MRF9120
MRF9120
MAXIMUM RATINGS
Rating Symbol Value Unit
Drain - Source Voltage VDSS - 0.5, +65 Vdc
Gate - Source Voltage VGS - 0.5, +15 Vdc
Total Device Dissipation @ TC = 25°C PD 250 W
Derate above 25°C 1.43 W/°C
Storage Temperature Range Tstg - 65 to +150 °C
Operating Junction Temperature TJ 200 °C
THERMAL CHARACTERISTICS
Characteristic Symbol Value (1) Unit
Thermal Resistance, Junction to Case RθJC 0.45 °C/W
NOTE - CAUTION - MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
Rev. 7
MOTOROLA
Motorola, RF DEVICE DATA
Inc. 2004 MRF9120R3 MRF9120LR3
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ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS (1)
ON CHARACTERISTICS (1)
Gate Threshold Voltage VGS(th) 2 3 4 Vdc
(VDS = 10 Vdc, ID = 200 µAdc)
Gate Quiescent Voltage VGS(Q) — 3.8 — Vdc
(VDS = 26 Vdc, ID = 450 mAdc)
Freescale Semiconductor, Inc.
C30
L1
C11
Balun 1 R1
C8
Z16 Z18 Z20 Z22 C19
Z24
RF Z2 Z4 Z6 Z8 Z10 Z12 Z14 RF
INPUT OUTPUT
Z1 C2 Z26 Z27
DUT
C1 C3 C4 C5 C6 C13 C14 C15 C16 C17
Z25
C7 Z17 Z19 Z21 Z23 C18
R2 C12 Balun 2
C9 L2
B1 B2 C22
VGG
+ B5
VDD
C29 + + +
VGG MRF9120
C30 B3 B4 900 MHz B6 C27 VDD
PUSH PULL
Rev 01B
C25 C26
C10
C21
WB3
CUTOUT AREA
C2 C19
C3 C17
C5
INPUT OUTPUT
C4 C13−C15 C16
WB2
WB4
C1 C6 C18 C20
R2 C7 C12 L2
C9 C22
C23 C24
18 50
EFFICIENCY (%)
Gps
h , DRAIN
17 45
16 η 40
IMD, INTERMODULATION
14 −30 −10
Tone Spacing = 100 kHz
DISTORTION (dBc)
13 IMD −32 −12
10 −38 −18
860 865 870 875 880 885 890 895 900
Freescale Semiconductor, Inc.
f, FREQUENCY (MHz)
18 −10
1200 mA
17
−30
16.5 1000 mA
800 mA
−40
1000 mA
16 800 mA
Figure 4. Power Gain versus Output Power Figure 5. Intermodulation Distortion versus
Output Power
IMD, INTERMODULATION DISTORTION (dBc)
−10 18 60
VDD = 26 Vdc
−20 IDQ = 2 x 500 mA 16 Gps 50
f1 = 880.0 MHz
f2 = 880.1 MHz
Gps, POWER GAIN (dB)
−30 14 40
−40 12 30
3rd Order
−50 10 20
5th Order
η VDD = 26 Vdc
−60 7th Order 8 IDQ = 2 x 500 mA 10
f = 880 MHz
−70 6 0
1 10 100 1000 1 10 100
Pout, OUTPUT POWER (WATTS) PEP Pout, OUTPUT POWER (WATTS) AVG.
Figure 6. Intermodulation Distortion Products Figure 7. Power Gain and Efficiency versus
versus Output Power Output Power
14 VDD = 26 Vdc 0
IDQ = 2 x 500 mA
12 f = 880 MHz −20
IS−97, Pilot, Sync, Paging
Traffic Codes 8 through 13
10 −40
750 kHz
8 −60
1.98 MHz
6 −80
0.1 1 10 100
Zo = 5 Ω
f = 865 MHz
f = 865 MHz
Zsource
f = 895 MHz
Freescale Semiconductor, Inc.
f Zsource Zload
MHz Ω Ω
− +
Z Z
source load
2X Q
A A bbb M T A M B M
NOTES:
G 4 1. INTERPRET DIMENSIONS AND TOLERANCES
B PER ASME Y14.5M−1994.
L 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION H IS MEASURED 0.030 (0.762) AWAY
1 2 FROM PACKAGE BODY.
4. RECOMMENDED BOLT CENTER DIMENSION OF
1.140 (28.96) BASED ON M3 SCREW.
B (FLANGE) INCHES MILLIMETERS
DIM MIN MAX MIN MAX
5 A 1.335 1.345 33.91 34.16
3 4 B 0.380 0.390 9.65 9.91
C 0.180 0.224 4.57 5.69
D 0.325 0.335 8.26 8.51
4X K
4X D E 0.060 0.070 1.52 1.78
F 0.004 0.006 0.10 0.15
bbb M T A M B M G 1.100 BSC 27.94 BSC
H 0.097 0.107 2.46 2.72
ccc M T A M B M K 0.085 0.115 2.16 2.92
Freescale Semiconductor, Inc.
CASE 375B - 04
ISSUE E
NI - 860
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