems on discrete and continuous random variables.
CO3 Identify the characteristics of different discrete and continuous distributions.
CO4 Analyze the statistical problems on large and small samples.
CO5 Apply the knowledge of probability and statistics in solving engineering problems.
Syllabus:

Introduction to Probability: Sets, Events, Axioms of Probability, Conditional Probability and


Independence, Bayes Theorem.

Random Variables: Definitions, Cumulative Distribution Functions, Probability Mass Function,


Probability Density Function, Joint and Conditional Distributions.

Expectations: Mean, Variance, Moments, Correlation, Chebychev and Schwarz Inequalities,


Moment-Generating and Characteristic Functions, Chernoff Bounds, Conditional Expectations,
Law of Large Numbers, Central Limit Theorem. Uniform, Binomial, Poisson and Normal
Distributions.
Test for Large Samples: Testing of Hypothesis –Null and alternate hypothesis, level of
significance and critical region-Z-test for single mean and difference of means, single proportion
and difference of proportions.

Test for Small Samples: t-test for single mean and difference of means – F-test for comparison of
variances, Chi-square test for goodness of fit, Chi-square test for independence.

Correlation and Regression: Correlation, lines of regression and examples.

Text Book(s):

1. S. C. Gupta and V. K. Kapoor, Fundamentals of Mathematical Statistics, S. Chand & Co,


2006.
2. R. A. Johnson: Miller and Freund’s Probability and Statistics for Engineers, Pearson
Publishers, 9th Edition, 2017 Thomas. G.B, and Finney R.L, Calculus, Pearson Education,
2007.

References & Web Resources:

1. S. Milton and J. Arnold, Introduction to Probability and Statistics, Tata McGraw Hill
Education Private Limited, 4th Edition, 2006.
2. R.K. Jain and S.R.K. Iyenger, Advanced Engineering Mathematics, 2nd Edition, Narosa
Publishing House. 2005.

Page 10 of 77
Course Title Course Code Structure (I-P-C)
Microprocessors and Microcontrollers EC251 3 0 3
Pre-requisite, if any: Digital Logic Design

Course Outcomes: At the end of the course, the students will be able to:
CO1 Learn the functional behaviour of a microprocessor using assembly instructions.
CO2 Learn to develop suitable computing architectures for certain applications
CO3 Use microprocessors and microcontrollers for building real time systems
CO4 Understand the data path architecture of microprocessors.
CO5 Understand the ISA of microprocessors and microcontrollers
Syllabus:

Evolution of processors. Harvard Versus Von-Neumann, RISC versus CISC, Register File,
General Instruction Types, Addressing Modes, and concept of pipelining and parallelism.

Memory: Main memory Technologies (SRAM, DRAM), Cache memory organization, improving
cache performance. Input/Output Unit: access of I/O devices, I/O ports, and I/O control
mechanisms – Program Controlled I /O. Interrupt controlled I/O and DMA controlled I/O

8086 Architecture, Register Organization, Memory segmentation, Pin configuration, latching of


address bus, Buffering of data bus. Minimum and Maximum mode operations.

8086 INTERFACING Memory interfacing: RAM, EPROM IC Chips I/O interfacing: 8255 PPI,
8257 DMA interface interfacing programmable interval timers – 8253/8254

Architecture of 8051, Pin configuration, built-in ROM & RAM organization, Stack organization.
Assembly language Programming with 8051: Instruction set, Data transfer, Arithmetic, logical
and branching instructions, Addressing modes.
Text Book(s):
1. D. A. Patterson and J. L. Hennessy, Computer Organization and Design - ARM, Morgan
Kaufmann, 2010..
2. Douglas V Hall, “Microprocessors and Interfacing Programming and Hardware,” 2/e,
THM, 2007
3. Mazidi M.A, Mazidi J.G &Rolin D. Mckinlay, “The 8051 Microcontroller & Embedded
Systems using Assembly and C,” 2/e, Pearson Education, 2007.
References & Web Resources:
1. Morris Mano, M., "Computer System Architecture," 3/e, Pearson Education, 2005.
2. B. B. Brey, Intel Microprocessors, 8th edition, Prentice Hall, 2008.
3. Microprocessors and Microcontrollers by Dr.Santhanuchatopadhya, IIT Kharagpur
https://onlinecourses.nptel.ac.in/noc18_ec03/course
4. Microprocessors and Microcontrollers, IIT Kanpur. https://nptel.ac.in/courses/Webcourse-
contents/IIT- KANPUR/microcontrollers

Page 11 of 77
Course Title Course Code Structure (I-P-C)
Analog and Digital Communications EC252 3 0 3
Pre-requisite, if any: Signals and Systems

Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand the basic concepts of signal modulation, demodulation, and transmission.
CO2 Analyze the performance of analog and digital communication systems.
CO3 Design and implement analog and digital communication systems for a given set of
specifications.
CO4 Use laboratory equipment and software tools to test and verify the proper operation of
communication systems.
Syllabus:

Introduction to Analog Communication Systems


 Introduction of Analog Communication Systems
 Modulation Types: Amplitude Modulation (AM), Frequency Modulation (FM), Phase
Modulation (PM)
 Properties of Fourier Transform, Band-pass Signals, and their Spectra,Introduction to
Mixers, Up-down Converters, and Channel Selection

Analog Communication Techniques


 Amplitude Modulation Techniques: DSB-SC, SSB-SC, VSB
 Frequency Modulation Techniques: Narrowband FM, Wideband FM, Phase Modulation
(PM)
 Frequency Division Multiplexing Techniques (FDM), Time Division Multiplexing
Techniques (TDM)
 Advanced Modulation techniques: single sideband suppressed carrier (SSBC), vestigial
sideband (VSB),orthogonal frequency-division multiplexing (OFDM)

Introduction to Digital Communication:


 Sampling and Quantization, PCM, Delta modulation, Adaptive delta modulation,
 BER Analysis, Bandwidth/Power efficiency, Carrier recovery – squaring and Costas loop.

Digital Communication Principles


 Digital Modulation Techniques: ASK, PSK, FSK, QAM
 Performance Analysis of Digital Communication Systems
 Error Detection and Correction Techniques: Hamming codes, Parity codes, CRC codes,
BCH codes
 Introduction to Spread Spectrum Techniques

Communication Systems, Design Challenges:


 Channel Distortions and Noises, Message Sources, Channel Effect,
 Signal-To-Noise Ratio, Information Capacity,
 Modulation and Detection, Matched filter, and correlation receiver, Super heterodyne
receiver,
Text Book(s):
1. Simon Haykin, An Introduction to Analog and Digital Communications, wiley Vol 2, 2008.
2. B. P. Lathi and Z. Ding, “Modern Digital and Analog Communication Systems,” 4th
Edition, Oxford University Press, 2011.
References & Web Resources:
1. John G Proakis, Digital Communications, 4th edition, 2008.

Page 12 of 77
Course Title Course Code Structure (I-P-C)
Control Systems EC254 3 0 3
Pre-requisite, if any: Signals and systems

Course Outcomes: At the end of the course, the students will be able to:
CO1 Model the linear systems using transfer functions and obtain transfer functions using
block diagrams and signal flow graphs.
CO2 Understand the significance of time response and find it for system analysis in
transient and steady state
CO3 Understand the concept of stability and know different techniques of stability analysis
and to introduce the concept of frequency domain analysis, Bode plots, Polar plots
CO4 Understand the concept of state space modeling and analysis.
CO5 Understand the state space model of the systems
Syllabus:

Open loop and closed loop systems, Transfer Function models of linear SystemsModelling of
Electrical & mechanical Systems, Block Diagram representation of Control Systems – Block
Diagram Reduction, Signal Flow Graph Representation of Control Systems, Mason’s gain
formula, Feedback Characteristics of Control Systems

Time Response of First and Second Order Systems with Standard Input Signals, Time Domain
Specifications of Second Order Systems, Steady State Error, Steady State Error Constants-Basic
Control Actions- Effects of Integral and Derivative Control actions.

Concept of Stability, Routh-Hurwitz Criterion, Relative Stability Analysis, The Concept and
Construction of Root Loci, Analysis of Control Systems with Root Locus

Frequency Response Bode Plots Log Magnitude versus Phase Plots, Polar Plots Frequency
Domain specifications Correlation between Time and Frequency Responses, Stability in
Frequency Domain Nyquist Stability Criterion - Assessment of Relative Stability, Gain Margin
and Phase Margin.

Concept of state, State Variables and State Models, State space models for LTI electrical Systems,
Phase variable form and diagonal canonical form, Conversion between Transfer Function models
and State space models, Solution to the State Equation, State Transition Matrix, Concept of
Controllability and Observability.

Text Book(s):
1. N. S. Nise, “Control Systems Engineering,” Wiley, 2014.Meriam
2. B.C. Kuo, “Automatic Control Systems”, 8th Edition, John Wiley.

References & Web Resources:


1. I. J. Nagrath and M. Gopal, “Control System Engineering,” New Age International
publishers, 2008.
2. J. J. Distefano, A. R. Stubberud, and I. J. Williams, “Control Systems,” Shaum’s outline
Series, 3rd Edition, McGraw Hill.

Page 13 of 77
Course Title Course Code Structure (I-P-C)
Digital Signal Processing EC253 3 0 3
Pre-requisite, if any: Signals and Systems

Course Outcomes: At the end of the course, the students will be able to:

CO1 Analyze DT signals using DFT along with FFT algorithms


CO2 Analyze discrete time LTI systems, and their impulse responses
CO3 Synthesize discrete signals from analog signals
CO4 Design of FIR type of Digital filters as per the specifications
CO5 Discuss briefly about DSP applications and understand basic concepts
of multi rate signal processing.
Syllabus:

Review of Discrete-time Signals and Systems: Discrete-time signals: sequences, discrete-time


systems, Linear time-invariant (LTI) systems, Properties of LTI systems, Linear constant
coefficient difference equations, Frequency domain representation of discrete-time signals and
systems, Representation of sequences by Fourier transforms, Symmetry properties of Fourier
transform, Fourier transform theorems, Discrete-time random signals.

Transform Analysis of Linear Time Invariant Systems: The frequency response of LTI systems,
System functions for systems characterized by linear constant-coefficient difference equations,
Frequency response of rational system functions, Relationship between magnitude and phase,
All-pass systems, Minimum phase systems.

Fast Fourier Transform: Introduction of the Discrete Fourier Transform (DFT), TheFourier
transform of periodic signals, Properties of DFT, Linear convolution using the DFT. Efficient
computation of the DFT, The Goertzel algorithms, Radix-2 decimation-in-time and decimation-
in- frequency Fast Fourier Transform algorithms.

Structures for Discrete-Time Systems: Block Diagram Representation of Linear Constant-


Coefficient Difference Equations, Signal Flow Graph Representation, Direct Forms, Cascade
Form.

Filter Design Techniques: Analog filter design, Butterworth, Chebyshev filter technique. FIR
filter design using Windowing and frequency sampling techniques. IIR filter design using impulse
invariance and bilinear transformation, FIR and IIR filter structures.

Overview of DSP applications, DTMF signal detection, Spectral analysis of sinusoidal signals
using FFT, Sub band coding of speech signals, Finite precision arithmetic effects.

Text Book(s):

1. A.V. Oppenheim, R.W. Schafer, and J. R. Buck, “Discrete-Time Signal Processing,”


Pearson Education, 3rd Edition, 2010.

References & Web Resources:


1. S. K. Mitra, “Digital Signal Processing: A Computer-Based Approach”, 4th Edition, Tata
Mcgraw Hill Publication, 2013.
2. J. G. Proakis and D. G. Manolakis, “Digital Signal Processing: Principles, Algorithms and
Applications”, Fourth edition, Pearson, 2007.

Page 14 of 77
Course Title Course Code Structure (I-P-C)
Micro Processors and Microcontrollers Practice EC255 0 3 2
Pre-requisite, if any: Digital logic design

Course Outcomes: At the end of the course, the students will be able to:
CO1 Program and use microprocessor 8086 for real time applications
CO2 Program and use ARM7 for real time application
CO3 use polar coordinates to describe rotational motion of an object.
CO4 understand the planetary motion and gravitation
CO5 apply the concepts of angular momentum and torque for rigid body
dynamics
Experiments:

8086 programming : Assembly code for simple addition, simple subtraction, simple
multiplication, division, multiply accumulation, matrix addition/subtraction/multiplication,
finding the odd-even, addition of N numbers, convolution, find the largest of N numbers, and so
on. Accessing the peripherals (Switches, LEDs, Keypad, seven segment display, buzzer, relay,
ADC, and temperature sensor) of 8086 development boards. Real time applications (traffic light
control, stepper motor control, logic control, and so on) using 8086 and 8051 development
boards.
ARM7 programming : Accessing the peripherals (Switches, LEDs, Keypad, seven segment
display, buzzer, relay, ADC, and temperature sensor) of ARM7-LPC2148 development board,
Assembly code for simple addition, simple subtraction, simple multiplication, division, multiply
accumulation, matrix addition/subtraction/multiplication, finding the odd-even, addition of N
numbers, convolution, find the largest of N numbers, and so on.

Project Work (Individual or 2-per group with respect to the availability of boards): Any project
work using the programming skills obtained from the aforementioned topics with 8086 or ARM7
development boards. The title and objective of the projects will be chosen or formed by the
students.

Text Book(s):
1. S. Furber, ARM System-on-chip Architecture, 13th impression, Pearson, 2012.
2. Kenneth J. Ayala, The 8086 Microprocessor: Programming and Interfacing The PC,
Delmar Publishers, 2007
References & Web Resources:
1. A. K. Ray, K. M. Bhurchandi, Advanced Microprocessors and Peripherals, TMH, 2007.

Page 15 of 77
Course Title Course Code Structure (I-P-C)
Analog and Digital Communications Practice EC256 0 3 2
Pre-requisite, if any: Signals and systems

Course Outcomes: At the end of the course, the students will be able to:
CO1 Ability to analyze and design analog communication systems such as amplitude
modulation, frequency modulation, and pulse modulation.
CO2 Ability to analyze and design digital communication systems such as pulse code
modulation, delta modulation, and PCM encoding and decoding.
CO3 Ability to demonstrate the use of various communication test and measurement
tools such as oscilloscopes, signal generators, and spectrum analyzers.
CO4 Ability to work effectively as part of a team to design and implement a
communication system.
CO5 Ability to identify and solve communication system problems through
experimentation and troubleshooting techniques.
Experiments:

1. (i) Amplitude modulation and demodulation (ii) Spectrum analysis of AM


2. (i) Frequency modulation and demodulation (ii) Spectrum analysis of FM
3. DSB-SC Modulator & Detector
4. SSB-SC Modulator & Detector (Phase Shift Method)
5. Frequency Division Multiplexing & De multiplexing
6. Pulse Amplitude Modulation & Demodulation
7. Pulse Width Modulation & Demodulation
8. Pulse Position Modulation & Demodulation
9. PCM Generation and Detection
10. Delta Modulation
11. Frequency Shift Keying: Generation and Detection
12. Binary Phase Shift Keying: Generation and Detection
13. Generation and Detection (i) DPSK (ii) QPSK
Text Book(s):

1. B. P. Lathi and Z. Ding, “Modern Digital and Analog Communication Systems,” 4th
Edition, Oxford University Press, 2011.
2. S. Haykin, “Communication Systems,” 4th Edition, Wiley, 2006
References & Web Resources:
1. J. M. Wozencraft and I. M. Jacobs, “Principles of Communication Engineering,” Wiley,
1965.
2. J. R. Barry, E. A. Lee, and D. G. Messerschmitt, “Digital Communication,” 3rd Edition,
Springer, 2004.

Page 16 of 77
Course Title Course Code Structure (I-P-C)
Digital Signal Processing Practice EC257 0 3 2
Pre-requisite, if any: Signals and Systems

Course Outcomes: At the end of the course, the students will be able to:

CO1 Understand various properties of signals and systems


CO2 Apply various operations (filtering) on signals
CO3 Become aware of various applications of Signal Processing
CO4 Analyze DFT, DTFT, and FFT on discrete signals.
CO5 Design digital filters.
Syllabus:
1. Convolution of discrete signals
2. Auto and cross correlation of discrete signals
3. Verification of the properties of convolution and correlation
4. Implementation of DFS, DFT, and DTFT
5. Implementation of DIT-FFT and DIF-FFT algorithms
6. Verification of the properties of DFS, DFT, DTFT, and FFT
7. FIR filter design
8. Analysis of FIR filter with various windowing techniques
9. IIR filter design
10. Analysis of IIT filter design with various analog approximations
11. Read and write audio, image, and video signals
12. Analysis of differences between the mono audio, stereo audio, binary image, grey image,
colour image, grey video, and colour video.

Text Book(s):
1. S. K. Mitra, “Digital Signal Processing: A Computer-Based Approach”, Fourth edition,
Tata Mcgraw Hill Publication, 2013.
2. E. Ifeachor, B. W. Jervis, “Digital Signal Processing: A Practical Approach” Second
edition, Pearson, 2002.

References & Web Resources:

1. S. W. Smith, “Digital Signal Processing: A Practical Guide for Engineers and Scientists”,
3rd Edition, Newnes (an imprint of Butterworth-Heinemann Ltd.), 2002.

2. Manuals of TI TMS320C67XX DSP Starter Kit.


3. A.V. Oppenheim, R.W. Schafer, and J. R. Buck, “Discrete-Time Signal Processing,”
Pearson Education, 3rd Edition, 2010.

Page 17 of 77
Course Title Course Code Structure (I-P-C)
Wireless Communication EC301 3 0 3
Pre-requisite, if any: Signals and Systems, Analog and Digital Communication Techniques

Course Outcomes: At the end of the course, the students will be able to:
CO1 Explain fundamental theories and concepts of modern wireless communication
systems.
CO2 Design a wireless communication system using digital modulation techniques.
CO3 Select and implement protocols for wireless networks such as WLAN, WMAN, and
WPAN.
CO4 Evaluate the potential of the next generation of wireless communication systems.
CO5 Analyze and solve problems in wireless communication networks

Syllabus:

Wireless Communication Overview, the Wireless Channel: Fading, Large scale fading, small scale fading,
Physical modeling for wireless channels, different statistical channel models. Channel parameters: Time
and Frequency coherence, delay spread, power profile, Capacity of wireless Channel- Capacity of Flat
Fading Channel, Channel State Information, Capacity with Receiver diversity – Capacity comparisons –
Capacity of Frequency Selective Fading channels, Jakes model for wireless channel correlation.

Overview of communication system design, Analog vs Digital and Single vs Multi-user communication,
RF Circuits and Propagation: RF circuits and components, Propagation models and channels, Antennas
and radiation patterns, Digital Modulation Techniques: Analog to digital conversion, Digital modulation
techniques, Spread spectrum techniques.

Introduction to Cellular and Mobile communications, the cellular and mobile concept and system design
fundamentals. Frequency reuse, Channel assignment strategies, Handoff strategies, Interference and system
capacity, Trunk and grade services, Methods for improving coverage and capacity in cellular systems,
Multiple access techniques TDMA, CDMA, FDMA and SDMA.

WLANs: IEEE 802.11 standards, WLAN architecture, Medium access control protocols, Wireless
Personal Area Networks (WPANs): IEEE 802.15 standards, ZigBee and Bluetooth, standards, Protocols for
WPANs

Wireless Metropolitan Networks (WMANs): IEEE 802.16 standards, WiMaxarchitecture, Medium access
control protocols, Wireless Sensor Networks (WSNs): Introduction to WSNs, Types and architectures of
WSNs, Protocols for WSNs

4G and 5G wireless systems: The evolution of wireless communication systems, Comparison between 4G
and 5G wireless systems, Applications of 5G wireless systems

Wireless Network Security: Network and Information Security, Threats and Attacks on Wireless Networks,
Security Solutions for Wireless Networks
Textbook(s):
1. Andrea Goldsmith, Wireless Communication, Cambridge University Press.
2. Aditya Jagannatham, Principles of Modern Wireless Communication Systems, McGraw
Hill, (2016)
References & Web Resources:
1. Theodore Rappaport, Wireless Communications, principles and Practices, 2nd Edition,
Pearson.

Page 18 of 77
Course Title Course Code Structure (I-P-C)
Electronic Manufacturing and Prototyping EC302 3 0 3
Pre-requisite, if any: Analog and Digital Electronics
Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand the Overview of electronic systems manufacturing and packaging
CO2 Discover Design Considerations for Different Types of PCB
CO3 Understand to design PCB using CAD Tool
CO4 Analyze PCB design Rules
CO5 Select Appropriate technique to test PCB
Syllabus:

Overview of electronic systems manufacturing and packaging, Introduction to IC manufacturing


and realization of passive components in ICs and VLSI, Surface Mount Technology, Thermal
budget and Current trends
Design Considerations for Different Types of PCBs: Single Layer PCB, Multilayer PCB, Flexible
PCB, etc. Design Considerations for PCBs for Different Applications: Digital Circuits, Analog
Circuits, High-Speed Circuits, Power Circuits, etc

Introduction to PCB Design using PCB tool Introduction to PCBs and general guidelines, PCB
design rules for various applications. Creation of new project in PCB tool, drawing the circuit in
the schematic page using the components from the library. Simulation of Circuit using P-spice
Simulation for verification of results, adding footprints to the components from the library.
Creating the netlist, importing the components on PCB tool PCB Editor. Placing and moving the
components in PCB Editor as per design sequence, Routing between the components. Generating
pdf files and Gerber files

Layout Rules and Parameters. Design Rule Checks: Signal Layer Checks, Power / Ground Checks,
Solder Mask Check, Drill Check, etc. Automated Processes, Through Hole Vs. SMT
Technologies. Thermal Management for IC and PCBs, Cooling Requirements, Electronic Cooling
Methods

Functions of an Electronic Package: Packaging Hierarchy, Driving Forces on Packaging


Technology, Materials for Microelectronic Packaging, Material for High-Density Interconnect
Substrates, Electrical Anatomy of Systems Packaging, Signal Distribution, Power Distribution,
Electromagnetic Interference, Design Process.

Symptom Recognition, Bracketing Technique, Component failure Analysis, Fault types and causes
in circuits, during manufacturing, Manual trouble shooting technique Tools and Instruments DMM
CRO, PCO, Logic probes, Logic pulsar, Logic Analyzer.

Textbooks:
1. R. T. Rao, Fundamentals of Microsystems Packaging, McGraw Hill, 2001, ISBN- 10:
0071371699, ISBN-13: 978-0071371698. 2. J. Axelson, Making Printed Circuit Boards,
TAB/McGraw Hill, 1993, ISBN- 10: 0070027994, ISBN-13: 978-0070027992.
2. J. Axelson, Making Printed Circuit Boards, TAB/McGraw Hill, 1993, ISBN- 10:
0070027994, ISBN-13: 978-0070027992.

References:
1. . R. K. Ulrich, W. D. Brown, Advanced Electronic Packaging, : IEEE Press Series on
Microelectronic Systems, 2 nd edition, 2006, Wiley-IEEE Press; ISBN-10: 0471754501,
ISBN-13: 978-0471754503
2. J. Varteresian, Fabricating Printed Circuit Boards (Demystifying Technology) 1 st edition,
Newnes, 2002. ISBN-10: 1878707507, ISBN-13: 978-1878707505
Page 19 of 77
3. R. A. Reis, Electronic project design and fabrication, 6 th edition, Prentice Hall, 2004,
ISBN-10: 0131130544, ISBN-13: 978-0131130548
4. K. Mitzner Complete PCB Design Using OrCad Capture and Layout, Elsevier, 2009, ISBN
:9780750689717.
5. J. H. Lau, C. P. Wong, J. L. Prince, Electronic Packaging: Design, Materials, Process, and
Reliability Electronic Packaging and Interconnection Series, 1 st edition, McGraw- Hill
Professional, 1998. ISBN-10: 0070371350, ISBN-13: 978-0070371354

Page 20 of 77
Course Title Course Code Structure (I-P-C)
Data Communication and Networking EC304 3 0 3
Pre-requisite, if any: Computer Networks, C Programming

Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand a transmission of a data in a network
CO2 Acquire knowledge of various OSI layers.
CO3 Understand topologies for specific networks.
CO4 Understand the basics of cryptography.
CO5 Understand various protocols of wireless transmission
Syllabus:

Overview of Data Communication and Networking: Introduction; Data communications:


components, data representation (ASCII, ISO etc.), direction of data flow (simplex, half duplex,
full duplex); network criteria, physical structure (type of connection, topology), categories of
network (LAN, MAN, WAN); Internet: brief history, Protocols and standards; Reference models:
OSI reference model, TCP/IP reference model, their comparative study.
Physical Layer: Overview of data (analog& digital), signal (analog& digital), transmission
(analog& digital) & transmission media (guided & unguided); Circuit switching: time division &
space division switch, TDM bus; Telephone Network; ATM, B-ISDN.
Data link Layer: Types of errors, framing (character and bit stuffing), error detection & correction
methods; Flow control; Protocols: Stop & wait ARQ, Go-Back- N ARQ, Selective repeat ARQ,
HDLC.
Medium Access sub layer: Point to Point Protocol, LCP, NCP, Token Ring; Reservation, Polling,
Multiple access protocols: Pure ALOHA, Slotted ALOHA, CSMA, CSMA/CD, CSMA/CA
Traditional Ethernet, fast Ethernet (in brief).
Network layer: Internetworking & devices: Repeaters, Hubs, Bridges, Switches, Router, Gateway;
Addressing: IP addressing, subnetting; Routing: techniques, static vs. dynamic routing, Unicast
Routing Protocols: RIP, OSPF, BGP; Other Protocols: ARP, IP, ICMP, IPV6.
Transport layer: Process to Process delivery; UDP; TCP; Congestion Control: Open Loop, Closed
Loop choke packets; Quality of service: techniques to improve QoS: Leaky bucket algorithm,
Token bucket algorithm.
Application Layer: Introduction to DNS, SMTP, SNMP, FTP, HTTP & WWW; Security:
Cryptography (Public, Private Key based), Digital Signature, Firewalls.

Text Book(s):
1. B. A. Forouzan, Data Communications and Networking, 4th edition, Tata McGraw Hill
2012, ISBN: 0072967757
2. A. S. Tanenbaum, Computer Networks, 4th edition, Pearson, 2013, ISBN: 978-
0132126953

References & Web Resources:


1. W. Stallings, Data and Computer Communications, 5th edition, Pearson, 5th edition, 2013,
ISBN: 978-0133506488.

Page 21 of 77
Course Title Course Code Structure (I-P-C)
VLSI System Design EC303 3 0 3
Pre-requisite, if any: Digital Logic Design

Course Outcomes: At the end of the course, the students will be able to:
CO1 Design the digital systems using Verilog or VHDL
CO2 Estimate the circuit/system performance, area, and power dissipation
CO3 Implement the low power and high throughput techniques on digital VLSI
circuits.
CO4 Develop the Custom IPs to integrate into Digital Systems using EDA..
CO5 Understand the CMOS digital circuits.
Syllabus:

Introduction to VLSI Design, Need for VLSI Design, Various VLSI design flows, Basic
classifications of VLSI design. Digital Arithmetic Circuits, Fixed Point/Floating Point/Galois
Field Arithmetic, RTL Design using Verilog HDL. Introduction to Hardware-Software Co-design,
Custom IPs, High level synthesis, and formal hardware verification.

MOS Transistors, Operation of MOSFET, CMOS Logic - Inverter, Logic Gates, Pass Transistors
and Transmission Gates, Tri states, Multiplexers, Sequential Circuits, and Pass Transistor Logic .

CMOS Fabrication and Layout - Inverter Cross-section, Fabrication process, Layout Design Rules,
Gate Layouts, Stick Diagrams. Timing optimization, Transient response, RC Delay Model, Linear
Delay Model, Logical Effort of Paths. Statistical timing analysis.

Sources of Power Dissipation, Dynamic Power, Static Power, Energy-Delay Optimization, Low
Power Architectures.Testers, text fixtures, and Test Programs, BIST, Scan Chains, Design for
Testability, Fault tolerant designs. CMOS chip design options: Full custom ASICs, Std. Cell based
ASICs, Gate Array based ASICs, Programmable logic structures-PLA, PAL, PROM, FPGA.
Introduction to Physical Design: Floor plan, power plan, placement, routing, physical verification.

Text Book(s):
1. Weste and Eshraghian: Principles of CMOS VLSI design, Addison Wesley, 4th Edn, 2011.
2. Samir Palnitkar: Verilog HDL ‐ Guide to Digital design and synthesis, Pearson Education, 3rd
Edn, 2003

References & Web Resources:


1. CMOS Logic Circuit Design, John P Uyemura, 2009, Springer
2. Verilog for Digital Design, Frank Vahid, Roman Lysecky, Wiely, 2007

Page 22 of 77
Course Title Course Code Structure (I-P-C)
Wireless Communication Practice EC305 0 3 2
Pre-requisite, if any: Signals and Systems, Analog and Digital Communication Techniques

Course Outcomes: At the end of the course, the students will be able to:
CO1 Understanding of Wireless Communication system in detail with its concepts,
techniques and application usage Practice.
CO2 This course Simulation basics of Wireless transmission, Channel Modelling, link
budget calculations, Capacity and Fading.
CO3 Every topic in Wireless communication to be explained with its function either with
demonstration and/or simulation using suitable software.
CO4 Upon completion of this course, students will be able to understand the principles of
wireless communication and its applications.
CO5 Students will be able to design, conduct and evaluate experiments related to wireless
communication.

Experiments:

Experiment-1: Basic experiments in Wireless Communication


 1. Antenna, Antenna Polarization and Antenna measurements
 2. Signal transmission and reception measurements
 3. Signal propagation and interference measurements

Experiment-2: Introduction to Wireless Communication Systems


 Definition and scope of Wireless Communication
 Wireless Communication Systems and Techniques
 Differences between Wired and Wireless Communication Systems
 Advantages and Disadvantages of Wireless Communication

Experiment-3: Wireless Communication Standards and Protocols


 Overview of Wireless Communication Standards and Protocols
 GSM, CDMA and LTE standards
 WiFi and Bluetooth Protocols

Experiment-4: Signal Propagation and Channel Modeling


 Understanding Signal Propagation
 Link Budget Calculations
 Types of Channel Models

Experiment -5: Wireless Communication System Design


 System Design Methodology
 Frequency Allocation and Spectrum utilization
 Antenna System Design Principles
 Power Management

Experiment-6: Practical Aspects of Wireless Communication


 Wireless Communication Testing and Measurements
 Troubleshooting Wireless Communication Systems
 Security issues in Wireless Communication
 Wireless Communication Applications

Experiment-7: Final Project


Page 23 of 77
 Students will work on a final project related to wireless communication.
 They will have to design, conduct and report the results of their project.
 Students will have to present their project to the class.

Text Book(s):
1. Andrea Goldsmith, Wireless Communication, Cambridge University Press.
2. Aditya Jagannatham, Principles of Modern Wireless Communication Systems, McGraw
Hill, (2016)
References & Web Resources:
1. Theodore Rappaport, Wireless Communications, principles and Practices, 2nd Edition,
Pearson.163

Page 24 of 77
Structure
Course Title Course Code
(I-P-C)
Electronic Manufacturing and Prototyping Practice EC306 0 3 2
Pre-requisite, if any: Analog and Digital Electronics
Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand the Flow of PCB Designing Process
CO2 Discover Designing different types of PCB
CO3 Practice designing PCB using CAD Tool
CO4 Examine fabricated PCB
CO5 Design and fabrication of PCB for different applications
Tool: Open-Source Tools

Experiments:

1. Designing PCB for different Power Supply Circuits


2. Regulator Circuit Design using IC 723, IC78XX, and IC79XX, Designing of power
supplies
3. Switching power Supply, DC to DC Converter, Buck Converter, Boost Converter, and
Buck- Boost Converter
4. Designing of Analog circuits
5. Signal Conditioning circuit, Current Source, V to I circuits
6. Designing Analog and Digital Circuits
7. Designing with Microcontroller
8. Mini Project- Fabrication of PCB using Printing, Milling, and Etching Methods

Textbooks:

1. R. T. Rao, Fundamentals of Microsystems Packaging, McGraw Hill, 2001, ISBN- 10:


0071371699, ISBN-13: 978-0071371698. 2. J. Axelson, Making Printed Circuit Boards,
TAB/McGraw Hill, 1993, ISBN- 10: 0070027994, ISBN-13: 978-0070027992.
2. J. Axelson, Making Printed Circuit Boards, TAB/McGraw Hill, 1993, ISBN- 10:
0070027994, ISBN-13: 978-0070027992.

References:

1. R. K. Ulrich, W. D. Brown, Advanced Electronic Packaging, : IEEE Press Series on


Microelectronic Systems, 2 nd edition, 2006, Wiley-IEEE Press; ISBN-10: 0471754501,
ISBN-13: 978-0471754503
2. J. Varteresian, Fabricating Printed Circuit Boards (Demystifying Technology) 1 st edition,
Newnes, 2002. ISBN-10: 1878707507, ISBN-13: 978-1878707505
3. R. A. Reis, Electronic project design and fabrication, 6 th edition, Prentice Hall, 2004,
ISBN-10: 0131130544, ISBN-13: 978-0131130548
4. K. Mitzner Complete PCB Design Using OrCad Capture and Layout, Elsevier, 2009, ISBN
:9780750689717.
5. J. H. Lau, C. P. Wong, J. L. Prince, Electronic Packaging: Design, Materials, Process, and
Reliability Electronic Packaging and Interconnection Series, 1 st edition, McGraw- Hill
Professional, 1998. ISBN-10: 0070371350, ISBN-13: 978-0070371354

Page 25 of 77
Course Title Course Code Structure (I-P-C)
VLSI system design Practice EC307 0 3 2
Pre-requisite, if any: Digital Logic Design

Course Outcomes: At the end of the course, the students will be able to:
CO1 Demonstrate the knowledge of digital circuit design flow
CO2 Analyse the process of simulation of combinational sequential circuits
CO3 Validate and demonstrate the results of digital circuits
CO4 Design of CMOS digital circuits
CO5 Implementation of digital circuits using FPGA
Experiments:
1. Simulate the parameters of NMOS, PMOS transistors from its characteristics.
2. Design and simulate the Symmetrical CMOS inverter.
3. Simulate and compare the performance of CMOS inverter over NMOS inverter.
4. Design and simulate the two input CMOS NAND/NOR gate.
5. Design and simulate the 4- bit CMOS adder Design and simulate Carry bypass adder.
6. Design and simulate the D-Flip Flop using transmission gates
7. Simulate the static and dynamic SRAM cells.
8. Layout design of CMOS inverter
9. Design and synthesis of digital CMOS circuits using EDA tool.
10. Implementation of digital circuits using FPGA
11. Implementation of digital circuits with semi custom ASIC
Text Book(s):

1. Weste and Eshraghian: Principles of CMOS VLSI design, Addison Wesley, 4th Edn, 2011.

References & Web Resources:

1. CMOS Logic Circuit Design, John P Uyemura, 2009, Springer

Page 26 of 77
Course Title Course Code Structure (I-P-C)
Antenna and Microwave Circuits Design EC351 3 0 3
Pre-requisite, if any: Electromagnetic waves and Transmission Lines

Course Outcomes: At the end of the course, the students will be able to:
CO1 Analyse various passive and active microwave circuits
CO2 Analyse a given antenna and find out its fundamental parameters.
CO3 Plan the link budget for microwave systems
CO4 Design Antennas with the given specification
CO5 Design microwave components like a filter, coupler, amplifier, mixer, oscillator
and LNA.
Syllabus:

Microwave Network Analysis: Impedance and Equivalent Voltages and Currents, Impedance and
Admittance Matrices, Reciprocal Networks, Lossless Networks, The Scattering Matrix, and The
Transmission (ABCD) Matrix.

Microwave Passive Circuits: Power dividers and directional couplers, microwave filters, Noise
and nonlinear distortion.

Microwave Active Circuits: Active RF and Microwave Devices, amplifier design, oscillators and
mixers.

Microwave Systems: Link Budget and Link Margin of wireless communication systems, Radio
Receiver Architectures, Noise Characterization of a Receiver.

Types of Antennas, Radiation Mechanism of Antenna, Fundamental Parameters and Figures-of-


Merit of Antennas Radiation Integrals and Auxiliary Potential Functions.

Linear Wire Antennas, Loop Antennas, Microstrip and Mobile Communications Antennas, Array
antennas.

Antenna Synthesis and Continuous Sources, Integral Equations, Moment Method, and Self and
Mutual Impedances.

Text Book(s):
1. Pozar, David M. Microwave engineering. John wiley& sons, 2011.
2. Balanis, Constantine A. Antenna theory: analysis and design. John wiley& sons, 2015.

References & Web Resources:


1. Stutzman, Warren L., and Gary A. Thiele. Antenna theory and design. John Wiley & Sons,
2012.
2. Collin, Robert E. Foundations for microwave engineering. John Wiley & Sons, 2007.

Page 27 of 77
Course Title Course Code Structure (I-P-C)
Information Theory and Coding EC352 3 0 3

Pre-requisite, if any:
Course Outcomes: At the end of the course, the students will be able to:
CO1 Analyze different sources in terms of entropy
CO2 Analyze different channels in terms of mutual information
CO3 Design data compression for various sources
CO4 Compute the capacity of different channels
CO5 Analyze AWGN channels

Syllabus
Information - Fundamentals: Entropy, joint entropy and conditional entropy, relative entropy and
mutual information, chain rules for entropy, relative entropy, and mutual information, Jensen's
inequality, log sum inequality, sufficient statistics, Fano's inequality
Asymptotic Equipartition Property (AEP): AEP, consequence of AEP - data compression, typical
set.
Data Compression: Kraft inequality, optimal codes and bounds on optimal codelength, Kraft
inequality for uniquely decodable codes, Huffman codes, Shannon-Fano-Elias coding (
Channel Capacity: (Binary) Symmetric Channels, Jointy typical sequences, the channel coding
theorem, Fano's inequality and the converse to the coding theorem, Hamming codes, joint source-
channel coding theorem.
Gaussian Channel: Differential entropy, coding theorem for Gaussian channels
Textbooks
1. T. M. Cover and J. A. Thomas, Elements of Information Theory, 2nd edition, John-Wiley &
Sons, 2006. ISBN: 978-0471241959
References & Web Resources:
1. I. Csiszar and J. Korner, Information Theory: Coding Theorems for Discrete Memoryless
Systems, 1st edition, AkademiaiKiado, 1997. ISBN: 978-9630574402

2. R. G. Gallager, Information Theory and Reliable Communication, 1st edition, Wiley, 1968,
ISBN: 978-0471290483

Page 28 of 77
Course Title Course Code Structure (I-P-C)
Antenna and Microwave Circuits Design Practice EC353 0 3 2
Pre-requisite, if any: Electromagnetic waves and Transmission Lines

Course Outcomes: At the end of the course, the students will be able to:
CO1 Measure of the fundamental parameters of the given antennas
CO2 Measure the s-parameters of various microwave circuits
CO3 Design various antennas using computational softwares, fabricate and measure
their performance.
CO4 Design various microwave passive components like filters, couplers using
computational softwares, fabricate and measure their s-parameters..
CO5 Design various microwave active components like amplifier, mixer, oscillator
and LNA using computational softwares.
Experiments:

1. Measure the fundamental parameters of various antennas like dipole, horn, and microstrip
antennas.
2. Measure the s-parameters of various couplers, filters, and Amplifiers.
3. Design wireless antenna for 4G and 5G applications, fabricate, and test its performance.
4. Design microwave passive components, fabricate, and test.
5. Design a microwave active component.

Text Book(s):
1. Pozar, David M. Microwave engineering. John wiley& sons, 2011.
2. Balanis, Constantine A. Antenna theory: analysis and design. John wiley& sons, 2015.
References & Web Resources:
1. Stutzman, Warren L., and Gary A. Thiele. Antenna theory and design. John Wiley & Sons,
2012.
2. Collin, Robert E. Foundations for microwave engineering. John Wiley & Sons, 2007.

Page 29 of 77
Course Title Course Code Structure (I-P-C)
Information Theory and Coding Practice EC354 0 3 2

Pre-requisite, if any: Information Theory and Coding

Course Outcomes: At the end of the course, the students will be able to:
CO1 To understand the programming of Entropies and Mutual Information
CO2 To understand the programming of Entropies and Mutual Information
CO3 To develop MATLAB codes for Block codes, Cyclic codes and Convolutional codes.
CO4 Analysis of Differential entropy, coding theorem for Gaussian channels
CO5 Analyze AWGN channels with practical knowledge

List of Experiments
1. Write a program for determination of various entropies and mutual information of a given
channel.
2. Write a program for generation and evaluation of variable length source coding using
C/MATLAB a) Shannon – Fano coding and decoding b) Huffman Coding and decoding c)
Lempel Ziv Coding and decoding
3. Write a Program for coding & decoding of Linear block codes.
4. Write a Program for coding & decoding of Cyclic codes.
5. Write a program for coding and decoding of convolutional codes.
6. Write a program for coding and decoding of BCH and RS codes.
7. Write a simulation program to implement source coding and channel coding for
transmitting a text file.

Textbooks
1. T. M. Cover and J. A. Thomas, Elements of Information Theory, 2nd edition, John-Wiley &
Sons, 2006. ISBN: 978-0471241959
References & Web Resources:
1. I. Csiszar and J. Korner, Information Theory: Coding Theorems for Discrete Memoryless
Systems, 1st edition, AkademiaiKiado, 1997. ISBN: 978-9630574402

2. R. G. Gallager, Information Theory and Reliable Communication, 1st edition, Wiley, 1968,
ISBN: 978-0471290483

Page 30 of 77
Course Title Course Code Structure (I-P-C)
MOSFET Modelling for VLSI Circuits EC501 3 2 4
Pre-requisite, if any: Electronic Devices and Circuits

Course Outcomes: At the end of the course, the students will be able to:
CO1 Model any kind of MOS Devices in 2-D or 3-D
CO2 Relate the models for further inclusion in circuits
CO3 Develop solution to overcome short channel issues
CO4 Develop various compact models appropriate for industry
CO5 Analyse the frequency response of MOS devices.
Syllabus:

Theory:

1. Intuitive analysis of MOS Transistor- Two-Terminal MOS Structure – Flatband Voltage,


Surface Condition, General Analysis, Inversion, Strong Inversion, Weak Inversion, Small- Signal
Capacitance, Three-Terminal MOS Structure (7 hours)

2. Long-Channel MOS Transistor, Introduction All-Region Models, Strong Inversion Models,


Weak Inversion Models, Source Reference vs. Body Reference, Effective Mobility (5 hours)

3. Small-Dimension Effects - Velocity Saturation, Channel Length Modulation, Charge Sharing,


Drain-Induced Barrier Lowering, Hot Carrier Effects, Velocity Overshoot Ballistic Operation,
Polysilicon Depletion (6 hours)

4. Small-Dimension Effects-Modelling for Circuits Simulation- Quantum-Mechanical Effects;


Gate Current, Junction Leakage, Scaling and New Technologies, Approaches, and Properties of
Good Models, Model Formulation Considerations, Parameter Extraction, Compact Models,
Benchmark Tests (7 hours)

5. Small-Signal Modelling - Conductance Parameter Definitions and Equivalent Circuits,


Conductance Parameters Due to Gate and Body Leakage, Transconductance, Source-Drain and
Output Conductance, Capacitance Definitions and Equivalent Circuits, Capacitance Evaluation
and Properties, y-Parameter Model, RF Models (11 hours)

Practice:

Introduction to Technology computer aided design (TCAD) tools; inputs and outputs of device and
process simulations. (8 hours)

2. Device simulation: observing the terminal characteristics and distributions of carriers, current,
field, potential and energy band diagrams within the device. (8 hours)

3. Process simulation: observation of device structure and doping profile Simulation of 2-D
MOSFETs through device and process simulations (8 hours)

4. Simulation of novel 3-D transistors such as III-V HEMT, LEDs, FinFETs, GAA devices, solar
cells etc, through device simulation (8 hours)

5. DC, AC, RF mixed mode and noise simulation for the devices (8 hours)

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Text Book(s):

1. Y. Tsividis and C. McAndrew, “MOSFET modelling for Circuit Simulation”, Oxford


University Press, 2011

2. C K Maiti, “Introducing Technology Computer-Aided Design (TCAD): Fundamentals,


Simulations, and Applications”, Jenny Stanford Publishing; 1st Edition, 2017, ISBN: 978-
9814745512.
3. Wu, Yung-Chun, Jhan, Yi-Ruei, “3D TCAD Simulation for CMOS Nanoeletronic Devices'',
Springer, 2017, ISBN 978-981-10-3066-6
References & Web Resources:

1. T. A. Fjeldly, T. Yetterdal, and M. Shur, “Introduction to Device Modeling and Circuit


Simulation”, John Wiley, 1998.

2. Y. Taur and T. H. Ning, “Fundamentals of Modern VLSI Devices”, Cambridge University


Press, 1998.

3. Y. P. Tsividis, “Mixed Analog-digital VLSI Devices and Technology”, World Scientific


Publishing Co Pte Ltd, 2002

4. C K Sarkar, “Technology Computer Aided Design: Simulation for VLSI MOSFET”, CRC
Press, 1st Edition, 2013, ISBN: 978-1466512658.
5. J.-P. Colinge, “FinFETs and Other Multi-Gate Transistors”, Springer, 2008, ISBN: 978- 0-387-
71751-7

Page 32 of 77
Course Title Course Code Structure (I-P-C)

Digital VLSI System Design EC502 3 2 4


Pre-requisite, if any: Digital Logic Design, VLSI Design

Course Outcomes: At the end of the course, the students will be able to:
CO1 Design digital systems using HDL and CMOS transistors.
CO2 Analyse the circuit/system performance, area, and power dissipation
CO3 Implement the low power and high throughput techniques on digital integrated circuits
CO4 Develop the Custom IPs to integrate into Digital Systems
CO5 Design the RTL based digital circuits using HDL.
CO6 Develop the hardware-software co-design using VLSI CAD tool.
Syllabus:

Theory:

1. Introduction to Digital design: timing issues, pipelining, folding/unfolding, resource sharing,


metastability, synchronization, clock skew, setup/hold time of flip-flops, synchronization
between multiple clock domains using FIFO, PLL, and DLL, reset – recovery/removal time, false
path. (5 hours)

2. Digital Systems Design with ASICs: PLDs, Semi/full custom ASIC designs, Emphasis on the
synthesis based approach to VLSI Design. Relevant issues related to physical design
automation such as partitioning, floor planning, power planning, placement & routing,
Algorithms for VLSI Physical Design, IO pads, electro static discharge. (10 hours)

3. Digital Systems Design with FPGAs: Hardware-Software Co-design, Custom IP


Development, High level synthesis (HLS), Efficient Coding Techniques in High Level Language
for HLS, Partial Reconfiguration. (5 hours)

4. CMOS Transistor Logic: I-V characteristics, Short channel effects, Mobility degradation &
velocity saturation, channel length modulation, body effect, drain induced barrier lowering,
leakage, RC delay model, logical effort, clock gating, dynamic voltage scaling, power gating,
glitch free circuits, dual-edge triggering, static CMOS, ratioed circuits, dynamic CMOS,
domino logic, pass transistor logic, (10 hours)

5. CMOS Synchronous Circuits: CMOS latches, CMOS flip flops, dual edge triggered flip flops,
synchronizers, arbiters, wave pipelining. (5 hours)

6. Memory Designs: SRAM, DRAM, ROM, PROM, EPROM, EEPROM, Flash, CAM (5 hours)

Practice:

1. Introduction to RTL Design: Basic combinational (half adder, full adder, multiplexer, decoder,
and so on) and sequential circuits design (Flip-flops and counters) using HDL with
commercial VLSI CAD tools or open source compilers. (5 hours)

2. Familiarity of Datapath elements: 32-bit Ripple carry adder, recursive doubling based carry
look ahead adder, Braun multiplier, Wallace tree multiplier, non restoring based division, IEEE-
754 floating point adder/Subtractor/multiplier/divider, CORDIC, modular multiplier, modular

Page 33 of 77
multiplicative inverse, modular exponentiation, cross-bar switch, Banyan switch, Batcher switch,
digital FIR filter. (10 hours)

3. Advanced VLSI circuit design concepts: Pipelining, clock gating to reduce the switching power
dissipation, hardware reuse strategy (folded hardware) to reduce the area, fault tolerant
digital circuit design, formal hardware verification using equivalence check, high level synthesis
with EDA, performance analysis of RTL design & high level synthesis based digital system using
EDA, partial reconfiguration using EDA. (5 hours)

4. Hardware-Software Co-design: Design flow of hardware-software co-design using FPGA


evaluation board with EDA, Custom IP design (arithmetic circuits as mentioned above),
hardware-software partitioning, and performance analysis of various hardware-software co-design
techniques. (10 hours)

5. Digital Circuits Design using CMOS: logic gates, combinational logic circuits, low power
CMOS circuits using VLSI CAD tool. (10 hours)

Text Book(s):
1. Neil H.E. Westte and David Money Harris, “CMOS VLSI Design: A Circuits and Systems
Perspective'', Addison Wesley, 4th Edn, 2011.
References & Web Resources:

1. Wakerly, J. F., “Digital Design: Principles and Practices”, 4th Edition, Pearson, 2008

2. MironAbramovici, Melvin A Breuer, and Arthur D Friedman, “Digital Systems Testing and
Testable Designs”, Wiley-IEEE Press, 1994.

3. N. A. Sherwani, “Algorithms for VLSI Physical Design Automation”, Bsp Books Pvt. Ltd., 3rd
edition, 2005.
4. Samir Palnitkar, “Verilog HDL ‐ Guide to Digital design and synthesis”, Pearson Education, 3rd
Edn, 2003.

Page 34 of 77
Course Title Course Code Structure (I-P-C)

Embedded System Design EC503 3 2 4


Pre-requisite, if any: Microprocessors and Microcontrollers

Course Outcomes: At the end of the course, the students will be able to:

CO1 Understand the basic elements of embedded systems such as I/O and interfaces.
CO2 Understand embedded system design using the ARM Cortex-M microcontroller with the
Launch pad IDE in C.
CO3 Develop the rapid prototype of embedded systems using microcontrollers.
CO4 Build wireless networked embedded systems using Arduino shields and modules (e.g.,
GPS, GSM/GPRS, Bluetooth, RFID, and ZigBee).
CO5 Exploit the advanced concepts such as networking and wireless communications, real-
time operating systems and control, and Internet of Things in the real time embedded
systems.
CO6 Develop the hardware-software co-design with parallel threads
CO7 Conduct experiments in Internet of Things
Syllabus:

Theory

1. Introduction to Embedded Systems: Elements of embedded systems (such as microcontrollers,


GPIO, communication, interrupts, ADC, and DAC); overview of microcontroller; Comparison
between Hardware, Software, and Firmware; Comparison between Hard, Soft, Firm, and Hybrid
real time systems; applications of embedded systems; classification of embedded systems;
characteristics of embedded systems; hardware-software partitioning; (5 hours)

2. RTOS: Software aspects of embedded systems; Real-time operating system (RTOS) - mutual
exclusion using semaphore; deadlock; critical section; event-driven scheduling; time sharing;
earliest deadline first scheduling; pre-emptive scheduling; non-pre-emptive scheduling; multi-
tasking; multi-threading; inter-process communication using mboxes, and pipes; priority
inversion; (10 hours)

3. Prototyping: Rapid prototyping of embedded systems with advanced microcontroller boards; (5


hours)

4. IoT: Basic elements of IoT; IoT systems design using advanced microcontroller boards; (10
hours)

5. Communication Protocols: I2C, CAN, PCIe, SPI, UART, USB (10 hours)

Practice

1. Experiments in GPIO such as switches, LEDs, LCD, Key pad, Seven Segment Display, Buzzer,
and relay; (5 hours)

2. Serial and parallel interfacing; data acquisition with ADC, audio, and video; timer interrupts;
Various bus inter connects such as I2C, UART, SPI, and so on; (5 hours)

3. DAC Experiments in control of RC servos, stepper motors, and DC motors; (5 hours)

4. Data acquisition and real-time control with uC boards, FPGA boards; (5 hours)

5. Add-on boards Experiments in wireless networked systems with GPS, GSM/GPRS, ZigBee,
Bluetooth, and RFID; (5 hours)
Page 35 of 77
6. Hardware-software co-design experiments using FPGA boards. (5 hours)

7. Experiments in IoT for smart automation using sensors, microcontrollers, and cloud. (5 hours)

8. Free RTOS based applications and PSoC trainer board based experiments. (8 hours)
Text Book(s):
1. D. Gajski, F. Vahid, S. Narayan, and J. Gong. “Specification and Design of Embedded
Systems”, Prentice Hall.
References & Web Resources:

1. J. W. Valavano, “Embedded Systems: Introduction to Arm Cortex-M Microcontrollers'', 2nd


edition, Create Space, 2012. ISBN: 978-1477508992.

2. J. W. Valavano, “Embedded Systems (Vol-2): Real-Time Interfacing to ARM Cortex-M


Microcontrollers'', 2nd edition, Create Space, 2011, ISBN: 978-1463590154.

3. J. W. Valavano, “Embedded Systems (Vol-3): Real-Time Operating Systems for Arm Cortex M
Microcontrollers'', 2nd edition, Create Space, 2012. ISBN: 978-1466468863.
4. A. McEwen and H. Cassimally, “Designing the Internet of Things”, 1st edition, Wiley, 2013.
ISBN: 978-8126556861.

Page 36 of 77
Course Title Course Code Structure (I-P-C)

Analog VLSI design EC504 3 2 4


Pre-requisite, if any: Analog Circuits

Course Outcomes: At the end of the course, the students will be able to:

CO1 Analyse effect of mismatch between components in the performance of ICs


CO2 Model MOSFET in IC
CO3 Analyse noise in different components in the IC
CO4 Derive the Data Sheet / Specifications of Single stage, two stage, folded cascode op
amps
CO5 Understand fully differential operation, opamp and make such circuits
Syllabus:

Theory
1. Introduction of CMOS technology: Components and mismatch in CMOS process, models and
Layout techniques. (4 hours)
2. MOS Transistor: Layout, model, Body effect, transit frequency. (4 hours)
3. Small signal analysis: Small signal analysis of MOSFET based amplifiers, cascade and cascode
MOSFET based amplifiers (10 hours)
4. Noise: Noise in Resistor, capacitor, and MOSFET, spectral density (4 hours)
5. Differential amplifiers, current mirror, cascode current mirror, folded cascodemulti stage, and
Miller compensated op amps. (6 hours)
6. Single stage op amp: Noise, offset, swing limits and slew rate, Loop gain and stability Analysis
in two and higher order opamp (5 hours)
7. Operational amplifiers based circuits: arithmetic circuits, oscillators, active filters. (10 hours)
8. PLL (5 hours)
Practice
1. Design of MOSFET based amplifiers: Schematic and layout simulation using EDA tools (15
hours)
2. Design of Op Amp based Circuits: Schematic and layout simulation using EDA tools (15
hours)
Text Book(s):
1. BehzadRazavi, “Design of Analog CMOS Integrated Circuits”, 2nd edition McGraw-Hill
Education, 2016, ISBN: 978-0-07-252493-2
2. Baker, R. Jacob, “CMOS: Circuit design, Layout, and Simulation”, John Wiley & Sons, 2019.
References & Web Resources:
1. Tony Chan Carusone, David A. Johns, Kenneth W. Martin, “Analog Integrated Circuit Design”,
John Wiley & Sons, Inc., 2012, ISBN: 978-0-470-77010-8.
2. Paul R. Gray, Paul J. Hurst, Stephen H. Lewis, Robert G. Meyer, “Analysis and Design Of
Analog Integrated Circuits”, 5th edition, John Wiley & Sons, Inc., 2009. ISBN: 978-0- 470-24599-
6.
3. TertulienNdjountche, “CMOS Analog Integrated Circuits High-Speed and PowerEfficient
Design”, CRC Press Taylor & Francis Group, 2011. ISBN: 978-1-4398- 5500-3

Page 37 of 77
Course Title Course Code Structure (I-P-C)

Advanced Computer Architecture EC505 3 0 3


Pre-requisite, if any: Digital Logic Circuits, Microprocessors and Microcontrollers

Course Outcomes: At the end of the course, the students will be able to:

Interpret the performance of a processor based on metrics such as execution time,


CO1
cycles per instruction (CPI), Instruction count etc
Predict the challenges of realizing different kinds of parallelism (such as instruction,
CO2
data, thread, core level) and leverage them for performance advancement
Apply the concept of memory hierarchy for efficient memory design and virtual
CO3
memory to overcome the memory wall
Explore emerging computing trends, computing platforms, and design trade-offs
CO4
Teaching Methodology
CO5 Design a data path of Harvard processor.
Syllabus:

Theory

1. Design Space Exploration and Optimizations: Performance metrics and performance


enhancement techniques, basic concepts of parallel processing and pipelining, power dissipation in
processors, power metrics, low-power design techniques, and Amdhal’s law (5 hours)

2. Instruction set architecture design: Instruction set design, implementation and performance
perspectives, relative advantages of RISC and CISC instruction set, processor datapath design
using Von Nuemann and Harvard architectures. (5 hours)

3. Instruction-level parallelism (ILP): Pipeline data-path, data-dependence. challenges in ILP


realization. instruction hazards and their solutions, out-of-order execution, control hazards, branch
prediction, VLIW and superscalar processors, control hazards, static and dynamic prediction,
dynamic instruction scheduling using score board, Thomosulo engine, and hardware speculation.
(10 hours)

4. Memory systems: Brief overview of memory technologies (SRAM, DRAM, ROM, CAM, and
flash), overview of memory hierarchy, cache design considerations, instruction vs. data caches,
read, write, and replacement policies in cache, analysis of cache performance, and cache design
for performance enhancement, cache coherence protocols, virtual memory organization. (10 hours)

5. Data Level Parallelism: Flynn’s processor classification, SIMD, MIMD, GPU architectures (5
hours)

6. Multicore implementations: tightly and loosely coupled multicore architectures (5 hours)

Practice

1. Processor data path design (Harvard Architecture with Microprogramming based Controller) in
HDL: It includes the functional units such as logic unit, fixed/floating point adder, multiplier, and
divider. Here, two separate memories are used for data and instruction. (15 hours)

2. Implementation of ILP and DLP processors: dynamic instruction scheduling, hazard resolution
techniques (15 hours)

3. Memory Design: cache memory design, cache coherence protocol design (5 hours)
Text Book(s):
Page 38 of 77
1. J .L. Hennessy, D.A.Patterson, “Computer Architecture: a quantitative approach”, Morgan
Kaufmann, 5th edition, 2011, ISBN: 978-1558605961.
2. William Stallings, “Computer Organization and Architecture”, Prentice Hall, 10th edition, 2015,
ISBN-10: 013293633X, ISBN-13: 978-0132936330

References & Web Resources:


1. David E. Culler, Jaswinder Singh, and Morgan Kaufmann, “Parallel Computer Architecture: A
Hardware/ Software Approach”, MK Publishers
2. C. Hamacher, Z. Vranesic and S. Zaky, “Computer Organization”, McGraw-Hill, 5th
edition,2002, ISBN: 0072320869.
3. Andrew S. Tanenbaum, “Structured Computer Organization”, Prentice Hall, 6th edition, 2012,
ISBN: 978-0132916523.
4. J.P. Shen and M.H. Lipasti, “Modern Processor Design'', MCGraw Hill, Crowfordsville, 2005
5. John P. Hayes, “Computer Architecture and Organization”, McGraw Hill

Page 39 of 77
Course Title Course Code Structure (I-P-C)

Digital Signal Processing and Architectures EC511 3 2 4


Pre-requisite, if any: Digital Signal Processing, Digital Logic Design

Course Outcomes: At the end of the course, the students will be able to:

CO1 Understand the concepts of digital signal processing: Filtering Techniques and
Orthogonal Transformations.
CO2 Develop the hardware designs of various Digital Filtering
CO3 Develop the hardware designs of various Orthogonal Transformations
CO4 Design the co-processor for digital signal processing
CO5 Analyse the multi rate signal processing
Syllabus:

Theory

1. Digital filter design: Basics of folded/parallel design, FIR/IIR filter design, steepest- descent
LMS algorithm, adaptive FIR filter design, multirate signal processing, polyphase decomposition,
and filter banks. (15 hours)

2. Discrete wavelet transform: Haar wavelet, 1D/2D/3D-Convolution based discrete wavelet


transform architecture, 1D/2D/3D-(5,3) and (9,7) lifting based discrete wavelet transform
architecture. (10 hours)

3. FFT architectures: radix-2/4 SDF, MDC, parallel FFT architectures. (5 hours)

4. HEVC architectures: introduction to DCT, integer DCT architectures, and discrete Hadamard
transform architectures. (5 hours)

5. Motion Picture Estimation: Algorithms on motion picture estimation (5 hours)

Practice

1. Hardware/software co-design of signal processing operations (8 hours)


2. Digital Signal Co-processor design (8 hours)
3. Digital Filter Designs – FIR, IIR, Adaptive filters (8 hours)
4. Discrete Orthogonal Transform Designs – FFT, integer DCT, DHT, DWT (8 hours)
5. Experiments using DSP trainer kits (8 hours)

Text Book(s):

1. S. K. Mitra, “Digital Signal Processing: A computer base approach”, Third edition,


McGraw Hill Higher Education, 2006.
2. Y.T. Chan, “Wavelet Basics”, Kluwer Publishers, Boston, 1993.
3. Simon Haykin, “Adaptive filter theory”, Pearson Education, Fifth edition, 2014.

References & Web Resources:

1. V. Oppenheium and R. W. Schafer, “Discrete-time signal processing”, Second edition,


Prentice Hall, 1999.

Page 40 of 77
Course Title Course Code Structure (I-P-C)

Mixed Signal Integrated Circuits EC512 3 2 4


Pre-requisite, if any: Analog Circuits

Course Outcomes: At the end of the course, the students will be able to:

CO1 Design and analyze ADC and DAC using EDA tools
CO2 Apply the concepts for mixed signal MOS circuit
CO3 Analyze the signal to noise ratio and modeling of mixed signals
CO4 Understand the characteristics of ADC and DAC
CO5 Design ADC and DAC using full custom ASIC
Syllabus:

Theory

1. Data converter fundamentals: Analog versus digital (or discrete time) signals, converting analog
signals to data signals, sample and hold circuits, sample and hold characteristics, switched
capacitor circuits, DAC specifications, ADC specifications.

2. Sample and hold and trans-linear circuits: Performance of sample-and-hold circuits – testing
sample and holds, MOS sample-and-hold basics, examples of CMOS S/H Circuits, bipolar and
BiCMOS Sample-and-Holds, Translinear gain Cell, trans-linear multiplier

3. DAC architectures: digital input code, R-2R ladder networks, current steering, charge scaling
DACs, cyclic DAC, pipeline DAC.

4. ADC architectures: flash ADC, 2-step flash ADC, pipeline ADC, integrating ADC, successive
approximation ADC.

5. Oversampling ADCs

Practice

1. Design and analysis of DACs in VLSI CAD tools (20 hours)

2. Design and analysis of ADCs in VLSI CAD tools (20 hours)


Text Book(s):

1. Baker, R. Jacob, “CMOS: Mixed Signal Circuit Design”, John Wiley & Sons, 2019.
2. BehzadRazavi, “Principles of Data Conversion System Design”, Wiley
References & Web Resources:

1. Tony Chan Carusone, David A. Johns, Kenneth W. Martin, “Analog Integrated Circuit Design”,
John Wiley & Sons

2. BehzadRazavi, “Design of Analog CMOS Integrated Circuits”, 2nd edition McGraw-Hill


Education, 2016

Page 41 of 77
Course Title Course Code Structure (I-P-C)

VLSI Verification and Testing EC513 3 2 4


Pre-requisite, if any: Digital Logic Circuits, VLSI Design

Course Outcomes: At the end of the course, the students will be able to:

CO1 Design and analyse complex VLSI systems using industry level Design and
verification tools.
CO2 Understand the concept of yield and identify the parameters influencing the same
CO3 Specify fabrication defects, errors and faults.
CO4 Implement combinational and sequential circuit test generation algorithms
CO5 Identify techniques to improve fault coverage
Syllabus:

Theory

1. Formal Hardware Verification: equivalence check and model check algorithms, compiler
optimizations for formal verification, temporal logic, binary decision diagrams: OBDD, ROBDD,
and BMD. (10 hours)

2. Introduction to VLSI Testing: Role of testing in VLSI Design flow, Testing at different levels
of abstraction, Fault error, defect, diagnosis, yield, Types of testing, Rule of Ten, Defects in VLSI
chip. Modelling basic concepts, Functional modelling at logic level and register level, structure
models, logic simulation, delay models. (3 hours)

3. Fault Modelling: Various types of faults, Fault equivalence and Fault dominance in
combinational sequential circuits. Fault simulation applications, General fault simulation
algorithms- Serial, and parallel, Deductive fault simulation algorithms. Combinational circuit test
generation, Structural Vs Functional test, ATPG, Path sensitization methods. (4 hours)

4. Automatic Test Pattern Generation: Difference between combinational and sequential circuit
testing, five and eight valued algebra, and Scan chain based testing method. D-algorithm
procedure, Problems, PODEM Algorithm, Problems on PODEM Algorithm. FAN Algorithm,
Problems on FAN algorithm, Comparison of D, FAN and PODEM Algorithms. Design for
Testability, Ad-hoc design, Generic scan based design. (8 hours)

5. DFT, scan chains, and BIST: Classical scan based design, System level DFT approaches, Test
pattern generation for BIST, and Circular BIST, BIST Architectures, Boundary scan testing. (8
hours)

6. Memory and Delay Test: Testable memory design-Test algorithms-Test generation for
Embedded RAMs, hazard free, robust, and non robust path delay fault tests, transition delay fault
test. (8 hours)

7. Test Compression: Test Data Compression, Compression Methods and Decompression


Methods. (4 hours)

Practice

1. Formal Verification: Basic UVM constructs & classes, design a basic test environment using
UVM, System Verilog/HDL verification features, including classes, constrained random stimulus,
coverage, strings, queues and dynamic arrays, and learn how to utilize these features for more
effective and efficient verification. (20 hours)

Page 42 of 77
2. VLSI Testing: Verify fault coverage of test patterns, simulate fault, apply test pattern, and
observe output, Hands-on on Design for test (DFT) – insert test points, scan chains, to improve
testability, Writing ATPG and Designs for Combinational and Sequential Circuits, Design of
LFSR for BIST, Fault Models simulations and verifications, Structural Testing with Fault Models,
and Implement path delay fault testing. (20 hours)
Text Book(s):

1. ZainalabedinNavabi, “Digital System Test and Testable Design using HDL Models and
Architecture”, 1st edition, Springer, 2010, ISBN: 978-1-4419-7547-8

2. Michael L. Bushnell and Vishwani D. Agrawal, “Essentials of Electronic Testing for Digital,
Memory, and Mixed-Signal VLSICircuits”, Springer, 2004. ISBN: 7923- 7991-8.

3. SystemVerilog for Design: A Guide to Using System Verilog for Hardware Design and
Modeling, 2 nd Edition, ISBN-13: 978-0387333991

4.Erik Seligman, Tom Schubert, andM V Achutha Kiran Kumar, “Formal Verification: An
Essential Toolkit for Modern VLSI Design”, MK Publishers.
References & Web Resources:

1. M. Abramovici, M. Breuer, and A. Friedman, “Digital Systems Testing and Testable Design,
IEEE Press.

2. Chris Spear, “SystemVerilog for Verification: A Guide to Learning the Testbench Language
Features'', Springer. 2012, ISBBN: 978-1461407140.

3. Donald Thomas, Logic Design and Verification Using SystemVerilog, 2016, ISBN:
1523364025.

4. “UVM Primer: A Step-by-Step Introduction to the Universal Verification Methodology”, 2013,


ISBN: 0974164933.

Page 43 of 77
Course Title Course Code Structure (I-P-C)

RFIC Design EC514 3 0 3


Pre-requisite, if any: Engineering Electromagnetics

Course Outcomes: At the end of the course, the students will be able to:
CO1 Analyze RF frequency filters, couplers, amplifier, oscillators and mixer circuits and
LNA.
CO2 Design RF frequency filters, couplers, amplifiers, and LNA.
CO3 Design Oscillators, mixers and Phase Locked Loops
CO4 Develop RFICs.
Syllabus:

Introduction to RF and Wireless Technology: A Wireless World, RF Design Is Challenging, The


Big Picture, Basic concepts in RF Design, General Considerations, Effects of Nonlinearity, Noise,
Sensitivity and Dynamic Range, Passive Impedance Transformation, Scattering Parameters,
Analysis of Nonlinear Dynamic Systems, Volterra Series.

Communication Concepts: General Considerations, Analog Modulation, Digital Modulation,


Spectral Regrowth, Mobile RF Communications, Multiple Access Techniques, Wireless
Standards.

Transceiver Architectures: General Considerations, Receiver Architectures, Transmitter


Architectures.

Low Noise Amplifiers and Mixer Design: General Considerations, Problem of Input Matching,
LNA Topologies, Gain Switching, Band Switching, High-IP2 LNAs, Nonlinearity Calculations,
General Considerations of Mixer, Passive Downconversion Mixers, Active Downconversion
Mixers, Improved Mixer Topologies, Upconversion Mixers.

Passive Devices: General Considerations, Inductors, Transformers, Transmission Lines, Constant


Capacitors.

Oscillators and Phase Locked Loop: Performance Parameters, Basic Principles, Cross-Coupled
Oscillator, Three-Point Oscillators, Voltage-Controlled Oscillators, Tuning Range Limitations, LC
VCOs with Wide Tuning Range, Phase Noise, Low-Noise VCOs, LO Interface, Mathematical
Model of VCOs, Quadrature Oscillators, Type-I PLLs, Type-II PLLs, PFD/CP Nonidealities,
Phase Noise in PLLs, Loop Bandwidth, Design Procedure.

Basics of Integer-N Frequency Synthesizers, Fractional-N Synthesizers and power Amplifiers,


Transceiver Design Example.

Text Book(s):
1. BehzadRazavi, RF Microelectronics, 2nd Edition, Pearson, 2011.
References & Web Resources:
1. I.D. Robertson , S. Lucyszyn, RFIC and MMIC Design and Technology: 13 (Materials,
Circuits and Devices), Institution of Engineering and Technology, 2001.

Page 44 of 77
Course Title Course Code Structure (I-P-C)

Electronic Packaging and Manufacturing EC515 3 2 4


Pre-requisite, if any: Basics of Electrical & Electronics Engineering

Course Outcomes: At the end of the course, the students will be able to:

CO1 Understands the electronics packaging including package styles or forms, hierarchy
and methods of packaging necessary for various environments.
CO2 Provides industry perspective in the electronics packaging
CO3 Ability to distinguish between engineering performance and economic considerations
to develop cost-efficient and high performance packaging approaches.
CO4 Predict the reliability of electronic components and structures.
CO4 Implementation of PCB design with different application
Syllabus:

Theory

1. Overview of Electronic Systems Packaging: Definition of a system and history of


semiconductors, Products and levels of packaging, Packaging aspects of handheld products,
Definition of PWB, Basics of Semiconductor and Process flowchart, Wafer fabrication, inspection
and testing, Wafer packaging; Packaging evolution; Chip connection choices, Wire bonding, TAB
and flip chip. (8 hours)

2. Electronic systems and needs, physical integration of circuits, packages, boards and complete
electronic systems; system applications like computer, automobile, medical and consumer
electronics with case studies and packaging levels. (8 hours)

3. Electrical design considerations - power distribution, signal integrity, RF package design and
Power-delivery in systems. CAD for Printed Wiring Boards (PWBs) and Design for
Manufacturability (DFM). PWB Technologies, Single-chip (SCM) and Multi-chip modules
(MCM), flex circuits. Recent trends in manufacturing like microvias, sequential build-up circuits
and high-density interconnect structures. (8 hours)

4. Materials and processes in electronics packaging, joining methods in electronics; lead-free


solders. Surface Mount Technology - design, fabrication and assembly, embedded passive
components. (8 hours)

5. Thermal management of IC and PWBs, Cooling Requirements, Electronic cooling methods


thermo-mechanical reliability, design for reliability, electrical test and green packaging issues,
Design for Reliability – Fundamentals, Induced failures. Electrical Testing –System level
electrical testing, Interconnection tests, Active Circuit Testing, Design for Testability. Trends in
packaging. (8 hours)

Practice

1. PCB design flow- Schematic -layout - PCB design using created library - PCB printing using
PCB prototyping machine-Testing and debugging of PCB. (4 hours)

2. Familiarization of different components and chip packages. (4 hours)

3. PCB Design for manufacturability. (4 hours)

4. PCB Design consideration for special circuits. (4 hours)

5. Design and development of PCBs using different simulator tools and prototyping. (4 hours)
Page 45 of 77
6. Hands-on lab sessions for board manufacturing and assembly. (4 hours)

7. Thermal and Heat Sink Design. (4 hours)


8. Electrical Testing and Active Circuit Testing. (4 hours)
Text Book(s):

1. Rao R. Tummala, “Fundamentals of Microsystems Packaging”, McGraw Hill, NY, 2001

2. Rao R Tummala and MadhavanSwaminathan, “Introduction to System-on-Package”, McGraw


Hill, 2008

3. R S Khandpur,” Printed Circuit Boards”, McGraw Hill, 2006

4.Richard K. Ulrich and William D. Brown, “Advanced Electronic Packaging”, 2nd Edition
:IEEEPress, 2006
References & Web Resources:

1. Jan Axelson, “Making Printed Circuit Boards”, TAB/McGraw Hill, 1993


2. Ronald A. Reis, “Electronic project design and fabrication”, 6/E, Prentice Hall, 2005.

Page 46 of 77
Departmental Electives

Page 47 of 77
Course Title Course Code Structure (I-P-C)
Analog and Mixed Signal Circuit Design EC521 3 0 3
Pre-requisite, if any: Analog Electronics

Course Outcomes: At the end of the course, the students will be able to:
CO1 Design and analyze complex analog integrated circuits using industry level analog IC
Design tools
CO2 Design and analyze ADC and DAC using EDA tools
CO3 Design and analyze various MOSFET based arithmetic circuits.
CO4 Learn the various methods of power optimization in analog circuits.
CO5 Learn various circuits of design of Operational Amplifier
Syllabus:

Introduction: Review of single state MOS amplifiers, current mirrors, cascode current mirrors,
active current mirrors, biasing techniques.

Op-amp design: Differential pair with current mirror load, single stage op-amp characteristics,
single stage op-amp tradeoffs, telescopic cascode op-amp, folded cascode op-amp, two stage op-
amp, fully differential single stage op-amp.

Data converter fundamentals: Analog versus digital (or discrete time) signals, converting analog
signals to data signals, sample and hold circuits, sample and hold characteristics, switched
capacitor circuits, DAC specifications, ADC specifications.

Data converters: DAC architectures – digital input code, R-2R ladder networks, current steering,
charge scaling DACs, cyclic DAC, pipeline DAC, ADC architectures – flash ADC, 2-step flash
ADC, pipeline ADC, integrating ADC, successive approximation ADC.

Phase locked loop: simple PLL, frequency/phase detectors, charge pump PLL, application as
frequency multiplier.
Text Book(s):
1. BehzadRazavi, Design of Analog CMOS Integrated Circuits McGraw-Hill
International Edition 2016.
2. Baker, R. Jacob, CMOS: Circuit design, Layout, and Simulation. John Wiley &
Sons, 2019.
References & Web Resources:
1. Phillip E. Allen and Douglas R. Holberg, CMOS Analog Circuit Design, Oxford
University Press, 2003.
2. BehzadRazavi, Fundamentals of Microelectronics, Second edition, Wiley, 2013
3. P. R. Gray, P. J. Hurst, S. H. Lewis and R. G. Meyer, Analysis And Design Of
Analog Integrated Circuits, 5th edition, John Wiley & Sons, Inc., 2009.

Page 48 of 77
Course Title Course Code Structure (I-P-C)
Artificial Intelligence and Machine Learning EC522 3 0 3
Pre-requisite, if any: Linear Algebra, Probability Theory, and Statistics

Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand the applications of Linear Algebra and Probability in Machine Learning
CO2 Familiarize with traditional and modern learning paradigms with their applications in the
real-world systems
CO3 Adapt human training for the development of intelligent machines
CO4 Model any real-world practical problem in a machine-learning domain
CO5 Grasp the artificial neural networks with an understanding of the modern deep-learning
techniques
Syllabus:

Introduction to machine learning: learning systems, classification, clustering, regression,


separability of problems; introduction to learning paradigms: supervised, unsupervised, semi
supervised, active, reinforcement with examples; cross-validation; performance evaluation metrics
for classification and clustering; curse of dimensionality, feature selection, reduction and
expansion, computation of Eigen co-ordinates and principle component analysis.
Recognition systems and design cycle, Non-linearly separable problems: solutions through
Cover’s theorem with examples, parametric learning mechanisms like Maximum likelihood,
expectation maximisation, aposteriori probabilities, Instance-based learning, Lazy learning with
K-nearest neighbour, Eager learning with basis functions, non-parametric learning using support
vector machines (SVMs).
Artificial neural networks: Analogy of biological neural network with artificial neural network;
Perceptron learning; gradient descent algorithm; multi-layer perceptrons; backpropagation
algorithm; activation functions, delta rule, learning curves: overfitting and underfitting of models;
Hebbian learning, self-organising feature map, radial basis function neural networks.
Deep neural networks: Introduction and advent of deep learning paradigm, solutions to vanishing
and exploding gradient problems, regularisation, activation functions for deep learning, deep feed
forward network, convolutional neural network (CNN), pretrained CNN models, attention
network, generative models like auto-encoders and adversarial learning, recurrent neural networks,
problem solving through deep learning and open areas of research.
Text Book(s):
1. T. M. Mitchell, Machine Learning, McGraw-Hill, 1997.
2. S. Haykin, Neural Networks: A Comprehensive Foundation. Prentice-Hall of India,
2007.
Reference Book(s):
1. R. O. Duda, P.E. Hart, D. G. Stork, Pattern Classification, John Wiley, 2001
2. I. Goodfellow, Y. Bengio, and A. Courville, Deep Learning, MIT Press, 2016

Page 49 of 77
Course Title Course Code Structure (I-P-C)
Circuits for Electronic System Design EC523 3 0 3

Pre-requisite, if any: Analog Electronics and Digital Logic Circuits

Course Outcomes: At the end of the course, the students will be able to:
CO1 Apply concepts of Analog circuits for signal conditioning, signal processing,
controller circuits, and driver circuits for power electronic circuits.
CO2 Design transformer and different power sources for various applications
CO3 Understand the interface of various modules to microcontroller and learn various
communication protocols
CO4 Perform descriptive error analysis for the circuits
CO5 Demonstrate key concepts in electronics circuit design, including tools,
approaches, and application scenarios
Syllabus:

1. Introduction to Op-Amps: Op-amp Characteristics, Negative feedback, Gain of the Op-Amp


2. Analog Signal conditioning circuits: Buffering, scaling, level translation, filtering applications,
Analog math circuits - arithmetic circuits, log circuits, trigonometric circuits and applications
Timer circuits, pulse width modulation circuits, P, PI and PID controller circuits, protection
circuits, base and gate drive circuits for power transistors, MOSFETs and IGBTs, relay and
contactor drive circuits. Design and error budget analysis of signal conditioners for low level
AC and DC applications. Error Analysis.
3. Power supply circuits:Board level power supply circuits to generate +/-12V, 5V, 3.3V, 1.8V.
Linear regulators, low drop out regulators, charge pumps, switched mode power converters.
4. Interfacing circuits: A to D, D to A, A to A and D to D interfaces, serial and parallel DACs,
sampling, RS-232, USB, I2C, LCD, serial memory, SPI, CAN, wireless (RF, WiFi) Ethernet,
RFID, SD card, SIM card, GPS, Touchscreen interfaces.
Digital circuit essentials:Digital filters, moving average, numeric formats, scaling, normalizing,
arithmetic, log, exponential, square root, cube root, hypotenuse, sine, 3 phase waves, PWM etc.
References & Web Resources:
1. Franco, S., Design with operational amplifiers and analog integrated circuits. Mc.
GrawHillbook Co. 1988.
2. Horowitz, P., and Hill, W., The art of electronics (2nd edition), Cambridge University Press.
1992.
3. Abraham Pressman, Keith Billings, Taylor Morey, Switching Power Supply Design, McGraw-
Hill Education, 2009
4. Warwick A. Smith, ARM Microcontroller Interfacing: Hardware and Software, Elektor
Electronics Publishing, 2010
5. Datasheets and Application notes of different Integrated circuits.

Page 50 of 77
Course Title Course Code Structure (I-P-C)
Cognitive Communication Networks EC524 3 0 3
Pre-requisite, if any: Signals and Systems, Analog and Digital, Wireless Communication
Techniques.

Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand the Cognitive Communication and networking as per applications.
CO2 Detects the desired signal in the scrambled spectrum.
CO3 Understand algorithms for cognitive networks.
CO4 Understand the MAC protocols in cognitive networks.
Syllabus:

Introduction to Cognitive Radio: Introduction –Software Defined Radio: Architecture–Digital


Signal Processor and SDR Baseband architecture – Reconfigurable Wireless Communication
Systems – Digital Radio Processing –Cognitive Radio: Cognitive radio Framework – Functions –
Paradigms of Cognitive Radio.

Spectrum Sensing: Introduction –Spectrum Sensing – Multiband Spectrum Sensing – Sensing


Techniques – Other algorithms – Comparison – Performance Measure & Design Trade-Offs:
Receiver operating characteristics – Throughput Performance measure –Fundamental limits and
trade-offs.

Cooperative Spectrum Acquisition: Basics of cooperative spectrum sensing–Examples of spectrum


acquisition techniques – cooperative transmission techniques – sensing strategies– Acquisition in
the Presence of Interference: Chase combining HARQ –Regenerative cooperative Diversity–
spectrum overlay– spectrum handoff.

MAC Protocols and Network Layer Design: Functionality of MAC protocol in spectrum access –
classification –Interframe spacing and MAC challenges – QOS – Spectrum sharing in CRAHN –
CRAHN models – CSMA/CA based MAC protocols for CRAHN – Routing in CRN– Centralized
and Distributed protocols – Geographical Protocol.

Text Book(s):
1. Mohamed Ibnkahla, “Cooperative Cognitive Radio Networks:The complete Spectrum
Cycle” I edition.
2. AhamedKhattab, Dmitri Perkins,BagdyByoumi,“Cognitive Radio Networks from Theory
to Practice '' 2013th edition.
References & Web Resources:
1. Kwang-Cheng Chen and Ramjee Prasad, “Cognitive Radio Networks, Wiley Publications
2. Alexander M.Wyglinski,MaziarNekovee, ThomasHou,” Cognitive Radio Communications
and Networks”. I edition.

Page 51 of 77
Course Title Course Code Structure (I-P-C)
Communication Protocols for Electronic System Design EC525 3 0 3

Pre-requisite, if any: NIL

Course Aim: To teach fundamentals of communication protocols for designing electronic


systems.

Course Outcomes: At the end of the course, the students will be able to:
CO1 Quantitative analysis of individual components of industrial data communications.
CO2 Analysis and specification of serial communication protocol standards.
CO3 Understanding the error detection, cable shielding techniques to avoid stray
pickups, noise.
CO4 Systematic understanding and development of industrial communication
protocols.
CO5 Implement the different communication protocols for different applications

Syllabus:

Overview: Standards, OSI model, Protocols, Physical standards, Modern instrumentation and
control systems, PLCs, Smart instrumentation systems, Communication principles and modes,
error detection, Transmission, UART.
Serial communication standards: Standards, serial data communication interface standards,
EIA-RS232 interface standard, RS-449, RS-422, RS-423 and RS-485 standards, Troubleshooting
and testing with RS-485, GPIB standard, USB interface.
Error Detection, Cabling and Electrical Noise: Errors, Types of error detection, control and
correction, copper and fiber cables, sources of electrical noise, shielding, cable ducting and
earthling.
Modems and Multiplexers: Synchronous and Asynchronous modes, flow control, modulation
techniques, types of a modem, modem standards, terminal and statistical multiplexers.
Communication Protocols: Flow control protocols, XON/XOFF, BSC, HDLC and File transfer
protocols, OSI model and layers, ASCII protocols, Modbus protocol.
Industrial Protocols: Introduction to HART protocol, Smart instrumentation, HART physical
layer, HART data link layer, HART application layer, ASD_i interface, Seriplex, CANbus, Device
net, Profibus, FIP bus, Fieldbus.
Local Area Networks: Circuit and packet switching, Network topologies, Media access control
mechanisms, LAN standards, Ethernet protocol, Token ring protocol.
References & Web Resources:
1. Practical data communications for instrumentation and control, John Park, Steve Mackay,
Edwin Wright, Elsevier Newnes Publisher, 2008.
2. Computer Networks,AndrewTanenbaum, Prentice Hall Professional Technical Reference,
2002.

Page 52 of 77
Course Title CourseCode Structure (I-P-C)

Design of Switched Mode Power Supplies EC526 3 0 3


Pre-requisite, if any: Basic Electrical and Electronics Engg., and Control System

Course Outcomes: At the end of the course, the students will be able to:
CO1 Able to do the Steady-State Analysis of DC-DC power converters
CO2 Design switched-mode DC-DC power converters
CO3 Apply corresponding control techniques
CO4 Design transformer and different power sources for various DC-DC Applications
CO5 Demonstrate proficiency with computer skills (e.g., PSPICE and MATLAB) for the
analysis and design of switched mode power converters.
Syllabus:

Switching devices: Ideal and real characteristics, control, drive and protection.

Design constraints of reactive elements in Power Electronic Systems: Design of inductor,


transformer and capacitors for power electronic applications, Input filter requirement.

Switching power converters: Circuit topology, operation, steady-state model, dynamic model.
PWM DC - DC Converters (CCM and DCM) - operating principles, constituent elements,
characteristics, comparisons and selection criteria.

Soft-switching DC - DC Converters: Zero-voltage-switching converters, zero-current switching


converters, multi-resonant converters and Load resonant converters.

Pulse Width Modulated Rectifiers: Properties of ideal rectifier, realization of near ideal rectifier,
control of the current waveform, single phase and three-phase converter systems incorporating
ideal rectifiers and design examples.

Review of linear control theory. Closed-loop control of switching power converters. Sample
designs and construction projects.

Text Books:

1. R. W. Erickson and D. Maksimovic, Fundamentals of Power Electronics, 2nd Kluwer Academic


Publishers, 2000. ed.,

References:

1. Marian K. Kazimierczuk, ‘Pulse-width Modulated DC-DC Power Converters’ John Wiley &
Sons Ltd., 1st Edition, 2008.

2. Philip T Krein, ‘Elements of Power Electronics’, Oxford University Press, 2nd Edition, 2012.

3. Batarseh, ‘Power Electronic Circuits’, John Wiley, 2nd Edition, 2004.

4. H. W. Whittington, B. W. Flynn, D. E. Macpherson, ‘Switched Mode Power Supplies’, John


Wiley & Sons Inc., 2nd Edition, 1997.

Page 53 of 77
Course Title Course Code Structure (I-P-C)
Detection and Estimation Theory EC527 3 0 3
Pre-requisite, if any: Signals and Systems, Random Process, Communication Systems

Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand the discrete-time and continuous-time signal theory for finding unknown
signal parameters.
CO2 Extract useful information from random observations in communications.
CO3 Design and analyze optimum detection schemes.
CO4 Estimate the error in wireless communication.
CO5 Understand the performance parameters in practical applications
Syllabus:

Detection Theory: Detection Theory in Signal Processing; the Detection Problem; the
Mathematical Detection Problem; Hierarchy of Detection Problems; Role of Asymptotics.

Statistical Detection Theory: Neyman-Pearson Theorem , Receiver Operating Characteristics,


Minimum Probability of Error, Multiple Hypothesis Testing, Minimum Bayes Risk Detector
- Binary Hypothesis.

Deterministic Signal: Matched Filters – Development of Detector, Performance of Matched Filter;


Multiple Signals – Binary case, Performance of Binary Case, M-ary case.

Random Signals: Estimator-Correlator – Energy Detector; Linear Model - Rayleigh Fading


Sinusoid, Incoherent FSK for a Multipath Channel.

Estimation Theory: Estimation in Signal Processing; Mathematical Estimation Problem; Assessing


Estimator Performance.

Minimum Variance Unbiased Estimation: Unbiased Estimators; Minimum Variance Criterion;


Existence of the Minimum Variance Unbiased Estimator; Finding the Minimum Variance
Unbiased Estimator. Estimator Accuracy Considerations; Cramer-Rao Lower Bound; General
CRLB for Signals in AWGN.

Estimation Techniques: Linear Model, General Minimum Variance Unbiased Estimation, Best
Linear Unbiased Estimators, Maximum Likelihood Estimation, Least Squares, Estimation.
Text Book(s):
1. Steven M. Kay, Fundamentals of Statistical signal processing, volume-1: Estimation theory.
Prentice Hall 2011.
2. Steven M. Kay, Fundamentals of Statistical signal processing, volume-2: Detection theory,
Prentice Hall 2011.

References & Web Resources:


1. Harry L. Van Trees, Detection, Estimation, and Modulation Theory, Part I, John Wiley &
Sons, Inc. 2011.
2. A. Papoulis and S. Unnikrishna Pillai, Probability, Random Variables and stochastic
processes, 4e. The McGraw-Hill 2010.

Page 54 of 77
Course Title Course Code Structure (I-P-C)
Digital Image Processing EC528 3 2 4
Pre-requisite, if any: Digital Signal Processing

Course Outcomes: At the end of the course, the students will be able to:

CO1 Analyse the properties of various images


CO2 Manipulate the operations between the images
CO3 Transform the given images
CO4 Detect the objects in the images
CO5 Enhance the resolution of the images
Syllabus:

Theory

1. Digital Image Fundamentals: elements of visual perception, image acquisition and display,
image sampling and quantization, pixel relationship, arithmetic operations between images and
super resolution (4 hours)

2. Image Transformation and Enhancement: geometric transformation, intensity transformation,


spatial domain filtering, DFT, DCT, KLT and frequency domain filtering (8 hours)

3. Image and Video coding: run length coding, Huffman coding, compression using DCT,
H.264/MPEG-4 advanced video coding (4 hours)

4. Image Restoration and Reconstruction: models for image degradation and restoration process,
Wieners’ filter, principles of Computed Tomography (CT), Image reconstruction from projections
using inverse Radon transform and binary image reconstruction using network flow (6 hours)

5. Color Image Processing: color models, pseudo and full-color image processing, smoothing and
sharpening in color images and segmentation based on color (4 hours)

6. Morphological Image Processing: erosion and dilation, opening and closing, boundary
extraction, hole filling, connected component extraction, thinning and thickening, and grayscale
morphology (6 hours)

7. Image Segmentation: point, line and edge detection, Hough transform, thresholding using
Otsu’s method, region based segmentation, watershed segmentation algorithm and graph-cut based
segmentation (7 hours)

8. Representation, Description and Recognition of Objects: chain codes, polygonal approximation


approaches, signatures, boundary segments, boundary descriptors, regional descriptors,
recognition based on decision–theoretic methods, matching shape numbers and string matching (7
hours)
Text Book(s):
1. Rafael C. Gonzalez and Richard E. Woods, “Digital Image Processing”, Pearson Education, 3rd
Edition, 2009
References & Web Resources:
1. William K Pratt, “Digital Image Processing”, John Willey, 4th edition, 2006.
2. A.K. Jain, “Fundamentals of Digital Image Processing”, Prentice Hall of India, 1995.
3. Rafael C. Gonzalez, Richard E. Woods, and Steven L. Eddins, “Digital Image Processing using
MATLAB”, Pearson Education, 2nd Edition, 2009.

Page 55 of 77
4. B. Chanda and D. Dutta Majumder, “Digital Image Processing and Analysis”, Prentice Hall of
India, 2008
Course Title Course Code Structure(I-P-C)

Electrical Drives EC529 1 3 3

Pre-requisite, if any: Basic Electrical and Electronics Engineering


Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand how power electronic converters and inverters operate.
CO2 Possess and understanding of feedback control theory.
CO3 Analyze and compare the performance of DC and AC machines.
CO4 Designcontrolalgorithmsforelectricdriveswhichachievetheregulation of
torque, speed or position in the above machines.

Syllabus:
Experiments conducted in this course bring out the basic concepts of different
types of electrical machines and their performance.

Experimentsareconductedtointroducetheconceptofcontrolofconventionalelectri
cmotors such as DC motor, AC Induction motor and also special machines
such as Steppermotor, Permanentmagnetbrushless motors,Servo motor.

Speed-Torquecharacteristicsofvarious typesofloadanddrivemotors arealsodiscussed.

The working principle of various power electronic converters is also studied


by conductingexperiments.

References & Web Resources:


1. R.Krishnan,“ElectricMotorDrives:Modeling,Analysis,andControl,”Pre
nticeHall, 2001.
2. .Mohan,“ElectricDrives:AnIntegrativeApproach,”MNPERE,2001.

Page 56 of 77
Course Title Course Code Structure (I-P-C)
Electromagnetic Interference and Compatibility EC530 3 0 3
Pre-requisite, if any: Electromagnetic Waves and Transmission Lines

Course Outcomes: At the end of the course, the students will be able to:
CO1 Gain knowledge to understand the concept of EMI / EMC related to product design.
CO2 Understand the various standards of EMI/EMC.
CO3 Diagnose and solve various electromagnetic compatibility problems.
CO4 Understand the sources of EMI and various coupling methods.
CO5 Learn the various methods of doing the pre-compliance measurement techniques.
Syllabus:

Introduction to EMI and EMC: Various EMC requirements and standards-Need for EMC and its
importance in electronic product design - sources of EMI - few case studies on EMC.

Conducted and radiated emission: power supply line filters-common mode and differential mode
current-common mode choke-switched mode power supplies.

Shielding techniques: shielding effectiveness-shield behaviour for the electric and magnetic field -
aperture-seams-conductive gaskets- conductive coatings.
Grounding techniques: signal ground-single point and multi-point grounding-system ground
common impedance coupling -common mode choke-Digital circuit power distribution and
grounding.
Contact protection: arc and glow discharge-contact protection network for inductive loads-C, RC,
RCD protection circuit- inductive kickback.
RF and transient immunity: transient protection network- RFI mitigation filter-power line
disturbance- ESD- human body model- ESD protection in system design.
PCB design for EMC compliance: PCB layout and stack up- multi-layerPCB objectives Return
path discontinuities-mixed signal PCB layout.
EMC pre-compliance measurement: conducted and radiated emission test-LISN- Anechoic
chamber.
Text Book(s):
1. H. W. Ott, Electromagnetic Compatibility Engineering, 2nd edition, John Wiley & Sons,
2011, ISBN: 9781118210659.
2. C. R. Paul, Introduction to Electromagnetic Compatibility, 2nd edition, Wiley India, 2010,
ISBN: 9788126528752.
References & Web Resources:
1. K. L. Kaiser, Electromagnetic Compatibility Handbook, 1st edition, CRC Press, 2005.
ISBN: 9780849320873.

Page 57 of 77
Course Title Course Code Structure (I-P-C)
MIMO Communication Systems EC531 3 0 3
Pre-requisite, if any: Signals and Systems, Analog and Digital Communications, and Wireless
Communication.

Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand the concept of MIMO communication techniques, Channel Capacity, MIMO
algorithms.
CO2 Understand power allocation strategies for practical MIMO systems.
CO3 Design algorithms of MIMO to improve the bit rate.
CO4 Understand MIMO in 5G communication.
CO5 Understand the MIMO reception in various channel conditions
Syllabus:

Introduction: Diversity-multiplexing trade-off, transmit diversity schemes, advantages and


applications of MIMO systems.

Analytical MIMO channel models: Uncorrelated, fully correlated, separately correlated and
keyhole MIMO fading models, parallel decomposition of MIMO channel.

Power allocation in MIMO systems:Uniform, adaptive and near optimal power allocation.

MIMO channel capacity: Capacity for deterministic and random MIMO channels, Capacity of
i.i.d., separately correlated and keyhole Rayleigh fading MIMO channels.

Space-Time codes: Advantages, code design criteria, Alamouti space-time codes, SER analysis of
Alamouti space-time code over fading channels, Space-time block codes, Space-time trellis codes,
Performance analysis of Space-time codes over separately correlated MIMO channel, Space-time
turbo codes.

MIMO detection: ML, ZF, MMSE, ZF-SIC, MMSE-SIC, LR based detection.

Advances in MIMO wireless communications: Spatial modulation, MIMO based cooperative


communication and cognitive radio, multiuser MIMO, cognitive-femtocells and large MIMO
systems for 5G wireless.
Text Book(s):
1. R. S. Kshetrimayum, Fundamentals of MIMO Wireless Communications,
Cambridge University Press, 2017.
2. A. Chokhalingam and B. S. Rajan, Large MIMO systems, Cambridge University
Press, 2014.

References & Web Resources:


1. B. Kumbhani and R. S. Kshetrimayum, MIMO Wireless Communications over
Generalized Fading Channels, CRC Press, 2017
2. T. L. Marzetta, E. G. Larsson, H. Yang and H. Q. Ngo, Fundamentals of Massive
3. MIMO, Cambridge University Press, 2016.

Page 58 of 77
Course Title Course Code Structure (I-P-C)
Numerical Techniques in Electromagnetics EC532 3 0 3
Pre-requisite, if any: Electromagnetic Waves and Transmission Lines

Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand how to computational solve different structures using Maxwell equations.
CO2 Understand various computational techniques and their pros and cons.
CO3 Understand which software works best in terms of speed, and accuracy for analysing a
given structure
CO4 Develop codes to analyze the EM structures.
CO5 Gain knowledge need to develop EM simulation software tools
Syllabus:

Review of vector calculus, Overview of computational electromagnetic, Review of Maxwell's


equations.
Analytical techniques in Electromagnetics.
Finite Difference Time Domain methods: Analysis, convergence, accuracy and numerical
dispersion, incorporating dielectric and dispersive materials, absorbing boundary conditions,
perfectly matched layers (PML), sources.

Moment Methods: Integral equations (EFIE,MFIE), Green’s Functions, MOM.

Finite element methods: Formulation and Absorbing boundary conditions (FEM).

Applications of computational electromagnetic: Specific Absorption Rate, Radar RCS, Periodic


structures, Eddy current calculations, capacitance and inductance calculations, Microwave inverse
imaging, Antenna radiation problems, Calculating the modes of a waveguide structure using the
integral equation method.

Text Book(s):
1. Numerical Techniques in Electromagnetic, Second Edition Hardcover – Import, 12
July 2000, by Matthew N.O. Sadiku
2. Analytical and Computational Methods in Electromagnetic, Artech House
Electromagnetic Analysis, 30 September 2008, by Ramesh Garg, Raj Mittra
References & Web Resources:
1. Computational Electromagnetics for RF and Microwave Engineering, 28 October
2010, by David B. Davidson
2. Advanced Engineering Electromagnetics Paperback - 8 October 2008, by
Constantine A. Balanis
3. Computational Methods for Electromagnetics: 4 (IEEE Press Series on
Electromagnetic Wave Theory) Hardcover – Import, 12 December 1997, by
Andrew F. Peterson, Scott L. Ray, Raj Mittra

Page 59 of 77
Course Title Course Code Structure(I-P-C)

Power Electronics EC533 3 0 3

Pre-requisite,ifany: Electronic Devices


CourseOutcomes:Atthe endofthe course,thestudentswillbeableto:
CO1 Understand basic operation of various power semiconductor devices andpassive
components
CO2 Understandthebasicprinciple ofswitchingcircuits.
CO3 DesignAC/DCrectifier,DC/DCconverterandDC/ACinvertercircuits.
CO4 Understandtherolepowerelectronicsplayintheimprovementofenergyusage,efficie
ncyandthedevelopmentofrenewableenergytechnologies.

CO5 Design different power converters

Syllabus:
Introduction topowerelectronics; applicationsandroleofpowerelectronics.
Introductiontopowersemiconductordevices,operatingcharacteristicsofPowerDi
ode,SCR,Power BJT, PowerMOSFET
andIGBT;DrivercircuitsandSnubbercircuits.
Introduction to AC/DC rectifiers, principle of operation of phase controlled
rectifiers, singlephaseandthreephaseAC-
DClinecommutatedconverters,dualconverter,andintroductiontounitypowerfacto
rconverters. Applications: DCmotordrivesandBattery chargers.
Introduction to DC/DC converters, Principle of operation of DC/DC (Buck,
Boost, Buck-Boost, Cuk, Fly-back and Forward) converters. Applications:
Power supply, DC motor drivesand SMPS.
Introductionto DC/AC inverters, PWMtechniques, Principleof operationof
single phaseand three phase DC-AC inverters, Applications: AC motor drives,
UPS, active filters, CFL,renewable power
generation,inductionanddielectricheating.

Text Book:
1. N.Mohan,T.Undeland,andW.Robbins,“PowerElectronics:Converters,A
pplications, andDesign,”3rdEdition,Wiley,2003.
2. M.Rashid,“PowerElectronics:Circuits,Devices&Applications,”Prentice
Hall,3rdEdition,2003.

References & Web Resources:


1. J.P.Agrawal,“PowerElectronic Systems:TheoryandDesign,”Pearson,2013.
2. Batarseh,“PowerElectronicCircuits,”JohnWiley,2004.2.R.W.Ericksona
ndD.Maksimovic,“Fundamentals
ofPowerElectronics,”2ndEdition,Springer,2001.
3. R.W.EricksonandD.Maksimovic,“FundamentalsofPowerElectronics,”
2ndEdition,Springer,2001.

Page 60 of 77
Course Title Course Code Structure (I-P-C)
Reliable Digital Communication System Design EC534 3 0 3
Pre-requisite, if any: Communication Systems, Digital Logic Design

Course Outcomes: At the end of the course, the students will be able to:
CO1 Learn the functional behaviour of various cryptography, intrusion detection, and error
correction algorithms.
CO2 Learn to develop hardware architectures of various cryptography, intrusion detection,
and error correction algorithms.
CO3 Develop the countermeasure prototypes of adversary attacks
CO4 Develop the crypto co-processors using FPGA.
CO5 Understand the algorithms of cryptography.
Syllabus:

Information theory, Entropy, Properties of Entropy


Goals of Relilable Digital Communication: first level of defense (integrity, confidentiality,
authenticity, and availability) and second level of defense (resilience to attacks).

Galois Field Arithmetic: Introduction to Group, Ring, and Fields, Prime/Polynomial field
representation, Irreducible polynomial, primitive polynomial, minimal polynomial, Galois field
addition, LSB first/MSB first/Montgomery Galois field multiplication architectures-bit serial, bit
parallel, digit serial, systolic, and scalable architectures, Modular exponentiators-Square-multiply
algorithm and Montgomery Ladder algorithm, Extended Euclidean algorithm/Fermat's little
theorem based multiplicative inverse architectures.

Symmetric Encryption/Decryption Architectures: DES, 3-DES, and AES (fully folded,


parameterized parallel, and fully parallel architectures).

Asymmetric Encryption/Decryption Architectures: ECC (right-to-left, left-to-right, Montgomery


based scalar multiplication in affine/projective co-ordinates) and RSA.

HASH architectures: SHA512 and SHA3.

Key exchange protocols: DiffieHelmen, Elgamal, Neuro crypto key exchange protocol.

Authentication schemes: Yang Shieh and EijiOkamato.

Pseudo random number generators, Stream ciphers.

Physical unclonable functions: RO PUF, larger decoder memory based PUF, and XOR PUF.

Intrusion Detection: Universal HASH functions, Cuckoo hashing, and Bloom filter.

Error detection codes: CRC, LRC, and parity check, Error correction codes-Hamming, BCH, Reed
Solomon, LDPC, Convolutional, Turbo product, and concatenated codes,
Hardware/software co-design analogous between ASIC/FPGA/hardware-software co-designs,
need for crypto accelerators (or coprocessors), and hardware/software partitioning based
AES/ECC architectures.

Side channel analysis: Power attack, Bit masking, and Cache template attack.

Page 61 of 77
Text Book(s):
1. Doug R. Stinson , Cryptography Theory and Practice, Third Edition, CRC Press, 2006.
2. Shu Lin and Daniel J Castello, Error Control Coding, Second Edition, Printice Hall, 2004.
3. Haykin, An Introduction to Analog and Digital Communications, wiley Vol 2, 2008.
References & Web Resources:
1. A. J. Menezes, P. C. van Oorshot, and S. A. Vanstone, Handbook of Applied
Cryptography, CRC Press, 1996.
2. Jonathan Katz and Yehuda Lindell, Introduction to Modern Cryptography, CRC Press,
2015.
3. DebdeepMukhopadhyay and RajatSubhra Chakraborty, Hardware Security: Design,
Threats and Safeguards, CRC Press, 2014.

Page 62 of 77
Course Title Course Code Structure (I-P-C)
RF and Microwave Integrated Circuits EC535 3 0 3
Pre-requisite, if any: Electromagnetic Waves and Transmission Lines,and Analog Electronics

Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand the differences in designing low frequency ICs, RFICs, and MMICs.
CO2 Analyse high frequency filters, couplers, amplifier, oscillators and mixer circuits.
CO3 Design high frequency filters, couplers, amplifiers.
CO4 Develop RFICs.
CO5 Develop MMICs.
Syllabus:

Electromagnetic Theory Review: Maxwell’s Equations, Fields in Media and Boundary Conditions,
The Wave Equation, General Plane Wave Solutions, Energy and Power, Transmission lines and
waveguide solutions.

Transmission Line Theory: The Lumped-Element Circuit Model for a Transmission Line, Field
Analysis of Transmission Lines, The Terminated Lossless Transmission Line, The Smith Chart,
The Quarter-Wave Transformer, Generator and Load Mismatches, Lossy Transmission Lines,
Transients on Transmission Lines.

Microwave Network Analysis: Impedance and Equivalent Voltages and Currents, Impedance and
Admittance Matrices, The Scattering Matrix, The Transmission (ABCD) Matrix.

Impedance matching and tuning, Microwave filter design.

Noise and nonlinear distortion, active rf and microwave devices.

Microwave Power Amplifier, Low Noise Amplifier, Oscillator and Mixer Design.

Introduction to microwave systems.


Text Book(s):
1. David M Pozar, Microwave Engineering, 4th Edition, Wiley, 2013.
2. BehzadRazavi, RF Microelectronics, 2nd Edition, Pearson, 2011.
References & Web Resources:
1. Robert E Collin, Foundations for Microwave Engineering, 2nd Edition, Wiley, 2007.
2. I.D. Robertson , S. Lucyszyn, RFIC and MMIC Design and Technology: 13 (Materials,
Circuits and Devices), Institution of Engineering and Technology, 2001.

Page 63 of 77
Course Title Course Code Structure (I-P-C)
Satellite Communication EC536 3 0 3
Pre-requisite, if any: Signals and Systems, Analog and Digital, Wireless Communication
Techniques.

Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand the satellite communication.
CO2 Understand the orbits and space of satellite communication.
CO3 Understand the optical communication.
CO4 Develop the packet switched networks.
CO5 Understand the importance of Optical technology in space applications
Syllabus:

OVERVIEW OF SATELLITE SYSTEMS, ORBITS AND LAUNCHING METHODS:


Introduction, Frequency Allocations for Satellite Services, Intelsat, U. S. Domsats Polar Orbiting
Satellites, Problems, Kepler’s First Law, Kepler’s Second Law, Kepler’s Third Law, Definitions
of Terms for Earth-orbiting Satellites, Orbital Elements, Apogee and Perigee Heights, Orbital
Perturbations, Effects of a Non-spherical Earth, Atmospheric Drag, Inclined Orbits, Calendars,
Universal Time, Julian Dates, Sidereal Time, The Orbital Plane, The Geocentric, Equatorial
Coordinate System, Earth Station Referred to the IJK Frame, The Top centric-Horizon Co-
ordinate System, The Sub-satellite Point, Predicting Satellite Position.

GEOSTATIONARY ORBIT & SPACE SEGMENT: Introduction, Antenna Look Angels, The
Polar Mount Antenna , Limits of Visibility , Near Geostationary Orbits, Earth Eclipse of Satellite,
Sun Transit Outage, Launching Orbits, Problems, Power Supply, Attitude Control, Spinning
Satellite Stabilization, Momentum Wheel Stabilization, Station Keeping, Thermal Control, TT&C
Subsystem , Transponders, Wideband Receiver, Input De-multiplexer, Power Amplifier, Antenna
Subsystem, Morelos, Anik-E, Advanced Tiros-N Spacecraft.

OPTICAL NETWORK ARCHITECTURES: Introduction to Optical Networks; Layered


Architecture- Spectrum partitioning, Network Nodes, Network Access Stations, Overlay
Processor, Logical network overlays, Connection Management and Control; Static and
Wavelength Routed Networks; Linear Light wave networks; Logically Routed Networks; Traffic
Grooming; The Optical Control Plane- Architecture, Interfaces, Functions; Generalized
Multiprotocol Label Switching – MPLS network and protocol stack, Link management, Routing
and Signaling in GMPLS.

OPTICAL PACKET SWITCHED NETWORKS: Network Architectures- Unbuffered


Networks, Buffering Strategies; OPS enabling technologies, Test beds; Optical Burst Switching,
Switching protocols, Contention Resolution, Optical Label Switching, OLS network test beds,
Control and Management – Network management functions, Configuration management,
Performance management, Fault management, Optical safety, Service interface; network
Survivability- Protection in SONET / SDH and IP Networks, Optical layer Protection,
Interworking between layers.

FREE SPACE OPTICAL COMMUNICATION: Analog and digital FSOC data link,
atmospheric attenuation, scattering, scintillation index, beam wandering, beam wave front
aberration, adaptive optics, active optics, deformable mirror control, RoFSO, atmospheric channel
models, estimation of refractive index, modulation and demodulation techniques, error control
techniques.

Page 64 of 77
Text Book(s):
1. Satellite Communications, Dennis Roddy, McGraw-Hill Publication Third
edition2001
2. Satellite Communications – Timothy Pratt, Charles Bostian and Jeremy Allnutt,
WSE, Wiley Publications, 2nd Edition, 2003.
References & Web Resources:
1. Timothy Pratt – Charles Bostian& Jeremy Allmuti, Satellite Communications, John
Willy & Sons (Asia) Pvt. Ltd. 2004
2. Wilbur L. Pritchars Henri G. SuyderHond Robert A. Nelson, Satellite
Communication Systems Engineering, Pearson Education Ltd., Second edition
2003.
3. Satellite Communications: Design Principles – M. Richharia, BS Publications, 2nd
Edition, 2003.
4. J. Gower, “Optical Communication System”, Prentice Hall of India, 2001
5. Rajiv Ramaswami, “Optical Networks “, Second Edition, Elsevier, 2004.
6. Satellite Communications Engineering – Wilbur L. Pritchard, Robert A Nelson and
Henri G. Suyderhoud, 2nd Edition, Pearson Publications, 2003.
7. Optical Fiber Communication – John M. Senior – Pearson Education – Second
Edition. 2007
8. Optical Fiber Communication – Gerd Keiser – McGraw Hill – Third Edition. 2000

Page 65 of 77
Course Title Course Code Structure(I-P-C)
Sensing and Instrumentation EC537 1 3 3

Pre-requisite, if any: Nil

CourseOutcomes:Atthe endofthe course,thestudentswillbeableto:


CO1 Buildsystemswhichwouldsensethedifferentphysicalsignal
CO2 Processthesignalsintherequiredanalogordigitalformats
CO3 Calibratesensorsaccordingtherequiredapplications.
CO4 Understandthecharacteristicsoftransducers.

Syllabus:
Transducers, transducer sensing and functions, Passive and active –
Resistance, inductanceand capacitance,Strain Gauges, Hall Effect sensors,
Opticalsensors.
Measurementofnon-
electricalquantitiessuchasdisplacement,velocity,acceleration,pressure, force,
flow and temperature, calibration of sensors, Data acquisition and
detectiontechniques, Signalconversion, PC‐based Instrumentation System.
Practiceincludesexperimentsfromfollowingtopics:

Signal generation – Instrumentation amplifiers – Signal conversion and


processing –CharacteristicsofTransducers-Calibrationofsensors–
Measurementofphysicalquantities.

Text Book(s):
1. AlanS.Morris,MeasurementandInstrumentationPrinciples,Elsevier,2001.
2. Sawhney. A. K, Course in Electrical & Electronics
Measurement &Instrumentation, DhanpatRai, 2007.

References & Web Resources:


1. Howard Austerlitz,Dataacquisitiontechniquesusing PCs, AcademicPress,
2ndEd.2002.
2. BruceMihura,LabVIEWforDataAcquisition(NationalInstrumentsVirtualInstru
mentation Series), PrenticeHall,2001.

Page 66 of 77
Course Title Course Code Structure(I-P-C)
Signal and Power Integrity EC538 3 0 3

Pre-requisite, if any: Nil

CourseOutcomes:Atthe endofthe course,thestudentswillbeableto:


CO1 Understand the design guidelines to be followed in PCB design and IC
packagingto prevent Signal and Power Integrity issues.
CO2 Analyze the physical structure and dimensions of the PCB elements and fit an
appropriate circuit model.
CO3 Analyze the measured voltages and currents in the PCB and find the causes of the
signal integrity issues.
CO4 Analyze the measured voltages and currents in the PCB and find the causes of the
power integrity issues.
CO5 Design an optimal layout for a PCB to avoid signal and power integrity issues.

Syllabus:
Signal Integrity Is in Your Future: What Are Signal Integrity, Power Integrity, and
Electromagnetic Compatibility?, Signal-Integrity Effects on One Net, Cross Talk, Rail-Collapse
Noise, Electromagnetic Interference (EMI, Two Important Signal-Integrity Generalizations,
Trends in Electronic Products, The Need for a New Design Methodology, A New Product Design
Methodology.

Time and Frequency Domains: The Time Domain, Sine Waves in the Frequency Domain, Shorter
Time to a Solution in the Frequency Domain, Sine-Wave Features, The Spectrum of a Repetitive
Signal, The Spectrum of an Ideal Square Wave, Frequency Domain to the Time Domain, Effect of
Bandwidth on Rise Time, Bandwidth and Rise Time, Bandwidth of Real Signals, Bandwidth and
Clock Frequency, Bandwidth of a Measurement, Bandwidth of a Model, Bandwidth of an
Interconnect.

Impedance and Electrical Models, The Physical Basis of Resistance, Capacitance, Inductance, and
Transmissions lines.

Transmission Lines and Reflections, Lossy Lines, Rise-Time Degradation, and Material
Properties, Cross Talk in Transmission Lines.

Differential Pairs and Differential Impedance, S-Parameters for Signal-Integrity Applications, The
Power Distribution Network (PDN)

Text Book(s):
1. Bogatin, Eric. Signal and power integrity-simplified. Pearson Education, 2010.

References & Web Resources:


1. Johnson, Howard, Howard W. Johnson, and Martin Graham. High-speed signal
propagation: advanced black magic. Prentice Hall Professional, 2003.
2. Johnson, Howard W., and Martin Graham. High-speed digital design: a handbook of
black magic. Vol. 155. Englewood Cliffs, NJ: Prentice Hall, 1993.

Page 67 of 77
Course Title Course Code Structure (I-P-C)
Software Defined Radio EC539 3 0 3
Pre-requisite, if any: Signals and Systems, Analog and Digital, Wireless Communication
Techniques.

Course Outcomes: At the end of the course, the students will be able to:

CO1 Understand the SDR, CR, and their applications.


CO2 Understand the signal processing architectures used in the SDR.
CO3 Develop the FPGA based SDR.
CO4 Develop microcontroller based SDR.
Syllabus:

INTRODUCTION TO SDR: What is Software-Defined Radio, The Requirement for Software-


Defined Radio, Legacy Systems, The Benefits of Multi-standard Terminals, Economies of Scale,
Global Roaming, Service Upgrading, Adaptive Modulation and Coding, Operational
Requirements, Key Requirements, Reconfiguration Mechanisms, , Handset Model, New Base-
Station and Network, Architectures, Separation of Digital and RF, Tower-Top Mounting, BTS
Hoteling, Smart Antenna Systems, Smart Antenna System Architectures, Power Consumption
Issues, Calibration Issues, Projects and Sources of Information on Software Defined Radio.

BASIC ARCHITECTURE OF A SOFTWARE DEFINED RADIO: Software Defined Radio


Architectures, Ideal Software Defined Radio Architecture, Required Hardware Specifications,
Digital Aspects of a Software Defined Radio, Digital Hardware, Alternative Digital Processing
Options for BTS Applications, Alternative Digital Processing Options for Handset Applications,
Current Technology Limitations, A/D Signal-to-Noise Ratio and Power 343 Consumption,
Derivation of Minimum Power Consumption, Power Consumption Examples, ADC Performance
Trends, Impact of Superconducting Technologies on Future SDR Systems.

SIGNAL PROCESSING DEVICES AND ARCHITECTURES: General Purpose Processors,


Digital Signal Processors, Field Programmable Gate Arrays, Specialized Processing Units, Tilera
Tile Processor, Application-Specific Integrated Circuits, Hybrid Solutions, Choosing a DSP
Solution. GPP-Based SDR, Non real time Radios, High-Throughput GPP-Based SDR, FPGA-
Based SDR, Separate Configurations, Multi-Waveform Configuration, Partial Reconfiguration,
Host Interface, Memory-Mapped Interface to Hardware, Packet Interface, Architecture for FPGA-
Based SDR, Configuration, Data Flow, Advanced Bus Architectures, Parallelizing for Higher
Throughput, Hybrid and Multi-FPGA Architectures, Hardware Acceleration, Software
Considerations, Multiple HA and Resource Sharing, Multi-Channel SDR.

COGNITIVE RADIO : TECHNIQUES AND SIGNAL PROCESSING:History and


background, Communication policy and Spectrum Management, Cognitive radio cycle, Cognitive
radio architecture, SDR architecture for cognitive radio, Spectrum sensing Single node sensing:
energy detection, cyclostationary and wavelet based sensing- problem formulation and
performance analysis based on probability of detection vs SNR. Cooperative sensing: different
fusion rules, wideband spectrum sensing- problem formulation and performance analysis based on
probability of detection vs SNR.

COGNITIVE RADIO: HARDWARE AND APPLICATIONS: Spectrum allocation models.


Spectrum handoff, Cognitive radio performance analysis. Hardware platforms for Cognitive radio
(USRP, WARP), details of USRP board, Applications of Cognitive radio.

Page 68 of 77
Text Book(s):
1. “RF and Baseband Techniques for Software Defined Radio” Peter B. Kenington, ARTECH
HOUSE, INC © 2005.
2. “Implementing Software Defined Radio”, Eugene Grayver, Springer, New York
Heidelberg Dordrecht London, ISBN 978-1-4419-9332-8 (eBook) 2013.

References & Web Resources:


1. “Cognitive Radio Technology”, by Bruce A. Fette, Elsevier, ISBN 10: 0-7506-7952-2,
2006.
2. “Cognitive Radio, Software Defined Radio and Adaptive Wireless Systems”,
HüseyinArslan, Springer, ISBN 978-1-4020-5541-6 (HB), 2007.

Page 69 of 77
Course Title Course Code Structure (I-P-C)
Testing and Testability EC540 3 0 3
Pre-requisite, if any: Digital Logic Design

Course Outcomes: At the end of the course, the students will be able to:

CO1 Identify the significance of testable design


CO2 Understand the concept of yield and identify the parameters influencing the same
CO3 Specify fabrication defects, errors and faults.
CO4 Implement combinational and sequential circuit test generation algorithms
CO5 Identify techniques to improve fault coverage
Syllabus:

Role of testing in VLSI Design flow, Testing at different levels of abstraction, Fault error, defect,
diagnosis, yield, Types of testing, Rule of Ten, Defects in VLSI chip. Modelling basic concepts,
Functional modelling at logic level and register level, structure models, logic simulation, delay
models.

Various types of faults, Fault equivalence and Fault dominance in combinational sequential
circuits. Fault simulation applications, General fault simulation algorithms- Serial, and parallel,
Deductive fault simulation algorithms. Combinational circuit test generation, Structural Vs
Functional test, ATPG, Path sensitization methods.

Difference between combinational and sequential circuit testing, five and eight valued algebra, and
Scan chain based testing method. D-algorithm procedure, Problems, PODEM Algorithm,
Problems on PODEM Algorithm. FAN Algorithm, Problems on FAN algorithm, Comparison of
D, FAN and PODEM Algorithms. Design for Testability, Ad-hoc design, Generic scan based
design.

Classical scan based design, System level DFT approaches, Test pattern generation for BIST, and
Circular BIST, BIST Architectures, and Testable memory design-Test algorithms-Test generation
for Embedded RAMs.

Fault Diagnosis Logic Level Diagnosis - Diagnosis by UUT reduction - Fault Diagnosis for
Combinational Circuits - Self-checking design - System Level Diagnosis.
Text Book(s):
1. M. Abramovici, M. Breuer, and A. Friedman, “Digital Systems Testing and Testable
Design, IEEE Press, 1990
2. Stroud, “A Designer’s Guide to Built-in Self-Test”, Kluwer Academic Publishers, 2002
References & Web Resources:
1. M. Bushnell and V. Agrawal, “Essentials of Electronic Testing for Digital, Memory &
Mixed-Signal VLSI Circuits”, Kluwer Academic Publishers, 2000
2. V. Agrawal and S.C. Seth, Test Generation for VLSI Chips, Computer Society Press.1989.
3. M. Abramovici, M.A. Breuer and A.D. Friedman, "Digital Systems and Testable Design",
Jaico Publishing House.
4. M.L. Bushnell and V.D. Agrawal, "Essentials of Electronic Testing for Digital, Memory and
Mixed-Signal VLSI Circuits", Kluwer Academic Publishers.
5. P.K. Lala, "Digital Circuit Testing and Testability", Academic Press, 2002.
6. A.L. Crouch, "Design Test for Digital IC's and Embedded Core Systems", Prentice Hall
International.

Page 70 of 77
Course Title Course Code Structure (I-P-C)
VLSI Technology EC541 3 2 4
Pre-requisite, if any: Electronic Devices

Course Outcomes: At the end of the course, the students will be able to:

CO1 Appreciate the intricacies involved in VLSI circuit fabrication.


CO2 Understand the various processes needed to fabricate the VLSI devices.
CO3 Learn fabrication steps for existing and coming generation devices.
Syllabus:

Theory

1. Introduction to VLSI Design, Bipolar Junction Transistor Fabrication, MOSFET Fabrication. (3


hours)

2. Crystal Structure of Si, Defects in Crystal, Crystal growth (3 hours)

3. Epitaxy, Vapour phase Epitaxy, Doping during Epitaxy, Molecular beam Epitaxy (3 hours)

4. Oxidation – Kinetics, Rate constants, Dopant Redistribution, Oxide Charges (3 hours)

5. Diffusion-Theory of Diffusion, Doping Profiles, Diffusion Systems Ion Implantation - Process,


Annealing of Damages, Masking during Implantation (3 hours)

6. Lithography, immersion lithography, e-beam lithography (3 hours)

7. Etching-Wet Chemical Etching, Dry Etching, Plasma Etching, Si, SiO2, SiN and other materials
(3 hours)

8. Deposition-Plasma Deposition, Metallization, Problems in Aluminium Metal contacts, Copper


interconnects (3 hours)

9. IC BJT - LOCOS, Trench isolation, Poly-emitter-poly-base-BJT and its suitability for high-
speed applications (3 hours)

10. MOSFET - Metal gate vs. Self-aligned Poly-gate, Tailoring of Device Parameters, CMOS
Technology, Latch - up in CMOS, MOSFET structures with strained channels and high-k gate
dielectrics, Bi-CMOS Technology, introduction to FINFETs (3 hours)

11. Small-Dimension Effects of MOSFET: Modelling for Circuits Simulation- Quantum-


Mechanical Effects; Gate Current, Junction Leakage, Scaling and New Technologies, Approaches,
and Properties of Good Models, Model Formulation Considerations, Parameter Extraction,
Compact Models, Benchmark Tests (7 hours)

12. Small-Signal Modelling of MOSFET: Conductance Parameter Definitions and Equivalent


Circuits, Conductance Parameters Due to Gate and Body Leakage, Transconductance, Source-
Drain and Output Conductance, Capacitance Definitions and Equivalent Circuits, Capacitance
Evaluation and Properties, y-Parameter Model, RF Models (6 hours)

Practice

1. Simulation of various properties of Si, SiO2, SiN and other materials (40 hours)

Page 71 of 77
Text Book(s):

1. S. K. Ghandhi, “VLSI Fabrication Principles- Silicon and Gallium Arsenide”, Wiley


Publications.
2. Y. Tsividis and C. McAndrew, “MOSFET modelling for Circuit Simulation”, Oxford
University Press, 2011
References & Web Resources:

1. S. M. Sze, “VLSI Technology”, Tata McGraw Hill, 2008

2. J. Plummer, M. D. Deal, and P. B. Griffin, “Silicon VLSI Technology, Fundamentals, Practice


and Modeling”, Pearson Higher Education, 2000

3. T. A. Fjeldly, T. Yetterdal, and M. Shur, “Introduction to Device Modeling and Circuit


Simulation”, John Wiley, 1998.
4. Y. Taur and T. H. Ning, “Fundamentals of Modern VLSI Devices”, Cambridge University
Press, 1998.

Page 72 of 77
Course Title Course Code Structure (I-P-C)
Design of IoT System EC542 3 0 3
Pre-requisite, if any: Microprocessors and Microcontrollers.

Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand the networking with IoT, its enabling technologies, and explore a young,
but rich, body of exciting ideas, solutions, and paradigm shifts.
CO2 Understanding the potential of IoT devices, support for networking according to the
protocol standards, and being able to program them, would be useful for real time
applications.
CO3 Develop the rapid prototypes of IoT based embedded systems using sensors, cloud.
CO4 Develop the IoT system using Arduino, Raspberry Pi, BeagleBone Black, and Intel
Edison/Galileo.
CO5 Implement an IoT System with Cloud
Syllabus:

Introduction to IoT: Definition, Trend, IoT applications, Sensing and Actuation, IoT Devices and
deployment models, Power awareness of IoT, LDO in IoT.

IoT Networking: Basic IoT Components, Interdependencies, Service Oriented Architecture.

IoT Data Protocols: MQTT, SMQTT, CoAP, XMPP, AMQP.

IoT Communication Protocols and their applications: IEEE 802.15.4, ZigBee6LoWPAN, Wireless
HART, Z-Wave, ISA 100, Bluetooth, and Bluetooth low energy (BLE), NFC, RFID, WiFi for IoT
communications.

Data Handling, Analytics, Data management for IoT: Data cleaning and processing, Data storage
models, Searching in IoT, Deep Web Semantic Sensor Web, Semantic web data management,
Real-time and Big data analytics for IoT, High-dimensional data processing, Parallel and
Distributed data processing.

Interoperability in IoT: Low power Interoperability for IPV6 IoT.

Cloud-Centric IoT: Architecture, Open Challenges, Energy efficiency, QoS, QoE.

Industrial IoT (IIoT): Industrial IoT and its benefits, Future of IIoT, Challenges, Examples.

IoT System Management and Virtualization: IoT environment management over Cloud computing
framework, Fog Computing paradigm for IoT with case studies, Softwarized control and
virtualization technologies for IoT network and computation resource management.

Case Studies: Sensor body-area-network, Smart cities and Smart homes, Agriculture.

IoT Network Framework: Wireless Network Fundamental for IoT communication tutorials with
demonstrations and hands-on: 802.11 and 802.15.4 MAC Fundamentals, Management Operations,
Security Overview, Network Core Protocols, Tizen Network Stack Architecture, Introduction,
CAPI Architecture Overview, Sync/Async Operation Sequence, Interaction of Network Core
Components, P2P Core Component Overview, OEM Layer, Supplicant Plugin Architecture
overview.

Page 73 of 77
Text Book(s):
1. The Internet of Things: Enabling Technologies, Platforms, and Use Cases, by EethurumRaj
and Anupama C. Raman (CRC Press).
2. Internet of Things: A Hands-on Approach, by ArshdeepBahga and Vijay Madisetti
(Universities Press).
References & Web Resources:
1. AdrianMcEwen, HakimCassimally, Designing the Internet of Things,Wiley,Nov 2013, (1st
edition)
2. Martin Charlier, Alfred Lui, Claire Rowland, Elizabeth Goodman, Ann Light, Designing
Connected Products, May 2015, O'Reilly Media.

Page 74 of 77
Course Title Course Code Structure (I-P-C)
Electric Vehicle Technology EC543 3 0 3
Pre-requisite, if any: Basic Electrical and Electronics Engineering

Course Outcomes: At the end of the course, the students will be able to:
CO1 To understand about basics of electric vehicle
CO2 To understand drives and control.
CO3 Select battery, battery indication system for EV applications
CO4 Design battery charger for an EV
CO5 Design a basic Electric Vehicle
Syllabus:

Introduction to Electric Vehicle : Review of Conventional Vehicle: Introduction to Electric


Vehicles: Types of EVs, Electric Drive-train, Tractive effort in normal driving.

Electric Drives : Basic concept of electric traction, introduction to various electric drive-train
topologies, power flow control in electric drive-train topologies, fuel efficiency analysis.
Introduction to electric components used in hybrid and electric vehicles, Configuration and control
of DC Motor drives, Configuration and control of Induction Motor drives, configuration and
control of Permanent Magnet Motor drives, Configuration and control of Switched Reluctance
Motor drives, drive system efficiency.

Energy Storage : Introduction to Energy Storage Requirements in Electric Vehicles: - Battery


based energy storage and its analysis, Fuel Cell based energy storage and its analysis,
Hybridization of different energy storage devices. Sizing the drive system, Sizing the propulsion
motor, sizing the power electronics, selecting the energy storage technology, Communications,
supporting subsystems.

Energy Management System : Energy Management Strategies, Automotive networking and


communication, EV charging standards, V2G, G2V, V2B, V2H. Business: E-mobility business,
electrification challenges, Business- E-mobility business, electrification challenges.

Mobility and Connectors : Connected Mobility and Autonomous Mobility- case study E-mobility
Indian Roadmap Perspective. Policy: EVs in infrastructure system, integration of EVs in smart
grid, social dimensions of EVs. Connectors- Types of EV charging connector, North American EV
Plug Standards, DC Fast Charge EV Plug Standards in North America, CCS (Combined Charging
System), CHAdeMO, Tesla, European EV Plug Standards.
Text Book(s):
1. Emadi, A. (Ed.), Miller, J., Ehsani, M., “Vehicular Electric Power Systems” Boca Raton,
CRC Press, 2003
2. Husain, I. “Electric and Hybrid Vehicles” Boca Raton, CRC Press, 2010.

References & Web Resources:


1. Larminie, James, and John Lowry, “Electric Vehicle Technology Explained” John
Wiley and Sons, 2012
2. Tariq Muneer and Irene IllescasGarcía, “The automobile, In Electric Vehicles:
Prospects and Challenges”, Elsevier, 2017
3. Sheldon S. Williamson, “Energy Management Strategies for Electric and Plug-in
Hybrid Electric Vehicles”, Springer, 2013
4. Patents of TESLA

Page 75 of 77
Course Title Course Code Structure (I-P-C)
Navigation System EC544 3 0 3
Pre-requisite, if any: Nil

Course Outcomes: At the end of the course, the students will be able to:
CO1 Understand the concept of GNSS, AGNSS, Radio Positioning and
Integration of Navigation technique.
CO2 Analyze navigation in various terrestrial situations.
CO3 Find the exact location of an object in the navigation system.
CO4 Design precision navigation systems.
Syllabus:

INTRODUCTION TO NAVIGATION: What Is Navigation, Position Fixing, Dead Reckoning,


Inertial Navigation, Radio and Satellite Navigation, Terrestrial Radio Navigation, Satellite
Navigation, Feature Matching, The Complete Navigation System.

NAVIGATION MATHEMATICS: Coordinate Frames, Kinematics, and the Earth: Coordinate


Frames, Kinematics, Earth Surface and Gravity Models, Frame Transformations, Coriolis force.

INERTIAL NAVIGATION: Inertial-Frame Navigation Equations, Earth-Frame Navigation


Equations, Local-Navigation-Frame Navigation Equations, Navigation Equations Precision,
Initialization and Alignment, INS Error Propagation, Platform INS, Horizontal-Plane Inertial
Navigation.

PRINCIPLES OF RADIO POSITIONING: Radio Positioning Configurations and Methods,


Positioning Signals, User Equipment, Propagation, Error Sources, and Positioning Accuracy.

GNSS: FUNDAMENTALS, SIGNALS, AND SATELLITES: Fundamentals of Satellite


Navigation, The Systems: Global Positioning System, GLONASS, Galileo, Beidou, REGIONAL
NAVIGATION SYSTEMS: Beidou and Compass, QZSS, IRNSS, GNSS INTEROPERABILITY:
Frequency Compatibility, User Competition, Multi-standard User Equipment Augmentation
Systems, System Compatibility, GNSS Signals, Navigation Data Messages.

ADVANCED SATELLITE NAVIGATION: Differential GNSS, Carrier-Phase Positioning and


Attitude, Poor Signal-to-Noise Environments, Multipath Mitigation, Signal Monitoring, Semi-
Codeless Tracking.

TERRESTRIAL RADIO NAVIGATION: Point-Source Systems, Loran, Instrument Landing


System, Urban and Indoor Positioning, Relative Navigation, Tracking, Sonar Transponders. (

FEATURE MATCHING: Terrain-Referenced Navigation, Sequential Processing, Batch


Processing, Performance, Laser TRN, Barometric TRN, Sonar TRN, Image Matching, Scene
Matching by Area Correlation, Continuous Visual Navigation, Map Matching, Other Feature-
Matching Techniques, Stellar Navigation, Gravity Gradiometry, Magnetic Field Variation. (6
hours)
INS/GNSS Integration: Integration Architectures, System Model and State Selection,
Measurement Models, Advanced INS/GNSS Integration.

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Text Book(s):
1. Principles of GNSS, Inertial, and Multisensor Integrated Navigation Systems, Paul
D. Groves Artech House, 2008 and 2013 Second Edition.
2. B.HofmannWollenhof, H.Lichtenegger, andJ.Collins, “GPS Theory and
Practice”, Springer Wien, new York, 2000.
References & Web Resources:
1. Pratap Misra and Per Enge, “Global Positioning System Signals, Measurements,
and Performance,” Ganga-Jamuna Press, Massachusetts, 2001.
2. Ahmed El-Rabbany, “Introduction to GPS,” Artech House, Boston, 2002.
3. Bradford W. Parkinson and James J. Spilker, “Global Positioning System: Theory
and Applications,” Volume II, American Institute of Aeronautics and Astronautics,
Inc., Washington, 1996.

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