Ethio Telecom Network Insight Report-Network Access

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www.huawei.com

Ethio telecom Access Network Insight Report

21/12/23

HUAWEI TECHNOLOGIES CO., LTD.


11 Overview
Overview

22 Reliability
Reliability Evaluation
Evaluation

33 Equipment
Equipment Resources
Resources

44 Performance
Performance Analysis
Analysis

55 Network
Network Configuration
Configuration

66 Equipment
Equipment Health
Health Check
Check

77 Attachment
Attachment

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HISILICON SEMICONDUCTOR
1 Overview

1.1
1.1 Objective
Objective and
and Period
Period

1.2
1.2 Comprehensive
Comprehensive Assessment
Assessment

1.3
1.3 Milestone
Milestone &
& Organization
Organization

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HISILICON SEMICONDUCTOR
Objective & Period

Objective: Analyze and assess the potential factors that affect the stable running of the network to find out
potential security risks on the network. Inform Customer of issues in advance, and provide feasible optimization
suggestions to ensure network safely and improve network reliability.

Object: Total 286 Devices are evaluated, including 119 MA5600T, 6 MA5608T and 161 MA5616.

Period: All the basic/traffic data of in this report were collected during 2019 Dec 4 th to 10th.

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HISILICON SEMICONDUCTOR
Comprehensive Assessment

6 Reliability Equipment Performance Network Equipment Health Contingency


Dimensions Evaluation Resources Analysis Configuration Check Plan Audit

NE Information
Product Health Up port Traffic Auto save Device Running
Resource configuraion Status
Basic Configuration
System Resource
(CPU/Memory) Tools
Alarm
Dual Control Boards XDSL Attainable Firewall configuraion
Traffic Flow
Rate
300+ Description
Assessment
Precaution & Risks
Formulas Slot/Card and Port NTP configuration Rectification
Link Protection Resource Contact Information
CPU Temperature
Remote Access
xDSL Ports’ Line Mac address WLAN configuration Hardware Failure
Lengths Resource Spare Parts
Scenario-Based
Emergency Plan

7 Engineering
Traffic Statistics Configuration Alarms Topology Processes Specifications
Data Sources Parameters

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HISILICON SEMICONDUCTOR
Milestone & Organization

Data Risk Report Internal Report


Data Collection Analysis Identification Preparation Technical Review Optimization Customer Workshop

Milest

one
Dec 8 Dec 22 Dec 22 Dec 29 … … …

We are here

Customer Team

Name Main Job

Habtom G/Giorgis Ethiotelecom Access Network Manger

Orga Abera Teshome Team Leader

nizati
Huawei Team
on
Name Main Job

Sirgut Zelleke Team Leader

Ephrem Assefa Technical Engineer

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HISILICON SEMICONDUCTOR
Summary

Through this inspection, we found Ethio telecom Devices network run stable, with Issues Distribution
good performance and sufficient capacity…….. However, several risks found in
Netcheck Items Severity
Equipment Health, especially configuration and some high risks in Network Architecture
Product Health Major
Analysis.
Dual Control Boards Major
Totally 15 issues found, in which 8 Major suggest to Solved immediately and 6 Reliability Evaluation
Link Protection Major
Minor issues suggest to be scheduled to rectify to avoid affecting service, 1
xDSL Ports’ Line Lengths Minor
suggestion issues need to pay more attention and rectification priority can be lower.
System Resource (CPU/Memory) Major

OLT Slot & Port Resource


Equipment Resources Minor
Analysis
MSAN Slot & Port Resource
Minor

Up link Traffic Resource Minor

Performance Analysis XDSL Attainable Rate Minor

CPU Temperature Major

Auto Save configuraion Major

Network Configuration Audit SNMP trap Major

NTP configuration Suggestion

Service Board Running state Major

Equipment Health Check Sub Board Running state Major

ONT optical power Minor

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HISILICON SEMICONDUCTOR
2 Reliability Evaluation

2.1
2.1 Product
Product Health
Health

2.2
2.2 Dual
Dual Control
Control Boards
Boards

2.3
2.3 Link
Link Protection
Protection

2.4
2.4 xDSL
xDSL Ports’
Ports’ Line
Line Lengths
Lengths

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HISILICON SEMICONDUCTOR
Dual Control boards

Evaluation description:

For large-capacity NEs, dual-control protection prevents user service


interruption if a control board is faulty so user experience is not affected.

Evaluation standard:
Enable dual-control protection on all NEs.

Evaluation result(s): NE Type NE IP Issue

Standby control board of 2 MA560XT out of 125 (1.6%) are in abnormal state
MA5600T 10.109.84.40 There is no standby in normal state
Optimization suggestion(s):
Configure dual control boards for devices without dual control boards . MA5600T 10.109.84.41 There is no standby in normal state

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HISILICON SEMICONDUCTOR
Link Protection

Value of Link Protection


The link protection includes link aggregation and port protection group . It can guarantee business can up by Protection Link when the uplink
has breakdown, avoid business breakdown.

Evaluation result(s):

1.125 of MA5600T and MA5608T in total support link


protection configuration

2.4 MA560XT out of 125 (3.2%) are not configured uplink


protection.

Optimization suggestion(s):
1.Suggest configured the link aggregation or port protection
group according to the physical truth for NEs that have not
configured link protection.
2. Configure ARP, OAM, and BFD for OLTs enabled with link
protection.

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HISILICON SEMICONDUCTOR
XDSL line Length

Evaluation description:
The copper line length is an important factor affecting xDSL port rates. A longer
copper line length leads to a lower attainable port rate, and the line is more
unstable. Learning copper line lengths of devices on the live network provides
significant guidance for the future network evolution.
Evaluation standards :
Usually, the copper line length of an VDSL port less than 800 m are
recommended. 

Evaluation result(s):
Totally collected 271 MA5600T and MA5616 (with 24288 xDSL business
ports), among which 203 valid devices (with 4144 valid ports) are evaluated.
The evaluation result is: 532 ports' line length exceed 2000m (12.83% of the
total number of valid ports). For other information, see the graph on the right
side.

Optimization suggestion(s):
For excessively long copper lines (longer than 2 km), moving nodes downwards
is recommended, to meet the subsequent requirements for high requirements..

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HISILICON SEMICONDUCTOR
3 Equipment Resource

3.1
3.1 System
System Resource(CPU/Memory)
Resource(CPU/Memory)

3.2
3.2 OLT
OLT Slot
Slot &
& PON
PON Port
Port Resource
Resource

3.4
3.4 MSAN
MSAN slot
slot &
& XDSL
XDSL port
port Resource
Resource

3.5
3.5 Mac
Mac address
address Resource
Resource

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HISILICON SEMICONDUCTOR
System Resource (CPU/Memory)

Evaluation result(s):
1.12 devices are in CPU Usage over than 80%.
2.108 devices are in Memory Usage over than 80%

Optimization suggestion(s):

Optimize devices with incorrect configurations, contact TAC for technical support

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HISILICON SEMICONDUCTOR
OLT Slot Usage

Slot Usage of All OLTs


NE Type NE IP Occupancy Rate(%)
MA5608T 10.109.148.2 100.00%
MA5608T 10.109.156.41 100.00%
MA5608T 10.109.156.6 100.00%
MA5608T 10.109.160.2 100.00%
MA5608T 10.109.164.66 100.00%
MA5608T 10.109.164.9 100.00%
MA5600T 10.109.83.130 12.50%
MA5600T 10.109.83.2 6.25%
MA5600T 10.109.92.10 31.25%
MA5600T 10.109.92.30 31.25%
MA5600T 10.109.92.50 37.50%
MA5600T 10.109.92.70 31.25%
MA5600T 10.109.92.90 37.50%
MA5600T 10.109.93.130 37.50%
MA5600T 10.109.93.150 37.50%
MA5600T 10.109.93.170 37.50%
MA5600T 10.109.94.74 37.50%
MA5600T 10.109.95.2 12.50%

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HISILICON SEMICONDUCTOR
MSAN Slot Usage

NE Type NE IP Occupancy Rate(%)


MA5616 10.109.156.37 100.00%
MA5616 10.109.156.89 100.00%
MA5616 10.109.160.34 100.00%
MA5616 10.109.164.140 100.00%
MA5616 10.109.164.43 100.00%
MA5600T 10.109.81.12 87.50%
MA5600T 10.109.81.2 81.25%
MA5616 10.109.160.42 100.00%
MA5600T 10.109.81.20 81.25%
MA5600T 10.109.81.24 81.25%
MA5600T 10.109.81.29 100.00%
MA5600T 10.109.81.69 100.00%
MA5600T 10.109.84.40 100.00%
MA5600T 10.109.84.8 93.75%
MA5600T 10.109.87.10 87.50%
MA5600T 10.109.87.11 81.25%
MA5600T 10.109.87.13 93.75%
MA5600T 10.109.87.34 100.00%
MA5600T 10.109.87.35 93.75%
MA5600T 10.109.87.6 100.00%

TELECOMMUNICATION INFRASTRUCTURE COMPANY -- HUAWEI TECHNOLOGIES CO., LTD. Page 15


HISILICON SEMICONDUCTOR
DSLAM/MSAN xdsl port Usage

NE Type NE IP Occupancy Rate(%)


MA5600T 10.109.81.66 83.33%
MA5616 10.109.95.24 100.00%

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HISILICON SEMICONDUCTOR
4 Performance Analysis

4.1
4.1 XDSL
XDSL MTRB
MTRB Rate
Rate

4.2
4.2 XDSL
XDSL Attainable
Attainable Rate
Rate
4.3
4.3 CPU
CPU Temperature
Temperature

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HISILICON SEMICONDUCTOR
XDSL MTRB Rate

Evaluation description:
Mean time between resync (MTBR) = Valid port online duration during
the collection period/Total number of resync of a port during the
collection period A larger MTBR value indicates that the port is more
stable.
Evaluation standards:
1.Device level: If the percentage of ports with the resync ratio for an NE
is equal to or exceeds 30%, the NE has a high resync ratio.
2.Port level: The MTBR evaluation involves the unstable threshold. If a
port's MTBR is less than or equal to the unstable threshold, the port is a
resync port. If a port's MTBR is greater than the unstable threshold, the
port does not have resync. The unstable threshold is 10800 (s) in this
evaluation.

Evaluation result(s):
Totally collected 271 MSANs/DSLAMs/MxUs (with 24288 xDSL business
ports), among which 194 valid devices (with 2034 valid ports) are
evaluated. The evaluation result is: 2014 ports are resync ports (99.02%
of the total number of valid ports) and 20 ports do not have resync
(0.98% of the total number of valid ports).

Optimization suggestion(s):
Port with high resync ratios may cause poor user experience, especially
for the video service. Frequent resync causes interruptions in video
playing. Lines connected to these ports require optimization and
reconstruction.

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HISILICON SEMICONDUCTOR
Rate Fulfillment Ratio of xDSL Ports

Evaluation description:
The attainable rate evaluation for xDSL ports helps carriers learn rates that all
ports can reach, which provides instructions for bandwidth acceleration and
high-bandwidth service provisioning.

Evaluation standards:
A device meets the requirements if the attainable rates of 80% xDSL ports on
the device are greater than or equal to target rate 10Mbit/s.

Evaluation result(s):
1.Totally collected 203 Devices (with 4144 xDSL business ports), Attainable rate Rate
Fulfillment is 3234 (Percentage 78.04%),NE numbers of Attainable rate Rate not
Fulfillment is 910(Percentage is 21.96%);

2.69 (40%) Devices has less than 80% XDSL ports whose attainable rate more than
10M.

Optimization suggestion(s):
May determine the reconstruction solution based on project
requirements, such as site move down or FTTX-change.

TELECOMMUNICATION INFRASTRUCTURE COMPANY -- HUAWEI TECHNOLOGIES CO., LTD. Page 19


HISILICON SEMICONDUCTOR
CPU Temperature

Peak Temperature Over than 60


Temperature
Device Type Device IP
(°C)
MA5616 10.109.152.14 74
MA5600T 10.109.81.31 70
MA5600T 10.109.81.69 69
MA5616 10.109.164.134 67
MA5600T 10.109.81.76 67
MA5600T 10.109.84.36 67
MA5600T 10.109.84.14 66
MA5616 10.109.156.37 65
MA5608T 10.109.148.2 65
MA5608T 10.109.160.2 65
MA5608T 10.109.164.9 64
MA5600T 10.109.81.8 64
MA5600T 10.109.87.38 64
MA5600T 10.109.84.4 63
Evaluation result(s):
MA5616 10.109.160.60 62
Temperature of 82 devices are over than 55°C. MA5600T 10.109.84.5 62
MA5600T 10.109.84.8 62
Optimization suggestion(s):
MA5616 10.109.164.138 61
Identify and reconstruct devices with high CPU temperatures to ensure normal services MA5600T 10.109.87.9 61
MA5616 10.109.164.62 61
MA5600T 10.109.81.7 61
MA5600T 10.109.81.75 61

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HISILICON SEMICONDUCTOR
5 Network Configuration

5.1
5.1 Auto
Auto save
save configuraion
configuraion
5.2
5.2 SNMP
SNMP Trap
Trap configuration
configuration
5.3
5.3 NTP
NTP configuration
configuration

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HISILICON SEMICONDUCTOR
Auto Save configuraion

Key Findings:
The AutoSave configuration device is disabled.

Impact:
After the system is reset, all the delivered service configurations are lost

The effected NEs:


All MA5616 Devices have the issue

Suggestions:
Run the following commands to enable automatic saving:
Method 1: huawei(config)#autosave interval on
Method 2: huawei(config)#autosave time on
Method 3: huawei(config)#autosave type all

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HISILICON SEMICONDUCTOR
SNMP Trap configuration

Key Findings:
The function of the device sending the trap packets to the NMS is disabled.

Impact:
Device alarm and event can not be reported to NMS.

The effected NEs:


1 MA15616 has the issue

Suggestions:
Please enable SNMP trap.

Example:
DeviceName(config)#snmp-agent trap enable

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HISILICON SEMICONDUCTOR
NTP configuration

Key Findings:
clock is not synchronized with any NTP server

Impact:
Alarms cannot be centralized

The effected NEs:


All 119 MA560XTs

Suggestions:
please specify NTP server
huawei(config)#ntp-service unicast-server xxx.xxx.xxx.xxx

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HISILICON SEMICONDUCTOR
6 Equipment Health Check

6.1
6.1 Service
Service Board
Board Running
Running state
state

6.2
6.2 Sub
Sub board
board Running
Running State
State

6.8
6.8 OLT
OLT PON
PON optical
optical power
power

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HISILICON SEMICONDUCTOR
Board Running state

Key Findings:
Some service boards are failed.
Some service boards are prohibited.
Some service boards are manually shutdown.

Impact:
The services carried by the board cannot be used normally.

The effected NEs:


Total 40 Devices have board failure issue.

Suggestions:
1ensure the board work normal if it needs to carry service
and delete the board if it is not used

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HISILICON SEMICONDUCTOR
Sub-Board Running state

Key Findings:
daughter board is in abnormal state .

Impact:
The services carried by the board cannot be used normally.

The effected NEs:


Total 3 Devices have board failure issue.

NE Type NE IP Issue

MA5600T (10.109.81.6 Sub board is not in normal state

MA5600T 10.109.87.7 Sub board is not in normal state


Sub board is not in normal state
MA5616 10.109.156.71

Suggestions:
Replace the faulty sub-board board and Ensure that the sub-board status is normal please

TELECOMMUNICATION INFRASTRUCTURE COMPANY -- HUAWEI TECHNOLOGIES CO., LTD. Page 27


HISILICON SEMICONDUCTOR
ONT optical power

Key Findings:
The optical power received by the ONT is beyond the normal range

Impact:
The ONT may go offline abnormally..

The effected NEs:


ONTs of 8 MA560XTs have the issue.

Suggestions:
Check whether the optical path is faulty.
Query the optical power received by ONT on PON interface. If the optical power is too low or too high(CLASS B+ : -28~-8dBm ; CLASS C+ : -32~-12dBm ; CLASS C+
+ : -35~-15dBm ; PX20 : -27~-6dBm ; PX20+ : -30~-6dBm ; PX20++ : -34~-10dBm), check the optical path information. If optical path works normally, contact the
technical support. If the optical power is too high, the ODN is unreasonable, please increase the optical attenuator.If the optical power is too low,please check
whether the optical attenuation is reasonable.

TELECOMMUNICATION INFRASTRUCTURE COMPANY -- HUAWEI TECHNOLOGIES CO., LTD. Page 28


HISILICON SEMICONDUCTOR
Precaution-Expansion failure due to Dusty

Summary:
If a subrack device has been running in heavy dust for a long period of time (for example, several months or years), dust may be accumulated on the connectors
connected to vacant slots.In this case, if a service board is installed in such a slot for capacity expansion, this service board may fail to register with the control board,
or services on this board may fail due to accumulated dust

Trigger conditions
The new board fails to register with the control board, or services fail on the new board.

Identification method
This issue is prone to occur in either of the following scenarios:
 The subrack device has been running in a heavy dust environment, such as on the curb, near a factory, or in a region where a sandstorm has happened.
The subrack device is located in a cabinet using direct ventilation design. In addition, service boards are not fully configured in the device.
If a newly installed service board fails to register with the control board, or services fail on this board, check whether the pins on the connector in the affected slot are
covered by dust. If it is true, this issue complies with the issue described in this document.

Root cause
If the subrack device has been running in a dusty environment for a long period of time, dust is accumulated on the connectors connected to vacant slots. In this
case, if a service board is installed in such a slot for capacity expansion, this service board insecurely connects to the backplane due to dust. As a result, this service
board fails to register with the control board, or services on this board fail.

Preventive measures
Before installing a service board in a vacant slot for capacity expansion, perform the following steps:
   Step 1      Clean the device.
For instructions about how to clean a device, see section [Attachment] in this document.
   Step 2      Install and remove the service board for 3-5 times.
----End
During routine maintenance, clean the devices once per quarter or half year.

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HISILICON SEMICONDUCTOR
7 Attachment

7.1
7.1 Issue
Issue List
List

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HISILICON SEMICONDUCTOR
Issue List

Issue summary

issue list

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HISILICON SEMICONDUCTOR
Thank you!

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HISILICON SEMICONDUCTOR

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