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The A16 Bionic chip
Mac transition to
Apple silicon
The Apple M1

Apple silicon is a series of system on a chip (SoC) and system in a package (SiP) processors designed by Apple Inc., mainly using the ARM architecture. They are the basis of Mac, iPhone, iPad, Apple TV, Apple Watch, AirPods, AirTag, HomePod, and Apple Vision Pro devices.

Apple announced its plan to switch Mac computers from Intel processors to Apple silicon at WWDC 2020 on June 22, 2020.[1][2] The first Macs built with the Apple M1 chip were unveiled on November 10, 2020. As of June 2023, the entire Mac lineup uses Apple silicon chips.

Apple fully controls the integration of Apple silicon chips with the company's hardware and software products. Johny Srouji is in charge of Apple's silicon design.[3] Manufacturing of the chips is outsourced to semiconductor contract manufacturers such as TSMC.

A series

The "A" series is a family of SoCs used in the iPhone, certain iPad models, and the Apple TV. "A" series chips were also used in the discontinued iPod Touch line and the original HomePod. They integrate one or more ARM-based processing cores (CPU), a graphics processing unit (GPU), cache memory and other electronics necessary to provide mobile computing functions within a single physical package.[4]

Apple A4

Main article: Apple A4

The Apple A4 is a PoP SoC manufactured by Samsung, the first SoC Apple designed in-house.[5] It combines an ARM Cortex-A8 CPU – also used in Samsung's S5PC110A01 SoC[6][7] – and a PowerVR SGX 535 graphics processor (GPU),[8][9][10] all built on Samsung's 45-nanometer silicon chip fabrication process.[11][12] The design emphasizes power efficiency.[13] The A4 commercially debuted in 2010, in Apple's iPad tablet,[8] and was later used in the iPhone 4 smartphone,[14] the fourth-generation iPod Touch, and the 2nd-generation Apple TV.[15]

The Cortex-A8 core used in the A4, dubbed "Hummingbird", is thought to use performance improvements developed by Samsung in collaboration with chip designer Intrinsity, which was subsequently acquired by Apple[16][17] It can run at far higher clock rates than other Cortex-A8 designs yet remains fully compatible with the design provided by ARM.[18] The A4 runs at different speeds in different products: 1 GHz in the first iPads,[19] 800 MHz in the iPhone 4 and fourth-generation iPod Touch, and an undisclosed speed in the 2nd-generation Apple TV.

The A4's SGX535 GPU could theoretically push 35 million polygons per second and 500 million pixels per second, although real-world performance may be considerably less.[20] Other performance improvements include additional L2 cache.

The A4 processor package does not contain RAM, but supports PoP installation. The 1st-generation iPad, fourth-generation iPod Touch,[21] and the 2nd-generation Apple TV[22] have an A4 mounted with two low-power 128 MB DDR SDRAM chips (totaling 256 MB), while the iPhone 4 has two 256 MB packages for a total of 512 MB.[23][24][25] The RAM is connected to the processor using ARM's 64-bit-wide AMBA 3 AXI bus. To give the iPad high graphics bandwidth, the width of the RAM data bus is double that used in previous ARM11- and ARM9-based Apple devices.[26]

Apple A5

Main article: Apple A5

The Apple A5 is an SoC manufactured by Samsung[27] that replaced the A4. The chip commercially debuted with the release of Apple's iPad 2 tablet in March 2011,[28] followed by its release in the iPhone 4S smartphone later that year. Compared to the A4, the A5 CPU "can do twice the work" and the GPU has "up to nine times the graphics performance",[29] according to Apple.

The A5 contains a dual-core ARM Cortex-A9 CPU[30] with ARM's advanced SIMD extension, marketed as NEON, and a dual core PowerVR SGX543MP2 GPU. This GPU can push between 70 and 80 million polygons/second and has a pixel fill rate of 2 billion pixels/second. The iPad 2's technical specifications page says the A5 is clocked at 1 GHz,[31] though it can adjust its frequency to save battery life.[30][32] The clock speed of the unit used in the iPhone 4S is 800 MHz. Like the A4, the A5 process size is 45 nm.[33]

An updated 32 nm version of the A5 processor was used in the 3rd-generation Apple TV, the fifth-generation iPod Touch, the iPad Mini, and the new version of iPad 2 (version iPad2,4).[34] The chip in the Apple TV has one core locked.[35][36] Markings on the square package indicate that it is named APL2498, and in software, the chip is called S5L8942. The 32 nm variant of the A5 provides around 15% better battery life during web browsing, 30% better when playing 3D games and about 20% better battery life during video playback.[37]

In March 2013, Apple released an updated version of the 3rd-generation Apple TV (Rev A, model A1469) containing a smaller, single-core version of the A5 processor. Unlike the other A5 variants, this version of the A5 is not a PoP, having no stacked RAM. The chip is very small, just 6.1×6.2 mm, but as the decrease in size is not due to a decrease in feature size (it is still on a 32 nm fabrication process), this indicates that this A5 revision is of a new design.[38] Markings tell that it is named APL7498, and in software, the chip is called S5L8947.[39][40]

Apple A5X

Main article: Apple A5X

The Apple A5X is an SoC announced on March 7, 2012, at the launch of the third-generation iPad. It is a high-performance variant of the Apple A5; Apple claims it has twice the graphics performance of the A5.[41] It was superseded in the fourth-generation iPad by the Apple A6X processor.

The A5X has a quad-core graphics unit (PowerVR SGX543MP4) instead of the previous dual-core as well as a quad-channel memory controller that provides a memory bandwidth of 12.8 GB/s, roughly three times more than in the A5. The added graphics cores and extra memory channels add up to a very large die size of 165 mm2,[42] for example twice the size of Nvidia Tegra 3.[43] This is mainly due to the large PowerVR SGX543MP4 GPU. The clock frequency of the dual ARM Cortex-A9 cores have been shown to operate at the same 1 GHz frequency as in A5.[44] The RAM in A5X is separate from the main CPU package.[45]

Apple A6

Main article: Apple A6

The Apple A6 is a PoP SoC introduced on September 12, 2012, at the launch of the iPhone 5, then a year later was inherited by its minor successor the iPhone 5C. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A5.[46] It is 22% smaller and draws less power than the 45 nm A5.[47]

The A6 is said to use a 1.3 GHz[48] custom[49] Apple-designed ARMv7 based dual-core CPU, called Swift,[50] rather than a licensed CPU from ARM like in previous designs, and an integrated 266 MHz triple-core PowerVR SGX 543MP3[51] graphics processing unit (GPU). The Swift core in the A6 uses a new tweaked instruction set, ARMv7s, featuring some elements of the ARM Cortex-A15 such as support for the Advanced SIMD v2, and VFPv4.[49] The A6 is manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.[52]

Apple A6X

Main article: Apple A6X

Apple A6X is an SoC introduced at the launch of the fourth-generation iPad on October 23, 2012. It is a high-performance variant of the Apple A6. Apple claims the A6X has twice the CPU performance and up to twice the graphics performance of its predecessor, the Apple A5X.[53]

Like the A6, this SoC continues to use the dual-core Swift CPU, but it has a new quad core GPU, quad channel memory and slightly higher 1.4 GHz CPU clock rate.[54] It uses an integrated quad-core PowerVR SGX 554MP4 graphics processing unit (GPU) running at 300 MHz and a quad-channel memory subsystem.[54][55] Compared to the A6 the A6X is 30% larger, but it continues to be manufactured by Samsung on a high-κ metal gate (HKMG) 32 nm process.[55]

Apple A7

Main article: Apple A7

The Apple A7 is a 64-bit PoP SoC whose first appearance was in the iPhone 5S, which was introduced on September 10, 2013. The chip would also be used in the iPad Air, iPad Mini 2 and iPad Mini 3. Apple states that it is up to twice as fast and has up to twice the graphics power compared to its predecessor the Apple A6.[56] The Apple A7 chip is the first 64-bit chip to be used in a smartphone and later a tablet computer.[57]

The A7 features an Apple-designed 1.3[58]–1.4[59] GHz 64-bit[60] ARMv8-A[61][62] dual-core CPU,[58] called Cyclone,[61] and an integrated PowerVR G6430 GPU in a four cluster configuration.[63] The ARMv8-A architecture doubles the number of registers of the A7 compared to the A6.[64] It now has 31 general-purpose registers that are each 64-bits wide and 32 floating-point/NEON registers that are each 128-bits wide.[60] The A7 is manufactured by Samsung on a high-κ metal gate (HKMG) 28 nm process[65] and the chip includes over 1 billion transistors on a die 102 mm2 in size.[58]

Apple A8

Main article: Apple A8

The Apple A8 is a 64-bit PoP SoC manufactured by TSMC. Its first appearance was in the iPhone 6 and iPhone 6 Plus, which were introduced on September 9, 2014.[66] A year later it would drive the iPad Mini 4. Apple states that it has 25% more CPU performance and 50% more graphics performance while drawing only 50% of the power compared to its predecessor, the Apple A7.[67] On February 9, 2018, Apple released the HomePod, which is powered by an Apple A8 with 1 GB of RAM.[68]

The A8 features an Apple-designed 1.4[69] GHz 64-bit[70] ARMv8-A[70] dual-core CPU, and an integrated custom PowerVR GX6450 GPU in a four cluster configuration.[69] The GPU features custom shader cores and compiler.[71] The A8 is manufactured on a 20 nm process[72] by TSMC,[73] which replaced Samsung as the manufacturer of Apple's mobile device processors. It contains 2 billion transistors. Despite that being double the number of transistors compared to the A7, its physical size has been reduced by 13% to 89 mm2 (consistent with a shrink only, not known to be a new microarchitecture).[74]

Apple A8X

Main article: Apple A8X

The Apple A8X is a 64-bit SoC introduced at the launch of the iPad Air 2 on October 16, 2014.[75] It is a high performance variant of the Apple A8. Apple states that it has 40% more CPU performance and 2.5 times the graphics performance of its predecessor, the Apple A7.[75][76]

Unlike the A8, this SoC uses a triple-core CPU, a new octa-core GPU, dual channel memory and slightly higher 1.5 GHz CPU clock rate.[77] It uses an integrated custom octa-core PowerVR GXA6850 graphics processing unit (GPU) running at 450 MHz and a dual-channel memory subsystem.[77] It is manufactured by TSMC on their 20 nm fabrication process, and consists of 3 billion transistors.

Apple A9

Main article: Apple A9

The Apple A9 is a 64-bit ARM-based SoC that first appeared in the iPhone 6S and 6S Plus, which were introduced on September 9, 2015.[78] Apple states that it has 70% more CPU performance and 90% more graphics performance compared to its predecessor, the Apple A8.[78] It is dual sourced, a first for an Apple SoC; it is manufactured by Samsung on their 14 nm FinFET LPE process and by TSMC on their 16 nm FinFET process. It was subsequently included in the first-generation iPhone SE, and the iPad (5th generation). The Apple A9 was the last CPU that Apple manufactured through a contract with Samsung, as all A-series chips after are manufactured by TSMC.

Apple A9X

Main article: Apple A9X

The Apple A9X is a 64-bit SoC that was announced on September 9, 2015, and released on November 11, 2015, and first appeared in the iPad Pro.[79] It offers 80% more CPU performance and two times the GPU performance of its predecessor, the Apple A8X. It is manufactured by TSMC using a 16 nm FinFET process.[80]

Apple A10 Fusion

Main article: Apple A10

The Apple A10 Fusion is a 64-bit ARM-based SoC that first appeared in the iPhone 7 and 7 Plus, which were introduced on September 7, 2016.[81] The A10 is also featured in the sixth-generation iPad, seventh-generation iPad and seventh-generation iPod Touch.[82] It has a new ARM big.LITTLE quad core design with two high performance cores, and two smaller highly efficient cores. It is 40% faster than the A9, with 50% faster graphics. It is manufactured by TSMC on their 16 nm FinFET process.

Apple A10X Fusion

Main article: Apple A10X

The Apple A10X Fusion is a 64-bit ARM-based SoC that first appeared in the 10.5" iPad Pro and the second generation of the 12.9" iPad Pro, which were both announced on June 5, 2017.[83] It is a variant of the A10 and Apple claims that it has 30 percent faster CPU performance and 40 percent faster GPU performance than its predecessor, the A9X.[83] On September 12, 2017, Apple announced that the Apple TV 4K would be powered by an A10X chip. It is made by TSMC on their 10 nm FinFET process.[84]

Apple A11 Bionic

Main article: Apple A11

The Apple A11 Bionic is a 64-bit ARM-based SoC[85] that first appeared in the iPhone 8, iPhone 8 Plus, and iPhone X, which were introduced on September 12, 2017.[85] It has two high-performance cores, which are 25% faster than the A10 Fusion, four high-efficiency cores, which are 70% faster than the energy-efficient cores in the A10, and for the first time an Apple-designed three-core GPU with 30% faster graphics performance than the A10.[85][86] It is also the first A-series chip to feature Apple's "Neural Engine," which enhances artificial intelligence and machine learning processes.[87]

Apple A12 Bionic

Main article: Apple A12

The Apple A12 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone XS, XS Max and XR, which were introduced on September 12, 2018. It is also used in the third-generation iPad Air, fifth-generation iPad Mini, and the eighth-generation iPad. It has two high-performance cores, which are 15% faster than the A11 Bionic, and four high-efficiency cores, which have 50% lower power usage than the energy-efficient cores in the A11 Bionic.[88] The A12 is manufactured by TSMC[89] using a 7 nm[90] FinFET process, the first to ship in a smartphone.[91][89] It is also used in the 6th generation Apple TV.

Apple A12X Bionic

Main article: Apple A12X

The Apple A12X Bionic is a 64-bit ARM-based SoC that first appeared in the 11.0" iPad Pro and the third generation of the 12.9" iPad Pro, which were both announced on October 30, 2018.[92] It offers 35% faster single-core and 90% faster multi-core CPU performance than its predecessor, the A10X. It has four high-performance cores and four high-efficiency cores. The A12X is manufactured by TSMC using a 7 nm FinFET process.

Apple A12Z Bionic

The Apple A12Z Bionic is an updated version of the A12X Bionic, first appearing in the fourth generation iPad Pro, which was announced on March 18, 2020.[93] It adds an additional GPU core, compared to the A12X, for improved graphics performance.[94] The A12Z is also used in the Developer Transition Kit prototype computer that helps developers prepare their software for Macs based on Apple silicon.[95]

Apple A13 Bionic

Main article: Apple A13

The Apple A13 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 11, 11 Pro, and 11 Pro Max, which were introduced on September 10, 2019. It is also featured in the second-generation iPhone SE (released April 15, 2020), the 9th generation iPad (announced September 14, 2021) and in the Studio Display (announced March 8, 2022)

The entire A13 SoC features a total of 18 cores – a six-core CPU, four-core GPU, and an eight-core Neural Engine processor, which is dedicated to handling on-board machine learning processes; four of the six cores on the CPU are low-powered cores that are dedicated to handling less CPU-intensive operations, such as voice calls, browsing the Web, and sending messages, while two higher-performance cores are used only for more CPU-intensive processes, such as recording 4K video or playing a video game.[96]

Apple A14 Bionic

Main article: Apple A14

The Apple A14 Bionic is a 64-bit ARM-based SoC that first appeared in the fourth-generation iPad Air and iPhone 12, released on October 23, 2020. It is the first commercially available 5 nm chipset and it contains 11.8 billion transistors and a 16-core AI processor.[97] It includes Samsung LPDDR4X DRAM, a 6-core CPU, and 4-Core GPU with real time machine learning capabilities. It was later used in the tenth-generation iPad, released on October 26, 2022.

Apple A15 Bionic

Main article: Apple A15

The Apple A15 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 13, unveiled on September 14, 2021. The A15 is built on a 5-nanometer manufacturing process with 15 billion transistors. It has 2 high-performance processing cores, 4 high-efficiency cores, a new 5-core graphics for iPhone 13 Pro series (4-core for iPhone 13 and 13 mini) processing unit, and a new 16-core Neural Engine capable of 15.8 trillion operations per second.[98][99] It is also used in the third-generation iPhone SE, iPhone 14, iPhone 14 Plus and the sixth-generation iPad Mini.[100]

Apple A16 Bionic

Main article: Apple A16

The Apple A16 Bionic is a 64-bit ARM-based SoC that first appeared in the iPhone 14 Pro, unveiled on September 7, 2022. The A16 has 16 billion transistors and is built on TSMC's N4P fabrication process, being touted by Apple as the first 4 nm processor in a smartphone.[101][102] However, N4 is an enhanced version of N5 technology, a de facto fourth-generation 5 nm manufacturing process.[103][104][105] The chip has 2 high-performance processing cores, 4 high-efficiency cores and 5-core graphics for iPhone 14 Pro series. Memory is upgraded to LPDDR5 for 50% higher bandwidth and a 7% faster 16-core Neural Engine capable of 17 trillion operations per second. The chip was later used in the iPhone 15 and iPhone 15 Plus.[106]

Apple A17 Pro

Main article: Apple A17

The Apple A17 Pro is a 64-bit ARM-based SoC that first appeared in the iPhone 15 Pro, unveiled on September 12, 2023. It is Apple's first 3 nm SoC. The chip has 2 high-performance processing cores, 4 high-efficiency cores, a 6-core GPU for iPhone 15 Pro series, and a 16-core Neural Engine capable of 35 trillion operations per second. The GPU was described as their biggest redesign in the history of Apple GPUs, adding hardware accelerated ray tracing and mesh shading support.[107]

Apple A18

Main article: Apple A18

The Apple A18 is a 64-bit ARM-based SoC designed by Apple that first appeared in the iPhone 16 and iPhone 16 Plus.

Apple A18 Pro

The Apple A18 Pro is a 64-bit ARM-based SoC designed by Apple that first appeared in the iPhone 16 Pro.

Comparison of A series processors

General Semiconductor technology Computer architecture CPU GPU AI accelerator Memory technology First release
Name Codename Part No. Image Node Manufacturer Transistors count Die size CPU ISA Bit width Performance core Efficiency core Overall cores Cache Vendor Cores SIMD EU count FP32 ALU count Frequency FP32 FLOPS Cores OPS Memory bus width Total channel
Bit per channel 		Memory type Theoretical
bandwidth 		Available capacity
Core name Cores Core speed Core name Cores Core speed L1 L2 L3 SLC
APL0098 S5L8900 90 nm
[108] 		Samsung 72 mm2
[11] 		ARMv6 32-bit ARM11 1 412 MHz — — — Single-core L1i: 16 KB
L1d: 16 KB 		— — — PowerVR
MBX Lite 		1 1 8 60 MHz – 103 MHz 0.96 GFLOPS – 1.64 GFLOPS — — 16-bit 1 channel
16-bit/channel 		LPDDR-266
(133.25 
MHz) 		533 MB/s 128 MB June 29, 2007
APL0278 S5L8720 65 nm
[11] 		36 mm2
[11] 		533 MHz 103 MHz – 133 MHz 1.64 GFLOPs – 2.12 GFLOPS 32-bit 1 channel
32-bit/channel 		1066 MB/s July 11, 2008
APL0298 S5L8920 71.8 mm2
[12] 		ARMv7 Cortex-A8 600 MHz L1i: 32 KB
L1d: 32 KB 		256 KB PowerVR
SGX535
[109] 		2 16 200 MHz 6.4 GFLOPS LPDDR-400
(200 MHz) 		1.6 GB/s 256 MB June 19, 2009
APL2298 S5L8922 45 nm
[11][12]
[33] 		41.6 mm2
[11] 		September 9, 2009
A4 APL0398 S5L8930 53.3 mm2
[11][12] 		800 MHz 512 KB 200 MHz – 250 MHz 6.4 GFLOPS – 8.0 GFLOPS 64-bit 2 channels
32-bit/channel 		3.2 GB/s April 3, 2010
1.0 GHz
800 MHz 512 MB
A5 APL0498 S5L8940 122.2 mm2
[33] 		Cortex-A9 2 800 MHz Dual-core 1 MB PowerVR
SGX543
[110][51] 		2 4 32 200 MHz 12.8 GFLOPS LPDDR2-800
(400 MHz) 		6.4 GB/s March 11, 2011
1.0 GHz
APL2498 S5L8942 32 nm
Hκ MG
[34][40] 		69.6 mm2
[34] 		800 MHz March 7, 2012
1.0 GHz
2[a] Dual-core[b]
APL7498 S5L8947 37.8 mm2
[40] 		1 Single-core January 28, 2013
A5X APL5498 S5L8945 45 nm
[11][12]
[33] 		165 mm2
[42] 		2 Dual-core 4 8 64 25.6 GFLOPS 128-bit 4 channels
32-bit/channel 		12.8 GB/s 1 GB March 16, 2012
A6 APL0598 S5L8950 32 nm
Hκ MG
[52][111]
[55] 		96.71 mm2
[52][111] 		ARMv7s[112] Swift[49] 1.3 GHz
[113] 		3 6 48 266 or 709 MHz 25.5 or 68.0 GFLOPS 64-bit 2 channels
32-bit/channel 		LPDDR2-1066
(533 MHz) 		8.5 GB/s September 21, 2012
A6X APL5598 S5L8955 123 mm2
[55] 		1.4 GHz
[54] 		PowerVR
SGX554
[54][114] 		4 16 128 300 MHz 76.8 GFLOPS 128-bit 4 channels
32-bit/channel 		17.0 GB/s November 2, 2012
A7 APL0698 S5L8960 28 nm
Hκ MG
[65][115] 		1 billion 102 mm2
[60][115] 		ARMv8.0-A
[61][69] 		64-bit Cyclone 1.3 GHz L1i: 64 KB
L1d: 64 KB 		4 MB (Inclusive)
[61][116][59] 		PowerVR
G6430
[63][114] 		450 MHz 115.2 GFLOPS 64-bit 1 channel
64-bit/channel 		LPDDR3-1600
(800 MHz) 		12.8 GB/s September 20, 2013
APL5698 S5L8965 1.4 GHz November 1, 2013
A8 APL1011 T7000 20 nm
Hκ MG
[70][69] 		TSMC 2 billion 89 mm2
[117][77]
[118] 		Typhoon 1.1 GHz PowerVR
GX6450
[71][119][120] 		533 MHz 136.4 GFLOPS September 19, 2014
1.4 GHz
1.5 GHz 2 GB
A8X APL1021 T7001 3 billion 128 mm2
[77] 		3 3-core 2 MB PowerVR
GX6850
[71][77][118] 		8 32 256 450 MHz 230.4 GFLOPS 128-bit 2 channels
64-bit/channel 		25.6 GB/s October 22, 2014
A9 APL0898 S8000 14 nm
FinFET
[121] 		Samsung ≥ 2 billion 96 mm2
[122] 		Twister 2 1.85 GHz
[123][124] 		Dual-core 3 MB 4 MB (Victim)

[116][125]

PowerVR
GT7600
[71][126] 		6 24 192 650 MHz 249.6 GFLOPS 64-bit 1 channel
64-bit/channel 		LPDDR4-3200
(1600 MHz) 		September 25, 2015
APL1022 S8003 16 nm
FinFET
[122][127]
[128] 		TSMC 104.5 mm2
[122]
A9X APL1021 S8001 ≥ 3 billion 143.9 mm2
[127][84] 		2.16 GHz
[129][130] 		—
[116][127] 		PowerVR
GT7850
[71][127] 		12 48 384 499.2 GFLOPS 128-bit[c] 2 channels[d]
64-bit/channel 		November 11, 2015
2.26 GHz 128-bit 2 channels
64-bit/channel 		51.2 GB/s 4 GB
A10 Fusion APL1W24 T8010 3.3 billion 125 mm2
[128] 		ARMv8.1-A Hurricane 2 1.64 GHz Zephyr 2 1.09 GHz Quad-core[e] P-core:
L1i: 64 KB
L1d: 64 KB

E-core:
L1i: 32 KB
L1d: 32 KB 		P-core:
3 MB

E-core:
1 MB 		4 MB PowerVR
GT7600
Plus[131][71]
[132][133] 		6 24 192 900 MHz 345.6 GFLOPS 64-bit 1 channel
64-bit/channel 		25.6 GB/s 2 GB September 16, 2016
2.34 GHz
3 GB
A10X Fusion APL1071 T8011 10 nm
FinFET
[84] 		≥ 4 billion 96.4 mm2
[84] 		3 2.38 GHz 3 1.30 GHz 6-core[f] P-core:
8 MB

E-core:
1 MB 		—
[134][135] 		4 MB 12 48 384 1000 MHz 768.0 GFLOPS 128-bit 2 channels
64-bit/channel 		51.2 GB/s 3 GB June 13, 2017
4 GB
A11
Bionic 		APL1W72 T8015 4.3 billion 87.66 mm2
[136] 		ARMv8.2-A
[137] 		Monsoon 2 2.39 GHz Mistral 4[g] 1.19 GHz 6-core 1st
generation Apple-
designed 		3 12 192 1066 MHz 409.3 GFLOPS 2 600 billion OPS 64-bit 4 channels
16-bit/channel 		LPDDR4X-4266
(2133 MHz) 		34.1 GB/s 2 GB September 22, 2017
3 GB
A12
Bionic 		APL1W81 T8020 7 nm (N7)
FinFET
 6.9 billion 83.27 mm2
[138] 		ARMv8.3-A
[139] 		Vortex 2.49 GHz Tempest 4 1.59 GHz P-core:
L1i: 128 KB
L1d: 128 KB

E-core:
L1i: 32 KB
L1d: 32 KB 		P-core:
8 MB

E-core:
2 MB 		8 MB 2nd
generation Apple-
designed (Apple G11P) 		4 16 256 1125 MHz 576.0 GFLOPS 8 5 TOPS September 21, 2018
4 GB
A12X Bionic APL1083 T8027 10 billion 135 mm2
[140] 		4 8-core Second generation Apple-
designed (Apple G11G) 		7
 28 448 1.008 TFLOPS 128-bit 2 channels
64-bit/channel 		68.2 GB/s November 7, 2018
6 GB
A12Z Bionic 8 32 512 1.152 TFLOPS March 25, 2020
16 GB June 22, 2020
A13
Bionic 		APL1W85 T8030 7 nm (N7P)
FinFET 		8.5 billion 98.48 mm2
[141] 		ARMv8.4-A
[142] 		Lightning 2 2.66 GHz Thunder 1.72 GHz 6-core P-core:
L1i: 128 KB
L1d: 128 KB

E-core:
L1i: 96 KB
L1d: 48 KB 		P-core:
8 MB

E-core:
4 MB 		16 MB 3rd
generation Apple-
designed
[143] 		4 16
[144] 		256 1350 MHz 691.2 GFLOPS 5.5 TOPS 64-bit 4 channels
16-bit/channel 		34.1 GB/s 3 GB September 20, 2019
4 GB
A14
Bionic 		APL1W01 T8101 5 nm (N5)
FinFET 		11.8 billion 88 mm2
[145] 		ARMv8.5-A
[146] 		Firestorm 3.00 GHz Icestorm 1.82 GHz P-core:
L1i: 192 KB
L1d: 128 KB

E-core:
L1i: 128 KB
L1d: 64 KB 		4th
generation Apple-
designed
[147][143][148]
[149] 		1462.5 MHz 748.8 GFLOPS 16 11 TOPS October 23, 2020
4 GB
A15
Bionic 		APL1W07
[150] 		T8110 5 nm (N5P)
FinFET 		15 billion 108.01 mm2
[150] 		ARMv8.6-A
[146] 		Avalanche 3.24 GHz Blizzard 2.02 GHz P-core:
12 MB

E-core:
4 MB 		32 MB 5th
generation Apple-
designed
[151][152][153] 		512
[144] 		1338 MHz
[144][154] 		1.370 TFLOPS[155] 15.8 TOPS 4 GB September 24, 2021
2.93 GHz 5 20
[154][156] 		640
[154][156] 		1.713 TFLOPS[157]
3.24 GHz 6 GB
A16
Bionic 		APL1W10

[158]

T8120 4 nm
(N4P)
FinFET

[103][104]
[105][102]
[159]

16 billion 112.75 mm2
 Everest
[160][161] 		3.46 GHz Sawtooth
[160][161] 		P-core:
16 MB

E-core:
4 MB

[162]

24 MB

[162]

6th
generation Apple-
designed 		1398 MHz
[156] 		1.789 TFLOPS
[156] 		17 TOPS LPDDR5-6400 (3200 MHz) 51.2 GB/s September 16, 2022
A17
Pro 		APL1V02 T8130 3 nm (N3B) FinFET 19 billion 103.80 mm2
 Everest (2nd generation) 3.78 GHz
[163] 		Sawtooth (2nd generation) 2.11 GHz
[163] 		7th
generation Apple-
designed 		6 24 768 2.147 TFLOPS[164] 35 TOPS 8 GB September 22, 2023
A18 APL1V08 3 nm (N3E) FinFET 90 mm2 [165] ARMv9.2-A[166] Everest (3rd generation) 4.05 GHz Sawtooth (3rd generation) 2.42 GHz[167] P-core:
8 MB

E-core:
4 MB 		12 MB

[168]

8th
generation Apple-
designed 		5 20[168] 640[168] 1490 MHz[169] 1.907 TFLOPS LPDDR5X-7500 (3750 MHz) 60.0 GB/s[168] September 9, 2024
A18
Pro 		APL1V07 T8140 105 mm2[165] P-core:
16 MB

E-core:
4 MB 		24 MB

[168]

6 24[168] 768[168] 2.289 TFLOPS
Name Codename Part No. Image Node Manufacturer Transistors count Die size CPU ISA Bit width Core name Cores Core speed Core name Cores Core speed Overall cores L1 L2 L3 SLC Vendor Cores SIMD EU count FP32 ALU count Frequency FP32 FLOPS Cores OPS Memory bus width Total channel
Bit per channel 		Memory type Theoretical
bandwidth 		Available capacity First release
Performance core Efficiency core Cache
General Semiconductor technology Computer architecture CPU GPU AI accelerator Memory technology

H series

The Apple "H" series is a family of SoCs with low-power audio processing and wireless connectivity for use in headphones.

Apple H1

The Apple H1 chip was used in the second and third generation AirPods and the first generation AirPods Pro. It was also used in the Powerbeats Pro, the Beats Solo Pro, Beats Fit Pro, the 2020 Powerbeats, and AirPods Max.[170] Specifically designed for headphones, it has Bluetooth 5.0, supports hands-free "Hey Siri" commands,[171] and offers 30 percent lower latency than the W1 chip used in earlier AirPods.[172]

Apple H2

The Apple H2 chip was used in the fourth generation AirPods and second generation AirPods Pro. It has Bluetooth 5.3, and implements 48 kHz noise reduction in hardware. The 2022 version of the H2 operates only on the 2.4 GHz frequency, while the 2023 version adds support for audio transmission using a proprietary protocol in two specific frequency ranges of the 5 GHz band.[173]

Comparison of H series processors

Name Model no. Image Bluetooth First release
H1 343S00289[174]
(AirPods 2nd Generation)
343S00290[175]
(AirPods 3nd Generation)
343S00404[176]
(AirPods Max)
H1 SiP[177]
(AirPods Pro) 		Apple H1 chip Apple H1 chip Apple H1 chip
Apple H1 SiP Apple H1 SiP 		5.0 March 20, 2019
H2 AirPods (4th generation)
AirPods Pro (2nd generation)[178] Apple Vision Pro 		5.3 September 7, 2022

M series

The Apple "M" series is a family of systems on a chip (SoC) used in Mac computers from November 2020 or later, iPad Pro tablets from April 2021 or later, iPad Air tablets from March 2022 or later, and Vision Pro. The "M" designation was previously used for Apple motion coprocessors.

Apple M1

Main article: Apple M1

The M1, Apple's first system on a chip designed for use in Macs, is manufactured using TSMC's 5 nm process. Announced on November 10, 2020, it was first used in the MacBook Air, Mac mini and 13-inch MacBook Pro, and later used in the iMac, 5th-generation iPad Pro and 5th-generation iPad Air. It comes with 4 performance cores and 4 efficiency cores, for a total of 8 CPU cores. It comes with up to 8 GPU cores, with the entry level MacBook Air having only 7 GPU cores. The M1 has 16 billion transistors.[179]

Apple M1 Pro

The M1 Pro is a more powerful version of the M1, with six to eight performance cores, two efficiency cores, 14 to 16 GPU cores, 16 Neural Engine cores, up to 32 GB unified RAM with up to 200 GB/s memory bandwidth, and more than double the transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro. Apple claimed the CPU performance is about 70% faster than the M1, and that its GPU performance is about double. Apple claims the M1 Pro can deliver up to 20 streams of 4K or 7 streams of 8K ProRes video playback (up from 6 offered by Afterburner card for 2019 Mac Pro).

Apple M1 Max

The M1 Max is a larger version of the M1 Pro chip, with eight performance cores, two efficiency cores, 24 to 32 GPU cores, 16 Neural Engine cores, up to 64 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the number of transistors. It was announced on October 18, 2021, and is used in the 14- and 16-inch MacBook Pro, as well as the Mac Studio. Apple claims the M1 Max can deliver up to 30 streams of 4K (up from 23 offered by Afterburner card for 2019 Mac Pro) or 7 streams of 8K ProRes video playback.

Apple M1 Ultra

The M1 Ultra consists of two M1 Max dies connected together by a silicon interposer through Apple's UltraFusion interconnect.[180] It has 114 billion transistors, 16 performance cores, 4 efficiency cores, 48 to 64 GPU cores and 32 Neural Engine cores; it can be configured with up to 128 GB unified RAM of 800 GB/s memory bandwidth. It was announced on March 8, 2022, as an optional upgrade for the Mac Studio. Apple claims the M1 Ultra can deliver up to 18 streams of 8K ProRes video playback.[181]

Apple M2

Main article: Apple M2

Apple announced the M2 SoC on June 6, 2022, at WWDC, along with a redesigned MacBook Air and a revised 13-inch MacBook Pro and later the sixth-generation iPad Pro and the sixth-generation iPad Air. The M2 is made with TSMC's "enhanced 5-nanometer technology" N5P process and contains 20 billion transistors, a 25% increase from the previous generation M1. The M2 can be configured with up to 24 gigabytes of RAM and 2 terabytes of storage. It has 8 CPU cores (4 performance and 4 efficiency) and up to 10 GPU cores. The M2 also increases the memory bandwidth to 100 GB/s. Apple claims CPU improvements up to 18% and GPU improvements up to 35% compared to the previous M1.[182]

Apple M2 Pro

The M2 Pro is a more powerful version of the M2, with six to eight performance cores, four efficiency cores, 16 to 19 GPU cores, 16 Neural Engine cores, up to 32 GB unified RAM with up to 200 GB/s memory bandwidth, and double the transistors. It was announced on January 17, 2023, in a press release and it is used in the 14- and 16-inch 2023 MacBook Pro as well as the Mac Mini. Apple claims the CPU performance is 20 percent faster than the M1 Pro and the GPU is 30 percent faster than the M1 Pro.[183]

Apple M2 Max

The M2 Max is a larger version of the M2 Pro, with eight performance cores, four efficiency cores, 30 to 38 GPU cores, 16 Neural Engine cores, up to 96 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the transistors. It was announced on January 17, 2023, in a press release and it is used in the 14- and 16-inch 2023 MacBook Pro, as well as the Mac Studio.[184] Apple claims the CPU performance is 20 percent faster than M1 Max and the GPU is 30 percent faster than the M1 Max.[183]

Apple M2 Ultra

The M2 Ultra consists of two M2 Max dies connected together by a silicon interposer through Apple's UltraFusion interconnect. It has 134 billion transistors, 16 performance cores, 8 efficiency cores, 60 to 76 GPU cores and 32 Neural Engine cores; it can be configured with up to 192 GB unified RAM of 800 GB/s memory bandwidth. It was announced on June 5, 2023, as an optional upgrade for the Mac Studio and the sole processor for the Mac Pro. Apple claims the M2 Ultra can deliver up to 22 streams of 8K ProRes video playback.[185]

Apple M3

Main article: Apple M3

Apple announced the M3 series of chips on October 30, 2023, along with the new MacBook Pro and iMac, and later used in the MacBook Air. The M3 is based on the 3 nm process and contains 25 billion transistors, a 25% increase from the previous generation M2. It has 8 CPU cores (4 performance and 4 efficiency) and up to 10 GPU cores. Apple claims CPU improvements up to 35% and GPU improvements up to 65% compared to the M1.[186]

Apple M3 Pro

The M3 Pro is a more powerful version of the M3, with six performance cores, six efficiency cores, 14 to 18 GPU cores, 16 Neural Engine cores, up to 36 GB unified RAM with 150 GB/s memory bandwidth, and 48% more transistors. It is used in the 14- and 16-inch MacBook Pro. Apple claims the CPU performance is 30 percent faster than the M1 Pro and the GPU is 40 percent faster than the M1 Pro.[186]

Apple M3 Max

The M3 Max is a larger version of the M3 Pro, with ten or twelve performance cores, four efficiency cores, 30 to 40 GPU cores, 16 Neural Engine cores, up to 128 GB unified RAM with up to 400 GB/s memory bandwidth, and more than double the transistors. It is used in the 14- and 16-inch MacBook Pro. Apple claims the CPU performance is 80 percent faster than the M1 Max and the GPU is 50 percent faster than the M1 Max.[186]

Apple M4

Main article: Apple M4

Apple announced the M4 chip on May 7, 2024, along with the new seventh-generation iPad Pro models; it would later be used for the iMac, Mac Mini and MacBook Pro. The M4 is based on the N3E process rather than the N3B process used by the M3 and contains 28 billion transistors. It has three or four performance cores, six efficiency cores and up to ten GPU cores. Apple claims the M4 has up to 1.5x faster CPU performance compared to the M2.[187]

Apple M4 Pro

The M4 Pro is a more powerful version of the M4, with eight or ten performance cores, four efficiency cores, 16 to 20 GPU cores, 16 Neural Engine cores, and up to 64 GB unified RAM with 273 GB/s memory bandwidth. It is used in the 14- and 16-inch MacBook Pro as well as the Mac Mini. Apple claims the CPU performance is 1.9x faster than the M1 Pro and the GPU is 2x faster than the M1 Pro.[188]

Apple M4 Max

The M4 Max is a larger version of the M4 Pro, with ten or twelve performance cores, four efficiency cores, 32 to 40 GPU cores, 16 Neural Engine cores, and up to 128 GB unified RAM with up to 546 GB/s memory bandwidth. It is used in the 14- and 16-inch MacBook Pro. Apple claims the CPU performance is 2.2x faster than the M1 Max and the GPU is 1.9x faster than the M1 Max.[188]

Comparison of M series processors

General Semiconductor technology CPU GPU AI accelerator Media Engine Memory technology First release
Name Codename
and part no. 		Image Process Transistor count Die size Transistor density CPU ISA Performance core Efficiency core Overall cores Cache Vendor Cores SIMD EU count FP32 ALU count Frequency FP32 FLOPS
(TFLOPS) 		Hardware-accelerated ray tracing Cores OPS Hardware Acceleration Media Decode/Encode Engine Memory bus width Total channel
Bit per channel 		Memory type Theoretical
bandwidth 		Available capacity
Core name Cores Core speed Core name Cores Core speed L1 L2 SLC Video decode Video encode ProRes decode & encode AV1 decode
M1 APL1102
T8103 		Apple M1 processor TSMC
N5 		16 billion 118.91 mm2[189] ~134 MTr/mm2 ARMv8.5-A
[146] 		Firestorm 4 3.20 GHz Icestorm 4 2.06 GHz 8-core P-core:
L1i: 192 KB
L1d: 128 KB

E-core:
L1i: 128 KB
L1d: 64 KB 		P-core:
12 MB

E-core:
4 MB 		8 MB 4th generation Apple-designed 7 28 896 1278 MHz 2.290 No 16 11 TOPS H264, HEVC 1 1 — — 128-bit 2 channels
64-bit/channel 		LPDDR4X-4266
(2133 MHz) 		68.25 GB/s 8 GB
16 GB 		November 17, 2020
8 32 1024 2.617
M1 Pro APL1103
T6000 		Apple M1 Pro processor 33.7 billion ≈ 245 mm2
[190] 		~137 MTr/mm2 6 3.23 GHz 2 P-core:
24 MB

E-core:
4 MB 		24 MB 14 56 1792 1296 MHz 4.644 H264, HEVC, ProRes, ProRes RAW 1 256-bit 2 channels
128-bit/channel 		LPDDR5-6400
(3200 MHz) 		204.8 GB/s 16 GB
32 GB 		October 26, 2021
8 10-core
16 64 2048 5.308
M1 Max APL1105
T6001
[191] 		Apple M1 Max processor 57 billion ≈ 432 mm2
[190] 		~132 MTr/mm2 48 MB 24 96 3072 7.962 2 2 512-bit 4 channels
128-bit/channel 		409.6 GB/s 32 GB
64 GB
32 128 4096 10.616
M1 Ultra APL1W06
T6002 		Apple M1 Ultra processor 114 billion ≈ 864 mm2 16 4 20-core P-core:
48 MB

E-core:
8 MB 		96 MB 48 192 6144 15.925 32 22 TOPS 2 4 4 1024-bit 8 channels
128-bit/channel 		819.2 GB/s 64 GB
128 GB 		March 18, 2022
64 256 8192 21.233
M2 APL1109
T8112 		Apple M2 processor TSMC
N5P 		20 billion 155.25 mm2
[189] 		~129 MTr/mm2 ARMv8.6-A
[146] 		Avalanche 4 3.50 GHz Blizzard 4 2.42 GHz 8-core P-core:
16 MB

E-core:
4 MB 		8 MB 5th generation Apple-designed 8 32 1024 1398 MHz 2.863 16 15.8 TOPS 1 1 1 128-bit 2 channels
64-bit/channel 		102.4 GB/s 8 GB
16 GB
24 GB 		June 24, 2022
9 [192] 36 1152 3.578 H264, HEVC —
10 40 1280 H264, HEVC, ProRes, ProRes RAW 1
M2 Pro APL1113
T6020 		40 billion ~289 mm2[193] ~138 MTr/mm2 6 10-core P-core:
32 MB

E-core:
4 MB 		24 MB 16 64 2048 5.726 256-bit 4 channels
64-bit/channel 		204.8 GB/s 16 GB
32 GB 		January 24, 2023
8 12-core 19 76 2432 6.799
M2 Max APL1111
T6021 		67 billion 3.69 GHz
[194] 		48 MB 30 120 3840 10.736 2 2 512-bit 4 channels
128-bit/channel 		409.6 GB/s 32 GB
64 GB
96 GB
38 152 4864 13.599
M2 Ultra APL1W12
T6022 		134 billion 16 ~3.00 GHz
-3.70 GHz
[194][195][196] 		8 24-core P-core:
64 MB

E-core:
8 MB 		96 MB 60 240 7680 21.473 32 31.6 TOPS 2 4 4 1024-bit 8 channels
128-bit/channel 		819.2 GB/s 64 GB
128 GB
192 GB 		June 13, 2023
76 304 9728 27.199
M3 APL1201
T8122 		TSMC
N3B 		25 billion — 4 4.05 GHz — 4 2.75 GHz 8-core P-core:
16 MB

E-core:
4 MB 		8 MB 7th generation Apple-designed 8 128 1024 1380 MHz

[197]

2.826 Yes 16 18 TOPS 1 1 1 1 128-bit 2 channels
64-bit/channel 		102.4 GB/s 8 GB
16 GB
24 GB 		November 7, 2023
10 160 1280 3.533
M3 Pro APL1203
T6030 		37 billion 5 6 11-core 12 MB 14 224 1792 4.946 192-bit 3 channels
64-bit/channel 		153.6 GB/s 18 GB
36 GB
6 12-core 18 288 2304 6.359
M3 Max APL1204
T6034 		92 billion 10 4 14-core P-core:
32 MB

E-core:
4 MB 		48 MB 30 480 3840 10.598 2 2 384-bit 3 channels
128-bit/channel 		307.2 GB/s 36 GB
96 GB
APL1204
T6031 		12 16-core 40 640 5120 14.131 512-bit 4 channels
128-bit/channel 		409.6 GB/s 48 GB
64 GB
128 GB
M4 APL1206
T8132 		TSMC
N3E 		28 billion ARMv9

[198]

3 4.40 GHz 6 2.85 GHz 9-core P-core:
16 MB

E-core:
4 MB 		10 160 1280 1470 MHz

[199]

4.26[200] 38 TOPS 1 1 128-bit 2 channels
64-bit/channel 		LPDDR5X-7500 (3750 MHz) 120 GB/s 8 GB May 15, 2024
4 10-core 16 GB
M4 Pro APL????
T6040 		8 4.51 GHz 4 12-core 16 256 2048 1.578 MHz 6.82[201] 256-bit LPDDR5X-8533 (4266 MHz) 273 GB/s 24 GB
48 GB
64 GB 		November 8, 2024
10 14-core P-core:
2×16 MB
E-core:
4 MB 		20 320 2560 8.52[202]
M4 Max 10 4 14-core 32 512 4096 13.64[203] 384-bit 409.6 GB/s 36 GB
12 16-core 40 640 5120 17.04[204] 512-bit 546 GB/s 48 GB
64 GB
128 GB
Name Codename
and part no. 		Image Process Transistor count Die size Transistor density CPU ISA Performance core Efficiency core Overall cores Cache Vendor Cores SIMD EU count FP32 ALU count Frequency FP32 FLOPS
(TFLOPS) 		Hardware-accelerated ray tracing Cores OPS Hardware Acceleration Media Decode/Encode Engine Memory bus width Total channel
Bit per channel 		Memory type Theoretical
bandwidth 		Available capacity First release
Core name Cores Core speed Core name Cores Core speed L1 L2 SLC Video decode Video encode ProRes decode & encode AV1 decode
General Semiconductor technology CPU GPU AI accelerator Media Engine Memory technology

R series

The R series is a family of low-latency system on a chips (SoCs) for real-time processing of sensor inputs.

Apple R1

The Apple R1 was announced by Apple on June 5, 2023, at its Worldwide Developers Conference. It is used in the Apple Vision Pro headset. The Apple R1 is dedicated to the real time processing of sensor inputs and delivering extremely low-latency images to the displays.

S series

The Apple "S" series is a family of systems in a package (SiP) used in the Apple Watch and HomePod. It uses a customized application processor that together with memory, storage and support processors for wireless connectivity, sensors, and I/O form a complete computer in a single package. They are designed by Apple and manufactured by contract manufacturers such as Samsung.

Apple S1

Main article: Apple S1

The Apple S1 is an integrated computer. It includes memory, storage and support circuits like wireless modems and I/O controllers in a sealed integrated package. It was announced on September 9, 2014, as part of the "Wish we could say more" event. It was used in the first-generation Apple Watch.[205]

Apple S1P

Used in Apple Watch Series 1. It has a dual-core processor identical to the S2, with the exception of the built-in GPS receiver. It contains the same dual-core CPU with the same new GPU capabilities as the S2, making it about 50% faster than the S1.[206][207]

Apple S2

Main article: Apple S2

Used in the Apple Watch Series 2. It has a dual-core processor and a built-in GPS receiver. The S2's two cores deliver 50% higher performance and the GPU delivers twice as much as the predecessor,[208] and is similar in performance to the Apple S1P.[209]

Apple S3

Used in the Apple Watch Series 3. It has a dual-core processor that is 70% faster than the Apple S2 and a built-in GPS receiver.[210] There is also an option for a cellular modem and an internal eSIM module.[210] It also includes the W2 chip.[210] The S3 also contains a barometric altimeter, the W2 wireless connectivity processor, and in some models UMTS (3G) and LTE (4G) cellular modems served by a built-in eSIM.[210]

Apple S4

Used in the Apple Watch Series 4. It introduced 64-bit ARMv8 cores to the Apple Watch through two Tempest cores,[211][212] which are also found in the A12 as energy-efficient cores. Despite its small size, Tempest uses a 3-wide decode out-of-order superscalar design, which makes it much more powerful than preceding in-order cores.

The S4 contains a Neural Engine that is able to run Core ML.[213] Third-party apps can use it starting from watchOS 6. The SiP also includes new accelerometer and gyroscope functionality that has twice the dynamic range in measurable values of its predecessor, as well as being able to sample data at 8 times the speed.[214] It contains the W3 wireless chip, which supports Bluetooth 5. It also contains a new custom GPU, which can use the Metal API.[215]

Apple S5

Used in the Apple Watch Series 5, Watch SE, and HomePod mini.[216] It adds a built-in magnetometer to the custom 64-bit dual-core processor and GPU of the S4.[217]

Apple S6

Used in the Apple Watch Series 6. It has a custom 64-bit dual-core processor that runs up to 20 percent faster than the S5.[218][219] The dual-cores in the S6 are based on the A13 Bionic's energy-efficient "little" Thunder cores at 1.8 GHz.[220] Like the S4 and S5, it also contains the W3 wireless chip.[219] The S6 adds the new U1 ultrawide band chip, an always-on altimeter, and 5 GHz WiFi.[218][219]

Apple S7

Used in the Apple Watch Series 7 and second-generation HomePod. The S7 CPU has the same T8301 identifier and quoted performance as the S6. It is the second time utilizing the energy-efficient "little" Thunder cores of the A13 Bionic.[221]

Apple S8

Used in the Apple Watch SE (2nd generation), Watch Series 8, and Watch Ultra.[222] The S8 CPU has the same T8301 identifier and quoted performance as the S6 and S7. It is the final CPU to utilize the energy-efficient "little" Thunder cores of the A13 Bionic.[223]

Apple S9

Used in the Apple Watch Series 9 and Watch Ultra 2. The S9 CPU has a new dual-core CPU with 60 percent more transistors than the S8, a new four-core Neural Engine and the new U2 ultra-wide band chip. The dual-cores in the S9 are based on the A16 Bionic's energy efficient "little" Sawtooth cores.[224]

Apple S10

Used in the Apple Watch Series 10. The S10 CPU is the second time utilizing the energy-efficient "little" Sawtooth cores of the A16 Bionic.

Comparison of S series processors

Name Model no. Image Semiconductor technology Die size CPU ISA CPU CPU cache GPU Memory technology Modem First release
S1 APL
0778
[225] 		28 nm Hκ MG[226][227] 32 mm2[226] ARMv7k[227][228] 520 MHz single-core Cortex-A7[227] L1d: 32 KB[229]
L2: 256 KB[229] 		PowerVR Series 5[227][230] LPDDR3[231] April 24, 2015
S1P TBC TBC ARMv7k[232][206][208] 520 MHz dual-core Cortex-A7[232] L1d: 32 KB[229] PowerVR Series 6 'Rogue'[232] LPDDR3 September 12, 2016
S2
S3 ARMv7k[233] Dual-core TBC LPDDR4 Qualcomm MDM9635M
Snapdragon X7 LTE 		September 22, 2017
S4 7 nm (TSMC N7) TBC ARMv8.3-A ILP32[234][235]
[146] 		1.59 GHz Dual-core Tempest L1d: 32 KB[227]
L2: 2 MB[227] 		Apple G11M[235] TBC September 21, 2018
S5 September 20, 2019
S6 7 nm (TSMC N7P) TBC 1.8 GHz Dual-core Thunder L1d: 48 KB[236]
L2: 4 MB[237] 		TBC September 18, 2020
S7 October 15, 2021
S8 September 16, 2022
S9 4 nm (TSMC N4P)[238] Dual-core Sawtooth L1d: 64 KB
L2: 4 MB[239] 		September 22, 2023
S10 September 20, 2024

T series

The T series chip operates as a secure enclave on Intel-based MacBook and iMac computers released from 2016 onwards. The chip processes and encrypts biometric information (Touch ID) and acts as a gatekeeper to the microphone and FaceTime HD camera, protecting them from hacking. The chip runs bridgeOS, a purported variant of watchOS.[240] The functions of the T series processor were built into the M series CPUs, thus ending the need for the T series.

Apple T1

The Apple T1 chip is an ARMv7 SoC (derived from the processor in the Apple Watch's S2) that drives the System Management Controller (SMC) and Touch ID sensor of the 2016 and 2017 MacBook Pro with Touch Bar.[241]

Apple T2

Main article: Apple T2

The Apple T2 security chip is a SoC first released in the iMac Pro. It is a 64-bit ARMv8 chip (a variant of the A10 Fusion, or T8010).[242] It provides a secure enclave for encrypted keys, enables users to lock down the computer's boot process, handles system functions like the camera and audio control, and handles on-the-fly encryption and decryption for the solid-state drive.[243][244][245] T2 also delivers "enhanced imaging processing" for the iMac Pro's FaceTime HD camera.[246][247]

Comparison of T series processors

Name Model no. Image Semiconductor technology Die size CPU ISA CPU CPU cache GPU Memory technology First release
Memory bandwidth
T1 APL
1023
[248] 		Apple T1 Processor TBC TBC ARMv7 TBD November
12, 2016
T2 APL
1027
[249] 		Apple T2 Processor TSMC 16 nm FinFET.[250] 104 mm2[250] ARMv8-A
ARMv7-A 		2× Hurricane
2× Zephyr
+ Cortex-A7 		L1i: 64 KB
L1d: 64 KB
L2: 3 MB[250] 		3× cores[250] LP-DDR4[250] December
14, 2017

U series

The Apple "U" series is a family of systems in a package (SiP) implementing ultra-wideband (UWB) radio.

Apple U1

The Apple U1 is used in the iPhone 11 series through the iPhone 14 series (excluding the second and third generation iPhone SE); Apple Watch Series 6 through the Apple Watch Series 8 and Apple Watch Ultra (1st generation); HomePod (2nd generation) and HomePod Mini; AirTag trackers; and the charging case for AirPods Pro (2nd generation).[251]

Apple U2

The Apple U2 (referred to by Apple as its "Second-generation Ultra Wideband chip") is used in the iPhone 15 series, iPhone 16 series, Apple Watch Series 9, Apple Watch Ultra 2 and Apple Watch Series 10.

Comparison of U series processors

Name Model no. Image CPU Semiconductor technology First release
U1 TMK

A75
[252]

Apple U1 chip Cortex-M4
ARMv7E-M[253] 		16 nm FinFET
(TSMC 16FF) 		September 20, 2019
U2 September 22, 2023

W series

The Apple "W" series is a family of RF SoCs used for Bluetooth and Wi-Fi connectivity.

Apple W1

The Apple W1 is a SoC used in the 2016 AirPods and select Beats headphones.[254][255] It maintains a Bluetooth[256] Class 1 connection with a computer device and decodes the audio stream that is sent to it.[257]

Apple W2

The Apple W2, used in the Apple Watch Series 3, is integrated into the Apple S3 SiP. Apple claimed the chip makes Wi-Fi 85% faster and allows Bluetooth and Wi-Fi to use half the power of the W1 implementation.[210]

Apple W3

The Apple W3 is used in the Apple Watch Series 4,[258] Series 5,[259] Series 6,[219] SE (1st generation),[219] Series 7, Series 8, SE (2nd generation), Ultra, Series 9, Ultra 2, and Series 10. It is integrated into the Apple S4, S5, S6, S7, S8, S9, and S10 SiPs. It supports Bluetooth 5.0/5.3.

Comparison of W series processors

Name Model no. Image Semiconductor technology Die size CPU ISA CPU CPU cache Memory technology Bluetooth First release
Memory bandwidth
W1 343S00130[260]
343S00131[260] 		Apple W1 chip TBC 14.3
 mm2
[260] 		TBC 4.2 December
13, 2016
W2 338S00348[261] Apple W2 chip TBC September
22, 2017
W3 338S00464[262] Apple W3 chip 5.0/5.3 September
21, 2018

M series coprocessors

Main article: Apple motion coprocessors

The Apple M-series coprocessors are motion coprocessors used by Apple Inc. in their mobile devices. First released in 2013, their function is to collect sensor data from integrated accelerometers, gyroscopes and compasses and offload the collecting and processing of sensor data from the main central processing unit (CPU).

Only the M7 and M8 coprocessors were housed on separate chips; the M9, M10, and M11 coprocessors were embedded in their corresponding A-series chips. Beginning with the A12 Bionic chip in 2018, the motion coprocessors were fully integrated into the SoC; this allowed Apple to reuse the "M"-series codename for their desktop SoCs.

Comparison of M series coprocessors

Name Model no. Image Semiconductor technology CPU ISA CPU First release
Apple M7 LPC18A1 NXP LPC18A1 90 nm ARMv7-M 150 MHz Cortex-M3 September
10, 2013
Apple M8 LPC18B1 NXP LPC18B1 September
9, 2014

Miscellaneous devices

This segment is about Apple-designed processors that are not easily sorted into another section.

Early series

See also: Early iPhone systems-on-chip

Apple first used Samsung-developed SoCs in early versions of the iPhone and iPod Touch. They combine in one package a single ARM-based processing core (CPU), a graphics processing unit (GPU), and other electronics necessary for mobile computing.

The APL0098 (also 8900B[263] or S5L8900) is a package on package (PoP) system on a chip (SoC) that was introduced on June 29, 2007, at the launch of the original iPhone. It includes a 412 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 90 nm process.[11] The iPhone 3G and the first-generation iPod Touch also use it.[264]

The APL0278[265] (also S5L8720) is a PoP SoC introduced on September 9, 2008, at the launch of the second-generation iPod Touch. It includes a 533 MHz single-core ARM11 CPU and a PowerVR MBX Lite GPU. It was manufactured by Samsung on a 65 nm process.[11][264]

The APL0298 (also S5L8920) is a PoP SoC introduced on June 8, 2009, at the launch of the iPhone 3GS. It includes a 600 MHz single-core Cortex-A8 CPU and a PowerVR SGX535 GPU. It was manufactured by Samsung on a 65 nm process.[108]

The APL2298 (also S5L8922) is a 45 nm die shrunk version of the iPhone 3GS SoC[11] and was introduced on September 9, 2009, at the launch of the third-generation iPod Touch.

Other

The Samsung S5L8747 is an ARM-based microcontroller used in Apple's Lightning Digital AV Adapter, a Lightning-to-HDMI adapter. This is a miniature computer with 256 MB RAM, running an XNU kernel loaded from the connected iPhone, iPod Touch, or iPad, then taking a serial signal from the iOS device translating that into a proper HDMI signal.[266][267]

Model no. Image First release CPU ISA Specs Application Utilizing devices Operating system
339S0196 339S0196 microcontroller September 2012 Unknown

ARM

256 MB
RAM 		Lightning to
HDMI conversion 		Apple Digital
AV Adapter 		XNU

See also

Similar platforms

Notes

  1. ^ 1 core locked
  2. ^ Single-core due to locked core
  3. ^ 64-bit due to unused channel
  4. ^ 1 channel unused
  5. ^ Only 2 cores performed at a same time
  6. ^ Only 3 cores performed at a same time
  7. ^ 1 efficiency core disabled in Apple TV 4K 3rd Gen

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Further reading

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