IC Package, Assembly Technology

I C – Integrated Circuit

An integrated circuit is a small but sophisticated device implementing s

everal electronic functions.
It is made up of two major parts: a tiny and very fragile silicon chip (die)
and a package which is intended to protect the internal silicon chip and
to provide users with a practical way of handling the component.

This presentation describes the various “front-end” and “back-end” ma

nufacturing processes. This technology is used for the majority of the I
Cs manufactured.

CONFIDENTIAL 2
THE FABRICATION OF A SEMICONDUCTOR DEVICE

The manufacturing phase of an integrated circuit can be divided into two steps. T
he first, wafer fabrication, is the extremely sophisticated and intricate process o
f manufacturing the silicon chip.

The second, assembly, is the highly precise and automated process of packagin
g the die. Those two phases are commonly known as “Front-End” and “Back-En
d” that includes two test steps: wafer probing and final test

CONFIDENTIAL 3
Front End Process

CONFIDENTIAL 4
WAFER FABRICATION ( FRONT-END )

Identical integrated circuits, called die, are made on each wafer in a multi-s
tep process. Each step adds a new layer to the wafer or modifies the existi
ng one. These layers form the elements of the individual electronic circuits.

The main steps for the fabrication of a die are summarized in the following
table. Some of them are repeated several times at different stages of the p
rocess. (The order given here doesn't reflect the real order of fabrication pr
ocess.)

CONFIDENTIAL 5
CONFIDENTIAL 6
Photo Masking Process

CONFIDENTIAL 7
Etching Process

Diffusion
Process

CONFIDENTIAL 8
Metal Deposition
Process

CONFIDENTIAL 9
Backend Process

CONFIDENTIAL 10
IC Packaging

CONFIDENTIAL 11
IC Package Composition
silicon chip

wire plastic compound

die attach

die pad

leadframe

CONFIDENTIAL 12
•Through-hole mount packages •Surface mount packages

CONFIDENTIAL 13
Package Roadmap (APK)

HDIP-18 DBS37P
SDIP-24/32…64
QFP stacked die Flip Chip

Package Distribution
HSOP-24 (QFP MCM)

QFP-100…208
DIP-16/18/24…40
SIL-13/17/23 COF
Chip Sorting
LQFP48
SSOP-16/20
Resistor
capacitor POP
SIL-9
VSO-40/56 QFP-32/48/..80
Matrix TFBGA
SO-14/16/24/32..56 VSO-101 HBGA sbSiP
LFBGA
1966 1980 1995 2000 2005 2007 (Year)

Start IC Company Trimmer Film Resistor Start IC Set up IC PKG Start IC QFP package BGA PKG COF/Leadfree Dark Green PoP
History

Testing Set-up Introduction Introduction Assembly Dev’t Center Wafer testing Introduction Introduction Introduction compound Intro sbSiP
(Y1974) (Y1966) (Y1968) (Y1969) (Y1969) (Y1987) (Y1989) (Y1992) (Y2000) (Y2002)/(Y2005) (Y2006) (Y2007)

CONFIDENTIAL 14
LQFP208 Single Chip

CONFIDENTIAL 15
MCP (multi-chip package) products

In past 7 years, APK delivered > 550Mpcs of MCP products

CONFIDENTIAL 16
Stacked die product

In past 3 years, APK delivered > 100Mpcs of stack-die products

CONFIDENTIAL 17
APK MCP products

CONFIDENTIAL 18
Multi Chip Stacked Die
QFP100_3-stacked dies

OM48316
OM48102

OM6115 OM48102

LQFP100_4-stacked dies

OM48316
Dummy
OM48102
OM6115 OM48102

CONFIDENTIAL 19
CONFIDENTIAL 20
Stack die assembly of QFP100

CONFIDENTIAL 21
APK stacked die product
QFP100 (PCD80716H) QFP100 (PCD8017H) SDIP56 (SAA4849PS)

LFBGA228 (PCF5213-1) LFBGA81 (PCD87750) HTQFN48 (BGB204)

CONFIDENTIAL 22
Conception – for 4-stacked dies pre-development
QFP100_3-stacked dies  RFS in Nov.’03

OM48316
OM48102

OM6115 OM48102

Package thickness=2.8mm
Die thickness=200um Glue
add a dummy spacer

LQFP100_4-stacked dies  to be evaluated

OM48316
Dummy
OM48102
OM6115 OM48102

Package thickness=1.4mm
Die thickness=100um B-stage/DAF

PCD8017H
OM48316

OM6115
OM48102
OM48102
Assy, F/T, Reliability test

CONFIDENTIAL 23
APK 4-stacked die concept development

Overview L/F to top die(overhang) BSOB under top die

Die-die-die bonding Bottom die - top die BSOB under top die

CONFIDENTIAL 24
BGT215 MCM with flipchip
- The BGT215 is designed for TV-enabled cellular handsets (TVoM). This
complete, low-power front-end solution is the fast way to add TV functionality to a
cellular phone.
- Related technologies :
- Flip chip on substrate
- Flip chip on die
- Stack dies
- Package : HLQFN 7x7x1.2 mm
- One lot reliability result available:
- MSLA passed Level 2 TUNER
- THB 1000 hr passed PICS
BB
- 110 C UHST 264 hr passed Substrate

- TMCL 500 cycle passed

- About 16 K samples produced, assembly yield is about 98 %

CONFIDENTIAL 25
 BGT215 Construction

Interconnect Tuner/PICS Interconnect wire/Pics

Interconnect BB/substrate Interconnect wire/substrate

CONFIDENTIAL 26
PNX0151 / LFBGA169

CONFIDENTIAL 27
PNX0151 / LFBGA169

CONFIDENTIAL 28
PNX0151 / LFBGA169

CONFIDENTIAL 29
(tbd)

CONFIDENTIAL 30
IC Package Assembly Process

CONFIDENTIAL 31
Glossary
L/F – leadframe
Substrate; laminate; PI(poly-imide) tape; film
D/A - die bond, die attach
die attach, glue, epoxy glue, alloy, soft solder, DAF, die attach film
W/B - wire bind, ball-stitch bond
Au wire, AuPd wire, Cu wire, Al wire
T/M - transfer molding, molding, encapsulation
EMC(epoxy molding compound), compound, plastic
Deflash
M/K; L/M - marking, laser marking
T/P - tin plating, solder plating, plating, strip plating
D/J - dejunk; dambar cutting
T/F - trim/form, lead cut/bend
B/M - ball mount
S/G - sawing, singulation

CONFIDENTIAL 32
Leadframe

CONFIDENTIAL 33
Different Carriers : leadframe, laminate, film…

CONFIDENTIAL 34
 Typical
Typical Assembly
Assembly Flow
Flow Chart
Chart

Wafer Wafer-test Grind/Sawing Die Bond Cure Wire Bond CC+ Molding
Cure

TAIWAN TAIWAN
P32P4910ABE2 P32P4910ABE2
C636604 C636604
9647SB 9647SB

Shipment Testing Trim/Form Plating PMC

Marking
Packing
Dambar cut, D/J

CONFIDENTIAL 35
Die bonding

CONFIDENTIAL 36
 Die bonding


curing

•Glue volume/dispenser control •Bond line thickness (BLT)

•Die placement/bond force control •Fillet height
•Glue wetting
Glue dispenser Epoxy glue
•Die position
-needle dispenser (dot) -normal oven cure
-pen writer (pattern) (1-2hrs)
-snap/fast cure
(couple minutes)

CONFIDENTIAL 37
Wire bonding

CONFIDENTIAL 38
Wire bonding

CONFIDENTIAL 39
Wire bonding

CONFIDENTIAL 40
Wire bonding – typical failure mode

1st bond
(ball)

2nd bond
(stitch)

•Metal peeling off (MPO) •Wrong wire loop •Loose stitch bond
•Chip out under bond (COUB) •Wire damage/scratch •Misplaced stitch
•Incorrect ball size •Wire short •Stitch broken
•Loose/lift ball bond •Wire broken
•Losing tail
•Ball short/shift
•Ball deformation (e.g. golf)
•Ball neck crack/broken

CONFIDENTIAL 41
 Wire bonding – MCM
1st bond (ball) 2nd bond (BSOB)

Die 2
Die 1

Die-to-die wire bonding for MCM

CONFIDENTIAL 42
Molding
transfer
plunger

top mold

mold
pellet gate air vent

primary secondary
runner runner
bottom mold

 void
CONFIDENTIAL 43
Molding – typical failure mode
• Void (internal/external)
• Incomplete Fill
• Wire Sweep
• Wire Deformation/Broken/Short between
• Resin Bleed/Flash
• Mould Sticking de-gate
• Gate Remains 
• Body Chip Out
• Body Shift
• Die Crack
• Die Paddle Shift

CONFIDENTIAL 44
QFN package

CONFIDENTIAL 45
What is QFN?

QFN is a package in lead-frame based technology

With lower parasitic impedance and thermal resistance, small size and
light, the package is suitable for middle to low pin count with high
frequency applications
The cost is also low. For all the reasons, the package is now drawing
high attention in the market
The external-exposed die-paddle and shorter wire path and leads have
improved the power dissipation and reduced the parasitic impedance
The size of the package is around ½ of the size of QFP in the same pin
count when replacing it with QFN.

CONFIDENTIAL 46
Source: Prismark

CONFIDENTIAL 47
HVQFN standard configuration options
Body size (mm) Lead count Thick (mm)
2.5x2.5 (or below) 4/8/10/12/14 0.85
3x3 4/8/10/12/16 0.85
Miniaturized
body
4x4 12/16/20/24 0.85
5x5 16/20/28/32/36 0.85
6x6 20/28/32/36/40/48/52 0.85
7x7 28/32/44/48 0.85
8x8 32/40/52/56/68 0.85
9x9 36/44/60/64 0.85 High I/O
10x10 44/52/68/72 0.85
12x12 88/100 0.85

CONFIDENTIAL 48
HVQFN bottom view

HVQFN inside view

CONFIDENTIAL 49
 PCB footprint design of HVQFN

Cross-section of HVQFN soldering Schematic of daisy-chain

CONFIDENTIAL 50
HVQFN cross-section

*Tape at the bottom of leadframe

CONFIDENTIAL 51
 HVQFN 5x5

half-etching
* QFN L/F taping

CONFIDENTIAL 52
HVQFN 10x10

CONFIDENTIAL 53
Typical HVQFN assembly process
Die attach Epoxy glue (soft-solder optioned for high thermal)

Glue curing Oven/snap cure to solidify epoxy glue

Wire bond Au/AuPd wire

Plasma Clean the leadframe to provide a better mold adhesion

Molding Plastic encapsulation for leadframe strip with backside taping

Tape detach Manual, to remove the tape on the backside of leadframe

Post mold cure Oven cure for hardening molding compound completely

Deflash (chemical) Remove plastic residue on exposed pads/lands

Laser marking Laser mark product ID codes on package body

Sawing Sawing mold map into package unit

CONFIDENTIAL 54
BGA package

CONFIDENTIAL 55
BGA – category in JEDEC

CONFIDENTIAL 56
BGA – substrate

CONFIDENTIAL 57
BGA

top side

bottom side

CONFIDENTIAL 58
BGA – substrate

CONFIDENTIAL 59
CONFIDENTIAL 60
BGA – assembly flow

CONFIDENTIAL 61
BGA molding

CONFIDENTIAL 62
BGA fluxing (ball mount)

CONFIDENTIAL 63
BGA (fluxing ) ball mount

(fluxing)

CONFIDENTIAL 64
BGA ball mount defects

CONFIDENTIAL 65
IC Package MSL

CONFIDENTIAL 66
 SHIPMENT

g
nin
itio
ond
Reflow for Soldering
c
245~260 °C pre

PCB

Application

CONFIDENTIAL 67
What is MSL (Moisture Sensitivity Level)
What happens to the product ?

1 2

3 4

MSL=1 : NOT moisture sensitive product

MSL>1 : Moisture sensitive product

CONFIDENTIAL 68
MSL levels applicable to :
SMD packages
–in REFLOW soldering process

–in WAVE soldering process

solder

MSL levels NOT applicable to :

Through Hole packages (WAVE soldering)

solder

CONFIDENTIAL 69
POPCORN

Source: Infineon

CONFIDENTIAL 70
MSLAssessment is used to:
- Rate Moisture Sensitivity of package part
- MSL 1, 2, 3 etc.

- Determine safe packing method for delivery

- Dry Pack – Yes (L>1) or No (L=1)

- Determine safe handling procedures

- Let the customer know how to handle parts

- Prevent reflow related package failures (popcorn)

- No Customer Complaints

CONFIDENTIAL 71
Peak Body (Classification) temperatures defined by:
-Package Thickness (incl LF/ substrate)
-Package Volume

CONFIDENTIAL 72
MSLA Procedure

►SCAT Test - As received parts

►Moisturize parts - Condition for MSL level
►3x Reflow parts - Per JEDEC Profile
►( Electrical Test )
►SCAT Test
►Cross-section

►Rate MSL Level and Report

CONFIDENTIAL 73
MSL levels vs floor life

Industry Specs:
–IPC/JEDEC J-STD-020C MSLA (July 2004)
–IPC/JEDEC J-STD-033 (Handling/Packing)
–Jeita ED4701

CONFIDENTIAL 74
MSL levels and Peak Body temperatures are printed on
packing labels to alert customers on how to handle.

CONFIDENTIAL 75
 Handling Moisture Sensitive Packages
Keep parts in dry bags until use

Use Floor Life based on MSL level

Once dry bag is opened Floor Life Clock can’t be stopped

- Special 1 hour rule - can open and reseal bag within 1 hour

Short Duration Exposure rule - If parts exposed to factory ambient for less than 8
hours Floor Life clock can be reset by 5X exposure time in dry box (< 10% RH)

If parts exceed Floor Life they must be baked before reflow

For Failure removal from Board part must be dry and low temperature should
be used

CONFIDENTIAL 76
External Cracks

CONFIDENTIAL 77
Internal Cracks Intersecting Bond Wire

Ball bond

CONFIDENTIAL 78
Internal Crack Extending to Lead Finger

CONFIDENTIAL 79
Internal Crack more than 2/3

CONFIDENTIAL 80
Swelling (popcorn)

CONFIDENTIAL 81
Die Lift

CONFIDENTIAL 82
 Stitch/Downbond Cracking
PLCC44 Stitch Cracks

SCAT inspection after

MSL level 1.

SCAT inspection after

MSL level 2.

SCAT inspection after

MSL level 3.

SEM photo of stitch bond crack after MSL SEM photo of stitch bond crack after
level 1 test. MSL level 2 test.

CONFIDENTIAL 83
Die Delamination

CONFIDENTIAL 84
Delamination on Wire Bond Surface

CONFIDENTIAL 85
IC Package Reliability

CONFIDENTIAL 86
First Level Reliability
Reliability
The probability that a IC package will perform a required
function without failure
– under specified conditions
– for a stated period of time

First Level
– Stand alone IC package, not soldered on a PCB
– Second level: Board Level Reliability

CONFIDENTIAL 87
Probability: “Bath-tub Curve”
Failure rate ()

Intrinsic Failure
Early Region Wear Out
Failure Region
Region MTBF applied in this
range

Time
0 168 hrs 1000 hrs

CONFIDENTIAL 88
 SHIPMENT

g
nin
itio
ond
Reflow for Soldering
c
245~260 °C pre

PCB

Application

CONFIDENTIAL 90
Reliability Stress Test
Test to asses the endurance of encapsulated semiconductor devices by
“accelerating” the conditions in shipment, SMT & application

PCB

Precon Test Environmental Test

(shipment and mounting) (field application)

CONFIDENTIAL 91
Reliability Stress Test Flow

Finished Products

Electrical Measurement /
Inspection*

preconditioning
Electr. M. / Inspection*

temperature unbiased biased high *Inspection

cycling humidity humidity temp. storage e.g. SCAT

Electrical Measurement /
Inspection*

CONFIDENTIAL 92
Biased humidity: HAST

• HAST (UHST with bias):

130 °C / 85% RH
Horizontal chamber

• Alternatives:
- 85 °C / 85% RH (THB)
- 110 °C / 85% RH

CONFIDENTIAL 93
PRECON Test
Purpose
To assess the sensitivity of non-hermetic packaged solid-state devices, after
shipment (environmental stresses), to PCB mounting (hot convection reflow
soldering)
Conditions are according to the assessed Moisture Sensitivity Level (MSL)

PCB

CONFIDENTIAL 94
TMCL Test
Purpose
To asses the endurance of non-hermetic packaged solid-state devices
exposed to mechanical stress as a result of expansion and contraction by high
and low temperature

Conditions
-55/+125 °C or
-65/+150 °C
125 °C
Air
Expansion

- 55 °C Contraction
Air

CONFIDENTIAL 95
PPOT/UHST Test
Purpose
To assess the resistance of non-hermetic packaged solid-state devices to
the effect of moisture intrusion

Conditions
PPOT: 121 °C, 100% RH (103.4 Kpa)
UHST: 130 °C, 85% RH (263 Kpa)
PPOT
CHAMBER

Accelerated intrusion of moisture

Towards electrochemically sensitive areas
(e.g. die surface: bond pad corrosion)
Through the surrounding moulding compound Moisture
or directly via gaps, cracks and delaminated areas
(as a result of Precon)

CONFIDENTIAL 96
THB/HAST Test
Purpose
To evaluate the reliability of non-hermetic packaged solid-state devices in
humid environments where temperature, humidity, and bias accelerate the
penetration of moisture

Conditions
THB: 85 °C, 85% RH with bias
THB/HAST
HAST: 130 °C, 85% RH with bias
CHAMBER
V
Accelerated intrusion of moisture & drift of impurities;
extra driving force: E-field
Towards electrochemically sensitive areas; extra driving
force: V
(e.g. die surface: bond pad corrosion)
Moisture
Tthrough the surrounding moulding compound -
-
+
+
Emax = V / dmin - +
or directly via gaps, cracks and delaminated areas
(as a result of Precon)
V

CONFIDENTIAL 97
HTSL Test
Purpose
To asses the endurance of IC products when exposed to a high
temperature for a long time period

Condition
150 °C

HTSL
150 °C

CONFIDENTIAL 98
Environmental Tests & Conditions
Environmental Stress Test Abbr. Stress Requirement
Conditions
Preconditioning PRECON per MSL, pass
1/2(a)/3/4/5(a)/6 level

Temperature Cycling Test, TMCL “C” -65°C to +150°C, 200 cls

(Condition C) unbiased

Temperature Cycling Test, TMCL “B” -55°C to +125°C, 500 cls

(Condition B) unbiased

Pressure Cooker test PPOT 121°C, 100 % RH, 96 hr

unbiased
Unsaturated Pressure Cooker UHST 130°C, 85% RH, 96 hr
unbiased
Temperature Humidity Bias, THBS/ 85°C, 85% RH, 1000 hr
Static/ Cycled Test THBC biased

Highly Accelerated Stress Test HAST 130°C, 85% RH, 96 hr

biased

High Temperature Storage Test HTSL 150°C 1000 hr

CONFIDENTIAL 99
PRECON: solder migration

CONFIDENTIAL 100
PRECON: external package crack

CONFIDENTIAL 101
PRECON: internal package crack
Delamination
propagates into a
package crackExternal
and crack
severs the ball bond.

CONFIDENTIAL 102
PRECON: popcorn

SCAT / B-Scan
SCAT / C-Scan

CONFIDENTIAL 103
PRECON/TMCL: die lift

die crack

underfill
delamination

die crack & delamination

die lift

CONFIDENTIAL 104
PRECON/TMCL: Stitch Bond Break

CONFIDENTIAL 105
PRECON/TMCL: ballneck break

CONFIDENTIAL 106
PRECON/TMCL: bond ball lift

chip out under bond

CONFIDENTIAL 107
PRECON/TMCL: solder ball crack

Die Bump Crack

Underfill
Bump

Bump Crack (solder fatigue) as

a result of delamination
Flip Chip - PASSI on laminate: CTE
- mismatch between substrate and die
- solved by selection and applying underfill

CONFIDENTIAL 108
TMCL: passivation crack / pattern shift

CONFIDENTIAL 109
TMCL: package Crack

CONFIDENTIAL 110
PPOT/UHST/THB/HAST:
wet bondpad corrosion
Ion
migration

Micro gap 


Moisture
penetration

CONFIDENTIAL 111
PPOT/UHST/THB/HAST:
dendritic growth & leakage path formation

Pin 6 Pin 7

Ag dendrite formation Cu dendrite formation /

/ current leakage current leakage

CONFIDENTIAL 112
THB/HAST: charge creep
Circuit malfunction in high voltage devices (typically a few
hundred volts) due to charge accumulation at the silicon-to-
plastic interface

HV (x100 V)

- +

• no catastrophic failure;
• but a leakage resulting in circuit
malfunction (reversible, can be baked out)

CONFIDENTIAL 113
HTSL: dry corrosion
ball delamination

Cu
Cu9Al4
Delamination starting at ball
CuAl
edges
CuAl2
Al

CONFIDENTIAL 114
HTSL: Kirkendall voiding

CONFIDENTIAL 115
THANK YOU !