2004 IEEE International Reliability Physics Symposium. Proceedings, 2004
The use of lead in electronic consumer products is being phased out in exchange for lead-free alt... more The use of lead in electronic consumer products is being phased out in exchange for lead-free alternatives. Understanding the physics of failure mechanisms within lead-free solder alloys will facilitate the replacement of lead bearing alloys for silicon device bonding in power semiconductor modules. Japan's legislation for reduction in lead bearing solders is presently in place while European legislation is slated
... Anant Agarwal 1,a , Sumi Krishnaswami 1 , James Richmond 1 , Craig Capell 1 , ... In addition... more ... Anant Agarwal 1,a , Sumi Krishnaswami 1 , James Richmond 1 , Craig Capell 1 , ... In addition, the overall losses (switching and conduction) of the SiC BJT operating at 250°C are approximately 50-60% lower than the comparable Si IGBT operating at 25°C. In many applications ...
2005 International Semiconductor Device Research Symposium, 2005
Silicon Carbide (SiC) is a very attractive material for high temperature semiconductor devices be... more Silicon Carbide (SiC) is a very attractive material for high temperature semiconductor devices because of its very wide bandgap (3.26 eV). Due to the wide bandgap, thermal carrier generation is very low in SiC, resulting in negligible junction leakage currents for temperatures up to ...
... Anant Agarwal 1,a , Sumi Krishnaswami 1 , James Richmond 1 , Craig Capell 1 , ... In addition... more ... Anant Agarwal 1,a , Sumi Krishnaswami 1 , James Richmond 1 , Craig Capell 1 , ... In addition, the overall losses (switching and conduction) of the SiC BJT operating at 250°C are approximately 50-60% lower than the comparable Si IGBT operating at 25°C. In many applications ...
Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting, 2006
Abstract This paper proposes a new heuristic approach based on genetic algorithms (GA) to estimat... more Abstract This paper proposes a new heuristic approach based on genetic algorithms (GA) to estimate mechanical and electrical parameters of an induction motor (IM) in all operative conditions using only speed transient measurements. The GA routine is used off-line to ...
... Bridge Inverter Ty McNutt 1 , John Reichl 1 , Harold Hearne 1 , Victor Veliadis 1 , Megan McC... more ... Bridge Inverter Ty McNutt 1 , John Reichl 1 , Harold Hearne 1 , Victor Veliadis 1 , Megan McCoy 1 , Eric Stewart 1 , Stephen Van Campen 1 , Chris Clarke 1 , Dave Bulgher 1 , Dimos Katsis 2 , Bruce Geil 2 and Skip Scozzie 2 1 ...
This paper describes the control analysis and design of an ac-to-ac three-phase mobile utility po... more This paper describes the control analysis and design of an ac-to-ac three-phase mobile utility power supply using a matrix converter capable of high-quality 50-, 60-, and 400-Hz output voltage and reduced input harmonic distortion. Instead of the traditional structure employing a diode bridge rectifier, a dc link and a pulsewidth-modulated inverter, a three-phaseto-three-phase direct ac-ac (matrix) converter has been used as the power-conditioning core of the system, working in conjunction with input and output LC low-pass filters. An optimizing control design method using a genetic algorithm approach has been used, which yields designs to minimize a cost function, taking into account transient and steady-state output voltage performance targets, together with robustness to different operative conditions and system parameters drift. Simulation and experimental tests have demonstrated that the system meets the power-quality requirements of the application.
Lead-free solders are being investigated as replacements for lead solders currently used in the p... more Lead-free solders are being investigated as replacements for lead solders currently used in the power electronics industry. Currently, the eutectic lead-tin alloy is widely used for attaching power devices. Thermal performance of packaged power devices and multichip ...
Victor Veliadis, Megan McCoy, Ty McNutt, Harold Hearne, Li-Shu Chen, Gregory DeSalvo, Chris Clark... more Victor Veliadis, Megan McCoy, Ty McNutt, Harold Hearne, Li-Shu Chen, Gregory DeSalvo, Chris Clarke, Bruce Geil*, Dimos Katsis*, Skip Scozzie* ... Northrop Grumman Advanced Technology Laboratory, MS 3B10, Linthicum, MD 21090 *US Army Research Laboratory, 2800 ...
2004 IEEE International Reliability Physics Symposium. Proceedings, 2004
The use of lead in electronic consumer products is being phased out in exchange for lead-free alt... more The use of lead in electronic consumer products is being phased out in exchange for lead-free alternatives. Understanding the physics of failure mechanisms within lead-free solder alloys will facilitate the replacement of lead bearing alloys for silicon device bonding in power semiconductor modules. Japan's legislation for reduction in lead bearing solders is presently in place while European legislation is slated
... Anant Agarwal 1,a , Sumi Krishnaswami 1 , James Richmond 1 , Craig Capell 1 , ... In addition... more ... Anant Agarwal 1,a , Sumi Krishnaswami 1 , James Richmond 1 , Craig Capell 1 , ... In addition, the overall losses (switching and conduction) of the SiC BJT operating at 250°C are approximately 50-60% lower than the comparable Si IGBT operating at 25°C. In many applications ...
2005 International Semiconductor Device Research Symposium, 2005
Silicon Carbide (SiC) is a very attractive material for high temperature semiconductor devices be... more Silicon Carbide (SiC) is a very attractive material for high temperature semiconductor devices because of its very wide bandgap (3.26 eV). Due to the wide bandgap, thermal carrier generation is very low in SiC, resulting in negligible junction leakage currents for temperatures up to ...
... Anant Agarwal 1,a , Sumi Krishnaswami 1 , James Richmond 1 , Craig Capell 1 , ... In addition... more ... Anant Agarwal 1,a , Sumi Krishnaswami 1 , James Richmond 1 , Craig Capell 1 , ... In addition, the overall losses (switching and conduction) of the SiC BJT operating at 250°C are approximately 50-60% lower than the comparable Si IGBT operating at 25°C. In many applications ...
Conference Record of the 2006 IEEE Industry Applications Conference Forty-First IAS Annual Meeting, 2006
Abstract This paper proposes a new heuristic approach based on genetic algorithms (GA) to estimat... more Abstract This paper proposes a new heuristic approach based on genetic algorithms (GA) to estimate mechanical and electrical parameters of an induction motor (IM) in all operative conditions using only speed transient measurements. The GA routine is used off-line to ...
... Bridge Inverter Ty McNutt 1 , John Reichl 1 , Harold Hearne 1 , Victor Veliadis 1 , Megan McC... more ... Bridge Inverter Ty McNutt 1 , John Reichl 1 , Harold Hearne 1 , Victor Veliadis 1 , Megan McCoy 1 , Eric Stewart 1 , Stephen Van Campen 1 , Chris Clarke 1 , Dave Bulgher 1 , Dimos Katsis 2 , Bruce Geil 2 and Skip Scozzie 2 1 ...
This paper describes the control analysis and design of an ac-to-ac three-phase mobile utility po... more This paper describes the control analysis and design of an ac-to-ac three-phase mobile utility power supply using a matrix converter capable of high-quality 50-, 60-, and 400-Hz output voltage and reduced input harmonic distortion. Instead of the traditional structure employing a diode bridge rectifier, a dc link and a pulsewidth-modulated inverter, a three-phaseto-three-phase direct ac-ac (matrix) converter has been used as the power-conditioning core of the system, working in conjunction with input and output LC low-pass filters. An optimizing control design method using a genetic algorithm approach has been used, which yields designs to minimize a cost function, taking into account transient and steady-state output voltage performance targets, together with robustness to different operative conditions and system parameters drift. Simulation and experimental tests have demonstrated that the system meets the power-quality requirements of the application.
Lead-free solders are being investigated as replacements for lead solders currently used in the p... more Lead-free solders are being investigated as replacements for lead solders currently used in the power electronics industry. Currently, the eutectic lead-tin alloy is widely used for attaching power devices. Thermal performance of packaged power devices and multichip ...
Victor Veliadis, Megan McCoy, Ty McNutt, Harold Hearne, Li-Shu Chen, Gregory DeSalvo, Chris Clark... more Victor Veliadis, Megan McCoy, Ty McNutt, Harold Hearne, Li-Shu Chen, Gregory DeSalvo, Chris Clarke, Bruce Geil*, Dimos Katsis*, Skip Scozzie* ... Northrop Grumman Advanced Technology Laboratory, MS 3B10, Linthicum, MD 21090 *US Army Research Laboratory, 2800 ...
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